<?xml version="1.0" encoding="utf-8"?>
<tw-patent-applications total-count="2153">
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621590</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113141962</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241128B">A43D25/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華錩實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWACHANG MACHINERY &amp; ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEN CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>真空充氣鞋底貼合機</chinese-title>
        <english-title>VACUUM INFLATABLE SOLE LAMINATING MACHINE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種真空充氣鞋底貼合機，包括：機台，內部為真空腔體且上方設有與真空腔體連通之定位機構，且機台外側設置傳動機構；真空泵浦，具有與真空腔體連通之抽氣管路；第一壓座，與機台之傳動機構連動，第一壓座設於機台上方並具有真空膜片，當第一壓座向下位移至機台上且真空膜片覆蓋定位機構時，真空膜片與定位機構之間形成真空抽氣囊袋；第二壓座，與機台之傳動機構連動，第二壓座設於第一壓座上方並具有充氣腔體，充氣腔體內部具有充氣膜片；空壓源(機)，具有環設於充氣腔體外側之充氣管路，充氣管路與充氣腔體內部連通，當第二壓座向下位移至第一壓座上方且充氣膜片覆蓋真空膜片時，充氣膜片與真空膜片之間形成充氣囊袋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is a vacuum inflatable shoe sole laminating machine, which includes: a machine platform with a vacuum chamber inside and a positioning mechanism connected to the vacuum chamber above, and a transmission mechanism arranged outside the machine platform; a vacuum pump with a vacuum chamber and a The exhaust pipeline is connected to the body; the first pressure seat is linked to the transmission mechanism of the machine. The first pressure seat is located above the machine and has a vacuum diaphragm. When the first pressure seat moves downward to the machine, the vacuum When the diaphragm covers the positioning mechanism, a vacuum bag is formed between the vacuum diaphragm and the positioning mechanism；The second pressure seat is linked to the transmission mechanism of the machine. The second pressure seat is located above the first pressure seat and has an inflatable cavity. The inflatable cavity has an inflatable diaphragm inside; the air pressure source (machine) has an environmental device. The inflation pipeline on the outside of the inflation cavity is connected to the inside of the inflation cavity. When the second pressure seat moves downward to above the first pressure seat and the inflatable diaphragm covers the vacuum diaphragm, the inflatable diaphragm and vacuum diaphragm An air-filled bladder is formed between the pieces.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機台</p>
        <p type="p">13:定位機構</p>
        <p type="p">15:動機構</p>
        <p type="p">150:第一軸桿</p>
        <p type="p">151:第二軸桿</p>
        <p type="p">152:第三軸桿</p>
        <p type="p">16:第三受夾部</p>
        <p type="p">2:閉鎖機構</p>
        <p type="p">20:夾具</p>
        <p type="p">21:驅動件</p>
        <p type="p">4:第一壓座</p>
        <p type="p">40:真空膜片</p>
        <p type="p">41:第一受夾部</p>
        <p type="p">42:第一位移板</p>
        <p type="p">43:第一固定模座</p>
        <p type="p">44:第一活動模座</p>
        <p type="p">5:第二壓座</p>
        <p type="p">50:充氣腔體</p>
        <p type="p">52:充氣管路</p>
        <p type="p">53:第二受夾部</p>
        <p type="p">530:第二受夾面</p>
        <p type="p">54:第二位移板</p>
        <p type="p">55:第二固定模座</p>
        <p type="p">56:第二活動模座</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="973px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621810</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143915</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B09C1/00</main-classification>
        <further-classification edition="200601120260302B">B09C1/10</further-classification>
        <further-classification edition="202301120260302B">C02F3/34</further-classification>
        <further-classification edition="202601120260302B">C12N1/12</further-classification>
        <further-classification edition="200601320260302B">C02F101/36</further-classification>
        <further-classification edition="200601320260302B">C12R1/89</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張書奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅宜萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹弼萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAN, BI-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JUN-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>生物整治助劑之製備方法、生物整治助劑及生物處理方法</chinese-title>
        <english-title>PREPARATION METHOD FOR BIOREMEDIATION ENHANCER, BIOREMEDIATION ENHANCER, AND BIOTREATMENT METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種生物整治助劑之製備方法、生物整治助劑及生物處理方法。生物整治助劑之製備方法包括：將一藻類種源植入一培養基中，置於一光合馴養槽內，持續通入氣體，進行馴養至少7天以上，然後得到經光合馴養的分解輔助藻類；以及對於上述分解輔助藻類進行後續加工處理，得到適用於作為有機物降解菌的碳源及電子供給源的生物整治助劑。藉此，本發明生物整治助劑之製備方法及生物處理方法可達到移除水體中藻體，有助於控制水體之優養化，將藻體廢棄物轉化為有價之生物整治助劑，並可減少最終溫室氣體排放。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a preparation method for a bioremediation enhancer, a bioremediation enhancer, and a biotreatment method. The preparation method for the bioremediation enhancer includes the following steps: inoculating an algal strain into a culture medium, placing it in a photosynthetic tank, continuously supplying gas for at least 7 days of acclimation to obtain a photosynthetically acclimated decomposition algae; and subsequently processing the decomposition algae to obtain a bioremediation enhancer that serves as a carbon source and electron donor for organic matter-degrading bacteria. Therefore, the preparation method for the bioremediation enhancer and the biotreatment method provided by the present invention can achieve the removal of algae from water bodies, assist in controlling water eutrophication, transform algal biomass waste into valuable bioremediation agents, and reduce the final greenhouse gas emissions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621614</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143926</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A47J31/00</main-classification>
        <further-classification edition="200601120241231B">A47J31/06</further-classification>
        <further-classification edition="200601120241231B">A47J31/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪偉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪偉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>過濾裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種過濾裝置，設有一底座、一上蓋及至少一氣囊，該底座設有一容室，該底座於外表面設有至少一下進水孔及至少一下出水孔，該至少一下進水孔及該至少一下出水孔貫穿該底座而與該容室相連通，該底座於鄰近後端處設有一樞接部，該上蓋能樞轉地與該底座相結合且設有一容槽，該上蓋於後端處設有一樞接部，該上蓋的樞接部與該底座的樞接部相樞設結合，該至少一氣囊係設於該上蓋，能讓該過濾裝置置放於一液體中時提供一浮力，使該過濾裝置的重量與該至少一氣囊的浮力達成平衡，而讓該過濾裝置漂浮於該液體中，提供一種具飄浮效果的過濾裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:底座</p>
        <p type="p">13:下進水孔</p>
        <p type="p">14:下出水孔</p>
        <p type="p">15:樞接部</p>
        <p type="p">16:穿槽</p>
        <p type="p">17:限位部</p>
        <p type="p">18:抵靠部</p>
        <p type="p">20:上蓋</p>
        <p type="p">23:上進水孔</p>
        <p type="p">24:上出水孔</p>
        <p type="p">25:樞接部</p>
        <p type="p">26:定位部</p>
        <p type="p">30:氣囊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="784px" img-content="tif" inline="yes" orientation="portrait" width="657px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623037</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143927</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241202B">H01J37/32</main-classification>
        <further-classification edition="200601120241202B">H05H1/28</further-classification>
        <further-classification edition="200601120241202B">H05H1/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UVAT TECHNOLOGY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李原吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUAN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉品均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PIN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉忠炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUNG-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林岱蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DAI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊億</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>組合式電極電漿製程系統及利用組合式電極進行電漿製程的方法</chinese-title>
        <english-title>MODULAR ELECTRODE PLASMA PROCESSING SYSTEM AND PLASMA PROCESSING METHOD USING MODULAR ELECTRODES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請為一種組合式電極電漿製程系統及利用組合式電極進行電漿製程的方法，此組合式電極電漿製程系統包含真空腔體、上電極、第一電極、第二電極及雙面黏貼件。其中，上電極設置於真空腔體內；雙面黏貼件用以將欲進行製程的基板固定於第二電極，而該第二電極可選擇性的與第一電極組合為一下電極，下電極與上電極之間形成一電漿製程空間，以對基板進行電漿製程處理；而當停止電漿製程處理時，可將第一電極與第二電極分離，並連同固定於第二電極上的基板一併取出進行運載。本申請藉由第二電極的設計而具有彈性安排製程時序的優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to a modular electrode plasma processing system and a method for performing plasma processing using the modular electrode. The modular electrode plasma processing system comprises a vacuum chamber, an upper electrode, a first electrode, a second electrode, and a double-sided adhesive. The upper electrode is positioned within the vacuum chamber; the double-sided adhesive is used to secure a substrate, which is to undergo processing, onto the second electrode. The second electrode can selectively combine with the first electrode to form a lower electrode, creating a plasma processing space between the lower electrode and the upper electrode to treat the substrate with plasma. When plasma processing is halted, the first electrode can be separated from the second electrode, allowing for removal of the substrate fixed to the second electrode for further handling. The design of the second electrode provides the advantage of flexible scheduling in the processing sequence.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">1a:外周邊緣</p>
        <p type="p">100:組合式電極電漿製程系統</p>
        <p type="p">10:真空腔體</p>
        <p type="p">20:上電極</p>
        <p type="p">30:第一電極</p>
        <p type="p">40:第二電極</p>
        <p type="p">42:接觸組合部</p>
        <p type="p">50:雙面黏貼件</p>
        <p type="p">51:第一黏貼層</p>
        <p type="p">52:第二黏貼層</p>
        <p type="p">60:下電極</p>
        <p type="p">70:框形蓋板</p>
        <p type="p">80:升降模組</p>
        <p type="p">P:電漿製程空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="1085px" img-content="tif" inline="yes" orientation="portrait" width="777px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622789</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143931</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250205B">G06F30/23</main-classification>
        <further-classification edition="200601120250205B">A61F2/28</further-classification>
        <further-classification edition="200601120250205B">G06T17/00</further-classification>
        <further-classification edition="201101120250205B">G06T19/00</further-classification>
        <further-classification edition="200601120250205B">G09B23/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭振仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, JENN-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宙晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHOU CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡書維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHUWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仰高</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YANG-KAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉浩志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, BERNARD HAOCHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張子彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TZU-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林啓倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯君偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃雅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YA-MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>客製化下顎骨板模型建立方法及系統</chinese-title>
        <english-title>CUSTOMIZED MANDIBULAR PLATE MODEL BUILDING METHOD AND SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種客製化下顎骨板模型建立方法及系統。下顎骨板模型建立方法包括：取得下顎骨斷層掃描影像，判斷下顎骨斷層掃描影像中的缺損區塊，將對應缺損區塊的雛形設計圖與下顎骨斷層掃描影像匯入三維建模軟體，以將該雛形設計圖調整為與缺損區塊相吻合的經調整設計圖，接收指示多個指定骨釘孔洞的使用者指令，將該些指定骨釘孔洞、經調整設計圖與下顎骨斷層掃描影像組合為待最佳化設計圖，對待最佳化設計圖的多個幾何參數執行有限元素模擬以產生經最佳化設計圖，以及根據經最佳化設計圖中的下顎骨骨板模型輸出客製化設計圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A customized mandibular plate model building method and system. The mandibular plate model building method includes: obtaining a mandibular tomography image, identifying a defect area in the mandibular tomography image, importing a preliminary designed image corresponding to the defect area and the mandibular tomography image into a 3D modeling software to adjust the preliminary designed image to create an adjusted image that matches the defect area, receiving a user command indicated designated screw holes, combining the designated screw holes, the adjusted design image and the mandibular tomography image into a to-be-validated design image, performing finite element simulation on geometric parameters of the to-be-validated design image to generate a validated design image, and outputting a customized design image according to a mandibular plate model in the validated design image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S103,S105,S107,S109,S111,S113:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="1004px" img-content="tif" inline="yes" orientation="portrait" width="701px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621960</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143933</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">B65D85/90</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬維京群島商祥茂光電科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIME WORLD INTERNATIONAL HOLDINGS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>VG</english-country>
              <english-address>VG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡家強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIA-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仁輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基板載具</chinese-title>
        <english-title>SUBSTRATE CARRIER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基板載具，包含承載主體、多個分隔件以及至少一止擋件。多個分隔件間隔設置於承載主體內側。至少一止擋件包含安裝部及第一止擋部。安裝部可移動地設置於承載主體。第一止擋部自安裝部延伸至承載主體上方。安裝部具有多個凹槽。這些凹槽分別對應這些分隔件定義出的多個基板收納槽。承載主體可相對至少一止擋件沿鎖合方向移動而使基板載具具有鎖合狀態及解鎖狀態，且至少一止擋件於鎖合方向上的尺寸大於承載主體於鎖合方向上的尺寸。當基板載具處於解鎖狀態，這些凹槽分別與這些基板收納槽對齊，承載主體與第一止擋部相間隔，且當基板載具處於鎖合狀態，這些凹槽分別與這些基板收納槽錯位，承載主體接觸第一止擋部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a substrate carrier, including a loading body, multiple dividing members, and at least one stopping member. The dividing members separately disposed inside the loading body. The at least one stopping member includes a mounting part and a first stopping part. The mounting part is movably disposed on the loading body. The first stopping part extends to the top of the loading body from the mounting part. The mounting part has multiple grooves. The grooves correspond to multiple substrate storage grooves which are defined by the dividing members, respectively. The loading body may move along a locking direction with respect to the at least one stopping member such that the substrate carrier has a locking state and unlocking state. The size of the at least one stopping member is larger than that of the loading body in the locking direction. When the substrate carrier is in the unlocking state, the grooves are aligned with the substrate storage grooves, respectively, and the loading body is spaced apart from the first stopping part. When the substrate carrier is in the locking state, the grooves are staggered with the substrate storage grooves, respectively, and the loading body is in contact with the first stopping part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1,1a:基板載具</p>
        <p type="p">11:承載主體</p>
        <p type="p">12:分隔件</p>
        <p type="p">13:止擋件</p>
        <p type="p">131:第一止擋件</p>
        <p type="p">132:第二止擋件</p>
        <p type="p">D1:鎖合方向</p>
        <p type="p">6-6:線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="729px" img-content="tif" inline="yes" orientation="portrait" width="866px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621783</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143934</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241128B">B01D53/26</main-classification>
        <further-classification edition="200601120241128B">B01D53/74</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH&amp;DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUAN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>水氣分離裝置</chinese-title>
        <english-title>WATER VAPOR REMOVING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水氣分離裝置，包含一外殼以及一第一除水結構。外殼具有一入風口、一出風口及一流體腔室。入風口透過流體腔室連通於出風口。第一除水結構設置於流體腔室中並具有一第一除水斜面。第一除水斜面面對入風口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A water vapor removing device including a shell and a first condensing structure. The shell has an air inlet, an air outlet and a fluid space. The air inlet is connected to the air outlet via the fluid space. The first condensing structure is disposed in the fluid space and has a first condensing inclined surface facing the air lnlet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:水氣分離裝置</p>
        <p type="p">100:外殼</p>
        <p type="p">110:入風口</p>
        <p type="p">120:出風口</p>
        <p type="p">130:流體腔室</p>
        <p type="p">131:第一流動空間</p>
        <p type="p">132:第二流動空間</p>
        <p type="p">133:第三流動空間</p>
        <p type="p">150:第一除水結構</p>
        <p type="p">151:第一除水斜面</p>
        <p type="p">155,255:連接柱</p>
        <p type="p">160,260:連接肋</p>
        <p type="p">200:第一隔板</p>
        <p type="p">201:第一連通孔</p>
        <p type="p">250:第二除水結構</p>
        <p type="p">251:第二除水斜面</p>
        <p type="p">300:第二隔板</p>
        <p type="p">301:第二連通孔</p>
        <p type="p">350:膨脹蓋</p>
        <p type="p">351:蓋板</p>
        <p type="p">352:側板</p>
        <p type="p">353:第一膨脹孔</p>
        <p type="p">400:膨脹板</p>
        <p type="p">401:第二膨脹孔</p>
        <p type="p">G:重力方向</p>
        <p type="p">θ:傾斜角度</p>
        <p type="p">D1,D2,D3:直徑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="995px" img-content="tif" inline="yes" orientation="portrait" width="715px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622378</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143936</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250121B">F04D29/66</main-classification>
        <further-classification edition="200601120250121B">F04D29/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>訊凱國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COOLER MASTER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈嘉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, JIA-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>複合式扇葉及風扇裝置</chinese-title>
        <english-title>COMPOSITE FAN BLADE AND FAN DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合式扇葉，包含一金屬件以及一塑膠件。金屬件包含一結合部及多個葉片部。這些葉片部連接於結合部之周圍。塑膠件呈筒狀，並至少部分結合於金屬件之結合部，以令金屬件之結合部與塑膠件共構成一輪轂結構。其中，結合部包含一基板及多個連接板。這些連接板分別連接於基板之周緣，並間隔設置而於任二相鄰之二連接板間形成一缺口。這些連接板各具有一內側面、一外側面及一凹槽。這些外側面背對這些內側面。這些葉片部分別凸出於這些連接板之這些外側面。這些凹槽分別位於這些內側面。塑膠件至少部分結合於這些凹槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite fan blade includes a metal member and a plastic member. The metal member includes a binding potion and a plurality of blade potions. The plurality of blade potions are connected to the periphery of the binding potion. The plastic member is tube-shaped, and at least partially connected to the binding potion of the metal member, such that the binding potion of the metal member and the plastic member together form a wheel structure. The binding potion includes a substrate and a plurality of connecting plates. The plurality of connecting plates are connected to the periphery of the substrate, and are spaced apart from each other to form a notch between any two adjacent connecting plates. Each of the plurality of connecting plates has an inner surface, an outer surface and a slot. The inner surfaces face away from the outer surfaces. The plurality of blade potions respectively protrude from the outer surfaces of the plurality of connecting plates. The slots are located on the inner surfaces. The plastic member are at least partially connected to the slots, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:風扇裝置</p>
        <p type="p">20:固定架</p>
        <p type="p">30:複合式扇葉</p>
        <p type="p">31:金屬件</p>
        <p type="p">311:結合部</p>
        <p type="p">3111:基板</p>
        <p type="p">3112:連接板</p>
        <p type="p">31121:內側面</p>
        <p type="p">31123:凹槽</p>
        <p type="p">312:葉片部</p>
        <p type="p">32:塑膠件</p>
        <p type="p">321:環槽</p>
        <p type="p">40:驅動元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="1007px" img-content="tif" inline="yes" orientation="portrait" width="694px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623391</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143942</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D30/60</main-classification>
        <further-classification edition="202501120250102B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李依珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘欽寒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, CHIN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置。半導體裝置包括基板、磊晶層、隔離結構、場氧化層。基板具有第一導電類型。磊晶層具有不同於第一導電類型的第二導電類型，且設置於基板上。隔離結構具有第一導電類型，且設置於磊晶層中。隔離結構包括第一井區、第二井區及設置於第一井區及第二井區之間的摻雜區。場氧化層設置於磊晶層上。其中，場氧化層暴露位於第一井區及摻雜區之間的磊晶層的頂表面或暴露位於第二井區及摻雜區之間的磊晶層的頂表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The semiconductor device includes a substrate, an epitaxial layer, an isolation structure, and a field oxide layer. The substrate has a first conductivity type. The epitaxial layer has a second conductivity type different from the first conductivity type and is disposed on the substrate. The isolation structure has a first conductivity type and is disposed in the epitaxial layer. The isolation structure includes a first well, a second well, and a doped region disposed between the first well and the second well. The field oxide layer is disposed on the epitaxial layer. Wherein, the field oxide layer exposes a top surface of the epitaxial layer located between the first well and the doped region or exposes a top surface of the epitaxial layer located between the second well and the doped region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">100:基板</p>
        <p type="p">102,104:第一埋置層</p>
        <p type="p">106,108:第二埋置層</p>
        <p type="p">110:磊晶層</p>
        <p type="p">112:深井區</p>
        <p type="p">114:高壓井區</p>
        <p type="p">122:第一井區</p>
        <p type="p">123:第一主動區</p>
        <p type="p">124:第二井區</p>
        <p type="p">125:第二主動區</p>
        <p type="p">126:摻雜區</p>
        <p type="p">200,200a,200b,200c,200d,200e,200f:場氧化層</p>
        <p type="p">210:閘極介電層</p>
        <p type="p">220:閘極電極</p>
        <p type="p">302,304,306,308:井區</p>
        <p type="p">312,314,316:摻雜區</p>
        <p type="p">400:第一介電層</p>
        <p type="p">410:第一金屬層</p>
        <p type="p">500:第二介電層</p>
        <p type="p">510:第二金屬層</p>
        <p type="p">A-A’:線段</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">ISO:隔離結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="756px" img-content="tif" inline="yes" orientation="portrait" width="1090px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623426</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143943</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D84/00</main-classification>
        <further-classification edition="202501120250102B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳弘修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONG-XIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘欽寒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, CHIN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置。半導體裝置包括基板、磊晶層及隔離元件。基板具有第一導電類型。磊晶層具有不同於第一導電類型的第二導電類型，且設置於該基板上。隔離元件具有第一導電類型，設置於基板及磊晶層中，且包括第一隔離結構及第二隔離結構。第二隔離結構連接第一隔離結構的第一邊緣。其中，第一隔離結構的寬度大於第二隔離結構的寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The semiconductor device includes a substrate, an epitaxial layer, and an isolation element. The substrate has a first conductivity type. The epitaxial layer has a second conductivity type different from the first conductivity type and is disposed on the substrate. The isolation element has the first conductivity type, is disposed in the substrate and the epitaxial layer, and includes a first isolation structure and a second isolation structure. The second isolation structure is connected to a first edge of the first isolation structure. Wherein, a width of the first isolation structure is greater than a width of the second isolation structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">E1:第一邊緣</p>
        <p type="p">E2:第二邊緣</p>
        <p type="p">ISO:隔離元件</p>
        <p type="p">S1:第一隔離結構</p>
        <p type="p">S2:第二隔離結構</p>
        <p type="p">S3:第三隔離結構</p>
        <p type="p">L1:切線</p>
        <p type="p">P1:第一部分</p>
        <p type="p">P2:第二部分</p>
        <p type="p">P3:第三部分</p>
        <p type="p">P4:第四部分</p>
        <p type="p">P6:第六部分</p>
        <p type="p">w1:第一寬度</p>
        <p type="p">w2:第二寬度</p>
        <p type="p">w3:第三寬度</p>
        <p type="p">R1:第一區域</p>
        <p type="p">R2:第二區域</p>
        <p type="p">R3:第三區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="632px" img-content="tif" inline="yes" orientation="portrait" width="832px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623622</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143962</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10W20/00</main-classification>
        <further-classification edition="202601120260303B">H10W70/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞峰半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYTEK SEMICONDUCTOR, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林健財</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-TSAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴國瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, KUO-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李權豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUAN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許郁莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有矽穿孔的基板結構及其製作方法</chinese-title>
        <english-title>SUBSTRATE STRUCTURE WITH THROUGH-SILICON VIA AND MANUFACTURE METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於此提供一種具有矽穿孔的基板結構和其製作方法。複數個矽穿孔結構設置於基板中且垂直貫通於基板的第一面和基板的第二面之間，其中任一矽穿孔結構包括一鄰近基板的第一面的導電墊、一貫通電極和介於貫通電極和基板之間的一襯層。在從基板的第二面進行薄化後，矽穿孔結構的貫通電極和對應的襯層突出於基板的第二面上，之後將一絕緣聚合物層覆蓋於基板的第二面上的，且絕緣聚合物層共形地覆蓋於突出的貫通電極和襯層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate structure with through-silicon via and manufacture method thereof are provided. Plural through-silicon via structures are deposited within a substrate and vertically through between a first and a second sides of the substrate. Each one through-silicon via structure includes a conductive pad close to the first side of the substrate, a through electrode and a liner between the through electrode and the substrate. After a thinning treatment from the second side of the substrate, the through electrodes with the liners are protruding out of the second side of the substrate. An insulation polymer covers the second side of the substrate and is conformally over the protruding through electrodes with the liners.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">11:第二面</p>
        <p type="p">30:貫通電極</p>
        <p type="p">31:第二面</p>
        <p type="p">40:襯層</p>
        <p type="p">41:第二面</p>
        <p type="p">60:絕緣聚合物層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="271px" img-content="tif" inline="yes" orientation="portrait" width="714px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621654</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143969</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241202B">A61F5/37</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄基三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄基三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許耿禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多片式中空透氣護腰結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種多片式透氣護腰結構，包含：一第一帶體、一第二帶體及二第一護片，該第一帶體與一第一護片連接，該第二帶體與另一第一護片連接，該二第一護片間設置一第二護片以連接件相互連接，或直接以連接件相互連接，該第一護片內面形成一外凸的第一空間，該第一護片上布列複數第一透氣孔，該第一透氣孔與該第一空間相通，該第二護片內面形成一外凸的第二空間，該第二護片上布列複數第二透氣孔，該第二透氣孔與該第二空間相通；藉以，提高整體透氣性，減少穿戴時的悶熱感，從而提升舒適度，同時，使用者在活動時身體可自由彎曲，符合人體工學，避免不適與不便的情況發生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一帶體</p>
        <p type="p">11:第一結合部</p>
        <p type="p">20:第二帶體</p>
        <p type="p">21:第二結合部</p>
        <p type="p">30:第一護片</p>
        <p type="p">31:第一透氣孔</p>
        <p type="p">32:第一閃避段</p>
        <p type="p">33:防護部</p>
        <p type="p">40:第二護片</p>
        <p type="p">41:第二透氣孔</p>
        <p type="p">42:第二閃避段</p>
        <p type="p">50:連接件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="669px" img-content="tif" inline="yes" orientation="portrait" width="976px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621755</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143981</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250930B">A61N1/08</main-classification>
        <further-classification edition="200601120250930B">A61N1/36</further-classification>
        <further-classification edition="202101120250930B">A61B5/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪木勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, MU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康峻宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JIUNN-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡純瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, CHUN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林伯星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BOR-SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具肌肉疲乏偵測的智慧垂足電刺激系統與方法</chinese-title>
        <english-title>INTELLIGENT DROP FOOT STIMULATION SYSTEM AND METHOD WITH MUSCLE FATIGUE DETECTION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種具肌肉疲乏偵測的智慧垂足電刺激系統與方法。此方法包括：透過第一慣性感測器感測小腿的運動姿態數據；透過第二慣性感測器感測足部的運動姿態數據；根據這些運動姿態數據判斷步態階段並計算出小腿角度以及足部角度；當步態階段屬於擺動期時，控制電刺激器產生第一脈波給至少一個電極以刺激小腿；以及在擺動期根據足部角度判斷小腿是否發生肌肉疲乏現象，若發生肌肉疲乏現象控制電刺激器產生第二脈波給電極以刺激小腿，其中第一脈波的波參數不同於第二脈波的波參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention proposes an intelligent drop foot stimulation system and method with muscle fatigue detection. The method includes: sensing motion posture data of a calf using a first inertial sensor; sensing motion posture data of a foot using a second inertial sensor; determining a gait phase and calculating a calf angle and a foot angle based on the motion posture data; when the gait phase is in a swing phase, controlling a electrical stimulator to generate a first pulse to stimulate the calf through at least one electrode; and during the swing phase, determining whether the muscle fatigue occurs in the calf based on the foot angle, and if muscle fatigue is detected, controlling the electrical stimulator to generate a second pulse to stimulate the calf through the electrode in which a pulse parameters of the first pulse is different from that of the second pulse.</p>
      </isu-abst>
      <representative-img>
        <p type="p">901~907:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="902px" img-content="tif" inline="yes" orientation="portrait" width="626px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621860</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143982</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250324B">B25C5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭淑仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭淑仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具包材釘裝裁切多功能釘書機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種具包材釘裝裁切多功能釘書機，主要結構包括有：釘書機上部、釘書機中部及釘書機下部。特別是：在釘書機上部設有一個以上的圓弧刀刃，於釘書機下部設有具備一個以上圓弧刀刃且可自由滑移之活動板，當相對之圓弧刀刃重合時可提供去除花莖葉子用途；又該活動板一側具有垂直刀刃，可提供裁切花莖長短之用途；另於釘書機下部設有凹槽用以容納整束被包裝材包覆之花莖，再利用釘書針之裝釘達到固定花束包裝材之用途；此外該活動板之圓弧刀刃亦可為平直切割邊，以便充做臨時剪刀用途；以上構成一多功能兼具實用便利之創新釘書機結構。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:釘書機</p>
        <p type="p">2:釘書機上部</p>
        <p type="p">21:重合孔</p>
        <p type="p">22:容置空間</p>
        <p type="p">221:圓弧刀刃</p>
        <p type="p">222:切割邊</p>
        <p type="p">23:固定片</p>
        <p type="p">231:垂直部</p>
        <p type="p">232:傾斜部</p>
        <p type="p">3:釘書機中部</p>
        <p type="p">31:重合孔</p>
        <p type="p">32:滑塊</p>
        <p type="p">321:止擋部</p>
        <p type="p">322:凸耳</p>
        <p type="p">323:溝槽</p>
        <p type="p">324:容置槽</p>
        <p type="p">325:缺口</p>
        <p type="p">4:釘書機底部</p>
        <p type="p">41:重合孔</p>
        <p type="p">42:空槽</p>
        <p type="p">43:凹槽</p>
        <p type="p">431:滑槽</p>
        <p type="p">432:活動板</p>
        <p type="p">433:凸耳</p>
        <p type="p">434:圓弧刀刃</p>
        <p type="p">435:垂直刀刃</p>
        <p type="p">436:切割邊</p>
        <p type="p">44:按壓部</p>
        <p type="p">441:弧形凹槽</p>
        <p type="p">5:固定軸</p>
        <p type="p">6:釘書針</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="743px" img-content="tif" inline="yes" orientation="portrait" width="614px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622781</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143984</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250303B">G06F21/30</main-classification>
        <further-classification edition="201301120250303B">G06F21/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商華科全球股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUS GLOBAL PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳金鳳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIN FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程忠崗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, ZHONG GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置與其身分驗證方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND IDENTITY AUTHENTICATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案為一種電子裝置與其身分驗證方法。此方法適用於包括攝像裝置的電子裝置，並包括下列步驟。執行電子裝置的一開機韌體。於開機韌體的執行期間，根據攝像裝置所拍攝的人臉圖像進行一人臉辨識而獲取人臉特徵資訊。於開機韌體的執行期間，判斷人臉圖像中的人臉特徵資訊是否匹配註冊人臉特徵資訊。當人臉圖像中的人臉特徵資訊未匹配註冊人臉特徵資訊，停止繼續執行開機韌體。當人臉圖像中的人臉特徵資訊匹配註冊人臉特徵資訊時，繼續執行開機韌體而啟動一作業系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a identity authentication method thereof are provided. The method is adapted to the electronic device including a camera device and includes the following steps. A boot firmware of the electronic device is executed. During the execution of the boot firmware, a facial recognition is performed based on a facial image captured by the camera device to obtain facial feature information. During the execution of the boot firmware, whether the facial feature information in the face image matches registered facial feature information is determined. When the facial feature information in the face image does not match the registered facial feature information, stop continuing the execution of the boot firmware. When the facial feature information in the face image matches the registered facial feature information, the boot firmware is continued to be executed to start an operating system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S250:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="764px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622782</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143987</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250714B">G06F21/60</main-classification>
        <further-classification edition="201301120250714B">G06F21/62</further-classification>
        <further-classification edition="201301120250714B">G06F21/64</further-classification>
        <further-classification edition="201301120250714B">G06F21/73</further-classification>
        <further-classification edition="201901120250714B">G06F16/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國泰金融控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CATHAY FINANCIAL HOLDING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李肇筌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHAO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅庭姍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, TING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>區塊鏈預言機資料共享系統</chinese-title>
        <english-title>BLOCKCHAIN ORACLE DATA SHARING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種區塊鏈預言機資料共享系統，其包含預言機設備以及客戶端裝置，預言機設備通訊連接資料伺服器，客戶端裝置透過區塊鏈通訊連接預言機設備，預言機設備將資料伺服器的資料提供給區塊鏈。區塊鏈包含應用程式合約與資料共享平台合約彼此連結，客戶端裝置執行應用程式服務向應用程式合約發起取得資料請求，應用程式合約向資料共享平台合約撈取存在於區塊鏈上的資料，資料共享平台合約回傳資料給應用程式合約，應用程式合約將資料回傳給應用程式服務，客戶端裝置進行相應於資料的應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a blockchain oracle data sharing system, which includes an oracle device and a client device, the oracle device is connected to a data server through communication, and the client device is connected to the oracle device through a block chain in communication. The oracle device feeds data from the data server to the block chain. The block chain includes an application contract and a data sharing platform contract linked to each other. The client device executes an application service and sends a data acquisition request to the application contract. The application contract obtains the data of the block chain from the data sharing platform contract. The data sharing platform contract returns the data to the application contract, the application contract returns the data to the application service, and the client device performs applications corresponding to the data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:客戶端裝置</p>
        <p type="p">111:應用程式服務</p>
        <p type="p">112:履行模組</p>
        <p type="p">120:區塊鏈</p>
        <p type="p">121:應用程式合約</p>
        <p type="p">122:資料共享平台合約</p>
        <p type="p">124:服務合約</p>
        <p type="p">126:預言機外掛程式</p>
        <p type="p">130:預言機設備</p>
        <p type="p">131:預言機節點</p>
        <p type="p">132:適配器</p>
        <p type="p">140:資料伺服器</p>
        <p type="p">141:閘道器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="720px" img-content="tif" inline="yes" orientation="portrait" width="1014px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622872</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143993</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250303B">G06Q40/08</main-classification>
        <further-classification edition="202301120250303B">G06Q30/015</further-classification>
        <further-classification edition="202001120250303B">G16Y10/50</further-classification>
        <further-classification edition="202001120250303B">G16Y40/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國泰金融控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CATHAY FINANCIAL HOLDING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李肇筌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHAO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅庭姍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, TING-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳純懿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘孝旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, SIAO-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於區塊鏈預言機之去中心化保險自動賠付系統</chinese-title>
        <english-title>DECENTRALIZED INSURANCE AUTOMATIC COMPENSATION SYSTEM BASED ON BLOCKCHAIN ORACLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種基於區塊鏈預言機之去中心化保險自動賠付系統，其包含預言機設備以及客戶端裝置，預言機設備通訊連接資料伺服器，客戶端裝置透過區塊鏈通訊連接預言機設備。區塊鏈包含保險智能合約與預言機智能合約彼此連結，客戶端裝置將投保資訊寫入保險智能合約，保險智能合約向預言機智能合約請求關於投保資訊的相關資訊，預言機智能合約透過預言機設備取得資料伺服器所提供的相關資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a decentralized insurance automatic compensation system based on blockchain oracle, which includes an oracle device and a client device, the oracle device is connected to a data server through communication, and the client device is connected to the oracle device through a block chain in communication. The block chain includes an insurance smart contract and an oracle smart contract linked to each other. The client device writes the insurance information into the insurance smart contract. The insurance smart contract requests relevant information about the insurance information from the oracle smart contract. The oracle smart contract obtains the relevant information provided by the data server through the oracle device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:客戶端裝置</p>
        <p type="p">120:區塊鏈</p>
        <p type="p">121:保險智能合約</p>
        <p type="p">122:預言機智能合約</p>
        <p type="p">123:保戶鏈上錢包</p>
        <p type="p">130:預言機設備</p>
        <p type="p">131:預言機節點</p>
        <p type="p">132:適配器</p>
        <p type="p">140:資料伺服器</p>
        <p type="p">150:資金提供者伺服器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="702px" img-content="tif" inline="yes" orientation="portrait" width="1036px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623476</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143994</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250211B">H10H20/856</main-classification>
        <further-classification edition="202501120250211B">H10H20/857</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富采光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENNOSTAR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪孟祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, MENG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育翎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊鎮毓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JHEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳柏廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓亨穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HENG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體元件</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一半導體元件包含一第一半導體層包含一第一斜面以及一第一表面；一半導體平台位於第一半導體層上，包含一活性層以及一第二半導體層，並包含一第二斜面與第一半導體層之第一表面相接；一接觸電極位於第二半導體層上；一絕緣反射結構位於接觸電極上，包含一或複數個第一絕緣反射結構開口以及複數個第二絕緣反射結構開口；一連接層，包含一金屬化合物，覆蓋絕緣反射結構並填入複數個第二絕緣反射結構開口；以及一金屬反射結構覆蓋複數個第二絕緣反射結構開口，其中於半導體元件之一側視圖中，連接層包含複數個連接層開口以分別對應複數個第二絕緣反射結構開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first semiconductor layer including a first inclined surface and a first surface; a semiconductor mesa formed on the first semiconductor layer, including an active layer and a second semiconductor layer, and including a second inclined surface connected to the first surface of the first semiconductor layer; a contact electrode formed on the second semiconductor layer; an insulating reflective structure formed on the contact electrode, including one or a plurality of first insulating reflective structure openings and a plurality of second insulating reflective structure openings; a connection layer, including a metal compound, covering the insulating reflective structure and filling into the plurality of second insulating reflective structure openings; and a metal reflective structure covering the plurality of second insulating reflective structure openings, wherein in a side view of the semiconductor device, the connection layer includes a plurality of connection layer openings respectively corresponding to the plurality of the second insulating reflective structure openings.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體元件</p>
        <p type="p">10:基板</p>
        <p type="p">10s:上表面</p>
        <p type="p">10t:出光面</p>
        <p type="p">11:第一邊</p>
        <p type="p">12:第二邊</p>
        <p type="p">20:半導體結構</p>
        <p type="p">20b、20t:上表面</p>
        <p type="p">21:第一半導體層</p>
        <p type="p">21t:第一表面</p>
        <p type="p">22:活性層</p>
        <p type="p">23:第二半導體層</p>
        <p type="p">23t:第二表面</p>
        <p type="p">30:接觸電極</p>
        <p type="p">40:絕緣反射結構</p>
        <p type="p">401:第一絕緣反射結構開口</p>
        <p type="p">402:第二絕緣反射結構開口</p>
        <p type="p">41:絕緣反射鏡</p>
        <p type="p">42:第一絕緣層</p>
        <p type="p">43:第一緻密層</p>
        <p type="p">51:連接層</p>
        <p type="p">510:連接層開口</p>
        <p type="p">52:金屬反射結構</p>
        <p type="p">60:絕緣結構</p>
        <p type="p">601:第一絕緣結構開口</p>
        <p type="p">602:第二絕緣結構開口</p>
        <p type="p">71:第一延伸電極</p>
        <p type="p">72:第二延伸電極</p>
        <p type="p">80:保護結構</p>
        <p type="p">801:第一保護結構開口</p>
        <p type="p">802:第二保護結構開口</p>
        <p type="p">91:第一電極墊</p>
        <p type="p">92:第二電極墊</p>
        <p type="p">B1:邊界</p>
        <p type="p">E1:第一凹陷區域</p>
        <p type="p">M:半導體平台</p>
        <p type="p">S1:第一斜面</p>
        <p type="p">S2:第二斜面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="649px" img-content="tif" inline="yes" orientation="portrait" width="1120px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621764</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113143995</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120241231B">A63B67/187</main-classification>
        <further-classification edition="201601120241231B">A63B67/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>開駿興業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃嘉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昉昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>羽毛球的人造羽毛</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種羽毛球的人造羽毛，人造羽毛的構造包括：一主軸、至少一羽溝、一第一羽片，以及一第二羽片；人造羽毛係採用含人造纖維之熱可塑性混合材料然後通過微發泡射出成型技術製作完成的一種具有微氣泡的微彈性多孔結構；主軸的構造包括以同軸的關係相連為一體的一羽軸和一羽根，主軸的橫截面形狀為楔形，第一羽片和第二羽片分別配置於羽軸的左側邊和右側邊並且和羽軸相連為一體，羽溝位在主軸的頂面和背面的其中至少一處，羽溝沿著主軸的軸向延伸；本發明之人造羽毛具有生產快速，最佳結構強靭表現以及減少自然資源之消耗的優點。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:主軸</p>
        <p type="p">11:羽軸</p>
        <p type="p">12:羽根</p>
        <p type="p">21:第一羽溝</p>
        <p type="p">31:第一羽片</p>
        <p type="p">32:第二羽片</p>
        <p type="p">33:羽枝</p>
        <p type="p">34:羽膜</p>
        <p type="p">341:內邊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="648px" img-content="tif" inline="yes" orientation="portrait" width="864px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621593</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144008</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A44B18/00</main-classification>
        <further-classification edition="200601120241230B">B29C45/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣百和工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN PAIHO LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭誠禕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, ALLEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張展祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHAN-LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>勾體結構、複層結構及勾體結構的製造方法</chinese-title>
        <english-title>HOOK STRUCTURE, MULTI-LAYERED STRUCTURE AND MANUFACTURING METHOD OF HOOK STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種勾體結構具有一第一延伸方向以及一第二延伸方向，其包含一支撐層以及一覆蓋層，其中支撐層包含一基層及複數勾體列組。勾體列組沿著第一延伸方向間隔排列，其中每一勾體列組包含複數勾體單元，每一勾體列組的勾體單元沿著第二延伸方向間隔排列，且勾體單元一體成型地連接於基層的一側。覆蓋層覆蓋於支撐層的勾體單元以及基層外露於所述側的複數表面區域。藉此，可提升勾體結構的結構穩定性與應用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a hook structure with a first extending direction and a second extending direction that includes a supporting layer and a covering layer, wherein the supporting layer includes a base layer and a plurality of hook columns. The hook columns are arranged at intervals along the first extending direction, wherein each of the hook columns includes a plurality of hook units, the hook units of each of the hook columns are arranged at intervals along the second extending direction, and the hook units are integrally connected to one side of the base layer. The covering layer covers the hook units of the supporting layer and a plurality of surface areas of the base layer that are exposed on the side of the base layer. Therefore, the mechanical stability and the applicability of the hook structure can be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:勾體結構</p>
        <p type="p">110:支撐層</p>
        <p type="p">111:基層</p>
        <p type="p">113:勾體單元</p>
        <p type="p">120:覆蓋層</p>
        <p type="p">D1:第一延伸方向</p>
        <p type="p">D2:第二延伸方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="626px" img-content="tif" inline="yes" orientation="portrait" width="989px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621932</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144011</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120241125B">B62K5/02</main-classification>
        <further-classification edition="200601120241125B">B62H1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商毅群電子科技（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TPK MULTI-ASSET (XIAMEN) INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙劍明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIAN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, ZHI-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, WEN-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHI-XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>車輛組裝系統</chinese-title>
        <english-title>VEHICLE ASSEMBLY SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種車輛組裝系統包含中央組裝平台以及兩輪組安裝推車。中央組裝平台包含傾斜機構、基座、升降機構、第一接合元件及第二接合元件。傾斜機構配置以固持車架，並帶動車架傾斜。升降機構連接基座及傾斜機構，並配置以驅動傾斜機構在基座上升降。基座在水平方向上具有相對的第一側以及第二側，第一、第二接合元件分別設置在基座的第一側及第二側。兩輪組安裝推車分別包含第三接合元件以及第四接合元件，第三、第四接合元件分別可拆分地連接中央組裝平台的第一、第二接合元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A vehicle assembly system includes a central assembly platform and two wheel installing vehicles. The central assembly platform includes a tilt mechanism, a base, a vertical motion mechanism, a first engaging member and a second engaging member. The tilt mechanism is configured to secure a frame of a vehicle and make the frame tilt. The vertical motion mechanism is connected to the base and the tilt mechanism and is configured to drive the tilt mechanism to move upward or downward on the base. The base has a first side and a second side in a horizontal direction. The first and second engaging members are disposed on the first and second sides of the base, respectively. The two wheel installing vehicles include a third engaging member and a fourth engaging member, respectively. The third and fourth engaging members are detachably connected to the first and second engaging members, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:車輛組裝系統</p>
        <p type="p">13:車架</p>
        <p type="p">15:腕組通孔</p>
        <p type="p">19A:第一輪組</p>
        <p type="p">19B:第二輪組</p>
        <p type="p">20:中央組裝平台</p>
        <p type="p">23:基座</p>
        <p type="p">25:升降機構</p>
        <p type="p">28:滾輪</p>
        <p type="p">30A:第一輪組安裝推車</p>
        <p type="p">30B:第二輪組安裝推車</p>
        <p type="p">31:轉軸裝置</p>
        <p type="p">35:固定座</p>
        <p type="p">35P:第一部份</p>
        <p type="p">35Q:第二部份</p>
        <p type="p">36:側擋板</p>
        <p type="p">37:底板</p>
        <p type="p">38:滾輪</p>
        <p type="p">39:手把</p>
        <p type="p">50:傾斜機構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="756px" img-content="tif" inline="yes" orientation="portrait" width="961px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621909</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144012</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250107B">B60B31/02</main-classification>
        <further-classification edition="200601120250107B">B60B30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商毅群電子科技（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TPK MULTI-ASSET (XIAMEN) INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, ZHI-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳金蒼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIN-CANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙劍明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIAN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, WEN-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>車輪輻條自動鎖緊系統</chinese-title>
        <english-title>AUTOMATIC SPOKE LOADING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種車輪輻條自動鎖緊系統包含輪圈支撐機構、複數個輻條鎖緊機構以及中控裝置。輪圈支撐機構包含放置平台以及輪轂夾持元件。放置平台配置以承載車輪，輪轂夾持元件設置在放置平台的中央。放置平台具有輪轂限位槽，輪轂限位槽環繞輪轂夾持元件。輻條鎖緊機構成對地設置在輪圈支撐機構的外圍，且各包含輻條帽鎖緊批頭。中控裝置配置以向輻條鎖緊機構發送指令，以驅使輻條鎖緊機構將車輪的待鎖的複數個輻條鎖緊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic spoke loading system includes a rim support mechanism, a plurality of spoke loading mechanism and a central control device. The rim support mechanism includes a platform and a hub holder. The platform is configured to support a wheel. The hub holder is positioned at a center of the platform. The platform has a hub positioning recess arranged around the hub holder. The spoke loading mechanisms are disposed on a surrounding of the rim support mechanism and are arranged in pairs. The spoke loading mechanisms each include a spoke cap tightening head. The central control device is configured to send commands to the spoke loading mechanisms to cause the spoke loading mechanisms to load a plurality of spokes of the wheel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:輪圈支撐機構</p>
        <p type="p">21:放置平台</p>
        <p type="p">22:輪圈限位槽</p>
        <p type="p">23:輪轂限位槽</p>
        <p type="p">24:輪轂夾持元件</p>
        <p type="p">30:定位裝置</p>
        <p type="p">31:基座</p>
        <p type="p">33:錐形滑動件</p>
        <p type="p">35:凸緣</p>
        <p type="p">37:彈性件</p>
        <p type="p">60:輻條鎖緊機構</p>
        <p type="p">61:輻條帽鎖緊批頭</p>
        <p type="p">65:控制及驅動單元</p>
        <p type="p">D1:第一方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="667px" img-content="tif" inline="yes" orientation="portrait" width="679px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621907</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144013</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241125B">B60B21/00</main-classification>
        <further-classification edition="200601120241125B">G01M17/013</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商毅群電子科技（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TPK MULTI-ASSET (XIAMEN) INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙劍明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIAN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, WEN-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHI-XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, ZHI-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>輪圈校正系統及其方法</chinese-title>
        <english-title>WHEEL RIM CORRECTION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於一種輪圈校正系統及輪圈校正方法。輪圈校正系統包含第一固定板、支撐柱、輪圈支撐機構、輪圈量測機構以及一對輻條校正機構。輪圈支撐機構包含輪圈容置槽、花鼓夾持單元以及輪圈夾持單元。輪圈測量機構包含偏擺感測單元以及跳動感測單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to a wheel rim correction system and a wheel rim correction method. The wheel rim correction system includes a first fixed plate, a support rod, a wheel rim support mechanism, a wheel rim measuring mechanism, and a pair of spoke correction mechanisms. The wheel support mechanism includes a wheel accommodating recess, a hub holding unit, and a wheel holding unit. The wheel detection mechanism includes a deflection sensing unit and a runout sensing unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:輪圈校正系統</p>
        <p type="p">100:輪圈支撐機構</p>
        <p type="p">101:第一固定板</p>
        <p type="p">103:支撐柱</p>
        <p type="p">105:支撐柱</p>
        <p type="p">110:輪圈容置槽</p>
        <p type="p">120:花鼓夾持單元</p>
        <p type="p">121:第一夾持部</p>
        <p type="p">130:輪圈夾持單元</p>
        <p type="p">131:第二夾持部</p>
        <p type="p">200:輪圈測量機構</p>
        <p type="p">210:偏擺感測單元</p>
        <p type="p">211:第一編碼器</p>
        <p type="p">220:跳動感測單元</p>
        <p type="p">221:輪圈接觸件</p>
        <p type="p">222:第二編碼器</p>
        <p type="p">300:輻條校正機構</p>
        <p type="p">410:控制面板</p>
        <p type="p">420:機電裝置</p>
        <p type="p">500:輪圈</p>
        <p type="p">510:花鼓</p>
        <p type="p">520:輪框</p>
        <p type="p">530:邊緣</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="741px" img-content="tif" inline="yes" orientation="portrait" width="965px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621926</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144025</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120241127B">B60W50/14</main-classification>
        <further-classification edition="202001120241127B">B60W30/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　崧峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMMY SONGFONG, WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　崧峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMMY SONGFONG, WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>追蹤警報系統、方法及其電腦程式產品</chinese-title>
        <english-title>TRACKING ALERT SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於安裝在車輛上的追蹤警報系統包含一監視模組、一里程表、一影像處理器、一警報處理器及一顯示儀表板。該影像處理器電耦合到該監視模組與該里程表。該警報處理器電耦合到該影像處理器。該顯示儀表板電耦合到該警報處理器。該監視模組可以捕捉該車輛後方的監視影像。該里程表可以決定該車輛運動時的距離數據。該影像處理器可以從多個監視影像中辨識一追蹤車輛，並將該車輛運動時的該距離數據與該追蹤車輛的該監控影像相關聯，從而產生行程影像。該警報處理器可以基於一閾值而產生一警報通知。該顯示儀表板可以顯示該警報通知給車輛駕駛。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tracking alert system for mounting on a vehicle includes a surveillance module, an odometer, an image processor, an alert processor, and a display dashboard. The image processor is electrically coupled to the surveillance module and the odometer. The alert processor is electrically coupled to the image processor. The display dashboard is electrically coupled to the alert processor. The surveillance module can capture surveillance images behind the vehicle. The odometer can determine distance data of the vehicle in motion. The image processor can identify a tracking vehicle from the surveillance images and associate the distance data of the vehicle in motion with the surveillance image of the tracking vehicle so as to generate a trip image. The alert processor can generate an alert notification based on a threshold value. The display dashboard can display the alert notification to the vehicle driver.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:監視模組</p>
        <p type="p">13:里程表</p>
        <p type="p">15:影像處理器</p>
        <p type="p">17:警報處理器</p>
        <p type="p">19:顯示儀表板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="752px" img-content="tif" inline="yes" orientation="portrait" width="740px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622002</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144031</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120241126B">C02F1/52</main-classification>
        <further-classification edition="202301120241126B">C02F1/68</further-classification>
        <further-classification edition="200601120241126B">B01J8/24</further-classification>
        <further-classification edition="200601120241126B">C01D3/06</further-classification>
        <further-classification edition="200601120241126B">C01F11/18</further-classification>
        <further-classification edition="200601120241126B">C01F5/24</further-classification>
        <further-classification edition="200601320241126B">C02F103/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬年清環境工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVER-CLEAR ENVIRONMENTAL ENG. CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YAO-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張楷洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KAI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUN-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英本</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>使用流體化床均質結晶技術處理鹵水以回收鈣和鎂成為偽白雲石顆粒之方法</chinese-title>
        <english-title>METHOD FOR TREATING BRINE USING FLUIDIZED BED HOMOGENEOUS CRYSTALLIZATION TECHNOLOGY FOR THE SIMULTANEOUS RECOVERY OF CALCIUM AND MAGNESIUM AS DOLOMITE-LIKE GRANULES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種使用流體化床均質結晶技術處理鹵水以回收鈣和鎂合成偽白雲石顆粒之方法。藉由控制出流水酸鹼值、碳酸根離子相對鈣和鎂離子的莫耳濃度比、水力滯留時間以及回流比等操作條件，可以在流化床均相結晶 (FBHC) 系統中高效地回收鹵水中的鈣和鎂以合成出高純度、高結晶性及低含水率的偽白雲石顆粒。該方法所獲得的處理效率與結晶顆粒純度高，具有高的利用潛力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for treating brine using fluidized bed homogeneous crystallization technology for the simultaneous recovery of calcium and magnesium as dolomite-like granules. By controlling operation conditions such as the effluent pH, the molar concentration ratio of carbonate ions to calcium and magnesium ions, hydraulic retention time and reflux ratio, calcium and magnesium in brine can be efficiently recovered in a fluidized-bed homogeneous crystallization (FBHC) system to synthesize dolomite-like granules with high purity, high crystallinity and low moisture content. This method has a very high application potential because of high treatment efficiency and crystal purity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:反應器</p>
        <p type="p">12:下段</p>
        <p type="p">14:上段</p>
        <p type="p">16:溶液進流口</p>
        <p type="p">18:藥劑進流口</p>
        <p type="p">20:出水口</p>
        <p type="p">22:回流管路</p>
        <p type="p">23:出水管</p>
        <p type="p">24:幫浦</p>
        <p type="p">25:沉澱池</p>
        <p type="p">26、28:幫浦</p>
        <p type="p">30:鹵水溶液</p>
        <p type="p">32:藥劑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="661px" img-content="tif" inline="yes" orientation="portrait" width="682px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621782</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144034</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B01D53/04</main-classification>
        <further-classification edition="200601120241230B">B01D53/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘博緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, BO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIA-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳志勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊勝仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>氣體捕捉裝置</chinese-title>
        <english-title>GAS CAPTURING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種氣體捕捉裝置，包括進氣管罩、出氣管罩、腔室、多個氣體吸附模組以及配氣機構。腔室連接在進氣管罩與出氣管罩之間。氣體吸附模組彼此層疊地設置在腔室內，氣流從進氣管罩進入腔室，行經氣體吸附模組，並以氣體吸附模組吸附氣流中的特定氣體後從腔室進入出氣管罩。配氣機構設置在進氣管罩與腔室之間。配氣機構包括兩個配氣盤，沿氣流的流向疊置在一起，各配氣盤具有多個開孔，且這些開孔沿氣流的流向而彼此錯位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas capturing device including an inlet pipe cover, a chamber, an outlet pipe cover, a plurality of gas absorption modules, and a gas distribution mechanism is provided. The chamber is connected between the inlet pipe cover and the outlet pipe cover, and the gas distribution mechanism is connected between the inlet pipe cover and the chamber. A gas flow enters the chamber from the inlet pipe cover by passing the gas distribution mechanism. After specific gas of the gas flow absorbed by the gas absorption modules, the gas flow enters the outlet pipe cover from the chamber. The gas distribution mechanism includes two gas distribution plates stacked together along a flow direction of the gas flow. Each gas distribution plates has a plurality holes, and the holes of the two gas distribution plates are offset from each other along the flow direction of the gas flow.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣體捕捉裝置</p>
        <p type="p">110:配氣機構</p>
        <p type="p">111、112:配氣盤</p>
        <p type="p">120:反應室</p>
        <p type="p">121:腔室</p>
        <p type="p">122:氣體吸附模組</p>
        <p type="p">131:進氣管</p>
        <p type="p">132:出氣管</p>
        <p type="p">133:進氣管罩</p>
        <p type="p">134:出氣管罩</p>
        <p type="p">F1、F2:氣流</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="704px" img-content="tif" inline="yes" orientation="portrait" width="1019px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623549</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144036</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10P70/00</main-classification>
        <further-classification edition="202601120260303B">H10W70/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國砂輪企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINIK COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝榮哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, JUNG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何嘉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIA-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井慎介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>複合基板及其製造方法</chinese-title>
        <english-title>COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合基板的製造方法，包含將切割產品級晶圓的餘料作為一殘餘層，其中殘餘層具有一第一接合面及一側面，側面連接於第一接合面的周緣，側面為不對稱的表面，以及將一接合層的一第二接合面接合於殘餘層的第一接合面，其中接合層為切割產品級晶圓的餘料，且殘餘層的材料及接合層的材料相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of composite substrate includes serving a remaining material produced from cutting a product-level wafer as a residual layer, where the residual layer has a first bonding surface and a side surface, the side surface is connected to a periphery of the first bonding surface, and the side surface is an asymmetrical surface; and bonding a second bonding surface of a bonding layer to the first bonding surface of the residual layer, where the bonding layer is a remaining material produced from cutting a product-level wafer, and the residual layer and the bonding layer are made of a same material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合基板</p>
        <p type="p">10:殘餘層</p>
        <p type="p">11:第一接合面</p>
        <p type="p">12:側面</p>
        <p type="p">20:接合層</p>
        <p type="p">21:第二接合面</p>
        <p type="p">22:側面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="314px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623402</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144037</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260303B">H10D48/042</main-classification>
        <further-classification edition="202601120260303B">H10P50/00</further-classification>
        <further-classification edition="201901120260303B">B32B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國砂輪企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINIK COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝榮哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, JUNG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何嘉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIA-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井慎介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>複合基板及其製造方法</chinese-title>
        <english-title>COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合基板的製造方法，包含提供一第一基層，其中第一基層為測試級晶圓且具有一第一接合面及一第一側面，且第一側面連接於第一接合面的周緣；提供一第二基層，其中第二基層的材料與第一基層的材料相同，第二基層具有一第二接合面及一第二側面，且第二側面連接於第二接合面的周緣；以及將第二基層的第二接合面接合於第一基層的第一接合面，而使第二基層的第二側面與第一基層的第一側面共同形成非平滑且非連續的表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of composite substrate includes providing a first layer, where the first layer is a dummy wafer and has a first bonding surface and a first side surface connected to a periphery of the first boding surface; providing a second layer, where the second layer and the first layer are made of a same material, the second layer has a second bonding surface and a second side surface connected to a periphery of the second boding surface; and bonding the second bonding surface of the second layer to the first bonding surface of the first layer, such that the second side surface of the second layer and the first side surface of the first layer together form a non-smooth and non-continuous surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合基板</p>
        <p type="p">10:第一基層</p>
        <p type="p">11:第一接合面</p>
        <p type="p">12:第一側面</p>
        <p type="p">20:第二基層</p>
        <p type="p">21:第二接合面</p>
        <p type="p">22:第二側面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="306px" img-content="tif" inline="yes" orientation="portrait" width="606px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623403</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144039</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260303B">H10D48/042</main-classification>
        <further-classification edition="202601120260303B">H10W70/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國砂輪企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINIK COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝榮哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, JUNG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何嘉哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIA-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>複合基板及其製造方法</chinese-title>
        <english-title>COMPOSITE SUBSTRATE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合基板的製造方法，包含將切割產品級晶圓的餘料作為一殘餘層，其中殘餘層具有一第一接合面及一側面，側面連接於第一接合面的周緣，側面為不對稱的表面；將一接合層的一第二接合面接合於殘餘層的第一接合面，其中接合層為晶棒，接合層的材料與殘餘層的材料相同；以及在接合層的第二接合面接合於殘餘層的第一接合面之後，對接合層進行裁切。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of composite substrate includes serving a remaining material produced from cutting a product-level wafer as a residual layer, where the residual layer has a first bonding surface and a side surface, the side surface is connected to a periphery of the first bonding surface, and the side surface is an asymmetrical surface; bonding a second bonding surface of a bonding layer to the first bonding surface of the residual layer, where the bonding layer is an ingot, and the bonding layer and the residual layer are made of a same material; and cutting the bonding layer after the second bonding surface of the bonding layer is bonded to the first bonding surface of the residual layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合基板</p>
        <p type="p">10:殘餘層</p>
        <p type="p">11:第一接合面</p>
        <p type="p">12:側面</p>
        <p type="p">20:接合層</p>
        <p type="p">21:第二接合面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="337px" img-content="tif" inline="yes" orientation="portrait" width="638px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623113</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144048</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241125B">H01R13/516</main-classification>
        <further-classification edition="201101120241125B">H01R13/6582</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江圳祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHUN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱依柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YI-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>連接器外殼</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器外殼，包含一外殼本體，以及一屏蔽件。該外殼本體具有多個壁、由該等壁界定的一插接通道，以及與該插接通道連通的一插口，該外殼本體的其中一該壁具有與該插接通道連通的一窗口，以及位於該窗口與該插口之間的至少一開孔。該屏蔽件設於該外殼本體的該壁，該屏蔽件包括設於該外殼本體內側的一第一彈片、設於該外殼本體外側的一第二彈片，以及連接在該第一彈片與該第二彈片之間並夾持在該外殼本體的該插口的邊緣上的一彎折部，該第一彈片具有位於自由端的至少一勾部，該至少一勾部從該壁的內壁面往外壁面穿過該窗口後向該外壁面彎折，且該至少一勾部的末端沒入在對應的該至少一開孔內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器外殼</p>
        <p type="p">1:外殼本體</p>
        <p type="p">11:頂壁</p>
        <p type="p">111:窗口</p>
        <p type="p">111a:凹入部</p>
        <p type="p">112:開孔</p>
        <p type="p">13:側壁</p>
        <p type="p">15:插接通道</p>
        <p type="p">16:插口</p>
        <p type="p">2:屏蔽件</p>
        <p type="p">21:第一彈片</p>
        <p type="p">211:第一彈性指部</p>
        <p type="p">212:連接部</p>
        <p type="p">213:勾部</p>
        <p type="p">214:末端</p>
        <p type="p">22:第二彈片</p>
        <p type="p">221:第二彈性指部</p>
        <p type="p">222:末端</p>
        <p type="p">23:彎折部</p>
        <p type="p">D1:前後方向</p>
        <p type="p">D2:上下方向</p>
        <p type="p">D3:左右方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="735px" img-content="tif" inline="yes" orientation="portrait" width="955px">
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          <date>115/06/01</date>
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          <doc-number>113144050</doc-number>
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        <main-classification edition="202401120241130B">A61F13/05</main-classification>
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                <last-name>中鎮醫療產品科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRONJEN MEDICAL TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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                <last-name>王仁賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, REN SHIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
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                <last-name>辜雅文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, YA-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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              <chinese-name name-type="organization">
                <last-name>陳思賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SZU HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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          </inventor>
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              <chinese-name name-type="organization">
                <last-name>劉彥萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>減壓護理墊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
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      <isu-abst lang="tw">
        <p type="p">一種減壓護理墊，包含一表層、一附著於該表層一側的彈性吸收層、一附著於該彈性吸收層相反於該表層的表面的黏膠層、一附著於該黏膠層相反於該表層方向的活性層、一形成於該活性層相反於該表層的表面的貼附層，及多個貫通該彈性吸收層、該黏膠層，及該活性層的貫孔。其中，該活性層包括一活性區，且至少部分的該活性區裸露於該貼附層外。本發明的減壓護理墊通過該等貫孔保持患者傷口良好的透氣性與透濕性，並利用該彈性吸收層進行傷口減壓並吸收患者傷口滲液，達成減少患處皮膚損傷、保持傷口處乾燥透氣的功效，為傷口提供良好的修復環境。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
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        <p type="p">2:表層</p>
        <p type="p">3:彈性吸收層</p>
        <p type="p">4:黏膠層</p>
        <p type="p">5:活性層</p>
        <p type="p">6:貼附層</p>
        <p type="p">7:貫孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="475px" img-content="tif" inline="yes" orientation="portrait" width="657px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <isuno>11</isuno>
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        <document-id>
          <doc-number>202622927</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>113144065</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
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        <main-classification edition="200601120250121B">G09B23/28</main-classification>
        <further-classification edition="200601120250121B">G09B19/00</further-classification>
        <further-classification edition="200601120250121B">A61N1/39</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>斯博特運休行銷有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIBAUD SPORTS AND LEISURE MARKETING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
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              <chinese-name name-type="organization">
                <last-name>劉晏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>張詞翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TZU HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>劉俊斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHUN PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>劉擎楷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHING KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
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      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>ＡＥＤ訓練貼片構造</chinese-title>
        <english-title>AED TRAINING PAD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本發明係關於一種AED訓練貼片構造，包含一固定座；一貼片部，係結合於該固定座，該貼片部的兩表面分別形成有一貼合面及一外表面，該貼合面上設有至少一個以上呈內凹狀的吸盤，藉以增加該貼合面的吸附力。藉由貼片部的貼合面上設有吸盤，可以增加貼合面的吸附力，使得該貼片部即使是經過使用多次之後，該貼合面上之黏性逐漸的衰減或失效，或者是假人身上佈滿了灰塵，仍然可以藉由該等吸盤的吸力作用，使該貼片部能夠牢固的吸附於假人身上，以供進行模擬操作AED訓練器之訓練，藉以增加其使用壽命。</p>
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        <p type="p">
        </p>
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        <p type="p">1:固定座</p>
        <p type="p">11:殼體</p>
        <p type="p">12:導線件</p>
        <p type="p">13:蓋板</p>
        <p type="p">2:貼片部</p>
        <p type="p">22:貼合面</p>
        <p type="p">24:吸盤</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="701px" img-content="tif" inline="yes" orientation="portrait" width="988px">
          </img>
        </representative>
      </representative-img>
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      <volno>24</volno>
      <isuno>11</isuno>
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          <doc-number>202623686</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>113144067</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
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        <main-classification edition="202601120260303B">H10W74/00</main-classification>
        <further-classification edition="202601120260303B">H10W76/13</further-classification>
        <further-classification edition="202601120260303B">H10W74/01</further-classification>
        <further-classification edition="202601120260303B">H10W72/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華東科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTON ADVANCED ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>于鴻祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HONG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古瑞庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, RUEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具雙面重佈線層的晶片封裝單元及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具雙面重佈線層的晶片封裝單元及其製造方法，該晶片封裝單元是由晶圓上進行切割作業所形成，該晶片封裝單元包含晶片、第一重佈線層、第二重佈線層及至少一側面連結線路；其中該晶片是依序經由該晶片的多個晶墊、各該第一導接線路、各該側面連結線路及各該第二導接線路而與各該第二導接線路上的多個對外連結體電性連結，再經由各該對外連結體對外電性連結，透過重佈線層技藝解決現有的晶圓的線路層設計相對複雜化的問題，並降低結構厚度而滿足產品追求輕薄短小趨勢，且避免在結構上使用矽穿孔技藝，有助於製造端降低製造成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶片封裝單元</p>
        <p type="p">1a:側面</p>
        <p type="p">10:晶片</p>
        <p type="p">11:第一表面</p>
        <p type="p">12:第二表面</p>
        <p type="p">13:晶墊</p>
        <p type="p">14:側面</p>
        <p type="p">20:第一重佈線層</p>
        <p type="p">21:第一介電層</p>
        <p type="p">22:第一導接線路</p>
        <p type="p">30:第二重佈線層</p>
        <p type="p">31:第二介電層</p>
        <p type="p">32:第二導接線路</p>
        <p type="p">33:對外連結體</p>
        <p type="p">40:側面連結線路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="398px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622309</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144069</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120250324B">D01F11/02</main-classification>
        <further-classification edition="200601120250324B">D01F9/17</further-classification>
        <further-classification edition="202101120250324B">D03D15/217</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚泰環保材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACEGREEN ECO-MATERIAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周文東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周紹華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉哲源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳忠信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具天然纖維素紗線</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具天然纖維素紗線包含一天然纖維素，該天然纖維素包含一長纖維素及一短纖維素，該長纖維素的含量以重量計佔該具天然纖維素紗線的總含量至少為20wt%，該短纖維素的含量以重量計佔該具天然纖維素紗線的總含量介於0wt%~80wt%，該具天然纖維素紗線在XRD繞射中2θ包含20°±3°、30°±3°及42.5°±3°的繞射峰，藉以該具天然纖維素紗線藉由限定XRD繞射圖譜的繞射峰，據以規範該天然纖維素的種類及來源，讓該具天然纖維素紗線維持高品質延伸率及強度的紡絲良率，增加該具天然纖維素紗線的紡絲穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="702px" img-content="tif" inline="yes" orientation="portrait" width="864px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623231</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144072</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L41/50</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡維軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, WEI XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林啟文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHI WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祐誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>結合多前端框架之平台建構系統、方法及其電腦可讀媒介</chinese-title>
        <english-title>PLATFORM CONSTRUCTION SYSTEM INTEGRATING MULTIPLE FRONT-END FRAMEWORKS, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種結合多前端框架之平台建構系統及其方法，先將各子系統模組化以打包成獨立的資料束，接著，進行入口主框架建置，以供各該子系統能動態載入，之後，執行入口主框架的系統配置並將各該子系統引入，透過監聽模組之間的事件和消息，以實現模組之間的通訊和協作，進而完成平台建構，因此，本發明讓子系統具備獨立性與可重用性，避免習知技術中應用常受限於單一框架的限制。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a platform construction system integrating multiple front-end frameworks. First, each subsystem is modularized and packaged into independent bundles. Then, an entrance main frame is constructed so that each subsystem can be dynamically imported. The system configuration of the entrance main frame is executed and each subsystem is imported. By monitoring events and messages between modules, communication and collaboration between modules are realized, and the platform construction is completed. Therefore, the present invention enables subsystems to be independent and reusable, and avoids the limitations of a single framework in conventional technologies. The present invention also provides a computer-readable medium for executing the method of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:結合多前端框架之平台建構系統</p>
        <p type="p">11:子系統模組化單元</p>
        <p type="p">12:入口主框架建置單元</p>
        <p type="p">13:入口主框架配置單元</p>
        <p type="p">14:引用子系統單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="524px" img-content="tif" inline="yes" orientation="portrait" width="792px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622896</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144073</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250303B">G06T15/00</main-classification>
        <further-classification edition="200601120250303B">G06T1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭智升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊子文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TZU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>決定渲染模式之控制系統、方法及其電腦可讀媒介</chinese-title>
        <english-title>CONTROL SYSTEM FOR DECIDING RENDERING MODES, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種決定渲染模式之控制系統及其方法，提供一支援元宇宙展演活動與虛擬場景編輯的內容管理系統以及一利用歷史測試資訊訓練出的人工智慧(AI)渲染模式決策模型，內容管理系統能設定場景渲染模式是以設定為主或由AI模型推論，以於未指定或是指定人工智慧決策渲染模式，利用人工智慧渲染模式決策模型對取得的一些即時資訊進行渲染模式選擇，之後，可由近端或遠端執行顯示圖層之切換和布局，最終渲染結果內容將於使用者終端裝置上呈現。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a control system for deciding rendering modes and a method thereof. A content management system that supports metaverse performance activities and virtual scene editing and an AI rendering mode decision model trained using historical test information are provided. The content management system can set the scene rendering mode to be based on settings or inferred from the AI model, so that when the scene rendering mode is unspecified or the AI rendering mode decision model is specified, the AI rendering mode decision model is used to perform choice of rendering mode based on some real-time information. Afterwards, the switching and layout of display layers can be performed from the near end or the remote end, and a final rendering result content will be presented on the user terminal device. The present invention also provides a computer-readable medium for executing the method of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:決定渲染模式之控制系統</p>
        <p type="p">11:使用者終端裝置</p>
        <p type="p">111:終端元宇宙應用模組</p>
        <p type="p">12:遠端伺服器裝置</p>
        <p type="p">121:遠端元宇宙應用模組</p>
        <p type="p">2:網路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="506px" img-content="tif" inline="yes" orientation="portrait" width="854px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622775</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144074</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250629B">G06F16/9535</main-classification>
        <further-classification edition="201901120250629B">G06F16/9536</further-classification>
        <further-classification edition="200601120250629B">G06F3/01</further-classification>
        <further-classification edition="201901120250629B">G16B40/00</further-classification>
        <further-classification edition="202001320250629B">G06F111/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉佩琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PEI CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡慶堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TASI, CHING TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張峯偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FENG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於知識圖譜之個人化搜尋系統、方法及其電腦程式產品</chinese-title>
        <english-title>SYSTEM AND METHOD FOR PERSONALIZED SEARCH BASED ON KNOWLEDGE GRAPH AND COMPUTER PROGRAM PRODUCT THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種基於知識圖譜之個人化搜尋系統、方法及其電腦程式產品。根據用戶輸入的查詢詞產生關鍵字搜尋計畫及向量搜尋計畫，進而計算出各個影片的關鍵字相似度分數及語意相似度分數，另將用戶觀看行為資料及影視輔助資料轉換為用戶影視知識圖譜，以利用基於知識圖譜的協同式過濾方法對該用戶影視知識圖譜進行處理，產生各個影片的用戶興趣分數，最後根據各個影片的關鍵字相似度分數、語意相似度分數、及用戶興趣分數產生用戶個人化影片清單。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for personalized search based on knowledge graph and a computer program product thereof are provided. Based on a query term inputted by a user, a keyword query strategy and a vector search strategy are generated to calculate a keyword similarity score and a semantic similarity score of each video. A user viewing behavior data and a video auxiliary data are transformed into a user video knowledge graph, which is processed by a knowledge graph-based synergistic filtering method, to generate a user interest score of each video. Finally, a list of user-personalized videos is generated based on the keyword similarity score, the semantic similarity score, and the user interest score of each video.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S21~S25:步驟</p>
        <p type="p">S31~S33:步驟</p>
        <p type="p">S41~S42:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="646px" img-content="tif" inline="yes" orientation="portrait" width="943px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623233</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144075</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250401B">H04L43/08</main-classification>
        <further-classification edition="202201120250401B">H04L43/0876</further-classification>
        <further-classification edition="202201120250401B">H04L43/091</further-classification>
        <further-classification edition="200601120250401B">G06F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林旻弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MIN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊荏晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李浩銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHAUR-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於服務日誌追蹤服務間運作鏈路之系統、方法及電腦可讀媒介</chinese-title>
        <english-title>SYSTEM, METHOD AND COMPUTER READABLE MEDIUM FOR TRACKING OPERATIONAL LINK BETWEEN SERVICES BASED ON SERVICE LOGS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種基於服務日誌追蹤服務間運作鏈路之系統、方法及電腦可讀媒介，係由識別碼產生模組對使用者端於資訊系統中之操作動作產生唯一追蹤識別碼，再將唯一追蹤識別碼於資訊系統之複數服務之間傳遞，以串連操作動作所經過之複數服務，俾由服務日誌收集管理模組收集唯一追蹤識別碼所串連之複數服務之服務日誌。再者，由運作鏈路追蹤整合模組依照複數服務之服務日誌之時間順序，以排列出操作動作之運作鏈路，再利用操作動作之運作鏈路計算出複數服務之每筆服務日誌之間隔時間，俾依據複數服務之每筆服務日誌之間隔時間追蹤或分析出資訊系統或複數服務之異常發生點或效能瓶頸點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a system, method and computer readable medium for tracking operational link between services based on service logs. An identification code generation module generates a unique tracking identification code for a user's operation action in an information system, and then transmits the unique tracking identification code between multiple services in the information system to connect the multiple services that the operation action pass through, and further a service log collection management module collects service logs of the multiple services linked by the unique tracking identification code. Next, an operation link tracking integration module arranges an operation link of the operation action according to a time sequence of each service log of the multiple services, and then uses the operation link of the operation action to calculate an interval time between each service log of the multiple services, in order to track or analyze an abnormal occurrence point or a performance bottleneck point of the information system or the multiple services according to the interval time between the each service log of the multiple services.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基於服務日誌追蹤服務間運作鏈路之系統</p>
        <p type="p">10:識別碼產生模組</p>
        <p type="p">20:服務日誌收集管理模組</p>
        <p type="p">30:歷史操作動作記錄模組</p>
        <p type="p">40:即時操作動作記錄追蹤模組</p>
        <p type="p">50:運作鏈路追蹤整合模組</p>
        <p type="p">60:鏈路追蹤可視化模組</p>
        <p type="p">A:使用者端</p>
        <p type="p">B:操作動作</p>
        <p type="p">C:唯一追蹤識別碼</p>
        <p type="p">D:資訊系統</p>
        <p type="p">E,E1,E2,E3,En:服務</p>
        <p type="p">F:服務日誌</p>
        <p type="p">G:運作鏈路</p>
        <p type="p">H:關聯圖</p>
        <p type="p">K:管理者端</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="824px" img-content="tif" inline="yes" orientation="portrait" width="666px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622248</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144086</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250501B">C12Q1/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百衛生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOGUARD CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周于楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>藥物敏感性測試之試劑盤片結構及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種藥物敏感性測試之試劑盤片結構及其方法，結構包括有一測試載體、至少二支撐限位部、一中央注入部、複數微流道、複數反應槽、複數AST專用之預置試劑、複數溢流槽道、複數溢流槽、複數漸縮部、及複數排氣孔。測試載體封裝前反應槽內已預先置入冷凍乾燥後之預置試劑，使用者於中央注入部加入檢體後，即可直接將測試載體設置於測試裝置中，啟動時檢體受離心力作用由微流道均勻流入反應槽中，若反應槽中檢體之含量大於其容積，就會順著溢流槽道的漸縮部流入溢流槽中，且反應中產生之氣體會從排氣孔排出。藉此，可簡化測試的前置步驟、均勻且適量的分配檢體，避免檢體交互感染、避免過量氣體崩壞載體而受汙染。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:測試載體</p>
        <p type="p">11:下盤片</p>
        <p type="p">111:定位部</p>
        <p type="p">112:支撐限位部</p>
        <p type="p">12:上盤片</p>
        <p type="p">2:中央注入部</p>
        <p type="p">21:檢體暫放區</p>
        <p type="p">22:注入口</p>
        <p type="p">3:微流道</p>
        <p type="p">4:反應槽</p>
        <p type="p">41:預置試劑</p>
        <p type="p">5:溢流槽道</p>
        <p type="p">51:漸縮部</p>
        <p type="p">6:溢流槽</p>
        <p type="p">7:排氣孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="684px" img-content="tif" inline="yes" orientation="portrait" width="964px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622481</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144087</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250121B">G01N21/25</main-classification>
        <further-classification edition="200601120250121B">G01N21/78</further-classification>
        <further-classification edition="200601120250121B">G01N33/569</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百衛生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOGUARD CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周于楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>藥物敏感性測試之裝置及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種藥物敏感性測試之裝置及其方法，主要於測試裝置啟動測試前，利用生長辨識光源照射培養元件，並由光源檢測模組接收照射後從原始檢體之數量取得的生長訊息，以判斷是否培養完成，而後稀釋檢體加入至試劑盤片之反應槽中，並將整體置入檢測設置槽中啟動測試，反應後以波長相異的第一、第二檢測光源先後照射同一反應槽，最後由光譜處理模組轉換從AST專用指示劑取得之顏色訊息為波長訊息，而得出檢測結果。藉此，以簡單快速的方式準確判斷檢體的生長狀況及檢測結果，且檢測結果係由兩道檢測光源及光譜處理模組分析，不但免於人工判讀，也可經由交叉比對取得更精準之結果。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:測試裝置</p>
        <p type="p">11:檢測設置槽</p>
        <p type="p">12:隔板件</p>
        <p type="p">13:蓋體</p>
        <p type="p">2:試劑盤片</p>
        <p type="p">3:培養元件</p>
        <p type="p">4:生長辨識光源</p>
        <p type="p">41:光源檢測模組</p>
        <p type="p">51:第一檢測光源</p>
        <p type="p">52:第二檢測光源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="955px" img-content="tif" inline="yes" orientation="portrait" width="677px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621897</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144088</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241205B">B32B18/00</main-classification>
        <further-classification edition="200601120241205B">B32B3/12</further-classification>
        <further-classification edition="200601120241205B">B32B5/32</further-classification>
        <further-classification edition="200601120241205B">C04B38/00</further-classification>
        <further-classification edition="200601120241205B">C12N5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏崧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-SUNGMR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏崧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-SUNGMR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>陶瓷載體之結構及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為涉及一種陶瓷載體之結構及其方法，主要包括一第一陶瓷本體、複數第一縱向部、複數第一橫向部、一第一孔洞部、至少一第二陶瓷本體、複數第二縱向部、複數第二橫向部、及一第二孔洞部，其中先於繪圖軟體上繪製陶瓷載體模型，而後再利用3D列印機搭配氧化鋯或氧化鋁的材質列印出多個彼此堆疊設置的第一、第二陶瓷本體，當列印完成後即可將第一、第二陶瓷本體進行高溫燒結成型，又當燒結完畢後再進行恆溫靜置一段時間，最後經過品質檢驗後即完成本案用於培育細胞的第一、第二陶瓷本體，藉此本案利用堆疊設置方式，使得在同等面積內，細胞得以向上發展，且表面積得以更大，有效增加細胞存活機率。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:第一陶瓷本體</p>
        <p type="p">11-:第一縱向部</p>
        <p type="p">12:第一橫向部</p>
        <p type="p">13:第一孔洞部</p>
        <p type="p">1-4:曲面部</p>
        <p type="p">2:第二陶瓷本體</p>
        <p type="p">21:第二縱向部</p>
        <p type="p">22:第二橫向部</p>
        <p type="p">23:第二孔洞部</p>
        <p type="p">24:曲面部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="1010px" img-content="tif" inline="yes" orientation="portrait" width="632px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621963</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144091</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250228B">B65G1/06</main-classification>
        <further-classification edition="200601120250228B">B65G1/04</further-classification>
        <further-classification edition="200601120250228B">B65G1/12</further-classification>
        <further-classification edition="200601120250228B">B65G1/137</further-classification>
        <further-classification edition="200601120250228B">B65G35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高僑自動化科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERA AUTOTECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李義隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>線邊倉結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種線邊倉結構，其包含有一輸送裝置、一線邊倉架與一平移裝置，其中，輸送裝置頂部具有一滑動座，滑動座的四個角落各設有一輸送柱，各輸送柱設有一升降平台，輸送柱透過馬達轉動一螺桿，升降平台與螺桿組合而可沿輸送柱縱向滑移，升降平台上設有一氣浮裝置與一夾制限位機構，夾制限位機構前端設有一夾角垂直之夾制部，夾制限位機構可朝輸送裝置的中央移動，線邊倉架包含一倉架本體，倉架本體兩側對稱設有數不同高度之放置架，升降平台可縱向移動，平移裝置拉動滑動座以水平橫向移動輸送裝置的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):輸送裝置</p>
        <p type="p">(101):輪體</p>
        <p type="p">(102):連座軸承</p>
        <p type="p">(11):滑動座</p>
        <p type="p">(12):輸送柱</p>
        <p type="p">(13):升降平台</p>
        <p type="p">(14):氣浮裝置</p>
        <p type="p">(15):夾制限位機構</p>
        <p type="p">(16):夾制部</p>
        <p type="p">(20):線邊倉架</p>
        <p type="p">(21):倉架本體</p>
        <p type="p">(211):放置架</p>
        <p type="p">(30):平移裝置</p>
        <p type="p">(31):傳動裝置</p>
        <p type="p">(311):皮帶輪</p>
        <p type="p">(32):傳動元件</p>
        <p type="p">(40):物料</p>
        <p type="p">(50):載具</p>
        <p type="p">(60):導輪座</p>
        <p type="p">(61):導輪</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="868px" img-content="tif" inline="yes" orientation="portrait" width="749px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621938</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144092</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250324B">B62M3/08</main-classification>
        <further-classification edition="202001120250324B">B62J25/00</further-classification>
        <further-classification edition="200601120250324B">F16C3/02</further-classification>
        <further-classification edition="200601120250324B">F16C19/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>源清科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃河源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自行車踏板結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自行車踏板結構，其包含有一軸桿與一踏板，其中，軸桿具有一軸桿本體，軸桿本體的外表由前而後階梯式漸縮有數不同直徑的外緣，踏板中心開設有一軸孔，軸孔由前而後因孔徑不同而分為數不同孔徑的孔部，軸桿本體套有一第一軸承及一第二軸承與軸孔之間呈緊配合關係，軸桿本體套有一內擋塊與軸孔之間呈鬆配合關係，軸桿本體鎖固有一外擋塊與軸孔之間呈鬆配合關係，當第一軸承及第二軸承毀損時，藉由所述軸孔孔徑不同產生的結構，踏板移動時被內擋塊或外擋塊阻擋防止踏板脫離軸桿而保持安全。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):軸桿</p>
        <p type="p">(11):軸桿本體</p>
        <p type="p">(111):第一外緣</p>
        <p type="p">(112):第二外緣</p>
        <p type="p">(113):第三外緣</p>
        <p type="p">(114):第四外緣</p>
        <p type="p">(115):第五外緣</p>
        <p type="p">(116):第六外緣</p>
        <p type="p">(12):第一軸承</p>
        <p type="p">(13):第二軸承</p>
        <p type="p">(14):內擋塊</p>
        <p type="p">(141):第一凸緣</p>
        <p type="p">(15):外擋塊</p>
        <p type="p">(151):第二凸緣</p>
        <p type="p">(152):穿孔</p>
        <p type="p">(16):螺固件</p>
        <p type="p">(20):踏板</p>
        <p type="p">(21):軸孔</p>
        <p type="p">(211):第一孔部</p>
        <p type="p">(212):第二孔部</p>
        <p type="p">(213):第三孔部</p>
        <p type="p">(214):第四孔部</p>
        <p type="p">(215):第五孔部</p>
        <p type="p">(216):第六孔部</p>
        <p type="p">(217):第七孔部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="735px" img-content="tif" inline="yes" orientation="portrait" width="1000px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621851</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144097</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120241230B">B24B53/017</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋健民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋健民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種硬焊鑽石及化學機械平坦化的拋光墊修整器的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種硬焊鑽石的方法，將多個粒徑大於200 μm的鑽石顆粒的一頂端朝下地落於一第一陶瓷模板的一平面，該鑽石顆粒的一突出高度係由形成於一第二陶瓷模板的多個貫孔的深度控制，然後在該第二陶瓷模板的一背面熔化一金屬焊料，使該金屬焊料以碳化金屬的化學鍵附著該鑽石顆粒，其中，該些鑽石顆粒在硬焊時以該第一陶瓷模板的該平面作為一共平面而齊平。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:鑽石磨料</p>
        <p type="p">31:頂端</p>
        <p type="p">32:底端</p>
        <p type="p">34:突出高度</p>
        <p type="p">40:焊料</p>
        <p type="p">50:小基板</p>
        <p type="p">60:修整單元</p>
        <p type="p">I:方位</p>
        <p type="p">Ⅱ:方位</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="418px" img-content="tif" inline="yes" orientation="portrait" width="735px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621841</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144098</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250107B">B24B1/04</main-classification>
        <further-classification edition="200601120250107B">B24B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋健民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋健民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>以切代磨的磨輪</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以切代磨的磨輪，包括：一基座以及至少十個以上的鑽石切削單元，該鑽石切削單元設置於該基座的一外環部分，且沿著該基座的一圓周方向排列，各個該鑽石切削單元包括兩個以上的鑽石刀片，該鑽石刀片沿著該基座的該圓周方向排列，且沿著該基座的徑向延伸，其中，在各個該鑽石切削單元中，該鑽石刀片的最高頂點的差異不超過100微米。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">13:基面</p>
        <p type="p">20:鑽石切削單元</p>
        <p type="p">21:鑽石刀片</p>
        <p type="p">21a:第一刀片</p>
        <p type="p">21b:第二刀片</p>
        <p type="p">21c:第三刀片</p>
        <p type="p">21d:第四刀片</p>
        <p type="p">211:刀片本體</p>
        <p type="p">211a:頂端</p>
        <p type="p">212:切削層</p>
        <p type="p">213:稜線部份</p>
        <p type="p">2131:倒角</p>
        <p type="p">2132:逃屑角</p>
        <p type="p">t:厚度</p>
        <p type="p">w:寬度</p>
        <p type="p">d:深度</p>
        <p type="p">t1:厚度</p>
        <p type="p">θ1:切刃角度</p>
        <p type="p">θ2:角度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="902px" img-content="tif" inline="yes" orientation="portrait" width="667px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621955</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144099</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241130B">B65D41/32</main-classification>
        <further-classification edition="200601120241130B">B65D55/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉雲龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉雲龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>易撕裂包裝袋結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種易撕裂包裝袋結構，其包含有一包裝袋，其中，所述包裝袋具有一密封袋體，該密封袋體外側具有一密封邊且其內具有一容置空間，所述密封邊封閉該容置空間，以所述容置空間可置入一內容物，一裁切裝置具有數水平且細小之裁刀，該裁切裝置下壓以所述裁刀裁切該密封邊形成相互對稱之二撕取部，所述撕取部是由該裁刀切除所述密封邊形成複數之撕取縫組成，部分之該撕取縫與所述密封邊的邊緣相通，以所述撕取縫破壞該密封邊部分結構而能夠沿所述撕取部撕開該密封袋體，令所述容置空間開放以取出該內容物。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):包裝袋</p>
        <p type="p">(11):密封袋體</p>
        <p type="p">(111):密封邊</p>
        <p type="p">(112):容置空間</p>
        <p type="p">(12):撕取部</p>
        <p type="p">(121):撕取縫</p>
        <p type="p">(20):內容物</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="672px" img-content="tif" inline="yes" orientation="portrait" width="561px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621638</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144105</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">A61B5/107</main-classification>
        <further-classification edition="200601120241204B">G06T17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人國家實驗研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL APPLIED RESEARCH LABORATORIES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭嘉真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIA-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳怡霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JASMINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳毅成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, I-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>全視角高速足部掃描器</chinese-title>
        <english-title>FULL VIEW HIGH SPEED FOOT SCANNER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種全視角高速足部掃描器，包括掃描座體、透明板、第一反射鏡、第二反射鏡以及深度相機。透明板覆蓋掃描座體的頂部，透明板設置足部放置區。第一反射鏡及第二反射鏡設置於掃描座體內，第一反射鏡的第一反射表面朝向透明板，第二反射鏡的第二反射表面朝向透明板，第一反射表面與第二反射表面具有設置角度，與透明板形成反射空間。深度相機設置於與透明板距離預設高度的位置，深度相機朝向足部放置區及反射空間以拍攝待測足部的足部影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A full view high speed foot scanner is disclosed, which includes a scanner base, a transparent plate, a first reflecting mirror, a second reflecting mirror and a depth camera. The transparent plate covers the top of the scanner base, and the transparent plate has a foot placement area. The first reflecting mirror and the second reflecting mirror are disposed in the scanner base. The first reflecting mirror has a first reflecting surface facing the transparent plate. The second reflecting mirror has a second reflecting surface facing the transparent plate. The first reflecting surface and the second reflecting surface are arranged with an angle for forming a reflection space with the transparent plate. The depth camera is disposed at a preset height away from the transparent plate, and faces the foot placement area and reflection space to capture foot images of the foot to be tested.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:全視角高速足部掃描器</p>
        <p type="p">11:掃描座體</p>
        <p type="p">12:透明板</p>
        <p type="p">13:第一反射鏡</p>
        <p type="p">14:第二反射鏡</p>
        <p type="p">15:深度相機</p>
        <p type="p">50:待測足部</p>
        <p type="p">111:容置空間</p>
        <p type="p">131:第一反射表面</p>
        <p type="p">132:反射空間</p>
        <p type="p">141:第二反射表面</p>
        <p type="p">151:相機架</p>
        <p type="p">152,153:拍攝範圍</p>
        <p type="p">A:設置角度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="681px" img-content="tif" inline="yes" orientation="portrait" width="756px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622410</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144106</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250218B">F16L37/086</main-classification>
        <further-classification edition="200601120250218B">F16L37/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳必琪國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JPC CONNECTIVITY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張旭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YU CHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>快速接頭</chinese-title>
        <english-title>QUICK CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種快速接頭用於輸送液體，快速接頭包含母接頭。母接頭包含前殼體、活塞套、活塞結構及第一彈簧。活塞套設置於前殼體的第一空間中，具有多個滑塊結構容置於前殼體的滑軌中，使活塞套能在第一空間中滑動。活塞結構包含依序連接之活塞座、活塞桿及活塞頭。活塞座設置於前殼體於第一空間朝外之開口處，活塞頭設置於活塞套之通孔中。第一彈簧設置於第一空間中並且兩側分別抵頂活塞套及活塞座。相較於習知技術，本發明之快速接頭，其中活塞套的滑塊結構與前殼體的滑軌提供活塞套一個穩定的軌道，有效防止活塞套傾斜或翻轉，進而避免漏液問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A quick connector for transporting liquid includes a female connector. The female connector includes a socket up-housing, a piston  cover, a piston structure, and a first spring. The piston cover is arranged in a first space of the socket up-housing and has sliders placed within the slide rail of the socket up-housing for allowing the piston cover to slide within the first space. The piston structure includes piston base, a piston rod, and a piston head. The piston base is arranged at the opening of the first space. The piston head is arranged within the through hole of the piston cover. The first spring is arranged in the first space, with its two ends respectively pressing against the piston cover and the piston base. Compared with the prior art, the quick connector provides a stable rail through the sliders and the slide rail to prevent the piston cover from tilting or inversion, thereby avoiding leakage issues.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:快速接頭</p>
        <p type="p">11:母接頭</p>
        <p type="p">111:前殼體</p>
        <p type="p">1112:第二空間</p>
        <p type="p">112:活塞套</p>
        <p type="p">1137:活塞頭</p>
        <p type="p">12:公接頭</p>
        <p type="p">124:第二活塞</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="511px" img-content="tif" inline="yes" orientation="portrait" width="975px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621748</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144112</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250214B">A61L9/03</main-classification>
        <further-classification edition="200601120250214B">F23D3/16</further-classification>
        <further-classification edition="200601120250214B">F23D5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛烙達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRO-IRODA INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊正男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHENG NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可防溢出的燃料槽</chinese-title>
        <english-title>SPILL-PROOF FUEL TANK</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明可防溢出的燃料槽包括有一個槽體，槽體設置有一個底板，槽體於底板沿垂直方向的上部設置有一個隔板，槽體的內部空間以隔板分隔形成一個填倒區及一個緩衝區，隔板設置有一個窄口，窄口鄰近底板且連通填倒區與緩衝區，燃料槽透過上述結構能夠避免倒入過多燃料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A spill-proof fuel tank of the present invention includes a tank body. The tank body is provided with a bottom plate, and a partition is provided in a upper portion of the tank body along a vertical direction of the bottom plate. An internal space of the tank body is divided by the partition into a filling area and a buffer area. The partition is provided with a narrow opening, which is located near the bottom plate and connects the filling area and the buffer area. This structure allows the fuel tank to prevent overfilling of fuel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:燃料槽</p>
        <p type="p">20:槽體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="712px" img-content="tif" inline="yes" orientation="portrait" width="956px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621800</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144115</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B05C21/00</main-classification>
        <further-classification edition="200601120241230B">B05C11/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周恬如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, TIEN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周恬如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, TIEN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>噴霧散熱的液體回收結構</chinese-title>
        <english-title>LIQUID RECOVERY STRUCTURE FOR SPRAY HEAT DISSIPATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種噴霧散熱的液體回收結構，散熱板的散熱面設有多個流向導引槽以及液體回收槽，當蓋體覆蓋且密合於散熱板時，蓋體與散熱板形成噴灑空間，蓋體向噴灑空間設有多個噴頭，每一個噴頭的噴灑軸線與蓋體的法線形成偏轉角，每一個噴頭的偏轉方向朝向液體回收槽的方向正向偏轉或是斜向偏轉，藉此可以達成提供噴灑冷卻液流動動量使冷卻液以同一方向流動，避免無序流動，以回收冷卻液避免積液導致散熱效率下降的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid retrieving structure for spray cooling is provided. Multiple flow-guiding grooves and liquid recovery grooves are set on a heat dissipation surface of a heat sink. A spray space is designed between a cover and the heat sink when the cover is covered and tightly fitted to the heat sink. Multiple nozzles are set on the cover, and inject liquid into the spray space. Axis of each nozzle forms an angle with normal direction of the heat sink. This angle of each nozzle is forward or diagonal towards the liquid recovery groove. Therefore, it becomes easier to retrieve the coolant, and avoid liquid accumulation leading to a decrease in heat dissipation efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:散熱板</p>
        <p type="p">131:回收區域</p>
        <p type="p">20:蓋體</p>
        <p type="p">30:噴灑空間</p>
        <p type="p">40:噴頭</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="891px" img-content="tif" inline="yes" orientation="portrait" width="789px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621763</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144120</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A63B23/02</main-classification>
        <further-classification edition="200601120241230B">A63B24/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智能動感有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DYNAMIC INTELLIGENCES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張博光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, PO KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳躍仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUEH JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李珩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>仰臥捲腹之計次系統及方法</chinese-title>
        <english-title>CURL-UP COUNTING SYSTEM AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明中仰臥捲腹之計次方法適用於具有手指軌跡追蹤模組的檢測墊體，受測者仰躺於該檢測墊體上，利用手指軌跡追蹤模組偵測受測者雙手至少一指尖於一預設時段由起始位置移動至終止位置之運動軌跡，以計算運動軌跡之移動距離及移動方向，判斷運動軌跡之移動距離是否等於或大於一預定距離，若是，則自動判定完成完整仰臥捲腹即計數一次，本發明利用系統自動判斷仰臥捲腹之精確性，並完成自動計次，以改良習有人為判斷可能發生誤判之缺失。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The curl-up counting method herein is suitable for use with a detection mat equipped with a finger trajectory tracking module. The test subject lies supine on the detection mat, and the finger trajectory tracking module detects the motion path of at least one fingertip as it moves from a starting position to an ending position within a predetermined time interval, thereby obtaining the movement distance and direction of the motion trajectory. The method then determines if the movement distance equals to or exceeds a predetermined distance. If so, it automatically records one complete curl-up. The invention involves utilizing a system to automatically assess the accuracy of each curl-up and perform automatic counting, thereby addressing the problem for misjudgment that can occur with manual assessment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">L:長邊方向</p>
        <p type="p">10:檢測墊體</p>
        <p type="p">20:手指軌跡追蹤模組</p>
        <p type="p">21:起始位置</p>
        <p type="p">22:終點位置</p>
        <p type="p">30:判定主機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="823px" img-content="tif" inline="yes" orientation="portrait" width="808px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621718</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144134</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K36/65</main-classification>
        <further-classification edition="200601120250501B">A61K36/484</further-classification>
        <further-classification edition="200601120250501B">A61K36/28</further-classification>
        <further-classification edition="200601120250501B">A61K36/74</further-classification>
        <further-classification edition="200601120250501B">A61K36/8998</further-classification>
        <further-classification edition="200601120250501B">A61K36/47</further-classification>
        <further-classification edition="200601120250501B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐再靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾博修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>中藥組成物用於製備抑制或減少乳癌細胞之抗癌藥物的用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於抑制或減少乳癌細胞的中藥組成物，包含甘遂、白芍、甘草、蒲公英、梔子及麥芽，該甘遂、該白芍、該甘草、該蒲公英、該梔子與該麥芽於該中藥組成物中的重量比例為1~2：4~6：2~3：3~5：2~4：2~3，其中該中藥組成物用於製備抗癌藥物之用途，該中藥組成物係以一有效劑量介於0.1~10mg/ml施予該乳癌細胞進行培養，經細胞實驗證實，該中藥組成物具有抑制該乳癌細胞的活性表現，達到治療乳癌症狀或抑制乳癌細胞活性之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.JPG" file="ed10025.JPG" height="607px" img-content="tif" inline="yes" orientation="portrait" width="1003px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622740</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144139</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250324B">G06F11/22</main-classification>
        <further-classification edition="202501120250324B">G06F11/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神雲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAC COMPUTING TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江家亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIA-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡居諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>控制開機選項的方法</chinese-title>
        <english-title>METHOD FOR CONTROLLING BOOT OPTIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種控制開機選項的方法，包含：執行熱鍵偵測程序及執行開機選項判斷程序。熱鍵偵測程序包含：偵測熱鍵訊號是否被觸發及當偵測到熱鍵訊號被觸發時，設置變數為第一值。開機選項判斷程序包含：讀取變數及當讀取到變數為第一值時，禁止裝置依據連接於裝置的第一輸入輸出介面的儲存裝置開機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for controlling boot options includes executing a hotkey detection procedure and executing a boot option determination procedure. The hotkey detection procedure includes detecting whether a hotkey signal is triggered, and when the hotkey signal is detected as triggered, setting a variable to a first value. The boot option determination procedure includes reading the variable, and when the variable is read as the first value, preventing a device from booting according to a storage device connected to a first input/output interface of the device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01~S02:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="242px" img-content="tif" inline="yes" orientation="portrait" width="436px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621943</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144141</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120241130B">B64C39/02</main-classification>
        <further-classification edition="200601120241130B">B64D47/00</further-classification>
        <further-classification edition="200901120241130B">H04W64/00</further-classification>
        <further-classification edition="200601120241130B">G08B21/10</further-classification>
        <further-classification edition="202401120241130B">G05D1/20</further-classification>
        <further-classification edition="202401320241130B">G05D105/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊光勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KUANG-SHINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許昭傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHAO CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇炳華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, PING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍聰義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, TSUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊瑞雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JUI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈閎駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HUNG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>山難救助系統和山難救助方法</chinese-title>
        <english-title>MOUNTAIN RESCUE SYSTEM AND MOUNTAIN RESCUE METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種山難救助系統和山難救助方法。山難救助方法包含：由行動裝置發射射頻訊號；由第一無人機根據第一路徑飛行以搜尋射頻訊號；由第二無人機根據第二路徑飛行以搜尋射頻訊號；響應於第一無人機偵測到射頻訊號，由第二無人機根據第一無人機的第一位置更新第二路徑以偵測射頻訊號；以及響應於第一無人機和第二無人機偵測到射頻訊號，根據第一位置以及第二無人機的第二位置定位行動裝置以產生第一定位結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mountain rescue system and a mountain rescue method are provided. The mountain rescue method includes: transmitting a radio frequency signal by a mobile device; flying according to a first path by a first drone to search the radio frequency signal; flying according to a second path by a second drone to search the radio frequency signal; in response to the first drone detecting the radio frequency signal, updating the second path according to a first position of the first drone by the second drone to detect the radio frequency signal; and in response to the first drone and the second drone detecting the radio frequency signal, positioning the mobile device according to the first position and a second position of the second drone to generate a first positioning result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501,S502,S503,S504,S505:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="809px" img-content="tif" inline="yes" orientation="portrait" width="595px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621601</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144145</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241216B">A47B67/02</main-classification>
        <further-classification edition="200601120241216B">A47B97/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>得縉有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE JIN CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊函諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>導光抽屜櫃及其智慧藥櫃系統</chinese-title>
        <english-title>DRAWER CABINET WITH LIGHT GUIDE AND INTELLIGENT MEDICINE CABINET SYSTEM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種導光抽屜櫃，包括形成一對一配置的多個光源與多個抽屜單元，以及用以控制該些光源的致能與否的一控制電路。每一抽屜單元包括一抽屜及設置在該抽屜上的一導光部。每一抽屜的一前板各具有一視窗。該些導光部分別用以接收該些光源所發出的光線，並分別將所接收到光線往前傳遞到該些抽屜的前板上的視窗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A drawing cabinet with light guides includes a multiple light sources configured in one-to-one arrangement with a plurality of drawer units, and a control circuit for controlling the light source. Each drawer unit includes a drawer and a light guide disposed in the drawer. Each drawer's front panel has a window. Each light guide is used to receive light emitted from each light source and transmit the received light forward to the window on the front panel of each drawer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:櫃體</p>
        <p type="p">101:前側面</p>
        <p type="p">102:後側面</p>
        <p type="p">11:抽屜通道</p>
        <p type="p">12:層板</p>
        <p type="p">13:軌道</p>
        <p type="p">14:背板</p>
        <p type="p">2:導光抽屜單元</p>
        <p type="p">21:抽屜</p>
        <p type="p">211:前板</p>
        <p type="p">212:視窗</p>
        <p type="p">213:後板</p>
        <p type="p">214:容納空間</p>
        <p type="p">215:底板</p>
        <p type="p">216:側板</p>
        <p type="p">22:導光部</p>
        <p type="p">221:前端面</p>
        <p type="p">222:後端面</p>
        <p type="p">223:導光體</p>
        <p type="p">224:導光層</p>
        <p type="p">3:光源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="707px" img-content="tif" inline="yes" orientation="portrait" width="914px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621603</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144149</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120241217B">A47B88/407</main-classification>
        <further-classification edition="201701120241217B">A47B88/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>得縉有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE JIN CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊文瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG,WEN-CHIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許榮貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, JUNG KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊函諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>方便調整抽屜大小的抽屜櫃</chinese-title>
        <english-title>DRAWER CABINET WITH ADJUSTABLE DRAWERS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可調整抽屜大小的抽屜櫃，包括一櫃體及多個小抽屜，該櫃體的一櫃層包括上下相對的兩個層板、多個位於兩該層板之間且沿X方向排列的小抽屜通道、及多對設置在下方該層板上且分別位於該些小抽屜通道的導軌，該些小抽屜通道彼此相通且大小相同，每一小抽屜通道及位於其內的導軌係沿Y方向延伸。該些小抽屜分別設置於該櫃層的該些小抽屜通道內，每一小抽屜包括一底面及設置在該底面的兩滑行部，每一小抽屜通道內的小抽屜的兩該滑行部分別沿能著每一小抽屜通道內的兩該導軌滑動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A drawer cabinet with adjustable drawers including a cabinet and a plurality of small drawers, wherein one cabinet layer of the cabinet has two opposing layers, a plurality of small drawer channels arranged between the two layers and along the X direction, and a plurality of pairs of guides arranged on the lower layer and respectively located in the small drawer channels. The small drawer channels communicate with each other and have the same size, and each small drawer channel and the guide therein extend along the Y direction. The small drawers are respectively disposed in the small drawer channels of the layer, and each small drawer includes a bottom surface and two sliding parts disposed on the bottom surface. The two sliding parts of each small drawer in each small drawer channel slide along the two guides in each small drawer channel, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:櫃體</p>
        <p type="p">10:櫃層</p>
        <p type="p">11:立板</p>
        <p type="p">12:層板</p>
        <p type="p">121:導板</p>
        <p type="p">13:小抽屜通道</p>
        <p type="p">14:導軌</p>
        <p type="p">20:容納空間</p>
        <p type="p">200:進出口</p>
        <p type="p">2:小抽屜</p>
        <p type="p">21:前板</p>
        <p type="p">22:後板</p>
        <p type="p">221:擋片</p>
        <p type="p">23:側板</p>
        <p type="p">24:底板</p>
        <p type="p">240:底面</p>
        <p type="p">25:滑行部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="875px" img-content="tif" inline="yes" orientation="portrait" width="734px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623186</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144150</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03B5/12</main-classification>
        <further-classification edition="200601120250303B">H03L7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韻中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有耐壓機制的振盪電路</chinese-title>
        <english-title>OSCILLATOR CIRCUIT HAVING VOLTAGE-WITHSTANDING MECHANISM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有耐壓機制的振盪電路，包含：第一電感電路、交叉耦合電晶體電路、第二電感電路以及電容電路。第一電感電路電性耦接於一對連接端。交叉耦合電晶體電路電性耦接於該對連接端。第二電感電路電性耦接於該對連接端以及一對振盪輸出端間。電容電路電性耦接於該對振盪輸出端間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An oscillator circuit having voltage-withstanding mechanism is provided that includes a first inductor circuit, a cross-coupled transistor circuit, a second inductor circuit and a capacitor circuit. The first inductor circuit is electrically coupled to a pair of connection terminals. The cross-coupled transistor circuit is electrically coupled to the pair of connection terminals. The second inductor circuit is electrically coupled between the pair of connection terminals and a pair of oscillating output terminals. The capacitor circuit is electrically coupled between the pair of oscillating output terminals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:振盪電路</p>
        <p type="p">110:第一電感電路</p>
        <p type="p">120:交叉耦合電晶體電路</p>
        <p type="p">130:第二電感電路</p>
        <p type="p">140:電容電路</p>
        <p type="p">CO1、CO2:連接端</p>
        <p type="p">L11、L12、L21、L22:電感</p>
        <p type="p">MN1:第一電晶體</p>
        <p type="p">MN2:第二電晶體</p>
        <p type="p">OT1、OT2:振盪輸出端</p>
        <p type="p">V1:第一電壓</p>
        <p type="p">V2:第二電壓</p>
        <p type="p">VDD1:第一電源電壓</p>
        <p type="p">VDD2:第二電源電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="787px" img-content="tif" inline="yes" orientation="portrait" width="739px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623187</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144151</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03B5/12</main-classification>
        <further-classification edition="200601120250303B">H03L7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韻中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有耐壓機制的振盪電路</chinese-title>
        <english-title>OSCILLATOR CIRCUIT HAVING VOLTAGE-WITHSTANDING MECHANISM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有耐壓機制的振盪電路。電感電路耦接於一對振盪輸出端。交叉耦合電晶體電路耦接於該對振盪輸出端及第一端點間。電容電路耦接於該對振盪輸出端間。第一源極退化電路包含：第一電感、第一電容、第二電容以及第一源極退化電晶體。第一電感電性耦接於第一端點以及第一電源電壓間。第一電容電性耦接於第一端點以及第二端點間。第二電容耦接於第一電源電壓及第三端點間，其中第三端點耦接於第二電源電壓。第一源極退化電晶體耦接於第二端點及第三端點間，並受控於第一饋入電壓而導通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An oscillator circuit having voltage-withstanding mechanism is provided. An inductor circuit is coupled to a pair of oscillating output terminals. A cross-coupled transistor circuit is coupled between the oscillating output terminals and a first terminal. A capacitor circuit is coupled between the oscillating output terminals. A first source degeneration circuit includes a first inductor, a first capacitor, a second capacitor and a first source degeneration circuit. The first inductor is coupled between the first terminal and a first power voltage. The first capacitor is coupled between the first terminal and a second terminal. The second capacitor is coupled between the first power voltage and a third terminal that is coupled to a second power voltage. The first source degeneration is coupled between the second terminal and the third terminal and is turned on based on a first feeding voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:振盪電路</p>
        <p type="p">110:電感電路</p>
        <p type="p">120:交叉耦合電晶體電路</p>
        <p type="p">130:電容電路</p>
        <p type="p">140:第一源極退化電路</p>
        <p type="p">CS1:第一電容</p>
        <p type="p">CS2:第二電容</p>
        <p type="p">L1:電感</p>
        <p type="p">L2:電感</p>
        <p type="p">LS1:第一電感</p>
        <p type="p">MP1:第一電晶體</p>
        <p type="p">MP2:第二電晶體</p>
        <p type="p">MS1:第一源極退化電晶體</p>
        <p type="p">OT1、OT2:振盪輸出端</p>
        <p type="p">TR1:第一端點</p>
        <p type="p">TR2:第二端點</p>
        <p type="p">TR3:第三端點</p>
        <p type="p">VDD1:第一電源電壓</p>
        <p type="p">VDD2:第二電源電壓</p>
        <p type="p">VF1:第一饋入電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="820px" img-content="tif" inline="yes" orientation="portrait" width="636px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623185</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144152</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">H03B5/04</main-classification>
        <further-classification edition="200601120250401B">H03B5/08</further-classification>
        <further-classification edition="200601120250401B">H03K4/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韻中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有相位雜訊降低機制的振盪電路</chinese-title>
        <english-title>OSCILLATOR CIRCUIT HAVING PHASE-NOISE DECREASING MECHANISM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有相位雜訊降低機制的振盪電路。電感電路包含圍繞中央區域的電感線圈且耦接於振盪輸出端間。電容電路耦接於振盪輸出端間。交叉耦合互補式金氧半導體電路設置於電感線圈的第一側且位於電感電路及電容電路間，以耦接於振盪輸出端。第一及第二走線自電感線圈的第一側沿軸線橫越中央區域至電感線圈的第二側，以分隔中央區域為二子區域。第一及第二源極退化電路設置於電感線圈的第二側與軸線的二對稱側。第一及第二源極退化電路分別透過第一走線及第二走線耦接於交叉耦合互補式金氧半導體電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An oscillator circuit having phase-noise decreasing mechanism is provided. An inductor circuit includes an inductor coil surrounding a central area and coupled between oscillating output terminals. A capacitor circuit is coupled between the oscillating output terminals. A cross-coupled CMOS circuit is disposed at a first side of the inductor coil and between the inductor circuit and the capacitor circuit to be coupled to the oscillating output terminals. A first wire and a second wire stretch from the first side of the inductor coil along with an axis to traverse the central area to a second side of the inductor coil to divide the central area into two sub areas. A first and a second source degeneration circuits are disposed at the second side of the inductor coil and are respectively disposed at two symmetrical sides of the axis. The first and the second source degeneration circuits respectively are coupled to the cross-coupled CMOS circuit through the first and the second wires.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:振盪電路</p>
        <p type="p">110:電感電路</p>
        <p type="p">120:電容電路</p>
        <p type="p">130:交叉耦合互補式金氧半導體電路</p>
        <p type="p">140:第一走線</p>
        <p type="p">150:第二走線</p>
        <p type="p">160:第一源極退化電路</p>
        <p type="p">170:第二源極退化電路</p>
        <p type="p">200:電感線圈</p>
        <p type="p">210:中央區域</p>
        <p type="p">220、230:延伸走線</p>
        <p type="p">240:第一線圈</p>
        <p type="p">250:第二線圈</p>
        <p type="p">A:軸線</p>
        <p type="p">CS1:第一電容</p>
        <p type="p">CS2:第二電容</p>
        <p type="p">LS1:第一電感</p>
        <p type="p">LS2:第二電感</p>
        <p type="p">OT1、OT2:振盪輸出端</p>
        <p type="p">TR1:第一端點</p>
        <p type="p">TR2:第二端點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="926px" img-content="tif" inline="yes" orientation="portrait" width="619px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622881</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144153</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250121B">G06Q50/20</main-classification>
        <further-classification edition="200601120250121B">G09B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬通教育股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇冠融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>線上學習平台系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種線上學習平台系統，適於為使用者提供自主學習循環，該系統包括：至少一個伺服器以及至少一個終端裝置，伺服器設置以與終端裝置進行通訊，該伺服器包括：學習進度管理模組，設置以追蹤該終端裝置的學習活動；測驗生成模組，與該學習進度管理模組耦接，設置以基於該終端裝置的學習活動，生成適應學生學習狀態的個性化測驗題目；以及錯題訂正模組，與該測驗生成模組和該測驗生成模組耦接，設置以接收該終端裝置在一測驗時所作的測驗題目及測驗答案，並針對與該測驗題目相關的錯誤答題生成一訂正練習。本發明的線上學習平台系統構建一個完整的自適應學習循環，能夠有效促進學生的自主學習能力，透過精確的學習進度管理、個性化測驗、靈活的錯題訂正和教材推薦，提升學習過程中的靈活性和精確性，並實現更高效的學習成效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:線上學習平台系統</p>
        <p type="p">12:伺服器</p>
        <p type="p">121:學習進度管理模組</p>
        <p type="p">122:測驗生成模組</p>
        <p type="p">123:錯題訂正模組</p>
        <p type="p">124:多元教材管理模組</p>
        <p type="p">125:教材數據庫</p>
        <p type="p">126:學習成效記錄模組</p>
        <p type="p">14:終端裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="648px" img-content="tif" inline="yes" orientation="portrait" width="716px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622882</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144154</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250319B">G06Q50/20</main-classification>
        <further-classification edition="202301120250319B">G06Q10/06</further-classification>
        <further-classification edition="200601120250319B">G09B5/00</further-classification>
        <further-classification edition="200601120250319B">G09B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬通教育股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇冠融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於綜合管理及支援學習遠距教育系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於綜合管理及支援學習遠距教育系統，系統包括：至少一個伺服器以及複數個終端設備，其與伺服器通訊並數據交換，包括：多功能整合模組，其設置為在一操作介面提供教學資料及互動支持功能，其中，教學資料及互動支持功能包括視訊教學、教材展示、作業管理及訊息通知的至少其中之一；行為監控模組，其設置為監控複數個終端設備的第一終端設備在課程期間的操作行為；智能化學力分析模組，其設置為接收並分析與第一終端設備相關連的測驗或作業結果；以及雲端行政管理模組，其設置為管理與複數個終端設備的第一終端設備相關連的第一行政事務以及與複數個終端設備的第二終端設備相關連的第二行政事務；其中，複數個終端設備的第一終端設備與第二終端設備設置為允許在操作介面上響應該教學資料及互動支持功能。透過本發明的系統，教師和學生能在同一操作介面整合遠距教學、行為監控、學力分析及行政管理之功能，無需在多個應用程式或視窗間切換，提升教與學的便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:伺服器</p>
        <p type="p">121:多功能整合模組</p>
        <p type="p">1211:作業管理子模組</p>
        <p type="p">1212:教材展示子模組</p>
        <p type="p">1213:作業考試答題庫</p>
        <p type="p">1214:訊息通知子模組</p>
        <p type="p">122:行為監控模組</p>
        <p type="p">1221:分頁切換監測子模組</p>
        <p type="p">123:智能化學力分析模組</p>
        <p type="p">1231:錯題分析子模組</p>
        <p type="p">1232:學習進度追蹤子模組</p>
        <p type="p">124:雲端行政管理模組</p>
        <p type="p">1241:第一管理子模組</p>
        <p type="p">1242:第二管理子模組</p>
        <p type="p">141:第一終端設備</p>
        <p type="p">142:第二終端設備</p>
        <p type="p">143:第三終端設備</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="988px" img-content="tif" inline="yes" orientation="portrait" width="725px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623019</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144155</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241130B">H01H13/14</main-classification>
        <further-classification edition="200601120241130B">H01H13/705</further-classification>
        <further-classification edition="200601120241130B">H01H3/02</further-classification>
        <further-classification edition="200601120241130B">G06F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致伸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃逸超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宇璔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-ZENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>按鍵結構</chinese-title>
        <english-title>KEY STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種按鍵結構，包括：鍵帽、以及背光模組。鍵帽具有透光區域。背光模組設置於鍵帽的下方，背光模組包括發光元件，發光元件與透光區域錯位配置。其中，在發光元件的光傳播路徑與透光區域之間設置有彈性元件，彈性元件用以使鍵帽彈性復位，彈性元件係以不透光材質製成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides a key structure, including a keycap and a backlight module. The keycap has a light-transmitting area. The backlight module is arranged beneath the keycap and includes a light-emitting element. The light-emitting element is positioned offset from the light-transmitting area. An elastic component is positioned between the light-emitting element's light propagation path and the light-transmitting area. The elastic component is used to elastically reset the keycap and is made of an opaque material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">KS:按鍵結構</p>
        <p type="p">1:鍵帽</p>
        <p type="p">4:開關層</p>
        <p type="p">11:頂面</p>
        <p type="p">13:帽簷</p>
        <p type="p">14A:第一透光區域</p>
        <p type="p">14B:第二透光區域</p>
        <p type="p">BB:線段</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="569px" img-content="tif" inline="yes" orientation="portrait" width="685px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622351</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144156</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250107B">E06B3/32</main-classification>
        <further-classification edition="200601120250107B">E06B3/96</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晟鈺智能全球有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>基隆市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞汶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>平面門窗之軌道組裝結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種平面門窗之軌道組裝結構，其包括一第一框體與一第二框體，在該第一框體與該第二框體相對組接後，該第一框體之第一下框板的一側與該第二框體之第二下框板之間形成一直線移動導槽。本發明利用組接後的所述第一框體與所述第二框體來形成該直線移動導槽，可以避免在該直線移動導槽兩側的該第二下框板與該支撐框片上形成毛邊，相應地，也能避免對該滑輪的表面造成磨損，從而確保在長時間的使用過後，該移動門窗也不會因滑輪損傷而產生噪音，進而提高產品的可靠度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一框體</p>
        <p type="p">121:支撐框片</p>
        <p type="p">122:扣接框片</p>
        <p type="p">13:穿槽</p>
        <p type="p">20:第二框體</p>
        <p type="p">23:扣接槽</p>
        <p type="p">24:弧形導槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="731px" img-content="tif" inline="yes" orientation="portrait" width="1052px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622764</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144161</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250303B">G06F16/10</main-classification>
        <further-classification edition="200601120250303B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威聯通科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QNAP SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳祖佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種對電腦檔案系統之持續快照進行版本擷取的方法</chinese-title>
        <english-title>A METHOD FOR EXCAVATING OF CONTINUOUS SNAPSHOTS IN A COMPUTER FILE SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種對電腦檔案系統之持續快照進行版本擷取的方法，包括以下步驟：        &lt;br/&gt;建立持續快照日誌系統（CSNAP Diary）在特定期間內收集電腦檔案的持續快照，並保存交易群組（transaction group）的根指標塊（Root Block Pointer），以記錄快照生成時之資料管理節點（dnode）和資料塊（Data Block）的狀態；        &lt;br/&gt;於資料管理節點內增設兩個欄位，用於標識每次修改的起始值與結束值；        &lt;br/&gt;當資料管理節點在不同交易群組中被修改時，根據相鄰或非相鄰交易群組的條件，動態設置起始值與結束值，以精確記錄變更範圍；        &lt;br/&gt;該方法通過遍歷資料管理節點中標記的起始值與結束值之最小值，自最後的持續快照向前追溯所有檔案有被修改之版本，實現快速版本擷取。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for excavating of continuous snapshots in a computer file system, comprising the following steps:        &lt;br/&gt;Establishing a Continuous Snapshot Diary (CSNAP Diary) to collect continuous snapshots of computer files within a specified period, and preserving the root block pointer of each transaction group to record the state of data management nodes (dnodes) and data blocks at the time of snapshot generation;        &lt;br/&gt;Adding two fields within each dnode to designate the start and end values of each modification of dnodes;        &lt;br/&gt;When a dnode is modified across different transaction groups, dynamically setting the start and end values based on conditions of adjacent or non-adjacent transaction groups to precisely record the range of changes;        &lt;br/&gt;The method achieves fast excavating by traversing the minimum start and end values marked in dnodes and tracing back all modified file versions from the latest continuous snapshot.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟d:檔案系統係處於第N個交易群組(即第N個持續快照)所對應之狀態與時間點</p>
        <p type="p">步驟d-1:若檔案系統係處於第N個交易群組(即第N個持續快照)所對應之狀態與時間點時，電腦檔案之資料管理節點被建立，此時，將起始值設置為N，結束值設置為一可辨識之數值</p>
        <p type="p">步驟d-2:若檔案系統係處於第N個交易群組(即第N個持續快照)所對應之狀態與時間點時，電腦檔案之資料管理節點被修改，且資料管理節點前一次修改係發生於第M個交易群組(即第M個持續快照)所對應之狀態與時間點</p>
        <p type="p">步驟e:N是M的鄰接之下一個交易群組</p>
        <p type="p">步驟e-1:將結束值變更為N，起始值保持不變</p>
        <p type="p">步驟e-2:將起始值變更為N並將結束值設置為M</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="952px" img-content="tif" inline="yes" orientation="portrait" width="745px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622883</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144162</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250121B">G06Q50/20</main-classification>
        <further-classification edition="201301120250121B">G06F21/33</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬通教育股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇冠融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多功能互動線上教育平台管理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種多功能互動線上教育平台管理系統，該系統包括至少一伺服器，設置以複數個終端裝置的至少其中之一進行通訊，該伺服器包括：一識別模組，耦接該等複數個終端裝置，設置以根據該等複數個終端裝置的至少其中之一識別與其相應的族群類型；以及一學習資源模組，耦接該識別模組，設置以接收所識別的終端裝置的請求，並根據該請求以及該族群類型提供與其相應的教育服務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:伺服器</p>
        <p type="p">121:識別模組</p>
        <p type="p">122:學習資源模組</p>
        <p type="p">1221:題庫單元</p>
        <p type="p">1222:電子書單元</p>
        <p type="p">123:教師管理模組</p>
        <p type="p">124:學習環境模組</p>
        <p type="p">125:分配管理模組</p>
        <p type="p">126:師資庫</p>
        <p type="p">14:終端裝置</p>
        <p type="p">141:第一終端裝置</p>
        <p type="p">142:第二終端裝置</p>
        <p type="p">143:第三終端裝置</p>
        <p type="p">144:第四終端裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="769px" img-content="tif" inline="yes" orientation="portrait" width="887px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622922</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144164</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250324B">G09B5/08</main-classification>
        <further-classification edition="201201120250324B">G06Q50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬通教育股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇冠融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>線上虛擬教室的教學互動方法及其系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種線上虛擬教室系統的教學互動方法， 該包括以下步驟：請求接收步驟，伺服器與複數個終端設備通訊連接，伺服器接收來自複數個終端設備的功能請求，其中，複數個終端設備包括與老師相關的至少一第一終端設備以及與學生相關的複數個第二終端設備；管理步驟，伺服器根據來自複數個第二終端設備的登入請求，偵測並確定參與課堂的學生數量，於第一終端設備上顯示參與者頭像；發言討論步驟，透過第二終端設備發送發言請求，發言請求通過該伺服器於第一終端設備的操作介面上顯示，第一終端設備配置以根據該發言請求選擇並允許複數個第二終端裝置的其中之一進行發言；以及獎勵步驟，在發言討論過程中，根據學生的參與表現，第一終端設備配置以透過其操作介面向第二終端設備發放獎勵，並顯示於第二終端設備的操作介面上。本發明亦提供一種線上虛擬教室系統，藉由本發明，提升線上教學的互動性和參與度，確保課堂管理有序進行，並能即時處理設備問題，保障教學過程的順暢運行。透過動態管理和多媒體展示，本發明增強了虛擬教室中的教學體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:請求接收步驟</p>
        <p type="p">S20:管理步驟</p>
        <p type="p">S30:發言討論步驟</p>
        <p type="p">S40:獎勵步驟</p>
        <p type="p">S50:展示步驟</p>
        <p type="p">S60:設備檢查步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="1084px" img-content="tif" inline="yes" orientation="portrait" width="794px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622567</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144165</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250121B">G02B6/42</main-classification>
        <further-classification edition="200601120250121B">G06F17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉維彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, WEI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃郁翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙芙涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, FU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>耦光對位方法及其系統</chinese-title>
        <english-title>OPTICAL COUPLING AND ALIGNING METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種耦光對位方法及其系統，耦光對位方法包含藉由一處理器依據一簡化群體生成規則及一梯度下降規則的一者產生一參數組，其中參數組包含至少一耦光座標及至少一耦光角度，且至少一耦光座標位於一目標區域內。藉由處理器計算由參數組中的至少一耦光座標及至少一耦光角度進行耦光所對應的一功率點。藉由處理器依據功率點決定是否更新一資料庫的一最佳功率點。藉由處理器重複執行上述步驟，直到複數參數組的數量等於一預設數量。處理器交替地透過簡化群體生成規則及梯度下降規則產生參數組。藉此，找出最佳的耦合位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical coupling and aligning method and a system thereof are proposed. The optical coupling and aligning method includes configuring a processor to generate a parameter set according to one of a Simplification Swarm Optimization (SSO) rule and a gradient descent rule, wherein the parameter set includes at least one optical coupling coordinate and at least one optical coupling angle, and the at least one optical coupling coordinate is in a target area. The processor is configured to calculate a power point, and the power point is generated when a light is coupled to the at least one optical coupling coordinate of the parameter set by the at least one optical coupling angle of the parameter set. The processor is configured to determine whether to update a best power point of a database according to the power point. The processor is configured to execute the aforementioned steps repeatedly until a number of a plurality of the parameter sets equal to a predetermined value. The processor is configured to generate the parameter sets by the SSO rule and the gradient descent rule alternately. Thus, the optical coupling and aligning method of the present disclosure can find out a best coupling position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:耦光對位系統</p>
        <p type="p">110:資料庫</p>
        <p type="p">120:處理器</p>
        <p type="p">121:參數組</p>
        <p type="p">1211:耦光座標</p>
        <p type="p">1212:耦光角度</p>
        <p type="p">A1:目標區域</p>
        <p type="p">P1:功率點</p>
        <p type="p">PG:最佳功率點</p>
        <p type="p">R1:簡化群體生成規則</p>
        <p type="p">R2:梯度下降規則</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="673px" img-content="tif" inline="yes" orientation="portrait" width="895px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622958</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144170</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250401B">G10L25/00</main-classification>
        <further-classification edition="202301120250401B">G06N3/08</further-classification>
        <further-classification edition="200601220250401B">A61B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學醫學院附設醫院新竹臺大分院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY HOSPITAL HSIN-CHU BRANCH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>常安彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, AN-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾靖桐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, JING-TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祈均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃沛銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑俞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>資料增強方法、呼吸音分類方法與電子裝置</chinese-title>
        <english-title>DATA AUGMENTATION METHOD, RESPIRATORY SOUND CLASSIFICATION METHOD AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種資料增強方法，用於擴展包括多個時頻譜（Spectrogram）的資料集。上述方法包括在資料集中的第一時頻譜中選擇至少一個區塊；決定所選的至少一個區塊的至少一個調整值；以及基於至少一個調整值調整第一時頻譜的至少一個區塊，以得到第一調整後時頻譜。上述調整值包括對比度調整值、亮度調整值以及伽瑪調整值的至少其中之一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data augmentation method for expanding a dataset including a plurality of spectrograms is provided. The method includes selecting at least one patch of a first spectrogram of the plurality of spectrograms, determining at least one adjustment value corresponding to the at least one patch, and adjusting the at least one patch of the first spectrogram based on the at least one adjustment value, to obtain a first adjusted spectrogram. The at least one adjustment value includes at least one of a contrast adjustment value, a brightness adjustment value, and a gamma adjustment value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S103、S105:資料增強方法的步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="703px" img-content="tif" inline="yes" orientation="portrait" width="585px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622010</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144177</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260203B">C03B33/08</main-classification>
        <further-classification edition="201401120260203B">B23K26/062</further-classification>
        <further-classification edition="202601120260203B">H10W70/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基板加工裝置、方法及加工基板</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS, METHOD AND PROCESSED SUBSTRATE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種基板加工裝置、方法及加工基板。基板加工裝置包含控制模組、材料供應模組、鑽孔模組以及材料移除模組。材料供應模組與控制模組電性連接，用以在基板上形成保護層。鑽孔模組與控制模組電性連接，用以對基板進行鑽孔。材料移除模組與控制模組電性連接，用於藉由光移除所述基板上的所述保護層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a substrate processing apparatus, method and processed substrate. The substrate processing apparatus includes a control module, material spraying module, drilling module and material removal module. The material spraying module is electrically connected to the control module to form a protective layer on the substrate. The drilling module is electrically connected to the control module and is used for drilling the substrate. The material removal module is electrically connected to the control module and is used to remove the protective layer on the substrate by light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:控制模組</p>
        <p type="p">20:材料供應模組</p>
        <p type="p">30:鑽孔模組</p>
        <p type="p">40:材料移除模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="431px" img-content="tif" inline="yes" orientation="portrait" width="586px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622610</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144182</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">G02F1/1333</main-classification>
        <further-classification edition="201401120241204B">H02S40/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張㻙堃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>液晶顯示器及雙層液晶顯示器</chinese-title>
        <english-title>LIQUID CRYSTAL DISPLAY AND DOUBLE-LAYER LIQUID CRYSTAL DISPLAY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種液晶顯示器，包含一顯示面板以及一太陽能模組。太陽能模組設置於顯示面板的一表面，並包含一聚合層、複數太陽能電池、至少一二極體及一透光層。此些太陽能電池彼此電性連接，並間隔埋設於聚合層中。至少一二極體埋設於聚合層中，且與此些太陽能電池的至少一者並聯連接。透光層設置於顯示面板及聚合層之間。顯示面板、透光層及聚合層之任相鄰二者透過一光學膠黏合。藉此，避免太陽能模組因部分區域受遮蔭而降低發電效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid crystal display is proposed. The liquid crystal display includes a display panel and a solar module. The solar module is disposed on a surface of the display panel, and includes a polymer layer, a plurality of solar cells, at least one diode and a transparent layer. The solar cells are electrically connected to each other, and alternately embedded in the polymer layer. The at least one diode is embedded in the polymer layer, and connected to at least one of the solar cells in parallel. The transparent layer is disposed between the display panel and the polymer layer. Any adjacent two of the display panel, the transparent layer and the polymer layer are bonded by an optical adhesive. Thus, the liquid crystal display of the present disclosure can avoid the solar module from decreasing the efficiency because the solar module is partially shaded.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:液晶顯示器</p>
        <p type="p">110:顯示面板</p>
        <p type="p">120:太陽能模組</p>
        <p type="p">121:聚合層</p>
        <p type="p">122:太陽能電池</p>
        <p type="p">123:二極體</p>
        <p type="p">124:透光層</p>
        <p type="p">125:遮光層</p>
        <p type="p">130:背板</p>
        <p type="p">TH1:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="672px" img-content="tif" inline="yes" orientation="portrait" width="956px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621844</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144184</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120241126B">B24B37/013</main-classification>
        <further-classification edition="200601120241126B">B24B49/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡祐嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>晶圓及晶圓研磨表面刮傷預判方法</chinese-title>
        <english-title>WAFER AND SCRATCH PREJUDGMENT METHOD FOR GRINDING SURFACE OF WAFER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種晶圓及晶圓研磨表面刮傷預判方法。所述晶圓具有經研磨的一頂面，其能用於通過形貌量測而取得多個偵測點位。所述頂面具有位在其半徑的20%～54%所涵蓋範圍的多個環形子區域，並且在對應於每個所述環形子區域的多個所述偵測點位之中，其最大值與最小值的差值定義為一子區域總厚度偏差值。在鄰近於所述頂面的圓心的兩個所述環形子區域之中，靠近所述中央區域的一個所述環形子區域的所述子區域總厚度偏差值大於另一個所述子區域總厚度偏差值。於任兩個所述環形子區域之中，兩個所述子區域總厚度偏差值之間的差值小於0.5微米。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a wafer and a scratch prejudgement method for a grinded surface of a wafer. The wafer has a top surface that is grinded and that is configured to have a plurality of detection points through a topography measurement. The top surface has a plurality of annular sub-regions arranged in a portion corresponding in position to a radius thereof that is within a range from 20% to 54%. The detection points on each of the annular sub-regions have a maximum value and a minimum value that have a difference defined as a sub-region total thickness variation (TTV). In any two of the annular sub-regions arranged adjacent to a circle of center of the top surface, the sub-region TTV of one of the any two of the annular sub-regions arranged adjacent to the circle of center is greater than the sub-region TTV of another one of the any two of the annular sub-regions. A difference of any two of the annular sub-regions is less than 0.5 μm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓</p>
        <p type="p">1:加工部分</p>
        <p type="p">11:頂面</p>
        <p type="p">111:中央區域</p>
        <p type="p">112:判別區域</p>
        <p type="p">112a:環形子區域</p>
        <p type="p">112b:環形子區域</p>
        <p type="p">113:排屑區域</p>
        <p type="p">114:邊緣區域</p>
        <p type="p">13:平口</p>
        <p type="p">2:環狀部分</p>
        <p type="p">C:圓心</p>
        <p type="p">R:半徑</p>
        <p type="p">W1:寬度</p>
        <p type="p">W2:寬度</p>
        <p type="p">P:偵測點位</p>
        <p type="p">S130:量測步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="789px" img-content="tif" inline="yes" orientation="portrait" width="923px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623601</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144186</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10P74/00</main-classification>
        <further-classification edition="202601120260303B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>由田新技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTECHZONE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒嘉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張勛豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置量測方法及其系統</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE MEASUREMENT METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種半導體裝置量測方法及系統。半導體裝置量測方法用於量測一半導體裝置與一基板間的一間距高度，其中該半導體裝置具有一金屬層與連接該金屬層的多個輸出端，且該輸出端連接至該基板，半導體裝置量測方法包括：量測該半導體裝置的頂面至該基板之間的一第一高度；基於紅外光量測該半導體裝置內的半導體層厚度，以獲得該半導體裝置的頂面至該金屬層的頂面之間的一第二高度；以及根據該第一高度、該第二高度，以及該金屬層的厚度，獲得該間距高度，其中該間距高度為該金屬層的底面至該基板之間的間距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device measurement method and a system thereof are provided. The semiconductor device measurement method is used to measure a pitch height between a semiconductor device and a substrate, wherein the semiconductor device has a metal layer and a plurality of output terminals connected to the metal layer, and the plurality of output terminals are connected to the substrate. The semiconductor device measurement method includes: measuring a first height between a top surface of the semiconductor device and the substrate; measuring a thickness of the semiconductor layer in the semiconductor device based on infrared light to obtain a second height between the top surface of the semiconductor device and a top surface of the metal layer; and obtaining the pitch height based on the first height, the second height, and the thickness of the metal layer, wherein the pitch height is a pitch between a bottom surface of the metal layer and the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z:半導體裝置量測系統</p>
        <p type="p">Z1:載台</p>
        <p type="p">Z2:測量裝置</p>
        <p type="p">Z3:分析裝置</p>
        <p type="p">Z4:填膠裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="479px" img-content="tif" inline="yes" orientation="portrait" width="407px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621835</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144201</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260302B">B23K26/60</main-classification>
        <further-classification edition="201401120260302B">B23K26/70</further-classification>
        <further-classification edition="201401120260302B">B23K26/382</further-classification>
        <further-classification edition="201401120260302B">B23K26/062</further-classification>
        <further-classification edition="202601120260302B">H10W70/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基板加工方法、裝置及加工基板</chinese-title>
        <english-title>SUBSTRATE PROCESSING METHOD, APPARATUS AND PROCESSED SUBSTRATE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種基板加工方法、裝置及加工基板。基板加工方法包含透過材料供應模組對基板提供噴塗材料，以在所述基板上形成保護層、透過鑽孔模組對所述基板進行鑽孔以及移除所述基板上的所述保護層。所述噴塗材料在預定溫度下透過揮發或者蒸發的方式被移除。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a substrate processing method, apparatus and processed substrate. The substrate processing method includes providing spraying material to the substrate through a material supply module to form a protective layer on the substrate, drilling the substrate through a drilling module, and removing the protective layer on the substrate. The spray material is removed by volatilization or evaporation at a predetermined temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S3:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="487px" img-content="tif" inline="yes" orientation="portrait" width="563px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622876</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144207</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250512B">G06Q50/02</main-classification>
        <further-classification edition="202301120250512B">G06N3/09</further-classification>
        <further-classification edition="202301120250512B">G06N3/0985</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛坤鎰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佩璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許耿禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具物理化學屬性產品的產地辨識學習方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具物理化學屬性產品的產地辨識學習方法，利用將複數已知物理化學屬性的已知產地產品分別以複數監督式機器學習演算法進行分析，判斷為不正確的已知產地產品，可以正負5%以內亂數產生複數組虛擬的亂數物理化學屬性，產生更多虛擬的已知產地產品資訊，再供判斷不正確監督式機器學習演算法，可更快速且簡易的將該監督式機器學習演算法訓練學習成優化監督式機器學習演算法，且可判斷為正確演算答案之機率，該機率最高之監督式機器學習演算法判定該演算法為最佳監督式機器學習演算法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(10A)、(10B)、(10C):已知產地產品</p>
        <p type="p">(11A)、(11B)、(11C):已知物理化學屬性</p>
        <p type="p">(12A)、(12B)、(12C):對應產地訊息</p>
        <p type="p">(12A2)、(12B2)、(12C2):亂數物理化學屬性</p>
        <p type="p">(20A)、(20B)、(20C):監督式機器學習演算法</p>
        <p type="p">(20A2)、(20B2)、(20C2):優化監督式機器學習演算法</p>
        <p type="p">(20D):最佳監督式機器學習演算法</p>
        <p type="p">(21A)、(21B)、(21C):初次演算答案</p>
        <p type="p">(22A):正確演算答案</p>
        <p type="p">(23A):不正確演算答案</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="638px" img-content="tif" inline="yes" orientation="portrait" width="737px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621551</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144211</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241128B">A01C15/00</main-classification>
        <further-classification edition="200601120241128B">A01C5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>果園施肥裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作係一種果園施肥裝置，其包含設置於車體的儲料斗、轉向機構、啟閉機構、翻耕機構及橫移機構，轉向機構能控制儲料斗的出料口方向，啟閉機構能控制儲料斗的出料口啟閉，橫移機構能控制翻耕機構相對車體左右方向線性橫移，本創作果園施肥裝置能依據果樹的位置，透過該轉向機構及該橫移機構控制儲料斗及翻耕機構轉向及移動至對應側，以進行多方向的施肥作業，並透過同步控制所述儲料斗的出料口方向以及該翻耕機構的位置，使儲料斗能配合果樹的位置傾倒肥料後，透過位在後方的翻耕機構進行翻耕混合的動作，以提高土壤吸收肥料的效率，並降低肥料流失及土壤酸化的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:儲料斗</p>
        <p type="p">11:儲料槽</p>
        <p type="p">12:出料口</p>
        <p type="p">13:導引板</p>
        <p type="p">20:轉向機構</p>
        <p type="p">30:啟閉機構</p>
        <p type="p">31:啟閉驅動件</p>
        <p type="p">32:閘門</p>
        <p type="p">40:翻耕機構</p>
        <p type="p">41:外罩</p>
        <p type="p">42:旋耕輪</p>
        <p type="p">50:橫移機構</p>
        <p type="p">60:送料機構</p>
        <p type="p">61:送料驅動件</p>
        <p type="p">611:驅動軸</p>
        <p type="p">62:送料鏈</p>
        <p type="p">621:鏈條</p>
        <p type="p">70:鑽孔機構</p>
        <p type="p">71:鑽孔驅動件</p>
        <p type="p">72:鑽孔螺桿</p>
        <p type="p">80:升降機構</p>
        <p type="p">90:車體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="647px" img-content="tif" inline="yes" orientation="portrait" width="1033px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623436</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144217</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260303B">H10D84/03</main-classification>
        <further-classification edition="202601120260303B">H10W10/00</further-classification>
        <further-classification edition="202501120260303B">H10D30/01</further-classification>
        <further-classification edition="202501120260303B">H10D84/80</further-classification>
        <further-classification edition="202501120260303B">H10D30/60</further-classification>
        <further-classification edition="202501120260303B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堯展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAO-JHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛勝元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, SHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李國興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUO-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康智凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHIH-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱永振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YUNG-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, GUAN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體元件及其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種半導體元件，其主要包含一基底包含一非平面元件區以及一平面元件區，一第一隔離結構設於該平面元件區之該基底內，一第一閘極結構設於該第一隔離結構上，一第一磊晶層設於該第一閘極結構旁，一第二隔離結構設於該非平面元件區之該基底內，一第二閘極結構設於該第二隔離結構上以及一第二磊晶層設於該第二閘極結構旁，其中第一閘極結構包含第一金屬閘極且第二閘極結構包含第二金屬閘極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate having a non-planar device region and a planar device region, a first isolation structure in the substrate of the planar device region, a first gate structure on the first isolation structure, a first epitaxial layer adjacent to the first gate structure, a second isolation structure in the substrate of the non-planar device region, a second gate structure on the second isolation structure, and a second epitaxial layer adjacent to the second gate structure. Preferably, the first gate structure includes a first metal gate and the second gate structure includes a second metal gate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:基底</p>
        <p type="p">14:非平面元件區</p>
        <p type="p">16:平面元件區</p>
        <p type="p">20:鰭狀結構</p>
        <p type="p">22:隔離結構</p>
        <p type="p">24:隔離結構</p>
        <p type="p">32:閘極結構</p>
        <p type="p">34:閘極結構</p>
        <p type="p">38:側壁子</p>
        <p type="p">40:磊晶層</p>
        <p type="p">42:源極/汲極區域</p>
        <p type="p">44:層間介電層</p>
        <p type="p">48:介質層</p>
        <p type="p">50:介質層</p>
        <p type="p">52:高介電常數介電層</p>
        <p type="p">54:功函數金屬層</p>
        <p type="p">56:低阻抗金屬層</p>
        <p type="p">60:金屬閘極</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="483px" img-content="tif" inline="yes" orientation="portrait" width="677px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621942</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144219</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B64C25/24</main-classification>
        <further-classification edition="202301120241230B">B64U70/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊光勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KUANG-SHINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許昭傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHAO CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇炳華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, PING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍聰義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, TSUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許偉倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈閎駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HUNG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>停靠無人機的方法和無人機系統</chinese-title>
        <english-title>METHOD OF DOCKING DRONE AND DRONE SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種停靠無人機的方法和無人機系統。方法包含：在停靠平台上配置第一充電端子；判斷無人機是否降落在停靠平台；以及響應於無人機降落在停靠平台，驅動第一推桿以將無人機推至停靠平台上的預設位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of docking a drone and a drone system are provided. The method includes: configuring a first charging terminal on a docking plate; determining whether a drone is landed on the docking plate; and in response to the drone being landed on the docking plate, driving a pusher rod to push the drone to a default position on the docking plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S102,S103:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="502px" img-content="tif" inline="yes" orientation="portrait" width="485px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623160</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144220</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">H02M1/084</main-classification>
        <further-classification edition="200601120250401B">H02M3/158</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶豪科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YAO-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳曜洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ISAAC Y.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪鼎杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多相位恆定開啟時間控制器及採用該控制器的電源轉換器</chinese-title>
        <english-title>MULTIPLE-PHASE CONSTANT ON-TIME CONTROLLER AND POWER CONVERTER USING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多相位恆定開啟時間控制器及採用該控制器的電源轉換器被揭露於此。在電源轉換器中，相位控制器將一完整COT控制訊號分成一主COT控制訊號和至少一從COT控制訊號。該主COT控制訊號觸發一主PWM訊號產生器，以相應地產生一主PWM訊號，而各從COT控制訊號觸發相應的從PWM訊號產生器，透過比較一主驅動器的一感測電流與相應從驅動器的一感測電流，調整相應從COT控制訊號的各脈衝寬度，藉此產生相應從驅動器的從PWM訊號。隨後，該主驅動器根據該主PWM訊號為負載裝置提供一主電流輸出，各從驅動器則根據對應的從PWM訊號為該負載裝置提供一從電流輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multiple-phase constant on-time controller and a power converter using the controller are disclosed herein. In the power converter, a phase controller divides a full COT control signal into a master COT control signal and at least one slave COT control signal. The master COT control signal triggers a master PWM-signal generator to generate a master PWM signal accordingly, and each slave COT control signal triggers a corresponding slave PWM-signal generator to generate the slave PWM signal for a corresponding slave driver by adjusting a width of each pulse of the corresponding slave COT control signal according to a comparison between a sensed current of a master driver and a sensed current of the corresponding slave driver. Then, the master driver provides a master current output for a load device according to a master PWM signal, and each slave driver provides a slave current output for the load device according to the slave PWM signal corresponding thereto.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電源轉換器</p>
        <p type="p">11:主驅動器</p>
        <p type="p">12_1~12_n:從驅動器</p>
        <p type="p">13:多相位COT控制器</p>
        <p type="p">131:主PWM訊號產生器</p>
        <p type="p">132_1~132_n:從PWM訊號產生器</p>
        <p type="p">133:相位控制器</p>
        <p type="p">2:負載裝置</p>
        <p type="p">CF1:完整COT控制訊號</p>
        <p type="p">CS11:感測電流</p>
        <p type="p">CS21~CS2n:感測電流</p>
        <p type="p">CSM1:主COT控制訊號</p>
        <p type="p">CSS1~CSSn:從COT控制訊號</p>
        <p type="p">MO1:主電流輸出</p>
        <p type="p">P1:主PWM訊號</p>
        <p type="p">P21~P2n:從PWM訊號</p>
        <p type="p">SO_1~SO_n:從電流輸出</p>
        <p type="p">VT:電流輸出</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="652px" img-content="tif" inline="yes" orientation="portrait" width="970px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623300</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144223</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200901120250212B">H04W92/02</main-classification>
        <further-classification edition="202201120250212B">H04L49/10</further-classification>
        <further-classification edition="200601120250212B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯陽半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITE TECH. INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐崇平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無線通用串列匯流排集線器及其操作方法</chinese-title>
        <english-title>WIRELESS UNIVERSAL SERIAL BUS HUB AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線通用串列匯流排集線器及其操作方法。無線通用串列匯流排集線器包括本地裝置以及遠程裝置。遠程裝置通訊連接至本地裝置。本地裝置分別自至少一第一裝置接收至少一資料、至少一校驗碼及至少一識別碼。本地裝置基於至少一資料、至少一校驗碼及至少一識別碼生成資料封包，並將資料封包無線傳輸至遠程裝置。遠程裝置基於資料封包生成串行差分資料，並將串行差分資料輸出至第二裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless universal serial bus hub and an operation method thereof. The wireless universal serial bus hub includes a local side device and a remote side device. The local side device communicatively connects to the remote side device. The local side device receives at least one data, at least one check code and at least one identifier from at least one first device respectively. The local side device generates and outputs a data packet based on the at least one data, the at least one check code and the at least one identifier and wirelessly transmits the data packet to the remote side device. The remote side device generates a serial differential data based on the data packet and outputs the serial differential data to a second device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501、S502、S503、S504:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="630px" img-content="tif" inline="yes" orientation="portrait" width="661px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622611</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144224</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241203B">G02F1/1333</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商冠捷投資有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOP VICTORY INVESTMENTS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王雯誼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MI, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包含一顯示面板及平貼於該顯示面板的一框體。該框體包括一內框，及相反於該顯示面板地連接設置在該內框的一外框。該內框具有一第一邊條。該第一邊條具有在一寬度方向上延伸的一表面、藉由該表面在該寬度方向上相間隔的一第一側面及一第二側面、及凹陷於該表面且延伸穿過該第一側面及該第二側面的一重工槽。該顯示裝置藉由設置該內框的該重工槽，便於輕易將該顯示面板與該內框分離以利重新加工，且不破壞框體的整體結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">2:顯示面板</p>
        <p type="p">3:框體</p>
        <p type="p">5:內框</p>
        <p type="p">51:邊條</p>
        <p type="p">51A:第一邊條</p>
        <p type="p">511:表面</p>
        <p type="p">512:第一側面</p>
        <p type="p">513:第二側面</p>
        <p type="p">514:重工槽</p>
        <p type="p">6:外框</p>
        <p type="p">X:寬度方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="763px" img-content="tif" inline="yes" orientation="portrait" width="952px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623372</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144227</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D8/00</main-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳厚潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HOU-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>覆晶式二極體結構及其製造方法</chinese-title>
        <english-title>FLIP-CHIP DIODE STRUCTURE AND MANAFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種覆晶式二極體結構，其包含一基底、二接面區、二金屬電極及一介電層。其中，基底具有二弧形凹槽，分別設置於基底之二側邊緣。二接面區設置於基底中。二金屬電極分別設置於基底之同一側面，且各自電性連接二接面區其中之一。介電層覆蓋二弧形凹槽及二金屬電極間之基底上表面。二弧形凹槽係各自鄰接二金屬電極其中之一外側，且二接面區於基底中之一最大深度小於二弧形凹槽之一深度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flip-chip diode structure is provided, which comprises: a substrate, two junction regions, two metal electrodes and a dielectric layer. The substrate includes two arc recesses, respectively disposed at opposite edges of the substrate. The two junction regions are disposed within the substrate. Two metal electrodes are disposed on the same side of the substrate and each electrically connected to one of the two junction regions. The dielectric layer covers the arc recesses and the top surface of the substrate between the two metal electrodes. Each of the arc recesses is adjacent to the outer side of one of the metal electrodes, and the maximum depth of the two junction regions within the substrate is less than the depth of the arc recesses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板</p>
        <p type="p">100:覆晶式二極體結構</p>
        <p type="p">110:基底</p>
        <p type="p">120:P型接面區</p>
        <p type="p">130:N型接面區</p>
        <p type="p">140:弧形凹槽</p>
        <p type="p">150:金屬電極</p>
        <p type="p">160:介電層</p>
        <p type="p">170:焊料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="651px" img-content="tif" inline="yes" orientation="portrait" width="901px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622167</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144230</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C08K3/22</main-classification>
        <further-classification edition="200601120241220B">C08K3/34</further-classification>
        <further-classification edition="200601120241220B">C08L101/00</further-classification>
        <further-classification edition="200601120241220B">B28B1/00</further-classification>
        <further-classification edition="200601120241220B">B28B3/00</further-classification>
        <further-classification edition="200601120241220B">B28B11/24</further-classification>
        <further-classification edition="200601120241220B">B28B17/00</further-classification>
        <further-classification edition="202201120241220B">B09B3/24</further-classification>
        <further-classification edition="202201120241220B">B09B3/32</further-classification>
        <further-classification edition="202201120241220B">B09B3/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康爾富照明股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMFORT LIGHTING INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭遠揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YUAN YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有回收陶瓷礙子的環保複合石板及其製造方法</chinese-title>
        <english-title>ENVIRONMENTAL FRIENDLY COMPOSITE STONE SLAB WITH RECYCLED CERAMIC BARRIERS AND ITS MANUFACTURING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種具有回收陶瓷礙子的環保複合石板及其製造方法，該環保複合石板的原料包含回收陶瓷礙子切片、回收陶瓷礙子顆粒、石英顆粒以及樹脂，將汰換的陶瓷礙子經過回收處理步驟後形成該回收陶瓷礙子切片及回收陶瓷礙子顆粒，隨後進行設置步驟、混合步驟、成型步驟以及固化步驟，以製造出呈現有礙子斷面的環保複合石板，據此，本發明不僅促進了被淘汰陶瓷礙子的回收和有效再利用，還成功地將這些廢棄物納入循環經濟的範疇，以及賦予其深刻的環保教育意義，提升大眾對環境保護的意識與重視。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An environmental friendly composite stone slab with recycled ceramic barriers and its manufacturing method, the raw materials of the environmentally friendly composite stone slab include recycled ceramic barrier slides, recycled ceramic barrier particles, quartz particles and resin, the recycled ceramic barrier slides and the recycled ceramic barrier particles are formed after recycling the ceramic barriers, and then setting, mixing, forming and curing steps are performed to create the environmentally friendly composite stone slab with barrier sections, thereby, the present method not only promotes the recycling and effective reuse of the eliminated ceramic barriers, but also successfully brings these wastes into the category of circular economy, gives it profound environmental education significance, and enhances the public's awareness and attention to environmental protection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:回收處理步驟</p>
        <p type="p">S20:設置步驟</p>
        <p type="p">S30:混合步驟</p>
        <p type="p">S40:成型步驟</p>
        <p type="p">S50:固化步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="757px" img-content="tif" inline="yes" orientation="portrait" width="465px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621636</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144233</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250629B">A61B3/14</main-classification>
        <further-classification edition="200601120250629B">A61B3/10</further-classification>
        <further-classification edition="202201120250629B">G06V40/19</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彰化基督教醫療財團法人彰化基督教醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉森永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃怡真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊明治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁勝富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊中平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奇業</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江佩倪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張睿壬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可智慧辨識瞳孔對光反應之擷取影像系統之方法及其裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可智慧辨識瞳孔對光反應之擷取影像系統之方法及其裝置，其方法包含下列步驟：一罩體依附一人體頭部步驟；罩體第一側設有一第一開口而相鄰地對應於一人體眼部及罩體第二側設有一第二開口而對應於人體眼部及一攝像裝置步驟；二分別設於罩體二邊側之邊開口並連通罩體內部空間之牽引部被驅動至一初始位置步驟；攝像裝置藉二位於罩體內部空間燈光部的照明來擷取一眼部影像、一牽引部影像、一瞳孔對光反應之一瞳孔影像或前述任一組合步驟；攝像裝置提供眼部影像予一影像偵測辨識系統偵測係睜眼或閉眼步驟；影像偵測辨識系統依眼部影像及牽引部影像來辨識後進行牽引眼部之上眼皮及獲取瞳孔影像被進行一影像偵測辨識程序，用以辨識該人體之功能或意識狀態資訊並傳遞資訊予一資料庫步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:罩體</p>
        <p type="p">13:第一基座</p>
        <p type="p">14:縱向基座</p>
        <p type="p">15:第二基座</p>
        <p type="p">16:橫向基座</p>
        <p type="p">17:第一驅動部</p>
        <p type="p">18:第二驅動部</p>
        <p type="p">19:牽引部</p>
        <p type="p">20:燈光部</p>
        <p type="p">22:第一側</p>
        <p type="p">24:第二側</p>
        <p type="p">26:邊側</p>
        <p type="p">28:內部空間</p>
        <p type="p">221:第一開口</p>
        <p type="p">301:攝像裝置</p>
        <p type="p">281:次空間</p>
        <p type="p">261:邊開口</p>
        <p type="p">32:第一滑部</p>
        <p type="p">42:第二滑部</p>
        <p type="p">52:第三滑部</p>
        <p type="p">62:第四滑部</p>
        <p type="p">92:第三馬達</p>
        <p type="p">94:撥桿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="726px" img-content="tif" inline="yes" orientation="portrait" width="996px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622488</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144234</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260303B">G01N21/88</main-classification>
        <further-classification edition="202601120260303B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翔緯光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHYAWEI OPTRONICS CORPORATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭昆賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KUN HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭昆賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KUN HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃富源</last-name>
                <first-name>桃園市中壢區延平路500號12樓之1　B室</first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>鍍層檢測設備、方法及鍍層設備</chinese-title>
        <english-title>COATING LAYER DETECTION APPARATUS, METHOD AND COATING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鍍層檢測設備，係用於檢測覆蓋於基板之鍍層是否有缺陷，其具有第一側向光源、第一取像裝置與控制器。第一側向光源面向基板的第一邊側，並用於發射第一側向光線至第一邊側，其中基板具有貫穿其第一表面與第二表面的複數個穿孔，第一側向光線經由第一邊側進入基板內部，且鍍層為不透光材質。第一取像裝置面向第一表面，並用於拍攝第一表面，以形成第一圖像。控制器電性連接第一側向光源與第一取像裝置，並用於控制第一側向光源與第一取像裝置，並根據第一圖像是否存有第一漏光光斑來判讀鍍層是否有缺陷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coating layer detection apparatus is used to detect whether a coating layer covering a substrate has a defective. The coating layer detection apparatus includes a first lateral light source, a first imaging device and a controller. The first lateral light source faces a first side of the substrate and is used to emit the first lateral light to the first side, wherein the substrate has a plurality of vias penetrating a first surface and a second surface of the substrate, and the first lateral light passes through the first side to enter inside of the substrate, and the coating layer is made of opaque material. The first imaging device faces the first surface and is used to photograph the first surface to form a first image. The controller is electrically connected to the first lateral light source and the first imaging device, and is used to control the first lateral light source and the first imaging device, and determine whether the coating layer has the defective based on whether there is a first light leakage spot in the first image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">101:第一邊側</p>
        <p type="p">102:第二邊側</p>
        <p type="p">105:第一表面</p>
        <p type="p">106:第二表面</p>
        <p type="p">107:穿孔</p>
        <p type="p">11:鍍層</p>
        <p type="p">11D:缺陷</p>
        <p type="p">211:第一側向光源</p>
        <p type="p">212:第二側向光源</p>
        <p type="p">221:第一取像裝置</p>
        <p type="p">222:第二取像裝置</p>
        <p type="p">23:控制器</p>
        <p type="p">241:第一輔助光源</p>
        <p type="p">242:第二輔助光源</p>
        <p type="p">251:第一遠心鏡取像模組</p>
        <p type="p">252:第二遠心鏡取像模組</p>
        <p type="p">LH1:第一輔助光線</p>
        <p type="p">LH2:第二輔助光線</p>
        <p type="p">LS1:第一側向光線</p>
        <p type="p">LS2:第二側向光線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="711px" img-content="tif" inline="yes" orientation="portrait" width="941px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623155</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144237</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">H02M1/08</main-classification>
        <further-classification edition="200601120241204B">H02M3/335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仲恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHONG-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡子翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, TZU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種用於諧振轉換器之控制裝置、控制方法及其非暫態電腦可讀儲存媒介</chinese-title>
        <english-title>A CONTROL DEVICE, CONTROL METHOD AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM THEREOF FOR RESONANCE CONVERTER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於諧振轉換器之控制裝置，係電性連接諧振轉換器。控制裝置包括電流轉換器與控制電路。電流轉換器係電性連接諧振轉換器的二次側電路，以測量二次側諧振電流之電流值。控制電路係電性連接於電流轉換器，以得到二次側諧振電流之電流值，且根據二次側諧振電流之電流值計算二次側諧振電流的至少一換向時間，以根據換向時間產生延遲時間控制訊號。並且，控制電路根據延遲時間控制訊號調變二次側電路的至少一開關元件的狀態轉換的延遲時間，致使狀態轉換被延遲至二次側諧振電流的交換方向完成之後。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control device for a resonant converter, is electrically connected to the resonant converter. The control device includes a current converter and a control circuit. The current converter is electrically connected to a secondary side circuit of the resonant converter, so as to measure a current value of the secondary side resonant current. The control circuit is electrically connected to the current converter, so as to obtain the current value of the secondary side resonance current, and calculate at least one exchange direction time of the secondary side resonance current based on the current value of the secondary side resonance current, so as to generate a delay time control signal based on the exchange direction time. Furthermore, the control circuit modulates a delay time of a state transition of at least one switching element of the secondary side circuit based on the delay time control signal, such that the state transition is delayed until the exchange direction for the secondary side resonant current is completed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:控制裝置</p>
        <p type="p">2000:諧振轉換器</p>
        <p type="p">100,100':電流轉換器</p>
        <p type="p">1100:控制電路</p>
        <p type="p">V&lt;sub&gt;BUS&lt;/sub&gt;:輸入電壓</p>
        <p type="p">V&lt;sub&gt;BAT&lt;/sub&gt;:輸出電壓</p>
        <p type="p">I&lt;sub&gt;BUS&lt;/sub&gt;:輸入電流</p>
        <p type="p">I&lt;sub&gt;BAT&lt;/sub&gt;:輸出電流</p>
        <p type="p">C&lt;sub&gt;in&lt;/sub&gt;:輸入電容</p>
        <p type="p">C&lt;sub&gt;out&lt;/sub&gt;:輸出電容</p>
        <p type="p">2010:一次側電路</p>
        <p type="p">2020:二次側電路</p>
        <p type="p">110,120,130,140,210,220,230,240:開關元件</p>
        <p type="p">C&lt;sub&gt;r_Pri&lt;/sub&gt;,C&lt;sub&gt;r_Sec&lt;/sub&gt;:諧振電容</p>
        <p type="p">L&lt;sub&gt;r_Pri&lt;/sub&gt;,L&lt;sub&gt;r_Sec&lt;/sub&gt;:諧振電感</p>
        <p type="p">L&lt;sub&gt;m&lt;/sub&gt;:磁化電感</p>
        <p type="p">N&lt;sub&gt;P&lt;/sub&gt;:一次側線圈</p>
        <p type="p">N&lt;sub&gt;S&lt;/sub&gt;:二次側線圈</p>
        <p type="p">Q&lt;sub&gt;A&lt;/sub&gt;,Q&lt;sub&gt;B&lt;/sub&gt;,Q&lt;sub&gt;C&lt;/sub&gt;,Q&lt;sub&gt;D&lt;/sub&gt;,Q&lt;sub&gt;E&lt;/sub&gt;,Q&lt;sub&gt;F&lt;/sub&gt;,Q&lt;sub&gt;G&lt;/sub&gt;,Q&lt;sub&gt;H&lt;/sub&gt;:電晶體</p>
        <p type="p">n1:節點</p>
        <p type="p">I&lt;sub&gt;Lr_Pri&lt;/sub&gt;:一次側諧振電流</p>
        <p type="p">I&lt;sub&gt;Lr_Sec&lt;/sub&gt;:二次側諧振電流</p>
        <p type="p">SI:電流訊號</p>
        <p type="p">DT1:延遲時間控制訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="740px" img-content="tif" inline="yes" orientation="portrait" width="1013px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622963</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144238</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241126B">G11C7/18</main-classification>
        <further-classification edition="200601120241126B">G11C8/14</further-classification>
        <further-classification edition="200601120241126B">G11C11/401</further-classification>
        <further-classification edition="200601120241126B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊書孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHU-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體元件</chinese-title>
        <english-title>MEMORY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體元件，包括第一位元線、第一字元線、第二位元線及第二字元線、感測放大器電路以及電壓提供電路。第一位元線及第二位元線分別耦接到第一記憶體單元及第二記憶體單元。第二位元線與第一位元線互補。感測放大器電路包括第一電晶體及第二電晶體。第一電晶體及第二電晶體串聯耦接在第一位元線及第二位元線之間。感測放大器電路包括位在第一位元線及第二位元線之間的第一節點。電壓提供電路耦接到感測放大器電路。電壓提供電路用以在儲存位元電位資料後修復期間提供第一電壓給第一節點。第一電壓為負電壓，且儲存位元電位資料後修復期間在儲存位元電位資料感測及預修復期間與位元線預充電期間之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device including a first bit line, a first word line, a second bit line, a second word line, a sensing amplifier circuit, and a voltage providing circuit is provided. The first bit line and the second bit line are coupled to a first memory cell and a second memory cell, respectively. The second bit line is complementary to the first bit line. The sensing amplifier circuit includes a first transistor and a second transistor. The first transistor and the second transistor are coupled in series between the first bit line and the second bit line. The sensing amplifier circuit includes a first node located between the first bit line and the second bit line. The voltage providing circuit is coupled to the sensing amplifier circuit. The voltage providing circuit is configured to provide a first voltage to the first node during a post-restoration period for storing a bit voltage data. The first voltage is a negative voltage, and the post- restoration period for storing the bit voltage data is between a sensing and pre-restoration period for storing the bit voltage data and a pre-charge period of a bit line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體元件</p>
        <p type="p">111、112:記憶體單元</p>
        <p type="p">120:感測放大器電路</p>
        <p type="p">130:等化器電路</p>
        <p type="p">140:電壓提供電路</p>
        <p type="p">141:第一電壓提供單元</p>
        <p type="p">142:第二電壓提供單元</p>
        <p type="p">BL:第一位元線</p>
        <p type="p">BLB:第二位元線</p>
        <p type="p">CS:電容器</p>
        <p type="p">EQL、NPRS、NSET、PSETA、PSETB:控制信號</p>
        <p type="p">MN1:第一電晶體</p>
        <p type="p">MN2:第二電晶體</p>
        <p type="p">MP1:第三電晶體</p>
        <p type="p">MP2:第四電晶體</p>
        <p type="p">MN5:第五電晶體</p>
        <p type="p">MN6:第六電晶體</p>
        <p type="p">MN7:第七電晶體</p>
        <p type="p">MN8:第八電晶體</p>
        <p type="p">MN9:第一等化電晶體</p>
        <p type="p">MN10:第二等化電晶體</p>
        <p type="p">N1、N2、SN:節點</p>
        <p type="p">V1、V2、V3、VDD、VSS:電壓</p>
        <p type="p">VPL:極板電壓</p>
        <p type="p">WL1:第一字元線</p>
        <p type="p">WL2:第二字元線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="566px" img-content="tif" inline="yes" orientation="portrait" width="1007px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622806</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144239</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120241204B">G06N3/08</main-classification>
        <further-classification edition="202301120241204B">G06N3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宣緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, XUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芷綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於剪枝模型的裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR PRUNING MODEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於剪枝模型的裝置及方法。所述方法包括以下步驟：層異常值獲得模組將校準資料集輸入至模型來獲得對應於多個層的每一者的層異常值，其中模型包括多個層；候選層選擇模組利用層異常值來從多個層中選擇出候選層；層剪枝模組從模型剪枝候選層來獲得剪枝後的模型；層融合模組利用候選層以及剪枝後的模型來獲得融合後的模型；以及壓縮規格模組判斷模型是否符合壓縮規格。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device and a method for pruning a model are provided. The method includes following steps: a layer outlier obtaining module inputs a calibration data set into the model to obtain a layer outlier corresponding to each of a plurality of layers, wherein the model includes the plurality of layers; a candidate layer selection module utilizes the layer outlier to select a candidate layer from the plurality of layers; a layer pruning module prunes the candidate layer from the model to obtain the pruned model; a layer fusion module uses candidate layer and the pruned model to obtain the fused model; and a compression specification module determines whether the model meets a compression specification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S21、S22、S23、S24、S25、S26:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="733px" img-content="tif" inline="yes" orientation="portrait" width="864px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623492</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144240</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120241127B">H10K50/858</main-classification>
        <further-classification edition="202301120241127B">H10K50/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝嘉定</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIA-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子芩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉展睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHAN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示面板</chinese-title>
        <english-title>DISPLAY PANEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板，包括第一基板、第二基板以及多個像素單元，各像素單元包括發光元件、光學層、微結構層以及低折射率層。發光元件配置於第一基板的內表面上。光學層覆蓋發光元件。微結構層配置於光學層遠離第一基板的內表面的頂面上。低折射率層配置於第二基板以及微結構層之間。低折射率層的折射率小於微結構層的折射率以及第二基板的折射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel including a first substrate, a second substrate and a plurality of pixel units is provided. Each pixel unit includes a light emitting element, an optical layer, a micro structure layer and a low refractive index layer. The light emitting element is disposed on an inner surface of the first substrate. The optical layer covers the light emitting element. The micro structure layer is disposed on a top surface of the optical layer away from the inner surface of the first substrate. The low refractive index layer is disposed between the second substrate and the micro structure layer. A refractive index of the low refractive index layer is lower than that of the micro structure layer and the second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示面板</p>
        <p type="p">10:像素單元</p>
        <p type="p">30:堤結構</p>
        <p type="p">100:低折射率層</p>
        <p type="p">200:微結構層</p>
        <p type="p">300:光學層</p>
        <p type="p">301:透明層、散射層</p>
        <p type="p">302:色轉層</p>
        <p type="p">400:發光元件</p>
        <p type="p">S1:第一基板</p>
        <p type="p">S2:第二基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="500px" img-content="tif" inline="yes" orientation="portrait" width="767px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622018</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144241</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">C04B35/00</main-classification>
        <further-classification edition="200601120250108B">C04B35/106</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃天恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TIEN-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游勝閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SHENG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JUN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>陶瓷材料、陶瓷材料的形成方法、與陶瓷基板</chinese-title>
        <english-title>CERAMIC MATERIAL AND METHOD OF FORMING THE SAME AND CERAMIC SUBSTRATE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">陶瓷材料包括表面改質的氧化鋯晶鬚，分散於氧化鋁基質中，其中氧化鋁基質與表面改質的氧化鋯晶鬚的重量比為97:3至80:20；其中表面改質的氧化鋯晶鬚的表面具有強化相微結構，且強化相微結構的組成包括結晶相的鋁酸鍶。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A ceramic material includes surface modified zirconium oxide whiskers dispersed in aluminum oxide matrix, wherein the aluminum oxide matrix and the surface modified zirconium oxide whiskers have a weight ratio of 97:3 to 80:20, wherein the surface of the surface modified zirconium oxide whiskers includes a reinforced phase microstructure, and the composition of the reinforced phase microstructure includes crystalline strontium aluminate.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="315px" img-content="tif" inline="yes" orientation="portrait" width="456px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623073</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144242</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120241204B">H01M8/023</main-classification>
        <further-classification edition="201601120241204B">H01M8/0252</further-classification>
        <further-classification edition="201601120241204B">H01M8/0258</further-classification>
        <further-classification edition="201601120241204B">H01M8/04</further-classification>
        <further-classification edition="201601120241204B">H01M8/04014</further-classification>
        <further-classification edition="201601120241204B">H01M8/04082</further-classification>
        <further-classification edition="201601120241204B">H01M8/24</further-classification>
        <further-classification edition="201601120241204B">H01M8/2475</further-classification>
        <further-classification edition="201601120241204B">H01M8/2484</further-classification>
        <further-classification edition="201601120241204B">H01M8/2485</further-classification>
        <further-classification edition="202101120241204B">H01M50/533</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>地諾科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TINER TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商珠海市榮成科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG CHEN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈輝祖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIA, HUI-TSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>温良成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, LIANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>分流式燃料電池裝置</chinese-title>
        <english-title>SPLIT-FLOW FUEL CELL DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種分流式燃料電池裝置，其包含有一孔隙基材、一線圈及複數導電件。孔隙基材具有導電性，孔隙基材呈一管狀，並具有一反應層；線圈位於孔隙基材外側，線圈具有一纏繞段及一分流段，纏繞段與分流段連接，纏繞段纏繞於孔隙基材，而分流段則露出於孔隙基材；複數導電件相鄰於孔隙基材，複數導電件相互依序串接，各導電件之間形成一安裝區，線圈的分流段設置於安裝區。藉此，提升燃料電池裝置的電流承載能力。此外，氣體可以在孔隙基材的反應層完整進行反應。而氣體與離子交換反應的水，亦不會影響電化反應，從而提升反應效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A split-flow fuel cell device consisting of a porous substrate, a coil, and plural conductive parts. The porous substrate is electrically conductive, and the porous substrate is a tubular with a reactive layer; The coil is located on the outside of the porous substrate, and the coil has a winding segment and a shunt segment, the winding segment is connected with the shunt segment, the winding segment is wound around the porous substrate, and the shunt segment is exposed on the porous substrate; The plural conductive parts are adjacent to the porous substrate, the plural conductive parts are connected in series with each other in sequence, an installation area is formed between the conductive parts, and the shunt segment of the coil is arranged in the installation area. Thus, the current carrying capacity of the fuel cell device can be increased. In addition, the gas can react intact in the reaction layer of the porous substrate. The water of the gas and ion exchange reaction will not affect the electrochemical reaction, thereby improving the reaction efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:分流式燃料電池裝置</p>
        <p type="p">10:孔隙基材</p>
        <p type="p">12:連接部</p>
        <p type="p">121:小徑段</p>
        <p type="p">122:大徑段</p>
        <p type="p">20:線圈</p>
        <p type="p">21:纏繞段</p>
        <p type="p">22:分流段</p>
        <p type="p">30:導電件</p>
        <p type="p">31:安裝區</p>
        <p type="p">33:第二串接部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="1094px" img-content="tif" inline="yes" orientation="portrait" width="592px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622680</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144253</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">G05D23/19</main-classification>
        <further-classification edition="200601120241204B">G05D16/20</further-classification>
        <further-classification edition="200601120241204B">F28C3/06</further-classification>
        <further-classification edition="200601120241204B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周恬如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, TIEN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周恬如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, TIEN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>變動發熱量的發熱元件工作溫度控制系統</chinese-title>
        <english-title>OPERATING TEMPERATURE OF HEAT COMPONENT WITH VARIABLE CALORIFIC VALUE CONTROL SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種變動發熱量的發熱元件工作溫度控制系統，該系統是以相變化原理為主要散熱途徑以實現熱管理，當工作溫度被控制為接面溫度時，依據工作溫度變化以及散熱裝置內的壓力值計算出散熱裝置內的目標壓力值，控制器控制外循環控制閥、內循環控制閥以及/或是壓力控制閥的閥門開啟幅度以達到散熱裝置內的目標壓力值，藉此可以達成精準控制變動發熱量的發熱元件工作溫度的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operating temperature of heat component with variable calorific value control system is provided. A liquid-gas phase change is a major heat dissipation path of the system to achieve thermal management. Target pressure in vapor chamber is calculated according to operating temperature and pressure in vapor chamber when operating temperature is controlled to junction temperature. Valve opening range of external circulation control valve, internal circulation control valve and/or pressure control valve is/are controlled by controller to achieve target pressure value in vapor chamber. Therefore, the control of operating temperature of heat component which has variable heat flux can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:發熱元件</p>
        <p type="p">11:溫度感測器</p>
        <p type="p">12:散熱裝置</p>
        <p type="p">121:冷卻液入口</p>
        <p type="p">122:積液蒸氣出口</p>
        <p type="p">123:壓力控制口</p>
        <p type="p">13:熱交換器</p>
        <p type="p">131:內循環入口</p>
        <p type="p">132:內循環出口</p>
        <p type="p">133:外循環入口</p>
        <p type="p">134:外循環出口</p>
        <p type="p">14:外循環控制閥</p>
        <p type="p">15:泵浦</p>
        <p type="p">16:內循環控制閥</p>
        <p type="p">17:壓力感測器</p>
        <p type="p">18:壓力控制閥</p>
        <p type="p">19:控制器</p>
        <p type="p">21:儲存槽</p>
        <p type="p">22:壓力源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="722px" img-content="tif" inline="yes" orientation="portrait" width="737px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622166</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144254</doc-number>
          <kind></kind>
          <date>113/11/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250402B">C08J11/24</main-classification>
        <further-classification edition="200601120250402B">C08G63/685</further-classification>
        <further-classification edition="200601120250402B">C08G63/78</further-classification>
        <further-classification edition="200601120250402B">C08L67/00</further-classification>
        <further-classification edition="200601120250402B">C08K3/34</further-classification>
        <further-classification edition="200601120250402B">B01J29/70</further-classification>
        <further-classification edition="200601120250402B">B01J31/06</further-classification>
        <further-classification edition="202401120250402B">B01J35/50</further-classification>
        <further-classification edition="200601120250402B">B01J37/00</further-classification>
        <further-classification edition="200601120250402B">B01J37/02</further-classification>
        <further-classification edition="200601120250402B">C07B61/00</further-classification>
        <further-classification edition="200601120250402B">C07D317/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊家瑀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, JIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁文傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEUNG, MAN-KIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭如忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENG, RU-JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳福龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>合成一種以廢棄聚乳酸製備有機－無機複合材料（類玻璃體－分子篩）並應用於二氧化碳與環氧化物合成環狀碳酸酯的異相催化劑</chinese-title>
        <english-title>SYNTHESIZE A HETEROGENEOUS CATALYST FOR PREPARING ORGANIC-INORGANIC COMPOSITE MATERIALS (VITRIMER-MOLECULAR SIEVE) FROM WASTE POLYLACTIC ACID AND USE IT TO SYNTHESIZE CYCLIC CARBONATES FROM CARBON DIOXIDE AND EPOXIDES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種以廢棄聚乳酸製備有機-無機複合材料並應用於二氧化碳與環氧化物合成環狀碳酸酯的異相催化劑。具體地，該有機-無機複合材料是類玻璃體-分子篩，具有可重複使用和高催化效率的技術效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a heterogeneous catalyst for preparing organic-inorganic composite materials from waste polylactic acid and use it to synthesize cyclic carbonates from carbon dioxide and epoxides. Specifically, the organic-inorganic composite materials are vitrimer-molecular sieve and have reusable and high catalytic effect.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="485px" img-content="tif" inline="yes" orientation="portrait" width="689px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623216</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144255</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04B7/185</main-classification>
        <further-classification edition="202301120250303B">H04W72/04</further-classification>
        <further-classification edition="200601120250303B">H04L25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾信翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HSIN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭凱倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KAI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁庭榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, TING-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>在衛星通訊中配置無線電資源的方法和無線通訊裝置</chinese-title>
        <english-title>METHOD AND WIRELESS COMMUNICATION DEVICE OF CONFIGURING RADIO RESOURCE IN SATELLITE COMMUNICATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種在衛星通訊中配置無線電資源的方法和無線通訊裝置。方法包含：根據預編碼資訊以及第一通道矩陣計算第一通道矩陣增益和第一雜訊增益；取得查找表，其中查找表包含調變編碼方案、頻譜效率以及需求訊噪比之間的映射關係；計算用於增加第一用戶設備的第一基頻資料流的第一頻譜效率的第一功率變化以及用於增加第一用戶設備的第二基頻資料流的第二頻譜效率的第二功率變化；以及響應於第一功率變化小於第二功率變化，更新對應於第一用戶設備的第一基頻資料流的第一調變編碼方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and a wireless communication device of configuring radio resource in a satellite communication are provided. The method includes: calculating a first channel matrix gain and a first noise gain according to precoding information and a first channel matrix; obtaining a lookup table, wherein the lookup table includes a mapping relationship among a first modulation and coding scheme, a spectral efficiency, and a required signal-to-noise ratio; calculating a first power variation for increasing a first spectral efficiency of a first baseband data stream of a first user equipment and a second power variation for increasing a second spectral efficiency of a second baseband data stream of the first user equipment; and in response to the first power variation being less than the second power variation, updating a first modulation and coding scheme corresponding to the first baseband data stream of the first user equipment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S801,S802,S803,S804,S805:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="716px" img-content="tif" inline="yes" orientation="portrait" width="585px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623440</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144256</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260303B">H10D84/80</main-classification>
        <further-classification edition="202501120260303B">H10D30/60</further-classification>
        <further-classification edition="202501120260303B">H10D30/01</further-classification>
        <further-classification edition="202601120260303B">H10P32/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳學彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSUEH-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王世銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，包括：基底、閘極堆疊層、矽鍺通道層、第一及第二源極/汲極區以及第一及第二輕摻雜汲極層。矽鍺通道層形成於基底內，且由閘極堆疊層覆蓋。第一及第二源極/汲極區形成於基底內，且分別位於閘極堆疊層的兩相對側。第一及第二輕摻雜汲極層形成於基底內。第一輕摻雜汲極層位於矽鍺通道層與第一源極/汲極區之間，且第二輕摻雜汲極層位於矽鍺通道層與第二源極/汲極區之間。第一輕摻雜汲極層及第二輕摻雜汲極層各自包括矽鍺材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device of this invention is provided and includes a substrate, a gate electrode stack layer, a silicon germanium channel layer, first and second source/drain regions, and first and second lightly doped drain (LDD) layers. The silicon germanium channel layer is formed in the semiconductor substrate and covered by the gate electrode stack. The first and second source/drain regions are formed in the semiconductor substrate and are respectively located on two opposite sides of the gate electrode stack. First and second LDD layers are formed in the semiconductor substrate. The first LDD layer is formed between the silicon germanium channel layer and the first source/drain region, and the second LDD layer is formed between the silicon germanium channel layer and the second source/drain region. The LDD layer and the second LDD layer each includes a silicon germanium material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">101:基底</p>
        <p type="p">111,112:第一源極/汲極區，第二源極/汲極區</p>
        <p type="p">110a,110b:第一摻雜的矽鍺磊晶層/第一輕摻雜汲極層，第二摻雜的矽鍺磊晶層/第二輕摻雜汲極層</p>
        <p type="p">120:未摻雜的矽鍺磊晶層/矽鍺通道層</p>
        <p type="p">122:閘極介電層</p>
        <p type="p">124:功函數金屬層</p>
        <p type="p">126:多晶矽層</p>
        <p type="p">128,130:第一金屬層，第二金屬層</p>
        <p type="p">132:絕緣蓋層</p>
        <p type="p">136,138:第一閘極間隙壁，第二閘極間隙壁</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="385px" img-content="tif" inline="yes" orientation="portrait" width="564px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622984</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144257</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120241128B">G16H10/00</main-classification>
        <further-classification edition="201801120241128B">G16H10/65</further-classification>
        <further-classification edition="202201120241128B">G06V10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾明桉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MING-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翟崧雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAI, SUNG-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許嘉醇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃上睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHANG-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳楷翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KAI-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張竣皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張芷瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHI-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>照護自動化平台</chinese-title>
        <english-title>CARE AUTOMATION PLATFORM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種照護自動化平台，包含：系統主機、閘道器、藍牙穿戴裝置、一或多個毫米波雷達、一或多個網路型監控攝影機(IP Camera)以及雲端資料庫。藍牙穿戴裝置取得之患者位置資訊、網路型監控攝影機取得之患者影像數據、以及毫米波雷達取得之患者動作或姿勢的偵測訊號皆經由閘道器傳輸至系統主機，然後再上傳至雲端資料庫，以進行跌倒辨識的運算以及判斷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A care automation platform is disclosed, including: a system host, a gateway, a Bluetooth wearable device, one or more millimeter wave radars, one or more network-based surveillance cameras (IP cameras) and a cloud database. The patient's location information obtained by the Bluetooth wearable device, the patient image data obtained by the network surveillance camera, and the patient's movement or posture detection signal obtained by the millimeter wave radar are all transmitted to the system host through the gateway, and then uploaded to the cloud database to perform fall identification calculations and judgments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:照護自動化平台</p>
        <p type="p">50:系統主機</p>
        <p type="p">40:閘道器</p>
        <p type="p">10:藍牙穿戴裝置</p>
        <p type="p">30:一或多個毫米波雷達</p>
        <p type="p">20:一或多個網路型監控攝影機(IP Camera)</p>
        <p type="p">70:雲端資料庫</p>
        <p type="p">60:告警裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="870px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621921</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144259</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">B60R16/023</main-classification>
        <further-classification edition="202401120241204B">H04B5/00</further-classification>
        <further-classification edition="201901120241204B">G01R31/3835</further-classification>
        <further-classification edition="201301120241204B">B60R25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笠眾實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳啓定</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具電力管理功能的車載藍牙裝置及其電力管理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種具電力管理功能的車載藍牙裝置及其電力管理方法，車載藍牙裝置執行其電力管理方法，車載藍牙裝置判斷是否與外部裝置連線成功。當連線成功，且判斷電池電壓小於第一電壓閾值及大於第二電壓閾值時，車載藍牙裝置產生自動解鎖訊號，使車門解鎖，且產生低電量提示訊息至外部裝置。當連線成功，且判斷電池電壓小於第二電壓閾值時，車載藍牙裝置不產生自動解鎖訊號，但產生低電量提示訊息至外部裝置。如此，使用者便可通過外部裝置收到低電量提醒，並盡早更換電池，避免電池電量耗盡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:車載藍牙裝置</p>
        <p type="p">11:處理模組</p>
        <p type="p">12:藍牙收發模組</p>
        <p type="p">13:門鎖控制模組</p>
        <p type="p">14:電池模組</p>
        <p type="p">141:電池單元</p>
        <p type="p">142:電壓檢測單元</p>
        <p type="p">15:提示音模組</p>
        <p type="p">16:開關模組</p>
        <p type="p">20:外部裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="913px" img-content="tif" inline="yes" orientation="portrait" width="673px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622920</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144260</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120241230B">G08G1/14</main-classification>
        <further-classification edition="202401120241230B">G06Q50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笠眾實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳啓定</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>提供停車資訊的系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種提供停車資訊的系統及方法，包含一行動裝置、一可控制汽車執行上鎖或解鎖的車載裝置，當該行動裝置與配對的該車載裝置之間建立無線通訊連線後，該行動裝置持續判斷兩者是否維持在一連線狀態，一旦中斷該無線通訊，該行動裝置記錄斷線當下該行動裝置的座標資訊，作為該汽車的一停車座標；在該行動裝置中的一應用程式可根據使用者的操作指令而顯示一地圖畫面，在該地圖畫面上顯示對應該停車座標的標記；藉此，在不需於汽車安裝任何GPS裝置的前提下，本發明允許使用者查閱行動裝置而得知汽車的停車位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="687px" img-content="tif" inline="yes" orientation="portrait" width="598px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623213</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144261</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120241204B">H04B5/45</main-classification>
        <further-classification edition="202401120241204B">H04B5/00</further-classification>
        <further-classification edition="201301120241204B">B60R25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笠眾實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳啓定</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>車輛遙控器之藍牙中繼遙控裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種輛遙控器之藍牙中繼遙控裝置及方法，係將一遙控器模組(汽車鑰匙遙控器)電性連結至一藍牙中繼控制器，該藍牙中繼控制器用於接收一行動裝置所發出的一藍牙信號，並依據該藍牙信號輸出一控制信號至該遙控器模組，該遙控器模組即可控制汽車執行相對應的解鎖、上鎖等車輛相關操作；藉由本創作，在不需要對車輛進行任何破壞或改裝的情況下，使用者可使用行動裝置實現該汽車鑰匙遙控器的各種既有功能，不再侷限於直接實體操作該汽車鑰匙遙控器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:遙控器模組</p>
        <p type="p">11:第一電路板</p>
        <p type="p">12:處理器</p>
        <p type="p">13:信號發射電路</p>
        <p type="p">20:藍牙中繼控制器</p>
        <p type="p">21:第二電路板</p>
        <p type="p">22:藍牙處理器</p>
        <p type="p">23:藍牙收發模組</p>
        <p type="p">24:信號輸出電路</p>
        <p type="p">25:電池</p>
        <p type="p">26:車充連接埠</p>
        <p type="p">30:行動裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="687px" img-content="tif" inline="yes" orientation="portrait" width="984px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623240</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144262</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120241130B">H04L67/12</main-classification>
        <further-classification edition="200601120241130B">H04L9/32</further-classification>
        <further-classification edition="200601120241130B">B60R16/023</further-classification>
        <further-classification edition="201301120241130B">B60R25/00</further-classification>
        <further-classification edition="200601120241130B">B60R16/00</further-classification>
        <further-classification edition="201901120241130B">G06F17/00</further-classification>
        <further-classification edition="200601120241130B">G08G1/00</further-classification>
        <further-classification edition="202201120241130B">H04L65/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笠眾實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳啓定</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>車載裝置的共享系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種車載裝置的共享系統，主要係由雲端伺服器連接第一電子裝置及第二電子裝置。第一電子裝置及第二電子裝置連接車載藍牙裝置。車載藍牙裝置連接門鎖遙控器。當車主通過第一電子裝置啟動共享功能時，雲端伺服器驗證第二電子裝置。當通過驗證後，雲端伺服器發送使用許可確認給第二電子裝置。共享者通過第二電子裝置傳送上鎖訊號或解鎖訊號至車載藍牙裝置，讓車載藍牙裝置通過門鎖遙控器控制該汽車執行上鎖或解鎖。如此一來，車主只需通過第一電子裝置啟動共享功能，無需將汽車鑰匙親手交付到共享者手上，讓車主能方便地分享汽車的使用權限給共享者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一電子裝置</p>
        <p type="p">20:第二電子裝置</p>
        <p type="p">30:雲端伺服器</p>
        <p type="p">40:車載藍牙裝置</p>
        <p type="p">50:網路</p>
        <p type="p">60:門鎖遙控器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="932px" img-content="tif" inline="yes" orientation="portrait" width="581px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622615</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144263</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250121B">G02F1/13357</main-classification>
        <further-classification edition="200601120250121B">G02F1/1335</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光森科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EOSOPTO TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳科宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊文勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WEN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昇聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHENG-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林贈連</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSENG- LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>光源模組</chinese-title>
        <english-title>LIGHT SOURCE MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光源模組包括電路板、發光元件、封裝層與多個微腔體。發光元件設置在電路板的基板表面上，且電性連接電路板。封裝層直接覆蓋基板表面與發光元件，且具有連接基板表面的第一表面。多個微腔體內嵌在封裝層內。這些微腔體的至少一部分緊鄰第一表面設置，且沿著基板表面的法線方向不重疊於發光元件的出光面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light source module including a circuit board, a light emitting device, an encapsulation layer and a plurality of microcavities is provided. The light emitting device is disposed on a substrate surface of the circuit board, and is electrically connected to the circuit board. The encapsulation layer directly covers the substrate surface and the light emitting device, and has a first surface connected to the substrate surface. The plurality of microcavities are embedded in the encapsulation layer. At least part of the microcavities is disposed adjacent to the first surface, and does not overlap with a light emitting surface of the light emitting device along a normal direction of the substrate surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光源模組</p>
        <p type="p">100:電路板</p>
        <p type="p">100s:基板表面</p>
        <p type="p">110:防焊油墨層</p>
        <p type="p">120:發光元件</p>
        <p type="p">120es:出光面</p>
        <p type="p">140:封裝層</p>
        <p type="p">140s1:第一表面</p>
        <p type="p">140s2:第二表面</p>
        <p type="p">A1、A2、A3:區域</p>
        <p type="p">CV1、CV2、CV3:微腔體</p>
        <p type="p">L:光線</p>
        <p type="p">Sc1、Su:間距</p>
        <p type="p">U1:反射單元</p>
        <p type="p">U2:調光單元</p>
        <p type="p">U3:折光單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="411px" img-content="tif" inline="yes" orientation="portrait" width="943px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623275</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144268</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H04R3/04</main-classification>
        <further-classification edition="200601120260302B">H04R5/04</further-classification>
        <further-classification edition="202601120260302B">H04R1/10</further-classification>
        <further-classification edition="200601120260302B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>固昌通訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, BILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>聲音調整裝置與聲音供應系統</chinese-title>
        <english-title>SOUND ADJUSTMENT DEVICE AND SOUND SUPPLY SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聲音調整裝置與聲音供應系統。聲音調整裝置包括一音訊接收元件、一頻率調整器以及一輸出埠。音訊接收元件用以接收一音訊。頻率調整器訊號連接音訊接收元件，並用以將音訊調整為一左耳音訊與一右耳音訊。左耳音訊的一第一頻率與右耳音訊的一第二頻率具有一頻率差值。頻率差值是由頻率調整器決定。輸出埠用以連接一耳機，將左耳音訊輸出至耳機的一左耳喇叭，並將右耳音訊輸出至耳機的一右耳喇叭。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sound adjustment device and a sound supply system are provided. The sound adjustment device includes an audio signal receiver, a frequency adjuster and an output port. The audio signal receiver is used to receive audio signals. The frequency adjuster signally connects the audio signal receiver, and is used to adjust the audio signals into left ear audio signals and right ear audio signals. A first frequency of the left ear audio signal and a second frequency of the right ear audio signal have a frequency difference. The frequency difference is determined by the frequency adjuster. The output port is used to connect an earphone, output left ear audio signals to a left ear speaker of the earphone, and output right ear audio signals to a right ear speaker of the earphone.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:耳機</p>
        <p type="p">12:左耳喇叭</p>
        <p type="p">14:右耳喇叭</p>
        <p type="p">20:音源</p>
        <p type="p">50:聲音供應系統</p>
        <p type="p">52:生理資訊感測器</p>
        <p type="p">54:處理器</p>
        <p type="p">100:聲音調整裝置</p>
        <p type="p">110:音訊接收元件</p>
        <p type="p">120:生理狀態資訊接收元件</p>
        <p type="p">130:頻率調整器</p>
        <p type="p">140:輸出埠</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="493px" img-content="tif" inline="yes" orientation="portrait" width="541px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622601</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144270</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250122B">G02B27/18</main-classification>
        <further-classification edition="200601120250122B">G02B27/42</further-classification>
        <further-classification edition="201801120250122B">H04N13/204</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫士弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, SHIH HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾志斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHIH PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>光投射器與搭配光投射器使用的感測系統</chinese-title>
        <english-title>PROJECTOR AND SENSING SYSTEM USED THEREFOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光投射器，包括光源和繞射光學元件，光源具有第一發光區以及第二發光區，繞射光學元件設置在光源上。繞射光學元件具有第一繞射結構和第二繞射結構，分別重疊第一發光區和第二發光區，第一繞射結構不同於第二繞射結構。亦提供一種感測系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A projector includes a light source and a diffractive optical element. The light source has a first light emitting area and a second light emitting area. The diffractive optical element is disposed on the light source. The diffraction optical element has a first diffraction structure and a second diffraction structure, respectively overlapping the first light emitting area and the second light emitting area, and the first diffraction structure is different from the second diffraction structure. A sensing system is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光投射器</p>
        <p type="p">100:光源</p>
        <p type="p">101:第一發光區</p>
        <p type="p">102:第二發光區</p>
        <p type="p">103:第三發光區</p>
        <p type="p">110:繞射光學元件</p>
        <p type="p">111:第一繞射結構</p>
        <p type="p">112:第二繞射結構</p>
        <p type="p">113:第三繞射結構</p>
        <p type="p">120:光阻擋層</p>
        <p type="p">130:透鏡陣列</p>
        <p type="p">131:第一透鏡</p>
        <p type="p">132:第二透鏡</p>
        <p type="p">133:第三透鏡</p>
        <p type="p">140:框體</p>
        <p type="p">L1:第一光束</p>
        <p type="p">L2:第二光束</p>
        <p type="p">L3:第三光束</p>
        <p type="p">DP1:第一繞射圖案</p>
        <p type="p">DP2:第二繞射圖案</p>
        <p type="p">DP3:第三繞射圖案</p>
        <p type="p">OB1:第一待測物</p>
        <p type="p">OB2:第二待測物</p>
        <p type="p">OB3:第三待測物</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="710px" img-content="tif" inline="yes" orientation="portrait" width="859px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621572</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144275</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120250501B">A23K30/00</main-classification>
        <further-classification edition="201601120250501B">A23K10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹國靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAN, KUO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高莫森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAVAHIAN, MOHSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>利用低溫等離子體技術降低黴菌毒素汙染之方法</chinese-title>
        <english-title>METHODS FOR REDUCING MYCOTOXIN CONTAMINATION USING LOW-TEMPERATURE PLASMA TECHNOLOGY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種利用低溫等離子體技術降低黴菌毒素汙染之方法，其包含以下步驟：提供樣品。提供反應模組，調整反應模組的控制參數後，開啟反應模組。將樣品置入反應模組後，反應模組進行低溫等離子處理，生成降解產物。提供質譜儀，降解產物經由質譜儀測量後，質譜儀生成複數個毒素的降解效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are methods for reducing mycotoxin contamination using low-temperature plasma technology, comprising the following steps. Provide samples. Provide a reaction module. After adjusting the control parameters of the reaction module, open the reaction module. After placing the sample into the reaction module, the reaction module undergoes low-temperature plasma treatment to generate degradation products. A mass spectrometer is provided. After the degradation products are measured by the mass spectrometer, the mass spectrometer generates multiple degradation efficiencies of the toxins.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100~S400:本發明之利用低溫等離子體技術降低黴菌毒素汙染之方法之步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="798px" img-content="tif" inline="yes" orientation="portrait" width="622px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622877</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144277</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120241130B">G06Q50/04</main-classification>
        <further-classification edition="202401120241130B">G06Q50/26</further-classification>
        <further-classification edition="202401120241130B">G06Q10/08</further-classification>
        <further-classification edition="202301120241130B">G06Q10/063</further-classification>
        <further-classification edition="202301120241130B">G06Q30/018</further-classification>
        <further-classification edition="201901120241130B">G06F16/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大自然交易平台股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATURES NANK EXCHANCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林群貿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾百慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田嘉昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃相瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹承祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇祝靑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李夢瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田浩人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田均睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪靜芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉禹成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>碳抵消方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種碳抵消方法，包含以下步驟：(A)一代持商伺服器接收由一使用者電子裝置輸出的一代碳權交易需求。(B)該代持商伺服器輸出一碳權交易需求至一碳權交易所伺服器。(C)該代持商伺服器接收由該使用者電子裝置輸出的一代碳權抵消需求。(D)該代持商伺服器根據該代碳權抵消需求輸出一碳權抵消需求至該碳權交易所伺服器。(E)該代持商伺服器由該碳權交易所伺服器接收一抵消證明檔案。(F)該代持商伺服器輸出一相關於一抵消憑證的代碳權抵消回覆，該抵消憑證具有相關於該抵消證明檔案之資訊，該抵消憑證可供用以產生相關於該抵消證明檔案的一證明檔案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:使用者電子裝置</p>
        <p type="p">3:代持商伺服器</p>
        <p type="p">9:碳權交易所伺服器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="664px" img-content="tif" inline="yes" orientation="portrait" width="960px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621903</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144289</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B41F15/36</main-classification>
        <further-classification edition="200601120241230B">B41C1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉和股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAVE C&amp;H SUPPLY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商倉和精密製造（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAVE PRECISION MFG (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉騏華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃軍皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具改良開口結構之印刷網版</chinese-title>
        <english-title>PRINTING SCREEN PLATE WITH IMPROVED OPENING STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">印刷網版包含網框及網布。網布設置於網框中，由具圖形開口之第一材料層以及具透墨開口之第二材料層構成。第二材料層設置於第一材料層之上。其中透墨開口對應圖形開口設置，透墨開口之寬度大於圖形開口之寬度。第一材料層對應透墨開口之區域具有位於中間之第一區段，以及位於側邊之至少一第二區段。第一區段之平均厚度小於第二區段之平均厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A printing screen plate includes a screen frame and a mesh. The mesh is arranged in the screen frame and consists of a first material layer with a graphic opening and a second material layer with an ink transmission opening. The second material layer is set on top of the first material layer. The ink transmission opening is set corresponding to the graphic opening. The width of the ink transmission opening is greater than the width of the graphic opening. An area of the first material layer corresponding to the ink transmission opening includes a first section in the middle and at least one second section at the side. The average thickness of the first section is less than the average thickness of the second section.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:印刷網版</p>
        <p type="p">210:網框</p>
        <p type="p">220:網布</p>
        <p type="p">222:第一材料層</p>
        <p type="p">224:第二材料層</p>
        <p type="p">2222:圖形開口</p>
        <p type="p">2242:透墨開口</p>
        <p type="p">2222w、2242w:寬度</p>
        <p type="p">A-A’:剖面線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="542px" img-content="tif" inline="yes" orientation="portrait" width="614px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622838</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144293</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250625B">G06Q20/12</main-classification>
        <further-classification edition="201201120250625B">G06Q20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃敦麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳婉宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉東相</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TUNG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴弘文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, HUNG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>線上安全付款確認之系統、方法及其電腦可讀媒介</chinese-title>
        <english-title>SECURE PAYMENT CONFIRMATION SYSTEM, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種線上安全付款確認之系統及其方法，係結合安全付款確認標準以及透過時戳服務，以確保交易資料之安全性與完整性，本發明能將付款確認之過程加以存證，以提供消費者具公信力之交易舉證證據，另外，本發明也透過安全付款確認標準的介面，提供風險預警圖示給消費者參考，據此，消費者可在安全付款確認頁面檢視風險預警圖示，提前取消交易，不執行支付動作，可減少整個流程的步驟，並且降低消費糾紛發生的機會。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a secure payment confirmation system and method thereof. Combining secure payment confirmation standards and timestamp services, the security and integrity of transaction data can be ensured. In the present invention, the payment confirmation process can be certified, so credible transaction evidence can be provided for consumers. In addition, the present invention also provides risk warning icons for the consumers to refer through a secure payment confirmation standard interface. Accordingly, the consumers can view the risk warning icon on the secure payment confirmation page, cancel the transaction in advance and not perform payment actions, which can reduce the steps of the entire process and reduce the chance of consumer disputes. The present invention also provides a computer-readable medium for executing the method of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:線上安全付款確認之系統</p>
        <p type="p">10:安全付款確認伺服器</p>
        <p type="p">11:電子消費系統</p>
        <p type="p">12:支付終端</p>
        <p type="p">13:時戳服務伺服器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="587px" img-content="tif" inline="yes" orientation="portrait" width="847px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622346</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144294</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241130B">E04F15/18</main-classification>
        <further-classification edition="200601120241130B">E04F13/075</further-classification>
        <further-classification edition="200601120241130B">E04G23/02</further-classification>
        <further-classification edition="200601120241130B">E04G21/00</further-classification>
        <further-classification edition="200601120241130B">E04B1/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張展祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張展祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>防漏水的施工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防漏水的施工方法，包含一確認一混凝土建物之一原始鋪層的漏水位置的檢測步驟、一打除圍繞對應漏水位置之一處理範圍的部分該原始鋪層而形成一施工範圍的打除步驟、一在該原始鋪層鑿設一個預備孔的打孔步驟、一由一個該預備孔灌注一發泡材而在該處理範圍形成一隔水層的灌注步驟、一清除滲出該施工範圍之該發泡材的清除步驟、一在該施工範圍塗佈一層底漆的打底步驟、一鋪設多片抗拉纖維網的鋪墊步驟、一鋪設一防水膠材而形成一防水層的阻水步驟，及一在該防水層以一水泥砂漿鋪設一與該原始鋪層銜接之補整結構層的填補步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:檢測步驟</p>
        <p type="p">102:打除步驟</p>
        <p type="p">103:打孔步驟</p>
        <p type="p">104:灌注步驟</p>
        <p type="p">105:清除步驟</p>
        <p type="p">106:整理步驟</p>
        <p type="p">107:打底步驟</p>
        <p type="p">108:鋪墊步驟</p>
        <p type="p">109:阻水步驟</p>
        <p type="p">110:填補步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="935px" img-content="tif" inline="yes" orientation="portrait" width="438px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621558</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144295</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A01K5/02</main-classification>
        <further-classification edition="202401120241230B">G06Q50/00</further-classification>
        <further-classification edition="200601120241230B">G08C17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊正輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHENG-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智慧型牲畜餵食監控及管理系統</chinese-title>
        <english-title>A SMART LIVESTOCK FEEDING MONITORING AND MANAGEMENT SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧型牲畜餵食監控及管理系統，包含一供飼單元、一連結於該供飼單元的主控單元、一連接該主控單元的伺服主機，及一連接該主控單元與該伺服主機的可攜裝置。該供飼單元包括一飼料桶、一用以控管飼料出料的出料模組，及一用以偵測飼料量的監控模組，該監控模組具有一第一微控制器，及一連接該第一微控制器的無線通訊器。該主控單元包括一第二微控制器、一用以控制該出料模組的控管模組、一操控介面，及一用以根據飼料重量提供換肉率參數的轉換模組。該伺服主機包括一伺服器及一資料庫。該可攜裝置能執行設定、控制、監看及查詢的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart livestock feeding monitoring and management system includes a feeder unit, a main control unit connected to the feeder unit, a server host connected to the main control unit, and a portable device connected to the main control unit and the server host. The feeder unit includes a feed bin, an export module for controlling feed discharge, and a monitoring module for detecting feed amount, the monitoring module having a first microcontroller, and a wireless communicator connected to the first microcontroller. The main control unit includes a second microcontroller, a control module for controlling the export module, a control interface, and a conversion module for providing feed conversion rate (FCR) parameter based on the feed weight. The server host includes a server and a database. The portable device is capable of performing a function of setting, control, monitoring, and inquiry.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:供飼單元</p>
        <p type="p">10:飼料桶</p>
        <p type="p">11:出料模組</p>
        <p type="p">12:監控模組</p>
        <p type="p">13:維護模組</p>
        <p type="p">2:主控單元</p>
        <p type="p">3:伺服主機</p>
        <p type="p">31:伺服器</p>
        <p type="p">32:資料庫</p>
        <p type="p">4:可攜裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="879px" img-content="tif" inline="yes" orientation="portrait" width="731px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621553</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144296</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A01D43/00</main-classification>
        <further-classification edition="200601120241231B">A01D43/06</further-classification>
        <further-classification edition="200601120241231B">A01D90/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林韋至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙淑真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, SUE-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎　鄧慶冷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE, DANG KHANH LINH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　德泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, DUC TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　段鄧科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, DOAN DANG KHOA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　福寶龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DO, PHUOC BAO LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自動化農用載具</chinese-title>
        <english-title>AUTOMATIC AGRICULTURAL VEHICLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動化農用載具，包含一載體，及一防傾倒裝置。該載體包括一主體機構，及二相互間隔地設置於該主體機構的行走機構。該防傾倒裝置包括一安裝於該主體機構且能在一待命位置及一伸出位置間移動的支撐輪，及一電連接該支撐輪且安裝於該載體內，並用以偵測該載體之一傾斜角度而控制該支撐輪移動的電控模組。該載體之該傾斜角度在一安全角度範圍內時，該支撐輪在該待命位置；該載體之該傾斜角度超過該安全角度範圍時，該支撐輪在該伸出位置並向外延伸而支撐於地面，故透過該電控模組感測該傾斜角度，使該載體能配合該支撐輪的運作維持平衡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic agricultural vehicle includes a carrier and an anti - tilt device. The carrier includes a main body mechanism and two walking mechanisms spaced apart from each other on the main body mechanism. The anti - tilt device includes a supporting wheel mounted to the main body mechanism of the carrier and movable between a standby position and an extension position. By the way, an electronic control module electrically connected to the supporting wheel and mounted in the carrier for detecting a tilt angle of the carrier to control movement of the supporting wheel. The tilt angle of the carrier in a safe angle range is within the standby position. Conversely, the supporting wheel in the extension position and extends outwardly to support the ground. Thus, through the electronic control module, based on the tilt angle detected by the electronic control module, the carrier works in coordination with the supporting wheel to maintain balance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:載體</p>
        <p type="p">11:主體機構</p>
        <p type="p">12:行走機構</p>
        <p type="p">2:防傾倒裝置</p>
        <p type="p">21:支撐輪</p>
        <p type="p">210:延伸部</p>
        <p type="p">211:支架</p>
        <p type="p">212:延伸腳</p>
        <p type="p">213:銜接件</p>
        <p type="p">214:驅動件</p>
        <p type="p">215:壓力感測器</p>
        <p type="p">216:限位開關</p>
        <p type="p">22:電控模組</p>
        <p type="p">3:承載架</p>
        <p type="p">31:支柱</p>
        <p type="p">4:採收單元</p>
        <p type="p">41:承載件</p>
        <p type="p">42:重量感測器</p>
        <p type="p">43:切割裝置</p>
        <p type="p">44:影像辨識裝置</p>
        <p type="p">5:控制模組</p>
        <p type="p">α:傾斜角度</p>
        <p type="p">B:待採物</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="970px" img-content="tif" inline="yes" orientation="portrait" width="681px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622435</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144297</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241128B">F27D3/15</main-classification>
        <further-classification edition="200601120241128B">F27D3/02</further-classification>
        <further-classification edition="200601120241128B">C22B21/06</further-classification>
        <further-classification edition="200601120241128B">C22B9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳弘毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡和霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臧君翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSANG, CHUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜玲珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, LING-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自動除渣裝置</chinese-title>
        <english-title>AUTOMATIC SLAG REMOVAL DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動除渣裝置，包含一載台、一位於該載台相對下方處的排渣板，及至少一可受控制地連接該載台及該排渣板，並用以帶動該排渣板升降及/或傾斜的致動器。該排渣板開設有複數由頂面延伸至底面的穿孔。該至少一致動器可受控制帶動該排渣板上下升降，並使該排渣板的傾斜角度改變，從而產生一面向一迎流方向的傾斜面，如此一來結晶器攪動時引起的部分渦流便會沿該迎流方向流過該排渣板，這時通過該排渣板的鋁湯會因重力的影響而由該等穿孔回落液面，而鋁渣則會因為無法通過該等穿孔而被撈置於該排渣板上，藉此可達到自動除渣以確保結晶效率之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic slag removal device includes a holder, a slag removal plate disposed below the holder and having at least one slag discharge plate controllably connected to the holder and the slag discharge plate for lifting and / or inclining the slag discharge plate, the slag discharge plate being formed with a plurality of through holes extending from a top surface to a bottom surface thereof, the at least one actuator being operable to move the slag discharge plate upwardly and downwardly to change the inclination angle of the slag discharge plate so as to produce an inclined surface facing a head - on flow direction such that a portion of the vortex flow generated by the agitating crystallizer flows through the slag discharge plate in the head - on direction, the aluminum soup flowing through the slag discharge plate will flow back from the through holes to a liquid level by gravity, and the aluminum slag is received in the slag discharge plate by virtue of failure to pass through the through holes, thereby achieving the effect of automatic slag removal and ensuring crystallization efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:坩堝</p>
        <p type="p">12:結晶器</p>
        <p type="p">21:載台</p>
        <p type="p">22:致動器</p>
        <p type="p">23:排渣板</p>
        <p type="p">231:穿孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="687px" img-content="tif" inline="yes" orientation="portrait" width="550px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622512</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144299</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">G01R1/067</main-classification>
        <further-classification edition="200601120241204B">G01R1/02</further-classification>
        <further-classification edition="200601120241204B">G01L1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣興電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡俊賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHUNHSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭仕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, SHIHSIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝育忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YU-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>荷重控制探針裝置及荷重控制方法</chinese-title>
        <english-title>LOAD CONTROL PROBE DEVICE AND LOAD CONTROL METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種荷重控制探針裝置，包含探針模組、荷重感測器及控制器，荷重感測器連接於探針模組並用於量測探針模組的荷重數據，控制器連接於探針模組及荷重感測器，控制器預存荷重設定值且用於控制探針模組移動並判斷荷重數據是否符合荷重設定值，在判斷荷重數據符合荷重設定值時停止探針模組移動並控制探針模組進行訊號檢測。一種荷重控制方法，適用於探針模組，包含：利用荷重感測器量測探針模組的荷重數據、控制該探針模組移動並判斷荷重數據是否符合荷重設定值以及當判斷荷重數據符合荷重設定值時停止探針模組移動並控制探針模組進行訊號檢測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A load control probe device includes a probe module, a load sensor and a controller. The load sensor is connected to the probe module and used to measure the load data of the probe module. The controller is connected to the probe module. Needle module and load sensor, the controller pre-stores the load setting value and is used to control the movement of the probe module and determine whether the load data meets the load setting value. When it is determined that the load data meets the load setting value, the probe module is stopped. The group moves and controls the probe module for signal detection. A load control method, suitable for a probe module, includes: using a load sensor to measure the load data of the probe module, controlling the movement of the probe module and judging whether the load data meets the load setting value and when determining that the load data meets the load setting value, stopping the probe module moving and controlling the probe module for signal detection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:荷重控制探針裝置</p>
        <p type="p">11:探針模組</p>
        <p type="p">12:荷重感測器</p>
        <p type="p">13:控制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="436px" img-content="tif" inline="yes" orientation="portrait" width="474px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622754</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144302</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250602B">G06F13/38</main-classification>
        <further-classification edition="200601120250602B">G06F13/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞祺電通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張盛傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電路板ＰＣＩＥ插槽具不同處理器的ＰＣＩＥ訊號來源之切換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種電路板PCIE插槽具不同處理器的PCIE訊號來源之切換裝置，其包括有：一主機板裝置，係包括有一電路板，該電路板上設有一第一處理器接槽及第二處理器接槽，該電路板之一端並設有至少一第一PCIE插槽及第二PCIE插槽；一PCIE切換裝置，設於該電路板上，該PCIE切換裝置包括有一PCIE切換晶片及切換元件；一電路佈線組，設於該電路板上，並使該第一處理器接槽、第二處理器接槽完成與該第一PCIE插槽、第二PCIE插槽間之線佈路局，並藉該PCIE切換晶片來控制該電路佈線組之通往該第一PCIE插槽、該第二PCIE插槽之線路選擇切換運作。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:電路板PCIE插槽使用切換裝置</p>
        <p type="p">10:主機板裝置</p>
        <p type="p">11:電路板</p>
        <p type="p">12:第一處理器接槽</p>
        <p type="p">13:第二處理器接槽</p>
        <p type="p">14:處理器(CPU0)</p>
        <p type="p">15:處理器(CPU1)</p>
        <p type="p">16:電路佈線組</p>
        <p type="p">161:第一PCIE插槽接線</p>
        <p type="p">162:第二PCIE插槽接線</p>
        <p type="p">163:第三PCIE插槽接線</p>
        <p type="p">17:第一PCIE插槽(PCIE1)</p>
        <p type="p">18:第二PCIE插槽(PCIE2)</p>
        <p type="p">20:PCIE切換裝置</p>
        <p type="p">21:PCIE切換晶片</p>
        <p type="p">22:切換元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="692px" img-content="tif" inline="yes" orientation="portrait" width="694px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623038</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144303</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王亘黼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSUAN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王慶鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHING-CHIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title>PLASMA PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電漿處理裝置，包含一下腔室、一上腔室以及一分配板。下腔室用以供一樣品放置。上腔室位於下腔室的上方。上腔室用以容置一電漿。分配板設置於下腔室與上腔室之間。分配板包含一介電材料層、一金屬材料層以及一通孔。金屬材料層設置於介電材料層靠近下腔室之一側。通孔沿一縱向方向貫穿介電材料層與金屬材料層。通孔連通下腔室與上腔室。通孔用以供電漿通過而沉積於樣品上。介電材料層沿縱向方向的一第一厚度為T1，金屬材料層沿縱向方向的一第二厚度為T2，通孔的一孔徑為D1，其滿足下列條件：5 ≤ (T1+T2)/D1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plasma processing apparatus includes a lower chamber, an upper chamber and a dispensing plate. The lower chamber is configured for a sample to be placed therein. The upper chamber is located above the lower chamber and is configured to accommodate a plasma. The dispensing plate is disposed between the lower chamber and the upper chamber. The dispensing plate includes a dielectric material layer, a metal material layer and a through hole. The metal material layer is disposed on a side of the dielectric material layer close to the lower chamber. The through hole is arranged through the dielectric material layer and the metal material layer along a longitudinal direction. The through hole is in fluid communication connection with the lower chamber and the upper chamber. The through hole is configured for the plasma passing therethrough to be deposited onto the sample. When a first thickness of the dielectric material layer along the longitudinal direction is T1, a second thickness of the metal material layer along the longitudinal direction is T2, and a diameter of the through hole is D1, the following condition is satisfied: 5 ≤ (T1+T2)/D1.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:下腔室</p>
        <p type="p">12:上腔室</p>
        <p type="p">13:分配板</p>
        <p type="p">131:介電材料層</p>
        <p type="p">132:金屬材料層</p>
        <p type="p">133:通孔</p>
        <p type="p">DE:延伸方向</p>
        <p type="p">DL:縱向方向</p>
        <p type="p">D1:孔徑</p>
        <p type="p">D2:間距</p>
        <p type="p">T1、T2:厚度</p>
        <p type="p">θ:夾角</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="708px" img-content="tif" inline="yes" orientation="portrait" width="1084px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621862</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144306</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250422B">B25D11/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國防部軍備局生產製造中心第２０５廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATERIAL PRODUCTION CENTER, ARMAMENTS BUREAU MND THE 205TH ARSENAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李芳明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, FANG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鵬宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃智彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡詠翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, YUNG-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>衝擊用模組及包括其之衝擊裝置</chinese-title>
        <english-title>IMPACT MODULE AND IMPACT DEVICE COMPRISING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種衝擊用模組。所述衝擊用模組包括一主殼體、一止擋端組件、一致動組件以及一衝擊用連動組件。主殼體沿著第一方向延伸，並具有一第一端及一第二端，其中第二端相對於第一端。止擋端組件結合於第一端。致動組件設置於第二端，且主殼體包覆至少部分的致動組件。衝擊用連動組件設置於止擋端組件與致動組件之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An impact module is provided. The impact module includes a main housing, a stop end assembly, an actuating assembly and an impact linkage assembly. The main housing extends along a first direction and has a first end and a second end opposite to the first end. The stop end assembly is coupled to the first end. The actuating assembly is disposed at the second end, and the main housing covers at least a portion of the actuating assembly. The impact linkage assembly is disposed between the stop end assembly and the actuating assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:衝擊用模組</p>
        <p type="p">110:主殼體</p>
        <p type="p">110a:上表面</p>
        <p type="p">110SH:螺孔</p>
        <p type="p">120:止擋端組件</p>
        <p type="p">140:致動組件</p>
        <p type="p">160:衝擊用連動組件</p>
        <p type="p">162:連動基座</p>
        <p type="p">162TA:溝槽</p>
        <p type="p">162TB:橫向凹槽</p>
        <p type="p">164:第一作用件</p>
        <p type="p">166:第二作用件</p>
        <p type="p">168:離合件</p>
        <p type="p">180:衝擊組件</p>
        <p type="p">182:固定部</p>
        <p type="p">182H:固定孔</p>
        <p type="p">184:突出部</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">E1:第一端</p>
        <p type="p">E2:第二端</p>
        <p type="p">S1:第一邊緣</p>
        <p type="p">S2:第二邊緣</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="667px" img-content="tif" inline="yes" orientation="portrait" width="1016px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621784</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144307</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">B01D53/26</main-classification>
        <further-classification edition="200601120241204B">F24F3/048</further-classification>
        <further-classification edition="200601120241204B">F24F3/14</further-classification>
        <further-classification edition="200601120241204B">F24F13/02</further-classification>
        <further-classification edition="201801120241204B">F24F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科嶠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA NEO TECH INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉步章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, PU-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭朝明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈維揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>CDA加熱裝置</chinese-title>
        <english-title>CDA HEATING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種CDA加熱裝置，包括一外筒、懸持於該外筒內的一內筒以及至少一電熱管，該內筒和該外筒共同框圍形成一氣體流道，該氣體流道包含形成於該外筒和該內筒之間並且連通一入氣口的一外環流道，以及形成於該內筒內並且連通一排氣口和該外環流道的一中心流道，且該氣體流道以及至少一所述電熱管共同提供CDA接觸的壁面具有平滑特徵，據以改進CDA中殘存的微粒或污染物易於囤積在加熱裝置內部的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">圍繞        &lt;br/&gt;A CDA heating device comprises an outer cylinder, an inner cylinder suspended in the outer cylinder and at least one electric heating pipe. The inner cylinder and the outer cylinder are surrounded common to form a gas flow channel. The gas flow channel comprises an outer ring channel formed between the outer cylinder and the inner cylinder and is connected with an air inlet, and a central flow channel formed in the inner cylinder. The central flow channel communicates an exhaust port and the outer ring flow channel. The gas flow channel and at least one electric heating pipe together provide the wall surfaces that the CDA contacts, and the wall surfaces has a smooth characteristic, so as to improve the tendency of residual particulates or contaminants in the CDA to accumulate inside the CDA heating device.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:外筒</p>
        <p type="p">11:第一端盤</p>
        <p type="p">12:法蘭</p>
        <p type="p">20:內筒</p>
        <p type="p">21:第二端盤</p>
        <p type="p">22:筒口</p>
        <p type="p">30:電熱管</p>
        <p type="p">45:隔板</p>
        <p type="p">451:通氣口</p>
        <p type="p">452:管孔</p>
        <p type="p">50:入氣管</p>
        <p type="p">60:排放管</p>
        <p type="p">70:內腔感溫棒</p>
        <p type="p">71:出口感溫棒</p>
        <p type="p">80:氣密墊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="977px" img-content="tif" inline="yes" orientation="portrait" width="722px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621605</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144308</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A47B91/02</main-classification>
        <further-classification edition="200601120241230B">A47B91/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳易璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳易璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇建太</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可移動油壓腳墊</chinese-title>
        <english-title>MOVABLE HYDRAULIC LEG CUSHION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種可移動油壓腳墊， 裝設於一承載座上，包括有一外殼、一活動內殼、一活塞、一膜片彈簧組件、一彈性件、一壓環以及一滾輪。活動內殼可相對外殼滑動，使活動內殼滑動至一活動位置或一收容位置。活塞之連接部固設於外殼並以一密封皮碗連接活動內殼，活塞之本體部容置於活動內殼容置空間內並將活動內殼容置空間區隔為一第一腔室及一第二腔室，本體部開設有一連通第一腔室及第二腔室之連通道並裝設有一單向閥膜片，用以控制連通道之連通狀態。其中，當可移動油壓腳墊受力升起時，活動內殼滑移至活動位置使滾輪可相對滾動，且第一腔室內之液壓油經連通道快速流動至第二腔室；當可移動油壓腳墊受壓下降時，活動內殼滑移至收容位置使滾輪收容至外殼容置空間內，且第二腔室內之液壓油經連通道緩慢回流至第一腔室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a movable hydraulic leg cushion, mounted on a carrier, and includes a housing, a movable inner shell, a piston, a diaphragm spring assembly, an elastic member, a pressure ring and a roller. The movable inner shell can slide relative to the housing, so that the movable inner shell can slide to a movable position or a receiving position. The connecting part of the piston is fixed on the housing and is connected to the movable inner shell with a sealing cup. The main body part of the piston is accommodated in a movable inner shell accommodation space and divides the movable inner shell accommodation space into a first chamber and a second chamber, the body part has a connecting passage communicating the first chamber and the second chamber and is equipped with a one-way valve diaphragm to control the communication state of the connecting passage. When the movable hydraulic leg cushion is lifted up due to force, the movable inner shell slides to the movable position so that the rollers can roll relatively, and the hydraulic oil in the first chamber quickly flows to the second chamber through the connecting passage; when the movable hydraulic leg cushion is lowered down under pressure, the movable inner shell slides to the receiving position so that the rollers are received in the housing accommodation space, and the hydraulic oil in the second chamber slowly flows back to the first chamber through the connecting passage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可移動油壓腳墊</p>
        <p type="p">2:外殼</p>
        <p type="p">20:外殼容置空間</p>
        <p type="p">21:注油孔</p>
        <p type="p">22:螺釘</p>
        <p type="p">3:活動內殼</p>
        <p type="p">30:活動內殼容置空間</p>
        <p type="p">31:蓋體</p>
        <p type="p">4:活塞</p>
        <p type="p">41:連接部</p>
        <p type="p">42:本體部</p>
        <p type="p">421:連通道</p>
        <p type="p">43:密封皮碗</p>
        <p type="p">44:單向閥膜片</p>
        <p type="p">45:注油道</p>
        <p type="p">46:活塞阻斷棒</p>
        <p type="p">5:膜片彈簧組件</p>
        <p type="p">51:膜片彈簧</p>
        <p type="p">52:膜片彈簧套</p>
        <p type="p">6:彈性件</p>
        <p type="p">7:壓環</p>
        <p type="p">8:滾輪</p>
        <p type="p">81:滾動件</p>
        <p type="p">82:X型密封圈</p>
        <p type="p">83:O型密封圈</p>
        <p type="p">9:防滑墊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="888px" img-content="tif" inline="yes" orientation="portrait" width="592px">
          </img>
        </representative>
      </representative-img>
    </description>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622808</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>113144309</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250602B">G06N5/04</main-classification>
        <further-classification edition="201901120250602B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅繼恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEI, CHIH-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅繼恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEI, CHIH-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>機器意識設計者模式語言代理先進邏輯晶片迴路布局</chinese-title>
        <english-title>CONSCIOUS ON DESIGNER PATTERN LANGUAGE COGNITIVE AI AGENT ADVANCED LOGIC CIRCUIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">機器意識學習設計者角色自主性理解生成人類的模式語言代理敘事。</p>
        <p type="p">一種模式語言代理關係詞語意編碼應用在一組晶片元件基板、功能層、及「協作技術」之結構層上。</p>
        <p type="p">一種模型來解析和理解模式語言，這些模型機器學習演算法。。設計者構建和優化這些模型，使其能夠高效地識別和生成語言。同時設計者在不同上下文中的表現確保其語言產出滿足用戶先進晶片Conscious on Agent-Chip的特徵。</p>
        <p type="p">機器意識敘事結構衍生出一種去中心化數學契約身份。</p>
        <p type="p">機器模擬自我主觀意識設計元素空間語意理解視覺元素設計個性化回應和模擬情感。涉及多維度空間中的信息處理，將語言和視覺元素整合到敘事中。導引機器學習運作邏輯推理多層多維晶片元件。</p>
        <p type="p">本發明機器意識模式語言代理敘事結構DPU(Designer)邏輯推理Conscious on Agent-Chip晶片元件特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621864</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144310</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241130B">B25H3/04</main-classification>
        <further-classification edition="200601120241130B">A47B81/00</further-classification>
        <further-classification edition="200601120241130B">A47B97/00</further-classification>
        <further-classification edition="200601120241130B">A47B96/00</further-classification>
        <further-classification edition="200601120241130B">G01V8/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寧茂企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHYMEBUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯舜瀚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, SHUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　雁雁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, YEN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIH-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳秋雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIU-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宣諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>饒憲堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAO, HSIEN-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可調式感應置物架及可調式感應置物架組</chinese-title>
        <english-title>ADJUSTABLE SENSING RACK AND ADJUSTABLE SENSING RACK SET</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可調式感應置物架，其包含二感應座體以及複數個可調式隔板。各感應座體包含複數個卡接槽、複數個容置槽、複數個感測機構以及複數個顯示元件。各感測機構包含光線感應組件以及光線遮蔽元件，光線感應組件包含光線發射元件及光線接收元件，光線遮蔽元件設置於各容置槽中，並可於光線發射元件及光線接收元件之間位移。各顯示元件用以顯示光線發射元件之光線進入或未進入光線接收元件。各可調式隔板可拆卸地卡接於感應座體之卡接槽。藉此，本發明之可調式感應置物架可在容置各種物品時，具有高偵測準確率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an adjustable sensing rack, which includes two sensing bases and a plurality of adjustable boards. Each of the sensing bases includes a plurality of clamping slots, a plurality of receiving slots, a plurality of sensing mechanisms and a plurality of displaying components. Each of the sensing mechanisms includes a light sensing component and a light blocking component. The light sensing component includes a light emitting component and a light receiving component. The light blocking component is disposed in each of the receiving slots, and can be moved between the light emitting component and the light receiving component. Each of the displaying components is used for displaying whether a light of the light emitting component entering or not entering the light receiving component. Each of the adjustable boards is detachably engaged with the clamping slots of the sensing bases. Therefore, the adjustable sensing rack of the present disclosure can have high detecting accuracy during containing various kinds of stuffs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可調式感應置物架</p>
        <p type="p">110:分隔件</p>
        <p type="p">200:感應座體</p>
        <p type="p">210:卡接槽</p>
        <p type="p">300:可調式隔板</p>
        <p type="p">320:容置空間</p>
        <p type="p">A:物品</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="748px" img-content="tif" inline="yes" orientation="portrait" width="945px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622652</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144320</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">G05B13/04</main-classification>
        <further-classification edition="200601120241204B">G05B19/418</further-classification>
        <further-classification edition="202301120241204B">G06N3/126</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣化學纖維股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMOSA CHEMICALS &amp; FIBRE CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃傳恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUAN EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江明家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, MING CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王勝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊鴻霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, HUNG LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>負載決定裝置、負載決定方法及其電腦程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種負載決定裝置、負載決定方法及其電腦程式產品。負載決定裝置執行基因演算法，在各次迭代中：(i)目標式從與多個候選負載組合對應的多個預測電流總和中選取最小者，各候選負載組合包含第一及第二候選負載量，各預測電流總和中的第一及第二預測電流值分別根據第一及第二模型計算，及(ii)限制式限制各候選負載組合的預測入氣量總和落在預設範圍內，各預測入氣量總和中的第一及第二預測入氣量分別根據第三及第四模型計算。負載決定裝置選取最後一次迭代中的該等預測電流總和之最小者所對應的候選負載組合以用於操作第一空壓機及第二空壓機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S301、S303、S305、S307:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="733px" img-content="tif" inline="yes" orientation="portrait" width="535px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622329</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144321</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">E01D22/00</main-classification>
        <further-classification edition="200601120250123B">E01D19/10</further-classification>
        <further-classification edition="200601120250123B">G01C15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人中華顧問工程司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA ENGINEERING CONSULTANTS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晨光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHEN-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃維信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴躍仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YAO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳禹丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾裕傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YU CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡欣局</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>爬索車</chinese-title>
        <english-title>BRIDGE CABLE INSPECTION CAR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種爬索車用以套設橋梁纜線，且移動至橋梁纜線的特定位置。爬索車包括本體與二套管夾爪，且本體包括第一位移模組與二第一線性滑動部。二套管夾爪分別包括第二線性滑動部，且當套管夾爪按第二線性滑動部給定的方向做往復直線運動時，第一位移模組與二套管夾爪的第二位移模組之間所形成的中點與第一位移模組至其中之一套管夾爪的第二位移模組的距離呈等腰三角形，以供爬索車夾持於特定線徑下的任意線徑的橋梁纜線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bridge cable inspection car is used to set a bridge cable and move to a specific position of the bridge cable. The bridge cable inspection car includes a main body and two casing clamps, and the main body includes a first displacement module and two first linear sliding parts. The two casing clamps include a second linear sliding part respectively, and when the casing clamps make reciprocating linear motion in a direction given by the second linear sliding part, a center point formed between the first displacement module and a second displacement module of the two casing clamps with a distance from the first displacement module to the second displacement module of one of the casing clamps forms an isosceles triangle, so that the bridge cable inspection car can clamp bridge cables of any diameter under a specific diameter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:爬索車</p>
        <p type="p">1:本體</p>
        <p type="p">10:限位部</p>
        <p type="p">12:第一位移模組</p>
        <p type="p">120:傳動輪</p>
        <p type="p">14:板體</p>
        <p type="p">14A、14B:外表面</p>
        <p type="p">140A:第一線性滑動部</p>
        <p type="p">Y:容置區域</p>
        <p type="p">2:套管夾爪</p>
        <p type="p">20:第一夾臂</p>
        <p type="p">20A:第二線性滑動部</p>
        <p type="p">22:第二夾臂</p>
        <p type="p">22B:第二位移模組</p>
        <p type="p">220:傳動輪</p>
        <p type="p">X:限位空間</p>
        <p type="p">5:馬達</p>
        <p type="p">300:橋梁纜線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.png" file="d10019.TIF" giffile="ed10019.png" height="733px" img-content="tif" inline="yes" orientation="portrait" width="868px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623249</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144324</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250122B">H04N13/332</main-classification>
        <further-classification edition="201801120250122B">H04N13/398</further-classification>
        <further-classification edition="200601120250122B">G06F3/01</further-classification>
        <further-classification edition="200601120250122B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭思華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SZU-HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹淩帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, LING-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡議元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, I-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示虛擬物件的方法、頭戴顯示系統與頭戴顯示裝置</chinese-title>
        <english-title>METHOD FOR DISPLAY VIRTUAL OBJECT, HEAD MOUNTED DISPLAY SYSTEM AND HEAD MOUNTED DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示虛擬物件的方法、頭戴顯示系統與頭戴顯示裝置。利用一頭戴顯示裝置上的影像擷取裝置朝一顯示屏幕擷取一環境影像。多個預設標記呈現於顯示屏幕上。根據環境影像中的多個預設標記，決定顯示屏幕的即時位姿資訊。根據顯示屏幕的即時位姿資訊與頭戴顯示裝置的裝置位姿資訊，決定顯示屏幕於擴增實境座標系統中的目標位姿資訊。根據顯示屏幕的目標位姿資訊，透過頭戴顯示裝置顯示錨定於顯示屏幕的一虛擬物件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for display virtual object, a head mounted display system and a head mounted display apparatus are provided. The method includes the following steps. An image capturing device on the head mounted display apparatus is used to capture an environment image toward a display screen. A plurality of preset markers are presented on the display screen. Real-time pose information of the display screen is determined based on the preset markers in the environment image. Based on the real-time pose information of the display screen and device pose information of the head-mounted display apparatus, target pose information of the display screen in an augmented reality coordinate system is determined. According to the target pose information of the display screen, a virtual object anchored on the display screen is displayed through the head-mounted display device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S340:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="532px" img-content="tif" inline="yes" orientation="portrait" width="667px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622710</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144332</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241223B">G06F3/041</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, PO-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳旻遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖韋齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>觸控板裝置</chinese-title>
        <english-title>TOUCHPAD DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控板裝置包括基板、觸控面板、平衡組件及補強板件。觸控面板具有外周緣與內表面，外周緣具有第一邊角、第二邊角、第三邊角及第四邊角，內表面的中央區域上具有開關。平衡組件設置於觸控面板與基板之間，平衡組件包括第一平衡桿、第二平衡桿、第三平衡桿及第四平衡桿。補強板件包括主板與多個限位凸板，主板設置於觸控面板之內表面，多個限位凸板連接於主板的周圍並突出觸控面板之外周緣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touchpad device includes a substrate, a touch panel, a balance assembly, and a reinforcing plate. The touch panel has an outer periphery and an inner surface. The outer periphery has a first corner, a second corner, a third corner, and a fourth corner. A central area of the inner surface is provided with a switch. The balance assembly is disposed between the touch panel and the substrate. The balance assembly includes a first balance bar, a second balance bar, a third balance bar, and a fourth balance bar. The reinforcing plate includes a main plate and a plurality of limiting convex plates. The main plate is disposed on the inner surface of the touch panel. The limiting convex plates are connected around the main plate and protrude from the outer periphery of the touch panel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:觸控板裝置</p>
        <p type="p">10:基板</p>
        <p type="p">15:頂面</p>
        <p type="p">20:觸控面板</p>
        <p type="p">21:外周緣</p>
        <p type="p">211:第一邊角</p>
        <p type="p">212:第二邊角</p>
        <p type="p">213:第三邊角</p>
        <p type="p">214:第四邊角</p>
        <p type="p">25:內表面</p>
        <p type="p">251:中央區域</p>
        <p type="p">26:開關</p>
        <p type="p">261:彈性復位件</p>
        <p type="p">27:緩衝體</p>
        <p type="p">30:平衡組件</p>
        <p type="p">31:第一平衡桿</p>
        <p type="p">32:第二平衡桿</p>
        <p type="p">33:第三平衡桿</p>
        <p type="p">34:第四平衡桿</p>
        <p type="p">40:補強板件</p>
        <p type="p">41:主板</p>
        <p type="p">45:限位凸板</p>
        <p type="p">451:擋止面</p>
        <p type="p">50:補強件</p>
        <p type="p">60:組接板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="1094px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622726</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144335</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F5/06</main-classification>
        <further-classification edition="200601120250303B">G06F5/00</further-classification>
        <further-classification edition="200601120250303B">G06F5/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許烱發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEU, JEONG-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉正硯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, JHENG-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林耘生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>低功耗的延遲先進先出緩衝電路及其操作方法</chinese-title>
        <english-title>LATENCY FIFO CIRCUIT AND OPERATION METHOD THEREOF HAVING LOW POWER DISSIPATION MECHANISM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種低功耗的延遲先進先出緩衝電路，包含：計數電路、複數先進先出緩衝器、輸入電路以及輸出電路。計數電路依序循環產生對應複數參照值其中之一的計數值。每一先進先出緩衝器對應參照值其中之一對應參照值，並具有儲存資料。輸入電路接收輸入資料，並根據計數值將輸入資料寫入先進先出緩衝器其中之一。輸出電路根據計數值選擇先進先出緩衝器其中之一的儲存資料輸出為延遲資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A latency first-in-first-out (FIFO) circuit having low power dissipation is provided that includes a counting circuit, FIFO buffers, an input circuit and an output circuit. The counting circuit in turn generates a counting value corresponding to one of reference values in a circular manner. Each of the FIFO buffers corresponds to a corresponding reference value of the reference values and includes stored data. The input circuit receives and writes the input data to one of the FIFO buffers according to the counting value. The output circuit selects the stored data of one of the FIFO buffers according to the counting value to be outputted as delayed data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:延遲先進先出緩衝電路</p>
        <p type="p">110:計數電路</p>
        <p type="p">120~122:先進先出緩衝器</p>
        <p type="p">130:輸入電路</p>
        <p type="p">140:輸出電路</p>
        <p type="p">COU:計數值</p>
        <p type="p">DIN:輸入資料</p>
        <p type="p">DDO:延遲資料</p>
        <p type="p">SA0~SA2:儲存資料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="649px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621949</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144336</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B65B51/32</main-classification>
        <further-classification edition="200601120241230B">B65B31/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹家綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹家綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可自動降溫的真空包裝機</chinese-title>
        <english-title>AUTOMATIC COOLING VACUUM PACKAGING MACHINE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種可自動降溫的真空包裝機，係於主機體之工作平面設有長孔，以供負壓組件之吸氣連接管或排氣連接管穿設於其中，並與熱熔組件相貼靠，使用時，欲操作之包裝袋以袋口置於工作平面上，當負壓源作用產生吸力時，包裝袋中的空氣透過吸嘴通過吸氣連接管來抽出包裝袋中的空氣，再透過熱熔組件將袋口密封，最後透過排氣連接管將空氣排出，則當空氣通過吸氣連接管或排氣連接管時，係自動帶走熱熔組件的殘熱，進而達到使熱熔組件降溫的作用，故使用者可無須等候熱熔組件降溫，而可長時間連續使用本發明之真空包裝機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention is an automatic cooling vacuum packaging machine. A long slot is provided on the working surface of the main body, allowing a suction connection pipe or an exhaust connection pipe of the vacuum component to pass through and align with the heat-sealing component. During use, the packaging bag is placed with its opening on the working surface. When the vacuum source generates suction, air inside the packaging bag is drawn out through a suction nozzle connected to the suction connection pipe. The bag's opening is then sealed by the heat-sealing component. Subsequently, air is expelled through the exhaust connection pipe. As air passes through the suction or exhaust connection pipes, residual heat from the heat-sealing component is automatically carried away, achieving a cooling effect for the heat-sealing component. This design eliminates the need for the user to wait for the heat-sealing component to cool, allowing continuous operation of the vacuum packaging machine for extended periods.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主機體</p>
        <p type="p">11:底座</p>
        <p type="p">111:盒體</p>
        <p type="p">112:工作平面</p>
        <p type="p">113:阻隔條</p>
        <p type="p">114:長孔</p>
        <p type="p">115:排氣孔</p>
        <p type="p">12:把手</p>
        <p type="p">121:樞接側</p>
        <p type="p">122:工作面</p>
        <p type="p">123:壓條</p>
        <p type="p">20:熱熔組件</p>
        <p type="p">21:固定板</p>
        <p type="p">22:發熱條</p>
        <p type="p">23:耐熱層</p>
        <p type="p">30:負壓組件</p>
        <p type="p">31:負壓源</p>
        <p type="p">32:吸嘴</p>
        <p type="p">33:吸氣連接管</p>
        <p type="p">34:排氣連接管</p>
        <p type="p">40:集汙盒</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="1035px" img-content="tif" inline="yes" orientation="portrait" width="762px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623114</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144337</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241223B">H01R13/52</main-classification>
        <further-classification edition="200601120241223B">F16L37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏致電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACES ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭榮勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, RONG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滕昌和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, CHANG-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>防水連接器組及其母座防水連接器</chinese-title>
        <english-title>WATERPROOF CONNECTOR ASSEMBLY AND FEMALE WATERPROOF CONNECTOR THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種防水連接器組及其母座防水連接器，該母座防水連接器係包含一第一管體、一按壓卡扣件及一防壓件；其中該按壓卡扣件的一按壓部係間隔設置於該母座防水連接器的一第一管體的外側，並靠近該第一管體的一第一前管口，而該防壓件係可軸向移動地設置在該第一管體的外側，當該防壓件移動至該第一管體的外側的第一位置時，該按壓卡扣件之該按壓部相對該第一管體的外側徑向移動一第一距離，當該防壓件移動至該第一管體的外側的第二位置時，該按壓卡扣件之該按壓部相對該第一管體的外側徑向移動一第二距離；其中該第二距離係短於第一距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates a waterproof connector assembly and female waterproof connector thereof. The female waterproof connector includes a first pipe body, a pressing buckle and an anti-pressure piece. A pressing part of the pressing is spaced apart on an outside of a first pipe body of the female waterproof connector and close to a first front pipe opening of the first pipe body. The anti-pressure piece is axially movably disposed on the outside of the first pipe body. When the anti-pressure piece moves to a first position on the outside of the first pipe body, the pressing part of the pressing buckle moves radially relative to the outside of the first pipe body by a first distance. When the anti-pressure piece moves to a second position on the outside of the first pipe body, the pressing part of the pressing buckle moves radially a second distance relative to the outside of the first pipe body. The second distance is shorter than the first distance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:防水連接器</p>
        <p type="p">10:母座防水連接器</p>
        <p type="p">11:第一管體</p>
        <p type="p">111:外側</p>
        <p type="p">112:第一凹環槽</p>
        <p type="p">113:第二凹環槽</p>
        <p type="p">20:防壓件</p>
        <p type="p">22:阻擋部</p>
        <p type="p">30:按壓卡扣件</p>
        <p type="p">31:按壓部</p>
        <p type="p">311:凹槽</p>
        <p type="p">321:下部</p>
        <p type="p">411:前端</p>
        <p type="p">42:第一活動閥件</p>
        <p type="p">421:第二密封件</p>
        <p type="p">43:第一彈簧</p>
        <p type="p">50:公端防水連接器</p>
        <p type="p">521:倒刺</p>
        <p type="p">71:第二活動閥件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="606px" img-content="tif" inline="yes" orientation="portrait" width="853px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622409</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144338</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">F16L37/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏致電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACES ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭榮勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, RONG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滕昌和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, CHANG-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>防水連接器組及其公端防水連接器</chinese-title>
        <english-title>WATERPROOF CONNECTOR ASSEMBLY AND MALE WATERPROOF CONNECTOR THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種防水連接器組及其公端防水連接器，該公端防水連接器係包含有一第二管體、一第二水管接合件及一第二水閥組件；其中該第二水管接合件係套接在該第二管體之後連接部之外側，且對應該後連接部的第二後管口形成一第二內縮部，該第二內縮部具有一第二直立內壁面，供該第二水閥組件的第二彈簧之一端係抵止於其上；如此，該第二彈簧能穩固地設置在該第二直立內壁面上，於長期在水流中軸向伸縮，較不易變形以提供穩定的彈力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a waterproof connector assembly and male waterproof connector. The male waterproof connector includes a second pipe body, a second water pipe joint and a second water valve assembly. The second water pipe joint is sleeved on an outside of a rear connection part of the second pipe body and has a second neck corresponding to a second rear pipe opening of the rear connection part. The second neck has an upright inner wall which one end of a second spring of the second water valve assembly is deposed against. Therefore, the second spring can be stably disposed on the second upright inner wall surface. It expands and contracts axially in the water flow for a long time and is less likely to deform to provide stable elasticity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:防水連接器</p>
        <p type="p">10:母座防水連接器</p>
        <p type="p">11:第一管體</p>
        <p type="p">111:外側</p>
        <p type="p">112:第一凹環槽</p>
        <p type="p">113:第二凹環槽</p>
        <p type="p">20:防壓件</p>
        <p type="p">22:阻擋部</p>
        <p type="p">30:按壓卡扣件</p>
        <p type="p">31:按壓部</p>
        <p type="p">311:凹槽</p>
        <p type="p">321:下部</p>
        <p type="p">411:前端</p>
        <p type="p">42:第一活動閥件</p>
        <p type="p">421:第二密封件</p>
        <p type="p">43:第一彈簧</p>
        <p type="p">50:公端防水連接器</p>
        <p type="p">521:倒刺</p>
        <p type="p">60:第二水管接合件</p>
        <p type="p">61:內縮部</p>
        <p type="p">611:第二直立內壁面</p>
        <p type="p">71:第二活動閥件</p>
        <p type="p">72:第二彈簧</p>
        <p type="p">722:端</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="602px" img-content="tif" inline="yes" orientation="portrait" width="917px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623276</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144341</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04R5/04</main-classification>
        <further-classification edition="200601120250303B">H04R3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凌通科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENERALPLUS TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅立聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, LI SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>雙模式音訊傳碼系統以及雙模式音訊傳碼方法</chinese-title>
        <english-title>DUAL-MODE AUDIO CODING SYSTEM AND DUAL-MODE AUDIO CODING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種雙模式音訊傳碼系統以及雙模式音訊傳碼方法，此雙模式音訊傳碼系統包括一訊號傳送裝置和一訊號接收裝置。傳送裝置包含第一控制電路和揚聲電路，揚聲電路結合聲音振膜及電磁線圈，根據第一控制電路的指令發出音頻聲波和高頻聲波訊號，同時透過電磁線圈傳送電磁訊號，且高頻聲波訊號的頻率高於音頻聲波。接收裝置由第二控制電路及聲音接收電路和電磁接收電路組成，用於接收音頻及高頻聲波訊號和電磁訊號。第一控制電路將通訊訊號調變為高頻聲波訊號和電磁訊號，而第二控制電路則解調變接收到的訊號，重建原始通訊訊號。        &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dual-mode audio coding system and a dual-mode audio coding method are provided in the embodiments of the present invention. The system includes a signal transmission device and a signal reception device. The transmission device comprises a first control circuit and a sound circuit, where the sound circuit incorporates a sound diaphragm and an electromagnetic coil. Based on the instructions from the first control circuit, it emits audio sound waves and high-frequency sound waves while transmitting electromagnetic signals through the coil, with the frequency of the high-frequency sound waves being higher than that of the audio sound waves. The reception device consists of a second control circuit, a sound reception circuit, and an electromagnetic reception circuit, which are used to receive audio and high-frequency sound waves as well as electromagnetic signals. The first control circuit modulates communication signals into high-frequency sound waves and electromagnetic signals, while the second control circuit demodulates the received signals to reconstruct the original communication signals.        &lt;br/&gt;&lt;br/&gt;&lt;b&gt;&lt;br/&gt;&lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:訊號傳送裝置</p>
        <p type="p">102:訊號接收裝置</p>
        <p type="p">103:第一揚聲電路</p>
        <p type="p">104:第一控制電路</p>
        <p type="p">105:聲音接收電路</p>
        <p type="p">106:電磁接收電路</p>
        <p type="p">107:第二控制電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="471px" img-content="tif" inline="yes" orientation="portrait" width="689px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623293</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144351</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200901120250303B">H04W52/18</main-classification>
        <further-classification edition="200901120250303B">H04W52/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海華科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZUREWAVE TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳悟一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓定衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, TING-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡馨尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, HSIN-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪偉嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, WEI-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>危宇甜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YU-TIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>運用歷史數據關聯性產生功率補償值的方法與無線通訊模組</chinese-title>
        <english-title>METHOD FOR GENERATING POWER-COMPENSATION VALUES WITH HISTORICAL DATA ASSOCIATION AND WIRELESS COMMUNICATION MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種運用歷史數據關聯性產生功率補償值的方法與無線通訊模組，在方法中，取得無線通訊模組運作在多個頻率的功率補償值之間的關聯性的歷史數據，從中計算多個頻率的功率補償值之間的多筆關聯性數值的總和，再從這些關聯性數值的總和得出其中最大值，據此決定關鍵頻率，關鍵頻率與多個頻率的功率補償值之間的多筆關聯性數值即形成預選集，如此，可以關鍵頻率的功率補償值，參照預選集中與多個頻率之間的關聯性數值推估適用多個頻率的功率補償值，形成寫入記憶體的功率補償清單。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for generating power-compensation values with historical data association and a wireless communication module are provided. In the method, historical data of associations among the power-compensation values for multiple frequencies that the wireless communication module operates on are obtained. Summations of multiple values of associations among the power-compensation values in multiple frequencies are calculated, and a largest summation of the values of associations is used to decide a critical frequency. The multiple values of associations between the power-compensation value of the critical frequency and the power-compensation values of the multiple frequencies form a dataset. The power-compensation values appropriate to the multiple frequencies can be estimated based on the power-compensation value of the critical frequency in view of the values of associations among the multiple frequencies. A power-compensation list written into a memory is formed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:測試平台</p>
        <p type="p">301:測試儀器</p>
        <p type="p">307:運算電路</p>
        <p type="p">303:歷史數據</p>
        <p type="p">305:功率補償清單</p>
        <p type="p">300:無線通訊模組</p>
        <p type="p">311:無線通訊電路</p>
        <p type="p">313:記憶體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.png" file="d10016.TIF" giffile="ed10016.png" height="696px" img-content="tif" inline="yes" orientation="portrait" width="555px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623274</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144360</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04R3/02</main-classification>
        <further-classification edition="200601120250303B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商美律電子(深圳)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERRY ELECTRONICS(SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳江凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIANG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭冠德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, GUAN-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於音訊處理的電子裝置和方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD FOR AUDIO PROCESSING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於音訊處理的電子裝置和方法。方法包含：通過反饋麥克風偵測聲音訊號；根據聲音訊號選擇聲音參數的第一配置以及第二配置的其中之一以取得受選配置；以及根據受選配置以通過揚聲器輸出音訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a method for audio processing are provided. The method includes: detecting a sound signal through a feedback microphone; selecting one of a first configuration and a second configuration of a sound parameter to obtain a selected configuration; and outputting audio through a speaker according to the selected configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301,S302,S303:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="417px" img-content="tif" inline="yes" orientation="portrait" width="552px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622169</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144364</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C08L25/02</main-classification>
        <further-classification edition="200601120241220B">C08L25/08</further-classification>
        <further-classification edition="200601120241220B">C08L45/00</further-classification>
        <further-classification edition="200601120241220B">C08L71/12</further-classification>
        <further-classification edition="200601120241220B">C08K5/01</further-classification>
        <further-classification edition="200601120241220B">C08J5/24</further-classification>
        <further-classification edition="200601120241220B">B32B15/08</further-classification>
        <further-classification edition="200601120241220B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔鈺君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUI, YU-JUIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宏毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃威儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂組成物及包括其的預浸體及覆金屬積層板</chinese-title>
        <english-title>RESIN COMPOSITION AND PREPREG AND METAL CLAD LAMINATE INCLUDING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種樹脂組成物，包括樹脂混合物，其中，以樹脂混合物的總重量計，樹脂混合物包括10重量%至50重量%的聚茚滿樹脂、10重量%至40重量%的聚苯醚樹脂、10重量%至70重量%的包括聚苯乙烯類熱塑性彈性體的低介電樹脂以及5重量%至20重量%的交聯劑。本發明的樹脂組成物所製成的覆金屬積層板能夠具有超低介電損耗因子及提高的玻璃轉移溫度，以滿足高階伺服器產品的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resin composition is provided. The resin composition includes a resin mixture, which includes 10 wt% to 50 wt% of a polyindene resin, 10 wt% to 40 wt% of a PPE resin, 10 wt% to 70 wt% of a low dielectric resin including a polystyrene-based thermoplastic elastomer, and 5 wt% to 20 wt% of a cross-linking agent, based on a total weight of the resin mixture. The resin composition enables the production of a metal clad laminate having an extremely low dissipation factor and an increased glass transition temperature, thereby meeting the requirements of high-end server products.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622021</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144386</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250917B">C04B37/02</main-classification>
        <further-classification edition="201101120250917B">B82Y30/00</further-classification>
        <further-classification edition="201101120250917B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳總興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉元浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>覆銅基板與製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係在提供一種覆銅基板結構與其製作方法，包含將氮化鋁基板浸泡在氧化鋁奈米溶膠中以特定速度拉升形成表面鍍膜；將該含有氧化鋁奈米溶膠鍍膜之氮化鋁基板取出放入烘箱烘乾；將烘乾後含有奈米氧化鋁薄膜之氮化鋁基板放入箱型爐中進行燒結；燒結完成後將銅片放置在含有燒結奈米氧化鋁薄膜之氮化鋁基板之上下兩個表面，進入氮氣爐在特定溫度下形成覆銅基板，達到高貼合強度。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="509px" img-content="tif" inline="yes" orientation="portrait" width="601px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623269</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144393</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H04R1/00</main-classification>
        <further-classification edition="202601120260302B">H04R1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商美律電子(深圳)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERRY ELECTRONICS(SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宏威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOU, HUNG-UEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王克民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KO MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃中一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無線耳機</chinese-title>
        <english-title>WIRELESS HEADSET</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線耳機，包括一耳機本體以及一電池組件。耳機本體包括一外殼、一導電部以及一第一接合件。導電部位於外殼內。第一接合件連接於外殼。電池組件可拆卸地連接於耳機本體，電池組件包括一第二接合件。在一第一狀態下，電池組件組裝於耳機本體，且第一接合件固定於第二接合件，導電部電性連接於電池組件。在第一狀態轉換至一第二狀態的過程中，通過一外力驅使第一接合件分離於第二接合件，進而使電池組件分離於耳機本體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless headset includes a headset body and a battery component. The headset body includes a housing, a conductive part and a first connecting component. The conductive part is located within the housing. The first connecting component is connected to the housing. The battery component is detachably connected to the headset body, and the battery component includes a second connecting component. In a first state, the battery component is assembled on the headset body, the first connecting component is fixed on the second connecting component, and the conductive part is electrically connected to the battery component. During the transition from the first state to a second state, an external force is used to drive the first connecting component to separate from the second connecting component, thereby causing the battery component to separate from the headset body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無線耳機</p>
        <p type="p">110:耳機本體</p>
        <p type="p">112:外殼</p>
        <p type="p">1121:前殼</p>
        <p type="p">1122:後殼</p>
        <p type="p">120:電池組件</p>
        <p type="p">124:驅動部</p>
        <p type="p">T1:耳柄部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="961px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621855</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144394</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">B25B13/06</main-classification>
        <further-classification edition="200601120250123B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和嘉興精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGC TORQUE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, WEN JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, WEN JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴翊慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>扭力工具</chinese-title>
        <english-title>TORQUE TOOL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種扭力工具，其包括：一第一桿體，沿一長度方向延伸，凹設一溝槽及複數定位部；一第二桿體，其徑向貫設相連通之一穿設孔及一容孔，該第一桿體穿設該穿設孔，該第二桿體另設有一通孔，該通孔之內孔壁設有一環溝槽，該環溝槽設有一限位環，該限位環至少部分徑向凸出該環溝槽；及一定位組件，其包括一控制件、一定位珠及一彈性件，該控制件穿設該容孔且可相對該容孔於一鎖定位置及一釋放位置之間移動，該彈性件彈抵於該容孔之一第一抵緣及該控制件之間，該定位珠容設於該通孔，該定位珠可朝該穿設孔的方向卡抵該限位環。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A torque tool is provided, including: a first rod, extending along a longitudinal direction, recessed with a groove and a plurality of positioning portions; a second rod, radially disposed through a through hole and a receiving hole which are communicated with each other, the first rod disposed through the through hole, the second rod further having a passing hole, an inner wall of the passing hole having an annular groove, the annular groove having a restriction ring engaged therein, the restriction ring at least partially radially protruded out of the annular groove; and a positioning assembly, including a control member, a positioning ball and an elastic member, the control member disposed through the receiving hole and being movable relative to the receiving hole between a locking position and a releasing position, the elastic member elastically abutted between a first abutting flange and the control member, the positioning ball received within the passing hole and engaged with the restriction ring in the direction toward the restriction ring.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一桿體</p>
        <p type="p">20:第二桿體</p>
        <p type="p">21:工作端部</p>
        <p type="p">22:穿設孔</p>
        <p type="p">23:容孔</p>
        <p type="p">27:握桿</p>
        <p type="p">271:組接孔</p>
        <p type="p">28:驅動桿</p>
        <p type="p">281:擴徑段</p>
        <p type="p">282:組接端部</p>
        <p type="p">29:卡珠</p>
        <p type="p">30:限位環</p>
        <p type="p">40:定位組件</p>
        <p type="p">41:控制件</p>
        <p type="p">412:第一端部</p>
        <p type="p">413:第二端部</p>
        <p type="p">42:定位珠</p>
        <p type="p">43:彈性件</p>
        <p type="p">50:強化件</p>
        <p type="p">61:彈推件</p>
        <p type="p">62:導引件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="692px" img-content="tif" inline="yes" orientation="portrait" width="870px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621856</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144397</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">B25B13/06</main-classification>
        <further-classification edition="200601120250123B">B25B23/142</further-classification>
        <further-classification edition="200601120250123B">B25B23/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和嘉興精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGC TORQUE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, WEN JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, WEN JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴翊慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>扭力工具</chinese-title>
        <english-title>TORQUE TOOL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種扭力工具，包括：一本體，其包括之一第一管體及一第二管體；一驅動部，設於該第二管體，當該驅動部受到大於一扭力設定值之扭力時會產生跳脫現象；一扭力調節機構，可調整該扭力設定值；一握把，外周設有複數卡槽；及一定位機構，包括一滑套及至少一定位件，該滑套相對該本體及該握把可於一鎖定位置及一釋放位置之間活動；其中，當該滑套位於該鎖定位置時，該至少一定位件卡抵該至少一該卡槽，使該握把不可相對該本體轉動；當該滑套位於該釋放位置時，該至少一定位件可脫離該至少一該卡槽，使該握把可相對該本體轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A torque tool is provided, including: a main body, including a first tube and a second tube; a driving portion, disposed on the second tube, when the driving portion is subjected to a torque greater than a preset torque value, the driving portion will produce a disengagement action; a torque adjustment mechanism, adjusted the preset torque value; a handle, having a plurality of engaging grooves on its outer circumference; and a positioning mechanism, including a sliding sleeve and at least one positioning member, the sliding sleeve being movable relative to the main body and the handle between a locking position and a releasing position; wherein when the sliding sleeve is located at the locking position, the at least one positioning member is engaged with the at least one engaging groove, the handle cannot be rotated relative to the main body; when the sliding sleeve is located in the releasing position, the at least one positioning member is disengaged from the at least one engaging groove, the handle can be rotated relative to the main body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:扭力工具</p>
        <p type="p">10:本體</p>
        <p type="p">11:第一管體</p>
        <p type="p">12:第二管體</p>
        <p type="p">15:第一視窗</p>
        <p type="p">16:結合件</p>
        <p type="p">20:驅動部</p>
        <p type="p">40:握把</p>
        <p type="p">50:定位機構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="661px" img-content="tif" inline="yes" orientation="portrait" width="974px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623505</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144402</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10P10/00</main-classification>
        <further-classification edition="202601120260303B">H10P76/40</further-classification>
        <further-classification edition="202601120260303B">H10P70/00</further-classification>
        <further-classification edition="200601120260303B">C30B25/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周政偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚毓峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, YU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈士強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, SHYH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體結構，包含基板、設置於基板上的半導體層與設置於基板上的複數個磊晶堆疊。基板包含彼此相鄰的晶粒區與切割區。磊晶堆疊設置於半導體層上並位於晶粒區中。該些磊晶堆疊彼此之間具有開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure is provided, including a substrate, a semiconductor layer disposed on the substrate and a plurality of epitaxy stacks disposed the semiconductor layer. The substrate has a die region and a scribe region adjacent to each other. The plurality of epitaxial disposed on the substrate in the die region. The plurality of epitaxial stacks has an opening between each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">100S:(圖案化)半導體層</p>
        <p type="p">110:磊晶堆疊</p>
        <p type="p">110t:突出部</p>
        <p type="p">1001:切割區</p>
        <p type="p">1002:晶粒區</p>
        <p type="p">A:方法</p>
        <p type="p">O:開口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="438px" img-content="tif" inline="yes" orientation="portrait" width="639px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623123</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144412</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250113B">H01R13/6581</main-classification>
        <further-classification edition="201101120250113B">H01R13/6582</further-classification>
        <further-classification edition="200601120250113B">H01R13/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱依柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YI-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡才揮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, TSAI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江圳祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHUN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>連接器外殼</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器外殼，包含一外殼本體以及一屏蔽件。該外殼本體具有多個壁、由該等壁界定且沿一插接方向延伸的一插接通道，以及與該插接通道連通的一插口，該外殼本體的其中一該壁具有沿該插接方向延伸的兩個細縫。該屏蔽件設於該外殼本體的該壁，該屏蔽件包括設於該外殼本體內側的一第一彈片、設於該外殼本體外側的一第二彈片，以及連接在該第一彈片與該第二彈片之間並夾持在該外殼本體的該插口的邊緣上的一彎折部，該第一彈片具有位於自由端且分別對應該兩個細縫的兩個折片部，該兩個折片部分別自該壁的內壁面往外壁面穿過該兩個細縫後向該壁的外壁面彎折。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器外殼</p>
        <p type="p">1:外殼本體</p>
        <p type="p">11:插接通道</p>
        <p type="p">12:插口</p>
        <p type="p">13:頂壁</p>
        <p type="p">14:底壁</p>
        <p type="p">15:側壁</p>
        <p type="p">16:後壁</p>
        <p type="p">17:細縫</p>
        <p type="p">18:凹部</p>
        <p type="p">2:屏蔽件</p>
        <p type="p">21:第一彈片</p>
        <p type="p">211:第一彈性指部</p>
        <p type="p">212:連接部</p>
        <p type="p">212a:末端緣</p>
        <p type="p">213:折片部</p>
        <p type="p">22:第二彈片</p>
        <p type="p">221:第二彈性指部</p>
        <p type="p">23:彎折部</p>
        <p type="p">D1:前後方向</p>
        <p type="p">D2:上下方向</p>
        <p type="p">D3:左右方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="723px" img-content="tif" inline="yes" orientation="portrait" width="973px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622398</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144413</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16F15/02</main-classification>
        <further-classification edition="200601120241230B">B63B39/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余昇鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃怡慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>海上裝置及其穩定器</chinese-title>
        <english-title>AN MARINE DEVICE AND A STABILIZER THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種海上裝置及其穩定器，該穩定器用於外掛在海上的一物件與一浮力單元，且包含一環座及多個阻尼模組。該環座設置在該物件且具有多個連接部。該等阻尼模組連接在該環座與該浮力單元間。每一該阻尼模組包括一第一活動單元、一第二活動單元及一阻尼器單元。該第一活動單元可活動地定位在該浮力單元。該第二活動單元可活動地定位在該環座的其中一該連接部。該阻尼器單元連接在該第二活動單元與該第一活動單元之間，並產生削減自然環境作用力的一阻尼力。該阻尼器單元具有一阻尼棒及一能轉動地螺接於該阻尼棒的容置筒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An marine device and a stabilizer thereof for an object suspended at the sea and a buoyancy unit, and comprising a ring seat and a plurality of damping modules. The ring seat is disposed at the object and has a plurality of connection portions. The damping modules are connected between the ring seat and the buoyancy unit. Each of the damping modules includes a first activity unit, a second activity unit, and a damper unit. The first activity unit is movably positioned at the buoyancy unit. The second activity unit is movably positioned at one of the connection portions of the ring seat. The damper unit is connected between the second activity unit and the first activity unit, and generates a damping force that reduces a natural environmental force. The damper unit has a damping rod and a receiving tube receiving cylinder rotatably threaded to the damping rod.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:浮力單元</p>
        <p type="p">11:基座組合</p>
        <p type="p">12:浮筒</p>
        <p type="p">13:延伸腿</p>
        <p type="p">14:支撐桿件</p>
        <p type="p">2:物件</p>
        <p type="p">21:塔柱</p>
        <p type="p">22:風力機組</p>
        <p type="p">300:穩定器</p>
        <p type="p">4:環座</p>
        <p type="p">5:阻尼模組</p>
        <p type="p">51:第一活動單元</p>
        <p type="p">52:第二活動單元</p>
        <p type="p">53:阻尼器單元</p>
        <p type="p">531:阻尼棒</p>
        <p type="p">532:容置筒</p>
        <p type="p">Z:上下方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="981px" img-content="tif" inline="yes" orientation="portrait" width="621px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622739</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144414</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">G06F11/14</main-classification>
        <further-classification edition="200601120260302B">G06F11/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神雲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAC COMPUTING TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林旺杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WANG CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基本輸入輸出系統資料回復方法及其運算裝置</chinese-title>
        <english-title>METHOD OF BASIC INPUT OUTPUT SYSTEM DATA RECOVERY AND COMPUTING DEVICE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基本輸入輸出系統資料回復方法，適用於一運算裝置，利用一處理器來執行，並包含以下步驟：利用一優先存儲區塊儲存的一基本輸入輸出系統的一配置資料執行電力開啟自我測試程序，並判定過程中是否發生故障，當此過程發生故障時重新啟動該運算裝置；利用一備援存儲區塊儲存的該配置資料執行電力開啟自我測試程序，並判定過程中是否發生故障，當此過程未發生故障時，傳送一毀損資料至一基板管理控制器；及根據該備援存儲區塊的該配置資料更新該優先存儲區塊的該配置資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a method of basic input output system data recovery which is applicable to a computing device, a processor is configured to perform the steps of: utilizing a configuration data of a basic input output system stored in a priority storage block to execute a power-on self-test program; determining whether a failure occurs during the process of power-on self-test; restarting the computing device when the failure occurs; utilizing the configuration data stored in a backup storage block to execute the power-on self-test program; determining whether a failure occurs during the process of power-on self-test; sending corruption data to a baseboard management controller when no failure occurs; and updating the configuration data of the priority storage block according to the configuration data of the backup storage block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201~S210:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="1006px" img-content="tif" inline="yes" orientation="portrait" width="773px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622902</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144415</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250227B">G06V10/70</main-classification>
        <further-classification edition="202201120250227B">G06V40/10</further-classification>
        <further-classification edition="200601120250227B">G08B21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國防醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL DEFENSE MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全濠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING HOLD TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪進茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIN-MAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許蕙玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HUI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫雍智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳乙瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠今</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUAN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊淳米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHUEN-MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林豐平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, FENG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳雪齡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSUEH-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁忠誌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔佩怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUI, PEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慧足</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI-TSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳羿伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施佳玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHIA-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡鉅洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHU-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="18">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧萱盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HSUAN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="19">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝明俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>防護衣著裝檢測系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防護衣著裝檢測系統，包含一用於拍攝一使用者的影像以輸出一影像資料的攝影單元、一顯示單元及一控制單元。該控制單元接收來自該攝影單元的該影像資料；該控制單元將該影像資料輸入一用於辨識多個被適當穿戴的預定裝備的基於人工智慧的物件辨識模型以產生分別對應於該等預定裝備的多筆辨識結果；該控制單元根據該等辨識結果分別產生分別對應於該等預定裝備且指示該等預定裝備是否被適當穿戴的多個檢測結果通知，並經由該顯示單元顯示該等檢測結果通知，因此能夠檢測並通知該使用者是否正確穿戴好該等預定裝備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:防護衣著裝檢測系統</p>
        <p type="p">1:攝影單元</p>
        <p type="p">2:顯示單元</p>
        <p type="p">3:控制單元</p>
        <p type="p">9:權限管理系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="726px" img-content="tif" inline="yes" orientation="portrait" width="789px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622451</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144416</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01B7/14</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂華股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RORZE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福崎義樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUZAKI, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>靜電電容感測器</chinese-title>
        <english-title>ELECTROSTATIC CAPACITANCE SENSOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種不會受到設置於交流供給源的含有既定頻率之任何頻率的雜訊影響之靜電電容感測器。檢測部10a、10b被供給反相位的交流訊號。一對運算放大器28a、28b的反相輸入端子係連接有對應的一方的檢測部，非反相輸入端子係連接有交流訊號。一對運算放大器28a、28b的輸出端子，係與對應的一方的前級差動放大器之一方的輸入端子連接。前級差動放大器34a、34b之另一方的輸入端子係以一方成為正相位，另一方成為反相位之方式連接交流電壓。一對前級差動放大器34a、34b的輸出端子係與後級差動放大器30的兩個輸入端子分別連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:元件部</p>
        <p type="p">10a,10b:檢測部</p>
        <p type="p">18:指狀物</p>
        <p type="p">19:流路</p>
        <p type="p">21a,21b:吸附墊</p>
        <p type="p">22a,22b:支撐間隔件</p>
        <p type="p">24a,24b:第1保護電極</p>
        <p type="p">25a,25b:感測器電極</p>
        <p type="p">40:配線部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="807px" img-content="tif" inline="yes" orientation="portrait" width="696px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622422</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144418</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120241230B">F24F1/26</main-classification>
        <further-classification edition="200601120241230B">F25B45/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奕華五金股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商本甘股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENKAN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大川智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳行一</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>冷媒管體之連接組立方法及其結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種冷媒管體之連接組立方法及其結構，係具有一圓狀之本體管及一延伸管，該本體管係於鄰近端部之位置設有一環狀之浮突部。該組立方法之主要特徵在於：於該延伸管環設一止漏環；使該止漏環位於浮突部內緣與延伸管外緣之間；將該延伸管一端套接安裝於該本體管一端內部；再於該浮突部之前方及後方的適當位置，經由加壓緊固以形成六角形之接合段。藉由該前方接合段及後方接合段，以及被壓縮之止漏環，使連接之冷媒管體具有強韌之防拔及防脫落作用，以及可達到確實之防洩漏效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體管</p>
        <p type="p">11:浮突部</p>
        <p type="p">14:第一接合段</p>
        <p type="p">15:第二接合段</p>
        <p type="p">2:延伸管</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="624px" img-content="tif" inline="yes" orientation="portrait" width="670px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623225</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144423</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04L1/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃國貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUO CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>資料傳送裝置及其方法</chinese-title>
        <english-title>DATA TRANSMISSION DEVICE AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資料傳送裝置及其方法，用以根據一時脈訊號與一外部裝置進行資料傳送，資料傳送裝置包含資料傳送裝置、第一傳送率偵測單元、第二傳送率偵測單元以及補償單元。資料收發單元與外部裝置進行封包收發。第一傳送率偵測單元根據第一封包以及時脈訊號偵測資料傳送率之整數部分。第二傳送率偵測單元根據第二封包、整數部分以及時脈訊號偵測資料傳送率之小數部分。當資料收發單元根據資料傳送率傳送第三封包至外部裝置時，補償單元根據小數部分對第三封包進行一位元時脈補償操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data transmission device and method thereof for performing data transmission with an external device based on a clock signal. The data transmission device includes a data transceiver unit, a first transmission rate detection unit, a second transmission rate detection unit, and a compensation unit. The data transceiver unit transmits and receives packets with the external device. The first transmission rate detection unit detects an integer part of a data transmission rate based on a first packet and the clock signal. The second transmission rate detection unit detects a fractional part of the data transmission rate based on a second packet, the integer part, and the clock signal. When the data transceiver unit transmits a third packet to the external device based on the data transmission rate, the compensation unit performs a bit-clock compensation operation on the third packet based on the fractional part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:資料傳送裝置</p>
        <p type="p">12:資料收發單元</p>
        <p type="p">121:第一封包</p>
        <p type="p">122:第二封包</p>
        <p type="p">123:第三封包</p>
        <p type="p">13:第一傳送率偵測單元</p>
        <p type="p">131:整數部分</p>
        <p type="p">14:第二傳送率偵測單元</p>
        <p type="p">141:位元偵測狀態表</p>
        <p type="p">15:補償單元</p>
        <p type="p">151:位元時脈補償操作</p>
        <p type="p">16:外部裝置</p>
        <p type="p">191:時脈訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="556px" img-content="tif" inline="yes" orientation="portrait" width="730px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622374</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144425</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">F04D29/40</main-classification>
        <further-classification edition="200601120250108B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大井泵浦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃景豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>泵浦保護罩</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種泵浦保護罩，其具有一殼體以及一出水片體。殼體具有一入水口以及一出水槽道。入水口形成於殼體的其中一面，出水槽道形成於殼體的頂面並延伸至殼體相對於入水口的另一面。出水槽道具有一上出水口及一側出水口。上出水口形成於殼體的頂面，側出水口位於殼體相對於入水口的該另一面。出水片體可拆卸式地設置於出水槽道中，且具有一上固定片、一上封閉片及一側封閉片。上固定片可拆卸式地設置於出水槽道中，上封閉片可分離地連接上固定片，且封閉出水槽道的上出水口。側封閉片可分離地連接上固定片，且封閉出水槽道的側出水口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼體</p>
        <p type="p">12:出水槽道</p>
        <p type="p">123:上出水卡合部</p>
        <p type="p">30:出水片</p>
        <p type="p">31:上固定片</p>
        <p type="p">32:上封閉片</p>
        <p type="p">33:側封閉片</p>
        <p type="p">34:下固定片</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="717px" img-content="tif" inline="yes" orientation="portrait" width="812px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621658</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144427</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A61G7/05</main-classification>
        <further-classification edition="200601120241230B">A47C27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大漢家具有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義居雅舍股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIJU YASHE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭翊弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳麒文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃博煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李恆儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HENG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭雲龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YUN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>左偉垣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZUO, WEI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>配合人體型態的床體結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種配合人體型態的床體結構，包含：一支撐層及一舒適層，支撐層包括複數個壓縮方向平行重力方向的彈簧，舒適層在重力方向上設置於支撐層的上方，舒適層在垂直於重力方向的一長度方向上劃分有複數區段，各區段選用自複數種柔軟基材，而使得複數區段的柔軟度不完全相同。本發明的配合人體型態的床體結構可以貼合人體的曲線，讓人體的主要肌肉分別被具有適當的柔軟度的區段支撐，獲得全身放鬆舒眠的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:配合人體型態的床體結構</p>
        <p type="p">1:支撐層</p>
        <p type="p">11:彈簧</p>
        <p type="p">2:舒適層</p>
        <p type="p">21~26:區段</p>
        <p type="p">g:重力方向</p>
        <p type="p">L:長度方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="577px" img-content="tif" inline="yes" orientation="portrait" width="995px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621618</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144431</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241130B">A47J39/02</main-classification>
        <further-classification edition="200601120241130B">A47J36/28</further-classification>
        <further-classification edition="200601120241130B">A47J41/00</further-classification>
        <further-classification edition="200601120241130B">B65D81/38</further-classification>
        <further-classification edition="200601120241130B">B65D85/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禪與徠特有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENLET CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖惟昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝岳穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YUEH-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>恆溫容器</chinese-title>
        <english-title>THERMOSTATIC CONTAINER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種恆溫容器，其包含中層疊合於外層，氣隙形成於中層與外層間，中層具有內膽填充凝膠於其內，內層疊合於中層用於承載食物，外層底殼、內層表面材質包含共聚酯(tritan)。恆溫容器置於微波爐加熱30至60秒，或置放於冷藏室大於15分鐘冷凍，可達到維持食物溫度效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a thermostatic container including a middle layer stacked on an outer layer, an air gap is formed between the middle layer and the outer layer. The middle layer includes an inner tank filled with gel. An inner layer is stacked on the middle layer for carrying food. The materials of the bottom shell of the outer layer and the surface of the inner layer include tritan. The thermostatic container can be heated in the microwave oven for 30 to 60 seconds, or placed in the refrigerator for more than 15 minutes to achieve the purpose of food temperature insulation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:外層</p>
        <p type="p">110:氣隙</p>
        <p type="p">200:中層</p>
        <p type="p">210:內膽</p>
        <p type="p">300:內層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="464px" img-content="tif" inline="yes" orientation="portrait" width="693px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621891</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144438</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">B29C55/04</main-classification>
        <further-classification edition="200601120241204B">B64C1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢翔航空工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AEROSPACE INDUSTRIAL DEVELOPMENT CORPORTAION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁揮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JEN-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李筆中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張穎傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳為祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-SHIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅秀媚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, HSIU-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董明棠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, MING-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江繼開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHI-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹士弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, SHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃順吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHUN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>曲面座艙罩的製造方法及用於製造曲面座艙罩的預成形裝置和定形裝置</chinese-title>
        <english-title>MANUFACTURING METHOD OF AIRCRAFT CANOPIES, AND PREFORMING DEVICE AND FINALIZING SHAPE DEVICE FOR MANUFACTURING AIRCRAFT CANOPIES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種曲面座艙罩的製造方法包含：在預成形階段先將可軟化材料板配置在預成形模具與可撓曲加熱模組之間，使該可軟化材料板預成形成具有預定形狀的半成品；然後在定形階段將該半成品配置在承載模座的定形模穴中，並用密封模蓋密封該定形模穴，使該半成品在該定形模穴內形成一成形曲板；最後在成品階段，裁切該成形曲板而形成該曲面座艙罩。藉此，可快速地製造出高品質的曲面座艙罩。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of aircraft canopies includes: disposing a softenable material plate between a preforming mold and a flexible heating module to preform a semifinished product in a preforming stage; then, disposing the semifinished product in a forming cavity of a carrier seat and sealing up the forming cavity by a sealing cover to form a curve-shaped plate in the forming cavity in a forming stage; and finally, cutting the curve-shaped plate to form the aircraft canopy in a finished product stage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10:預成形階段</p>
        <p type="p">S20:定形階段</p>
        <p type="p">S30:成品階段</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="407px" img-content="tif" inline="yes" orientation="portrait" width="461px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622766</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144439</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250303B">G06F16/20</main-classification>
        <further-classification edition="201901120250303B">G06F16/24</further-classification>
        <further-classification edition="202301120250303B">G06N5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南山人壽保險股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN SHAN LIFE INSURANCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡其杭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHI-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游程盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHENG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳乃詩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, NAI-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王明婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫悉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, SHI-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智能擴充及搜尋結構化欄位之系統</chinese-title>
        <english-title>SYSTEM FOR INTELLIGENT EXPANSION AND SEARCH OF STRUCTURED FIELDS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之系統包含一伺服器，建構為執行提示工程以及提示優化工程。執行提示工程包含：建立提示，並且將原始知識檔案加入提示；輸入提示至大型語言模型；以及取得至少一詮釋資料，並且加入至少一詮釋資料至原始知識檔案被解析而成的複數個知識片段，以成為該等知識片段的至少一擴充欄位；執行提示優化工程包含：輸入提示優化提示至大型語言模型，並且取得詮釋資料篩選條件以及提示優化搜尋條件；基於詮釋資料篩選條件以及至少一擴充欄位篩選該等知識片段，以取得複數個已過濾知識片段；以及基於提示優化搜尋條件，搜尋該等已過濾知識片段中，以取得搜尋結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A disclosed system comprises a server, which is configured to execute a prompt operation and a prompt optimization operation. Executing the prompt operation comprises: creating a prompt, and adding an original knowledge file to the prompt; inputting the prompt to an LLM (Large Language Model, LLM); and obtaining at least one metadata, and adding the at least one metadata to a plurality of knowledge fragments parsed from the original knowledge file as at least one expansion field of the knowledge fragments; executing the prompt optimization operation comprises: inputting the prompt optimization prompt to the LLM, and obtaining an metadata filtering condition and a prompt optimization search condition; filtering the knowledge fragments based on the metadata filtering condition and the at least one expansion field to obtain a plurality of filtered knowledge fragments; and search the filtered knowledge fragments to obtain search results based on the prompt optimization search condition to obtain search results.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301~304:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="980px" img-content="tif" inline="yes" orientation="portrait" width="626px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622381</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144445</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16B21/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒昌行精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWIT PRECISION INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有多段式解鎖之固定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種具有多段式解鎖之固定裝置，包括：一基座，包括基部及位於基部上的柱體，基部二側各形成有定位壁，柱體內部形成有容置室，且於柱體二側各形成有與容置室呈連通狀之滑槽及收納槽，二收納槽各容置有滾動體；一旋轉座，其包括有船形部且船形部內部具有可套置於柱體外部之容置空間，於船形部二側各設有向外凸設之定位體及對位於二滑槽之軸孔，二滑槽與二軸孔係供樞軸穿設定位，以使船形部於柱體外部做一旋動，且樞軸外部套設有容置於二滑槽與二軸孔之間可做旋動復位的彈性元件， 而船形部之二定位體上形成有與基座之二定位壁形成卡合定位的複數卡點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">101:滑槽</p>
        <p type="p">102:收納槽</p>
        <p type="p">11:基部</p>
        <p type="p">111:底板</p>
        <p type="p">112:側板</p>
        <p type="p">1121:定位壁</p>
        <p type="p">1122:導弧部</p>
        <p type="p">12:柱體</p>
        <p type="p">121:夾座</p>
        <p type="p">1210:槽孔</p>
        <p type="p">14:滾動體</p>
        <p type="p">15:彈性體</p>
        <p type="p">2:旋轉座</p>
        <p type="p">201:軸孔</p>
        <p type="p">21:船形部</p>
        <p type="p">212:漸變斜壁</p>
        <p type="p">2122:鎖定側</p>
        <p type="p">214:擋止部</p>
        <p type="p">215:閃避孔</p>
        <p type="p">22:定位體</p>
        <p type="p">221:弧形部</p>
        <p type="p">222:弧面</p>
        <p type="p">223:第一卡點</p>
        <p type="p">224:第二卡點</p>
        <p type="p">225:第三卡點</p>
        <p type="p">226:第四卡點</p>
        <p type="p">23:樞軸</p>
        <p type="p">24:彈性元件</p>
        <p type="p">241:環形部</p>
        <p type="p">242:固定段</p>
        <p type="p">243:抵持段</p>
        <p type="p">25:操作部</p>
        <p type="p">3:頂持座</p>
        <p type="p">31:定位盤</p>
        <p type="p">32:頂桿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="1087px" img-content="tif" inline="yes" orientation="portrait" width="788px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623234</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144447</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L43/08</main-classification>
        <further-classification edition="202201120250303B">H04L67/12</further-classification>
        <further-classification edition="200601120250303B">G06F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大同大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭福烱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, FU-CHIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王岱鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DAI-XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉威成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>物聯網監控方法、監控模組的生成方法及電子裝置</chinese-title>
        <english-title>INTERNET OF THINGS MONITORING METHOD, MONITORING MODULE GENERATION METHOD AND ELECTRONIC APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種物聯網監控方法、監控模組的生成方法及電子裝置。首先，產生物聯網裝置的監控模組，包括：接收物聯網裝置的資源描述檔；基於資源描述檔中的各可監控設備的資源訊息，獲取對應於各可監控設備的視覺化物件以及控制碼，進而產生監控介面；基於資源描述檔中的連線訊息來產生控制邏輯；以及基於控制邏輯以及監控介面，產生監控模組。接著，響應於監控模組運行於用戶端裝置中，透過監控模組經由雲端伺服器來實現對物聯網裝置的監控。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An internet of things monitoring method, monitoring module generation method and electronic apparatus are provided. First, a monitoring module for an IOT apparatus is generated, including: receiving a resource description file of the IOT apparatus; based on resource information of each monitorable device in the resource description file, obtaining a visual object and control code corresponding to each monitorable device, and then generating a monitoring interface; generating a control logic based on connection information in the resource description file; and generating a monitoring module based on the control logic and the monitoring interface. Then, in response to the monitoring module running in a client apparatus, the monitoring module is used to monitor the IOT apparatus through a cloud server.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10、S20、S105~S120:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="803px" img-content="tif" inline="yes" orientation="portrait" width="708px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621896</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144452</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250102B">B32B7/04</main-classification>
        <further-classification edition="200601120250102B">B32B7/10</further-classification>
        <further-classification edition="200601120250102B">B32B27/08</further-classification>
        <further-classification edition="202501120250102B">H10F19/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾立涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, LI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴美君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, MEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉聖揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHENG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈宏欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HUNG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭柏齡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIAO, PO-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姵吟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PEI-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多層膜與太陽能電池封裝結構</chinese-title>
        <english-title>MULTI-LAYERED FILM AND SOLAR CELL PACKAGE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">多層膜包括：(A)阻氧層；(B)阻水氣層，位於(A)阻氧層上並直接接觸(A)阻氧層；以及(C)黏著層，位於(B)阻水氣層上並直接接觸(B)阻水氣層。(A)阻氧層包括(a)改質聚乙烯樹脂與(e)乙烯-乙烯醇共聚物。(B)阻水氣層包括190℃的熔融指數為20至40 g/10 min的(b1)第一乙烯-1-辛烯共聚物與190℃的熔融指數為1至10 g/10 min的(b2)第二乙烯-1-辛烯共聚物。(C)黏著層包括190℃的熔融指數為1至10 g/10 min之乙烯-丙烯酸甲酯-甲基丙烯酸縮水甘油酯共聚物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-layered film includes (A) oxygen barrier layer; (B) moisture barrier layer disposed on and directly contact with (A) oxygen barrier layer; and (C) adhesive layer disposed on and directly contact with (B) moisture barrier layer. (A) Oxygen barrier layer includes (a) modified polyethylene resin and (e) ethylene-vinyl alcohol copolymer. (B) Moisture barrier layer includes (b1) first poly(ethylene-co-1-octene) having a melting index of 20 to 40 g/10 min at 190℃ and (b2) second poly(ethylene-co-1-octene) having a melting index of 1 to 10 g/10 min at 190℃. (C) Adhesive layer includes poly(ethylene-co-methacrylate-co-glycidyl methacrylate) having a melting index of 1 to 10 g/10 min at 190℃.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:(A)阻氧層</p>
        <p type="p">13:(B)阻水氣層</p>
        <p type="p">15:(C)黏著層</p>
        <p type="p">100:多層膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="269px" img-content="tif" inline="yes" orientation="portrait" width="482px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622840</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144453</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120241204B">G06Q20/36</main-classification>
        <further-classification edition="202301120241204B">G06Q40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱特納科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYCATENA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾信田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳砥柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>加密貨幣錢包破解系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種加密貨幣錢包破解系統及方法，此系統包括前端採集模組、正規化模組、加密貨幣錢包演算法比對模組、助記詞還原模組，其中，前端採集模組會自電子設備採集錢包原始資料，供正規化模組將錢包原始資料處理為錢包正規化資料並標註錢包種類，而加密貨幣錢包演算法比對模組即根據錢包正規化資料及標註的錢包種類自預設之錢包矩陣清單提取對應錢包種類之錢包類型及其加密演算法，接著助記詞還原模組遂利用預設之字典檔以及錢包類型及其加密演算法，對錢包正規化資料進行分析與解密以還原出助記詞。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:電子設備</p>
        <p type="p">2:加密貨幣錢包破解系統</p>
        <p type="p">21:前端採集模組</p>
        <p type="p">22:正規化模組</p>
        <p type="p">23:加密貨幣錢包演算法比對模組</p>
        <p type="p">24:助記詞還原模組</p>
        <p type="p">C:雲端伺服器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="487px" img-content="tif" inline="yes" orientation="portrait" width="685px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623219</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144462</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250512B">H04B10/11</main-classification>
        <further-classification edition="200601120250512B">G02B5/08</further-classification>
        <further-classification edition="200601120250512B">G02B27/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOW, CHI WAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自由空間光通訊的光路自適應追蹤系統及方法</chinese-title>
        <english-title>LIGHT PATH ADAPTIVE TRACING SYSTEM AND METHOD FOR A FREE-SPACE OPTICAL COMMUNICATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自由空間光通訊的光路自適應追蹤系統，利用二個反射鏡及二個光感測器來進行光路自適應追蹤校準。當入射光的入射角或是入射位置發生變化時，該二個光感測器分別取得二個不同光程下的二個光斑中心座標。該光路自適應追蹤系統根據該二個光斑中心座標來分別調整該二個反射鏡的旋轉角度，直至該二個光斑中心座標分別與該二個光感測器的中心標準點重合。在該二個光斑中心座標與該二個光感測器的中心標準點重合時，即可重建出標準光路路徑，使該光路自適應追蹤系統中的光接收器可以接收到最佳的光能量並取得該入射光中的傳輸資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An light path adaptive tracking system for free space optical communication uses two reflectors and two light sensors to carry out optical path adaptive tracking calibration. When the incident angle or incident position of the incident light changes, the two light sensors respectively obtain two light spot center coordinates under two different light paths. The light path adaptive tracking system adjusts rotation angles of the two reflectors according to the two light spot center coordinates, until the two light spot center coordinates coincide with center standard points of the two light sensors. When the two light spot center coordinates coincide with the center standard points of the two light sensors, the standard light path can be reconstructed, so that a light receiver in the light path adaptive tracking system can receive the best light energy and obtain a transmission data in the incident light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:光路自適應追蹤系統</p>
        <p type="p">31:第一反射鏡</p>
        <p type="p">32:第二反射鏡</p>
        <p type="p">33:第一分光鏡</p>
        <p type="p">34:第二分光鏡</p>
        <p type="p">35:第一光感測器</p>
        <p type="p">36:第二光感測器</p>
        <p type="p">37:準直器</p>
        <p type="p">38:光接收器</p>
        <p type="p">LD:雷射光束</p>
        <p type="p">Lr1:第一反射光束</p>
        <p type="p">Lr2:第二反射光束</p>
        <p type="p">Lrd1:第一分割光束</p>
        <p type="p">Lrd2:第二分割光束</p>
        <p type="p">Lrd3:第三分割光束</p>
        <p type="p">Lrd4:第四分割光束</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.bmp" file="ed10006.bmp" height="716px" img-content="tif" inline="yes" orientation="portrait" width="771px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621917</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144468</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120241128B">B60L53/68</main-classification>
        <further-classification edition="201901120241128B">B60L53/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉育睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許啟輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於電池能源站之緊急事件管理方法及其電池能源站</chinese-title>
        <english-title>EMERGENCY MANAGEMENT METHODS FOR BATTERY ENERGY STATION, AND BATTERY ENERGY STATIONS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於電池能源站之緊急事件管理方法，適用於用以收納且對複數電池進行充電之一電池能源站。首先，利用提供電力給該電池能源站之一交流電源執行一電池充電作業，以對於該等電池進行充電，並提供該等電池進行一電池交換作業。當電池能源站發生一第一緊急事件時，中斷該交流電源，以停止該電池充電作業，並致使該等電池中之至少一者執行一反向供電作業，以提供電力給該電池能源站，並維持該電池交換作業之運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Emergency management methods are provided, which are suitable for a battery energy station used for storing and charging a plurality of batteries. First, an AC power provided power to the battery energy station is utilized to perform a battery charging operation to charge the batteries, and the batteries are provided for a battery exchange operation. When a first emergency event occurs in the battery energy station, the AC power is stopped, thus to stop the battery charging operation, and at least one of the batteries is caused to perform a reverse power supply operation to provide power to the battery energy station, and maintain the operation of the battery exchange operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410、S420、S430、S440:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="1019px" img-content="tif" inline="yes" orientation="portrait" width="743px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622785</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144469</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250303B">G06F21/82</main-classification>
        <further-classification edition="201301120250303B">G06F21/70</further-classification>
        <further-classification edition="200601120250303B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦登有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU-DAN LIMITED CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃偉智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林偉楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>集線器裝置</chinese-title>
        <english-title>HUB DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種集線器裝置，包括一上行接口、一下行接口以及一控制晶片。上行接口用以耦接一主機裝置。下行接口用以耦接一週邊裝置。控制晶片耦接於上行接口與下行接口之間，並包括一第一儲存電路、一第二儲存電路以及一控制電路。第一儲存電路儲存一病毒碼。第二儲存電路儲存一文件資料。控制電路比對病毒碼與文件資料。當文件資料相同於病毒碼時，控制電路進行一保護操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hub device including an upstream facing port, a downstream facing port, and a control chip is provided. The upstream facing port is configured to be coupled to a host device. The downstream facing port is configured to be coupled to a peripheral device. The control chip is coupled between the upstream facing port and the downstream facing port and includes a first storage circuit, a second storage circuit, and a control circuit. The first storage circuit stores a virus pattern. The second storage circuit stores file data. The control circuit compares the virus pattern and the file data. When the file data is the same as the virus pattern, the control circuit performs a protection operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:操作系統</p>
        <p type="p">110:主機裝置</p>
        <p type="p">120:集線器裝置</p>
        <p type="p">130、140:週邊裝置</p>
        <p type="p">111、131、141:連接埠</p>
        <p type="p">121:上行接口</p>
        <p type="p">122:控制晶片</p>
        <p type="p">123、124:下行接口</p>
        <p type="p">125:警示裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="886px" img-content="tif" inline="yes" orientation="portrait" width="705px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622532</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144475</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">G01S7/02</main-classification>
        <further-classification edition="200601120250123B">G01S7/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>輝創電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHETRON ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳康綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KANG-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種雷達結構</chinese-title>
        <english-title>RADAR STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雷達結構，用以解決習知雷達殼體厚度不均導致成型不良的問題。係包含：一殼體，具有一連接元件，該連接元件之一開口端係由該殼體朝外設置，該連接元件之一連接端朝向該殼體內部之一容置空間，該殼體具有數個引腳及數個凹槽位於該連接元件，各該些引腳係由該連接元件之該開口端貫穿至該連接端，該些引腳係間隔排列，該些凹槽形成於該開口端且位於該些引腳之間，各該些凹槽之一深度的延伸方向與該些引腳的延伸方向大致平行；及一電路板，位於該容置空間，該電路板電性連接該些引腳。藉此可以達成符合產品規格及提升良率的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A radar structure is provided to solve the problem of poor molding caused by uneven thickness of conventional radar casings. The radar structure includes a housing having a connecting component, and a circuit board. An open end of the connecting component is arranged outwardly from the housing. A connection end of the connecting component faces a space inside the housing. The housing includes a plurality of pins and a plurality of grooves located on the connecting component. Each pin penetrates from the open end to the connecting end of the connecting component. The plurality of pins are arranged at intervals. The plurality of grooves are formed on the open end and between the plurality of pins. The extending direction of a depth of each groove is substantially parallel to the extending direction of the plurality of pins. The circuit board is in the space and is electrically connected to the plurality of pins. The radar structure provides the effects of meeting product specifications and improving yields.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:殼體</p>
        <p type="p">11:連接元件</p>
        <p type="p">111:開口端</p>
        <p type="p">112:連接端</p>
        <p type="p">113:側壁</p>
        <p type="p">12:引腳</p>
        <p type="p">12a:第一端</p>
        <p type="p">12b:第二端</p>
        <p type="p">13:凹槽</p>
        <p type="p">2:電路板</p>
        <p type="p">S:容置空間</p>
        <p type="p">D:深度</p>
        <p type="p">T:長度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="738px" img-content="tif" inline="yes" orientation="portrait" width="856px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623374</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144479</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250211B">H10D30/01</main-classification>
        <further-classification edition="202501120250211B">H10D30/65</further-classification>
        <further-classification edition="202501120250211B">H10D30/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒振東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZOU, CHEN-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴云凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIH-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包含基板、垂直電晶體和橫向電晶體。基板具有第一導電型，垂直電晶體設置於基板的第一區，橫向電晶體設置於基板的第二區。垂直電晶體包含第二導電型的第一埋層埋入基板內，第二導電型的第一井區設置於第一埋層的正上方。第一溝槽從第一井區向下延伸至第一埋層內，第一溝槽的底面位於第一埋層中。導電部設置於第一溝槽內，接觸第一埋層，且電耦接至汲極接點。第二溝槽設置於第一井區中，閘極設置於第二溝槽內，源極區鄰接第二溝槽的側面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, a vertical transistor, and a lateral transistor. The substrate has a first conductivity type. The vertical transistor is disposed in a first area of ​​the substrate, and the lateral transistor is disposed in a second area of ​​the substrate. The vertical transistor includes a first buried layer having a second conductivity type and embedded in the substrate. A first well region has the second conductivity type and is disposed directly above the first buried layer. A first trench is extended downward from the first well region into the first buried layer, and a bottom surface of the first trench is located in the first buried layer. A conductive portion is disposed in the first trench, in direct contact with the first buried layer, and electrically coupled to a drain contact. A second trench is disposed in the first well region, and a gate is disposed in the second trench. A source region abuts a side of the second trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">100-1:第一區</p>
        <p type="p">100-2:第二區</p>
        <p type="p">101:基板</p>
        <p type="p">102:基底</p>
        <p type="p">103:磊晶層</p>
        <p type="p">105:第一埋層</p>
        <p type="p">107:第一井區</p>
        <p type="p">111:第一溝槽</p>
        <p type="p">112:第二溝槽</p>
        <p type="p">113:第三溝槽</p>
        <p type="p">121:介電襯層</p>
        <p type="p">122:場板</p>
        <p type="p">123:閘極</p>
        <p type="p">125:基體區</p>
        <p type="p">126:閘極介電層</p>
        <p type="p">127:源極區</p>
        <p type="p">129:摻雜區</p>
        <p type="p">131:介電襯層</p>
        <p type="p">132:場板</p>
        <p type="p">141:介電層</p>
        <p type="p">142:導電部</p>
        <p type="p">150:層間介電層</p>
        <p type="p">152:接點</p>
        <p type="p">153:汲極接點</p>
        <p type="p">VT:垂直電晶體</p>
        <p type="p">LT:橫向電晶體</p>
        <p type="p">S:源極電位</p>
        <p type="p">D:汲極電位</p>
        <p type="p">G:閘極電位</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="659px" img-content="tif" inline="yes" orientation="portrait" width="932px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622955</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144481</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250320B">G10L17/02</main-classification>
        <further-classification edition="201301120250320B">G10L13/02</further-classification>
        <further-classification edition="201301120250320B">G10L25/03</further-classification>
        <further-classification edition="201301120250320B">G10L25/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王家慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹博丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, BO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於語者辨識之語者語音轉換方法</chinese-title>
        <english-title>METHOD FOR SPEAKER VOICE CONVERSION VIA SPEAKER RECOGNITION AND SYSTEM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種基於語者辨識之語者語音轉換方法，其係先取得語者之第一語音資料之語音頻譜特徵資料與基礎頻率特徵資料，再依據語音頻譜特徵資料與基礎頻率特徵資料取得第一嵌入式特徵資料，接續藉此於特徵向量空間中進行向量比對，以取得第二嵌入式特徵資料，並依據語音頻譜特徵資料、基礎頻率特徵資料、第一嵌入式特徵資料與第二嵌入式特徵資料取得第一關鍵特徵資料與第二關鍵特徵資料，因而藉此產生第二語音資料，第二語音資料相似於第一語音資料，藉此提供相似語者語音訊號，因而改善語音轉換效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention related to a method for speaker voice conversion via speaker recognition. The method firstly obtains a voice spectrum eigendata and a base frequency eigendata from a first voice signal of a speaker, then obtains a first speaker embedding eigendata according to the voice spectrum eigendata and the base frequency eigendata, and hereby, a vector comparison is executed in a eigendata space for obtaining a second speaker embedding eigendata. Thereby, a first speaker voice key eigendata and a second voice key eigendata are obtained according to the voice spectrum eigendata, the base frequency eigendata, the first speaker embedding eigendata and the second speaker embedding eigendata. Accordingly, a second voice signal is generated according to the first speaker voice key eigendata and the second voice key eigendata, hereby, a voice signal from a similar speaker is provided for improving voice transformation efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10-S50:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="980px" img-content="tif" inline="yes" orientation="portrait" width="673px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621761</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144486</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241130B">A63B21/075</main-classification>
        <further-classification edition="200601120241130B">A63B21/062</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>統鑫運動開發工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG XIN SPORTS DEVELOPMENT INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱凱程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, KAI CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>健身器材配重塊</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種健身器材配重塊，包含一本體、一限制桿、一作動桿及一定位件。當本體沿著第一方向位移而與定位件結合時，作動桿與限制桿之一或兩者受大於彈力的一外力推抵而朝第二方向位移，作動桿將與定位件結合。當本體沿著第一方向位移而未與定位件結合時，作動桿將與定位件分離，作動桿受彈力彈抵而與限制桿朝第三方向位移。藉此，除了提供手動按壓鎖定，還有提供自動跳脫鎖定，無須重複拆、組，既簡易，又方便，大大提升使用者對健身器材的使用體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:健身器材配重塊</p>
        <p type="p">11:本體</p>
        <p type="p">11A:第一方向</p>
        <p type="p">11B:第二方向</p>
        <p type="p">11C:第三方向</p>
        <p type="p">12:負重桿</p>
        <p type="p">13:限制桿</p>
        <p type="p">14:作動桿</p>
        <p type="p">15:連接件</p>
        <p type="p">16:彈性件</p>
        <p type="p">17:定位件</p>
        <p type="p">18:限位桿</p>
        <p type="p">19:固定銷</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.png" file="d10019.TIF" giffile="ed10019.png" height="790px" img-content="tif" inline="yes" orientation="portrait" width="683px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621967</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144494</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">B65G17/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林省揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自黏鐵芯製程之程序切換旋轉裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自黏鐵芯製程之程序切換旋轉裝置，適用於供多個用以分別乘載多個鐵芯的載盤放置。該自黏鐵芯製程之程序切換旋轉裝置包含一適用於乘載所述載盤的平台、一輸送單元，及一緩衝單元。該平台包括一主體部，及二彎道部。該輸送單元包括一鏈條，及一用以帶動該鏈條運轉的傳動裝置。該鏈條具有多個彼此串接的串接模組，每一該串接模組具有一本體部、一第一銜接部、一第二銜接部、多個支撐滑輪，及二導引滑輪。該緩衝單元安裝於該等彎道部的至少其中之一與該主體部之間，並用以對該鏈條帶動所述載盤旋轉而產生的離心力產生緩衝效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:平台</p>
        <p type="p">11:主體部</p>
        <p type="p">12:彎道部</p>
        <p type="p">2:輸送單元</p>
        <p type="p">21:鏈條</p>
        <p type="p">211:串接模組</p>
        <p type="p">216:導引滑輪</p>
        <p type="p">22:傳動裝置</p>
        <p type="p">3:緩衝單元</p>
        <p type="p">31:軸部</p>
        <p type="p">32:彈簧</p>
        <p type="p">9:載盤</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="627px" img-content="tif" inline="yes" orientation="portrait" width="942px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623133</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144495</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250418B">H01R39/08</main-classification>
        <further-classification edition="200601120250418B">F16C19/02</further-classification>
        <further-classification edition="202301120250418B">H04N23/51</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊上慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, SHANG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林品憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PIN-XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自轉式影像檢測裝置</chinese-title>
        <english-title>ROTATING IMAGE DETECTION DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自轉式影像檢測裝置，包含一主體單元及一防護單元。該主體單元包括一設置架、一設置於該設置架上的動力源，及一被一輸出軸穿設的導電滑環。該導電滑環具有一直接或間接地固定於該設置架上的外定座，及一可旋轉地設置於該外定座且固定套設於該動力源上的內轉芯。該外定座與該內轉芯可相對旋轉且以滑動接觸方式電性連接。該防護單元包括一樞設於該設置架上且可被該動力源帶動旋轉的防護外殼，及一可拆離地設置於該防護外殼上且電性連接該內轉芯的檢測模組，透過該導電滑環可使連接該外定座的外部線路不會繞轉，進而可避免線路纏繞或扭轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rotating image detection device comprises a main body unit and a protective unit. Said main body unit includes a disposition frame, a power source disposed on said disposition frame, and a conductive slip ring extended through by a output shaft. Said conductive slip ring has an outer fixing seat directly or indirectly fixed on said disposition frame, and an inner rotating core rotatably disposed on said outer fixing seat and fixed on said power source. Said outer fixing seat and said inner rotating core are relatively rotatable and are electrically connected in a sliding contact manner. Said protective unit includes a protective casing pivotally disposed on said disposition frame and drivable by said power source to rotate, and a detection module detachably disposed on said protective casing and electrically connected to said inner rotating core, through said conductive slip ring, said outer circuit connected to said outer fixing seat is not rotatable, thereby preventing circuit from winding or twisting.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主體單元</p>
        <p type="p">11:設置架</p>
        <p type="p">111:固定主軸</p>
        <p type="p">113:導引座</p>
        <p type="p">114:電控盤</p>
        <p type="p">115:導槽</p>
        <p type="p">12:集電滑環</p>
        <p type="p">121:外殼座</p>
        <p type="p">13:動力源</p>
        <p type="p">132:減速機</p>
        <p type="p">134:輸出軸</p>
        <p type="p">14:導電滑環</p>
        <p type="p">141:外定座</p>
        <p type="p">2:電控單元</p>
        <p type="p">3:防護單元</p>
        <p type="p">31:防護外殼</p>
        <p type="p">311:外殼罩</p>
        <p type="p">312:樞轉架</p>
        <p type="p">314:盤體</p>
        <p type="p">315:滾珠</p>
        <p type="p">32:檢測模組</p>
        <p type="p">321:影像感測器</p>
        <p type="p">322:視覺光源</p>
        <p type="p">323:供電器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="848px" img-content="tif" inline="yes" orientation="portrait" width="681px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622476</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144498</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">G01M11/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上詮光纖通信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOCI FIBER OPTIC COMMUNICATIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游泰偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>共同封裝光學之保偏光纖組裝校正方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種共同封裝光學之保偏光纖組裝校正方法及其系統，其組裝校方法的步驟為：使用具有複數個Ｖ型槽並排的基板，每個Ｖ型槽內放置著保偏光纖之祼纖段；使用低頻振動器讓祼纖段能沿V型槽移動及旋轉，並控制祼纖段伸出V型槽的長度；使用光學檢查鏡頭組監控於複數Ｖ型槽內持續轉動的祼纖段，當其中祼纖段的端面旋轉至設定角度時，操作第一下壓組件對處的祼纖段壓制；持續重複上述光學檢查步驟，直到所有複數保偏光纖皆被壓制且位於設定角度，接著操作第二下壓組件壓制於複數保偏光纖的包覆段，藉此達到讓並排之複數保偏光纖得以快速校正的目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S01~S04:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="801px" img-content="tif" inline="yes" orientation="portrait" width="638px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621893</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144500</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241129B">B32B5/28</main-classification>
        <further-classification edition="200601120241129B">C08J5/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滙歐科技開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EURO-ACE COMPOSITE MANUFACTURING CO,. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭清松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAW, CHING-SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>預浸料材料</chinese-title>
        <english-title>PREPREG MATERIAL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種預浸料材料，包含複數個預浸料結構，該預浸料結構為一多層結構，包含一纖維樹脂層、一第一樹脂層、一金屬層以及一第二樹脂層，其中，該多層結構具有不同的一材質、一膨脹係數、一黏滯係數以及一厚薄度，該預浸料結構經過預固化後層狀堆疊形成該預浸料材料，該纖維樹脂層與該第二樹脂層結合後形成一界面，該界面減少該預浸料結構層狀堆疊的位移，進一步地提升該預浸料材料的整體強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A prepreg material comprising a plurality of prepreg structures, wherein each prepreg structure is a multilayer structure, prepreg structure has a fiber-resin layer, a first resin layer, a metal layer, and a second resin layer. The multilayer structure features different materials, expansion coefficients, viscosities, and thicknesses. After pre-curing, the prepreg structures are stacked in layers to form the prepreg material. An interface is formed between the fiber-resin layer and the second resin layer, which reduces the displacement of the layered stack of the prepreg structure and further enhances the overall strength of the prepreg material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:預浸料結構</p>
        <p type="p">11:纖維樹脂層</p>
        <p type="p">111:纖維層</p>
        <p type="p">112:第一樹脂</p>
        <p type="p">12:第一樹脂層</p>
        <p type="p">13:金屬層</p>
        <p type="p">14:第二樹脂層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="731px" img-content="tif" inline="yes" orientation="portrait" width="935px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623335</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144502</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241227B">H05K7/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊柏村</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PO TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>夾持裝置</chinese-title>
        <english-title>CLAMPING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種夾持裝置包含基座、按壓件、兩夾持件以及至少一復位件。基座包含相連的抵靠部以及分隔部。按壓件包含按壓部以及兩第一推抵部。按壓部配置以朝向抵靠部移動。第一推抵部連接按壓部，並分別延伸至分隔部的相反兩側。夾持件分別位於分隔部的兩側，並分別包含兩第二推抵部。復位件配置以使夾持件遠離分隔部移動，當按壓部朝向抵靠部移動時，第一推抵部係沿著分隔部分別朝向夾持件移動並分別推抵第二推抵部，致使夾持件相向移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A clamping device includes a base, a pressing member, two clamping members, and at least one position-returning member. The base includes an abutting portion and a partition portion connected to each other. The pressing member includes a pressing portion and two first pushing portions. The pressing portion is configured to move toward the abutting portion. The first pushing portions are connected to the pressing portion and extend to opposite sides of the partition portion respectively. The clamping members are respectively located on opposite sides of the partition portion and respectively include two second pushing portions. The position-returning member is configured to move the clamping members away from the partition portion. When the pressing portion moves towards the abutting portion, the first pushing portions move towards the clamping members along the partition portion and push the second pushing portions respectively, causing the clamping members to move towards each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:夾持組合</p>
        <p type="p">100:夾持裝置</p>
        <p type="p">110:基座</p>
        <p type="p">112:抵靠部</p>
        <p type="p">114:分隔部</p>
        <p type="p">116:牆部</p>
        <p type="p">120:按壓件</p>
        <p type="p">122:按壓部</p>
        <p type="p">124:第一推抵部</p>
        <p type="p">126:第一推抵斜面</p>
        <p type="p">130:夾持件</p>
        <p type="p">132:第二推抵部</p>
        <p type="p">134:第二推抵斜面</p>
        <p type="p">136:夾桿</p>
        <p type="p">138:勾爪部</p>
        <p type="p">140、141:復位件</p>
        <p type="p">160:滑槽</p>
        <p type="p">161:第一槽段</p>
        <p type="p">162:第二槽段</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="718px" img-content="tif" inline="yes" orientation="portrait" width="1000px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621812</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144503</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241204B">B21C1/06</main-classification>
        <further-classification edition="200601120241204B">B21C3/02</further-classification>
        <further-classification edition="200601120241204B">C21D9/52</further-classification>
        <further-classification edition="200601120241204B">B21C1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵順裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, SHUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>不銹鋼線材的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF STAINLESS STEEL WIRE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種不銹鋼線材製造方法，包括：步驟1，提供材質為不銹鋼且具第一外徑的母線材，將母線材通過輥抽製程而取得具第二外徑的粗線材；步驟2。將粗線材通過細抽製程而取得具第三外徑的細線材；步驟3，將細線材進行往復式伸線製程而取得具第四外徑的超精細線材。在往復式伸線製程中，細線材先以頭端在前而尾端在後地穿過至少一眼模而伸線，再以尾端在前而頭端在後地穿過至少一另一眼模而再次伸線。眼模與另一眼模各具有第一模孔與第二模孔，第一模孔與第二模孔彼此同軸且相對於該軸存在徑向段差；以及步驟4，對超精細線材進行再結晶熱處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of stainless steel wire including four steps is provided. In the first step, an original stainless steel wire having a first diameter is provided, and a thick wire with a second diameter is obtained through a roll drawing process performed to the original wire. In the second step, performing a fine drawing to the thick wire to obtain a thin wire with a third diameter. In the third step, perform a reciprocating drawing process to the thin wire to obtain a ultra-fine wire with a fourth diameter, wherein the thin wire is drawn by passing through molds in reciprocated way. Each of the molds has a first drawing hole and a second drawing hole, and a radial step existed therebetween. In the fourth step, the ultra-fine wire is subjected to recrystallization heat treatment.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="757px" img-content="tif" inline="yes" orientation="portrait" width="552px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621880</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144508</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">B26D9/00</main-classification>
        <further-classification edition="200601120250123B">B21D53/00</further-classification>
        <further-classification edition="200601120250123B">E04H12/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>臥式水塔加工程序及其水塔結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種臥式水塔加工程序及水塔結構，包括提供一板片結構，板片結構定義或具有兩邊緣接合區；一製孔作業，應用製孔裝置在本體上成型出人孔區域。以及，一裁切作業，裁切分離兩邊緣接合區，而構成一具有開放區的環狀本體的水塔結構，以利於每一個環狀本體可相互疊置、運輸，達到建立一個比較理想的作業機制和結構效果；改善習知(筒狀)水塔的裝載佔據大量空間，不利於運輸及減少業者或中/下游廠商必須建立相當大的製造及/或加工場地和配置多種大型機具設備之生產線等情形。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:板片結構</p>
        <p type="p">11:邊緣接合區</p>
        <p type="p">12:補強結構</p>
        <p type="p">13:端部</p>
        <p type="p">14:人孔區域</p>
        <p type="p">15:開放區</p>
        <p type="p">20:本體</p>
        <p type="p">X:軸向參考線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="947px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621606</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144510</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A47B96/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啟賦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIFF TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳智昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鶴憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐國祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>儲物架裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種儲物架裝置，包含一個支架模組，及二個上下設置在該支架模組的承載模組。該支架模組包括數個左右排列的縱向桿、一個安裝在該等縱向桿之頂端部的橫向桿，及二個分別安裝在該橫向桿之左右兩端部的側固定件。每一該承載模組包括一個安裝在該等縱向桿之前的固定桿、一個安裝在該固定桿的承載單元、數個安裝在該承載單元上的承載板，及一個連接該承載單元的支撐單元。該等承載板能用以分別承載數個物品。透過該等承載模組的結構設計，增加該儲物架裝置承載該物品的數量，且透過整合該儲物架裝置之製造材料，降低該儲物架裝置的自體重量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:儲物架裝置</p>
        <p type="p">2:支架模組</p>
        <p type="p">21:縱向桿</p>
        <p type="p">22:橫向桿</p>
        <p type="p">23:側固定件</p>
        <p type="p">3:承載模組</p>
        <p type="p">31:固定桿</p>
        <p type="p">32:承載單元</p>
        <p type="p">321:側承載架</p>
        <p type="p">322:中間承載架</p>
        <p type="p">33:承載板</p>
        <p type="p">331:載物板體</p>
        <p type="p">332:突板體</p>
        <p type="p">333:反光體</p>
        <p type="p">334:凹槽</p>
        <p type="p">34:支撐單元</p>
        <p type="p">341:第一支撐件</p>
        <p type="p">342:第二支撐件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="760px" img-content="tif" inline="yes" orientation="portrait" width="990px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623164</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144513</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200701120250113B">H02M1/42</main-classification>
        <further-classification edition="200601120250113B">H02H9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>通嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEADTREND TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒明璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, MING-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周冠賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, KUAN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>功因校正電源供應器以及相關之控制方法</chinese-title>
        <english-title>POWER SUPPLIES WITH POWER FACTOR CORRECTION, AND CONTROL METHODS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種控制方法，適用於一功因校正電源供應器，其用以轉換一交流電電源為一中介電源以及一輸出電源。該功因校正電源供應器具有一脈衝寬度調變電路，用以轉換該中介電源為該輸出電源。該控制方法包含有：偵測該交流電電源，用以提供一電源正常訊號；當該電源正常訊號指示該交流電電源為正常時，針對該脈衝寬度調變電路提供一輸入電源保護；以及，當該電源正常訊號指示該交流電電源已經不正常時，改變或取消該輸入電源保護。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An embodiment of the present invention provides a control method applicable to a power factor correction (PFC) power supply, which is used to convert an AC power source into an intermediate power source and an output power source. The PFC power supply includes a pulse width modulation (PWM) circuit to convert the intermediate power source into the output power source. The control method comprises: detecting the AC power source to provide a power-good signal; when the power-good signal indicates that the AC power source is good, providing an input power protection for the PWM circuit; and, when the power normal signal indicates that the AC power source is no longer normal, modifying or canceling the input power protection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">204:脈衝寬度調變電路</p>
        <p type="p">208:電源控制器</p>
        <p type="p">230:比較器</p>
        <p type="p">234:分壓電路</p>
        <p type="p">236、238:電容</p>
        <p type="p">240:比較器</p>
        <p type="p">242:電源偵測器</p>
        <p type="p">243:及閘</p>
        <p type="p">244:參考電壓產生器</p>
        <p type="p">246:保護電路</p>
        <p type="p">CR:諧振電容</p>
        <p type="p">GNDI:輸入接地線</p>
        <p type="p">GNDO:輸出接地線</p>
        <p type="p">HI:訊號</p>
        <p type="p">HS:功率開關</p>
        <p type="p">HV:高壓端</p>
        <p type="p">INV:中介電源線</p>
        <p type="p">LO:訊號</p>
        <p type="p">LP:一次側繞組</p>
        <p type="p">LR:電感</p>
        <p type="p">LS:功率開關</p>
        <p type="p">PG:電源正常訊號</p>
        <p type="p">S&lt;sub&gt;BO&lt;/sub&gt;:欠壓訊號</p>
        <p type="p">S&lt;sub&gt;OCP&lt;/sub&gt;:過電流訊號</p>
        <p type="p">V&lt;sub&gt;HV&lt;/sub&gt;:高壓訊號</p>
        <p type="p">V&lt;sub&gt;INV&lt;/sub&gt;:中介電源</p>
        <p type="p">V&lt;sub&gt;OCP-REF&lt;/sub&gt;:電流參考訊號</p>
        <p type="p">VS:電流偵測訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="698px" img-content="tif" inline="yes" orientation="portrait" width="625px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622360</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144514</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F04B39/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白啟正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, CHI-JENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鴻志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳英俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIAN-SHIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱元琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YUAN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊啟生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>擴散環</chinese-title>
        <english-title>DIFFUSION RING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種擴散環，適用於空壓機。擴散環包括環狀基座和複數個葉片。環狀基座包括第一環狀件與第二環狀件。第一環狀件配置為固定於空壓機的葉輪基座上。第二環狀件配置為圍繞該第一環狀件設置。第二環狀件係可相對於第一環狀件轉動。每一個葉片具有相對的第一端與第二端，其中每一個葉片的第一端係設置於第一環狀件上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A diffusion ring is suitable for an air compressor. The diffusion ring includes an annular base and multiple blades. The annular base includes a first annular component and a second annular component. The first annular component is configured to be fixed on the impeller base of the air compressor. The second annular component is configured to be arranged around the first annular component. The second annular component can rotate relative to the first annular component. Each blade has a relative first end and a second end, wherein the first end of each blade is positioned on the first annular component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:擴散環</p>
        <p type="p">110:環狀基座</p>
        <p type="p">111:第一環狀件</p>
        <p type="p">113:第二環狀件</p>
        <p type="p">130:葉片</p>
        <p type="p">200:空壓機</p>
        <p type="p">210:葉輪基座</p>
        <p type="p">211:葉輪</p>
        <p type="p">230:入口處</p>
        <p type="p">250:出口處</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="636px" img-content="tif" inline="yes" orientation="portrait" width="691px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622818</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144518</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q10/04</main-classification>
        <further-classification edition="202301120250303B">G06Q10/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹譽鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, YU-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>結合外部資訊與殘差修正的伺服器需求滾動預測系統</chinese-title>
        <english-title>SERVER DEMAND ROLLING FORECAST SYSTEM INCORPORATING EXTERNAL INFORMATION AND RESIDUAL MODIFICATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種結合外部資訊與殘差修正的伺服器需求滾動預測系統，包含一內部資料取得裝置、一外部指標取得裝置、及與其相連接的一伺服器需求量混合預測裝置，經配置而根據內部資料以一線性預測模型計算得到一需求量預測值及一殘差值，以及根據該殘差值及外部指標以一非線性預測模型計算得到一殘差預測值，從而藉由結合該需求量預測值及該殘差預測值而計算得到一需求量最終預測值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a server demand rolling forecast system incorporating external information and residual modification, comprising an internal data acquisition device, an external factor acquisition device, and a server demand hybrid forecasting device connected thereto and configured to calculate a demand predicted value and a residual based on internal data by using a linear forecast model, calculate a residual predicted value base on the residual and external factors by using a nonlinear forecast model, and calculate a final demand predicted value by combining the demand predicted value and the residual predicted value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:結合外部資訊與殘差修正的伺服器需求滾動預測系統</p>
        <p type="p">1:內部資料取得裝置</p>
        <p type="p">2:外部指標取得裝置</p>
        <p type="p">3:伺服器需求量混合預測裝置</p>
        <p type="p">31:需求量預測單元</p>
        <p type="p">32:殘差預測單元</p>
        <p type="p">33:混合預測單元</p>
        <p type="p">D:需求量預測值</p>
        <p type="p">Df:需求量最終預測值</p>
        <p type="p">Ext:外部指標</p>
        <p type="p">Int:內部資料</p>
        <p type="p">M1:線性預測模型</p>
        <p type="p">M2:非線性預測模型</p>
        <p type="p">R:殘差值</p>
        <p type="p">Rf:殘差預測值</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="773px" img-content="tif" inline="yes" orientation="portrait" width="783px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623005</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144519</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">H01F5/00</main-classification>
        <further-classification edition="200601120250123B">G01R19/00</further-classification>
        <further-classification edition="200601120250123B">G01R15/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　安閣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROUT, UMA SANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳至強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電流感應線圈</chinese-title>
        <english-title>CURRENT SENSING COIL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電流感應線圈，其包括屏蔽層、感應線圈及短路線圈。屏蔽層具有中央孔洞。感應線圈與屏蔽層連接，並設置於中央孔洞內。短路線圈與屏蔽層連接，並設置於中央孔洞內。其中，感應線圈圍繞短路線圈，使短路線圈設置於感應線圈內，且感應線圈的匝數大於短路線圈的匝數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A current sensing coil includes a shielding layer, a sensing coil and a short-circuit coil. The shielding layer has a central hole. The sensing coil is connected to the shielding layer and disposed in the central hole. The short-circuit coil is connected to the shielding layer and disposed in the central hole. The sensing coil surrounds the short-circuit coil, such that the short-circuit coil is disposed inside the sensing coil. The number of the turns of the sensing coil is greater than that of the short-circuit coil.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電流感應線圈</p>
        <p type="p">11:屏蔽層</p>
        <p type="p">12:感應線圈</p>
        <p type="p">13:短路線圈</p>
        <p type="p">CH:中央孔洞</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="659px" img-content="tif" inline="yes" orientation="portrait" width="904px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623098</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144520</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01Q21/28</main-classification>
        <further-classification edition="200601120250303B">H01Q3/24</further-classification>
        <further-classification edition="201801120250303B">H04B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許健明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政大</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>二件式裝置之切換式天線系統</chinese-title>
        <english-title>SWITCHABLE ANTENNA SYSTEM FOR TWO-PIECE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種二件式裝置之切換式天線系統，切換式天線系統包含一第一天線、一第二天線、一第三天線、一第一無線通訊模組、一第二無線通訊模組、一第一切換電路、一第二切換電路以及一控制裝置。在切換式天線系統中，第一天線、第二天線及第三天線支援一無線通訊頻段以及一2.4G專屬頻段，控制裝置電性連接第一無線通訊模組、第二無線通訊模組、第一切換電路及第二切換電路，以控制第一切換電路及第二切換電路，使第一無線通訊模組透過第一切換電路及第二切換電路選擇性地電性連接第一天線、第二天線及第三天線的其中之二。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides discloses a switchable antenna system for two-piece device. The switchable antenna system includes a first antenna, a second antenna, a third antenna, a first wireless communication module, a second wireless communication module, a first switching circuit, a second switching circuit and a control device. In the switchable antenna system, the first antenna, the second antenna and the third antenna support a wireless communication frequency band and a 2.4G proprietary frequency band. The control device is electrically connected to the first wireless communication module, the second wireless communication module, the first switching circuit and the second switching circuit and controls the first switching circuit and the second switching circuit, so that the first wireless communication module selectively and electrically connects two of the first antenna, the second antenna and the third antenna through the first switching circuit and the second switching circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:切換式天線系統</p>
        <p type="p">12:第一天線</p>
        <p type="p">14:第二天線</p>
        <p type="p">16:第三天線</p>
        <p type="p">18:第一無線通訊模組</p>
        <p type="p">20:第二無線通訊模組</p>
        <p type="p">22:第一切換電路</p>
        <p type="p">24:第二切換電路</p>
        <p type="p">26:控制裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="658px" img-content="tif" inline="yes" orientation="portrait" width="627px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622544</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144524</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120250121B">G02B1/11</main-classification>
        <further-classification edition="201501120250121B">G02B1/10</further-classification>
        <further-classification edition="200601120250121B">G02B1/08</further-classification>
        <further-classification edition="200601120250121B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成科技（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成光電（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE OPTPELECTRONICS (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英特盛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡緣蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YUAN-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116345373</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>擴增實境抬頭顯示器蓋板之抗眩光結構</chinese-title>
        <english-title>ANTI-GLARE STRUCTURE OF AUGMENTED REALITY HEAD-UP DISPLAY COVER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種擴增實境抬頭顯示器蓋板之抗眩光結構，包含：基板；油墨層；以及抗反射層鍍膜；其中該基板上方疊有該油墨層；其中該油墨層上方疊有該抗反射層鍍膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is an anti-glare structure of augmented reality head-up display cover, comprising a substrate, a black matrix layer and an anti-reflective coating. The black matrix is stacked on the substrate. The anti-reflective coating is stacked on the black matrix.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:基板</p>
        <p type="p">6A:油墨層</p>
        <p type="p">6B:抗反射層鍍膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="514px" img-content="tif" inline="yes" orientation="portrait" width="653px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623211</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144531</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04B3/20</main-classification>
        <further-classification edition="200601120250303B">H04B3/23</further-classification>
        <further-classification edition="200601120250303B">H04L25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱元志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YUAN-JIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊曜駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李景硯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHING-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉俊邑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHUN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於車用乙太網路系統的詢問端電路</chinese-title>
        <english-title>INQUIRER-SIDE CIRCUIT FOR USE IN AUTOMOTIVE ETHERNET SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出種車用乙太網路系統中的詢問端電路，其包含：混合電路，設置成可耦接於媒介相關介面電路，以與被詢端電路進行資料通信；傳送電路，耦接於混合電路，設置成可產生並提供傳送信號給混合電路；接收電路，耦接於混合電路，設置成可接收並解析混合電路傳來的接收信號，以產生資料信號；處理電路，耦接於接收電路，設置成可對資料信號進行處理；實體編碼子層電路，耦接於處理電路，設置成可控制傳送電路之運作；以及回音消除電路，耦接於傳送電路與接收電路之間，設置成可產生回音消除信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inquirer-side circuit of an automotive Ethernet system includes: a hybrid circuit arranged to operably couple with an MDI circuit to conduct data communication with a respondent-side circuit; a transmitting circuit coupled with a hybrid circuit and arranged to operably generate and provide a transmission signal to the hybrid circuit; a receiving circuit coupled with the hybrid circuit and arranged to operably receive and parse a received signal transmitted from the hybrid circuit to generate a data signal; a processing circuit coupled with the receiving circuit and arranged to operably process the data signal; a physical coding sublayer circuit coupled with the processing circuit and arranged to operably control the operations of the transmitting circuit; and an echo cancellation circuit coupled between the transmitting circuit and the receiving circuit, and arranged to operably generate an echo cancellation signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車用乙太網路系統(automotive Ethernet system)</p>
        <p type="p">102、104:雙絞線(twisted pair)</p>
        <p type="p">110:詢問端電路(inquirer-side circuit)</p>
        <p type="p">111:媒介相關介面電路(MDI circuit)</p>
        <p type="p">112:混合電路(hybrid circuit)</p>
        <p type="p">113:傳送電路(transmitting circuit)</p>
        <p type="p">114:接收電路(receiving circuit)</p>
        <p type="p">115:處理電路(processing circuit)</p>
        <p type="p">116:實體編碼子層電路(physical coding sublayer circuit)</p>
        <p type="p">117:回音消除電路(echo cancellation circuit)</p>
        <p type="p">120:被詢端電路(respondent-side circuit)</p>
        <p type="p">121:媒介相關介面電路(MDI circuit)</p>
        <p type="p">122:混合電路(hybrid circuit)</p>
        <p type="p">123:傳送電路(transmitting circuit)</p>
        <p type="p">124:接收電路(receiving circuit)</p>
        <p type="p">125:處理電路(processing circuit)</p>
        <p type="p">126:實體編碼子層電路(physical coding sublayer circuit)</p>
        <p type="p">127:回音消除電路(echo cancellation circuit)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="783px" img-content="tif" inline="yes" orientation="portrait" width="1042px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623212</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144532</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04B3/20</main-classification>
        <further-classification edition="200601120250303B">H04L25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱元志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, YUAN-JIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊曜駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李景硯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHING-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉俊邑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHUN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>車用乙太網路系統中的詢問端電路</chinese-title>
        <english-title>INQUIRER-SIDE CIRCUIT OF AUTOMOTIVE ETHERNET SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出種車用乙太網路系統中的詢問端電路，其包含：混合電路，設置成可透過媒介相關介面電路與被詢端電路進行資料通信；傳送電路，耦接於混合電路，設置成可產生並提供傳送信號給混合電路；接收電路，耦接於混合電路，設置成可接收並解析混合電路傳來的接收信號，以產生資料信號；處理電路，耦接於接收電路，設置成可對資料信號進行處理；實體編碼子層電路，耦接於處理電路，設置成可依據處理電路的指示，進行實體編碼運作，以控制傳送電路之運作；以及回音消除電路，耦接於傳送電路與接收電路之間，設置成可產生回音消除信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inquirer-side circuit of an automotive Ethernet system includes: a hybrid circuit arranged to operably conduct data communication with a respondent-side circuit through an MDI circuit; a transmitting circuit coupled with a hybrid circuit and arranged to operably generate and provide a transmission signal to the hybrid circuit; a receiving circuit coupled with the hybrid circuit and arranged to operably receive and parse a received signal transmitted from the hybrid circuit to generate a data signal; a processing circuit coupled with the receiving circuit and arranged to operably process the data signal; a physical coding sublayer circuit coupled with the processing circuit and arranged to operably conduct a physical coding operation according to the instruction of the processing circuit to control the operations of the transmitting circuit; and an echo cancellation circuit coupled between the transmitting circuit and the receiving circuit, and arranged to operably generate an echo cancellation signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車用乙太網路系統(automotive Ethernet system)</p>
        <p type="p">102、104:雙絞線(twisted pair)</p>
        <p type="p">110:詢問端電路(inquirer-side circuit)</p>
        <p type="p">111:媒介相關介面電路(MDI circuit)</p>
        <p type="p">112:混合電路(hybrid circuit)</p>
        <p type="p">113:傳送電路(transmitting circuit)</p>
        <p type="p">114:接收電路(receiving circuit)</p>
        <p type="p">115:處理電路(processing circuit)</p>
        <p type="p">116:實體編碼子層電路(physical coding sublayer circuit)</p>
        <p type="p">117:回音消除電路(echo cancellation circuit)</p>
        <p type="p">120:被詢端電路(respondent-side circuit)</p>
        <p type="p">121:媒介相關介面電路(MDI circuit)</p>
        <p type="p">122:混合電路(hybrid circuit)</p>
        <p type="p">123:傳送電路(transmitting circuit)</p>
        <p type="p">124:接收電路(receiving circuit)</p>
        <p type="p">125:處理電路(processing circuit)</p>
        <p type="p">126:實體編碼子層電路(physical coding sublayer circuit)</p>
        <p type="p">127:回音消除電路(echo cancellation circuit)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="771px" img-content="tif" inline="yes" orientation="portrait" width="1000px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622264</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144533</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C23C14/06</main-classification>
        <further-classification edition="200601120241220B">C23C14/18</further-classification>
        <further-classification edition="200601120241220B">C23C14/22</further-classification>
        <further-classification edition="200601120241220B">C23C14/54</further-classification>
        <further-classification edition="200601120241220B">C23C14/58</further-classification>
        <further-classification edition="200601120241220B">C23C28/00</further-classification>
        <further-classification edition="200601120241220B">B23B27/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃家宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於金屬刀具之鍍膜方法</chinese-title>
        <english-title>COATING METHOD FOR METAL CUTTER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於金屬刀具之鍍膜方法包含於一刀具基材表面沉積一中介層，以氮氣電漿處理該中介層表面，於該中介層表面沉積一類鑽碳膜，經氮氣電漿表面處理之該中介層可提高該類鑽碳膜附著力，有助於提昇金屬刀具之使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a coating method for a metal cutter, an interlayer is deposited on top of a cutter base, the interlayer is surface-processed by N        &lt;sub&gt;2&lt;/sub&gt;plasma, and a diamond-like carbon film is deposited on top of the processed interlayer. The interlayer processed by N        &lt;sub&gt;2&lt;/sub&gt;plasma can increase adhesion of the diamond-like carbon film to improve life cycle of the metal cutter.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:用於金屬刀具之鍍膜方法</p>
        <p type="p">11:第一沉積步驟</p>
        <p type="p">12:表面處理步驟</p>
        <p type="p">13:第二沉積步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="520px" img-content="tif" inline="yes" orientation="portrait" width="520px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622251</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144537</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250501B">C12Q1/6876</main-classification>
        <further-classification edition="200601120250501B">C12Q1/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凌陽科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNPLUS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高熹騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, HSI-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高熹騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, HSI-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱明堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, MING-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林韋豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭采和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, DAISY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李亦蟬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YI-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任書儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEN, SHU-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>非洲豬瘟病毒檢測晶片及其應用</chinese-title>
        <english-title>DETECTION CHIP FOR AFRICAN SWINE FEVER VIRUS AND APPLICATION THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種非洲豬瘟病毒的檢測晶片及其應用，該檢測晶片包含並聯的複數個電晶體，每一個該複數個電晶體個別包含基底層、空接閘極、金屬連接通道、延伸閘極及生物檢測層，該生物檢測晶片經表面修飾製程結合生物探針，以對待測樣本進行非洲豬瘟病毒的檢測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention disclosed a detection chip for African swine fever virus and its application. The detection chip includes a plurality of transistors in parallel. Each of the transistors includes a substrate layer, a floating gate, an extending metal connector, an extending gate, and a biological detecting layer. The detection chip undergoes surface modification processes to integrate biological probes, allowing the detection of African swine fever virus in the sample.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="761px" img-content="tif" inline="yes" orientation="portrait" width="876px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622578</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144538</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">G02B9/64</main-classification>
        <further-classification edition="200601120241230B">G02B11/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今國光學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINKO OPTICAL CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泓餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李伯昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>七片式取像鏡頭</chinese-title>
        <english-title>SEVEN-PIECE IMAGING LENS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種七片式取像鏡頭，由物側至像側依序包括一前鏡群、一光圈及一後鏡群，前鏡群包括由物側至像側依序排列的一第一鏡片、一第二鏡片、一第三鏡片及一第四鏡片，前鏡群整體具有負屈光力，第一鏡片的像側面為凹面，第二鏡片的像側面為凹面，第三鏡片的像側面為凹面，後鏡群包括由物側至像側依序排列的一第五鏡片、一第六鏡片及一第七鏡片，後鏡群整體具有正屈光力，第五鏡片的物側面及像側面均為凸面，第七鏡片的物側面及像側面均為凸面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A Seven-Piece Imaging Lens includes a front lens group, a stop and a rear lens group in sequence from the object side to the image side. The front lens group includes a first lens, a second lens, a third lens and a fourth lens arranged in sequence from the object side to the image side. The front lens group as a whole has negative refractive power. The object sides of the first, the second and the third lenses are all concave. The rear lens group includes a fifth lens, a sixth lens and a seventh lens arranged in sequence from the object side to the image side. The rear lens group as a whole has positive refractive power. The object sides and the image sides of the fifth and seventh lenses are all convex.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一鏡片</p>
        <p type="p">20:第二鏡片</p>
        <p type="p">30:第三鏡片</p>
        <p type="p">40:第四鏡片</p>
        <p type="p">50:第五鏡片</p>
        <p type="p">60:第六鏡片</p>
        <p type="p">70:第七鏡片</p>
        <p type="p">80:平板鏡片</p>
        <p type="p">A:物側</p>
        <p type="p">B:像側</p>
        <p type="p">G1:前鏡群</p>
        <p type="p">G2:後鏡群</p>
        <p type="p">ST:光圈</p>
        <p type="p">L:光軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="582px" img-content="tif" inline="yes" orientation="portrait" width="685px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623542</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144542</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10P52/00</main-classification>
        <further-classification edition="200601120260303B">B24B7/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣運機械工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENMEC MECHANICAL ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯智鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, CHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾家柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIA CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>晶錠晶圓研磨系統</chinese-title>
        <english-title>INGOT WAFER GRINDING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種晶錠晶圓研磨系統，用以研磨半導體物件(化合物半導體)，包括一設備前端模組（EFEM）、一研磨設備及至少一倉儲分類設備。所述設備前端模組於設有裝載口（Load Port），裝載口能用以輸入及輸出載具，所述載具能用以承載半導體物件(晶圓或晶錠)。所述研磨設備設置於設備前端模組的一側，研磨設備包含一或多個研磨裝置。倉儲分類設備設置於設備前端模組的另一側，倉儲分類設備能用以存放載具，以增加儲量。由此，能用以進行半導體物件的研磨，可達成從晶錠到晶圓多尺寸規格全自動化大量生產作業，以提升產能效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ingot wafer grinding system is provided for grinding a semiconductor object (compound semiconductor), which includes an equipment front end module (EFEM), a grinding equipment, and at least one stock sorting equipment. The EFEM is provided with a load port that can be used to input or output pods. The pods can be used to carry the semiconductor object, such as wafers or crystal ingots. The grinding equipment is disposed at one side of the EFEM, and includes one or more grinding devices. The stock sorting equipment is disposed at another side of the EFEM, and can be used to store pads to increase storage capacity. As a result, it can be used to grind semiconductor objects and achieve fully automatic massed production operations in multiple dimensions from ingot to wafer, so as to increase the production efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:設備前端模組</p>
        <p type="p">11:裝載口</p>
        <p type="p">12:搬運機構</p>
        <p type="p">2:研磨設備</p>
        <p type="p">21:研磨裝置</p>
        <p type="p">22:晶圓測厚機構</p>
        <p type="p">23:晶錠測厚機構</p>
        <p type="p">3:倉儲分類設備</p>
        <p type="p">31:儲格</p>
        <p type="p">A:第一輸送路徑</p>
        <p type="p">B:第二輸送路徑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="783px" img-content="tif" inline="yes" orientation="portrait" width="862px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622457</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144543</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260303B">G01B11/14</main-classification>
        <further-classification edition="202601120260303B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>由田新技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTECHZONE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒嘉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUAN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李岳龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUEH-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>覆晶高度量測方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR MEASURING HEIGHT IN FLIP CHIP</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種覆晶高度量測方法及系統。覆晶高度量測方法包括以下步驟：提供一覆晶結構，覆晶結構包括一基板、一晶片、以及設置於基板與晶片之間的複數個焊球；進行一覆晶結構影像的截取與量測，通過拍攝覆晶結構，以取得覆晶結構的側面影像，並基於覆晶結構的側面影像量測晶片的一晶片側面影像垂直距離、或基板與晶片之間的一影像垂直間隔距離；進行覆晶結構中一垂直間隔距離的計算，根據晶片側面影像垂直距離或影像垂直間隔距離計算出基板與晶片之間的垂直間隔距離；以及進行一總空間體積的計算，根據垂直間隔距離計算出基板與晶片之間的總空間體積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and a system for measuring height in flip chip are provided. The method for measuring height in flip chip includes the following steps: providing a flip chip structure, wherein the flip chip structure includes a substrate, a chip, and a plurality of solder balls disposed between the substrate and the chip; capturing and measuring an image of the flip chip structure: photographing the flip chip structure to obtain a side image of the flip chip structure, and measuring the side image of the flip chip structure to obtain a vertical distance of a side image of the chip or an image vertical spacing distance between the substrate and the chip; calculating a vertical spacing distance in the flip chip structure: calculating a vertical spacing distance between the substrate and the chip based on the vertical distance of the side image of the chip or the image vertical spacing distance; and calculating a total space volume: calculating a total space volume between the substrate and the chip based on the vertical spacing distance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-S4:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="297px" img-content="tif" inline="yes" orientation="portrait" width="488px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622871</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144545</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120241130B">G06Q40/06</main-classification>
        <further-classification edition="201201120241130B">G06Q20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣土地銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAND BANK OF TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>資產移轉作業系統及其方法</chinese-title>
        <english-title>ASSET TRANSFER OPERATION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資產移轉作業系統，包括通訊模組、資訊處理模組及審核處理模組。上述通訊模組用以接收上述多個分行主機傳輸的多個資產移轉資訊。上述資訊處理模組用以辨識資產移轉資訊的資產編號，根據一移轉作業標準格式進行處理產生銀行主機伺服器的一資產移轉合併單據，以及透過辨識資產移轉資訊的第一欄位資訊分別根據一移轉作業標準格式進行處理產生各分行主機的一資產移轉分行單據，再辨識資產移轉資訊的重要性，將高價值資產在資產移轉合併單據及資產移轉分行單據進行標記，以進行雙重審核流程。上述審核處理模組用以供上述多個審核人員裝置對上述資產移轉合併單據或資產移轉分行單據進行審核。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An asset transfer operation system includes a communication module, an information processing module, and an auditing processing module. The communication module is designed to receive multiple asset transfer information transmitted from various branch hosts. The information processing module is configured to identify the asset numbers from the asset transfer information and process them according to a predefined transfer operation standard format, thereby generating an asset transfer consolidated document on the bank's central server. Based on the recognition of the first field information, the module further processes and generates branch-specific asset transfer documents for each branch server. The module also assesses the importance of the assets, marking high-value assets in both the consolidated and branch-specific asset transfer documents for dual-review processing. The review processing module allows multiple auditors to review either the consolidated or branch-specific asset transfer documents.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資產移轉作業系統</p>
        <p type="p">110:通訊模組</p>
        <p type="p">120:資訊處理模組</p>
        <p type="p">130:審核處理模組</p>
        <p type="p">140:報表生成模組</p>
        <p type="p">150:帳務處理模組</p>
        <p type="p">160:資產移轉資料庫</p>
        <p type="p">170:分行主機</p>
        <p type="p">180:審核人員裝置</p>
        <p type="p">190:財務系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="796px" img-content="tif" inline="yes" orientation="portrait" width="740px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622606</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144551</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241212B">G02C7/04</main-classification>
        <further-classification edition="200601120241212B">G02C7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海華科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZUREWAVE TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖育萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉桐林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, TUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡煌展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, HUANG-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>隱形眼鏡</chinese-title>
        <english-title>CONTACT LENS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種隱形眼鏡。隱形眼鏡包含一眼鏡本體及一電子組件。眼鏡本體用來配戴於一眼球上，並且眼鏡本體包含有一光學部、及圍繞於光學部的一環形配戴部。環形配戴部具有呈C字形的一下眼瞼佈局區。電子組件設置於眼鏡本體上。電子組件通過眼鏡本體能隨著眼球移動，並且電子組件包含一刺激單元、及電性耦接刺激單元的一供電單元。刺激單元包含配置於所述下眼瞼佈局區內的一電極模組及電性耦接電極模組的一升壓控制模組。升壓控制模組通過電極模組發出一脈衝電壓信號，並且脈衝電壓信號用來被體液傳導至眼球一側的下眼瞼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A contact lens is provided. The contact lens includes a lens body and an electronic component. The lens body is designed to be worn on an eyeball, and it comprises an optical section and an annular wearing section surrounding the optical section. The annular wearing section features a C-shaped lower eyelid arrangement area. The electronic component is mounted on the lens body. The electronic component can move with the eyeball through the lens body and includes a stimulation unit and a power supply unit electrically coupled to the stimulation unit. The stimulation unit includes an electrode module positioned within the lower eyelid arrangement area and a boost control module electrically coupled to the electrode module. The boost control module emits a pulsed voltage signal through the electrode module, and the pulsed voltage signal is conducted by bodily fluids to the lower eyelid on one side of the eyeball.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:隱形眼鏡</p>
        <p type="p">1:眼鏡本體</p>
        <p type="p">11:光學部</p>
        <p type="p">12:環形配戴部</p>
        <p type="p">13:鏤空部</p>
        <p type="p">15:天線</p>
        <p type="p">2:電子組件</p>
        <p type="p">21:刺激單元</p>
        <p type="p">211:電極模組</p>
        <p type="p">2111:指叉電極</p>
        <p type="p">212:升壓控制模組</p>
        <p type="p">22:供電單元</p>
        <p type="p">GA:下眼瞼佈局區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="812px" img-content="tif" inline="yes" orientation="portrait" width="731px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622463</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144552</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250124B">G01B11/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣運機械工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENMEC MECHANICAL ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯智鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, CHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾家柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIA CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>整合型多工量測系統</chinese-title>
        <english-title>INTEGRATED MULTIPLEXING MEASUREMENT SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種整合型多工量測系統，用以量測半導體物件(化合物半導體)，包括一機體、一條紋干涉裝置、一白光干涉探頭及一彩色共軛焦量測探頭。條紋干涉裝置、白光干涉探頭及彩色共軛焦量測探頭設置於機體內。所述條紋干涉裝置能用於量測半導體物件的翹曲、凹凸、顏色、明亮分布、形狀及高氮區的分布等。白光干涉探頭及彩色共軛焦量測探頭設置於一處，所述白光干涉探頭可量測半導體物件的表面粗糙度及表面深度等，彩色共軛焦量測探頭(色散探頭)可用於量測半導體物件的表面粗糙度及厚度等，可利用共焦成像色散分析技術，精確量測半導體物件表面的粗糙度，亦可進行表面輪廓量測，包括微細的曲率和結構特徵。本發明將多種量測裝置整合於一機台，可分開或一起使用，而能便利於半導體物件的量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated multiplexing measurement system is provided for measuring conductor objects (compound semiconductor), which includes a machine body, a fringe interference device, a white light interference probe, and a color conjugate focus measurement probe. The fringe interference device, the white light interference probe, and the color conjugate focus measurement probe are disposed in the machine body. The fringe interference device can be used to measure the warpage, concave or convex, color, brightness distribution, shape and distribution of high nitrogen regions of semiconductor objects, etc. The white light interference probe and the color conjugate focus measurement probe are disposed at one place. The white light interference probe can be used to measure the surface roughness and surface depth of semiconductor objects, etc. The color conjugate focus measurement probe (dispersion probe) can be used to measure the surface roughness and thickness of semiconductor objects, etc. Confocal imaging dispersion analysis technology can be used to accurately measure the surface roughness of semiconductor objects, and can also measure surface profiles, including fine curvatures and structural features. The present invention integrates multiple measuring devices into one machine, which can be used separately or together, so as to facilitate the measurement of semiconductor objects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機體</p>
        <p type="p">11:第一側</p>
        <p type="p">12:第二側</p>
        <p type="p">13:第三側</p>
        <p type="p">14:第四側</p>
        <p type="p">2:條紋干涉裝置</p>
        <p type="p">3:白光干涉探頭</p>
        <p type="p">4:彩色共軛焦量測探頭</p>
        <p type="p">5:第一工作台</p>
        <p type="p">6:第二工作台</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.bmp" file="ed10005.bmp" height="877px" img-content="tif" inline="yes" orientation="portrait" width="645px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623016</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144555</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241202B">H01G4/30</main-classification>
        <further-classification edition="200601120241202B">H01G4/224</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈺邦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APAQ TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭敦仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, DUEN-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王懿穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>堆疊型電容器組件以及堆疊型電容器封裝結構</chinese-title>
        <english-title>STACKED CAPACITOR ASSEMBLY AND STACKED CAPACITOR PACKAGE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種堆疊型電容器組件以及堆疊型電容器封裝結構。堆疊型電容器封裝結構包括堆疊型電容器組件、電極組件以及絕緣封裝體。堆疊型電容器組件包括多個導電基板。電極組件包括第一電極結構以及第二電極結構。絕緣封裝體被配置以用於包覆堆疊型電容器組件且承載電極組件。多個導電基板彼此分離且符合下列公式：H=nt+(n+1)d；其中，H為多個導電基板的總厚度，n為多個導電基板的數量，t為每一導電基板的厚度，d為相鄰的兩個導電基板之間的距離；其中，多個導電基板的數量介於2至30之間，每一導電基板的厚度介於80 µm至150 µm之間，相鄰的兩個導電基板之間的距離介於0.05 µm至30 µm之間，且d/h的比值介於0.35至350之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a stacked capacitor assembly and a stacked capacitor package structure. The stacked capacitor package structure includes a stacked capacitor assembly, an electrode assembly and an insulating package body. The stacked capacitor assembly include multiple conductive substrates. The electrode assembly includes a first electrode structure and a second electrode structure. The insulating package body is configured to enclose the stacked capacitor assembly and carry the electrode assembly. The conductive substrates are separated from each other and conform to the following formula: H=nt+(n+1)d, in which H is the total thickness of the conductive substrates, n is the number of the conductive substrates, t is the thickness of each conductive substrate, and d is the distance between two adjacent conductive substrates. The number of the conductive substrates is between 2 and 30, the thickness of each conductive substrate is between 80 µm and 150 µm, and the distance between two adjacent conductive substrates is between 0.05 µm and 30 µm, and the ratio of d/h is between 0.35 and 350.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:導電基板</p>
        <p type="p">101:第一部分</p>
        <p type="p">102:第二部分</p>
        <p type="p">2:內部導電結構</p>
        <p type="p">5:圍繞狀絕緣層</p>
        <p type="p">6:隔離物</p>
        <p type="p">G:間隔空間</p>
        <p type="p">H,t:厚度</p>
        <p type="p">d:距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.png" file="d10020.TIF" giffile="ed10020.png" height="561px" img-content="tif" inline="yes" orientation="portrait" width="896px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621768</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144556</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120250729B">A63F13/24</main-classification>
        <further-classification edition="200601120250729B">G06F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶德科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXIN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧賀隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HO-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林錦龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾子華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, TZU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>控制裝置及控制裝置套件</chinese-title>
        <english-title>CONTROL DEVICES AND CONTROL DEVICE KITS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種控制裝置及控制裝置套件。控制裝置包含支撐板件及兩個把手部。支撐板件的兩端分別具有第一卡合結構及第一電連接結構。各第一電連接結構與支撐板件內的電路模組連接。各個把手部的內側具有第二卡合結構及第二電連接結構。兩個把手部的兩個第二卡合結構能與支撐板件的兩個第一卡合結構可拆卸地連接。當兩個把手部通過兩個第二卡合結構與支撐板件的兩個第一卡合結構相互卡合，且把手部的內側的連接器，與電子裝置連接時，第一電連接結構能與第二電連接結構電性連接，而各個操作構件產生的控制訊號，能傳遞至電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a control device and a control device kit. The control device comprises a support plate and two handle portions. Each end of the support plate is provided with a first engagement structure and a first electrical connection structure. Each first electrical connection structure is connected to a circuit module within the support plate. The inner side of each handle portion is provided with a second engagement structure and a second electrical connection structure. The two second engagement structures of the handle portions are detachably connected to the two first engagement structures of the support plate. When the two handle portions are engaged with the two first engagement structures of the support plate through the two second engagement structures, and the connectors on the inner side of the handle portions are connected to an electronic device, the first electrical connection structures can be electrically connected to the second electrical connection structures, allowing control signals generated by each operating component to be transmitted to the electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:控制裝置</p>
        <p type="p">1:支撐板件</p>
        <p type="p">10:電池</p>
        <p type="p">11:第一卡合結構</p>
        <p type="p">111:開口</p>
        <p type="p">112:封閉部</p>
        <p type="p">12:第一電連接結構</p>
        <p type="p">13:電路模組</p>
        <p type="p">2:把手部</p>
        <p type="p">2A:中央處理模組</p>
        <p type="p">2B:凸出部</p>
        <p type="p">21:操作構件</p>
        <p type="p">22:第二卡合結構</p>
        <p type="p">23:第二電連接結構</p>
        <p type="p">24:連接器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="758px" img-content="tif" inline="yes" orientation="portrait" width="963px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621552</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144560</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">A01D34/00</main-classification>
        <further-classification edition="200601120250303B">A01B69/00</further-classification>
        <further-classification edition="202401120250303B">G05D1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優式機器人股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URSROBOT AI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世又</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游勝凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連豊力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳忠侯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUNG-HOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳招成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>區域性作業管理方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種區域性作業管理方法，包含：獲得一對應於一區域資料的路徑資料，其中，該路徑資料指示出一位於一待處理區域之內的作業路徑；根據該路徑資料及一作業設備資料決定出多個分工參數，並根據該等分工參數定義出多個彼此連接且共同構成該作業路徑的分工路徑部分，其中，該等分工參數分別表示多個彼此不同的距離或時間長度，該等分工路徑部分分別定義出多個位於該待處理區域內的分工區域部分，該等分工區域部分分別對應於該等分工參數，且按照對應之該等分工參數的大小並排，而使得愈小之分工參數所對應的該分工區域部分愈接近該後續目標區域；根據該等分工路徑部分分別控制多個自主移動設備於該待處理區域執行環境處理作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S13:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="612px" img-content="tif" inline="yes" orientation="portrait" width="760px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622878</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144575</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120241130B">G06Q50/04</main-classification>
        <further-classification edition="202401120241130B">G06Q50/00</further-classification>
        <further-classification edition="202401120241130B">G06Q10/08</further-classification>
        <further-classification edition="202301120241130B">G06Q10/063</further-classification>
        <further-classification edition="201901120241130B">G06F16/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成創永續股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C.C.SUSTAIN ESG SOLUTION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳峙霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳峙霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林妙儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>供應鏈碳盤查管理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種供應鏈碳盤查管理系統，包含一供應商資料庫、一專案資料庫、一前置處理裝置、一邀請裝置與一碳盤查計算裝置。供應商資料庫儲存複數個供應商資料；專案資料庫儲存一主專案以及複數個盤查專案；前置處理裝置自供應商資料庫中選擇供應商資料之多個，以形成複數個關聯供應商資料；邀請裝置傳送一邀請訊息至各關聯供應商資料的通訊帳號；邀請裝置接收對應的一回覆訊息後，將專案資料庫中對應的盤查專案設定為一關聯盤查專案，且邀請裝置將各關聯盤查專案與主專案相關聯；碳盤查計算裝置計算關聯盤查專案之各別碳排放量以及一總碳排放量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:供應鏈碳盤查管理系統</p>
        <p type="p">40:電子裝置</p>
        <p type="p">402:第一電子裝置</p>
        <p type="p">404:第二電子裝置</p>
        <p type="p">50:網際網路</p>
        <p type="p">60:外部系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="767px" img-content="tif" inline="yes" orientation="portrait" width="658px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623621</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144577</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10W10/10</main-classification>
        <further-classification edition="202601120260303B">H10W20/00</further-classification>
        <further-classification edition="202601120260303B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫家禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHIA-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>單擴散阻斷結構及其製造方法</chinese-title>
        <english-title>SINGLE DIFFUSION BREAK STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出了一種具有單擴散阻斷的半導體結構，包含一基底，其上界定有一第一單元區域與一第二單元區域，該第一單元區域與該第二單元區域相鄰且具有各自的該些鰭部，一淺溝槽隔離結構位於該基底上且圍繞該些鰭部，多個閘極跨過該些鰭部，一虛設閘極位於該第一區域與該第二區域之間的該淺溝槽隔離結構上且與該些閘極間隔排列，至少一導電圖案位於該虛設閘極上並與之連接，以及至少一虛設導孔件位於該至少一導電圖案上並與之連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure with single diffusion break (SDB) is provided in the present invention, including a substrate with a first cell region and a second cell region defined thereon, the first cell region and the second cell region are adjacent to each other and have respective fins, a STI on the substrate and surrounding the fins, multiple gates crossing over the fins, a dummy gate on the STI between the first cell region and the second cell region and spaced apart with the gates, at least one conductive pattern on the dummy gate and connecting therewith, and at least one dummy via on the at least one conductive pattern and connecting therewith.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">104:閘極氧化層</p>
        <p type="p">DG:虛設閘極</p>
        <p type="p">F:鰭部</p>
        <p type="p">M0:第零金屬層</p>
        <p type="p">M1:第一金屬層</p>
        <p type="p">MD:第一導電圖案</p>
        <p type="p">MP:第二導電圖案</p>
        <p type="p">SDB:單擴散阻斷(結構)</p>
        <p type="p">STI:淺溝槽隔離結構</p>
        <p type="p">V0:虛設導孔件、第零金屬層導孔件、虛設垂直互連條</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="625px" img-content="tif" inline="yes" orientation="portrait" width="695px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621863</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144583</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">B25D17/08</main-classification>
        <further-classification edition="200601120250123B">B25D17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻安國際興業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG ANN TOOL INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇政維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHENG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>組合式氣動鎚工具</chinese-title>
        <english-title>COMPOSITE PNEUMATIC HAMMER TOOL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明組合式氣動鎚工具包括有一個本體、一個氣動桿及一個連結器，本體設置有一個工具頭，工具頭設置有一個插槽，氣動桿的一端能夠連接氣動工具且另一端可脫離地連接於工具頭，連結器固定結合於氣動桿，連結器包括有一個扣件，扣件能夠在扣接位置與釋放位置之間移動，扣件在扣接位置時，扣件插接於插槽內並使氣動桿不能脫離工具頭，扣件在釋放位置時，扣件退出插槽並使氣動桿能夠脫離工具頭，工具透過上述結構能夠減少材積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite pneumatic hammer tool includes a body, a pneumatic rod, and a connector. The body is equipped with a tool head, which features a slot. One end of the pneumatic rod can be connected to a pneumatic tool, while the other end can be detachably connected to the tool head. The connector is fixedly attached to the pneumatic rod and includes a fastener. The fastener is capable of moving between a locked position and a released position. When in the locked position, the fastener is inserted into the slot, preventing the pneumatic rod from detaching from the tool head. When in the released position, the fastener disengages from the slot, allowing the pneumatic rod to detach from the tool head. Through the aforementioned structure, the tool can reduce its overall size.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:工具</p>
        <p type="p">20:本體</p>
        <p type="p">21:工具頭</p>
        <p type="p">212:工作部</p>
        <p type="p">213:背部</p>
        <p type="p">22:握柄</p>
        <p type="p">30:氣動桿</p>
        <p type="p">40:連結器</p>
        <p type="p">41:扣件</p>
        <p type="p">42:第一套座</p>
        <p type="p">421:固接部</p>
        <p type="p">423:套環部</p>
        <p type="p">43:第二套座</p>
        <p type="p">44:控制座</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="884px" img-content="tif" inline="yes" orientation="portrait" width="686px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622930</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144584</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241202B">G09F9/30</main-classification>
        <further-classification edition="200601120241202B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高熵材料科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGH ENTROPY MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉均蔚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, JIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>強化支撐片及包含其之可摺疊顯示器</chinese-title>
        <english-title>REINFORCED SUPPORT SHEET AND FOLDABLE DISPLAY DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種強化支撐片，用於整合在一可摺疊顯示器之中以貼附至一顯示面板的底面，且用於支撐該顯示面板。依據本發明，該強化支撐片包括一基底與一皺褶結構，其中該基底的頂面用於貼附連接該顯示面板，使得該皺褶結構涵蓋該顯示面板的一彎折區域。依此設計，當該顯示面板彎折之時，該皺褶結構緩衝施加在該彎折區域的應力，藉此方式減少殘餘應力累積在該彎折區域，從而避免該彎折區域出現摺痕及裂痕。皺褶結構因具有較大的強度及剛性，可對該顯示面板產生良好的支撐作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a reinforced support sheet for application in a foldable display device. The reinforced support sheet is used to support a bottom surface of a display panel of the foldable display device, and comprises a substrate and a wrinkle structure, in which the wrinkle structure oppositely overlaps a bending region of the display panel. Therefore, in case of the display panel is folded, a strain force applied to the bending region is buffered and/or attenuated by the wrinkle structure, thereby reducing the accumulation of residual strain occurring in the bending region. As a result, creases and/or cracks are avoided to be formed in the bending region in spied of the fact that the display panel has been folded plenty of times. In addition, because of having high strength and rigidity, the wrinkle structure provides a good support to the display panel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:強化支撐片</p>
        <p type="p">10:基底</p>
        <p type="p">11:皺褶結構</p>
        <p type="p">12:膠黏層</p>
        <p type="p">2:顯示面板</p>
        <p type="p">3:光學保護片</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="715px" img-content="tif" inline="yes" orientation="portrait" width="968px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622951</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144587</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250113B">G09G5/10</main-classification>
        <further-classification edition="200601120250113B">G09G3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭煥騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HUAN-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示驅動晶片及其色偏補償方法</chinese-title>
        <english-title>DISPLAY DRIVER IC AND COLOR DEVIATION COMPENSATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示驅動晶片，用於一可撓式顯示器。該顯示驅動晶片包含一顯示控制電路以及一摺痕補償電路。該顯示控制電路耦接於該可撓式顯示器之一顯示面板，用於根據一像素向該顯示面板提供驅動訊號。該摺痕補償電路耦接於該顯示控制電路，用於執行一色偏補償方法。該色偏補償方法包含取得該可撓式顯示器之一彎折處之一摺疊角度；根據該摺疊角度決定該像素之一子像素之一色偏補償值；以及根據該色偏補償值調整該子像素之一子像素值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display driver IC used for a flexible display is provided. The display driver IC includes a display control circuit and a bending compensation circuit. The display control circuit is coupled to a display panel of the flexible display and used for providing driving signals to the display panel according to a pixel. The bending compensation circuit is coupled to the display control circuit and used for executing a color deviation compensation method. The color deviation compensation method includes obtaining a bending angle of a folding part of the flexible display; determining a compensation value for a sub-pixel of the pixel according to the bending angle; and adjusting a sub-pixel value of the sub-pixel according to the compensation value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:色偏補償流程</p>
        <p type="p">400~410:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="984px" img-content="tif" inline="yes" orientation="portrait" width="722px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623441</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144588</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260303B">H10D84/80</main-classification>
        <further-classification edition="202501120260303B">H10D48/38</further-classification>
        <further-classification edition="202501120260303B">H10D62/10</further-classification>
        <further-classification edition="202601120260303B">H10P14/60</further-classification>
        <further-classification edition="202601120260303B">H10W10/00</further-classification>
        <further-classification edition="202601120260303B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, WEN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TSUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江昌達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHANG-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種半導體裝置及其形成方法。半導體裝置包括基底、隔離結構以及薄膜電阻結構。基底包括由隔離溝渠所界定的主動區。隔離結構設置在隔離溝渠中且包括凹槽。薄膜電阻結構設置在凹槽上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a semiconductor device and a method for forming the same. The semiconductor device includes a substrate including an active region defining by an isolation trench, an isolation structure disposed in the isolation trench and including a recess, and a thin film resistor structure disposed over the recess.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">100t:隔離溝渠</p>
        <p type="p">110:隔離結構</p>
        <p type="p">122:支撐結構</p>
        <p type="p">132:第一介電層</p>
        <p type="p">140:閘極結構</p>
        <p type="p">150:第二介電層</p>
        <p type="p">162:薄膜電阻結構</p>
        <p type="p">172、174:導電通孔</p>
        <p type="p">110r:凹槽</p>
        <p type="p">AA:主動區</p>
        <p type="p">DR1:第一裝置區</p>
        <p type="p">DR2:第二裝置區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="508px" img-content="tif" inline="yes" orientation="portrait" width="613px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621642</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144590</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120250729B">A61B5/374</main-classification>
        <further-classification edition="202101120250729B">A61B5/386</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石文龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, WEN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱正弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JENG-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡旻諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>腦波感測結構</chinese-title>
        <english-title>BRAINWAVE SENSING STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種腦波感測結構，包括梳狀基座、感測電極、彈臂及螺絲。梳狀基座具有通孔。感測電極包括設置於通孔內的定位部與位於通孔外的感測部。彈臂設置於梳狀基座相反於感測電極的感測部的一側，並具有彈臂穿孔。螺絲自彈臂相反於梳狀基座的一側可動地穿設於彈臂穿孔並鎖附至感測電極的定位部，致感測電極與彈臂浮動連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A brainwave sensing structure including a comb-shaped base, a sensing electrode, an elastic arm and a screw is provided. The comb-shaped base has a through hole. The sensing electrode includes a positioning part disposed in the through hole and a sensing part located outside the through hole. The elastic arm is disposed at one side of the comb-shaped base opposite to the sensing part of the sensing electrode and has an elastic arm via. The screw movably passes through the elastic arm via from one side of the elastic arm opposite to the comb-shaped base and is screwed into the positioning part of the sensing electrode, thereby causing the sensing electrode and the elastic arm to be movably connected to each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:腦波感測結構</p>
        <p type="p">110:梳狀基座</p>
        <p type="p">111:梳齒</p>
        <p type="p">112:定位側牆</p>
        <p type="p">112a:側向缺口</p>
        <p type="p">1121:定位空間</p>
        <p type="p">122:感測部</p>
        <p type="p">122b:感測凸柱</p>
        <p type="p">130:彈臂</p>
        <p type="p">140:彈性套體</p>
        <p type="p">141:彈性套筒</p>
        <p type="p">150:螺絲</p>
        <p type="p">151:頭部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="696px" img-content="tif" inline="yes" orientation="portrait" width="849px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622493</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144605</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G01N21/958</main-classification>
        <further-classification edition="200601120241231B">G01N21/896</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米豊米科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MLMTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>光學檢測裝置</chinese-title>
        <english-title>OPTICAL DETECTION DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學檢測裝置，用於檢測透光基板中的孔洞，且包含光源、容置槽、偏光片、電極和影像偵測裝置。容置槽用於容納液晶材料和透光基板，且透光基板包括多個貫穿孔洞，容置槽具有第一側和第二側，用於使液晶材料和透光基板位於第一側和第二側之間。偏光片和電極設置於該容置槽的第一側和第二側，其中第一電極和第二電極用於使兩者之間產生電場。當容置槽中存在液晶材料和透光基板時，透光基板被浸泡於液晶材料中，且液晶材料填入些貫穿孔洞中。影像偵測裝置用於偵測穿透液晶材料或透光基板的光線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The optical detection device is used for detecting holes in the transparent substrate and comprises a light source, an accommodating tank, polarizers, electrodes and an image detection device. The accommodating tank is used for accommodating a liquid crystal material and a transparent substrate, and the transparent substrate comprises through holes, and the accommodating tank has a first side and a second side, so that the liquid crystal material and the transparent substrate are located between the first side and the second side. The polarizers and the electrodes are arranged on the first side and the second side of the accommodating tank, where the first electrode and the second electrode are used for generating an electric field between them. When the liquid crystal material and the transparent substrate exist in the accommodating tank, the transparent substrate is soaked in the liquid crystal material, and the liquid crystal material is filled in the through holes. The image detection device is used for detecting light rays penetrating the liquid crystal material or the transparent substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10-1:光學檢測裝置</p>
        <p type="p">20:光源</p>
        <p type="p">30:容置槽</p>
        <p type="p">40:影像偵測裝置</p>
        <p type="p">51:第一偏光片</p>
        <p type="p">52:第二偏光片</p>
        <p type="p">61:第一電極</p>
        <p type="p">62:第二電極</p>
        <p type="p">71:第一配向膜</p>
        <p type="p">72:第二配向膜</p>
        <p type="p">80:液晶材料</p>
        <p type="p">90:透光基板</p>
        <p type="p">100a:貫穿孔洞</p>
        <p type="p">100b:盲孔洞</p>
        <p type="p">R11、R12、R13、R14:光線</p>
        <p type="p">R12’、R13’、R14’:光線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="687px" img-content="tif" inline="yes" orientation="portrait" width="868px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622711</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144611</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">G06F3/041</main-classification>
        <further-classification edition="201301120250123B">G06F3/0354</further-classification>
        <further-classification edition="201301120250123B">G06F3/039</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾郭庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG-KUO, TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游翔鉦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HSIANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐季祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, CHI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李金麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>觸控感測系統及觸控感測裝置</chinese-title>
        <english-title>TOUCH SENSING SYSTEM AND TOUCH SENSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控感測系統，包括觸控感測裝置及主動筆。觸控感測裝置包括驅動器電路及觸控感測面板。驅動器電路用以驅動觸控感測面板輸出上行信號。主動筆用以根據上行信號輸出下行信號給觸控感測面板。驅動器電路根據觸控感測裝置的操作模式調整上行信號的頻率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch sensing system including a touch sensing apparatus and a stylus is provided. The touch sensing apparatus includes a driver circuit and a touch sensing panel. The driver circuit drives the touch sensor panel to output an uplink signal. The stylus outputs a downlink signal to the touch sensor panel based on the uplink signal. The driver circuit adjusts the frequency of the uplink signal according to operation modes of the touch sensing apparatus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:觸控感測系統</p>
        <p type="p">110:觸控感測裝置</p>
        <p type="p">120:主動筆</p>
        <p type="p">DL:下行信號</p>
        <p type="p">UL:上行信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="683px" img-content="tif" inline="yes" orientation="portrait" width="660px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622712</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144613</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">G06F3/041</main-classification>
        <further-classification edition="200601120250123B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奕力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILI TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許誠顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹秉燏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, PING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈易弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YI HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>觸控顯示裝置</chinese-title>
        <english-title>TOUCH DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控顯示裝置包括觸控顯示面板、蓋板與導體層。觸控顯示面板設有顯示區以及顯示區以外的周邊區，且包括驅動晶片與接地線。驅動晶片設置在周邊區內。接地線設置在周邊區內且環繞顯示區。接地線連接驅動晶片的接地端。蓋板設置在觸控顯示面板的一側，且重疊於顯示區與周邊區。導體層設置在蓋板朝向觸控顯示面板的蓋板表面上，且重疊於接地線的至少一部分與驅動晶片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch display apparatus including a touch display panel, a cover and a conductor layer is provided. The touch display panel is provided with a display area and a peripheral area outside the display area, and includes a driver chip and a ground wire. The driver chip is disposed in the peripheral area. The ground wire is disposed in the peripheral area and surrounds the display area. The ground wire connects a ground terminal of the driver chip. The cover is disposed on one side of the touch display panel facing away from the first substrate, and overlaps the display area and the peripheral area. The conductor layer is disposed on a cover surface of the cover facing the touch display panel, and overlaps the driver chip and at least part of the ground wire.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:觸控顯示裝置</p>
        <p type="p">100:觸控顯示面板</p>
        <p type="p">101、102:基板</p>
        <p type="p">140:觸控感測層</p>
        <p type="p">200:蓋板</p>
        <p type="p">220:導體層</p>
        <p type="p">CWR:共電位線</p>
        <p type="p">GWR:接地線</p>
        <p type="p">POL1、POL2:偏光片</p>
        <p type="p">WD1:水滴</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="442px" img-content="tif" inline="yes" orientation="portrait" width="461px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621659</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144617</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250512B">A61G7/057</main-classification>
        <further-classification edition="200601120250512B">A61G5/10</further-classification>
        <further-classification edition="201801120250512B">G16H40/60</further-classification>
        <further-classification edition="201301120250512B">G06F3/048</further-classification>
        <further-classification edition="200601120250512B">G01L1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康揚股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARMA MEDICAL PRODUCTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡睿弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, JUI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴胡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAHUL, SELVARAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>坐壓偵測的提示方法</chinese-title>
        <english-title>PROMPTING METHOD OF SITTING PRESSURE DETECTION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種坐壓偵測的提示方法包含：在一驗證啟動時間點，控制一壓力偵測墊的多個壓力感測器偵測壓力偵測墊上不同位置的壓力而產生壓力值；接收並加總在該驗證啟動時間點產生的壓力值，以產生一標準值；在一減壓時間點，控制該些壓力感測器偵測壓力偵測墊上不同位置的壓力而產生壓力值；接收並加總在該減壓時間點產生的壓力值，以產生一動態值；以及顯示代表該動態值相對於該標準值變化的一圖形化提示在使用者介面上。藉此，可視覺化提示坐壓減緩的成果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A prompting method of sitting pressure detection includes: controlling pressure sensors of a pressure detecting cushion to sense pressure values at different positions on the pressure detecting cushion at a time point of verification startup; generating a standard value by receiving and adding up the pressure values generated at the time point of verification startup; controlling the pressure sensors to sense pressure values at a time point of stress reduction; generating a dynamic value by receiving and adding up the pressure values generated at the time point of stress reduction; and displaying a graphic tip representing the change of the dynamic value relative to the standard value, on a user interface. Therefore, it is possible to prompt the results of reducing sitting pressure by a visualization way.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="1038px" img-content="tif" inline="yes" orientation="portrait" width="789px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621806</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144619</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">B08B9/093</main-classification>
        <further-classification edition="200601120250123B">B08B13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>信佑機械工程有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIN YO MECHANICAL ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>清洗噴頭</chinese-title>
        <english-title>CLEANING NOZZLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種清洗噴頭，包括：連接之入口段、出口段及頂段；入口段，具有入口；出口段，具有相反之第一端及第二端，第一端係連接於入口段，出口段於第一端及第二端之間具有複數噴出縫；頂段，具有相反之連接端及封閉端，連接端係連接於該出口段之第二端，頂段具有反射面，反射面供以反射流體</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cleaning nozzle includes an entrance section having an entrance, an exit section and a top section, the exit section has a first end and a second end opposite to the first end, the first end is connected to the entrance section, a plurality of ejection seams is defined between the first and second ends, the top section has a connecting end and a closed end opposite to the connecting end, the connecting end is connected to the second end, and the top section has a reflective surface for reflecting fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:入口段</p>
        <p type="p">11:前端</p>
        <p type="p">111:入口</p>
        <p type="p">12:後端</p>
        <p type="p">20:出口段</p>
        <p type="p">21:第一端</p>
        <p type="p">22:第二端</p>
        <p type="p">20A:噴出縫</p>
        <p type="p">20B:輔助噴出縫</p>
        <p type="p">30:頂段</p>
        <p type="p">31:連接端</p>
        <p type="p">32:封閉端</p>
        <p type="p">321:反射面</p>
        <p type="p">X:軸向</p>
        <p type="p">R:周向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="1079px" img-content="tif" inline="yes" orientation="portrait" width="760px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621780</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144622</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250330B">B01D46/02</main-classification>
        <further-classification edition="202201120250330B">B01D46/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>信佑機械工程有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIN YO MECHANICAL ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>濾布袋清洗方法</chinese-title>
        <english-title>FILTER CLOTH BAG CLEANING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種濾布袋清洗方法，包括：準備步驟，準備待清洗之濾布袋；秤重步驟，對濾布袋秤重，以得到初始重量；清洗步驟，將濾布袋套在清洗噴頭外，並將流體導入清洗噴頭內，透過位於該清洗噴頭外周緣之複數噴出縫噴出流體，噴向該濾布袋之內側面；移動步驟，驅動濾布袋或清洗噴頭移動，改變濾布袋與清洗噴頭之相對位置；檢測步驟，對清洗完成後之濾布袋進行秤重，以得到清洗後重量；判定步驟，將初始重量及清洗後重量帶入清灰公式，得到清灰率，當清灰率小於90%，則重新執行清洗步驟及移動步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A filter cloth bag cleaning method includes the following steps: preparing which prepares the filter cloth bag to be cleaned, weighing which weighs the filter cloth bag to get an initial weight, cleaning which places the filter cloth bag outside the cleaning nozzle and makes fluid flow into the cleaning nozzle, and then ejected through a plurality of ejection seams located at an outer edge of the cleaning nozzle to an inner side of the filter cloth bag, moving which drives the filter cloth bag or the cleaning nozzle to move, so as to change the relative position of the filter cloth bag and the cleaning nozzle, detecting which weighs the filter cloth bag after cleaning to get the weight after cleaning, determining which takes the initial weight and the weight after cleaning into the cleaning formula to obtain the ash removal rate, when the ash removal rate is less than 90%, restart the cleaning and moving steps.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:準備步驟</p>
        <p type="p">S2:秤重步驟</p>
        <p type="p">S3:清洗步驟</p>
        <p type="p">S4:移動步驟</p>
        <p type="p">S5:檢測步驟</p>
        <p type="p">S6:判定步驟</p>
        <p type="p">S7:物性檢測步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="845px" img-content="tif" inline="yes" orientation="portrait" width="499px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622486</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144627</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120241202B">G01N21/3577</main-classification>
        <further-classification edition="200601120241202B">G01N21/31</further-classification>
        <further-classification edition="200601120241202B">G01N33/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淙宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯呈達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, CHENG-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宏聲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUNG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王昕兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIN-ERH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>水質檢測設備及應用其之水質檢測方法</chinese-title>
        <english-title>WATER QUALITY DETECTING EQUIPMENT AND WATER QUALITY DETECTING METHOD USING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">水質檢測設備包括檢測腔裝置、幫浦模組、光源、光感測器及控制器。檢測腔裝置具有檢測腔。幫浦模組用以輸送待檢液及試劑至檢測腔。光源位於檢測腔外且用以發出檢測光至檢測腔。光感測器感測通過檢測腔之檢測光並產生檢測電壓值。控制器電性連接光感測器及幫浦模組且經配置以執行以下程序：電壓感測程序、稀釋判斷程序、待檢液稀釋程序及濃度取得程序。稀釋判斷程序可計算檢測電壓值與基礎電壓值之電壓比值。當電壓比值大於臨界值時執行濃度取得程序，當電壓比值不大於臨界值時，執行待檢液稀釋程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A water quality detecting equipment includes a detection chamber device, a pump module, a light source, a light sensor and a controller. The detection chamber device has a detection chamber. The pump module is configured to transport a to-be-tested liquid and a reagent to the detection chamber. The light source is configured to emit detection light to the detection chamber. The light sensor is configured to sense the detection light traveling through the detection chamber and generate a detection voltage. The controller is electrically connected to the light sensor and the pump module and is configured to execute the following procedures: a voltage sensing procedure, a dilution determination procedure, a dilution procedure and a concentration acquisition procedure. The dilution determination procedure may calculate a voltage ratio between the detection voltage value and a basic voltage value. When the voltage ratio is greater than a critical value, the concentration acquisition procedure is executed. When the voltage ratio is not greater than the critical value, the dilution procedure is executed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:水質檢測設備</p>
        <p type="p">120:幫浦模組</p>
        <p type="p">130:光源</p>
        <p type="p">140:光感測器</p>
        <p type="p">150:控制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="371px" img-content="tif" inline="yes" orientation="portrait" width="504px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622697</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144631</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F1/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子系統、電源補強裝置與Type-C電源線</chinese-title>
        <english-title>ELECTRONIC SYSTEM, POWER SUPPLY REINFORCEMENT DEVICE AND TYPE-C POWER CORD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子系統、電源補強裝置與Type-C電源線。電子系統包括一第一電子裝置、一第一Type-C電源線、一電源補強裝置、一第二Type-C電源線及一第二電子裝置。第一電子裝置具有一第一Type-C連接埠。第一Type-C連接埠支援一PD充電功能。第一Type-C電源線連接於第一電子裝置。電源補強裝置連接於第一Type-C電源線。第二Type-C電源線連接於電源補強裝置。第二電子裝置具有一第二Type-C連接埠。第一Type-C連接埠支援一PD放電功能。第一電子裝置之一第一功率大於第二電子裝置之一第二功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic system, a power supply reinforcement device and a Type-C power cord are provided. The electronic system includes a first electronic device, a first Type-C power cord, a power reinforcement device, a second Type-C power cord and a second electronic device. The first electronic device has a first Type-C port. The first Type-C port supports a PD charging function. The first Type-C power cord is connected to the first electronic device. The power reinforcement device is connected to the first Type-C power cord. The second Type-C power cord is connected to the power reinforcement device. The second electronic device has a second Type-C port. The first Type-C port supports a PD discharge function. A first power of the first electronic device is greater than a second power of the second electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一電子裝置</p>
        <p type="p">110:第一Type-C連接埠</p>
        <p type="p">200:第二電子裝置</p>
        <p type="p">210:第二Type-C連接埠</p>
        <p type="p">300:電源補強裝置</p>
        <p type="p">400:第一Type-C電源線</p>
        <p type="p">500:第二Type-C電源線</p>
        <p type="p">1000:電子系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="433px" img-content="tif" inline="yes" orientation="portrait" width="726px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622698</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144632</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F1/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置及其控制方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置及其控制方法。電子裝置之控制方法包括以下步驟。判斷電子裝置是否透過一Type-C連接埠進行一充電或放電程序。判斷一Type-C線正插或反插於Type-C連接埠。控制一第一切換器對Type-C連接埠之一A6引腳、一A7引腳、一B6引腳及一B7引腳進行一USB2.0路徑與一接地路徑的切換。控制一第二切換器對Type-C連接埠之一A8引腳及一B8引腳進行一電源路徑與一SBU路徑的切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a control method thereof are provided. An electronic device includes the following steps. Whether an electronic device is charged or discharged through a Type-C port is determined. Whether the Type-C cable plugged into the Type-C port is faced up or faced down is determined. A first switch is controlled to switch a A6 pin, a A7 pin, a B6 pin and a B7 pin of the Type-C port between an USB2.0 path and a ground path. A second switch is controlled to switch a A8 pins and a B8 pin of the Type-C port between a power path and an SBU path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S141,S142,S143,S144,S151,S152,S153,S154:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="681px" img-content="tif" inline="yes" orientation="portrait" width="1002px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622483</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144634</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01N21/31</main-classification>
        <further-classification edition="200601120250512B">G02B6/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>逢甲大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田春林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>D形光纖氣體感測器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種D形光纖氣體感測器，包含一光纖、連接於該光纖一端的一光源發射器、連接於該光纖另一端的一光譜儀及與該光譜儀電性連接的一電腦，該光纖上鍍覆有包含複數間隙的一薄膜，當一待測氣體的氣體分子進入該薄膜的複數間隙中時，該薄膜的折射率將發生變化，該光源發射器射入該光纖的光線將在該薄膜發生損耗模態共振，使該光譜儀接收到的光線強度隨之改變，該電腦接收該光譜儀輸出的一光強度檢測數值，並根據一線性模型計算該光強度檢測數值對應的該待測氣體的該氣體檢測濃度，且該光纖具有耐溫、耐濕度、不受電磁波干擾等特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光纖</p>
        <p type="p">10A:感測區段</p>
        <p type="p">11:第一端</p>
        <p type="p">12:第二端</p>
        <p type="p">20:光源發射器</p>
        <p type="p">30:光譜儀</p>
        <p type="p">40:電腦</p>
        <p type="p">50:量測腔體</p>
        <p type="p">51:底座</p>
        <p type="p">52:進氣口</p>
        <p type="p">70:顯示器</p>
        <p type="p">D1:光強度檢測數值</p>
        <p type="p">D2:氣體檢測濃度</p>
        <p type="p">G:待測氣體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="590px" img-content="tif" inline="yes" orientation="portrait" width="927px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622261</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144641</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241206B">C22C1/02</main-classification>
        <further-classification edition="200601120241206B">C22C21/00</further-classification>
        <further-classification edition="200601120241206B">C22C28/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳榮志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, RONG-ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>管琪芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUAN, CHI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡欣翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHIN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉正同</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪銘祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, MING-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>鋁鈧合金靶材及其製造方法</chinese-title>
        <english-title>ALUMINUM-SCANDIUM ALLOY TARGET MATERIAL AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鋁鈧合金靶材之製造方法，包含以下步驟。分別對第一金屬混合物與第二金屬混合物進行真空熔煉步驟以及霧化步驟，以分別形成第一鋁鈧合金粉體與第二鋁鈧合金粉體，其中第一鋁鈧合金粉體之鈧含量大於35.7重量百分比，且第二鋁鈧合金粉體之鈧含量小於35.7重量百分比。然後，再對第一鋁鈧合金粉體與第二鋁鈧合金粉體進行乾式混粉步驟以及成型及緻密化步驟，以形成鋁鈧合金靶材。本發明的鋁鈧合金靶材具有純度高、密度高、氧含量低及加工性佳之優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of an aluminum-scandium alloy target material includes the following steps. A first metal mixture and a second metal mixture are respectively subjected to a vacuum melting step and an atomization step to form a first aluminum-scandium alloy powder and a second aluminum-scandium alloy powder, respectively, in which a scandium content of the first aluminum-scandium alloy powder is greater than 35.7 weight percent, and a scandium content of the second aluminum-scandium alloy powder is less than 35.7 weight percent. Then, the first aluminum-scandium alloy powder and the second aluminum-scandium alloy powder are subjected to a dry mixing step and a shaping and densification step to form the aluminum-scandium alloy target material. The aluminum-scandium alloy target material of the present invention has the advantages of high purity, high density, low oxygen content, and good processability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110,120,130,140,150:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="647px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622689</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144647</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">G06F1/20</main-classification>
        <further-classification edition="200601120250123B">H05K7/20</further-classification>
        <further-classification edition="200601120250123B">G05D7/06</further-classification>
        <further-classification edition="200601120250123B">G05D13/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS,INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>房子陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, ZIHYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何竑逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, HONG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, REN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊勝鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHENG-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>冷卻液分配裝置控制系統及其控制方法</chinese-title>
        <english-title>CONTROL SYSTEM FOR COOLING DISTRIBUTION UNIT AND CONTROL METHOD FOR CDU GROUP FLOW CONTROL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種冷卻液分配裝置(Cooling Distribution Unit, CDU)控制方法，應用於至少由第一CDU及第二CDU組成一個群組的CDU控制系統，並且包括：偵測處於靜止狀態的第二CDU；由群組中任一CDU透過通訊線路輸出低轉速指令至第一CDU及第二CDU，以指示第一CDU及第二CDU運作於第二轉速 ，其中第二轉速低於第一CDU原本運作的第一轉速；以及，於判斷第一CDU及第二CDU皆運作於第二轉速達到一預設時間時，群組中任一CDU透過通訊線路發出目標流量指令至第一CDU及第二CDU，以指示第一CDU及第二CDU分別輸出目標流量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control method for cooling distribution unit (CDU) is disclosed. The control method is applied to a CDU control system having a group at least including a first CDU and a second CDU, and includes following steps: detecting the second CDU of a resting state; sending a low rotation-speed command to the first CDU and the second CDU to indicate both of the first and second CDUs to operate at a second rotation speed, wherein the second rotation speed is slower than a first rotation speed at which the first CDU currently operated; and, when determining both of the first and second CDUs to be operating at the second rotation speed for a preset time length, sending a target flow command to the first CDU and the second CDU to indicate both of the first and second CDUs to operate and output a target flow of colling liquid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S51~S54:控制步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="741px" img-content="tif" inline="yes" orientation="portrait" width="707px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622879</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144653</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120241231B">G06Q50/06</main-classification>
        <further-classification edition="201301120241231B">G06F21/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏維廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智慧電池裝置及其循環方法、系統</chinese-title>
        <english-title>SMART BATTERY DEVICE AND ITS RECYCLING METHOD AND SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供的智慧電池裝置包括處理模組及電池芯，該處理模組包括：儲存模組，係用於儲存與該電池芯相關的電池履歷，其中，該處理模組用於對該儲存模組進行讀取和寫入；以及加密模組，係利用加密機制對該電池履歷中至少一部分資訊進行加密；該電池芯電性連接且供電至該處理模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides a smart battery device, comprising: a processing module comprising: a storage module configured to store a battery history associated with the battery cell, wherein the processing module is configured to read from and write to the storage module; and an encryption module configured to encrypt at least a portion of the information in the battery history; and a battery cell electrically connected to and supplying power to the processing module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電池裝置</p>
        <p type="p">202:電池芯</p>
        <p type="p">206:微控制器</p>
        <p type="p">208:充電開關</p>
        <p type="p">210:放電開關</p>
        <p type="p">212:保護裝置</p>
        <p type="p">214:次保護晶片</p>
        <p type="p">226:儲存單元</p>
        <p type="p">228:加密模組</p>
        <p type="p">230,232,234:信號</p>
        <p type="p">236:邏輯控制電路</p>
        <p type="p">240:通訊界面</p>
        <p type="p">SMBUS_DATA,SMBUS_CLOCK:通訊匯流排</p>
        <p type="p">BATTERY_ID,SYSTEM_ID:電池識別指示</p>
        <p type="p">P+:正極</p>
        <p type="p">P-:負極</p>
        <p type="p">A,B:節點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="728px" img-content="tif" inline="yes" orientation="portrait" width="1011px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622007</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144657</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241203B">C03B20/00</main-classification>
        <further-classification edition="200601120241203B">C30B33/02</further-classification>
        <further-classification edition="200601120241203B">C30B29/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣晶技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TXC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林承葦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文楷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>單晶石英材料的加工方法</chinese-title>
        <english-title>PROCESSING METHOD OF SINGLE-CRYSTAL QUARTZ MATERIAL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種單晶石英材料的加工方法，包括以下步驟。決定單晶石英材料易產生雙晶之待加工區。使用加熱器對單晶石英材料上的待加工區升溫，使待加工區的加工難度下降。使用雷射在待加工區中已被升溫的部分對石英材料進行加工。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processing method of single-crystal quartz material includes the following steps. Determining an area to be processed where twin crystals are prone to occur on the single-crystal quartz material. Using a heater to heat an area to be processed on the single-crystal quartz material, so that processing difficulty of the area to be processed is reduced. Using a processor to process the single-crystal quartz material in a heated area to be processed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10、S100、S200、S300:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="569px" img-content="tif" inline="yes" orientation="portrait" width="602px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623365</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144658</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250424B">H10B61/00</main-classification>
        <further-classification edition="200601120250424B">G11C16/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王子嵩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZIH-SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏經宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHING YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體裝置及其操作方法</chinese-title>
        <english-title>MEMORY DEVICE AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種記憶體裝置及其操作方法。記憶體裝置包括主磁性隧道接面（MTJ）結構以及參考MTJ結構。主MTJ結構包括第一參考層、自由層以及設置在第一參考層和自由層之間的第一阻障層。參考MTJ結構包括第二參考層、自由層以及設置在第二參考層與自由層之間的第二阻障層。自由層在第一阻障層和第二阻障層之間，且第一參考層的磁取向不同於第二參考層的磁取向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device and an operation method thereof. The memory device includes a major magnetic tunnel junction (MTJ) structure and a reference MTJ structure. The major MTJ structure includes a first reference layer, a free layer and a first barrier layer disposed between the first reference layer and the free layer. The reference MTJ structure includes a second reference layer, the free layer and a second barrier layer disposed between the second reference layer and the free layer. The free layer is between the first barrier layer and the second barrier layer. The magnetic orientation of the first reference layer is different from the magnetic orientation of the second reference layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:記憶體裝置/記憶體單元</p>
        <p type="p">100:第一參考層</p>
        <p type="p">101、141:磁矩</p>
        <p type="p">110:第一阻障層</p>
        <p type="p">120:自由層</p>
        <p type="p">130:第二阻障層</p>
        <p type="p">140:第二參考層</p>
        <p type="p">150:電極</p>
        <p type="p">BL1:第一位元線</p>
        <p type="p">BL2:第二位元線</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">MTJ1:主磁性隧道接面(MTJ)結構/主MTJ結構</p>
        <p type="p">MTJ2:參考MTJ結構</p>
        <p type="p">ST:選擇電晶體</p>
        <p type="p">SL:源極線</p>
        <p type="p">WL:字元線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="554px" img-content="tif" inline="yes" orientation="portrait" width="741px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621644</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144664</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250303B">A61B6/51</main-classification>
        <further-classification edition="201801120250303B">G16H30/40</further-classification>
        <further-classification edition="201801120250303B">G16H30/20</further-classification>
        <further-classification edition="201801120250303B">G16H50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIPEI MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮聖偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, SHENG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>牙科醫病資訊標註輔助系統及其方法</chinese-title>
        <english-title>DENTAL MEDICAL INFORMATION ANNOTATION AUXILIARY SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種牙科醫病資訊標註輔助系統及其方法，牙科圖像輔助診斷裝置依據預先建立好的牙科疾病診斷機器學習模型對患者全口牙齒X光數位圖像進行人工智慧診斷分析以生成輔助診斷結果資訊，輔助意見生成裝置自牙科圖像輔助診斷裝置接收輔助診斷結果資訊，輔助意見生成裝置依據輔助診斷說明資訊中的關鍵字詞資訊自輔助意見資料庫查詢出對應的輔助意見資訊生成輔助意見顯示資訊，輔助意見生成裝置提供輔助意見顯示資訊至牙科圖像輔助診斷裝置，牙科圖像輔助診斷裝置將輔助診斷結果資訊以及輔助意見顯示資訊標註於患者全口牙齒X光數位圖像呈現顯示，藉此可以達成提供牙科醫師進行診斷與治療的輔助與提供患者了解病情的目的的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dental medical information annotation auxiliary system and a method thereof are provided. Patient whole mouth teeth digital X-ray image is diagnosed and analyzed using AI according to pre-built dental disease diagnosis machine learning model to generate auxiliary diagnostic result information by dental image-assisted diagnosis device. Auxiliary diagnostic result information is received by auxiliary opinion generated device from dental image-assisted diagnosis device. Auxiliary opinion information is inquired from auxiliary opinion database according to key word information in auxiliary diagnosis information to generate auxiliary opinion display information by auxiliary opinion generating device. Auxiliary opinion display information is received by dental image-assisted diagnosis device from auxiliary opinion generating device. Auxiliary diagnostic result information and auxiliary opinion display information are marked and displayed on patient whole mouth teeth digital X-ray image by dental image-assisted diagnosis device. Therefore, the efficiency of providing assistant to dentist in diagnosis and treatment and providing purpose of patient understanding condition may be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:牙科全口數位X光機</p>
        <p type="p">20:牙科圖像輔助診斷裝置</p>
        <p type="p">21:第一非暫態計算機可讀儲存媒體</p>
        <p type="p">22:第一硬體處理器</p>
        <p type="p">30:輔助意見生成裝置</p>
        <p type="p">31:第二非暫態計算機可讀儲存媒體</p>
        <p type="p">32:第二硬體處理器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="904px" img-content="tif" inline="yes" orientation="portrait" width="571px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622207</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144665</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">C09K5/06</main-classification>
        <further-classification edition="200601120241230B">F24F13/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳穗祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳穗祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>優態鹽之製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一般優態(Eultectic Salts)在多次使用後，會因內含元素之分離產生吸放熱性能衰減及過冷度之現象；</p>
        <p type="p">本創作使用0.01mm~50mm之奈米金屬粉，其強力的「凡得瓦力」(Van der Waals force)中的取向力(偶極-偶極力(dipole-dipole force))及誘導力(偶極-誘發偶極力(dipole-induced dipole force))促使優態鹽內各元素分子間，經由奈米金屬粉之「凡得瓦力」及「離子鍵」(ionic bond)產生連結，而改善由於多次使用後結晶再熔化的反復過程，致各元素產生分離，而降低吸放熱性能及產生過冷度之現象。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">101:水</p>
        <p type="p">102:優態鹽材料</p>
        <p type="p">103:奈米金屬粉</p>
        <p type="p">104:奈米粒子優態鹽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="327px" img-content="tif" inline="yes" orientation="portrait" width="687px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623139</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144672</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">H02G1/02</main-classification>
        <further-classification edition="200601120250123B">H01B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣電力股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝治均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖苡均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴建業</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃銘宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董群驥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具複合式成型紮線之架空配電線路的固定架構及其複合式成型紮線結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種具複合式成型紮線之架空配電線路的固定架構及其複合式成型紮線結構，該架空配電線路的固定架構包括一礙子、一高壓被覆線與一複合式成型紮線結構，其中，該複合式成型紮線結構的紮線體會綑綁至該礙子，並會纏繞至該高壓被覆線上，以使該高壓被覆線與該礙子相固定，且繞設於該高壓被覆線上的相鄰兩紮圈，彼此之間的紮距為45毫米至70毫米間；又，該紮線體至少包含一內部支撐層與一外部屏蔽層，且該內部支撐層不具導電性，該外部屏蔽層則具有半導電性，如此，透過該複合式成型紮線結構之設計，能夠解決電位梯度過大的問題，並防止斷線事故的發生，還能穩定電場分布以及減少電暈現象，進而延長高壓被覆線的使用壽命，提升架空配電線路的安全性與可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:紮線體</p>
        <p type="p">10:紮圈</p>
        <p type="p">2:絕緣套</p>
        <p type="p">4:礙子</p>
        <p type="p">5:高壓被覆線</p>
        <p type="p">G:紮距</p>
        <p type="p">C:橫擔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="620px" img-content="tif" inline="yes" orientation="portrait" width="988px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623320</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144679</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">H05K1/03</main-classification>
        <further-classification edition="200601120250123B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米豊米科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MLMTEK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電路板結構</chinese-title>
        <english-title>CIRCUIT BOARD STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板結構，分為元件承載區和線路區，該電路板結構包括玻璃基板、導電線路、底板、流體通道、以及導熱通孔。導電線路設置於玻璃基板的頂面，且在該元件承載區和該線路區內連續分布。底板設置於玻璃基板的底面，且接觸該底面。流體通道設置於玻璃基板或底板內，並分布於線路區和元件承載區中，一端連通冷卻液入口，另一端連通冷卻液出口，用於使一冷卻液在其中流通。多個導熱通孔設置於元件承載區的玻璃基板內，自玻璃基板的頂面向玻璃基板的底面延伸，且和流體通道之間相鄰且相互分離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board structure, comprising a device mounting region and a conductive line region, and the circuit board structure includes a glass substrate, conductive lines, a base plate, a fluid channel, and thermal vias. The conductive lines are disposed on the top surface of the glass substrate and continuously distributed within both the device mounting region and the conductive line region. The base plate is disposed on the bottom surface of the glass substrate and in contact with the bottom surface. The fluid channel is disposed within the glass substrate or base plate, distributed across the conductor region and device mounting region, with one end in fluid communication with a coolant inlet and another end in fluid communication with a coolant outlet, and is used for allowing coolant to flow through. The multiple thermal vias are disposed in the glass substrate of the device mounting region, extending from the top surface of the glass substrate to the bottom surface of the glass substrate, and are disposed adjacent to but separated from the fluid channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:俯視</p>
        <p type="p">10A:電路板結構</p>
        <p type="p">100:玻璃基板</p>
        <p type="p">101、201:頂面</p>
        <p type="p">102:底面</p>
        <p type="p">105:指狀突出部</p>
        <p type="p">120:導電通孔</p>
        <p type="p">140:流體通道</p>
        <p type="p">141:冷卻液入口</p>
        <p type="p">142:冷卻液出口</p>
        <p type="p">143:淺溝槽</p>
        <p type="p">145:彎曲部</p>
        <p type="p">160:導熱通孔</p>
        <p type="p">161:頂端</p>
        <p type="p">162:底端</p>
        <p type="p">200:底板</p>
        <p type="p">300:導電線路</p>
        <p type="p">600:電子元件</p>
        <p type="p">D1:距離</p>
        <p type="p">M:元件承載區</p>
        <p type="p">L:線路區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="735px" img-content="tif" inline="yes" orientation="portrait" width="771px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621940</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144681</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250507B">B62M9/10</main-classification>
        <further-classification edition="200601120250507B">B62M9/16</further-classification>
        <further-classification edition="200601120250507B">F16H55/12</further-classification>
        <further-classification edition="200601120250507B">F16H55/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒲田建二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMADA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>人力驅動車用的鏈輪總成</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供人力驅動車用的鏈輪總成，其變速響應優良、變速衝擊較小、並且、可滑順地進行升檔變速及降檔變速。        &lt;br/&gt;[解決手段]12T鏈輪包含：12T主升檔開始齒，被構成為在主升檔動作及主升檔鏈相位中，最初地從驅動鏈解除嚙合；12T輔助升檔開始齒，被構成為在輔助升檔動作及輔助升檔鏈相位中，最初地從驅動鏈解除嚙合；12T主降檔開始齒，被構成為在主降檔動作與主降檔鏈相位中，最初地嚙合至驅動鏈；以及12T輔助降檔開始齒，被構成為在輔助降檔動作及輔助降檔鏈相位中，最初地嚙合至驅動鏈。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:鏈輪總成</p>
        <p type="p">34:10T鏈輪</p>
        <p type="p">36:12T鏈輪</p>
        <p type="p">48:10T鏈輪本體</p>
        <p type="p">50:10T鏈輪齒</p>
        <p type="p">50X:10T基準齒</p>
        <p type="p">54:12T鏈輪齒</p>
        <p type="p">54A:驅動面</p>
        <p type="p">54B:非驅動面</p>
        <p type="p">56:12T主升檔促進齒</p>
        <p type="p">58:12T輔助升檔促進齒</p>
        <p type="p">60:12T主降檔促進齒</p>
        <p type="p">62:12T輔助降檔促進齒</p>
        <p type="p">64:12T主升檔最終嚙合齒</p>
        <p type="p">66:12T主升檔開始齒</p>
        <p type="p">68:12T主升檔凹齒</p>
        <p type="p">70:12T輔助升檔最終嚙合齒</p>
        <p type="p">72:12T輔助升檔開始齒</p>
        <p type="p">74:12T輔助升檔凹齒</p>
        <p type="p">76:12T主降檔開始齒</p>
        <p type="p">78:12T主降檔凹齒</p>
        <p type="p">80:12T主鄰接齒</p>
        <p type="p">82:12T輔助降檔開始齒</p>
        <p type="p">84:12T輔助降檔凹齒</p>
        <p type="p">86:12T輔助鄰接齒</p>
        <p type="p">T1:驅動旋轉方向</p>
        <p type="p">T2:非驅動旋轉方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10034.png" file="d10034.TIF" giffile="ed10034.png" height="731px" img-content="tif" inline="yes" orientation="portrait" width="649px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621607</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144683</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A47B96/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川湖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE WORKS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊順和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>托架總成</chinese-title>
        <english-title>BRACKET ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種托架總成包含一第一托架、一第二托架、一齒排、一工作件以及一操作件。該第一托架安排有一第一安裝件；該第二托架可相對該第一托架位移，且該第二托架安排有一第二安裝件；該齒排安排至該第一托架；該工作件安排至該第二托架，該工作件用以卡掣至該齒排；當該工作件卡掣至該齒排時，該第一托架只能相對該第二托架往一第一方向位移，而該第二托架只能相對該第一托架往相反該第一方向的一第二方向位移，使該第一安裝件與該第二安裝件之間從定義一第一長度被調整至一第二長度；該操作件用以驅動該工作件從該齒排解掣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bracket assembly includes a first bracket, a second bracket, a toothed bar, a working member and an operating member. The first bracket is arranged with a first mounting member. The second bracket is movable relative to the first bracket and is arranged with a second mounting member. The toothed bar is arranged at the first bracket. The working member is arranged at the second bracket and is configured to engaged with the toothed bar. When the working member is engaged with the toothed bar, the first bracket can only be moved in a first direction relative to the second bracket while the second bracket can only be moved in a second direction opposite to the first direction relative to the first bracket such that a first length between the first mounting member and the second mounting member can be adjusted to a second length. The operating member is configure to disengage the working member from the toothed bar.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:托架總成</p>
        <p type="p">22:第一托架</p>
        <p type="p">22a,24a:第一端</p>
        <p type="p">22b,24b:第二端</p>
        <p type="p">24:第二托架</p>
        <p type="p">32:操作件</p>
        <p type="p">34:第一安裝件</p>
        <p type="p">36a,46a:第一牆</p>
        <p type="p">36b,46b:第二牆</p>
        <p type="p">38,48:縱向牆</p>
        <p type="p">52:連接孔</p>
        <p type="p">44:第二安裝件</p>
        <p type="p">62:操作部</p>
        <p type="p">68:第一長孔</p>
        <p type="p">72:第一連接特徵</p>
        <p type="p">76:支撐件</p>
        <p type="p">80:彈性件</p>
        <p type="p">82:復歸彈性件</p>
        <p type="p">88:預定孔</p>
        <p type="p">90:對應孔</p>
        <p type="p">L1:第一側</p>
        <p type="p">L2:第二側</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="657px" img-content="tif" inline="yes" orientation="portrait" width="1006px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621762</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144687</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A63B22/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡育倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡育倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>更具吸震緩衝效能之多功能軟跑板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種更具吸震緩衝效能之多功能軟跑板，係主要由一支撐板頂面依序向上相互貼合有較小長、寬度之一軟質吸震層及一柔性耐磨層，該軟質吸震層之頂面縱向由前至後形成有下斜向平面，並將二柔性金屬導熱箔條以縱向貼合於該軟質吸震層與柔性耐磨層之間、或該軟質吸震層與支撐板之間後，且以其前、後端底面貼合於該支撐板頂面，而二該柔性金屬導熱箔條係為銅箔、或鋁箔材質，且其縱向長度介於該柔性耐磨層與軟質吸震層之間，並使該柔性耐磨層同時貼合在該支撐板上並完全覆蓋住二該柔性金屬導熱箔條與軟質吸震層；藉此，當運動者踩踏跑步機跑板時，跑板同時具有更佳之緩衝避震、導流散熱、以及耐磨的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:支撐板</p>
        <p type="p">20:軟質吸震層</p>
        <p type="p">30:柔性耐磨層</p>
        <p type="p">40:柔性金屬導熱箔條</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="963px" img-content="tif" inline="yes" orientation="portrait" width="604px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623453</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144689</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10D88/00</main-classification>
        <further-classification edition="202601120260303B">H10D80/30</further-classification>
        <further-classification edition="202601120260303B">H10W90/00</further-classification>
        <further-classification edition="202601120260303B">H10W70/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鯨鏈科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHALECHIP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>台北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亞東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YA-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　惠禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, HUEY-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪慶煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHING-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>三維半導體裝置</chinese-title>
        <english-title>THREE-DIMENSION SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種三維半導體裝置，包括第一邏輯電路、第一傳送器及第一接收器。第一邏輯電路配置於第一電路層。第一傳送器配置於第一電路層，用以接收來自第一邏輯電路的第一數位訊號，並輸出第一類比訊號。第一接收器配置於第一電路層，用以接收來自第二電路層的第二類比訊號，並將第二類比訊號轉換為第二數位訊號後傳送至第一邏輯電路。其中，第一類比訊號及第二類比訊號為高頻類比訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to a three-dimensional semiconductor device comprising a first logic circuit, a first transmitter and a first receiver. The first logic circuit is disposed on the first circuit layer. The first transmitter is disposed on the first circuit layer for receiving a first digital signal from the first logic circuit and outputting a first analog signal. The first receiver is disposed on the first circuit layer for receiving a second analog signal from a second circuit layer and converting the second analog signal into a second digital signal transmitted to the first logic circuit. The first analog signal and the second analog signal are high-frequency analog signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:三維半導體裝置</p>
        <p type="p">10:連接柱</p>
        <p type="p">100:第一電路層</p>
        <p type="p">110:邏輯電路組</p>
        <p type="p">111:第一邏輯電路</p>
        <p type="p">112:第一傳送器</p>
        <p type="p">113:第一接收器</p>
        <p type="p">200:第二電路層</p>
        <p type="p">210:邏輯電路組</p>
        <p type="p">211:第二邏輯電路</p>
        <p type="p">212:第二傳送器</p>
        <p type="p">213:第二接收器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="882px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622994</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144690</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120241230B">G16H50/20</main-classification>
        <further-classification edition="201801120241230B">G16H30/00</further-classification>
        <further-classification edition="200601120241230B">A61B8/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彰化基督教醫療財團法人彰化基督教醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝聰哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>應用超音波影像以人工智慧偵測胎兒腦部異常之輔助辨識系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用超音波影像以人工智慧偵測胎兒腦部異常之輔助辨識系統，其可用於當超音波影像模糊與局部解剖特徵較不明顯的狀況下，利用人工智慧技術處理胎兒超音波影像的輔助辨識系統與方法，可有效提升卷積神經網路對重要胎兒發育關鍵解剖位置的辨識效能，進一步降低臨床醫師判讀的負擔，以提高胎兒發育異常判讀工作的準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:階層式解剖區域偵測模組</p>
        <p type="p">20:關鍵組織偵測模組</p>
        <p type="p">30:關鍵解剖標記點偵測模組</p>
        <p type="p">40:生物量測模組</p>
        <p type="p">50:異常發育判讀模組</p>
        <p type="p">100:胎兒超音波檢查報告書</p>
        <p type="p">P1:胎兒小腦平面超音波影像</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="704px" img-content="tif" inline="yes" orientation="portrait" width="939px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622708</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144702</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120241209B">G06F3/0362</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達方電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARFON ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇振畇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHEN-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>滑鼠</chinese-title>
        <english-title>MOUSE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑鼠包含滾輪、導電的轉動軸、第一永磁元件、第二永磁元件、電路板、導電的第一連接元件、導電的第二連接元件以及控制器。滾輪係以轉動中心套合於轉動軸上。第一永磁元件係電性接合於轉動軸的第一末端上。第二永磁元件係電性接合於轉動軸的第二末端上。第一連接元件係電性接合於電路板上且電性接觸第一永磁元件。第二連接元件係電性接合於電路板上且電性接觸第二永磁元件。控制器回應關於滾輪之轉動脈衝訊號以及命令訊號沿第一電流方向或第二電流方向或交替地沿第一電流方向與第二電流方向傳輸電流進而驅動滾輪基於電流轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mouse includes a roller wheel, a conductive rotary shaft, a first permanent magnetic device, a second permanent magnetic device, a circuit board, a conductive first linking device, a conductive second linking device, and a controller. The roller wheel is fitted with a rotary center thereof on the rotary shaft. The first permanent magnetic device is electrically connected to a first end of the rotary shaft. The second permanent magnetic device is electrically connected to a second end of the rotary shaft. The first linking device is electrically connected to the circuit board and electrically contacts the first permanent magnetic device. The second linking device is electrically connected to the circuit board and electrically contacts the second permanent magnetic device. The controller, responsive to the rotation pulses associated with the roller wheel and the command signals, transmits a current in the first current direction or the second current direction or alternately in the first current direction and the second current direction to drive the roller wheel to rotate based on the current.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:滑鼠</p>
        <p type="p">104:下殼體</p>
        <p type="p">12:滾輪</p>
        <p type="p">120:轉動中心</p>
        <p type="p">14:轉動軸</p>
        <p type="p">144:第二末端</p>
        <p type="p">18:第二永磁元件</p>
        <p type="p">20:電路板</p>
        <p type="p">24:第二連接元件</p>
        <p type="p">242:第二主體</p>
        <p type="p">244:第二抵接部</p>
        <p type="p">26:控制器</p>
        <p type="p">28:滾輪支架</p>
        <p type="p">284:第二側</p>
        <p type="p">288:第二支撐台</p>
        <p type="p">30:第一緩衝片</p>
        <p type="p">32:第二緩衝片</p>
        <p type="p">34:限制構件</p>
        <p type="p">36:彈簧</p>
        <p type="p">38:開關</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="805px" img-content="tif" inline="yes" orientation="portrait" width="780px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621811</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144703</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B21B37/16</main-classification>
        <further-classification edition="200601120241230B">B21B1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成機工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐特異機電有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊燿榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉先本</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>非對稱型鋼的成形設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一非對稱型鋼的成形設備包括一生產線和一工業電腦；該生產線中朝一第一方向延伸的一底座上設有能活動的一第一車壁和一第二車壁；該第一車壁連接一第一車壁驅動組，該第二車壁連接一第二車壁驅動組，且沿著該第一方向設置的多個型鋼成形組係於該第一車壁和該第二車壁之間形成供一鋼板成形通過的一成形空間；該工業電腦的一處理器根據一記憶體所存有一程控參數表中的複數第一車壁參數驅動該生產線中的該第一車壁驅動組移動，和根據該程控參數表中的複數第二車壁參數驅動該生產線中的該第二車壁驅動組移動；所述兩車壁可獨立的受控成形鋼材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:生產線</p>
        <p type="p">2:工業電腦</p>
        <p type="p">3:外部裝置</p>
        <p type="p">10:處理器</p>
        <p type="p">20:記憶體</p>
        <p type="p">30:人機介面</p>
        <p type="p">40:蜂鳴器</p>
        <p type="p">50:通訊介面</p>
        <p type="p">301:第一車壁驅動組</p>
        <p type="p">302:第二車壁驅動組</p>
        <p type="p">341:第一傳動裝置</p>
        <p type="p">342:第二傳動裝置</p>
        <p type="p">351:第一感測器</p>
        <p type="p">352:第二感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="657px" img-content="tif" inline="yes" orientation="portrait" width="952px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622604</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144719</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241226B">G02C5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>占暉光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳天恕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯志緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>眼鏡</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種眼鏡，包含一鏡片、一鏡架、二設置於該鏡架上的快拆機構，及二鏡腳。該鏡片包括一片體部，及二由該片體部凸伸的卡制部。每一卡制部開設出一穿槽。每一快拆機構包括一樞接於該鏡架的限位件，及一樞接於該限位件的鎖扣件。該限位件可受操作而在一鎖定位置及一解鎖位置間偏擺。當該限位件位於該鎖定位置時，該鎖扣件有部分穿伸通過相對應穿槽並卡制於該卡制部上，以將該鏡片固定於該鏡架上。當該限位件位於該解鎖位置時，該鎖扣件由該穿槽移出且不再卡制於該卡制部上，使該鏡片可由該鏡架上移除，操作簡單而具便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:鏡片</p>
        <p type="p">21:片體部</p>
        <p type="p">211:退讓空間</p>
        <p type="p">22:卡制部</p>
        <p type="p">221:穿槽</p>
        <p type="p">3:鏡架</p>
        <p type="p">31:主框架</p>
        <p type="p">311:嵌槽</p>
        <p type="p">32:側端架</p>
        <p type="p">321:殼壁部</p>
        <p type="p">322:凸接部</p>
        <p type="p">323:端頭部</p>
        <p type="p">324:內部空間</p>
        <p type="p">325:扣槽</p>
        <p type="p">326:定位槽</p>
        <p type="p">4:快拆機構</p>
        <p type="p">41:限位件</p>
        <p type="p">42:鎖扣件</p>
        <p type="p">5:鏡腳</p>
        <p type="p">51:支架</p>
        <p type="p">52:配戴墊件</p>
        <p type="p">6:鼻墊</p>
        <p type="p">61:組接件</p>
        <p type="p">62:墊體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="904px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622605</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144720</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241226B">G02C5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>占暉光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳天恕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳彥廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯志緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>眼鏡</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種眼鏡，包含一個在兩側各自設有一穿槽的鏡片、二分別可拆離地設置於該鏡片上的快拆機構，及二分別設置於該等快拆機構上的鏡腳。每一快拆機構包括一側殼座、一樞設於該側殼座內的鎖扣件，及一個兩端分別頂抵該側殼座及該鎖扣件的彈簧。該鎖扣件具有一延伸板部、二由該延伸板部的上下兩側朝外延伸並樞設於該側殼座上的樞軸部，及一由該延伸板部的前端朝外凸伸的鉤扣部。該彈簧推頂該延伸板部以使該鉤扣部伸置於該穿槽中而鉤設該鏡片。使用者可透過按壓該延伸板部使該鉤扣部移出該穿槽，從而將該快拆機構由該鏡片上拆除，達到快速拆換該鏡片之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:鏡片</p>
        <p type="p">21:片體部</p>
        <p type="p">211:退讓空間</p>
        <p type="p">22:卡制部</p>
        <p type="p">221:穿槽</p>
        <p type="p">3:快拆機構</p>
        <p type="p">31:側殼座</p>
        <p type="p">311:設置空間</p>
        <p type="p">312:殼壁部</p>
        <p type="p">313:凸榫部</p>
        <p type="p">314:端頭部</p>
        <p type="p">315:嵌槽</p>
        <p type="p">316:定位槽</p>
        <p type="p">32:鎖扣件</p>
        <p type="p">321:延伸板部</p>
        <p type="p">322:樞軸部</p>
        <p type="p">323:鉤扣部</p>
        <p type="p">325:定位板部</p>
        <p type="p">33:彈簧</p>
        <p type="p">4:鏡腳</p>
        <p type="p">41:支架</p>
        <p type="p">42:配戴墊件</p>
        <p type="p">5:鼻墊</p>
        <p type="p">51:組接件</p>
        <p type="p">52:墊體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="755px" img-content="tif" inline="yes" orientation="portrait" width="1013px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621944</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144721</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120250423B">B64F5/60</main-classification>
        <further-classification edition="200601120250423B">G01M9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鞍機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDEN SADDLE MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭明秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃睿廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>場域模擬設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種場域模擬設備，包含一場域裝置、一送風模組及一模擬模組。場域裝置包括一入口、一相反於該入口的出口及多個在該入口及該出口之間彼此接合的容置管。該等容置管分別界定出多個場域，該等容置管具有一第一容置管及一第二容置管，該等場域具有一第一場域及一第二場域。送風模組可活動地設置於該場域裝置的出口。模擬模組包括多個分別設置於該等容置管的模擬裝置，該等模擬裝置具有一第一模擬裝置及多個第二模擬裝置，該第一模擬裝置為灑水裝置並設置於該第一容置管內，該等第二模擬裝置為風扇並設置於該第二容置管內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:場域模擬設備</p>
        <p type="p">1:場域裝置</p>
        <p type="p">11:入口</p>
        <p type="p">12:出口</p>
        <p type="p">13:容置管</p>
        <p type="p">13A:第一容置管</p>
        <p type="p">13B:第二容置管</p>
        <p type="p">13C:第三容置管</p>
        <p type="p">13D:第四容置管</p>
        <p type="p">13E:第五容置管</p>
        <p type="p">15:回收單元</p>
        <p type="p">2:送風模組</p>
        <p type="p">21:送風裝置</p>
        <p type="p">22:整流裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="653px" img-content="tif" inline="yes" orientation="portrait" width="1011px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622437</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144722</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F28C1/00</main-classification>
        <further-classification edition="200601120241230B">F28F25/10</further-classification>
        <further-classification edition="200601120241230B">F28F27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鞍機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDEN SADDLE MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭明秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃睿廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>致冷單元及冷卻塔裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種致冷單元及冷卻塔裝置，該冷卻塔裝置包含一隔熱外殼及至少一致冷單元。該致冷單元包括一循環管路及多個散熱層板。該循環管路適用於導引一冷凍劑循環流通。該等散熱層板連接於該循環管路且間隔排列。相鄰的兩個該散熱層板的外表面共同界定出一適用於供流體通過的致冷通道。各該散熱層板的內部中空形成一適用於供該冷凍劑通過的內部空間。其中，當該等內部空間供該冷凍劑通過時，該等散熱層板與該冷凍劑進行熱交換，並在各該散熱層板的外表面形成一冰塊層，使得通過該等致冷通道的該流體的熱能被該等冰塊層吸收而降溫，藉此，達到致冷效能提升的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:致冷單元</p>
        <p type="p">21:支撐框架</p>
        <p type="p">211:框架主體</p>
        <p type="p">212:限位件</p>
        <p type="p">213:吊掛件</p>
        <p type="p">22:循環管路</p>
        <p type="p">221:導入管組件</p>
        <p type="p">222:導出管組件</p>
        <p type="p">23:散熱層板</p>
        <p type="p">24:致冷通道</p>
        <p type="p">25:散熱管組合體</p>
        <p type="p">251:散熱管件</p>
        <p type="p">252:下連接板</p>
        <p type="p">253:上連接板</p>
        <p type="p">26:側致冷空間</p>
        <p type="p">X:前後方向</p>
        <p type="p">Y:左右方向</p>
        <p type="p">Z:上下方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="839px" img-content="tif" inline="yes" orientation="portrait" width="691px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622428</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144726</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250218B">F24F11/63</main-classification>
        <further-classification edition="201801120250218B">F24F11/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣松下電器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA ELECTRIC (TAIWAN) CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯信宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>商店空調設定溫度限制系統及其控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種商店空調設定溫度限制系統及其控制方法，適用設置於一商店且訊號連接一氣象資料庫。該商店空調設定溫度限制系統包含至少一溫度感測裝置、至少一空調裝置及一處理裝置。該空調裝置包括一操作面板、一空調單元及一控制單元，該操作面板用於生成一空調設定溫度值。該處理裝置包括一深度迴歸模型，該處理裝置用於令該深度迴歸模型生成一下限溫度值與一上限溫度值，該控制單元用於控制接續生成的該空調設定溫度值不得小於該下限溫度值或不得大於該上限溫度值。本發明得以在實現節能減碳之前提下，令該商店的內部溫度介於舒適的範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:溫度感測裝置</p>
        <p type="p">2:空調裝置</p>
        <p type="p">21:操作面板</p>
        <p type="p">22:空調單元</p>
        <p type="p">23:控制單元</p>
        <p type="p">3:處理裝置</p>
        <p type="p">31:深度迴歸模型</p>
        <p type="p">8:商店</p>
        <p type="p">9:氣象資料庫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="649px" img-content="tif" inline="yes" orientation="portrait" width="981px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622742</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144732</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F11/30</main-classification>
        <further-classification edition="201901120250303B">G06F16/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華南商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA NAN COMMERCIAL BANK, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡文鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEN CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>資料庫監控方法及系統</chinese-title>
        <english-title>DATABASE MONITORING METHOD AND SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資料庫監控方法，包括：藉由第一伺服器於第一時間點執行第一批次檔以第一預設條件查詢第一伺服器內的資料庫以產生第一結果檔，藉由第一伺服器於晚於所述第一時間點的第二時間點執行第二批次檔以所述預設條件查詢資料庫以產生第二結果檔，並比較所述第一結果檔及所述第二結果檔以產生第三結果檔，以及藉由第二伺服器的Nagios監控模組根據所述第三結果檔產生通知訊號，並透過監控介面輸出所述通知訊號。一種資料庫監控系統，包含第一伺服器及第二伺服器，其中第一伺服器包含處理器及資料庫，第二伺服器連接於第一伺服器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A database monitoring method, comprising: using a first server to execute a first batch file at a first time point to query a database within the first server under preset conditions to generate a first result file, using the first server to execute a second batch file at a second time point later than the first time point to query the database to generate a second result file, comparing the first result file and the second result file to produce a third result file, generating a notification signal by a Nagios module of a second server based on the third result file, and outputting the notification signal via a monitoring interface to execute a monitoring tool and obtain multiple conditional statements corresponding to the second result file. A database monitoring system includes a first server and a second server, wherein the first server includes a processor and a database, and the second server is connected to the first server.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101,S103,S105:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="491px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621647</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144733</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241210B">A61B17/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敏瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敏瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>新型咬口器</chinese-title>
        <english-title>NEW TYPE BITE BLOCK</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種新型咬口器，其包括具有穿孔之護齒件以及設於該護齒件之前側且連通該穿孔之套管，藉由該套管連通該穿孔，以供氣管內管穿設其中並進入使用者之口腔內，使用時，該護齒件位於該使用者之上下顎之間，可供該使用者含咬，俾於該使用者發生牙關緊閉反射時，可達到避免該使用者發生牙齒搖動斷裂之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a new type bite block, which includes a mouthguard with a perforation and a sleeve located on the front side of the mouthguard and connected to the perforation. The sleeve is connected to the perforation for an endotracheal tube to pass through and enter a user's oral cavity. When in use, the mouthguard is located between the upper and lower jaws of the user and can be bitten by the user, so as to prevent the user's teeth from being damaged when the user's trismus reflex occurs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:咬口器</p>
        <p type="p">11:護齒件</p>
        <p type="p">12:套管</p>
        <p type="p">A-A:剖面線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="769px" img-content="tif" inline="yes" orientation="portrait" width="618px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622722</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144734</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F3/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威聯通科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QNAP SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李修賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSIU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭法宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, FA-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒲宜謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, YI-CIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>儲存節點、儲存叢集與達成其資料存取加速之方法</chinese-title>
        <english-title>STORAGE NODE, STORAGE CLUSTER AND METHOD FOR ACHIEVING DATA ACCESS ACCELERATION THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種儲存節點、儲存叢集與達成其資料存取加速之方法，其中，該儲存叢集包括複數儲存節點。該達成儲存叢集之資料存取加速之方法係由該儲存叢集中之各該儲存節點的處理器執行，其中，各該儲存節點包括該處理器與複數儲存裝置，且該複數儲存裝置具有至少兩種不同之每秒讀寫次數速度。該達成儲存叢集之資料存取加速之方法包括：根據各該儲存裝置之每秒讀寫次數速度進行評估，以將該複數儲存裝置進行最佳化排序，將原先儲存於複數儲存裝置中該最佳化排序中非最佳化儲存裝置的元資料遷移至該複數儲存裝置中該最佳化排序中最佳化儲存裝置，根據該最佳化排序設定定期或因應突發事件所需之檢測機制，以及，在該檢測機制中，若該最佳化儲存裝置之該每秒讀寫次數速度已降至一閾值，則依據該儲存節點之系統資源，將儲存於該最佳化儲存裝置之該元資料遷回該非最佳化儲存裝置或遷移至該複數儲存裝置中之其他儲存裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A storage node, a storage cluster and a method for achieving accelerating data access thereof are provided, wherein the storage cluster includes a plurality of storage nodes. The method for achieving data access acceleration of the storage cluster is performed by a processor of each of the storage nodes in the storage cluster, wherein each of the storage nodes includes the processor and a plurality of storage device. The storage devices have at least two different speeds of input/output operations per second. The method for achieving data access acceleration of the storage cluster includes: evaluating each storage device according to the speed of input/output operations per second thereof to perform an optimized sorting of the storage devices; migrating metadata previously stored in non-optimized storage devices of the optimized sorting of the storage devices to optimized storage devices of the optimized sorting of the storage devices; setting up a detection mechanism that is periodical or required in response to unexpected events according to the optimized sorting; and, if the speed of input/output operations per second of the optimized storage device has dropped to a critical value, migrating the metadata stored in the optimized storage device of such storage node based on the system resources of such storage node to the optimized storage device of such optimization ranking in the plural storage device; and detection mechanism, if the read/write per second rate of the optimized storage device has dropped to a threshold, migrating the metadata stored in the optimized storage device back to the non-optimized storage device or to another storage device in the storage devices according to system resources of the storage node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21~25:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="702px" img-content="tif" inline="yes" orientation="portrait" width="565px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623638</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144735</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260203B">H10W40/10</main-classification>
        <further-classification edition="202601120260203B">H10W74/10</further-classification>
        <further-classification edition="202601120260203B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>焦嘉振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIAO, CHIA CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子封裝件</chinese-title>
        <english-title>ELECTRONIC PACKAGE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝件，主要在一承載結構上設有一電子元件及一線路結構，並使該線路結構遮蓋該電子元件，其中，該線路結構形成有開口，以令該電子元件外露出該開口，並於該開口內容置一接觸該電子元件之導熱件，以及於該導熱件上設置一散熱結構，以透過該導熱件及該散熱結構提供電子元件散熱路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an electronic package, which includes setting an electronic component and an circuit structure on a carrier structure, and allowing the circuit structure to cover the electronic component, wherein the circuit structure is formed with an opening to expose the electronic component, a thermal conductive element contacting the electronic component is placed in the opening and a heat-dissipating structure is placed on the thermal conductive element to provide a heat dissipation path for the electronic component through the thermal conductive element and the heat-dissipating structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:電子封裝件</p>
        <p type="p">20:承載結構</p>
        <p type="p">20a:第一側</p>
        <p type="p">20b:第二側</p>
        <p type="p">21:電子元件</p>
        <p type="p">210:導電凸塊</p>
        <p type="p">211:主動面</p>
        <p type="p">212:非主動面</p>
        <p type="p">213:底膠</p>
        <p type="p">22:線路結構</p>
        <p type="p">22a:第一表面</p>
        <p type="p">22b:第二表面</p>
        <p type="p">220:開口</p>
        <p type="p">221:第一導電接點</p>
        <p type="p">222:第二導電接點</p>
        <p type="p">223:導電件</p>
        <p type="p">23:導熱件</p>
        <p type="p">230:導熱膠</p>
        <p type="p">24:封裝體</p>
        <p type="p">25:散熱結構</p>
        <p type="p">251:金屬層</p>
        <p type="p">252:絕緣層</p>
        <p type="p">253:金屬凸塊</p>
        <p type="p">26:導電元件</p>
        <p type="p">27:被動模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="399px" img-content="tif" inline="yes" orientation="portrait" width="666px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621924</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144738</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B60T8/1761</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彥豪智能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEKTRO TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃泊憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>液壓調節裝置</chinese-title>
        <english-title>HYDRAULIC PRESSURE ADJUSTMENT DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種液壓調節裝置，包含一殼體、一第一閥組件、一第二閥組件及一驅動件。殼體具有一入油口、一主通道、一出油口及一調壓腔室，入油口及出油口連接於主通道，調壓腔室連接於主通道。第一閥組件可移動地設置於殼體，以阻斷或開啟主通道，而控制入油口及出油口的連通關係。第二閥組件可移動地設置於殼體，以控制主通道與調壓腔室的連通關係。驅動件可活動地設置於殼體，並驅動第一閥組件及第二閥組件分別控制入油口及出油口的連通關係以及主通道與調壓腔室的連通關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hydraulic pressure adjustment device includes a casing, a first valve assembly, a second valve assembly and a driving component. The casing has an inlet, a main channel, an outlet and a pressure adjustment chamber. The inlet and the outlet are connected to the main channel, and the pressure adjustment chamber is connected to the main channel. The first valve assembly is movably disposed on the casing for blocking or opening the main channel so as to control a communication relationship between the inlet and the outlet. The second valve assembly is movably disposed on the casing for controlling a communication relationship between the main channel and the pressure adjustment chamber. The driving component is movably disposed on the casing for simultaneously driving the first valve assembly and the second valve assembly to respectively control the communication relationship between the inlet and the outlet and the communication relationship between the main channel and the pressure adjustment chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:液壓調節裝置</p>
        <p type="p">10:殼體</p>
        <p type="p">11:入油口</p>
        <p type="p">12:主通道</p>
        <p type="p">13:出油口</p>
        <p type="p">14:調壓腔室</p>
        <p type="p">15:第一閥體腔室</p>
        <p type="p">16:第二閥體腔室</p>
        <p type="p">17:容置腔室</p>
        <p type="p">18:旁通腔室</p>
        <p type="p">19:定位部</p>
        <p type="p">20:第一閥組件</p>
        <p type="p">21:第一閥體</p>
        <p type="p">22:第一彈性件</p>
        <p type="p">30:第二閥組件</p>
        <p type="p">31:第二閥體</p>
        <p type="p">32:第二彈性件</p>
        <p type="p">40:驅動件</p>
        <p type="p">41:凹槽</p>
        <p type="p">42:凸緣</p>
        <p type="p">50:彈性復位件</p>
        <p type="p">60:液壓感測器</p>
        <p type="p">70:復原組件</p>
        <p type="p">71:推擠活塞</p>
        <p type="p">72:彈力施加件</p>
        <p type="p">C:中心線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="987px" img-content="tif" inline="yes" orientation="portrait" width="642px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622677</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144740</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250729B">G05D1/686</main-classification>
        <further-classification edition="202401120250729B">G05D1/242</further-classification>
        <further-classification edition="202401120250729B">G05D1/622</further-classification>
        <further-classification edition="202401320250729B">G05D109/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃歆惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自主跟隨機器人導航系統及方法</chinese-title>
        <english-title>AUTONOMOUS FOLLOWING ROBOT NAVIGATION SYSTEM AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種自主跟隨機器人導航系統及方法。所述方法包括：追蹤感測器取得目標相對於機器人的位置及方向角，運算裝置依據位置及方向角計算出環繞目標的虛擬跟隨邊界，光學雷達取得目標附近的障礙物的空間資訊，運算裝置依據空間資訊排除所述虛擬跟隨邊界的多個候選點中的至少一碰撞點，輸入多個候選點至目標函數以產生多個候選值，選擇這些候選值中的最小者對應的一最佳追蹤點，執行局部路徑規劃程序以產生從機器人至最佳追蹤點的最佳路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An autonomous following robot navigation system and method are proposed. The method includes: acquiring the relative position and heading angle of a target with respect to the robot via a tracking sensor; calculating a virtual following boundary around the target based on the position and heading angle using a computing device; obtaining spatial information of obstacles near the target through an optical radar; excluding at least one collision point from multiple candidate points on the virtual following boundary based on the spatial information using the computing device; inputting the multiple candidate points into an objective function to generate multiple candidate values; selecting the best tracking point corresponding to the minimum of these candidate values; and executing a local path planning process to generate the optimal path from the robot to the best tracking point.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S4,S5,S6:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="838px" img-content="tif" inline="yes" orientation="portrait" width="631px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622668</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144741</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250218B">G05D1/43</main-classification>
        <further-classification edition="202401120250218B">G05D1/246</further-classification>
        <further-classification edition="202401120250218B">G05D1/648</further-classification>
        <further-classification edition="202301120250218B">B64U20/00</further-classification>
        <further-classification edition="202301320250218B">B64U101/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於動態視窗演算法的機器人自主導航系統及方法</chinese-title>
        <english-title>ROBOT AUTONOMOUS NAVIGATION SYSTEM AND METHOD BASED ON THE DYNAMIC WINDOW APPROACH</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種基於動態視窗演算法的機器人自主導航系統及方法，所述方法包括：攝影裝置取得環境的深度影像，運算裝置執行物件偵測模型以從深度影像中辨識環境中的多個物件，依據這些物件的間距產生多個聚類，計算機器人與這些聚類之間的多個距離，選擇小於指定距離的至少一聚類計算出噴灑路徑，光學雷達取得環境的感測資料，運算裝置依據感測資料產生成本地圖，執行動態視窗演算法產生多個候選軌跡，輸入噴灑路徑、成本地圖及所述多個候選軌跡至目標函數以產生多個數值，並選擇數值中的最大者對應的候選軌跡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A robot autonomous navigation system and a method based on the Dynamic Window Approach (DWA) are proposed. The method includes: capturing a depth image of an environment by a camera device, executing an object detection model by the computing device to recognize a plurality of objects in the environment from the depth image, generating a plurality of clusters according to a distance between the plurality of objects; calculating a plurality of distances between a robot and the plurality of clusters, selecting at least one cluster within a specified distance to calculate a spraying path; obtaining a sensing data of the environment by a LiDAR, generating a cost map according to the sense data by the computing device; performing the DWA to generate a plurality of candidate paths, inputting the spraying path, the cost map, and the plurality of candidate paths to an object function to generate a plurality of values; and selecting one of the plurality of candidate paths corresponding to the highest value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-S8:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="847px" img-content="tif" inline="yes" orientation="portrait" width="655px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623322</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144742</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250218B">H05K1/11</main-classification>
        <further-classification edition="200601120250218B">H05K3/02</further-classification>
        <further-classification edition="200601120250218B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>景碩科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINSUS INTERCONNECT TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍國興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, KUO-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉弘晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUNG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泰均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TAI-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電路板結構及其製作方法</chinese-title>
        <english-title>CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板結構，包含絕緣層、填孔金屬層以及線路層。絕緣層開設有複數個開口。填孔金屬層填入於開口中。線路層設置於絕緣層上的表面上，且包含複數個線路圖案。線路圖案的一部分與填孔金屬層連接，線路層與填孔金屬層的連接處具有材料交界面。絕緣層上的線路圖案的高低差小於6μm且不均勻度小於18%。透過兩階段電鍍的方式，能有效地改善對體積差異產生的翹曲，使得線路圖案盡可能達到銅厚度一致。進而能夠符合設計、避免阻抗的提升，有助於提升產品的電性質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board structure includes an insulating layer, a hole-filling metal layer and a circuit layer. The insulation layer is provided with a plurality of openings. The hole-filling metal layer is filled in the opening. The circuit layer is disposed on the surface of the insulating layer and includes a plurality of circuit patterns. A part of the circuit pattern is connected to the hole-filling metal layer, and the connection between the circuit layer and the hole-filling metal layer has a material interface. The height difference of the circuit patterns on the insulating layer is less than 6μm, and the non-uniformity is less than 18%. Through two-stage electroplating, the warpage caused by volume differences can be effectively improved, and making the circuit pattern as consistent as possible in copper thickness. Furthermore, it can comply with the design and avoid an increase in impedance, which helps to improve the electrical properties of the product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電路板結構</p>
        <p type="p">10:絕緣層</p>
        <p type="p">11:開口</p>
        <p type="p">13:表面</p>
        <p type="p">20:填孔金屬層</p>
        <p type="p">25:材料交界面</p>
        <p type="p">30:線路層</p>
        <p type="p">31:線路圖案</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="346px" img-content="tif" inline="yes" orientation="portrait" width="569px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622215</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144743</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">C09K11/54</main-classification>
        <further-classification edition="200601120250303B">C09K11/02</further-classification>
        <further-classification edition="201101120250303B">B82Y20/00</further-classification>
        <further-classification edition="201101120250303B">B82Y40/00</further-classification>
        <further-classification edition="200601120250303B">G01N21/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫新宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, HSIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘富川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, FU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江家慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIA-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐易廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林暐庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-TIMG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於汞離子檢測生物凝膠材料及其操作方法</chinese-title>
        <english-title>MERCURY ION DETECTING BIOGEL MATERIAL AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於汞離子檢測生物凝膠材料之操作方法包含：製備一凝膠材料；製備一量子點材料；將該凝膠材料及量子點材料進行混合，以形成一含量子點之螢光凝膠材料，且該含量子點之螢光凝膠材料具有可放射一螢光強度；及將該含量子點之螢光凝膠材料置於一待測樣本時，於該待測樣本中一汞離子濃度導致該含量子點之螢光凝膠材料產生一螢光強度變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mercury iron detecting biogel material includes: prefabricating a gel material; prefabricating a QD material; mixing the gel material and the QD material to form a QD-contained fluorescent gel material, with the QD-contained fluorescent gel material capable of emitting a fluorescent intensity; and supplying the QD-contained fluorescent gel material to a unknown sample, with a mercury ion contained in the unknown sample causing the QD-contained fluorescent gel material to generate a change of fluorescent intensity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:含量子點之螢光凝膠材料</p>
        <p type="p">11:凝膠材料</p>
        <p type="p">12:量子點材料</p>
        <p type="p">2:待測樣本</p>
        <p type="p">3:紫外光</p>
        <p type="p">30:螢光</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="403px" img-content="tif" inline="yes" orientation="portrait" width="603px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622499</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144744</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250512B">G01N33/205</main-classification>
        <further-classification edition="200601120250512B">G01N21/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江家慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIA-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫新宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, HSIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘富川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, FU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐易廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳郁晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>汞離子檢測之感測器及其方法</chinese-title>
        <english-title>MERCURY ION DETECTION SENSOR DEVICE AND SENSING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種汞離子檢測之感測方法包含：提供一感測元件，並製備一凝膠材料及一量子點材料，且該量子點材料具有一螢光特性，並將該凝膠材料及量子點材料進行混合，以形成一含量子點之螢光凝膠材料，且該含量子點之螢光凝膠材料具有可放射一螢光強度，且將該含量子點之螢光凝膠材料配置於該感測元件之一預定感測位置上，以形成一感測薄膜層，且將該感測薄膜層之含量子點之螢光凝膠材料置於一待測樣本時，於該待測樣本中一汞離子濃度導致該含量子點之螢光凝膠材料產生一螢光強度變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mercury ion detecting sensing method includes: providing a sensor member; prefabricating a gel material and a QD material having a fluorescent characteristic; mixing the gel material and the QD material to form a QD-contained fluorescent gel material, with the QD-contained fluorescent gel material capable of emitting a fluorescent intensity; dispensing the QD-contained fluorescent gel material to a predetermined sensing position of sensor member to form a membrane layer; and immersing the QD-contained fluorescent gel material of membrane layer to a unknown sample, with a mercury ion contained in the unknown sample causing the QD-contained fluorescent gel material to generate a change of fluorescent intensity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感測元件</p>
        <p type="p">10:含量子點之螢光凝膠材料</p>
        <p type="p">100:感測薄膜層</p>
        <p type="p">11:凝膠材料</p>
        <p type="p">12:量子點材料</p>
        <p type="p">2:待測樣本</p>
        <p type="p">3:紫外光</p>
        <p type="p">30:螢光</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="534px" img-content="tif" inline="yes" orientation="portrait" width="602px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621707</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144745</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250701B">A61K31/715</main-classification>
        <further-classification edition="200601120250701B">A61P3/00</further-classification>
        <further-classification edition="200601120250701B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商重慶金賽星醫療科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHONGQING JINSAIXING MEDICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周翔君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, XIANG-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>房劬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, QU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SI-QIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>胺基酸交聯多糖聚合物、水凝膠及其製備方法</chinese-title>
        <english-title>AMINO ACID CROSSLINKED POLYSACCHARIDE POLYMER, HYDROGEL AND ITS PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種胺基酸交聯多糖聚合物、水凝膠及其製備方法。所述交聯多糖聚合物由組分A和組分B交聯形成，其中：所述組分A為多糖或多糖衍生物；所述組分B為具有強極性基團的物質，所述強極性基團包括至少一個胺基和一個羧基。該聚合物具有穩定的三維剛性網路結構，具備較強的溶脹性，同時能夠起到大大增強機械強度/彈性模量的作用，對消化道黏膜無刺激性，易被降解。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses an amino acid cross-linked polysaccharide polymer, a hydrogel and a preparation method thereof. The cross-linked polysaccharide polymer is formed by crosslinking component A and component B, wherein, the component A is a polysaccharide or polysaccharide derivative; the component B is a substance with strong polar groups, which include at least one amino group and one carboxyl group. The polymer has a stable three-dimensional rigid network structure, a strong swelling ability, and can greatly enhance mechanical strength/elastic modulus, it is non irritating to the gastrointestinal mucosa and it is easily degraded.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623267</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144747</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250123B">H04N23/90</main-classification>
        <further-classification edition="202301120250123B">H04N23/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圓展科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVER INFORMATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡緯鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張森喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SEN-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江志宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭棠聿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多鏡頭自動運鏡拍攝方法及系統</chinese-title>
        <english-title>MULTI-CAMERA AUTOMATIC PHOTOGRAPHIC METHOD AND SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多鏡頭自動運鏡拍攝方法包含以下步驟。以多個攝影機拍攝人物和物件，並取得人物的人物資訊和物件的物件資訊，其中多個攝影機包含主攝影機及副攝影機；透過主攝影機偵測人物與物件是否實質接觸；當主攝影機偵測到人物與物件實質接觸時，依據人物資訊選擇以多個攝影機中之一者拍攝，並依據人物資訊和物件資訊，以第一拍攝參數拍攝；以及當人物資訊改變時，依據人物資訊選擇以多個攝影機中之另一者拍攝，並依據人物資訊和物件資訊，以第二拍攝參數拍攝，其中第二拍攝參數與第一拍攝參數不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-camera automatic photographic method includes steps as follows. A plurality of cameras capture a person and an object to obtain the person information of the person and the object information of the object, where the plurality of cameras include a main camera and at least one secondary camera; the main camera detect whether the person and the object are in physical contact; when the main camera detects that the person and the object are in physical contact, one of the plurality of cameras is selected for photography based on the person information, and a first photographic parameter is used for photography based on the person information and the object information; and when the person information changes, another of the plurality of cameras is selected for photography, and a second photographic parameter is used for photography based on the person information and the object information, where the second photographic parameter is different from the first photographic parameter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:多鏡頭自動運鏡拍攝方法</p>
        <p type="p">S201~S204:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="807px" img-content="tif" inline="yes" orientation="portrait" width="588px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623264</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144748</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">H04N23/61</main-classification>
        <further-classification edition="200601120250303B">H04N7/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圓展科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVER INFORMATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭棠聿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張森喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SEN-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江志宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡緯鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, WEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>會議人物的拍攝方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM OF PHOTOGRAPHING PEOPLE IN MEETING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種會議人物的拍攝方法包含以下步驟。以攝像裝置拍攝空間中的多個人員，取得多個人員影像；輸入多個人員影像至影像判斷模型以取得多個人員影像中的多個清晰人員影像，並排除模糊人員影像；由多個清晰人員影像中每一者與攝像裝置之間的第一距離，以及多個人員影像中每兩相鄰者之間的第二距離，計算多個清晰人員影像所對應之每兩相鄰人員之間的實際距離；從多個清晰人員影像中將實際距離小於預設範圍所對應的一群清晰人員影像納入會議群組；在會議介面中顯示會議群組中的該群清晰人員影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of photographing people in a meeting includes steps as follows. A camera device is used to shoot people in the space to obtain multiple person images; the multiple person images are inputted to the image judgment model to obtain multiple clear person images of the multiple person images and to exclude blurred person images; based on a first distance between each of the multiple clear person images and the camera device with a second distance between every two adjacent person images in the multiple person images, an actual distance between the every two adjacent people corresponding to the multiple clear person images is calculated; a group of clear person images corresponding to the actual distance smaller than the preset range from the multiple clear person images are added into a conference group; the group of clear person images of conference group are displayed in a conference interface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:會議人物的拍攝方法</p>
        <p type="p">S101~S109:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="698px" img-content="tif" inline="yes" orientation="portrait" width="878px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622192</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144749</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C09D167/04</main-classification>
        <further-classification edition="201801120241220B">C09D7/61</further-classification>
        <further-classification edition="200601120241220B">B32B27/18</further-classification>
        <further-classification edition="200601120241220B">B32B27/36</further-classification>
        <further-classification edition="200601120241220B">B05D1/38</further-classification>
        <further-classification edition="200601120241220B">B05D3/02</further-classification>
        <further-classification edition="200601120241220B">B05D5/08</further-classification>
        <further-classification edition="200601120241220B">B05D7/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新川創新股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUSTAINABLE CARBOHYDRATE INNOVATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施承昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHENG-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於形成多塗層結構的生物高分子塗層組合物、多塗層結構及多塗層結構的製備方法</chinese-title>
        <english-title>BIO-POLYMER COATING COMPOSITION FOR FORMING MULTI-LAYER COATING STRUCTURE, MULTI-LAYER COATING STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於形成多塗層結構的生物高分子塗層組合物、多塗層結構及所述多塗層結構的製備方法。所述生物高分子塗層組合物包括聚羥基鏈烷酸酯和鹼性物質，其所形成的多塗層結構具有優異的防水防油性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a bio-polymer coating composition for forming a multi-layer coating structure, the multi-layer coating structure, and a manufacturing method of the multi-layer coating structure. The bio-polymer coating composition includes polyhydroxyalkanoates and an alkali, and the multi-layer coating structure formed by the bio-polymer coating composition has excellent water-proof and oil-proof properties.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622868</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144753</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250319B">G06Q40/04</main-classification>
        <further-classification edition="202301120250319B">G06Q10/04</further-classification>
        <further-classification edition="202001120250319B">G06F30/27</further-classification>
        <further-classification edition="200601120250319B">G06T1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北商業大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY OF BUSINESS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉箐茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>針對布林通道的金融商品趨勢分析裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種針對布林通道的金融商品趨勢分析方法包括：從金融商品交易平台獲取金融商品的收盤價指標、變異數指標以及中軌指標；藉由時間序列值轉換圖像編碼器分別將收盤價指標、變異數指標以及中軌指標轉換為收盤價序列函數、變異數序列函數以及中軌序列函數；將收盤價序列函數、變異數序列函數以及中軌序列函數轉換為三張時間序列正規化圖片；將三張時間序列正規化圖片進行疊合以產生深度為三且相關於金融商品的合併圖；以及藉由卷積神經網路模組比較合併圖以及布林通道標籤圖以產生比較結果，其中比較結果相關於金融商品的未來趨勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟</p>
        <p type="p">S2:步驟</p>
        <p type="p">S3:步驟</p>
        <p type="p">S4:步驟</p>
        <p type="p">S5:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="961px" img-content="tif" inline="yes" orientation="portrait" width="687px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623235</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144756</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L43/08</main-classification>
        <further-classification edition="202201120250303B">H04L41/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凌群電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏　至均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, JERRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲綱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUO-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>平衡伺服負載與虛擬資源之可視化監控系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種平衡伺服負載與虛擬資源之可視化監控系統，包含數據監測模組、數據分析模組、告警通知模組、流量繪圖模組及顯示模組，數據分析模組設有負載平衡權重演算模型。數據監測模組連接至少一伺服負載平衡器及至少一虛擬資源池，且透過至少一傳輸協定分別對伺服負載平衡器及虛擬資源池輪詢而取得複數個負載狀態數據及複數個資源池狀態數據。數據分析模組演算一段期間內對應該傳輸協定之數據而分別獲得一平均負載數據及一平均資源數據。告警通知模組利用內存之一告警值比對各該平均負載數據及各該平均資源數據而於錯誤時輸出一告警訊號，且流量繪圖模組匯整生成拓樸圖式之至少一整合流量變化圖，供顯示模組實時顯示。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可視化監控系統</p>
        <p type="p">10:數據監測模組</p>
        <p type="p">11:數據分析模組</p>
        <p type="p">110:負載平衡權重演算模型</p>
        <p type="p">111:平均負載數據</p>
        <p type="p">112:平均資源數據</p>
        <p type="p">12:告警通知模組</p>
        <p type="p">15:流量繪圖模組</p>
        <p type="p">150:整合流量變化圖</p>
        <p type="p">16:顯示模組</p>
        <p type="p">2:伺服負載平衡器</p>
        <p type="p">20:負載狀態數據</p>
        <p type="p">3:虛擬資源池</p>
        <p type="p">30:資源池狀態數據</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="933px" img-content="tif" inline="yes" orientation="portrait" width="706px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621881</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144757</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B27B9/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樹德科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU-TE UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅首僖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, SHOU-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粘育綾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEN, YU-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉益照</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-ZHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊晶淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JING-QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>手持式木工電動工具裝置</chinese-title>
        <english-title>HANDHELD WOODWORKING POWER TOOL DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種手持式木工電動工具裝置，包含一動力單元，及一工具單元，該動力單元包括一動力主體、一與該動力主體連接的動力組合模組，及一與該動力主體連接的致動模組，該工具單元包括一與該動力主體連接的工具主體、一與該工具主體連接的工具組合模組，及一與該工具主體連接的工具模組，該動力組合模組與該工具組合模組的結構相互配合且相互組合，用於使該致動模組與該工具模組連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A handheld woodworking electric tool device includes a power unit and a tool unit. The power unit includes a power main body, a power combination module connected to the power main body, and an actuating structure connected to the power main body. The tool unit includes a tool body connected to the power body, a tool combination module connected to the tool body, and a tool module connected to the tool body. The structures of the power combination module and the tool combination module cooperate and combine with each other to connect the actuating structure with the tool module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:動力單元</p>
        <p type="p">31:動力主體</p>
        <p type="p">34:散熱結構</p>
        <p type="p">4:工具單元</p>
        <p type="p">41:工具主體</p>
        <p type="p">43:工具模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="826px" img-content="tif" inline="yes" orientation="portrait" width="611px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623199</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144758</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250319B">H03H7/12</main-classification>
        <further-classification edition="200601120250319B">H03H9/46</further-classification>
        <further-classification edition="200601120250319B">H01P1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余俊璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JIUN-JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>帶通濾波器</chinese-title>
        <english-title>BAND-PASS FILTER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種帶通濾波器，包含主體、二個輸入輸出柱、多個共振柱及導電籠。輸入輸出柱位於主體在一方向上的相對兩側。多個共振柱設置於主體內。各共振柱具有第一端及第二端。多個共振柱包含二個輸入輸出共振柱及至少一中介共振柱。輸入輸出共振柱相鄰於輸入輸出柱且電性連接至輸入輸出柱。中介共振柱在上述方向上位於輸入輸出共振柱之間。導電籠圍繞共振柱且包含底層、頂層及多個側連接件。側連接件連接底層及頂層。共振柱之第一端連接至底層。共振柱之第二端設置成與頂層間隔。各共振柱與側連接件之最小距離小於共振柱彼此之間的最小距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A band-pass filter includes a body, two input-output pillars, a plurality of resonance pillars and a conductive cage. The input-output pillars are located on two opposite sides of the body in a direction. The resonance pillars are disposed in the body. Each of the resonance pillars has a first end and a second end. The resonance pillars include two input-output resonance pillars and at least one intermediate resonance pillar. The input-output resonance pillars are disposed adjacent to the input-output pillars and electrically connected to the input-output pillars. The intermediate resonance pillar is located between the input-output resonance pillars in the above direction. The conductive cage is disposed surrounding the resonant pillars and includes a bottom layer, a top layer and a plurality of side connectors. The side connectors are disposed connecting the bottom layer and the top layer. The first ends of the resonance pillars are connected to the bottom layer. The second ends of the resonance pillars are spaced apart from the top layer. A minimum distance between each of the resonance pillars and the side connectors is less than a minimum distance between the resonance pillars.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:帶通濾波器</p>
        <p type="p">51:主體</p>
        <p type="p">521,522:輸入輸出柱</p>
        <p type="p">53:共振柱</p>
        <p type="p">531,532:輸入輸出共振柱</p>
        <p type="p">533:第一中介共振柱</p>
        <p type="p">534:第二中介共振柱</p>
        <p type="p">535:第三中介共振柱</p>
        <p type="p">541:電性連接件</p>
        <p type="p">55:導電籠</p>
        <p type="p">551:底層</p>
        <p type="p">552:頂層</p>
        <p type="p">553,554:側連接件</p>
        <p type="p">561:第一電容導體</p>
        <p type="p">562:第二電容導體</p>
        <p type="p">563:第三電容導體</p>
        <p type="p">564:第四電容導體</p>
        <p type="p">565:第五電容導體</p>
        <p type="p">582:浮動導體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.bmp" file="ed10017.bmp" height="730px" img-content="tif" inline="yes" orientation="portrait" width="977px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622724</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144760</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F3/14</main-classification>
        <further-classification edition="200601120250303B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>聲控顯示系統及聲控顯示器</chinese-title>
        <english-title>VOICE-CONTROLLED DISPLAYING SYSTEM AND VOICE-CONTROLLED DISPLAY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種聲控顯示系統及聲控顯示器，聲控顯示系統包含一控制器以及一顯示器。控制器包含一收音模組、一處理模組及一發送模組。收音模組用以接收一語音指令，並將語音指令轉換為一語音訊號。處理模組訊號連接收音模組，並對語音訊號進行辨識而產生一控制指令。發送模組訊號連接處理模組，並用以傳輸控制指令。顯示器包含一接收模組及一顯示模組。接收模組訊號連接發送模組，並接收控制指令。顯示模組訊號連接接收模組，並依據控制指令顯示一顯示畫面。藉此，提供一種兼具節省電力，且可作為空間裝飾的資訊顯示工具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A voice-controlled displaying system and a voice-controlled display are proposed. The voice-controlled displaying system includes a controller and a display. The controller includes a voice receiving module, a processing module and a transmitting module. The voice receiving module is configured to receive a speech instruction, and transform the speech instruction into a speech signal. The processing module is signally connected to the voice receiving module, and identifies the speech signal to generate a controlling instruction. The transmitting module is signally connected to the processing module and is configured to transmit the controlling instruction. The display includes a receiving module and a displaying module. The receiving module is signally connected to the transmitting module, and receives the controlling instruction. The displaying module is signally connected to the receiving module, and displays a displayed screen according to the controlling instruction. Thus, the voice-controlled displaying system of the present disclosure can provide an information displaying tool which can save power and act as a decoration in a space.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:聲控顯示系統</p>
        <p type="p">110:控制器</p>
        <p type="p">111:收音模組</p>
        <p type="p">113:處理模組</p>
        <p type="p">115:發送模組</p>
        <p type="p">120:顯示器</p>
        <p type="p">121:接收模組</p>
        <p type="p">123:顯示模組</p>
        <p type="p">C1:控制指令</p>
        <p type="p">S1:語音訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="712px" img-content="tif" inline="yes" orientation="portrait" width="818px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622795</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144769</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250303B">G06F40/10</main-classification>
        <further-classification edition="202001120250303B">G06F40/177</further-classification>
        <further-classification edition="201901120250303B">G06F16/25</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣大哥大股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN MOBILE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐美雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MEI YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YI CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯佩芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, PEI CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多層級表格轉換裝置及其方法</chinese-title>
        <english-title>A MULTI-LEVEL TABLE CONVERSION DEVICE AND A METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多層級表格轉換裝置包含定義器以及分析器。定義器接收第一表格，並透過自然語言處理技術對所述第一表格的多個第一單元格執行語意解析操作。語意解析操作包含自所述第一單元格中提取多個關鍵詞，以及判斷關鍵詞之間的層級關係。分析器耦接定義器，根據所述層級關係以及多個關鍵詞，對第一單元格的至少一者添加多個標記的對應一者；並且根據層級關係和標記，將第一表格轉換為第二表格。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-level table conversion device includes a definer and an analyzer. The definer receives a first table and performs a semantic parsing operation on a plurality of first cells of the first table through a natural language processing technology. The semantic parsing operation includes extracting a plurality of keywords from the first cells, and determining a level relationship between the keywords. The analyzer is coupled to the definer and adds a corresponding one of a plurality of tags to at least one of the first cells according to the level relationship and the keywords; and converts the first table into a second table according to the level relationship and the tags.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多層級表格轉換裝置</p>
        <p type="p">110:定義器</p>
        <p type="p">120:分析器</p>
        <p type="p">130:產生器</p>
        <p type="p">TB1:第一表格</p>
        <p type="p">TB2:第二表格</p>
        <p type="p">LR1:層級關係</p>
        <p type="p">KW[1]~KW[n]:關鍵詞</p>
        <p type="p">DD_CHT:樹狀結構圖</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="649px" img-content="tif" inline="yes" orientation="portrait" width="990px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622431</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144770</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250123B">F24H9/25</main-classification>
        <further-classification edition="200601120250123B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沛禾科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PI-R TECHNOLOGY CO.LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昭炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHAO HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>飲水機觸控裝置</chinese-title>
        <english-title>TOUCH CONTROL DEVICE FOR WATER DISPENSERS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種飲水機觸控裝置，依序包括：一面板、一觸控薄膜、一屏蔽層及一電路板，該觸控薄膜包括複數觸控部，該複數觸控部電性連接該電路板，各該觸控部為電容式觸控部，該屏蔽層覆設該觸控薄膜且電性連接該電路板，該屏蔽層具有複數非屏蔽區、一屏蔽區及一屏蔽結構，該複數非屏蔽區對應該複數觸控部；藉此，觸控靈敏度高且抗干擾力強。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch control device for water dispensers is provided, sequentially including: a panel, a touch film, a shielding layer and a circuit board, the touch film including a plurality of touch control portions, the plurality of touch control portions electrically connected with the circuit board, each touch control portion being a capacitive touch control portion, the shielding layer covering the touch film and electrically connected with the circuit board, the shielding layer having a plurality of non-shielded areas, a shielded area and a shielding structure, the plurality of non-shielded areas corresponding the plurality of touch control portions; therefore, it has high touch sensitivity and strong anti-interference capability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:飲水機觸控裝置</p>
        <p type="p">10:面板</p>
        <p type="p">34:接地端子</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="955px" img-content="tif" inline="yes" orientation="portrait" width="591px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622394</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144771</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">F16D3/16</main-classification>
        <further-classification edition="200601120250123B">B25B23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科宏工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE HUNG INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN NIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>萬向接頭</chinese-title>
        <english-title>UNIVERSAL JOINT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種萬向接頭，包括：一筒件，包括相對配置的一接槽及一組接結構，該接槽包括多個第一內面及多個第二內面，該多個第一內面與該多個第二內面的形狀相異且周向交錯設置，該組接結構供與一第一外部裝置相組接；及一接桿，包括相對配置的一第一端部及一第二端部，該第一端部可擺動地容設於該接槽且與該筒件一起轉動，該第一端部包括多個第一側面及多個第二側面，該多個第一側面與該多個第二側面的形狀相異且周向交錯設置，該多個第一側面與該多個第二側面分別與該多個第一內面與該多個第二內面相面對，該第二端部供與一第二外部裝置相組接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A universal joint is provided, wherein the universal joint includes: a socket including a connecting slot and a assembling structure oppositely arranged, the connecting slot including a plurality of first inner surfaces and a plurality of second inner surfaces, the plurality of first inner surfaces and the plurality of second inner surfaces being different in shape and being alternatively and circumferentially arranged, the assembling structure being configured to be assembled with a first external device; and a connecting rod including a first end portion and a second end portion oppositely arranged, the first end portion being swingably received in the connecting slot and rotatable with the socket, the first end portion including a plurality of first side surfaces and a plurality of second side surfaces, the plurality of first side surfaces and the plurality of second side surfaces being different in shape and being alternatively and circumferentially arranged, the plurality of first side surfaces and the plurality of second side surfaces facing the plurality of first inner surfaces and the plurality of second inner surfaces, respectively, the second end portion being configured to be assembled with a second external device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:萬向接頭</p>
        <p type="p">10:筒件</p>
        <p type="p">20:接桿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="645px" img-content="tif" inline="yes" orientation="portrait" width="458px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623195</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144774</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03F3/217</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周泠杪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, LING-MIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴佑旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YOU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張景翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHING-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>D類放大器</chinese-title>
        <english-title>CLASS-D AMPLIFIER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">D類放大器包含：迴路濾波器，用來接收第一及第二回授訊號，以及透過第一及第二電阻器分別接收第一及第二輸入訊號，並且濾波第一及第二輸入訊號與第一及第二回授訊號以產生第一及第二濾波訊號；三角波產生器，用來根據第一及第二參考電壓產生三角波；第一及第二比較器，用來分別將第一及第二濾波訊號與三角波比較以分別產生第一及第二脈衝寬度調變訊號；第一及第二驅動器電路，用來分別根據第一及第二脈衝寬度調變訊號產生第一及第二輸出訊號；以及參考電壓產生電路，用來根據控制訊號產生第一及第二參考電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A class-D amplifier includes: a loop filter configured to receive first and second feedback signals, to receive first and second input signals through first and second resistors respectively, and to filter the first and second input signals and the first and second feedback signals to generate first and second filtered signals; a triangle wave generator configured to generate a triangle wave based on first and second reference voltages; first and second comparators configured to compare the first and second filtered signals with the triangle wave respectively to generate the first and second pulse width modulation (PWM) signals, respectively; first and second driver circuits configured to generate first and second output signals based on the first and second PWM signals, respectively; and a reference voltage generation circuit configured to generate the first and second reference voltages based on a control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:D類放大器</p>
        <p type="p">110:迴路濾波器</p>
        <p type="p">120:三角波產生器</p>
        <p type="p">130_1,130_2:比較器</p>
        <p type="p">140_1,140_2:驅動器電路</p>
        <p type="p">150:參考電壓產生電路</p>
        <p type="p">AVDD,PVDD:電源電壓</p>
        <p type="p">Ctrl1,Ctrl2:控制訊號</p>
        <p type="p">Rfb1,Rfb2,Rin1,Rin2:電阻器</p>
        <p type="p">Vcm:共模電壓</p>
        <p type="p">Vfb1,Vfb2:回授訊號</p>
        <p type="p">VH:高參考電壓</p>
        <p type="p">Vin1,Vin2:輸入訊號</p>
        <p type="p">VL:低參考電壓</p>
        <p type="p">V1f1,V1f2:濾波訊號</p>
        <p type="p">Vout1,Vout2:輸出訊號</p>
        <p type="p">Vpwm1,Vpwm2:脈衝寬度調變訊號</p>
        <p type="p">Vtr:三角波</p>
        <p type="p">510:共模電壓產生電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.png" file="d10016.TIF" giffile="ed10016.png" height="699px" img-content="tif" inline="yes" orientation="portrait" width="1002px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622845</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144778</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250617B">G06Q30/02</main-classification>
        <further-classification edition="202401120250617B">G06Q10/08</further-classification>
        <further-classification edition="200601120250617B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AWOO INTELLIGENCE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林思吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SZU WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃照峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>即時性商品推薦系統及其實施方法</chinese-title>
        <english-title>REAL-TIME PRODUCT RECOMMEDATION SYSTEM AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為提供一種即時性商品推薦系統及其實施方法，於實施時透過定時擷取網際網路中的即時性資訊，利用人工智慧模型進行分析，生成標籤並貼附於關聯商品上，同時賦予或更新標籤所對應的權重值，在進行商品推薦時，能即時推陳出新，自動排序出最符合消費者實時需求的商品，且精確地將即時性資訊反映在商品推薦中，達到最佳的電子行銷效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:即時性商品推薦系統</p>
        <p type="p">11:中央處理模組</p>
        <p type="p">12:儲存模組</p>
        <p type="p">121:學習資料庫</p>
        <p type="p">122:標籤資料庫</p>
        <p type="p">123:商品資料庫</p>
        <p type="p">13:即時擷取模組</p>
        <p type="p">14:字詞萃取模組</p>
        <p type="p">15:標籤組合模組</p>
        <p type="p">16:商品陳列模組</p>
        <p type="p">2:網際網路</p>
        <p type="p">3:資訊裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="685px" img-content="tif" inline="yes" orientation="portrait" width="1029px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621555</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144779</doc-number>
          <kind></kind>
          <date>113/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120241203B">A01G18/66</main-classification>
        <further-classification edition="200601120241203B">B65D30/10</further-classification>
        <further-classification edition="202201120241203B">B09B3/00</further-classification>
        <further-classification edition="202201320241203B">B09B101/75</further-classification>
        <further-classification edition="202201320241203B">B09B101/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恰口科研企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯志諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡坪芫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>蕈菌太空包</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明乃是一種蕈菌太空包，其包含：一包材，該包材為薄膜，該薄膜之材料為回收塑膠或含回收料之塑膠；一碎粒基底，該碎粒基底為廢棄木材經粉碎處理後之碎木材，該碎粒基底置入該包材內包覆；一改質碳粉，該改質碳粉為經表面官能基改質之多微孔洞碳粉，該改質碳粉混合該碎粒基底，並與該碎粒基底一起置入該包材內包覆；及一蕈菇複合養份，該蕈菇複合養份為蕈菇營養液，該蕈菇複合養份混合該改質碳粉及該碎粒基底，並與該碎粒基底一起置入該包材內包覆。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:包材</p>
        <p type="p">201:碎粒基底</p>
        <p type="p">301:改質碳粉</p>
        <p type="p">401:蕈菇複合養份</p>
        <p type="p">501:蕈菌</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="816px" img-content="tif" inline="yes" orientation="portrait" width="544px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622685</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144785</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250502B">G05F1/575</main-classification>
        <further-classification edition="200601120250502B">H02M3/158</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANPEC ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳富權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓學恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, HSUEH-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多迴路控制電路及其控制方法</chinese-title>
        <english-title>MULTI-LOOP CONTROL CIRCUIT AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開是一種多迴路控制電路及其控制方法。多迴路控制電路包括放大級電路及電流選擇電路。其中放大級電路具有可輸出第一轉導放大電流的第一轉導放大器及可輸出第二轉導放大電流的第二轉導放大器。電流選擇電路接收第一轉導放大電流及第二轉導放大電流，並輸出誤差輸出電流。電流選擇電路從第一轉導放大電流及第二轉導放大電流中選出最大者並輸出當成誤差輸出電流，且由所述誤差輸出電流產生一誤差放大訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-loop control circuit and a control method thereof are provided. The multi-loop control circuit includes an amplification stage circuit and a current selection circuit. The amplification stage circuit has a first transduction amplifier that can output a first transduction amplification current and a second transduction amplifier that can output a second transduction amplification current. The current selection circuit receives the first transduction amplification current and the second transduction amplification current, and outputs an error output current. The current selection circuit selects the largest from the first transduction amplification current and the second transduction amplification current and outputs it as the error output current. An error amplified signal is generated by the error output current.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:多迴路控制電路</p>
        <p type="p">10:放大級電路</p>
        <p type="p">11:電流補償電路</p>
        <p type="p">12:電流選擇電路</p>
        <p type="p">13:電流移除電路</p>
        <p type="p">14:迴路補償電路</p>
        <p type="p">OTA1:第一轉導放大器</p>
        <p type="p">OTA2:第二轉導放大器</p>
        <p type="p">OTA3:第三轉導放大器</p>
        <p type="p">IGM1:第一轉導放大電流</p>
        <p type="p">IGM2:第二轉導放大電流</p>
        <p type="p">IGM3:第三轉導放大電流</p>
        <p type="p">IOUT:誤差輸出電流</p>
        <p type="p">EAO:誤差放大訊號</p>
        <p type="p">VREF1:第一參考電壓</p>
        <p type="p">VREF2:第二參考電壓</p>
        <p type="p">VREF3:第三參考電壓</p>
        <p type="p">VFB1:第一回授電壓</p>
        <p type="p">VFB2:第二回授電壓</p>
        <p type="p">VFB3:第三回授電壓</p>
        <p type="p">N:節點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="614px" img-content="tif" inline="yes" orientation="portrait" width="921px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623295</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144787</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120241231B">H04W72/541</main-classification>
        <further-classification edition="202301120241231B">H04W72/542</further-classification>
        <further-classification edition="202301120241231B">H04W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王姿琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TZU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏　在賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAN, CHAI-HIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林萬怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WAN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KAI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無線接取網路智慧控制器、動態資源區塊配置方法及動態配置資源區塊的基站</chinese-title>
        <english-title>RAN INTELLIGENT CONTROLLER, DYNAMIC RESOURCE BLOCK CONFIGURATION METHOD AND BASE STATION WITH DYNAMIC RESOURCE BLOCK CONFIGURATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線接取網路智慧控制器(RIC)、動態資源區塊(RB)配置方法及動態配置資源區塊的基站。多個基站(BS)持續從關聯的多個UE接收網路狀態資訊，並傳送給RIC。RIC從多個BS獲取對應多個用戶設備(UE)的網路狀態資訊；RIC基於網路狀態資訊，識別多個UE中的被干擾的至少一第一UE；RIC基於網路狀態資訊、至少一第一UE、至少一第一BS，設定對應到多個BS的多個動態RB分配策略；多個BS反應於從RIC接收動態RB分配策略，將可支配的多個RB劃分為多個第一RB組以及第二RB組，據此產生對應多個UE的傳輸資源分配資訊，以使多個UE識別各自的多個被分配RB。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A Radio Access Network Intelligent Controller (RIC), a dynamic Resource Block (RB) allocation method, and a related base station. Multiple base stations (BSs) continuously receive network status information from associated multiple UEs and transmit it to the RIC. The RIC obtains network status information from multiple BSs; based on the network status information, the RIC identifies at least one first UE among multiple UEs that is experiencing interference; the RIC sets multiple dynamic RB allocation strategies corresponding to multiple BSs based on the network status information， at least one first UE, and at least one first BS; in response to receiving dynamic RB allocation strategies from the RIC, multiple BSs divide their available RBs into multiple first RB groups and a second RB group， thereby generating transmission resource allocation information corresponding to multiple UEs, enabling multiple UEs to identify their respective allocated RBs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S350:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="753px" img-content="tif" inline="yes" orientation="portrait" width="767px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621713</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144788</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120241220B">A61K35/32</main-classification>
        <further-classification edition="200601120241220B">A61P29/00</further-classification>
        <further-classification edition="200601120241220B">A61P39/06</further-classification>
        <further-classification edition="200601120241220B">C09K11/65</further-classification>
        <further-classification edition="201101120241220B">B82Y5/00</further-classification>
        <further-classification edition="201101120241220B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國醫藥大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊宗原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUANG, TZONG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張長正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜文平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, WEN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董紓廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, SHU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>源於動物之聚合物點、其製備方法及用途</chinese-title>
        <english-title>ANIMAL-DERIVED POLYMER DOT, PREPARATION METHOD AND USE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種源於動物之聚合物點，包含下式(1)所示之碳點：        &lt;br/&gt;C        &lt;sub&gt;x&lt;/sub&gt;O        &lt;sub&gt;y&lt;/sub&gt;N        &lt;sub&gt;z&lt;/sub&gt;(1)，        &lt;br/&gt;C為碳，O為氧，N為氮，x、y及z代表原子百分比並滿足以下關係：55≦x≦75，15≦y≦35，10≦z≦30，且x＋y＋z＝100，且該碳點係得自源於動物之材料。源於動物之聚合物點的製備方法包含：添加源於動物之材料至水中，以形成水溶液；以及加熱該水溶液，以獲得源於動物之聚合物點。另提供源於動物之聚合物點用於製備抗發炎及抗氧化其中至少一者之組成物的用途。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An animal-derived polymer dot includes a carbon dot represented by following formula (1):        &lt;br/&gt;C        &lt;sub&gt;x&lt;/sub&gt;O        &lt;sub&gt;y&lt;/sub&gt;N        &lt;sub&gt;z&lt;/sub&gt;(1),        &lt;br/&gt;C is carbon, O is oxygen, N is nitrogen, x, y, and z denote atomic percentages and satisfie the following relationship: 55≦x≦75, 15≦y≦35, 10≦z≦30, and x+y+z=100, and the carbon dot is obtained from an animal-derived material. A preparation method of the animal-derived polymer dot includes: adding the animal-derived material into water to form an aqueous solution; and heating the aqueous solution to obtain the animal-derived polymer dot. A use of the animal-derived polymer dot for manufacture of at least one of anti-inflammatory and anti-oxidation compositions.      </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="735px" img-content="tif" inline="yes" orientation="portrait" width="976px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622653</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144789</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250225B">G05B19/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李坤穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KUN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仕偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>工具機主軸運轉節能的控制方法</chinese-title>
        <english-title>ENERGY SAVING CONTROL METHOD FOR MACHINE TOOL SPINDLE OPERATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">工具機主軸運轉節能的控制方法，其步驟包含取得工具機對物件加工運轉主軸馬達的轉速與對應能耗結果及/或轉速與對應碳排放量結果，該結果至少包含最高能耗數值及/或最高碳排放量數值；使該工具機對下一該物件加工；針對該轉速與對應能耗結果設定該工具機運轉時之轉速閾值，該閾值低於該最高能耗數值及/或該最高碳排放量數值所對應的轉速；本發明透過主軸馬達的轉速與對應能耗結果或對應碳排放量結果，設定加工閾值不超過最高能耗數值或最高碳排放量數值，避免使用高能耗轉速進行切削，相對即能減少能源使用，達到節能減碳效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an energy-saving control method for machine tool spindle includes the following steps: obtaining the spindle motor’s rotational speed used in the machining process and the corresponding energy consumption and/or carbon emission results. These results include at least the highest energy consumption value and/or the highest carbon emission value. The method then applies these parameters for the next machining process of the object. Based on the obtained rotational speed and corresponding energy consumption results, a speed threshold is set for the machine tool operation, which is lower than the speed corresponding to the highest energy consumption and/or carbon emission value. This invention establishes a machining threshold that does not exceed the maximum energy consumption or carbon emission values by referencing the spindle motor’s rotational speed and corresponding energy consumption or carbon emission results. By avoiding high-energy consumption speeds during cutting, this method effectively reduces energy usage, achieving both energy savings and carbon reduction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S3:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="889px" img-content="tif" inline="yes" orientation="portrait" width="663px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622419</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144790</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F23N5/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘順碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, SHUN-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁晉維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐愷呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KAI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐紹文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, SHAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>鍋爐控制方法</chinese-title>
        <english-title>BOILER CONTROL METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種鍋爐控制方法。在此方法中，利用控制器取得鍋爐之數個燃燒模式之對應之數個火焰型態。當鍋爐於這些燃燒模式中的一個燃燒模式時，控制器根據此燃燒模式所對應之火焰型態控制鍋爐之液位計，以使鍋爐之液位匹配此燃燒模式所對應之火焰型態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a boiler control method. In this method, plural flame patterns corresponding to plural combustion modes of a boiler are obtained by using a controller. When the boiler is operated at one of the combustion modes, the controller controls a liquid level gauge of the boiler according to the flame pattern corresponding to the one of the combustion modes, such that a liquid level of the boiler matches the flame pattern corresponding to the one of the combustion modes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鍋爐</p>
        <p type="p">110:爐體</p>
        <p type="p">112:燃燒空間</p>
        <p type="p">120:燃燒器</p>
        <p type="p">130:熱交換管</p>
        <p type="p">132:開口</p>
        <p type="p">140:液位計</p>
        <p type="p">150:控制器</p>
        <p type="p">160:飼水管</p>
        <p type="p">170:蒸氣分離器</p>
        <p type="p">F:火焰</p>
        <p type="p">HT:火焰高溫位置</p>
        <p type="p">L:液體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="719px" img-content="tif" inline="yes" orientation="portrait" width="776px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623459</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144795</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250314B">H10F30/20</main-classification>
        <further-classification edition="202501120250314B">H10F55/20</further-classification>
        <further-classification edition="202501120250314B">H10F77/124</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華立捷科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HLJ TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴力弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, LI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴利溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, LI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林炳成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾彥鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YEN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>超高速光偵測器</chinese-title>
        <english-title>ULTRA-SPEED LIGHT DETECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種超高速光偵測器，包括基板、吸光層及電極層。吸光層設置於基板上。電極層具透光性，設置於吸光層上，區分為多個第一電極及多個第二電極，第一電極與第二電極為相反極性，多個第一電極間隔排列，相鄰的二個第一電極之間存在第二電極，相鄰的第一電極與第二電極之間具有間距，顯露一部份的吸光層的表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultra-high-speed light detector includes a substrate, a light absorption layer and an electrode layer. The light absorption is provided on the substrate. The electrode layer is light-transmissive and is provided on the light absorption layer. It is divided into a plurality of first electrodes and a plurality of second electrodes. The first electrode and the second electrode have opposite polarities. The first electrodes are arranged at intervals. The second electrode is located between two adjacent first electrodes. A gap is located between the adjacent first electrodes and the second electrodes, exposing a part of the surface of the light absorption layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:超高速光偵測器</p>
        <p type="p">10:基板</p>
        <p type="p">11:吸光層</p>
        <p type="p">12:電極層</p>
        <p type="p">121:第一電極</p>
        <p type="p">122:第二電極</p>
        <p type="p">13:能障層</p>
        <p type="p">W:間距</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="687px" img-content="tif" inline="yes" orientation="portrait" width="696px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622755</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144796</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250526B">G06F13/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李哲言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHE-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示埠輸出適配器以及用來控制顯示埠輸出適配器的時脈訊號的方法</chinese-title>
        <english-title>DISPLAYPORT OUTPUT ADAPTER AND METHOD FOR CONTROLLING CLOCK SIGNAL OF DP OUTPUT ADAPTER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種顯示埠輸出適配器以及用來控制該顯示埠輸出適配器的一時脈訊號的方法。該顯示埠輸出適配器包含一時脈產生器、一儲存裝置以及一控制器，其中該儲存裝置耦接至該時脈產生器，以及該控制器耦接至該時脈產生器以及該儲存裝置。該時脈產生器依據一控制碼輸出該時脈訊號，其中該控制碼對應於該時脈訊號的一頻率。該儲存裝置儲存該顯示埠輸出適配器自一顯示埠源端裝置接收到的輸入資料，並且依據該時脈訊號將儲存在該儲存裝置中的輸出資料傳送至一顯示埠匯集裝置。另外，該控制器依據該儲存裝置的一資料量控制該控制碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A DisplayPort (DP) output adapter and a method for controlling a clock signal of the DP output adapter. The DP output adapter includes a clock generator, a storage device and a controller, wherein the storage device is coupled to the clock generator, and the controller is coupled to the clock generator and the storage device. The clock generator outputs the clock signal according to a control code, wherein the control code is associated with a frequency of the clock signal. The storage device stores input data received from a DP source device by the DP output adapter, and transmits output data stored in the storage device to a DP sink device according to the clock signal. In addition, the controller controls the control code according to data amount of the storage device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:顯示埠輸出適配器</p>
        <p type="p">210:鎖相迴路</p>
        <p type="p">220:靜態隨機存取記憶體</p>
        <p type="p">230:控制器</p>
        <p type="p">230P:處理電路</p>
        <p type="p">230M:儲存裝置</p>
        <p type="p">230C:程式碼</p>
        <p type="p">CLK:時脈訊號</p>
        <p type="p">D&lt;sub&gt;FREQ&lt;/sub&gt;:控制碼</p>
        <p type="p">D&lt;sub&gt;WL&lt;/sub&gt;:水位碼</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="540px" img-content="tif" inline="yes" orientation="portrait" width="987px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622954</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144797</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250103B">G10L15/28</main-classification>
        <further-classification edition="200601120250103B">G10L15/16</further-classification>
        <further-classification edition="201301120250103B">G10L17/18</further-classification>
        <further-classification edition="201301120250103B">G10L19/02</further-classification>
        <further-classification edition="202301120250103B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芯音智能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSPEECH AI CO.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑞璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊杰凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>語音識別設備及其應用之級聯式語音識別系統</chinese-title>
        <english-title>VOICE RECOGNITION DEVICE AND APPLICATION IN A CASCADED SPEECH RECOGNITION SYSTEM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種語音識別設備，主要拆解神經網路架構為編碼器及解碼器，形成級聯式神經網路架構。並且，藉由編碼器依據編碼器參數對輸入語音數據進行編碼。接著，生成中間編碼表現訊息，並藉由網路傳輸中間編碼表現訊息至解碼器。接著，藉由解碼器依據解碼器參數對中間編碼表現訊息進行解碼生成辨識文本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides a voice recognition device that primarily decomposes the neural network architecture into an encoder and a decoder, forming a cascaded neural network structure. Additionally, the encoder encodes the input voice data based on encoder parameters. Subsequently, it generates an intermediate encoded representation message, which is then transmitted to the decoder via the network. Then, the decoder decodes the intermediate encoded representation message based on decoder parameters to generate recognized text.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:級聯式語音識別系統</p>
        <p type="p">U:使用者</p>
        <p type="p">E:網路</p>
        <p type="p">10:編碼器</p>
        <p type="p">11:解碼器</p>
        <p type="p">12:神經網路架構</p>
        <p type="p">101:編碼器參數</p>
        <p type="p">102:中間編碼表現訊息</p>
        <p type="p">103:語音識別設備</p>
        <p type="p">103a:近端設備</p>
        <p type="p">104:語音解碼設備</p>
        <p type="p">104a:遠端設備</p>
        <p type="p">110:辨識文本</p>
        <p type="p">111:解碼器參數</p>
        <p type="p">131:輸入語音數據</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="808px" img-content="tif" inline="yes" orientation="portrait" width="748px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622453</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144799</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250203B">G01B7/34</main-classification>
        <further-classification edition="200601120250203B">G01R27/26</further-classification>
        <further-classification edition="200601120250203B">G01R1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃榮堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JUNG TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃榮堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JUNG TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>刀把式粗度計及其應用之表面粗度量測系統</chinese-title>
        <english-title>A TOOL-HOLDER TYPE ROUGHNESS METER AND ITS APPLICATION IN A SURFACE ROUGHNESS MEASUREMENT SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種表面粗度量測系統，係包含一刀把式粗度計及一分析設備，其中該刀把式粗度計前端具有一接觸式伸縮針，該刀把式粗度計於一工具機床台表面移動時，該接觸式伸縮針係會上下位移，並使得該刀把式粗度計內部之渦電流線圈感測器所量測之量測線圈電感數據產生變化，而該分析設備能夠接收線圈電感數據，並依據該線圈電感數據進行運算出一距離變化數據，再依據該距離變化數據進行運算出一表面粗糙度參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A surface roughness measurement system, comprising a tool-holder type roughness meter and an analysis device. The tool-holder type roughness meter has a contact-type telescoping needle at its front end. When the tool-holder type roughness meter moves across the surface of a machine tool table, the contact-type telescoping needle displaces vertically, causing a change in the inductance data measured by an eddy current coil sensor inside the tool-holder type roughness meter. The analysis device receives the coil inductance data and calculates a distance variation based on this data. Using the distance variation data, the system then computes a surface roughness parameter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:刀把式粗度計</p>
        <p type="p">2:分析設備</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="799px" img-content="tif" inline="yes" orientation="portrait" width="521px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623360</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144805</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260303B">H10B41/20</main-classification>
        <further-classification edition="202301120260303B">H10B41/30</further-classification>
        <further-classification edition="202301120260303B">H10B41/35</further-classification>
        <further-classification edition="202301120260303B">H10B43/20</further-classification>
        <further-classification edition="202301120260303B">H10B43/30</further-classification>
        <further-classification edition="202301120260303B">H10B43/35</further-classification>
        <further-classification edition="202601120260303B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊金成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體元件及其製造方法</chinese-title>
        <english-title>MEMORY DEVICE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體元件，包括：基底、第一堆疊結構、第二堆疊結構以及多個第一凸起部以及多個第二凸起部以及多個導體插塞。記憶體元件可為具備高容量及高性能的立體NAND快閃記憶體。所述多個第一凸起部設置於所述第一堆疊結構的第一階梯結構的多個第一導體層上，且與所述多個第一導體層電性連接。所述多個第二凸起部，設置於第二堆疊結構的所述第二階梯結構的所述多個第二導體層上，且與所述多個第二導體層電性連接。多個導體插塞，延伸穿過所述第二階梯結構與所述第一階梯結構，且每個導體插塞分別與所述多個第一導體層以及所述多個第二導體層的其中之一電性連接，且被所述多個第一凸起部以及所述多個第二凸起部的其中之一環繞且電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a substrate, a first stack structure, a second stack structure, a plurality of first protrusions, a plurality of second protrusions, and a plurality of conductive plugs. The memory device may be a three-dimensional NAND flash memory with high capacity and high performance. The plurality of first protrusions are disposed on and are electrically connected to the plurality of first conductor layers of a first staircase structure of the first stacked structure. The plurality of second protrusions are disposed on and are electrically connected to the plurality of second conductive layers of the second staircase structure of the second stack structure. The plurality of conductive plugs extend through the second staircase structure and the first staircase structure, and each conductive plug is connected to one of the plurality of first conductive layers and the plurality of second conductive layers. Each conductive plug is surrounded by and electrically connected to one of the plurality of first protrusions and the plurality of second protrusions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">104:堆疊結構/第一堆疊結構</p>
        <p type="p">104a:第一階梯結構</p>
        <p type="p">114:開口</p>
        <p type="p">128:凸起部</p>
        <p type="p">I-I’、II-II’:線</p>
        <p type="p">R1、R2、R3、R4:列</p>
        <p type="p">S1、S2、S3:階</p>
        <p type="p">D1:距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10064.png" file="d10064.TIF" giffile="ed10064.png" height="607px" img-content="tif" inline="yes" orientation="portrait" width="390px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623003</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144813</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250729B">H01C17/075</main-classification>
        <further-classification edition="200601120250729B">H01C7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>同欣電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONG HSING ELECTRONIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊雁茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAN-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴致瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, JHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施建宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, JIAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子元件的製造方法、電子元件及薄膜電阻</chinese-title>
        <english-title>A METHOD FOR MANUFACTURING AN ELECTRONIC COMPONENT, AN ELECTRONIC COMPONENT, AND A THIN-FILM RESISTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種電子元件的製造方法、電子元件及薄膜電阻。電子元件的製造方法包含：於陶瓷基板形成貫穿的導通孔；於陶瓷基板的一側形成電阻膜；形成金屬層於陶瓷基板的兩側，金屬層覆蓋部分的電阻膜，部分的金屬層位於導通孔內；於金屬層的一側形成導電結構，部分的導電結構於陶瓷基板的一側構成第一電極、第二電極及線路結構；部分的導電結構於陶瓷基板的另一側形成第三電極，第三電極與第一電極、第二電極或線路結構電性連通；於電阻膜的一側，形成絕緣保護層，以覆蓋電阻膜未被金屬層覆蓋的部分；於第二電極的一側，形成輔助焊接結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a method for manufacturing an electronic component, an electronic component, and a thin-film resistor. The manufacturing method of the electronic component includes: forming a through via in a ceramic substrate; forming a resistive film on one side of the ceramic substrate; forming a metal layer on both sides of the ceramic substrate, where the metal layer covers part of the resistive film, and part of the metal layer is located within the via; forming a conductive structure on one side of the metal layer, wherein part of the conductive structure on one side of the ceramic substrate constitutes a first electrode, a second electrode, and a circuit structure; part of the conductive structure on the other side of the ceramic substrate forms a third electrode, which is electrically connected to the first electrode, the second electrode, or the circuit structure; forming an insulating protective layer on the resistive film to cover the portion of the resistive film not covered by the metal layer; and forming an auxiliary soldering structure on one side of the second electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電子元件</p>
        <p type="p">1:陶瓷基板</p>
        <p type="p">11:導通孔</p>
        <p type="p">2:電阻膜</p>
        <p type="p">3:金屬層</p>
        <p type="p">4:導電結構</p>
        <p type="p">41:第一電極</p>
        <p type="p">42:第二電極</p>
        <p type="p">43:線路結構</p>
        <p type="p">44:第三電極</p>
        <p type="p">45:導電材料</p>
        <p type="p">5:絕緣保護層</p>
        <p type="p">6:輔助焊接結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="645px" img-content="tif" inline="yes" orientation="portrait" width="914px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622980</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144815</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">G11C16/24</main-classification>
        <further-classification edition="200601120250425B">G11C11/26</further-classification>
        <further-classification edition="200601120250425B">G11C11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體裝置、電流電壓轉換器以及資料線的預充電方法</chinese-title>
        <english-title>MEMORY DEVICE, CURRENT-TO-VOLTAGE CONVERTOR AND PRECHARGE METHOD FOR DATA LINE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置、電流電壓轉換器以及資料線的預充電方法被提出。電流電壓轉換器包括第一預充電電路、第二預充電電路以及下拉電路。第一預充電電路被配置以在資料感測動作的預充電期間，根據為第一邏輯準位的感測致能信號將資料線上的電壓預充電至預設電壓。第二預充電電路被配置以根據資料線上的電壓來產生回授電壓，並在預充電期間根據回授電壓以拉升資料線上的電壓。下拉電路被配置以根據為第二邏輯準位的感測致能信號以使資料線進行放電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device, a current-to-voltage convertor and a pre-charge method for data line are provided. The current-to-voltage convertor includes a first pre-charge circuit, a second pre-charge circuit and a pull-down circuit. The first pre-charge circuit is configured to pre-charge a voltage on a data line to a preset voltage according to a sensing enable signal which is at a first logic level during a pre-charge period of a data sensing operation. The second pre-charge circuit is configured to generate a feedback voltage according to the voltage on the data line and pull up the voltage on the data line according to the feedback voltage during the pre-charge period. The pull-down circuit is configured to discharge the data line according to the sensing enable signal which is at a second logic level.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電流電壓轉換器</p>
        <p type="p">110:第一預充電電路</p>
        <p type="p">120:第二預充電電路</p>
        <p type="p">130:下拉電路</p>
        <p type="p">140:箝位電路</p>
        <p type="p">DL:資料線</p>
        <p type="p">GBL:全域位元線</p>
        <p type="p">MC:記憶胞</p>
        <p type="p">MN1:電晶體</p>
        <p type="p">N&lt;sub&gt;VSA&lt;/sub&gt;:感測電壓節點</p>
        <p type="p">SAEN:感測致能信號</p>
        <p type="p">SW1:開關</p>
        <p type="p">VCC:電源電壓</p>
        <p type="p">VSA:感測電壓信號</p>
        <p type="p">VSS:參考接地電壓</p>
        <p type="p">WL:字元線信號</p>
        <p type="p">Y:選擇信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="844px" img-content="tif" inline="yes" orientation="portrait" width="737px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622923</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144818</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241213B">G09B5/08</main-classification>
        <further-classification edition="200601120241213B">G09B9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>醫諾華醫學科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOVA MEDICAL TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淳娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUEN-CHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>藥劑處方審查訓練系統及方法</chinese-title>
        <english-title>PHARMACEUTICAL PRESCRIPTION REVIEW TRAINING SYSTEM AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於藥劑處方審查訓練的系統及方法。藥劑處方審查訓練系統包含教案建置模組、學員演練模組以及教師管理模組。教案建置模組經配置以接收複數組案例資訊，並將複數組案例資訊整合為複數個教案，其中每一組案例資訊包含針對決策任務的觸發事件、模擬處方箋及至少一個問答題。學員演練模組經配置以顯示複數個教案，使學員執行對應決策任務並輸入對應決策回饋，其中決策回饋包含問答題之對應作答，並且產生一組決策成績。教師管理模組經配置以顯示決策回饋，使教師輸入作答之對應問答題成績及EPA（Entrustable Professional Activity，可信賴專業活動）能力評級。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for pharmaceutical prescription review training are provided. The pharmaceutical prescription review training system comprises a lesson creation module, a student exercise module and an instructor management module. The lesson creation module is configured to receive a plurality of groups of case information and integrate them into a plurality of lessons, wherein each group of case information comprises a trigger event for a decision task, a simulation prescription note and at least one Q&amp;amp;A question. The student exercise module is configured to display the plurality of lessons, prompting a student to perform corresponding decision tasks and input corresponding decision feedbacks comprising corresponding answers to the Q&amp;amp;A questions, and generate a group of decision scores. The instructor management module is configured to display the decision feedbacks, prompting an instructor to input corresponding Q&amp;amp;A scores to the answers and an EPA (Entrustable Professional Activity) capability rating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:藥劑處方審查訓練方法</p>
        <p type="p">21、22、23:步驟</p>
        <p type="p">24、25、26:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="1084px" img-content="tif" inline="yes" orientation="portrait" width="568px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622589</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144822</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G02B27/01</main-classification>
        <further-classification edition="200601120241231B">B08B3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商群豐駿科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARUX TECHNOLOGY PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昱嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅靜怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHING-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋立偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, LI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>設置在具有擋風玻璃的運輸工具的電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE INSTALLED ON VEHICLE WITH WINDSHIELD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設置在具有擋風玻璃的運輸工具的電子裝置，包括顯示模組、清潔模組與集塵模組。顯示模組包括發光單元以及覆蓋層。發光單元適於發出光束。覆蓋層設置於發光單元上且重疊發光單元。擋風玻璃與顯示模組相對設置。光束穿透覆蓋層，射至擋風玻璃，使人眼可觀察到虛像形成於擋風玻璃後方。清潔模組與集塵模組分別設置於顯示模組的相對兩側。至少部分清潔模組鄰近覆蓋層，而集塵模組具有開口，且開口鄰近覆蓋層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device installed on a vehicle with a windshield includes a display module, a cleaning module, and a dust collection module. The display module includes a light emitting unit and a cover layer. The light emitting unit is adapted to emit a light beam. The cover layer is disposed on the light emitting unit and overlaps the light emitting unit. The windshield is positioned opposite the display module. The light beam penetrates the cover layer and is incident on the windshield, allowing the human eye to observe a virtual image formed behind the windshield. The cleaning module and the dust collection module are respectively located on opposite sides of the display module. At least a portion of the cleaning module is adjacent to the cover layer, and the dust collection module has an opening adjacent to the cover layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:電子裝置</p>
        <p type="p">110:顯示模組</p>
        <p type="p">114:覆蓋層</p>
        <p type="p">120a:清潔模組</p>
        <p type="p">124:出風口</p>
        <p type="p">125:偵測組件</p>
        <p type="p">130a:集塵模組</p>
        <p type="p">132:開口</p>
        <p type="p">F:氣流</p>
        <p type="p">S:容置槽</p>
        <p type="p">S1:第一側</p>
        <p type="p">S2:第二側</p>
        <p type="p">S3:第三側</p>
        <p type="p">S4:第四側</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="466px" img-content="tif" inline="yes" orientation="portrait" width="724px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622678</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144824</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G05D7/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世喆科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBAL PRECISE INSTRUMENT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉正輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>氣體流量調節裝置</chinese-title>
        <english-title>GAS FLOW REGULATING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種氣體流量調節裝置包括控制器、閥門、輸入管路、輸出管路與流量計。該閥門根據該流量調節控制訊號來調整該閥門之輸出口之截面積。該流量計用以將該輸入管路之一流量值進行計算且傳送至該控制器。當該控制器接收到該生產機台所傳送之該閒置運作訊號時，則該控制器根據該閒置運作訊號與該流量值來傳送該流量調節控制訊號至該閥門以縮小該閥門之輸出口之截面積。在該控制器縮小該閥門之輸出口之截面積的過程中，該控制器會同時根據該流量計所傳送之該流量值來判斷是否已達到一閒置流量預設值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas flow regulating device includes a controller, a valve, an input pipeline, an output pipeline, and a flowmeter. The valve adjusts the cross-sectional area of its outlet according to a flow regulation control signal. The flowmeter calculates and transmits a flow value of the input pipeline to the controller. If the controller receives an idle signal from a production machine, the controller will transmit the flow regulation control signal to the valve to reduce the cross-sectional area of the outlet of the valve based on the idle signal and the flow value. While the controller is reducing the cross-sectional area of the valve outlet, the controller will simultaneously determine whether an idle flow predetermined value has been reached based on the flow value transmitted by the flowmeter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣體流量調節裝置</p>
        <p type="p">110:控制器</p>
        <p type="p">120:閥門</p>
        <p type="p">130:輸入管路</p>
        <p type="p">140:輸出管路</p>
        <p type="p">150:流量計</p>
        <p type="p">170:偵測器</p>
        <p type="p">180:警示單元</p>
        <p type="p">190:無線網路單元</p>
        <p type="p">200:生產機台</p>
        <p type="p">300:氣體輸出裝置</p>
        <p type="p">400:廢氣處理機台</p>
        <p type="p">AS:警示訊號</p>
        <p type="p">NG:惰性氣體</p>
        <p type="p">EG:廢氣</p>
        <p type="p">FV:流量值</p>
        <p type="p">OS:運作狀態訊號</p>
        <p type="p">NOS:正常運作訊號</p>
        <p type="p">DOS:閒置運作訊號</p>
        <p type="p">FCS:流量調節控制訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="713px" img-content="tif" inline="yes" orientation="portrait" width="1048px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622590</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144831</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250203B">G02B27/01</main-classification>
        <further-classification edition="200601120250203B">A42B3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石文龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, WEN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱正弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JENG-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡旻諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>頭戴式裝置</chinese-title>
        <english-title>HEAD-MOUNTED DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種頭戴式裝置包括多個夾持組件、彈性復位件以及調整機構。夾持組件用以夾持使用者頭部的相對兩側。彈性復位件耦接所述多個夾持組件。調整機構耦接所述多個夾持組件並包括用以承靠於所述使用者頭部的固定件以及用以相對所述固定件移動的移動件，所述移動件包括導引斜面，當所述移動件受外力而移動至鬆開位置時，所述多個夾持組件經由所述導引斜面的導引而分別往遠離所述使用者頭部的方向移動，當所述外力消失，所述多個夾持組件經由所述彈性復位件的彈性復位力而往靠近所述使用者頭部的方向移動，並使所述移動件復位至夾緊位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A head-mounted device includes a plurality of clamping components, an elastic component and an adjusting mechanism. The plurality of clamping components are configured to clamp two opposite sides of a user’s head. The elastic component is coupled between the plurality of clamping components. The adjusting mechanism is coupled between the plurality of clamping components and includes a fixing component leaning against the user’s head and a moving component moved relatively to the fixing component. The moving component comprises a guiding surface. When the moving component is moved by a force to a release position, the plurality of clamping components is moved away from the user’s head by the guidance of the guiding surface. When the force is gone, the plurality of clamping components is moved toward the user’s head and the moving component is moved back to a clamping position by an restoring force of the elastic component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:頭戴式裝置</p>
        <p type="p">110:夾持組件</p>
        <p type="p">113,1342,1343:凸柱</p>
        <p type="p">116:罩覆部</p>
        <p type="p">120:彈性復位件</p>
        <p type="p">130:調整機構</p>
        <p type="p">132:移動件</p>
        <p type="p">1321:導引斜面</p>
        <p type="p">1324:受力端</p>
        <p type="p">1322,1323:移動件滑槽</p>
        <p type="p">134:固定件</p>
        <p type="p">1344:止擋部</p>
        <p type="p">140:鎖定件</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="716px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622382</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144834</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">F16B21/09</main-classification>
        <further-classification edition="200601120260302B">F16B5/06</further-classification>
        <further-classification edition="202601120260302B">H10W40/60</further-classification>
        <further-classification edition="200601120260302B">F16B19/02</further-classification>
        <further-classification edition="200601120260302B">F16B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍隆國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIVEGRAND INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>彈性扣體及其扣接方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種彈性扣體及其扣接方法，其包含扣接頭部，扣接頭部大於被扣物體之限制部，彈性扣體穿過或通過被扣物體而組接或設置於物體，用以使物體與被扣物體組合或彈性組合。藉此，可完成至少兩物體之快速結合與分離，而達到反復快速結合與分離之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:彈性扣體</p>
        <p type="p">11:扣接頭部</p>
        <p type="p">111:斜面</p>
        <p type="p">12:身部</p>
        <p type="p">13:彈性元件</p>
        <p type="p">14:對應部</p>
        <p type="p">15:擋抵部</p>
        <p type="p">10:被扣物體</p>
        <p type="p">101:限制部</p>
        <p type="p">20:物體</p>
        <p type="p">h:抬起距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="453px" img-content="tif" inline="yes" orientation="portrait" width="991px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621786</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144835</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">B01D61/02</main-classification>
        <further-classification edition="200601120241220B">B01D61/08</further-classification>
        <further-classification edition="200601120241220B">B01D61/12</further-classification>
        <further-classification edition="200601120241220B">B01D65/02</further-classification>
        <further-classification edition="202301120241220B">C02F1/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡事康流體科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLUXTEK INTERNATIONAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴炎村</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YEN-TSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡順利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHUN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有自動逆洗功能的直輸淨水系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有自動逆洗功能的直輸淨水系統，包含：原水入口部、第一壓力閥、過濾裝置、第二壓力閥、淨水出口部、廢水出口部，以及能量回收水路，其液體連通於過濾裝置、第二壓力閥及第一壓力閥。其中，能量回收水路配置為在淨水出口部關閉時蓄積淨水以累積壓力，並透過所累積壓力將淨水逆流至過濾出水口，以清洗過濾組件。具有自動逆洗功能的直輸淨水系統適用在每次使用淨水輸出後自動清洗其直輸淨水系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:具有自動逆洗功能的直輸淨水系統</p>
        <p type="p">11:原水入口部</p>
        <p type="p">12:淨水出口部</p>
        <p type="p">13:廢水出口部</p>
        <p type="p">100:第一壓力閥</p>
        <p type="p">110_I(IN):第一入水閥</p>
        <p type="p">110_O(OUT):第一出水閥</p>
        <p type="p">120_I:第一入水口</p>
        <p type="p">120_O:第一出水口</p>
        <p type="p">200:第二壓力閥</p>
        <p type="p">210_I(IN):第二入水閥</p>
        <p type="p">210_O(OUT):第二出水閥</p>
        <p type="p">220_I:第二入水口</p>
        <p type="p">220_O:第二出水口</p>
        <p type="p">500:過濾裝置</p>
        <p type="p">510:過濾入水口</p>
        <p type="p">520:過濾出水口</p>
        <p type="p">530:過濾廢水出口</p>
        <p type="p">550:過濾組件</p>
        <p type="p">560:原水區域</p>
        <p type="p">570:淨水區域</p>
        <p type="p">600:能量回收水路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.png" file="d10019.TIF" giffile="ed10019.png" height="673px" img-content="tif" inline="yes" orientation="portrait" width="739px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622718</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144836</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F3/044</main-classification>
        <further-classification edition="200601120250303B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧志平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡德宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TE TSOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>觸控自我測試方法、使用其之觸控裝置以及使用其之觸控積體電路</chinese-title>
        <english-title>SELF-TEST METHOD FOR TOUCH DEVICE, TOUCH DEVICE AND TOUCH SENSING INTEGRATED CIRCUIT USING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的較佳實施例關於一種觸控自我測試方法、使用其之觸控裝置以及使用其之觸控積體電路，此觸控自我測試方法用於觸控系統在低耗電模式中自我測試。方法包括：提供觸控比較電路比較觸控電容端與參考電容端充電速度；在低耗電模式中定期進行觸控檢測；經過預設次數後，透過數據控制改變觸控電容端補償電容大小，使理論電容值超過觸控感測門檻；判斷觸控比較電路輸出；若輸出觸控致能訊號，維持低耗電模式；若輸出觸控失能訊號，喚醒系統並校正觸控感測門檻。此方法可在低耗電模式中有效進行自我測試和校正。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The preferred embodiment of the present invention describes a self-test method for touch device, touch device and touch sensing integrated circuit using the same. The method includes: providing a touch comparison circuit to compare charging speeds of touch capacitance and reference capacitance terminals; periodically performing touch detection in low power mode; after a preset number of detections, altering the compensation capacitance of the touch capacitance terminal via data control, making the theoretical capacitance exceed the touch sensing threshold; evaluating the touch comparison circuit output; if a touch enable signal is output, maintaining low power mode; if a touch disable signal is output, waking the system and calibrating the touch sensing threshold. This method effectively performs self-testing and calibration in low power mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S401~S414:本發明一較佳實施例的觸控自我測試方法之流程步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="990px" img-content="tif" inline="yes" orientation="portrait" width="757px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623095</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144847</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01Q15/00</main-classification>
        <further-classification edition="200601120250303B">H01Q3/44</further-classification>
        <further-classification edition="200601120250303B">H01P1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和成欣業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOCHENG CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANG HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宣辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSUAN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鞠志遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHU FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉命權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MING CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游本堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, PEN CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴昭旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, ZHAO XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡仁偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, REN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZONG YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡大鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, DA CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>雙層擇頻結構</chinese-title>
        <english-title>A DOUBLE-LAYER FREQUENCY-SELECTIVE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙層擇頻結構，其包括一第一頻率選擇層，第一頻率選擇層具有陣列狀排列之複數個第一圖案單元，任一第一圖案單元具有一第一阻隔單元及可供電磁波穿透之一第一孔徑單元；一第一基板層疊並結合第一頻率選擇層；一中間介質層層疊並結合第一基板；一第二基板層疊並結合中間介質層；而一第二頻率選擇層層疊並結合第二基板，且第二擇頻層具有陣列狀排列之複數個第二圖案單元，任一第二圖案單元具有可供反射電磁波之一第二阻隔單元及一第二孔徑單元，藉此，即可有效減少雷達反射之截面積，並增加截頻之寬度，進而提高匿蹤之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a double-layer frequency-selective structure, which includes a first frequency selective layer. The first frequency selective layer has a plurality of first pattern units arranged in an array. Each first pattern unit has a first blocking unit and a first aperture unit that can be penetrated by electromagnetic waves. A first substrate is stacked and combined with the first frequency selective layer, and an intermediate dielectric layer is stacked and combined with the first substrate. A second substrate is stacked and combined with the intermediate dielectric layer, and a second frequency selective layer is stacked and combined with the second substrate, and the second frequency selective layer has a plurality of second pattern units arranged in an array, and each second pattern unit has a second blocking unit and a second aperture unit for reflecting electromagnetic waves, thereby effectively reducing the cross-sectional area of ​​radar reflection and increasing the width of the cut-off frequency, and thus improving the concealment effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雙層擇頻結構</p>
        <p type="p">2:第一頻率選擇層</p>
        <p type="p">21:第一圖案單元</p>
        <p type="p">22:第一阻隔單元</p>
        <p type="p">221:第一方形片</p>
        <p type="p">222:第一方形框</p>
        <p type="p">23:第一孔徑單元</p>
        <p type="p">231:第一方形孔</p>
        <p type="p">3:第一基板</p>
        <p type="p">4:中間介質層</p>
        <p type="p">5:第二基板</p>
        <p type="p">6:第二頻率選擇層</p>
        <p type="p">61:第二圖案單元</p>
        <p type="p">62:第二阻隔單元</p>
        <p type="p">621:第二方形片</p>
        <p type="p">622:第二方形框</p>
        <p type="p">63:第二孔徑單元</p>
        <p type="p">631:第二方形孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="1097px" img-content="tif" inline="yes" orientation="portrait" width="760px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622679</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144848</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">G05D7/06</main-classification>
        <further-classification edition="200601120241230B">F16K31/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁祥捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, HSIANG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁祥捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, HSIANG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有複數電磁閥之流量控制裝置</chinese-title>
        <english-title>FLOW CONTROL DEVICE WITH MULTIPLE SOLENOID VALVES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具有複數電磁閥之流量控制裝置，包括一本體、至少二個流孔、一第一管路、一第二管路及至少二組電磁閥。該本體具有一流體入口及一流體出口，所述流孔設置於該本體內且具有不同孔徑。該第一管路連接該流體入口至所述流孔，該第二管路連接所述流孔至該流體出口。每組電磁閥包括一線圈、一靜鐵、一動鐵、一閥門及一彈簧，所述電磁閥可獨立控制所述流孔的開啟或關閉。當所述流孔包括n個流孔且設置n組電磁閥時，其開啟組合可產生2        &lt;sup&gt;n&lt;/sup&gt;種不同流量，藉此提供更精確的流量控制。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a flow control device with a plurality of solenoid valves, comprising a body, at least two flow ports, a first passage, a second passage, and at least two solenoid valves. The body has a fluid inlet and a fluid outlet, with the flow ports disposed inside the body having different hole diameters. The first passage connects the fluid inlet to the flow ports, and the second passage connects the flow ports to the fluid outlet. Each solenoid valve includes a coil, a static iron core, a moving iron core, a valve, and a spring, where each solenoid valve can independently control the opening or closing of its corresponding flow port. When there are n flow ports, each paired with n solenoid valves, the various combinations of solenoid valves can generate 2        &lt;sup&gt;n&lt;/sup&gt;distinct flow rates, thereby providing more precise flow control.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:流量控制裝置</p>
        <p type="p">10:本體</p>
        <p type="p">11:流體入口</p>
        <p type="p">12:流體出口</p>
        <p type="p">21:第一流孔</p>
        <p type="p">22:第二流孔</p>
        <p type="p">23:第三流孔</p>
        <p type="p">24:第四流孔</p>
        <p type="p">31:第一管路</p>
        <p type="p">32:第二管路</p>
        <p type="p">41:第一電磁閥</p>
        <p type="p">42:第二電磁閥</p>
        <p type="p">43:第三電磁閥</p>
        <p type="p">44:第四電磁閥</p>
        <p type="p">51、52、53、54:電線</p>
        <p type="p">X:區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="749px" img-content="tif" inline="yes" orientation="portrait" width="769px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623188</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144850</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03B5/12</main-classification>
        <further-classification edition="200601120250303B">H03B5/02</further-classification>
        <further-classification edition="200601120250303B">H03L7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭紹瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>振盪電路及其緩衝器</chinese-title>
        <english-title>OSCILLATION CIRCUIT AND BUFFER THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種振盪電路，包括振盪器及緩衝器。振盪器根據類比控制訊號提供至少一振盪訊號。緩衝器耦接於振盪器，緩衝器包括至少一輸入端、至少一輸出端、緩衝單元、第一電容陣列及第二電容陣列。至少一輸入端用以接收至少一振盪訊號，至少一輸出端用以提供至少一緩衝訊號。緩衝單元耦接於至少一輸入端與至少一輸出端之間。第一電容陣列耦接於緩衝單元，且根據至少一第一數位訊號改變第一電容陣列的等效電容值。第二電容陣列耦接於緩衝單元，且根據至少一第二數位訊號改變第二電容陣列的等效電容值。至少一第二數位訊號是根據類比控制訊號所產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An oscillation circuit includes an oscillator and a buffer. The oscillator provides at least one oscillation signal according to an analog control signal. The buffer is coupled to the oscillator, and includes at least one input terminal, at least one output terminal, a buffer unit, a first capacitor array, and a second capacitor array. The at least one input terminal receives the at least one oscillation signal, and the at least one output terminal provides at least one buffered signal. The buffer unit is coupled between the at least one input terminal and the at least one output terminal. The first capacitor array is coupled to the buffer unit and changes its capacitance value according to at least one first digital signal. The second capacitor array is coupled to the buffer unit and changes its capacitance value according to at least one second digital signal. The at least one second digital signal is generated based on the analog control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:振盪電路</p>
        <p type="p">OS:振盪器</p>
        <p type="p">BUF:緩衝器</p>
        <p type="p">In1,In2:輸入端</p>
        <p type="p">Out1,Out2:輸出端</p>
        <p type="p">VC:類比控制訊號</p>
        <p type="p">dvc1:第一數位訊號</p>
        <p type="p">dvc2:第二數位訊號</p>
        <p type="p">Gm:緩衝單元</p>
        <p type="p">CapArray1:第一電容陣列</p>
        <p type="p">CapArray2:第二電容陣列</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="680px" img-content="tif" inline="yes" orientation="portrait" width="795px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622529</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144852</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250203B">G01R31/34</main-classification>
        <further-classification edition="202001120250203B">G01R31/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂怡萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖元楷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YUAN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝文政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, WEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建評</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>驅動器及其偵測方法</chinese-title>
        <english-title>DRIVE AND DETECTION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">驅動器的偵測方法，包含步驟:(S1)檢查驅動器的運作參數是否正常，如是則執行步驟(S2)，如否則執行步驟(S4)；(S2)確認異常旗標的數值是否為1，如是則執行步驟(S3)，如否則執行步驟(S4)；(S3)不啟動緩啟動電路；(S4)控制開關導通；(S5)計數預定時間對電容預充電；(S6)確認電容的電壓是否大於預設電壓閥值，如是則執行步驟(S7)，如否則執行步驟(S8)； (S7)控制驅動器進入待機模式；以及(S8控制開關斷開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Detection method of a drive includes steps: (S1), determining whether operation parameters are normal, if yes, perform step (S2), or perform step (S4); (S2), determining whether value of an abnormal flag is 1, if yes, perform step (S3), or perform step (S4); (S3), not starting a soft-start circuit; (S4), controlling a switch to be closed; (S5), counting a predetermined time to pre-charge a capacitor; (S6), determining whether a voltage of the capacitor larger than a predetermined voltage threshold, if yes, perform step (S7), or perform step (S8); (S7), controlling the drive into a standby mode; and (S8), controlling the switch to be opened.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S8:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="972px" img-content="tif" inline="yes" orientation="portrait" width="706px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622926</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144856</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250729B">G09B19/00</main-classification>
        <further-classification edition="200601120250729B">G09B5/06</further-classification>
        <further-classification edition="200601120250729B">G06F3/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優派國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIEWSONIC INTERNATIONAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林心玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　國偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, KEVIN-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧與明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>互動式學習材料產生方法及其相關電腦系統</chinese-title>
        <english-title>INTERACTIVE LEARNING MATERIAL GENERATION METHOD AND RELATED COMPUTER SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種互動式學習材料產生方法，用於一電腦系統，包含有以一少樣本學習方法對一資源資料庫之資料進行辨識，以決定至少一學習主題；比對一指定主題與該至少一學習主題，以決定一比對結果；根據該比對結果，收集相關於該比對結果之學習資料；以及根據一使用者之一學習程度，調整相關於該學習資料其學習內容之一難易度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interactive learning material generation method, for a computer system, includes recognizing data of a resource database with a few-shot learning (FSL) method to determine at least an learning topic; comparing a specified topic to the at least to an learning topic to determine a comparison result; collecting learning data associated with the comparison result according to the comparison result; and adjusting a difficulty of the learning content related to the learning data according to a user's learning level..</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:互動式學習材料產生方法20</p>
        <p type="p">202-212:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="824px" img-content="tif" inline="yes" orientation="portrait" width="603px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622432</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144857</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250729B">F24S25/30</main-classification>
        <further-classification edition="201801120250729B">F24S25/63</further-classification>
        <further-classification edition="201401120250729B">H02S20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富陽能開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇家瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙元寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有防凹陷強化支撐結構之太陽能模組陣列框架系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係包括一太陽能模組陣列框架及複數防凹陷強化支撐結構。太陽能模組陣列框架係具有複數第一框部及第二框部；每一防凹陷強化支撐結構係具有一主支撐框條、複數T型支撐件、複數第一L轉接片、複數下壓扣片及複數第二L轉接片。主支撐框條設於相鄰二第一框部之間；複數T型支撐件沿主支撐框條分佈而用以架設主支撐框條；每一第一L轉接片係將T型支撐件及主支撐框條固定為一體。每一下壓扣片係以壓扣結構壓扣於第二框部，每一第二L轉接片係連結固定主支撐框條及下壓扣片。達成可解決因跨距較長而下彎的問題，及可適用於支撐鋼梁位置不同之各類工廠屋頂等優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:太陽能模組陣列框架</p>
        <p type="p">10A:太陽能模組容納空間</p>
        <p type="p">12:第二框部</p>
        <p type="p">20:防凹陷強化支撐結構</p>
        <p type="p">21:主支撐框條</p>
        <p type="p">211:側凹部</p>
        <p type="p">22:T型支撐件</p>
        <p type="p">23:第一L轉接片</p>
        <p type="p">231:第一螺鎖元件</p>
        <p type="p">24:下壓扣片</p>
        <p type="p">91:太陽能模組</p>
        <p type="p">92:框架</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="721px" img-content="tif" inline="yes" orientation="portrait" width="988px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621634</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144865</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250203B">A47L19/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾緹亞國際興業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>T&amp;Y KITCHEN APPLIANCE CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仁達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JEN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>烘碗機結構</chinese-title>
        <english-title>BOWL DRYER STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種烘碗機結構，包括：殼本體，具有連通的開口及容置空間；        &lt;br/&gt;門扉，可相對殼本體位移的組設於殼本體，門扉用以封閉或開啟開口；加熱器裝設於門扉，加熱器供以對容置空間內輸送熱風，是以，由於加熱器裝設於門扉，進而可避免加熱器占用容置空間，以達到妥善利用烘碗機內部空間的效果。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bowl dryer structure includes a housing having an opening and a receiving space in communication with the opening, a door movably disposed in the housing and used to close or open the opening, a heater disposed in the door and used to transport hot air to the receiving space, which can avoid the heater to occupy the receiving space, so as to achieve the effect of making proper use of the internal space of the bowl dryer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼本體</p>
        <p type="p">10A:開口</p>
        <p type="p">11:頂板</p>
        <p type="p">12:底板</p>
        <p type="p">13:側板</p>
        <p type="p">14:後板</p>
        <p type="p">20:門扉</p>
        <p type="p">20A:頂端</p>
        <p type="p">20B:底端</p>
        <p type="p">21:內側面</p>
        <p type="p">22:外側面</p>
        <p type="p">30:加熱器</p>
        <p type="p">31:電機盒</p>
        <p type="p">32:操作面板</p>
        <p type="p">40:第一碗籃</p>
        <p type="p">50:第二碗籃</p>
        <p type="p">X:滑移方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="940px" img-content="tif" inline="yes" orientation="portrait" width="778px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622656</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144867</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250501B">G05B19/406</main-classification>
        <further-classification edition="200601120250501B">G05B19/408</further-classification>
        <further-classification edition="200601120250501B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余承翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHENG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳家明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>馬達驅動控制裝置及馬達驅動監控方法</chinese-title>
        <english-title>MOTOR DRIVE CONTROL DEVICE AND MOTOR DRIVE MONITORING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種控制裝置，包含標籤單元、管理單元、特徵萃取單元及異常判斷單元。標籤單元用以自多個原始資料取得多個區段資料，且用以分析每個區段資料，以分別對區段資料定義標籤。管理單元耦接於標籤單元，用以自標籤單元接收該些區段資料。管理單元用以將該些區段資料中具有相同之標籤的一部分分類於資料庫，以作為資料庫中的多個資料點。特徵萃取單元耦接於管理單元，用以分析該些資料點的複數個特徵值。異常判斷單元耦接於特徵萃取單元，用以將該些特徵值與異常閾值相比對，以產生通知訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control device includes a label unit, a management unit, a feature extraction unit and an abnormality determination unit. The label unit is configured to obtain multiple segment data from multiple raw data, and is configured to analyze the segment data to label a tag for each segment data respectively. The management unit is coupled to the label unit and configured to receive the segment data from the label unit. The management unit is configured to classify a portion of the segment data with the same label into a databas as multiple data points in the database. The feature extraction unit is coupled to the management unit and configured to analyze multiple feature values of the data points. The abnormality determination unit is coupled to the feature extraction unit and configured to compare the feature values with an abnormal threshold to generate a notification message.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:控制裝置</p>
        <p type="p">210:控制模組</p>
        <p type="p">220:監控模組</p>
        <p type="p">221:資料收集單元</p>
        <p type="p">222:標籤單元</p>
        <p type="p">223:管理單元</p>
        <p type="p">224:特徵萃取單元</p>
        <p type="p">225:異常判斷單元</p>
        <p type="p">226:資料輸出單元</p>
        <p type="p">230:伺服馬達</p>
        <p type="p">240:感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="701px" img-content="tif" inline="yes" orientation="portrait" width="959px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623423</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144869</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260223B">H10D80/20</main-classification>
        <further-classification edition="202501120260223B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新唐科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUVOTON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昀融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體裝置。半導體裝置包括基板、汲極結構、閘極區、源極區以及電阻結構。汲極結構設置於基板上並且包括汲極接墊、接入端以及汲極區。汲極接墊設置於基板上。接入端設置於汲極接墊上。汲極區配置為一環形形狀且環繞汲極接墊。閘極區設置於基板上且環繞汲極區。源極區設置於基板上且環繞閘極區。電阻結構設置於汲極接墊與汲極區之間且電性連接接入端與汲極區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The semiconductor device includes a substrate, a drain structure, a gate region, a source region, and a resistor structure. The drain structure is disposed on the substrate and includes a drain pad, an access terminal, and a drain region. The drain pad is disposed on the substrate. The access terminal is disposed on the drain pad. The drain region is configured in a ring shape encircling the drain pad. The gate region is disposed on the substrate and encircles the drain region. The source region is disposed on the substrate and encircles the gate region. The resistor structure is disposed between the drain pad and the drain region and is electrically connected to the access terminal and the drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">104D:汲極區</p>
        <p type="p">108:閘極區/閘極結構</p>
        <p type="p">108E:閘極電極</p>
        <p type="p">110:源極區</p>
        <p type="p">112:電阻結構</p>
        <p type="p">114:基極區</p>
        <p type="p">116:閘極介電層</p>
        <p type="p">118:(閘極)間隔物</p>
        <p type="p">120:閘極場板</p>
        <p type="p">122:隔離結構</p>
        <p type="p">124:阱區</p>
        <p type="p">126:阱區</p>
        <p type="p">128:阱區</p>
        <p type="p">130:阱區</p>
        <p type="p">AA:主動區</p>
        <p type="p">E1:邊界</p>
        <p type="p">E2:邊界</p>
        <p type="p">X:X方向</p>
        <p type="p">Y:Y方向</p>
        <p type="p">Z:Z方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.png" file="d10018.TIF" giffile="ed10018.png" height="725px" img-content="tif" inline="yes" orientation="portrait" width="1022px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622797</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144889</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120241231B">G06F40/232</main-classification>
        <further-classification edition="202301120241231B">G06N3/0464</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博相科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳忠興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林邦棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>英文拼字校正方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種英文拼字校正方法，其主要對每一輸入英文字串之各英文字元進行編碼且將所對應之編碼數字做正規化處理以取得初始編號陣列數值，再將編碼數字進行距離計算及做正規化處理已取得初始距離陣列數值，再利用輸入英文字串之英文字元字數來產生可變長度的特徵圖，該特徵圖進行一維之卷積神經網路運算及全連接運算處理產生特徵圖，該特徵圖再以雙向長短期記憶(LSTM)網路輸出並進行全連接運算處理產生特徵圖，再進行概率辨識並輸出概率字串，而後再辨識所述概率字串而輸出一文拼字校正結果，以解決習知有掉字或多字的問題發生，進而達到利用字元序列關係與字元距離及可變陣列長度來精準校正英文拼字之功效者。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="846px" img-content="tif" inline="yes" orientation="portrait" width="644px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623246</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144891</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04N7/15</main-classification>
        <further-classification edition="200601120250303B">H04N7/14</further-classification>
        <further-classification edition="201101120250303B">H04N21/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚國鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUO-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江仁秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, JEN-CHIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>視訊處理方法、視訊處理裝置以及相機驅動程式</chinese-title>
        <english-title>VIDEO PROCESSING METHOD, VIDEO PROCESSING DEVICE, AND CAMERA DRIVER PROGRAM THEREFOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種用於視訊會議之視訊處理方法，適用於一電子裝置，此電子裝置具有一相機，且安裝有一相機驅動程式以及一會議程式，且相機具有一硬體快門。此視訊處理方法包含：利用相機驅動程式獲取一名片圖像；利用相機驅動程式驅動相機以獲取一串流視訊；利用相機驅動程式將名片圖像添加於串流視訊而產生一處理後串流視訊；以及利用會議程式呈現處理後串流視訊。本案並提供一種視訊處理裝置以及一種相機驅動程式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A video processing method for a video conference is provided. The video processing method is adapted to an electronic device. The electronic device has a camera, which has a hardware shutter, and is installed with a camera driver program and a conference program. The video processing method comprises the following steps. Firstly, the camera driver program is used to retrieve a business card image. Then, the camera driver program is used to access a streaming video. Afterward, the camera driver program is used to add the business card image in the streaming video to generate a processed streaming video. Then, the processed streaming video is shown through the video conference program. A video processing device and a camera driver program is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:視訊處理裝置</p>
        <p type="p">120:名片設定單元</p>
        <p type="p">140:視訊處理單元</p>
        <p type="p">20:電子裝置</p>
        <p type="p">22:相機</p>
        <p type="p">222:硬體快門</p>
        <p type="p">24:儲存元件</p>
        <p type="p">DRV:相機驅動程式</p>
        <p type="p">APP:會議程式</p>
        <p type="p">BC:名片圖像</p>
        <p type="p">SV0:串流視訊</p>
        <p type="p">SV1:處理後串流視訊</p>
        <p type="p">D1:使用者資訊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="886px" img-content="tif" inline="yes" orientation="portrait" width="680px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622231</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144896</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201001120250123B">C12N5/076</main-classification>
        <further-classification edition="200601120250123B">C12M3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許岩得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUUW, YAN-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>練運澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAN, YUN-ZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林春福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUEN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>以血漿萃取物進行小鼠卵丘卵母細胞複合體的體外成熟培養系統及其方法</chinese-title>
        <english-title>MATURATION CULTURE SYSTEM AND METHOD THEREOF FOR MOUSE CUMULUS OOCYTE COMPLEXES WITH PLASMA EXTRACTS IN VITRO</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種小鼠卵丘卵母細胞複合體的體外成熟培養方法包含：製備至少一血漿萃取物，且該血漿萃取物萃取自一動物血液；製備至少一小鼠卵丘卵母細胞複合體，且該小鼠卵丘卵母細胞複合體取自一母小鼠濾泡；將該小鼠卵丘卵母細胞複合體進行體外成熟培養於一培養液，以獲得一初培養小鼠卵丘卵母細胞複合體；將該血漿萃取物添加調製於該培養液及初培養小鼠卵丘卵母細胞複合體，以獲得一已調製培養液；及將該初培養小鼠卵丘卵母細胞複合體持續進行體外成熟培養於該已調製培養液，以獲得至少一已成熟小鼠卵丘卵母細胞複合體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A maturation culture method includes: prefabricating at least one plasma extract extracting from an animal blood; prefabricating at least one post-implanted mouse blastocyst obtaining from a female mouse; culturing the post-implanted mouse blastocyst in a media material &lt;i&gt;in vitro&lt;/i&gt; to obtain a preliminary cultured post-implanted blastocyst; adding the plasma extract to the media material and the preliminary cultured post-implanted blastocyst to obtain an adjusted media material; and continuously culturing the preliminary cultured post-implanted blastocyst in the adjusted media material to obtain a full maturated post-implanted blastocyst.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:培養液製備單元</p>
        <p type="p">2:體外成熟培養單元</p>
        <p type="p">20:血漿萃取物製備單元</p>
        <p type="p">22:小鼠卵丘卵母細胞複合體製備單元</p>
        <p type="p">3:已成熟小鼠卵丘卵母細胞複合體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="306px" img-content="tif" inline="yes" orientation="portrait" width="671px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622796</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144898</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250303B">G06F40/10</main-classification>
        <further-classification edition="202001120250303B">G06F40/166</further-classification>
        <further-classification edition="201901120250303B">G06N20/00</further-classification>
        <further-classification edition="202301120250303B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神通資訊科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAC INFORMATION TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃匡庸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUANG YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林顥蒼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HAO TSANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YA WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於預收集資料的人工智慧輔助生成永續報告書的系統及其方法</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE-ASSISTED ENVIRONMENTAL SOCIAL GOVERNANCE REPORT GENERATION SYSTEM BASED ON PRE-COLLECTED DATA AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於預收集資料的人工智慧輔助生成永續報告書的系統及其方法，報告書專案管理端透過報告書管理伺服端，建立報告書專案與生成編審分配請求，再基於編審分配請求指定對應的報告書編輯端，報告書編輯端透過人工智慧平台，將關鍵內容訊息提供至介接服務檢索強化生成的大型語言模型，以產生AI章節內容訊息，再對AI章節內容訊息的文字、圖片、表格以及版面的編輯以生成章節內容與提交審核，當所有的編審分配請求皆取得對應的審核完成回應時，報告書管理伺服端將所有的章節內容填入於報告書樣板，以生成永續報告書，藉此可以達成藉由人工智慧的輔助與預收集的資料正確、快速且便利生成永續報告書的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An artificial intelligence-assisted environmental social governance (ESG) report generation system based on pre-collected data and a method thereof are provided. Report project is created and editorial assignment request is generated by report project management terminal through report management server. Key content message is provided to large language model which is interface retrieval-augmented generation (RAG) to generate artificial intelligence (AI) chapter content information by report editor terminal which is designated based on editorial assignment request through AI platform. Text, pictures, tables and layout of AI chapter content information are edited to generate chapter content than chapter content submitted for review. All chapter contents are filled in report template to generate ESG by report management server. Therefore, the efficiency of generating ESG correctly, quickly and conveniently based on artificial intelligence-assisted and pre-collected data may be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:報告書專案管理端</p>
        <p type="p">20:人工智慧平台</p>
        <p type="p">30:報告書編輯端</p>
        <p type="p">31:回應模組</p>
        <p type="p">32:AI章節內容訊息模組</p>
        <p type="p">33:編輯模組</p>
        <p type="p">40:報告書審核端</p>
        <p type="p">50:報告書管理伺服端</p>
        <p type="p">51:報告書樣板資料庫</p>
        <p type="p">52:查詢模組</p>
        <p type="p">53:頁面生成模組</p>
        <p type="p">54:編輯通知模組</p>
        <p type="p">55:審核通知模組</p>
        <p type="p">56:報告書生成模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="1018px" img-content="tif" inline="yes" orientation="portrait" width="760px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622230</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144900</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201001120241212B">C12N5/07</main-classification>
        <further-classification edition="201501120241212B">A61K35/30</further-classification>
        <further-classification edition="200601120241212B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚醫療財團法人林口長庚紀念醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG MEMORIAL HOSPITAL, LINKOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛詒仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, YI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於生產外泌體的方法及其所製得的外泌體暨其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於生產外泌體的方法，其包括：將角膜基質細胞(CSKs)培養於一含有維生素C的培養基中，而得到CSKs的細胞培養物；以及自該細胞培養物中收取外泌體。本發明亦揭示由上述方法所製得的外泌體可被用來促進角膜內皮細胞增生以及角膜內皮傷口癒合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="814px" img-content="tif" inline="yes" orientation="portrait" width="712px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622535</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144901</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120241219B">G01S13/931</main-classification>
        <further-classification edition="202001120241219B">G01S13/93</further-classification>
        <further-classification edition="200601120241219B">G01S13/88</further-classification>
        <further-classification edition="200601120241219B">G01S7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智易科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARCADYAN TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許展維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝政翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIE, JENG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭世炘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHIH-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭軒宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, HSUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭宏文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, HUNG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭信郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>雷達校正裝置及其操作方法</chinese-title>
        <english-title>RADAR CALIBRATING DEVICE AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種雷達校正裝置，用於校正安裝於車輛之雷達系統。雷達系統包含雷達模組以及雷達控制單元用以接收車輛輸出的第一訊號。雷達校正裝置包括記憶體，儲存有設定軟體。雷達校正裝置同樣包括訊號校準單元提供資訊。雷達校正裝置同樣包括處理器，耦接記憶體、訊號校準單元及雷達控制單元，並運行設定軟體及接收資訊。處理器根據資訊將第一訊號校正為第二訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A radar calibrating device for calibrating a radar system installed on a vehicle, is provided by the present disclosure. The radar system comprises a radar module and a radar control unit configured to receive a first signal output by the vehicle. The radar calibrating device comprises a memory starting a configuration software. The radar calibrating device also comprises a signal calibrating unit providing information. The radar calibrating device also comprises a processor coupled to the memory, the signal calibrating unit and the radar control unit, and configured to executing the configuration software. The processor calibrates the first signal to a second signal based on the information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:雷達校正裝置</p>
        <p type="p">110:處理器</p>
        <p type="p">120:記憶體</p>
        <p type="p">130:訊號校準單元</p>
        <p type="p">200:雷達系統</p>
        <p type="p">210:雷達控制單元</p>
        <p type="p">220:指示單元</p>
        <p type="p">230a~230n:雷達模組</p>
        <p type="p">300:車輛</p>
        <p type="p">320:車輛控制單元</p>
        <p type="p">330:連接埠</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="539px" img-content="tif" inline="yes" orientation="portrait" width="794px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623087</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144907</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01Q1/22</main-classification>
        <further-classification edition="200601120250303B">H01Q1/24</further-classification>
        <further-classification edition="200601120250303B">H01Q9/42</further-classification>
        <further-classification edition="200601120250303B">H01Q21/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佳鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方啟印</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, CHI-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳朝旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAO-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖志威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　浩元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, HAU YUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃士耿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-KENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳正雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括一接地面及一天線模組。天線模組包括第一至第四輻射體及第一至第五電子元件。第一電子元件連接第一輻射體的饋入端與接地面。第二電子元件連接第一輻射體與第二輻射體。第三電子元件連接第二輻射體與接地面。第一電子元件、第一輻射體、第二電子元件、第二輻射體與第三電子元件形成一第一迴路。第三輻射體連接於第一輻射體。第四電子元件連接第三輻射體與接地面。第一電子元件、第一輻射體、第三輻射體及第四電子元件形成一第二迴路。第四輻射體連接於饋入端。第五電子元件連接第四輻射體與接地面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a ground plane and an antenna module. The antenna module includes first to fourth radiators and first to fifth electronic components. The first electronic component is connected to a feed end of the first radiator and the ground plane. The second electronic component is connected to the first and second radiators. The third electronic component is connected to the second radiator and the ground plane. The first electronic component, the first radiator, the second electronic component, the second radiator and the third electronic component form a first loop. The third radiator is connected to the first radiator. The fourth electronic component is connected to the third radiator and the ground plane. The first electronic component, the first, third radiators and the fourth electronic component form a second loop. The fourth radiator is connected to the feed end. The fifth electronic component is connected to the fourth radiator and the ground plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A1~A4、B1~B2、G1~G6:位置</p>
        <p type="p">20:接地面</p>
        <p type="p">30:凹口</p>
        <p type="p">31:第一邊緣</p>
        <p type="p">32:第二邊緣</p>
        <p type="p">33:第一端</p>
        <p type="p">34:第二端</p>
        <p type="p">35:第三邊緣</p>
        <p type="p">40:晶片</p>
        <p type="p">100:天線模組</p>
        <p type="p">110:第一輻射體</p>
        <p type="p">120:第二輻射體</p>
        <p type="p">130:第三輻射體</p>
        <p type="p">140:第四輻射體</p>
        <p type="p">171:第一電子元件</p>
        <p type="p">172:第二電子元件</p>
        <p type="p">173:第三電子元件</p>
        <p type="p">174:第四電子元件</p>
        <p type="p">175:第五電子元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="670px" img-content="tif" inline="yes" orientation="portrait" width="984px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621832</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144910</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120250203B">B23K26/21</main-classification>
        <further-classification edition="201401120250203B">B23K26/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成新科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>4DMEN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>散熱器之雷射焊接成型方法</chinese-title>
        <english-title>METHOD FOR WELDING AND FORMING A HEAT RADIATOR BY USING LASER BEAM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明散熱器之雷射焊接成型方法，其包含有準備、初步固定及焊接等步驟，首先備有雷射焊接裝置及欲進行焊接之散熱器，其中，該散熱器具有一開設有槽孔之本體，以及冷卻管路，而該槽孔具有相互連通之第一、第二開槽，且該第二開槽之最大直徑大於該第一開槽之最大直徑，當該冷卻管路安裝於該本體時，該冷卻管路之定位部與該第二開槽之周緣面形成一焊接處，該雷射焊接裝置再以0∘至30∘之間的焊接角度朝該焊接處周緣5mm內的範圍進行焊接，從而產生自體熔融現象，並透過熔液填充該焊接處縫隙，有效提升該散熱器焊接後之密封效果，更能確實避免滲漏。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for welding and forming a heat radiator by using laser beam includes a preparation step, a preliminary positioning step, and a welding step. The preparation step includes preparing a laser welding device and a heat radiator applied to be welded. The heat radiator has a heat pipe and a body provided with at least one hole. The hole has a first opening and a second opening communicating with the first opening. A maximum diameter of the second opening is greater than a maximum diameter of the first opening. When the heat pipe is installed on the body, a positioning portion of the heat pipe is came into contact with a peripheral wall of the second opening to thereby form a welding seam. The laser welding device emits a laser beam toward the welding seam within a range of 5 millimeters apart from a periphery of the welding seam. A welding angle is defined between the welding seam and the laser beam to be within a range between 0 and 30 degrees. Thus, the method facilitates the self-fusion welding, and thus the welding seam is filled fully by the molten liquid, thereby improving the sealing effect after a welding operation is completed and preventing liquid leakage.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="855px" img-content="tif" inline="yes" orientation="portrait" width="563px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621833</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144911</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120241230B">B23K26/21</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成新科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>4DMEN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PO-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>散熱器之雷射轉動焊接方法</chinese-title>
        <english-title>METHOD FOR WELDING A HEAT RADIATOR BY USING ROTATING LASER BEAMS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明散熱器之雷射轉動焊接方法，其包含有準備、初步固定及焊接等步驟，首先備有雷射焊接裝置及待焊接之散熱器，該散熱器具有一開設有槽孔之本體，以及插置於該槽孔之冷卻管路，以使該冷卻管路之定位部與該槽孔之第二開槽的周緣面形成一焊接處，而後驅動該雷射焊接裝置之複數雷射單元繞行該散熱器，並以0度至30度之間的焊接角度朝該焊接處周緣5公釐內的範圍進行焊接，進而透過自體熔融，而使熔融之熔液填充該焊接處縫隙，不僅提升焊接後之密封效果，確實避免滲漏，同時防止設備線路纏繞，更能改善加工效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for welding a heat radiator by using rotating laser beams includes a preparation step, a preliminary positioning step, and a welding step. The preparation step includes preparing a laser welding device and a heat radiator applied to be welded. The heat radiator has a body provided with at least one hole and a heat pipe disposed in the hole. A positioning portion of the heat pipe is came into contact with a peripheral wall of a second opening of the hole when the heat pipe is accommodated in the hole to thereby form a welding seam. A welding operation is conducted by a plurality of laser units of the laser welding device. The laser units emit laser beams toward the welding seam within a range of 5 millimeters apart from a periphery of the welding seam while the laser units are simultaneously rotated. A welding angle is defined between the welding seam and the laser beams to be within a range between 0 and 30 degrees. Thus, the method facilitates the self-fusion welding, and thus the welding seam is filled fully by the molten liquid, thereby improving the sealing effect after the welding operation is completed, preventing liquid leakage, preventing equipment lines from being entangled, and improving the processing efficiency.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="925px" img-content="tif" inline="yes" orientation="portrait" width="543px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623247</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144913</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04N7/18</main-classification>
        <further-classification edition="202201120250303B">G06V20/52</further-classification>
        <further-classification edition="202301120250303B">H04N23/661</further-classification>
        <further-classification edition="202301120250303B">H04N23/60</further-classification>
        <further-classification edition="202201120250303B">H04L67/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱青泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>網路設備以及網路控制系統</chinese-title>
        <english-title>NETWORK EQUIPMENT AND NETWORK CONTROL SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種網路設備，適用於一區域網路，區域網路內具有一網路攝影機。此網路設備包含一網路介面模組、一影像識別模組以及一控制中心。網路介面模組適於通訊連接於網路攝影機，並接收來自網路攝影機之一影像資料。影像識別模組適於辨識影像資料，據以產生一辨識結果。控制中心適於依據辨識結果，控制區域網路內之至少一物聯網(Iot)裝置。本案並提供一種應用此網路設備之網路控制系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A network equipment is provided. The network equipment is adapted to a local area network with a network camera. The network equipment comprises a network interface module, an image recognition module, and a control unit. The network interface module is used for communicating with the network camera to receive image data from the network camera. The image recognition module is used for recognizing image data to generate a result. The control unit is used for control at least one Internet of things (Iot) device in the local area network according to the result. A network control system with the network equipment is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:網路控制系統</p>
        <p type="p">100:網路設備</p>
        <p type="p">12:網路攝影機</p>
        <p type="p">14:物聯網裝置</p>
        <p type="p">16:行動裝置</p>
        <p type="p">LN:區域網路</p>
        <p type="p">D1:影像資料</p>
        <p type="p">MS:提示訊息</p>
        <p type="p">S1:控制訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="703px" img-content="tif" inline="yes" orientation="portrait" width="921px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622811</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144917</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">G06N10/00</main-classification>
        <further-classification edition="202201120250303B">G06N10/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭士嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIH-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王梅瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MEI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>量子特徵圖電路、量子神經網路、其計算方法、及運具能耗資料分析系統與方法</chinese-title>
        <english-title>QUANTUM FEATURE MAP CIRCUIT, QUANTUM NEURAL NETWORK, COMPUTING METHOD THEREOF, AND SYSTEM AND METHOD FOR ANALYZING ENERGY CONSUMPTION DATA OF VEHICLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示量子特徵圖電路及其計算方法，量子特徵圖電路包括對量子位元進行量子閘操作之量子閘以及接著對量子位元進行旋轉閘操作之旋轉閘，且輸入變量值作為量子特徵圖電路中旋轉閘的角度參數值。本案另揭示量子神經網路及其計算方法，量子神經網路包括量子特徵圖電路和變分模型電路，變分模型電路對經量子特徵圖電路操作的各個量子位元進行旋轉閘操作，再對任兩個量子位元進行量子閘操作、接著對各個量子位元進行旋轉閘操作，且權重變量值作為變分模型電路中各個旋轉閘的角度參數值。此外，本案揭示基於量子神經網路之運具能耗資料分析系統及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A quantum feature map circuit and its computing method are provided. A quantum feature map circuit includes a quantum gate performing a quantum gate operation on a quantum bit and a rotary gate then performing a rotary gate operation on the quantum bit, wherein an input variable value is used as an angle parameter value of the rotary gate within the quantum feature map circuit. A quantum neural network and it computing method are also provided. A quantum neural network includes a quantum feature map circuit and a variational mode circuit, wherein the variational mode circuit performs a rotary gate operation on each quantum bit operated by the quantum feature map circuit, and then performs a quantum gate operation on any two quantum bits, and then performs a rotary gate operation on each of the quantum bits, and a weight variant value is used as an angular parameter value of each of the rotary gates of the variational mode circuit. Further, a system and method for analyzing energy consumption data of vehicles are provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:量子位元</p>
        <p type="p">101:量子閘</p>
        <p type="p">102:旋轉閘</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="281px" img-content="tif" inline="yes" orientation="portrait" width="572px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623141</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144926</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250512B">H02H3/16</main-classification>
        <further-classification edition="200601120250512B">H02H5/04</further-classification>
        <further-classification edition="200601120250512B">H02H5/00</further-classification>
        <further-classification edition="200601120250512B">H02B13/01</further-classification>
        <further-classification edition="200601120250512B">H02B13/02</further-classification>
        <further-classification edition="200601120250512B">H02B13/025</further-classification>
        <further-classification edition="200601120250512B">H02B1/28</further-classification>
        <further-classification edition="200601120250512B">G01K7/22</further-classification>
        <further-classification edition="200601120250512B">G01N27/14</further-classification>
        <further-classification edition="202301120250512B">G06N3/08</further-classification>
        <further-classification edition="201801120250512B">H04W4/38</further-classification>
        <further-classification edition="201801120250512B">H04W4/90</further-classification>
        <further-classification edition="201301120250512B">G06F3/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潤安科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李峻逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪麗敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, LI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具整合濕度感測器和物聯網連接性的防浸水防電擊保護器</chinese-title>
        <english-title>ANTI-IMMERSION ELECTRIC SHOCK PROTECTOR WITH INTEGRATED MOISTURE SENSORS AND IOT CONNECTIVITY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防浸水防電擊保護器，具有增強防水性的密封外殼和整合的數位濕度及溫度感測器。微控制器處理感測器數據，並通過物聯網連接性與外部設備通信，實現即時遠程監控和警告。防浸水防電擊保護器包括可透過行動應用程式和網頁儀表板訪問的用戶介面，允許用戶接收即時通知並查看運作狀態。此外，保護器在檢測到關鍵濕度或溫度水平時，可啟動自動預防措施以增強安全性。保護器還具備數據記錄和預測性維護功能，用於趨勢分析和主動裝置管理。該發明為防止電擊保護器中的水分滲入提供了一種堅固的解決方案，同時具備智能監控和用戶友好的特性，從而在各種環境中提升電氣安全性和可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An Anti-Immersion Electric Shock Protector is disclosed, featuring a sealed outer shell with enhanced waterproofing and integrated digital moisture and temperature sensors. A microcontroller processes sensor data and communicates with external devices via IoT connectivity, enabling real-time remote monitoring and alerting. The device includes a user interface accessible through a mobile application and web dashboard, allowing users to receive instant notifications and view operational status. Additionally, the protector can initiate automatic preventive actions upon detecting critical moisture or temperature levels to enhance safety. Data logging and predictive maintenance capabilities are incorporated for trend analysis and proactive device management. This invention provides a robust solution for preventing water ingress in electric shock protectors while offering intelligent monitoring and user-friendly features, thereby improving electrical safety and reliability in various environments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:客戶端裝置</p>
        <p type="p">20:伺服器</p>
        <p type="p">100、200:防浸水防電擊保護器</p>
        <p type="p">105:本地指示器</p>
        <p type="p">110:密封外殼</p>
        <p type="p">111:密封機構</p>
        <p type="p">112:密封指示器</p>
        <p type="p">113:電線管道</p>
        <p type="p">114:密封元件</p>
        <p type="p">120:防電擊保護器主體</p>
        <p type="p">121:電路中斷機構</p>
        <p type="p">122:控制介面</p>
        <p type="p">130:安裝結構</p>
        <p type="p">132:安裝網</p>
        <p type="p">134:連接柱</p>
        <p type="p">140:感測器</p>
        <p type="p">142:濕度感測器</p>
        <p type="p">144:溫度感測器</p>
        <p type="p">150:微控制器</p>
        <p type="p">152:記憶體</p>
        <p type="p">160:無線通訊模組</p>
        <p type="p">170:電源管理系統</p>
        <p type="p">172:穩壓器</p>
        <p type="p">174:備用電源</p>
        <p type="p">180:用戶介面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="692px" img-content="tif" inline="yes" orientation="portrait" width="1038px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622777</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144927</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">G06F17/16</main-classification>
        <further-classification edition="202301120241220B">G06F18/213</further-classification>
        <further-classification edition="202301120241220B">G06F18/2131</further-classification>
        <further-classification edition="202301120241220B">G06F18/2135</further-classification>
        <further-classification edition="202301120241220B">G06F18/22</further-classification>
        <further-classification edition="202301120241220B">G06F18/27</further-classification>
        <further-classification edition="202301120241220B">G06N5/04</further-classification>
        <further-classification edition="202301120241220B">G06Q10/04</further-classification>
        <further-classification edition="201201120241220B">G06Q50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳文傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪匡聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, KUANG SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅鎬德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, HAO DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施姵彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, PEI TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳勲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIA-SYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏鈺佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張棋傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHANG, CI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范姜怡茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN JIANG, YI RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃少宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHAO HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏鈺真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施育宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-HER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>金屬有機骨架之活化製程方法及其預測模型之建立方法</chinese-title>
        <english-title>ACTIVATED PROCESSING METHOD FOR METAL ORGANIC FRAMEWORK AND ELSTABLISHING METHOD FOR PREDICTED MODEL THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種金屬有機骨架(MOF)之活化製程方法及其預測模型之建立方法，其先藉由VOC之濃度對應之第一光譜資料與MOF材料之晶體參數對應之第二光譜資料，預先建立預測模型，以應用於將MOF材料加熱至活化，並利用第一量測裝置量測MOF材料於活化過程中產生之揮發性有機化合物(VOC)，以取得VOC之第一光譜資料，透過主機依據預測模型與第一光譜資料判斷MOF材料完成活化並取得MOF材料之晶體參數。藉此改善MOF材料之材料產率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an activated processing method for metal organic framework (MOF) and an established method for predicted model thereof. Firstly, prebuilding a prediction model according to the first spectral data of the VOC obtained by the first measurement device and the second spectral data of MOF powder obtained by the second measurement device, applied for heating the MOF powder until it is activated, and a first measuring device measures volatile organic compounds (VOC) produced within the activation process of the MOF powder to obtain a first spectral data of the VOC and the host obtains the crystal change amount of the MOF powder based on a prediction model and the first spectral data. The material yield of MOF materials is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10-S30:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="974px" img-content="tif" inline="yes" orientation="portrait" width="701px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622420</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144932</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F24C15/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何健標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE,CHIEN BIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何健標</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE,CHIEN BIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>爐頭定位結構</chinese-title>
        <english-title>BURNER POSITIONING STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種爐頭定位結構，其主要於爐架框內對應安裝爐頭的位置處鎖固一定位件，在所述定位件上端部設有一破孔及一嵌插孔，由所述破孔側壁延伸一抵掣片，所述抵掣片一端對應抵靠在所述定位件側端部；藉此，讓爐頭底端所設置的嵌腳及定位腳，能對應嵌入嵌插孔定位及抵掣在上端部定位，有效達成爐頭安裝之角度正確性及穩定性，且定位件能提升整體強度，並具有單邊更換之效用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a burner positioning structure. It primarily involves securing a positioning component at a corresponding position for installing the burner within a stove frame. The upper end of the positioning component is provided with a perforation and an insertion slot. An abutment plate extends from the sidewall of the perforation, with one end of the abutment plate corresponding to and abutting against the side end of the positioning component. This design allows embedded foot and positioning foot located at the bottom of the burner to be inserted into the insertion slot for proper positioning and to abut against the upper end for secure placement. It effectively ensures the correct angle and stability of the burner installation. Additionally, the positioning component enhances overall structural strength and provides the benefit of single-sided replacement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:爐架框</p>
        <p type="p">11:透孔</p>
        <p type="p">2:爐頭</p>
        <p type="p">21:嵌腳</p>
        <p type="p">211:溝槽</p>
        <p type="p">22:定位腳</p>
        <p type="p">23:噴嘴部</p>
        <p type="p">24:導管部</p>
        <p type="p">241:穿孔</p>
        <p type="p">3:定位件</p>
        <p type="p">31:上端部</p>
        <p type="p">311:破孔</p>
        <p type="p">312:嵌插孔</p>
        <p type="p">313:抵掣片</p>
        <p type="p">32:側端部</p>
        <p type="p">4:螺桿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="780px" img-content="tif" inline="yes" orientation="portrait" width="959px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622918</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144934</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">G07F17/10</main-classification>
        <further-classification edition="201201120250425B">G06Q50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭添裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭添裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏福楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>錢幣及財物捐獻收納智慧系統</chinese-title>
        <english-title>INTELLIGENT STORAGE SYSTEM FOR DONATED MONEY AND PROPERTY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種錢幣及財物捐獻收納智慧系統，其於一機體設有計判組件與包裝打印組件，當有捐獻者捐獻貨幣或貴金屬時，會先由該計判組件計算判斷捐獻物的資料，再由該包裝打印組件包裝捐獻物並打印上捐獻資訊，包裝打印完的捐獻物會被收納於該機體中，而捐獻資料也會同時儲存於一主控器中，藉此後續取出捐獻物進行清點時，可與儲存的捐獻資料進行比對，以改善過往以純人力清點紀錄時可能發生弊端的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention related to an intelligent storage system for donated money and property includes a machine body. The machine body disposed with at least a judging assembly and at least a wrapping and stamping assembly. When the system receives donated money or precious metal, the judging assembly would judge the information of the donation first. Then the wrapping and stamping assembly would wrap the donation and stamp the package with donation information. The donation package would be stored in the machine body and the donation information would be saved in a host controller. So the donations list can be compared to the saved information during checking to solve the problem about possible disadvantages by manual operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主機</p>
        <p type="p">11:機體</p>
        <p type="p">12:收納室</p>
        <p type="p">13:顯示輸入組件</p>
        <p type="p">14:主控器</p>
        <p type="p">15:攝錄器</p>
        <p type="p">17:收據產生組件</p>
        <p type="p">18:警報組件</p>
        <p type="p">2:歸檔總成</p>
        <p type="p">211:投入口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="968px" img-content="tif" inline="yes" orientation="portrait" width="773px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621640</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144936</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241212B">A61B5/15</main-classification>
        <further-classification edition="200601120241212B">A61B5/151</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>睿康生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>採血筆</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作包括有外殼，以及設於外殼內的膛座、頂針件及發射彈簧。外殼內設有壓抵凸塊；膛座能往復活動且包括有通道及推抵凹口；頂針件能往復活動地穿置於通道且包括有針座及具有彈性的至少一彈性臂；彈性臂能受壓抵凸塊所壓抵，其中的一彈性臂抵靠於推抵凹口的底部；發射彈簧抵靠於外殼與頂針件。本創作能夠解決現有採血筆需要手動上膛而不便使用的問題，提供一種能夠連續進行採血程序的採血筆。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:第一殼體</p>
        <p type="p">11:按壓凸塊</p>
        <p type="p">12:擋止凸塊</p>
        <p type="p">20:固定座</p>
        <p type="p">21:卡制凹溝</p>
        <p type="p">22:擋止凹部</p>
        <p type="p">30:膛座</p>
        <p type="p">301:推抵端</p>
        <p type="p">31:通道</p>
        <p type="p">32:推抵凹口</p>
        <p type="p">33:擋止凹口</p>
        <p type="p">36:容溝</p>
        <p type="p">37:卡制肋</p>
        <p type="p">38:限止凸部</p>
        <p type="p">40:頂針件</p>
        <p type="p">41:主體</p>
        <p type="p">411:第一端</p>
        <p type="p">42:針座</p>
        <p type="p">43:彈性臂</p>
        <p type="p">44:復位彈簧抵塊</p>
        <p type="p">45:導引塊</p>
        <p type="p">46:針座支撐肋</p>
        <p type="p">50:發射彈簧</p>
        <p type="p">60:復位彈簧</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="768px" img-content="tif" inline="yes" orientation="portrait" width="1121px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622425</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144939</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120250203B">F24F3/16</main-classification>
        <further-classification edition="201801120250203B">F24F11/58</further-classification>
        <further-classification edition="201801120250203B">F24F11/30</further-classification>
        <further-classification edition="201801120250203B">F24F11/70</further-classification>
        <further-classification edition="201801120250203B">F24F11/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫皓然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOU, HAO-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳錦銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智能聯網清淨機</chinese-title>
        <english-title>INTELLIGENT INTERNET PURIFIER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能聯網清淨機，包含主體、過濾模組、主機驅動控制器及氣體偵測模組。主體設有空氣導流路徑。過濾模組安裝於空氣導流路徑中，且包含導風機及過濾清淨組件。導風機導引空氣通過過濾清淨組件。主機驅動控制器控制導風機之運作。氣體偵測模組與主機驅動控制器電性連接，用於偵測空氣的濕度、溫度和空污，以產生偵測數據，並通過物聯網通訊將偵測數據傳送至聯網雲端運算服務裝置。聯網雲端運算服務裝置即時調控主機驅動控制器控制導風機之啟閉以及動態調整導風機之運作頻率與輸出風量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intelligent internet purifier is disclosed and includes a main body, a purifying module, a host driving controller and a gas detecting module. The main body has an air guiding path. The purifying module is disposed in the air guiding path, and includes a fan and a filtering component. The fan guides air to pass trough the filtering component. The host driving controller controls the operation of the fan. The host driving controller is electrically coupled with the gas detecting module, and configured to detect the humidity, temperature and air pollution to generate a detection data, and the detection data is transmitted to a networked cloud computing service device through IoT communication. The networked cloud computing service device real-timely controls the host drive controller to control the operation of the fan and dynamically adjusts the operating frequency and output air volume of the fan.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主體</p>
        <p type="p">2:過濾模組</p>
        <p type="p">21:導風機</p>
        <p type="p">22:過濾清淨組件</p>
        <p type="p">3:主機驅動控制器</p>
        <p type="p">4:氣體偵測模組</p>
        <p type="p">41:控制電路板</p>
        <p type="p">42:氣體偵測主體</p>
        <p type="p">5:聯網雲端運算服務裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.png" file="d10022.TIF" giffile="ed10022.png" height="673px" img-content="tif" inline="yes" orientation="portrait" width="804px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
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          <doc-number>202622418</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144941</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F23D14/02</main-classification>
        <further-classification edition="200601120241230B">F23D14/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CETERA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐愷呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KAI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐紹文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, SHAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恒育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>天然氣混氨燃燒器</chinese-title>
        <english-title>NATURAL GAS CO-FIRING AMMONIA BURNER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種天然氣混氨燃燒器，包含第一進氣管件、第二進氣管件、以及漩流機構。第一進氣管件具有空氣流道、天然氣流道、以及混合流道。混合流道位於空氣流道與天然氣流道之下游且具有第一噴口。從空氣流道流出之空氣與從天然氣流道流出之天然氣於混合流道中混合。第二進氣管件設於第一進氣管件中，且具有氨氣與空氣流道。氨氣與空氣流道配置以接收氨氣與空氣預混物。氨氣與空氣流道具有第二噴口。第一噴口環繞於第二噴口之外圍且與第二噴口相隔預設距離。漩流機構設於混合流道中，且配置以使空氣與天然氣漩流預混。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A natural gas co-firing ammonia burner includes a first gas intake pipe, a second gas intake pipe, and a swirl mechanism. The first gas intake pipe has an air flow channel, a natural gas flow channel, and a mixing flow channel. The mixing flow channel is located downstream of the gas flow channel and the natural gas flow channel and has a first spout. Air flowing out from the air flow channel and a natural gas flowing out from the natural gas flow channel are mixed in the mixing flow channel. The second gas intake pipe is disposed in the first gas intake pipe and has an ammonia and air flow channel. The ammonia and air flow channel is configured to receive an ammonia and air premix. The ammonia and air flow channel has a second spout. The first spout surrounds the second spout and is separated from the second spout by a predetermined distance. The swirl mechanism is disposed in the mixing flow channel and configured to swirl and premix the air and the natural gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:天然氣混氨燃燒器</p>
        <p type="p">110:第三噴口</p>
        <p type="p">200:第一進氣管件</p>
        <p type="p">210:空氣流道</p>
        <p type="p">212:進氣口</p>
        <p type="p">214:出氣口</p>
        <p type="p">220:天然氣流道</p>
        <p type="p">222:進氣口</p>
        <p type="p">224:出氣口</p>
        <p type="p">230:混合流道</p>
        <p type="p">232:第一噴口</p>
        <p type="p">300:第二進氣管件</p>
        <p type="p">310:氨氣與空氣流道</p>
        <p type="p">312:進氣口</p>
        <p type="p">314:第二噴口</p>
        <p type="p">400:漩流機構</p>
        <p type="p">410:預混漩流片</p>
        <p type="p">412:葉片</p>
        <p type="p">420:預混漩流片</p>
        <p type="p">422:葉片</p>
        <p type="p">430:駐焰漩流片</p>
        <p type="p">432:葉片</p>
        <p type="p">500:隔層管</p>
        <p type="p">510:容置空間</p>
        <p type="p">520:保溫材料</p>
        <p type="p">D:預設距離</p>
        <p type="p">G:間隙</p>
        <p type="p">G1:空氣</p>
        <p type="p">G2:天然氣</p>
        <p type="p">G3:氨氣與空氣預混物</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="677px" img-content="tif" inline="yes" orientation="portrait" width="925px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621789</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144942</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">B01J20/18</main-classification>
        <further-classification edition="200601120241220B">B01J20/22</further-classification>
        <further-classification edition="200601120241220B">B01J20/28</further-classification>
        <further-classification edition="200601120241220B">B01J20/30</further-classification>
        <further-classification edition="200601120241220B">B01D53/04</further-classification>
        <further-classification edition="200601120241220B">B01D53/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊智博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅偉仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SSU YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林燁敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YEH-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連培榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, PEI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>氣體吸附薄膜及其製造方法</chinese-title>
        <english-title>GAS ADSORPTION THIN FILM AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種氣體吸附薄膜及其製造方法。氣體吸附薄膜包含第一薄膜；設置在第一薄膜上的間隔板，其中間隔板具有網狀結構，且網狀結構包含多個孔洞；填充在間隔板的孔洞中的吸附材料粉體；以及設置在間隔板及吸附材料粉體上的第二薄膜。藉此，氣體吸附薄膜可使吸附材料粉體隔離水氣，並使其具有較佳的氣體吸附性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas adsorption thin film and a method of forming the same are provided. The gas adsorption thin film includes a first thin film; a spacer plate disposed on the first thin film, in which the spacer plate has a network structure, and the network structure includes plural holes; adsorbent powder is filled within the holes of the spacer plate; and a second thin film disposed on the spacer plate and the adsorbent powder. Therefore, the gas adsorption thin film can prevent moisture from the adsorbent powder, thereby achieving a better gas adsorption property.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣體吸附薄膜</p>
        <p type="p">110:第一薄膜</p>
        <p type="p">120:間隔板</p>
        <p type="p">120A:下表面</p>
        <p type="p">120B:上表面</p>
        <p type="p">130:吸附材料粉體</p>
        <p type="p">140:第二薄膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="544px" img-content="tif" inline="yes" orientation="portrait" width="923px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622263</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144944</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C22C9/00</main-classification>
        <further-classification edition="200601120241220B">C22F1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柏諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BO-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泰昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TAI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>銅合金及其製造方法</chinese-title>
        <english-title>COPPER ALLOY AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種銅合金的製造方法包含以下步驟。提供初始銅胚，其中初始銅胚包含特定比例的組成份。加熱初始銅胚以獲得均質銅胚。對均質銅胚進行析出細晶處理，以獲得銅合金。銅合金具有良好的抗拉強度、熱傳係數以及導電率，有利於後續應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a copper alloy includes the following steps. An initial copper billet is provided, in which the initial copper billet contains a specific proportion of composition. The initial copper billet is heated to obtain a homogeneous copper billet. The homogeneous copper billet is subjected to a precipitation and refinement processing to obtain the copper alloy. The copper alloy has good tensile strength, heat transfer coefficient, and electrical conductivity, which is beneficial to subsequent applications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110,120,130,132,134,136,140:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="661px" img-content="tif" inline="yes" orientation="portrait" width="574px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622709</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144955</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250123B">G06F3/039</main-classification>
        <further-classification edition="201301120250123B">G06F3/0487</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佃昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, TIEN-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳顥言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAO-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>官振鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUAN, CHENG-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>觸覺回饋指環裝置及應用其之觸覺回饋系統</chinese-title>
        <english-title>HAPTIC FEEDBACK RING APPARATUS AND SYSTEM USING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸覺回饋指環裝置及應用其之觸覺回饋系統，觸覺回饋指環裝置包含一本體、複數觸覺回饋單元、慣性感測器及至少一動力源。本體套設於操作人員的手部的手指的第二或第三指節；觸覺回饋單包括觸覺回饋方向不同的至少二馬達元件；慣性感測器用以蒐集觸覺回饋生物力學數據以及空間位置數據；動力源用以提供電力。複數接觸覺回饋指環裝置電性連接力感知回饋裝置、資料庫及中控單元構成觸覺回饋系統，中控單元將相對應的觸覺回饋訊號由資料庫傳送至配戴於操作人員手指的觸覺回饋指環裝置，使操作人員感受到力回饋與觸覺回饋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A haptic feedback ring apparatus and system using the same is disclosed, the haptic feedback ring apparatus includes a body and a plurality of haptic feedback units which includes at least two motor elements with different haptic feedback directions, inertial measurement unit and at least one power source for providing power. The body is sleeved on the middle part or the proximal part of fingers of operator’s hands. The inertial measurement unit is for collecting haptic feedback biomechanics data and spatial location data. A plurality of the haptic feedback ring apparatuses thermally coupled to force perception feedback apparatus, database and central control unit form a haptic feedback system. The central control unit transfers correspond haptic feedback signal to the haptic feedback ring apparatuses which are disposed on operator’s fingers so the operator could sense force feedback and haptic feedback.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:觸覺回饋指環裝置</p>
        <p type="p">10:本體</p>
        <p type="p">11:貫穿部</p>
        <p type="p">20:第一馬達元件</p>
        <p type="p">30:第二馬達元件</p>
        <p type="p">40:慣性感測器</p>
        <p type="p">50:控制處理器</p>
        <p type="p">60:動力源</p>
        <p type="p">70:充電接點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="786px" img-content="tif" inline="yes" orientation="portrait" width="650px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622867</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144957</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250203B">G06Q40/02</main-classification>
        <further-classification edition="200601120250203B">G07F19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合作金庫商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN COOPERATIVE BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱廉松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, LIEN-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智慧櫃台出納系統及其運作方法</chinese-title>
        <english-title>SMART COUNTER CASHIER SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智慧櫃台出納系統包括一櫃台窗口電子裝置、一點鈔機以及一櫃台內電子裝置。櫃台窗口電子裝置包含一第一攝影裝置及一聲學裝置。櫃台內電子裝置具有一輸入裝置，該櫃台內電子裝置通訊連接至該櫃台窗口電子裝置及該點鈔機，用以交叉比對該攝影裝置所錄製之影像、該點鈔機傳輸之資訊及櫃台人員使用該輸入裝置鍵入該櫃台內電子裝置之資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart counter cashier system includes a counter window electronic device, a cash counting machine and an in-counter electronic device. The counter window electronic device includes a first camera device and an acoustic device. The electronic device in the counter has an input device. The in-counter electronic device is communicatively connected to the counter window electronic device and the cash counting machine for cross-referencing the images recorded by the first camera device, the information transmitted by the cash counting machine and the input data from the in-counter electronic device by a personnel using the input device to key in.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:智慧櫃台出納系統</p>
        <p type="p">110:錢箱</p>
        <p type="p">112:攝影裝置</p>
        <p type="p">114:通訊裝置</p>
        <p type="p">120:櫃台窗口電子裝置</p>
        <p type="p">122:聲學裝置</p>
        <p type="p">124:通訊裝置</p>
        <p type="p">126:攝影裝置</p>
        <p type="p">128:紫外線裝置</p>
        <p type="p">130:點鈔機</p>
        <p type="p">132:顯示器</p>
        <p type="p">134:儲存裝置</p>
        <p type="p">136:處理裝置</p>
        <p type="p">138:通訊裝置</p>
        <p type="p">140:櫃台內電子裝置</p>
        <p type="p">142:輸入裝置</p>
        <p type="p">144:儲存裝置</p>
        <p type="p">146:處理裝置</p>
        <p type="p">148:通訊裝置</p>
        <p type="p">149:顯示器</p>
        <p type="p">150:伺服器電子裝置</p>
        <p type="p">152:影像資料庫</p>
        <p type="p">154:報表模組</p>
        <p type="p">156:客戶資料庫</p>
        <p type="p">158:訊息派發模組</p>
        <p type="p">160:網路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="773px" img-content="tif" inline="yes" orientation="portrait" width="988px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623147</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144961</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H02J7/00</main-classification>
        <further-classification edition="200601120260302B">H05K7/20</further-classification>
        <further-classification edition="200601120260302B">F16M11/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭匡祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENG, KUANG-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭匡祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENG, KUANG-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有散熱及充電功能的穩固裝置</chinese-title>
        <english-title>STABILIZING DEVICE WITH HEAT DISSIPATION AND CHARGING FUNCTIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露為一種具有散熱及充電功能的穩固裝置，其對一手機進行充電，包含有吸附裝置、萬向轉接組件及散熱充電裝置，吸附裝置具有頂部，萬向轉接組件連接於頂部，散熱充電裝置連接於萬向轉接組件且遠離吸附裝置之一側，散熱充電裝置包含有殼體、充電部及散熱部，殼體的外周緣具有連通內外部的複數空氣通道，散熱部包含有風扇、導熱環，風扇鄰近於萬向轉接組件，導熱環設於殼體之內緣且遠離萬向轉接組件，導熱環內側設有導熱塊，導熱塊上疊設有磁吸件，磁吸件連接充電部，散熱部之設置有助於手機及充電部散熱，避免發生過熱之情況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a mobile phone charging dock with a heat dissipation function for charging a mobile phone. It includes an adsorption device, a universal joint assembly, and a heat-dissipating charging device. The adsorption device has a top portion to which the universal joint assembly is connected. The heat-dissipating charging device is connected to the universal joint assembly and positioned on the side away from the adsorption device. The heat-dissipating charging device comprises a housing, a charging section, and a heat dissipation section. The outer periphery of the housing features multiple air channels that connect its interior and exterior. The heat dissipation section includes a fan and a heat-conducting ring. The fan is located near the universal joint assembly, while the heat-conducting ring is arranged along the inner edge of the housing, away from the universal joint assembly. Inside the heat-conducting ring is a heat-conducting block, on which a magnetic component is stacked. The magnetic component is connected to the charging section. The arrangement of the heat dissipation section aids in dissipating heat from both the mobile phone and the charging section, preventing overheating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:吸附裝置</p>
        <p type="p">11:頂部</p>
        <p type="p">12:底部</p>
        <p type="p">13:吸盤</p>
        <p type="p">15:解除真空件</p>
        <p type="p">20:萬向轉接組件</p>
        <p type="p">321:充電線圈</p>
        <p type="p">322:充電蓋板</p>
        <p type="p">331:風扇</p>
        <p type="p">332:導熱環</p>
        <p type="p">333:導熱塊</p>
        <p type="p">334:磁吸件</p>
        <p type="p">335:底面</p>
        <p type="p">336:散熱膏</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="1060px" img-content="tif" inline="yes" orientation="portrait" width="753px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622823</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144963</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250414B">G06Q10/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵奕翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, YI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHENG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵立榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, LI-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>隔板及使用其之收納裝置</chinese-title>
        <english-title>PARTITION AND STORAGE DEVICE USING THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種隔板及使用其之收納裝置。收納裝置包括載具及隔板。載具包括底板設置有複數供電接點。隔板包括殼體、控制模組以及散光板。控制模組設置於殼體之容置空間，控制模組包括電路板、無線模組、發光二極體及電連接器。無線模組及電連接器設置於電路板。發光二極體設置於電路板之一側表面。無線模組用以接收控制訊號，以控制發光二極體之作動。散光板設置於殼體，且使發光二極體發出的光線自散光板射出。隔板設置於載具之底板，且電連接器對應電性連接至複數供電接點的其中之一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A partition and a storage device using thereof. The storage device includes a carrier and at least one partition. The carrier includes a base plate provided with a plurality of power supply contacts. Each of the partition includes a housing, a control module and a diffuser plate. The control module is arranged in an accommodation space of the housing. The control module includes a circuit board, a wireless module, LEDs and an electrical connector. The wireless module and the electrical connector are arranged on the circuit board. The LEDs are arranged on one side surface of the circuit board. The wireless module is used to receive control signals to control the status of the LEDs. The diffusing plate is arranged on the housing and allows the light emitted by the LEDs to emit from the diffusing plate. The partition is arranged on the base plate of the carrier, and the electrical connector is electrically connected to one of the plurality of power supply contacts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:收納裝置</p>
        <p type="p">10:隔板</p>
        <p type="p">20:載具</p>
        <p type="p">21:底板</p>
        <p type="p">211:供電接點</p>
        <p type="p">30:電子裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="871px" img-content="tif" inline="yes" orientation="portrait" width="783px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621639</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144967</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241212B">A61B5/145</main-classification>
        <further-classification edition="202101120241212B">A61B5/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰博科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIDOC TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳朝旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳佳其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭振祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHEN-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>生物感測器</chinese-title>
        <english-title>BIOSENSOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明相關於一種連接於一電路板的一生物感測器，且該生物感測器呈一直向型，包括一近端部與該電路板連接，及一遠端部具有至少一電活性表面，植入皮下以連續量測一生理訊號，而該電活性表面的任一垂直於該生物感測器的截面的周長上，環設配置有至少一絕緣層，以加強該生物感測器位於皮下的安全性。其中，該近端部也可更進一步的包括一緩衝元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is related to a biosensor which is connected to a printed circuit board, and the biosensor is a direct type sensor which comprises a proximal end which is connected with the printed circuit board, and a distal end with at least one electroactive surface, in order to implant beneath the skin tissue to measure a physiological signal continuously. The electroactive surface with a circularly disposed insulating layer is to enhance the safety of the subcutaneous biosensor. The proximal end can further comprise a cushion component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:生物感測器</p>
        <p type="p">12:遠端部</p>
        <p type="p">14a:電活性表面</p>
        <p type="p">15a:絕緣層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="466px" img-content="tif" inline="yes" orientation="portrait" width="353px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622349</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144968</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">E05B27/06</main-classification>
        <further-classification edition="200601120241231B">E05B15/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣福興工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN FU HSING INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹天福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, TIEN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳啟桐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖和信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可更換鑰匙之鎖具</chinese-title>
        <english-title>REKEYABLE LOCK</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">鎖具包含一鎖殼形成有一鎖仁孔、複數個第一鎖珠孔以及複數個設定孔；以及一鎖仁可轉動地設置於該鎖仁孔中且形成有複數個第二鎖珠孔。當該鎖仁相對該鎖殼位於一第一轉動位置時，該複數個第二鎖珠孔分別對準於該複數個第一鎖珠孔。當該鎖仁相對該鎖殼自該第一轉動位置轉動至一第二轉動位置時，該複數個第二鎖珠孔分別面向且錯位於該複數個設定孔。當該鎖仁相對該鎖殼位於該第二轉動位置且進一步相對該鎖殼沿該鎖仁的軸向方向自一第一軸向位置移動至一第二軸向位置時，該複數個第二鎖珠孔分別對準於該複數個設定孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lock includes a lock casing formed with a lock cylinder hole, a plurality of first pin holes and a plurality of setting holes; and a lock cylinder rotatably arranged in the lock cylinder hole and formed with a plurality of second pin holes. When the lock cylinder is located at a first rotating position relative to the lock casing, the second pin holes are aligned with the first pin holes respectively. When the lock cylinder is rotated relative to the lock casing from the first rotating position to the second rotating position, the second pin holes face toward and are misaligned with the setting holes respectively. When the lock cylinder is located at the second rotating position and further moved from a first axial position to a second axial position along an axial direction of the lock cylinder, the second pin holes are aligned with the setting holes respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鎖具</p>
        <p type="p">110:鎖殼</p>
        <p type="p">112:鎖仁孔</p>
        <p type="p">114:第一鎖珠孔</p>
        <p type="p">116:設定孔</p>
        <p type="p">120:鎖仁</p>
        <p type="p">122:第二鎖珠孔</p>
        <p type="p">124:鑰匙孔</p>
        <p type="p">124a:鑰匙孔頂部</p>
        <p type="p">130:鎖珠組</p>
        <p type="p">132:第一鎖珠</p>
        <p type="p">133:鎖珠彈簧</p>
        <p type="p">134:第二鎖珠</p>
        <p type="p">136:設定鎖珠</p>
        <p type="p">137:設定彈簧</p>
        <p type="p">140:定位片</p>
        <p type="p">150:定位環</p>
        <p type="p">152:凸出部</p>
        <p type="p">200:鑰匙</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.png" file="d10016.TIF" giffile="ed10016.png" height="699px" img-content="tif" inline="yes" orientation="portrait" width="926px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621813</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144971</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B21D1/05</main-classification>
        <further-classification edition="202201120260302B">B22F1/054</further-classification>
        <further-classification edition="200601120260302B">B22F3/20</further-classification>
        <further-classification edition="200601120260302B">C22C9/00</further-classification>
        <further-classification edition="200601120260302B">C30B1/02</further-classification>
        <further-classification edition="202601120260302B">H10P14/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵順裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, SHUN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>等軸晶靶材的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF EQUIAXED CRYSTAL TARGET</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種等軸晶靶材的製造方法，包含以下步驟：透過一徑向鍛造製程，將一金屬棒材製成一鍛造基材；透過一軋延製程及一鍛板製程，將該鍛造基材製成一第一板材，該軋延製程為沿著該鍛造基材的軸向進行軋延；以一等通道轉角擠型模具對該第一板材往復進行一等通道轉角擠型製程，以獲得一第二板材，該第二板材的累積平均等效應變大於10，其中，該第一板材進入該等通道轉角擠型模具的入料方向與該鍛造基材的軋延方向相同；及對該第二板材進行一退火再結晶熱處理製程，以獲得一等軸晶靶材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of equiaxed crystal target comprising the steps of: providing a metal bar and the metal bar is made into a forged base material through a radial forging process. The forged base material is made into a first plate through a rolling process and a forging process wherein the rolling process is rolling along the axial direction of the forged base material. An equal channel angular extrusion mold is used to reciprocally perform an equal channel angular extrusion process on the first plate to obtain a second plate wherein the cumulative average equivalent strain of the second plate is greater than 10. The feeding direction of the first plate into the equal channel angular extrusion mold is the same as the rolling direction of the forged base material. Perform an annealing and recrystallization heat treatment process on the second plate to obtain an equiaxed crystal target.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S130,S150,S170:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="854px" img-content="tif" inline="yes" orientation="portrait" width="761px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622258</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144972</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241210B">C22B7/00</main-classification>
        <further-classification edition="200601120241210B">C22B15/00</further-classification>
        <further-classification edition="202201120241210B">B09B3/40</further-classification>
        <further-classification edition="200601120241210B">B01J23/94</further-classification>
        <further-classification edition="200601120241210B">B01J23/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫宏源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HONG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鈺淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣承學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHENG HSUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>銅粉資源回收物中溴元素的去除方法及再生銅製造方法</chinese-title>
        <english-title>METHOD FOR REMOVING BROMINE ELEMENT FROM RECYCLED COPPER POWDER AND METHOD FOR MANUFACTURING RECYCLED COPPER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種銅粉資源回收物中溴元素的去除方法，包括下列步驟：取得一銅粉資源回收物，其包括溴化阻燃劑；在一製程溫度及一製程時間內，對該銅粉資源回收物進行一熱裂解製程，使該銅粉資源回收物受熱產生由該溴化阻燃劑生成的一排氣；以及，以混合型觸媒與該排氣進行一化學反應，其中該混合型觸媒包括一含鐵觸媒及一含鈣觸媒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for removing bromine element from recycled copper powder, including the following steps: obtaining recycled copper powder, which includes a brominated flame retardant; heating the recycled copper powder by a pyrolysis process at a process temperature and a process time, wherein the recycled copper powder is heated to produce an exhaust gas generated by the brominated flame retardant; and using a mixed catalyst to perform a chemical reaction on the exhaust gas, wherein the mixed catalyst includes an iron-containing catalyst and a calcium-containing catalyst.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S13:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="501px" img-content="tif" inline="yes" orientation="portrait" width="672px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622620</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144973</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120241231B">G03B11/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新鉅科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWMAX TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁永福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YUNG FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳烱弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIUNG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用以提升鏡頭成像品質之鏡頭模組及電子裝置</chinese-title>
        <english-title>LENS MODULE AND ELECTRONIC DEVICE FOR IMPROVING AN IMAGING QUALITY OF THE LENS MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鏡頭模組包括：一鏡筒，具有一中空筒體；以及一光學透鏡組，設置於該鏡筒內，其中該光學透鏡組包括至少一透鏡；其中該鏡筒之該中空筒體包括一內周緣，該內周緣包括第一及第二切邊，其分別沿Y軸朝該中空筒體之中心處內縮；以及沿中心軸之該中空筒體之平面圖，該第一及第二切邊之各輪廓線包括下列其中一者：沿該Y軸朝外凸的一圓弧線、沿該Y軸朝內凹的一圓弧線、沿該Y軸朝外凸且連接的兩斜線、以及沿該Y軸朝內凹且連接的兩斜線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens module includes: a lens barrel having a hollow barrel; and an optical lens assembly disposed in the lens barrel, wherein the optical lens assembly includes at least one lens; wherein the hollow barrel includes an inner peripheral edge, and the inner peripheral edge includes first and second cut edges, which are respectively retracted toward the center of the lens along the Y-axis; and in the plan view of the lens along the central axis, each contour line of the first and second cut edges includes one of the following: an arc line that is convex outward along the Y-axis, an arc line that is concave inward along the Y-axis, two oblique lines that are convex outward along the Y-axis and connected, and two oblique lines that are convex inward along the Y-axis and connected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:鏡筒</p>
        <p type="p">110:中空筒體</p>
        <p type="p">111:第一切邊</p>
        <p type="p">112:第二切邊</p>
        <p type="p">11a:圓弧線</p>
        <p type="p">CL:中心軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="395px" img-content="tif" inline="yes" orientation="portrait" width="467px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622549</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144974</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G02B5/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新鉅科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWMAX TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁永福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YUNG FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳烱弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIUNG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用以提升鏡頭成像品質之鏡頭模組及電子裝置</chinese-title>
        <english-title>LENS MODULE AND ELECTRONIC DEVICE FOR IMPROVING AN IMAGING QUALITY OF THE LENS MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鏡頭模組包括：一鏡筒；以及一光學透鏡組，設置於該鏡筒內，其中該光學透鏡組包括至少一透鏡；其中該透鏡包括一外周緣，該外周緣包括第一及第二切邊，其分別沿Y軸朝該透鏡之中心處內縮；以及沿中心軸之該透鏡之平面圖，該第一及第二切邊之各輪廓線包括下列其中一者：沿該Y軸朝外凸的一圓弧線、沿該Y軸朝內凹的一圓弧線、沿該Y軸朝外凸且連接的兩斜線、以及沿該Y軸朝內凹且連接的兩斜線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens module includes: a lens barrel; and an optical lens assembly disposed in the lens barrel, wherein the optical lens assembly includes at least one lens; wherein the lens includes an outer peripheral edge, and the outer peripheral edge includes first and second cut edges, which are respectively retracted toward the center of the lens along the Y-axis; and in the plan view of the lens along the central axis, each contour line of the first and second cut edges includes one of the following: an arc line that is convex outward along the Y-axis, an arc line that is concave inward along the Y-axis, two oblique lines that are convex outward along the Y-axis and connected, and two oblique lines that are convex inward along the Y-axis and connected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:透鏡</p>
        <p type="p">121:第一切邊</p>
        <p type="p">122:第二切邊</p>
        <p type="p">12a:圓弧線</p>
        <p type="p">CL:中心軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="347px" img-content="tif" inline="yes" orientation="portrait" width="384px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621996</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144982</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120241220B">C02F1/00</main-classification>
        <further-classification edition="202301120241220B">C02F1/22</further-classification>
        <further-classification edition="202301120241220B">C02F9/00</further-classification>
        <further-classification edition="200601120241220B">B01L7/00</further-classification>
        <further-classification edition="200601320241220B">C02F103/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾豐謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, FUNG-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾豐謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, FUNG-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>LNG冷凍法海水淡化系統及方法</chinese-title>
        <english-title>SEAWATER DESALINATION SYSTEM AND METHOD BASED ON LNG COOLING TECHNOLOGY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種LNG冷凍法海水淡化系統及方法，本發明的系統包括依序設置的海水儲存槽、過濾器、預冷換熱器、兩相換熱器、結晶器、分離器和淡水生成器。待冷卻淡化的海水被引進海水儲存槽暫存，而後經過過濾器去除其中的雜質。過濾海水先經過預冷換熱器冷卻降溫，再於兩相換熱器內與LNG進行直接或間接的熱交換，得到低溫海水。結晶器可通過攪拌方式對低溫海水進行結晶處理，以產生冰晶及高濃度低溫海水，分離器可將冰晶與高濃度低溫海水分離，而淡水生成器可將冰晶融化產生淡水。因此，能有效利用LNG冷能，減少能源浪費，降低海水淡化的能耗和成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A seawater desalination system and method are provided. The system includes a seawater storage tank, a filter, a pre-cooling heat exchanger, a two-phase heat exchanger, a crystallizer, a separator, and a fresh water generator that are arranged in sequence. Seawater to be cooled and desalinated is introduced into a seawater storage tank for temporary storage and then passes through a filter to remove impurities. The filtered seawater is cooled by a pre-cooling heat exchanger and then exchanges heat directly or indirectly with LNG in the two-phase heat exchanger, so as to obtain low-temperature seawater. The crystallizer can perform a crystallization treatment with stirring on the low-temperature seawater, so as to produce ice crystals and high-concentration low-temperature seawater. The separator can separate the ice crystals from the high-concentration low-temperature seawater, and the freshwater generator can melt the ice crystals to produce fresh water. Therefore, LNG cold energy can be effectively utilized, thereby reducing energy waste and energy consumption and costs of fresh water production and seawater desalination.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:海水儲存槽</p>
        <p type="p">2:過濾器</p>
        <p type="p">3:預冷換熱器</p>
        <p type="p">4:兩相換熱器</p>
        <p type="p">5:結晶器</p>
        <p type="p">6:分離器</p>
        <p type="p">7:淡水生成器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="508px" img-content="tif" inline="yes" orientation="portrait" width="968px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621879</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144986</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B26D1/547</main-classification>
        <further-classification edition="200601120241230B">B26D7/26</further-classification>
        <further-classification edition="200601120241230B">H01R43/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐國振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUO CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張正謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>切片設備及其排線方法</chinese-title>
        <english-title>SLICING APPARATUS AND WIRE-ARRANGEMENT METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種切片設備及其排線方法。所述切片設備的排線方法包含：取得一標準捲線筒安裝於一軸桿時的一標準位置參數，以供一排線機構於所述標準捲線筒之上定義有一預設排線起點與一預設排線終點；將一捲線筒安裝於所述軸桿，並取得所述捲線筒的一實際位置參數；以一處理裝置比對所述實際位置參數與所述標準位置參數，以取得一位置補償參數，以供所述排線機構據以將所述預設排線起點與所述預設排線終點分別調整為一實際排線起點與一實際排線終點；及以所述排線機構將一切割線自所述實際排線起點捲繞於所述捲線筒、直至所述實際排線終點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a slicing apparatus and a wire-arrangement method thereof. The wire-arrangement method includes: obtaining a standard position parameter from a standard reel that is assembled to a shaft for providing a wire-arrangement mechanism to define a predetermined start point and a predetermined end point on the standard reel; assembling a reel to the shaft and obtaining a real position parameter of the reel; using a processing device to obtain a position difference parameter by comparing compare the standard position parameter and real position parameter for providing the wire-arrangement mechanism to respectively adjust the predetermined start point and the predetermined end point to become a real start point and a real end point; and using the wire-arrangement mechanism to wind a sawing wire around the reel from the real start point to the real end point.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:切片設備的排線方法</p>
        <p type="p">S110:前置步驟</p>
        <p type="p">S120:檢測步驟</p>
        <p type="p">S130:補償步驟</p>
        <p type="p">S140:排線步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="459px" img-content="tif" inline="yes" orientation="portrait" width="305px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623148</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144989</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241127B">H02K5/02</main-classification>
        <further-classification edition="200601120241127B">H02K5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓睿騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, RUEI TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓睿騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, RUEI TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴翊慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>馬達</chinese-title>
        <english-title>MOTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種馬達，其包括：一外殼組件及一機電單元。該外殼組件包含有一主框體與二蓋體，二該蓋體沿一軸心線同軸地組設於該主框體之相對二端，各該蓋體係由一塑料材質所製成，該塑料材質之熱變形溫度係介於120度至140度之間，各該蓋體包含有一座部；該機電單元包含有一定子組、一轉子組、一心軸與二軸承，該定子組與該轉子組可相對轉動地容設於該主框體，二該軸承分別容設於二該蓋體，該心軸組設於該轉子組而成同轉動關係，該心軸之二側分別可轉動地穿設過二該軸承與二該蓋體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A motor is provided, including a housing component and an electromechanical unit. The shell assembly includes a main frame and two covers. The two covers are coaxially assembled at opposite ends of the main frame along an axis. Each cover system is made of a plastic material. The heat deformation temperature of the plastic material is between 120 degrees and 140 degrees. Each cover body includes a base. The electromechanical unit includes a stator group, a rotor group, a spindle and two bearings. The stator group and the rotor group are relatively rotatably accommodated in the main frame. The two bearings are respectively accommodated in the two covers. The spindle is assembled on the rotor assembly in a synchronous rotation relationship, and two sides of the spindle are rotatably passed through the two bearings and the two covers respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:蓋體</p>
        <p type="p">36:第二加強肋</p>
        <p type="p">4:機電單元</p>
        <p type="p">43:心軸</p>
        <p type="p">44:軸承</p>
        <p type="p">51:風扇</p>
        <p type="p">52:風罩</p>
        <p type="p">6:鎖固件</p>
        <p type="p">83:第三尺寸</p>
        <p type="p">84:第四尺寸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.bmp" file="ed10008.bmp" height="730px" img-content="tif" inline="yes" orientation="portrait" width="850px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621787</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144990</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250512B">B01F23/47</main-classification>
        <further-classification edition="202201120250512B">B01F23/80</further-classification>
        <further-classification edition="202201120250512B">B01F31/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銪鑫金屬有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IN-DEPTH PRECISION CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宜昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊傳鏈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>流體細化裝置</chinese-title>
        <english-title>FLUID REFINEMENT DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種流體細化裝置，包含一機台，該機台的內部具有一容室，該容室的出口具有一連接部用以連接一分裝容器。一震盪片設置於該容室內，該震盪片設有複數細化孔，該些細化孔的數量至少為2056孔，震盪片會產生超音波震盪，使容室內的乳液經過高頻振動後改變其分子結構，降低分子之間的黏附力，從而達到分子細化的效果，經過震盪處理後，乳液隨即流經震盪片的細化孔，形成均勻細膩的液態分子，以滿足使用者對清爽、無黏膩感的使用需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fluid refinement device comprises a base unit with an internal chamber. The chamber features an outlet with a connecting portion designed to attach to a dispensing container. An oscillating plate is installed within the chamber and is equipped with multiple refined pores, numbering at least 2056. The oscillating plate generates ultrasonic vibrations, which cause high-frequency oscillations in the liquid within the chamber, altering its molecular structure and reducing adhesion between molecules. This molecular refinement enables the liquid to pass smoothly through the refined pores, producing a uniform, fine mist that provides a refreshing, non-sticky experience for users.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機台</p>
        <p type="p">101:容室</p>
        <p type="p">102:連接部</p>
        <p type="p">11:震盪片</p>
        <p type="p">25:分裝容器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="957px" img-content="tif" inline="yes" orientation="portrait" width="488px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621710</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144991</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">A61K31/785</main-classification>
        <further-classification edition="200601120241220B">C08G73/10</further-classification>
        <further-classification edition="200601120241220B">A61P29/00</further-classification>
        <further-classification edition="200601120241220B">A61P31/04</further-classification>
        <further-classification edition="200601120241220B">A61P39/06</further-classification>
        <further-classification edition="201101120241220B">B82Y5/00</further-classification>
        <further-classification edition="201101120241220B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國醫藥大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊宗原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUANG, TZONG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張長正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHANG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳家琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIA-QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慶炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜文平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, WEN-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>聚合物點、其製備方法及用途</chinese-title>
        <english-title>POLYMER DOT, PREPARATION METHOD AND USE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種聚合物點，其包含不含苯環之含氮碳點。一種聚合物點之製備方法，其包含：藉由一鍋合成法處理A        &lt;sub&gt;2&lt;/sub&gt;型單體及B        &lt;sub&gt;3&lt;/sub&gt;型單體，以獲得聚合物點。一種聚合物點之用途，其係用於製備抗發炎、抗菌及抗氧化其中至少一者之組成物。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polymer dot includes a nitrogen-containing carbon dot without a benzene ring. A preparation method of the polymer dot includes: treating an A        &lt;sub&gt;2&lt;/sub&gt;type monomer and a B        &lt;sub&gt;3&lt;/sub&gt;type monomer by a one-pot synthesis to obtain the polymer dot. A use of the polymer dot is for manufacture of at least one of anti-inflammatory, antibacterial, and antioxidant compositions.      </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="641px" img-content="tif" inline="yes" orientation="portrait" width="896px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623144</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113144992</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H02J3/00</main-classification>
        <further-classification edition="202601120260302B">H02J3/38</further-classification>
        <further-classification edition="202601120260302B">H02J13/00</further-classification>
        <further-classification edition="202401120260302B">G06Q50/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中央大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CENTRAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>模組化聚落式微電網能源管理系統及其控制方法</chinese-title>
        <english-title>MODULAR RUNDLING MICROGRID ENERGY MANAGEMENT SYSTEM AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種模組化聚落式微電網能源管理系統及其控制方法，系統包含微電網核心、複數個電網模組以及控制裝置。複數個電網模組環繞微電網核心設置以形成第一聚落，複數個電網模組及微電網核心藉由串聯或並聯的連接方式形成複數個拓撲型式。控制裝置連接微電網核心及複數個電網模組，藉由微電網核心及複數個電網模組的能量資訊，評估第一聚落的系統韌性指標，通過系統韌性指標切換複數個拓撲型式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modular rundling microgrid energy management system and a control method thereof are disclosed. The system includes a microgrid core, a plurality of power grid modules and a control device. The plurality of grid modules are disposed around the microgrid core to form a first rundling. The plurality of grid modules and the microgrid core are connected in series or parallel to form a plurality of topology types. The control device connects the microgrid core and the plurality of power grid modules. The energy information of the microgrid core and the plurality of power grid modules are used to evaluate the system resilience index of the first rundling. The plurality of topology types can be switched based on the system resilience index.</p>
      </isu-abst>
      <representative-img>
        <p type="p">CD:控制裝置</p>
        <p type="p">MGC:微電網核心</p>
        <p type="p">MG1:第一微電網</p>
        <p type="p">MG2:第二微電網</p>
        <p type="p">MG3:第三微電網</p>
        <p type="p">MG4:第四微電網</p>
        <p type="p">MP:市電</p>
        <p type="p">NG1:第一奈電網</p>
        <p type="p">R1:第一聚落</p>
        <p type="p">R2:第二聚落</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10039.JPG" file="ed10039.JPG" height="492px" img-content="tif" inline="yes" orientation="portrait" width="731px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622886</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145030</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250303B">G06T3/40</main-classification>
        <further-classification edition="202301120250303B">H04N23/698</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滿景資訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUPER LABORATORIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡智翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>影像拼接方法及影像拼接系統</chinese-title>
        <english-title>IMAGE STITCHING METHOD AND IMAGE STITCHING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">影像拼接方法包含分割攝影機所擷取的影像為複數個影像區塊；將該些影像區塊中，每一影像區塊分割為地面影像區域及非地面影像區域；依據每一影像區塊對應的平面夾角，篩選每一影像區塊；若影像區塊通過篩選，依據地面像素比例門檻，將影像區塊再次篩選；若影像區塊再次通過篩選，將影像區塊內，對應該地面影像區域的複數個像素標記為地面偵測區域；以及取得複數個地面偵測區域，以根據該些地面偵測區域，將複數個攝影機擷取的複數個三維空間影像進行拼接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image stitching method includes partitioning an image captured by a camera into a plurality of image blocks, partitioning each image block of the plurality of image blocks into a ground image area and a non-ground image area, filtering the each image block according to a plane angle corresponding to the each image block; if an image block passes filtering, filtering the image block again according to a ground pixel proportion threshold; if the image block passes filtering again, labeling a plurality of pixels corresponding to the ground image area in the image block as a ground detection area, and acquiring a plurality of ground detection areas for stitching a plurality of three-dimensional images captured by a plurality of cameras according to the ground areas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:影像拼接系統</p>
        <p type="p">10、101至10L:攝影機</p>
        <p type="p">20:處理器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="717px" img-content="tif" inline="yes" orientation="portrait" width="796px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623012</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145034</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">H01F27/29</main-classification>
        <further-classification edition="200601120250108B">H01F17/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇力新電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHILISIN ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林均治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電感器</chinese-title>
        <english-title>INDUCTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種電感器。電感器包含一磁性體、多個單件式線圈、一電極結構及一保護結構。磁性體具有一底面。多個單件式線圈埋設於磁性體內且彼此間隔地配置。各單件式線圈具有自底面露出的一第一端部與一第二端部。電極結構設置於磁性體的底面上並包括多個第一電極與多個第二電極。多個第一電極彼此間隔地配置且分別電性耦接多個單件式線圈的第一端部。多個第二電極彼此間隔地配置且分別電性耦接多個單件式線圈的第二端部。保護結構設置於磁性體的底面上。保護結構隔開多個第一電極與多個第二電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inductor is provided. The inductor includes a magnetic body, multiple single-piece coils, an electrode structure, and a protective structure. The magnetic body has a bottom surface. The multiple single-piece coils are embedded within the magnetic body and are spaced apart. Each single-piece coil has a first end and a second end, both exposed from the bottom surface. The electrode structure is positioned on the bottom surface of the magnetic body and includes multiple first electrode and multiple second electrode. The multiple first electrode are spaced apart and electrically coupled to the first ends of the multiple single-piece coils, while the multiple second electrode are spaced apart and electrically coupled to the second ends of the multiple single-piece coils. The protective structure is located on the bottom surface of the magnetic body, separating the multiple first electrode from the multiple second electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電感器</p>
        <p type="p">1:磁性體</p>
        <p type="p">2:單件式線圈</p>
        <p type="p">21:本體部</p>
        <p type="p">22:第一端部</p>
        <p type="p">23:第二端部</p>
        <p type="p">3:電極結構</p>
        <p type="p">31:第一電極</p>
        <p type="p">32:第二電極</p>
        <p type="p">4:保護結構</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">BM:底面</p>
        <p type="p">TP:頂面</p>
        <p type="p">SP:環側面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="667px" img-content="tif" inline="yes" orientation="portrait" width="677px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623088</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145036</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">H01Q1/22</main-classification>
        <further-classification edition="200601120250204B">H01Q3/00</further-classification>
        <further-classification edition="200601120250204B">H01P3/00</further-classification>
        <further-classification edition="200601120250204B">H04B7/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊熠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浦大鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, TA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>穿戴式裝置和通訊方法</chinese-title>
        <english-title>WEARABLE DEVICE AND COMMUNICATION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種穿戴式裝置，包括一接收元件、一第一傳波結構、一第二傳波結構、一阻抗轉換器、一發射元件，以及一柔性穿戴層。第一傳波結構和第二傳波結構皆鄰近於接收元件，其中接收元件係位於第一傳波結構和第二傳波結構之間。阻抗轉換器係鄰近於第一傳波結構。發射元件係鄰近於阻抗轉換器，其中阻抗轉換器係位於第一傳波結構和發射元件之間。柔性穿戴層可用於承載接收元件、第一傳波結構、第二傳波結構、阻抗轉換器，以及發射元件，其中第一傳波結構、第二傳波結構，以及發射元件可共同形成一複合輻射體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wearable device includes a receiver element, a first wave transmission structure, a second wave transmission structure, an impedance converter, a transmitter element, and a flexible wearable layer. The first wave transmission structure and the second wave transmission structure are adjacent to the receiver element. The receiver element is positioned between the first wave transmission structure and the second wave transmission structure. The impedance converter is adjacent to the first wave transmission structure. The transmitter element is adjacent to the impedance converter. The impedance converter is positioned between the first wave transmission structure and the transmitter element. The flexible wearable layer is configured to carry the receiver element, the first wave transmission structure, the second wave transmission structure, the impedance converter, and the transmitter element. A composite radiator is formed by the first wave transmission structure, the second wave transmission structure, and the transmitter element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:穿戴式裝置</p>
        <p type="p">110:接收元件</p>
        <p type="p">111:第一虛擬正方形</p>
        <p type="p">112:第二虛擬正方形</p>
        <p type="p">115:目標區域</p>
        <p type="p">121,122,123,124:主要金屬部</p>
        <p type="p">125,126,127,128:輔助金屬部</p>
        <p type="p">130:第一傳波結構</p>
        <p type="p">140-1,140-2,140-N:第一金屬部</p>
        <p type="p">150:第二傳波結構</p>
        <p type="p">160-1,160-2,160-M:第二金屬部</p>
        <p type="p">170:阻抗轉換器</p>
        <p type="p">175:轉換金屬部</p>
        <p type="p">180:發射元件</p>
        <p type="p">184:第一輻射金屬部</p>
        <p type="p">185:第二輻射金屬部</p>
        <p type="p">190:柔性穿戴層</p>
        <p type="p">199:通訊裝置</p>
        <p type="p">D1,D2,D3,D4,DA,DB,DC,DD:間距</p>
        <p type="p">L1,L2,L3,L4,L5,L6,L7:長度</p>
        <p type="p">SW:無線信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="705px" img-content="tif" inline="yes" orientation="portrait" width="1026px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623489</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145040</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250123B">H10H29/856</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余瑞斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JUI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家毫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, JIA HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田堃正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, KUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示面板</chinese-title>
        <english-title>DISPLAY PANEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板包括基板、發光元件、反射層與微透鏡。發光元件設置在基板上，且具有背對基板的正向出光面以及連接正向出光面的側向出光面。反射層設置在基板上，且覆蓋發光元件的側向出光面。反射層具有背對基板的平坦表面。發光元件的正向出光面相對於基板的基板表面具有第一高度。反射層的平坦表面相對於基板表面具有第二高度。第一高度大於第二高度。微透鏡設置在發光元件上，且覆蓋正向出光面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel including a substrate, a light emitting device, a reflective layer and a microlens is provided. The light emitting device is disposed on the substrate, and has a front light emitting surface facing away from the substrate and a lateral light emitting surface connecting the front light emitting surface. The reflective layer is disposed on the substrate, and covers the lateral light emitting surface of the light emitting device. The reflective layer has a flat surface facing away from the substrate. The front light emitting surface of the light emitting device has a first height relative to a substrate surface of the substrate. The flat surface of the reflective layer has a second height relative to the substrate surface. The first height is greater than the second height. The microlens is disposed on the light emitting device, and covers the front light emitting surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示面板</p>
        <p type="p">100:基板</p>
        <p type="p">100s:基板表面</p>
        <p type="p">105:接合墊</p>
        <p type="p">120:發光元件</p>
        <p type="p">120es1:正向出光面</p>
        <p type="p">120es2:側向出光面</p>
        <p type="p">121:第一電極</p>
        <p type="p">122:第二電極</p>
        <p type="p">125:磊晶結構層</p>
        <p type="p">140:反射層</p>
        <p type="p">140fs:平坦表面</p>
        <p type="p">140p:凸出部</p>
        <p type="p">160:微透鏡</p>
        <p type="p">160sw:側壁面</p>
        <p type="p">180:遮光層</p>
        <p type="p">190:封裝層</p>
        <p type="p">H1、H2:高度</p>
        <p type="p">X、Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="582px" img-content="tif" inline="yes" orientation="portrait" width="866px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623194</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145043</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03F3/189</main-classification>
        <further-classification edition="200601120250303B">H03F1/26</further-classification>
        <further-classification edition="200601120250303B">G05F3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭天雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, TIEN-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳智聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>放大裝置及其電流鏡電路</chinese-title>
        <english-title>AMPLIFICATION DEVICE AND CURRENT MIRROR CIRCUIT THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於一種放大裝置，於該放大裝置中，訊號輸入端接收輸入訊號。訊號輸出端輸出放大訊號。放大電路耦接於該訊號輸入端與該訊號輸出端之間，且包括疊接的第一電晶體及第二電晶體。第三電晶體接收第一參考電流。第四電晶體接收第二參考電流。第五電晶體接收第三參考電流，且耦接於該第四電晶體。運算放大器耦接於該第三電晶體及該放大電路。該第四電晶體與該放大電路之一電晶體之間的距離小於該第五電晶體與該放大電路中該電晶體之間的距離。該第四電晶體用以偵測溫度變化以進行補償。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure is related to an amplification device, and in the amplification device, a signal input terminal receives an input signal. A signal output terminal outputs an amplified signal. An amplification circuit is coupled between the signal input terminal and the signal output terminal, and includes a first transistor and a second transistor connected in a cascode manner. A third transistor receives a first reference current. A fourth transistor receives a second reference current. A fifth transistor receives a third reference current and is coupled to the fourth transistor. An operational amplifier is coupled to the third transistor and the amplification circuit. A distance from the fourth transistor to a transistor in the amplification circuit is less than a distance from the fifth transistor to the same transistor. The fourth transistor is used to detect temperature changes for compensation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:放大裝置</p>
        <p type="p">110:放大電路</p>
        <p type="p">CM:電流鏡電路</p>
        <p type="p">ILOAD:負載電流</p>
        <p type="p">IREF1,IREF2,IREF3:參考電流</p>
        <p type="p">N1,N2,N3,N4:節點</p>
        <p type="p">NI:訊號輸入端</p>
        <p type="p">NO:訊號輸出端</p>
        <p type="p">OP1:運算放大器</p>
        <p type="p">REF1,REF2,REF3,REF4:參考電壓端</p>
        <p type="p">SIN:輸入訊號</p>
        <p type="p">SOUT:放大訊號</p>
        <p type="p">T1,T2,T3,T4,T5:電晶體</p>
        <p type="p">VD1,VD3,VD4:電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="643px" img-content="tif" inline="yes" orientation="portrait" width="881px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621709</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145046</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241202B">A61K31/737</main-classification>
        <further-classification edition="200601120241202B">A61P17/04</further-classification>
        <further-classification edition="201601120241202B">A23L33/125</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華海洋生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊賢鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王品涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許珮毓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施一新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施惠齡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡倩婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>包含低分子量褐藻醣膠之組成物用於製備改善異位性皮膚炎之藥物或食品的用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種包含低分子量褐藻醣膠之組成物用於製備異位性皮膚炎藥物的用途，其中該低分子量褐藻醣膠的重量平均分子量為3,000道爾頓以下。本發明之組成物可有效地改善異位性皮膚炎患者的病灶範圍與嚴重程度、以及搔癢症狀(包含因搔癢造成的失眠症狀)，即可明顯改善異位性皮膚炎患者之SCORAD指數；此外，本發明之組成物可降低患者對外用類固醇軟膏及/或口服抗組織胺的依賴、降低異位性皮膚炎相關的免疫參數，同時不會讓肝腎的生化指數升高。因此，本發明之組成物在異位性皮膚炎的治療方面能兼具有效性及安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="558px" img-content="tif" inline="yes" orientation="portrait" width="625px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623090</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145048</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250319B">H01Q1/36</main-classification>
        <further-classification edition="200601120250319B">H01Q3/26</further-classification>
        <further-classification edition="201501120250319B">H01Q5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和碩聯合科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEGATRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃金鼎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>天線模組</chinese-title>
        <english-title>ANTENNA MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種天線模組包括主輻射體、饋入輻射體、第一、第二接地輻射體、第一傾斜輻射體及場型調整輻射體。主輻射體包括第一開路端。饋入輻射體、第一、第二接地輻射體及第一傾斜輻射體彎折地連接於主輻射體。第一傾斜輻射體具有遠離主輻射體的第二開路端、位於第一接地輻射體與饋入輻射體的相對側且與主輻射體的法線方向夾有第一非零夾角。第二接地輻射體位於第一開路端的相對側。場型調整輻射體位於第一開路端旁、隔開於第一開路端且包括匹配輻射體及第二傾斜輻射體，匹配輻射體靠近第一開路端，第二傾斜輻射體與法線方向夾有第二非零夾角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna module includes a main radiator, a feeding radiator, a first grounding radiator, a second grounding radiator, a first tilting radiator and a pattern adjusting radiator. The main radiator includes a first open end. The feeding radiator, the first grounding radiator, the second grounding radiator and the first tilting radiator are bendably connected to the main radiator. The first tilting radiator has a second open end which is away from the main radiator. The first tilting radiator is located at an opposite side which is relative to the first grounding radiator and the feeding radiator. A first non-zero angle is formed between the first tilting radiator and a normal direction of the main radiator. The second grounding radiator is located at a side which is relative to the first open end. The pattern adjusting radiator is located besides the first open end and separated from the first open end. The pattern adjusting radiator includes a matching radiator and a second tilting radiator. The matching radiator is close to the first open end. A second non-zero angle is formed between the second tilting radiator and the normal direction of the main radiator.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:天線模組</p>
        <p type="p">110:主輻射體</p>
        <p type="p">111:第一開路端</p>
        <p type="p">113:第一邊</p>
        <p type="p">114:第二邊</p>
        <p type="p">115:第三邊</p>
        <p type="p">116:第四邊</p>
        <p type="p">120:饋入輻射體</p>
        <p type="p">130:第一接地輻射體</p>
        <p type="p">140:第一傾斜輻射體</p>
        <p type="p">141:第二開路端</p>
        <p type="p">150:第二接地輻射體</p>
        <p type="p">160:場型調整輻射體</p>
        <p type="p">161:匹配輻射體</p>
        <p type="p">163:第二傾斜輻射體</p>
        <p type="p">170:接地面</p>
        <p type="p">A1、A2:夾角</p>
        <p type="p">D:距離</p>
        <p type="p">F:訊號饋入源</p>
        <p type="p">N:方向</p>
        <p type="p">X、Y、Z:軸向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="622px" img-content="tif" inline="yes" orientation="portrait" width="880px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622848</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145054</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250319B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250319B">G06Q30/02</further-classification>
        <further-classification edition="200601120250319B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>第一商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIRST COMMERCIAL BANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉韋杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝忠欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>客製化行銷方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種客製化行銷系統，包含一儲存有每一行銷活動的行銷活動資訊的儲存裝置及一後台伺服器。該後台伺服器用於獲得一待分析用戶的多筆活動參與紀錄、所有點數兌換紀錄及所有點數獲取紀錄；對於每一行銷活動，根據一對應於該行銷活動所屬的活動屬性的屬性偏好值獲得一屬性權重，根據該待分析用戶對應於該行銷活動的活動參與紀錄、所有點數兌換紀錄、所有點數獲取紀錄及該屬性權重，獲得該待分析用戶對於該行銷活動的一活動偏好值；根據該等活動偏好值，在該等行銷活動中選擇出M個推薦活動；及輸出該等M個推薦活動所分別對應的行銷活動資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:客製化行銷系統</p>
        <p type="p">11:儲存裝置</p>
        <p type="p">12:前台伺服器</p>
        <p type="p">13:後台伺服器</p>
        <p type="p">100:通訊網路</p>
        <p type="p">2:活動集點平台</p>
        <p type="p">3:分行系統</p>
        <p type="p">4:獎品兌換機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="480px" img-content="tif" inline="yes" orientation="portrait" width="963px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622741</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145055</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">G06F11/22</main-classification>
        <further-classification edition="200601120250425B">G06F11/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神雲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAC COMPUTING TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高翊瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, YI SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基本輸入輸出系統的預設值檢測方法</chinese-title>
        <english-title>BIOS DEFAULT DETECTION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基本輸入輸出系統的預設值檢測方法，藉由一訊號連接該待測單元的一檢測單元來實施，該檢測單元儲存有一包含多個待測選項與其分別對應之多個目標值的結構化資料，包含：(A) 對於每一待測選項，產生並傳送多個用於取得該待測選項之預設值的操作指令至該待測單元，以使該待測單元將該待測選項的該預設值傳送至該檢測單元；(B) 對於每一已獲得該預設值的待測選項，判定該待測選項所對應的該預設值與該待測選項所對應的該目標值是否相同；(C) 當判定出不同時，將該待測選項作為一設定錯誤選項。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A BIOS default detection method is implemented by a detection unit. The detection unit is connected to a unit under test and stores a structure data. The structured data includes a plurality of options to be tested and their respective corresponding multiple target values. The BIOS default detection method ​​include: (A) For each option to be tested, generate and send a plurality of operation instructions for obtaining the default value of the option to be tested to the unit under test, so that the unit under test returns the default value of the option to be tested to the detection unit; (B) For each option to be tested that has obtained the default value, determine whether the default value corresponding to the option to be tested is the same as the target value corresponding to the option to be tested; (C) When it is determined that the default value corresponding to the option to be tested is different from the target value corresponding to the option to be tested, the option to be tested is regarded as a setting error option.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S601~S607:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="697px" img-content="tif" inline="yes" orientation="portrait" width="1013px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621754</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145056</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241130B">A61N1/04</main-classification>
        <further-classification edition="200601120241130B">A61N1/36</further-classification>
        <further-classification edition="200601120241130B">A61B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖育德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YU-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宜潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曲柏勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, PO-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳海茵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HAI-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>穿戴式神經刺激與感測裝置</chinese-title>
        <english-title>WEARABLE NEURAL STIMULATION AND SENSING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種穿戴式神經刺激與感測裝置，包括可佩戴於頭部的頭帶，其表面具有多個電極安裝槽，電極安裝槽可靈活安裝刺激電極和感測電極。刺激電極包括淺層和深層刺激電極，分別用於三叉神經刺激和時間干擾腦刺激，實現對淺層和深層腦區的非侵入式電刺激。感測電極用於電阻抗成像，提供對腦部活動的生理數據進行即時監測。控制單元調節刺激電極的電刺激參數和感測電極的量測參數，處理單元處理獲取的生理數據。本發明具有精準刺激、體積小、便攜等優點，可應用於神經退化性疾病的治療和監測，提升患者的生活品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a wearable neural stimulation and sensing device, including a headband that can be worn on the head, with multiple electrode mounting slots on its surface. The electrode mounting slots allow flexible installation of stimulation electrodes and sensing electrodes. The stimulation electrodes include shallow and deep stimulation electrodes, used respectively for trigeminal nerve stimulation and transcranial interference brain stimulation, enabling non-invasive electrical stimulation of both shallow and deep brain regions. The sensing electrodes are used for electrical impedance tomography, providing real-time monitoring of physiological data on brain activity. A control unit adjusts the electrical stimulation parameters of the stimulation electrodes and the measurement parameters of the sensing electrodes, while a processing unit handles the acquired physiological data. This invention offers advantages such as precise stimulation, compact size, and portability, making it suitable for the treatment and monitoring of neurodegenerative diseases, thus enhancing patients' quality of life.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:穿戴式神經刺激與感測裝置</p>
        <p type="p">110:頭帶</p>
        <p type="p">120:電極</p>
        <p type="p">122:刺激電極</p>
        <p type="p">124:感測電極</p>
        <p type="p">130:控制單元</p>
        <p type="p">140:處理單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="995px" img-content="tif" inline="yes" orientation="portrait" width="753px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623091</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145066</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">H01Q1/36</main-classification>
        <further-classification edition="201501120250204B">H01Q5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勁達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王歷信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>天線構造</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種天線構造，包括：一饋入點，其供一預設線纜做一焊接；一斜伸段，係呈傾斜狀且其一端耦接於該饋入點；一共用路徑，其一端與該斜伸段之另一端耦接，並由與該斜伸段耦接處朝第一方向延伸至末端；一低頻輻射部，其一端耦接於該共用路徑末端並朝第二方向延伸經一轉折朝第四方向延伸；續由該第四方向末端經一轉折朝第三方向延伸；再由該第三方向經一轉折朝該第一方向延伸且經由一轉折朝該第二方向延伸形成末段；一高頻輻射部，其一端耦接於該共用路徑末端並朝該第三方向延伸經一轉折朝該第四方向延伸；再由該第四方向末端經一轉折朝該第二方向形成末段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:天線</p>
        <p type="p">11:饋入點</p>
        <p type="p">12:斜伸段</p>
        <p type="p">13:共用路徑</p>
        <p type="p">14:低頻輻射部</p>
        <p type="p">15:高頻輻射部</p>
        <p type="p">16:銜接段</p>
        <p type="p">17:接地區</p>
        <p type="p">18:匹配部</p>
        <p type="p">2:電路板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="749px" img-content="tif" inline="yes" orientation="portrait" width="1023px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623239</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145067</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L51/02</main-classification>
        <further-classification edition="202201120250303B">H04L51/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉孟涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉孟涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>線上聊天機器人系統及即時回覆之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種線上聊天機器人系統及即時回覆之方法，包括一線上聊天平台、一智慧問答平台及一客戶關係管理系統資料庫，線上聊天平台收集複數社群帳號在至少一社群平台對一企業帳號所發出的詢問訊息，並對社群帳號進行分析，以判斷該些社群帳號是否為企業帳號之一會員；當判斷使用者不是會員時，智慧問答平台產生詢問訊息之答案，並在線上聊天平台上將答案回覆該等社群帳號；當判斷使用者是會員時，從客戶關係管理系統資料庫中搜尋與詢問訊息相對應之答案，並在線上聊天平台上將答案回覆使用者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:線上聊天機器人系統</p>
        <p type="p">12:線上聊天平台</p>
        <p type="p">14:智慧問答平台</p>
        <p type="p">16:客戶關係管理系統資料庫</p>
        <p type="p">20:社群平台</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="612px" img-content="tif" inline="yes" orientation="portrait" width="878px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623471</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145074</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250211B">H10H20/80</main-classification>
        <further-classification edition="202501120250211B">H10H20/81</further-classification>
        <further-classification edition="202501120250211B">H10H20/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN-ASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡景元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鴻達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HONG-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳權威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>雙波段發光二極體及其製造方法</chinese-title>
        <english-title>DUAL-BAND LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種雙波段發光二極體及其製造方法，雙波段發光二極體包含一第一磊晶複合層、一第二磊晶複合層及一透明導電層。其中，第一磊晶複合層具有一第一波段之一第一發光層，第二磊晶複合層具有一第二波段之一第二發光層，且第一波段不小於第二波段。透明導電層夾置於第一磊晶複合層及第二磊晶複合層間，且第一磊晶複合層設置於第二磊晶複合層之上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dual-band light-emitting diode and a manufacturing method thereof are provided. The dual-band light-emitting diode comprises a first epitaxial composite layer, a second epitaxial composite layer and a transparent conductive layer. The first epitaxial composite layer has a first light-emitting layer of a first wavelength band, the second epitaxial composite layer has a second light-emitting layer of a second wavelength band, and the first wavelength band is no less than the second wavelength band. The transparent conductive layer is sandwiched between the first epitaxial composite layer and the second epitaxial composite layer, and the first epitaxial composite layer is disposed on the second epitaxial composite layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:N型歐姆接觸層</p>
        <p type="p">13:N型磷化銦磊晶層</p>
        <p type="p">14:第一發光層</p>
        <p type="p">15:P型磷化銦磊晶層</p>
        <p type="p">16:P型鋅摻雜磷砷化銦鎵磊晶層</p>
        <p type="p">17:金屬疊層</p>
        <p type="p">18:第一透明導電層</p>
        <p type="p">20:第二磊晶成長基板</p>
        <p type="p">21:N型砷化鎵層</p>
        <p type="p">22:N型砷化鋁鎵磊晶層</p>
        <p type="p">23:第二發光層</p>
        <p type="p">24:P型砷化鋁鎵磊晶層</p>
        <p type="p">25:P型碳摻雜砷化鎵磊晶層</p>
        <p type="p">28:第二透明導電層</p>
        <p type="p">31:P型電極</p>
        <p type="p">32:第一N型電極</p>
        <p type="p">33:第二N型電極</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.png" file="d10026.TIF" giffile="ed10026.png" height="886px" img-content="tif" inline="yes" orientation="portrait" width="764px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623337</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145078</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250512B">H05K7/20</main-classification>
        <further-classification edition="200601120250512B">H05K7/14</further-classification>
        <further-classification edition="200601120250512B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱鴻年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, HUNG-NIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李唯溢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐陽圳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU YANG, JHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>功率模組集合及其適用之固定裝置</chinese-title>
        <english-title>POWER MODULE ASSEMBLY AND FIXING DEVICE ADAPTED THERETO</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種功率模組集合包含功率模組、固定裝置及至少一固定件。功率模組具有殼體，且殼體上設有凸出體。固定裝置設置於凸出體上。固定裝置包含至少一固定部、第一卡合部與第二卡合部、及複數個連接部。第一卡合部及第二卡合部分別設置於至少一固定部的相對兩側，以分別卡合於凸出體的相對兩端。複數個連接部設置於至少一固定部與第一卡合部及第二卡合部之間。至少一固定件用以分別固定至少一固定部，進而使功率模組固定於一另一裝置上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power module assembly includes a power module, a fixing device and at least one fixing element. The power module includes a housing having a protrusion body disposed thereon. The fixing device is disposed on the protrusion body. The fixing device includes at least one fixing portion, a first engaging portion and a second engaging portion, and plural connection portions. The first engaging portion and the second engaging portion are disposed at two opposite sides of the fixing portion for respectively engaging with two opposite ends of the protrusion body. Plural connection portions are disposed between the at least one fixing portion and the first and the second engaging portions. The at least one fixing element is used to fix the at least one fixing portion, thereby fixing the power module to another device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:功率模組集合</p>
        <p type="p">10:功率模組</p>
        <p type="p">20:固定裝置</p>
        <p type="p">30:固定件</p>
        <p type="p">101:殼體</p>
        <p type="p">102:接腳</p>
        <p type="p">103:上表面</p>
        <p type="p">104:下表面</p>
        <p type="p">105:側表面</p>
        <p type="p">120:凸出部</p>
        <p type="p">A-A’:剖面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="800px" img-content="tif" inline="yes" orientation="portrait" width="728px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623414</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145079</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250729B">H10D62/824</main-classification>
        <further-classification edition="202501120250729B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝文元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, WEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游政昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, JHENG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泓宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開的一些實施方式提供一種半導體裝置，其包括電性連接至三五族半導體主體層的接觸件。接觸件的金屬層堆疊包括多個金屬層以及位於金屬層堆疊的最頂層的金屬氮化物蓋層，其中多個金屬層包括位於最底層且具有一金屬元素的金屬底層，金屬氮化物蓋層具有上述金屬元素的氮化物，且金屬底層的厚度大於金屬氮化物蓋層的厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments of the present disclosure provide a semiconductor device including a contact electrically connected to an III-V group semiconductor body layer. A metal layer stack of the contact includes a plurality of metal layers and a metal nitride capping layer at the topmost layer of the metal layer stack. The metal layers include a metal bottom layer having a metal element at the bottommost layer, the metal nitride capping layer has a nitride of the metal element, and a thickness of the metal bottom layer is larger than a thickness of the metal nitride capping layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200a:接觸件</p>
        <p type="p">210:金屬底層</p>
        <p type="p">220:第一金屬層</p>
        <p type="p">230:第二金屬層</p>
        <p type="p">240:金屬氮化物蓋層</p>
        <p type="p">T1,T2:厚度</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.bmp" file="ed10006.bmp" height="659px" img-content="tif" inline="yes" orientation="portrait" width="838px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621600</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145080</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A47B47/02</main-classification>
        <further-classification edition="200601120241230B">A47B96/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盈太企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROTREND CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳順義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>凹形方管升降置物架</chinese-title>
        <english-title>CONCAVE SQUARE TUBE LIFTING STORAGE SHELF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種凹形方管升降置物架，包括複數個立柱組、兩個固定置物層及複數個活動置物層。這些立柱組分別包括凹形方管，每個凹形方管包括凹形板件。每個固定置物層分別包括固定層架及第一組裝組件，第一組裝組件設於固定層架，第一組裝組件套設於凹形方管之外側，且固定置物層藉由第一組裝組件組立於這些立柱組之間。活動置物層包括活動層架及第二組裝組件，第二組裝組件設於活動層架。活動置物層能沿升降方向移動，藉由第二組裝組件組立於這些立柱組之間，且這些活動置物層位於兩個固定置物層之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A concave square tube lifting storage shelf is provided. The concave square tube lifting storage shelf includes a plurality of post components, two fixed storage layers and a plurality of moveable storage layers. These post components each include a concave square tube, with each concave square tube comprising a concave plate. Each fixed storage layer includes a fixed shelf and a first assembly component, with the first assembly component being mounted on the fixed shelf. The first assembly component is fitted onto the outer side of the concave square tube, and the fixed storage layer is assembled between the vertical post assemblies via the first assembly component. The movable storage layers each include a movable shelf and a second assembly component, with the second assembly component mounted on the movable shelf. The movable storage layers can move in the lifting direction and are assembled between the vertical post assemblies by these second assembly components, with these movable storage layers positioned between the two fixed storage layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:凹形方管升降置物架</p>
        <p type="p">110:立柱組</p>
        <p type="p">112:凹形方管</p>
        <p type="p">120:固定置物層</p>
        <p type="p">124:第一組裝組件</p>
        <p type="p">130:活動置物層</p>
        <p type="p">134:第二組裝組件</p>
        <p type="p">170:腳柱</p>
        <p type="p">L1:堆疊方向</p>
        <p type="p">LA:升降方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.bmp" file="ed10020.bmp" height="980px" img-content="tif" inline="yes" orientation="portrait" width="757px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621928</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145082</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B61K9/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任才俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, TSAI-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>循軌檢測系統及方法</chinese-title>
        <english-title>TRACK MONITORING SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種循軌檢測系統及方法，該系統包括：一循軌檢測裝置，循軌蒐集一訓練期軌道扣件影像及一使用期軌道扣件影像；一辨識模組，將該訓練期軌道扣件影像比對一標準軌道扣件影像，產生一相似度；一預測模組，當與該故障之訓練期軌道扣件影像相關的前一段時間之至少一影像被提取，以訓練該預測模組，獲得將發生故障之該影像的至少一特徵，當儲存該使用期軌道扣件影像至該預測模組，獲得可能發生故障的至少一特徵，利用該辨識模組將該標準軌道扣件影像比對該使用期軌道扣件影像，產生一相似度；一維修單位；及一資料庫，係儲存該訓練期軌道扣件影像、該標準軌道扣件影像、該相似度、該影像、該二特徵、該使用期軌道扣件影像、一故障機率、一預定故障機率門檻值及該一預定相似度門檻值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A track monitoring system and method thereof comprises: A track monitoring device, which collects a training-period track fastener image and a usage-period track fastener image. A recognition module, which compares the training-period track fastener image with a standard track fastener image to generate a similarity score. A prediction module, which is trained and at least one feature of the image indicating an impending fault is gained when at least one image, a preceding time period, is related to a fault training-period track fastener image and extracted. When the usage-period track fastener image is stored in the prediction module, at least one feature indicating a possible fault is obtained. The recognition module compares the standard track fastener image with the usage-period track fastener image to generate a similarity score. A database, which stores the training-period track fastener image, the standard track fastener image, the similarity score, the images, the two features, the usage-period track fastener image, a fault probability, a predetermined fault probability threshold, and a predetermined similarity threshold. A maintenance unit is involved as well.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S1)~(S19):步驟編號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="735px" img-content="tif" inline="yes" orientation="portrait" width="1001px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622327</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145084</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250203B">E01C11/00</main-classification>
        <further-classification edition="200601120250203B">B32B7/12</further-classification>
        <further-classification edition="200601120250203B">B32B33/00</further-classification>
        <further-classification edition="200601120250203B">E01C19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶泰樹脂化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHING-TAI RESINS CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡朝嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHAO-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉明昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ,MING-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>工程構造物結構及其鋪設方法</chinese-title>
        <english-title>ENGINEERING STRUCTURE AND ITS LAYING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種工程構造物結構，包括：基礎層，具有上表面；滲透黏著層，位於基礎層之上表面；防水防護層，位於滲透黏著層上方，滲透黏著層位於基礎層及防水防護層之間；防水接著界面層，位於防水防護層上方，防水防護層位於滲透黏著層及防水接著界面層之間；表面層，依需求及設計圖說鋪設於防水接著界面層上方，是以，可達成防水、防蝕、耐酸、鹼、鹽、及確保工程構造物結構物強度並延長整體使用壽命之技術效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An engineering structure and its laying method, which includes a base layer having an upper surface, a permeable adhesive layer located at the upper surface, a waterproof protective layer located above the permeable adhesive layer that is located between the base layer and the waterproof protective layer, a waterproof interface layer located above the waterproof protective layer that is located between the permeable adhesive layer and the waterproof interface layer, a surface layer laid above the waterproof interface layer according to the requirements and design drawings, so as to achieve the technical effects of waterproof, corrosion prevention, acid resistance, alkali, salt, and ensuring the strength of the engineering structure and prolonging the overall service life.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:前處理步驟</p>
        <p type="p">S2:塗佈滲透黏著層步驟</p>
        <p type="p">S3:鋪設防水防護層步驟</p>
        <p type="p">S4:增加防水接著界面層步驟</p>
        <p type="p">S5:表面層鋪設步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="878px" img-content="tif" inline="yes" orientation="portrait" width="592px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622581</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145085</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250203B">G02B11/06</main-classification>
        <further-classification edition="200601120250203B">G02B17/08</further-classification>
        <further-classification edition="200601120250203B">G02B27/28</further-classification>
        <further-classification edition="200601120250203B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新鉅科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWMAX TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃靖昀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡斐欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, FEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾冠銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>光學透鏡組和電子裝置</chinese-title>
        <english-title>OPTICAL LENS ASSEMBLY AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學透鏡組包含由目側至像源側依序配置的一第一透鏡、一反射式偏光元件、一第二透鏡、一部分反射部分透射元件和一第三透鏡，還包含位於該反射式偏光元件與該部分反射部分透射元件之間的一相位延遲元件。當滿足特定條件時，可減輕光學透鏡組的重量及確保成像品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical lens assembly includes a first lens, a reflective polarizer, a second lens, a partial-reflective-partial-transmissive element and a third lens arranged in order from a visual side to an image-source side, and further includes a phase retarder located between the reflective polarizer and the partial-reflective-partial-transmissive element. The optical lens assembly becomes more lightweight and has a better image quality when satisfying a specific condition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光欄</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">111:目側表面</p>
        <p type="p">112:像源側表面</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">121:目側表面</p>
        <p type="p">122:像源側表面</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">131:目側表面</p>
        <p type="p">132:像源側表面</p>
        <p type="p">141:第一吸收式偏光元件</p>
        <p type="p">142:反射式偏光元件</p>
        <p type="p">143:第一相位延遲元件</p>
        <p type="p">150:部分反射部分透射元件</p>
        <p type="p">161:第二相位延遲元件</p>
        <p type="p">162:第二吸收式偏光元件</p>
        <p type="p">170:影像源</p>
        <p type="p">171:像源面</p>
        <p type="p">180:光軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="731px" img-content="tif" inline="yes" orientation="portrait" width="726px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623173</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145090</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">H02M3/335</main-classification>
        <further-classification edition="200601120250425B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIAN POWER DEVICES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪宗良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, TSUNG LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>雙級直流電源轉換器</chinese-title>
        <english-title>DUAL-STAGE DC POWER CONVERTER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙級直流電源轉換器包括第一級直流轉換器、第二級直流轉換器、第一控制器以及第二控制器。第一級直流轉換器提供第一輸出電壓。第二級直流轉換提供第二輸出電壓。第一控制器接收第二輸出電壓，且根據第二輸出電壓的大小，提供模式信號至第二控制器，使第二控制器提供頻率信號控制第二級直流轉換器操作於定頻模式或變頻模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dual-stage DC power converter includes a first stage DC converter, a second stage DC converter, a first controller, and a second controller. The first stage DC converter provides a first output voltage. The second stage DC converter provides a second output voltage. The first controller receives the second output voltage, and provides a mode signal to the second controller according to the second output voltage so that the second controller provides a frequency signal to control the second stage DC converter operating in a fixed-frequency mode or a variable-frequency mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一級直流轉換器</p>
        <p type="p">20:第二級直流轉換器</p>
        <p type="p">11:第一控制器</p>
        <p type="p">21:第二控制器</p>
        <p type="p">V&lt;sub&gt;in&lt;/sub&gt;:直流輸入電壓</p>
        <p type="p">V&lt;sub&gt;bus&lt;/sub&gt;:第一輸出電壓</p>
        <p type="p">V&lt;sub&gt;out&lt;/sub&gt;:第二輸出電壓</p>
        <p type="p">S&lt;sub&gt;C&lt;/sub&gt;:控制信號</p>
        <p type="p">S&lt;sub&gt;M&lt;/sub&gt;:模式信號</p>
        <p type="p">S&lt;sub&gt;F&lt;/sub&gt;:頻率信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="476px" img-content="tif" inline="yes" orientation="portrait" width="639px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623168</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145091</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">H02M3/156</main-classification>
        <further-classification edition="200601120250425B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIAN POWER DEVICES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪宗良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, TSUNG LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具主動功率分配之直流電源轉換器</chinese-title>
        <english-title>DC POWER CONVERTER WITH ACTIVE POWER DISTRIBUTION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具主動功率分配之直流電源轉換器包括電源轉換單元、複數開關元件以及控制單元。各開關元件具有控制端、第一端以及第二端。該等第一端分別接收複數直流輸入電源，該等第二端連接電源轉換單元。該等開關元件的數量與該等直流輸入電源的數量相同。控制單元提供複數控制信號，且透過該等控制端對應地控制該等開關元件的導通與關斷，使得電源轉換單元提供輸出電源。控制單元根據輸出電源需要由該等直流輸入電源所提供電力的比例，透過該等控制信號控制該等開關元件導通次數的比例 。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A DC power converter with an active power distribution includes a power conversion unit, a plurality of switch components, and a control unit. Each switch component includes a control terminal, a first terminal, and a second terminal. The first terminals respectively receive a plurality of DC input power supplies, and the second terminals are connected to the power conversion unit. The number of the switch components is equal to the number of the DC input power supplies. The control unit provides a plurality of control signals, and the switch components are turned on and turned off by the corresponding control signals through the control terminals so that the power conversion unit provides an output power supply. The control unit controls the proportion of the number of conductions of the switch components by the control signals according to the proportion of power provided by the DC input power supplies required by the output power supply.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電源轉換單元</p>
        <p type="p">100:控制單元</p>
        <p type="p">Q&lt;sub&gt;1&lt;/sub&gt;,Q&lt;sub&gt;2&lt;/sub&gt;:開關元件</p>
        <p type="p">V&lt;sub&gt;in1&lt;/sub&gt;,V&lt;sub&gt;in2&lt;/sub&gt;:直流輸入電源</p>
        <p type="p">S&lt;sub&gt;C1&lt;/sub&gt;,S&lt;sub&gt;C2&lt;/sub&gt;:控制信號</p>
        <p type="p">V&lt;sub&gt;O&lt;/sub&gt;:輸出電源</p>
        <p type="p">L&lt;sub&gt;m&lt;/sub&gt;:電感</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="499px" img-content="tif" inline="yes" orientation="portrait" width="499px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621750</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145092</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241219B">A61L27/36</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, ZHI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張天㔾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TIEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瓏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>珊瑚骨移植物、其製備方法及其用途</chinese-title>
        <english-title>CORAL BONE GRAFT MATERIAL, PREPARATION METHOD THEREOF AND USE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種珊瑚骨移植物的製備方法，其包含將鹿角珊瑚屬的珊瑚進行粉碎，去除有機物質，經300至600℃進行燒結並滅菌後，以得到該珊瑚骨移植物。本發明另提供一種用上述製備方法所得到的珊瑚骨移植物，用於骨缺損的治療上。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="396px" img-content="tif" inline="yes" orientation="portrait" width="384px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622395</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145093</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">F16F1/38</main-classification>
        <further-classification edition="200601120250108B">B60G7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五福創新有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIVE BLESSINGS INNOVATION LIMITED COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭尚豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>應用於汽車三腳架的氣密襯套</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用於汽車三腳架的氣密襯套，包含一橡膠件、一金屬外殼及二塑膠支撐件。該橡膠件包括一沿一軸線方向延伸且界定出一內穿孔的橡膠本體、一圍繞連接該橡膠本體的第一蓋部、一圍繞連接該橡膠本體且相反於該第一蓋部的第二蓋部，及自該橡膠本體向外延伸的一第一分隔片部與一第二分隔片部。該金屬外殼圍繞連接該第一蓋部的外周面與該第二蓋部的外周面，該金屬外殼與該橡膠件共同界定出至少一氣室。該等塑膠支撐件位於該至少一氣室。本發明藉由設置位於該至少一氣室的該等塑膠支撐件，以產生避震與支撐效果，進而提升行車路感。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:橡膠件</p>
        <p type="p">11:橡膠本體</p>
        <p type="p">111:內穿孔</p>
        <p type="p">14:第一分隔片部</p>
        <p type="p">15:第二分隔片部</p>
        <p type="p">4:氣室</p>
        <p type="p">41:側室部</p>
        <p type="p">42:通道部</p>
        <p type="p">D2:分隔方向</p>
        <p type="p">P1:假想面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.png" file="d10018.TIF" giffile="ed10018.png" height="810px" img-content="tif" inline="yes" orientation="portrait" width="726px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622436</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145096</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F27D19/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昆成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳尹軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIN SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐愷呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KAI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐紹文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, SHAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恒育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>工業爐之溫度控制方法</chinese-title>
        <english-title>METHOD FOR CONTROLLING TEMPERATURE OF INDUSTRIAL FURNACE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">工業爐之溫度控制方法包括：計算工業爐的多個熱電偶所分別測得的多個溫度讀值之熱電偶平均溫度；將命令溫度減去熱電偶平均溫度來取得溫度差；根據溫度差來對工業爐的燃燒器的控制閥執行比例積分微分控制以取得占空比；自節能優化演算法腳本讀取閥開度；根據閥開度與占空比來取得控制閥的總熱能；根據閥開度與總熱能來取得控制訊號，控制訊號至少包含梯形波形；及根據控制訊號來控制燃燒器進行燃燒操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for controlling temperature of an industrial furnace includes: calculating an average temperature of plural temperatures respectively measured by plural thermocouples; subtracting the average temperature from a command temperature to obtain a temperature difference; performing a proportional integral derivative control on a control valve of a burner of the industrial furnace according to the temperature difference, thereby obtaining a duty cycle; reading an opening degree of the control valve from an energy-saving optimization algorithm script; obtaining a total thermal energy of the control valve according to the opening degree and the duty cycle; obtaining a control signal based on the opening degree and the total thermal energy, in which the control signal at least includes a trapezoidal waveform; and controlling the burner to perform combustion operation according to the control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S4,S5,S6,S7:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="739px" img-content="tif" inline="yes" orientation="portrait" width="859px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622490</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145098</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250213B">G01N21/95</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余昇鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芊旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃怡慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>塔柱瑕疵檢測方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR DETECTING TOWER COLUMN DEFECTS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種塔柱瑕疵檢測方法，由控制裝置控制攝影設備在塔柱內部的多個高度位置旋轉一圈以取得在各該高度位置的N張連續的塔柱內壁面影像，且由影像處理裝置根據攝影設備的鏡頭可視範圍及塔柱內壁面的周長，將在各該高度位置的周長分割成連續的N個被編號的區域，並將各該高度位置的N張內壁面影像按拍攝順序依序對應貼在與各該高度位置對應的N個區域而形成與塔柱內壁面對應的三維空間影像，並根據複數瑕疵特徵對三維空間影像進行影像辨識，以從中找出存在裂痕瑕疵的內壁面影像，並輸出存在裂痕瑕疵的內壁面影像對應的該高度位置及其所在的區域的編號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for detecting tower column defects. The control device controls the photography equipment to rotate once at multiple height positions inside the tower column to obtain N consecutive inner wall images of the tower column at each height position. The image processing device divides the perimeter at each height position into N consecutive numbered areas based on the viewing range of the camera lens of the photography equipment and the perimeter of the inner wall of the tower column, and sequentially pastes the N inner wall images at each height position on the N areas corresponding to each height position in the shooting order to form a three-dimensional spatial image corresponding to the inner wall surface of the tower column, and performs image recognition on the three-dimensional spatial image based on a plurality of defect characteristics to find the inner wall image with cracks and defects, and outputs the height position corresponding to the inner wall image with cracks and defects and the number of the area where it is located.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S4:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="918px" img-content="tif" inline="yes" orientation="portrait" width="751px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622910</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145099</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120241211B">G06V20/10</main-classification>
        <further-classification edition="202301120241211B">G06F18/23</further-classification>
        <further-classification edition="201701120241211B">G06T7/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優式機器人股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URSROBOT AI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世又</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江秉諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳忠侯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUNG-HOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳招成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>區域狀態檢測方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種區域狀態檢測方法，由一區域狀態檢測系統實施，該區域狀態檢測系統儲存有一土地影像資料，該土地影像資料包含分別對應於多個像素的多筆像素資料；該區域狀態檢測方法包含：對於每一像素，根據對應的該像素資料計算一對應於該像素的過綠指數；使用一用於區分綠色或非綠色的分群演算法對該等過綠指數分群以產生分別對應於該等像素的多個綠色分群結果；根據指示出綠色的該等綠色分群結果的數量及該等像素的總量計算一綠草覆蓋度，或根據指示出綠色的該等綠色分群結果對應的該等像素所對應的該等過綠指數計算一綠草植生指數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S17:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="991px" img-content="tif" inline="yes" orientation="portrait" width="695px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621916</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145100</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250729B">B60L53/60</main-classification>
        <further-classification edition="201901120250729B">B60L53/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯一安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周書暐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, SHU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於車輛條件之電池交換方法，及其電池能源站</chinese-title>
        <english-title>BATTERY EXCHANGE METHODS BASED ON VEHICLE CONDITIONS, AND BATTERY ENERGY STATIONS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於車輛條件之電池交換方法，適用於用以收納且對複數電池進行充電之一電池能源站。首先，接收一電池交換要求，並依據該電池交換要求取得相應一車輛之一車輛條件。接著，於一電池選定作業中，依據該車輛條件由該等電池中選擇至少一目標電池，並相應於該電池交換要求提供該目標電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Battery exchange methods based on vehicle conditions are provided, which are suitable for a battery energy station used for storing and charging a plurality of batteries. First, a battery exchange request is received, and vehicle conditions corresponding to a vehicle are obtained according to the battery exchange request. Then, in a battery selection operation, at least one target battery is selected from the batteries according to the vehicle conditions, and the target battery is provided in response to the battery exchange request.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310、S320、S330、S340:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="1046px" img-content="tif" inline="yes" orientation="portrait" width="655px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622608</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145103</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250407B">G02F1/133</main-classification>
        <further-classification edition="202001120250407B">G01R31/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致茂電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHROMA ATE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旻原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫鈺柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, YU JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示器測試裝置及顯示器測試方法</chinese-title>
        <english-title>DISPLAY TESTING DEVICE AND DISPLAY TESTING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示器測試裝置，包含處理電路、多工電路及連接電路。處理電路用以根據測試檔案，產生複數個影像訊號。該些影像訊號用以使顯示器產生測試影像。多工電路耦接於處理電路，且包含複數個多工器。該些多工器的每一者用以接收該些影像訊號，且用以選擇性地輸出該些影像訊號的其中一者。連接電路耦接於多工電路，且包含複數個連接埠。該些連接埠的每一者分別對應於該些多工器的其中一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display testing device includes a processing circuit, a multiplexing circuit and a connecting circuit. The processing circuit is configured to generate a plurality of image signals according to a test file. The image signals are configured to cause a display device to generate a test image. The multiplexer circuit is coupled to the processing circuit and includes a plurality of multiplexers. Each of the multiplexers is configured to receive the image signals and to selectively output one of the image signals. The connection circuit is coupled to the multiplex circuit and includes a plurality of connection ports. Each of the connection ports corresponds to one of the multiplexers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:顯示器測試裝置</p>
        <p type="p">210:處理電路</p>
        <p type="p">220:多工電路</p>
        <p type="p">221A:多工器</p>
        <p type="p">221B:多工器</p>
        <p type="p">222:設定電路</p>
        <p type="p">230:連接電路</p>
        <p type="p">240:記憶體</p>
        <p type="p">250:現場可編程閘陣列電路</p>
        <p type="p">DP:顯示器</p>
        <p type="p">P11:連接埠</p>
        <p type="p">P12:連接埠</p>
        <p type="p">P21:連接埠</p>
        <p type="p">P22:連接埠</p>
        <p type="p">S1:影像訊號</p>
        <p type="p">S2:影像訊號</p>
        <p type="p">SA:設定訊號</p>
        <p type="p">SB:設定訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="904px" img-content="tif" inline="yes" orientation="portrait" width="794px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623022</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145115</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">H01H13/704</main-classification>
        <further-classification edition="200601120250204B">H01H13/84</further-classification>
        <further-classification edition="200601120250204B">G06F3/041</further-classification>
        <further-classification edition="200601120250204B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀巽淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, SYUN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱振豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>背光模組</chinese-title>
        <english-title>BACKLIGHT MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背光模組包含基層、第一及第二隔光片、第一、第二及第三導光片與第一及第二遮光片。基層具有第一、第二及第三開口。第一隔光片設置於基層上方，並具有第一及第二隔光區與第四開口。第一導光片設置於第一隔光區內。第二導光片設置於第二隔光區內。第一遮光片設置於第一隔光片上方，並具有第一及第二透光窗與第五開口。第三、第四及第五開口對應設置。第二隔光片設置於第一遮光片上方，並具有第三隔光區。第三導光片設置於第三隔光區內。第二遮光片設置於第二隔光片上方，並具有第三、第四及第五透光窗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A backlight module includes a base layer, first and second light-isolating sheets, first, second, and third light guide sheets, and first and second light- shielding sheets. The base layer has first, second, and third openings. The first light-isolating g sheet is disposed above the base layer and has first and second light-isolating areas and a fourth opening. The first light guide sheet is disposed in the first light-isolating area. The second light guide sheet is disposed in the second light-isolating area. The first light-shielding sheet is disposed above the first light-isolating sheet and has first and second light-transmitting windows and a fifth opening. The third, fourth, and fifth openings are disposed correspondingly. The second light-isolating sheet is disposed above the first light-shielding sheet and has a third light-isolating area. The third light guide sheet is disposed in the third light-isolating area. The second light-shielding sheet is disposed above the second light-isolating sheet and has third, fourth, and fifth light-transmitting windows.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:背光模組</p>
        <p type="p">210:電路板</p>
        <p type="p">211:第一發光元件</p>
        <p type="p">213:第三發光元件</p>
        <p type="p">220:基層</p>
        <p type="p">231:第一隔光片</p>
        <p type="p">232:第二隔光片</p>
        <p type="p">241:第一導光片</p>
        <p type="p">241a:第一微結構組</p>
        <p type="p">243:第三導光片</p>
        <p type="p">243a:第三微結構組</p>
        <p type="p">251:第一遮光片</p>
        <p type="p">252:第二遮光片</p>
        <p type="p">260:蓋板</p>
        <p type="p">BZ1:第一隔光區</p>
        <p type="p">BZ3:第三隔光區</p>
        <p type="p">LT1:第一透光部</p>
        <p type="p">LT3:第三透光部</p>
        <p type="p">OP1:第一開口</p>
        <p type="p">OP3:第三開口</p>
        <p type="p">OP4:第四開口</p>
        <p type="p">OP5:第五開口</p>
        <p type="p">WD1:第一透光窗</p>
        <p type="p">WD3:第三透光窗</p>
        <p type="p">WD5:第五透光窗</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="667px" img-content="tif" inline="yes" orientation="portrait" width="1017px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622873</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145117</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q40/12</main-classification>
        <further-classification edition="201901120250303B">G06F16/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>爍益管理顧問有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOI CONSULTING LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游上逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SHANG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思源</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自動化分類財稅資料以建立專家知識庫的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR AUTOMATED CLASSIFICATION OF FINANCIAL AND TAX DATA TO ESTABLISH AN EXPERT KNOWLEDGE BASE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動化分類系統及分類方法，用於自動化將財稅資料進行分類，進而形成與優化專家知識庫，以提升自動化財務會計和稅務申報的準確性。該分類系統從各種來源導入財稅資料，清理並組織資料，並利用具有多層級的階層結構的知識庫，使用預定義的行業特定關鍵字進行分類。對於未被現有關鍵字匹配的紀錄，分類系統利用語言處理模型提取相關關鍵字並預測稅務扣抵的機率和會計科目的分類。此外，還藉由使用者介面供專家用戶審查並修改分類結果，其輸入動態更新和優化知識庫。該輸入系統與會計軟體緊密整合並自動化重複性任務，顯著提高分類準確性和運營效率，同時最小化手動干預。此外，分類系統還包括準確性測試和知識庫優化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automated classification system and classification method designed for automatically classifying financial and tax data, thereby forming and optimizing an expert knowledge base to enhance the accuracy of automated financial accounting and tax reporting. The classification system imports financial and tax data from various sources, cleans and organizes the data, and utilizes a knowledge base with a multi-level hierarchical structure to classify data using predefined industry-specific keywords. For records not matched by existing keywords, the classification system employs a language processing model to extract relevant keywords and predict probabilities for tax deductions and categorization into accounting subjects. Additionally, through a user interface, expert users can review and modify the classification results, with their inputs dynamically updating and optimizing the knowledge base. The system seamlessly integrates with accounting software and automates repetitive tasks, significantly improving classification accuracy and operational efficiency while minimizing manual intervention. Furthermore, the classification system includes mechanisms for accuracy testing and knowledge base optimization.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S170:流程圖步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="972px" img-content="tif" inline="yes" orientation="portrait" width="765px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622337</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145130</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">E03F5/04</main-classification>
        <further-classification edition="200601120241230B">E03C1/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>得心企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀品均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>地漏旋轉結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種地漏旋轉結構，其包含有一地漏，其中，所述地漏具有一地漏槽，該地漏槽設有一轉盤，所述轉盤可相對該地漏槽旋轉，所述轉盤偏心設置卡固有一導水槽，所述導水槽可相對該轉盤旋轉，該導水槽偏心設置有一地漏心管，所述地漏槽內設有一過濾件，該過濾件與一用以過濾之篩蓋組合，所述篩蓋設有至少一篩孔供水通過，所述導水槽的直徑大於該轉盤的半徑，所述導水槽旋轉後可令該地漏心管的中心位於該轉盤的中心，旋轉所述轉盤及該導水槽調整所述地漏心管的位置，並將該地漏心管與一排水管組接。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):地漏</p>
        <p type="p">(11):地漏槽</p>
        <p type="p">(12):轉盤</p>
        <p type="p">(121):斜面</p>
        <p type="p">(13):導水槽</p>
        <p type="p">(14):地漏心管</p>
        <p type="p">(15):過濾件</p>
        <p type="p">(151):凸緣</p>
        <p type="p">(16):篩蓋</p>
        <p type="p">(161):篩孔</p>
        <p type="p">(162):卡緣</p>
        <p type="p">(20):排水管</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="650px" img-content="tif" inline="yes" orientation="portrait" width="933px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621595</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145134</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A45C11/04</main-classification>
        <further-classification edition="200601120241230B">B65D85/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>均賀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUN HE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王江全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>防溢隱形眼鏡容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防溢隱形眼鏡容器，其包含有：一容器本體、一上蓋與一隱形眼鏡置放架，其中，所述容器本體具有一開口、一容置空間與一第一接合部，所述上蓋具有一外頂面、一內頂面、一蓋緣與一第二接合部，所述內頂面的中央設有一排氣孔與一管體，該管體的內緣形成有一第一螺紋段，所述排氣孔包含有貫穿所述內頂面的一第一孔部與貫穿所述外頂面的一第二孔部，所述第一孔部是設呈針孔狀的大小，所述第二孔部則明顯大於所述第一孔部，所述隱形眼鏡置放架具有一架本體與二儲存罩，所述架本體一端中央伸出有一架桿，該架桿的外緣形成有一第二螺紋段。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):容器本體</p>
        <p type="p">(11):開口</p>
        <p type="p">(12):容置空間</p>
        <p type="p">(13):第一接合部</p>
        <p type="p">(14):密封環</p>
        <p type="p">(20):上蓋</p>
        <p type="p">(21):外頂面</p>
        <p type="p">(22):內頂面</p>
        <p type="p">(23):蓋緣</p>
        <p type="p">(24):第二接合部</p>
        <p type="p">(25):排氣孔</p>
        <p type="p">(251):第一孔部</p>
        <p type="p">(252):第二孔部</p>
        <p type="p">(26):管體</p>
        <p type="p">(261):第一螺紋段</p>
        <p type="p">(30):隱形眼鏡置放架</p>
        <p type="p">(31):架本體</p>
        <p type="p">(32):儲存罩</p>
        <p type="p">(33):架桿</p>
        <p type="p">(331):第二螺紋段</p>
        <p type="p">(34):抵緣</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="975px" img-content="tif" inline="yes" orientation="portrait" width="695px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621888</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>113145138</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120250113B">B29C45/14</main-classification>
        <further-classification edition="200601120250113B">B29C45/03</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊瑪克國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李康宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>絕緣起子頭之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種絕緣起子頭之製造方法，其係依序經過置料、合模、注料、開模、封口等步驟，而能完成絕緣起子頭之製作，又置料是將起子頭放入一模具中，該起子頭係透過金屬加工的方式形成有一頭段、一中間段與一尾段，且所述頭段的外徑是大於所述中間段與所述尾段，所述尾段的端部設有一端口，所述模具是由一上模與一下模構成，該上模內部形成有一第一模穴、該下模內部形成有一第二模穴，所述上模與所述下模的一端間共同構成有一穿設孔，該穿設孔中穿置有一定位銷，所述下模則設有一擋牆、多個入料口、一第一頂針與一第二頂針。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(S1):置料</p>
        <p type="p">(S2):合模</p>
        <p type="p">(S3):注料</p>
        <p type="p">(S4):開模</p>
        <p type="p">(S5):封口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="876px" img-content="tif" inline="yes" orientation="portrait" width="479px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622365</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145141</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">F04D29/00</main-classification>
        <further-classification edition="200601120250204B">F04D29/04</further-classification>
        <further-classification edition="200601120250204B">F04D29/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱美電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張裕銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>單多年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>風扇裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風扇裝置，包含一圍繞界定出一內空間的輪轂、多片彼此間隔地自該輪轂向外延伸的扇葉、一設置於該內空間且界定出一穿設空間的導磁環、一連接於該輪轂且沿一軸方向延伸至該穿設空間的芯軸，及一設置於該穿設空間而圍繞該芯軸的磁鐵環。其中，由於該磁鐵環是以一可塑形之磁鐵材料製成，於是該磁鐵環界定出至少一配置槽，能因應配重需求而適用於供填充配重塊，使得該風扇裝置得以穩定運轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:輪轂</p>
        <p type="p">20:內空間</p>
        <p type="p">21:基板</p>
        <p type="p">210:第一填充槽</p>
        <p type="p">22:環板</p>
        <p type="p">3:扇葉</p>
        <p type="p">4:導磁環</p>
        <p type="p">40:穿設空間</p>
        <p type="p">5:芯軸</p>
        <p type="p">6:磁鐵環</p>
        <p type="p">60:配置槽</p>
        <p type="p">61:端面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="999px" img-content="tif" inline="yes" orientation="portrait" width="644px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623490</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145144</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260303B">H10K10/46</main-classification>
        <further-classification edition="202601120260303B">H10K19/10</further-classification>
        <further-classification edition="202501120260303B">H10D84/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴朝松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHAO-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅　安德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUAD, UGHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
              <english-address>ID</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昭仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>單一電晶體裝置及其運作方法</chinese-title>
        <english-title>SINGLE TRANSISTOR DEVICE AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種單一電晶體裝置，包含一電晶體、一延伸閘極、一槽體、一參考電極和一分析裝置。電晶體的閘極連接延伸閘極，在槽體內放置待測溶液。延伸閘極和參考電極在待測溶液內，進行特定的電性運作條件。使單一電晶體裝置能超過能斯特限制並放大酸鹼值感測度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A single transistor device includes a transistor, an extended gate, a tank, a reference electrode and an analysis device. A gate of the transistor connects the extended gate. The tank is put solution. The extended gate and the reference electrode are in the solution and operating specific electrical condition. The single transistor device can exceed the Nernst limit and amplify sensitivity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(A)-(J):步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="920px" img-content="tif" inline="yes" orientation="portrait" width="692px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623632</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145146</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10W20/40</main-classification>
        <further-classification edition="200601120260303B">C23C18/32</further-classification>
        <further-classification edition="202601120260303B">H10P95/00</further-classification>
        <further-classification edition="202601120260303B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華東科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTON ADVANCED ENGINEERING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于鴻祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HONG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古瑞庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, RUEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>晶片封裝的重佈線路結構的改良方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶片封裝的重佈線路結構改良，該晶片封裝包含晶片、多條重佈線路及多條鎳金層，各該重佈線路是利用重佈線層技藝水平方向延伸地成型在該晶片的表面上，各該鎳金層是利用化學鎳金技藝而鍍設成型在各該重佈線路的表面上，各該鎳金層是由鎳層及金層所構成且該金層是位於該鎳層上，以解決現有晶片封裝因採用電鍍技藝製成鎳金層而使得鎳金層厚度不均，且製程複雜的問題。此外，各該重佈線路能使該晶片上的多個晶墊產生XY平面電性延伸及互聯的作用供可在該晶片的周圍形成較分散的多個該晶墊，藉此能有效提昇晶片封裝的設計空間及信賴度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶片封裝</p>
        <p type="p">10:晶片</p>
        <p type="p">11:晶墊</p>
        <p type="p">12:第一保護層</p>
        <p type="p">13:第二保護層</p>
        <p type="p">131:開口</p>
        <p type="p">20:重佈線路</p>
        <p type="p">21:介電層</p>
        <p type="p">22:凹槽</p>
        <p type="p">23:表面</p>
        <p type="p">24:側面</p>
        <p type="p">30:鎳金層</p>
        <p type="p">31:鎳層</p>
        <p type="p">32:金層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="452px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623068</doc-number>
          <kind></kind>
          <date>115/06/01</date>
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          <doc-number>113145148</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120241206B">H01M4/36</main-classification>
        <further-classification edition="201001120241206B">H01M4/13</further-classification>
        <further-classification edition="200601120241206B">H01M8/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞福儲能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APH EPOWER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡施柏達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHIH PO-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王一修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳茜庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>改質正極結構、鋅釩電池及其製備方法</chinese-title>
        <english-title>MODIFIED POSITIVE ELECTRODE STRUCTURE, ZINC-VANADIUM BATTERY, AND PREPARATION METHODS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鋅釩電池，其包含改質正極結構（包含正極及第一改質層）、隔離膜、負極以及水系電解液。正極包含覆有碳塗層的鋁。第一改質層位於正極上且含有釩基材料70~95重量份、導電劑3~45重量份及黏結劑3~45重量份。隔離膜位於第一改質層上。負極含有鋅且位於隔離膜上。正極、第一改質層、隔離膜及負極位於水系電解液內。在使用CuKα1線之XRD測定釩基材料之X射線繞射圖案中，以位於2θ=8°±1.0°之波峰的強度為I        &lt;sub&gt;8&lt;/sub&gt;、位於2θ=20°±1.0°之波峰的強度為I        &lt;sub&gt;20&lt;/sub&gt;時，I        &lt;sub&gt;8&lt;/sub&gt;及I        &lt;sub&gt;20&lt;/sub&gt;之比值(I        &lt;sub&gt;8&lt;/sub&gt;/I        &lt;sub&gt;20&lt;/sub&gt;)滿足0＜I        &lt;sub&gt;8&lt;/sub&gt;/I        &lt;sub&gt;20&lt;/sub&gt;≤1.4。此外，還提供一種上述改質正極結構、一種製備上述改質正極結構的方法以及一種製備上述鋅釩電池的方法。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A zinc-vanadium battery includes a modified positive electrode structure (including a positive electrode and a first modified layer), a separator, a negative electrode, and an aqueous electrolyte. The positive electrode includes carbon-coated aluminum. The first modified layer is on the positive electrode and includes 70 to 95 parts by weight of vanadium-based material, 3 to 45 parts by weight of a conductive agent, and 3 to 45 parts by weight of a binder. The separator is on the first modified layer. The negative electrode includes zinc and is on the separator. The positive electrode, the first modified layer, the separator, and the negative electrode are in the aqueous electrolyte. In the X-ray diffraction patterns of the vanadium-based material measured by XRD using CuKα1 line, an intensity of a peak at 2θ=8°±1.0° is denoted as I        &lt;sub&gt;8&lt;/sub&gt;, and an intensity of a peak at 2θ=20°±1.0° is denoted as I        &lt;sub&gt;20&lt;/sub&gt;, and a ratio of I        &lt;sub&gt;8&lt;/sub&gt;and I        &lt;sub&gt;20&lt;/sub&gt;(i.e., I        &lt;sub&gt;8&lt;/sub&gt;/I        &lt;sub&gt;20&lt;/sub&gt;) satisfies 0＜I        &lt;sub&gt;8&lt;/sub&gt;/I        &lt;sub&gt;20&lt;/sub&gt;≤1.4. In addition, the modified positive electrode structure, a method for preparing the modified positive electrode structure, and a method for preparing the zinc-vanadium battery are also provided.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:鋅釩電池</p>
        <p type="p">10:正極</p>
        <p type="p">12:第一改質層</p>
        <p type="p">14:隔離膜</p>
        <p type="p">16:負極</p>
        <p type="p">18:水系電解液</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.bmp" file="ed10007.bmp" height="577px" img-content="tif" inline="yes" orientation="portrait" width="812px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623066</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145149</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201001120241206B">H01M4/13</main-classification>
        <further-classification edition="200601120241206B">H01M4/36</further-classification>
        <further-classification edition="200601120241206B">H01M8/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞福儲能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APH EPOWER CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡施柏達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHIH PO-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王一修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳茜庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>改質正極結構、鋅釩電池及其製備方法</chinese-title>
        <english-title>MODIFIED POSITIVE ELECTRODE STRUCTURE, ZINC-VANADIUM BATTERY, AND PREPARATION METHODS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鋅釩電池，其包含改質正極結構（包含正極及改質層）、隔離膜、負極以及水系電解液。正極含有鈦。改質層位於正極上且含有釩基材料70~95重量份、導電劑3~45重量份以及黏結劑3~45重量份。隔離膜位於改質層上。負極含有鋅且位於隔離膜上。正極、改質層、隔離膜及負極位於水系電解液內。其中，在使用CuKα1線之XRD測定釩基材料之X射線繞射圖案中，以位於2θ=8°±1.0°之波峰的強度為I        &lt;sub&gt;8&lt;/sub&gt;、位於2θ=20°±1.0°之波峰的強度為I        &lt;sub&gt;20&lt;/sub&gt;時，I        &lt;sub&gt;8&lt;/sub&gt;及I        &lt;sub&gt;20&lt;/sub&gt;之比值 (I        &lt;sub&gt;8&lt;/sub&gt;/I        &lt;sub&gt;20&lt;/sub&gt;)滿足0＜I        &lt;sub&gt;8&lt;/sub&gt;/I        &lt;sub&gt;20&lt;/sub&gt;≤1.4。此外，還提供一種上述改質正極結構、一種製備上述改質正極結構的方法以及一種製備上述鋅釩電池的方法。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A zinc-vanadium battery includes a modified positive electrode structure (including a positive electrode and a modified layer), a separator, a negative electrode, and an aqueous electrolyte. The positive electrode includes titanium. The modified layer is on the positive electrode and includes 70 to 95 parts by weight of vanadium-based material, 3 to 45 parts by weight of a conductive agent, and 3 to 45 parts by weight of a binder. The separator is on the modified layer. The negative electrode includes zinc and is on the separator. The positive electrode, the modified layer, the separator, and the negative electrode are in the aqueous electrolyte. In the X-ray diffraction patterns of the vanadium-based material measured by XRD using CuKα1 line, an intensity of a peak at 2θ=8°±1.0° is denoted as I        &lt;sub&gt;8&lt;/sub&gt;, and an intensity of a peak at 2θ=20°±1.0° is denoted as I        &lt;sub&gt;20&lt;/sub&gt;, and a ratio of I        &lt;sub&gt;8&lt;/sub&gt;and I        &lt;sub&gt;20&lt;/sub&gt;(i.e., I        &lt;sub&gt;8&lt;/sub&gt;/I        &lt;sub&gt;20&lt;/sub&gt;) satisfies 0＜I        &lt;sub&gt;8&lt;/sub&gt;/I        &lt;sub&gt;20&lt;/sub&gt;≤1.4. In addition, the modified positive electrode structure, a method for preparing the modified positive electrode structure, and a method for preparing the zinc-vanadium battery are also provided.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鋅釩電池</p>
        <p type="p">10:正極</p>
        <p type="p">12:改質層</p>
        <p type="p">14:隔離膜</p>
        <p type="p">16:負極</p>
        <p type="p">18:水系電解液</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.bmp" file="ed10005.bmp" height="630px" img-content="tif" inline="yes" orientation="portrait" width="870px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623278</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145155</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250314B">H04R27/00</main-classification>
        <further-classification edition="200601120250314B">F04D29/60</further-classification>
        <further-classification edition="200601120250314B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, KUO CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>風扇噪音放大裝置</chinese-title>
        <english-title>FAN NOISE AMPLIFICATION DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風扇噪音放大裝置，其係應用於放大電子裝置的風扇噪音，其中風扇噪音放大裝置包括：外殼體，具有環繞連接之第一側壁、第二側壁、第三側壁及第四側壁、底面、以及頂面，共同圍繞形成共振腔，第一側壁上設有圓形通孔；以及至少一開口管，透過圓形通孔置放於共振腔內，開口管具有連接環部及與連接環部相連的本體部，連接環部具有開口面積，本體部具有沿著軸方向延伸之中空且圓筒狀的筒狀側壁，筒狀側壁具有開口管長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fan noise amplification device, designed to amplify the fan noise of an electronic device, includes: housing: Comprising a first sidewall, second sidewall, third sidewall, fourth sidewall, a bottom surface, and a top surface, all interconnected to form a resonance cavity. The first sidewall has a circular through-hole；At least one open tube: Placed in the resonance cavity through the circular through-hole. The open tube includes a connecting ring portion and a main body portion connected to the ring. The connecting ring portion has an opening area, while the main body portion features a cylindrical sidewall that is hollow and extends along the axial direction, with a length corresponding to the open tube.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:外殼體</p>
        <p type="p">111:第一側壁</p>
        <p type="p">1111:圓形通孔</p>
        <p type="p">112:第二側壁</p>
        <p type="p">113:第三側壁</p>
        <p type="p">114:第四側壁</p>
        <p type="p">115:底面</p>
        <p type="p">116:頂面</p>
        <p type="p">117:共振腔</p>
        <p type="p">12:開口管</p>
        <p type="p">121:連接環部</p>
        <p type="p">122:本體部</p>
        <p type="p">1221:筒狀側壁</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="492px" img-content="tif" inline="yes" orientation="portrait" width="693px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623180</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145157</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120241231B">H02P27/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研深電機工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇偉中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇達鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳淑玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇樞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>馬達轉向切換器及具有該馬達轉向切換器之數位控制馬達</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達轉向切換器，電性連接於一數位控制馬達，包含有：一接電單元，具有一第一接點以及一第二接點；一切換單元，具有一交流接點、一判斷接點、一控制端以及一電控開關。在該判斷接點電性連接於該第一接點時，該控制端係控制該電控開關通路而導通，而使該數位控制馬達上的一單相控制器得以接收到正電源訊號，該單相控制器即控制該數位控制馬達正轉；在該判斷接點電性連接於該第二接點時，該控制端係控制該電控開關斷路而不導通，該單相控制器即控制該數位控制馬達反轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:馬達轉向切換器</p>
        <p type="p">11:接電單元</p>
        <p type="p">12:第一接點</p>
        <p type="p">14:第二接點</p>
        <p type="p">21:切換單元</p>
        <p type="p">211:零電位接點</p>
        <p type="p">212:通過接點</p>
        <p type="p">22:交流接點</p>
        <p type="p">24:判斷接點</p>
        <p type="p">26:控制端</p>
        <p type="p">28:電控開關</p>
        <p type="p">281:正電源接點</p>
        <p type="p">282:外接點</p>
        <p type="p">31:正電源</p>
        <p type="p">32:零電位參考點</p>
        <p type="p">41:選擇開關</p>
        <p type="p">49:殼體</p>
        <p type="p">51:數位控制馬達</p>
        <p type="p">52:單相控制器</p>
        <p type="p">521:第一腳位</p>
        <p type="p">522:第二腳位</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="679px" img-content="tif" inline="yes" orientation="portrait" width="962px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622401</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145158</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">F16H59/06</main-classification>
        <further-classification edition="201001120250204B">F16H57/04</further-classification>
        <further-classification edition="200601120250204B">F01M13/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWANG YANG MOTOR CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHINE HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無段變速系統的過濾機構</chinese-title>
        <english-title>FILTER MECHANISM OF CONTINUOUSLY VARIABLE SPEED SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無段變速系統的過濾機構，無段變速系統係被安裝於車體的傳動箱內，傳動箱具有傳動箱蓋，具有冷卻風入口，以及設置於傳動箱蓋外側的冷卻風導引蓋，並具有可供外界冷卻風進入的導風孔，過濾機構包括：第一過濾件，第一過濾件係位於冷卻風導引蓋上；第二過濾件，第二過濾件係位於傳動箱蓋中冷卻風入口外側；以及冷卻風流徑，其自導風孔連續地延伸穿過第一過濾件及第二過濾件至傳動箱蓋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A filter mechanism of a continuously variable speed system. The continuously variable speed system is installed in a transmission box. The transmission box has a transmission box cover, a cooling air inlet, and a cooling air guide cover arranged outside the transmission box cover. The outer side of the transmission case cover has an air guide hole for external cooling air to enter. The filter mechanism includes: a first filter element, which is located on the cooling air guide cover; a second filter element, which is located on the cooling air guide cover; Located on the transmission case cover; and a cooling air flow path, which extends continuously from the air hole through the first filter element and the second filter element to the transmission case cover.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:無段變速系統</p>
        <p type="p">11:驅動盤組</p>
        <p type="p">12:被動盤組</p>
        <p type="p">13:傳動帶狀件</p>
        <p type="p">2:傳動箱</p>
        <p type="p">21:傳動箱蓋</p>
        <p type="p">22:冷卻風入口</p>
        <p type="p">3:冷卻風導引蓋</p>
        <p type="p">31:導風孔</p>
        <p type="p">4:第一過濾件</p>
        <p type="p">5:第二過濾件</p>
        <p type="p">6:冷卻風流徑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="831px" img-content="tif" inline="yes" orientation="portrait" width="530px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622774</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145159</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250303B">G06F16/93</main-classification>
        <further-classification edition="202201120250303B">G06V30/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東友科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECO IMAGE SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自動化文件分類及智能儲存系統及其方法</chinese-title>
        <english-title>AUTOMATIC DOCUMENT CLASSIFICATION AND INTELLIGENT STORAGE SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種自動化文件分類及智能儲存系統，包括：事務機。事務機包括：掃瞄模組、辨識模組、記憶模組以及控制處理模組，掃瞄模組對文件執行掃瞄作業，以獲得文件影像。辨識模組具有光學字元辨識技術，可將文件影線轉換為可編輯之數位文件，並進行辨識及判斷程序。控制處理模組架構於控制與執行掃描作業、文件影像之辨識及判斷程序以及分類儲存程序。於辨識及判斷程序中，若判斷數位文件符合特定分類原則，則進行分類儲存程序，將數位文件儲存至特定資料夾，若判斷數位文件未符合特定分類原則，則將數位文件儲存至未分類資料夾。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automatic document classification and intelligent storage system is disclosed and includes a multi-function printer (MFP). The MFP includes a scan module, a recognition module, a memory module and a control processing module. The scan module scans a document to obtain the document image. The recognition module has optical character recognition technology to convert the document image into an editable digital file, so as to perform recognition and judgment processes. The control processing module is structured to control and execute the scanning process, the document image recognition and judgment processes, and the classification storage process. During the identification and judgment processes, if the digital file meets a specific classification principle, the classification storage process is performed, and the digital file is stored in a specific folder. While if the digital file does not meet the specific classification principle, the digital file will be stored in an unclassified folder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:事務機</p>
        <p type="p">10:掃描模組</p>
        <p type="p">11:辨識模組</p>
        <p type="p">110:光學字元辨識技術</p>
        <p type="p">12:通訊模組</p>
        <p type="p">13:記憶模組</p>
        <p type="p">130:儲存空間</p>
        <p type="p">14:控制處理模組</p>
        <p type="p">15:操控模組</p>
        <p type="p">150:操控介面</p>
        <p type="p">2:外接式儲存裝置</p>
        <p type="p">3:雲端空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="852px" img-content="tif" inline="yes" orientation="portrait" width="741px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621989</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145162</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C01F7/54</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秀霖環境科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林逸賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游舒媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>利用氫氟酸溶液生產含氟結晶產物的自動化生產系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提供一種利用氫氟酸溶液生產含氟結晶產物的自動化生產系統，其包括結晶處理裝置、第一入料模組、第二入料模組、結晶物處理模組及自動控制模組，其中，該自動控制模組電性連接該氟離子濃度感測計、該光纖感測計、第一入料模組的第一泵、第二入料模組的第二泵及結晶物處理模組的出料泵，該自動控制模組接收氟離子濃度感測計感測的氟離子濃度參數控制該第一泵或該第二泵，且該自動控制模組接收該光纖感測計的感測結果控制該出料泵的開啟與關閉。據此，本創作能有利於自動控制結晶反應的氟離子濃度，藉此簡化生產含氟結晶產物的反應和流程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:結晶處理裝置</p>
        <p type="p">11:外槽體</p>
        <p type="p">12:內槽體</p>
        <p type="p">121:流通口</p>
        <p type="p">122:攪拌單元</p>
        <p type="p">1221:葉片</p>
        <p type="p">13:沉降斗</p>
        <p type="p">131:沉降口</p>
        <p type="p">14:結晶物排放口</p>
        <p type="p">15:導流板</p>
        <p type="p">16:溢流口</p>
        <p type="p">17:氟離子濃度感測計</p>
        <p type="p">18:濁度感測計</p>
        <p type="p">19:光纖感測計</p>
        <p type="p">20:第一入料模組</p>
        <p type="p">21:第一入料槽</p>
        <p type="p">22:第一入料管</p>
        <p type="p">23:噴料頭</p>
        <p type="p">24:第一泵</p>
        <p type="p">30:第二入料模組</p>
        <p type="p">31:第二入料槽</p>
        <p type="p">32:第二入料管</p>
        <p type="p">33:噴料頭</p>
        <p type="p">34:第二泵</p>
        <p type="p">40:結晶物處理模組</p>
        <p type="p">41:出料管</p>
        <p type="p">42:出料泵</p>
        <p type="p">43:離心裝置</p>
        <p type="p">44:產物收集槽</p>
        <p type="p">50:擔體循環模組</p>
        <p type="p">51:引流管</p>
        <p type="p">511:吸取端</p>
        <p type="p">512:輸送端</p>
        <p type="p">52:輸送泵</p>
        <p type="p">53:噴料件</p>
        <p type="p">60:自動控制模組</p>
        <p type="p">A1:反應區</p>
        <p type="p">A2:整流區</p>
        <p type="p">A3:結晶物收集區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="678px" img-content="tif" inline="yes" orientation="portrait" width="901px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621990</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145163</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C01F7/54</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秀霖環境科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林逸賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游舒媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>利用氫氟酸溶液生產含氟結晶產物的自動化生產方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提供一種利用氫氟酸溶液生產含氟結晶產物的自動化生產方法，其包括：感測氫氟酸溶液的濃度，並預設入料流量；自動控制模組根據氫氟酸溶液的濃度和流量及反應溶液的濃度，輸出反應溶液的預定流量；入料反應溶液和氫氟酸溶液至反應區；即時感測反應區中溶液的氟離子濃度，自動控制模組即時控制反應溶液的入料流量；即時感測含氟結晶物的沉降高度，自動控制模組控制是否排放含氟結晶物。本創作能以簡便的方法處理高濃度的氫氟酸溶液，並據此獲得沙粒狀、含水率低、高鈉/鋁分子比的氟鋁酸鈉結晶產物或氟矽酸鈉結晶產物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="1018px" img-content="tif" inline="yes" orientation="portrait" width="703px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622613</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145165</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">G02F1/1335</main-classification>
        <further-classification edition="200601120250204B">G02F1/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括可透光層、第一裝飾層以及第二裝飾層。第一裝飾層配置於可透光層的第一表面上，且包括第一膽固醇液晶層。第二裝飾層配置於可透光層的第二表面上，且包括第二膽固醇液晶層。第一表面與第二表面相對，且第一膽固醇液晶層被配置以反射左旋圓偏光以及右旋圓偏光中的一者，第二膽固醇液晶層被配置以反射左旋圓偏光以及右旋圓偏光中的另一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device including a transparent layer, a first decoration layer and a second decoration layer is provided. The first decoration layer is disposed on a first surface of the transparent layer and includes a first cholesteric liquid crystal layer. The second decoration layer is disposed on a second surface of the transparent layer and includes a second cholesteric liquid crystal layer. The first surface is opposite to the second surface. The first cholesteric liquid crystal layer is used to reflect one of a left circularly polarized light and a right circularly polarized light, and the second cholesteric liquid crystal layer is used to reflect the other one of the left circularly polarized light and the right circularly polarized light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示裝置</p>
        <p type="p">100:透明顯示器</p>
        <p type="p">101:第一裝飾層</p>
        <p type="p">102:第二裝飾層</p>
        <p type="p">101LC、102LC:膽固醇液晶層</p>
        <p type="p">CL:環境光</p>
        <p type="p">LE:左旋圓偏光</p>
        <p type="p">RE:右旋圓偏光</p>
        <p type="p">S1、S2:表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="565px" img-content="tif" inline="yes" orientation="portrait" width="829px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622362</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145166</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">F04C18/16</main-classification>
        <further-classification edition="200601120250204B">F04C29/00</further-classification>
        <further-classification edition="200601120250204B">F04C29/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>復盛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU SHENG INDUSTRIAL CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泰瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TAIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳雨峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>壓縮機結構</chinese-title>
        <english-title>COMPRESSOR STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種壓縮機結構，包括壓縮機殼體、油槽、油氣桶、電機、第一安裝座、至少一油過濾器、第二安裝座及至少一油細分離器。壓縮機殼體具有壓縮腔。油槽設置於壓縮機殼體的下方。油氣桶連通於油槽，且壓縮機殼體與油槽位於油氣桶的同一側。電機與第一安裝座分別設置於壓縮機殼體的相對兩側。第一安裝座具有排氣流道，且壓縮腔通過排氣流道連通於油氣桶。油過濾器設置於第一安裝座上，並通過第一安裝座與壓縮腔相連通。第二安裝座設置於油氣桶上。油細分離器設置於第二安裝座上，並通過第二安裝座與油氣桶相連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compressor structure including a compressor housing, an oil tank, an oil-gas barrel, a motor, a first assembly base, at least one oil filter, a second assembly base, and at least one oil mist separator is provided. The compressor housing has a compression chamber. The oil tank is disposed below the compressor housing. The oil-gas barrel is communicated with the oil tank, and the compressor housing and the oil tank are located at the same side of the oil-gas barrel. The motor and the first assembly base are respectively disposed at two opposite sides of the compressor housing. The first assembly base has an air outtake passage, and the compression chamber is communicated with the oil-gas barrel through the air outtake passage. The oil filter is disposed on the first assembly base and communicated with the compression chamber through the first assembly base. The second assembly base is disposed on the oil-gas barrel. The oil mist separator is disposed on the second assembly base and is communicated with the oil-gas barrel through the second assembly base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:壓縮機結構</p>
        <p type="p">110:壓縮機殼體</p>
        <p type="p">120:油槽</p>
        <p type="p">121:外部線形凸肋</p>
        <p type="p">130:油氣桶</p>
        <p type="p">131:頂部</p>
        <p type="p">132:底部</p>
        <p type="p">134、151b、153a、153b、182:連通口</p>
        <p type="p">135:觀油鏡</p>
        <p type="p">140:電機</p>
        <p type="p">150:第一安裝座</p>
        <p type="p">151:油濾座</p>
        <p type="p">152:軸承座</p>
        <p type="p">153:軸承座蓋</p>
        <p type="p">160:油過濾器</p>
        <p type="p">180:油細分離器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="915px" img-content="tif" inline="yes" orientation="portrait" width="806px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622363</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145167</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">F04C18/16</main-classification>
        <further-classification edition="200601120250204B">F04C29/00</further-classification>
        <further-classification edition="200601120250204B">F04C29/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>復盛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU SHENG INDUSTRIAL CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泰瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TAIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳雨峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>壓縮機結構</chinese-title>
        <english-title>COMPRESSOR STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種壓縮機結構，包括壓縮機殼體、油槽、油氣桶、電機、第一安裝座、至少一油過濾器、第二安裝座及至少一油細分離器。壓縮機殼體具有壓縮腔。壓縮機殼體、油槽及油氣桶為一體鑄造成型的結構。電機與第一安裝座分別設置於壓縮機殼體的相對兩側。第一安裝座具有油氣流道，且壓縮腔通過油氣流道連通於油氣桶。油過濾器設置於第一安裝座上，並通過第一安裝座與壓縮腔相連通。第二安裝座設置於油氣桶上。油細分離器設置於第二安裝座上，並通過第二安裝座與油氣桶相連通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A compressor structure including a compressor housing, an oil tank, an oil-gas barrel, a motor, a first assembly base, at least one oil filter, a second assembly base, and at least one oil mist separator is provided. The compressor housing has a compression chamber. The compressor housing, the oil tank, and the oil-gas barrel are integrally cast and formed. The motor and the first assembly base are respectively disposed at two opposite sides of the compressor housing. The first assembly base has an oil-gas flow passage, and the compression chamber is communicated with the oil-gas barrel through the oil-gas flow passage. The oil filter is disposed on the first assembly base and communicated with the compression chamber through the first assembly base. The second assembly base is disposed on the oil-gas barrel. The oil mist separator is disposed on the second assembly base and is communicated with the oil-gas barrel through the second assembly base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:壓縮機結構</p>
        <p type="p">110:壓縮機殼體</p>
        <p type="p">120:油槽</p>
        <p type="p">130:油氣桶</p>
        <p type="p">131:頂部</p>
        <p type="p">132:底部</p>
        <p type="p">134、151b、153a、153b、182:連通口</p>
        <p type="p">135:觀油鏡</p>
        <p type="p">140:電機</p>
        <p type="p">150:第一安裝座</p>
        <p type="p">151:油濾座</p>
        <p type="p">152:軸承座</p>
        <p type="p">153:軸承座蓋</p>
        <p type="p">160:油過濾器</p>
        <p type="p">180:油細分離器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="889px" img-content="tif" inline="yes" orientation="portrait" width="757px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622500</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145168</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">G01N33/48</main-classification>
        <further-classification edition="200601120250204B">G01N27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHIH-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃勝國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐文斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敬文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>生物晶片</chinese-title>
        <english-title>BIOCHIP</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種生物晶片，包括電路基板、封裝材料層、第一膠體以及上基板。封裝材料層配置於電路基板上，封裝材料層包括第一擋牆，第一擋牆對電路基板的正投影圍繞一區域，第一擋牆具有相對的內側與外側，內側面對於區域。第一膠體完整環繞於外側。上基板具有注入孔，且包括第一導電層，第一導電層從注入孔暴露出來，其中在電路基板的法線方向上，注入孔與區域重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A biological chip includes a circuit substrate, a packaging material layer, a first colloid and an upper substrate. The packaging material layer is arranged on the circuit substrate. The packaging material layer includes a first retaining wall. An orthographic projection of the first retaining wall on the circuit substrate surrounds an area. The first retaining wall has opposite inner and outer sides, and the inner side faces the area. The first colloid completely surrounds the outside. The upper substrate has an injection hole and includes a first conductive layer exposed from the injection hole, wherein the injection hole overlaps the area in a normal direction of the circuit substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:生物晶片</p>
        <p type="p">110:電路基板</p>
        <p type="p">111:基底</p>
        <p type="p">120:封裝材料層</p>
        <p type="p">121:第一擋牆</p>
        <p type="p">122:第二擋牆</p>
        <p type="p">130:第一膠體</p>
        <p type="p">140:上基板</p>
        <p type="p">141:注入孔</p>
        <p type="p">142:第一導電層</p>
        <p type="p">143:基底</p>
        <p type="p">160:導電膠</p>
        <p type="p">A1:距離</p>
        <p type="p">BL:緩衝層</p>
        <p type="p">CL:控制電極層</p>
        <p type="p">E1:第一端</p>
        <p type="p">E2:第二端</p>
        <p type="p">E3:第三端</p>
        <p type="p">E4:第四端</p>
        <p type="p">G1:第一黏著層</p>
        <p type="p">G2:第二黏著層</p>
        <p type="p">G3:第三黏著層</p>
        <p type="p">G4:第四黏著層</p>
        <p type="p">GI:閘極絕緣層</p>
        <p type="p">H1、H2:疏水層</p>
        <p type="p">IB:離子阻障層</p>
        <p type="p">M1:第一金屬層</p>
        <p type="p">M2:第二金屬層</p>
        <p type="p">POL:主動層</p>
        <p type="p">R1:區域</p>
        <p type="p">S1:內側</p>
        <p type="p">S2:外側</p>
        <p type="p">SA:樣本</p>
        <p type="p">S/D:源/汲極</p>
        <p type="p">X、Y、Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="663px" img-content="tif" inline="yes" orientation="portrait" width="1037px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622591</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145169</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250203B">G02B27/01</main-classification>
        <further-classification edition="201301120250203B">G10L21/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商艾沛芯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APACECORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>擴增實境裝置與聲音視覺化方法</chinese-title>
        <english-title>AUGMENTED REALITY DEVICE AND SOUND VISUALIZATION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種聲音視覺化的擴增實境裝置，包含顯示器、聲音感測器以及處理器。聲音感測器用以感測聲音訊號。處理器辨識聲音訊號的聲音資訊，此聲音資訊包含聲源的種類或者方向。處理器也用以將聲音資訊轉換為影像資訊，並且將影像資訊顯示在顯示器上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention proposes an augmented reality device for sound visualization, which includes a display, a sound sensor, and a processor. The sound sensor detects a sound signal. The processor identifies sound information from the sound signal, where this sound information includes a type or a direction of a sound source. The processor also converts the sound information into visual information and display this visual information on the display.</p>
      </isu-abst>
      <representative-img>
        <p type="p">701~703:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="483px" img-content="tif" inline="yes" orientation="portrait" width="602px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623072</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145170</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">H01M4/96</main-classification>
        <further-classification edition="200601120241231B">C23C14/14</further-classification>
        <further-classification edition="201601120241231B">H01M8/0234</further-classification>
        <further-classification edition="201601120241231B">H01M8/0206</further-classification>
        <further-classification edition="201101120241231B">B21D26/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛翔峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, HSIANG CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許恭銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUNY-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁塘偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, TANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾建偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, JIAN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>金屬雙極板預塗層、其製造方法、利用其製造的金屬雙極板及其製造方法</chinese-title>
        <english-title>PRE-COATING OF METAL BIPOLAR PLATE, METHOD OF FORMING THE SAME, METAL BIPOLAR PLATE PRODUCED BY USING THE SAME AND METHOD OF PRODUCING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種金屬雙極板預塗層及其製造方法。金屬雙極板預塗層係用以成形於金屬基板的表面上。金屬雙極板預塗層包含設置在金屬基板上的中介層，其中中介層包含過渡金屬碳化物；以及設置在中介層上的表面導電層，其中表面導電層包含石墨層，且表面導電層的厚度為0.2 μm至1.0 μm。此金屬雙極板預塗層具有較佳的耐腐蝕性及導電性，可應用於金屬雙極板及其製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pre-coating of a metal bipolar plate and a method of forming the same are provided. The pre-coating of the metal bipolar plate is used to form on a surface of a metal substrate. The pre-coating of the metal bipolar plate includes an intermediate layer disposed on the metal substrate, in which the intermediate layer includes transition metal carbide; and a surface conductive layer disposed on the intermediate layer, in which the surface conductive layer includes a graphite layer, and a thickness of the surface conductive layer is in a range of 0.2 μm to 1.0 μm. The pre-coating of the metal bipolar plate can have improved corrosion resistance and electrical conductivity, thereby being applied to the metal bipolar plate and the method of producing the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:金屬雙極板預塗層</p>
        <p type="p">110:金屬基板</p>
        <p type="p">120:中介層</p>
        <p type="p">130:表面導電層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.bmp" file="ed10003.bmp" height="527px" img-content="tif" inline="yes" orientation="portrait" width="832px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622851</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145171</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q30/0241</main-classification>
        <further-classification edition="202301120250303B">G06Q30/0251</further-classification>
        <further-classification edition="200601120250303B">G06F3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商艾沛芯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APACECORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智慧行動廣告系統與行動廣告系統的控制方法</chinese-title>
        <english-title>INTELLIGENT MOBILE ADVERTISING SYSTEM AND CONTROL METHOD OF MOBILE ADVERTISING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種智慧行動廣告系統，包含以下元件。移動裝置用以在環境中移動。顯示器設置於移動裝置上以提供多媒體廣告。感測器設置於移動裝置上以取得環境資訊。處理器設置於移動裝置上並電性連接至顯示器以及感測器。處理器根據環境資訊偵測環境中的多個人，並辨識這些人的多個受眾資訊，此受眾資訊用以評估廣告效益。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an intelligent mobile advertising system, including the following components. A moving device is configured to move within an environment. A display is mounted on the moving device to provide multimedia advertisements. A sensor is installed on the moving device to capture environmental information. A processor is installed on the mobile device and is electrically connected to the display and the sensor. The processor detects people in the environment based on the environmental information and identifies various target information of these people. This target information is used to evaluate effectiveness of the advertisement.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110,120,130,140:智慧行動廣告系統</p>
        <p type="p">111,121,131,141:移動裝置</p>
        <p type="p">112,122,132,142:顯示器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="706px" img-content="tif" inline="yes" orientation="portrait" width="868px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622506</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145173</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">G01P5/02</main-classification>
        <further-classification edition="200601120250204B">G01P1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹崑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KUN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>風速測量組件</chinese-title>
        <english-title>WIND SPEED MEASURING ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風速測量組件包含出風口配置以產生風流。風速測量組件包含基板、治具以及風速計。基板包含熱電偶孔。治具夾持基板。出風口以及治具位於基板之相反兩側。風速計設置於治具上並毗鄰熱電偶孔。風速計遠離出風口。風流沿著一方向流向熱電偶孔。出風口、風速計以及熱電偶孔於所述方向上排列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wind speed measuring assembly includes an air outlet configured to generate ab airflow. The wind speed measuring assembly includes a substrate, a fixture, and an anemometer. The substrate includes a thermocouple hole. The fixture clamps the substrate. The air outlet and the fixture are located at two opposite sides of the substrate. The anemometer is disposed on the fixture and adjacent to the thermocouple hole. The anemometer is away from the air outlet. The air flow flows to the thermocouple hole along a direction. The air outlet, the anemometer, and the thermocouple hole are arranged in the direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:風速測量組件</p>
        <p type="p">110:基板</p>
        <p type="p">120:治具</p>
        <p type="p">130:風速計</p>
        <p type="p">AF:風流</p>
        <p type="p">DF:散熱鰭片</p>
        <p type="p">OL:出風口</p>
        <p type="p">TC:熱電偶孔</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="761px" img-content="tif" inline="yes" orientation="portrait" width="1010px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622136</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145174</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241216B">C08F283/00</main-classification>
        <further-classification edition="200601120241216B">C08G61/02</further-classification>
        <further-classification edition="200601120241216B">C08G65/48</further-classification>
        <further-classification edition="200601120241216B">C08L51/08</further-classification>
        <further-classification edition="200601120241216B">C08L65/00</further-classification>
        <further-classification edition="200601120241216B">C08L71/10</further-classification>
        <further-classification edition="200601120241216B">C08J5/24</further-classification>
        <further-classification edition="200601120241216B">B32B15/08</further-classification>
        <further-classification edition="200601120241216B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台燿科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN UNION TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江仁吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, JEN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孟暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MENG-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃煒新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂組成物及其應用</chinese-title>
        <english-title>RESIN COMPOSITION AND USES OF THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂組成物，其包含：        &lt;br/&gt;（A）具有茚滿結構之馬來醯亞胺化合物；以及        &lt;br/&gt;（B）具有乙烯性不飽和雙鍵之成分，其係選自以下群組：具式（I）結構之化合物、具式（II）結構之化合物、及其組合，        &lt;br/&gt;&lt;img align="absmiddle" height="137px" width="416px" file="ed10040.JPG" alt="ed10040.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;其中，A、R、X、Y、m、及n係如本文中所定義。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A resin composition is provided. The resin composition comprises:        &lt;br/&gt;(A) a maleimide compound with an indane structure; and        &lt;br/&gt;(B) a component having ethylenically unsaturated double bond(s), which is selected from the group consisting of a compound having a structure of formula (I), a compound having a structure of formula (II), and combinations thereof,        &lt;br/&gt;&lt;img align="absmiddle" height="81px" width="385px" file="ed10041.JPG" alt="ed10041.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="83px" width="412px" file="ed10042.JPG" alt="ed10042.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein A, R, X, Y, m, and n are as defined in the specification.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">：無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622388</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145175</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250203B">F16B39/282</main-classification>
        <further-classification edition="200601120250203B">F16B39/284</further-classification>
        <further-classification edition="200601120250203B">F16B39/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>健策精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENTECH PRECISION INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王泓溢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊方瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, PO-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昌旗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHANG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>鎖固組合</chinese-title>
        <english-title>FASTENING ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鎖固組合包含螺母結構以及螺絲。螺母結構包含螺母頭以及卡扣件。螺母頭具有螺孔。卡扣件與螺母頭沿軸線排列。卡扣件包含底環以及複數個彈性臂。彈性臂設置於底環並繞軸線排列，彈性臂分別至少部分朝向螺孔延伸，彈性臂中每一者具有內螺紋。螺絲配置以先耦合內螺紋後再耦合螺孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fastening assembly includes a nut structure and a screw. The nut structure includes a nut head and a locking piece. The nut head has a screw hole. The locking piece and the nut head are aligned alone an axis. The locking piece includes a base ring and a plurality of elastic arms. The elastic arms are disposed on the base ring and arranged around the axis. The elastic arms at least partially extend towards the screw hole respectively. Each of the elastic arms has an inner thread. The screw is configured to firstly couple with the inner thread and then the screw hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鎖固組合</p>
        <p type="p">110:螺母結構</p>
        <p type="p">111:螺母頭</p>
        <p type="p">112:主體</p>
        <p type="p">113:壁體</p>
        <p type="p">116:卡扣件</p>
        <p type="p">117:底環</p>
        <p type="p">118:彈性臂</p>
        <p type="p">1181:螺紋部</p>
        <p type="p">1182:連接部</p>
        <p type="p">120:螺絲</p>
        <p type="p">121:螺紋段</p>
        <p type="p">122:本體段</p>
        <p type="p">122S:承托面</p>
        <p type="p">130:限位套筒</p>
        <p type="p">131:套環</p>
        <p type="p">132:凸出部</p>
        <p type="p">HP:起子孔</p>
        <p type="p">HS:螺孔</p>
        <p type="p">SI:內螺紋</p>
        <p type="p">SO:外螺紋</p>
        <p type="p">XL:軸線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="1057px" img-content="tif" inline="yes" orientation="portrait" width="671px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621655</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145177</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241219B">A61F7/08</main-classification>
        <further-classification edition="200601120241219B">A61N5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃怡綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃怡綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銀澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>治療過敏性鼻炎的熱敷裝置</chinese-title>
        <english-title>A HEAT THERAPY DEVICE FOR TREATING ALLERGIC RHINITIS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種治療過敏性鼻炎的熱敷裝置，包括一眼鼻熱敷罩、一上背熱敷墊及一控制器。該眼鼻熱敷罩用以配戴於使用者頭部，並罩設雙眼及其周圍部位，更包括相互組裝的一內蓋、一外蓋、一第一發熱模組、一貼合環圈及一頭帶，並可藉由該第一發熱模組產生波長介於9~10μm的遠紅外線。該上背熱敷墊可供固定於該使用者上背部位，且內部設置有一第二發熱模組，可產生波長介於9~10μm的遠紅外線，用以照射人體上背部位的特定穴道。該控制器用以開關控制該眼鼻熱敷罩與上背熱敷墊產生遠紅外線照射於眼鼻與上背部位，可對過敏性鼻炎產生治療效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat therapy device for treating allergic rhinitis, comprising an eye-nose heating eye mask, an upper back heating pad, and a controller. The eye-nose heating eye mask is designed to be worn on the user’s head, covering the eyes and surrounding areas. It includes an inner cover, an outer cover, a first heating module, an adhesive ring, and a head strap. The first heating module can generate far-infrared rays with wavelengths between 9~10 μm. The upper back heating pad is designed to be fixed on the user's upper back and contains a second heating module, which can emit far-infrared rays with wavelengths between 9~10 μm to target specific acupoints on the upper back. The controller enables the on/off control of the eye-nose heating eye mask and upper back heating pad, allowing far-infrared irradiation to the eye-nose area and upper back, which can have therapeutic effects on allergic rhinitis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:熱敷裝置</p>
        <p type="p">10:眼鼻熱敷罩</p>
        <p type="p">20:上背熱敷墊</p>
        <p type="p">30:控制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="538px" img-content="tif" inline="yes" orientation="portrait" width="708px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621656</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145179</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241212B">A61F7/08</main-classification>
        <further-classification edition="200601120241212B">A61N5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃怡綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃怡綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銀澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>治療耳鳴的熱敷裝置</chinese-title>
        <english-title>A HEAT THERAPY DEVICE FOR TINNITUS TREATMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種治療耳鳴的熱敷裝置，包括一頭戴式熱敷耳機、一頸部熱敷儀及一控制器。該頭戴式熱敷耳機可供配戴於使用者頭部，且具有二熱敷耳罩分別罩設貼合於使用者左、右耳部，除了提供音樂，還設置多數個第一發熱模組至少分別對應靠近於各耳部的神門穴、耳穴腎點、耳穴內耳點及耳穴交感點，可在通電狀態下產生波長介於9~10μm的遠紅外線。該頸部熱敷儀可供貼合於使用者後頸部，並設置至少一第二發熱模組，可在通電狀態下產生波長介於9~10μm的遠紅外線，用以照射刺激後頸部。該控制器可有線或無線開關控制所述頭戴式熱敷耳機與頸部熱敷儀。據此，本發明的熱敷裝置可對過敏性鼻炎產生治療效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat therapy device for tinnitus treatment, comprising a head-worn thermal earphone, a neck-heating pillow, and a controller. The head-worn thermal earphone is designed to be worn on the user’s head and features two thermal ear covers that fit snugly over the user’s left and right ears. In addition to providing audio playback, it is equipped with multiple first heating modules, each positioned to correspond to acupoints near the ears, such as the Shenmen, Kidney, Inner Ear, and Sympathetic ear acupoints. When powered, these modules emit far-infrared rays with wavelengths between 9 and 10 μm.The neck-heating pillow is designed to rest against the back of the user’s neck and includes at least one second heating module that, when powered, emits far-infrared rays with wavelengths between 9 and 10 μm to stimulate the back of the neck. The controller can switch the head-worn thermal earphone and neck-heating pillow on or off via a wired or wireless connection. Accordingly, this thermal application device provides a therapeutic effect for allergic rhinitis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:熱敷裝置</p>
        <p type="p">10:頭戴式熱敷耳機</p>
        <p type="p">20:頸部熱敷儀</p>
        <p type="p">30:控制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="565px" img-content="tif" inline="yes" orientation="portrait" width="655px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621714</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145182</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120241205B">A61K35/745</main-classification>
        <further-classification edition="200601120241205B">A61P1/00</further-classification>
        <further-classification edition="201601120241205B">A23L33/135</further-classification>
        <further-classification edition="201601120241205B">A23K10/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葡萄王生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAPE KING BIO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳勁初</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳炎鍊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詩偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王啟憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CI-SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯毓欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡侑珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YOU-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石仰慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YANG-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林靜雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雅君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YA-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江佳琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳姿和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZI-HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>雷特氏雙歧桿菌（Ｂｉｆｉｄｏｂａｃｔｅｒｉｕｍ　ｌａｃｔｉｓ）ＧＫＫ２用於製造改善腸道菌相、延長腸道益菌定殖率之醫藥組合物之用途</chinese-title>
        <english-title>USE OF BIFIDOBACTERIUM LACTIS GKK2 IN THE MANUFACTURE OF A　PHARMACEUTICAL COMPOSITION FOR IMPROVING INTESTINAL FLORA AND PROLONGING THE COLONIZATION RATE OF BENEFICIAL INTESTINAL BACTERIA</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包含雷特氏雙歧桿菌（        &lt;i&gt;Bifidobacterium lactis&lt;/i&gt;）GKK2之組合物，其可用於改善腸道菌相、促進腸道益菌的定殖率，延長腸道益菌於腸道中的活性。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a composition containing        &lt;i&gt;Bifidobacterium lactis&lt;/i&gt;GKK2, which can be used to improve intestinal bacteria, promote the colonization rate of intestinal beneficial bacteria, and prolong the survival of intestinal beneficial bacteria in the intestine.      </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="503px" img-content="tif" inline="yes" orientation="portrait" width="713px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621611</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145184</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241219B">A47C27/08</main-classification>
        <further-classification edition="200601120241219B">A47C27/10</further-classification>
        <further-classification edition="200601120241219B">A47C27/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聖州企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMOSA SAINT JOSE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊明舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MING-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>內膽分離式充氣墊結構</chinese-title>
        <english-title>INFLATABLE MATTRESS STRUCTURE WITH SEPARABLE AIR COLUMN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為內膽分離式充氣墊結構，一種內膽分離式充氣墊結構包括有：外包覆罩；包覆空間；至少一第一分隔件；以及氣柱內膽。一種內膽分離式充氣墊結構包括有：外包覆罩；包覆空間；複數第一分隔件；至少一第二分隔件；以及氣柱內膽。藉由本發明之實施，內膽分離式充氣墊結構具有可以簡單設置、操作或收藏；分離式外包覆罩與氣柱內膽，有效大幅降低晃動；容易拆下清理、修補、更換，不管是外包覆罩或是氣柱內膽破損，內膽分離式充氣墊結構仍可快速繼續使用；可以依據需求或喜好，選擇或快速更換不同的外包覆罩；製造容易，使用單一模具即可生產各種不同尺寸之內膽分離式充氣墊結構；可分隔包覆區並使用獨立之氣柱內膽，使不同包覆區之間不易產生晃動且不會互相干擾等特殊功效，使內膽分離式充氣墊結構可立即適用於車用、家庭、醫院或野外等場所等各種不同的應用需求，達到多功能應用之目的，有效增加使用者使用意願及適宜使用的應用場合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses inflatable mattress structures with separable air column. One inflatable mattress structure with separable air column includes a cover, inside space, at least one first divider and an air column. Another inflatable mattress structure with separable air column includes a cover, inside space, plural first dividers, at least one second divider and an air column. With the implementation of the present invention, inflatable mattress structures can be easily set up, operated or stored; vibrations are greatly reduced; easy to clean or repair; cover is easy to change; operable when maintaining; multiple size making with one single mold. With standalone enwrapping areas filled with standalone air columns, interferences between different standalone enwrapping areas on the same inflatable mattress structure are effectively prevented. All these benefits make the inflatable mattress structures suitable for car use, home use, hospital applications or entertainment applications, and improve effectively the application occasions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:內膽分離式充氣墊結構</p>
        <p type="p">10:外包覆罩</p>
        <p type="p">11:第一罩面</p>
        <p type="p">12:第二罩面</p>
        <p type="p">20:包覆空間</p>
        <p type="p">21:隔間</p>
        <p type="p">30:第一分隔件</p>
        <p type="p">40:氣柱內膽</p>
        <p type="p">41:端部</p>
        <p type="p">50:充放氣閥</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="450px" img-content="tif" inline="yes" orientation="portrait" width="591px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622380</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145185</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">F16B13/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冠誠國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CPC FASTENERS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫銘一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, MING-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>膨脹螺絲</chinese-title>
        <english-title>EXPANSION SCREW</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明膨脹螺絲，其在於螺栓上形成有一鑽鎖部，該鑽鎖部最大外徑大於一作動套管之最大外徑，而該鑽鎖部之鑽體上開設有呈相反方向之兩溝槽，且該鑽體之一端連接於一桿體，另一端主要形成有呈凹設之兩連接段，一位於該兩連接段間之鑽尖，分別與該兩連接段呈連接之兩鑽削刃，以及兩切削刃，每一切削刃係形成於每一溝槽之一側；是以，藉由該鑽尖搭配該兩鑽削刃、該兩切削刃的合作下，以及該兩連接段的設計，故該鑽鎖部鑽切時，以達該鑽鎖部可於鎖設時自行鑽孔進行切削，最後再利用該鑽鎖部對該作動套管頂掣膨脹，有效達到固鎖、膨脹定位等功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An expansion screw is characterized in that a drilling portion is formed on a bolt portion. A maximum outer diameter of the drilling portion is greater than a maximum outer diameter of a sleeve unit. Two opposite grooves are disposed on a drilling body of the drilling portion. One end of the drilling body is connected to a shank while another end of the drilling body is provided with two connecting sections recessedly formed, a tip located between the connecting sections, two severing edges connected to the connecting sections respectively, and two cutting edges. Each cutting edge is formed at one side of each groove. Thus, the cooperation of the severing edges, the cutting edges, the tip, and the connecting sections allows the drilling portion to execute the self-drilling and cutting movements during a drilling operation of the drilling portion. The drilling portion then expands the sleeve unit, thereby attaining the effects of fixing, expanding, and positioning effectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:膨脹螺絲</p>
        <p type="p">4:螺栓</p>
        <p type="p">5:作動套管</p>
        <p type="p">6:螺帽</p>
        <p type="p">41:桿體</p>
        <p type="p">42:螺牙</p>
        <p type="p">43:鑽鎖部</p>
        <p type="p">51:膨脹部</p>
        <p type="p">52:連接部</p>
        <p type="p">431:鑽體</p>
        <p type="p">432:連接段</p>
        <p type="p">433:鑽尖</p>
        <p type="p">434:鑽削刃</p>
        <p type="p">435:溝槽</p>
        <p type="p">436:切削刃</p>
        <p type="p">437:緊固部</p>
        <p type="p">A:物件</p>
        <p type="p">B:第一端</p>
        <p type="p">C:第二端</p>
        <p type="p">D:凹槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="693px" img-content="tif" inline="yes" orientation="portrait" width="1099px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622356</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145188</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F01K27/02</main-classification>
        <further-classification edition="200601120241230B">A47J37/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樹德科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU-TE UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林群超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHYUN-CHAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃郁倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇翊媖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BO-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>熱轉換供電裝置及具有熱轉換供電裝置之烤肉爐</chinese-title>
        <english-title>A THERMOELECTRIC POWER SUPPLY DEVICE AND A BARBECUE GRILL EQUIPPED THEREWITH</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種熱轉換供電裝置及具有熱轉換供電裝置之烤肉爐，其中，熱轉換供電裝置，其將熱電模組設置於殼體中，殼體外部設有磁性結構，以將殼體吸附於發熱金屬物件上，使熱電模組之熱接觸端可更好的靠近發熱金屬物件上，並由電池模組之儲能端儲存熱電模組所產生之電能，以此，實現便攜式的廢熱回收目的，並且可將此一熱轉換供電裝置與烤肉爐結合，藉此，利用烤肉爐所產生的熱源轉換成電能，解決使用者於野外活動中對電力的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a thermoelectric power supply device and a barbecue grill equipped therewith. A thermoelectric module is installed within a casing featuring a magnetic structure on its exterior, which enables the thermoelectric module to contact with a heat-generating metal object. This design ensures that the hot contact end of the thermoelectric module is positioned in proximity of the heat-generating metal object. A energy storage component of a battery module stores the electrical energy generated by the thermoelectric module. This facilitates portable waste heat recovery. Additionally, the thermoelectric power supply device can be integrated with a barbecue grill, allowing heat generated by the grill to be converted into electrical energy, thereby addressing the user's power needs during outdoor activities.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:殼體</p>
        <p type="p">11:容置空間</p>
        <p type="p">12:抓握部</p>
        <p type="p">2:熱電模組</p>
        <p type="p">21:冷卻端</p>
        <p type="p">22:熱接觸端</p>
        <p type="p">3:磁性結構</p>
        <p type="p">4:電池模組</p>
        <p type="p">41:儲能端</p>
        <p type="p">42:供電端</p>
        <p type="p">43:控制整合單元</p>
        <p type="p">5:太陽能發電模組</p>
        <p type="p">6:逆變器</p>
        <p type="p">7:插座</p>
        <p type="p">71:交流電插孔</p>
        <p type="p">72:直流電插孔</p>
        <p type="p">D:熱轉換供電裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="993px" img-content="tif" inline="yes" orientation="portrait" width="712px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621570</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145189</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241212B">A23D9/007</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙特利生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MODLEE BIOTECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳琪穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QIYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林見軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種植物性油粉配方</chinese-title>
        <english-title>A KIND OF VEGETABLE OIL POWDER FORMULA</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種植物性油粉配方，特別是經不同脂肪酸比例搭配而成之油粉作為飲食中理想的脂肪攝取來源者，其主要是以Omega-3：Omega-6：Omega-9比例為1：1：3的油粉配方，依美國心臟協會油脂飲食建議使用植物油來源及參考「國人膳食營養素參考攝取量及其說明第八版」，使用富含Omega-6多元不飽和脂肪酸的大豆油、富含Omega-3多元不飽和脂肪酸的亞麻仁油，並增加富含Omega-9單元不飽脂肪酸的芥花油及新型高單元不飽和葵花籽油搭配為最佳油粉配方，直接使用即可達到營養需求，對高齡者使用上極具便利性，為提供素食者油脂最佳來源，且無使用魚來源油脂亦無魚過敏原之疑慮，是提供各種不同需求者油脂攝食之良好來源者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a plant-based oil powder formula, especially an oil powder prepared by mixing different fatty acid ratios as an ideal source of fat intake in the diet. The formula is mainly based on the ratio of Omega-3: Omega-6: Omega-9. It is an oil powder formula of 1:1:3 According to the American Heart Association's dietary recommendations for fats and oils, use vegetable oil sources and refer to the "Chinese Dietary Nutrient Reference Intakes and Interpretations, Eighth Edition". Use soybean oil rich in Omega-6 polyunsaturated fatty acids and Omega-3 polyunsaturated fatty acids. Flaxseed oil, canola oil rich in Omega-9 monounsaturated fatty acids and new high monounsaturated sunflower oil are added to form the best oil powder formula. It can meet nutritional needs by direct use and is suitable for the elderly. It is extremely convenient and provides the best source of fats for vegetarians. It does not use fish-derived fats and has no concerns about fish allergens. It is a good source of fats for people with different needs.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622990</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145191</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260302B">G16H20/70</main-classification>
        <further-classification edition="202601120260302B">G06T11/00</further-classification>
        <further-classification edition="201701120260302B">G06T7/90</further-classification>
        <further-classification edition="200601120260302B">A61B5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>逢甲大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭月妹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YUEH MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顔貽祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAN, YEE SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁詩婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIONG, SZE TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於情緒波動即時渲染圖像的方法及其系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭基於情緒波動即時渲染圖像的方法及其系統，其中，該方法，係包括以下步驟：步驟A：取得一原始圖像；步驟B：將該原始圖像分解為複數個顏色區塊；步驟C：取得由至少一生理檢測裝置所檢測出一受測者的一即時情緒資訊，其中，該即時情緒資訊至少包括與該受測者情緒狀態相關的生理數據；步驟D：讀取來自於一資料庫中的一情緒顏色資訊，並基於該情緒顏色資訊分析出與該即時情緒資訊相匹配的至少一情緒顏色，其中，該情緒顏色資訊包含不同情緒狀態及其相對應的該情緒顏色之關係；步驟E：將該情緒顏色取代該原始圖像的至少一顏色區塊，從而生成一即時渲染圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:生理檢測裝置</p>
        <p type="p">20:運算裝置</p>
        <p type="p">21:處理單元</p>
        <p type="p">22:資料庫</p>
        <p type="p">23:顯示單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="731px" img-content="tif" inline="yes" orientation="portrait" width="632px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622773</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145193</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250203B">G06F16/909</main-classification>
        <further-classification edition="202301120250203B">G06Q10/06</further-classification>
        <further-classification edition="200601120250203B">G01C21/26</further-classification>
        <further-classification edition="200601120250203B">G09F27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭春發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHUN-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭國泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KUO-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>以行動定位系統資訊進行導覽及活動規劃管理系統及其方法</chinese-title>
        <english-title>GUIDING AND ACTIVITY PLANNING MANAGEMENT SYSTEM AND METHOD THEREOF WITH MOBILE POSITION SYSTEMATIC DATA</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種導覽規劃管理方法包含：提供一主動式導覽器於一行動通訊裝置，並利用該主動式導覽器接收一行動定位系統訊號；將該主動式導覽器連接通訊於一雲端導覽系統，且依該行動定位系統訊號該主動式導覽器於該雲端導覽系統主動尋找一位置所屬導覽資訊及一可導覽位置範圍；於該可導覽位置範圍內該主動式導覽器於該行動通訊裝置主動顯示一提示導覽資訊，以便獲得一確認資訊；依該確認資訊於該行動通訊裝置播放該位置所屬導覽資訊；該主動式導覽器持續確認該行動定位系統訊號是否符合於該可導覽位置範圍，以便決定持續或終止播放該位置所屬導覽資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An activity planning management method includes: providing a mobile communication device with an active guider which receives mobile position systematic data; communicating the active guider with a cloud guiding system, with actively searching a guiding audio data and a guidable area in the cloud guiding system; the active guider providing a confirmation inquiry on the mobile communication device within the guidable area to thereby receive confirmation response from a user; according to the confirmation response the active guider displaying the guiding audio data on the mobile communication device; the active guider determining the mobile position systematic data to comply with the guidable area so as to continue or terminate displaying the guiding audio data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:行動定位系統</p>
        <p type="p">10:主動式導覽器</p>
        <p type="p">100:行動定位系統訊號</p>
        <p type="p">20:行動通訊裝置</p>
        <p type="p">200:雲端導覽系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="306px" img-content="tif" inline="yes" orientation="portrait" width="664px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623075</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145194</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">H01M8/18</main-classification>
        <further-classification edition="200601120241231B">B67D3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊上慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, SHANG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱進寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHIN-PAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余雅蕙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, YA-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>儲液槽的液位平衡裝置及其操作方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR LIQUID LEVEL BALANCE OF RESERVOIR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種儲液槽的液位平衡裝置，其以一導通管組連通一第一儲液槽的一第一管、一第三管及連通一第二儲液槽的一第二管，並藉由設置於該第一管與該導通管組的一第一導通管之間的一第一通液閥、設置於該第二管與該導通管組的一第二導通管之間的一第二通液閥及設置於該第三管與該第一導通管之間的一第三通液閥，使容納於該第一儲液槽中一第一液體及容納於該第二儲液槽中一第二液體達到液位高度要求，以利進行電解或其他工業製程需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a liquid level balance device, a conduit assembly is connected to a first tube and a third tube of a first reservoir and connected to a second tube of a second reservoir, and levels of a first liquid in the first reservoir and a second liquid in the second reservoir can be adjusted using a first valve mounted between the first tube and a first conduit of the conduit assembly, a second valve mounted between the second tube and a second conduit of the conduit assembly and a third valve mounted between the third tube and the first conduit to reach requirement for electrolysis or other processes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:儲液槽的液位平衡裝置</p>
        <p type="p">110:第一儲液槽</p>
        <p type="p">111:第一管</p>
        <p type="p">112:第三管</p>
        <p type="p">120:第二儲液槽</p>
        <p type="p">121:第二管</p>
        <p type="p">122:第四管</p>
        <p type="p">130:第一通液閥</p>
        <p type="p">140:第二通液閥</p>
        <p type="p">150:第三通液閥</p>
        <p type="p">160:第四通液閥</p>
        <p type="p">170:導通管組</p>
        <p type="p">171:第一導通管</p>
        <p type="p">172:第二導通管</p>
        <p type="p">173:第三導通管</p>
        <p type="p">180:出氣閥</p>
        <p type="p">181:出氣口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="807px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622020</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145196</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241216B">C04B35/66</main-classification>
        <further-classification edition="202201120241216B">B09B3/20</further-classification>
        <further-classification edition="202201120241216B">B09B3/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中仁有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHONG REN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鐘仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>鎂碳球及其製造方法</chinese-title>
        <english-title>MAGNESIA-CARBON BALLS AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鎂碳球及其製造方法。該鎂碳球製造方法，包含：一第一破碎步驟，將使用過回收之鎂碳磚以破碎機進行粗破碎形成鎂碳塊；一第二破碎步驟，將該第一破碎步驟所得之鎂碳塊進行細破碎形成鎂碳粉；一混拌步驟，將該第二破碎步驟所得之鎂碳粉與一耐火材摻和進行混拌活性化；一膠結步驟，將該混拌步驟所得之該高活性鎂碳粉與一膠結材進行混拌膠結；一造塊步驟，利用造塊機進行擠壓造塊形成一鎂碳球；及一乾燥步驟，將該鎂碳球置於一乾燥溫度及一乾燥時間進行除濕乾燥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnesia-carbon ball and its manufacturing method are provided. The manufacturing method includes: a first crushing step, where recycled magnesia-carbon bricks are coarsely crushed into magnesia-carbon blocks using a crusher; a second crushing step, where the magnesia-carbon blocks are finely crushed into magnesia-carbon powder; a mixing step, where the magnesia-carbon powder obtained from the second crushing step is blended with a refractory material and activated by mixing; a binding step, where the activated magnesia-carbon powder is mixed with a binder for binding; a shaping step, where the mixture is compressed and shaped into magnesia-carbon balls using a shaping machine; and a drying step, where the magnesia-carbon balls are dehydrated and dried at a set temperature and duration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S0):第一破碎步驟</p>
        <p type="p">(S1):第一破碎步驟</p>
        <p type="p">(S2):混拌步驟</p>
        <p type="p">(S3):膠結步驟</p>
        <p type="p">(S4):造塊步驟</p>
        <p type="p">(S5):乾燥步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="711px" img-content="tif" inline="yes" orientation="portrait" width="388px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622503</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145198</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250805B">G01N33/68</main-classification>
        <further-classification edition="200601120250805B">G01N33/50</further-classification>
        <further-classification edition="201101120250805B">B82Y5/00</further-classification>
        <further-classification edition="202501120250805B">H10D84/83</further-classification>
        <further-classification edition="202501120250805B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>超拍科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淑萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHU-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁玉芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有氧化銦錫薄膜塗覆之垂直排列矽奈米線及其在靈敏奈米電子裝置中的應用</chinese-title>
        <english-title>INDIUM TIN OXIDE FILM COATED UPSTANDING SILICON NANOWIRES (ITO/USNWS) AND THE USE THEREOF IN SENSITIVE NANOELECTRONIC DEVICE (NED)</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種奈米結構感測基板，其包含具有氧化銦錫(ITO)塗層之垂直排列的矽奈米線(ITO/USNWs)。所述ITO/USNWs是通過經由銀金屬輔助化學蝕刻方法製作垂直排列矽奈米線(USNWs)，並於降低矽奈米線的密度後塗覆氧化銦錫塗層製備而成。此外，經生物受體修飾的ITO/USNWs被開發用於作為延伸式閘極場效電晶體裝置的感測基板，實現無標記檢測與生物標記相關的疾病，例如阿茲海默症、急性心肌梗塞、冠狀動脈疾病、肝性腦病、肺纖維化、庫欣氏綜合症以及癌症。此外，被氧化銦錫塗層塗覆的垂直排列矽奈米線也可用於奈米化細胞的生物感測器中，以細胞受藥物釋放影響的電性定量評估。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a nanostructural sensing substrate comprising indium tin oxide (ITO) film coated upstanding silicon nanowires (ITO/USNWs). The ITO/USNWs are fabricated by coating an ITO film on USNWs, the density of which has been reduced using a facile Ag-assisted chemical etching method. Furthermore, the bioreceptor modified ITO/USNWs are developed to serve as the sensing substrate of the EGFETs device for label-free diagnosis of biomarker related diseases, such Alzheimer’s disease (AD), asacute myocardial infarction, coronary artery disease (CAD), hepatic encephalopathy, lung fibrosis, Cushing's syndrome and cancers. The ITO-coated-USNWs are also used in nano-featured cell-based biosensors (CBB) for electrically quantitative evaluation of drug release.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="863px" img-content="tif" inline="yes" orientation="portrait" width="444px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623152</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145199</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250113B">H02K9/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱美電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張裕銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>單多年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>馬達裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種馬達裝置，包含一定子單元及一轉子單元。該定子單元包括一導磁件、二上下對合以夾設該導磁件的絕緣架，及複數繞設於該絕緣架上的線圈繞組。每一絕緣架還開設有複數散熱槽。該轉子單元包括一罩覆該定子單元的外殼罩。該外殼罩沿軸向開設出複數連通該等散熱槽的散熱孔。每一散熱槽會沿徑向延伸通過其中一線圈繞組的內部，且沿軸向延伸而在該線圈繞組的兩側產生開口，故當該外殼罩因旋轉而使氣流由該等散熱孔進入該外殼罩內時，氣流會進入該等散熱槽而產生對流，從而冷卻該等線圈繞組的內部，並提高每一線圈繞組與氣流的接觸面積以提升散熱效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:定子單元</p>
        <p type="p">3:轉子單元</p>
        <p type="p">4:絕緣架</p>
        <p type="p">41:內殼座</p>
        <p type="p">42:承載支臂</p>
        <p type="p">421:外殼壁</p>
        <p type="p">423:通槽</p>
        <p type="p">43:止擋板</p>
        <p type="p">44:散熱槽</p>
        <p type="p">441:流通區段</p>
        <p type="p">442:引導區段</p>
        <p type="p">5:導磁件</p>
        <p type="p">51:電磁鋼片</p>
        <p type="p">6:線圈繞組</p>
        <p type="p">7:樞轉機構</p>
        <p type="p">71:內軸管</p>
        <p type="p">72:軸承</p>
        <p type="p">73:樞軸</p>
        <p type="p">8:外殼罩</p>
        <p type="p">81:散熱孔</p>
        <p type="p">9:磁環</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="723px" img-content="tif" inline="yes" orientation="portrait" width="748px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622960</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145200</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250303B">G10L25/48</main-classification>
        <further-classification edition="201301120250303B">G10L25/51</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪子頡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, TZU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪逸群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, I-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>異音偵測方法及異音偵測系統</chinese-title>
        <english-title>ABNORMAL SOUND DETECTION METHOD AND ABNORMAL SOUND DETECTION SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了異音偵測方法及異音偵測系統。該異音偵測方法包含以下步驟：訓練一判斷模組，使該判斷模組具有一設備的一正常音訊特徵範圍；獲得該設備的一待測音訊；濾除該待測音訊中的一環境音訊，以獲得一處理後待測音訊；從該處理後待測音訊中提取出一待測音訊特徵；將該待測音訊特徵輸入至該判斷模組；以及通過該判斷模組比對該待測音訊特徵是否落於該正常音訊特徵範圍之內，並且輸出一異音偵測結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an abnormal sound detection method and an abnormal sound detection system. The abnormal sound detection method includes the following steps: training a determination module, wherein the determination module has a normal audio characteristic range of an apparatus; obtaining an audio to be tested of the apparatus; filtering out an environmental audio in the audio to be tested to obtain a processed audio to be tested; extracting a characteristic of audio to be tested from the processed audio to be tested; inputting the characteristic of audio to be tested into the determination module; and comparing whether the characteristic of audio to be tested within the normal audio characteristic range and outputting an abnormal sound detection result by the determination module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:異音偵測方法</p>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
        <p type="p">S140:步驟</p>
        <p type="p">S150:步驟</p>
        <p type="p">S160:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="1000px" img-content="tif" inline="yes" orientation="portrait" width="776px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622525</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145201</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">G01R31/28</main-classification>
        <further-classification edition="202001120250401B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆常青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MU, CHANG QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>提供電子元件中部分腳位單獨檢測的系統及其方法</chinese-title>
        <english-title>PROVIDING INDIVIDUAL DETECTION OF SOME PINS IN ELECTRONIC COMPONENT SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種提供電子元件中部分腳位單獨檢測的系統及其方法，當檢測平台自使用者裝置接收電路元件配置圖以及檢測請求時，依據電路元件配置圖各個電子元件型號自元件模型資料庫查詢出對應的檢測模型資料，再確認每一個電子元件的每一個腳位的外部連接狀態，並選擇腳位的外部連接狀態為已連接對應的腳位內部連接定義以及腳位參數進行電子元件對應腳位的導通與基本功能檢測，藉此可以達成提供電子元件中部分腳位單獨檢測以及提供多個電子元件彼此之間串聯電子元件腳位檢測的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A providing individual detection of some pins in electronic component system and a method thereof are provided. Detection model information are inquired according to each electronic component types in a circuit component configuration diagram from a component model database when the circuit component configuration diagram and a detection request are received by a detection platform from a user device. External connection statuses of each pins of each electronic components are confirmed by the detection platform. Pin internal connection definition and pin parameters are selected to continuity and basic function detection of corresponding pins of electronic components when the external connection statuses of each pins are connected. Therefore, the efficiency of providing individual detection of some pins in electronic components and providing electronic component pin detection when multiple electronic components connected in series with each other may be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:使用者裝置</p>
        <p type="p">20:檢測平台</p>
        <p type="p">21:元件模型資料庫</p>
        <p type="p">22:查詢模組</p>
        <p type="p">23:連線確認模組</p>
        <p type="p">24:檢測模組</p>
        <p type="p">25:檢測覆蓋率模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="953px" img-content="tif" inline="yes" orientation="portrait" width="585px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622756</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145202</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F13/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙晉東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JIN DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張天超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, TIAN CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓雪山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, XUE SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>遠端設備虛擬化通訊的驅動與存取控制系統及其方法</chinese-title>
        <english-title>DRIVER AND ACCESS CONTROL SYSTEM FOR REMOTE DEVICE VIRTUALIZATION COMMUNICATION AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種遠端設備虛擬化通訊的驅動與存取控制系統及其方法，擴展電路板的擴展CPLD透過LVDS與對外連接介面傳輸數據至外部設備使外部設備執行相應指令，且擴展CPLD儲存有擴展暫存器映射表，擴展暫存器映射表儲存對外連接介面的控制行為、資料輸入輸出以及狀態監測的資訊，控制CPLD提供LVDS與GPMC訊號的訊號轉換，且控制CPLD儲存有多個控制暫存器映射表，每一個控制暫存器映射表與控制USB Type-C埠對應連接的擴展電路板的擴展暫存器映射表對應，且使用數據同步技術與對應的擴展暫存器映射表進行數據同步，控制裝置對控制暫存器映射表進行控制行為、資料輸入輸出以及狀態監測的變動以數據同步至對應的擴展暫存器映射表，以實現遠端控制外部設備的驅動與存取，藉此可以達成遠端控制外部設備的驅動與存取的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driver and access control system for remote device virtualization communication and a method thereof are provided. An extended CPLD of an extended circuit board transfers data to an external device through LVDS and an external connection interface to execute corresponding instructions. The extended CPLD stores an extended register mapping table and the extended register mapping table stores a control behavior, data input and output, and status monitoring information of the external connection interface. A controlled CPLD provides signal conversion of LVDS and GPMC signals. The controlled CPLD stores multiple control register mapping table and each control register mapping table corresponds to the extended register mapping table of the extended circuit board which is connected with control USB Type-C port. Using data synchronization technology to synchronize data between the control register mapping table and the corresponding extended register mapping table. A control device controls the control behavior, data input and output, and status monitoring changes of the control register mapping table and synchronizes the data to the corresponding extended register mapping table to realize remote control of the drive and access of external devices. Therefore, the efficiency of controlling the drive and access of external device remotely may be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:擴展電路板</p>
        <p type="p">11:對外連接介面</p>
        <p type="p">12:擴展CPLD</p>
        <p type="p">13:擴展USB Type-C埠</p>
        <p type="p">20:控制電路版</p>
        <p type="p">21:控制USB Type-C埠</p>
        <p type="p">22:控制CPLD</p>
        <p type="p">23:核心模組</p>
        <p type="p">24:乙太網路連接埠</p>
        <p type="p">30:控制裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="1023px" img-content="tif" inline="yes" orientation="portrait" width="697px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622809</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145203</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06N5/04</main-classification>
        <further-classification edition="201901120250303B">G06N20/00</further-classification>
        <further-classification edition="202301120250303B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝運</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於人工智慧的自動化數據處理系統及其方法</chinese-title>
        <english-title>AUTOMATED DATA PROCESSING SYSTEM BASED ON ARTIFICIAL INTELLIGENCE AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於人工智慧的自動化數據處理系統及其方法，客戶端提供詢問訊息至人工智慧平台，以透過決策代理將詢問訊息提供至大型語言模型以產生至少一任務並選擇對應的任務代理，任務代理執行被選取的任務以生成任務結果以及任務完成指令，反饋任務完成指令回決策代理，決策代理選擇接續的任務對應的任務代理，由回答代理將所有任務的任務結果使用人工智慧生成技術生成回答結果並反饋回客戶端，藉此可以達成基於人工智慧以提供便捷自動化數據處理的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automated data processing system based on artificial intelligence and a method thereof are provided. An ask message is provided to an artificial intelligence platform from a client. The ask message is provided to large language model through a router agent to generate at least one task and select the corresponding task agent. The task agent executes the selected task to generate a task result and a task completion instruction and feedback the task completion instruction to the router agent. The router agent selects the task agent corresponding to the subsequent task. An answering agent uses artificial intelligence generation technology to generate an answer result according to all tasks and feedback to the client. Therefore, the efficiency of providing automated data processing based on artificial intelligence conveniently may be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:客戶端</p>
        <p type="p">20:人工智慧平台</p>
        <p type="p">21:決策代理</p>
        <p type="p">22:任務代理</p>
        <p type="p">23:回答代理</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="937px" img-content="tif" inline="yes" orientation="portrait" width="640px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622813</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145204</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250303B">G06N20/00</main-classification>
        <further-classification edition="202301120250303B">G06Q10/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫學達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XUE DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於多時序模型的伺服器返修部件備件量預測系統及其方法</chinese-title>
        <english-title>FORECASTING SYSTEM FOR SERVER REPAIR SPARE PARTS BASED ON MULTIPLE TIME SERIES MODEL AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於多時序模型的伺服器返修部件備件量預測系統及其方法，透過執行資料探索及搭配歷史經驗資料，對歷史時序資料的原始特徵建立特徵分化規則，以便將原始特徵分割成多個分化特徵，再驗證分化特徵的有效性，以及評估分化特徵反應目標變量的變化，直到符合預設結果為止，接著，分割目標變量使其與分化特徵的數量相同且彼此對應，並且輸入至多時序模型作為訓練資料以進行訓練，在預測備件量時，接收當前時序資料以輸入至訓練完成的多時序模型，用以獲得準確的備件量預測結果，藉以達到提高伺服器的備件量的評估精確性之技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A forecasting system for server repair spare parts based on multiple time series model and method thereof is disclosed. By performing data exploration and leveraging historical experience data, feature differentiation rules are established for the raw features of historical time series data. This process allows the original features to be divided into multiple differentiated features. The validity of these differentiated features is then verified, and their ability to capture variations in the target variable is assessed until the predefined results are met. Next, the target variable is segmented to match the number of differentiated features, ensuring a one-to-one correspondence, and this data is input into multiple time series models for training. When forecasting spare parts demand, receives the current time series data, which is then fed into the trained multi-time series model to generate accurate spare parts quantity predictions. The mechanism is help to improve the accuracy of spare parts quantity evaluation for server.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:多時序模型</p>
        <p type="p">410a~410n:資料</p>
        <p type="p">411a~411n:時序模型</p>
        <p type="p">412a~412n:預測結果</p>
        <p type="p">413:備件量預測結果</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="834px" img-content="tif" inline="yes" orientation="portrait" width="721px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622658</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145205</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G05B19/418</main-classification>
        <further-classification edition="201701120250303B">G06T7/00</further-classification>
        <further-classification edition="202301220250303B">G06Q10/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭首君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, SHOU JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>整合生產線資料以提供異常分析輔助資料之裝置及方法</chinese-title>
        <english-title>DEVICE FOR INTEGRATING PRODUCTION LINE DATA TO PROVIDE AUXILIARY DATA FOR ABNORMAL ANALYSIS AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種整合生產線資料以提供異常分析輔助資料之裝置及方法，其透過由維修系統取得設置於光學檢測裝置後之檢測站判定目標物料異常時所產生之不良維修訊息後，依據不良位置訊息由整合光學檢測裝置所產生之光學檢測資料與生產線上之各控制管理系統所產生的控制管理資料所產生之光學測試資料表中讀出目標物料之物料資料，並依據不良維修訊息中之不良位置訊息由目標物料之物料影像上擷取元件位置圖像，及整合物料資料、不良維修訊息與元件位置圖像以產生目標物料之整合訊息之技術手段，可以整合不同檢測站的資料以提供系統化的分析輔助，並達成提高生產線異常分析效率之的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for integrating production line data to provide auxiliary data for abnormal analysis and a method thereof are provided. By obtaining defective repair information generated when an inspection station sited behind an optical inspection device determines that a target material is abnormal from a repair system, reading material data of the target material from an optical test data table generated by integrating optical inspection data generated by the optical inspection device and control management data generated by control management systems on the production line based on the defective repair information, capturing a component location image from a material image of the target material according to a location message in the defective repair information, and integrating the material data, the defective repair information and the component location image to generate integrated information for the target material, the device and the method can integrate data from different testing stations to provide systematic analysis assistance, and can achieve the effect of improving efficiency of production line abnormality analysis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟310:在目標物料通過設置於生產線上之光學檢測裝置後，取得光學檢測裝置所產生之光學檢測結果及生產線上之控制管理系統所產生之目標物料之控制管理資料</p>
        <p type="p">步驟320:整合光學檢測結果與控制管理資料以產生光學測試資料表</p>
        <p type="p">步驟330:由維修系統取得設置於光學檢測裝置後之檢測站判定目標物料異常時所產生之不良維修訊息</p>
        <p type="p">步驟340:依據不良維修訊息中之不良位置訊息由光學測試資料表中讀出目標物料之物料資料</p>
        <p type="p">步驟350:取得目標物料之物料影像，並依據不良維修訊息中之不良位置訊息由物料影像上擷取元件位置圖像</p>
        <p type="p">步驟370:整合物料資料、不良維修訊息與元件位置圖像以產生目標物料之整合訊息</p>
        <p type="p">步驟390:輸出整合訊息</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="1102px" img-content="tif" inline="yes" orientation="portrait" width="778px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622736</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145206</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F11/07</main-classification>
        <further-classification edition="201901120250303B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝運</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>以大型語言模型進行血緣檢查以定位異常之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR CHECKING LINEAGE OF DATA WITH LARGE LANGUAGE MODEL TO LOCATE ANOMALIES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以大型語言模型進行血緣檢查以定位異常之裝置及方法，其透過使用大型語言模型解析自然語言的異常定位請求以取得發生異常之目標資料之欄位訊息後，依據欄位訊息取得目標資料之血緣資料以產生表示發生異常之上游資料及/或服務的差異環節訊息，及透過大型語言模型以自然語言輸出包含差異環節訊息異常定位結果之技術手段，可以降低檢查過程複雜度與人員專業需求且減少檢查時間，並達成提高檢查效率、準確度與滿意度的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device and a method for checking lineage of data with a large language model to locate anomalies are provided. By using a large language model to parse an exception location request using natural language to obtain field information of a target data where the exception occurred, obtaining lineage data of the target data based on the field information to generate a discrepancy message indicating upstream data and/or service where the exception occurred, and using the large language model to output anomaly positioning results containing discrepancy message in natural language, the device and the method can reduce complexity of inspection process, professional needs of personnel and inspection time, and can achieve the effect of improving inspection efficiency and accuracy and user satisfaction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟310:取得目標資料之異常定位請求</p>
        <p type="p">步驟330:使用大型語言模型解析異常定位請求以取得特徵參數，特徵參數包含目標資料之欄位訊息</p>
        <p type="p">步驟350:依據欄位訊息取得目標資料之血緣訊息</p>
        <p type="p">步驟360:依據血緣訊息取得血緣資料，血緣資料包含上游資料與服務檢測結果</p>
        <p type="p">步驟370:比對上游資料與目標資料是否相符且依據服務檢測結果判斷產生上游資料之服務是否正常以產生差異環節訊息</p>
        <p type="p">步驟390:透過大型語言模型輸出異常定位結果，異常定位結果包含差異環節訊息</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="953px" img-content="tif" inline="yes" orientation="portrait" width="676px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623338</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145208</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">H05K7/20</main-classification>
        <further-classification edition="200601120250123B">G02F1/133</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達擎股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO DISPLAY PLUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范國宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, KUO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的一些實施例提供一種顯示裝置。顯示裝置包括固定結構、第一轉軸及第一顯示模組。固定結構包含第一側邊、相對於第一側邊的第二側邊及設置於第一側邊與第二側邊之間的第一散熱片。第一散熱片包含一第一承載面。第一轉軸包含第一固定元件及第二固定元件，且第一固定元件設置於第一承載面上。第一顯示模組包含第一顯示區及相鄰於第一顯示區的第一周邊區，且第二固定元件設置於第一周邊區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of this disclosure provide a display device. The display device includes a fixing structure, a first shaft, and a first display module. The fixed structure includes a first side, a second side opposite to the first side, and a first heat sink between the first side and the second side. The first heat sink includes first loading surface. The first shaft includes a first fixing element and a second fixing element, and the first fixing element is disposed on the first loading surface. The first display module includes a first display region and a first peripheral region adjacent to the first display region, and the second fixing element is disposed in the first peripheral region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">11:固定結構</p>
        <p type="p">112:第一散熱片</p>
        <p type="p">1122:第一散熱側</p>
        <p type="p">1124:第二散熱側</p>
        <p type="p">1126:第一承載面</p>
        <p type="p">1128:第一固定面</p>
        <p type="p">12:第一轉軸</p>
        <p type="p">13:第一顯示模組</p>
        <p type="p">132:第一顯示區</p>
        <p type="p">134:第一周邊區</p>
        <p type="p">15:控制模組</p>
        <p type="p">151:系統板</p>
        <p type="p">152:光源驅動板</p>
        <p type="p">153:訊號線</p>
        <p type="p">154:訊號組件</p>
        <p type="p">16:鉸接元件</p>
        <p type="p">3-3:剖面線</p>
        <p type="p">FR1:虛線方框</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="792px" img-content="tif" inline="yes" orientation="portrait" width="990px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621951</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145209</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B65B63/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃祖源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自動化整平系統及自動化整平方法</chinese-title>
        <english-title>AUTOMATED LEVELING SYSTEM AND AUTOMATED LEVELING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種自動化整平系統及自動化整平方法。自動化整平系統適用於整平至少一包裝袋。自動化整平系統包含整平裝置。整平裝置包含放置座和升降組件。放置座具有供至少一包裝袋放置的平面。升降組件連接放置座，並用以帶動放置座在第一位置和第二位置之間升降，以及進行加速度運動，以使至少一包裝袋受到重力與加速度運動的影響而在平面上重複掉落。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An automated leveling system and an automated leveling method are provided. The automated leveling system is used for leveling at least one packing bag. The automated leveling system includes a leveling device. The leveling device includes a carrying base and a raise and lower assembly. The carrying base has a plane for placing the at least one packing bag. The raise and lower assembly is connected to the carrying base to drive the carrying base to raise and lower and perform an acceleration movement between a first position and a second position, causing the at least one packing bag to be affected by gravity and the acceleration movement to fall repeatedly on the plane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:自動化整平系統</p>
        <p type="p">200:包裝袋</p>
        <p type="p">300:機架</p>
        <p type="p">400:供料裝置</p>
        <p type="p">500:輸送組件</p>
        <p type="p">510,520:輸送件</p>
        <p type="p">610,620:擋件</p>
        <p type="p">615:篩選通道</p>
        <p type="p">700:整平裝置</p>
        <p type="p">800:收納盒</p>
        <p type="p">930,950:偵測器</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="753px" img-content="tif" inline="yes" orientation="portrait" width="947px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622899</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145213</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260302B">G06V10/141</main-classification>
        <further-classification edition="200601120260302B">G06T5/40</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>頎邦科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPBOND TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭郁倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YU-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊暐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>蝕刻終點判定方法</chinese-title>
        <english-title>ETCHING ENDPOINT DETERMINATION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蝕刻終點判定方法包含：蝕刻系統對半導體裝置進行蝕刻；光學系統擷取半導體影像；運算裝置接收半導體影像，運算裝置之HV判斷模組取出HV通道數值，且HV判斷模組依據HV通道數值判斷是否達到蝕刻終點並輸出HV通道蝕刻終點判斷訊號；運算裝置之AI判斷模組對半導體影像進行影像處理而得到特徵強化影像，且AI判斷模組依據特徵強化影像判斷是否達到蝕刻終點並輸出AI蝕刻終點判斷訊號；以及運算裝置之判定模組接收HV通道蝕刻終點判斷訊號及AI蝕刻終點判斷訊號，判定模組依據HV通道蝕刻終點判斷訊號及AI蝕刻終點判斷訊號判定是否達到蝕刻終點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A etching endpoint determination method includes the following steps: the etching system performs etching on the semiconductor device; an optical system captures images of the semiconductor; a computing device receives the semiconductor images, where the HV determination module of the computing device extracts HV channel values, and based on the HV channel values, determines whether the etching endpoint has been reached and outputs the HV channel etching endpoint determination signal; the AI determination module of the computing device processes the semiconductor images to obtain feature-enhanced images, and based on the feature-enhanced images, determines whether the etching endpoint has been reached and outputs the AI etching endpoint determination signal; and the determination module of the computing device receives the HV channel etching endpoint determination signal and the AI etching endpoint determination signal, and determines whether the etching endpoint has been reached based on these two signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:蝕刻終點判定方法</p>
        <p type="p">11:蝕刻系統對半導體裝置進行蝕刻</p>
        <p type="p">12:光學系統擷取半導體裝置之半導體影像</p>
        <p type="p">13:取得HV通道數值及特徵強化影像</p>
        <p type="p">14:判定半導體裝置是否達到蝕刻終點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="612px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621728</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145217</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250701B">A61K39/285</main-classification>
        <further-classification edition="200601120250701B">A61K39/275</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>公益財團法人東京都醫學總合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO METROPOLITAN INSTITUTE OF MEDICAL SCIENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安井文彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUI, FUMIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小原道法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHARA, MICHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井孝司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保富康宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUTOMI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITOH, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小原恭子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOHARA, KYOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/040714</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>Ｍ痘疫苗</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種對屬於正痘病毒屬的病毒感染症的疫苗，其含有非增殖型減毒牛痘病毒DIs株。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="423px" img-content="tif" inline="yes" orientation="portrait" width="672px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623316</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145219</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">H05K1/02</main-classification>
        <further-classification edition="200601120250204B">H05B1/02</further-classification>
        <further-classification edition="200601120250204B">H05B3/02</further-classification>
        <further-classification edition="200601120250204B">H02H5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神基科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GETAC TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳李性</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李英維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>印刷電路板組件、加熱控制電路及其控制方法</chinese-title>
        <english-title>PRINTED CIRCUIT BOARD ASSEMBLY, HEATING CONTROL CIRCUIT AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路印刷板組件包含電路板、加熱電阻及開關。電路板包含組件層、訊號層、導電層及至少一導通孔。組件層具有用於裝設元件的裝設區。訊號層包含第一訊號線及第二訊號線。導電層設置在組件層及訊號層之間，包含導電圖形。至少一導通孔將第一訊號線連接至導電圖形。加熱電阻的第一端電性連接第一訊號線，且加熱電阻的第二端電性連接該第二訊號線。導電圖形、至少一導通孔、第一訊號線、加熱電阻、開關及第二訊號線電性串聯在電源電壓端及接地端之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A printed circuit board assembly includes a circuit board, a heating resistor and a switch. The circuit board includes a component layer, a signal layer, a conductive layer and a conductive via. The component layer has a installation region for installing a component. The signal layer includes a first signal trace and a second signal trace. The conductive layer is disposed between the component layer and the signal layer, and the component layer includes a conductive pattern. At least one conductive via connects the first signal trace to the conductive pattern. A first terminal of the heating resistor is electrically connected to the first signal trace, and a second terminal of the heating resistor is electrically connected to the second signal trace. The conductive pattern, the at least one conductive via, the first signal trace, the heating resistor, the switch and the second signal trace are electrically connected in sires between a power supply voltage terminal and a ground terminal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路印刷板組件</p>
        <p type="p">106:電路板</p>
        <p type="p">110:區域</p>
        <p type="p">112a~112d:加熱電阻</p>
        <p type="p">116:第一訊號線</p>
        <p type="p">118:第二訊號線</p>
        <p type="p">120:底層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="547px" img-content="tif" inline="yes" orientation="portrait" width="505px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622852</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145220</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250709B">G06Q30/0241</main-classification>
        <further-classification edition="202001120250709B">G06F40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴華國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡建郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃照峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>以ＡＩ應用實現提升關鍵字廣告效益的系統及實施方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR ENHANCING KEYWORD ADVERTISING EFFECTIVENESS THROUGH AI APPLICATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種以AI應用實現提升關鍵字廣告效益的系統及實施方法，供一用戶輸入需求指令，經由一語言處理模型基於需求指令收集、分析複數動態文本資料，提取複數動態文本資料中的複數重要字詞資訊，藉由一生成模型轉化為複數關鍵字資訊，對所述之關鍵字資訊進行排名、優選，以及組合，並基於經排名、優選，以及組合後的關鍵字資訊生成複數篇文章，一翻譯模組可對所生成之複數篇文章進行翻譯，使文章內容可以適用於不同國別；又，一文章上架模組可分別上架複數篇文章以實施AB測試，並分別對複數篇文章進行流量檢視，以調整上架網站之文章。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:以AI應用實現提升關鍵字廣告效益的系統及實施方法</p>
        <p type="p">11:伺服器</p>
        <p type="p">111:中央處理模組</p>
        <p type="p">12:網際網路</p>
        <p type="p">112:儲存裝置</p>
        <p type="p">13:用戶端資訊裝置</p>
        <p type="p">1121:動態資訊資料庫</p>
        <p type="p">1122:關鍵字資料庫</p>
        <p type="p">1123:文本生成資料庫</p>
        <p type="p">113:語言處理模型</p>
        <p type="p">1131:語意分析模組</p>
        <p type="p">1132:資料收集模組</p>
        <p type="p">1133:資料分析模組</p>
        <p type="p">114:生成模型</p>
        <p type="p">1141:關鍵字生成模組</p>
        <p type="p">1142:關鍵字分類模組</p>
        <p type="p">1143:關鍵字排名單元</p>
        <p type="p">1144:關鍵字優選單元</p>
        <p type="p">1145:關鍵字組合單元</p>
        <p type="p">1146:文章生成模組</p>
        <p type="p">115:翻譯模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="731px" img-content="tif" inline="yes" orientation="portrait" width="1126px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622776</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145222</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F17/15</main-classification>
        <further-classification edition="202301120250303B">G06N3/063</further-classification>
        <further-classification edition="202301120250303B">G06N3/045</further-classification>
        <further-classification edition="200601120250303B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YONG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張林昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪後禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HOU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智能處理單元及可變形卷積的運算方法</chinese-title>
        <english-title>INTELLIGENCE PROCESSING UNIT AND DEFORMABLE CONVOLUTION OPERATION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種智能處理單元及可變形卷積的運算方法。智能處理單元包含：記憶體、網格處理電路以及卷積計算電路。記憶體用來儲存一可變形卷積運算的一第一輸入資料的一部分、該可變形卷積運算的一偏差的一部分、該可變形卷積運算的一權重的一部分及一網格的一部分，該網格係由該可變形卷積運算的一偏移轉換而來。網格處理電路用來執行一網格取樣操作以基於該第一輸入資料及該網格產生一第二輸入資料。卷積計算電路用來對該第二輸入資料、該權重及該偏差執行一卷積運算以產生一輸出資料。該輸出資料實質上等於該可變形卷積運算之結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses an intelligence processing unit (IPU) and a deformable convolution operation method. The IPU includes: a memory, a grid processing circuit, and a convolution computation circuit. The memory is configured to store a part of a first input data of a deformable convolution operation, a part of a bias of the deformable convolution operation, a part of a weight of the deformable convolution operation, and a part of a grid, where the grid is derived from an offset transformation of the deformable convolution operation. The grid processing circuit is configured to perform a grid-sampling operation to generate a second input data based on the first input data and the grid. The convolution computation circuit is configured to perform a convolution operation on the second input data, the weight, and the bias to generate an output data. The output data is substantially identical to the result of the deformable convolution operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電子裝置</p>
        <p type="p">210:智能處理單元</p>
        <p type="p">212:直接記憶體存取電路</p>
        <p type="p">214:卷積計算電路</p>
        <p type="p">216:記憶體</p>
        <p type="p">218:網格處理電路</p>
        <p type="p">219:插值計算電路</p>
        <p type="p">220:外部記憶體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="628px" img-content="tif" inline="yes" orientation="portrait" width="996px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622748</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145224</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120250425B">G06F12/0802</main-classification>
        <further-classification edition="200601120250425B">G06F13/14</further-classification>
        <further-classification edition="200601120250425B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉紅江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HONG-JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高天</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, TIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體控制電路及其運作方法</chinese-title>
        <english-title>MEMORY CONTROLLER CIRCUIT AND OPERATION METHOD OF THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體控制電路，包含：資料緩衝電路、資料保持電路以及控制電路。資料緩衝電路用於存儲自記憶體讀取到的資料，其中記憶體包括有複數記憶體庫和與該複數記憶體庫對應的複數個通道。資料保持電路與該複數通道相連。控制電路被配置以：基於源自資料讀取指令的記憶體庫識別碼在資料緩衝電路的儲存量已滿時控制資料保持電路不選通記憶體庫識別碼對應的目標通道而將目標通道上的目標資料保持於目標通道；以及在儲存量未滿時控制資料保持電路選通目標通道以將目標通道上的目標資料讀取至資料緩衝電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory controller circuit that includes a data buffer circuit, a data holding circuit and a control circuit. The data buffer circuit stores data read from a memory that includes memory banks and channels corresponding to the memory banks. The data holding circuit is coupled to the channels. The control circuit is configured to, according to a memory bank ID from a data read command, control the data holding circuit to not enable a target channel that the memory bank ID corresponds to and hold target data on the target channel when a storage capacity of the data buffer circuit is full, and control the data holding circuit to t enable the target channel to read the target data to the data buffer circuit when the storage capacity of the data buffer circuit is not full.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:記憶體控制電路</p>
        <p type="p">200:識別碼緩衝電路</p>
        <p type="p">210:轉換與解析電路</p>
        <p type="p">220:資料緩衝電路</p>
        <p type="p">230:資料保持電路</p>
        <p type="p">240:控制電路</p>
        <p type="p">BID:記憶體庫識別碼</p>
        <p type="p">CDA:對應資料</p>
        <p type="p">CHA~CHD:通道</p>
        <p type="p">DRC:資料讀取指令</p>
        <p type="p">ITS:中斷訊號</p>
        <p type="p">MRC:記憶體讀取指令</p>
        <p type="p">SDA:儲存資料</p>
        <p type="p">SID:記憶體庫識別碼</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="738px" img-content="tif" inline="yes" orientation="portrait" width="786px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621986</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145225</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C01B33/12</main-classification>
        <further-classification edition="200601120241220B">C01B33/18</further-classification>
        <further-classification edition="200601120241220B">C03C1/02</further-classification>
        <further-classification edition="200601120241220B">C03C3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富宸材料國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FULL CHAIN MATERIALS INT'L CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席伐拉　拉傑　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SELVARAJ, RAJESH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳汪勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WANG-XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>石英純化方法及石英純化系統</chinese-title>
        <english-title>QUARTZ PURIFICATION METHOD AND QUARTZ PURIFICATION SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種改進的石英純化方法，採用探針式超聲輔助的多步驟程序，實現超高純度石英。該純化流程包括機械研磨、磁選、酸浸、超聲震盪輔助及乾燥等階段。酸浸過程使用鹽酸、硝酸、磷酸、過氧化氫及硫酸五種酸，按任意順序進行，以選擇性去除雜質。每次酸浸均配合探針式超聲震盪，透過超聲波加速反應動力學，提高雜質溶解效率，並減少殘留污染物。此多階段製程能有效去除金屬及非金屬雜質，同時保持石英結構完整性。超聲震盪與精確酸處理的協同效應，不僅提升純化效率，還具備高重現性與規模化特性，滿足對超純石英的高端應用需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention introduces an advanced methodology for the purification of quartz, utilizing a sequential multi-step process optimized by probe sonication to achieve ultra-high purity levels. The purification protocol comprises sequential stages of mechanical grinding, magnetic separation, acid leaching, ultrasonic oscillation, and subsequent drying to achieve high-purity quartz. The acid leaching process employing five distinct acids—hydrochloric acid, nitric acid, phosphoric acid, hydrogen peroxide, and sulfuric acid—in any sequence to selectively remove impurities. Each acid leaching step is augmented by probe sonication, where ultrasonic vibration forces enhance reaction kinetics, increase impurity dissolution efficiency, and minimize residual contaminants. This multi-stage approach ensures superior removal of metallic and non-metallic impurities while maintaining the structural integrity of quartz. The synergistic effect of ultrasonic vibration with tailored acid treatments establishes a highly efficient, reproducible, and scalable purification method, addressing the demands of advanced applications requiring ultra-pure quartz.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S60:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="687px" img-content="tif" inline="yes" orientation="portrait" width="826px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622792</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145226</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250425B">G06F30/33</main-classification>
        <further-classification edition="202001120250425B">G06F30/367</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李子宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林揚迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YANG-DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧啟富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電路檢查方法及電路檢查裝置</chinese-title>
        <english-title>CIRCUIT DETECTION METHOD AND CIRCUIT DETECTION DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種電路檢查方法，由處理器讀取儲存於記憶體的至少一指令所執行。電路檢查方法包含以下步驟：檢查目的電路對應的目的電源域是否處於開啟狀態；檢查目的電路之上一級的中間電路對應的中間電源域是否處於關閉狀態；以及若中間電路對應的中間電源域處於關閉狀態，且目的電路對應的目的電源域處於開啟狀態，產生電路檢查報告。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit detection method executed by a processor reading at least command stored in a memory is disclosed herein. The circuit detection method includes following steps: detecting whether a destination power domain corresponding to a destination circuit is in an active state; detecting whether an intermediate power domain corresponding to an intermediate circuit preceding the destination circuit is in an inactive state; and if the intermediate power domain corresponding to the intermediate circuit is in the inactive state and the destination domain corresponding to the destination circuit is in the active state, generating a circuit detection report.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電路檢查方法</p>
        <p type="p">210~230:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="687px" img-content="tif" inline="yes" orientation="portrait" width="757px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623115</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145227</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241223B">H01R13/52</main-classification>
        <further-classification edition="200601120241223B">F16L37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏致電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACES ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭榮勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, RONG-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒巧欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, CHIAU-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>軸推式防水連接器組及其母座防水連接器</chinese-title>
        <english-title>AXIS PUSH TYPE WATERPROOF CONNECTOR SET AND FEMALE WATERPROOF CONNECTOR THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種軸推式防水連接器組及其母座防水連接器，該母座防水連接器係包含一第一管體、一按壓卡扣件及一防壓件；其中該按壓卡扣件的一按壓部係間隔設置於該母座防水連接器的一第一管體的外側，並靠近該第一管體的一第一前管口，而該防壓件係可軸向移動地設置在該第一管體的外側，當該防壓件的一阻擋部移動至該第一管體的外側的第一位置時，該按壓卡扣件之該按壓部相對該第一管體的外側徑向移動一第一距離，當該防壓件的該阻擋部移動至該第一管體的外側的第二位置時，該按壓卡扣件之該按壓部相對該第一管體的外側徑向移動一第二距離；其中該第二距離係短於第一距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an axis push type waterproof connector set and female waterproof connector thereof. The female waterproof connector includes a first pipe body, a pressing buckle and an anti-pressure piece. A pressing part of the pressing is spaced apart on an outside of a first pipe body of the female waterproof connector and close to a first front pipe opening of the first pipe body. The anti-pressure piece is axially movably disposed on the outside of the first pipe body. When the anti-pressure piece moves to a first position on the outside of the first pipe body, the pressing part of the pressing buckle moves radially relative to the outside of the first pipe body by a first distance. When the anti-pressure piece moves to a second position on the outside of the first pipe body, the pressing part of the pressing buckle moves radially a second distance relative to the outside of the first pipe body. The second distance is shorter than the first distance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:防水連接器</p>
        <p type="p">10:母座防水連接器</p>
        <p type="p">11:第一管體</p>
        <p type="p">20:防壓件</p>
        <p type="p">22:推移部</p>
        <p type="p">25:第一水管接合件</p>
        <p type="p">30:按壓卡扣件</p>
        <p type="p">31:按壓部</p>
        <p type="p">50:公端防水連接器</p>
        <p type="p">60:第二水管接合件</p>
        <p type="p">71:第二活動閥件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="600px" img-content="tif" inline="yes" orientation="portrait" width="719px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623623</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145228</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="200601120260302B">G02B6/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昱論</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊健剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIUNG, CHIEN-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許穆平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MU-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張謝平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHIE-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體元件的製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體元件的製造方法包括提供第一晶圓。第一晶圓包括第一介電層、第一金屬層以及第一光學元件。第一金屬層與第一光學元件位於第一介電層中。第一金屬層的一部位與第一光學元件的一部位通過第一介電層暴露。製造方法還包括提供第二晶圓。第二晶圓包括基材、第二介電層以及第二金屬層。第二介電層位於基材上方。第二金屬層位於第二介電層中。第二金屬層的一部位通過第二介電層暴露。製造方法還包括將第一晶圓與第二晶圓對接，使得第一介電層接合於第二介電層，且第一金屬層接合於第二金屬層。第一光學元件接合於第二介電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a semiconductor device includes providing a first wafer. The first wafer includes a first dielectric layer, a first metal layer, and a first optical element. The first metal layer and the first optical element are in the first dielectric layer. A portion of the first metal layer and a portion of the first optical element are exposed through the first dielectric layer. The manufacturing method further includes providing a second wafer. The second wafer includes a substrate, a second dielectric layer, and a second metal layer. The second dielectric layer is over the substrate. The second metal layer is in the second dielectric layer. A portion of the second metal layer is exposed through the second dielectric layer. The manufacturing method further includes docking the first wafer and the second wafer, so that the first dielectric layer is bonded to the second dielectric layer, and the first metal layer is bonded to the second metal layer, in which the first optical element is bonded to the second dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100,200:晶圓</p>
        <p type="p">102,202:基材</p>
        <p type="p">104,204:介電層</p>
        <p type="p">106,206:金屬層</p>
        <p type="p">108:光學元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="583px" img-content="tif" inline="yes" orientation="portrait" width="409px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623260</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145229</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250303B">H04N21/85</main-classification>
        <further-classification edition="201101120250303B">H04N21/854</further-classification>
        <further-classification edition="201101120250303B">H04N21/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺北大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIPEI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳信龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何孟樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, MENG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>影片剪輯裝置及方法</chinese-title>
        <english-title>VIDEO EDITING DEVICE AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影片剪輯裝置及方法。該裝置基於一語音模型，產生對應該影片之複數個文字片段及對應該等文字片段各者之一時間區間。該裝置基於一大型語言模型，刪除該等文字片段各者中之至少一冗餘文字，以產生複數個目標文字片段，其中該等目標文字片段各者對應至之一目標時間區間。該裝置基於該影片、該等目標文字片段及該等目標時間區間，產生一精簡影片，其中該精簡影片包含對應於該等目標時間區間之複數個顯示文字，且該等顯示文字是基於該等目標文字片段產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A video editing device and method. The device is based on a speech model and generates a plurality of text fragments corresponding to the video and a time interval corresponding to each of the text fragments. The device is based on a large language model and deletes at least one redundant text in each of the text fragments to generate a plurality of target text fragments, wherein each of the target text fragments corresponds to a target time interval. The device generates a simplified video based on the video, the target text fragments and the target time intervals, wherein the simplified video includes a plurality of display text corresponding to the target time interval, and the display texts is generated based on the target text fragments.</p>
      </isu-abst>
      <representative-img>
        <p type="p">VED:影片剪輯裝置</p>
        <p type="p">11:收發介面</p>
        <p type="p">12:儲存器</p>
        <p type="p">13:處理器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="607px" img-content="tif" inline="yes" orientation="portrait" width="633px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621794</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145230</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">B01L3/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞禾生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEAT BIOTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭正輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIAU, JENG HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHUN LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於生物粒子之操作裝置</chinese-title>
        <english-title>MANIPULATION DEVICE FOR BIOLOGICAL PARTICLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於生物粒子之操作裝置包含基板、金屬傳導層、工作電極與保護層。金屬傳導層在基板上。工作電極在金屬傳導層上並電性連接金屬傳導層。保護層覆蓋金屬傳導層，保護層具有第一凹槽，第一凹槽暴露工作電極，且工作電極的頂表面高於第一凹槽的底部，其中保護層接觸工作電極的側壁。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manipulation device for biological particle includes a substrate a metal conductive layer, a working electrode and a protection layer. The metal conductive layer is over the substrate. The working electrode is over and electrically in contact with the metal conductive layer. The protection layer covers the metal conductive layer. The protection layer has a first recess exposing the working electrode. The top surface of the working electrode is higher than the bottom of the first recess, and the protection layer is in contact with the sidewall of the working electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">112:基材</p>
        <p type="p">114、130:絕緣層</p>
        <p type="p">120:金屬傳導層</p>
        <p type="p">140:通孔件</p>
        <p type="p">150:工作電極</p>
        <p type="p">160:保護層</p>
        <p type="p">162:氮化層</p>
        <p type="p">164:氧化層</p>
        <p type="p">B:目標生物粒子</p>
        <p type="p">H1、H2:高度</p>
        <p type="p">R1、R2:凹槽</p>
        <p type="p">T1、T2:厚度</p>
        <p type="p">W1、W2、W3:寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="675px" img-content="tif" inline="yes" orientation="portrait" width="879px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622583</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145232</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">G02B11/34</main-classification>
        <further-classification edition="202101120250204B">G02B7/02</further-classification>
        <further-classification edition="200601120250204B">G02B3/00</further-classification>
        <further-classification edition="202101120250204B">G03B17/28</further-classification>
        <further-classification edition="202101120250204B">G03B17/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林振誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施語函</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>取像光學透鏡組、取像裝置及電子裝置</chinese-title>
        <english-title>IMAGE CAPTURING OPTICAL LENS ASSEMBLY, IMAGING APPARATUS AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種取像光學透鏡組，由物側至像側依序包含八片透鏡，且所述八片透鏡由物側至像側為一第一透鏡、一第二透鏡、一第三透鏡、一第四透鏡、一第五透鏡、一第六透鏡、一第七透鏡以及一第八透鏡。各透鏡皆具有一物側表面朝向物側以及一像側表面朝向像側。第二透鏡物側表面近光軸處為凹面。第二透鏡像側表面近光軸處為凸面。第三透鏡具有正屈折力。第五透鏡像側表面近光軸處為凹面。第八透鏡具有負屈折力。當滿足特定條件時，可配合整體面形設計調整第五透鏡的空間配置，並有助於降低組裝難易度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image capturing optical lens assembly includes eight lens elements, which are, in order from an object side to an image side along a light path, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element. Each of the lens elements has an object-side surface facing towards the object side and an image-side surface facing towards the image side. The object-side surface of the second lens element is concave in a paraxial region thereof. The image-side surface of the second lens element is convex in a paraxial region thereof. The third lens element has positive refractive power. The image-side surface of the fifth lens element is concave in a paraxial region thereof. The eighth lens element has negative refractive power. When specific conditions of the image capturing optical lens assembly are satisfied, it is favorable for adjusting the space arrangement of the fifth lens element according to the entire surface shape design, and is also favorable for reducing the assembling difficulty.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:取像裝置</p>
        <p type="p">ST:光圈</p>
        <p type="p">E1:第一透鏡</p>
        <p type="p">E2:第二透鏡</p>
        <p type="p">E3:第三透鏡</p>
        <p type="p">E4:第四透鏡</p>
        <p type="p">E5:第五透鏡</p>
        <p type="p">E6:第六透鏡</p>
        <p type="p">E7:第七透鏡</p>
        <p type="p">E8:第八透鏡</p>
        <p type="p">E9:濾光元件</p>
        <p type="p">IMG:成像面</p>
        <p type="p">IS:電子感光元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10039.png" file="d10039.TIF" giffile="ed10039.png" height="711px" img-content="tif" inline="yes" orientation="portrait" width="830px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623555</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145238</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10P72/00</main-classification>
        <further-classification edition="202601120260303B">H10P72/70</further-classification>
        <further-classification edition="202601120260303B">H10W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABLEPRINT TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪誌宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORNG, CHIH-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>載板壓平裝置</chinese-title>
        <english-title>CARRIER LEVELING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種載板壓平裝置包含一框體、一第一承載件、一第二承載件以及一氣囊。第一承載件設置於框體內以承置一載板，第二承載件設置於框體內且位於第一承載件的上方，氣囊設置於第一承載件與第二承載件之間，氣囊的一端固定於第二承載件，且氣囊包含一彈性膜及連結彈性膜的一剛性板件。剛性板件可於氣囊充氣時朝第一承載件的方向移動並抵壓載板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A carrier leveling device includes a frame, a first supporting member, a second supporting member, and an airbag. The first supporting member is disposed within the frame to support a carrier, and the second supporting member is disposed within the frame and above the first supporting member. The airbag is disposed between the first and second supporting members, and one end of the airbag is fixed to the second supporting member. The airbag includes an elastic membrane and a rigid plate connected to the elastic membrane. When the airbag is inflated, the rigid plate moves towards the first supporting member and presses against the carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:處理腔室</p>
        <p type="p">100:載板壓平裝置</p>
        <p type="p">102:框體</p>
        <p type="p">110:載板處理組件</p>
        <p type="p">120、122、124:承載件</p>
        <p type="p">130:氣囊</p>
        <p type="p">Y:鉛直方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="687px" img-content="tif" inline="yes" orientation="portrait" width="969px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623112</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145239</doc-number>
          <kind></kind>
          <date>113/11/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250210B">H01R13/46</main-classification>
        <further-classification edition="200601120250210B">H01R13/514</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐虞企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TARNG YU ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞唐虞電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN TARNG YU ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃睦容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多件式電連接器</chinese-title>
        <english-title>MODULAR ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多件式電連接器，該多件式電連接器係可設置於電子設備中以傳輸訊號，該多件式電連接器係由多件的電連接器組件組合而構成，因此，在該多件式電連接器設計完成後，仍然可以藉由調整組合的多件電連接器組件，而達成客製化調整電連接器的對接埠特徵與導電端子數量，使該多件式電連接器可以適用於各式電子設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modular electrical connector, which can be installed in electronic devices to transmit signals, is composed of multiple connector components assembled together. This design allows for customization of the connector's mating port features and the number of conductive terminals even after the modular electrical connector has been finalized. As a result, the modular electrical connector can be adapted for use in various types of electronic devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:多件式電連接器</p>
        <p type="p">11:第一電連接器組件</p>
        <p type="p">111:第一絕緣膠芯</p>
        <p type="p">1111:第一膠芯對接埠</p>
        <p type="p">P1111:第一膠芯主要端子穿設通道</p>
        <p type="p">1115:第一膠芯端子位移止擋組件組合結構</p>
        <p type="p">12:第二電連接器組件</p>
        <p type="p">121:第二絕緣膠芯</p>
        <p type="p">1211:第二膠芯對接埠</p>
        <p type="p">12111:第二膠芯端子對接結構穿設空間</p>
        <p type="p">13:端子位移止擋組件</p>
        <p type="p">2:主要導電線材</p>
        <p type="p">3:對接構件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="934px" img-content="tif" inline="yes" orientation="portrait" width="711px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622939</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145240</doc-number>
          <kind></kind>
          <date>113/11/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120250203B">G09G3/32</main-classification>
        <further-classification edition="202001120250203B">H05B45/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商榮諭科技（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASPHETEK SOLUTION (CHENGDU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榮諭科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASPHETEK SOLUTION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡英宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張郁川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李璟林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHING-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEN-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示控制方法及相關設備</chinese-title>
        <english-title>DISPLAY CONTROL METHOD AND RELATED DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示控制方法及相關設備，顯示控制方法應用於顯示裝置，顯示裝置包括控制器和發光組件，控制器用於輸出驅動信號，驅動信號用於控制發光組件發光；顯示控制方法包括：獲取發光組件的工作溫度；若工作溫度大於預設溫度，根據工作溫度調整驅動信號，驅動信號的電流與工作溫度成正相關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display control method and related devices are provided. The display control method is applied to a display device. The display device includes a controller and a light emitting module. The controller is configured to output driving signals, and the driving signals are configured to control the light emitting module to emit light. The display control method includes: obtaining an operating temperature of the light emitting module; if the operating temperature is higher than a preset temperature, adjusting the drive signals according to the operating temperature, and a current of the drive signals being positively correlated with the operating temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="317px" img-content="tif" inline="yes" orientation="portrait" width="692px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623469</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145243</doc-number>
          <kind></kind>
          <date>113/11/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250509B">H10F77/40</main-classification>
        <further-classification edition="202501120250509B">H10F71/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宸賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHEN XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳紋如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>睿田能源有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEN ENERGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宸賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHEN XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳紋如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭朋深</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>利用類白色光陷阱導光板（膜）／擴散板（膜）提升彩色太陽能板色彩飽和度與光電轉換率的方法</chinese-title>
        <english-title>A METHOD OF USING AN OFF-WHITE LIGHT TRAP LIGHT GUIDE PLATE(FLIM)/DIFFUSION PLATE(FLIM) TO IMPROVE THE COLOR SATURATION AND PHOTOELECTRIC CONVERSION RATE OF A COLOR SOLAR PANEL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種利用類白色光陷阱導光板(膜)/擴散板(膜)提升彩色太陽能板色彩飽和度與光電轉換率的方法，其方法步驟為選擇類白色光陷阱導光板(膜)/擴散板(膜)，裁切成太陽能板尺寸，橋接墊高結構邊框採不吸光材料，進行彩色墨印刷或彩色膜料貼合，導光板(膜)/擴散板(膜)固定於墊高結構，墊高結構貼合太陽能板，光電轉換效率及色彩顯示性能測試，形成本發明的成品能提升太陽能板的光電轉換效率及色彩飽和度的技術為目的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is a method of using an off-white light trap light guide plate (film)/diffusion plate (film) to improve the color saturation and photoelectric conversion rate of a color solar panel. The method steps are to select an off-white light trap light guide plate (film) / Diffusion plate (film), cut to the size of the solar panel, the frame of the bridge pad structure is made of non-light absorbing material, printed with color ink or pasted with color film materials, the light guide plate (film) / diffusion plate (film) is fixed on the pad structure, the raised structure is attached to the solar panel, the photoelectric conversion efficiency and color display performance are tested, and the finished product of the present invention is formed to improve the photoelectric conversion efficiency and color saturation of the solar panel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">a:選擇類白色導光板(膜)/擴散板(膜)</p>
        <p type="p">b:裁切成太陽能板尺寸</p>
        <p type="p">c:墊高結構採不吸光材料</p>
        <p type="p">d:進行彩色墨印刷或彩色膜料貼合</p>
        <p type="p">e:導光板(膜)/擴散板(膜)固定於墊高結構</p>
        <p type="p">f:墊高結構貼合太陽能板</p>
        <p type="p">g:光電轉換效率及色彩顯示性能測試</p>
        <p type="p">h:成品</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="639px" img-content="tif" inline="yes" orientation="portrait" width="696px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621954</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145252</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241216B">B65D19/00</main-classification>
        <further-classification edition="200601120241216B">B29C45/00</further-classification>
        <further-classification edition="200601120241216B">C08L23/00</further-classification>
        <further-classification edition="200601120241216B">C08L23/12</further-classification>
        <further-classification edition="200601320241216B">B29K23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹俊哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHUN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林瑞榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JUI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>聚烯烴塑膠棧板及其製造方法</chinese-title>
        <english-title>POLYOLEFIN PLASTIC PALLET AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種聚烯烴塑膠棧板及其製造方法。聚烯烴塑膠棧板包含一基板。基板定義有一厚度距離，在基板的其中一側定義有一止滑表面。從止滑表面向下延伸10 %範圍內的厚度距離定義為一止滑層，止滑層提升止滑表面的抗滑係數。止滑層的組成包含聚烯烴彈性體及聚烯烴高分子，聚烯烴彈性體的重均分子量是介於1000至10000 g/mol，聚烯烴高分子的重均分子量是介於50000至300000 g/mol。基於止滑層的總重為100 wt%，聚烯烴彈性體的含量是介於1 wt%至10 wt%之間。基板的彎曲強度是介於24 MPa至28.5 MPa之間，止滑表面的抗滑係數不小於65 BPN。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a polyolefin plastic pallet and a manufacturing method thereof. The polyolefin plastic pallet includes a base plate. The base plate defines a thickness distance, and an anti-slip surface is defined on one side of the base plate. An anti-slip layer extends downward from the anti-slip surface by 10% of the thickness distance. The anti-slip layer can be configured to increase an anti-slip coefficient of the anti-slip surface. A composition of the anti-slip layer includes polyolefin elastomer and polyolefin polymer. A weight average molecular weight of the polyolefin elastomer is between 1000 and 10000 g/mol, and a weight average molecular weight of the polyolefin polymer is between 50000 and 300000 g/mol. mol. Based on the total weight of the anti-slip layer being 100 wt%, the content of the polyolefin elastomer is between 1 wt% and 10 wt%. The bending strength of the substrate is between 24 MPa and 28.5 MPa, and the anti-slip coefficient of the anti-slip surface is not less than 65 BPN.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:聚烯烴塑膠棧板</p>
        <p type="p">1:基板</p>
        <p type="p">11:止滑層</p>
        <p type="p">11a:止滑表面</p>
        <p type="p">2:簍空部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="665px" img-content="tif" inline="yes" orientation="portrait" width="941px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623094</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145253</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120250303B">H01Q5/30</main-classification>
        <further-classification edition="200601120250303B">H01Q1/22</further-classification>
        <further-classification edition="200601120250303B">H01Q1/24</further-classification>
        <further-classification edition="200601120250303B">H01Q9/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張琨盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敬基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>支援寬頻操作之行動裝置</chinese-title>
        <english-title>MOBILE DEVICE SUPPORTING WIDEBAND OPERATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種支援寬頻操作之行動裝置，包括：一饋入輻射部、一延伸輻射部、一短路輻射部、一輔助輻射部、一接地輻射部，以及一介質基板。饋入輻射部具有一饋入點。延伸輻射部係耦接至饋入輻射部。饋入輻射部和延伸輻射部皆經由短路輻射部耦接至一接地電位。輔助輻射部係耦接至饋入輻射部。接地輻射部係耦接至接地電位，其中接地輻射部係鄰近於饋入輻射部。饋入輻射部、延伸輻射部、短路輻射部、輔助輻射部，以及接地輻射部皆設置於介質基板上。饋入輻射部、延伸輻射部、短路輻射部、輔助輻射部，以及接地輻射部係共同形成一天線結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mobile device supporting wideband operations includes a feeding radiation element, an extension radiation element, a shorting radiation element, an auxiliary radiation element, a grounding radiation element, and a dielectric substrate. The feeding radiation element has a feeding point. The extension radiation element is coupled to the feeding radiation element. The feeding radiation element and the extension radiation element are coupled through the shorting radiation element to a ground voltage. The auxiliary radiation element is coupled to the feeding radiation element. The grounding radiation element is coupled to the ground voltage. The grounding radiation element is adjacent to the feeding radiation element. The feeding radiation element, the extension radiation element, the shorting radiation element, the auxiliary radiation element, and the grounding radiation element are disposed on the dielectric substrate. An antenna structure is formed by the feeding radiation element, the extension radiation element, the shorting radiation element, the auxiliary radiation element, and the grounding radiation element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:行動裝置</p>
        <p type="p">110:饋入輻射部</p>
        <p type="p">111:饋入輻射部之第一端</p>
        <p type="p">112:饋入輻射部之第二端</p>
        <p type="p">115:饋入輻射部之第一增寬部份</p>
        <p type="p">120:延伸輻射部</p>
        <p type="p">121:延伸輻射部之第一端</p>
        <p type="p">122:延伸輻射部之第二端</p>
        <p type="p">130:短路輻射部</p>
        <p type="p">131:短路輻射部之第一端</p>
        <p type="p">132:短路輻射部之第二端</p>
        <p type="p">140:輔助輻射部</p>
        <p type="p">141:輔助輻射部之第一端</p>
        <p type="p">142:輔助輻射部之第二端</p>
        <p type="p">150:接地輻射部</p>
        <p type="p">151:接地輻射部之第一端</p>
        <p type="p">152:接地輻射部之第二端</p>
        <p type="p">155:接地輻射部之第二增寬部份</p>
        <p type="p">160:L字形單極槽孔</p>
        <p type="p">170:介質基板</p>
        <p type="p">190:信號源</p>
        <p type="p">FP:饋入點</p>
        <p type="p">GC1:第一耦合間隙</p>
        <p type="p">GC2:第二耦合間隙</p>
        <p type="p">L1,L2,L3,L4,L5,L6:長度</p>
        <p type="p">VSS:接地電位</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="714px" img-content="tif" inline="yes" orientation="portrait" width="957px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622485</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145258</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120250512B">G01N21/3504</main-classification>
        <further-classification edition="201401120250512B">G01N21/35</further-classification>
        <further-classification edition="200601120250512B">G01N29/34</further-classification>
        <further-classification edition="200601120250512B">G01N29/36</further-classification>
        <further-classification edition="200601120250512B">G01N29/24</further-classification>
        <further-classification edition="200601120250512B">G01N29/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈺太科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZILLTEK TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳振頤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣鎧宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, KAI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>氣體感測裝置與光聲光譜氣體感測器</chinese-title>
        <english-title>GAS SENSING DEVICE AND PHOTOACOUSTIC SPECTROSCOPY GAS SENSOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種氣體感測裝置與光聲光譜氣體感測器。氣體感測裝置包含一發射器以及一光聲光譜氣體感測器。發射器能發出一預定電磁波。光聲光譜氣體感測器設置於發射器的一側並包含一反應腔體、一容置腔體、一微機電單元、及一特定應用積體電路。反應腔體具有用來容置一氣體的一反應空間。反應腔體能被預定電磁波穿過至反應空間內，使氣體與預定電磁波產生一待測聲波。容置腔體連接反應腔體並具有一容置空間。容置腔體與反應腔體共同地具有一聲音通道。微機電單元設置於容置腔體內且覆蓋聲音通道，使待測聲波直接地被微機電單元感測。特定應用積體電路連接微機電單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gas sensing device and a photoacoustic spectroscopy gas sensor are provided. The gas sensing device includes an emitter and a photoacoustic spectroscopy gas sensor. The emitter is capable of emitting a predetermined electromagnetic wave. The photoacoustic spectroscopy gas sensor is positioned on one side of the emitter and includes a reaction chamber, a housing chamber, a microelectromechanical system (MEMS) unit, and an application-specific integrated circuit (ASIC). The reaction chamber has a reaction space for containing a gas to be measured. The reaction chamber allows the predetermined electromagnetic wave to pass through into the reaction space, causing the gas to react with the electromagnetic wave to produce detecting sound waves. The housing chamber is connected to the reaction chamber and has a housing space. Together, the housing chamber and the reaction chamber form a sound channel. The MEMS unit is located inside the housing chamber and covers the sound channel, enabling the MEMS unit to directly sense the detecting sound waves. The ASIC is connected to the MEMS unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:氣體感測裝置</p>
        <p type="p">1:載板</p>
        <p type="p">2:發射器</p>
        <p type="p">3:光聲光譜氣體感測器</p>
        <p type="p">31:反應腔體</p>
        <p type="p">311:環牆</p>
        <p type="p">312:透光蓋</p>
        <p type="p">313:電磁波遮罩</p>
        <p type="p">32:容置腔體</p>
        <p type="p">33:微機電單元</p>
        <p type="p">34:特定應用積體電路</p>
        <p type="p">4:反射蓋</p>
        <p type="p">5:透氣防塵網</p>
        <p type="p">D1:高度方向</p>
        <p type="p">D2:寬度方向</p>
        <p type="p">SP32:容置空間</p>
        <p type="p">SP31:反應空間</p>
        <p type="p">SP4:封閉空間</p>
        <p type="p">SC:聲音通道</p>
        <p type="p">H:最小預定間距</p>
        <p type="p">OP:開孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="687px" img-content="tif" inline="yes" orientation="portrait" width="956px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621824</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145272</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">B23K20/02</main-classification>
        <further-classification edition="200601120241231B">B23K35/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂金股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIRE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊東漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡志欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIH-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種異質接合結構及其製造方法</chinese-title>
        <english-title>A HETEROGENEOUS BONDING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種接合結構。接合結構包括：第一基板；第一奈米孿晶層，在第一基板上；以及第二基板，在第一奈米孿晶層上。在接合結構的剖面圖中，接近第一奈米孿晶層的上表面的至少1微米的第一區域包括第一平行排列孿晶界，且第一平行排列孿晶界具有50%以上的[111]結晶方位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonding structure is provided. The bonding structure includes a first substrate; a first nano-twinned layer on the first substrate; and a second substrate on the first nano-twinned layer. In a cross-sectional view of the bonding structure, a first region of at least 1 μm proximate an upper surface of the first nano-twinned layer includes a first parallel-arranged twin boundary, and the first parallel-arranged twin boundary includes 50% or more [111] crystal orientation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">10’:基板</p>
        <p type="p">14:奈米孿晶層</p>
        <p type="p">16:奈米孿晶柱</p>
        <p type="p">22:過渡晶粒層</p>
        <p type="p">24:退火孿晶</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="531px" img-content="tif" inline="yes" orientation="portrait" width="728px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623514</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145277</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/40</main-classification>
        <further-classification edition="202601120260302B">H10P14/692</further-classification>
        <further-classification edition="202601120260302B">H10P34/00</further-classification>
        <further-classification edition="200601120260302B">C23C16/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>積亞半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROASIA SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>閘極氧化層之製造方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF GATE OXIDE LAYER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種閘極氧化層之製造方法，包含以下步驟：首先，提供一含矽基板。接著，提供一第一氧氣等離子電漿沉積，以形成一第一二氧化矽層覆蓋含矽基板。其次，提供一第二氧氣等離子電漿沉積，以形成一第二二氧化矽層覆蓋第一二氧化矽層。最終，提供具一第三氧氣等離子電漿，轟擊第二二氧化矽層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a gate oxide layer is provided. The manufacturing method comprises the following steps: First, a silicon-containing substrate is provided. Next, a first oxygen plasma deposition is applied to form a first silicon dioxide (SiO₂) layer covering the silicon-containing substrate. Then, a second oxygen plasma deposition is applied to form a second silicon dioxide (SiO₂) layer over the first silicon dioxide layer. Finally, a third oxygen plasma is applied to bombard the second silicon dioxide layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01:步驟</p>
        <p type="p">S02:步驟</p>
        <p type="p">S03:步驟</p>
        <p type="p">S04:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="750px" img-content="tif" inline="yes" orientation="portrait" width="605px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622170</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145281</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241218B">C08L27/06</main-classification>
        <further-classification edition="200601120241218B">B32B27/32</further-classification>
        <further-classification edition="201801120241218B">C08K3/016</further-classification>
        <further-classification edition="200601120241218B">C09K21/14</further-classification>
        <further-classification edition="200601120241218B">C09K21/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN YA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹俊哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, CHUN-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉騏瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, CI-SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>高光澤度耐燃耐衝擊板材及其聚氯乙烯組成物</chinese-title>
        <english-title>HIGH GLOSS FLAME-RETARDANT IMPACT-RESISTANT PLATE AND POLYVINYL CHLORIDE COMPOSITION THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種高光澤度耐燃耐衝擊板材，是由一聚氯乙烯組成物所製成，該聚氯乙烯組成物包含100重量份之一聚氯乙烯原料組分、3至15重量份之至少一無機添加劑、0.1至0.5重量份之至少一成碳劑以及2至5重量份之至少一熱穩定劑。該聚氯乙烯原料組分包含一聚氯乙烯原料及一氯化聚氯乙烯原料，且該聚氯乙烯原料與該氯化聚氯乙烯原料的含量比為5.66:1至1.5:1。因此，該高光澤度耐燃耐衝擊板材具有不小於90GU的60°光澤度，並且在3~5 mm之厚度條件下具有根據FM4910標準之小於6的火焰延燒指數（FPI）和小於0.4的發煙指數（SDI）及大於3 kg-cm/cm的衝擊強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A high gloss flame-retardant impact-resistant plate is made of a polyvinyl chloride composition that includes 100 parts by weight of a polyvinyl chloride raw material component, 3 to 15 part by weight of at least one inorganic additive, 0.1 to 0.5 part by weight of at least one carbon forming agent, and 2 to 5 parts by weight of at least one heat stabilizer. The polyvinyl chloride raw material component includes a polyvinyl chloride raw material and a chlorinated polyvinyl chloride raw material in a content ratio of 5.66:1 to 1.5:1. Therefore, the high gloss flame-retardant impact-resistant plate has a 60-degree gloss of not less than 90GU, and has a fire propagation index (FPI) of less than 6 and a smoke damage index (SDI) of less than 0.4 according to the FM4910 standard and an impact strength of greater than 3 kg•cm/cm under the condition of having a thickness of 3-5 mm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2、S3:製作方法步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="407px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622194</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145283</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">C09D195/00</main-classification>
        <further-classification edition="201801120241230B">C09D7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>誠泰工業科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERNG TAY TECHNOLOGY CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王勝義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHEN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>防水性結合結構</chinese-title>
        <english-title>WATERPROOF BONDING STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種防水性結合結構，其包含一承載座以及至少一個以上的鎖固件，以固定該承載座於一安裝基面，該承載座包含一基板、一防水貼層以及一蓋板，該防水貼層黏附於該基板之表面；該蓋板透過壓合與該鎖固件之嵌合緊密結合該基板、該防水貼層以及該蓋板，其中，該防水貼層包含一膠體以及一纖維複合物，本發明透過該膠體之配方與該纖維複合物材料之合適選用，以達成該防水貼層具備良好之防水性以及釘孔自癒性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A waterproof bonding structure comprises a base seat and at least one fastener to secure the base seat to a mounting surface. The base seat includes a substrate, a waterproof adhesive layer, and a cover plate. The waterproof adhesive layer adheres to the surface of the substrate, and the cover plate is tightly integrated with the substrate, the adhesive layer, and the fastener through compression fitting. The waterproof adhesive layer consists of a gum and a fiber composite. This invention achieves excellent waterproofing and self-healing properties around nail holes through the appropriate selection of gum formulation and fiber composite materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:承載座</p>
        <p type="p">11:基板</p>
        <p type="p">12:防水貼層</p>
        <p type="p">13:蓋板</p>
        <p type="p">20:鎖固件</p>
        <p type="p">21:自攻螺絲</p>
        <p type="p">22:墊片</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="1038px" img-content="tif" inline="yes" orientation="portrait" width="786px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622338</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145288</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">E04B9/06</main-classification>
        <further-classification edition="200601120250108B">E04B9/18</further-classification>
        <further-classification edition="200601120250108B">E04B9/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王家壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIA-SHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王家壽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIA-SHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>隔板吊掛結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種隔板吊掛結構，其係與設置於屋頂的一吊掛件進行連接，以形成天花板，隔板吊掛結構包含一基板、一掛接件及一加強件。基板底部角落處凹設有一第一接合部，基板底部設有一第一底接面；掛接件具有一第二接合部、一連接部以及一第二底接面，第二接合部與第一接合部相互接合，連接部凹設於第二接合部遠離基板之一側，掛接件之材質與基板之材質不相同；加強件水平貼合第一底接面及第二底接面。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:隔板吊掛結構</p>
        <p type="p">10:基板</p>
        <p type="p">11:第一接合部</p>
        <p type="p">111:第一接合段</p>
        <p type="p">112:第一圓弧段</p>
        <p type="p">113:第二接合段</p>
        <p type="p">12:第一底接面</p>
        <p type="p">20:掛接件</p>
        <p type="p">21:第二接合部</p>
        <p type="p">211:第三接合段</p>
        <p type="p">211a:斜切面</p>
        <p type="p">212:第二圓弧段</p>
        <p type="p">213:第四接合段</p>
        <p type="p">22:連接部</p>
        <p type="p">221:連接槽</p>
        <p type="p">23:第二底接面</p>
        <p type="p">30:加強件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="836px" img-content="tif" inline="yes" orientation="portrait" width="676px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623304</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145291</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250204B">H05B45/325</main-classification>
        <further-classification edition="202001120250204B">H05B45/36</further-classification>
        <further-classification edition="202001120250204B">H05B45/48</further-classification>
        <further-classification edition="200601120250204B">G02B6/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITEMAX ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張琮堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TSUNG-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>發光二極體燈條的精確調光電路</chinese-title>
        <english-title>PRECISION DIMMING CIRCUIT FOR LED LIGHT STRIPS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光二極體(light-emitting diode, LED)燈條的精確調光電路，包括：驅動電路，被配置為基於脈衝寬度調變(pulse width modulation, PWM)訊號透過第一輸出端輸出導通訊號，以及透過第二輸出端輸出驅動電流；LED燈條，其第一端電性耦接至驅動電路，以接收驅動電流，其第二端電性耦接至驅動開關，驅動開關還電性耦接至第二輸出端，並由導通訊號驅動而導通，LED燈條被配置為當驅動開關導通時基於驅動電流的大小而產生對應的亮度；判斷單元，具有判斷輸入端、n個輸出端及設定調光比例，判斷單元被配置為當PWM訊號的佔空比例小於等於設定調光比例時，由n個輸出端輸出調光訊號，其中n為大於等於1的正整數；以及n個分流迴路，其一端與LED燈條並聯耦接，其另一端與判斷單元的n個輸出端電性耦接，n個分流迴路被配置為基於調光訊號而導通n個分流迴路中的m個並聯迴路，以降低流過LED燈條的驅動電流的大小，其中m為大於等於1且小於等於n的正整數。藉此，本發明可用於對LED燈條進行精確調光，並解決PWM調光技術的調光比例的範圍不大的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A precise dimming circuit for light-emitting diode (LED) light strips, including:        &lt;br/&gt;a driving circuit is configured to output a conduction signal through a first output end and output a driving current through a second output end based on a PWM signal; an LED light strips has a first end electrically coupled to the driving circuit to receive a driving current, and a second end electrically coupled to a driving switch, the driving switch is also electrically coupled to the second output end, and is driven and turned on by the conduction signal, and the LED light strips is configured to generate corresponding brightness based on the magnitude of the driving current when the driving switch is turned on; a judgment unit has a judgment input end, n output ends and a set dimming ratio. The judgment unit is configured to output a dimming signal through the n output ends when the duty ratio of the PWM signal is less than or equal to the set dimming ratio, where n is a positive integer greater than or equal to 1; and n shunt circuits, one end of which is coupled in parallel with the LED light strips, and the other end of which is electrically coupled with the n output ends of the judgment unit, the n shunt circuits are configured to turn on based on the dimming signal m parallel circuits among the n shunt circuits are used to reduce the magnitude of the driving current flowing through the LED light strips, where m is a positive integer greater than or equal to 1 and less than or equal to n. Thereby, the present invention can be used to accurately dim the LED light strips and solve the problem of a small range of dimming ratios in PWM dimming technology.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:驅動電路</p>
        <p type="p">21:判斷單元</p>
        <p type="p">110:精確調光電路</p>
        <p type="p">ILS:驅動電流</p>
        <p type="p">IN1:驅動輸入端</p>
        <p type="p">IN2:判斷輸入端</p>
        <p type="p">LS:LED燈條</p>
        <p type="p">OT1:第一輸出端</p>
        <p type="p">OT2:第二輸出端</p>
        <p type="p">OS:導通訊號</p>
        <p type="p">R1:分流電阻</p>
        <p type="p">R2:分流電阻</p>
        <p type="p">Rn:分流電阻</p>
        <p type="p">PS:PWM訊號</p>
        <p type="p">Q1:第一開關元件</p>
        <p type="p">Q1’:第二開關元件</p>
        <p type="p">Q2:第一開關元件</p>
        <p type="p">Q2’:第二開關元件</p>
        <p type="p">QD:驅動開關</p>
        <p type="p">Qn:第一開關元件</p>
        <p type="p">Qn’:第二開關元件</p>
        <p type="p">SC1:分流迴路</p>
        <p type="p">SC2:分流迴路</p>
        <p type="p">SCn:分流迴路</p>
        <p type="p">X1:節點</p>
        <p type="p">X2:節點</p>
        <p type="p">Xn:節點</p>
        <p type="p">Y1:輸出端</p>
        <p type="p">Y2:輸出端</p>
        <p type="p">Yn:輸出端</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="608px" img-content="tif" inline="yes" orientation="portrait" width="816px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622727</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145297</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F9/06</main-classification>
        <further-classification edition="200601120250303B">G06F13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台中商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAICHUNG COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粘庭維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEN, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施國敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, KUO-TUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>通訊管理系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR COMMUNICATION MANAGING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊管理系統包含一處理單元及一與該處理單元電連接的儲存單元。該處理單元用於：當接收到一來自於一控制端電子裝置且指示出一受控端電子裝置的指令資料時，根據該受控端電子裝置所對應的一應用程式介面資料，將該指令資料以適用於該受控端電子裝置的通訊協定傳送至該受控端電子裝置；在接收到一來自於該受控端電子裝置的回傳資料時，判斷該回傳資料是否具備數據完整性，在判定為是時，將該回傳資料傳送至該控制端電子裝置，否則，產生並傳送一對應於該指令資料的錯誤通知至該控制端電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication managing system includes a processing unit and a storage unit electrically connected to the processing unit. The processing unit is configured to: when receiving an instruction data from a control end electronic device and indicating a controlled end electronic device, transmit the instruction data to the controlled end electronic device in a communication protocol suitable for the controlled end electronic device; when receiving a return data from the controlled end electronic device, determine whether the return data possesses data integrity; upon the determining result is affirmative, transmit the return data to the control end electronic device; otherwise, generate and transmit an error notification corresponding to the instruction data to the control end electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:通訊管理系統</p>
        <p type="p">11:處理單元</p>
        <p type="p">12:儲存單元</p>
        <p type="p">D:應用程式介面資料</p>
        <p type="p">50:控制端電子裝置</p>
        <p type="p">60:受控端電子裝置</p>
        <p type="p">60’:指定受控端電子裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="585px" img-content="tif" inline="yes" orientation="portrait" width="931px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622959</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145308</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250303B">G10L25/00</main-classification>
        <further-classification edition="200601120250303B">G10K11/175</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬開曼群島商意騰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRITISH CAYMAN ISLANDS INTELLIGO TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>KY</english-country>
              <english-address>KY</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃俊銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧俞安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YU-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉耀鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐禎助</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHEN-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>聲音回授處理系統及方法</chinese-title>
        <english-title>ACOUSTIC FEEDBACK PROCESSING SYSTEM AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種聲音回授處理系統，包含第一信號特徵提取電路、第一編碼電路、聲音回授偵測電路及聲音回授消除電路。第一信號特徵提取電路經組態以從第一聲音信號提取信號特徵。第一編碼電路耦接第一信號特徵提取電路，經組態以分別接收第一聲音信號、信號特徵及會議識別碼並據以產生經編碼聲音信號。聲音回授偵測電路耦接第一編碼電路，經組態以分別接收經編碼聲音信號及第二聲音信號並據以判斷是否有聲音回授現象存在。聲音回授消除電路耦接聲音回授偵測電路，經組態以透過類神經網路在有聲音回授現象存在的情況下進行聲音回授消除程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An acoustic feedback processing system including a first signal feature extraction circuit, a first encoding circuit, an acoustic feedback detection circuit and an acoustic feedback elimination circuit is disclosed. The first signal feature extraction circuit is configured to extract a signal feature from a first sound signal. The first encoding circuit is coupled to the first signal feature extraction circuit and configured to receive the first sound signal, the signal feature and a conference identification code and generate an encoded sound signal accordingly. The acoustic feedback detection circuit is coupled to the first encoding circuit and configured to receive the encoded sound signal and a second sound signal respectively and determine whether sound feedback phenomenon exists. The acoustic feedback elimination circuit is coupled to the acoustic feedback detection circuit and configured to perform a sound feedback elimination process through a neural network in the case of sound feedback phenomenon.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:聲音回授處理系統</p>
        <p type="p">10:第一信號特徵提取電路</p>
        <p type="p">12:第一編碼電路</p>
        <p type="p">14:聲音回授偵測電路</p>
        <p type="p">16:聲音回授消除電路</p>
        <p type="p">NB1:第一資訊處理裝置</p>
        <p type="p">RU1:第一接收單元</p>
        <p type="p">OU1:第一輸出單元</p>
        <p type="p">AO:第一聲音信號</p>
        <p type="p">AI:第二聲音信號</p>
        <p type="p">SF:信號特徵</p>
        <p type="p">CID:會議識別碼</p>
        <p type="p">AO’:經編碼聲音信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="435px" img-content="tif" inline="yes" orientation="portrait" width="821px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623482</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145314</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250123B">H10H29/49</main-classification>
        <further-classification edition="202501120250123B">H10H29/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昱嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUAN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開了一種電子裝置，其包括基板、多個電晶體、第一透鏡單元以及第二透鏡單元。所述多個電晶體設置在基板上，且每一個電晶體具有通道。第一透鏡單元及第二透鏡單元設置在基板上。所述多個電晶體中與第一透鏡單元重疊的通道數量不同於所述多個電晶體中與第二透鏡單元重疊的通道數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure reveals an electronic device having a substrate, a plurality of transistors, a first lens unit, and a second lens unit. The plurality of transistors are arranged on the substrate, and each transistor has a channel. The first lens unit and the second lens unit are arranged on the substrate. The number of channels of the plurality of transistors that overlap with the first lens unit is different from the number of channels of the plurality of transistors that overlap with the second lens unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:電子裝置</p>
        <p type="p">110:基板</p>
        <p type="p">112:主動區</p>
        <p type="p">114:周邊區</p>
        <p type="p">116:導線</p>
        <p type="p">118:驅動電路</p>
        <p type="p">120:絕緣層</p>
        <p type="p">126:導線</p>
        <p type="p">128:定義層</p>
        <p type="p">130:絕緣層</p>
        <p type="p">132:透鏡定義層</p>
        <p type="p">140:絕緣層</p>
        <p type="p">150R、150G、150B:濾光片</p>
        <p type="p">D:汲極</p>
        <p type="p">G:閘極</p>
        <p type="p">H12、H22:高度</p>
        <p type="p">H11、H21、W1、W2:間距</p>
        <p type="p">L:通道</p>
        <p type="p">L1、L2:透鏡單元</p>
        <p type="p">M1、M2:導電層</p>
        <p type="p">Q:電晶體</p>
        <p type="p">R1、R2:曲率半徑</p>
        <p type="p">S:源極</p>
        <p type="p">X、Y、Z:方向</p>
        <p type="p">θ1、θ2:接觸角</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="681px" img-content="tif" inline="yes" orientation="portrait" width="935px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622701</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145321</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F3/01</main-classification>
        <further-classification edition="201101120250303B">G06T19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅聖儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, SHENG-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, SHIN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIA-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉旭航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HSU-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>應用於元宇宙應用程式的虛實融合系統及其方法</chinese-title>
        <english-title>VIRTUAL-PHYSICAL INTEGRATION SYSTEM AND METHOD THEREOF APPLIED FOR METAVERSE APP</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用於元宇宙應用程式的虛實融合系統及其方法，方法包括感測並獲取現實物件的現實資訊；接收並儲存現實資訊，紀錄現實資訊的資料類型且將現實資訊統一資料格式，並且紀錄現實物件的錨點資訊；從場景資料庫下載虛擬場景資訊；接收現實資訊以及虛擬場景資訊，並且根據虛擬場景資訊將現實物件的地理位置轉換成虛擬場景中對應的座標點；以及根據虛擬化身靠近現實物件在虛擬場景的座標點時，將現實物件的現實資訊與虛擬場景進行融合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A virtual-physical integration system and method thereof applied for metaverse app is provided, the method includes sensing and obtaining real information of real object, receiving and storing actual information, recording data type of the actual information and unifying the actual information into a data format, and recording anchor point information of the real object, downloading virtual scene information from a scene database, receiving real information and virtual scene information, and converting geographical location of real object into corresponding coordinate point in the virtual scene according to the virtual scene information, and when the virtual avatar approaches the coordinate point of the real object in the virtual scene, the real information of the real object and the virtual scene are integrated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:感測器</p>
        <p type="p">102:場景資料庫</p>
        <p type="p">103:物件資訊擷取暨虛擬化模組</p>
        <p type="p">104:場景加載模組</p>
        <p type="p">105:物件資訊同步模組</p>
        <p type="p">106:場景資訊整合模組</p>
        <p type="p">20:虛擬化身</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="652px" img-content="tif" inline="yes" orientation="portrait" width="819px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622934</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145322</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250731B">G09G3/20</main-classification>
        <further-classification edition="200601120250731B">G09G5/10</further-classification>
        <further-classification edition="200601120250731B">H03M1/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奕力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILI TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁嘉碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHIA-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示驅動裝置</chinese-title>
        <english-title>DISPLAY DRIVING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示驅動裝置。伽瑪電壓補償電路受控於伽瑪電路提供至少一補償電壓給源極驅動電路中的各數位類比轉換器，以補償對應目標補償灰階的伽瑪電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display driving device is provided. A gamma voltage compensation circuit is controlled by a gamma circuit to provide at least one compensation voltage to each digital analog converter in a source driver circuit to compensate a gamma voltage corresponding to a target compensation gray level.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示驅動裝置</p>
        <p type="p">102:伽瑪電路</p>
        <p type="p">104:源極驅動電路</p>
        <p type="p">106:源極驅動電路</p>
        <p type="p">108:第一伽瑪電壓補償電路</p>
        <p type="p">110:第二伽瑪電壓補償電路</p>
        <p type="p">D1~D1200:第一數位類比轉換器</p>
        <p type="p">D1201~D2400:第二數位類比轉換器</p>
        <p type="p">O1~O2400:運算放大器</p>
        <p type="p">m、n:信號傳輸線的數量</p>
        <p type="p">S1~S2400:驅動源極線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="636px" img-content="tif" inline="yes" orientation="portrait" width="1030px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622915</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145323</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">G06V40/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊耀欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇奕宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂坤憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范庭維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>影像管理方法、伺服器及影像擷取裝置</chinese-title>
        <english-title>IMAGE MANAGEMENT METHOD, SERVER AND IMAGE CAPTURE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供一種影像管理方法、伺服器及影像擷取裝置。該方法對時序性的多個第一影像中尚未檢驗的多個第二影像執行影像檢驗操作，包括：識別目標物件並判斷其方向；根據該方向判斷目標物件各部位的完整度；據此產生完整性編碼。最後選擇具有最大完整性編碼的影像作為目標影像輸出。藉此方法可有效篩選出最適合進行人物重識別的影像，提升整體系統效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides an image management method, server and image capture device. The method performs image inspection operations on uninspected second images among multiple first images arranged in chronological order. The operations include: identifying target objects and determining their orientations; evaluating the completeness of various parts of the target objects based on their orientations; and generating corresponding completeness codes. Finally, the image with the highest completeness code is selected as the target image for output. This method effectively filters out the most suitable images for person re-identification, thereby enhancing overall system performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S610、S611、S612、S613、S620:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.png" file="d10019.TIF" giffile="ed10019.png" height="691px" img-content="tif" inline="yes" orientation="portrait" width="738px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622519</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145324</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250204B">G01R27/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李坤鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許昀傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YUN CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電容器檢測電路</chinese-title>
        <english-title>CAPACITOR DETECTION CIRCUIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電容器檢測電路。電容器檢測電路位於電源供應器中，用以檢測電源供應器中的電容器。電容器檢測電路包括帶寬濾波器電路、緩衝及峰值檢測電路以及比較器電路。帶寬濾波器電路接收電容器的一節點電壓，以提供一濾波電壓。緩衝及峰值檢測電路接收濾波電壓，以提供一峰值電壓。比較器電路接收峰值電壓，以基於峰值電壓及參考電壓的比較結果提供電容器故障訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capacitor detection circuit is provided. The capacitor detection circuit is located in a power supply unit and is used to detect a capacitor in the power supply unit. The capacitor detection circuit includes a bandwidth filter circuit, a buffer and peak detection circuit, and a comparator circuit. The bandwidth filter circuit receives a node voltage of the capacitor to provide a filtered voltage. The buffer and peak detection circuit receives the filtered voltage to provide a peak voltage. The comparator circuit receives the peak voltage and provides a capacitor fault signal based on the comparison result of the peak voltage and a reference voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電容器檢測電路</p>
        <p type="p">110:帶寬濾波器電路</p>
        <p type="p">120:緩衝及峰值檢測電路</p>
        <p type="p">130:比較器電路</p>
        <p type="p">AMP1:第一差動放大器</p>
        <p type="p">AMP2:第二差動放大器</p>
        <p type="p">C1:第一電容器</p>
        <p type="p">C2:第二電容器</p>
        <p type="p">C3:第三電容器</p>
        <p type="p">Cbulk:本體電容器</p>
        <p type="p">D1:第一二極體</p>
        <p type="p">E-cap:電容器</p>
        <p type="p">R1:第一電阻器</p>
        <p type="p">R2:第二電阻器</p>
        <p type="p">R3:第三電阻器</p>
        <p type="p">R4:第四電阻器</p>
        <p type="p">R5:第五電阻器</p>
        <p type="p">R6、R6a:第六電阻器</p>
        <p type="p">R7、R7a:第七電阻器</p>
        <p type="p">R8:第八電阻器</p>
        <p type="p">Vbus:節點電壓</p>
        <p type="p">Vcc:供電電壓</p>
        <p type="p">Vfault:電容器故障訊號</p>
        <p type="p">Vflt:濾波電壓</p>
        <p type="p">Vpc:峰值電壓</p>
        <p type="p">Vref1:參考電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="728px" img-content="tif" inline="yes" orientation="portrait" width="968px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622662</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145325</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">G05B23/02</main-classification>
        <further-classification edition="200601120250401B">G05B19/406</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創智先進科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRANZX ADVANCED TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡國志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, KUO CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡國志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, KUO CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智能動態監控系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種智能動態監控系統，其中，智能動態監控系統包含感測器、計算單元、比對分析單元、智能預測單元與資料庫，智能預測單元根據資料庫所儲存的參數，推演或預測機台或機台的各軸於感測時或未來的狀態。當智能預測單元收到比對分析結果後，即可依據前述之推演或預測，對比對分析結果產生即時結果或未來預測，而讓使用者可以得知機台或各軸之某一時段的即時狀態或未來狀態，藉此達到動態檢測或預測機台或各軸的狀態。再者，本發明亦揭露一種智能動態監控方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:智能動態監控系統</p>
        <p type="p">10:感測器</p>
        <p type="p">11:過濾器</p>
        <p type="p">12:計算單元</p>
        <p type="p">13:比對分析單元</p>
        <p type="p">14:智能預測單元</p>
        <p type="p">15:資料庫</p>
        <p type="p">16:提醒單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="701px" img-content="tif" inline="yes" orientation="portrait" width="590px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622005</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145326</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C02F7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱德仕實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINDAX MECHANICAL CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂庭佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>曝氣管及其裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種曝氣管，該曝氣管包含主管與出水管。其中，主管具有主出水口、初混合段、主進水口與進氣口；出水管耦接主管具有主出水口的一端，出水管具有出水口與進水口。本發明亦提供一種曝氣裝置。本發明之曝氣管及其裝置利用多段式混合段與混合加速段的設計，以讓水的流速持續提升，並讓水壓持續降低，藉此更多的空氣與水混合，以待後續釋出空氣時能夠提升水中的含氧量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:出水管</p>
        <p type="p">100:出水口</p>
        <p type="p">102:再次進水口</p>
        <p type="p">104:螺孔</p>
        <p type="p">11:主管</p>
        <p type="p">113:進氣口</p>
        <p type="p">114:卡槽</p>
        <p type="p">115:螺孔</p>
        <p type="p">12:進水管</p>
        <p type="p">122:入口</p>
        <p type="p">123:卡槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="533px" img-content="tif" inline="yes" orientation="portrait" width="941px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623303</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145328</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250731B">H05B45/18</main-classification>
        <further-classification edition="200601120250731B">G09G5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立碁電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGITEK ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳義文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>發光裝置以及用於發光裝置的操作方法</chinese-title>
        <english-title>LIGHT-EMITTING DEVICE AND OPERATING METHOD FOR LIGHT-EMITTING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種發光裝置以及用於發光裝置的操作方法。發光裝置包括發光二極體以及控制電路。控制電路在第一期間控制發光二極體提供輸出光，並且在第二期間提供偵測訊號至發光二極體以接收發光二極體的感測電壓值。第一期間以及第二期間彼此交替且不重疊。控制電路依據感測電壓值獲得發光二極體的接面溫度，並依據接面溫度來補償輸出光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting device and an operating method for the light-emitting device are provided. The light-emitting device includes a light-emitting diode (LED) and a control circuit. The control circuit controls the LED to provide an output light during a first period, and provides a detection signal to the LED to receive a sensing voltage value of the LED during a second period. The first period and the second period alternate and do not overlap with each other. The control circuit obtains a junction temperature of the LED according to the sensed voltage value, and compensates the output light according to the junction temperature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光裝置</p>
        <p type="p">110_1、110_2、110_3:發光二極體</p>
        <p type="p">120:控制電路</p>
        <p type="p">L1、L2、L3:輸出光</p>
        <p type="p">SC:控制訊號</p>
        <p type="p">SDE:偵測訊號</p>
        <p type="p">SDR1、SDR2、SDR3:驅動訊號</p>
        <p type="p">TJ1、TJ2、TJ3:接面溫度</p>
        <p type="p">VD1、VD2、VD3:感測電壓值</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="750px" img-content="tif" inline="yes" orientation="portrait" width="596px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621947</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145330</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120241230B">B64U20/87</main-classification>
        <further-classification edition="202401120241230B">G05D1/46</further-classification>
        <further-classification edition="202301320241230B">B64U101/31</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳劭寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHAO HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳駿偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WENSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無人機巡檢系統與自動巡檢方法</chinese-title>
        <english-title>DRONE INSPECTION SYSTEM AND AUTOMATIC INSPECTION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種無人機巡檢系統，包含伺服器與無人機。伺服器通過操作介面接收巡檢任務，其包含巡檢路線。無人機包含影像擷取模組。伺服器用以執行排程以設定無人機執行巡檢任務。影像擷取模組用以持續取得多張環境影像，無人機根據環境影像辨識無人機的位置以行進在巡檢路線上。當無人機行進在巡檢路線上時，無人機將環境影像傳送至伺服器，伺服器用以根據環境影像判斷是否發生異常現象以產生對應於巡檢任務的巡檢結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a drone inspection system that includes a server and a drone. The server receives an inspection task through an operating interface. The inspection task includes an inspection route. The drone is equipped with an image capture module. The server executes scheduling to configure the drone for carrying out the inspection task. The image capture module continuously captures multiple environmental images, and the drone identifies its position based on these images to move along the inspection route. As the drone proceeds along the inspection route, it transmits the environmental images to the server. The server then determines whether an abnormal condition has occurred based on the environmental images and generates an inspection result corresponding to the inspection task.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:伺服器</p>
        <p type="p">120:資料庫</p>
        <p type="p">131,132:無人機</p>
        <p type="p">131_C:影像擷取模組</p>
        <p type="p">141:無人機前端操作介面</p>
        <p type="p">142:無人機任務排程管理系統</p>
        <p type="p">143:無人機服務系統</p>
        <p type="p">144:人工智慧巡檢管理系統</p>
        <p type="p">145:無人機設備管理系統</p>
        <p type="p">146:無人機事件通知管理系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="664px" img-content="tif" inline="yes" orientation="portrait" width="934px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621914</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145349</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120241226B">B60L50/64</main-classification>
        <further-classification edition="200601120241226B">B62J1/12</further-classification>
        <further-classification edition="200601120241226B">B62J35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃英甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭裕棋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周哲民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>機車的後懸機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種機車的後懸機構，機車至少包括有車架單元，該車架單元具有頭管，由該頭管朝車體後方延設的主車架，該主車架朝車體後方連接有左右一對的連接板架；該車架單元於該連接板架的前方設有動力單元；該車架單元上方設有座墊與位於該座墊前方的燃油箱及設於該座墊下方的置物箱；該連接板架樞設有後搖臂；該後搖臂與該動力單元之間設有後避震器；該後避震器下端連接有連桿單元；該後避震器上方設有電池，該電池係位於該燃油箱與該置物箱之間；由俯視觀視，該電池與該後避震器至少有一部分重疊；藉此可使六連桿形式後懸機構的該後避震器與該電池呈現上下方式的設置，藉此避免影響到該置物箱容置空間設置；從俯視觀視，該電池與該後避震器至少部分重疊，可使該機車整體重量集中化且係向車體中心配置。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:機車</p>
        <p type="p">2:車架單元</p>
        <p type="p">251:上側車架</p>
        <p type="p">2512:延伸段</p>
        <p type="p">253:腳踏管部</p>
        <p type="p">26:連接板架</p>
        <p type="p">27:後車架</p>
        <p type="p">271:上升段</p>
        <p type="p">272:延設段</p>
        <p type="p">28:後搖臂</p>
        <p type="p">29:連桿單元</p>
        <p type="p">291:上橫桿</p>
        <p type="p">292:下橫桿</p>
        <p type="p">293:連結架</p>
        <p type="p">294:第一連桿</p>
        <p type="p">2941:第一連桿樞接部</p>
        <p type="p">295:第二連桿</p>
        <p type="p">296:鎖設架</p>
        <p type="p">297:駐車腳架樞接座</p>
        <p type="p">2971:樞接部</p>
        <p type="p">3:動力單元</p>
        <p type="p">32:傳動部</p>
        <p type="p">321:帶動件</p>
        <p type="p">6:後避震器</p>
        <p type="p">61:上樞接部</p>
        <p type="p">62:下樞接部</p>
        <p type="p">7:電池安裝座</p>
        <p type="p">8:電池</p>
        <p type="p">9:主腳架</p>
        <p type="p">B:置物箱</p>
        <p type="p">Ba:避讓部</p>
        <p type="p">B1:維修部</p>
        <p type="p">M:排氣裝置</p>
        <p type="p">T:燃油箱</p>
        <p type="p">RW:後輪</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="680px" img-content="tif" inline="yes" orientation="portrait" width="893px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623106</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145351</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120241227B">H01R12/77</main-classification>
        <further-classification edition="201101120241227B">H01R12/79</further-classification>
        <further-classification edition="200601120241227B">H01R13/627</further-classification>
        <further-classification edition="200601120241227B">H01R13/639</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾昌興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>P-TWO INDUSTRIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林賢昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於扁平連接對象物的易鎖連接器</chinese-title>
        <english-title>EASY-LOCK CONNECTOR FOR A FLAT CONNECTION OBJECT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於扁平連接對象物的易鎖連接器，包括絕緣殼體、由該絕緣殼體保持的複數個接觸件、二個鎖定構件及外殼。外殼具備外殼本體、二個彈性臂部及操作部。該二個彈性臂部自該外殼本體的後緣延伸，該操作部連接該二個彈性臂部末端，該操作部係與每一個鎖定構件的被致動部操作地連接。鎖定構件係配置用於鎖定插入易鎖連接器的扁平連接對象物。該操作部係被操作來使鎖定構件的鎖定臂偏置離開鎖定位置，以釋放對扁平對象物的鎖定。藉助於上述的構造，改善易鎖連接器的操作性且實現低輪廓的易鎖連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An easy-lock connector for a flat connection object which comprises an insulating housing, a plurality of contacts held by the insulating housing, two locking members and a shell is provided. The shell comprises a shell body, two elastic arm portions and an operated portion. The two elastic arm portions extend from a rear edge of the shell body, and ends of the two elastic arm portion are connected by the operated portion. The operated portion is operatively connected with an actuated portion of each locking member. The locking members are arranged to lock the flat connection object inserted into the easy-lock connector. The operated portion is operated to bias locking arms of the locking members away from the lock position so as to release the lock to the flat connection object. By means of the configuration mentioned above, the operability of the easy-lock connector is improved, and a low-profile easy-lock connector is realized.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:易鎖連接器</p>
        <p type="p">11:絕緣殼體</p>
        <p type="p">110:嵌合開口</p>
        <p type="p">12:外殼</p>
        <p type="p">13:鎖定構件</p>
        <p type="p">14:第一接觸件</p>
        <p type="p">15:第二接觸件</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.png" file="d10022.TIF" giffile="ed10022.png" height="735px" img-content="tif" inline="yes" orientation="portrait" width="981px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621561</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145352</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250203B">A01K67/36</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昆億生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNYI BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱炳烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, PING LIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳淑敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHU MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林治青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃靖鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JING JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉言鋐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YEN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾子軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, TZU HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王傳勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>全自動黑水虻飼養設備</chinese-title>
        <english-title>AUTOMATIC BLACK SOLDIER FLY FARMING EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種全自動黑水虻飼養設備，包含一基座，係設有至少一飼養槽，該基座的底部設有一開口，該飼養槽的底部具有一圓心；一攪拌單元包含有一固定架、一動力源、一第一攪拌葉片及一第二攪拌葉片，該動力源設有一軸桿垂向伸入於該飼養槽內，該軸桿的端部垂直設有一橫桿，該橫桿以該圓心區分成為一第一桿段及一第二桿段，該第一攪拌葉片設於該第一桿段上，該第二攪拌葉片設於該第二桿段上；一閘門單元封閉或開啟該開口；一輸送單元設有一輸送帶，通過該開口的下方處；一控制單元控制該攪拌單元、該閘門單元及該輸送單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:攪拌單元</p>
        <p type="p">22:動力源</p>
        <p type="p">221:軸桿</p>
        <p type="p">222:橫桿</p>
        <p type="p">222A:第一桿段</p>
        <p type="p">222B:第二桿段</p>
        <p type="p">23:第一攪拌葉片</p>
        <p type="p">231:第一接桿</p>
        <p type="p">24:第二攪拌葉片</p>
        <p type="p">241:第二接桿</p>
        <p type="p">25:第一輔助撥件</p>
        <p type="p">26:第二輔助撥件</p>
        <p type="p">261:第三接桿</p>
        <p type="p">27:第三輔助撥件</p>
        <p type="p">271:第四接桿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="821px" img-content="tif" inline="yes" orientation="portrait" width="1048px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622449</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145353</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F41H3/00</main-classification>
        <further-classification edition="200601120241230B">B64D45/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和成欣業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOCHENG CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANG HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宣辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSUAN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鞠志遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHU FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉命權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MING CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游本堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, PEN CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴昭旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, ZHAO XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡仁偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, REN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZONG YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡大鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, DA CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>曲面雙層擇頻結構之成型方法</chinese-title>
        <english-title>A FORMING METHOD FOR A CURVED DOUBLE-LAYER FREQUENCY-SELECTIVE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作之曲面雙層擇頻結構及係具有弧形之一彎曲板件，彎曲板件主要包括一第一擇頻層以及依序向下堆疊並結合之一第一基板、一中間介質層、一第二基板以及一第二擇頻層；而其成型方法係將第一擇頻層結合於第一基板上，同時計算出第二擇頻層之複數個第二圖案單元之間距，將複數個第二圖案單元結合在第二基板上；之後再堆疊並定位第一基板、具樹脂之中間介質層及第二基板，讓複數個第一圖案單元之一第一基準列對齊複數個第二圖案單元之一第二基準列，並讓第一、第二基準列位於一模具內之一中間高點處，再經由加壓、硬化樹脂及裁切為一成品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The curved double-layer frequency-selective structure of this invention includes a curved plate with an arc shape. The curved plate includes a first frequency-selective layer, a first substrate, an intermediate dielectric layer, and a second substrate, and a second frequency selective layer that are stacked and combined downward in sequence. The forming method is to combine the first frequency selective layer on the first substrate, and simultaneously calculate the distance between a plurality of second pattern units of the second frequency selective layer, and the plurality of second pattern units are combined on the second substrate, and then the first substrate, the intermediate dielectric layer with resin and the second substrate are stacked and positioned, such that first reference rows of a plurality of first pattern units are aligned with second reference rows of the plurality of second pattern units, and the first and second reference rows are positioned at a middle high point in a mold, and then are pressed, processed by hardened resin and cut into a finished product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:曲面雙層擇頻結構</p>
        <p type="p">10:彎曲板件</p>
        <p type="p">2:第一擇頻層</p>
        <p type="p">21:第一圖案單元</p>
        <p type="p">22:第一反射單元</p>
        <p type="p">221:第一方形片</p>
        <p type="p">222:第一方形框</p>
        <p type="p">23:第一孔徑單元</p>
        <p type="p">231:第一方形孔</p>
        <p type="p">3:第一基板</p>
        <p type="p">4:中間介質層</p>
        <p type="p">5:第二基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="612px" img-content="tif" inline="yes" orientation="portrait" width="790px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622472</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145355</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260302B">G01J5/48</main-classification>
        <further-classification edition="202201120260302B">G01J5/061</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張世忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張世忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種使用影像感應陣列元件處理氣密空間內板狀被加熱物溫度偵測的方法與裝置</chinese-title>
        <english-title>A METHOD AND DEVICE FOR PROBING TEMPERATURE OF PLATE-SHAPED HEATED OBJECT(S) IN AIRTIGHT SPACE USING IMAGE SENSING ARRAY ELEMENT(S)</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及工業設備溫度偵測並可藉以溫度控制用於諸如半導體快速熱製程處理腔室等需對氣密反應腔內板狀被加熱物，如晶圓與/或基板與/或襯底之溫度調變均勻性控制的方法和裝置 ，使用耦合到具有廣域視角的影像感應陣列元件來監測基板溫度並藉此應用於相關的溫度調控。廣域視角的影像感應陣列元件被密封元件與固定夾具固定於製程處理腔室壁上的開口處直接形成氣密並可完整通過光熱輻射訊號使能全域偵測氣密腔體內被加熱之板狀物的表面溫度所熱輻射出的全波長域之熱能，再經廣域視角的影像感應陣列元件轉換成電子訊號進行近乎完美的非接觸式廣域：被探測物幾何全域光熱輻射波譜全波長域地映射至影像感應陣列元件之表面的非接觸式測溫與繼之配合軟與/或韌與/或硬體架構而成的溫控元件所組成之溫度控制系統。其中，影像感應陣列元件之幾何陣列可以數學概念與/或方法映射到氣密空間內板狀被加熱物之各平面區塊陣列與/或光熱輻射源陣列，作為多域多個輸出多個輸入溫控系統的數學矩陣計算之基礎，以實現襯底的實時即時之均勻溫度調控 。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method for temperature probing and then be followed by control application on industrial equipments, such as a semiconductor rapid thermal process processing chamber, which requires uniformity of temperature modulation of a plate-shaped heated object, such as a wafer and/or a substrate e, in an airtight chamber and the device uses image sensing array(s) elements coupled to a wide viewing angle to monitor the substrate temperature and is applicablly related to temperature regulation. The wide viewing angle image sensing array element is fixed to the opening on the wall of the process chamber by the sealing element and the fixing fixture to directly form an airtight seal and can completely detect the heated plate in the airtight chamber through photothermal radiation signals. The thermal energy in the full wavelength range radiated by the surface temperature of the object is then converted into electronic signals by the image sensing array element with a wide viewing angle to produce a near-perfect non-contact wide-area: full-area photothermal radiation spectrum of the object being detected, accordingly. The non-contact temperature measurement mapped to the surface of the image sensing array element in the full wavelength range and the temperature control element combined with the software and/or firmware and/or hardware architecture(s) can thus form a temperature control system. Among them, the geometric array of image sensing array elements can be mapped with mathematical concepts and/or methods to the planar block array of the plate-shaped heated object and/or the photothermal radiation source array, as a multi-domain, multiple output, and multiple input temperature closed-loop controller. The basis of the mathematical matrix calculation of the temperature control system so as to achieve instant and uniform temperature control of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">00:氣密反應腔</p>
        <p type="p">01:光熱輻射源</p>
        <p type="p">02:光熱輻射源固定座</p>
        <p type="p">03:光熱輻射透射窗夾具</p>
        <p type="p">04:反應腔主體</p>
        <p type="p">05:基片</p>
        <p type="p">06:高光熱輻射反射率元件</p>
        <p type="p">07:光熱輻射透射窗</p>
        <p type="p">08:全域第一光熱輻射感應錐體空間</p>
        <p type="p">09:全域第二光熱輻射感應錐體空間</p>
        <p type="p">10:主光熱輻射影像感應陣列</p>
        <p type="p">11:次光熱輻射影像感應陣列</p>
        <p type="p">12:光熱輻射影像感應陣列邊框</p>
        <p type="p">13:光熱輻射影像感應陣列電源與/或訊號導線</p>
        <p type="p">14:光熱輻射影像感應陣列固定基座</p>
        <p type="p">15:光熱輻射影像感應陣列固定基座之源與/或訊號導線</p>
        <p type="p">16:光熱輻射源之光熱輻射主體</p>
        <p type="p">17:光熱輻射源之光熱輻射主體的固定基座</p>
        <p type="p">18:光熱輻射源電源線</p>
        <p type="p">19:反應與/或清潔與/或惰性與/或稀釋與/或吹掃氣體之入口通道</p>
        <p type="p">20:反應與/或清潔與/或惰性與/或稀釋與/或吹掃氣體之出口通道</p>
        <p type="p">21:清潔與/或惰性與/或稀釋與/或吹掃氣體之入口通道</p>
        <p type="p">22:清潔與/或惰性與/或稀釋與/或吹掃氣體之出口通道</p>
        <p type="p">23:全域光熱輻射感應錐體空間邊界面</p>
        <p type="p">24:全域光熱輻射影像感應陣列映射於基片表面法線方向中心線</p>
        <p type="p">25:固定光熱輻射透射窗夾具於光熱輻射源固定座之緊固元件</p>
        <p type="p">26:固定光熱輻射透射窗夾具於反應腔主體之緊固元件</p>
        <p type="p">27:固定高光熱輻射反射率元件於反應腔主體之緊固元件</p>
        <p type="p">28:固定光熱輻射影像感應陣列固定基座於高光熱輻射反射率元件之緊固元件</p>
        <p type="p">29:介於光熱輻射影像感應陣列固定基座與高光熱輻射反射率元件之密封元件</p>
        <p type="p">30:介於清潔與/或惰性與/或稀釋與/或吹掃氣體之入口通道與清潔與/或惰性與/或稀釋與/或吹掃氣體之出口通道間流場</p>
        <p type="p">31:介於反應與/或清潔與/或惰性與/或稀釋與/或吹掃氣體之入口通道與反應與/或清潔與/或惰性與/或稀釋與/或吹掃氣體之出口通道間流場</p>
        <p type="p">32:介於高光熱輻射反射率元件與反應腔主體之密封元件</p>
        <p type="p">33:介於光熱輻射透射窗與光熱輻射透射窗夾具之密封元件</p>
        <p type="p">34:可拆卸與/或替換之全域針孔成像元件</p>
        <p type="p">36:可拆卸替換之分域針孔成像元件</p>
        <p type="p">37:分域光熱輻射感應錐體空間邊界面</p>
        <p type="p">38:分域光熱輻射影像感應陣列映射於基片表面法線方向中心線</p>
        <p type="p">39:介於光熱輻射透射窗夾具與反應腔主體之密封元件</p>
        <p type="p">40:全域陣列式光熱輻射影像感應裝置</p>
        <p type="p">41:分域陣列式光熱輻射影像感應裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="785px" img-content="tif" inline="yes" orientation="portrait" width="653px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622897</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145359</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250303B">G06T19/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦創科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHING CHUANG TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖鉦達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>裝潢圖片生成系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝潢圖片生成系統，用以訊號連接一電子裝置，該裝潢圖片生成系統包含一通訊模組與一圖片生成模組，其中，該通訊模組訊號連接該電子裝置，該通訊模組自該電子裝置接收一原始圖片以及一提示資料；該圖片生成模組訊號連接該通訊模組，且該通訊模組將該原始圖片及該提示資料傳送給該圖片生成模組；該圖片生成模組具有一圖片生成模型，該圖片生成模型基於該原始圖片及該提示資料生成至少一裝潢圖片，且該圖片生成模組將該至少一裝潢圖片傳送至該通訊模組；其中，該通訊模組將該至少一裝潢圖片傳送給該電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:裝潢圖片生成系統</p>
        <p type="p">10:通訊模組</p>
        <p type="p">102:標記單元</p>
        <p type="p">20:圖片生成模組</p>
        <p type="p">202:圖片生成模型</p>
        <p type="p">204:評價單元</p>
        <p type="p">30:資料庫</p>
        <p type="p">40:電子裝置</p>
        <p type="p">402:螢幕</p>
        <p type="p">404:攝影模組</p>
        <p type="p">50:網際網路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="835px" img-content="tif" inline="yes" orientation="portrait" width="602px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623345</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145360</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250205B">H05K9/00</main-classification>
        <further-classification edition="200601120250205B">H05K5/02</further-classification>
        <further-classification edition="200601120250205B">H05K7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>精英電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELITEGROUP COMPUTER SYSTEMS CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭宇軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YU HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHIEN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴宏宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, HUNG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李龍進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置及夾持結構</chinese-title>
        <english-title>ELECTRONIC DEVICE AND CLAMPING STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包含一殼體、一雜訊源、一屏蔽罩以及至少一夾持結構。雜訊源設置於殼體。屏蔽罩設置於殼體，並將雜訊源罩設於內。至少一夾持結構包含一基座以及二夾持件。基座設置於殼體。二夾持件可轉動地設置於基座。每一夾持件包含一夾持部。透過二夾持件之至少一者相對基座轉動，以令二夾持部相對靠近而共同夾持屏蔽罩或相對遠離而釋放屏蔽罩。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a casing, a noise source, a shielding cover and at least one clamping structure. The noise source is disposed on the casing. The shielding cover is disposed on the casing, and covers the noise source. The at least one clamping structure includes a base and two clamping members. The base is disposed on the casing. The two clamping members are rotatably disposed on the base. Each of the two clamping members includes a clamping portion. The two clamping portions are relatively close to each other to together clamp the shielding cover or are relatively far apart to release the shielding cover through at least one of the two clamping members rotating relative to the base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">20:殼體</p>
        <p type="p">40:屏蔽罩</p>
        <p type="p">50:夾持結構</p>
        <p type="p">51:基座</p>
        <p type="p">52:夾持件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="610px" img-content="tif" inline="yes" orientation="portrait" width="927px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621609</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145361</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A47C7/02</main-classification>
        <further-classification edition="200601120241231B">A47C7/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樹德科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU-TE UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧圓華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YUAN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>以冗餘料件製成的坐臥裝置及製作工法</chinese-title>
        <english-title>SITTING AND LYING DEVICE MADE OF REDUNDANT MATERIALS AND MANUFACTURING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以冗餘料件製成的坐臥裝置，包含一層板單元、一立柱單元，及一底座連接單元，該層板單元包括複數彼此層疊在一起並相互錯開的板體，每一板體上形成有至少一穿孔，該立柱單元包括複數分別貫穿該層板單元的支撐柱，該底座連接單元包括複數分別自每一支撐柱之一側水平延伸的接桿，該複數接桿彼此肢接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sitting and lying device made of redundant materials includes a plate unit, a column unit, and a base connection unit. The laminate unit includes a plurality of plate bodies that are stacked on each other and staggered from each other. At least one through hole is formed on each plate body. The column unit includes a plurality of support columns that respectively penetrate the floor unit. The base connection unit includes a plurality of connecting rods extending horizontally from one side of each support column. The plurality of connecting rods are limb-connected to each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:層板單元</p>
        <p type="p">31:板體</p>
        <p type="p">32:穿孔</p>
        <p type="p">33:側擋主體</p>
        <p type="p">4:立柱單元</p>
        <p type="p">41:支撐柱</p>
        <p type="p">42:圍繞壁</p>
        <p type="p">43:照明空間</p>
        <p type="p">44:頂端結構</p>
        <p type="p">45:底端結構</p>
        <p type="p">5:底座連接單元</p>
        <p type="p">51:接桿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="1035px" img-content="tif" inline="yes" orientation="portrait" width="676px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622427</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145364</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250314B">F24F7/04</main-classification>
        <further-classification edition="200601120250314B">F24F7/007</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃榮芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, RONG FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>地下室之通風設計方法</chinese-title>
        <english-title>A VENTILATION METHOD FOR A BASEMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種地下室之通風設計方法，其主要包括下列步驟：A.在至少一出氣口之位置上開設至少一天井以連通室內空間，並將室內空間劃分為至少一區塊；B.決定至少一區塊之初步進氣量與初步總進氣量；C.進行電腦模擬以計算出至少一天井之出氣量，並將至少一出氣口之出氣量設為至少一天井之出氣量；以及D.封閉至少一天井，再重新進行電腦模擬以調整至少一出氣口之出氣量及至少一第一進氣口之進氣量；藉此，即可以在至少一出氣口出氣，而至少一第一進氣口進氣時，讓地下室內之空氣流動順暢，以排出廢氣並降低室內之溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a ventilation method for a basement, which includes following steps. A step A: provide at least one impluvium at the position of at least one air outlet to in communication with an indoor space, and divide the indoor space into at least one zone; a step B: determine the inlet volume and the preliminary total inlet volume of the at least one zone; a step C: carry out computer simulation to calculate the air outlet volume of the at least one impluvium, and set the air outlet volume of the at least one air outlet to the air outlet volume of the at least one impluvium; and a step D: close at least one impluvium, and re-carry out computer simulation to adjust the air outlet volume of the at least one air outlet and the air inlet volume of at least one first air inlet; thereby, when air is discharged from the at least one air outlet and air is taken in from the at least one first air inlet, the air in the basement can flow smoothly to discharge exhaust gas and the indoor temperature is reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:地下停車場</p>
        <p type="p">11:室內空間</p>
        <p type="p">12:第一區塊</p>
        <p type="p">13:第二區塊</p>
        <p type="p">2:第一側牆</p>
        <p type="p">21:出氣口</p>
        <p type="p">3:第二側牆</p>
        <p type="p">4:第三側牆</p>
        <p type="p">41:第一進氣口</p>
        <p type="p">5:第四側牆</p>
        <p type="p">6:隔間牆</p>
        <p type="p">61:通道</p>
        <p type="p">62:第二進氣口</p>
        <p type="p">7:車道出入口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="688px" img-content="tif" inline="yes" orientation="portrait" width="974px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623647</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145365</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10W42/00</main-classification>
        <further-classification edition="202601120260303B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汎星半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANSTAR SEMICONDUCTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, I-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有指狀結構金屬繞線佈局的半導體元件</chinese-title>
        <english-title>SEMICONDUCTOR COMPONENT WITH FINGER-STRUCTURED METAL ROUTING LAYOUT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種具有指狀結構金屬繞線佈局的半導體元件，其包含半導體基板、第一墊及第二墊。半導體基板包含具有不同極性的第一區域及第二區域。第一墊設置於第一區域上。第一墊包含多層金屬而具有多層高度。第二墊設置於第二區域上。第二墊包含單層金屬而具有單層高度。多層高度大於單層高度，致使第一墊相對於第二墊的多層金屬側面積大於第二墊相對於第一墊的單層金屬側面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor component with a finger-structured metal routing layout, including a semiconductor substrate, a first pad and a second pad, is disclosed. The semiconductor substrate includes a first region and a second region with different polarities. The first pad is disposed on the first region. The first pad includes multi-layer of metal and has a height of multi-layer. The second pad is disposed on the second region. The second pad includes a single-layer of metal and has a height of single-layer. The height of multi-layer is larger than the height of single-layer, so that a side area of multi-layer metal of ​​the first pad relative to the second pad is larger than a side area of single-layer metal of ​​the second pad relative to the first pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:半導體元件</p>
        <p type="p">NS:半導體基板</p>
        <p type="p">P+:第一區域</p>
        <p type="p">IP2:第一墊</p>
        <p type="p">CT:接觸層</p>
        <p type="p">PM1:第一墊的第一金屬層</p>
        <p type="p">VIA:通孔層</p>
        <p type="p">PM2:第一墊的第二金屬層</p>
        <p type="p">N+:第二區域</p>
        <p type="p">GP2:第二墊</p>
        <p type="p">NM1L:第二墊的第一金屬層</p>
        <p type="p">H1:接觸層的高度</p>
        <p type="p">H2:第一金屬層的高度</p>
        <p type="p">H3:通孔層的高度</p>
        <p type="p">H4:第二金屬層的高度</p>
        <p type="p">C2:寄生電容</p>
        <p type="p">AC:接觸層的側面積</p>
        <p type="p">A1:第一金屬層的側面積</p>
        <p type="p">AV:通孔層的側面積</p>
        <p type="p">A2:第二金屬層的側面積</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="697px" img-content="tif" inline="yes" orientation="portrait" width="1002px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622353</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145373</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241223B">E06B9/68</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岳新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUEH SHIN HIGH-TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧佩暄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, PEI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧欣宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, HSIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>捲門控制系統</chinese-title>
        <english-title>ROLLING DOOR CONTROL SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種捲門控制系統，用以驅動一馬達傳動組帶動一捲門作動，並藉由感測該馬達傳動組的轉動角度，以判斷該捲門的捲收高度，該控制系統包含一感側模組、一傳輸驅動電路及一控制模組，該控制模組用以驅動該馬達傳動組，該感側模組用以感測該馬達傳動組，並藉由該感側模組的一第一控制器形成一角度電位訊號，該傳輸驅動電路的一第一電壓轉換單元、一第二電壓轉換單元及一比較單元用以接收及傳送該角度電位訊號至該控制模組的一第二控制器，藉由該傳輸驅動電路可避免傳送該角度電位訊號時受到干擾，而造成該第二控制器誤斷該捲門的捲收高度或未收到該角度電位訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rolling door control system can actuate a motor drive set to move a rolling door and sense rotation angle of the motor drive set to know the rolling door height. The control system includes a control module, a sensing module and a driving circuit. The control module is provided to drive the motor drive set, the sensing module is provided to sense the motor drive set and its first controller is provided to generate an angle potential signal. A first voltage converter, a second voltage converter and a comparator of the drive circuit are provided to receive and transmit the angle potential signal to a second controller of the control module. The driving circuit can avoid interference during transmission of the angle potential signal so it can avoid the second controller from misjudging the rolling door height or failed transmission of the angle potential signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:捲門控制系統</p>
        <p type="p">110:感側模組</p>
        <p type="p">111:定位感測器</p>
        <p type="p">112:第一控制器</p>
        <p type="p">120:傳輸驅動電路</p>
        <p type="p">130:控制模組</p>
        <p type="p">131:馬達驅動單元</p>
        <p type="p">132:第二控制器</p>
        <p type="p">140:第二傳輸驅動電路</p>
        <p type="p">200:馬達傳動組</p>
        <p type="p">S1:第一識別訊號</p>
        <p type="p">S2:第二識別訊號</p>
        <p type="p">V1:轉動訊號</p>
        <p type="p">V11:第一角度電位訊號</p>
        <p type="p">V21:第一請求電位訊號</p>
        <p type="p">V14:轉動角度訊號</p>
        <p type="p">V24:請求訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="661px" img-content="tif" inline="yes" orientation="portrait" width="904px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623317</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145374</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250205B">H05K1/02</main-classification>
        <further-classification edition="200601120250205B">H05K3/00</further-classification>
        <further-classification edition="200601120250205B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商慶鼎精密電子（淮安）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QINGDING PRECISION ELECTRONICS (HUAI'AN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐菀翎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WAN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電路板組件及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD ASSEMBLY AND FABRICATING METHOD OF THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種電路板組件及其製造方法。電路板組件包含柔性線路板、多個電子元件、線路板和多個散熱片。柔性線路板包含第一線路層和介電層。介電層具有空腔。第一線路層覆蓋空腔。多個電子元件設置在柔性線路板內，且電性連接第一線路層。線路板與柔性線路板堆疊，且包含第二線路層，並具有開口。開口顯露局部的柔性線路板。多個電子元件位於第二線路層和柔性線路板之間。線路板位於多個散熱片和多個電子元件之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board assembly and a fabricating method of the same are provided. The circuit board assembly includes a flexible circuit board, multiple electronic devices, a circuit board, and multiple heat dissipating films. The flexible circuit board includes a first wiring layer and a dielectric layer. The dielectric layer has a cavity. The first wiring layer covers the cavity. The electronic devices are disposed in the flexible circuit board and are connected to the first wiring layer. The circuit board is stacked on the flexible circuit board, and includes a second wiring layer, and has an opening. The opening exposes portions of the flexible circuit board. The electronic devices are located between the second wiring layer and the flexible circuit board. The circuit board is located between the heat dissipating films and the electronic devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板組件</p>
        <p type="p">110:柔性線路板</p>
        <p type="p">111~113,141:線路層</p>
        <p type="p">111a:傳輸部</p>
        <p type="p">114,115:介電層</p>
        <p type="p">116,117:覆蓋層</p>
        <p type="p">118:空腔</p>
        <p type="p">121,122:電子元件</p>
        <p type="p">130:導電結構</p>
        <p type="p">140,150:線路板</p>
        <p type="p">141a:導熱部</p>
        <p type="p">141b:走線</p>
        <p type="p">142,151:黏合層</p>
        <p type="p">143,152:開口</p>
        <p type="p">161,162:散熱片</p>
        <p type="p">170:導熱結構</p>
        <p type="p">181,182:防焊層</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="564px" img-content="tif" inline="yes" orientation="portrait" width="962px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622609</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145375</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250925B">G02F1/133</main-classification>
        <further-classification edition="201901120250925B">G02F1/19</further-classification>
        <further-classification edition="200601120250925B">G09F9/35</further-classification>
        <further-classification edition="202301120250925B">H10K77/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳湲琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昱嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUAN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁庭瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, TING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIUNN-SHYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊秋蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIU-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可拉伸電子裝置</chinese-title>
        <english-title>STRETCHABLE ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可拉伸電子裝置，包括一第一反射式面板。第一反射式面板包括一第一基板、一第二基板、一第一液晶層、一第一框膠以及一第一材料層。第一基板具有至少一第一開口。第二基板相對於第一基板。第一液晶層設置在第一基板與第二基板之間。第一框膠設置在第一基板與第二基板之間且鄰近於第一液晶層。第一材料層設置在至少一第一開口中，其中第一材料層的材料不同於第一基板的材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stretchable electronic device includes a first reflective panel. The first reflective panel includes a first substrate, a second substrate, a first liquid crystal layer, a first sealant and a first material layer. The first substrate has at least one first opening. The second substrate is opposite to the first substrate. The first liquid crystal layer is disposed between the first substrate and the second substrate. The first sealant is disposed between the first substrate and the second substrate and adjacent to the first liquid crystal layer. The first material layer is disposed in the at least one first opening, wherein a material of the first material layer is different from a material of the first substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">BP:接合墊</p>
        <p type="p">BR:橋狀部分</p>
        <p type="p">ED:可拉伸電子裝置</p>
        <p type="p">FE:軟性電子元件</p>
        <p type="p">FG1:第一框膠</p>
        <p type="p">IS:島狀部分</p>
        <p type="p">MT1:第一材料層</p>
        <p type="p">OE:外部電子元件</p>
        <p type="p">OP1:第一開口</p>
        <p type="p">P1,P2:部分</p>
        <p type="p">PXR:畫素區</p>
        <p type="p">RG:區域</p>
        <p type="p">RP1:第一反射式面板</p>
        <p type="p">SB1:第一基板</p>
        <p type="p">Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="937px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622341</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145380</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250205B">E04C2/30</main-classification>
        <further-classification edition="200601120250205B">E04F15/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英宏德企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於供水泥砂漿或混凝土充填之抗裂結構及其樓地板層</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於供水泥砂漿或混凝土充填之抗裂結構及其樓地板層，抗裂結構為層板體並由上至下形成於三維空間不規則排列之複數鏤空孔，由上至下之鏤空孔投影於平面後呈相互交疊狀；其中將通過層板體外表面各自定義為六個虛擬封閉面，並於虛擬封閉面包覆之立體區域內因鏤空孔所形成之總體鏤空區域的體積占比大於50%。樓地板層包含前述抗裂結構與隔音結構，且隔音結構設置於抗裂結構一側。據此，水泥砂漿或混凝土係可通過抗裂結構並固化於上，進行達到增強水泥砂漿或混凝土結構強度之功效，同時亦可使隔音結構順利與水泥砂漿或混凝土結合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:抗裂結構</p>
        <p type="p">10:層板體</p>
        <p type="p">101:鏤空孔</p>
        <p type="p">A:虛擬封閉面</p>
        <p type="p">B:立體區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="899px" img-content="tif" inline="yes" orientation="portrait" width="578px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622911</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145383</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">G06V20/52</main-classification>
        <further-classification edition="202301120250303B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳世光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHIH KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智能商品追蹤系統</chinese-title>
        <english-title>INTELLIGENT GOODS TRACKING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種智能商品追蹤系統，包含攝影裝置和處理終端，攝影裝置安裝於貨架周圍，透過拍攝模組拍攝即時動態影像並傳送至處理終端；處理終端運用深度學習技術針對即時動態影像進行物體檢測和影像分割，提取即時動態影像中的貨架、商品及購物籃特徵，並運用多邊形框選技術，標記感應區域框及商品外框，並於商品外框內標記中心點；當商品被移動時，處理終端記錄其中心點連續移動的移動軌跡；若商品外框與感應區域框重疊且移動軌跡達到購買距離，則產生購買訊號；藉此能夠自動追蹤商品並偵測購買行為，有效提升商場管理效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an intelligent goods tracking system comprising an imaging device and a processing terminal. The imaging device is installed around shelves and captures real-time dynamic images via a shooting module, transmitting the images to the processing terminal. The processing terminal applies deep learning techniques for object detection and image segmentation on the real-time dynamic images to extract features of shelves, goods, and shopping baskets. Using polygonal framing technology, the system marks sensing area frames and product bounding boxes, as well as marks a central point within each product bounding box. When a product is moved, the processing terminal records the movement trajectory of its central point. If the product bounding box overlaps with the sensing area frame and the movement trajectory reaches a purchase distance, a purchase signal is generated. This system enables automatic tracking of goods and detection of purchasing behavior, thereby effectively improving mall management efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:社群通訊平台</p>
        <p type="p">100:智能商品追蹤系統</p>
        <p type="p">10:攝影裝置</p>
        <p type="p">11:拍攝模組</p>
        <p type="p">12:傳輸模組</p>
        <p type="p">20:處理終端</p>
        <p type="p">21:資料庫</p>
        <p type="p">22:通訊模組</p>
        <p type="p">23:運算模組</p>
        <p type="p">24:紀錄模組</p>
        <p type="p">25:顯示模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="888px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621981</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145388</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250205B">B82Y40/00</main-classification>
        <further-classification edition="201101120250205B">B82Y20/00</further-classification>
        <further-classification edition="200601120250205B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃敞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱冠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, GUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃星瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳銘安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>超穎透鏡奈米柱的排列方法</chinese-title>
        <english-title>ARRANGEMENT METHOD OF NANO-PILLARS OF META-LENS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開的實施方式提供一種超穎透鏡奈米柱的排列方法，包括將第一奈米柱陣列劃分成多個亞單元組成的亞單元矩陣、從亞單元矩陣獲得製程超規定位矩陣以定位第一奈米柱陣列中的製程超規亞單元、從亞單元矩陣獲得平均相位矩陣、使用製程超規定位矩陣和平均相位矩陣建立替換亞單元資料庫，以及使用替換亞單元資料庫選擇性替換第一奈米柱陣列中的製程超規亞單元以獲得第二奈米柱陣列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an arrangement method of nano-pillars of a meta-lens, which includes dividing a first nano-pillar array into a sub-unit array composed of sub-units, obtaining an over spec positioning matrix from the sub-unit array to position an over spec sub-unit in the first nano-pillar array, obtaining an average phase matrix from the sub-unit array, establishing a substitution sub-unit database by the over spec positioning matrix and the average phase matrix, and selectively substituting the over spec sub-unit in the first nano-pillar array by using the substitution sub-unit database to obtain a second nano-pillar array.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110,120,130,140:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="694px" img-content="tif" inline="yes" orientation="portrait" width="947px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623036</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145393</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260303B">H01J37/317</main-classification>
        <further-classification edition="200601120260303B">H01J37/08</further-classification>
        <further-classification edition="202601120260303B">H10P30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢辰科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED ION BEAM TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴煜騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YU-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡居諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>離子佈植機</chinese-title>
        <english-title>ION IMPLANTER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種離子佈植機包含離子源、線性多極模組、離子束形調節模組以及分析儀磁鐵單元。線性多極模組設置於離子源與基板之間。離子束形調節模組設置於離子源與線性多極模組之間。分析儀磁鐵單元設置於離子源與線性多極模組之間，離子束形調節模組設置於分析儀磁鐵單元之入口前方，線性多極模組設置於分析儀磁鐵單元之出口後方。離子束形調節模組可用以調節離子束以改變離子束進入基板之離子束發散角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ion implanter comprises ion source, linear multipole module, ion beam shape adjustment module, and analyzer magnetic unit. The linear multipole module is positioned between the ion source and a substrate. The ion beam shape adjustment module is positioned between the ion source and the linear multipole module. The analyzer magnetic unit is positioned between the ion source and the linear multipole module, the ion beam shape adjustment module is positioned in front of an entrance of the analyzer magnetic unit, and the linear multipole module is positioned behind an exit of the analyzer magnetic unit. The ion beam shape adjustment module is configured to adjust an ion beam to modify the divergence angle of the ion beam as it enters a substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10’:離子佈植機</p>
        <p type="p">11:離子源</p>
        <p type="p">111:弧形狹縫</p>
        <p type="p">12:離子束形調節模組</p>
        <p type="p">13:分析儀磁鐵單元</p>
        <p type="p">131:入口</p>
        <p type="p">132:出口</p>
        <p type="p">14:線性多極模組</p>
        <p type="p">91:基板</p>
        <p type="p">θy:離子束發散角</p>
        <p type="p">I:離子束</p>
        <p type="p">A:基板直徑</p>
        <p type="p">X,Y,Z:座標軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.png" file="d10023.TIF" giffile="ed10023.png" height="452px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622661</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145394</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G05B23/00</main-classification>
        <further-classification edition="202601120260302B">G06T11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許裕鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無人載具監控系統及其方法</chinese-title>
        <english-title>UNMANNED VEHICLE MONITORING SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種無人載具監控系統及其方法。無人載具監控方法係應用在資料處理裝置上，包含：藉由資料處理裝置執行初始化程序以接收運行資料；處理運行資料以保留關鍵部分資料；處理關鍵部份資料以生成複數張圖片；以及合併複數張圖片以生成影片，其中該運行資料是由一無人載具於運作期間產生之資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An unmanned vehicle monitoring system and method thereof are provided. The unmanned vehicle monitoring method is applied to a data processing device and comprises: executing an initialization procedure by the data processing device to receive operational data; processing the operational data to retain key portion data; processing the key portion data to generate multiple images; and merging the multiple images to generate a video, wherein the operational data is generated by an unmanned vehicle during its operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無人載具監控系統</p>
        <p type="p">110:無人載具</p>
        <p type="p">120:資料處理裝置</p>
        <p type="p">122:儲存單元</p>
        <p type="p">131:初始化模組</p>
        <p type="p">132:資料處理模組</p>
        <p type="p">133:圖片生成模組</p>
        <p type="p">134:影片生成模組</p>
        <p type="p">135:圖形使用者介面模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="704px" img-content="tif" inline="yes" orientation="portrait" width="510px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623475</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145395</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10H20/855</main-classification>
        <further-classification edition="202501120250102B">H10H29/10</further-classification>
        <further-classification edition="200601120250102B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳隆京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LUNG-JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子芩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉展睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHAN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包含發光基板、與發光基板相對設置的對向基板及設置於發光基板與對向基板之間的填充層。發光基板包含第一基板、反射圖案層、微型發光二極體及散射件。反射圖案層設置於第一基板上並具有開口，微型發光二極體設置於開口中，散射件填充於開口中並覆蓋微型發光二極體。對向基板包含第二基板、濾光單元、平坦層及微型透鏡。濾光單元設置於第二基板上並對應微型發光二極體，平坦層設置於第二基板與濾光單元之間並具有對應微型發光二極體的凹槽，微型透鏡設置於凹槽中並對應微型發光二極體，微型透鏡的折射率大於平坦層的折射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a light emitting substrate, a counter substrate disposed opposite to the light emitting substrate, and a filling layer disposed between the light emitting substrate and the counter substrate. The light emitting substrate includes a first substrate, a reflective pattern layer, micro light emitting diodes and scattering elements. The reflective pattern layer is disposed on the first substrate and has openings. The micro light emitting diodes are disposed in the openings, respectively. The scattering elements are respectively filled in the openings, and cover the micro light emitting diodes, respectively. The counter substrate includes a second substrate, filter units, a planarization layer and micro lenses. The filter units are disposed on the second substrate and correspond to the micro light emitting diodes, respectively. The planarization layer is disposed between the second substrate and the filter units, and has recesses corresponding to the micro light emitting diodes, respectively. The micro lenses are respectively disposed in the recesses and correspond to the micro light emitting diodes, respectively. The refractive index of the micro lenses is greater than the refractive index of the planarization layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">100:發光基板</p>
        <p type="p">102:第一基板</p>
        <p type="p">104:反射圖案層</p>
        <p type="p">106:微型發光二極體</p>
        <p type="p">106b、106b’:第一微型發光二極體</p>
        <p type="p">106g:第二微型發光二極體</p>
        <p type="p">108:散射件</p>
        <p type="p">200:對向基板</p>
        <p type="p">202:第二基板</p>
        <p type="p">204:濾光單元</p>
        <p type="p">204r:第一濾光單元</p>
        <p type="p">204g:第二濾光單元</p>
        <p type="p">204b:第三濾光單元</p>
        <p type="p">206:平坦層</p>
        <p type="p">208:微型透鏡</p>
        <p type="p">210:遮光件</p>
        <p type="p">300:填充層</p>
        <p type="p">A:區域</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">E1:第一電極</p>
        <p type="p">E2:第二電極</p>
        <p type="p">M:波長轉換材料</p>
        <p type="p">O:開口</p>
        <p type="p">P1:第一接墊</p>
        <p type="p">P2:第二接墊</p>
        <p type="p">R:凹槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="588px" img-content="tif" inline="yes" orientation="portrait" width="861px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622614</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145396</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">G02F1/1335</main-classification>
        <further-classification edition="200601120250123B">G02F1/137</further-classification>
        <further-classification edition="200601120250123B">G09F9/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>裝飾面板以及顯示裝置</chinese-title>
        <english-title>DECORATION PANEL AND DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝飾面板包括第一基板、第一透光導電層、透光結構層、膽固醇液晶層、第二透光導電層、散射層以及第二基板。第一透光導電層設置於第一基板上。透光結構層設置於第一透光導電層上，其中透光結構層包含複數個透光結構。膽固醇液晶層設置於透光結構層上。第二透光導電層設置於膽固醇液晶層上。散射層設置於第二透光導電層上，其中散射層具有複數個有機粒子。第二基板設置於散射層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A decoration panel includes a first substrate, a first transparent conductive layer, a transparent structure layer, a cholesteric liquid crystal layer, a second transparent conductive layer, a scattering layer, and a second substrate. The first transparent conductive layer is disposed on the first substrate. The transparent structure layer is disposed on the first transparent conductive layer, in which the transparent structure layer includes plural transparent structures. The cholesteric liquid crystal layer is disposed on the transparent structure layer. The second transparent conductive layer is disposed on the cholesteric liquid crystal layer. The scattering layer is disposed on the second transparent conductive layer, in which the scattering layer has plural organic particles. The second substrate is disposed on the scattering layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝飾面板</p>
        <p type="p">110、170:基板</p>
        <p type="p">120、150:透光導電層</p>
        <p type="p">130:透光結構層</p>
        <p type="p">132、134:透光結構</p>
        <p type="p">140:膽固醇液晶層</p>
        <p type="p">160:散射層</p>
        <p type="p">170A、170B:表面</p>
        <p type="p">TH1:厚度</p>
        <p type="p">D1:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="518px" img-content="tif" inline="yes" orientation="portrait" width="824px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623184</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145401</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120241218B">H02S50/00</main-classification>
        <further-classification edition="201801120241218B">F24S40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐庭嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, TING-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>太陽光電系統的故障偵測方法及其故障偵測系統</chinese-title>
        <english-title>FAULT DETECTION METHOD FOR SOLAR PHOTOVOLTAIC SYSTEM AND FAULT DETECTION SYSTEM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種太陽光電系統的故障偵測方法，包含獲取具故障評估參數及類別的歷史資料建立歷史特徵值；分別進行二階段建模。第一階段建模包含選定模型超參數並建立第一超參數組合訓練模型；基於性能指標選擇模型超參數的第一對應數值為第一建模參數。第二階段建模包含運用人工智慧演算法生成第二超參數組合；基於適應度值選擇一組第二超參數組合，並優化調整第一建模參數為第二建模參數；依據第二建模參數及人工智慧演算法基於歷史特徵值建立太陽光電故障偵測模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fault detection method for solar photovoltaic systems includes obtaining historical data with fault evaluation parameters and categories to establish historical characteristic values; and performing two-stage modeling respectively. The first stage of modeling includes selecting model hyperparameters and establishing a first hyperparameter combination training model; based on performance indicators, the first corresponding value of the model hyperparameter is selected as the first modeling parameter. The second stage of modeling includes selecting model hyperparameters and establishing a second hyperparameter combination training model. Finally, an artificial intelligence algorithm is used to generate the second hyperparameter combinations; a set of second hyperparameter combinations are selected based on the fitness value. And adjust the first modeling parameter to the second modeling parameter; establish a fault detection model based on the second modeling parameter and the artificial intelligence algorithm based on the historical characteristic values.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:太陽光電故障偵測系統</p>
        <p type="p">110:太陽光電系統</p>
        <p type="p">111:光電模組</p>
        <p type="p">120:程控系統</p>
        <p type="p">C1,C2,Cn:並聯組串</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="701px" img-content="tif" inline="yes" orientation="portrait" width="678px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623129</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145402</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250210B">H01R31/06</main-classification>
        <further-classification edition="200601120250210B">H05K1/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓鈺祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>轉接裝置</chinese-title>
        <english-title>ADAPTER DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種轉接裝置包含轉接板及轉接板固定件。轉接板包含電路基板、第一電連接器及第二電連接器。電路基板包含通孔和相對的第一表面及第二表面，第一電連接器及第二電連接器分別設置在第一表面及第二表面上，第一電連接器配置以與電子元件的電連接器對接。轉接板固定件包含板體以及固定柱。板體覆蓋電路基板的第二表面，並包含暴露出第二電連接器的開口。固定柱設置在板體上，並對齊於電路基板的通孔。固定柱包含螺紋孔，電子元件的螺絲配置以鎖入螺紋孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adapter device includes an adapter board and a fastening device. The adapter board includes a circuit board, a first electrical connector and a second electrical connector. The circuit board includes a thru-hole, a first surface and a second surface opposite to the first surface. The first and second electrical connectors are disposed on the first and second surfaces, respectively. The first electrical connector is configured to mate with an electrical connector of an electronic component. The fastening device includes a plate and a post. The plate covers the second surface of the circuit board and includes an opening that exposes the second electrical connector. The post is disposed on the plate and is aligned with the thru-hole of the circuit board. The post includes a threaded hole meshing with a screw of the electronic component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子元件</p>
        <p type="p">11:元件主體</p>
        <p type="p">12:電連接器</p>
        <p type="p">13:螺絲</p>
        <p type="p">14:彈簧</p>
        <p type="p">151:第一凹槽</p>
        <p type="p">152:第二凹槽</p>
        <p type="p">20:轉接裝置</p>
        <p type="p">31:第一電連接器</p>
        <p type="p">32:第二電連接器</p>
        <p type="p">34:通孔</p>
        <p type="p">37:電路基板</p>
        <p type="p">371:第一表面</p>
        <p type="p">372:第二表面</p>
        <p type="p">51:板體</p>
        <p type="p">52:固定柱</p>
        <p type="p">53:開口</p>
        <p type="p">56:螺紋孔</p>
        <p type="p">57:安裝孔</p>
        <p type="p">H1,H2:厚度</p>
        <p type="p">W1,W2,W3:寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="653px" img-content="tif" inline="yes" orientation="portrait" width="954px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623130</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145403</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250731B">H01R31/06</main-classification>
        <further-classification edition="201101120250731B">H01R12/72</further-classification>
        <further-classification edition="200601120250731B">G01R1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓鈺祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>轉接裝置</chinese-title>
        <english-title>ADAPTER DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種轉接裝置包含轉接板及轉接板固定件。轉接板包含電路基板、第一電連接器及第二電連接器。電路基板通孔和相對的第一表面及第二表面，第一電連接器及第二電連接器分別設置在電路基板的第一表面及第二表面上，第一電連接器配置以與電子元件的電連接器對接。轉接板固定件面對電路基板的通孔設置，並包含螺紋孔，電子元件的螺絲配置以鎖入螺紋孔。轉接板固定件包含頭部及柄部，頭部抵靠於電路基板的第二表面，柄部連接頭部，並延伸進入電路基板的通孔中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adapter device includes an adapter board and a fastening device. The adapter board includes a circuit board, a first electrical connector and a second electrical connector. The circuit board has a thru-hole, a first surface and a second surface opposite to the first surface. The first and second electrical connectors are disposed on the first and second surfaces, respectively. The first electrical connector is configured to mate with an electrical connector of an electronic component. The fastening device is positioned to face the thru-hole of the circuit board and includes a threaded hole. A screw of the electronic component is configured to engage the threaded hole. The fastening device includes a head and a shank. The head abuts the second surface of the circuit board. The shank is connected to the head and extends into the thru-hole of the circuit board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子元件</p>
        <p type="p">11:元件主體</p>
        <p type="p">12:電連接器</p>
        <p type="p">13:螺絲</p>
        <p type="p">14:彈簧</p>
        <p type="p">151:第一凹槽</p>
        <p type="p">152:第二凹槽</p>
        <p type="p">31:第一電連接器</p>
        <p type="p">32:第二電連接器</p>
        <p type="p">34:通孔</p>
        <p type="p">37:電路基板</p>
        <p type="p">371:第一表面</p>
        <p type="p">372:第二表面</p>
        <p type="p">60:轉接板固定件</p>
        <p type="p">61:頭部</p>
        <p type="p">62:柄部</p>
        <p type="p">63:螺紋孔</p>
        <p type="p">H1,H2:厚度</p>
        <p type="p">W1,W2,W3:寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.bmp" file="ed10010.bmp" height="700px" img-content="tif" inline="yes" orientation="portrait" width="995px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623131</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145404</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">H01R31/06</main-classification>
        <further-classification edition="200601120241230B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓鈺祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, YU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>轉接裝置</chinese-title>
        <english-title>ADAPTER DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種轉接裝置包含轉接板及轉接板固定件。轉接板包含電路基板、第一電連接器及第二電連接器。電路基板包含通孔和相對的第一表面及第二表面，第一電連接器及第二電連接器分別設置在電路基板的第一表面及第二表面上，第一電連接器配置以與電子元件的電連接器對接。轉接板固定件包含螺柱及螺帽。螺柱設置在電路基板的通孔中，並包含第一螺紋孔及外螺紋，電子裝置的螺絲配置以鎖入第一螺紋孔。螺帽套設在螺柱上，並抵靠於電路基板的第二表面。螺帽包含第二螺紋孔，第二螺紋孔與螺柱的外螺紋相嚙合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adapter device includes an adapter board and a fastening device. The adapter board includes a circuit board, a first electrical connector and a second electrical connector. The circuit board includes a thru-hole, a first surface and a second surface opposite to the first surface. The first and second electrical connectors are disposed on the first and second surfaces, respectively. The first electrical connector is configured to mate with an electrical connector of an electronic component. The fastening device includes a nut and a threaded post. The threaded post is disposed in the thru-hole of the circuit board and includes a first threaded hole and an external thread. A screw of the electronic component is configured to engage the first threaded hole. The nut is provided around the threaded post and abuts the second surface of the circuit board. The nut includes a second threaded hole meshing with the external thread of the threaded post.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子元件</p>
        <p type="p">11:元件主體</p>
        <p type="p">12:電連接器</p>
        <p type="p">13:螺絲</p>
        <p type="p">14:彈簧</p>
        <p type="p">151:第一凹槽</p>
        <p type="p">152:第二凹槽</p>
        <p type="p">31:第一電連接器</p>
        <p type="p">32:第二電連接器</p>
        <p type="p">34:通孔</p>
        <p type="p">37:電路基板</p>
        <p type="p">371:第一表面</p>
        <p type="p">372:第二表面</p>
        <p type="p">70:轉接板固定件</p>
        <p type="p">71:第一螺紋孔</p>
        <p type="p">72:第二螺紋孔</p>
        <p type="p">73:外螺紋</p>
        <p type="p">76:螺柱</p>
        <p type="p">77:螺帽</p>
        <p type="p">H1,H2:厚度</p>
        <p type="p">L:長度</p>
        <p type="p">W1,W2,W3:寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="696px" img-content="tif" inline="yes" orientation="portrait" width="941px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621752</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145405</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250102B">A61M1/00</main-classification>
        <further-classification edition="200601120250102B">A61J1/05</further-classification>
        <further-classification edition="202301120250102B">A61J1/14</further-classification>
        <further-classification edition="202301120250102B">A61J1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長庚學校財團法人長庚科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG GUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHU CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫鳳鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, FENG MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游景蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHING LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉芃邑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PENG YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣宜倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YI CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李香君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HSIANG CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王明旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭雅竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, YA CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李依蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>引流瓶結構</chinese-title>
        <english-title>DRAINAGE BOTTLE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種引流瓶結構，包含有：一本體，為一透明殼體，內部設置有一容置空間，頂端設置有一開口；一標示單元，其係具有一第一標示部以及一第二標示部，該第一標示部與該第二標示部係標示有不同的單位刻度，並且該第一標示部與該第二標示部係為兩種不同顏色所構成；一蓋體，蓋設於該本體之開口上，該蓋體上並設置有一負壓口以及一引流口；一襯底部，其係設置於該容置空間內，並具有一與該標示單元不同之顏色。透過該標示單元的不同顏色的顯示，讓使用者可以有效率地進行判斷內部液量，提升效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a drainage bottle structure, which includes: a body, which is a transparent shell with an accommodation space provided inside and an opening at the top; a marking unit having a first marking part and a second marking unit; The first marking part and the second marking part are marked with different unit scales, and the first marking part and the second marking part are composed of two different colors; a cover, covering the opening of the body and the cover are provided with a negative pressure port and a drainage port; a lining bottom is provided in the accommodation space and has a color different from that of the marking unit. Through the display of different colors of the marking unit, users can efficiently judge the internal liquid volume and improve efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體</p>
        <p type="p">11:容置空間</p>
        <p type="p">12:開口</p>
        <p type="p">13:基礎標示線</p>
        <p type="p">20:標示單元</p>
        <p type="p">21:第一標示部</p>
        <p type="p">22:第二標示部</p>
        <p type="p">23:第三標示部</p>
        <p type="p">30:蓋體</p>
        <p type="p">31:負壓口</p>
        <p type="p">32:引流口</p>
        <p type="p">40:襯底部</p>
        <p type="p">50:圖示單元</p>
        <p type="p">51:血液顏色比對表</p>
        <p type="p">52:狀態指示表</p>
        <p type="p">60:瓶架</p>
        <p type="p">61:環形套部</p>
        <p type="p">62:C型夾</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="843px" img-content="tif" inline="yes" orientation="portrait" width="773px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622471</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145406</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G01J5/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖律普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, LU-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹承達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, CHENG TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭丁豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, TING-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>熱感測電路</chinese-title>
        <english-title>HEAT SENSOR CIRCUIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種熱感測電路包含感測像素、參考像素、感測單元及電壓產生單元。感測像素與參考像素耦接在感測單元的第一輸入端點。電壓產生單元包含多個開關電路以及與開關電路耦接的分壓電路。分壓電路更耦接在第一供應電壓與第二供應電壓之間。開關電路中的第一開關電路根據第一供應電壓輸出第一電壓至感測像素，開關電路中的第二開關電路根據第一供應電壓輸出第二電壓至參考像素，以及開關電路中的第三開關電路根據第一供應電壓輸出第三電壓至感測單元的一第二輸入端點。感測單元更根據感測像素與參考像素之間電流差產生輸出電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat sensor circuit includes a sensing pixel, a reference pixel, a sensing unit, and a voltage generation unit. The sensing pixel and the reference pixel are coupled to a first input terminal of the sensing unit. The voltage generation unit includes multiple switch circuits and a voltage divider circuit coupled to the switch circuits. The voltage divider circuit is further coupled between a first supply voltage and a second supply voltage. A first switch circuit in the switch circuits outputs a first voltage to the sensing pixel based on the first supply voltage, a second switch circuit in the switch circuits outputs a second voltage to the reference pixel based on the first supply voltage, and a third switch circuit in the switch circuits outputs a third voltage to a second input terminal of the sensing unit based on the first supply voltage. The sensing unit further generates an output voltage based on the current difference between sensing pixel and reference pixel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">140_1:電壓產生單元</p>
        <p type="p">141:分壓電路</p>
        <p type="p">1431:感測單元(RSU)</p>
        <p type="p">146:電源供應電路</p>
        <p type="p">BF1~BF3:緩衝電路</p>
        <p type="p">C11~C13:控制訊號</p>
        <p type="p">C21~C23:控制訊號</p>
        <p type="p">C31~C33:控制訊號</p>
        <p type="p">CF:電容器</p>
        <p type="p">OP:放大器</p>
        <p type="p">PX1-1:感測像素</p>
        <p type="p">R1~R4:電阻器</p>
        <p type="p">RPX1:參考像素</p>
        <p type="p">S11~S13:開關</p>
        <p type="p">S21~S23:開關</p>
        <p type="p">S31~S33:開關</p>
        <p type="p">SW1~SW3:開關電路</p>
        <p type="p">V1~V3:電壓</p>
        <p type="p">Vo:輸出電壓</p>
        <p type="p">VDD:供應電壓</p>
        <p type="p">VSS:供應電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="731px" img-content="tif" inline="yes" orientation="portrait" width="1049px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622989</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145407</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120241219B">G16H20/10</main-classification>
        <further-classification edition="201801120241219B">G16H10/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樹德科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU-TE UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程達隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, DA-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>應用於眼部用藥之管理系統及其設備</chinese-title>
        <english-title>A SYSTEM AND A DEVICE FOR THE MANAGEMENT OF OPHTHALMIC MEDICATION.</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種應用於眼部用藥之管理系統及其設備，其係以偵測模組偵測放置眼部用藥之存放裝置，以確認存放裝置之使用狀態，以此，透過應用於眼部用藥之管理系統中的判斷單元判斷裝有眼部用藥之存放裝置的使用狀態，並以其管理單元根據使用狀態進行判別並決定輸出對應的提示，提升用藥體驗，確保用藥的準確性和安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a system and a device for the management of ophthalmic medication. The device includes a detection module for monitoring a storage device containing ophthalmic medication to determine usage status thereof. The system features a determination unit for assessing the usage status of the storage device. Furthermore, a management unit evaluates the usage status and determines the appropriate prompts to output, thereby enhancing the medication experience and ensuring accuracy and safety in medication use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:判斷單元</p>
        <p type="p">2:管理單元</p>
        <p type="p">3:提示單元</p>
        <p type="p">4:設定介面</p>
        <p type="p">5:電子裝置</p>
        <p type="p">6:雲端伺服器</p>
        <p type="p">S:應用於眼部用藥之管理系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="751px" img-content="tif" inline="yes" orientation="portrait" width="457px">
          </img>
        </representative>
      </representative-img>
    </description>
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        <document-id>
          <doc-number>202621560</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>113145408</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250205B">A01K13/00</main-classification>
        <further-classification edition="200601120250205B">A01K1/00</further-classification>
        <further-classification edition="200601120250205B">A61L2/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樹德科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU-TE UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林群超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHYUN-CHAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉芷彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHIH-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>寵物清潔艙</chinese-title>
        <english-title>PET CLEANING CABIN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種寵物清潔艙，其包括：箱狀結構，其具有可分離式之蓋體，與該蓋體相鄰之第一側面、第二側面、第三側面及第四側面，其中，第一側面具有第一開口；第二側面具有第二開口，第四側面具有第三開口；第一側面、第二側面、第三側面及第四側面共同界定一容置空間；跑步系統，與第一側面以第一連接件連接；及除菌單元，設置於容置空間靠近該跑帶之一側。本發明之有益功效在於結合了跑步機清潔腳掌、室內消毒和穿鞋凳功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pet cleaning cabin comprising: a box structure with a detachable cover, a first side, a second side, a third side and a fourth side adjacent to the detachable cover, wherein the first side contains a first opening; the second side contains a second opening, and the fourth side contains a third opening; the first side, the second side, the third side and the fourth side jointly define an accommodation space; a running system connected to the first side via a first connecting piece; and a sterilization unit disposed on a side of the accommodation space neighboring to the running system. The beneficial effect of this utility model features of combining the functions of a treadmill for cleaning soles of feet, indoor disinfection and shoe-wearing stools.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一側面</p>
        <p type="p">11:第一開口</p>
        <p type="p">12:第二開口</p>
        <p type="p">14:第三開口</p>
        <p type="p">2:第二側面</p>
        <p type="p">3:第三側面</p>
        <p type="p">4:第四側面</p>
        <p type="p">5:蓋體</p>
        <p type="p">6:跑步系統</p>
        <p type="p">63:跑帶</p>
        <p type="p">7:第一連接件</p>
        <p type="p">9:除菌單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="975px" img-content="tif" inline="yes" orientation="portrait" width="762px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622906</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145410</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">G06V10/82</main-classification>
        <further-classification edition="202301120250303B">G06F18/214</further-classification>
        <further-classification edition="202301120250303B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉治能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石明于</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, MING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>資料擴增方法及其系統</chinese-title>
        <english-title>DATA AUGMENTATION METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資料擴增方法，包含：取得由第一場域拍攝之第一場域影像及由第二場域拍攝之第二場域影像，其中第一場域影像之數量大於第二場域影像；分別自第一場域影像及第二場域影像裁切出第一物件影像及第二物件影像；以第一物件影像及第二物件影像訓練物件生成模型；以物件生成模型生成複數個新物件影像；將複數個新物件影像合成至第二場域影像為新物件場域影像；以及以第二場域影像及新物件場域影像訓練物件鑑別模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data augmentation method includes: obtaining a first field image taken from a first field and a second field image taken from a second field, and a number of the first field image is greater than the second field image; cropping a first object image and a second object image respectively from the first field image and the second field image; training an object generation model using the first object image and the second object image; generating new object images using the object generation model; combining the new object images into the second field image to become a new object field image; and training an object discrimination model using the second field image and the new object field image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資料擴增系統</p>
        <p type="p">110:第一影像處理伺服器</p>
        <p type="p">111:影像裁切模組</p>
        <p type="p">112:物件定位模組</p>
        <p type="p">120:資料擴增伺服器</p>
        <p type="p">121:物件分群模組</p>
        <p type="p">122:物件生成模組</p>
        <p type="p">130:第二影像處理伺服器</p>
        <p type="p">131:影像合成模組</p>
        <p type="p">132:風格轉換模組</p>
        <p type="p">140:物件鑑別伺服器</p>
        <p type="p">150:影像資料庫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="607px" img-content="tif" inline="yes" orientation="portrait" width="981px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622445</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145411</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F28F3/06</main-classification>
        <further-classification edition="200601120241230B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧威華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, WEI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郎明忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANG, MING-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可改變流道之散熱構造</chinese-title>
        <english-title>HEAT DISSIPATION STRUCTURE WITH VARIABLE FLOW CHANNEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可改變流道之散熱構造，包含一底座、一組合式導流模組及一蓋板，該組合式導流模組設置於該底座的一容置空間中，該蓋板覆蓋該容置空間及該組合式導流模組，該組合式導流模組包含複數個第一轉接柱及複數個隔板，該些隔板活動地結合於相鄰的二該第一轉接柱，藉由選擇性地將該些隔板結合於相鄰的二該第一轉接柱，以構成可改變流體流向的至少一流道，使該流道可應用於不同的散熱區域及散熱需求，以增加散熱效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation structure with variable flow channel includes a base, a modular flow guiding module and a lid. The modular flow guiding module is placed in an accommodation space of the base, the lid covers the accommodation space and the modular flow guiding module. The modular flow guiding module includes columns and partitions movably mounted on two adjacent columns. Each of the partitions can be selectively mounted on any two adjacent columns to build at least one flow channel for changing flowing direction, so the variable flow channel can be used for different areas and requirements to improve heat dissipation efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:散熱構造</p>
        <p type="p">100a:流體入口</p>
        <p type="p">100b:流體出口</p>
        <p type="p">110:底座</p>
        <p type="p">111:底板</p>
        <p type="p">111a:第一定位孔</p>
        <p type="p">111b:第一定位槽</p>
        <p type="p">112:邊框</p>
        <p type="p">112a:凹槽</p>
        <p type="p">113:容置空間</p>
        <p type="p">120:組合式導流模組</p>
        <p type="p">121:第一轉接柱</p>
        <p type="p">122:隔板</p>
        <p type="p">123:第二轉接柱</p>
        <p type="p">130:蓋板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="1041px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622582</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145412</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250212B">G02B11/32</main-classification>
        <further-classification edition="202101120250212B">G02B7/02</further-classification>
        <further-classification edition="200601120250212B">G02B3/00</further-classification>
        <further-classification edition="202101120250212B">G03B17/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紘立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETERGE OPTO-ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯家儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, CHIA YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡柏年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PO NIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祖孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TSU-MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>光學攝像透鏡組、成像裝置及電子裝置</chinese-title>
        <english-title>OPTICAL IMAGING LENS, IMAGING DEVICE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像鏡頭，從物側至像側沿光軸依序包括第一透鏡、第二透鏡、第三透鏡、光圈、第四透鏡、第五透鏡及第六透鏡；該光學成像透鏡組，由物側至像側依序包含一第一透鏡，具有負屈折力，其物側面為凸面，其像側面為凹面；一第二透鏡，具有負屈折力，其像側面為凹面；一第三透鏡，具有正屈折力，其像側面為凸面；一光圈；一第四透鏡，具有正屈折力，其物側面為凸面，其像側面為凸面；一第五透鏡，具有負屈折力，其物側面為凹面，其像側面為凸面；一第六透鏡，具有屈折力，其物側面為凸面，其像側面為凹面；其中，該光學成像透鏡組之透鏡總數為六片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging lens including a first lens element, a second lens element, a third lens element, an aperture, a fourth lens element, a fifth lens element, and a sixth lens element arranged in sequence from an object side to an image side along an optical axis is provided. The optical imaging lenses include, from an object side to an image side, the first lens having negative refractive power and including an object-side surface being convex and an image-side surface being concave, the second lens having negative refractive power and including an image-side surface being concave, the third lens having positive refractive power and including an image-side surface being convex, the aperture, the forth lens having positive refractive power and including an object-side surface being convex and an image-side surface being convex, the fifth lens having negative refractive power and including an object-side surface being concave and an image-side surface being convex, and the sixth lens having refractive power and including an object-side surface being convex and an image-side surface being concave. The optical imaging lenses include a total of six elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光學成像透鏡組</p>
        <p type="p">11:第一透鏡</p>
        <p type="p">12:第二透鏡</p>
        <p type="p">13:第三透鏡</p>
        <p type="p">14:第四透鏡</p>
        <p type="p">15:第五透鏡</p>
        <p type="p">16:第六透鏡</p>
        <p type="p">17:濾光元件</p>
        <p type="p">18:保護玻璃</p>
        <p type="p">101:成像面</p>
        <p type="p">11a:第一透鏡之物側面</p>
        <p type="p">11b:第一透鏡之像側面</p>
        <p type="p">12a:第二透鏡之物側面</p>
        <p type="p">12b:第二透鏡之像側面</p>
        <p type="p">13a:第三透鏡之物側面</p>
        <p type="p">13b:第三透鏡之像側面</p>
        <p type="p">14a:第四透鏡之物側面</p>
        <p type="p">14b:第四透鏡之像側面</p>
        <p type="p">15a:第五透鏡之物側面</p>
        <p type="p">15b:第五透鏡之像側面</p>
        <p type="p">16a:第六透鏡之物側面</p>
        <p type="p">16b:第六透鏡之像側面</p>
        <p type="p">17a、17b:濾光元件之二表面</p>
        <p type="p">18a、18b:保護玻璃之二表面</p>
        <p type="p">102:影像感測元件</p>
        <p type="p">I:光軸</p>
        <p type="p">ST:光圈</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="702px" img-content="tif" inline="yes" orientation="portrait" width="901px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622681</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145413</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250205B">G05D23/19</main-classification>
        <further-classification edition="200601120250205B">G05D23/27</further-classification>
        <further-classification edition="200601120250205B">B23K1/005</further-classification>
        <further-classification edition="202201120250205B">G01J5/48</further-classification>
        <further-classification edition="202101120250205B">G01K13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧威華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, WEI-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郎明忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANG, MING-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>紅外線回焊裝置之溫度控制系統</chinese-title>
        <english-title>TEMPERATURE CONTROL SYSTEM FOR IR REFLOW DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種紅外線回焊裝置之溫度控制系統，藉由一熱影像擷取裝置、一環境溫度偵測器、一運算裝置、一比例積分微分控制器、一電力控制器及一氣體降溫裝置控制一紅外線加熱器的一加熱溫度及一工作艙的一環境溫度，以控制位於該工作艙的一電子元件的至少一焊球在一降溫過程中的一降溫梯度，以確保該焊球降溫後的結構強度和穩定性，並可避免該焊球在降溫過程中產生裂痕、氣孔、熱變形，以保持該焊球的焊接外觀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a temperature control system for IR reflow device, a thermal camera, a temperature sensor, a computer, a PID controller, a power controller and an air cooler are provided to control heating temperature of an IR heater and working temperature of a chamber so as to control cooling gradient of solder ball(s) on an electronic component placed in the chamber during cooling. Thus, it is able to ensure structural strength and stability of the solder ball(s), avoid cracks, pores or thermal deformation observed on the solder ball(s) during cooling and maintain welding appearance of the solder ball(s).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:溫度控制系統</p>
        <p type="p">110:熱影像擷取裝置</p>
        <p type="p">120:環境溫度偵測器</p>
        <p type="p">130:運算裝置</p>
        <p type="p">140:比例積分微分控制器</p>
        <p type="p">150:電力控制器</p>
        <p type="p">160:氣體降溫裝置</p>
        <p type="p">200:紅外線回焊裝置</p>
        <p type="p">S1:工作溫度訊號</p>
        <p type="p">S2:環境溫度訊號</p>
        <p type="p">S3:溫差訊號</p>
        <p type="p">S4:控制常數</p>
        <p type="p">S5:電力控制訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="538px" img-content="tif" inline="yes" orientation="portrait" width="910px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621756</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145414</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A61N2/00</main-classification>
        <further-classification edition="200601120241231B">A61N2/02</further-classification>
        <further-classification edition="200601120241231B">A61B5/055</further-classification>
        <further-classification edition="202101120241231B">A61B5/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡國諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, KUO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宗鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZONG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃致軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡元斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YUAN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>經顱磁刺激的冷卻裝置及其載具</chinese-title>
        <english-title>COOLING DEVICE FOR TRANSCRANIAL MAGNETIC STIMULATION AND CARRIER THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種經顱磁刺激的冷卻裝置，包含一載具、一輸送管組及至少一分隔件，該載具的一載體用以容置至少一經顱磁刺激線圈，一冷卻流體經由該載具的一流體分流罩輸入至該載體，該輸送管組連接該流體分流罩，用以輸出通過該載具的該冷卻流體及容置該經顱磁刺激線圈的複數個導線，該分隔件設置於該輸送管組的一撓性管中，以分隔該些導線，藉由流動於該載具及該輸送管組中的該冷卻流體對該經顱磁刺激線圈及該些導線進行散熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cooling device for transcranial magnetic stimulation (TMS) includes a carrier, a pipe assembly and at least one separator. A body of the carrier is provided for placement of at least one TMS coil, and a cooling fluid can flow into the body via a fluid dividing cover of the carrier. The pipe assembly is connected to the fluid dividing cover to output the cooling fluid flowing through the carrier and is provided to accommodate wires of the TMS coil. The separator is mounted in a flexible pipe of the pipe assembly to separate the wires. The TMS coil and the wires can be cooled by the cooling fluid flowing in the carrier and the pipe assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:經顱磁刺激的冷卻裝置</p>
        <p type="p">110:載具</p>
        <p type="p">111:載體</p>
        <p type="p">111c:限位空間</p>
        <p type="p">111d:流體混合空間</p>
        <p type="p">111e:中間部</p>
        <p type="p">111f:間隔牆</p>
        <p type="p">112:流體分流罩</p>
        <p type="p">112a:第一通孔</p>
        <p type="p">112b:分流道</p>
        <p type="p">112c:流體入口</p>
        <p type="p">112e:本體</p>
        <p type="p">112f:蓋體</p>
        <p type="p">112g:第二通孔</p>
        <p type="p">120:輸送管組</p>
        <p type="p">121:撓性管</p>
        <p type="p">121a:第一流道</p>
        <p type="p">122:輸送管</p>
        <p type="p">122a:第二流道</p>
        <p type="p">122b:輸出口</p>
        <p type="p">130:分隔件</p>
        <p type="p">131:第一穿孔</p>
        <p type="p">132:第二穿孔</p>
        <p type="p">140:密封管</p>
        <p type="p">141:通孔</p>
        <p type="p">150:密封膠</p>
        <p type="p">160:第一密封分隔件</p>
        <p type="p">161:分隔孔</p>
        <p type="p">162:注膠孔</p>
        <p type="p">170:第二密封分隔件</p>
        <p type="p">171:分隔孔</p>
        <p type="p">200:經顱磁刺激線圈</p>
        <p type="p">210:導線</p>
        <p type="p">F:冷卻流體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="1019px" img-content="tif" inline="yes" orientation="portrait" width="695px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621568</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145415</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241212B">A23B7/153</main-classification>
        <further-classification edition="200601120241212B">A23B7/154</further-classification>
        <further-classification edition="200601120241212B">A23B7/157</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恰口科研企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯志諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡坪芫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>作物保鮮劑製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明乃是一種作物保鮮劑製備方法，其包含：1.溶液混合，該溶液混合是將至少一酸類、鹼類或鹽類混合成溶液混合物；2.碳粉處理，該碳粉處理是將經碳化之碳粉進行研磨成為平均粒徑1nm~10000&amp;amp;mu;m的預處理碳粉；3.預浸處理，該預浸處理將溶液混合物與預處理碳粉混合，使其成為預浸碳粉；4.微波處理，該微波處理是將預浸碳粉進行微波加熱，微波加熱所施予熱能為2000~10000W，時間為1秒鐘~60分鐘，使其成為微波碳粉；5.爐管處理，該爐管處理是將微波碳粉經溫度100~1500&amp;amp;deg;C加熱，使其成為活化碳晶球；6.均質化，該均質化是將活化碳晶球摻和入精油及醣類化合物中以均質機均勻混合，其即完成作物保鮮劑製備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:溶液混合</p>
        <p type="p">201:碳粉處理</p>
        <p type="p">301:預浸處理</p>
        <p type="p">401:微波處理</p>
        <p type="p">501:爐管處理</p>
        <p type="p">601:均質化</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="880px" img-content="tif" inline="yes" orientation="portrait" width="452px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623339</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145432</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260303B">H05K7/20</main-classification>
        <further-classification edition="202601120260303B">H10W40/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翌實實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YISHI INDUSTRIAL CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>散熱設備及浮動式散熱機構</chinese-title>
        <english-title>HEAT-DISSIPATION APPARATUS AND FLOATING HEAT-DISSIPATION MECHANISM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種散熱設備及浮動式散熱機構。所述浮動式散熱機構包含有一配置板及多個導熱件。所述配置板具有多個通孔，並且每個所述通孔沿一厚度方向貫穿所述配置板。每個所述導熱件能夠可拆卸地安裝於任一個所述通孔，並包含有一柱體及套設於所述柱體的一彈性件。於每個所述導熱件中，所述柱體用來穿設於任一個所述通孔並能相對於所述配置板轉動，所述柱體能通過所述彈性件而沿所述厚度方向彈性地移動。多個所述導熱件之中的至少部分能選擇性地安裝於所述配置板的至少部分所述通孔，以構成彼此相異的多種散熱佈局。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a heat-dissipation apparatus and a floating heat-dissipation mechanism. The floating heat-dissipation mechanism includes a layout board and a plurality of heat-conductive members. The layout board has a plurality of thru-holes penetrating therethrough along a height direction. Each of the heat-conductive members is detachably assembled to any one of the thru-holes, and includes a pillar and an elastic component sleeved at the pillar. In each of the heat-conductive members, the pillar is configured to pass through any one of the thru-holes and is rotatable relative to the layout board, and the pillar is elastically moveable along the height direction through the elastic component. At least part of the heat-conductive members can be selectively assembled to at least part of the thru-holes of the layout board, so as to form a plurality of heat-dissipation layouts being different from each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:散熱設備</p>
        <p type="p">1:作業腔體</p>
        <p type="p">11:第一腔體</p>
        <p type="p">111:第一容置槽</p>
        <p type="p">112:第一流道</p>
        <p type="p">113:環形溝</p>
        <p type="p">12:第二腔體</p>
        <p type="p">121:第二容置槽</p>
        <p type="p">1211:淺層槽</p>
        <p type="p">1212:深層槽</p>
        <p type="p">122:第二流道</p>
        <p type="p">123:壓抵柱</p>
        <p type="p">13:密封環</p>
        <p type="p">2:浮動式散熱機構</p>
        <p type="p">21:配置板</p>
        <p type="p">211:通孔</p>
        <p type="p">22:導熱件</p>
        <p type="p">221:柱體</p>
        <p type="p">222:第一散熱鰭片組</p>
        <p type="p">223:第二散熱鰭片組</p>
        <p type="p">224:彈性件</p>
        <p type="p">3:冷卻裝置</p>
        <p type="p">200:電子封裝構件</p>
        <p type="p">201:封裝體</p>
        <p type="p">2011:發熱區</p>
        <p type="p">2012:非發熱區</p>
        <p type="p">202:發熱元件</p>
        <p type="p">203:電子元件</p>
        <p type="p">H:厚度方向</p>
        <p type="p">C:冷卻流體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="706px" img-content="tif" inline="yes" orientation="portrait" width="1047px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622814</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145433</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250303B">G06N20/00</main-classification>
        <further-classification edition="202301120250303B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周開祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, KAI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多模態行為預測模型訓練系統與方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR TRAINING MULTIMODAL BEHAVIOR PREDICTION MODEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種多模態行為預測模型訓練系統與方法，所述方法執行於一運算裝置中，運算裝置設有處理器與神經處理器。其中，通過處理器取得一或多個非可信任的感測器以及可信任的感測器產生的多種感測數據，通過神經處理器可針對多種感測數據分別運用對應的多種模型預測使用者的行為，並以可信任的感測器產生的感測數據訓練同一時間由非可信任的感測器產生的感測數據，以訓練得出預測模型。如此，神經處理器以完成訓練的預測模型以及可信任模型共同建立一多模態行為預測模型，用以預測使用者行為，並能針對特定事件發出提醒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for training a multimodal behavior prediction model are provided. The method is performed in a computing device that includes a processor and a neural processor. The processor retrieves multiple types of sensor data generated by one or more untrusted sensors and trusted sensors, and the neural processor uses multiple types of models corresponding to the multiple types of sensor data to predict behaviors of a user. The sensor data generated by the trusted sensors can be used to train the sensor data that are generated by the one or more untrusted sensors at the same time so as to train one or more prediction models. Therefore, the neural processor uses the trained prediction models and the trusted model to jointly establish the multimodal behavior prediction model that can be used to predict behaviors of the user and send a reminder for a specific event.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:影像擷取單元</p>
        <p type="p">202:音訊接收單元</p>
        <p type="p">203:定位單元</p>
        <p type="p">204:感測單元</p>
        <p type="p">206:大型語言模型</p>
        <p type="p">205:神經處理器</p>
        <p type="p">207:受訓練語言模型</p>
        <p type="p">208:行為偵測單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="669px" img-content="tif" inline="yes" orientation="portrait" width="789px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621613</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145434</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A47G23/04</main-classification>
        <further-classification edition="200601120241231B">A47J27/12</further-classification>
        <further-classification edition="200601120241231B">A47G19/22</further-classification>
        <further-classification edition="200601120241231B">A47J31/10</further-classification>
        <further-classification edition="200601120241231B">A23F5/02</further-classification>
        <further-classification edition="200601120241231B">A47J43/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立暨南國際大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHI NAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>南投縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭健雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JEN-SON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瓊嬌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIUNG-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張眾卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUNG-CHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智能飲品杯組</chinese-title>
        <english-title>INTELLIGENT DRINK CUP SET</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種智能飲品杯組，其包含攪拌件、杯體、多個感應單元及溫度控制模組。攪拌件具有觸發單元。杯體內部具有容置空間。多個感應單元間隔地設置於容置空間的內周壁。感應單元響應於觸發單元以產生感應訊號。溫度控制模組設置於杯體的底部，且電性連接多個感應單元。溫度控制模組依據多個感應單元產生感應訊號的順序，以加熱或冷卻容置空間中的液體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides an intelligent drink cup set, which includes a stirring rod, a cup body, a plurality of sensing units and a temperature control module. The stirring rod has a trigger unit. The cup body has an accommodation space. The sensing units are arranged at intervals on the inner peripheral wall of the accommodation space. The sensing unit responds to the triggering unit to generate sensing signals. The temperature control module is arranged at the bottom of the cup body and is electrically connected to the sensing units. The temperature control module heats or cools the liquid in the accommodation space based on a sequence in which the sensing units generate sensing signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:攪拌件</p>
        <p type="p">11:觸發單元</p>
        <p type="p">20:杯體</p>
        <p type="p">30:感應單元</p>
        <p type="p">31:感應訊號</p>
        <p type="p">40:溫度控制模組</p>
        <p type="p">41:處理單元</p>
        <p type="p">411:第一順序</p>
        <p type="p">412:第二順序</p>
        <p type="p">413:切換次數</p>
        <p type="p">414:預定數值</p>
        <p type="p">42:加熱晶片</p>
        <p type="p">43:製冷晶片</p>
        <p type="p">51:感溫單元</p>
        <p type="p">511:溫度訊號</p>
        <p type="p">52:顯示單元</p>
        <p type="p">61:電池單元</p>
        <p type="p">62:電連接埠</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="904px" img-content="tif" inline="yes" orientation="portrait" width="705px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621616</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145436</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A47J31/41</main-classification>
        <further-classification edition="200601120241230B">A47J31/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立暨南國際大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHI NAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>南投縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路暢平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHANG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭健雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JEN-SON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾永平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉芃均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PENG-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智能咖啡杯組</chinese-title>
        <english-title>INTELLIGENT COFFEE CUP SET</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種智能咖啡杯組，其包含杯體、乳品添加模組、多個感應單元及控制模組。杯體具有飲品空間。飲品空間配置以容置咖啡。乳品添加模組設置於杯體的杯壁，且連通至飲品空間。乳品添加模組包含高壓產生單元及乳品供應單元。高壓產生單元供應高壓氣體，以使乳品供應單元的乳品輸出至飲品空間。多個感應單元沿著飲品空間的圓周方向間隔地設置於杯體的杯壁。感應單元感應咖啡的流動而產生感應訊號。控制模組依據多個感應單元獲得第一流動方向。控制模組根據第一流動方向控制高壓產生單元運作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an intelligent coffee cup set, which includes a cup, a milk adding module, a plurality of sensing units and a control module. The cup has a beverage space for accommodating coffee. The milk adding module is installed on a cup-wall of the cup and is connected to the beverage space. The milk adding module includes a high-pressure generation unit and a milk supply unit. The high-pressure generating unit supplies high-pressure gas so that the milk output to the beverage space. The sensing unit is arranged on the cup-wall of the cup at intervals along the circumferential direction of the beverage space. The sensing unit senses a flow of coffee and generates a sensing signal. The control module obtains a first flow direction based on the sensing signals. The control module controls the operation of the high-pressure generating unit according to the first flow direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S:智能咖啡杯組</p>
        <p type="p">1:杯體</p>
        <p type="p">11:飲品空間</p>
        <p type="p">12:液面高度標誌</p>
        <p type="p">13:容置空間</p>
        <p type="p">131:微孔</p>
        <p type="p">132:添加部</p>
        <p type="p">2:乳品添加模組</p>
        <p type="p">21:高壓產生單元</p>
        <p type="p">22:乳品供應單元</p>
        <p type="p">3:感應單元</p>
        <p type="p">31:感應訊號</p>
        <p type="p">4:控制模組</p>
        <p type="p">41:第一流動方向</p>
        <p type="p">42:第二流動方向</p>
        <p type="p">43:第一預定頻率</p>
        <p type="p">44:第二預定頻率</p>
        <p type="p">5:糖品添加模組</p>
        <p type="p">51:高壓產生單元</p>
        <p type="p">52:糖品供應單元</p>
        <p type="p">6:振動感應模組</p>
        <p type="p">61:振動訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="898px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621790</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145444</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">B01J21/04</main-classification>
        <further-classification edition="200601120241220B">B01J23/656</further-classification>
        <further-classification edition="200601120241220B">B01J23/89</further-classification>
        <further-classification edition="200601120241220B">B01D53/56</further-classification>
        <further-classification edition="200601120241220B">B01D53/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張顓麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林弘萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HONG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝旻家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, MIN-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>觸媒組合物與去除氮氧化物的方法</chinese-title>
        <english-title>CATALYTIC COMPOSITION AND METHOD FOR REMOVING NITROGEN OXIDES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸媒組合物包括一載體、第一活性成分與第二活性成分。第一活性成分披覆於載體的表面，其中第一活性成分包括第一觸媒，第一觸媒為氧化錳。第二活性成分包括第二觸媒及第三觸媒，並披覆於第一活性成分的表面以及載體上無第一活性成分披覆的表面。所述第二觸媒包含鉑金屬、鈀金屬或其組合，第三觸媒包含氧化鉀、氧化鈉或其組合。第一觸媒與第二觸媒的莫耳比例為1：0.001至1：0.2，且第一觸媒與第三觸媒的莫耳比例為1：0.1至1：10。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A catalytic composition includes a carrier, a first active component, a second active component. The first active component is coated on a surface of the carrier, wherein the first active component includes a first catalyst, and the first catalyst is manganese oxide.        &lt;br/&gt;The second active component including a second catalyst and a third catalyst is coated on a surface of the first active component and the surface of the carrier that is not covered with the first active component. The second catalyst includes platinum metal, palladium metal, or a combination thereof, and the third catalyst includes potassium oxide, sodium oxide or a combination thereof. The molar ratio of the first catalyst to the second catalyst is 1:0.001 to 1:0.2, and the molar ratio of the first catalyst to the third catalyst is 1:0.1 to 1:10.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:觸媒組合物</p>
        <p type="p">102:載體</p>
        <p type="p">102s、104s:表面</p>
        <p type="p">104:第一活性成分</p>
        <p type="p">106:第二活性成分</p>
        <p type="p">C1:第一觸媒</p>
        <p type="p">C2:第二觸媒</p>
        <p type="p">C3:第三觸媒</p>
        <p type="p">H&lt;sub&gt;2&lt;/sub&gt;:氫氣</p>
        <p type="p">H&lt;sub&gt;2&lt;/sub&gt;O:水</p>
        <p type="p">N&lt;sub&gt;2&lt;/sub&gt;:氮氣</p>
        <p type="p">NO&lt;sub&gt;X&lt;/sub&gt;:氮氧化物</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="505px" img-content="tif" inline="yes" orientation="portrait" width="742px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621585</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145445</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120241231B">A42B1/008</main-classification>
        <further-classification edition="200601120241231B">A42B3/04</further-classification>
        <further-classification edition="200601120241231B">A42B3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泊采企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BO CAI ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊中琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG QI, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪銘憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有電熱線鏡片的安全帽供電裝置</chinese-title>
        <english-title>A POWER SUPPLY APPARATUS FOR SAFETY HELMET WITH HEATING WIRE LENS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關一種具有電熱線鏡片的安全帽供電裝置，其包括：一安全帽本體，該本體前端設有一可掀式鏡片，該本體兩側邊分別具有樞接部，該裝置是結合在該本體的其中一樞接部，其包含：一間隔座，該間隔座是結合在本體的樞接部上，且該間隔座外側邊設有一鏡片座，該鏡片座結合一具有電熱線的鏡片；一安裝在間隔座的導電傳導元件組，該導電傳導元件組一端與電源供應連接組連接，及一結合在鏡片的導電接觸元件組，該導電接觸元件組在鏡片安裝於鏡片座後會與導電傳導元件組接觸，利用電源供應連接組提供電力並藉由所述的裝置提供給電熱線使用，以避免鏡片產生霧氣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention is about a kind of a power supply apparatus for safety helmet with heating wire lens. It includes the safety helmet body. The front of the safety helmet body has a liftable lens. There are pivots on the two sides of the safety helmet body respectively. This apparatus is connected to one of the pivots on the safety helmet body. It consists of: a spacer seat, which is connected to the pivot of the safety helmet body. The outer side of the spacer seat has a lens seat. The lens seat is integrated with a lens with heating wire; a conductive component which installed in the spacer seat. One side of the conductive component is connected to the power supply connecting component; a conductive contact component that integrated with the lens. The conductive contact component makes contact with the conductive component after the lens is installed on the lens seat. The power supply connecting component provides power to the apparatus for the heating wire to prevent fogging on the lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:鏡片</p>
        <p type="p">21:電熱線</p>
        <p type="p">22:旋轉孔</p>
        <p type="p">23:卡摯塊</p>
        <p type="p">24:卡摯孔</p>
        <p type="p">25:連接線槽</p>
        <p type="p">3:間隔座</p>
        <p type="p">31:鏡片座</p>
        <p type="p">32:組裝孔</p>
        <p type="p">321:容置槽</p>
        <p type="p">34:鎖固孔</p>
        <p type="p">41:導電螺絲</p>
        <p type="p">42:螺母</p>
        <p type="p">5:導電接觸元件組</p>
        <p type="p">51:導電接觸片</p>
        <p type="p">511:接觸面</p>
        <p type="p">512:連接端</p>
        <p type="p">513:電源線</p>
        <p type="p">52:外蓋</p>
        <p type="p">521:固定柱</p>
        <p type="p">522:結合柱</p>
        <p type="p">6:電源供應連接組</p>
        <p type="p">61:電源插座</p>
        <p type="p">611:電源供應插孔</p>
        <p type="p">612:USB插孔</p>
        <p type="p">62:導電連接片</p>
        <p type="p">621:連接端</p>
        <p type="p">622:接觸端</p>
        <p type="p">63:電源線</p>
        <p type="p">8:內蓋</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="734px" img-content="tif" inline="yes" orientation="portrait" width="1025px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622592</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145449</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250212B">G02B27/01</main-classification>
        <further-classification edition="200601120250212B">G02B27/28</further-classification>
        <further-classification edition="200601120250212B">G02B11/02</further-classification>
        <further-classification edition="202101120250212B">G02B7/02</further-classification>
        <further-classification edition="200601120250212B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉晶光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃峻洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許聖偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>目鏡光學系統</chinese-title>
        <english-title>OCULAR OPTICAL SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種目鏡光學系統，配置用以將來自顯示畫面的成像光線經過目鏡光學系統進入觀察者的眼睛以形成影像。目鏡光學系統從目側至顯示側沿光軸依序包括第一透鏡及第二透鏡。目鏡光學系統還包括線偏振膜、反射偏振膜、四分之一波長片及部份反射鏡。四分之一波長片設置在反射偏振膜上，反射偏振膜設置在線偏振膜上，線偏振膜設置在第一透鏡的顯示側面的光軸區域的平面上。第二透鏡的目側面的光軸區域為凸面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ocular optical system, configuring to allow imaging rays from a display screen to enter an eye of an observer through the ocular optical system to form an image is provided. The ocular optical system includes a first lens element and a second lens element in sequence along an optical axis from an eye-side to a display-side. The ocular optical system further includes a linear polarizing film, a reflective polarizing film, a quarter-wave plate and a partially reflective mirror. The quarter-wave plate is disposed on the reflective polarizing film, the reflective polarizing film is disposed on the linear polarizing film, and the linear polarizing film is disposed on a plane of an optical axis region of the display-side of the first lens element. An optical axis region on the eye-side of the second lens element is convex.</p>
      </isu-abst>
      <representative-img>
        <p type="p">0:瞳孔</p>
        <p type="p">1:第一透鏡</p>
        <p type="p">10:目鏡光學系統</p>
        <p type="p">15,25,35,45:目側面</p>
        <p type="p">151,161,251,261:光軸區域</p>
        <p type="p">153,163,253,263:圓周區域</p>
        <p type="p">16,26,36,46:顯示側面</p>
        <p type="p">2:第二透鏡</p>
        <p type="p">3:線偏振膜加反射偏振膜</p>
        <p type="p">4:四分之一波長片</p>
        <p type="p">5:部份反射鏡</p>
        <p type="p">99:顯示畫面</p>
        <p type="p">A1:目側</p>
        <p type="p">A2:顯示側</p>
        <p type="p">I:光軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10034.png" file="d10034.TIF" giffile="ed10034.png" height="690px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621596</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145453</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A45D6/00</main-classification>
        <further-classification edition="200601120241231B">A45D44/00</further-classification>
        <further-classification edition="200601120241231B">A45D20/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商桑蘇巴蘭股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOONSOOBARAM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金民秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MIN SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>造型配件和具有該造型配件的可攜式裝置</chinese-title>
        <english-title>STYLING ATTACHMENT AND PORTABLE DEVICE EQUIPPED THEREWITH</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的一實施例的造型配件包括：配件底座，具有空氣流入的底座入口和排出流入的空氣的底座出口；捲筒，與底座出口連通，具有用於將藉由底座出口流入的空氣中的一部分噴射到側面的狹縫和用於排出沿著與底座出口相反的方向流入的空氣中的一部分的捲筒出口；及蓋部，設置在捲筒出口，具有用於將藉由捲筒出口排出的空氣噴射到捲筒的側面的蓋部風嘴。根據本發明的造型配件和具有該造型配件的可攜式裝置構造成當用戶沿期望方向對頭發做造型時能夠從配件的兩端部排出空氣，從而具有充分保持頭髮的溫度的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:造型配件</p>
        <p type="p">110:配件底座</p>
        <p type="p">116:配件風嘴</p>
        <p type="p">120:捲筒</p>
        <p type="p">122:狹縫</p>
        <p type="p">130:蓋部</p>
        <p type="p">132:裙擺部</p>
        <p type="p">134:蓋部主體</p>
        <p type="p">134a:蓋部旋鈕</p>
        <p type="p">136:蓋部風嘴</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="835px" img-content="tif" inline="yes" orientation="portrait" width="502px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621930</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145455</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250731B">B62D57/02</main-classification>
        <further-classification edition="200601120250731B">B62D57/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴禾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴禾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可加裝運動模組的機械狗</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明可加裝運動模組的機械狗，其運動模組就是各種已知的移動系統，包含車輪系統(如遙控車)、履帶系統(如遙控履帶車)、跳躍系統(如彈簧壓縮器)、降落傘(如遙控飛行傘)、遙控船(如浮桶+螺旋槳)、或無人機(如遙控直升機)都是現有的裝備，只是依需要加裝於機械狗上。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621889</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145478</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B29C45/16</main-classification>
        <further-classification edition="200601320241230B">B29L7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凌正南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LING, CHENG-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, WEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恭正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUNG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>機殼製作方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF CASING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種機殼製作方法，包括：以塑膠射出成型製作出機殼，在塑膠射出成型的過程中，提供至少兩種塑膠粒材，是同質塑膠且具不同顏色，其中塑膠粒材藉由塑膠粒材的混料方式，塑膠粒材的異色混料比例、塑膠粒材的熔點差異、塑膠粒材的進料方式、或塑膠粒材的進點位置與成型溫度，而使機殼的表面呈現非固定流痕圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of casing is provided. The manufacturing method includes manufacturing a casing by plastic injection molding, and during the process of manufacturing the casing, at least two kinds of plastic pellets are provided. The at least two kinds of plastic pellets are homogeneous plastics having colors different from each other. An irregular flow mark pattern is generated on a surface of the casing by mixing ways of the plastic pellets, a mixing ratio of the plastic pellets with different colors, different melting temperatures of the plastic pellets, injection ways of the plastic pellets, or injection positions and molding temperatures of the plastic pellets during the process of injection molding.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1、S2、S3、S4、S5、S6:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="498px" img-content="tif" inline="yes" orientation="portrait" width="509px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622655</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145481</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250418B">G05B19/04</main-classification>
        <further-classification edition="200601120250418B">G05B19/042</further-classification>
        <further-classification edition="200601120250418B">G06F1/28</further-classification>
        <further-classification edition="200601120250418B">G06F1/16</further-classification>
        <further-classification edition="200601120250418B">H05K7/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神雲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAC COMPUTING TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張詠渝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>伺服器機櫃系統及伺服器機櫃控制方法</chinese-title>
        <english-title>A SERVER CABINET SYSTEM AND SERVER CABINET CONTROL METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種伺服器機櫃系統，包含一容置有多個硬碟的磁碟抽屜、一抽屜滑軌設備，及一處理單元。該抽屜滑軌設備包括二滑軌總成，每一滑軌總成包括一滑軌裝置、一馬達及一測距模組。該滑軌裝置可相對於該機櫃在一滑移方向上滑移。該馬達用以驅動該滑軌裝置。測距模組量測與磁碟抽屜的距離，以得到開啟距離。該處理單元根據對應其中一硬碟的一裝置錯誤訊息以控制所述馬達運轉而驅動所述滑軌裝置同步帶動該磁碟抽屜往移出該機櫃的方向移動而使該磁碟抽屜移出該機櫃並露出該裝置錯誤訊息對應的硬碟，以便於進行後續的維護作業。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A server cabinet system includes a disk drawer accommodating a plurality of hard disks, a drawer slide rail device, and a processing unit. The drawer slide rail device includes two slide rail assemblies, each of which includes a slide rail device slidable relative to the cabinet in a sliding direction. The motor is configured to drive the slide rail device. The distance measuring module measures a distance from the disk drawer to obtain an open distance. The processing unit controls, based on a device error message corresponding to one of the hard disks, the motor to operate so as to drive the slide rail devices to synchronously move the disk drawer to move out of the cabinet and to expose from the hard disk corresponding to the device error message, thereby facilitating subsequent maintenance operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:滑軌總成</p>
        <p type="p">11:滑軌裝置</p>
        <p type="p">12:馬達</p>
        <p type="p">13:測距模組</p>
        <p type="p">2:馬達驅動裝置</p>
        <p type="p">3:處理單元</p>
        <p type="p">91:磁碟抽屜</p>
        <p type="p">92:硬碟</p>
        <p type="p">93:微處理器</p>
        <p type="p">94:抽屜滑軌設備</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="740px" img-content="tif" inline="yes" orientation="portrait" width="871px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622667</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145482</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250326B">G05D1/249</main-classification>
        <further-classification edition="202401120250326B">G05D1/43</further-classification>
        <further-classification edition="202401320250326B">G05D111/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優式機器人股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URSROBOT AI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴昱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世又</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連豊力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳忠侯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUNG-HOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳招成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>往復式即時定位方法及其裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種往復式即時定位方法經由一往復式即時定位裝置實施，該往復式即時定位裝置包含一處理模組及一訊號連接該處理模組並用於獲得一連串感測資料的視覺慣性模組，每一感測資料包含一環境影像及一慣性資料。當該處理模組判定出一位姿圖中存在一閉合環路時，該處理模組根據一當前位姿之前的所有位姿中獲得一對應於該當前位姿的對齊閉環位姿，該處理模組根據該當前位姿及其對應的該當前感測資料，與該對齊閉環位姿及其對應的感測資料獲得一連接關係，該處理模組優化該位姿圖，並以該位姿圖之優化後當前位姿作為即時定位資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11~17:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="1053px" img-content="tif" inline="yes" orientation="portrait" width="718px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622891</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145483</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120241231B">G06T7/70</main-classification>
        <further-classification edition="202201120241231B">G06V20/56</further-classification>
        <further-classification edition="202401120241231B">G05D1/249</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優式機器人股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URSROBOT AI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴昱翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連豊力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳忠侯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUNG-HOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳招成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>視覺定位方法及定位裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種視覺視覺定位方法，藉由一定位裝置來實施，包含一處理模組及一訊號連接該處理模組並接收一連串相關於該定位裝置周圍環境之環境影像的視覺感測器，當該處理模組接收到一環境影像時，該處理模組根據該環境影像利用一影像分割方法獲得一主要影像及一次要影像，該處理模組根據該主要影像及該次要影像獲得一對應於該主要影像的主要權重及一對應於該次要影像的次要權重，該處理模組根據該主要影像、該主要權重、該次要影像及該次要權重獲得一對應於該定位裝置的定位資訊。該處理模組根據分割後的該環境影像會有更穩定的定位效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1~3:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="653px" img-content="tif" inline="yes" orientation="portrait" width="654px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622377</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145485</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250212B">F04D29/62</main-classification>
        <further-classification edition="200601120250212B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉今</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林光華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUANG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>離心式風扇</chinese-title>
        <english-title>CENTRIFUGAL FAN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種離心式風扇，包括框體、蓋體、吸震件以及葉輪。框體具有底部與側牆，側牆立於底部的周緣上。吸震件配置於側牆上。蓋體組裝至框體以將吸震件夾持在蓋體與側牆之間。葉輪可旋轉地配置在框體與蓋體之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A centrifugal fan including a frame, a cover, a shock-absorption member, and an impeller is provided. The frame has a bottom and a side wall erected on a peripheral edge of the bottom. The shock-absorption member is disposed on the side wall. The cover is assembled to the frame and the shock-absorption member is clamped between the cover and the side wall. The impeller is rotatably arranged between the frame and the cover.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:離心式風扇</p>
        <p type="p">110:框體</p>
        <p type="p">113:支撐柱</p>
        <p type="p">114:凸柱</p>
        <p type="p">120:吸震件</p>
        <p type="p">130:蓋體</p>
        <p type="p">140:葉輪</p>
        <p type="p">151、152:吸震件</p>
        <p type="p">E1:入風口</p>
        <p type="p">E3:出風口</p>
        <p type="p">h1、h2:高度</p>
        <p type="p">S2:第二頂面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="702px" img-content="tif" inline="yes" orientation="portrait" width="1025px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623156</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145487</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">H02M1/08</main-classification>
        <further-classification edition="200701120241231B">H02M7/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖啓仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周彥甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHOU, YAN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧鴻毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, HUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>輔助諧振換相極裝置及其操作方法</chinese-title>
        <english-title>AUXILIARY RESONANT COMMUTATED POLE (ARCP) DEVICE AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種輔助諧振換相極（auxiliary resonant commutated pole，ARCP）裝置以及ARCP裝置的操作方法。ARCP裝置包括第一諧振電容器、第二諧振電容器、諧振元件、第一電壓開關、第二電壓開關以及控制器。第一諧振電容器連接於電源端與連接節點之間。第二諧振電容器連接於連接節點與參考電壓端之間。諧振元件的第一端連接於連接節點。第一電壓開關連接於電源端與諧振元件的第二端之間。第二電壓開關連接於諧振元件的第二端與參考電壓端之間。控制器控制第一電壓開關以及第二電壓開關以使位於連接節點的電壓值在設定範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An auxiliary resonant commutated pole (ARCP) device and an operating method of the ARCP device are provided. The ARCP device includes a first resonant capacitor, a second resonant capacitor, a resonant element, a first voltage switch, a second voltage switch and a controller. The first resonant capacitor is connected between a power terminal and a connection node. The second resonance capacitor is connected between the connection node and a reference voltage terminal. A first terminal of the resonant element is connected to the connection node. The first voltage switch is connected between the power terminal and a second terminal of the resonant element. The second voltage switch is connected between the second terminal of the resonant element and the reference voltage terminal. The controller controls the first voltage switch and the second voltage switch so that a voltage value at the connection node is within a set range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:ARCP裝置</p>
        <p type="p">110:控制器</p>
        <p type="p">120:ARCP電路</p>
        <p type="p">130:偵測電路</p>
        <p type="p">C1、C2:諧振電容器</p>
        <p type="p">LB:諧振元件</p>
        <p type="p">ND:連接節點</p>
        <p type="p">P1:電源端</p>
        <p type="p">RR:設定範圍</p>
        <p type="p">SB1:第一電壓開關</p>
        <p type="p">SB2:第二電壓開關</p>
        <p type="p">SD:偵測訊號</p>
        <p type="p">VD:電壓值</p>
        <p type="p">VP:電源電壓值</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="789px" img-content="tif" inline="yes" orientation="portrait" width="1015px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622628</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145488</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120241218B">G03F1/76</main-classification>
        <further-classification edition="201201120241218B">G03F1/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車行遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHE, SHYNG-YEUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂美蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MEI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>形成半導體裝置的方法</chinese-title>
        <english-title>METHOD FOR FORMING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種形成半導體裝置的方法，其包括以下步驟。於目標層上方提供光罩圖案，光罩圖案包括第一圖案和第二圖案，第一圖案和第二圖案在第一方向上彼此相鄰。使用光罩圖案在第一位置處進行第一曝光製程，使得目標層包括第一曝光區。將光罩圖案從第一位置沿第一方向移動至第二位置。使用光罩圖案在第二位置處進行第二曝光製程，使得目標層包括第二曝光區。其中目標層包括第一曝光區和第二曝光區彼此重疊的重疊區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for forming a semiconductor device, which includes following steps. A photo mask pattern including a first pattern and a second pattern adjacent to each other in a first direction is provided above a target layer. A fist exposure process is performed at a first position by using the photo mask pattern, so that the target layer is formed to include a first exposed region. The photo mask pattern is moved from the first position to a second position along the first direction. A second exposure process is performed at the second position by using the photo mask pattern, so that the target layer is formed to include a second exposed region. The target layer includes an overlapping region in which the first exposed region and the second exposed region overlapped with each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓</p>
        <p type="p">10_Sht:預設曝光區域</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">P1:第一位置</p>
        <p type="p">P2:第二位置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="593px" img-content="tif" inline="yes" orientation="portrait" width="655px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623039</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145489</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260303B">H01J37/32</main-classification>
        <further-classification edition="200601120260303B">H05H1/34</further-classification>
        <further-classification edition="200601120260303B">H05H1/36</further-classification>
        <further-classification edition="202601120260303B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力晶積成電子製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張柏揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, BO-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周俊吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電容耦合電漿蝕刻機台及電容耦合電漿蝕刻方法</chinese-title>
        <english-title>CAPACITIVELY COUPLED PLASMA ETCHING MACHINE AND CAPACITIVELY COUPLED PLASMA ETCHING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電容耦合電漿蝕刻機台，包括蝕刻腔室、電漿產生腔室、第一電極、第一梳狀電極、第二梳狀電極與第二電極。電漿產生腔室位在蝕刻腔室上。第一電極、第一梳狀電極、第二梳狀電極與第二電極位在電漿產生腔室中。第一電極位在第二電極上。第一梳狀電極與第二梳狀電極位在第一電極與第二電極之間。第一梳狀電極包括多個第三電極。第二梳狀電極包括多個第四電極。多個第三電極與多個第四電極交替排列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capacitively coupled plasma etching machine including an etching chamber, a plasma generation chamber, a first electrode, a first comb-shaped electrode, a second comb-shaped electrode, and a second electrode is provided. The plasma generation chamber is located above the etching chamber. The first electrode, the first comb-shaped electrode, the second comb-shaped electrode, and the second electrode are located in the plasma generation chamber. The first electrode is located on the second electrode. The first comb-shaped electrode and the second comb-shaped electrode are located between the first electrode and the second electrode. The first comb-shaped electrode includes third electrodes. The second comb-shaped electrode includes fourth electrodes. The third electrodes and the fourth electrodes are arranged alternately.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電容耦合電漿蝕刻機台</p>
        <p type="p">100:蝕刻腔室</p>
        <p type="p">102:電漿產生腔室</p>
        <p type="p">104:梳狀電極</p>
        <p type="p">106:梳狀電極</p>
        <p type="p">108:電路切換控制盒</p>
        <p type="p">110:電腦</p>
        <p type="p">E1,E2,E3,E4:電極</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="706px" img-content="tif" inline="yes" orientation="portrait" width="905px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623241</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145491</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L67/50</main-classification>
        <further-classification edition="202201120250303B">H04L9/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓傳育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, CHUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉哲豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHE-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHEN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許嘉容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於網路行為識別連網設備的裝置及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR IDENTIFYING NETWORK DEVICE BASED ON NETWORK BEHAVIOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於網路行為識別連網設備的裝置及方法。此方法適於由具有處理器的電子裝置識別連接至網路的連網設備，其包括下列步驟：擷取多個連網設備連結網路的網路行為數據；從網路行為數據中擷取與各連網設備相關聯的多筆行為資訊，使用行為資訊生成標籤以建立各連網設備的行為描述並收錄於識別資料庫；以及響應於擷取到當前網路行為數據，解析當前網路行為數據中的行為資訊，並與識別資料庫中各行為描述的標籤比對，根據比對結果識別當前網路行為數據所屬的連網設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus and a method for identifying a network device based on network behavior are provided. The method is adapted for an electronic apparatus having a processor to identify a network-connected device connected to a network, and includes steps of: retrieving network behavior data of multiple network-connected devices connecting to the network, extracting multiple pieces of behavior information associated with each network device from the network behavior data, generating tags by using the behavior information so as to create a behavior description of each network device and record the behavior description in an identification database, and in response to retrieving current network behavior data, parsing the behavior information in the current network behavior data and comparing the behavior information with the tags of each behavior description in the identification database, so as to identify the network device to which the current network behavior data belong based on a comparison result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S302~S306:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="559px" img-content="tif" inline="yes" orientation="portrait" width="582px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623602</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145492</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="201801120260302B">G01N23/2251</further-classification>
        <further-classification edition="200601120260302B">G01B7/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江知優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>監控字元線的方法</chinese-title>
        <english-title>METHOD FOR MONITORING WORF LINE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種監控字元線的方法，其用於監控位於基底中的多個溝槽中的多個字元線的深度均勻度，且包括以下步驟。提供由式（1）計算得到的關於字元線深度的深度指標。對第一晶圓進行電子束掃描，並根據預設的θ、掃描得到的多個第一字元線中的每一個的SP與W以及式（1），得到多個第一DI。取得所述多個第一字元線的多個實際深度。經由迴歸分析，計算所述多個第一DI與所述多個實際深度的R        &lt;sup&gt;2&lt;/sup&gt;值，確認R        &lt;sup&gt;2&lt;/sup&gt;不低於0.9。對第二晶圓進行所述電子束掃描，並得到多個第二DI。計算所述多個第二DI的三倍標準差，並根據所述三倍標準差來監控所述第二晶圓的字元線深度的均勻度。        &lt;br/&gt;DI=tan(θ)×(SP-W)/2  式（1）      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Providing is a method for monitoring word lines, which is used to monitor the depth uniformity of a plurality of word lines located in a plurality of trenches in the substrate. The method includes the following steps. A depth index (DI) about the word line depth calculated by Equation (1). A first wafer is scanned with an electron beam, and a plurality of first DIs are obtained according to a predetermined θ, an SP and a W of each of the first word lines from scanning and the Equation (1). A plurality of real depths of the plurality of first word lines are obtained. Through regression analysis, the R        &lt;sup&gt;2&lt;/sup&gt;values of the plurality of first DIs and the plurality of real depths are calculated, and it is confirmed that R        &lt;sup&gt;2&lt;/sup&gt;is not less than 0.9. A second wafer is scanned with the electron beam, and a plurality of second DIs are obtained. A 3-sigma (3σ) is calculated from the plurality of second DIs, and the word line depth uniformity of the second wafer is monitored according to the 3σ.        &lt;br/&gt;DI=tan(θ)×(SP-W)/2 Equation (1)      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100、102、104、106、108、110、112:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="783px" img-content="tif" inline="yes" orientation="portrait" width="526px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622358</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145496</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">F03G7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝正舉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, ZHENG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝正舉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, ZHENG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃珊珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>磁能疊加轉速發動機</chinese-title>
        <english-title>MAGNETIC ENERGY SUPERPOSITION SPEED ENGINE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁能疊加轉速發動機，包含一動力單元、至少一傳動單元，及一負載單元，該動力單元包括一動力模組，該傳動單元包括一主動側轉體、複數主動磁鐵、一從動側轉體，及複數從動磁鐵，該動力模組帶動該主動側轉體旋轉，該複數主動磁鐵與該複數從動磁鐵呈磁性連接的關係，該複數主動磁鐵的數量大於該複數從動磁鐵的數量，該主動側轉體帶動該從動側轉體旋轉，該負載單元包括一負載模組，該從動側轉體帶動該負載模組旋轉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic energy superposition speed engine includes a power unit, at least one transmission unit, and a load unit. The power unit includes a power module. The transmission unit includes an active side rotating body, a plurality of active magnets, a driven side rotating body, and a plurality of driven magnets. The power module drives the active side swivel body to rotate. The plurality of active magnets and the plurality of driven magnets are magnetically connected. The number of active magnets is greater than the number of driven magnets. The active side rotating body drives the driven side rotating body to rotate. The load unit includes a load module. The driven side rotor drives the load module to rotate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:動力單元</p>
        <p type="p">31:動力模組</p>
        <p type="p">4:傳動單元</p>
        <p type="p">41:主動側轉體</p>
        <p type="p">43:從動側轉體</p>
        <p type="p">5:負載單元</p>
        <p type="p">51:負載模組</p>
        <p type="p">6:軸承單元</p>
        <p type="p">61:磁浮軸承</p>
        <p type="p">65:第一支撐體結構</p>
        <p type="p">66:第二支撐體結構</p>
        <p type="p">7:殼體單元</p>
        <p type="p">71:內側殼體</p>
        <p type="p">72:外側殼體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="937px" img-content="tif" inline="yes" orientation="portrait" width="712px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622686</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145514</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250731B">G06F1/16</main-classification>
        <further-classification edition="200601120250731B">H04N5/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江東峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TUNG CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張格禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KO CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁偉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, WEI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳其倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, QI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>遮光罩</chinese-title>
        <english-title>LIGHT SHIELD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種遮光罩，適於組裝至一顯示裝置，而包括一上蓋基座、一上蓋、兩側板及燈條模組。上蓋基座組裝於顯示裝置的上側，並具有一凹槽。上蓋配置於上蓋基座上。兩側板分別連接於上蓋的相對兩側。燈條模組可轉動地設置於凹槽。燈條模組發出的光通過凹槽中的一開口照射出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light shield is adapted to be mounted on a display device and includes a top cover base, a top cover, two side panels, and a light bar module. The top cover base is assembled to a top side of the display device and has a groove. The top cover is arranged on the top cover base. The two side panels are connected to two opposite sides of the top cover, respectively. The light bar is rotatably disposed in the groove. A light generated by the light bar module exits through an opening in the groove.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:遮光罩</p>
        <p type="p">110:上蓋基座</p>
        <p type="p">120:上蓋</p>
        <p type="p">130a,130b:側板</p>
        <p type="p">132:側部</p>
        <p type="p">138:開孔</p>
        <p type="p">140:燈條模組</p>
        <p type="p">1442:旋鈕本體</p>
        <p type="p">160:後蓋</p>
        <p type="p">200:顯示裝置</p>
        <p type="p">202:螢幕</p>
        <p type="p">A-A,B-B,D-D:剖線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.png" file="d10020.TIF" giffile="ed10020.png" height="668px" img-content="tif" inline="yes" orientation="portrait" width="687px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623484</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145515</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250213B">H10H29/851</main-classification>
        <further-classification edition="202501120250213B">H10H29/855</further-classification>
        <further-classification edition="202501120250213B">H10H29/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡燕青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YEN CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝承志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括多個畫素單元。每一畫素單元包括堤岸層、第一發光元件、第二發光元件、第三發光元件、第一色轉換結構、第一散射結構及第二散射結構。堤岸層的多個開口沿著行方向及列方向排成多行與多列。第一發光元件、第二發光元件及第三發光元件分別位於堤岸層的第一開口、第二開口及第三開口中。第一色轉換結構設置於第一開口。第一散射結構設置於第二開口中。第二散射結構設置於第三開口中。第一色轉換結構及第一散射結構在第一方向上排列。第一散射結構及第二散射結構在第二方向上排列。第一方向、第二方向、行方向及列方向互相交錯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes pixel units. Each of the pixel unit includes a bank layer, a first light-emitting element, a second light-emitting element, a third light-emitting element, a first color conversion structure, a first scattering structure and a second scattering structure. Openings of the bank layer are arranged in multiple rows and columns along a row direction and a column direction. The first, second and third light-emitting elements are respectively located in the first, second and third openings of the bank layer. The first color conversion structure is disposed in the first opening. The first scattering structure is disposed in the second opening. The second scattering structure is disposed in the third opening. The first color conversion structure and the first scattering structure are arranged in a first direction. The first scattering structure and the second scattering structure are arranged in a second direction. The first direction, the second direction, the row direction and the column direction are intersected with each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">112:接墊組</p>
        <p type="p">112a、112b:接墊</p>
        <p type="p">112M-1、112M-2、112M-3:主要接墊組</p>
        <p type="p">112R-1、112R-2、112R-3:備用接墊組</p>
        <p type="p">120:堤岸層</p>
        <p type="p">121、122、123、124、125、126:開口</p>
        <p type="p">131:第一發光元件</p>
        <p type="p">132:第二發光元件</p>
        <p type="p">133:第三發光元件</p>
        <p type="p">141:第一色轉換結構</p>
        <p type="p">142:第二色轉換結構</p>
        <p type="p">151:第一散射結構</p>
        <p type="p">152:第二散射結構</p>
        <p type="p">161:第一透明結構</p>
        <p type="p">162:第二透明結構</p>
        <p type="p">C&lt;sub&gt;n&lt;/sub&gt;、C&lt;sub&gt;n+1&lt;/sub&gt;、C&lt;sub&gt;n+2&lt;/sub&gt;:行</p>
        <p type="p">d1:第一方向</p>
        <p type="p">d2:第二方向</p>
        <p type="p">PX:畫素單元</p>
        <p type="p">R&lt;sub&gt;m&lt;/sub&gt;、R&lt;sub&gt;m+1&lt;/sub&gt;:列</p>
        <p type="p">x:列方向</p>
        <p type="p">y:行方向</p>
        <p type="p">I-I’、II-II’:剖線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="776px" img-content="tif" inline="yes" orientation="portrait" width="701px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622126</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145521</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C08F8/30</main-classification>
        <further-classification edition="200601120241220B">C08F212/08</further-classification>
        <further-classification edition="200601120241220B">C08F222/08</further-classification>
        <further-classification edition="200601120241220B">C09D125/14</further-classification>
        <further-classification edition="200601120241220B">C09D135/06</further-classification>
        <further-classification edition="200601120241220B">C09D5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐崇桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHUNG-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊文斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, WEN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史習岡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, HSI-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭煜芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHA-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>水性樹脂、水性塗料、與防蝕塗層</chinese-title>
        <english-title>AQUEOUS RESIN, AQUEOUS COATING MATERIAL, AND CORROSION RESISTANT COATING LAYER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供水性樹脂，其係芳香酸與鹼中和的開環中間產物反應所形成的銨鹽。所述開環中間產物係含馬來酸酐的共聚物與三級胺醇進行開環反應而成。所述含馬來酸酐的共聚物的化學結構為        &lt;img align="absmiddle" height="140px" width="248px" file="ed10032.JPG" alt="ed10032.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，其中R        &lt;sup&gt;1&lt;/sup&gt;為H或CH        &lt;sub&gt;3&lt;/sub&gt;，R        &lt;sup&gt;2&lt;/sup&gt;為H、CH        &lt;sub&gt;3&lt;/sub&gt;、或C        &lt;sub&gt;6&lt;/sub&gt;H        &lt;sub&gt;5&lt;/sub&gt;，m:n=1:3至3:1，且n=4至20。所述三級胺醇的化學結構為        &lt;img align="absmiddle" height="116px" width="161px" file="ed10033.JPG" alt="ed10033.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，R        &lt;sup&gt;3&lt;/sup&gt;為C        &lt;sub&gt;1-10&lt;/sub&gt;的烷撐基，R        &lt;sup&gt;4&lt;/sup&gt;為H、C        &lt;sub&gt;1-10&lt;/sub&gt;的烷基、或C        &lt;sub&gt;6-12&lt;/sub&gt;的芳香基，且R        &lt;sup&gt;5&lt;/sup&gt;及R        &lt;sup&gt;6&lt;/sup&gt;各自獨立地為C        &lt;sub&gt;1-10&lt;/sub&gt;的烷基或C        &lt;sub&gt;6-12&lt;/sub&gt;的芳香基。芳香酸的化學結構為        &lt;img align="absmiddle" height="137px" width="249px" file="ed10034.JPG" alt="ed10034.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，R        &lt;sup&gt;7&lt;/sup&gt;為H、C        &lt;sub&gt;1-10&lt;/sub&gt;的烷基、或C        &lt;sub&gt;6-12&lt;/sub&gt;的芳香基，且R        &lt;sup&gt;8&lt;/sup&gt;係C        &lt;sub&gt;1-5&lt;/sub&gt;的烷撐基或        &lt;img align="absmiddle" height="57px" width="117px" file="ed10035.JPG" alt="ed10035.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aqueous resin is provided. The aqueous resin is an ammonium salt formed by reacting an aromatic acid with an alkaline compound neutralized ring-opening intermediate compound. The ring-opening intermediate compound is formed by performing a ring-opening reaction of a copolymer (containing maleic anhydride) by a tertiary amino alcohol. The copolymer containing maleic anhydride has a chemical structure of        &lt;img align="absmiddle" height="137px" width="242px" file="ed10036.JPG" alt="ed10036.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, R        &lt;sup&gt;1&lt;/sup&gt;is H or C H        &lt;sub&gt;3&lt;/sub&gt;, R        &lt;sup&gt;2&lt;/sup&gt;is H, CH        &lt;sub&gt;3&lt;/sub&gt;, or C        &lt;sub&gt;6&lt;/sub&gt;H        &lt;sub&gt;5&lt;/sub&gt;, m:n=1:3 to 3:1, and n=4 to 20. The tertiary amino alcohol has a chemical structure of        &lt;img align="absmiddle" height="118px" width="145px" file="ed10037.JPG" alt="ed10037.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, R        &lt;sup&gt;3&lt;/sup&gt;is C        &lt;sub&gt;1-10&lt;/sub&gt;alkylene group,R        &lt;sup&gt;4&lt;/sup&gt;is H, C        &lt;sub&gt;1-10&lt;/sub&gt;alkyl group, or C        &lt;sub&gt;6-12&lt;/sub&gt;aromatic group, and each of R        &lt;sup&gt;5&lt;/sup&gt;and R        &lt;sup&gt;6&lt;/sup&gt;is independently of C        &lt;sub&gt;1-10&lt;/sub&gt;alkyl group or C        &lt;sub&gt;6-12&lt;/sub&gt;aromatic group. The aromatic acid has a chemical structure of        &lt;img align="absmiddle" height="137px" width="246px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, R        &lt;sup&gt;7&lt;/sup&gt;is H, C        &lt;sub&gt;1-10&lt;/sub&gt;alkyl group, or C        &lt;sub&gt;6-12&lt;/sub&gt;aromatic group, and R        &lt;sup&gt;8&lt;/sup&gt;is C        &lt;sub&gt;1-5&lt;/sub&gt;alkylene group or        &lt;img align="absmiddle" height="55px" width="122px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623442</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145522</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250731B">H10D84/82</main-classification>
        <further-classification edition="202501120250731B">H10D30/64</further-classification>
        <further-classification edition="202501120250731B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒振東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZOU, CHEN-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴云凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳姿宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖志成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIH-CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體結構包含基底、至少一磊晶層、深溝槽隔離結構、圖案化隔離層以及導電層。基底具有第一導電型，至少一磊晶層設置於基底上方，深溝槽隔離結構貫穿至少一磊晶層和基底，且圍繞第一區，深溝槽隔離結構以外包含第二區。圖案化隔離層設置於基底之底表面，具有開口暴露出第二區的基底。導電層設置於圖案化隔離層下方，且經由開口電連接至基底。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes a base, at least an epitaxial layer, a deep trench isolation structure, a patterned isolation layer and a conductive layer. The base has a first conductivity type and at least the epitaxial layer is disposed on the base. The deep trench isolation structure penetrates at least the epitaxial layer and the base and surrounds a first area, and a second area is located outside the deep trench isolation structure. The patterned isolation layer is disposed on a bottom surface of the base and has an opening to expose the base in the second area. The conductive layer is disposed under the patterned isolation layer and electrically connected to the base through the opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">100-1:第一區</p>
        <p type="p">100-2:第二區</p>
        <p type="p">101:基底</p>
        <p type="p">101F:第一表面</p>
        <p type="p">101B:第二表面</p>
        <p type="p">103:磊晶層</p>
        <p type="p">103-1:第一磊晶層</p>
        <p type="p">103-2:第二磊晶層</p>
        <p type="p">105:深溝槽隔離結構</p>
        <p type="p">107:圖案化隔離層</p>
        <p type="p">108:開口</p>
        <p type="p">109:導電層</p>
        <p type="p">111:N-LDMOS電晶體</p>
        <p type="p">113:P-LDMOS電晶體</p>
        <p type="p">115:CMOS電晶體</p>
        <p type="p">117:VDMOS電晶體</p>
        <p type="p">121、144:介電層</p>
        <p type="p">122:閘極</p>
        <p type="p">123、145:場板</p>
        <p type="p">125:基體區</p>
        <p type="p">127:源極區</p>
        <p type="p">141:溝槽</p>
        <p type="p">SB:單塊基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="696px" img-content="tif" inline="yes" orientation="portrait" width="1010px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623092</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145524</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250304B">H01Q1/36</main-classification>
        <further-classification edition="201501120250304B">H01Q5/20</further-classification>
        <further-classification edition="200601120250304B">H01Q1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啓碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON NEWEB CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳君愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何文彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, WEN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳靜雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>天線結構</chinese-title>
        <english-title>ANTENNA STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種天線結構，包括：一接地元件、一第一輻射部、一第二輻射部、一第三輻射部、一非導體支撐元件，以及一金屬機構件。第一輻射部具有一饋入點。第二輻射部係耦接至接地元件上之一第一接地點，其中第二輻射部係鄰近於第一輻射部。第三輻射部係耦接至接地元件上之一第二接地點，其中第三輻射部係鄰近於第一輻射部。第一輻射部係位於第二輻射部和第三輻射部之間。接地元件、第一輻射部、第二輻射部，以及第三輻射部皆設置於非導體支撐元件上。金屬機構件具有一槽孔，其中金屬機構件係鄰近於第一輻射部、第二輻射部，以及第三輻射部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna structure includes a ground element, a first radiation element, a second radiation element, a third radiation element, a nonconductive support element, and a metal mechanism element. The first radiation element has a feeding point. The second radiation element is coupled to a first grounding point on the ground element. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to a second grounding point on the ground element. The third radiation element is adjacent to the first radiation element. The first radiation element is positioned between the second radiation element and the third radiation element. The ground element, the first radiation element, the second radiation element, and the third radiation element are disposed on the nonconductive support element. The metal mechanism element has a slot. The metal mechanism element is adjacent to the first radiation element, the second radiation element, and the third radiation element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:天線結構</p>
        <p type="p">110:接地元件</p>
        <p type="p">120:第一輻射部</p>
        <p type="p">121:第一輻射部之第一端</p>
        <p type="p">122:第一輻射部之第二端</p>
        <p type="p">124:第一輻射部之較寬部份</p>
        <p type="p">125:第一輻射部之較窄部份</p>
        <p type="p">130:第二輻射部</p>
        <p type="p">131:第二輻射部之第一端</p>
        <p type="p">132:第二輻射部之第二端</p>
        <p type="p">140:第三輻射部</p>
        <p type="p">141:第三輻射部之第一端</p>
        <p type="p">142:第三輻射部之第二端</p>
        <p type="p">144:第三輻射部之傾斜部份</p>
        <p type="p">145:第三輻射部之延伸部份</p>
        <p type="p">170:非導體支撐元件</p>
        <p type="p">180:金屬機構件</p>
        <p type="p">181:槽孔之第一閉口端</p>
        <p type="p">182:槽孔之第二閉口端</p>
        <p type="p">185:槽孔</p>
        <p type="p">190:信號源</p>
        <p type="p">FP:饋入點</p>
        <p type="p">GC1:第一耦合間隙</p>
        <p type="p">GC2:第二耦合間隙</p>
        <p type="p">GC3:第三耦合間隙</p>
        <p type="p">GC4:第四耦合間隙</p>
        <p type="p">GP1:第一接地點</p>
        <p type="p">GP2:第二接地點</p>
        <p type="p">L1,L2,L3,LS:長度</p>
        <p type="p">VSS:接地電位</p>
        <p type="p">W1,W2:寬度</p>
        <p type="p">θ:夾角</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="627px" img-content="tif" inline="yes" orientation="portrait" width="968px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623336</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145528</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">H05K7/14</main-classification>
        <further-classification edition="200601120250123B">H05K5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯穎科技服務股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIWYNN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高菁穗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, JING-SUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊詠媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YONG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子組件及電子設備</chinese-title>
        <english-title>ELECTRONIC ASSEMBLY AND ELECTRONIC APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子組件，用於安裝於一電子設備的一殼體。電子組件包含一電子裝置、一限位件以及一固定件。固定件包含一止擋結構，其中止擋結構自固定件的一表面垂直於第一方向突起。當電子裝置沿著第一方向被安裝於殼體並處於一固定位置，限位件部分嵌設於電子裝置中且部分嵌設於殼體中，且止擋結構止擋電子裝置沿著相反於第一方向的一第二方向脫離殼體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic assembly for being installed on a housing of an electronic apparatus is provided. The electronic assembly includes an electronic device, a limiting component and a fixing component. The fixing component includes a stop structure, wherein the stop structure protrudes from a surface of the fixing component perpendicularly to a first direction. When the electronic device is installed on the housing along the first direction and is in a fixed position, the limiting component is partially embedded in the electronic device and partially embedded in the housing, and the stop structure stops the electronic device from leaving the housing along a second direction opposite to the first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:電子組件</p>
        <p type="p">20:殼體</p>
        <p type="p">30:電子裝置</p>
        <p type="p">32:限位件</p>
        <p type="p">34:固定件</p>
        <p type="p">210:背板</p>
        <p type="p">212:頂板</p>
        <p type="p">214:底板</p>
        <p type="p">216:側板</p>
        <p type="p">222:第二卡合結構</p>
        <p type="p">348:活動臂</p>
        <p type="p">350:解掣部</p>
        <p type="p">354:止擋結構</p>
        <p type="p">356:導引部</p>
        <p type="p">358:止擋部</p>
        <p type="p">362:第一卡合結構</p>
        <p type="p">A,A',X,Y,Z:方向</p>
        <p type="p">F1,F2:力</p>
        <p type="p">S1:第一表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="737px" img-content="tif" inline="yes" orientation="portrait" width="854px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623392</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145535</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250213B">H10D30/60</main-classification>
        <further-classification edition="202501120250213B">H10D84/03</further-classification>
        <further-classification edition="202501120250213B">H10D62/60</further-classification>
        <further-classification edition="202501120250213B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢磊科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EPISIL TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉原良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUAN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宜蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張元洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUAN-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體元件及其製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可抑制短通道效應與降低熱載子問題的半導體元件，包含一碳化矽磊晶基材、兩個阱區、一接面場效區、兩個源極、兩個輕摻雜區、兩個重摻雜區、一閘極，及一汲極電極。特別的是，該兩個輕摻雜區對應該兩個源極設置，每一個輕摻雜區具有自該碳化矽磊晶基材的頂面向下並位於相應的該源極的側邊的一第一輕摻雜層，及一位於該第一輕雜層下方，並自相應該側邊的下半部延伸至該源極的底部的第二輕摻雜層，且該第二輕摻雜層於對應該源極的側邊的寬度大於該第一輕摻雜層，該接面場效區自該碳化矽磊晶基材表面向下形成，位於該兩個阱區之間且不與該兩個阱區相接觸。此外，本發明還提供該半導體元件的製作方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:碳化矽磊晶基材</p>
        <p type="p">21:碳化矽基材</p>
        <p type="p">22:碳化矽磊晶膜</p>
        <p type="p">23:頂面</p>
        <p type="p">24:底面</p>
        <p type="p">W:阱區</p>
        <p type="p">J&lt;sub&gt;FET&lt;/sub&gt;:接面場效區</p>
        <p type="p">S:源極</p>
        <p type="p">3:輕摻雜區</p>
        <p type="p">31:第一輕摻雜層</p>
        <p type="p">32:第二輕摻雜層</p>
        <p type="p">HW:重摻雜區</p>
        <p type="p">G:閘極</p>
        <p type="p">4:絕緣單元</p>
        <p type="p">41:第一絕緣層</p>
        <p type="p">42:第二絕緣層</p>
        <p type="p">5:導電單元</p>
        <p type="p">51:歐姆接觸層</p>
        <p type="p">52:導電層</p>
        <p type="p">6:絕緣保護單元</p>
        <p type="p">7:電連接單元</p>
        <p type="p">71:導電結構</p>
        <p type="p">72:電連接線路</p>
        <p type="p">D:汲極電極</p>
        <p type="p">D11:金屬矽化物層</p>
        <p type="p">D12:金屬導電層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="617px" img-content="tif" inline="yes" orientation="portrait" width="807px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621751</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145544</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241219B">A61L27/36</main-classification>
        <further-classification edition="200601120241219B">A61L27/42</further-classification>
        <further-classification edition="200601120241219B">A61L27/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科科生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEKE MEDTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江定鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉立陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何宇晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, YU-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯勝元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, SHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖時雍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SHIH-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>補骨複合材料及其製造方法</chinese-title>
        <english-title>COMPOSITE MATERIAL FOR BONE REPAIR AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種補骨複合材料，應用於一骨科手術以及一牙科手術中一使用者的傷口修復中，用以促進該使用者的傷口癒合，誘導該使用者的一自體骨細胞生長，以及誘導該使用者的一移植骨與該自體骨細胞融合，該補骨複合材料包含高分子聚合物、骨粉以及外泌體。相較於習知技術，本發明所提供之補骨複合材料具有較佳的骨誘導性和相容性，並且可以穩定的生物因子釋放，進而促進骨頭的修復以及再生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite material for bone repair is used in an orthopedic surgery and a dental surgery for wound repair in a user to promote wound healing, to induce growth of an autogenous osteoblast in the user, and to induce fusion of a grafted bone with the autogenous osteoblast in the user. The composite material for bone repair comprises a polymer, a bone meal, and an exosome. Compared with the prior art, the invention provides the composite material for bone repair have better osteoconductivity and compatibility, and can stabilize the release of biofactors to promote bone repair and regeneration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:補骨複合材料</p>
        <p type="p">11:高分子聚合物</p>
        <p type="p">12:骨粉</p>
        <p type="p">13:外泌體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="749px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622405</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145545</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250205B">F16K31/60</main-classification>
        <further-classification edition="200601120250205B">F16K35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東巍企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAWNWAY ENTERPRISE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳國樟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有安全把手的水龍頭</chinese-title>
        <english-title>FAUCET WITH SAFETY HANDLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水龍頭，包括一轉動頭、用以帶動該轉動頭轉動的一安全把手、及位於該轉動頭內的一止動件。該安全把手包括一把手、設置在該把手內的一活動鎖件與一壓縮彈簧、及螺合於該把手的一頂端的一螺帽。其中，該活動鎖件包括抵靠於該螺帽的一抵塊、從該抵塊往上延伸的一按壓桿、從該抵塊往下延伸且穿過該壓縮彈簧的一上桿、及從該上桿往下延伸的一下桿。該按壓桿的一按鈕係從該螺帽的一緃向貫穿孔凸出到外面。該下桿的一限制部平常是位於該止動件的一限制孔內，只有在該按鈕被按下時才脫離開該限制孔，以使該把手能被轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A faucet comprising a rotating head, a safety handle for driving the rotating head to rotate, and a stopping element located inside the rotating head. The safety handle includes a handle, a movable locking element and a compression spring disposed inside the handle, along with a nut screwed onto a top end of the handle, wherein the movable locking element includes a block that abuts against the nut, a pressing lever extending upward from the block, an upper rod extending downward from the block and passing through the compression spring, and a bottom rod extending downward from the upper rod. A button of the pressing lever protrudes outward through a hole in the nut. A restricting portion of the bottom rod is normally located within a limiting hole of the stopping element, and only when the button is pressed does it disengage from the limiting hole, allowing the handle to be rotated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:座體</p>
        <p type="p">13:控制閥</p>
        <p type="p">131:閥體</p>
        <p type="p">131a:前段部</p>
        <p type="p">131b:後段部</p>
        <p type="p">132:閥桿</p>
        <p type="p">2:轉動組件</p>
        <p type="p">21:止動件</p>
        <p type="p">210:螺栓</p>
        <p type="p">211:環座</p>
        <p type="p">212:圓筒</p>
        <p type="p">213:限制孔</p>
        <p type="p">214:第一窄通道</p>
        <p type="p">215:第二窄通道</p>
        <p type="p">22:轉動頭</p>
        <p type="p">23:螺栓</p>
        <p type="p">251:第二螺孔</p>
        <p type="p">3:安全把手</p>
        <p type="p">31:把手</p>
        <p type="p">311:上段部</p>
        <p type="p">312:下段部</p>
        <p type="p">312a:外螺紋段</p>
        <p type="p">314:螺孔</p>
        <p type="p">32:活動鎖件</p>
        <p type="p">321:抵塊</p>
        <p type="p">322:按壓桿</p>
        <p type="p">322a:按鈕</p>
        <p type="p">323:上桿</p>
        <p type="p">324:下桿</p>
        <p type="p">324a:桿部</p>
        <p type="p">324b:頸部</p>
        <p type="p">324c:限制部</p>
        <p type="p">33:螺帽</p>
        <p type="p">331:帽體</p>
        <p type="p">332:外螺紋段</p>
        <p type="p">333:緃向貫穿孔</p>
        <p type="p">34:壓縮彈簧</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="947px" img-content="tif" inline="yes" orientation="portrait" width="735px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623208</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145556</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03M1/66</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創意電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBAL UNICHIP CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪鼎豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡惠雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HUI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>數位類比轉換器</chinese-title>
        <english-title>DIGITAL TO ANALOG CONVERTER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數位類比轉換器包含多個轉換電流單元、補償電流單元以及第一放大器。轉換電流單元的每一者包含第一差動開關對、第一疊接電晶體及第一電流源電晶體。第一差動開關對受控於一第一控制訊號及一第一反向控制訊號。第一疊接電晶體及第一電流源電晶體彼此串聯且與第一差動開關對耦接。補償電流單元包含第二疊接電晶體。第一放大器的輸入端與第二疊接電晶體的源極耦接，第一放大器的輸出端與第二疊接電晶體的閘極與第一疊接電晶體的閘極的每一者耦接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A digital to analog converter includes multiple switching current cells, an offset current cell, and a first amplifier. Each of the switching current cells includes a first differential switch pair, a first stack transistor and a first current source transistor. The first differential switch pair is controlled by a first control signal and a first inverted control signal. The first stack transistor and the first current source transistor are coupled in series and are coupled to the first differential switch pair. The offset current cell includes a second stack transistor. An input terminal of the first amplifier is coupled to a source of the second stack transistor. An output terminal of the first amplifier is coupled to each of a gate of the second stack transistor and a gate of the first stack transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:數位類比轉換器</p>
        <p type="p">110:轉換電流單元</p>
        <p type="p">111、121:差動開關對</p>
        <p type="p">120:補償電流單元</p>
        <p type="p">130:前置處理裝置</p>
        <p type="p">140:電流源電路</p>
        <p type="p">150:數位控制器</p>
        <p type="p">Qj、B:控制訊號</p>
        <p type="p">
        &lt;img align="absmiddle" height="33px" width="25px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"&gt;
        &lt;/img&gt;、&lt;img align="absmiddle" height="23px" width="18px" file="d10002.TIF" alt="其他非圖式ed10002.png" img-content="character" orientation="portrait" inline="no" giffile="ed10002.png"/&gt;:反向控制訊號</p>
        <p type="p">M3、M7:疊接電晶體</p>
        <p type="p">M4、M8:電流源電晶體</p>
        <p type="p">M1、M2、M5、M6:開關</p>
        <p type="p">Vb:偏壓信號</p>
        <p type="p">131:放大器電路</p>
        <p type="p">Vsh:電壓信號</p>
        <p type="p">DS:數位訊號</p>
        <p type="p">141:電流源</p>
        <p type="p">142:閘極偏壓電路</p>
        <p type="p">n1、n2:輸出端</p>
        <p type="p">n3~n5:節點</p>
        <p type="p">L1:調節環路</p>
        <p type="p">VDD:電源電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="709px" img-content="tif" inline="yes" orientation="portrait" width="1002px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622208</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145561</doc-number>
          <kind></kind>
          <date>113/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C09K5/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳穗祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳穗祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無機相變材料及有機相變材料之融合製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">相變材料可分為有機相變材料及無機相變材料，有機相變材料常使用碳原子數為18~26的脂肪烴、碳原子數為12~18的脂肪醇等，其缺點是導熱不佳及潛熱值低；無機相變材料常使用水加上硫酸鈉等鹽類，其缺點是有較大之過冷度及多次吸放熱後性能降低，有機相變材料及無機相變材料兩者很難融合。</p>
        <p type="p">本創作使用聚乙二醇、聚氧丙烯、12烷苯磺酸、甜菜鹵、12烷基硫酸鈉、酒精、甲醇組成的組中之一組材料或單獨材料，打破有機相變材料及無機相變材料之離子鍵，使之能互相融合，如此可改善有機相變材料導熱不佳及潛熱值低之缺點，及改善無機相變材料多次使用後結晶再熔化的反復過程，致各元素產生分離，而降低吸放熱性能及產生高過冷度之現象。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">101:無機相變材料</p>
        <p type="p">102:聚乙二醇、聚氧丙烯、12烷苯磺酸、甜菜鹵、12烷基硫酸鈉、酒精、甲醇組成的組中之一組材料</p>
        <p type="p">103:有機相變材料</p>
        <p type="p">104:融合相變材料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="495px" img-content="tif" inline="yes" orientation="portrait" width="714px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621650</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145563</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241205B">A61C7/08</main-classification>
        <further-classification edition="200601120241205B">A61C7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒服美生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳美光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳家寅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可防止後牙向外擴張之隱形牙套製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種隱形牙套之後牙防止向外擴張方法，具體爲：首先建立真實牙弓模型單元，構成一假想之真實牙弓曲線；接着針對真實牙弓模型單元估算前牙區的理想內縮位置，產生一理想牙弓模型單元，並構成一假想之理想牙弓曲線；然後將前述二牙弓曲線相互疊合，計算後牙區的牙弓曲線偏差值；最後依牙弓曲線偏差值對理想牙弓曲線之後牙區補償一朝向內側彎曲之預縮距離，產生一修正牙弓曲線修正理想牙弓模型，產生一修正牙弓模型單元製作隱形牙套，使得隱形牙套的前牙區及後牙區一同往牙弓中心方向彎曲預縮，令矯正後的後牙維持在理想牙弓模型單元的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S140:步驟流程</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="879px" img-content="tif" inline="yes" orientation="portrait" width="687px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621890</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145569</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241209B">B29C53/02</main-classification>
        <further-classification edition="200601120241209B">B29C53/42</further-classification>
        <further-classification edition="200601120241209B">B29C59/02</further-classification>
        <further-classification edition="200601120241209B">B01D39/14</further-classification>
        <further-classification edition="200601120241209B">C12N11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海絲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HYFIBER TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂文裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, WEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>濾材及其製法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多孔體及其製法。該多孔體包含一壁體、數突肋，以及數孔洞。該壁體沿一第一方向長向延伸，並沿橫交該第一方向的一第二方向彎曲延伸而呈開環狀或閉環狀。該壁體包括內外相反的一第一表面與一第二表面，以及兩個在該第二方向上分別位於兩側的側端面。每一該側端面連接於該第一表面與該第二表面間。該等突肋在該第一方向上彼此間隔排列地形成於該第一表面及該第二表面的其中至少一者。該等孔洞形成於該壁體與該等突肋。本發明多孔體因為包括有該等突肋及該等側端面，因此本發明能具有更好的過濾效果或微生物承載效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:多孔體</p>
        <p type="p">21:壁體</p>
        <p type="p">211:第一壁部</p>
        <p type="p">212:第二壁部</p>
        <p type="p">213:第一表面</p>
        <p type="p">214:第二表面</p>
        <p type="p">215:側端面</p>
        <p type="p">22:突肋</p>
        <p type="p">221:第一肋部</p>
        <p type="p">23:孔洞</p>
        <p type="p">24:溝槽</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="770px" img-content="tif" inline="yes" orientation="portrait" width="612px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622389</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145570</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250212B">F16C11/04</main-classification>
        <further-classification edition="200601120250212B">F16H35/18</further-classification>
        <further-classification edition="200601120250212B">G06F1/16</further-classification>
        <further-classification edition="200601120250212B">H05K7/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鑫禾科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINHER TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, CHIH-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴南海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, NAN-HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>樞鈕器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樞鈕器，包含一基座，一設於該基座的第一軸，一設於該基座並嚙合該第一斜齒輪的第二斜齒輪，一設於該基座並與該第一軸交錯配置的第二軸。該第一軸設有一第一斜齒輪，該第二軸設有一嚙合該第二斜齒輪的第三斜齒輪，一選擇性接合該第三斜齒輪的傳動件，及一連接該傳動件的彈性件，該彈性件輔助該傳動件與該第三斜齒輪接合。該樞鈕器具有一第一狀態及一第二狀態，於該第一狀態時該第一軸轉動並帶動該第三斜齒輪，且該第三斜齒輪原地空轉。於該第二狀態時第三斜齒輪與該傳動件接合且該第一軸與該第二軸形成同動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:樞鈕器</p>
        <p type="p">21:基座</p>
        <p type="p">213:第二凹槽</p>
        <p type="p">214:第二凸塊</p>
        <p type="p">22:第一軸</p>
        <p type="p">221:第一斜齒輪</p>
        <p type="p">222:第一止擋塊</p>
        <p type="p">223:第一扭力組</p>
        <p type="p">23:第二斜齒輪</p>
        <p type="p">241:第三斜齒輪</p>
        <p type="p">251:第三止擋塊</p>
        <p type="p">253:第二扭力組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="913px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622767</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145571</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250303B">G06F16/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張明淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>資料探勘方法及用於資料探勘的電腦系統</chinese-title>
        <english-title>DATA MINING METHOD AND COMPUTER SYSTEM FOR DATA MINING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資料探勘方法，包含有萃取一資料表單之一資料表之一主特徵欄位；根據該資料表之該主特徵欄位之一變異數以及一獨特值比例，決定對應於該資料表之一評估測度值；以及根據該資料表之該評估測度值，決定該資料表之一資料探勘價值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data mining method includes extracting a main character column of a data sheet of a data list; determining an evaluation measurement value of the data sheet according to a variance and an outlier ratio of the main character column of the data sheet; and determining a data mining value of the data sheet according to the evaluation measurement value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:資料探勘流程</p>
        <p type="p">202-210:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="789px" img-content="tif" inline="yes" orientation="portrait" width="509px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623466</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145572</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250310B">H10F71/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寀祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, TSAI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昌鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, CHANG-SIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳以德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YII-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪政源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>堆疊太陽能電池及其製造方法</chinese-title>
        <english-title>STACKED SOLAR CELL AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種堆疊太陽能電池及其製造方法。此方法包含提供矽基板；進行遠程電漿原子層沉積製程，以形成穿隧氧化矽薄膜在矽基板上，其中穿隧氧化矽薄膜的厚度為1 nm至3 nm；以及形成鈣鈦礦層在穿隧氧化矽薄膜上。藉由穿隧氧化矽薄膜，可降低電漿對矽基板造成損害，並降低矽基板表面的缺陷密度，且可提升堆疊太陽能電池的光電轉換效率及穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stacked solar cell and a method of forming the same are provided. The method includes following steps: a silicon substrate is provided; a remote plasma atomic layer deposition is performed to form a tunnel silicon oxide thin film on the silicon substrate, in which a thickness of the tunnel silicon oxide thin film is 1 nm to 3 nm; and a perovskite layer is formed on the tunnel silicon oxide thin film. Thus, the tunnel silicon oxide thin film can decrease the damage of plasma on the silicon substrate, a defect density of a surface of the silicon substrate can be reduced, and a photoelectric conversion efficiency and stability of the stacked solar cell can be increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">210,220,230,240,250,260:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="658px" img-content="tif" inline="yes" orientation="portrait" width="898px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622702</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145573</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F3/01</main-classification>
        <further-classification edition="201401120250303B">A63F13/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紅然股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYB STUDIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃維韶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-SHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊惠美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HUEI-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉建汎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIEN-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PO-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊景文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃頊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游子樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, TZU-LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周螢瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫大龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種使用互動裝置的互動式展演系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種使用一互動裝置的互動式展演系統，應用於一展演場景，包括：一伺服器，管理該展演場景的複數個背景資料，選擇並讀取該複數個背景資料中的一者為一第一背景，生成投影該第一背景的一第一指示；至少一投影裝置，通訊連接該伺服器，從該伺服器接收該第一指示並據以進行投影該第一背景；一控制裝置，與該伺服器和該互動裝置通訊連接，從該伺服器接收該第一指示並據以產生至少一互動物件資料，傳送該至少一互動物件資料至該互動裝置；其中，該互動裝置接收該至少一互動物件資料並據以在一使用者的視野內顯示至少一虛擬互動物件，並偵測該使用者與該至少一虛擬互動物件進行互動的一手勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:互動式展演系統</p>
        <p type="p">11:伺服器</p>
        <p type="p">12:投影裝置</p>
        <p type="p">13:控制裝置</p>
        <p type="p">14:聲音裝置</p>
        <p type="p">15:燈光裝置</p>
        <p type="p">16:機械裝置</p>
        <p type="p">17:感應器</p>
        <p type="p">18:互動裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="744px" img-content="tif" inline="yes" orientation="portrait" width="977px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622832</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145574</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q10/10</main-classification>
        <further-classification edition="201901120250303B">G06F16/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兆豐國際商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪聖樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林暉鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林銘嬋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MING-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏錩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可自選欄位之互動式報表生成系統及方法</chinese-title>
        <english-title>INTERACTIVE REPORT GENERATION SYSTEM AND METHOD WITH OPTIONAL FIELDS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可自選欄位之互動式報表生成系統包含資料庫伺服器及主機伺服器。資料庫伺服器具有資料表，每個資料表具有表格名稱及多個資料欄位。主機伺服器包含通訊單元、程式介面單元及處理器。程式介面單元具有互動式介面，互動式介面包含表列區及指令生成區。處理器電連接程式介面單元及通訊單元，用以將這些資料表之表格名稱與資料欄位分別顯示於表列區上，判斷表列區內之資料欄位是否部分被拖曳至指令生成區內，若是，將此資料欄位自動生成SQL語法，以及依據SQL語法，製作出資料報表，並帶入對應資料欄位之資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interactive report generation system with optional fields includes a database server and a host server. The database server is provided with data tables and each of the data table includes multiple data fields. The host server includes a communication unit, a program interface unit and a processor. The program interface unit is provided with an interactive interface including a list area and a command generation area. The processor is electrically connected to the program interface unit and the communication unit, and used to display the table names and data fields of these data tables on the table list area, and determined whether a part of the data fields in the table list area has been dragged to the command generation area. If so, SQL syntax is automatically generated for this data field, and data report based on the SQL syntax is created, and data for the corresponding data fields are sent thereto.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:可自選欄位之互動式報表生成系統</p>
        <p type="p">100:資料庫伺服器</p>
        <p type="p">110:資料表</p>
        <p type="p">200:主機伺服器</p>
        <p type="p">210:通訊單元</p>
        <p type="p">220:程式介面單元</p>
        <p type="p">240:報表製作模組</p>
        <p type="p">250:圖表製作模組</p>
        <p type="p">260:記憶單元</p>
        <p type="p">270:處理器</p>
        <p type="p">300:終端裝置</p>
        <p type="p">N:網路架構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="608px" img-content="tif" inline="yes" orientation="portrait" width="1004px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622687</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145575</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241227B">G06F1/16</main-classification>
        <further-classification edition="200601120241227B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施宥呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李武晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒治恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSOU, CHIH-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>筆記型電腦的觸控板</chinese-title>
        <english-title>TOUCHPAD OF LAPTOP COMPUTER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種筆記型電腦的觸控板，包括觸控板模組、一對連動板、一對支撐桿以及抵壓件。觸控板模組可移動地設置於殼體，觸控板模組具有開關元件。各連動板的第一側緣樞接觸控板模組。支撐桿設置於殼體且分別對應連動板，連動板可樞轉地抵靠在支撐桿上。抵壓件樞接各連動板的第二側緣且位在連動板之間，以使連動板與抵壓件形成連桿機構，第一側緣與第二側緣隔著支撐桿而彼此相對。當觸控板模組被按壓時，觸控板模組驅動各連動板相對於支撐桿樞轉，以使連動板的第二側緣與開關元件彼此移近直至抵壓件觸發開關元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touchpad of laptop computer including a touchpad module, a pair of linking plates, a pair of supporting rods, and a pressing member is provided. The touchpad module movably disposed onto a housing of the laptop computer has a switch element. Each linking plate has a first side edge pivoted to the touchpad module. The supporting rods are disposed on the housing and corresponding to the linking plates respectively, and the linking plate leaning against the supporting rod and pivots relative to the supporting rod as a fulcrum. The pressing member pivoted to a second side edge of each linking plate is located between the linking plates, and the linking plates are formed a linkage mechanism with the pressing member, wherein the first side edge and the second side edge are opposite to each other across the supporting rod.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:觸控板</p>
        <p type="p">110:觸控板模組</p>
        <p type="p">120:連動板</p>
        <p type="p">130:支撐桿</p>
        <p type="p">140:抵壓件</p>
        <p type="p">150:第一彈性件</p>
        <p type="p">160:卡扣組件</p>
        <p type="p">170:第二彈性件</p>
        <p type="p">200:殼體</p>
        <p type="p">210:底殼</p>
        <p type="p">211:凹陷</p>
        <p type="p">213:凸柱</p>
        <p type="p">P3:凸柱</p>
        <p type="p">X-Y-Z:直角座標</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="841px" img-content="tif" inline="yes" orientation="portrait" width="722px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622770</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145577</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250512B">G06F16/53</main-classification>
        <further-classification edition="201901120250512B">G06F16/58</further-classification>
        <further-classification edition="200601120250512B">F16B2/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江建翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHINE-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>卡勾對搜尋配對方法</chinese-title>
        <english-title>HOOK PAIR SEARCH AND PAIRING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種卡勾對搜尋配對方法包含根據一組卡勾參數於多數個卡勾面中得到一主面候選面，根據主面候選面建立包含至少一對應於主面候選面的從面候選面的虛擬正立方體，根據主面候選面及至少一從面候選面之間的對應關係產生至少一從面候選面中得以與主面候選面配對之一組從面候選面，及由該組從面候選面選出一從面候選面，以與該主面候選面進行卡勾配對。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hook pair search and matching method includes obtaining a candidate main surface from a plurality of hook surfaces, creating a virtual cube including at least one candidate secondary surface corresponding to the candidate main surface according to the candidate main surface, generating a set of candidate secondary surfaces from the at least one candidate secondary surface that can be paired with the candidate main surface according to the corresponding relationship between the candidate main surface and at least one candidate secondary surface, and selecting a s candidate secondary surface from the set of candidate secondary surfaces to be matched with the candidate main surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:方法</p>
        <p type="p">S301-S307:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="904px" img-content="tif" inline="yes" orientation="portrait" width="606px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623230</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145578</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L41/14</main-classification>
        <further-classification edition="200901120250303B">H04W24/02</further-classification>
        <further-classification edition="202301120250303B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>啓碁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON NEWEB CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊才</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIUNN-TSAIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無線區域網路之數位孿生方法、運算裝置及非暫態電腦可讀取儲存媒介</chinese-title>
        <english-title>DIGITAL TWIN METHOD FOR WIRELESS LOCAL AREA NETWORK, OPERATING SYSTEM, AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線區域網路之數位孿生方法，由一運算裝置執行且包含：取得場域中多個無線通訊裝置分別對應之多個裝置配置；將此些裝置配置輸入至生成式人工智慧模型以學習生成式人工智慧模型之多個隱藏變數；利用此些裝置配置訓練生成式人工智慧模型，以產生在場域之現實無線區域網路之時間結構；以及基於生成式人工智慧模型時間結構建立對應現實無線區域網路之數位孿生無線區域網路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A digital twin method for a wireless local area network is executed by an operating device. The digital twin method includes: obtaining a plurality of device configurations respectively corresponding to a plurality of wireless communication devices in a field; inputting the device configurations to a generative artificial intelligence (AI) model to learn a plurality of hidden variables of the generative AI model; training the generative AI model by utilizing the device configurations to generate a time structure of a realistic wireless local area network in the field; and constructing a digital twin wireless local area network corresponding to the realistic wireless local area network based on the generative AI model and the time structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:數位孿生方法</p>
        <p type="p">S310,S320,S330,S340:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="837px" img-content="tif" inline="yes" orientation="portrait" width="649px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621925</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145580</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B60W30/14</main-classification>
        <further-classification edition="201201120241230B">B60W30/095</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江進豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JINN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐世鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張祖錕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TSU-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏宏源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, HUNG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷震台</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, CHENG-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>移動載具感知融合系統及方法</chinese-title>
        <english-title>MOBILE VEHICLE SENSOR FUSION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為提出一種移動載具感知融合系統及方法，其應用於一載具以一移動速度行進時，先利用一光掃描單元與一影像擷取單元取得載具之一第一偵測區域與一第二偵測區域之一第一掃描影像與一第一環境影像並傳送至一主機，用以取得一第一影像，並從第一影像取得一障礙物影像，用以取得一障礙物之一障礙物資訊，進而取得載具與障礙物之一相對距離，以用於判斷障礙物位於靠近載具之第一偵測區域或位於外側之第二偵測區域，並透過判斷障礙物位於第一偵測區域而產生對應之一第一輔助訊息，進而讓駕駛依據第一輔助訊息避免忽略危險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is to provide a mobile vehicle sensor fusion system and method thereof, which is applied for a vehicle moving with a movement velocity. Firstly, a light scan unit and a depth image capture unit are used to obtain a first scan image and a first capturing image for a first detection area and a second detection area of the vehicle, and then transferring to a host, for obtaining a depth image, thereby, an obstacle image is obtained from the depth image for obtaining an obstacle information of an obstacle and obtaining a relative distance between the vehicle and the obstacle. Hereby, the host determines whether the obstacle is located at the first detection area close to the vehicle or the second detection area outside of the first detection area while a corresponding assistance message is generated by determining the obstacle located at the first detection area. Further, the driver is prevented from the danger based on the first assistance message.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10-S22:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="1008px" img-content="tif" inline="yes" orientation="portrait" width="753px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622294</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145581</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120250102B">C25B11/04</main-classification>
        <further-classification edition="202101120250102B">C25B11/061</further-classification>
        <further-classification edition="202101120250102B">C25B11/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張棋傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHANG, CI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林世杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉美儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫梓宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, CHIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張振暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳子鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>不溶性電極之製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種不溶性電極之製備方法，其係對一基材進行一前處理，並將該基材浸置於一含鉛電解液中進行一第一電解反應，使該基材之表面形成一第一含鉛鍍層，形成該第一含鉛鍍層後，將該基材浸置於之該含鉛電解液中進行一第二電解反應，使該第一含鉛鍍層之表面形成一第二含鉛鍍層，並於一反應時間後於該第一含鉛鍍層之表面形成該第二含鉛鍍層，以製得一不溶性電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S02:步驟</p>
        <p type="p">S04:步驟</p>
        <p type="p">S06:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="683px" img-content="tif" inline="yes" orientation="portrait" width="636px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622753</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145582</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G06F13/12</main-classification>
        <further-classification edition="200601120241231B">G06F13/14</further-classification>
        <further-classification edition="200601120241231B">G06K19/06</further-classification>
        <further-classification edition="200601120241231B">H04N1/32</further-classification>
        <further-classification edition="200601120241231B">H04N1/393</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東友科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECO IMAGE SYSTEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶涌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智能列印控制系統及智能列印控制方法</chinese-title>
        <english-title>INTELLIGENT PRINTING CONTROL SYSTEM AND INTELLIGENT PRINTING CONTROL METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種智能列印控制系統，包括：行動裝置及事務機。行動裝置包括鏡頭、處理器、第一通訊模組及顯示器。事務機包括記憶模組、控制處理模組、第二通訊模組以及多個功能模組。使用者透過行動裝置之鏡頭拍攝及掃瞄事務機的二維條碼，藉由解碼二維條碼，快速連線至事務機，並透過第一通訊模組與第二通訊模組連線配對。再將儲存於事務機之記憶模組內的控制介面顯示於行動裝置之顯示器上，即為智能控制介面。使用者選擇智能控制介面上之功能，處理器產生對應之執行指令，並傳送至事務機，使對應之功能模組執行該功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An intelligent printing control system is disclosed and comprises a mobile devices and a multi-function printer (MFP). The mobile device comprises a lens, a processor, a first communication module and a display. The MFP includes a memory module, a control processing module, a second communication module and multiple functional modules. A user scans a 2D code of the MFP through the lens of the mobile device, quickly connects to the MFP by decoding the 2D code, so that the mobile device connects and pairs with the MFP through the connection between the first communication module and the second communication module. After that, a control interface stored in the memory module of MFP is then displayed on the display of the mobile device, which is the intelligent control interface. The user can select a function on the intelligent control interface, and the processor generates the corresponding execution instruction and sends it to the MFP, so that the corresponding function module executes the function.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:智能列印控制系統</p>
        <p type="p">2:行動裝置</p>
        <p type="p">20:殼體</p>
        <p type="p">24:顯示器</p>
        <p type="p">3:事務機</p>
        <p type="p">30:殼體</p>
        <p type="p">31:二維條碼</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="647px" img-content="tif" inline="yes" orientation="portrait" width="834px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622732</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145583</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250303B">G06F9/445</main-classification>
        <further-classification edition="201801120250303B">G06F9/44</further-classification>
        <further-classification edition="200601120250303B">G06F9/06</further-classification>
        <further-classification edition="201801120250303B">G06F8/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUAN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊朝光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHAO-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪健珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉哲銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHE-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>動態調整硬體配置指令的方法與電子裝置</chinese-title>
        <english-title>METHOD FOR DYNAMICALLY ADJUSTING HARDWARE CONFIGURATION INSTRUCTION AND ELECTRONIC APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種動態調整硬體配置指令的方法與電子裝置。動態調整硬體配置指令適用於包括基本輸入輸出系統（BIOS）裝置與硬體裝置的電子裝置，所述方法包括下列步驟。根據硬體裝置的硬體配置指令集產生二進制原始資料檔案，其中硬體配置指令集包括至少一硬體配置指令。將二進制原始資料檔案寫入至BIOS裝置的BIOS變量儲存空間。透過執行BIOS代碼，自BIOS變量儲存空間讀取二進制原始資料檔案中的硬體配置指令。透過執行BIOS代碼，將從BIOS變量儲存空間讀取的硬體配置指令寫入至硬體裝置的暫存器內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for dynamically adjusting hardware configuration instruction and an electronic apparatus are provided. The method for dynamically adjusting hardware configuration instructions is adapted to the electronic apparatus including a basic input and output system （BIOS） device and a hardware device.        &lt;br/&gt;The method includes the following steps. A binary raw data file is generated according to a hardware configuration instruction set of the hardware device, wherein the hardware configuration instruction set includes at least one hardware configuration instruction. The binary raw data file is written to BIOS variable storage space of the BIOS device. By executing BIOS code, the hardware configuration instruction in the binary raw data file is read from the BIOS variable storage space. By executing the BIOS code, the hardware configuration instruction read from the BIOS variable storage space is written into a register of the hardware device.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S240:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="593px" img-content="tif" inline="yes" orientation="portrait" width="661px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623340</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145584</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">H05K7/20</main-classification>
        <further-classification edition="200601120250425B">H05K7/02</further-classification>
        <further-classification edition="200601120250425B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉政熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>獨立圖形處理器</chinese-title>
        <english-title>DISCRETE GRAPHICS PROCESSING UNIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種獨立圖形處理器，包括第一支架、第二支架、顯示卡、散熱器及二個風扇。第一支架具有並列設置的二個進風口。第二支架相對於第一支架設置。顯示卡設置於第二支架上，且位於第一支架與第二支架之間。散熱器設置於第一支架與顯示卡之間，並熱耦接於顯示卡的熱源。二個風扇分別對應二個進風口設置，且可旋轉地連接於第一支架。在第一模式下，二個風扇的二個旋轉軸線互為平行。由第一模式轉換至第二模式時，二個風扇分別沿不同向旋轉，以使二個旋轉軸線相交。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A discrete graphics processing unit including a first bracket, a second bracket, a graphics card, a heatsink, and two fans is provided. The first bracket has two air intake openings arranged side by side. The second bracket is positioned opposite to the first bracket. The graphics card is positioned on the second bracket and is located between the first and second brackets. The heatsink is positioned between the first bracket and the graphics card, and is thermally coupled to a heat source of the graphics card. The two fans are positioned corresponding to the two air intake openings and are rotatably connected to the first bracket. In a first mode, two rotational axes of the two fans are parallel to each other. When transitioning from the first mode to a second mode, the two fans rotate in two opposite directions respectively, causing the two rotational axes to intersect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:獨立圖形處理器</p>
        <p type="p">101:散熱空間</p>
        <p type="p">110:第一支架</p>
        <p type="p">111:進風口</p>
        <p type="p">120:第二支架</p>
        <p type="p">130:顯示卡</p>
        <p type="p">131:熱源</p>
        <p type="p">140:散熱器</p>
        <p type="p">150:風扇</p>
        <p type="p">151:旋轉軸線</p>
        <p type="p">160:扭力鉸鏈</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="735px" img-content="tif" inline="yes" orientation="portrait" width="997px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623334</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145585</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250117B">H05K7/02</main-classification>
        <further-classification edition="200601120250117B">H05K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂靜宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHING-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉侯亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, HOU-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子設備</chinese-title>
        <english-title>ELECTRONIC APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子設備，包括機殼、主機板、獨立顯示卡及活動飾板。主機板與獨立顯示卡設置於機殼內部。機殼內部具有位於主機板的一側的線路區，且獨立顯示卡的部分延伸至線路區。活動飾板設置於獨立顯示卡的上方，並遮蔽線路區。活動飾板包括固定於機殼內部的第一飾板與疊合於第一飾板上的第二飾板。第二飾板滑動連接於第一飾板，以依據獨立顯示卡的尺寸在第一飾板上滑動並貼近獨立顯示卡。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic apparatus including a casing, a motherboard, a discrete graphics processing unit and a movable decorative panel is provided. The motherboard and the discrete graphics processing unit are disposed inside the casing. The interior of the casing has a routing area located at one side of the motherboard, and the discrete graphics processing unit extends to the routing area. The movable decorative panel is disposed above the discrete graphics processing unit and covers the routing area. The movable decorative panel includes a first decorative panel fixed inside the casing and a second decorative panel overlapping the first decorative panel. The second decorative panel is slidably connected to the first decorative panel to slide on the first decorative panel and close to the discrete graphics processing unit according to the size of the discrete graphics processing unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子設備</p>
        <p type="p">101:螺絲</p>
        <p type="p">110:機殼</p>
        <p type="p">111:線路區</p>
        <p type="p">112:固定扣片</p>
        <p type="p">1101:頂部</p>
        <p type="p">1104:風扇</p>
        <p type="p">1105:底部</p>
        <p type="p">120:主機板</p>
        <p type="p">130:獨立顯示卡</p>
        <p type="p">132:入風口</p>
        <p type="p">140:活動飾板</p>
        <p type="p">141:第一飾板</p>
        <p type="p">141a:安裝板部</p>
        <p type="p">141b:第一遮蔽板部</p>
        <p type="p">141c:第一側板部</p>
        <p type="p">1413:扣孔</p>
        <p type="p">142:第二飾板</p>
        <p type="p">142a:第二側板部</p>
        <p type="p">142b:第二遮蔽板部</p>
        <p type="p">D1:第一距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="713px" img-content="tif" inline="yes" orientation="portrait" width="1008px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622539</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145588</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201001120250303B">G01S19/38</main-classification>
        <further-classification edition="200601120250303B">G01S5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>農業部農業試驗所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN AGRICULTURAL RESEARCH INSTITUTE, MINISTRY OF AGRICULTURE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉滄棽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TSANG-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張翊庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具可互換式定位裝置之定位系統及其定位方法</chinese-title>
        <english-title>POSITIONING SYSTEM HAVING SWITCHABLE POSITIONING DEVICES AND POSITIONING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種定位系統，包含第一裝置、第二裝置及通訊模組。第一裝置取得第一裝置之第一位置資訊。第二裝置取得第二裝置之第二位置資訊。通訊模組架構於使第一裝置及第二裝置通訊連接。第二裝置透過通訊模組將第二位置資訊傳送至第一裝置，第一裝置根據第一位置資訊及第二位置資訊執行誤差除去程序，以取得第一裝置之第一高精度位置資訊。第一裝置將第一位置資訊透過通訊模組傳送至第二裝置，第二裝置根據第一位置資訊及第二位置資訊執行誤差除去程序，以取得第二裝置之第二高精度位置資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A positioning system is disclosed and includes a first device, a second device and a communication module. The first device is configured to obtain a first location information of the first device. The second device is configured to obtain a second location information of the second device. The communication module is configured to communicate between the first device and the second device. The second device transmits the second location information to the first device through the communication module, and the first device conducts an error removal procedure according to the first location information and the second location information, so as to generate a first high-precision location information of the first device. The first device transmits the first location information to the second device through the communication module, and the second device conducts the error removal procedure according to the first location information and the second location information, so as to generate a second high-precision location information of the first device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:定位系統</p>
        <p type="p">1:第一裝置</p>
        <p type="p">11:第一定位模組</p>
        <p type="p">12:第一處理模組</p>
        <p type="p">2:第二裝置</p>
        <p type="p">21:第二定位模組</p>
        <p type="p">22:第二處理模組</p>
        <p type="p">3:通訊模組</p>
        <p type="p">31:第一通訊單元</p>
        <p type="p">32:第二通訊單元</p>
        <p type="p">33:第三通訊單元</p>
        <p type="p">4:使用者裝置</p>
        <p type="p">41:顯示螢幕</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="665px" img-content="tif" inline="yes" orientation="portrait" width="978px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622339</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145591</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">E04C2/24</main-classification>
        <further-classification edition="200601120241230B">E04C5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉玉祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉衣祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, YI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾采倪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHONG, CAI-NI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宗融</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>木建築用水平結構件之非膠合集成工法</chinese-title>
        <english-title>NON-GLUED LAMINATED CONSTRUCTION METHOD OF HORIZONTAL LOAD-BEARING COMPONENT FOR TIMBER BUILDINGS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種木建築用水平結構件之非膠合集成工法，包含一堆疊步驟及一固定步驟，該堆疊步驟係將複數木板堆疊排列形成一木建築構件本體，該木建築構件本體上有複數第一斜孔，以及相對所述複數第一斜孔之複數第二斜孔，該固定步驟係將複數第一緊固件依序穿設於所述複數第一斜孔，並將複數第二緊固件依序穿設於所述複數第二斜孔，以固定所述複數木板，透過有序的植入方式，可增進結構的穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an non-glued laminated construction method of horizontal load-bearing component for timber buildings, which includes a stacking step and a fixing step. The stacking step is to stack and arrange a plurality of wooden boards to form a wooden building component body. The wooden building component body has a row of first oblique holes and a row of second oblique holes opposite to the row of first oblique holes. The fixing step is to sequentially penetrate a plurality of first fasteners into the plurality of first oblique holes, and to sequentially penetrate a plurality of second fasteners into the plurality of second oblique holes to fix the plurality of second fasteners. Wooden boards, through orderly implantation, can enhance structural stability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(11):第一端</p>
        <p type="p">(12):第二端</p>
        <p type="p">(13):中間部</p>
        <p type="p">(14):第一斜孔</p>
        <p type="p">(15):第二斜孔</p>
        <p type="p">(2):第一緊固件</p>
        <p type="p">(3):第二緊固件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="471px" img-content="tif" inline="yes" orientation="portrait" width="719px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623323</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145593</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">H05K1/11</main-classification>
        <further-classification edition="200601120241230B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭于鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏郁任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐宗伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, TSUNG-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>印刷電路總成及其製造方法</chinese-title>
        <english-title>PRINTED CIRCUIT ASSEMBLY AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種印刷電路總成及其製造方法，印刷電路總成包括電路板、變壓器與高壓側開關。印刷電路總成之製造方法，其步驟包括：取用高壓側開關；塗佈防護材料於高壓側開關的複數個高壓側接腳的表面，以形成第一防護層；將高壓側開關的該些個高壓側接腳插接於電路板，其中該些個高壓側接腳的第一高壓接腳部露出於電路板上，且第一防護層覆蓋於第一高壓接腳部的表面。該些個高壓側接腳的第二高壓接腳部穿出於電路板下，焊接穿過電路板下方的該些個第二高壓接腳部，使第二高壓接腳部表面覆蓋的第一防護層被高溫熔解，並該些個高壓側接腳與電路板的底面焊接在一起。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a printed circuit assembly and a manufacturing method thereof. The printed circuit assembly includes the circuit board, transformer and high-side switch. The steps of the printed circuit assembly manufacturing method include:        &lt;br/&gt;Access the high voltage side switch; Coating protective material on the surfaces of the plurality of high-voltage side pins of the high-voltage side switch to form a first protective layer; The high-voltage side pins of the high-voltage side switch are plugged into the circuit board, wherein the first high-voltage side pin portions of the high-voltage side pins are exposed on the circuit board, and the first protective layer covers the first high-voltage side pin. The surface of the lateral foot. The second high-voltage side pins of the high-voltage side pins pass under the circuit board, and are welded through the second high-voltage side pins under the circuit board, so that the surface of the second high-voltage side pins is covered The first protective layer is melted by high temperature, and the high-voltage side pins are welded to the bottom surface of the circuit board.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:電路板</p>
        <p type="p">13:高壓側開關</p>
        <p type="p">131:高壓側接腳</p>
        <p type="p">1311:第一高壓接腳部</p>
        <p type="p">1312:第二高壓接腳部</p>
        <p type="p">10:防護材料</p>
        <p type="p">100:第一防護層</p>
        <p type="p">200:焊錫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="930px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622442</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145596</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F28D15/04</main-classification>
        <further-classification edition="200601120241230B">F28F23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼得科超眾科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CHAUN-CHOUNG TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鉦譁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭世皇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHI HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>常振暐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHEN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭哲翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHE-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭閔中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, MIN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王梓瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TZU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多層式編織條狀毛細結構</chinese-title>
        <english-title>MULTI-LAYER BRAIDED CAPILLARY STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多層式編織條狀毛細結構，包括一第一編織圈與一第二編織圈，第一編織圈由第一編織層呈圈狀包覆一內孔以疊置而成，並具有由第一編織層疊置所形成的一第一厚度，且各第一編織層係由彼此相互交織而成的二第一編織線所構成，以於各第一編織層上形成複數第一網格；第二編織圈包覆於第一編織圈外，第二編織圈由第二編織層呈圈狀包覆第一編織圈以疊置而成，且各第二編織層係由彼此相互交織而成的二第二編織線所構成，以於各第二編織層上形成複數第二網格；其中，第一編織線的線徑大於第二編織線的線徑，且第一網格大於第二網格，而第一厚度則大於內孔的孔徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-layer braided capillary structure having a first braided ring and a second braided ring is provided. The first braided ring includes at least one first braided layer. The at least one first braided layer covers an inner hole in a circle to stack to form the first braided ring having a first thickness. The at least one first braided layer is formed by two first braided wires intertwined with each other to form a plurality of first grids. The second braided ring includes at least one second braided layer. The at least one second braided layer covers the first braided ring in a circle to stack to form the second braided ring. The at least one second braided layer is formed by two second braided wires intertwined with each other to form a plurality of second grids. A diameter of the first braided wires is greater than a diameter of the second braided wires. Each of the first grids is greater than each of the second grids. The first thickness is greater than an aperture of the inner hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:第一編織層</p>
        <p type="p">T1:第一厚度</p>
        <p type="p">2a:第二編織層</p>
        <p type="p">T2:第二厚度</p>
        <p type="p">30:內孔</p>
        <p type="p">D2:孔徑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="442px" img-content="tif" inline="yes" orientation="portrait" width="505px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622887</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145597</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250512B">G06T3/604</main-classification>
        <further-classification edition="202201120250512B">G06V10/82</further-classification>
        <further-classification edition="202201120250512B">G06V10/764</further-classification>
        <further-classification edition="200601120250512B">G01N21/86</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫學達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XUE DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>適用自動光學檢測的元件圖像擷取系統及其方法</chinese-title>
        <english-title>COMPONENT IMAGE CAPTURE SYSTEM FOR AUTOMATIC OPTICAL INSPECTION AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種適用自動光學檢測的元件圖像擷取系統及其方法，圖像處理伺服器使用物件識別模型對待處理圖像中的電子元件進行識別，以找出機板中唯一存在的四個電子元件並計算得到四個電子元件的元件中心圖像座標，再將元件中心圖像座標與相近元件中心標準座標分組為四組座標分組，使用座標轉換演算法以計算得到四組座標轉換係數組，將座標轉換係數組依據每個座標轉換係數刪除最大值與最小值再進行平均以計算得到座標轉換係數，將待處理圖像使用座標轉換係數的座標轉換演算法以轉換為轉換圖像，再依據每一個擷取資訊中擷取中心座標以及擷取範圍擷取至少一擷取元件圖像，藉此可以達成提供擷取正確範圍的擷取元件圖像的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A component image capture system for automatic optical inspection and a method thereof are provided. Electronic components in a to-be-processed image are recognized by an image processing server using an object recognition model to find only four electronic components present on the board and component center image coordinates of four electronic components are calculated. Group the component center image coordinates and similar component center standard coordinates into four coordinate groups. Four sets of coordinate conversion coefficients are calculated by using coordinate conversion algorithm. The maximum and minimum values ​​from the coordinate conversion coefficient group are deleted based on each coordinate conversion coefficient and average them to calculate the coordinate conversion coefficient. The to-be-processed image is converted into a converted image by Convert the coordinate conversion algorithm using the coordinate conversion coefficient. At least one capture component images are captured according to acquisition center coordinates and acquisition range are included in each acquisition information. Therefore, the efficiency of providing captured component image which has a correct range may be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:自動光學檢測機台</p>
        <p type="p">20:圖像處理伺服器</p>
        <p type="p">21:標準座標資料庫</p>
        <p type="p">22:圖像擷取資料庫</p>
        <p type="p">23:查詢模組</p>
        <p type="p">24:元件識別模組</p>
        <p type="p">25:轉換計算模組</p>
        <p type="p">26:元件圖像擷取模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="929px" img-content="tif" inline="yes" orientation="portrait" width="543px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622768</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145598</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250303B">G06F16/30</main-classification>
        <further-classification edition="201901120250303B">G06F16/31</further-classification>
        <further-classification edition="202001120250303B">G06F40/35</further-classification>
        <further-classification edition="202001120250303B">G06F40/30</further-classification>
        <further-classification edition="202201120250303B">H04L51/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張泉鈺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QUAN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>由聊天記錄中取出結構化知識資料之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR EXTRACTING STRUCTURED KNOWLEDGE DATA FROM CHAT HISTORY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種由聊天記錄中取出結構化知識資料之裝置及方法，其透過將所取得之聊天記錄分割為多個聊天內容後，使用第一大型語言模型識別各聊天內容所包含之聊天主題，並依據聊天主題分割各聊天內容為相對應之對話內容，及判斷各聊天主題與相對應之對話內容的相關性達到門檻值時，使用第二大型語言模型分析對話內容以產生結構化知識資料之技術手段，可以有效整理出聊天記錄中之有價值內容，並達成減少人工分析與總結之工作量的技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for extracting structured knowledge data from chat history and a method thereof are provided. By splitting an obtained chat history into multiple chat content, using a first large language model to identify chat topics contained in each of the chat content, splitting each chat content into corresponding conversation content based on one of the chat topics, and using a second large language model to generate structured knowledge data when a correlation between each of the chat topic and the corresponding conversation content reaches a threshold, the device and the method can organize valuable content in chat history, and achieve the effect of reducing workload of manual analysis and summary.</p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟310:取得聊天記錄</p>
        <p type="p">步驟320:分割聊天記錄為多個聊天內容</p>
        <p type="p">步驟330:使用大型語言模型識別聊天內容所包含之聊天主題，並依據聊天主題分割聊天內容為相對應之對話內容</p>
        <p type="p">步驟350:判斷聊天主題與對話內容之相關性是否達到門檻值</p>
        <p type="p">步驟370:使用大型語言模型分析對話內容以產生對話內容之結構化知識資料</p>
        <p type="p">步驟380:儲存結構化知識資料到知識管理資料庫中</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="959px" img-content="tif" inline="yes" orientation="portrait" width="672px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623478</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145600</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260303B">H10H29/03</main-classification>
        <further-classification edition="202601120260303B">H10P74/00</further-classification>
        <further-classification edition="202601120260303B">H10P72/00</further-classification>
        <further-classification edition="200601120260303B">G05B19/404</further-classification>
        <further-classification edition="202201120260303B">G06V10/764</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東捷科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳贊仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許巍耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭晨泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>批量轉移製程的檢測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之檢測方法首先使用一拾取頭從一載板的一承載區拾取多個半導體元件。接著拾取頭將多個半導體元件移動至一浸漬區沾取助焊劑，且移動一影像檢測器至載板的承載區進行檢測，以取得一拾取影像。之後拾取頭將多個半導體元件轉置於一目標基板的轉置區。最後移動拾取頭至載板的另一承載區以拾取半導體元件，且移動影像檢測器至目標基板的轉置區進行檢測，以取得一轉置影像。藉此，本發明之方法可以及時紀錄拾取及轉置的結果，來改善製程及提高製程穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機台</p>
        <p type="p">12:龍門支架</p>
        <p type="p">14:控制單元</p>
        <p type="p">20:拾取頭</p>
        <p type="p">30:載板</p>
        <p type="p">34:浸漬區</p>
        <p type="p">42:半導體元件</p>
        <p type="p">50:影像檢測器</p>
        <p type="p">60:目標基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="1007px" img-content="tif" inline="yes" orientation="portrait" width="707px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623583</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145601</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10P72/50</main-classification>
        <further-classification edition="202601120260303B">H10W72/00</further-classification>
        <further-classification edition="202201120260303B">G06V10/40</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東捷科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳贊仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許巍耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭晨泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>晶片對位方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之晶片對位方法首先取得一晶片之一第一對位特徵相對於一拾取頭之一第二對位特徵的一位置補償量，接著使拾取頭之第二對位特徵對齊一玻璃基板之一第三對位特徵，最後根據位置補償量對晶片的位置進行補償，使晶片之第一對位特徵對齊玻璃基板之第三對位特徵。藉此，本發明之晶片對位方法可以有效提升晶片的對位精度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S2~S3:步驟</p>
        <p type="p">S3.1~S3.2:步驟</p>
        <p type="p">10:晶片</p>
        <p type="p">12:第一對位特徵</p>
        <p type="p">20:拾取頭</p>
        <p type="p">22:第二對位特徵</p>
        <p type="p">C2:中心點</p>
        <p type="p">30:玻璃基板</p>
        <p type="p">32:第三對位特徵</p>
        <p type="p">C3:中心點</p>
        <p type="p">40:白光影像感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="1051px" img-content="tif" inline="yes" orientation="portrait" width="776px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622713</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145605</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241218B">G06F3/041</main-classification>
        <further-classification edition="200601120241218B">G06F3/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達方電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARFON ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江治湘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江正偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>觸覺回饋量測方法</chinese-title>
        <english-title>HAPTIC FEEDBACK MEASUREMENT METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸覺回饋量測方法，用於一觸覺回饋觸控板。該觸覺回饋觸控板具有一觸控表面。該觸覺回饋量測方法包含步驟：於該觸控表面上定義相鄰排列之一第一量測點及一第二量測點；準備一第一力感測器、一第二力感測器、一第一加速感測器及一第二加速感測器，該第一力感測器及該第一加速感測器設置於該第一量測點上方，第二力感測器及該第二加速感測器設置於該第二量測點上方；使該第二加速感測器接觸該第二量測點；使該第一力感測器或該第二力感測器對應地接觸該第一量測點或該第二量測點；以及經由該第二加速感測器接收一加速感測信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A haptic feedback measurement method, used for a haptic feedback touchpad with a touch surface, includes the following steps of: defining a first measurement spot and a second measurement spot that are adjacently arranged on the touch surface; preparing a first force sensor, a second force sensor, a first acceleration sensor and a second acceleration sensor, in which the first force sensor and the first acceleration sensor are disposed on above the first measurement spot, and the second force sensor and the second acceleration sensor are disposed above the second measurement spot; making the second acceleration sensor contact the second measurement spot; making the first force sensor or the second force sensor contact the first measurement spot or the second measurement spot correspondingly; and receiving an acceleration sensing signal through the second acceleration sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:觸覺回饋觸控板</p>
        <p type="p">10a:觸控表面</p>
        <p type="p">22a:第一力感測器</p>
        <p type="p">22b:第二力感測器</p>
        <p type="p">22c:第三力感測器</p>
        <p type="p">22d:第四力感測器</p>
        <p type="p">24a:第一加速感測器</p>
        <p type="p">24b:第二加速感測器</p>
        <p type="p">24c:第三加速感測器</p>
        <p type="p">24d:第四加速感測器</p>
        <p type="p">T21:第一量測點</p>
        <p type="p">T22:第二量測點</p>
        <p type="p">T23:第三量測點</p>
        <p type="p">T24:第四量測點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="326px" img-content="tif" inline="yes" orientation="portrait" width="687px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621675</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145608</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61K9/16</main-classification>
        <further-classification edition="200601120250501B">A61K47/36</further-classification>
        <further-classification edition="200601120250501B">A61K36/074</further-classification>
        <further-classification edition="200601120250501B">A61K36/9066</further-classification>
        <further-classification edition="200601120250501B">A61K31/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周名洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, MING YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周名洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, MING YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡妤晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林緹妍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TI YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪鼎杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>奈米多醣體複合粒子及其製備方法</chinese-title>
        <english-title>POLYSACCHARIDE NANOCOMPOSITE PARTICLES AND METHOD FOR PREPARATION THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種新穎之奈米多醣體複合粒子，其係由一種聚陽離子多醣體及兩種聚陰離子多醣體透過靜電吸引力及錯合反應製備而成。該奈米多醣體複合粒子具有優良的活性成分包覆率，使其被細胞攝取後能夠均勻地分布其中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a novel polysaccharide nanocomposite particle, which is formed from one type of cationic polysaccharides and two types of anionic polysaccharides through electrostatic attraction and complexation reaction. The polysaccharide nanocomposite particles have excellent coating efficient for an active ingredient, allowing them to be evenly distributed after being taken up by cells.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="947px" img-content="tif" inline="yes" orientation="portrait" width="610px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623485</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145611</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250212B">H10H29/851</main-classification>
        <further-classification edition="202501120250212B">H10H29/855</further-classification>
        <further-classification edition="202501120250212B">H10H29/856</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡旻錦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MIN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包括驅動背板、堤岸層、第一發光元件、第一下光學結構及第一色轉換結構。堤岸層設置於驅動背板上且具有第一開口。第一發光元件位於第一開口中且電性連接至驅動背板。第一下光學結構設置於堤岸層的第一開口中，且覆蓋第一發光元件。第一色轉換結構設置於堤岸層的第一開口中及第一下光學結構上。第一下光學結構位於第一色轉換結構與第一發光元件之間。第一發光元件用以發出第一色光。第一色轉換結構用以將第一色光轉換為第二色光。第一下光學結構用以使第一色光穿透且反射第二色光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus includes a driving backplane, a bank layer, a first light-emitting element, a first lower optical structure and a first color conversion structure. The bank layer is disposed on the driving backplane and has a first opening. The first light-emitting element is located in the first opening and is electrically connected to the driving backplane. The first lower optical structure is disposed in the first opening of the bank layer and covers the first light-emitting element. The first color conversion structure is disposed in the first opening of the bank layer and on the first lower optical structure. The first lower optical structure is located between the first color conversion structure and the first light-emitting element. The first light-emitting element is adapted to emit a first color light. The first color conversion structure is adapted to convert the first color light into a second color light. The first lower optical structure is adapted to be passed through by the first color light and reflect the second color light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">110:驅動背板</p>
        <p type="p">120:堤岸層</p>
        <p type="p">121:第一開口</p>
        <p type="p">122:第二開口</p>
        <p type="p">123:第三開口</p>
        <p type="p">131:第一發光元件</p>
        <p type="p">131a:頂面</p>
        <p type="p">131b:側壁</p>
        <p type="p">132:第二發光元件</p>
        <p type="p">133:第三發光元件</p>
        <p type="p">140:對向基板</p>
        <p type="p">142:基底</p>
        <p type="p">144:遮光圖案層</p>
        <p type="p">144a:開口</p>
        <p type="p">146R、146G、146B:彩色濾光圖案</p>
        <p type="p">151:第一下光學結構</p>
        <p type="p">161:第一色轉換結構</p>
        <p type="p">171:第一上光學結構</p>
        <p type="p">180、190:透光材料</p>
        <p type="p">PX:畫素</p>
        <p type="p">SW1:三明治結構</p>
        <p type="p">T151、T171:厚度</p>
        <p type="p">z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="661px" img-content="tif" inline="yes" orientation="portrait" width="970px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622761</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145612</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250512B">G06F15/78</main-classification>
        <further-classification edition="200601120250512B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神雲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAC COMPUTING TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韋喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡居諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>背板的編碼方法、背板的識別方法及伺服器系統</chinese-title>
        <english-title>METHOD FOR ENCODING A BACKPLANE, METHOD FOR IDENTIFYING A BACKPLANE AND SERVER SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種背板的編碼方法，適用於伺服器系統。伺服器系統包含主板及背板。主板包含第一連接器。背板包含第二連接器及邏輯電路。第一連接器耦接於第二連接器。編碼方法包含：透過第一連接器的多個接腳對背板編碼以得到對應於背板的辨識碼；將辨識碼儲存於邏輯電路的韌體中；及將辨識碼儲存於伺服器系統的BIOS中。本案更提供一種背板的識別方法及一種伺服器系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for encoding a backplane, applicable to a server system. The server system comprises a motherboard and a backplane. The motherboard comprises a first connector. The backplane comprises a second connector and a logic circuit. The first connector is coupled to the second connector. The method for encoding the backplane comprises: encoding the backplane through a plurality of pins of the first connector to obtain an identification code corresponding to the backplane; storing the identification code in firmware of the logic circuit; and storing the identification code in BIOS of the server system. The present invention further provides a method for identifying the backplane and a server system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01~S03:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="389px" img-content="tif" inline="yes" orientation="portrait" width="533px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621945</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145613</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250218B">B64U10/14</main-classification>
        <further-classification edition="202301120250218B">B64U60/50</further-classification>
        <further-classification edition="202301120250218B">B64U20/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詩漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無人機及機臂</chinese-title>
        <english-title>DRONE AND ARM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無人機，包括一主體、一機臂結構及一支撐腳。機臂結構設置於主體的外側。支撐腳具有一天線模組。天線模組設置於支撐腳內且沿機臂結構的內壁延伸至主體內。支撐腳可拆卸地組裝於機臂結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A drone includes a main body, an arm structure and a stand. The arm structure is disposed on an outer side of the drone body. The stand has an antenna module. The antenna module is disposed in the stand and extends along an inner wall of the arm structure into the main body. The stand is detachably assembled to the arm structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:機臂結構</p>
        <p type="p">122:臂部</p>
        <p type="p">1221:第一組裝部</p>
        <p type="p">1221a:開槽</p>
        <p type="p">1221b:滑動件</p>
        <p type="p">1221c:彈性件</p>
        <p type="p">124:支撐腳</p>
        <p type="p">124a:支撐端</p>
        <p type="p">1241:第二組裝部</p>
        <p type="p">1241a、1241b:卡勾</p>
        <p type="p">130:天線模組</p>
        <p type="p">132:天線本體</p>
        <p type="p">134:線材組件</p>
        <p type="p">1341:第一線材</p>
        <p type="p">1341a:第一連接部</p>
        <p type="p">1342:第二線材</p>
        <p type="p">1342a:第二連接部</p>
        <p type="p">136:彈性結構</p>
        <p type="p">1361:彈性體</p>
        <p type="p">D:滑動方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.png" file="d10022.TIF" giffile="ed10022.png" height="914px" img-content="tif" inline="yes" orientation="portrait" width="663px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622657</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145614</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G05B19/416</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王焌豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JUN HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於生產設備的節能控制系統及其節能控制方法</chinese-title>
        <english-title>ENERGY-SAVING CONTROL SYSTEM FOR PRODUCTION APPARATUS AND ENERGY-SAVING CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種用於生產設備的節能控制系統及其節能控制方法。節能控制系統包括控制電路以及電流鉤表。電流鉤表耦接生產設備。控制電路耦接電流鉤表。控制電路執行電流訊號擷取模組，以透過電流鉤表取得生產設備的電流訊號，並且電流訊號擷取模組轉換電流訊號為電流數值變化曲線。控制電路透過分析模型分析電流數值變化曲線，以辨識電流數值變化曲線中的加工段區間以及非加工的虛耗段區間，並且控制電路根據辨識出電流數值變化曲線的非加工的虛耗段區間，調整生產設備的馬達轉速，以提升節能效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An energy-saving control system for production apparatus and an energy-saving control method thereof are provided. The energy-saving control system includes a control circuit and a current hook meter. The current hook meters are coupled to production equipment. The control circuit is coupled to the current hook meter. The control circuit executes a current signal acquisition module to obtain a current signal of the production equipment through the current hook meter, and the current signal acquisition module converts the current signal into a current value variation curve. The control circuit analyzes a current value change curve through an analysis model to identify a processing section interval and a non-processed wastage section interval in the current value change curve, and the control circuit adjusts a motor speed of the production equipment to improve energy saving effect according to the non-processed wastage section of the current value change curve.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:節能控制系統</p>
        <p type="p">110:控制電路</p>
        <p type="p">120:電流鉤表</p>
        <p type="p">200:生產設備</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="464px" img-content="tif" inline="yes" orientation="portrait" width="599px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621915</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145618</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250213B">B60L53/16</main-classification>
        <further-classification edition="201901120250213B">B60L53/60</further-classification>
        <further-classification edition="201901120250213B">B60L58/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬有創新股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATURS DESIGN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭駿鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHUN PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇峻毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHUN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於電動車輛之動力電池健康度預測與評估系統及具有該系統的充電樁、儲能櫃以及不斷電器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於電動車輛、儲能櫃及不斷電器之動力電池健康度預測與評估系統，該系統包括：資料庫單元、讀取單元以及人工智慧(AI)處理單元，能夠直接對電動汽車、儲能櫃或不斷電器進行動力電池健康度預測與評估，或是被整合於充電槍，其中該資料庫單元透過一協定訊號裝置與電動汽車、儲能櫃或不斷電器的電池連接，儲存不同廠牌電池和被測電池的各項電氣特性之數據以建立成資料庫；經該讀取單元與該資料庫單元協同運作，以及該人工智慧(AI)處理單元進行深度學習與歸納、總結與重複訓練，進而根據最佳AI模型預測被測電池壽命，提供電池健康度狀況預測及確保可靠充電效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:資料庫單元</p>
        <p type="p">3:讀取單元</p>
        <p type="p">4:人工智慧(AI)處理單元</p>
        <p type="p">8:電動汽車</p>
        <p type="p">9:螢幕</p>
        <p type="p">21:記憶體</p>
        <p type="p">31:微控制器</p>
        <p type="p">32:電壓電流感測器</p>
        <p type="p">33:區域網路控制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10057.JPG" file="ed10057.JPG" height="538px" img-content="tif" inline="yes" orientation="portrait" width="717px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622874</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145619</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250303B">G06Q50/00</main-classification>
        <further-classification edition="202401120250303B">G06Q50/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樹德科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHU-TE UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳璽煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHI-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智為</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李威聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於車載網路技術之碳足跡評估方法、系統及其平台</chinese-title>
        <english-title>A CARBON FOOTPRINT ASSESSMENT METHOD BASED ON ONBOARD NETWORK TECHNOLOGY, A SYSTEM, AND A PLATFORM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基於車載網路技術之碳足跡評估方法、系統及其平台，其中，該方法步驟包含: 以一車載電腦獲取並上傳一車輛之一動態運行數據至一雲端伺服器；以該雲端伺服器根據該動態運行數據進行運算，產生對應該車輛之一碳排放數據；及以該雲端伺服器根據該碳排放數據產生對應該車輛之一碳足跡評估結果。藉以，實現精準的碳足跡評估，並提供其評估系統及平台，以作為即時車載數據的監控與動態分析，解決傳統碳排放估算方法的侷限性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This present invention discloses a carbon footprint assessment method based on onboard network technology, a system, and a platform thereof. The steps of the method comprise: obtaining and uploading dynamic operation data of a vehicle to a cloud server using an onboard computer; performing calculations according to the dynamic operation data by the cloud server to generate a corresponding carbon emission data of the vehicle; and generating a corresponding carbon footprint assessment result of the vehicle based on the carbon emission data using the cloud server. This approach enables accurate carbon footprint assessment and provides an evaluation system and platform for real-time monitoring and dynamic analysis of onboard computer data, addressing the limitations of traditional methods for carbon emission estimation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟</p>
        <p type="p">S2:步驟</p>
        <p type="p">S3:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="656px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622634</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145620</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G03F7/16</main-classification>
        <further-classification edition="200601120241231B">G06N3/02</further-classification>
        <further-classification edition="200601120241231B">G01N21/88</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊慕理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MU-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塗勝智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, SHEMG-ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIAN-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>光阻塗佈異常檢測系統與方法</chinese-title>
        <english-title>DEFECT DETECTION SYSTEM AND METHOD FOR PHOTORESIST COATING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光阻塗佈異常檢測系統與方法。光阻塗佈異常檢測系統包含：記憶體與處理器。記憶體用以儲存複數個指令。處理器用以載入記憶體之指令，以進行上述之光阻塗佈異常檢測方法。光阻塗佈異常檢測方法包含：根據複數個正常歷史塗佈製程之複數筆歷史正常資料來建立一類神經網路模型，每一歷史正常資料包含一正常檢測訊號；獲取一線上塗佈製程之一原始檢測訊號；利用類神經網路模型來根據原始檢測訊號計算出相應之一重建檢測訊號；以及比較原始檢測訊號與重建檢測訊號，並根據比較之結果來判斷線上塗佈製程之一產品是否有異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A defect detection system and a defect detection method for photoresist coating are provided. The defect detection system includes: a memory and a processor. The memory is configured to store plural instructions. The processor is configured to load the instructions stored in the memory to perform: building an artificial neural network model in accordance with historic normal data of plural historic coating processes , in which each of the historic normal data includes a normal detected signal; obtaining an original detected signal of an online coating process; calculating a reconstructed detected signal in accordance with the original detected signal correspondingly by using the artificial neural network model ; and comparing the original detected signal with the reconstructed detected signal and determining if a product of the online coating process has a defect in accordance with the comparing result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:光阻塗佈異常檢測方法</p>
        <p type="p">410~440:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="613px" img-content="tif" inline="yes" orientation="portrait" width="799px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622593</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145621</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250227B">G02B27/01</main-classification>
        <further-classification edition="200601120250227B">G02B5/20</further-classification>
        <further-classification edition="200601120250227B">G02F1/1333</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成科技(成都)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成光電(深圳)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英特盛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王楨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116586026</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示模組</chinese-title>
        <english-title>DISPLAY MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示模組包含同調光源、分光鏡、空間光調制器、透鏡系統、反射鏡以及體積全像光學元件。分光鏡位於同調光源上方。空間光調制器位於分光鏡的一側，配置以調製複數個光線，光線的每一者具有不同於其它者的成像面。透鏡系統位於分光鏡相對於空間光調制器的一側。反射鏡位於透鏡系統相對於分光鏡的一側。體積全像光學元件位於反射鏡上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display module includes a coherent light source, a beam splitter, a spatial light modulator, a lens system, a reflective mirror and a volume holographic optical element (VHOE). The beam splitter is located on the display panel. The spatial light modulator is located at a side of the beam splitter, configured to modulate a plurality of light beams. Each of the light beams has an image plane different from the others. The lens system is located at a side of the beam splitter opposite to the spatial light modulator. The reflective mirror is located at a side of the lens system opposite to the beam splitter. The VHOE is located above the reflective mirror.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示模組</p>
        <p type="p">110:同調光源</p>
        <p type="p">120:分光鏡</p>
        <p type="p">130:空間光調制器</p>
        <p type="p">140:透鏡系統</p>
        <p type="p">150:反射鏡</p>
        <p type="p">160:體積全像光學元件</p>
        <p type="p">170:擋風玻璃</p>
        <p type="p">L1,L2:光線</p>
        <p type="p">E:觀察者</p>
        <p type="p">S1,S2:成像位置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="673px" img-content="tif" inline="yes" orientation="portrait" width="956px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623273</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145623</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H04R3/00</main-classification>
        <further-classification edition="200601120250303B">H03F3/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高立龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, LI-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可避免總諧波失真之惡化的音訊輸入電路</chinese-title>
        <english-title>AUDIO INPUT CIRCUIT CAPABLE OF PREVENTING DEGRADATION OF TOTAL HARMONIC DISTORTION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種音訊輸入電路，包含一單端訊號輸入電路、一差動訊號輸入電路、一第一放大器電路與一第二放大器電路。該單端訊號輸入電路於一單端模式下藉由開關被致能，以輸出一單端音訊訊號給該第一放大器電路。該差動訊號輸入電路於一差動模式下藉由開關被致能，以輸出一差動音訊訊號給該第一放大器電路。該第一放大器電路依據其所接收的訊號輸出一反相音訊輸出訊號給該第二放大器電路。該第二放大器電路依據其所接收的訊號輸出一正相音訊輸出訊號。於該單端及差動模式下，輸入該第一與第二放大器電路之非反相輸入端的訊號為直流訊號，以穩定該音訊輸入電路中的開關的導通電阻線性度，並避免該音訊輸入電路之總諧波失真的惡化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An audio input circuit including a single-ended signal input circuit, a differential signal input circuit, a first amplifier circuit, and a second amplifier circuit. The single-ended signal input circuit is enabled by switches in a single-ended mode to output a single-ended audio signal to the first amplifier circuit. The differential signal input circuit is enabled by switches in a differential mode to output a differential signal to the first amplifier circuit. The first amplifier circuit outputs an inverting audio output signal to the second amplifier circuit according to signals it received. The second amplifier circuit outputs a non-inverting audio output signal according to signals it received. In the single-ended and differential modes, the signals inputted to non-inverting input nodes of the first and second amplifier circuits are DC signals to stabilize the on-resistance linearity of the switches and prevent the degradation of total harmonic distortion of the audio input circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:音訊輸入電路</p>
        <p type="p">310:單端訊號輸入電路</p>
        <p type="p">320:差動訊號輸入電路</p>
        <p type="p">330:第一放大器電路</p>
        <p type="p">340:第二放大器電路</p>
        <p type="p">312:單端電路第一電阻</p>
        <p type="p">314:單端電路第一開關</p>
        <p type="p">316:單端電路第二開關</p>
        <p type="p">322:差動電路第一電阻</p>
        <p type="p">324:差動電路第一開關</p>
        <p type="p">326:差動電路第二電阻</p>
        <p type="p">328:差動電路第二開關</p>
        <p type="p">329:差動電路第三開關</p>
        <p type="p">332:第一放大器</p>
        <p type="p">334:第一回授電阻</p>
        <p type="p">342:輸入電阻</p>
        <p type="p">344:第二回授電阻</p>
        <p type="p">346:第二放大器</p>
        <p type="p">348:輸出電阻</p>
        <p type="p">VIP2:單端音訊訊號</p>
        <p type="p">VCM:共模訊號</p>
        <p type="p">VIP1:差動音訊訊號的一正端訊號</p>
        <p type="p">VIN1:差動音訊訊號的一負端訊號</p>
        <p type="p">VON:反相音訊輸出訊號</p>
        <p type="p">VOP:正相音訊輸出訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="907px" img-content="tif" inline="yes" orientation="portrait" width="675px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622690</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145625</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241227B">G06F1/20</main-classification>
        <further-classification edition="200601120241227B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文錚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>散熱裝置及電子裝置</chinese-title>
        <english-title>HEAT DISSIPATING DEVICE AND NOTEBOOK COMPUTER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱裝置及包含散熱裝置的電子裝置。散熱裝置包含基板、第一離心風扇、第一風扇擋板、第二風扇擋板以及溫度隔絕結構。基板具有第一表面、第二表面及貫穿第一表面與第二表面的貫穿槽。第一離心風扇設置於貫穿槽中。第一風扇擋板設置於第一表面，並部分地遮蓋貫穿槽。第一風扇擋板具有第一頂部、連接第一頂部的第一底部、以及自第一頂部延伸的固定部。第一頂部具有第一開口，第一底部具有沿著第一頂部的外緣的第一缺口。固定部連接第一表面。第二風扇擋板設置於第二表面，並遮蔽貫穿槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipating device and a notebook computer including the same are described. The heat dissipating device includes a base plate, a first centrifugal fan, a first fan baffle, a second fan baffle, and a temperature isolation structure. The base plate has a first surface, a second surface, and a penetrating slot penetrated both the first and the second surface. The first centrifugal fan is positioned within the penetrating slot. The first fan baffle is positioned on the first surface and partially covers the penetrating slot. The first fan baffle has a first top portion, a second bottom portion connected to the first top portion, a fixing portion extended from the first top portion. The first top portion has a first opening. The first bottom portion has a first notch along an out margin of the first top portion. The fixed portion is connected to the first surface. The second fan baffle is positioned on the second surface and covers the penetrating slot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:散熱裝置</p>
        <p type="p">110:基板</p>
        <p type="p">111:第一表面</p>
        <p type="p">120:第一離心風扇</p>
        <p type="p">130:第一風扇擋板</p>
        <p type="p">131:第一頂部</p>
        <p type="p">133:固定部</p>
        <p type="p">150:溫度隔絕結構</p>
        <p type="p">151:第一隔絕段</p>
        <p type="p">152:第二隔絕段</p>
        <p type="p">153:第三隔絕段</p>
        <p type="p">160:冷空氣排出區域</p>
        <p type="p">170:冷空氣吸入區域</p>
        <p type="p">180:第二離心風扇</p>
        <p type="p">240:第二散熱空間</p>
        <p type="p">M1:區域</p>
        <p type="p">A-A':割面線</p>
        <p type="p">x:第一軸向</p>
        <p type="p">y:第二軸向</p>
        <p type="p">z:第三軸向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="710px" img-content="tif" inline="yes" orientation="portrait" width="1004px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622787</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145627</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250303B">G06F30/20</main-classification>
        <further-classification edition="202001120250303B">G06F30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃振洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHEN-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳學良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSUEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹燕越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, YAN-YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>設計預測系統及其操作方法</chinese-title>
        <english-title>DESIGN PREDICTING SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設計預測系統的操作方法，包括：辨識複數個第一設計元件，依據第一設計元件產生複數個第一特徵；依據第一特徵產生演算法模型；在機構圖中辨識第一輸入特徵；藉由演算法模型匹配第一輸入特徵及第一特徵；以及當第一輸入特徵匹配第一特徵中的第三特徵時，將第一設計元件中的第二設計元件繪製於機構圖中，其中第二設計元件具有第三特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of operating a design predicting system comprising: identifying a plurality of first design units, and generating a plurality of first features according to the first design units; generating an algorithmic model according to the first features; identifying a first input feature in a mechanical drawing; matching the first input feature and the first features by the algorithmic model; and when the first input feature matches a third feature in the first features, formulating a second design unit of the first design units to the mechanic drawing, wherein the second design unit has a third feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:操作方法</p>
        <p type="p">701~706:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="728px" img-content="tif" inline="yes" orientation="portrait" width="1019px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622815</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145628</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120241227B">G06N20/00</main-classification>
        <further-classification edition="201701120241227B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹燕越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, YAN-YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王聖文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王皓生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>考核系統及其操作方法</chinese-title>
        <english-title>ASSESSMENT SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種考核系統的操作方法，包括：模型訓練階段，模型訓練階段包含：拍攝螢幕裝置的第一影像；依據第一影像產生第一資料；接收第二資料；依據第一資料以及第二資料產生第一描述；以及依據第一描述產生演算法模型；以及考核階段，考核階段包含：拍攝螢幕裝置的第二影像；依據第二影像產生第三資料；接收第四資料；依據第三資料以及第四資料產生第二描述；以及依據第二描述產生考核結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operating method of an assessment system, comprising: a model training stage, the model training stage including: photographing a first image of a screen device; generating a first data according to the first image; receiving a second data; generating a first description according to the first data and the second data; and generating a algorithmic model according to the first description; and an assessment stage, the assessment stage including: photographing a second image of the screen device; generating a third data according to the second image; receiving a fourth data; generating a second description according to the third data and the fourth data; and generating an assessment result according to the second description.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:操作方法</p>
        <p type="p">601~607:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="728px" img-content="tif" inline="yes" orientation="portrait" width="929px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621993</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145629</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250321B">C01G23/047</main-classification>
        <further-classification edition="200601120250321B">C01G23/053</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙宰孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, CHE HOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙宰孝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, CHE HOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>製造二氧化鈦粉末的方法及由其製備的二氧化鈦粉末</chinese-title>
        <english-title>METHOD FOR MANUFACTURING TIO2 POWDER AND TIO2 POWDER PREPARED BY THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為了實現上述目的，根據本發明一實施例之製造二氧化鈦粉末的方法的一個態樣包括：從形成Ti-N層後的殘餘物中捕獲NH        &lt;sub&gt;3&lt;/sub&gt;及TiCl        &lt;sub&gt;4&lt;/sub&gt;；將NH        &lt;sub&gt;3&lt;/sub&gt;及TiCl        &lt;sub&gt;4&lt;/sub&gt;溶解於溶劑中以製備混合物；從混合物中獲得二氧化鈦及NH        &lt;sub&gt;4&lt;/sub&gt;Cl；以及從獲得的二氧化鈦及NH        &lt;sub&gt;4&lt;/sub&gt;Cl中分離出二氧化鈦粉末。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aspect of a method for manufacturing TiO        &lt;sub&gt;2&lt;/sub&gt;powder according to an embodiment of the present invention for achieving the above-described object is a method for manufacturing TiO        &lt;sub&gt;2&lt;/sub&gt;powder comprising: capturing NH        &lt;sub&gt;3&lt;/sub&gt;and TiCl        &lt;sub&gt;4&lt;/sub&gt;from a residue after forming a Ti-N layer; dissolving the NH        &lt;sub&gt;3&lt;/sub&gt;and TiCl        &lt;sub&gt;4&lt;/sub&gt;in a solvent to prepare a mixture; obtaining TiO        &lt;sub&gt;2&lt;/sub&gt;and NH        &lt;sub&gt;4&lt;/sub&gt;Cl from the mixture; and separating TiO        &lt;sub&gt;2&lt;/sub&gt;powder from the obtained TiO        &lt;sub&gt;2&lt;/sub&gt;and NH        &lt;sub&gt;4&lt;/sub&gt;Cl.      </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="420px" img-content="tif" inline="yes" orientation="portrait" width="513px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622004</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145633</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250103B">C02F3/30</main-classification>
        <further-classification edition="202301120250103B">C02F9/00</further-classification>
        <further-classification edition="200601120250103B">B01D69/02</further-classification>
        <further-classification edition="200601120250103B">B01D71/02</further-classification>
        <further-classification edition="200601120250103B">B01D61/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林正祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSENG-HSIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林正祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSENG-HSIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>陶瓷膜濾浮除(CMFF)廢水處理系統及其處理方法</chinese-title>
        <english-title>CERAMIC MEMBRANE FILTRATION-FLOTATION (CMFF) WASTEWATER TREATMENT SYSTEM AND TREATMENT METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種陶瓷膜濾浮除(CMFF)廢水處理系統及其處理方法，該方法包括：前處理步驟，對於存放在前處理槽中之待處理原水進行前處理，並得到一前處理出流水；生物CMFF處理步驟，對於被輸送至生物CMFF處理槽中之前處理出流水，利用陶瓷平板膜生物反應器(CMBR)去除有機污染物，並經由CMBR的微孔結構進行過濾，且藉由通過微孔結構所形成的奈米微氣泡，將前處理出流水中所含的油脂及其他疏水性污染物帶至水面形成浮渣及油脂濃縮物，以瞬間自然壓出浮渣與油脂；CMBR逆洗步驟，透過浮除逆洗單元的空壓輸入裝置        機所產生的壓縮氣體、及用以調節壓縮氣體的輸送之控制閥，對陶瓷平板膜生物反應器進行逆洗操作。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a ceramic membrane filtration-flotation (CMFF) wastewater treatment system and a treatment method thereof, which includes the following steps. Pre-treatment step: pre-treating the raw water stored in a pre-treatment tank to obtain pre-treated effluent. Biological flotation treatment step: transporting the pre-treated effluent to a biological treatment flotation tank to remove organic pollutants by a using the biological treatment flotation tank. The effluent is filtered through the microporous structure of the Ceramic Membrane Bioreactor (CMBR), and microbubbles formed by passing through the microporous structure bring oils and other hydrophobic pollutants in the pre-treated effluent to the water surface, forming scum and concentrated oil substances. CMBR backwashing step: performing a backwashing operation on the ceramic flat-plate membrane bioreactor using compressed air generated by an air compressor in the flotation backwashing unit, and regulating the delivery of the compressed air through control valves.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:陶瓷膜濾浮除(CMFF)廢水處理系統</p>
        <p type="p">10:原水儲槽</p>
        <p type="p">20:第一生物CMFF處理槽</p>
        <p type="p">30:浮除逆洗單元</p>
        <p type="p">40:清水槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="908px" img-content="tif" inline="yes" orientation="portrait" width="568px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623162</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145642</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">H02M1/14</main-classification>
        <further-classification edition="200601120250425B">H02M3/156</further-classification>
        <further-classification edition="200601120250425B">H02M7/217</further-classification>
        <further-classification edition="200601120250425B">G05F1/565</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹子增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, TZU-TSENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>高輸出穩定度之電源供應器</chinese-title>
        <english-title>POWER SUPPLY DEVICE WITH HIGH OUTPUT STABILITY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高輸出穩定度之電源供應器，包括：一橋式整流器、一升壓電感器、一功率切換器、一第一輸出級電路、一分壓電路、一切換電路、一變壓器、一諧振電容器、一第二輸出級電路，以及一偵測及控制電路。偵測及控制電路可致能變壓器之一主線圈之部份或全部，從而調整此變壓器之一降壓倍率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply device with high output stability includes a bridge rectifier, a boost inductor, a power switch element, a first output stage circuit, a voltage divider circuit, a switch circuit, a transformer, a resonant capacitor, a second output stage circuit, and a detection and control circuit. The detection and control circuit can enable a portion or all of a main coil of the transformer, thereby adjusting a voltage reduction rate of the transformer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源供應器</p>
        <p type="p">110:橋式整流器</p>
        <p type="p">120:功率切換器</p>
        <p type="p">130:第一輸出級電路</p>
        <p type="p">140:分壓電路</p>
        <p type="p">150:切換電路</p>
        <p type="p">160:變壓器</p>
        <p type="p">161:主線圈</p>
        <p type="p">164:第一副線圈</p>
        <p type="p">165:第二副線圈</p>
        <p type="p">170:第二輸出級電路</p>
        <p type="p">180:偵測及控制電路</p>
        <p type="p">CR:諧振電容器</p>
        <p type="p">DR:變壓器之降壓倍率</p>
        <p type="p">LM:激磁電感器</p>
        <p type="p">LR:漏電感器</p>
        <p type="p">LU:升壓電感器</p>
        <p type="p">VD:分壓電位</p>
        <p type="p">VE:中間電位</p>
        <p type="p">VG1:第一驅動電位</p>
        <p type="p">VG2:第二驅動電位</p>
        <p type="p">VG3:第三驅動電位</p>
        <p type="p">VIN1:第一輸入電位</p>
        <p type="p">VIN2:第二輸入電位</p>
        <p type="p">VL:電感電位</p>
        <p type="p">VOUT:輸出電位</p>
        <p type="p">VR:整流電位</p>
        <p type="p">VSS:接地電位</p>
        <p type="p">VW:切換電位</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="682px" img-content="tif" inline="yes" orientation="portrait" width="999px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622296</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145644</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">C25C7/00</main-classification>
        <further-classification edition="200601120250425B">C25C1/00</further-classification>
        <further-classification edition="200601120250425B">C25C3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏銘翬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, MING-HUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文錦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEN-JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王正全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂春福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周雅靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, YA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電析設備</chinese-title>
        <english-title>ELECTROLYSIS EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電析設備，包括：槽體，包括進料口、出料口、排氣孔與上方開口；分離式上蓋，覆蓋槽體的上方開口，且分離式上蓋包括朝向槽體的內側、相對於內側的外側與分離式上蓋的側邊；陽極裝置，以第一支架組固定於分離式上蓋的內側中；以及陰極裝置，以第二支架組可拆卸地固定於分離式上蓋的內側中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A electrolysis equipment is provided. The electrolysis equipment includes: a tank body, comprising an inlet, an outlet, an exhaust hole and an upper opening; a separable upper cover, covering the upper opening of the tank body, and the detachable upper cover comprises an inner side toward the tank body, an outer side relative to the inner side and a side of the detachable upper cover; an anode assembly, fixed in the inner side of the separable upper cover with a first bracket set; and a cathode assembly, detachably fixed in the inner side of the separable upper cover with a second bracket set.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電析設備</p>
        <p type="p">100:槽體</p>
        <p type="p">110:進料口</p>
        <p type="p">120:出料口</p>
        <p type="p">130:排氣孔</p>
        <p type="p">140:上方開口</p>
        <p type="p">150:槽體固定孔</p>
        <p type="p">200:分離式上蓋</p>
        <p type="p">200I:內側</p>
        <p type="p">200E:外側</p>
        <p type="p">200S:側邊</p>
        <p type="p">230:分離式上蓋固定孔</p>
        <p type="p">300:陽極裝置</p>
        <p type="p">300b:陽極鰭片</p>
        <p type="p">310:第一支架組</p>
        <p type="p">310V:第一垂直支架組</p>
        <p type="p">310H:第一平行支架組</p>
        <p type="p">400:陰極裝置</p>
        <p type="p">410:第二支架組</p>
        <p type="p">420:結合部件</p>
        <p type="p">H:高度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="905px" img-content="tif" inline="yes" orientation="portrait" width="645px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622714</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145646</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250319B">G06F3/041</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致伸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIMAX ELECTRONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韋強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹偉平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, WEI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>觸控板模組</chinese-title>
        <english-title>TOUCHPAD MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">觸控板模組包括支撐件、組裝電路板、間隔件及中間層。組裝電路板位於支撐件上方並包括至少一組導電圖案設置在其下表面上。該至少一組導電圖案包括彼此分離的第一及第二導電圖案。間隔件設置在支撐件與組裝電路板之間。間隔件為導電間隔件或者間隔件的上表面設有導電層。中間層設置在該至少一組導電圖案與間隔件之間並定義鏤空區域，以使該至少一組導電圖案透過鏤空區域面對導電間隔件或導電層。當觸控板模組被按壓時，第一導電圖案及第二導電圖案接觸導電間隔件或導電層，以使第一導電圖案與第二導電圖案透過導電間隔件或導電層彼此導通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch panel module includes a support member, a printed circuit board assembly, a spacer and an intermediate layer. The printed circuit board assembly is located over the support member and includes at least one set of conductive patterns disposed on a lower surface of the printed circuit board assembly. The at least one set of conductive patterns includes first and second conductive patterns separated from each other. The spacer is disposed between the support member and the printed circuit board assembly. The spacer is a conductive spacer, or an upper surface of the spacer is provided with a conductive layer. The intermediate layer is disposed between the least one set of conductive patterns and the spacer and defines a hollow region, so that the least one set of conductive patterns faces the conductive spacer or the conductive layer through the hollow region. When the touch panel module is pressed, the first and second conductive patterns are in contact with the conductive spacer or the conductive layer, so that the first and second conductive patterns are electrically connected to each other through the conductive spacer or the conductive layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:支撐件</p>
        <p type="p">120:組裝電路板</p>
        <p type="p">1201:組導電圖案</p>
        <p type="p">130:間隔件</p>
        <p type="p">140:中間層</p>
        <p type="p">140a:鏤空區域</p>
        <p type="p">150:蓋板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="502px" img-content="tif" inline="yes" orientation="portrait" width="999px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623349</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145647</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250109B">H10B12/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐文家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, WEN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭宇峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構及其形成方法，半導體結構包括基底、隔離部件以及第一型元件。隔離部件設置於鄰接基底的第一周邊區的溝槽中。隔離部件包括第一至第三襯層以及填充層。第一襯層覆蓋溝槽鄰接第一周邊區的側壁。第二襯層覆蓋第一襯層和側壁的下部。第三襯層覆蓋暴露出來的第一襯層。填充層填充溝槽，且覆蓋第二、第三襯層。第一型元件形成於第一周邊區中。在實質垂直於基底的頂面的方向上，第一型元件的第一源/汲極區的第一底面位於基底的頂面與第三襯層的第二底面之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a substrate, an isolation feature and a first-type device. The isolation feature is disposed in a trench adjacent to a first peripheral region of the substrate. The isolation feature includes first, second and third insulating liner layers and an insulating filling layer. The first insulating liner layer covers a sidewall of the trench adjacent to the first peripheral region. The second insulating liner layer covers the first insulating liner layer and a lower portion of the sidewall. The third insulating liner layer covers the exposed first insulating liner layer. The insulating filling layer fills the trench and covers the second and third insulating liner layers. The first-type device is formed in the first peripheral region. In a direction substantially perpendicular to a top surface of the substrate, a first bottom surface of a first source/drain region of the first-type device is located between the top surface of the substrate and a second bottom surface of the third insulating liner layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基底</p>
        <p type="p">200T:頂面</p>
        <p type="p">201:第一井區</p>
        <p type="p">202:第二井區</p>
        <p type="p">203:第三井區</p>
        <p type="p">204,204-1,204-2,204-3,204-4,204-5:溝槽</p>
        <p type="p">204-1B,204-2B,204-4B,211-B,428NB:底面</p>
        <p type="p">204-1S1,204-1S2,204-2S1,204-2S2,204-4S1,204-4S2:側壁</p>
        <p type="p">205b:摻雜區</p>
        <p type="p">206,206-1,206-2,206-3,206-4,206-5:隔離部件</p>
        <p type="p">206-1L,206-2L:第一半部</p>
        <p type="p">206-1R,206-2R:第二半部</p>
        <p type="p">208:第一襯層</p>
        <p type="p">210:第二襯層</p>
        <p type="p">211:第三襯層</p>
        <p type="p">212:填充層</p>
        <p type="p">212-1S,212-2S,212-4S1,212-4S2:側面</p>
        <p type="p">213,242:絕緣蓋層</p>
        <p type="p">230:字元線</p>
        <p type="p">248a,248b:接觸插塞</p>
        <p type="p">250:位元線</p>
        <p type="p">260:儲存電容</p>
        <p type="p">400:陣列區</p>
        <p type="p">406:周邊區</p>
        <p type="p">402:第一周邊區</p>
        <p type="p">404:第二周邊區</p>
        <p type="p">410:記憶體陣列</p>
        <p type="p">412N:第一型元件</p>
        <p type="p">412P:第二型元件</p>
        <p type="p">424N:第一閘極結構</p>
        <p type="p">428N:第一源/汲極區</p>
        <p type="p">424P:第二閘極結構</p>
        <p type="p">428P:第二源/汲極區</p>
        <p type="p">500:半導體結構</p>
        <p type="p">A1,A2,A3:主動區</p>
        <p type="p">C1,C2:中心軸</p>
        <p type="p">D1,D2,D3:深度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="726px" img-content="tif" inline="yes" orientation="portrait" width="1002px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622771</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145652</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120250303B">G06F16/70</main-classification>
        <further-classification edition="201901120250303B">G06F16/78</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王懷憶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUAI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳先達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIEN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林裕翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>大數量級影片的管理方法、電子裝置和電腦程式產品</chinese-title>
        <english-title>METHOD, ELECTRONIC DEVICE, AND COMPUTER PROGRAM PRODUCT FOR LARGE-SCALE VIDEO MANAGEMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種大數量級影片的管理方法，應用於監視系統，包括偵測事件且依據事件輸出大數量級影片；對大數量級影片標註複數標籤，標籤包括大數量級影片中至少一物件的複數屬性；接收影片搜尋資訊；比對影片搜尋資訊和大數量級影片的標籤的關聯性，且依據關聯性對應輸出複數推薦影片於終端裝置中，終端裝置包括顯示幕；偵測該顯示幕的解析度，以及依據解析度將推薦影片自適應播放於顯示幕上的使用者介面中。本揭露的方法使用最接近人類搜尋邏輯的屬性標籤索引技術，有效進行大數量級影片管理，依據輸入資訊自動搜尋出關聯性影片結果，極簡化搜尋流程並提升使用者體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A management method for large-scale videos, applied to a surveillance system, includes the following steps. An event is detected and large-scale videos are output based on the event. The large-scale videos are marked with multiple tags. The tags include multiple attributes of at least one object in the large-scale videos. Video search information is received. A correlation is compared between the video search information and the tags of the large-scale videos. Multiple recommended videos are output to a terminal device according to the correlation. The terminal device includes a display. A resolution of the display is detected. The recommended videos are adaptively played in a user interface on the display based on the resolution. The disclosed method uses attribute tag indexing technology that is closest to human search logic to effectively manage large-scale videos and automatically search for relevant video results based on input information, greatly simplifying the search process and improving user experience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100,S102,S104,S106,S108,S110,S1’,S2’:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="761px" img-content="tif" inline="yes" orientation="portrait" width="761px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621562</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145656</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A01K97/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶熊漁具股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張良任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭克帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電動捲線器搏魚數據圖像化之顯示系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動捲線器搏魚數據圖像化顯示系統，以一轉速檢出單元判定魚線收線、出線的線速度，並以一電流檢出單元及一電壓檢出單元分別檢出系統的電流值及電壓值，一記憶單元儲存一轉速關係表及一功率關係表，透過一係數計算單元將前述數值對應置入轉速關係表及功率關係表，計算出一線速度係數及一功率係數，再由搏魚數據算出單元將前述兩個係數整合計算出一搏魚數據，並將所算得搏魚數據整合爲一圖像化結果並顯示於一顯示裝置，使釣魚者可直觀了解魚的戰力，增加視覺刺激，令釣魚活動更具趣味性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:轉速檢出單元</p>
        <p type="p">11:第一轉速感測模組</p>
        <p type="p">12:第二轉速感測模組</p>
        <p type="p">2:電流檢出單元</p>
        <p type="p">3:電壓檢出單元</p>
        <p type="p">4:記憶單元</p>
        <p type="p">5:係數計算單元</p>
        <p type="p">6:搏魚數據算出單元</p>
        <p type="p">7:顯示裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="841px" img-content="tif" inline="yes" orientation="portrait" width="715px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622691</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145666</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250117B">G06F1/20</main-classification>
        <further-classification edition="200601120250117B">F16C11/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游瑞益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JUI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫惠平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HUI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫峻宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, CHUN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>闕延洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUEH, YEN-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可攜式電子裝置</chinese-title>
        <english-title>PORTABLE ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可攜式電子裝置，包括第一機體、第二機體、轉軸結構、齒條及磁性滑動板。第一機體具有第一開孔。轉軸結構設置於第一機體內，且包括轉軸與固定於轉軸的齒輪。齒條可滑動地設置於第一機體內，其中齒條嚙接於齒輪，且設有第一磁鐵。磁性滑動板可滑動地設置於第一機體內，其中磁性滑動板對應第一磁鐵設置於齒條的一側，且第一開孔位於磁性滑動板的滑動路徑上。第二機體通過轉軸可旋轉地連接於第一機體，且設有對應於磁性滑動板的第二磁鐵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A portable electronic device including a first body, a second body, a rotating shaft structure, a rack and a magnetic sliding plate is provided. The first body has a first opening. The rotating shaft structure is disposed in the first body and includes a rotating shaft and a gear fixed to the rotating shaft. The rack is slidably disposed in the first body, wherein the rack is engaged with the gear and is provided with a first magnet. The magnetic sliding plate is slidably disposed in the first body, wherein the magnetic sliding plate is disposed at one side of the rack corresponding to the first magnet, and the first opening is located on a sliding path of the magnetic sliding plate. The second body is rotatably connected to the first body through the rotating shaft and is provided with a second magnet corresponding to the magnetic sliding plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:可攜式電子裝置</p>
        <p type="p">110:第一機體</p>
        <p type="p">111:第一開孔</p>
        <p type="p">120:第二機體</p>
        <p type="p">121:第二磁鐵</p>
        <p type="p">130:轉軸結構</p>
        <p type="p">131:轉軸</p>
        <p type="p">132:齒輪</p>
        <p type="p">133:驅動凸部</p>
        <p type="p">140:齒條</p>
        <p type="p">141:第一磁鐵</p>
        <p type="p">150:磁性滑動板</p>
        <p type="p">160:活動板</p>
        <p type="p">161:從動凸部</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="653px" img-content="tif" inline="yes" orientation="portrait" width="933px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622692</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145667</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G06F1/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉政熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示卡</chinese-title>
        <english-title>DISPLAY CARD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示卡，包括架體、熱源、多個散熱鰭片、熱管、多個主風扇及輔助風扇。架體具有第一側、相對於第一側的第二側及連通於第一側與第二側的開口。熱源設置於架體的第一側。多個散熱鰭片並列設置於架體的第一側。熱源通過熱管熱耦接於多個散熱鰭片。多個主風扇設置於多個散熱鰭片上。輔助風扇對應開口設置於架體的第二側。各主風扇的旋轉軸線平行於輔助風扇的旋轉軸線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display card including a chassis, a heat source, a plurality of fins, a heat pipe, a plurality of main fans and an auxiliary fan is provided. The chassis has a first side, a second side opposite to the first side, and an opening communicated with the first side and the second side. The heat source is disposed at the first side of the chassis. The fins are arranged side by side at the first side of the chassis. The heat source is thermally coupled to the fins through the heat pipe. The main fans are disposed on the fins. The auxiliary fan is disposed at the second side of the chassis as corresponding to the opening. A rotation axis of each of the main fans is parallel to a rotation axis of the auxiliary fan.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示卡</p>
        <p type="p">110:架體</p>
        <p type="p">110a:第一區</p>
        <p type="p">110b:第二區</p>
        <p type="p">110c第三區</p>
        <p type="p">111:第一側</p>
        <p type="p">112:第二側</p>
        <p type="p">113:開口</p>
        <p type="p">120:熱源</p>
        <p type="p">130:散熱鰭片</p>
        <p type="p">140:熱管</p>
        <p type="p">150:第一主風扇</p>
        <p type="p">150a:第一旋轉軸線</p>
        <p type="p">151:第二主風扇</p>
        <p type="p">151a:第二旋轉軸線</p>
        <p type="p">152:第三主風扇</p>
        <p type="p">152a:第三旋轉軸線</p>
        <p type="p">160:輔助風扇</p>
        <p type="p">160a:第四旋轉軸線</p>
        <p type="p">170:電路板</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:排列方向</p>
        <p type="p">P1、P2、P3:排列間距</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="688px" img-content="tif" inline="yes" orientation="portrait" width="1038px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622893</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145668</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06T9/00</main-classification>
        <further-classification edition="201701120250303B">G06T7/70</further-classification>
        <further-classification edition="201701120250303B">G06T7/00</further-classification>
        <further-classification edition="200601220250303B">G11B27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞軒科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMTRAN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅國治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, KUO CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>影像處理方法、裝置以及電腦可讀取記錄媒體</chinese-title>
        <english-title>IMAGE PROCESSING METHOD AND APPARATUS AND COMPUTER-READABLE RECORDING MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像處理方法、裝置以及電腦可讀取記錄媒體。所述影像處理方法包括：判斷影像序列對應的場景，並基於所述場景對影像序列進行製作，而產生多媒體檔案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image processing method and apparatus and computer-readable recording medium are provided. The image processing method includes: determining a scene corresponding to an image sequence and performing a production on the image sequence based on the scene to generate a multimedia file.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S205~S210:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="253px" img-content="tif" inline="yes" orientation="portrait" width="597px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622889</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145669</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120250303B">G06T7/10</main-classification>
        <further-classification edition="201701120250303B">G06T7/00</further-classification>
        <further-classification edition="200601120250303B">G06T5/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHANG-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置與其合成影像產生方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND SYNTHETIC IMAGE GENERATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露揭示一種電子裝置與其合成影像產生方法。所述方法用於包括影像感測器的電子裝置，並包括下列步驟。於操作於預覽模式的期間，將影像感測器所擷取的多張原始圖幀記錄至一緩存器。當接收一拍照指令時，自緩存器中的多張原始圖幀之中提取多張連續圖幀。多張連續圖幀包括一基準圖幀與多張候選圖幀。透過對基準圖幀與各張候選圖幀進行特徵比對，從多張候選圖幀篩選出至少一經挑選圖幀。對基準圖幀與至少一經挑選圖幀進行影像合成處理，以產生符合一影像保存格式的最終拍照影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a synthetic image generation method thereof are provided. The method is adapted to the electronic device including an image sensor and includes the following steps. During operating in a preview mode, raw frames captured by the image sensor are recorded to a buffer. When a photographing instruction is received, consecutive frames are extracted from the raw frames in the buffer. The consecutive frames include a base frame and multiple candidate frames. By performing feature matching between the base frame and each of the candidate frames, at least one selected frame is selected from the candidate frames. Image composition processing is performed according to the base frame and the at least one selected frame to generate a final captured image that conforms to an image storage format.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S340:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="495px" img-content="tif" inline="yes" orientation="portrait" width="642px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623266</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145670</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">H04N23/70</main-classification>
        <further-classification edition="200601120250303B">G06T5/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華碩電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASUSTEK COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王妙維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MIAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊秀婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HSIU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王信智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置與其產生高動態範圍影像的曝光控制方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND EXPOSURE CONTROL METHOD FOR GENERATING HIGH DYNAMIC RANGE IMAGE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭示一種電子裝置與其產生高動態範圍影像的曝光控制方法。透過影像擷取裝置依據初始曝光值獲取第一影像。根據第一影像產生多個色彩通道的累積分布函數與亮度通道的累積分布函數。根據多個色彩通道的累積分布函數與亮度通道的累積分布函數，判斷各個色彩通道的曝光狀態是否過曝或曝光不足。當色彩通道其中之一的曝光狀態為過曝或曝光不足，根據多個色彩通道其中之一的累積分布函數與亮度通道的累積分布函數決定目標曝光值。根據目標曝光值擷取第二影像，並利用第一影像與第二影像合成一高動態範圍影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and a long-exposure video generation method thereof are provided. A first image is acquired by the image capture device based on an initial exposure value. Cumulative distribution functions (CDFs) of color channels and a CDF of a luminance channel are generated according to the first image. Based on the CDFs of the color channels and the luminance channel, whether an exposure status of each color channel is overexposed or underexposed is determined. When the exposure status of one of the color channels is overexposed or underexposed, a target exposure value is determined based on the CDF of the one of the color channels and the CDF of the luminance channel. A second image is captured based on the target exposure value, and a high dynamic range image is synthesized using the first image and the second image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S260:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="857px" img-content="tif" inline="yes" orientation="portrait" width="745px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623547</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145673</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260304B">H10P54/00</main-classification>
        <further-classification edition="202501120260304B">H10D62/10</further-classification>
        <further-classification edition="202601120260304B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何凱光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, KAI-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江孟庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, MENG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括晶粒套組、測試鍵設置區以及切割道。晶粒套組包括複數個晶粒，各晶粒具有正多邊形狀。其中各晶粒具有複數個側邊，且側邊的數量為四的倍數且大於四。測試鍵設置區設置在晶粒之間且鄰接各晶粒的一側邊。測試鍵設置區具有等邊多邊形狀。切割道環繞地設置在各晶粒的外緣及測試鍵設置區的外緣上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a multi-die package, a testkey region, and a scribe line. The multi-die package includes a plurality of dies each in a regular polygon shape, wherein each of the plurality of dies includes a number of sides, and the number is a multiplier of four and is greater than four. The testkey region is disposed between the plurality of dies and adjacent to one side of each of the plurality of dies. The testkey region is in an equilateral polygon shape. The scribe line surrounds a periphery of each of the plurality of dies and a periphery of the testkey region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">110:晶粒套組</p>
        <p type="p">120:晶粒</p>
        <p type="p">122:側邊</p>
        <p type="p">130:測試鍵設置區</p>
        <p type="p">132:側邊</p>
        <p type="p">134:測試鍵結構</p>
        <p type="p">140:切割道</p>
        <p type="p">W1:寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="871px" img-content="tif" inline="yes" orientation="portrait" width="689px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622616</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145686</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250219B">G02F1/1337</main-classification>
        <further-classification edition="200601120250219B">G02F1/1347</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凌巨科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIANTPLUS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳哲耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHE-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周凱茹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, KAI-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江宜達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, I-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具穿透區的顯示面板</chinese-title>
        <english-title>DISPLAY PANEL WITH LIGHT-TRANSMITTING AREA</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種具穿透區的顯示面板，包括第一平坦層、第一透光導電層、反射層、液晶層、第二透光導電層、第二平坦層及二配向膜。第一透光導電層設置於第一平坦層上。反射層設置於第一透光導電層上，第一透光導電層上不具有反射層的區域定義穿透開口。液晶層位於反射層上，液晶層中摻雜掌性分子。第二透光導電層位於液晶層上。二配向膜分別位於反射層及液晶層之間，及位於第二透光導電層與液晶層之間，至少一配向膜施予接觸的液晶定向力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel with a penetration area includes a first flat layer, a first light-transmitting conductive layer, a reflective layer, a liquid crystal layer, a second light-transmitting conductive layer, a second flat layer and two alignment films. The first light-transmitting conductive layer is provided on the first flat layer. The reflective layer is provided on the first light-transmitting conductive layer, and a area on the first light-transmitting conductive layer that without reflective layer defines a transmitting opening. The liquid crystal layer is provided on the reflective layer, and the liquid crystal layer is doped with chiral molecules. The second light-transmitting conductive layer is provided on the liquid crystal layer. The two alignment films are respectively located between the reflective layer and the liquid crystal layer, and between the second light-transmitting conductive layer and the liquid crystal layer. At least one alignment film exerts an orientation force on the liquid crystal in contact.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Z1:具穿透區的顯示面板</p>
        <p type="p">1:第一透光基板</p>
        <p type="p">1a:頂面</p>
        <p type="p">1b:底面</p>
        <p type="p">11:薄膜電晶體陣列</p>
        <p type="p">2:第一平坦層</p>
        <p type="p">3:第一透光導電層</p>
        <p type="p">4:反射層</p>
        <p type="p">5:液晶層</p>
        <p type="p">51:液晶</p>
        <p type="p">52:掌性分子</p>
        <p type="p">6:第二透光導電層</p>
        <p type="p">7:第二平坦層</p>
        <p type="p">8:濾光片</p>
        <p type="p">9:第二透光基板</p>
        <p type="p">D1:水平方向</p>
        <p type="p">D2:垂直方向</p>
        <p type="p">F1:第一定向力</p>
        <p type="p">L1:長度</p>
        <p type="p">PI1:第一配向膜</p>
        <p type="p">PI2:第二配向膜</p>
        <p type="p">Tr:穿透開口</p>
        <p type="p">W:寬度</p>
        <p type="p">α:定位夾角</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="719px" img-content="tif" inline="yes" orientation="portrait" width="993px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621773</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145694</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250214B">A63H33/04</main-classification>
        <further-classification edition="200601120250214B">G09B19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台南家專學校財團法人台南應用科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬彩瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭紋忻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庭葳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳中聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝依良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>積木教具的製造方法及積木教具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積木教具的製造方法，將聚集並且同品種的落葉清潔並且乾燥之後製成小碎片及／或粉狀的碎葉單元，進一步將所述碎葉單元與增量粉末、黏著劑、與碎葉單元相同品種的木粉末以及水混合成可塑形材料，透過模具將所述可塑形材料製成與碎葉單元相同品種的樹木的葉子形狀的一個積木教具。所述積木教具包括一個底座以及一個葉片部分，所述葉片部分由複數個塊拼合能夠形成與所述碎葉單元相同品種的樹葉外形，所述積木教具進一步還能散發與所述碎葉單元相同品種的樹葉的味道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S111:聚集相同品種的樹葉</p>
        <p type="p">S113:清潔樹葉</p>
        <p type="p">S115:乾燥步驟</p>
        <p type="p">S117:粉碎步驟</p>
        <p type="p">S119:混合原料步驟</p>
        <p type="p">S131:塑形步驟</p>
        <p type="p">S133:脫模步驟</p>
        <p type="p">S135:防水處理步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="856px" img-content="tif" inline="yes" orientation="portrait" width="553px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623324</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145698</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250731B">H05K1/14</main-classification>
        <further-classification edition="200601120250731B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威盛電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIA TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐業奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YEH-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林高田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, GAO-TIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝秉勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, PING-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁閎森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, HUNG-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>線路基板</chinese-title>
        <english-title>CIRCUIT SUBSTRATE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種線路基板，包括核心板、彼此堆疊的第一介電層、彼此堆疊的第二介電層以及第一導線。第一介電層設置核心板上。第一介電層以及第二介電層由不同的材料形成且具有不同的厚度。第一導線設置於第一介電層以及第二介電層中。第一導線包括第一線段、第二線段、彼此堆疊的第一導電孔以及彼此堆疊的第二導電孔。第一線段、第二線段設置於第一介電層、第二介電層之間。第一導電孔貫穿第一介電層，且連接第一線段。第二導電孔貫穿第二介電層，且連接第一導電孔以及第二線段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit substrate is provided. The circuit substrate includes a core substrate, first dielectric layers stacked on each other, second dielectric layers stacked on each other, and a first conductive line. The first dielectric layers are disposed on the core substrate. The first dielectric layers and the second dielectric layers are formed of different materials and have different thicknesses. The first conductive line is disposed in the first dielectric layers and the second dielectric layers. The first conductive line includes a first line segment, a second line segment, first conductive vias stacked on each other, and second conductive vias stacked on each other. The first line segment and the second line segment are disposed between the first dielectric layers and the second dielectric layers. The first conductive vias penetrate the first dielectric layers. The first conductive vias are connected the first line segment. The second conductive vias penetrate the second dielectric layers. The second conductive vias are connected the first conductive vias and the second line segment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:核心板</p>
        <p type="p">200T:第一表面</p>
        <p type="p">200B:第二表面</p>
        <p type="p">200V:核心導電通孔</p>
        <p type="p">210,210T,210B,220,230:介電層</p>
        <p type="p">222,232:防焊層</p>
        <p type="p">240T,240B:內佈線結構</p>
        <p type="p">250T,250B:外佈線結構</p>
        <p type="p">260:導電凸塊</p>
        <p type="p">270:焊錫凸塊</p>
        <p type="p">500A:線路基板</p>
        <p type="p">CL1,CL2:導線</p>
        <p type="p">CL1-1,CL1-2,CL2-1,CL2-2:線段</p>
        <p type="p">D1,D2:直徑</p>
        <p type="p">D100,D110,D120:方向</p>
        <p type="p">GL:接地層</p>
        <p type="p">L1,L2,L3,L4,L5,L6,L7,L8,L9,L10,L11,L12,L13,L14,L15,L16,L17,L18:層別</p>
        <p type="p">P1,P2:線長</p>
        <p type="p">T210,T220,T230:厚度</p>
        <p type="p">TV1-1,TV1-2,TV1-3,TV2-1,TV2-2,TV2-3:導電孔堆疊</p>
        <p type="p">TV1-1A,TV1-1B,TV1-2A,TV1-3A,TV1-3B,TV2-1A,TV2-1B,TV2-2A,TV2-3A,TV2-3B:導電孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="761px" img-content="tif" inline="yes" orientation="portrait" width="1033px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621651</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145699</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A61C7/08</main-classification>
        <further-classification edition="200601120241231B">A63B71/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHENG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHENG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>護齒器</chinese-title>
        <english-title>MOUTH GUARD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種護齒器，適合配戴於上牙齒列，包括基礎部、外周壁、內周壁及兩個橫向限位部。基礎部具有第一側及與第一側相對的第二側。外周壁及內周壁分別沿著基礎部的外周緣側及內周緣側形成，並且從基礎部的第一側突出。複數個齒槽部形成於基礎部的第一側，位於外周壁及內周壁之間，用於接收上牙齒列中的各個牙齒。兩個橫向限位部沿著基礎部的外周緣側形成，並且從基礎部的第二側突出。其中，兩個橫向限位部分別對應於上牙齒列中的左右的犬齒，且兩個橫向限位部各自的最底部分比基礎部的第二側對應於上牙齒列中的正門牙位置的部分更低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mouth guard suitable for wearing on the upper dentition is provided, including a base part, an outer peripheral wall, an inner peripheral wall and two lateral limiting parts. The base part has a first side and a second side opposite to the first side. The outer peripheral wall and the inner peripheral wall are respectively formed along the outer peripheral side and the inner peripheral side of the base part, and protrude from the first side of the base part. A plurality of tooth grooves are formed on the first side of the base part, between the outer peripheral wall and the inner peripheral wall, for receiving each tooth in the upper dentition. The two lateral limiting parts are formed along the outer peripheral side of the base part and protrude from the second side of the based part. The two lateral limiting parts respectively correspond to the left and right canine teeth in the upper dentition, and the bottom portion of each of the two lateral limiting parts is lower than the portion of the second side of the base part corresponding to the position of the front incisors in the upper dentition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:護齒器</p>
        <p type="p">12:基礎部</p>
        <p type="p">12B:咬合側</p>
        <p type="p">14:外周壁</p>
        <p type="p">16:內周壁</p>
        <p type="p">16A:內周上部壁</p>
        <p type="p">161:部分</p>
        <p type="p">17:端部/後端</p>
        <p type="p">20:橫向限位部</p>
        <p type="p">22:斜坡面/引導面</p>
        <p type="p">23:最底部分</p>
        <p type="p">A-A:線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="743px" img-content="tif" inline="yes" orientation="portrait" width="942px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622977</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145704</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250319B">G11C16/10</main-classification>
        <further-classification edition="200601120250319B">G11C16/34</further-classification>
        <further-classification edition="200601120250319B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華邦電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINBOND ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>快閃記憶體裝置及其編程方法</chinese-title>
        <english-title>FLASH MEMORY DEVICE AND PROGRAM METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種快閃記憶體裝置及其編程方法。所述編程方法包括下列步驟：從多個記憶體區域中選擇出要進行編程操作的目標記憶體區域，其中目標記憶體區域被劃分為多個記憶胞群組；對目標記憶體區域執行編程驗證；以及在目標記憶體區域未通過編程驗證的情況下，將記憶胞群組的其中一者的編程時間區段設置為與記憶胞群組的其中另一者的編程時間區段重疊，據此依序對記憶胞群組進行編程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A flash memory device and a program method thereof are provided. The program method includes following steps: selecting a target memory area to be performed program operation from a plurality of memory areas, where the target memory area is divided into a plurality of memory cell groups; performing a program verification on the target memory area; and in a state that the target memory area fails the program verification, setting a programming time period of one of the memory cell groups to overlap with a programming time period of the other one of the memory cell groups, and accordingly programing the memory cell groups.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S200~S204:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="482px" img-content="tif" inline="yes" orientation="portrait" width="642px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622869</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145711</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250219B">G06Q40/04</main-classification>
        <further-classification edition="202301120250219B">G06Q40/00</further-classification>
        <further-classification edition="202301120250219B">G06N5/04</further-classification>
        <further-classification edition="201901120250219B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國信託商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CTBC BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹正城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊程予</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張碩文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許元銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王秀君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周錫彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於金融投資推薦的預測模型建立方法及運算裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於金融投資推薦的預測模型建立方法，藉由一包含一處理模組的運算裝置來實施，並包含以下步驟，該處理模組根據一交易時間區間獲得多個待分析客戶資料，對於每一指數公司，該處理模組根據該指數公司獲得多個指數報酬率，對於每一待分析客戶資料，該處理模組根據該待分析客戶資料之該交易紀錄與該數位歷程，及該等指數報酬率獲得一交易標的訓練資料中的特徵資料，並根據該待分析客戶資料所對應之金融商品獲得該交易標的訓練資料的標註結果，且根據該等交易標的訓練資料利用一機器學習演算法獲得一交易標的預測模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">13:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="394px" img-content="tif" inline="yes" orientation="portrait" width="614px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621781</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>113145713</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250214B">B01D46/24</main-classification>
        <further-classification edition="200601120250214B">B01D46/42</further-classification>
        <further-classification edition="202201120250214B">B01D50/00</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎朋企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>X'POLE PRECISION TOOLS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鼎耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, DING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾煥鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HUAN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>研磨工具機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
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      <isu-abst lang="tw">
        <p type="p">一種研磨工具機，具有一工具機本體，一馬達，一第一風流產生件，一研磨盤，及一連接該工具機本體的集塵件，該集塵件包含一面向該研磨盤的集塵罩，及一連接該集塵罩的集塵銜接管，該第一風流產生件啟動時形成一由該集塵罩向該集塵銜接管流動的第一氣流。該研磨工具機具有至少一設於該工具機本體的進氣口，一連通該集塵銜接管的通道，及一設於該通道的第二風流產生件，該第二風流產生件啟動時形成一由該至少一進氣口向該集塵銜接管流動的第二氣流，該第二氣流與該第一氣流共同形成一集塵氣流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:研磨工具機</p>
        <p type="p">21:工具機本體</p>
        <p type="p">211:頭部</p>
        <p type="p">212:握持部</p>
        <p type="p">23:第一風流產生件</p>
        <p type="p">231:第一扇葉</p>
        <p type="p">232:第二扇葉</p>
        <p type="p">24:研磨盤</p>
        <p type="p">25:集塵件</p>
        <p type="p">251:集塵罩</p>
        <p type="p">252:集塵銜接管</p>
        <p type="p">258:第二端口</p>
        <p type="p">26:偏心塊</p>
        <p type="p">27:進氣口</p>
        <p type="p">28:通道</p>
        <p type="p">29:第二風流產生件</p>
        <p type="p">291:進風側</p>
        <p type="p">292:出風側</p>
        <p type="p">30:安裝座</p>
        <p type="p">33:散熱孔</p>
        <p type="p">36:通氣孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="986px" img-content="tif" inline="yes" orientation="portrait" width="762px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <isuno>11</isuno>
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        <document-id>
          <doc-number>202621853</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145714</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B24B55/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鼎朋企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>X'POLE PRECISION TOOLS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭鼎耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, DING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾煥鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HUAN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>附掛於研磨工具機上的集塵件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種附掛於研磨工具機上的集塵件，包含一主體，一連接該主體的輔助管及一風流產生件，該主體內部中空並定義出一第一氣流通道，該輔助管具有一與該第一氣流通道連通的第二氣流通道，及至少一遠離該第一氣流通道並與外部連通的進氣口，該風流產生件設於該第二氣流通道內，該風流產生件啟動後導引外部氣體由該至少一進氣口經該第二氣流通道進入該第一氣流通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:集塵件</p>
        <p type="p">21:主體</p>
        <p type="p">213:入氣口</p>
        <p type="p">214:出氣口</p>
        <p type="p">22:輔助管</p>
        <p type="p">221:第二氣流通道</p>
        <p type="p">222:進氣口</p>
        <p type="p">224:管體</p>
        <p type="p">225:擋蓋</p>
        <p type="p">23:風流產生件</p>
        <p type="p">232:進風側</p>
        <p type="p">233:出風側</p>
        <p type="p">24:集塵罩</p>
        <p type="p">241:組裝口</p>
        <p type="p">25:集塵袋</p>
        <p type="p">251:袋口</p>
        <p type="p">252:銜接管</p>
        <p type="p">26:延伸管</p>
        <p type="p">261:管件</p>
        <p type="p">27:過濾件</p>
        <p type="p">28:凸塊</p>
        <p type="p">281:翼部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="1018px" img-content="tif" inline="yes" orientation="portrait" width="788px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622015</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>113145715</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C03C17/23</main-classification>
        <further-classification edition="202001120241220B">C08J7/04</further-classification>
        <further-classification edition="201501120241220B">G02B1/113</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMOSA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊博名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敬遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾文宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, WEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳玉振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文筆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, WEN-BEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何榮銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, RONG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張証彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷可忻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, KE-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>抗反射薄膜的製造方法</chinese-title>
        <english-title>METHOD OF FORMING ANTI-REFLECTION THIN FILM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抗反射薄膜的製造方法。方法包含提供基材；浸潤塗佈或旋轉塗佈嵌段共聚物在基材上，並使嵌段共聚物形成網狀結構薄膜，其中嵌段共聚物包含聚苯乙烯以及聚左旋乳酸；對網狀結構薄膜進行水解操作，以去除聚左旋乳酸，而形成多孔聚苯乙烯模板；添加二氧化矽前驅物至多孔聚苯乙烯模板中，以進行溶膠凝膠反應，從而形成聚苯乙烯-二氧化矽混成材料；以及移除多孔聚苯乙烯模板，以形成抗反射薄膜。藉此，可製得具有較佳抗反射性質的抗反射薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming an anti-reflection thin film is provided. The method includes providing a substrate; dip coating or spin coating a block copolymer on the substrate, and making the block copolymer form a network structure thin film, in which the block copolymer includes polystyrene and poly-L-lactic acid; performing a hydrolysis operation to the network structure thin film to remove the poly-L-lactic acid, thereby forming a porous polystyrene framework; adding a silicon dioxide precursor into the porous polystyrene framework to perform a sol-gel process, thereby forming a PS-SiO        &lt;sub&gt;2&lt;/sub&gt;hybrid material; and removing the porous polystyrene framework to form the anti-reflection thin film. Therefore, the anti-reflection thin film with better anti-reflection property can be obtained.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110,120,130,140,150:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="672px" img-content="tif" inline="yes" orientation="portrait" width="862px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202623328</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>113145716</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
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        <main-classification edition="202501120250306B">H05K5/00</main-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宜穆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YI-MU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, WEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林梓偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王友史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-SHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, DONG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>殼體結構</chinese-title>
        <english-title>HOUSING STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種殼體結構，包括第一殼件、第二殼件及輔助殼件。第一殼件具有第一側向定位部與貫穿第一側向定位部的定位孔。第二殼件具有對應第一側向定位部設置的第二側向定位部與凸出於第二側向定位部的定位柱。第二殼件安裝於第一殼件，且定位柱穿過定位孔。輔助殼件套接於第一側向定位部與第二側向定位部，並與定位柱相卡合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A housing structure including first housing member, a second housing member, and an auxiliary housing member is provided. The first housing member has a first lateral positioning portion and a positioning hole penetrating the first lateral positioning portion. The second housing member has a second lateral positioning portion disposed as corresponding to the first lateral positioning portion and a positioning post protruding from the second lateral positioning portion. The second housing member is mounted to the first housing member, and the positioning post passes through the positioning hole. The auxiliary housing member is sleeved on the first lateral positioning portion and the second lateral positioning portion and is engaged with the positioning post.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一殼件</p>
        <p type="p">111:第一側向定位部</p>
        <p type="p">1111:第一表面</p>
        <p type="p">1112:第二表面</p>
        <p type="p">112:定位孔</p>
        <p type="p">120:第二殼件</p>
        <p type="p">121:第二側向定位部</p>
        <p type="p">1211:第一板部</p>
        <p type="p">1212:第二板部</p>
        <p type="p">122:定位柱</p>
        <p type="p">130:輔助殼件</p>
        <p type="p">131:輔助定位孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="681px" img-content="tif" inline="yes" orientation="portrait" width="934px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623676</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145717</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260203B">H10W72/20</main-classification>
        <further-classification edition="202601120260203B">H10W70/62</further-classification>
        <further-classification edition="202601120260203B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南茂科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPMOS TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JUI-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江咏芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YONG-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>薄膜覆晶封裝結構</chinese-title>
        <english-title>CHIP ON FILM PACKAGE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">薄膜覆晶封裝結構包括可撓性基底、多個引腳以及晶片。可撓性基底具有晶片接合區。多個引腳設置於可撓性基底上且各引腳具有延伸至晶片接合區內的內引腳部，其中多個引腳包括第一引腳，第一引腳的第一內引腳部具有開孔。晶片設置於晶片接合區中，其中晶片具有多個凸塊，多個凸塊分別對應連接多個引腳的內引腳部並分別具有與內引腳部重疊的內引腳接合區。多個凸塊包括第一凸塊，第一凸塊與第一內引腳部對應連接並具有第一內引腳接合區，且開孔在第一凸塊上的正投影位於第一內引腳接合區內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip on film package structure includes a flexible substrate, a plurality of leads and a chip. The flexible substrate has a chip mounting area. The plurality of leads is disposed on the flexible substrate and each of the leads has an inner lead portion extending to the chip mounting area. The plurality of leads includes a first lead. A first inner lead portion of the first lead has an opening. The chip is disposed in the chip mounting area. The chip has a plurality of bumps. The bumps are connected correspondingly to the inner lead portions of the leads respectively and have inner lead connection areas overlapping the inner lead portions respectively. The plurality of bumps includes a first bump. The first bump is connected correspondingly with the first inner lead portion and has a first inner lead connection area. An orthogonal projection of the opening on the first bump is located within the first inner lead connection area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110s1,110s2:長邊</p>
        <p type="p">112a:第一內引腳部</p>
        <p type="p">130s1,130s2,S1,S2,S3,S4:邊</p>
        <p type="p">132:第一凸塊</p>
        <p type="p">132a:第一內引腳接合區</p>
        <p type="p">140:金屬共晶層</p>
        <p type="p">L1,L2:長度</p>
        <p type="p">OP:開孔</p>
        <p type="p">W1,W3,W5:寬度</p>
        <p type="p">x,y:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="663px" img-content="tif" inline="yes" orientation="portrait" width="676px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622626</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145718</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250218B">G03F1/36</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯華電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITED MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭欣宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, HSIN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃品翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PIN HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MING-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>產生光學鄰近校正圖案的方法</chinese-title>
        <english-title>METHOD FOR GENERATING OPTICAL PROXIMITY CORRECTION PATTERN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種產生光學鄰近校正圖案的方法，其包括以下步驟。提供佈局圖案。佈局圖案包括位於邊緣區域中的第一單元圖案以及位於中央區域中的第二單元圖案。建立對應於第一單元圖案以及中央區域的與邊緣區域相鄰的邊緣部分中的第二單元圖案的第一光學鄰近校正子圖案。建立對應於第二單元圖案的第二光學鄰近校正子圖案。形成覆蓋邊緣區域以及邊緣部分的標記。識別邊緣區域，並根據所述第一光學鄰近校正子圖案而獲得第一光學鄰近校正圖案。根據標記來識別除邊緣部分之外的中央區域，並根據第二光學鄰近校正子圖案而獲得第二光學鄰近校正圖案。組合第一光學鄰近校正圖案與第二光學鄰近校正圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for generating an optical proximity correction pattern is provided. The method includes the following steps. A layout pattern including a first unit pattern in an edge region and second unit patterns in a central region. A first OPC sub-pattern corresponding to the first unit pattern and the second unit patterns in an edge portion of the central region adjacent to the edge region and a second OPC sub-pattern corresponding to the second unit pattern are built. A mark covering the edge region and the edge portion is formed. The edge region is identified, and a first OPC pattern is obtained according to the first OPC sub-pattern. The central region except the edge portion is identified according to the mark, and a second OPC pattern is obtained according to the second OPC sub-pattern. The first OPC pattern and the second OPC pattern are combined.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S102、S104、S106、S108:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="606px" img-content="tif" inline="yes" orientation="portrait" width="529px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621919</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145720</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">B60Q1/26</main-classification>
        <further-classification edition="200601120250303B">B60Q9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汯益光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONGYI OPTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀唐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YAO-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林家榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子鈺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>盲點偵測裝置</chinese-title>
        <english-title>BLIND SPOT DETECTION DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種盲點偵測裝置，包括後照鏡、電致發光量子點元件以及封膠層。後照鏡具有凹槽以及對應凹槽的透光區，電致發光量子點元件對應設置於凹槽處。封膠層設置在電致發光量子點元件和後照鏡之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A blind spot detection device includes a rearview mirror, an electroluminescent quantum dot element and a sealant layer. The rearview mirror has a groove and a light transmitting area corresponding to the groove, and the electroluminescent quantum dot element is disposed corresponding to the groove. The sealant layer is disposed between the electroluminescent quantum dot element and the rearview mirror.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電致發光量子點元件</p>
        <p type="p">110:後照鏡</p>
        <p type="p">120:封膠層</p>
        <p type="p">d,d’,D:寬度</p>
        <p type="p">OP:凹槽</p>
        <p type="p">t1:第一厚度</p>
        <p type="p">t2:第二厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="503px" img-content="tif" inline="yes" orientation="portrait" width="720px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622368</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145722</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241223B">F04D29/28</main-classification>
        <further-classification edition="200601120241223B">F04D29/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉今</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林光華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUANG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>離心式散熱風扇</chinese-title>
        <english-title>CENTRIFUGAL HEAT DISSIPATION FAN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種離心式散熱風扇，包括殼體與葉輪。葉輪可旋轉地設置於殼體內。葉輪具有輪轂及從輪轂延伸出的多個葉片。葉片環繞輪轂排列。各葉片的表面具有至少一基部及突出於基部的隆起部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A centrifugal heat dissipation fan including a housing and a blade wheel is provided. The blade wheel is rotatably disposed in the housing. The blade wheel has a hub and a plurality blades extending from the hub, and the blades are arranged around the hub. A surface of each blade has a base portion and a protrusion portion protruding from the base portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:葉輪</p>
        <p type="p">111:輪轂</p>
        <p type="p">112:葉片</p>
        <p type="p">113:靜音環</p>
        <p type="p">120:殼體</p>
        <p type="p">121:蓋板</p>
        <p type="p">122:底座</p>
        <p type="p">AX:旋轉軸向</p>
        <p type="p">121a、122a:入風口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="1027px" img-content="tif" inline="yes" orientation="portrait" width="730px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623639</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145723</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/10</main-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林光華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUANG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉今</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子封裝結構及其製作方法</chinese-title>
        <english-title>ELECTRONIC PACKAGE STRUCTURE MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝結構，包括基板、第一電子元件、至少一第二電子元件，液態金屬、散熱件、背材以及絕緣膠。第一電子元件與第二電子元件分別配置於基板上而彼此相鄰。液態金屬配置於第一電子元件上。散熱件配置於第一電子元件上且抵壓液態金屬，第一電子元件所產生的熱經由液態金屬傳送至散熱件。背材具透光性與絕緣性。絕緣膠塗佈於背材且隨背材貼附至基板，以使絕緣膠覆蓋且密封第二電子元件，其中受抵壓的液態金屬的至少部分溢出第一電子元件且被絕緣膠與背材隔絕於第二電子元件之外。另提及電子封裝結構的製作方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package structure including a substrate, a first electronic element, at least one second electronic element, a liquid metal disposed on the first electronic element, a heat dissipating member disposed on the first electronic element to squeeze the liquid metal, a carrier being transparent and electrically insulating, and an electrically insulating glue coated on the carrier is provided. The first and the second electronic elements next to each other are respectively disposed on the substrate. The carrier and the electrically insulating glue thereon are pasted on the substrate to cover and package the second electronic element. A portion of the liquid metal overflew out of the first electronic element are isolated from the second electronic element via the carrier and the electrically insulating glue. A manufacturing method of electronic package structure is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子封裝結構</p>
        <p type="p">110:基板</p>
        <p type="p">120:擋牆</p>
        <p type="p">121:部件一</p>
        <p type="p">122:部件二</p>
        <p type="p">130:絕緣覆蓋件</p>
        <p type="p">131:絕緣膠</p>
        <p type="p">132:背材</p>
        <p type="p">140:液態金屬</p>
        <p type="p">150:散熱件</p>
        <p type="p">160:第一電子元件</p>
        <p type="p">170:第二電子元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="452px" img-content="tif" inline="yes" orientation="portrait" width="721px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623687</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145724</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W40/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉今</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林光華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUANG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子封裝結構及其製作方法</chinese-title>
        <english-title>ELECTRONIC PACKAGE STRUCTURE MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子封裝結構，包括基板、第一電子元件、至少一第二電子元件、擋牆、絕緣膠、液態金屬以及散熱件。第一電子元件與第二電子元件分別配置於基板上且彼此相鄰。擋牆配置於基板上且環繞第一電子元件與第二電子元件。絕緣膠配置於基板上且位於第一電子元件與擋牆之間。絕緣膠覆蓋且密封第二電子元件。液態金屬配置於第一電子元件上。散熱件配置於第一電子元件上且抵壓液態金屬。第一電子元件所產生的熱經由液態金屬傳送至散熱件。另提供電子封裝結構的製作方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic package structure including a substrate, a first electronic element, at least one second electronic element, a wall, an electrically insulating glue, a liquid metal, and a heat dissipating member is provided. The first electronic element and the second electronic element are disposed on the substrate respectively and next to each other. The wall disposed on the substrate surrounds the first and the second electronic elements. The electrically insulating glue is disposed on the substrate and filled between the first electronic elements and the wall to cover and seal the second electronic element. The liquid metal is disposed on the first electronic element. The heat dissipating member is disposed on the first electronic element and squeezes the liquid metal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子封裝結構</p>
        <p type="p">110:基板</p>
        <p type="p">120:擋牆</p>
        <p type="p">150:散熱件</p>
        <p type="p">160:第一電子元件</p>
        <p type="p">170:第二電子元件</p>
        <p type="p">A-A:剖線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="534px" img-content="tif" inline="yes" orientation="portrait" width="556px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622916</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145725</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250922B">G06V40/10</main-classification>
        <further-classification edition="202201120250922B">G06V40/60</further-classification>
        <further-classification edition="202201120250922B">G06V10/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人資訊工業策進會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡政鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許群昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳右穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOU-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瀚林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王牧華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴宏達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, HUNG-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃亮維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LIANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>使用單一影像擷取器之人體骨架辨識裝置及方法</chinese-title>
        <english-title>HUMAN SKELETON RECOGNITION DEVICE USING SINGLE IMAGE CAPTURE AND METHOD OF THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種使用單一影像擷取器之人體骨架辨識裝置，包含單一個影像擷取器及一處理器。單一個影像擷取器朝向人體的第一面設置，以擷取人體的待辨識影像；其中，待辨識影像中包含有人體之第一面成像、第一鏡面反射成像以及第二鏡面反射成像，第一鏡面反射成像係人體之第一側面反射的側面成像，第二鏡面反射成像係人體之第二側面反射的側面成像。處理器連接影像擷取器，接收影像擷取器擷取之待辨識影像；其中，處理器識別在第一面成像、第一鏡面反射成像及第二鏡面反射成像中人體之複數關節特徵，並判斷該些關節特徵是否有被遮蔽；當處理器判斷第一面成像、第一鏡面反射成像及第二鏡面反射成像中有至少一關節特徵被遮蔽時，處理器融合未被遮蔽之該些關節特徵，以還原被遮蔽之至少一關節特徵，並根據融合還原後之該些關節特徵產生骨架特徵，以及根據骨架特徵建立人體之三維骨架特徵模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a human skeleton recognition device using a single image capturer. The human skeleton recognition device comprises a single image capturer and a processor. The single image capturer is disposed toward a first side of the human to capture an image. The image comprises a first side focus, a first mirror reflection focus, and a second mirror reflection focus. The processor is connected to the single image capturer and receives the image captured by the single image capturer. The processor identifies a plurality of joint features of the human in the first side focus, the first mirror reflection focus, and the second mirror reflection focus. The processor further determines whether the plurality of joint features are covered with a body of the human. When the processor determines that at least one of the joint features in the first side focus, the first mirror reflection focus, and the second mirror reflection focus is covered by the body, the processor fuses the joint features being not covered by the body to recover the joint feature covered by the body in the first side focus, the first mirror reflection focus, and the second mirror reflection focus. Moreover, the processor fuses the recovered joint features to build a skeleton feature and builds a three-dimension skeleton feature model according to the skeleton feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:使用單一影像擷取器之人體骨架辨識裝置</p>
        <p type="p">11:影像擷取器</p>
        <p type="p">12:處理器</p>
        <p type="p">I:待辨識影像</p>
        <p type="p">I0:第一面成像</p>
        <p type="p">I1:第一鏡面反射成像</p>
        <p type="p">I2:第二鏡面反射成像</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="622px" img-content="tif" inline="yes" orientation="portrait" width="929px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622546</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145727</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120250217B">G02B1/113</main-classification>
        <further-classification edition="200601120250217B">G02F1/1335</further-classification>
        <further-classification edition="202501120250217B">H10F77/42</further-classification>
        <further-classification edition="200601120250217B">B60J3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMOSA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立清華大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TSING HUA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊博名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敬遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾文宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, WEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳玉振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文筆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, WEN-BEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何榮銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, RONG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張証彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷可忻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, KE-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>抗反射薄膜及其應用</chinese-title>
        <english-title>ANTI-REFLECTION THIN FILM AND APPLICATION THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種抗反射薄膜及其應用。抗反射薄膜包含基材；以及位於基材上的二氧化矽網狀結構，其中抗反射薄膜包含特定體積百分率的二氧化矽網狀結構。藉此，可提升抗反射薄膜的光穿透率，從而應用於顯示器、太陽能板及擋風玻璃中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An anti-reflection thin film and application thereof are provided. The anti-reflection thin film includes a substrate and silicon dioxide network structure located on the substrate, in which the anti-reflection thin film includes the silicon dioxide network structure with specific volume percentage. Therefore, light transmittance of the anti-reflection thin film can be increased, thereby applying in a display device, a solar panel and a windshield.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:抗反射薄膜</p>
        <p type="p">110:基材</p>
        <p type="p">120:二氧化矽網狀結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="591px" img-content="tif" inline="yes" orientation="portrait" width="933px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622340</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145731</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">E04C2/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王進忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王進忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇民</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>強化水泥板及其製法與應用</chinese-title>
        <english-title>REINFORCED CEMENT BOARD AND MANUFACTURING METHOD AND APPLICATION THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種強化水泥板，包含一板體，及複數工程膠條。該等工程膠條具有尼龍和玻璃纖維。該等工程膠條隨意方向地分散或交疊於該板體內部，而能提升該強化水泥板的韌性及機械支撐力。因此，該強化水泥板作為板模使用時，無須進行板模拆除和牆面修飾等工序，而能縮短工期，降低人力成本。此外，本案還提供該強化水泥板的製法及應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reinforced cement board includes a board body and several plastic strips. These plastic strips have nylon and glass fibers. The plastic strips are dispersed or overlapped inside the board body randomly, thereby improving the toughness and mechanical supporting force of the reinforced cement board. Therefore, when the reinforced cement board is used as a formwork, there is no need to dismantle the formwork and carry out the wall decoration process, which can shorten the construction period and reduce labor costs. Besides, this invention also provides the manufacturing method and application of the reinforced cement board.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:強化水泥板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="726px" img-content="tif" inline="yes" orientation="portrait" width="1003px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623404</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145741</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250102B">H10D48/36</main-classification>
        <further-classification edition="202501120250102B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>世界先進積體電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧光軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KUANG-HSUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚毓峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, YU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈士強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, SHYH-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體結構，包含基板、位於基板上的晶種層與位於晶種層上的緩衝層。緩衝層包含位於該晶種層上的至少一超晶格部與位於該超晶格部上的至少一阻擋層。阻擋層之厚度為10奈米~600奈米。超晶格部為N1個，阻擋層為N2個。N1、N2分別為正整數且大於或等於1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure is provided, including a substrate, a seed layer disposed on the substrate, and a buffer layer disposed on the seed layer. The buffer layer includes at least one superlattice portion disposed on the seed layer and at least one block layer disposed on the superlattice portion. The thickness of the barrier layer is 10 nanometers to 600 nanometers. The number of the superlattice portion is N1, and the number of the barrier layer is N2. N1 and N2 are positive integers and greater than or equal to 1 respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">102C:基材</p>
        <p type="p">102M:絕緣材料</p>
        <p type="p">104:晶種層</p>
        <p type="p">104H:高溫晶種層</p>
        <p type="p">104L:低溫晶種層</p>
        <p type="p">106:緩衝層</p>
        <p type="p">BL1:(第一)超晶格部</p>
        <p type="p">SL1:(第一)超晶格部</p>
        <p type="p">SLU:重複單元</p>
        <p type="p">SLU1:第一子層</p>
        <p type="p">SLU2:第二子層</p>
        <p type="p">T&lt;sub&gt;SL1&lt;/sub&gt;:(第一超晶格部的)厚度</p>
        <p type="p">T&lt;sub&gt;BL1&lt;/sub&gt;:(第一阻擋層的)厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="536px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622450</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145751</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250224B">F41J3/00</main-classification>
        <further-classification edition="200601120250224B">A63F9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商勁偉塑膠模具五金廠有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINWEI PLASTIC MODEL HARDWARE FACTORY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳賢達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIEN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李賀翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>飛鏢遊戲機的飛鏢靶本體結構</chinese-title>
        <english-title>DART TARGET BODY STRUCTURE OF DART GAME MACHINE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種飛鏢遊戲機的飛鏢靶本體結構，包含：本體框以及組設在該本體框的飛鏢靶模組，該飛鏢靶模組包括主靶框、複數靶塊、副靶框、支撐板、及複數第一鎖固組件；由於該飛鏢靶模組是呈模組化的設在該本體框，且將其中的該主靶框與副靶框設計成相同結構，因此當該主靶框損壞時，得以將該飛鏢靶模組從該本體框上拆離，並用目前已有及完好的副靶框與受損的主靶框對調，使得該飛鏢靶模組無需整體更換，即可再次使用，有效降低維修成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dart target body structure of dart game machine, which includes a body frame and a dart target module disposed in the body frame, the dart target module includes a main target frame, a plurality of target blocks, a secondary target frame, a support plate and a plurality of first locking components, since the dart target module is modular in the body frame, and the main target frame is designed in the same structure as the secondary target frame, when the main target frame is damaged, the dart target module can be removed from the body frame, and the existing and intact secondary target frame can be adjusted with the damaged main target frame, so the dart target module can be used again without overall replacement, effectively reducing the maintenance cost.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:本體框</p>
        <p type="p">11:容置空間</p>
        <p type="p">12:邊框部</p>
        <p type="p">13:鎖柱部</p>
        <p type="p">14:鎖鈕</p>
        <p type="p">A:飛鏢靶模組</p>
        <p type="p">B:標示框組</p>
        <p type="p">80B:設置孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="956px" img-content="tif" inline="yes" orientation="portrait" width="726px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621774</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145752</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250224B">A63H33/18</main-classification>
        <further-classification edition="200601120250224B">A63F9/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商勁偉塑膠模具五金廠有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINWEI PLASTIC MODEL HARDWARE FACTORY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳賢達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIEN-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李賀翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>模組化的飛鏢遊戲機台</chinese-title>
        <english-title>MODULAR DART GAME MACHINE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種模組化的飛鏢遊戲機台，包含：一機座，具有一結合頂部；一飛鏢靶座，沿縱向設置在該機座上，並具有一設在該結合頂部的結合底部；以及一鎖固件，能夠拆卸地螺設在該機座的該結合頂部與該飛鏢靶座的該結合底部之間，使該機座與該飛鏢靶座鎖固成一體，通過該飛鏢遊戲機台採模組化設計允許在運送過程中，將機座與飛鏢靶座兩個部件平行堆疊或緊密排列，最大化利用運輸空間，這樣可以降低每單位貨物的運輸成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A modular dart game machine includes a machine base having a connecting top portion, a dart target base longitudinally disposed on the machine base and a connecting bottom portion disposed on the connecting top portion, and a locking member detachably disposed between the connecting top portion and the connecting bottom portion, which makes the machine base and the dart target base locked together, by the modular design, the machine base and the dart target base can be stacked parallel or closely arranged in the transportation process, so as to maximize the use of transportation space, reducing the transportation cost per unit of cargo.</p>
      </isu-abst>
      <representative-img>
        <p type="p">Y:縱向</p>
        <p type="p">X:橫向</p>
        <p type="p">20:座框</p>
        <p type="p">21:座框側部</p>
        <p type="p">30:立框</p>
        <p type="p">31:立框座部</p>
        <p type="p">32:結合頂部</p>
        <p type="p">33:穿孔</p>
        <p type="p">40:背板</p>
        <p type="p">41:背板部</p>
        <p type="p">42:底板部</p>
        <p type="p">50:飛鏢靶座</p>
        <p type="p">51:結合底部</p>
        <p type="p">52:螺紋孔</p>
        <p type="p">55:副電子顯示螢幕</p>
        <p type="p">59:定位框</p>
        <p type="p">60:鎖固件</p>
        <p type="p">71:第一支撐腳</p>
        <p type="p">72:螺絲</p>
        <p type="p">73:第二支撐腳</p>
        <p type="p">74:滾輪</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="1028px" img-content="tif" inline="yes" orientation="portrait" width="690px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622952</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145755</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241218B">G09G5/10</main-classification>
        <further-classification edition="200601120241218B">G09G5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林德祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TE-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳芳雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FANG-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示器的處理電路及相關的控制方法</chinese-title>
        <english-title>PROCESSING CIRCUIT OF DISPLAY AND ASSOCIATED CONTROL METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種用於一顯示器的處理電路，其包含有一統計電路、一背光亮度計算電路及一區域調光控制電路。該統計電路用以統計一影像資料中多個區域之每一個區域的一亮度特徵。該背光亮度計算電路用以根據該顯示器的一環境光亮度以及每一個區域的該亮度特徵以決定出每一個區域的一背光亮度。該區域調光控制電路耦接於該背光亮度計算電路，且用以根據每一個區域的該背光亮度來產生對應的一背光控制訊號，以控制該顯示器的一顯示面板中對應到該區域的至少一背光源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a processing circuit for a display, which includes a statistical circuit, a backlight brightness calculation circuit and a local dimming control circuit. The statistical circuit is configured to determine a brightness characteristic of each region of a plurality of regions in image data. The backlight brightness calculation circuit is configured to determine a backlight brightness of each region based on an ambient light brightness of the display and the brightness characteristics of each region. The local dimming control circuit is coupled to the backlight brightness calculation circuit and configured to generate a corresponding backlight control signal according to the backlight brightness of each region to control at least one backlight of a display panel of the display corresponding to the region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示器</p>
        <p type="p">102:環境光感測器</p>
        <p type="p">104:顯示面板</p>
        <p type="p">110:處理電路</p>
        <p type="p">112:統計電路</p>
        <p type="p">114:背光亮度計算電路</p>
        <p type="p">116:區域調光控制電路</p>
        <p type="p">118:補償電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="592px" img-content="tif" inline="yes" orientation="portrait" width="875px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622898</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145756</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250425B">G06V10/12</main-classification>
        <further-classification edition="202201120250425B">G06V10/88</further-classification>
        <further-classification edition="200601120250425B">G06F3/01</further-classification>
        <further-classification edition="200601120250425B">G02B27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱奕榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YI-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石維國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, WEI-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置及與其相關的影像識別方法</chinese-title>
        <english-title>ELECTRONIC DEVICE AND ASSOCIATED IMAGE RECOGNITION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置及與其相關的影像識別方法。電子裝置包含：螢幕、控制模組、攝影模組與鏡片。控制模組電連接於螢幕和攝影模組。控制模組控制螢幕顯示播放影像。攝影模組包含感光元件與鏡頭。當攝影模組啟用時，電子裝置操作於一般視訊模式與閱讀輔助模式其中的一者。鏡片設置於鏡頭的外側。鏡片的位置隨著一般視訊模式與閱讀輔助模式而選擇性改變。自鏡片發出至鏡頭的光線在感光元件形成感光影像。控制模組對感光影像進行影像處理後，產生播放影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device and associated image recognition method are provided. The electronic device includes a panel, a control module, a camera module, and a transparent lens. The control module is electrically connected to the panel and the camera module. The control module controls the panel to display a display image. The camera module includes an image sensor and a camera lens. When the camera module is enabled, the electronic device operates in one of normal video mode and reading assistance mode. The transparent lens is placed outside of the camera lens. The position of the transparent lens is selectively changed with the normal video mode and the reading assistance mode. The light transmitted from the transparent lens to the camera lens forms a focused image at the image sensor. The control module processes the focused image and generates the displayed image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:電子裝置</p>
        <p type="p">81:控制模組</p>
        <p type="p">82:攝影模組</p>
        <p type="p">821:鏡頭</p>
        <p type="p">823:感光元件</p>
        <p type="p">83:螢幕</p>
        <p type="p">84:鏡片</p>
        <p type="p">85:感測模組</p>
        <p type="p">87:周邊裝置</p>
        <p type="p">89:鏡片支撐結構</p>
        <p type="p">891:軸心</p>
        <p type="p">893:支架</p>
        <p type="p">895:牽引器</p>
        <p type="p">movCTL:牽引器控制信號</p>
        <p type="p">senIMG:感光影像</p>
        <p type="p">dspIMG:播放影像</p>
        <p type="p">POS1_trigSIG:第一鏡片位置觸發信號</p>
        <p type="p">POS2_trigSIG第二鏡片位置觸發信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="665px" img-content="tif" inline="yes" orientation="portrait" width="745px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622371</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145761</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250217B">F04D29/30</main-classification>
        <further-classification edition="200601120250217B">F04D25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林光華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUANG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>離心式散熱風扇</chinese-title>
        <english-title>CENTRIFUGAL HEAT DISSIPATION FAN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種離心式散熱風扇，適用於筆記型電腦。離心式散熱風扇包括殼體、輪轂與多個扇葉。殼體具有多個凹陷。輪轂可旋轉地設置於殼體內。扇葉環設於輪轂以隨輪轂沿一方向旋轉。凹陷面對扇葉，且各凹陷的輪廓沿所述方向呈漸縮。在離心式散熱風扇運轉時，殼體表面的氣流進入凹陷，因所述漸縮而匯集一處且被擠出凹陷而吹向扇葉。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A centrifugal heat dissipation fan suited for a laptop computer is provided. The centrifugal heat dissipation fan includes a housing having a plurality depressions, a hub rotating disposed in the housing, and a plurality of blades disposed at side of and surrounding the hub. The blades are rotated in a direction along with the hub. The depressions face toward the blades, and a contour of each of the depressions is tapered toward the direction. An airflow in a surface of the housing enters the depression when the centrifugal heat dissipation fan is operated. After the airflow being gathered together because of the tapered contour, the airflow is squeezed out of the recess and flows toward the blades.</p>
      </isu-abst>
      <representative-img>
        <p type="p">111:頂板</p>
        <p type="p">111a:入風口</p>
        <p type="p">111b:凹陷</p>
        <p type="p">123:靜音環</p>
        <p type="p">CH1:第一流道</p>
        <p type="p">CH2:第二流道</p>
        <p type="p">F1、F2、F3:氣流</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="405px" img-content="tif" inline="yes" orientation="portrait" width="648px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622379</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145762</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250217B">F04D29/66</main-classification>
        <further-classification edition="200601120250217B">F04D29/30</further-classification>
        <further-classification edition="200601120250217B">F04D25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林光華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUANG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉今</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>離心式散熱風扇</chinese-title>
        <english-title>CENTRIFUGAL HEAT DISSIPATION FAN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種離心式散熱風扇，適用於筆記型電腦。離心式散熱風扇包括殼體、輪轂、多個扇葉以及靜音環。輪轂可旋轉地設置於殼體內。扇葉環設于輪轂以隨輪轂沿第一方向旋轉。靜音環連接扇葉且環設在扇葉遠離輪轂的末緣。靜音環具有多個凹陷，各凹陷的輪廓沿第二方向呈漸縮，第二方向相反於第一方向。行經靜音環的氣流進入凹陷後，因所述漸縮而匯集於一處且被擠出凹陷並吹向殼體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A centrifugal heat dissipation fan suited for a laptop computer is provided. The centrifugal heat dissipation fan includes a housing, a hub rotating disposed in the housing, a plurality of blades disposed at side of and surrounding the hub, and a mute ring connecting the blades and located at ends of the blades opposite to the hub. The blades and the hub are rotated in a first direction. The mute ring has a plurality of recesses, and a contour of each of the recesses is tapered toward a second direction, wherein the second and the first directions are opposite directions. An airflow passes by the mute ring and enters the recess. After the airflow being gathered together because of the tapered contour, the airflow is squeezed out of the recess and flows toward the housing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">122:扇葉</p>
        <p type="p">123:靜音環</p>
        <p type="p">123a:頂面</p>
        <p type="p">124:凹陷</p>
        <p type="p">124a:第一流道</p>
        <p type="p">124b:第二流道</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">F0、F1、F2、F3:氣流</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="778px" img-content="tif" inline="yes" orientation="portrait" width="737px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621995</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145763</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250113B">C01G49/14</main-classification>
        <further-classification edition="202201120250113B">B09B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美晶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭以仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>利用廢硫酸製備硫酸亞鐵及含鐵離子無機高分子聚合物之系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種利用廢硫酸製備硫酸亞鐵及含鐵離子無機高分子聚合物之系統，設有一存放槽，一第一反應槽連通存放槽並接收廢硫酸溶液與一鐵源反應的硫酸亞鐵溶液；一過濾裝置連通於第一反應槽用以過濾硫酸亞鐵溶液；一第二反應槽連通於過濾裝置相，並與一酸劑供應槽及一氧化劑供應裝置相連通，向第二反應槽添加酸性溶劑及氧化劑與硫酸亞鐵溶液聚合得聚合硫酸鐵溶液；一蒸發器分別連通於過濾裝置及第二反應槽，將硫酸亞鐵溶液或聚合硫酸鐵溶液蒸發濃縮，再經第一結晶器降溫析出硫酸亞鐵晶體或聚合硫酸鐵晶體，實現以廢硫酸製得不同成品，滿足市場需求。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:存放槽</p>
        <p type="p">110:第一反應槽</p>
        <p type="p">120:過濾裝置</p>
        <p type="p">200:第二反應槽</p>
        <p type="p">210:酸劑供應槽</p>
        <p type="p">220:氧化劑供應裝置</p>
        <p type="p">300:蒸發器</p>
        <p type="p">310:第一結晶器</p>
        <p type="p">320:脫水裝置</p>
        <p type="p">330:乾燥裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="690px" img-content="tif" inline="yes" orientation="portrait" width="967px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621988</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145764</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">C01F7/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美晶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭以仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓修齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>利用廢硫酸製備鋁化合物之系統及合成反應方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種利用廢硫酸製備鋁化合物之系統，其包括一存放槽、一第一反應槽、一除雜裝置、一第二反應槽、一蒸發器及一結晶器，存放槽供應廢硫酸溶液至第一反應槽，與鋁源反應得到硫酸鋁溶液可分別經輸送管導流至蒸發器；或經除雜裝置除雜後輸送至第二反應槽，第二反應槽加入一硫酸鹽與硫酸鋁溶液混合得硫酸鋁複鹽溶液，以蒸發器對硫酸鋁溶液或硫酸鋁複鹽溶液濃縮為飽和溶液，再經結晶器降溫結晶。而合成反應方法，包括以下步驟：(a)去除廢硫酸溶液中的過氧化氫；(b)加入鋁源反應得到硫酸鋁溶液；(c)硫酸鋁溶液析晶得硫酸鋁晶體；或者除去不溶物雜質，加入硫酸鹽混合後再析晶得到硫酸鋁複鹽晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:存放槽</p>
        <p type="p">2:第一反應槽</p>
        <p type="p">21:第一進料管線</p>
        <p type="p">22:第一出料管線</p>
        <p type="p">23:輸送管道</p>
        <p type="p">24、42:攪拌裝置</p>
        <p type="p">25、43:加溫裝置</p>
        <p type="p">26:pH計</p>
        <p type="p">3:除雜裝置</p>
        <p type="p">4:第二反應槽</p>
        <p type="p">41:第二進料管線</p>
        <p type="p">44:第二出料管線</p>
        <p type="p">5:蒸發器</p>
        <p type="p">51:連通管道</p>
        <p type="p">6:結晶器</p>
        <p type="p">61:輸送管線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="946px" img-content="tif" inline="yes" orientation="portrait" width="627px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622323</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145765</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">D06H3/00</main-classification>
        <further-classification edition="200601120241230B">G01L5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人紡織產業綜合研究所</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN TEXTILE RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪瑞達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JUI-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃慶堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHING-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>織物張力檢測控制組件</chinese-title>
        <english-title>FABRIC TENSION DETECTION CONTROL ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種織物張力檢測控制組件包括檢測板、彈性件、第一磁力件、塑形塊、頂昇裝置、壓力感測裝置與第二磁力件。織物套設於檢測板。彈性件的一端位於檢測板上。第一磁力件位於彈性件遠離檢測板的另一端，且位於織物中。塑形塊覆蓋第一磁力件且位於織物中，使織物由塑形塊撐開。頂昇裝置位於塑形塊下方。壓力感測裝置位於頂昇裝置上。第二磁力件位於壓力感測裝置上。頂昇裝置配置以上升或下降而使第二磁力件接近或遠離第一磁力件。壓力感測裝置配置以感測第一磁力件與第二磁力件之間的斥力變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fabric tension detection control assembly includes a detection plate, a flexible element, a first magnetic element, a shaping block, a lifting device, a pressure sensing device, and a second magnetic element. A fabric sleeves on the detection plate. An end of the flexible element is located on the detection plate. The first magnetic element is located on another end of the flexible element facing away from the detection plate, and is located in the fabric. The shaping block covers the first magnetic element and is located in the fabric, such that the fabric is stretched by the shaping block. The lifting device is located below the shaping block. The pressure sensing device is located on the lifting device. The second magnetic element is located on the pressure sensing device. The lifting device is configured to lift or lower to enable the second magnetic element to be close to or away from the first magnetic element. The pressure sensing device is configured to sense a change in a repulsive force between the first magnetic element and the second magnetic element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:織物張力檢測控制組件</p>
        <p type="p">110:檢測板</p>
        <p type="p">120:彈性件</p>
        <p type="p">130:第一磁力件</p>
        <p type="p">140:塑形塊</p>
        <p type="p">142:第一表面</p>
        <p type="p">144:第二表面</p>
        <p type="p">150:頂昇裝置</p>
        <p type="p">160:壓力感測裝置</p>
        <p type="p">170:第二磁力件</p>
        <p type="p">210:織物</p>
        <p type="p">A:區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="686px" img-content="tif" inline="yes" orientation="portrait" width="925px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623214</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145773</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120250304B">H04B7/04</main-classification>
        <further-classification edition="201501120250304B">H04B1/40</further-classification>
        <further-classification edition="200601120250304B">H01Q1/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上緯科技電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周祐邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周鈞廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯岦宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉爾順</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>增強型WiFi天線系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種增強型WiFi天線系統，包括無線網路模組、第一訊號增強模組、第二訊號增強模組、第一天線模組以及第二天線模組。無線網路模組具有與第一二極體連接的第一輸出端以及與第二二極體連接的第二輸出端，且第一二極體與第二二極體的輸出端連接至第一接點，第一訊號增強模組具有與第一接點連接的第一切換路徑，第二訊號增強模組具有與第一輸出端連接的第二切換路徑。其中，無線網路模組輸出第一控制訊號以及第二控制訊號從而控制第一切換路徑之路徑切換，以及藉由第一控制訊號控制第二切換路徑之路徑切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:無線網路模組</p>
        <p type="p">100:第一輸出端</p>
        <p type="p">101:第二輸出端</p>
        <p type="p">102:第一接點</p>
        <p type="p">11:第一訊號增強模組</p>
        <p type="p">110:第一切換路徑</p>
        <p type="p">12:第二訊號增強模組</p>
        <p type="p">120:第二切換路徑</p>
        <p type="p">13:第一天線模組</p>
        <p type="p">14:第二天線模組</p>
        <p type="p">D1:第一二極體</p>
        <p type="p">D2:第二二極體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="737px" img-content="tif" inline="yes" orientation="portrait" width="673px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622757</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145776</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">G06F13/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭俊豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, CHUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴俊豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHUN HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>音訊裝置以及控制方法</chinese-title>
        <english-title>AUDIO DEVICE AND CONTROL METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種音訊裝置被揭示。此音訊裝置包含輸入輸出介面、查找電路、記憶體以及處理器。輸入輸出介面用以從音訊系統主機接收至少一SDCA音訊拓樸控制項目。查找電路用以依據至少一SDCA音訊拓樸控制項目中的多個關鍵資訊，至位址對應表找到目標指標，透過目標指標指向目標控制項目和目標儲存位址，將音訊控制資料指向目標儲存位址，並傳送對應於目標控制項目的中斷訊號。處理器用以依據中斷訊號至記憶體取得對應於中斷訊號的操作程式，並依據操作程式至對應於目標控制項目的目標儲存位址執行操作，以控制音訊裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An audio device is disclosed. The audio device includes an input and output interface, a search circuit, a memory, and a processor. The input and output interface is configured to receive at least one SDCA audio topology control item from the audio system host. The search circuit is configured to search a target indicator from a correspondence table according to several key information of at least one SDCA audio topology control item, to point to a target control item and a target storage addresses through the target indicator, and to send an interrupt signal corresponding to the target control item. The processor is configured to obtain the operating program corresponding to the interrupt signal from the memory according to the interrupt signal, and to perform operations to the target storage address corresponding to the target control item according to the operating program to control the audio device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:音訊裝置</p>
        <p type="p">110:輸入輸出介面</p>
        <p type="p">112:埠實體層</p>
        <p type="p">114:數位介面</p>
        <p type="p">130:查找電路</p>
        <p type="p">135:位址對應表</p>
        <p type="p">150A,150B:記憶體</p>
        <p type="p">152A,152B:子記憶體</p>
        <p type="p">170:處理器</p>
        <p type="p">180:音頻暫存器</p>
        <p type="p">190:更新電路</p>
        <p type="p">0x CD:音訊控制資料</p>
        <p type="p">ISR:中斷訊號</p>
        <p type="p">31:通訊匯流排主控器</p>
        <p type="p">32:序列周邊介面主控器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="760px" img-content="tif" inline="yes" orientation="portrait" width="970px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623099</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145777</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01Q21/28</main-classification>
        <further-classification edition="201701120250303B">H04B7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上緯科技電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周祐邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周鈞廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯岦宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉爾順</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>增強型WiFi天線系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種增強型WiFi天線系統，包括無線網路模組、第一訊號增強模組、第二訊號增強模組、第一天線模組及第二天線模組。無線網路模組具有第一輸出端、第二輸出端及第三輸出端，第一訊號增強模組具有第一切換路徑並與第一、第二以及第三輸出端透過第一至第四二極體連接，第二訊號增強模組具有第二切換路徑並與第一以及第二輸出端連接，第一天線模組與第一切換路徑連接，以及第二天線模組與第二切換路徑連接。無線網路模組輸出第一、第二以及第三控制訊號從而控制第一切換路徑之路徑切換，以及藉由第一以及第二控制訊號控制第二切換路徑之路徑切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:無線網路模組</p>
        <p type="p">100:第一輸出端</p>
        <p type="p">101:第二輸出端</p>
        <p type="p">102:第三輸出端</p>
        <p type="p">103:第一接點</p>
        <p type="p">104:第二接點</p>
        <p type="p">11:第一訊號增強模組</p>
        <p type="p">110:第一切換路徑</p>
        <p type="p">12:第二訊號增強模組</p>
        <p type="p">120:第二切換路徑</p>
        <p type="p">13:第一天線模組</p>
        <p type="p">14:第二天線模組</p>
        <p type="p">D1:第一二極體</p>
        <p type="p">D2:第二二極體</p>
        <p type="p">D3:第三二極體</p>
        <p type="p">D4:第四二極體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="755px" img-content="tif" inline="yes" orientation="portrait" width="735px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621847</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145784</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120241231B">B24B37/11</main-classification>
        <further-classification edition="200601120241231B">B24B47/12</further-classification>
        <further-classification edition="200601120241231B">C25F3/24</further-classification>
        <further-classification edition="200601120241231B">C25F7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家中山科學研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高俊翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHUN HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮奕澂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERNG, YI CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任國光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEN, KUO KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JUNG CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊博仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PO JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林暄翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSUAN HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱冠諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, KUAN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡順億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAN, SHUN YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電解研磨裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種電解研磨裝置，係包括：一加工槽，係用於容置一待加工物件與一電解液；一研磨單元，係設置於該加工槽上方，該研磨模組具有一加工主軸與一加工刷頭，該加工刷頭係由該加工主軸帶動旋轉、並對該待加工物件進行研磨；一直流電源供應器，其陰極端電性連接該加工刷頭，陽極端電性連接該待加工物件；一電解液槽，係藉由一回收管路回收該加工槽內之電解液，再透過一供液管路將電解液輸送至該加工刷頭；其中該加工刷頭係為一圓形研磨刷頭，其中心由該加工主軸帶動旋轉，由內而外設置中心齒輪、中齒圈與外齒圈，該中心齒輪與中齒圈間、與該中齒圈與外齒圈間具有複數行星齒輪，該加工刷頭在旋轉研磨過程中，該中心齒輪、中齒圈與外齒圈三者具有相同之切線速率。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">21:驅動軸</p>
        <p type="p">22:中心齒輪</p>
        <p type="p">23:中齒圈</p>
        <p type="p">24:外齒圈</p>
        <p type="p">25:行星齒輪</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="755px" img-content="tif" inline="yes" orientation="portrait" width="676px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622907</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145785</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250805B">G06V10/82</main-classification>
        <further-classification edition="202201120250805B">G06V10/22</further-classification>
        <further-classification edition="202201120250805B">G06V10/25</further-classification>
        <further-classification edition="202201120250805B">G06V10/26</further-classification>
        <further-classification edition="202201120250805B">G06V10/46</further-classification>
        <further-classification edition="202301120250805B">G06N3/0464</further-classification>
        <further-classification edition="202301120250805B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庄子悅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUANG, ZI YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>雙層遮擋感知與軟非極大值抑制結合的雙列直插封裝缺陷圖像後處理系統及其方法</chinese-title>
        <english-title>POST-PROCESSING SYSTEM FOR DUAL IN-LINE PACKAGE DEFECT IMAGES COMBINING BILAYER OCCLUSION PERCEPTION AND SOFT NON-MAXIMUM SUPPRESSION AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙層遮擋感知與軟非極大值抑制結合的雙列直插封裝缺陷圖像後處理系統及其方法，透過雙層卷積網路模型對雙列直插封裝圖像的缺陷區域建模為重疊的頂部圖層及底部圖層，用以檢測遮擋部分及推理被遮擋部分，以便輸出多個遮罩及檢測框，接著根據面積大小過濾遮罩及檢測框，再執行軟非極大值抑制運算以輸出置信度高且重疊率低的檢測框，以及執行多邊形近似處理以獲得多邊形簡化遮罩，最後一併顯示多邊形簡化遮罩、置信度高且重疊率低的檢測框及雙列直插封裝圖像，藉以達到提高缺陷檢測的靈活性與精確性之技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A post-processing system for dual in-line package defect images combining bilayer occlusion perception and soft non-maximum suppression and method thereof is disclosed. By using a Bilayer Convolutional Network (BCNet) to model the defect regions of a Dual In-line Package (DIP) image as overlapping top and bottom layers for occlusion detection and occlusion reasoning, multiple masks and bounding boxes are generated. Subsequently, the masks and bounding boxes are filtered based on area size, followed by performing Soft Non-Maximum Suppression (Soft NMS) to output bounding boxes with high confidence and low Intersection Over Union (IoU). Polygon approximation is then applied to produce simplified polygonal masks. Finally, the simplified polygonal masks, high-confidence low-IoU bounding boxes, and the DIP image are displayed together. The mechanism is help to improve the flexibility and accuracy of defect detection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:遮擋檢測模組</p>
        <p type="p">120:過濾模組</p>
        <p type="p">130:運算模組</p>
        <p type="p">140:調整模組</p>
        <p type="p">150:輸出模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="770px" img-content="tif" inline="yes" orientation="portrait" width="672px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622903</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145786</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260303B">G06V10/764</main-classification>
        <further-classification edition="202201120260303B">G06V10/771</further-classification>
        <further-classification edition="202201120260303B">G06V10/774</further-classification>
        <further-classification edition="202201120260303B">G06V20/64</further-classification>
        <further-classification edition="202601120260303B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉淑鍵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHU JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>以深度學習模型複檢錫膏印刷不良電路板之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR USING DEEP LEARNING MODEL TO RE-INSPECT DEFECTIVE SOLDER PASTE PRINTED CIRCUIT BOARDS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以深度學習模型複檢錫膏印刷不良電路板之裝置及方法，其透過取得被光學原理檢測設備判斷為錫膏印刷不良之印刷電路板的印刷錫膏影像後，使用分類模型分類印刷錫膏影像，當分類模型將印刷錫膏影像中對應印刷電路板上之焊點區域的影像特徵分類為錫膏印刷良好時，由印刷錫膏影像中擷取出對應焊點區域的焊點窗口影像，並使用分類模型判斷每焊點窗口影像是否表示對應之焊點區域的錫膏印刷良好之技術手段，降低錫膏檢測裝置之技術人員所花費的維護成本，並達成降低印刷電路板之錫膏印刷狀況誤判率之技術功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for using deep learning model to re-inspect defective solder paste printed circuit boards and a method thereof are provided. By obtaining a solder paste image of a printed circuit board that is determined to be poorly printed by an AOI equipment, using a deep learning model to classify the solder paste image, extracting solder joint window images corresponding to solder joint areas on the printed circuit board from the solder paste image when the deep learning model classifies the solder paste image as well printing, using the deep learning model to determine whether each of the solder joint window images indicates that the solder paste in the corresponding one of the solder joint area is well printed, the device and the method can reducing maintenance costs spent by technicians on SPI devices, and can achieve the effect of reducing misjudgment rate of solder paste printing conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">步驟310:取得被光學原理檢測設備判斷為錫膏印刷不良之印刷電路板之印刷錫膏影像</p>
        <p type="p">步驟330:使用分類模型分類印刷錫膏影像</p>
        <p type="p">步驟350:當分類模型將印刷錫膏影像中對應印刷電路板上之焊點區域之影像特徵分類為錫膏印刷良好時，由印刷錫膏影像中擷取出對應各焊點區域之多個焊點窗口影像</p>
        <p type="p">步驟370:使用分類模型判斷焊點窗口影像是否表示焊點區域之錫膏印刷良好</p>
        <p type="p">步驟390:標記表示錫膏印刷不良之焊點窗口影像所對應之焊點區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="963px" img-content="tif" inline="yes" orientation="portrait" width="724px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622262</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145787</doc-number>
          <kind></kind>
          <date>113/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120241216B">C22C1/04</main-classification>
        <further-classification edition="200601120241216B">B22F3/10</further-classification>
        <further-classification edition="202201120241216B">B22F1/14</further-classification>
        <further-classification edition="200601120241216B">C22C19/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國家中山科學研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅璟元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHING YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮奕澂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERNG, YI CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛如盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, JU YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高俊翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHUN HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任國光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEN, KUO KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡覲承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIN CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉安洲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, AN CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>提升積層製造鎳基超合金緻密度之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種提升積層製造鎳基超合金緻密度之方法，係包括：提供一鎳基超合金粉末；在該鎳基超合金粉末中加入一定比例之碳化鈮粉末；將該鎳基超合金粉末與該碳化鈮粉末之混合物置入一球磨機中進行球磨混合；將球磨混合後之該鎳基超合金粉末-碳化鈮粉末混合物用於積層製造鋪粉燒結製程，得到一鎳基超合金工件</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">S1~S4:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="552px" img-content="tif" inline="yes" orientation="portrait" width="637px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622354</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145788</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">E21B17/04</main-classification>
        <further-classification edition="200601120250108B">E21B33/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大允機械有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAYUN TOOL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃榮和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JUNG-HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟澄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳培元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PEI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易定芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>防止倒流的鑽桿</chinese-title>
        <english-title>A DRILLING ROD FOR PREVENTING BACKFLOW</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明防止倒流的鑽桿，包含：鑽桿主體、內部組件與密封組件，鑽桿主體具有上接頭部、下接頭部與設有第一通道的桿身部，上接頭部的第一通孔連通第一通道，而內部組件連接於鑽桿主體，並具有管體來構成第二通道，密封組件位於第一通道中，其中，當鑽桿主體接受到從上接頭部往下接頭部流動的正向流體時，密封組件的遮擋件將被正向流體推移而與第一通孔分開，使得第一通孔連通第二通道，又當鑽桿主體接受到從下接頭部往上接頭部流動的反向流體時，遮擋件將被反向流體推移而緊密封閉第一通孔；因此，反向流體僅能從下接頭部流到第一通道而無法進入第一通孔，避免倒流現象發生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a drilling rod for preventing backflow. The drilling rod comprises a drilling body, an internal member, and a seal member. The drilling body comprises an upper joint portion, a lower joint portion, and a rod body provided with a first channel for communicating with a first through hole of the upper joint portion. The internal member is connected to the drilling body and is formed a tube to define a second channel. The seal member is assembled in the first channel to cover the first through hole. When a forward fluid flows from the upper joint portion to the lower joint portion in the drilling body, a shielding portion of the seal member is pushed by the forward fluid to separate from the first through hole, so that the first through hole is communicated with the second channel. When a reversed fluid flows from the lower joint portion to the upper joint portion in the drilling body, the shielding portion is pushed by the reversed fluid to seal the first through hole. Therefore, the reversed fluid only flows from the lower joint portion into the first channel without entering the first through hole to prevent a backflow condition from being generated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鑽桿</p>
        <p type="p">10:鑽桿主體</p>
        <p type="p">11:上接頭部</p>
        <p type="p">12:下接頭部</p>
        <p type="p">121:第二通孔</p>
        <p type="p">13:桿身部</p>
        <p type="p">131:第一通道</p>
        <p type="p">132:內周緣</p>
        <p type="p">14:螺旋凸肋</p>
        <p type="p">20:內部組件</p>
        <p type="p">21:內管部</p>
        <p type="p">22:固定部</p>
        <p type="p">23:管體</p>
        <p type="p">24:第二通道</p>
        <p type="p">25:定位環</p>
        <p type="p">26:定位孔</p>
        <p type="p">30:密封組件</p>
        <p type="p">31:遮擋件</p>
        <p type="p">D1:軸線方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="949px" img-content="tif" inline="yes" orientation="portrait" width="681px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622995</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145790</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250224B">G16H50/30</main-classification>
        <further-classification edition="202301120250224B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種具有時間關聯性分析的失眠偵測方法</chinese-title>
        <english-title>METHOD FOR INSOMNIA DETECTION WITH TIME-CORRELATION ANALYSIS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種具有時間關聯性分析的失眠偵測方法，包含有訊號預處理及偵測分類等步驟，即先對輸入之受測者的整晚睡眠心電圖訊號進行分類、區分、合併分段、重新組合以及對組合後的五個主要睡眠時態分別截取T秒鐘心電圖訊號，以形成一組5個時間步心電圖訊號做為輸入訊號之用，並以採用可偵測T秒鐘失眠事件且經訓練、驗證及測試後之最佳化的深度學習技術做為偵測模型，藉由最佳化模型之具有長短期記憶-全連接的計算分類與損失函數、優化器運算的配合，以對輸入之5個時間步心電圖訊號進行偵測，通過演算、分析的偵測處理，最終輸出分類結果，有效提升分類準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for insomnia detection with time-correlation analysis includes a signal preprocessing step and a detection and classification step. The inputted full-night sleep electrocardiogram signal of a subject is classified, distinguished, combined, divided, and recombined to further capture T-second electrocardiogram signals from five main sleep stages respectively, thereby obtaining a set of electrocardiogram signals including five time steps for being used as input signals. After the optimum deep-learning technology capable of detecting T-second insomnia events is trained, verified, and tested, it is used as a detection model. The optimum model with calculation and classification of long short-term memory-fully connected is cooperated with loss function and an optimizer to detect the input signals of five time steps. Through a detection treatment of calculation and analysis, a result of classification is further obtained, thereby effectively improving the accuracy of classification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:一種具有時間關聯性分析的失眠偵測方法</p>
        <p type="p">31:訊號預處理</p>
        <p type="p">32:偵測分析</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="902px" img-content="tif" inline="yes" orientation="portrait" width="596px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623280</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145795</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120241230B">H04W4/029</main-classification>
        <further-classification edition="200901120241230B">H04W4/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯一安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>群組車輛之可用安時管理方法及系統</chinese-title>
        <english-title>AVAILABLE AMPERE-HOUR MANAGEMENT METHODS AND SYSTEMS FOR GROUP VEHICLES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種群組車輛之可用安時管理方法及系統。首先，於一遠端伺服器提供一群組中一第一電動車輛及一第二電動車輛所分別相應之一第一可用安時及一第二可用安時。於既定計費周期內持續透過一網路接收相應第一電動車輛之第一使用安時及相應第二電動車輛之第二使用安時。接著，判斷第一使用安時是否超過第一可用安時，且判斷第二使用安時是否超過第二可用安時。當第一使用安時超過第一可用安時且第二使用安時並未超過第二可用安時時，將第二可用安時扣除第一使用安時超過第一可用安時的部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Available Ampere-hour management methods and systems for group vehicles are provided. First, a first available ampere-hour and a second available ampere-hour respectively corresponding to a first electric vehicle and a second electric vehicle in a group are provided. A first used ampere-hour of the first electric vehicle and the second used ampere-hour of the second electric vehicle are continuously received through a network within a preset billing cycle. Then, it is determined whether the first used ampere-hour exceeds the first available ampere-hour, and whether the second used ampere-hour exceeds the second available ampere-hour. When the first used ampere-hour exceeds the first available ampere-hour and the second used ampere-hour does not exceed the second available ampere-hour, the portion of the first used ampere-hour that exceeds the first available ampere-hour is deducted from the second available ampere-hour.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S610、S620、S630、S640、S650、S660:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="1091px" img-content="tif" inline="yes" orientation="portrait" width="805px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622024</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145801</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C07C25/18</main-classification>
        <further-classification edition="200601120241220B">C07C43/263</further-classification>
        <further-classification edition="200601120241220B">C09K15/04</further-classification>
        <further-classification edition="200601120241220B">C09K15/06</further-classification>
        <further-classification edition="202201120241220B">B22F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周力行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, LI-SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭建賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣明學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, MING-HSUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳溪山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI-SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>抗氧化塗層及表面改質金屬材料</chinese-title>
        <english-title>OXIDATION RESISTANT COATINGS AND SURFACE-MODIFIED METAL MATERIAL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抗氧化塗層，包括氯取代之聚對二甲苯、氟取代之聚對二甲苯及烷基取代之聚對二甲苯，且抗氧化塗層中氯：氟：烷基的重量比為1~10：6~27：2~15。該抗氧化塗層可用於包覆易被氧化金屬材料表面形成表面改質金屬材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An oxidation resistant coating includes a chloro-substituted parylene, a fluorine-substituted parylene, and an alkyl substitution parylene, and a weight ratio of chlorine to fluorine to the alkyl group is 1~10：6~27：2~15. The oxidation resistant coating can be utilized to cover the surface of readily oxidizable metal material to form a surface-modified metal material.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="760px" img-content="tif" inline="yes" orientation="portrait" width="936px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622912</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145802</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250418B">G06V20/59</main-classification>
        <further-classification edition="202201120250418B">G06V10/88</further-classification>
        <further-classification edition="202201120250418B">G06V10/764</further-classification>
        <further-classification edition="202201120250418B">G06V10/82</further-classification>
        <further-classification edition="201601120250418B">G09G3/3208</further-classification>
        <further-classification edition="200601120250418B">G02F1/13357</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TZU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田仲豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, CHUNG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃騰緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃美蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MEI-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無透鏡辨識系統</chinese-title>
        <english-title>LENSLESS IDENTIFICATION SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種無透鏡辨識系統，包含以下元件。紅外光源發射紅外光至目標物以產生反射光。顯示面板具有前側、背側、以及第一側，其中第一側連接前側與背側，第一紅外光源設置於第一側。反射光入射至顯示面板的前側並從背側射出。影像擷取單元設置於顯示面板的背側，用以根據反射光產生影像。計算模組電性連接至影像擷取單元，用以根據影像執行辨識模型以產生對應目標物的類別。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure presents a lensless identification system, including the following components. An infrared light source emits infrared light toward a target object to produce reflected light. A display panel has a front side, a back side, and a first side, where the first side connects the front and back sides. The first infrared light source is disposed at the first side. The reflected light enters the front side of the display panel and exits from the back side. An image capturing unit is disposed at the back side of the display panel to generate an image based on the reflected light. A computing module is electrically connected to the image capturing unit to execute a recognition model based on the image and generate a category of the target object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:蓋板</p>
        <p type="p">221,222:紅外光源</p>
        <p type="p">230:顯示面板</p>
        <p type="p">230_1:第一側</p>
        <p type="p">230_2:第二側</p>
        <p type="p">230b:背側</p>
        <p type="p">230f:前側</p>
        <p type="p">231:第一基板</p>
        <p type="p">232:液晶層</p>
        <p type="p">233:第二基板</p>
        <p type="p">240:光學加密元件</p>
        <p type="p">250:影像擷取單元</p>
        <p type="p">260:計算模組</p>
        <p type="p">270:背光模組</p>
        <p type="p">280:目標物</p>
        <p type="p">291,292:紅外光</p>
        <p type="p">293:反射光</p>
        <p type="p">D1,D2:間距</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="625px" img-content="tif" inline="yes" orientation="portrait" width="811px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622833</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145803</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q10/10</main-classification>
        <further-classification edition="202301120250303B">G06N3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳政育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於生成式對話理解來生成客服查詢表單的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR GENERATING CUSTOMER SERVICE QUERY FORM BASED ON GENERATIVE DIALOGUE UNDERSTANDING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種基於生成式對話理解來生成客服查詢表單的系統及方法。所述方法包括以下步驟：利用客服常用片語來對客服對話內容執行文字前處理操作，以獲得文字前處理後的客服對話內容；將對話行號以及文字前處理後的客服對話內容輸入至表單生成模型，來生成對應於對話行號的查詢表單；當查詢表單不正確時，利用修改後的查詢表單來計算出擷取準確度；以及利用修改後的查詢表單來訓練表單生成模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for generating a customer service query form based on generative dialogue understanding is provided. The method includes following steps: using a common customer service phrase to perform a text pre-processing operation on a customer service dialogue content to obtain the text pre-processed customer service dialogue content; inputting a dialogue line number and the text pre-processed customer service dialogue content into a form generation model to generate a query form corresponding to the dialogue line number; when the query form is incorrect, using the modified query form to calculate a retrieval accuracy; and using the modified query form to train the form generation model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S21~S24:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="698px" img-content="tif" inline="yes" orientation="portrait" width="653px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623110</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145804</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250121B">H01R13/10</main-classification>
        <further-classification edition="200601120250121B">H01R13/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾昌興業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>P-TWO INDUSTRIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林賢昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可堆疊連接式連接器模組</chinese-title>
        <english-title>STACKABLE MODULAR CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種可堆疊連接式連接器模組，用以連接一電路板。可堆疊連接式連接器模組包含一外殼及一連接器。外殼夾設電路板，包含一第一殼體及一第二殼體。第一殼體更具有一第一開孔，第二殼體更具有對應第一開孔之一第二開孔。連接器設置於外殼中並連接電路板，包含一連接器本體、複數第一接觸件及複數第二接觸件。其中，第一殼體與第二殼體共同定義一第一容置空間，當連接器設置於第一容置空間時，連接器本體之相對兩端分別容置於第一開孔及第二開孔，所述第一接觸件之一端外露於第一開孔，所述第二接觸件之一端外露於第二開孔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The stackable modular connector is used for connecting with a circuit board and comprises a housing and a connector. The housing clamps the circuit board and includes a first housing and a second housing. The first housing comprises a first opening. The second housing comprises a second opening corresponding to the first opening. The connector is disposed in the housing and connected to the circuit board, comprising a connector body, a plurality of first contact elements, and a plurality of second contact elements. The first housing and the second housing jointly define a first accommodating space. When the connector is positioned in the first accommodating space, the opposite ends of the connector body are respectively disposed in the first opening and the second opening. One end of the first contact elements is exposed through the first opening. One end of the second contact elements is exposed through the second opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:可堆疊連接式連接器模組</p>
        <p type="p">2000:電路板</p>
        <p type="p">1:外殼</p>
        <p type="p">11:第一殼體</p>
        <p type="p">111:第一開孔</p>
        <p type="p">112:凹陷部</p>
        <p type="p">113:第一軌道槽</p>
        <p type="p">114:第一導引塊</p>
        <p type="p">12:第二殼體</p>
        <p type="p">122:凸塊</p>
        <p type="p">123:第二軌道槽</p>
        <p type="p">124:第二導引塊</p>
        <p type="p">2:連接器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="879px" img-content="tif" inline="yes" orientation="portrait" width="798px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622290</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145809</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241209B">C23C24/04</main-classification>
        <further-classification edition="200601120241209B">C23C24/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐士輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OU, SHIH-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許富銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, FU-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭淙仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TSUNG JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>金屬件之表面處理方法</chinese-title>
        <english-title>SURFACE TREATMENT METHOD OF METAL PART</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種金屬件之表面處理方法。在此方法中，對金屬件之表層進行微粉珠擊處理程序，以在金屬件之表層形成金相組織強化區。此金相組織強化區之再結晶溫度低於金屬件之內部結構之再結晶溫度。表層包覆此內部結構。對金屬件進行熱處理程序。此熱處理程序之熱處理溫度等於或大於金相組織強化區之再結晶溫度且小於內部結構之再結晶溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a surface treatment method of a metal part. In this method, a micro-powder shoot peening process is performed on an outer layer of the metal part to form a metallographic structure strengthening area in the outer layer of the metal part. A recrystallization temperature of the metallographic structure strengthening area is smaller than a recrystallization temperature of an internal structure of the metal part. The outer layer covers the internal structure. A heat treatment process is performed on the metal part. A heat treatment temperature of the heat treatment process is equal to or greater than the recrystallization temperature of the metallographic structure strengthening area and smaller than the recrystallization temperature of the internal structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:表面處理方法</p>
        <p type="p">110:步驟</p>
        <p type="p">120:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="589px" img-content="tif" inline="yes" orientation="portrait" width="874px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621564</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145810</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250102B">A01M1/10</main-classification>
        <further-classification edition="200601120250102B">A01K67/00</further-classification>
        <further-classification edition="202201120250102B">B09B3/00</further-classification>
        <further-classification edition="202501120250102B">A01K67/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商ＢＳＦ科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BSF INNOVATION LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　鎮濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, CHUN-TO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　穎茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, WING-SIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　鎮濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, CHUN-TO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　穎茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, WING-SIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>移動式黑水虻養殖裝置</chinese-title>
        <english-title>MOBILE BLACK SOLDIER FLY (BSF) FARMING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種移動式黑水虻養殖裝置，其一最簡結構包括：一可移動式櫃體以及至少一黑水虻養殖器，其中，該可移動式櫃體具有一第一隔室與一第二隔室，該第一隔室的一側壁開設有一投入口，且該至少一黑水虻養殖器設置在該第二隔室內。特別地，該第一隔室)與該第二隔室之間具設有一第一通道，使得通過該投入口投入該第一隔室的一有機廢棄物可以經由該第一通道進入該第二隔室，從而進一步地進入該至少一黑水虻養殖器。如此，該有機廢棄物由養殖於該至少一黑水虻養殖器之中的複數隻黑水虻進行分解處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a mobile black soldier fly (BSF) farming apparatus, wherein the mobile BSF farming apparatus includes a simplest structure that comprises a mobile rack and at least one BSF farming device. To be more specific, the mobile rack is provided with a first compartment and a second compartment therein, the first compartment is formed with an input opening on a side wall thereof, the at least one BSF farming device is disposed in the second compartment, and the first compartment and the second compartment are in communication with each other by a first channel. By such arrangements, after an organic waste is fed into the first compartment via the input opening, the organic waste may subsequently get into the second compartment through the first channel, thereby being processed by a plurality of BSFs living in the BSF farming device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:移動式黑水虻養殖裝置</p>
        <p type="p">11:可移動式櫃體</p>
        <p type="p">111:第一隔室</p>
        <p type="p">112:第二隔室</p>
        <p type="p">12:投入口</p>
        <p type="p">13:門片</p>
        <p type="p">15:黑水虻養殖器</p>
        <p type="p">1C1:第一通道</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="762px" img-content="tif" inline="yes" orientation="portrait" width="739px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623329</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145811</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250218B">H05K5/02</main-classification>
        <further-classification edition="200601120250218B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡協良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>減振結構及電子裝置</chinese-title>
        <english-title>DAMPING STRUCTURE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包含一機殼、一硬碟、至少一風扇以及至少一減振結構。硬碟設置於機殼內。至少一風扇設置於機殼內。至少一減振結構位於硬碟與至少一風扇之間，並包含一壓縮彈簧、一質量塊以及一定位件。壓縮彈簧之一端設置於機殼。質量塊之一端連接於壓縮彈簧之另一端。定位件連接於壓縮彈簧遠離質量塊之一端，以令減振結構透過定位件而定位於機殼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a casing, a hard disk, at least one fan and at least one damping structure. The hard disk is disposed in the casing. The at least one fan is disposed in the casing. The at least one damping structure is located between the hard disk and the at least one fan, and includes a compression spring, a mass block and a positioning component. An end of the compression spring is disposed on the casing. An end of the mass block is connected to another end of the compression spring. The positioning component is connected to the end of the compression spring located away from the mass block, so that the damping structure is positioned on the casing through the positioning component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:減振結構</p>
        <p type="p">51:壓縮彈簧</p>
        <p type="p">52:質量塊</p>
        <p type="p">53:定位件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="829px" img-content="tif" inline="yes" orientation="portrait" width="609px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622399</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145812</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250219B">F16F15/04</main-classification>
        <further-classification edition="200601120250219B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃心豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-HAOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳伯修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-HSIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡協良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HSIEH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>減振結構及電子裝置</chinese-title>
        <english-title>DAMPING STRUCTURE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包含一機殼、一硬碟、至少一風扇以及至少一減振結構。硬碟設置於機殼內。至少一風扇設置於機殼內。至少一減振結構位於硬碟與至少一風扇之間，並包含一彈片、一第一質量塊、至少一壓縮彈簧以及至少一第二質量塊。彈片包含二安裝部以及一彎曲部。二安裝部安裝於機殼。彎曲部之相對兩端分別連接於二安裝部。彎曲部之中段與機殼的距離大於彎曲部之相對兩端與機殼的距離。第一質量塊設置於彎曲部之中段。至少一壓縮彈簧之一端設置於二安裝部之一者。至少一第二質量塊之一端連接於至少一壓縮彈簧之另一端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a casing, a hard disk, at least one fan and at least one damping structure. The hard disk is disposed in the casing. The at least one fan is disposed in the casing. The at least one damping structure is located between the hard disk and the at least one fan, and includes an elastic component, a first mass block, at least one compression spring and at least one second mass block. The elastic component includes two mounting portions and a bending portion. The two mounting portions are mounted in the casing. Opposite ends of the bending portion are respectively connected to the two mounting portions. A distance between a central section of the bending portion and the casing is greater than a distance between the opposite ends of the bending portion and the casing. The mass block is disposed on the central section of the bending portion. An end of the at least one compression spring is disposed on one of the two mounting portions. An end of the at least one second mass is connected to another end of the at least one compression spring.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:機殼</p>
        <p type="p">21:機殼本體</p>
        <p type="p">22:第一磁性件</p>
        <p type="p">50:減振結構</p>
        <p type="p">51:彈片</p>
        <p type="p">5122:缺槽</p>
        <p type="p">52:第一質量塊</p>
        <p type="p">521:表面</p>
        <p type="p">522:組裝柱</p>
        <p type="p">523:安裝槽</p>
        <p type="p">53:壓縮彈簧</p>
        <p type="p">54:第二質量塊</p>
        <p type="p">55:第二磁性件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="740px" img-content="tif" inline="yes" orientation="portrait" width="866px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622403</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145813</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16K17/04</main-classification>
        <further-classification edition="200601120241230B">G05D16/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>滙科企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴日欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉安鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具緊急斷氣開關之計時調壓閥</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具緊急斷氣開關之計時調壓閥，包含有：一閥體，具有一閥本體、一進氣孔、一出氣孔、一閥芯腔、一計時腔、一調壓腔及一斷氣腔；一閥芯，設於閥芯腔內，可於一封閉位置至一開放位置間進行往復位移，當閥芯位於開放位置時，調壓腔係與斷氣腔呈連通，當閥芯位於封閉位置時，調壓腔係與斷氣腔呈阻隔；一計時裝置，設於計時腔中，以供使用者預設在多少時間後能自動控制閥芯在封閉位置至開放位置間進行切換者；一調壓裝置，設於調壓腔中，用以調節流入於閥芯腔之流體壓力大小者；一緊急斷氣開關，具有一容置座、一頂桿、一底桿、一止漏塞體、一頂彈簧、一C形扣及一底彈簧；當每按壓頂        &lt;br/&gt;桿一次，頂桿便會帶動底桿下移，並使底桿旋轉一定角度，使得底桿之底桿滑塊會在容置座之深槽與淺槽間變換位置，以使止漏塞體在封閉與未封閉之位置持續移動，以達到快速斷氣與快速恢復供氣之功效。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:緊急斷氣開關</p>
        <p type="p">51:容置座</p>
        <p type="p">511:穿孔</p>
        <p type="p">52:頂桿</p>
        <p type="p">521:底孔</p>
        <p type="p">522:頂桿滑塊</p>
        <p type="p">523:頂桿鋸齒部</p>
        <p type="p">53:底桿</p>
        <p type="p">531:底桿滑塊</p>
        <p type="p">532:底桿斜面</p>
        <p type="p">54:止漏塞體</p>
        <p type="p">55:頂彈簧</p>
        <p type="p">56:C形扣</p>
        <p type="p">57:底彈簧</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.png" file="d10024.TIF" giffile="ed10024.png" height="1020px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622807</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145814</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06N3/08</main-classification>
        <further-classification edition="202301120250303B">G06N3/092</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　毅安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALELLI CHRISTMANN, GUILHERME HENRIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
              <english-address>BR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅應陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YING-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許　哲菡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDALA, HANJAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
              <english-address>ID</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於強化學習的智能體策略生成方法及非暫態電腦可讀取媒體</chinese-title>
        <english-title>METHOD FOR GENERATING AGENT POLICY BASED ON REINFORCEMENT LEARNING AND NON-TRANSITORY COMPUTER-READABLE MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種基於強化學習的智能體策略生成方法及非暫態電腦可讀取媒體，所述方法包括：依據動作網路及智能體的第一狀態產生第一動作供智能體執行，依據價值網路及第一狀態產生第一價值，取得環境產生的智能體的第二狀態及獎勵函數產生的獎勵，儲存第一狀態、第一動作、第一價值、第二狀態及獎勵至緩衝區，依據緩衝區訓練價值網路及動作網路，其中動作網路的損失函數包括策略梯度損失及正則化損失，正則化損失包括第一距離及第二距離，第一距離關聯於第一動作，第二距離關聯於第一動作或第一價值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for generating agent policy based on reinforcement learning and non-transitory computer-readable media is proposed. The method includes generating a first action for an agent to execute according to an actor network and a first state of the agent, generating a first value according to a value network and the first state, obtaining the agent’s second state generated by an environment and a reward generated by a reward function, storing the first state, first action, first value, second state, and reward in a buffer, and training the value network and actor network according to the buffer. The loss function of the actor network includes a policy gradient loss and a regularization loss, where the regularization loss includes a first distance and a second distance, with the first distance related to the first action and the second distance related to the first action or the first value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S4,S5:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="776px" img-content="tif" inline="yes" orientation="portrait" width="581px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623018</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145815</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">H01H3/26</main-classification>
        <further-classification edition="200601120241231B">H01H71/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳錫瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳錫瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>低壓斷路器電動馬達操作器改良裝置</chinese-title>
        <english-title>IMPROVED DEVICE FOR THE MOTOR OPERATOR OF A LOW-VOLTAGE CIRCUIT BREAKER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種低壓斷路器電動馬達操作器改良裝置，可以改善習有技藝其該低壓斷路器電動馬達操作器一般祇有啟斷、閉合、故障跳脫手動復歸以上三種功能，無法滿足電力系統實際市場上的應用需求，本發明除上述功能外並具備現場與外部操作強制啟斷、強制閉合與復歸解除強制功能，並可外部操作附鎖功能，以符合現行電業法中用戶用電設備裝置規則修正版(111.09.01)第841條及現行法規(111.03.17)第155條第四項第一款的要求，防止產生誤送電或誤斷電對人員或設備產生的危害，本發明解決目前全世界低壓斷路器電動馬達操作器無法具備上述功能外，並具備相容式適用任何廠牌低壓斷路器達到經濟性。其主要技術特徵是設置一連動斷路器把手的機構、一滾珠螺桿滑台機構、一電動馬達、一電動馬達剎車裝置、一馬達驅動控制器、一外部指令單元，對該低壓斷路器進行閉合、啟斷、強制閉合、強制啟斷、復歸解除強制狀態的功能操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to an improved device for the motor operator of a low-voltage circuit breaker. It addresses the limitations of conventional motor operators, which typically only provide three functions: opening, closing, and manual reset after fault tripping. These functions are insufficient to meet the practical application needs of modern power systems. In addition to these basic functions, this invention introduces capabilities for local and external forced opening, forced closing, and resetting to cancel the forced state. It also includes an external locking function to comply with the updated requirements of the current Electricity Act and user equipment installation regulations (Amended on September 1, 2022, Article 841) as well as the current regulations (Amended on March 17, 2022, Article 155, Paragraph 4, Item 1). These enhancements help prevent potential hazards to personnel or equipment caused by accidental power delivery or disconnection. </p>
        <p type="p">This invention overcomes the global shortcomings of existing low-voltage circuit breaker motor operators by integrating these advanced functions while maintaining compatibility with circuit breakers from any manufacturer, thereby achieving economic efficiency. </p>
        <p type="p">The main technical features include the following components: </p>
        <p type="p">● A mechanism linked to the circuit breaker handle </p>
        <p type="p">● A ball screw slide mechanism </p>
        <p type="p">● An electric motor </p>
        <p type="p">● An electric motor brake device </p>
        <p type="p">● A motor drive controller </p>
        <p type="p">● An external command unit </p>
        <p type="p">These components enable the low-voltage circuit breaker to perform operations such as closing, opening, forced closing, forced opening, and resetting to cancel the forced state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:低壓斷路器電動馬達操作器改良裝置</p>
        <p type="p">2:斷路器本體</p>
        <p type="p">3:斷路器把手</p>
        <p type="p">4:閉合ON位置</p>
        <p type="p">5:啟斷OFF位置</p>
        <p type="p">10:連動斷路器把手的機構</p>
        <p type="p">20:滾珠螺桿滑台機構</p>
        <p type="p">21:滑台作動固定單元</p>
        <p type="p">30:電動馬達</p>
        <p type="p">40:電動馬達剎車裝置</p>
        <p type="p">50:馬達驅動控制器</p>
        <p type="p">51:接收單元</p>
        <p type="p">52:內部電子電路</p>
        <p type="p">53:微處理器</p>
        <p type="p">54:輸出單元</p>
        <p type="p">60:外部指令單元</p>
        <p type="p">61:控制面板</p>
        <p type="p">62:ON按鍵開關</p>
        <p type="p">63:OFF按鍵開關</p>
        <p type="p">64:強制ON按鍵開關</p>
        <p type="p">65:強制OFF按鍵開關</p>
        <p type="p">66:復歸按鍵開關</p>
        <p type="p">67:鎖匙選擇開關</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="857px" img-content="tif" inline="yes" orientation="portrait" width="742px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622801</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145816</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06N3/02</main-classification>
        <further-classification edition="202301120250303B">G06N3/08</further-classification>
        <further-classification edition="201901120250303B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JENG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳金博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張明清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MING-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>減少大型視覺語言模型產生幻覺的方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR REDUCING HALLUCINATION FROM LARGE VISION-LANGUAGE MODEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種減少大型視覺語言模型產生幻覺的方法及系統。所述方法包括以運算裝置執行的多個步驟，這些步驟包括：取得測試影像，輸入測試影像及提示至大型視覺語言模型以產生測試嵌入，提示用於命令大型語言視覺模型描述測試影像，在多個參考嵌入中找出與測試嵌入最接近的候選嵌入，以候選嵌入在一顯著性維度的資料取代測試嵌入在此顯著性維度的資料，以及大型視覺語言模型依據取代完成的測試嵌入產生測試結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and system for reducing hallucination from Large Vision-Language Model (LVLM) are proposed. The method includes a plurality of steps performed by a computing device, and these steps include: obtaining a test image, inputting the test image and a prompt into the LVLM to generate a test embedding, where the prompt instructs the LVLM to describe the test image; identifying a candidate embedding closest to the test embedding among a plurality of reference embeddings, replacing the data in a salient dimension of the test embedding with that from the candidate embedding in the same salient dimension, and generating a test result based on the modified test embedding by the LVLM.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S4,S5:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="640px" img-content="tif" inline="yes" orientation="portrait" width="608px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622992</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145817</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250220B">G16H30/40</main-classification>
        <further-classification edition="201701120250220B">G06T7/00</further-classification>
        <further-classification edition="201901120250220B">G06F16/53</further-classification>
        <further-classification edition="200601120250220B">A61B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周君諦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUN-TI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳維超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏智斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHIH-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧秋蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIU-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>內視鏡影像的搜尋系統及方法</chinese-title>
        <english-title>SEARCH SYSTEM AND METHOD FOR ENDOSCOPIC IMAGES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種內視鏡影像的搜尋系統及方法。該方法中，特徵擷取模型根據目標影像、多個第一來源影像及第二來源影像，分別產生目標特徵值、多個第一特徵值及多個第二特徵值，這些來源影像來自人體器官的不同區域。接著，計算第一特徵值及第二特徵值各自與目標特徵值之間的多個相似度，再依這些相似度分別計算第一和第二參考值。若第一參考值大於第二參考值，則選取相似度最高的第一來源影像作為搜尋結果；反之，則選擇相似度最高的第二來源影像作為搜尋結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A search system and method for endoscopic images is proposed. In this method, a feature extraction model generates a target feature value, along with multiple first and second feature values based on a target image and multiple first and second source images from different areas of a human organ. Next, the similarity between each first and second feature value and the target feature value is calculated, followed by the computation of first and second reference values based on these similarities. If the first reference value is greater than the second, the source image with the highest similarity among the first values is selected as the search result; otherwise, the source image with the highest similarity among the second values is chosen as the result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-S6:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="888px" img-content="tif" inline="yes" orientation="portrait" width="690px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622444</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145819</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250220B">F28F3/02</main-classification>
        <further-classification edition="200601120250220B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳虹汝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童凱煬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, KAI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>水冷板裝置</chinese-title>
        <english-title>COLD PLATE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水冷板裝置，包含導熱殼、鰭片、進液管及出液管。導熱殼具有散熱空間。鰭片設置於導熱殼，並位於散熱空間。進液管連接於導熱殼遠離鰭片之一側，並與散熱空間相連通。進液管包含第一漸擴部及第一外接部。第一漸擴部與導熱殼及第一外接部相連。第一漸擴部的寬度自連接於第一外接部之一端朝連接於導熱殼之一端遞增。出液管連接於導熱殼遠離鰭片之一側，並與散熱空間相連通。第一漸擴部對應於至少部分之鰭片。第一漸擴部的漸擴方向與鰭片的延伸方向不平行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cold plate device includes a thermally conductive casing, a fin, a liquid inlet pipe and a liquid outlet pipe. The thermally conductive casing has a cooling space. The fin is disposed on the thermally conductive casing, and is located in the cooling space. The liquid inlet pipe is connected to a side of the thermally conductive casing away from the fin, and is in fluid communication with the cooling space. The liquid inlet pipe includes a first gradually expanding portion and a first externally connecting portion. The first gradually expanding portion is connected to the thermally conductive casing and the first externally connecting portion. A width of the first gradually expanding portion increases from an end connected to the first externally connecting portion toward an end connected to the thermally conductive casing. The liquid outlet pipe is connected to the side of the thermally conductive casing away from the fin, and is in fluid communication with the cooling space. The first gradually expanding portion corresponds to at least a part of the fin. An expanding direction of the first gradually expanding portion is not parallel to an extending direction of the fin.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:水冷板裝置</p>
        <p type="p">11:導熱殼</p>
        <p type="p">111:第一殼體</p>
        <p type="p">112:第二殼體</p>
        <p type="p">1121:基部</p>
        <p type="p">1122:凸出部</p>
        <p type="p">13:進液管</p>
        <p type="p">131:第一漸擴部</p>
        <p type="p">132:第一外接部</p>
        <p type="p">14:出液管</p>
        <p type="p">141:第二漸擴部</p>
        <p type="p">142:第二外接部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="628px" img-content="tif" inline="yes" orientation="portrait" width="905px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622693</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145820</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G06F1/20</main-classification>
        <further-classification edition="200601120241231B">F28F11/00</further-classification>
        <further-classification edition="200601120241231B">G01N19/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童凱煬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, KAI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳虹汝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>液冷組件</chinese-title>
        <english-title>LIQUID COOLING ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種液冷組件，包含一液體輸送件及一吸液材。液體輸送件包含一殼體、一入液接頭及至少一出液接頭，入液接頭及至少一出液接頭設置於殼體。吸液材設置於殼體並對應於入液接頭及至少一出液接頭。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid cooling assembly includes a liquid delivering component and an absorbent material. The liquid delivering component includes a casing, an inlet joint and at least one outlet joint. The inlet joint and the at least one outlet joint are disposed on the casing. The absorbent material is disposed on the casing and corresponds to the inlet joint and the at least one outlet joint.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:液冷組件</p>
        <p type="p">10:液體輸送件</p>
        <p type="p">11:殼體</p>
        <p type="p">111:積液槽</p>
        <p type="p">12:入液接頭</p>
        <p type="p">13:出液接頭</p>
        <p type="p">20:吸液材</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="696px" img-content="tif" inline="yes" orientation="portrait" width="904px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622694</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145822</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250123B">G06F1/20</main-classification>
        <further-classification edition="200601120250123B">F28F11/00</further-classification>
        <further-classification edition="200601120250123B">G01N19/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童凱煬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, KAI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳虹汝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>液冷組件</chinese-title>
        <english-title>LIQUID COOLING ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種液冷組件，包含一液體輸送件、一吸液材及一阻水蓋。液體輸送件包含一殼體、一入液接頭及一出液接頭，殼體包含一積液槽，入液接頭及出液接頭設置於殼體且至少部分地位於積液槽。吸液材裝設於殼體的積液槽且部分凸出於積液槽。阻水蓋設置於殼體且與殼體共同包覆吸液材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid cooling assembly includes a liquid delivering component, an absorbent material and a liquid blocking cover. The liquid delivering component includes a casing, an inlet joint and an outlet joint. The casing includes a liquid retention recess. The inlet joint and the outlet joint are disposed on the casing and are partially located in the liquid retention recess. The absorbent material is mounted in the liquid retention recess and partially protrudes out of the liquid retention recess. The liquid blocking cover is disposed on the casing, and the liquid blocking cover and the casing together cover the absorbent material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:液冷組件</p>
        <p type="p">10:液體輸送件</p>
        <p type="p">20:吸液材</p>
        <p type="p">30:阻水蓋</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="722px" img-content="tif" inline="yes" orientation="portrait" width="882px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622584</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145823</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250219B">G02B11/34</main-classification>
        <further-classification edition="202101120250219B">G02B7/02</further-classification>
        <further-classification edition="200601120250219B">G02B3/00</further-classification>
        <further-classification edition="202101120250219B">G03B17/12</further-classification>
        <further-classification edition="202101120250219B">G03B17/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾昱泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YU-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳栢緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>攝像光學鏡片組、取像裝置及電子裝置</chinese-title>
        <english-title>PHOTOGRAPHING OPTICAL LENS ASSEMBLY, IMAGE CAPTURING UNIT AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種攝像光學鏡片組，包含七片透鏡。七片透鏡沿光路由物側至像側依序為第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡與第七透鏡。第一透鏡具有正屈折力，且第一透鏡物側表面於近光軸處為凸面。第二透鏡具有負屈折力。第三透鏡物側表面於近光軸處為凸面。第六透鏡物側表面於近光軸處為凸面，第六透鏡像側表面於近光軸處為凹面，且第六透鏡具有至少一反曲點。第七透鏡具有負屈折力，且第七透鏡物側表面於近光軸處為凹面。當滿足特定條件時，攝像光學鏡片組能同時滿足微型化、大成像面和高成像品質的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A photographing optical lens assembly includes seven lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The first lens element with positive refractive power has an object-side surface being convex in a paraxial region thereof. The second lens element has negative refractive power. The third lens element has an object-side surface being convex in a paraxial region thereof. The sixth lens element has an object-side surface being convex in a paraxial region thereof and an image-side surface being concave in a paraxial region thereof, and the sixth lens element has at least one inflection point. The seventh lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof. When specific conditions are satisfied, the requirements of compact size, large image surface and high image quality can be met by the photographing optical lens assembly, simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:取像裝置</p>
        <p type="p">ST:光圈</p>
        <p type="p">S1,S2:光闌</p>
        <p type="p">E1:第一透鏡</p>
        <p type="p">E2:第二透鏡</p>
        <p type="p">E3:第三透鏡</p>
        <p type="p">E4:第四透鏡</p>
        <p type="p">E5:第五透鏡</p>
        <p type="p">E6:第六透鏡</p>
        <p type="p">E7:第七透鏡</p>
        <p type="p">E8:濾光元件</p>
        <p type="p">IMG:成像面</p>
        <p type="p">IS:電子感光元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="722px" img-content="tif" inline="yes" orientation="portrait" width="719px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623002</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145828</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">H01C7/20</main-classification>
        <further-classification edition="200601120241230B">H01C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光頡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIKING TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭順和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧契佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡朝安</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>耐高溫電阻元件</chinese-title>
        <english-title>HIGH-TEMPERATURE RESISTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種耐高溫電阻元件，其包含：一基板層、一第一表電極層以及第二表電極層。該第一表電極層設置在該基板層的一第一表面，該電阻層部分覆蓋在該第一電極層及該基板層上，該第二表電極層與該第一表電極層對齊設置且覆蓋在該第一表電極層及該電阻層上，使得該電阻層夾持於該第一電極層與該第二電極層之間，該第一表電極層、該電阻層與該第二表電極層形成複合結構用以抑制該耐高溫電阻元件在高溫下的電阻值變化量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A high-temperature resistor is provided and includes a substrate layer, a first surface electrode layer, and a second surface electrode layer. The first surface electrode layer is disposed on a first surface of the substrate layer, the resistance layer partially attaches the first electrode layer and the substrate layer, the second surface electrode layer is aligned with the first surface electrode layer, and attached on the first surface electrode layer and the resistance layer, so that the resistance layer is fixed between the first electrode layer and the second electrode layer. The first surface electrode layer, the resistance layer and the second surface electrode layer form a composite structure to suppress the change in resistance value of the high-temperature resistor at high temperatures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:耐高溫電阻元件</p>
        <p type="p">10:基板層</p>
        <p type="p">20:複合結構</p>
        <p type="p">21:第一表電極層</p>
        <p type="p">22:第二表電極層</p>
        <p type="p">30:電阻層</p>
        <p type="p">40:保護層</p>
        <p type="p">50:第一側電極層</p>
        <p type="p">60:第二側電極層</p>
        <p type="p">70:背電極層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="415px" img-content="tif" inline="yes" orientation="portrait" width="747px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621908</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145829</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250219B">B60B27/02</main-classification>
        <further-classification edition="200601120250219B">B60B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖永原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YUNG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡奕萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, YI-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王怡珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖永原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YUNG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自行車花轂及其防護裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自行車花轂及其防護裝置，包含一花轂本體及一防護裝置。該花轂本體包括一心軸、一轂殼及二軸承。該轂殼圍繞界定出一供該心軸穿設的穿孔。該穿孔具有一開口段。該防護裝置包括一防護套。該防護套具有沿軸向反向設置的一遮蔽段與一套接段。該遮蔽段伸入該開口段且外徑小於但接近該開口段的孔徑。該套接段套設於該心軸。當該防護套套設於該心軸且該遮蔽段伸入該轂殼的開口段時，藉由該防護套具可撓性且該套接段的內徑不大於該心軸的外徑，能提高該防護套與該心軸間的接合緊密度而避免該防護套位移而具有提高防塵效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:花轂本體</p>
        <p type="p">11:心軸</p>
        <p type="p">111:第一端</p>
        <p type="p">113:第一開口</p>
        <p type="p">12:轂殼</p>
        <p type="p">121:穿孔</p>
        <p type="p">122:輻條安裝部</p>
        <p type="p">123:開口段</p>
        <p type="p">13:軸承</p>
        <p type="p">14:端套</p>
        <p type="p">2:防護裝置</p>
        <p type="p">21:防護套</p>
        <p type="p">211:遮蔽段</p>
        <p type="p">212:套接段</p>
        <p type="p">213:連接段</p>
        <p type="p">214:套孔</p>
        <p type="p">216:小孔徑部</p>
        <p type="p">22:第一護蓋</p>
        <p type="p">221:第一塞部</p>
        <p type="p">222:第一蓋部</p>
        <p type="p">23:第二護蓋</p>
        <p type="p">231:第二塞部</p>
        <p type="p">232:第二蓋部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="681px" img-content="tif" inline="yes" orientation="portrait" width="968px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623004</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145830</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01C17/12</main-classification>
        <further-classification edition="200601120250303B">H01C7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光頡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIKING TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳尚仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHANG-REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧契佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡朝安</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>耐電性薄膜電阻結構及其製備方法</chinese-title>
        <english-title>SURGE WITHSTANDING FILM RESISTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種耐電性薄膜電阻結構及其製備方法，耐電性薄膜電阻結構包含基板、合金交界層、電阻層、導體層、保護層及電鍍層。本發明之製備方法利用濺鍍搭配帶有特殊設計之光罩方式將金屬材料以條狀結構形成於基板上。此方法能夠提升電阻耐電性、散熱能力與結合力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A surge withstanding film resistor structure and manufacturing method thereof are provided. The surge withstanding film resistor structure includes a substrate, an adhesive layer, a resistance layer, a conductor layer, a protective layer, and a plating layer. The manufacturing method is combined with a specially designed mask to form a strip structure, thereby enhancing the surge withstanding ability, heat dissipation, and bonding strength.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:耐電性薄膜電阻</p>
        <p type="p">10:基板</p>
        <p type="p">20:合金交界層</p>
        <p type="p">30:電阻層</p>
        <p type="p">41:上導體層</p>
        <p type="p">42:下導體層</p>
        <p type="p">43:側導體層</p>
        <p type="p">50:保護層</p>
        <p type="p">60:電鍍層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="421px" img-content="tif" inline="yes" orientation="portrait" width="724px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622221</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145832</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241206B">C11D1/66</main-classification>
        <further-classification edition="200601120241206B">C11D1/12</further-classification>
        <further-classification edition="200601120241206B">C11D3/33</further-classification>
        <further-classification edition="200601120241206B">C11D3/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖浤峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HONG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖浤峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HONG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴翊慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔劑及包含其之清潔劑組合物</chinese-title>
        <english-title>CLEANER AND CLEANING COMPOSITION INCLUDING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種清潔劑，包括：乙二胺四乙酸四鈉、Triton X-100、十二烷基苯磺酸鈉、椰子油起泡劑、甘油及水；其中，乙二胺四乙酸四鈉於該清潔劑的重量百分比為0.1％至0.5％，Triton X-100於該清潔劑的重量百分比為5％至20％，十二烷基苯磺酸鈉於該清潔劑的重量百分比為2％至15％。本發明另提供一種清潔劑組合物，包括如上所述之清潔劑，另包括：一噴瓶，包括一瓶身及一蓋設於該瓶身之噴頭，該清潔劑容置於該瓶身內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cleaner of the present invention includes: EDTA-4Na, Triton X-100, sodium dodecyl benzene sulfonate, cocamidopropyl betaine, glycerin and water. A weight percentage of EDTA-4Na is between 0.1％ and 0.5％, a weight percentage of Triton X-100 is between 5％ and 20％, and a weight percentage of sodium dodecyl benzene sulfonate is between 2％ and 15％. The present invention further provides a cleaning composition including the cleaner as described above, further including: a spray bottle, including a bottle body and a spray head disposed on the bottle body. The cleaner is received in the bottle body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:清潔劑</p>
        <p type="p">2:噴瓶</p>
        <p type="p">21:瓶身</p>
        <p type="p">22:噴頭</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="837px" img-content="tif" inline="yes" orientation="portrait" width="525px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623265</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145836</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120241231B">H04N23/695</main-classification>
        <further-classification edition="202301120241231B">H04N23/61</further-classification>
        <further-classification edition="202201120241231B">G06V40/10</further-classification>
        <further-classification edition="202001120241231B">G01S15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圓展科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVER INFORMATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊誠愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHENG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於聲源追蹤與影像處理的拍攝系統及方法</chinese-title>
        <english-title>THE CAPTURING SYSTEM AND METHOD BASED ON SOUND SOURCE TRACKING AND IMAGE PROCESSING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提出一種基於聲源追蹤與影像處理的拍攝系統及方法，其中方法包括：攝像裝置依據第一參數拍攝第一影像，依據第二參數拍攝第二影像，運算裝置依據使用者指令在第一影像中設定觸發區，在第二影像中設定展示區，攝像裝置拍攝第三影像，麥克風陣列擷取聲音並產生對應的聲源位置，運算裝置判斷觸發條件是否成立，觸發條件包括第三影像中的目標物件或聲源位置位於觸發區中，當觸發條件成立時，運算裝置控制攝像裝置依據第二參數拍攝展示區，否則控制攝像裝置朝向聲源位置拍攝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An capturing system and method based on sound source tracking and image processing is provided, where the method includes: capturing, by a camera, a first image according to a first parameter and a second image according to a second parameter; setting, by a computing device, a trigger zone in the first image and a display zone in the second image according to an user instruction; capturing a third image by the camera, recording sound and generating a sound source location corresponding to the sound by a microphone array; determining if the trigger condition is met by the computing device, where the trigger condition includes whether a target object in the third image or the sound source location is within the trigger zone; controlling the camera to capture the display zone according to the second parameter by the computing device if the trigger condition is met; otherwise, controlling the camera to capture toward the sound source location.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S2,S3,S4,S5,S6:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="722px" img-content="tif" inline="yes" orientation="portrait" width="723px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621873</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145837</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16B47/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英屬維京群島商祥茂光電科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRIME WORLD INTERNATIONAL HOLDINGS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>VG</english-country>
              <english-address>VG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仁輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡詠筌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YUNG-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪禕婕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於散熱墊片的吸盤裝置及包含其的吸取設備</chinese-title>
        <english-title>SUCKING DEVICE AND SUCKING APPARATUS INCLUDING THE SAME FOR HEAT DISSIPATION PADS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種吸盤裝置及包含其的吸取設備。吸盤裝置包含第一吸盤本體以及第二吸盤本體。第一吸盤本體具有第一表面、第二表面、第一空腔、第一通孔以及多個第一吸附孔，其中第一通孔位於第一表面，這些第一吸附孔位於第二表面，且第一通孔經由第一空腔與這些第一吸附孔連通。第二吸盤本體耦接於第一吸盤本體且具有第三表面、第四表面、第二空腔、第二通孔以及多個第二吸附孔，其中第二通孔位於第三表面，這些第二吸附孔位於第四表面，第二通孔經由第二空腔與這些第二吸附孔連通，且第一空腔與第二空腔不連通。第二表面不平行於第四表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a sucking device and a sucking apparatus including the same. The sucking device includes a first sucking body and a second sucking body. The first sucking body has a first surface, a second surface, a first chamber, a first through-hole, and multiple first sucking holes. The first through-hole is on the first surface. The first sucking holes are on the second surface. The first through-hole communicates with the first sucking holes via the first chamber. The second sucking body is coupled to the first sucking body and has a third surface, a fourth surface, a second chamber, a second through-hole, and multiple second sucking holes. The second through-hole is on the third surface. The second sucking holes are on the fourth surface. The second through-hole communicates with the second sucking holes via the second chamber. The first chamber and the second chamber do not communicate with each other. The second surface is not parallel to the fourth surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:吸盤裝置</p>
        <p type="p">100:第一吸盤本體</p>
        <p type="p">120:第二表面</p>
        <p type="p">150:第一吸附孔</p>
        <p type="p">200:第二吸盤本體</p>
        <p type="p">220:第四表面</p>
        <p type="p">250:第二吸附孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="814px" img-content="tif" inline="yes" orientation="portrait" width="682px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623330</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145841</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">H05K5/02</main-classification>
        <further-classification edition="200601120241230B">H05K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恒昌行精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANWIT PRECISION INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾英智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李毓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無段式緩衝解鎖之固定裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種無段式緩衝解鎖之固定裝置，包括：一基座，其包括有本體且本體內部具有一容置室，於本體底側設有位於中間處之穿孔及位於後端之卡塊；一滑座，其穿設於基座之容置室中，滑座包括基板且基板中具有對應穿孔位置之漸變槽，漸變槽二端各形成有較窄之鎖定側及較寬之解鎖側，另於基板底部二側各形成有向下凸伸有抵持體及以傾斜角度接觸於卡塊之擋止面，且基板於對應抵持體前方與本體前端之間設有彈性體；一頂持座，其包括固定於預設機盒之板座中的定位盤，定位盤向上凸設有伸入基座之穿孔及滑座之漸變槽中的定位桿，於定位盤與定位桿之間形成有環形頂面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">10:容置室</p>
        <p type="p">11:本體</p>
        <p type="p">12:卡塊</p>
        <p type="p">13:抵持彈片</p>
        <p type="p">14:擋板</p>
        <p type="p">16:定位體</p>
        <p type="p">2:滑座</p>
        <p type="p">20:漸變槽</p>
        <p type="p">201:鎖定側</p>
        <p type="p">202:解鎖側</p>
        <p type="p">21:基板</p>
        <p type="p">22:抵持體</p>
        <p type="p">23:擋止面</p>
        <p type="p">24:彈性體</p>
        <p type="p">25:操作部</p>
        <p type="p">3:頂持座</p>
        <p type="p">31:定位盤</p>
        <p type="p">311:環形頂面</p>
        <p type="p">32:定位桿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="704px" img-content="tif" inline="yes" orientation="portrait" width="919px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622683</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145843</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G05D23/27</main-classification>
        <further-classification edition="200601120260302B">G05D23/30</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>技鼎股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PREMTEK INTERNATIONAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林武郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WU-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖柏亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, BO-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱政斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JENG-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范劭寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, SHAO-NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉怡良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIOU, YI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林庭如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TING-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體晶圓製程溫控方法及其運算控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體晶圓製程溫控方法，適用於依照一預設溫控曲線控制一半導體的製程溫度，對於該製程時段之每一時間點，該方法藉由一運算控制裝置來實施並包含以下步驟：(A)在接收到對應於該時間點之一光學量測溫度後，利用一用於將一待轉換之光學量測溫度轉換成一經轉換之製程溫度的溫度轉換模型，將該光學量測溫度轉換為該時間點所對應的該製程溫度；(B)根據該製程溫度與該預設溫控曲線在對應該時間點的溫度獲得一溫度差值；(C)根據該溫度差值計算出一待調整功率；及(D)根據該待調整功率控制一溫度調控裝置，以調控溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">401~406:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="889px" img-content="tif" inline="yes" orientation="portrait" width="728px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623302</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145844</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">H05B3/16</main-classification>
        <further-classification edition="200601120241231B">H05B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳正豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高經凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHING-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林峻逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA, SHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>加熱組件</chinese-title>
        <english-title>HEATING ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種加熱組件，用以加熱一料管並包含一組裝筒、一線圈隔離件以及一線圈組件。組裝筒具有一外表面及一安裝槽。安裝槽從外表面徑向地向內凹陷。組裝筒用以圍繞料管。線圈隔離件設置於安裝槽。線圈組件沿著線圈隔離件設置於安裝槽中並用以加熱料管。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heating assembly configured to heat a barrel and includes a mounting barrel, a coil assembly insulation component, and a coil. The mounting barrel has an outer surface and a mounting recess radially recessed inwards therefrom. The mounting barrel is configured to surround the barrel. The coil insulation component is disposed in the mounting recess. The coil assembly is disposed in the mounting recess along the coil insulation component and configured to heat the barrel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:加熱組件</p>
        <p type="p">100:組裝筒</p>
        <p type="p">110:第一組裝部</p>
        <p type="p">120:第二組裝部</p>
        <p type="p">300:隔熱支撐件</p>
        <p type="p">400:安裝筒</p>
        <p type="p">410:第一安裝部</p>
        <p type="p">420:第二安裝部</p>
        <p type="p">500:磁鐵</p>
        <p type="p">520:第二板部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="708px" img-content="tif" inline="yes" orientation="portrait" width="830px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623065</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145846</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">H01M4/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙克傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, KO-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭文欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEN-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瀛方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YING-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡銘浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-HAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林義暐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>乾式電極滾壓成膜系統</chinese-title>
        <english-title>DRY ELECTRODE FILM FORMING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種乾式電極滾壓成膜系統，包含一定量供料裝置、一粉料均勻輸出裝置及一滾壓裝置。定量供料裝置具有一輸料口及一供料口，輸料口用以供粉料輸入，且供料口用以輸出粉料。粉料均勻輸出裝置具有一接收部、一輸送通道及一輸出口，接收部對應於供料口以接收來自供料口所輸出的粉料，輸送通道連接接收部及輸出口，輸送通道的寬度自接收部朝輸出口的方向漸增以將粉料均勻分布地輸送至輸出口，而使輸出口均勻且定量地輸出粉料。滾壓裝置對應於輸出口，且用以將自輸出口輸出的粉料滾壓成膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dry electrode film forming system includes a constant amount feeding device, a powder uniform deliver device and a rolling device. The constant amount feeding device has a powder inlet and a supply outlet. The powder inlet is configured for powder to be input therein. The supply outlet is configured to output the powder. The powder uniform deliver device has a receiving portion, a delivering channel and a powder outlet. The receiving portion corresponds to the supply outlet for receiving the powder from the supply outlet. The delivering channel is connected to the receiving portion and the powder outlet, and the delivering channel has a width gradually increasing along a direction from the receiving portion to the powder outlet for uniformly distributing and delivering the powder to the powder outlet, such that the powder outlet uniformly output the powder with a constant amount. The rolling device corresponds to the powder outlet for rolling the powder from the powder output to a film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:乾式電極滾壓成膜系統</p>
        <p type="p">10:定量供料裝置</p>
        <p type="p">11:輸料口</p>
        <p type="p">13:供料口</p>
        <p type="p">20:粉料均勻輸出裝置</p>
        <p type="p">21:托盤</p>
        <p type="p">211:接收部</p>
        <p type="p">212:輸出口</p>
        <p type="p">22:震動產生器</p>
        <p type="p">23:均勻化模具</p>
        <p type="p">24:導料件</p>
        <p type="p">241:導料部</p>
        <p type="p">242:導引通道</p>
        <p type="p">30:滾壓裝置</p>
        <p type="p">θ:傾斜角度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="982px" img-content="tif" inline="yes" orientation="portrait" width="687px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621839</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145847</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B23Q3/157</main-classification>
        <further-classification edition="200601120241230B">B23B25/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韻巧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUN-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林勇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>刀具定位裝置及方法</chinese-title>
        <english-title>CUTTING TOOL POSITIONING DEVICE AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種刀具定位方法，適用於包含多個刀套及基座的鏈式刀庫，所述刀具定位方法包含：沿不同於所述多個刀套的移動方向的感測方向朝所述多個刀套進行距離感測，根據距離感測所得之感測資料取得對應於連續時間的時序波形，將時序波形轉換為正弦波形，及根據正弦波形的多個測定波峰位置與多個預設波峰位置，決定所述多個刀套各自的位置偏移量。一種刀具定位裝置，適用於包含多個刀套及基座的鏈式刀庫，包含距離感測器及訊號處理裝置，其中距離感測器設置於基座，訊號處理裝置連接於距離感測器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tool positioning method suitable for a chain-type tool magazine comprising a plurality of tool holders and a base, the tool positioning method comprising: performing distance sensing toward the plurality of tool holders along a sensing direction different from a movement direction of the tool holders; acquiring a time-series waveform corresponding to continuous time from the sensing data obtained through distance sensing; converting the time-series waveform into a sinusoidal waveform; and determining the position offsets of the plurality of tool holders based on a plurality of preset peak positions and the measured peak positions of the sinusoidal waveform. A tool positioning device suitable for a chain-type tool magazine comprising a plurality of tool holders and a base, the device comprising: a distance sensor disposed on the base, and a signal processing unit connected to the distance sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:刀具定位裝置</p>
        <p type="p">11:距離感測器</p>
        <p type="p">12:訊號處理裝置</p>
        <p type="p">13:控制器</p>
        <p type="p">2:鏈式刀庫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="424px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621822</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145848</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B23D31/00</main-classification>
        <further-classification edition="200601220241230B">B21J19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>春日機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林晧旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>剪斷裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種剪斷裝置，適用於安裝在一基座，並包含一可拆離地卡制於該基座上且沿一行程方向延伸的剪斷模組、一被該剪斷模組套設的剪刀桿，及一可拆離地固定於該剪刀桿上的刀具。該剪斷模組開設有一沿一垂直該行程方向的送線方向延伸的穿孔。該剪刀桿可受推動而相對於該剪斷模組沿該行程方向移動。該剪斷裝置將該剪斷模組、該剪刀桿，及該刀具整合成一個組件，並以非螺絲鎖固的卡制方式安裝於該基座上，如此一來作業人員僅需將該剪斷模組由該基座上拆下，便可將整個剪斷裝置拆離鍛造成型機，無需另外使用工具，也不用旋固螺栓，操作步驟簡易且可節省操作空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:剪斷裝置</p>
        <p type="p">4:剪斷模組</p>
        <p type="p">41:主殼體</p>
        <p type="p">411:活動插槽</p>
        <p type="p">412:導槽</p>
        <p type="p">413:推料孔</p>
        <p type="p">43:安裝座</p>
        <p type="p">44:推料桿</p>
        <p type="p">5:剪刀桿</p>
        <p type="p">51:桿殼體</p>
        <p type="p">6:刀具</p>
        <p type="p">61:剪刀片</p>
        <p type="p">62:剪刀仁</p>
        <p type="p">621:線孔</p>
        <p type="p">7:墊片</p>
        <p type="p">A:行程方向</p>
        <p type="p">B:寬度方向</p>
        <p type="p">C:送線方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="902px" img-content="tif" inline="yes" orientation="portrait" width="626px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622498</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145853</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">G01N27/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁特電子企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIGHT ELECTRONIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏奕韓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, YI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林品萱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PIN HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾智勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIN YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高仕棻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, SHIH FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張貴雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUEI-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YI SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>溶氧電極組件及液體溶氧量的測量方法</chinese-title>
        <english-title>DISSOLVED OXYGEN ELECTRODE ASSEMBLY AND METHOD FOR MEASURING THE AMOUNT OF DISSOLVED OXYGEN IN LIQUID</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種溶氧電極組件，包括：本體、殼體及蓋體。本體的表面突出有彼此相鄰的工作電極、輔助電極及參考電極。殼體連接本體，且容納參考電極。工作電極及輔助電極位於殼體外。殼體於遠離本體的一側具有第一開口，第一開口設有一離子交換膜。蓋體連接本體並容納輔助電極、工作電極以及殼體，蓋體於遠離本體的一側具有第二開口，第二開口設有氣體交換膜。亦提供一種使用上述溶氧電極組件的及液體溶氧量的測量方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dissolved oxygen electrode assembly includes a main body, a shell and a cover. The main body has a working electrode, a counter electrode and a reference electrode adjacent to each other protrude from a surface of the main body. The shell is connected to the main body and accommodates the reference electrode. The working electrode and counter electrode are located outside the shell. The shell has a first opening on a side away from the main body, and an Ion exchange film is provided in the first opening. The cover is connected to the main body and accommodates the counter electrode, the working electrode and the shell. The cover has a second opening on a side away from the main body. The second opening is provided with a gas exchange film. A method for measuring the amount of dissolved oxygen in liquid using the dissolved oxygen electrode assembly is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:溶氧電極組件</p>
        <p type="p">1:本體</p>
        <p type="p">11:工作電極</p>
        <p type="p">11a:延伸部</p>
        <p type="p">11b:工作部</p>
        <p type="p">12:輔助電極</p>
        <p type="p">13:參考電極</p>
        <p type="p">2:殼體</p>
        <p type="p">21:第一開口</p>
        <p type="p">22:離子交換膜</p>
        <p type="p">3:蓋體</p>
        <p type="p">31:第二開口</p>
        <p type="p">32:氣體交換膜</p>
        <p type="p">41:第一電解液</p>
        <p type="p">42:第二電解液</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="441px" img-content="tif" inline="yes" orientation="portrait" width="609px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622517</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145862</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250310B">G01R1/20</main-classification>
        <further-classification edition="200601120250310B">G01R1/02</further-classification>
        <further-classification edition="200601120250310B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>興城科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRUM TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊東益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TONY-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓柏揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, PAI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許皓威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSH, HAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>檢測一待測電子元件之裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR DETECTING AN ELECTRONIC COMPONENT TO BE TESTED</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於檢測一待測電子元件之裝置，包含一加熱模組、以及一溫度監控模組。該加熱模組對該待測電子元件加熱。該溫度監控模組電連接於該加熱模組，並監測與管控該待測電子元件的一溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for detecting an electronic component to be tested includes a heating module and a temperature monitoring module. The heating module heats the electronic component to be tested. The temperature monitoring module is electrically connected to the heating module, and monitors and controls a temperature of the electronic component to be measured.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:檢測待測電子元件的裝置</p>
        <p type="p">62:溫度監控模組</p>
        <p type="p">52:加熱模組</p>
        <p type="p">500:待測電子元件</p>
        <p type="p">525:處理單元</p>
        <p type="p">526:溫度監測單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="579px" img-content="tif" inline="yes" orientation="portrait" width="513px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622919</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145863</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G08B5/36</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳碩鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳碩鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHUO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>動態逃生指示燈具</chinese-title>
        <english-title>DYNAMIC ESCAPE INDICATOR LIGHT FIXTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種動態逃生指示燈具，包括一燈具，其設有一顯示裝置，該顯示裝置可顯示一往該燈具左方方向逃生或往該燈具右方方向逃生之指示燈號，該燈具之左側側面與右側側面上分別設有一雷射指示燈，且該顯示裝置顯示往該燈具左方方向逃生之指示燈號時，該燈具左側側面之雷射指示燈可同步投射一雷射光束，而該顯示裝置顯示往該燈具右方方向逃生之指示燈號時，該燈具右側側面之雷射指示燈可同步投射一雷射光束。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dynamic escape indicator light fixture, including a light fixture, which is provided with a display device. The display device can display an indicator light signal to escape to the left of the light fixture or to the right direction of the light fixture. The left side of the light fixture is connected to There is a laser indicator light on the right side, and when the display device displays an escape signal to the left of the lamp, the laser indicator light on the left side of the lamp can simultaneously project a laser beam, and the When the display device displays an escape signal to the right of the lamp, the laser indicator light on the right side of the lamp can simultaneously project a laser beam.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:燈具</p>
        <p type="p">11:顯示裝置</p>
        <p type="p">112:指示燈號</p>
        <p type="p">2:雷射指示燈</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="661px" img-content="tif" inline="yes" orientation="portrait" width="719px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623232</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145868</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L41/50</main-classification>
        <further-classification edition="202201120250303B">H04L67/50</further-classification>
        <further-classification edition="202201120250303B">H04L69/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>儲韶廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHAO TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂侑陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭哲瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可擴充性之服務延伸系統、裝置、方法及其電腦可讀媒介</chinese-title>
        <english-title>SCALABLE SERVICE EXTENSION SYSTEM, DEVICE, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種可擴充性之服務延伸系統、裝置及其方法，係透過無線技術直接從第三方雲端服務伺服器下載通訊協定包，藉以擴充不同雲端服務之間的設備通訊協定，如此，無須設置多個廠牌之服務閘道器，即可完成設備綁定、控制等，另外，本發明之可擴充性服務延伸裝置可自動組網，有利於使用者無須人工執行組網程序而自動完成組網。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a scalable service extension system, device and method thereof. In the present invention, communication protocol packages are download directly from third-party cloud service servers through wireless technology, thereby device communication protocols between different cloud services can be expanded. In this way, there is no need to install service gateways of multiple brands to complete device binding and control, etc... In addition, a scalable service extension device of the present invention can automatically construct network, which is beneficial to users without having to manually perform procedures of network construction and can complete network construction automatically. The present invention also provides a computer-readable medium for executing the method of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:可擴充性之服務延伸系統</p>
        <p type="p">11:使用者裝置</p>
        <p type="p">12:雲端服務伺服器</p>
        <p type="p">13:可擴充性服務延伸裝置</p>
        <p type="p">14:受控裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="547px" img-content="tif" inline="yes" orientation="portrait" width="646px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622612</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145870</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241223B">G02F1/1333</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐嘉均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>
                </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丘兆仟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHAO-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示面板</chinese-title>
        <english-title>DISPLAY PANEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種顯示面板，包括像素陣列層以及遮蔽結構。像素陣列層包括多個像素單元。各像素單元包括第一訊號線以及第二訊號線，其中第一訊號線沿第一方向延伸。遮蔽結構包括對應第一訊號線的第一遮蔽層，以及對應第二訊號線的第二遮蔽層。第一遮蔽層在像素陣列層的垂直投影重疊第一訊號線的第一側邊，且不重疊第一訊號線的第二側邊。第二遮蔽層在像素陣列層的垂直投影的第一部分在第一方向上重疊第二訊號線的第一側邊且與第二訊號線的本體區域不完全重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel including a pixel array layer and a shielding structure is provided. The pixel array layer includes a plurality of pixel units. Each pixel unit includes a first signal line and a second signal line, wherein the first signal line extends along a first direction. The shielding structure includes a first shielding layer corresponding to the first signal line and a second shielding layer corresponding to the second signal line. A vertical projection of the first shielding layer on the pixel array layer overlaps a first side of the first signal line, and does not overlap a second side of the first signal line. A vertical projection of the second shielding layer on the pixel array layer overlaps a first side of the second signal line along the first direction, and does not completely overlap a body region of the second signal line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:顯示面板</p>
        <p type="p">101:閘極線</p>
        <p type="p">102:數據線</p>
        <p type="p">102P:尖角區</p>
        <p type="p">103:第一遮蔽層</p>
        <p type="p">104:第二遮蔽層</p>
        <p type="p">104A:第一遮蔽線</p>
        <p type="p">104B:第二遮蔽線</p>
        <p type="p">106A、106B:重疊區域</p>
        <p type="p">PL:像素陣列層</p>
        <p type="p">PX:像素單元</p>
        <p type="p">SL:遮蔽結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="686px" img-content="tif" inline="yes" orientation="portrait" width="785px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622474</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145872</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260303B">G01K7/01</main-classification>
        <further-classification edition="202601120260303B">H10W40/80</further-classification>
        <further-classification edition="200601120260303B">H03F1/30</further-classification>
        <further-classification edition="200601120260303B">H03F3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊博翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PO-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>溫度感測結構與射頻電路</chinese-title>
        <english-title>TEMPERATURE SENSING STRUCTURE AND RADIO FREQUENCY CIRCUIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種溫度感測結構，用以感測一待測物的溫度。所述溫度感測結構包括一溫度感測元件以及一熱傳導部件。熱傳導部件耦接於溫度感測元件與該待測物之間，以進行熱傳導。上述熱傳導部件包括一第一金屬體、一第二金屬體以及一金屬-絕緣體-金屬結構。第一金屬體耦接溫度感測元件，第二金屬體耦接待測物，金屬-絕緣體-金屬結構則連接於第一金屬體與第二金屬體之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A temperature sensing structure for sensing a temperature of an object to be tested is provided. The temperature sensing structure includes a temperature sensing element and a thermal conduction component. The thermal conductive component is coupled between the temperature sensing element and the object to be tested for thermal conduction. The thermal conductive component includes a first metal body, a second metal body and a metal-insulator-metal structure. The first metal body is coupled to the temperature sensing element, the second metal body is coupled to the object to be tested, and the metal-insulator-metal structure is connected between the first metal body and the second metal body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:溫度感測結構</p>
        <p type="p">101:基底</p>
        <p type="p">102:待測物</p>
        <p type="p">104:第一金屬體</p>
        <p type="p">106:第二金屬體</p>
        <p type="p">108:金屬-絕緣體-金屬結構</p>
        <p type="p">110:第三金屬體</p>
        <p type="p">112:絕緣體</p>
        <p type="p">114:第四金屬體</p>
        <p type="p">116:導通孔</p>
        <p type="p">118:第五金屬體</p>
        <p type="p">120:介電層</p>
        <p type="p">d1、d2、d3:最短距離</p>
        <p type="p">t:厚度</p>
        <p type="p">TC:熱傳導部件</p>
        <p type="p">TS:溫度感測元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="713px" img-content="tif" inline="yes" orientation="portrait" width="941px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623157</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145877</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H02M1/08</main-classification>
        <further-classification edition="200601120250303B">H02J7/04</further-classification>
        <further-classification edition="200601120250303B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立澎湖科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>澎湖縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃奕舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉振宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭伯宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>降壓型充電器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種降壓型充電器，其電路內包含有一緩震電路，緩震電路係由一電感及一電容組成，並與一輸出電感互為耦合，藉此，使得降壓型充電器能利用所提供的緩震電路，令充電器內的主開關達到零電壓導通及零電流截止的柔性切換功能，同時緩震電路可以降低主開關的電壓及電流應力，讓半導體器件在高頻環境下，壽命得以延長，大幅提高其實用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:緩震電路</p>
        <p type="p">12:電感</p>
        <p type="p">14:電容</p>
        <p type="p">16:輸出電感</p>
        <p type="p">20:主開關</p>
        <p type="p">21:二極體</p>
        <p type="p">22:電晶體</p>
        <p type="p">30:電源</p>
        <p type="p">40:電阻</p>
        <p type="p">50:有極電容</p>
        <p type="p">60:整流二極體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="568px" img-content="tif" inline="yes" orientation="portrait" width="972px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622925</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145878</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241209B">G09B9/30</main-classification>
        <further-classification edition="200601120241209B">G02B27/01</further-classification>
        <further-classification edition="202301320241209B">B64U101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>允和科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUNHE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊柏峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, PO-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>無人機訓練模擬系統</chinese-title>
        <english-title>UAV TRAINING SIMULATION SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種無人機訓練模擬系統，其包含相互耦接的頭戴式顯示裝置、操作裝置及處理裝置。頭戴式顯示裝置具有第一通訊模組及顯示模組；操作裝置具有操作手把，操作手把能夠藉由第二通訊模組輸出控制訊號；處理裝置具有資料庫模組、執行模組及第三通訊模組，資料庫模組儲存有訓練模擬程式，執行模組自資料庫模組取得並執行訓練模擬程式，以輸出訓練畫面資訊，並使顯示模組根據訓練畫面資訊顯示包含有訓練場景及無人機的訓練畫面，第三通訊模組接收並輸出控制訊號至執行模組，執行模組根據控制訊號控制訓練畫面中的無人機於訓練場景移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A UAV training simulation system consisting of a coupled head-mounted display device, operating device, and processing device. The head-mounted display device has a first communication module and a display module; The operating device has an operating handle, and the operating handle can output a control signal by the second communication module; The processing device has a database module, an execution module and a third communication module, the database module stores a training simulation program, the execution module obtains and executes the training simulation program from the database module, outputs the training screen information, makes the display module display the training screen that comprises the training scene and the UAV according to the training screen information, the third communication module receives and outputs the control signal to the execution module, and the execution module controls the UAV in the training screen to move in the training scene according to the control signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:無人機訓練模擬系統</p>
        <p type="p">10:頭戴式顯示裝置</p>
        <p type="p">11:第一通訊模組</p>
        <p type="p">12:顯示模組</p>
        <p type="p">121:訓練畫面</p>
        <p type="p">20:操作裝置</p>
        <p type="p">21:操作手把</p>
        <p type="p">211:第二通訊模組</p>
        <p type="p">30:處理裝置</p>
        <p type="p">30a:資料庫模組</p>
        <p type="p">30b:執行模組</p>
        <p type="p">30c:第三通訊模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="932px" img-content="tif" inline="yes" orientation="portrait" width="586px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622846</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145881</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q30/0201</main-classification>
        <further-classification edition="202301120250303B">G06Q30/02</further-classification>
        <further-classification edition="202301120250303B">G06Q30/06</further-classification>
        <further-classification edition="202201120250303B">G06V40/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳世光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHIH-KUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>零售商店顧客行為分析系統</chinese-title>
        <english-title>CUSTOMER BEHAVIOR ANALYSIS SYSTEM FOR RETAIL STORES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種零售商店顧客行為分析系統，由多個攝影裝置及一處理終端組成，攝影裝置能拍攝店內動態影像，生成即時監控資訊並向外傳送。處理終端整合資料庫、通訊模組及運算模組，通過深度學習技術進行影像分割和物體檢測，對應資料庫中的區域資料和人物模型，標記顧客特徵並生成人物外框及追蹤中心點，其中，隨顧客移動，運算模組記錄追蹤中心點，繪製移動軌跡，並結合區域資料產生行為分析結果；藉此，能精準確認顧客行動路徑，助力商品陳列優化及行銷策略制定，提升零售效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a customer behavior analysis system for retail stores, comprising multiple imaging devices and a processing terminal. The imaging devices capture dynamic in-store images, generate real-time monitoring information, and transmit it externally. The processing terminal integrates a database, communication module, and computation module, utilizing deep learning techniques for image segmentation and object detection. By correlating with regional data and customer models in the database, the system identifies customer characteristics, generates bounding boxes, and tracks central points. As customers move, the computation module records the tracked central points, maps movement trajectories, and combines regional data to generate behavioral analysis results. This enables precise identification of customer movement paths, supporting optimization of product displays and development of marketing strategies, thereby enhancing retail efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:社群通訊平台</p>
        <p type="p">100:零售商店顧客行為分析系統</p>
        <p type="p">10:攝影裝置</p>
        <p type="p">11:拍攝模組</p>
        <p type="p">12:處理模組</p>
        <p type="p">13:傳輸模組</p>
        <p type="p">20:處理終端</p>
        <p type="p">21:資料庫</p>
        <p type="p">22:通訊模組</p>
        <p type="p">23:運算模組</p>
        <p type="p">24:紀錄模組</p>
        <p type="p">25:顯示模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="677px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623089</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145882</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H01Q1/24</main-classification>
        <further-classification edition="200601120250303B">H01Q3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立澎湖科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>澎湖縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊明霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳明典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雨翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏泓瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於深度學習之陣列天線故障場型補償方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於深度學習之陣列天線故障場型補償方法，其透過饋入特定天線故障之陣列天線單元場型訓練一深度類神經網路，以獲得特定天線故障之陣列天線單元相關的深度類神經網路參數，供對可能發生故障之天線逐一操作上述程序，獲得每種故障天線相對應之深度類神經網路參數，藉以當系統偵測到某一天線故障時，即依據相對應之深度類神經網路輸出未損毀天線所需之振幅及相位，使得剩餘未損毀天線可產生接近原始完整陣列天線單元之場型，具有快速產生接近原始天線場型之效，以維持原有通訊效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:通訊信號處理單元</p>
        <p type="p">20:場型決定單元</p>
        <p type="p">30:深度學習單元</p>
        <p type="p">40:相位及振幅控制單元</p>
        <p type="p">45:相位及振幅損毀偵測元件</p>
        <p type="p">50:陣列天線單元</p>
        <p type="p">55:天線損毀單元偵測元件</p>
        <p type="p">60:場型補償處理單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="871px" img-content="tif" inline="yes" orientation="portrait" width="687px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623327</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145884</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">H05K3/46</main-classification>
        <further-classification edition="200601120241230B">H05K3/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商鵬鼎控股（深圳）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AVARY HOLDING (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商慶鼎精密電子（淮安）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QINGDING PRECISION ELECTRONICS (HUAI' AN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鵬鼎科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARUDA TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉方超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FANG-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈芾雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, FU-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘福偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, FU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何明展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, MING-JAAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電路板及其製造方法</chinese-title>
        <english-title>CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路板包含至少二電路結構、至少二電鍍層、多個氣孔以及二保護層。至少二電路結構中的一者包含一第一導電層、一第一介電層、多個導電元件、一第一膠層、一第二膠層、一第二介電層、一第二導電層、一第三膠層、一第三介電層及一第三導電層。第一介電層位於第一導電層與多個導電元件之間。第二膠層設於第一膠層。第二介電層位於第二膠層與第二導電層之間。第三介電層位於第三膠層與第三導電層之間。至少二電鍍層分別包覆至少二電路結構。多個氣孔形成於第二導電層與至少二電鍍層。二保護層覆蓋至少二電鍍層與多個氣孔。藉此，簡化製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit board includes at least two circuit structures, at least two electroplated layers, a plurality of vent holes, and two protective layers. Each of the at least two circuit structures includes a first conductive layer, a first dielectric layer, a plurality of conductive elements, a first adhesive layer, a second adhesive layer, a second dielectric layer, a second conductive layer, a third adhesive layer, a third dielectric layer, and a third conductive layer. The first dielectric layer is positioned between the first conductive layer and the plurality of conductive elements. The second adhesive layer is disposed on the first adhesive layer. The second dielectric layer is positioned between the second adhesive layer and the second conductive layer. The third dielectric layer is positioned between the third adhesive layer and the third conductive layer. The at least two electroplated layers respectively cover the at least two circuit structures, the plurality of vent holes are formed in the second conductive layer and the at least two electroplated layers, and the two protective layers cover the at least two electroplated layers and the plurality of vent holes. Thus, the manufacturing process can be simplified.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電路板</p>
        <p type="p">110:電路結構</p>
        <p type="p">111:第一導電層</p>
        <p type="p">112:第一介電層</p>
        <p type="p">113:導電元件</p>
        <p type="p">114:第一膠層</p>
        <p type="p">115:第二膠層</p>
        <p type="p">116:第二介電層</p>
        <p type="p">117:第二導電層</p>
        <p type="p">120:電鍍層</p>
        <p type="p">130:保護層</p>
        <p type="p">140:空腔</p>
        <p type="p">150:黏合層</p>
        <p type="p">171:第三膠層</p>
        <p type="p">172:第三介電層</p>
        <p type="p">173:第三導電層</p>
        <p type="p">AH:氣孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="702px" img-content="tif" inline="yes" orientation="portrait" width="1034px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623270</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145885</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250922B">H04R1/02</main-classification>
        <further-classification edition="200601120250922B">H04R5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耕榆有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王肇朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王健丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易撰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具傾斜擺放之圓弧反射腔室的音箱結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種具傾斜擺放之圓弧反射腔室的音箱結構，包括一箱體、一揚聲器與一殼體，其中，該揚聲器安裝至該箱體的前側，且該揚聲器的前側形成一參考平面，該參考平面位於由橫軸(X軸)與縱軸(Y軸)構成的座標平面上；該殼體安裝至該箱體的後側，其前側朝內凹設形成一圓弧反射腔室，該圓弧反射腔室呈立體圓弧構型，且至少部分位於該揚聲器於該箱體內的聲波傳播方向上，用以反射該揚聲器所產生的聲波，其中，該圓弧反射腔室能沿橫軸(X軸)方向及/或縱軸(Y軸)方向分別傾斜，使得該圓弧反射腔室與該參考平面間，形成一橫向夾角及/或一縱向夾角，如此，透過非對稱的內部結構，能夠抑制駐波的產生，進而提高該音箱結構的聲學性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:音箱結構</p>
        <p type="p">11:箱體</p>
        <p type="p">11A:前蓋件</p>
        <p type="p">11B:中空箱件</p>
        <p type="p">13:揚聲器</p>
        <p type="p">15:殼體</p>
        <p type="p">150:圓弧反射腔室</p>
        <p type="p">R:參考平面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="982px" img-content="tif" inline="yes" orientation="portrait" width="701px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623200</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145889</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">H03H7/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立澎湖科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>澎湖縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊明霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳明典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張政佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>適用於雙頻阻抗轉換電路之設計方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種適用於雙頻阻抗轉換電路及其設計方法，尤指一種具有隨頻率變化的複數阻抗信號源及負載之雙頻阻抗轉換電路，雙頻阻抗轉換電路係由傳輸線和集總元件組成，使其可以工作在兩個任意、且不相關的頻率，其所需之元件數值可由設計之公式獲得，無須耗時之大量數值進行試誤計算，同時可有效縮短設計時程，且所獲得之阻抗轉換電路器具有尺寸精簡的優點，並可避免使用極細或極寬之傳輸線和並聯殘段，大幅提高其實用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">ST&lt;sub&gt;1&lt;/sub&gt;:上段之傳輸線</p>
        <p type="p">ST&lt;sub&gt;2&lt;/sub&gt;:下段之傳輸線</p>
        <p type="p">TL&lt;sub&gt;S&lt;/sub&gt;:左段之傳輸線</p>
        <p type="p">TL&lt;sub&gt;L&lt;/sub&gt;:右段之傳輸線</p>
        <p type="p">Q&lt;sub&gt;B&lt;/sub&gt;:電感</p>
        <p type="p">Q&lt;sub&gt;L&lt;/sub&gt;:負載</p>
        <p type="p">Q&lt;sub&gt;S&lt;/sub&gt;:信號源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10043.JPG" file="ed10043.JPG" height="600px" img-content="tif" inline="yes" orientation="portrait" width="888px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621874</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145890</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B25J15/08</main-classification>
        <further-classification edition="200601120241230B">B22D19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾健明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHIEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, MING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>殼模取放模組及殼模定位裝置</chinese-title>
        <english-title>PICK-AND-PLACE MODULE OF SHELL MOLD AND POSITIONING APPARATUS OF SHELL MOLD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種殼模取放模組，包括取放臂、柱形本體、多個夾爪以及連桿機構。柱形本體組裝至取放臂。連桿機構活動地設置於取放臂且穿設柱形本體，夾爪分別樞接於連桿機構，以使夾爪受連桿機構的驅動而相對於柱形本體運動，並在收縮狀態與伸張狀態之間轉換。當取放臂降下並移向殼模時，處於收縮狀態的夾爪與連桿機構的局部隨柱形本體移入殼模的中空部件。在夾爪受連桿機構的驅動而轉換至伸張狀態時，夾爪抵接並固定於中空部件的內壁，以供取放臂上升時提取殼模。另揭露一種殼模定位裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pick-and-place module of shell module including a pick-and-place arm, a cylindrical body assembled to the pick-and-place arm, a gripper with multi-jaws, and a linkage mechanism is provided. The linkage mechanism movably is disposed on the pick-and-place arm and penetrating the cylindrical body. The gripper pivoted to the linkage mechanism moves relative to the cylindrical body by the linkage mechanism to be transformed between a contracted state and a stretched state. The gripper in the contracted state moves into a hollow part of the shell mold along with the cylindrical body when the pick-and-place arm is lowered down and moves toward the shell mold. Then the gripper is driven by the linkage mechanism and transformed to the stretched state to lean against an inner wall of the hollow part, such that the hollow part and the cylindrical body are fixed together, and the shell is picked-up when the pick-and-place arm is lifted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼模定位裝置</p>
        <p type="p">20:殼模</p>
        <p type="p">100:殼模取放模組</p>
        <p type="p">200:台車</p>
        <p type="p">210:升降機構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="900px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623190</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145891</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03D7/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIAN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIA-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭冠麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, KUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佳蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIA-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>混波器及具有此混波器的接收器系統</chinese-title>
        <english-title>MIXER AND RECEIVER SYSTEM HAVING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種混波器，包含輸入級、開關電路及輸出級。輸入級用以接收本地振盪器訊號且包含變壓器。變壓器用以轉換本地振盪器訊號為差動訊號，其中差動訊號包含正半週訊號及負半週訊號。開關電路電性連接於輸入級及接地端之間，且用以作為轉導級及開關級，其中射頻訊號經由跨導級而被放大轉換為電流訊號，且電流訊號及差動訊號經由開關級而被調製為混合頻率訊號。輸出級電性連接於供電電壓與開關電路之間，且用以輸出混合頻率訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mixer includes an input stage, a switching circuit, and an output stage. The input stage receives a local oscillator signal and includes a transformer. The transformer is used to convert the local oscillator signal into a differential signal, in which the differential signal consists of a positive half-cycle signal and a negative half-cycle signal. The switching circuit is electrically connected between the input stage and a ground terminal and is used as a transconductance stage and a switching stage, in which a RF signal is amplified and converted to a current signal by the transconductance stage and in which the current signal and the differential signal are modulated to a mixed frequency signal by the switching stage. The output stage is electrically connected between a supply voltage and the switching circuit and is used to output the mixed frequency signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:混波器</p>
        <p type="p">121:輸入級</p>
        <p type="p">122:開關電路</p>
        <p type="p">123:輸出級</p>
        <p type="p">124:射頻輸入級</p>
        <p type="p">B&lt;sub&gt;1&lt;/sub&gt;,B&lt;sub&gt;2&lt;/sub&gt;,B&lt;sub&gt;3&lt;/sub&gt;,B&lt;sub&gt;4&lt;/sub&gt;:基極端</p>
        <p type="p">C&lt;sub&gt;G&lt;/sub&gt;:電容器</p>
        <p type="p">D&lt;sub&gt;1&lt;/sub&gt;,D&lt;sub&gt;2&lt;/sub&gt;,D&lt;sub&gt;3&lt;/sub&gt;,D&lt;sub&gt;4&lt;/sub&gt;:汲極端</p>
        <p type="p">G&lt;sub&gt;1&lt;/sub&gt;,G&lt;sub&gt;2&lt;/sub&gt;,G&lt;sub&gt;3&lt;/sub&gt;,G&lt;sub&gt;4&lt;/sub&gt;:閘極端</p>
        <p type="p">IF+:輸出正半週訊號</p>
        <p type="p">IF-:輸出負半週訊號</p>
        <p type="p">L&lt;sub&gt;D1&lt;/sub&gt;:第一電感器</p>
        <p type="p">L&lt;sub&gt;D2&lt;/sub&gt;:第二電感器</p>
        <p type="p">L4:第四電感器</p>
        <p type="p">L5:第五電感器</p>
        <p type="p">LO:本地振盪器訊號</p>
        <p type="p">LO+:正半週訊號</p>
        <p type="p">LO-:負半週訊號</p>
        <p type="p">M&lt;sub&gt;1&lt;/sub&gt;:第一開關</p>
        <p type="p">M&lt;sub&gt;2&lt;/sub&gt;:第二開關</p>
        <p type="p">M&lt;sub&gt;3&lt;/sub&gt;:第三開關</p>
        <p type="p">M&lt;sub&gt;4&lt;/sub&gt;:第四開關</p>
        <p type="p">N:匝數</p>
        <p type="p">GND:接地端</p>
        <p type="p">RF:射頻訊號</p>
        <p type="p">S&lt;sub&gt;1&lt;/sub&gt;,S&lt;sub&gt;2&lt;/sub&gt;,S&lt;sub&gt;3&lt;/sub&gt;,S&lt;sub&gt;4&lt;/sub&gt;:源極端</p>
        <p type="p">T:變壓器</p>
        <p type="p">V&lt;sub&gt;DD&lt;/sub&gt;:供電電壓</p>
        <p type="p">V&lt;sub&gt;G&lt;/sub&gt;:第一電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="679px" img-content="tif" inline="yes" orientation="portrait" width="930px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623007</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145892</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">H01F27/24</main-classification>
        <further-classification edition="200601120241231B">H01F30/12</further-classification>
        <further-classification edition="200601120241231B">H01F3/10</further-classification>
        <further-classification edition="200601120241231B">H01F3/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIAN POWER DEVICES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪宗良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, TSUNG LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>變壓器鐵心</chinese-title>
        <english-title>TRANSFORMER CORE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種變壓器鐵心包括第一鐵心部件、第二鐵心部件以及複數間隔部件。第一鐵心部件包括兩第一側柱與一第一中柱。第二鐵心部件包括兩第二側柱與一第二中柱。第二鐵心部件的兩第二側柱非接觸對接第一鐵心部件的兩第一側柱，第二鐵心部件的第二中柱非接觸對接第一鐵心部件的第一中柱。間隔部件分別配置於非接觸對接的兩第二側柱與兩第一側柱之間以及非接觸對接的第二中柱與第一中柱之間，用以阻斷第一鐵心部件與第二鐵心部件的感應電流路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transformer core includes a first core component, a second core component, and a plurality of separation components. The first core component includes two first side columns and one first center column. The second core component includes two second side columns and one second center column. The two second side columns are connected with the two first side columns in a non-contact manner, and the second center column is connected with the first center column in a non-contact manner. The separation components are respectively disposed between the two second side columns and the two first side columns, and between the second center column and the first center column so as to block induced current paths between the first core component and the second core component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:變壓器鐵心</p>
        <p type="p">1:第一鐵心部件</p>
        <p type="p">2:第二鐵心部件</p>
        <p type="p">11,12:第一側柱</p>
        <p type="p">13:第一中柱</p>
        <p type="p">21,22:第二側柱</p>
        <p type="p">23:第二中柱</p>
        <p type="p">AG1:第一氣隙</p>
        <p type="p">AG2:第二氣隙</p>
        <p type="p">AG3:第三氣隙</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="498px" img-content="tif" inline="yes" orientation="portrait" width="669px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622901</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145893</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">G06V10/40</main-classification>
        <further-classification edition="202201120250303B">G06V10/54</further-classification>
        <further-classification edition="202201120250303B">G06V10/70</further-classification>
        <further-classification edition="202201120250303B">G06V10/764</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人資訊工業策進會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE FOR INFORMATION INDUSTRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張均東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUN-DONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>影像辨識裝置及方法</chinese-title>
        <english-title>IMAGE RECOGNITION APPARATUS AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種影像辨識裝置及方法。該裝置基於一影像進行一特徵擷取運算，以產生一特徵圖。該裝置基於該特徵圖進行一紋理特徵擷取運算，以產生一紋理特徵圖。該裝置基於該紋理特徵圖進行一分類運算，以辨識該影像中的一物件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image recognition apparatus and method are provided. The apparatus performs a feature extraction based on an image to generate a feature map. The apparatus performs a texture feature extraction based on the feature map to generate a texture feature map. The apparatus performs a classification based on the texture feature map to recognize an object in the image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">IMG:影像</p>
        <p type="p">FM:特徵圖</p>
        <p type="p">TFM:紋理特徵圖</p>
        <p type="p">RS:辨識結果</p>
        <p type="p">OP2,OP4,OP6:運作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="770px" img-content="tif" inline="yes" orientation="portrait" width="761px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623169</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145894</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">H02M3/156</main-classification>
        <further-classification edition="200601120250425B">H02M3/335</further-classification>
        <further-classification edition="200601120250425B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全漢企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FSP TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宜鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃振翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CCHENG HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林暉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連人傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAN, REN JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具諧振操作之電源轉換器的開關切換方法</chinese-title>
        <english-title>SWITCHING METHOD OF POWER CONVERTER WITH RESONANT OPERATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具諧振操作之電源轉換器的開關切換方法包括：(a)、偵測電源轉換器的輸出電壓；(b)、計算第一開關的第一導通時間；(c)、取得電源轉換器的諧振週期時間；以及(d)、從第一開關導通時起算，經過第一導通時間、第一截止時間以及諧振週期時間後，導通第二開關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A switching method of a power converter with resonant operation includes steps of: (a) detecting an output voltage of the power converter, (b) calculating a first turned-on time of a first switch, (c) acquiring a resonant period time of the power converter, and (d) turning on a second switch after the first turned-on time, a first turned-off time, and the resonant period time from a time when the first switch is turned on.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S14:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.png" file="d10027.TIF" giffile="ed10027.png" height="599px" img-content="tif" inline="yes" orientation="portrait" width="513px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622003</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145895</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250602B">C02F1/58</main-classification>
        <further-classification edition="200601120250602B">C01F7/54</further-classification>
        <further-classification edition="200601320250602B">C02F101/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中興大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHUNG HSING UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧明俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, MING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種回收氟離子方法</chinese-title>
        <english-title>A METHOD FOR RECOVERING FLUORIDE IONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種回收氟離子方法，其步驟包含：於含氟廢水中，依據其氟離子[F        &lt;sup&gt;-&lt;/sup&gt;]與三價鋁離子[Al        &lt;sup&gt;3+&lt;/sup&gt;]之摩爾比（MR），加入對應摩爾比之三價鋁之鋁鹽沉澱劑；並透過於pH值為3.16至7.0之環境中，藉由含氟廢水之鈉粒子[Na        &lt;sup&gt;+&lt;/sup&gt;]或用以調整pH值之氫氧化鈉（NaOH），以透過反應形成冰晶石（Na        &lt;sub&gt;3&lt;/sub&gt;AlF        &lt;sub&gt;6&lt;/sub&gt;）之形式回收氟離子；藉此，本發明係可均勻、穩定且有效的將廢水之氟化物去除，且其去除率（FR）可達93%，冰晶石之結晶率（CR）亦可達91%；藉此，顯見本發明可防止廢水中之氟化物對環境及生物健康之影響，且所回收之冰晶石不具有毒性，可回收用於其他用途，藉可達致回收及綠色環保之功效。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a method for recovering fluoride ions, which includes the following steps: In fluoride-containing wastewater, based on the molar ratio (MR) of fluoride ions [F        &lt;sup&gt;-&lt;/sup&gt;] to aluminum ions [Al        &lt;sup&gt;3+&lt;/sup&gt;], an aluminum salt precipitant corresponding to the molar ratio of trivalent aluminum is added. In an environment with a pH value ranging from 3.16 to 7.0, fluoride ions are recovered in the form of cryolite (Na3AlF6) through a reaction involving sodium ions [Na        &lt;sup&gt;+&lt;/sup&gt;] from the fluoride wastewater or sodium hydroxide (NaOH) used to adjust the pH value. Thus, the process effectively removes fluoride from the wastewater in a uniform, stable, and efficient manner, with a fluoride removal rate (FR) of up to 93%, and a cryolite crystallization rate (CR) of up to 91%. The present invention can prevent the impact of fluoride in wastewater on the environment and biological health. The recovered cryolite is non-toxic and can be reused for other purposes, achieving both recycling and environmental protection.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:回流管</p>
        <p type="p">11:輸出端</p>
        <p type="p">12:回流端</p>
        <p type="p">2:結晶管</p>
        <p type="p">21:回流部</p>
        <p type="p">3:pH值控制器</p>
        <p type="p">4:廢水輸入端</p>
        <p type="p">5:沉澱劑輸入端</p>
        <p type="p">6:循環泵</p>
        <p type="p">7:輸入泵</p>
        <p type="p">8:玻璃珠</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="1006px" img-content="tif" inline="yes" orientation="portrait" width="696px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622622</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145896</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120250220B">G03B15/02</main-classification>
        <further-classification edition="202101120250220B">G03B15/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶睿通訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIVOTEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王明為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳炳樞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, PING-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>攝影裝置</chinese-title>
        <english-title>CAMERA DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有均勻照明效果的攝影裝置，其包含有基座、複數個攝影單元、光源以及覆蓋件。該複數個攝影單元分布在該基座。該光源位於該複數個攝影單元之間。該覆蓋件設置在該基座以包覆該複數個攝影單元和該光源。該覆蓋件包含中央區域以及外環區域，該外環區域圍繞該中央區域以對應於該複數個攝影單元，該中央區域以一體成型方式連接該外環區域且對應於該光源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera device with an uniform illumination effect includes a base, a plurality of camera units, an light source and a covering component. The plurality of camera units is disposed on the base. The light source is located among the plurality of camera units. The covering component is disposed on the base to cover the plurality of camera units and the light source. The covering component includes a central area and an outer area. The outer area is disposed around the central area and corresponds to the plurality of camera units. The central area is integrated with the outer area monolithically and corresponds to the light source.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:攝影裝置</p>
        <p type="p">12:基座</p>
        <p type="p">14:攝影單元</p>
        <p type="p">16:光源</p>
        <p type="p">18:覆蓋件</p>
        <p type="p">20:承載部</p>
        <p type="p">22:中央區域</p>
        <p type="p">24:外環區域</p>
        <p type="p">26:外殼</p>
        <p type="p">28:透光罩</p>
        <p type="p">30:光發射器</p>
        <p type="p">32:電路基板</p>
        <p type="p">34:出光面</p>
        <p type="p">36:遮光部</p>
        <p type="p">38:頂端</p>
        <p type="p">D1:光源之出光面和基座的距離</p>
        <p type="p">D2:透光罩之頂端和基座的距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="641px" img-content="tif" inline="yes" orientation="portrait" width="890px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623481</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145898</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250731B">H10H29/37</main-classification>
        <further-classification edition="202501120250731B">H10H29/855</further-classification>
        <further-classification edition="200601120250731B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝鎮宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIEH, CHEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置及顯示系統</chinese-title>
        <english-title>DISPLAY DEVICE AND DISPLAY SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包含顯示模組、基板、多個發光顯示單元及多個透鏡單元。基板具有面對顯示模組的第一表面及背對顯示模組的第二表面。這些發光顯示單元設置於第二表面上並呈陣列排列，各發光顯示單元包含多個發光畫素，且各發光畫素包含多個微型發光二極體。這些透鏡單元設置於第二表面上並呈陣列排列，這些透鏡單元與這些發光顯示單元交錯設置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a display module, a substrate, multiple light emitting display units and multiple lens units. The substrate has a first surface facing the display module and a second surface facing away from the display module. The light emitting display units are disposed on the second surface and arranged in array. Each light emitting display unit includes multiple light emitting pixels, and each light emitting pixel includes multiple micro light emitting diodes. The lens units are disposed on the second surface and arranged in array, and the lens units and the light emitting display units are alternately arranged.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">100:顯示模組</p>
        <p type="p">102:基板</p>
        <p type="p">104:發光顯示單元</p>
        <p type="p">106:透鏡單元</p>
        <p type="p">A:區域</p>
        <p type="p">d:距離</p>
        <p type="p">D1:第一方向</p>
        <p type="p">G:間隔</p>
        <p type="p">S1:第一表面</p>
        <p type="p">S2:第二表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="542px" img-content="tif" inline="yes" orientation="portrait" width="970px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622890</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145899</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120250303B">G06T7/41</main-classification>
        <further-classification edition="201701120250303B">G06T7/40</further-classification>
        <further-classification edition="201701120250303B">G06T7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>晶睿通訊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIVOTEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉誠傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>影像內容分析方法及其影像分析設備</chinese-title>
        <english-title>IMAGE CONTENT ANALYSIS METHOD AND IMAGE ANALYSIS APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種應用於影像分析設備的影像內容分析方法，其包含有取得影像，運用邊緣偵測技術以計算該影像之邊緣密度，運用紋理偵測技術以計算該影像之紋理豐富度，以及對該邊緣密度與該紋理豐富度以生成該影像之豐富度分數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image content analysis method is applied to an image analysis apparatus and includes acquiring an image, utilizing an edge detection technology to compute an edge density of the image, utilizing a texture detection technology to compute a texture richness of the image, and analyzing the edge density and the texture richness to generate richness score of the image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S102、S104、S106、S108、S110、S112:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10029.JPG" file="ed10029.JPG" height="547px" img-content="tif" inline="yes" orientation="portrait" width="594px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622870</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145900</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250303B">G06Q40/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許績群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭良加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, LIANG-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱婷婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, TING-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>加速證券下單交易的裝置與方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR ACCELERATING SECURITIES ORDERING TRANSACTIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種加速證券下單交易的裝置與方法。加速證券下單交易的裝置包括一網路單元、一處理單元及複數防火牆。網路單元包括複數網路接孔，此些網路接孔經由複數網路線路分別一對一連接至一交易所系統的複數網路接入口，以形成複數網路連線。處理單元連接網路單元，以將複數交易封包依次循環地經由此些網路接孔中之一傳出。此些網路連線分別一對一通過此些防火牆，使此些交易封包在進入網路接入口之前通過防火牆。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus and a method for accelerating securities ordering transactions are provided. The apparatus for accelerating securities ordering transactions includes a network unit, a processing unit, and a plurality of firewalls. The network unit includes a plurality of network ports, each of which is connected one-to-one via a plurality of network lines to a plurality of network ports of an exchange system, so as to form a plurality of network connections. The processing unit is connected to the network unit to transmit a plurality of transaction packets sequentially and cyclically through one of the network ports. Each of the network connections passes one-to-one through the firewalls, allowing the transaction packets to pass through the firewalls before entering the network ports.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:加速證券下單交易的裝置</p>
        <p type="p">110:網路單元</p>
        <p type="p">113:網路接孔</p>
        <p type="p">120:處理單元</p>
        <p type="p">130:防火牆</p>
        <p type="p">200:交易所系統</p>
        <p type="p">210:網路接入口</p>
        <p type="p">300:券商主機</p>
        <p type="p">400:網路線路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="647px" img-content="tif" inline="yes" orientation="portrait" width="640px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621559</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145908</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241205B">A01K5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玖咪智能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOYMENT SMART CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范耕魁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, KENG-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐詩媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHIH-YUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>寵物餵食裝置</chinese-title>
        <english-title>PET FEEDING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種寵物餵食裝置包含有一寵物食物與電源供應機以及一寵物飲水機。寵物食物與電源供應機包含有複數個充電器，而寵物飲水機包含有一電源接收器，用以電性連接充電器其中之一，以利用充電器提供寵物飲水機所需的電源，且寵物飲水機可根據實際需求，調整寵物飲水機和寵物食物與電源供應機的相對位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pet feeding device includes a pet food and power supply equipment and a pet water dispenser. The pet food and power supply equipment includes a plurality of power chargers, and the pet water dispenser includes a power receiver for electrically connecting one of the power chargers to use the power charger to provide a required power to the pet water dispenser, and adjust the relative position of the pet water dispenser and the pet food and power supply equipment according to actual needs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:寵物餵食裝置</p>
        <p type="p">200:寵物食物與電源供應機</p>
        <p type="p">210:食物盆</p>
        <p type="p">220:食物供給器</p>
        <p type="p">230:防蟻底座</p>
        <p type="p">300:寵物飲水機</p>
        <p type="p">310:飲水盆</p>
        <p type="p">320:給水器</p>
        <p type="p">400:活動攝影機</p>
        <p type="p">410:攝影機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="776px" img-content="tif" inline="yes" orientation="portrait" width="869px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622507</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145912</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">G01P5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹崑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KUN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>風速測量組件</chinese-title>
        <english-title>WIND SPEED MEASURING ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種風速測量組件包含基板、風管、治具以及風速計。基板包含開口。風管自基板之表面突伸。風管之鏤空部位形成通道與開口連通。治具設置於風管上。風速計容置於治具中並位於風管之通道中。通道於一方向上拉長延伸。以所述方向觀之，風速計之暴露於治具中之部位相對於開口置中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wind speed measuring assembly includes a substrate, a wind tube, a fixture, and an anemometer. The substrate includes an opening. The wind tube protrudes from a surface of the substrate. A hollowed portion of the wind tube forms a channel communicating with the opening. The fixture is disposed on the wind tube. The anemometer is accommodated in the fixture and is located in the channel of the wind tube. The channel is elongated in a direction. In a view of the direction, a portion of the anemometer exposed in the fixture is centered relative to the opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:風速測量組件</p>
        <p type="p">110:基板</p>
        <p type="p">120:風管</p>
        <p type="p">122A:第一側板</p>
        <p type="p">122B:第二側板</p>
        <p type="p">122C:第三側板</p>
        <p type="p">122D:第四側板</p>
        <p type="p">130:治具</p>
        <p type="p">140:風速計</p>
        <p type="p">AF:風流</p>
        <p type="p">CH1:通道</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="723px" img-content="tif" inline="yes" orientation="portrait" width="911px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622798</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145916</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250502B">G06F40/56</main-classification>
        <further-classification edition="201301120250502B">G10L13/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓓爾科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭光泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, KUANG TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃照峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>體感式情境互動系統及其實施方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種體感式情境互動系統及其實施方法，供於一應用程式中匯入情境文本（例如網路小說）後，令一語言模型可對情境文本進行分類，以生成對應的文字選項供以選擇，再由一情感分析模型基於所選之選項所對應的文字中，提取一情感關鍵字詞；接續著，一語音合成模型基於情感分析模型的提取結果，合成帶有情感的一人工語音，再經由一訊號轉換模組將人工語音轉換為一語音訊號，透過一音訊輸出模組進行語音播放，另一方面，人工語音亦同時被轉換為一控制訊號傳送至一體感裝置，令其可執行特定的作動模式，以達到情境互動式的情趣體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:體感式情境互動系統</p>
        <p type="p">11:伺服器</p>
        <p type="p">12:網際網路</p>
        <p type="p">111:中央處理模組</p>
        <p type="p">112:語言模型</p>
        <p type="p">113:情感分析模型</p>
        <p type="p">114:語音合成模型</p>
        <p type="p">115:訊號轉換模組</p>
        <p type="p">116:文本資料庫</p>
        <p type="p">117:模型資料庫</p>
        <p type="p">13:使用者端裝置</p>
        <p type="p">14:體感裝置</p>
        <p type="p">131:通訊模組</p>
        <p type="p">141:微控制單元</p>
        <p type="p">132:音訊輸出模組</p>
        <p type="p">142:驅動模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="693px" img-content="tif" inline="yes" orientation="portrait" width="1091px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621922</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145917</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250217B">B60R16/023</main-classification>
        <further-classification edition="202401120250217B">B60K35/81</further-classification>
        <further-classification edition="202401120250217B">B60K35/85</further-classification>
        <further-classification edition="200601120250217B">G09G5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃以恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>座艙顯示系統、智能座艙和車輛</chinese-title>
        <english-title>COCKPIT DISPLAY SYSTEM, INTELLIGENT COCKPIT, AND VEHICLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種座艙顯示系統、智能座艙和車輛。座艙顯示系統包括：車載資訊娛樂控制器，車載資訊娛樂控制器用於生成第一顯示信號，第一顯示信號為基於DP/eDP協議的顯示信號；座艙顯示器，座艙顯示器電連接車載資訊娛樂控制器，座艙顯示器中裝配有協議轉換橋接晶片和顯示驅動晶片，協議轉換橋接晶片用於接收第一顯示信號，及將第一顯示信號轉換為第二顯示信號，第二顯示信號為基於LVDS協議的轉換信號；協議轉換橋接晶片還用於將第二顯示信號傳輸至顯示驅動晶片進行對外顯示。本申請能夠降低座艙顯示系統對外顯示的成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a cockpit display system, an intelligent cockpit, and a vehicle. The system includes a vehicle infotainment controller and a cockpit display. The vehicle infotainment controller is configured to generate a first display signal which is a signal based on a DP/eDP protocol, the vehicle infotainment controller is electrically connected to the cockpit display. The cockpit display is equipped with a protocol conversion bridge chip and a display driver chip, the protocol conversion bridge chip is configured to receive the first display signal and convert the first display signal to a second display signal, which is a conversion signal based on a LVDS protocol. The protocol conversion bridge chip is also configured to transmit the second display signal to the display driver chip for external display. This application can reduce the cost of external display of the cockpit display system.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="458px" img-content="tif" inline="yes" orientation="portrait" width="616px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623331</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145918</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">H05K5/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范姜凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN CHIANG, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李志程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳炯翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIUNG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪志德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIH-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張豫成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣駿麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JYUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏毅倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂忠衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高振庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏聖力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, SHENG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳政鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳奇臨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭修豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSIU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>防水導流片、防水散熱組件以及防水散熱機櫃</chinese-title>
        <english-title>WATERPROOF DIVERSION PLATE, WATERPROOF HEAT DISSIPATION ASSEMBLY AND HEAT DISSIPATION CABINET</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種防水導流片，用於阻擋流體中的目標物，包括本體及擋板。所述本體包括相對設置的第一端和第二端，定義所述第一端至所述第二端為導流方向。所述擋板傾斜連接於本體的第二端，所述擋板被配置為阻擋流動的所述流體中的目標物，所述擋板與所述第二端之間的夾角為60~120度。所述第一端設有缺口，所述缺口被配置為供目標物排出。另，本申請還提供一種防水散熱組件以及防水散熱機櫃。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A waterproof diversion plate for blocking targets in a fluid, which includes a main body and a baffle. The main body includes a first end and a second end that are arranged oppositely. The direction from the first end to the second end is defined as the diversion direction. The baffle is obliquely connected to the second end of the main body. The baffle is configured to block the targets in the flowing fluid, and the angle between the baffle and the second end is 60 to 120 degrees. A notch is provided at the first end, and the notch is configured to allow the targets to be discharged. The waterproof diversion plate provided by this application has the advantages of high-efficiency target blocking ability, simple structure and strong adaptability. In addition, this application also provides a waterproof heat dissipation assembly and a heat dissipation cabinet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">235:限位塊</p>
        <p type="p">231d:第二側</p>
        <p type="p">233:缺口</p>
        <p type="p">234:固定槽</p>
        <p type="p">23:防水導流片</p>
        <p type="p">221:第一邊框</p>
        <p type="p">224:凹槽</p>
        <p type="p">21:安裝板</p>
        <p type="p">223:第一連接部</p>
        <p type="p">211:裝配槽</p>
        <p type="p">222:第二邊框</p>
        <p type="p">T:通道</p>
        <p type="p">231c:第一側</p>
        <p type="p">232:擋板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="693px" img-content="tif" inline="yes" orientation="portrait" width="685px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622180</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145921</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241210B">C08L71/12</main-classification>
        <further-classification edition="200601120241210B">C08L79/08</further-classification>
        <further-classification edition="200601120241210B">C08L55/04</further-classification>
        <further-classification edition="200601120241210B">C08F212/34</further-classification>
        <further-classification edition="200601120241210B">H05K1/03</further-classification>
        <further-classification edition="200601120241210B">B32B15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台光電子材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝鎮宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂組合物及其製品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種樹脂組合物，其包括含乙烯基樹脂，該含乙烯基樹脂包括含乙烯基聚苯醚樹脂、馬來醯亞胺樹脂、含乙烯基聚烯烴樹脂、含乙烯基芳香族芴化合物或其組合；以及預聚物，該預聚物係由一混合物經預聚反應而製得，且該混合物包括乙烯基甲苯-二乙烯基苯共聚物、含乙烯基芳香族芴化合物以及苯并環丁烯改性聚丁二烯二丙烯酸酯。該樹脂組合物可製成各類製品，包括背膠銅箔、積層板或印刷電路板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623493</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145923</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">H10K50/858</main-classification>
        <further-classification edition="202301120250303B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳湲琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李冠鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUAN-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置，其包括基板、第一有機層、第一電子元件、第二有機層以及第一透鏡。基板包括連接部分以及至少兩個主要部分，連接部分連接至少兩個主要部分。第一有機層設置在至少兩個主要部分的其中一個上且包括第一開口。第一電子元件設置在第一開口內。第二有機層設置在第一有機層上且覆蓋第一電子元件。第一透鏡設置在第二有機層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device including a substrate, a first organic layer, a first electronic element, a second organic layer and a first lens is disclosed. The substrate includes a connection portion and at least two main portions, and the connection portion connects the at least two main portions. The first organic layer is disposed on one of the main portions and includes a first opening. The first electronic element is disposed in the first opening. The second organic layer is disposed on the first organic layer and covers the first electronic element. The first lens is disposed on the second organic layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">100C:連接部分</p>
        <p type="p">100M:主要部分</p>
        <p type="p">100P:基板開口</p>
        <p type="p">102:底部基板</p>
        <p type="p">104:黏著層</p>
        <p type="p">110:第一有機層</p>
        <p type="p">110H:通孔</p>
        <p type="p">120:第二有機層</p>
        <p type="p">120a,Sa,100a,110a,130a:上表面</p>
        <p type="p">130:第一透鏡</p>
        <p type="p">130b:下表面</p>
        <p type="p">200:電路層</p>
        <p type="p">I0,I1,I2,I3:絕緣層</p>
        <p type="p">CE:連接件</p>
        <p type="p">CL:導線</p>
        <p type="p">D,D1,D2:深度</p>
        <p type="p">DE:汲極</p>
        <p type="p">E1:第一電極</p>
        <p type="p">E2:第二電極</p>
        <p type="p">ED:電子裝置</p>
        <p type="p">EU:電子元件</p>
        <p type="p">EU1:第一電子元件</p>
        <p type="p">EUM,EDM:封裝層</p>
        <p type="p">GE:閘極</p>
        <p type="p">M1:導電層</p>
        <p type="p">OP1:第一開口</p>
        <p type="p">RE1,RE2:凹槽</p>
        <p type="p">SC:半導體層</p>
        <p type="p">SE:源極</p>
        <p type="p">T1:第一厚度</p>
        <p type="p">T2:第二厚度</p>
        <p type="p">T3:厚度</p>
        <p type="p">TFT:薄膜電晶體</p>
        <p type="p">W1,W2:寬度</p>
        <p type="p">Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="746px" img-content="tif" inline="yes" orientation="portrait" width="1015px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622914</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145925</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120241231B">G06V40/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA EASTERN UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃獻鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIANN-FONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊家程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JIA-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>水果成熟度的辨識系統及辨識方法</chinese-title>
        <english-title>RECOGNIZING SYSTEM AND RECOGNIZING METHOD FOR FRUIT RIPENESS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種水果成熟度的辨識系統及辨識方法，水果成熟度的辨識系統包含一影像擷取模組、連結影像擷取模組的一資料庫、連結資料庫的一分析模組、及連結分析模組的一通訊模組。影像擷取模組能取得一水果像素資料，分析模組計算出水果像素資料中出現最多次的像素值為一待分析像素值，並且分析模組比對待分析像素值與一預設水果熟程度像素表，以得知一水果熟程度資訊。通訊模組傳送水果熟程度資訊至一終端裝置，以顯示水果熟程度資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a a recognizing system and recognizing method for fruit ripeness. The recognizing system for fruit ripeness includes an image capturing module, a database that is linked to the image capturing module, an analysis module that is linked to the database, and a communication module that is linked to the analysis module. The image capturing module is configured to obtain a fruit pixel data. The analysis module calculates that the pixel value that appears the most times in the fruit pixel data is a pixel value to be analyzed, and the analysis module is operated to compare the pixel value to be analyzed with a preset fruit ripeness pixel table to obtain a fruit ripeness information. The communication module is operated to transmit the fruit ripeness information to a terminal device to display the fruit ripeness information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:水果成熟度的辨識系統</p>
        <p type="p">1:影像擷取模組</p>
        <p type="p">11:鏡頭</p>
        <p type="p">12:影像擷取單元</p>
        <p type="p">2:資料庫</p>
        <p type="p">3:分析模組</p>
        <p type="p">31:預處理單元</p>
        <p type="p">32:分析單元</p>
        <p type="p">4:通訊模組</p>
        <p type="p">T:終端裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="427px" img-content="tif" inline="yes" orientation="portrait" width="943px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623145</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145928</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H02J3/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭劭維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, SHAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏力</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>混合變壓裝置及其控制方法</chinese-title>
        <english-title>HYBRID TRANSFORMER DEVICE AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種混合變壓裝置及其控制方法，混合變壓裝置包括：至少一電力電子模組，係包括:一並聯轉換器與一串聯轉換器，互相電性連接而構成一混合轉換器，並聯轉換器電性連接一配電變壓器之低電壓側；一控制器，係依據電子電力模組數量控制並聯轉換器與串聯轉換器之第一至第四切換開關、旁路電路以及補償變壓器之至少一者的訊號，且於當輸入電子電力模組的電壓改變的情況下，減少負載電壓的變化；一通訊裝置，係傳輸電壓電流資訊至控制器；一斷路器以及一旁路電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention discloses a hybrid distribution transformer device and its control method. The hybrid distribution transformer device includes: at least one power electronics module, which includes a parallel converter and a series converter, electrically connected to form a hybrid converter, with the parallel converter electrically connected to the low voltage side of the distribution transformer; a controller, which controls at least one of the signals for the first to fourth switching switches, bypass circuit, and compensation transformer in the parallel converter and the series converter based on the number of power electronics modules, and reduces the variation in load voltage when the input voltage of these power electronics modules changes; a communication device, which transmits voltage and current information to the controller; a circuit breaker; and a bypass circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:混合變壓裝置</p>
        <p type="p">23:並聯轉換器</p>
        <p type="p">26:串聯轉換器</p>
        <p type="p">25:直流電壓匯流排</p>
        <p type="p">Q1:第一切換開關</p>
        <p type="p">Q2:第二切換開關</p>
        <p type="p">Q3:第三切換開關</p>
        <p type="p">Q4:第四切換開關</p>
        <p type="p">L1,L2:電感</p>
        <p type="p">I&lt;sub&gt;L&lt;/sub&gt;:電流</p>
        <p type="p">V&lt;sub&gt;C&lt;/sub&gt;:電容電壓</p>
        <p type="p">Cac:電容</p>
        <p type="p">27:旁路與突波吸收電路</p>
        <p type="p">101:繼電器</p>
        <p type="p">SCR:矽控整流器</p>
        <p type="p">MOV:金屬氧化物變阻器</p>
        <p type="p">T:補償變壓器</p>
        <p type="p">T1:第一端點</p>
        <p type="p">T2:第二端點</p>
        <p type="p">10:配電變壓器</p>
        <p type="p">HV:高電壓側</p>
        <p type="p">LV:低電壓側</p>
        <p type="p">LV1:第一端點</p>
        <p type="p">N1:第二端點</p>
        <p type="p">LV2:第三端點</p>
        <p type="p">L3:第四端點</p>
        <p type="p">C',LV2',L3':電壓訊號</p>
        <p type="p">L':電流訊號</p>
        <p type="p">20:電力電子模組</p>
        <p type="p">21:斷路器</p>
        <p type="p">22:第一連接端子</p>
        <p type="p">23':運行訊號</p>
        <p type="p">24:電容器</p>
        <p type="p">28:控制器</p>
        <p type="p">30:負載</p>
        <p type="p">F:饋線</p>
        <p type="p">C':電壓訊號</p>
        <p type="p">D:溫度訊號</p>
        <p type="p">L':電流訊號</p>
        <p type="p">Q1':第一切換開關訊號</p>
        <p type="p">Q2':第二切換開關訊號</p>
        <p type="p">Q3':第三切換開關訊號</p>
        <p type="p">Q4':第四切換開關訊號</p>
        <p type="p">S1':旁路與突波吸收電路訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="747px" img-content="tif" inline="yes" orientation="portrait" width="1036px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623259</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145948</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250303B">H04N21/478</main-classification>
        <further-classification edition="201101120250303B">H04N21/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姊弟投資股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIBLINGS INVESTMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鈺軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU SYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁啟達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多媒體影音系統及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多媒體影音系統，包含：一資料庫，儲存複數個目標商品資料，該複數個目標商品資料包含一第一商品資料，該第一商品資料包含一第一商品影像資料；以及一伺服器，存取該資料庫，並通訊連接一影音伺服器，該伺服器自該影音伺服器接收一目標影音資料，該目標影音資料包含複數個目標幀影像資料，該複數個目標幀影像資料包含一第一幀影像資料，該第一幀影像資料關聯於一第一播放時間點；其中該伺服器將該第一幀影像資料與該第一商品影像資料進行比對，並基於該第一商品影像資料符合該第一幀影像資料的至少一部份，而產生一清單資料，該清單資料指示出該第一商品資料關聯於該第一幀影像資料及/或該第一播放時間點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多媒體影音系統</p>
        <p type="p">110:資料庫</p>
        <p type="p">120:伺服器</p>
        <p type="p">800:影音伺服器</p>
        <p type="p">900:影像播放裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="693px" img-content="tif" inline="yes" orientation="portrait" width="676px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621589</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145952</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A43D11/01</main-classification>
        <further-classification edition="200601120241231B">A43D25/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶成工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POU CHEN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文堡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEN PAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔鵬仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, PENG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許千昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>製鞋機的快拆安裝模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製鞋機的快拆安裝模組，包含一安裝單元、至少一夾固單元及一膠刷單元，該安裝單元包括一基部、一底部、一自該底部朝上延伸且連接該基部的卡設部，及一自該底部朝上延伸且連接該基部的側部，該基部、該底部、該卡設部及該側部共同界定一容置空間，該卡設部具有一連通該容置空間並朝上延伸且朝上開放的卡槽，該至少一夾固單元包括一設置於該基部的固定件，及一可擺動地樞設於該固定件的閂件，該膠刷單元包括一安裝件，及一設置於該安裝件的刷件，該安裝件具有一可受該至少一夾固單元夾固的本體部，及一用於嵌入該卡槽內的滑條部，以提升組裝的便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:安裝單元</p>
        <p type="p">21:基部</p>
        <p type="p">22:底部</p>
        <p type="p">23:卡設部</p>
        <p type="p">231:卡槽</p>
        <p type="p">24:側部</p>
        <p type="p">25:定位銷</p>
        <p type="p">26:彈簧銷</p>
        <p type="p">27:容置空間</p>
        <p type="p">3:夾固單元</p>
        <p type="p">31:固定件</p>
        <p type="p">32:彈性件</p>
        <p type="p">33:閂件</p>
        <p type="p">331:擺動部</p>
        <p type="p">332:擋部</p>
        <p type="p">333:斜面</p>
        <p type="p">4:膠刷單元</p>
        <p type="p">41:安裝件</p>
        <p type="p">411:本體部</p>
        <p type="p">412:滑條部</p>
        <p type="p">42:刷件</p>
        <p type="p">X:延伸方向</p>
        <p type="p">Y:水平方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="923px" img-content="tif" inline="yes" orientation="portrait" width="715px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622328</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145953</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250219B">E01C23/06</main-classification>
        <further-classification edition="200601120250219B">E02D29/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳國同</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUO-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫堂霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, TANG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭勝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, SHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳新典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫子硯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, TZU-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>圓形人孔蓋之啟閉暨路面微創工法</chinese-title>
        <english-title>OPENING AND CLOSING OF CIRCULAR MANHOLE COVER AND MINIMALLY INVASIVE ROAD CONSTRUCTION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種圓形人孔蓋之啟閉暨路面微創工法，包括：探測埋設在路面下的圓形人孔蓋，在路面標示出圓心與圓周的對應位置。在圓心的對應位置處將路面銑出第一孔洞直至露出圓形人孔蓋。經由第一孔洞取得路面至圓形人孔蓋的深度並檢視圓形人孔蓋的圓心處是否有孔洞。若是，則續行下一步驟，若否，對圓形人孔蓋銑出第二孔洞後再續行下一步驟。依據圓心與圓周進行路面切割至所述深度。吊起圓形人孔蓋與被切割的路面。復位圓形人孔蓋，植入橡膠孔塞至第二孔洞。將橡膠緩衝片置入路面被切割時產生的縫隙。以矽膠填補縫隙及橡膠孔塞至路面的段差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An opening and closing of circular manhole cover and minimally invasive road construction method is provided. Firstly, detecting the circular manhole cover under road, and providing marks of corresponding positions of a circle center and a circumference of the circular manhole cover on the road. Then milling the road at the position corresponding to the circle center to form a first hole exposing the circular manhole cover, obtaining a depth of the first hole, and checking whether there is a hole in the center of the circular manhole cover. Then cutting the road to the depth according to the positions of the circle center and the circumference. Then lifting up a cutting pavement and the circular manhole cover. Then replacing the circular manhole cover, inserting a plug into the second hole, placing a cushion into a gap, and sealing the gap and a step between the plug and the road.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:人孔空間</p>
        <p type="p">10A、10B:路面</p>
        <p type="p">11:第一孔洞</p>
        <p type="p">40:圓形人孔蓋</p>
        <p type="p">41:第二孔洞</p>
        <p type="p">50:活動吊桿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.png" file="d10026.TIF" giffile="ed10026.png" height="974px" img-content="tif" inline="yes" orientation="portrait" width="682px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622853</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145964</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250204B">G06Q30/06</main-classification>
        <further-classification edition="202301120250204B">G06Q30/0601</further-classification>
        <further-classification edition="201201120250204B">G06Q40/04</further-classification>
        <further-classification edition="201201120250204B">G06Q50/18</further-classification>
        <further-classification edition="202001120250204B">G16Y10/45</further-classification>
        <further-classification edition="202001120250204B">G16Y40/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, MENGRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方泓元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, HUNG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔呂文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNG, LU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳閔楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MIN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭文惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, WEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於區塊鏈之供應鏈交易協作方法及系統</chinese-title>
        <english-title>BLOCKCHAIN-BASED SUPPLY CHAIN TRANSACTION COLLABORATION METHOD AND SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於區塊鏈之供應鏈交易協作方法，包含：客戶端裝置上傳用以製造產品之第一元件物料清單至第一區塊鏈；以物料清單轉換模型將第一元件物料清單轉換為第二元件物料清單；客戶端裝置與製造端裝置及供料端裝置根據第二元件物料清單於第一區塊鏈簽訂產品之智能合約，智能合約包含訂單規則及訂單狀態；以及對應於供料端裝置之供料端依照第二元件物料清單及訂單規則將元件出貨至製造端，使對應於製造端裝置之製造端收取元件並以元件製造產品，其中供料端裝置及製造端裝置根據元件之動態於第一區塊鏈更新訂單狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A blockchain-based supply chain transaction collaboration method includes: uploading a first component bill of materials used to manufacture a product to a first blockchain by a client side device; converting the first component bill of materials to a second component bill of materials using a bill of materials conversion model; signing a smart contract for the product on the first blockchain based on the second component bill of materials by the client side device, a manufacturing side device and a supply side device, and the smart contract including an order rule and an order status; shipping the components by a supply side corresponding to the supply side device to a manufacturing side corresponding to the manufacturing side device in accordance with the second component bill of material and the order rules. The manufacturing side receives the components and manufactures the product with the components. The supply side device and the manufacturing side device update the order status in the first blockchain based on a dynamics of the components.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基於區塊鏈之供應鏈交易協作系統</p>
        <p type="p">110:區塊鏈主鏈</p>
        <p type="p">120:區塊鏈側鏈</p>
        <p type="p">130:客戶端裝置</p>
        <p type="p">140:製造端裝置</p>
        <p type="p">150:供料端裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="737px" img-content="tif" inline="yes" orientation="portrait" width="1007px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622423</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145968</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250224B">F24F3/14</main-classification>
        <further-classification edition="200601120250224B">F24F13/08</further-classification>
        <further-classification edition="200601120250224B">F24F13/20</further-classification>
        <further-classification edition="200601120250224B">F24F13/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣日立江森自控股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴央青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃盈毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江支佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李柏勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉忠宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>除濕裝置</chinese-title>
        <english-title>DEHUMIDIFYING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種除濕裝置，包含：殼體，其具有除濕進風口、散熱進風口、出風口；除濕組件，其包括蒸發器及凝縮器；風扇，其被設置在殼體內且鄰近出風口；控制器，其被設置於殼體內；主要風道，其被建構成使空氣依序從除濕進風口、經由蒸發器、凝縮器及風扇來朝向出風口流動；及旁通風道，其被建構成使空氣依序從散熱進風口、經由控制器及風扇來朝向出風口流動，其中殼體的內部設有散熱導流結構，以將旁通風道中流經控制器的空氣導引至凝縮器和風扇之間的空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:除濕進風口</p>
        <p type="p">11a:初級濾網</p>
        <p type="p">11b:HEPA濾網</p>
        <p type="p">12:散熱進風口</p>
        <p type="p">13:出風口</p>
        <p type="p">14:散熱導流結構</p>
        <p type="p">21:蒸發器</p>
        <p type="p">21a:熱管模組</p>
        <p type="p">21a1:熱管單元</p>
        <p type="p">21a2:熱管單元</p>
        <p type="p">22:凝縮器</p>
        <p type="p">30:風扇</p>
        <p type="p">40:控制器</p>
        <p type="p">41:散熱鰭片</p>
        <p type="p">50:集水槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="832px" img-content="tif" inline="yes" orientation="portrait" width="582px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621591</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145970</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A43D25/18</main-classification>
        <further-classification edition="200601120241231B">A43D25/06</further-classification>
        <further-classification edition="200601120241231B">B05C1/02</further-classification>
        <further-classification edition="200601120241231B">B05C9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶成工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POU CHEN CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許千昱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇信錩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, HSIN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊哲明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHE MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>塗膠裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種塗膠裝置，適用於將一黏膠塗抹至一具有一輪廓線的鞋面上。該塗膠裝置包含一基座單元，及一塗抹件。該基座單元包括一座體，及一設置於該座體的擋止件。該座體沿一第一軸向具有一外側面。該擋止件凸設於該座體的外側面並具有一遠離該座體的擋止面。該塗抹件設置於該座體並具有一沿該第一軸向鄰近該擋止面的塗抹面。藉由該擋止部抵靠著該輪廓線移動能穩定地將黏膠塗抹至該輪廓線內，以提升塗膠的品質以及鞋子的生產效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:塗膠裝置</p>
        <p type="p">10:支架單元</p>
        <p type="p">20:基座單元</p>
        <p type="p">1:座體</p>
        <p type="p">11:外側面</p>
        <p type="p">2:擋止件</p>
        <p type="p">4:塗抹件</p>
        <p type="p">42:塗抹體</p>
        <p type="p">421:塗抹面</p>
        <p type="p">5:供膠單元</p>
        <p type="p">51:供膠器</p>
        <p type="p">52:供膠管</p>
        <p type="p">200:驅動裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="938px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622369</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145973</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241223B">F04D29/28</main-classification>
        <further-classification edition="200601120241223B">F04D29/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林光華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUANG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯召漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, JAU-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊典逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TIEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅譯翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YI-XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具多環板葉片的離心風扇及其製作方法</chinese-title>
        <english-title>CENTRIFUGAL FAN WITH MULTIPLE RING-PLATE BLADES AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具多環板葉片的離心風扇，包括輪轂、第一環板葉片以及至少一第二環板葉片。第一環板葉片結合至輪轂。第二環板葉片疊置於第一環板葉片且與第一環板葉片之間保持距離以形成流道。第二環板葉片各是由多個弧形板體組成。另揭露具多環板葉片的離心風扇的製作方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A centrifugal fan with multiple ring-plate blades including a hub, a first ring-plate blade, and at least one second ring-plate blade is provided. The first ring-plate blade is assembled to the hub. The second ring-plate blade is stacked onto the first ring-plate blade and kept a distance from the first ring-plate blade, so as to form an air flowing channel. The second ring-plate blade is composed of a plurality of arc plates. A manufacturing of the centrifugal fan with multiple ring-plate blades is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:輪轂</p>
        <p type="p">111:本體</p>
        <p type="p">112:結合環</p>
        <p type="p">CX:旋轉軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="397px" img-content="tif" inline="yes" orientation="portrait" width="489px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621645</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145974</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A61B8/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡國諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, KUO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>超音波深度探測裝置</chinese-title>
        <english-title>ULTRASONIC DEPTH DETECTION DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種超音波深度探測裝置，包括一殼體、一聚焦式超音波探頭組件、一噴嘴及一供水管路。聚焦式超音波探頭組件設置於殼體內。噴嘴設置於殼體，且位於聚焦式超音波探頭組件的前側。供水管路穿設至殼體內，其中殼體、聚焦式超音波探頭組件與噴嘴之間圍繞出一空間，供水管路連通於空間，供水管路所輸送的水適於進入空間，連同聚焦式超音波探頭組件的聲波從噴嘴噴出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultrasonic depth detection device includes a housing, a focused ultrasonic probe assembly, a nozzle and a water supply pipeline. The focused ultrasonic probe assembly is disposed in the housing. The nozzle is disposed at the housing and located at the front side of the focused ultrasonic probe assembly. The water supply pipeline passes through the housing, and a space is surrounded by the housing, the focused ultrasonic probe assembly and the nozzle. The water supply pipeline is communicated with the space. Water transported by the water supply pipeline is adapted to enter the space, and is jetted out from the nozzle together with sound waves from the focused ultrasonic probe assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">θ:角度</p>
        <p type="p">D:口徑</p>
        <p type="p">Z:空間</p>
        <p type="p">100:超音波深度探測裝置</p>
        <p type="p">110:殼體</p>
        <p type="p">112:蓋體</p>
        <p type="p">115:聚焦式超音波探頭組件</p>
        <p type="p">120:超音波探頭</p>
        <p type="p">125:聚焦元件</p>
        <p type="p">126:聚焦內凹弧面</p>
        <p type="p">130:噴嘴</p>
        <p type="p">140:供水管路</p>
        <p type="p">150:引水套件</p>
        <p type="p">151:筒體</p>
        <p type="p">152:第一開口</p>
        <p type="p">153:第二開口</p>
        <p type="p">154:延伸部</p>
        <p type="p">155:凸環</p>
        <p type="p">160:密封環</p>
        <p type="p">170:訊號線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="722px" img-content="tif" inline="yes" orientation="portrait" width="682px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623143</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145975</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250203B">H02H9/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白景堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃翊翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>靜電放電保護電路</chinese-title>
        <english-title>ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種靜電放電保護電路，耦接於第一電壓端與第二電壓端之間，且包括第一及第二雙極性接面電晶體。第一及第二雙極性接面電晶體的第一端分別耦接第一電壓端及第二電壓端。第一及第二雙極性接面電晶體的第二端相互耦接。第一及第二雙極性接面電晶體的控制端相互耦接。第一雙極性接面電晶體的第一端與控制端之間的接面的崩潰電壓大於第一雙極性接面電晶體的第二端與控制端之間的接面的崩潰電壓。第二雙極性接面電晶體的第一端與控制端之間的接面的崩潰電壓大於第二雙極性接面電晶體的第二端與控制端之間的接面的崩潰電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrostatic discharge (ESD) protection circuit coupled between a first voltage terminal and a second voltage terminal is provided. The ESD protection circuit includes a first and a second bipolar junction transistors (BJTs). The first and second BJTs have their first terminals coupled to the first voltage terminal and the second voltage terminal, respectively. A second terminal of the second BJT is coupled to a second terminal of the first BJT. A control terminal of the first BJT is coupled to a control terminal of the second BJT. A breakdown voltage of a junction between the first terminal and the control terminal of the first BJT is greater than a breakdown voltage of a junction between the second terminal and the control terminal of the first BJT. A breakdown voltage of a junction between the first terminal and the control terminal of the first BJT is greater than a breakdown voltage of a junction between the second terminal and the control terminal of the first BJT.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100-1:靜電放電保護電路</p>
        <p type="p">210:第一阻抗電路</p>
        <p type="p">215、225:虛線箭頭</p>
        <p type="p">HBT1、HBT2:雙極性接面電晶體</p>
        <p type="p">HBN11、HBN12、HBN21、HBN22:雙極性接面電晶體的端</p>
        <p type="p">HBN1C、HBN2C:雙極性接面電晶體的控制端</p>
        <p type="p">VN1、VN2:電壓端</p>
        <p type="p">M1~M5:半導體材料</p>
        <p type="p">VDD:電壓輸入端</p>
        <p type="p">GND:參考電壓端</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.png" file="d10021.TIF" giffile="ed10021.png" height="614px" img-content="tif" inline="yes" orientation="portrait" width="626px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622372</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145976</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241223B">F04D29/32</main-classification>
        <further-classification edition="200601120241223B">F04D29/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林光華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUANG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉今</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>軸流散熱風扇</chinese-title>
        <english-title>AXIAL COOLING FAN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種軸流散熱風扇，包括輪轂與多個錐形葉片。輪轂具有旋轉軸。錐形葉片環繞地設置於輪轂上並受輪轂驅動。錐形葉片彼此層置且同軸於旋轉軸，以形成入風口與出風口，且各錐形葉片的輪廓是從入風口朝向出風口呈漸擴。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An axial cooling fan including a hub having a rotating axis and a plurality of cone blades is provided. The cone blades disposed around the hub and driven by the hub are stacked on top of each other and coaxial with the rotating axis so as to form an inlet and an outlet of an airflow. A contour of each cone blades is expanding from the inlet toward the outlet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:軸流散熱風扇</p>
        <p type="p">110:輪轂</p>
        <p type="p">120:錐形葉片</p>
        <p type="p">130:殼體</p>
        <p type="p">CX:旋轉軸</p>
        <p type="p">FL1:入風口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="674px" img-content="tif" inline="yes" orientation="portrait" width="911px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623263</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145977</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">H04N23/60</main-classification>
        <further-classification edition="202301120250303B">H04N23/70</further-classification>
        <further-classification edition="202301120250303B">H04N23/61</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭珍如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHEN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石維國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, WEI-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>動態曝光方法及電子裝置</chinese-title>
        <english-title>DYNAMIC EXPOSURE METHOD AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種動態曝光方法及電子裝置。動態曝光方法適於包括一影像感測器的一電子裝置，所述方法包括以下步驟。透過影像感測器擷取一原始影像。響應於原始影像包括一人臉區域，根據原始影像中的人臉區域決定第一色彩校正矩陣。利用第一色彩校正矩陣調整原始影像，以產生一色調修正影像。響應於所述原始影像包括一人臉區域，根據第一亮度調整策略對色調修正影像進行一亮度適應調整，以產生一預處理影像。根據預處理影像進行一人臉自動曝光程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides an image processing method and an electronic device. The dynamic exposure method is adapted to an electronic device including an image sensor, and the method includes the following steps. A raw image is captured through the image sensor. In response to the raw image including a face area, the first color correction matrix is ​​determined according to the face area in the raw image. The raw image is adjusted using the first color correction matrix to generate a tone-corrected image. In response to the raw image including a face region, a luma adaptation adjustment is performed on the tone-corrected image according to a first brightness adjustment strategy to generate a preprocessed image. A face automatic exposure program is performed based on the preprocessed image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S280:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="848px" img-content="tif" inline="yes" orientation="portrait" width="810px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622293</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145978</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120241217B">C25B11/031</main-classification>
        <further-classification edition="202101120241217B">C25B11/052</further-classification>
        <further-classification edition="202101120241217B">C25B11/061</further-classification>
        <further-classification edition="202101120241217B">C25B11/089</further-classification>
        <further-classification edition="202101120241217B">C25B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宜穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉莉筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, LI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童永樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, YUNG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>觸媒電極與其形成方法與電解裝置</chinese-title>
        <english-title>CATALYTIC ELECTRODE AND METHOD OF FORMING THE SAME AND ELECTROLYSIS DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">觸媒電極，包括鎳基多孔基材；鎳與其他金屬的多個觸媒合金球，摻雜多種元素，其他金屬包括鐵，元素包括C、F、與S，且觸媒合金球散佈於鎳基多孔基材的表面上；以及多個磷化金屬顆粒，披覆鎳基多孔基材與觸媒合金球，且磷化金屬顆粒包括磷化鎳、磷化鎳鐵、磷化鎳鈷、磷化鎳銅、或磷化鎳鋅。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A catalytic electrode includes a nickel-based porous substrate, and a plurality of catalytic alloy balls of nickel and another metal doped with elements, in which the another metal includes iron, the elements includes C, F, and S, and the catalytic alloy balls are dispersed on the surface of the nickel-based porous substrate. The catalytic electrode also includes a plurality of metal phosphide particles covering the nickel-based porous substrate and the catalytic alloy balls, and the metal phosphide particles includes nickel phosphide, nickel iron phosphide, nickel cobalt phosphide, nickel copper phosphide, or nickel zinc phosphide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622998</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145982</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250922B">G16Y20/40</main-classification>
        <further-classification edition="202001120250922B">G16Y40/20</further-classification>
        <further-classification edition="202001120250922B">G16Y10/45</further-classification>
        <further-classification edition="201201120250922B">G06Q20/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉吉原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, CHI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信騫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIN-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顧客行為追蹤方法、顧客行為追蹤系統及行為分析單元</chinese-title>
        <english-title>CUSTOMER BEHAVIOR TRACKING METHOD, CUSTOMER BEHAVIOR TRACKING SYSTEM AND BEHAVIOR ANALYZING UNIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顧客行為追蹤方法、顧客行為追蹤系統及行為分析單元。顧客行為追蹤方法包括以下步驟。透過連接數個影像擷取單元之一多目標追蹤元件，綁定進入一識別區之一關鍵使用者。透過至少一人工智慧物聯網元件，識別關鍵使用者對單一商品之至少一關鍵動作，關鍵動作包括一拿取動作。依據關鍵動作，截錄一關鍵影片片段。拿取動作之時間點為關鍵影片片段之起點。依據關鍵影片片段，以一視覺語言模型識別出單一商品之一商品品項。依據單一商品之商品品項，識別關鍵使用者對單一商品之一結帳行為或一選購行為。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A customer behavior tracking method, a customer behavior tracking system and a behavior analyzing unit are provided. The customer behavior tracking method includes the following steps. A key user who enters an identification area is bound by a multi-target tracking component connected to a plurality of image capture units. At least one key action of the key user for a single product is recognized by at least one artificial intelligence of things (AIoT) element. The key action includes a taking action. A key video segment is cropped according to the key action. The taking action is the starting point of the key video segment. A vision language model is used to recognize a product item of the single product. Based on the product item of the single product, a checkout behavior or a purchase behavior of the key user for the single product is recognized.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140,S150,S160,S170:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="804px" img-content="tif" inline="yes" orientation="portrait" width="644px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622574</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145984</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250307B">G02B9/04</main-classification>
        <further-classification edition="202101120250307B">G02B7/00</further-classification>
        <further-classification edition="202101120250307B">G02B7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WENSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳淋華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LINHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅維威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, WEIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116866277</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學成像鏡頭</chinese-title>
        <english-title>OPTICAL IMAGING LENS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光學成像鏡頭，從一物側至一像側沿一光軸依序包括一第一透鏡組以及一第二透鏡組，一鏡筒具有一靠近物側的一前端部與一靠近像側的一後端部，且後端部具有一朝向像側的一黏貼面，第一透鏡組設置並固定在鏡筒中，第二透鏡組具有一組裝部，經由一膠體固定於鏡筒的黏貼面，其中光學成像鏡頭滿足以下條件:0.95≦ODG2/ODB≦1.05，以及18≦ODG2/Wba≦58，其中ODG2為第二透鏡組的最大外徑，ODB為鏡筒的最大外徑，Wba為後端部的黏貼面在徑向上的最大寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides an optical imaging lens, which sequentially comprises a first lens group and a second lens group along an optical axis from an object side to an image side. A barrel has a front end close to the object side and a rear end close to the image side, and the rear end has an adhesive surface facing the image side. The first lens group is arranged and fixed in the barrel, and the second lens group has an mounting portion fixed on the adhesive surface of the barrel through a glue. The optical imaging lens satisfies the following conditions: 0.95≦ODG2/ODB≦1.05, and 18≦ODG2/Wba≦58, wherein ODG2 is the maximum outer diameter of the second lens group, ODB is the maximum outer diameter of the barrel, and Wba is the maximum width of the adhesive surface at the rear end in the radial direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:光學成像鏡頭</p>
        <p type="p">10:鏡筒</p>
        <p type="p">11:前端部</p>
        <p type="p">12:後端部</p>
        <p type="p">13:黏貼面</p>
        <p type="p">14:物側面</p>
        <p type="p">15:像側面</p>
        <p type="p">A1:物側</p>
        <p type="p">A2:像側</p>
        <p type="p">G1:第一透鏡組</p>
        <p type="p">G2:第二透鏡組</p>
        <p type="p">I:光軸</p>
        <p type="p">IDa:黏貼面的最小內徑</p>
        <p type="p">L1:第一透鏡</p>
        <p type="p">L2:第二透鏡</p>
        <p type="p">L3:第三透鏡</p>
        <p type="p">L4:第四透鏡</p>
        <p type="p">L5:第五透鏡</p>
        <p type="p">L6:第六透鏡</p>
        <p type="p">L7:第七透鏡</p>
        <p type="p">ODG1:第一透鏡組的最大外徑</p>
        <p type="p">ODG2:第二透鏡組的最大外徑</p>
        <p type="p">P1:光學有效部</p>
        <p type="p">P2:組裝部</p>
        <p type="p">R:固定環</p>
        <p type="p">TG1:第一透鏡組在光軸上的厚度</p>
        <p type="p">TG2:第二透鏡組在光軸上的厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="808px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
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          <doc-number>202622370</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145994</doc-number>
          <kind></kind>
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        <main-classification edition="200601120241223B">F04D29/28</main-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宗廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TSUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖茂能</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, MAO-NENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錚玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林光華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUANG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉今</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>離心式散熱風扇</chinese-title>
        <english-title>CENTRIFUGAL HEAT DISSIPATION FAN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種離心式散熱風扇，包括殼體與葉輪。殼體具有位在軸向上的至少一入風口與位在徑向上的至少一出風口。葉輪包括輪轂與環設於輪轂的多個葉片。各葉片從輪轂延伸出。輪轂沿軸向可旋轉地設置於殼體內。輪轂帶動葉片在殼體內旋轉而產生氣流。氣流從入風口流入殼體且從出風口流出殼體。葉片具有至少兩種長度，以在殼體內產生壓力差變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one air inlet on an axial direction and at least one air outlet on a radial direction. The impeller has a hub and a plurality of blades surrounding the hub. The hub drives the blades to rotate in the housing to generate an airflow flowing into the housing via the air inlet and out of the housing via the air outlet. The blades are respectively extended 本案from the hub and has have at least two lengths, such that a variation of pressure change of the airflow is generated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:離心式散熱風扇</p>
        <p type="p">110:殼體</p>
        <p type="p">111:入風口</p>
        <p type="p">113:出風口</p>
        <p type="p">120:輪轂</p>
        <p type="p">130:葉片</p>
        <p type="p">C1:旋轉軸</p>
        <p type="p">C2:中心軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="667px" img-content="tif" inline="yes" orientation="portrait" width="674px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621808</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145995</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120241218B">B09B3/35</main-classification>
        <further-classification edition="202201320241218B">B09B101/15</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連翔綠能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACON GREENERGY TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬正展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, CHENG-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉于豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>廢太陽能模組的處理方法及其處理設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種廢太陽能模組的處理方法及其處理設備。該廢太陽能模組的處理方法包含：破碎步驟：使一廢太陽能模組的一基底單元上的一玻璃層破碎形成碎玻璃；及掉落步驟：利用重力使該基底單元透過以該基底單元的一第一端部低於一第二端部的方式掉落，以使碎玻璃在重力作用下脫離該基底單元。由於碎玻璃在脫離該基底單元的過程中無需使用人力，因此本發明可降低碎玻璃危害工人健康的風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">M1:廢棄太陽能模組的處理方法</p>
        <p type="p">ST11:輸入步驟</p>
        <p type="p">ST12:破碎步驟</p>
        <p type="p">ST13:輸送步驟</p>
        <p type="p">ST14:掉落步驟</p>
        <p type="p">ST141:垂降步驟</p>
        <p type="p">ST142:掉下步驟</p>
        <p type="p">ST15:拉升步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="984px" img-content="tif" inline="yes" orientation="portrait" width="690px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622415</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145996</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250220B">F21V33/00</main-classification>
        <further-classification edition="200601120250220B">A61C19/00</further-classification>
        <further-classification edition="201801120250220B">F21V9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃致軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡博期</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, PO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林治中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃怡文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, I-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依樵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, I-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>複合式光源模組</chinese-title>
        <english-title>COMPOSITE LIGHT SOURCE MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合式光源模組，適於連接於一牙檢測主機，包括一殼體、多個光源組件、多個濾光片、一轉動機構以及一連接組件。殼體包括一穿孔。這些光源組件傾斜地設置於殼體內，且位於穿孔的外側，這些光源組件具有不同的波長。這些濾光片可調整地設置於殼體內，這些濾光片所過濾的光波長不同。轉動機構設置於殼體內且連接於這些濾光片，以可選擇地使這些濾光片的其中一者遮蔽穿孔。連接組件外露於殼體的外表面，電性連接於這些光源組件與轉動機構，且適於結構地與電性地連接至牙檢測主機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite light source module is adapted to connect to a teeth inspection host device. The composite light source module includes a casing, multiple light source assemblies, multiple light filters, a rotating mechanism and a connecting assembly. The casing includes a through hole. The multiple light source assemblies are obliquely disposed inside the casing and located at outside of the through hole. The multiple light source assemblies have different wavelengths. The multiple light filters are adjustably disposed inside the casing. The multiple light filters filter light at different wavelengths. The rotating mechanism is disposed inside the casing and connected to the multiple light filters, so that one of the multiple light filters selectively covers the through hole. The connecting assembly is exposed to an external surface of the casing, electrically connected to the multiple light source assemblies and the rotating mechanism, and adapted to be structurally and electrically connected to the teeth inspection host device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:複合式光源模組</p>
        <p type="p">110:殼體</p>
        <p type="p">123:第一光源</p>
        <p type="p">125:第二光源</p>
        <p type="p">127:第三光源</p>
        <p type="p">131:第一濾光片</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="796px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621968</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145997</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B65G47/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>惠特科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FITTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張書淯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHU YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林峻成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JYUN CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱添煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CASPER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>能抑制物料翹曲之輸送裝置</chinese-title>
        <english-title>MATERIAL WARPING PREVENTION CONVEYOR SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種能抑制物料翹曲之輸送裝置，其包括：一輸送單元及至少一防翹曲組件。該輸送單元包含有一運輸區域，該運輸區域供至少一物料置放運輸；該至少一防翹曲組件鄰設於該輸送單元，該至少一防翹曲組件包含有一吹氣噴頭，該吹氣噴頭之至少一氣口係高於該運輸區域且朝向該運輸區域，由該至少一氣口噴出的氣流會對該至少一物料產生壓力以抑制該至少一物料翹曲，使得該至少一物料可以在運輸過程中保持平整，以確保後續各種作業順暢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a material warping prevention conveyor system, which includes: a conveying unit and at least one anti-warping component. The conveying unit includes a transportation area for at least one material to be placed and transported. The at least one anti-warp component is located adjacent to the conveying unit. The at least one anti-warp component includes a blowing nozzle, and at least one air outlet of the blowing nozzle is higher than the transportation area and faces the transportation area. The air flow ejected from the at least one air port will generate pressure on the at least one material to inhibit the at least one material from warping, so that the at least one material can remain flat during transportation to ensure smooth subsequent operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輸送單元</p>
        <p type="p">11:運輸區域</p>
        <p type="p">14:傳輸方向</p>
        <p type="p">2:防翹曲組件</p>
        <p type="p">21:吹氣噴頭</p>
        <p type="p">211:氣口</p>
        <p type="p">22:座體</p>
        <p type="p">53:可透光承台</p>
        <p type="p">61:滾輪</p>
        <p type="p">7:物料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="592px" img-content="tif" inline="yes" orientation="portrait" width="1009px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621966</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145998</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B65G15/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>惠特科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FITTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張書淯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SHU YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林峻成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JYUN CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱添煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CASPER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>輸送設備</chinese-title>
        <english-title>CONVEYING EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種輸送設備，其包括：一輸送組件及一移載組件。該輸送組件包含有二可沿一Y軸相對移動之輸送座，該二輸送座共同界定出一供傳輸一物料之輸送流道，各該輸送座沿一X軸延伸；該移載組件供將該物料沿一Z軸放置於該輸送流道，該移載組件包含有一基座與複數供移動該物料之移載臂，複數該移載臂可選擇性地相對該基座沿該X軸、該Y軸移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a conveying equipment, which includes: a conveying component and a transfer component. The conveyor assembly includes two conveyor seats that can move relatively along a Y-axis. The two conveyor seats jointly define a conveyor flow channel for conveying a material. Each conveyor seat extends along an X-axis. The transfer component is used to place the material on the conveying channel along a Z-axis. The transfer component includes a base and a plurality of transfer arms for moving the material. A plurality of the transfer arms can selectively move relative to the base along the X-axis and the Y-axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輸送組件</p>
        <p type="p">5:移載組件</p>
        <p type="p">51:基座</p>
        <p type="p">57:主架體</p>
        <p type="p">58:第一滑軌</p>
        <p type="p">59:第二滑軌</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="728px" img-content="tif" inline="yes" orientation="portrait" width="998px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622412</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113145999</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241226B">F16L37/22</main-classification>
        <further-classification edition="200601120241226B">F16L37/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翊懋有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOSSOMOOR TRADING CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白竹涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, CHU HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>快速接頭</chinese-title>
        <english-title>QUICK CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種快速接頭，包括：一主體、一閥組件與一鎖定機構。該主體定義有一軸向、一徑向與一周向，該主體包含有相連接之一第一構件與一第二構件，該第一構件與該第二構件共同界定出一內部空間，該第一構件貫設有複數沿該徑向延伸之貫孔，該第一構件供一插件沿該軸向插入該內部空間；該閥組件容設於該主體供該插件推抵而開啟；該鎖定機構包含有一滑套、至少一第一限位單元、至少一第二限位單元、複數定位珠與一彈性件，該滑套係可沿該軸向與該周向移動地套設於該主體以切換於一鎖定位置與一釋放位置，該至少一第一限位單元與該至少一第二限位單元其中一者設於該滑套、另一者設於該主體，該至少一第一限位單元包含有相連通之一第一滑槽與一第二滑槽，該第一滑槽沿該周向延伸，該第二滑槽沿該軸向延伸，該第二滑槽於該軸向上係凸伸於該第一滑槽，該至少一第二限位單元可相對移動地插接於該至少一第一限位單元，該複數定位珠可活動地限位於該複數貫孔，該彈性件彈抵於該主體與該滑套之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a quick connector, which includes: a main body, a valve assembly and a locking mechanism. The main body defines an axial direction, a radial direction and a circumferential direction, and the main body includes a connected first component and a second component. The first component and the second component jointly define an internal space. The first component is provided with a plurality of through holes extending along the radial direction. The first component allows a plug-in to be inserted into the internal space along the axial direction. The valve assembly is accommodated in the main body and is opened by being pushed by the plug-in. The locking mechanism includes a sliding sleeve, at least a first limiting unit, at least a second limiting unit, a plurality of positioning beads and an elastic member. The sliding sleeve is movably sleeved on the main body along the axial direction and the circumferential direction to switch between a locking position and a release position. One of the at least one first limiting unit and the at least one second limiting unit One is set on the sliding sleeve and the other is set on the main body. The at least one first limiting unit includes a first slide groove and a second slide groove that communicate with each other. The first slide groove extends along the circumferential direction, the second slide groove extends along the axial direction, and the second slide groove extends along the axial direction. The chute protrudes from the first chute in the axial direction. The at least one second limiting unit is relatively movably plugged into the at least one first limiting unit. The plurality of positioning beads are movably limited to the plurality of through holes, and the elastic member elastically abuts between the main body and the sliding sleeve.</p>
      </isu-abst>
      <representative-img>
        <p type="p">31:滑套</p>
        <p type="p">4:第一限位單元</p>
        <p type="p">41:第一滑槽</p>
        <p type="p">42:第二滑槽</p>
        <p type="p">43:齒部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="536px" img-content="tif" inline="yes" orientation="portrait" width="537px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621579</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146002</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120250501B">A23L19/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>統一企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭冠玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏霈妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊清華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉爾順</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>供烹調用之綠色蔬菜的製備方法、含該綠色蔬菜之烘焙食品的製備方法及其產物</chinese-title>
        <english-title>METHOD FOR PREPARING GREEN VEGETABLES FOR COOKING, METHOD FOR PRODUCING BAKERY PRODUCT CONTAINING THE GREEN VEGETABLES AND BAKERY PRODUCT PRODUCED BY THE METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種供烹調用之綠色蔬菜的製備方法，包括以下步驟：解凍經冷凍之綠色蔬菜；混合大於或等於80重量份之該經解凍之綠色蔬菜與大於或等於0.8重量份之碳酸氫鈉，以製備第一混合物；混合所述第一混合物與油品原料，以製備第二混合物；以及加熱所述第二混合物。本發明所提供的供烹調用之綠色蔬菜的製備方法令冷凍之綠色蔬菜經加熱烹調後，能呈現良好的顏色及風味。此外，本發明還提供一種含該綠色蔬菜之烘焙食品的製備方法及其產物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S40:步驟</p>
        <p type="p">S11、S12、S41:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="725px" img-content="tif" inline="yes" orientation="portrait" width="468px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623181</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146018</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241218B">H02P27/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>偉詮電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WELTREND SEMICONDUCTOR INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許得衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, TE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冼達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEN, TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪見宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIEN-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>主動式馬達預警方法及主動式馬達預警系統</chinese-title>
        <english-title>ACTIVE MOTOR WARNING METHOD AND ACTIVE MOTOR WARNING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">主動式馬達預警方法包含利用馬達驅動模組驅動馬達；利用環境感測器檢測至少一個環境狀態，並將至少一個環境狀態傳送至馬達驅動模組；馬達驅動模組產生包含第一訊息與第二訊息之脈衝寬度調變訊號；及將脈衝寬度調變訊號主動透過馬達轉速訊號器輸出腳位，傳送至主機。脈衝寬度調變訊號的第一訊息包含馬達的轉速。脈衝寬度調變訊號的第二訊息包含馬達的至少一個運轉狀態及/或至少一個環境狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An active motor warning method includes using a motor drive module for driving a motor, using an environment sensing module for detecting at least one environmental state and transmitting the at least one environmental state to the motor drive module, generating a pulse width modulation signal including a first message and a second message by the motor drive module, and actively transmitting the pulse width modulation signal to a host through a frequency generator output pin. The first message of the pulse width modulation signal includes a rotation speed of the motor. The second message of the pulse width modulation signal includes at least one operating state and/or the at least one environmental state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:主動式馬達預警系統</p>
        <p type="p">10:馬達</p>
        <p type="p">11:環境感測器</p>
        <p type="p">12:馬達驅動模組</p>
        <p type="p">13:主機</p>
        <p type="p">S&lt;sub&gt;VCC&lt;/sub&gt;:驅動電壓</p>
        <p type="p">S&lt;sub&gt;SPD&lt;/sub&gt;:轉速控制訊號</p>
        <p type="p">S&lt;sub&gt;FG&lt;/sub&gt;:馬達轉速訊號</p>
        <p type="p">S&lt;sub&gt;GND&lt;/sub&gt;:接地電壓</p>
        <p type="p">S&lt;sub&gt;CTL&lt;/sub&gt;:電機三相U、V、W驅動訊號</p>
        <p type="p">S&lt;sub&gt;FB1&lt;/sub&gt;:第一回授訊號</p>
        <p type="p">S&lt;sub&gt;FB2&lt;/sub&gt;:第二回授訊號</p>
        <p type="p">P&lt;sub&gt;VCC&lt;/sub&gt;:驅動電壓腳位</p>
        <p type="p">P&lt;sub&gt;SPD&lt;/sub&gt;:轉速控制腳位</p>
        <p type="p">P&lt;sub&gt;FG&lt;/sub&gt;:馬達轉速訊號器輸出腳位</p>
        <p type="p">P&lt;sub&gt;GND&lt;/sub&gt;:接地腳位</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="649px" img-content="tif" inline="yes" orientation="portrait" width="814px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621721</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146020</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241212B">A61K38/18</main-classification>
        <further-classification edition="200601120241212B">A61P13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>思必瑞特生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPIRIT SCIENTIFIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林道隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DAO LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林道隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DAO LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敬和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種改善女性泌尿生殖道症候群的製劑及其用途</chinese-title>
        <english-title>A PREPARATION FOR IMPROVING FEMALE GENITOURINARY SYNDROME AND THE USE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種改善女性泌尿生殖道症候群的製劑及其用途，該製劑包含一有效劑量的血小板衍生生長因子，其中，該血小板衍生生長因子為血小板衍生生長因子-BB，且該製劑係一非經腸胃道製劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A preparation for improving female genitourinary syndrome and the use thereof are provided, the preparation including an effective amount of platelet-derived growth factor (PDGF), wherein the PDGF is platelet-derived growth factor-BB (PDGF-BB), and the preparation is a parenteral preparation.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="563px" img-content="tif" inline="yes" orientation="portrait" width="810px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622654</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146023</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G05B19/02</main-classification>
        <further-classification edition="201201120250303B">G06Q50/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝青樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHING HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡銘芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張燦勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CAN XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李易陵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種回饋調整參數成形方法</chinese-title>
        <english-title>FEEDBACK PARAMETER ADJUSTMENT FORMING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種回饋調整參數成形方法，適用於鍛造或沖壓設備，包括：輸入胚料的預期成形結果；透過光學檢測單元量測胚料的第一特徵；透過成形參數決策模型，並導入優化方程式進行模態分析，以估算出第一最適成形參數調整成形機的加工參數後，根據加工參數對胚料進行加工程序，以加工成形為半成品；於進行加工程序後，量測半成品的第二特徵，當至少一第二特徵不符合預期成形結果時，透過成形參數決策模型以及優化方程式進行模態分析，以估算出第二最適成形參數；根據第二最適成形參數修正調整加工參數，以重複進行加工程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A feedback parameter adjustment forming method, suitable for forging or stamping equipment, includes inputting the expected forming result of the billet. The first feature of the billet is measured using an optical detection unit. A forming parameter decision model, combined with an optimization equation for modal analysis, is used to estimate the first optimal forming parameters. After adjusting the processing parameters of the forming machine based on these optimal parameters, the billet undergoes a processing procedure to be formed into a semi-finished product. After processing, the second feature of the semi-finished product is measured. If at least one second feature does not meet the expected forming result, the forming parameter decision model and optimization equation are used again for modal analysis to estimate the second optimal forming parameters. The processing parameters are then adjusted according to the second optimal forming parameters, and the processing procedure is repeated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S180:步驟流程</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="738px" img-content="tif" inline="yes" orientation="portrait" width="736px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622016</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146024</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C04B26/12</main-classification>
        <further-classification edition="200601120241220B">C04B24/26</further-classification>
        <further-classification edition="200601120241220B">C04B14/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIN HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸致瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳信廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SIN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴建利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIEN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>水溶性芯材組成物、水溶性芯材及其製作方法</chinese-title>
        <english-title>WATER-SOLUBLE CORE MATERIAL COMPOSITION, WATER-SOLUBLE CORE MATERIAL AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水溶性芯材組成物，包含：一基砂；一水溶樹脂；及一黏著劑；其中，該基砂為80至90重量份，該水溶樹脂為5至10重量份，該黏著劑為5至10重量份，其中，該水溶樹脂包含極性非離子基團。本發明另揭示一種水溶性芯材及其製作方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A water-soluble core material composition includes a sand, a water-soluble resin and an adhesive wherein the sand is 80 to 90 wt%, the water-soluble resin is 5 to 10 wt% and the adhesive is 5 to 10 wt%, wherein the water-soluble resin contains polar nonionic groups. The invention also discloses a water-soluble core material and manufacturing method thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S130,S150:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="566px" img-content="tif" inline="yes" orientation="portrait" width="749px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623078</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146025</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201001120241210B">H01M10/054</main-classification>
        <further-classification edition="201001120241210B">H01M4/139</further-classification>
        <further-classification edition="200601120241210B">H01M4/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許家語</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>鋁電池之電極材料及其製造方法</chinese-title>
        <english-title>ELECTRODE MATERIALS OF ALUMINUM BATTERIESAND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鋁電池之電極材料的製造方法，包含以下步驟：提供一鋁基石墨烯鑄錠，其包含一鋁基材料及一石墨烯；透過一第一成型製程，將該鋁基石墨烯鑄錠製成一第一基材，並使該石墨烯均勻分散於該鋁基材料中；將該第一基材進行一等通道轉角擠型製程而獲得一第二基材；透過一第二成型製程，使該第二基材中的石墨烯的分佈沿該第二基材的一延展方向有序排列且橫跨該第二基材的晶界，以製成一第三基材；及當該第二成型製程為採用一壓延製程時，透過一輾壓製程，以使該第三基材的表面形成數個孔。本發明還提供一種鋁電池之電極材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method for electrode materials of aluminum batteries comprising the steps of: providing an aluminum-based graphene ingot, which includes an aluminum-based material and a graphene. The aluminum-based graphene ingot is made into a first base material through a first molding process and the graphene is evenly dispersed in the aluminum-based material. An equal channel angular extrusion process on the first base material to obtain a second base material. The graphene in the second base material is distributed in an orderly manner along an extension direction of the second base material and across the grain boundaries of the second base material to form a third base material through a second molding process. When the second molding process adopts a calendering process, a rolling process is used to form several holes on the surface of the third base material. The invention also provides an electrode materials of aluminum batteries.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S130,S150,S170,S190:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="1034px" img-content="tif" inline="yes" orientation="portrait" width="780px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622480</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146027</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01N21/01</main-classification>
        <further-classification edition="200601120250512B">G02B27/44</further-classification>
        <further-classification edition="200601120250512B">G01D5/353</further-classification>
        <further-classification edition="202101120250512B">G01K11/3206</further-classification>
        <further-classification edition="200601120250512B">C23C14/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳子鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TZU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳文傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, WEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JYUN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>氫氣感測裝置及其製造方法</chinese-title>
        <english-title>HYDROGEN SENSING DEVICE AND ITS MANUFACTURING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種氫氣感測裝置及其製造方法，其結構包含：輸出端；光纖：其係包含：具有第一布拉格光柵以及均勻環狀氫氣敏感薄膜之第一感測部；具有保護層之第一隔絕部以及；具有第二布拉格光柵之第二感測部；以及一接收端，其中，該第一中心波長以及該第二中心波長皆位於該波長範圍內，透過讓輸出端輸出光訊號讓其通過第一感測部以及第二感測部以產生影響資訊，進而透過接收端讀取影響資訊來判斷氫氣濃度以及溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a hydrogen sensing device and its manufacturing method, the structure of which comprises: an output terminal; an optical fiber comprising: a first sensing portion having a first Bragg grating and a uniformly annular hydrogen-sensitive material film; a first insulating portion having a protective layer; a second sensing portion having a second Bragg grating; and a receiving end, wherein the first center wavelength and the second center wavelength are located within the wavelength range of the first and second center wavelengths, and the receiving end reads the influence information to determine the hydrogen concentration and temperature. The first center wavelength and the second center wavelength are located within the wavelength range, and the first and second sensing portions are allowed to pass through the first and second sensing portions of the first center wavelengths to generate impact information, which is then read by the receiving end to determine the concentration of hydrogen and the temperature, and the second sensing portion of the second center wavelength.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氫氣感測裝置</p>
        <p type="p">10:輸出端</p>
        <p type="p">20:光纖</p>
        <p type="p">22:第一感測部</p>
        <p type="p">222:第一布拉格光柵</p>
        <p type="p">224:氫氣敏感薄膜</p>
        <p type="p">24:第一隔絕部</p>
        <p type="p">242:保護層</p>
        <p type="p">26:第二感測部</p>
        <p type="p">262:第二布拉格光柵</p>
        <p type="p">30:接收端</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="714px" img-content="tif" inline="yes" orientation="portrait" width="932px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622440</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146029</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">F28D15/02</main-classification>
        <further-classification edition="200601120250108B">F28F1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>營邦企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃郁祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>低沸點散熱器</chinese-title>
        <english-title>LOW BOILING-POINT COOLING MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係一種低沸點散熱器，包括蒸發器、冷凝鰭片組及導熱管，蒸發器具有腔室，冷凝鰭片組相對蒸發器配置，冷凝鰭片組具有匯流腔及分流腔，導熱管沿縱向連接在蒸發器及冷凝鰭片組之間，導熱管具有不直接相互連通的蒸發通道及回吸通道，蒸發通道與回吸通道的截面均為非圓形，蒸發通道沿縱向連通腔室及分流腔，回吸通道沿縱向連通匯流腔及腔室；藉此，能夠使工作液體產生循環迴路而不會於蒸發冷凝時相互干擾，並且有效增加工作液體通過導熱管的流量及流速，從而提升低沸點散熱器的散熱效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A low boiling-point cooling module having an evaporator, a condensing fin group, and a heat pipe is provided. The evaporator has a chamber. The condensing fin group is configured to be opposite to the evaporator and has a convergence chamber and a shunt chamber. The heat pipe is connected between the evaporator and the condensing fin group along a longitudinal direction and has an evaporation channel and a suction channel not connected to each other. A cross section of the evaporation channel and a cross section of the suction channel are non-circle. The evaporation channel is communicated to the chamber and the shunt chamber along the longitudinal direction. The suction channel is communicated to the convergence chamber and the chamber along the longitudinal direction. A working fluid may generate a circulation loop without interfering with each other during evaporation and condensation and effectively increase a flow and a flow rate when passing through the heat pipe to enhance a heat dissipation efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:蒸發器</p>
        <p type="p">101:腔室</p>
        <p type="p">20:冷凝鰭片組</p>
        <p type="p">201:匯流腔</p>
        <p type="p">202:分流腔</p>
        <p type="p">30:導熱管</p>
        <p type="p">D:縱向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="726px" img-content="tif" inline="yes" orientation="portrait" width="1044px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622373</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146030</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">F04D29/38</main-classification>
        <further-classification edition="200601120250108B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商溙奕（江西）電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWER LOGIC (JIANGXI TAI YI) CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文昉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEN FAUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許嘉恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝榮忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, JUNG CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>環形扇葉結構</chinese-title>
        <english-title>ANNULAR FAN BLADE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種環形扇葉結構，包括：一扇葉。該扇葉具有一輪轂及複數個從該輪轂徑向朝外延伸出的葉片。其中，該些葉片上各具有一驅風面、一背風面、一凸緣部、一凹緣部及一側緣部；每一個該葉片的該凸緣部至該凹緣部的斷面呈一傾斜狀，每一個該葉片的該側緣部以疊接於相鄰的該葉片的該驅風面上，以圍成一個傾斜狀的多邊花型的環牆。在扇葉安裝於扇框上旋轉時，該些葉片除了能夠產生一個大的風量輸出外，同時傾斜狀的多邊花型的環牆也能夠降低旋轉時所產生的噪音。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An annular fan blade structure includes: one fan blade. The fan blade has a hub and a plurality of blades extending radially outward from the hub. Moreover, each of the blades has a wind-driving surface, a leeward surface, a flange portion, a concave edge portion, and a side edge portion. A cross section from the flange portion to the concave edge portion of each blade is inclined. The side edge portion of each blade overlaps the wind-driving surface of the adjacent blade to form a inclined polygonal flower annular wall. When the fan blade is mounted on a fan frame and rotates, in addition to producing a large air volume output by the blades, the inclined polygonal flower annular wall may also reduce the noise generated during rotation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:扇葉</p>
        <p type="p">101:輪轂</p>
        <p type="p">102:葉片</p>
        <p type="p">1021:驅風面</p>
        <p type="p">1022:背風面</p>
        <p type="p">1023:凸緣部</p>
        <p type="p">1024:凹緣部</p>
        <p type="p">1025:側緣部</p>
        <p type="p">103:環牆</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="712px" img-content="tif" inline="yes" orientation="portrait" width="702px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622461</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146034</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G01B11/255</main-classification>
        <further-classification edition="200601120241231B">C21D8/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁子洹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, TZU-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉俊呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIUN CHERNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>鋼管彎曲檢測與矯正系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR STEEL PIPE BEND DETECTION AND CORRECTION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鋼管彎曲檢測與矯正系統，包含影像擷取裝置、矯正資料庫和彎曲檢測伺服器。影像擷取裝置用以擷取通過加熱退火設備之鋼管之至少一鋼管影像。矯正資料庫用以儲存對應於鋼管之矯正資料。彎曲檢測伺服器與影像擷取裝置及矯正資料庫通訊連接，且用以接收至少一鋼管影像及矯正資料。彎曲檢測伺服器包含彎曲檢測模組和矯正控制模組。彎曲檢測模組用以根據至少一鋼管影像以至少一彎曲檢測模型生成檢測結果，並根據檢測結果判斷鋼管是否為彎曲。矯正控制模組用以在判斷鋼管為彎曲時根據對應於鋼管之矯正資料決定控制參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A steel pipe bend detection and correction system includes: an image capture device, used for capturing at least one steel pipe image of the steel pipe passing through a heating annealing equipment; a correction database, used for storing a correction data corresponding to the steel pipe; and a bend detection server, communicatively connected to the image capture device and the correction database, used for receiving the at least one steel pipe image and correction data. The bend detection server includes: a bend detection module, used for generating a detection result using at least one bend detection model based on at least one steel pipe image, and determining whether the steel pipe is bent based on the detection results; and a correction control module, used for deciding a control parameter based on the correction data corresponding to the steel pipe when determining that the steel pipe is bent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鋼管彎曲檢測與矯正系統</p>
        <p type="p">110:彎曲檢測伺服器</p>
        <p type="p">111:影像處理模組</p>
        <p type="p">112:彎曲檢測模組</p>
        <p type="p">113:矯正控制模組</p>
        <p type="p">120:影像擷取裝置</p>
        <p type="p">130:矯正資料庫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="530px" img-content="tif" inline="yes" orientation="portrait" width="902px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623283</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146035</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250303B">H04W4/40</main-classification>
        <further-classification edition="201801120250303B">H04W4/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>公信電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳之偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉棋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張淑婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>訊息通訊方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種訊息通訊方法，主要是透過一路側單元(RSU)及至少一車側單元(OBU)的組合設計，該路側單元(RSU)與該車側單元(OBU)皆分別設有一中央處理器(CPU)及一分離式蜂巢式車聯網(C-V2X)控制模組，而該中央處理器(CPU)與該分離式蜂巢式車聯網(C-V2X)控制模組之間係透過一通訊介面進行通訊，再透過該分離式蜂巢式車聯網(C-V2X)控制模組來達到短距車對車之通訊，以提供即時警告及協同反應，或是車對基站之通訊，使能改善交通流量，提升道路效率。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">S100:時相資訊傳遞路側單元</p>
        <p type="p">S110:路側時相資訊進行傳遞</p>
        <p type="p">S120:通訊模組進行編譯封包</p>
        <p type="p">S130:車側單元接收通訊封包</p>
        <p type="p">S140:車側單元取出路側時相資訊</p>
        <p type="p">S150:路側時相資訊傳遞中央處理器</p>
        <p type="p">S160:路側時相資訊呈現使用者介面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="984px" img-content="tif" inline="yes" orientation="portrait" width="414px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623341</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146050</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>營邦企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃郁祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YU XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>閉環式雙水冷排散熱裝置</chinese-title>
        <english-title>CLOSED-CYCLE DOUBLE RADIATOR COOLING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係一種閉環式雙水冷排散熱裝置，包括液冷頭、第一液冷排、第二液冷排及風扇，液冷頭具有熱端口及冷端口，第一液冷排具有第一進液口及第一出液口，熱端口連通第一進液口，第二液冷排配置在液冷頭及第一液冷排之間，第二液冷排的體積小於第一液冷排的體積，第二液冷排具有第二進液口及第二出液口，第一出液口連通第二進液口，第二出液口連通冷端口，風扇對應第一液冷排配置並對第一液冷排氣冷散熱，第一液冷排位於風扇及第二液冷排之間；藉此，能夠在伺服器既有的空間大小下，進一步地提升伺服器的散熱效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A closed-cycle double radiator cooling device having a liquid-cooling head, a first liquid-cooling radiator, a second liquid-cooling radiator, and a fan is provided. The liquid-cooling head has a hot port and a cold port. The first liquid-cooling radiator has a first inlet and a first outlet. The hot port is communicated to the first inlet. The second liquid-cooling radiator is arranged between the liquid-cooling head and the first liquid-cooling radiator and has a second inlet and a second outlet. A volume of the first liquid-cooling radiator is smaller than a volume of the second liquid-cooling radiator. The first outlet is communicated to the second inlet. The second outlet is communicated to the cold port. The fan is corresponding to and performs air cooling to the first liquid-cooling radiator. A cooling efficiency of a server is therefore improving within an existing space of the server.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:液冷頭</p>
        <p type="p">20:第一液冷排</p>
        <p type="p">30:第二液冷排</p>
        <p type="p">40:風扇</p>
        <p type="p">A:伺服器</p>
        <p type="p">A1:熱源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="755px" img-content="tif" inline="yes" orientation="portrait" width="977px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622953</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146051</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G10L15/26</main-classification>
        <further-classification edition="202001120250303B">G06F40/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弘真科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NETKLASS TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>即時翻譯的會議系統以及分享方法</chinese-title>
        <english-title>CONFERENCING SYSTEM AND SHARING METHOD FOR REAL-TIME TRANSLATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種即時翻譯的會議系統，包括會議裝置、伺服器、顯示器以及多個使用者裝置。會議裝置擷取會議場域中的聲音訊號，並對聲音訊號進行斷句斷詞處理。伺服器從會議裝置接收處理後聲音訊號，並利用語音翻譯處理將處理後聲音訊號轉換為翻譯文字資料以傳送至會議裝置。會議裝置控制顯示器顯示翻譯文字資料。當多個使用者裝置向該會議裝置傳送各自的連線請求以與會議裝置建立連線時，會議裝置在建立連線之後從多個使用者裝置接收各使用者裝置的語言請求，其中會議裝置在接收各語言請求之後向各使用者裝置傳送翻譯文字資料，以令多個使用者裝置顯示翻譯文字資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A conferencing system for real-time translation is disclosed, which includes a conferencing device, a server, a display, and multiple user devices. The conferencing device captures an audio signal in a conference field and performs segmentation and tokenization for the audio signal; The server receives the processed audio signal from the conferencing device and converts the processed audio signal into translated text data by utilizing a voice translation process to transmit to the conferencing device; The conferencing device controls the display to display the translated text data. When the user devices transmit a respective connection request to the conferencing device to establish connections with the conferencing device, the conferencing device transmits to the a respective language request from the user devices after the connections are established, where the conferencing device transmits the translated textual data to each user device after receiving the respective language request, so as to make the user devices display the translated textual data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:即時翻譯的會議系統</p>
        <p type="p">111~11n:使用者裝置</p>
        <p type="p">120:會議裝置</p>
        <p type="p">130:伺服器</p>
        <p type="p">140:顯示器</p>
        <p type="p">150:分享裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="456px" img-content="tif" inline="yes" orientation="portrait" width="658px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621985</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146052</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120250219B">C01B32/205</main-classification>
        <further-classification edition="200601120250219B">B02C23/00</further-classification>
        <further-classification edition="202201120250219B">B01F35/94</further-classification>
        <further-classification edition="202201320250219B">B01F101/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美林控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEILIN HOLDINGS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美林能源科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEI LIN ENERGY TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁敏航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, MIN-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊茹媛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, RU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李武燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WU-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛百誼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, PAI YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>石墨粉體生產系統與方法</chinese-title>
        <english-title>GRAPHITE POWDER PRODUCTION SYSTEM AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種石墨粉體生產系統，包括：一入料模組；一微波加熱腔體；以及一出料模組。該微波加熱腔體內的加熱管內設置有一螺旋攪拌機構，用於將粉碎物料從該加熱管的一端推送到另一端，該螺旋攪拌機構具有攪拌軸桿，該攪拌軸桿上設有複數個攪拌片。本發明也揭示一種石墨粉體生產方法。根據本發明的石墨粉體生產系統與方法，能夠處理大量的有機粉碎物料，使其快速地加熱分解成為石墨粉體，且快速的冷卻送出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention discloses a graphite powder production system, including: a feeding module; a microwave heating cavity; and a discharging module. A spiral stirring mechanism provided in the heating tube in the microwave heating cavity is used for pushing the crushed materials from one end of the heating tube to the other end. The spiral stirring mechanism has a stirring shaft, and a plurality of stirring blades are provided on the stirring shaft. This invention also discloses a graphite powder production method. The graphite powder production system and method according to this invention can process a large amount of organic crushed materials, so that they can be quickly heated and decomposed into carbon materials, and then cooled and sent out quickly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:石墨粉體生產系統</p>
        <p type="p">100:入料模組</p>
        <p type="p">110:第一入料口</p>
        <p type="p">120:第一閥門</p>
        <p type="p">130:緩衝容器</p>
        <p type="p">140:第二閥門</p>
        <p type="p">150:第一出料口</p>
        <p type="p">200:微波加熱腔體</p>
        <p type="p">205:出氣孔</p>
        <p type="p">210:加熱管</p>
        <p type="p">215:第一螺旋攪拌機構</p>
        <p type="p">217:第一攪拌軸桿</p>
        <p type="p">219:攪拌片</p>
        <p type="p">220:微波功率源</p>
        <p type="p">230:第三閥門</p>
        <p type="p">255:入氣孔</p>
        <p type="p">300:出料模組</p>
        <p type="p">310:冷卻裝置</p>
        <p type="p">315:第二螺旋攪拌機構</p>
        <p type="p">317:第二攪拌軸桿</p>
        <p type="p">319:攪拌片</p>
        <p type="p">320:固態產物出料口</p>
        <p type="p">410:出氣管路</p>
        <p type="p">420:冷凝裝置</p>
        <p type="p">430:燃燒發電模組</p>
        <p type="p">500:控制裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="412px" img-content="tif" inline="yes" orientation="portrait" width="635px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623258</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146054</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250303B">H04N21/47</main-classification>
        <further-classification edition="201101120250303B">H04N21/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭萓聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, I-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>串流媒體伺服器佈署系統及其方法</chinese-title>
        <english-title>STREAMING MEDIA SERVER DEPLOYMENT SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種串流媒體伺服器佈署系統及其方法，該方法適用於包括多個影像伺服器及負載平衡器的串流媒體伺服器佈署系統，包括負載平衡器從使用者觀看設備接收觀看請求指令；負載平衡器於該些影像伺服器中選擇第一影像伺服器，並且將觀看請求指令傳送至第一影像伺服器；以及第一影像伺服器依據觀看請求指令尋找觀看請求指令對應的欲播放的目標串流，並且將目標串流傳送至使用者觀看設備，以於使用者觀看設備播放目標串流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A streaming media server deployment system and method thereof, the method which is suitable for the streaming media server deployment system, and the streaming media server deployment system includes a plurality of image servers and a load balancer. The method includes the load balancer receives a viewing request instruction from a user's viewing device; the load balancer selects a first image server among the image servers and sends the viewing request instruction to the first image server; and the first image server searches for a target stream to be played corresponding to the viewing request instruction according to the viewing request instruction, and transmits the target stream to the user's viewing device to play the target stream on the user's viewing device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201、S202、S203、S204、S205、S206、S207、S208:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="896px" img-content="tif" inline="yes" orientation="portrait" width="564px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622352</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146055</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">E06B3/78</main-classification>
        <further-classification edition="200601120241231B">E06B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大千裝潢有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIQIAN DECORATION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方康瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, KANG WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>拉門</chinese-title>
        <english-title>SLIDING DOOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種拉門，包含：門板體、成對的外覆板件以及透明板體。成對的外覆板件以覆設於門板體的開口槽的方式彼此相對向地設置。透明板體安裝於成對的外覆板件之間的容置空間。外覆板件的格柵結構具有強化結構柵條，以配合長形框架體共同形成抗變形結構並網狀地隔出複數個透光孔。長形框架體因抗變形結構而不致受材料內應力影響而變形，以確保成對的外覆板件的連接構件能夠確實連接。此外，本發明藉由成對的外覆板件及透明板體阻隔聲音與氣流通過拉門、且遮蔽直視以保視覺隱私，更允許環境光得以穿透拉門。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sliding door includes: a door plate, two covering plates and a transparent plate. The covering plates are opposite disposed in a manner of covering an opening slot of the door plate. The transparent plate is mounted in an accommodating space between the two covering plates. A grid structure of the covering plate has a plurality of reinforced structural palings being with a long frame to form a deformation-resistant structure that forms a plurality of reticulated apertures. The long frame are provided from deformation caused by internal stress from the material due to the deformation-resistant structure, which makes sure that a plurality connecting components of the covering plates are exactly connected to each other. In addition, the present invention stops the sound and the air flow pass through the sliding door by the two covering plate and transparent plate such that the direct vision is shielded for privacy and the environmental light is further allowable to pass through the sliding door.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:拉門</p>
        <p type="p">1:門板體</p>
        <p type="p">2:外覆板件</p>
        <p type="p">21:長形框架體</p>
        <p type="p">210:透光孔</p>
        <p type="p">22:格柵結構</p>
        <p type="p">221:強化結構柵條</p>
        <p type="p">3:透明板體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="1038px" img-content="tif" inline="yes" orientation="portrait" width="663px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622289</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146056</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C23C18/16</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鍾賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林聖哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>抗氫蝕結構與其形成方法</chinese-title>
        <english-title>HYDROGEN CORROSION RESISTANT STRUCTURE AND FORMATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抗氫蝕結構的形成方法，其包括：提供基材；以及以液相沉積法於基材暴露於外的表面的至少一部分上形成抗氫蝕層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming a hydrogen corrosion resistant structure including the following steps is provided: providing a substrate; and forming a hydrogen corrosion resistant layer on at least a portion of an exposed surface of the substrate by a liquid-phase deposition (LPD) method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11、S12:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="289px" img-content="tif" inline="yes" orientation="portrait" width="425px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621757</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146057</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250219B">A61N2/00</main-classification>
        <further-classification edition="200601120250219B">A61N2/02</further-classification>
        <further-classification edition="200601120250219B">H01F5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依樵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, I-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡博期</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, PO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宗鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZONG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIA YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林治中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帥俊銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHUO, JYUN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>經顱磁刺激立體線圈裝置的驅動系統</chinese-title>
        <english-title>DRIVING SYSTEM FOR TRANSCRANIAL MAGNETIC STIMULATION 3D COIL DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種經顱磁刺激立體線圈裝置的驅動系統。經顱磁刺激立體線圈裝置包括多個線圈，且各線圈的中心軸彼此垂直。驅動系統包括主控裝置、第一刺激主機及第二刺激主機。第一刺激主機用於刺激第一線圈。第二刺激主機用於刺激第二線圈。主控裝置判定對應於指定旋轉磁場方向的第一最大刺激輸出（MSO）比例及一第二MSO比例。主控裝置發送指示第一MSO比例的第一控制信號至第一刺激主機，並發送指示第二MSO比例的第二控制信號至第二刺激主機。第一刺激主機因應於第一MSO比例刺激第一線圈。第二刺激主機因應於第二MSO比例刺激第二線圈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the disclosure provide a driving system for a transcranial magnetic stimulation (TMS) 3D coil device. The TMS 3D coil device includes multiple coils whose central axes are perpendicular to each other. The driving system includes a main control device, a first and a second stimulation host. The first and second stimulation hosts are configured to stimulate a first and second coil. The main control device determines a first maximum stimulator output (MSO) ratio and a second MSO ratio corresponding to a specified rotating magnetic field direction. The main control device sends a first control signal indicating the first MSO ratio to the first stimulation host and a second control signal indicating the second MSO ratio to the second stimulation host. The first stimulation host stimulates the first coil based on the first MSO ratio. The second stimulation host stimulates the second coil based on the second MSO ratio.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第一線圈</p>
        <p type="p">12:第二線圈</p>
        <p type="p">13:第三線圈</p>
        <p type="p">1200:驅動系統</p>
        <p type="p">1205:主控裝置</p>
        <p type="p">1210:第一刺激主機</p>
        <p type="p">1220:第二刺激主機</p>
        <p type="p">1230:第三刺激主機</p>
        <p type="p">CS1:第一控制信號</p>
        <p type="p">CS2:第二控制信號</p>
        <p type="p">CS3:第三控制信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10047.JPG" file="ed10047.JPG" height="662px" img-content="tif" inline="yes" orientation="portrait" width="1014px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623457</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146060</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250425B">H10D89/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳哲宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHE-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有靜電放電保護功能的半導體結構</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE WITH ELECTROSTATIC DISCHARGE PROTECTION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種具有靜電放電保護功能的半導體結構。半導體結構包括基板、第一源極/汲極區、第二源極/汲極區、第三源極/汲極區、第一摻雜區、隔離結構與第二摻雜區。基板具有第一摻雜劑類型的第一井區。第一源極/汲極區、第二源極/汲極區與第三源極/汲極區，位於第一井區中，具有第二摻雜劑類型。第一摻雜區位於第一井區中，具有第一摻雜劑類型。隔離結構位於基板中。第二摻雜區位於隔離結構與第一源極/汲極區之間，具有第一摻雜劑類型，其中第二摻雜區的摻雜深度大於隔離結構的深度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a semiconductor structure with electrostatic discharge protection function. The semiconductor structure includes a substrate, a first source/drain region, a second source/drain region, a third source/drain region, a first doped region, an isolation structure and a second doped region. The substrate has a first well region of a first dopant type. The first source/drain region, the second source/drain region and the third source/drain region are located in the first well region and have a second dopant type. A first doped region is located in the first well region and has a first dopant type. The isolation structure is located in the substrate. The second doped region is located between the isolation structure and the first source/drain region and has the first dopant type, wherein the doping depth of the second doped region is greater than the depth of the isolation structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">110:基板</p>
        <p type="p">120:第一源極/汲極區</p>
        <p type="p">130:第二源極/汲極區</p>
        <p type="p">140:第三源極/汲極區</p>
        <p type="p">150:第一摻雜區</p>
        <p type="p">160:隔離結構</p>
        <p type="p">170:第二摻雜區</p>
        <p type="p">180:第一閘極</p>
        <p type="p">190:第二閘極</p>
        <p type="p">A-A’:線</p>
        <p type="p">DS1:距離</p>
        <p type="p">W1:第一寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="787px" img-content="tif" inline="yes" orientation="portrait" width="1022px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622684</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146061</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G05F1/46</main-classification>
        <further-classification edition="200601120241231B">H02M3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>致茂電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHROMA ATE INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林京樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>高壓電源供應裝置</chinese-title>
        <english-title>HIGH-VOLTAGE POWER SUPPLY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種高壓電源供應裝置，包含電壓隔離模組、可調壓電源供應模組、直流交流轉換模組、變壓模組以及回授控制模組。可調壓電源供應模組受控於電壓回授信號以調整直流基準電壓。直流交流轉換模組依據控制信號將直流基準電壓轉換為交流低電壓信號。變壓模組將交流低電壓信號轉換為多個交流高電壓信號，並將所述多個交流高電壓信號轉換為多個直流輸出電壓。回授控制模組偵測被選擇的兩個直流輸出電壓之間的電壓差，並比較電壓差與預設門檻值，據以產生電壓回授信號。其中被選擇的兩個直流輸出電壓係為供應給輸出端的正電壓與負電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a high-voltage power supply device comprises a voltage isolation module, an adjustable voltage power supply module, a DC-AC conversion module, a transformer module, and a feedback control module. The adjustable voltage power supply module is controlled by a voltage feedback signal to adjust a DC reference voltage. The DC-AC conversion module converts the DC reference voltage into an AC low-voltage signal based on a control signal. The transformer module converts the AC low-voltage signal into a plurality of AC high-voltage signals, and further converts into a plurality of DC output voltages. The feedback control module detects a voltage difference between two of the DC output voltages and compares the voltage difference with a preset threshold to generate the voltage feedback signal. Wherein the two selected DC output voltages are a positive voltage and a negative voltage supplied to an output terminal of the high-voltage power supply device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:高壓電源供應裝置</p>
        <p type="p">10:供電模組</p>
        <p type="p">11:電壓隔離模組</p>
        <p type="p">12:可調壓電源供應模組</p>
        <p type="p">13:直流交流轉換模組</p>
        <p type="p">14:變壓模組</p>
        <p type="p">15:回授控制模組</p>
        <p type="p">150:電壓偵測單元</p>
        <p type="p">151:電壓比較單元</p>
        <p type="p">16:輸出端</p>
        <p type="p">17:控制晶片</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="366px" img-content="tif" inline="yes" orientation="portrait" width="768px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621792</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146069</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">B01J37/02</main-classification>
        <further-classification edition="200601120241220B">B01J37/04</further-classification>
        <further-classification edition="200601120241220B">B01J29/03</further-classification>
        <further-classification edition="200601120241220B">B01J29/04</further-classification>
        <further-classification edition="202401120241220B">B01J35/50</further-classification>
        <further-classification edition="200601120241220B">B01D39/20</further-classification>
        <further-classification edition="202201120241220B">B01D46/00</further-classification>
        <further-classification edition="200601120241220B">B01D53/62</further-classification>
        <further-classification edition="200601120241220B">B01D53/94</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林淵淙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋佾威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程培正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, PEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張岳倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUEH-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>鐵錳改質MCM-41觸媒濾餅的製造方法及用途</chinese-title>
        <english-title>METHOD FOR MANUFACTURING IRON/MANGANESE-MODIFIED MCM-41 CATALYST FILTER CAKE AND USE OF THE MANUFACTURED IRON/MANGANESE-MODIFIED MCM-41 CATALYST FILTER CAKE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鐵錳改質MCM-41觸媒濾餅的製造方法，用以製造獲得能夠用於去除一氧化碳及/或懸浮微粒的鐵錳改質MCM-41觸媒濾餅。該製造方法包含：提供一MCM-41觸媒；混合該MCM-41觸媒及一過渡金屬鹽水溶液，使該過渡金屬鹽水溶液中的鐵離子與錳離子負載於該MCM-41觸媒上，以形成一金屬改質觸媒；及將該金屬改質觸媒分散於包含有二乙胺的水中，以形成一分散液，續將該分散液滴加於一陶瓷纖維濾餅上，以獲得該鐵錳改質MCM-41觸媒濾餅。本發明另關於依如前述之製造方法所製造獲得的鐵錳改質MCM-41觸媒濾餅的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for manufacturing iron/manganese-modified MCM-41 catalyst filter cake is used for manufacturing the iron/manganese-modified MCM-41 catalyst filter cake able to remove carbon oxide and/or particulate matters. The method includes: providing a MCM-41 catalyst; loading the MCM-41 catalyst with iron ions and manganese ions in an aqueous solution of transition metal salts by mixing the MCM-41 catalyst with the aqueous solution of transition metal salts, forming a metal-modified catalyst; and forming a dispersion by dispersing the metal-modified catalyst in water with ethylenediamine, followed by dropwise adding the dispersion onto a filter cake of ceramic fibers to obtain the iron/manganese-modified MCM-41 catalyst filter cake. The uses of the iron/manganese-modified MCM-41 catalyst filter cake manufactured by the method are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:觸媒提供步驟</p>
        <p type="p">S2:金屬離子負載步驟</p>
        <p type="p">S3:觸媒負載步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="706px" img-content="tif" inline="yes" orientation="portrait" width="745px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621936</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146071</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250214B">B62K25/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久鼎金屬實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏維澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍益坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>模組化之載具避震結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種模組化之載具避震結構，其包含有一殼體、一連接軸、一彈性件與一調整件。殼體具有一貫通殼體前後端之容置空間。連接軸穿設於殼體之容置空間。彈性件可伸縮地套設連接軸，彈性件之一端設置於殼體，另一端設置於連接軸。調整件，可移動地套設於連接軸之一端，並抵接彈性件，以調整彈性件之預載量。藉此，連接軸可安裝於載具的懸臂之間，在載具經過不平整之路面時，傳導到懸臂的震動即可由彈性件進行吸收。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:載具避震結構</p>
        <p type="p">20:殼體</p>
        <p type="p">21:容置空間</p>
        <p type="p">22:第一溝孔</p>
        <p type="p">23:階緣</p>
        <p type="p">30:連接軸</p>
        <p type="p">32:止檔部</p>
        <p type="p">33:螺紋部</p>
        <p type="p">40:彈性件</p>
        <p type="p">41:定位段</p>
        <p type="p">50:調整件</p>
        <p type="p">51:調整凹槽</p>
        <p type="p">60:軸承</p>
        <p type="p">70:固定件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="720px" img-content="tif" inline="yes" orientation="portrait" width="1002px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621935</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146072</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">B62K23/06</main-classification>
        <further-classification edition="200601120250108B">B62J1/00</further-classification>
        <further-classification edition="200601120250108B">F16C1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久鼎金屬實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林育安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>轉動式線控裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種轉動式線控裝置，其包含有一安裝座、一導引件、一轉動環以及一纜索。安裝座具有一軸孔。導引件設置於安裝座，其具有一設置於安裝座之一側的第一導輪。轉動環套設安裝座，其可相對於安裝座轉動。纜索穿設於安裝座並沿著導引件設置而形成一第一彎折段，纜索以第一彎折段與第一導輪之外周面相抵接，且纜索之一端被固定於轉動環，於轉動環相對於安裝座轉動時，纜索同時被牽引。如此，轉動式線控裝置可透過安裝座套於自行車之車手把，讓騎乘者透過手指轉動轉動環，即可控制自行車座管內之升降閥體進行開閥，使坐墊高度得以被調整。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">22:第一迫緊孔</p>
        <p type="p">23:迫緊片</p>
        <p type="p">24:上蓋</p>
        <p type="p">241:延伸部</p>
        <p type="p">242:出線孔</p>
        <p type="p">25:環座</p>
        <p type="p">251:通孔</p>
        <p type="p">26:螺絲</p>
        <p type="p">27:凹陷部</p>
        <p type="p">30:導引件</p>
        <p type="p">40:轉動環</p>
        <p type="p">41:第二迫緊孔</p>
        <p type="p">42:線定位部</p>
        <p type="p">44:定位件</p>
        <p type="p">50:纜索</p>
        <p type="p">51:第一彎折段</p>
        <p type="p">52:第二彎折段</p>
        <p type="p">70:迫緊件</p>
        <p type="p">80:橡膠套環</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="1020px" img-content="tif" inline="yes" orientation="portrait" width="541px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622259</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146084</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250325B">C22B9/16</main-classification>
        <further-classification edition="200601120250325B">C22B9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華新麗華股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALSIN LIHWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏于勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, YU SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭名宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, MING HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文滔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江輔航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, FU HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王儉堂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許明豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, MING HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王瑜慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>廢鋼次級料於精煉爐中一段式冶煉的回收處理方法及設備</chinese-title>
        <english-title>METHOD AND APPARATUS FOR RECYCLING AND PROCESSING INFERIOR STEEL SCRAP THROUGH ONE-STAGE SMELTING IN A LADLE REFINING FURNACE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種廢鋼次級料於精煉爐中一段式冶煉的回收處理方法及設備，回收處理的廢鋼次級料不限定鋼種，例如碳鋼或合金鋼的廢鋼次級料皆可。在精煉爐中添加重量比例50%以上的廢鋼次級料，例如可添加100%的廢鋼次級料(全部使用廢鋼次級料)，使廢鋼次級料在精煉爐中熔融；在精煉爐中添加還原劑，使廢鋼次級料在精煉爐中進行還原而成為製程用鋼水。本發明在精煉爐上方設置封閉的集塵罩，在集塵罩上方設置集塵構造，集塵罩可防止廢鋼次級料熔融的鋼水噴濺造成料損，以及防止高溫形成的飛塵四散造成空汙，同時加高集塵構造的設置位置，飛塵冷卻快不需使用水冷機制，集塵構造可避免吸入過多且高溫的飛塵，可延長集塵構造的使用壽命。本發明設置廢鋼次級料料倉及成分調整料倉的雙重料倉，廢鋼次級料料倉透過設置有震動機構、滾動機構、擾動機構或攪動機構的給料件及移動送料管可達成連續送料以及調整廢鋼次級料的送料位置確保入料的功效，成分調整料倉則可根據所需鋼水的需求投入例如鉻、錳等成分調整物料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:精煉爐</p>
        <p type="p">11:出鋼口</p>
        <p type="p">12:排渣口</p>
        <p type="p">13:電極棒</p>
        <p type="p">2:集塵罩</p>
        <p type="p">3:集塵構造</p>
        <p type="p">4:廢鋼次級料料倉</p>
        <p type="p">5:給料件</p>
        <p type="p">6:移動送料管</p>
        <p type="p">7:成分調整料倉</p>
        <p type="p">8:台車</p>
        <p type="p">A:鋼水</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="908px" img-content="tif" inline="yes" orientation="portrait" width="691px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622556</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146091</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250218B">G02B6/12</main-classification>
        <further-classification edition="200601120250218B">G02B6/13</further-classification>
        <further-classification edition="200601120250218B">G02B6/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矽品精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICONWARE PRECISION INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃禎嫻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHEN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧汶瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENG, WEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪良易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, LIANG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康政畬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王愉博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>光電裝置及其製法</chinese-title>
        <english-title>OPTOELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光電裝置及其製法，其中，該光電裝置包含有光學引擎晶片及設於該光學引擎晶片上之光纖連接器，該光纖連接器具有本體及連接該本體之支撐部，以令用以固定該光纖連接器及該光引擎晶片之黏著層可容設於該本體及該支撐部所圍束的空間中，且使該光纖連接器可透過該支撐部平穩立設於該光學引擎晶片上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an optoelectronic device and its manufacturing method which comprises: an optical engine chip and an optical fiber connector provided on the optical engine chip, wherein the optical fiber connector includes a body and a support portion connected to the body, so that an adhesive layer used to fix the optical fiber connector and the optical engine chip can be accommodated in the space surrounded by the body and the support portion, and the optical fiber connector can be stably erected on the optical engine chip through the support portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光電裝置</p>
        <p type="p">11:光學引擎晶片</p>
        <p type="p">11a:第一側</p>
        <p type="p">11b:第二側</p>
        <p type="p">12:黏著層</p>
        <p type="p">13:光纖連接器</p>
        <p type="p">131:本體</p>
        <p type="p">132:支撐部</p>
        <p type="p">14:導電元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="340px" img-content="tif" inline="yes" orientation="portrait" width="443px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622367</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146097</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">F04D29/22</main-classification>
        <further-classification edition="200601120250108B">F04D29/24</further-classification>
        <further-classification edition="200601120250108B">F04D29/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東元電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECO ELECTRIC &amp; MACHINERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖志勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIH-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TA-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林岳宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUE-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳家慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIA-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>選擇性調整流體流出管朝向之離心式泵浦組件</chinese-title>
        <english-title>A CENTRIFUGAL PUMP ASSEMBLY WITH SELECTIVELY ADJUSTABLE FLUID OUTLET PIPE ORIENTATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種選擇性調整流體流出管朝向之離心式泵浦組件包含一離心式泵浦、至少一腳座與至少一鎖固元件。離心式泵浦包含一泵浦本體、至少二固定座與一流體流出管。泵浦本體具有至少二組裝側與異於上述組裝側之一流體流出側。固定座設置於上述組裝側。流體流出管設置於流體流出側。腳座用以在上述組裝側中選擇出一選定組裝側後，抵接於設置在選定組裝側之固定座。鎖固元件用以將腳座鎖固於選定組裝側之固定座。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A centrifugal pump assembly with selectively adjustable fluid outlet pipe orientation includes a centrifugal pump, at least one foot, and at least one locking element. The centrifugal pump includes a pump body, at least two mounting bases, and a fluid outlet pipe. The pump body has at least two mounting sides and a fluid outlet side different from the aforementioned mounting sides. The mounting bases are disposed on the aforementioned mounting sides. The fluid outlet pipe is disposed on the fluid outlet side. The foot is used to abut against the mounting base disposed on a selected mounting side after selecting the selected mounting side from the aforementioned mounting sides. The locking element is used to lock the foot to the mounting base on the selected mounting side.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:泵浦組件</p>
        <p type="p">1:離心式泵浦</p>
        <p type="p">11:泵浦本體</p>
        <p type="p">111a:組裝側</p>
        <p type="p">113:殼體</p>
        <p type="p">114:泵蓋</p>
        <p type="p">117a:殼體鎖固件</p>
        <p type="p">1171a:穿設段</p>
        <p type="p">1172a:凸伸段</p>
        <p type="p">12c:固定座</p>
        <p type="p">121c:鎖孔</p>
        <p type="p">122b:鎖孔</p>
        <p type="p">13:流體流出管</p>
        <p type="p">2:腳座</p>
        <p type="p">21:連結部</p>
        <p type="p">22a,22b:支撐部</p>
        <p type="p">25:通孔</p>
        <p type="p">3a,3b:鎖固元件</p>
        <p type="p">4:螺帽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="714px" img-content="tif" inline="yes" orientation="portrait" width="765px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621766</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146098</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A63F9/30</main-classification>
        <further-classification edition="200601120241230B">B25J15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寶凱電子企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏銘山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏彤穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>夾物機之夾爪開合平移調整裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種夾物機之夾爪開合平移調整裝置，包含一承接座及一調整板。該承接座包括一芯座部，及複數由該芯座部朝外延伸且分別供該等爪身樞接的樞座部。每一樞座部開設出一用於容置相對應爪身的開槽。該芯座部開設有複數彼此相間隔的定位孔。該調整板包括一靠抵於該芯座部的芯板部，及一朝該承接座凸伸且嵌設於其中一定位孔中的定位部。使用者可透過旋轉該調整板，使該調整板相對於該承接座旋轉，藉此使該定位部由其中一定位孔中移出，並於重新對準另一定位孔後嵌入，如此可使該調整板以不同部位遮擋於該等開槽的上方，從而調整該等爪身的開度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:夾爪裝置</p>
        <p type="p">21:驅動元件</p>
        <p type="p">22:芯桿</p>
        <p type="p">23:連動桿</p>
        <p type="p">24:爪身</p>
        <p type="p">3:夾爪開合平移調整裝置</p>
        <p type="p">31:承接座</p>
        <p type="p">311:芯座部</p>
        <p type="p">312:樞座部</p>
        <p type="p">313:開槽</p>
        <p type="p">314:定位孔</p>
        <p type="p">32:調整板</p>
        <p type="p">321:芯板部</p>
        <p type="p">322:凸垣部</p>
        <p type="p">323:彈片部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="931px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622804</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146102</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250319B">G06N3/063</main-classification>
        <further-classification edition="201801120250319B">G06F9/44</further-classification>
        <further-classification edition="201801120250319B">G06F9/445</further-classification>
        <further-classification edition="200601120250319B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商艾沛芯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APACECORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許萓庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YI TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>人工智慧計算裝置</chinese-title>
        <english-title>ARTIFICIAL INTELLIGENCE COMPUTING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種人工智慧計算裝置，包含以下元件。控制晶粒設置在基板之上。儲存晶粒設置在控制晶粒之上。儲存晶粒包含動態隨機存取記憶體，此動態隨機存取記憶體用以儲存機器學習模型。控制晶粒和儲存晶粒的其中之一包含靜態隨機存取記憶體。深度學習處理單元電性連接至儲存晶粒，用以執行機器學習模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an artificial intelligence computing device including following components. A control die is disposed on a substrate. A memory die is positioned above the control die. The memory die includes dynamic random-access memory (DRAM) for storing a machine learning model. Either the control die or the memory die includes static random-access memory (SRAM). A deep learning processing unit is electrically connected to the memory die and is configured to execute the machine learning model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:人工智慧計算裝置</p>
        <p type="p">110:基板</p>
        <p type="p">120:控制晶粒</p>
        <p type="p">121:控制器</p>
        <p type="p">130:儲存晶粒</p>
        <p type="p">131:動態隨機存取記憶體</p>
        <p type="p">132:靜態隨機存取記憶體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="421px" img-content="tif" inline="yes" orientation="portrait" width="614px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622433</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146104</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250430B">F25D23/00</main-classification>
        <further-classification edition="200601120250430B">F25D11/02</further-classification>
        <further-classification edition="200601120250430B">F25D27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＺＥＲＯ　ＦＯＯＤ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZERO FOOD CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木野正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINO, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮谷茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATANI, SHIGERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂田剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKATA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>高濕度保管庫</chinese-title>
        <english-title>STORAGE CHAMBER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種保管庫，具備第一空間與第二空間；前述第一空間及前述第二空間是經由將第一空間空氣與第二空間空氣以任意之混合比率混合的連通機構來互相地連通；前述保管庫具備：冷卻裝置，被設置在前述第二空間中，且將前述第二空間的第二溫度(t2)冷卻至比前述第一空間的第一溫度(t1)還低；以及控制冷卻裝置的控制裝置；其中，在經由前述連通機構混合前述第一空間的空氣與前述第二空間的空氣時，高溫高絕對濕度空氣透過低溫低絕對濕度空氣冷卻而部分地過飽和的水蒸氣含有空氣，係以在混合空氣中產生或不產生霧或冰霜的邊界附近的、未產生側的混合比來混合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A storage chamber is provided and includes a first space and a second space. The first space and the second space are communicated via a communication mechanism that mixes first-space air and second-space air at any desired mixing ratio. The storage chamber includes: a cooling device, which is installed in the second space, and cools the second temperature t2 of the second space to be lower than the first temperature t1 of the first space; and a control device, which controls the cooling device. When mixing air of the first space and air of the second space via the communication mechanism, the high-temperature and high-absolute-humidity air is cooled by the low-temperature and low-absolute-humidity air, resulting in water vapor-containing air that is partially supersaturated. The water vapor-containing air is mixed at a ratio of the side near the boundary where mist or frost could be formed or not in the mixed air, but at the side the mist or frost is not formed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:保管庫</p>
        <p type="p">102,104,109:區劃板</p>
        <p type="p">103:冷卻盤管</p>
        <p type="p">105:儲水槽</p>
        <p type="p">106,108,111,113:送風裝置</p>
        <p type="p">107,112:冷卻裝置</p>
        <p type="p">110:控制裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="728px" img-content="tif" inline="yes" orientation="portrait" width="882px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622424</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146106</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250529B">F24F3/14</main-classification>
        <further-classification edition="200601120250529B">F24F6/02</further-classification>
        <further-classification edition="200601120250529B">F25D17/08</further-classification>
        <further-classification edition="200601120250529B">F25D21/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＺＥＲＯ　ＦＯＯＤ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZERO FOOD CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂田剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKATA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木野正人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINO, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮谷茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATANI, SHIGERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>加濕冷卻系統</chinese-title>
        <english-title>HUMIDIFYING AND COOLING SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種冷卻庫的加濕冷卻系統，具備：冷卻裝置，具有冷卻盤管；以及控制裝置，控制前述冷卻裝置；其中，前述控制裝置是藉由控制前述冷卻裝置，重複地執行：冷卻模式，一邊使霜或水滴附著在前述冷卻盤管上，一邊將冷卻庫冷卻；與加濕模式，一邊使附著在前述冷卻盤管的前述霜昇華或使前述水滴蒸發，一邊將前述冷卻庫加濕。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A humidifying and cooling system of a cooling chamber is provided, and the system includes a cooling device having a cooling coil, and a control device that controls the cooling device. By controlling the cooling device, the control device alternately performs a cooling mode, in which the cooling chamber is cooled while frost or water droplets are bonded on the cooling coil, and a humidifying mode, in which the frost bonded on the cooling coil sublimates or the water droplets evaporate from the cooling coil while humidifying the cooling chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621719</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146109</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241212B">A61K36/82</main-classification>
        <further-classification edition="200601120241212B">A61K36/752</further-classification>
        <further-classification edition="200601120241212B">A61K36/06</further-classification>
        <further-classification edition="200601120241212B">A61P29/00</further-classification>
        <further-classification edition="201601120241212B">A23L33/105</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>東海大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNGHAI UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱致穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃玟瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大維</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>柳橙皮發酵康普茶及其用途</chinese-title>
        <english-title>CITRUS PEEL FERMENTED KOMBUCHA AND USE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種柳橙皮發酵康普茶及其用途，藉由添加柳橙皮於康普茶中進行共發酵獲得之所述柳橙皮發酵康普茶，可進一步提升康普茶之抗發炎效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a citrus peel fermented kombucha and use thereof, the citrus peel fermented kombucha obtained by adding citrus peel to kombucha for co-fermentation can further enhance the anti-inflammatory effect of the kombucha.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="511px" img-content="tif" inline="yes" orientation="portrait" width="617px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623015</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146112</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250102B">H01F41/02</main-classification>
        <further-classification edition="202501120250102B">H02K15/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張婉琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WAN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許智評</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建泩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>層疊芯體的製造設備及製造方法</chinese-title>
        <english-title>MANUFACTURING EQUIPMENT AND MANUFACTURING METHOD OF LAMINATED CORE BODY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種層疊芯體的製造設備及製造方法，層疊芯體包括多個上下疊置且兩兩相連的金屬片體。製造設備包含堆疊模具、預固定裝置及承接裝置。堆疊模具包括供金屬片體由上往下依序置入的疊置空間。預固定裝置的雷射焊接機對兩兩相鄰的兩個金屬片體的相接處依序進行點焊，使上下疊置的金屬片體定形成層疊芯體。承接裝置的載台用於承接來自疊置空間的層疊芯體，並能夠受控翻轉使層疊芯體向外排出。藉由雷射焊接機以雷射焊接方式對兩兩相鄰的兩個金屬片體的相接處依序進行點焊，能讓金屬片體被預固定而定形成層疊芯體，進而省去在堆疊模具內加熱的步驟，以簡化製造設備並減少故障發生機率，達到生產成本降低及生產效率提升的效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing equipment and a manufacturing method of a laminated core body, the laminated core body including a plurality of stacked metal sheets stacked one above the other and connected one above the other. The manufacturing equipment includes a stacking mold, a prefixing device, and a receiving device. The stacking mold includes a stacking space in which the metal sheets are inserted sequentially from top to bottom. Laser welding machines of the prefixing device performs spot welding on the junction of two adjacent ones of the metal sheets so as to fix the metal sheets stacked one above the other to form the laminated core body. A carrier of the receiving device is configured to receive the laminated core body from the stacking space and is capable of being rotated to discharge the laminated core body outwardly. By using the laser welding machines to perform spot welding sequentially on the junction of two adjacent ones of the metal sheets in a laser welding manner, the metal sheets can be pre-fixed to form the laminated core body, so that the step of heating in the stacking mold can be omitted, thereby simplifying the structure of the manufacturing equipment and reducing the probability of failure of the manufacturing equipment, so as to achieve the effect of lowering the production cost and improving the production efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">11:貫孔</p>
        <p type="p">31:沖頭</p>
        <p type="p">32:沖壓模具</p>
        <p type="p">321:沖壓孔</p>
        <p type="p">4:堆疊模具</p>
        <p type="p">41:疊置空間</p>
        <p type="p">5:預固定裝置</p>
        <p type="p">51:雷射焊接機</p>
        <p type="p">6:承接裝置</p>
        <p type="p">61:立座</p>
        <p type="p">63:載台</p>
        <p type="p">7:第一束緊環</p>
        <p type="p">71:第一限位孔</p>
        <p type="p">8:第二束緊環</p>
        <p type="p">81:第二限位孔</p>
        <p type="p">101:金屬片體</p>
        <p type="p">101a:片體部</p>
        <p type="p">101b:上黏膠部</p>
        <p type="p">101c:下黏膠部</p>
        <p type="p">200:金屬捲帶</p>
        <p type="p">202:帶體部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="748px" img-content="tif" inline="yes" orientation="portrait" width="875px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621646</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146120</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241219B">A61B8/06</main-classification>
        <further-classification edition="200601120241219B">A61B8/08</further-classification>
        <further-classification edition="200601120241219B">A61B8/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立成功大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHENG KUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李順裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHUENN-YUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃春融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHUN-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳儒逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝孟達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIEH, MENG-DAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃致憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱鼎翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIOU, DING-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝譯霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷明岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, MING-YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷鎧擇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, KAI-ZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳家浚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭志弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>穿戴式心臟超音波貼片、心血管疾病辨識系統及其方法</chinese-title>
        <english-title>WEARABLE CARDIAC ULTRASOUND PATCH, CARDIOVASCULAR DISEASE IDENTIFICATION SYSTEM, AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種穿戴式心臟超音波貼片、心血管疾病辨識系統及其方法，將矽光子積體電路層與微機電積體電路層整合為一光纖式微型感測器且其與一運算晶片封裝為一體，讓受檢者不受時間或地域限制以穿戴式的便捷方式實現心臟超音波的檢測處理，且該矽光子積體電路層中的各矽光子元件與微機電積體電路層中的各壓電元件分別疊接設置並以二維陣列排列，使該穿戴式心臟超音波貼片掃描到更多的角度。再者，本發明之心血管疾病辨識系統可處理受檢者的心臟超音波、心電訊號以及心音訊號，三者數據互相驗證，提高對綜合性心血管疾病的檢出率，以減少醫師診斷心血管疾病的時間與誤判。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wearable cardiac ultrasound patch, a cardiovascular disease identification system, and its method are disclosed. The patch integrates a silicon photonic integrated circuit layer with a micro-electro-mechanical system (MEMS) integrated circuit layer to form a fiber-optic miniature sensor, which is encapsulated with a computational chip as a single unit. This design allows individuals to conveniently perform cardiac ultrasound detection without being restricted by time or location. In the silicon photonic integrated circuit layer, each silicon photonic component is stacked with piezoelectric components from the MEMS integrated circuit layer and arranged in a two-dimensional array, enabling the wearable cardiac ultrasound patch to capture images from multiple angles. Furthermore, the cardiovascular disease identification system processes cardiac ultrasound data, electrocardiogram signals, and phonocardiogram signals of the individual under examination. By cross-verifying these three datasets, the system enhances the detection rate of comprehensive cardiovascular diseases, thereby reducing the time required for physicians to diagnose cardiovascular conditions and minimizing the risk of misdiagnosis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:穿戴式心臟超音波貼片</p>
        <p type="p">10:封裝體</p>
        <p type="p">100:黏膠層</p>
        <p type="p">11:光纖式微型感測器</p>
        <p type="p">12:運算晶片</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="778px" img-content="tif" inline="yes" orientation="portrait" width="618px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621563</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146126</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241206B">A01M1/04</main-classification>
        <further-classification edition="200601120241206B">G01N27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李殊智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHU-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李殊智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHU-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>防治螞蟻的箱體</chinese-title>
        <english-title>ANT-REPELLENT BOX</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露為一種防治螞蟻的箱體，包含一箱體及一燈具。箱體內部具有一容置空間；燈具設置於該容置空間內，該燈具能發出覆蓋該容置空間至少80%總面積的光線，用以干擾螞蟻的活動行為。藉由上述結構，透通過光照有效防止螞蟻於箱體內聚集築巢，減少對設備的干擾，達到非化學性且兼具環保的驅趕螞蟻效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an ant-repellent box comprising a box body and a lighting device. The box body includes an accommodating space, and the lighting device is disposed within this space. The lighting device emits light covering at least 80% of the total area of the accommodating space, disrupting the activity of ants. Through this structure, the use of light effectively prevents ants from gathering and nesting within the box, reducing interference with equipment. This achieves a non-chemical, environmentally friendly ant-repellent effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:箱體</p>
        <p type="p">11:容置空間</p>
        <p type="p">20:燈具</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="1029px" img-content="tif" inline="yes" orientation="portrait" width="810px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621961</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146127</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">B65F1/14</main-classification>
        <further-classification edition="200601120241231B">B29B17/00</further-classification>
        <further-classification edition="200601120241231B">B65D90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡僅鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JIN PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳於軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡僅鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JIN PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳於軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>容器回收裝置</chinese-title>
        <english-title>CONTAINER RECYCLING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種容器回收裝置，可供回收至少一待回收容器，包括：一主體，其包括一回收區，該回收區設有至少一回收桶，該至少一回收桶包括一桶體及一蓋體，該蓋體可拆卸地安裝於該桶體；一控制單元；及至少一計數單元，該至少一計數單元通訊連接該控制單元，該至少一計數單元可累計該至少一待回收容器的數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A container recycling device is provided, being adapted to recycle a container, including: a main body, including a recycling region, the recycling region having at least one recycling bin, the at least one recycling bin including a bin body and a lid, the lid removably assembled to the bin body; a control unit; and at least one counting unit, the at least one counting unit communicated with the control unit, the at least one counting unit accumulated a number of the container.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:容器回收裝置</p>
        <p type="p">10:主體</p>
        <p type="p">20:回收區</p>
        <p type="p">21:回收桶</p>
        <p type="p">50:絞碎區</p>
        <p type="p">51:絞碎機構</p>
        <p type="p">70:輸送區</p>
        <p type="p">71:輸送機構</p>
        <p type="p">72:殼體</p>
        <p type="p">73:輸送帶</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="976px" img-content="tif" inline="yes" orientation="portrait" width="669px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622400</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146128</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250108B">F16H1/32</main-classification>
        <further-classification edition="200601120250108B">F16H55/17</further-classification>
        <further-classification edition="201201120250108B">F16H57/023</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崴立機電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關永昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>減速機結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提供一種減速機結構，定義一軸線，一輸入軸沿軸線延伸，一第一外齒輪，相對軸線偏心且可轉動地連接至輸入軸，當輸入軸轉動，帶動第一外齒輪繞軸線轉動，一第一內齒輪設於第一外齒輪之外，一第二內齒輪設於該一外齒輪之外，第一、第二內齒輪沿軸線依序排列，其中第一內齒輪之齒數異於第二內齒輪之齒數，第一外齒輪同時與第一、第二內齒輪嚙合，一輸出軸連接第二內齒輪，包覆及支持相關組，第一內齒輪固定於外殼內，藉此可提供體積較小、易於製造之減速機。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:輸入軸</p>
        <p type="p">20:第一外齒輪</p>
        <p type="p">21:第一穿伸部</p>
        <p type="p">30:第一內齒輪</p>
        <p type="p">40:第二內齒輪</p>
        <p type="p">50:輸出軸</p>
        <p type="p">60:外殼</p>
        <p type="p">70:保持器</p>
        <p type="p">71:第一穿孔</p>
        <p type="p">80:配重塊</p>
        <p type="p">81:第二穿伸部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="706px" img-content="tif" inline="yes" orientation="portrait" width="830px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621979</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146131</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250220B">B82Y15/00</main-classification>
        <further-classification edition="201101120250220B">B82Y40/00</further-classification>
        <further-classification edition="200601120250220B">G01N27/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立高雄科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐健富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許正良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊永朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡沅南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐健雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>氣體感測器及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種氣體感測器，其包括依序堆疊的一基板、一半導體晶種層、一第一奈米結構層、一第一電極、一第二奈米結構層、以及一第二電極，其特徵在於，該第一奈米結構層通過先在該半導體晶種層之上成長出包括複數個半導體奈米件的一奈米結構層並接著對該奈米結構層執行一低溫氮摻雜處理而製成。如此設計，該第一奈米結構層包括複數個P型半導體奈米件，且該第二奈米結構層包括複數個N型半導體奈米件。從而，一金屬-氧化物半導體-金屬(MSM)結構即由該第二電極、該第一奈米結構層與該第二奈米結構層、以及該第一電極組成。並且，該第一奈米結構層與該第二奈米結構層之間具有PN junction。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:氣體感測器</p>
        <p type="p">11:基板</p>
        <p type="p">12:半導體晶種層</p>
        <p type="p">13:第一奈米結構層</p>
        <p type="p">131:P型半導體奈米件</p>
        <p type="p">132:筆尖形頭端</p>
        <p type="p">14:第一電極</p>
        <p type="p">16:第二奈米結構層</p>
        <p type="p">161:N型半導體奈米件</p>
        <p type="p">17:第二電極</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="681px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623680</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146133</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖富江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, FU-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖富江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, FU-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體晶片製作方法</chinese-title>
        <english-title>MANUFACTURING METHOD OF SEMICONDUCTOR CHIP</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種半導體晶片製作方法，其包含以下步驟：提供一晶片，該晶片具有一主動面、一非主動面及四側表面，該主動面與該非主動面相對，該四側表面連接該主動面與該非主動面，其中該非主動面及該四側表面皆設有一金屬薄膜；在一印刷電路基板塗佈一錫膏以形成一錫膏圖案，並且該錫膏圖案在該印刷電路基板上定義出一接合區域；將該晶片的該主動面附接到該接合區域；以及對附有該晶片的該印刷電路基板進行回焊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a manufacturing method of semiconductor chip. The manufacturing method of semiconductor chip includes the following steps: providing a chip, wherein the chip has an active surface, a non-active surface, and fours side surfaces, the active surface is opposite to the non-active surface, the fours side surfaces connects the active surface and the non-active surface, and the non-active surface and the fours side surfaces are respectively provided with a metal thin film; applying a solder paste to a printed circuit board to form a solder paste pattern, wherein the solder paste pattern defines a bonding area; attaching the active surface of the chip to the bonding area; and reflowing the printed circuit board with the chip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體晶片製作方法</p>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
        <p type="p">S140:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="806px" img-content="tif" inline="yes" orientation="portrait" width="707px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622568</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146136</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250220B">G02B6/42</main-classification>
        <further-classification edition="202501120250220B">H10H29/85</further-classification>
        <further-classification edition="202501120250220B">H10H29/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳崇道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳仰恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YANG-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇松宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, SUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>光子封裝結構及其製造方法</chinese-title>
        <english-title>PHOTONIC PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種光子封裝結構，其包含一基板、一矽光子模組、一發光二極體模組以及一驅動元件。矽光子模組與基板連接。發光二極體模組連接矽光子模組，使矽光子模組位於基板與發光二極體模組之間，且發光二極體模組包含一載板、至少一發光二極體元件及至少一導電凸塊。發光二極體元件設置於載板上，且發光二極體元件朝向矽光子模組。導電凸塊設置於載板上，導電凸塊朝向基板，且導電凸塊與發光二極體元件電性連接。驅動元件設置於基板上且與導電凸塊形成電性連接。藉此，可減少因高溫而導致的光強度衰減或結構損壞等問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to the present disclosure, a photonic packaging structure includes a substrate, a silicon photonics module, a light-emitting diode module and a driving element. The silicon photonics module is connected to the substrate. The light-emitting diode module is connected to the silicon photonics module, which makes the silicon photonics module between the substrate and the light-emitting diode module. The light-emitting diode module includes a carrier, at least one light-emitting diode element and at least one conductive bump. The light-emitting diode element is disposed on the carrier, and the light-emitting diode element faces the silicon photonics module. The conductive bump is disposed on the carrier. The conductive bump faces the substrate, and the conductive bump is electrically connected to the light-emitting diode element. The driving element is disposed on the substrate and is electrically connected to the conductive bump. Therefore, the problems such as light intensity degradation or structural damage caused by high temperature can be reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光子封裝結構</p>
        <p type="p">110:基板</p>
        <p type="p">120:矽光子模組</p>
        <p type="p">130:發光二極體模組</p>
        <p type="p">131:載板</p>
        <p type="p">132:發光二極體元件</p>
        <p type="p">133:導電凸塊</p>
        <p type="p">D:驅動元件</p>
        <p type="p">C:光纖接口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="451px" img-content="tif" inline="yes" orientation="portrait" width="778px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623165</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146137</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200701120250425B">H02M1/42</main-classification>
        <further-classification edition="200601120250425B">H02M7/217</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群光電能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHICONY POWER TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝宗穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, TSUNG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊逸群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, I-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電源供應器及功率因數校正方法</chinese-title>
        <english-title>POWER SUPPLY AND POWER FACTOR CORRECTION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源供應器，包含轉換電路、測量電路及控制電路。轉換電路用以將輸入電壓轉換為輸出電壓，轉換電路的功率開關用以根據控制訊號調整輸出電壓。測量電路用以測量輸入端的輸入電流，且用以根據輸入電流計算複數個諧波參數，該些諧波參數對應於複數個諧波頻率。控制電路耦接於轉換電路及測量電路，且用以根據輸入電壓產生對應於該些諧波頻率的複數個倍頻訊號。當輸入電流在複數個測量週期間的變化率大於預設值時，控制電路用以根據該些倍頻訊號及該些諧波參數產生電流補償訊號，且根據電流補償訊號產生控制訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply includes a conversion circuit, a measurement circuit and a control circuit. The conversion circuit is configured to convert an input voltage to an output voltage. A power switch of the conversion circuit is configured to adjust the output voltage according to a control signal. The measurement circuit is configured to measure an input current, and to calculate multiple harmonic parameters according to the input current, and the harmonic parameters correspond to multiple harmonic frequencies. The control circuit is coupled to the conversion circuit and the measurement circuit, and is configured to generate multiple order frequency signals corresponding to the harmonic frequencies according to an input voltage. When a change rate of the input current between multiple measurement cycles is greater than a preset value, the control circuit is configured to generate a current compensation signal according to the order frequency signals and the harmonic parameters, and generate the control signal according to the current compensation signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301-S306:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="710px" img-content="tif" inline="yes" orientation="portrait" width="896px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622504</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146143</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250501B">G01N33/68</main-classification>
        <further-classification edition="200601120250501B">G01N33/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國醫藥大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳朝榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖文伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEN-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡輔仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, FUU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>檢測糖尿病前期或糖尿病之方法及評估糖尿病前期患者病程發展之方法</chinese-title>
        <english-title>METHOD FOR DETECTING PREDIABETES OR DIABETES AND METHOD FOR ASSESSING PROGRESSION IN PATIENT WITH PREDIABETES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種檢測糖尿病前期或糖尿病之方法以及一種評估糖尿病前期患者病程發展之方法。檢測糖尿病前期或糖尿病之方法包含自受試者取得尿液樣本、進行檢測步驟及進行判斷步驟。在檢測步驟中，利用蛋白質體學分析法檢測尿液樣本中尿蛋白生物標誌的含量，以得到檢測值，其中尿蛋白生物標誌為α1酸性醣蛋白及/或鋅α2醣蛋白。在判斷步驟中，將檢測值與健康對照組的標準值相比，若檢測值高於標準值，判斷受試者患有糖尿病前期或糖尿病。藉此，本發明可透過非侵入式且易於使用的尿液樣本，快速檢測糖尿病之罹病風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for detecting prediabetes or diabetes and a method for assessing progression in patient with prediabetes are provided. The method for detecting prediabetes or diabetes includes obtaining a urine sample from a subject, performing a detection step and performing a determination step. In the detection step, a proteomics analysis method is used to detect a content of a urinary protein biomarker in the urine sample to obtain a detection value, where the urinary protein biomarker is alpha-1-acid glycoprotein 1 and/or zinc-alpha-2-glycoprotein. In the determination step, the detection value is compared with a standard value of a healthy control. If the detection value is higher than the standard value, it is determined that the subject has prediabetes or diabetes. Therefore, the present disclosure can quickly detect the risk of diabetes through a non-invasive and easy-to-use urine sample.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:檢測糖尿病前期或糖尿病之方法</p>
        <p type="p">110,120,130:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="718px" img-content="tif" inline="yes" orientation="portrait" width="650px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623158</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146145</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">H02M1/08</main-classification>
        <further-classification edition="200601120250425B">G05F1/565</further-classification>
        <further-classification edition="201601120250425B">H02J7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹鎮旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, ZHEN-XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>均流控制電路、電源供應器及供電系統</chinese-title>
        <english-title>CURRENT SHARING CONTROL CIRCUIT, POWER SUPPLY UNIT AND POWER SUPPLY SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種均流控制電路、電源供應器及供電系統，其中均流控制電路包括：控制器，用於輸出電流控制信號至供電電路，以指示供電電路之輸出電流。電流回饋電路，用於根據電流控制信號輸出對應之電流回饋信號至均流母線，其中，電流回饋信號為電流信號。控制器還用於接收均流母線之電壓，並用於根據均流母線之電壓調節電流控制信號。由此，本申請提供之均流控制電路、電源供應器及供電系統，可以精確地、穩定地實現多電源並聯供電系統中複數電源供應器進行輸出電流之均流控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a current sharing control circuit, a power supply unit and a power supply system. The current sharing control circuit includes a controller for outputting a current control signal to the power supply circuit to indicate the output current of the power supply circuit, a current feedback circuit for outputting a corresponding current feedback signal to the current sharing bus according to the current control signal, wherein the current feedback signal is a current signal. The controller is also used to receive the voltage of the current sharing bus and to adjust the current control signal according to the voltage of the equalizing bus. Thus, the current sharing control circuit, the power supply unit and the power supply system can accurately and stably achieve equalization of the output currents of multiple power supplies in a multiple parallel power supply system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:電源供應器</p>
        <p type="p">111:供電電路</p>
        <p type="p">1121:控制器</p>
        <p type="p">1122:電流回饋電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="842px" img-content="tif" inline="yes" orientation="portrait" width="702px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622348</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146148</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241205B">E04H17/14</main-classification>
        <further-classification edition="200601120241205B">E04H17/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元厚環護營造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN HOU ENVIRONMENTAL PROTECTION CONSTRUCTION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊明得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, MIN-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方建弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, CHIEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, WEN-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張啟威</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>圍籬結構</chinese-title>
        <english-title>FENCE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一圍籬結構包含複數個立柱、複數個橫向板、複數個第一縱向圓桿及複數個第二縱向圓桿，各該橫向板之兩端設置於相鄰的該些立柱，各該橫向板具有複數個第一穿孔及複數個第二穿孔，該些第一縱向圓桿穿設於該些第一穿孔，該些第二縱向圓桿穿設於該些第二穿孔，該些第一縱向圓桿及該些第二縱向圓桿呈交錯排列，相鄰的該些第一縱向圓桿及該些第二縱向圓桿之間具有間隙，因此風可快速通過該圍籬結構，避免風阻壓力過大導致該圍籬結構傾斜或損毀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fence includes columns, horizontal plates, first vertical circular rod and second vertical circular rods. Both ends of each of the horizontal plates are mounted on the adjacent columns. Each of the horizontal plates includes first through holes and second through holes, the first vertical circular rods are inserted into the first through holes, and the second vertical circular rods are inserted into the second through holes. The first and second vertical circular rods are arranged in dislocation and a gap exists between the adjacent first and second vertical circular rods, thus wind can pass through the fence quickly to avoid the fence from tilting or being damaged caused by excessive wind pressure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:圍籬結構</p>
        <p type="p">110:立柱</p>
        <p type="p">111:固定端</p>
        <p type="p">112:自由端</p>
        <p type="p">120:橫向板</p>
        <p type="p">130:第一縱向圓桿</p>
        <p type="p">140:第二縱向圓桿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="784px" img-content="tif" inline="yes" orientation="portrait" width="686px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622526</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146149</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250925B">G01R31/28</main-classification>
        <further-classification edition="200601120250925B">G01R1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張小娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAO-JUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊耀武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAO-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王丙銀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BING-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁寶魁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, BAO-KUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉新帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XIN-SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓延輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, YAN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔曉劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, XIAO-JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱大舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TA-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒易鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, YI-XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116624687</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>針點檢驗裝置與系統</chinese-title>
        <english-title>DEVICES AND SYSTEMS FOR CHECKING NEEDLE POINT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種針點檢驗裝置與系統，針點檢驗裝置包括：連接模組，用以連接針點治具，接收所述針點治具之供電電壓，以及傳輸所述針點治具之測試訊號；檢驗電路，與所述連接模組連接，所述檢驗電路用以接收所述供電電壓進行工作，並接收所述測試訊號，根據所述測試訊號判斷所述針點治具連接之待測試探針以及待測試射頻天線對應之功能是否正常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A devices and systems for checking needle point. devices for checking needle point includes: connection module for connecting the pin point grips, receiving the supply voltage from the pin point grips and transmitting the test signals from the pin point grips. inspection circuit, connected to the connection module, the inspection circuit board is used to receive the power supply voltage to work, and receive the test signal, according to the test signal to determine the needle point fixture connected to the probe to be tested as well as to be tested to the RF antenna corresponds to the normal function or not.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:針點檢驗裝置</p>
        <p type="p">110:連接模組</p>
        <p type="p">120:檢驗電路</p>
        <p type="p">101:針點治具</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="717px" img-content="tif" inline="yes" orientation="portrait" width="581px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622751</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146150</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G06F12/16</main-classification>
        <further-classification edition="200601120241231B">G06F11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慧榮科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON MOTION, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉劉育林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH LIU, YU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉思驛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, SZU-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉信金</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>執行瞬間斷電恢復處理的方法及電腦程式產品及裝置</chinese-title>
        <english-title>METHOD AND COMPUTER PROGRAM PRODUCT AND APPARATUS FOR PERFORMING SUDDEN POWER OFF RECOVERY PROCESS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種執行瞬間斷電恢復處理的方法、電腦程式產品及裝置。該方法由閃存控制器的處理單元執行，包含：在重新獲得電力後，執行瞬間斷電恢復處理所需的操作；以及執行精簡垃圾回收處理。瞬間斷電恢復處理和精簡垃圾回收處理的執行時間限制在主機端等待閃存控制器完成瞬間斷電恢復處理的一段預設時間之內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention is related to a method, a computer program product and an apparatus for performing a sudden power off recovery (SPOR) process. The method, performed by a processing unit of a flash controller, includes: after power is regained, performing operations required in the SPOR process and performing a compact garbage collection (GC) process. The execution time of the SPOR process and the compact GC process is limited to a preset time period that a host side waits for the flash controller to complete the SPOR process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:精簡垃圾回收處理</p>
        <p type="p">S510~S550:方法步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="960px" img-content="tif" inline="yes" orientation="portrait" width="805px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623024</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146154</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250205B">H01H19/14</main-classification>
        <further-classification edition="200601120250205B">H01H19/02</further-classification>
        <further-classification edition="200601120250205B">H01H19/04</further-classification>
        <further-classification edition="200601120250205B">G06F3/041</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商毅嘉電子(蘇州)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIA TECHNOLOGY (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毅嘉科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIA TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周忠慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUNG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仲瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116925311</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>旋鈕結構</chinese-title>
        <english-title>KNOB STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種旋鈕結構。旋鈕結構能用來安裝於一觸控功能顯示面板上。旋鈕結構包括一底座、一基板、一觸發件及一操作蓋。基板設置於底座上。基板包含一載體、一環形接墊、多個內側接墊及多個外側接墊。載體具有共同一圓心的一第一、第二與第三環形配置區域。環形接墊配置於第一環形配置區域上。多個內側接墊配置於第二環形配置區域上。多個內側接墊彼此間隔地配置且電性耦接。多個外側接墊配置於第三環形配置區域上。多個外側接墊彼此間隔地配置且電性耦接。觸發件能被操作以電性耦接環形接墊、以及內側接墊與外側接墊至少其中一者。據此，旋鈕結構能發出一第一訊號、一第二訊號、或一第三訊號至觸控功能顯示面板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A knob structure is provided. The knob structure can be installed on a touch-enabled display panel. The knob structure includes a base, a substrate, a triggering element, and an operating cover. The substrate is placed on the base and contains a carrier, an annular pad, multiple inner pads, and multiple outer pads. The carrier has first, second, and third annular configuration areas with a common center. The annular pad is arranged in the first annular configuration area. The inner pads are arranged in the second annular area, spaced apart from each other, and electrically coupled. The outer pads are arranged in the third annular area, also spaced apart from each other and electrically coupled. The triggering element can be operated to electrically connect the annular pad and at least one of the inner pads or the outer pads. Accordingly, the knob structure can send a first signal, a second signal, or a third signal to the touch-enabled display panel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板</p>
        <p type="p">21:載體</p>
        <p type="p">22:環形接墊</p>
        <p type="p">23:內側接墊</p>
        <p type="p">24:外側接墊</p>
        <p type="p">25:中心接墊</p>
        <p type="p">5:按壓開關</p>
        <p type="p">D1:徑向方向</p>
        <p type="p">A1:第一環形配置區域</p>
        <p type="p">A2:第二環形配置區域</p>
        <p type="p">A3:第三環形配置區域</p>
        <p type="p">FL:假想線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.png" file="d10016.TIF" giffile="ed10016.png" height="856px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621557</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146163</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A01G31/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大元光鮮有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VALOFRESH LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳載道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSAI-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林珍如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳家忞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JASMINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>傾斜式薄膜淺耕機構與運用傾斜式薄膜淺耕機構之隔離水耕方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種傾斜式薄膜淺耕機構與運用傾斜式薄膜淺耕機構之隔離水耕方法，該傾斜式薄膜式淺耕機構係設置於一水耕植栽設備，包含有若干載盤、栽培墊及複數栽培塊，該載盤設置於水耕植栽設備之一機架並相對地面傾斜預定角度，其上凹設有複數容納槽，該栽培墊置於載盤頂側，其對應各該容納槽之位置分別開設有複數栽培孔，各該栽培塊分別可拆卸地塞置於各栽培孔，係承載蔬菜苗，該水耕植栽設備之一液體輸送單元係連接載板之二端，可將培養液輸送至該載盤，使該栽培墊可受培養液之浮力作用而浮起，培養液可沿著傾斜之該載盤流動而自然地流入各容納槽，培養液於該載盤與栽培墊之間之流動過程概呈薄膜狀。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:傾斜式薄膜式淺耕機構</p>
        <p type="p">1:層架</p>
        <p type="p">12:載盤</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="486px" img-content="tif" inline="yes" orientation="portrait" width="694px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622682</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146164</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">G05D23/20</main-classification>
        <further-classification edition="202101120241230B">F25B41/20</further-classification>
        <further-classification edition="200601120241230B">F25B49/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澄鈦動能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENERGY TITAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾志良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHIH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>精準控溫之冷卻循環系統</chinese-title>
        <english-title>COOLING CIRCULATION SYSTEM WITH PRECISE TEMPERATURE CONTROL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明精準控溫之冷卻循環系統，其主要在於冷凝裝置之冷凝組設有一比例控制單元，且該比例控制單元(即低壓比例控制器或高壓比例控制器)連接有一整合控制器，同時該整合控制器與該冷卻循環系統之控制介面、壓縮機、泵浦及儲液槽連接；是以，利用該整合控制器可感測該儲液槽內之循環液溫度，且計算出該循環液溫度與該控制介面之設定溫度的溫度誤差值，該整合控制器會依據該溫度誤差值，進而控制該壓縮機與該泵浦的個別運轉率，以及控制該比例控制單元調整製冷劑進入蒸發器的量，進而達到即時且精準地的溫度控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cooling circulation system with precise temperature control is mainly characterized in that a condensing set of a condensing device includes a control unit, namely a high-pressure control unit or a low-pressure control unit. The control unit is connected with an integrated controller which is connected with a control interface, a compressor, a pump and a liquid storage tank of the cooling circulation system. The integrated controller is adapted to sense the temperature of the circulating liquid in the liquid storage tank, and thence calculate the temperature difference between the temperature of the circulating liquid and the set temperature of the control interface. Based on the temperature difference, the integrated controller further controls the respective operational rate of the compressor and the pump and controls the control unit to regulate the quantity of the refrigerant entered into an evaporator, thereby controlling the temperature instantly and accurately.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:精準控溫之冷卻循環系統</p>
        <p type="p">31:冷卻裝置</p>
        <p type="p">311:儲液槽</p>
        <p type="p">312:泵浦</p>
        <p type="p">313:連接管路</p>
        <p type="p">32:冷凝裝置</p>
        <p type="p">321:蒸發器</p>
        <p type="p">322:壓縮機</p>
        <p type="p">323:冷凝組</p>
        <p type="p">3231:冷凝器</p>
        <p type="p">3232:膨脹閥</p>
        <p type="p">3233A:高壓比例控制器</p>
        <p type="p">3234:整合控制器</p>
        <p type="p">33:控制介面</p>
        <p type="p">34:第一變頻器</p>
        <p type="p">35:第二變頻器</p>
        <p type="p">4:待冷卻機具</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="726px" img-content="tif" inline="yes" orientation="portrait" width="1021px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623153</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146165</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">H02K9/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澄鈦動能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENERGY TITAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾志良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHIH-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冠廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address></address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於馬達之散熱器</chinese-title>
        <english-title>HEAT DISSIPATION DEVICE APPLIED TO A MOTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明用於馬達之散熱器，其主要在於該散熱器設於一與該馬達之馬達本體呈連接的連接管路上，該散熱器具有一中空狀且與該連接管路連接之串接管，以及一供該馬達之控制器設置之承載座，故該控制器產生之熱能經由該承載座導引至該串接管，以便該熱能與流至該串接管內之液體進行熱交換，藉以降低該控制器溫度，除達到低成本且具該控制器快速散熱功效外，更可有效提昇該馬達使用壽命。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation device applied to a motor is provided. The heat dissipation device is disposed on a connecting pipeline which is connected to a motor body of the motor. The heat dissipation device includes a series connection pipeline which is hollow and connected to the connecting pipeline and a loading seat on which a controller of the motor is disposed. Accordingly, the heat generated by the controller can be guided from the loading seat to the series connection pipeline, which allows the heat and liquid flowing into the series connection pipeline to conduct a heat exchanging effect, thereby reducing the temperature of the controller, attaining low costs and a quick heat-dissipating effect for the controller, and assisting the motor in prolonging the service life efficiently.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:散熱器</p>
        <p type="p">31:串接管</p>
        <p type="p">32:承載座</p>
        <p type="p">311:連通孔</p>
        <p type="p">4:馬達</p>
        <p type="p">41:馬達本體</p>
        <p type="p">42:控制器</p>
        <p type="p">5:連接管路</p>
        <p type="p">A:液體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="604px" img-content="tif" inline="yes" orientation="portrait" width="855px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622446</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146168</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">F28F13/06</main-classification>
        <further-classification edition="200601120241231B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>四零四科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOXA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉育佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾冠惟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏昌旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, CHANG-HSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>散熱結構及相關的電子裝置</chinese-title>
        <english-title>HEAT DISSIPATING STRUCTURE AND RELATED ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種散熱結構，其包含有一基座、複數個第一散熱鰭片以及複數個第二散熱鰭片，該複數個第一散熱鰭片並排設置在該基座的一第一基部上，各該第一散熱鰭片上形成有一第一缺口，該複數個第一散熱鰭片的該第一缺口共同定義出沿一第一方向延伸的一第一通道，該複數個第二散熱鰭片並排設置在該基座的一第二基部上，各該第二散熱鰭片上形成有一第二缺口，該複數個第二散熱鰭片的該第二缺口共同定義出沿一第二方向延伸的一第二通道，該第二通道的一走向與該第一通道的一走向不在同一直線上。此外，本發明還揭露一種相關的電子裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipating structure is provided and includes a base, a plurality of first heat dissipating fins disposed on a first portion of the base in parallel, and a plurality of second heat dissipating fins disposed on a second portion of the base in parallel. A first notch is formed on each of the plurality of first heat dissipating fins. The first notches of the plurality of first heat dissipating fins cooperatively define a first channel extending along a first direction. A second notch is formed on each of the plurality of second heat dissipating fins. The second notches of the plurality of second heat dissipating fins cooperatively define a second channel extending along a second direction. The first channel and the second channel are not aligned in a straight line. Besides, a related electronic device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">13:散熱結構</p>
        <p type="p">131:基座</p>
        <p type="p">1311:第一基部</p>
        <p type="p">1312:第二基部</p>
        <p type="p">1313:第三基部</p>
        <p type="p">132:第一散熱鰭片</p>
        <p type="p">1321:第一缺口</p>
        <p type="p">133:第二散熱鰭片</p>
        <p type="p">1331:第二缺口</p>
        <p type="p">134:第一輔助散熱鰭片</p>
        <p type="p">135:第二輔助散熱鰭片</p>
        <p type="p">C1:第一通道</p>
        <p type="p">C2:第二通道</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:重力方向</p>
        <p type="p">F:氣流</p>
        <p type="p">L1,L2:長度方向</p>
        <p type="p">N:法線方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="620px" img-content="tif" inline="yes" orientation="portrait" width="804px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622947</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146170</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120241218B">G09G3/3233</main-classification>
        <further-classification edition="201601120241218B">G09G3/3266</further-classification>
        <further-classification edition="202001120241218B">H05B45/325</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董哲維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, CHE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭豫杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李玫憶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MEI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱郁勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉恩池</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, EN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置及其畫素驅動方法</chinese-title>
        <english-title>DISPLAY APPARATUS AND METHOD OF DRIVING PIXELS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置及其畫素驅動方法。顯示裝置包括畫素陣列、時序控制器、閘極驅動器、源極驅動器、以及發光驅動電路。畫素陣列具有多個自發光畫素電路。時序控制器提供畫素電壓資料、至少二掃描起始信號、以及發光起始信號。閘極驅動器基於掃描起始信號將單一畫面期間切割為多個子畫面期間以逐列開啟自發光畫素電路。源極驅動器基於畫素電壓資料在子畫面期間中的每一者對應自發光畫素電路提供多個畫素電壓，以決定自發光畫素電路的發光元件的驅動電流。發光驅動電路基於發光起始信號提供多個發光信號至自發光畫素電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An display apparatus and method of driving pixels thereof are provided. The display apparatus includes a pixel array, a timing controller, a gate driver, a source driver, and an emission driver circuit. The pixel array has a plurality of self-luminous pixel circuits. The timing controller provides a pixel voltage data, at least two scan start signals, and an emission start signal. The gate driver divides a single frame period into a plurality of sub-frame periods based on the scan start signals to turn on the self-luminous pixel circuits column by column. The source driver provides a plurality of pixel voltages corresponding to the self-luminous pixel circuit in each sub-frame period based on the pixel voltage data to determine driving currents of emission elements of self-luminous pixel circuits. The emission driving circuit provides a plurality of emission signals to the self-luminous pixel circuit based on the emission start signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:時序控制器</p>
        <p type="p">120:電力控制器</p>
        <p type="p">130:閘極驅動器</p>
        <p type="p">140:源極驅動器</p>
        <p type="p">150:發光驅動電路</p>
        <p type="p">160:畫素陣列</p>
        <p type="p">CS:掃描補償信號</p>
        <p type="p">CTDR:驅動電路</p>
        <p type="p">DATAex:顯示資料</p>
        <p type="p">DATApxl:畫素電壓</p>
        <p type="p">DL1:發光二極體</p>
        <p type="p">EM:發光信號</p>
        <p type="p">Idr:驅動電流</p>
        <p type="p">PX:自發光畫素電路</p>
        <p type="p">RS:重置信號</p>
        <p type="p">STVEM:發光起始信號</p>
        <p type="p">STVG1、STVG2:掃描起始信號</p>
        <p type="p">VC:電壓控制信號</p>
        <p type="p">VDD:系統高電壓</p>
        <p type="p">Vini:初始電壓</p>
        <p type="p">Vop:操作電壓</p>
        <p type="p">Vref:參考電壓</p>
        <p type="p">Vsig:畫素電壓</p>
        <p type="p">VSS:系統低電壓</p>
        <p type="p">Vsync:垂直同步信號</p>
        <p type="p">WS1:第一掃描信號</p>
        <p type="p">WS2:第二掃描信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="725px" img-content="tif" inline="yes" orientation="portrait" width="908px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621567</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146175</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250102B">A21D15/00</main-classification>
        <further-classification edition="202501120250102B">A21D15/08</further-classification>
        <further-classification edition="201701120250102B">A21D13/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>統一企業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNI-PRESIDENT ENTERPRISES CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃翊婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>提升機製可頌層次感之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種提升機製可頌層次感之方法，先對一混合材料進行攪拌，以使該混合材料形成一第一過渡麵糰，該第一過渡麵糰的擴展程度介於50%~70%之間，再使該第一過渡麵糰包裹奶油，並對該第一過渡麵糰進行一第一加工程序後，冷凍以形成一第二過渡麵糰，接著將該第二過渡麵糰回溫後，進行一第二加工程序，以形成一第三過渡麵糰，再對該第三過渡麵糰進行分割，並捲成待加工可頌，該待加工可頌的擴展程度為100%，最後將該等待加工可頌靜置於一第二冰箱內，使後續烘烤後不會有因過度擴展而影響口感的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21~25:提升機製可頌層次感之方法的步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="917px" img-content="tif" inline="yes" orientation="portrait" width="643px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621976</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146176</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B66C13/18</main-classification>
        <further-classification edition="200601120241230B">B65G43/00</further-classification>
        <further-classification edition="200601120241230B">B61B13/00</further-classification>
        <further-classification edition="200601120241230B">B61B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盟立自動化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRLE AUTOMATION CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張維哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEI-ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>高空行走式搬運車及側移模組的偵測裝置與偵測方法</chinese-title>
        <english-title>OVERHEAD HOIST TRANSFER, DETECTING DEVICE OF LATERAL MOVING MODULE, AND DETECTING METHOD OF LATERAL MOVING MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種高空行走式搬運車及側移模組的偵測裝置與偵測方法。高空行走式搬運車包含一車體、設置於車體內的一側移模組、連接於側移模組的一捲揚模組、連接於一捲揚模組的一夾爪模組、及一控制器。側移模組包含一第一側移機構、一第一感測單元、至少一第二側移機構及一第二感測單元。第一感測單元能感測第一側移機構的狀態產生一第一感測訊號。第二側移機構滑動地設置於第一側移機構。第二感測單元能感測第二側移機構的狀態產生一第二感測訊號。控制器能依據第一感測訊號與第二感測訊號得知側移模組的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure are directed to an overhead hoist transfer, a detecting device of lateral moving module, and a detecting method of lateral moving module. The overhead hoist transfer includes a vehicle body, a lateral moving module that is disposed in the vehicle body, a winch module that is connected to the lateral moving module, a clamping module that is connected to the winch module, and a controller. The lateral moving module includes a first lateral moving mechanism, a first sensing unit, at least one second lateral moving mechanism, and a second sensing unit. The first sensing unit can sense the state of the first lateral moving mechanism for generating a first sensing signal. The second lateral moving mechanism is slidably disposed at the first lateral moving mechanism. The second sensing unit can sense the state of the second lateral moving mechanism for generating a second sensing signal. The controller can obtain the state of the lateral moving module according to the first sensing signal and the second sensing signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:高空行走式搬運車</p>
        <p type="p">1:車體</p>
        <p type="p">11:走行模組</p>
        <p type="p">2:側移模組</p>
        <p type="p">21:第一側移機構</p>
        <p type="p">23:第二側移機構</p>
        <p type="p">3:捲揚模組</p>
        <p type="p">4:夾爪模組</p>
        <p type="p">41:夾爪機構</p>
        <p type="p">X:第一預設方向</p>
        <p type="p">H:高度方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="889px" img-content="tif" inline="yes" orientation="portrait" width="668px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623171</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146183</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">H02M3/158</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂達電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANPEC ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昆民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有電壓差控制機制的電源轉換器</chinese-title>
        <english-title>POWER CONVERTER HAVING VOLTAGE DIFFERENCE CONTROL MECHANISM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種具有電壓差控制機制的電源轉換器。本發明的電源轉換器包含上橋開關、下橋開關、下橋驅動電路、上橋打開驅動電路、上橋關閉驅動電路以及上橋電壓差調變電路。上橋打開驅動電路將上橋開關從關閉狀態切換至開啟狀態。上橋電壓差調變電路依據輸出節點的輸出電壓以輸出浮動電壓至上橋關閉驅動電路的第一電源輸入端，接著上橋關閉驅動電路使用浮動電壓來將上橋開關從開啟狀態切換至關閉狀態，使浮動電壓與輸出電壓之間的電壓差落入一目標電壓範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power converter having a voltage difference control mechanism is provided. The power converter includes a high-side switch, a low-side switch, a high-side off-state driver circuit, a high-side on-state driver circuit, a low-side driver circuit and a high-side voltage difference modulating circuit. The high-side on-state driver circuit switches the high-side switch from an off-state to an on-state state. The high-side voltage difference modulating circuit outputs a floating voltage to a first power input terminal of the high-side off-state driver circuit according to an output voltage of the output node, and the high-side off-state driver circuit uses the floating voltage to switch the high-side switch from the on-state to the off-state such that a voltage difference between the floating voltage and the output voltage falls within a target voltage range.</p>
      </isu-abst>
      <representative-img>
        <p type="p">HON:上橋打開驅動電路</p>
        <p type="p">HVM:上橋電壓差調變電路</p>
        <p type="p">HOFF:上橋關閉驅動電路</p>
        <p type="p">VFLT:浮動電壓</p>
        <p type="p">LDR:下橋驅動電路</p>
        <p type="p">VM:輸入電壓</p>
        <p type="p">HS:上橋開關</p>
        <p type="p">LS:下橋開關</p>
        <p type="p">VOUT:輸出電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="686px" img-content="tif" inline="yes" orientation="portrait" width="645px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622875</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146188</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120260302B">G06Q50/00</main-classification>
        <further-classification edition="202601120260302B">G06Q10/00</further-classification>
        <further-classification edition="201201120260302B">G06Q20/04</further-classification>
        <further-classification edition="201201120260302B">G06Q20/38</further-classification>
        <further-classification edition="200601120260302B">H04L9/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭銘書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MIN-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸本立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, BEN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃聖祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHENG-YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於區塊鏈智能合約的分潤系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR PROFIT SHARING BASED ON SMART CONTRACTS IN BLOCKCHAIN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種基於區塊鏈智能合約的分潤系統及方法。方法包括以下步驟：用戶減碳分潤模組從區塊鏈獲得綠色里程徽章令牌，並且用戶減碳分潤模組從區塊鏈獲得關聯於綠色里程徽章令牌的交通載具令牌，其中交通載具令牌關聯於碳足跡；用戶減碳分潤模組利用綠色里程徽章令牌以及交通載具令牌來計算出減碳分潤值；用戶意見分潤模組從區塊鏈獲得意見投票令牌；用戶意見分潤模組利用意見投票令牌、綠色里程徽章令牌以及交通載具令牌來計算出意見分潤值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for profit sharing based on smart contracts in blockchain are provided. The method includes following steps: a user-carbon-reduction-and-profit-sharing-module obtains a green mileage badge token from the blockchain, and the user-carbon-reduction-and-profit-sharing-module obtains a transportation vehicle token associated with the green mileage badge token from the blockchain, wherein the transportation vehicle token is associated with a carbon footprint; the user-carbon-reduction-and-profit-sharing-module uses the green mileage badge token and the transportation vehicle token to calculate a carbon reduction profit sharing value; a user-opinion-profit-sharing-module obtains an opinion survey token and an opinion voting token from the blockchain; the user-opinion-profit-sharing-module uses the opinion survey token, the green mileage badge token and the transportation vehicle token to calculate an opinion profit sharing value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S31、S33、S35、S37:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="658px" img-content="tif" inline="yes" orientation="portrait" width="910px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622707</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146189</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120241231B">G06F3/0354</main-classification>
        <further-classification edition="200601120241231B">G06F3/041</further-classification>
        <further-classification edition="201901120241231B">G06F1/324</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奕力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILI TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜俊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, CHUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>觸控顯示裝置及其操作方法</chinese-title>
        <english-title>TOUCH DISPLAY DEVICE AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控顯示裝置及其操作方法。觸控顯示裝置包括信號接收器、類比數位轉換器、信號傳輸器及處理器。信號接收器接收來自於主動式觸控筆的下行信號。下行信號包括類比觸控信號。類比數位轉換器將類比觸控信號轉換為取樣資料。在觸控顯示裝置的低頻運行模式時，處理器透過信號傳輸器及上行信號而調降由主動式觸控筆提供的下行信號的載波頻率。處理器降低類比數位轉換器的取樣頻率，並依據取樣資料進行觸控感測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch display device and an operating method thereof are provided. The touch display device includes a signal receiver, an analog-to-digital converter (ADC), a signal transmitter, and a processor. The signal receiver receives a downlink signal from an active stylus. The downlink signal includes an analog touch signal. The analog-to-digital converter converts the analog touch signal into sampled data. In a low frequency operating mode of the touch display device, the processor reduces a carrier frequency of the downlink signal provided by the active stylus through the signal transmitter and an uplink signal. The processor reduces a sampling frequency of the ADC and performs touch sensing according to the sampled data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S302~S360:觸控顯示裝置的操作方法的步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="778px" img-content="tif" inline="yes" orientation="portrait" width="1029px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622938</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146192</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250120B">G09G3/30</main-classification>
        <further-classification edition="200601120250120B">G09G5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李芝儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GRACE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾英忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YING-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖硯韜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, YEN-TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用以驅動顯示面板的驅動裝置</chinese-title>
        <english-title>DRIVING DEVICE FOR DRIVING DISPLAY PANEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種驅動裝置。驅動裝置包括驅動器以及時序控制器。驅動器耦接顯示面板的畫素電路以及背光電路。時序控制器耦接驅動器。在圖框週期中，時序控制器在延遲一段期間後，輸出輸出影像數據至驅動器，以使驅動器同時地根據輸出影像數據以及背光影像數據來驅動畫素電路以及背光電路。或者，在圖框週期中，當驅動器驅動畫素電路時，驅動器基於背光影像數據中的空白數據在一段期間後，根據背光影像數據中的有效數據驅動背光電路。如此，驅動裝置能夠在區域調光的應用中避免顯示畫面出現殘影。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A driving device is provided. The driving device includes a driver and a timing controller (TCON). The driver is coupled to a pixel circuit and a backlight circuit of a panel. The TCON is coupled to the driver. In a frame period, after a delayed interval, the TCON outputs output image data to the driver, such that the driver drives the pixel circuit and the backlight circuit according to the output image data and backlight image data at the same time. Alternatively, when the driver drives the pixel circuit, after an interval based on dummy data of the backlight image data, the driver drives the backlight circuit according to available data of the backlight image data. Thereby, the driving device is capable of avoiding blur issues happen in the display screen.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:驅動裝置</p>
        <p type="p">110:時序控制器</p>
        <p type="p">111:緩衝器</p>
        <p type="p">120:驅動器</p>
        <p type="p">121~123:驅動電路</p>
        <p type="p">DBL:背光影像數據</p>
        <p type="p">DIN:輸入影像數據</p>
        <p type="p">DOUT:輸出影像數據</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="695px" img-content="tif" inline="yes" orientation="portrait" width="895px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622473</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146195</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120241230B">G01K1/08</main-classification>
        <further-classification edition="200601120241230B">A61B5/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熱映光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RADIANT INNOVATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林增隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TSENG-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳依伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, I-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>耳套配送裝置</chinese-title>
        <english-title>PROBE COVER DELIVERY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種耳套配送裝置。耳套配送裝置包括耳套配送基座、耳套頂推組件以及耳套容置配件。耳套配送基座具有基座本體、第一滑槽結構以第二滑槽結構。耳套頂推組件設置在基座本體上。耳套容置配件設置在基座本體上。耳套頂推組件包括第一耳套頂抵件以及第二耳套頂抵件。第一耳套頂抵件具有第一支架部以及第一頂抵部。第二耳套頂抵件具有第二支架部以及第二頂抵部。耳套容置配件包括用於容置多個耳溫計探頭套的一耳套容置部、可移動地與第一滑槽結構相互配合的一第一配合部以及可移動地與第二滑槽結構相互配合的一第二配合部。藉此，耳溫計探頭套可以透過耳套頂推組件的第一頂抵部以及第二頂抵部的頂抵而從耳套容置配件掉落在耳套配送基座上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a probe cover delivery device. The probe cover delivery device includes a probe cover delivery base, an probe cover pushing assembly and an probe cover receiving accessory. The probe cover delivery base has a base body, a first sliding groove structure and a second sliding groove structure. The probe cover pushing assembly is arranged on the base body. The probe cover receiving accessory is arranged on the base body. The probe cover pushing assembly includes a first probe cover abutting element and a second probe cover abutting element. The first probe cover abutting element has a first holder portion and a first pushing portion. The second probe cover abutting element has a second holder portion and a second pushing portion. The probe cover receiving accessory includes an probe cover receiving portion for receiving a plurality of probe covers of an ear thermometer, a first fitting portion movably cooperating with the first sliding groove structure, and a second fitting portion movably cooperating with the second sliding groove structure. Thereby, the probe cover of the ear thermometer can be pushed by the first abutting element and second abutting element of the probe cover pushing assembly to drop from the probe cover receiving accessory onto the probe cover delivery base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">D:耳套配送裝置</p>
        <p type="p">1:耳套配送基座</p>
        <p type="p">10:基座本體</p>
        <p type="p">100R:耳套容置空間</p>
        <p type="p">101:第一耳套配送平台</p>
        <p type="p">102:第二耳套配送平台</p>
        <p type="p">103:耳套限位平台</p>
        <p type="p">11:第一滑槽結構</p>
        <p type="p">12:第二滑槽結構</p>
        <p type="p">2:耳套頂推組件</p>
        <p type="p">21:第一耳套頂抵件</p>
        <p type="p">211:第一支架部</p>
        <p type="p">2110:第一固定卡勾體</p>
        <p type="p">212:第一頂抵部</p>
        <p type="p">2120:第一傾斜面</p>
        <p type="p">22:第二耳套頂抵件</p>
        <p type="p">221:第二支架部</p>
        <p type="p">2210:第二固定卡勾體</p>
        <p type="p">222:第二頂抵部</p>
        <p type="p">2220:第二傾斜面</p>
        <p type="p">R1:第一容置空間</p>
        <p type="p">R2:第二容置空間</p>
        <p type="p">R3:第三容置空間</p>
        <p type="p">3:耳套容置配件</p>
        <p type="p">30:耳套容置部</p>
        <p type="p">301:中空本體</p>
        <p type="p">3011:第一開口</p>
        <p type="p">3012:第二開口</p>
        <p type="p">3013:耳套觀看區</p>
        <p type="p">302:耳套限位體</p>
        <p type="p">31:第一配合部</p>
        <p type="p">3100:第一活動卡勾體</p>
        <p type="p">32:第二配合部</p>
        <p type="p">3200:第二活動卡勾體</p>
        <p type="p">33:手壓凸桿部</p>
        <p type="p">4:第一彈性件</p>
        <p type="p">5:第二彈性件</p>
        <p type="p">C:耳溫計探頭套</p>
        <p type="p">C1:耳套部</p>
        <p type="p">C2:側端部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="1037px" img-content="tif" inline="yes" orientation="portrait" width="739px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621643</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146204</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250526B">A61B6/00</main-classification>
        <further-classification edition="202101120250526B">G03B43/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>能資國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENERGY RESOURCES INTERNATIONAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊聰敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TSUNG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳大愚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖文澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEN-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃科志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KER-JER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐嘉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖泰杉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, TAI-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>輕便式可拆卸組合與攜帶之Ｘ光投射輔具裝置</chinese-title>
        <english-title>THE X-RAY PROJECTION ASSISTIVE DEVICE WITH BOTH PORTABILITY AND DETACHABLE COMBINATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一目的在於提供輕便式可拆卸組合與攜帶之X光投射輔具裝置，包括一種ㄈ或U型可調高低與摺合收納托架，可拆卸固定X光機承載座與可攜式X光機所整合完成；當醫護人員使用時，張開一種ㄈ或U型可調高低與摺合收納托架，可拆卸固定X光機承載座置於其托架上兩臂管，並將可用可攜式X光機置換於其上，使可攜式X光機朝下投射x光；使用完畢時，將可拆卸固定X光機承載座鬆開旋轉螺絲與扣件模組，分離一種ㄈ或U型可調高低與摺合收納托架；或者，鬆脫可拆卸固定X光機承載座同側旋轉螺絲與扣件模組，使可拆卸固定X光機承載座一邊掛於一種ㄈ或U型可調高低與摺合收納托架上一臂管上並下垂，以和一種ㄈ或U型可調高低與摺合收納托架整體收合，利於醫護人員方便攜帶使用與移動；或者，輕便式可拆卸組合之X光投射輔具裝置，亦可為係包括一種ㄈ或U型可調高低與摺合收納托架，X光機轉軸承載座，L型板支撐件，旋轉角度控制件與可攜式X光機所整合完成，而可使可攜式X光機投射±90°內可自由旋轉角度方向操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">One of the purposes of this invention is to provide a lightweight, detachable and the X-ray projection assistive device with both portability and detachable combination, including a ㄈ- or U-shaped height-adjustable and foldable storage bracket, a detachable fixed X-ray machine carrying base and a portable X-ray machines . When used by medical staff, a ㄈ or U-shaped height-adjustable and foldable storage bracket is opened, a removable fixed X-ray machine carrying base is placed on the two arm tubes of the bracket, and a portable X-ray machine can be used to set on it so that the portable X-ray machine projects X-rays downward; After use, loosen the rotating screw and fastener module of the detachable fixed X-ray machine bearing base, and then separate a U-shaped or U-shaped adjustable height and folding storage bracket; or, loosen the detachable fixed X-ray machine bearing Rotate the screws and the hardware module on the same side of the base, so that the detachable fixed X-ray machine carrying base can be hung on one arm of a U-shaped or U-shaped height-adjustable and foldable storage bracket and hang down to match the one Or the U-shaped height-adjustable and foldable storage bracket can be folded as a whole, which is convenient for medical staff to carry, use and move. Alternatively, the X-ray projection assistive device with both portability and detachable combination can also include a U-shaped or U-shaped height-adjustable and foldable storage bracket, an X-ray machine shaft bearing base, L-shaped plates support, and rotation angle unit. The control unit are integrated with the portable X-ray machine, allowing the X-ray projection assistive device with both portability and detachable combination to freely rotate within ±90°。</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:一種ㄈ或U型可調高低與摺合收納托架</p>
        <p type="p">2:可拆卸固定X光機承載座</p>
        <p type="p">3:可攜式X光機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="683px" img-content="tif" inline="yes" orientation="portrait" width="502px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621587</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146208</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250514B">A43B17/00</main-classification>
        <further-classification edition="200601120250514B">A61B5/103</further-classification>
        <further-classification edition="201601120250514B">H02J50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北市立大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF TAIPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUO WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅思凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, SZU KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅榮岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, JUNG YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姬兆平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, CHAO PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤濬哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUN CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何喜將</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智慧感測鞋墊的感測方法及其結構</chinese-title>
        <english-title>SENSING METHOD AND STRUCTURE OF AN INTELLIGENT SENSING INSOLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種智慧感測鞋墊的感測方法及其結構，旨在透過鞋墊內的六個壓力感測器、加速計及陀螺儀，精確偵測使用者的足部壓力變化、動作強度及姿態變化。系統通過微機器學習法及監督式學習法即時運算，對壓力、加速度及角速度訊號進行分類與異常偵測，並將判斷結果傳輸至外部設備以進行狀態顯示和即時提醒。結合卷積神經網路和時間循環神經網路進行足部踩踏模式識別，系統能夠提供詳細的足壓分佈及動作分析，提升步態監控及健康管理的精確度與實用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a sensing method and structure of an intelligent sensing insole. The smart Insole is designed to accurately detect changes in foot pressure, motion intensity, and posture variations of the user through six pressure sensors, an accelerometer, and a gyroscope embedded within the insole. The system uses micro-machine learning and supervised learning methods for real-time computation, classifying and detecting anomalies in pressure, acceleration, and angular velocity signals. The judgment results are transmitted to external devices for status display and immediate alerts. By integrating convolutional neural networks and recurrent neural networks for foot strike pattern recognition, the system provides detailed foot pressure distribution and motion analysis, enhancing the accuracy and practicality of gait monitoring and health management.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01,S02,S03,S04a,S04b,S05a,S05b:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="657px" img-content="tif" inline="yes" orientation="portrait" width="1039px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623681</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146210</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雅馬哈智能機器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAHA ROBOTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手井森介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEI, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉野浩章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋邦行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KUNIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鳥畑稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORIHATA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>接合裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">接合裝置包括：切口生成部，相對於自毛細管抽出的導線，使分離狀態的第一刀與第二刀自與抽出方向相交的方向向導線的方向移動，使第一刀與第二刀接近並與導線接觸，藉此在導線形成切口；以及引腳導線形成部，在導線的前端部接合於接合對象的狀態下，利用夾持器把持並牽引導線，藉此在切口處切斷導線而在接合對象形成引腳導線，第一刀與第二刀中的至少任一者具有錐形部，所述錐形部形成為彼此的間隔朝向導線的插入方向而變窄。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">121a:外刀</p>
        <p type="p">121b:內刀</p>
        <p type="p">121c、121d:錐形部</p>
        <p type="p">121e:刀部</p>
        <p type="p">121f:接觸面</p>
        <p type="p">122:支撐臂</p>
        <p type="p">300:導線</p>
        <p type="p">De、Dr:間隔</p>
        <p type="p">R:直徑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="493px" img-content="tif" inline="yes" orientation="portrait" width="685px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621586</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146211</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250602B">A43B3/44</main-classification>
        <further-classification edition="202201120250602B">A43B3/38</further-classification>
        <further-classification edition="202201120250602B">A43B3/48</further-classification>
        <further-classification edition="201901120250602B">G06F1/3203</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北市立大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF TAIPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUO WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅思凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, SZU KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅榮岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, JUNG YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姬兆平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, CHAO PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤濬哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUN CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何喜將</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>低功耗智慧鞋具系統及其節能運算方法</chinese-title>
        <english-title>SENSING METHOD AND STRUCTURE OF AN INTELLIGENT GAIT RECOGNITION INSOLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種低功耗智慧鞋具系統及其節能運算方法，包含感測模組、整合式處理與電源管理模組及整合的充電與數據同步模組。感測模組包含六個壓力感測器，分別配置於智慧鞋具的關鍵壓力點，實時監測足底壓力及行為狀態。整合式處理與電源管理模組具備低功耗微處理器，依據數據頻率動態調整運算模式與功耗。整合的充電與數據同步模組支援無線充電及低功耗藍牙數據同步，達成節能高效的運作，適用於個人步態監控及行為識別。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention discloses a low-power smart insole system and its energy-saving computation method. The system comprises a sensing module, an integrated processing and power management module, and an integrated charging and data synchronization module. The sensing module includes six pressure sensors positioned at key pressure points of the smart footwear to monitor foot pressure and behavior in real time. The integrated processing and power management module features a low-power microprocessor that dynamically adjusts the operation mode and power consumption based on data frequency. The integrated charging and data synchronization module supports wireless charging and low-power Bluetooth data synchronization, achieving energy-efficient operation, suitable for personal gait monitoring and behavior recognition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01-S03:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="587px" img-content="tif" inline="yes" orientation="portrait" width="841px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621765</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146212</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250711B">A63B69/36</main-classification>
        <further-classification edition="201501120250711B">A63B60/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北市立大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF TAIPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUO WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅思凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, SZU KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅榮岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, JUNG YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姬兆平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, CHAO PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤濬哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUN CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何喜將</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>高爾夫智慧訓練鞋墊的數據判斷方法及其結構</chinese-title>
        <english-title>DATA ANALYSIS METHOD AND STRUCTURE OF A SMART GOLF TRAINING INSOLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種高爾夫智慧訓練鞋墊的數據判斷方法及其結構，結合壓力感測器、慣性測量單元、微處理器及虛擬運動教練系統，旨在提升高爾夫運動的訓練效果。鞋墊內置六個壓力感測器，精確監測足部壓力分佈，並透過加速度計及陀螺儀收集揮桿動作的動態數據。微處理器運用卷積神經網路(CNN)和長短期記憶模型(LSTM)進行動作分析，識別不合宜動作模式，並生成動作辨識結果。虛擬運動教練系統接收分析數據，通過動作識別模組和技術建議生成模組，提供即時的技術矯正建議，幫助使用者修正錯誤動作。該系統實現了揮桿動作的精確監控、即時反饋與矯正，提升高爾夫訓練的科學性和有效性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a data analysis method and structure of a smart golf training insole. The smart golf training insole that combines pressure sensors, an inertial measurement unit (IMU), a microprocessor, and a virtual sports coaching system to enhance golf training effectiveness. The insole is equipped with six pressure sensors that accurately monitor foot pressure distribution and collects dynamic data of the swing motion through an accelerometer and gyroscope. The microprocessor uses Convolutional Neural Networks (CNN) and Long Short-Term Memory (LSTM) models to analyze motion, identify improper movement patterns, and generate motion recognition results. The virtual sports coaching system receives the analysis data and, through the motion recognition module and technical suggestion generation module, provides real-time correction advice to help users rectify errors in their movements. This system achieves precise monitoring, immediate feedback, and correction of swing actions, enhancing the scientific approach and effectiveness of golf training.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01-S06:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="667px" img-content="tif" inline="yes" orientation="portrait" width="954px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621588</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146213</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250630B">A43B17/00</main-classification>
        <further-classification edition="202201120250630B">A43B3/44</further-classification>
        <further-classification edition="202201120250630B">A43B3/48</further-classification>
        <further-classification edition="200601120250630B">A61B5/103</further-classification>
        <further-classification edition="200601120250630B">A61B5/11</further-classification>
        <further-classification edition="200601120250630B">G01L5/00</further-classification>
        <further-classification edition="200601120250630B">G01L1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺北市立大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF TAIPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KUO WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅思凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, SZU KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅榮岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, JUNG YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姬兆平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, CHAO PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤濬哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUN CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何喜將</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智慧步態識別鞋墊的感測方法及其結構</chinese-title>
        <english-title>SENSING METHOD AND STRUCTURE OF AN INTELLIGENT GAIT RECOGNITION INSOLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的智慧步態識別鞋墊通過優化感測器佈局和結合三軸加速度及陀螺儀感測器，全方位捕捉步態數據，提升數據的完整性和準確性。採用先進的數據融合技術和特徵提取方法，如加權平均、降噪算法及主成分分析技術，有效提高步態特徵的提取精度。結合神經網絡和監督式學習的步態識別算法，實現個性化的步態異常檢測及行為建議生成，增強系統的自我學習能力和適應性。並透過即時數據傳輸、視覺化圖表和語音提示，幫助使用者即時了解步態狀態並進行調整。該技術在步態識別的精確度、即時性和個性化建議方面具顯著優勢。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention diecloses a sensing method and structure of an intelligent gait recognition insole. The intelligent gait recognition insole optimizes sensor layout and integrates triaxial accelerometers and gyroscopes to capture gait data comprehensively, enhancing data completeness and accuracy. It employs advanced data fusion and feature extraction methods, such as weighted averaging, noise reduction algorithms, and principal component analysis, effectively improving the precision of gait feature extraction. By combining neural networks and supervised learning in gait recognition algorithms, it enables personalized gait anomaly detection and generates behavior suggestions, enhancing the system's self-learning ability and adaptability. Real-time data transmission, visual charts, and voice prompts help users understand their gait status and make adjustments promptly. This technology offers significant advantages in gait recognition accuracy, immediacy, and personalized recommendations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01,S02a,S02b,S02c,S02d,S03,S04,S05:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="708px" img-content="tif" inline="yes" orientation="portrait" width="894px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622017</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146227</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241216B">C04B28/08</main-classification>
        <further-classification edition="200601120241216B">C04B18/06</further-classification>
        <further-classification edition="200601120241216B">C04B18/14</further-classification>
        <further-classification edition="200601120241216B">C04B40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐建華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIEN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張名惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MING-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JUN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>混凝土及其製備方法</chinese-title>
        <english-title>CONCRETE AND METHOD FOR PREPARING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種混凝土及其製備方法。該混凝土包含：11wt%至20wt%的鈉(Na)、3wt%至6wt%的鎂(Mg)、7wt%至11wt%的鋁(Al)、15wt%至22wt%的矽(Si)、0.4wt%至0.7wt%的鉀(K)、以及49wt%至53wt%的鈣(Ca)，以該混凝土中的鈉、鎂、鋁、矽、鉀、及鈣的總重為基準，且該混凝土包含鈣鋁矽酸鹽化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A concrete and a method for preparing the same are provided. The concrete includes 11wt% to 20wt% of sodium, 3wt% to 6wt% of magnesium, 7wt% to 11wt% of aluminum, 15wt% to 22wt% of silicon, 0.4wt% to 0.7wt% of potassium, and 49wt% to 53wt% of calcium, based on the total weight of sodium, magnesium, aluminum, silicon, potassium, and calcium in the concrete. Additionally, the concrete includes a calcium aluminosilicate compound.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:混凝土的製備方法</p>
        <p type="p">12、14、16:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="647px" img-content="tif" inline="yes" orientation="portrait" width="721px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621913</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146228</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250220B">B60L7/24</main-classification>
        <further-classification edition="201001120250220B">B62M6/45</further-classification>
        <further-classification edition="201001120250220B">B62M6/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏佳騰動力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭正欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃睦豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宇紹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電動車的輔助電子煞車控制系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動車的輔助電子煞車控制系統，包含動力馬達、馬達控制器、把手位置感知器與控制器，馬達控制器連接動力馬達，控制器連接馬達控制器與把手位置感知器，控制器計算把手位置感知器所輸出之把手位置信號隨著時間變化的斜率；當控制器判斷斜率不小於零，控制器根據把手位置信號輸出第一驅動命令給馬達控制器，第一驅動命令對應正向馬達目標扭力，把手位置信號與正向馬達目標扭力的大小為正相關；當控制器判斷斜率小於零且電動車的車速大於零，控制器根據電動車的車速輸出第二驅動命令給馬達控制器，第二驅動命令對應反向馬達目標扭力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:動力馬達</p>
        <p type="p">20:馬達控制器</p>
        <p type="p">30:把手位置感知器</p>
        <p type="p">40:控制器</p>
        <p type="p">V:車速</p>
        <p type="p">I:驅動電流</p>
        <p type="p">θ:把手位置信號</p>
        <p type="p">S1:第一驅動命令</p>
        <p type="p">S2:第二驅動命令</p>
        <p type="p">TP:正向馬達目標扭力</p>
        <p type="p">TN:反向馬達目標扭力</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="548px" img-content="tif" inline="yes" orientation="portrait" width="879px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622426</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146229</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250108B">F24F11/58</main-classification>
        <further-classification edition="200601120250108B">F24F13/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫皓然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOU, HAO-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳錦銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智能聯網排風機</chinese-title>
        <english-title>SMART NETWORKED EXHAUST FAN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能聯網排風機，包含：主體，設置空氣導流路徑；導風機，安裝於主體內部空氣導流路徑中，導引排氣；主機驅動控制器，控制導風機之啟動及動態調整導風機的運作頻率與輸出風量；氣體偵測模組，與主機驅動控制器電性連接，氣體偵測模組偵測空污並輸出偵測數據，並透過物聯網通訊傳輸至聯網雲端運算服務裝置，聯網雲端運算服務裝置收集分析即時監控偵測數據，並根據偵測數據而智能選擇傳輸控制指令給氣體偵測模組接收，以控制主機驅動控制器調控導風機之啟閉及動態調整導風機的運作頻率與輸出風量，達到即時監測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart networked exhaust fan is disclosed and includes a main body, at least one blower, a host drive controller and at least one air detection module. The main body comprises an air diversion path. The blower is disposed in the air diversion path of the main body for guiding the air. The host drive controller controls the operation of the blower and dynamically adjust the operation frequency and the output air volume of the blower. The air detection module is electrically in connection with the host drive controller. The air detection module detects air pollution, outputs detection data to a networked cloud computing service device through internet of things. The networked cloud computing service device collects, analyzes, monitors the detection data in real-time, intelligently selects and transmit a control command to the air detection module according to the detection data, so as to control the host drive controller to adjust the operation of the blower and dynamically adjust the operation frequency and the output air volume of the blower to achieve real-time monitoring.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主體</p>
        <p type="p">11:吸風口</p>
        <p type="p">12:排風管</p>
        <p type="p">2:導風機</p>
        <p type="p">3:主機驅動控制器</p>
        <p type="p">4:氣體偵測模組</p>
        <p type="p">41:控制電路板</p>
        <p type="p">42:氣體偵測主體</p>
        <p type="p">5:聯網雲端運算服務裝置</p>
        <p type="p">6:過濾清淨組件</p>
        <p type="p">A:空氣導流路徑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="569px" img-content="tif" inline="yes" orientation="portrait" width="777px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622671</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146233</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250220B">G05D1/46</main-classification>
        <further-classification edition="201801120250220B">H04W4/30</further-classification>
        <further-classification edition="202401320250220B">G05D109/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉宜朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YI-PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡昆樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, KUN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於規劃路徑的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR PLANNING PATH</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於規劃路徑的系統及方法。所述方法包括以下步驟：利用對應於目標空域的基地台位置來獲得行動網路訊號強度，其中多個二維網格的每一者對應於行動網路訊號強度；利用行動網路訊號強度來生成對應於多個二維網格的成本地圖；以及利用成本地圖來建立目標空域的路徑規劃模型，並且利用多個二維網格以及路徑規劃模型來規劃出起始點以及終點之間的路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method for planning a path are provided. The method includes following steps: obtaining a mobile network signal strength using a base station position corresponding to a target airspace, wherein each of a plurality of two-dimensional grids corresponds to the mobile network signal strength; using the mobile network signal strength to generate a cost map corresponding to the plurality of two-dimensional grids; and using the cost map to establish a path planning model of the target airspace, and using the plurality of two-dimensional grids and the path planning model to plan the path between a starting point and an end point.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S81~S84:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10061.JPG" file="ed10061.JPG" height="588px" img-content="tif" inline="yes" orientation="portrait" width="907px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622665</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146236</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120241218B">G05D1/246</main-classification>
        <further-classification edition="202401320241218B">G05D109/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊世弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIH HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳駿偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊震偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHEN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳劭寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHAO HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王峻瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>路線修正方法及自主移動裝置</chinese-title>
        <english-title>ROUTE CORRECTION METHOD AND AUTONOMOUS MOBILE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種路線修正方法及自主移動裝置。決定擷取影像中的參考點對應的參考位置資訊，其中擷取影像是對環境中的參考點拍攝所得的。決定估測位置資訊與參考位置資訊之間的偏差資訊，其中估測位置資訊是基於自主移動裝置的運動資訊所估測的。依據偏差資訊修正自主移動裝置的移動路線資訊，其中移動路線資訊對應於估測位置資訊與定點位置資訊之間的路線。藉此，可提升定位的準確度及可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A route correction method and autonomous mobile device are provided. The reference position information corresponding to the reference point in the captured image is determined, where the captured image is taken from the reference point in the environment. The deviation information between the estimated position information and the reference position information is determined, where the estimated position information is estimated based on the motion information of the autonomous mobile device. The moving route information of the autonomous mobile device is corrected based on the deviation information, where the moving route information corresponds to the route between the estimated position information and the positioning-point position information. Therefore, the accuracy and reliability of positioning could be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210~S230:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="432px" img-content="tif" inline="yes" orientation="portrait" width="672px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622430</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146243</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260302B">F24H1/18</main-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竑新股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG SHIN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃哲峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅敬翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭獻聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古庭瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>純水加熱器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種純水加熱器，包括一加熱區、一儲水區及一電控區，加熱區包括複數互相串接的加熱器及溫度感知器，加熱器對從進水口流入的水進行加熱，每一溫度感知器分別設於加熱器之出水端，偵測水被加熱器加熱後之溫度值；儲水區包括一儲水桶槽，用以儲存被加熱的水，當出水口不出水時，水在加熱區及儲水區中內部循環；電控區接收溫度感知器所傳送的溫度值，並控制加熱器之運作，當加熱區及儲水區的水之溫度值到達一預設溫度值時，電控區控制加熱器停止加熱。本發明的純水加熱器可達到節能及節水的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">122:控制面板</p>
        <p type="p">131:第一加熱器</p>
        <p type="p">132:第二加熱器</p>
        <p type="p">133:第三加熱器</p>
        <p type="p">134:第四加熱器</p>
        <p type="p">135:第五加熱器</p>
        <p type="p">136:第六加熱器</p>
        <p type="p">151:第一溫度感知器</p>
        <p type="p">152:第二溫度感知器</p>
        <p type="p">153:第三溫度感知器</p>
        <p type="p">154:第四溫度感知器</p>
        <p type="p">155:第五溫度感知器</p>
        <p type="p">156:第六溫度感知器</p>
        <p type="p">162:儲水桶槽</p>
        <p type="p">1624:桶槽進水管</p>
        <p type="p">164:幫浦</p>
        <p type="p">166:桶槽溫度感知器</p>
        <p type="p">167:出水管</p>
        <p type="p">168:逆止閥</p>
        <p type="p">169:循環管</p>
        <p type="p">18:出水口</p>
        <p type="p">20:進水口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="1028px" img-content="tif" inline="yes" orientation="portrait" width="678px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621857</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146247</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250224B">B25B33/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>興富康工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIFUKANG INDUSTRIAL.CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃上源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHANG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建平</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>牽引工具</chinese-title>
        <english-title>TOWING TOOLS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種牽引工具，供用於一控制臂，該控制臂之一側可沿一擺動方向擺動地樞設於一車身，該控制臂之另側設有一和尚頭，該和尚頭可分離地組接於一車輪轂總成，該牽引工具包括：一主體、至少一組接孔及二抵靠件。該主體包含有二頭部與一柄部，該二頭部分別橫向地凸伸於該柄部之相對二側；該至少一組接孔設於該柄部以供一手工具插接；該二抵靠件分別橫向地凸伸於該二頭部，該二抵靠件供夾靠該控制臂位於該擺動方向上之相對二側；其中，當該二抵靠件夾靠該控制臂後，使用者可透過該手工具施力予該主體，以帶動該控制臂沿該擺動方向移動，進而令該和尚頭相對該車輪轂總成移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a traction tool for use with a control arm. One side of the control arm can be pivoted to a vehicle body in a swing direction. The other side of the control arm is provided with a ball joint, which is detachably assembled to a wheel hub assembly. The traction tool includes: a main body, at least one set of connecting holes and two supporting parts. The main body includes two heads and a handle, and the two heads respectively protrude laterally from opposite sides of the handle. The at least one set of sockets is provided on the handle for insertion of a hand tool. The two resisting pieces protrude laterally from the two heads respectively, and are used to clamp the control arm on two opposite sides in the swing direction. When the two resisting members are clamped against the control arm, the user can apply force to the main body through the hand tool to drive the control arm to move in the swing direction, thereby causing the ball joint to move relative to the wheel hub assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主體</p>
        <p type="p">2:組接孔</p>
        <p type="p">3:抵靠件</p>
        <p type="p">4:固定膠體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="824px" img-content="tif" inline="yes" orientation="portrait" width="711px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623076</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146250</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120241230B">H01M8/24</main-classification>
        <further-classification edition="201601120241230B">H01M8/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳賢謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIEN-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嵩駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SUNG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴建銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡麗端</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, LI-DUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>燃料電池電堆之固鎖裝置</chinese-title>
        <english-title>CLAMPING APPARARUS FOR FUEL CELL STACK</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種燃料電池電堆之固鎖裝置，包含至少一第一壓制件、至少一第二壓制件、至少一第一扣件、至少一第二扣件與複數連接組件；第一壓制件與第一扣件之間、第一壓制與第二扣件之間、第二壓制件與第一扣件之間、第二壓制件與第二扣件之間可分別形成第一連接通道、第二連接通道、第三連接通道與第四連接通道，分別提供設置一連接組件連結鎖固，對燃料電池電堆相對之頂面與底面、相對之第一面與第二面產生夾持束緊作用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A clamping apparatus for fuel cell stack is disclosed, which includes at least one first pressing element, at least one second pressing element, at least one first fastener, at least one second fastener and a plurality of connecting assemblies. A first connecting path, a second connecting path, a third connecting path and a fourth connecting path is formed individually between the first pressing element and the first fastener, the first pressing element and the second fastener, the second pressing element and the first fastener, the second pressing element and the second fastener. The first connecting path, the second connecting path, the third connecting path and the fourth connecting path are installed in one connecting assembly respectively for tightening clamping around the opposite top surface and bottom surface, and the opposite first surface and second surface of the fuel cell stack.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:固鎖裝置</p>
        <p type="p">10:第一壓制件</p>
        <p type="p">20:第二壓制件</p>
        <p type="p">30:第一扣件</p>
        <p type="p">40:第二扣件</p>
        <p type="p">50:連接組件</p>
        <p type="p">60:彈性件</p>
        <p type="p">90:燃料電池電堆</p>
        <p type="p">91:頂面</p>
        <p type="p">92:底面</p>
        <p type="p">93:第一面</p>
        <p type="p">94:第二面</p>
        <p type="p">X:X軸</p>
        <p type="p">Y:Y軸</p>
        <p type="p">Z:Z軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="746px" img-content="tif" inline="yes" orientation="portrait" width="754px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623245</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146253</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">H04N5/58</main-classification>
        <further-classification edition="200601120250425B">G09G5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>緯創資通股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WISTRON CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許䕒蔆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIA-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>螢幕亮度調整方法和裝置</chinese-title>
        <english-title>SCREEN BRIGHTNESS ADJUSTMENT METHOD AND DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種螢幕亮度調整方法。螢幕亮度調整方法可適用一螢幕亮度調整裝置。螢幕亮度調整方法可包括下步驟。藉由螢幕亮度調整裝置之一影像擷取裝置，取得一人臉影像。藉由螢幕亮度調整裝置之一處理器，根據人臉影像，取得一螢幕角度。藉由螢幕亮度調整裝置之一環境光感射器，取得一環境亮度值。藉由處理器，根據螢幕角度，取得一補償參數。藉由處理器，根據環境亮度值和補償參數，取得一實際環境亮度值。藉由處理器，根據實際環境亮度值，調整螢幕亮度調整裝置之一顯示裝置之一亮度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A screen brightness adjustment method is provided in the invention. The screen brightness adjustment method may be applied to a screen brightness adjustment device. The screen brightness adjustment method may comprise the following steps. An image capturing device of the screen brightness adjustment device may be configured to obtain a face image. A processor of the screen brightness adjustment device may be configured to obtain a screen angle according to the face image. An ambient light sensor (ALS) of the screen brightness adjustment device may be configured to obtain an environment brightness value. The processor may be configured to obtain a compensation parameter according to the screen angle. The processor may be configured to obtain a real environment brightness value according to the environment brightness value and the compensation parameter. The processor may be configured to adjust the brightness of a display device of the screen brightness adjustment device according to the real environment brightness value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:流程圖</p>
        <p type="p">S710~S750:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10030.JPG" file="ed10030.JPG" height="873px" img-content="tif" inline="yes" orientation="portrait" width="681px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622758</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146260</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F13/38</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神雲科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITAC COMPUTING TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾彥綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YEN-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林冠丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KUAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉名桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MING-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多處理器系統的連接埠設定方法</chinese-title>
        <english-title>METHOD FOR SETTING PORT OF MULTI - PROCESSOR SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多處理器系統的連接埠設定方法，適用於將該多處理器系統的每一中央處理器的一目標G連接埠設定為xGMI或PCIe，由一主中央處理器來實施，該方法包含以下步驟：(A)根據一主連結器的一主目標接腳的邏輯位準，判斷該主連結器是否與一電連接一從中央處理器的從連結器電連接；(B)當判斷出該主連結器與該從連結器電連接時，設定該主中央處理器的一主目標G連接埠，及該從中央處理器的一從目標G連接埠為xGMI；及(C)當判斷出該主連結器不與該從連結器電連接時，設定該主目標G連接埠及該從目標G連接埠為PCIe。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for setting port of multi - processor system adapted to set a target G port of each CPU of the multi - processor system to xGMI or PCIe, being by a master CPU, the method comprising the steps of: (A) the master CPU determining whether a master connector is electrically connected to a slave connector of a slave CPU according to a logic level of a master target pin of the master connector;(B) when the master CPU determines that the master connector is electrically connected to the slave connector, setting a master target G port of the master CPU and a slave target G port of the slave CPU to be xGMI; and(C) when the master CPU determines that the master connector is not electrically connected to the slave connector, setting the master target G port and the slave target G port to be PCIe.</p>
      </isu-abst>
      <representative-img>
        <p type="p">31~33:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="776px" img-content="tif" inline="yes" orientation="portrait" width="701px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622295</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146261</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120250501B">C25B11/04</main-classification>
        <further-classification edition="202301120250501B">C02F1/58</further-classification>
        <further-classification edition="200601320250501B">C02F101/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明志科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MING CHI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴怡廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, DA WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>複合電極</chinese-title>
        <english-title>COMPOSITE ELECTRODE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種複合電極適用於液體中吸附及脫附磷酸鹽且包含載體及複合層結構。複合層結構設置於載體並包括相互堆疊的層狀雙氫氧化物層單元及偶氮苯層單元。層狀雙氫氧化物層單元設置於載體的表面。偶氮苯層單元具有偶氮苯組分。偶氮苯層單元經照射紫外光，複合層結構呈吸附狀態，且偶氮苯組分在吸附狀態的結構為順式結構。偶氮苯層單元經照射可見光，複合層結構呈脫附狀態，且偶氮苯組分在脫附狀態的結構為反式結構。本發明複合電極能透過施加正負電壓並照射不同光源於液體中吸附及脫附磷酸鹽，而達到好的磷酸鹽吸附及脫附效果且處理效率佳。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composite electrode is suitable for adsorbing and desorbing phosphate in liquid and comprises a carrier and a composite layer structure. Said composite layer structure sets in said carrier and includes a layered double hydroxide layer unit and an azobenzene layer unit stacked on top of each other. Said layered double hydroxide layer unit is placed on the surface of said carrier. Said azobenzene layer unit has an azobenzene component. Said azobenzene layer unit is irradiated with ultraviolet light, said composite layer structure is in an adsorbed state, and the structure of said azobenzene component in said adsorbed state is a cis structure. Said azobenzene layer unit is irradiated with visible light, said composite layer structure is in a desorbed state, and the structure of said azobenzene component in said adsorbed state is a trans structure. Said composite electrode can absorb and desorb phosphate in liquid by applying positive and negative voltages and irradiating different light sources, thereby achieving good phosphate adsorption and desorption effects and good processing efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:複合層結構</p>
        <p type="p">21:層狀雙氫氧化物層單元</p>
        <p type="p">211:層狀雙氫氧化物層</p>
        <p type="p">22:偶氮苯層單元</p>
        <p type="p">221:偶氮苯層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="557px" img-content="tif" inline="yes" orientation="portrait" width="596px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621803</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146262</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250314B">B08B3/04</main-classification>
        <further-classification edition="200601120250314B">B08B13/00</further-classification>
        <further-classification edition="200601120250314B">F26B3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣矽科宏晟科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐桂樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>接頭清洗裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種接頭清洗裝置，其能承載一接頭，並能以一液體清洗接頭，以一氣體乾燥接頭。接頭清洗裝置具有一本體、一擋板、一液體管道、一氣體管道及一排液孔。本體內形成一清洗空間。擋板設置於本體中並位於清洗空間上方。擋板具有一通孔連通清洗空間，並能承載接頭。液體管道環繞設置於本體並能流通液體。液體管道具有複數出液口，出液口形成於本體的壁面並連通清洗空間。氣體管道環繞設置於本體並能流通氣體。氣體管道具有複數出氣口，出氣口形成於本體的壁面並連通清洗空間。出液口及等出氣口朝向接頭。排液孔形成於本體的底部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:接頭</p>
        <p type="p">10:本體</p>
        <p type="p">30:液體管道</p>
        <p type="p">31:進液口</p>
        <p type="p">40:氣體管道</p>
        <p type="p">41:進氣口</p>
        <p type="p">70:偵測管道</p>
        <p type="p">80:控制裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="869px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621749</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146263</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250501B">A61L27/02</main-classification>
        <further-classification edition="200601120250501B">A61L27/14</further-classification>
        <further-classification edition="200601120250501B">A61L27/30</further-classification>
        <further-classification edition="200601120250501B">A61L27/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立中山大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL SUN YAT-SEN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, ZHI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瓏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>藤壺骨移植物、及其製備方法和其用途</chinese-title>
        <english-title>BARNACLE BONE GRAFT MATERIAL, PREPARATION METHOD THEREOF AND USE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種藤壺骨移植物的製備方法，其包含將藤壺的外骨骼進行粉碎、去除有機物質、經300至600℃進行燒結並滅菌後，以得到該藤壺骨移植物。本發明另提供一種用上述製備方法所得到的藤壺骨移植物，用於骨缺損的治療上。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="333px" img-content="tif" inline="yes" orientation="portrait" width="683px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623342</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146264</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250224B">H05K7/20</main-classification>
        <further-classification edition="200601120250224B">F28F3/02</further-classification>
        <further-classification edition="201301120250224B">H04B10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>至良科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALL BEST PRECISION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊策航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>光收發模組殼體及光收發模組</chinese-title>
        <english-title>OPTICAL TRANSCEIVER MODULE HOUSING AND OPTICAL TRANSCEIVER MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光收發模組殼體，包含一殼本體及一散熱件。該殼本體具有一電子器件容置空間及連通該電子器件容置空間之一開口。該散熱件可卸地組裝至該殼本體。該散熱件包含一導熱基板及固定於該導熱基板上之至少一導熱鰭片，該導熱基板容置於該電子器件容置空間內，該至少一導熱鰭片自該開口露出。一種光收發模組，包含一電路板總成及前述的光收發模組殼體。該電路板總成具有一板緣連接器。該電路板總成容置於該電子器件容置空間並伸出該電子器件容置空間以露出該板緣連接器，該導熱基板與該電路板總成熱耦合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical transceiver module housing includes a housing body and a heat sink. The housing body has an electronic component accommodating space and an opening communicated with the electronic component accommodating space. The heat sink is detachably assembled to the housing body. The heat sink includes a thermally conductive plate and at least one thermally conductive fin fixed on the thermally conductive plate. The thermally conductive plate is accommodated in the electronic component accommodating space. The at least one thermally conductive fin is exposed from the opening. An Optical transceiver module includes a circuit board assembly and the above optical transceiver module housing. The circuit board assembly has a board edge connector. The circuit board assembly is accommodated in the electronic component accommodating space and extends out of the electronic device accommodating space to expose the board edge connector. The thermally conductive plate is thermally coupled with the circuit board assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光收發模組</p>
        <p type="p">12:電路板總成</p>
        <p type="p">120:電路板</p>
        <p type="p">122:板緣連接器</p>
        <p type="p">124,126:電子元件</p>
        <p type="p">14a:長度方向</p>
        <p type="p">1422:上蓋</p>
        <p type="p">1422a:開口</p>
        <p type="p">1422c:垂直板</p>
        <p type="p">1424:下蓋</p>
        <p type="p">1424a:開口</p>
        <p type="p">144:上散熱件</p>
        <p type="p">1442:導熱基板</p>
        <p type="p">1444:導熱鰭片</p>
        <p type="p">1446:蓋板</p>
        <p type="p">146:下散熱件</p>
        <p type="p">1462:導熱基板</p>
        <p type="p">1464:導熱鰭片</p>
        <p type="p">148,150:導熱材料</p>
        <p type="p">Dv:垂直方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="899px" img-content="tif" inline="yes" orientation="portrait" width="692px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622212</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146266</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C09K5/14</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝一化工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINY CHEMICAL INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張凱捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KAI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫啓發</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHI-FA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>導熱用複合材料的製法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種導熱用複合材料的製法，包含：(a)提供多張石墨烯膜，每一石墨烯膜是藉由將包含石墨烯粉末、液態環氧樹脂及固化劑的原料組分填充於模具中凝固後脫膜而得，以石墨烯粉末及液態環氧樹脂的總量為100重量份計，液態環氧樹脂的用量占3~5重量份；(b)將石墨烯膜沿一方向排列堆疊後，在10~12kg/cm        &lt;sup&gt;2&lt;/sup&gt;的壓力範圍下進行熱壓合，使石墨烯膜彼此接合形成一石墨烯積層體；(c)將石墨烯積層體沿該方向進行裁切，得到一石墨烯片；及(d)於石墨烯片的裁切面濺鍍銅，製得一導熱用複合材料。透過(a)至(d)，製作出結構穩固且具備良好垂直導熱係數及良好耐熱性的導熱用複合材料。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">X:方向</p>
        <p type="p">Y:裁切面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="774px" img-content="tif" inline="yes" orientation="portrait" width="592px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622186</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146277</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250217B">C09D1/00</main-classification>
        <further-classification edition="201401120250217B">C09D11/50</further-classification>
        <further-classification edition="201401120250217B">C09D11/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手心志業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAND-HEART DESIGN LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓訓群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUO, HSUN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>隱形圖樣的印刷方法及其印刷品</chinese-title>
        <english-title>PRINTING METHOD FOR INVISIBLE PATTERNS AND PRINTED PRODUCTS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種隱形圖樣的印刷方法及其印刷品。該隱形圖樣的印刷方法，包含：提供一紙質基材，該紙質基材無含有螢光物質；提供一隱形螢光油墨；將該隱形螢光油墨網版點狀地附著至該紙質基材上。藉此，本創作具有隱藏訊息、防偽功能及用於藝術表現等有利功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed printing method for invisible patterns includes the following steps: providing a paper-based substrate that does not contain fluorescent substances; providing an invisible fluorescent ink; and screen-printing the invisible fluorescent ink onto the paper-based substrate in a dot matrix pattern. This invention offers advantageous effects such as hidden information, anti-counterfeiting functionality, and applicability in artistic expression.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(S10~S42):步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="948px" img-content="tif" inline="yes" orientation="portrait" width="817px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622929</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146278</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250224B">G09F7/02</main-classification>
        <further-classification edition="200601120250224B">G09F7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手心志業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAND-HEART DESIGN LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>標示牌</chinese-title>
        <english-title>SIGNBOARD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種標示牌，包含：一構圖板，具一孔洞區、一構圖面及一線頭放置面，該孔洞區具數個孔洞；數個線繩，用以穿線於該些孔洞並成形圖樣於該構圖面。據此，本創作可供線繩穿線後形成圖樣並傳遞訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosed signboard comprises: a pattern board with a perforated area, a pattern surface, and a cord-end placement surface, where the perforated area includes multiple holes; and multiple cords for threading through these holes to form patterns on the pattern surface. This disclosure allows the threading of cords to create patterns and convey messages.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(10):構圖板</p>
        <p type="p">(11):孔洞區</p>
        <p type="p">(111):孔洞</p>
        <p type="p">(12):構圖面</p>
        <p type="p">(20):線繩</p>
        <p type="p">(40):結合件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="787px" img-content="tif" inline="yes" orientation="portrait" width="589px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622847</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146279</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250321B">G06Q30/0203</main-classification>
        <further-classification edition="202301120250321B">G06Q30/0282</further-classification>
        <further-classification edition="200601120250321B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>手心志業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAND-HEART DESIGN LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>ＡＩ導入品牌策略洞察系統</chinese-title>
        <english-title>SYSTEM FOR AI-INTEGRATED BRAND STRATEGY INSIGHTS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種AI導入品牌策略洞察方法及其系統。該AI導入品牌策略洞察方法包含：一訪談摘要洞察步驟；一市場趨勢洞察步驟；及一品牌策略洞察步驟，依據該訪談摘要洞察步驟之資訊、及該品牌策略洞察步驟之資訊，與客戶進行品牌策略會議。藉此，本創作能夠不僅節省品牌洞察時間，更能夠提高品牌洞察與設計的品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and system for AI-integrated brand strategy insights are disclosed. The method comprises: an interview summary insight step; a brand strategy insight step; and a brand strategy meeting step. The brand strategy meeting is conducted with the client based on the information obtained from the interview summary insight step and the brand strategy insight step. This invention not only saves time in gaining brand insights but also enhances the quality of brand insights and design.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S31:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="989px" img-content="tif" inline="yes" orientation="portrait" width="598px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622531</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146283</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">G01R33/12</main-classification>
        <further-classification edition="202501120250425B">H10F77/12</further-classification>
        <further-classification edition="202501120250425B">H10F77/14</further-classification>
        <further-classification edition="202501120250425B">H10D84/40</further-classification>
        <further-classification edition="202501120250425B">H10D30/69</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣師範大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN NORMAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美國加州理工學院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALIFORNIA INSTITUTE OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, YANN-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸亭樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　乃裳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, NAI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝篤行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, DUXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於單層半導體過渡金屬二硫化物的場效電晶體之巨大鐵電與光電響應</chinese-title>
        <english-title>GIANT FERROELECTRIC AND OPTOELECTRONIC RESPONSES OF FIELD EFFECT TRANSISTORS BASED ON MONOLAYER SEMICONDUCTING TRANSITION METAL DICHALCOGENIDES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種場效電晶體，包括：基板；單晶半導體過渡金屬二硫化物(TMD)的單層，位於基板上；源極觸點及汲極觸點，通向應變單層；及閘極觸點，位於基板上；其中相對於源極觸點向閘極觸點施加的閘極電壓調制單層在應變時的鐵電響應，及源極觸點與汲極觸點之間穿過單層的電流；並且其中基板是剛性的，並且在響應於外部磁場而抵靠剛性基板發生應變時，單層經歷不對稱晶格膨脹，或者基板是誘導單層的不對稱晶格膨脹的應變工程化基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A field effect transistor including a substrate; a monolayer of a single crystal semiconducting transition metal dichalcogenide (TMD) on the substrate; a source contact and a drain contact to the strained monolayer; and a gate contact on the substrate; wherein the a gate voltage applied to the gate contact with respect to the source contact modulates a ferroelectric response of the monolayer when strained and a current through the monolayer between the source contact and the drain contact; and wherein the substrate is rigid and the monolayer experiences asymmetric lattice expansion when strained against the rigid substrate in response to an external magnetic field or the substrate is a strain engineered substrate inducing asymmetric lattice expansion of the monolayer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102:基板</p>
        <p type="p">104:單晶半導體過渡金屬二硫化物</p>
        <p type="p">106:源極觸點</p>
        <p type="p">108:汲極觸點</p>
        <p type="p">110:閘極觸點</p>
        <p type="p">200:系統</p>
        <p type="p">202:電腦系統/控制器/電路</p>
        <p type="p">204:磁場源</p>
        <p type="p">206:低溫系統/低溫冷凍冷卻系統</p>
        <p type="p">208:EM場源/源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10059.JPG" file="ed10059.JPG" height="682px" img-content="tif" inline="yes" orientation="portrait" width="1038px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622924</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146288</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250321B">G09B5/08</main-classification>
        <further-classification edition="201301120250321B">G06F3/048</further-classification>
        <further-classification edition="202001120250321B">G06F30/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林庭緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TING WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林庭緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TING WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳季宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JI HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭尚蓁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHANG CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>數位電路與邏輯設計的教學系統和教學電腦程式產品</chinese-title>
        <english-title>INSTRUCTIONAL SYSTEM AND COMPUTER PROGRAM PRODUCT FOR DIGITAL CIRCUIT AND LOGIC DESIGN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數位電路與邏輯設計的教學系統透過一使用者介面顯示不同虛擬元件的技術說明給使用者參考，並且允許使用者在使用者介面上選擇數個虛擬元件並設定這些虛擬元件之間的接線關係而建立一虛擬數位電路，同時使用一硬體描述語言，根據接線關係、一連線表和被選擇的各虛擬電子元件的運作規則，建立映射虛擬數位電路的一電路模擬模型，以便允許使用者在使用者介面上操控虛擬數位電路中的虛擬元件，從而根據電路模擬模型顯示虛擬數位電路的運作。藉此讓使用者學習數位電路與邏輯設計的知識並體驗實作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An instructional system for digital circuit and logic design shows technical descriptions of different virtual elements on a user interface for a user to reference, and establishes a circuit simulation model by a HDL according to a wiring relationship of virtual elements, a netlist, and operational rules of the virtual elements as the user selects and wires the virtual elements together on the user interface to establish a virtual digital circuit mapping the circuit simulation model, so as to show the operation of the virtual digital circuit on the user interface when the user operates virtual element(s) of the virtual digital circuit on the user interface. Therefore, the user can learn the knowledge of digital circuit and logic design and experience the related practice.</p>
      </isu-abst>
      <representative-img>
        <p type="p">22:使用者介面</p>
        <p type="p">C:虛擬數位電路</p>
        <p type="p">S:模擬啟動鍵</p>
        <p type="p">V1:虛擬輸入元件</p>
        <p type="p">V2:虛擬輸入元件</p>
        <p type="p">V3:虛擬輸出元件</p>
        <p type="p">V5:虛擬邏輯閘</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="749px" img-content="tif" inline="yes" orientation="portrait" width="1044px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622357</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146299</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250317B">F03G3/00</main-classification>
        <further-classification edition="200601120250317B">F03B17/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳素月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳素月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>物體懸浮重力發電</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作係提供一種，物體懸浮重力發電，構置一個消耗1度電能發出2度或2度以上的電之裝置，具有一個及一個以上之直立式水槽，該水槽分上層與下層二層，上下層中間設有兩邊開合一道閘門，上層儲滿水閘門關閉著。下層空置著，下層對外亦設有一道閘門，下層又設有一條進水管。另設有一個及一個以上之物體，物體採中空設計，中間空氣是周邊密閉的，因此，物體體積可以放大，當物體體積設計成等於水的50公噸時，物體體積的重量只設計用25公噸，物體密度就會比水小，浮力就會大於壓力；</p>
        <p type="p">操作次序，將物體推入下層定位，對外閘門關閉，兩邊卡栓卡入凹槽，下層水管快速補滿下層空間，上下層滿水位，下層空氣已排出。將上下層中間之閘門開啟，開啟兩邊卡栓讓物體懸浮上升至上層最高水面停止，用吊臂將物體吊掛在發電機。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:水槽本體</p>
        <p type="p">2:水槽上層的水</p>
        <p type="p">3:上層水槽與下層水槽中間之雙邊閘門</p>
        <p type="p">4:下層水槽對外閘門</p>
        <p type="p">5:下層水槽兩邊設卡栓</p>
        <p type="p">6:下層水槽設有一條排氣管</p>
        <p type="p">7:下層水槽設有一條快速補水管</p>
        <p type="p">8:下層空氣</p>
        <p type="p">9:下層地上設有一隻推桿</p>
        <p type="p">10:物體懸浮路線</p>
        <p type="p">14:最上方吊掛物體之旋轉吊臂</p>
        <p type="p">15:高塔吊掛方式發電機</p>
        <p type="p">19:最下層設於地下，把物體緩緩往上推之油壓機</p>
        <p type="p">20:物體吊掛在發電機，重力轉動發電機路線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="802px" img-content="tif" inline="yes" orientation="portrait" width="697px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623405</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146301</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250219B">H10D62/10</main-classification>
        <further-classification edition="202501120250219B">H10D62/60</further-classification>
        <further-classification edition="200601120250219B">G01K7/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥棠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YEN-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，包括：基底，包括具有第一摻雜類型的第一摻雜區，以及具有與所述第一摻雜類型不同的第二摻雜類型的第二摻雜區；介電層，位於所述第一摻雜區之上；第一金屬層，位於所述介電層之上；以及第二金屬層，位於所述第二摻雜區之上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a semiconductor device, including: a semiconductor substrate, including a first doping region having a first doping type, and a second doping region having a second doping type different from the first doping type; a dielectric layer being disposed above the first doped region; a first metal layer being disposed above the dielectric layer; and a second metal layer being disposed above the second doped region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:基底</p>
        <p type="p">112:第一摻雜區</p>
        <p type="p">114:第二摻雜區</p>
        <p type="p">114S、120S、140S:側表面</p>
        <p type="p">120:介電層</p>
        <p type="p">130:第一金屬層</p>
        <p type="p">140:第二金屬層</p>
        <p type="p">150:絕緣層</p>
        <p type="p">D1、D2:距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="531px" img-content="tif" inline="yes" orientation="portrait" width="845px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623179</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146302</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">H02P3/06</main-classification>
        <further-classification edition="200601120241231B">G05B19/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上銀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃彥舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宏亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱謙成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有緊急處置的驅動設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的具有緊急處置的驅動設備具有一馬達模組、一緊急開關及一處理裝置。馬達模組包括一電源輸入端、一控制裝置、一驅動裝置及一馬達。處理裝置連接馬達模組及緊急開關，且具有一電源延遲時間及一控制延遲時間。在緊急開關閉觸發時，處理裝置被觸發來執行一緊停流程。緊停流程包括計數電源延遲時間及控制延遲時間，在控制延遲時間計數過程中，輸出一減速信號至控制裝置，以使驅動裝置驅動馬達減速運轉。隨後，在控制延遲時間計數結束時，輸出一關閉信號，以關閉驅動裝置。在電源延遲時間計數結束時，停止一電源供電至電源輸入端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:驅動設備</p>
        <p type="p">10:馬達模組</p>
        <p type="p">11:電源輸入端</p>
        <p type="p">13:控制裝置</p>
        <p type="p">15:驅動裝置</p>
        <p type="p">17:馬達</p>
        <p type="p">20:緊急開關</p>
        <p type="p">30:處理裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="478px" img-content="tif" inline="yes" orientation="portrait" width="750px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623191</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146303</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03F1/30</main-classification>
        <further-classification edition="200601120250303B">H03F3/189</further-classification>
        <further-classification edition="200601120250303B">H03F3/20</further-classification>
        <further-classification edition="200601120250303B">H04B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王一峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-FONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>偏壓補償電路</chinese-title>
        <english-title>BIAS COMPENSATION CIRCUIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">偏壓補償電路接收偵測電路產生的偵測訊號，偵測電路用以偵測放大器電路中的射頻訊號。偏壓補償電路包含轉換電路及偏壓電路。轉換電路耦接至偵測電路，用以調整偵測訊號的相位或振幅以產生注入訊號。注入訊號為電流訊號。偏壓電路耦接至轉換電路，用以依據注入訊號產生偏壓訊號至放大器電路。偏壓訊號隨著偵測訊號變動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bias compensation circuit receives a detection signal from a detection circuit. The detection circuit is used to detect a radio frequency signal from an amplifier circuit. The bias compensation circuit includes a conversion circuit and a bias circuit. The bias circuit is coupled to the detection circuit to adjust a phase or an amplitude of the detection signal to generate an injection signal. The injection signal is a current signal. The bias circuit is coupled to the conversion circuit to generate a bias signal to the amplifier circuit according to the injection signal. The bias signal varies with the detection signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">16:轉換電路</p>
        <p type="p">160:相位偏移器</p>
        <p type="p">162:振幅控制器</p>
        <p type="p">18:偏壓電路</p>
        <p type="p">Cbf2,Cps,Cf:電容</p>
        <p type="p">I2:偵測電流</p>
        <p type="p">I3:注入訊號</p>
        <p type="p">Sbias:偏壓訊號</p>
        <p type="p">Nac:偏壓控制節點</p>
        <p type="p">T1至T5:電晶體</p>
        <p type="p">PDOUT:功率訊號</p>
        <p type="p">R1至R6,Rf:電阻</p>
        <p type="p">Rvi1及Rvi2:可變電阻</p>
        <p type="p">Vc:電壓</p>
        <p type="p">VPHASE:相位調整電壓</p>
        <p type="p">Vamp:振幅調整電壓</p>
        <p type="p">VR,VREF,VCCB:參考電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="706px" img-content="tif" inline="yes" orientation="portrait" width="891px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621865</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146311</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250218B">B25H3/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立晏企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIH YANN INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖伯霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, PO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃世瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>工具盤</chinese-title>
        <english-title>TOOL STORAGE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種工具盤，包括：多個承盤；及一連接組件，該連接組件連接該多個承盤使得該多個承盤間隔設置，該連接組件包括多個掛設部，各該掛設部供掛設一物件。藉此，該多個承盤可供存放不同大小、種類之零件或工具，並且該多個掛設部可供另外掛置具有可供掛設的結構之各種零件或工具，具有極大的收納容量及多元收納方式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tool storage device is provided, wherein the tool storage device includes: a plurality of trays; and a connection assembly, the connection assembly connecting the plurality of trays so that the plurality of trays are arranged in intervals, the connection assembly including a plurality of hanging members, each of the plurality of hanging members being configured to hang at least one object. Thereby, the plurality of trays can be used to store parts or tools of different sizes and types, and the plurality of hanging members can be used to additionally hang various parts or tools with structures for hanging, which has huge storage capacity and provides various ways for storage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工具盤</p>
        <p type="p">11:承盤</p>
        <p type="p">11a:第一承盤</p>
        <p type="p">11b:第二承盤</p>
        <p type="p">11c:第三承盤</p>
        <p type="p">12a:掛設部</p>
        <p type="p">12c:外柱</p>
        <p type="p">12c1:第一外柱</p>
        <p type="p">12c2:第二外柱</p>
        <p type="p">20:輪座</p>
        <p type="p">21:滾輪</p>
        <p type="p">40:握把</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="888px" img-content="tif" inline="yes" orientation="portrait" width="637px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623367</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146314</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250203B">H10B63/00</main-classification>
        <further-classification edition="202301120250203B">H10N70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡沅南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YUAN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡美慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MEI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐健富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, JIAN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江建志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>高透光電阻式記憶體結構</chinese-title>
        <english-title>HIGH-OPTICAL-TRANSMITTANCE RESISTIVE MEMORY STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種高透光電阻式記憶體結構，其包含一可撓性基板層、一下電極層、一奈米電阻層及一上電極層。可撓性基板層包含一高分子軟性材料及摻雜於高分子軟性材料的一高透光陶瓷材料；下電極層層疊於可撓性基板層上，下電極層包含高分子軟性材料及摻雜於高分子軟性材料的一氧化金屬奈米線材料；奈米電阻層層疊於下電極層上，奈米電阻層包含一聚醯亞胺材料以及摻雜於聚醯亞胺材料的一奈米材料；上電極層層疊於奈米電阻層上，上電極層包含高分子軟性材料及摻雜於高分子軟性材料的氧化金屬奈米線材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A high-optical-transmittance resistive memory structure, which includes a flexible substrate layer, a bottom electrode layer, a nanoscale resistive layer, and a top electrode layer.The flexible substrate layer comprises a polymer-based flexible material and a highly transparent ceramic material doped into the polymer-based flexible material. The bottom electrode layer is stacked on the flexible substrate layer and includes a polymer-based flexible material doped with metal oxide nanowire material.The nanoscale resistive layer is stacked on the bottom electrode layer and contains a polyimide material doped with nanoscale material. The top electrode layer is stacked on the nanoscale resistive layer and comprises a polymer-based flexible material doped with metal oxide nanowire material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:高透光電阻式記憶體結構</p>
        <p type="p">10:可撓性基板層</p>
        <p type="p">20:下電極層</p>
        <p type="p">30:奈米電阻層</p>
        <p type="p">40:上電極層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="820px" img-content="tif" inline="yes" orientation="portrait" width="686px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623368</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146315</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250203B">H10B63/00</main-classification>
        <further-classification edition="202301120250203B">H10N70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡美慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MEI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡沅南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YUAN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭冠珷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, GUAN-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>低透光電阻式記憶體結構</chinese-title>
        <english-title>LOW-OPTICAL-TRANSMITTANCE RESISTIVE MEMORY STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種低透光電阻式記憶體結構，其包含一可撓性基板層、一下電極層、一可調式電阻層及一上電極層。可撓性基板層包含一高分子軟性材料及摻雜於高分子軟性材料的一深色陶瓷材料；下電極層層疊於可撓性基板層上，下電極層包含高分子軟性材料及摻雜於高分子軟性材料的一奈米金屬線材料或一石墨材料；可調式電阻層層疊於下電極層上，可調式電阻層包含一可調式聚醯亞胺材料；上電極層層疊於可調式電阻層上，上電極層包含高分子軟性材料及摻雜於高分子軟性材料的奈米金屬線材料或石墨材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A low-optical-transmittance resistive memory structure, which includes a flexible substrate layer, a bottom electrode layer, an adjustable resistive layer, and a top electrode layer.The flexible substrate layer comprises a polymer-based flexible material and a dark ceramic material doped into the polymer-based flexible material. The bottom electrode layer is stacked on the flexible substrate layer and includes a polymer-based flexible material doped with either a nanometal wire material or a graphite material.The adjustable resistive layer is stacked on the bottom electrode layer and contains an adjustable polyimide material. The top electrode layer is stacked on the adjustable resistive layer and comprises a polymer-based flexible material doped with either nanometal wire material or graphite material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:低透光電阻式記憶體結構</p>
        <p type="p">10:可撓性基板層</p>
        <p type="p">20:下電極層</p>
        <p type="p">30:可調式電阻層</p>
        <p type="p">40:上電極層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="893px" img-content="tif" inline="yes" orientation="portrait" width="790px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622301</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146316</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250314B">C30B13/14</main-classification>
        <further-classification edition="200601120250314B">C30B13/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪忠欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, JHONG CIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉昌鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, CHANG-SIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>長晶裝置</chinese-title>
        <english-title>CRYSTAL GROWTH APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種長晶裝置包括坩堝、上蓋、第一線圈、一第二線圈、一第三線圈、第一電源供應單元、第二電源供應單元以及第三電源供應單元。坩堝用以容納長晶材料。上蓋位於坩堝的頂部且與坩堝形成反應空間，且上蓋用以承載長晶裝置形成之晶種。第一線圈、第二線圈以及第三線圈環繞坩堝且沿垂直方向由上至下依序排列。第一電源供應單元電性耦接第一線圈。第二電源供應單元電性耦接第二線圈。第三電源供應單元電性耦接第三線圈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A crystal growth apparatus includes a crucible, an upper cover, a first coil, a second coil, a third coil, a first power supply unit, a second power supply unit and a third power supply unit. The crucible is configured to accommodate a crystal growth material. The upper cover is on the top of the crucible, forms a reaction space with the crucible, and configured to carry a crystal seed formed by the crystal growth apparatus. The first, second and third coils surround the crucible and are arranged sequentially from top to bottom in a vertical direction. The first power supply unit is electrically coupled to the first coil. The second power supply unit is electrically coupled to the second coil. The third power supply unit is electrically coupled to the third coil.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:長晶裝置</p>
        <p type="p">110:坩堝</p>
        <p type="p">110A:底部</p>
        <p type="p">110B:頂部</p>
        <p type="p">120:上蓋</p>
        <p type="p">130、140、150:線圈</p>
        <p type="p">130A、140A、150A:第一匝</p>
        <p type="p">130B、140B、150B:第二匝</p>
        <p type="p">160、170、180:電源供應單元</p>
        <p type="p">162、172、182:功率匹配單元</p>
        <p type="p">800:交流電產生單元</p>
        <p type="p">900:長晶材料</p>
        <p type="p">900A:熔湯液面</p>
        <p type="p">D1、D2:距離</p>
        <p type="p">CP1、CP2、CP3:線圈節距</p>
        <p type="p">RS:反應空間</p>
        <p type="p">X、Y、Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="663px" img-content="tif" inline="yes" orientation="portrait" width="950px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622822</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146317</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250319B">G06Q10/063</main-classification>
        <further-classification edition="202301120250319B">G06Q10/04</further-classification>
        <further-classification edition="202301120250319B">G06N5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立勤益科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王靖欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHING-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴莉家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, LI-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基於專家意見之輔助決策系統及方法</chinese-title>
        <english-title>DECISION-MAKING SYSTEMS AND METHODS BASED ON EXPERT OPINIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種基於專家意見之輔助決策系統，其包含有一資料庫、一問卷篩選模組、一問卷評估模組及一問卷排序模組。資料庫儲存有至少一專家問卷資料。問卷篩選模組與資料庫耦接，問卷篩選模組依據專家問卷資料計算出三角模糊數，進而找出可接受的專家問卷資料。問卷評估模組與問卷篩選模組耦接，問卷評估模組依據可接受的各三角模糊數建立一專家意見平均值矩陣，進而找出專家問卷資料的一關聯程度。問卷排序模組與問卷評估模組耦接，問卷排序模組以一極限化超級矩陣排序出專家問卷資料的一重要程度。藉此，提供企業一決策建議。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A decision-making systems and methods based on expert opinions, which includes a database, a questionnaire screening module, a questionnaire evaluation module and a questionnaire ranking module. The database contains at least one expert questionnaire data. The questionnaire screening module is coupled with the database, and the questionnaire screening module calculates the triangulation fuzzy number according to the expert questionnaire data, and then finds the acceptable expert questionnaire data. The questionnaire evaluation module is coupled with the questionnaire screening module, and the questionnaire evaluation module establishes an average matrix of expert opinions according to the acceptable triangular fuzzy numbers, and then finds out the correlation degree of the expert questionnaire data. The questionnaire ranking module is coupled with the questionnaire evaluation module, and the questionnaire ranking module sorts out the importance of the expert questionnaire data with a limiting super matrix. Thus, we can provide decision-making suggestions for enterprises.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:輔助決策系統</p>
        <p type="p">1:伺服器</p>
        <p type="p">2:終端裝置</p>
        <p type="p">10:資料庫</p>
        <p type="p">20:問卷篩選模組</p>
        <p type="p">30:問卷評估模組</p>
        <p type="p">40:問卷排序模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10082.JPG" file="ed10082.JPG" height="712px" img-content="tif" inline="yes" orientation="portrait" width="640px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622469</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146319</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250217B">G01F1/66</main-classification>
        <further-classification edition="202201120250217B">G01F1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾科穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, KO-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>褚柏胤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, BO-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹慶中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, CHING-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泓銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>波導板及超音波流量計</chinese-title>
        <english-title>WAVEGUIDE PLATE AND ULTRASONIC FLOW METER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種波導板，用以於高溫管道及超音波換能器之間傳導超音波訊號。波導板包括平板部及多個週期性孔洞。多個週期性孔洞於垂直平板部的方向貫穿過平板部。具有多個週期性孔洞的波導板可達到於縮小尺寸的同時仍具有增強隔熱及超音波傳導的效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A waveguide plate for conducting ultrasonic signal between a high temperature pipeline and an ultrasonic transducer. The waveguide plate comprises a plate part and multiple periodic holes. The multiple periodic holes penetrate the plate part in a direction perpendicular to the plate part. The waveguide plate with the multiple periodic holes can achieve enhanced heat insulation and ultrasonic conduction efficiency while decreasing size per se.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112:超音波訊號</p>
        <p type="p">120:波導板</p>
        <p type="p">121:平板部</p>
        <p type="p">122:週期性孔洞</p>
        <p type="p">122p:傳導路徑</p>
        <p type="p">122h:散熱區域</p>
        <p type="p">123:第一端</p>
        <p type="p">124:第二端</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="620px" img-content="tif" inline="yes" orientation="portrait" width="643px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621929</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146321</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">B62B3/02</main-classification>
        <further-classification edition="200601120241231B">A01K1/02</further-classification>
        <further-classification edition="200601120241231B">A01K1/03</further-classification>
        <further-classification edition="200601120241231B">A45C11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>優利冠企業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古博升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可收合之寵物籃</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種可收合之寵物籃，其包含一框架；一底板，其與框架間隔設置；二收合組件，每一收合組件包含一卡榫部、二下連桿部及二上連桿部，卡榫部設置於框架，每一下連桿部的一端樞接於卡榫部，下連桿部的另一端樞接於底板，上連桿部的一端樞接於框架，上連桿部的另一端樞接於下連桿部，二收合組件呈相對設置且同步作動，卡榫部可受控而具有一撐開狀態及一收合狀態，當卡榫部為撐開狀態時，框架及底板彼此遠離，當卡榫部為收合狀態時，框架及底板彼此靠近；一罩體，其環繞套設於框架、底板及二收合組件；藉此當使用者不使用時，可透過將本發明調整為收合狀態，使得整體體積減少，以便於使用者收納及節省空間，欲使用時，僅需將框體向上拉起至撐開狀態即可使用，具有高度便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:框架</p>
        <p type="p">20:底板</p>
        <p type="p">30:收合組件</p>
        <p type="p">31:卡榫部</p>
        <p type="p">32:下連桿部</p>
        <p type="p">33:上連桿部</p>
        <p type="p">40:罩體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="728px" img-content="tif" inline="yes" orientation="portrait" width="827px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622865</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146322</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q30/0645</main-classification>
        <further-classification edition="201201120250303B">G06Q20/10</further-classification>
        <further-classification edition="201201120250303B">G06Q20/14</further-classification>
        <further-classification edition="201901120250303B">B60L53/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光陽工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWANG YANG MOTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯一安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚博綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, PO-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈怡宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電動車輛之週期租費之付款管理方法及系統</chinese-title>
        <english-title>PAYMENT MANAGEMENT METHODS AND SYSTEMS FOR PERIODIC RENTAL FEES OF ELECTRIC VEHICLES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電動車輛之週期租費之付款管理方法及系統。首先，利用一遠端伺服器決定相應一電動車輛之一帳單，其中該帳單至少包括一應繳費用。接著，遠端伺服器接收一繳款作業中相應該帳單之一繳款資料，其中該繳款資料至少包括一繳款金額。當繳款金額小於應繳費用時，遠端伺服器依據應繳費用及繳款金額重新決定相應電動車輛之帳單，其中帳單中之應繳費用等於原來的應繳費用減去繳款金額，且重新決定相應該電動車輛之該帳單與原來之該帳單具有相同之一繳費期間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Payment management methods and systems for periodic rental fees of electric vehicles are provided. First, a remote server is used to determine a bill corresponding to an electric vehicle, wherein the bill at least includes a fee payable. Then, the remote server receives payment information corresponding to the bill in a payment operation, where the payment information includes at least a payment amount. When the payment amount is less than the fee payable, the remote server re-determines the bill corresponding to the electric vehicle based on the fee payable and the payment amount. The fee payable in the re-determined bill is equal to the original fee payable minus the payment amount, and the re-determined bill has the same payment period as the original bill.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S410、S420、S430、S440:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="1081px" img-content="tif" inline="yes" orientation="portrait" width="703px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623192</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146329</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">H03F1/30</main-classification>
        <further-classification edition="200601120250303B">H03F3/189</further-classification>
        <further-classification edition="200601120250303B">H03F3/20</further-classification>
        <further-classification edition="200601120250303B">H04B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立積電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHWAVE TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王一峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-FONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>偏壓補償電路</chinese-title>
        <english-title>BIAS COMPENSATION CIRCUIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">偏壓補償電路包含功率偵測電路及偏壓電路。功率偵測電路包含第一及第二功率分配電路、第一及第二偵測電路、第一及第二轉換電路、及整合電路。第一及第二功率分配電路依據輸入訊號分別產生第一及第二功率分配訊號。第一及第二偵測電路分別依據第一及第二功率分配訊號產生第一及第二偵測訊號。第一及第二功率分配訊號之功率範圍不同。第一及第二轉換電路分別將第一及第二偵測訊號轉換為第一及第二功率電流。整合電路接收第一及第二功率電流以產生偵測訊號。偏壓電路接收偵測訊號以調整偏壓訊號，及提供偏壓訊號至放大器電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bias compensation circuit includes a power detection circuit and a bias circuit. The power detection circuit includes first and second power distribution circuits, first and second detection circuits, first and second conversion circuits, and a summing circuit. The first and second power distribution circuits respectively generate first and second input signals according to an input signal. The first and second detection circuits generate first and second power signals according to first and second input signals, respectively. The first and second conversion circuits generate first and second power currents according to first and second power signals, respectively. The summing circuit receives the first and second power signals to generate a power signal. The bias circuit receives the power signal to adjust a bias signal and provide the bias signal to the amplifier circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:功率放大裝置</p>
        <p type="p">10:功率偵測電路</p>
        <p type="p">101及102:衰減器</p>
        <p type="p">111及112:功率偵測器</p>
        <p type="p">121及122:諧波濾波器</p>
        <p type="p">100:輸出電路</p>
        <p type="p">131及132:電壓電流轉換電路</p>
        <p type="p">14:電流加總節點</p>
        <p type="p">15:電流電壓轉換電路</p>
        <p type="p">16:轉換電路</p>
        <p type="p">160:相位偏移器</p>
        <p type="p">162:振幅控制器</p>
        <p type="p">18:偏壓電路</p>
        <p type="p">19:調整電路</p>
        <p type="p">BCC:偏壓補償電路</p>
        <p type="p">C1,C2:電容</p>
        <p type="p">Sbias:偏壓訊號</p>
        <p type="p">IPD1及IPD2:功率偵測電流</p>
        <p type="p">Nin,Ni:輸入端</p>
        <p type="p">Nout,No:輸出端</p>
        <p type="p">PA:功率放大器</p>
        <p type="p">PDIN:射頻訊號</p>
        <p type="p">PDOUT:功率訊號</p>
        <p type="p">RFIN:輸入訊號</p>
        <p type="p">RFOUT:輸出訊號</p>
        <p type="p">VPHASE:相位調整電壓</p>
        <p type="p">Vamp:振幅調整電壓</p>
        <p type="p">VD1及VD2:功率分配訊號</p>
        <p type="p">VDF1及VDF2:濾波電壓</p>
        <p type="p">VDO1及VDO2:偵測訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="741px" img-content="tif" inline="yes" orientation="portrait" width="892px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621952</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146330</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B65D1/40</main-classification>
        <further-classification edition="200601120241230B">B65D3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>銓寶工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUMPOWER MACHINERY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝樹林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, SHU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王慶賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHING-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秉男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PIN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏志煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHIH-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴柏丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, PO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪銘憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>雙層複合材質容器的回收方法</chinese-title>
        <english-title>A RECYCLING METHOD OF A DOUBLE LAYER COMPOSITE MATERIAL CONTAINER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種雙層複合材質容器的回收方法，其步驟包含：取得一雙層複合材質容器，該雙層複合材質容器至少包含一無淋膜層的紙質外層體及一塑膠內層體，該紙質外層體外表面具有一識別標記；接續由消費者或業者將雙層複合材質容器拿到回收裝置回收，該回收裝置設有一辨識器及至少一投入口，該辨識器用於辨識該識別標記，當辨識器辨識該識別標記為設定條件後，該回收裝置打開投入口供消費者或業者將雙層複合材質容器投入回收裝置內，並記錄投入數量；再由回收車將回收完成的該雙層複合材質容器運送到集中處理廠進行紙質外層體及塑膠內層體的再製處理以重複循環再利用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention is about a kind of recycling method of a double layer composite material container. The steps including: to obtain a double layer composite material container which has at least one laminate-free paper outer layer and a plasticinner layer. Surface of the paper outer layer has an identification mark; then consumers or vendors bring the double layer composite material container to the recycling device for recycle. The recycling device has a recognition device and at least one inlet. The recognition device is used to identifies the identification mark. After the recognition device identified the identification mark with the preset condition, the recycling device opens its inlet for the consumers or vendors to dispose the double layer composite material container and it records the disposed quantity; then recycling truck delivers the recycled double layer composite material container to the centralized processing plant to reprocess the paper outer layer and the plasticinner layer for reuse.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01~S05:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="1001px" img-content="tif" inline="yes" orientation="portrait" width="667px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621619</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146331</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251105B">A47L9/10</main-classification>
        <further-classification edition="200601120251105B">A47L7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和全豐光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昆漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳盈運</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳澤安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樓韋辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林邦棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>ＵＶＣ光等離子空氣清淨機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種UVC光等離子空氣清淨機，主要包括：高壓產生器、紫外光源、光源集中件及殼體，其中高壓產生器設置於電路板且電性連接正電壓導體及負電壓導體，由正電壓導體及負電壓導體經通電電離出正離子及負離子，經正離子及負離子的電荷中和而瞬間產生足以滅菌消毒的能量反應，另，設置於電路板的紫外光源位於正電壓導體及負電壓導體之間，經通電而產生紫外光，再藉由光源集中件將紫外光集中散出進而達到滅菌用途，透過本發明的高壓產生器及紫外光源，並應用於空氣流動的場域，能對有人的環境中進行滅菌消毒。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:高壓產生器</p>
        <p type="p">100:正電壓導體</p>
        <p type="p">102:負電壓導體</p>
        <p type="p">12:紫外光源</p>
        <p type="p">14:光源集中件</p>
        <p type="p">140:集光空間</p>
        <p type="p">160:上殼</p>
        <p type="p">162:下殼</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="749px" img-content="tif" inline="yes" orientation="portrait" width="606px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623183</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146332</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120250218B">H02S20/32</main-classification>
        <further-classification edition="201401120250218B">H02S20/30</further-classification>
        <further-classification edition="201401120250218B">H02S40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>集光環能開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳禹文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林邦棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>太陽能裝置自動控制追日系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種太陽能裝置自動控制追日系統，係包括：一公轉轉動組件；一公轉控制組件設置一第一碰觸開關及一第二碰觸開關及一公轉定時器，該第一碰觸開關連接有一第一公轉作動器切換一公轉正反開關，與該第二碰觸開關連接有一第二公轉作動器切換所述公轉正反開關，該公轉正反開關電性連接所述公轉定時器及一公轉驅動馬達且於設定時間通電及斷電所述公轉驅動馬達；一自轉轉動組件；及一自轉控制組件設置有一第一自轉作動定時器及一第二自轉作動定時器及一自轉定時器，該第一自轉作動定時器連接有一第一自轉作動器並切換一自轉正反開關，與該第二自轉作動定時器連接有一第二自轉作動器並切換所述自轉正反開關，該自轉正反開關電性連接所述自轉定時器及一自轉驅動馬達且於設定時間通電及斷電所述自轉驅動馬達，藉此，該太陽能裝置自動控制追日系統公轉透過所述公轉控制組件及自轉控制組件自動追日，可省去習知需要利用複雜的軟體程式設計之控制晶片來進行追日所耗費之設置成本，進而達到可降低製作及維護成本之功效者。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">23:公轉驅動軸</p>
        <p type="p">25:公轉驅動馬達</p>
        <p type="p">3:公轉控制組件</p>
        <p type="p">31:第一定位銷</p>
        <p type="p">32:第二定位銷</p>
        <p type="p">33:第一碰觸開關</p>
        <p type="p">331:第一公轉作動器</p>
        <p type="p">34:第二碰觸開關</p>
        <p type="p">341:第二公轉作動器</p>
        <p type="p">35:公轉定時器</p>
        <p type="p">351:公轉正反開關</p>
        <p type="p">43:自轉驅動軸</p>
        <p type="p">47:自轉驅動馬達</p>
        <p type="p">5:自轉控制組件</p>
        <p type="p">51:第一自轉作動定時器</p>
        <p type="p">511:第一自轉作動器</p>
        <p type="p">52:第二自轉作動定時器</p>
        <p type="p">521:第二自轉作動器</p>
        <p type="p">53:自轉定時器</p>
        <p type="p">531:自轉正反開關</p>
        <p type="p">6:電源供應組件</p>
        <p type="p">61:公轉降壓穩壓器</p>
        <p type="p">62:自轉降壓穩壓器</p>
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          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="1025px" img-content="tif" inline="yes" orientation="portrait" width="706px">
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              <english-country>TW</english-country>
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              <chinese-name name-type="organization">
                <last-name>柯辰宇</last-name>
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                <last-name>陳俊源</last-name>
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              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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                <last-name>陳志宗</last-name>
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                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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              <chinese-name name-type="organization">
                <last-name>林邦棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
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        </agents>
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      </priority-claims>
      <invention-title>
        <chinese-title>具壓力輔助垂直及水平位移的牽引架</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本發明係提供一種具壓力輔助垂直及水平位移的牽引架，係包括：一主架體具有一主架組接座及一主架壓持件，又該主架體上設置有一導軌組及一導座及一組接架，該組接架設置有一連動座及一拉桿，該拉桿與該主架壓持件間設置有一牽引線；及一致動組件，該致動組件係設置於所述主架體相對該組接架之一側且具有一壓力缸及一伸縮桿，該壓力缸一端係與該主架組接座相互組設，而該伸縮桿一端係組設於該壓力缸內，與另一端係與該連動座相互組設，進而可透過致動組件調整並定位，使其具壓力輔助垂直及水平位移的牽引架可以垂直及水平的方式來調整患者腿部之位置，進而達到可依照手術需求快速調整牽引位置患者姿態，且可由致動組件以壓力輔助完成強力鎖定並達到鎖定患者維持安全姿態之功效者。</p>
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      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:具壓力輔助垂直及水平位移的牽引架</p>
        <p type="p">2:主架體</p>
        <p type="p">21:主架樞接部</p>
        <p type="p">22:主架組接座</p>
        <p type="p">221:第一樞接部</p>
        <p type="p">222:第二樞接部</p>
        <p type="p">223:第三樞接部</p>
        <p type="p">23:組接架</p>
        <p type="p">231:連動座</p>
        <p type="p">232:拉桿</p>
        <p type="p">233:牽引線</p>
        <p type="p">24:導軌組</p>
        <p type="p">25:導座</p>
        <p type="p">251:延伸套部</p>
        <p type="p">252:導軌固定件</p>
        <p type="p">26:主架握持部</p>
        <p type="p">261:護弓部</p>
        <p type="p">27:主架壓持件</p>
        <p type="p">28:主架固定座</p>
        <p type="p">281:主架旋件</p>
        <p type="p">3:致動組件</p>
        <p type="p">31:壓力缸</p>
        <p type="p">32:伸縮桿</p>
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          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="1048px" img-content="tif" inline="yes" orientation="portrait" width="727px">
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                <last-name>財團法人亞洲大學</last-name>
                <first-name></first-name>
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                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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              <chinese-name name-type="organization">
                <last-name>國立臺北科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>葉品陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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              <chinese-name name-type="organization">
                <last-name>林君玲</last-name>
                <first-name></first-name>
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                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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              <chinese-name name-type="organization">
                <last-name>田國健</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
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          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>林湧群</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>曹銘煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
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      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>虛擬實境結合腦波分析的遊戲成癮併社交焦慮風險評估系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">一種虛擬實境結合腦波分析的遊戲成癮併社交焦慮風險評估系統，具有一VR頭戴裝置用以播放一虛擬實境影片供受測者觀看，而一腦波擷取裝置具有八個電極，各電極安裝於受測者頭部的額葉區、中央區及頂葉區之特定位置上，以供擷取受測者於觀看虛擬實境影片時之腦波頻率，藉此取得一受測者腦波資訊，並以一統計分析單元接收由腦波擷取裝置取得的受測者腦波資訊，使統計分析單元可將受測者腦波資訊與其內建之一預設腦波資訊進行比對，以判斷受測者是否為遊戲成癮併社交焦慮之高度風險者。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
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        <p type="p">11:VR頭戴裝置</p>
        <p type="p">21:腦波擷取裝置</p>
        <p type="p">22:電極</p>
        <p type="p">31:統計分析單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="704px" img-content="tif" inline="yes" orientation="portrait" width="1002px">
          </img>
        </representative>
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          <doc-number>202622182</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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          <doc-number>113146335</doc-number>
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          <date>113/11/29</date>
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        <further-classification edition="200601120241216B">C08J5/18</further-classification>
        <further-classification edition="200601120241216B">H05K3/28</further-classification>
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              <chinese-name name-type="organization">
                <last-name>達邁科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIMIDE TECHNOLOGY INCOPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>莊詠竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YUNG-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧婷瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, TING-XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
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        </inventors>
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        </agents>
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      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>黑色消光之聚醯亞胺膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本發明為一種黑色消光之聚醯亞胺膜，其包括有一聚醯亞胺，其佔該膜71~89wt%，該聚醯亞胺係由二胺及二酸酐聚合形成聚醯胺酸後經由化學環化而得；一碳黑，其佔該膜為2~9wt%，其中值粒徑(D50)小於1μm；及一聚醯亞胺消光劑，其中值粒徑(D50)為0.3~4μm，及該佔該膜之重量百分比為9~20wt%，使該膜之斷裂延伸率大於15%，突出波峰高度(Spk)小於300nm，60度光澤度小於30GU，穿透度小於1%。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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      <isuno>11</isuno>
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          <doc-number>202623224</doc-number>
          <kind></kind>
          <date>115/06/01</date>
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          <doc-number>113146336</doc-number>
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        <main-classification edition="200601120250303B">H04J14/02</main-classification>
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              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>朱俐瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, LI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董彥麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, YEN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>黃詠仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YONG-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>林長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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      </priority-claims>
      <invention-title>
        <chinese-title>管控開放全光網路之波長切換之系統、方法及其電腦可讀媒介</chinese-title>
        <english-title>SYSTEM FOR CONTROLING WAVELENGTH SWITCHING OF OPEN ALL-PHOTONIC NETWORK, METHOD AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種管控開放全光網路之波長切換之系統及其方法，係應用於開放全光網路上，具有波長切換保護和恢復功能，以確保網路在故障發生時能夠快速恢復並提供可靠的服務，實際運作時，透過動態路由監控模組即時收集切換狀態之訊息和資料，並且透過動態配置模組更新開放全光網路收發器之配置(即波長路徑切換)，藉以提供高效的品質保證監控和管理。本發明復提供一種電腦可讀媒介，係用於執行本發明之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a system for controlling wavelength switching of Open All-Optical Network and method thereof. The present invention is applied to an Open All-Optical Network and has wavelength switching protection and recovery functions to ensure that the network can quickly recover and provide reliable services when a failure occurs. In actual operation, information and data of the switching status can be collected in real time by a dynamic routing monitoring module, and the configuration of the Open All-Optical Network transceiver, i.e. wavelength path switching, can be updated by a dynamic configuration module, so that efficient monitoring and management of quality assurance can be provided. The present invention also provides a computer-readable medium for executing the method of the present invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:管控開放全光網路之波長切換之系統</p>
        <p type="p">11:動態路由監控模組</p>
        <p type="p">12:動態配置模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="417px" img-content="tif" inline="yes" orientation="portrait" width="568px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622326</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146343</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">D21H27/10</main-classification>
        <further-classification edition="200601120241231B">D21H11/12</further-classification>
        <further-classification edition="200601120241231B">D21H17/02</further-classification>
        <further-classification edition="200601120241231B">D21H17/36</further-classification>
        <further-classification edition="201801120241231B">A01G20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡豪意</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HAO-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡豪意</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HAO-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡沅南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YUAN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>環保紙地膜及其製造方法</chinese-title>
        <english-title>ECO-FRIENDLY PAPER MULCH FILM AND ITS MANUFACTURING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露為一種環保紙地膜及其製造方法，包含一底紙及一深色頂膜。底紙由植物纖維製成；深色頂膜黏附於底紙的一面，深色頂膜由深色可自然分解之回收材料及可自然分解之樹脂攪拌後塗佈於底紙上方，經烘烤而成，深色頂膜具有能穿透水氣但無法穿透液態水的複數微孔。藉由上述結構，環保紙地膜可應用於農地上，具有抑制雜草、保護土壤及改善秧苗生長環境的效果，並能自然分解，減少人力拆除成本及降低環境污染，符合環保及永續發展之需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an eco-friendly paper mulch film and its manufacturing method, comprising a base paper and a dark-colored top film. The base paper is made from plant fibers, while the dark-colored top film is adhered to one side of the base paper. The top film is formed by blending dark-colored biodegradable recycled materials with biodegradable resin and coating the mixture onto the base paper, followed by baking. The top film is characterized by multiple micro-pores that allow water vapor to pass through but block liquid water. With this structure, the eco-friendly paper mulch film can be applied to farmland, effectively suppressing weeds, protecting soil, and improving the growth environment for seedlings. Furthermore, it decomposes naturally, reducing labor costs for removal and minimizing environmental pollution, aligning with the goals of environmental protection and sustainable development.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S4:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="918px" img-content="tif" inline="yes" orientation="portrait" width="635px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622540</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146345</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250512B">G01V3/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃桂奕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, KUE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉家維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李伯亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BO-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>震電整合訊號量測裝置</chinese-title>
        <english-title>SEISMIC-ELECTRIC INTEGRATED SIGNAL MEASUREMENT DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種震電整合訊號量測裝置，包括金屬外殼、絕緣殼體、震波模組及地電阻模組。金屬外殼包括殼本體及一插置體，殼本體包括相對的第一端與第二端，插置體連接於殼本體之第一端。絕緣殼體容設於殼本體之內。震波模組包括感測組件、感應正電流傳輸線、感應負電流傳輸線，感測組件設於絕緣殼體之內，感應正電流傳輸線之一端連接於感測組件，感應正電流傳輸線之另一端設於殼本體之第二端之外，感應負電流傳輸線之一端連接於感測組件，感應負電流傳輸線之另一端設於殼本體之該第二端之外。地電阻模組包括電阻訊號線，電阻訊號線連接於殼本體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A seismic-electric integrated signal measurement device is provided. The seismic-electric integrated signal measurement device includes a metal housing, an insulating shell, a seismic wave module, and a ground resistance module. The metal housing includes a main body and an insert body, with the main body having a first and a second opposing end. The insert body is connected to the first end of the main body. The insulating shell is housed within the main body. The seismic wave module includes a sensing component, a positive current induction transmission line, and a negative current induction transmission line. The sensing component is housed within the insulating shell, with one end of the positive current induction transmission line connected to the sensing component, and the other end extending outside the second end of the main body. One end of the negative current induction transmission line is connected to the sensing component, and the other end extends outside the second end of the main body. The ground resistance module includes a resistance signal line, which is connected to the main body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:震電整合訊號量測裝置</p>
        <p type="p">110:金屬外殼</p>
        <p type="p">112:殼本體</p>
        <p type="p">112A:第一端</p>
        <p type="p">112B:第二端</p>
        <p type="p">114:插置體</p>
        <p type="p">114A:尖部</p>
        <p type="p">116:蓋體</p>
        <p type="p">120:震波模組</p>
        <p type="p">122:感測組件</p>
        <p type="p">124:感應正電流傳輸線</p>
        <p type="p">126:感應負電流傳輸線</p>
        <p type="p">130:絕緣殼體</p>
        <p type="p">140:地電阻模組</p>
        <p type="p">142:電阻訊號線</p>
        <p type="p">150:保護環</p>
        <p type="p">A1:正極</p>
        <p type="p">A2:負極</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="833px" img-content="tif" inline="yes" orientation="portrait" width="530px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622332</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146346</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">E03C1/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝堯宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王柏鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>可調式壁面排水裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種可調式壁面排水裝置，結構包括有一具有至少一排水槽之工作平台、至少一移動機構、一集水槽、一透過一出水管連接一固定式排水口之出水口、一活動擋板、至少一引水口、至少一連接軟管、一擋板帶動件、及一維修端口。藉上述結構，將排水槽透過連接軟管連結至集水槽的引水口處，配合擋板帶動件賦予的可動性，讓使用者在利用移動機構移動工作平台時，可牽動連接軟管而帶動活動擋板及引水口，並維持連接軟管及出水管之連接狀態，藉此，即便集水槽之出水口連接的是固定式排水口，也可根據使用者需求對工作平台進行線性移動，而提升室內設計的便利性及靈活性，同時備有維修端口便於清潔維修，為高度人性化之設計。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:工作平台</p>
        <p type="p">11:排水槽</p>
        <p type="p">12:移動機構</p>
        <p type="p">2:集水槽</p>
        <p type="p">22:維修端口</p>
        <p type="p">3:出水管</p>
        <p type="p">4:活動擋板</p>
        <p type="p">51:連接軟管</p>
        <p type="p">6:擋板帶動件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="906px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622343</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146347</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250219B">E04F11/18</main-classification>
        <further-classification edition="200601120250219B">G08B5/22</further-classification>
        <further-classification edition="200601120250219B">F21V33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIVERSITY OF TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝堯宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇彥文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>智慧安全扶手</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種智慧安全扶手，結構包括有一扶手本體、二固定部、至少一蓄電元件、複數發光元件、至少一感應元件、一訊號發送件、至少一控制部、及一無線傳輸裝置。藉上述結構，只要利用固定部將扶手本體安裝於適當位置，便可利用內建的蓄電元件免布線的供電，以透過感應元件提供人體感應驅動發光元件之功能，而藉由扶手本體的發光增加行動不便者經過時的安全性，或於發生意外時，透過扶手本體上的控制部及訊號發送件直接給予行動不便者求救的即時性，且可利用無線傳輸裝置對蓄電元件、發光元件及訊號發送件進行遠端監控及設定。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:扶手本體</p>
        <p type="p">11:固定部</p>
        <p type="p">12:控制部</p>
        <p type="p">2:蓄電元件</p>
        <p type="p">3:發光元件</p>
        <p type="p">31:感應元件</p>
        <p type="p">4:訊號發送件</p>
        <p type="p">5:無線傳輸裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="879px" img-content="tif" inline="yes" orientation="portrait" width="683px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622407</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146349</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241223B">F16L1/024</main-classification>
        <further-classification edition="200601120241223B">B29C65/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>靖宜工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVER PROFIT CONTRACTOR CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳桂靖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>道路配管之裝置及其方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為有關一種道路配管之裝置及其方法，結構包括有一移動平台、複數間隔排列的設置於移動平台上之輸送裝置、至少一滑動部、一設於移動平台上之熔接裝置、及至少一包含有一控制元件、及一連接控制元件之吊爪部之懸吊裝置。藉上述結構，利用滑動部讓管體在移動平台上滑順推移，並在移動平台上用熔接裝置進行熔接作業，排除設備拆裝的費時問題，且因移動平台可移動於鋪設管路之延伸方向上，讓懸吊裝置可少量的設置在移動平台上或一側，利用控制元件驅動吊爪部進行簡單的垂直升降動作，便可完成管體的埋設，使整體施工具有省時快速、減少占地、提升安全性等優勢。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:移動平台</p>
        <p type="p">2:輸送裝置</p>
        <p type="p">21:滑動部</p>
        <p type="p">22:限位部</p>
        <p type="p">3:傳動元件</p>
        <p type="p">4:熔接裝置</p>
        <p type="p">5:懸吊裝置</p>
        <p type="p">51:控制元件</p>
        <p type="p">52:吊爪部</p>
        <p type="p">6:支撐座</p>
        <p type="p">61:輔助輪</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.bmp" file="ed10003.bmp" height="766px" img-content="tif" inline="yes" orientation="portrait" width="1119px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621641</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146354</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">A61B5/22</main-classification>
        <further-classification edition="202101120241231B">A61B5/24</further-classification>
        <further-classification edition="202101120241231B">A61B5/397</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國泰醫療財團法人國泰綜合醫院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塗雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮聖彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳威廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>利用表面肌電訊號的肌肉疲勞度分析裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種利用表面肌電訊號的肌肉疲勞度分析裝置，包含有輸入單元及處理單元。處理單元通過該輸入單元接收時域肌電訊號，並轉換成一頻域積電訊號。且處理單元具有一深度學習模型，並以時域肌電訊號及頻域肌電訊號作為輸入。深度學習模型具有時域分支、頻域分支及全連接層。時域分支提取時域肌電訊號的時域特徵。頻域分支提取頻域肌電訊號的頻域特徵。全連接層根據時域特徵及頻域特徵產生分析結果。分析結果為肌肉疲勞分析結果或肌肉未疲勞分析結果。如此便可進一步提高分析結果的準確度，有助於運動和醫療專業人員在制定訓練計劃或復健計畫時，有效的預防運動損傷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:利用表面肌電訊號的肌肉疲勞度分析裝置</p>
        <p type="p">11:輸入單元</p>
        <p type="p">12:處理單元</p>
        <p type="p">13:輸出單元</p>
        <p type="p">20:表面肌電訊號檢測裝置</p>
        <p type="p">30:外部裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="923px" img-content="tif" inline="yes" orientation="portrait" width="631px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622986</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146359</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250422B">G16H10/60</main-classification>
        <further-classification edition="201801120250422B">G16H30/40</further-classification>
        <further-classification edition="201801120250422B">G16H80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國醫藥大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁　鳳如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, FENG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖偉志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, WEI-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂智彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHIH-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁　鳳如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, FENG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>用於分類醫學影像之系統、方法和電腦可讀媒介</chinese-title>
        <english-title>SYSTEM AND METHOD FOR CLASSIFYING A MEDICAL IMAGE, AND COMPUTER READABLE MEDIUM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於分類醫學影像之系統包括輸入模組、資料預處理模組、資料清理模組、偵測模組和輸出模組。輸入模組可自有其需要之個體取得醫學影像。資料預處理模組可處理醫學影像以生成小塊影像。資料清理模組可對小塊影像執行資料清理以生成輸入資料。偵測模組可用於對輸入資料執行物件偵測以生成輸出資料。輸出模組可處理輸出資料以生成個體之分析報告。用於分類醫學影像之方法和電腦可讀媒介可藉由用於分類醫學影像之系統實現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for classifying a medical image includes an input module, a data preprocessing module, a data cleansing module, a detection module, and an output module. The input module is used to acquire the medical image from a subject in need thereof. The data preprocessing module is used to process the medical image into a tile image. The data cleansing module is used to perform data cleansing on the tile image to generate input data. The detection module is used to perform object detection on the input data to generate output data. The output module is used to process the output data to generate an analysis report for the subject. A method for classifying a medical image and a computer readable medium thereof may be realized through the system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:用於分類醫學影像之系統</p>
        <p type="p">100:輸入模組</p>
        <p type="p">200:資料預處理模組</p>
        <p type="p">300:資料清理模組</p>
        <p type="p">400:偵測模組</p>
        <p type="p">500:輸出模組</p>
        <p type="p">600:模型建立模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="692px" img-content="tif" inline="yes" orientation="portrait" width="767px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623236</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146360</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L43/20</main-classification>
        <further-classification edition="202201120250303B">H04L43/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英利科技控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>一種創建可視化虛擬空間降低平台負載的邊緣運算之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種創建可視化虛擬空間降低平台負載的邊緣運算之方法，其係透過以下步驟進行，使用一創作工具輸出成一可視化虛擬空間，該可視化虛擬空間於一伺服器中運行，至少一用戶端透過網址訪問所述伺服器，將該可視化虛擬空間載入所述用戶端，所述用戶端訪問該伺服器外的至少一資料庫獲取該可視化虛擬空間運行所需的資源，藉由所述可視化虛擬空間將該資料庫的資源直接在所述用戶端呈現。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):創作工具</p>
        <p type="p">(20):可視化虛擬空間</p>
        <p type="p">(30):伺服器</p>
        <p type="p">(40):用戶端</p>
        <p type="p">(50):資料庫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="548px" img-content="tif" inline="yes" orientation="portrait" width="867px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623556</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146361</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260303B">H10P72/00</main-classification>
        <further-classification edition="202601120260303B">H10P72/70</further-classification>
        <further-classification edition="200601120260303B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾建偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, JIAN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁塘偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, TANG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花瑞銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUA,JUI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許恭銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, KUNY-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛翔峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, HSIANG-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>適用靜電吸盤之電引入裝置</chinese-title>
        <english-title>ELECTRIC INTRODUCTION DEVICE FOR ELECTROSTATIC CHUCK</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種適用靜電吸盤之電引入裝置，用以解決習知電引入裝置拆裝困難及供電不穩定的問題。係包含：一基座，具有一本體及位於該本體上的一載台，至少二電極埋設於該載台內部，該基座另具有至少二管道，各該管道穿透該本體及在該載台下表面形成對應其中一該電極之位置的盲孔，使各該電極的部分面積露出並連通所對應之該管道；及至少二導電柱，分別穿過該至少二管道及電連接該至少二電極，各該導電柱具有可沿電連接方向彈性往復之一接頭，用於電連接其中一該電極。藉此可以達成拆換便利及供電穩定的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electric introduction device for electrostatic chuck is provided to solve the problems of difficulty in disassembly and assembly and unstable power supply of conventional electric introduction device. The device includes a base, at least two conductive posts, and at least two pipes. The base includes a body and a carrier on the body. At least two electrodes are embedded inside the carrier. Each of the pipes penetrates the body and form a blind hole corresponding to the position of one of the electrodes on the lower surface of the carrier. Part of area of each electrode is exposed and connected to the corresponding pipe. The at least two conductive posts pass through the at least two pipes and are electrically connected to the at least two electrodes. Each conductive post has a joint that can elastically reciprocate along the electrical connection direction for electrically connecting one of the electrodes. The electric introduction device provides the effects of convenient replacement and stable power supply.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基座</p>
        <p type="p">1a:頂面</p>
        <p type="p">1b:底面</p>
        <p type="p">11:本體</p>
        <p type="p">12:載台</p>
        <p type="p">13:黏著層</p>
        <p type="p">14:電極</p>
        <p type="p">15:管道</p>
        <p type="p">16:絕緣層</p>
        <p type="p">17:內螺紋</p>
        <p type="p">2:導電柱</p>
        <p type="p">2a:第一端</p>
        <p type="p">2b:第二端</p>
        <p type="p">21:接頭</p>
        <p type="p">22:凹槽</p>
        <p type="p">23:彈性元件</p>
        <p type="p">24:限位件</p>
        <p type="p">25:外螺紋</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="1004px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622843</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146362</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q30/01</main-classification>
        <further-classification edition="202201120250303B">H04L51/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛酷智能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACCUHIT AI TECHNOLOGY TAIWAN CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佳瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳耀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAO-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許煒駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林庭箴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING-CHEN, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING-CHAO, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>於通訊介面中動態指派服務人員的系統</chinese-title>
        <english-title>SYSTEM FOR DYNAMICALLY ASSIGNING CUSTOMER SERVICE STAFF IN COMMUNICATION INTERFACE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出了一種於通訊介面中動態指派服務人員的系統，該系統包含了一權限設定模組、一平台互動模組、一回覆指派模組、一回覆狀態管控模組、一頭像更新模組、一自動回覆模組一通訊內容篩選模組與一通訊記錄模組。本發明的平台互動模組讓行動通訊平台的一對一服務於商家端延伸為多個可替換服務人員的操作，具體由哪一位服務人員上線向客戶提供服務則可由服務主管透過回覆指派模組來指派。此外，回覆狀態管控模組將一輪回覆切分成三種狀態，並依照不同的狀態提醒服務人員關注客戶的需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for dynamically assigning customer service staff in communication interfaces is disclosed. The system includes a permission setting module, a platform interaction module, a reply assignment module, a reply status control module, an avatar update module, an automatic reply module, a communication content filtering module and a communication recording module. The platform interaction module of the present invention allows the one-to-one service of the mobile communication platform to be extended to the operation of multiple replaceable service personnel on a merchant side. The specific service personnel who will go online to provide services to customers can be assigned by a service supervisor through the reply assignment module to assign. In addition, the reply status control module divides a round of reply into three statuses and reminds the service personnel to pay attention to customer needs according to different statuses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:伺服主機</p>
        <p type="p">2a:第一商家端通訊裝置</p>
        <p type="p">2b:第二商家端通訊裝置</p>
        <p type="p">2c:第三商家端通訊裝置</p>
        <p type="p">3:平台伺服器</p>
        <p type="p">4a:第一客戶端通訊裝置</p>
        <p type="p">4b:第二客戶端通訊裝置</p>
        <p type="p">11:權限設定模組</p>
        <p type="p">12:平台互動模組</p>
        <p type="p">13:回覆指派模組</p>
        <p type="p">14:回覆狀態管控模組</p>
        <p type="p">15:頭像更新模組</p>
        <p type="p">16:自動回覆模組</p>
        <p type="p">17:通訊內容篩選模組</p>
        <p type="p">18:通訊記錄模組</p>
        <p type="p">C:通訊介面</p>
        <p type="p">O:操作介面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="1025px" img-content="tif" inline="yes" orientation="portrait" width="734px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622769</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146363</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250303B">G06F16/35</main-classification>
        <further-classification edition="201901120250303B">G06F16/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛酷智能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACCUHIT AI TECHNOLOGY TAIWAN CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林祺傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CI JIE, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭博元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BO-YUAN, JHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林柄錦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BING-JIN, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林庭箴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TING JHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳健宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIAN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鼎超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING-CHAO, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高宏銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>商品說明文字標籤化的方法與系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR LABELING PRODUCT DESCRIPTION TEXT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出了一種商品說明文字標籤化的方法與系統。該系統包含了一輸入模組、一文字處理模組、一文字分群模組、一大語言模型輸入模組與一輔助修正模組。本發明可以在操作者與大語言模型之間提供一個中介服務系統，讓操作者以大語言模型的輸出調整輸入字詞，以取得對特定產品或服務的商品標籤。在多輪的輸入操作下，可以讓大語言模型輸出的商品標籤越趨精準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and a system for labeling product description text are disclosed. The system includes an input module, a word processing module, a text grouping module, a large language model input module and an auxiliary correction module. The present invention can provide an intermediary service system between an operator and a large language model, allowing the operator to adjust the input words with the output of the large language model to obtain product labels for specific products or services. After multiple rounds of input operations, the product labels output by the large language model can become more and more accurate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:計算機</p>
        <p type="p">2:伺服器</p>
        <p type="p">3:電腦主機</p>
        <p type="p">3a:顯示裝置</p>
        <p type="p">3b:輸入裝置</p>
        <p type="p">10:輸入模組</p>
        <p type="p">11:文字處理模組</p>
        <p type="p">111:詞庫</p>
        <p type="p">112:詞向量模型</p>
        <p type="p">12:文字分群模組</p>
        <p type="p">121:分群演算模型</p>
        <p type="p">13:大語言模型輸入模組</p>
        <p type="p">131:提示詞詞庫</p>
        <p type="p">14:輔助修正模組</p>
        <p type="p">N:網路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="918px" img-content="tif" inline="yes" orientation="portrait" width="663px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622607</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146366</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G02C7/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永達利科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONG DA LI TECHNOLOGY., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王江全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>透氧隱形眼鏡</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透氧隱形眼鏡，包括一隱形眼鏡，該隱形眼鏡具有呈凸弧狀之一外鏡面，以及位於該外鏡面相反側且呈凹弧狀之一內鏡面，該隱形眼鏡係經由雷射激光直線貫穿該外鏡面以及該內鏡面設有至少一透氧孔，利用所述透氧孔增加該隱形眼鏡的透氣性及透氧率，使得隱形眼鏡配戴時，眼球可適時經由透氧孔供給獲得氧氣，並增加淚液、水分的循環效果，大幅降眼睛乾澀感、刺痛或異物感等不適症狀，進一步提升配戴的舒適性，並有效減少眼部感染風險，確保配戴的安全性，另在眼藥水或是人工淚液的使用亦可通過所述透氧孔確實達到眼球的濕潤效果，兼具眼球舒緩之便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:隱形眼鏡</p>
        <p type="p">101:光學區</p>
        <p type="p">102:非光學區</p>
        <p type="p">103:外邊緣</p>
        <p type="p">11:外鏡面</p>
        <p type="p">12:內鏡面</p>
        <p type="p">13:透氧孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="809px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621837</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146369</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250102B">B23K37/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新代科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYNTEC TECHNOLOGY CO.LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸康帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KANGFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳信宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XINYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鵬舉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, PENGJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包晉安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAO, JIN-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡隸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>視覺送絲焊接檢測及輔助送絲的方法</chinese-title>
        <english-title>A METHOD FOR WIRE-FEEDING WELDING VISUAL DETECTION AND AUXILIARY WIRE FEEDING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種視覺送絲焊接檢測及輔助送絲的方法。該方法包括以下步驟：步驟1︰在視覺系統上標記鐳射出光點；步驟2：使用視覺感測器得到焊絲頭距離鐳射出光點位置的相對關係；步驟3：將上述相對關係回傳至控制系統，判斷是否在允許誤差範圍內。其中，送絲不準確則執行步驟4，送絲準確則跳轉到步驟5；步驟4：進入送絲補償，將焊絲頭移動到準確位置；步驟5：開始執行送絲焊接。本發明一種視覺送絲焊接檢測及輔助送絲的方法，能夠在焊接出光前，先視覺檢測焊絲是否送到焊接出光位置的方法，以及不在預期位置時自動輔助把焊絲送到位的方法，提高了送絲焊接的效果和產品良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for wire-feeding welding visual detection and auxiliary wire feeding. The method includes the following steps: Step 1: Mark the laser light spot on the vision system. Step 2: Use a visual detector to obtain the relative position of the welding wire head and the laser light spot. Step 3: Send the relative position mentioned above back to the control system to determine whether it is within the allowable error range. If the wire-feeding position is inaccurate, proceed to step 4; if the wire-feeding position is accurate, jump to step 5. Step 4: Execute wire-feeding compensation and move the welding wire head to the accurate position. Step 5: Start wire-feeding welding. The present invention is a method for wire-feeding welding visual detection and auxiliary wire feeding, which can visually detect whether the welding wire will be sent to the welding laser emitting position before the welding light is emitted; and a method to automatically assist in sending the welding wire into position when it is not at the expected position, which improves wire-feeding welding effect and product yield.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="840px" img-content="tif" inline="yes" orientation="portrait" width="674px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621556</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146370</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250213B">A01G31/02</main-classification>
        <further-classification edition="201801120250213B">A01G9/02</further-classification>
        <further-classification edition="200601120250213B">A01G9/20</further-classification>
        <further-classification edition="200601120250213B">A01G9/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立屏東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL PINGTUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾興穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HSING YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁佑慎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YU SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余奕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>蔬果培育系統</chinese-title>
        <english-title>CULTIVATION SYSTEM FOR FRUITS AND VEGETABLES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蔬果培育系統，包含：一槽體，用以培育一蔬果種子；一環控設備，用以調整該槽體四周的亮度與溫度；一第一供給設備，用以提供一含鉀培養液；一第二供給設備，用以提供一改良培養液；及一伺服端，用以控制該環控設備的作動，於一生長期間，該伺服端控制該第一供給設備與該槽體形成連通，使該含鉀培養液流至該槽體，於一處理期間，該伺服端控制該第一供給設備不與該槽體形成連通，並控制該第二供給設備與該槽體形成連通，使該改良培養液流至該槽體，即可得到由該蔬果種子所培育出的低鉀蔬果植株或無鉀蔬果植株。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cultivation system for fruits and vegetables comprises a tank, an environmental control equipment, a first supply device, a second supply device and a Server. The tank is used to grow a fruit and vegetable seed. The environmental control device is used to adjust the brightness and temperature around the tank. The first supply device is used to provide a low-potassium medium. The second supply device is used to provide an improved medium. The server is used to control the operation of the environmental control equipment. During a growth period, the server controls the first supply device to form a connection with the tank, so that the low-potassium medium flows to the tank. During a treatment period, the server controls the first supply device not to form communication with the tank, and controls the second supply device to form communication with the tank, so that the improved medium flows to the tank. In this way, low-potassium vegetable and fruit plants or potassium-free vegetable and fruit plants can be obtained from the fruit and vegetable seed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:槽體</p>
        <p type="p">12:環控設備</p>
        <p type="p">121:光源元件</p>
        <p type="p">122:溫度模組</p>
        <p type="p">1221:致冷晶片</p>
        <p type="p">1222:加熱晶片</p>
        <p type="p">13:第一供給設備</p>
        <p type="p">131:第一管體</p>
        <p type="p">132:第一電磁閥</p>
        <p type="p">14:第二供給設備</p>
        <p type="p">141:第二管體</p>
        <p type="p">142:第二電磁閥</p>
        <p type="p">3:伺服端</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="908px" img-content="tif" inline="yes" orientation="portrait" width="680px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622538</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146371</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250102B">A01K67/30</main-classification>
        <further-classification edition="201001120250102B">G01S19/01</further-classification>
        <further-classification edition="200601120250102B">G08B25/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英田科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEANG TENG TECHNOLOGY CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳千皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳佩妤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PEI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳文平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, PING CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余奕賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>蜂箱安全監控系統</chinese-title>
        <english-title>SAFETY MONITOR SYSTEM FOR BEEHIVE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種蜂箱安全監控系統，包含：一偵測模組，用以在蜂箱非處於一停止狀態時，持續產生並發送一偵測訊號，該偵測訊號包含該蜂箱的一蜂箱編號及一位置座標；及一監控平台，具有用以儲存該蜂箱的蜂箱編號及相對應的設置座標的一資料庫單元，該監控平台根據該偵測訊號中的蜂箱編號取得相對應的設置座標，若該位置座標與該設置座標相距超過一第一距離門檻，則控制一無人載具朝該位置座標移動，當該位置座標不再變動時，控制該無人載具朝四周開始攝錄產生一追蹤影像，並將該追蹤影像發送至一行動裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A safety monitor system for beehive includes a detection module for continuously generating and sending a detection signal when the beehive is not in a stopped state and the detection signal contains a beehive number and a position coordinates of the beehive. A monitoring platform having a database unit for storing the beehive number and corresponding setting coordinates of the beehive. The monitoring platform obtains the corresponding setting coordinates according to the beehive number in the detection signal. The monitoring platform controls an UAV towards the position coordinates whenever the distance between the position coordinates and the setting coordinates exceeds a distance threshold. The monitoring platform controls the UAV to turn around and start recording to produce a tracking image, which is sent to a mobile device when the position coordinates are no longer moving.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:蜂箱</p>
        <p type="p">2:偵測模組</p>
        <p type="p">21:移動偵測單元</p>
        <p type="p">22:定位單元</p>
        <p type="p">23:訊號傳輸單元</p>
        <p type="p">24:控制單元</p>
        <p type="p">3:無人載具</p>
        <p type="p">31:攝像單元</p>
        <p type="p">4:監控平台</p>
        <p type="p">41:資料庫單元</p>
        <p type="p">M:行動裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="496px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621861</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146372</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250120B">B25D1/02</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鹿港工具實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU KANG HAND TOOLS INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪義恭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, YI-GONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳芳池</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>鐵鎚結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種鐵鎚結構，其包含有：一把手、一第一工具頭與一第二工具頭，其中，所述把手具有相連接的一握把部與一本體部，所述本體部一端形成有一容伸缺口，另一端設有一軸孔，所述第一工具頭一端形成有一靠抵緣，該靠抵緣上設有一固定孔，所述第一工具頭上方設有一第一孔，且該第一孔是與所述固定孔互呈導通，所述第二工具頭具有一軸桿，該軸桿側端設有一固接段，所述固接段上設有一第二孔。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">(10):把手</p>
        <p type="p">(11):握把部</p>
        <p type="p">(12):本體部</p>
        <p type="p">(13):容伸缺口</p>
        <p type="p">(131):第一接合部</p>
        <p type="p">(14):軸孔</p>
        <p type="p">(141):階緣</p>
        <p type="p">(20):第一工具頭</p>
        <p type="p">(21):靠抵緣</p>
        <p type="p">(211):第二接合部</p>
        <p type="p">(22):固定孔</p>
        <p type="p">(23):第一孔</p>
        <p type="p">(231):開口</p>
        <p type="p">(30):第二工具頭</p>
        <p type="p">(31):軸桿</p>
        <p type="p">(311):階緣</p>
        <p type="p">(32):固接段</p>
        <p type="p">(33):第二孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="712px" img-content="tif" inline="yes" orientation="portrait" width="945px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622921</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146375</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250113B">G08G1/14</main-classification>
        <further-classification edition="202401120250113B">G06Q50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華學校財團法人中華科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昀諭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宥心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YU HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴悅芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, YUEH FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇智傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, JHIH JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晉承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIN CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高民宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, MIN HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡君君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYO MYINT, MYINT MYAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高安妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, EI HONEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤秋英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIN, EI PHYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王德文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>停車場控管系統</chinese-title>
        <english-title>PARKING LOT MANAGEMENT SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種停車場控管系統，包含有：一車位偵測模組，具有複數個車位影像擷取單元、一車位影像分析單元及一剩餘車位顯示單元，用以偵測一般車位及特殊車位的剩餘車位數並顯示於停車場外供駕駛閱覽；一擋止模組，具有複數個擋止單元設置於該停車場之每一車位，可受驅動而於一擋止位置與一通行位置間移動，藉以限制該停車場中之車輛能否進入對應之該特殊車位；以及一特殊車輛判斷模組，具有一特殊證明感應單元設於停車場之車輛進出口一側，用以感應於車輛進出口之車輛之一駕駛所出示之一特殊證明，據以產生一特殊證明資料；及一判斷單元用以在接收該特殊證明資料後，上傳至一雲端資料庫進行分析比對，以判斷該車輛是否為特殊車輛。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A parking lot management system comprises: A parking space detection module, including multiple parking space image capture units, a parking space image analysis unit, and a remaining parking space display unit. This module detects the number of available regular and designated parking spaces and displays the information outside the parking lot for drivers to view. A blocking module, including multiple blocking units installed at each parking space in the parking lot. These units can be driven to move between a blocking position and a passing position to control whether vehicles in the parking lot can access the corresponding designated parking spaces. A designated vehicle determination module, including: A designated proof sensing unit installed at one side of the vehicle entry and exit points of the parking lot, used to sense a special proof presented by the driver of a vehicle at the entry or exit and generate designated proof data. A determination unit that, upon receiving the designated proof data, uploads it to a cloud database for analysis and comparison to determine whether the vehicle qualifies as a designated vehicle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:停車場控管系統</p>
        <p type="p">10:車位偵測模組</p>
        <p type="p">11:車位影像擷取單元</p>
        <p type="p">12:車位影像分析單元</p>
        <p type="p">13:剩餘車位顯示單元</p>
        <p type="p">20:擋止模組</p>
        <p type="p">21:擋止單元</p>
        <p type="p">22:控制單元</p>
        <p type="p">30:特殊車輛判斷模組</p>
        <p type="p">31:特殊車牌辨識單元</p>
        <p type="p">32:特殊證明感應單元</p>
        <p type="p">33:判斷單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="655px" img-content="tif" inline="yes" orientation="portrait" width="953px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622330</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146378</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">E02B3/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭大雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, TA HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭光聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, KUANG TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭光謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, KUANG CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭尊琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, TSUN-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭韻庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭大雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, TA HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭光聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, KUANG TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭光謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, KUANG CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>漂浮式減能裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種漂浮式減能裝置，包含一框架單元、一導浪單元、一浮板單元、一船舵單元、一消波單元、一定位單元及一太陽能板單元。該框架單元包括一前段、一中段及一後段。該導浪單元具有至少一設置於該前段的導浪板。該浮板單元具有多數分別設置於該框架單元的浮板。該船舵單元具有多數舵板。該消波單元包括一消波網組及一減能刷組。該定位單元包括至少一連接於該框架單元與該海床的定位錨鏈。該太陽能板單元包括多數可產生電能的太陽能板。利用整體的配置，可以達到減能、確保國土保持，且可兼具綠能發電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:框架單元</p>
        <p type="p">11:前段</p>
        <p type="p">12:中段</p>
        <p type="p">13:後段</p>
        <p type="p">14:縱補強管</p>
        <p type="p">20:導浪單元</p>
        <p type="p">21:導浪板</p>
        <p type="p">30:浮板單元</p>
        <p type="p">31:浮板</p>
        <p type="p">40:船舵單元</p>
        <p type="p">41:舵板</p>
        <p type="p">50:消波單元</p>
        <p type="p">51:消波網組</p>
        <p type="p">511:第一消波網</p>
        <p type="p">512:第二消波網</p>
        <p type="p">52:減能刷組</p>
        <p type="p">60:定位單元</p>
        <p type="p">61:定位錨鏈</p>
        <p type="p">611:彈性鏈件</p>
        <p type="p">612:錨件</p>
        <p type="p">613:鏈段</p>
        <p type="p">614:彈簧段</p>
        <p type="p">62:導柱</p>
        <p type="p">621:螺桿部</p>
        <p type="p">63:螺帽</p>
        <p type="p">64:定位盤</p>
        <p type="p">70:太陽能板單元</p>
        <p type="p">71:太陽能板</p>
        <p type="p">80:風力發電單元</p>
        <p type="p">81:風力發電機組</p>
        <p type="p">X:第一軸向</p>
        <p type="p">Z:第二軸向</p>
        <p type="p">Y:第三軸向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="744px" img-content="tif" inline="yes" orientation="portrait" width="916px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622037</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146381</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250219B">C07C211/09</main-classification>
        <further-classification edition="200601120250219B">C08F22/06</further-classification>
        <further-classification edition="200601120250219B">G02F1/137</further-classification>
        <further-classification edition="200601120250219B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡伶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田堃正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, KUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖乾煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHIEN-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示面板及其製造方法</chinese-title>
        <english-title>DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板，包括第一基板、第二基板、顯示介質層以及第一配向層。第二基板與第一基板相對設置。顯示介質層設置於第一基板與第二基板之間，且包括多個顯示介質分子。第一配向層設置於第一基板上，其中第一配向層是由二酸酐化合物、具有烷基側鏈的二胺化合物及不具烷基側鏈的二胺化合物進行縮合聚合而成，具有烷基側鏈的二胺化合物與不具烷基側鏈的二胺化合物的莫耳數比為0.1至0.5，且具有烷基側鏈的二胺化合物的烷基側鏈的碳數為1至12。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel is provided. The display panel includes a first substrate, a second substrate, a display medium layer and a first alignment layer. The second substrate is arranged opposite to the first substrate. The display medium layer is disposed between the first substrate and the second substrate, and includes plural display medium molecules. The first alignment layer is disposed on the first substrate, wherein the first alignment layer is form through condensation polymerization of a dianhydride compound, a diamine compound having an alkyl side chain and a diamine compound having no alkyl side chain, a molar ratio of the diamine compound having the alkyl side chain to the diamine compound having no alkyl side chain ranges from 0.1 to 0.5, and the alkyl side chain of the diamine compound having the alkyl side chain is a C1 to C12 alkyl group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示面板</p>
        <p type="p">110,120:基板</p>
        <p type="p">112,122,142:表面</p>
        <p type="p">130:顯示介質層</p>
        <p type="p">140,150:配向層</p>
        <p type="p">160:畫素陣列層</p>
        <p type="p">170:共用電極層</p>
        <p type="p">DM:顯示介質分子</p>
        <p type="p">PE:畫素電極</p>
        <p type="p">PX:畫素</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="792px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623467</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146382</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250204B">H10F71/00</main-classification>
        <further-classification edition="202501120250204B">H10F77/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鍾賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俊名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JYUN-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>太陽能電池基板及其製造方法</chinese-title>
        <english-title>SOLAR CELL SUBSTRATE AND MANUFACTURING METHOD THEREFOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種太陽能電池基板的製造方法，其包括：提供基板；對該基板進行紋理化製程，以使該基板具有紋理結構；以及對具有該紋理結構的該基板進行表面微處理製程，以於該紋理結構上形成微結構，而形成太陽能電池基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method for a solar cell substrate including the following steps is provided: providing a substrate; performing a texturization process on the substrate so that the substrate has a textured structure; and performing a surface micro-treatment process on the substrate having the textured structure to form microstructures on the textured structure to form the solar cell substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11、S12、S13:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="487px" img-content="tif" inline="yes" orientation="portrait" width="615px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623102</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146384</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120241231B">H01R12/72</main-classification>
        <further-classification edition="200601120241231B">H01R25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞市康祥電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN KANGXIANG ELECTRONIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永常</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG- CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張弘典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾軒禾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HSUAN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭振田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>模組化電連接器(一)</chinese-title>
        <english-title>MODULAR ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種模組化電連接器，包括一殼體、第一外連接器、第一內連接器、第一電性連接組件、第一壓蓋件、第二外連接器、第二內連接器、第二電性連接組件及第二壓蓋件；第一內連接器設置於殼體內之一第一電路板上，第二內連接器設置於殼體內之第二電路板上；其中第一外連接器及第二外連接器在水平位置並排設置，第一電路板具有一第一高度，第二電路板具有一第二高度，第一高度與該第二高度不相同；本發明提供於殼體內設置不同高度電路板之適應性使用，藉由可撓性的電性連接組件應用連接，可適應殼體內部不同高度電路板，提升了使用上的多元性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a modular electrical connector comprising a housing, a first external connector, a first internal connector, a first electrical connection assembly, a first pressing component, a second external connector, a second internal connector, a second electrical connection assembly, and a second pressing component. The first internal connector is disposed on a first circuit board within the housing, and the second internal connector is disposed on a second circuit board within the housing. The first and second external connectors are arranged side by side in a horizontal position. The first circuit board has a first height, while the second circuit board has a second height, with the first and second heights being different.        &lt;br/&gt;&lt;br/&gt;This invention provides adaptive usage for installing circuit boards of varying heights within the housing. By employing flexible electrical connection assemblies, it accommodates circuit boards of different heights inside the housing, thereby enhancing versatility in application.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:模組化電連接器</p>
        <p type="p">10:第一外連接器</p>
        <p type="p">102:第一端子</p>
        <p type="p">104:第一絕緣結構</p>
        <p type="p">106:外殼件</p>
        <p type="p">15:第一內連接器</p>
        <p type="p">17:第一電路板</p>
        <p type="p">18:第一電性連接組件</p>
        <p type="p">182:組件本體</p>
        <p type="p">19:第一壓蓋件</p>
        <p type="p">20:第二外連接器</p>
        <p type="p">25:第二內連接器</p>
        <p type="p">27:第二電路板</p>
        <p type="p">28:第二電性連接組件</p>
        <p type="p">29:第二壓蓋件</p>
        <p type="p">30:第三外連接器</p>
        <p type="p">40:第四外連接器</p>
        <p type="p">H1:第一高度</p>
        <p type="p">H2:第二高度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="481px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623128</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146387</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250925B">H01R25/16</main-classification>
        <further-classification edition="200601120250925B">H01R31/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞市康祥電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN KANGXIANG ELECTRONIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永常</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG- CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張弘典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾軒禾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HSUAN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭振田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>模組化電連接器(二)</chinese-title>
        <english-title>MODULAR ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種組化電連接器，包括殼體、外連接器、內連接器、電性連接組件及壓蓋件，外連接器設置於殼體內，內連接器設置於殼體內之電路板上，其中電路板相對於該殼體底面可具有一第一高度及一第二高度，第一高度與第二高度不相同；藉由可撓性的電性連接組件應用連接，可適應殼體內部不同高度電路板，提升了使用上的多元性及便利性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a modular electrical connector, comprising a housing, an external connector, an internal connector, an electrical connection assembly, and a pressing component. The external connector is installed inside the housing, while the internal connector is mounted on a circuit board within the housing. The circuit board can be positioned at a first height or a second height relative to the bottom surface of the housing, where the first height and the second height are different. By employing a flexible electrical connection assembly, the connector can accommodate circuit boards of varying heights inside the housing, enhancing versatility and convenience in use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一外連接器</p>
        <p type="p">15:第一內連接器</p>
        <p type="p">17:第一電路板</p>
        <p type="p">18:第一電性連接組件</p>
        <p type="p">30:第三外連接器</p>
        <p type="p">H2:第二高度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="593px" img-content="tif" inline="yes" orientation="portrait" width="751px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623100</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146389</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120241227B">H01R12/70</main-classification>
        <further-classification edition="200601120241227B">H01R13/504</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞市康祥電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN KANGXIANG ELECTRONIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永常</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG- CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張弘典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾軒禾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HSUAN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭振田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電連接器結構</chinese-title>
        <english-title>ELECTRICAL CONNECTOR STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種電連接器結構，包括電性連接組件及補強板，電性連接組件包括組件本體以及設置於組件本體的複數個線路，該等線路具有第一連接端及第二連接端；以及補強板，設置於第二連接端，補強板一面為補強板焊接面，另一面為接觸金手指面，補強板焊接面上設有一補強板焊接區，該接觸金手指面與第二連接端之該等線路相互接觸。本發明藉由於電性連接組件之補強板與鐵殼件直接焊接，加強了連接結構穩定性，使電或信號能的有效傳遞，並且，藉由電性連接組件之線路的特定排列設置，降低訊號衰減。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an electrical connector structure, which includes an electrical connection component and a reinforcing plate. The electrical connection component includes a component body and a plurality of circuits provided on the component body. The circuits have first connection ends and the second connection ends. ; and a reinforcing plate, arranged at the second connection end. One side of the reinforcing plate is the welding surface of the reinforcing plate, and the other side is the contact gold finger surface. The welding surface of the reinforcing plate is provided with a reinforcing plate welding area, which contacts the gold finger. The lines on the surface and the second connection end are in contact with each other. The present invention strengthens the stability of the connection structure by directly welding the reinforcing plate and the iron shell of the electrical connection component, enabling effective transmission of electricity or signal energy. Moreover, through the specific arrangement and arrangement of the lines of the electrical connection component, Reduce signal attenuation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電連接器結構</p>
        <p type="p">10:電性連接組件</p>
        <p type="p">102:第一連接端</p>
        <p type="p">104:第二連接端</p>
        <p type="p">11:組件本體</p>
        <p type="p">12:補強板</p>
        <p type="p">122:補強板焊接面</p>
        <p type="p">123:補強板焊接區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="629px" img-content="tif" inline="yes" orientation="portrait" width="752px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623103</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146390</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250218B">H01R12/72</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞市康祥電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN KANGXIANG ELECTRONIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永常</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG- CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張弘典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUNG-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾軒禾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HSUAN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭振田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電連接器結構</chinese-title>
        <english-title>ELECTRICAL CONNECTOR STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種電連接器結構，包括有連接器接頭及控制基板；控制基板其一端設有連接器連接區及其另一端設有訊號線連接區，控制基板於訊號線連接區之正反面設有第一、三訊號連接組，控制基板於連接器連接區之正面設有第二、四訊號連接組，將第一、二訊號連接組及第三、四訊號連接組透過佈線方式具相對應之電性連接；藉此，連接器接頭所設之上下排第一、二連接端子組其焊接端，僅需於連接器連接區之正面分別與第二、四訊號連接組電性連接，即達成連接器接頭之上下排第一、二連接端子組相對與訊號線連接區正反面之第一、三訊號連接組形成電性導通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an electrical connector structure, comprising a connector head and a control substrate. One end of the control substrate is provided with a connector connection area, while the other end is equipped with a signal wire connection area. On the front and back surfaces of the signal wire connection area of the control substrate, there are first and third signal connection groups. On the front surface of the connector connection area of the control substrate, second and fourth signal connection groups are arranged. The first and second signal connection groups, as well as the third and fourth signal connection groups, are electrically connected through routing. Through this design, the welding ends of the upper and lower rows of the first and second connector terminal groups of the connector head only need to be electrically connected to the second and fourth signal connection groups on the front surface of the connector connection area. This achieves electrical continuity between the upper and lower rows of the first and second connector terminal groups of the connector head and the first and third signal connection groups on the front and back surfaces of the signal wire connection area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接器接頭</p>
        <p type="p">11:第一連接端子組</p>
        <p type="p">111:第一連接端子</p>
        <p type="p">112:第一訊號連接端</p>
        <p type="p">113:第一焊接端</p>
        <p type="p">12:第二連接端子組</p>
        <p type="p">121:第二連接端子</p>
        <p type="p">122:第二訊號連接端</p>
        <p type="p">123:第二焊接端</p>
        <p type="p">13:固定接腳</p>
        <p type="p">2:控制基板</p>
        <p type="p">21:連接器連接區</p>
        <p type="p">22:訊號線連接區</p>
        <p type="p">23:第一焊接面</p>
        <p type="p">24:第二焊接面</p>
        <p type="p">25:定位孔</p>
        <p type="p">26:凸部</p>
        <p type="p">3:第一訊號連接組</p>
        <p type="p">4:第二訊號接點組</p>
        <p type="p">6:第四訊號接點組</p>
        <p type="p">8:定位焊接區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="769px" img-content="tif" inline="yes" orientation="portrait" width="816px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621758</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146391</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A61N2/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林升遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林升遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>添加有磁能材料之載體結構</chinese-title>
        <english-title>A CARRIER STRUCTURE WITH MAGNETIC ENERGY MATERIALS ADDED</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一種添加有磁能材料之載體結構，其中:載體結構進一步具有內空間以及活動接觸人體之磁發部；另設磁發模組及微金屬模組相互混合後添加於內空間，又磁發模組係包含一鐵料、一釹料、一硼料及一鎘料以粉末型態相互混合後再予以熔融固化，而微金屬模組以各種金屬粉末型態混鍊於該磁發模組內，該載體結構藉由該磁發模組及該微金屬模組的混合後予以容置在內空間，使其使用者進行配掛、穿戴等直接/間接接觸於人體，透過該磁發模組所產生的磁場以中和、調整人體本身、環境周遭所存在的磁場，讓人體機能保持在健康的運作，減少病痛的產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a carrier structure with magnetic energy materials added, wherein: the carrier structure further has an inner space and a magnetic hair part that can move and contact the human body; a magnetic hair module and a micro-metal module are mixed with each other and then added to the inner space, and the magnetic hair part is The hair mold set includes an iron material, a neodymium material, a boron material and a cadmium material that are mixed with each other in powder form and then melted and solidified, and the micro-metal module is mixed with various metal powder forms in the magnetic hair mold In the group, the carrier structure is contained in the inner space after being mixed with the magnetic hair module and the micro-metal module, so that the user can directly/indirectly contact the human body through hanging, wearing, etc., through the magnetic hair module. The magnetic field generated by the hair module can neutralize and adjust the magnetic field existing in the human body itself and the surrounding environment, so as to maintain the healthy operation of human body functions and reduce the occurrence of diseases.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:載體結構</p>
        <p type="p">101:內空間</p>
        <p type="p">102:磁發部</p>
        <p type="p">20:磁發模組</p>
        <p type="p">30:微金屬模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="659px" img-content="tif" inline="yes" orientation="portrait" width="923px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622333</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146392</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250206B">E03C1/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博麟水電材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOLIN CORPORATION LTD. (ERIC)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏進中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, JIN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊益松</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>落水頭</chinese-title>
        <english-title>DRAIN HEAD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提出了一種適用於浴室地板的高效落水頭設計，具備顯著的快速排水功能。該落水頭包含框體、兩組導水板、落水板及落水孔，安裝於浴室地板時，其框體上方可配合多種市售排水孔蓋，下方則與排水系統連接。設計上，兩組導水板安裝於框體與落水板之間，藉此在框體與落水板之間形成明顯的高度落差，有效提升排水速度。尤其是第二導水板自框體朝下傾斜連接至落水板，使水流能快速引導至落水孔，徹底避免水分在落水頭內部滯留。此設計大幅降低了細菌與蚊蟲滋生的風險，顯著減少清潔頻率與維護負擔，從而有效提升浴室環境的整體潔淨度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This creation presents an efficient drain head design for bathroom floors, featuring rapid drainage capabilities. The drain head comprises a frame, two sets of guide plates, a drainage plate, and a drainage hole. When installed on a bathroom floor, the frame can accommodate various commercial drain covers on its top, while connecting to the drainage system below. Structurally, the two sets of guide plates are positioned between the frame and the drainage plate, creating a notable height difference that effectively enhances drainage speed. Notably, the second guide plate is angled downward from the frame to the drainage plate, ensuring water is swiftly directed to the drainage hole, thoroughly preventing water from stagnating within the drain head. This design significantly reduces the risks of bacterial and mosquito breeding, minimizes cleaning frequency and maintenance efforts, and thereby enhances the overall cleanliness and usability of the bathroom environment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:落水頭</p>
        <p type="p">11:框體</p>
        <p type="p">111:第一圍板</p>
        <p type="p">112:第二圍板</p>
        <p type="p">12:第一導水板</p>
        <p type="p">121:第一頂邊</p>
        <p type="p">122:第一底邊</p>
        <p type="p">123:第一斜邊</p>
        <p type="p">13:第二導水板</p>
        <p type="p">131:第二頂邊</p>
        <p type="p">132:第二底邊</p>
        <p type="p">133:第二斜邊</p>
        <p type="p">14:落水板</p>
        <p type="p">15:落水孔</p>
        <p type="p">16:安裝框</p>
        <p type="p">161:頂面板</p>
        <p type="p">162:下扣框</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="733px" img-content="tif" inline="yes" orientation="portrait" width="970px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621788</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146393</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250115B">B01J13/02</main-classification>
        <further-classification edition="200601120250115B">C04B18/14</further-classification>
        <further-classification edition="202201120250115B">B09B3/00</further-classification>
        <further-classification edition="200601120250115B">C22B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸致瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡和霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, SHIN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臧君翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSANG, CHUN-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>以廢鑄砂製作中空球體的方法、中空球體</chinese-title>
        <english-title>METHOD FOR PRODUCING HOLLOW SPHERE FROM WASTE CAST SAND, AND HOLLOW SPHERE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種以廢鑄砂製作中空球體的方法，及一種中空球體。以廢鑄砂製作中空球體的方法包含將水、包括黏結劑的製漿組分與包括氧化矽、氧化鋁及氧化鋯的廢鑄砂混合製成一漿料，在總量100wt%的該漿料中該廢鑄砂佔40wt%至60wt%；將該漿料進行造粒而形成多顆實心顆粒；及將該等實心顆粒進行熱處理後冷卻，而使該等實心顆粒因熱化學反應轉化成多顆中空球體。每一中空球體包含一陶瓷外殼且該陶瓷外殼含有四方晶相氧化鋯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention provides a method for producing hollow sphere from waste cast sand, and a hollow sphere. Said method for producing hollow spheres with waste cast sand comprises making a slurry with water, a binder, and a waste cast sand including silica, alumina and zirconia, said waste cast sand is contained from 40 wt% to 60 wt% in said slurry in a total amount of 100 wt%. Granulating said slurry to form a plurality of solid granules. Cooling said solid granules after thermal treatment to convert said solid granules into a plurality of hollow spheres by thermal chemical reaction.. Each hollow sphere comprises a ceramic shell ,and said ceramic shell contains tetragonal phase zirconia.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="641px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621817</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146394</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">B21J5/02</main-classification>
        <further-classification edition="200601120241230B">B21J13/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張燦勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CAN-XUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林原誌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUAN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高玉駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>雙頭製品之鍛造成形裝置</chinese-title>
        <english-title>FORGING DEVICE FOR DOUBLE-HEADED PRODUCTS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種雙頭製品之鍛造成形裝置，包含一下模單元及一上模單元。該下模單元包括一下模座、一設置於該下模座上的成形座，及二設置於該成形座上的複動機構。該成形座具有一設置於該下模座的承座體，及二可移動地設置於該承座體上的下模仁。該上模單元可受控制而向下靠近該下模單元以與該等下模仁合模，該上模單元與該等下模仁相配合界定出一上端頭特徵區段，當該上模單元持續下壓該等複動機構時，每一複動機構會向內推動相對應下模仁，使該等下模仁與該承座體相配合界定出一下端頭特徵區段，藉此可一次性地鍛造出雙頭製品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A forging device for double-headed products comprising a lower mold unit and an upper mold unit including a lower mold seat, a forming seat disposed on the lower mold seat, and two dual mold mechanisms disposed on the forming seat. The forming seat has a receiving body disposed on the lower mold seat, and two lower mold cores movably disposed on the receiving body. The upper mold unit is controllable to move downward toward the lower mold unit to engage the lower mold cores, the upper mold unit and the lower mold cores cooperatively defining an upper head feature section, each of the dual mold mechanisms pushing inwardly a corresponding one of the lower mold cores such that the lower mold cores cooperate with the receiving body to define a lower head feature section thereby forging a double-headed product at a time as the upper mold unit continues to depress the dual mold mechanisms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:下模單元</p>
        <p type="p">21:下模座</p>
        <p type="p">22:成形座</p>
        <p type="p">221:設置座體</p>
        <p type="p">222:承座體</p>
        <p type="p">223:下模仁</p>
        <p type="p">224:外斜面</p>
        <p type="p">23:複動機構</p>
        <p type="p">231:滑塊</p>
        <p type="p">232:拉伸彈簧</p>
        <p type="p">233:楔型塊</p>
        <p type="p">234:接觸斜面</p>
        <p type="p">235:壓抵斜面</p>
        <p type="p">24:頂出桿</p>
        <p type="p">3:上模單元</p>
        <p type="p">31:上模座</p>
        <p type="p">32:沖床</p>
        <p type="p">33:上模仁</p>
        <p type="p">331:通槽</p>
        <p type="p">34:沖頭</p>
        <p type="p">35:緩衝彈簧</p>
        <p type="p">36:楔型導板</p>
        <p type="p">361:導斜面</p>
        <p type="p">37:壓縮彈簧</p>
        <p type="p">38:壓塊</p>
        <p type="p">4:胚料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="1020px" img-content="tif" inline="yes" orientation="portrait" width="596px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621956</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146397</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250214B">B65D51/30</main-classification>
        <further-classification edition="200601120250214B">B65D81/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏泩科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRYTECH CORPORATION LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許蒼宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, TSANG HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>密封罐之罐蓋結構</chinese-title>
        <english-title>A LID STRUCTURE OF A SEALED CAN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種密封罐之罐蓋結構，係在密封罐的罐蓋設一開放式容槽，容槽中可拆卸嵌設有一體式吸濕塊；透過該一體式吸濕塊的設置，能直接將吸濕塊組裝在罐蓋上，不須外包裝，且能與空氣大面積直接接觸，不需要再如傳統散狀顆粒式吸濕材須以包裝材包裝後才能安置在罐蓋上，可以提高密封罐內的吸濕效果。此外，還進一步在罐蓋對應接觸罐身之開口端面的表面處，一體形成有一道以上的環狀形變阻氣圈；當罐蓋與罐身鎖緊時，環狀形變阻氣圈因受到鎖緊壓力產生形變，並因此緊貼於罐身的開口端面上，形成如同緊密的密封圈，使罐蓋與罐身之間得到多重的氣密效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a lid structure of a sealed can, in which the lid of the sealed can is provided with an open-type container, in which a one-piece moisture-absorbent block is detachably embedded; through the setting of the one-piece moisture-absorbent block, the moisture-absorbent block can be directly assembled on the lid of the can, which does not need to be externally packaged, and it can have direct contact with the air on a large scale, and does not need to be packaged in packaging materials as the traditional bulk particle-type moisture-absorbent material before it is placed on the lid, which can enhance the moisture-absorbing effect in the sealed can. In addition, more than one annular deformation gas barrier ring is integrally formed on the surface of the lid corresponding to the open end surface of the can body; when the lid and the can body are locked, the annular deformation gas barrier ring is locked due to the tight pressure produces deformation, and therefore it is close to the open end surface of the can body, forming a tight sealing ring, which achieves multiple air-tight effects between the lid and the can body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:罐蓋</p>
        <p type="p">11:端面</p>
        <p type="p">12:容槽</p>
        <p type="p">121:周壁</p>
        <p type="p">13:夾持件</p>
        <p type="p">131:卡掣部</p>
        <p type="p">14:淺槽</p>
        <p type="p">15:蓋板</p>
        <p type="p">16:吸濕變色顯示材</p>
        <p type="p">17:孔洞</p>
        <p type="p">18:日期標示部件</p>
        <p type="p">181:月標示區</p>
        <p type="p">183:月指示件</p>
        <p type="p">1831:月選定孔</p>
        <p type="p">2:吸濕塊</p>
        <p type="p">21:彈性環</p>
        <p type="p">211:卡環</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="745px" img-content="tif" inline="yes" orientation="portrait" width="870px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622392</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146398</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241223B">F16C29/04</main-classification>
        <further-classification edition="200601120241223B">F16C43/04</further-classification>
        <further-classification edition="201701120241223B">A47B88/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川湖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE WORKS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊順和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KAI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>滑軌總成</chinese-title>
        <english-title>SLIDE RAIL ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑軌總成包含一第一軌、一第二軌、一助滑裝置、一彈性件以及一輔助件。該第一軌安排有一預定結構；該助滑裝置活動地安裝在該第一軌與該第二軌；該彈性件安排至該助滑裝置，且該彈性件包含一預定特徵；該輔助件安排至該第二軌；當該第二軌相對該第一軌從一延伸位置往一開啟方向卸下的過程中，該輔助件會與該彈性件的預定特徵相互接觸，用以將該助滑裝置往該開啟方向帶動至與該預定結構相互卡掣的一預定位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A slide rail assembly includes a first rail, a second rail, an aid-sliding device, a resilient member and an auxiliary member. The first rail is arranged with a predetermined structure. The aid-sliding device is movably mounted between the first rail and the second rail. The resilient member is arranged at the aid-sliding device and includes a predetermined feature. The auxiliary member is arranged at the second rail. During a process that the second rail is detached from an extending position in an opening direction, the auxiliary member and the predetermined feature of the resilient member contact one another in order to carry the aid-sliding device to a predetermined position where the aid-sliding device engaging with the predetermined structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:滑軌總成</p>
        <p type="p">22:第一軌</p>
        <p type="p">22a,24a,45a:第一端</p>
        <p type="p">22b,24b,45b:第二端</p>
        <p type="p">24:第二軌</p>
        <p type="p">26:第三軌</p>
        <p type="p">28:助滑裝置</p>
        <p type="p">30:彈性件</p>
        <p type="p">32:輔助件</p>
        <p type="p">36a,60a:第一牆</p>
        <p type="p">36b,60b:第二牆</p>
        <p type="p">38:縱向牆</p>
        <p type="p">42:第一預定特徵</p>
        <p type="p">44:預定結構</p>
        <p type="p">45:擋部</p>
        <p type="p">46:主體</p>
        <p type="p">48:滾動件</p>
        <p type="p">50:第二預定特徵</p>
        <p type="p">52:連接部</p>
        <p type="p">54:彈性部</p>
        <p type="p">56:預定穿孔</p>
        <p type="p">58:卡掣特徵</p>
        <p type="p">64:軸件</p>
        <p type="p">66:彈性特徵</p>
        <p type="p">68:基座</p>
        <p type="p">70:第一工作件</p>
        <p type="p">72:第二工作件</p>
        <p type="p">74:彈性結構</p>
        <p type="p">76:第一釋放件</p>
        <p type="p">77:第二釋放件</p>
        <p type="p">78:第一軸部</p>
        <p type="p">80:第二軸部</p>
        <p type="p">D1:開啟方向</p>
        <p type="p">R:收合位置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="757px" img-content="tif" inline="yes" orientation="portrait" width="1037px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621602</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146399</doc-number>
          <kind></kind>
          <date>113/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120241223B">A47B88/40</main-classification>
        <further-classification edition="200601120241223B">H05K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川湖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE WORKS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊順和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁子承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, TZU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>滑軌機構及其托架裝置</chinese-title>
        <english-title>SLIDE RAIL MECHANISM AND BRACKET DEVICE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑軌機構包含一滑軌以及一托架裝置。該托架裝置安排至該滑軌且包含一補強件、一第一托架、一第一支撐件、一第二支撐件及一第二托架。該補強件連接至該滑軌。該第一托架安排至該滑軌與該補強件的其中之一；該第一支撐件與該第二支撐件可相對該補強件活動；該第二托架安排至該第二支撐件；該補強件與該第一支撐件可相對彼此選擇性地卡掣於不同的預定位置，使該第一托架的一第一安裝件與該第二托架的一第二安裝件之間具有不同的距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A slide rail mechanism includes a slide rail and a bracket device. The bracket device is arranged at the slide rail and includes a reinforcing member, a first bracket, a first supporting member, a second supporting member and a second bracket. The reinforcing member is connected to the slide rail. The first bracket is arranged at one of the slide rail and the reinforcing member. The first supporting member and the second supporting member are movable relative to the reinforcing member. The second bracket is arranged at the second supporting member. The reinforcing member and the first supporting member are selectively engaged with one another at different predetermined positions such that different distances are defined between a first mounting member of the first bracket and a second mounting member of the second bracket.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:滑軌機構</p>
        <p type="p">22:滑軌</p>
        <p type="p">24:托架裝置</p>
        <p type="p">26:活動軌</p>
        <p type="p">28:補強件</p>
        <p type="p">30:第一托架</p>
        <p type="p">32:第一支撐件</p>
        <p type="p">34:第二支撐件</p>
        <p type="p">36:第二托架</p>
        <p type="p">44:第一安裝件</p>
        <p type="p">56:第二安裝件</p>
        <p type="p">62:卡掣特徵</p>
        <p type="p">66:彈性件</p>
        <p type="p">68:第一安裝特徵</p>
        <p type="p">70:第二安裝特徵</p>
        <p type="p">E1,E1’:第一端</p>
        <p type="p">E2,E2’:第二端</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="669px" img-content="tif" inline="yes" orientation="portrait" width="1006px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621854</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146406</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250214B">B25B1/02</main-classification>
        <further-classification edition="200601120250214B">B25B1/20</further-classification>
        <further-classification edition="200601120250214B">B25B1/24</further-classification>
        <further-classification edition="200601120250214B">B25B11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>協威機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪逸博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, YI-PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡建全</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>氣壓/液壓式夾具定位裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種氣壓/液壓式夾具定位裝置，用於將虎鉗等夾持裝置快速定位在夾具定位裝置上面，其包括基座、汽缸、作動件、活塞及四個定位柱等。該基座內有容置空間、四個定位孔，並設有進壓和洩壓通道。該汽缸的頂端對應裝入容置空間，汽缸設有作動軸與徑向突塊，突塊內有頂推件，頂推件末端為V形尖部。使用時，從基座的進壓通道輸入氣體/液壓以推動活塞上下移動，使作動件亦隨之上升或下降帶動頂推件徑向移動，使頂推件的V形尖部嵌入或脫離定位柱的定位凹槽，藉此實現對虎鉗等夾持裝置快速定位與鬆開的功能，特別適用於自動化加工的領域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基座</p>
        <p type="p">12:定位孔</p>
        <p type="p">14:進壓通道</p>
        <p type="p">15:洩壓通道</p>
        <p type="p">17:吹氣通道</p>
        <p type="p">18:管接頭</p>
        <p type="p">20:汽缸</p>
        <p type="p">22:軸孔</p>
        <p type="p">23:徑向導槽</p>
        <p type="p">24:限位座</p>
        <p type="p">30:作動件</p>
        <p type="p">31:作動軸</p>
        <p type="p">32:徑向突塊</p>
        <p type="p">40:四個頂推件</p>
        <p type="p">42:V形尖部</p>
        <p type="p">50:活塞</p>
        <p type="p">51:螺栓</p>
        <p type="p">60:定位柱</p>
        <p type="p">61:螺絲孔</p>
        <p type="p">62:定位凹槽</p>
        <p type="p">70:底蓋</p>
        <p type="p">71:氣密凸環</p>
        <p type="p">72:螺絲</p>
        <p type="p">80:彈性元件</p>
        <p type="p">81:碟形彈簧</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="1086px" img-content="tif" inline="yes" orientation="portrait" width="720px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621580</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146407</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120241230B">A23L25/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建綠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIAN-LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建綠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIAN-LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>花生加工設備、花生加工方法及花生麻糬捲結構</chinese-title>
        <english-title>PEANUT PROCESSING APPARATUS, PEANUT PROCESSING METHOD AND PEANUT MOCHI ROLL STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開一種花生加工設備，其包括：粉碎機、進料缸、控制裝置與計時器。粉碎機設有進料口、出料口與托盤，粉碎機用於將來自進料口的熟花生仁粉碎成花生粉與/或花生碎，並使花生粉與/或花生碎自出料口落至托盤。進料缸與進料口連通且用於接收熟花生仁。控制裝置用以接收粉碎指令後，根據粉碎指令控制粉碎機粉碎一粉碎量的花生粉與/或花生碎。計時器設置於粉碎機的外側；計時器用於自控制裝置控制粉碎機進行粉碎時或粉碎機結束粉碎時開始進行計時，並顯示時間資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a peanut processing apparatus, which includes a crusher, a feeding cylinder, a control device and a timer. The crusher is provided with an inlet, an outlet and a tray. The crusher is configured to crush cooked peanut kernels from the inlet into peanut powder and/or crushed peanuts, and let the peanut powder and/or crushed peanuts fall from the outlet to the tray. The feeding cylinder communicates with the inlet and is configured to receive the cooked peanut kernels. After receiving a crushing command, the control device controls the crusher to crush a crushing amount of the peanut powder and/or crushed peanuts according to the crushing command. The timer is disposed on the outside of the crusher. The timer is configured to start timing when the control device controls the crusher for crushing or when the crusher ends crushing, and display time information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:花生加工設備</p>
        <p type="p">110:粉碎機</p>
        <p type="p">112:進料口</p>
        <p type="p">114:出料口</p>
        <p type="p">116:托盤</p>
        <p type="p">120:進料缸</p>
        <p type="p">130:控制裝置</p>
        <p type="p">132:輸入單元</p>
        <p type="p">134:顯示單元</p>
        <p type="p">140:計時器</p>
        <p type="p">142:顯示器</p>
        <p type="p">F:出料方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="789px" img-content="tif" inline="yes" orientation="portrait" width="683px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621814</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146409</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250213B">B21D22/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人金屬工業研究發展中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METAL INDUSTRIES RESEARCH &amp; DEVELOPMENT CENTRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張蕙稘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HUI-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>沖床連續模與沖床系統</chinese-title>
        <english-title>STAMPING CONTINUOUS MOLD AND STAMPING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的沖床連續模包含矩形模座、沖裁部、二模座定位孔及二模座夾持部。沖裁部設置於矩形模座並形成虛擬定位基準線將矩形模座分為連續區及傳送區。每一模座夾持部與每一模座定位孔對應。當沖床連續模放置於第一沖床設備時，虛擬定位基準線對齊第一工作台的第一虛擬工作台基準線，二模座夾持部分別對應第一工作台上的二第一設置部；當沖床連續模放置於第二沖床設備時，虛擬定位基準線對齊第二工作台的第二虛擬工作台基準線，二模座夾持部分別對應第二工作台上的二第二設置部。藉此可適用於不同沖床設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a stamping continuous mold including a rectangular bracket, a cutting potion, two bracket positioning holes and two bracket clamping portions. The cutting potion is disposed at the rectangular bracket and forms a virtual positioning line to divide the rectangular bracket into a continuous area and a transferring area. Each bracket clamping portion corresponds to each bracket positioning hole. As the stamping continuous mold is disposed at the first stamping apparatus, the virtual positioning line is aligned with a first virtual worktable line of a first worktable, and the two bracket clamping portions respectively correspond to two first disposing portions of the first worktable. As the stamping continuous mold is disposed at the second stamping apparatus, the virtual positioning line is aligned with a second virtual worktable line of a second worktable, and the two bracket clamping portions respectively correspond to two second disposing portions of the second worktable. Therefore, the stamping continuous mold can be used in different stamping apparatuses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:沖床連續模</p>
        <p type="p">1203:模座夾持部</p>
        <p type="p">1210:沖裁部</p>
        <p type="p">1211,1212,1213,1214:零件</p>
        <p type="p">1211a:穿孔</p>
        <p type="p">1212a:卡合凹</p>
        <p type="p">L2:虛擬定位基準線</p>
        <p type="p">P1,P2,P3,P4,P5,P6,P7,P8:工作位置</p>
        <p type="p">S1:連續區</p>
        <p type="p">S2:傳送區</p>
        <p type="p">X:長度方向</p>
        <p type="p">Y:寬度方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="692px" img-content="tif" inline="yes" orientation="portrait" width="916px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622972</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146410</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250425B">G11C11/54</main-classification>
        <further-classification edition="202301120250425B">G06N3/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳巍仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-ZEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體內運算裝置、系統及其操作方法</chinese-title>
        <english-title>COMPUTE IN MEMORY DEVICE, SYSTEM AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體內運算裝置，包含記憶體電路、字元線驅動電路、偵測電路以及電壓調製電路。記憶體電路，包括平行排列的多個記憶體區塊透過多條位元線彼此耦接一起，每一記憶體區塊具有多個記憶體單元分別和該多位元線對應耦接，一字元線以及一電源線耦接該複數個記憶體單元。字元線驅動電路，根據二進位輸入數值產生類比驅動電流透過字元線驅動此多個記憶體單元。偵測電路偵測此類比驅動電流。電壓調製電路，根據類比驅動電流檢測輸出電流變異，以根據輸出電流變異產生操作電壓透過電源線提供給此多個記憶體單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The compute in memory device includes a memory circuit, a word line driving circuit, a detection circuit and a voltage modulation circuit. The memory circuit includes a plurality of memory blocks arranged in parallel and coupled to each other through a plurality of bit lines. Each memory block has a plurality of memory cells respectively coupled to the plurality of bit lines, a word line and a power line coupled to the plurality of memory cells. The word line driving circuit generates an analog driving current according to the binary input value to drive the plurality of memory cells through the word line. The detection circuit detects this analog driving current. The voltage modulation circuit detects the variation of the output current based on the analog driving current, and generates an operating voltage based on the variation of the output current to provide to the plurality of memory units through the power line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體內運算裝置</p>
        <p type="p">110:偵測電路</p>
        <p type="p">120:電壓調製電路</p>
        <p type="p">130:字元線驅動電路</p>
        <p type="p">140:記憶體電路</p>
        <p type="p">131,132…13N:數位類比轉換電路</p>
        <p type="p">141,142…14N:記憶體區塊</p>
        <p type="p">151,152,…,15N:字元線</p>
        <p type="p">161,162,…,16W:位元線</p>
        <p type="p">171,172,…,17N:電源線</p>
        <p type="p">W&lt;sub&gt;11&lt;/sub&gt;、W&lt;sub&gt;12&lt;/sub&gt;、W&lt;sub&gt;13&lt;/sub&gt;…W&lt;sub&gt;NW&lt;/sub&gt;:記憶體單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="715px" img-content="tif" inline="yes" orientation="portrait" width="892px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621987</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146411</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C01D15/00</main-classification>
        <further-classification edition="201001120241220B">H01M10/0563</further-classification>
        <further-classification edition="200601120241220B">H01M10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇　育陞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎　玉龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE, NGOC LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武　氏姮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, THI HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多硫化物溶液及其製備方法</chinese-title>
        <english-title>POLYSULFIDE SOLUTION AND PREPARTION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種多硫化物溶液及其製備方法。多硫化物溶液的製備方法包括以下操作。混合硫、多環芳香烴、金屬與溶劑以形成反應混合物，其中金屬包括鹼金屬、鹼土金屬或其組合。使反應混合物中的多環芳香烴與金屬反應以形成錯合物，其中錯合物包括帶負電的多環芳香烴與金屬離子。使錯合物中的金屬離子與硫反應以形成多硫化物溶液。多硫化物溶液包括金屬多硫化物、多環芳香烴以及與金屬多硫化物和多環芳香烴混合的溶劑。金屬多硫化物包括鹼金屬多硫化物、鹼土金屬多硫化物或其組合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a polysulfide solution and a preparation method thereof. The preparation method of the polysulfide solution includes the following operations. Sulfur, a polycyclic aromatic hydrocarbon, a metal, and a solvent are mixed to form a reaction mixture, in which the metal includes an alkali metal, an alkaline earth metal, or a combination thereof. The polycyclic aromatic hydrocarbon and the metal in the reaction mixture are reacted to form a coordination complex, in which the coordination complex includes a negatively charged polycyclic aromatic hydrocarbon and a metal ion. The metal ion in the coordination complex and the sulfur are reacted to form the polysulfide solution. The polysulfide solution includes a metal polysulfide, the polycyclic aromatic hydrocarbon, and the solvent mixed with the metal polysulfide and the polycyclic aromatic hydrocarbon. The metal polysulfide includes an alkali metal polysulfide, an alkaline earth metal polysulfide, or a combination thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110、120、130:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="714px" img-content="tif" inline="yes" orientation="portrait" width="893px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622993</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146413</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250303B">G16H30/40</main-classification>
        <further-classification edition="201801120250303B">G16H30/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏碁股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACER INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯亮宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, LIANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>醫療影像檔的文字解碼方法及電子裝置</chinese-title>
        <english-title>TEXT DECODING METHOD FOR MEDICAL IMAGE FILE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種醫療影像檔的文字解碼方法及電子裝置。所述方法適用於電子裝置，並包括下列步驟。讀取一醫療影像檔中的一字符集標籤。判斷字符集標籤是否為一預設標籤值。反應於字符集標籤為預設標籤值，根據電子裝置的作業系統語系決定一當前字符編碼標準。根據當前字符編碼標準解碼醫療影像檔的文字內容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides an text decoding method for medical image file and an electronic device. The method includes the following steps. A character set tag in a medical image file is read. Whether the character set tag is a predetermined tag value is determined. In response to the character set tag being a predetermined tag value, a current character coding standard is determined according to operating system language of the electronic device. Text content of the medical image file is decoded according to the current character coding standard.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S350:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="519px" img-content="tif" inline="yes" orientation="portrait" width="701px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623282</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146414</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200901120250303B">H04W4/14</main-classification>
        <further-classification edition="202201120250303B">H04L51/21</further-classification>
        <further-classification edition="202101120250303B">H04W12/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中華電信股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNGHWA TELECOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古勇勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, YUNG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鴻鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONG-PONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴季夆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳品瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PIN-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>詐騙簡訊示警系統及其方法</chinese-title>
        <english-title>FRAUD SHORT MESSAGE WARNING SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種詐騙簡訊示警系統及其方法，分別與原發訊簡訊中心及用戶終端通訊連接，詐騙簡訊示警系統包括信號處理模組、簡訊分析模組以及分別與信號處理模組、簡訊分析模組電性連接或通訊連接的簡訊示警模組。信號處理模組用以接收原發訊簡訊中心的簡訊，並且將簡訊傳送至簡訊分析模組。簡訊分析模組用以對簡訊進行疑似詐騙機率分析，以獲取分析結果。簡訊示警模組用以依據分析結果判斷是否進行示警處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fraud short message warning system and method thereof are communicated with an original message center and a user terminal respectively, the fraud short message warning system includes a signal processing module, a message analysis module and a message warning module, the message warning module is electrically or communicatively connected to the signal processing module and the message analysis module respectively. The signal processing module is used to receive a message from the original message center and transmit the message to the message analysis module. The message analysis module is used to analyze the probability of suspected fraud in the message to obtain an analysis result. The message warning module is used to determine whether to perform warning processing according to the analysis result.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:詐騙簡訊示警系統</p>
        <p type="p">20:原發訊簡訊中心</p>
        <p type="p">30:用戶終端</p>
        <p type="p">100:信號處理模組</p>
        <p type="p">200:簡訊示警模組</p>
        <p type="p">300:簡訊分析模組</p>
        <p type="p">400:資料庫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="670px" img-content="tif" inline="yes" orientation="portrait" width="803px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623486</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146415</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250306B">H10H29/851</main-classification>
        <further-classification edition="202501120250306B">H10H29/855</further-classification>
        <further-classification edition="202501120250306B">H10H29/856</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭有斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>白光發光結構</chinese-title>
        <english-title>WHITE LIGHT EMITTING STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種白光發光結構，包括藍色發光二極體、反射結構、黃色光轉換元件以及黃色濾光元件。反射結構包括凹槽，且藍色發光二極體重疊於凹槽。黃色光轉換元件位於該藍色發光二極體之上，且被配置為將藍色發光二極體發出的藍光的一部分轉換成黃光。黃色濾光元件位於黃色光轉換元件之上。在垂直於藍色發光二極體的出光面的第一方向上，黃色光轉換元件朝向藍色發光二極體的底面重疊於藍色發光二極體的一部分，且不重疊於藍色發光二極體的另一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A white light emitting structure includes a blue light emitting diode, a reflective structure, a yellow light conversion element and a yellow filter element. The reflective structure includes a groove, and the blue light-emitting diode overlaps the groove. The yellow light conversion element is located above the blue light emitting diode and is configured to convert part of the blue light emitted by the blue light emitting diode into yellow light. The yellow filter element is located above the yellow light conversion element. In a first direction perpendicular to a light-emitting surface of the blue light-emitting diode, a bottom surface of the yellow light conversion element facing to the blue light-emitting diode overlaps a portion of the blue light-emitting diode and do not overlap another portion of the blue light-emitting diode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:白光發光結構</p>
        <p type="p">100:電路基板</p>
        <p type="p">110:接墊</p>
        <p type="p">200:藍色發光二極體</p>
        <p type="p">202:出光面</p>
        <p type="p">210:電極</p>
        <p type="p">220:半導體堆疊</p>
        <p type="p">310:反射結構</p>
        <p type="p">312:凹槽</p>
        <p type="p">312b:底面</p>
        <p type="p">312s:側壁</p>
        <p type="p">320A:透明結構</p>
        <p type="p">321,331:底面</p>
        <p type="p">332,342:通孔</p>
        <p type="p">330A:黃色光轉換元件</p>
        <p type="p">340A:黃色濾光元件</p>
        <p type="p">350:遮光層</p>
        <p type="p">352:第一開口</p>
        <p type="p">D1:第一方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="633px" img-content="tif" inline="yes" orientation="portrait" width="774px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622185</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146417</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C08L97/00</main-classification>
        <further-classification edition="200601120241220B">C08L101/16</further-classification>
        <further-classification edition="201801120241220B">C08K3/013</further-classification>
        <further-classification edition="200601120241220B">C08J3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王賢明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王賢明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HSIEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>生物可分解母粒、其製造加工方法及其製品</chinese-title>
        <english-title>BIODEGRADABLE MASTERBATCH, ITS MANUFACTURING AND PROCESSING METHOD AND ITS PRODUCTS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種生物可分解母粒、其製造加工方法及其製品，其中，該母粒係包含20 wt％至85 wt％之生物可分解材料、0 wt％至70wt％之無機粉體，以及 2 wt％至50 wt％之植物纖維；其係透過將前述材料混合後，透過批式熔融混煉；而後押出以製成母粒；藉此，本發明透過無機粉體與植物纖維之加入，使可提升母粒及其製品整體物性之強度、韌性及分解速度。並且利用利用電荷、極性力、凡得瓦耳力、表面橋接等作用，並採用機械研磨法及化學法，目的在於破除硬團聚及預防性之避免再重新團聚，對粉末材料的顆粒表面做化學性或物理性的修飾，使其表面性質因而發生變化，成為易於分散在特定界質的另一相材料中。採用批式熔融混煉，再以押出形成之母粒，可使無機粉體與植物纖維於生物可分解材料中均勻分佈，使確保其本身及所製成製品之品質，後續即可透過將母粒藉由押出、射出、吸塑或吹製形成各式製品，如：容器、餐具、包材、廚房衛浴用品、家庭用品等，並可適用於一次性產品，經後續加工成型所製得之產品具有家園堆肥標準，原料及產品能夠分解成水（H        &lt;sub&gt;2&lt;/sub&gt;O）、二氧化碳（CO        &lt;sub&gt;2&lt;/sub&gt;）及有（無）機物生物養分，達到生物循環，產品埋於土壤內經微生物分解作用轉化成土壤中有機碳的生物養分讓植物吸收，對環境品質優異的功效，藉可有助於替代降低塑膠製品之使用，以減少塑膠汙染及對環境之危害，進而可達致環境保護與減碳之目標者。      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a biodegradable masterbatch, its manufacturing and processing method, and its products. The masterbatch comprises 20 wt% to 85 wt% of biodegradable material, 0 wt% to 70 wt% of inorganic powder, and 2 wt% to 50 wt% of plant fiber. The masterbatch is produced by mixing the above materials, followed by batch melt blending and extrusion. By incorporating inorganic powder and plant fibers, the invention enhances the overall physical properties of the masterbatch and its products, including strength, toughness, and decomposition rate. Additionally, the invention employs mechanisms such as electrostatic charges, polar forces, van der Waals forces, and surface bridging, along with mechanical grinding and chemical methods, to break hard agglomerates and prevent re-agglomeration. This process chemically or physically modifies the surface properties of the powder particles, making them easier to disperse into another phase material within a specific medium. By adopting batch melt mixing followed by extrusion to form masterbatches, inorganic powders and plant fibers can be uniformly distributed within biodegradable materials, ensuring the quality of both the material itself and the resulting products. These masterbatches can subsequently be processed through extrusion, injection molding, thermoforming, or blow molding to create various products such as containers, tableware, packaging materials, kitchen and bathroom items, and household goods. They are also suitable for single-use products. The products formed through further processing meet the standards for home composting. The raw materials and finished products can decompose into water (H₂O), carbon dioxide (CO₂), and organic or inorganic biological nutrients, achieving a biological cycle. When buried in soil, these products are broken down by microorganisms into organic carbon, which serves as a nutrient for plants, thereby contributing positively to environmental quality. This invention can help reduce the use of plastic products, thereby minimizing plastic pollution and its harmful impact on the environment, ultimately contributing to the goals of environmental protection and carbon reduction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S001~S004:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="848px" img-content="tif" inline="yes" orientation="portrait" width="518px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622458</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146423</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">G01B11/24</main-classification>
        <further-classification edition="202001120250401B">G02B30/54</further-classification>
        <further-classification edition="201101120250401B">G06T15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, DON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳啟桐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖和信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>物件三維外型影像擷取系統與方法</chinese-title>
        <english-title>OBJECT 3D PROFILE IMAGE CAPTURE SYSTEM AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種物件三維外型影像擷取系統，用以經由評價複數張切層影像的聚焦品質變化找出待測物的三維外型輪廓，該系統包括照相裝置、移動裝置及控制裝置。照相裝置包括:鏡頭模組及影像感知器成像模組，及由鏡頭模組及影像感知器成像模組之相對關係位置對應出的待測物側聚焦平面。移動裝置用以使照相裝置相對於待測物沿移動路徑運動，移動路徑不垂直待測物側聚焦平面。控制裝置與照相裝置及移動裝置電性連接，以控制移動裝置移動，並於照相裝置相對於待測物沿移動路徑運動時，控制照相裝置取得待測物之複數張切層影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object 3D profile image capture system and method are used to find the appearance contour of an object by evaluating changes in focus quality of multiple slice images. The system includes a camera device, a mobile device, and a control device. The camera device includes a lens module and an image sensor imaging module. The lens module and the image sensor imaging module form a focus plane. The moving device is used to move the camera device along an imaging path relative to the object, and the imaging path is not perpendicular to the focus plane. The control device is electrically connected to the camera device and the mobile device to control the movement of the mobile device, and when the camera device moves along the imaging path, it controls the camera device to obtain a plurality of slice images of the object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:物件外型影像擷取系統</p>
        <p type="p">17:感知器偏差夾角</p>
        <p type="p">70:第一平面</p>
        <p type="p">71:第一平面法線</p>
        <p type="p">80:第一平面上之移動路徑</p>
        <p type="p">90:待測物</p>
        <p type="p">11b:鏡頭模組</p>
        <p type="p">111:鏡頭光學中心軸線</p>
        <p type="p">15c、15d、15e:待測物側聚焦平面</p>
        <p type="p">151:待測物側聚焦平面法線</p>
        <p type="p">13:影像感知器成像平面</p>
        <p type="p">131:影像感知器成像平面法線</p>
        <p type="p">20:移動裝置</p>
        <p type="p">21:第一軸移載導軌</p>
        <p type="p">22:第二軸移載導軌</p>
        <p type="p">23:第三軸移載導軌</p>
        <p type="p">30:待測物平台</p>
        <p type="p">35:待測物平台參考平面</p>
        <p type="p">50:控制裝置</p>
        <p type="p">31:可視範圍(FOV)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="676px" img-content="tif" inline="yes" orientation="portrait" width="1088px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622660</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146424</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250124B">G05B19/42</main-classification>
        <further-classification edition="200601120250124B">G05B19/048</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立虎尾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL FORMOSA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>雲林縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈金鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, CHIN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹炳熾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAN, BING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIR-JANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯信宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, HSIN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡文修</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>工具機產業價值鏈工程品質記錄系統</chinese-title>
        <english-title>ENGINEERING QUALITY RECORDING SYSTEM FOR THE MACHINE TOOL INDUSTRY VALUE CHAIN</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種工具機產業價值鏈工程品質記錄系統，其包含有一原材料記錄模組、一生產過程監控模組、一可用度計算模組、一品質管理模組、一生命週期管理模組及一報告與分析模組，該原材料記錄模組係對工具機生產過程中的原材料的品質進行記錄，該生產過程監控模組係與該原材料記錄模組訊號連接，係對工具機的加工、組裝和測試過程進行實時監控，該可用度計算模組係與該生產過程監控模組訊號連接，其係計算工具機的可用度，該品質管理模組係與該生產過程監控模組訊號連接，其係對每一環節的品質數據進行收集、分析和報告生成，該生命週期管理模組係與可用度計算模組及品質管理模組訊號連接，其係用以追蹤工具機的整個生命週期，該報告與分析模組係與該生命週期管理模組訊號連接，其係通過數據分析生成詳細報告。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an engineering quality recording system for the machine tool industry value chain, which includes a raw material recording module, a production process monitoring module, an availability calculation module, a quality management module, a life cycle management module, and a reporting and analysis module.        &lt;br/&gt;The raw material recording module is designed to record the quality of raw materials used in the production process of the machine tool. The production process monitoring module is signal-connected to the raw material recording module and is applied to real-time monitor the processing, assembling and testing of the machine tool.        &lt;br/&gt;The availability calculation module is signal-connected to the production process monitoring module and is applied to calculate the availability of the machine tool. The quality management module is also signal-connected to the production process monitoring module and is applied to collect, analyze and generates reports on quality data for each production stage.        &lt;br/&gt;The life cycle management module is signal-connected to the availability calculation module and the quality management module, enabling tracking of the entire life cycle of machine tools. Finally, the reporting and analysis module is signal-connected to the lifecycle management module and is applied to generate detailed reports through data analysis.      </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:原材料記錄模組</p>
        <p type="p">20:生產過程監控模組</p>
        <p type="p">30:可用度計算模組</p>
        <p type="p">40:品質管理模組</p>
        <p type="p">50:生命週期管理模組</p>
        <p type="p">60:報告與分析模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="955px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623375</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146432</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250122B">H10D30/01</main-classification>
        <further-classification edition="202501120250122B">H10D30/69</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游政昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, JHENG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JHE-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝文元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, WEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>製備半導體裝置的方法與半導體裝置</chinese-title>
        <english-title>METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體裝置，包含基板、通道層、阻障層、閘極結構、介電層、閘極插塞以及閘極連接墊。通道層設置於基板上；阻障層設置於通道層上；閘極結構設置於部分阻障層上；介電層設置於阻障層與閘極結構上；閘極插塞設置於介電層中並與閘極結構接觸；以及閘極連接墊設置於閘極插塞上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided, including: a substrate, a channel layer, a barrier layer, a gate structure, a dielectric layer, a gate plug and a gate connection pad. The channel layer is disposed on the substrate; the barrier layer is disposed on the channel layer; the gate structure is disposed on part of the barrier layer; the dielectric layer is disposed on the barrier layer and the gate structure; the gate plug is disposed on the dielectric layer and in contact with the gate structure; and the gate connection pad is disposed on the gate plug.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:基板</p>
        <p type="p">120:閘極結構</p>
        <p type="p">130:汲極電極</p>
        <p type="p">140:源極電極</p>
        <p type="p">150:閘極匯流排</p>
        <p type="p">152:閘極連接墊</p>
        <p type="p">154:閘極插塞</p>
        <p type="p">162:汲極連接墊</p>
        <p type="p">164:汲極插塞</p>
        <p type="p">172:源極連接墊</p>
        <p type="p">174:源極插塞</p>
        <p type="p">A-A:線段</p>
        <p type="p">A1:主動區</p>
        <p type="p">A2:隔離區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="662px" img-content="tif" inline="yes" orientation="portrait" width="782px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622209</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146434</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241220B">C09K5/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張際銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHI MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FU YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志青</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>奈米冰晶</chinese-title>
        <english-title>NANO ICE CRYSTAL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種奈米冰晶，實質上由40重量百分比的鹽、55重量百分比的水、1重量百分比的碳粉及4重量百分比的黏稠劑所組成，其中該奈米冰晶係藉由該鹽、該水、該碳粉及該黏稠劑混合所形成，且該奈米冰晶的潛熱值為水的40倍至50倍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A nano ice crystal is essentially composed of 40 wt% of salt, 55 wt% of water, 1 wt% of carbon powder, and 4 wt% of pasting agent, wherein the nano ice crystal is formed by mixing the salt, the water, the toner, and the binder, and the nano ice crystal has a latent heat value of 40 to 50 times that of water.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622836</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146435</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250210B">G06Q20/08</main-classification>
        <further-classification edition="201201120250210B">G06Q20/24</further-classification>
        <further-classification edition="202301120250210B">G06Q30/06</further-classification>
        <further-classification edition="202301120250210B">G06Q40/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>點點全球股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝瑞庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>支付整合系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一支付整合系統包括電連接處理單元的通訊單元和記憶單元；該通訊單元供通訊連接終端使用者裝置、第一點數發行方系統、第一商家販售系統和金融系統；該記憶單元存有會員資料、第一點數發行方資料和第一商家資料；該處理單元接收對應該第一點數發行方資料的第一額度請求而產生第一額度；當透過該通訊單元自該終端使用者裝置接收對應該會員資料和該第一商家資料的第一消費折抵額度時，該處理單元將該第一額度減去該第一消費折抵額度，且接收對應虛擬信用卡請求的虛擬卡號，並使用該虛擬卡號直接給付該第一消費折抵額度至該第一商家販售系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:支付整合系統</p>
        <p type="p">110:通訊單元</p>
        <p type="p">120:處理單元</p>
        <p type="p">130:記憶單元</p>
        <p type="p">210:第一點數發行方系統</p>
        <p type="p">300:終端使用者裝置</p>
        <p type="p">410:第一商家販售系統</p>
        <p type="p">411:零售支付機台</p>
        <p type="p">500:金融系統</p>
        <p type="p">510:國際卡組織系統</p>
        <p type="p">520:銀行系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="722px" img-content="tif" inline="yes" orientation="portrait" width="1049px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623376</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146437</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250122B">H10D30/01</main-classification>
        <further-classification edition="202501120250122B">H10D30/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游政昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, JHENG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JHE-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝文元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, WEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置與其製作方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，包含具有主動區以及隔離區的半導體基板、設置在主動區上的閘極結構、汲極電極與源極電極，其中汲極電極與源極電極位於閘極結構的兩側。半導體裝置包含介電層、閘極連接墊、閘極插塞，與第一場板。介電層覆蓋半導體基板、閘極結構、汲極電極與源極電極。閘極連接墊設置於介電層上且於垂直投影上重疊閘極結構，閘極插塞設置在介電層中並位於半導體基板的主動區上，以電性連接閘極連接墊與閘極結構。第一場板設置於介電層上與閘極連接墊同層且與閘極連接墊相隔開來，其中閘極連接墊的材料與第一場板的材料相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a semiconductor substrate having an active region and an isolation region, a gate structure, a drain electrode, and a source electrode disposed on the active region, in which the drain electrode and the source electrode are disposed at opposite sides of the gate structure. The semiconductor device includes a dielectric layer, a gate pad, gate plugs, and a first field plate. The dielectric layer covers the semiconductor substrate, the gate structure, the drain electrode, and the source electrode. The gate pad is disposed on the dielectric layer and overlaps the gate structure in a vertical projection. The gate plugs are disposed in the dielectric layer and on the active region, to electrically interconnect the gate pad and the gate structure. The first field plate is disposed on the dielectric layer in the same layer as the gate pad and is spaced apart from the gate pad. The material of the gate pad is the same as the material of the first field plate. A method of forming the semiconductor device is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:半導體基板</p>
        <p type="p">120:閘極結構</p>
        <p type="p">130:汲極電極</p>
        <p type="p">140:源極電極</p>
        <p type="p">150:閘極匯流排</p>
        <p type="p">152:閘極連接墊</p>
        <p type="p">154:閘極插塞</p>
        <p type="p">162:汲極連接墊</p>
        <p type="p">164:汲極插塞</p>
        <p type="p">172:源極連接墊</p>
        <p type="p">174:源極插塞</p>
        <p type="p">A-A:線段</p>
        <p type="p">A1:主動區</p>
        <p type="p">A2:隔離區</p>
        <p type="p">FP1:第一場板</p>
        <p type="p">FP2:第二場板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="701px" img-content="tif" inline="yes" orientation="portrait" width="979px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623261</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146438</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">H04N23/51</main-classification>
        <further-classification edition="202301120250303B">H04N23/50</further-classification>
        <further-classification edition="201801120250303B">H04N13/204</further-classification>
        <further-classification edition="201801120250303B">H04N13/246</further-classification>
        <further-classification edition="201801120250303B">H04N13/271</further-classification>
        <further-classification edition="201701120250303B">G06T7/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耐能智慧股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNERON (TAIWAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張蘇瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝必克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, BIKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李湘村</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HSIANGTSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴奕良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YI-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭瑋倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, WEI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多攝像單元構造及裝置</chinese-title>
        <english-title>MULTI-CAMERA UNIT STRUCTURE AND DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種多攝像單元構造，包含第一攝像單元、第二攝像單元、第三攝像單元和校正影像產生單元。第二攝像單元係相距第一距離而設置於其與第一攝像單元所形成之第一方向，第一攝像單元及第二攝像單元以第一攝像單元為取像基準，對標的物取得第一景深影像。第三攝像單元係相距第二距離而設置於其與第一或第二攝像單元所形成之第二方向，第二方向與第一方向形成夾角，第三攝像單元與第一或第二攝像單元以第一或第二攝像單元為取像基準，對標的物取得第二景深影像，校正影像產生單元根據第一景深影像及第二景深影像以取得校正景深影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a multi-camera unit structure, which includes a first camera unit, a second camera unit, a third camera unit and a correct-image generation unit. The second camera unit is distant from the first camera unit with a first preset distance in a first direction. With taking the first camera unit as an imaging reference, the first and the second camera units obtain a first DOF image of a target object. The third camera unit is distant from the first camera unit with a second preset distance in a second direction. The first and second directions define an included angle. With taking the first camera unit as an imaging reference, the third and the first camera units obtain a second DOF image of the target object. The correct-image generation unit obtains a corrected DOF image according to the first and the second DOF images.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多攝像單元構造</p>
        <p type="p">110:第一攝像單元</p>
        <p type="p">120:第二攝像單元</p>
        <p type="p">130:第三攝像單元</p>
        <p type="p">140:第一軌道單元</p>
        <p type="p">150:第二軌道單元</p>
        <p type="p">160:校正影像產生單元</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">D1:第一距離</p>
        <p type="p">D2:第二距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="771px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622454</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146441</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260303B">G01B9/00</main-classification>
        <further-classification edition="200601120260303B">G01C11/00</further-classification>
        <further-classification edition="202601120260303B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華洋精機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭賢德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宣復</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宇樞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具有反射鏡之半導體檢測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有反射鏡之半導體檢測裝置，包含有：一主架體，具有一第一架體及固設於該第一架體的一第二架體；一攝影機及一光源，分別設於該第一架體及該第二架體，該攝影機具有一取像方向，該光源具有一照射方向；一反射鏡；以及一檢測台；其中，該取像方向與該照射方向兩者中，其中一者係與該台面之法線相夾一第一預定角度，另一者則經由該反射鏡之反射而與該台面之該法線相夾一第二預定角度；該攝影機與該光源係位於該法線之同一側，且與該第一預定角度的夾角位置同側，並且與該第二預定角度的夾角位置不同側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:具有反射鏡之半導體檢測裝置</p>
        <p type="p">11:主架體</p>
        <p type="p">12:第一架體</p>
        <p type="p">14:第二架體</p>
        <p type="p">21:攝影機</p>
        <p type="p">31:光源</p>
        <p type="p">41:反射鏡</p>
        <p type="p">51:檢測台</p>
        <p type="p">52:台面</p>
        <p type="p">91:待檢測物</p>
        <p type="p">C:取像方向</p>
        <p type="p">F:法線</p>
        <p type="p">L:虛擬直線</p>
        <p type="p">P:照射方向</p>
        <p type="p">θ1:第一預定角度</p>
        <p type="p">θ2:第二預定角度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="996px" img-content="tif" inline="yes" orientation="portrait" width="721px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621598</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146442</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250224B">A45F3/04</main-classification>
        <further-classification edition="200601120250224B">A45C13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞東學校財團法人亞東科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃秀鳳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃信嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝煒勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>具隱藏雨衣之兒童背包</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種具隱藏雨衣之兒童背包，包含具置物包體及背帶之背包本體，背帶設置於置物包體後側，其中置物包體之左或右側部具有四個穿設部；設於左或右側部之鉤架體，具有凸球、延伸支架與中央支架，中央支架一端與延伸支架固接，另端具擋止部，延伸支架之另端與凸球固接，其中延伸支架由穿設部穿過而固定於上側面；收納包體固設於左或右側部，其為防水材且具四邊形底面與由底面四邊延伸連接之三角面，三角面朝底面中心摺收形成收納空間，中央支架與凸球穿設於底面而位於收納空間內，三角面尖端之扣合孔與凸球相互扣合；雨衣係連接於底面並可捲收或摺收於收納空間；及受中央支架穿設而遮蓋於收納包體之矽膠蓋體，下表面設有口徑小於凸球直徑之凹部，以於受壓時套設於凸球。據此，係可消除雨具攜帶之不便並提供孩童面對突發下雨天氣時之良好解決方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:兒童背包</p>
        <p type="p">10:背包本體</p>
        <p type="p">101:置物包體</p>
        <p type="p">1011:前側部</p>
        <p type="p">1012:左側部</p>
        <p type="p">1013:右側部</p>
        <p type="p">1014:後側部</p>
        <p type="p">102:背帶</p>
        <p type="p">11:鉤架體</p>
        <p type="p">12:收納包體</p>
        <p type="p">122:三角面</p>
        <p type="p">1221:扣合孔</p>
        <p type="p">14:矽膠蓋體</p>
        <p type="p">143:發光區</p>
        <p type="p">15:第一反光條</p>
        <p type="p">16:第二反光條</p>
        <p type="p">17:氣墊區</p>
        <p type="p">B:虛擬矩形面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="909px" img-content="tif" inline="yes" orientation="portrait" width="679px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622497</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146443</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250321B">G01N27/00</main-classification>
        <further-classification edition="200601120250321B">G01N27/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人國家實驗研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL APPLIED RESEARCH LABORATORIES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳峰志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FONG-ZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭文澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, WEN-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林奕成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHU-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柔甄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ROU-JHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>多單元氣體感測器</chinese-title>
        <english-title>MULTI-UNIT GAS SENSOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種多單元氣體感測器，供感測氣體，其包含基板以及複數個感測單元。基板包含第一表面以及通孔，通孔貫穿基板，且在第一表面具有氣體入口，氣體可由第一表面之外側往第一表面流動，由氣體入口進入並通過通孔。複數個感測單元設置於第一表面，且均勻地圍繞氣體入口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-unit gas sensor for sensing gas is disclosed. The multi-unit gas sensor includes a substrate and a plurality of sensing units. The substrate includes a first surface and a through hole. The through hole penetrates the substrate and has a gas inlet on the first surface. The gas is capable of flowing from outside the first surface to the first surface, entering through the gas inlet and passing through the through hole. A plurality of sensing units are disposed on the first surface and evenly surround the gas inlet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">110:第一表面</p>
        <p type="p">120:通孔</p>
        <p type="p">121:氣體入口</p>
        <p type="p">200:感測單元</p>
        <p type="p">300:氣體</p>
        <p type="p">400:筒狀導流裝置</p>
        <p type="p">401:導流裝置入口</p>
        <p type="p">410:內側</p>
        <p type="p">500:氣體驅動裝置</p>
        <p type="p">910:多單元氣體感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="1001px" img-content="tif" inline="yes" orientation="portrait" width="620px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623161</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146445</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">H02M1/084</main-classification>
        <further-classification edition="200701120241231B">H02M1/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀業翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, YEH-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游明弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MING-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林保全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PAO-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電力轉換系統及其方法</chinese-title>
        <english-title>POWER CONVERSION SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電力轉換方法包含偵測電力轉換電路的輸出電流訊號；根據輸出電流訊號產生電流調整訊號；根據電流調整訊號產生多個控制訊號；及根據該些控制訊號中之一者輸出叢發訊號組至對應的功率電路以控制其多個功率開關。叢發訊號組包含多個叢發訊號。各該叢發訊號包括多個叢發區間，且兩相鄰的該些叢發區間之間具有叢發間隔。功率電路於各該叢發區間操作於工作模式及於各該叢發間隔操作於休止模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power conversion method includes detecting an output current signal of a power conversion circuit; generating a current adjusting signal according to the output current signal; generating a plurality of control signals according to the current adjusting signal; and outputting, according to one of the control signals, a burst signal set to a corresponding power circuit to control a plurality of power switches thereof. The burst signal set includes a plurality of burst signal. Each of the burst signal includes a plurality of burst zones, and there is a bust interval between two adjacent burst zones. The power circuit operates in a working mode during each of the burst zones and operates in a resting mode during each of the burst interval.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S301~S307:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="375px" img-content="tif" inline="yes" orientation="portrait" width="517px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622752</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146447</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F13/10</main-classification>
        <further-classification edition="200601120250303B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商星宸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIGMASTAR TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳泉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, QUAN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜維生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, WEI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豔雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAN-XIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱礽</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置的啟動流程及電子裝置的晶片</chinese-title>
        <english-title>BOOT PROCESS OF ELECTRONIC DEVICE AND CHIP OF ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了電子裝置的啟動流程及晶片。晶片耦接外部記憶體、周邊介面電路及儲存裝置。儲存裝置儲存外部記憶體資訊及複數個外部記憶體初始化檔案。晶片包含：介面控制電路、記憶體以及計算電路。介面控制電路用來控制周邊介面電路。計算電路用來執行儲存於記憶體的程式碼及/或程式指令以執行以下步驟：透過周邊介面電路得到一數值；根據該數值產生一索引值；根據該索引值及該外部記憶體資訊，從該些外部記憶體初始化檔案中決定一目標外部記憶體初始化檔案；以及，載入該目標外部記憶體初始化檔案的一外部記憶體參數至該記憶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A boot process and a chip of an electronic device are provided. The chip is coupled to an external memory, a peripheral interface circuit, and a storage device. The storage device stores external memory information and multiple external memory initialization files. The chip includes an interface control circuit, a memory, and a computing circuit. The interface control circuit is configured to control the peripheral interface circuit. The computing circuit is configured to execute program codes and/or program instructions stored in the memory to perform the following steps: obtaining a value through the peripheral interface circuit; generate an index value based on the value; determining a target external memory initialization file from the external memory initialization files based on the index value and the external memory information; and loading an external memory parameter of the target external memory initialization file into the memory.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:啟動流程</p>
        <p type="p">110:ROM執行程序</p>
        <p type="p">310:周邊介面電路初始化程序</p>
        <p type="p">320:外部記憶體參數載入程序</p>
        <p type="p">330:啟動載入器執行程序</p>
        <p type="p">S122,S124,S126,S128,S332:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="632px" img-content="tif" inline="yes" orientation="portrait" width="834px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623480</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146448</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250224B">H10H29/30</main-classification>
        <further-classification edition="202501120250224B">H10H29/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田堃正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, KUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>透明顯示器</chinese-title>
        <english-title>TRANSPARENT DISPLAY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種透明顯示器，其包含：顯示面板和驅動電路晶片。顯示面板包含複數個像素結構。驅動電路晶片電性連接至顯示面板，且沿著第一方向設置。像素結構包含：高輝度發光元件和第一至第四黑色矩陣。第一和第二黑色矩陣係沿著第二方向延伸，且彼此相對。第一方向與第二方向互相垂直。第三和第四黑色矩陣位於第一和第二黑色矩陣之間。第三和第四黑色矩陣係沿著第一方向延伸，且彼此相對。第一至第四黑色矩陣係環繞高輝度發光元件。高輝度發光元件與第一至第四黑色矩陣之間具分別具有第一至第四距離。第四距離為其中最小者，且大於或等於40微米。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transparent displayer is provided. The transparent displayer includes: a display panel and driver chips. The display panel includes pixel structures. The driver chips are electrically connected to the display panel, and disposed along a first direction. The pixel structure includes: a high brightness light-emitting element and fist to fourth black matrixes. The first and second black matrixes are extended along a second direction and opposite to each other. The first direction is vertical to the second direction. The third and fourth black matrixes are located between the first and second black matrixes. The third and fourth black matrixes are extended along the first direction, and opposite to each other. The first to fourth black matrix surrounds the high brightness light-emitting element. First to fourth distances are respectively located between the high brightness light-emitting element and the first to fourth black matrixes. The fourth distance is a minimum distance among the first to fourth distances, and greater than or equal to 40 um.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210~240:黑色矩陣</p>
        <p type="p">L1~L4:距離</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">GL:高輝度發光元件</p>
        <p type="p">RA:接合區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="717px" img-content="tif" inline="yes" orientation="portrait" width="898px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622932</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146449</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241231B">G09F9/33</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>友達光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭有斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置及其修復方法</chinese-title>
        <english-title>DISPLAY DEVICE AND REPAIRING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包含陣列基板、反射絕緣層及遮光層。陣列基板具有多個畫素區，各畫素區包含多個子畫素單元，各子畫素單元包含第一接墊及發光元件，第一接墊設置於陣列基板上，發光元件設置於第一接墊上以電連接第一接墊。反射絕緣層設置於第一接墊上並圍繞發光元件，於各畫素區中，反射絕緣層具有至少一凹陷部，且凹陷部對應子畫素單元的其中之一。遮光層設置於反射絕緣層上並圍繞發光元件，於各畫素區中，遮光層具有位於凹陷部中的填充部，且填充部對應子畫素單元的前述其中之一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes an array substrate, a reflective insulating layer and a light shielding layer. The array substrate has multiple pixel areas. Each pixel area includes a multiple sub-pixel units. Each sub-pixel unit includes a first pad and a light emitting element. The first pad is disposed on the array substrate. The light emitting element is disposed on the first pad to electrically connect to the first pad. The reflective insulating layer is disposed on the first pad and surrounds the light emitting element. In each pixel area, the reflective insulating layer has at least one recessed part, and the recessed part corresponds to one of the sub-pixel units. The light shielding layer is disposed on the reflective insulating layer and surrounds the light emitting element. In each pixel area, the light shielding layer has a filling part located in the recessed part, and the filling part corresponds to the aforementioned one of the sub-pixel units.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:陣列基板</p>
        <p type="p">102:反射絕緣層</p>
        <p type="p">102s:圍繞部</p>
        <p type="p">102r:凹陷部</p>
        <p type="p">104:遮光層</p>
        <p type="p">104c:覆蓋部</p>
        <p type="p">104f:填充部</p>
        <p type="p">E1:第一電極</p>
        <p type="p">LE:發光元件</p>
        <p type="p">P1:第一接墊</p>
        <p type="p">t1、t2:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="418px" img-content="tif" inline="yes" orientation="portrait" width="488px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622386</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146452</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">F16B37/04</main-classification>
        <further-classification edition="200601120241230B">F16B39/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>惠亞工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERO VERIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN TEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>抗舉螺帽及具有該抗舉螺帽之支撐裝置</chinese-title>
        <english-title>ANTI-LIFTING NUT AND SUPPORT DEVICE HAVING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抗舉螺帽，包括：支撐頂板，係為一金屬板體，且中央設有一螺孔以供一桿體穿設；圓管部，係與該支撐頂板一體鍛造成型，該圓管部之外周緣係位於該支撐頂板之外周緣內側，且該圓管部之內徑係大於該桿體之外徑；以及凹槽，係環繞形成於該圓管部之外周面。藉由本發明之實施，可藉由圓管部中空管狀的結構，及將圓管部與支撐頂板一體鍛造成型的方式，以大幅提昇抗舉螺帽的材料與結構強度，進而在不減損抗舉螺帽支撐能力的同時大幅減少其材料用量、縮小其尺寸，並降低抗舉螺帽及具有該抗舉螺帽之支撐裝置的重量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An anti-lifting nut, includes a metallic supporting top plate with a screw hole; a round tube portion forged and formed together with the supporting top plate, wherein the outer edge of the round tube portion is located inside the outer edge of the supporting top plate and the inner diameter of the round tube portion is larger than the outer diameter of the opening; and a recess formed around the outer surface of the round tube portion. By the implementation of the present disclosure, the strength of the anti-lifting nut can be improved by the hollow structure of the round tube portion and forging the round tube portion and the supporting top plate integrally, thereby reducing the amount of material and the size of the anti-lift nut without compromising its support capability, and reducing the weights of the anti-lift nut and the support device with it.</p>
      </isu-abst>
      <representative-img>
        <p type="p">15:抗舉螺帽</p>
        <p type="p">151:支撐頂板</p>
        <p type="p">151a:轉動部</p>
        <p type="p">1510:螺孔</p>
        <p type="p">151p:螺紋</p>
        <p type="p">152:圓管部</p>
        <p type="p">153:凹槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="437px" img-content="tif" inline="yes" orientation="portrait" width="589px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622387</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146453</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251030B">F16B39/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>惠亞工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERO VERIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIEN TEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>抗舉螺帽及具有該抗舉螺帽之支撐裝置</chinese-title>
        <english-title>ANTI-LIFTING NUT AND SUPPORT DEVICE HAVING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種抗舉螺帽，包括：支撐頂板，係為一金屬板體，且其中央設有一螺孔以供一桿體穿設；圓管部，係焊接結合於該支撐頂板之底部，該圓管部之外周緣係位於該支撐頂板之外周緣內側，且該圓管部之內徑係大於該螺孔及該桿體之外徑；以及凹槽，係環繞形成於該圓管部之外周面。藉由本發明之實施，可使抗舉螺帽藉由其中空管狀的圓管部減輕該抗舉螺帽本身及具有該抗舉螺帽之支撐裝置整體的重量，並藉由將中空管狀的圓管部焊接結合於板狀的支撐頂板的方式以簡化抗舉螺帽的製程並降低其製造成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An anti-lifting nut, includes a supporting top plate that is a metal plate with a screw hole in its center for a rod to penetrate; a round tube portion that is welded to the bottom of the supporting top plate, wherein the outer edge of the round tube portion is located inside the outer edge of the supporting top plate and the inner diameter of the round tube portion is larger than the outer diameters of the opening and the rod; and a recess that is formed around the outer surface of the round tube portion. By the implementation of the present disclosure, the weights of the anti-lifting nut and the supporting device having the anti-lifting nut can be reduced by the hollow tube type round tube portion of the anti-lifting nut. In the meantime, the production process can be simplified and the cost of production can be reduced for the anti-lifting nut by welding the hollow tube type round tube portion to the supporting top plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">15:抗舉螺帽</p>
        <p type="p">151:支撐頂板</p>
        <p type="p">151a:轉動部</p>
        <p type="p">1510:螺孔</p>
        <p type="p">151p:螺紋</p>
        <p type="p">152:圓管部</p>
        <p type="p">154:焊道</p>
        <p type="p">155:空心孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="502px" img-content="tif" inline="yes" orientation="portrait" width="520px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622880</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146454</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250303B">G06Q50/06</main-classification>
        <further-classification edition="202301120250303B">G06Q10/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福爾摩沙氣候智慧服務有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMOSA CLIMATE SMART SERVICE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹榮軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, JUNG-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉憶玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, I WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡采佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSAI-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林暐盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>以用電量推估碳排放量的方法</chinese-title>
        <english-title>METHOD TO ESTIMATE CARBON EMISSION BASED ON ELECTRICITY CONSUMPTION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種以用電量推估碳排放量的方法。該方法包括一資料輸入步驟、一電費數據提供步驟、一全年用電量推估步驟、一範疇二排放量計算步驟、一年度總排放量計算步驟以及一範疇一排放量計算步驟。可透過一運算處理器從一資料庫獲得所儲存的一電費數據轉換為全年用電量，進而推估出該範疇一排放量以及該範疇二排放量。藉此，對於尚無進行溫室氣體盤查、無揭露排放量的企業，則可透過該企業的用電量或每月電費單數據而進行碳排放量的推估，藉此以降低該企業所耗費的資源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method to estimate carbon emission based on electricity consumption. The method involves a data input step, an electricity bill data providing step, an annual electricity consumption estimation step, a scope two emission calculation step, an annual total emission calculation step and a scope one emission calculation step. The stored electricity bill data may be obtained from a database through a computing processor and converted into an annual electricity consumption, thereby estimating the emissions of the scope one emission and the scope two emission. In this way, for companies that have not conducted greenhouse gas inventories and have not disclosed their emissions, carbon emissions may be estimated based on the company's electricity consumption or monthly electricity bill data so as to reduce the resources consumed by the company.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:以用電量推估碳排放量的方法</p>
        <p type="p">S110~S160:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="784px" img-content="tif" inline="yes" orientation="portrait" width="662px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622820</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146455</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q10/06</main-classification>
        <further-classification edition="202301120250303B">G06Q10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兆豐國際商業銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGA INTERNATIONAL COMMERCIAL BANK CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪聖樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林暉鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HUI-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林銘嬋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MING-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏錩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世章</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>資料化工作流程系統</chinese-title>
        <english-title>DATA-DRIVEN WORKFLOW SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種資料化工作流程系統，包括使用者介面、處理器及資料庫。處理器連接使用者介面及資料庫。資料庫包含工作流程代號資料表及工作流程步驟資料表。資料化工作流程系統執行以下運作：使用者介面接收包含工作流程名稱的執行流程命令；處理器根據流程名稱在資料庫中尋找工作流程的代號及工作流程步驟；以及處理器在資料庫中新增執行資料表，且根據工作流程步驟執行工作流程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data-driven workflow system includes a user interface, a processor, and a database. The processor is connected to the user interface and the database. The data-driven workflow system performs the following operations: the user interface receives a workflow executing command, which includes a workflow title. The processor searches a code name of the workflow and a workflow step based on the workflow title. The processor adds an executing data-table and performs the workflow based on the workflow step.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資料化工作流程系統</p>
        <p type="p">110:使用者介面</p>
        <p type="p">120:處理器</p>
        <p type="p">121:更新單元</p>
        <p type="p">122:儲存單元</p>
        <p type="p">123:查詢單元</p>
        <p type="p">124:驗證單元</p>
        <p type="p">130:資料庫</p>
        <p type="p">131:工作流程代號資料表</p>
        <p type="p">132:工作流程步驟資料表</p>
        <p type="p">133:執行資料表</p>
        <p type="p">134:工作流程紀錄資料表</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="701px" img-content="tif" inline="yes" orientation="portrait" width="946px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622439</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146466</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250922B">F28D5/00</main-classification>
        <further-classification edition="200601120250922B">F28F3/02</further-classification>
        <further-classification edition="200601120250922B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張伃昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎修甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HSIU-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許元朧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YUAN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉珉宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MIN-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙開誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, KAI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>散熱支架及電控組件</chinese-title>
        <english-title>HEAT DISSIPATION SUPPORT AND ELECTRONIC CONTROL ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱支架，包括複數散熱板、第一側板和第二側板，散熱板限定長度方向、寬度方向和厚度方向。複數散熱板沿厚度方向間隔設置。各個散熱板分別設有沿寬度方向間隔之第一流道和第二流道。第一側板開設有第一腔室和第二腔室，第一腔室和第二腔室沿散熱板之寬度方向間隔設置。第一側板設有進水口和出水口，進水口連通第一腔室，出水口連通第二腔室。第二側板開設有複數連通道。上述散熱支架中散熱板之兩側板面能夠同時接觸複數目標件，以對目標件散熱。本創作一併提供一種包含該散熱支架之電控組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat dissipation support comprises a plurality of heat dissipation plates, a first side plate and a second side plate, and the heat dissipation plate limits the length direction, width direction and thickness direction Heat dissipation plates are set at intervals along the thickness direction. Each heat dissipation plate is provided with a first channel and a second channel separated along the width direction. The first side plate is provided with a first chamber and a second chamber, and the first chamber and the second chamber are arranged at intervals along the width direction of the heat dissipation plate. The first side plate is provided with a water inlet and a water outlet. The water inlet is connected with the first chamber, and the water outlet is connected with the second chamber. The second side plate is provided with multiple connecting channels. The two sides of the heat dissipation plate in the heat dissipation support can contact multiple target parts at the same time to heat the target parts. The invention also provides an electronic control assembly comprising the heat dissipation support.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:散熱支架</p>
        <p type="p">11:散熱板</p>
        <p type="p">12:第一側板</p>
        <p type="p">13:第二側板</p>
        <p type="p">14:安裝空間</p>
        <p type="p">X:長度方向</p>
        <p type="p">Y:寬度方向</p>
        <p type="p">Z:厚度方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="837px" img-content="tif" inline="yes" orientation="portrait" width="700px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622594</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146467</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250411B">G02B27/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新煒科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　耀坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEE, YEW-KOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖正興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHENG-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116375097</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種顯示裝置，包括：顯示器，包括第一顯示部和第二顯示部，第一顯示部用於發射第一光線，第二顯示部用於發射第二光線，第一光線與第二光線具有不同波長；超構光學結構，包括第一調光部和第二調光部，第一調光部位於第一光線的光路上，第二調光部位於第二光線的光路上，第一調光部用於調控第一光線的傳遞方向且第二調光部用於調控第二光線的傳遞方向，使第一光線以不同於第二光線的角度從超構光學結構射出；投影鏡頭，第一光線以不同於第二光線的射出角度射出；以及光波導，第一光線以非平行於第二光線的入射角度入射至光波導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a display apparatus including a display device including a first display portion and a second display portion, a meta-optical structure including a first modulate portion and a second modulate portion, a projection lens, and an optical waveguide. The first display portion is used to emit a first light beam and the second display portion is used to emit a second light beam, wherein the first light beam and the second light beam have different wavelengths. The first modulate portion is on an optical path of the first light beam and is used to modulate a transmitting direction of the first light beam. The second modulate portion is on an optical path of the second light beam and is used to modulate a transmitting direction of the second light beam. The first light beam and the second light beam exit from the projection lens at different angles. The first light beam and the second light beam incident on the optical waveguide non-parallel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">10:顯示器</p>
        <p type="p">11:第一顯示部</p>
        <p type="p">12:第二顯示部</p>
        <p type="p">20:超構光學結構</p>
        <p type="p">21:第一調光部</p>
        <p type="p">22:第二調光部</p>
        <p type="p">30:投影鏡頭</p>
        <p type="p">40:光波導</p>
        <p type="p">L1:第一光線</p>
        <p type="p">L2:第二光線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="886px" img-content="tif" inline="yes" orientation="portrait" width="606px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622600</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146468</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250626B">G02B27/02</main-classification>
        <further-classification edition="200601120250626B">G02B27/18</further-classification>
        <further-classification edition="200601120250626B">G02B6/12</further-classification>
        <further-classification edition="200601120250626B">G02B6/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新煒科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖正興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHENG-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　耀坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEE, YEW-KOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116375114</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種顯示裝置，包括：第一微顯示器，用於發射第一光線；第一超構光學結構，用於調控所述第一光線的傳遞方向，使所述第一光線非垂直出射；第二微顯示器，用於發射第二光線，所述第一光線與所述第二光線具有不同波長；合光元件，具有出光面，所述第一光線和所述第二光線並藉由所述出光面射出；投影鏡頭，用於接收自所述出光面射出的所述第一光線和所述第二光線，且所述第一光線以不同於所述第二光線的射出角度射出；光波導，所述第一光線以非平行於所述第二光線的入射角度入射至光波導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a display apparatus including a first micro-display for emitting a first light beam, a second micro-display for emitting a second light beam, an first meta-optical structure, a light combining element with a light exiting surface, a projection lens, and an optical waveguide. The first light beam and the second light beam have different wavelengths. The first meta-optical structure is used to modulate transmitting directions of the first light beam and the second light beam. The light combining element is used to transmit the first and second light beams through the exiting surface. The projection lens is used to receive the first and second light beams from the exiting surface. The first light beam and the second light beam exit from the projection lens at different angles. The first light beam and the second light beam incident on the optical waveguide non-parallel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">10:第一微顯示器</p>
        <p type="p">11:第一顯示面</p>
        <p type="p">20:第二微顯示器</p>
        <p type="p">21:第二顯示面</p>
        <p type="p">40:合光元件</p>
        <p type="p">41:出光面</p>
        <p type="p">50:投影鏡頭</p>
        <p type="p">60:光波導</p>
        <p type="p">70:第一超構光學結構</p>
        <p type="p">L1:第一光線</p>
        <p type="p">L2:第二光線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="865px" img-content="tif" inline="yes" orientation="portrait" width="601px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622595</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146469</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250411B">G02B27/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新煒科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖正興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHENG-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　耀坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEE, YEW-KOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411637510X</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種顯示裝置，包括：第一微顯示器，具有第一顯示面，第一微顯示器以非垂直於第一顯示面方向發射第一光線；第二微顯示器，具有第二顯示面，第二微顯示器以非垂直於第二顯示面方向發射第二光線，第一光線與第二光線具有不同波長；合光元件，具有出光面，第一光線和第二光線藉由出光面射出；投影鏡頭，用於接收自出光面射出的第一光線和第二光線，且第一光線以不同於第二光線的射出角度射出；以及光波導，第一光線以非平行於第二光線的入射角度入射至光波導。本申請的顯示裝置可以改善彩虹效應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a display apparatus including a first micro-display having a first display surface for emitting a first light beam, a second micro-display having a second display surface for emitting a second light beam, a light combining element with a light exiting surface, a projection lens, and an optical waveguide. The first light beam and the second light beam have different wavelengths. The light combining element is used to transmit the first and second light beams through the exiting surface. The projection lens is used to receive the first and second light beams from the exiting surface. The first light beam and the second light beam exit from the projection lens at different angles. The first light beam and the second light beam incident on the optical waveguide non-parallel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">10:第一微顯示器</p>
        <p type="p">11:第一顯示面</p>
        <p type="p">20:第二微顯示器</p>
        <p type="p">21:第二顯示面</p>
        <p type="p">40:合光元件</p>
        <p type="p">41:出光面</p>
        <p type="p">50:投影鏡頭</p>
        <p type="p">60:光波導</p>
        <p type="p">L1:第一光線</p>
        <p type="p">L2:第二光線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="844px" img-content="tif" inline="yes" orientation="portrait" width="596px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622596</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146470</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250411B">G02B27/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新煒科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAYPRUS TECHNOLOGIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖正興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHENG-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　耀坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEE, YEW-KOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭明川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, MING-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116375082</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種顯示裝置，包括：第一微顯示器，用於發射第一光線；第二微顯示器，用於發射第二光線，所述第一光線與所述第二光線具有不同波長；合光元件，具有出光面，所述第一光線和所述第二光線藉由所述出光面射出；投影鏡頭，包括透鏡元件和超構光學結構，透鏡元件用於調製第一光線和第二光線，超構光學結構用於調控第一光線和第二光線的傳遞方向，使第一光線以不同於第二光線的角度從所述投影鏡頭射出；光波導，所述第一光線以非平行於所述第二光線的入射角度入射至所述光波導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a display apparatus including first micro-display for emitting a first light beam, a second micro-display for emitting a second light beam, a light combining element with a light exiting surface, a projection lens, and an optical waveguide. The first light beam and the second light beam have different wavelengths. The light combining element is used to transmit the first and second light beams through the exiting surface. The projection lens includes a lens assembly and a meta-optical structure. The lens assembly is used to modulate the first and second light beams, and the meta-optical structure is used to regulate directions of the first and second light beams, so that the first light beam and the second light beam exit from the projection lens at different angles. The first light beam and the second light beam incident on the optical waveguide non-parallel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">10:第一微顯示器</p>
        <p type="p">11:第一顯示面</p>
        <p type="p">20:第二微顯示器</p>
        <p type="p">21:第二顯示面</p>
        <p type="p">40:合光元件</p>
        <p type="p">41:出光面</p>
        <p type="p">50:投影鏡頭</p>
        <p type="p">51:透鏡組件</p>
        <p type="p">52:超構光學結構</p>
        <p type="p">60:光波導</p>
        <p type="p">L1:第一光線</p>
        <p type="p">L2:第二光線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="865px" img-content="tif" inline="yes" orientation="portrait" width="581px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621920</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146471</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120251103B">B60R1/22</main-classification>
        <further-classification edition="200601120251103B">G08C17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃以恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI-HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>盲區輔助顯示系統及汽車</chinese-title>
        <english-title>BLIND AREA AUXILIARY DISPLAY SYSTEM AND VEHICLE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種盲區輔助顯示系統，包括：攝像頭模組，位於汽車的外部，用於獲取所述汽車外部預設範圍內的第一圖像，所述預設範圍包括駕駛員的被所述汽車A柱遮擋的視野盲區；顯示控制模組，電連接所述攝像頭模組，用於接收所述第一圖像，並根據所述第一圖像中的內容輸出顯示控制訊號；以及顯示模組，位於所述汽車的內部，電連接所述顯示控制模組，用於在開啟時根據所述顯示控制訊號顯示至少部分所述第一圖像。本申請還提供一種汽車。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a blind area auxiliary display system including a camera module located on the exterior of the vehicle, a display control module and a display module located inside the vehicle. The camera module is used to obtain a first image within a preset range of the exterior of the vehicle. The preset range of the exterior includes a blind area of the driver's visual field obscured by the A-pillar of the vehicle. The display control module is electrically connected to the camera module and is used to receive the first image and output a display control signal according to the content in the first image. The display module is electrically connected to the display control module, and is used to display at least part of the first image according to the display control signal when turned on. This present disclosure also provides a vehicle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:盲區輔助顯示系統</p>
        <p type="p">10:攝像頭模組</p>
        <p type="p">20:顯示模組</p>
        <p type="p">30:顯示控制模組</p>
        <p type="p">31:第一顯示控制器</p>
        <p type="p">32:第二顯示控制器</p>
        <p type="p">40:環境光感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="786px" img-content="tif" inline="yes" orientation="portrait" width="585px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623332</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146587</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250218B">H05K5/02</main-classification>
        <further-classification edition="200601120250218B">G11B33/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川湖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE WORKS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊順和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>托架總成</chinese-title>
        <english-title>BRACKET ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種托架總成包含一第一托架以及一第二托架。該第一托架安排有一第一安裝件；該第二托架可相對該第一托架位移，且該第二托架安排有一第二安裝件，該第二托架的一側安排有一支撐件，用以支撐一承載物；該支撐件包含一安裝特徵，可供該承載物的一部位安裝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bracket assembly includes a first bracket and a second bracket. The first bracket is arranged with a first mounting member. The second bracket is displaceable relative to the first bracket and is arranged with a second mounting member. A side of the second bracket is arranged with a supporting member for supporting an object. The supporting member includes a mounting feature for providing a portion of the object to be mounted therein.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:托架總成</p>
        <p type="p">202:第一托架</p>
        <p type="p">204:第一安裝件</p>
        <p type="p">206:第二托架</p>
        <p type="p">208:第二安裝件</p>
        <p type="p">210a:第一柱</p>
        <p type="p">210b:第二柱</p>
        <p type="p">212:支撐件</p>
        <p type="p">216:安裝特徵</p>
        <p type="p">220:縱向部</p>
        <p type="p">220a:第一端</p>
        <p type="p">202b:第二端</p>
        <p type="p">222:彎折部</p>
        <p type="p">224:支撐部</p>
        <p type="p">230:縱向牆</p>
        <p type="p">237:第二凸出特徵</p>
        <p type="p">L1’:第一側</p>
        <p type="p">L2’:第二側</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="714px" img-content="tif" inline="yes" orientation="portrait" width="1024px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621608</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146588</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120241230B">A47B96/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川湖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE WORKS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川益科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KING SLIDE TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KEN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊順和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUN-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YAO-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王俊強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>托架總成</chinese-title>
        <english-title>BRACKET ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種托架總成包含一第一托架、一第二托架以及一支撐件。該第一托架安排有一第一安裝件；該第二托架可相對該第一托架位移，且該第二托架安排有一第二安裝件，該第二托架的一側安排有該支撐件，用以支撐一承載物；該支撐件包含一安裝特徵，可供該承載物的一部位安裝。該第一托架包含一補強結構，且該補強結構相鄰該安裝特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bracket assembly includes a first bracket, a second bracket and a supporting member. The first bracket is arranged with a first mounting member. The second bracket is displaceable relative to the first bracket and is arranged with a second mounting member. A side of the second bracket is arranged with the supporting member for supporting an object. The supporting member includes a mounting feature for providing a portion of the object to be mounted therein. The first bracket includes a reinforcing structure being located adjacent to the mounting feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:第一托架</p>
        <p type="p">202b:第二端</p>
        <p type="p">204:第一安裝件</p>
        <p type="p">206:第二托架</p>
        <p type="p">208:第二安裝件</p>
        <p type="p">210a:第一柱</p>
        <p type="p">210b:第二柱</p>
        <p type="p">212:支撐件</p>
        <p type="p">214:承載物</p>
        <p type="p">216:安裝特徵</p>
        <p type="p">222:彎折部</p>
        <p type="p">226:凸部</p>
        <p type="p">238:補強結構</p>
        <p type="p">B:底部</p>
        <p type="p">J1:第一橫向寬度</p>
        <p type="p">J2:第二橫向寬度</p>
        <p type="p">Q2:第二預定位置</p>
        <p type="p">W1:第一預定壁</p>
        <p type="p">W2:第二預定壁</p>
        <p type="p">W3:第三預定壁</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="746px" img-content="tif" inline="yes" orientation="portrait" width="1026px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622940</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146591</doc-number>
          <kind></kind>
          <date>113/12/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120250801B">G09G3/32</main-classification>
        <further-classification edition="200601120250801B">G09G3/36</further-classification>
        <further-classification edition="200601120250801B">H05K7/20</further-classification>
        <further-classification edition="200601120250801B">G02B27/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成科技（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成光電（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英特盛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永璁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUNG TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117193560</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>車用抬頭顯示系統及其發光二極體裝置</chinese-title>
        <english-title>VEHICULAR HEAD-UP DISPLAY SYSTEM AND LIGHT-EMITTING DIODE DEVICE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種車用抬頭顯示系統及其發光二極體裝置，發光二極體裝置包含發光二極體模組、驅動電路、溫度感測電路、降溫裝置與電子控制單元。驅動電路驅動發光二極體模組產生顯示光，溫度感測電路感測一溫度。電子控制單元電性連接降溫裝置、溫度感測電路與驅動電路。電子控制單元根據溫度超過一溫度預設值之變動幅度，提升驅動電路輸出給發光二極體模組之驅動電流，以提升顯示光之亮度，接著再啟動降溫裝置降低溫度，直到溫度等於溫度預設值為止。在降溫裝置降低溫度後，電子控制單元根據變動幅度，降低驅動電流，以降低亮度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a vehicular head-up display system and a light-emitting diode device thereof. The light-emitting diode device includes a light-emitting diode module, a driving circuit, a temperature sensing circuit, a cooling device and an electronic control unit. The driving circuit drives the light-emitting diode module to generate display light and the temperature sensing circuit senses a temperature. The electronic control unit is electrically connected to the cooling device, the temperature sensing circuit and the driving circuit. The electronic control unit increases the driving current output from the driving circuit to the light-emitting diode module based on the variation of the temperature exceeding a preset temperature value to increase the brightness of the display light, and then starts the cooling device to reduce the temperature until the temperature is equal to the preset temperature value. After the cooling device decreases the temperature, the electronic control unit reduces the driving current based on the variation to reduce the brightness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:發光二極體裝置</p>
        <p type="p">100:發光二極體模組</p>
        <p type="p">101:驅動電路</p>
        <p type="p">102:溫度感測電路</p>
        <p type="p">103:降溫裝置</p>
        <p type="p">104:電子控制單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="486px" img-content="tif" inline="yes" orientation="portrait" width="811px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621604</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146593</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120241230B">A47B88/43</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南俊國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN JUEN INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張富田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FU-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊豐銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, FENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>連志益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIEN, CHIH-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>滑軌機構及其操作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種滑軌機構，包含：提供一滑軌裝置及一滑軌總成，該滑軌裝置與該滑軌總成之間設有一開關結構、一位移結構及一輔助結構，該輔助結構鎖定該滑軌總成為收合狀態；該開關結構鎖定該滑軌裝置與該滑軌總成之間的相對位置，再以該開關結構解鎖該滑軌裝置與該滑軌總成之間的相對位置；該位移結構帶動該滑軌總成在該滑軌裝置上進行活動位移；以及該輔助結構隨著該位移結構在該滑軌裝置上進行活動位移，當該輔助結構活動位移至該滑軌裝置之預定處，則該輔助結構解鎖該滑軌總成進行展開狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:滑軌裝置</p>
        <p type="p">11:支撐架</p>
        <p type="p">111:第一牆</p>
        <p type="p">112:第二牆</p>
        <p type="p">113:縱向牆</p>
        <p type="p">114:第四牆</p>
        <p type="p">115:第五牆</p>
        <p type="p">116:安裝口</p>
        <p type="p">12:通道</p>
        <p type="p">13:第一擋部</p>
        <p type="p">20:滑軌總成</p>
        <p type="p">30:開關結構</p>
        <p type="p">31:路徑板</p>
        <p type="p">32:導引組件</p>
        <p type="p">321:架體</p>
        <p type="p">322:把手</p>
        <p type="p">33:導引特徵</p>
        <p type="p">40:位移結構</p>
        <p type="p">41:安裝件</p>
        <p type="p">411:抱持牆</p>
        <p type="p">412:安裝件之側面</p>
        <p type="p">413:座體</p>
        <p type="p">44:第三滾動件</p>
        <p type="p">50:輔助結構</p>
        <p type="p">501:第一板體</p>
        <p type="p">502:第二板體</p>
        <p type="p">51:第一鎖定特徵</p>
        <p type="p">52:第二鎖定特徵</p>
        <p type="p">53:樞接件</p>
        <p type="p">54:第一限位片</p>
        <p type="p">56:補強肋</p>
        <p type="p">A1:第一導引面</p>
        <p type="p">B:定位特徵</p>
        <p type="p">B1:阻擋面</p>
        <p type="p">C3:第三固定部</p>
        <p type="p">C4:第四固定部</p>
        <p type="p">D2:第二彈性件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="641px" img-content="tif" inline="yes" orientation="portrait" width="1025px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621612</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146603</doc-number>
          <kind></kind>
          <date>113/11/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250219B">A47C31/12</main-classification>
        <further-classification edition="200601120250219B">A47C31/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱撒床業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>彰化縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施麗卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凃東材</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>彰化縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>感應承載自動調整床墊的獨立支撐結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感應承載自動調整床墊的獨立支撐結構，係在床墊內設一底座，於底座上均距佈滿伸縮棒，用來取代床墊內部的獨立筒彈簧，伸縮棒其內部設有一傳動機、一感應晶片、一伸縮桿及一支撐面，相互連結感應；首先，業者將消費者身體適應的承載重量數值輸入所有伸縮棒之感應晶片內，其承載數值可隨著不同的消費者及需求隨時調整改變數值；當使用者身體躺於床墊或翻身時，其支撐面承受的下壓力超過(或低於)設定值時，感應晶片立即感應到隨即通知傳動機發動，帶動伸縮桿將支撐面下降(或上升)，這時下壓力將分散至周遭之伸縮棒，周遭之伸縮棒其支撐面承受的下壓力超過(或低於)設定值時，感應晶片立即感應到隨即通知傳動機發動，帶動伸縮桿將周遭之支撐面下降(或上升)，直至所有之支撐面承受的下壓力與設定值一致時即停止運作；如此達到製作材料單一性、取代獨立筒彈簧無需庫存各式規格獨立筒彈簧圈及床墊於身體每個部位其獨立支撐力一致性之目的。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">1:伸縮棒</p>
        <p type="p">11:支撐面</p>
        <p type="p">12:伸縮桿</p>
        <p type="p">13:傳動機</p>
        <p type="p">14:感應起動晶片</p>
        <p type="p">2:床墊</p>
        <p type="p">3:底座</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="1058px" img-content="tif" inline="yes" orientation="portrait" width="735px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622780</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146657</doc-number>
          <kind></kind>
          <date>113/12/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06F18/2415</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商鴻運科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱財平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, TSAI-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊承儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHENG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐婉馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TARNG, WAN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116572466</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>品質檢測方法、設備及電腦可讀取儲存媒體</chinese-title>
        <english-title>METHOD, EQUIPMENT AND COMPUTER-READABLE STORAGE MEDIA FOR QUALITY INSPECTION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種品質檢測方法、設備及存儲介質。品質檢測方法包括：獲取待測電路板上元器件之圖像資料集，圖像資料集包括與N個標籤分別對應之N類標注資料集，N＞1且N為整數。將圖像資料集輸入預訓練之檢測模型，獲得檢測結果。當檢測結果不符合預設標準時，根據N類標注資料集及模型關注區域確定異常原因。根據異常原因對模型關注區域或圖像資料集進行調整，直至檢測結果符合預設標準。本申請能夠有效減少模型數量，提高檢測之精確程度與檢測效率；能夠降低對設備之硬體設定要求，降低品質檢測設備之運行成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a method, equipment and storage media for quality inspection. The method includes: obtaining an image data set of components on a circuit board to be tested, the image data set includes N-class labeled data set corresponding to N labels, N ＞ 1 and N is an integer; inputting the image data set into a pretrained detection model to obtain a detection result; when the detection result does not meet a preset standard, determining an abnormal reason according to the N-class labeled data set and a model attention area; adjusting the model attention area or the image data set according to the abnormal reason until the detection result meets the preset standard. The number of models may be effectively reduced, such that the accuracy of detection and detection efficiency are improved, and the hardware configuration requirements for the device may be reduced, such that the operating cost of an equipment for quality inspection is reduced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-S4:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="559px" img-content="tif" inline="yes" orientation="portrait" width="631px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622819</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146715</doc-number>
          <kind></kind>
          <date>113/12/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250508B">G06Q10/04</main-classification>
        <further-classification edition="202401120250508B">G06Q10/08</further-classification>
        <further-classification edition="202301120250508B">G06Q10/087</further-classification>
        <further-classification edition="202301120250508B">G06Q30/06</further-classification>
        <further-classification edition="202301120250508B">G06Q30/0601</further-classification>
        <further-classification edition="200601120250508B">G06F17/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡馬爾　尤努斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMAL, YUNUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿加瓦爾　拉胡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGARWAL, RAHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴在敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0165800</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>季節區間檢測方法及其裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR DETECTING SEASONALITY PERIODS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係有關於一種推季節區間檢測方法及其裝置。根據本揭露一些實施例的季節區間檢測方法可以包括如下步驟：獲取每個商品類別的時間序列形式的需求資料；使用該需求資料提取代表需求波動趨勢的平滑模式，該平滑模式包括代表短期需求波動趨勢的第一平滑模式和代表長期需求波動趨勢的第二平滑模式；使用該第一平滑模式和該第二平滑模式檢測第一季節區間；使用基於該需求資料的頻率分量提取的週期模式檢測第二季節區間；和合併該第一季節區間和該第二季節區間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method and apparatus for detecting seasonality periods. The method for detecting seasonality periods may include obtaining demand data of a time series format for each product category, extracting a smoothing pattern indicating a trend of demand fluctuation using the demand data, the smoothing pattern including a first smoothing pattern indicating a trend of short-term demand fluctuation and a second smoothing pattern indicating a trend of long-term demand fluctuation, detecting a first seasonality period using the first smoothing pattern and the second smoothing pattern, detecting a second seasonality period using a periodic pattern extracted based on a frequency component of the demand data, and merging the first seasonality period and the second seasonality period with each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S300、S400、S500、S600:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="767px" img-content="tif" inline="yes" orientation="portrait" width="502px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621597</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113146769</doc-number>
          <kind></kind>
          <date>113/12/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250328B">A45D31/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商珍熙韓國美容實業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JC KOREA CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　成龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SUNG-YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔景植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, KYOUNG-SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴成敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SEONG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豫宛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/KR2024/019340</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有三維曲面形狀的指甲貼紙</chinese-title>
        <english-title>NAIL STICKER HAVING THREE-DIMENSIONAL CURVED SHAPE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種具有三維曲面形狀的指甲貼紙。具有三維曲面形狀的指甲貼紙包括一個貼紙主體，貼紙主體的底面可貼附於指甲上，具有柔性，並具有與指甲形狀相對應的三維曲面形狀，以及設置於貼紙主體的頂面上的半固化層。其中指甲貼紙具有柔性，並具有與指甲形狀相對應的三維曲面，使其在半固化層固化前具有一定程度的彎曲強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a nail sticker having a three-dimensional curved shape. The nail sticker having a three-dimensional curved shape includes a sticker main body which is adhered to a nail at the bottom surface thereof, is flexible and has a three-dimensional curved shape corresponding to the shape of a nail, and a semi-cured layer provided on the top surface of the sticker main body, wherein the nail sticker is flexible and has a three-dimensional curved surface corresponding to the shape of a nail so that it may have a predetermined level of bending strength before the semi-cured layer is cured.        &lt;br/&gt;​      </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:指甲貼紙</p>
        <p type="p">110:貼紙主體</p>
        <p type="p">111:黏著層</p>
        <p type="p">113:基材層</p>
        <p type="p">115:設計層</p>
        <p type="p">117:中間層</p>
        <p type="p">130:半固化層</p>
        <p type="p">150:保護膜</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="792px" img-content="tif" inline="yes" orientation="portrait" width="723px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622728</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147363</doc-number>
          <kind></kind>
          <date>113/12/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250602B">G06F9/06</main-classification>
        <further-classification edition="201801120250602B">G06F9/44</further-classification>
        <further-classification edition="201801120250602B">G06F8/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹始亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, SHILIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃曉路</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, XIAOLU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂遠方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LV, YUANFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁胤豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YINHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174730</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用以支持服務之功能之裝置、方法及記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM FOR SUPPORTING FUNCTIONALITY OF A SERVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於本發明之一實施例之藉由電子裝置而將第1服務中之作業遷移至第2服務的方法中，上述第1服務為Jenkins服務，上述第2服務為Kubernetes服務，上述方法可包括如下步驟：產生用以於上述第2服務中支持上述第1服務所支持之對象功能之作業模板層；使用所產生之上述作業模板層來產生與上述對象功能相關之構成檔案；及將產生之上述構成檔案應用於上述第2服務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:電子裝置</p>
        <p type="p">401:作業</p>
        <p type="p">402:作業</p>
        <p type="p">403:作業</p>
        <p type="p">404:作業</p>
        <p type="p">410:第1服務</p>
        <p type="p">420:第2服務</p>
        <p type="p">430:作業模板層</p>
        <p type="p">440:基礎建設</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="631px" img-content="tif" inline="yes" orientation="portrait" width="1049px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623343</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147583</doc-number>
          <kind></kind>
          <date>113/12/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251001B">H05K7/20</main-classification>
        <further-classification edition="200601120251001B">G06F1/20</further-classification>
        <further-classification edition="200601120251001B">F28F3/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻準精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOXCONN TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>符猛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝錦榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, JIN-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅富升</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, FU-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117192731</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>散熱器和終端裝置</chinese-title>
        <english-title>RADIATOR AND TERMINAL DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種散熱器，包括至少一第一散熱組件、第二散熱組件、進液接頭和出液接頭。第一散熱組件包括第一流道、第一進液孔和第一出液孔，第一流道連通第一進液孔和第一出液孔，第一進液孔和第一出液孔均貫穿第一散熱組件；第二散熱組件和第一散熱組件可拆卸地連接，第二散熱組件包括第二流道、第二進液孔和第二出液孔，第二流道連通第二進液孔和第二出液孔，第二進液孔連通第一進液孔，第二出液孔連通出液孔；進液接頭連通第一進液孔；出液接頭連通第一出液孔。本申請還提供一種終端裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A radiator includes at least one first heat dissipating assembly, a second heat dissipating assembly, a liquid inlet connector, and a liquid outlet connector. The first heat dissipating assembly includes a first flow channel, a first liquid inlet hole, and a first liquid outlet hole. The first flow channel communicates with the first liquid inlet hole and the first liquid outlet hole, and both the first liquid inlet hole and the first liquid outlet hole penetrate the first heat dissipating assembly. The second heat dissipating assembly is detachably connected to the first heat dissipating assembly. The second heat dissipating assembly includes a second flow channel, a second inlet hole, and a second outlet hole. The second flow channel communicates with the second inlet hole and the second outlet hole, the second inlet hole communicates with the first inlet hole, and the second outlet hole communicates with the outlet hole. The liquid inlet connector is connected to the first liquid inlet hole. The liquid outlet connector is connected to the first liquid outlet hole. The present disclosure further provides a terminal device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:散熱器</p>
        <p type="p">10:第一散熱組件</p>
        <p type="p">11:第一本體部</p>
        <p type="p">12:第一安裝部</p>
        <p type="p">20:第二散熱組件</p>
        <p type="p">21:第二本體部</p>
        <p type="p">22:第二安裝部</p>
        <p type="p">30:安裝空間</p>
        <p type="p">40:進液接頭</p>
        <p type="p">41:第一連通部</p>
        <p type="p">42:第一凸起</p>
        <p type="p">43:第三凸起</p>
        <p type="p">50:出液接頭</p>
        <p type="p">51:第二連通部</p>
        <p type="p">52:第二凸起</p>
        <p type="p">53:第四凸起</p>
        <p type="p">60:導熱片</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="810px" img-content="tif" inline="yes" orientation="portrait" width="735px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622744</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147792</doc-number>
          <kind></kind>
          <date>113/12/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250208B">G06F11/36</main-classification>
        <further-classification edition="201301120250208B">G06F3/048</further-classification>
        <further-classification edition="202401120250208B">G06Q10/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑩瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YINGYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄔耀平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAOPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0169662</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基於圖像的用戶介面測試方法及其系統</chinese-title>
        <english-title>IMAGE BASED USER INTERFACE TEST METHOD AND SYSTEM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的實施例的基於圖像的用戶介面測試方法，由計算裝置執行，可包括：獲取與第一用戶介面對應的第一圖像的步驟，計算上述第一圖像和與第二用戶介面對應的已存儲的第二圖像之間的相似度的步驟，以及基於上述相似度驗證上述第一用戶介面的步驟，驗證上述第一用戶介面的步驟可包括：當上述相似度為預設的閾值以上時，確定上述第一用戶介面的狀態為驗證通過；當上述相似度低於上述閾值時，確定上述第一用戶介面的狀態為驗證失敗的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image based user interface test method according to an exemplary embodiment of the present disclosure is performed by a computing device and may include: obtaining a first image corresponding to a first user interface; calculating similarity between the first image and a previously stored second image corresponding to a second user interface; and verifying the first user interface based on the similarity, wherein the verifying of the first user interface includes: determining a status of the first user interface as a verification pass when the similarity is greater than or equal to a preset threshold value, and determining the status of the first user interface as a verification failure when the similarity is less than the threshold value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200、S300、S310、S320、S330:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="607px" img-content="tif" inline="yes" orientation="portrait" width="526px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622824</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147793</doc-number>
          <kind></kind>
          <date>113/12/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250210B">G06Q10/08</main-classification>
        <further-classification edition="201901120250210B">G06F16/953</further-classification>
        <further-classification edition="200601120250210B">G06F17/40</further-classification>
        <further-classification edition="202301120250210B">G06Q30/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧妍姝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RO, YEON JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SO YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴枝洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JI HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0170915</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基於配送類別的商品篩選方法及其系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR FILTERING PRODUCT BASED ON DELIVERY CATEGORY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種商品篩選方法及其系統。該方法包括如下步驟：顯示包括用於基於配送類別對商品列表進行篩選的篩選器列表的商品列表顯示頁面，其中，該配送類別包括到達類型；和回應於接收到包括選擇該篩選器列表包含的該到達類型的篩選器的第一使用者輸入，在該商品列表顯示頁面顯示的該商品列表中，過濾掉除選擇的該篩選器對應的商品之外的剩餘商品，其中，基於該商品的配送到達時間預先設置與該商品列表內的商品對應的該到達類型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There are provided a method and system for filtering a product. The method includes displaying a product list display page including a filter list for filtering a product list based on a delivery category, the delivery category including an arrival type, and filtering out the remaining products except for a product corresponding to a selected filter in the product list displayed on the product list display page in response to receiving a first user input including a selection of a filter for the arrival type included in the filter list, wherein the arrival type corresponding to a product included in the product list is preset based on a delivery arrival time of the product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S300:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="452px" img-content="tif" inline="yes" orientation="portrait" width="644px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622857</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147879</doc-number>
          <kind></kind>
          <date>113/12/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250206B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250206B">G06Q10/0832</further-classification>
        <further-classification edition="202401120250206B">G06Q10/08</further-classification>
        <further-classification edition="200601120250206B">G06F13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧妍姝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RO, YEON JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SO YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0171938</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>保證配送時間資訊提供方法及其系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PROVIDING GUARANTEED DELIVERY TIME INFORMATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明的一實施例的保證配送時間資訊提供方法由計算系統執行，包括如下步驟：識別要包括在用戶終端中顯示的商品搜索結果列表的第一商品的第一保證配送日期和時間，所述第一保證配送日期和時間以小於或等於三小時的預定時間間隔為單位設置；利用基於所述用戶終端的用戶的配送地址資訊和所述配送地址資訊的出庫倉庫資訊，確定是否顯示所述第一保證配送日期和時間；及當確定顯示所述第一商品的保證配送日期和時間時，向所述用戶終端提供包括所述第一商品的第一保證配送日期和時間的資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A guaranteed delivery time information providing method according to an embodiment of the present invention is executed by a computing system and includes the following steps: identifying a first guaranteed delivery date and time of a first product to be included in a product search result list displayed on a user terminal, wherein the first guaranteed delivery date and time are set in predetermined time intervals of three hours or less; determining whether to display the first guaranteed delivery date and time based on the delivery address information of the user associated with the user terminal and the warehouse information corresponding to the delivery address information; and, when it is determined to display the guaranteed delivery date and time of the first product, providing the user terminal with information including the first guaranteed delivery date and time of the first product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S710、S720、S730:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="553px" img-content="tif" inline="yes" orientation="portrait" width="640px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622892</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147979</doc-number>
          <kind></kind>
          <date>113/12/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120250502B">G06T7/70</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣云卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YUN-QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡子琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TZYY-CHYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, ZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>訾留飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZI, LIU-FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鬱五</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂祥龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LV, XIANG-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117145232</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一站式視覺定位方法、裝置、電子設備及存儲介質</chinese-title>
        <english-title>ONE-STOP VISUAL POSITIONING METHOD, DEVICE, ELECTRONIC APPARATUS AND STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種一站式視覺定位方法、裝置、電子設備及存儲介質，一站式視覺定位方法包括：將治具的標記點定義為原點，基於原點確定基準座標系；對複數工站中的每個工站的相機座標系與基準座標系之間的轉換關係進行標定，獲得每個工站對應的轉換關係；若承載有產品的治具依次流入複數工站中的各個工站，獲取標記點於各個工站中的標記圖像；根據標記點於各個工站中的標記圖像與各個工站對應的轉換關係計算標記點於各個工站中的基準座標；基於標記點於各個工站中的基準座標對產品進行定位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a one-stop visual positioning method, a device, an electronic apparatus and a storage medium. The one-stop visual positioning method includes: defining a marking point of a fixture as an origin, and determining a reference coordinate system based on the origin; calibrating a transformation relationship between a camera coordinate system of each workstation in a plurality of workstations and the reference coordinate system, and obtaining a transformation relationship for each workstation; in response that the fixture carrying a product enter each workstation in the plurality of workstations sequentially, obtaining a marking image of the marking point at each workstation; calculating a reference coordinate of the marking point at each workstation based on the marking image of the marking point at each workstation and the transformation relationship of each workstation; positioning the product based on the reference coordinate of the marking point at each workstation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10~S14:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="753px" img-content="tif" inline="yes" orientation="portrait" width="579px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622663</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113147981</doc-number>
          <kind></kind>
          <date>113/12/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">G05B23/02</main-classification>
        <further-classification edition="200601120250401B">G06F11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商鴻運科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王呈裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117066620</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>設備異常檢測方法及電子設備</chinese-title>
        <english-title>METHOD FOR DETECTING ABNORMITIES OF DEVICE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種設備異常檢測方法及電子設備。該方法包括：若檢測到待測設備的性能指標資料出現異常，根據對性能指標資料的相關性分析，獲得相關權重；基於相關權重及性能指標資料對應的異常事件的時間衰減權重，對性能指標資料與異常事件的歷史指標資料進行自注意力分析，獲得注意力權重；確定性能指標資料對應的專家模型的收斂指標，若依據注意力權重及收斂指標確定專家模型合格，基於性能指標資料對應的時域及頻域特徵、歸一化後的性能指標資料，利用專家模型，獲得待測設備的異常檢測結果。利用本申請，能夠準確檢測設備是否出現異常。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a method for detecting abnormities of a device and an electronic device. The method includes: in response that an abnormality in performance index data of a device to be tested has been detected, obtaining a correlation weight based on a correlation analysis of the performance index data; obtaining an attention weight by performing a self-attention analysis on the performance index data and historical index data of an abnormal event, based on the correlation weight and a time decay weight corresponding to the abnormal event of the performance index data; determining a convergence indicator for an expert model corresponding to the performance index data; and in response that the expert model is determined to be qualified based on the attention weight and convergence indicator, obtaining an abnormity detection result of the device to be tested by utilizing the expert model, based on time domain and frequency domain features corresponding to the performance index data, and normalized performance index data. By utilizing the present application, it is possible to accurately detect whether any abnormity is occurred in the device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S11~S18:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="785px" img-content="tif" inline="yes" orientation="portrait" width="667px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622858</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148040</doc-number>
          <kind></kind>
          <date>113/12/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250401B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250401B">G06Q30/06</further-classification>
        <further-classification edition="202301120250401B">G06Q30/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧妍姝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RO, YEON JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SO YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李坤熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0171887</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用戶定制型購買誘導方法及其系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR USER-PERSONALIZED PURCHASE INDUCEMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的一實施例的用戶定制型購買誘導方法，由計算裝置執行，包括：將在購買者終端上顯示的搜索結果頁面中包括的多個商品中，識別在預設特定時間段內銷售量第一商品的步驟；利用上述銷售量第一商品的資訊和上述搜索結果頁面的搜索詞，運算上述銷售量第一商品與上述搜索詞之間的相關度的步驟；以及在運算的上述相關度超過預設基準值的情況下，向上述購買者終端發送包括上述銷售量第一商品中顯示第一徽章的銷售商品資訊的上述搜索結果頁面的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to an embodiment of the user-customized purchase induction method disclosed herein, the method is executed by a computing device and includes the steps of: identifying, among multiple products included in a search results page displayed on a purchaser terminal, a top-selling product during a preset specific time period; calculating the relevance between the top-selling product and the search term of the search results page by utilizing information about the top-selling product and the search term; and, when the calculated relevance exceeds a preset threshold, transmitting to the purchaser terminal the search results page that includes sales product information displaying a first badge on the top-selling product.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S910、S920、S930:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.png" file="d10021.TIF" giffile="ed10021.png" height="498px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622859</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148041</doc-number>
          <kind></kind>
          <date>113/12/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250205B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250205B">G06Q30/0241</further-classification>
        <further-classification edition="202301120250205B">G06Q30/02</further-classification>
        <further-classification edition="202301120250205B">G06Q30/01</further-classification>
        <further-classification edition="200601120250205B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧妍姝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RO, YEON JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SO YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李大洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DA YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0170990</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>商品評論顯示方法及其系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR DISPLAYING REVIEW FOR PRODUCT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種商品評論顯示方法及其系統。所述方法包括如下步驟：顯示包括商品列表的商品列表顯示頁面，所述商品列表顯示頁面包括所述商品列表中包括的商品的資訊；及回應於接收到包括對所述商品的資訊中包括的評論資訊的選擇的第一用戶輸入，顯示所述評論資訊的詳細資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There are provided a method and system for displaying a review for a product. The method includes displaying a product list display page including a product list, the product list display page including information on products included in the product list, and displaying detailed information on review information included in the information on the products in response to receiving a first user input including a selection of the review information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="391px" img-content="tif" inline="yes" orientation="portrait" width="504px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622825</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148116</doc-number>
          <kind></kind>
          <date>113/12/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250710B">G06Q10/08</main-classification>
        <further-classification edition="200601120250710B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, STACY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王偉卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李順鐸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫納爾　羅希特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNAL, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏帕迪亞　阿比納夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UPADHYAY, ABHINAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩普特拉　蘇維托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAPUTRA, SOEWITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金德成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DUCKSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡多納　奧爾蒂斯　何塞　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDONA ORTIZ, JOSE DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CO</english-country>
              <english-address>CO</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩諾巴特　拉胡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARNOBAT, RAHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛特雷　姆魯根德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINTRE, MRUGENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174445</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>管理物流之裝置、方法及記錄有命令之記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM STORING INSTRUCTION FOR MANAGING LOGISTICS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包括一個以上之處理器、及儲存有用以藉由上述一個以上之處理器而執行之命令之一個以上之記憶體的裝置，該裝置以如下方式構成，即，於執行上述命令時，上述一個以上之處理器如下：自相機接收第1資訊，該第1資訊係與包裝有商品之目標包裹之影像相關者；自掃描器接收第2資訊，該第2資訊係掃描上述目標包裹之一個以上之識別碼而獲得者；基於上述第1資訊及上述第2資訊，確定為了配送而需將上述目標包裹搬運至其中之目標區域；控制分揀器而將上述目標包裹搬運至上述目標區域；且上述裝置以如下方式構成：於確定上述目標區域時，基於上述第1資訊來確定上述目標包裹是否以預先確定之第1包裝類型包裝；根據確定上述目標包裹以上述第1包裝類型包裝，基於上述第2資訊來確定是否掃描到上述目標包裹之包裝識別碼；根據確定未掃描到上述包裝識別碼，將上述目標區域確定為預先確定之保留區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:環境</p>
        <p type="p">110:裝置</p>
        <p type="p">121:相機</p>
        <p type="p">122:掃描器</p>
        <p type="p">123:分揀器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="377px" img-content="tif" inline="yes" orientation="portrait" width="600px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622931</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148239</doc-number>
          <kind></kind>
          <date>113/12/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250917B">G09F9/30</main-classification>
        <further-classification edition="200601120250917B">G09F9/33</further-classification>
        <further-classification edition="200601120250917B">H05K13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金定章治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANESADA, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鷹野充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKANO, MITSURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森歩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, AYUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩津明宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWATSU, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萩野修司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAGINO, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三博嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISE, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金田真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANETA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/953,127</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置，包括至少一電子單元。至少一電子單元中的每一個包括第一發光裝置、調整裝置和懸掛裝置。調整裝置連接到第一發光裝置，用於調整第一發光裝置的位置狀態。懸掛裝置連接到調整裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes at least one electronic unit. Each of the at least one electronic unit includes a first light-emitting device, an adjustment device and a suspension device. The adjustment device is connected to the first light-emitting device for adjusting a position state of the first light-emitting device. The suspension device is connected to the adjustment device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100a:電子裝置</p>
        <p type="p">110:第一發光裝置</p>
        <p type="p">112:發光板</p>
        <p type="p">114:背板</p>
        <p type="p">130:調整裝置</p>
        <p type="p">131:主體</p>
        <p type="p">132:角度調整單元</p>
        <p type="p">133:調節螺栓</p>
        <p type="p">134:調整單元</p>
        <p type="p">135:調節螺母</p>
        <p type="p">140:懸掛裝置</p>
        <p type="p">B:螺絲</p>
        <p type="p">E:電子單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.png" file="d10021.TIF" giffile="ed10021.png" height="968px" img-content="tif" inline="yes" orientation="portrait" width="763px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621637</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148271</doc-number>
          <kind></kind>
          <date>113/12/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250709B">A61B5/022</main-classification>
        <further-classification edition="200601120250709B">A61B5/0225</further-classification>
        <further-classification edition="200601120250709B">G06F17/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>疆域醫創科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGYU INNOVATIVE MEDICAL TECHNOLOGY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉秉昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, PING-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZHI-BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116483763</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>血壓測量方法、階段式洩氣血壓計、電子設備及存儲介質</chinese-title>
        <english-title>BLOOD PRESSURE MEASUREMENT METHOD, STEPWISE DEFLATION SPHYGMOMANOMETER, ELECTRONIC DEVICE, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種血壓測量方法、階段式洩氣血壓計、電子設備及存儲介質，血壓測量方法包括：控制氣泵對壓脈帶充氣，獲取所述壓脈帶內的壓力感測器即時發送的原始壓力值；基於預設差分公式處理所述原始壓力值，得到差分信號；根據所述差分信號確定所述原始壓力值中的波峰值和波谷值；根據所述波峰值和所述波谷值確定脈搏振幅和血壓值；根據所述脈搏振幅和所述血壓值確定收縮壓和舒張壓。本申請涉及血壓測量技術領域，能夠提升階梯式放氣時測量血壓的平滑度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a blood pressure measurement method, a stepwise deflation sphygmomanometer, an electronic device, and a storage medium. The method includes obtaining real-time raw pressure values sent by a pressure sensor within a pressure cuff of the stepwise deflation sphygmomanometer during a deflation stage; obtaining a differential signal by processing the raw pressure values based on a preset difference formula; determining a peak value and a trough value in the raw pressure values based on the differential signal; determining a pulse amplitude and blood pressure values based on the peak value and the trough values; determining systolic blood pressure and diastolic blood pressure based on the pulse amplitude and blood pressure values from a plurality of deflation stages. The present application can increase the smoothness of blood pressure measurement during stepwise deflation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S20~S24:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="688px" img-content="tif" inline="yes" orientation="portrait" width="717px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622826</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148295</doc-number>
          <kind></kind>
          <date>113/12/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250710B">G06Q10/08</main-classification>
        <further-classification edition="200601120250710B">G06F17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, STACY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王偉卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李順鐸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫納爾　羅希特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNAL, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏帕迪亞　阿比納夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UPADHYAY, ABHINAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩普特拉　蘇維托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAPUTRA, SOEWITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金德成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DUCKSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡多納　奧爾蒂斯　何塞　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDONA ORTIZ, JOSE DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CO</english-country>
              <english-address>CO</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩諾巴特　拉胡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARNOBAT, RAHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛特雷　姆魯根德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINTRE, MRUGENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174394</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>管理物流之裝置、方法及記錄有命令之記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM STORING INSTRUCTION FOR MANAGING LOGISTICS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種裝置，其包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器而執行之命令；且上述裝置以如下方式構成，即，於執行上述命令時，上述一個以上之處理器如下：產生第1資訊，該第1資訊係指示包裝商品時需使用之第1包裝類型者；自掃描儀接收第2資訊，該第2資訊係基於完成上述商品之包裝所得之目標包裹之一個以上的識別碼而獲得者；基於上述第1資訊及上述第2資訊，確定上述目標包裹是否為根據上述第1包裝類型而包裝者；響應於確定上述目標包裹未根據上述第1包裝類型而包裝，向用戶之終端傳輸第3資訊，該第3資訊係指示上述目標包裹未根據上述第1包裝類型而包裝者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:環境</p>
        <p type="p">110:裝置</p>
        <p type="p">121:作業人員終端</p>
        <p type="p">122:掃描儀</p>
        <p type="p">123:相機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="308px" img-content="tif" inline="yes" orientation="portrait" width="644px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623350</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148517</doc-number>
          <kind></kind>
          <date>113/12/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">H10B12/00</main-classification>
        <further-classification edition="202501120250303B">H10D1/60</further-classification>
        <further-classification edition="202301120250303B">H10N97/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃智雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHIH-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/957,837</doc-number>
          <date>20241124</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電容結構及其製造方法</chinese-title>
        <english-title>CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電容結構和其製造方法被提供。電容結構包括底部電極、絕緣層、頂部電極和介面層。絕緣層設置在底部電極上。頂部電極設置在絕緣層上。介面層設置在絕緣層和頂部電極之間。介面層的成分具有至少一個元素與絕緣層包含的元素相同，並具有至少一個元素與頂部電極包含的元素相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capacitor structure and a manufacturing method thereof are provided. The capacitor structure includes a bottom electrode, an insulation layer, a top electrode and an interfacial layer. The insulation layer is disposed on the bottom electrode. The top electrode is disposed over the insulation layer. The interfacial layer is disposed between the insulation layer and the top electrode. A composition of the interfacial layer has at least one element in common with elements containing in the insulation layer and at least one element in common with elements containing in the top electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電容結構</p>
        <p type="p">100:基板</p>
        <p type="p">102:著陸墊</p>
        <p type="p">112:支撐層</p>
        <p type="p">112a:第一支撐層</p>
        <p type="p">112b:第二支撐層</p>
        <p type="p">112c:第三支撐層</p>
        <p type="p">140:底部電極</p>
        <p type="p">150:絕緣層</p>
        <p type="p">160:介面層</p>
        <p type="p">170:頂部電極</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10029.png" file="d10029.TIF" giffile="ed10029.png" height="616px" img-content="tif" inline="yes" orientation="portrait" width="882px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623238</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148549</doc-number>
          <kind></kind>
          <date>113/12/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250303B">H04L49/10</main-classification>
        <further-classification edition="202201120250303B">H04L45/60</further-classification>
        <further-classification edition="202201120250303B">H04L49/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商達發科技(蘇州)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIROHA TECHNOLOGY (SUZHOU) LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116711327</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>網路封包處理裝置以及網路封包轉發方法</chinese-title>
        <english-title>NETWORK PACKET PROCESSING DEVICE AND NETWORK PACKET FORWARD METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種網路封包處理裝置，包含平行處理電路、封包分發電路及封包保序處理電路。該平行處理電路包含複數個封包處理電路，用以對不同封包進行平行處理。每一封包處理電路包含網路處理器核心。該封包分發電路將複數個封包分別分發至該複數個封包處理電路。該封包保序處理電路對該平行處理電路所產生的複數個處理後的封包進行保序發送，其中該複數個處理後的封包包含第一、第二處理後的封包，分別對應至該複數個封包中的第一、第二封包，且該第一、第二處理後的封包於輸出資料流中的順序相同於該第一、第二封包於輸入資料流中的順序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A network packet processing device includes a parallel processing circuit, a packet distribution circuit and a packet order-preserving processing circuit. The parallel processing circuit includes a plurality of packet processing circuits for processing different packets in parallel. Each packet processing circuit includes a network processing unit (NPU) core. The packet distribution circuit distributes the packets to the packet processing circuits, respectively. The packet order-preserving processing circuit performs order-preserving sending of a plurality of processed packets generated by the parallel processing circuit, wherein the processed packets include first and second processed packets corresponding to first and second packets in the packets, respectively, and an order of the first and second processed packets in an output data stream sent from the packet order-preserving processing circuit is the same as an order of the first and second packets in an input data stream received by the packet distribution circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:網路封包處理裝置</p>
        <p type="p">102:封包分發電路</p>
        <p type="p">104:平行處理電路</p>
        <p type="p">106:封包保序處理電路</p>
        <p type="p">108:動態隨機存取記憶體</p>
        <p type="p">110:封包緩衝器</p>
        <p type="p">112_1,112_N:封包處理電路</p>
        <p type="p">114_1,114_N:環形緩衝器</p>
        <p type="p">116_1,116_N:網路處理器核心</p>
        <p type="p">118_1,118_N:輸出緩衝器</p>
        <p type="p">120_1,120_K:序列號池</p>
        <p type="p">S_IN:輸入資料流</p>
        <p type="p">S_OUT:輸出資料流</p>
        <p type="p">PKT:封包</p>
        <p type="p">PKT_DESCR:封包描述元</p>
        <p type="p">PKT_INF:封包資訊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="681px" img-content="tif" inline="yes" orientation="portrait" width="1008px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622827</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148577</doc-number>
          <kind></kind>
          <date>113/12/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250602B">G06Q10/08</main-classification>
        <further-classification edition="202301120250602B">G06Q10/0833</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫納爾　羅希特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNAL, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏帕迪亞　阿比納夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UPADHYAY, ABHINAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩普特拉　蘇維托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAPUTRA, SOEWITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金德成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DUCKSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡多納　奧爾蒂斯　何塞　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDONA ORTIZ, JOSE DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CO</english-country>
              <english-address>CO</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩諾巴特　拉胡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARNOBAT, RAHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛特雷　姆魯根德拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINTRE, MRUGENDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡浩鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, HOJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174421</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>管理包裝作業之裝置、方法及記錄有命令之記錄媒體</chinese-title>
        <english-title>APPARATUS, METHOD AND RECORDING MEDIUM STORING INSTRUCTION FOR MANAGING PACKING OPERATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明可提供一種裝置，其包括：一個以上之處理器；及一個以上之記憶體，其等儲存有用以藉由上述一個以上之處理器而執行之命令；且上述裝置構成為，於執行上述命令時，上述一個以上之處理器自第1掃描器接收第1資訊，該第1資訊係掃描與第1商品對應之第1識別碼而獲得者；基於上述第1資訊，確定是否已掃描與需與上述第1商品一併包裝至對象包裹之一個以上之第2商品各者對應之識別碼；隨著確定為已掃描與上述一個以上之第2商品各者對應之識別碼，控制印表機以列印上述對象包裹之運單，控制與上述印表機連接之第2掃描器以掃描由上述印表機列印之上述運單來獲得第2資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:環境</p>
        <p type="p">110:裝置</p>
        <p type="p">121:第1掃描器</p>
        <p type="p">122:第2掃描器</p>
        <p type="p">123:印表機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="430px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622860</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148579</doc-number>
          <kind></kind>
          <date>113/12/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250303B">G06Q30/0601</main-classification>
        <further-classification edition="202301120250303B">G06Q30/0251</further-classification>
        <further-classification edition="202001120250303B">G06F40/103</further-classification>
        <further-classification edition="200601120250303B">G06F13/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>慶秀珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYUNG, SU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李大洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DA YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昭允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SO YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李坤熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0171361</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>商品列表提供方法及其系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PROVIDING PRODUCT LIST</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠直觀確認商品列表中包括的各商品項目的銷售數量資訊的商品列表提供方法。根據本發明的商品列表提供方法包括如下步驟：構建包括多個商品項目的商品列表；從預定義的多個不同銷售數量表達文本中選擇與所述商品項目的銷售數量對應的銷售數量表達文本；渲染包括顯示選擇的所述銷售數量表達文本的人氣度顯示區域的所述商品項目的畫面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a method for providing a product list capable of intuitively confirming the sales number information of each product item included in the product list. The method for providing a product list may include configuring a product list including a plurality of product items, selecting a sales number display text corresponding to the sales number of the product item among a plurality of different sales number display texts that are predefined, and rendering a screen of the product item including a popularity display area displaying the selected sales number display text.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:商品列表</p>
        <p type="p">1100.1200、1300、1400:商品項目</p>
        <p type="p">1110、1210、1310、1410:人氣度顯示區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="970px" img-content="tif" inline="yes" orientation="portrait" width="681px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623248</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148739</doc-number>
          <kind></kind>
          <date>113/12/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251021B">H04N9/77</main-classification>
        <further-classification edition="200601120251021B">G06T5/50</further-classification>
        <further-classification edition="200601120251021B">G02B27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃建榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIAN-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116718538</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>影像處理方法、裝置、電子設備及存儲介質</chinese-title>
        <english-title>METHOD FOR PROCESSING IMAGE, DEVICE, ELECTRONIC APPARATUS, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種影像處理方法、裝置、電子設備及存儲介質，所述方法應用於電子設備，所述方法包括：獲取測試圖像；確定所述測試圖像中不同區域的興趣點的亮度值；基於所述不同區域的興趣點的亮度值確定目標點的灰階值；以及根據所述目標點的灰階值調整所述測試圖像。上述方法能夠提升捕捉測試圖像中的興趣點的準確率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a method for processing an image, a device, an electronic apparatus, and a storage medium. The method is applied in the electronic device, and the method includes obtaining a test image, and determining brightness values of interest points of different areas of the test image. The method further includes determining a grayscale value of a target point based on the brightness values of the interest points, and adjusting the test image according to the grayscale value of the target point. The above method may improve the accuracy of capturing the interest point of the test image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01~S04:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="460px" img-content="tif" inline="yes" orientation="portrait" width="650px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622421</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148808</doc-number>
          <kind></kind>
          <date>113/12/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250224B">F24C15/20</main-classification>
        <further-classification edition="200601120250224B">F24C15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>研能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROJET TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫皓然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOU, HAO-JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳錦銓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃啟峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHI-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113146225</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>智能聯網抽油煙機</chinese-title>
        <english-title>SMART NETWORKED RANGE HOOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種智能聯網抽油煙機，包含：主體，設置有至少一吸風口，連接一空氣導流路徑之一管道，以及包含氣罩框體；導風機，安裝於管道中，導引空污引流於管道中，以排出於室外場域；主機驅動控制器，以控制氣罩框體之啟閉，以及控制導風機之啟閉及動態調整導風機的運作頻率與輸出風量；氣體偵測模組，與主機驅動控制器電性連接，輸出偵測數據，且透過物聯網通訊將偵測數據傳輸至聯網雲端運算服務裝置，其中聯網雲端運算服務裝置根據偵測數據即時調控主機驅動控制器啟動氣罩框體之啟閉，以及導風機之啟閉及動態調整導風機的運作頻率與輸出風量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A smart networked range hood is disclosed and includes a main body, a blower, a host drive controller and at least one air detection module. The main body comprises at least one air suction port and at least one air hood frame, and the at least one air suction port is in communication with a duct of an air diversion path. The blower is disposed in the duct to guide the air pollution in the duct to be discharged to an outdoor area. The host drive controller controls the open/close status of the air hood frame and the operation of the blower, and dynamically adjusts the operation frequency and the output air volume of the blower. The air detection module is electrically in connection with the host drive controller. The air detection module outputs detection data to a networked cloud computing service device through internet of things. The networked cloud computing service device controls the host drive controller to control the open/close status of the air hood frame, adjust the operation of the blower and dynamically adjust the operation frequency and the output air volume of the blower.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主體</p>
        <p type="p">11:吸風口</p>
        <p type="p">12:管道</p>
        <p type="p">13:氣罩框體</p>
        <p type="p">133:噴氣孔</p>
        <p type="p">14:導流罩板</p>
        <p type="p">5:聯網雲端運算服務裝置</p>
        <p type="p">K:烹飪空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.png" file="d10028.TIF" giffile="ed10028.png" height="675px" img-content="tif" inline="yes" orientation="portrait" width="890px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623627</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113148966</doc-number>
          <kind></kind>
          <date>113/12/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/20</main-classification>
        <further-classification edition="202601120260302B">H10W20/49</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商芯愛科技（南京）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AALTOSEMI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳盈儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YIN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敏堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MIN-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳楊麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YANG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張垂弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, ANDREW C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘柏均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116543622</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>封裝基板及其製法</chinese-title>
        <english-title>PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝基板，其製法係於一具有核心層之核心板體之其中一側上形成線路結構，使該核心板體之另一側作為植球側，以減少該封裝基板之層數，故該封裝基板之總厚度有利於減薄。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A packaging substrate is made by forming a circuit structure on one side of a core body with a core layer, so the other side of the core body is used as a ball side to reduce the number of layers of the packaging substrate. Therefore, the total thickness of the packaging substrate is advantageous for thinning.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:封裝基板</p>
        <p type="p">1a:核心板體</p>
        <p type="p">10:核心層</p>
        <p type="p">10a:第一側</p>
        <p type="p">10b:第二側</p>
        <p type="p">100:穿孔</p>
        <p type="p">12:塞孔材</p>
        <p type="p">13a,13b:佈線層</p>
        <p type="p">130:植球墊</p>
        <p type="p">14:導電柱</p>
        <p type="p">15:線路結構</p>
        <p type="p">16:防焊層</p>
        <p type="p">160,720:開孔</p>
        <p type="p">72:絕緣層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="416px" img-content="tif" inline="yes" orientation="portrait" width="653px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621778</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113149915</doc-number>
          <kind></kind>
          <date>113/12/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250224B">B01D35/30</main-classification>
        <further-classification edition="200601120250224B">B01D35/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商溢泰（南京）環保科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溢泰實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慶雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周海鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊學藺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117462637</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>壁掛式淨水器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種壁掛式淨水器。壁掛式淨水器掛設於外部的安裝面，壁掛式淨水器包括：殼體，包括下殼和與下殼可拆卸連接的上殼；濾芯組，可拆卸地設於濾芯安裝位；安裝機構，位於上殼和下殼之間，安裝機構與上殼圍成第一容納腔，濾芯組穿設於濾芯安裝位並可拆卸地連接安裝機構；以及集成水路板，連通於濾芯組，集成水路板位於第一容納腔且安裝於安裝機構。本發明利用安裝機構對淨水器內部的區域進行分割，更便於各個部件在淨水器內進行合理的佈局，提高了空間利用率；設置安裝機構，可以分別支撐上部的水路板和下部的濾芯，濾芯濕水增加的重量，可以被安裝機構分擔並沿背板分散，減輕淨水器殼體受力，優化了安裝機構的承重能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">130:背板</p>
        <p type="p">130a:第一安裝區域</p>
        <p type="p">130b:第二安裝區域</p>
        <p type="p">133:第二對接部</p>
        <p type="p">140:裝飾板</p>
        <p type="p">210:中框支架</p>
        <p type="p">211:第一安裝台</p>
        <p type="p">212:第二安裝台</p>
        <p type="p">220:濾芯安裝座</p>
        <p type="p">400:集成水路板</p>
        <p type="p">510:主電路板</p>
        <p type="p">520:顯示器</p>
        <p type="p">530:電控安裝架</p>
        <p type="p">560:電源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="876px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622917</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150234</doc-number>
          <kind></kind>
          <date>113/12/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260302B">G06V40/16</main-classification>
        <further-classification edition="202201120260302B">G06V40/20</further-classification>
        <further-classification edition="200601120260302B">G06F3/01</further-classification>
        <further-classification edition="202601120260302B">G06T11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃湘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117498785</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>數位人表情處理方法、裝置、電子設備及存儲介質</chinese-title>
        <english-title>METHOD FOR PROCESSING FACIAL EXPRESSION OF DIGITAL HUMAN, DEVICE , ELECTRONIC APPARATUS, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種數位人表情處理方法、裝置、電子設備及存儲介質，所述方法應用於電子設備，所述方法包括：獲取使用者的第一資訊；獲取所述使用者的第二資訊；基於所述第二資訊確定對應的表情資訊；以及根據所述第一資訊、所述第二資訊和所述表情資訊生成數位人的表情資訊。上述方法能夠提升電子設備的交互效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a method for processing a facial expression of a digital human, a device, an electronic apparatus, and a storage medium. The method is applied in the electronic device, and the method includes obtaining first information of a user, and obtaining second information of the user. The method further includes determining a facial expression corresponding to the second information and generating a facial expression of the digital human based on the first information, the second information and the facial expression corresponding to the second information. The above method may improve interactive effects of the electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S01~S04:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="612px" img-content="tif" inline="yes" orientation="portrait" width="629px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623203</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150359</doc-number>
          <kind></kind>
          <date>113/12/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250501B">H03H9/19</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣晶技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TXC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志恂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余啟綸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高笙翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, SHENG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/959,127</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>振盪裝置</chinese-title>
        <english-title>OSCILLATING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭露一種振盪裝置，其包含互相耦接之第一石英晶體諧振器、驅動電路、第一緩衝器、帶通濾波器、第二石英晶體諧振器與第二緩衝器。驅動電路驅動第一石英晶體諧振器產生具有諧振頻率之第一振盪訊號。第一緩衝器隔離負載變化，以利用第一振盪訊號產生第一時脈訊號。帶通濾波器允許僅第一時脈訊號通過，進而產生一過濾訊號，其中第一時脈訊號具有在通帶內的諧振頻率之諧波頻率。第二石英晶體諧振器整流過濾訊號，以產生具有諧波頻率之第二振盪訊號。第二緩衝器隔離負載變化，以利用第二振盪訊號產生第二時脈訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An oscillating device includes a first quartz crystal resonator, a driving circuit, a first buffer, a bandpass filter, a second quartz crystal resonator, and a second buffer coupled to each other. The driving circuit drives the first quartz crystal resonator to generate a first oscillating signal with a resonant frequency. The first buffer isolates from a load variation to generate a first clock signal in response to the first oscillating signal. The bandpass filter allows only the first clock signal with the harmonic frequency of the resonant frequency within a passband to pass through, thereby generating a filtered signal. The second quartz crystal resonator rectifies the filtered signal to generate a second oscillating signal having the harmonic frequency. The second buffer isolates from a load variation to generate a second clock signal in response to the second oscillating signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:振盪裝置</p>
        <p type="p">10:第一石英晶體諧振器</p>
        <p type="p">11:驅動電路</p>
        <p type="p">12:第一緩衝器</p>
        <p type="p">13:帶通濾波器</p>
        <p type="p">14:第二石英晶體諧振器</p>
        <p type="p">15:第二緩衝器</p>
        <p type="p">16:波形調整電路</p>
        <p type="p">O1:第一振盪訊號</p>
        <p type="p">C1:第一時脈訊號</p>
        <p type="p">F:過濾訊號</p>
        <p type="p">O2:第二振盪訊號</p>
        <p type="p">C2:第二時脈訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="624px" img-content="tif" inline="yes" orientation="portrait" width="761px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621779</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150451</doc-number>
          <kind></kind>
          <date>113/12/24</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120250317B">B01D35/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商溢泰（南京）環保科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溢泰實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林慶雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周海鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊學藺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411746388X</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>壁掛式淨水器及用於其的安裝機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種壁掛式淨水器及用於其的安裝機構。安裝機構包括：中框支架，安裝於壁掛式淨水器的殼體內，中框支架包括第一安裝台和第二安裝台，第一安裝台和第二安裝台沿第一方向依次設置，第一方向定義為背離安裝壁掛式淨水器的安裝面的方向；第一安裝台用於安裝集成水路板；以及濾芯安裝座，用於安裝濾芯組，濾芯安裝座可拆卸地設於第二安裝台，濾芯安裝座包括濾芯接口管和座體，濾芯接口管自座體側向延伸設置，濾芯接口管能夠穿過中框支架與集成水路板連接。本發明通過設置並列的第一安裝台和第二安裝台，濾芯和水路板可以通過中框支架進行連接，也可以被分別安裝在中框支架同一結構的不同部分，適用於壁掛式淨水器，有利於節省內部空間佈局。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:安裝機構</p>
        <p type="p">210:中框支架</p>
        <p type="p">211:第一安裝台</p>
        <p type="p">212:第二安裝台</p>
        <p type="p">220:濾芯安裝座</p>
        <p type="p">230:管路接頭</p>
        <p type="p">231:接頭管</p>
        <p type="p">232:接頭平臺</p>
        <p type="p">400:集成水路板</p>
        <p type="p">410:進出水口組</p>
        <p type="p">420:旁路</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="524px" img-content="tif" inline="yes" orientation="portrait" width="670px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621858</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150457</doc-number>
          <kind></kind>
          <date>113/12/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250214B">B25C1/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力肯實業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE POAN PNEUMATIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁嘉生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, CHIA-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宜宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, I-TSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖英杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YING-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖振良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, ZHEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鈺哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳律丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LU-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113146420</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有雙重安全機制的擊釘工具</chinese-title>
        <english-title>FASTENER DRIVING TOOL WITH DUAL SAFETY MECHANISM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具有雙重安全機制的擊釘工具，包括擊發裝置及驅動裝置。擊發裝置包括本體、第一逆止閥及撞針組。本體包括氣瓶、汽缸、上蓋及環壁，氣瓶、汽缸與環壁之間形成腔室，環壁開設第一通孔，環壁與汽缸的其中之一開設第二通孔或環壁與汽缸之間形成第二通孔，第二通孔與腔室相通。第一逆止閥設置於第一通孔的開口的外側。撞針組包括活塞及擊釘桿，活塞具有第一密封環、第二密封環及第三密封環，擊釘桿連接活塞。驅動裝置連接擊釘桿。在第一種安全機制失效的情況之下，以第二種安全機制為主，提升本發明的擊釘工具的操作安全性，且結構簡化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fastener driving tool with a double safety mechanism includes a driving device and a returning device. The driving device includes a main body, a first check valve and a driver member. The main body includes a gas vessel, a cylinder, an upper cover and an annular wall, a chamber is formed between the gas vessel, the cylinder and the annular wall, the annular wall has a first hole, a second hole is formed on one of the annular wall and the cylinder or a second hole is formed between the annular wall and the cylinder, and the second hole communicates with the chamber. The first check valve is disposed outside the opening of the first hole. The driver member includes a piston and a driver, the piston has a first sealing ring, a second sealing ring and a third sealing ring, and the driver is connected to the piston. The returning device is connected to the driver. When the first safety mechanism fails, the second safety mechanism is the main one, thereby improving the operational safety of the fastener driving tool of the present invention, and the structure is simplified.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:擊發裝置</p>
        <p type="p">111:氣瓶</p>
        <p type="p">1111:第一穿孔</p>
        <p type="p">1132:外蓋</p>
        <p type="p">13:射嘴</p>
        <p type="p">20:驅動裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10061.JPG" file="ed10061.JPG" height="964px" img-content="tif" inline="yes" orientation="portrait" width="774px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622569</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150461</doc-number>
          <kind></kind>
          <date>113/12/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250226B">G02B6/42</main-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>占興旺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAN, XING-WANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117345633</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光模組及其組裝方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光模組及光模組的組裝方法。光模組包括一殼體、一電路板、多個光纖插座及一插座支架。光纖插座通過光纖與電路板耦合連接。插座支架設於光介面前方，插座支架的彈性鎖固臂設有限位部。殼體的容納槽的內側壁設有一插入部、一鎖固部及一單向通過部。彈性鎖固臂的限位部由插入部裝入殼體內，彈性鎖固臂的限位部可以由插入部滑過單向通過部進入鎖固部內並與鎖固部相互抵止，使插座支架鎖固於殼體，並將多個光纖插座對準緊固到所述光介面。上述光模組按光模組的組裝方法進行組裝，操作簡單且不容易損壞光纖，提高裝配效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:電介面</p>
        <p type="p">102:光介面</p>
        <p type="p">11:容納槽</p>
        <p type="p">12:插入槽(插入部)</p>
        <p type="p">13:鎖固槽(鎖固部)</p>
        <p type="p">14:單向通過凸起(單向通過部)</p>
        <p type="p">20:電路板</p>
        <p type="p">21:光電晶片</p>
        <p type="p">30:光纖插座</p>
        <p type="p">40:插座支架</p>
        <p type="p">41:面板</p>
        <p type="p">411:加強筋</p>
        <p type="p">42:彈性鎖固臂</p>
        <p type="p">422:限位凸起(限位部)</p>
        <p type="p">43:卡槽</p>
        <p type="p">60:光纖</p>
        <p type="p">71:把手</p>
        <p type="p">72:滑動臂</p>
        <p type="p">73:卡扣</p>
        <p type="p">80:間隔件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="522px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622181</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113150903</doc-number>
          <kind></kind>
          <date>113/12/26</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120250115B">C08L71/12</main-classification>
        <further-classification edition="200601120250115B">H01B3/18</further-classification>
        <further-classification edition="201801120250115B">C08K3/016</further-classification>
        <further-classification edition="200601120250115B">H01B3/47</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商台光電子材料（昆山）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王榮濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅兆鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚興星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛文濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉迪雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117196060</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂組合物及其製品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種樹脂組合物，其包括100重量份的含不飽和碳碳雙鍵的聚苯醚樹脂；5重量份至100重量份的式（1）所示化合物、式（2）所示化合物、式（1）所示化合物的低聚物、式（2）所示化合物的低聚物或其組合；以及5重量份至100重量份的苯并環丁烯改性聚烯烴。此外，本發明還公開一種由前述樹脂組合物製成的製品，其包括半固化片、樹脂膜、積層板或印刷電路板，且於鍍銅後銅箔剝離強度均一性、Z軸熱膨脹係數以及儲能模量變化率等特性中的至少一者獲得改善。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202623119</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151269</doc-number>
          <kind></kind>
          <date>113/12/27</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120250418B">H01R13/639</main-classification>
        <further-classification edition="201101120250418B">H01R12/77</further-classification>
        <further-classification edition="200601120250418B">H01R13/40</further-classification>
        <further-classification edition="200601120250418B">H01R13/502</further-classification>
        <further-classification edition="200601120250418B">H01R13/627</further-classification>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商亳州聯滔電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOZHOU LANTO ELECTRONIC LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶冰川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, BINGCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116396159</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>連接器</chinese-title>
        <english-title>CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請屬於連接器技術領域，公開了一種連接器，包括承載座體、端子和鎖定架，承載座體的一端設置有插裝槽，端子設置有多個，多個端子分別設置於承載座體上，端子設置有第二連接部，第二連接部伸入插裝槽，柔性電路板插裝於插裝槽中時，抵接於第二連接部，鎖定架安裝於承載座體，鎖定架設置有卡扣，柔性電路板設置有鎖定槽，柔性電路板插裝於插裝槽中時，卡扣伸入鎖定槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention belongs to the technical field of connector and discloses a connector which includes a bearing body, a plurality of terminals and a locking frame. One end of the bearing body is provided with an insertion groove, and the plurality of terminals are disposed. The plurality of terminals are respectively arranged on the bearing body. The terminal is disposed with a second connection part. The second connection part extends into the insertion groove. When the flexible circuit board abuts against the second connection part while being inserted into the insertion groove. The locking frame is installed on the bearing body and locked. The locking frame is disposed with buckles. A flexible circuit board is disposed with a locking groove. When the flexible circuit board is inserted into the insertion groove, the buckle extends into the locking groove. In the present invention, when the flexible circuit board is connected, the insertion groove on the bearing body cooperates with the buckle on the locking frame to lock the flexible circuit board to prevent the flexible circuit board from accidentally falling out of the insertion groove. The locking frame is disposed independently relative to the bearing body, position and size of the buckle can be adaptively adjusted according to size of the flexible circuit board.        &lt;br/&gt;​      </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:承載座體</p>
        <p type="p">2:端子</p>
        <p type="p">3:鎖定架</p>
        <p type="p">100:線纜</p>
        <p type="p">200:柔性電路板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="514px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622729</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151732</doc-number>
          <kind></kind>
          <date>113/12/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250303B">G06F9/38</main-classification>
        <further-classification edition="201801120250303B">G06F9/30</further-classification>
        <further-classification edition="201601120250303B">G06F12/08</further-classification>
        <further-classification edition="201101120250303B">G06T15/00</further-classification>
        <further-classification edition="200601120250303B">G06T1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李家澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIAZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　振業</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEONG, CHENYAP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白　鈺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅成平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, CHENGPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茅　健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　伯展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BOZHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋立彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, LITONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹友銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, YOU-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/959,563</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種指令高速緩存、環形緩衝器及控制訪問指令高速緩存的方法</chinese-title>
        <english-title>AN INSTRUCTION CACHE, A CIRCULAR BUFFER AND A METHOD FOR CONTROLLING ACCESS OF AN INSTRUCTION CACHE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種指令高速緩存，包括：指令高速緩存區塊，配置為為處理器存儲多個指令；環形緩衝器，配置為存儲該多個指令的一部分，其中該環形緩衝器的訪問速度比該指令高速緩存區塊的訪問速度快；以及選擇電路，耦接到該指令高速緩存區塊和該環形緩衝器，配置為根據是否能在該環形緩衝器中找到一接收到的讀地址從該指令高速緩存區塊的第一指令和從該環形緩衝器的第二指令中選擇一個作為該處理器的輸出指令。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An instruction cache, comprising: an instruction cache bank, configured to store instructions for a processor; a circular buffer, configured to store a portion of the instructions, wherein access speed of the circular buffer is faster than access speed of the instruction cache bank; and a selection circuit, coupled to the instruction cache bank and the circular buffer, and configured to select one of a first instruction from the instruction cache bank and a second instruction from the circular buffer to be output as an output instruction for the processor according to whether a received read address is found in the circular buffer or not.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:指令高速緩存</p>
        <p type="p">221:地址緩衝區</p>
        <p type="p">223:比較電路</p>
        <p type="p">240:與閘</p>
        <p type="p">222:指令緩衝區</p>
        <p type="p">220:環形緩衝器</p>
        <p type="p">210:指令高速緩存區塊</p>
        <p type="p">230:選擇電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="583px" img-content="tif" inline="yes" orientation="portrait" width="746px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622597</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151756</doc-number>
          <kind></kind>
          <date>113/12/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250613B">G02B27/01</main-classification>
        <further-classification edition="201501120250613B">G02B1/11</further-classification>
        <further-classification edition="200601120250613B">G02B3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業桓科技（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE ADVANCED TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成科技(成都)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE TECHNOLOGY (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商業成光電（深圳）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英特盛科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENERAL INTERFACE SOLUTION LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃上育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭羽眉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, YU-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/135767</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>近眼顯示裝置</chinese-title>
        <english-title>NEAR EYE DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種近眼顯示裝置，包括顯示屏、光引導模組以及離焦透鏡。顯示屏用於出射圖像光。光引導模組用於接收並引導圖像光。離焦透鏡用於接收從光引導模組出射之圖像光並將圖像光投射至人眼，離焦透鏡包括第一離焦面與第二離焦面。第一離焦面上設置有中心區以及圍繞中心區之複數微透鏡。中心區用於接收部分圖像光並將部分圖像光聚焦至人眼之視網膜上，複數微透鏡被配置為使入射到中心區以外之部分圖像光聚焦至人眼之視網膜前方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a near eye display device. The near eye display device includes a display screen, an optical guide module and a defocus lens. The display screen is used to emit image light. The optical guide module is used to receive and guide image light. The defocus lens is used to receive the image light from the optical guide module and project the image light to the human eye. The defocus lens includes a first defocus plane and a second defocus plane. The first defocus plane is provided with a central area and a plurality of micro lenses around the central area. The central area is used to receive part of the image light and focus part of the image light on the retina of the human eye. The plurality of micro lenses are configured to focus part of the image light incident outside the central area to the front of the retina of the human eye.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:近眼顯示裝置</p>
        <p type="p">1:顯示屏</p>
        <p type="p">2:光引導模組</p>
        <p type="p">21:第一透鏡</p>
        <p type="p">211:第一表面</p>
        <p type="p">213:第二表面</p>
        <p type="p">22:半反半透膜</p>
        <p type="p">23:複合膜層</p>
        <p type="p">231:相位延遲層</p>
        <p type="p">233:反射偏振層</p>
        <p type="p">235:線性偏振層</p>
        <p type="p">4:離焦透鏡</p>
        <p type="p">41:第一離焦面</p>
        <p type="p">413:微透鏡</p>
        <p type="p">43:第二離焦面</p>
        <p type="p">5:第一黏合層</p>
        <p type="p">L1:圖像光</p>
        <p type="p">E:人眼</p>
        <p type="p">E1:視網膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="887px" img-content="tif" inline="yes" orientation="portrait" width="780px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622520</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>113151824</doc-number>
          <kind></kind>
          <date>113/12/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250805B">G01R31/01</main-classification>
        <further-classification edition="202001120250805B">G01R31/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商鴻運科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLOUD NETWORK TECHNOLOGY SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴昀聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YUN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇嘉正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, CHIA-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱建瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭炫宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117282032</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子控制器之測試序列生成方法及測試系統</chinese-title>
        <english-title>TEST SEQUENCE GENERATION METHOD OF ELECTRONIC CONTROLLER AND TEST SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種電子控制器之測試序列生成方法及測試系統。方法包括：獲取電子控制器之複數測試項目及複數測試項目之間的依賴關係與互斥關係。接收複數測試項目中每個測試項目所需之測試資源。根據依賴關係、互斥關係、每個測試項目所需之測試資源，生成測試序列。由此，本申請提供之電子控制器之測試序列生成方法及測試系統，可以縮短ECU之測試時間，提高測試資源利用率及測試效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a test sequence generation method of electronic controller and test system. The method includes: obtaining the plural test items of an electronic controller and the dependency and mutual exclusivity relationships between the plural test items. Receiving the test resources required for each test item in the plural test items. Generate test sequences based on the dependency relationships, mutually exclusive relationships, and test resources required for each test item. As a result, the test sequence generation method of electronic controller and test system can shorten the testing time of ECUs and improve the utilization of testing resources and testing efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S21~S25:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="731px" img-content="tif" inline="yes" orientation="portrait" width="610px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622508</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100121</doc-number>
          <kind></kind>
          <date>114/01/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250401B">G01P15/02</main-classification>
        <further-classification edition="201301120250401B">G01P15/14</further-classification>
        <further-classification edition="201401120250401B">A63F13/211</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊茆世芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG MAO, SHIH-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡承延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,990</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>動作力回饋裝置及動作力回饋方法</chinese-title>
        <english-title>MOTION FORCE FEEDBACK DEVICE AND MOTION FORCE FEEDBACK METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種動作力回饋裝置及動作力回饋方法。方法包括以下步驟：由慣性量測單元量測關於物體在空間中的位置和方向；由流體速度感測單元量測物體相對於環境流體的速度變化及環境流體在至少一方向上的相對移動速度；由向量力回饋單元動態調整離心力的大小與方向而提供力回饋；以及由處理器運算從慣性量測單元及流體速度感測單元取得的量測訊號而產生物體在空間中的移動距離及移動方向，並且由處理器根據物體的移動姿態及接觸物體的力道，致動向量力回饋單元提供力回饋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A motion force feedback device and a motion force feedback method are provided. The method includes following steps: an inertial measurement unit measures a position and a direction of an object in a space; an air velocity sensing unit measures a velocity change of the object relative to an ambient fluid and a relative movement velocity of the ambient fluid in at least one direction; a vector force feedback unit dynamically adjusts a magnitude and the direction of a centrifugal force to provide a force feedback; and a processor calculates a measurement signal obtained from the inertial measurement unit and the air velocity sensing unit to generate a moving distance and a moving direction of the object in the space, and the processor activates the vector force feedback unit to provide the force feedback based on a moving posture of the object and a contact force with the object.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S21、S23、S25、S27:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="593px" img-content="tif" inline="yes" orientation="portrait" width="850px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623646</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100220</doc-number>
          <kind></kind>
          <date>114/01/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/47</main-classification>
        <further-classification edition="202601120260302B">H10W40/25</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳新瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡毓祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭竣翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, JYUN-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/957,254</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>封裝結構</chinese-title>
        <english-title>PACKAGE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的一方面是關於一種封裝結構。封裝結構包括接合到基底的晶粒、位於基底上方並圍繞晶粒的模封材料、位於晶粒的頂面上方的液態金屬、位於模封材料上方並圍繞液態金屬的側壁的環結構以及附接到環結構並接觸液態金屬的散熱器。環結構包括與液態金屬交界的內環部分以及支撐散熱器的外環部分，內環部分包括通孔，通孔形成用於液態金屬的循環通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">One aspect of the present disclosure pertains to a package structure. The package structure includes a die bonded to a substrate; a molding compound over the substrate and surrounding the die; a liquid metal over a top surface of the die; a ring structure over the molding compound and surrounding sidewalls of the liquid metal; and a heat sink attached to the ring structure and contacting the liquid metal. The ring structure includes an inner ring portion interfacing the liquid metal and an outer ring portion supporting the heat sink, and the inner ring portion includes through holes that form circulation channels for the liquid metal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:積體電路半導體封裝體(半導體封裝體)</p>
        <p type="p">200:晶粒</p>
        <p type="p">270:重分佈層(RDL)</p>
        <p type="p">303:第一模封材料(模封材料)</p>
        <p type="p">305:第二模封材料(模封材料)</p>
        <p type="p">402:表面貼裝元件(SMT元件)</p>
        <p type="p">404:中介層元件</p>
        <p type="p">500:環結構</p>
        <p type="p">504:液態金屬</p>
        <p type="p">506:散熱器</p>
        <p type="p">604:微凸塊</p>
        <p type="p">605:基部黏著接頭(黏著接頭)</p>
        <p type="p">606:中介層</p>
        <p type="p">607:導電跡線</p>
        <p type="p">608:可控塌陷晶片連接凸塊(C4凸塊)</p>
        <p type="p">609a,609b:底部填充物</p>
        <p type="p">610:封裝基底</p>
        <p type="p">611:焊點</p>
        <p type="p">612:中介層凸塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.png" file="d10020.TIF" giffile="ed10020.png" height="731px" img-content="tif" inline="yes" orientation="portrait" width="1002px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622715</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100363</doc-number>
          <kind></kind>
          <date>114/01/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">G06F3/041</main-classification>
        <further-classification edition="200601120250401B">G06K7/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柔佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JOU-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林仲則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUNG-CHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹昕庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, HSIN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施定騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, DING-TENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/961,410</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>觸摸控制方法</chinese-title>
        <english-title>TOUCH CONTROL METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸摸控制方法，用以控制觸摸裝置的觸摸感測操作。觸摸裝置具有多個感測器。觸摸控制方法包括：取得被觸摸感測器的第一感測值及與被觸摸感測器鄰近的多個感測器的多個感測值；根據第一感測值及與被觸摸感測器鄰近的多個感測器的多個感測值決定觸摸物體在被觸摸感測器內的觸摸位置；根據觸摸物體在被觸摸感測器內的觸摸位置將第一感測值正規化為第二感測值；以及根據第二感測值執行觸摸報點程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch control method configured to control a touch sensing operation of a touch apparatus is provided. The touch apparatus has a plurality of sensors. The touch control method includes: obtaining a first sensing value of a touched sensor and a plurality of sensing values of sensors neighbored with the touched sensor; determining a touch position of the touch object inside the touched sensor according to the first sensing value and the plurality of the sensing values of the sensors neighbored with the touched sensor; normalizing the first sensing value to a second sensing value according to the touch position inside the touched sensor; and performing a touch reporting process according to the second sensing value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S200、S210、S220、S230:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="609px" img-content="tif" inline="yes" orientation="portrait" width="707px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623635</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100437</doc-number>
          <kind></kind>
          <date>114/01/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/43</main-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張睿紳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUI-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛長榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSUEH, CHANG-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱政男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHEN-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊曜群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛隆凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, LUNG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/953,223</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝體、基板及製造封裝基板的方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE, SUBSTRATE, AND METHOD OF FABRICATING PACKAGE SUBSTRATE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝基板及其製造方法，包括用於整合被動裝置的改善的接觸結構。用於整合被動裝置的金屬接觸墊可以包括漸縮形狀，例如倒錐台形狀。金屬接觸墊的漸縮形狀可以在金屬接觸墊以及圍繞金屬接觸墊的介電聚合物覆蓋層之間的界面處提供減少的應力。在一些實施例中，金屬接觸墊可以包括例如銅的金屬材料，其摻雜有例如氮的非金屬元素，這可以提供與介電聚合物覆蓋層增強的黏附性。降低的應力以及改善的黏附性可以減少分層缺陷的發生。如上所述的包括整合被動裝置以及金屬接點的整合被動裝置部件可以併入封裝基板中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package substrate and a method of fabrication thereof including improved contact structures for integrated passive devices (IPDs). Metal contact pads for IPDs may include a tapered shape, such as an inverted frustum shape. The tapered shape of the metal contact pads may provide decreased stress at an interface between the metal contact pads and a dielectric polymer capping layer surrounding the metal contact pads. In some embodiments, the metal contact pads may include a metal material, such as copper, that is doped with a non-metallic element, such as nitrogen, which may provide enhance adhesion with the dielectric polymer capping layer. The reduced stress and improved adhesion may reduce the occurrence of delamination defects. An IPD component including IPD(s) and metal contacts as described above may be incorporated into a package substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:基板核心</p>
        <p type="p">102:第一表面/表面</p>
        <p type="p">103:第二表面/表面</p>
        <p type="p">104:核心金屬特徵</p>
        <p type="p">105:整合被動裝置</p>
        <p type="p">106:導電通孔</p>
        <p type="p">107:鈍化層</p>
        <p type="p">108:接觸通孔</p>
        <p type="p">111:整合被動裝置部件</p>
        <p type="p">117:金屬墊</p>
        <p type="p">125:介電聚合物覆蓋層</p>
        <p type="p">127:介電材料</p>
        <p type="p">129:導電互連結構/接觸通孔</p>
        <p type="p">131:第一再分佈層</p>
        <p type="p">133:第二再分佈層</p>
        <p type="p">135:金屬互連結構/導電互連結構</p>
        <p type="p">140:封裝基板</p>
        <p type="p">142:第一表面/正表面</p>
        <p type="p">144:第二表面/背表面</p>
        <p type="p">146:接合墊</p>
        <p type="p">147:接合墊</p>
        <p type="p">150:半導體封裝體</p>
        <p type="p">151:第一半導體晶粒/半導體晶粒</p>
        <p type="p">153:第二半導體晶粒/半導體晶粒</p>
        <p type="p">154:接合結構</p>
        <p type="p">156:底部填充材料部分</p>
        <p type="p">157:焊球</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10033.JPG" file="ed10033.JPG" height="362px" img-content="tif" inline="yes" orientation="portrait" width="748px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623210</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100641</doc-number>
          <kind></kind>
          <date>114/01/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250203B">H04B1/06</main-classification>
        <further-classification edition="201501120250203B">H04B1/38</further-classification>
        <further-classification edition="200601120250203B">H04L27/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION INDUSTRY COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUAN-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116651519</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>無線訊號接收裝置和無線訊號接收方法</chinese-title>
        <english-title>WIRELESS SIGNAL RECEIVING DEVICE AND RECEIVING METHOD OF WIRELESS SIGNAL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種無線訊號接收裝置及無線訊號接收方法，無線訊號接收方法透過無線訊號接收裝置執行並包括：透過天線接收無人機的導頻訊號以及速度；執行地面訊號下鏈接收與同步演算法，地面訊號下鏈接收與同步演算法包括下列步驟：根據無人機的位置、天線的位置以及導頻訊號的傳遞方向，計算訊號抵達角；根據導頻訊號的頻率、速度以及訊號抵達角，計算都普勒頻率偏移；根據都普勒頻率偏移，調整導頻訊號的頻率；根據對應導頻訊號的預設時間點，調整導頻訊號在資料符元的出現時間點；根據調整後出現時間點，調整資料符元的取樣時間點。透過前述方法，修正都普勒頻率偏移並達成訊號幀同步。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a wireless signal receiving device and a receiving method of a wireless signal, and the receiving method of the wireless signal performed by the wireless signal receiving device including: receiving the pilot signal and the velocity of a UAV by an antenna; performing a ground downlink signal reception and synchronization algorithm which includes steps as follows: according to the position of the UAV, the position of the antenna and the transmission direction of the pilot signal, calculating an angle of arrival; according to the frequency of the pilot signal, the velocity of the UAV and the angle of arrival, calculating a doppler frequency shift; according to the doppler frequency shift, adjusting the frequency of the pilot signal; according to the preset time point corresponding to the pilot signal, adjusting the present time point of the pilot signal in a data symbol; according to the adjusted present time point, adjusting the sampling time point of the pilot signal. By the foregoing method, the doppler frequency shift is modified and frame synchronization is achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10,S20:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="190px" img-content="tif" inline="yes" orientation="portrait" width="696px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623127</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100643</doc-number>
          <kind></kind>
          <date>114/01/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250401B">H01R24/60</main-classification>
        <further-classification edition="201101120250401B">H01R13/6589</further-classification>
        <further-classification edition="201101120250401B">H01R13/6471</further-classification>
        <further-classification edition="200601120250401B">H01R13/506</further-classification>
        <further-classification edition="201101120250401B">H01R12/71</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立德精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張勛徐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XUNXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐紅強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117348966</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>連接器及電子設備的配件</chinese-title>
        <english-title>A CONNECTOR AND ACCESSORIES FOR AN ELECTRONIC EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器及電子設備的配件，連接器包括中間屏蔽件，中間屏蔽件設置有多個輔助接地引腳；端子組件包括第一信號端子組和第二信號端子組，第一信號端子組和第二信號端子組沿連接器的厚度方向設於中間屏蔽件的兩側；第一信號端子組包括間隔設置的多個第一引腳部，多個第一引腳部中夾設一個輔助接地引腳；第二信號端子組包括間隔設置的多個第二引腳部，多個第二引腳部中夾設一個輔助接地引腳；第一引腳部、第二引腳部以及輔助接地引腳並排設置，多個第一引腳部中的至少一者用於傳輸高頻信號，多個第二引腳部中的至少一者用於傳輸高頻信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to a connector and accessories for an electronic equipment. The connector includes an intermediate shielding member. The intermediate shielding member is provided with a plurality of auxiliary ground pins. A terminal assembly includes a first signal terminal group and a second signal terminal group. The first signal terminal group and the second signal terminal group are arranged on both sides of the intermediate shielding member along the thickness direction of the connector. The first signal terminal group includes a plurality of first pin portions arranged at intervals. An auxiliary ground pin is sandwiched among the plurality of first pin portions. The second signal terminal group includes a plurality of second pin portions arranged at intervals. An auxiliary ground pin is sandwiched among the plurality of second pin portions. The first pin portion, the second pin portion and the auxiliary ground pin are arranged side by side. At least one of the plurality of first pin portions is used to transmit a high frequency signal. At least one of the plurality of second pin portions is used to transmit a high-frequency signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接器</p>
        <p type="p">111:第一信號端子組</p>
        <p type="p">112:第二信號端子組</p>
        <p type="p">113:第三信號端子組</p>
        <p type="p">114:第四信號端子組</p>
        <p type="p">12:屏蔽結構</p>
        <p type="p">121:中間屏蔽件</p>
        <p type="p">122:外屏蔽件</p>
        <p type="p">131:第一絕緣件</p>
        <p type="p">1311:第一限位通孔</p>
        <p type="p">1312:第一避讓凹槽</p>
        <p type="p">1314:第一定位柱</p>
        <p type="p">1315:第二限位塊</p>
        <p type="p">1316:第二插孔</p>
        <p type="p">132:第二絕緣件</p>
        <p type="p">1324:第二避讓凹槽</p>
        <p type="p">1325:第二凸起</p>
        <p type="p">133:第三絕緣件</p>
        <p type="p">1331:限位凹槽</p>
        <p type="p">1332:嵌設槽</p>
        <p type="p">14:隔離座</p>
        <p type="p">142:遮擋壁</p>
        <p type="p">15:殼結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="773px" img-content="tif" inline="yes" orientation="portrait" width="684px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623673</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100813</doc-number>
          <kind></kind>
          <date>114/01/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凃偉祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, WEI-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭冠程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, KUAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明機</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LII, MIRNG-JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/954,798</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝件及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成半導體封裝件的方法，包括：在第一導電部件上形成鈍化結構；在鈍化結構中形成開口，以露出第一導電部件；在鈍化結構上以及在開口中形成保護層，其中在鈍化結構上的保護層具有第一厚度；凹蝕保護層的部分以形成凹槽，其中凹槽露出第一導電部件，其中在凹槽的側壁上的保護層的第二厚度小於第一厚度；以及在保護層上以及在凹槽中形成第二導電部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a passivation structure over a first conductive feature; forming an opening in the passivation structure to expose the first conductive feature; forming a protection layer over the passivation structure and within the opening, wherein the protection layer over the passivation structure has a first thickness; recessing a portion of the protection layer to form a recess, wherein the recess exposes the first conductive feature, wherein a second thickness of the protection layer at a sidewall of the recess is smaller than the first thickness; and forming a second conductive feature over the protection layer and within the recess.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">104:裝置</p>
        <p type="p">108:介電質/ILD</p>
        <p type="p">110:插塞</p>
        <p type="p">112:互連結構</p>
        <p type="p">114:線</p>
        <p type="p">116:通孔</p>
        <p type="p">118:介電層</p>
        <p type="p">120:金屬部件</p>
        <p type="p">122:介電層</p>
        <p type="p">124:鈍化層</p>
        <p type="p">136:RDL</p>
        <p type="p">140:鈍化層</p>
        <p type="p">142:鈍化層</p>
        <p type="p">146:保護層</p>
        <p type="p">147:表面</p>
        <p type="p">160:凸塊下金屬化層/UBM</p>
        <p type="p">162:導電連接器</p>
        <p type="p">170:區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10035.png" file="d10035.TIF" giffile="ed10035.png" height="626px" img-content="tif" inline="yes" orientation="portrait" width="907px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621804</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100957</doc-number>
          <kind></kind>
          <date>114/01/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B08B7/00</main-classification>
        <further-classification edition="200601120260302B">B65H18/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓政洹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JEONG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0009346</doc-number>
          <date>20240122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>壓印頭清潔裝置及清潔方法</chinese-title>
        <english-title>STAMP CLEANING DEVICE AND METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種使用拉伸裝置之壓印頭清潔裝置及清潔方法。該壓印頭清潔裝置，包含：一卷對卷單元，該卷對卷單元包含一第一捲動部及一第二捲動部，其中該第二捲動部設置成與該第一捲動部分隔開，且配置以將一黏合膜自該第一捲動部移動至該第二捲動部；以及一清潔單元，設置於該第一捲動部及該第二捲動部之間，該清潔單元配置以拉伸該黏合膜，並透過拉伸的該黏合膜黏附於黏附在一壓印頭上的污染物，以清除該壓印頭的污染物，其中，該卷對卷單元配置以將黏附有污染物的該黏合膜捲繞至該第二捲動部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A stamp cleaning device and method thereof using a stretching device are provided. A stamp cleaning device includes: a roll-to-roll unit including a first rolling portion and a second rolling portion, where the second rolling portion is disposed to be spaced apart from the first rolling portion, and configured to move an adhesive film from the first rolling portion to the second rolling portion; and a cleaning unit disposed between the first rolling portion and the second rolling portion, configured to stretch the adhesive film, and clean contaminants of a stamp by adhering the stretched adhesive film to the contaminants adhered to the stamp, where the roll-to-roll unit is configured to wind the adhesive film to which the contaminants are attached to the second rolling portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:壓印頭</p>
        <p type="p">20:壓印移轉頭</p>
        <p type="p">100:卷對卷單元</p>
        <p type="p">110:第一捲動部</p>
        <p type="p">120:第二捲動部</p>
        <p type="p">130:第三捲動部</p>
        <p type="p">140:第一導引滾輪</p>
        <p type="p">150:第二導引滾輪</p>
        <p type="p">200:清潔單元</p>
        <p type="p">210:支撐部</p>
        <p type="p">220:驅動部</p>
        <p type="p">221-O:開口</p>
        <p type="p">F:黏合膜</p>
        <p type="p">SC1:壓印頭清潔裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="780px" img-content="tif" inline="yes" orientation="portrait" width="954px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623101</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114100978</doc-number>
          <kind></kind>
          <date>114/01/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120260302B">H01R12/71</main-classification>
        <further-classification edition="201101120260302B">H01R12/70</further-classification>
        <further-classification edition="200601120260302B">H01R13/02</further-classification>
        <further-classification edition="200601120260302B">H01R13/73</further-classification>
        <further-classification edition="200601120260302B">H01R13/502</further-classification>
        <further-classification edition="200601120260302B">H05K1/11</further-classification>
        <further-classification edition="202601120260302B">H05K1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立德精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張勛徐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XUNXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐紅強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117348453</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>連接器及電子設備的配件</chinese-title>
        <english-title>CONNECTOR AND ACCESSORY OF ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種連接器及電子設備的配件，連接器與電路板裝配連接，並具有相對的第一端和第二端，連接器包括屏蔽結構和絕緣結構，屏蔽結構位於第一端與絕緣結構連接；殼結構套設在絕緣結構的外側並貼設在電路板上，殼結構透過緊固件與電路板連接；端子組件部分設在絕緣結構內，並包括多組第一導電端子和多組第二導電端子，位於第二端的第一導電端子和第二導電端子穿出絕緣結構，第一導電端子和第二導電端子沿垂直於連接器之厚度方向的第一方向交替排布；電路板設有導電片，連接器設在電路板中，第一導電端子、第二導電端子與導電片電連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a connector and an accessory of an electronic device. The connector is connected to a circuit board and is provided with a first end and a second end opposite to each other. The connector includes a shielding structure and an insulating structure. The shielding structure is located at the first end and is connected to the insulating structure. A shell structure is sleeved on an outside of the insulating structure and is adhered on the circuit board. The shell structure is connected to the circuit board through a fastener. A terminal assembly is partially disposed in the insulating structure and includes a plurality of first conductive terminals and a plurality of second conductive terminals. The first conductive terminals and the second conductive terminals located at the second end penetrate the insulating structure. The first conductive terminals and the second conductive terminals are alternately arranged along a first direction perpendicular to a thickness direction of the connector. A conductive sheet is disposed on the circuit board. The connector is disposed in the circuit board. The first conductive terminals and the second conductive terminals are electrically connected to the conductive sheet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">13:屏蔽結構</p>
        <p type="p">131:外屏蔽件</p>
        <p type="p">132:中間屏蔽件</p>
        <p type="p">141:第一絕緣件</p>
        <p type="p">1411:第一限位通孔</p>
        <p type="p">1412:第一避讓凹槽</p>
        <p type="p">1414:第二限位塊</p>
        <p type="p">1415:第一定位柱</p>
        <p type="p">1416:第二插孔</p>
        <p type="p">142:第二絕緣件</p>
        <p type="p">1423:第二避讓凹槽</p>
        <p type="p">1424:第二凸起</p>
        <p type="p">143:第三絕緣件</p>
        <p type="p">1431:嵌設槽</p>
        <p type="p">1432:限位凹槽</p>
        <p type="p">161:第一導電端子</p>
        <p type="p">162:第二導電端子</p>
        <p type="p">17:隔離座</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="753px" img-content="tif" inline="yes" orientation="portrait" width="715px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622830</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101043</doc-number>
          <kind></kind>
          <date>114/01/10</date>
        </document-id>
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        <main-classification edition="202301120250915B">G06Q10/087</main-classification>
        <further-classification edition="202301120250915B">G06Q30/06</further-classification>
        <further-classification edition="201201120250915B">G06Q50/10</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈文達拉朱　納文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOVINDARAJU, NAVEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權　伊薩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, ISSAC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張光耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, GUANGYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭世煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, SEHWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金堰安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, YANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏巍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175061</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>處理緊急旗標之方法、裝置及記錄有命令之記錄媒體</chinese-title>
        <english-title>METHOD, APPARATUS AND RECORDING MEDIUM STORING INSTRUCTIONS FOR PROCESSING URGENT FLAG</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一實施例之藉由電子裝置而實行之方法可包括如下步驟：識別與目標物流中心相關聯之至少一個商品；於上述至少一個商品中識別設定有緊急旗標之至少一個第1商品、及未設定上述緊急旗標之至少一個第2商品；及對上述至少一個第1商品設定緊急通道，對上述至少一個第2商品設定普通通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:入站系統</p>
        <p type="p">110:卸載</p>
        <p type="p">120:入庫</p>
        <p type="p">130:陳列</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="407px" img-content="tif" inline="yes" orientation="portrait" width="855px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623377</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101252</doc-number>
          <kind></kind>
          <date>114/01/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250516B">H10D30/01</main-classification>
        <further-classification edition="202501120250516B">H10D30/62</further-classification>
        <further-classification edition="202501120250516B">H10D64/01</further-classification>
        <further-classification edition="202501120250516B">H10D62/17</further-classification>
        <further-classification edition="202501120250516B">H10D64/27</further-classification>
        <further-classification edition="202501120250516B">H10D64/23</further-classification>
        <further-classification edition="200601120250516B">H03K17/689</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昱志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊富雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FU-HSIUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉思賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SZU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳斐筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FEI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/950,566</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電晶體及形成電晶體的方法</chinese-title>
        <english-title>TRANSISTORS AND METHODS FOR FORMING TRANSISTORS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電晶體的閘極介電層包括中央區域和一個或多個邊緣區域。中央區域的厚度小於多個邊緣區域的厚度。這增加了角落氧化物厚度並減少了雙峰現象，在不需要額外遮罩的情況下改善了性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The gate dielectric layer of a transistor includes a central region and one or more edge regions. The thickness of the central region is less than the thickness of the plurality of edge regions. This increases the corner oxide thickness and reduces the double hump phenomenon, improving performance without needing an extra mask.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101、103:電晶體</p>
        <p type="p">110:基板</p>
        <p type="p">114、115:隔離區</p>
        <p type="p">116:第一主動區</p>
        <p type="p">117:第二主動區</p>
        <p type="p">150:閘極</p>
        <p type="p">160:源極/汲極</p>
        <p type="p">D-D:線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10033.png" file="d10033.TIF" giffile="ed10033.png" height="951px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622522</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101258</doc-number>
          <kind></kind>
          <date>114/01/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120260302B">G01R31/26</main-classification>
        <further-classification edition="200601120260302B">G01R1/073</further-classification>
        <further-classification edition="202601120260302B">H10W46/00</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭天毓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TIEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃政翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHENG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JIAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/953,096</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶片探測設備、晶片探測方法及偏移檢測圖案</chinese-title>
        <english-title>CHIP PROBING APPARATUS, CHIP PROBING METHOD AND SHIFT DETECTION PATTERN</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶片探測設備，適於執行晶圓的晶片探測製程。晶圓包括積體電路區域、切割線區域及分佈在切割線區域中的至少一個偏移檢測圖案。晶片探測設備包括探針卡，而探針卡包括電氣量測探針及偏移檢測探針，其中電氣量測探針適於壓在積體電路區域上，偏移檢測探針適於壓在偏移檢測圖案上。至少一個偏移檢測圖案包括目標探測圖案及分佈在目標探測圖案附近的輔助圖形，當探針卡與晶圓誤對準時，偏移檢測探針中的一者會同時壓在目標探測圖案及輔助圖形上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip probing apparatus, adapted to perform a chip probing process of a wafer is provided. The wafer includes integrated circuit regions, scribe line regions and at least one shift detection pattern distributed in the scribe line regions. The chip probing apparatus includes a probe card including electrical measurement needles and shift detection needles, wherein the electrical measurement needles are adapted to be pressed onto the integrated circuit regions, and the shift detection needles are adapted to be pressed onto the shift detection pattern. The at least one shift detection pattern includes a target probing pattern and an auxiliary pattern distributed in proximity to the target probing pattern, and one of the shift detection needles is pressed onto the target probing pattern and the auxiliary pattern simultaneously when the probe card is misaligned with the wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶片探測設備</p>
        <p type="p">110:探針卡</p>
        <p type="p">112:基板</p>
        <p type="p">114:電氣量測探針</p>
        <p type="p">116a、116b:偏移檢測探針</p>
        <p type="p">120、130:晶圓</p>
        <p type="p">140:測試頭</p>
        <p type="p">150:強化構件</p>
        <p type="p">160:電路板</p>
        <p type="p">170:導電凸塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.png" file="d10018.TIF" giffile="ed10018.png" height="510px" img-content="tif" inline="yes" orientation="portrait" width="972px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623454</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101259</doc-number>
          <kind></kind>
          <date>114/01/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D88/00</main-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202601120260302B">H10W10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾明慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MING-TSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林詠淇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林修任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIEH, JYU-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/953,125</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例的半導體裝置包括第一半導體基底、介電材料、第一互連結構以及第一接合結構。所述第一半導體基底具有第一傾斜側壁。所述介電材料位於所述第一半導體基底上方並具有側壁、第二傾斜側壁以及位於所述側壁和所述第二傾斜側壁之間的轉折點。所述第一互連結構位於所述第一半導體基底上方並至少被所述介電材料側向環繞。所述第一接合結構位於所述第一互連結構上方並至少被所述介電材料側向環繞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first semiconductor substrate, a dielectric material, a first interconnect structure and a first bonding structure. The first semiconductor substrate has a first inclined sidewall. The dielectric material is disposed over the first semiconductor substrate and has a sidewall, a second inclined sidewall and a turning point between the sidewall and the second inclined sidewall. The first interconnect structure is disposed over the first semiconductor substrate and at least laterally surrounded by the dielectric material. The first bonding structure is disposed over the first interconnect structure and at least laterally surrounded by the dielectric material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體結構</p>
        <p type="p">110、120:半導體晶粒</p>
        <p type="p">112、122:半導體基底</p>
        <p type="p">122a:前側</p>
        <p type="p">122b:背側</p>
        <p type="p">132t、1281t、1282t:表面</p>
        <p type="p">112W、112W’、120W、132W、1161W1、1161W2’、1181W:側壁</p>
        <p type="p">114:裝置</p>
        <p type="p">116、126:互連結構</p>
        <p type="p">117:密封環</p>
        <p type="p">118、128:接合結構</p>
        <p type="p">125:通孔</p>
        <p type="p">125a、125b:端</p>
        <p type="p">132:絕緣包封體</p>
        <p type="p">140:導電墊</p>
        <p type="p">142:導電端子</p>
        <p type="p">1161、1261:介電層</p>
        <p type="p">1161S、132t:表面</p>
        <p type="p">1162:金屬化圖案</p>
        <p type="p">1181、1281:接合介電層</p>
        <p type="p">1182、1182D、1282:接合件</p>
        <p type="p">1262:金屬化圖案</p>
        <p type="p">DM:介電材料</p>
        <p type="p">DM1、DM2:介電部分</p>
        <p type="p">DM1W、DM2W:寬度</p>
        <p type="p">STP1:階梯狀側壁</p>
        <p type="p">TP:轉折點</p>
        <p type="p">θ1、θ2:角度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.png" file="d10027.TIF" giffile="ed10027.png" height="693px" img-content="tif" inline="yes" orientation="portrait" width="970px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622733</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101260</doc-number>
          <kind></kind>
          <date>114/01/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250711B">G06F9/46</main-classification>
        <further-classification edition="201801120250711B">G06F9/30</further-classification>
        <further-classification edition="200601120250711B">G06F9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣旭哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, HSU-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁啓銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, CHI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡桂賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, KUEI-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張嘉麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,816</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用以處理多行程以及多執行緒的電腦系統以及方法</chinese-title>
        <english-title>COMPUTER SYSTEMS AND METHODS FOR HANDLING MULTI-PROCESSES AND MULTI-THREADS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出用於處理多行程以及多執行緒的方法及電腦系統。前述用於處理多行程的方法適用於電腦系統，以利用子行程技術或是基於行程識別碼來控制圖形處理器執行由客戶終端發送的行程的任務。前述用於處理多執行緒的方法適用於電腦系統，以基於執行緒識別碼來控制圖形處理器執行由客戶終端發送執行緒任務。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and computer systems for handling multi-processes and multi-threads are proposed. The method for handling multi-processes is applicable to a computer system to control a graphic processor to handle tasks of a process sent from a client terminal by a child process technique or based on a process ID. The method for handling multi-threads is applicable to a computer system to control a graphic processor to handle tasks of a thread sent from a client terminal based on a thread ID.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S202~S210:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="790px" img-content="tif" inline="yes" orientation="portrait" width="622px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623688</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101270</doc-number>
          <kind></kind>
          <date>114/01/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佩璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PEI-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李兆偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝政吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡毓祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,210</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶片封裝結構及其形成方法</chinese-title>
        <english-title>CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種晶片封裝結構。晶片封裝結構包括封裝基板以及安裝在晶片封裝結構上的半導體裝置。散熱層包括覆蓋半導體裝置的頂表面的第一部分、覆蓋半導體裝置的側壁的第二部分以及覆蓋封裝基板的頂表面的第三部分，第一部分、第二部分和第三部分彼此連接。至少一導熱通孔形成為穿過封裝基板以接觸散熱層的第三部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip package structure is provided. The chip package structure includes a package substrate and a semiconductor device mounted on the package substrate. A heat dissipation layer includes a first portion covering the top surface of the semiconductor device, a second portion covering the sidewall of the semiconductor device, and a third portion covering the top surface of the package substrate. The first portion, second portion and third portion are connected to each other. At least one thermal via is formed through the package substrate to contact the third portion of the heat dissipation layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶片封裝結構</p>
        <p type="p">128:導電墊</p>
        <p type="p">130A,130B:封裝元件</p>
        <p type="p">136:導電凸塊</p>
        <p type="p">140:密封劑</p>
        <p type="p">142:導電連接器</p>
        <p type="p">148:底部填充層</p>
        <p type="p">150:封裝結構/晶圓上晶片(CoW)裝置</p>
        <p type="p">160:封裝基板</p>
        <p type="p">160a:最外表面/頂表面</p>
        <p type="p">160b:最外表面/底表面</p>
        <p type="p">162,162G:導電連接器</p>
        <p type="p">164:導熱通孔</p>
        <p type="p">170:散熱層</p>
        <p type="p">180:蓋子/導熱蓋</p>
        <p type="p">181:板部分</p>
        <p type="p">182:框架部分</p>
        <p type="p">184:黏合劑</p>
        <p type="p">186:熱界面材料</p>
        <p type="p">190:散熱器</p>
        <p type="p">192:鰭片</p>
        <p type="p">194:熱界面材料</p>
        <p type="p">X,Y,Z:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10041.png" file="d10041.TIF" giffile="ed10041.png" height="715px" img-content="tif" inline="yes" orientation="portrait" width="971px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622627</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101397</doc-number>
          <kind></kind>
          <date>114/01/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120250519B">G03F1/64</main-classification>
        <further-classification edition="201201120250519B">G03F1/22</further-classification>
        <further-classification edition="200601120250519B">G03F7/20</further-classification>
        <further-classification edition="201101120250519B">B82Y30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡沛勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, PEI-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林雲躍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YUN-YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,132</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光罩護膜、其形成方法及使用其製造半導體元件的方法</chinese-title>
        <english-title>PELLICLE, METHOD OF FORMING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於在微影期間保護光罩免受污染顆粒的光罩護膜。光罩護膜包括具有硼碳氮化物（BCN）奈米結構網絡的光罩護膜物。光罩護膜物附加到光罩護膜框架，該框架安裝到在微影操作期間使用的光罩上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pellicle for protecting a photomask from contaminant particles during photolithography is provided. The pellicle includes a pellicle membrane having a network of boron carbonitride (BCN) nanostructures. The pellicle membrane is attached to a pellicle frame that is mounted to a photomask to be used during photolithography operations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">114:光罩護膜</p>
        <p type="p">222:安裝框架</p>
        <p type="p">230:光罩護膜物</p>
        <p type="p">231、231’:硼碳氮化物奈米結構</p>
        <p type="p">232:邊框</p>
        <p type="p">240:保護層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="1019px" img-content="tif" inline="yes" orientation="portrait" width="684px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623689</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101401</doc-number>
          <kind></kind>
          <date>114/01/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W40/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張介明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIEH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游明志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEW, MING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/959,167</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>封裝結構及其製造方法</chinese-title>
        <english-title>PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝結構，包括接合到封裝基底的裝置封裝元件。封裝結構包括接合到封裝基底且位於裝置封裝元件周圍的環形結構。封裝結構更包括設置在裝置封裝元件和封裝基底之間的熱管。熱管在裝置封裝元件和環形結構之間橫向延伸，並且熱管在封裝基底的法線方向上至少部分地顯露於裝置封裝元件和環形結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure is provided. The package structure includes a device package component bonded to a package substrate. The package structure includes a ring structure bonded to the package substrate and around the device package component. The package structure also includes a heat pipe disposed between the device package component and the package substrate. The heat pipe laterally extends between the device package component and the ring structure, and the heat pipe is at least partially exposed from the device package component and the ring structure in the normal direction of the package substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:封裝結構</p>
        <p type="p">50:裝置晶粒</p>
        <p type="p">100:積體電路封裝體(裝置封裝元件)</p>
        <p type="p">150:底部填充物</p>
        <p type="p">152:封裝模封材料</p>
        <p type="p">162:導電連接器</p>
        <p type="p">200:封裝基底</p>
        <p type="p">202:基底核心</p>
        <p type="p">204,205:內連線結構</p>
        <p type="p">206:阻焊劑</p>
        <p type="p">208:底部填充物</p>
        <p type="p">210:凸塊結構</p>
        <p type="p">216:阻焊劑</p>
        <p type="p">300:環形結構</p>
        <p type="p">300A:第一部分</p>
        <p type="p">300B:第二部分</p>
        <p type="p">310:黏著膜</p>
        <p type="p">400A,400B:熱管</p>
        <p type="p">500:印刷電路板</p>
        <p type="p">H:厚度</p>
        <p type="p">H1,H2:高度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.png" file="d10028.TIF" giffile="ed10028.png" height="699px" img-content="tif" inline="yes" orientation="portrait" width="988px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622561</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101467</doc-number>
          <kind></kind>
          <date>114/01/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250522B">G02B6/122</main-classification>
        <further-classification edition="200601120250522B">G02B6/34</further-classification>
        <further-classification edition="201301120250522B">H04B10/516</further-classification>
        <further-classification edition="201301120250522B">H04B10/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江嘉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉勝凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, SHENG KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂聯威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, LIAN WEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施啟元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHI-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊沛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUN-PEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張澤恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, TSE-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,431</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學裝置及調變輸入光訊號的方法</chinese-title>
        <english-title>OPTICAL DEVICE AND METHOD FOR MODULATING AN INPUT OPTICAL SIGNAL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於光學調變的光學裝置。光學裝置包括配置為將輸入光訊號分成第一光訊號和第二光訊號的光分歧器，以及包括第一波導臂和第二波導臂的相移器。第一波導臂和第二波導臂中的每一個包括多個串聯耦合的彎曲波導，且相移器配置為在第一波導臂中的第一光訊號與第二波導臂中的第二光訊號之間產生相位差。光學裝置還包括配置為結合第一光訊號和第二光訊號以產生調變輸出訊號的結合器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical device for optical modulation is provided. The optical device includes a splitter configured to split an input optical signal into a first optical signal and a second optical signal, and a phase shifter including a first waveguide arm and a second waveguide arm. Each of the first waveguide arm and the second waveguide arm includes a plurality of bending waveguides coupled in series, and the phase shifter is configured to generate a phase difference between the first optical signal in the first waveguide arm and the second optical signal in the second waveguide arm. The optical device further includes a combiner configured to combine the first optical signal and the second optical signal to generate a modulated output signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:輸入光訊號</p>
        <p type="p">20:第一光訊號</p>
        <p type="p">30:第二光訊號</p>
        <p type="p">40:第一相移光訊號</p>
        <p type="p">50:第二相移光訊號</p>
        <p type="p">60:輸出訊號</p>
        <p type="p">100:光學裝置</p>
        <p type="p">101:光分歧器</p>
        <p type="p">102:相移器</p>
        <p type="p">103:結合器</p>
        <p type="p">104:第一波導臂</p>
        <p type="p">105:第二波導臂</p>
        <p type="p">106、106a、106b:彎曲波導</p>
        <p type="p">107:直線波導</p>
        <p type="p">110:第一波導</p>
        <p type="p">111:第一光柵耦合器</p>
        <p type="p">112:第二波導</p>
        <p type="p">113:第二光柵耦合器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="622px" img-content="tif" inline="yes" orientation="portrait" width="811px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623524</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101468</doc-number>
          <kind></kind>
          <date>114/01/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳承先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN-SHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧胤龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YINLUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊曜群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YAO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊天中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TIEN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳威豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳旭賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旭峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SYUFONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JYUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/951,651</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURES AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種形成半導體結構的方法。基底設有第一區和第二區。在第一區中的基底中形成貫通孔。在第一區中形成覆蓋貫通孔的第一導電圖案，並且在第二區中的基底上同時形成第一導電層。在第一區中的第一導電圖案上形成第二導電圖案，並且在第二區中的第一導電層上同時形成第二導電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming a semiconductor structure is provided. A substrate is provided with a first region and a second region. A through via is formed in the substrate in the first region. A first conductive pattern is formed covering the through via in the first region and a first conductive layer is simultaneously formed on the substrate in the second region. A second conductive pattern is formed on the first conductive pattern in the first region and a second conductive layer is simultaneously formed on the first conductive layer in the second region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">402、404、406、407、408、410:動作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10049.png" file="d10049.TIF" giffile="ed10049.png" height="843px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623370</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101493</doc-number>
          <kind></kind>
          <date>114/01/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D1/68</main-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202301120260302B">H10N97/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林杏芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊蒔融</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHIH-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王教瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JAIO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉克群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KO CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉人誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊敦年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAUNG, DUN-NIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/950,473</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積體電路裝置及其製造方法</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一些實施例涉及包括雙側電容器結構的積體電路裝置。積體電路裝置包括設置在基底上方的多個介電層以及包含多個電容部分的電容結構。每個電容部分包括延伸穿過所述多個介電層的第一導電元件、延伸穿過所述多個介電層且沿著第一導電元件對齊的介電元件、以及延伸穿過所述多個介電層且沿著介電元件對齊的第二導電元件。所述多個介電層中的至少一個包括在所述多個電容部分中的多個第一相鄰對之間橫向延伸的第一介電層，其中第一相鄰對中的每一對中的電容部分的間隔小於第一長度。第一介電層包括限定多個電容部分中的多個第二相鄰對中的每一對之間的間隙的側壁，其中間隙的長度大於或等於第一長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Some embodiments relate to an integrated circuit （IC） device that includes a double-sided capacitor structure. The IC device includes dielectric layers disposed over a substrate, and a capacitor structure including capacitor portions. Each capacitor portion includes a first conductive element extending through the dielectric layers, a dielectric element extending through the dielectric layers and aligned along the first conductive element, and a second conductive element extending through the dielectric layers and aligned along the dielectric element. At least one of the dielectric layers includes a first dielectric layer that laterally extends between first neighboring pairs of the capacitor portions, where capacitor portions in each of the first neighboring pairs are separated by less than a first length. The first dielectric layer includes sidewalls defining gaps between each of second neighboring pairs of the capacitor portions, where lengths of the gaps are greater than or equal to the first length.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1900:方法</p>
        <p type="p">1902、1904、1906、1908、1910、1912、1914、1916、1918、1920、1922、1924:動作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.bmp" file="ed10032.bmp" height="964px" img-content="tif" inline="yes" orientation="portrait" width="718px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622828</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101574</doc-number>
          <kind></kind>
          <date>114/01/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120250701B">G06Q10/08</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫納爾　羅希特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNAL, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪爾　阿迪特雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ADITYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇拉西達桑　沙拉迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THULASIDASAN, SARADHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0166511</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置及其動作方法、以及包括電子裝置之系統</chinese-title>
        <english-title>ELECTRONIC DEVICE AND METHOD OF OPERATING THE SAME, AND SYSTEM INCLUDING THE ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種電子裝置之動作方法。動作方法可包括如下步驟：確認包括至少一個物品之運送箱之已掃描之識別資訊；確認上述運送箱所包括之上述至少一個物品中之所選物品之已掃描之識別資訊；確認與上述所選物品對應之發票；確認附著有上述發票之包裝箱是否處於開放狀態；於上述包裝箱處於開放狀態之情形時，控制上述所選物品所處之第1板之斜率；及以密封上述包裝箱之方式進行控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S610:動作</p>
        <p type="p">S620:動作</p>
        <p type="p">S630:動作</p>
        <p type="p">S640:動作</p>
        <p type="p">S650:動作</p>
        <p type="p">S660:動作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="742px" img-content="tif" inline="yes" orientation="portrait" width="626px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623412</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101627</doc-number>
          <kind></kind>
          <date>114/01/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250602B">H10D62/17</main-classification>
        <further-classification edition="202501120250602B">H10D64/27</further-classification>
        <further-classification edition="202501120250602B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳奕寰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋主名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JHU-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佳叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIA-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳斐筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FEI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱振樑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/956,160</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積體晶片及其形成方法</chinese-title>
        <english-title>INTEGRATED CHIP AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">積體晶片包括沿著半導體基底的第一源極/汲極區和第二源極/汲極區。通道區沿著基底從第一源極/汲極區延伸到第二源極/汲極區。閘極電極位於第一和第二源極/汲極區之間。閘極電極具有第一和第二外側壁以及從第一外側壁延伸到第二外側壁的底表面。閘極介電層位於閘極電極和通道區之間。閘極介電層的橫向部分沿著閘極電極的底表面橫向延伸。閘極介電層的第一和第二垂直部分從橫向部分沿著閘極電極的第一和第二外側壁向上延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated chip including a first source/drain region and a second source/drain region along a semiconductor substrate. A channel region extends along the substrate from the first source/drain region to the second source/drain region. The gate electrode is between the first and second source/drain regions. The gate electrode has first and second outer sidewalls and a bottom surface extending from the first outer sidewall to the second outer sidewall. The gate dielectric layer is between the gate electrode and the channel region. A lateral portion of the gate dielectric layer extends laterally along the bottom surface of the gate electrode. First and second vertical portions of the gate dielectric layer extend upward from the lateral portion along the first and second outer sidewalls of the gate electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:剖視圖</p>
        <p type="p">101x,101z:軸</p>
        <p type="p">101:電晶體</p>
        <p type="p">102:半導體基底</p>
        <p type="p">102a,110d:頂表面</p>
        <p type="p">104:第一源極/汲極區、源極/汲極區</p>
        <p type="p">106:第二源極/汲極區、源極/汲極區</p>
        <p type="p">108:通道區</p>
        <p type="p">110:閘極電極</p>
        <p type="p">110a,112c:第一外側壁/側壁</p>
        <p type="p">110b,112d:第二外側壁/側壁</p>
        <p type="p">110c,112b:底表面</p>
        <p type="p">112:閘極介電層</p>
        <p type="p">112a:第一上表面/上表面</p>
        <p type="p">112e:第二上表面/上表面</p>
        <p type="p">112f:第一內側壁/側壁</p>
        <p type="p">112g:第三上表面/上表面</p>
        <p type="p">112h:第二內側壁/側壁</p>
        <p type="p">114:橫向部分</p>
        <p type="p">116:第一垂直部分</p>
        <p type="p">118:第二垂直部分</p>
        <p type="p">120:第一厚度</p>
        <p type="p">122:第二厚度</p>
        <p type="p">124:第三厚度</p>
        <p type="p">126:第一輕摻雜源極/汲極區、輕摻雜源極/汲極區、源極/汲極區</p>
        <p type="p">128:第二輕摻雜源極/汲極區、輕摻雜源極/汲極區、源極/汲極區</p>
        <p type="p">130:淺溝隔離(STI)結構</p>
        <p type="p">132:第一側壁間隔物/側壁間隔物</p>
        <p type="p">134:第二側壁間隔物/側壁間隔物</p>
        <p type="p">136:介電結構</p>
        <p type="p">138:第一接觸件/接觸件</p>
        <p type="p">140:第二接觸件/接觸件</p>
        <p type="p">142:第三接觸件/接觸件</p>
        <p type="p">A-A’:線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="514px" img-content="tif" inline="yes" orientation="portrait" width="715px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623569</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101708</doc-number>
          <kind></kind>
          <date>114/01/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/10</main-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖崇憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHUNG HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓瑞木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, JUI-MU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃邦育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BANG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建坊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯家瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, CHIA-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張致國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-KUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/807,102</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>運輸箱</chinese-title>
        <english-title>TRANSPORT CASE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種運輸箱用以保持複數個晶圓以便運輸晶圓。運輸箱包括感測器系統，感測器系統用以在運輸箱停靠在半導體處理工具的裝載/卸載系統時產生指示運輸箱內狀況的感測器資料。運輸箱包括通訊系統，通訊系統用以將感測器資料自感測器系統傳輸至外部控制系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transport case is configured to hold a plurality of wafers for transport of the wafers. The transport case includes a sensor system configured to generate sensor data indicative of conditions within the transport case while the transport case is docked at a load/unload system of a semiconductor process tool. The transport case includes a communication system configured to transmit the sensor data from the sensor system to an external control system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體處理系統</p>
        <p type="p">101:網路</p>
        <p type="p">102:運輸箱</p>
        <p type="p">104:控制系統</p>
        <p type="p">105:分析模型</p>
        <p type="p">106:裝載/卸載系統</p>
        <p type="p">107:處理工具</p>
        <p type="p">108:槽</p>
        <p type="p">110:晶圓</p>
        <p type="p">112:感測器系統</p>
        <p type="p">114:感測器</p>
        <p type="p">116:控制系統</p>
        <p type="p">118:通訊系統</p>
        <p type="p">119:電源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.png" file="d10020.TIF" giffile="ed10020.png" height="735px" img-content="tif" inline="yes" orientation="portrait" width="902px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622509</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101752</doc-number>
          <kind></kind>
          <date>114/01/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250708B">G01R1/04</main-classification>
        <further-classification edition="200601120250708B">G01R1/073</further-classification>
        <further-classification edition="200601120250708B">G01R1/18</further-classification>
        <further-classification edition="202001120250708B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚書安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANG, SHU AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃光興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, GUANG-SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯凱驛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, KAI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何修羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, HSIOU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,787</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>測試系統</chinese-title>
        <english-title>TESTING SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種測試系統及使用其的測試方法。該測試系統包括用於測試待測裝置（DUT）的探針卡。該探針卡包括：空間轉換器；配置在空間變換器的第一表面之上的線路板；以及配置在空間變換器的第二表面之上的探針頭。該探針頭包括：通過間隔物彼此間隔開的下板與上板；至少兩個回送探針分別貫穿上板與下板，以在待測裝置上的至少兩個回送凸塊之間傳輸回送測試訊號；以及第一遮蔽結構從下板的下表面往待測裝置的上表面延伸且水平配置在至少兩個回送探針之間，其中第一遮蔽結構被配置為具有接地電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a testing system and a testing method of using the same. The testing system includes a probe card for testing a device under test (DUT). The probe card includes: a space transformer; a circuit board over a first surface of the space transformer; and a probe head over a second surface of the space transformer. The probe head includes: a lower plate spaced from an upper plate by a spacer; at least two loopback probe pins respectively penetrating through the lower plate and the upper plate to carry a loopback test signal between at least two loopback bumps on the DUT; and a first shielding structure extending from a lower surface of the lower plate toward an upper surface of the DUT and horizontally disposed between the at least two loopback probe pins, wherein the first shielding structure is configured to have a ground voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:探針卡</p>
        <p type="p">22:第一凸塊/凸塊</p>
        <p type="p">24、24A、24B、24C:第二凸塊/凸塊</p>
        <p type="p">26:第三凸塊/凸塊</p>
        <p type="p">28:第四凸塊/凸塊</p>
        <p type="p">50:待測裝置</p>
        <p type="p">100:探針頭</p>
        <p type="p">110:下板</p>
        <p type="p">112、114、116、118:第一開口</p>
        <p type="p">120:上板</p>
        <p type="p">122、124、126、128:第二開口</p>
        <p type="p">130:間隔物</p>
        <p type="p">142:回送探針/探針</p>
        <p type="p">144:接地探針/探針</p>
        <p type="p">146:I/O探針/探針</p>
        <p type="p">148:電源探針/探針</p>
        <p type="p">152:第一遮蔽結構/遮蔽結構</p>
        <p type="p">154:第二遮蔽結構/遮蔽結構</p>
        <p type="p">156:第三遮蔽結構/遮蔽結構</p>
        <p type="p">162、164、166、172、182:介電層</p>
        <p type="p">170:第一導電層</p>
        <p type="p">180:第二導電層</p>
        <p type="p">184:固定元件</p>
        <p type="p">200:線路板</p>
        <p type="p">300:空間轉換器</p>
        <p type="p">300a:第一表面</p>
        <p type="p">300b:第二表面</p>
        <p type="p">302、304、306、308:導電佈線</p>
        <p type="p">400:治具</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="726px" img-content="tif" inline="yes" orientation="portrait" width="997px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623398</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101754</doc-number>
          <kind></kind>
          <date>114/01/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250901B">H10D30/66</main-classification>
        <further-classification edition="202501120250901B">H10D62/10</further-classification>
        <further-classification edition="202501120250901B">H10D62/60</further-classification>
        <further-classification edition="202501120250901B">H10D62/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林東陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TUNG-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳瑞興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, RUEY-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,062</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種深溝渠結構可形成為包括摻雜多晶矽核心以及摻雜多晶矽核心的側壁上的介電隔離層。該深溝渠結構可被提供以作為深溝渠隔離結構，其在半導體裝置中橫向環繞電晶體。另外及/或替代地，該深溝渠結構可被包括在高壓電晶體中以作為垂直汲極區域，其延伸進入半導體裝置的半導體層中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A deep trench structure may be formed to include a doped polysilicon core and dielectric isolation layers on the sidewalls of the doped polysilicon core. The deep trench structure may be provided as a deep trench isolation structure that laterally surrounds transistors in a semiconductor device. Additionally and/or alternatively, the deep trench structure may be included in a high-voltage transistor as a vertical drain region that extends into a semiconductor layer of a semiconductor device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">106:底部半導體層</p>
        <p type="p">108:積體電路裝置</p>
        <p type="p">110:介電層</p>
        <p type="p">112a、112b、112c:接觸結構</p>
        <p type="p">200:示例實施</p>
        <p type="p">202:摻雜半導體層</p>
        <p type="p">204:摻雜埋入半導體層</p>
        <p type="p">206:塊狀區域</p>
        <p type="p">208:源極/汲極區</p>
        <p type="p">212:垂直源極/汲極區</p>
        <p type="p">210:深溝渠結構</p>
        <p type="p">214:介電隔離層/第一介電隔離層/第二介電隔離層</p>
        <p type="p">216:閘極結構</p>
        <p type="p">218:通道區</p>
        <p type="p">220:閘極介電層</p>
        <p type="p">222:側壁間隔層</p>
        <p type="p">224:本體植入區域</p>
        <p type="p">226:垂直漂移區</p>
        <p type="p">D1、D2、D3、D4、D5、D6:尺寸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10034.png" file="d10034.TIF" giffile="ed10034.png" height="943px" img-content="tif" inline="yes" orientation="portrait" width="735px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623400</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101768</doc-number>
          <kind></kind>
          <date>114/01/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260224B">H10D30/67</main-classification>
        <further-classification edition="202501120260224B">H10D30/01</further-classification>
        <further-classification edition="202501120260224B">H10D30/43</further-classification>
        <further-classification edition="202501120260224B">H10D62/10</further-classification>
        <further-classification edition="202501120260224B">H10D62/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-GING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉駿逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JUN-YE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昀錚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUN-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,385</doc-number>
          <date>20240728</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/954,778</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例涉及半導體裝置結構。該結構包括：基板；絕緣材料，設置在該基板上；第一鰭結構，從該基板向上延伸穿過該絕緣材料；第二鰭結構，從該基板向上延伸穿過該絕緣材料；源極/汲極（S/D）特徵，設置在該第一鰭結構和該第二鰭結構之間；以及隔離溝槽結構，延伸穿過該第一鰭結構並進入該基板，其中，該隔離溝槽結構具有摻雜側壁區域，該摻雜側壁區設置在該S/D特徵和該隔離溝槽結構之間並與該S/D特徵和該隔離溝槽結構接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to a semiconductor device structure. The structure includes a substrate, an insulating material disposed on the substrate, a first fin structure extending upwardly from the substrate through the insulating material, a second fin structure extending upwardly from the substrate through the insulating material, a source/drain (S/D) feature disposed between the first and second fin structures, and an isolation trench structure extending through the first fin structure and into the substrate, wherein the isolation trench structure has a doped sidewall region disposed between and in contact with the S/D feature and the isolation trench structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:基板</p>
        <p type="p">112:鰭結構</p>
        <p type="p">138:閘極間隔件</p>
        <p type="p">144:介電質間隔件</p>
        <p type="p">146:S/D特徵、S/D區域</p>
        <p type="p">160t:隔離溝槽</p>
        <p type="p">162:接觸蝕刻停止層(CESL)</p>
        <p type="p">164:層間介電質(ILD)層</p>
        <p type="p">167ta:隔離溝槽結構</p>
        <p type="p">167tb:隔離溝槽結構</p>
        <p type="p">178:介面層(IL)</p>
        <p type="p">180:閘極介電質層</p>
        <p type="p">182:閘極電極層</p>
        <p type="p">200:半導體裝置結構</p>
        <p type="p">4408:保護障壁件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10154.JPG" file="ed10154.JPG" height="431px" img-content="tif" inline="yes" orientation="portrait" width="364px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622895</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101883</doc-number>
          <kind></kind>
          <date>114/01/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">G06T11/00</main-classification>
        <further-classification edition="201701120260302B">G06T7/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商輝創電子科技（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHETRON ELECTRONICS (SUZHOU)CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳加增</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIA-TSENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116614030</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>物件影像渲染方法及其系統</chinese-title>
        <english-title>RENDERING METHOD FOR OBJECT IMAGE AND SYSTEM THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種物件影像渲染方法及其系統，用以解決習知影像處理技術無法呈現重製物件完整外觀之3D影像的問題。係包含：自輸入影像中識別出感興趣物件各部位區域的區域位置資訊、區域輪廓及區域外觀；將區域位置資訊與相應的區域輪廓，建立輪廓映射關係；將區域位置資訊與相應的區域外觀，建立外觀映射關係；根據輪廓映射關係，形成重製物件輪廓，使重製物件輪廓對應各區域位置資訊的各區域，具有相應的區域輪廓；及根據外觀映射關係，使重製物件輪廓對應各區域位置資訊的各區域，渲染相應的區域外觀。本發明可以達成提供駕駛者真實與生動視覺體驗的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A rendering method for object image and system thereof is adapted for solving the problem that the conventional image processing technique cannot render the complete appearance of reconstruct object into 3D image. The corresponding method of the present invention includes the following steps. An area position information, an area outline and an area appearance of each component area is identified from the input image. An outline mapping relationship is built by correlating the area position information with a respective area outline. An appearance mapping relationship is built by correlating the area position information with a respective area appearance. A reconstruct object outline is formed according to the outline mapping relationship, and each area of the reconstruct object outline corresponding a respective area position information has a respective area outline. Each area of the reconstruct object outline, corresponding a respective area position, is rendered by a respective area appearance. This invention can achieve the effect of providing the driver with verisimilar and vivid visual experience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:影像輸入步驟</p>
        <p type="p">S2:特徵識別與提取步驟</p>
        <p type="p">S3:特徵與位置關聯步驟</p>
        <p type="p">S4:影像重製步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="891px" img-content="tif" inline="yes" orientation="portrait" width="706px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623104</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101894</doc-number>
          <kind></kind>
          <date>114/01/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120251017B">H01R12/72</main-classification>
        <further-classification edition="200601120251017B">H01R13/24</further-classification>
        <further-classification edition="201101120251017B">H01R13/6581</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立德精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LEADER PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張勛徐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XUNXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張曉慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIAOQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐紅強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117328375</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>連接器及電子設備的配件</chinese-title>
        <english-title>CONNECTOR AND ACCESSORY OF ELECTRONIC APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種連接器及電子設備的配件，連接器可拆卸地嵌設在電路板中，連接器包括絕緣結構以及端子組件。端子組件的部分結構設置於絕緣結構內，端子組件包括第一導電部和兩組第二導電部，第一導電部和兩組第二導電部沿厚度方向相對設置。位於第一側的第一導電部沿第一方向穿出絕緣結構，並抵接至電路板。兩組第二導電部沿第二方向對稱設置，且位於第一側的兩個第二導電部均能夠沿第一方向穿出絕緣結構，並抵接至電路板。電路板的側部設置有分別與第二導電部和第一導電部對應的導電片。利用連接器的側部空間，分別設置第一導電部和第二導電部，合理規劃側部的空間布局，有效縮減連接器的截面尺寸，利於實現其小型化和輕量化設計，減少占用空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a connector and an accessory of electronic apparatus, the connector is removably embedded in a circuit board and the connector includes an insulation structure and a terminal module. The partial structure of terminal module is disposed inside the insulation structure, and the terminal module includes a first conductive part and two sets of second conductive parts which are relatively disposed along a thickness direction. The first conductive part located on a first side passes through the insulation structure along a first direction and contacts the circuit board. The two sets of second conductive parts are symmetrically disposed along a second direction, and the two second conductive parts located on the first side can all pass through the insulation structure along the first direction and contact the circuit board. The side part of the circuit board has conductive sheets respectively corresponding to the first conductive part and the second conductive part. By utilizing the space of the side part of the connector, the first conductive part and the second conductive parts are respectively disposed, and the space distribution of the side part of the connector is reasonably planned to effectively reduce the cross section size of the connector. It is beneficial to achieve the thinness and the lightness of the connector and to reduce the occupied space of the connector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">13:絕緣結構</p>
        <p type="p">131:第一絕緣件</p>
        <p type="p">1311:第一定位柱</p>
        <p type="p">1312:第二插孔</p>
        <p type="p">132:第二絕緣件</p>
        <p type="p">1323:第二凸起</p>
        <p type="p">133:第三絕緣件</p>
        <p type="p">1331:嵌設槽</p>
        <p type="p">1332:限位凹槽</p>
        <p type="p">141:第一導電部</p>
        <p type="p">142:第二導電部</p>
        <p type="p">15:隔離座</p>
        <p type="p">161:外屏蔽件</p>
        <p type="p">16111:觸點彈臂</p>
        <p type="p">16112:限位彈片</p>
        <p type="p">162:中間屏蔽件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="451px" img-content="tif" inline="yes" orientation="portrait" width="672px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623659</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101920</doc-number>
          <kind></kind>
          <date>114/01/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/60</main-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W90/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘志堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, CHIH-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林建璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭禮輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, LI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/963,423</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝及製造半導體封裝的方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體封裝包括基板、配置在基板上的第一半導體裝置、配置在基板上並環繞第一半導體裝置的多個第二半導體裝置、配置在基板上的環結構、以及蓋結構。環結構環繞第一半導體裝置及多個第二半導體裝置，並配置在第一半導體裝置及多個第二半導體裝置之間，環結構包括從頂視圖部分重疊多個第二半導體裝置頂表面的凸緣部分。蓋結構覆蓋並接合到第一半導體裝置、多個第二半導體裝置及凸緣部分的上表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package includes a substrate, a first semiconductor device disposed over the substrate, a plurality of second semiconductor devices disposed over the substrate and around the first semiconductor device, a ring structure disposed over the substrate, and a lid structure. The ring structure surrounds the first semiconductor device and the plurality of second semiconductor devices, and disposed between the first semiconductor device and the plurality of second semiconductor devices, the ring structure includes a flange portion partially overlap with top surfaces of the plurality of second semiconductor devices from a top view. The lid structure covers and is bonded to the first semiconductor device, the plurality of second semiconductor devices and an upper surface of the flange portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體封裝</p>
        <p type="p">101:基板</p>
        <p type="p">102:導電連接器</p>
        <p type="p">117:重佈線結構</p>
        <p type="p">401:第一半導體裝置、半導體裝置</p>
        <p type="p">500:第二半導體裝置、半導體裝置</p>
        <p type="p">600:環結構</p>
        <p type="p">610:凸緣部分</p>
        <p type="p">620:壁部分</p>
        <p type="p">700,850:黏合劑</p>
        <p type="p">800:蓋結構</p>
        <p type="p">810:第一接合部分</p>
        <p type="p">820:第二接合部分</p>
        <p type="p">830:板狀部分</p>
        <p type="p">850:熱介面材料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10035.png" file="d10035.TIF" giffile="ed10035.png" height="723px" img-content="tif" inline="yes" orientation="portrait" width="1101px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622565</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101933</doc-number>
          <kind></kind>
          <date>114/01/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250501B">G02B6/36</main-classification>
        <further-classification edition="200601120250501B">G02B6/44</further-classification>
        <further-classification edition="201301120250501B">H04B10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>至良科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALL BEST PRECISION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊策航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊閎喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HUNG-JHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/726,252</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光收發模組插座殼體、光收發模組及光收發模組組合</chinese-title>
        <english-title>OPTICAL TRANSCEIVER MODULE SOCKET CAGE, OPTICAL TRANSCEIVER MODULE, AND OPTICAL TRANSCEIVER MODULE SET</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光收發模組插座殼體，其包含一殼本體及一液冷件。該殼本體形成一模組插槽。該液冷件具有供工作流體流過的流道結構。該液冷件固定設置於該殼本體內並露出於該模組插槽內。一種光收發模組，其包含一模組殼體及露出於該模組殼體一側之一板緣連接器。該模組殼體包含一主殼體及二垂直板，該主殼體具有一平坦導熱表面，該二垂直板自該平坦導熱表面相對兩側突出。該二垂直板及該平坦導熱表面之間形成一無結構空間。一種光收發模組組合，其包含具有前述光收發模組插座殼體之一光收發模組插座、及與該光收發模組插座匹配之一光收發模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical transceiver module socket cage includes a cage body and a liquid cooling component. The cage body forms a module-receiving slot. The liquid cooling component has a flow channel structure for a working fluid to flow through. The liquid cooling component is fixed disposed in the cage body and is exposed in the module-receiving slot. An optical transceiver module includes a module housing and an edge connector exposed on a side of the module housing. The module housing includes a main housing and two vertical plates. The main housing has a flat heat-conducting surface. The two vertical plates protrude from two opposite sides of the flat heat-conducting surface. A structure-less space is formed between the two vertical plates and the flat heat-conducting surface. An optical transceiver module set includes an optical transceiver module socket having the above optical transceiver module socket cage, and an optical transceiver module matching the optical transceiver module socket.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光收發模組組合</p>
        <p type="p">12:光收發模組</p>
        <p type="p">122:模組殼體</p>
        <p type="p">1222:主殼體</p>
        <p type="p">1222a:第三平坦導熱表面</p>
        <p type="p">1224:垂直板</p>
        <p type="p">1226:無結構空間</p>
        <p type="p">124:板緣連接器</p>
        <p type="p">14:光收發模組插座</p>
        <p type="p">142:光收發模組插座殼體</p>
        <p type="p">1422:殼本體</p>
        <p type="p">1422a:模組插槽</p>
        <p type="p">1422b:長度方向</p>
        <p type="p">1422c:插入口</p>
        <p type="p">1424:液冷件</p>
        <p type="p">1426a,1426b:傳輸管</p>
        <p type="p">146:電路板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="685px" img-content="tif" inline="yes" orientation="portrait" width="1037px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623694</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101938</doc-number>
          <kind></kind>
          <date>114/01/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/01</main-classification>
        <further-classification edition="202601120260302B">H10W40/10</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧景睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, JING-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝政吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,104</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>封裝結構及其形成方法</chinese-title>
        <english-title>PACKAGE STRUCTURE AND FORMATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種封裝結構及形成方法。方法包含將含晶片結構設置在基板之上，並形成橫向圍繞含晶片結構的保護層。保護層的內側壁圍繞一開口，前述開口暴露含晶片結構的一部分。前述方法還包含在開口中形成熱界面元件，以及將散熱蓋設置在熱界面元件和保護層之上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure and a formation method are provided. The method includes disposing a chip-containing structure over a substrate and forming a protective layer laterally surrounding the chip-containing structure. Interior sidewalls of the protective layer surround an opening exposing a portion of the chip-containing structure. The method also includes forming a thermal interface element in the opening and disposing a heat-spreading lid over the thermal interface element and the protective layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:含晶片結構</p>
        <p type="p">100:中介物基板</p>
        <p type="p">102A,102B:半導體晶片</p>
        <p type="p">104:接合結構</p>
        <p type="p">106:底部填充結構</p>
        <p type="p">108:保護層</p>
        <p type="p">110:接合結構</p>
        <p type="p">112:基板</p>
        <p type="p">114:底部填充結構</p>
        <p type="p">118’:保護層</p>
        <p type="p">120:熱界面元件</p>
        <p type="p">122:散熱蓋</p>
        <p type="p">124:黏著層</p>
        <p type="p">126:接合結構</p>
        <p type="p">P:突出部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10030.png" file="d10030.TIF" giffile="ed10030.png" height="504px" img-content="tif" inline="yes" orientation="portrait" width="748px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622861</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101962</doc-number>
          <kind></kind>
          <date>114/01/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250704B">G06Q30/0601</main-classification>
        <further-classification edition="201901120250704B">G06F16/21</further-classification>
        <further-classification edition="201901120250704B">G06F16/27</further-classification>
        <further-classification edition="201801120250704B">G06F9/44</further-classification>
        <further-classification edition="202201120250704B">H04L43/0852</further-classification>
        <further-classification edition="202201120250704B">H04L43/0888</further-classification>
        <further-classification edition="202201120250704B">H04L43/08</further-classification>
        <further-classification edition="202201120250704B">H04L43/55</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, XUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0173712</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置及其動作方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子裝置之動作方法。電子裝置之動作方法可包括如下步驟：確認第1資料庫中成為備份目標之目標資料之特性資訊，該第1資料庫係用於服務運營之服務環境中所包括者；基於上述目標資料之特性資訊，確認用於測試之第2資料庫中之模擬資料；基於測試備份設定資訊，確認上述測試環境之狀態資訊，該測試環境之狀態資係與測試環境中實行之上述模擬資料之測試備份進度對應者；及基於上述測試環境之狀態資訊，確認用於備份上述目標資料之服務備份設定資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310:步驟</p>
        <p type="p">S320:步驟</p>
        <p type="p">S330:步驟</p>
        <p type="p">S340:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="696px" img-content="tif" inline="yes" orientation="portrait" width="508px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622941</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101967</doc-number>
          <kind></kind>
          <date>114/01/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120250401B">G09G3/32</main-classification>
        <further-classification edition="200601120250401B">G09G3/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳漢崑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HAN-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, JEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯景文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, CHING-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許淯翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/951,713</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>降低操作溫度的控制方法及驅動裝置</chinese-title>
        <english-title>CONTROL METHOD FOR REDUCING OPERATING TEMPERATURE AND DRIVING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種降低驅動裝置操作溫度之控制方法，所述驅動裝置包括複數個通道驅動電路，所述控制方法包括下列步驟：致能過溫度感測功能以判斷是否執行降溫操作；以及響應於判斷執行該降溫操作，針對每一線週期，藉由將該線週期中之通道之通道資料的灰階值與早於該線週期的先前線週期中之通道之通道資料的灰階值進行比較來判斷複數個通道驅動電路於該線週期期間執行過驅動操作或電荷共享操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A control method for reducing operating temperature of a driving device is provided. The driving device includes a plurality of channel driving circuits. The control method includes enabling an over-temperature sensing function to determine whether to perform a temperature reducing operation, and for each line period, determining that the plurality of channel driving circuits perform an overdriving operation or a charge sharing operation during the line period by comparing a gray level of channel data of a channel in the line period with a gray level of channel data of the channel in a previous line period before the line period in response to determining to perform the temperature reducing operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:流程</p>
        <p type="p">S200,S202,S204,S206,S208:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="893px" img-content="tif" inline="yes" orientation="portrait" width="726px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623371</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101976</doc-number>
          <kind></kind>
          <date>114/01/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250520B">H10D1/68</main-classification>
        <further-classification edition="202301120250520B">H10N97/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡喻丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林杏芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSING-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉人誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉克群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KO CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王教瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JAIO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/961,917</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電容結構（例如，溝槽電容結構）形成於半導體裝置的內連線層中。不是蝕刻內連線層的介電層以形成電容結構溝槽（例如，深溝槽），而是在內連線層的介電層中形成寬主溝槽（例如，具有相對較低長寬比）。主溝槽填充介電插塞，介電插塞經圖案化並用於形成電容結構的底部電極結構的多個柱。底部電極結構的柱在主溝槽中定義多個次級溝槽（例如，具有相對較高長寬比），然後在次級溝槽內襯有電容結構的絕緣層並填充電容結構的頂部電極結構的多個柱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A capacitor structure (e.g., a trench capacitor structure) is formed in an interconnect layer of a semiconductor device. Instead of etching the dielectric layers of the interconnect layer to form the trenches (e.g., the deep trenches) for the capacitor structure, a wide main trench (e.g., having a relatively low aspect ratio) is formed in the dielectric layers of the interconnect layer. The main trench is filled with a dielectric plug, and the dielectric plug is patterned and used to form a plurality of columns of a bottom electrode structure of the capacitor structure. The columns of the bottom electrode structure define a plurality of secondary trenches (e.g., that have a relatively high aspect ratio) in the main trench that are then lined with an insulator layer of the capacitor structure and filled in with a plurality of columns of a top electrode structure of the capacitor structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">116、124、128、132:ILD層</p>
        <p type="p">118、122、126、130:ESL</p>
        <p type="p">120:導電結構</p>
        <p type="p">142:頂部通孔</p>
        <p type="p">160:電容結構</p>
        <p type="p">200:範例實作</p>
        <p type="p">202a:主溝槽結構</p>
        <p type="p">202b:上部延伸區域</p>
        <p type="p">204:襯墊</p>
        <p type="p">206:底部電極結構</p>
        <p type="p">206a、206b、206c、206d、206e、206f、206g、206h、206i、206j:電極壁</p>
        <p type="p">206k、210j:基層</p>
        <p type="p">208:絕緣層</p>
        <p type="p">208a、208b、208c、208d、208e、208f、208g、208h、208i:U形橫截面段</p>
        <p type="p">210:頂部電極結構</p>
        <p type="p">210a、210b、210c、210d、210e、210f、210g、210h、210i:電極插塞</p>
        <p type="p">212、214:蓋層</p>
        <p type="p">216、218:側壁間隙壁</p>
        <p type="p">A-A:線</p>
        <p type="p">x、z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.png" file="d10024.TIF" giffile="ed10024.png" height="973px" img-content="tif" inline="yes" orientation="portrait" width="747px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622629</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114101979</doc-number>
          <kind></kind>
          <date>114/01/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260302B">G03F1/84</main-classification>
        <further-classification edition="201201120260302B">G03F1/42</further-classification>
        <further-classification edition="201201120260302B">G03F1/44</further-classification>
        <further-classification edition="201201120260302B">G03F1/24</further-classification>
        <further-classification edition="202201120260302B">G06V10/82</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, CHUN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張浩銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾信富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HSIN-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/959,976</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>檢查圖案化掩模以及監控其晶圓圖案行為的裝置與方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR INSPECTING PATTERNING MASK AND MONITORING WAFER PATTERN BEHAVIOR OF PATTERNING MASK</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">檢查圖案化掩模的方法包括將極紫外（EUV）光束輻射到圖案化掩模的表面，並將來自圖案化掩模的表面的反射的極紫外光束導向影像感測器。該方法還包括基於反射的極紫外光束產生圖案化掩模的表面的影像，並基於圖案化掩模的表面的影像確定圖案化掩模的臨界尺寸均勻性（CDU）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for inspecting a patterning mask includes radiating an extreme ultraviolet (EUV) beam to a surface of the patterning mask and directing a reflected EUV beam from the surface of the patterning mask to an image sensor. The method further includes generating an image of the surface of the patterning mask based on the reflected EUV beam and determining a critical dimension uniformity (CDU) of the patterning mask based on the image of the surface of the patterning mask.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:方法</p>
        <p type="p">S1010、S1020、S1030、S1040、S1050:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.png" file="d10025.TIF" giffile="ed10025.png" height="801px" img-content="tif" inline="yes" orientation="portrait" width="770px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622849</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102039</doc-number>
          <kind></kind>
          <date>114/01/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250626B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250626B">G06Q30/0601</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯娜京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, NAE KYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔英珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YOUNG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金雅文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YAE EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>具妍靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, YEON JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0173746</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>提供資訊之電子裝置之動作方法及支持該動作方法之電子裝置</chinese-title>
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR PROVIDING INFORMATION AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，揭示一種電子裝置提供資訊之方法，其包括如下步驟：確認與用戶在與上述電子裝置相關之服務中之輸入對應之物品；基於為了於上述服務中銷售上述物品而設定之物品銷售價格及針對上述用戶之折扣優惠，確認為了向上述用戶銷售上述物品而應用之用戶銷售價格；及提供包括上述物品之第1折扣率資訊之上述物品之銷售資訊，該第1折扣率資訊係基於上述物品銷售價格及上述用戶銷售價格而獲得者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">301:動作</p>
        <p type="p">302:動作</p>
        <p type="p">303:動作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="561px" img-content="tif" inline="yes" orientation="portrait" width="600px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623206</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102045</doc-number>
          <kind></kind>
          <date>114/01/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250501B">H03L7/08</main-classification>
        <further-classification edition="200601120250501B">H03L7/099</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, TSUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YA-TIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張智賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝正祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/958,105</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於同步振盪器輸出訊號並具有參考輸入訊號的系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR SYNCHRONIZING AN OSCILLATOR OUTPUT SIGNAL WITH A REFERENCE INPUT SIGNAL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統包括振盪器電路，其包括第一和第二調節庫以及電流控制振盪器。第一調節庫連接到電壓節點並接收調節訊號，在電壓節點產生對應於調節訊號的電壓降，並允許隨電壓降變化的第一電流通過。第二調節庫連接到電壓節點並接收振盪器輸入訊號，並響應於電壓降與振盪器輸入訊號之間的電壓差來調節通過的第二電流。電流控制振盪器接收第一和第二電流的總和的第三電流，並基於第三電流微調振盪器輸出訊號以追蹤參考輸入訊號的頻率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system comprises an oscillator circuit that includes first and second tuning banks and a current-controlled oscillator. The first tuning bank is connected to a voltage node and receives the tuning signal, generates a voltage drop at the voltage node that corresponds to the tuning signal, and allows the flow of a first current therethrough that varies with the voltage drop. The second tuning bank is connected to the voltage node and receives an oscillator input signal and regulates a second current that flows therethrough in response to a voltage difference between the voltage drop and the oscillator input signal. The current-controlled oscillator receives a third current that is a sum of the first and second currents and fine-tunes an oscillator output signal based on the third current to track a frequency of a reference input signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:控制迴路</p>
        <p type="p">110a:頻率偵測器</p>
        <p type="p">110c:振盪器控制器</p>
        <p type="p">110b:濾波器</p>
        <p type="p">120:控制迴路</p>
        <p type="p">120a:除頻器</p>
        <p type="p">120b:相位偵測器</p>
        <p type="p">120c:電荷泵電路</p>
        <p type="p">130:振盪器電路</p>
        <p type="p">140:錯誤訊號</p>
        <p type="p">150:濾波後的誤差訊號</p>
        <p type="p">160:回授訊號</p>
        <p type="p">DN、UP:訊號</p>
        <p type="p">DTW:調節訊號</p>
        <p type="p">OSC&lt;sub&gt;OUT&lt;/sub&gt;:振盪器輸出訊號</p>
        <p type="p">REF&lt;sub&gt;IN&lt;/sub&gt;:參考輸入訊號</p>
        <p type="p">TRK_EN:致能訊號</p>
        <p type="p">VCO&lt;sub&gt;IN&lt;/sub&gt;:振盪器輸入訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="565px" img-content="tif" inline="yes" orientation="portrait" width="970px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623461</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102046</doc-number>
          <kind></kind>
          <date>114/01/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250305B">H10F39/12</main-classification>
        <further-classification edition="202501120250305B">H10F39/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉庭佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, TING-TSO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳愉婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, U-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡紓婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, SHU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾承叡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHENG JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁世汎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, SHYH-FANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/958,045</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積體晶片及其形成方法</chinese-title>
        <english-title>INTEGRATED CHIP AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">積體晶片包括具有前側和與前側相對的背側的第一半導體基板。光偵測器位於第一半導體基板內。背側深溝槽隔離（DTI）結構包括導電背側隔離層和介電背側隔離層，從背側朝前側延伸進入第一半導體基板，並延伸於光偵測器和鄰近光偵測器之間以隔離光偵測器與鄰近光偵測器。介電背側隔離層位於導電背側隔離層和第一半導體基板之間。第一互連結構包括沿第一半導體基板前側的第一多個導電互連。導電前側DTI結構從第一互連結構延伸到導電背側隔離層，並將導電背側隔離層耦合到第一互連結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated chip including a first semiconductor substrate having a frontside and a backside opposite the frontside. A photodetector is within the first semiconductor substrate. A backside deep trench isolation (DTI) structure includes a conductive backside isolation layer and a dielectric backside isolation layer extending into the first semiconductor substrate from the backside toward the frontside and extending between the photodetector and neighboring photodetectors to isolate the photodetector from the neighboring photodetectors. The dielectric backside isolation layer is between the conductive backside isolation layer and the first semiconductor substrate. A first interconnect structure includes a first plurality of conductive interconnects along the frontside of the first semiconductor substrate. A conductive frontside DTI structure extends from the first interconnect structure to the conductive backside isolation layer and couples the conductive backside isolation layer to the first interconnect structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:剖面視圖</p>
        <p type="p">102:主動像素區域</p>
        <p type="p">104:光偵測器</p>
        <p type="p">106:半導體基板</p>
        <p type="p">106a:前側</p>
        <p type="p">106b:背側</p>
        <p type="p">108:背側DTI結構</p>
        <p type="p">109:部分</p>
        <p type="p">110:介電背側隔離層</p>
        <p type="p">112:導電背側隔離層</p>
        <p type="p">114:虛設像素區域</p>
        <p type="p">116、120:介電結構</p>
        <p type="p">118:彩色濾光片</p>
        <p type="p">119:微透鏡</p>
        <p type="p">122:閘極電極</p>
        <p type="p">124:互連結構</p>
        <p type="p">126:接觸件</p>
        <p type="p">128:導電線</p>
        <p type="p">130:導電穿孔</p>
        <p type="p">132:前側DTI結構</p>
        <p type="p">134:偏壓電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10031.png" file="d10031.TIF" giffile="ed10031.png" height="482px" img-content="tif" inline="yes" orientation="portrait" width="717px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623550</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102141</doc-number>
          <kind></kind>
          <date>114/01/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P70/00</main-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W42/00</further-classification>
        <further-classification edition="202501120260302B">H10D1/68</further-classification>
        <further-classification edition="202301120260302B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴世恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, SHIH-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪展羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳斐筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FEI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,078</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體晶粒</chinese-title>
        <english-title>SEMICONDUCTOR DIE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體封裝件中的半導體晶粒包括延伸穿過半導體晶粒的裝置層的穿基底電容器結構。穿基底電容器結構可電連接至半導體晶粒的第一側上的第一內連線層，以及電連接至半導體晶粒的與第一側相對的第二側上的第二內連線層。穿過半導體晶粒的裝置層形成穿基底電容器結構使得能夠形成具有高縱橫比的穿基底電容器結構，這為穿基底電容器結構的底部電極和頂部電極提供了更大的表面積。更大的表面積使得穿基底電容器結構能夠實現更高的電容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor die in a semiconductor package includes a through-substrate capacitor structure that extends through the device layer of the semiconductor die. The through-substrate capacitor structure may be electrically connected to a first interconnect layer on a first side of the semiconductor die, and to a second interconnect layer on a second side of the semiconductor die opposing the first side. Forming the through-substrate capacitor structure through the device layer of the semiconductor die enables the through-substrate capacitor structure to be formed to have a high aspect ratio, which provides for greater surface area for a bottom electrode and a top electrode of the through-substrate capacitor structure. The greater surface area enables a higher capacitance to be achieved for the through-substrate capacitor structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝件</p>
        <p type="p">102、104:半導體晶粒</p>
        <p type="p">106:接合介面</p>
        <p type="p">108、112:裝置層</p>
        <p type="p">110、114、132:內連線層</p>
        <p type="p">116、118:積體電路裝置</p>
        <p type="p">120、126、134:介電層</p>
        <p type="p">122、128、136:導電結構</p>
        <p type="p">124、130:接合墊</p>
        <p type="p">138:連接結構</p>
        <p type="p">140:穿基底電容器結構</p>
        <p type="p">142:底部電極</p>
        <p type="p">144:頂部電極</p>
        <p type="p">146:絕緣體層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10037.JPG" file="ed10037.JPG" height="683px" img-content="tif" inline="yes" orientation="portrait" width="882px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623670</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102205</doc-number>
          <kind></kind>
          <date>114/01/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/69</main-classification>
        <further-classification edition="202601120260302B">H10W76/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳邦莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BANG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王健彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/956,683</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>封裝結構及其製造方法</chinese-title>
        <english-title>PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝結構及其製造方法。所述封裝結構包括封裝元件以及附接至封裝元件的突出部件。所述封裝結構更包括設置於封裝元件以及突出部件上方的蓋件以及位於蓋件的底表面下方且位於突出部件的第一側的第一熱界面材料。所述封裝結構包括第二熱界面材料。此外，第二熱界面材料包括位於蓋件的底表面下方且位於突出部件的第二側的第一部分、位於蓋件的底部上方的第二部分、以及穿過蓋件的底部並與第一部及第二部連接的第三部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package structure and method for manufacturing the same are provided. The package structure includes a package component and a protruding feature attached to the package component. The package structure further includes a lid disposed over the package component and the protruding feature and a first thermal interface material under a bottom surface of the lid and at a first side of the protruding feature. The package structure includes a second thermal interface material. In addition, the second thermal interface material includes a first portion under the bottom surface of the lid and at a second side of the protruding feature, a second portion over a bottom portion of the lid, and a third portion through the bottom portion of the lid and connecting with the first portion and the second portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:中介層結構</p>
        <p type="p">20、30:半導體晶粒</p>
        <p type="p">40:封裝元件</p>
        <p type="p">50:封裝基板</p>
        <p type="p">100’:封裝結構</p>
        <p type="p">102:基板</p>
        <p type="p">102T:第一側</p>
        <p type="p">104:導通孔</p>
        <p type="p">106:互連結構</p>
        <p type="p">108:導電部件</p>
        <p type="p">110:介電層</p>
        <p type="p">112:導電焊墊</p>
        <p type="p">114:導電連接件</p>
        <p type="p">116:底部填充劑</p>
        <p type="p">118:模塑層</p>
        <p type="p">120:導電焊墊</p>
        <p type="p">122:導電連接件</p>
        <p type="p">124:導電部件</p>
        <p type="p">126:介電層</p>
        <p type="p">128:基板</p>
        <p type="p">130:導電連接件</p>
        <p type="p">132:底部填充劑</p>
        <p type="p">134:突出部件</p>
        <p type="p">136A、136G、136L’:熱界面材料/TIM</p>
        <p type="p">138:環狀結構</p>
        <p type="p">140:黏著劑</p>
        <p type="p">142:蓋件</p>
        <p type="p">142B:底部</p>
        <p type="p">142D:堰體部</p>
        <p type="p">142H:穿孔</p>
        <p type="p">144:黏著劑</p>
        <p type="p">148:外部冷卻工具</p>
        <p type="p">E40:邊緣</p>
        <p type="p">H&lt;sub&gt;142D&lt;/sub&gt;:高度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10089.png" file="d10089.TIF" giffile="ed10089.png" height="690px" img-content="tif" inline="yes" orientation="portrait" width="1004px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622862</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102220</doc-number>
          <kind></kind>
          <date>114/01/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250627B">G06Q30/0601</main-classification>
        <further-classification edition="201901120250627B">G06F16/21</further-classification>
        <further-classification edition="201901120250627B">G06F16/25</further-classification>
        <further-classification edition="202501120250627B">G06F11/36</further-classification>
        <further-classification edition="200601120250627B">G06F11/34</further-classification>
        <further-classification edition="202301120250627B">G06N3/08</further-classification>
        <further-classification edition="201801120250627B">G06F9/44</further-classification>
        <further-classification edition="201301120250627B">G06F3/048</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉龍軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, LONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷福耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, FUYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金海彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAE BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李臻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何騰歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, TENGHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祝繁景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, FANJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0173667</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>處理日誌資料之方法、電子裝置及記錄媒體</chinese-title>
        <english-title>METHOD OF PROCESSING LOG DATA, ELECTRONIC DEVICE AND RECORDING MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之各種實施例之藉由電子裝置而實行之處理日誌資料的方法可包括如下步驟：自第1伺服器獲得第1日誌資料，該第1日誌資料包括與用戶終端中產生之事件相關之事件日誌資訊；自第2伺服器獲得第2日誌資料，該第2日誌資料包括提供至上述用戶終端之情境資訊；及將上述第1日誌資料及上述第2日誌資料儲存至資料庫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">100:電子裝置</p>
        <p type="p">210:第1伺服器</p>
        <p type="p">220:第2伺服器</p>
        <p type="p">230:資料庫</p>
        <p type="p">240:用戶終端</p>
        <p type="p">250:lumberjack模組</p>
        <p type="p">260:kafka模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="534px" img-content="tif" inline="yes" orientation="portrait" width="850px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622854</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102228</doc-number>
          <kind></kind>
          <date>114/01/20</date>
        </document-id>
      </application-reference>
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        <main-classification edition="202301120250901B">G06Q30/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯娜京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, NAE KYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南允貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, YOON JEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張玉珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YOU JEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174738</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>提供包括物品之資訊之頁面之裝置及其方法</chinese-title>
        <english-title>APPARATUS FOR PROVIDING A PAGE INCLUDING INFORMATION ON ITEMS AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，揭示了一種於電子裝置中提供資訊之方法，該方法包括如下步驟：將至少一個物品之資訊提供至用戶之裝置；獲得至少一個物品中之一個以上之物品之選擇資訊；獲得包括與一個以上之物品各者相關聯之一個以上之影像資訊中之至少一部分的頁面；及將頁面提供至用戶之裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:電子裝置</p>
        <p type="p">120:用戶之裝置</p>
        <p type="p">210:動作</p>
        <p type="p">220:動作</p>
        <p type="p">230:動作</p>
        <p type="p">240:動作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="630px" img-content="tif" inline="yes" orientation="portrait" width="653px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622443</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102254</doc-number>
          <kind></kind>
          <date>114/01/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250923B">F28D20/02</main-classification>
        <further-classification edition="200601120250923B">F28F27/00</further-classification>
        <further-classification edition="200601120250923B">F28F13/00</further-classification>
        <further-classification edition="200601120250923B">G06F1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳邦莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BANG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王健彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/964,245</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>二相冷卻系統以及冷卻方法</chinese-title>
        <english-title>TWO-PHASE COOLING SYSTEM AND COOLING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種二相冷卻系統，包括一外殼以及一熱源，外殼包括一第一容積以及一第二容積，熱源位於第一容積中。第一容積配置以容納一液體冷卻劑，使得液體冷卻劑與熱源接觸，並且第二容積配置以容納液體冷卻劑的一蒸氣。所述二相冷卻系統包括一冷凝器，位於第二容積中，從蒸氣移除熱量，使得蒸氣冷凝成一液體，返回一容積。一偏轉器位於第一容積，控制由熱源產生的蒸氣的一路徑。一種冷卻方法，冷卻一熱源，包括以偏轉器將一第一部件產生的蒸氣的一分量轉移遠離一第二部件，從而避免第二部件附近的液體冷卻劑密度降低，從而提高冷卻效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A two-phase cooling system includes an enclosure with a first volume, a second volume, and a heat source located in the first volume. The first volume is configured to contain a liquid coolant such that the liquid coolant is in contact with the heat source, and the second volume is configured to contain a vapor of the liquid coolant. The two-phase cooling system includes a condenser located in the second volume that removes heat from the vapor so that the vapor condenses into a liquid that returns to the first volume. A deflector located in the first volume controls a path of vapor generated by the heat source. A method of cooling a heat source includes diverting, with the deflector, a fraction of vapor generated by a first component away from a second component, thus avoiding decrease in liquid coolant density near the second component thereby increasing cooling efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:二相冷卻系統/冷卻系統</p>
        <p type="p">101:冷凝器</p>
        <p type="p">102:外殼</p>
        <p type="p">104a:第一容積</p>
        <p type="p">104b:第二容積</p>
        <p type="p">106:熱源</p>
        <p type="p">108:液體冷卻劑</p>
        <p type="p">110:蒸氣</p>
        <p type="p">112a:第一高度</p>
        <p type="p">112c:第三高度</p>
        <p type="p">114:中心區域</p>
        <p type="p">116:導管</p>
        <p type="p">116a:入口導管</p>
        <p type="p">116b:出口導管</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="718px" img-content="tif" inline="yes" orientation="portrait" width="802px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622835</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102319</doc-number>
          <kind></kind>
          <date>114/01/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250620B">G06Q10/30</main-classification>
        <further-classification edition="202301120250620B">G06Q30/016</further-classification>
        <further-classification edition="202301120250620B">G06Q30/06</further-classification>
        <further-classification edition="202301120250620B">G06Q30/0601</further-classification>
      </classification-ipc>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安雅英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, AHYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卞周英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYON, JUYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金志龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹河智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HAJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹炳瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, BYURYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐慧珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, HYEJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175593</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>商品的服務請求處理方法及支持其的電子裝置</chinese-title>
        <english-title>METHOD FOR PROCESSING SERVICE REQUEST ON PRODUCT AND ELECTRONIC DEVICE SUPPORTING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明一實施例的商品的服務請求處理方法可包括如下步驟：從外部電子裝置接收與從與商品的服務請求相關的應用程序的執行畫面中選擇第一商品的第一用戶輸入相關的信息；響應于接收與第一用戶輸入相關的信息，判斷第一商品是否爲由多個單位商品組成的套餐商品；基于第一商品爲套餐商品的判斷，從多個單位商品中確定與服務請求的對象相關的第一單位商品的數量或合計金額中的至少一個；以及基于第一單位商品的數量或合計金額中的至少一個，確定與向應用程序的執行畫面提供的服務請求的處理相關的多個第一項目。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for processing a service request on a product according to an embodiment of the disclosure includes receiving, from an external electronic device, information on a first user input for selecting a first product on an execution screen of application related to a service request on a product, in response to receiving the information on the first user input, determining whether the first product is a package product composed of a plurality of unit products, based on determining that the first product is the package product, determining at least one of the number or total amount of a first unit product related to a target of the service request among the plurality of unit products, and based on at least one of the number or total amount of the first unit product, determining a plurality of first items related to processing the service request to be provided on the execution screen of the application.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:內容</p>
        <p type="p">31a:項目</p>
        <p type="p">31b:項目</p>
        <p type="p">31c:項目</p>
        <p type="p">100:電子裝置</p>
        <p type="p">200:網絡</p>
        <p type="p">300:外部電子裝置</p>
        <p type="p">310:應用程序的執行畫面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="707px" img-content="tif" inline="yes" orientation="portrait" width="712px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623424</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102353</doc-number>
          <kind></kind>
          <date>114/01/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D80/20</main-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D86/80</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
        <further-classification edition="202601120260302B">H10W10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊哲維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHE WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李名哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MING-CHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昇展</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHENG-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃韋翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昇照</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHENG-CHAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喻中一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/960,447</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體元件及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體結構包括導電電極層和絕緣層，其側向延伸進入多個介電層中。側向延伸可稱為鰭部分。鰭部分可從溝槽結構底部區段的中央部分向側向向外延伸。半導體結構可包括多個溝槽結構，每個溝槽結構可包括一組鰭部分。除包括鰭部分的溝槽結構外，半導體結構可包括額外溝槽結構，位於包括鰭部分的相鄰溝槽結構的頂部區段之間的側向。額外溝槽結構的深度小於包括鰭部分的溝槽結構的深度。這使鰭部分能夠向側向延伸到額外溝槽結構下方，從而使鰭部分的尺寸能夠增加。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes conductive electrode layers and an insulator layer that extend laterally into a plurality of dielectric layers. The lateral extensions may be referred to as fin portions. The fin portions may extend laterally outward from a central portion of a trench structure at a bottom section of the trench structure. The semiconductor structure may include a plurality of trench structures, and each trench structure may include a set of fin portions. In addition to the trench structures including the fin portions, the semiconductor structure may include additional trench structures located laterally between top sections of adjacent trench structures that include fin portions. The depth of the additional trench structures is less than a depth of the trench structures that include fin portions. This enables the fin portions to extend laterally under the additional trench structures, which enables the size of the fin portions to be increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體元件</p>
        <p type="p">114a、114b、114c、114d、114e、114f、114g:層間介電層</p>
        <p type="p">116a、116b、116c:蝕刻停止層</p>
        <p type="p">118a、118b、118c:介電膜層</p>
        <p type="p">128:溝槽電容結構</p>
        <p type="p">130:底部接觸窗</p>
        <p type="p">132:頂部接觸窗</p>
        <p type="p">134:第一溝槽結構</p>
        <p type="p">134a:頂部區段</p>
        <p type="p">134b:底部區段</p>
        <p type="p">136a:中央部分</p>
        <p type="p">136b:鰭部分</p>
        <p type="p">140:黏著層</p>
        <p type="p">142:底部電極層</p>
        <p type="p">144:絕緣層</p>
        <p type="p">146:頂部電極層</p>
        <p type="p">148:氧化物蓋層</p>
        <p type="p">150:氮氧化物蓋層</p>
        <p type="p">152:氮化物蓋層</p>
        <p type="p">154、156:側壁間隙壁</p>
        <p type="p">D1、D2、D3、D4:深度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10031.png" file="d10031.TIF" giffile="ed10031.png" height="701px" img-content="tif" inline="yes" orientation="portrait" width="995px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623699</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102446</doc-number>
          <kind></kind>
          <date>114/01/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/40</main-classification>
        <further-classification edition="202601120260302B">H10W40/10</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江幸達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, SING-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉士瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳存晏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/956,793</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶片封裝結構及其形成方法</chinese-title>
        <english-title>CHIP PACKAGING STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶片封裝結構的形成方法，包括：提供具有半導體基板和導電凸塊的晶片。半導體基板具有正面和背面，且導電凸塊位於正面。方法包括從背面部分地移除半導體基板以在半導體基板中形成凹槽。當部分地移除半導體基板之後，半導體基板具有第一柱及第二柱從凹槽的底面突出。方法包括將散熱器接合到晶片。散熱器具有第一通道及第二通道，第一通道及第二通道穿過散熱器且連接凹槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming a chip package structure is provided. The method includes providing a chip having a semiconductor substrate and a conductive bump. The semiconductor substrate has a front surface and a back surface, and the conductive bump is over the front surface. The method includes partially removing the semiconductor substrate from the back surface to form a recess in the semiconductor substrate. After the semiconductor substrate is partially removed, the semiconductor substrate has a first pillar and a second pillar protruding from a bottom surface of the recess. The method includes bonding a heat sink to the chip. The heat sink has a first channel and a second channel, and the first channel and the second channel pass through the heat sink and connect the recess.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:晶片</p>
        <p type="p">117:晶片結構</p>
        <p type="p">170:重分佈基板</p>
        <p type="p">171:介電層</p>
        <p type="p">172:佈線層</p>
        <p type="p">180:晶片封裝件</p>
        <p type="p">181:晶片</p>
        <p type="p">185:焊料層</p>
        <p type="p">190:底填充層</p>
        <p type="p">200:晶片封裝件</p>
        <p type="p">210:模製層</p>
        <p type="p">310:佈線基板</p>
        <p type="p">314:導電墊</p>
        <p type="p">320:底填充層</p>
        <p type="p">330:黏合層</p>
        <p type="p">340:環形結構</p>
        <p type="p">350:焊球</p>
        <p type="p">360:密封劑</p>
        <p type="p">370:導熱層</p>
        <p type="p">380:環形層</p>
        <p type="p">394b:鰭片</p>
        <p type="p">400:晶片封裝結構</p>
        <p type="p">C1:入口通道</p>
        <p type="p">C2:出口通道</p>
        <p type="p">P1:路徑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10036.png" file="d10036.TIF" giffile="ed10036.png" height="750px" img-content="tif" inline="yes" orientation="portrait" width="1064px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622376</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102594</doc-number>
          <kind></kind>
          <date>114/01/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250414B">F04D29/58</main-classification>
        <further-classification edition="200601120250414B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116976934</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>風機殼體及鼓風機總成</chinese-title>
        <english-title>BLOWER HOUSING AND BLOWER ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種風機殼體及鼓風機總成，風機殼體包括安裝殼本體、散熱件、後蓋及彈性密封環。該安裝殼本體的一側具有裝配口，該安裝殼本體的另一側具有用於安裝定轉子組件的安裝口；散熱件至少部分設於該安裝殼本體內，並連接於該安裝殼本體；後蓋設置於該裝配口，且該後蓋設有呈輻射狀的第一加強筋；彈性密封環設置於該後蓋的邊緣，且該彈性密封環具有裙部和延伸部，該裙部密封抵接於該安裝殼本體，該延伸部密封抵接於該散熱件，且該彈性密封環密封該安裝殼本體與該後蓋之間的間隙，以及密封該散熱件與該後蓋之間的間隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a blower housing and a blower assembly. The blower housing includes an install housing body, a heat dissipation element, a rear cover and an elastic seal ring. One side of the install housing body is provided with an assembling opening. The other side of the install housing body is provided with a mounting opening for mounting a stator and rotor component. The heat dissipation element is at least partially disposed in the install housing body and connected to the install housing body. The rear cover is disposed on the assembling opening. The rear cover is provided with a radial first reinforcing rib. The elastic seal ring is disposed on the edge of the rear cover. The elastic seal ring is provided with a skirt portion and an extending portion. The skirt portion is abutted against the install housing body. The extending portion is abutted against the heat dissipation element. The elastic seal ring is sealed the gap between the install housing body and the rear cover, and is sealed the gap between the heat dissipation element and the rear cover.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1301:裝配口</p>
        <p type="p">131:第一殼體</p>
        <p type="p">132:第二殼體</p>
        <p type="p">140:後蓋</p>
        <p type="p">145:安裝槽</p>
        <p type="p">200:散熱件</p>
        <p type="p">300:減震組件</p>
        <p type="p">400:彈性密封環</p>
        <p type="p">510:定子組</p>
        <p type="p">511:漆包線</p>
        <p type="p">512:插片</p>
        <p type="p">520:磁瓦</p>
        <p type="p">530:機殼</p>
        <p type="p">540:轉軸</p>
        <p type="p">550:插片減震橡膠</p>
        <p type="p">560:插片保持架</p>
        <p type="p">570:第一軸承</p>
        <p type="p">580:第二軸承</p>
        <p type="p">700:接線座</p>
        <p type="p">800:電路板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.JPG" file="ed10023.JPG" height="941px" img-content="tif" inline="yes" orientation="portrait" width="645px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622855</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102647</doc-number>
          <kind></kind>
          <date>114/01/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250701B">G06Q30/06</main-classification>
        <further-classification edition="201201120250701B">G06Q20/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯娜京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, NAE KYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔英珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YOUNG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金雅文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YAE EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>具妍靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, YEON JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0173374</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>價格資訊提供方法及用於該方法之用戶終端</chinese-title>
        <english-title>METHOD FOR PROVIDING PRICE INFORMATION AND USER TERMINAL THEREFOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種價格資訊提供方法及用於該方法之用戶終端。根據本發明，藉由用戶終端而實行之價格資訊提供方法可包括如下步驟：藉由用戶終端之輸入介面而接收對提供第1物品之詳細資訊之第1頁面的請求；及針對存在分期付款優惠之第1物品，基於分期付款優惠來於藉由用戶終端之輸出介面而提供之第1頁面中顯示對第1物品進行結算時預估之分期付款期間資訊及分期付款金額資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S230:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="563px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623700</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102700</doc-number>
          <kind></kind>
          <date>114/01/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W76/40</main-classification>
        <further-classification edition="202601120260302B">H10W76/45</further-classification>
        <further-classification edition="202601120260302B">H10W40/10</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江幸達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, SING-DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉士瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳存晏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/964,206</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶片封裝體結構及其形成方法</chinese-title>
        <english-title>CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種晶片封裝體結構的形成方法。方法包含提供晶片，晶片具有半導體基板，半導體基板具有前側表面及後側表面。方法包含自後側表面部分地移除半導體基板以形成凹槽於半導體基板中。方法包含將散熱件接合至晶片。散熱件具有第一通道及第二通道，且第一通道及第二通道穿過散熱件且連接凹槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming a chip package structure is provided. The method includes providing a chip having a semiconductor substrate having a front surface and a back surface. The method includes partially removing the semiconductor substrate from the back surface to form a recess in the semiconductor substrate. The method includes bonding a heat sink to the chip. The heat sink has a first channel and a second channel, and the first channel and the second channel pass through the heat sink and connect the recess.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:晶片</p>
        <p type="p">180:晶片封裝體</p>
        <p type="p">350:焊料球</p>
        <p type="p">400:晶片封裝體結構</p>
        <p type="p">410:蓋體</p>
        <p type="p">415:孔洞</p>
        <p type="p">420:配線板</p>
        <p type="p">422:通孔</p>
        <p type="p">430:背板</p>
        <p type="p">432:通孔</p>
        <p type="p">440:固定結構</p>
        <p type="p">441:墊圈</p>
        <p type="p">441a:開口</p>
        <p type="p">442:墊圈</p>
        <p type="p">442a:開口</p>
        <p type="p">443:柱體結構</p>
        <p type="p">450:散熱件</p>
        <p type="p">452:出液通道</p>
        <p type="p">454:出液通道</p>
        <p type="p">460:固定結構</p>
        <p type="p">461:墊圈</p>
        <p type="p">461a:開口</p>
        <p type="p">462:墊圈</p>
        <p type="p">462a:開口</p>
        <p type="p">463:柱體結構</p>
        <p type="p">470:固定結構</p>
        <p type="p">472:固定平板</p>
        <p type="p">472a:通孔</p>
        <p type="p">474:彈簧</p>
        <p type="p">I-I’:剖線</p>
        <p type="p">TH:通孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="665px" img-content="tif" inline="yes" orientation="portrait" width="978px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623690</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102734</doc-number>
          <kind></kind>
          <date>114/01/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W76/40</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10W76/05</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳新瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡毓祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝政吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, CHENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/958,735</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其製備方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，包含在重分佈層中介物的上表面上的晶粒構件，以提供中介物上晶片結構。封裝結構位在中介物上晶片結構上。熱環位在封裝基板上，其中熱環位在中介物上晶片結構的周邊。成型材料沉積在封裝基板上，且在熱環及中介物上晶片結構之間的空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some embodiments, a device is described that includes die components on an upper surface of a redistribution layer interposer to provide a chip on interposer structure. A packaging substrate is present on the chip on interposer structure. A thermal ring is present on the packaging substrate, wherein the thermal ring is positioned about a perimeter of the chip on interposer structure. Molding material is deposited on the packaging substrate in a space between the thermal ring and the chip on interposer structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">117:封裝劑</p>
        <p type="p">120:頂部晶粒構件</p>
        <p type="p">125:封裝構件</p>
        <p type="p">129:焊料凸塊</p>
        <p type="p">130:記憶體構件</p>
        <p type="p">135:底部填充物</p>
        <p type="p">136:邊緣擋牆</p>
        <p type="p">137:封裝基板</p>
        <p type="p">140:環結構</p>
        <p type="p">141:黏著劑</p>
        <p type="p">323:焊料凸塊</p>
        <p type="p">375:成型材料</p>
        <p type="p">S1:內側壁</p>
        <p type="p">U1:上表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="539px" img-content="tif" inline="yes" orientation="portrait" width="815px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623624</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102919</doc-number>
          <kind></kind>
          <date>114/01/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W10/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃立賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LI-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳錦賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIN-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚詠霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, YUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭錫圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSI-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/961,819</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種形成半導體裝置的方法，包括形成內連線晶粒，內連線晶粒包括多個穿孔，部分地延伸穿過半導體基板、內連線結構，位在半導體基板上、以及多個晶粒連接元件，位在內連線結構上。在晶粒連接元件上施加保護層，然後圖案化保護層，以在晶粒連接元件周圍形成多個保護覆層。在內連線晶粒及保護覆層上方及周圍形成封裝材料。執行第一平坦化製程，使封裝材料、保護覆層以及晶粒連接元件等高。在晶粒連接元件上方形成第一重分佈結構，且第一重分佈結構與晶粒連接元件電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming an interconnection die that comprises through vias extending partially through a semiconductor substrate, an interconnect structure over the semiconductor substrate, and die connectors over the interconnect structure. A protection layer is applied over the die connectors and then patterned to form protective coverings around the die connectors. An encapsulant is formed over and around the interconnection die and the protective coverings. A first planarization process is performed to level the encapsulant, the protective coverings, and the die connectors. A first redistribution structure is formed over and electrically connected to the die connectors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:穿孔</p>
        <p type="p">110:內連線晶粒</p>
        <p type="p">112:基板</p>
        <p type="p">114:基板穿孔</p>
        <p type="p">118:橋接晶粒</p>
        <p type="p">120:保護層</p>
        <p type="p">128:封裝材料</p>
        <p type="p">130:前側重分佈結構</p>
        <p type="p">154:金屬化層</p>
        <p type="p">136,156:凸塊下金屬</p>
        <p type="p">150:背側重分佈結構</p>
        <p type="p">200:積體電路封裝體</p>
        <p type="p">202A:邏輯裝置</p>
        <p type="p">202B:記憶體裝置</p>
        <p type="p">204,226:導電連接元件</p>
        <p type="p">206:晶粒連接元件</p>
        <p type="p">212,232:封裝材料</p>
        <p type="p">220:封裝基板</p>
        <p type="p">222:基板核心</p>
        <p type="p">224:接合墊</p>
        <p type="p">240:中介層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10050.png" file="d10050.TIF" giffile="ed10050.png" height="679px" img-content="tif" inline="yes" orientation="portrait" width="878px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622743</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114102944</doc-number>
          <kind></kind>
          <date>114/01/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250701B">G06F11/30</main-classification>
        <further-classification edition="200601120250701B">G06F11/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑩瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YINGYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄔耀平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAOPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0166271</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>處理過去執行之複數個測試案例之資訊之方法及其電子裝置</chinese-title>
        <english-title>METHOD OF PROCESSING INFORMATION ON PLURALITY OF TEST CASES WHICH ARE PREVIOUSLY EXECUTED BEFORE AND ELECTRONIC APPARATUS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例，可提供一種電子裝置處理過去執行之複數個測試案例之資訊之方法，該方法包括如下步驟：獲得複數個測試案例各者之執行次數資訊、優先級資訊、及自動化資訊；基於執行次數資訊，確定至少一個第1測試案例；基於至少一個第1測試案例各者之優先級資訊及自動化資訊，確定至少一個第2測試案例；及向用戶終端提供至少一個第2測試案例之優先級資訊及自動化資訊中之至少一者。根據另一實施例，可提供一種實行方法之裝置及記錄有用以實行方法之電腦程式之電腦可讀記錄媒體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="655px" img-content="tif" inline="yes" orientation="portrait" width="585px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623455</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103424</doc-number>
          <kind></kind>
          <date>114/01/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D88/00</main-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
        <further-classification edition="202601120260302B">H10W99/00</further-classification>
        <further-classification edition="202601120260302B">H10W76/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛普科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AP MEMORY TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾基偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, KEE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　文良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡茹宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, RU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/958,297</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括第一堆疊對和連接單元。第一堆疊對包括第一重複單元和第二重複單元。該第一重複單元包括第一介電層、被該第一介電層包圍的第一裝置、以及包括第一金屬層的第一互連結構，該第一金屬層覆蓋該第一裝置並且被該第一介電層包圍。該第一金屬層電耦合至該第一裝置。第二重複單元包括第二介電層、第二互連結構和第二裝置，該第二互連結構包括接合至第一金屬層的第二金屬層。該第二裝置被第二介電層包圍和電耦合至該第二金屬層。連接單元包括電耦合至第一金屬層和第二金屬層的接觸墊。也揭露一種製造半導體結構的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first stacking pair and a connecting unit. The first stacking pair comprises a first repeating unit and a second repeating unit. The first repeating unit comprises a first dielectric layer, a first device surrounded by the first dielectric layer, and a first interconnect structure comprising a first metal layer over the first device and surrounded by the first dielectric layer, the first metal layer electrically coupled to the first device. The second repeating unit comprises a second dielectric layer, a second interconnect structure comprising a second metal layer bonded to the first metal layer, and a second device surrounded by the second dielectric layer and electrically coupled to the second metal layer. The connecting unit comprises a contact pad electrically coupled to the first metal layer and the second metal layer. A method of manufacturing the semiconductor structure is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:第一重複單元</p>
        <p type="p">15:第一堆疊對</p>
        <p type="p">20A:第二重複單元</p>
        <p type="p">25:連接單元</p>
        <p type="p">100:第一基板</p>
        <p type="p">101A:半導體結構</p>
        <p type="p">110:第一介電層</p>
        <p type="p">112:導電插塞</p>
        <p type="p">112A:第一組導電插塞</p>
        <p type="p">112B:第二組導電插塞</p>
        <p type="p">114:導電板</p>
        <p type="p">114A:第一導電板</p>
        <p type="p">114B:第二導電板</p>
        <p type="p">120:第一裝置</p>
        <p type="p">130:第一互連結構</p>
        <p type="p">132:導電貫孔</p>
        <p type="p">134:導線</p>
        <p type="p">136:第二金屬層</p>
        <p type="p">136A:第一部分</p>
        <p type="p">136B:第二部分</p>
        <p type="p">210:第二介電層</p>
        <p type="p">212:導電插塞</p>
        <p type="p">212A:第三組導電插塞</p>
        <p type="p">212B:第四組導電插塞</p>
        <p type="p">214:導電板</p>
        <p type="p">214A:第三導電板</p>
        <p type="p">214B:第四導電板</p>
        <p type="p">220:第二裝置</p>
        <p type="p">230:第二互連結構</p>
        <p type="p">232:導電貫孔</p>
        <p type="p">234:導線</p>
        <p type="p">236:第二金屬層</p>
        <p type="p">236A:第一部分</p>
        <p type="p">236B:第二部分</p>
        <p type="p">240:鈍化層</p>
        <p type="p">250:接觸墊</p>
        <p type="p">250A:第一接觸墊</p>
        <p type="p">250B:第二接觸墊</p>
        <p type="p">260:連接墊</p>
        <p type="p">1201:頂部導電板</p>
        <p type="p">1202:底部導電板</p>
        <p type="p">2201:頂部導電板</p>
        <p type="p">2202:底部導電板</p>
        <p type="p">L1:長度</p>
        <p type="p">L2:長度</p>
        <p type="p">T100:厚度</p>
        <p type="p">T110:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.png" file="d10028.TIF" giffile="ed10028.png" height="783px" img-content="tif" inline="yes" orientation="portrait" width="724px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623242</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103449</doc-number>
          <kind></kind>
          <date>114/01/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250701B">H04L67/50</main-classification>
        <further-classification edition="201801120250701B">H04W76/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鎮安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHENAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0173384</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置及其資訊處理方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND PROCESSING INFORMATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子裝置之資訊處理方法。資訊處理方法可包括如下步驟：自用戶終端獲得連接請求；基於連接請求而確認連接管理資訊；確認與連接管理資訊對應之邏輯伺服器；及藉由邏輯伺服器而與用戶終端實行通訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S310:步驟</p>
        <p type="p">S320:步驟</p>
        <p type="p">S330:步驟</p>
        <p type="p">S340:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="649px" img-content="tif" inline="yes" orientation="portrait" width="516px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622850</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103451</doc-number>
          <kind></kind>
          <date>114/01/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250611B">G06Q30/0207</main-classification>
        <further-classification edition="202301120250611B">G06Q30/0601</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯娜京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, NAE KYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔英珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YOUNG JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金雅文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YAE EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>具妍靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, YEON JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李坤熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0173623</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>提供優惠券資訊之方法及裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PROVIDING COUPON INFORMATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一實施例之電子裝置提供優惠券資訊之方法可包括如下步驟：自用戶之終端獲得第1物品之購買請求；基於用戶之資訊及第1物品之資訊中之至少一者，確認用戶之一個以上之優惠券；基於第1物品之結算金額，確定一個以上之優惠券中之第1優惠券；及響應於購買請求，向用戶之終端提供包括第1物品之結算資訊及第1優惠券之資訊之第1頁面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:順序圖</p>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="653px" img-content="tif" inline="yes" orientation="portrait" width="500px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623641</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103742</doc-number>
          <kind></kind>
          <date>114/02/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/22</main-classification>
        <further-classification edition="202601120260302B">H10W40/47</further-classification>
        <further-classification edition="202601120260302B">H10W40/73</further-classification>
        <further-classification edition="202601120260302B">H10W42/00</further-classification>
        <further-classification edition="202601120260302B">H10W70/685</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王健彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIEN-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳邦莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BANG-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張國欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KUO-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>言　瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, KATHY WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/680,151</doc-number>
          <date>20240807</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/971,836</doc-number>
          <date>20241206</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>封裝結構及其製造方法</chinese-title>
        <english-title>PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝結構的製造方法包括形成封裝元件，其包括形成延伸穿過基底的熱通孔，以及將晶粒接合到熱通孔。此方法包括將封裝元件的熱通孔附接到封裝基底的第一導熱墊，其中封裝基底包括位於第一導熱墊下方的熱管。此方法包括將支撐結構附接到封裝基底的第二導熱墊，其中熱管位於第二導熱墊下方，其中支撐結構包括第一熱電冷卻器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a package component, including forming a thermal via extending through a substrate; and bonding a die to the thermal via; attaching the thermal via of the package component to a first conductive pad of a package substrate, wherein the package substrate includes a heat pipe underneath the first conductive pad; and attaching a support structure to a second conductive pad of the package substrate, wherein the heat pipe is underneath the second conductive pad, wherein the support structure includes a first thermoelectric cooler.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:封裝元件</p>
        <p type="p">50:晶圓</p>
        <p type="p">53:熱通孔</p>
        <p type="p">60A,60B:裝置</p>
        <p type="p">80:導電連接器</p>
        <p type="p">90:支撐件</p>
        <p type="p">100:封裝基底</p>
        <p type="p">114:導電連接器</p>
        <p type="p">142A,142B:熱墊</p>
        <p type="p">150:熱管</p>
        <p type="p">200:封裝體</p>
        <p type="p">210:支撐結構</p>
        <p type="p">220:熱電冷卻器(TEC)</p>
        <p type="p">221:連接器</p>
        <p type="p">222,224,226,228:黏著劑熱界面材料(黏著劑TIM)</p>
        <p type="p">230:散熱器</p>
        <p type="p">240:冷卻系統</p>
        <p type="p">250:外部基底</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="661px" img-content="tif" inline="yes" orientation="portrait" width="969px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622716</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114103951</doc-number>
          <kind></kind>
          <date>114/02/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250303B">G06F3/041</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭彥誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YEN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/963,400</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>觸控控制器及用於觸控控制器的方法</chinese-title>
        <english-title>TOUCH CONTROLLER AND METHOD FOR USE IN TOUCH CONTROLLER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種觸控控制器，用於控制觸控面板。觸控面板包含複數個感測單元的陣列，複數個感測單元分為N行，每行包含M個範圍，每行中的M個範圍被組成P個區域。該觸控控制器包含開關電路及感測電路。在粗掃描期間中，開關電路將每行的每個區域中的複數個感測單元互相耦接，且感測電路掃描N行的PxN個區域以產生PxN個區域訊號。在M個細掃描期間中，開關電路將PxN個區域中的觸發區域中的複數個感測單元互相斷開，且感測電路掃描該觸發區域中的範圍而不掃描PxN個區域中的複數個未觸發區域以產生觸發區域中的複數個感測單元的複數個單元訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A touch controller is used to control a touch panel. The touch panel has an array of sensor cells divided in to N columns, wherein each column has M regions, and the M regions are grouped into P zones. The touch controller has a switch circuit and a sensing circuit. In a coarse scan period, the switch circuit shorts the sensor cells in each zone of each column, and the sensing circuits scans PxN zones of the N columns to generate PxN zone signals. In M fine scan periods, the switch circuit decouples the sensor cells in a triggered zone of the PxN zones, and the sensing circuit scans a region of the triggered zone without scanning untriggered zones of the PxN zones to generated cell signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1-S4:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10030.JPG" file="ed10030.JPG" height="665px" img-content="tif" inline="yes" orientation="portrait" width="827px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622375</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104026</doc-number>
          <kind></kind>
          <date>114/02/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250325B">F04D29/42</main-classification>
        <further-classification edition="200601120250325B">F04D29/58</further-classification>
        <further-classification edition="200601120250325B">F04D29/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116975490</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>風機殼體、鼓風機總成及車輛空調系統</chinese-title>
        <english-title>BLOWER HOUSING, BLOWER ASSEMBLY AND VEHICLE AIR CONDITIONING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種風機殼體、鼓風機總成及車輛空調系統，風機殼體包括安裝殼、散熱件及減震組件。安裝殼設有多個限位槽，安裝殼具有用於安裝定轉子組件的安裝空間；散熱件包括位於安裝殼內的散熱板，散熱板的邊緣具有多個固定部；減震組件包括多個減震件，多個減震件沿第一方向間隔設置，減震件對應設置於限位槽中，且減震件在第一方向上的端部、在第二方向上的端部以及背離安裝殼軸線的一端均抵接於限位槽的槽壁，減震件朝向安裝殼中軸線的一端開設有口袋槽，多個減震件的口袋槽與多個固定部一一對應，每個固定部限位於與其對應的口袋槽中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a blower housing, a blower assembly and a vehicle air conditioning system. The blower housing includes an install housing, a heat dissipation element and a shock absorbing component. A plurality of position limiting slots is disposed on the install housing. The install housing is provided with a mounting space for mounting a stator and rotor component. The heat dissipation element includes a heat dissipation plate located in the install housing. The edge of the heat dissipation plate is provided with a plurality of fixing portions. The shock absorbing component includes a plurality of shock absorbing elements. The plurality of shock absorbing elements are disposed at intervals along a first direction. The shock absorbing elements are correspondingly disposed in the position limiting slots. The end of the shock absorbing element in the first direction, the end of the shock absorbing element in a second direction and the end of the shock absorbing element away from the axis of the install housing are abutted against the walls of the position limiting slot. A pocket slot is disposed on one end of the shock absorbing element toward the central axis of the install housing. The pocket slots of the plurality of shock absorbing elements are correspond to the plurality of fixing portions. Each fixing portion is limited in the corresponding pocket slot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">131:第一殼體</p>
        <p type="p">1311:減震柱</p>
        <p type="p">200:散熱件</p>
        <p type="p">310:減震件</p>
        <p type="p">X:第一方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.JPG" file="ed10025.JPG" height="714px" img-content="tif" inline="yes" orientation="portrait" width="656px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623281</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104406</doc-number>
          <kind></kind>
          <date>114/02/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250303B">H04W4/029</main-classification>
        <further-classification edition="201801120250303B">H04W4/02</further-classification>
        <further-classification edition="201801120250303B">H04W4/38</further-classification>
        <further-classification edition="200901120250303B">H04W88/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃品翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PIN-SIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王韋程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,895</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>無線通訊的裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD FOR WIRELESS COMUNICATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種無線通訊的裝置。裝置包含處理器。處理器發送使用者裝置的連接狀態的要求至第一基站。處理器發送掃描第一基站的覆蓋範圍內的區域的感測指令至第一基站以產生環境特徵資料。處理器根據環境特徵資料執行神經網路推論以產生使用者裝置的預測位置。處理器根據預測位置控制第一可重構智慧表面裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for wireless communication is provided. The device includes a processor. The processor sends a request to an first base station for connection status of a user device. The processor sends a sensing command to the first base station to scan an area in a coverage of the first base station to generate environment feature data. The processor performs a neural network inference according to the environment feature data to generate a predicted position of the user device. The processor controls a first reconfiguration intelligent surface (RIS) device according to the predicted position.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">100:控制器</p>
        <p type="p">131:感測模組</p>
        <p type="p">132:預測模組</p>
        <p type="p">133:決策模組</p>
        <p type="p">134:可重構智慧表面模組</p>
        <p type="p">135:換手模組</p>
        <p type="p">136:路徑模組</p>
        <p type="p">200:基站</p>
        <p type="p">400:可重構智慧表面</p>
        <p type="p">500:使用者裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="767px" img-content="tif" inline="yes" orientation="portrait" width="919px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622831</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104480</doc-number>
          <kind></kind>
          <date>114/02/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250801B">G06Q10/087</main-classification>
        <further-classification edition="202401120250801B">G06Q10/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金德誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DUCK SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭形旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, HYEONG WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李錫勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUK HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全玄贊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, HYUN CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權　永洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, YOUNGSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0168701</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>處理測定資訊之電子裝置之動作方法及支持該動作方法之電子裝置</chinese-title>
        <english-title>OPERATING METHOD FOR ELECTRONIC APPARATUS FOR PROCESSING MEASUREMENT INFORMATION AND ELECTRONIC APPARATUS SUPPORTING THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種測定資訊處理方法，其包括如下步驟：確認對象物品；獲得上述對象物品之識別資訊；自用戶終端獲得包括上述對象物品之至少一個測定資訊之第1測定資訊集；及基於上述第1測定資訊集來設定上述對象物品之管理資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S210:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S250:步驟</p>
        <p type="p">S270:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="630px" img-content="tif" inline="yes" orientation="portrait" width="616px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623396</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104523</doc-number>
          <kind></kind>
          <date>114/02/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/62</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10W10/00</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202501120260302B">H10D62/13</further-classification>
        <further-classification edition="202501120260302B">H10D84/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃偉順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宗胤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, TSUNG-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王英名</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YING MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭易沂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, I-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳力毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,644</doc-number>
          <date>20240806</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/978,147</doc-number>
          <date>20241212</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體元件及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATION THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供了一種積體電路，該積體電路包括用於共存於同一晶片中的相同類型元件的多個源極/汲極物理尺寸。一些實施例提供了用於調製源極/汲極物理尺寸以微調寄生電容（例如閘極和汲極之間的寄生電容Cgd）和電阻（例如類比或RF（射頻）元件中的源極/汲極接觸件的電阻Rc）的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide an integrated circuit including multiple source/drain physical dimensions for the same type devices co-exist in the same chip. Some embodiments provide methods for modulating source/drain physical dimension to fine-tune parasite capacitance, such as parasite capacitance between gate and drain Cgd, and resistance, such as resistance for source/drain contact Rc in analog or RF (radio frequency) devices.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:方法</p>
        <p type="p">12、14、16、18、20、22、24、26、28、30、32、34、36、38、40、42、44、46:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.png" file="d10027.TIF" giffile="ed10027.png" height="739px" img-content="tif" inline="yes" orientation="portrait" width="1031px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621661</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104590</doc-number>
          <kind></kind>
          <date>114/02/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">A61H3/06</main-classification>
        <further-classification edition="200601120250401B">G01C21/34</further-classification>
        <further-classification edition="202001120250401B">G01S15/93</further-classification>
        <further-classification edition="200601120250401B">G01S17/42</further-classification>
        <further-classification edition="200601120250401B">G08B21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>醒吾學校財團法人醒吾科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桃氏　碧江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　文福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　黎竹原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李世達</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113212644</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>感測器融合的防護裝置與方法</chinese-title>
        <english-title>SENSOR FUSION PROTECTION DEVICE AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種感測器融合的防護裝置與方法，利用感測器融合的創新設計，可以同時匯集多顆、同類型或不同種類感測器的數據，先行逐一收集單一感測的數據，最後再匯總全部的數據，傳送至微處理器或是中央處理器進行判讀與運算，可以更快和更準確地感知周邊的環境條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a sensor fusion protection device and method, which utilizes the sensor fusion design and can simultaneously collect data from multiple sensors of the same type or different types, so as to collect the data of a single sensor one by one. The data is then summarized and sent to a microprocessor or central processing unit for interpretation and calculation, which can sense the surrounding environmental conditions more quickly and accurately.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:白手杖</p>
        <p type="p">101:容置空間</p>
        <p type="p">20:手持式光達</p>
        <p type="p">30’:超音波感測器</p>
        <p type="p">40:藍牙裝置</p>
        <p type="p">41:藍牙耳機</p>
        <p type="p">50:資料處理模組</p>
        <p type="p">501:控制介面</p>
        <p type="p">502:應用單元</p>
        <p type="p">60:遠端資料庫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="905px" img-content="tif" inline="yes" orientation="portrait" width="725px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623427</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104782</doc-number>
          <kind></kind>
          <date>114/02/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202301120260302B">H10B10/00</further-classification>
        <further-classification edition="202501120260302B">H10D30/00</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202501120260302B">H10D30/67</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D84/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭秉恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, PING-EN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳稚軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,834</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/981,129</doc-number>
          <date>20241213</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構以及其形成方法</chinese-title>
        <english-title>A SEMICONDUCTOR STRUCTURE AND ITS FORMING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供IC結構及形成該結構的方法。於一實施例中，形成IC結構之範例的方法包含形成沿著第一方向縱向地延伸的高介電常數金屬閘極結構；形成將高介電常數金屬閘極結構分隔成兩個部分的溝槽；順應地沉積第一介電層，以大抵地填充溝槽；在第一介電層順應地沉積後，於高介電常數金屬閘極結構上，形成圖案化的遮罩，圖案化的遮罩包含設置於溝槽正上方的開口；利用圖案化的遮罩做為蝕刻遮罩，回蝕第一介電層，以獲得打薄的第一介電層；以及在第一介電層蝕刻後，於溝槽中及打薄的第一介電層上，形成第二介電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An IC structure and a method of forming the same are provided. In an embodiment, an exemplary method of forming the IC structure includes forming a high-k metal gate structure extending lengthwise along a first direction, forming a trench to separate the high-k metal gate structure into two portions, conformally depositing a first dielectric layer to substantially fill the trench, after the conformally depositing of the first dielectric layer, forming a patterned mask over the high-k metal gate structure, the patterned mask comprising an opening disposed directly over the trench, etching back the first dielectric layer while using the patterned mask as an etch mask to obtain a thinned first dielectric layer, and after the etching of the first dielectric layer, forming a second dielectric layer in the trench and on the thinned first dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">402,404,406,408,410,412,414,416:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="744px" img-content="tif" inline="yes" orientation="portrait" width="977px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622745</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104870</doc-number>
          <kind></kind>
          <date>114/02/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250801B">G06F11/36</main-classification>
        <further-classification edition="201801120250801B">G06F8/35</further-classification>
        <further-classification edition="201801120250801B">G06F8/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商韓領有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUPANG CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李贇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>應澤木</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YING, ZEMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0173709</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置及其代碼部署方法</chinese-title>
        <english-title>ELECTRONIC APPARATUS AND DEPLOYING CODES METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電子裝置之代碼部署方法。代碼部署方法可包括如下步驟：對自第1終端接收到之與第1功能相關之第1代碼實行第1測試；將通過上述第1測試之上述第1代碼合併至整合分支；對與包括上述第1代碼之複數個代碼對應之複數個功能實行第2測試，該等複數個代碼係合併於上述整合分支者；及將滿足設定之條件之第2代碼合併至主分支，該第2代碼係與通過上述第2測試之一個以上之功能對應之一個以上的代碼中者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">120:第1用戶終端</p>
        <p type="p">140:第2用戶終端</p>
        <p type="p">S200:步驟</p>
        <p type="p">S210:步驟</p>
        <p type="p">S220:步驟</p>
        <p type="p">S230:步驟</p>
        <p type="p">S240:步驟</p>
        <p type="p">S250:步驟</p>
        <p type="p">S260:步驟</p>
        <p type="p">S270:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="923px" img-content="tif" inline="yes" orientation="portrait" width="727px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623222</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104923</doc-number>
          <kind></kind>
          <date>114/02/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120250602B">H04B17/15</main-classification>
        <further-classification edition="201501120250602B">H04B17/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘桂均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, GUI-JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余雷同</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, LEI-TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐學亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, XUE-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116901783</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>功分器及通訊測試系統</chinese-title>
        <english-title>POWER DIVIDER AND COMMUNICATION TEST SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種功分器與通訊測試系統，功分器用於連接通訊測試儀與通訊設備，功分器包括旋轉電機、連接件、通訊設備連接器及控制電路；控制電路用於輸出控制訊號至旋轉電機，控制訊號用於控制旋轉電機旋轉，以帶動連接件旋轉並連接至一個設備連接埠。由此，本申請提供之功分器及通訊測試系統，可以降低通訊測試系統中之功分器數量、複雜度，從而簡化通訊測試儀與通訊設備之間之電連接結構，減少通訊測試儀與通訊設備之間之訊號衰減及損耗，實現通訊測試儀對通訊設備之自動化通訊測試。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application provides a power divider and a communication test system. The power divider is used to connect a communication tester and communication equipment. The power divider comprises a rotating motor, a connector, a communication equipment connector and a control circuit. The control circuit is used to output the control signal to the rotating motor, and the control signal is used to control the rotation of the rotating motor to turn the connector and connect to a device connection port. Therefore, the power divider and communication test system provided in this application can reduce the number and complexity of power dividers in the communication test system, thus simplifying the electrical connection structure between the communication tester and the communication device, reducing the signal attenuation and loss between the communication tester and the communication device, and realizing the automatic communication test of the communication device by the communication tester.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:通訊測試儀</p>
        <p type="p">12:通訊設備</p>
        <p type="p">13:功分器</p>
        <p type="p">131:測試儀連接器</p>
        <p type="p">132:旋轉電機</p>
        <p type="p">133:連接件</p>
        <p type="p">1331:連接頭</p>
        <p type="p">134:通訊設備連接器</p>
        <p type="p">1341:設備連接埠</p>
        <p type="p">135:控制電路</p>
        <p type="p">14:主機設備</p>
        <p type="p">ANT1~ANT8:天線埠</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="762px" img-content="tif" inline="yes" orientation="portrait" width="674px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623070</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114104960</doc-number>
          <kind></kind>
          <date>114/02/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01M4/62</main-classification>
        <further-classification edition="200601120260224B">C08G18/72</further-classification>
        <further-classification edition="201001120260224B">H01M4/13</further-classification>
        <further-classification edition="201001120260224B">H01M10/052</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＤＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松岡龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUOKA, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髭白朋和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGESHIRO, TOMOKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城崎丈雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIZAKI, TAKEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-097341</doc-number>
          <date>20240617</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>非水系二次電池正極用黏合劑組成物、非水系二次電池正極用組成物、非水系二次電池用正極及非水系二次電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種非水系二次電池正極用黏合劑組成物、含有上述正極用黏合劑組成物之非水系二次電池正極用組成物、由上述正極用組成物所形成之正極、以及具有上述正極之二次電池，上述非水系二次電池正極用黏合劑組成物能夠形成對電解液之耐久性或正極活性物質之分散性優異且充放電效率及容量維持率等電池特性優異之二次電池，且亦符合針對有機氟化合物之法規。&lt;br/&gt;本發明之非水系二次電池正極用黏合劑組成物含有胺酯樹脂（urethane resin）及非水系溶劑，上述胺酯樹脂係使芳香族系多異氰酸酯、分子量為50以上500以下之鏈伸長劑、及分子量為500以上5000以下之多元醇進行反應而獲得之胺酯樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623082</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105232</doc-number>
          <kind></kind>
          <date>114/02/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120260225B">H01M50/202</main-classification>
        <further-classification edition="202101120260225B">H01M50/109</further-classification>
        <further-classification edition="202101120260225B">H01M50/262</further-classification>
        <further-classification edition="202101120260225B">H01M50/271</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商簡易萬全公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMPLISAFE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朵德　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOWD, KRISTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　卡萊布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, KALEB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海伍德　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEYWOOD, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古德爾　迪恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOODALE, DEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱鈺翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喻善淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SHAN-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡志堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHIH-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/689,196</doc-number>
          <date>20240830</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電池容納裝置及用於安裝電池在電池容納裝置的方法</chinese-title>
        <english-title>BATTERY RETAINING DEVICE AND PROCESS FOR INSTALLING BATTERY IN BATTERY RETAINING DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電池容納裝置包括基座以及可下壓的蓋件。基座界定接收電池的電池開口，電池具有鈕扣狀的外型。基座包括位於電池開口附近的維持器。可下壓的一蓋件設置於電池開口中，並固定於緊靠維持器的地點，以在蓋件連接基座時預防電池從基座脫離。蓋件包括止動器以及本體部，其中，根據本體部和維持器的接合及止動器和基座的肩部，蓋件可釋放地固定於基座。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a base and a depressible cover. The base defines a battery opening in which to receive a battery having the form factor of a coin-cell. The base includes a retainer located proximate to the battery opening. The depressible cover is disposed in the battery opening and is secured in place against the retainer to prevent removal of the battery from the base while the cover is coupled to the base. The cover includes a detent and a body portion, wherein the cover is releasably secured to the base upon engagement of the body portion with the retainer and engagement of the detent with a shoulder of the base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:設備</p>
        <p type="p">12:裝置</p>
        <p type="p">14:電池</p>
        <p type="p">16:基座</p>
        <p type="p">20:座體</p>
        <p type="p">22:電池板</p>
        <p type="p">24:蓋件</p>
        <p type="p">26:外蓋</p>
        <p type="p">30:電池開口</p>
        <p type="p">30A:第一端</p>
        <p type="p">30B:第二端</p>
        <p type="p">32:彈簧</p>
        <p type="p">32A,34A:後側</p>
        <p type="p">32B:前側</p>
        <p type="p">36:負極接觸導線</p>
        <p type="p">40:維持器</p>
        <p type="p">42A:第一維持延伸部分</p>
        <p type="p">42B:第二維持延伸部分</p>
        <p type="p">50:腔體</p>
        <p type="p">54:肩部</p>
        <p type="p">60:本體部</p>
        <p type="p">62:緊固區段</p>
        <p type="p">64:主體區段</p>
        <p type="p">66:外緣區段</p>
        <p type="p">68:開口</p>
        <p type="p">70A,70B:維持凹槽</p>
        <p type="p">80:止動器</p>
        <p type="p">82,84:卡勾件</p>
        <p type="p">82B,84B:倒角前表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="942px" img-content="tif" inline="yes" orientation="portrait" width="738px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623363</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105420</doc-number>
          <kind></kind>
          <date>114/02/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B43/20</main-classification>
        <further-classification edition="202301120260302B">H10B99/00</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
        <further-classification edition="202601120260302B">H10P14/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川島裕嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, HIROTSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-200703</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體記憶裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明抑制到達深度不同之複數個接觸孔上之抗蝕圖案之層厚不均。&lt;br/&gt;實施方式之半導體記憶裝置之製造方法形成積層體，該積層體係複數個第1絕緣層與複數個第2絕緣層逐層交替積層而成；形成複數個孔，該等複數個孔於積層體內沿著積層體之積層方向延伸，且到達深度不同；向複數個孔內填充含碳層，使得於距複數個孔各自之上端部規定深度之位置處具有上表面；形成被覆層，該被覆層覆蓋複數個孔各自中之含碳層之上表面；透過被覆層去除含碳層；形成抗蝕圖案，該抗蝕圖案覆蓋由被覆層堵塞之複數個孔之一部分且具有供複數個孔之另一部分露出之開口部；將堵塞露出於抗蝕圖案之開口部之複數個孔之另一部分之被覆層去除；對複數個孔之另一部分進行追加加工，以使複數個孔之另一部分之到達深度增加。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">72:被覆層</p>
        <p type="p">81:硬質遮罩圖案</p>
        <p type="p">CLe,Cle,CLg,CLh:接觸孔</p>
        <p type="p">LMs:積層體</p>
        <p type="p">NL,OL:絕緣層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10052.JPG" file="ed10052.JPG" height="389px" img-content="tif" inline="yes" orientation="portrait" width="712px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621912</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114105441</doc-number>
          <kind></kind>
          <date>114/02/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250801B">B60L3/12</main-classification>
        <further-classification edition="201901120250801B">B60L50/60</further-classification>
        <further-classification edition="201901120250801B">B60L58/10</further-classification>
        <further-classification edition="202001120250801B">G01R31/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇擂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧雲龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, YUN-LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411690784.5</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>動力電池故障預警方法、電子設備和電腦可讀存儲介質</chinese-title>
        <english-title>POWER BATTERY FAULT WARNING METHOD, ELECTRONIC DEVICE, AND NON-TRANSITORY STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種動力電池故障預警方法、電子設備和電腦可讀存儲介質，方法應用於移動終端，移動終端通信連接車輛，車輛內設有動力電池，動力電池用於為車輛提供電能；方法包括：在車輛行駛的過程中，接收動力電池的故障等級，其中，車輛的動力電池發生故障時，生成故障等級；生成與故障等級匹配的故障處理結果，其中，故障處理結果至少包括車輛是否需要維修以及車輛的運行狀態或駕駛模式是否需要調整；基於故障處理結果進行預警。本申請能夠在動力電池出現故障預警時，及時生成故障處理結果，以提醒駕駛員對故障進行規避。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a power battery fault warning method, electronic device, and non-transitory storage medium. The method is applied to a mobile terminal, the mobile terminal communicates with a vehicle, the vehicle provides with a power battery, the power battery is used to provide electric energy for the vehicle. The method includes: in a process of the vehicle driving, receiveing a fault level of the power battery, wherein the fault level of the power battery is generated when the power battery of the vehicle fails; generating a fault processing result matching the fault level, wherein the fault processing result at least includes whether the vehicle needs maintenance and whether the vehicle's operating state or driving mode needs to be adjusted; and warning the fault processing results. This application can generate the fault processing result in time when the power battery failure warning occurs, so as to remind the driver to avoid the fault.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101-S103:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="424px" img-content="tif" inline="yes" orientation="portrait" width="636px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622518</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106065</doc-number>
          <kind></kind>
          <date>114/02/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250402B">G01R19/12</main-classification>
        <further-classification edition="200601120250402B">B81B7/02</further-classification>
        <further-classification edition="200601120250402B">B81B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許郁文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JEN-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭沁柔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIN-JOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃肇達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHAO-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024118808098</doc-number>
          <date>20241219</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中華民國</country>
          <doc-number>113144035</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具微機電元件的電壓感測裝置</chinese-title>
        <english-title>VOLTAGE SENSING DEVICE HAVING MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) ELEMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種具微機電元件的電壓感測裝置，包括微機電感測元件、轉阻放大電路以及微分電路。微機電感測元件用於感測輸入電壓以產生感測電流。轉阻放大電路連接於微機電感測元件的輸出端以接收感測電流，將感測電流轉換為放大電壓。微分電路連接於轉阻放大電路，用於接收放大電壓，及對放大電壓進行微分以產生微分訊號，其中微分訊號指示輸入電壓是否具有驟變狀態及指示輸入電壓發生驟變的時間點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A voltage sensing device having micro electro mechanical systems (MEMS) element includes a MEMS sensing element, a transimpedance amplifying circuit and a differential circuit. The MEMS sensing element is configured to sense an input voltage to generate a sensed current. The transimpedance amplifying circuit is connected to an output terminal of the MEMS sensing element. The transimpedance amplifying circuit is configured to receive the sensed current, convert the sensed current into an amplified voltage. The differential circuit is connected to the transimpedance amplifying circuit. The differential circuit is configured to receive the amplified voltage and differentiate the amplified voltage to generate a differential signal, wherein the differential signal indicates whether an input voltage drops and a time point at which the input voltage drops.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:具微機電元件的電壓感測裝置</p>
        <p type="p">11:微機電感測元件</p>
        <p type="p">12:轉阻放大電路</p>
        <p type="p">121:放大器</p>
        <p type="p">122:電阻器</p>
        <p type="p">13:微分電路</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">I1:感測電流</p>
        <p type="p">V2:接地電壓</p>
        <p type="p">V3:放大電壓</p>
        <p type="p">V4:微分訊號</p>
        <p type="p">ω:頻率</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="563px" img-content="tif" inline="yes" orientation="portrait" width="906px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622706</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106206</doc-number>
          <kind></kind>
          <date>114/02/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120250401B">G06F3/0346</main-classification>
        <further-classification edition="202401120250401B">G06T3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭家堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIAU, JIA-YAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUANHSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/950,157</doc-number>
          <date>20241117</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>校正參數產生系統及方法</chinese-title>
        <english-title>CALIBRATION PARAMETER GENERATING DEVICE AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種校正參數產生系統及方法。處理裝置基於複數個身體部位各者之一追蹤資料，計算一目標使用者之一身體姿態。處理裝置自至少一校正裝置中之一第一校正裝置接收包含該目標使用者之一第一即時影像及該第一校正裝置之一定位資訊，該第一即時影像包含至少一穿戴式裝置中之至少一第一可視穿戴式裝置。處理裝置基於該第一即時影像、該第一校正裝置之該定位資訊及該身體姿態，產生對應該至少一第一可視穿戴式裝置各者之一校正參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A calibration parameter generating device and method are provided. The processing device calculates a body posture of a target user based on tracking data of each of the plurality of body parts. The processing device receives a first real-time image of the target user and positioning information of a first calibration device from the first calibration device of the at least one calibration device, and the first real-time image includes at least one first visible wearable device among the at least one wearable device. The processing device generates a calibration parameter corresponding to each the at least one first visible wearable device based on the first real-time image, the positioning information of the first calibration device, and the body posture.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:校正參數產生方法</p>
        <p type="p">S501、S503、S505:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="763px" img-content="tif" inline="yes" orientation="portrait" width="781px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623272</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106323</doc-number>
          <kind></kind>
          <date>114/02/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250401B">H04R1/04</main-classification>
        <further-classification edition="200601120250401B">H01R13/02</further-classification>
        <further-classification edition="200601120250401B">B29C45/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密組件（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION ACCESSORY (SUZHOU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉剛強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, GANGQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117477469</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種耳機連接器及其製備方法</chinese-title>
        <english-title>EARPHONE CONNECTOR AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種耳機連接器及其製備方法，包括相互結合的第一構件和第二構件，該第一構件由電鍍級的第一塑膠材料製成，該第二構件由非電鍍級的第二塑膠材料製成，該第一構件外露於該第二構件的部分覆蓋有金屬電鍍層，且該第一構件內側具有擋牆結構。本發明採用雙射射出成型的相互結合的第一構件和第二構件，並在第一構件內側具有擋牆結構以及第一構件外露於第二構件的部分覆蓋有金屬電鍍層，整體結構簡單，所得產品品質優異，成型簡便，生產效率高且生產成本低。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An earphone connector and a preparation method thereof are disclosed . The earphone connector includes a first component and a second component combined with each other. The first component is made of a first plastic material of electroplating grade. The second component is made of a second plastic material of non-electroplating grade. A portion of the first component exposed from the second component is covered with a metal electroplating layer. The inner side of the first component is provided with a blocking wall structure. The disclosure uses the first component and the second component combined with each other through double-color injection, and the blocking wall structure is provided on the inner side of the first component, and the portion of the first component exposed from the second component is covered with the metal electroplating layer. The overall structure is simple, the quality of the product is excellent, the molding is simple, the efficiency of the production is high and the cost of the production is low.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:第一構件</p>
        <p type="p">3:第二構件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="672px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621904</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106350</doc-number>
          <kind></kind>
          <date>114/02/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250417B">B41J2/07</main-classification>
        <further-classification edition="200601120250417B">B41J2/435</further-classification>
        <further-classification edition="200601120250417B">B41J2/485</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪世慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHI-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王君豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YAO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117594227</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>噴墨控制方法及噴墨設備</chinese-title>
        <english-title>INKJET CONTROLLING METHOD AND INKJET EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及噴墨列印技術領域，提供一種噴墨控制方法及噴墨設備。噴墨控制方法包括：接收待加工零件之噴碼資料；調用清潔裝置清潔待加工零件之表面；調用採集裝置採集待加工零件之第一位置訊息及噴碼裝置之噴頭之第二位置資訊；根據噴碼資料與待加工零件之第一位置訊息確定噴墨控制資訊；基於噴墨控制資訊對清潔後之待加工零件進行噴塗；調用固化裝置對噴塗於待加工零件上之第一碼標進行固化。噴墨設備包括接收裝置、傳送裝置、清潔裝置、噴碼裝置、採集裝置、資料處理裝置及固化裝置。藉由本申請提高了噴墨之效率與準確率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a field of an inkjet printing technology, and provides an inkjet controlling method and an inkjet equipment. The method includes: receiving inkjet coding data of a part to be processed; invoking a cleaning device to clean a surface of the parts to be processed; invoking an acquisition device to collect a first position information of the parts to be processed and a second position information of a nozzle of an inkjet coding device; determining inkjet control information according to the inkjet coding data and the first position information of the parts to be processed; spraying on the parts to be processed after cleaning is based on the inkjet control information; invoking a curing device to cure a first code mark sprayed on the part to be processed. The inkjet equipment includes a receiving device, a transmission device, a cleaning device, an inkjet coding device, an acquisition device, a data processing device and a curing device. The application improves the efficiency and accuracy of inkjet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101-107:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="975px" img-content="tif" inline="yes" orientation="portrait" width="686px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622159</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106480</doc-number>
          <kind></kind>
          <date>114/02/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250514B">C08J5/18</main-classification>
        <further-classification edition="200601120250514B">C08G73/10</further-classification>
        <further-classification edition="202101120250514B">H01M50/414</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商亞安頂材有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMIDEMASTER CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾吉永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHI YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱楗洺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JIAN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王秀慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIU HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊杰凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/132402</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>聚醯亞胺隔膜及其製備方法和應用</chinese-title>
        <english-title>POLYIMIDE SEPARATOR AND PREPARATION METHOD AND APPLICATION THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了聚醯亞胺隔膜及其製備方法和應用，屬於高分子材料領域。該聚醯亞胺隔膜的製備方法包括下述步驟：（1）將二胺類單體與二酸酐類單體加入至溶劑中，反應得到含聚醯胺酸的溶液；（2）向所述含聚醯胺酸的溶液中加入帶有含醯胺基團的單體，反應後得到漿料；（3）將所述漿料經相轉化法得到聚醯亞胺隔膜。該聚醯亞胺隔膜的製備中加入含醯胺基團的單體來改善結構，從而提升該隔膜的電解液浸潤性與電解液吸收率，進而提升電池倍率性能；並且拉伸強度和耐穿刺性也顯著提高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a polyimide separator, its preparation method, and its application, belonging to the field of polymer materials. The preparation method of the polyimide separator comprises the following steps: (1) adding a diamine monomer and a dianhydride monomer into a solvent to react and obtain a solution containing polyamic acid; (2) adding a monomer with amide groups to the solution containing polyamic acid, and after reaction, obtaining a slurry; (3) obtaining the polyimide separator from the slurry via a phase inversion process. In the preparation of the polyimide separator, the addition of the monomer containing amide groups serves to improve the structure, thereby enhancing the electrolyte wettability and electrolyte absorption rate of the separator, which in turn improves the battery's rate performance; moreover, the tensile strength and puncture resistance are also significantly enhanced.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622151</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106481</doc-number>
          <kind></kind>
          <date>114/02/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250922B">C08G73/10</main-classification>
        <further-classification edition="200601120250922B">C08J5/22</further-classification>
        <further-classification edition="200601120250922B">B32B27/26</further-classification>
        <further-classification edition="201601120250922B">H01M8/1067</further-classification>
        <further-classification edition="202101120250922B">H01M50/403</further-classification>
        <further-classification edition="202101120250922B">H01M50/423</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商亞安頂材有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMIDEMASTER CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱楗洺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JIAN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾吉永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHI YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王秀慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIU HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊杰凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/132422</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>聚醯亞胺隔膜及其製備方法和電化學裝置</chinese-title>
        <english-title>POLYIMIDE SEPARATOR, PREPARATION METHOD THEREOF, AND ELECTROCHEMICAL DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了聚醯亞胺隔膜及其製備方法和電化學裝置，屬於鋰離子電池材料領域。該電池用聚醯亞胺隔膜的製備方法包括下述步驟：（1）將二胺類單體與二酸酐類單體加入至溶劑中，反應得到含中間體的溶液；（2）向所述含中間體的溶液中加入帶有含醯胺基團的單體，反應後得到漿料；（3）將所述漿料塗布於離型力為50 gf/25mm-500 gf/25mm的基板上，之後浸泡於凝固浴溶液中預固化，最後將預固化後的濕膜自基板表面取下，乾燥後得到聚醯亞胺隔膜。該製備方法利於工業大規模生產，且製備得到的聚醯亞胺隔膜的抗拉強度不低於20MPa，孔隙率在55%以上，電解液吸收率在150%以上，且能夠在350℃以下不熔融、不形變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a polyimide separator, a preparation method thereof, and an electrochemical device, belonging to the field of lithium-ion battery materials. The preparation method of the polyimide separator for batteries includes the following steps: (1) adding a diamine monomer and a dianhydride monomer into a solvent to react and obtain a solution containing an intermediate; (2) adding a monomer containing amide groups into the solution containing the intermediate, and reacting to obtain a slurry; (3) coating the slurry onto a substrate with a release force of 50 gf/25 mm to 500 gf/25 mm, then immersing it in a coagulation bath for pre-curing, and finally peeling the pre-cured wet film from the surface of the substrate and drying it to obtain the polyimide separator. This preparation method is suitable for large-scale industrial production, and the resulting polyimide separator exhibits a tensile strength of no less than 20MPa, a porosity of over 55%, an electrolyte uptake of over 150%, and maintains its shape and integrity without melting or deforming below 350°C.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="493px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623083</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106482</doc-number>
          <kind></kind>
          <date>114/02/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120250514B">H01M50/414</main-classification>
        <further-classification edition="201001120250514B">H01M10/0525</further-classification>
        <further-classification edition="200601120250514B">C08G73/10</further-classification>
        <further-classification edition="200601120250514B">C08J5/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商亞安頂材有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMIDEMASTER CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱楗洺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JIAN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾吉永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHI YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王秀慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIU HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊杰凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/132702</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>交聯型聚醯亞胺鋰電池隔膜及其製備方法和應用</chinese-title>
        <english-title>CROSSLINKED POLYIMIDE LITHIUM BATTERY SEPARATOR AND PREPARATION METHOD AND APPLICATION THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了交聯型聚醯亞胺鋰電池隔膜及其製備方法和應用，屬於鋰離子電池材料技術領域。該製備方法包括下述步驟：（1）將摩爾比為1:（0.7-0.95）的二胺類單體與二酸酐類單體加入至溶劑中反應，之後加入促進劑得到含聚醯胺酸的漿料；（2）將漿料塗布於多孔性基板上，之後浸泡於反應液中得到預固化膜，將預固化膜烘乾後即得交聯型聚醯亞胺鋰電池隔膜；反應液包括封端劑和有機溶劑，封端劑選自鄰苯二甲酸酐、4-苯乙炔基苯酐、4-乙炔基苯酐、苯乙炔基偏苯三酸酐、乙炔基雙苯酐及甲基乙炔基苯酐中的至少一種。該製備方法能夠提高隔膜的耐溫性，保證其在350℃以下不熔融且不形變，同時提高隔膜的抗拉強度和穿刺強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a crosslinked polyimide lithium battery separator, its preparation method, and its application, belonging to the technical field of lithium-ion battery materials. The preparation method includes the following steps:(1) A diamine monomer and a dianhydride monomer are added into a solvent at a molar ratio of 1:(0.7–0.95) to react, followed by the addition of a promoter to obtain a slurry containing polyamic acid; (2) The slurry is coated onto a porous substrate and then immersed in a reaction solution to obtain a pre-cured membrane. After drying the pre-cured membrane, a crosslinked polyimide lithium battery separator is obtained. The reaction solution includes a capping agent and an organic solvent, where the capping agent is selected from at least one of phthalic anhydride, 4-phenylethynylphthalic anhydride, 4-ethynylphthalic anhydride, phenylethynyltrimellitic anhydride, ethynyl-substituted dianhydride, and methyl ethynylphthalic anhydride. This preparation method improves the thermal resistance of the separator, ensuring that it does not melt or deform below 350°C, while also enhancing its tensile strength and puncture resistance.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="533px" img-content="tif" inline="yes" orientation="portrait" width="740px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623084</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106489</doc-number>
          <kind></kind>
          <date>114/02/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120250514B">H01M50/414</main-classification>
        <further-classification edition="200601120250514B">B05C9/04</further-classification>
        <further-classification edition="200601120250514B">C08G73/10</further-classification>
        <further-classification edition="200601120250514B">C08J5/18</further-classification>
        <further-classification edition="201001120250514B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商亞安頂材有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMIDEMASTER CO., LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾吉永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHI YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱楗洺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JIAN MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王秀慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIU HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊杰凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/132440</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>卷對卷塗布製備雙面多孔性聚醯亞胺隔膜的方法、雙面多孔性聚醯亞胺隔膜及應用</chinese-title>
        <english-title>ROLL-TO-ROLL COATING METHOD FOR PREPARING DOUBLE-SIDED POROUS POLYIMIDE SEPARATOR, DOUBLE-SIDED POROUS POLYIMIDE SEPARATOR, AND APPLICATION THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了卷對卷塗布製備雙面多孔性聚醯亞胺隔膜的方法、雙面多孔性聚醯亞胺隔膜及應用，屬於電池用聚醯亞胺隔膜技術領域。其製備方法包括步驟：（1）將二胺類單體與二酸酐類單體加入至溶劑中，反應後加入固化促進劑再次反應，降溫後得到聚醯亞胺漿料；（2）向聚醯亞胺漿料中加入低沸點溶劑，攪拌均勻得到塗布料；（3）將塗布料塗布於PET基材上，並進入預加熱區域進行預加熱、預固化後的聚醯亞胺膜自基材表面取下，乾燥後得到雙面多孔性聚醯亞胺隔膜。該方法通過在聚醯亞胺漿料中加入低沸點溶劑和在隔膜預固化之前進行預加熱兩步操作結合，抵抗形變性高、孔隙率高且兩面孔隙率差異性小的雙面多孔性聚醯亞胺隔膜，可提高電解液吸收率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a roll-to-roll coating method for preparing a double-sided porous polyimide separator, as well as the double-sided porous polyimide separator and its application. It belongs to the technical field of polyimide separators for batteries. The preparation method includes the following steps: (1) adding a diamine monomer and a dianhydride monomer into a solvent, followed by a reaction; then adding a curing accelerator for a second reaction, and cooling to obtain a polyimide slurry; (2) adding a low-boiling-point solvent to the polyimide slurry and stirring evenly to obtain a coating material; (3) coating the material onto a PET substrate, then preheating in a preheating zone for pre-curing; the pre-cured polyimide film is then peeled off from the substrate surface and dried to obtain the double-sided porous polyimide separator. This method combines the addition of a low-boiling-point solvent into the polyimide slurry and a preheating step before pre-curing the separator, resulting in a double-sided porous polyimide separator with high deformation resistance, high porosity, and minimal porosity difference between both sides, thereby enhancing the electrolyte absorption rate.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="559px" img-content="tif" inline="yes" orientation="portrait" width="667px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622790</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114106569</doc-number>
          <kind></kind>
          <date>114/02/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250703B">G06F30/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商賽爾迪克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSP XR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金會埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HOI JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴贊洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, CHAN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜辰奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JIN KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0165097</doc-number>
          <date>20241119</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2025-0001413</doc-number>
          <date>20250106</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於城市洪水模擬的設備、方法、及電腦程式產品</chinese-title>
        <english-title>APPARATUS, METHOD, AND COMPUTER PROGRAM PRODUCT FOR URBAN FLOOD SIMULATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於即時基於網頁的城市洪水模擬的設備及方法。根據本揭露的用於城市洪水模擬的設備包括硬體處理器及儲存單元，該儲存單元連接至該處理器以儲存城市的數位高程模型、城市設計資訊及降水資訊、以及用以執行用於城市洪水模擬的該方法的至少一個電腦程式。用於城市洪水模擬的該方法包括（a）使用該城市的該數位高程模型及該城市設計資訊生成模擬區域資訊及水流資訊，（b）使用該模擬區域資訊、該水流資訊及該降水資訊生成洪水相關資訊，以及（c）可視化及顯示該洪水相關資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure discloses an apparatus and method for real-time web-based urban flood simulation. An apparatus for urban flood simulation according to the present disclosure includes a hardware processor and a storage unit connected to the processor to store a digital elevation model of a city, city design information and precipitation information, and at least one computer program configured to perform the method for urban flood simulation. The method for urban flood simulation includes (a) generating simulation zone information and water flow information using the digital elevation model of the city and the city design information, (b) generating flood-related information using the simulation zone information, the water flow information, and the precipitation information, and (c) visualizing and displaying the flood-related information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:用於城市洪水模擬的設備</p>
        <p type="p">11:儲存單元</p>
        <p type="p">12:模擬設定單元</p>
        <p type="p">13:洪水資訊生成單元</p>
        <p type="p">14:模擬輸出單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10090.JPG" file="ed10090.JPG" height="746px" img-content="tif" inline="yes" orientation="portrait" width="654px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621937</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107043</doc-number>
          <kind></kind>
          <date>114/02/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250314B">B62L1/02</main-classification>
        <further-classification edition="200601120250314B">F16L37/10</further-classification>
        <further-classification edition="200601120250314B">F16D65/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商蘭溪市捷克運動器材製造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANXI JIEKE SPORTS APPARATUS MANUFACTURING CO.,LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余志軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, ZHIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嗣斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SIBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024119284121</doc-number>
          <date>20241225</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024116839886</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>油管快接結構和油壓碟刹系統</chinese-title>
        <english-title>AN OIL PIPE QUICK CONNECTION STRUCTURE AND AN OIL PRESSURE DISC BRAKE SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種油管快接結構和油壓碟刹系統。該油管快接結構包括有一內部中通的第一油管、一連接件和一轉接件，連接件和轉接件均內部貫通有油路，連接件與轉接件卡接限位以貫通油路；連接件至少包括有第一插接部，以及佈置於第一插接部側壁上的卡點部；轉接件至少包括有：主體部，其內部貫通，且其軸向中部開設有依次排列並相貫通的第一容置腔、第二容置腔和第三容置腔；卡口部，其開設於第一容置腔的側壁面並連通至第二容置腔，以容納卡點部自卡口部穿過並在第二容置腔內旋轉定位；鎖扣件，其固定裝配於主體部的外壁上，且其上設有一延伸入第二容置腔內以限位卡點部旋轉角度的扣頭部。本發明便於油管與泵體之間的便捷裝配固定，油路暢通且不漏油，極大地方便了油管在油壓碟刹系統內的快速裝配。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an oil pipe quick connection structure and an oil pressure disc brake system. The oil pipe quick connection structure includes a first oil pipe with a centrally hollow interior, a connector, and an adaptor. An oil circuit is connected in each of the connector and the adaptor, and the connector and the adaptor are limited in a clamping manner to make the oil circuits connected. The connector includes at least a first socket portion and a snap portion that is arranged on a side wall of the first socket portion. The adaptor includes at least: a main body, which is internally connected, and axially centered with a first accommodation chamber, a second accommodation chamber, and a third accommodation chamber that are arranged in sequence and connected to each other; a bayonet portion, which is defined to a side wall of the first accommodation chamber and is communicated to the second accommodation chamber, so as to accommodate the snap portion to pass through the bayonet portion and rotate inside the second accommodation chamber for positioning; and a locking fastener, which is fixedly assembled to an outer wall of the main body and is provided with a buckle portion that extends into the second accommodation chamber to limit a rotational angle of the snap portion. By means of the present invention, the assembly and fixation between oil pipes and a pump body are convenient with smooth oil circuits and no oil leakage, which greatly facilitates the rapid assembly of oil pipes in the oil pressure disc brake system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:連接件</p>
        <p type="p">20:轉接件</p>
        <p type="p">206:活接套</p>
        <p type="p">30:第一油管</p>
        <p type="p">40:油管套管</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="762px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623071</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107051</doc-number>
          <kind></kind>
          <date>114/02/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250902B">H01M4/62</main-classification>
        <further-classification edition="201001120250902B">H01M4/1315</further-classification>
        <further-classification edition="201001120250902B">H01M4/133</further-classification>
        <further-classification edition="201001120250902B">H01M4/139</further-classification>
        <further-classification edition="201001120250902B">H01M10/058</further-classification>
        <further-classification edition="200601120250902B">H01M10/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＢＥＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEI CORP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹泳晋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, YOUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金明俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MYUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵昌得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, CHANGDEUCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175022</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鋰二次電池及其製造方法</chinese-title>
        <english-title>LITHIUM SECONDARY BATTERY AND METHOD OF MANUFACTURING SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種鋰二次電池及其製造方法，該電池在陽極集電器和陰極集電器之間設置有隔板和陰極板，並在陽極集電器和陰極板之間提供電解質，其中，陰極板是由陰極活性材料粉末壓製而成，且陰極板上塗覆有由含鋰化合物形成的犧牲材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a lithium secondary battery configured such that a separator and a cathode plate are disposed between an anode current collector and a cathode current collector and an electrolyte is provided between the anode current collector and the cathode plate, in which the cathode plate is formed by pressing a cathode active material powder, and the cathode plate is coated with a sacrificial material formed of a compound containing lithium, and a method of manufacturing the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:陽極集電器</p>
        <p type="p">20:陰極集電器</p>
        <p type="p">30:陰極活性材料</p>
        <p type="p">35:黏合劑材料</p>
        <p type="p">40:犧牲材</p>
        <p type="p">50:隔板</p>
        <p type="p">60:陽極層</p>
        <p type="p">C:孔洞</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="404px" img-content="tif" inline="yes" orientation="portrait" width="679px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621823</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107058</doc-number>
          <kind></kind>
          <date>114/02/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">B23K3/06</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道騰翰　強納生Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAUTENHAHN, JONATHAN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾沃　格雷戈里Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CALVO, GREGORY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡士特　格雷戈里李奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUESTE, GREGORY LEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希伯　傑克森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHIEBER, JACKSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/588,348</doc-number>
          <date>20240227</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於組合式波焊流動設計的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR COMBINED WAVE SOLDERING FLOW DESIGN</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">波焊站包括具有焊錫材料之儲器的焊錫罐、定位在該焊錫罐之儲器中的流動導管、及耦接至該流動導管的波焊噴嘴組合件。該波焊噴嘴組合件具有用以產生焊錫波的焊錫分配擋板、耦接至該流動導管並用以在賦能焊錫完全流動穿過該焊錫分配擋板的打開位置與抑制焊錫之一部分流動穿過該焊錫分配擋板的關閉位置之間移動的節流門、及耦接至該流動導管並用以在賦能增加的焊錫流動的降低位置與減少焊錫流動的升高位置之間移動的出口翼。控制器用以控制該節流門及該出口翼的移動，以控制焊錫流動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave, a throttle gate coupled to the flow duct and configured to move from an open position to enable complete flow of solder through the solder distribution baffle and a closed position to inhibit a portion of flow of solder through the solder distribution baffle, and an exit wing coupled to the flow duct and configured to move from a lowered position to enable increased solder flow and a raised position to decrease solder flow. A controller is configured to control the movement of the throttle gate and the exit wing to control the flow of solder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">24:波焊站</p>
        <p type="p">30:焊錫罐</p>
        <p type="p">32:儲器</p>
        <p type="p">34:流動導管</p>
        <p type="p">36:波焊噴嘴組合件</p>
        <p type="p">38:泵葉輪</p>
        <p type="p">40:末端壁</p>
        <p type="p">44:第一縱向側壁</p>
        <p type="p">46:第二縱向側壁</p>
        <p type="p">48:交叉支撐元件</p>
        <p type="p">50:出口翼</p>
        <p type="p">52:鉸鏈</p>
        <p type="p">54:致動器</p>
        <p type="p">56:致動器臂</p>
        <p type="p">58:致動器支撐框架</p>
        <p type="p">60:致動器塊</p>
        <p type="p">62:連接桿</p>
        <p type="p">64:旋轉桿</p>
        <p type="p">66:橫桿</p>
        <p type="p">68:背閘</p>
        <p type="p">72:節流門</p>
        <p type="p">78:鉸鏈銷</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="711px" img-content="tif" inline="yes" orientation="portrait" width="872px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622703</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107141</doc-number>
          <kind></kind>
          <date>114/02/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250602B">G06F3/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117532998</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>擴展現實作業系統及方法</chinese-title>
        <english-title>EXTENDED REALITY OPERATING SYSTEM AND METHODS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種擴展現實作業系統及方法，擴展現實作業系統包括擴展現實設備以及移動終端；所述移動終端回應於預設程式啟動後，與所述擴展現實設備建立通信連接；所述擴展現實設備回應於確認開啟IMU功能，傳輸IMU開啟指令至所述移動終端；所述移動終端回應於所述IMU開啟指令，即時獲取IMU資料並傳輸至所述擴展現實設備；所述擴展現實設備接收所述IMU資料，根據所述IMU資料顯示並控制游標之移動。本申請可提高擴展現實作業系統之交互速度，以及提高擴展現實設備中對於游標操作之準確度，從而改善使用者對於擴展現實設備之操作體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A extended reality operating system and methods. extended reality operating system includes: Extended reality devices and mobile terminals; The mobile terminal establishes a communication connection with the extended reality device in response to the start of a preset program; the extended reality device transmits an IMU opening instruction to the mobile terminal in response to confirming the opening of the IMU function; the mobile terminal acquires IMU data in real time in response to the IMU opening instruction and transmits it to the extended reality device; the extended reality device receives the IMU data, displays and controls the movement of the cursor according to the IMU data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:擴展現實作業系統</p>
        <p type="p">110:擴展現實設備</p>
        <p type="p">120:移動終端</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="715px" img-content="tif" inline="yes" orientation="portrait" width="678px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623445</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107149</doc-number>
          <kind></kind>
          <date>114/02/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/83</main-classification>
        <further-classification edition="202501120260302B">H10D30/67</further-classification>
        <further-classification edition="202501120260302B">H10D64/23</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEONGKWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃東勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DONGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珉優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文炳鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, BYUNGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元暢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WONCHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全在鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, JAEHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珍我</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賢洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUNSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0102670</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體裝置，其包括：一下源極/汲極圖案；一下通道結構，其連接至該下源極/汲極圖案；一下閘極電極，其與該下通道結構重疊且在一第一方向上延伸；一下主動接點，其在該下源極/汲極圖案上；一上通道結構，其與該下通道結構重疊；一上源極/汲極圖案，其連接至該上通道結構；一上閘極電極，其與該上通道結構重疊且在該第一方向上延伸；一層間結構，其在該下通道結構與該上通道結構之間；以及一貫通主動接點，其延伸通過該層間結構，且電氣連接至該上源極/汲極圖案及該下主動接點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a semiconductor device including a lower source/drain pattern, a lower channel structure connected to the lower source/drain pattern, a lower gate electrode overlapping the lower channel structure and extending in a first direction, a lower active contact on the lower source/drain pattern, an upper channel structure overlapping the lower channel structure, an upper source/drain pattern connected to the upper channel structure, an upper gate electrode overlapping the upper channel structure and extending in the first direction, an interlayer structure between the lower channel structure and the upper channel structure, and a through active contact extending through the interlayer structure, and electrically connected to the upper source/drain pattern and the lower active contact.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基體</p>
        <p type="p">20:遮罩層</p>
        <p type="p">20_L:下表面</p>
        <p type="p">31:閘極傳導部分</p>
        <p type="p">41:主動傳導部分</p>
        <p type="p">42:主動通孔部分</p>
        <p type="p">50:層間結構</p>
        <p type="p">51:第一層間絕緣層</p>
        <p type="p">52:第二層間絕緣層</p>
        <p type="p">53:半導體層</p>
        <p type="p">61:上絕緣層</p>
        <p type="p">62:接點</p>
        <p type="p">A-A':線</p>
        <p type="p">AC1:下主動接點、第一下主動接點</p>
        <p type="p">AC2:下主動接點、第二下主動接點</p>
        <p type="p">AC3:上主動接點</p>
        <p type="p">AP:作用圖案</p>
        <p type="p">CH1:下通道結構</p>
        <p type="p">CH2:上通道結構</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">E2:區</p>
        <p type="p">GE1,GE2:下閘極電極</p>
        <p type="p">GE3:上閘極電極</p>
        <p type="p">GI1:下閘極絕緣層</p>
        <p type="p">GI2:上閘極絕緣層</p>
        <p type="p">GS1:下閘極間隔件</p>
        <p type="p">GS2:上閘極間隔件</p>
        <p type="p">SD1:下源極/汲極圖案</p>
        <p type="p">SD2:上源極/汲極圖案</p>
        <p type="p">SP1:下半導體圖案</p>
        <p type="p">SP2:上半導體圖案</p>
        <p type="p">TC:貫通主動接點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="692px" img-content="tif" inline="yes" orientation="portrait" width="972px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623573</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107463</doc-number>
          <kind></kind>
          <date>114/02/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="202601120260302B">H10P72/76</further-classification>
        <further-classification edition="200601120260302B">G03F7/36</further-classification>
        <further-classification edition="200601120260302B">G03F7/38</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>阮　清軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, THANH XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　科林　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, COLIN F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃祖濱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞歷山大　洛根　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALEXANDER, LOGAN PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯拿　維拉杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINHA, VIRAAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔克　傑里米　托德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUCKER, JEREMY TODD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒吉爾　康納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE GEAR, CONOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
              <english-address>IE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁爾斯　麥可　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYERS, MICHAEL THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施洛斯　勞倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHLOSS, LAWRENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>保爾斯　史蒂芬　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOWES, STEVE WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱門　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAM, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江寶迪尼　思魯提　江拿巴沙瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAMBALDINNI, SHRUTI CHANNABASAVA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海德　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAIDER, ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董勇良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, YONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>ＫＣ　尚布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KC, SHAMBHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
              <english-address>NP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛洛斯基　博里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOLOSSKIY, BORIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迷思拉　謝卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISHRA, SHEKHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/558,507</doc-number>
          <date>20240227</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/572,014</doc-number>
          <date>20240329</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/739,405</doc-number>
          <date>20241227</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>極紫外光阻的曝光後烘烤和乾式顯影用的設備及方法</chinese-title>
        <english-title>EQUIPMENT AND METHOD FOR POST-EXPOSURE BAKE AND DRY DEVELOPMENT OF EXTREME ULTRAVIOLET PHOTORESISTS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">極紫外光(EUV)光刻技術的背景揭露了用於提高晶圓間和晶圓內均勻性的系統和技術。藉由在不破壞真空條件下，在EUV曝光的晶圓上執行曝光後烘烤操作和乾式顯影操作，改善了晶圓間均勻性和晶圓內均勻性。在曝光後烘烤和乾式顯影製程之間，執行使晶圓暴露於受控的擬大氣環境的冷卻和處理操作，係可恢復因在不破壞真空條件下於EUV曝光的晶圓上執行曝光後烘烤操作和乾式顯影操作而可能損失的劑量對尺寸關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and techniques for enhancing wafer-to-wafer and in-wafer uniformity in the context of extreme ultraviolet (EUV) lithography are disclosed. By performing post-exposure bake operations and dry-development operations on an EUV-exposed wafer without breaking vacuum, wafer-to-wafer uniformity and in-wafer uniformity are improved. Performing a cooling and treatment operation in between the post-exposure bake and the dry-development process and in which the wafer is exposed to a controlled pseudo-atmospheric environment may recover dose-to-size that may be lost by performing the post-exposure bake operations and dry-development operations on the EUV-exposed wafer without breaking vacuum.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:冷卻和處理腔室</p>
        <p type="p">201a、201b:晶圓</p>
        <p type="p">202:傳送腔室</p>
        <p type="p">204:乾式顯影腔室</p>
        <p type="p">210:晶圓搬運機器人</p>
        <p type="p">211a、211b:晶圓支撐件</p>
        <p type="p">212a、212b:儲存槽</p>
        <p type="p">214a、214b:溫度控制系統</p>
        <p type="p">216a、216b:冷卻劑控制閥</p>
        <p type="p">220a、220b:噴淋頭</p>
        <p type="p">224a、224b:頂升銷</p>
        <p type="p">226:間縫閥</p>
        <p type="p">228:非反應性載氣源</p>
        <p type="p">230:氧氣源</p>
        <p type="p">231:二氧化碳源</p>
        <p type="p">232:水蒸汽源</p>
        <p type="p">234a~234e:噴淋頭控制閥</p>
        <p type="p">234f:閥</p>
        <p type="p">235a、235b:泵浦</p>
        <p type="p">236:晶圓支撐件</p>
        <p type="p">237:處理氣體源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.png" file="d10025.TIF" giffile="ed10025.png" height="692px" img-content="tif" inline="yes" orientation="portrait" width="966px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622447</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107801</doc-number>
          <kind></kind>
          <date>114/03/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">F41B4/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐西蘭商全球力量ＩＰ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALFORCE IP LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
              <english-address>NZ</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達夫　威廉　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUFF, WILLIAM MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
              <english-address>NZ</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝茨　理查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BETTS, RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
              <english-address>NZ</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/560,933</doc-number>
          <date>20240304</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>飛鏢、飛鏢發射器及飛鏢製造方法</chinese-title>
        <english-title>DART, DART LAUNCHER AND METHOD OF MANUFACTURING DART</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">飛鏢2，用於飛鏢射擊器，該飛鏢包含一主體4，其中該主體包含：一直徑與長度之比為1:1.5至1:6，一質心距離≤長度/2，一直徑為10至30毫米，以及一轉動慣量≥1x10^-5公斤米平方/秒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dart 2 for use with a dart blaster, the dart comprising a body 4, wherein the body comprises: a diameter to length ratio of 1:1.5 to 1:6, a center of mass distance ≤ length/2, a diameter of 10 to 30 mm and a rotational inertia ≥ 1x10^-5 kgm^2/s.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:飛鏢</p>
        <p type="p">4:主體</p>
        <p type="p">6:中空內部</p>
        <p type="p">8:近端</p>
        <p type="p">10:遠端</p>
        <p type="p">12:凹槽</p>
        <p type="p">14:外壁組件</p>
        <p type="p">16:內壁組件</p>
        <p type="p">18:唇部</p>
        <p type="p">a:飛鏢的長度</p>
        <p type="p">b:飛鏢的前緣厚度</p>
        <p type="p">c:飛鏢的直徑</p>
        <p type="p">d:質心(COM)距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="520px" img-content="tif" inline="yes" orientation="portrait" width="625px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623333</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114107981</doc-number>
          <kind></kind>
          <date>114/03/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250423B">H05K5/02</main-classification>
        <further-classification edition="200601120250423B">H05K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣達電腦股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTA COMPUTER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>叢耀宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSORNG, YAW-TZORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳東憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TUNG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倪祥圃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NI, HSIANG-PU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張燿麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YAO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/953,723</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>手柄組件以及連桿模組</chinese-title>
        <english-title>HANDLE ASSEMBLY AND CONNECTING ROD MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種手柄組件、一種包含手柄組件的連桿以及一種用於從包含手柄組件的外殼中撤回物體的方法。手柄組件包含手柄機構。手柄機構包含手柄板和從手柄板的相對側延伸的手柄臂。每個手柄臂包含手柄臂孔和手柄臂開槽。手柄機構進一步包含至少部分地延伸穿過手柄板的閂鎖，以及一對在其相對端與閂鎖接合的滑件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A handle assembly, a connecting rod including a handle assembly, and a method for allowing withdrawal of an object from an enclosure including a handle assembly are disclosed. The handle assembly includes a handle mechanism. The handle mechanism includes a handle plate and handle arms extending from opposite sides of the handle plate. Each of the handle arms includes a handle arm aperture and a handle arm slot. The handle mechanism further includes a latch extending at least partially across the handle plate, and a pair of sliders engaged with the latch at opposite ends thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:手柄組件</p>
        <p type="p">202:手柄機構</p>
        <p type="p">204:閂鎖</p>
        <p type="p">206:滑件</p>
        <p type="p">208:托架</p>
        <p type="p">210:彈簧</p>
        <p type="p">212:手柄板</p>
        <p type="p">214:手柄臂</p>
        <p type="p">216,220:孔</p>
        <p type="p">218:開槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="929px" img-content="tif" inline="yes" orientation="portrait" width="775px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621878</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108185</doc-number>
          <kind></kind>
          <date>114/03/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250312B">B26B19/48</main-classification>
        <further-classification edition="200601120250312B">B26B19/14</further-classification>
        <further-classification edition="200601120250312B">B26B19/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商湖州立訊精密工業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUZHOU LUXSHARE PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉光興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, GUANGXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116967507</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多功能護理裝置</chinese-title>
        <english-title>MULTIFUNCTIONAL SKIN CARE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種多功能護理裝置，包括控制模組、驅動模組和多個護理模組。任一護理模組均能夠可拆卸地連接於驅動模組，至少一個護理模組包括第一護理元件，任一護理模組包括第二護理元件。第一護理元件用於剃除毛髮或按摩肌膚，第二護理元件用於發出護理肌膚的光照。第一護理元件連接有傳動組件，傳動組件用於與驅動模組的驅動馬達傳動連接；第二護理元件連接有第一導電元件，第一導電元件用於與驅動模組的第一連接端子連接。控制模組控制第一連接端子與第二護理元件電導通，並根據第二護理元件輸出的電信號識別不同護理模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to a multifunctional skin care device including a control module, a driving module and a plurality of skin care modules. Any one skin care module can be detachably connected to the driving module, at least one skin care module includes a first skin care component, and any one skin care module includes a second skin care component. The first skin care component is configured to shave or massage the skin, and the second skin care component is configured to emit a beam which can perform skin care. The first skin care component is connected to a propelling assembly configured to be mechanically connected to the driving motor of the driving module; the second skin care component is connected to a first conductive component configured to be connected to the first connection terminal. The control module can control the conduction of the first conductive component and the second skin care component, and can distinguish different skin care modules mounted on the driving module according to the electrical signals output by the second skin care component. Hence, the multifunctional skin care device of the present disclosure can be multipurpose and satisfy the use requirements of different scenes, and it is convenient for the user to use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:多功能護理裝置</p>
        <p type="p">100:機身</p>
        <p type="p">101:第一控制按鍵</p>
        <p type="p">102:第二控制按鍵</p>
        <p type="p">103:第三控制按鍵</p>
        <p type="p">400:護理模組</p>
        <p type="p">401:第一護理元件</p>
        <p type="p">402:第二護理元件</p>
        <p type="p">403:第三護理元件</p>
        <p type="p">410:第一護理模組</p>
        <p type="p">420:第二護理模組</p>
        <p type="p">430:第三護理模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="523px" img-content="tif" inline="yes" orientation="portrait" width="713px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623298</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108208</doc-number>
          <kind></kind>
          <date>114/03/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250901B">H04W76/15</main-classification>
        <further-classification edition="201801120250901B">H04W76/25</further-classification>
        <further-classification edition="200901120250901B">H04W40/12</further-classification>
        <further-classification edition="202301120250901B">H04W28/08</further-classification>
        <further-classification edition="200901120250901B">H04W88/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中光電智能機器人股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETRONIC INTELLIGENT ROBOTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃獻毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HSIEN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾國聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, KUO-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張愷宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, KAI-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何繼勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, JIH-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹凱仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KAI-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,907</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>無人裝置的通訊系統和通訊方法</chinese-title>
        <english-title>COMMUNICATION SYSTEM AND COMMUNICATION METHOD OF UNMANNED DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種無人裝置的通訊系統和通訊方法。通訊方法包含：將控制器通訊連接至無人裝置；由控制器分別傳送控制器指令至第一鏈路以及第二鏈路，以分別通過第一鏈路和第二鏈路傳送包含控制器指令的第一封包和第二封包至無人裝置；由無人裝置從第一封包和第二封包中選出受選封包，並且從受選封包取得控制器指令；以及由無人裝置從第一鏈路和第二鏈路中選出受選鏈路，並且通過受選鏈路傳送資料給控制器。本發明提出的無人裝置的通訊系統和通訊方法，可透過多鏈路傳送指令以操作無人裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication system and a communication method of unmanned device are provided. The communication method includes: communicatively connecting a controller to an unmanned device; transmitting, by the controller, a controller command to a first link and a second link respectively to transmit a first packet and a second packet including the controller command to the unmanned device through the first link and the second link respectively; selecting a selected packet from the first packet and the second packet and obtaining the controller command from the selected packet by the unmanned device; and selecting a selected link from the first link and the second link and transmitting data to the controller through the selected link by the unmanned device. The communication system and the communication method of the present invention may operate the unmanned device by transmitting commands through multi-links.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S601,S602,S603,S604:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="775px" img-content="tif" inline="yes" orientation="portrait" width="622px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623205</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108316</doc-number>
          <kind></kind>
          <date>114/03/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250620B">H03K5/156</main-classification>
        <further-classification edition="200601120250620B">H03K5/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/959,454</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>工作週期校正裝置及其工作週期校正方法</chinese-title>
        <english-title>DUTY CYCLE CORRECTION DEVICE AND DUTY CYCLE CORRECTION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種工作週期校正裝置及其工作週期校正方法。工作週期調整電路調整輸入時脈信號的工作週期，以輸出輸出時脈信號。積分器電路依據輸出時脈信號產生積分信號。校正控制電路依據積分信號的邏輯準位變化周期性地控制工作週期調整電路調整工作週期的調整量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A duty cycle correction device and a duty cycle correction method thereof are provided. A duty cycle adjustment circuit adjusts a duty cycle of an input clock signal to output an output clock signal. An integrator circuit generates an integral signal according to the output clock signal. A correction control circuit periodically controls the duty cycle adjustment circuit to adjust an adjustment amount of the duty cycle according to changes in a logic level of the integrated signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工作週期校正裝置</p>
        <p type="p">102:工作週期調整電路</p>
        <p type="p">104:積分器電路</p>
        <p type="p">106:校正控制電路</p>
        <p type="p">CLK1:輸入時脈信號</p>
        <p type="p">CLK2:輸出時脈信號</p>
        <p type="p">S1:積分信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="562px" img-content="tif" inline="yes" orientation="portrait" width="721px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621831</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108481</doc-number>
          <kind></kind>
          <date>114/03/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251222B">B23K26/16</main-classification>
        <further-classification edition="200601120251222B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鷗爾熙製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORC MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船山昌彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAYAMA, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水修一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, SHUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大原英治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOHARA, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-204718</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>集塵裝置以及雷射加工裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的是在包括有集塵裝置的雷射加工裝置中，將可有效地去除碎屑的氣流製造於集塵室內。其解決手段為一種雷射加工裝置100，在投影光學系統30與基板W(加工平台50)之間包括有集塵裝置80。集塵裝置80係，包括集塵室81，且將插入進氣噴嘴60、排氣管道70的插入口，作為第一通氣口82、第二通氣口84，形成於與框體81C相向的位置。第一通氣口82與進氣噴嘴60之間，設有在加工中可吸入外氣的空間區域GA，在第二通氣口84與排氣管道70之間，設有在加工中可吸入外氣的空間區域GB。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">15:支撐體</p>
        <p type="p">30:投影光學系統</p>
        <p type="p">30S:鏡筒基座部</p>
        <p type="p">32:光學零件</p>
        <p type="p">50:加工平台</p>
        <p type="p">60:進氣噴嘴</p>
        <p type="p">60T:頂端部</p>
        <p type="p">62:支撐構件</p>
        <p type="p">70:排氣管道</p>
        <p type="p">70T:頂端部</p>
        <p type="p">72:支撐構件</p>
        <p type="p">80:集塵裝置</p>
        <p type="p">81:框體</p>
        <p type="p">81C:框體</p>
        <p type="p">82:第一通氣口</p>
        <p type="p">82B:下方邊緣</p>
        <p type="p">82T:上方邊緣</p>
        <p type="p">84:第二通氣口</p>
        <p type="p">84B:下方邊緣</p>
        <p type="p">84T:上方邊緣</p>
        <p type="p">88:保持部</p>
        <p type="p">90:外氣導入口</p>
        <p type="p">100:雷射加工裝置</p>
        <p type="p">110:氣體供給裝置</p>
        <p type="p">120:排氣裝置</p>
        <p type="p">GA,GA1,GA2,GB,GB1,GB2:空間區域</p>
        <p type="p">S:處理空間</p>
        <p type="p">SR:掃描範圍</p>
        <p type="p">T:區間</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="685px" img-content="tif" inline="yes" orientation="portrait" width="990px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621969</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108572</doc-number>
          <kind></kind>
          <date>114/03/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250331B">B65G47/90</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立芯精密智造（昆山）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXIS PRECISION INTELLIGENT MANUFACTURING (KUNSHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢向陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BI, XIANGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡宗輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, ZONGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張賢祝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIANZHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘小波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAN, XIAOBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何良宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, LIANGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116974093</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>夾取機構、自動上料裝置及自動上料方法</chinese-title>
        <english-title>GRIPPING MECHANISM, AUTOMATIC FEEDING DEVICE AND METHOD FOR AUTOMATIC FEEDING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種夾取機構、自動上料裝置及自動上料方法，該夾取機構包括升降模組、移送模組和夾持模組，升降模組包括相傳動連接的升降平臺和升降驅動件，移送模組包括相傳動連接的移送驅動件和移送支架，移送支架可滑動設置在升降平臺上，夾持模組設在移送支架上，夾持模組包括定位件和多個夾持件，多個夾持件分設在定位件的兩側，定位件供待夾取件抵接定位，夾持件夾持待夾取件，提高生產效率。定位件對待夾取件的夾取位置進行定位，便於夾持件對待夾取件準確夾取和輸送。夾持模組對待夾取件的施力均勻且穩定，減小與待夾取件的相對移位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a gripping mechanism, an automatic feeding device and a method for automatic feeding. The gripping mechanism includes an elevating module, a transfer module and a gripping module. The elevating module includes an elevating platform and an elevating driving element. The elevating platform is in transmission connection with the elevating driving element. The transfer module includes a transfer driving element and a transfer support. The transfer driving element is in transmission connection with the transfer support. The transfer support is slidably disposed on the elevating platform. The gripping module is disposed on the transfer support. The gripping module includes a locating element and a plurality of gripping elements. The plurality of gripping elements are disposed on both sides of the locating element. The locating element is used for the element to be gripped to abut and locate. The gripping element grips the element to be gripped to improve production efficiency. The locating element locates the gripping position of the element to be gripped, so the gripping element accurately grips and transfers the element to be gripped. The gripping module applies uniform and stable force to the element to be gripped to reduce the relative displacement with the element to be gripped.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:升降模組</p>
        <p type="p">2:移送模組</p>
        <p type="p">3:夾持模組</p>
        <p type="p">4:輸送模組</p>
        <p type="p">5:待夾取件</p>
        <p type="p">51:凸出部</p>
        <p type="p">6:機架</p>
        <p type="p">7:工作緩存機構</p>
        <p type="p">71:第一料框</p>
        <p type="p">711:第一存放槽</p>
        <p type="p">8:輸出機構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="762px" img-content="tif" inline="yes" orientation="portrait" width="719px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623660</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108970</doc-number>
          <kind></kind>
          <date>114/03/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/60</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10W40/22</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文炅燉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUN, KYUNG DON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金知晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI HWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白相眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, SANGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0104371</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝可包括：第一再分佈基體；第一半導體晶片及第二半導體晶片，安裝於第一再分佈基體上且彼此水平地間隔開；第一模製層，設置成包圍第一及第二半導體晶片且暴露第一及第二半導體晶片之底表面；橋接晶片，安裝於第一及第二半導體晶片之底表面上；第二模製層，設置於第一再分佈基體上以嵌入第一及第二半導體晶片、第一模製層以及橋接晶片；第二再分佈基體，安置於第二模製層上；上部封裝，安裝於第二再分佈基體上；及垂直連接結構，鄰近於第一模製層設置以將第一及第二再分佈基體彼此連接。第一再分佈基體可具有設置於第一再分佈基體之頂表面中的凹部，且橋接晶片可安置於凹部中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package may include a first redistribution substrate, a first semiconductor chip and a second semiconductor chip, which are mounted on the first redistribution substrate and are horizontally spaced apart from each other, a first mold layer provided to surround the first and second semiconductor chips and expose bottom surfaces of the first and second semiconductor chips, a bridge chip mounted on the bottom surfaces of the first and second semiconductor chips, a second mold layer provided on the first redistribution substrate to embed the first and second semiconductor chips, the first mold layer, and the bridge chip, a second redistribution substrate disposed on the second mold layer, an upper package mounted on the second redistribution substrate, and a vertical connection structure provided adjacent to the first mold layer to connect the first and second redistribution substrates to each other. The first redistribution substrate may have a recess provided in a top surface of the first redistribution substrate, and the bridge chip may be disposed in the recess.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一再分佈基體</p>
        <p type="p">110:第一基體絕緣圖案</p>
        <p type="p">120:第一基體互連圖案</p>
        <p type="p">122:第一基體襯墊</p>
        <p type="p">124:第二基體襯墊</p>
        <p type="p">126:第三基體襯墊</p>
        <p type="p">130:外部襯墊</p>
        <p type="p">140:基體保護層</p>
        <p type="p">150:外部端子</p>
        <p type="p">162:第三內部端子</p>
        <p type="p">164:第四內部端子</p>
        <p type="p">200:模組結構</p>
        <p type="p">210:第一半導體晶片</p>
        <p type="p">211:第一黏著層</p>
        <p type="p">212:第一基礎層</p>
        <p type="p">214:第一晶片互連層</p>
        <p type="p">216a:第一晶片襯墊</p>
        <p type="p">216b:第二晶片襯墊</p>
        <p type="p">218:第一內部端子</p>
        <p type="p">220:第二半導體晶片</p>
        <p type="p">221:第二黏著層</p>
        <p type="p">222:第二基礎層</p>
        <p type="p">226a:第三晶片襯墊</p>
        <p type="p">226b:第四晶片襯墊</p>
        <p type="p">228:第二內部端子</p>
        <p type="p">230:第一模製層</p>
        <p type="p">240:橋接晶片</p>
        <p type="p">242:橋接基礎層</p>
        <p type="p">244:橋接互連層</p>
        <p type="p">246:第一橋接襯墊</p>
        <p type="p">248:第二橋接襯墊</p>
        <p type="p">250:底部填充層</p>
        <p type="p">300:導電柱</p>
        <p type="p">350:第二模製層</p>
        <p type="p">400:第二再分佈基體</p>
        <p type="p">410:第二基體絕緣圖案</p>
        <p type="p">420:第二基體互連圖案</p>
        <p type="p">600:被動裝置晶片</p>
        <p type="p">602:被動裝置襯墊</p>
        <p type="p">604:被動裝置連接端子</p>
        <p type="p">700:上部封裝</p>
        <p type="p">710:上部封裝基體</p>
        <p type="p">712:上部基體襯墊</p>
        <p type="p">714:中間連接端子</p>
        <p type="p">720:上部封裝晶片</p>
        <p type="p">722:上部連接端子</p>
        <p type="p">730:上部模製層</p>
        <p type="p">800:熱耗散構件</p>
        <p type="p">802:黏著膜</p>
        <p type="p">RS:凹陷區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="628px" img-content="tif" inline="yes" orientation="portrait" width="983px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623182</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114108972</doc-number>
          <kind></kind>
          <date>114/03/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120250711B">H02P29/60</main-classification>
        <further-classification edition="202001120250711B">G01R31/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立錡科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHTEK TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊大勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TA-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林奕圻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, I-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏道炎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, TAO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳明正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, MING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,595</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/048,866</doc-number>
          <date>20250208</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>偵測馬達異常的方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR DETECTION OF ABNORMALITIES IN MOTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於偵測馬達異常的方法，其包括由微控制器產生正交電流，使用低通濾波器基於該正交電流計算平均電流，由該微控制器產生漣波電流，比較該漣波電流與該平均電流，判定在設定時段內該漣波電流是否偏離該平均電流超過預定閾值，當該漣波電流在該設定時段內偏離該平均電流超過該預定閾值時，觸發警報訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for detecting abnormalities of a motor includes generating, by a microcontroller, a quadrature current, calculating, using a low-pass filter, an average current based on the quadrature current, generating, by the microcontroller, a ripple current, comparing the ripple current with the average current, determining whether the ripple current deviates from the average current by more than a predetermined threshold for a specified duration, and triggering an alert signal when the ripple current deviates from the average current by more than the predetermined threshold for the specified duration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:馬達控制系統</p>
        <p type="p">10:馬達</p>
        <p type="p">20:逆變器</p>
        <p type="p">100:微控制器</p>
        <p type="p">102:第一電阻</p>
        <p type="p">103:第二電阻</p>
        <p type="p">110:記憶體</p>
        <p type="p">120:第一減法器</p>
        <p type="p">125:第一比例積分控制器</p>
        <p type="p">130:第二減法器</p>
        <p type="p">140:克拉克轉換模組</p>
        <p type="p">145:第二比例積分控制器</p>
        <p type="p">150:帕克轉換模組</p>
        <p type="p">155:低通濾波器</p>
        <p type="p">160:位置及速率估計器</p>
        <p type="p">170:空間向量脈寬調變模組</p>
        <p type="p">I&lt;sub&gt;A&lt;/sub&gt;,I&lt;sub&gt;B&lt;/sub&gt;,I&lt;sub&gt;C&lt;/sub&gt;:相電流</p>
        <p type="p">I&lt;sub&gt;α&lt;/sub&gt;,I&lt;sub&gt;β&lt;/sub&gt;:定子電流</p>
        <p type="p">I&lt;sub&gt;d&lt;/sub&gt;:直流電流</p>
        <p type="p">I&lt;sub&gt;q&lt;/sub&gt;:正交電流</p>
        <p type="p">I&lt;sub&gt;avg&lt;/sub&gt;:平均電流</p>
        <p type="p">I&lt;sub&gt;rp&lt;/sub&gt;:漣波電流</p>
        <p type="p">I&lt;sub&gt;ω&lt;/sub&gt;:比例積分訊號</p>
        <p type="p">θ&lt;sub&gt;r&lt;/sub&gt;:轉子角度</p>
        <p type="p">ω&lt;sub&gt;c&lt;/sub&gt;:控制速率</p>
        <p type="p">ω&lt;sub&gt;r&lt;/sub&gt;:速率訊號</p>
        <p type="p">V&lt;sub&gt;IN&lt;/sub&gt;:輸入電壓</p>
        <p type="p">Ve:電路電壓</p>
        <p type="p">Du:佔空比訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="538px" img-content="tif" inline="yes" orientation="portrait" width="236px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623585</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109102</doc-number>
          <kind></kind>
          <date>114/03/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/70</main-classification>
        <further-classification edition="200601120260302B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕克　維傑Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARKHE, VIJAY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/564,892</doc-number>
          <date>20240313</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/926,108</doc-number>
          <date>20241024</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於夾緊絕緣體基板的低成本靜電吸盤</chinese-title>
        <english-title>LOW COST ELECTROSTATIC CHUCK FOR CHUCKING INSULATOR SUBSTRATES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處提供了靜電吸盤(ESC)的形成方法。在某些實施例中，形成靜電吸盤(ESC)的方法包括：在陶瓷板的下表面上形成相互連接的複數個第一槽；在陶瓷板的下表面上形成相互連接且與複數個第一槽分開的複數個第二槽；在複數個第一槽中沉積金屬層以形成第一電極，並在複數個第二槽中沉積金屬層以形成第二電極；以及用介電材料填滿複數個第一槽和複數個第二槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of forming electrostatic chucks (ESCs) are provided herein. In some embodiments, a method of forming an electrostatic chuck (ESC) includes: forming a plurality of first grooves that are interconnected in a lower surface of a ceramic plate; forming a plurality of second grooves that are interconnected in the lower surface of the ceramic plate and that are separate from the plurality of first grooves; depositing a metal layer in the plurality of first grooves to form a first electrode and in the plurality of second grooves to form a second electrode; and filling the plurality of first grooves and the plurality of second grooves with a dielectric material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
        <p type="p">108:步驟</p>
        <p type="p">110:步驟</p>
        <p type="p">112:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="959px" img-content="tif" inline="yes" orientation="portrait" width="695px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622219</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109172</doc-number>
          <kind></kind>
          <date>114/03/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260203B">C09K19/38</main-classification>
        <further-classification edition="200601120260203B">C08L67/00</further-classification>
        <further-classification edition="200601120260203B">C08K3/34</further-classification>
        <further-classification edition="200601120260203B">C08K7/14</further-classification>
        <further-classification edition="200601120260203B">C08G63/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商上野製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO FINE CHEMICALS INDUSTRY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石津忍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZU, SHINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深澤正寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAZAWA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木詩織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, SHIORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207683</doc-number>
          <date>20241128</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-207690</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>液晶聚合物組成物</chinese-title>
        <english-title>LIQUID CRYSTAL POLYMER COMPOSITION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種液晶聚合物組成物，其可維持液晶聚合物具有之機械強度及耐熱性，同時薄片化流動性及耐起泡性優異。&lt;br/&gt;本發明有關一種液晶聚合物組成物，其係相對於液晶聚合物100質量份，含有石英含量為0至0.25質量%之滑石0.1至150質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a liquid crystal polymer composition that can maintain the mechanical strength and heat resistance inherent to liquid crystal polymers, while also exhibiting excellent thin-wall flowability and anti-foaming properties.&lt;br/&gt;The present invention relates to a liquid crystal polymer composition which, relative to 100 parts by mass of the liquid crystal polymer, contains 0.1 to 150 parts by mass of talc with a quartz content of 0 to 0.25% by mass.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623682</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109318</doc-number>
          <kind></kind>
          <date>114/03/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="202601120260302B">H10W20/44</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹偉翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, WEI HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/950,872</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置及製造方法。一種方法包括：在基板上形成複數個主動區；在這些主動區上方形成互連結構；蝕刻開口穿過互連結構、穿過這些主動區且進入基板中，其中開口由側壁界定；形成通孔結構在開口內；及形成氣隙在通孔結構與側壁之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and methods of fabrication are provided. A method includes forming active regions on a substrate; forming an interconnect structure over the active regions; etching an opening through the interconnect structure, through the active regions, and into the substrate, wherein the opening is bounded by a sidewall; forming a via structure within the opening; and forming an air gap between the via structure and the sidewall.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:工件</p>
        <p type="p">202:基板</p>
        <p type="p">206-1:鰭片</p>
        <p type="p">208:中心區</p>
        <p type="p">210:周邊區</p>
        <p type="p">214:隔離結構</p>
        <p type="p">230:層間介電質(ILD)層</p>
        <p type="p">300:互連結構</p>
        <p type="p">302:金屬接線</p>
        <p type="p">304:通孔</p>
        <p type="p">340:金屬間介電質(IMD)層</p>
        <p type="p">350-1:內部金屬側壁</p>
        <p type="p">355:金屬耦接特徵</p>
        <p type="p">390:IMD層</p>
        <p type="p">400:保護環結構</p>
        <p type="p">500:TSV</p>
        <p type="p">530:第一頂部介電層</p>
        <p type="p">540:第一頂部金屬特徵</p>
        <p type="p">550:第二頂部介電層</p>
        <p type="p">560:第二頂部金屬特徵</p>
        <p type="p">570:頂部通孔</p>
        <p type="p">M1~Mn:金屬化層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10059.png" file="d10059.TIF" giffile="ed10059.png" height="740px" img-content="tif" inline="yes" orientation="portrait" width="870px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623628</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109412</doc-number>
          <kind></kind>
          <date>114/03/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/20</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10W90/00</further-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W76/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商英路矽科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOSILICON TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>敖海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高專</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117215095</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>三維堆疊晶片及其製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
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                <last-name>KIM, JI HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金尙碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔鎭鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0037414</doc-number>
          <date>20240318</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2025-0018333</doc-number>
          <date>20250212</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>發光二極體顯示驅動電路及包含其的顯示裝置</chinese-title>
        <english-title>LED DISPLAY DRIVING CIRCUIT AND LED DISPLAY DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">LED顯示驅動電路，包含：通道驅動電路，據PWM控制訊號向各通道線提供通道電流，並使連接至各通道線的LED發光；掃描驅動電路，包含掃描開關及預充電開關，掃描開關連接至掃描線，掃描開關據掃描訊號開關，以選擇連接至LED之掃描線發光，預充電開關連接至掃描線並據預充電控制訊號與掃描開關互補運作，且預充電開關在各掃描開關關斷時開啟以向掃描線提供預充電電壓；資料控制器，產生PWM控制訊號、掃描訊號及預充電控制訊號，並在檢測到LED中之短路LED時，當連接短路LED的目標掃描線的掃描開關關斷時，透過關斷預充電開關將目標掃描線維持浮接狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting diode (LED) display driving circuit that can reduce line failures caused by a shorted LED according to one aspect of the present disclosure includes a channel driving circuit configured to supply a channel current to each of a plurality of channel lines according to a pulse width modulation (PWM) control signal and allow a plurality of LEDs connected to each channel line to emit light, a scan driving circuit including a plurality of scan switches connected to a plurality of scan lines and selectively turned on or off according to a scan signal to select a scan line connected to LEDs to emit light, and a plurality of precharge switches connected to the plurality of scan lines and configured to operate complementarily with the scan switches according to a precharge control signal, and turned on when each of the scan switches is turned off to supply a precharge voltage to a corresponding scan line, and a data controller configured to generate the PWM control signal, the scan signal, and the precharge control signal and maintain a target scan line in a floating state by turning off a precharge switch connected to a target scan line when a scan switch of a target scan line to which a shorted LED is connected is turned off when the shorted LED among the plurality of LEDs is detected.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:LED顯示裝置</p>
        <p type="p">120:LED顯示驅動電路</p>
        <p type="p">P:像素</p>
        <p type="p">CLK:時脈</p>
        <p type="p">DATA:影像資料</p>
        <p type="p">CL2,CL3,CLm:通道線</p>
        <p type="p">SL1,SL2,SL3,SLn:掃描線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="610px" img-content="tif" inline="yes" orientation="portrait" width="601px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622287</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109777</doc-number>
          <kind></kind>
          <date>114/03/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/46</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘迪　維許瓦思庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDEY, VISHWAS KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫拉迪安　雅拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORADIAN, ALA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏普迪　安諾庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BODEPUDI, ANIL KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/618,649</doc-number>
          <date>20240327</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於半導體製造的多部分基板支撐件及相關方法、製程套件，以及製程腔室</chinese-title>
        <english-title>MULTI-SECTION SUBSTRATE SUPPORTS AND RELATED METHODS, PROCESS KITS, AND PROCESSING CHAMBERS FOR SEMICONDUCTOR MANUFACTURING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例與多部分基板支撐件及相關的處理套組、處理腔室、部件和用於半導體製造的方法有關。在一或多個實施例中，處理腔室包括具有複數個同心部件的基板支撐件，其中包括具有外直徑的第一部件，以及位於第一部件的徑向外側的第二部件。第二部件包含環形的第一外部部分。處理腔室還包括複數個熱源，這些熱源排列成複數個同心加熱區域。加熱區域包括與第一部件對齊的第一加熱區域，該第一加熱區域包括第一熱源，以及與第二部件對齊的第二加熱區域。第二加熱區域包括第二熱源，且第一熱源和第二熱源可獨立控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to multi-section substrate supports, and related process kits, processing chambers, components, and methods for semiconductor manufacturing. In one or more embodiments, a processing chamber includes a substrate support having a plurality of concentric pieces including a first piece having an outer diameter, and a second piece disposed radially outwardly of the first piece. The second piece includes a first outer section that is annular in shape. The processing chamber further includes a plurality of heat sources arranged into a plurality of concentric heating zones. The heating zones include a first heating zone aligned with the first piece, the first heating zone including a first heat source, and a second heating zone aligned with the second piece. The second heating zone includes a second heat source, and the first heat source and the second heat source are independently controllable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">138a:熱源</p>
        <p type="p">138b:熱源</p>
        <p type="p">138c:熱源</p>
        <p type="p">300:板材組件</p>
        <p type="p">310:內部部分</p>
        <p type="p">330:外部部分</p>
        <p type="p">350:外部部分</p>
        <p type="p">370:脊</p>
        <p type="p">372:升舉銷孔</p>
        <p type="p">373:臂開口</p>
        <p type="p">380:第一間隔墊</p>
        <p type="p">385:第二間隔墊</p>
        <p type="p">1000:腔室套件</p>
        <p type="p">HZ1:加熱區域</p>
        <p type="p">HZ2:加熱區域</p>
        <p type="p">HZ3:加熱區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="772px" img-content="tif" inline="yes" orientation="portrait" width="1129px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623428</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109950</doc-number>
          <kind></kind>
          <date>114/03/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202501120260302B">H10D84/80</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立陽明交通大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL YANG MING CHIAO TUNG UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林鑫成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, HSIN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜建德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, CHIEN-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉致為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHEE-WEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/955,405</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，包括具有半導體鰭片的基板、在基板上方的第一電晶體、及垂直地在第一電晶體之上的第二電晶體。第一電晶體包括在半導體鰭片上方的第一閘極結構，其中在橫截面圖中，半導體鰭片包含與第一閘極結構之底表面接觸的通道部分、及在第一閘極結構之相對側壁上的源極/汲極部分。第二電晶體包括半導體鰭片之上的半導體通道層、在半導體通道層上方的第二閘極結構、及在半導體通道層之相對末端上的源極/汲極磊晶結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate having a semiconductor fin, a first transistor over the substrate, and a second transistor vertically above the first transistor. The first transistor includes a first gate structure over the semiconductor fin, in which in a cross-sectional view, the semiconductor fin comprises a channel portion in contact with a bottom surface of the first gate structure, and source/drain portions on opposite sidewalls of the first gate structure. The second transistor includes a semiconductor channel layer above the semiconductor fin, a second gate structure over the semiconductor channel layer, and source/drain epitaxy structures on opposite ends of the semiconductor channel layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">100CH:通道部分</p>
        <p type="p">100F:半導體鰭片</p>
        <p type="p">100SD:源極/汲極部分</p>
        <p type="p">102:半導體層</p>
        <p type="p">105:隔離結構</p>
        <p type="p">115:閘極間隔物</p>
        <p type="p">116:內部間隔物</p>
        <p type="p">135:源極/汲極</p>
        <p type="p">140:隔離層</p>
        <p type="p">150A~150B:源極/汲極磊晶結構</p>
        <p type="p">155A~155B:源極/汲極觸點</p>
        <p type="p">160:ILD層</p>
        <p type="p">170:金屬閘極結構</p>
        <p type="p">172:閘極介電層</p>
        <p type="p">174:功函數金屬層</p>
        <p type="p">176:閘極填充金屬</p>
        <p type="p">180A~180B:源極/汲極通孔</p>
        <p type="p">270:金屬閘極結構</p>
        <p type="p">272:閘極介電層</p>
        <p type="p">274:功函數金屬層</p>
        <p type="p">276:閘極填充金屬</p>
        <p type="p">H1:高度</p>
        <p type="p">L1:閘極長度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10046.png" file="d10046.TIF" giffile="ed10046.png" height="719px" img-content="tif" inline="yes" orientation="portrait" width="532px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623079</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114109982</doc-number>
          <kind></kind>
          <date>114/03/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250707B">H01M10/42</main-classification>
        <further-classification edition="201901120250707B">G01R31/396</further-classification>
        <further-classification edition="202001120250707B">G01R31/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商高麗亞鉛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOREA ZINC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金承顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金容昔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YONG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0169656</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於管理電池的裝置及方法</chinese-title>
        <english-title>APPARATUS AND METHOD FOR MANAGING BATTERY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容揭露了一個裝置，包含一個或多個處理器，其中，該一個或多個處理器被配置為：從掃描器接收與透過掃描目標電池而產生的一個或多個影像相關的第一資訊；基於該第一資訊產生與該目標電池的三維影像相關的第二資訊；基於該第一資訊透過識別該目標電池的一個或多個特徵來產生第三資訊；基於該第二資訊和第三資訊產生第四資訊，其中在該目標電池的三維影像上標記與該目標電池的一個或多個特徵相關的資訊；以及將第四資訊傳輸至被配置為對該目標電池進行拆卸操作的外部裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure discloses an apparatus comprising one or more processors, wherein the one or more processors are configured to: receive, from a scanner, first information relating to one or more images generated by scanning a target battery, generate, based on the first information, second information relating to a three-dimensional image of the target battery, generate, based on the first information, third information by identifying one or more characteristics of the target battery, generate, based on the second information and the third information, fourth information in which information relating to the one or more characteristics of the target battery is labeled on the three-dimensional image of the target battery, and transmit the fourth information to an external apparatus configured to perform a disassembly operation for the target battery.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:環境</p>
        <p type="p">110:裝置</p>
        <p type="p">120:掃描器</p>
        <p type="p">130:外部裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="376px" img-content="tif" inline="yes" orientation="portrait" width="572px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622793</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110278</doc-number>
          <kind></kind>
          <date>114/03/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120250801B">G06F30/333</main-classification>
        <further-classification edition="200601120250801B">G06F11/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科瓦列夫　弗拉迪米爾　瓦倫蒂諾維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOVALEV, VLADIMIR VALENTINOVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/959,204</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積體電路的安全掃描測試</chinese-title>
        <english-title>SECURE SCAN TESTING OF INTEGRATED CIRCUITS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於對處理敏感資料的積體電路進行掃描測試同時保護這些資料免受未經授權的存取的技術。提供與主掃描暫存器並行的第二掃描暫存器，第二掃描暫存器在功能上複製主掃描暫存器。主掃描和複製掃描暫存器是可掃描載入的(即，可以載入掃描資料)，但是是不可掃描的(即，不可掃描讀取)。第一和第二掃描暫存器擷取的資料不會被掃描輸出以供外部觀察，而是比較第一和第二掃描暫存器的內容，並由作為常規可掃描(或可掃描讀取)暫存器操作的第三掃描暫存器擷取比較結果。第三掃描暫存器被掃描輸出以供觀察的值反映測試結果，且第一和第二掃描暫存器中的資料不被掃描輸出且無法被觀察到。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques for scan testing integrated circuits that process sensitive data while protecting such data from unauthorized access. A second scan register is provided in parallel to a primary scan register, the second scan register functionally replicating the primary scan register. The primary and replica scan registers are scan loadable (i.e., can be loaded with scan data) but are non-scannable (i.e., not scan readable). Instead of data captured by the first and second scan registers being scanned out for external observation, contents of the first and second scan registers are compared, and the comparison result is captured by a third scan register that operates as a regular scannable (or scan readable) register. The values of the third scan register scanned out for observation reflect the test results, and data in the first and second scan registers are not scanned out and cannot be observed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第一源掃描暫存器</p>
        <p type="p">104:第二源掃描暫存器</p>
        <p type="p">106:測試輸入埠</p>
        <p type="p">108:功能存取(FUNC Access)</p>
        <p type="p">110:冗餘電路</p>
        <p type="p">112:比較電路</p>
        <p type="p">114:目標掃描暫存器</p>
        <p type="p">116:測試輸出埠</p>
        <p type="p">117:輸出端</p>
        <p type="p">118:功能使用(FUNC Use)</p>
        <p type="p">CLK:時脈訊號</p>
        <p type="p">S_En:移位致能訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="586px" img-content="tif" inline="yes" orientation="portrait" width="948px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623351</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110330</doc-number>
          <kind></kind>
          <date>114/03/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江玗潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, YU-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂增富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TSENG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡鎮宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JHEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/948,790</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含位元線結構的半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE INCLUDING A BIT LINE STRUCTURE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體結構及其製造方法。該半導體結構包含一基底結構、一位元線結構和一單元接觸結構。該位元線結構係設置於該基底結構上。該單元接觸結構係設置於該位元線結構的周圍，且具有面向該位元線結構的一第一表面和一第二表面。該單元接觸結構的該第一表面與該位元線結構之間的一第一距離不同於該單元接觸結構的該第二表面與該位元線結構之間的一第二距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure and a method of manufacturing the same are provided. The semiconductor structure includes a base structure, a bit line structure and a cell contact structure. The bit line structure is disposed over the base structure. The cell contact structure is disposed around the bit line structure, and has a first surface and a second surface facing the bit line structure. A first distance between the first surface of the cell contact structure and the bit line structure is different from a second distance between the second surface of the cell contact structure and the bit line structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體結構</p>
        <p type="p">2:第一位元線結構</p>
        <p type="p">3:第二位元線結構</p>
        <p type="p">4:間隙物</p>
        <p type="p">6:單元接觸結構</p>
        <p type="p">10:基底結構</p>
        <p type="p">11:第一主動區</p>
        <p type="p">12:第二主動區</p>
        <p type="p">18:著陸墊</p>
        <p type="p">21:主體部分</p>
        <p type="p">22:帽蓋部分</p>
        <p type="p">23:導體</p>
        <p type="p">31:主體部分</p>
        <p type="p">32:帽蓋部分</p>
        <p type="p">33:絕緣體</p>
        <p type="p">41:第一層</p>
        <p type="p">42:第二層</p>
        <p type="p">43:第三層</p>
        <p type="p">44:再填充材料</p>
        <p type="p">61:第一導電部分</p>
        <p type="p">62:第二導電部分</p>
        <p type="p">100:基底部分</p>
        <p type="p">101:第一表面</p>
        <p type="p">211:鎢層</p>
        <p type="p">212:矽化鎢層</p>
        <p type="p">213:氮化鎢層</p>
        <p type="p">214:鈦層</p>
        <p type="p">311:鎢層</p>
        <p type="p">312:矽化鎢層</p>
        <p type="p">313:氮化鎢層</p>
        <p type="p">314:鈦層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10106.JPG" file="ed10106.JPG" height="778px" img-content="tif" inline="yes" orientation="portrait" width="837px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623121</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110587</doc-number>
          <kind></kind>
          <date>114/03/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120250502B">H01R13/6473</main-classification>
        <further-classification edition="200601120250502B">H01R13/24</further-classification>
        <further-classification edition="200601120250502B">H01R33/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊精密組件（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE PRECISION ACCESSORY (SUZHOU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李大波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DABO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦勝勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, SHENGXUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫宏偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, HONGWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史春和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, CHUNHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116866775</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>阻抗可變的連接器</chinese-title>
        <english-title>VARIABLE IMPEDANCE CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種阻抗可變的連接器，該阻抗可變的連接器中，支撐件由絕緣材質製備；固定導通組件固設於支撐件，固定導通組件具有第一固定導通部、第二固定導通部和第三固定導通部；活動導通件設於支撐件，且至少局部能在第一固定導通部和第二固定導通部之間移動，並能與兩者連接且導通；活動導通件在第一固定導通部和第二固定導通部之間移動的過程中，與第三固定導通部保持連接且導通；其中活動導通件與第一固定導通部、第二固定導通部和第三固定導通部之間的接觸面積分別為第一面積、第二面積和第三面積，第三面積小於第一面積與第二面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a variable impedance connector. In the variable impedance connector, a support is prepared from the insulating material. A fixed conductive component is fixed on the support. The fixed conductive component is provided with a first fixed conductive portion, a second conductive portion and a third conductive portion. A movable conductive component is disposed on the support, and at least partially moves between the first fixed conductive portion and the second conductive portion, and is connected and turned on to both of them. The movable conductive component is connected and turned on to the third conductive portion during the movement between the first fixed conductive portion and the second conductive portion. Wherein the contact areas between the movable conductive component and the first fixed conductive portion, the second conductive portion and the third conductive portion are respectively a first area, a second area and a third area. The third area is smaller than the first area and the second area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:支撐件</p>
        <p type="p">200:固定導通組件</p>
        <p type="p">300:活動導通件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="614px" img-content="tif" inline="yes" orientation="portrait" width="917px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622411</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114110866</doc-number>
          <kind></kind>
          <date>114/03/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250922B">F16L37/091</main-classification>
        <further-classification edition="200601120250922B">F16L21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商道流國際控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAOZ INTERNATIONAL HOLDING LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭聖弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENG, SHENG-HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/953,475</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>管線接頭組件</chinese-title>
        <english-title>PIPE JOINT ASSEMBLIES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種管線接頭組件，具有一墊圈和二管線。墊圈是彈性的並且有通孔。每一管線都有一連接墊圈的終端。每一終端的連接面上均有一組凹槽和凸起，以適配墊圈兩側的凸起和凹槽。凸起的截面呈等腰梯形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pipe joint assembly comprises a gasket and two pipes. The gasket is flexible and has a through hole. Each pipe has a terminal connecting the gasket. Each terminal has a set of grooves and protrusions on a connecting surface to fit the sets on two sides of the gasket. Cross sections of protrusions are isosceles trapezoid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第一管線</p>
        <p type="p">120:第二管線</p>
        <p type="p">140:罩殼</p>
        <p type="p">150:套筒</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="429px" img-content="tif" inline="yes" orientation="portrait" width="477px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623458</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111034</doc-number>
          <kind></kind>
          <date>114/03/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D89/60</main-classification>
        <further-classification edition="202501120260302B">H10D8/00</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D62/13</further-classification>
        <further-classification edition="202501120260302B">H10D64/23</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
        <further-classification edition="202501120260302B">H10D84/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金永權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG GWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜明吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, MYUNG GIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權旭炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, WOOK HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安國一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, GUK IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊京桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KYUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李胤榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, YUN YEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪炳鶴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, BYOUNG HAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0105188</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種具有改良之產率及效能之半導體裝置。該半導體裝置包括：一基體，其包括一第一區及一第二區且具有一第一傳導性類型；第一及第二作用圖案，其在該第一區上間隔開一第一節距；一第一閘極結構，其與該第一及第二作用圖案相交；第一磊晶圖案，其各具有與該第一傳導性類型不同之一第二傳導性類型，且在該第一及第二作用圖案中之每一者上之該第一閘極結構的兩側邊上接收相同電壓位準；第三及第四作用圖案，其在該第二區上間隔開一第二節距；一第二閘極結構，其與該第三及第四作用圖案相交；以及第二磊晶圖案，其在該第三及第四作用圖案之每一者上之該第二閘極結構之該等側邊上，各具有該第二傳導性類型，其中該第一節距係該第二節距的n倍(其中n係2或更大之一自然數)，且具有該第二傳導性類型之磊晶圖案不安置於該第一作用圖案與該第二作用圖案之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided a semiconductor device with improved yield and performance. The semiconductor device includes a substrate including a first region and a second region and having a first conductivity type, first and second active patterns spaced apart by a first pitch, on the first region, a first gate structure intersecting the first and second active patterns, first epitaxial patterns each having a second conductivity type, different from the first conductivity type, and receiving the same voltage level, on both sides of the first gate structure on each of the first and second active patterns, third and fourth active patterns spaced apart by a second pitch, on the second region, a second gate structure intersecting the third and fourth active patterns, and second epitaxial patterns each having the second conductivity type, on the sides of the second gate structure on each of the third and fourth active patterns, wherein the first pitch is n times the second pitch (where n is a natural number of 2 or greater), and no epitaxial pattern having the second conductivity type is disposed between the first and second active patterns.</p>
      </isu-abst>
      <representative-img>
        <p type="p">160a:第一磊晶圖案、磊晶圖案</p>
        <p type="p">160b:第二磊晶圖案、磊晶圖案</p>
        <p type="p">160c:第三磊晶圖案、磊晶圖案</p>
        <p type="p">160d:第四磊晶圖案、磊晶圖案</p>
        <p type="p">160e:第五磊晶圖案、磊晶圖案</p>
        <p type="p">160f:第六磊晶圖案、磊晶圖案</p>
        <p type="p">160g:第七磊晶圖案、磊晶圖案</p>
        <p type="p">160h:第八磊晶圖案、磊晶圖案</p>
        <p type="p">260a:第九磊晶圖案、磊晶圖案</p>
        <p type="p">260b:第十磊晶圖案、磊晶圖案</p>
        <p type="p">260c:第十一磊晶圖案、磊晶圖案</p>
        <p type="p">260d:第十二磊晶圖案、磊晶圖案</p>
        <p type="p">260e:第十三磊晶圖案、磊晶圖案</p>
        <p type="p">260f:第十四磊晶圖案、磊晶圖案</p>
        <p type="p">260g:第十五磊晶圖案、磊晶圖案</p>
        <p type="p">260h:第十六磊晶圖案、磊晶圖案</p>
        <p type="p">3FP:元件</p>
        <p type="p">A11:第一作用圖案、作用圖案</p>
        <p type="p">A12:第二作用圖案、作用圖案、第二圖案</p>
        <p type="p">A13:第三作用圖案、作用圖案、n型作用圖案</p>
        <p type="p">A14:第四作用圖案、作用圖案</p>
        <p type="p">A15:第五作用圖案、作用圖案</p>
        <p type="p">A16:第六作用圖案、作用圖案</p>
        <p type="p">A17:第七作用圖案、作用圖案、n型作用圖案</p>
        <p type="p">A18:第八作用圖案、作用圖案、n型作用圖案</p>
        <p type="p">A1-A1,A2-A2,B-B,C-C:線</p>
        <p type="p">A21:第九作用圖案、作用圖案</p>
        <p type="p">A22:第十作用圖案、作用圖案</p>
        <p type="p">A23:第十一作用圖案、作用圖案</p>
        <p type="p">A24:第十二作用圖案、作用圖案</p>
        <p type="p">A25:第十三作用圖案、作用圖案</p>
        <p type="p">A26:第十四作用圖案、作用圖案</p>
        <p type="p">A27:第十五作用圖案、作用圖案</p>
        <p type="p">A28:第十六作用圖案、作用圖案</p>
        <p type="p">FP:第一節距</p>
        <p type="p">G1:第一閘極結構、第一閘極圖案</p>
        <p type="p">G2:第二閘極結構、第二閘極圖案</p>
        <p type="p">I:第一區、區</p>
        <p type="p">II:第二區、區</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="714px" img-content="tif" inline="yes" orientation="portrait" width="970px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623557</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111135</doc-number>
          <kind></kind>
          <date>114/03/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="200601120260302B">H05B3/10</further-classification>
        <further-classification edition="200601120260302B">H05B3/74</further-classification>
        <further-classification edition="200601120260302B">C23C14/50</further-classification>
        <further-classification edition="200601120260302B">C23C16/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤丈予</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, JOYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-135891</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>陶瓷加熱器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種陶瓷加熱器，具備具有外側區域測溫用的測溫孔之陶瓷板接合體，適合更正確地測定陶瓷板接合體之外側區域的溫度。此陶瓷加熱器，具備：陶瓷板接合體，包含上側陶瓷板及下側陶瓷板；陶瓷軸，安裝在陶瓷板接合體之一方的面；內側區域加熱器電路與外側區域加熱器電路，埋設於上側陶瓷板；以及內側區域測溫用的第一測溫孔與外側區域測溫用的第二測溫孔，設置在陶瓷板接合體。第二測溫孔，包含縱孔與橫孔，該縱孔於陶瓷板接合體中到達至陶瓷板接合體的接合面，該橫孔從縱孔起沿著接合面沿水平方向往外周延伸。下側陶瓷板，具有較上側陶瓷板之熱傳導率更低的熱傳導率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:陶瓷加熱器</p>
        <p type="p">12:陶瓷板接合體</p>
        <p type="p">12a:上側陶瓷板</p>
        <p type="p">12b:下側陶瓷板</p>
        <p type="p">12c:接合面</p>
        <p type="p">12d:第一面</p>
        <p type="p">12e:第二面</p>
        <p type="p">14:陶瓷軸</p>
        <p type="p">16:內側區域加熱器電路</p>
        <p type="p">18:外側區域加熱器電路</p>
        <p type="p">20:第一測溫孔</p>
        <p type="p">22:第二測溫孔</p>
        <p type="p">22a:縱孔</p>
        <p type="p">22b:橫孔</p>
        <p type="p">24:第一測溫手段</p>
        <p type="p">26:第二測溫手段</p>
        <p type="p">28:第一端子棒</p>
        <p type="p">30:第二端子棒</p>
        <p type="p">32:下部構件</p>
        <p type="p">S:內部空間</p>
        <p type="p">Z1:內側區域</p>
        <p type="p">Z2:外側區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="796px" img-content="tif" inline="yes" orientation="portrait" width="696px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622974</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111278</doc-number>
          <kind></kind>
          <date>114/03/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250905B">G11C16/02</main-classification>
        <further-classification edition="200601120250905B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾柏皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, PO-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栢添賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BO, TIAN-CIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,526</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體裝置及記憶體系統</chinese-title>
        <english-title>MEMORY DEVICE AND MEMORY SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">記憶體裝置包含第一記憶體區塊對。第一記憶體區塊對用以儲存第一儲存資料位元，並用以比較第一儲存資料位元及第一輸入位元以產生第一電流信號，第一記憶體區塊對包含第一記憶體區塊及第二記憶體區塊。第一記憶體區塊用以依據第一字串選擇線信號產生複數個第一字串電流信號。第二記憶體區塊用以依據第二字串選擇線信號產生複數個第二字串電流信號，其中第一字串選擇線信號及第二字串選擇線信號用以攜載第一輸入位元，以及第一記憶體區塊對更用以將第一字串電流信號及第二字串電流信號相加以產生第一電流信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a first memory block pair. The first memory block pair is configured to store a first stored data bit, and configured to compare the first stored data bit and a first input bit, to generate a first current signal. The first memory block pair includes a first memory block and a second memory block. The first memory block is configured to generate a plurality of first string current signals according to a first string select line signal The second memory block is configured to generate a plurality of second string current signals according to a second string select line signal, wherein the first string select line signal and the second string select line signal are configured to carry the first input bit, and the first memory block pair is further configured to sum the plurality of first string current signals and the plurality of second string current signals to generate the first current signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:記憶體裝置</p>
        <p type="p">IS1_1~IS1_9、IS1_1’~IS1_9’:字串電流信號</p>
        <p type="p">SSL、SSL’:字串選擇線信號</p>
        <p type="p">HVT、LVT:臨界電壓準位</p>
        <p type="p">HVSSL、LVSSL:電壓準位</p>
        <p type="p">ISL1:電流準位</p>
        <p type="p">BK1、BK1’:記憶體區塊</p>
        <p type="p">IB1、IB1’、IT1:電流信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.png" file="d10018.TIF" giffile="ed10018.png" height="779px" img-content="tif" inline="yes" orientation="portrait" width="1092px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621950</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111901</doc-number>
          <kind></kind>
          <date>114/03/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250802B">B65B61/04</main-classification>
        <further-classification edition="200601120250802B">B65B61/06</further-classification>
        <further-classification edition="200601120250802B">B26D7/01</further-classification>
        <further-classification edition="200601120250802B">B26D7/20</further-classification>
        <further-classification edition="200601120250802B">B26D7/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻海精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HON HAI PRECISION INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃恩典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, EN-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王曉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王愛明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, AI-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117372626</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>裁切裝置</chinese-title>
        <english-title>CUTTING DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開一種裁切裝置，用於將產品與真空袋分離，真空袋包括主體部與密封部，主體部包覆產品，密封部連接主體部之外周，包括定位組件與裁切組件。定位組件用於定位產品，並承托密封部。裁切組件包括支架、壓板與裁刀，支架與壓板彈性連接，裁刀連接支架，支架被配置為帶動壓板將密封部壓持於定位組件，並帶動裁刀伸出壓板，對密封部進行裁切，使密封部與主體部分離，進而將產品與真空袋分離。藉由定位組件與裁切組件配合，於定位產品後對密封部進行裁切，便於分離產品與真空袋，降低產品受損之風險。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The application provides a cutting device, used to separate the product from the vacuum bag, the vacuum bag includes a main body and a sealing part, the main body wraps the product, the sealing part connects the outer circumference of the main body, and includes a positioning component and a cutting component. The positioning component is used to locate the product and support the sealing part. The cutting component includes a bracket, a pressure plate, and a cutting blade. The bracket and the pressure plate are elastically connected, and the cutting blade is connected to the bracket. The bracket is configured to drive the pressure plate to press the sealing part onto the positioning component, and drive the cutting blade to extend out of the pressure plate to cut the sealing part, so that the sealing part is separated from the main body, and then the product is separated from the vacuum bag. By coordinating the positioning and cutting components, the sealing part is cut after positioning the product, making it easier to separate the product from the vacuum bag and reducing the risk of product damage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裁切裝置</p>
        <p type="p">10:定位組件</p>
        <p type="p">101:第一安裝板</p>
        <p type="p">102:第二安裝板</p>
        <p type="p">11:第一定位機構</p>
        <p type="p">12:第二定位機構</p>
        <p type="p">15:固定塊</p>
        <p type="p">16:頂升件</p>
        <p type="p">20:裁切組件</p>
        <p type="p">21:支架</p>
        <p type="p">22:裁刀</p>
        <p type="p">23:壓板</p>
        <p type="p">200:真空袋</p>
        <p type="p">201:主體部</p>
        <p type="p">202:密封部</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="869px" img-content="tif" inline="yes" orientation="portrait" width="707px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623189</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111933</doc-number>
          <kind></kind>
          <date>114/03/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250811B">H03B5/20</main-classification>
        <further-classification edition="200601120250811B">H03B5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商上海新進芯微電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BCD SHANGHAI MICRO-ELECTRONICS COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙安東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, ANDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成東波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, DONGBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃燕華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　宜忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, YIZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117455953</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於環形振盪器之控制電路及環形振盪器裝置</chinese-title>
        <english-title>A CONTROL CIRCUIT FOR A RING OSCILLATOR AND A RING OSCILLATION DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種用於環形振盪器之控制電路及環形振盪器裝置，係關於振盪信號領域。供電電源透過參考電壓生成模組及運算放大器來為環形振盪器提供電源電壓。同時回饋控制模組會根據環形振盪器之輸出信號之頻率之即時情況來調控運算放大器之正相輸入端之電壓，從而影響到運算放大器輸出至環形振盪器之電源電壓。藉由調控電源電壓來調整環形振盪器之輸出信號之頻率，形成對環形振盪器之輸出信號之回饋控制。透過回饋動態調整使得環形振盪器之輸出信號之頻率保持在穩定的小範圍內，從而提高環形振盪器之輸出信號之頻率之穩定性及可靠性，減小環形振盪器之輸出信號之頻率分佈，同時避免了器件參數等因素對環形振盪器之輸出信號之頻率之影響，提高頻率精度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a control circuit for a ring oscillator and a ring oscillation device, which relates to the field of oscillation signals. A power supply provides power supply voltage for the ring oscillator through a reference voltage generation module and an operational amplifier. Meanwhile, a feedback control module regulates a voltage at a non-inverting input terminal of the operational amplifier according to real-time situations of a frequency of an output signal of the ring oscillator, thereby affecting the power supply voltage output by the operational amplifier to the ring oscillator. The frequency of the output signal of the ring oscillator is adjusted by regulating the power supply voltage, a feedback control for the output signal of the ring oscillator is obtained. Through dynamic adjustment of the feedback, the frequency of the output signal of the ring oscillator is maintained within a stable and narrow range. Thus, the stability and reliability of the frequency of the output signal of the ring oscillator are improved, and the frequency distribution of the output signal of the ring oscillator is reduced. At the same time, the influence of factors such as device parameters on the frequency of the output signal of the ring oscillator is avoided, and the frequency accuracy is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:參考電壓生成模組</p>
        <p type="p">3:回饋控制模組</p>
        <p type="p">OSC:環形振盪器</p>
        <p type="p">TCA:運算放大器</p>
        <p type="p">VDD:供電電源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="489px" img-content="tif" inline="yes" orientation="portrait" width="685px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623006</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114111950</doc-number>
          <kind></kind>
          <date>114/03/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250602B">H01F17/06</main-classification>
        <further-classification edition="200601120250602B">H01F1/153</further-classification>
        <further-classification edition="200601120250602B">H01F41/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乾坤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYNTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏志宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, CHIH HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖仲凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHUNG KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊代強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/964,226</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>功率電感器的磁性元件以及其製造方法</chinese-title>
        <english-title>MAGNETIC COMPONENT OF POWER INDUCTOR AND FABRICATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁性元件，適用於功率電感器。該磁性元件包括一磁性本體，其包含非晶磁性粉末及/或奈米晶磁性粉末和至少一分布於非晶磁性粉末及/或奈米晶磁性粉末之間的無矽玻璃材料；一線圈，埋嵌在該磁性本體內；以及一對電極，分別電連接到該線圈的兩端子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic component is adapted to be used in a power inductor. The magnetic component includes a magnetic body containing amorphous magnetic powders and/or nano-crystalline magnetic powders and at least one silicon-free glass material distributed among the amorphous magnetic powders and/or nano-crystalline magnetic powders; a coil embedded in the magnetic body; and a pair of electrodes electrically connected to two terminals of the coil, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:非晶磁性粉末及/或奈米晶磁性粉末</p>
        <p type="p">102:無矽玻璃材料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="483px" img-content="tif" inline="yes" orientation="portrait" width="614px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622970</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112200</doc-number>
          <kind></kind>
          <date>114/03/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">G11C11/417</main-classification>
        <further-classification edition="200601120251103B">G11C7/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕塔克　阿瑟克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATHAK, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡多奇　阿圖爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATOCH, ATUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/960,648</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體電路及其操作方法</chinese-title>
        <english-title>MEMORY CIRCUITS AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體電路可包含以下中的至少一者：第一記憶體分區、第一局部輸入/輸出(I/O)電路、第二記憶體分區、第二局部I/O電路、全域I/O電路、第一局部閂鎖電路及第二局部閂鎖電路。第一記憶體分區可包括第一記憶體陣列。第二記憶體分區可包括第二記憶體陣列。第一局部閂鎖電路可經組態為在自第一記憶體陣列讀取時被啟用以閂鎖資料位元。第二局部閂鎖電路可經組態為在自第二記憶體陣列讀取時被啟用以閂鎖資料位元。第一局部閂鎖電路及第二局部閂鎖電路可經組態為交替地啟用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory circuit may comprise at least one of: a first memory bank, a first local input/output (I/O) circuit, a second memory bank, a second local I/O circuit, a global I/O circuit, a first local latch circuit, and a second local latch circuit. The first memory bank may include a first memory array. The second memory bank may include a second memory array. The first local latch circuit can be configured to be activated to latch data bit when read from the first memory array. The second local latch circuit can be configured to be activated to latch data bit when read from the second memory array. The first local latch circuit and the second local latch circuit can be configured to be alternately activated.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:方法</p>
        <p type="p">802:操作</p>
        <p type="p">804:操作</p>
        <p type="p">806:操作</p>
        <p type="p">808:操作</p>
        <p type="p">810:操作</p>
        <p type="p">812:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.png" file="d10016.TIF" giffile="ed10016.png" height="749px" img-content="tif" inline="yes" orientation="portrait" width="757px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623525</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112692</doc-number>
          <kind></kind>
          <date>114/04/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/00</main-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田子容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, TZU JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張任遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/961,641</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>中介層和其形成方法</chinese-title>
        <english-title>INTERPOSER AND METHODS FOR FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">中介層上的對準標記形成於晶片區域內而非晶圓刻劃線或晶粒街道中。基板穿孔溝槽及至少一個對準標記溝槽形成於基板的晶片區域中。基板穿孔溝槽及至少一個對準標記溝槽用金屬填充以形成經填充基板穿孔溝槽及至少一個對準標記。基板的厚度經減小以自經填充基板穿孔溝槽形成基板穿孔。這樣可以減小切割期間的製程缺陷且改善良率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Alignment marks on an interposer are formed within a chip area instead of in a wafer scribe line or die street. A through-substrate via (TSV) trench and at least one alignment mark trench are formed in a chip area of a substrate. The TSV trench and the at least one alignment mark trench are filled with a metal to form a filled TSV trench and the at least one alignment mark. The thickness of the substrate is reduced to form a through-substrate via (TSV) from the filled TSV trench. This reduces process defects during dicing and improves yield.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">102:前側/上表面/第一側</p>
        <p type="p">104:背側/底表面/第二側</p>
        <p type="p">110:中介層</p>
        <p type="p">116:垂直晶圓刻劃線</p>
        <p type="p">120:重分佈層</p>
        <p type="p">148:基板穿孔溝槽</p>
        <p type="p">190:對準標記</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.png" file="d10026.TIF" giffile="ed10026.png" height="471px" img-content="tif" inline="yes" orientation="portrait" width="620px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622572</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112779</doc-number>
          <kind></kind>
          <date>114/04/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250414B">G02B6/46</main-classification>
        <further-classification edition="200601120250414B">G02B6/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＡＤＳ科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADS TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋光烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, KWANG YEOUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175177</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>對於共同封裝光學(CPO)模組的光子積體電路用於可拆式光纖陣列的收容器對位裝置及利用該裝置的收容器對位方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種在預對位及塗敷環氧樹脂後的重新對位期間，完全防止收容器偏離的同時防止環氧樹脂沾在用於固定收容器的收容器固定單元而一起固化的問題的技術；本發明一個實施例之對於共同封裝光學模組的光子積體電路用於可拆式光纖陣列的收容器對位裝置具有對於收容器透過環氧樹脂固定到光子積體電路的上表面、光纖陣列透過收容器的上表面的凹凸部安置時移動受到限制且以能與收容器分離的方式安置的結構，該裝置將收容器對位到光子積體電路，包括：治具，用以固定光子積體電路；夾爪，用以將光纖陣列已被安置到收容器所形成的光纖單元固定；移動模組，使夾爪進行3軸移動；及收容器固定單元，在鄰接夾爪的區域構成位於收容器的上部並可上下移動，用以施加往上牽拉收容器的力量以接觸並固定於收容器，直到收容器透過環氧樹脂固定到光子積體電路為止，從而使收容器以緊貼方式固定在光纖陣列，與此同時，在塗敷環氧樹脂後的微對位過程中抑制收容器的橫向移動及縱向移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:夾爪</p>
        <p type="p">21:固定突出夾爪</p>
        <p type="p">22:缸型移動夾爪</p>
        <p type="p">40:收容器固定單元</p>
        <p type="p">41:接觸單元</p>
        <p type="p">42:單元移動模組</p>
        <p type="p">100:光纖單元</p>
        <p type="p">101:光纖陣列</p>
        <p type="p">102:收容器</p>
        <p type="p">d1:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="712px" img-content="tif" inline="yes" orientation="portrait" width="635px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622191</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114112794</doc-number>
          <kind></kind>
          <date>114/04/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260225B">C09D11/52</main-classification>
        <further-classification edition="200601120260225B">H05K1/09</further-classification>
        <further-classification edition="200601120260225B">H05K3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＸ金屬股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JX ADVANCED METALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須賀正太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGA, SHOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河野猛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-100844</doc-number>
          <date>20240621</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>銅油墨、電子電路基板及電子電路基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種能夠抑制將銅油墨印刷在基板上時之滲出，製作短路少且可靠性高之電路圖案的銅油墨、及使用其之電子電路基板及電子電路基板之製造方法。  &lt;br/&gt;本發明係一種銅油墨，其含有銅粒子，由剪切速度1 sec&lt;sup&gt;-1&lt;/sup&gt;時之黏度η1與剪切速度10 sec&lt;sup&gt;-1&lt;/sup&gt;時之黏度η10之比（η1/η10）所定義的觸變指數TI為7.5以下，當以50秒使剪切速度自0.01 sec&lt;sup&gt;-1&lt;/sup&gt;提高至300 sec&lt;sup&gt;-1&lt;/sup&gt;，在300 sec&lt;sup&gt;-1&lt;/sup&gt;保持50秒之後，以50秒自300 sec&lt;sup&gt;-1&lt;/sup&gt;降低至0.01 sec&lt;sup&gt;-1&lt;/sup&gt;時藉由動態黏彈性測定所測得之剪切應力之遲滯區域為3000 Pa·sec&lt;sup&gt;-1&lt;/sup&gt;以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="484px" img-content="tif" inline="yes" orientation="portrait" width="622px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622586</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113000</doc-number>
          <kind></kind>
          <date>114/04/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250714B">G02B13/00</main-classification>
        <further-classification edition="202101120250714B">G03B17/12</further-classification>
        <further-classification edition="202101120250714B">G03B17/28</further-classification>
        <further-classification edition="201101120250714B">B82Y30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞洲光學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA OPTICAL CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張錫齡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, HSI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉哲郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113145378</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>成像鏡頭（八十二）</chinese-title>
        <english-title>LENS ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像鏡頭自一物側至一像側依序包括一光學元件以及一影像感測元件。該光學元件包括複數對微型結構。該影像感測元件包括複數對像素區。每一對微型結構包括一第一視角微型結構以及一第二視角微型結構，該第一視角微型結構將物成像於對應的一第一視角像素區，該第二視角微型結構將物成像於對應的一第二視角像素區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens assembly includes an optical element and an image sensor element. The optical element includes a plurality of micro structure pairs. The image sensor element includes a plurality of pixel area pairs. Each pair of micro structure includes a first-view micro structure and a second-view micro structure. The first-view micro structure images an object in a corresponding first-view pixel area. The second-view micro structure images the object in a corresponding second-view pixel area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成像鏡頭</p>
        <p type="p">110:超穎透鏡</p>
        <p type="p">1103:出射面</p>
        <p type="p">1101L:第一入射區</p>
        <p type="p">1101R:第二入射區</p>
        <p type="p">110ML:微透鏡結構</p>
        <p type="p">130:感測器</p>
        <p type="p">1303:底面</p>
        <p type="p">1301L:第一感測區</p>
        <p type="p">1301R:第二感測區</p>
        <p type="p">150:待測物</p>
        <p type="p">AX1:軸線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="679px" img-content="tif" inline="yes" orientation="portrait" width="709px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622981</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113182</doc-number>
          <kind></kind>
          <date>114/04/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C29/42</main-classification>
        <further-classification edition="200601120260302B">G06F11/16</further-classification>
        <further-classification edition="202601120260302B">G06F11/14</further-classification>
        <further-classification edition="200601120260302B">G06F11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃善宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SEON WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEONG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池晸煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, JUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0166508</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>錯誤校正電路及包括其的半導體裝置</chinese-title>
        <english-title>ERROR CORRECTION CIRCUIT AND SEMICONDUCTOR DEVICE INCLUDING SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">錯誤校正電路包括錯誤處理電路、中毒處理電路和資料圖案轉換電路。錯誤處理電路接收資料，生成延遲資料、同位訊號和校正子資訊，並輸出透過根據校正子資訊校正資料中的錯誤而生成的錯誤校正資料。中毒處理電路根據寫入命令輸出寫入中毒旗標和讀取中毒旗標中的一個作為中毒圖案控制訊號。資料圖案轉換電路根據中毒圖案控制訊號，將延遲資料和同位訊號轉換為中毒圖案並輸出中毒圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An error correction circuit includes an error processing circuit, a poison processing circuit, and a data pattern conversion circuit. The error processing circuit receives data, generates delayed data, a parity signal, and syndrome information, and outputs error correction data generated by correcting errors in the data according to the syndrome information. The poison processing circuit outputs one of a write poison flag and a read poison flag as a poison pattern control signal in accordance with a write command. The data pattern conversion circuit converts the delayed data and the parity signal into a poison pattern according to the poison pattern control signal and outputs the poison pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:錯誤校正電路</p>
        <p type="p">110:全域線鎖存電路</p>
        <p type="p">210:輸入/輸出控制電路</p>
        <p type="p">220:錯誤處理電路</p>
        <p type="p">230:同位操作電路</p>
        <p type="p">240:校正子操作電路</p>
        <p type="p">250:資料校正電路</p>
        <p type="p">270:中毒處理電路</p>
        <p type="p">280:中毒檢測電路</p>
        <p type="p">290:中毒鎖存器</p>
        <p type="p">300:資料圖案轉換電路</p>
        <p type="p">400:錯誤嚴重性確定電路</p>
        <p type="p">500:命令控制電路</p>
        <p type="p">CDT:錯誤校正資料</p>
        <p type="p">CMD-WT:外部寫入命令</p>
        <p type="p">DT:資料</p>
        <p type="p">DDT:延遲資料</p>
        <p type="p">ECS-EN:錯誤檢查和清理模式賦能訊號</p>
        <p type="p">iRD:讀取命令</p>
        <p type="p">iWT:寫入命令</p>
        <p type="p">PRT:同位訊號</p>
        <p type="p">PSNC:中毒圖案控制訊號</p>
        <p type="p">RGIO:第一全域線</p>
        <p type="p">RGIO-LT:全域線鎖存訊號</p>
        <p type="p">RPSN:讀取中毒旗標</p>
        <p type="p">SEVR:錯誤嚴重性資訊</p>
        <p type="p">SYD:校正子資訊</p>
        <p type="p">WGIO:第二全域線</p>
        <p type="p">WPSN:寫入中毒旗標</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="731px" img-content="tif" inline="yes" orientation="portrait" width="814px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622943</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113186</doc-number>
          <kind></kind>
          <date>114/04/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120250714B">G09G3/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝侑倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YU-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾長聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, CHANG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/963,345</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示驅動器及其操作方法及顯示面板</chinese-title>
        <english-title>DISPLAY DRIVER AND OPERATING METHOD THEREOF, AND DISPLAY PANEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示驅動器的操作方法，用於驅動顯示面板。顯示面板包含多個像素電路，像素電路排列在多個顯示線。顯示驅動器的操作方法包括：在至少一刷新幀期間，由顯示驅動器向像素電路提供具有參考值的初始電壓；以及在至少一非刷新幀期間，由顯示驅動器向像素電路提供具有多個不同電壓值的初始電壓。初始電壓的多個不同電壓值分別對應於多個顯示線與顯示驅動器之間的距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operating method of a display driver adapted to drive a display panel is provided. The display panel includes a plurality of pixel circuits arranged in a plurality of display lines. The operating method of the display driver includes the following steps. By the display driver, an initial voltage with a reference value is provided to the pixel circuits during at least one active frame. By the display driver, the initial voltage with a plurality of different voltage values is provided to the pixel circuits during at least one skip frame. The plurality of different voltage values of the initial voltage respectively correspond to a plurality of distances between the plurality of display lines and the display driver.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210、S220:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="397px" img-content="tif" inline="yes" orientation="portrait" width="661px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622127</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113217</doc-number>
          <kind></kind>
          <date>114/04/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C08F14/18</main-classification>
        <further-classification edition="200601120260224B">C08L27/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎浩輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBASAKI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐橋祐亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHASHI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳谷碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGIYA, AOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>織岡真理子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIOKA, MARIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部香織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊田瑞菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYODA, MIZUNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大繼聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUGU, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巨勢丈裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSE, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-099119</doc-number>
          <date>20240619</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>水性分散液之製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING AQUEOUS DISPERSION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水性分散液之製造方法，係形成一包含氟烯烴系聚合物之粒子及水且不含氟系乳化劑的反應系統，並在前述反應系統中至少使氣態全氟烯烴聚合，來製造包含氟聚合物之粒子的水性分散液；其中，前述氟烯烴系聚合物係一具親水性基之氟烯烴系聚合物，且不含以具親水性基之單體為主體的單元；前述水性分散液中所含氟聚合物之粒子之平均粒徑相對於前述氟烯烴系聚合物之粒子之平均粒徑的比值大於1；並且，前述水性分散液中之氟聚合物之粒子含量相對於前述反應系統中之氟烯烴系聚合物之粒子含量的比值為2以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623271</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113243</doc-number>
          <kind></kind>
          <date>114/04/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250501B">H04R1/02</main-classification>
        <further-classification edition="200601120250501B">H04R5/033</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江西立訊智造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGXI LUXSHARE INTELLIGENT MANUFACTURE CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116974731</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>無線耳機系統及其使用方法</chinese-title>
        <english-title>WIRELESS EARPHONE SYSTEM AND USING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種無線耳機系統包括：耳機單體、充電盒以及換向組件。耳機單體設置有第一磁體。充電盒的下殼體的內部設置有第二磁體，第二磁體具有磁極相反的第一表面和第二表面並具有第一狀態和第二狀態，第一磁體的磁極與第一表面的磁極相同。第二磁體處於第一狀態時，第一表面靠近第一磁體，使耳機單體能朝背離第二磁體的方向移動；第二磁體處於第二狀態時，第二表面靠近第一磁體，使第一磁體吸緊第二磁體。換向組件活動地設置於下殼體，並連接於第二磁體，且能夠帶動第二磁體旋轉，以使第二磁體在第一狀態和第二狀態之間切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a wireless earphone system including an earbud, a charging case and a direction reverse module. The earbud has a first magnetic body. The interior of lower case of the charging case has a second magnetic body which is provided with a first surface and a second surface with opposite magnetic poles and has a first state and a second state, and the magnetic pole of the first magnetic body is the same as the magnetic pole of the first surface. When the second magnetic body lies in the first state, the first surface approaches the first magnetic body so that the earbud can move in a direction far away from the second magnetic body; when the second magnetic body lies in the second state, the second surface approaches the first magnetic body so that the first magnetic body attracts the second magnetic body. The direction reverse module is movably disposed on the lower case, is connected to the second magnetic body and can drive the second magnetic body to rotate so that the second magnetic body is switched between the first state and the second state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:耳機單體</p>
        <p type="p">11:第一磁體</p>
        <p type="p">21:下殼體</p>
        <p type="p">211:固定座</p>
        <p type="p">22:上殼體</p>
        <p type="p">3:第二磁體</p>
        <p type="p">31:第一表面</p>
        <p type="p">32:第二表面</p>
        <p type="p">41:旋鈕</p>
        <p type="p">42:第一轉軸</p>
        <p type="p">43:旋轉支架</p>
        <p type="p">44:安裝架</p>
        <p type="p">45:連接軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="531px" img-content="tif" inline="yes" orientation="portrait" width="649px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622359</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113244</doc-number>
          <kind></kind>
          <date>114/04/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250416B">F16D65/14</main-classification>
        <further-classification edition="201201320250416B">F16D121/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商立訊智造科技（常熟）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUXSHARE INTELLIGENT MANUFACTURE TECHNOLOGY (CHANGSHU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃子碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZIH-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾柏穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, PO-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳富源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, FU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117299921</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>致動裝置</chinese-title>
        <english-title>ACTUATING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種致動裝置，包括支撐座、擺動臂、制動彈性件、制動件、第一形狀記憶合金線和第二形狀記憶合金線，擺動臂安裝於支撐座，相對於支撐座擺動，制動件通過制動彈性件連接於支撐座，制動彈性件驅動制動件抵靠鎖定擺動臂，第一形狀記憶合金線通電工作時帶動擺動臂擺動，第二形狀記憶合金線通電工作時帶動制動件遠離釋放擺動臂。本發明中，制動件由制動彈性件進行支撐，省略了轉軸和軸承等轉動連接的相關部件和結構，降低了公差要求，使得制動件在保證鎖定效果的基礎上，能夠有效縮小占用空間，壓縮製備成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to actuating apparatus. The actuating aperture includes a support base, a swing arm, a brake elastic member, a brake member, a first shape memory alloy wire and a second shape memory alloy wire. The swing arm is installed on the support base and swings relative to the support base. The brake member is connected to the support base through the brake elastic member. The brake elastic member drives the brake member to against and lock the swing arm. The first shape memory alloy wire drives the swing arm to swing when powered on. The second shape memory alloy wire drives the brake member away and releases the swing arm when powered on. In the present disclosure, the brake member is supported by the brake elastic member, and the related components and structures of the rotation connection such as the rotating shaft and the bearing are omitted. Therefore, the tolerance requirements are lowered, so that the brake member can effectively reduce the occupied space and reduce the manufacturing cost while ensuring the locking effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:支撐座</p>
        <p type="p">2:擺動臂</p>
        <p type="p">3:制動彈性件</p>
        <p type="p">4:制動件</p>
        <p type="p">5:第一形狀記憶合金綫</p>
        <p type="p">6:第二形狀記憶合金綫</p>
        <p type="p">7:擺臂彈性件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="334px" img-content="tif" inline="yes" orientation="portrait" width="507px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622968</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113409</doc-number>
          <kind></kind>
          <date>114/04/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C11/40</main-classification>
        <further-classification edition="200601120260302B">G11C11/54</further-classification>
        <further-classification edition="202501120260302B">H10F39/18</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱郁芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YU-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭安皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, ANHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/962,306</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>A SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構包括基板中的複數個光敏像素，基板之第一側上方的互連結構，記憶體區，其包括形成在互連結構中的複數個記憶體單元，其中互連結構用以將光敏像素耦接至複數個記憶體單元，以及影像信號處理器(ISP)，其經由互連結構耦接至複數個記憶體單元，其中所述ISP用以提供類神經形態計算能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure includes: a plurality of photosensitive pixels in a substrate; an interconnect structure over a first side of the substrate; a memory region including a plurality of memory cells formed in the interconnect structure, wherein the interconnect structure is configured to couple photosensitive pixels to the plurality of memory cells; and an Image Signal Processor (ISP) coupled to the plurality of memory cells via the interconnect structure, wherein the ISP is configured to provide a neuromorphic computing capability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:CIS系統</p>
        <p type="p">102:半導體基板</p>
        <p type="p">104:光敏像素區</p>
        <p type="p">106:記憶體單元區</p>
        <p type="p">108:ISP區</p>
        <p type="p">110:記憶體單元區</p>
        <p type="p">112:像素電晶體</p>
        <p type="p">122:光敏偵測區域</p>
        <p type="p">125:光電二極體層</p>
        <p type="p">131:濾色器</p>
        <p type="p">132:微透鏡</p>
        <p type="p">142:通路電晶體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.png" file="d10022.TIF" giffile="ed10022.png" height="605px" img-content="tif" inline="yes" orientation="portrait" width="964px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621776</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113490</doc-number>
          <kind></kind>
          <date>114/04/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251226B">B01D21/06</main-classification>
        <further-classification edition="200601120251226B">B01D21/24</further-classification>
        <further-classification edition="202301120251226B">C02F1/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商宇都宮工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUNOMIYA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇都宮秀雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUNOMIYA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205709</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>圓形沉澱池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">係具備：俯視圓形之沉澱池本體，係供給有原水；浮渣刮集腕部，係自中心部沿著半徑方向配置於該沉澱池本體之水面，並以該中心部作為中心迴旋；管撇取器，係自中心部沿著半徑方向配置於水面，並具有用以排出浮渣之浮渣接收口；溢流堰，係形成於沉澱池本體之周壁部，使處理水往半徑方向外側溢流；以及壓力流體噴出機構，係於沉澱池本體內對於水中噴出壓力流體，前述壓力流體噴出機構，係具備：流體噴出管，係沿著沉澱池本體之內周面設置；壓力流體供給機構，係對於該流體噴出管供給至少含有空氣之壓力流體；以及複數個噴出口，係於流體噴出管之長度方向隔著間隔配置，噴出壓力流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:圓形沉澱池</p>
        <p type="p">2:沉澱池本體</p>
        <p type="p">3:浮渣刮集腕部</p>
        <p type="p">4:管撇取器</p>
        <p type="p">5:周壁部</p>
        <p type="p">6:溢流堰</p>
        <p type="p">7:底部</p>
        <p type="p">8:汙泥刮集腕部</p>
        <p type="p">9:壓力流體噴出機構</p>
        <p type="p">10:汙泥排出口</p>
        <p type="p">11:筒狀壁</p>
        <p type="p">12:驅動部</p>
        <p type="p">13:垂直軸</p>
        <p type="p">14:排水路</p>
        <p type="p">15:流出渠</p>
        <p type="p">17:阻流板</p>
        <p type="p">21:桿</p>
        <p type="p">22:刮集板</p>
        <p type="p">23:浮渣接收口</p>
        <p type="p">24:管</p>
        <p type="p">25:轉動機構</p>
        <p type="p">26:軌道</p>
        <p type="p">31:流體噴出管</p>
        <p type="p">32:壓力流體供給機構</p>
        <p type="p">34:集管</p>
        <p type="p">35:連接管</p>
        <p type="p">36:供給配管</p>
        <p type="p">41:原水供給管</p>
        <p type="p">W:水面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="432px" img-content="tif" inline="yes" orientation="portrait" width="672px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623446</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113597</doc-number>
          <kind></kind>
          <date>114/04/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/83</main-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑞仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEO IN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權裕珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, YU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴丙洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BYUNG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0103792</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置和製造半導體裝置的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：閘極結構，所述閘極結構包括交替堆疊的多個絕緣層和多個導電層；接觸結構，該接觸結構在所述閘極結構內延伸並且電連接到所述導電層之一；多個第二支撐件，每個第二支撐件包括支柱和突起，所述支柱具有位於所述接觸結構的中心的第一距離內的中心，所述突起在所述支柱和所述多個導電層之間延伸；以及多個第一支撐件，所述多個第一支撐件至少部分地被所述多個突起圍繞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a gate structure including a plurality of conductive layers and a plurality of insulating layers that are alternately stacked; a contact structure extending within the gate structure and electrically connected to one of the conductive layers; a plurality of second supports, each second support including a pillar having a center located within a first distance of a center of the contact structure and protrusions extending between the pillar and the plurality of conductive layers; and a plurality of first supports at least partially surrounded by the plurality of protrusions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:導電層</p>
        <p type="p">12:絕緣層</p>
        <p type="p">16:接觸插塞</p>
        <p type="p">16A:阻擋層</p>
        <p type="p">16B:金屬層</p>
        <p type="p">17:絕緣間隔件</p>
        <p type="p">A-A’:線</p>
        <p type="p">CS:接觸結構</p>
        <p type="p">GST:閘極結構</p>
        <p type="p">LV1:第一高度</p>
        <p type="p">LV2:第二高度</p>
        <p type="p">SP1:第一支撐件</p>
        <p type="p">SP2:第二支撐件</p>
        <p type="p">SP2A:支柱</p>
        <p type="p">SP2B:突起</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="674px" img-content="tif" inline="yes" orientation="portrait" width="794px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622647</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113621</doc-number>
          <kind></kind>
          <date>114/04/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">G03F9/00</main-classification>
        <further-classification edition="200601120260225B">G03F7/20</further-classification>
        <further-classification edition="202301120260225B">G06N3/08</further-classification>
        <further-classification edition="201101120260225B">G06T15/00</further-classification>
        <further-classification edition="200601120260225B">G01B11/26</further-classification>
        <further-classification edition="200601120260225B">G01B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耶提　阿比特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YATI, ARPIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/661,067</doc-number>
          <date>20240618</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/092,074</doc-number>
          <date>20250327</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用設計資料及深度學習分段進行疊對量測之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR OVERLAY MEASUREMENT USING DESIGN DATA AND DEEP LEARNING SEGMENTATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種使用設計資料及深度學習分段進行疊對量測之方法。該方法可將選定設計層呈現為對應於該等設計層之各位點之經呈現設計影像。將一第一設計層呈現為包含一第一位點之一第一經呈現設計影像且將一第二設計層呈現為包含一第二位點之一第二經呈現設計影像。該方法可獲取包含多個層之一樣本之經量測影像。該方法可將一深度學習模型應用於該等經量測影像，以將該等經量測影像分段成一第一經分段層及一第二經分段層。該方法可將一選定經呈現設計影像與一對應經分段層對準。該方法可基於該選定經呈現設計影像與該對應經分段層之間之對準來判定第一層與第二層之間之疊對位移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for overlay measuring using design data and deep learning segmentation is disclosed. The method may render selected design layers as rendered design images corresponding to each site of the design layers. A first design layer is rendered as a first rendered design image including a first site and a second design layer is rendered as a second rendered design image including a second site. The method may acquire measured images of a sample including multiple layers. The method may apply a deep learning model to the measured images to segment the measured images into a first segmented layer and a second segmented layer. The method may align a selected rendered design image with a corresponding segmented layer. The method may determine overlay shift between the first layer and the second layer based on alignment of the selected rendered design image and the corresponding segmented layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:計量系統</p>
        <p type="p">102:成像子系統</p>
        <p type="p">104:控制器</p>
        <p type="p">106:處理器</p>
        <p type="p">108:記憶體</p>
        <p type="p">110:樣本</p>
        <p type="p">112:深度學習模型</p>
        <p type="p">114:使用者介面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="550px" img-content="tif" inline="yes" orientation="portrait" width="758px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622987</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113734</doc-number>
          <kind></kind>
          <date>114/04/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250422B">G16H10/60</main-classification>
        <further-classification edition="201801120250422B">G16H15/00</further-classification>
        <further-classification edition="201801120250422B">G16H80/00</further-classification>
        <further-classification edition="201901120250422B">G06F16/21</further-classification>
        <further-classification edition="202301120250422B">G06N3/08</further-classification>
        <further-classification edition="200601120250422B">G06F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國醫藥大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周德陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, DER-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮文生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, WEN-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳韋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾皓陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, HOW-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林峻頤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JIUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周敬堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHING-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳欣梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HSIN-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,027</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>醫療資料及整合系統</chinese-title>
        <english-title>MEDICAL DATA INTEGRATION AND ANALYSIS SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的醫療資料及整合系統包含複數醫療裝置、病歷資料庫、資料流處理裝置、資料庫管理裝置、人工智慧預測裝置以及視覺化呈現裝置。資料流處理裝置依據資料流主鍵選擇策略選擇每一偵測資料流及病歷資料流的資料流主鍵，並依據餘數將偵測資料流及病歷資料流分配至接收佇列，複製佇列用以複製接收佇列。資料庫管理裝置設定複數資料表主鍵，資料表主鍵與資料流主鍵相同。人工智慧預測裝置取得複數偵測特徵及複數病患特徵以提供預測結果。視覺化呈現裝置視覺化呈現偵測特徵、病患特徵及預測結果。藉此提升醫療裝置的連結以及資料的整合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The medical data integration and analysis system includes a plurality of medical devices, a medical record database, a data flow processing device, a database managing device, an AI predicting device and a vision displaying device. The medical record database selects a data flow key of each detecting data flow and a data flow key of a medical record data flow according to a data flow key selecting strategy, and assigns the detecting data flows and the medical record data flow to a plurality of receiving queues according to remainders. A plurality of replicating queues replicate the receiving queues. The database managing device sets a plurality of data table keys which are respectively identical to the data flow keys. The AI predicting device obtains a plurality of detecting features and a plurality of patient features to provide a predicting result. The vision displaying device displays the detecting features, the patient features and the predicting result. Therefore, the connection and the integration of the medical devices are increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:醫療資料及整合系統</p>
        <p type="p">111,112,113,114:醫療裝置</p>
        <p type="p">120:病歷資料庫</p>
        <p type="p">130:資料流處理裝置</p>
        <p type="p">131:接收佇列</p>
        <p type="p">132:複製佇列</p>
        <p type="p">1331,1332,1333,1334,1335,1336:分配器</p>
        <p type="p">1341,1342,1343,1344,1345,1346:資料轉換模組</p>
        <p type="p">140:資料庫管理裝置</p>
        <p type="p">150:人工智慧預測裝置</p>
        <p type="p">151:資料提取及計算單元</p>
        <p type="p">152:多模型集成預測單元</p>
        <p type="p">153:集成判定單元</p>
        <p type="p">160:視覺化呈現裝置</p>
        <p type="p">161:顯示器</p>
        <p type="p">171,172,173,174,175,176:閘道器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="685px" img-content="tif" inline="yes" orientation="portrait" width="918px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622128</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114113816</doc-number>
          <kind></kind>
          <date>114/04/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C08F14/18</main-classification>
        <further-classification edition="200601120260224B">C08L27/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎浩輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBASAKI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳谷碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGIYA, AOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐橋祐亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHASHI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>織岡真理子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIOKA, MARIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巨勢丈裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSE, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大繼聰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUGU, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部香織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊田瑞菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYODA, MIZUNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-099105</doc-number>
          <date>20240619</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>水性分散液之製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING AQUEOUS DISPERSION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水性分散液之製造方法，係形成一包含氟烯烴系聚合物之粒子及水且不含氟系乳化劑的反應系統，並在前述反應系統中至少使氣態全氟烯烴聚合而獲得包含氟聚合物之粒子的水性分散液；其中，前述反應系統之液體黏度小於2mPa・s；前述水性分散液中所含氟聚合物之粒子之平均粒徑相對於前述氟烯烴系聚合物之粒子之平均粒徑的比值大於1；並且，前述水性分散液中之氟聚合物之粒子含量相對於前述反應系統中之氟烯烴系聚合物之粒子含量的比值為2以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622725</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114069</doc-number>
          <kind></kind>
          <date>114/04/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250502B">G06F3/14</main-classification>
        <further-classification edition="200601120250502B">G06F13/38</further-classification>
        <further-classification edition="200601120250502B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉軒銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XUANMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王飛虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, FEIHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張一凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚嘉祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, JIAQI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯妍君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YENCHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116386725</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>移動裝置</chinese-title>
        <english-title>MOBILE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露是關於一種移動裝置，其中的影像處理電路電性連接至兩個匯流排。處理器透過第二匯流排傳送指令以及反矩陣的多個係數給影像處理電路，此指令用以指示對輸入影像執行轉換程序。影像處理電路根據反矩陣以及輸出像素的座標計算輸入影像的輸入像素的座標，藉此透過第一匯流排從記憶體讀取輸入像素。影像處理電路還透過第一匯流排將輸出像素寫入至記憶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure is related to a mobile device, wherein an image processing circuit is electrically connected to two buses. A processor transmits an instruction and multiple coefficients of an inverse matrix to the image processing circuit through the second bus. The instruction indicates the execution of a transformation process on an input image. Based on the inverse matrix and the coordinates of an output pixel, the image processing circuit calculates the coordinates of an input pixel of the input image, thereby reading the input pixel from a memory through the first bus. The image processing circuit also writes the output pixel to the memory through the first bus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:移動裝置</p>
        <p type="p">110:處理器</p>
        <p type="p">120:第一匯流排</p>
        <p type="p">130:橋接器</p>
        <p type="p">140:第二匯流排</p>
        <p type="p">150:非同步橋接器</p>
        <p type="p">160:顯示器控制器</p>
        <p type="p">170:影像處理電路</p>
        <p type="p">181~183:記憶體</p>
        <p type="p">190:外部裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="630px" img-content="tif" inline="yes" orientation="portrait" width="875px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622803</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114122</doc-number>
          <kind></kind>
          <date>114/04/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250701B">G06N3/06</main-classification>
        <further-classification edition="202301120250701B">G06N3/063</further-classification>
        <further-classification edition="202301120250701B">G06N3/04</further-classification>
        <further-classification edition="202301120250701B">G06N3/048</further-classification>
        <further-classification edition="200601120250701B">G06F9/302</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯文昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHWA, WIN-SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂樂　艾許文　桑傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LELE, ASHWIN SANJAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張孟凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MENG-FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/951,576</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>運算裝置及其運算方法</chinese-title>
        <english-title>COMPUTING DEVICE AND COMPUTING METHODS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電路，用於將神經網路中的輸入資料變換為輸出資料，並包含相互連接之算術邏輯電路及控制電路，該控制電路在一或多個週期內發送配置設定序列以配置相互連接之算術邏輯電路。算術邏輯電路對輸入資料聯合執行softmax運算或S形線性單元運算之至少一者。相互連接之算術邏輯電路包含產生輸入的小數部分之第一指數及輸入的整數部分之第二指數的指數電路、將第一指數與第二指數相乘為第一中間變量的乘法器電路、對與多個輸入之指數相關的多個中間變量進行求和的累加器電路、及產生輸入至倒數電路的第二中間變量之倒數的倒數電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A circuit is configured for transforming input data in a neural network to output data, and includes inter-connected arithmetic logic circuits and a control circuit sending a sequence of configuration settings to configure the inter-connected arithmetic logic circuits over one or more cycles. The inter-connected arithmetic logic circuits jointly perform at least one of a softmax or a sigmoidal linear unit (SiLU) operation on the input data. The inter-connected arithmetic logic circuits include an exponential circuit generating a first exponential of a fractional part of an input and a second exponential of an integer part of the input, a multiplier circuit multiplying the first exponential and the second exponential into a first intermediate variable, an accumulator circuit summing multiple intermediate variables relating to exponentials of multiple inputs, and a reciprocal circuit generating a reciprocal of a second intermediate variable that is input to the reciprocal circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:神經網路模型</p>
        <p type="p">102:輸入資料</p>
        <p type="p">105:神經元</p>
        <p type="p">110:層</p>
        <p type="p">115:logits/對數勝算</p>
        <p type="p">120:softmax運算</p>
        <p type="p">130:輸出資料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="602px" img-content="tif" inline="yes" orientation="portrait" width="952px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622144</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114182</doc-number>
          <kind></kind>
          <date>114/04/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C08G59/40</main-classification>
        <further-classification edition="200601120260223B">C08L63/00</further-classification>
        <further-classification edition="200601120260223B">B32B27/38</further-classification>
        <further-classification edition="200601120260223B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仲野暦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, REKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, ISAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村嘉生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, YOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-099051</doc-number>
          <date>20240619</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供一種樹脂組成物，儘管其線熱膨脹係數低，仍會具有良好的機械特性，進一步可以形成膠渣去除性及膠黏性亦優良的硬化物。  &lt;br/&gt;　　解決手段係一種樹脂組成物，其含有：(A)環氧樹脂、(B)馬來醯亞胺樹脂及/或聚醯亞胺樹脂，及(C)無機填充材，  &lt;br/&gt;　　(A)成分含有：(A-1)常溫下為液狀之環氧樹脂及  &lt;br/&gt;　　(A-2)聯苯酚骨架環氧樹脂，  &lt;br/&gt;　　(A)成分中之全部環氧基之莫耳數X與(A-1)成分之環氧基之莫耳數x之比x/X係0.4~0.9，  &lt;br/&gt;　　將樹脂成分設為100質量%之情形，(B)成分之含量係7~30質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623369</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114239</doc-number>
          <kind></kind>
          <date>114/04/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D1/62</main-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W29/00</further-classification>
        <further-classification edition="202601120260302B">H10W10/10</further-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭茹雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, RU-SHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余科京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KEJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭安皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, ANHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/960,632</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：第一基板，包括彼此相對的第一側及第二側；第二基板，包括彼此相對的第一側及第二側；磊晶結構；閘極結構，位於第一基板的第一側上；第一金屬層及第二金屬層，位於第二基板的第一側上；介電層，插入於第一金屬層與第二金屬層之間；及接合層，插入於第一基板的第二側與第二基板的第二側之間。第一金屬層及第二金屬層以及介電層可操作地形成電容器，電容器耦接至第一基板的第一側上的至少一磊晶結構。第一金屬層及第二金屬層以及介電層中的各者包括朝向或遠離第一基板延伸的豎直部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first substrate including first and second sides opposite to each other, a second substrate including first and second sides opposite to each other, epitaxial structures, a gate structure on the first side of the first substrate, a first metal layer and a second metal layer on the first side of the second substrate, a dielectric layer interposed between the first and second metal layers, and a bonding layer interposed between the second side of the first substrate and the second side of the second substrate. The first and second metal layers, and the dielectric layer operatively form a capacitor that is coupled to at least one epitaxial structure on the first side of the first substrate. Each of the first and second metal layers, and the dielectric layer includes a vertical portion extending toward or away from the first substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:第一基板</p>
        <p type="p">111:第一側</p>
        <p type="p">112:第二側</p>
        <p type="p">120:第二基板</p>
        <p type="p">121:第一側</p>
        <p type="p">122:第二側</p>
        <p type="p">130:磊晶結構</p>
        <p type="p">140:閘極結構</p>
        <p type="p">150:金屬化層</p>
        <p type="p">150A:金屬化層</p>
        <p type="p">150B:金屬化層</p>
        <p type="p">160:電容器</p>
        <p type="p">161:第一金屬層</p>
        <p type="p">161L:側向部分</p>
        <p type="p">161V:豎直部分</p>
        <p type="p">162:第二金屬層</p>
        <p type="p">162L:側向部分</p>
        <p type="p">162V:豎直部分</p>
        <p type="p">167:介電層</p>
        <p type="p">167L:側向部分</p>
        <p type="p">167V:豎直部分</p>
        <p type="p">CT:接觸結構</p>
        <p type="p">EPI:磊晶結構</p>
        <p type="p">FEOL:前段製程</p>
        <p type="p">ILD1層間介電結構</p>
        <p type="p">MG:閘極結構</p>
        <p type="p">VB-1:通孔結構</p>
        <p type="p">VB-2:通孔結構</p>
        <p type="p">VB-3:通孔結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="721px" img-content="tif" inline="yes" orientation="portrait" width="744px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622361</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114114353</doc-number>
          <kind></kind>
          <date>114/04/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260220B">F04B49/06</main-classification>
        <further-classification edition="200601120260220B">G05B13/04</further-classification>
        <further-classification edition="200601120260220B">F04B39/06</further-classification>
        <further-classification edition="201901120260220B">G06N20/00</further-classification>
        <further-classification edition="200601120260220B">F24D19/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比利時商亞特拉斯可波克氣動股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATLAS COPCO AIRPOWER, NAAMLOZE VENNOOTSCHAP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡黎特　佛里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN RIET, FREEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范羅伊　維姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN ROY, WIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>比利時</country>
          <doc-number>BE 2024/5841</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>控制具有熱回收系統的壓縮機設備之方法、設置有執行該方法之控制演算法之控制器以及設置有該控制器的熱回收系統之壓縮機設備</chinese-title>
        <english-title>METHOD FOR CONTROLLING A COMPRESSOR INSTALLATION WITH A HEAT RECOVERY SYSTEM, A CONTROLLER PROVIDED WITH A CONTROL ALGORITHM TO CARRY OUT SUCH A METHOD AND COMPRESSOR INSTALLATION WITH A HEAT RECOVERY SYSTEM PROVIDED WITH SUCH A CONTROLLER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於控制壓縮機設備(1)之方法，該壓縮機設備(1)包括一壓縮機裝置(2)及一熱回收系統(3)，該熱回收系統(3)將回收熱量提供至一熱網路(7)，因此該方法包括以下步驟：&lt;br/&gt;  提供該壓縮機裝置(2)及該熱回收系統(3)的數學模型(22)；&lt;br/&gt;  提供電力成本(24)及/或該熱網路(7)的成本(24)；&lt;br/&gt;  提供壓縮氣體的期望壓力(26)及該熱網路(7)的期望溫度(27)；&lt;br/&gt;  提供一控制演算法(28)，以控制壓縮機裝置(2)的速度及該熱回收系統(3)中的流量，&lt;br/&gt;  因此該控制演算法(28)可確定該熱回收系統(3)中的流量及該壓縮機裝置(2)的速度之一控制順序(29)，從而考慮該電力成本(24)及/或透過該熱網路(7)加熱的該成本，使得總運轉成本為最少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Method for controlling a compressor installation (1), comprising a compressor device (2) and a heat recovery system (3) that and provides recovered heat to a heat network (7), whereby it comprises the steps of:&lt;br/&gt; providing mathematical models (22) of the compressor device (2) and the heat recovery system (3);&lt;br/&gt; providing the costs (24) of electricity, and/or the costs (24) of the heat network (7);&lt;br/&gt; providing the desired pressure (26) of compressed gas and the desired temperature (27) of the heat network (7);&lt;br/&gt; providing a control algorithm (28) that controls the speed of the compressor device (2) and the flow in the heat recovery system (3);&lt;br/&gt; whereby the control algorithm (28) will determine, a control sequence (29) of the flow in the heat recovery system (3) and of the speed of the compressor device (2), thereby taking into account the cost (24) of electricity, and/or the costs (24) of heating by the heat network (7), such that the total operational cost is minimal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:壓縮機設備</p>
        <p type="p">2:壓縮機裝置</p>
        <p type="p">3:熱回收系統</p>
        <p type="p">3':水冷卻系統</p>
        <p type="p">4:壓力網路</p>
        <p type="p">5:壓力容器</p>
        <p type="p">6:驅動器</p>
        <p type="p">7:熱網路</p>
        <p type="p">8:熱能生產單元</p>
        <p type="p">9:第一泵</p>
        <p type="p">10:熱交換器</p>
        <p type="p">11:備用冷卻器</p>
        <p type="p">12:旁通管</p>
        <p type="p">13:三通閥</p>
        <p type="p">14:控制器</p>
        <p type="p">15:加熱器</p>
        <p type="p">16:熱能儲存槽</p>
        <p type="p">17:第二泵</p>
        <p type="p">18:吹洩閥</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="912px" img-content="tif" inline="yes" orientation="portrait" width="679px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622495</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115098</doc-number>
          <kind></kind>
          <date>114/04/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260228B">G01N23/223</main-classification>
        <further-classification edition="200601120260228B">H01J37/301</further-classification>
        <further-classification edition="200601120260228B">H01J35/18</further-classification>
        <further-classification edition="200601120260228B">H01J35/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商布魯克科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRUKER TECHNOLOGIES LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沛雷　艾薛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PELED, ASHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡莫　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROKHMAL, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃明頓　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WORMINGTON, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/649,378</doc-number>
          <date>20240519</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>大氣環境中樣品發出之低能量X射線螢光之分析</chinese-title>
        <english-title>ANALYSIS OF LOW-ENERGY X-RAY FLUORESCENCE EMITTED FROM SAMPLE IN ATMOSPHERIC ENVIRONMENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於X射線分析之系統，該系統包含：(a)一X射線分析總成，其(i)安置於經組態以維持一受控第一壓力之一X射線圍封殼中，且(ii)經組態以引導一第一X射線束朝向處於與該第一壓力不同之一第二壓力下之定位於該X射線圍封殼外部之一樣品，且產生指示回應於該第一X射線束照射於該樣品上而自該樣品發出之一第二X射線束之一信號；及(b)一窗口總成，其安置於該X射線分析總成與該樣品之間且經組態以(i)密封該X射線圍封殼以維持該等第一與第二壓力之間之一壓力差，且(ii)使該等第一及第二X射線束通過，且該窗口總成包含由對該等第一及第二X射線束透明之一材料製成之一窗口層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for X-ray analysis, the system includes: (a) an X-ray analysis assembly, which is (i) disposed in an X-ray enclosure configured to maintain a controlled first pressure, and (ii) configured to direct a first X-ray beam toward a sample positioned out of the X-ray enclosure at a second pressure different from the first pressure, and to produce a signal indicative of a second X-ray beam emitted from the sample in response to the first X-ray beam impinging on the sample, and (b) a window assembly, which is disposed between the X-ray analysis assembly and the sample and is configured to (i) seal the X-ray enclosure to maintain a pressure difference between the first and second pressures, and (ii) pass the first and second X-ray beams, and the window assembly includes a window layer made from a material transparent to the first and second X-ray beams.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:X射線分析總成</p>
        <p type="p">11:X射線分析系統</p>
        <p type="p">12:X射線源</p>
        <p type="p">13:表面/外表面</p>
        <p type="p">14:X射線光學器件</p>
        <p type="p">15:真空腔室/腔室</p>
        <p type="p">16:X射線偵測器</p>
        <p type="p">18:距離感測器</p>
        <p type="p">19:插圖</p>
        <p type="p">20:電腦</p>
        <p type="p">21:卡盤</p>
        <p type="p">22:處理器</p>
        <p type="p">23:X射線束</p>
        <p type="p">24:介面</p>
        <p type="p">25:光束</p>
        <p type="p">26:電力供應單元(PSU)</p>
        <p type="p">29:表面/外表面</p>
        <p type="p">30:樣品</p>
        <p type="p">31:表面</p>
        <p type="p">32:經塑形光點</p>
        <p type="p">33:窗口總成</p>
        <p type="p">34:厚度</p>
        <p type="p">36:開口</p>
        <p type="p">39:表面</p>
        <p type="p">40:電動載物台</p>
        <p type="p">44:層</p>
        <p type="p">52:電纜</p>
        <p type="p">55:窗口層</p>
        <p type="p">66:距離</p>
        <p type="p">67:外徑</p>
        <p type="p">77:厚度</p>
        <p type="p">88:基於磁性之電荷陷阱(MT)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="1048px" img-content="tif" inline="yes" orientation="portrait" width="735px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623496</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115405</doc-number>
          <kind></kind>
          <date>114/04/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250516B">H10K59/122</main-classification>
        <further-classification edition="202301120250516B">H10K50/805</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李炳淏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BEONGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0169650</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包含：基板，包含顯示區域及圍繞其之非顯示區域，顯示區域具有包含第一、第二及第三子像素之子像素；第一電極，設置於基板上之各子像素中；堤岸，設置於第一電極上、位於相鄰之子像素之間的邊界、覆蓋第一電極上表面的周邊部分，且包含位於第一電極上之第一堤岸及位於第一堤岸上之第二堤岸；及有機層，設置於第一電極與堤岸上並延伸橫跨子像素，第一堤岸包含與第二堤岸重疊之重疊部分，及被第二堤岸曝露並包含側表面之第一曝露部分，且堤岸包含從堤岸之上表面形成為凹陷之凹槽部分及於平面視角中圍繞第一曝露部分之分隔部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device according to an embodiment includes a substrate including a display area having a plurality of sub-pixels including a first sub-pixel, a second sub-pixel, and a third sub-pixel, and a non-display area surrounding the display area, a first electrode disposed in each of the sub-pixels on the substrate, a bank disposed on the first electrode, positioned at a boundary between adjacent sub-pixels, covering a peripheral portion of an upper surface of the first electrode, and including a first bank on the first electrode and a second bank on the first bank, and an organic layer disposed on the first electrode and the bank, and extending across the plurality of sub-pixels, wherein the first bank includes an overlapping portion overlapping with the second bank, and a first exposed portion exposed by the second bank and including a side surface, and wherein the bank includes a groove portion formed to be recessed from an upper surface of the bank, and a separation portion surrounding the first exposed portion in a plan view.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示面板</p>
        <p type="p">DA:顯示區域</p>
        <p type="p">NDA:非顯示區域</p>
        <p type="p">NDA_S:感測器非顯示區域</p>
        <p type="p">SH1,SH2:感測器孔</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">MR:主區域</p>
        <p type="p">SR:子區域</p>
        <p type="p">BR:彎曲區域</p>
        <p type="p">CSP:裂紋檢測圖案</p>
        <p type="p">DIC:資料驅動器</p>
        <p type="p">GIP:閘極驅動單元</p>
        <p type="p">VSSL:低電位電壓線</p>
        <p type="p">PA1:第一接墊區域</p>
        <p type="p">PA2:第二接墊區域</p>
        <p type="p">SH1,SH2:感測器孔</p>
        <p type="p">PX:像素</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="962px" img-content="tif" inline="yes" orientation="portrait" width="779px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623592</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115580</doc-number>
          <kind></kind>
          <date>114/04/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/72</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅津智樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMETSU, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池口雅文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEGUCHI, MASAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>刑部有紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSAKABE, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木健介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳志旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-128906</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>靜電吸盤</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種可抑制處理中的基板的面內溫度分布的不均之靜電吸盤。&lt;br/&gt;本發明的解決手段為一種靜電吸盤10，包含：介電質基板100，具有載置面之面110；底板200，在內部形成有冷媒流道270，接合於介電質基板100。當從面110到底板200之中與載置面相反側的面220的距離為T1，從面110到冷媒流道270的距離為D1時，在該靜電吸盤10中D1＞T1/2成立。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:靜電吸盤</p>
        <p type="p">100:介電質基板</p>
        <p type="p">110、120、210、220:面</p>
        <p type="p">111:封環</p>
        <p type="p">112:點</p>
        <p type="p">116:底面</p>
        <p type="p">140、240:供給流道</p>
        <p type="p">200:底板</p>
        <p type="p">250:分配流道</p>
        <p type="p">270:冷媒流道</p>
        <p type="p">300:接合層</p>
        <p type="p">D1、D2、D3、T1、T2:距離</p>
        <p type="p">DL1、DL2:一點鏈線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="1039px" img-content="tif" inline="yes" orientation="portrait" width="618px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621984</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115608</doc-number>
          <kind></kind>
          <date>114/04/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120250602B">C01B32/20</main-classification>
        <further-classification edition="201001120250602B">H01M4/133</further-classification>
        <further-classification edition="201001120250602B">H01M4/587</further-classification>
        <further-classification edition="200601120250602B">H01M4/62</further-classification>
        <further-classification edition="201001120250602B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商貝特瑞新材料集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BTR NEW MATERIAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊玉梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周海輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, HAIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任建國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, JIANGUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃友元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YOUYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀雪琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, XUEQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117421389</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>負極材料、負極片和二次電池</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種負極材料、負極片和二次電池，其涉及電化學儲能領域。所述負極材料包括內核和設於內核的至少部分表面的包覆層，所述包覆層包括聚合物，負極材料的紅外光譜在1320±10 cm&lt;sup&gt;-1&lt;/sup&gt;至1880±10 cm&lt;sup&gt;-1&lt;/sup&gt;的波數範圍內存在第一特徵峰、第二特徵峰和第三特徵峰，第一特徵峰為-CH&lt;sub&gt;2&lt;/sub&gt;鍵的彎曲振動峰，第二特徵峰為C-N鍵的伸縮振動峰，第三特徵峰為C=C鍵的伸縮振動峰，第一特徵峰與第三特徵峰的峰面積之比為Z，Z為0.35至0.8。負極片和二次電池包括該負極材料，二次電池具有較高的首次庫倫效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電極組件</p>
        <p type="p">101:正極片</p>
        <p type="p">102:負極片</p>
        <p type="p">103:隔離膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="461px" img-content="tif" inline="yes" orientation="portrait" width="609px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623447</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115647</doc-number>
          <kind></kind>
          <date>114/04/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/83</main-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="200601120260302B">B82B3/00</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹芸碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, YUN-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳仕傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SHIH-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳以雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, I-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李振銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王美勻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MEI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,247</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/074,083</doc-number>
          <date>20250307</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的半導體結構包括背側介電層；背側蝕刻停止層位於背側介電層上；第一源極/汲極結構與第二源極/汲極結構，位於背側蝕刻停止層上並沿著第一方向彼此分開；前側源極/汲極接點位於第一源極/汲極結構與第二源極/汲極結構上；背側接點結構穿過背側介電層與背側蝕刻停止層以耦接至第一源極/汲極結構；穿通孔延伸穿過背側介電層與背側蝕刻停止層；基底鰭狀物位於背側蝕刻停止層與第二源極/汲極結構之間；以及隔離結構包括沿著基底鰭狀物的側壁延伸的部分。背側接點結構與背側介電層中的穿通孔交界，且隔離結構包括氧化物為主的材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure according to the present disclosure includes a semiconductor structure including a backside dielectric layer, a backside etch stop layer (ESL) over the backside dielectric layer, a first source/drain feature and a second source/drain feature over the backside ESL and spaced apart from one another along a first direction, a frontside source/drain contact disposed over the first source/drain feature and the second source/drain feature, a backside contact feature through the backside dielectric layer and the backside ESL to couple to the first source/drain feature, a through via extending through the backside dielectric layer and the backside ESL, a base fin between the backside ESL and the second source/drain feature; and an isolation feature including a portion extending along sidewalls of the base fin. The backside contact feature interfaces the through via in the backside dielectric layer and the isolation feature includes an oxide-based material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:前驅結構</p>
        <p type="p">200B:背側</p>
        <p type="p">200F:前側</p>
        <p type="p">202B:基底鰭狀物</p>
        <p type="p">204:隔離結構</p>
        <p type="p">206:接點蝕刻停止層</p>
        <p type="p">208:第一層間介電層</p>
        <p type="p">210:閘極間隔物</p>
        <p type="p">212:第一蝕刻停止層</p>
        <p type="p">214:第二層間介電層</p>
        <p type="p">222:緩衝磊晶層</p>
        <p type="p">224:底部氮化物層</p>
        <p type="p">226:第一源極/汲極結構</p>
        <p type="p">227:第二源極/汲極結構</p>
        <p type="p">228:矽化物結構</p>
        <p type="p">230:前側接點</p>
        <p type="p">232:第一金屬間介電層</p>
        <p type="p">234:第二金屬間介電層</p>
        <p type="p">236:第一前側金屬線路</p>
        <p type="p">238:第三金屬間介電層</p>
        <p type="p">240:第一前側接點通孔</p>
        <p type="p">242:第二蝕刻停止層</p>
        <p type="p">244:第四金屬間介電層</p>
        <p type="p">246:接點結構</p>
        <p type="p">247:背側蝕刻停止層</p>
        <p type="p">248:背側介電層</p>
        <p type="p">256:穿通孔腳</p>
        <p type="p">264:背側接點腳</p>
        <p type="p">266:合併導電結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="656px" img-content="tif" inline="yes" orientation="portrait" width="902px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623679</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115777</doc-number>
          <kind></kind>
          <date>114/04/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/30</main-classification>
        <further-classification edition="202601120260302B">H10W40/25</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁正庸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, ZHENG-YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭羽筠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YU-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林耕竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KENG-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉韋廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, WEI-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王怡蒨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YI-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/794,585</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於形成接合結構的方法以及接合結構</chinese-title>
        <english-title>METHOD FOR FORMING A BONDED STRUCTURE AND A BONDED STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容說明一種接合半導體結構以及一種形成接合半導體結構的方法。該接合半導體結構包括以一結合結構接合的第一及第二基體。該結合結構在第一與第二基體之間提供高熱傳導率及高接合強度。該結合結構包括接合層及黏著層，該等接合層包括氧化鈦且該等黏著層包括氮化鈦。該方法包括在該第一基體上形成一第一黏著層且在該第二基體上形成一第二黏著層。該方法亦包括在該第一黏著層上形成一第一接合層且在該第二黏著層上形成一第二接合層。該方法更包括藉由將該等第一及第二接合層接合在一起來接合該等第一及第二基體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes a bonded semiconductor structure and a method of forming the bonded semiconductor structure. The bonded semiconductor structure includes first and second substrates bonded with a bonding structure. The bonding structure provides high thermal conductivity and high bonding strength between the first and second substrates. The bonding structure includes bonding layers and adhesion layers, with the bonding layers including titanium oxide and the adhesion layers including titanium nitride. The method includes forming a first adhesion layer on the first substrate and a second adhesion layer on the second substrate. The method also includes forming a first bonding layer on the first adhesion layer and a second bonding layer on the second adhesion layer. The method further includes bonding the first and second substrates by bonding the first and second bonding layers together.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:接合結構，結構</p>
        <p type="p">110:第一基體</p>
        <p type="p">120:半導體基體，基體</p>
        <p type="p">125:層間介電質</p>
        <p type="p">130:中段層，MEOL層</p>
        <p type="p">140:後段層，BEOL層</p>
        <p type="p">142:金屬線</p>
        <p type="p">144:金屬通孔</p>
        <p type="p">150:介電層</p>
        <p type="p">156:半導體裝置</p>
        <p type="p">160:結合結構</p>
        <p type="p">170:第二基體，載體基體</p>
        <p type="p">180:熱</p>
        <p type="p">200:結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="651px" img-content="tif" inline="yes" orientation="portrait" width="719px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623443</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115829</doc-number>
          <kind></kind>
          <date>114/04/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120251203B">H10D84/82</main-classification>
        <further-classification edition="202501120251203B">H10D30/47</further-classification>
        <further-classification edition="202501120251203B">H10D62/10</further-classification>
        <further-classification edition="202501120251203B">H10D62/824</further-classification>
        <further-classification edition="202501120251203B">H10D64/20</further-classification>
        <further-classification edition="200601120251203B">H02H3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴昱安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YI-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHERN, CHAN-HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯蘇　斯帝芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUSU, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,042</doc-number>
          <date>20241126</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/061,074</doc-number>
          <date>20250224</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可以與GaN高電壓裝置整合的保護電路，包括由串聯連接在信號輸入和參考輸入之間的正向觸發的場效電晶體(FET)和反向觸發的FET所組成的主要放電路徑。包含正向整流器的第一分壓器網路和包含反向整流器的第二分壓器網路連接在介於信號輸入和參考輸入之間。正向觸發的FET的閘極耦合到第一分壓器網路的中間節點，允許它接收介於信號輸入和參考輸入之間的中間電壓。在第一分壓器網路中的至少一個正向整流器保護閘極免受來自參考輸入處的電壓尖峰。類似地，反向觸發的FET的閘極耦合到第二分壓器網路的中間節點，提供類似的保護和電壓控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A protection circuit that can be integrated with a GaN high-voltage device includes a main discharge path composed of a forward-triggering field-effect transistor (FET) and a reverse-triggering FET, connected in series between a signal input and a reference input. A first voltage-divider network comprising forward-oriented rectifiers and a second voltage-divider network comprises reverse-oriented rectifiers are connected between the signal input and the reference input. The gate of the forward-triggering FET is coupled to an intermediate node of the first voltage-divider network, allowing it to receive a voltage that is intermediate between the signal input and the reference input. At least one forward-oriented rectifier in the first voltage-divider network, protects the gate from voltage spikes originating at the reference input. Similarly, the gate of the reverse-triggering FET is coupled to an intermediate node of the second voltage-divider network, providing analogous protection and voltage control.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:保護電路</p>
        <p type="p">101:輸入端子</p>
        <p type="p">105:參考端子</p>
        <p type="p">109:輸入信號線路</p>
        <p type="p">113:第一分壓器網路</p>
        <p type="p">115:第一部分</p>
        <p type="p">117:整流器</p>
        <p type="p">117a:整流器</p>
        <p type="p">117b:整流器</p>
        <p type="p">119:反向觸發的場效電晶體</p>
        <p type="p">123:閘極</p>
        <p type="p">127:浮動節點</p>
        <p type="p">131:正向觸發的場效電晶體</p>
        <p type="p">135:閘極</p>
        <p type="p">137:節點</p>
        <p type="p">139:第二部分</p>
        <p type="p">141:參考信號線路</p>
        <p type="p">145:高電壓裝置</p>
        <p type="p">147:節點</p>
        <p type="p">149:第二分壓器網路</p>
        <p type="p">159:高電壓源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="644px" img-content="tif" inline="yes" orientation="portrait" width="792px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622935</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115882</doc-number>
          <kind></kind>
          <date>114/04/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250514B">G09G3/20</main-classification>
        <further-classification edition="200601120250514B">G01R27/02</further-classification>
        <further-classification edition="202101120250514B">G01K13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲境</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHE-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖仁豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, JEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,544</doc-number>
          <date>20241121</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2025101354285</doc-number>
          <date>20250207</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於顯示面板的溫度管理方法、積體電路和顯示面板</chinese-title>
        <english-title>TEMPERATURE MANAGEMENT METHOD, INTEGRATED CIRCUIT FOR DISPLAY PANEL, AND DISPLAY PANEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及提供一種用於顯示面板的溫度管理方法，該方法由顯示驅動積體電路執行，包括：由顯示驅動積體電路檢測所述顯示面板的邊緣電阻線的阻抗值，所述邊緣電阻線沿所述顯示面板的邊緣進行布置；以及由顯示驅動積體電路基於所述邊緣電阻線的阻抗值來確定所述顯示面板的溫度信息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a temperature management method for a display panel, the method is performed by a display driver integrated circuit and includes detecting, by the display driver integrated circuit, an impedance value of an edge resistance line of the display panel, wherein the edge resistance line is arranged along the edge of the display panel; and determining, by the display driver integrated circuit, temperature information of the display panel based on the impedance value of the edge resistance line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">401,402,403:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="487px" img-content="tif" inline="yes" orientation="portrait" width="644px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623406</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114115932</doc-number>
          <kind></kind>
          <date>114/04/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/10</main-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202501120260302B">H10D30/60</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
        <further-classification edition="200601120260302B">B82B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李坤全</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUN-CHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宗熺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, TSUNG-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白易芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, YI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱德安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TE-AN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭紫微</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWOK, TSZ-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游明華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李啟弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHII-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,669</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/066,686</doc-number>
          <date>20250228</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">方法包括：形成複數個半導體奈米結構。半導體奈米結構中的上半導體奈米結構與半導體奈米結構中的相應下半導體奈米結構重疊。方法進一步包括以下步驟：在半導體奈米結構旁邊形成源極/汲極凹槽，其中源極/汲極凹槽具有中間垂直線。第一半導體層由半導體奈米結構形成，其中第一半導體層具有導電類型的掺雜劑，且導電類型為p型或n型。第二半導體層形成在第一半導體層上方，其中第二半導體層具有與中間垂直線對準的垂直細長高掺雜區域。矽化物區域形成在第二半導體層上方且電耦合至第二半導體層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a plurality of semiconductor nanostructures. Upper ones of the plurality of semiconductor nanostructures overlap respective lower ones of the plurality of semiconductor nanostructures. The method further includes forming a source/drain recess aside of the plurality of semiconductor nanostructures, wherein the source/drain recess has a middle vertical line. A first semiconductor layer is formed from the plurality of semiconductor nanostructures, wherein the first semiconductor layer has a dopant of a conductivity type, and the conductivity type is p-type or n-type. A second semiconductor layer is formed over the first semiconductor layer, wherein the second semiconductor layer has a vertical-and-elongated high-dopant region aligned to the middle vertical line. A silicide region is formed over and electrically coupling to the second semiconductor layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板</p>
        <p type="p">22B:第二層/半導體層/奈米結構</p>
        <p type="p">38:閘極間隔物</p>
        <p type="p">44:內間隔物</p>
        <p type="p">47:區域</p>
        <p type="p">48:源極/汲極區域</p>
        <p type="p">48A:半導體層/半導體區域</p>
        <p type="p">48B:半導體層/半導體區域</p>
        <p type="p">48C:半導體層/覆蓋層</p>
        <p type="p">48HP:高掺雜區域</p>
        <p type="p">49:介電層</p>
        <p type="p">50:CESL</p>
        <p type="p">51:中介層</p>
        <p type="p">52:ILD</p>
        <p type="p">62:閘極介電層</p>
        <p type="p">68:閘電極</p>
        <p type="p">70:閘極堆疊</p>
        <p type="p">78:矽化物區域</p>
        <p type="p">80B:接觸插塞/觸點</p>
        <p type="p">82:電晶體</p>
        <p type="p">114:中心線/中間垂直線</p>
        <p type="p">L&lt;sub&gt;bottom&lt;/sub&gt;:L&lt;sub&gt;底部&lt;/sub&gt;</p>
        <p type="p">L&lt;sub&gt;HP&lt;/sub&gt;:高度</p>
        <p type="p">W&lt;sub&gt;HP&lt;/sub&gt;:寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10057.png" file="d10057.TIF" giffile="ed10057.png" height="731px" img-content="tif" inline="yes" orientation="portrait" width="821px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623429</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116013</doc-number>
          <kind></kind>
          <date>114/04/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田子容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, TZU JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張任遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/954,628</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝及其形成的方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種半導體封裝及其形成方法。此方法包括沉積接合層，在接合層中形成第一開口，在第一開口的暴露表面上沉積導電層，以及形成從第一開口的底部延伸的第二開口。第二開口的尺寸小於第一開口的尺寸。此方法還包括在第一開口和第二開口的暴露表面上沉積阻障層，並執行電化學鍍覆製程以用金屬層填充第一開口和第二開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package and methods of forming the same are provided. The method includes depositing a bonding layer, forming a first opening in the bonding layer, depositing a conductive layer on exposed surfaces of the first opening, and forming a second opening extending from a bottom of the first opening. The second opening has a smaller dimension than a dimension of the first opening. The method further includes depositing a barrier layer on exposed surfaces of the first opening and the second opening and performing an electrochemical plating process to fill the first opening and the second opening with a metal layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">156&lt;sub&gt;&lt;i&gt;T&lt;/i&gt;&lt;/sub&gt;:頂部接合層(接合層)</p>
        <p type="p">300:介電層</p>
        <p type="p">302:再分佈層</p>
        <p type="p">304:接合層</p>
        <p type="p">308:導電層</p>
        <p type="p">316:阻障層</p>
        <p type="p">318:金屬層</p>
        <p type="p">322:頂表面</p>
        <p type="p">324:側表面</p>
        <p type="p">326:底表面</p>
        <p type="p">328:側表面</p>
        <p type="p">330:底表面</p>
        <p type="p">BPM:接合墊金屬</p>
        <p type="p">BPV:接合墊導孔</p>
        <p type="p">H&lt;sub&gt;1&lt;/sub&gt;:高度</p>
        <p type="p">H&lt;sub&gt;2&lt;/sub&gt;:高度</p>
        <p type="p">T&lt;sub&gt;1&lt;/sub&gt;:厚度</p>
        <p type="p">T&lt;sub&gt;2&lt;/sub&gt;:厚度</p>
        <p type="p">X:方向</p>
        <p type="p">Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.png" file="d10024.TIF" giffile="ed10024.png" height="552px" img-content="tif" inline="yes" orientation="portrait" width="749px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621554</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116084</doc-number>
          <kind></kind>
          <date>114/04/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250530B">A01G9/02</main-classification>
        <further-classification edition="201801120250530B">A01G9/029</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DING FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DING FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113144235</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>植栽器皿</chinese-title>
        <english-title>PLANTING VESSELS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係為一種具有延伸尺寸長度的植栽器皿，以塑膠器皿具有延長的功用，有利於在不同地方區域調整所需的長度進行植栽，更重要的是利於植栽換盆填土時的施作，在不同的寛度大量減少土壤高度，以達到減土壤節水的功能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is a planting container with an extended length. The plastic container has an extended function, which is conducive to adjusting the required length for planting in different local areas. More importantly, it is conducive to the operation of repotting and filling the soil for planting, and the soil height can be greatly reduced at different widths to achieve the function of reducing soil and saving water.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:植栽器皿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="416px" img-content="tif" inline="yes" orientation="portrait" width="578px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622802</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116344</doc-number>
          <kind></kind>
          <date>114/04/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250909B">G06N3/048</main-classification>
        <further-classification edition="202301120250909B">G06N3/063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商蒂普愛可斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEEPX CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭溱雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JIN UNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金錄元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, LOK WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田䚘振</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUN, HYUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0170131</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>可於多種模式下運行以近似激活函數之類神經處理單元及其執行方法</chinese-title>
        <english-title>NEURAL PROCESSING UNIT OPERABLE IN MULTIPLE MODES TO APPROXIMATE ACTIVATION FUNCTION AND METHOD FOR OPERATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可提供類神經處理單元。該類神經處理單元可包括用於根據包含於類神經網路模型中的激活函數，以在第一方法或第二方法之間選擇一種激活函數處理方法的控制器電路、已程式化激活函數執行(Programmed Activation Function Execution，PAFE)單元，用於執行近似該激活函數的已程式化激活函數(Programmed Activation Function，PAF)，並輸出第一激活值，以及轉換器電路，用於轉換該第一激活值並輸出第二激活值。在第一方法中，僅已程式化激活函數執行單元可運行。在第二方法中，已程式化激活函數執行單元以及轉換器均可運行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A neural processing unit may be provided. The neural processing unit may comprise a controller circuit configured to select an activation function processing method among a first method or a second method, according to an activation function included in a neural network model, a programmed activation function execution unit (PAFE unit) configured to execute a programmed activation function (PAF) that approximate the activation function and output a first activation value, and a converter circuit configured to convert the first activation value and output a second activation value. In the first method, only the PAFE unit may operate. In the second method, both the PAFE unit and the converter may operate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S300,S310,S320:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10089.JPG" file="ed10089.JPG" height="377px" img-content="tif" inline="yes" orientation="portrait" width="708px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623665</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116407</doc-number>
          <kind></kind>
          <date>114/04/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/62</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野中敏央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NONAKA, TOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-125231</doc-number>
          <date>20240731</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2025/008657</doc-number>
          <date>20250310</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體晶片與再配線層的傳送距離被縮短的半導體裝置。&lt;br/&gt;半導體裝置(1)具備：&lt;br/&gt;包含配線層(40)和絕緣層(50)的再配線層(10)；及&lt;br/&gt;第1半導體晶片(100)，&lt;br/&gt;絕緣層(50)是以無機材料形成，第1半導體晶片(100)的連接層(110)與第1焊墊(24)的各者直接接合至再配線層(10)的絕緣層(50)和第1晶片焊墊(121)的各者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:再配線層</p>
        <p type="p">11:第1主面</p>
        <p type="p">12:第2主面</p>
        <p type="p">21:第1電極層</p>
        <p type="p">22:第2電極層</p>
        <p type="p">24:第1焊墊</p>
        <p type="p">25:第2焊墊</p>
        <p type="p">31:第1通孔</p>
        <p type="p">32:第2通孔</p>
        <p type="p">40:配線層</p>
        <p type="p">42:配線</p>
        <p type="p">50:絕緣層</p>
        <p type="p">100:第1半導體晶片</p>
        <p type="p">101:第1晶片主面</p>
        <p type="p">102:第2晶片主面</p>
        <p type="p">110:連接層</p>
        <p type="p">121:第1晶片焊墊</p>
        <p type="p">151:第1端面</p>
        <p type="p">500:被覆層</p>
        <p type="p">L1:距離</p>
        <p type="p">L2:距離</p>
        <p type="p">L11:距離</p>
        <p type="p">L12:距離</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="451px" img-content="tif" inline="yes" orientation="portrait" width="946px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622145</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116525</doc-number>
          <kind></kind>
          <date>114/05/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C08G59/40</main-classification>
        <further-classification edition="200601120260224B">C08G59/50</further-classification>
        <further-classification edition="200601120260224B">C08L63/00</further-classification>
        <further-classification edition="200601120260224B">C09D163/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川島裕貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>衞藤元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETOU, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-098518</doc-number>
          <date>20240619</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>乳劑型環氧樹脂硬化劑組成物及水系環氧樹脂組成物</chinese-title>
        <english-title>EMULSION-TYPE EPOXY RESIN CURING AGENT COMPOSITION AND WATER-BASED EPOXY RESIN COMPOSITION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種乳劑型環氧樹脂硬化劑組成物、及摻合其之水系環氧樹脂組成物。該乳劑型環氧樹脂硬化劑組成物含有：成分(A)：對於苯二甲胺(a1)1莫耳，使超過1莫耳且未達1.5莫耳之選自於由苯酚及具有碳數3以下之烷基之苯酚化合物構成之群組中之至少1種之化合物(a2)、及超過1莫耳且未達1.5莫耳之醛化合物(a3)與其進行曼尼希反應而得之反應組成物，成分(B)：HLB值為14.0以上之具有芳香環之非離子性乳化劑，成分(C)：共溶劑，及，水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition of an emulsion-type epoxy resin curing agent comprising: &lt;br/&gt;Component (A): a reaction composition obtained by performing a Mannich reaction between: &lt;br/&gt;1 mol of xylylenediamine (a1), &lt;br/&gt;more than 1 mol and less than 1.5 mol of at least one compound (a2) selected from the group consisting of phenol and phenolic compounds having an alkyl group with 3 or fewer carbon atoms, and &lt;br/&gt;more than 1 mol and less than 1.5 mol of an aldehyde compound (a3), &lt;br/&gt;Component (B): a nonionic emulsifier having an HLB value of 14.0 or higher and an aromatic ring, &lt;br/&gt;Component (C): a co-solvent, and &lt;br/&gt;Water, &lt;br/&gt;and a water-based epoxy resin composition formulated with the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621842</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116558</doc-number>
          <kind></kind>
          <date>114/05/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251020B">B24B13/02</main-classification>
        <further-classification edition="200601120251020B">B24B13/04</further-classification>
        <further-classification edition="200601120251020B">B24B9/14</further-classification>
        <further-classification edition="200601120251020B">B24B49/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商小島工程股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小嶋秀夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJIMA, HIDEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福澤浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUZAWA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城和哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOWA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/040837</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>加工方法及球心式加工機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在採用球心式加工機(1)的加工方法中，具有：工具安裝步驟(ST1)，使透鏡素材(40)保持於透鏡承座(41)，並將加工工具(5)安裝於心軸(6)；第1球面加工步驟(ST2)，執行球面加工動作；第1差異值取得步驟(ST3)，取得透鏡素材(40)之加工對象面(40a)的第1加工半徑(R1)，並取得目標半徑(Re)與第1加工半徑(R1)之間的第1差異值(∆R1)；第1工具位置設置步驟(ST4)，藉由促使加工工具(5)僅移動相當於第1差異值(∆R1)的距離，將「在加工工具(5)的工具表面(5a)中與加工對象面(40a)接觸的第1接點(C1)」與「轉動軸(L1)及搖動軸(L2)的交點(O)」之間的距離，作為目標半徑(Re)；第2球面加工步驟(ST5)，使新的透鏡素材(40)保持於透鏡承座(41)，執行球面加工動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="907px" img-content="tif" inline="yes" orientation="portrait" width="570px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623172</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116706</doc-number>
          <kind></kind>
          <date>114/05/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">H02M3/158</main-classification>
        <further-classification edition="200601120251103B">H03K17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商達爾科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIODES INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃鋒榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, FENG-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳浩銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HAO-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李歌晏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KO-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余國庸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, KUO-YUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/958,586</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/US24/61234</doc-number>
          <date>20241220</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>自舉電容器更新控制設備及方法</chinese-title>
        <english-title>BOOTSTRAP CAPACITOR REFRESH CONTROL APPARATUS AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包含：一自舉電容器更新脈衝產生電路，其經組態以一旦一功率轉換器之一低側開關之一關斷時間超過一預定臨限值，便產生一更新脈衝以接通該低側開關；及一邏輯閘，其經組態以接收該更新脈衝及一低側脈衝寬度調變(PWM)信號，且產生施加至該功率轉換器之該低側開關之一閘極之一驅動信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus includes a bootstrap capacitor refresh pulse generation circuit configured to generate a refresh pulse to turn on a low-side switch of a power converter once an off-time of the low-side switch exceeds a predetermined threshold, and a logic gate configured to receive the refresh pulse and a low-side pulse width modulation (PWM) signal, and generate a drive signal applied to a gate of the low-side switch of the power converter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:功率轉換器</p>
        <p type="p">201:高側驅動器</p>
        <p type="p">202:低側驅動器</p>
        <p type="p">203:自舉電容器更新控制設備</p>
        <p type="p">302:計時器</p>
        <p type="p">304:邏輯閘</p>
        <p type="p">C&lt;sub&gt;BS&lt;/sub&gt;:自舉電容器</p>
        <p type="p">Co:輸出電容器</p>
        <p type="p">D1:二極體</p>
        <p type="p">L1:輸出電感器</p>
        <p type="p">QH:高側開關</p>
        <p type="p">QH_G:高側閘極驅動信號</p>
        <p type="p">QHP:高側PWM信號</p>
        <p type="p">QL:低側開關</p>
        <p type="p">QL_G:低側閘極驅動信號</p>
        <p type="p">QLP:PWM信號</p>
        <p type="p">QLP1:低側PWM信號</p>
        <p type="p">SW:共同節點</p>
        <p type="p">T&lt;sub&gt;RF&lt;/sub&gt;:更新脈衝</p>
        <p type="p">Vb:偏置電壓</p>
        <p type="p">VIN:輸入電壓匯流排/輸入電壓</p>
        <p type="p">Vo:輸出電壓匯流排/輸出電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="855px" img-content="tif" inline="yes" orientation="portrait" width="789px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623411</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116712</doc-number>
          <kind></kind>
          <date>114/05/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120251001B">H10D62/13</main-classification>
        <further-classification edition="202501120251001B">H10D62/60</further-classification>
        <further-classification edition="202501120251001B">H10D62/822</further-classification>
        <further-classification edition="202501120251001B">H10D30/62</further-classification>
        <further-classification edition="202501120251001B">H10D64/01</further-classification>
        <further-classification edition="202501120251001B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈞瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宇杏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程健家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIEN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊嚴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/953,325</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES AND FORMING METHODS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體裝置及其形成方法。半導體元件可以包括源極/汲極區域、在源極/汲極區域上具有調製摻雜分佈的複合層、以及在複合層上方的導電接觸件。複合層可以包括位於源極/汲極區域上的第一子層和第二子層。第一子層可以位於第二子層和源極/汲極區域之間。第一子層可以包括第一半導體材料和具有第一摻雜劑濃度的第一摻雜劑。第二子層可以包括第二半導體材料和具有第二摻雜劑濃度的第二摻雜劑。第二摻雜劑可以與第一摻雜劑相同，且第二摻雜劑濃度可以與第一摻雜劑濃度不同。導電接觸件可以透過複合層電連接到源極/汲極區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and the method of forming the same are provided. The semiconductor device may include a source/drain region, a composite layer with a modulated doping profile on the source/drain region, and a conductive contact over the composite layer. The composite layer may include a first sublayer on the source/drain region and a second sublayer. The first sublayer may be between the second sublayer and the source/drain region. The first sublayer may comprise a first semiconductor material and a first dopant with a first dopant concentration. The second sublayer may comprise a second semiconductor material and a second dopant with a second dopant concentration. The second dopant may be same as the first dopant, and the second dopant concentration may be different from the first dopant concentration. The conductive contact may be electrically connected to the source/drain region by the composite layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">92:源極/汲極區域</p>
        <p type="p">126:第三間隔物</p>
        <p type="p">127:複合層</p>
        <p type="p">127A:第一子層</p>
        <p type="p">127B:第二子層</p>
        <p type="p">128:區域</p>
        <p type="p">129:第二矽化物區</p>
        <p type="p">130:背面通孔</p>
        <p type="p">D1:深度</p>
        <p type="p">D2:深度</p>
        <p type="p">W1:寬度</p>
        <p type="p">W2:寬度</p>
        <p type="p">Y:軸</p>
        <p type="p">Z:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10159.png" file="d10159.TIF" giffile="ed10159.png" height="604px" img-content="tif" inline="yes" orientation="portrait" width="761px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622099</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116715</doc-number>
          <kind></kind>
          <date>114/05/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">C07K7/06</main-classification>
        <further-classification edition="200601120260202B">C07K7/08</further-classification>
        <further-classification edition="200601120260202B">A61K51/08</further-classification>
        <further-classification edition="200601120260202B">A61P35/00</further-classification>
        <further-classification edition="200601120260202B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商3Ｂ製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3B PHARMACEUTICALS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧　貝迪　納奧拉什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AL-OBAIDI, NAOWRAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐斯特坎普　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSTERKAMP, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施耐德　艾伯哈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, EBERHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍尼　艾琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOEHNE, AILEEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博拉爾斯基　迪爾克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZBORALSKI, DIRK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦斯納　特施納　潔西卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAHSNER-TESCHNER, JESSICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯莫林　克里斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMERLING, CHRISTIANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊尼基　烏爾里希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REINEKE, ULRICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓格　卡洛琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DRAEGER, CAROLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼古拉耶娃　歐嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIKOLAEVA, OLGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
              <english-address>RU</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷莫　歐夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REIMER, ULF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/EP2024/082992</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>P-鈣黏蛋白配體</chinese-title>
        <english-title>P-CADHERIN LIGANDS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種P-鈣黏蛋白結合化合物；一種包含該P-鈣黏蛋白結合化合物之組合物；該P-鈣黏蛋白結合化合物及該組合物，其分別用於診斷疾病之方法中；該P-鈣黏蛋白結合化合物及該組合物，其分別用於治療疾病之方法中；該P-鈣黏蛋白結合化合物及該組合物，其分別用於診斷及治療疾病之方法中，該方法亦被稱為「治療診斷」或「治療診斷學」方法；該P-鈣黏蛋白結合化合物及該組合物，其分別用於將放射性核種遞送至表現P-鈣黏蛋白之組織之方法中；一種分別使用該P-鈣黏蛋白結合化合物及該組合物來診斷疾病之方法；一種分別使用該P-鈣黏蛋白結合化合物及該組合物來治療疾病之方法；一種分別使用該P-鈣黏蛋白結合化合物及該組合物來診斷及治療疾病之方法，該方法亦被稱為「治療診斷」或「治療診斷學」方法；一種分別使用該P-鈣黏蛋白結合化合物及該組合物來將放射性核種遞送至表現P-鈣黏蛋白之組織之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is related to a P-cadherin binding compound; a composition comprising the P-cadherin binding compound; the P-cadherin binding compound and the composition, respectively, for use in a method for the diagnosis of a disease; the P-cadherin binding compound and the composition, respectively, for use in a method for the treatment of a disease; the P-cadherin binding compound and the composition, respectively, for use in a method of diagnosis and treatment of a disease which is also referred to as "thera(g)nosis" or "thera(g)nostics"; the P-cadherin binding compound and the composition, respectively, for use in a method for delivering a radionuclide to a P-cadherin expressing tissue; a method for the diagnosis of a disease using the P-cadherin binding compound and the composition, respectively; a method for the treatment of a disease using the P-cadherin binding compound and the composition, respectively; a method for the diagnosis and treatment of a disease which is also referred to as "thera(g)nosis" or "thera(g)nostics, using the P-cadherin binding compound and the composition, respectively; a method for the delivery of a radionuclide to a P-cadherin expressing tissue using the P-cadherin binding compound and the composition, respectively.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed11382.JPG" file="ed11382.JPG" height="1032px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623417</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116748</doc-number>
          <kind></kind>
          <date>114/05/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120251001B">H10D64/01</main-classification>
        <further-classification edition="202501120251001B">H10D30/01</further-classification>
        <further-classification edition="202501120251001B">H10D64/68</further-classification>
        <further-classification edition="202501120251001B">H10D64/27</further-classification>
        <further-classification edition="202501120251001B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高魁佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, KUEI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃冠凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, GUAN KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林駿宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHUN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林敏巧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MIN-CHIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張詠琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/956,158</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">各個實施例提供一種形成半導體裝置結構的方法。此方法包括從基板形成鰭片結構，鰭片結構包括交替堆疊的複數個奈米結構化層與複數個犧牲奈米結構化層。在基板上形成淺溝槽隔離（STI）區域。形成犧牲閘極結構，其中第一閘極部分懸置於STI區域上方，第二閘極部分懸置於鰭片結構上。移除鰭片結構中的犧牲奈米結構化層以形成第一空腔。以犧牲介電層填充第一空腔。移除犧牲介電層的邊緣部分以形成第二空腔。以介電間隔物填充第二空腔。形成源極/汲極（S/D）特徵，S/D特徵與奈米結構化層和介電間隔物接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments provide a method for forming a semiconductor device structure. The method includes forming a fin structure from a substrate, the fin structure comprises a plurality of nanostructured layers and a plurality of sacrificial nanostructured layers alternatingly stacked, forming a shallow trench isolation (STI) region on the substrate, forming a sacrificial gate structure with a first gate portion suspended over the STI region and a second gate portion on the fin structure, removing the sacrificial nanostructured layers in the fin structure to form first cavities, filling the first cavities with a sacrificial dielectric layer, removing edge portions of each sacrificial dielectric layer to form second cavities, filling the second cavities with a dielectric spacer, forming a source/drain (S/D) feature, the S/D feature being in contact with the nanostructured layers and the dielectric spacers, and replacing the sacrificial gate structure and the sacrificial dielectric layer with a gate structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置結構</p>
        <p type="p">102:基板</p>
        <p type="p">104:超晶格結構、奈米片堆疊</p>
        <p type="p">105:奈米片堆疊、基底結構</p>
        <p type="p">106:奈米結構化層</p>
        <p type="p">108:奈米結構化犧牲層</p>
        <p type="p">118:STI區域</p>
        <p type="p">714:外閘極間隔物</p>
        <p type="p">1712:犧牲閘極結構</p>
        <p type="p">1712A:氧化物層、IL層</p>
        <p type="p">1712B:多晶矽結構</p>
        <p type="p">1712C:氮化物遮罩層、氮化物層</p>
        <p type="p">1712D:氧化物遮罩層、氧化物層</p>
        <p type="p">A-A:剖面</p>
        <p type="p">B-B:剖面</p>
        <p type="p">C-C:剖面</p>
        <p type="p">X:軸</p>
        <p type="p">Y:軸</p>
        <p type="p">Z:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10104.png" file="d10104.TIF" giffile="ed10104.png" height="767px" img-content="tif" inline="yes" orientation="portrait" width="808px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621825</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116865</doc-number>
          <kind></kind>
          <date>114/05/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B23K20/10</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H05K1/18</further-classification>
        <further-classification edition="200601120260302B">H02M7/537</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林承園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IM, SEUNGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/956,300</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>設備、方法、與功率逆變氣模組</chinese-title>
        <english-title>APPARATUS, METHOD, AND POWER INVERTER MODULE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種用於電子組件之無焊耦接的混合材料引線。一種說明性設備包括一第一基材、與該第一基材實體耦接的一半導體晶粒、及延伸自包含該第一基材及該半導體晶粒的一裝置封裝的複數個引線。在此實例中，複數個引線包括一混合材料引線，其係與半導體晶粒電性耦接且係由一第一導電材料及一第二導電材料所建構。此混合材料引線的該第一導電材料可設置以在一音場內保持一剛性結構，而該第二導電材料可設置以在該音場內塑性變形，以接合至一第二基材。本文亦揭示一種對應的裝置及製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Hybrid-material leads for solderless coupling of an electronic component are described herein. An illustrative apparatus includes a first substrate, a semiconductor die physically coupled with the first substrate, and a plurality of leads extending from a device package containing the first substrate and the semiconductor die. The plurality of leads in this example includes a hybrid-material lead that is electrically coupled with the semiconductor die and constructed of a first conductive material and a second conductive material. The first conductive material of this hybrid-material lead may be configured to maintain a rigid structure within an acoustic field while the second conductive material may be configured to plastically deform within the acoustic field to bond to a second substrate. Corresponding devices and fabrication methods are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:設備/電子組件</p>
        <p type="p">102:第一基材</p>
        <p type="p">104:半導體晶粒</p>
        <p type="p">106:引線</p>
        <p type="p">108:導線/導電線</p>
        <p type="p">110-1:第一導電材料</p>
        <p type="p">110-2:第二導電材料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="602px" img-content="tif" inline="yes" orientation="portrait" width="918px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623488</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114116901</doc-number>
          <kind></kind>
          <date>114/05/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250514B">H10H29/854</main-classification>
        <further-classification edition="202501120250514B">H10H29/855</further-classification>
        <further-classification edition="202501120250514B">H10H29/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錼創顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLAYNITRIDE DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施　曉權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SI, HIO-KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MO</english-country>
              <english-address>MO</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴皓云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, HAO-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫聖淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, SHENG-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱柏崴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,565</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示面板及其製造方法</chinese-title>
        <english-title>DISPLAY PANEL AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示面板，包括一電路基板、一圖案化結構層、多個微型發光晶片、多個屈光球體及一填充層。電路基板定義有多個畫素區域，圖案化結構層配置在電路基板上而區隔這些畫素區域，並且形成分別對應這些畫素區域的多個容置空間。這些微型發光晶片連接電路基板，並且對應這些畫素區域而分別配置於這些容置空間。這些屈光球體設置於這些微型發光晶片遠離電路基板的一側，且各屈光球體分別容置於這些容置空間的其中之一。在平行於電路基板的表面的方向上，填充層填充於圖案化結構層與各屈光球體之間。一種顯示面板的製造方法亦被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display panel includes a circuit substrate, a patterned structure layer, a plurality of micro-light-emitting chips, a plurality of refractive spheres and a filling layer. A plurality of pixel regions are defined on the circuit substrate. The patterned structural layer is disposed on the circuit substrate to separate the pixel regions and form a plurality of accommodating spaces respectively corresponding to the pixel regions. The micro-light emitting chips are connected to the circuit substrate and are respectively disposed in the accommodating spaces corresponding to the pixel areas. The refractive spheres are disposed on a side of the micro-light emitting chips away from the circuit substrate, and each refractive sphere is respectively accommodated in one of the accommodating spaces. In a direction parallel to a surface of the circuit substrate, the filling layer is filled between the patterned structure layer and each refractive sphere. A manufacturing method of a display panel is also proposed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示面板</p>
        <p type="p">110:電路基板</p>
        <p type="p">112:表面</p>
        <p type="p">120:圖案化結構層</p>
        <p type="p">130:微型發光晶片</p>
        <p type="p">140:屈光球體</p>
        <p type="p">142:球面</p>
        <p type="p">150:填充層</p>
        <p type="p">160:透光基板</p>
        <p type="p">170:光學膠層</p>
        <p type="p">A1:畫素區域</p>
        <p type="p">C1:容置空間</p>
        <p type="p">D1:距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.png" file="d10018.TIF" giffile="ed10018.png" height="579px" img-content="tif" inline="yes" orientation="portrait" width="848px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623407</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117010</doc-number>
          <kind></kind>
          <date>114/05/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120251023B">H10D62/10</main-classification>
        <further-classification edition="202501120251023B">H10D8/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪道一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, TAO-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WUN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李介文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JAM-WEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳國基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KUO-JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,169</doc-number>
          <date>20241121</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/077,397</doc-number>
          <date>20250312</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體二極體結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DIODE STRUCTURE AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例係關於一種半導體二極體結構，其包含：一半導體層；一第一p型摻雜結構，其放置於該半導體層上方；一第一n型摻雜結構，其位於該半導體層上方；一中心結構，其放置於該第一p型摻雜結構與該第一n型摻雜結構之間；一第二p型摻雜結構，其放置於該第一p型摻雜結構與該中心結構之間；及一第二n型摻雜結構，其放置於該第一n型摻雜結構與該中心結構之間。該第一及第二p型摻雜結構與該第二及第一n型摻雜結構關於該中心結構線對稱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor diode structure includes a semiconductor layer, a first p-type doped structure disposed over the semiconductor layer, a first n-type doped structure over the semiconductor layer, a central structure disposed between the first p-type doped structure and the first n-type doped structure, a second p-type doped structure disposed between the first p-type doped structure and the central structure, and a second n-type doped structure disposed between the first n-type doped structure and the central structure. The first and second p-type doped structures are line symmetric to the second and first n-type doped structures about the central structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:半導體二極體結構</p>
        <p type="p">112':半導體層</p>
        <p type="p">112B:後側</p>
        <p type="p">112F:前側</p>
        <p type="p">114:陽極區/第一區</p>
        <p type="p">114a:後側通路(VB)區</p>
        <p type="p">114b:VB阻斷區</p>
        <p type="p">116:中介區/第二區</p>
        <p type="p">118:陰極區/第三區</p>
        <p type="p">118a:VB區</p>
        <p type="p">118b:VB阻斷區</p>
        <p type="p">122:奈米結構通道</p>
        <p type="p">140:p型摻雜結構</p>
        <p type="p">142:p型摻雜結構</p>
        <p type="p">144:n型摻雜結構</p>
        <p type="p">146:n型摻雜結構</p>
        <p type="p">152a:金屬閘極</p>
        <p type="p">152b:金屬閘極</p>
        <p type="p">154a:金屬閘極</p>
        <p type="p">154b:金屬閘極</p>
        <p type="p">156:金屬閘極</p>
        <p type="p">158a:金屬閘極</p>
        <p type="p">158b:金屬閘極</p>
        <p type="p">160:中心結構</p>
        <p type="p">162:隔離件</p>
        <p type="p">170:金屬至汲極(MD)或金屬至裝置(MD)接點</p>
        <p type="p">172:MD接點</p>
        <p type="p">180m:導電線</p>
        <p type="p">180v:通路連接器</p>
        <p type="p">182m:導電線</p>
        <p type="p">182v:通路連接器</p>
        <p type="p">184:絕緣層</p>
        <p type="p">190m:後側導電線</p>
        <p type="p">190v:底部通路連接器</p>
        <p type="p">192m:後側導電線</p>
        <p type="p">192v:底部通路連接器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10029.JPG" file="ed10029.JPG" height="789px" img-content="tif" inline="yes" orientation="portrait" width="1078px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621848</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117218</doc-number>
          <kind></kind>
          <date>114/05/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260114B">B24B37/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許勛豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/950,214</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化學機械拋光之拋光墊</chinese-title>
        <english-title>CMP POLISHING PAD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種由化學機械拋光(chemical mechanical polishing ，CMP)系統使用的CMP之拋光墊。該CMP之拋光墊包含：墊主體，包含基座部分及設置於基座部分上的介接部分；以及嵌入於墊主體中的相變化材料，其中相變化材料由一熔融溫度來表徵，熔融溫度在由CMP系統進行之CMP製程的操作範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemical mechanical polishing (CMP) polishing pad used by a CMP system is provided. The CMP polishing pad comprises: a pad body comprising a base portion and an interfacing portion disposed on the base portion; and a phase-change material (PCM) embedded in the pad body, wherein the PCM is characterized by a melting temperature within an operational temperature range of a CMP process conducted by the CMP system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:化學機械拋光(CMP)系統</p>
        <p type="p">110:晶圓</p>
        <p type="p">112:拋光墊</p>
        <p type="p">114:旋轉晶圓固持器</p>
        <p type="p">122:晶圓表面</p>
        <p type="p">124:研磨漿料</p>
        <p type="p">126:旋轉平台</p>
        <p type="p">128:研磨漿料供應裝備</p>
        <p type="p">151:墊主體</p>
        <p type="p">152:基座部分</p>
        <p type="p">154:介接部分</p>
        <p type="p">156:底表面</p>
        <p type="p">158:頂表面</p>
        <p type="p">160:溝槽</p>
        <p type="p">170:相變化材料(PCM)微膠囊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="670px" img-content="tif" inline="yes" orientation="portrait" width="983px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623418</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117228</doc-number>
          <kind></kind>
          <date>114/05/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D64/01</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202501120260302B">H10D62/17</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉德夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEH, TEFU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪若珺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, JO-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周俊誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHUN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/954,647</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構和其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開的實施例提供一種方法，包括形成遮罩層於具有複數個垂直堆疊奈米片的奈米結構上方，垂直堆疊奈米片包括位於通道區域的基底結構上方的第一奈米片、第一奈米片下方的第二奈米片及第二奈米片下方的第三奈米片，其中遮罩層具有暴露部分的奈米結構的缺陷；從奈米結構被暴露的部分周圍移除第一功函數金屬層；移除遮罩層；及使用酸性化學劑處理奈米結構被暴露的部分，其中酸性化學劑從奈米結構被暴露的部分移除高介電常數介電質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method, includes: forming a mask layer over a nanostructure having a plurality of vertically stacked nanosheets including a first nanosheet above a base structure of a channel region, a second nanosheet below the first nanosheet, and a third nanosheet below the second nanosheet, wherein the mask layer has a defect that leaves a portion of the nanostructure exposed; removing a first work function metal layer from around the portion of the nanostructure that is exposed; removing the mask layer; and treating the portion of the nanostructure that is exposed with an acidic chemical that removes high-K dielectric from the portion of the nanostructure that is exposed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3002:n型奈米結構</p>
        <p type="p">3004:n型區域</p>
        <p type="p">3006:p型奈米結構</p>
        <p type="p">3008:p型區域</p>
        <p type="p">3010:第一功函數層</p>
        <p type="p">3018:高介電常數介電層</p>
        <p type="p">3020:界面層</p>
        <p type="p">NFET:n型場效電晶體</p>
        <p type="p">PFET:p型場效電晶體</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10077.png" file="d10077.TIF" giffile="ed10077.png" height="459px" img-content="tif" inline="yes" orientation="portrait" width="445px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621849</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117287</doc-number>
          <kind></kind>
          <date>114/05/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260302B">B24B37/34</main-classification>
        <further-classification edition="201201120260302B">B24B37/005</further-classification>
        <further-classification edition="200601120260302B">B24B57/04</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭晉銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, TE-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, WEN-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫旭昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUEN, SHICH-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/962,360</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化學機械拋光裝置與執行化學機械拋光製程的方法</chinese-title>
        <english-title>APPARATUS FOR CHEMICAL MECHANICAL POLISHING AND METHOD FOR PERFORMING CHEMICAL MECHANICAL POLISHING PROCESS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種化學機械拋光（chemical mechanical polishing, CMP）裝置。CMP裝置包括壓板和設置在壓板上的晶圓載體。CMP裝置也包括漿料輸送系統。漿料輸送系統包括漿料管道，配置為將漿料混合物分配到壓板上。漿料輸送系統還包括光流動池，其連接到漿料管道的一區段並週向地圍繞此區段，其中漿料管道的一區段沿縱軸延伸。光流動池包括配置為照射此區段的至少一部分的光源。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chemical mechanical polishing (CMP) apparatus is provided. The CMP apparatus includes a platen and a wafer carrier disposed over the platen. The CMP apparatus further includes a slurry delivery system. The slurry delivery system includes a slurry conduit configured to dispense a slurry mixture onto the platen. The slurry delivery system further includes a light flow cell coupled to and circumferentially surrounding a segment of the slurry conduit, where the segment extends along a longitudinal axis. The light flow cell includes a light source configured to irradiate at least a portion of the segment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102:壓板</p>
        <p type="p">103:旋轉軸</p>
        <p type="p">104:拋光墊</p>
        <p type="p">104s:拋光表面</p>
        <p type="p">106:晶圓載體</p>
        <p type="p">107:旋轉軸</p>
        <p type="p">111:漿料混合物</p>
        <p type="p">120:CMP控制系統</p>
        <p type="p">140:半導體晶圓</p>
        <p type="p">200:漿料輸送系統</p>
        <p type="p">A1:軸</p>
        <p type="p">A2:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.png" file="d10024.TIF" giffile="ed10024.png" height="735px" img-content="tif" inline="yes" orientation="portrait" width="931px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623393</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117359</doc-number>
          <kind></kind>
          <date>114/05/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/60</main-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
        <further-classification edition="202601120260302B">H10W10/00</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="200601120260302B">B82B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鈞瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUN WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程健家</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHIEN-CHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊嚴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宇杏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/954,105</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一實施例中，說明一種方法，該方法包括形成具有第一第一基底材料成分及第一濃度的第一導電類型摻雜劑的源極/汲極區；去除具有第一基底材料成分及第一濃度的第一導電類型摻雜劑的部分以暴露接觸表面；及在接觸表面磊晶形成接觸層。接觸層包括第二基底材料成分及第二濃度的第一導電類型摻雜劑，其中第一導電類型摻雜劑的第二濃度大於第一濃度。接觸層上沉積金屬，其中位於金屬與接觸層之間的界面包括金屬半導體合金。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an embodiment, a method is described that includes forming a source/drain region having a first base material composition and a first concentration of a first conductivity type dopant; removing a portion of the source/drain region having the first base material composition and the first concentration of the first conductivity type dopant to expose a contact surface; and forming a contact layer on the contact surface. The contact layer comprises a second composition and has a second concentration of the first conductivity type dopant, wherein the second concentration is greater than the first concentration for the first conductivity type dopant. A metal is deposited on the contact layer, wherein an interface between the metal and the contact layer includes a metal semiconductor alloy.</p>
      </isu-abst>
      <representative-img>
        <p type="p">54A,54B,54C:奈米結構</p>
        <p type="p">90:內部間隔件</p>
        <p type="p">92:源極/汲極區</p>
        <p type="p">100:閘極介電層</p>
        <p type="p">102:閘極電極/閘極導體</p>
        <p type="p">113:保護間隔件</p>
        <p type="p">116:金屬觸點</p>
        <p type="p">200:接觸層/接觸磊晶層</p>
        <p type="p">205:金屬半導體合金層/金屬半導體合金</p>
        <p type="p">230:底部介電層</p>
        <p type="p">400:前側觸點</p>
        <p type="p">401:後側基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10085.png" file="d10085.TIF" giffile="ed10085.png" height="720px" img-content="tif" inline="yes" orientation="portrait" width="846px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623506</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117375</doc-number>
          <kind></kind>
          <date>114/05/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
        <further-classification edition="200601120260302B">B82B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林衍廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIEN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游明華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李啟弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHII-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,675</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/080,106</doc-number>
          <date>20250314</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體元件及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括以下步驟：形成複數個半導體奈米結構，其中該些半導體奈米結構中的上半導體奈米結構與該些半導體奈米結構中的相應下半導體奈米結構重疊。該方法進一步包括以下步驟：在該些半導體奈米結構旁邊形成源極/汲極凹槽；及由該些半導體奈米結構形成第一半導體層。在該第一半導體層的剖面圖中，該第一半導體層具有一凸形狀。第二半導體層形成在該第一半導體層上方。矽化物區域形成在該第二半導體層上方且接觸該第二半導體層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a plurality of semiconductor nanostructures, wherein upper ones of the plurality of semiconductor nanostructures overlap respective lower ones of the plurality of semiconductor nanostructures. The method further includes forming a source/drain recess aside of the plurality of semiconductor nanostructures, and forming a first semiconductor layer from the plurality of semiconductor nanostructures. The first semiconductor layer has a convex shape in a cross-sectional view of the first semiconductor layer. A second semiconductor layer is formed over the first semiconductor layer. A silicide region is formed over and contacting the second semiconductor layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板</p>
        <p type="p">22A:第一層、犧牲層、半導體層</p>
        <p type="p">22B:第二層、半導體層、奈米結構</p>
        <p type="p">30:虛設閘極堆疊</p>
        <p type="p">32:虛設閘極介電層</p>
        <p type="p">34:虛設閘電極</p>
        <p type="p">38:閘極間隔物</p>
        <p type="p">42:凹槽</p>
        <p type="p">44:內間隔物</p>
        <p type="p">47:區域</p>
        <p type="p">48A:半導體層</p>
        <p type="p">49:介電層</p>
        <p type="p">112:退火製程</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10057.png" file="d10057.TIF" giffile="ed10057.png" height="680px" img-content="tif" inline="yes" orientation="portrait" width="582px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623430</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117381</doc-number>
          <kind></kind>
          <date>114/05/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202501120260302B">H10D84/83</further-classification>
        <further-classification edition="202501120260302B">H10D30/43</further-classification>
        <further-classification edition="202501120260302B">H10D30/67</further-classification>
        <further-classification edition="202601120260302B">H10P50/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃怡慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YI TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張書維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SHU-UEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張之勵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古淑瑗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, SHU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/792,644</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置結構的形成方法</chinese-title>
        <english-title>METHODS OF FORMING SEMICONDUCTOR DEVICE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括在形成鰭結構於基板上，其中鰭結構包括由第一半導體材料製成的第一多個半導體層和由第二半導體材料製成的第二多個半導體層。形成犧牲閘極疊層於鰭結構上。移除鰭結構之與犧牲閘極疊層相鄰的部分以暴露基板的多個部分。沿橫向方向移除第二多個半導體層的多個邊緣部分以形成多個凹槽，其中移除邊緣部分包括使用包括三氟化氯的氣體蝕刻劑執行選擇性乾蝕刻製程。形成內部間隔物於凹槽中。形成源極/汲極區與犧牲閘極疊層相鄰。移除犧牲閘極疊層和第二多個半導體層。形成閘極結構取代犧牲閘極疊層和該第二多個半導體層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a fin structure on a substrate, wherein the fin structure includes a first plurality of semiconductor layers made of a first semiconductor material and a second plurality of semiconductor layers made of a second semiconductor material, forming a sacrificial gate stack over the fin structure, removing portions of the fin structure adjacent to the sacrificial gate stack to expose a portion of the substrate, removing edge portions of the second plurality of semiconductor layers in a lateral direction to form recesses, wherein removing the edge portions includes performing a selective dry etching process using a gas etchant that includes ClF&lt;sub&gt;3&lt;/sub&gt;, forming inner spacers in the recesses, forming a source/drain (S/D) region adjacent to the sacrificial gate stack, removing the sacrificial gate stack and the second plurality of semiconductor layers, and forming a gate structure in place of the sacrificial gate stack and the second plurality of semiconductor layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置結構</p>
        <p type="p">106:第一半導體層</p>
        <p type="p">108:第二半導體層</p>
        <p type="p">130:犧牲閘極結構</p>
        <p type="p">131a:第一對</p>
        <p type="p">131b:第二對</p>
        <p type="p">132:犧牲閘極介電層</p>
        <p type="p">134:犧牲閘電極層</p>
        <p type="p">136:遮罩層</p>
        <p type="p">138:第一閘極隔離物</p>
        <p type="p">139:第二閘極隔離物</p>
        <p type="p">140a:第一凹槽</p>
        <p type="p">140b:第二凹槽</p>
        <p type="p">CL:中心線</p>
        <p type="p">D1:第一距離</p>
        <p type="p">D2:第二距離</p>
        <p type="p">P1:第一間距</p>
        <p type="p">P2:第二間距</p>
        <p type="p">W1:第一橫向寬度</p>
        <p type="p">W2:第二橫向寬度</p>
        <p type="p">X:方向</p>
        <p type="p">Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10042.png" file="d10042.TIF" giffile="ed10042.png" height="618px" img-content="tif" inline="yes" orientation="portrait" width="954px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622636</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117469</doc-number>
          <kind></kind>
          <date>114/05/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G03F7/20</main-classification>
        <further-classification edition="200601120260226B">G01L1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舟艾柏　浩山姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOUAIB, HOUSSAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/652,680</doc-number>
          <date>20240529</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/195,337</doc-number>
          <date>20250430</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於具有機械應力調變之半導體結構之量測的方法及系統</chinese-title>
        <english-title>METHODS AND SYSTEMS FOR MEASUREMENT OF SEMICONDUCTOR STRUCTURES WITH MECHANICAL STRESS MODULATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中呈現基於量測信號值之改變及歸因於機械應力變動之一量測目標之電性質、光學性質或兩者之經估計改變來量測特徵化該量測目標之結構參數之方法及系統。藉由在一受測量測目標內誘發一機械波來擾動該量測目標之該等電及光學性質。在較佳實施例中，該機械波由與一受測晶圓之一後側接觸之一超音波致動器激發。該等量測信號值之該等改變及該量測目標之該等電性質、光學性質或兩者之經估計改變兩者經量化且作為輸入提供至一量測模型。依此方式，該量測係基於量測信號相對於電性質、光學性質或兩者之導數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems measuring structural parameters characterizing a measurement target based on changes in measurement signal values and estimated changes in electrical properties, optical properties, or both, of the measurement target due to variation of mechanical stress are presented herein. The electrical and optical properties of a measurement target are perturbed by inducing a mechanical wave within the measurement target under measurement. In preferred embodiments, the mechanical wave is excited by an ultrasonic actuator in contact with a back side of a wafer under measurement. Both the changes in the measurement signal values and estimated changes in the electrical properties, optical properties, or both, of the measurement target are quantified and provided as input to a measurement model. In this manner, the measurement is based on the derivatives of measurement signals with respect to electrical properties, optical properties, or both.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光譜橢偏儀(SE)度量系統</p>
        <p type="p">101:晶圓/樣品</p>
        <p type="p">103:SE量測信號</p>
        <p type="p">104:關注參數</p>
        <p type="p">105:SE子系統/光譜橢偏儀</p>
        <p type="p">106:SE量測信號</p>
        <p type="p">107:SE照明光/照明束</p>
        <p type="p">108:量測點</p>
        <p type="p">109:經收集光</p>
        <p type="p">110:照明源</p>
        <p type="p">111A:照明光學器件</p>
        <p type="p">111B:光學濾波器</p>
        <p type="p">112:偏光組件</p>
        <p type="p">113:照明視場光闌</p>
        <p type="p">114:照明光瞳孔徑光闌</p>
        <p type="p">115:集光光學器件</p>
        <p type="p">116:集光孔徑光闌</p>
        <p type="p">117:偏光元件</p>
        <p type="p">118:集光視場光闌</p>
        <p type="p">119:偵測器/信號獲取電子器件</p>
        <p type="p">130:運算系統</p>
        <p type="p">131:處理器</p>
        <p type="p">132:記憶體</p>
        <p type="p">133:匯流排</p>
        <p type="p">134:程式指令</p>
        <p type="p">140:命令信號</p>
        <p type="p">150:機械波激發源</p>
        <p type="p">151:機械波/泵浦照明光</p>
        <p type="p">152:命令信號</p>
        <p type="p">190:晶圓夾頭/樣品定位系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.JPG" file="ed10027.JPG" height="804px" img-content="tif" inline="yes" orientation="portrait" width="743px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623658</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117489</doc-number>
          <kind></kind>
          <date>114/05/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/40</main-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乾坤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYNTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張峻豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊玉林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YU-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,540</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>導線架、封裝以及製造導線架的方法</chinese-title>
        <english-title>LEADFRAME, PACKAGE AND METHOD FOR MANUFACTURING LEADFRAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種封裝，其包含一晶粒、一第一導線架及一第二導線架，其中該第一導線架與該第二導線架堆疊並藉由使用黏著物質接合在一起，以形成一最終導線架；其中該晶粒接合至該最終導線架。透過本實施例的內容，該封裝可以具有適當的訊號傳輸路徑以及多方向的散熱路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a package including a die, a first leadframe and a second leadframe. The first leadframe and the second leadframe are stacked and bonded together by using adhering substance to form a final leadframe. The die is bonded to the final leadframe. By using the package of the embodiments, the package includes appropriate signal transmission paths and multi-directional heat dissipation paths.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝</p>
        <p type="p">110:晶粒</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="554px" img-content="tif" inline="yes" orientation="portrait" width="820px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623683</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117574</doc-number>
          <kind></kind>
          <date>114/05/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202501120260302B">H10D64/01</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
        <further-classification edition="202501120260302B">H10D62/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林子敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, TZU-GING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/963,936</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體元件以及形成饋通穿孔之方法</chinese-title>
        <english-title>A SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING FEEDTHROUGH VIAS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露描述了一種於基材上形成縱向饋通穿孔之方法。暴露基材的前側上之微動區中的半導體鰭片的部位。移除半導體鰭片的經暴露的部位以創建第一溝槽。以至少一介電材料填充第一溝槽以形成介電溝槽。蝕刻介電溝槽至中間深度以於介電溝槽內形成第二溝槽。以導電材料填充第二溝槽。從基材的後側蝕刻介電溝槽以形成後側體積，後側體積於第二溝槽中暴露導電材料。後側體積以附加的導電材料填充以形成縱向饋通穿孔。縱向饋通穿孔垂直於切割金屬閘極溝槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for forming a longitudinal feedthrough via (FTV) on a substrate are described. A portion of a semiconducting fin in a jog region on a front side of the substrate is exposed. The exposed portion of the semiconducting fin is removed to create a first trench. The first trench is filled with at least one dielectric material to form a dielectric trench. The dielectric trench is then etched to an intermediate depth to form a second trench within the dielectric trench. The second trench is filled with an electrically conductive material. The dielectric trench is then etched from the back side of the substrate to form a backside volume that exposes the electrically conductive material in the second trench. The backside volume is filled with additional electrically conductive material to form the longitudinal FTV. The longitudinal FTV is perpendicular to a cut metal gate trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102,104,106,108,110,112,114,116,118,120,122,124,126,128,130,132,134,136,138,140:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="769px" img-content="tif" inline="yes" orientation="portrait" width="1090px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622746</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117694</doc-number>
          <kind></kind>
          <date>114/05/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250910B">G06F12/02</main-classification>
        <further-classification edition="201601120250910B">G06F12/10</further-classification>
        <further-classification edition="201601120250910B">G06F12/1018</further-classification>
        <further-classification edition="201601120250910B">G06F12/0802</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>明魯瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYUNG, ROHYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙在彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, JAE-EON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175922</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具記憶體管理的處理器實施方法和電子裝置以及相關聯之非暫時性電腦可讀儲存媒體</chinese-title>
        <english-title>PROCESSOR-IMPLEMENTED METHOD AND ELECTRONIC DEVICE WITH MEMORY MANAGEMENT AND ASSOCIATED NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種處理器實施之方法包括：判定一記憶體之複數個記憶體節點當中的一第一記憶體節點之一第一子記憶體區的一頁面使用是否大於或等於一第一臨限值；回應於該第一子記憶體區之該頁面使用係大於或等於該第一臨限值而判定該第一記憶體節點之一第二子記憶體區；判定經判定第二子記憶體區之頁面當中的一目標頁面；以及將該第二子記憶體區之經判定之該目標頁面分配至該第一子記憶體區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processor-implemented method includes determining whether a page usage of a first sub-memory region of a first memory node among a plurality of memory nodes of a memory is greater than or equal to a first threshold value, determining a second sub-memory region of the first memory node in response to the page usage of the first sub-memory region being greater than or equal to the first threshold value, determining a target page among pages of the determined second sub-memory region, and allocating the determined target page of the second sub-memory region to the first sub-memory region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">610,620,630,640:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.png" file="d10021.TIF" giffile="ed10021.png" height="863px" img-content="tif" inline="yes" orientation="portrait" width="655px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622982</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117744</doc-number>
          <kind></kind>
          <date>114/05/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250613B">G11C29/52</main-classification>
        <further-classification edition="200601120250613B">G11C7/10</further-classification>
        <further-classification edition="201801120250613B">G06F8/654</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市欣芯半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN XINXIN SEMICONDUCTOR CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張均林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117025940</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>數據儲存裝置及數據讀取方法</chinese-title>
        <english-title>DATA STORAGE DEVICE AND DATA READING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數據儲存裝置及數據讀取方法，其中數據儲存裝置耦接主機，主機包括主機記憶體緩衝器，數據儲存裝置包括控制器、非揮發性記憶體及緩衝器，數據讀取方法包括：通過主機下載數據儲存裝置的欲更新韌體數據；判斷主機記憶體緩衝器具有欲更新韌體數據；讀取主機記憶體緩衝器中的欲更新韌體數據至緩衝器中；通過糾錯機制判斷緩衝器中的欲更新韌體數據是正確數據；以及更新數據儲存裝置的韌體數據。如此，降低數據儲存裝置的讀寫操作並提高穩定性，以及不影響數據儲存裝置的讀寫操作並提高數據傳輸速度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data storage device and a data reading method are provided, wherein the data storage device is coupled to a host, the host includes a host memory buffer, the data storage device includes a controller, a non-volatile memory and a buffer, and the data reading method includes: downloading a firmware data to be updated from the data storage device through the host; determining that the host memory buffer contains the firmware data to be updated; reading the firmware data to be updated from the host memory buffer into the buffer; determining that the firmware data to be updated in the buffer is correct data through an error correction mechanism; and updating the firmware data of the data storage device. In this way, the read and write operations of the data storage device are reduced and the stability is improved, and the read and write operations of the data storage device are not affected and the data transmission speed is increased.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S3,S5,S7,S9,S11,S13,S15:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="852px" img-content="tif" inline="yes" orientation="portrait" width="770px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622738</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117747</doc-number>
          <kind></kind>
          <date>114/05/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250602B">G06F11/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市欣芯半導體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN XINXIN SEMICONDUCTOR CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張均林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117011685</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>數據儲存裝置及校驗碼產生方法</chinese-title>
        <english-title>DATA STORAGE DEVICE AND CHECK CODE GENERATION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種數據儲存裝置及校驗碼產生方法，其中數據儲存裝置包括控制器及非揮發性記憶體，非揮發性記憶體用以儲存多個指令，控制器用以執行多個指令以實現校驗碼產生方法包括：判斷非揮發性記憶體使用校驗碼的最小單位；分割最小單位為至少二個子單位；以及分別對至少二個子單位進行錯誤更正碼編碼操作以產生子校驗碼。如此，使得不同容量的數據儲存裝置具有相同的解碼能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A data storage device and a check code generation method are provided, wherein the data storage device includes a controller and a non-volatile memory, the non-volatile memory is used to store multiple instructions, and the controller is used to execute the multiple instructions to implement the check code generation method includes: determining a smallest unit of the check code used by the non-volatile memory; dividing the smallest unit into at least two sub-units; and performing an error correction code encoding operation on at least two sub-units to generate sub-check codes. In this way, data storage devices with different capacities have the same decoding capabilities.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1,S3,S5:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="246px" img-content="tif" inline="yes" orientation="portrait" width="457px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622448</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114117971</doc-number>
          <kind></kind>
          <date>114/05/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120260224B">F41B11/62</main-classification>
        <further-classification edition="201301120260224B">F41B11/73</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦查工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANZA STAMPING INDUSTRY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>宜蘭縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳力維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂滄堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TSANG-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝旻諺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, MIN-YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/666,354</doc-number>
          <date>20240516</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/776,403</doc-number>
          <date>20240718</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>空氣槍及其穿刺機構</chinese-title>
        <english-title>AIR GUN AND ITS PIERCING MECHANISM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種高壓壓縮氣體壓力容器及使用該類容器的裝置。更具體地說，本發明的部分內容涉及具有可穿刺薄膜的高壓（例如以氮氣或N₂為基礎）加壓氣體鋼瓶，該薄膜凹陷設置於壓力容器開口處之內，以致現有技術中的穿刺機構無法穿透該薄膜，從而達到安全目的，此外，本發明的部分內容還涉及使用壓縮氣體作為動力的裝置，該裝置配備有加長的穿刺針，用於穿透設有凹陷可穿刺薄膜的壓力容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">High pressure compressed gas pressure vessels and devices utilizing such vessels are disclosed herein. More particularly, aspects of the present invention are directed to high pressure (i.e., nitrogen or N2 based) pressurized gas cylinders with pierceable membranes recessed from the opening of the pressure vessel such that prior art piercing mechanisms cannot pierce the membrane for safety purposes. Additionally, aspects of the present invention are directed to pressurized gas operated devices with elongated pins for piercing pressure vessels with recessed pierceable membranes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">103:蓋體</p>
        <p type="p">121:頸部</p>
        <p type="p">301:穿刺針</p>
        <p type="p">303:外殼</p>
        <p type="p">305:壓力容器密封件</p>
        <p type="p">307:上部</p>
        <p type="p">309:下部</p>
        <p type="p">311:縱向通道</p>
        <p type="p">315:上密封件</p>
        <p type="p">317:腔體</p>
        <p type="p">319:導管</p>
        <p type="p">321:止擋件</p>
        <p type="p">323:座面</p>
        <p type="p">325:固定件</p>
        <p type="p">501:下密封件</p>
        <p type="p">503:大氣排氣孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="773px" img-content="tif" inline="yes" orientation="portrait" width="613px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622866</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118105</doc-number>
          <kind></kind>
          <date>113/07/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260224B">G06Q40/00</main-classification>
        <further-classification edition="200601120260224B">G07F19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣銀行股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANK OF TAIWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程筱玟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HSIAO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊祺雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>自動櫃員設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自動櫃員設備，配合一金融伺服器運作。金融伺服器儲存多筆金融帳戶資料，每一金融帳戶資料具有至少一筆提款紀錄。自動櫃員設備包含一控制單元、一顯示單元、一操作介面、一儲鈔單元及一取鈔單元。其中，操作介面接收一帳戶驗證資料，使自動櫃員設備連線至金融伺服器執行一帳戶驗證程序。操作介面接收一用於指示一提領金額資訊的操作指令。控制單元依據符合帳戶驗證資料之金融帳戶資料的提款紀錄，產生一符合提領金額資訊的選鈔組合建議資訊，並令顯示單元顯示選鈔組合建議資訊。選鈔組合建議資訊包括總金額對應於提領金額資訊的至少一種貨幣的提領數量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:自動櫃員設備</p>
        <p type="p">200:金融伺服器</p>
        <p type="p">1:控制單元</p>
        <p type="p">2:顯示單元</p>
        <p type="p">3:操作介面</p>
        <p type="p">4:儲鈔單元</p>
        <p type="p">5:取鈔單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="931px" img-content="tif" inline="yes" orientation="portrait" width="728px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623378</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118163</doc-number>
          <kind></kind>
          <date>114/05/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120251128B">H10D30/01</main-classification>
        <further-classification edition="202501120251128B">H10D62/60</further-classification>
        <further-classification edition="202501120251128B">H10D62/40</further-classification>
        <further-classification edition="202501120251128B">H10D30/60</further-classification>
        <further-classification edition="200601120251128B">B82B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林衍廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YAN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIEN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游明華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李啟弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHII-HORNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/949,454</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置和其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在本公開的一些實施例中，一種半導體裝置包括具有(110)晶向的基板、位於基板上方的奈米結構堆疊及位於奈米結構堆疊的相對側上的溝槽中的源極/汲極區域。在一些實施例中，源極/汲極區域包括位於奈米結構堆疊中的奈米結構的末端且具有第一鍺濃度的第一半導體材料。當從側截面圖觀看時，第一半導體材料具有三角形幾何形狀。在一些實施例中，源極/汲極區域也包括位於第一半導體材料上填充至少部分的溝槽且具有第二鍺濃度的第二半導體材料。第二鍺濃度大於第一鍺濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In some embodiments, a semiconductor device is described that includes a substrate having a (110) crystal orientation; a stack of nanostructures over the substrate; and a source/drain region in trenches on opposing sides of the stack of nanostructures. In some embodiments, the source/drain region includes a first semiconductor material having a first concentration of germanium on ends of the nanostructures in the stack of nanostructures. The first semiconductor material has a triangular geometry when viewed from a side cross sectional view. In some embodiments, the source/drain region also includes a second semiconductor material having a second concentration of germanium on the first semiconductor material filling at least a portion of the trenches. The second concentration of the germanium is greater than the first concentration of the germanium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基板</p>
        <p type="p">50P:p型區域</p>
        <p type="p">54A,54B,54C:第二奈米結構</p>
        <p type="p">76:虛擬閘極</p>
        <p type="p">78:遮罩</p>
        <p type="p">118:接觸件</p>
        <p type="p">192:第一半導體材料</p>
        <p type="p">192a:第三半導體材料</p>
        <p type="p">193:第二半導體材料</p>
        <p type="p">194:界面半導體材料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.JPG" file="ed10026.JPG" height="710px" img-content="tif" inline="yes" orientation="portrait" width="507px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622975</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118164</doc-number>
          <kind></kind>
          <date>114/05/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251023B">G11C16/06</main-classification>
        <further-classification edition="200601120251023B">G11C16/10</further-classification>
        <further-classification edition="200601120251023B">G11C15/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>旺宏電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACRONIX INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林榆瑄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾柏皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, PO-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李峯旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, FENG-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林昱佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/964,183</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體裝置及記憶體系統</chinese-title>
        <english-title>MEMORY DEVICE AND MEMORY SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體系統，包含記憶體裝置、記憶體控制器及配置電路。記憶體控制器具有邏輯以執行：(i)編程記憶體裝置以儲存資料；(ii)依據輸入資料，提供一或多個搜尋電壓至記憶體裝置；以及(iii)根據來自記憶體裝置的輸出電流，判斷儲存資料及輸入資料間的相似度。輸出電流用以表示代表儲存資料的儲存邏輯值及代表該輸入資料的輸入邏輯值之間的歐幾里得距。配置電路具有邏輯以基於記憶體控制器的以下動作判斷基準閾值電壓：(i)編程該使用該一或多個編程電壓的記憶體裝置以設定一或多個閾值電壓；以及(ii)提供該一或多個搜尋電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory system is provided to include a memory device, a memory controller and a configuration circuitry. The memory controller configured with logic to (i) program the memory device to store storage data, (ii) provide search voltages to the memory device in dependence on input data and (iii) determine a level of similarity between the stored storage data and the input data according to an output current from the memory device that represents a Euclidean distance between the stored storage data and the input data. The configuration circuitry includes logic to determine a base threshold voltage (Vt) according to which the memory controller (i) programs the memory device and (ii) provides the one or more search voltages.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2100:系統</p>
        <p type="p">2102:配置電路</p>
        <p type="p">2110:控制器</p>
        <p type="p">2111:閾值暫存器</p>
        <p type="p">2120:偏置排列狀態機</p>
        <p type="p">2130:匯流排</p>
        <p type="p">2135:線路</p>
        <p type="p">2140:字元線解碼器</p>
        <p type="p">2141:搜尋字元緩衝器</p>
        <p type="p">2145:字元線</p>
        <p type="p">2160:記憶體陣列</p>
        <p type="p">2165:位元線</p>
        <p type="p">2170:頁緩衝器</p>
        <p type="p">2175:記憶體匹配累加器</p>
        <p type="p">2190:快取暫存器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10095.JPG" file="ed10095.JPG" height="696px" img-content="tif" inline="yes" orientation="portrait" width="968px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623671</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118207</doc-number>
          <kind></kind>
          <date>114/05/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/69</main-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣興電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIMICRON TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳裕華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚瑞敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIN, RA-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,576</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/770,328</doc-number>
          <date>20250311</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板結構</chinese-title>
        <english-title>SUBSTRATE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板結構，包括一介電基板、一黏著促進層、一導電材料、至少一介電層及至少一接墊。介電基板具有彼此相對的一上表面與一下表面及貫穿介電基板且連接上表面與下表面的至少一通孔。黏著促進層配置於介電基板的上表面上、下表面上及至少一通孔的內壁上。導電材料填滿至少一通孔而定義出至少一導電通孔。至少一介電層配置於黏著促進層上且具有暴露出至少一導電通孔的至少一開口。至少一開口的一口徑大於至少一導電通孔的一孔徑。至少一接墊配置於至少一介電層的至少一開口內且延伸至至少一介電層上。至少一接墊與至少一導電通孔電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate structure includes a dielectric substrate, an adhesion promotion layer (APL), a conductive material, at least one insulation layer and at least one pad. The dielectric substrate has an upper surface, a lower surface opposite to each other and at least one through-hole passing through the dielectric substrate and connecting the upper surface and the lower surface. The APL is disposed on the upper surface, on the lower surface, and on an inner wall of the at least one through hole of the dielectric substrate. The conductive material fills the at least one through hole to define the at least one conductive through hole. The at least one insulation layer is disposed on APL and has at least one opening exposing at least one conductive through hole. A diameter of the at least one opening is larger than a diameter of the at least one conductive through hole. The at least one pad is disposed in the at least one opening of the at least one insulation layer and extends onto the at least one insulation layer. The at least one pad is electrically connected to the at least one conductive through hole.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板結構</p>
        <p type="p">110:介電基板</p>
        <p type="p">111:上表面</p>
        <p type="p">112:通孔</p>
        <p type="p">113:下表面</p>
        <p type="p">115:周圍表面</p>
        <p type="p">120:黏著促進層</p>
        <p type="p">121、123:表面</p>
        <p type="p">130:導電通孔</p>
        <p type="p">131:頂面</p>
        <p type="p">133:底面</p>
        <p type="p">140:介電層</p>
        <p type="p">142:開口</p>
        <p type="p">150:接墊</p>
        <p type="p">155:線路</p>
        <p type="p">CM:導電材料</p>
        <p type="p">D1:口徑</p>
        <p type="p">D2:孔徑</p>
        <p type="p">M:金屬層</p>
        <p type="p">S:種子層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="559px" img-content="tif" inline="yes" orientation="portrait" width="1034px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622557</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118210</doc-number>
          <kind></kind>
          <date>114/05/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">G02B6/12</main-classification>
        <further-classification edition="200601120260225B">G02B6/36</further-classification>
        <further-classification edition="200601120260225B">B81B3/00</further-classification>
        <further-classification edition="200601120260225B">B81C1/00</further-classification>
        <further-classification edition="200601120260225B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宥纁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU-HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/680,121</doc-number>
          <date>20240807</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/083,683</doc-number>
          <date>20250319</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝、半導體結構及其製造之方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE, SEMICONDUCTOR STRUCTURE, AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露描述了一種在微機電系統（MEMS）結構上具有光子元件的半導體封裝。該半導體封裝包含：基板、設置在基板上的MEMS結構以及設置在MEMS結構上的光子元件。MEMS結構包含：鍵合到基板的梳齒結構和耦合到梳齒結構的框架結構。光子元件鍵合到框架結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure describes a semiconductor package with a photonic device on a micro-electro-mechanical systems (MEMS) structure. The semiconductor package includes a substrate, a MEMS structure disposed on the substrate, and a photonic device disposed on the MEMS structure. The MEMS structure includes a comb structure bonded to the substrate and a frame structure coupled to the comb structure. The photonic device is bonded to the frame structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝</p>
        <p type="p">102:基板</p>
        <p type="p">104:MEMS結構</p>
        <p type="p">106:光子元件</p>
        <p type="p">108:第一鍵合結構</p>
        <p type="p">110:銲線鍵合</p>
        <p type="p">112:電連接器</p>
        <p type="p">114:銲線鍵合</p>
        <p type="p">116:第二鍵合結構</p>
        <p type="p">120:梳齒結構</p>
        <p type="p">122:中間框架</p>
        <p type="p">124:外框架</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="618px" img-content="tif" inline="yes" orientation="portrait" width="961px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623603</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118219</doc-number>
          <kind></kind>
          <date>114/05/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="200601120260302B">G01B11/24</further-classification>
        <further-classification edition="200601120260302B">G01N21/95</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王學雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XUEWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/797,715</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於改良接合後性能的晶圓形狀配對之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR WAFER SHAPE PAIRING FOR IMPROVED POST-BONDING PERFORMANCE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於晶圓至晶圓接合之晶圓配對之系統可包含一晶圓形狀計量子系統及控制器。該控制器可接收一組頂部晶圓及底部晶圓之形狀測量且接著基於該等形狀測量而將該組頂部晶圓及該等底部晶圓分類成晶圓群組。該控制器可使用一晶圓群組號碼標記各頂部及底部晶圓且自選定晶圓群組判定晶圓配對。該控制器可計算該組晶圓配對之各晶圓配對之彎曲度差且基於彎曲度差之間隔而將該組晶圓配對分類成晶圓配對群組。該控制器可使各晶圓配對群組與一對應參考配方相關聯且根據與一選定晶圓配對群組相關聯之一對應參考配方引導一接合器接合該選定晶圓配對群組中之該等晶圓配對。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for wafer pairing for wafer-to-wafer bonding may include a wafer shape metrology sub-system and controller. The controller may receive the shape measurements for a set of top wafers and bottom wafers and then sort the set of top wafers and the bottom wafers into wafer groups based on the shape measurements. The controller may tag each top and bottom wafer with a wafer group number and determine wafer pairs from selected wafer groups. The controller may calculate the bow difference for each wafer pair of the set of wafer pairs and sort the set of wafer pairs into wafer pair groups based on intervals of bow difference. The controller may associate each wafer pair group with a corresponding reference recipe and direct a bonder to bond the wafer pairs in a selected wafer pair group according to a corresponding reference recipe associated with the selected wafer pair group.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓形狀計量系統</p>
        <p type="p">101a:第一照明光束</p>
        <p type="p">101b:第二照明光束</p>
        <p type="p">102:晶圓形狀計量子系統</p>
        <p type="p">103a至103c:資料信號</p>
        <p type="p">104:控制器</p>
        <p type="p">105a:第一干涉儀子系統</p>
        <p type="p">105b:第二干涉儀子系統</p>
        <p type="p">106:處理器</p>
        <p type="p">108:記憶體</p>
        <p type="p">114:接合器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="587px" img-content="tif" inline="yes" orientation="portrait" width="895px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623515</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118313</doc-number>
          <kind></kind>
          <date>114/05/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/40</main-classification>
        <further-classification edition="201101120260302B">B82Y40/00</further-classification>
        <further-classification edition="202501120260302B">H10D64/01</further-classification>
        <further-classification edition="202501120260302B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐紹華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHAO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡元正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, YUAN-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佳儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIA-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡塏旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, KAI-MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭裕鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, YU-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/956,632</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體結構及製造半導體結構的方法。方法包括：在基板上方形成半導體奈米片堆疊；在半導體奈米片堆疊上方形成犧牲閘極結構；形成與犧牲閘極結構相鄰的襯墊；形成與襯墊相鄰的介電層；移除犧牲閘極結構以形成閘極腔；執行氧化製程以氧化與閘極腔相鄰的襯墊的一部分；以及移除與閘極腔相鄰的襯墊的所述部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are semiconductor structures and methods for fabricating semiconductor structures. A method includes forming a stack of semiconductor nanosheets over a substrate; forming a sacrificial gate structure over the stack of semiconductor nanosheets; forming a liner adjacent to the sacrificial gate structure; forming a dielectric layer adjacent to the liner; removing the sacrificial gate structure to form a gate cavity; performing an oxidation process to oxidize a portion of the liner adjacent to the gate cavity; and removing the portion of the liner adjacent to the gate cavity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:側壁間隔物</p>
        <p type="p">790:頂端</p>
        <p type="p">791:底部段</p>
        <p type="p">792:頂部段</p>
        <p type="p">A1:角度</p>
        <p type="p">D1:底部臨界尺寸</p>
        <p type="p">D2:頂部臨界尺寸</p>
        <p type="p">H0、H5:高度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10048.png" file="d10048.TIF" giffile="ed10048.png" height="763px" img-content="tif" inline="yes" orientation="portrait" width="611px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623026</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118386</doc-number>
          <kind></kind>
          <date>114/05/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">H01J37/04</main-classification>
        <further-classification edition="200601120260226B">H01J37/10</further-classification>
        <further-classification edition="200601120260226B">H01J37/244</further-classification>
        <further-classification edition="200601120260226B">H01J37/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　辛容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, XINRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯迪　艾倫　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRODIE, ALAN D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/682,169</doc-number>
          <date>20240812</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/901,626</doc-number>
          <date>20240930</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用微偏轉器陣列產生電子束</chinese-title>
        <english-title>CREATION OF ELECTRON BEAMS USING A MICRO-DEFLECTOR ARRAY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一槍透鏡接收一電子束或其他粒子束，該電子束或其他粒子束接著藉由一孔隙陣列分成小束。該等小束之各者係遠心的。一全域成像透鏡接收來自該孔隙陣列之該等小束。在該全域成像透鏡之一平面上之一微偏轉器陣列包含經組態以個別地控制之偏轉器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gun lens receives an electron beam or other particle beam, which is then divided into beamlets by an aperture array. Each of the beamlets is telecentric. A global imaging lens receives the beamlets from the aperture array. A micro deflector array on a plane of the global imaging lens includes deflectors configured to be individually controlled.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">101:電子束源</p>
        <p type="p">102:電子束</p>
        <p type="p">103:全域槍透鏡(GL)</p>
        <p type="p">104:孔隙陣列(APA)</p>
        <p type="p">105:遠心電子小束</p>
        <p type="p">106:全域成像透鏡(IL)/磁性影像透鏡(MIL)</p>
        <p type="p">111:微偏轉器陣列(MDA)</p>
        <p type="p">z:光軸</p>
        <p type="p">α:半小束角度/板角度</p>
        <p type="p">β:總射束角度/板角度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="683px" img-content="tif" inline="yes" orientation="portrait" width="973px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623439</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118409</doc-number>
          <kind></kind>
          <date>114/05/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/67</main-classification>
        <further-classification edition="202501120260302B">H10D62/17</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃少澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SHAO-TSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何韋德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, WEI-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士棊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,665</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/095,884</doc-number>
          <date>20250331</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體裝置及其形成方法。半導體裝置可包括第一源極/汲極區、位於第一源極/汲極區側壁上的第一奈米結構、圍繞第一奈米結構的第一閘極結構、位於第一閘極結構之上的第一隔離區與第二隔離區、以及位於第一源極/汲極區與第一閘極結構之上的介電層。第一隔離區與第二隔離區可各自包括第一介電材料與第一摻質。介電層可延伸在第一隔離區與第二隔離區之間。介電層可包括第二介電材料。介電層可不含第一摻質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device and the method of forming the same are provided. The semiconductor device may include a first source/drain region, a first nanostructure on a sidewall of the first source/drain region, a first gate structure around the first nanostructure, a first isolation region and a second isolation region on the first gate structure, and a dielectric layer over the first source/drain region and the first gate structure. The first isolation region and the second isolation region may each comprise a first dielectric material and a first dopant. The dielectric layer may extend between the first isolation region and the second isolation region. The dielectric layer may comprise a second dielectric material. The dielectric layer may be free of the first dopant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板</p>
        <p type="p">20’:半導體鰭片</p>
        <p type="p">22:多層堆疊</p>
        <p type="p">24A,24B:虛設奈米結構</p>
        <p type="p">26U:上半導體奈米結構</p>
        <p type="p">26L:下半導體奈米結構</p>
        <p type="p">28:半導體條帶</p>
        <p type="p">34:STI區域</p>
        <p type="p">36:虛設介電層</p>
        <p type="p">38:虛設閘極層</p>
        <p type="p">40’:遮罩層</p>
        <p type="p">42:虛設閘極堆疊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.png" file="d10024.TIF" giffile="ed10024.png" height="866px" img-content="tif" inline="yes" orientation="portrait" width="684px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622331</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118458</doc-number>
          <kind></kind>
          <date>114/05/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">E03C1/044</main-classification>
        <further-classification edition="200601120260224B">B67D1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商吉賽公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GESSI S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉賽　吉安　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GESSI, GIAN LUCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>義大利</country>
          <doc-number>102024000013726</doc-number>
          <date>20240614</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>處理水生產單元及相關聯分配裝置</chinese-title>
        <english-title>CONDITIONED WATER PRODUCTION UNIT AND ASSOCIATED DISPENSING DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供處理水生產單元(110)，其包含：&lt;br/&gt;  -    一第一槽(120)，其用於一第一類型之處理水及/或用於預定用以生產該第一類型之處理水的一輔助流體，以及&lt;br/&gt;  -    一主殼(111)，其容納該第一槽(120)之至少部分，較佳地為全部，其中該主殼(111)識別至少由該第一槽(120)部分地佔據之一內部容積並且具有一自由容積(160)，&lt;br/&gt;    該處理水生產單元(110)之特徵在於其包含配置於該自由容積(160)中之一填料(140)，該填料(140)預定用以產生及/或在使用中決定該處理水生產單元(110)之熱力學效率的至少一提高及/或至少在該自由容積(160)之一部分中之冷凝及/或霜凍形成的一減少。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Conditioned water production unit (110) comprising:&lt;br/&gt; - a first tank (120) for a first type of conditioned water and/or for an accessory fluid destined to the production of said first type of conditioned water, and&lt;br/&gt; - a primary case (111), containing at least part of, preferably entirely, said first tank (120), wherein said primary case (111) identifies an inner volume partially occupied at least by said first tank (120) and has a free volume (160),&lt;br/&gt; said conditioned water production unit (110) being characterized in that it comprises a filler (140) arranged in said free volume (160), said filler (140) being destined to produce, and/or determining in use, at least an increase of thermodynamic efficiency of said conditioned water production unit (110) and/or a reduction of the formation of condensation and/or hoarfrost at least in a part of said free volume (160).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理水分配裝置</p>
        <p type="p">101:分配本體</p>
        <p type="p">102:控制機構</p>
        <p type="p">102a:閥組，主閥，閥</p>
        <p type="p">103a:第一入口</p>
        <p type="p">103b:第二入口</p>
        <p type="p">105:第一控制元件，控制元件</p>
        <p type="p">110:處理水生產單元</p>
        <p type="p">111:主殼</p>
        <p type="p">113:入口管道</p>
        <p type="p">114:入口</p>
        <p type="p">120:第一槽，槽</p>
        <p type="p">130:第二槽，槽</p>
        <p type="p">140:填料</p>
        <p type="p">150:熱機，閉合迴路熱機，冷凍熱機</p>
        <p type="p">160:自由容積</p>
        <p type="p">180:資料處理單元</p>
        <p type="p">200:支撐表面</p>
        <p type="p">301:第一未處理水源</p>
        <p type="p">302:第二未處理水源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="797px" img-content="tif" inline="yes" orientation="portrait" width="702px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621685</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118620</doc-number>
          <kind></kind>
          <date>114/05/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/485</main-classification>
        <further-classification edition="200601120260302B">A61K31/137</further-classification>
        <further-classification edition="200601120260302B">A61K9/54</further-classification>
        <further-classification edition="200601120260302B">A61P3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商納爾普羅皮恩製藥有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALPROPION PHARMACEUTICALS LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱吉爾　羅伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHURCHILL, ROB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切斯納特　亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHESNUT, AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/917,080</doc-number>
          <date>20241016</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含納曲酮及／或安非他酮之醫藥調配物</chinese-title>
        <english-title>PHARMACEUTICAL FORMULATIONS COMPRISING NALTREXONE AND/OR BUPROPION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">闡述包含納曲酮(naltrexone)及/或安非他酮(bupropion)之醫藥調配物。此類醫藥調配物可包含緩釋多層珠粒。亦闡述投與此類調配物之方法，諸如用於治療超重或肥胖症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described are pharmaceutical formulations comprising naltrexone and/or bupropion. Such pharmaceutical formulations can comprise extended-release, multilayer beads. Also described are methods of administering such formulations, such as for the treatment of overweight or obesity.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="507px" img-content="tif" inline="yes" orientation="portrait" width="730px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623526</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118693</doc-number>
          <kind></kind>
          <date>114/05/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/00</main-classification>
        <further-classification edition="201901120260302B">G06F17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂﨑哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAZAKI, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸本洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUMOTO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-089237</doc-number>
          <date>20240531</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電腦程式、資訊處理方法、基板處理方法、資訊處理裝置、及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種期待能支援對於成膜後的基板之蝕刻處理之配方的生成之電腦程式、資訊處理方法、基板處理方法、資訊處理裝置、及基板處理裝置。  &lt;br/&gt;　　本實施形態之電腦程式，其使電腦執行生成對於基板處理裝置所致之成膜後的基板之蝕刻處理之配方的處理，其中，在記憶部記憶有設定關於蝕刻處理之不同條件之複數個配方零件、以及實施了基於各配方零件之蝕刻處理之情形的蝕刻輪廓；使前述電腦執行以下處理：取得蝕刻處理所致之目標蝕刻輪廓，從前述記憶部選擇達成所取得之前述目標蝕刻輪廓之複數個配方零件，並生成組合了所選擇之前述複數個配方零件之配方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">11:腔室</p>
        <p type="p">12:基板保持機構</p>
        <p type="p">12a:保持部</p>
        <p type="p">12b:支柱部</p>
        <p type="p">12c:驅動部</p>
        <p type="p">13a:第一吐出部</p>
        <p type="p">13b:第二吐出部</p>
        <p type="p">14:回收杯</p>
        <p type="p">14a:排液口</p>
        <p type="p">14b:排氣口</p>
        <p type="p">15:FFU</p>
        <p type="p">16a,16b:供給源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="659px" img-content="tif" inline="yes" orientation="portrait" width="808px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623611</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118735</doc-number>
          <kind></kind>
          <date>114/05/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P76/00</main-classification>
        <further-classification edition="202601120260302B">H10W46/00</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巫明勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MING HSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳右瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/963,587</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種一半導體裝置的製造方法包括：在一基板上形成複數個光阻劑條帶，其中一開口形成於該等光阻劑條帶中之每一者中；在該等光阻劑條帶之該等開口中形成複數個觸點，其中該等觸點中每一者的一外部輪廓為一條帶形狀；及使用該等光阻劑條帶以形成複數個位元線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A manufacturing method of a semiconductor device includes forming a plurality of photoresist strips on a substrate, in which an opening is formed in each of the photoresist strips; forming a plurality of contacts in the openings of the photoresist strips, in which an outer contour of each of the contacts is a string shape; and using the photoresist strips to form a plurality of bit lines.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:基板</p>
        <p type="p">120:主動區域</p>
        <p type="p">130:觸點</p>
        <p type="p">140:周邊觸點</p>
        <p type="p">150:位元線</p>
        <p type="p">200:光阻劑條帶</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="755px" img-content="tif" inline="yes" orientation="portrait" width="942px">
          </img>
        </representative>
      </representative-img>
    </description>
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          <doc-number>114118749</doc-number>
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          <date>114/05/19</date>
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        <main-classification edition="202501120251002B">H10D30/01</main-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李健瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>郭建億</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, CHIEN-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游明華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, MING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/962,312</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括在半導體基板上沉積多層堆疊，其中半導體基板之頂表面平行於(110)晶面；蝕刻多層堆疊及半導體基板以形成鰭片；在鰭片中鄰近虛設閘極形成第一凹槽，其中鰭片中的第一凹槽之底表面與(110)晶面共面；及在第一凹槽中形成磊晶源極/汲極區，其中磊晶源極/汲極區包括磊晶源極/汲極區之底部部分、及在磊晶源極/汲極區之底部部分上方的磊晶源極/汲極區之頂部部分，其中當沿著&lt;img align="absmiddle" height="34px" width="55px" file="ed10004.JPG" alt="ed10004.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;晶向觀察時，磊晶源極/汲極區之頂部部分中的位錯數目大於磊晶源極/汲極區之底部部分中的位錯數目。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes depositing a multi-layer stack on a semiconductor substrate, wherein a top surface of the semiconductor substrate is parallel to the (110) crystallographic plane, etching the multi-layer stack and the semiconductor substrate to form a fin, forming a first recess in the fin adjacent the dummy gate, wherein a bottom surface of the first recess in the fin is coplanar with the (110) crystallographic plane, and forming an epitaxial source/drain region in the first recess, wherein the epitaxial source/drain region includes a bottom portion of the epitaxial source/drain region, and a top portion of the epitaxial source/drain region over the bottom portion of the epitaxial source/drain region, wherein when observed along the ＜1&lt;img align="absmiddle" height="13px" width="3px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;0＞ crystallographic direction, a number of dislocations in the top portion of the epitaxial source/drain region is greater than a number of dislocations in the bottom portion of the epitaxial source/drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:基板</p>
        <p type="p">50N:n型區</p>
        <p type="p">50P:p型區</p>
        <p type="p">54A~54C:第二奈米結構</p>
        <p type="p">60:通道區</p>
        <p type="p">81:第一間隔物</p>
        <p type="p">90:內部間隔物</p>
        <p type="p">91:第一層</p>
        <p type="p">92A:磊晶源極/汲極區之底部部分</p>
        <p type="p">92B:磊晶源極/汲極區之頂部部分</p>
        <p type="p">94:CESL</p>
        <p type="p">96:第一ILD</p>
        <p type="p">102:閘電極</p>
        <p type="p">104:閘極遮罩</p>
        <p type="p">106:第二ILD</p>
        <p type="p">110:矽化物區</p>
        <p type="p">112:源極/汲極觸點</p>
        <p type="p">114:閘極觸點</p>
        <p type="p">120:閘極介電層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10084.png" file="d10084.TIF" giffile="ed10084.png" height="707px" img-content="tif" inline="yes" orientation="portrait" width="631px">
          </img>
        </representative>
      </representative-img>
    </description>
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          <doc-number>202623347</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114118759</doc-number>
          <kind></kind>
          <date>114/05/20</date>
        </document-id>
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        <main-classification edition="202301120260302B">H10B10/00</main-classification>
        <further-classification edition="202601120260302B">H10P30/00</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳於貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-BEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
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              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,147</doc-number>
          <date>20241121</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/093,691</doc-number>
          <date>20250328</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其形成方法以及記憶體單元</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME AND MEMORY CELL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供半導體裝置結構及其形成方法，在一些實施例中，進行佈植製程，以將摻雜物植入源極/汲極區，以改善裝置效能。舉例來說，可透過額外摻雜物增強靜態隨機存取記憶體單元中的電晶體的源極/汲極區，以改善靜態隨機存取記憶體單元的效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide a semiconductor device structure and methods of forming the same. In some embodiments, an implantation process is performed to implant a dopant into a S/D region to improve device performance. For example, source/drain regions of the transistors in a SRAM cell may be enhanced by additional dopants to improve the SRAM cell performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:靜態隨機存取記憶體單元</p>
        <p type="p">101:基底</p>
        <p type="p">106:半導體通道層</p>
        <p type="p">130a,130b:閘極結構</p>
        <p type="p">132N:源極/汲極區</p>
        <p type="p">132ND:增強源極/汲極區</p>
        <p type="p">138:第一閘極間隙壁</p>
        <p type="p">139:第二閘極間隙壁</p>
        <p type="p">144:內部間隙壁</p>
        <p type="p">150:第一磊晶區</p>
        <p type="p">152:隔離層</p>
        <p type="p">153N:阻障磊晶層</p>
        <p type="p">154N:過渡磊晶層</p>
        <p type="p">154ND:增強過渡磊晶層</p>
        <p type="p">156N:塊狀磊晶層</p>
        <p type="p">156ND:增強塊狀磊晶層</p>
        <p type="p">160:背側源極/汲極接點</p>
        <p type="p">161:襯墊</p>
        <p type="p">166:蝕刻停止層</p>
        <p type="p">168:第二層間介電層</p>
        <p type="p">172:閘極介電層</p>
        <p type="p">174:閘極電極層</p>
        <p type="p">192:矽化物層</p>
        <p type="p">194:前側源極/汲極接點</p>
        <p type="p">198:前側導通孔</p>
        <p type="p">PD:下拉電晶體</p>
        <p type="p">PG:傳輸閘極電晶體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.png" file="d10025.TIF" giffile="ed10025.png" height="669px" img-content="tif" inline="yes" orientation="portrait" width="805px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202622297</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114118787</doc-number>
          <kind></kind>
          <date>114/05/20</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120260302B">C25D5/12</main-classification>
        <further-classification edition="200601120260302B">C25D5/50</further-classification>
        <further-classification edition="200601120260302B">C25D3/56</further-classification>
        <further-classification edition="200601120260302B">C25D7/00</further-classification>
        <further-classification edition="200601120260302B">C25D5/36</further-classification>
        <further-classification edition="200601120260302B">C25D5/44</further-classification>
        <further-classification edition="202601120260302B">H10W70/66</further-classification>
      </classification-ipc>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商古河電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商古河精密金屬工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA PRECISION ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田真由</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛原颯己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUZUHARA, SOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠崎健作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOZAKI, KENSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-124705</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子零件用材料及其製造方法、引線架材料及其製造方法、以及半導體封裝體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種電子零件用材料，假定組裝半導體封裝體時，例如，在400℃加熱的情況下，仍具有高的焊料潤濕性，而且，在120℃左右的高溫環境下使用時，仍可使構成含鎳(Ni)層的鎳原子擴散至表面而與焊料或引線反應所造成的連接可靠性下降不易發生。&lt;br/&gt;   電子零件用材料1具有由導電材料組成的基體2、與形成於基體2的至少一部分的表面21之表面覆膜3，表面覆膜3具有含鎳層31，該含鎳層31含有鎳，由包含厚度方向t之剖面觀看，含鎳層31的平均結晶粒徑在0.10μm以上且0.50μm以下的範圍，從藉由電子背向散射繞射(EBSD)法實行之結晶取向解析所獲得的前述剖面中的晶粒平均取向差(GAM)的平均值在0.95°以上且2.00°以下的範圍，並且前述剖面中的GAM的眾數為0.7°以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電子零件用材料</p>
        <p type="p">10:引線架材料</p>
        <p type="p">2:基體</p>
        <p type="p">21:表面</p>
        <p type="p">3:表面覆膜</p>
        <p type="p">31:含鎳層</p>
        <p type="p">t:厚度方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="405px" img-content="tif" inline="yes" orientation="portrait" width="655px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622523</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118796</doc-number>
          <kind></kind>
          <date>114/05/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120260302B">G01R31/26</main-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西顯太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-087002</doc-number>
          <date>20240529</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>檢查系統、及檢查系統之組裝方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種具有對應於檢查對象元件的擴充性而能夠降低成本的技術。  &lt;br/&gt;  檢查系統係檢查具有多個DUT的晶圓W。檢查系統係包含探針卡與具有多個DUT的數量以上的中繼單位部的介面部。檢查系統係包含檢查中繼單位部的數量以下的DUT的模組板與層積在介面部與模組板之間及/或多個模組板彼此之間的介面片。介面部係在與探針卡相反的面上可配置多個模組板。介面片係將介面部的多個中繼單位部與配置在介面部的模組板加以電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:介面部</p>
        <p type="p">211:基體</p>
        <p type="p">212:第1導通部</p>
        <p type="p">213:第2導通部</p>
        <p type="p">214:介面片</p>
        <p type="p">215:中繼單位部</p>
        <p type="p">26:測試頭</p>
        <p type="p">27:模組板</p>
        <p type="p">27A:第1模組板</p>
        <p type="p">27B:第2模組板</p>
        <p type="p">271:模組本體</p>
        <p type="p">272:導通部</p>
        <p type="p">273:訊號傳達部</p>
        <p type="p">274:電子電路</p>
        <p type="p">275:檢查單元</p>
        <p type="p">276:余白部</p>
        <p type="p">28:介面片</p>
        <p type="p">28A:第1介面片</p>
        <p type="p">28B:第2介面片</p>
        <p type="p">281:配線</p>
        <p type="p">282:主配線</p>
        <p type="p">283:副配線</p>
        <p type="p">284:旁路配線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="1012px" img-content="tif" inline="yes" orientation="portrait" width="620px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622019</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118802</doc-number>
          <kind></kind>
          <date>114/05/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">C04B35/565</main-classification>
        <further-classification edition="200601120251103B">C04B35/195</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＮＧＫ阿德列克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK ADREC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古宮山常夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMIYAMA, TSUNEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>各務欣哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKAMU, KINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中西泰久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANISHI, YASUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臼杵裕樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUKI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井戸翔也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDO, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-208600</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>燒成用托架</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種燒成用托架，在SiC系基板上設有包含富鋁紅柱石的含富鋁紅柱石層，其中含富鋁紅柱石層滿足：含富鋁紅柱石層所含堇青石為3質量%以上50質量%以下與含富鋁紅柱石層所含鉀元素為1質量%以上5質量%以下的至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板</p>
        <p type="p">4:含富鋁紅柱石層</p>
        <p type="p">6:第一塗層</p>
        <p type="p">8:第二塗層</p>
        <p type="p">10:燒成用托架</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.bmp" file="ed10007.bmp" height="391px" img-content="tif" inline="yes" orientation="portrait" width="556px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621884</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118808</doc-number>
          <kind></kind>
          <date>114/05/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">B29B11/16</main-classification>
        <further-classification edition="200601120260226B">B29B15/10</further-classification>
        <further-classification edition="200601120260226B">B29C70/32</further-classification>
        <further-classification edition="200601120260226B">D06M10/00</further-classification>
        <further-classification edition="200601120260226B">D06M13/224</further-classification>
        <further-classification edition="200601120260226B">D06M13/463</further-classification>
        <further-classification edition="200601120260226B">D06M13/503</further-classification>
        <further-classification edition="200601120260226B">D06M15/263</further-classification>
        <further-classification edition="200601120260226B">D06M15/53</further-classification>
        <further-classification edition="200601120260226B">D06M15/65</further-classification>
        <further-classification edition="200601120260226B">F16J12/00</further-classification>
        <further-classification edition="200601120260226B">F17C1/06</further-classification>
        <further-classification edition="200601320260226B">B29K105/08</further-classification>
        <further-classification edition="200601320260226B">D06M101/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須賀勇貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀之內綾信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORINOUCHI, AYANOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中文彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, FUMIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧田治己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUDA, HARUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松島佳保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHIMA, KAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-084552</doc-number>
          <date>20240524</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-123066</doc-number>
          <date>20240730</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>日本</country>
          <doc-number>2024-168168</doc-number>
          <date>20240927</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>日本</country>
          <doc-number>2024-231479</doc-number>
          <date>20241227</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含有上漿劑之碳纖維束、碳纖維強化複合材料、壓力容器及壓力容器用之含有上漿劑之碳纖維束</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種壓力容器，其係使熱硬化性樹脂含浸於含有上漿劑之碳纖維束並進行硬化而成的壓力容器，該含有上漿劑之碳纖維束含有：包含50質量%以上的不含環氧基之化合物(A)的上漿劑，其中，含有上漿劑之碳纖維束依照樹脂硬化配方B根據JIS R7608(2007)進行評價所得之股線強度(股線強度B’)為4.9GPa以上，依照樹脂硬化配方A根據JIS R7608(2007)進行評價所得之股線強度(股線強度A’)相對於股線強度B’的比例(強度利用率)為90%以上，堆積纖毛量為0.80mg以下。提供穩定展現高破裂強度的壓力容器。另外提供兼具堆積纖毛之抑制與集束性及品質穩定性的含有上漿劑之碳纖維束。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:工廠壓縮空氣管線</p>
        <p type="p">B:增壓機</p>
        <p type="p">C:水壓泵</p>
        <p type="p">D:數據記錄器</p>
        <p type="p">E:輸液軟管</p>
        <p type="p">F:固定機構</p>
        <p type="p">G:安全罩</p>
        <p type="p">H:壓力容器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="469px" img-content="tif" inline="yes" orientation="portrait" width="730px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623431</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118883</doc-number>
          <kind></kind>
          <date>114/05/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202501120260302B">H10D84/83</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石哲齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHE CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊固峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,828</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/086,322</doc-number>
          <date>20250321</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供半導體裝置及其形成方法。一種例示性方法包括在基板上方形成半導體層堆疊，半導體層堆疊具有在下部通道層上方的上部通道層；形成半導體層，半導體層包含對下部通道層誘導壓應變的下部部分及對上部通道層誘導張應變的上部部分，其中下部部分與上部部分間隔開；在形成半導體層之後，形成包覆於上部通道層周圍的第一閘極結構及包覆於下部通道層周圍的第二閘極結構；移除半導體層之上部部分；及在形成第一閘極結構及第二閘極結構之後，形成耦接至上部通道層的源極/汲極特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and methods of forming the same are provided. An exemplary method includes forming a semiconductor layer stack over a substrate, the semiconductor layer stack having an upper channel layer over a lower channel layer, forming a semiconductor layer, the semiconductor layer comprising a lower portion inducing a compressive strain to the lower channel layer and an upper portion inducing a tensile strain to the upper channel layer, wherein the lower portion is spaced apart from the upper portion, after the forming of the semiconductor layer, forming a first gate structure wrapping around the upper channel layer and a second gate structure wrapping around the lower channel layer, removing the upper portion of the semiconductor layer, and after the forming of the first gate structure and the second gate structure, forming a source/drain feature coupled to the upper channel layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:中間結構</p>
        <p type="p">202:基板</p>
        <p type="p">226M:中間介電層</p>
        <p type="p">236:底部ILD層</p>
        <p type="p">256:第一介電結構</p>
        <p type="p">258:蝕刻終止層</p>
        <p type="p">260:ILD層</p>
        <p type="p">272:前側源極/汲極觸點</p>
        <p type="p">273:多層互連結構</p>
        <p type="p">274a:第一層</p>
        <p type="p">428a':下部源極/汲極特徵</p>
        <p type="p">486a,486b:矽化物層</p>
        <p type="p">488a,488b:後側源極/汲極觸點</p>
        <p type="p">2080L1,2080L2:下部通道構件</p>
        <p type="p">2080N1,2080N2:奈米結構</p>
        <p type="p">2080U1,2080U2:上部通道構件</p>
        <p type="p">X,Y,X:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10072.png" file="d10072.TIF" giffile="ed10072.png" height="726px" img-content="tif" inline="yes" orientation="portrait" width="857px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623380</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118957</doc-number>
          <kind></kind>
          <date>114/05/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260225B">H10D30/01</main-classification>
        <further-classification edition="202501120260225B">H10D30/43</further-classification>
        <further-classification edition="202501120260225B">H10D30/67</further-classification>
        <further-classification edition="202501120260225B">H10D62/10</further-classification>
        <further-classification edition="202501120260225B">H10D64/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭宇正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIAU, YU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉韋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張振維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉超慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHAO-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱于庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIOU, YU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭治棠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, CHIH-TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃泰鈞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, TAI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李資良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TZE-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/801,880</doc-number>
          <date>20240813</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>形成半導體結構、場效電晶體及環繞閘極場效電晶體的方法</chinese-title>
        <english-title>METHODS FOR FORMING SEMICONDUCTOR STRUCTURE, FIELD EFFECT TRANSISTOR AND GATE-ALL-AROUND FIELD EFFECT TRANSISTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體結構可以透過以下方式形成：在基板上方形成複數個半導體奈米線，其中半導體奈米線及基板透過間隙彼此垂直間隔開，且其中半導體奈米線透過支撐結構懸掛在基板上方；執行一系列的多個處理步驟的至少兩迭代，處理步驟包括沉積相對應的介電材料的可流動化學氣相沉積製程及以紫外線輻射照射相對應的介電材料的紫外線固化製程；經由等向性蝕刻透過可流動化學氣相沉積製程沉積並透過紫外線固化製程緻密化的介電材料，形成具有比半導體奈米線更小的橫向範圍的介電間隔件結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure may be formed by: forming semiconductor nanowires over a substrate, wherein the semiconductor nanowires and the substrate are vertically spaced from one another by gaps, and wherein the semiconductor nanowires are suspended over the substrate by a support structure; performing at least two iterations of a sequence of processing steps that includes a flowable chemical vapor deposition process that deposits a respective dielectric material and an ultraviolet cure process that irradiates ultraviolet radiation to the respective dielectric material; and forming dielectric spacer structures having a lesser lateral extent than the semiconductor nanowires by isotropically etching the dielectric materials deposited by instances of the flowable chemical vapor deposition process and densified by instances of the ultraviolet cure process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體奈米線/基板單晶半導體層/奈米線堆疊/奈米線堆疊結構</p>
        <p type="p">17:奈米線間空腔</p>
        <p type="p">22:共形介電襯墊</p>
        <p type="p">24:介電間隔件結構</p>
        <p type="p">241:第一介電材料部分/第一介電材料</p>
        <p type="p">242:第二介電材料部分/第二介電材料</p>
        <p type="p">30:犧牲介電襯墊/共形介電襯墊</p>
        <p type="p">32:犧牲閘極電極</p>
        <p type="p">38:介電閘極間隔件</p>
        <p type="p">41:分離溝槽</p>
        <p type="p">hd1:第一水平方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10081.JPG" file="ed10081.JPG" height="714px" img-content="tif" inline="yes" orientation="portrait" width="968px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623381</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118966</doc-number>
          <kind></kind>
          <date>114/05/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/01</main-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張榮宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JUNG-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊宗翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TSUNG-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍文廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, WEN-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江國誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, KUO-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張復成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FU-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,327</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/092,946</doc-number>
          <date>20250327</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置與其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置的形成方法。方法包括形成多個鰭狀結構於具有(110)結晶取向的基板的上表面之上，且鰭狀結構各自包括交錯的多個通道半導體部分與多個犧牲介電部分，其中源極/汲極溝槽露出鰭狀結構中相鄰的鰭狀結構的通道半導體部分的側壁，其中相鄰的鰭狀結構的通道半導體部分的上表面、側壁表面、與下表面具有(110)結晶取向。方法更包括沉積磊晶半導體區於源極/汲極溝槽的底部；形成底部介電結構於磊晶半導體區上；以及自相鄰的鰭狀結構的通道半導體部分的側壁表面磊晶成長源極/汲極結構，以填入源極/汲極溝槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming a semiconductor device is provided. The method includes forming, over a top surface of a substrate with a (110) crystal orientation, a plurality of fin structures each comprising alternating channel semiconductor portions and sacrificial dielectric portions, wherein sidewalls of the channel semiconductor portions of adjacent fin structures in the plurality of fin structures of each of the adjacent fin structures are exposed by a source/drain trench, wherein top, sidewall and bottom surfaces of the channel semiconductor portions of the adjacent fin structures have the (110) crystal orientation. The method further includes depositing an epitaxial semiconductor region at a bottom of the source/drain trench, forming a bottom dielectric feature over the epitaxial semiconductor region, and epitaxially growing a source/drain feature from the sidewall surfaces of the channel semiconductor portions of the adjacent fin structures to fill the source/drain trench.</p>
      </isu-abst>
      <representative-img>
        <p type="p">L1:第一源極/汲極磊晶層</p>
        <p type="p">L2:第二源極/汲極磊晶層</p>
        <p type="p">L3:第三源極/汲極磊晶層</p>
        <p type="p">L4:第四源極/汲極磊晶層</p>
        <p type="p">208P:通道半導體部分</p>
        <p type="p">209P:硬遮罩部分</p>
        <p type="p">210B:基底部分</p>
        <p type="p">230:源極/汲極溝槽</p>
        <p type="p">238:內側間隔物</p>
        <p type="p">240:磊晶半導體區</p>
        <p type="p">242:底部介電結構</p>
        <p type="p">246:空洞</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="711px" img-content="tif" inline="yes" orientation="portrait" width="1079px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622564</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114118977</doc-number>
          <kind></kind>
          <date>114/05/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251029B">G02B6/34</main-classification>
        <further-classification edition="200601120251029B">G02B6/124</further-classification>
        <further-classification edition="200601120251029B">G02B6/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田子容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIEN, TZU JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張任遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JEN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/963,861</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>封裝體及形成封裝體的方法</chinese-title>
        <english-title>PACKAGE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施方式說明一種封裝體。此封裝體包括一個光子晶粒，其中包括：位於包覆層中的波導、第一光柵耦合器及第二光柵耦合器。第一光柵耦合器與第二光柵耦合器在第一方向上具有間隙，其中第一光柵耦合器在垂直於第一方向的第二方向上具有第一端及第二端。光子晶粒還包括穿過包覆層、設置在間隙中並且沿第二方向延伸超過第一光柵耦合器的第一端及第二端的第一光學保護結構。此封裝體還包括設置在第一介電層中的互連結構和位於包覆層上方的第二介電層，電子晶粒包括電耦合到互連結構的電路，以及橫向圍繞電子晶粒的絕緣層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure illustrates a package. The package includes a photonic die including: a waveguide, a first grating coupler, and a second grating coupler disposed in a cladding layer. The first grating coupler and the second grating coupler have a gap therebetween in a first direction, wherein the first grating coupler has a first end and a second end in a second direction perpendicular to the first direction. The photonic die also includes a first optical guard structure through the cladding layer, disposed in the gap, and extending over the first end and the second end of the first grating coupler in the second direction. The package also includes an interconnect structure disposed in a first dielectric layer and a second dielectric layer over the cladding layer, an electronic die including circuits electrically coupled to the interconnect structure, and an insulating layer laterally surrounding the electronic die.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光子封裝體</p>
        <p type="p">101:光子晶粒</p>
        <p type="p">102B:絕緣層，埋氧層</p>
        <p type="p">102C:塊體基板，矽基板</p>
        <p type="p">104:波導</p>
        <p type="p">106:光子元件</p>
        <p type="p">108:光柵耦合器</p>
        <p type="p">108A:第一光柵耦合器</p>
        <p type="p">108B:第二光柵耦合器</p>
        <p type="p">110:包覆層</p>
        <p type="p">116:觸點</p>
        <p type="p">118:第一光學保護結構</p>
        <p type="p">118A:第一光學隔離</p>
        <p type="p">118B:第二光學隔離</p>
        <p type="p">118C:共享部分</p>
        <p type="p">120:互連結構</p>
        <p type="p">122:第一介電層</p>
        <p type="p">124:第二介電層</p>
        <p type="p">126:第三介電層</p>
        <p type="p">128:連接層</p>
        <p type="p">130:導電板</p>
        <p type="p">132:第二光學保護結構</p>
        <p type="p">132A:第一光學隔離</p>
        <p type="p">132B:第二光學隔離</p>
        <p type="p">134:第三光學保護結構</p>
        <p type="p">134A:第一光學隔離</p>
        <p type="p">134B:第二光學隔離</p>
        <p type="p">136:第四光學保護結構</p>
        <p type="p">136A:第一光學隔離</p>
        <p type="p">136B:第二光學隔離</p>
        <p type="p">144:電子晶粒</p>
        <p type="p">146:晶粒連接器</p>
        <p type="p">148:介電接合層</p>
        <p type="p">150:絕緣層</p>
        <p type="p">T:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="637px" img-content="tif" inline="yes" orientation="portrait" width="933px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622631</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119015</doc-number>
          <kind></kind>
          <date>114/05/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G03F7/004</main-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="200601120260302B">C08K7/18</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下俊貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>代島雄汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIJIMA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平原真菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAHARA, MANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新川太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIKAWA, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山恭之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OYAMA, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/023398</doc-number>
          <date>20240627</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>感光性樹脂組成物、感光性元件、印刷線路板及印刷線路板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種感光性樹脂組成物，其含有（A）具有乙烯性不飽和鍵及酸性基之樹脂、（B）熱固化性樹脂、（C）光聚合性化合物、（D）光聚合起始劑及（E）無機填料，（E）無機填料含有平均粒徑為0.5μm以上之第1無機填料和平均粒徑為0.3μm以下之第2無機填料，第1無機填料的含量與第2無機填料的含量之固體成分質量比為6:4～8:2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感光性元件</p>
        <p type="p">10:支撐膜</p>
        <p type="p">20:感光層</p>
        <p type="p">30:保護膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="438px" img-content="tif" inline="yes" orientation="portrait" width="713px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202621703</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114119073</doc-number>
          <kind></kind>
          <date>114/05/21</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120251205B">A61K31/7088</main-classification>
        <further-classification edition="200601120251205B">C12N15/24</further-classification>
        <further-classification edition="200601120251205B">C12N15/12</further-classification>
        <further-classification edition="200601120251205B">A61K38/20</further-classification>
        <further-classification edition="200601120251205B">A61K38/16</further-classification>
        <further-classification edition="200601120251205B">A61P35/00</further-classification>
      </classification-ipc>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周民元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, MIN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YEN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊明華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MING-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴雅萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YA-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林美薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, MEI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林俐岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LI-TSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾郁傢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, YU-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳思遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, SSU-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴錦盆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHIN-PEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,841</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療癌症的mRNA組成物、含其之製劑及其用途</chinese-title>
        <english-title>MRNA COMPOSITION FOR TREATING CANCER, PREPARATION CONTAINING THE SAME AND USE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於治療癌症的mRNA組成物，包括：一編碼出靶向CD47之嵌合抗原受體(chimeric antigen receptor, CAR)的mRNA；以及一編碼出介白素-12 (interleukin 12, IL-12)的mRNA。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mRNA composition for treating cancer is provided. The mRNA composition for treating cancer includes a mRNA encoding a CD47 targeted chimeric antigen receptor (CAR) and a mRNA encoding interleukin 12 (IL-12).</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="698px" img-content="tif" inline="yes" orientation="portrait" width="976px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622478</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119113</doc-number>
          <kind></kind>
          <date>114/05/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G01N1/44</main-classification>
        <further-classification edition="200601120260224B">G01N25/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商奧寶科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORBOTECH LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波瑞特　艾爾卡納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PORAT, ELKANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>悠格夫　羅奈恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOGEV, RONEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特科　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TURKO, NIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩卡伊夫　伊格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAEV, IGOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯柯佛　有里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASKOVER, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/683,720</doc-number>
          <date>20240816</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/929,008</doc-number>
          <date>20241028</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體中之內部缺陷之熱偵測</chinese-title>
        <english-title>THERMAL DETECTION OF INTERNAL DEFECTS IN SEMICONDUCTOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">紅外線輻射，且具體而言短波紅外線輻射，可用作為半導體檢驗情境中之一主動熱成像程序之一熱源。在半導體檢驗情境中，超聲波亦可用作為一主動熱成像程序之一熱源。短波紅外線干涉可用於偵測一半導體之內表面處的動態溫度變化。作為熱源之短波紅外線輻射或作為熱源之超聲波可與短波紅外線干涉之使用組合以偵測動態溫度變化，其允許改良偵測解析度。短波紅外線干涉亦可用於直接偵測半導體直接接合界面處的次表面空隙。該短波紅外線干涉可或可不需要熱擾動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Infrared radiation, and specifically short-wave infrared radiation, may be used as a heat source for an active thermography process in the context semiconductor inspection. Ultrasonic acoustic waves may also be used as a heat source for an active thermography process in the context of semiconductor inspection. Short-wave infrared interference may be used to detect dynamic temperature changes at internal surfaces of a semiconductor, and specifically near a semiconductor direct-bond interface. Either of the short-wave infrared radiation as the heat source or the ultrasonic acoustic waves as the heat source may be combined with the use of short-wave infrared interference to detect dynamic temperature changes, which allows for improved detection resolution. Short-wave infrared interference may also be used to directly detect subsurface voids at the semiconductor direct-bond interface. The short-wave infrared interference may or may not require thermal perturbation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:主動熱成像系統</p>
        <p type="p">101:直接接合堆疊</p>
        <p type="p">102:熱源</p>
        <p type="p">102a:基於光之熱源</p>
        <p type="p">102b:基於聲波之熱源</p>
        <p type="p">104:載物台</p>
        <p type="p">106:成像子系統</p>
        <p type="p">106a:近紅外線(NIR)成像子系統</p>
        <p type="p">106b:短波紅外線(SWIR)成像子系統</p>
        <p type="p">106c:中波紅外線(MWIR)成像子系統</p>
        <p type="p">106d:長波紅外線(LWIR)成像子系統</p>
        <p type="p">107:收集紅外線光</p>
        <p type="p">108:控制器</p>
        <p type="p">109:紅外線影像</p>
        <p type="p">110a:上半導體裝置</p>
        <p type="p">110b:下半導體裝置</p>
        <p type="p">111:紅外線照明</p>
        <p type="p">112:直接接合</p>
        <p type="p">114:次表面空隙</p>
        <p type="p">116:處理器</p>
        <p type="p">118:記憶體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="868px" img-content="tif" inline="yes" orientation="portrait" width="730px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623448</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119138</doc-number>
          <kind></kind>
          <date>114/05/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/83</main-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
        <further-classification edition="202601120260302B">H10P14/24</further-classification>
        <further-classification edition="200601120260302B">B81C1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉鎮瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHENG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,944</doc-number>
          <date>20241126</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/088,873</doc-number>
          <date>20250324</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置結構及其形成方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例提供半導體裝置結構及其形成方法。半導體裝置結構包括複數個半導體奈米結構、圍繞半導體奈米結構中之各者的閘極堆疊、沿著閘極堆疊之側壁延伸的閘極間隔物、電連接至複數個半導體奈米結構中之第一半導體奈米結構的第一源極/汲極區、設置在第一源極/汲極區之下的半導體層、及設置在第一源極/汲極區與半導體層之間的第一介電層。第一介電層包括凹的第一頂表面及實質上平坦的第一底表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide semiconductor device structures and methods of forming the same. The semiconductor device structure includes a plurality of semiconductor nanostructures, a gate stack surrounding each of the semiconductor nanostructures, a gate spacer extending along a sidewall of the gate stack, a first source/drain region electrically connected to a first semiconductor nanostructure of the plurality of semiconductor nanostructures, a semiconductor layer disposed below the first source/drain region, and a first dielectric layer disposed between the first source/drain region and the semiconductor layer. The first dielectric layer includes a first top surface that is concave and a first bottom surface that is substantial flat.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板</p>
        <p type="p">20':半導體條帶</p>
        <p type="p">26L:下部半導體奈米結構</p>
        <p type="p">26U:上部半導體奈米結構</p>
        <p type="p">44:閘極間隔物</p>
        <p type="p">54:內部間隔物</p>
        <p type="p">55:半導體層</p>
        <p type="p">56:介電隔離層</p>
        <p type="p">57a:介電層</p>
        <p type="p">62L:下部源極/汲極區</p>
        <p type="p">62U:上部源極/汲極區</p>
        <p type="p">64a:介電層</p>
        <p type="p">70:CESL</p>
        <p type="p">72:ILD</p>
        <p type="p">78:閘極介電質</p>
        <p type="p">80L:下部閘電極</p>
        <p type="p">80U:上部閘電極</p>
        <p type="p">90:閘極堆疊</p>
        <p type="p">90L:上部閘極結構</p>
        <p type="p">90U:下部閘極結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10049.png" file="d10049.TIF" giffile="ed10049.png" height="962px" img-content="tif" inline="yes" orientation="portrait" width="740px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623652</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119285</doc-number>
          <kind></kind>
          <date>114/05/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W46/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋寅鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, INHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鐘秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONGSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MYUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭銀國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, EUNGUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙槿彙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KEUNHWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0165992</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容提供了一種半導體裝置，其包括：一主動層，其包括一核心區及一虛設區，該主動層包括一主動區及閘極結構，該主動區安置在該核心區及該虛設區上，該等閘極結構安置在該主動區上；一前互連層，其安置在該主動層上且包括一前互連結構；以及一後互連層，其安置在該主動層下方且包括一後互連結構。該等閘極結構包括第一閘極結構及虛設閘極結構，該等第一閘極結構安置在該核心區上且電氣連接至該前互連結構，該等虛設閘極結構安置在該虛設區上且電氣浮動。該前互連結構包括一第一前傳輸線及一第一前連接線，該第一前傳輸線安置在該核心區上，該第一前連接線安置在該虛設區上。該第一前連接線電氣連接至該第一前傳輸線且自該核心區延伸至該虛設區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes an active layer including a core region and a dummy region, the active layer including an active region disposed on the core and dummy regions, and gate structures disposed on the active region; a front interconnection layer disposed on the active layer and including a front interconnection structure; and a rear interconnection layer disposed below the active layer and including a rear interconnection structure. The gate structures include first gate structures disposed on the core region and electrically connected to the front interconnection structure, and dummy gate structures disposed on the dummy region and electrically floated. The front interconnection structure includes a first front transmission line disposed on the core region, and a first front connection line disposed on the dummy region. The first front connection line is electrically connected to the first front transmission line and extends from the core region to the dummy region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:半導體裝置</p>
        <p type="p">105:主動區</p>
        <p type="p">130:源極/汲極區</p>
        <p type="p">160:閘極結構</p>
        <p type="p">160a:第一閘極結構</p>
        <p type="p">160b:第二閘極結構</p>
        <p type="p">170:層間絕緣層</p>
        <p type="p">181:前側接點</p>
        <p type="p">183:上通孔</p>
        <p type="p">185:閘極接點</p>
        <p type="p">191:背側接點</p>
        <p type="p">193:後電力軌</p>
        <p type="p">195:下阻擋結構</p>
        <p type="p">210:前互連結構</p>
        <p type="p">215:前傳輸線</p>
        <p type="p">215a:第一前傳輸線</p>
        <p type="p">215b:第二前傳輸線</p>
        <p type="p">217:前連接線</p>
        <p type="p">217a:第一前連接線</p>
        <p type="p">219:前檢測線</p>
        <p type="p">219a:第一前檢測線</p>
        <p type="p">219b:第二前檢測線</p>
        <p type="p">220:前分離結構</p>
        <p type="p">225:前絕緣層</p>
        <p type="p">250:後互連結構</p>
        <p type="p">255:後傳輸線</p>
        <p type="p">255a:第一後傳輸線</p>
        <p type="p">255b:第二後傳輸線</p>
        <p type="p">265:後絕緣層</p>
        <p type="p">ACL:主動層</p>
        <p type="p">BML:後互連層</p>
        <p type="p">CR:核心區</p>
        <p type="p">DR:虛設區</p>
        <p type="p">FML:前互連層</p>
        <p type="p">II-II':線</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="716px" img-content="tif" inline="yes" orientation="portrait" width="915px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623382</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119351</doc-number>
          <kind></kind>
          <date>114/05/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260225B">H10D30/01</main-classification>
        <further-classification edition="202501120260225B">H10D30/67</further-classification>
        <further-classification edition="202501120260225B">H10D30/60</further-classification>
        <further-classification edition="202501120260225B">H10D30/62</further-classification>
        <further-classification edition="202501120260225B">H10D64/27</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閎康科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATERIALS ANALYSIS TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉原銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YUAN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱日照</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, JIH-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宇珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉致為</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHEE-WEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳弘仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/678523</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>閘極環繞式場效電晶體及其製造方法</chinese-title>
        <english-title>GATE ALL-AROUND FIELD EFFECT TRANSISTOR AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種閘極環繞式場效電晶體(Gate All-Around Field Effect Transistor，GAAFET)及其製造方法，GAAFET包括基板、第一犧牲層、通道層、保護層、複合場氧化層、汲極電極與源極電極以及閘極堆疊層。第一犧牲層設置在基板上，通道層設置在第一犧牲層上且從汲極區跨越至源極區。保護層設置在通道層上且位於汲極區及源極區中。複合場氧化層設置在保護層上且位於汲極區及源極區中，具有暴露保護層的汲極開口及源極開口。汲極電極及源極電極分別設置在汲極開口及源極開口中且電性接觸保護層。閘極堆疊層設置在基板上且位於通道區中，閘極堆疊層圍繞通道層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gate all-around field effect transistor (GAAFET) and a method for fabricating the same are provided. The GAAFET includes a substrate, a first sacrificial layer, a channel layer, a protective layer, a composite field oxide (FOX) layer, a drain electrode, a source electrode and a gate stacking layer. The first sacrificial layer is disposed on the substrate, and the channel layer is disposed on the first sacrificial layer and extends from a drain region to a source region. The protection layer is disposed on the channel layer and is located in the drain region and the source region. The composite FOX layer is disposed on the protection layer and is located in the drain region and the source region, and has a drain opening and a source opening for exposing the protection layer. The drain electrode and the source electrode are respectively disposed in the drain opening and the source opening and are electrically in contact with the protection layer. The gate stacking layer is disposed on the substrate and located in the channel region, and the gate stack layer surrounds the channel layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:GAAFET</p>
        <p type="p">200:基板</p>
        <p type="p">201:第一犧牲層</p>
        <p type="p">202:通道層</p>
        <p type="p">203:保護層</p>
        <p type="p">205:第二犧牲層</p>
        <p type="p">206:場氧化層</p>
        <p type="p">208:閘極絕緣層</p>
        <p type="p">209:第一閘極金屬層</p>
        <p type="p">210:第二閘極金屬層</p>
        <p type="p">CF:複合場氧化層</p>
        <p type="p">DE:汲極電極</p>
        <p type="p">SE:源極電極</p>
        <p type="p">DO:汲極開口</p>
        <p type="p">SO:源極開口</p>
        <p type="p">GS:閘極堆疊層</p>
        <p type="p">A1:通道區</p>
        <p type="p">A2:汲極區</p>
        <p type="p">A3:源極區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10066.bmp" file="ed10066.bmp" height="665px" img-content="tif" inline="yes" orientation="portrait" width="923px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621983</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119391</doc-number>
          <kind></kind>
          <date>114/05/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120260223B">C01B32/174</main-classification>
        <further-classification edition="200601120260223B">H01M4/66</further-classification>
        <further-classification edition="202101120260223B">H01M50/409</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱鉛筆股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI PENCIL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀧本恵莉子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKIMOTO, ERIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田後慶一朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGO, KEIICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田有亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>門端孝太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADOHASHI, KOUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-094267</doc-number>
          <date>20240611</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>奈米碳管分散液、電極膜及電池用隔離件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的特徵為包含選自由下述A)、B)及C)所組成的A群中2種以上的奈米碳管、纖維素衍生物及水。  &lt;br/&gt;(A群)  &lt;br/&gt;　　A) 纖維長為4μm~100μm、纖維寬為1nm~5nm之奈米碳管  &lt;br/&gt;　　B) 纖維長為30μm~20000μm、纖維寬為3nm~60nm之奈米碳管  &lt;br/&gt;　　C) 纖維長為10μm以下、纖維寬為10nm~30nm之奈米碳管。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623388</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119509</doc-number>
          <kind></kind>
          <date>114/05/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250908B">H10D30/47</main-classification>
        <further-classification edition="202501120250908B">H10D62/17</further-classification>
        <further-classification edition="202501120250908B">H10D62/13</further-classification>
        <further-classification edition="202501120250908B">H10D62/852</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金眞煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIN-HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃仁俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, IN JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊溶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOONYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0165645</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：一障壁層，其在一通道層上且包括具有與該通道層之能帶間隙不同之一能帶間隙的一材料；源極及汲極電極，其在該通道層上；一閘極電極，其在該障壁層上、在該源極電極與該汲極電極之間；一閘極半導體層，其在該障壁層與該閘極電極之間；一第一場分散層，其在該源極電極與該汲極電極之間且連接至該源極電極；一第二場分散層，其在該閘極電極與該汲極電極之間、在該障壁層上且連接至該第一場分散層；以及一第三場分散層，其在該第二場分散層與該汲極電極之間、在該障壁層上。該第一場分散層之一邊緣沿著一垂直方向與該第三場分散層之一邊緣對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes: a barrier layer on a channel layer and including a material having a different energy band gap from that of the channel layer; source and drain electrodes on the channel layer; a gate electrode on the barrier layer between the source electrode and the drain electrode; a gate semiconductor layer between the barrier layer and the gate electrode; a first field dispersion layer between the source electrode and the drain electrode, and connected to the source electrode; a second field dispersion layer between the gate electrode and the drain electrode on the barrier layer, and connected to the first field dispersion layer; and a third field dispersion layer between the second field dispersion layer and the drain electrode on the barrier layer. An edge of the first field dispersion layer is aligned with an edge of the third field dispersion layer along a vertical direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">132:通道層</p>
        <p type="p">155:閘極電極</p>
        <p type="p">170:源極電極</p>
        <p type="p">190:汲極電極</p>
        <p type="p">210:第一場分散層</p>
        <p type="p">220:第二場分散層、第二場分布層</p>
        <p type="p">230:第三場分散層、第三場分布層</p>
        <p type="p">A-A':線</p>
        <p type="p">CV1:第一通孔</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="862px" img-content="tif" inline="yes" orientation="portrait" width="663px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623653</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119540</doc-number>
          <kind></kind>
          <date>114/05/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W46/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
        <further-classification edition="200601120260302B">H01J37/26</further-classification>
        <further-classification edition="200601120260302B">H01J37/317</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋寅鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, INHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敬雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYOUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭明眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, MYUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭銀國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, EUNGUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁好榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, HOYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙槿彙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KEUN HWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許琇行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEO, SUHAENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174072</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：一基體，其包括彼此相對之一第一表面及一第二表面、一胞元區及一排除區；一活化圖案；一虛設圖案；源極/汲極圖案及虛設源極/汲極圖案；閘極電極；虛設閘極電極；一上導線，其連接至該等源極/汲極圖案中之至少一第一源極/汲極圖案；一下導線，其連接至該等源極/汲極圖案中之至少一第二源極汲極/圖案；以及一虛設佈線，其從該上導線或該下導線中之一者延伸，其中該等虛設閘極電極及該等虛設源極/汲極圖案與該上導線及該下導線絕緣，且其中該虛設佈線之端係在該排除區上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate including a first surface and a second surface that are opposite to each other, a cell region, and a keep out region, an activation pattern, a dummy pattern, source/drain patterns and dummy source/drain patterns, gate electrodes, dummy gate electrodes, an upper wire that is connected to at least one first source/drain pattern of the source/drain patterns, a lower wire that is connected to at least one second source drain/pattern of the source/drain patterns, and a dummy wiring extending from one of the upper wire or the lower wire, where the dummy gate electrodes and the dummy source/drain patterns are insulated from the upper wire and the lower wire, and where ends of the dummy wiring are on the keep out region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基體</p>
        <p type="p">120:第一層間絕緣層</p>
        <p type="p">130:第二層間絕緣層</p>
        <p type="p">140:第三層間絕緣層</p>
        <p type="p">150:第四層間絕緣層</p>
        <p type="p">210:第一虛設佈線</p>
        <p type="p">220:第二虛設佈線</p>
        <p type="p">310:上絕緣層</p>
        <p type="p">320:下絕緣層</p>
        <p type="p">A-A':線</p>
        <p type="p">AP:活化圖案</p>
        <p type="p">BCA:下接觸圖案</p>
        <p type="p">BM1:第一下導線圖案、下導線</p>
        <p type="p">BM2,BM4,BM5,BM6,BM7,BM8:下導線</p>
        <p type="p">BM3:下導線、第三下導線</p>
        <p type="p">BS:下導線區</p>
        <p type="p">CA:接觸圖案</p>
        <p type="p">CAV:接觸通孔</p>
        <p type="p">CB:閘極接觸圖案</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向、方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">DCA:虛設接觸圖案</p>
        <p type="p">DGE,DGI:虛設閘極結構</p>
        <p type="p">DGI_M:虛設主閘極結構、虛設主閘極絕緣層</p>
        <p type="p">DGI_S:虛設子閘極結構、虛設子閘極絕緣層</p>
        <p type="p">DGS:虛設閘極間隔件</p>
        <p type="p">DMG:虛設閘極電極</p>
        <p type="p">DMG_M:虛設子閘極結構、虛設主閘極電極、虛設閘極電極</p>
        <p type="p">DMG_S:虛設子閘極結構、虛設子閘極電極、虛設閘極電極</p>
        <p type="p">DP:虛設圖案</p>
        <p type="p">DSD:虛設源極/汲極圖案</p>
        <p type="p">FM1:上導線、第一上導線</p>
        <p type="p">FM2,FM4,FM6,FM8,FM9,FM10,FM11,FM12,FM14:上導線</p>
        <p type="p">FM3:上導線、第三上導線</p>
        <p type="p">FM5:上導線、第五上導線</p>
        <p type="p">FM7:上導線、第七上導線</p>
        <p type="p">FM13:上導線、第十三上導線</p>
        <p type="p">FM15:上導線、第十五上導線</p>
        <p type="p">FS:上導線區</p>
        <p type="p">GE:閘極結構</p>
        <p type="p">GI_S:子閘極結構、子閘極絕緣層</p>
        <p type="p">GI_M:主閘極結構、主閘極絕緣層</p>
        <p type="p">GS:閘極間隔件</p>
        <p type="p">MG_M:主閘極結構、閘極電極、主閘極電極</p>
        <p type="p">MG_S:子閘極結構、子閘極電極、閘極電極</p>
        <p type="p">R1:第一區</p>
        <p type="p">R2:第二區</p>
        <p type="p">SD:源極/汲極圖案</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.bmp" file="ed10024.bmp" height="726px" img-content="tif" inline="yes" orientation="portrait" width="1013px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202623449</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119571</doc-number>
          <kind></kind>
          <date>114/05/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/83</main-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
        <further-classification edition="202501120260302B">H10D30/60</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹芸碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, YUN-SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, PO-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宥均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李振銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳以雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, I-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王美勻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MEI-YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,032</doc-number>
          <date>20241126</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/169,267</doc-number>
          <date>20250403</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURES AND METHODS FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供製造半導體結構的方法，包括：提供結構，包括基板和從基板突出的鰭狀結構；在基板上並相鄰鰭狀結構的側壁形成隔離結構；在隔離結構上形成保護層；在鰭狀結構的源極/汲極區上成長源極/汲極部件；在源極/汲極部件上沉積接觸蝕刻停止層（CESL）；在CESL上沉積第一層間介電（ILD）層、蓋層和第二ILD層；在第一ILD層中形成源極/汲極接觸插塞以電性耦合源極/汲極部件；在源極/汲極部件和源極/汲極接觸插塞之間形成金屬矽化物層；從結構底部薄化基板；形成開口，暴露源極/汲極接觸插塞的底表面和保護層的底表面；以及在開口中沉積背側導電部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes providing a structure including a substrate and a fin-shaped structure protruding from the substrate, forming an isolation structure and a protecting layer thereon over the substrate and adjacent to a sidewall of the fin-shaped structure, growing a source/drain feature on a source/drain region of the fin-shaped structure, depositing a contact etch stop layer （CESL） over the source/drain feature, depositing a first interlayer dielectric （ILD） layer, a capping layer, and a second ILD layer over the CESL, forming a source/drain contact plug in the first ILD layer to electrically couple to the source/drain feature, forming a metal silicide layer between the source/drain feature and the source/drain contact plug, thinning down the substrate from a bottom of the structure, forming an opening exposing a bottom surface of the source/drain contact plug and a bottom surface of the protecting layer, and depositing a backside conductive feature in the opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:結構/裝置</p>
        <p type="p">214:隔離結構/隔離部件</p>
        <p type="p">215:保護層</p>
        <p type="p">260:閘極結構</p>
        <p type="p">270:閘極隔離結構/切割金屬閘極部件</p>
        <p type="p">284:通孔</p>
        <p type="p">286:背側蝕刻停止層/ESL</p>
        <p type="p">288:背側ILD層</p>
        <p type="p">292:FTV</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10085.png" file="d10085.TIF" giffile="ed10085.png" height="737px" img-content="tif" inline="yes" orientation="portrait" width="869px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621819</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119629</doc-number>
          <kind></kind>
          <date>114/05/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B22F3/14</main-classification>
        <further-classification edition="200601120260224B">B28B3/02</further-classification>
        <further-classification edition="200601120260224B">B32B18/00</further-classification>
        <further-classification edition="200601120260224B">C04B35/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, LUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐納隆　馬修喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONELON, MATTHEW JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/656,154</doc-number>
          <date>20240605</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於生產藉由所採用之粉末在混合步驟之前及之後的粒徑分布來界定的燒結積層體的程序</chinese-title>
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY DEFINED BY PARTICLE SIZE DISTRIBUTION OF A POWDER EMPLOYED PRIOR TO AND SUBSEQUENT TO A MIXING STEP</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.    將第一成分粉末及另一成分粉末在體積區段中混合以獲得第一粉末；&lt;br/&gt;b.    將該第一粉末引入內部體積以獲得該內部體積中的第一粉末層，其中該內部體積&lt;br/&gt;i.     具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.    至少部分地藉由模具之內表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;c.    使該第一粉末層經受熱量及壓力以獲得該積層體，其中&lt;br/&gt;i.     該熱量藉由施加在該模具、該內部體積、或兩者上的電壓產生，且&lt;br/&gt;ii.    該積層體包含第一層；&lt;br/&gt;其中&lt;br/&gt;比率D2/D1係至少0.30，其中&lt;br/&gt;D1係在混合該第一成分粉末及該另一成分粉末之前，該另一成分粉末之粒徑分布(PSD)的第一d&lt;sub&gt;50&lt;/sub&gt;值，且&lt;br/&gt;D2係在該第一成分粉末及該另一成分粉末之該混合之後，該另一成分粉末之該PSD的另一d&lt;sub&gt;50&lt;/sub&gt;值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. mixing a first constituent powder and a further constituent powder in a volume section to obtain a first powder;&lt;br/&gt;b. introducing the first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;c. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer;&lt;br/&gt;wherein&lt;br/&gt;a ratio D2/D1 is at least 0.30, where&lt;br/&gt;D1 is a first d&lt;sub&gt;50&lt;/sub&gt;value of a particle size distribution (PSD) of the further constituent powder prior to mixing the first constituent powder and the further constituent powder, and&lt;br/&gt;D2 is a further d&lt;sub&gt;50&lt;/sub&gt;value of the PSD of the further constituent powder following the mixing of the first constituent powder and the further constituent powder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">001:第一個推動構件</p>
        <p type="p">002:第一活塞</p>
        <p type="p">003:第一衝頭</p>
        <p type="p">004:第一衝頭內表面</p>
        <p type="p">005:模具之內表面</p>
        <p type="p">006:模具</p>
        <p type="p">007:第二衝頭內表面</p>
        <p type="p">008:第二衝頭</p>
        <p type="p">009:第二活塞</p>
        <p type="p">010:第二推動構件</p>
        <p type="p">011:壓縮軸</p>
        <p type="p">012:電源</p>
        <p type="p">013:內部體積</p>
        <p type="p">014:第一粉末層</p>
        <p type="p">100:根據本發明之裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="683px" img-content="tif" inline="yes" orientation="portrait" width="743px">
          </img>
        </representative>
      </representative-img>
    </description>
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  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621882</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119634</doc-number>
          <kind></kind>
          <date>114/05/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B28B1/00</main-classification>
        <further-classification edition="200601120260224B">B32B18/00</further-classification>
        <further-classification edition="200601120260224B">C04B33/00</further-classification>
        <further-classification edition="200601120260224B">C04B35/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, LUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐納隆　馬修喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONELON, MATTHEW JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/656,159</doc-number>
          <date>20240605</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於採用至少一個預燒結壓縮步驟來生產燒結積層體的程序</chinese-title>
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY EMPLOYING AT LEAST ONE PRE-SINTERING COMPRESSION STEP</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.     將第一粉末引入內部容積以獲得該內部容積中的第一粉末層，其中該內部容積&lt;br/&gt;i.      具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.     至少部分地藉由模具之內部表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.     使該第一粉末層經受第一壓縮，該第一壓縮之特徵在於下列中之任一者&lt;br/&gt;I./     最大力F&lt;sub&gt;1&lt;/sub&gt;係在50 kN至600 kN的範圍內，&lt;br/&gt;II./   最大壓力P&lt;sub&gt;1&lt;/sub&gt;係在0.1 MPa至10 MPa的範圍內；&lt;br/&gt;III./  標準I./及II./兩者；&lt;br/&gt;c.     將另一粉末引入該內部容積以獲得另一粉末層，從而進一步導致獲得包含該第一粉末層及該另一粉末層的層配置；&lt;br/&gt;d.     使該層配置經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.      該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，且&lt;br/&gt;ii.     該積層體包含第一層及另一層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;b. subjecting the first powder layer to a first compression characterized by at either&lt;br/&gt;I./ a maximum force F&lt;sub&gt;1&lt;/sub&gt;in the range from 50 to 600 kN,&lt;br/&gt;II./ a maximum pressure P&lt;sub&gt;1&lt;/sub&gt;in the range from 0.1 to 10 MPa;&lt;br/&gt;III./ both criteria I./ and II./;&lt;br/&gt;c. introducing a further powder into the interior volume to obtain a further powder layer, thereby further leading to a layer arrangement comprising the first powder layer and the further powder layer being obtained;&lt;br/&gt;d. subjecting the layer arrangement to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer and a further layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">001:第一推動構件</p>
        <p type="p">002:第一活塞</p>
        <p type="p">003:第一衝頭</p>
        <p type="p">004:第一衝頭內部表面</p>
        <p type="p">005:模具之內部表面</p>
        <p type="p">006:模具</p>
        <p type="p">007:第二衝頭內部表面</p>
        <p type="p">008:第二衝頭</p>
        <p type="p">009:第二活塞</p>
        <p type="p">010:第二推動構件</p>
        <p type="p">011:壓縮軸</p>
        <p type="p">012:電源</p>
        <p type="p">013:內部容積</p>
        <p type="p">014:層配置</p>
        <p type="p">100:裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="585px" img-content="tif" inline="yes" orientation="portrait" width="632px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621820</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119635</doc-number>
          <kind></kind>
          <date>114/05/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B22F3/14</main-classification>
        <further-classification edition="200601120260224B">C04B33/00</further-classification>
        <further-classification edition="200601120260224B">B32B18/00</further-classification>
        <further-classification edition="200601120260224B">B28B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, LUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐納隆　馬修喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONELON, MATTHEW JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/656,166</doc-number>
          <date>20240605</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>在燒結階段期間採用臨限溫度的用於生產燒結積層體之程序</chinese-title>
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY EMPLOYING A THRESHOLD TEMPERATURE DURING A SINTERING PHASE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於生產一積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.    將第一粉末引入內部容積以獲得該內部容積中的第一粉末層，其中該內部容積&lt;br/&gt;i.     具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.    至少部分地藉由模具之內部表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.    使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.     該熱藉由跨該模具、該內部容積、或兩者施加的電壓產生，且&lt;br/&gt;ii.    該積層體包含第一層；&lt;br/&gt;其中使該第一粉末層經受該熱及壓力之該步驟（步驟b.）包含下列子步驟：&lt;br/&gt;I.     第一子步驟S&lt;sub&gt;RAMP&lt;/sub&gt;，其中該內部容積中的溫度T從T = T&lt;sub&gt;S&lt;/sub&gt;增加至T = T&lt;sub&gt;H&lt;/sub&gt;，其中T&lt;sub&gt;H&lt;/sub&gt;大於T&lt;sub&gt;S&lt;/sub&gt;，且在此期間，第一子步驟的該溫度T不超過T&lt;sub&gt;H&lt;/sub&gt;，&lt;br/&gt;II.   在該第一子步驟S&lt;sub&gt;RAMP&lt;/sub&gt;之後的另一子步驟S&lt;sub&gt;SINT&lt;/sub&gt;，在此期間，該內部容積中的該溫度T不下降至低於T&lt;sub&gt;H&lt;/sub&gt;；&lt;br/&gt;其中T&lt;sub&gt;H&lt;/sub&gt;係在950℃至1350℃的範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer;&lt;br/&gt;wherein the step of subjecting the first powder layer to the heat and pressure (step b.) comprises the following sub-steps:&lt;br/&gt;I. a first sub-step S&lt;sub&gt;RAMP&lt;/sub&gt;wherein a temperature T in the interior volume is increased from T = T&lt;sub&gt;S&lt;/sub&gt;to T = T&lt;sub&gt;H&lt;/sub&gt;, with T&lt;sub&gt;H&lt;/sub&gt;greater than T&lt;sub&gt;S&lt;/sub&gt;, and during which first sub-step the temperature T does not exceed T&lt;sub&gt;H&lt;/sub&gt;,&lt;br/&gt;II. a further sub-step S&lt;sub&gt;SINT&lt;/sub&gt;following the first sub-step S&lt;sub&gt;RAMP&lt;/sub&gt;, during which the temperature T in the interior volume does not drop below T&lt;sub&gt;H&lt;/sub&gt;;&lt;br/&gt;wherein T&lt;sub&gt;H&lt;/sub&gt;is in the range from 950 to 1350 °C.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:曲線</p>
        <p type="p">601:第一子步驟S&lt;sub&gt;RAMP&lt;/sub&gt;；子步驟</p>
        <p type="p">602:另一子步驟S&lt;sub&gt;SINT&lt;/sub&gt;；子步驟</p>
        <p type="p">603:冷卻步驟</p>
        <p type="p">604:第一階段；第一子步驟S&lt;sub&gt;RAMP&lt;/sub&gt;之第一階段</p>
        <p type="p">605:另一階段；第一子步驟S&lt;sub&gt;RAMP&lt;/sub&gt;之另一階段</p>
        <p type="p">606:第一階段；另一子步驟S&lt;sub&gt;SINT&lt;/sub&gt;之第一階段</p>
        <p type="p">607:另一階段；另一子步驟S&lt;sub&gt;SINT&lt;/sub&gt;之另一階段</p>
        <p type="p">T,T&lt;sub&gt;A&lt;/sub&gt;,T&lt;sub&gt;E&lt;/sub&gt;,T&lt;sub&gt;H&lt;/sub&gt;,T&lt;sub&gt;S&lt;/sub&gt;:溫度</p>
        <p type="p">t:時間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="506px" img-content="tif" inline="yes" orientation="portrait" width="748px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621980</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119668</doc-number>
          <kind></kind>
          <date>114/05/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120260223B">B82Y20/00</main-classification>
        <further-classification edition="201101120260223B">B82Y30/00</further-classification>
        <further-classification edition="200601120260223B">C09K19/04</further-classification>
        <further-classification edition="200601120260223B">C09K19/40</further-classification>
        <further-classification edition="200601120260223B">G02F1/136</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿里爾　迪帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARYAL, DIPAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
              <english-address>NP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿貝爾　凱特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABEL, KATE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅頓達洛　安東尼奧　路易斯　帕切科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROTONDARO, ANTONIO LUIS PACHECO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野雄大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, TAKEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森本保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMOTO, TAMOTSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/677,975</doc-number>
          <date>20240530</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>控制自組裝離子型液晶(ILC)結構之晶相的方法</chinese-title>
        <english-title>METHODS FOR CONTROLLING THE PHASE OF SELF-ASSEMBLED IONIC LIQUID CRYSTAL (ILC) STRUCTURES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供改進方法的實施例，其利用離子型液晶(ILC)之定向自組裝(DSA)在基板表面上形成規則結構。更具體地，提供諸多方法實施例，以控制透過ILC自組裝形成於基板表面上之規則結構的晶相，ILC具有陽離子頭基、具有複數烴之烷基尾基以及陰離子。在本文所揭示之實施例中，規則結構之晶相係透過用較大尺寸官能基團取代烷基鏈中所包含之烴的氫(H)原子來控制。對烷基鏈添加較大尺寸官能基團係透過以下方式改變規則結構之晶相 : (a) 增加ILC親水(陽離子)及疏水(烷基尾基)基團之間的間距；以及(b)改變自組裝ILC尾基內烷基尾部的取向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of improved methods are provided to form ordered structures on a surface of a substrate using direct self-assembly (DSA) of ionic liquid crystals (ILCs). More specifically, various embodiments of methods are provided to control the phase of an ordered structure formed on a substrate surface via self-assembly of ILCs having cation head groups, alkyl tail groups having a plurality of hydrocarbons and anions. In the embodiments disclosed herein, the phase of the ordered structure is controlled by replacing the hydrogen (H) atoms of the hydrocarbons included the alkyl chain with larger sized functional groups. Adding larger sized functional groups to the alkyl chain changes the phase of the ordered structure by: (a) increasing the separation between the hydrophilic (cation) and hydrophobic (alkyl tail) groups of the ILCs, and (b) changing the orientation of alkyl tails within the tail groups of the self-assembled ILCs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">210:步驟</p>
        <p type="p">220:步驟</p>
        <p type="p">230:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="803px" img-content="tif" inline="yes" orientation="portrait" width="572px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623617</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119675</doc-number>
          <kind></kind>
          <date>114/05/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P95/00</main-classification>
        <further-classification edition="201901120260302B">G06F16/906</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人北海道大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林累輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, RUIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村隆央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷山美紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEYAMA, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川貴弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斉藤直輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤後廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOGO, REN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田圭介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-087317</doc-number>
          <date>20240529</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電腦程式、學習模型之生成方法、資訊處理方法及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可期待實現有關基板處理之時間序列資料之檢索之電腦程式、學習模型之生成方法、資訊處理方法及資訊處理裝置。&lt;br/&gt;  本發明之電腦程式係使電腦執行生成學習模型之處理者，該學習模型受理有關基板處理之時間序列資料作為輸入，並輸出時間序列資料之特徵量，該電腦程式係使電腦執行如下處理：獲取學習用資料，該學習用資料係將有關基板處理之時間序列資料與基於時間序列資料之特徵量進行之處理相關之複數個真實值建立了對應關係；將所獲取之學習用資料之時間序列資料輸入至學習模型，獲取學習模型輸出之特徵量；基於所獲取之特徵量、學習用資料之真實值及複數個損失函數，算出複數個誤差；基於所算出之複數個誤差，算出綜合誤差；基於所算出之綜合誤差，更新學習模型之參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資訊處理裝置(電腦)</p>
        <p type="p">3:基板處理裝置</p>
        <p type="p">5:終端裝置</p>
        <p type="p">7:基板處理DB</p>
        <p type="p">9:學習模型</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="831px" img-content="tif" inline="yes" orientation="portrait" width="770px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622324</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119717</doc-number>
          <kind></kind>
          <date>114/05/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251001B">D06M13/165</main-classification>
        <further-classification edition="200601120251001B">D06M13/256</further-classification>
        <further-classification edition="200601120251001B">D06M13/262</further-classification>
        <further-classification edition="200601120251001B">D06M15/53</further-classification>
        <further-classification edition="200601120251001B">D06M15/643</further-classification>
        <further-classification edition="202201120251001B">C09K23/02</further-classification>
        <further-classification edition="202201120251001B">C09K23/42</further-classification>
        <further-classification edition="200601320251001B">D06M101/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臺灣塑膠工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORMOSA PLASTICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡坤曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, KUN-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪家祺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHIA-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周玟汝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, WEN-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHI-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃龍田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, LONG-TYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHIEN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃英治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恭德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, GONG-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童世煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, SHIH-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭如忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JENG, RU-JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113144626</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>碳纖維處理劑組成物、碳纖維處理劑、其製造方法及碳纖維前驅物</chinese-title>
        <english-title>TREATMENT AGENT COMPOSITION FOR CARBON FIBER, TREATMENT AGENT FOR CARBON FIBER, METHOD OF FORMING THE SAME AND CARBON FIBER PRECURSOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種碳纖維處理劑組成物、碳纖維處理劑、其製造方法及碳纖維前驅物。碳纖維處理劑組成物包含具有至少一改質官能基的改質聚有機矽氧烷、分散劑及水。基於改質聚有機矽氧烷為100 wt%，分散劑為10 wt%至50 wt%。分散劑具有式(I)所示的結構。藉由具有特定結構的分散劑，使改質聚有機矽氧烷分散於水中，可使碳纖維處理劑具有較佳的乳化安定性及熱穩定性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A treatment agent composition for carbon fiber, a treatment agent for carbon fiber, a method of forming the same and a carbon fiber precursor are provided. The treatment agent composition for carbon fiber includes modified polysiloxane having at least one modified functional group, a dispersing agent and water. Based on the modified polysiloxane as 100 wt%, the dispersing agent is 10 wt% to 50 wt%. The dispersing agent has a structure shown as formula (I). The modified polysiloxane is dispersing in water by the dispersing agent with a specific structure, thereby making the treatment agent for carbon fiber have better emulsification stability and thermal stability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622195</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119827</doc-number>
          <kind></kind>
          <date>114/05/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09G1/02</main-classification>
        <further-classification edition="200601120260302B">C09K3/14</further-classification>
        <further-classification edition="202601120260302B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井手健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDE, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂部晃一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKABE, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>政所重智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDOKORO, SHIGETOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-125821</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>研磨用組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種新穎的研磨用組合物，其可以解決下述的取捨問題：在除去多晶矽等的具有矽－矽鍵的膜的自然氧化膜的同時，能夠提高相對於具有氧－矽鍵的膜等的絕緣膜的研磨速度的多晶矽等的具有矽－矽鍵的膜的研磨速度之比，從而實現更確實的絕緣膜停止功能，並且抑制絕緣膜損失。  &lt;br/&gt;[解決手段]一種研磨用組合物，包含：矽醇基數為6個/nm&lt;sup&gt;2&lt;/sup&gt;以上、22個/nm&lt;sup&gt;2&lt;/sup&gt;以下的膠態氧化矽、鹼金屬鹽、具有醯胺鍵的高分子化合物、鹼性胺基酸及水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623040</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119852</doc-number>
          <kind></kind>
          <date>114/05/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H01J37/32</main-classification>
        <further-classification edition="200601120260223B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅德與舒瓦茲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROHDE &amp; SCHWARZ GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗呂豪夫　阿德里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRUEHAUF, ADRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧尼穆斯　弗洛里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHNIMUS, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮茨卡　馬蒂亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIETZKA, MATHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24194634.2</doc-number>
          <date>20240814</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿產生系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR PLASMA GENERATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於電漿產生的系統（10）。該系統（10）包括射頻RF產生器模組（12）、匹配網路（14）和至少一個電漿腔室（16）。匹配網路（14）被連接到RF產生器模組（12）的輸出介面（20），使得匹配網路（14）被佈置在RF產生器模組（12）和電漿腔室（16）之間。RF產生器模組（12）被配置為經由輸出介面（20）輸出RF訊號。RF產生器模組（12）具有至少一個具有放大器輸出阻抗（Z&lt;sub&gt;A&lt;/sub&gt;）的放大器（18）。RF產生器模組（12）具有產生器輸出阻抗（Z&lt;sub&gt;G&lt;/sub&gt;）。該系統（10）包括控制模組（28），該控制模組被配置為根據經由該輸出介面（20）輸出的RF功率來控制該匹配網路（14），從而調整該至少一個放大器（18）的放大器輸出阻抗（Z&lt;sub&gt;A&lt;/sub&gt;）和該RF產生器模組（12）的產生器輸出阻抗（Z&lt;sub&gt;G&lt;/sub&gt;），從而對該至少一個放大器（18）和該RF產生器模組（12）執行負載調制。此外，描述了一種用於電漿產生的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a system (10) for plasma generation. The system (10) comprises a radio frequency, RF, generator module (12), a matching network (14) and at least one plasma chamber (16). The matching network (14) is connected to an output interface (20) of the RF generator module (12) such that the matching network (14) is arranged between the RF generator module (12) and the plasma chamber (16). The RF generator module (12) is configured to output via the output interface (20) an RF signal. The RF generator module (12) has at least one amplifier (18) with an amplifier output impedance (Z&lt;sub&gt;A&lt;/sub&gt;). The RF generator module (12) has a generator output impedance (Z&lt;sub&gt;G&lt;/sub&gt;). The system (10) comprises a control module (28) that is configured to control the matching network (14) in dependence of an RF power to be outputted via the output interface (20), thereby adapting the amplifier output impedance (Z&lt;sub&gt;A&lt;/sub&gt;) of the at least one amplifier (18) and the generator output impedance (Z&lt;sub&gt;G&lt;/sub&gt;) of the RF generator module (12) in order to perform a load modulation of the at least one amplifier (18) and the RF generator module (12). Further, a method for plasma generation is described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:系統</p>
        <p type="p">12:射頻RF產生器模組</p>
        <p type="p">14:匹配網路</p>
        <p type="p">16:電漿腔室</p>
        <p type="p">18:放大器</p>
        <p type="p">28:控制模組</p>
        <p type="p">30:測量模組</p>
        <p type="p">32:組合器</p>
        <p type="p">34:處理電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="708px" img-content="tif" inline="yes" orientation="portrait" width="686px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622190</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119867</doc-number>
          <kind></kind>
          <date>114/05/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260223B">C09D7/42</main-classification>
        <further-classification edition="201801120260223B">C09D7/61</further-classification>
        <further-classification edition="200601120260223B">C09D5/00</further-classification>
        <further-classification edition="200601120260223B">C09D133/08</further-classification>
        <further-classification edition="200601120260223B">C09D133/14</further-classification>
        <further-classification edition="200601120260223B">B05D1/02</further-classification>
        <further-classification edition="200601120260223B">B05D5/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商關西塗料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANSAI PAINT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>管本圭司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAMOTO, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中岡晴河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAOKA, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永井彰典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAI, AKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-095678</doc-number>
          <date>20240613</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>塗料組成物及塗膜形成方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種噴出穩定性優異且所形成之塗膜之消光性及光澤均勻性優異之塗料組成物。&lt;br/&gt;  本揭示係一種塗料組成物，其係包含覆膜形成樹脂(A)及消光劑(B)之噴墨方式用塗料組成物，前述消光劑(B)之體積平均粒徑d50在1～25μm之範圍內，前述塗料組成物於溫度23℃及剪切速度0.1sec-1下之黏度在20～30000mPa・s之範圍內。本揭示係關於一種塗料組成物，其中以塗料組成物中之合計樹脂固形物成分100質量份為基準計，前述消光劑(B)之含量在0.8～20質量份之範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623629</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119871</doc-number>
          <kind></kind>
          <date>114/05/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/20</main-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金知秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JISOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金珍圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔虎浚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵賢俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, HYUNJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁圭泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, KYUTAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓東煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, DONG-HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許汀銀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HER, JEONGEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0164433</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露半導體裝置及半導體封裝。一種半導體裝置之一些示例性實施例包含：一第一基體，其具有面向彼此之一第一表面及一第二表面；一邏輯區塊，其在該第一表面上；一電力輸送網路，其在該第二表面上，其包括連接於該邏輯區塊之多個背側線；一第二基體，其在該邏輯區塊上與該第一基體之該第一表面相對；一第一貫通結構，其穿透該第一基體；以及一第二貫通結構，其穿透該第二基體且電氣連接於該第一貫通結構。該第一貫通結構包含：一貫通傳導圖案，其與該邏輯區塊水平地間隔開且穿透該第一基體；多個上部傳導圖案，其堆疊於該貫通傳導圖案之一頂表面上；以及多個下部傳導圖案，其堆疊於該貫通傳導圖案之一底表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are semiconductor devices and semiconductor packages. Some example embodiments of a semiconductor device comprises a first substrate having a first surface and a second surface facing each other, a logic block on the first surface, a power delivery network on the second surface including a plurality of backside lines connected to the logic block, a second substrate on the logic block opposite to the first surface of the first substrate, a first through structure penetrating the first substrate, and a second through structure penetrating the second substrate and electrically connected to the first through structure. The first through structure comprises a through conductive pattern horizontally spaced apart from the logic block and penetrating the first substrate, a plurality of upper conductive patterns stacked on a top surface of the through conductive pattern, and a plurality of lower conductive patterns stacked on a bottom surface of the through conductive pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:第一基體</p>
        <p type="p">105a:第一表面</p>
        <p type="p">105b:第二表面</p>
        <p type="p">200:第二基體</p>
        <p type="p">210:第二貫通結構</p>
        <p type="p">1101:下部晶片襯墊</p>
        <p type="p">1150:第二連接端子</p>
        <p type="p">1250:第三連接端子</p>
        <p type="p">A-A':線</p>
        <p type="p">AC:主動接點</p>
        <p type="p">BC:背側接點</p>
        <p type="p">BILD:背側層間介電層</p>
        <p type="p">BM1:背側線</p>
        <p type="p">BM2:下部傳導圖案</p>
        <p type="p">BP:貫通傳導圖案</p>
        <p type="p">BV1:元件</p>
        <p type="p">BV2:下部導孔</p>
        <p type="p">FILD:前部層間介電層</p>
        <p type="p">FM1:上部線</p>
        <p type="p">FM2:上部傳導圖案</p>
        <p type="p">FV1:上部通孔</p>
        <p type="p">FV2:上部導孔</p>
        <p type="p">GE:閘極電極</p>
        <p type="p">HPT:元件</p>
        <p type="p">ICS:連接結構</p>
        <p type="p">IP:邏輯區塊</p>
        <p type="p">PDN:電力輸送網路</p>
        <p type="p">SD:源極/汲極圖案</p>
        <p type="p">STI:裝置隔離層</p>
        <p type="p">TS:第一貫通結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="777px" img-content="tif" inline="yes" orientation="portrait" width="1110px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623630</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114119872</doc-number>
          <kind></kind>
          <date>114/05/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/20</main-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202501120260302B">H10D62/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申洪湜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, HONGSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐英植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YOUNGSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳盛淏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, SEONGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹世潾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SERIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李知惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JI-HYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李炫哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUNCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0164567</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案揭露一種半導體裝置。該半導體裝置可包括：一第一層間絕緣層，其在一半導體基體上；第一傳導圖案，其穿透該第一層間絕緣層；一第二層間絕緣層，其在該第一層間絕緣層上；第二傳導圖案，其設置於該第二層間絕緣層中且耦接至該等第一傳導圖案；以及分離絕緣圖案，其設置於該第二層間絕緣層中處於該等第二傳導圖案之間。該第二層間絕緣層之一部分可在該等分離絕緣圖案之側表面與該等第二傳導圖案之側表面之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is disclosed. The semiconductor device may include a first interlayer insulating layer on a semiconductor substrate, first conductive patterns penetrating the first interlayer insulating layer, a second interlayer insulating layer on the first interlayer insulating layer, second conductive patterns provided in the second interlayer insulating layer and coupled to the first conductive patterns, and separation insulating patterns provided in the second interlayer insulating layer between the second conductive patterns. A portion of the second interlayer insulating layer may be between side surfaces of the separation insulating patterns and side surfaces of the second conductive patterns.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體基體</p>
        <p type="p">112:第一閘極絕緣圖案</p>
        <p type="p">114:第二閘極絕緣圖案</p>
        <p type="p">122:周邊多晶矽圖案</p>
        <p type="p">124:周邊矽化物圖案</p>
        <p type="p">126:周邊金屬圖案</p>
        <p type="p">143:第一蝕刻終止層</p>
        <p type="p">150:絕緣襯套層</p>
        <p type="p">160:第一層間絕緣層</p>
        <p type="p">183:第一絕緣圖案</p>
        <p type="p">190:第二蝕刻終止層</p>
        <p type="p">200:第二層間絕緣層</p>
        <p type="p">215:分離絕緣圖案</p>
        <p type="p">217:分離絕緣間隔體</p>
        <p type="p">231:間隙填充絕緣圖案</p>
        <p type="p">240:罩蓋絕緣層</p>
        <p type="p">251:第三層間絕緣層</p>
        <p type="p">253:第一上部絕緣層</p>
        <p type="p">260:第二上部絕緣層</p>
        <p type="p">ACT1:周邊主動區</p>
        <p type="p">AK:對準標記圖案</p>
        <p type="p">B-B':線</p>
        <p type="p">C-C':線</p>
        <p type="p">CP1:第一傳導圖案</p>
        <p type="p">CP2:第二傳導圖案</p>
        <p type="p">CP3:第三傳導圖案</p>
        <p type="p">PG:元件</p>
        <p type="p">P1:部分</p>
        <p type="p">PCR:第二區</p>
        <p type="p">PHM:周邊硬遮罩圖案</p>
        <p type="p">PM:周邊金屬線</p>
        <p type="p">SD:周邊源極/汲極區</p>
        <p type="p">SL:第三區</p>
        <p type="p">SS:周邊閘極間隔體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="755px" img-content="tif" inline="yes" orientation="portrait" width="857px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622637</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120007</doc-number>
          <kind></kind>
          <date>114/05/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G03F7/20</main-classification>
        <further-classification edition="200601120260224B">G03F7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野瀬　亞力山卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONOSE, ALEXANDRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RO</english-country>
              <english-address>RO</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博塔里　蒂亞戈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOTARI, TIAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
              <english-address>BR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴斯特　提莫　馬蒂亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEIST, TIMO MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑟方丹　帕斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERFONTAINE, PASCAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅德維德亞娃　瑪利亞　維亞齊莎拉維維娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDVEDYEVA, MARIYA VYACHESLAVIVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
              <english-address>UA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周子理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, ZILI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　可拉吉　馬可斯　傑拉度　馬堤司　瑪麗亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN KRAAIJ, MARKUS GERARDUS MARTINUS MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24178687.0</doc-number>
          <date>20240529</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用神經網路預測度量衡資料之方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR PREDICTING METROLOGY DATA USING A NEURAL NETWORK</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明呈現一種用於使用一神經網路產生一經圖案化部分之經預測度量衡資料之方法。該神經網路包含一輸入網路及一輸出網路。該輸入網路包含一公用輸入模型及一特定輸入模型，其中該公用輸入模型已藉由一程序進行訓練，在該程序中，該公用輸入模型基於由複數個度量衡系統產生之訓練度量衡資料而處理資料，且該特定輸入模型特定針對於一第一度量衡系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method is presented for generating, using a neural network, predicted metrology data of a patterned portion. The neural network comprises an input network and an output network. The input network comprises a common input model and a specific input model, wherein the common input model has been trained by a process in which the common input model processes data based on training metrology data generated by a plurality of metrology systems, and the specific input model is specific to a first metrology system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:神經網路</p>
        <p type="p">401:度量衡資料</p>
        <p type="p">402:組態資料</p>
        <p type="p">403:組態資料</p>
        <p type="p">404:經預測度量衡資料</p>
        <p type="p">405:公用輸入模型</p>
        <p type="p">406:工具重映射區段</p>
        <p type="p">407:工具特定輸入模型</p>
        <p type="p">408:工具特定輸出模型</p>
        <p type="p">409:公用輸出模型</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10068.JPG" file="ed10068.JPG" height="287px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623473</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120026</doc-number>
          <kind></kind>
          <date>114/05/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260225B">H10H20/816</main-classification>
        <further-classification edition="202501120260225B">H10H20/824</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井健滋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岸祐太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGISHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-095814</doc-number>
          <date>20240613</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化合物半導體基板及化合物半導體基板的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種化合物半導體基板，其在n型GaP基板上具有四元發光層，該四元發光層是至少依序積層由(Al&lt;sub&gt;x&lt;/sub&gt;Ga&lt;sub&gt;1-x&lt;/sub&gt;)&lt;sub&gt;y&lt;/sub&gt;In&lt;sub&gt;1-y&lt;/sub&gt;P(其中，0≦x≦1，0≦y≦1)所構成之n型包覆層、活性層、p型包覆層而成，在前述四元發光層的與前述n型GaP基板側的第一主表面為相反側的第二主表面上，積層有作為窗層之p型GaP層，該化合物半導體基板的特徵在於：前述活性層中的p型雜質濃度為9×10&lt;sup&gt;15&lt;/sup&gt;(Atoms/cm&lt;sup&gt;3&lt;/sup&gt;)以下，並且，n型雜質濃度為7×10&lt;sup&gt;15&lt;/sup&gt;(Atoms/cm&lt;sup&gt;3&lt;/sup&gt;)以下。藉此，可提供一種化合物半導體基板及化合物半導體基板的製造方法，其具有AlGaInP的四元發光層，若應用於發光元件能夠使通電時的輝度壽命特性變得良好。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:n型GaP基板</p>
        <p type="p">12:n型包覆層</p>
        <p type="p">13:活性層</p>
        <p type="p">14:p型包覆層</p>
        <p type="p">15:四元發光層</p>
        <p type="p">16:第一主表面</p>
        <p type="p">17:第二主表面</p>
        <p type="p">18:p型GaP層</p>
        <p type="p">19:化合物半導體基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="419px" img-content="tif" inline="yes" orientation="portrait" width="423px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622961</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120056</doc-number>
          <kind></kind>
          <date>114/05/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C7/10</main-classification>
        <further-classification edition="200601120260302B">G11C7/22</further-classification>
        <further-classification edition="200601120260302B">G11C8/10</further-classification>
        <further-classification edition="200601120260302B">G11C11/40</further-classification>
        <further-classification edition="200601120260302B">G11C29/42</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋淸基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, CHOUNG KI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175953</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於透過共用多個通道來輸入和輸出資料的記憶體裝置</chinese-title>
        <english-title>MEMORY DEVICE FOR INPUTTING AND OUTPUTTING DATA BY SHARING A PLURALITY OF CHANNELS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括：包含N個第一通道的第一核心晶粒和包括N個第二通道的第二核心晶粒。第一核心晶粒的第一通道和第二核心晶粒的第二通道透過接收共同的寫入命令和共同的讀取命令來輸入和輸出資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a first core die including N first channels and a second core die including N second channels. The first channel of the first core die and the second channel of the second core die input and output data by receiving a write command in common and a read command in common.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:記憶體裝置</p>
        <p type="p">100:基礎晶粒</p>
        <p type="p">101:記憶體控制器(MC)</p>
        <p type="p">103:資料輸入及輸出電路(DATA I/O)</p>
        <p type="p">111~118:核心晶粒</p>
        <p type="p">CH0~CH15:通道</p>
        <p type="p">RANK0:第一分類</p>
        <p type="p">RANK1:第二分類</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="717px" img-content="tif" inline="yes" orientation="portrait" width="727px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622306</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120105</doc-number>
          <kind></kind>
          <date>114/05/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C30B29/40</main-classification>
        <further-classification edition="202601120260302B">H10P14/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商索泰克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOITEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇瑟蘭　布魯諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHYSELEN, BRUNO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>法國</country>
          <doc-number>FR2406424</doc-number>
          <date>20240617</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於製造包含單晶ＩＩＩ–Ｖ族材料層堆疊之複合結構之方法</chinese-title>
        <english-title>PROCESS FOR MANUFACTURING A COMPOSITE STRUCTURE INCLUDING A STACK OF LAYERS MADE OF SINGLE-CRYSTAL III-V MATERIALS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於製造一複合結構之方法，包括以下步驟：a) 提供一複合基板，其包含一支撐基板及單晶III-V族材料之一種子層，該種子層透過一鍵合界面而設置在該支撐基板上，該支撐基板的熱膨脹係數不同於該種子層的熱膨脹係數，且該種子層具有一固有晶格參數；b) 在該種子層上磊晶生長多個III-V族單晶層，稱爲磊晶層，之一堆疊，每個磊晶層具有一固有晶格參數。當該支撐基板的熱膨脹係數低於該種子層的熱膨脹係數時，該堆疊的至少一個磊晶層的組成被選定，以使其固有晶格參數相較於該種子層的固有晶格參數減少200 ppm至3000 ppm。當該支撐基板的熱膨脹係數高於該種子層的熱膨脹係數時，該堆疊的至少一個磊晶層的組成被選定，以使其固有晶格參數相較於該種子層的固有晶格參數增加200 ppm至3000 ppm。本發明亦涉及一種複合結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a process for manufacturing a composite structure, comprising the following steps: a) providing a composite substrate including a support substrate and a seed layer made of single-crystal III-V material arranged on the support substrate via a bonding interface, the support substrate having a thermal expansion coefficient different from that of the seed layer, and the seed layer having an intrinsic lattice parameter; b) epitaxial growth of a stack of type III-V single-crystal layers, known as epitaxial layers, on the seed layer, each epitaxial layer having an intrinsic lattice parameter. When the thermal expansion coefficient of the support substrate is lower than that of the seed layer, at least one epitaxial layer of the stack has a composition chosen so that its intrinsic lattice parameter is reduced by 200 ppm to 3000 ppm relative to the intrinsic lattice parameter of the seed layer. When the thermal expansion coefficient of the support substrate is higher than that of the seed layer, at least one epitaxial layer of the stack has a composition chosen so that its intrinsic lattice parameter is increased by 200 ppm to 3000 ppm relative to the intrinsic lattice parameter of the seed layer. The invention also relates to a composite structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621906</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120107</doc-number>
          <kind></kind>
          <date>114/05/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B43K3/04</main-classification>
        <further-classification edition="200601120260224B">B43K29/00</further-classification>
        <further-classification edition="200601120260224B">B43K23/08</further-classification>
        <further-classification edition="200601120260224B">B43K24/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商青島點石文具用品有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QINGDAO BEST POINT STATIONERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王元鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024106812251</doc-number>
          <date>20240529</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>按動聲音可控的按壓式筆</chinese-title>
        <english-title>PRESS-TYPE PEN WITH CONTROLLABLE SOUND</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種按動聲音可控的按壓式筆，按動聲音可控的按壓式筆，包括：筆桿、筆芯、復位彈簧、按壓定位組件。按壓定位組件包括導向件、滑動件和定位件。導向件上設置有導向滑槽，導向滑槽中設置有轉動驅動部和定位配合部，滑動件沿導向滑槽的長度方向可滑動的安裝在導向件上，定位件可轉動的安裝在滑動件上，定位件上設置有定位部，定位部可滑動的設置在導向滑槽中。其中，滑動件上還設置有發聲件，筆桿上設置有用於與發聲件配合的發聲配合件；導向件可轉動地設置在筆桿中，滑動件用於推動筆芯在筆桿中移動。實現按動聲音可控以滿足不同用戶使用要求，進而提高用戶使用體驗性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses a press-type pen with controllable sound upon pressing. The press-type pen with controllable sound includes: a pen body, a pen refill, a reset spring, and a pressing positioning component. The pressing positioning component includes a guiding member, a sliding member, and a positioning member. The guiding member is equipped with a guiding slide groove, in which there is a rotating driving part and a positioning matching part. The sliding member is slidably mounted on the guiding member along the length direction of the guiding slide groove, and the positioning member is rotatably mounted on the sliding member. The positioning member is provided with a positioning part, which is slidably arranged in the guiding slide groove. Additionally, the sliding member is equipped with a sound-producing part, and the pen body contains a sound-matching part that cooperates with the sound-producing part. The guiding member is rotatably arranged within the pen body, and the sliding member serves to push the pen refill to move within the pen body. This design achieves controllable sound upon pressing, fulfilling the diverse usage requirements of different users and thereby enhancing the user experience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:筆桿</p>
        <p type="p">11:筆頭</p>
        <p type="p">13:筆夾</p>
        <p type="p">21:筆尖</p>
        <p type="p">35:轉動套</p>
        <p type="p">36:筆帽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="915px" img-content="tif" inline="yes" orientation="portrait" width="418px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621883</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120238</doc-number>
          <kind></kind>
          <date>114/05/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B28B1/00</main-classification>
        <further-classification edition="200601120260224B">B32B18/00</further-classification>
        <further-classification edition="200601120260224B">C04B33/00</further-classification>
        <further-classification edition="200601120260224B">C04B35/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賀利氏科萬特北美有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAEUS COVANTICS NORTH AMERICA LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, LUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐納隆　馬修喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONELON, MATTHEW JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/656,153</doc-number>
          <date>20240605</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於藉由控制所採用之粉末的氯含量來生產經燒結之積層體之程序</chinese-title>
        <english-title>PROCESS FOR PRODUCING A SINTERED LAYERED BODY BY CONTROLLING THE CHLORINE CONTENT OF A POWDER EMPLOYED</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於生產積層體之程序，其包含下列程序步驟：&lt;br/&gt;a.    將第一粉末引入內部容積以獲得該內部容積中的第一粉末層，其中該內部容積&lt;br/&gt;i.     具有至少200 mm的橫截面寬度W，且&lt;br/&gt;ii.    至少部分地藉由模具之內表面定界，其中該模具具有至少一個壁，且其中該壁包含碳；&lt;br/&gt;b.    使該第一粉末層經受熱及壓力以獲得該積層體，其中&lt;br/&gt;i.     該熱藉由施加在該模具、該內部容積、或兩者上的電壓產生，且&lt;br/&gt;ii.    該積層體包含第一層；&lt;br/&gt;其中&lt;br/&gt;該第一粉末具有50 ppm或更小的氯含量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A process for producing a layered body, comprising the following process steps:&lt;br/&gt;a. introducing a first powder into an interior volume to obtain a first powder layer in the interior volume, wherein the interior volume&lt;br/&gt;i. has a cross-sectional width W of at least 200 mm, and&lt;br/&gt;ii. is at least partially bordered by an interior surface of a die, wherein the die has at least one wall, and wherein said wall comprises carbon;&lt;br/&gt;b. subjecting the first powder layer to a heat and a pressure to obtain the layered body, wherein&lt;br/&gt;i. the heat is generated by an electrical voltage applied across the die, the interior volume, or both, and&lt;br/&gt;ii. the layered body comprises a first layer;&lt;br/&gt;wherein&lt;br/&gt;the first powder has a chlorine content of 50 ppm or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">001:第一推動構件</p>
        <p type="p">002:第一活塞</p>
        <p type="p">003:衝頭</p>
        <p type="p">004:衝頭內表面</p>
        <p type="p">005:內表面</p>
        <p type="p">006:模具</p>
        <p type="p">007:衝頭內表面</p>
        <p type="p">008:衝頭</p>
        <p type="p">009:第二活塞</p>
        <p type="p">010:第二推動構件</p>
        <p type="p">011:壓縮軸</p>
        <p type="p">012:電源</p>
        <p type="p">013:內部容積</p>
        <p type="p">014:第一粉末層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="717px" img-content="tif" inline="yes" orientation="portrait" width="644px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622336</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120310</doc-number>
          <kind></kind>
          <date>114/05/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">E03D11/02</main-classification>
        <further-classification edition="200601120251103B">E03D9/00</further-classification>
        <further-classification edition="200601120251103B">A61L2/12</further-classification>
        <further-classification edition="200601120251103B">A47K13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＴＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTO LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢岡寿成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAOKA, TOSHINARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雨森彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMEMORI, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松浦貴志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUURA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-208684</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用水裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種能夠有效率地除菌的用水裝置。  &lt;br/&gt;　　用以解決課題之手段為，一種用水裝置，係具備：照射光的照射裝置；及透過前述照射裝置照射的光進行除菌的除菌部，其中，從前述照射裝置照射的光，其峰值波長至少在光譜內的350nm以上450nm以下之間；且從前述照射裝置照射的光的一部分，會穿透前述除菌部的表面，並在前述除菌部的內部反射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:盆部(除菌部)</p>
        <p type="p">2a1:第1層(內部層)</p>
        <p type="p">2a2:第2層(內部層)</p>
        <p type="p">2a3:第3層(表層)</p>
        <p type="p">100:菌</p>
        <p type="p">L1:直接光</p>
        <p type="p">L2:反射光</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="512px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621805</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120422</doc-number>
          <kind></kind>
          <date>114/06/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">B08B9/027</main-classification>
        <further-classification edition="200601120260226B">B08B3/08</further-classification>
        <further-classification edition="202301120260226B">C02F1/44</further-classification>
        <further-classification edition="200601120260226B">B01D61/58</further-classification>
        <further-classification edition="200601120260226B">B01D61/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商栗田工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURITA WATER INDUSTRIES LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-130030</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>超純水供給系統的清洗方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種超純水供給系統的清洗方法，是對超純水供給系統進行清洗的方法，所述超純水供給系統具有：送水部，將來自超純水製造裝置的超純水輸送至使用點；以及返送部，將未使用的超純水自使用點返送至超純水製造裝置，所述方法對自所述送水部至返送部的至少一部分區域進行清洗，其特徵在於，設置包括送水用泵及供來自所述送水用泵的送水流通的微粒除去裝置的清洗單元，將自所述清洗單元送出的水的往路用配管與所述區域的一端側連接，並利用回路用配管將所述區域的另一端側與所述清洗單元的水接受側連接，在所述區域中流通清洗水來清洗所述區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:一次純水配管(配管)</p>
        <p type="p">2:子罐</p>
        <p type="p">3:子系統(二次純水系統)</p>
        <p type="p">4:超純水送水配管(送水配管、配管)</p>
        <p type="p">5:使用點</p>
        <p type="p">5a、5b、5c、5d、5e:管線</p>
        <p type="p">6:返送配管(配管)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="330px" img-content="tif" inline="yes" orientation="portrait" width="628px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622281</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120456</doc-number>
          <kind></kind>
          <date>114/06/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C23C16/455</main-classification>
        <further-classification edition="200601120260225B">C23C16/458</further-classification>
        <further-classification edition="200601120260225B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托塔帕伊爾　阿倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOTTAPPAYIL, ARUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANGBAEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAEYOUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭東瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, DONGRAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/654,813</doc-number>
          <date>20240531</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有溫度控制能力之反應腔室及配備有反應腔室之基板處理系統</chinese-title>
        <english-title>REACTION CHAMBER WITH TEMPERATURE CONTROL CAPABILITIES AND SUBSTRATE PROCESSING SYSTEM EQUIPPED WITH THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">呈現一種具有高效溫度控制能力之反應腔室及包含該反應腔室之基板處理系統。該反應腔室可包含：一腔室壁，經組態以環繞在其中處理一晶圓之一反應空間；一晶圓支撐件，安置於該腔室壁之一下部部分及中心處，且該晶圓支撐件經組態以支撐該晶圓；一蓮蓬頭，安置於該腔室壁之一上部側處；一氣體通道(GC)，安置於該蓮蓬頭上及周圍；及一溫度控制部分，安置於該GC上且經組態以控制該反應腔室之一溫度，其中一冷卻劑路徑安置於該GC中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reaction chamber with efficient temperature control capabilities and substrate processing system comprising the reaction chamber is presented. The reaction chamber may comprise a chamber wall configured to encircle a reaction space in which a wafer is processed, a wafer support disposed at a lower part and center of the chamber wall and the wafer support is configured to support the wafer, a showerhead disposed at an upper side of the chamber wall, a gas channel (GC) disposed on and around the showerhead and a temperature control part disposed on the GC and configured to control a temperature of the reaction chamber, wherein a coolant path is disposed in the GC.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:反應腔室</p>
        <p type="p">110:溫度控制部分/冷卻板部分</p>
        <p type="p">111:溫度控制部分/熱接觸板</p>
        <p type="p">112:水路徑</p>
        <p type="p">120:溫度控制部分</p>
        <p type="p">130:氣體通道(GC)</p>
        <p type="p">131:冷卻劑路徑</p>
        <p type="p">140:蓮蓬頭</p>
        <p type="p">150:腔室壁</p>
        <p type="p">160:晶圓支撐件</p>
        <p type="p">161:晶圓</p>
        <p type="p">170:反應空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="694px" img-content="tif" inline="yes" orientation="portrait" width="938px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623654</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120469</doc-number>
          <kind></kind>
          <date>114/06/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/05</main-classification>
        <further-classification edition="202601120260302B">H10W70/09</further-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W70/63</further-classification>
        <further-classification edition="202601120260302B">H10W70/65</further-classification>
        <further-classification edition="202601120260302B">H10W70/692</further-classification>
        <further-classification edition="202601120260302B">H10W70/695</further-classification>
        <further-classification edition="202601120260302B">H10W90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯格埃里　蘇布拉瑪尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KENGERI, SUBRAMANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇利　塔密希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SURI, TAMEESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特爾　梅格納馬赫許庫馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, MEGHNA MAHESHKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特爾　哈亞特卡麥勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, KHYAT KAMAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>印度</country>
          <doc-number>202441042341</doc-number>
          <date>20240531</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/671,929</doc-number>
          <date>20240716</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>19/219,146</doc-number>
          <date>20250527</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有多個中介層核心的中介層裝置</chinese-title>
        <english-title>INTERPOSER DEVICES WITH MULTIPLE INTERPOSER CORES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處所述的實施例係關於具有多個中介層核心的中介層裝置。例如，系統可以包括中介層裝置的第一堆疊和中介層裝置的第二堆疊。第一堆疊可以包括第一核心，包括第一核心基板，而第二堆疊可以包括第二核心，包括第二核心基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate interposer devices with multiple interposer cores. For example, a system can include a first stack of an interposer device and a second stack of the interposer device. The first stack can include a first core including a first core substrate and the second stack can include a second core including a second core substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:印刷電路板(PCB)</p>
        <p type="p">104-1:球組</p>
        <p type="p">104-2:球組</p>
        <p type="p">105-1:球</p>
        <p type="p">105-2:球</p>
        <p type="p">110-1:再分配層</p>
        <p type="p">110-2:再分配層</p>
        <p type="p">110-3:再分配層</p>
        <p type="p">110-4:再分配層</p>
        <p type="p">112-1:導電線</p>
        <p type="p">112-2:導電線</p>
        <p type="p">112-4:導電線</p>
        <p type="p">114-1:通孔</p>
        <p type="p">114-2:通孔</p>
        <p type="p">120-1:核心</p>
        <p type="p">120-2:核心</p>
        <p type="p">122-1:核心基板</p>
        <p type="p">122-2:核心基板</p>
        <p type="p">124-1:TSV</p>
        <p type="p">124-2:TSV</p>
        <p type="p">125:介面</p>
        <p type="p">130:中介層</p>
        <p type="p">132:中介層基板</p>
        <p type="p">134:導電線</p>
        <p type="p">136:通孔</p>
        <p type="p">138:橋</p>
        <p type="p">140:晶粒</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="665px" img-content="tif" inline="yes" orientation="portrait" width="907px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622699</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120621</doc-number>
          <kind></kind>
          <date>114/06/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F1/26</main-classification>
        <further-classification edition="200601120251201B">G05F1/46</further-classification>
        <further-classification edition="200601120251201B">H02M3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏達國際電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HTC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳權禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHUAN-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>靳龍庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, LUNGTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,541</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>穿戴式電子裝置、電源裝置以及其操作方法</chinese-title>
        <english-title>WEARABLE ELECTRONIC DEVICE, POWER DEVICE AND OPERATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種穿戴式電子裝置、電源裝置以及其操作方法被提出。電源裝置包括電壓轉換電路以及電源管理電路。電壓轉換電路接收系統電源，根據系統電源的電壓大小來決定升壓或通過系統電源來產生供應電源。電源管理電路耦接電壓轉換電路，基於供應電源來產生至少一操作電源至至少一應用電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wearable electronic device, a power device and an operation method thereof are provided. The power device includes a voltage converting circuit and a power management circuit. The voltage converting circuit receives a system power, determines to boost or pass the system power to generate a supply power according to a voltage magnitude of the system power. The power management circuit is coupled to the voltage converting circuit, generates at least one operation power to at least one application circuit based on the supply power.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源裝置</p>
        <p type="p">110:電壓轉換電路</p>
        <p type="p">120:電源管理電路</p>
        <p type="p">V_BOB:供應電源</p>
        <p type="p">V_SYS:系統電源</p>
        <p type="p">Vop:操作電源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="711px" img-content="tif" inline="yes" orientation="portrait" width="415px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623285</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120687</doc-number>
          <kind></kind>
          <date>114/06/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250701B">H04W4/70</main-classification>
        <further-classification edition="200901120250701B">H04W52/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙寶輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, BAOHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何東宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, DONG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116866455</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2025105631018</doc-number>
          <date>20250430</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>藍牙系統的通信方法、主裝置、及從裝置</chinese-title>
        <english-title>COMMUNICATION METHOD, MASTER DEVICE, AND SLAVE DEVICE OF BLUETOOTH SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種藍牙系統的通信方法。藍牙系統包括主裝置及從裝置。通信方法包括主裝置與從裝置建立連接，主裝置經由連接發送省電指令至從裝置，響應於省電指令，從裝置經由連接發送省電確認指令至主裝置，接著斷開連接，及進入從裝置省電模式，及響應於省電確認指令，主裝置進入主裝置省電模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication method for use in a Bluetooth system. The Bluetooth system includes a master device and a slave device. The communication method includes the master device and the slave device establishing a connection, the master device issuing a power-saving command to the slave device, in response to the power-saving command, the slave device issuing a power-saving acknowledgement command to the master device, then terminating the connection and entering a slave power-saving mode, and in response to the power-saving acknowledgement command, the master device entering a master power-saving mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:主裝置</p>
        <p type="p">12:從裝置</p>
        <p type="p">300:藍牙連線流程</p>
        <p type="p">305:閒置狀態</p>
        <p type="p">310,315:指令</p>
        <p type="p">320,325:進入省電模式</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="908px" img-content="tif" inline="yes" orientation="portrait" width="740px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622723</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120691</doc-number>
          <kind></kind>
          <date>114/06/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250901B">G06F3/06</main-classification>
        <further-classification edition="201601120250901B">G06F12/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔程植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JUNGSIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹錫永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SEOK-YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0165062</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>運算叢集及運算裝置之操作方法，以及相關非暫時性電腦可讀儲存媒體與電子裝置</chinese-title>
        <english-title>OPERATING METHOD OF COMPUTE CLUSTER AND COMPUTING DEVICE, AND RELATED NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種方法，其包括：藉由一第一節點產生用以將該第一節點之資料儲存於一虛擬記憶體中之一虛擬位址處的一指令；藉由該第一節點根據該虛擬位址判定對應於該虛擬位址之一快取區塊是否儲存於該第一節點之一快取中；基於指示對應於該虛擬位址之一快取區塊未儲存於該第一節點之該快取中的該判定，從而在該第一節點中產生包括該資料之一目標快取區塊；及藉由該第二節點更新儲存於該第二節點之一快取中之一快取區塊，其中該第二節點之該快取中之該快取區塊對應於該虛擬位址，且其中該更新係基於該目標快取區塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An method includes: generating, by a first node, an instruction to store data of the first node at a virtual address in a virtual memory; determining, by the first node, according to the virtual address, whether a cache block corresponding to the virtual address is stored in a cache of the first node; based on the determining indicating that a cache block corresponding to the virtual address is not stored in the cache of the first node, generating, in the first node, a target cache block including the data; and updating, by the second node, a cache block stored in a cache of the second node, where the cache block in the cache of the second node corresponds to the virtual address, and where the updating is based on the target cache block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">610,620,630,640,650:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="862px" img-content="tif" inline="yes" orientation="portrait" width="738px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623625</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120812</doc-number>
          <kind></kind>
          <date>114/06/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
        <further-classification edition="202601120260302B">H10W90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳柏慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, PO-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李孟燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MENG-TSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許立翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, LI-HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇安治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, AN-JHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,681</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/175,556</doc-number>
          <date>20250410</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及形成積體電路封裝的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括形成封裝構件，所述封裝構件包括：中介層，包括第一重佈線結構；貼附到第一重佈線結構的積體電路晶粒；形成封裝基底，形成封裝基底包括：在基底核心的相對側上方形成第二重佈線結構和第三重佈線結構；單體化基底核心以形成元件基底；將第一元件基底和第二元件基底貼到載體，第一元件基底和第二元件基底通過間隙側向錯開；並在第一元件基底和第二元件基底上方形成接合層；將封裝構件貼到封裝基底；並在封裝基底上方形成外部連接件，外部連接件被配置為電耦合積體電路晶粒的訊號布線、電源布線或接地布線到另一封裝構件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a package component, the package component comprising: an interposer comprising a first redistribution structure; integrated circuit dies attached to the first redistribution structure; forming a package substrate, forming the package substrate comprising: forming a second redistribution structure and a third redistribution structure over opposite sides of a substrate core; singulating the substrate core to form component substrates; attaching a first component substrate and a second component substrate to a carrier, the first component substrate and the second component substrate being laterally displaced by a gap; and forming a bonding layer over the first component substrate and the second component substrate; attaching the package component to the package substrate; and forming external connectors over the package substrate, the external connectors being configured to electrically couple a signal routing, a power routing, or a ground routing of the integrated circuit dies to an another package component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">150A:邏輯裝置</p>
        <p type="p">150B:記憶體裝置</p>
        <p type="p">160:背側重佈線結構</p>
        <p type="p">200,200A:封裝構件</p>
        <p type="p">240:中介層</p>
        <p type="p">300,300A:重構封裝基底/重構封裝晶圓</p>
        <p type="p">302:核心基底/基底核心</p>
        <p type="p">303:核心材料</p>
        <p type="p">306:基底穿孔/玻璃穿孔</p>
        <p type="p">307:前側重佈線結構/重佈線結構</p>
        <p type="p">308:背側重佈線結構/重佈線結構</p>
        <p type="p">310:金屬墊</p>
        <p type="p">312:鈍化層</p>
        <p type="p">330:元件基底</p>
        <p type="p">332:間隙填充材料</p>
        <p type="p">336:互連晶粒</p>
        <p type="p">338:模塑聚合物</p>
        <p type="p">350:重佈線結構</p>
        <p type="p">360:外部連接件</p>
        <p type="p">400,400A:積體電路封裝</p>
        <p type="p">408:封裝材</p>
        <p type="p">450:金屬層</p>
        <p type="p">460:熱介面材料層/TIM層</p>
        <p type="p">470:蓋子</p>
        <p type="p">472:黏著劑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10056.png" file="d10056.TIF" giffile="ed10056.png" height="729px" img-content="tif" inline="yes" orientation="portrait" width="1054px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623031</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120823</doc-number>
          <kind></kind>
          <date>114/06/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01J37/26</main-classification>
        <further-classification edition="200601120260225B">H01J37/244</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃郊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王進澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JINZE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊海濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/099770</doc-number>
          <date>20240618</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用逆晶粒對資料庫對準之裝置內疊對度量衡</chinese-title>
        <english-title>IN-DEVICE OVERLAY METROLOGY USING INVERSE DIE-TO-DATABASE ALIGNMENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種帶電粒子束設備，其包括一帶電粒子束源、一帶電粒子光學系統、一帶電粒子偵測器及一控制器。該帶電粒子光學將一初級帶電粒子束引導於一樣本表面處。該控制器基於該偵測器處之經偵測帶電粒子而判定安置於該樣本表面處之一目標特徵之一輪廓。該目標特徵之一第一層結構及一第二層結構係基於包括一第一層設計圖案及一第二層設計圖案之一設計圖案。該控制器進行以下操作：經由一逆晶粒對資料庫(iD2DB)對準來判定該第一層結構之一對準位置，該iD2DB對準包括在由該目標特徵之該經判定輪廓界定之一搜尋區域中對該第一層設計圖案之至少一部分之一搜尋；判定該第二層結構之一對準位置；及判定該等對準位置之一差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charged particle beam apparatus includes a charged particle beam source, a charged particle optical system, a charged particle detector, and a controller. The charged particle optical directs a beam of primary charged particles at a sample surface. The controller determines a contour of a target feature disposed at the sample surface based on detected charged particles at the detector. A first layer structure and a second layer structure of the target feature are based on a design pattern that includes a first layer design pattern and a second layer design pattern. The controller determines an alignment position of the first layer structure, via an inverse die-to-database (iD2DB) alignment that includes a search for at least a portion of the first layer design pattern in a search area defined by the determined contour of the target feature, an alignment position of the second layer structure, and a difference thereof.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:程序流程</p>
        <p type="p">702:步驟</p>
        <p type="p">704:步驟</p>
        <p type="p">706:步驟</p>
        <p type="p">708:步驟</p>
        <p type="p">710:步驟</p>
        <p type="p">712:步驟</p>
        <p type="p">714:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="500px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
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  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623286</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120848</doc-number>
          <kind></kind>
          <date>114/06/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120250701B">H04W4/70</main-classification>
        <further-classification edition="200601120250701B">H04L12/02</further-classification>
        <further-classification edition="202201120250701B">H04L69/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙寶輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, BAOHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何東宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, DONG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116400525</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2025105606745</doc-number>
          <date>20250430</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>通訊系統的通訊方法</chinese-title>
        <english-title>METHOD OF COMMUNICATION IN COMMUNICATION SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊系統的通訊方法，該通訊系統包括第一裝置及第二裝置，方法包括第一裝置發送裝置開機封包至第二裝置，響應於裝置開機封包，重置第二裝置，在第二裝置重置後，第二裝置發送第一握手封包至第一裝置，及響應於第一握手封包，第一裝置回傳第二握手封包至第二裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of communication for use in a communication system is provided, the communication system including a first device and a second device. The method includes the first device issuing a device power-on packet to a second device, resetting the second device in response to the device power-on packet, the second device issuing a first handshake packet to the first device after the second device is reset, and the first device transmitting a second handshake packet to the second device in response to the first handshake packet.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:通訊方法</p>
        <p type="p">S300至S316:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="1066px" img-content="tif" inline="yes" orientation="portrait" width="783px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622130</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120865</doc-number>
          <kind></kind>
          <date>114/06/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C08F20/26</main-classification>
        <further-classification edition="200601120260223B">C08L33/14</further-classification>
        <further-classification edition="200601120260223B">C08K5/3477</further-classification>
        <further-classification edition="200601120260223B">B32B27/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商播磨化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARIMA CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎匠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西谷和晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHITANI, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒木彩帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKI, SAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-093351</doc-number>
          <date>20240607</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>(甲基)丙烯酸樹脂、硬化型組成物及多層片</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種(甲基)丙烯酸樹脂，其能夠形成「維持對於塗佈液之潤濕性之同時，脫模性提升之脫模層」。本發明之(甲基)丙烯酸樹脂包含特定之結構式所表示之構成單元，上述(甲基)丙烯酸樹脂包含特定之結構式所表示之構成單元，且碘值為50 gI&lt;sub&gt;2&lt;/sub&gt;/100 g以下，因此能夠形成「維持對於塗佈液之潤濕性之同時，脫模性提升之脫模層」。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622908</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120945</doc-number>
          <kind></kind>
          <date>114/06/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260302B">G06V10/82</main-classification>
        <further-classification edition="200601120260302B">G01N21/956</further-classification>
        <further-classification edition="201701120260302B">G06T7/11</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅素　喬丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROUSE, GORDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普魯格薩　亞聶　庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PULUGURTHA, ANIL KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫耶　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOYER, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/959,278</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>編碼一樣本之設計資訊以供檢查及其他程序中之運行時間使用</chinese-title>
        <english-title>ENCODING DESIGN INFORMATION FOR A SPECIMEN FOR RUNTIME USE IN INSPECTION AND OTHER PROCESSES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於判定一樣本之資訊之方法及系統。一個系統包含一深度學習(DL)模型，該DL模型經組態用於將一樣本之一設計之資訊變換為包含依據該設計中之位置而變化之經編碼設計屬性之該設計之一經編碼表示。一電腦系統儲存該經編碼表示以供藉由一工具對該樣本執行之一程序中之使用。該經編碼表示可經組態為可用於諸如但不限於缺陷分類及擾亂點過濾之應用之一設計屬性圖。本文中描述之實施例之一個顯著優點係即使針對實質上大量缺陷，其等仍實現線上執行此等應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for determining information for a specimen are provided. One system includes a deep learning (DL) model configured for transforming information for a design for a specimen into an encoded representation of the design that includes encoded design attributes as a function of position in the design. A computer system stores the encoded representation for use in a process performed on the specimen by a tool. The encoded representation may be configured as a design attribute map that can be used for applications such as, but not limited to, defect classification and nuisance filtering. One significant advantage of the embodiments described herein is that they enable such applications to be performed inline even for substantially large numbers of defects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:工具</p>
        <p type="p">14:樣本</p>
        <p type="p">16:光源</p>
        <p type="p">18:光學元件</p>
        <p type="p">20:透鏡</p>
        <p type="p">22:載物台</p>
        <p type="p">24:集光器</p>
        <p type="p">26:元件</p>
        <p type="p">28:偵測器</p>
        <p type="p">30:集光器</p>
        <p type="p">32:元件</p>
        <p type="p">34:偵測器</p>
        <p type="p">36:電腦系統</p>
        <p type="p">102:電腦系統</p>
        <p type="p">104:組件</p>
        <p type="p">106:深度學習(DL)模型</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="596px" img-content="tif" inline="yes" orientation="portrait" width="614px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623604</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120991</doc-number>
          <kind></kind>
          <date>114/06/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="202301120260302B">G06N3/0455</further-classification>
        <further-classification edition="200601120260302B">G06F17/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波耶瑟　史文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOESE, SVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格羅杰　菲力普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROEGER, PHILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/952,833</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用變換器架構之基於機器學習之計量升取樣</chinese-title>
        <english-title>MACHINE LEARNING BASED METROLOGY UPSAMPLING USING A TRANSFORMER ARCHITECTURE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於對樣品資訊進行升取樣之方法及系統。一般言之，實施例經組態用於使用一變換器架構對一樣品之計量資訊進行升取樣。變換器經組態用於自注意力及交叉注意力。除諸如額外計量變數及藉由對一樣品執行一程序之一程序工具產生之資訊之其他資訊之外，至該變換器之一編碼器之針對該樣品上之稀疏位置之輸入亦可包含該等稀疏位置之計量資訊及座標。至該變換器之一解碼器之針對密集位置之輸入僅包含該等密集位置之座標及藉由該程序工具針對該等密集位置產生之一些資訊。該解碼器輸出該等密集位置之計量資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for upsampling specimen information are provided. In general, the embodiments are configured for upsampling metrology information for a specimen using a transformer architecture. The transformer is configured for self-attention and cross-attention. Inputs to an encoder of the transformer for sparse locations on a specimen may include metrology information and coordinates of the sparse locations in addition to other information such as additional metrology variables and information generated by a process tool that performs a process on the specimen. Inputs to a decoder of the transformer for the dense locations include only the coordinates of the dense locations and some information generated for the dense locations by the process tool. The decoder outputs the metrology information for the dense locations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">126:樣品</p>
        <p type="p">130:寬頻反射光譜儀(BRS)</p>
        <p type="p">132:透鏡</p>
        <p type="p">134:寬頻光譜儀/偵測器</p>
        <p type="p">136:透鏡</p>
        <p type="p">138:孔徑</p>
        <p type="p">140:色散元件</p>
        <p type="p">142:偵測器陣列</p>
        <p type="p">143:鏡</p>
        <p type="p">144:探測光束</p>
        <p type="p">145:透鏡</p>
        <p type="p">146:光源</p>
        <p type="p">148:鏡</p>
        <p type="p">150:鏡</p>
        <p type="p">152:電腦子系統</p>
        <p type="p">153:組件</p>
        <p type="p">154:寬頻光譜橢偏儀(BSE)</p>
        <p type="p">155:變換器</p>
        <p type="p">156:偏光器</p>
        <p type="p">157:製造程序工具</p>
        <p type="p">158:聚焦鏡</p>
        <p type="p">159:感測器</p>
        <p type="p">160:準直鏡</p>
        <p type="p">162:旋轉補償器</p>
        <p type="p">164:檢偏鏡</p>
        <p type="p">166:鏡</p>
        <p type="p">168:膜/薄膜層</p>
        <p type="p">170:基板</p>
        <p type="p">172:電動馬達</p>
        <p type="p">174:光束輪廓橢偏儀(BPE)</p>
        <p type="p">176:四分之一波板</p>
        <p type="p">178:偏光器</p>
        <p type="p">180:透鏡</p>
        <p type="p">182:四象限偵測器</p>
        <p type="p">183:光源/雷射</p>
        <p type="p">184:探測光束</p>
        <p type="p">186:鏡</p>
        <p type="p">188:鏡</p>
        <p type="p">190:鏡</p>
        <p type="p">192:光束輪廓反射儀(BPR)</p>
        <p type="p">194:透鏡</p>
        <p type="p">196:光束分裂器</p>
        <p type="p">198:線性偵測器陣列</p>
        <p type="p">200:線性偵測器陣列</p>
        <p type="p">202:偵測器/相機</p>
        <p type="p">204:橢偏儀</p>
        <p type="p">206:光源</p>
        <p type="p">208:偏光器</p>
        <p type="p">210:透鏡</p>
        <p type="p">212:透鏡</p>
        <p type="p">214:旋轉補償器</p>
        <p type="p">216:檢偏鏡</p>
        <p type="p">218:偵測器</p>
        <p type="p">220:光束</p>
        <p type="p">222:電動馬達</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="742px" img-content="tif" inline="yes" orientation="portrait" width="966px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623029</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114120994</doc-number>
          <kind></kind>
          <date>114/06/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H01J37/20</main-classification>
        <further-classification edition="200601120260223B">H01J37/22</further-classification>
        <further-classification edition="200601120260223B">H01J37/28</further-classification>
        <further-classification edition="200601120260223B">H01J37/305</further-classification>
        <further-classification edition="201801120260223B">G01N23/2251</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＦＥＩ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEI COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格爾茨　雷姆科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEURTS, REMCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波托切克　帕維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POTOCEK, PAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
              <english-address>CZ</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/734,069</doc-number>
          <date>20240605</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>薄片變形檢測和調整</chinese-title>
        <english-title>DETECTING AND ADJUSTING LAMELLA DEFORMATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明專利所述的一種方法，包括利用設有第一研磨設定的帶電粒子束系統在第一時間對樣本執行第一研磨操作，基於第一研磨操作生成樣本的第一影像，基於第一影像判定樣本的第一組追蹤特徵，利用設有第一研磨設定的帶電粒子束系統在第二時間對樣本執行第二研磨操作，基於第二研磨操作生成樣本的第二影像，基於第二影像判定第一組追蹤特徵的第一變更，並基於第一變更將第一研磨設定調整為第二研磨設定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method including performing, with a charged particle system having a first milling setting, a first milling operation on a sample at a first time, generating a first image of the sample based on the first milling operation, determining, based on the first image, a first set of tracking features of the sample, performing, with the charged particle system having the first milling setting, a second milling operation on the sample at a second time, generating a second image of the sample based on the second milling operation, determining, based on the second image, a first change to the first set of tracking features, and adjusting the first milling setting to a second milling setting based on the first change.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:帶電粒子束系統</p>
        <p type="p">111:FIB系統</p>
        <p type="p">112:離子柱</p>
        <p type="p">114:離子源</p>
        <p type="p">115:萃取電極</p>
        <p type="p">116:聚焦組件</p>
        <p type="p">117:聚焦元件</p>
        <p type="p">118:聚焦離子束</p>
        <p type="p">119:系統控制器</p>
        <p type="p">120:靜電偏轉裝置</p>
        <p type="p">121:記憶體</p>
        <p type="p">122:樣本</p>
        <p type="p">124:TEM支架；TEM樣本架</p>
        <p type="p">125:樣本台</p>
        <p type="p">126:樣本室</p>
        <p type="p">130:抽汲系統</p>
        <p type="p">132:空控制器</p>
        <p type="p">134:高壓電源</p>
        <p type="p">136:放大器</p>
        <p type="p">138:圖案產生器</p>
        <p type="p">140:帶電粒子偵測器</p>
        <p type="p">141:SEM</p>
        <p type="p">142:視訊電路</p>
        <p type="p">143:電子束</p>
        <p type="p">144:視訊監視器</p>
        <p type="p">145:電源和控制單元</p>
        <p type="p">146:氣體注入系統</p>
        <p type="p">147:微操作器</p>
        <p type="p">148:電動馬達</p>
        <p type="p">149:執行器</p>
        <p type="p">150:細探針</p>
        <p type="p">152:陰極</p>
        <p type="p">154:陽極</p>
        <p type="p">156:聚光透鏡</p>
        <p type="p">158:物鏡</p>
        <p type="p">160:偏轉器</p>
        <p type="p">162:STEM偵測器</p>
        <p type="p">168:離子泵</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="773px" img-content="tif" inline="yes" orientation="portrait" width="998px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623631</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121039</doc-number>
          <kind></kind>
          <date>114/06/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/20</main-classification>
        <further-classification edition="202601120260302B">H10W70/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商微軟技術授權有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROSOFT TECHNOLOGY LICENSING, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肯嗒路普　克里斯多佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANTALOUBE, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/789,313</doc-number>
          <date>20240730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括嵌入有與基板平面正交的接觸表面的被動元件的封裝基板及相關方法</chinese-title>
        <english-title>PACKAGE SUBSTRATE INCLUDING PASSIVE DEVICES EMBEDDED WITH CONTACT SURFACES ORTHOGONAL TO A PLANE OF SUBSTRATE AND RELATED METHODS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">可將被動元件嵌入封裝基板中的空腔，而被動元件具有在接觸表面上的電氣觸點，前述接觸表面正交於封裝基板的表面並且延伸穿過封裝基板。被動元件的電氣觸點可耦接至通孔，通孔耦接至電源以提供電容性去耦。可從封裝基板排除一或多個貫穿通孔(THV)以容納被動元件，前述一或多個貫穿通孔(THV)為封裝基板上的IC提供電流。將被動元件嵌入封裝基板的空腔中，而封裝基板具有正交而非平行於封裝基板表面的接觸表面，減少了被動元件佔用的面積。這種方式減少了從封裝基板排除的THV數量，從而減少對電源網路電阻的影響。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Passive devices may be embedded into a cavity in a package substrate, with electrical contacts of the passive device on a contact surface orthogonal to a surface of the package substrate and extending through the package substrate. The electrical contacts of the passive device may be coupled to vias coupled to a power supply to provide capacitive decoupling. One or more through-hole vias (THVs), which provide current to ICs on the package substrate, may be excluded from the package substrate to accommodate the passive device. Embedding the passive devices in the cavity of the package substrate with the contact surface orthogonal to, rather than parallel to, the surface of the package substrate, reduces an area occupied by the passive device. In this manner, a number of the THVs excluded from the package substrate is reduced, which results in a smaller impact to the resistance of the power supply network.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:封裝基板</p>
        <p type="p">302:介電材料</p>
        <p type="p">304:2D陣列</p>
        <p type="p">306:圓柱狀THV</p>
        <p type="p">308L:表面</p>
        <p type="p">308U:表面</p>
        <p type="p">310:積體電路(IC)</p>
        <p type="p">312:被動元件</p>
        <p type="p">314:孔洞</p>
        <p type="p">316:接觸表面/側面</p>
        <p type="p">318:元件基板</p>
        <p type="p">320A:電氣觸點</p>
        <p type="p">320B:電氣觸點</p>
        <p type="p">320C:電氣觸點</p>
        <p type="p">322:位置</p>
        <p type="p">324:通孔</p>
        <p type="p">324A:通孔</p>
        <p type="p">324B:通孔</p>
        <p type="p">324C:通孔</p>
        <p type="p">326:孔洞開口</p>
        <p type="p">328:互連</p>
        <p type="p">330:介電材料</p>
        <p type="p">332:壁</p>
        <p type="p">336:行</p>
        <p type="p">338:互連層</p>
        <p type="p">338L:互連層</p>
        <p type="p">338U:互連層</p>
        <p type="p">340:列</p>
        <p type="p">342L:互連</p>
        <p type="p">342U:互連</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="555px" img-content="tif" inline="yes" orientation="portrait" width="692px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623000</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121168</doc-number>
          <kind></kind>
          <date>114/06/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H01B3/30</main-classification>
        <further-classification edition="200601120260223B">H01B13/00</further-classification>
        <further-classification edition="200601120260223B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兵庫縣公立大學法人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF HYOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細田一輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSODA, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>並川敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMIKAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸川洋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIKAWA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊健夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TAKEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田哲男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, TETSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川進二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-093645</doc-number>
          <date>20240610</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電線、電纜用被覆材、電線、電纜、半導體製造裝置用真空裝置、半導體製造裝置以及電線、電纜用被覆材的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供：即便於真空狀態使用，出氣（outgas）成分之流出亦較少的半導體製造裝置用之電線、電纜用被覆材、使用其之電線、電纜、半導體製造裝置用真空裝置、半導體製造裝置以及電線、電纜用被覆材的製造方法。本發明係一種電線、電纜用被覆材，其用於半導體製造裝置內之真空裝置，且滿足下述條件A：  &lt;br/&gt;（條件A）  &lt;br/&gt;於20～30℃、1.0×10&lt;sup&gt;-2&lt;/sup&gt;～1.0×10&lt;sup&gt;-4&lt;/sup&gt; Pa之條件下靜置48小時後之試樣之每單位表面積的釋氣率為2.0×10&lt;sup&gt;-9&lt;/sup&gt; Pa･m&lt;sup&gt;3&lt;/sup&gt;/s/cm&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622149</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121233</doc-number>
          <kind></kind>
          <date>114/06/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C08G64/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤高木祐梨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO TAKAGI, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>輿石英二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSHIISHI, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水英貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, HIDETAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石裕人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIZUKA, HIROHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白武宗憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRATAKE, MUNENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田拓真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細川智哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOKAWA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-093295</doc-number>
          <date>20240607</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>熱塑性樹脂之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於樹脂之製造裝置中之洗淨，並不能必然稱為充分者。例如，可舉出具有相對較高蒸氣壓之SPG等作為單體使用之聚合反應後之反應器等，其確實之洗淨並非容易者。因此，由於反應器等中所殘留之雜質混入，於聚合反應後所得到之樹脂中，無法實現所設定之構成單位之比例，並且曾懸念餾出裝置、配管之閉塞等情況。作為解決上述課題之手段，可舉出以下之熱塑性樹脂之製造方法。  &lt;br/&gt;　　即，係於將含有來自螺環乙二醇(SPG)或SPG衍生物之構成單位之第1熱塑性樹脂(S)進行聚合之後，製造第2熱塑性樹脂(A)之製造方法，該方法含有洗淨步驟(a)，於前述洗淨步驟(a)中，將使用於前述第1熱塑性樹脂(S)之製造之反應器，依序以碳酸酯及芳香醇進行洗淨之熱塑性樹脂之製造方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:聚合反應器</p>
        <p type="p">20:反應器</p>
        <p type="p">20A:樹脂原料投入口</p>
        <p type="p">20B:樹脂排出口</p>
        <p type="p">22:攪拌翼</p>
        <p type="p">24:連結管</p>
        <p type="p">30:冷卻裝置</p>
        <p type="p">30A:第1餾出液排出口</p>
        <p type="p">30B:第2餾出液排出口</p>
        <p type="p">40:餾出液貯槽</p>
        <p type="p">40A:注入口</p>
        <p type="p">40B:排出口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="652px" img-content="tif" inline="yes" orientation="portrait" width="667px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623041</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121236</doc-number>
          <kind></kind>
          <date>114/06/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="200601120260302B">G01K7/16</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅查阿爾瓦雷斯　胡安卡洛斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROCHA-ALVAREZ, JUAN CARLOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
              <english-address>MX</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/737,275</doc-number>
          <date>20240607</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括量測組件的基板支撐件及相關設備、方法及處理腔室</chinese-title>
        <english-title>SUBSTRATE SUPPORTS INCLUDING MEASUREMENT ASSEMBLIES, AND RELATED APPARATUS, METHODS, AND PROCESSING CHAMBERS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例一般涉及包括量測組件的基板支撐件及相關設備、方法和處理腔室（例如，半導體處理腔室）。在一或多個實施例中，用於放置在處理腔室中的基板支撐件包括包含陶瓷材料的支撐主體，以及嵌入於支撐主體中的量測組件。該量測組件包括電阻、耦合到電阻的輸入線、耦合到輸入線的輸入墊，以及耦合到電阻的輸出線。輸入線和輸出線的電阻低於電阻。量測組件包括耦合到輸出線的輸出墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to substrate supports including measurement assemblies, and related apparatus, methods, and processing chambers (e.g., semiconductor processing chambers). In one or more embodiments, a substrate support for disposition in a processing chamber includes a support body including a ceramic material, and a measurement assembly embedded in the support body. The measurement assembly includes a resistor, an input wire coupled to the resistor, an input pad coupled to the input wire, and an output wire coupled to the resistor. The input wire and the output wire have a lower resistance than the resistor. The measurement assembly includes an output pad coupled to the output wire.</p>
      </isu-abst>
      <representative-img>
        <p type="p">136:加熱元件</p>
        <p type="p">154:吸附電極</p>
        <p type="p">156:電極</p>
        <p type="p">224:基板支撐件</p>
        <p type="p">230:量測組件</p>
        <p type="p">231:電阻</p>
        <p type="p">232:輸入線</p>
        <p type="p">234:輸出線</p>
        <p type="p">235:輸出墊</p>
        <p type="p">241:開口</p>
        <p type="p">242:插入件</p>
        <p type="p">252:支撐主體</p>
        <p type="p">D1:第一距離</p>
        <p type="p">D2:第二距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="364px" img-content="tif" inline="yes" orientation="portrait" width="723px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621885</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121256</doc-number>
          <kind></kind>
          <date>114/06/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B29C41/14</main-classification>
        <further-classification edition="200601120260224B">B29D23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商普羅達有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRODUCT SRL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格雷拉　艾曼紐埃萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUERRA, EMANUELE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法科尼　路卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FACCONI, LUCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科佩塔　路卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COPETA, LUCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/IT2024/000017</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於製造鎧裝加強型塑料管的方法</chinese-title>
        <english-title>PROCESS FOR THE PRODUCTION OF TUBES OF PLASTIC MATERIAL REINFORCED WITH ARMOUR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於製造鎧裝加強型塑料管的方法，該方法包含：至少一個將第一成型裝置浸入第一聚合物共混物中的浸漬步驟及至少一個將第二成型裝置浸入第二聚合物共混物中的浸漬步驟，以便分別獲得第一塑料護套及第二塑料護套，隨後將第一塑料護套及第二塑料護套與配置於其間的穿孔式鎧裝組裝在一起以便獲得組合件，其中對該組合件進行熱層合且隨後進行冷卻；亦揭示由此獲得之鎧裝加強型塑料管及在醫療手術領域及生物醫學領域中的相關應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">It is disclosed a process for the production of tubes of plastic material reinforced with armour comprising at least one dipping step into a first polymer blend of a first forming means and at least one dipping step into a second polymer blend of a second forming means in order to obtain a first sheath of plastic material and a second sheath of plastic material, respectively, which are subsequently assembled together with a perforated armour arranged therebetween for obtaining an assembly, wherein said assembly is subjected to hot lamination and subsequent cooling; the tube of plastic material reinforced with armour thus obtained and related applications in the medical-surgical and biomedical field are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鎧裝管</p>
        <p type="p">101:塑料內層</p>
        <p type="p">102:塑料外層</p>
        <p type="p">103:金屬鎧裝</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="747px" img-content="tif" inline="yes" orientation="portrait" width="886px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621999</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121313</doc-number>
          <kind></kind>
          <date>114/06/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260223B">C02F1/28</main-classification>
        <further-classification edition="202301120260223B">C02F9/00</further-classification>
        <further-classification edition="202301120260223B">C02F1/467</further-classification>
        <further-classification edition="200601320260223B">C02F101/36</further-classification>
        <further-classification edition="200601320260223B">C02F103/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商祿幕斯科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUMMUS TECHNOLOGY LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費爾奇　查德　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FELCH, CHAD L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克拉克　馬克　艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLARK, MARK ALLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>得　萊昂　加列戈斯　埃里卡　莉澤特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE LEON GALLEGOS, ERIKA LIZETTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
              <english-address>MX</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/657,246</doc-number>
          <date>20240607</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於消除全氟及多氟烷基物質(PFAS)之水處理及濕式空氣再生方法之整合</chinese-title>
        <english-title>INTEGRATION OF WATER TREATMENT AND WET AIR REGENERATION METHODS FOR THE DESTRUCTION OF PER- AND POLYFLUORINATED ALKYL SUBSTANCES (PFAS)</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於收集且消除水中全氟及多氟烷基物質(PFAS)之水處理方法及系統。該等系統及方法利用一粉末活性碳處理(PACT)步驟及一濕式空氣再生(WAR)處理步驟，其後接著一電氧化處理步驟。該等所揭示方法及系統能夠消除包含地下水、飲用水或者工業或市政廢水之水流及/或吸附介質中存在之PFAS。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Water treatment methods and systems for the collection and destruction of per- and polyfluorinated alkyl substances (PFAS) in water are provided. The systems and methods utilize a powdered activated carbon treatment (PACT) step and a wet air regeneration (WAR) treatment step followed by an electro-oxidation treatment step. The disclosed methods and systems are capable of destroying PFAS present in water streams and/or adsorption media, including groundwater, drinking water, or industrial or municipal wastewater.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:入口流</p>
        <p type="p">12:粉末活性碳</p>
        <p type="p">14:廢碳材料</p>
        <p type="p">15:再循環管線</p>
        <p type="p">16:清潔水流</p>
        <p type="p">18:含全氟及多氟烷基物質(PFAS)漿液</p>
        <p type="p">19:廢氣</p>
        <p type="p">20:無機灰</p>
        <p type="p">22:流出物</p>
        <p type="p">24:再生碳固體部分</p>
        <p type="p">26:廢液</p>
        <p type="p">28:流出物流</p>
        <p type="p">30:全氟及多氟烷基物質(PFAS)濃縮物部分</p>
        <p type="p">32:電氧化流出物流</p>
        <p type="p">100:水處理系統</p>
        <p type="p">102:粉末活性碳處理(PACT)系統</p>
        <p type="p">104:分離器</p>
        <p type="p">106:濕式空氣再生(WAR)系統</p>
        <p type="p">108:分離站</p>
        <p type="p">110:濃縮器</p>
        <p type="p">112:電氧化單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="567px" img-content="tif" inline="yes" orientation="portrait" width="804px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623574</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121387</doc-number>
          <kind></kind>
          <date>114/06/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>油谷幸則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABURATANI, YUKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田嚴之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/023664</doc-number>
          <date>20240628</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置、移載機之示教方法、半導體裝置之製造方法、基板移載系統及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可利用移載機偵測晶圓搬送盒內之晶圓的位置，並對移載機進行示教之技術。  &lt;br/&gt;本發明具有機器人及控制部，該機器人具有：感測器，其檢測基板的邊緣；回轉部，其使上述感測器繞回轉軸運動；進退驅動部，其被支撐於上述回轉部，並且以可變更上述感測器與上述回轉軸之間的距離之方式支撐上述感測器；及末端執行器，其被支撐為可繞上述回轉軸運動且可變更與上述回轉軸之間的距離；該控制部被構成為，可一面使上述感測器繞上述回轉軸之旋轉角度及上述距離變化，一面偵測未由上述末端執行器固持而被置放於基準位置之基板的邊緣之上述距離的最大值進行搜索，而取得上述最大值及成為最大值時的旋轉角度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">6:晶圓(示教對象晶圓)</p>
        <p type="p">29a,29b:光纖感測器</p>
        <p type="p">29c,29d:光纖感測器</p>
        <p type="p">40:回轉軸</p>
        <p type="p">50:中心</p>
        <p type="p">60:旋轉圓</p>
        <p type="p">100,101:雷射光束</p>
        <p type="p">A:交叉點</p>
        <p type="p">D:旋轉圓的半徑</p>
        <p type="p">r:晶圓的半徑</p>
        <p type="p">X&lt;sub&gt;edge&lt;/sub&gt;(0):距離</p>
        <p type="p">X&lt;sub&gt;edge&lt;/sub&gt;(β):距離</p>
        <p type="p">β:旋轉角度</p>
        <p type="p">Δd:差值</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="553px" img-content="tif" inline="yes" orientation="portrait" width="607px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622223</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121498</doc-number>
          <kind></kind>
          <date>114/06/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C11D3/26</main-classification>
        <further-classification edition="200601120260302B">C11D7/32</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高齊嶽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO, CHI YUEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古芬克　哈奇　歐斯曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUEVENC, HACI OSMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
              <english-address>TR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里普　安卓亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLIPP, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈美卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, MEI CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24181709.7</doc-number>
          <date>20240612</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於清潔包含鎳及鋁之半導體基板表面之組成物之用途、相應組成物及方法</chinese-title>
        <english-title>USE OF A COMPOSITION FOR CLEANING THE SURFACE OF A SEMICONDUCTOR SUBSTRATE COMPRISING NICKEL AND ALUMINIUM, RESPECTIVE COMPOSITION AND PROCESS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述一種包含一或多種有機氮化合物之組成物用於清潔半導體基板表面之用途，其中該表面包含含有鎳及鋁之二元金屬材料，以及相應組成物。此外，本文描述一種涉及該包含一或多種有機氮化合物之組成物之製造半導體裝置之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein is the use of a composition comprising one or more organic nitrogen compounds for cleaning the surface of a semiconductor substrate, wherein said surface comprises a binary metallic material comprising nickel and aluminium, and a respective composition. Moreover, described is herein a process for the manufacture of a semiconductor device involving said composition comprising one or more organic nitrogen compounds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622268</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121596</doc-number>
          <kind></kind>
          <date>114/06/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C23C14/56</main-classification>
        <further-classification edition="200601120260223B">C23C14/06</further-classification>
        <further-classification edition="200601120260223B">C23C14/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多田憲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADA, NORITOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-095909</doc-number>
          <date>20240613</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>濺鍍裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之濺鍍裝置(100)是將Yb氧化物或SiC作為靶材材料(200)來對已配置於腔室(110)內的基板(10)進行濺鍍之濺鍍裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">100:濺鍍裝置</p>
        <p type="p">110:腔室</p>
        <p type="p">120:基板保持部</p>
        <p type="p">121:固定治具</p>
        <p type="p">130:靶材保持部</p>
        <p type="p">140:氣體供給部</p>
        <p type="p">151:真空泵</p>
        <p type="p">152:閥</p>
        <p type="p">160:電源</p>
        <p type="p">170:磁性電路</p>
        <p type="p">200:靶材材料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="655px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622274</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121604</doc-number>
          <kind></kind>
          <date>114/06/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/34</main-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="202501120260302B">H10D64/68</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
        <further-classification edition="202501120260302B">H10D84/85</further-classification>
        <further-classification edition="202601120260302B">H10P14/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李璐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊梓燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, ZIYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴浩銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, HAOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊依晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, I-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林永景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YONGJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙浩岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHA, HAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德維拉詹　賈納爾德罕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEVRAJAN, JANARDHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/660,071</doc-number>
          <date>20240614</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>製造電子元件之方法</chinese-title>
        <english-title>METHODS OF MANUFACTURING ELECTRONIC DEVICES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了製造電子元件的方法和在電子元件製程中沉積金屬氮化物薄膜的方法。沉積金屬氮化物薄膜的方法包括將半導體基板暴露於金屬前驅物、含氮反應物和還原劑，以便直接在半導體基板上沉積金屬氮化物薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of manufacturing electronic devices and methods of depositing a metal nitride film as part of an electronic device fabrication process are described. The method of depositing the metal nitride film comprises exposing a semiconductor substrate to a metallic precursor, a nitrogen-containing reactant, and a reducing agent to deposit the metal nitride film directly on the semiconductor substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110:操作</p>
        <p type="p">120:操作</p>
        <p type="p">130:操作</p>
        <p type="p">140:操作</p>
        <p type="p">150:操作</p>
        <p type="p">160:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="911px" img-content="tif" inline="yes" orientation="portrait" width="577px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622558</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121681</doc-number>
          <kind></kind>
          <date>114/06/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G02B6/12</main-classification>
        <further-classification edition="200601120260224B">G02B6/287</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商爾雅實驗室公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AYAR LABS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布赫賓德　西德尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHBINDER, SIDNEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉維吉安　哈伊格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEVORGYAN, HAYK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AM</english-country>
              <english-address>AM</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲尼　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINI, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇樓　阿納托爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHILO, ANATOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BY</english-country>
              <english-address>BY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基塔　德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITA, DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　奥登　德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN ORDEN, DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威克魯斯　德雷斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERCRUYSSE, DRIES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　馬諾基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, MANUJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/659,324</doc-number>
          <date>20240612</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有改良之可靠性的微環共振器裝置加熱器</chinese-title>
        <english-title>MICRORING RESONATOR DEVICE HEATER WITH IMPROVED RELIABILITY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">微環共振器裝置包括具有內徑向壁、外徑向壁、頂面及底面之環形光波導。該環形光波導環繞微環共振器裝置之內部區域。環形加熱器設置於微環共振器裝置之內部區域內。該環形加熱器具有內徑向壁、外徑向壁、頂面及底面。該環形加熱器環繞微環共振器裝置之中心。該環形加熱器為電阻加熱裝置。第一及第二電觸點電連接至環形加熱器。散熱鰭片設置於環形光波導之一部分上方。散熱鰭片熱連接至環形加熱器。散熱鰭片與環形加熱器以及第一和第二電觸點電隔離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A microring resonator device includes a ring-shaped optical waveguide that has an inner radial wall, an outer radial wall, a top surface, and a bottom surface. The ring-shaped optical waveguide circumscribes an interior region of the microring resonator device. A ring-shaped heater is disposed within the interior region of the microring resonator device. The ring-shaped heater has an inner radial wall, an outer radial wall, a top surface, and a bottom surface. The ring-shaped heater circumscribes a center of the microring resonator device. The ring-shaped heater is an electrically resistive heating device. First and second electrical contacts are electrically connected to the ring-shaped heater. A heat spreader fin is disposed above a portion of the ring-shaped optical waveguide. The heat spreader fin is thermally connected to the ring-shaped heater. The heat spreader fin is electrically isolated from the ring-shaped heater and from the first and second electrical contacts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微環共振器裝置</p>
        <p type="p">103-1:金屬加熱線</p>
        <p type="p">103-2:金屬加熱線</p>
        <p type="p">103-3:金屬加熱線</p>
        <p type="p">103-4:金屬加熱線</p>
        <p type="p">103-5:金屬加熱線</p>
        <p type="p">103-6:金屬加熱線</p>
        <p type="p">103-7:金屬加熱線</p>
        <p type="p">105:環形光波導</p>
        <p type="p">105A:全厚度(垂直厚度)外環形區域、外環形區域</p>
        <p type="p">105B:部分厚度(垂直厚度)環形區域、內環形區域</p>
        <p type="p">105C:內部指狀特徵部</p>
        <p type="p">107:中心</p>
        <p type="p">109A:電接觸結構</p>
        <p type="p">109B:電接觸結構</p>
        <p type="p">111:電導體</p>
        <p type="p">113:電導體</p>
        <p type="p">115:匯排流光波導、第一匯排流光波導</p>
        <p type="p">117:抽取光波導、第二匯排流光波導</p>
        <p type="p">118:光學耦合區域</p>
        <p type="p">119:光學耦合區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.JPG" file="ed10025.JPG" height="785px" img-content="tif" inline="yes" orientation="portrait" width="1074px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623642</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121712</doc-number>
          <kind></kind>
          <date>114/06/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/22</main-classification>
        <further-classification edition="202601120260302B">H10W40/25</further-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
        <further-classification edition="202601120260302B">H10W90/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W76/05</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳燕銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁國強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TING, KUO-CHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯亭竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, TING-CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,396</doc-number>
          <date>20241124</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/182,573</doc-number>
          <date>20250417</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR PACAKGE AND METHOD OF FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體封裝包括第一晶粒、至少一個第二晶粒和散熱結構。第一晶粒具有第一接合層。第二晶粒具有第二接合層，其中第二晶粒配置在第一晶粒上，且第二接合層鍵合到第一接合層。散熱結構配置在至少一個第二晶粒的背側表面上，其中散熱結構的熱導率在120W/(m∙K)到10,000 W/(m∙K)範圍內，散熱結構的厚度在5µm到1,500µm範圍內，且散熱結構面向至少一個第二晶粒背側表面的表面面積在10mm&lt;sup&gt;2&lt;/sup&gt;到860 mm&lt;sup&gt;2&lt;/sup&gt;範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package includes a first die, at least one second die and a thermal dissipation structure. The first die has a first bonding layer. The second die has a second bonding layer, wherein the second die is disposed on the first die, and the second bonding layer is bonded to the first bonding layer. The thermal dissipation structure is disposed on a backside surface of the at least one second die, wherein a thermal conductivity of the thermal dissipation structure is in a range of 120 W/(m∙K) to 10,000 W/(m∙K), a thickness of the thermal dissipation structure is in a range of 5µm to 1,500µm, and an area of a surface of the thermal dissipation structure facing the backside surface of the at least one second die is in a range of 10mm&lt;sup&gt;2&lt;/sup&gt; to 860 mm&lt;sup&gt;2&lt;/sup&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:第一晶粒</p>
        <p type="p">104-AS、106-AS:主動表面</p>
        <p type="p">104-BS、106-BS:背側表面</p>
        <p type="p">104A、106A:半導體基板</p>
        <p type="p">104B、106B:重分佈結構</p>
        <p type="p">104B-1、104E、104F-1、106B-1、106D、106E-1、110-1、112、116:介電層</p>
        <p type="p">104B-2、106B-2、110-2:導電元件</p>
        <p type="p">104C:基板穿孔</p>
        <p type="p">104D、106C、114:導電墊</p>
        <p type="p">104F:第一接合層</p>
        <p type="p">104F-2、106E-2:接合墊</p>
        <p type="p">104F-3、106E-3:導電通孔</p>
        <p type="p">106:第二晶粒</p>
        <p type="p">106E:第二接合層</p>
        <p type="p">108:填充層</p>
        <p type="p">110:背側重分佈結構</p>
        <p type="p">120:導電凸塊</p>
        <p type="p">202:第一膜層</p>
        <p type="p">204:第二膜層</p>
        <p type="p">AL1:對準標記</p>
        <p type="p">D1:厚度</p>
        <p type="p">PK1:封裝結構</p>
        <p type="p">TX1:散熱結構</p>
        <p type="p">TX1-S1:表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10030.png" file="d10030.TIF" giffile="ed10030.png" height="757px" img-content="tif" inline="yes" orientation="portrait" width="680px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622648</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121771</doc-number>
          <kind></kind>
          <date>114/06/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G03F9/00</main-classification>
        <further-classification edition="200601120260224B">G01B11/06</further-classification>
        <further-classification edition="200601120260224B">G01B11/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佳哈尼　莎曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAHANI, SAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛瓦拉　托雷斯　勞爾　安德烈斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUEVARA TORRES, RAUL ANDRES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
              <english-address>MX</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查克拉博蒂　德巴米特拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAKRABORTY, DEBAMITRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷茲瓦尼　納拉吉　羅珊娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REZVANI NARAGHI, ROXANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
              <english-address>IR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/658,991</doc-number>
          <date>20240612</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>整合式光學件距離、水平及傾斜感測器</chinese-title>
        <english-title>INTEGRATED OPTICS DISTANCE, LEVELING AND TILT SENSOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之系統及方法使用一整合式光子感測器以判定存在於度量衡區或標記處之傾斜角。該整合式光子感測器使用兩對光柵耦合器，各對具有一發射光柵耦合器及一捕捉光柵耦合器。該等光柵耦合器之位置可固定，其中當該區處之該傾斜角為一正角時，一第一捕捉光柵耦合器將捕捉其成對發射光柵耦合器之一峰值捕捉光值，且當該區處之該傾斜角為一負角時，一第二捕捉光柵耦合器將捕捉其成對發射光柵耦合器之一峰值捕捉光值。在使用此固定組態且知曉將捕捉峰值耦合效率時之該等傾斜角的情況下，使用該兩個捕捉光值來計算一比率。使用此比率來判定一傾斜角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present system(s) and method(s) use an integrated photonic sensor to determine tilt angle present at the metrology region or mark. The integrated photonic sensor uses two pairs of grating couplers, each pair having an emitting grating coupler and a capturing grating coupler. The positions of the grating couplers may be fixed wherea first capturing grating coupler will capture a peak captured light value of its paired emitting grating coupler when the angle of tilt at the region is a positive angle, and a second capturing grating coupler will capture a peak captured light value of its paired emitting grating coupler when the angle of tilt at the region is a negative angle. Using this fixed configuration and knowing the tilt angles at which peak coupling efficiencies would be captured, a ratio is computed using the two captured light values. A tilt angle is determined using this ratio.</p>
      </isu-abst>
      <representative-img>
        <p type="p">30:目標/度量衡目標</p>
        <p type="p">600:系統</p>
        <p type="p">602:基板</p>
        <p type="p">604:輻射感測器</p>
        <p type="p">606:光學組件</p>
        <p type="p">612:輻射源</p>
        <p type="p">621:第一光學路徑</p>
        <p type="p">625:輻射發射器</p>
        <p type="p">635:輻射接收器</p>
        <p type="p">650:聚焦分支</p>
        <p type="p">660:疊對偵測分支</p>
        <p type="p">670:光束分光器</p>
        <p type="p">675:聚焦量測</p>
        <p type="p">677:偵測孔徑</p>
        <p type="p">679:偵測孔徑</p>
        <p type="p">680:對準分支</p>
        <p type="p">681:感測器</p>
        <p type="p">683:感測器</p>
        <p type="p">685:輻射</p>
        <p type="p">690:接物鏡</p>
        <p type="p">FS:聚焦信號</p>
        <p type="p">O:物件</p>
        <p type="p">O1':共軛平面</p>
        <p type="p">O2':共軛平面</p>
        <p type="p">P:光瞳平面</p>
        <p type="p">PRO:處理器</p>
        <p type="p">S1:第一強度</p>
        <p type="p">S2:第二強度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10037.JPG" file="ed10037.JPG" height="684px" img-content="tif" inline="yes" orientation="portrait" width="872px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623507</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121773</doc-number>
          <kind></kind>
          <date>114/06/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="202601120260302B">H10P90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耶爾德勒姆　歐克戴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YILDIRIM, OKTAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　哈倫　理查　喬哈奈　法蘭西卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN HAREN, RICHARD JOHANNES FRANCISCUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩特羅夫　安德烈　葉夫根尼耶維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETROV, ANDREI YEVGENYEVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　迪傑克　里昂　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DIJK, LEON PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　豪　保羅斯　亞伯特斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN HAL, PAULUS ALBERTUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克佛耶茲　安卓尼斯　亨瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOEVOETS, ADRIANUS HENDRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧塞姆斯　達米安　尤里埃爾　波亞茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUSSEMS, DAMIEN URIEL BOAZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比奇曼　阿爾罕　約翰尼斯　安敦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEUKMAN, ARJAN JOHANNES ANTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡駑戈帕蘭　斯安　帕拉雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENUGOPALAN, SYAM PARAYIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛滕貝格　海拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOGTENBERG, HELLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古特　路易絲　卡琳娜　勞里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOUTEUX, LOUISE KARINA LAURIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24183125.4</doc-number>
          <date>20240619</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>歐洲專利局</country>
          <doc-number>24217687.3</doc-number>
          <date>20241205</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>歐洲專利局</country>
          <doc-number>25161915.1</doc-number>
          <date>20250305</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶圓至晶圓接合製程</chinese-title>
        <english-title>WAFER-TO-WAFER BONDING PROCESS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於控制一供體基板至一受體基板之接合的方法，該方法包含：處理該供體基板及/或該受體基板之一表面；及將一基板區特定屬性應用於該供體基板及/或該受體基板之該經處理表面以局部地控制一接合波之一演進。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided method for controlling bonding of a donor substrate to an acceptor substrate, the method comprising: treating a surface of the donor and/or acceptor substrate; and applying a substrate region specific property to the treated surface of the donor and/or acceptor substrate to locally control an evolution of a bonding wave.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:供體基板及/或受體基板/基板</p>
        <p type="p">600:基板區/同心基板區</p>
        <p type="p">610:基板區/同心基板區</p>
        <p type="p">620:基板區/同心基板區</p>
        <p type="p">630:基板區/同心基板區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="314px" img-content="tif" inline="yes" orientation="portrait" width="572px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622143</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121825</doc-number>
          <kind></kind>
          <date>114/06/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C08G59/24</main-classification>
        <further-classification edition="200601120260226B">C08L63/00</further-classification>
        <further-classification edition="200601120260226B">G03F7/004</further-classification>
        <further-classification edition="200601120260226B">G03F7/027</further-classification>
        <further-classification edition="200601120260226B">G02B6/12</further-classification>
        <further-classification edition="200601120260226B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田拓実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-115815</doc-number>
          <date>20240719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可穩定獲得光傳輸損失較小之光波導的樹脂組成物；包含該樹脂組成物的樹脂片；包含該樹脂組成物的樹脂組成物套組；包含該樹脂組成物之硬化物的光波導；以及具備該光波導的光電混載基板。一種樹脂組成物，其係包含(A)環氧樹脂、(B)光硬化性樹脂、(C)具有羧基與乙烯性不飽和鍵之樹脂及(D)光聚合起始劑的樹脂組成物，其中在(A)成分、(B)成分及(C)成分之各成分之硬化物中，波長1310nm的折射率差為0.07以上之成分的含量，在將(A)成分、(B)成分及(C)成分的合計設為100質量%時係未達10質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光波導</p>
        <p type="p">100:芯層</p>
        <p type="p">100A:芯層的入射側端</p>
        <p type="p">100B:芯層的出射側端</p>
        <p type="p">100I:芯層與包覆層的界面</p>
        <p type="p">200:包覆層</p>
        <p type="p">300:基材</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="613px" img-content="tif" inline="yes" orientation="portrait" width="715px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622638</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121964</doc-number>
          <kind></kind>
          <date>114/06/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G03F7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅德維德亞娃　瑪利亞　維亞齊莎拉維維娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDVEDYEVA, MARIYA VYACHESLAVIVNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
              <english-address>UA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　力司特　雅得安　喬漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN LEEST, ADRIAAN JOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　斯瓦特　塞伯　特克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE ZWART, SIEBE TJERK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥提森　賽門　吉司伯　喬瑟佛思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATHIJSSEN, SIMON GIJSBERT JOSEPHUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾培傑尼　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPEGGIANI, FILIPPO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡貝爾　彼得　安東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAPEL, PIETER ANTHON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24184990.0</doc-number>
          <date>20240627</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>判定影像中之共同點的方法、裝置及電腦程式</chinese-title>
        <english-title>METHOD OF DETERMINING A COMMON POINT IN IMAGES, APPARATUS AND COMPUTER PROGRAM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種判定至少一對目標影像中之一正常目標影像及互補目標影像中之各者之一共同點的方法。該方法包含：獲得該至少一對目標影像，該至少一對目標影像中之各對目標影像包含一正常目標影像及一互補目標影像，該正常目標影像係從自一基板上之一目標繞射的一對對應繞射階中之一正常繞射階獲得的，且該互補目標影像係自該對對應繞射階中之一互補繞射階獲得的；及藉由使各該目標影像參考至少一個特殊應用參考影像來判定該至少一對目標影像中之各目標影像的該共同點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method of determining a common point for each of a normal target image and complementary target image of at least one pair of target images. The method comprises obtaining the at least one pair of target images, each pair of target images of the at least one pair of target images comprising a normal target image and a complementary target image, the normal target image being obtained from a normal diffraction order of a pair of corresponding diffraction orders as diffracted from a target on a substrate and the complementary target image being obtained from a complementary diffraction order of the pair of corresponding diffraction orders; and determining the common point for each target image of the at least one pair of target images by referring each the target image to at least one application specific reference image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">AL:對準步驟</p>
        <p type="p">AV:平均步驟</p>
        <p type="p">Im&lt;sub&gt;1C&lt;/sub&gt;:互補影像</p>
        <p type="p">Im&lt;sub&gt;1N&lt;/sub&gt;:正常影像</p>
        <p type="p">Im&lt;sub&gt;2C&lt;/sub&gt;:互補影像</p>
        <p type="p">Im&lt;sub&gt;2N&lt;/sub&gt;:正常影像</p>
        <p type="p">Im&lt;sub&gt;3C&lt;/sub&gt;:互補影像</p>
        <p type="p">Im&lt;sub&gt;3N&lt;/sub&gt;:正常影像</p>
        <p type="p">Im&lt;sub&gt;avC&lt;/sub&gt;:互補平均影像</p>
        <p type="p">Im&lt;sub&gt;avN&lt;/sub&gt;:正常平均影像</p>
        <p type="p">Im&lt;sub&gt;PTC&lt;/sub&gt;:互補臨時模板</p>
        <p type="p">Im&lt;sub&gt;PTN&lt;/sub&gt;:正常臨時模板</p>
        <p type="p">IM&lt;sub&gt;ref&lt;/sub&gt;:平均影像</p>
        <p type="p">Im&lt;sub&gt;refC&lt;/sub&gt;:參考圖像</p>
        <p type="p">Im&lt;sub&gt;refN&lt;/sub&gt;:參考影像</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="707px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622160</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121965</doc-number>
          <kind></kind>
          <date>114/06/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08J5/18</main-classification>
        <further-classification edition="200601120260225B">C08L1/10</further-classification>
        <further-classification edition="200601120260225B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊士曼化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EASTMAN CHEMICAL COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　釗明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, THAUMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐納森　麥可　尤金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONELSON, MICHAEL EUGENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張倩倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QIANQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/662,211</doc-number>
          <date>20240620</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有+C板光學性質之纖維素酯膜</chinese-title>
        <english-title>CELLULOSE ESTER FILMS HAVING +C PLATE OPTICAL PROPERTIES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案揭示包含具有低羥基含量之纖維素酯及某些含羥基添加劑之組合物及膜。此等膜展現正C (+C)板特性，此使該等膜特別適用於光學應用，諸如在液晶顯示器(LCD)及有機LED (OLED)顯示器中作為保護膜及補償膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses compositions and films comprising cellulose esters having low hydroxyl content and certain hydroxy containing additives. These films exhibit positive C (+C) plate behavior, which make them particularly suitable for use in optical applications, such as in liquid crystal displays (LCD) and organic LED (OLED) displays as protective and compensation films.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622161</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114121966</doc-number>
          <kind></kind>
          <date>114/06/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C08J5/18</main-classification>
        <further-classification edition="200601120260224B">C08L1/14</further-classification>
        <further-classification edition="200601120260224B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊士曼化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EASTMAN CHEMICAL COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張倩倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QIANQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張忠博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHONGBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃夢菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MENGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/662,233</doc-number>
          <date>20240620</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有改良之波長色散之光學補償膜</chinese-title>
        <english-title>OPTICAL COMPENSATION FILMS WITH IMPROVED WAVELENGTH DISPERSION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學補償膜廣泛用於平板顯示器中。光學補償膜之延遲之波長色散為影響顯示器之性能的關鍵參數之一。始終需要具有反向色散之補償膜，其延遲隨著光波長增加而增加。然而，當前補償膜不能完全滿足反向色散之要求，尤其對於長波長光(λ＞ 550 nm)而言。本申請案揭示包含樹脂及添加劑之補償膜，其具有選擇性光吸收性質及對於長波長光之良好反向色散。該等補償膜展現&lt;img align="absmiddle" height="52px" width="125px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Optical compensation films are widely adopted in flat panel displays. Wavelength dispersion of retardation of optical compensation films is one of the critical parameters impacting the performance of displays. Compensation films with reverse dispersion, of which the retardation increases along with light wavelength increasing, is always desired. However, current compensation films can’t fully meet the requirement of reverse dispersion, especially for long wavelength light (λ＞ 550 nm). This application discloses compensation films comprising resins and additives with selective light absorption properties with good reverse dispersion for long wavelength light. The compensation films exhibit an &lt;img align="absmiddle" height="52px" width="125px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621715</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122019</doc-number>
          <kind></kind>
          <date>114/06/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120260302B">A61K35/747</main-classification>
        <further-classification edition="200601120260302B">A61P1/00</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
        <further-classification edition="200601120260302B">A61P17/00</further-classification>
        <further-classification edition="201601120260302B">A23L33/135</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千濱良太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIHAMA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹中悠人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKENAKA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤勇紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YUUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-159231</doc-number>
          <date>20240913</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含乳酸菌之組成物、飲食品及醫藥品</chinese-title>
        <english-title>COMPOSITIONS, FOODS, BEVERAGES, AND MEDICINES CONTAINING LACTIC ACID BACTERIA</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種使用於用來活化漿細胞樣樹狀細胞(pDC)等用途之組成物，其係包含沙克乳酸桿菌(Lactobacillus sakei)MG-LAB279株(寄存編號：NITE BP-03645)及/或其菌體成分作為有效成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition for use in activating plasmacytoid dendritic cells (pDCs) and the like, comprising Lactobacillus sakei MG-LAB279 strain (accession number: NITE BP-03645) and/or its bacterial components as active ingredients.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621652</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122025</doc-number>
          <kind></kind>
          <date>114/06/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61C7/28</main-classification>
        <further-classification edition="200601120260302B">A61C7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商數珍科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEARL DIGITAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹　恆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱永紳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, YUNG SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林桓毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/659,257</doc-number>
          <date>20240612</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具鎖定蓋的牙齒矯正裝置之方法與裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PROVIDING ORTHODONTIC APPLIANCE WITH A LIGATING COVER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種牙齒矯正托槽組件包含基座托槽與鎖定蓋。該鎖定蓋設有可與基座托槽之導軌滑動嚙合的夾具、帶凸塊結構的限位槽(用於卡合基座托槽上的扣部)，以及用於固定弓絲的弓絲槽。部分實施例中，鎖定蓋之栓部可與燕尾槽中的凸脊嚙合以實現二次鎖定。夾持部或接收孔設計便於工具輔助拆卸。此結構確保弓絲被穩固固定，並具備使用者友善的操作特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An orthodontic bracket assembly includes a base bracket and a ligating cover. The cover includes clips for sliding engagement with rails, a retention channel with a bump to engage a button on the base bracket, and a ligating ledge for retaining an archwire. In some embodiments, a ligating latch engages a ridge in a dovetail channel for secondary locking. Grips or receiving holes allow tool-assisted removal. The design ensures secure archwire retention and user-friendly operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基座托槽</p>
        <p type="p">20:鎖定蓋</p>
        <p type="p">30:弓絲</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="355px" img-content="tif" inline="yes" orientation="portrait" width="262px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623479</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122156</doc-number>
          <kind></kind>
          <date>114/06/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260223B">H10H29/03</main-classification>
        <further-classification edition="202501120260223B">H10H29/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克朗寧　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRONIN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪安戴利　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ANDREA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/660,143</doc-number>
          <date>20240614</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>微型ＬＥＤ晶片之自動化巨量轉移及接合系統</chinese-title>
        <english-title>AN AUTOMATED MASS TRANSFERRING AND BONDING OF MICROLED CHIPS SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種微型LED晶片之自動化巨量轉移及接合(mass transferring and bonding, MTB)系統，其中：一MTB品質模組測量來自一第一參數群組的一個參數，並計算來自一第二參數群組的一參數，以協助控制該MTB程序；一MTB處理模組輸入來自該第二群組的該參數及來自一第三群組的另一參數以控制該程序；一MTB後檢驗模組測量來自一第四群組的一個參數，其判定來自所執行的該第一群組及該第二群組的該等參數的該執行；一MTB歷史模組基於該第一群組、該第二群組、該第三群組、及該第四群組來計算複數個群組參數；且一MTB整合模組基於來自該MTB歷史模組的該等結果來更新該MTB處理模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an automated mass transferring and bonding (MTB) of micro LED chips system in which an MTB quality module measures one parameter from a first group of parameters and calculates a parameter from a second group of parameters to assist controlling the MTB process, an MTB process module inputs the parameter from the second group and another parameter from a third group to control the process, an MTB post-inspection module measures one parameter from a fourth group that determines the performance of the parameters from the first and second group performed, an MTB historical module calculates a plurality of group parameters based upon the first, second, third, and fourth groups, and an MTB integration module to update the MTB process module based on the results from the MTB historical module.&lt;b&gt;&lt;u&gt;  &lt;/u&gt;&lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第三方PVD AI網路</p>
        <p type="p">104:通訊介面</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:基礎模組</p>
        <p type="p">110:MTB品質模組；品質模組</p>
        <p type="p">112:MTB處理模組；處理模組；模組</p>
        <p type="p">114:MTB後檢驗模組；後檢驗模組；模組</p>
        <p type="p">116:歷史模組；MTB歷史模組</p>
        <p type="p">118:整合模組；MTB整合模組</p>
        <p type="p">120:MTB品質資料庫；品質資料庫</p>
        <p type="p">122:MTB程序資料庫；程序資料庫</p>
        <p type="p">124:網路資料庫；MTB網路資料庫</p>
        <p type="p">126:雲端</p>
        <p type="p">128:預處理MTB設備；設備</p>
        <p type="p">130:通訊介面</p>
        <p type="p">132:記憶體</p>
        <p type="p">134:預處理MTB設備AI模組；預處理MTB AI模組</p>
        <p type="p">136:預處理MTB設備資料庫</p>
        <p type="p">138:處理MTB設備；處理設備；MTB設備；MTB處理設備</p>
        <p type="p">140:通訊介面</p>
        <p type="p">142:記憶體</p>
        <p type="p">144:處理MTB設備AI模組</p>
        <p type="p">146:處理MTB設備資料庫</p>
        <p type="p">148:後處理MTB設備；後MTB處理設備</p>
        <p type="p">150:通訊介面</p>
        <p type="p">152:記憶體</p>
        <p type="p">154:後處理MTB設備AI模組</p>
        <p type="p">156:後處理MTB設備資料庫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="529px" img-content="tif" inline="yes" orientation="portrait" width="781px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623470</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122157</doc-number>
          <kind></kind>
          <date>114/06/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10H20/01</main-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克朗寧　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRONIN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪安戴利　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ANDREA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/660,169</doc-number>
          <date>20240614</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>微型ＬＥＤ晶片之自動化快速熱處理系統</chinese-title>
        <english-title>AN AUTOMATED RAPID THERMAL PROCESSING OF MICROLED CHIPS SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種微型LED晶片之快速熱處理(rapid thermal processing, RTP)系統，其中：一RTP品質模組測量來自一第一參數群組的一個參數，並計算來自一第二參數群組的一參數，以協助控制該RTP程序；一RTP處理模組輸入來自該第二群組的該參數及來自一第三群組的另一參數以控制該程序；一RTP後檢驗模組測量來自一第四群組的一個參數，其判定來自所執行的該第一群組及該第二群組的該等參數的該執行；一RTP歷史模組基於該第一群組、該第二群組、該第三群組、及該第四群組來計算複數個群組參數；且一RTP整合模組基於來自該RTP歷史模組的該等結果來更新該RTP處理模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a rapid thermal processing (RTP) of micro LED chips system in which an RTP quality module measures one parameter from a first group of parameters and calculates a parameter from a second group of parameters to assist in controlling the RTP process, an RTP process module inputs the parameter from the second group and another parameter from a third group to control the process, an RTP post-inspection module measures one parameter from a fourth group that determines the performance of the parameters from the first and second group performed, an RTP historical module calculates a plurality of group parameters based upon the first, second, third, and fourth groups, and an RTP integration module to update the RTP process module based on the results from the RTP historical module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第三方RTP AI網路</p>
        <p type="p">104:通訊介面</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:基礎模組</p>
        <p type="p">110:RTP檢驗模組</p>
        <p type="p">112:RTP處理模組</p>
        <p type="p">114:RTP後處理模組</p>
        <p type="p">116:RTP歷史模組；歷史模組</p>
        <p type="p">118:RTP整合模組</p>
        <p type="p">120:RTP檢驗資料庫</p>
        <p type="p">122:RTP程序資料庫</p>
        <p type="p">124:RTP網路資料庫；網路資料庫</p>
        <p type="p">126:雲端</p>
        <p type="p">128:預處理RTP設備</p>
        <p type="p">130:通訊介面</p>
        <p type="p">132:記憶體</p>
        <p type="p">134:預處理RTP設備AI模組</p>
        <p type="p">136:預處理RTP設備資料庫</p>
        <p type="p">138:處理RTP設備</p>
        <p type="p">140:通訊介面</p>
        <p type="p">142:記憶體</p>
        <p type="p">144:處理RTP設備AI模組</p>
        <p type="p">146:處理RTP設備資料庫</p>
        <p type="p">148:後處理RTP設備</p>
        <p type="p">150:通訊介面</p>
        <p type="p">152:記憶體</p>
        <p type="p">154:後處理RTP設備AI模組</p>
        <p type="p">156:後處理RTP設備資料庫；RTP後處理資料庫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="841px" img-content="tif" inline="yes" orientation="portrait" width="754px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622704</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122167</doc-number>
          <kind></kind>
          <date>114/06/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250916B">G06F3/01</main-classification>
        <further-classification edition="200601120250916B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王敏益</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MIN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元嫄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YUAN-YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳皇因</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUANG-YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周松豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, SUNG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李培睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PEI-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,133</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>互動裝置、功能元件、以及互動裝置的控制方法</chinese-title>
        <english-title>INTERACTIVE DEVICE, FUNCTIONAL ELEMENT AND CONTROL METHOD OF INTERACTIVE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種互動裝置、功能元件、以及互動裝置的控制方法，互動裝置包括一承載座、一第一功能元件以及一第二功能元件。承載座具有相對應的一承載面及一底面並於兩者的間形成一容置空間，且該表面更包含複數個安裝區。第一功能元件具有一第一表面且可分離地設置於該複數個安裝區中的一者。第二功能元件具有一第二表面且可分離地設置於該複數個安裝區中的另至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides an interactive device, a functional element, and a control method of the interactive device. The interactive device includes a supporting seat, a first functional element and a second functional element. The supporting seat has a supporting surface and a bottom surface corresponding to the supporting surface，and a receiving space is formed between the supporting surface and the bottom surface. The surface further includes a plurality of installation areas. The first functional element has a first surface and is detachably disposed in one of the installation areas. The second functional element has a second surface and is detachably disposed in at least another one of the installation areas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一功能元件</p>
        <p type="p">2:第二功能元件</p>
        <p type="p">3:第三功能元件</p>
        <p type="p">4:第四功能元件</p>
        <p type="p">5:第五功能元件</p>
        <p type="p">6:第六功能元件</p>
        <p type="p">7:承載座</p>
        <p type="p">71:承載面</p>
        <p type="p">73:固定部</p>
        <p type="p">74:電性介面</p>
        <p type="p">R1:第一安裝區</p>
        <p type="p">R2:第二安裝區</p>
        <p type="p">R3:第三安裝區</p>
        <p type="p">R4:第四安裝區</p>
        <p type="p">R5:第五安裝區</p>
        <p type="p">R6:第六安裝區</p>
        <p type="p">R7:第七安裝區</p>
        <p type="p">R8:第八安裝區</p>
        <p type="p">R9:第九安裝區</p>
        <p type="p">R10:第十安裝區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.png" file="d10027.TIF" giffile="ed10027.png" height="963px" img-content="tif" inline="yes" orientation="portrait" width="739px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623042</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122193</doc-number>
          <kind></kind>
          <date>114/06/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="200601120260302B">H05H1/36</further-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇藤敦司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTO, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小岩真悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIWA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中一光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, IKKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永海幸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMI, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-102340</doc-number>
          <date>20240625</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠於電漿處理中抑制基板之表面電位衰減之技術。本發明之電漿處理裝置具備在靜電吸盤內配置於基板支持面之下方之第1電極、第1開關、經由第1開關電性連接於第1電極之第1吸盤電源、電性連接於第1電極之第1電壓脈衝產生器、及控制部，且控制部構成為以於對基板支持面上之基板進行電漿處理期間，對第1電極交替施加第1基準電壓與第1脈衝電壓之方式控制第1開關、第1吸盤電源及第1電壓脈衝產生器，第1基準電壓具有第1吸盤電壓位準，第1脈衝電壓具有第1脈衝電壓位準，第1脈衝電壓位準之絕對值大於第1吸盤電壓位準之絕對值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">2:控制部</p>
        <p type="p">2a:電腦</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通訊介面</p>
        <p type="p">10:腔室</p>
        <p type="p">10a:側壁</p>
        <p type="p">10e:氣體排出口</p>
        <p type="p">10s:電漿處理空間</p>
        <p type="p">11:基板支持部</p>
        <p type="p">13:簇射頭</p>
        <p type="p">13a:氣體供給口</p>
        <p type="p">13b:氣體擴散室</p>
        <p type="p">13c:氣體導入口</p>
        <p type="p">20:氣體供給部</p>
        <p type="p">21:氣體源</p>
        <p type="p">22:流量控制器</p>
        <p type="p">30:電源</p>
        <p type="p">31:RF電源</p>
        <p type="p">31a:第1RF產生部</p>
        <p type="p">31b:第2RF產生部</p>
        <p type="p">32:DC電源</p>
        <p type="p">32a:第1DC產生部</p>
        <p type="p">32b:第2DC產生部</p>
        <p type="p">40:排氣系統</p>
        <p type="p">111:本體部</p>
        <p type="p">111a:中央區域</p>
        <p type="p">111b:環狀區域</p>
        <p type="p">112:環組件</p>
        <p type="p">1110:基台</p>
        <p type="p">1110a:流路</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">1111a:陶瓷構件</p>
        <p type="p">1111b:靜電電極</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="789px" img-content="tif" inline="yes" orientation="portrait" width="1083px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622133</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122220</doc-number>
          <kind></kind>
          <date>114/06/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C08F214/26</main-classification>
        <further-classification edition="200601120260224B">C08F214/28</further-classification>
        <further-classification edition="200601120260224B">C08F214/22</further-classification>
        <further-classification edition="200601120260224B">C08F210/06</further-classification>
        <further-classification edition="200601120260224B">C08F2/44</further-classification>
        <further-classification edition="200601120260224B">C08L27/12</further-classification>
        <further-classification edition="200601120260224B">C08J3/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎浩輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBASAKI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳谷碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGIYA, AOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田武志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-098618</doc-number>
          <date>20240619</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含氟聚合物之製造方法、固形物、交聯物</chinese-title>
        <english-title>FLUORINE-CONTAINING POLYMER PRODUCTION METHOD, SOLID MATTER, AND CROSS-LINKED PRODUCT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種含氟聚合物之製造方法，係於水性介質存在且具有氟原子之乳化劑實質上不存在的條件下，在式(X)所示化合物及聚合引發劑存在下，將單體1與單體2聚合來製造不具熔點之含氟聚合物，其中該單體1具有氟原子，該單體2係與單體1不同種類之單體且具有與碳原子鍵結之氫原子。&lt;br/&gt;  C(X&lt;sup&gt;1&lt;/sup&gt;)(X&lt;sup&gt;2&lt;/sup&gt;)=C(X&lt;sup&gt;3&lt;/sup&gt;)CONH-R-Z　　(X)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623383</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122386</doc-number>
          <kind></kind>
          <date>114/06/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/01</main-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YUNG-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳稚軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIH-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李振銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHEN-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳於貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-BEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,783</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/183,645</doc-number>
          <date>20250418</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及製造半導體裝置的方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURES AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種製造半導體裝置的方法，包括：在基板上形成第一主動區和第二主動區；在第一主動區和第二主動區之間沉積隔離結構；跨越第一主動區和第二主動區形成閘極結構；形成溝槽，將閘極結構分為第一段以及第二段；在溝槽中形成介電部件；減薄基板以及隔離結構以暴露介電部件的底表面；選擇性地去除介電部件的表面層以形成氣隙；以及沉積密封層以覆蓋氣隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of fabricating a semiconductor device includes forming a first active region and a second active region over a substrate, depositing an isolation structure between the first and second active regions, forming a gate structure across the first active region and the second active region, forming a trench dividing the gate structure into a first segment and a second segment, depositing a dielectric feature in the trench, thinning the substrate and the isolation structure to expose a bottom surface of the dielectric feature, selectively removing a surface layer of the dielectric feature to form an air gap, and depositing a seal layer capping the air gap.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:結構/裝置</p>
        <p type="p">108:通道層</p>
        <p type="p">112:主動區</p>
        <p type="p">114:隔離結構</p>
        <p type="p">144:介電層</p>
        <p type="p">146:電極層</p>
        <p type="p">152:金屬層</p>
        <p type="p">154:蓋層</p>
        <p type="p">156:遮罩層</p>
        <p type="p">157:填充層</p>
        <p type="p">158:介電層/CMG結構/閘極切割結構</p>
        <p type="p">164:ILD層</p>
        <p type="p">168:間隙/氣隙</p>
        <p type="p">176:密封層</p>
        <p type="p">178:互連層</p>
        <p type="p">180:互連層</p>
        <p type="p">108B:基底</p>
        <p type="p">112a:主動區</p>
        <p type="p">112b:主動區</p>
        <p type="p">112c:主動區</p>
        <p type="p">112d:主動區</p>
        <p type="p">142c:金屬閘極堆疊</p>
        <p type="p">144a:界面層</p>
        <p type="p">144b:介電層</p>
        <p type="p">150c:閘極結構/第一段</p>
        <p type="p">150e:閘極結構/第二段</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10036.bmp" file="ed10036.bmp" height="749px" img-content="tif" inline="yes" orientation="portrait" width="1029px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622310</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122416</doc-number>
          <kind></kind>
          <date>114/06/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">D03D13/00</main-classification>
        <further-classification edition="202101120260225B">D03D15/267</further-classification>
        <further-classification edition="200601120260225B">D02G1/02</further-classification>
        <further-classification edition="201901120260225B">B32B7/028</further-classification>
        <further-classification edition="200601120260225B">C03C13/00</further-classification>
        <further-classification edition="200601120260225B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東紡績股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO BOSEKI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇佐見宙樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USAMI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漆崎優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>URUSHIZAKI, MASARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-139636</doc-number>
          <date>20240821</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>玻璃布、預浸體及印刷配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供織造後即使經過加熱步驟也不產生縱筋之玻璃布。  &lt;br/&gt;　　其解決方法為，本發明之玻璃布為將由複數根的玻璃纖絲所成之玻璃纖維作為經紗及緯紗所構成之玻璃布，前述經紗的熱收縮率之最大值與最小值之差為0.19%以下之範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622187</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122444</doc-number>
          <kind></kind>
          <date>114/06/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C09D5/00</main-classification>
        <further-classification edition="200601120260224B">C09D129/04</further-classification>
        <further-classification edition="200601120260224B">C09D163/00</further-classification>
        <further-classification edition="200601120260224B">C09D133/02</further-classification>
        <further-classification edition="200601120260224B">C09D139/00</further-classification>
        <further-classification edition="200601120260224B">B05D1/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>先崎尊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SENZAKI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森莉紗子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, RISAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-097861</doc-number>
          <date>20240618</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>底漆組成物、積層體及積層體之製造方法</chinese-title>
        <english-title>PRIMER COMPOSITION, LAMINATE, AND METHOD FOR PRODUCING LAMINATE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種無關於基板之種類，可提高基板與由感光性組成物的硬化物所成之硬化物層之間的密著性之底漆組成物、具備源自該底漆組成物的底漆層之積層體及其製造方法。  &lt;br/&gt;　　解決手段為一種底漆組成物，其包含基材成分(A)、化合物(B)與溶劑(S)，基材成分(A)包含樹脂(A1)及/或聚合性化合物(A2)，聚合性化合物(A2)為可藉由自由基聚合以外的其他聚合機制進行聚合之化合物，化合物(B)具有可藉由與感光性組成物中的光硬化性化合物(a)中的含乙烯性不飽和雙鍵的基之反應能形成共價鍵之官能基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622204</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122451</doc-number>
          <kind></kind>
          <date>114/06/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K3/14</main-classification>
        <further-classification edition="200601120260302B">C09G1/02</further-classification>
        <further-classification edition="201201120260302B">B24B37/00</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛蘭斯特倫　吉米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRANSTROM, JIMMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紐曼　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEWMAN, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/698,513</doc-number>
          <date>20240924</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化學機械平坦化之系統以及方法</chinese-title>
        <english-title>A SYSTEM AND A METHOD FOR CHEMICAL MECHANICAL PLANARIZATION OF A-SI AND SIO2</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供化學機械平坦化非晶矽和二氧化矽基板之系統以及方法。拋光組合物呈酸性，且包含在拋光組合物的氮原子上含有雜原子取代基的嗎啉化合物和研磨劑。拋光組合物非選擇性地去除非晶矽和二氧化矽基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods are provided for chemical mechanical planarization a-Si and SiO&lt;sub&gt;2&lt;/sub&gt; substrates. The polishing composition is acidic and includes a morpholine compound including a heteroatom substituent at a nitrogen atom of the morpholine compound, and an abrasive. The polishing composition non-selectively removes both a-Si and SiO&lt;sub&gt;2&lt;/sub&gt;.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:化學機械平坦化系統</p>
        <p type="p">102:研磨平台</p>
        <p type="p">104:拋光墊</p>
        <p type="p">106:晶圓支撐架</p>
        <p type="p">108:供給系統</p>
        <p type="p">110:拋光組合物</p>
        <p type="p">112:第一旋轉軸</p>
        <p type="p">114:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="705px" img-content="tif" inline="yes" orientation="portrait" width="616px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623318</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122526</doc-number>
          <kind></kind>
          <date>114/06/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">H05K1/02</main-classification>
        <further-classification edition="200601120260226B">H05K1/03</further-classification>
        <further-classification edition="200601120260226B">H05K3/02</further-classification>
        <further-classification edition="200601120260226B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商青井電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOI ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤貴章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高田直希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林彥丞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134611</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>配線基板及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]使配線基板的性能提升。[解決手段]一種配線基板SUB1，其具有：陶瓷基板10，其具備上表面10t及下表面10b；以及導體圖案20A，其形成於陶瓷基板10的上表面10t上。導體圖案20A包含：基底金屬層21，其形成於陶瓷基板10的上表面10t；以及金屬層22，其以覆蓋基底金屬層21的整體之方式形成於陶瓷基板10的上表面10t上。基底金屬層21除了銅及銀以外，包含鈦及鉻中至少一種。金屬層22包含銅作為主成分，並且金屬層22所包含之銀的重量比小於基底金屬層21所包含之銀的重量比。基底金屬層21的側面21s被金屬層22覆蓋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:陶瓷基板</p>
        <p type="p">10b:下表面(表面)</p>
        <p type="p">10t:上表面(表面)</p>
        <p type="p">20,20A:導體圖案</p>
        <p type="p">21:基底金屬層</p>
        <p type="p">21s:側面</p>
        <p type="p">22:金屬層</p>
        <p type="p">SUB1:配線基板</p>
        <p type="p">T21,T22:厚度</p>
        <p type="p">W22F:寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="430px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622632</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122621</doc-number>
          <kind></kind>
          <date>114/06/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">G03F7/004</main-classification>
        <further-classification edition="200601120260225B">G03F7/027</further-classification>
        <further-classification edition="200601120260225B">G03F7/075</further-classification>
        <further-classification edition="200601120260225B">C08K5/5465</further-classification>
        <further-classification edition="200601120260225B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増田直彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, NAOAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡出翔太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKADE, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-102130</doc-number>
          <date>20240625</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>感光性樹脂組成物、感光性元件、印刷線路板及印刷線路板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之永久抗蝕劑用之感光性樹脂組成物包含（A）酸改質含乙烯基樹脂、（B）光聚合性化合物、（C）光聚合起始劑及（D）含異氰酸酯基矽烷化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感光性元件</p>
        <p type="p">10:支撐膜</p>
        <p type="p">20:感光層</p>
        <p type="p">30:保護膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="509px" img-content="tif" inline="yes" orientation="portrait" width="810px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623558</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122627</doc-number>
          <kind></kind>
          <date>114/06/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="202601120260302B">H10P72/76</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙瓦拉尼　卡皮爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWLANI, KAPIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗蘭森　保羅　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRANZEN, PAUL M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/660,967</doc-number>
          <date>20240617</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有晶圓定心能力的轉動分度器</chinese-title>
        <english-title>ROTATIONAL INDEXERS WITH WAFER CENTERING CAPABILITY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供轉動分度器，其允許在多站腔室內與各晶圓基座與基座之間的轉移操作相關地執行逐個晶圓的置中。一個此轉動分度器具有轉動中心軸，該轉動中心軸可沿著一或更多橫向方向移動以提供晶圓置中能力；具有橫向移動能力的密封配置是提供用於此實行例。另一此轉動分度器使用該分度器的晶圓支撐件處的額外轉動能力，結合在分度器的晶圓支撐件上的晶圓的刻意偏心放置而提供晶圓置中能力。還描述了其他轉動分度器，其中晶圓支撐件能夠從轉動分度器的中心軸徑向向內或向外移動，以執行晶圓置中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Rotational indexers are provided that allow for wafer-by-wafer centering to be performed in association with each wafer pedestal-to-pedestal transfer operation within a multi-station chamber. One such rotational indexer has a rotational center axis that is movable along one or more lateral directions in order to provide wafer centering capability; sealing arrangements with lateral movement capability are provided for such implementations. Another such rotational indexer uses additional rotational capability at the wafer supports of the indexer, in combination with deliberate off-center placement of the wafers on the wafer supports of the indexer, to provide wafer centering capability. Other rotational indexers in which the wafer supports are able to be moved radially inward or outward from the center axis of the rotational indexer in order to perform wafer centering are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5102:腔室</p>
        <p type="p">5103:轉動分度器</p>
        <p type="p">5108:基座</p>
        <p type="p">5112:升降銷</p>
        <p type="p">5126:影像感測器</p>
        <p type="p">5128:分度器臂</p>
        <p type="p">5132:晶圓支撐件</p>
        <p type="p">5138:第一軸</p>
        <p type="p">5144:晶圓</p>
        <p type="p">5199:視埠或窗口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10066.JPG" file="ed10066.JPG" height="735px" img-content="tif" inline="yes" orientation="portrait" width="914px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622344</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122731</doc-number>
          <kind></kind>
          <date>114/06/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250801B">E04F15/02</main-classification>
        <further-classification edition="200601120250801B">E04F15/08</further-classification>
        <further-classification edition="200601120250801B">E04G9/10</further-classification>
        <further-classification edition="200601120250801B">E04B1/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白明正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, MING CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白朝昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, CHAO SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白明正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAI, MING CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳豐裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113145842</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>中空浮動隔音板及其層板結構</chinese-title>
        <english-title>HOLLOW FLOATING SOUNDPROOF BOARD AND ITS PANEL STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係有關於一種中空浮動隔音板及其層板結構，其主要在一基板的第一端面往一方向排列設置多數個中空凹部，該些中空凹部在第二端面形成凸部，並讓二相鄰凸部間形成空間區域，如此，以形成一中空浮動隔音板，進而讓該隔音板能運用在樓地板、層板的製作，能在至少一隔音板的搭配組合下配置外部包覆水泥砂漿層；藉此，讓層板結構透過中空室的設計，能具備有隔音、隔熱的效果，且該隔音板以捆狀包裝，在施作過程能依地形需求而便利裁切，達施工方便的優點與功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a hollow floating soundproof board and its panel structure. It primarily involves a plurality of hollow recesses arranged in one direction on a first surface of a base board. These hollow recesses form protrusions on the second surface, and a space is created between every two adjacent protrusions, thereby forming a hollow floating soundproof board. This soundproof board can be applied in the construction of floor slabs and panels, and may be externally covered with a layer of cement mortar in combination with at least one soundproof board. Through the design of hollow chambers, the panel structure can achieve sound and thermal insulation effects. Furthermore, the soundproof board can be bundled for packaging and easily cut according to the terrain requirements during installation, thus providing the advantages of convenient construction and enhanced performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:隔音板</p>
        <p type="p">11:基板</p>
        <p type="p">111:第一端面</p>
        <p type="p">112:第二端面</p>
        <p type="p">113:中空凹部</p>
        <p type="p">114:凸部</p>
        <p type="p">115:空間區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="670px" img-content="tif" inline="yes" orientation="portrait" width="963px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622152</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122749</doc-number>
          <kind></kind>
          <date>114/06/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08G73/10</main-classification>
        <further-classification edition="200601120260225B">C08L79/08</further-classification>
        <further-classification edition="200601120260225B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白川三千紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAKAWA, MICHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-101603</doc-number>
          <date>20240625</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂組成物、接合體之製造方法、接合體及裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂組成物、接合體之製造方法、接合體、以及裝置之製造方法，其中，上述樹脂組成物用於接合體之製造方法，上述接合體之製造方法包括：準備基板A之步驟，上述基板A具有具備電極之面；聚醯亞胺含有部形成步驟，在基板A的具備上述電極之面上形成聚醯亞胺含有部；準備基板B之步驟，上述基板B具有具備電極之面；及接合步驟，聚醯亞胺含有部形成步驟包括將樹脂組成物適用於基板A的具備上述電極之面之步驟，上述樹脂組成物包含作為聚醯亞胺之樹脂，樹脂的醯亞胺化率為80%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622273</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122766</doc-number>
          <kind></kind>
          <date>114/06/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/30</main-classification>
        <further-classification edition="200601120260302B">C23C16/48</further-classification>
        <further-classification edition="200601120260302B">C23C16/52</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉本真也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIMOTO, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五十嵐誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGARASHI, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, JAEWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒姍蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, SHANRONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉賈拉蒂南　森蒂爾庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJARATHINAM, SENTHILKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆圖薩米　奧姆普拉卡什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUTHUSAMY, OMPRAKASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿瑪拉吉　法蘭克　威爾森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMALRAJ, FRANK WILSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/661,978</doc-number>
          <date>20240620</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>填充間隙之方法及用於填充間隙之處理系統</chinese-title>
        <english-title>METHOD OF FILLING GAP AND PROCESSING SYSTEM FOR SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種填充一間隙或一特徵之方法。該方法可包含：將具備一間隙或一特徵之一基板引入一製程系統中；執行一或多個循環，一循環包含一沉積步驟及一固化步驟，該沉積步驟包含：提供一第1前驅物及一第2前驅物，該第1前驅物包含一含Si前驅物；提供一製程氣體，其中該製程氣體包含Ar、H2、N2、He、O2、NH3或其組合中之至少一者；以及生成一電漿，其中該電漿使該等前驅物及該製程氣體反應以形成一間隙填充流體；該固化步驟包含：使該基板同時曝露於一真空紫外輻射及一環境氣體，藉此固化該間隙填充流體並在該間隙或該特徵中形成一膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of filling a gap or a feature is provided. The method may comprise introducing a substrate provided with a gap of a feature into a process system; executing one or more cycles, a cycle comprising a deposition step and a curing step, the deposition step comprising: providing a 1st precursor and a 2nd precursor, the 1st precursor comprising a Si-containing precursor; providing a process gas, wherein the process gas comprises at least one of Ar, H2, N2, He, O2, NH3, or a combination thereof and; generating a plasma, wherein the plasma causes the precursors and the process gas to react to form a gap filling fluid; the curing step comprising: simultaneously exposing the substrate to a vacuum ultraviolet radiation and to an ambient gas, thereby curing the gap filling fluid and forming a film in the gap or the feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">101:步驟</p>
        <p type="p">102:步驟</p>
        <p type="p">103:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">105:步驟</p>
        <p type="p">107:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="611px" img-content="tif" inline="yes" orientation="portrait" width="906px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622164</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122770</doc-number>
          <kind></kind>
          <date>114/06/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C08J11/08</main-classification>
        <further-classification edition="200601120260223B">B29B17/04</further-classification>
        <further-classification edition="202301120260223B">C02F1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商ＩＦＰ新能源公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IFP ENERGIES NOUVELLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曼西諾　吉安盧卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANCINO, GIANLUCA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>列寧庫格　勒　庫格　戴米恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEINEKUGEL-LE-COCQ, DAMIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷斯　威佛瑞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEISS, WILFRIED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉維斯　佛朗西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVISE, FRANCIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宏　杜克　阮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN-HONG, DUC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古乃任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>法國</country>
          <doc-number>2406674</doc-number>
          <date>20240621</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>藉由以溶劑回收進行溶解、純化及再整合再循環塑膠之方法</chinese-title>
        <english-title>PROCESS FOR RECYCLING PLASTICS BY DISSOLUTION WITH SOLVENT RECOVERY, PURIFICATION AND REINTEGRATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種處理塑膠原料之方法，其包含：  &lt;br/&gt;a)將該塑膠原料溶解於包含再循環溶劑流之溶解溶劑中的步驟，以獲得粗聚合物溶液，  &lt;br/&gt;b)純化該粗聚合物溶液之步驟，隨後  &lt;br/&gt;c)獲得純化熱塑性塑膠流之溶劑-聚合物分離步驟，其包括一連串氣體-液體分離區段，各自產生包含目標熱塑性塑膠之液態流出物及包含溶解溶劑之氣態流出物，  &lt;br/&gt;d)溶解溶劑再循環步驟，其包含：  &lt;br/&gt;d1)對來自第一氣體-液體分離區段之該氣態流出物之至少一部分進行輕組分脫除，及/或  &lt;br/&gt;d2)對來自最後一個氣體-液體分離區段之該氣態流出物之至少一部分進行重組分脫除。  &lt;br/&gt;本發明亦關於一種執行該處理方法之裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a process for treating a plastic feedstock, comprising: &lt;br/&gt;a) a step of dissolving the plastic feedstock in a dissolution solvent comprising a recycled solvent stream, to obtain a crude polymer solution, &lt;br/&gt;b) a step of purifying the crude polymer solution, then &lt;br/&gt;c) a solvent-polymer separation step to obtain a stream of purified thermoplastics, including a series of gas-liquid separation sections, each producing a liquid effluent, which comprises the targeted thermoplastics, and a gaseous effluent which comprises dissolution solvent, &lt;br/&gt;d) a dissolution solvent recycling step, comprising: &lt;br/&gt;d1) topping of at least a fraction of the gaseous effluent from the first gas-liquid separation section, and/or &lt;br/&gt;d2) tailing of at least a fraction of the gaseous effluent from the last gas-liquid separation section. &lt;br/&gt;The present invention also relates to a device for performing said treatment process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:塑膠原料</p>
        <p type="p">2:新鮮溶解溶劑流/新鮮溶劑流</p>
        <p type="p">3:溶解溶劑流</p>
        <p type="p">4:粗聚合物溶液</p>
        <p type="p">5:純化聚合物溶液</p>
        <p type="p">6:雜質</p>
        <p type="p">7:純化熱塑性聚合物流</p>
        <p type="p">8:輕雜質流</p>
        <p type="p">9:脫輕溶劑流</p>
        <p type="p">10:流</p>
        <p type="p">11:經乾燥之溶劑流出物/流</p>
        <p type="p">12:含水流</p>
        <p type="p">13:重雜質流</p>
        <p type="p">14:脫重溶劑流/流</p>
        <p type="p">15:再循環溶劑流</p>
        <p type="p">16:添加劑</p>
        <p type="p">g1:氣態流出物</p>
        <p type="p">g1a:部分流/流</p>
        <p type="p">g1b:部分流/流</p>
        <p type="p">g1c:部分流/流</p>
        <p type="p">g1d:流</p>
        <p type="p">g2:氣態流出物</p>
        <p type="p">g3:氣態流出物</p>
        <p type="p">g3a:部分流/流</p>
        <p type="p">g3b:部分流/流</p>
        <p type="p">g4:氣態流出物</p>
        <p type="p">l1:液態流出物</p>
        <p type="p">l2:液態流出物</p>
        <p type="p">l3:液態流出物</p>
        <p type="p">l4:液態流出物</p>
        <p type="p">(a):溶解步驟/步驟</p>
        <p type="p">(b):純化步驟/步驟</p>
        <p type="p">c):溶劑-聚合物分離步驟/步驟</p>
        <p type="p">(c1):氣體-液體分離區段/第一氣體-液體分離區段</p>
        <p type="p">(c2):氣體-液體分離區段/第二氣體-液體分離區段</p>
        <p type="p">(c3):氣體-液體分離區段/第三氣體-液體分離區段</p>
        <p type="p">(c4):氣體-液體分離區段/第四氣體-液體分離區段/最後一個氣體-液體分離區段</p>
        <p type="p">d):步驟</p>
        <p type="p">(d1):輕組分脫除/輕組分脫除蒸餾塔/輕組分脫除區段</p>
        <p type="p">(d2):重組分脫除/重組分脫除蒸餾塔/重組分脫除區段</p>
        <p type="p">(d'3):另一溶劑-水分離/溶劑-水分離步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="719px" img-content="tif" inline="yes" orientation="portrait" width="734px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622200</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122803</doc-number>
          <kind></kind>
          <date>114/06/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260224B">C09J7/30</main-classification>
        <further-classification edition="200601120260224B">C09J163/00</further-classification>
        <further-classification edition="200601120260224B">B32B7/10</further-classification>
        <further-classification edition="200601120260224B">B32B27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商巴川集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMOEGAWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長拓己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部一智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KAZUTOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栃平順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOCHIHIRA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-099035</doc-number>
          <date>20240619</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子材料用接著組成物、接著片材及積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種包含熱硬化性樹脂之電子材料用接著組成物(13)，前述電子材料用接著組成物所形成之片狀硬化物係以第1相分散於第2相中之相分離狀態存在。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:接著片材</p>
        <p type="p">11:接著片材之上表面</p>
        <p type="p">12:接著片材之下表面</p>
        <p type="p">13:電子材料用接著組成物</p>
        <p type="p">20:積層體</p>
        <p type="p">21:上表面之保護材</p>
        <p type="p">22:下表面之保護材</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="591px" img-content="tif" inline="yes" orientation="portrait" width="742px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622639</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122812</doc-number>
          <kind></kind>
          <date>114/06/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G03F7/20</main-classification>
        <further-classification edition="200601120260224B">G03F9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納伽薩　達摩　拉迪烏斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGASSA DHARMA, RADIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
              <english-address>ID</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜曼　奧澤爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUMAN, OZER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TR</english-country>
              <english-address>TR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯本　馬騰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERBEN, MAARTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡波內　盧多維科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBONE, LUDOVICO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24191167.6</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>判定基準之退化的方法</chinese-title>
        <english-title>METHOD OF DETERMINING DEGRADATION ON A FIDUCIAL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種判定一基準上之一塗層之一退化程度的方法，該方法包含：自該基準之一第一量測集合判定一第一數學模型，該第一量測集合包含該基準之一第一量測區域的量測；自該基準之一第二量測集合判定一第二數學模型，該第二量測集合包含該基準之一第二量測區域的量測，該第二量測區域不同於該第一量測區域；及基於該第一數學模型及該第二數學模型而判定該塗層之一退化程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method of determining a degradation level of a coating on a fiducial, the method comprising: determining a first mathematical model from a first set of measurements of the fiducial, said first set of measurements comprising measurements of a first measurement area of the fiducial; determining a second mathematical model from a second set of measurements of the fiducial, said second set of measurements comprising measurements of a second measurement area of the fiducial, said second measurement area being different to said first measurement area; and determining a degradation level of the coating based on the first mathematical model and the second mathematical model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301:第一量測區域</p>
        <p type="p">302:第二量測區域</p>
        <p type="p">303:基準組件</p>
        <p type="p">304:基準板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="415px" img-content="tif" inline="yes" orientation="portrait" width="652px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622201</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122825</doc-number>
          <kind></kind>
          <date>114/06/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C09J133/04</main-classification>
        <further-classification edition="200601120260225B">C09J11/06</further-classification>
        <further-classification edition="200601120260225B">C08K5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商漢高股份有限及兩合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENKEL AG &amp; CO. KGAA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張未浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEIHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡小龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石征</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅翠銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, CUIRUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/100345</doc-number>
          <date>20240620</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>熱固性黏著劑組合物</chinese-title>
        <english-title>HEAT-CURABLE ADHESIVE COMPOSITION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種熱固性黏著劑組合物，其包含基於該組合物之總重量計：  &lt;br/&gt;(a) (甲基)丙烯酸系單體，  &lt;br/&gt;(b)脂族胺基甲酸酯(甲基)丙烯酸酯低聚物，  &lt;br/&gt;(c) 核-殼橡膠，於該殼中含有丙烯酸系單元；  &lt;br/&gt;(d) 0.1至1.2重量%之具有通式(1)之結構之熱引發劑：  &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;-L&lt;sup&gt;1&lt;/sup&gt;-O-O-L&lt;sup&gt;2&lt;/sup&gt;-R&lt;sup&gt;2&lt;/sup&gt;      (1)  &lt;br/&gt;其中R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;彼此獨立地選自經取代或未經取代之C&lt;sub&gt;6&lt;/sub&gt;-C&lt;sub&gt;18&lt;/sub&gt;芳基及經取代或未經取代之C&lt;sub&gt;5&lt;/sub&gt;-C&lt;sub&gt;18&lt;/sub&gt;環烷基；  &lt;br/&gt;L&lt;sup&gt;1&lt;/sup&gt;及L&lt;sup&gt;2&lt;/sup&gt;彼此獨立地選自羰基、酯鍵、及直鏈或分支鏈C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;10&lt;/sub&gt;伸烷基。  &lt;br/&gt;本發明亦關於該組合物之固化產物，包含該固化產物或利用該組合物黏結之物品及黏結基板之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a heat-curable adhesive composition comprising, based on the total weight of the composition: &lt;br/&gt;(a)a (meth)acrylic monomer, &lt;br/&gt;(b)an aliphatic urethane (meth)acrylate oligomer, &lt;br/&gt;(c)a core-shell rubber containing an acrylic unit in the shell; &lt;br/&gt;(d)0.1-1.2 wt% of a thermal initiator having a structure of general formula (1): &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;-L&lt;sup&gt;1&lt;/sup&gt;-O-O-L&lt;sup&gt;2&lt;/sup&gt;-R&lt;sup&gt;2&lt;/sup&gt; (1) &lt;br/&gt;wherein R&lt;sup&gt;1 &lt;/sup&gt;and R&lt;sup&gt;2&lt;/sup&gt;, independently from each other, are selected from a substituted or unsubstituted C&lt;sub&gt;6&lt;/sub&gt;-C&lt;sub&gt;18&lt;/sub&gt; aryl group and a substituted or unsubstituted C&lt;sub&gt;5&lt;/sub&gt;-C&lt;sub&gt;18&lt;/sub&gt; cycloalkyl group; &lt;br/&gt;L&lt;sup&gt;1 &lt;/sup&gt;and L&lt;sup&gt;2&lt;/sup&gt;, independently from each other, are selected from a carbonyl group, an ester bond, and a linear or branched C&lt;sub&gt;1&lt;/sub&gt;-C&lt;sub&gt;10&lt;/sub&gt; alkylene group. &lt;br/&gt;The present invention also relates to a cured product of said composition, an article comprising the cured product or bonded with said composition and a process of bonding substrates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621900</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122839</doc-number>
          <kind></kind>
          <date>114/06/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">B32B37/12</main-classification>
        <further-classification edition="200601120251103B">B32B27/30</further-classification>
        <further-classification edition="200601120251103B">B32B27/36</further-classification>
        <further-classification edition="200601120251103B">B32B7/12</further-classification>
        <further-classification edition="200601120251103B">C09J133/24</further-classification>
        <further-classification edition="200601120251103B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹川泰介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAGAWA, TAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205884</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>偏光薄膜之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種偏光薄膜之製造方法，係於附易接著層之偏光件的易接著層面透過接著劑層貼合有光學薄膜的偏光薄膜之製造方法；前述光學薄膜係選自於由聚酯系樹脂、(甲基)丙烯酸系樹脂、聚苯乙烯系樹脂及聚碳酸酯系樹脂所構成群組中之至少1種樹脂薄膜；接著劑組成物含有含環狀醚基之(甲基)丙烯醯胺衍生物及具有碳數為10以上之烴基之(甲基)丙烯酸酯；易接著組成物含有水、含環狀醚基之(甲基)丙烯醯胺衍生物及通式(1)所示化合物，且前述易接著組成物中，固體成分濃度為55質量%以上且85質量%以下；並且，前述偏光薄膜之製造方法包含以下步驟：將前述接著劑組成物之塗膜及/或前述易接著組成物之塗膜之塗敷量調整成使貼合前述接著劑組成物之塗膜與前述易接著組成物之塗膜而得之未硬化組成物層之固體成分中，含環狀醚基之(甲基)丙烯醯胺衍生物之合計比率為61質量%以上且80質量%以下，來形成前述未硬化組成物層。該偏光薄膜之製造方法係一於附易接著層之偏光件的易接著層面透過接著劑層貼合有光學薄膜的偏光薄膜之製造方法，其即便在使用選自於由聚酯系樹脂、(甲基)丙烯酸系樹脂、聚苯乙烯系樹脂及聚碳酸酯系樹脂所構成群組中之至少1種樹脂薄膜作為光學薄膜時，仍可獲得具有良好外觀之偏光薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623237</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122911</doc-number>
          <kind></kind>
          <date>114/06/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120250801B">H04L45/28</main-classification>
        <further-classification edition="200601120250801B">G05B19/402</further-classification>
        <further-classification edition="200601120250801B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山龍也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本浩一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺田光一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERADA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/041317</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>通訊裝置及控制系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實現控制系統的信賴性提升等。控制用通訊系統，係具有控制裝置、通訊裝置、複數個元件(控制對象裝置)群，是由含有控制裝置與複數個通訊裝置的雙工化網路所構成。於相鄰的通訊裝置中，與構成雙工化網路的通訊埠不同的通訊裝置之通訊埠間，被至少含有1個元件的子控制網路所連接。通訊裝置(例如中繼裝置(123))係具有：通訊部(154)，係具有通訊埠並將封包進行通訊；和循環測知資訊處理部(循環位元處理部(190))將封包上的循環測知資訊(循環位元)予以無效化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">123:中繼裝置</p>
        <p type="p">190(190b):循環位元處理部</p>
        <p type="p">191(191b):通訊處理記錄部</p>
        <p type="p">192(192a~192d):通訊轉送控制部</p>
        <p type="p">154(154a~154d):通訊部</p>
        <p type="p">701a~701d:通訊埠機能</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10048.png" file="d10048.TIF" giffile="ed10048.png" height="547px" img-content="tif" inline="yes" orientation="portrait" width="737px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623669</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122923</doc-number>
          <kind></kind>
          <date>114/06/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/65</main-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W90/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>殷景泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EUN, KYOUNG TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成基俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNG, KI JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0101448</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有凸塊下金屬化的扇出半導體封裝</chinese-title>
        <english-title>FAN OUT SEMICONDUCTOR PACKAGE HAVING UNDER BUMP METALLURGY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容涉及具有凸塊下金屬化的扇出半導體封裝。半導體封裝包括：連接件，其連接到半導體晶片；第一再分佈層，其包括第一再分佈圖案；第二再分佈層，其包括第二再分佈圖案；以及凸塊下金屬化UBM墊，其設置在第二再分佈層上；第二再分佈圖案包括與UBM墊對齊的再分佈墊和在第一方向上延伸超過UBM墊的側表面的側表面；第一再分佈圖案包括第一再分佈線，第一再分佈線包括與再分佈墊的第一邊緣對齊的第一線和與再分佈墊的第二邊緣對齊的第二線；第一線的第一側表面在第一方向上比再分佈墊的第一邊緣延伸得更遠，並且第二線的第一側表面在第一方向上比再分佈墊的第二邊緣延伸得更遠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package includes a connector connected to a semiconductor chip; a first redistribution layer including a first redistribution pattern; a second redistribution layer including a second redistribution pattern; and an under-bump metallization (UBM) pad disposed on the second redistribution layer; the second redistribution pattern including a redistribution pad aligned with the UBM pad and a side surface extending beyond a side surface of the UBM pad in a first direction; the first redistribution pattern including first redistribution lines comprising a first line aligned with a first edge of the redistribution pad and a second line aligned with a second edge of the redistribution pad; a first side surface of the first line extending farther in the first direction than the first edge of the redistribution pad, and a first side surface of the second line extending farther in the first direction than the second edge of the redistribution pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體封裝</p>
        <p type="p">100:半導體晶片</p>
        <p type="p">110:晶片墊</p>
        <p type="p">200:連接件</p>
        <p type="p">300:模製構件</p>
        <p type="p">400:再分佈結構</p>
        <p type="p">410:第一再分佈層</p>
        <p type="p">411:第一再分佈圖案</p>
        <p type="p">411a:第一再分佈線/左第一再分佈線</p>
        <p type="p">411b:第一再分佈線/右第一再分佈線</p>
        <p type="p">411c:第一附加再分佈線</p>
        <p type="p">411d:第二附加再分佈線</p>
        <p type="p">412:第一介電層/介電層</p>
        <p type="p">420:第二再分佈層</p>
        <p type="p">421:第二再分佈圖案</p>
        <p type="p">421a:再分佈墊</p>
        <p type="p">422:第二介電層</p>
        <p type="p">500:UBM墊</p>
        <p type="p">600:外部連接端子</p>
        <p type="p">700:絕緣層</p>
        <p type="p">800:鈍化層</p>
        <p type="p">A:部分</p>
        <p type="p">CT1:第一接觸部分</p>
        <p type="p">CT2:第二接觸部分</p>
        <p type="p">CT3:第三接觸部分</p>
        <p type="p">CT4:第四接觸部分</p>
        <p type="p">CT5:第五接觸部分</p>
        <p type="p">FD:第一方向</p>
        <p type="p">OP:開口</p>
        <p type="p">SD:第二方向</p>
        <p type="p">VD:垂直方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="712px" img-content="tif" inline="yes" orientation="portrait" width="899px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622140</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122934</doc-number>
          <kind></kind>
          <date>114/06/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08G59/18</main-classification>
        <further-classification edition="200601120260225B">C08L63/00</further-classification>
        <further-classification edition="200601120260225B">C09J163/00</further-classification>
        <further-classification edition="200601120260225B">C09J11/06</further-classification>
        <further-classification edition="200601120260225B">C08K5/13</further-classification>
        <further-classification edition="200601120260225B">C08K5/524</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本化藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON KAYAKU KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喜多敬吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITA, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯塚真之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIZUKA, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-099318</doc-number>
          <date>20240620</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-132440</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光硬化性樹脂組成物、光纖陣列用接著劑、光纖陣列及光通信用零件</chinese-title>
        <english-title>PHOTOCURABLE RESIN COMPOSITION, ADHESIVE FOR OPTICAL FIBER ARRAYS, OPTICAL FIBER ARRAYS, AND OPTICAL COMMUNICATION COMPONENTS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的係提供一種具有優異之硬化速度及高耐熱性之光硬化性樹脂組成物。更具體而言，本發明之目的係提供一種光硬化性樹脂組成物，其作為用於固定形成有V溝(3)之基板(2)、裸露之光纖芯線(5)及蓋板(4)固定之接著劑(6)，即使具有複雜之構造且光不易照射仍顯示出充分之硬化性之外，還具有可承受回流步驟的高耐熱性。光硬化性樹脂組成物為含有環氧樹脂(A)、光酸產生劑(B)及抗氧化劑(C)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention aims to provide a photocurable resin composition with excellent curing speed and great heat resistance. More specifically, the present invention aims to provide a photocurable resin composition that can be used as an adhesive (6) to secure a substrate (2) with a V-groove (3), exposed optical fiber cores (5), and a cover plate (4). The photocurable resin composition exhibits sufficient curing properties despite a complex structure and low exposure to light, and also has great heat resistance sufficient to withstand a reflow process. The photocurable resin composition contains an epoxy resin (A), a photoacid generator (B), and an antioxidant (C).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光纖陣列</p>
        <p type="p">2:V溝基板</p>
        <p type="p">3:V溝</p>
        <p type="p">4:蓋板</p>
        <p type="p">5:光纖芯線</p>
        <p type="p">6:接著劑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="463px" img-content="tif" inline="yes" orientation="portrait" width="561px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622278</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114122973</doc-number>
          <kind></kind>
          <date>114/06/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/44</main-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方杜拉利亞　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FONDURULIA, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金堤　安基特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMTEE, ANKIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/663,596</doc-number>
          <date>20240624</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於氣體分配之設備</chinese-title>
        <english-title>APPARATUS FOR GAS DISTRIBUTION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露技術之各種實施例可提供一種噴淋頭板，其具有：一第一表面及一相對第二表面；一圓形切口，其在該第二表面中，其中該切口包含在該第二表面處具有一第一直徑之一開口以及自一豎直軸線徑向向外突出並形成一第二直徑之一凹槽，其中該第二直徑大於該第一直徑；以及一突出部，其安置於該第一表面與該第二表面之間，該突出部朝向該軸線向內突出，其中該突出部形成該凹槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments of the present technology may provide a showerhead plate having a first surface and an opposing second surface, a circular cutout in the second surface, wherein the cutout comprises an opening having a first diameter at the second surface and a groove that projects radially outwards from a vertical axis and forms a second diameter, wherein the second diameter is larger than the first diameter, and a protrusion disposed between the first and second surfaces that projects inwards toward the axis, wherein the protrusion forms the groove.</p>
      </isu-abst>
      <representative-img>
        <p type="p">125:底部部分/第二部分</p>
        <p type="p">155:第一表面</p>
        <p type="p">160:第二表面</p>
        <p type="p">300:入口通孔</p>
        <p type="p">305:排氣通孔</p>
        <p type="p">500:豎直軸線</p>
        <p type="p">505:切口</p>
        <p type="p">510:突出部</p>
        <p type="p">520:凹槽</p>
        <p type="p">525:表面</p>
        <p type="p">530:圓形開口</p>
        <p type="p">535:終止邊緣</p>
        <p type="p">D1:第一直徑</p>
        <p type="p">D2:第二直徑</p>
        <p type="p">D3:第三直徑</p>
        <p type="p">DG:深度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="484px" img-content="tif" inline="yes" orientation="portrait" width="950px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622134</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123037</doc-number>
          <kind></kind>
          <date>114/06/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C08F214/26</main-classification>
        <further-classification edition="200601120260224B">C08F210/02</further-classification>
        <further-classification edition="200601120260224B">C08F2/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀圭司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴崎浩輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBASAKI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹內優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEUCHI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-099103</doc-number>
          <date>20240619</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含氟聚合物之製造方法</chinese-title>
        <english-title>METHODS OF PRODUCING FLUORINE-CONTAINING POLYMER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種含氟聚合物之製造方法，包含下述步驟：在包含第1含氟聚合物及水性介質之水性分散液中，使包含含氟單體之單體進行聚合，製造第2含氟聚合物；第1含氟聚合物包含以四氟乙烯為主體之結構單元與以乙烯為主體之結構單元；並且，在單體開始聚合之前，水性分散液不含含氟乳化劑，或者，含氟乳化劑之含量相對於水性分散液之總質量為100質量ppm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622157</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123075</doc-number>
          <kind></kind>
          <date>114/06/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G77/38</main-classification>
        <further-classification edition="200601120260302B">G03F7/075</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/027</further-classification>
        <further-classification edition="202601120260302B">H10W74/47</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, MEGUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内田一幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-100377</doc-number>
          <date>20240621</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-084782</doc-number>
          <date>20250521</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鹼可溶性聚矽氧化合物、感光性樹脂組成物、樹脂硬化膜、半導體封裝、顯示裝置</chinese-title>
        <english-title>ALKALI-SOLUBLE SILICONE COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION, RESIN CURED FILM, SEMICONDUCTOR PACKAGE, DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供可形成高溫環境下的耐光性及高溫高濕環境下的耐久性良好之樹脂硬化膜之鹼可溶性聚矽氧化合物及感光性樹脂組成物、以及使用前述樹脂硬化膜之半導體封裝、顯示裝置。&lt;br/&gt;本發明之解決手段為一種鹼可溶性聚矽氧化合物，係具有下述通式(3)所示之取代基。&lt;br/&gt;&lt;img align="absmiddle" height="297px" width="312px" file="ed10030.JPG" alt="ed10030.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(惟R&lt;sub&gt;5&lt;/sub&gt;獨立地表示氫原子或甲基。R&lt;sub&gt;6&lt;/sub&gt;獨立地表示可含有雜原子之碳數4至20之烴基。R&lt;sub&gt;7&lt;/sub&gt;獨立地表示可含有雜原子之碳數1至20之烴基。L表示氫原子或含有羧基之取代基，通式(3)中至少含有一個含有羧基之取代基。*表示鍵結部位)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The objectives of the present invention are to provide an alkali-soluble silicone compound and a photosensitive resin composition that are capable of forming a resin cured film having good light resistance in a high-temperature environment and good durability in a high-temperature and high-humidity environment, as well as a semiconductor package and a display device using the resin cured film.&lt;br/&gt;Provided as a solution in the present invention is an alkali-soluble silicone compound having a substituent represented by the following general formula (3):&lt;br/&gt;&lt;img align="absmiddle" height="280px" width="311px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;,&lt;br/&gt;(provided that R&lt;sub&gt;5&lt;/sub&gt;independently represents a hydrogen atom or a methyl group. R&lt;sub&gt;6&lt;/sub&gt;independently represents a hydrocarbon group having 4 to 20 carbon atoms which may contain a heteroatom. R&lt;sub&gt;7&lt;/sub&gt;independently represents a hydrocarbon group having 1 to 20 carbon atoms which may contain a heteroatom. L represents a hydrogen atom or a substituent containing a carboxy group, and at least one substituent containing a carboxy group is included in the general formula (3). * represents a bonding site.)</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622022</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123095</doc-number>
          <kind></kind>
          <date>114/06/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C07C1/04</main-classification>
        <further-classification edition="200601120260226B">C07B61/00</further-classification>
        <further-classification edition="200601120260226B">C07C11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友重機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川崎康晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI, YASUHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-133976</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一氧化碳轉化率演算方法及一氧化碳轉化率演算裝置、以及烴製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明的課題之一為，提供一種與一氧化碳轉化率演算方法及其演算裝置有關之技術，該一氧化碳轉化率演算方法係在以一氧化碳及氫為原料之觸媒反應中，能夠更簡便且迅速地掌握一氧化碳轉化率。  &lt;br/&gt;　　[解決手段]為了解決上述課題，提供一種一氧化碳轉化率演算方法及用於實施該演算方法的演算裝置，其中，該一氧化碳轉化率演算方法包括：觸媒反應步驟，其係進行以一氧化碳和氫為原料之觸媒反應；及計算步驟，其係依據藉由觸媒反應步驟生成之烯烴中α-烯烴的比例或烯烴中的順式/反式比，計算一氧化碳轉化率。  &lt;br/&gt;　　依據本發明，在CO轉化率的計算中，藉由與所生成之烴混合物中的成分比有關之測定來替代每單位時間的氣體(原料氣體及出口氣體)中的CO莫耳數的測定。藉此，能夠簡便且迅速地計算CO轉化率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="756px" img-content="tif" inline="yes" orientation="portrait" width="726px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623575</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123230</doc-number>
          <kind></kind>
          <date>114/06/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片岡正道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATAOKA, MASAMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-105320</doc-number>
          <date>20240628</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>處理系統、處理方法及搬運裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明可效率良好地進行將複數裸晶移載至對象體時所用的移載用零件之更換。  &lt;br/&gt;本發明之處理複數裸晶的處理系統，包含：具有用於將第一對象體所固持之複數該裸晶移載至第二對象體之移載用零件的移載裝置，及設於該移載裝置之外部，並為了更換該移載裝置中的該移載用零件而搬運該移載用零件的搬運裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:處理系統</p>
        <p type="p">2:第一處理系統</p>
        <p type="p">3:第二處理系統</p>
        <p type="p">10:搬入搬出站</p>
        <p type="p">11:處理站</p>
        <p type="p">20:前開式晶圓盒載置台</p>
        <p type="p">30:搬運裝置</p>
        <p type="p">31:搬運路徑</p>
        <p type="p">32:搬運臂</p>
        <p type="p">40:搬運裝置</p>
        <p type="p">41:搬運臂</p>
        <p type="p">42:旋轉台</p>
        <p type="p">50:轉移裝置</p>
        <p type="p">51:緩衝裝置</p>
        <p type="p">60:裸晶配置裝置</p>
        <p type="p">61:腔室</p>
        <p type="p">62:閘門</p>
        <p type="p">70:搬入搬出站</p>
        <p type="p">71:處理站</p>
        <p type="p">80:前開式晶圓盒載置台</p>
        <p type="p">90:搬運裝置</p>
        <p type="p">91:搬運路徑</p>
        <p type="p">92:搬運臂</p>
        <p type="p">100:搬運裝置</p>
        <p type="p">101:搬運臂</p>
        <p type="p">102:旋轉台</p>
        <p type="p">110:轉移裝置</p>
        <p type="p">111:緩衝裝置</p>
        <p type="p">120:裸晶接合裝置</p>
        <p type="p">121:腔室</p>
        <p type="p">122:閘門</p>
        <p type="p">130:控制裝置</p>
        <p type="p">C:載具</p>
        <p type="p">F:切割框架</p>
        <p type="p">Fc,Ff,Fw:前開式晶圓盒</p>
        <p type="p">W:晶圓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="970px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621964</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123263</doc-number>
          <kind></kind>
          <date>114/06/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">B65G1/137</main-classification>
        <further-classification edition="200601120260225B">B65G67/02</further-classification>
        <further-classification edition="200601120260225B">B65G67/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大福股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIFUKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩田昌重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWATA, MASASHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-145367</doc-number>
          <date>20240827</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>搬送設備</chinese-title>
        <english-title>TRANSPORT FACILITY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">搬送設備具備用以搬送搬送對象物B的搬送車4、和用以支撐搬送對象物B的支撐裝置5。搬送車4具備用以支撐搬送對象物B的底面的第1支撐台42、和推壓部43。支撐裝置5具備至少一部分即可動支撐部61c可運動的第2支撐台6、用以限制支撐於第2支撐台6的搬送對象物B的移動的限制部7、及被推壓部43推壓的被推壓部8。可動支撐部61c構成為連動於被推壓部8藉由推壓部43被推壓而退回。第2支撐台6構成為允許第1支撐台42進入到因可動支撐部61c退回而變空的空間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:搬送台</p>
        <p type="p">4:搬送車</p>
        <p type="p">5:支撐裝置</p>
        <p type="p">6:第2支撐台</p>
        <p type="p">7:限制部</p>
        <p type="p">8:被推壓部</p>
        <p type="p">22:供給車輛</p>
        <p type="p">23:底盤</p>
        <p type="p">24:底板</p>
        <p type="p">24f:上表面</p>
        <p type="p">25:交接構造</p>
        <p type="p">31:導引台</p>
        <p type="p">32:接受面</p>
        <p type="p">41:車體</p>
        <p type="p">42:第1支撐台</p>
        <p type="p">42f:搬送面</p>
        <p type="p">43:推壓部</p>
        <p type="p">61c:可動支撐部</p>
        <p type="p">61f:支撐面</p>
        <p type="p">61t:傾斜部</p>
        <p type="p">B:搬送對象物</p>
        <p type="p">G:物品</p>
        <p type="p">T:搬送方向</p>
        <p type="p">X:移載方向</p>
        <p type="p">X1:移載方向第1側</p>
        <p type="p">X2:移載方向第2側</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="712px" img-content="tif" inline="yes" orientation="portrait" width="1021px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623483</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123284</doc-number>
          <kind></kind>
          <date>114/06/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250915B">H10H29/49</main-classification>
        <further-classification edition="202501120250915B">H10H29/80</further-classification>
        <further-classification edition="202501120250915B">H10H20/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜育維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡乙誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/722,074</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置及其修補方法</chinese-title>
        <english-title>DISPLAY DECIVE AND REPAIR METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種顯示裝置，其包括第一發光單元、第二發光單元、第一導線、第一備用接墊以及第二備用接墊。第一導線電性連接於第一發光單元與第二發光單元。第一備用接墊與第一導線電性連接。第二備用接墊與第一導線電性連接。第一發光單元具有第一電極以及第二電極，第二發光單元具有第三電極以及第四電極，第一導線電連接第二電極以及第三電極，且第二電極與第三電極為不同極性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device including a first light-emitting unit, a second light-emitting unit, a first wire, a first redundant pad, and a second redundant pad is provided. The first wire is electrically connected to the first light-emitting unit and the second light-emitting unit. The first redundant pad is electrically connected to the first wire. The second redundant pad is electrically connected to the first wire. The first light-emitting unit has a first electrode and a second electrode, and the second light-emitting unit has a third electrode and a fourth electrode. The first wire is electrically connected to the second electrode and the third electrode, and the second electrode and the third electrode are of different polarities.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:顯示裝置</p>
        <p type="p">100:載板</p>
        <p type="p">CL1、CL2、CL3:導線</p>
        <p type="p">E1:第一發光單元</p>
        <p type="p">E11、E31:第一電極</p>
        <p type="p">E12、E32:第二電極</p>
        <p type="p">E21、E41:第三電極</p>
        <p type="p">E22、E42:第四電極</p>
        <p type="p">E2:第二發光單元</p>
        <p type="p">E3:第三發光單元</p>
        <p type="p">E4:第四發光單元</p>
        <p type="p">MP1:第一組接墊</p>
        <p type="p">MP11、MP12、MP21、MP22:接墊</p>
        <p type="p">MP2:第二組接墊</p>
        <p type="p">RP1:第一組備用接墊</p>
        <p type="p">RP11、RP12、RP21、RP22:備用接墊</p>
        <p type="p">RP2:第二組備用接墊</p>
        <p type="p">X、Y、Z:方向</p>
        <p type="p">c1、c1’、c2、c2’、c3、c4、O1、O2:中心位置</p>
        <p type="p">d1:最遠距離</p>
        <p type="p">p1、p2、p3:節距</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="632px" img-content="tif" inline="yes" orientation="portrait" width="952px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622148</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123316</doc-number>
          <kind></kind>
          <date>114/06/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C08G64/14</main-classification>
        <further-classification edition="200601120260223B">C08G63/80</further-classification>
        <further-classification edition="200601120260223B">C08G63/83</further-classification>
        <further-classification edition="200601120260223B">C08L63/02</further-classification>
        <further-classification edition="200601120260223B">C08F2/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彦坂高明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIKOSAKA, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吹田百恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKITA, MOMOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村聖斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-099925</doc-number>
          <date>20240620</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>聚碳酸酯樹脂、絕緣材料及電子基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種聚碳酸酯樹脂，其具有下述式(1)所表示之結構。式(1)中，X&lt;sub&gt;1&lt;/sub&gt;、X&lt;sub&gt;2&lt;/sub&gt;、X&lt;sub&gt;3&lt;/sub&gt;及X&lt;sub&gt;4&lt;/sub&gt;分別獨立地為氫原子、經取代或未經取代之碳數1～6之烷基、或者經取代或未經取代之成環碳數6～20之環烷基，但，選自由X&lt;sub&gt;1&lt;/sub&gt;、X&lt;sub&gt;2&lt;/sub&gt;、X&lt;sub&gt;3&lt;/sub&gt;及X&lt;sub&gt;4&lt;/sub&gt;所組成之群中之至少1個不為氫原子，R&lt;sub&gt;1&lt;/sub&gt;為碳數12～24之直鏈烷基。  &lt;br/&gt;&lt;img align="absmiddle" height="151px" width="346px" file="ed10049.JPG" alt="ed10049.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623618</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123319</doc-number>
          <kind></kind>
          <date>114/06/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P95/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
        <further-classification edition="202601120260302B">H10P14/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山內邦裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAUCHI, KUNIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池亜紀応</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, AKIOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-101489</doc-number>
          <date>20240624</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>處理基板之處理方法、半導體裝置之製造方法及處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠減少基板上之金屬污染之處理基板之處理方法、半導體裝置之製造方法及處理裝置。  &lt;br/&gt;本發明係關於一種藉由如下氣體來處理基板之處理方法，該氣體即：選自由IF&lt;sub&gt;7&lt;/sub&gt;、IF&lt;sub&gt;5&lt;/sub&gt;、BrF&lt;sub&gt;5&lt;/sub&gt;、BrF&lt;sub&gt;3&lt;/sub&gt;、MoF&lt;sub&gt;6&lt;/sub&gt;、GeF&lt;sub&gt;4&lt;/sub&gt;、ClF及ClF&lt;sub&gt;3&lt;/sub&gt;所組成之群中之至少一種氣體(第1氣體)；以及選自由F&lt;sub&gt;2&lt;/sub&gt;及HF所組成之群中之至少一種氣體(第2氣體)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622165</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123351</doc-number>
          <kind></kind>
          <date>114/06/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08J11/08</main-classification>
        <further-classification edition="200601120260225B">D01F13/04</further-classification>
        <further-classification edition="200601120260225B">B01D11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊沃控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVEL HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古茲　約翰　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOODS, JOHN B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達維斯　福瑞斯　傑萊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAVIS, FOREST GERARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃福　柴克瑞　艾丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLFORD, ZACKARY AIDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳致豫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/662,628</doc-number>
          <date>20240621</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>自織物回收彈性纖維之程序及系統及經回收彈性纖維之再利用</chinese-title>
        <english-title>PROCESSES AND SYSTEMS FOR RECYCLING ELASTANE FROM TEXTILES AND ITS REUSE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述用於自各種組合物之織物廢料回收及純化彈性纖維之方法，以及將經純化之經回收彈性纖維轉換成新的即用型纖維用於服裝製造或其他用途之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are methods for recycling and purifying elastane from textile waste of various compositions as well as methods for converting the purified recycled elastane into new ready to use fibers for garment manufacturing or other uses.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="744px" img-content="tif" inline="yes" orientation="portrait" width="1023px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622479</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123448</doc-number>
          <kind></kind>
          <date>114/06/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">G01N3/317</main-classification>
        <further-classification edition="200601120260225B">G01N3/62</further-classification>
        <further-classification edition="200601120260225B">G01B11/04</further-classification>
        <further-classification edition="200601120260225B">G01B11/22</further-classification>
        <further-classification edition="200601120260225B">G01B11/26</further-classification>
        <further-classification edition="200601120260225B">G01B21/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥利弗　瓦倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLIVER, WARREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑　詹妮弗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAY, JENNIFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,150</doc-number>
          <date>20240809</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/824,665</doc-number>
          <date>20240904</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>校凖或驗證儀表化的壓頭之位移量測系統的裝置及方法</chinese-title>
        <english-title>DEVICE AND METHOD TO CALIBRATE OR VERIFY THE DISPLACEMENT-MEASUREMENT SYSTEM OF AN INSTRUMENTED INDENTER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一光學偵測器判定一傾斜表面上之一第一位置與一第二位置之間的一相對深度。一控制器基於該第一位置與該第二位置之間的該相對深度及位置之間移動之距離來判定該傾斜表面之一斜率。一致動器在位於該第一位置與該第二位置之間的該傾斜表面上之複數個中間位置處位移一衝頭。一位移偵測器判定樣本在該複數個中間位置之各者處由該衝頭接觸之一深度。該控制器基於該傾斜表面之該斜率及位置之間移動之距離進一步判定複數個中間位置之各者處之該傾斜表面之一經計算深度。該控制器進一步比較由該位移偵測器量測之該深度與各對應經計算深度以驗證該位移偵測器之準確度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical detector determines a relative depth between a first position and a second position on an inclined surface. A controller determines a slope of the inclined surface based on the relative depth between the first position and the second position and the distance moved between positions. An actuator displaces a punch at a plurality of intermediate positions on the inclined surface located between the first position and the second position. A displacement detector determines a depth at which the sample is touched by the punch at each of the plurality of intermediate positions. The controller further determines a calculated depth of the inclined surface at each of the plurality of intermediate positions based on the slope of the inclined surface and the distance moved between positions. The controller further compares the depth measured by the displacement detector to each corresponding calculated depth to verify accuracy of the displacement detector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">6:支撐件</p>
        <p type="p">7:載物台/X-Y台</p>
        <p type="p">9:致動器</p>
        <p type="p">11:電流驅動負載線圈</p>
        <p type="p">13:桿</p>
        <p type="p">15:壓頭衝頭</p>
        <p type="p">17:可變電流源</p>
        <p type="p">18:板片彈簧</p>
        <p type="p">19:系統控制器</p>
        <p type="p">21:位移偵測器</p>
        <p type="p">21A:中心板</p>
        <p type="p">21B:驅動板</p>
        <p type="p">23:轉換器/DC位移偵測器</p>
        <p type="p">25:數位伏特計</p>
        <p type="p">26:AC源</p>
        <p type="p">27:DC電流偵測器</p>
        <p type="p">29:第二數位伏特計</p>
        <p type="p">31:記憶體</p>
        <p type="p">33:AC信號產生器</p>
        <p type="p">35:AC位移偵測器</p>
        <p type="p">40:顯示器</p>
        <p type="p">100:系統</p>
        <p type="p">101:樣本</p>
        <p type="p">110:光學偵測器</p>
        <p type="p">115:縱向軸線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="741px" img-content="tif" inline="yes" orientation="portrait" width="741px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623701</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123475</doc-number>
          <kind></kind>
          <date>114/06/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W80/00</main-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆霍帕迪耶　帕莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKHOPADHYAY, PARTHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富爾福德　Ｈ　吉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FULFORD, H. JIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德維利耶　安東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEVILLIERS, ANTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加德納　馬克　Ｉ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARDNER, MARK I.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加勒比　蘇里爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARIBE, ZURIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/663,984</doc-number>
          <date>20240625</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/010,838</doc-number>
          <date>20250106</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>混合式接合中的晶圓疊置對位</chinese-title>
        <english-title>WAFER OVERLAY REGISTRATION IN HYBRID BONDING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種混合式接合的方法，包含：存取源自第一晶圓的第一晶粒以及源自一或更多第二晶圓的第二晶粒。量測第一晶粒之第一疊置對位值（ORV）以及第二晶粒之第二ORV。執行晶粒配對處理，基於第一ORV與第二ORV匹配第一晶粒與第二晶粒以形成配對晶粒。執行混合式接合處理以接合配對晶粒。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of hybrid bonding includes accessing first dies sourced from a first wafer and second dies sourced from one or more second wafers. First overlay registration values (ORVs) of the first dies and second ORVs of the second dies are measured. A die pairing process is executed that matches the first dies with the second dies to form paired dies based on the first ORVs and the second ORVs. A hybrid bonding process is executed to bond the paired dies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">190:控制器</p>
        <p type="p">400:處理</p>
        <p type="p">S410,S420,S430,S440:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="758px" img-content="tif" inline="yes" orientation="portrait" width="1027px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623451</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123513</doc-number>
          <kind></kind>
          <date>114/06/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/85</main-classification>
        <further-classification edition="202501120260302B">H10D64/60</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202501120260302B">H10D62/17</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑞乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, JUI-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林威呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾威程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TZENG, WEI-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,749</doc-number>
          <date>20241127</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/190,276</doc-number>
          <date>20250425</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構與半導體裝置結構</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR DEVICE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭示內容的半導體結構包括：第一隔離結構；第一底部電晶體；第二底部電晶體，沿方向設置在第一隔離結構與第一底部電晶體之間；第一頂部電晶體，設置在第一隔離結構上方；第二隔離結構，位於第一底部電晶體上方；及第二頂部電晶體，位於第二底部電晶體上方。第二頂部電晶體沿方向設置在第一頂部電晶體與第二隔離結構之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor structure according to the present disclosure includes a first isolation structure, a first bottom transistor, a second bottom transistor disposed between the first isolation structure and the first bottom transistor along a direction, a first top transistor disposed over the first isolation structure, a second isolation structure over the first bottom transistor, and a second top transistor over the second bottom transistor. The second top transistor is disposed between the first top transistor and the second isolation structure along the direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體結構/前驅物結構</p>
        <p type="p">210C:通道區域</p>
        <p type="p">210SD:源極/汲極區域</p>
        <p type="p">212B:底部源極/汲極特徵</p>
        <p type="p">212T:頂部源極/汲極特徵</p>
        <p type="p">220B:閘極結構</p>
        <p type="p">220T:閘極結構</p>
        <p type="p">230:中間介電層</p>
        <p type="p">240:閘極間隔物</p>
        <p type="p">262:前側裝置隔離特徵</p>
        <p type="p">263:前側矽化物特徵</p>
        <p type="p">264:前側接觸特徵</p>
        <p type="p">266:第一ESL</p>
        <p type="p">268:第一ILD層</p>
        <p type="p">270:第二ESL</p>
        <p type="p">272:第二ILD層</p>
        <p type="p">280:前側跳線特徵</p>
        <p type="p">282:第四ESL</p>
        <p type="p">284:前側IMD層</p>
        <p type="p">285:第一導電特徵</p>
        <p type="p">288:第二導電特徵</p>
        <p type="p">290:前側閘極觸點</p>
        <p type="p">304、324:第一背側ESL</p>
        <p type="p">306:第一背側ILD層</p>
        <p type="p">310:背側裝置隔離特徵</p>
        <p type="p">318:阻障層</p>
        <p type="p">320:背側接觸特徵</p>
        <p type="p">322:背側矽化物特徵</p>
        <p type="p">326:第二背側ILD層</p>
        <p type="p">336:背側跳線特徵</p>
        <p type="p">338:背側閘極觸點</p>
        <p type="p">2080B:底部通道構件</p>
        <p type="p">2080M:中間半導體層</p>
        <p type="p">2080T:頂部通道構件</p>
        <p type="p">A-A'、B-B'、C-C':剖面</p>
        <p type="p">X、Y、Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.png" file="d10026.TIF" giffile="ed10026.png" height="730px" img-content="tif" inline="yes" orientation="portrait" width="958px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623419</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123606</doc-number>
          <kind></kind>
          <date>114/06/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120251201B">H10D64/01</main-classification>
        <further-classification edition="202501120251201B">H10D64/27</further-classification>
        <further-classification edition="202501120251201B">H10D64/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江育賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, ZHI-CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊固峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KU-FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,791</doc-number>
          <date>20241127</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/189,954</doc-number>
          <date>20250425</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多重閘極半導體裝置及其形成方法</chinese-title>
        <english-title>MULTI-GATE SEMICONDUCTOR DEVICE AND METHODS OF FORMATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供半導體裝置及形成方法。一個示例性的方法包括在基板上形成半導體層堆疊，半導體層堆疊具有位於下部通道層上方的上部通道層，執行蝕刻製程以使下部通道層側向凹陷而不實質上蝕刻上部通道層，形成耦接經凹陷的下部通道層的第一源極/汲極特徵，並形成耦接上部通道層的第二源極/汲極特徵，第二源極/汲極特徵配置於第一源極/汲極特徵上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and methods of forming the same are provided. An exemplary method includes forming a semiconductor layer stack over a substrate, the semiconductor layer stack having an upper channel layer over a lower channel layer, performing an etching process to laterally recess the lower channel layer without substantially etching the upper channel layer, forming a first source/drain feature coupled to the recessed lower channel layer, and forming a second source/drain feature coupled to the upper channel layer, the second source/drain feature is disposed over the first source/drain feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體裝置</p>
        <p type="p">10U:上部裝置</p>
        <p type="p">10L:下部裝置</p>
        <p type="p">26’L:通道層</p>
        <p type="p">26’U:通道層</p>
        <p type="p">62L:源極/汲極特徵</p>
        <p type="p">62U:源極/汲極特徵</p>
        <p type="p">72:底部閘極結構</p>
        <p type="p">74:上部閘極結構</p>
        <p type="p">78:閘極介電層</p>
        <p type="p">80L:閘極電極</p>
        <p type="p">80U:閘極電極</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10035.png" file="d10035.TIF" giffile="ed10035.png" height="714px" img-content="tif" inline="yes" orientation="portrait" width="747px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623352</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123610</doc-number>
          <kind></kind>
          <date>114/06/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260224B">H10B12/00</main-classification>
        <further-classification edition="202501120260224B">H10D30/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高秉廈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, BYENGHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文錦妃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUN, GEUMBI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOONJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭慧晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, HYEJEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金益秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, IKSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃光台</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, KWANGTAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0104880</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>主動圖案之間具有空氣間隙的半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INCLUDING AIR GAP BETWEEN ACTIVE PATTERNS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置，包括主動圖案，其包括第一第一主動圖案、第二第一主動圖案以及第三第一主動圖案，背閘極電極在第一第一主動圖案和第二第一主動圖案之間延伸並在第一方向中延伸，第一字元線和第二字元線在第二第一主動圖案和第三第一主動圖案之間延伸並在第二方向中彼此間隔開，絕緣圖案在第一字元線和第二字元線之間，第一空氣間隙在第一第一主動圖案和第二第一主動圖案之間，其中背閘極電極在第一空氣間隙上，以及第二空氣間隙在第二第一主動圖案和第三第一主動圖案之間，其中第一字元線、第二字元線以及絕緣圖案在第二空氣間隙上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes active patterns that include a first-first active pattern, a second-first active pattern, and a third-first active pattern, a back gate electrode extending between the first-first active pattern and the second-first active pattern and extending in the first direction, a first word line and a second word line extending between the second-first active pattern and the third-first active pattern and spaced apart from each other in the second direction, an insulating pattern between the first word line and the second word line, a first air gap between the first-first active pattern and the second-first active pattern, where the back gate electrode is on the first air gap, and a second air gap between the second-first active pattern and the third-first active pattern, where the first word line, the second word line, and the insulating pattern are on the second air gap.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:背閘極電極</p>
        <p type="p">24:背閘極封蓋圖案</p>
        <p type="p">30:單元閘極介電層</p>
        <p type="p">35、36、70、72:材料層</p>
        <p type="p">37:絕緣圖案</p>
        <p type="p">45、51:絕緣結構</p>
        <p type="p">55:介電層</p>
        <p type="p">57:第二電極</p>
        <p type="p">75:位元線</p>
        <p type="p">78:位元線覆蓋圖案</p>
        <p type="p">81:位元線結構</p>
        <p type="p">84:位元線間隔件</p>
        <p type="p">87、90、93:空氣間隙結構</p>
        <p type="p">87a、87b:空氣間隙</p>
        <p type="p">96:下部頂蓋絕緣層</p>
        <p type="p">CR:記憶區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="898px" img-content="tif" inline="yes" orientation="portrait" width="780px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
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          <doc-number>202623438</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123611</doc-number>
          <kind></kind>
          <date>114/06/24</date>
        </document-id>
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        <main-classification edition="202501120260302B">H10D84/40</main-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D30/67</further-classification>
        <further-classification edition="202501120260302B">H10D8/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙槿彙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KEUNHWI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋寅鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, INHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴星海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EOM, BYEOLHAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
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              <chinese-name name-type="organization">
                <last-name>嚴太釪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UHM, TAEWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申東官</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, DONGGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洞院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李敬雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KYOUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙學柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, HAGJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0106999</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種實例性半導體裝置包括：電晶體；第一裝置；背側絕緣結構，位於電晶體及第一裝置下方；前側導電結構，位於電晶體及第一裝置上；鈍化結構，位於第一裝置與背側絕緣結構之間；背側導電圖案，位於背側絕緣結構與電晶體之間；以及背側內連結構，位於背側絕緣結構中且與背側導電圖案電性連接。第一裝置包括：半導體本體，包括具有第一導電類型的第一半導體區及具有第二導電類型的第二半導體區；第一半導體圖案，位於第一半導體區上；以及第二半導體圖案，位於第二半導體區上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example semiconductor device includes a transistor, a first device, a back side insulating structure below the transistor and the first device, a front side conductive structure on the transistor and the first device, a passivation structure between the first device and the back side insulating structure, a back side conductive pattern between the back side insulating structure and the transistor, and a back side interconnection structure in the back side insulating structure and electrically connected with the back side conductive pattern. The first device includes a semiconductor body, including a first semiconductor region having a first conductivity type and a second semiconductor region having a second conductivity type, a first semiconductor pattern on the first semiconductor region, and a second semiconductor pattern on the second semiconductor region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:半導體晶片</p>
        <p type="p">15b:裝置/第二裝置</p>
        <p type="p">49:第二層間絕緣層</p>
        <p type="p">55a2:第二內連件</p>
        <p type="p">55io:前部輸入/輸出內連結構</p>
        <p type="p">61:前部絕緣結構</p>
        <p type="p">62:上部前部內連結構</p>
        <p type="p">65:鈍化結構</p>
        <p type="p">74b:背側導電圖案/第二背側導電圖案</p>
        <p type="p">79:連接接觸結構</p>
        <p type="p">92:背側絕緣結構</p>
        <p type="p">96b:背側內連結構/第二背側內連結構</p>
        <p type="p">96io:背側內連結構/背側輸入/輸出內連結構</p>
        <p type="p">620:上部接墊</p>
        <p type="p">625:下部接墊</p>
        <p type="p">701:下部基座</p>
        <p type="p">703、803:接墊</p>
        <p type="p">705、805:本體部分</p>
        <p type="p">707、807:導電凸塊</p>
        <p type="p">715:凸塊</p>
        <p type="p">801:上部晶片</p>
        <p type="p">Ia-Ia'、IVb-IVb'、VII-VII':線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10077.JPG" file="ed10077.JPG" height="697px" img-content="tif" inline="yes" orientation="portrait" width="959px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
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          <doc-number>202622277</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114123806</doc-number>
          <kind></kind>
          <date>114/06/25</date>
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      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/42</main-classification>
        <further-classification edition="200601120260302B">C23C16/46</further-classification>
        <further-classification edition="200601120260302B">C23C16/48</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>密斯金　卡列布</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISKIN, CALEB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹姆斯　羅賓森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAMES, ROBINSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬德哈里　尼廷</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>CHOUDHARY, NITIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
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          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬希斯瓦蘭　布貝西　巴卜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOTHEESWARAN, BUBESH BABU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪摩斯　亞歷山卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMOS, ALEXANDROS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯拉　奈娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHOSLA, NAYNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
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          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇拉娜　米蒂莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SURANA, MITISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉瀚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王文濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WENTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　潤鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAO, ION HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MO</english-country>
              <english-address>MO</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, FAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇俊威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, JUNWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/665,062</doc-number>
          <date>20240627</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/665,070</doc-number>
          <date>20240627</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有偏移式上部加熱器元件陣列的腔室配置、半導體處理系統以及製造腔室配置及將材料層沉積至基板上的方法</chinese-title>
        <english-title>CHAMBER ARRANGEMENTS WITH OFFSET HEATER ELEMENT ARRAYS, SEMICONDUCTOR PROCESSING SYSTEMS, AND METHODS OF MAKING CHAMBER ARRANGEMENTS AND DEPOSITING MATERIAL LAYERS ONTO SUBSTRATES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種腔室配置，該腔室配置包括一腔室主體、一基板支撐件及一上部加熱器元件陣列。該腔室主體具有注入端及縱向相對之排氣端，該基板支撐件配置於該腔室主體內且支撐於該腔室主體中以圍繞一旋轉軸旋轉，且該上部加熱器元件陣列支撐於該腔室主體上方且包括一側向內部第一上部線性燈及一側向內部第二上部線性燈。該側向內部第一上部線性燈與該旋轉軸分隔一第一側向間隔距離，該側向內部第二上部線性燈與該旋轉軸分隔一第二側向間隔距離，且該第一側向間隔距離及該第二側向間隔距離中之一者大於該第一側向間隔距離該第二側向間隔距離中之另一者。本文亦描述了半導體處理系統及材料層沉積方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chamber arrangement includes a chamber body, a substrate support, and an upper heater element array. The chamber body has injection and longitudinally opposite exhaust ends, the substrate support is arranged within the chamber body and supported therein for rotation about a rotation axis, and the upper heater element array is supported above the chamber body and include a laterally-inner first upper linear lamp and a laterally-inner second upper linear lamp. The laterally-inner first upper linear lamp is separated from the rotation axis by a first lateral spacing distance, the laterally-inner second upper linear lamp is separated from the rotation axis by a second lateral spacing distance, and one of the first lateral spacing distance and the second lateral spacing distance is greater than the other of the first lateral spacing distance the second lateral spacing distance. Semiconductor processing systems and material layer deposition methods are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板</p>
        <p type="p">4:材料層</p>
        <p type="p">104:腔室配置</p>
        <p type="p">111:下部腔室高度</p>
        <p type="p">113:上部腔室高度</p>
        <p type="p">115:閘閥</p>
        <p type="p">126:腔室主體</p>
        <p type="p">128:注入凸緣</p>
        <p type="p">130:排氣凸緣</p>
        <p type="p">134:分隔件</p>
        <p type="p">136:基板支撐件</p>
        <p type="p">138:支撐構件</p>
        <p type="p">140:軸構件</p>
        <p type="p">142:升降與旋轉模組</p>
        <p type="p">144:陶瓷材料</p>
        <p type="p">146:注入端</p>
        <p type="p">148:排氣端</p>
        <p type="p">150:內部</p>
        <p type="p">152:上壁</p>
        <p type="p">154:下壁</p>
        <p type="p">156:第一側壁</p>
        <p type="p">158:第二側壁</p>
        <p type="p">160:外部肋</p>
        <p type="p">162:外表面</p>
        <p type="p">182:不透明材料</p>
        <p type="p">184:上部腔室</p>
        <p type="p">186:下部腔室</p>
        <p type="p">188:分隔件孔</p>
        <p type="p">190:旋轉軸</p>
        <p type="p">192:不透明材料</p>
        <p type="p">200:上部加熱器元件陣列</p>
        <p type="p">300:上部反射器</p>
        <p type="p">400:下部加熱器元件陣列</p>
        <p type="p">500:下部反射器</p>
        <p type="p">600:非接觸式溫度感測器/第一基板高溫計</p>
        <p type="p">604:第二基板高溫計</p>
        <p type="p">606:第三基板高溫計</p>
        <p type="p">608:腔室高溫計</p>
        <p type="p">616:冷卻劑</p>
        <p type="p">R:旋轉</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="770px" img-content="tif" inline="yes" orientation="portrait" width="712px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623599</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123834</doc-number>
          <kind></kind>
          <date>114/06/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/78</main-classification>
        <further-classification edition="200601120260302B">G05B19/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　釗添</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, CHOW TIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派提爾　瑞吉維</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, RAJEEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/682,341</doc-number>
          <date>20240813</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/978,568</doc-number>
          <date>20241212</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有整體晶圓混合卡盤之薄膜框架載體</chinese-title>
        <english-title>FILM FRAME CARRIER WITH WHOLE WAFER HYBRID CHUCK</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種系統，該系統包含：一卡盤，其界定一平面表面及包圍該平面表面之周邊表面；複數個升降銷，其等安置於該卡盤之該平面表面中界定之複數個孔隙內；及複數個框架手柄，其等連接至該卡盤之該周邊表面。該複數個升降銷經組態以延伸出該複數個孔隙在該平面表面上方以支撐一整體晶圓，且該複數個框架手柄經組態以支撐一薄膜框架載體之一框架。該複數個升降銷經進一步組態以回縮至該複數個孔隙中在該平面表面下方，其中該卡盤之該平面表面經組態以支撐該薄膜框架載體之一晶圓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The system includes a chuck defining a planar surface and peripheral surface surrounding the planar surface, a plurality of lift pins disposed within a plurality of apertures defined in the planar surface of the chuck, and a plurality of frame handles connected to the peripheral surface of the chuck. The plurality of lift pins are configured to extend out of the plurality of apertures above the planar surface to support a whole wafer, and the plurality of frame handles are configured to support a frame of a film frame carrier. The plurality of lift pins are further configured to retract into the plurality of apertures beneath the planar surface, with the planar surface of the chuck being configured to support a wafer of the film frame carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">101:整體晶圓</p>
        <p type="p">110:卡盤</p>
        <p type="p">111:平面表面</p>
        <p type="p">112:周邊表面</p>
        <p type="p">113:孔隙</p>
        <p type="p">114:中心轂</p>
        <p type="p">115:微埠</p>
        <p type="p">116:安裝埠</p>
        <p type="p">120:升降銷</p>
        <p type="p">130:框架手柄</p>
        <p type="p">131:基座構件</p>
        <p type="p">132:墊片</p>
        <p type="p">140:真空源</p>
        <p type="p">150:致動器</p>
        <p type="p">160:處理器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="434px" img-content="tif" inline="yes" orientation="portrait" width="703px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622390</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114123961</doc-number>
          <kind></kind>
          <date>114/06/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260128B">F16C11/04</main-classification>
        <further-classification edition="200601120260128B">G06F1/16</further-classification>
        <further-classification edition="200601120260128B">H05K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHE-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱哲賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, CHE-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/722,043</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樞軸模組及電子裝置</chinese-title>
        <english-title>HINGE MODULE AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樞軸模組，包括基座、二轉動組件及連動組件。轉動組件樞設於基座，且彼此並列設置。二轉動組件包括二支架。連動組件滑設於轉動組件。一外接功能模組適於耦接於或分離於樞軸模組以使樞軸模組在第一狀態及第二狀態之間轉換。當樞軸模組處於第一狀態時，連動組件位於第一位置並抵接於其中一轉動組件，二支架相互平行並相對遠離彼此。當樞軸模組處於第二狀態時，連動組件位於第二位置並抵接於另一轉動組件，二支架相互平行並相對靠近彼此。一種電子裝置更被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hinge module includes a base, two rotating components and a linkage component. The rotating components are pivoted on the base and arranged side by side. The two rotating components include two brackets. The linkage component is slidably disposed on the rotating components. An external function module is adapted to being coupled on or separated from the hinge module to enable the hinge module to switch between a first state and a second state. When the hinge module is in the first state, the linkage component is located at a first position and abuts against one of the rotating components, and the two brackets are parallel to each other and relatively far away from each other. When the hinge module is in the second state, the linkage component is located at a second position and abuts against the other rotating components, and the two brackets are parallel to each other and relatively close to each other. AN ELECTRONIC DEVICE is further provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:樞軸模組</p>
        <p type="p">110:基座</p>
        <p type="p">120:第一轉動組件</p>
        <p type="p">121:第一支架</p>
        <p type="p">122:第一轉軸</p>
        <p type="p">130:第二轉動組件</p>
        <p type="p">131:第二支架</p>
        <p type="p">132:第二轉軸</p>
        <p type="p">133:第四抵接部</p>
        <p type="p">140:第一切換組件</p>
        <p type="p">141:第一本體</p>
        <p type="p">142:第一滑塊</p>
        <p type="p">1421:第一端</p>
        <p type="p">1422:第二端</p>
        <p type="p">143:第一凸輪</p>
        <p type="p">1431:第一限位凹槽</p>
        <p type="p">1432:第二限位凹槽</p>
        <p type="p">144:第二凸輪</p>
        <p type="p">1441:第三限位凹槽</p>
        <p type="p">150:第二切換組件</p>
        <p type="p">151:第二本體</p>
        <p type="p">152:第二滑塊</p>
        <p type="p">1521:第三端</p>
        <p type="p">1522:第四端</p>
        <p type="p">153:第三凸輪</p>
        <p type="p">1531:第四限位凹槽</p>
        <p type="p">1532:第五限位凹槽</p>
        <p type="p">154:第四凸輪</p>
        <p type="p">1541:第六限位凹槽</p>
        <p type="p">160:連動組件</p>
        <p type="p">161:滑動件</p>
        <p type="p">1611:第一連接部</p>
        <p type="p">162:止擋件</p>
        <p type="p">1621:第一抵接部</p>
        <p type="p">1623:第二連接部</p>
        <p type="p">163:第一磁性件</p>
        <p type="p">164:復位件</p>
        <p type="p">P2:第二位置</p>
        <p type="p">S2:第二狀態</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.png" file="d10032.TIF" giffile="ed10032.png" height="1012px" img-content="tif" inline="yes" orientation="portrait" width="732px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622292</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124078</doc-number>
          <kind></kind>
          <date>114/06/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23F1/38</main-classification>
        <further-classification edition="202601120260302B">H10P50/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商德山股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUYAMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉川由樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKKAWA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木雄山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, YUZAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-105525</doc-number>
          <date>20240628</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體用基板之處理液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種半導體用基板之處理液，其能去除半導體用基板所包含之釕等之高熔點金屬。&lt;br/&gt;[解決手段]藉由一種半導體用基板之處理液來獲得解決，該處理液係用以從包含高熔點金屬之半導體用基板去除高熔點金屬之半導體用基板之處理液，其中包含選自鹼金屬及鹼土類金屬之一種以上之金屬以及氧化劑，前述氧化劑為選自由次鹵酸離子、金屬錯合物及其鹽所成群之一種以上，且在25℃下之pH為7以上14以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622147</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124079</doc-number>
          <kind></kind>
          <date>114/06/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08G64/04</main-classification>
        <further-classification edition="200601120260225B">C08L69/00</further-classification>
        <further-classification edition="200601120260225B">C09D169/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清末祥哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIYOSUE, SYOUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川典慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, NORIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-104345</doc-number>
          <date>20240627</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>聚碳酸酯樹脂組成物、塗敷溶液及塗膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">需要一種既具備高柔軟性等又在色相方面亦優異之聚碳酸酯樹脂組成物。  &lt;br/&gt;　　上述課題藉由以下樹脂組成物解決。  &lt;br/&gt;　　亦即，一種聚碳酸酯樹脂組成物，係含有聚碳酸酯樹脂(A)與縮合磷酸酯(B)之樹脂組成物；  &lt;br/&gt;　　前述聚碳酸酯樹脂(A)含有來源於以下述通式(1)所表示之單體之構成單元。  &lt;br/&gt;&lt;img align="absmiddle" height="91px" width="264px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;通式(1)中，R&lt;sub&gt;1&lt;/sub&gt;至R&lt;sub&gt;4&lt;/sub&gt;以及R&lt;sub&gt;5&lt;/sub&gt;至R&lt;sub&gt;8&lt;/sub&gt;係分別獨立地表示氫、氟、氯、溴、或碘、或分別可具有取代基之碳數1至20之烷基、碳數6至12之芳基、碳數2至12之烯基、碳數1至5之烷氧基、或碳數7至17之芳烷基；  &lt;br/&gt;　　X係如本案說明書所記載。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622936</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124083</doc-number>
          <kind></kind>
          <date>114/06/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251001B">G09G3/20</main-classification>
        <further-classification edition="202001120251001B">H05B45/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>群創光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOLUX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>苗栗縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅閔馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, MIN-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾名駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, MING-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖宏昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, HUNG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/726,331</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種電子裝置。電子裝置包括基板、第一電子元件、第二電子元件、第一驅動電路、第二驅動電路以及第一控制電路。第一電子元件以及第二電子元件設置於基板的第一區域。第一驅動電路以及第二驅動電路設置於所述基板的第二區域。第一驅動電路耦接第一電子元件。第二驅動電路耦接第二電子元件。第一控制電路設置於基板的第二區域，並且耦接第一驅動電路以及第二驅動電路。第一控制電路包括第一判斷電晶體、第二判斷電晶體、第一輸入控制電晶體、第二輸入控制電晶體、第一重置電晶體以及第一電容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device is provided. The electronic device includes a substrate, a first electronic component, a second electronic component, a first drive circuit, a second drive circuit and a first control circuit. The first electronic component and the second electronic component are arranged in a first area of the substrate. The first drive circuit and the second drive circuit are arranged in a second area of the substrate. The first drive circuit is coupled to the first electronic component. The second drive circuit is coupled to the second electronic component. The first control circuit is arranged in the second area of the substrate and is coupled to the first drive circuit and the second drive circuit. The first control circuit includes a first judgment transistor, a second judgment transistor, a first input control transistor, a second input control transistor, a first reset transistor and a first capacitor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110_k、110_(k+1):驅動電路</p>
        <p type="p">120_k:控制電路</p>
        <p type="p">CL2:輸入信號線</p>
        <p type="p">RL:重置信號線</p>
        <p type="p">RST:重置信號</p>
        <p type="p">SINA2:輸入信號</p>
        <p type="p">SN[k-1]、SN[k]、SN[k+1]:輸出信號</p>
        <p type="p">SL[k]、SL[k+1]:信號線</p>
        <p type="p">VGL、VGH:參考電壓</p>
        <p type="p">T1~T5:電晶體</p>
        <p type="p">C1:電容</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="668px" img-content="tif" inline="yes" orientation="portrait" width="784px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622141</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124090</doc-number>
          <kind></kind>
          <date>114/06/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08G59/20</main-classification>
        <further-classification edition="200601120260225B">C08L63/00</further-classification>
        <further-classification edition="200601120260225B">C08K3/36</further-classification>
        <further-classification edition="201801120260225B">C08K3/013</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋元真歩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIMOTO, MAHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橫山耕祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOYAMA, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松永昌大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNAGA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-104896</doc-number>
          <date>20240628</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>固化性樹脂組成物及結構體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種固化性樹脂組成物。該固化性樹脂組成物含有環氧化合物、無機填充劑、偶合劑及聚合起始劑。環氧化合物包含脂環式環氧化合物。以環氧化合物的總量為基準，脂環式環氧化合物的含量為60質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623043</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124110</doc-number>
          <kind></kind>
          <date>114/06/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01J37/32</main-classification>
        <further-classification edition="200601120260224B">H03H7/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿札德　Ａ　Ｎ　Ｍ瓦塞科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZAD, A N M WASEKUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
              <english-address>BD</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉馬斯瓦米　卡堤克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASWAMY, KARTIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊特　尼可拉斯Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIGHT, NICOLAS J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/US24/39227</doc-number>
          <date>20240724</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有多級電漿阻抗匹配的基於二極體的射頻(RF)匹配網路</chinese-title>
        <english-title>DIODE-BASED RADIO FREQUENCY (RF) MATCHING NETWORK WITH MULTILEVEL PLASMA IMPEDANCE MATCHING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文件提供的各個態樣通常包括設備、電漿處理系統以及在射頻（RF）電漿處理系統中調整以改善基板處理指標的方法。某些態樣針對在電漿處理系統中處理基板的設備。該設備大體包括：（RF）訊號發生器；第一匹配網路；第二匹配網路；耦合在RF訊號發生器和第一匹配網路之間的第一二極體；耦合在RF訊號發生器和第二匹配網路之間的第二二極體；以及驅動器，其第一輸出耦合到第一二極體，第二輸出耦合到第二二極體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects provided herein generally include apparatus, plasma processing systems and methods for tuning in a radio frequency (RF) plasma processing system for improving substrate processing metrics. Some aspects are directed to an apparatus for processing a substrate in a plasma processing system. The apparatus generally includes: an RF signal generator; a first matching network; a second matching network; a first diode coupled between the RF signal generator and the first matching network; a second diode coupled between the RF signal generator and the second matching network; and a driver having a first output coupled to the first diode and a second output coupled to the second diode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:電路</p>
        <p type="p">302:RF發生器</p>
        <p type="p">304:DC阻擋電路</p>
        <p type="p">312:負載</p>
        <p type="p">314:RF阻擋電路</p>
        <p type="p">316:驅動器</p>
        <p type="p">324:RF阻擋電路</p>
        <p type="p">328:訊號</p>
        <p type="p">330:電容元件</p>
        <p type="p">332:電容元件</p>
        <p type="p">D1:PIN二極體</p>
        <p type="p">D2:PIN二極體</p>
        <p type="p">D3:PIN二極體</p>
        <p type="p">D4:PIN二極體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="711px" img-content="tif" inline="yes" orientation="portrait" width="684px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623499</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124303</doc-number>
          <kind></kind>
          <date>114/06/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260224B">H10K59/131</main-classification>
        <further-classification edition="202301120260224B">H10K59/122</further-classification>
        <further-classification edition="202301120260224B">H10K59/121</further-classification>
        <further-classification edition="202301120260224B">H10K59/80</further-classification>
        <further-classification edition="202301120260224B">H10K59/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星顯示器有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴注燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUCHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高裕敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YOOMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金惠琬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYEWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫藝林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, YERIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李弼錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PILSUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔忠碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, CHUNG SOCK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪性珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SUNGJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0107285</doc-number>
          <date>20240812</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置以及包含其之電子設備</chinese-title>
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置包含：基板，其包含顯示區域以及圍繞顯示區域的周邊區域；電源供應線，其設置在周邊區域中且供應低功率電壓；多個第一電極，其設置在顯示區域中且供應有高功率電壓；像素定義層，其設置在第一電極上且暴露出各第一電極的一部分以定義發射區域；輔助連接電極，其設置在像素定義層上且電性連接至電源供應線；電極層，其設置在第一電極以及輔助連接電極上，電性連接至輔助連接電極，且供應有低功率電壓；以及分隔件，其設置在輔助連接電極上，與輔助連接電極的一部分重疊，且將電極層分離為在顯示區域中彼此分隔開的多個第二電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a substrate including a display area and a peripheral area, a power supply line disposed in the peripheral area and supplying a low power voltage, multiple first electrodes disposed in the display area and supplied with a high power voltage, a pixel defining layer disposed on the first electrodes and exposing a portion of each of the first electrodes to define an emission area, an auxiliary connection electrode disposed on the pixel defining layer and connected to the power supply line, an electrode layer disposed on the first electrodes and the auxiliary connection electrode, connected to the auxiliary connection electrode, and supplied with the low power voltage, and a separator disposed on the auxiliary connection electrode, overlapping a portion of the auxiliary connection electrode, and separating the electrode layer into multiple second electrodes spaced apart from each other in the display area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">DA:顯示區域</p>
        <p type="p">DD:顯示裝置</p>
        <p type="p">DDV:資料驅動器</p>
        <p type="p">DL:資料線</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">GDV:閘極驅動器</p>
        <p type="p">GL:閘極線</p>
        <p type="p">NDA:周邊區域</p>
        <p type="p">PL:電源線</p>
        <p type="p">PX:像素</p>
        <p type="p">SUB:基板</p>
        <p type="p">VSL1:第一電源供應線</p>
        <p type="p">VSL2:第二電源供應線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.png" file="d10023.TIF" giffile="ed10023.png" height="847px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623020</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124328</doc-number>
          <kind></kind>
          <date>114/06/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250728B">H01H13/26</main-classification>
        <further-classification edition="200601120250728B">H01H13/02</further-classification>
        <further-classification edition="200601120250728B">H01H13/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達方電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARFON ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝育群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡志鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIEN, CHIH-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭紹崙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIAO, SHAO-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,689</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>按鍵結構及鍵盤</chinese-title>
        <english-title>KEYSWITCH STRUCTURE AND KEYBOARD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種按鍵結構，包含一底座、一上蓋及一鍵帽。該底座包含一下蓋及一彈性圓凸，該彈性圓凸設置於該下蓋的上方並具有一孔。該上蓋固定設置於該底座的上方並具有一開口。該鍵帽與該上蓋可卸地連接，該鍵帽具有一帽體及一撞擊柱，該帽體可滑動地穿過該開孔，該撞擊柱自該帽體朝向該底座突出並伸入該孔。其中，當朝向該上蓋按壓該鍵帽時，該鍵帽擠壓該彈性圓凸，且該撞擊柱撞擊該底座以產生聲響。一種鍵盤，包含複數個前述按鍵結構。該複數個按鍵結構的複數個上蓋由單一構件形成，該複數個按鍵結構的複數個下蓋由單一構件形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A keyswitch structure includes a base, an upper casing, and a keycap. The base includes a lower casing and an elastic dome. The elastic dome is disposed above the lower casing and has a hole. The upper casing is fixedly disposed above the base and has an opening. The keycap is detachably connected to the upper casing. The keycap has a keycap body and an impact post. The keycap body slidably passes through the opening. The impact post protrudes from the keycap body toward the base and extends into the hole. Therein, when the keycap is pressed toward to the upper casing, the key cap squeezes the elastic dome, and the impact post impacts the base to generate a sound. A keyboard includes a plurality of the keyswitch structures. The upper covers of the key structures are formed by a single component, and the lower covers of the key structures are formed by a single component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:按鍵結構</p>
        <p type="p">12:底座</p>
        <p type="p">122:下蓋</p>
        <p type="p">124:彈性圓凸</p>
        <p type="p">124a:孔</p>
        <p type="p">126:開關電路板</p>
        <p type="p">126a:孔</p>
        <p type="p">1262:上基板</p>
        <p type="p">1262a,1264a:環狀開關接點</p>
        <p type="p">1264:下基板</p>
        <p type="p">1266:間隔層</p>
        <p type="p">14:上蓋</p>
        <p type="p">142:開口</p>
        <p type="p">16:鍵帽</p>
        <p type="p">162:帽體</p>
        <p type="p">162a:導柱</p>
        <p type="p">162b:限位勾</p>
        <p type="p">164:撞擊柱</p>
        <p type="p">Dv:垂直方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="830px" img-content="tif" inline="yes" orientation="portrait" width="690px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623674</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124362</doc-number>
          <kind></kind>
          <date>114/06/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南亞科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYA TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅翊仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YI-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/951,912</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有漸縮導孔的半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE HAVING TAPERED VIA AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種半導體結構，包含第一晶粒、第二晶粒和第一導孔。第一晶粒包含第一基底、具有第一導電墊的第一互連結構，以及第一導電墊上的第一接合層。第二晶粒包含接合至第一接合層的第二接合層、第二接合層上的第二基底，以及第二互連結構。第一導孔貫穿第二晶粒和第一接合層，並耦接至第一導電墊。第一導孔包含具有第一寬度的第一部分，以及耦接至第一部分且具有第二寬度的第二部分，第二寬度不同於第一寬度，其中第一部分由第一接合層環繞並相鄰於第二互連結構，且第二部分由第二基底環繞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a semiconductor structure including a first die, a second die and a first via. The first die includes a first substrate, a first interconnect structure having a first conductive pad, and a first bonding layer over the first conductive pad. The second die includes a second bonding layer bonded to the first bonding layer, a second substrate over the second bonding layer, and a second interconnect structure. The first via extends through the second die and the first bonding layer and coupled to the first conductive pad. The first via includes a first portion having a first width and a second portion coupled to the first portion and having a second width different from the first width, wherein the first portion is surrounded by the first bonding layer and adjacent to the second interconnect structure, and the second portion is surrounded by the second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:第一晶粒</p>
        <p type="p">101a:第一基底</p>
        <p type="p">101b:第一互連層</p>
        <p type="p">101c:第一介電層</p>
        <p type="p">101d:第一互連結構</p>
        <p type="p">101e:第一墊部分</p>
        <p type="p">101f:第一導孔部分</p>
        <p type="p">101g:第一導電墊</p>
        <p type="p">101h:第一接合層</p>
        <p type="p">101j:第三導孔</p>
        <p type="p">101k:第一電子元件</p>
        <p type="p">101l:第一鈍化層</p>
        <p type="p">102:第二晶粒</p>
        <p type="p">102a:第二基底</p>
        <p type="p">102b:第二互連層</p>
        <p type="p">102c:第二介電層</p>
        <p type="p">102d:第二互連結構</p>
        <p type="p">102e:第二墊部分</p>
        <p type="p">102f:第二導孔部分</p>
        <p type="p">102g:第二導電墊</p>
        <p type="p">102h:第四接合層</p>
        <p type="p">102j:第二接合層</p>
        <p type="p">102k:第二電子元件</p>
        <p type="p">102l:第二鈍化層</p>
        <p type="p">103:第三晶粒</p>
        <p type="p">103a:第三基底</p>
        <p type="p">103b:第三互連層</p>
        <p type="p">103c:第三介電層</p>
        <p type="p">103d:第三互連結構</p>
        <p type="p">103e:第三墊部分</p>
        <p type="p">103f:第三導孔部分</p>
        <p type="p">103g:第三導電墊</p>
        <p type="p">103h:第五接合層</p>
        <p type="p">103j:第三接合層</p>
        <p type="p">103k:第三電子元件</p>
        <p type="p">103l:第三鈍化層</p>
        <p type="p">103x:界面</p>
        <p type="p">104:導電凸塊</p>
        <p type="p">105:模製件</p>
        <p type="p">106:第一導孔</p>
        <p type="p">106a:第一部分</p>
        <p type="p">106b:第二部分</p>
        <p type="p">106c:阻障層</p>
        <p type="p">106i:界面</p>
        <p type="p">106s:階梯狀結構</p>
        <p type="p">106x:第一接觸表面區域</p>
        <p type="p">107:第二導孔</p>
        <p type="p">107a:第一部分</p>
        <p type="p">107b:第二部分</p>
        <p type="p">107c:阻障層</p>
        <p type="p">107i:界面</p>
        <p type="p">107s:階梯狀結構</p>
        <p type="p">107x:第二接觸表面區域</p>
        <p type="p">108:承載基底</p>
        <p type="p">200:第二半導體結構</p>
        <p type="p">201:中介層</p>
        <p type="p">A1:第一剖面區域</p>
        <p type="p">A2:第二剖面區域</p>
        <p type="p">A3:第三剖面區域</p>
        <p type="p">A4:第四剖面區域</p>
        <p type="p">W1:第一寬度</p>
        <p type="p">W2:第二寬度</p>
        <p type="p">W3:第一寬度</p>
        <p type="p">W4:第二寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.JPG" file="ed10028.JPG" height="773px" img-content="tif" inline="yes" orientation="portrait" width="957px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622139</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124407</doc-number>
          <kind></kind>
          <date>114/06/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08G18/48</main-classification>
        <further-classification edition="200601120260225B">C08G18/72</further-classification>
        <further-classification edition="200601120260225B">C08L75/08</further-classification>
        <further-classification edition="200601120260225B">C08J9/12</further-classification>
        <further-classification edition="200601320260225B">C08G101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商巴斯夫歐洲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASF SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波伊索特　艾爾瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POESELT, ELMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞其曼　西蒙　亨德利克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIECHMANN, SIMON HENDRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳殿軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, DIAN JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冠勛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, GUAN SHIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏斯魯　歐茲曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USLU, OZAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多羅迪安　艾米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOROODIAN, AMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24185513.9</doc-number>
          <date>20240628</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>TPU泡沫</chinese-title>
        <english-title>TPU FOAM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於熱塑性聚胺甲酸酯泡沫，其係藉由泡沫射出成型來獲得，其具有於自100至220 kg/m&lt;sup&gt;3&lt;/sup&gt;的範圍的密度，其包含熱塑性聚胺甲酸酯（TPU-1）及根據ASTM D395:2018測定低於45%的壓縮永久變形。本發明進一步關於熱塑性聚胺甲酸酯泡沫，其包含熱塑性聚胺甲酸酯（TPU*），該熱塑性聚胺甲酸酯（TPU*）係自多元醇組成物（PC）製備，該多元醇組成物（PC）包含至少一種多元醇（P1），該多元醇（P1）具有於自500至5000 g/mol的範圍，較佳於自550至3000 g/mol的範圍的分子量Mn，其於動態掃描量熱法（DSC）之第一加熱運行中不顯示可由於-10至20°C的溫度範圍內的吸熱峰見到的軟相結晶程度及大於0.7 mJ/mg TPU的焓，該動態掃描量熱法（DSC）係於預處理後根據DIN EN ISO 11357-3:2013使用20°C/min的加熱速率，該預處理包括退火步驟及分開的於緊鄰測量前於100°C下10 min的乾燥步驟，且其具有＞ 50 g/10 min的熔體流動速率（MFR），該熔體流動速率（MFR）係於190°C及21.6 kg的負載下根據DIN EN ISO 1133-1:2022測定，偏離限定的測量時間60 s而非限定的活塞路徑長度，或於自5至50 g/10 min的範圍的熔體流動速率（MFR），該熔體流動速率（MFR）係於190°C及21.6 kg的負載下根據DIN EN ISO 1133-1:2022測定，偏離限定的測量時間60 s而非限定的活塞路徑長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a thermoplastic polyurethane foam obtained by foam injection molding with a density in the range of from 100 to 220 kg/m&lt;sup&gt;3&lt;/sup&gt; comprising a thermoplastic polyurethane (TPU-1) and a compression set below 45% determined according to ASTM D395:2018. The invention furthermore relates to a thermoplastic polyurethane foam comprising a thermo-plastic polyurethane ((TPU*) which is prepared from a polyol composition (PC) comprising at least one polyol (P1) with a molecular weight Mn in the range of from 500 to 5000 g/mol, preferably in the range of from 550 to 3000 g/mol, which does not show a degree of soft phase crystallization visible by an endothermal peak in the temperature range of -10 to 20 °C with an enthalpy of greater than 0.7 mJ/mg TPU in the first heating run of a dynamic scanning calorimetry (DSC) according to DIN EN ISO 11357-3:2013 with a heating rate of 20 °C/min after a pre-treatment including an annealing step and a separate drying step at 100 °C for 10 min immediately before the measurement and which has a melt flow rate (MFR) of ＞ 50 g/10 min at 190 °C and a load of 21.6 kg determined according to DIN EN ISO 1133-1:2022 deviating by a defined measuring time of 60 s instead of a defined path length of the piston or a melt flow rate (MFR) in the range of from 5 to 50 g/10 min at 190 °C and a load of 21.6 kg determined according to DIN EN ISO 1133-1:2022 deviating by a defined measuring time of 60 s instead of a defined path length of the piston.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623559</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124508</doc-number>
          <kind></kind>
          <date>114/06/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="200601120260302B">B65D85/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商未來兒股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRAIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溜渕晴也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAMARIBUCHI, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/023364</doc-number>
          <date>20240627</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板收納容器、過濾器部以及塊狀過濾器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板收納容器（1）具備：容器主體（2）；蓋體；密封部件；以及過濾器部（80），具有能夠將基板收納空間（27）與容器主體（2）的外部的空間連通的通氣路（801）、配置於通氣路（801）的過濾器（85）以及形成通氣路（801）的殼體（81、82、83、84），配置於容器主體（2），氣體能夠經過過濾器（85）在容器主體（2）的外部的空間與基板收納空間（27）之間通過，向容器主體（2）的外部開口的殼體（81~84）的開口部（802）具有形成向容器主體（2）的內部凹陷的凹部（847）的被嵌合凹部形成部，在凹部（847）嵌合設置有塊狀過濾器（8441）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">24:下壁</p>
        <p type="p">80:供氣用過濾器部</p>
        <p type="p">81:內側開口形成部</p>
        <p type="p">82:第1殼體部</p>
        <p type="p">83:噴嘴部</p>
        <p type="p">84:第2殼體部</p>
        <p type="p">85:過濾器</p>
        <p type="p">86:閥芯</p>
        <p type="p">87:彈簧</p>
        <p type="p">88:密接墊</p>
        <p type="p">89:O形環</p>
        <p type="p">801:通氣路</p>
        <p type="p">802:外部空間側開口</p>
        <p type="p">803:外部空間側收納室開口</p>
        <p type="p">804:閥芯收納室</p>
        <p type="p">806:貫通孔</p>
        <p type="p">807:基板收納空間側開口</p>
        <p type="p">811:圓形狀突出部</p>
        <p type="p">815:凹部</p>
        <p type="p">821:筒狀部</p>
        <p type="p">822:端部凸緣部</p>
        <p type="p">823:端部板狀部</p>
        <p type="p">824:小凸緣部</p>
        <p type="p">825:突部</p>
        <p type="p">831:筒狀部</p>
        <p type="p">832:O形環</p>
        <p type="p">833:外徑大徑部</p>
        <p type="p">834:徑縮小部</p>
        <p type="p">841:筒狀部</p>
        <p type="p">842:端部內方突出部</p>
        <p type="p">843:端部軸向突出部</p>
        <p type="p">844:外部突出部</p>
        <p type="p">861:密封壁</p>
        <p type="p">862:密封面</p>
        <p type="p">866:O形環</p>
        <p type="p">8441:塊狀過濾器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="738px" img-content="tif" inline="yes" orientation="portrait" width="808px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623008</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124617</doc-number>
          <kind></kind>
          <date>114/06/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">H01F27/28</main-classification>
        <further-classification edition="200601120260226B">H01F27/08</further-classification>
        <further-classification edition="200601120260226B">H01F27/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃浩翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, HAO-SHIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張家熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIA-HSI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/763,443</doc-number>
          <date>20240703</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電源模組</chinese-title>
        <english-title>A POWER MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明請求保護一種電源模組，包括基板、多個功率元件、磁性組件、金屬塗層、以及散熱器。基板包括頂面、底面和至少一個側邊緣面，其中側邊緣面在基板的頂面和底面之間延伸。多個功率元件放置於基板的頂面。磁性組件放置於基板。該磁性組件包括磁芯、一次線圈、二次線圈，一次線圈和二次線圈纏繞該磁芯。金屬塗層覆蓋該至少一個側邊緣面的至少一部分。散熱器放置於多個功率元件的上方，其中該散熱器連接至所述金屬塗層。本發明的電源模組透過金屬塗層將熱量從基板傳導至散熱器，且線圈的走線具有更大的面積，因此具有更好的熱效能和更低的損耗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power module is disclosed. The power module has a substrate, a plurality of power devices, a magnetic component, a metallic coating, and a heat spreader. The substrate has a top surface, a bottom surface, and at least one side edge surface. The side edge surface extends between the top surface and the bottom surface. The plurality of power devices are disposed on the top surface of the substrate. The magnetic component is disposed on the substrate. The magnetic has a magnetic core, a primary winding, and a secondary winding, and the primary winding and the secondary winding are wound on the magnetic core. The metallic coating covers at least a portion of the at least one side edge surface of the substrate. The heat spreader is disposed on top of the plurality of power devices, and the heat spreader is connected to the metallic coating. The power module of the present disclosure transmits heat from the substrate to the heat spreader via the metallic coating, and traces of the windings have larger area, thus the power module has better thermal performance and reduced loss.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電源模組</p>
        <p type="p">210:基板</p>
        <p type="p">210A:頂面</p>
        <p type="p">210B:底面</p>
        <p type="p">212:側邊緣面</p>
        <p type="p">220:功率元件</p>
        <p type="p">230:連接器</p>
        <p type="p">240:磁性元件</p>
        <p type="p">250:被動元件</p>
        <p type="p">260a:第一部分</p>
        <p type="p">260b:第二部分</p>
        <p type="p">280:散熱器</p>
        <p type="p">282a:支撐端子</p>
        <p type="p">282b:支撐端子</p>
        <p type="p">TA:導熱黏合劑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.bmp" file="ed10004.bmp" height="606px" img-content="tif" inline="yes" orientation="portrait" width="1083px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623028</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124657</doc-number>
          <kind></kind>
          <date>114/06/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">H01J37/05</main-classification>
        <further-classification edition="200601120260226B">H01J37/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東實先進股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TASMIT, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嘉藤誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-109716</doc-number>
          <date>20240708</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>圖像生成裝置及圖像生成方法</chinese-title>
        <english-title>IMAGE GENERATION DEVICE AND IMAGE GENERATION METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">圖像生成裝置具備：維恩過濾器（108），係具備多極子構造；動作控制部（150），係使滿足維恩條件的電場及磁場形成在維恩過濾器，且藉由對於複數極之各者施加相同的電壓而使軸對稱透鏡場形成在維恩過濾器；下側分路器（120），係配置在維恩過濾器（108）的下方，且具有通孔（123）；及電子檢測器（107），係檢測藉由維恩過濾器（108）按照能量而分散之二次電子當中的至少具備預定的能量之二次電子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An image generation device includes: a Wien filter (108) with a multipole structure; an operation control unit (150) that forms an axially symmetric lens field in Wien filter by applies same voltage to each of multiple poles and forms electric field and magnetic field satisfying a Wien conditions; a lower shunt (120) having a through hole (123) and positioned below the Wien filter (108); and an electron detector (107) that detects secondary electrons with at least a predetermined energy among the secondary electrons dispersed according to energy by the Wien filter (108).</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:電子槍</p>
        <p type="p">102:聚光透鏡系統(電子光學系統)</p>
        <p type="p">103:一次電子射線</p>
        <p type="p">104:二次電子射線</p>
        <p type="p">105:對物透鏡(電子光學系統)</p>
        <p type="p">106:試料</p>
        <p type="p">107:電子檢測器</p>
        <p type="p">107a:檢測面</p>
        <p type="p">108:維恩過濾器</p>
        <p type="p">112:偏向器</p>
        <p type="p">115:上側分路器</p>
        <p type="p">120:下側分路器</p>
        <p type="p">120a:面</p>
        <p type="p">121:圖像化裝置</p>
        <p type="p">123:通孔</p>
        <p type="p">130:狹縫</p>
        <p type="p">130a:面(能量分散面)</p>
        <p type="p">135:二次電子聚焦透鏡</p>
        <p type="p">150:動作控制部</p>
        <p type="p">150a:記憶裝置</p>
        <p type="p">150b:演算裝置</p>
        <p type="p">150c:電源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="902px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623600</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124705</doc-number>
          <kind></kind>
          <date>114/06/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/78</main-classification>
        <further-classification edition="202601120260302B">H10W40/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＡＴＴ先進溫度測試系統有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾伯　馬克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EIBL, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歌德克斯特　馬克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUTEKUNST, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>10 2024 118 557.0</doc-number>
          <date>20240701</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>卡盤系統，用於將半導體晶圓保持在卡盤上之方法及用途</chinese-title>
        <english-title>CHUCK SYSTEM, METHOD AND USE FOR HOLDING A SEMICONDUCTOR WAFER ON A CHUCK</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種卡盤系統(1)經形成以將半導體晶圓(100)保持於卡盤(20)上，且具有蒸氣室(10)，該蒸氣室(10)具有經形成以吸熱之蒸發表面(11)。該蒸氣室(10)復具有經形成以散熱之冷凝表面(12)，以及設於該蒸發表面(11)與該冷凝表面(12)之間之流體室(15)，於其中設置冷卻流體。該蒸氣室(10)係形成為卡盤附件，其中，當在操作位置附著於該卡盤(20)上時，該冷凝表面(12)與該卡盤(20)進行熱交換，且該蒸發表面(11)經形成以保持且溫度控制該半導體晶圓(100)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chuck system (1) is formed for holding a semiconductor wafer (100) on a chuck (20) and has a vapor chamber (10) with an evaporation surface (11) formed for heat absorption. The vapor chamber (10) further has a condensation surface (12) formed for heat dissipation, and a fluid chamber (15) disposed between the evaporation surface (11) and the condensation surface (12), in which a cooling fluid is disposed. </p>
        <p type="p">The vapor chamber (10) is formed as a chuck attachment, in which, when attached on the chuck (20) in an operating position, the condensation surface (12) is in heat exchange with the chuck (20), and the evaporation surface (11) is formed to hold and temperature-control the semiconductor wafer (100).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:卡盤系統</p>
        <p type="p">10:蒸氣室</p>
        <p type="p">11:蒸發表面</p>
        <p type="p">12:冷凝表面</p>
        <p type="p">14:保持凹部</p>
        <p type="p">15:流體室</p>
        <p type="p">16:芯吸材料</p>
        <p type="p">17:間隔柱</p>
        <p type="p">18:殼體邊緣</p>
        <p type="p">20:卡盤</p>
        <p type="p">21:溫度控制表面</p>
        <p type="p">100:半導體晶圓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="569px" img-content="tif" inline="yes" orientation="portrait" width="1036px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623353</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124760</doc-number>
          <kind></kind>
          <date>114/06/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260224B">H10B12/00</main-classification>
        <further-classification edition="202501120260224B">H10D30/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美光科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史派特金　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPEETJENS, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李程</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　艾爾伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, ALBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴寇克　大衛　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAYCOCK, DAVID A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金道俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔正憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JEONG-HEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,581</doc-number>
          <date>20240723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>垂直三維(3D)記憶體中之數位線形成</chinese-title>
        <english-title>DIGIT LINE FORMATION IN VERTICAL THREE-DIMENSIONAL (3D) MEMORY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於具有水平定向存取裝置及儲存節點之一垂直堆疊記憶體胞元陣列之系統、方法及設備。該等水平定向存取裝置具有藉由通道區分離開之第一源極/汲極區及第二源極/汲極區。完全圍繞該通道區之每一表面形成該等通道區處之閘極作為藉由閘極介電質與通道區分離開之環繞式閘極(GAA)結構。該等記憶體胞元具有連接至該等第二源極/汲極區之水平定向儲存節點及連接至該等第一源極/汲極區之數位線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems, methods and apparatus are provided for an array of vertically stacked memory cells having horizontally oriented access devices and storage nodes. The horizontally oriented access devices having first source/drain regions and second source/drain regions separated by channel regions. Gates at the channel regions formed fully around every surface of the channel region as gate-all-around (GAA) structures separated from channel regions by gate dielectrics. The memory cells have horizontally oriented storage nodes connected to the second source/drain regions and digit lines connected to the first source/drain regions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">332-1:矽(Si)材料</p>
        <p type="p">332-2:矽(Si)材料</p>
        <p type="p">332-3:矽(Si)材料</p>
        <p type="p">332-N:矽(Si)材料</p>
        <p type="p">333:第二介電材料</p>
        <p type="p">335:光微影遮罩材料</p>
        <p type="p">339:第一介電材料</p>
        <p type="p">342:第二層間介電材料</p>
        <p type="p">367:層間介電質(ILD)填充材料</p>
        <p type="p">370:第二導電材料</p>
        <p type="p">372:金屬材料</p>
        <p type="p">374:儲存節點</p>
        <p type="p">377:第一導電材料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.JPG" file="ed10032.JPG" height="719px" img-content="tif" inline="yes" orientation="portrait" width="961px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622640</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124815</doc-number>
          <kind></kind>
          <date>114/07/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">G03F7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾培傑尼　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPEGGIANI, FILIPPO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古特　路易絲　卡琳娜　勞里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOUTEUX, LOUISE KARINA LAURIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>休斯曼　賽門　雷納德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUISMAN, SIMON REINALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/670,303</doc-number>
          <date>20240712</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於光學量測資訊之緊密型顯示之系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR COMPACT DISPLAY OF OPTICAL MEASUREMENT INFORMATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種度量衡裝置，該度量衡裝置接收與一基板上之一圖案相互作用的輻射。該度量衡裝置包括一光學模組，該光學模組將該輻射分成該光學模組之一第一臂中之一第一輻射及該光學模組之一第二臂中之一第二輻射。該光學模組之該第二臂含有一光楔。該光楔之一第一分段更改正繞射階之一行進角度，且該光楔之一第二分段更改負繞射階之一行進角度，使得該等正繞射階與該等負繞射階為空間上分離的。該光楔之該第一分段及該第二分段引導正繞射階以在一偵測器上形成一第一影像，且引導負繞射階以在一偵測器上形成一第二影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A metrology device receives radiation that has interacted with a pattern on a substrate. The metrology device includes an optical module that splits the radiation into a first radiation in a first arm of the optical module and a second radiation in a second arm of the optical module. The second arm of the optical module contains an optical wedge. A first segment of the optical wedge alters an angle of travel of positive diffraction orders and a second segment of the optical wedge alters an angle of travel of negative diffraction orders, such that the positive and negative diffraction orders are spatially separated. The first and second segments of the optical wedge direct positive diffraction orders to form a first image on a detector and negative diffraction orders to form a second image on a detector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">602:光學模組</p>
        <p type="p">604:偵測器</p>
        <p type="p">606:物鏡</p>
        <p type="p">608:點鏡面</p>
        <p type="p">610:非偏振光束分光器</p>
        <p type="p">612:第一輻射</p>
        <p type="p">613:鏡面</p>
        <p type="p">614:第二輻射</p>
        <p type="p">616:光學元件</p>
        <p type="p">618:第二臂組件</p>
        <p type="p">620:鏡面</p>
        <p type="p">622:鏡面</p>
        <p type="p">624:透鏡</p>
        <p type="p">626:摺疊式光學器件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="648px" img-content="tif" inline="yes" orientation="portrait" width="457px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623017</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124824</doc-number>
          <kind></kind>
          <date>114/07/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">H01G9/022</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳里多股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARLIT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊賀上祥汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGAUE, SHOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和田直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WADA, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相澤恭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIZAWA, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村真奈美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, MANAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-147284</doc-number>
          <date>20240829</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電解電容器用電解液及電解電容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的電解電容器用電解液，係至少含有：(A)膠體二氧化矽、(B)聚醚改質聚矽氧系界面活性劑、(C)電解質鹽、及(D)有機溶劑的電解電容器用電解液；其中，  &lt;br/&gt;(A)膠體二氧化矽的平均粒徑係5~15nm，且含有作為添加劑之(E)，上述(E)為下述一般式(1)所示至少1種以上的磷酸酯化合物；  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="159px" width="234px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式(1)中，R&lt;sup&gt;1&lt;/sup&gt;係表示氫原子、碳數1~10之烷基、苯基、苄基；R&lt;sup&gt;2&lt;/sup&gt;係表示碳數1~10之烷基、苯基、苄基；又，R&lt;sup&gt;1&lt;/sup&gt;與R&lt;sup&gt;2&lt;/sup&gt;分別可為相同亦可為不同)  &lt;br/&gt;(E)磷酸酯化合物之合計相對於(A)膠體二氧化矽為1的質量比，係0.01~2.0。  &lt;br/&gt;藉由本發明的電解電容器用電解液及含有其的電解電容器，可提供具有高火花電壓、電導度優異、經長時間使用仍可抑制電解液凝膠化且耐久性優異的電解電容器用電解液。又，使用此種電解電容器用電解液，可提供耐電壓特性優異的電解電容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623399</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124837</doc-number>
          <kind></kind>
          <date>114/07/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260225B">H10D30/66</main-classification>
        <further-classification edition="202501120260225B">H10D12/00</further-classification>
        <further-classification edition="202501120260225B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商瑞薩電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RENESAS ELECTRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-131279</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一半導體基板之一第一主表面上形成具有一上部分及一下部分之一層間絕緣膜。此外，形成穿透該層間絕緣膜之一接觸孔，且在該接觸孔中形成一接觸部件。在橫截面視圖中，該接觸孔在一第一方向上之寬度在該接觸孔之一上端處比在一下端處更寬，且在對應於該層間絕緣膜之該上部分之一深度處比在對應於該層間絕緣膜之該下部分之一深度處更寬。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An interlayer insulating film having an upper portion and a lower portion is formed on a first main surface of a semiconductor substrate. Furthermore, a contact hole penetrating the interlayer insulating film is formed, and a contact member is formed in the contact hole. In the cross-sectional view, the width of the contact hole in a first direction is wider at an upper end than at a lower end of the contact hole, and is wider at a depth corresponding to the upper portion of the interlayer insulating film than at a depth corresponding to the lower portion of the interlayer insulating film.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:射極電極</p>
        <p type="p">11:接觸孔</p>
        <p type="p">11a:接觸部件</p>
        <p type="p">26a:上部分</p>
        <p type="p">26b:下部分</p>
        <p type="p">Φ1:傾斜角</p>
        <p type="p">Φ2:傾斜角</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10036.JPG" file="ed10036.JPG" height="566px" img-content="tif" inline="yes" orientation="portrait" width="667px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622305</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114124857</doc-number>
          <kind></kind>
          <date>114/07/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251229B">C30B29/06</main-classification>
        <further-classification edition="200601120251229B">C30B15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMCO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沖田憲治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKITA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-204744</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>細粉去除裝置、細粉去除方法以及矽原料之填充方法</chinese-title>
        <english-title>FINE POWDER REMOVAL DEVICE, FINE POWDER REMOVAL METHOD, AND SILICON RAW MATERIAL FILLING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供可以適當去除充填管內的細粉的細粉去除裝置。  &lt;br/&gt;[解決方案] 細粉去除裝置係將構成為下端的開口能夠開閉並且填充有矽原料的充填管內的細粉去除，包括抽吸前述細粉的抽吸管嘴、以及使前述抽吸管嘴在前述充填管的內部與外部之間移動的管嘴移動部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Subject] Provides a fine powder removal device that can properly remove fine powder from a filling pipe. &lt;br/&gt;[Solution] The fine powder removal device removes fine powder from the filling pipe filled with silicon raw material and has an opening at a lower end that may be opened and closed. The fine powder removal device includes a suction nozzle for sucking the fine powder and a nozzle moving portion for moving the suction nozzle between inside and outside of the filling pipe.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1,1A:細粉去除裝置</p>
        <p type="p">2:傾斜度調整部</p>
        <p type="p">3:旋轉部</p>
        <p type="p">4:吹出部</p>
        <p type="p">5:內側抽吸部</p>
        <p type="p">6:管嘴移動部</p>
        <p type="p">7:外側抽吸部</p>
        <p type="p">8:重量計</p>
        <p type="p">9:充填管</p>
        <p type="p">21:基部</p>
        <p type="p">22:框架部</p>
        <p type="p">23:旋轉軸體</p>
        <p type="p">24:支持體</p>
        <p type="p">25:傾斜馬達</p>
        <p type="p">31:轉盤</p>
        <p type="p">32:收容筒部</p>
        <p type="p">33:保持部</p>
        <p type="p">34:旋轉導引部</p>
        <p type="p">41:吹出管嘴固定部</p>
        <p type="p">42:被保持部</p>
        <p type="p">43:配管收容部</p>
        <p type="p">44:吹出管嘴</p>
        <p type="p">44A:第一吹出管嘴</p>
        <p type="p">44B:第二吹出管嘴</p>
        <p type="p">44C:第三吹出管嘴</p>
        <p type="p">44D:第四吹出管嘴</p>
        <p type="p">44E:第五吹出管嘴</p>
        <p type="p">44F:第六吹出管嘴</p>
        <p type="p">44G:第七吹出管嘴</p>
        <p type="p">44H:第八吹出管嘴</p>
        <p type="p">44I:第九吹出管嘴</p>
        <p type="p">44J:第十吹出管嘴</p>
        <p type="p">45:氣體供給部</p>
        <p type="p">51:抽吸管嘴</p>
        <p type="p">52:被保持部</p>
        <p type="p">53:配管</p>
        <p type="p">54:內側負壓產生部</p>
        <p type="p">61:移動保持部</p>
        <p type="p">62:移動驅動部</p>
        <p type="p">63:移動導引部</p>
        <p type="p">71:外側抽吸體</p>
        <p type="p">72:配管</p>
        <p type="p">73:外側負壓產生部</p>
        <p type="p">91:充填管主體</p>
        <p type="p">91A:上端開口</p>
        <p type="p">92:凸緣構件</p>
        <p type="p">93:開閉構件</p>
        <p type="p">221:鉛直部</p>
        <p type="p">222:水平延伸部</p>
        <p type="p">241:底壁部</p>
        <p type="p">242:側壁部</p>
        <p type="p">331:蓋部</p>
        <p type="p">331A:嵌合孔</p>
        <p type="p">332:導引突部</p>
        <p type="p">341:導引槽</p>
        <p type="p">511:抽吸孔</p>
        <p type="p">611:螺帽部</p>
        <p type="p">612:導引孔</p>
        <p type="p">621:移動馬達</p>
        <p type="p">622:軸承</p>
        <p type="p">623:螺桿軸</p>
        <p type="p">631:導引桿</p>
        <p type="p">632:下支持部</p>
        <p type="p">633:上支持部</p>
        <p type="p">921:凸緣主體</p>
        <p type="p">922:支持片</p>
        <p type="p">923:貫通孔</p>
        <p type="p">931:軸</p>
        <p type="p">932:底蓋</p>
        <p type="p">A:氣體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="989px" img-content="tif" inline="yes" orientation="portrait" width="662px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623462</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125017</doc-number>
          <kind></kind>
          <date>114/07/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260223B">H10F39/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安川浩永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUKAWA, HIROHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大平光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHIRA, HIKARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-130111</doc-number>
          <date>20240806</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-227823</doc-number>
          <date>20241224</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝、攝像裝置、電子機器、及半導體封裝之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本技術之目的在於，於晶圓級封裝中實現高速傳送。  &lt;br/&gt;本技術之半導體封裝具備半導體晶片、第1塑模樹脂、貫通通孔及重佈線層。於該半導體封裝中，第1塑模樹脂覆蓋半導體晶片之側面。又，於半導體封裝中，貫通通孔貫通第1塑模樹脂。又，重佈線層將連接設置於半導體晶片之正面之晶片焊墊與貫通通孔之一端的共面波導作為重佈線而配線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:半導體封裝</p>
        <p type="p">210:玻璃</p>
        <p type="p">220:CIS晶片</p>
        <p type="p">221:像素部</p>
        <p type="p">222:晶片焊墊</p>
        <p type="p">230:塑模樹脂</p>
        <p type="p">240:重佈線層</p>
        <p type="p">250:重佈線</p>
        <p type="p">260:TMV</p>
        <p type="p">271:平面焊墊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10062.JPG" file="ed10062.JPG" height="441px" img-content="tif" inline="yes" orientation="portrait" width="570px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621797</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125042</doc-number>
          <kind></kind>
          <date>114/07/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120250923B">B05B11/10</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾建傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, JIAN JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾煜琇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, YU SHIOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾駿閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, JIUN HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>屏東縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾文波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, WEN PO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾建傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, JIAN JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾駿閎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSENG, JIUN HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113145700</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>液體施配器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種液體施配器，其底部結合一容器，包含：一電泵腔穴，其前壁往外凸設一噴嘴；一圓形腔穴，其設有連通容器內部之汲入孔，及連通電泵腔穴之一第一通孔及一第二通孔；一插設在電泵腔穴之電動泵單元，其具有一電動泵室；及一局部插設在圓形腔穴之手動泵單元，其具有一手動泵室；藉由操控手動泵單元，可促使汲入孔、第一通孔、電動泵室，及噴嘴串聯構成一條電動泵送路徑；及促使汲入孔、手動泵室、第二通孔，及噴嘴串聯構成一條手動泵送路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">100:液體施配器</p>
        <p type="p">101a:握持部</p>
        <p type="p">101b:托部</p>
        <p type="p">102:前壁</p>
        <p type="p">103:流體通孔</p>
        <p type="p">104:圓形腔穴</p>
        <p type="p">104a:前伸部</p>
        <p type="p">110:手動泵單元</p>
        <p type="p">112:旋控部</p>
        <p type="p">140:按鈕</p>
        <p type="p">150:電動泵單元</p>
        <p type="p">170:電路板</p>
        <p type="p">171:微動開關</p>
        <p type="p">177:彈性電接器</p>
        <p type="p">179:密封蓋</p>
        <p type="p">180:電池</p>
        <p type="p">181:噴嘴</p>
        <p type="p">190:容器</p>
        <p type="p">Ma:電動噴出標誌</p>
        <p type="p">Mb:手動噴出標誌</p>
        <p type="p">R10:電泵腔室</p>
        <p type="p">T:指標</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="1023px" img-content="tif" inline="yes" orientation="portrait" width="690px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622006</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125076</doc-number>
          <kind></kind>
          <date>114/07/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C03B17/06</main-classification>
        <further-classification edition="200601120260223B">C03B7/01</further-classification>
        <further-classification edition="200601120260223B">C03B5/08</further-classification>
        <further-classification edition="200601120260223B">F16L57/04</further-classification>
        <further-classification edition="200601120260223B">G21F1/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恰卡波堤　阿立塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAKRABORTY, ARITRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>常思遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, SIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈林頓　偉德勒瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRINGTON, WADE LEROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金振洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>具本亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, BONHYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘格爾　大衛Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANGLE, DAVID S</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔普類　德瑞克艾登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIPLETT, DEREK ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/666,801</doc-number>
          <date>20240702</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於玻璃製造之流塊以及對應總成、系統及方法</chinese-title>
        <english-title>FLOW BLOCK FOR USE IN GLASS MANUFACTURING, AND CORRESPONDING ASSEMBLIES, SYSTEMS, AND METHODS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了減少一玻璃製造設備內之腐蝕之系統及方法。該玻璃製造設備包含具有一流塊總成之一熔化容器，該流塊總成提供一內部體積與下游製程之間的一管路。該流塊總成包含至少一個耐火磚，該至少一個耐火磚界定背對耐火材料之一內部體積之一外側及面朝該耐火材料之該內部體積之一內側。該內側之至少一部分包含由一耐腐蝕包層材料形成之一包層。該流塊總成進一步包含界定一內端及一相對外端之一管，該管穿過該至少一個耐火磚安置，使得該內端延伸超出該至少一個耐火磚之該內側，且該外端延伸超出該外側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and method of reducing corrosion within a glass manufacturing apparatus are provided herein. The glass manufacturing apparatus comprises a melting vessel having a flow block assembly which provides a conduit between an inside volume and downstream process. The flow block assembly comprises at least one refractory brick defining an exterior side for facing away from an inside volume of the refractory and an interior side for facing toward the inside volume of the refractory. At least a portion of the interior side comprises a cladding formed from a corrosion resistant cladding material. The flow block assembly further comprises a tube defining an interior end and an opposite exterior end disposed through the at least one refractory brick such that the interior end extends beyond the interior side of the at least one refractory brick, and the exterior end extends beyond the exterior side.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:耐火磚</p>
        <p type="p">110:流塊</p>
        <p type="p">120:包層</p>
        <p type="p">132:管</p>
        <p type="p">140:凸緣</p>
        <p type="p">146:圓周表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="817px" img-content="tif" inline="yes" orientation="portrait" width="714px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622456</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125083</doc-number>
          <kind></kind>
          <date>114/07/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251008B">G01B11/06</main-classification>
        <further-classification edition="200601120251008B">G01N21/25</further-classification>
        <further-classification edition="200601120251008B">G06F17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯塚正樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIZUKA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤森公佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMORI, KOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-204703</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>膜厚測定裝置及膜厚測定方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之膜厚測定裝置包含：光測定部，其對樣品照射具有第1波長之第1光，檢測藉由樣品反射之第1光，輸出與該第1光之波長重心之算出相關之第1信號；記憶部，其記憶表示第1波長下之樣品之膜厚與波長重心之關係之第1關係資訊；及解析部；且解析部導出根據膜厚候選及第1關係資訊而特定之與膜厚候選相應之波長重心和算出之第1光之波長重心之差即波長方向距離、以及根據算出之第1光之波長重心及第1關係資訊而導出之膜厚與膜厚候選之差即膜厚方向距離之至少任一者，基於導出結果而導出樣品之膜厚。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:膜厚測定裝置</p>
        <p type="p">10:光照射部</p>
        <p type="p">11:半反射鏡</p>
        <p type="p">12:場透鏡</p>
        <p type="p">20:相機系統</p>
        <p type="p">21:透鏡</p>
        <p type="p">22:傾斜二向分色反射鏡(光學元件)</p>
        <p type="p">23,24:區域感測器(光檢測部)</p>
        <p type="p">30:控制裝置</p>
        <p type="p">32:解析部</p>
        <p type="p">33:記憶部</p>
        <p type="p">100:樣品(對象物)</p>
        <p type="p">100a:基板</p>
        <p type="p">100b:膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10042.JPG" file="ed10042.JPG" height="710px" img-content="tif" inline="yes" orientation="portrait" width="983px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623672</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125094</doc-number>
          <kind></kind>
          <date>114/07/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/69</main-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊丹鳳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, DANFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　貴忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KAI CHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　全豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, SWAIN HONG ALFRED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　佩燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUA, LINDA PEI EE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/790,239</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及製造扇出絎縫封裝的方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MAKING A FAN-OUT QUILT PACKAGE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其具有形成於第一載體上之基板。將半導體晶粒安裝於該基板上。在第二載體上形成互連結構。在該基板或該互連結構上形成銅柱。該互連結構安置於該基板上方，其中該銅柱及該半導體晶粒處於該基板與該互連結構之間。在將該互連結構安置於該基板上方之後，移除該第一載體及該第二載體。在移除該第一載體之後，將系統級封裝（SiP）與該半導體晶粒相對地安裝至該基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device has a substrate formed on a first carrier. A semiconductor die is mounted on the substrate. An interconnect structure is formed on a second carrier. A copper pillar is formed on the substrate or interconnect structure. The interconnect structure is disposed over the substrate with the copper pillar and semiconductor die between the substrate and interconnect structure. The first carrier and second carrier are removed after disposing the interconnect structure over the substrate. A system-in-package (SiP) is mounted to the substrate opposite the semiconductor die after removing the first carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:電性組件/半導體晶粒/光子晶粒</p>
        <p type="p">110:主動表面/光子電路</p>
        <p type="p">114:微柱</p>
        <p type="p">120:基板/中介層</p>
        <p type="p">122:導電層</p>
        <p type="p">124:絕緣層</p>
        <p type="p">130:導電柱/柱</p>
        <p type="p">132:焊蓋</p>
        <p type="p">134:焊料</p>
        <p type="p">140:第二或頂部互連結構/互連結構/基板</p>
        <p type="p">142:導電層</p>
        <p type="p">144:絕緣層</p>
        <p type="p">150:囊封物/模製化合物</p>
        <p type="p">160:系統級封裝/SiP</p>
        <p type="p">162:導電柱</p>
        <p type="p">164:底部填充劑</p>
        <p type="p">170:第二囊封物/囊封物</p>
        <p type="p">176:凸塊/焊料凸塊</p>
        <p type="p">180:絎縫封裝/QP</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.JPG" file="ed10026.JPG" height="359px" img-content="tif" inline="yes" orientation="portrait" width="930px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623675</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125136</doc-number>
          <kind></kind>
          <date>114/07/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/30</further-classification>
        <further-classification edition="202601120260302B">H10W72/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/763,467</doc-number>
          <date>20240703</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於低溫銅接合的積層接合層製程和結構</chinese-title>
        <english-title>BUILD UP BONDING LAYER PROCESS AND STRUCTURE FOR LOW TEMPERATURE COPPER BONDING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示形成微電子組件之方法。在一些具體實例中，該方法包括提供具有金屬化層之元件，該金屬化層包含場介電質及嵌入於該場介電質中之導電特徵。該金屬化層亦包含表面，其包括該場介電質及該導電特徵。該方法進一步包括在該導電特徵上方形成銅特徵，在該銅特徵之側壁上方形成介電層，且隨後平坦化該介電層以形成混合接合表面，其中該銅特徵在該混合接合表面處暴露。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods of forming a microelectronic component. In some embodiments, the method includes providing an element having a metallization layer that comprises a field dielectric and a conductive feature embedded in the field dielectric. The metallization layer also comprises a surface that includes the field dielectric and the conductive feature. The method further includes forming a copper feature over the conductive feature, forming a dielectric layer over sidewalls of the copper feature, and then planarizing the dielectric layer to form a hybrid bonding surface, where the copper feature is exposed at the hybrid bonding surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:製程</p>
        <p type="p">1002:區塊</p>
        <p type="p">1004:區塊</p>
        <p type="p">1006:區塊</p>
        <p type="p">1008:區塊</p>
        <p type="p">1010:區塊</p>
        <p type="p">1012:區塊</p>
        <p type="p">1014:區塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10063.JPG" file="ed10063.JPG" height="622px" img-content="tif" inline="yes" orientation="portrait" width="707px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622174</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125179</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08L63/04</main-classification>
        <further-classification edition="200601120260225B">C08L63/10</further-classification>
        <further-classification edition="200601120260225B">C08G59/32</further-classification>
        <further-classification edition="200601120260225B">C08G59/40</further-classification>
        <further-classification edition="200601120260225B">C08G12/08</further-classification>
        <further-classification edition="200601120260225B">C09D5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河野和起</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOUNO, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花岡拓磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANAOKA, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-116197</doc-number>
          <date>20240719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>水系環氧樹脂組成物、該水系環氧樹脂組成物之硬化物、及該水系環氧樹脂組成物之製造方法</chinese-title>
        <english-title>Aqueous Epoxy Resin Composition, Cured Product of said Aqueous Epoxy Resin Composition, and Method for Producing said Aqueous Epoxy Resin Composition</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為一種水系環氧樹脂組成物，含有：  &lt;br/&gt;環氧樹脂(A)，  &lt;br/&gt;硬化劑(B)，包含環氧氯丙烷與下述通式(1)表示之胺化合物的反應產物(b1)，  &lt;br/&gt;芳香族烴甲醛樹脂(C)，及  &lt;br/&gt;水。  &lt;br/&gt;H&lt;sub&gt;2&lt;/sub&gt;N-CH&lt;sub&gt;2&lt;/sub&gt;-A-CH&lt;sub&gt;2&lt;/sub&gt;-NH&lt;sub&gt;2&lt;/sub&gt;    (1)  &lt;br/&gt;式(1)中，A為1,2-伸苯基、1,3-伸苯基、或1,4-伸苯基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An aqueous epoxy resin composition comprising: &lt;br/&gt;an epoxy resin (A), &lt;br/&gt;a curing agent (B) containing a reaction product (b1) of epichlorohydrin and an amine compound represented by general formula (1), &lt;br/&gt;an aromatic hydrocarbon formaldehyde resin (C), and &lt;br/&gt;water. &lt;br/&gt;H₂N–CH₂–A–CH₂–NH₂ (1) &lt;br/&gt;(In formula (1), A represents a 1,2-phenylene group, 1,3-phenylene group, or 1,4-phenylene group.)</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623523</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125187</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P34/42</main-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳澤愛彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGISAWA, YOSHIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-119654</doc-number>
          <date>20240725</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2025/013204</doc-number>
          <date>20250331</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置、基板處理方法、半導體裝置之製造方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可提高利用熱處理之基板間的面內膜厚均勻性之技術。  &lt;br/&gt;本發明之基板處理裝置具備有：處理室，其處理複數片基板；電磁波產生器，其對複數片基板供給電磁波；第1氣體供給部，其從複數片基板之側方朝向基板的第1部位供給第1氣體；及第2氣體供給部，其從複數片基板之側方朝向與第1部位不同之第2部位供給第2氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">105:噴嘴/第1氣體噴嘴</p>
        <p type="p">200:晶圓</p>
        <p type="p">201:處理室/處理爐/反應室/反應區</p>
        <p type="p">205:閘閥</p>
        <p type="p">305:第2氣體噴嘴</p>
        <p type="p">306:旋轉部</p>
        <p type="p">655-1,655-3:微波振盪器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="631px" img-content="tif" inline="yes" orientation="portrait" width="720px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623134</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125200</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01S3/00</main-classification>
        <further-classification edition="200601120260224B">H05G2/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶　業爭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, YEZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱秋石</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, QIUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞當斯　約書亞　羅斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADAMS, JOSHUA ROSS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃弗烈治　喬治　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVERAGE, GEORGE J</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯　柏拉許　寶利捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAS, PALASH PARIJAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諶斐華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FEIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫　肇寒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, ZHAOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　子丰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BRIAN ZI FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于瀟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐德希　卡曼　優利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOLDESI, CARMEN IULIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RO</english-country>
              <english-address>RO</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏夫根斯　亞歷山大　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAFGANS, ALEXANDER ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/673,979</doc-number>
          <date>20240722</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/707,707</doc-number>
          <date>20241015</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於二氧化碳雷射驅動ＥＵＶ源之獨立稀薄脈衝之方法及裝置</chinese-title>
        <english-title>METHODS AND APPARATUSES FOR INDEPENDENT RAREFICATION PULSE FOR CO2 LASER DRIVEN EUV SOURCE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種脈衝式雷射系統，其包括將一光脈衝遞送至一光學快門之一雷射，該光學快門經組態以透射該脈衝之(a)一第一透射部分，其具有小於20 ns之一上升時間及一第一部分峰值功率；隨後透射(b)一第二透射部分，其具有小於該第一部分峰值功率之一初始功率；及隨後透射(c)一第三透射部分，其具有至少100 nJ之一能量及小於或等於200 ns之一持續時間。一低電壓驅動器(用以控制該第一透射部分之透射)可與一高電壓驅動器(用以控制該第三透射部分之透射)並聯連接至該光學快門中之一EOM，其中電隔離器定位各別電壓驅動器之輸出以保護該低電壓驅動器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pulsed laser system includes a laser that delivers a light pulse to an optical shutter configured to transmit, of the pulse: (a) a first transmitted portion having a rise time of less than 20 ns and a first portion peak power, then (b) a second transmitted portion having an initial power less than the first portion peak power, and then (c) a third transmitted portion having an energy of at least 100 nJ and a duration of less than or equal to 200 ns. A low voltage driver (to control transmission of the first transmitted portion) can be connected to an EOM in the optical shutter in parallel with a high voltage driver (to control transmission of the third transmitted portion), with electrical isolators positioned the outputs of the respective voltage drivers to protect the low voltage driver.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:處理裝置</p>
        <p type="p">210:EUV光源</p>
        <p type="p">212:雷射系統</p>
        <p type="p">240:雷射</p>
        <p type="p">241:脈衝</p>
        <p type="p">242:光學快門</p>
        <p type="p">247:放大器</p>
        <p type="p">248:光束遞送系統</p>
        <p type="p">249:前置放大器</p>
        <p type="p">250:脈衝式雷射系統</p>
        <p type="p">251:AOM</p>
        <p type="p">252:第一透射部分</p>
        <p type="p">252amp:稀薄脈衝</p>
        <p type="p">252d:第一部分持續時間</p>
        <p type="p">252ia:初始振幅</p>
        <p type="p">252pp:第一部分峰值功率</p>
        <p type="p">252rt:第一部分上升時間</p>
        <p type="p">252st:第一部分開始時間</p>
        <p type="p">252v:信號</p>
        <p type="p">253:聲光調變器</p>
        <p type="p">254:第二透射部分</p>
        <p type="p">254amp:主脈衝</p>
        <p type="p">256:第三透射部分</p>
        <p type="p">256d:第三部分持續時間</p>
        <p type="p">256pp:第三部分峰值功率</p>
        <p type="p">256st:第三部分開始時間</p>
        <p type="p">256v:信號</p>
        <p type="p">CTR:控制器</p>
        <p type="p">G1:曲線圖</p>
        <p type="p">G2:曲線圖</p>
        <p type="p">G3:曲線圖</p>
        <p type="p">G4:曲線圖</p>
        <p type="p">hv:高度</p>
        <p type="p">lv:低高度</p>
        <p type="p">OP:光程</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="725px" img-content="tif" inline="yes" orientation="portrait" width="984px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623074</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125208</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120260223B">H01M8/12</main-classification>
        <further-classification edition="201601120260223B">H01M8/0254</further-classification>
        <further-classification edition="200601120260223B">H01M4/86</further-classification>
        <further-classification edition="202101120260223B">C25B11/032</further-classification>
        <further-classification edition="202101120260223B">H01M50/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商博隆能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLOOM ENERGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫爾佐格　拉利昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERZOG, RALION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特爾　希哈薩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, SIDDHARTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾納　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEINGAERTNER, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　凱倫　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KAREN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克裡什納達斯　賈亞庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNADASS, JAYAKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楚卡　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETRUCHA, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱克利斯　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEKELIS, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/668,515</doc-number>
          <date>20240708</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含閥式陽極尾氣氧化器管總成之燃料電池系統</chinese-title>
        <english-title>FUEL CELL SYSTEM INCLUDING VALVED ANODE TAILGAS OXIDIZER CONDUIT ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種燃料電池系統，其包含：熱盒；燃料電池之堆疊，其經定位於該熱盒中且經組態以產生電力及陽極排氣；陽極尾氣氧化器(ATO)，其經定位於該熱盒中且經組態以氧化該陽極排氣之一部分；循環管，其經定位於該熱盒之外部且經組態以接收自該熱盒輸出之該陽極排氣；燃料管總成，其經組態以將燃料提供至該堆疊；及ATO管總成，其同心包圍該燃料管總成且經組態以接收自該循環管轉移之該陽極排氣之第一部分且將該陽極排氣之該第一部分提供至該ATO。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fuel cell system includes a hotbox, a stack of fuel cells located in the hotbox and configured to generate power and an anode exhaust, an anode tail gas oxidizer (ATO) located in the hotbox and configured to oxidize a portion of the anode exhaust, a recycling conduit located outside of the hotbox and configured to receive the anode exhaust output from the hotbox, a fuel conduit assembly configured to provide fuel to the stack, and an ATO conduit assembly concentrically surrounding the fuel conduit assembly and configured to receive a first portion of the anode exhaust diverted from the recycling conduit and to provide the first portion of the anode exhaust to the ATO.</p>
      </isu-abst>
      <representative-img>
        <p type="p">350:同心歧管</p>
        <p type="p">352:燃料進口</p>
        <p type="p">356:陽極排氣進口</p>
        <p type="p">360:燃料管總成</p>
        <p type="p">362A:第一燃料管</p>
        <p type="p">362B:第二燃料管</p>
        <p type="p">364A:第一波紋管</p>
        <p type="p">364B:第二波紋管</p>
        <p type="p">372A:第一陽極排氣管</p>
        <p type="p">374:波紋管</p>
        <p type="p">376:分配管</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="846px" img-content="tif" inline="yes" orientation="portrait" width="382px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623044</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125227</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武部一宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEBE, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向井俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKAI, SYUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-112137</doc-number>
          <date>20240712</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>異常放電檢測方法及控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據施加處理後的影像檢測微小異常放電。  &lt;br/&gt;控制裝置40係根據拍攝到的處理容器11內部的動態影像，取得灰階影像並對該灰階影像進行調整對比度的平滑化處理，該灰階影像係以灰階表示屬於用於檢測微小異常放電的時序性評估對象範圍之幀的影像。另外，控制裝置40係透過背景相減法取得二值化影像，該二值化影像係以不同像素值表示處理對象的平滑化影像中相對於背景作為前景所特定出的差分部位與該差分部位以外的部位。進而，控制裝置40係對該二值化影像進行至少各一次閉合處理與斷開處理，並輸出用於檢測微小異常放電的放電影像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="799px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623307</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125264</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H05H1/46</main-classification>
        <further-classification edition="200601120260223B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤野拓哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWANO, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藥師寺秀明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAKUSHIJI, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-114213</doc-number>
          <date>20240717</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置及配方登錄方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">控制部係具備記憶部、輸入部、判定部及登錄部。記憶部係儲存對基板的電漿處理配方。輸入部係接受對基板的電漿處理配方的輸入。判定部係判定在按照輸入部所接受的配方執行電漿處理時，上部電極中是否發生異常放電。登錄部係在判定部判定上部電極為發生異常放電的情況下，拒絕向記憶部登錄配方，在判定部判定上部電極為沒有發生異常放電的情況下，在記憶部登錄配方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:控制部</p>
        <p type="p">101:外部I/F</p>
        <p type="p">102:使用者I/F</p>
        <p type="p">103:記憶部</p>
        <p type="p">103a:配方資料</p>
        <p type="p">103b:教師資料</p>
        <p type="p">103c:預測模型資料</p>
        <p type="p">104:程序控制器</p>
        <p type="p">104a:電漿控制部</p>
        <p type="p">104b:產生部</p>
        <p type="p">104c:判定部</p>
        <p type="p">104d:登錄部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="877px" img-content="tif" inline="yes" orientation="portrait" width="700px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623518</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125269</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/60</main-classification>
        <further-classification edition="202601120260302B">H10P50/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔瓦柯利　穆罕默德麥赫迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAVAKOLI, MOHAMMAD MAHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　正周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JOUNG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傑拉多斯　艾夫傑尼諾斯Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GELATOS, AVGERINOS V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅保奇　班雀奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEBARKI, BENCHERKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/667,526</doc-number>
          <date>20240703</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>利用微波氧化之氮化矽介電質的選擇性蝕刻</chinese-title>
        <english-title>SELECTIVE ETCHING OF SILICON NITRIDE DIELECTRICS WITH MICROWAVE OXIDATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一或多個實施例，方法包含將基板定位於處理腔室內。該基板包括安置於基板表面之上的硬遮罩層、安置於硬遮罩層之上的第一層，以及安置於於第一層之上的第二層。方法進一步包含將製程氣體流入處理腔室，並將微波能量遞送至製程氣體達一時間週期，以選擇性蝕刻硬遮罩層和第一層，其中將微波能量遞送至製程氣體不產生電漿。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to one or more embodiments, a method includes positioning a substrate within a processing chamber. The substrate includes a hardmask layer disposed over a surface of the substrate, a first layer disposed over the hardmask layer, and a second layer disposed over the first layer. The method further includes flowing a process gas into the processing chamber, and delivering a microwave energy for a period of time to the process gas to selectively etch the hardmask layer and the first layer, wherein delivering the microwave energy to the process gas does not generate a plasma.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">310:操作</p>
        <p type="p">320:操作</p>
        <p type="p">330:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="611px" img-content="tif" inline="yes" orientation="portrait" width="658px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623394</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125325</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120251120B">H10D30/60</main-classification>
        <further-classification edition="202501120251120B">H10D62/10</further-classification>
        <further-classification edition="202501120251120B">H10D62/824</further-classification>
        <further-classification edition="202501120251120B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SZU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡祖禹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOO, JU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫偉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOON, WEI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/722,158</doc-number>
          <date>20241119</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/198,718</doc-number>
          <date>20250505</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電晶體、裝置結構及裝置結構的形成方法</chinese-title>
        <english-title>TRANSISTOR, DEVICE STRUCTURE AND FORMATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示了用於在半導體裝置（諸如電晶體）中實施的電絕緣材料及/或結構。例示性電絕緣層為具有含硼及氮的層壓結構的介電層。含硼及氮的層壓結構包括至少一個結晶氮化硼層（例如，六方氮化硼層）及至少一個非晶氮化硼層。在一些實施例中，介電層在電晶體中實施。例如，電晶體包括閘極間隔物及/或內部間隔物，且介電層為閘極間隔物、內部間隔物或兩者。在另一個實例中，介電層為接觸蝕刻終止層，其可形成在電晶體之上。在另一個實例中，介電層為或形成電晶體的閘極與另一個電晶體的閘極之間的閘極隔離層的一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Electrically insulating materials and/or structures are disclosed herein for implementation in semiconductor devices, such as transistors. An exemplary electrically insulating layer is a dielectric layer having a boron-and-nitrogen containing laminate structure. The boron-and-nitrogen containing laminate structure includes at least one crystalline boron nitride layer (e.g., a hexagonal boron nitride layer) and at least one amorphous boron nitride layer. In some embodiments, the dielectric layer is implemented in a transistor. For example, the transistor includes a gate spacer and/or an inner spacer, and the dielectric layer is the gate spacer, the inner spacer, or both. In another example, the dielectric layer is a contact etch stop layer, which may be formed over the transistor. In another example, the dielectric layer is, or forms a portion of, a gate isolation layer between a gate of the transistor and a gate of another transistor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:層壓的介電膜</p>
        <p type="p">15:結晶氮化硼層</p>
        <p type="p">20:非晶氮化硼層</p>
        <p type="p">25:半導體裝置</p>
        <p type="p">T:厚度</p>
        <p type="p">t1:厚度</p>
        <p type="p">t2:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.png" file="d10015.TIF" giffile="ed10015.png" height="297px" img-content="tif" inline="yes" orientation="portrait" width="701px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623116</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125333</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01R13/629</main-classification>
        <further-classification edition="200601120260302B">H01R13/639</further-classification>
        <further-classification edition="201101120260302B">H01R24/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾威勒電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀永良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, YUNG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐煜揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/706,041</doc-number>
          <date>20241011</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/785,650</doc-number>
          <date>20250409</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>連接器組件</chinese-title>
        <english-title>CONNECTOR ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器組件包括彈性固定單元、殼體及拉動單元。彈性固定單元具有固持部及傳動部，其中固持部和傳動部相互連動。殼體連接彈性固定單元。拉動單元可移動地連接殼體，並具有施力部及驅動部，其中驅動部銜接傳動部，施力部配置以受力而帶動拉動單元沿著施力方向移動，使得驅動部進一步帶動固持部及傳動部移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector assembly includes an elastic fixing unit, a housing, and a pulling unit. The elastic fixing unit has a fixing portion and a transmission portion, in which the fixing portion and the transmission portion are interlinked. The housing is connected to the elastic fixing unit. The pulling unit is movably connected to the housing and has a force-applying portion and a driving portion, in which the driving portion engages with the transmission portion, and the force-applying portion is configured to, upon receiving a force, drive the pulling unit to move along a direction of the force, such that the driving portion further drives the fixing portion and the transmission portion to move.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:連接器組件</p>
        <p type="p">100:線端連接器</p>
        <p type="p">110:彈性固定單元</p>
        <p type="p">111:固持部</p>
        <p type="p">113:傳動部</p>
        <p type="p">113a:凸出體</p>
        <p type="p">113b:延伸部</p>
        <p type="p">130:拉動單元</p>
        <p type="p">131:施力部</p>
        <p type="p">131a:凸肋</p>
        <p type="p">133:驅動部</p>
        <p type="p">133a:驅動孔</p>
        <p type="p">135:本體部</p>
        <p type="p">135a:長通孔</p>
        <p type="p">137:組裝部</p>
        <p type="p">150:殼體</p>
        <p type="p">152:第一殼體</p>
        <p type="p">154:第二殼體</p>
        <p type="p">155:窗口</p>
        <p type="p">156:對接通道</p>
        <p type="p">158:通孔</p>
        <p type="p">A:對接連接器</p>
        <p type="p">X:第一軸向</p>
        <p type="p">X1:施力方向</p>
        <p type="p">Y:第二軸向</p>
        <p type="p">Z:第三軸向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="730px" img-content="tif" inline="yes" orientation="portrait" width="1005px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623013</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125336</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01F27/29</main-classification>
        <further-classification edition="200601120260302B">H01F27/24</further-classification>
        <further-classification edition="200601120260302B">H02M3/00</further-classification>
        <further-classification edition="202601120260302B">H05K1/18</further-classification>
        <further-classification edition="200601120260302B">H05K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊仲望</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHONGWANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEI, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅超偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, CHAOWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024108952389</doc-number>
          <date>20240704</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>耦合電感及其適用的功率轉換模組</chinese-title>
        <english-title>COUPLING INDUCTOR AND POWER CONVERSION MODULE WITH SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案為一種耦合電感，連接於發熱組件，包括磁芯及繞組部。磁芯包括上和下表面。繞組部包括第一和第二功率繞組，兩者間存在公共磁通路徑。部分第一和第二功率繞組分別容置於磁芯內，第一功率繞組的兩相對端部外露於下表面而形成第一和第二外接部，第一功率繞組部分外露於上表面而形成第一散熱部，第二功率繞組的兩相對端部外露於下表面而形成第三和第四外接部，第二功率繞組部分外露於上表面而形成第二散熱部。第一和第三外接部與發熱組件電連接，並將發熱組件所產生的熱能引導至第一和第二散熱部進行散熱，第二和第四外接部用以輸出功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a coupling inductor. The coupling inductor is electrically connected with a heating element and includes a magnetic core and a winding assembly. The magnetic core has a top surface and a bottom surface. The winding assembly includes a first power winding and a second power winding, and a shared flux path is provided between the first power winding and the second power winding. The first power winding and the second power winding are partially disposed within the magnetic core. Two opposite terminals of the first power winding are exposed on the bottom surface of the magnetic core and respectively formed as a first outer connection part and a second outer connection part, and a portion of the first power winding is exposed on the top surface of the magnetic core and configured as a first heat dissipation part. Two opposite terminals of the second power winding are exposed on the bottom surface of the magnetic core and respectively formed as a third outer connection part and a fourth outer connection part, and a portion of the second power winding is exposed on the top surface of the magnetic core and configured a second heat dissipation part. The first outer connection part and the third outer connection part are electrically connected with the heating element, and heat generated by the heating element is conducted via the first outer connection part and the third outer connection part to the first heat dissipation part and the second heat dissipation part, and the winding assembly outputs power via the second outer connection part and the fourth outer connection part.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:耦合電感</p>
        <p type="p">2:磁芯</p>
        <p type="p">20:上表面</p>
        <p type="p">21:下表面</p>
        <p type="p">3b:第二外接部</p>
        <p type="p">3d:第四外接部</p>
        <p type="p">3e:第五外接部</p>
        <p type="p">H1:第一散熱板</p>
        <p type="p">H2:第二散熱板</p>
        <p type="p">PS:水平面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="659px" img-content="tif" inline="yes" orientation="portrait" width="781px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623067</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125343</doc-number>
          <kind></kind>
          <date>114/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201001120260226B">H01M4/136</main-classification>
        <further-classification edition="201001120260226B">H01M4/58</further-classification>
        <further-classification edition="201001120260226B">H01M10/052</further-classification>
        <further-classification edition="200601120260226B">H01M10/39</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商柯納米克斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONAMIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布克哈特　斯蒂芬　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURKHARDT, STEPHEN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古爾德　尼可拉斯　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOULD, NICHOLAS A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫德斯利　珍妮佛　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAWDSLEY, JENNIFER R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古乃任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/667,448</doc-number>
          <date>20240703</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於鋰硫或鈉硫電池組之陰極材料</chinese-title>
        <english-title>CATHODE MATERIAL FOR LITHIUM- OR SODIUM-SULFUR BATTERY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於鋰硫或鈉硫電池組之多孔複合陰極活性材料。該多孔複合陰極活性材料包括導電黏合劑中之金屬硫化物粒子的互連框架。該多孔複合陰極活性材料含有介於50質量%與75質量%之間的電活性硫族元素轉化陰極材料及介於10質量%與35質量%之間的金屬硫化物。製造該材料之方法可包括形成漿料及在受控條件下乾燥。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A porous composite cathode active material for lithium- of sodium-sulfur batteries is provided. The porous composite cathode active material includes an interconnected framework of metal sulfide particles in a conductive binder. The porous composite cathode active material contains between 50 and 75 mass % of an electroactive chalcogen conversion cathode material and between 10 and 35 mass % metal sulfide(s). Methods of making the material can include forming a slurry and drying under controlled conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:電化學電池</p>
        <p type="p">802、802a、802b:負電極</p>
        <p type="p">804、804a、804b:正電極</p>
        <p type="p">806、806a、806b:隔膜</p>
        <p type="p">810:外殼</p>
        <p type="p">812:流體電解質</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="612px" img-content="tif" inline="yes" orientation="portrait" width="888px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622213</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125427</doc-number>
          <kind></kind>
          <date>114/07/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C09K5/14</main-classification>
        <further-classification edition="201801120260223B">C08K3/105</further-classification>
        <further-classification edition="200601120260223B">C08K3/38</further-classification>
        <further-classification edition="200601120260223B">C08L101/12</further-classification>
        <further-classification edition="200601120260223B">C08F2/06</further-classification>
        <further-classification edition="200601120260223B">C08G12/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波瑟　佛洛倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOURCET, FLORENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦逸群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIN, YI-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈桑尼　法桑奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASSANI, FARZANEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞柯比　格洛斯　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAACOBI-GROSS, NIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>英國</country>
          <doc-number>2409834.5</doc-number>
          <date>20240705</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>熱傳導組合物</chinese-title>
        <english-title>THERMALLY CONDUCTIVE COMPOSITION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種組合物，其包含聚合物、氮化硼顆粒及氧化鋁顆粒，其中以該組合物總重量之百分比計：  &lt;br/&gt;該等氮化硼顆粒的重量百分比大於10 wt%；  &lt;br/&gt;該等氧化鋁顆粒的重量百分比為至少10 wt%；且  &lt;br/&gt;該聚合物的重量百分比為至少20 wt%。  &lt;br/&gt;亦揭示一種包含該組合物之熱傳導膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition comprising a polymer, boron nitride particles and alumina particles wherein, as a percentage of the total composition weight: &lt;br/&gt;the boron nitride particles weight percentage is greater than 10 wt%; &lt;br/&gt;the alumina particles weight percentage is at least 10 wt%; and &lt;br/&gt;the polymer weight percentage is at least 20 wt %. &lt;br/&gt;A thermally conductive film comprising the composition is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623521</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125555</doc-number>
          <kind></kind>
          <date>114/07/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/692</main-classification>
        <further-classification edition="202601120260302B">H10P14/694</further-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本良知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, YOSHITOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-126424</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理方法、半導體裝置之製造方法、程式及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種基板處理方法、半導體裝置之製造方法、程式及基板處理裝置。本發明之課題係在設置於基板表面的凹部內精密地形成膜。本發明之基板處理方法包含(a)向在表面具有具備由第1基底構成的底面及由第2基底構成的側面之凹部的基板供給成膜劑，以比形成於上述第2基底上的第1膜的厚度厚的方式，在上述第1基底上形成上述第1膜的步驟；及(b)向上述基板供給蝕刻劑，在使形成於上述第1基底上的上述第1膜之至少一部分殘留的狀態下，將形成於上述第2基底上的上述第1膜除去的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">115:晶舟升降機</p>
        <p type="p">115s:閘門開關機構</p>
        <p type="p">121:控制器</p>
        <p type="p">200:晶圓(基板)</p>
        <p type="p">201:處理室</p>
        <p type="p">202:處理爐</p>
        <p type="p">203:反應管</p>
        <p type="p">207:加熱器</p>
        <p type="p">209:歧管</p>
        <p type="p">217:晶舟</p>
        <p type="p">218:隔熱板</p>
        <p type="p">219:密封蓋</p>
        <p type="p">219s:閘門</p>
        <p type="p">231:排氣管</p>
        <p type="p">231a:排氣口</p>
        <p type="p">232a,232b,232c,232d,232e,232f,232g,232h:氣體供給管</p>
        <p type="p">241a,241b,241c,241d,241e,241f,241g,241h:質量流量控制器(MFC)</p>
        <p type="p">243a,243b,243c,243d,243e,243f,243g,243h:閥</p>
        <p type="p">244:APC閥</p>
        <p type="p">245:壓力感測器</p>
        <p type="p">246:真空泵</p>
        <p type="p">248:集積型供給系統</p>
        <p type="p">249a,249b,249c:噴嘴</p>
        <p type="p">250a,250b,250c:氣體供給孔</p>
        <p type="p">263:溫度感測器</p>
        <p type="p">267:旋轉機構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="881px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622198</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125634</doc-number>
          <kind></kind>
          <date>114/07/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09G1/18</main-classification>
        <further-classification edition="200601120260302B">C10M173/00</further-classification>
        <further-classification edition="200601120260302B">C10M105/14</further-classification>
        <further-classification edition="202601120260302B">H10P58/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓬田知行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOMOGITA, AKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村友彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, TOMOHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-109786</doc-number>
          <date>20240708</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>加工液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種加工液，其可使用於複線式線鋸裝置且具優異之防止線鋸撓曲的性能。&lt;br/&gt;  製成一種加工液，其含有有效成分及水，且&lt;br/&gt;  前述有效成分含有下述成分(A)；&lt;br/&gt;  成分(A)：鹼值為5.0~110mgKOH/g且氮原子含量為0.10~3.0質量%之聚氧伸烷基胺。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622276</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125678</doc-number>
          <kind></kind>
          <date>114/07/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/40</main-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="200601120260302B">C23C16/52</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商圓益ＩＰＳ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONIK IPS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李成煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUNG HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李周勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JU YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
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          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯容昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOR, YONG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹承熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SEUNG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金潁俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文在正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOON, JAE JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0169678</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理方法及裝置和記錄用於執行該方法的程式的記錄介質</chinese-title>
        <english-title>METHOD AND APPARATUS FOR PROCESSING SUBSTRATE AND RECORDING MEDIUM FOR PERFORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的基板處理方法用於在形成包含第一處理區域和第二處理區域的處理空間的製程腔室中，在複數個基板上形成薄膜，包括以下步驟：第一步驟，將第一基板及第二基板分別位於第一處理區域及第二處理區域；第二步驟，向第一處理區域分別獨立地噴射同步氣體和第一製程氣體的同時，向第二處理區域噴射第二製程氣體；第三步驟，分別移動第一基板及第二基板，使其位於第二處理區域及第一處理區域；以及第四步驟，向第一處理區域分別獨立地噴射同步氣體和第一製程氣體，同時向第二處理區域噴射第二製程氣體，其中，在第二步驟及第四步驟中，在第一噴射時間內噴射同步氣體，在第二噴射時間內噴射第一製程氣體，在第一噴射時間加上第二噴射時間的第三噴射時間內，噴射第二製程氣體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:第一步驟</p>
        <p type="p">S200:第二步驟</p>
        <p type="p">S300:第三步驟</p>
        <p type="p">S400:第四步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="598px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
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  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622541</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125681</doc-number>
          <kind></kind>
          <date>114/07/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260220B">G01V3/12</main-classification>
        <further-classification edition="200601120260220B">G01V11/00</further-classification>
        <further-classification edition="201701120260220B">G06T7/33</further-classification>
        <further-classification edition="200601120260220B">G01C21/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商巨設地工透視科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEO SEARCH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大河原聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAWARA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一柳星文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ICHIYANAGI, HOSHIBUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧建川</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206641</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>地下數據管理裝置、方法及程序</chinese-title>
        <english-title>UNDERGROUND DATA MANAGEMENT APPARATUS, METHOD, AND PROGRAM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種地下數據管理裝置，沿著被設定為路面影像之攝影範圍部分重疊的複數測試線，讓取得位置對應並取得，並自複數測試線中選擇參考測試線，將路面影像沿著測試線分割為複數區塊，透過將參考測試線之路面影像的區塊，及另一測試線之路面影像的區塊相關聯以使影像內的特徵點呈一致，以於各一區塊特定另一測試線相對於參考測試線的相對位置，並於每一區塊內，以相對於參考測試線之相對位置下管理地下數據。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An underground data management apparatus acquires surface images and underground data along a plurality of survey lines set so that imaging ranges of the surface images partially overlap, with acquisition positions being correlated, selects a reference survey line from among the plurality of survey lines, divides the surface images along each survey line into a plurality of blocks, associates each block of the surface image from the reference survey line with corresponding blocks of surface images from other survey lines by matching feature points within the images, thereby identifying relative positions of the other survey lines with respect to the reference survey line for each block, and manages the underground data for each block based on its relative position with respect to the reference survey line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:地下數據管理裝置</p>
        <p type="p">32:取得部</p>
        <p type="p">34:特定部</p>
        <p type="p">36:管理部</p>
        <p type="p">38:地下數據</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="702px" img-content="tif" inline="yes" orientation="portrait" width="611px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622291</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125694</doc-number>
          <kind></kind>
          <date>114/07/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C23F1/28</main-classification>
        <further-classification edition="200601120260223B">C22C38/18</further-classification>
        <further-classification edition="200601120260223B">C23C22/50</further-classification>
        <further-classification edition="200601120260223B">C25D3/38</further-classification>
        <further-classification edition="200601120260223B">H01M4/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本和志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田和彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, KADUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松山洋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUYAMA, YOUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-111515</doc-number>
          <date>20240711</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>水性組成物、不鏽鋼開孔箔及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種水性組成物，係用以於不鏽鋼箔之厚度方向形成貫穿孔，以該水性組成物之總量基準計，包含：0.01質量%以上且20質量%以下的過氧化氫、1質量%以上且30質量%以下的鹵素離子、及超過0質量%且5質量%以下的銅離子；以及一種不鏽鋼開孔箔之製造方法，包含：使該水性組成物與不鏽鋼箔接觸，而形成於不鏽鋼箔之厚度方向貫穿之多個貫穿孔的貫穿孔形成步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622397</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125716</doc-number>
          <kind></kind>
          <date>114/07/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260112B">F16F9/36</main-classification>
        <further-classification edition="200601120260112B">F16F9/02</further-classification>
        <further-classification edition="200601120260112B">B62K21/08</further-classification>
        <further-classification edition="200601120260112B">B62K21/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商福克斯制造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOX FACTORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝克　威廉　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BECKER, WILLIAM M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉爾伯特　達蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILBERT, DAMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/720,875</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/227,929</doc-number>
          <date>20250604</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於空氣彈簧總成的負空氣彈簧體積密封頭</chinese-title>
        <english-title>NEGATIVE AIR SPRING VOLUME SEALHEAD FOR AIR-SPRING ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種避震叉包括：一下管；下管伸縮地接合的一上管；及設置於下管及上管內的一空氣彈簧總成。空氣彈簧總成包括：一正空氣腔室；一負空氣腔室；將正空氣腔室與負空氣腔室分隔的一活塞；及定位於負空氣腔室附近的一密封頭。密封頭包括一外壁及一內壁，內壁界定一口孔，耦接至活塞的一軸桿可移動地接納於口孔中。一中空腔室定位於外壁與內壁之間。一觸頂板附接至密封頭，觸頂板包括與中空腔室連通的複數個開口。密封頭之中空腔室增大負空氣腔室之一體積，從而提供改良之避震效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A suspension fork includes a lower tube, an upper tube telescopically engaged with the lower tube, and an air-spring assembly disposed within the lower tube and the upper tube. The air-spring assembly includes a positive air chamber, a negative air chamber, a piston dividing the positive air chamber and the negative air chamber, and a sealhead positioned proximate the negative air chamber. The sealhead includes an outer wall and an inner wall defining an aperture in which a shaft coupled to the piston is movably received. A hollow chamber is positioned between the outer wall and inner wall. A topout plate comprising a plurality of openings in communication with the hollow chamber is attached to the sealhead. The hollow chamber of the sealhead increases a volume of the negative air chamber, providing improved suspension performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">151:密封頭總成/密封頭/密封頭主體</p>
        <p type="p">154:基部部分</p>
        <p type="p">157:延伸部分</p>
        <p type="p">160:口孔</p>
        <p type="p">163:外壁</p>
        <p type="p">166:內壁</p>
        <p type="p">169:中空腔室/腔室</p>
        <p type="p">172:觸頂板</p>
        <p type="p">175:螺紋界面</p>
        <p type="p">178a,178b,178c:開口</p>
        <p type="p">180:襯套</p>
        <p type="p">181:端面</p>
        <p type="p">184:環形密封件</p>
        <p type="p">185:消喀嚦音裝置</p>
        <p type="p">187a,187b:環形凹槽</p>
        <p type="p">188a:第一環形動態空氣軸桿密封件/第三動態空氣軸桿密封件</p>
        <p type="p">188b:第二環形動態空氣軸桿密封件/第四動態空氣軸桿密封件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="711px" img-content="tif" inline="yes" orientation="portrait" width="805px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623373</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125717</doc-number>
          <kind></kind>
          <date>114/07/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120251118B">H10D12/01</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉明焦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, MINGJIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文卡特拉曼　普拉薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENKATRAMAN, PRASAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷克瑟　克里斯多福　勞倫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REXER, CHRISTOPHER LAWRENCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布里格斯　大衛　肯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIGGS, DAVID KENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢　沙姆蘇爾　阿雷芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAN, SHAMSUL AREFIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耶迪納克　約瑟夫　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEDINAK, JOSEPH ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/957,308</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>絕緣閘雙極電晶體及其製造方法</chinese-title>
        <english-title>INSULATED GATE BIPOLAR TRANSISTOR AND METHODS FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種絕緣閘雙極電晶體包括複數個半導體層、一溝槽材料、一電絕緣層、及一射極導電層。該等半導體層具有(i)一半導體表面及(ii)穿過該半導體表面形成的複數個閘極溝槽及複數個射極溝槽，該複數個閘極溝槽與該複數個射極溝槽由複數個台面分開。該溝槽材料設置在該等射極溝槽中。該電絕緣層形成在該等半導體層之上。該電絕緣層界定與該等台面對準並延伸橫跨該等射極溝槽的複數個開口。該電絕緣層不延伸至該等射極溝槽中。該射極導電層形成在該電絕緣層之上。該射極導電層通過該等開口直接接觸(i)各台面及(ii)各射極溝槽中的該溝槽材料。該射極導電層亦延伸橫跨該等射極溝槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An insulated gate bipolar transistor includes multiple semiconductor layers, a trench material, an electrically insulative layer, and an emitter conductive layer. The semiconductor layers have (i) a semiconductor surface and (ii) multiple gate trenches and multiple emitter trenches separated by multiple mesas formed through the semiconductor surface. The trench material is disposed in the emitter trenches. The electrically insulative layer is formed over the semiconductor layers. The electrically insulative layer defines multiple openings that align with the mesas and extend across the emitter trenches. The electrically insulative layer do not extend into the emitter trenches. The emitter conductive layer is formed over the electrically insulative layer. The emitter conductive layer directly contacts through the openings (i) each mesa and (ii) the trench material in each emitter trench. The emitter conductive layer also extends across the emitter trenches.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:絕緣閘雙極電晶體(IGBT)</p>
        <p type="p">102:第一摻雜層/摻雜層/層</p>
        <p type="p">104:第二摻雜層/摻雜層/層</p>
        <p type="p">106:第三摻雜層/摻雜層/層</p>
        <p type="p">112:導電層</p>
        <p type="p">114:射極導電層</p>
        <p type="p">116:溝槽</p>
        <p type="p">118:半導體表面</p>
        <p type="p">120:閘極溝槽</p>
        <p type="p">122:射極溝槽</p>
        <p type="p">124:電絕緣塗層/層</p>
        <p type="p">126:溝槽材料</p>
        <p type="p">130:成斜角溝槽側壁植入區</p>
        <p type="p">132:第一側</p>
        <p type="p">134:第二側</p>
        <p type="p">136:第三側</p>
        <p type="p">140:溝槽</p>
        <p type="p">142:深度</p>
        <p type="p">144:厚度/深度</p>
        <p type="p">150:鎮流電阻器</p>
        <p type="p">152:鎮流接觸件</p>
        <p type="p">154:箭頭</p>
        <p type="p">160:台面</p>
        <p type="p">162:寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="925px" img-content="tif" inline="yes" orientation="portrait" width="718px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623308</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125767</doc-number>
          <kind></kind>
          <date>114/07/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H05H1/46</main-classification>
        <further-classification edition="200601120260223B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三田祐也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKATA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太宅正晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OYA, MASAHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-113938</doc-number>
          <date>20240717</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置、偏壓電源及電漿處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之電漿處理裝置包含偏壓電源。偏壓電源電性耦合至腔室內之基板支持部。偏壓電源包含第1及第2轉換電路以及第1及第2脈衝產生電路。第1及第2轉換電路分別自輸入DC電壓產生第1DC電壓及第2DC電壓。第1脈衝產生電路於週期內之第1副期間內自第1DC電壓產生第1電壓脈衝之第1序列。第2脈衝產生電路於週期內之第2副期間內自第2DC電壓產生第2電壓脈衝之第2序列。第1及第2電壓脈衝相對於基準電位具有互不相同之電位差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">10:腔室</p>
        <p type="p">11:基板支持部</p>
        <p type="p">50:偏壓電源</p>
        <p type="p">52:DC產生部</p>
        <p type="p">54:波形產生部</p>
        <p type="p">520:AC/DC轉換器</p>
        <p type="p">521:第1轉換電路</p>
        <p type="p">522:第2轉換電路</p>
        <p type="p">523:控制電路</p>
        <p type="p">530:輸入端</p>
        <p type="p">531:第1輸出端</p>
        <p type="p">532:第2輸出端</p>
        <p type="p">541:第1脈衝產生電路</p>
        <p type="p">542:第2脈衝產生電路</p>
        <p type="p">543:控制電路</p>
        <p type="p">544:感測器</p>
        <p type="p">551:第1輸入端</p>
        <p type="p">552:第2輸入端</p>
        <p type="p">560:輸出端</p>
        <p type="p">DC1:第1DC電壓</p>
        <p type="p">DC2:第2DC電壓</p>
        <p type="p">DCi:輸入DC電壓</p>
        <p type="p">SS1:同步信號</p>
        <p type="p">SS2:同步信號</p>
        <p type="p">VS1:第1序列</p>
        <p type="p">VS2:第2序列</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="662px" img-content="tif" inline="yes" orientation="portrait" width="991px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622355</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125770</doc-number>
          <kind></kind>
          <date>114/07/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">F01D25/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＧＥ維諾瓦科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE VERNOVA TECHNOLOGY GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密特　托爾斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, THORSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑟姆斯　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THURMES, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科爾伯　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOERBER, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/EP2024/072520</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>推力軸環加工工具及用於現場修復渦輪機之轉子軸的推力軸環之方法</chinese-title>
        <english-title>THRUST COLLAR MACHINING TOOL AND METHODS FOR IN-SITU REPAIRING OF A THRUST COLLAR OF A ROTOR SHAFT OF A TURBINE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於用於加工渦輪機之轉子軸的推力軸環之工具。具體地，蒸汽渦輪機或氣體渦輪機。該工具包含支座(20)及環形單元(30)，該環形單元連接至支座(20)。環形單元(30)經組態用於圍繞該轉子軸定位，且其包含靜環(31)及可旋轉環(32)。可旋轉環(32)經組態以相對於靜環(31)旋轉。切割工具連接至可旋轉環(32)。該支座經組態以耐受在加工該推力軸環期間由該切割工具引起的負載。本揭露亦係關於用於修復推力軸環之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is related to tools for machining a thrust collar of a rotor shaft of a turbine. In particular, a steam turbine or a gas turbine. The tool comprises a support (20) and an annular unit (30) connected to the support (20) . The annular unit (30) is configured for being positioned around the rotor shaft and it comprises a static ring (31) and a rotatable ring (32). The rotatable ring (32) is configured to rotate relative to the static ring (31). A cutting tool is connected to the rotatable ring (32). The support is configured to withstand the loads induced by the cutting tool during machining of the thrust collar. The present disclosure also relates to methods for repairing a thrust collar.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:工具</p>
        <p type="p">20:支座</p>
        <p type="p">21:第一實質上環形支撐構件；第一環形支撐構件；環形支撐構件</p>
        <p type="p">22:第二實質上環形支撐構件；第二環形支撐構件</p>
        <p type="p">23:連接軸</p>
        <p type="p">30:環形單元</p>
        <p type="p">31:靜環</p>
        <p type="p">32:可旋轉環</p>
        <p type="p">321:環形齒輪</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.JPG" file="ed10028.JPG" height="511px" img-content="tif" inline="yes" orientation="portrait" width="670px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622688</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125891</doc-number>
          <kind></kind>
          <date>114/07/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G06F1/16</main-classification>
        <further-classification edition="200601120260302B">G06F1/20</further-classification>
        <further-classification edition="202601120260302B">G06F1/18</further-classification>
        <further-classification edition="200601120260302B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商雷蛇（亞太）私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAZER (ASIA-PACIFIC) PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHINGHSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭丞佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHENGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/SG2024/050490</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置、可攜式儲存模組及系統</chinese-title>
        <english-title>ELECTRONIC DEVICE, PORTABLE STORAGE MODULE, AND SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據各種實施例，可提供一種系統，其可包括可攜式儲存模組及電子裝置。可攜式儲存模組可包括具有可插入部分的殼罩。可攜式儲存模組可進一步包括設置在殼罩的一對相對端段的第一端段處的連接器。可插入部分可包括第一端段及位於殼罩的一對相對端段之間的殼罩的一段的至少一部分。可攜式儲存模組的殼罩的可插入部分可以經由電子裝置的外殼的壁處的開口插入至電子裝置的外殼的內部空間內的模組容納空間中，以使可攜式儲存模組的連接器與電子裝置的主機板的內部連接器互相連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to various embodiments, there may be provided a system which may include a portable storage module and an electronic device. The portable storage module may include a casing with an insertable portion. The portable storage module may further include a connector disposed at a first end segment of a pair of opposite end segments of the casing. The insertable portion may include the first end segment and at least a portion of a segment of the casing between the pair of opposite end segments of the casing. The insertable portion of the casing of the portable storage module may be insertable into a module-accommodation space within an internal space of a housing of the electronic device, via an opening at a wall of the housing of the electronic device, to interconnect a connector of the portable storage module with an inner connector of a mainboard of the electronic device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">110:外殼</p>
        <p type="p">111:內部空間</p>
        <p type="p">111a:周圍邊緣部分</p>
        <p type="p">111b:中心或核心部分</p>
        <p type="p">112:開口</p>
        <p type="p">113:模組容納空間</p>
        <p type="p">113a、140a:縱軸</p>
        <p type="p">113b:插入軸</p>
        <p type="p">116、156:接合元件</p>
        <p type="p">120:主機板</p>
        <p type="p">121:內部連接器</p>
        <p type="p">122:外部連接器</p>
        <p type="p">131:風扇單元</p>
        <p type="p">140:可攜式儲存模組</p>
        <p type="p">150:殼罩</p>
        <p type="p">150a:第一端段</p>
        <p type="p">161:連接器</p>
        <p type="p">1000:系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="491px" img-content="tif" inline="yes" orientation="portrait" width="730px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622011</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125907</doc-number>
          <kind></kind>
          <date>113/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C03B33/08</main-classification>
        <further-classification edition="201401120260302B">B23K26/062</further-classification>
        <further-classification edition="202601120260302B">H10W70/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聚嶸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHPROS INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游智偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>基板加工裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種基板加工裝置。基板加工裝置包含控制模組、材料供應模組、鑽孔模組以及材料移除模組。材料供應模組與控制模組電性連接，用以在基板上形成保護層。鑽孔模組與控制模組電性連接，用以對基板進行鑽孔。材料移除模組與控制模組電性連接，用於藉由光移除所述基板上的所述保護層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a substrate processing apparatus. The substrate processing apparatus includes a control module, material spraying module, drilling module and material removal module. The material spraying module is electrically connected to the control module to form a protective layer on the substrate. The drilling module is electrically connected to the control module and is used for drilling the substrate. The material removal module is electrically connected to the control module and is used to remove the protective layer on the substrate by light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:控制模組</p>
        <p type="p">20:材料供應模組</p>
        <p type="p">30:鑽孔模組</p>
        <p type="p">40:材料移除模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="360px" img-content="tif" inline="yes" orientation="portrait" width="635px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623500</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125930</doc-number>
          <kind></kind>
          <date>114/07/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260226B">H10K59/80</main-classification>
        <further-classification edition="202301120260226B">H10K59/38</further-classification>
        <further-classification edition="202301120260226B">H10K59/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴濟範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JE-BEOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭東烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, DONG-RYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁志碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JI-SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴栽賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0112997</doc-number>
          <date>20240822</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>發光顯示裝置</chinese-title>
        <english-title>LIGHT EMITTING DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光顯示裝置包含：基板；發光二極體，位於基板上；凸透鏡，位於發光二極體上；以及凹透鏡，位於發光二極體與凸透鏡之間。凸透鏡的一端位於凹透鏡的兩端之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emitting display device includes a substrate; a light emitting diode on the substrate; a convex lens on the light emitting diode; and a concave lens between the light emitting diode and the convex lens. An end of the convex lens is positioned between both ends of the concave lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:發光顯示裝置</p>
        <p type="p">301:基板</p>
        <p type="p">310:半導體層</p>
        <p type="p">312:閘極絕緣層</p>
        <p type="p">314:閘極電極</p>
        <p type="p">320:層間絕緣層</p>
        <p type="p">322:第一接觸孔</p>
        <p type="p">324:第二接觸孔</p>
        <p type="p">330:源極電極</p>
        <p type="p">332:汲極電極</p>
        <p type="p">334:平坦化層</p>
        <p type="p">336:汲極接觸孔</p>
        <p type="p">340:第一電極</p>
        <p type="p">342:發光層</p>
        <p type="p">344:第二電極</p>
        <p type="p">346:堤層</p>
        <p type="p">350:封裝層</p>
        <p type="p">352:第一無機絕緣層</p>
        <p type="p">354:有機絕緣層</p>
        <p type="p">356:第二無機絕緣層</p>
        <p type="p">362:連接電極</p>
        <p type="p">364a:第一絕緣材料層</p>
        <p type="p">364b:第二絕緣材料層</p>
        <p type="p">366:第一觸控電極</p>
        <p type="p">368:第二觸控電極</p>
        <p type="p">370:黑色矩陣</p>
        <p type="p">372:彩色濾光層</p>
        <p type="p">374:第三絕緣層</p>
        <p type="p">380:第二絕緣層</p>
        <p type="p">382:凸透鏡</p>
        <p type="p">384:中心</p>
        <p type="p">386:端</p>
        <p type="p">390:第一絕緣層</p>
        <p type="p">392:凹透鏡</p>
        <p type="p">394:中心</p>
        <p type="p">396:端</p>
        <p type="p">D:發光二極體</p>
        <p type="p">H1:第一水平長度、第一寬度</p>
        <p type="p">H2:第二水平長度、第二寬度</p>
        <p type="p">P:像素區</p>
        <p type="p">Tr:薄膜電晶體</p>
        <p type="p">V1:第一垂直長度、第一深度</p>
        <p type="p">V2:第二垂直長度、第二深度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="823px" img-content="tif" inline="yes" orientation="portrait" width="708px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622179</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125937</doc-number>
          <kind></kind>
          <date>114/07/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C08L71/08</main-classification>
        <further-classification edition="200601120260223B">C09K3/10</further-classification>
        <further-classification edition="200601120260223B">C08G65/12</further-classification>
        <further-classification edition="200601120260223B">C08G18/10</further-classification>
        <further-classification edition="202501120260223B">H10H20/854</further-classification>
        <further-classification edition="200601120260223B">C09J175/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹田吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井豪明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TAKEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小口亮平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGUCHI, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-112605</doc-number>
          <date>20240712</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-112625</doc-number>
          <date>20240712</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>日本</country>
          <doc-number>2024-112633</doc-number>
          <date>20240712</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>日本</country>
          <doc-number>2024-112673</doc-number>
          <date>20240712</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>聚醚化合物之製造方法、具有反應性矽基之聚醚化合物之製造方法、具有胺甲酸酯鍵之聚醚化合物之製造方法及具有聚合性不飽和基之聚醚化合物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明具有羥基之聚醚化合物之製造方法包含在複合金屬氰化物錯合物觸媒存在下使含AO原料中之AO對具有羥基之引發劑進行聚合的步驟，且相對於含AO原料之總質量，含AO原料之甲醇含量為0.0001ppm以上且小於20ppm；具有反應性矽基之聚醚化合物之製造方法更包含將聚醚化合物之羥基轉換成具有反應性矽基之基團的步驟；具有胺甲酸酯鍵之聚醚化合物之製造方法更包含使具有羥基之聚醚化合物與多異氰酸酯進行反應的步驟；並且，具有聚合性不飽和基之聚醚化合物之製造方法更包含將聚醚化合物之羥基轉換成具有聚合性不飽和基之基團的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622111</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114125940</doc-number>
          <kind></kind>
          <date>114/07/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再生元醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REGENERON PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪利洛　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DILILLO, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧爾森　卡拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLSON, KARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>厄爾曼　艾莉卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULLMAN, ERICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/670,016</doc-number>
          <date>20240711</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>GPRC5D　x　CD28雙特異性抗體及其使用方法</chinese-title>
        <english-title>GPRC5D X CD28 BISPECIFIC ANTIBODIES AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供雙特異性抗原結合分子，其包含特異性結合於GPRC5D之第一抗原結合域及特異性結合於CD28之第二抗原結合域。在某些實施例中，抗原結合分子為包含特異性結合於GPRC5D之第一抗原結合域及特異性結合於CD28之第二抗原結合域的雙特異性抗體或其抗原結合片段。在某些實施例中，雙特異性抗體適用於治療癌症(例如多發性骨髓瘤)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides bispecific antigen-binding molecules comprising a first antigen-binding domain that binds specifically to GPRC5D and a second antigen-binding domain that binds specifically to CD28. In certain embodiments, the antigen-binding molecules are bispecific antibodies or antigen-binding fragments thereof that comprise a first antigen-binding domain that binds specifically to GPRC5D and a second antigen-binding domain that binds specifically to CD28. In certain embodiments, the bispecific antibodies are useful for treating a cancer (&lt;i&gt;e.g.&lt;/i&gt;, multiple myeloma).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623661</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126002</doc-number>
          <kind></kind>
          <date>114/07/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/60</main-classification>
        <further-classification edition="202601120260302B">H10W70/63</further-classification>
        <further-classification edition="202601120260302B">H10W70/65</further-classification>
        <further-classification edition="202601120260302B">H10W70/68</further-classification>
        <further-classification edition="202601120260302B">H10W70/685</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W90/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩托　安尼奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ANIKET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴　柏翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, BOHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　志杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHIJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/781,723</doc-number>
          <date>20240723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含具有背側金屬化互連件之整合裝置之封裝</chinese-title>
        <english-title>PACKAGE COMPRISING AN INTEGRATED DEVICE WITH BACK SIDE METALLIZATION INTERCONNECTS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝包含：第一基材；整合裝置，其耦接至該第一基材，其中該整合裝置包含複數個背側金屬化互連件；及第二基材，其透過第一複數個焊料互連件耦接至該第一基材，其中該第二基材透過第二複數個焊料互連件耦接至該複數個背側金屬化互連件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package comprising a first substrate; an integrated device coupled to the first substrate, wherein the integrated device comprises a plurality of back side metallization interconnects; and a second substrate coupled to the first substrate through a first plurality of solder interconnects, wherein the second substrate is coupled to the plurality of back side metallization interconnects through the second plurality of solder interconnects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:板</p>
        <p type="p">102:基材</p>
        <p type="p">104:基材</p>
        <p type="p">105:整合裝置</p>
        <p type="p">106:囊封層</p>
        <p type="p">107:焊料互連件</p>
        <p type="p">109:焊料互連件</p>
        <p type="p">110:板介電層</p>
        <p type="p">111:板互連件</p>
        <p type="p">114:焊料互連件</p>
        <p type="p">120:介電層</p>
        <p type="p">121:互連件</p>
        <p type="p">126:阻焊層</p>
        <p type="p">128:阻焊層</p>
        <p type="p">140:介電層</p>
        <p type="p">141:互連件</p>
        <p type="p">146:阻焊層</p>
        <p type="p">150:柱互連件</p>
        <p type="p">151:背側金屬化互連件</p>
        <p type="p">152:焊料互連件</p>
        <p type="p">156:底部填充物</p>
        <p type="p">200:封裝</p>
        <p type="p">205:整合裝置</p>
        <p type="p">210:電路徑</p>
        <p type="p">250:焊料互連件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="1025px" img-content="tif" inline="yes" orientation="portrait" width="621px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622188</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126013</doc-number>
          <kind></kind>
          <date>114/07/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C09D5/16</main-classification>
        <further-classification edition="200601120260223B">C09D183/07</further-classification>
        <further-classification edition="200601120260223B">C07F7/10</further-classification>
        <further-classification edition="200601120260223B">H05K3/28</further-classification>
        <further-classification edition="202301120260223B">H10K71/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田成紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, SHIGEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-111095</doc-number>
          <date>20240710</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>水性組成物及以該水性組成物處理的物品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種水性組成物，其含有：  &lt;br/&gt;　　(A)由下述式(1)所表示的有機矽化合物  &lt;br/&gt;　　&lt;img align="absmiddle" height="34px" width="325px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(R表示氫原子或碳數1～10之烷基，Z表示具有乙烯性不飽和鍵之基，n表示0、1或2)  &lt;br/&gt;　　(B)非離子界面活性劑  &lt;br/&gt;　　(C)酸  &lt;br/&gt;　　(D)水  &lt;br/&gt;　　，並且  &lt;br/&gt;　　(B)成分的量為相對於水性組成物的總質量為0.0005～0.05質量%，  &lt;br/&gt;　　將前述有機矽化合物S質量份與離子交換水19×S質量份在25℃下並在攪拌下滴入甲醇至液體相溶時的甲醇量定為M質量份時，藉由式(2)求得的(A)成分的G值為1.5以上  &lt;br/&gt;　　&lt;img align="absmiddle" height="38px" width="223px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　該水性組成物含有疏水性高的矽烷偶合劑，塗敷於基材時，可產生介電特性及在高溫或高濕環境下信賴性優異的物品。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623432</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126042</doc-number>
          <kind></kind>
          <date>114/07/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202501120260302B">H10D84/83</further-classification>
        <further-classification edition="200601120260302B">B82B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>温哲睿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, JE-RUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石哲齊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, CHE CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡寬侃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, KUAN-KAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫偉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOON, WEI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,782</doc-number>
          <date>20241127</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/210,876</doc-number>
          <date>20250516</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>堆疊裝置結構的製作方法</chinese-title>
        <english-title>METHOD OF FORMING STACKED DEVICE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供用於將高介電常數介電材料整合在堆疊多閘極裝置結構中以改良熱導率的方法。一種根據本揭示的方法包括形成第一多閘極裝置結構；在基板之上沉積高介電常數介電層；在第一多閘極裝置結構之上接合高介電常數介電層；在高介電常數介電層的接合之後，移除基板；圖案化高介電常數介電層以形成接觸開口；在接觸開口中形成接觸特徵；在高介電常數介電層及接觸特徵之上接合磊晶堆疊；以及執行進一步的製程以自磊晶堆疊形成第二多閘極裝置結構。磊晶堆疊包括藉由複數個第二半導體層交錯的複數個第一半導體層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods for integrating high-kappa dielectric material in stacked multi-gate device structure to improve thermal conductivity. A method according to the present disclosure includes forming a first multi-gate device structure, depositing a high-kappa dielectric layer over a substrate, bonding the high-kappa dielectric layer over the first multi-gate device structure, after the bonding of the high-kappa dielectric layer, removing the substrate, patterning the high-kappa dielectric layer to form a contact opening, forming a contact feature in the contact opening, bonding an epitaxial stack over the high-kappa dielectric layer and the contact feature; and performing further processes to form a second multi-gate device structure from the epitaxial stack. The epitaxial stack includes a plurality of first semiconductor layers interleaved by a plurality of second semiconductor layers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:方塊</p>
        <p type="p">104:方塊</p>
        <p type="p">106:方塊</p>
        <p type="p">108:方塊</p>
        <p type="p">110:方塊</p>
        <p type="p">112:方塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10088.png" file="d10088.TIF" giffile="ed10088.png" height="579px" img-content="tif" inline="yes" orientation="portrait" width="1029px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622106</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126096</doc-number>
          <kind></kind>
          <date>114/07/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K14/575</main-classification>
        <further-classification edition="200601120260302B">A61K38/26</further-classification>
        <further-classification edition="201701120260302B">A61K47/54</further-classification>
        <further-classification edition="201701120260302B">A61K47/65</further-classification>
        <further-classification edition="200601120260302B">A61P3/04</further-classification>
        <further-classification edition="200601120260302B">A61P3/00</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦格納　霍葛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAGNER, HOLGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比克森曼　艾金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIXENMANN, ACHIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷納爾　艾伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRENNAUER, ALBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福克斯　湯姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOX, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼德斯　史緹芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETERS, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托伊費爾　丹尼爾　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEUFEL, DANIEL PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24187900.6</doc-number>
          <date>20240711</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>新穎NMU受體2促效劑</chinese-title>
        <english-title>NOVEL NMU RECEPTOR 2 AGONISTS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於為神經調節肽U受體2 (neuromedin U receptor 2；NMUR2)促效劑之新穎NMU-8類似物、其製備方法、包含其之醫藥組合物及其於療法中的用途，特定言之，於治療或預防與NMUR2活化相關聯或經NMUR2活化調節之疾病及/或病狀(諸如肥胖或其共病)中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to novel NMU-8 analogues that are neuromedin U receptor 2 (NMUR2) agonists, processes for their preparation, pharmaceutical compositions comprising them and their use in therapy, particularly in the treatment or prevention of disease and/or condition associated with or modulated by NMUR2 activation such as obesity or obesity comorbidities.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622641</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126113</doc-number>
          <kind></kind>
          <date>114/07/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G03F7/20</main-classification>
        <further-classification edition="200601120260224B">H02K41/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　珉圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃馬　阿爾瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERMA, ARJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申泰熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, TAEHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬尼　奈森　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINNEY, NATHAN ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,271</doc-number>
          <date>20240722</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有封閉槽設計之開槽型鐵磁性核心多相動子</chinese-title>
        <english-title>SLOTTED FERROMAGNETIC CORE POLYPHASE FORCER WITH CLOSED SLOT DESIGN</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種用於LiMMS致動器之具有一新穎「封閉槽」鐵核心設計之開槽型鐵核心馬達，其實現在不顯著降低驅動力密度、熱效能及可製造性的情況下，大幅降低驅動紋波/齒槽效應轉矩。在較佳實施例中，該封閉槽以一薄鐵磁性層完全覆蓋置放於該等槽內部之線圈，該薄鐵磁性層在本發明中可稱為一鐵磁性橋接件。由與鐵磁性鐵核心開槽型電樞相同之材料製成的該鐵磁性橋接件藉由產生自高磁導率至等於1之一相對磁導率的一平滑過渡來減小齒槽效應轉矩，此舉消除磁阻中作為引起齒槽效應轉矩之一顯著因素的一陡峭的方波式變化。在一些實施例中，使用此新穎設計將齒槽效應轉矩降低至原來的二分之一。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a slotted iron core motor with a novel “closed slot” iron core design for the LiMMS actuator that allows significant drive ripple/cogging reduction without introducing significant penalties on drive force density, thermal performance and manufacturability. In preferred embodiments, the closed slot completely covers the coils placed inside the slots with a thin ferromagnetic layer that may be referred to in this disclosure as a ferromagnetic bridge. The ferromagnetic bridge being made of the same material as the ferromagnetic iron core slotted armature reduces cogging by creating a smooth transition from high permeability to a relative permeability of 1, which eliminates a steep, square-wave style in the magnetic reluctance that is a significant factor in causing cogging. In some embodiments, cogging is reduced by a factor of 2 using this novel design.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:圖示</p>
        <p type="p">405:鐵磁性橋接件</p>
        <p type="p">410:冷卻表面/參考位置</p>
        <p type="p">415:電線圈</p>
        <p type="p">420:鐵磁性齒狀物</p>
        <p type="p">425:鐵核心電樞</p>
        <p type="p">430:經圓化基底輪廓</p>
        <p type="p">435:經圓化橋接件輪廓</p>
        <p type="p">440:磁體陣列</p>
        <p type="p">445:鐵核心電樞結構</p>
        <p type="p">a:相位</p>
        <p type="p">a':相位</p>
        <p type="p">b':相位</p>
        <p type="p">c:相位</p>
        <p type="p">c':相位</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="579px" img-content="tif" inline="yes" orientation="portrait" width="772px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623309</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126120</doc-number>
          <kind></kind>
          <date>114/07/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H05H1/46</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庄司省吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOJI, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>四本松康太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIHOMMATSU, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-114353</doc-number>
          <date>20240717</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置及電源系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提昇電漿處理裝置中之電漿處理之製程性能的技術。電漿處理裝置具備：RF信號產生器；及電壓脈衝信號產生器，其電性連接於偏壓電極，構成為產生電壓脈衝信號，其中電壓脈衝信號具有重複週期，重複週期之各者包含重複具有第1電壓脈衝之序列之第1期間、及重複具有第2電壓脈衝之序列之第2期間，第1電壓脈衝之序列所包含之各第1電壓脈衝具有第1工作比及第1頻率，第2電壓脈衝之序列所包含之各第2電壓脈衝具有第2工作比及第2頻率，第1工作比與第2工作比不同，及/或第1頻率與第2頻率不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">2:控制部</p>
        <p type="p">2a:電腦</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通信介面</p>
        <p type="p">10:腔室</p>
        <p type="p">11:基板支持部</p>
        <p type="p">12:電漿產生部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="619px" img-content="tif" inline="yes" orientation="portrait" width="480px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622125</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126131</doc-number>
          <kind></kind>
          <date>114/07/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C08F2/48</main-classification>
        <further-classification edition="200601120260223B">B32B27/36</further-classification>
        <further-classification edition="201801120260223B">C09J7/40</further-classification>
        <further-classification edition="200601120260223B">C09D5/20</further-classification>
        <further-classification edition="200601120260223B">C08J5/22</further-classification>
        <further-classification edition="201901120260223B">B32B7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗薄膜先端加工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY ADVANCED FILM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍬形昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAGATA, MASARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上岡武則</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEOKA, TAKENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笠原康宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASAHARA, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山根延久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANE, NOBUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-112227</doc-number>
          <date>20240712</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>剝離薄膜及附有剝離薄膜之黏著帶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種與黏著帶的剝離性良好的非氟系剝離薄膜。一種剝離薄膜，其係包含聚酯薄膜與脫模層之剝離薄膜，其中前述聚酯薄膜包含氧化鈦，前述脫模層為含有具有碳數8以上的烷基之化合物之活性能量線硬化性組成物的硬化層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:聚酯薄膜</p>
        <p type="p">11:剝離薄膜</p>
        <p type="p">20:捲出裝置</p>
        <p type="p">30:塗布裝置</p>
        <p type="p">40:乾燥裝置</p>
        <p type="p">50:紫外線照射裝置</p>
        <p type="p">51:輸送輥</p>
        <p type="p">52:紫外線產生裝置</p>
        <p type="p">60:捲取裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="717px" img-content="tif" inline="yes" orientation="portrait" width="807px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621726</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126134</doc-number>
          <kind></kind>
          <date>114/07/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/08</main-classification>
        <further-classification edition="201701120260302B">A61K47/64</further-classification>
        <further-classification edition="200601120260302B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商愛杜西亞製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDORSIA PHARMACEUTICALS LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布魯克　菲立克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROECKER, FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費瑞爾　喬昂　米格爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREIRE, JOAO MIGUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
              <english-address>PT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/EP2024/069748</doc-number>
          <date>20240711</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含艱難擬梭菌疫苗之醫藥組合物</chinese-title>
        <english-title>PHARMACEUTICAL COMPOSITION COMPRISING CLOSTRIDIOIDES DIFFICILE VACCINE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種疫苗調配物，其包含式(I)之多醣-蛋白質結合物、包含醫藥上可接受之鋁鹽之佐劑、醫藥上可接受之緩衝劑及水；及其於療法中，特定言之於預防及/或治療與艱難擬梭菌(&lt;i&gt;Clostridioides difficile&lt;/i&gt;)相關聯之疾病之用途。  &lt;br/&gt;&lt;img align="absmiddle" height="268px" width="619px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a vaccine formulation comprising a polysaccharide-protein conjugate of formula (I), an adjuvant comprising a pharmaceutically acceptable aluminum salt, a pharmaceutically acceptable buffer, and water; and its use in therapy, in particular for prevention and/or treatment of diseases associated with &lt;i&gt;Clostridioides difficile&lt;/i&gt;. &lt;br/&gt;&lt;img align="absmiddle" height="274px" width="643px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="598px" img-content="tif" inline="yes" orientation="portrait" width="659px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623570</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126138</doc-number>
          <kind></kind>
          <date>114/07/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/10</main-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＤＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TDK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小番達裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTSUGAI, TATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤紘大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KODAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部知史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TOMOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-111669</doc-number>
          <date>20240711</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>映射裝置及裝載埠裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供無論檢測對象物有無撓曲均能夠精確地檢測檢測對象物的收納狀態的映射裝置及具有映射裝置的裝載埠。映射裝置（20）檢測收納於容器（10）中的板狀的檢測對象物（100）的收納狀態。映射裝置（20）包括：第一感測器，具有沿著容器（10）的開口（14）延伸的第一光軸（33）；以及第二感測器，具有第二光軸（43a），此第二光軸（43a）以與第一光軸（33）傾斜地交叉的方式朝向容器（10）的側方延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:門</p>
        <p type="p">10:容器</p>
        <p type="p">11:主體</p>
        <p type="p">12a,12b:架子</p>
        <p type="p">14:開口部</p>
        <p type="p">16a,16b:側壁</p>
        <p type="p">20:映射裝置</p>
        <p type="p">22:映射臂</p>
        <p type="p">23a,23b:夾具</p>
        <p type="p">24a,24b:第一部分</p>
        <p type="p">25a,25b:第二部分</p>
        <p type="p">33:第一光軸</p>
        <p type="p">43a,43b:第二光軸</p>
        <p type="p">100:基板</p>
        <p type="p">110a,110b:側方部</p>
        <p type="p">111a,111b:角部</p>
        <p type="p">112:正面端</p>
        <p type="p">S1:第一邊</p>
        <p type="p">S2:第二邊</p>
        <p type="p">S3:第三邊</p>
        <p type="p">θa,θb:角度(傾斜角度)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.png" file="d10023.TIF" giffile="ed10023.png" height="678px" img-content="tif" inline="yes" orientation="portrait" width="502px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622515</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126157</doc-number>
          <kind></kind>
          <date>114/07/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G01R1/073</main-classification>
        <further-classification edition="202001120260224B">G01R31/26</further-classification>
        <further-classification edition="200601120260224B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDOU, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤田裕人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJITA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉山克昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIYAMA, KATSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-115426</doc-number>
          <date>20240719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>檢查裝置、及檢查用治具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠提高元件與探針接觸的精度，同時降低檢查成本之技術。  &lt;br/&gt;檢查裝置係進行元件的檢查。檢查裝置具備：探針卡，係具有會和該元件接觸的探針；多個彈性塊，係和該探針卡電連接；以及彈性框架，係收容該多個彈性塊。該探針卡係由被分割後的多個小型探針卡形成。該多個小型探針卡的每一個係被固定在該彈性框架而一體化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:檢查裝置</p>
        <p type="p">21:測試器</p>
        <p type="p">22:母板</p>
        <p type="p">221:端子</p>
        <p type="p">23:殼體</p>
        <p type="p">30:檢查用治具</p>
        <p type="p">31:彈性框架</p>
        <p type="p">32:框架本體</p>
        <p type="p">33:收容孔</p>
        <p type="p">35:彈性塊</p>
        <p type="p">36:塊本體</p>
        <p type="p">37:第1端子</p>
        <p type="p">38:第2端子</p>
        <p type="p">40:探針卡</p>
        <p type="p">41:小型探針卡</p>
        <p type="p">42:卡本體</p>
        <p type="p">421:端子</p>
        <p type="p">43:探針</p>
        <p type="p">44:固定部</p>
        <p type="p">50:配線構件</p>
        <p type="p">51:本體</p>
        <p type="p">52:第1端子</p>
        <p type="p">53:第2端子</p>
        <p type="p">60:固定機構</p>
        <p type="p">61:密封構件</p>
        <p type="p">62:波紋管構件</p>
        <p type="p">63:第1吸引裝置</p>
        <p type="p">64:第2吸引裝置</p>
        <p type="p">70:台座</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="1007px" img-content="tif" inline="yes" orientation="portrait" width="674px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622235</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126226</doc-number>
          <kind></kind>
          <date>114/07/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201001120260302B">C12N15/113</main-classification>
        <further-classification edition="200601120260302B">C12N9/22</further-classification>
        <further-classification edition="200601120260302B">C12N15/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商四川至善唯新生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SICHUAN REAL&amp;BEST BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董飆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, BIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉靜婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, JINGYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/105047</doc-number>
          <date>20240711</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ＲＮＡ反式剪接分子和系統</chinese-title>
        <english-title>RNA TRANS-SPLICING MOLECULES AND SYSTEMS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了涉及反式剪接的新型RNA編輯/表現系統。具體而言，本文提供了工程化的RNA反式剪接分子（RTM），其可以藉由編輯pre-mRNAs而不是基因來修復內源突變或功能失調的蛋白質。此外，還提供了基於兩個或多個工程化RTM的雙/多RTM系統，其可以形成穩定的互補配對結構，並產生獨立於內源mRNAs的靶基因的全長成熟mRNAs。雙/多RTM系統克服了單個載體的包裝容量限制，並允許大基因（例如，成熟mRNA ＞ 5 kb）的有效表現。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are novel RNA editing/expression systems that involve trans-splicing. Specifically, provided herein are engineered RNA Trans-Splicing Molecules (RTMs) that can repair endogenous mutant or dysfunctional proteins by editing the pre-mRNAs instead of the genes. Additionally, dual/multiple RTM systems based on two or more engineered RTMs are also provided, which can form stable complementary-pairing structures and produce full-length, mature mRNAs of target genes independent of the endogenous mRNAs. The dual/multiple RTM systems overcome the packaging capacity limitations of single vectors and allow efficient expression of large genes (&lt;i&gt;e.g.&lt;/i&gt;, with mature mRNA ＞ 5 kb).</p>
      </isu-abst>
      <representative-img>
        <p type="p">3’ss:3’剪接位點</p>
        <p type="p">5’ss:5’剪接位點BP:分支點</p>
        <p type="p">PPT:多嘧啶束</p>
        <p type="p">RTM:RNA反式剪接分子</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="482px" img-content="tif" inline="yes" orientation="portrait" width="942px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623527</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126260</doc-number>
          <kind></kind>
          <date>114/07/11</date>
        </document-id>
      </application-reference>
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        <main-classification edition="202601120260302B">H10P50/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本隆治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, RYUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-144371</doc-number>
          <date>20240826</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>處理方法、半導體裝置之製造方法、處理裝置及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供能夠使將基板表面的特定材料選擇性地除去時的處理時間大幅縮短的技術。  &lt;br/&gt;本發明之解決手段係將包含下述步驟之循環進行既定次數：準備基板之步驟，係進行(a)藉由使在表面具有第1材料、與形成於第2材料上之第3材料的基板暴露於改質劑，使上述改質劑含有之抑制劑吸附於上述第1材料之表面的步驟，與(b)藉由使上述基板暴露於反應劑，使上述第3材料之至少一部分與上述反應劑反應而生成反應生成物的步驟；與(c)藉由對上述基板施加能量，而並行地進行上述反應生成物的除去、與上述抑制劑之除去及無效化中的至少任一者的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="1060px" img-content="tif" inline="yes" orientation="portrait" width="608px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622603</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126337</doc-number>
          <kind></kind>
          <date>114/07/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G02C5/00</main-classification>
        <further-classification edition="200601120260226B">G02C11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盛蕾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯怡利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YI-LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫鼎成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, TING-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/683,687</doc-number>
          <date>20240815</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>穿戴裝置</chinese-title>
        <english-title>WEARABLE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種穿戴裝置，包括一鏡腳、一鏡框及一樞軸模組。鏡框可動地連接於鏡腳。樞軸模組包括一支架、至少一第一阻尼件、一連接件及至少一第二阻尼件。支架連接於鏡框且沿一第一轉動軸線可轉動地連接於連接件。第一阻尼件位於支架及連接件之間。連接件可轉動地連接於至少一第二阻尼件的其中之一。第二阻尼件連接於鏡腳。連接件包括一齒條，第二阻尼件包括一齒輪，齒條嚙合於齒輪。連接件的一第二轉動軸線相異於第一轉動軸線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wearable device including a temple, a frame and a pivot module is provided. The frame is movably connected to the temple. The pivot module includes a bracket, at least one first damping member, a connecting member and at least one second damping member. The bracket is connected to the frame and is rotatably connected to the connecting member along a first axis. The first damping member is located between the bracket and the connecting member. The connecting member is rotatably connected to one of the at least one second damping member. The second damping member is connected to the temple. The connecting member includes a rack, and the second damping member includes a gear. The rack is engaged with the gear. A second axis of the connecting member is different from the first axis.</p>
      </isu-abst>
      <representative-img>
        <p type="p">C:轉動中心</p>
        <p type="p">L1:第一轉動軸線</p>
        <p type="p">L2:第二轉動軸線</p>
        <p type="p">P:容置空間</p>
        <p type="p">X-Y-Z:直角座標</p>
        <p type="p">100:穿戴裝置</p>
        <p type="p">110:鏡腳</p>
        <p type="p">120:鏡框</p>
        <p type="p">121:鏡腳連接部</p>
        <p type="p">122:鏡片連接部</p>
        <p type="p">130:鏡片</p>
        <p type="p">200:樞軸模組</p>
        <p type="p">210:支架</p>
        <p type="p">220a:第一阻尼件</p>
        <p type="p">230:連接件</p>
        <p type="p">231:齒條</p>
        <p type="p">240a:第二阻尼件</p>
        <p type="p">241a:齒輪</p>
        <p type="p">242:第二阻尼主體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="716px" img-content="tif" inline="yes" orientation="portrait" width="968px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202621697</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126349</doc-number>
          <kind></kind>
          <date>114/07/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/675</main-classification>
        <further-classification edition="200601120260302B">C07F9/6561</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">A61P17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瑞克迪斯醫藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RECLUDIX PHARMA, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷格曼　霍華德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREGMAN, HOWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約曼　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEOMAN, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐寧　珍妮佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOWNING, JENNIFER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷茲尼克　塞繆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REZNIK, SAMUEL K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西克邁爾　歐內斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SICKMIER, ERNEST ALLEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錢切塔　喬瓦尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIANCHETTA, GIOVANNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦斯瓦尼　里希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VASWANI, RISHI G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢富爾科　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIFULCO, NEIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田　夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰斯科　安卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TASKER, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍多斯　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HODOUS, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/670,686</doc-number>
          <date>20240712</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/743,999</doc-number>
          <date>20250110</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ＳＴＡＴ６調節劑及其用途</chinese-title>
        <english-title>STAT6 MODULATORS AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本文總體上關於STAT6調節劑及其用途，並且更特別地關於可用於治療與STAT6相關的症狀的化合物、其鹽和組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates generally to STAT6 modulators and uses thereof, and more specifically to compounds, salts, and compositions thereof useful for treating conditions associated with STAT6.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
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        <document-id>
          <doc-number>202623306</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114126390</doc-number>
          <kind></kind>
          <date>114/07/11</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120260223B">H05H1/00</main-classification>
        <further-classification edition="200601120260223B">H05H1/46</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒木魁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAKI, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霜田恵一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMODA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
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                <last-name>村上拓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, HIRAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/673,274</doc-number>
          <date>20240719</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2025/022706</doc-number>
          <date>20250624</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置及控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種掌握電漿之狀態之電漿處理裝置及控制方法。  &lt;br/&gt;本發明之電漿處理裝置具備：電漿處理腔室；基台，其配置於上述電漿處理腔室內；靜電吸盤，其配置於上述基台之上部，且包含複數個分割區域；吸附電極，其配置於上述靜電吸盤內；加熱器電極，其於上述吸附電極之下方，配置於上述複數個分割區域之各者；加熱器電源，其電性連接於上述加熱器電極；表面電位測定裝置，其電性連接於上述吸附電極，且具有表面電位計；及控制部；且上述控制部基於由上述加熱器電源施加至上述加熱器電極之電力之設定值、及由上述表面電位計測得之電位，算出電漿之狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">60:加熱器電源</p>
        <p type="p">70:表面電位測定裝置</p>
        <p type="p">71:濾波器</p>
        <p type="p">72:銅圓板</p>
        <p type="p">73:銅板</p>
        <p type="p">74:丙烯酸系樹脂板</p>
        <p type="p">75:探針</p>
        <p type="p">76:表面電位計</p>
        <p type="p">77:信號記錄裝置</p>
        <p type="p">78:電位測定系統</p>
        <p type="p">80:吸盤電源</p>
        <p type="p">81:繼電器箱(切換部)</p>
        <p type="p">81a:開關</p>
        <p type="p">111:本體部</p>
        <p type="p">112:環組件</p>
        <p type="p">1110:基台</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">1111a:陶瓷構件</p>
        <p type="p">1111b:靜電吸盤電極(吸附電極)</p>
        <p type="p">1111c:加熱器電極</p>
        <p type="p">V2:電壓</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="767px" img-content="tif" inline="yes" orientation="portrait" width="1014px">
          </img>
        </representative>
      </representative-img>
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          <doc-number>202622236</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114126411</doc-number>
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          <date>114/07/11</date>
        </document-id>
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        <main-classification edition="201001120260302B">C12N15/113</main-classification>
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        <further-classification edition="200601120260302B">A61P43/00</further-classification>
        <further-classification edition="200601120260302B">A61P3/06</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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                <last-name>大陸商上海拓界生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUOJIE BIOTECH (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>董道銀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, DAOYIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉浩淼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HAOMIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>林曉燕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, XIAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李云飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YUNFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024109332966</doc-number>
          <date>20240712</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024111182238</doc-number>
          <date>20240815</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025100142250</doc-number>
          <date>20250106</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>202510286757X</doc-number>
          <date>20250312</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>2025105800571</doc-number>
          <date>20250507</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>靶向miR-132的反義寡核苷酸及其醫藥用途</chinese-title>
        <english-title>ANTISENSE OLIGONUCLEOTIDE TARGETING MIR-132 AND THE PHARMACEUTICAL USE THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及靶向miR-132的反義寡核苷酸及其醫藥用途。具體地，本揭露涉及靶向miR-132的反義寡核苷酸、醫藥組成物及其醫藥用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to antisense oligonucleotide targeting miR-132 and the pharmaceutical use thereof. Specifically, the present disclosure relates to antisense oligonucleotide targeting miR-132, the pharmaceutical composition, and the pharmaceutical use thereof.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="367px" img-content="tif" inline="yes" orientation="portrait" width="587px">
          </img>
        </representative>
      </representative-img>
    </description>
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        <document-id>
          <doc-number>202622505</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114126425</doc-number>
          <kind></kind>
          <date>114/07/11</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120260302B">G01N33/68</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P25/28</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商衛材Ｒ&amp;Ｄ企管股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EISAI R&amp;D MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>堀江勘太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIE, KANTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維爾德史密斯　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILDSMITH, KRISTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>德瓦納拉揚　維斯瓦納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEVANARAYAN, VISWANATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩迪夫　帕拉宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SACHDEV, PALLAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/670,673</doc-number>
          <date>20240712</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/763,784</doc-number>
          <date>20250226</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>流體生物標誌物</chinese-title>
        <english-title>FLUID BIOMARKER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了診斷、選擇、監測和治療患有阿茲海默症（AD）、疑似患有阿茲海默症或有患上阿茲海默症風險的受試者之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods of diagnosing, selecting, monitoring, and treating subjects having, suspected of having, or at risk for developing Alzheimer’s disease (AD).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
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      <isuno>11</isuno>
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        <document-id>
          <doc-number>202621682</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114126437</doc-number>
          <kind></kind>
          <date>114/07/11</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120260302B">A61K31/445</main-classification>
        <further-classification edition="200601120260302B">A61P3/00</further-classification>
        <further-classification edition="200601120260302B">A61P25/28</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商雅捷法羅斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AZAFAROS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍斯科拿　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANDSKRONER, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗雷塔哥　克里斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREITAG, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅培茲　迪　芙魯托斯　蘿拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPEZ DE FRUTOS, LAURA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24382745.8</doc-number>
          <date>20240711</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>歐洲專利局</country>
          <doc-number>24382953.8</doc-number>
          <date>20240904</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>歐洲專利局</country>
          <doc-number>25382030.2</doc-number>
          <date>20250120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>溶酶體儲積症之治療</chinese-title>
        <english-title>TREATMENT OF LYSOSOMAL STORAGE DISORDERS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於尼佐格司他(nizubaglustat)之用途，其用於治療人類個體之溶酶體儲積症。具體而言，本發明係關於劑量為每天總計3 mg至9 mg尼佐格司他之用途。本發明亦係關於包括劑量為每天總計3 mg至9 mg尼佐格司他之醫藥組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to the use of nizubaglustat in treating a lysosomal storage disorder in a human subject. Specifically, the invention relates to the use of nizubaglustat at a dose of 3mg – 9mg total/day. The invention also relates to pharmaceutical compositions comprising nizubaglustat at a dose of 3mg – 9mg total/day.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10035.JPG" file="ed10035.JPG" height="718px" img-content="tif" inline="yes" orientation="portrait" width="1101px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621688</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126449</doc-number>
          <kind></kind>
          <date>114/07/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/513</main-classification>
        <further-classification edition="200601120260302B">A61P31/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾森伯利生物科學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASSEMBLY BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄢然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/670,717</doc-number>
          <date>20240712</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療對第一抗病毒療法不具反應的病毒感染之環脲噻唑基化合物</chinese-title>
        <english-title>CYCLIC UREA THIAZOLYL COMPOUND FOR TREATMENT OF VIRAL INFECTIONS UNRESPONSIVE TO TREATMENT WITH A FIRST ANTIVIRAL THERAPY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供使用環脲噻唑化合物治療及預防對一或多種第一抗病毒療法不具反應的病毒感染之方法及醫藥調配物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods and pharmaceutical formulations for the treatment and prophylaxis of a viral infection unresponsive to treatment with one or more first antiviral therapy using a cyclic urea thiozole compound.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.JPG" file="ed10025.JPG" height="961px" img-content="tif" inline="yes" orientation="portrait" width="796px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622242</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126452</doc-number>
          <kind></kind>
          <date>114/07/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/85</main-classification>
        <further-classification edition="200601120260302B">C12N15/11</further-classification>
        <further-classification edition="200601120260302B">C12N9/22</further-classification>
        <further-classification edition="200601120260302B">A61K9/51</further-classification>
        <further-classification edition="202501120260302B">A61K9/127</further-classification>
        <further-classification edition="200601120260302B">A61K47/24</further-classification>
        <further-classification edition="200601120260302B">A61K47/18</further-classification>
        <further-classification edition="200601120260302B">A61K47/10</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商石藥集團中奇製藥技術（石家莊）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CSPC ZHONGQI PHARMACEUTICAL TECHNOLOGY (SHIJIAZHUANG) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王浩岩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HAOYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杭宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苏晓晔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, XIAOYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏立帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, LIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吴磊彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, LEIBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杨旋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁思娴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QI, SIXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>钟菲娅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, FEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杨思聪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SICONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董亚丽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, YALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张雅婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YATING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李春雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHUNLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>张志超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHICHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, MENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202410929061X</doc-number>
          <date>20240711</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2025100678554</doc-number>
          <date>20250116</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種非病毒載體介導的大片段DNA定點敲入系統</chinese-title>
        <english-title>A NON-VIRAL VECTOR-MEDIATED SITE-SPECIFIC KNOCK-IN SYSTEM FOR LARGE DNA FRAGMENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及向原代細胞中導入目的核酸序列的方法，所述目的核酸序列插入所述原代細胞的基因組中和/或在所述原代細胞中表達，所述方法包含將所述原代細胞與包載有線性DNA的核酸-脂質奈米顆粒組合物接觸。本申請還進一步提供了所述包載有線性DNA的核酸-脂質奈米顆粒組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to a method for introducing a target nucleic acid sequence into primary cells, wherein the target nucleic acid sequence is inserted into the genome of the primary cells and/or expressed therein. The method comprises contacting the primary cells with a nucleic acid-lipid nanoparticle composition encapsulating linear DNAs. The present application also further provides the nucleic acid-lipid nanoparticle composition encapsulating linear DNAs.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.png" file="d10018.TIF" giffile="ed10018.png" height="438px" img-content="tif" inline="yes" orientation="portrait" width="565px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621576</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126467</doc-number>
          <kind></kind>
          <date>114/07/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A23L2/70</main-classification>
        <further-classification edition="200601120260302B">A23L2/72</further-classification>
        <further-classification edition="201901120260302B">C12C11/11</further-classification>
        <further-classification edition="200601120260302B">C12C7/24</further-classification>
        <further-classification edition="200601120260302B">C12C7/26</further-classification>
        <further-classification edition="200601120260302B">C12H1/00</further-classification>
        <further-classification edition="200601120260302B">C12H1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商樂斯福公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LESAFFRE ET COMPAGNIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科林　索尼婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLLIN, SONIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德克萊爾　尼古拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DECLERCQ, NICOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>揚森斯　菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSSENS, PHILIPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡耶　奧利維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAILLE, OLIVIER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>法國</country>
          <doc-number>2407644</doc-number>
          <date>20240712</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>以酵母產品對飲料進行的膠體穩定化</chinese-title>
        <english-title>COLLOIDAL STABILIZATION OF A BEVERAGE WITH A YEAST PRODUCT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所得為一種飲料的製造方法，該方法包含膠體穩定化步驟，以該酵母產品的總重量為基準，該步驟以具有至少為72 %的真實蛋白質含量，以及為3 %或更少的核苷酸含量來實施，並且由此得到如此的膠體穩定化方法及其對應用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is obtained a method for producing a beverage, comprising a colloidal stabilization step implemented with an insoluble yeast product having a true protein content of at least 72 % and nucleotide content of 3 % or less by weight, per total weight of the yeast product, and a colloidal stabilization method as such and corresponding uses.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622108</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126534</doc-number>
          <kind></kind>
          <date>114/07/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K14/715</main-classification>
        <further-classification edition="200601120260302B">C07K14/705</further-classification>
        <further-classification edition="200601120260302B">C07K16/28</further-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商旗艦先鋒創新有限責任(ＶＩＩ)公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLAGSHIP PIONEERING INNOVATIONS VII, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班度克瓦拉　荷茲法　賽夫丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDUKWALA, HOZEFA SAIFUDDIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉塔帕　施魯蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRATAPA, SHRUTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾頓　安吉拉　溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORTON, ANGELA WYNNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈桑　山繆爾　克萊門特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASSAN, SAMUEL CLEMENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/671,604</doc-number>
          <date>20240715</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/671,614</doc-number>
          <date>20240715</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/684,935</doc-number>
          <date>20240820</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>美國</country>
          <doc-number>63/715,908</doc-number>
          <date>20241104</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>美國</country>
          <doc-number>63/715,937</doc-number>
          <date>20241104</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>免疫調節融合蛋白及相關方法</chinese-title>
        <english-title>IMMUNOMODULATORY FUSION PROTEINS AND RELATED METHODS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供免疫調節融合蛋白及包含其之組合物(例如醫藥組合物)；以及製備該等免疫調節融合蛋白及組合物之方法。本文所提供之免疫調節融合蛋白適用於醫藥組合物及使用方法(包括例如抑制或減少(例如防止)個體之促炎性免疫反應之方法)中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are immunomodulatory fusion proteins and compositions (&lt;i&gt;e.g., &lt;/i&gt;pharmaceutical compositions) comprising the same; as well as methods of making the immunomodulatory fusion proteins and compositions. The immunomodulatory fusion proteins provided herein are useful in pharmaceutical compositions and methods of use (including, &lt;i&gt;e.g., &lt;/i&gt;methods of suppressing or reducing (&lt;i&gt;e.g., &lt;/i&gt;preventing) a pro-inflammatory immune response in a subject).</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="457px" img-content="tif" inline="yes" orientation="portrait" width="436px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622470</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126547</doc-number>
          <kind></kind>
          <date>114/07/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">G01F1/76</main-classification>
        <further-classification edition="201901120260223B">G01M13/00</further-classification>
        <further-classification edition="200601120260223B">G05D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃兆隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, CHAO-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張育騫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳庚琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, KENG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡堯琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YAO-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHUNG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭晨宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, CHEN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱慶瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIOU, CHING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/672,644</doc-number>
          <date>20240717</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>噴嘴流量試驗夾具</chinese-title>
        <english-title>NOZZLE FLOW TEST FIXTURE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一個實例提供用於噴嘴氣體流量試驗的方法。該方法包含將試驗氣體供應至噴嘴流量試驗夾具的氣體流入口；測量經由貼附至試驗氣體流出口之試驗噴嘴離開噴嘴流量試驗夾具之試驗氣體的第一氣體流率；同時測量經由貼附至參考氣體流出口之參考噴嘴離開噴嘴流量試驗夾具之試驗氣體的第二氣體流率；以及將第一氣體流率與第二氣體流率進行比較，以判定試驗噴嘴相對於參考噴嘴滿足預定流量條件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">One example provides a method for nozzle gas flow testing. The method comprises supplying test gas to a gas flow inlet of a nozzle flow test fixture; measuring a first gas flow rate of the test gas exiting the nozzle flow test fixture through a test nozzle affixed to a test gas flow outlet; concurrently measuring a second gas flow rate of the test gas exiting the nozzle flow test fixture through a reference nozzle affixed to a reference gas flow outlet; and comparing the first gas flow rate to the second gas flow rate to determine that the test nozzle satisfies a predetermined flow condition relative to the reference nozzle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:方法</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="895px" img-content="tif" inline="yes" orientation="portrait" width="669px">
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                <last-name>KAOHSIUNG MEDICAL UNIVERSITY</last-name>
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                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
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                <first-name></first-name>
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                <first-name></first-name>
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              <address></address>
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              <english-address>TW</english-address>
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                <first-name></first-name>
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                <last-name>WANG, WEN-JYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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              <english-address>TW</english-address>
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                <last-name>林文杰</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          <country>美國</country>
          <doc-number>63/671,283</doc-number>
          <date>20240715</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>微脂體融合誘導腫瘤標靶性囊泡的製備與其應用</chinese-title>
        <english-title>LIPOSOME FUSION-INDUCED TUMOR-TARGETING VESICLES PRODUCTION AND ITS APPLICATIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種細胞外泌體，其中該細胞外泌體的膜表面包含：複數個高流動性微脂體的磷脂；以及一癌細胞的表面蛋白。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An extracellular vesicle, wherein a membrane surface of the extracellular vesicle comprises: a plurality of phospholipids derived from high-fluidity liposomes; and surface proteins derived from a cancer cell.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="469px" img-content="tif" inline="yes" orientation="portrait" width="694px">
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          <date>115/06/01</date>
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        <main-classification edition="202601120260302B">H10P50/28</main-classification>
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                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科羅拉多大學董事會法人團體</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>帕度布魯斯卡亞　漢納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PADDUBROUSKAYA, HANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
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              <chinese-name name-type="organization">
                <last-name>阿貝爾　凱特</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>ABEL, KATE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>帕切科　羅頓達洛　安東尼奧　路易斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PACHECO ROTONDARO, ANTONIO LUIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹迪　奥米德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZANDI, OMID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
              <english-address>IR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉沃特扣　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZYWOTKO, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬治　史蒂芬　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEORGE, STEVEN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/777,718</doc-number>
          <date>20240719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用低溫乾式化學蝕刻製程蝕刻含矽材料的新穎上層膜及方法</chinese-title>
        <english-title>NOVEL OVERLAYER FILMS AND METHODS FOR ETCHING SILICON-CONTAINING MATERIALS USING A LOW TEMPERATURE DRY CHEMICAL ETCH PROCESS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
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      <isu-abst lang="tw">
        <p type="p">方法之多種實施例被提供以利用上層以加速在半導體基板上所提供的下層的蝕刻。本文所揭示的實施例中，超薄（例如，小於 2 nm）上層膜被沉積於下層上，以在低溫（例如，小於或等於 100°C）下執行乾式化學蝕刻處理期間，提升下層之局部蝕刻速率（及對下層之選擇性）。藉由提供介質以在下層之表面進行更有效的化學反應，在低於在裸露下層表面上實現化學反應通常所需的閾值能量以下的溫度，上層膜（包含金屬氧化物或金屬氟化物材料）加速下層的蝕刻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments of methods are provided that utilize an overlayer to accelerate etching of an underlayer provided on a semiconductor substrate. In the embodiments disclosed herein, an ultrathin (e.g., less than 2 nm) overlayer film is deposited onto an underlayer to enhance the local etch rate of (and selectivity to) the underlayer during a dry chemical etch process performed at low temperature (e.g., less than or equal to 100°C). The overlayer film, which comprises a metal oxide or metal fluoride material, accelerates etching of the underlayer at temperatures below the threshold energy typically needed to enable chemical reactions on a bare underlayer surface by providing a medium for more effective chemical reactions at the surface of the underlayer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:處理流程</p>
        <p type="p">205:半導體基板</p>
        <p type="p">210:第一層</p>
        <p type="p">215:第二層</p>
        <p type="p">225:方框</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="976px" img-content="tif" inline="yes" orientation="portrait" width="350px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621575</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126591</doc-number>
          <kind></kind>
          <date>114/07/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A23L2/56</main-classification>
        <further-classification edition="200601120260302B">A23L2/02</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三得利控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNTORY HOLDINGS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢部紗和子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABE, SAWAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安井洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUI, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-115627</doc-number>
          <date>20240719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含有辣椒素之非碳酸飲料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明課題係以在具有酸味之非碳酸飲料中，減輕一口氣飲用時所發生之容易嗆喉不適感為目的。  &lt;br/&gt;　　解決手段為，在酸度為0.4%以上的非碳酸飲料中摻合辣椒素，並將飲料中之辣椒素的濃度調整為0.05ppm以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621573</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126592</doc-number>
          <kind></kind>
          <date>114/07/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A23L2/02</main-classification>
        <further-classification edition="200601120260302B">A23L2/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三得利控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNTORY HOLDINGS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢部紗和子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABE, SAWAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安井洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUI, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-115638</doc-number>
          <date>20240719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含有薑烯酚之非碳酸飲料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明課題係以在具有酸味之非碳酸飲料中，減輕一口氣飲用時所發生之容易嗆喉不適感為目的。  &lt;br/&gt;　　解決手段為，在酸度為0.4%以上的非碳酸飲料中摻合薑烯酚，並將飲料中之薑烯酚的濃度調整為0.02ppm以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622083</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126602</doc-number>
          <kind></kind>
          <date>114/07/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D491/22</main-classification>
        <further-classification edition="200601120260302B">A61K31/4745</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州中美華東製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU ZHONGMEIHUADONG PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陸寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, KUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳樹倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHULUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范貝貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, BEIBEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏炎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　東舟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DONGZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024109397744</doc-number>
          <date>20240715</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024117883091</doc-number>
          <date>20241206</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025104015447</doc-number>
          <date>20250401</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種喜樹鹼類化合物及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種式(I)所示化合物或其藥學上可接受的鹽、酯、立體異構體、互變異構體、多晶型物、溶劑合物、N-氧化物、同位素標記的化合物、代謝物或前藥，包含其的藥物組合物，以及它們用於預防或治療癌症和/或腫瘤及其相關病症的用途。上述化合物具有良好的活性，其內酯環更加穩定，同時具有低外排率兼具更好的安全性，具有明顯的成藥潛力。&lt;br/&gt;&lt;img align="absmiddle" height="133px" width="221px" file="ed10144.JPG" alt="ed10144.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623420</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126643</doc-number>
          <kind></kind>
          <date>114/07/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D64/23</main-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
        <further-classification edition="202501120260302B">H10D84/83</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴寅源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, INWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KANG-ILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/682,657</doc-number>
          <date>20240813</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/096,036</doc-number>
          <date>20250331</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括不同源極/汲極接觸結構的堆疊半導體元件</chinese-title>
        <english-title>STACKED SEMICONDUCTOR DEVICE INCLUDING DIFFERENT SOURCE/DRAIN CONTACT STRUCTURES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體元件，包括：位於第一層級的第一源極/汲極圖案；位於與第一層級垂直不同的第二層級的第二源極/汲極圖案；以及位於第一源極/汲極圖案上的第一接觸結構，其中部分第一源極/汲極圖案位於第一接觸結構的第一凹槽中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a semiconductor device which includes: a 1&lt;sup&gt;st&lt;/sup&gt; source/drain pattern at a 1&lt;sup&gt;st&lt;/sup&gt; level; a 2&lt;sup&gt;nd&lt;/sup&gt; source/drain pattern at a 2&lt;sup&gt;nd&lt;/sup&gt; level vertically different from the 1&lt;sup&gt;st&lt;/sup&gt; level; and a 1&lt;sup&gt;st&lt;/sup&gt; contact structure on the 1&lt;sup&gt;st&lt;/sup&gt; source/drain pattern, wherein a portion of the 1&lt;sup&gt;st&lt;/sup&gt; source/drain pattern is in a 1&lt;sup&gt;st&lt;/sup&gt; recess of the 1&lt;sup&gt;st&lt;/sup&gt; contact structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:堆疊半導體元件</p>
        <p type="p">10A、10B、10C:通道堆疊</p>
        <p type="p">119:閘極間隔件</p>
        <p type="p">135、145:源極/汲極圖案</p>
        <p type="p">150:閘極結構</p>
        <p type="p">GD:閘極介電層</p>
        <p type="p">GE:閘極電極</p>
        <p type="p">UF:金屬層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="575px" img-content="tif" inline="yes" orientation="portrait" width="769px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622734</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126676</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">G06F9/48</main-classification>
        <further-classification edition="200601120260223B">G06F9/50</further-classification>
        <further-classification edition="202201120260223B">G06N10/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商光子公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHOTONIC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加法里　希納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHAFFARI, SINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
              <english-address>IR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沙母巴亞帝　沙布納姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAMBAYATI, SHABNAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　科林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, COLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/671,906</doc-number>
          <date>20240716</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>量子資訊學程序之控制</chinese-title>
        <english-title>CONTROL OF QUANTUM INFORMATICS PROCESSES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於控制一量子資訊學設備(QIA)之設備包含複數個指令佇列單元(IQU)，該QIA包括量子系統及可操作以控制該等量子系統之量子態之裝置。該等IQU之各者包括一資料處理器、一佇列及佇列控制邏輯。各IQU與一對應裝置相關聯。各佇列經組態以保持用於控制該對應裝置之微指令及一相關聯時間點。該資料處理器經組態以基於程序程式執行指令來將用於控制該裝置之微指令插入至該佇列中。該佇列控制邏輯經組態以在基於該等時間點之時間釋放用於控制該對應裝置之該等微指令。該設備之設計可易於擴展。專用於處理各裝置之程式執行指令之資料處理器降低衝突之可能性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatus for controlling a quantum informatics apparatus (QIA) that comprises quantum systems and devices operative to control quantum states of the quantum systems includes plural of instruction queuing units (IQUs). Each of the IQUs comprises a data processor, a queue, and queue control logic. Each IQU is associated with a corresponding device. Each queue is configured to hold micro-instructions for controlling the corresponding device and an associated time point. The data processor is configured to insert micro-instructions for controlling the device into the queue based on process program execution instructions. The queue control logic is configured to release the micro-instructions for controlling the corresponding device at times based on the time points. The design of the apparatus is readily scalable. Dedicated data processors for processing program execution instructions for each device reduces the possibility of conflicts.</p>
      </isu-abst>
      <representative-img>
        <p type="p">40:量子資訊學設備(QIA)</p>
        <p type="p">41A:程式執行指令集</p>
        <p type="p">41B:程式執行指令集</p>
        <p type="p">41C:程式執行指令集</p>
        <p type="p">41D:程式執行指令集</p>
        <p type="p">41E:程式執行指令集</p>
        <p type="p">42A:裝置</p>
        <p type="p">42B:裝置</p>
        <p type="p">42C:裝置</p>
        <p type="p">42D:裝置</p>
        <p type="p">42E:裝置</p>
        <p type="p">43A:指令佇列單元(IQU)</p>
        <p type="p">43B:指令佇列單元(IQU)</p>
        <p type="p">43C:指令佇列單元(IQU)</p>
        <p type="p">43D:指令佇列單元(IQU)</p>
        <p type="p">43E:指令佇列單元(IQU)</p>
        <p type="p">44A:介面</p>
        <p type="p">44B:介面</p>
        <p type="p">44C:介面</p>
        <p type="p">44D:介面</p>
        <p type="p">44E:介面</p>
        <p type="p">47A:微指令</p>
        <p type="p">47B:時間點</p>
        <p type="p">47C:確定性時間佇列(DTQ)邏輯</p>
        <p type="p">47D:佇列</p>
        <p type="p">47E:佇列</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="563px" img-content="tif" inline="yes" orientation="portrait" width="694px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622282</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126679</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C23C16/455</main-classification>
        <further-classification edition="200601120260226B">C23C16/458</further-classification>
        <further-classification edition="200601120260226B">C23C16/46</further-classification>
        <further-classification edition="200601120260226B">C23C16/50</further-classification>
        <further-classification edition="200601120260226B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧恩　陶德　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUNN, TODD ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希羅　艾瑞克　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHERO, ERIC JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/673,569</doc-number>
          <date>20240719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>反應器系統及調變反應器內之基板溫度的方法</chinese-title>
        <english-title>REACTOR SYSTEM AND METHOD OF MODULATING TEMPERATURE OF SUBSTRATE WITHIN REACTOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露用於快速調變一基板之一溫度之反應器系統及方法。例示性反應器系統可包括耦接至一反應器之一反應腔室的一或多個溫度調節氣體源。另外或替代地，例示性反應器系統可包括一升降銷總成，該升降銷總成可在處理期間將一基板移離一基座表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Reactor systems and methods for rapidly modulating a temperature of a substrate are disclosed. Exemplary reactor systems can include one more temperature regulating gas sources coupled to a reaction chamber of a reactor. Additionally or alternatively, exemplary reactor systems can include a lift pin assembly that can move a substrate away from a susceptor surface during processing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:反應器系統</p>
        <p type="p">102:反應器</p>
        <p type="p">104:基座</p>
        <p type="p">105:頂部表面</p>
        <p type="p">106:溫度調節氣體源</p>
        <p type="p">108:溫度調節氣體</p>
        <p type="p">110:導管</p>
        <p type="p">112:氣體分配裝置</p>
        <p type="p">114:升降銷</p>
        <p type="p">116:升降銷</p>
        <p type="p">118:流量控制環</p>
        <p type="p">120:腔室</p>
        <p type="p">122:腔室壁</p>
        <p type="p">124:閘閥開口</p>
        <p type="p">126:導管開口</p>
        <p type="p">127:區段</p>
        <p type="p">128:上部腔室區或處理區</p>
        <p type="p">129:孔</p>
        <p type="p">130:下部腔室區或裝載/卸載區</p>
        <p type="p">132:基板</p>
        <p type="p">134:溫度調節裝置</p>
        <p type="p">136:機構</p>
        <p type="p">138:底部腔室壁</p>
        <p type="p">140:氣體溫度調節裝置</p>
        <p type="p">142:閥</p>
        <p type="p">144:閥</p>
        <p type="p">146:入口</p>
        <p type="p">148:孔</p>
        <p type="p">150:充氣室</p>
        <p type="p">152:排氣路徑</p>
        <p type="p">154:排氣路徑</p>
        <p type="p">156:真空源</p>
        <p type="p">158:控制器</p>
        <p type="p">160:絕緣體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="801px" img-content="tif" inline="yes" orientation="portrait" width="1118px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623354</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126691</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜昌錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝　瑞英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, RUIYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪卡拉　拉古維爾Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKALA, RAGHUVEER S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴德　艾咪琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHILD, AMY LYNN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費雪伯恩　菲德里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISHBURN, FREDRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭會晟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, HOI SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　智君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHIJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普蘭薩西哈蘭　巴拉薩拉瑪年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/795,651</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於經摻雜模具之DRAM單元製造方法</chinese-title>
        <english-title>DRAM CELL FABRICATION APPROACHES FOR DOPED MOLD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了一種形成3D DRAM單元的方法。一個方法可能包括在從槽延伸的複數個側向開口內形成介電襯墊和填充材料，其中複數個側向開口和槽是在碳摻雜的交替第一層和第二層堆疊中形成的，並從複數個側向開口中部分移除介電襯墊。該方法還可能包括沿著複數個側向開口和槽形成犧牲層、移除犧牲層，以及在移除犧牲層後沿著複數個側向開口和槽形成閘極介電質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Approaches for forming 3D DRAM cells are disclosed. One method may include forming a dielectric liner and a fill material within a plurality of lateral openings extending from a slot, wherein the plurality of lateral openings and the slot are formed in a carbon-doped stack of alternating first layers and second layers, and partially removing the dielectric liner from the plurality of lateral openings. The method may further include forming a sacrificial layer along the plurality of lateral openings and the slot, removing the sacrificial layer, and forming a gate dielectric along the plurality of lateral openings and the slot following removal of the sacrificial layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理系統</p>
        <p type="p">102:工廠介面</p>
        <p type="p">104,106:裝載閘腔室</p>
        <p type="p">108,110:轉移腔室</p>
        <p type="p">112,114:轉移機器人</p>
        <p type="p">116,118:保存腔室</p>
        <p type="p">120~130:處理腔室</p>
        <p type="p">140:對接站</p>
        <p type="p">142:工廠介面機器人</p>
        <p type="p">144:前開口統一晶圓盒(FOUP)</p>
        <p type="p">148:葉片</p>
        <p type="p">150~176:端口</p>
        <p type="p">190:系統控制器</p>
        <p type="p">192:中央處理單元(CPU)</p>
        <p type="p">194:記憶體</p>
        <p type="p">196:支援電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="860px" img-content="tif" inline="yes" orientation="portrait" width="711px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623045</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126693</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01J37/32</main-classification>
        <further-classification edition="200601120260224B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫姆　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUMOU, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈瑞歐　傑高</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRELL, JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　丹尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, DENNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭森　奈森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANSOM, NATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克庫斯柯　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCCUSKER, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/796,165</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>分散式射頻系統中射頻功率傳輸的控制</chinese-title>
        <english-title>CONTROL OF RF POWER DELIVERY IN A DISTRIBUTED RF SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處描述的實施例與一種設備相關，該設備包括RF電源供應器和RF功率分流器。在一個實施例中，RF功率分流器包含複數個輸出端，並且複數個RF阻抗匹配設備與RF功率分流器的複數個輸出端中的不同輸出端電氣耦合。在一個實施例中，複數個RF感測器被配置用來量測沿著複數個傳輸線的電壓及/或電流，該複數個傳輸線將RF功率分流器的複數個輸出端中每一個耦合到複數個RF阻抗匹配設備中一不同者。在一個實施例中，設備進一步包括與複數個RF感測器和複數個RF阻抗匹配設備通信耦合的控制器。控制器被配置為利用去調諧操作平衡通過複數個RF阻抗匹配設備的功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to an apparatus that includes an RF power supply and an RF power splitter. In an embodiment, the RF power splitter includes a plurality of outputs, and a plurality of RF impedance matches are electrically coupled to different ones of the plurality of outputs of the RF power splitter. In an embodiment, a plurality of RF sensors are configured to measure a voltage and/or a current along a plurality of transmission lines that couple each of the plurality of outputs of the RF power splitter to a different one of the plurality of RF impedance matches. In an embodiment, the apparatus further includes a controller communicatively coupled to the plurality of RF sensors and the plurality of RF impedance matches. The controller is configured to balance power that passes through the plurality of RF impedance matches with a detuning operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:傳輸系統</p>
        <p type="p">105:電源</p>
        <p type="p">106:傳輸線</p>
        <p type="p">110:功率分流器</p>
        <p type="p">111&lt;sub&gt;A&lt;/sub&gt;:傳輸線</p>
        <p type="p">111&lt;sub&gt;B&lt;/sub&gt;:傳輸線</p>
        <p type="p">111&lt;sub&gt;C&lt;/sub&gt;:傳輸線</p>
        <p type="p">111&lt;sub&gt;D&lt;/sub&gt;:傳輸線</p>
        <p type="p">115&lt;sub&gt;A&lt;/sub&gt;:阻抗匹配設備</p>
        <p type="p">115&lt;sub&gt;B&lt;/sub&gt;:阻抗匹配設備</p>
        <p type="p">115&lt;sub&gt;C&lt;/sub&gt;:阻抗匹配設備</p>
        <p type="p">115&lt;sub&gt;D&lt;/sub&gt;:阻抗匹配設備</p>
        <p type="p">120&lt;sub&gt;A&lt;/sub&gt;:電漿腔室</p>
        <p type="p">120&lt;sub&gt;B&lt;/sub&gt;:電漿腔室</p>
        <p type="p">120&lt;sub&gt;C&lt;/sub&gt;:電漿腔室</p>
        <p type="p">120&lt;sub&gt;D&lt;/sub&gt;:電漿腔室</p>
        <p type="p">124:晶圓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10084.JPG" file="ed10084.JPG" height="668px" img-content="tif" inline="yes" orientation="portrait" width="888px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623463</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126710</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260226B">H10F39/12</main-classification>
        <further-classification edition="202301120260226B">H04N25/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩田佳典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWATA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野澤克徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOZAWA, KATSUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-138899</doc-number>
          <date>20240820</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光檢測裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之光檢測裝置包含：底壁部；側壁部，其配置於底壁部上，劃定朝與底壁部相反側開口之開口部；光檢測部，其配置於底壁部上，具有複數個光檢測區域；及窗構造部，其覆蓋開口部；且窗構造部具有：第1框部，其具有自與底壁部交叉之方向觀察之情形下與複數個光檢測區域分別重疊之複數個第1開口；複數個光學構件，其等具有透光性，以分別覆蓋複數個第1開口之方式配置於第1框部上；及第2框部，其在與底壁部交叉之方向上相對於第1框部配置於與底壁部相反側，具有自與底壁部交叉之方向觀察之情形下與複數個光檢測區域分別重疊之複數個第2開口；複數個光學構件分別由複數個第2開口之內表面包圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光檢測裝置</p>
        <p type="p">2:底壁部</p>
        <p type="p">3:側壁部</p>
        <p type="p">3a:頂面</p>
        <p type="p">4:光檢測部</p>
        <p type="p">5:窗構造部</p>
        <p type="p">6:第1框部</p>
        <p type="p">6f:第1開口</p>
        <p type="p">7:第2框部</p>
        <p type="p">7b:上表面</p>
        <p type="p">7d:框部分</p>
        <p type="p">7e:分隔部分</p>
        <p type="p">7f:第2開口</p>
        <p type="p">8:光學構件</p>
        <p type="p">8b:上表面</p>
        <p type="p">9:通氣部</p>
        <p type="p">31:第1壁部</p>
        <p type="p">32:第2壁部</p>
        <p type="p">32a:頂面</p>
        <p type="p">33:外側部分</p>
        <p type="p">33a:頂面</p>
        <p type="p">41:光檢測區域</p>
        <p type="p">61c:開口</p>
        <p type="p">IX-IX,V-V,VI-VI,VII-VII,VIII-VIII:線</p>
        <p type="p">L:光</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="856px" img-content="tif" inline="yes" orientation="portrait" width="741px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622023</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126718</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C13/20</main-classification>
        <further-classification edition="200601120260302B">C07H15/18</further-classification>
        <further-classification edition="200601120260302B">A61K31/203</further-classification>
        <further-classification edition="200601120260302B">A61K31/7028</further-classification>
        <further-classification edition="201701120260302B">A61K47/54</further-classification>
        <further-classification edition="200601120260302B">A61P31/14</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>至善生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASTERY BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林伯霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏畿府</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, CHI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/671,449</doc-number>
          <date>20240715</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>視磺酸綴合化合物及其用途</chinese-title>
        <english-title>RETINOIC ACID CONJUGATE COMPOUNDS AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供包含視黃酸與經共價連接的三醣所形成的綴合化合物的組成物。本揭露亦提供用於預防或治療癌症或病毒感染的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are compositions including conjugate compounds of a retinoic acid and a covalently linked trisaccharide. Also provided are methods for prevention or treatment of cancer or viral infections.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623384</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126738</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260225B">H10D30/01</main-classification>
        <further-classification edition="202501120260225B">H10D30/67</further-classification>
        <further-classification edition="202501120260225B">H10D64/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　世海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEONG, SAI HOOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥倫布　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLOMBEAU, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴斯克　維拉拉格萬Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASKER, VEERARAGHAVAN S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普蘭薩西哈蘭　巴拉薩拉瑪年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/799,152</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有蝕刻終止層的電晶體直接背側觸點</chinese-title>
        <english-title>TRANSISTOR DIRECT BACKSIDE CONTACT WITH ETCH STOP LAYER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了半導體元件及其製造方法。提供矽晶圓並在矽晶圓上形成蝕刻終止雙層。在起始晶圓中插入蝕刻終止雙層將用作晶圓前側深溝槽形成的蝕刻終止以及晶圓背側平坦化的蝕刻終止。利用這種方法，GAA裝置中的犧牲材料深度和基板厚度的變化可以在微影疊加控制中提供益處。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and methods of manufacturing the same are described. A silicon wafer is provided and an etch stop bilayer is formed on the silicon wafer. The insertion of an etch stop bilayer in the starting wafer will serve as an etch stop for deep trench formation on the wafer frontside and for wafer backside planarization. With this approach variations in the sacrificial material depth in a GAA device and substrate thickness may offer benefits in lithography overlay control.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:裝置</p>
        <p type="p">224:替換金屬閘極</p>
        <p type="p">225:源極/汲極</p>
        <p type="p">228:氮化物襯墊</p>
        <p type="p">230:介電質</p>
        <p type="p">232:矽化物層</p>
        <p type="p">234:金屬填充物</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="468px" img-content="tif" inline="yes" orientation="portrait" width="548px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623355</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126770</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260224B">H10B12/00</main-classification>
        <further-classification edition="202501120260224B">H10D30/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美光科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付　啟濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, QITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　達斯汀　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, DUSTIN H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛瑞璟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, RUIJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　大衛　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, DAVID K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,172</doc-number>
          <date>20240722</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/231,966</doc-number>
          <date>20250609</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶電路及用於形成記憶電路之方法</chinese-title>
        <english-title>MEMORY CIRCUITRY AND METHODS USED IN FORMING MEMORY CIRCUITRY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之一種記憶電路包括垂直交錯配置之絕緣階層及記憶體胞元階層。該等記憶體胞元階層中之記憶體胞元個別地包括具有一閘極之一水平電晶體、一電容器側及一數位線側。電容器係在該電容器側上與該水平電晶體電耦合。一數位線係在該數位線側上與該水平電晶體電耦合。該等絕緣階層包括一絕緣材料，該絕緣材料係垂直位於該等記憶體胞元階層之垂直緊鄰者之間。該絕緣材料橫向延伸超過該等記憶體胞元之垂直緊鄰者之該等閘極之該數位線側及該電容器側。該絕緣材料在該等閘極之該數位線側之橫向外側與在該等閘極之該電容器側處相比垂直最薄。本發明亦揭示一種方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Memory circuitry comprises vertically-alternating insulative tiers and memory-cell tiers. Memory cells in the memory cell tiers individually comprise a horizontal transistor having a gate, a capacitor side, and a digitline side. The capacitor is electrically coupled with the horizontal transistor on the capacitor side. A digitline is electrically coupled with the horizontal transistor on the digitline side. The insulative tiers comprise an insulative material that is vertically between immediately-vertically-adjacent of the memory-cell tiers. The insulative material extends laterally beyond the digitline side and the capacitor side of the gates of immediately-vertically-adjacent of the memory cells. The insulative material is vertically thinnest laterally outward of the digitline side of the gates than at the capacitor side of the gates. Methods are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:基板構造/記憶電路</p>
        <p type="p">10:記憶體陣列區域</p>
        <p type="p">11:基底基板</p>
        <p type="p">12:半導體基板</p>
        <p type="p">13:頂部閘極階層</p>
        <p type="p">14:單晶矽/半導體材料/矽材料/通道區</p>
        <p type="p">15:底部閘極階層</p>
        <p type="p">20:絕緣階層</p>
        <p type="p">21:腔</p>
        <p type="p">22:記憶體胞元階層</p>
        <p type="p">23:第一源極/汲極區</p>
        <p type="p">24:絕緣材料</p>
        <p type="p">26:第二源極/汲極區</p>
        <p type="p">28:通道區</p>
        <p type="p">30b:底部閘極</p>
        <p type="p">30t:頂部閘極</p>
        <p type="p">32:閘極絕緣體</p>
        <p type="p">33:第一電容器電極</p>
        <p type="p">34:第二電容器電極</p>
        <p type="p">36:電容器絕緣體</p>
        <p type="p">40:絕緣體材料</p>
        <p type="p">62:絕緣體材料</p>
        <p type="p">70:導電金屬材料</p>
        <p type="p">71:導電摻雜多晶矽</p>
        <p type="p">74:水平伸長溝槽</p>
        <p type="p">80:電容器側</p>
        <p type="p">81:部分</p>
        <p type="p">82:導電材料</p>
        <p type="p">90:數位線側</p>
        <p type="p">95:位置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.JPG" file="ed10027.JPG" height="643px" img-content="tif" inline="yes" orientation="portrait" width="722px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621676</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126775</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/12</main-classification>
        <further-classification edition="200601120260302B">A61K31/352</further-classification>
        <further-classification edition="200601120260302B">A61P1/00</further-classification>
        <further-classification edition="201601120260302B">A23L33/10</further-classification>
        <further-classification edition="201601120260302B">A23K20/111</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商帝斯曼知識產權資產管理有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DSM IP ASSETS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格爾吉奇　迪諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRGIC, DINO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬爾科　多麗絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARKO, DORIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾瓦克　芭芭拉　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVAK, BARBARA KATHARINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦爾加　伊莉莎白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VARGA, ELISABETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24193595.6</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於減低新月毒素之不良作用的設施及方法</chinese-title>
        <english-title>MEANS AND METHODS FOR REDUCING ADVERSE EFFECT OF TRICHOTHECENE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種組成物、用於減低新月毒素之不良作用的方法、化合物之用途及供使用於治療、改善及/或預防與新月毒素相關聯之一或多種症狀的化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a composition, a method for reducing adverse effects of a trichothecene, use of a compound, and a compound for use in treatment, amelioration and/or prevention of symptom(s) associated with a trichothecene.</p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622029</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126794</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C31/20</main-classification>
        <further-classification edition="200601120260302B">A61K8/34</further-classification>
        <further-classification edition="200601120260302B">A61K8/49</further-classification>
        <further-classification edition="200601120260302B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大賽璐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAICEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶川泰照</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJIKAWA, YASUTERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅原碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEHARA, MIDORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>景行瞳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGEYUKI, HITOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-114228</doc-number>
          <date>20240717</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>1,3-丁二醇製品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種即便於摻合於化妝料組成物中之情形時，亦不易產生爛蘋果味及刺激性氣味之1,3-丁二醇製品。  &lt;br/&gt;一種1,3-丁二醇製品，其下述式所表示之面積率為10以上280以下。  &lt;br/&gt;面積率＝峰X面積/1,3BG峰面積×10&lt;sup&gt;6&lt;/sup&gt;，  &lt;br/&gt;峰X面積：於特定條件之氣相層析分析中，於將作為內部標準物質之二乙二醇二甲醚之峰之相對滯留時間設為1.0時，於相對滯留時間為0.59～0.65之範圍內出現之峰X於SIM模式m/z101離子層析圖中之面積，  &lt;br/&gt;1,3BG峰面積：於特定條件之氣相層析分析中，於將作為內部標準物質之二乙二醇二甲醚之峰之相對滯留時間設為1.0時，於相對滯留時間為0.72～0.88之範圍內出現之1,3-丁二醇之峰於Scan模式m/z72離子層析圖中之面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:脫水塔</p>
        <p type="p">B:脫鹽塔</p>
        <p type="p">C:脫高沸點物蒸餾塔</p>
        <p type="p">D:鹼反應器</p>
        <p type="p">E:脫鹼塔</p>
        <p type="p">F:製品蒸餾塔</p>
        <p type="p">A-1,B-1,C-1,E-1,F-1:冷凝器</p>
        <p type="p">A-2,C-2,F-2:再沸器</p>
        <p type="p">X-1:粗1,3-丁二醇</p>
        <p type="p">X-2:水(排出水)</p>
        <p type="p">X-3:鹽、高沸點物、及1,3-丁二醇之一部分</p>
        <p type="p">X-4:高沸點物及1,3-丁二醇之一部分</p>
        <p type="p">X-5:苛性鈉、高沸點物、及1,3-丁二醇之一部分</p>
        <p type="p">X-6:低沸點物及1,3-丁二醇之一部分</p>
        <p type="p">Y:1,3-丁二醇製品</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="749px" img-content="tif" inline="yes" orientation="portrait" width="983px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <isuno>11</isuno>
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          <doc-number>202622030</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126795</doc-number>
          <kind></kind>
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        </document-id>
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        <main-classification edition="200601120260302B">C07C31/20</main-classification>
        <further-classification edition="200601120260302B">A61K8/34</further-classification>
        <further-classification edition="200601120260302B">A61Q19/00</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大賽璐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAICEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶川泰照</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJIKAWA, YASUTERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅原碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEHARA, MIDORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>景行瞳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGEYUKI, HITOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-114226</doc-number>
          <date>20240717</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>1,3-丁二醇製品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即便於摻合於化妝料組成物中之情形時，亦不易產生爛蘋果味及刺激性氣味之1,3-丁二醇製品。  &lt;br/&gt;一種1,3-丁二醇製品，其下述式所表示之面積率為20以上260以下。  &lt;br/&gt;面積率＝峰X面積/1,3BG峰面積×10&lt;sup&gt;6&lt;/sup&gt;，  &lt;br/&gt;峰X面積：於特定條件之氣相層析分析中，於將作為內部標準物質之二乙二醇二甲醚之峰之相對滯留時間設為1.0時，於相對滯留時間為6.6～6.7之範圍內出現之峰X於Scan模式m/z145離子層析圖中之面積，  &lt;br/&gt;1,3BG峰面積：於特定條件之氣相層析分析中，於將作為內部標準物質之二乙二醇二甲醚之峰之相對滯留時間設為1.0時，於相對滯留時間為5.23～6.27之範圍內出現之1,3-丁二醇之峰於Scan模式m/z72離子層析圖中之面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:脫水塔</p>
        <p type="p">B:脫鹽塔</p>
        <p type="p">C:脫高沸點物蒸餾塔</p>
        <p type="p">D:鹼反應器</p>
        <p type="p">E:脫鹼塔</p>
        <p type="p">F:製品蒸餾塔</p>
        <p type="p">A-1,B-1,C-1,E-1,F-1:冷凝器</p>
        <p type="p">A-2,C-2,F-2:再沸器</p>
        <p type="p">X-1:粗1,3-丁二醇</p>
        <p type="p">X-2:水(排出水)</p>
        <p type="p">X-3:鹽、高沸點物、及1,3-丁二醇之一部分</p>
        <p type="p">X-4:高沸點物及1,3-丁二醇之一部分</p>
        <p type="p">X-5:苛性鈉、高沸點物、及1,3-丁二醇之一部分</p>
        <p type="p">X-6:低沸點物及1,3-丁二醇之一部分</p>
        <p type="p">Y:1,3-丁二醇製品</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="727px" img-content="tif" inline="yes" orientation="portrait" width="999px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622031</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126796</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C31/20</main-classification>
        <further-classification edition="200601120260302B">A61K8/34</further-classification>
        <further-classification edition="200601120260302B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大賽璐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAICEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶川泰照</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJIKAWA, YASUTERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅原碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEHARA, MIDORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>景行瞳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGEYUKI, HITOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-114227</doc-number>
          <date>20240717</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>1,3-丁二醇製品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即便於摻合於化妝料組成物中之情形時，亦不易產生爛蘋果味及刺激性氣味之1,3-丁二醇製品。  &lt;br/&gt;一種1,3-丁二醇製品，其下述式所表示之面積率為54以上130以下。  &lt;br/&gt;面積率＝峰X面積/自總峰面積減去二乙二醇二甲醚之峰面積後之面積×10&lt;sup&gt;6&lt;/sup&gt;，  &lt;br/&gt;峰X面積：於特定條件之氣相層析分析中，於將作為內部標準物質之二乙二醇二甲醚之峰之相對滯留時間設為1.0時，於相對滯留時間為6.2～6.32之範圍內具有峰頂之峰之面積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:脫水塔</p>
        <p type="p">B:脫鹽塔</p>
        <p type="p">C:脫高沸點物蒸餾塔</p>
        <p type="p">D:鹼反應器</p>
        <p type="p">E:脫鹼塔</p>
        <p type="p">F:製品蒸餾塔</p>
        <p type="p">A-1,B-1,C-1,E-1,F-1:冷凝器</p>
        <p type="p">A-2,C-2,F-2:再沸器</p>
        <p type="p">X-1:粗1,3-丁二醇</p>
        <p type="p">X-2:水(排出水)</p>
        <p type="p">X-3:鹽、高沸點物、及1,3-丁二醇之一部分</p>
        <p type="p">X-4:高沸點物及1,3-丁二醇之一部分</p>
        <p type="p">X-5:苛性鈉、高沸點物、及1,3-丁二醇之一部分</p>
        <p type="p">X-6:低沸點物及1,3-丁二醇之一部分</p>
        <p type="p">Y:1,3-丁二醇製品</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="737px" img-content="tif" inline="yes" orientation="portrait" width="997px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621886</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126816</doc-number>
          <kind></kind>
          <date>114/07/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B29C41/14</main-classification>
        <further-classification edition="200601120260224B">B29D23/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有馬俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARIMA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羽鳥優平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATORI, YUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-132078</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>移動體、移動體的控制方法及移動體的控制程式</chinese-title>
        <english-title>MOBILE OBJECT, CONTROL METHOD FOR MOBILE OBJECT, AND CONTROL PROGRAM FOR MOBILE OBJECT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的移動體100係具備：移動體本體1、及使移動體本體1執行自主移動的控制裝置6。控制裝置6係執行路徑探索及姿勢探索，路徑探索係不考慮移動體本體1的姿勢而探索移動體本體1的路徑，姿勢探索係將於經由路徑探索所產生之路徑的各位置處的移動體本體1的姿勢，根據各位置之周圍的環境資訊進行設定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The mobile object 100 of the present invention includes a mobile object main body 1, and a control device 6 for making the mobile object main body 1 to execute autonomous movement. The control device 6 executes a route search that searches for a route for the mobile object main body 1 without considering the attitude of the mobile object main body 1, and an attitude search that sets the attitude of the mobile object main body 1 at each position on the route generated by the route search based on environmental information surrounding each position.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.JPG" file="ed10027.JPG" height="655px" img-content="tif" inline="yes" orientation="portrait" width="566px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622000</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126830</doc-number>
          <kind></kind>
          <date>114/07/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260223B">C02F1/28</main-classification>
        <further-classification edition="202301120260223B">C02F1/42</further-classification>
        <further-classification edition="202301120260223B">C02F9/00</further-classification>
        <further-classification edition="202301120260223B">C02F1/32</further-classification>
        <further-classification edition="201701120260223B">B01J47/00</further-classification>
        <further-classification edition="201701120260223B">B01J49/00</further-classification>
        <further-classification edition="200601120260223B">B01D61/02</further-classification>
        <further-classification edition="200601120260223B">B01D61/14</further-classification>
        <further-classification edition="200601320260223B">C02F103/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塩谷惟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIOYA, YUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村勇規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>油井啓徳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUI, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋一重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, KAZUSHIGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須藤史生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUDO, FUMIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-114993</doc-number>
          <date>20240718</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>純水製造方法、純水製造裝置及超純水供給系統</chinese-title>
        <english-title>PURE WATER PRODUCTION METHOD, PURE WATER PRODUCTION DEVICE, AND ULTRAPURE WATER SUPPLYING SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於純水製造方法、純水製造裝置及超純水供給系統。本發明之純水製造方法，將被處理水以活性碳裝置5予以活性碳處理，將經活性碳處理的活性碳處理水藉由脫鹽裝置予以脫鹽處理而製造純水。活性碳裝置5，使充填有活性碳之複數活性碳塔5&lt;sub&gt;1&lt;/sub&gt;～5&lt;sub&gt;n&lt;/sub&gt;並聯配置；脫鹽裝置，至少使複數脫鹽機器並聯配置。該純水製造方法，具有如下步驟：採水步驟，使該被處理水通水至複數活性碳塔5&lt;sub&gt;1&lt;/sub&gt;～5&lt;sub&gt;n&lt;/sub&gt;中的全部；以及再生步驟，將複數活性碳塔5&lt;sub&gt;1&lt;/sub&gt;～5&lt;sub&gt;n&lt;/sub&gt;中的至少一塔之通水停止，或使複數脫鹽機器中的至少一部分再生；再生步驟中之活性碳塔的通水空間速度為10/h以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A pure water production method in which water to be treated undergoes an activated carbon treatment at an activated carbon device 5, and the activated carbon treated water that has been activated carbon treated, is subjected to a desalination treatment by a desalination device to produce pure water. Within the activated carbon device 5, a plurality of activated carbon towers 5&lt;sub&gt;1&lt;/sub&gt;~5&lt;sub&gt;n&lt;/sub&gt; filled with activated carbon are placed in parallel. Within the desalination device, at least a plurality of desalination machines are placed in parallel. The pure water production method comprises a water sampling operation, in which the water to be treated is passed through all of the plurality of activated carbon towers 5&lt;sub&gt;1&lt;/sub&gt;~5&lt;sub&gt;n&lt;/sub&gt;,&lt;sub/&gt;and a refreshing operation, in which either the passing of water in at least one of the towers within the plurality of activated carbon towers 5&lt;sub&gt;1&lt;/sub&gt;~5&lt;sub&gt;n&lt;/sub&gt; is stopped, or at least a portion of the plurality of desalination machines is refreshed. During the refreshing operation, the water passing space velocity of the activated carbon towers is less than 10/h.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:純水製造裝置</p>
        <p type="p">2:原水槽</p>
        <p type="p">3:過濾裝置</p>
        <p type="p">4:過濾水槽</p>
        <p type="p">5:活性碳裝置</p>
        <p type="p">5&lt;sub&gt;1&lt;/sub&gt;~5&lt;sub&gt;n&lt;/sub&gt;:活性碳塔</p>
        <p type="p">6:2B3T裝置(2床3塔式純水裝置、脫鹽裝置)</p>
        <p type="p">10&lt;sub&gt;1&lt;/sub&gt;~10&lt;sub&gt;m&lt;/sub&gt;:K塔(陽離子交換樹脂塔)</p>
        <p type="p">11&lt;sub&gt;1&lt;/sub&gt;~11&lt;sub&gt;m&lt;/sub&gt;:D塔(脫碳酸塔)</p>
        <p type="p">12&lt;sub&gt;1&lt;/sub&gt;~12&lt;sub&gt;m&lt;/sub&gt;:A塔(陰離子交換樹脂塔)</p>
        <p type="p">13:後段設備</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.png" file="d10016.TIF" giffile="ed10016.png" height="460px" img-content="tif" inline="yes" orientation="portrait" width="911px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623348</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126854</doc-number>
          <kind></kind>
          <date>114/07/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260121B">H10B10/00</main-classification>
        <further-classification edition="202501120260121B">H10D89/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林士豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王屏薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, PING-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳於貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-BEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,368</doc-number>
          <date>20241126</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/215,911</doc-number>
          <date>20250522</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶單元、記憶陣列及製造半導體裝置的方法</chinese-title>
        <english-title>MEMORY CELL, MEMORY ARRAY AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶單元，包括一主動區，沿著一第一方向縱向延伸；與第一、第二閘極結構，沿著與第一方向不同之一第二方向縱向延伸。第一閘極結構與主動區接合，形成一第一電晶體，第二閘極結構與主動區接合，形成一第二電晶體。記憶單元更包括一第一磊晶特徵，設置在第一電晶體之一源極區；一第二磊晶特徵，設置在第一電晶體與第二電晶體之一共汲極區；一背側接點，設置在第一磊晶特徵下，並與之電性耦接；一背側信號線設置在背側接點下，並與之電性耦接；與一第一前側接點，設置在第二磊晶特徵之上，並與之電性耦接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory cell includes an active region extending lengthwise along a first direction and first and second gate structures extending lengthwise along a second direction different from the first direction. The first gate structure engages the active region in forming a first transistor, and the second gate structure engages the active region in forming a second transistor. The memory cell further includes a first epitaxial feature disposed on a source region of the first transistor, a second epitaxial feature disposed on a common drain region of the first and second transistors, a backside contact disposed under and in electrical coupling with the first epitaxial feature, a backside signal line disposed under and in electrical coupling with the backside contact, and a first frontside contact disposed above and in electrical coupling with the second epitaxial feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:SRAM單元</p>
        <p type="p">BL、BLB:位元線</p>
        <p type="p">WL:字元線</p>
        <p type="p">PG-1、PG-2、PU-1、PU-2、PD-1、PD-2:電晶體</p>
        <p type="p">INV1、INV2:反向器</p>
        <p type="p">VDD:電源電壓</p>
        <p type="p">VSS:接地電壓</p>
        <p type="p">CD1、CD2:共汲極</p>
        <p type="p">SN、SNB:儲存節點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10036.png" file="d10036.TIF" giffile="ed10036.png" height="678px" img-content="tif" inline="yes" orientation="portrait" width="776px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623551</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126871</doc-number>
          <kind></kind>
          <date>114/07/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P70/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/60</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中井仁司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAI, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-122046</doc-number>
          <date>20240729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之基板處理裝置具備腔室、基板保持部及移動機構。腔室收納基板。基板保持部配置於腔室內，逐片保持基板。移動機構使基板保持部移動。基板保持部具有與基板接觸之夾盤銷。移動機構於腔室內，使基板保持部於藉由處理液處理基板之至少1個處理位置與洗淨夾盤銷之洗淨位置之間移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing apparatus includes a chamber, a substrate holding portion, and a moving mechanism. The chamber accommodates a substrate. The substrate holding portion is disposed in the chamber and holds the substrate one by one. The moving mechanism moves the substrate holding portion. The substrate holding portion includes a chuck pin that comes into contact with the substrate. The moving mechanism moves the substrate holding portion within the chamber between at least one processing position at which the substrate is processed with a processing liquid and a cleaning position at which the chuck pin is cleaned.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板處理單元</p>
        <p type="p">11:腔室</p>
        <p type="p">11a:側壁</p>
        <p type="p">12:開口</p>
        <p type="p">13:擋板</p>
        <p type="p">100:基板處理裝置</p>
        <p type="p">101:控制裝置</p>
        <p type="p">102:控制部</p>
        <p type="p">104:記憶部</p>
        <p type="p">111:通路</p>
        <p type="p">150:交接台</p>
        <p type="p">150a:板</p>
        <p type="p">150b:凸部</p>
        <p type="p">200:基板保持部</p>
        <p type="p">200a:基端部</p>
        <p type="p">200b:末端部</p>
        <p type="p">400:浸漬槽</p>
        <p type="p">600:洗淨槽</p>
        <p type="p">C200:圓</p>
        <p type="p">CR:中心機器人</p>
        <p type="p">CW:洗淨位置</p>
        <p type="p">IR:傳載機器人</p>
        <p type="p">L200:迴旋軸線</p>
        <p type="p">LP:裝載埠</p>
        <p type="p">Q:處理位置</p>
        <p type="p">Q1:處理位置</p>
        <p type="p">Q2:處理位置</p>
        <p type="p">Q3:處理位置</p>
        <p type="p">R:交接位置</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.JPG" file="ed10025.JPG" height="753px" img-content="tif" inline="yes" orientation="portrait" width="921px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622642</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126873</doc-number>
          <kind></kind>
          <date>114/07/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G03F7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭星月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, XINGYUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布奧納科西　布蘭登　羅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUONACORSI, BRANDON ROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,287</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>最佳化圖案化器件佈局及控制於一微影製程中使用之琢面鏡之離散光瞳輪廓</chinese-title>
        <english-title>OPTIMIZING A PATTERNING DEVICE LAYOUT AND A DISCRETIZED PUPIL PROFILE TO CONTROL FACET MIRRORS USED IN A LITHOGRAPHIC PROCESS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之一種用於最佳化用於一微影設備中之一照明光束的電腦實施方法包括初始化包括一可調整元素陣列之一離散照明映射圖(map)。該微影設備包括一琢面化鏡器件，該琢面化鏡器件包含安置於該微影設備之一光瞳平面處之琢面鏡。各個可調整元素係基於來自該琢面化鏡器件之一琢面鏡之照明強度來計算。藉由使用連續可變元素來計算來自該等琢面鏡之照明強度。該電腦實施方法亦包括藉由基於使用一圖案化器件之一微影製程之結果的反覆運算來對該等連續可變元素進行反覆調整，從而調整該等可調整元素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computer-implemented method for optimizing a beam of illumination used in a lithographic apparatus includes initializing a discretized illumination map including an array of adjustable elements. The lithographic apparatus includes a facetted mirror device comprising facet mirrors disposed at a pupil plane of the lithographic apparatus. Each adjustable element is calculated based on illumination intensity from a facet mirror of the faceted mirror device. Illumination intensities from the facet mirrors are calculated by using continuously variable elements. The computer-implemented method also includes adjusting the adjustable elements by iterative adjustments of the continuously variable elements based on iterative computation of outcomes of a lithographic process using a patterning device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:離散照明圖</p>
        <p type="p">502:插圖</p>
        <p type="p">504:遮罩</p>
        <p type="p">506:輻射光束</p>
        <p type="p">508:圖案</p>
        <p type="p">p&lt;sub&gt;j1,slp1&lt;/sub&gt;:可調整元素</p>
        <p type="p">p&lt;sub&gt;j2,slp2&lt;/sub&gt;:可調整元素</p>
        <p type="p">p&lt;sub&gt;j3,slp3&lt;/sub&gt;:可調整元素</p>
        <p type="p">slp:位置</p>
        <p type="p">slp&lt;sub&gt;mid&lt;/sub&gt;:隙縫位置/隙縫中心</p>
        <p type="p">slp&lt;sub&gt;max&lt;/sub&gt;:隙縫位置</p>
        <p type="p">slp&lt;sub&gt;min&lt;/sub&gt;:隙縫位置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10029.JPG" file="ed10029.JPG" height="706px" img-content="tif" inline="yes" orientation="portrait" width="1013px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622097</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126886</doc-number>
          <kind></kind>
          <date>114/07/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F11/00</main-classification>
        <further-classification edition="200601120260302B">C07F7/18</further-classification>
        <further-classification edition="200601120260302B">C07C381/12</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京應化工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO OHKA KOGYO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲荷宇俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INARI, TAKATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西澤彰人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIZAWA, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-114328</doc-number>
          <date>20240717</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-072372</doc-number>
          <date>20250424</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>經修飾缺損部位之雜多酸鹽或其混合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種經修飾缺損部位之新穎的雜多酸鹽，其為通式(I)表示之經修飾缺損部位之雜多酸鹽，於雜多酸鹽之陰離子部導入了複數個具有酸解離性基之極性基。  &lt;br/&gt;&lt;img align="absmiddle" height="53px" width="274px" file="ed10108.JPG" alt="ed10108.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621712</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126901</doc-number>
          <kind></kind>
          <date>114/07/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120260302B">A61K35/12</main-classification>
        <further-classification edition="200601120260302B">A61P9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大賽璐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAICEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人北海道大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内村誠一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIMURA, SEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中修志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATSUKA, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川堀真人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWABORI, MASAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-114257</doc-number>
          <date>20240717</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>經血管內投予用醫藥組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明之目的在於提供一種對中樞神經疾病治療之治療效果優異之醫藥組成物。  &lt;br/&gt;[解決手段]本發明係一種經血管內投予用醫藥組成物，其包含細胞外囊泡（Extracellular vesicle）純化物，用於治療中樞神經疾病，且上述細胞外囊泡純化物係藉由包括如下步驟之細胞外囊泡純化物之製造方法而獲得：（i）純化步驟，使包含細胞外囊泡及夾雜物之被處理液與篩析（exclusion）及陰離子交換載體接觸，獲得包含上述細胞外囊泡之處理液；及（ii）膜過濾步驟，將上述處理液供於膜過濾，獲得上述細胞外囊泡之濃縮液；上述細胞外囊泡純化物對中樞神經疾病治療之治療效果優異。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621759</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126947</doc-number>
          <kind></kind>
          <date>114/07/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">A61N5/10</main-classification>
        <further-classification edition="200601120260223B">A61K51/12</further-classification>
        <further-classification edition="200601120260223B">A61K9/107</further-classification>
        <further-classification edition="200601120260223B">A61K39/39</further-classification>
        <further-classification edition="202501120260223B">A01N1/168</further-classification>
        <further-classification edition="200601120260223B">G21G4/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商阿爾法陶醫療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA TAU MEDICAL LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多門卡偉克　維爾得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOMANKEVICH, VERED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史奇米特　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱爾森　伊茲哈可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELSON, ITZHAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雅樂祺　李歐</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>ARAZI, LIOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席格　羅南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEGAL, RONEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋特　阿姆農</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAT, AMNON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂維　多爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEVY, DOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/671,825</doc-number>
          <date>20240716</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>載有阿爾發發射體放射性核種之溶液</chinese-title>
        <english-title>SOLUTION LOADED WITH ALPHA-EMITTER RADIONUCLIDES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種產生用於治療患者之乳液之方法。該方法包括產生攜載藉由添加鈣離子而變成水凝膠之藥劑之水基溶液。將鐳放射性核種以足以用於放射療法之濃度添加至該水基溶液。在將該鐳添加至該水基溶液之後，混合該水基溶液與乳化劑及油。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of generating an emulsion for treating a patient. The method includes generating a water-based solution carrying an agent which turns into a hydrogel by addition of calcium ions. Radium radionuclides are added to the water-based solution in a concentration sufficient for radiotherapy. After adding the radium to the water-based solution, the water-based solution is mixed with an emulsifier and an oil.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
        <p type="p">108:步驟</p>
        <p type="p">110:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="441px" img-content="tif" inline="yes" orientation="portrait" width="594px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622052</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126969</doc-number>
          <kind></kind>
          <date>114/07/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/12</main-classification>
        <further-classification edition="200601120260302B">C07D471/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴　強納森　艾薩克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAY, JONATHAN ISAAC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/671,969</doc-number>
          <date>20240716</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>移除保護基團之方法</chinese-title>
        <english-title>METHODS FOR THE REMOVAL OF PROTECTING GROUPS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於自經保護有機氮化合物移除甲苯磺醯基保護基團之溫和且通用之方法，其另外適用於商業規模。本發明提供自經保護有機氮化合物移除甲苯磺醯基保護基團以形成包含氮雜雙環[3.1.0]己烷-6-甲醯胺衍生物之未經保護氮化合物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A mild and general method for tosyl protecting group removal from a protected organic nitrogen compound that is additionally suitable for use at commercial scale. A method for the removal of a tosyl protecting group from a protected organic nitrogen compound to form an unprotected nitrogen compound, including azabicyclo[3.1.0]hexane-6-carboxamide derivatives.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.JPG" file="ed10023.JPG" height="612px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622057</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126971</doc-number>
          <kind></kind>
          <date>114/07/16</date>
        </document-id>
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      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/14</main-classification>
        <further-classification edition="200601120260302B">A61K31/444</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雅盧米斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALUMIS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>百　考博特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BY, KOLBOT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱班森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, BENSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿隆佐　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALONZO, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃瑪姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MAGGIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/671,864</doc-number>
          <date>20240716</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>TYK2抑制劑之晶型及其用途</chinese-title>
        <english-title>CRYSTALLINE FORMS OF A TYK2 INHIBITOR AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明部分地關於&lt;i&gt;N&lt;/i&gt;-(4-((3-甲氧基-4-(1-(甲基-&lt;i&gt;d&lt;/i&gt;&lt;sub&gt;3&lt;/sub&gt;)-1&lt;i&gt;H&lt;/i&gt;-1,2,4-三唑-3-基)吡啶-2-基)胺基)-5-丙醯基吡啶-2-基)環丙烷甲醯胺游離鹼之晶型、其醫藥組合物及使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure is in part directed to crystalline forms of &lt;i&gt;N&lt;/i&gt;-(4-((3-methoxy-4-(1-(methyl-&lt;i&gt;d&lt;/i&gt;&lt;sub&gt;3&lt;/sub&gt;)-1&lt;i&gt;H&lt;/i&gt;-1,2,4-triazol-3-yl)pyridin-2-yl)amino)-5-propionylpyridin-2-yl)cyclopropane carboxamide, free base, pharmaceutical compositions thereof, and methods of use.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.JPG" file="ed10028.JPG" height="522px" img-content="tif" inline="yes" orientation="portrait" width="750px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623389</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114126989</doc-number>
          <kind></kind>
          <date>114/07/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260226B">H10D30/47</main-classification>
        <further-classification edition="202501120260226B">H10D62/13</further-classification>
        <further-classification edition="202501120260226B">H10D62/17</further-classification>
        <further-classification edition="202501120260226B">H10D62/85</further-classification>
        <further-classification edition="202501120260226B">H10D64/20</further-classification>
        <further-classification edition="202501120260226B">H10D64/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電源整合公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POWER INTEGRATIONS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　國昌　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, KUO-CHANG ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆魯克桑　卡爾蒂克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURUKESAN, KARTHICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫迪莫夫　阿列克謝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDYMOV, ALEXEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬治斯庫　索林　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEORGESCU, SORIN S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/672,383</doc-number>
          <date>20240717</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/US25/35884</doc-number>
          <date>20250630</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於實現穩健開關性能的高電子遷移率電晶體裝置結構</chinese-title>
        <english-title>A HIGH ELECTRON MOBILITY TRANSISTOR DEVICE STRUCTURE FOR ROBUST SWITCHING PERFORMANCE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於實現穩健開關性能的高電子遷移率電晶體（HEMT）裝置結構。一電子障蔽可藉由在P型與N型半導體層之間形成的一PN接面的一接觸電位來產生。該電子障蔽可有助於減少電子從二維電子氣體（2DEG）射出到二維電子氣體下方的層。作為另一選擇且另外地，可在源極層與汲極層周圍再生長一高摻雜的N型層。此再生長的高摻雜的N型層可有利於緩解由一退化的二維電子氣體所引起的空乏穿透。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A high electron mobility transistor (HEMT) device structure for robust switching performance is presented herein. An electron barrier may be created by a PN-junction contact potential formed between P-type and N-type semiconductor layers. The electron barrier may advantageously reduce electron ejection from the 2DEG into layers below the 2DEG. Alternatively, and additionally, a highly doped N-type layer may be regrown around the source and drain layers. The regrown highly doped N-type layer may advantageously mitigate depletion reach-through caused by a degraded 2DEG.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:緩衝層</p>
        <p type="p">104:P-GaN磊晶層</p>
        <p type="p">106:N-GaN磊晶層</p>
        <p type="p">108:氮化鋁鎵層</p>
        <p type="p">109:二維電子氣體</p>
        <p type="p">110:氮化矽層</p>
        <p type="p">113s:源極金屬化物</p>
        <p type="p">113d:汲極金屬化物</p>
        <p type="p">114:閘極金屬化物</p>
        <p type="p">115、116:閘極場板</p>
        <p type="p">123s、123d:小突起</p>
        <p type="p">200b:GaN高電子遷移率電晶體</p>
        <p type="p">212s:源極再生長層</p>
        <p type="p">212d:汲極再生長層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="705px" img-content="tif" inline="yes" orientation="portrait" width="678px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621965</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127005</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65G1/137</main-classification>
        <further-classification edition="200601120260302B">B65G67/02</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商村田機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURATA MACHINERY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大島宗訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSHIMA, MUNEKUNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-121250</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>搬送車系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之搬送車系統具備有：埠，其具有可取得容器之重量的重量取得部、及可取得容器之種類即容器類型的容器類型取得部；上位控制器，其產生將容器自埠朝向既定之搬送目的地進行搬送的意旨之搬送請求；及搬送車控制器，其根據搬送請求，選擇搬送車之任一者，並對所選擇之搬送車發送搬送指令。埠係當載置有容器時，將包含在重量取得部所取得的重量與在容器類型取得部所取得的容器類型的容器資訊，發送至上位控制器，上位控制器係根據所接收的容器資訊以產生搬送請求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:埠</p>
        <p type="p">50:搬送車控制器</p>
        <p type="p">100:上位控制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="705px" img-content="tif" inline="yes" orientation="portrait" width="898px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621901</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127012</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">B32B37/24</main-classification>
        <further-classification edition="200601120260223B">B32B7/12</further-classification>
        <further-classification edition="201801120260223B">C09J7/30</further-classification>
        <further-classification edition="200601120260223B">C09J175/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇都宮達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUNOMIYA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>半田至</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANDA, ITARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>品川雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINAGAWA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-131730</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>附黏著劑層之薄膜之捲繞體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種附黏著劑層之薄膜之捲繞體之製造方法，該附黏著劑層之薄膜之捲繞體無剝離襯材，且該製造方法可達成抑制氣泡捲入或皺褶產生與抑制凹痕，同時進行長條捲取。本發明提供一種附黏著劑層之薄膜之捲繞體，該附黏著劑層之薄膜之捲繞體無剝離襯材，且該附黏著劑層之薄膜之捲繞體已抑制住氣泡捲入或皺褶產生且還抑制住凹痕。&lt;br/&gt;  其係從長條附黏著劑層之薄膜製造捲繞體之方法；該附黏著劑層之薄膜依序具有脫模層、特定之基材及特定之黏著劑層；該附黏著劑層之薄膜係經過配置於捲取軸前方之接觸輥後捲取於捲取軸上而成為捲繞體；且，該接觸輥之接觸壓力P以線壓計為3.6N/cm＜P＜14.0N/cm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">101:附黏著劑層之薄膜</p>
        <p type="p">102:附黏著劑層之薄膜之捲繞體</p>
        <p type="p">200:接觸輥</p>
        <p type="p">300:捲取軸</p>
        <p type="p">400:位置調整部</p>
        <p type="p">11:輸送輥</p>
        <p type="p">12:輸送輥</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="400px" img-content="tif" inline="yes" orientation="portrait" width="567px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621581</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127041</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120260302B">A23L31/10</main-classification>
        <further-classification edition="202501120260302B">A23L11/60</further-classification>
        <further-classification edition="202501120260302B">A23L11/65</further-classification>
        <further-classification edition="202501120260302B">A23C11/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商朝日集團控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI GROUP HOLDINGS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乙志昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUSHI, NOBORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤祐樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>若林将夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAKABAYASHI, MASAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-113944</doc-number>
          <date>20240717</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>酵母素材之酵素處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種分散性優異之乳替代食品用酵母酵素處理物之製造方法、該處理物及包含該處理物之乳替代飲食品。  &lt;br/&gt;本發明提供一種乳替代飲食品用酵母酵素處理物之製造方法、該處理物及包含該處理物之乳替代飲食品，該乳替代飲食品用酵母酵素處理物之製造方法之特徵在於：包括(a)利用聚葡萄糖酶對酵母萃取物菌體殘渣進行處理；及(b)回收(a)中所獲得之處理物；且該聚葡萄糖酶為具有內切活性之聚葡萄糖酶、及具有外切活性之聚葡萄糖酶這至少2種。本發明之酵母酵素處理物較先前製品分散性優異，適合於調配在乳替代飲食品中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621962</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127058</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65G1/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本裕昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>名取祐介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATORI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIHARA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤朋也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-121175</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>處理系統、取出治具、及取出方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠簡單地取出設置在處理系統內的搬送單元之技術。  &lt;br/&gt;處理系統係包含：搬送模組，係具有沿搬送方向延伸的導軌、支撐導軌的搬送框架、及可沿導軌移動的搬送單元；以及多個處理模組，係連接於搬送模組，藉由搬送單元被搬送來搬送物。搬送框架係具有設置在沿著搬送方向比導軌的終端的位置長的位置的框架端。此外，處理系統係具備取出治具，該取出治具係具有較框架端更進入到搬送框架內且接近或接觸導軌的終端的搬出用軌道，能夠從導軌將搬送單元取出到搬出用軌道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">40:搬送模組</p>
        <p type="p">48:搬送單元</p>
        <p type="p">80:取出治具</p>
        <p type="p">81:軌道構件</p>
        <p type="p">811:固定板</p>
        <p type="p">82:台車</p>
        <p type="p">821:台本體</p>
        <p type="p">822:手推部</p>
        <p type="p">823:移動構件</p>
        <p type="p">823a:車輪</p>
        <p type="p">823b:高度位置調整部</p>
        <p type="p">824:支撐板</p>
        <p type="p">825:止擋件</p>
        <p type="p">84:搬出用軌道</p>
        <p type="p">841:中繼軌道</p>
        <p type="p">841a:一端</p>
        <p type="p">841b:另一端</p>
        <p type="p">842:台車側軌道</p>
        <p type="p">842a:一端</p>
        <p type="p">842b:另一端</p>
        <p type="p">85:固定具</p>
        <p type="p">411:基底板</p>
        <p type="p">411e:終端</p>
        <p type="p">412:搬送框架</p>
        <p type="p">412e:框架端</p>
        <p type="p">413:腳部</p>
        <p type="p">441:導軌</p>
        <p type="p">441e:終端</p>
        <p type="p">444:X軸可動體</p>
        <p type="p">445:滾動體</p>
        <p type="p">446:止擋件</p>
        <p type="p">D1、D2:間隔</p>
        <p type="p">P:突出量</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="978px" img-content="tif" inline="yes" orientation="portrait" width="746px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622058</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127059</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/14</main-classification>
        <further-classification edition="200601120260302B">A61K31/4709</further-classification>
        <further-classification edition="200601120260302B">A61P1/00</further-classification>
        <further-classification edition="200601120260302B">A61P11/00</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商亞哥邁伯西班牙有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGOMAB SPAIN S.L.U.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘賓卡索　貝剛納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAMPIN CASAL, BEGONA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽倫貝特藍　裘帝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CERON BERTRAN, JORDI CARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊米雷茲艾特羅　杰瑟斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMIREZ ARTERO, JESUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范布拉班特　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN BRABANDT, WILLEM AIME BEATRIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇卡諾維克　賈斯娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKANOVIC, JASNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RS</english-country>
              <english-address>RS</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特森　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATTERSON, ADAM ROSS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24382778.9</doc-number>
          <date>20240717</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>結晶形式</chinese-title>
        <english-title>CRYSTALLINE FORMS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">尤其提供一種物質，該物質為式(I)化合物之酸加成鹽：  &lt;br/&gt;&lt;img align="absmiddle" height="169px" width="208px" file="ed10044.JPG" alt="ed10044.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中該物質呈固體結晶形式。該物質為ALK5之抑制劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is provided &lt;i&gt;inter alia&lt;/i&gt; a substance which is an acid addition salt of a compound of formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="180px" width="214px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein the substance is in a solid crystalline form. The substance is an inhibitor of ALK5.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10047.JPG" file="ed10047.JPG" height="346px" img-content="tif" inline="yes" orientation="portrait" width="706px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622014</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127069</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C03C4/00</main-classification>
        <further-classification edition="200601120260224B">C03B17/06</further-classification>
        <further-classification edition="200601120260224B">C03B37/022</further-classification>
        <further-classification edition="200601120260224B">C03C3/076</further-classification>
        <further-classification edition="200601120260224B">C03C3/089</further-classification>
        <further-classification edition="200601120260224B">C03C3/091</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德奈卡　馬修約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEJNEKA, MATTHEW JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍伯森　里沙安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMBERSON, LISA ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/672,830</doc-number>
          <date>20240718</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於高UV透射之含鹼、可熔融成型玻璃</chinese-title>
        <english-title>ALKALI-CONTAINING, FUSION FORMABLE GLASSES FOR HIGH UV TRANSMISSION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種具有高UV透射率的含鹼、可熔融成型玻璃，其按氧化物計可包含：≥65.00莫耳%至≤72.50莫耳%的SiO&lt;sub&gt;2&lt;/sub&gt;；≥2.50莫耳%至≤13.75莫耳%的Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;；≥0.00莫耳%至≤18.00莫耳%的B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;；≥0.00莫耳%至≤6.00莫耳%的MgO；≥0.00莫耳%至≤15.00莫耳%的Na&lt;sub&gt;2&lt;/sub&gt;O；≥3.10莫耳%至≤7.50莫耳%的K&lt;sub&gt;2&lt;/sub&gt;O；各≤1.00莫耳%的Li&lt;sub&gt;2&lt;/sub&gt;O及ZnO；≤0.04莫耳%的SnO&lt;sub&gt;2&lt;/sub&gt;；各≤0.10莫耳%的TiO&lt;sub&gt;2&lt;/sub&gt;、Fe&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;及Ce&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;；以及≤2莫耳%的F&lt;sup&gt;-&lt;/sup&gt;。Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; + B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; - R&lt;sub&gt;2&lt;/sub&gt;O - CaO - SrO - BaO的總和≥-0.75莫耳%且≤40.00莫耳%，其中R&lt;sub&gt;2&lt;/sub&gt;O為Na&lt;sub&gt;2&lt;/sub&gt;O + K&lt;sub&gt;2&lt;/sub&gt;O + Li&lt;sub&gt;2&lt;/sub&gt;O的總和。Na&lt;sub&gt;2&lt;/sub&gt;O + K&lt;sub&gt;2&lt;/sub&gt;O的總和≥3.10莫耳%且≤15.50莫耳%。As&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; + Sb&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; + PbO的總和≤0.01莫耳%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An alkali-containing, fusion formable glass with high UV transmission may include on an oxide basis: ≥ 65.00 mol% to ≤ 72.50 mol% SiO&lt;sub&gt;2&lt;/sub&gt;; ≥ 2.50 mol% to ≤ 13.75 mol% Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;; ≥ 0.00 mol% to ≤ 18.00 mol% B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;; ≥ 0.00 mol% to ≤ 6.00 mol% MgO; ≥ 0.00 mol% to ≤ 15.00 mol% Na&lt;sub&gt;2&lt;/sub&gt;O; ≥ 3.10 mol% to ≤ 7.50 mol% K&lt;sub&gt;2&lt;/sub&gt;O; ≤ 1.00 mol% of each of Li&lt;sub&gt;2&lt;/sub&gt;O and ZnO; ≤ 0.04 mol% SnO&lt;sub&gt;2&lt;/sub&gt;; ≤ 0.10 mol% of each of TiO&lt;sub&gt;2&lt;/sub&gt;, Fe&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;, and Ce&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;; and ≤ 2 mol% F&lt;sup&gt;-&lt;/sup&gt;. A sum of Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; + B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; - R&lt;sub&gt;2&lt;/sub&gt;O - CaO - SrO - BaO is ≥ -0.75 mol% and ≤ 40.00 mol%, where R&lt;sub&gt;2&lt;/sub&gt;O is the sum of Na&lt;sub&gt;2&lt;/sub&gt;O + K&lt;sub&gt;2&lt;/sub&gt;O + Li&lt;sub&gt;2&lt;/sub&gt;O. A sum of Na&lt;sub&gt;2&lt;/sub&gt;O + K&lt;sub&gt;2&lt;/sub&gt;O is ≥ 3.10 mol% and ≤ 15.50 mol%. A sum of As&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; + Sb&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; + PbO is ≤ 0.01 mol%.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="467px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623166</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127090</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200701120251118B">H02M1/42</main-classification>
        <further-classification edition="200701120251118B">H02M1/44</further-classification>
        <further-classification edition="200601120251118B">H02M1/08</further-classification>
        <further-classification edition="200601120251118B">H02M7/217</further-classification>
        <further-classification edition="200601120251118B">H02M7/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡南洋理工大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYANG TECHNOLOGICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商光寶科技新加坡私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, ZHIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐燚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　翊勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, YI CHYN CASSANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,502</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/082,882</doc-number>
          <date>20250318</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>零電壓軟切換控制方法及應用其之功率控制電路</chinese-title>
        <english-title>ZERO-VOLTAGE SOFT SWITCHING CONTROL METHOD AND POWER CONTROL CIRCUIT USING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種零電壓軟切換控制方法及應用其之功率控制電路。零電壓軟切換控制方法包括以下步驟。執行一梯形電流控制，以將一電感電流形成數個梯形波形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A zero-voltage soft switching (ZVS soft switching) control method and a power control circuit using the same are provided. The ZVS soft switching control method includes the following steps. A trapezoidal current control is executed to shape an inductor current into a plurality of trapezoidal waveforms.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:功率控制電路</p>
        <p type="p">110:取樣與計算單元</p>
        <p type="p">120:鎖相迴路(PLL)單元</p>
        <p type="p">130:零電壓軟切換邊界條件單元</p>
        <p type="p">140:電壓閉環控制器</p>
        <p type="p">150:電容電壓平衡控制單元</p>
        <p type="p">160:平均電流控制單元</p>
        <p type="p">170:梯形電流控制單元</p>
        <p type="p">180:梯形電流調變單元</p>
        <p type="p">190:多階轉換電路</p>
        <p type="p">191:濾波電路</p>
        <p type="p">Cf:電容</p>
        <p type="p">D1,D2,Dn,Da,Db:佔空比</p>
        <p type="p">fsw:切換頻率</p>
        <p type="p">iL:電感電流</p>
        <p type="p">ILavg:平均電流值</p>
        <p type="p">L1,L2:電感</p>
        <p type="p">IZVS:反向電流值</p>
        <p type="p">PWM1,PWM2,PWMn:脈衝寬度調變(PWM)控制信號</p>
        <p type="p">TWF:梯形波形</p>
        <p type="p">Vac,Vcf:交流側(AC)電壓</p>
        <p type="p">Vdc:直流側(DC)電壓</p>
        <p type="p">Vox:輸出電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="785px" img-content="tif" inline="yes" orientation="portrait" width="1072px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622112</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127107</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">C07K16/24</further-classification>
        <further-classification edition="200601120260302B">C07K16/46</further-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P17/00</further-classification>
        <further-classification edition="200601120260302B">A61P11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商班布薩治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAMBUSA THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YUANHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, SHIHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAI, TIANHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUN, ANDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, SHANSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, THANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JINGJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024109715840</doc-number>
          <date>20240719</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/674,223</doc-number>
          <date>20240722</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025109222513</doc-number>
          <date>20250703</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多特異性結合劑及其用途</chinese-title>
        <english-title>MULTISPECIFIC BINDING AGENTS AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於多特異性結合劑及其用途，具體而言結合至介白素-4受體α (IL-4Rα)及介白素31 (IL-31)之多特異性結合劑。本申請案進一步提供了包含本文所提供之該等多特異性結合劑之組合物(例如，醫藥組合物)及其用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to multispecific binding agents and uses thereof, specifically multispecific binding agents that bind to both interleukin-4 receptor alpha (IL-4Rα) and interleukin 31 (IL-31). The present application further provides compositions (e.g., pharmaceutical compositions) comprising the multispecific binding agents provided herein and uses thereof.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10046.JPG" file="ed10046.JPG" height="407px" img-content="tif" inline="yes" orientation="portrait" width="636px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621729</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127108</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/39</main-classification>
        <further-classification edition="200601120260302B">A61K31/505</further-classification>
        <further-classification edition="202501120260302B">A61K9/127</further-classification>
        <further-classification edition="200601120260302B">A61K9/19</further-classification>
        <further-classification edition="200601120260302B">A61K47/02</further-classification>
        <further-classification edition="200601120260302B">A61K47/18</further-classification>
        <further-classification edition="200601120260302B">A61K47/22</further-classification>
        <further-classification edition="200601120260302B">A61K47/24</further-classification>
        <further-classification edition="200601120260302B">A61K47/26</further-classification>
        <further-classification edition="200601120260302B">A61P37/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO PHARMA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河村恵理子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAMURA, ERIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-116078</doc-number>
          <date>20240719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含有疫苗佐劑之脂質體製劑</chinese-title>
        <english-title>LIPOSOMAL FORMULATION COMPRISING VACCINE ADJUVANT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種可用作疫苗佐劑之化合物之保存穩定性優異之脂質體製劑、以及該脂質體製劑之冷凍乾燥製劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a liposome formulation comprising a compound useful as a vaccine adjuvant, which has excellent storage stability, and also a lyophilized preparation of the liposome formulation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622184</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127116</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08L83/12</main-classification>
        <further-classification edition="200601120260225B">C08G77/14</further-classification>
        <further-classification edition="200601120260225B">C08G65/336</further-classification>
        <further-classification edition="200601120260225B">C08K5/053</further-classification>
        <further-classification edition="200601120260225B">C07C29/74</further-classification>
        <further-classification edition="200601320260225B">C08G101/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲岱爾　歐加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIEDEL, OLGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法輪斯　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERENZ, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24189946.7</doc-number>
          <date>20240722</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>純化的聚醚矽氧烷Ⅱ</chinese-title>
        <english-title>PURIFIED POLYETHER SILOXANES II</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種聚醚矽氧烷，其包含至少一個矽氧烷嵌段和至少一個聚醚嵌段，其特徵在於聚醚矽氧烷包含不大於0.5重量%+/-10%的至少一種N2至N6短直鏈矽氧烷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a polyether siloxane comprising at least one siloxane block and at least one polyether block, characterized in that the polyether siloxane comprises not more than 0.5 wt.-% +/- 10% of at least one short, linear siloxane N2 to N6.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622241</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127126</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/82</main-classification>
        <further-classification edition="200601120260302B">C07K14/00</further-classification>
        <further-classification edition="200601120260302B">A01H3/04</further-classification>
        <further-classification edition="200601120260302B">A01P13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商拜奧西克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOSEEK INC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆巴爾迪亞　埃斯特班</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOMBARDIA, ESTEBAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
              <english-address>AR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅韋托　阿德里安　赫蘇斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROVETTO, ADRIAN JESUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
              <english-address>AR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫爾加達　馬科斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORGADA, MARCOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
              <english-address>AR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴赫　吉列爾莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAHR, GUILLERMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
              <english-address>AR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩維諾　聖地牙哥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAVINO, SANTIAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AR</english-country>
              <english-address>AR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/672,969</doc-number>
          <date>20240718</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有除草作用的肽核酸（ＰＮＡ）、除草肽構築體和除草組合物及相關方法</chinese-title>
        <english-title>PEPTIDE NUCLEIC ACIDS (PNAS) WITH HERBICIDAL EFFECT, HERBICIDAL PEPTIDE CONSTRUCTS AND HERBICIDE COMPOSITIONS, AND RELATED METHODS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及除草核酸類似物（NAA），較佳適用於控制有害植物的除草肽核酸（PNA），包含所述NAA和選自細胞穿透肽（CPP）和/或定位信號肽（LSP）中的至少一種的肽構築體，以及包含NAA和至少一種農學上合適的助劑的除草組合物。本發明還涉及一種控制植物類病害的方法，所述方法包括將本發明的組合物應用於有害植物，以及通過將本發明中的PNA或肽構築體應用於靶細胞來沉默或調節靶基因表現的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention refers to an herbicide Nucleic Acid Analog (NAA), preferably an herbicidal Peptide Nucleic Acid (PNA) suitable for controlling a pest plant, a peptide construct comprising said NAA and at least one selected from a cell-penetrating peptide (CPP) and/or a location signal peptide (LSP), and an herbicidal composition comprising the NAA and at least one agronomically suitable adjuvant. The invention also refers to a method for controlling a plant pest which comprises applying the composition of the present invention to a pest plant, and a method for silencing or modulating the expression of a target gene by applying the PNA or peptide construct of the present invention to a target cell.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="432px" img-content="tif" inline="yes" orientation="portrait" width="617px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621711</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127128</doc-number>
          <kind></kind>
          <date>114/07/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K33/06</main-classification>
        <further-classification edition="202601120260302B">C01B3/00</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="200601120260302B">A61P39/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和合生醫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOHO BIOTECH CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王光毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUANG-YIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈明忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, MIN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王天佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TIAN-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,707</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>富氫珊瑚鈣、組成物、製造及其用途</chinese-title>
        <english-title>HYDROGEN-RICH CORAL CALCIUM, COMPOSITIONS, MANUFACTURE AND USE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種富氫珊瑚鈣產物或組成物。其包括(a)具有孔洞之珊瑚鈣材料；及(b)在珊瑚鈣孔洞內帶有的氫氣(H&lt;sub&gt;2&lt;/sub&gt;)；其中富氫珊瑚鈣產物或組成物係呈固體形式，具有在水中連續且穩定釋放氫氣持續至少3小時之性質。亦揭示一種製造本發明富氫珊瑚鈣產物或組成物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hydrogen-rich coral calcium product or composition is disclosed. It comprises (a) a material of coral calcium, having pores; and (b) hydrogen gas (H&lt;sub&gt;2&lt;/sub&gt;), carried in the coral calcium pores; wherein the hydrogen rich coral calcium product or composition is a solid form and possesses a property of continuous and stable release of the hydrogen gas for at least 3 hours when it is in water. A method of manufacturing a hydrogen-rich coral calcium product or composition of the invention is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="396px" img-content="tif" inline="yes" orientation="portrait" width="358px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622452</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127229</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G01B7/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆霍帕迪耶　帕莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKHOPADHYAY, PARTHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富爾福德　亨利　吉姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FULFORD, HENRY JIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加德納　馬克　Ｉ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARDNER, MARK I.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/780,344</doc-number>
          <date>20240722</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>藉由電容器測試結構的金屬凹部深度測量</chinese-title>
        <english-title>METAL RECESS DEPTH MEASUREMENTS BY CAPACITOR TEST STRUCTURE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供一種測試晶圓中金屬凹部深度的系統，其包含形成在晶圓中的測試結構，以及垂直位於測試結構上方的複數探針墊。測試結構包含彼此橫向相鄰的第一區域及第二區域。第一區域包含具有頂表面的介電層以及形成在該頂表面下方的金屬層。第二區域包含該介電層、該金屬層、以及橫向彼此隔開的第一金屬墊及第二金屬墊，其自該頂表面垂直延伸至該介電層中並與該金屬層接觸。該等探針墊包含配置成垂直位於第一區域上方的第一探針墊及第二探針墊，以及配置成垂直位於第二區域上方且與第一金屬墊及第二金屬墊分別對齊的第三探針墊及第四探針墊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for testing metal recess depths into a wafer includes a test structure formed in the wafer, and probe pads positioned vertically over the test structure. The test structure includes a first region and a second region laterally adjacent to each other. The first region includes a dielectric layer having a top surface and a metal layer formed under the top surface. The second region includes the dielectric layer, the metal layer, and a first metal pad and a second metal pad laterally separated, vertically extend into the dielectric layer from the top surface, and in contact with the metal layer. The probe pads include a first and a second probe pads configured to be vertically over the first region, and a third and a fourth probe pads configured to be vertically over the second region and to align with the first and the second metal pads, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:介電層</p>
        <p type="p">1A:介電層1的一部分</p>
        <p type="p">1F:介電層1的頂表面</p>
        <p type="p">2:金屬層或導軌、金屬導軌</p>
        <p type="p">3A:第一金屬墊</p>
        <p type="p">3B:第二金屬墊</p>
        <p type="p">4A:第一探針墊</p>
        <p type="p">4B:第二探針墊</p>
        <p type="p">5A:第三探針墊</p>
        <p type="p">5B:第四探針墊</p>
        <p type="p">10A:第一區域</p>
        <p type="p">10B:第二區域</p>
        <p type="p">11A:第一電容器</p>
        <p type="p">11B:第二電容器</p>
        <p type="p">12A:第三電容器</p>
        <p type="p">12B:第四電容器</p>
        <p type="p">25:預定位置或水平面</p>
        <p type="p">50:晶圓</p>
        <p type="p">60:金屬凹部</p>
        <p type="p">100:系統</p>
        <p type="p">100A:測試結構</p>
        <p type="p">100B:探針墊</p>
        <p type="p">D:距離</p>
        <p type="p">d&lt;sub&gt;1&lt;/sub&gt;:第一距離</p>
        <p type="p">d&lt;sub&gt;2&lt;/sub&gt;:第二距離</p>
        <p type="p">d&lt;sub&gt;R&lt;/sub&gt;:深度</p>
        <p type="p">GND:接地</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="568px" img-content="tif" inline="yes" orientation="portrait" width="862px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623508</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127236</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
        <further-classification edition="202601120260302B">H10W10/10</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202501120260302B">H10D30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台灣積體電路製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林政明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHENG-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱宗凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TSUNG-KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳思樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SZU-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫偉源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOON, WEI-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖　思雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, SZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,750</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/216,212</doc-number>
          <date>20250522</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容揭示一種方法，包括以下步驟：在基板上形成主動區域；在底部區域的第一通道及頂部區域的第二通道上形成閘極介電層；在底部區域的閘極介電層上形成虛設插塞；在頂部區域的閘極介電層上及虛設插塞的側壁上沉積偶極材料層；對偶極材料層及虛設插塞進行第一圖案化製程，使得第三主動區域上不存在偶極材料層及虛設插塞；對閘極介電層進行第一偶極驅動製程；對偶極材料層進行第二圖案化製程，使得第二主動區域上不存在偶極材料層及虛設插塞；及對閘極介電層進行第二偶極驅動製程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method that includes forming active regions on a substrate; forming a gate dielectric layer on first channels in a bottom region and on second channels in a top region; forming dummy plugs on the gate dielectric layer in the bottom region; depositing a dipole material layer on the gate dielectric layer in the top region and on sidewalls of the dummy plugs; performing a first patterning process to the dipole material layer and the dummy plugs such that the dipole material layer and the dummy plugs are absent on the third active region; performing a first dipole driving process to the gate dielectric layer; performing a second patterning process to the dipole material layer such that the dipole material layer and the dummy plugs are absent on the second active region; and performing a second dipole driving process to the gate dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:IC結構、工件</p>
        <p type="p">102:基板</p>
        <p type="p">120N:n型閘極電極</p>
        <p type="p">120P:p型閘極電極</p>
        <p type="p">202:半導體通道、通道、通道層</p>
        <p type="p">203:介面層</p>
        <p type="p">204:高k介電層、閘極介電層、高k介電材料層</p>
        <p type="p">208:PFET閘極區域、底部閘極區域</p>
        <p type="p">302:半導體通道、通道、通道層</p>
        <p type="p">308:NFET閘極區域、頂部閘極區域</p>
        <p type="p">516:隔離結構</p>
        <p type="p">Y、Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10048.png" file="d10048.TIF" giffile="ed10048.png" height="785px" img-content="tif" inline="yes" orientation="portrait" width="910px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623576</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127239</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="200601120260302B">B25J11/00</further-classification>
        <further-classification edition="200601120260302B">B25J13/08</further-classification>
        <further-classification edition="200601120260302B">B25J15/00</further-classification>
        <further-classification edition="200601120260302B">B25J9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰勒　特維斯　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAYLOR, TRAVIS R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,562</doc-number>
          <date>20240723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含具有與感測器通訊用的整合天線之末端效應器的晶圓轉運機器人</chinese-title>
        <english-title>WAFER TRANSFER ROBOTS INCLUDING END EFFECTORS HAVING INTEGRATED ANTENNAS FOR COMMUNICATION WITH SENSORS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">晶圓搬運系統包括晶圓搬運機器人，該晶圓搬運機器人包含基部；耦接至配置成轉運基板之末端效應器的一或更多手臂區段；嵌入末端效應器中的天線，其中天線係配置成接收來自配置在晶圓搬運系統內之至少一感測器的感測器資料；以及與天線通訊的路由器，其中路由器係配置成從嵌入末端效應器中的天線接收感測器資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wafer handling system includes a wafer handling robot, which includes a base, one or more arm segments coupled to an end effector configured to transfer a substrate, an antenna embedded in the end effector, wherein the antenna is configured to receive sensor data from at least one sensor arranged within the wafer handling system, and a router in communication with the antenna, wherein the router is configured to receive the sensor data from the antenna embedded in the end effector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">610:路由器</p>
        <p type="p">620:轉運機器人</p>
        <p type="p">628:手臂區段</p>
        <p type="p">632:末端效應器</p>
        <p type="p">634:天線</p>
        <p type="p">636:感測器晶圓</p>
        <p type="p">638:感測器</p>
        <p type="p">640:無線訊號</p>
        <p type="p">642:旋轉關節</p>
        <p type="p">644:基部</p>
        <p type="p">648:真空饋通件</p>
        <p type="p">650:導線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="968px" img-content="tif" inline="yes" orientation="portrait" width="749px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623612</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127264</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P76/00</main-classification>
        <further-classification edition="200601120260302B">B29C59/02</further-classification>
        <further-classification edition="200601120260302B">B29C33/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤公夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, KIMIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-116815</doc-number>
          <date>20240722</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>壓印模具用基板及其製造方法、以及壓印模具及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之壓印模具用基板用於製造能以極高之位置精度轉印凹凸圖案之壓印模具，其包含具有第1面及位於其相反側之第2面的基材，且於基材之第2面上，第1點、第2點及第3點位於連結第2面之幾何中心與第2面之外周緣上之任意點的一直線上，第1點位於距第2面之幾何中心最近之處，第3點位於距第2面之外周緣最近之處，第2點位於第1點與第3點之間，於通過第1點、第2點及第3點且沿著基材之厚度方向之剖面上，第1點處之第1高度T&lt;sub&gt;1&lt;/sub&gt;、第2點處之第2高度T&lt;sub&gt;2&lt;/sub&gt;及第3點處之第3高度T&lt;sub&gt;3&lt;/sub&gt;滿足式T&lt;sub&gt;1&lt;/sub&gt;≥T&lt;sub&gt;3&lt;/sub&gt;＞T&lt;sub&gt;2&lt;/sub&gt;所示之關係，第1～第3高度T&lt;sub&gt;1&lt;/sub&gt;～T&lt;sub&gt;3&lt;/sub&gt;係以第1面位於下方之狀態將基材載置於規定之水平面時，以該水平面為基準的高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:壓印模具用基板</p>
        <p type="p">2:基材</p>
        <p type="p">3:凸構造部</p>
        <p type="p">4:凹陷部</p>
        <p type="p">21:第1面</p>
        <p type="p">22:第2面</p>
        <p type="p">31:凸構造部之上表面</p>
        <p type="p">41:凹陷部之緣部</p>
        <p type="p">H&lt;sub&gt;3&lt;/sub&gt;:凸構造部之突出高度</p>
        <p type="p">P1:第1點</p>
        <p type="p">P2:第2點</p>
        <p type="p">P3:第3點</p>
        <p type="p">PO:第2面之外周緣</p>
        <p type="p">T&lt;sub&gt;1&lt;/sub&gt;:高度</p>
        <p type="p">T&lt;sub&gt;2&lt;/sub&gt;:高度</p>
        <p type="p">T&lt;sub&gt;3&lt;/sub&gt;:高度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="416px" img-content="tif" inline="yes" orientation="portrait" width="803px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623537</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127269</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/28</main-classification>
        <further-classification edition="202601120260302B">H10P50/68</further-classification>
        <further-classification edition="202601120260302B">H10P76/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡塔諾　克里斯多佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CATANO, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>列斐伏爾　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEFEVRE, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禧爾　傑佛瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEARER, JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/781,793</doc-number>
          <date>20240723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>形成具有高深寬比之凹陷特徵部的蝕刻系統</chinese-title>
        <english-title>ETCHING SYSTEM FOR FORMING RECESSED FEATURES WITH HIGH ASPECT RATIO</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包含在腔室中提供結構，其中結構包含複數第一層與複數第二層交替地堆疊於彼此之上；暴露結構於第一氣體，藉此透過遮罩而移除保持完整之複數第二層中之一最頂者之一或更多部分；暴露結構於第二氣體，藉此轉換完整之複數第一層之一最頂者之一或更多部分；以及暴露結構於第一氣體，藉此移除最頂第一層之一或更多轉換部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes providing a structure in a chamber, wherein the structure comprising a plurality of first layers and a plurality of second layers alternately stacked on top of one another; exposing the structure to a first gas, thereby removing one or more portions of a topmost one of the plurality of second layers that was intact through a mask; exposing the structure to a second gas, thereby converting one or more portions of a topmost one of the plurality of first layers that was intact; and exposing the structure to the first gas, thereby removing the one or more converted portions of the topmost first layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:基板</p>
        <p type="p">210:堆疊</p>
        <p type="p">212:第一層</p>
        <p type="p">212A:最頂第一層</p>
        <p type="p">214:第二層</p>
        <p type="p">214A:最頂第二層</p>
        <p type="p">220:遮罩</p>
        <p type="p">222:圖案</p>
        <p type="p">230:凹陷特徵部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="435px" img-content="tif" inline="yes" orientation="portrait" width="310px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622069</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127273</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D413/04</main-classification>
        <further-classification edition="200601120260302B">C07D401/14</further-classification>
        <further-classification edition="200601120260302B">C07D401/04</further-classification>
        <further-classification edition="200601120260302B">C07D403/04</further-classification>
        <further-classification edition="200601120260302B">C07D403/14</further-classification>
        <further-classification edition="200601120260302B">A61K31/4427</further-classification>
        <further-classification edition="200601120260302B">A61K31/513</further-classification>
        <further-classification edition="200601120260302B">A61K31/4545</further-classification>
        <further-classification edition="200601120260302B">A61K31/497</further-classification>
        <further-classification edition="200601120260302B">A61K31/501</further-classification>
        <further-classification edition="200601120260302B">A61P1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商Ｃ4Ｘ探索有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C4X DISCOVERY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>欣德　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HYND, GEORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉尼　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLANEY, PAUL MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博蒙特　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEAUMONT, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克恩　奧利佛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KERN, OLIVER THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>英國</country>
          <doc-number>2410575.1</doc-number>
          <date>20240719</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>英國</country>
          <doc-number>2412270.7</doc-number>
          <date>20240820</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>治療性化合物(二)</chinese-title>
        <english-title>THERAPEUTIC COMPOUNDS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於作為α4β7整聯蛋白抑制劑之化合物。本發明亦係關於用於製備該等化合物之方法、包含該等化合物之醫藥組合物以及該等物質在治療與α4β7相關之疾病或病症中之用途。&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to compounds that are α4β7 integrin inhibitors. The present invention also relates to processes for the preparation of these compounds, to pharmaceutical compositions comprising them, and to their use in the treatment of diseases or disorders associated with α4β7.&lt;b&gt;  &lt;/b&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623637</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127298</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/00</main-classification>
        <further-classification edition="202601120260302B">H10W40/25</further-classification>
        <further-classification edition="202601120260302B">H10W40/73</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商國際電氣股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUSAI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤森弘貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMORI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野正昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, MASAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/042240</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置，基板加熱方法及半導體裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種加熱為使基板的溫度形成均等的技術。  &lt;br/&gt;　　具有包含蓄熱材料的絕熱體，其配置在被收容於反應容器內的基板附近，該反應容器是被構成為加熱至預定的溫度，  &lt;br/&gt;　　並被構成為：若前述蓄熱材料的熔點高於前述預定的溫度，則前述蓄熱材料為固體，若前述蓄熱材料的熔點低於前述預定的溫度，則前述蓄熱材料為液體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">300:絕熱體</p>
        <p type="p">301:蓄熱材料</p>
        <p type="p">302:石英構件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="363px" img-content="tif" inline="yes" orientation="portrait" width="445px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622121</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127329</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/30</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商多安生物治療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAAN BIOTHERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
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                <last-name>趙炳哲</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>CHO, BYOUNG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴世映</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SAE YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金楠勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, NAMHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴之泳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JI YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
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              <chinese-name name-type="organization">
                <last-name>金榮燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG SEOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹炷景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, JU GYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0095982</doc-number>
          <date>20240719</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2025-0092621</doc-number>
          <date>20250709</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>新穎的抗ＣＥＡＣＡＭ５抗體及其治療用途</chinese-title>
        <english-title>NOVEL ANTI-CEACAM5 ANTIBODIES AND THERAPEUTIC USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種特異性結合至CEACAM5之新穎的抗體及其治療用途。根據本發明之抗體可為單株抗體或雙特異性抗體的形式，且雙特異性抗體可為雙互補位抗體。根據本發明之抗體可用於治療癌症。根據本發明之抗體可具有可用於癌症治療之各種抗體基模態之形式，且抗體基模態包含抗體藥物複合體（ADC）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to novel antibodies that specifically bind to CEACAM5 and therapeutic uses thereof. The antibody according to the present disclosure may be in the form of a monoclonal antibody or a bispecific antibody, and the bispecific antibody may be a biparatopic antibody. The antibody according to the present disclosure is useful for treating cancer. The antibody according to the present disclosure may have the form of various antibody-based modalities that may be used for cancer treatment, and the antibody-based modality includes an antibody-drug conjugate (ADC).</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="598px" img-content="tif" inline="yes" orientation="portrait" width="600px">
          </img>
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    </description>
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      <isuno>11</isuno>
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          <kind></kind>
          <date>115/06/01</date>
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          <doc-number>114127340</doc-number>
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        <main-classification edition="200601120260302B">A61K31/675</main-classification>
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              <chinese-name name-type="organization">
                <last-name>美商基利科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILEAD SCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>柏克爾　亞歷山大　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURCKLE, ALEXANDER J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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                <last-name>陳　阿爾伯特</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>CHIN, ELBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <english-address>US</english-address>
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                <last-name>鄧亦范</last-name>
                <first-name></first-name>
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                <last-name>DENG, YIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
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              <english-address>CN</english-address>
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                <last-name>恩珊　迪巴</last-name>
                <first-name></first-name>
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                <last-name>ENSAN, DEEBA</last-name>
                <middle-name></middle-name>
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              <address></address>
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              <english-address>CA</english-address>
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                <last-name>法爾　約書亞　Ｄ</last-name>
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              <english-name name-type="organization">
                <last-name>FARR, JOSHUA D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>赫里希　瑪莉　史都華</last-name>
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                <last-name>HERLIHY, MARY STUART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>瓊　班傑明　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNE, BENJAMIN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>曼達　雅各迪希　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANDA, JAGADEESH N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
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          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾特　葛雷高瑞　Ｔ</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>NOTTE, GREGORY T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>帕克希爾　艾瑞克　Ｑ</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>PARKHILL, ERIC Q.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>賽吉兒　達斯汀　Ｓ</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SIEGEL, DUSTIN S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>斯彭思　凱蒂　Ａ</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SPENCE, KATIE A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　征宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHENG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾　顯煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, XIANHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
            </addressbook>
          </agent>
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              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          <agent rep-type="agent" sequence="3">
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              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/673,485</doc-number>
          <date>20240719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ＳＴＡＴ６化合物</chinese-title>
        <english-title>STAT6 COMPOUNDS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供信號轉導及轉錄活化子6 (STAT6)之調節劑，包括式J、I、及Ia之化合物、其醫藥組成物、及治療發炎性病況或疾病之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Modulators of signal transducer and activator of transcription 6 (STAT6) are provided, including compounds of Formula J, I and Ia, pharmaceutical compositions thereof, and methods of treating an inflammatory condition or disease.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
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          <date>115/06/01</date>
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        <document-id>
          <doc-number>114127346</doc-number>
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        <further-classification edition="200601120260302B">A61P17/04</further-classification>
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                <last-name>美商安進公司</last-name>
                <first-name></first-name>
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                <last-name>AMGEN INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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              <english-address>US</english-address>
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          </applicant>
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                <last-name>日商協和麒麟股份有限公司</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>KYOWA KIRIN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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          </applicant>
        </applicants>
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              <chinese-name name-type="organization">
                <last-name>恰魯萬　普里斯塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHARUWORN, PRISTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>納格帕爾　安杰里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGPAL, ANJALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>艾斯方迪阿里　埃薩諾拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESFANDIARI, EHSANOLLAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
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              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青野友紀子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AONO, YUKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索奈葛倫　亨里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONNERGREN, HENRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波洛克　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOULOC, ANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特里菲迪　艾許特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRIVEDI, ASHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/672,905</doc-number>
          <date>20240718</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療結節性癢疹之方法</chinese-title>
        <english-title>METHOD FOR TREATING PRURIGO NODULARIS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於藉由投與抗OX40或抗OX40L抑制劑來治療結節性癢疹之方法，以及具有用於這種用途的說明書的製品。特別地，本發明關於一種劑量方案，其中抗OX40抗體以介於約150 mg與300 mg之間的劑量每4週一次投與，其中在第2週投與介於約150 mg與300 mg之間的額外負載劑量的抗OX40抗體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a method for treating prurigo nodularis by administering an anti-OX40 or anti-OX40L inhibitor, and an article of manufacture with instructions for such use. In particular the invention relates to a dosage regiment wherein an anti-OX40 antibody is administered at a dose of between about 150 mg and 300 mg once every 4 weeks, with an additional loading dose of anti-OX40 antibody between about 150 mg and 300 mg at week 2.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="532px" img-content="tif" inline="yes" orientation="portrait" width="948px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622113</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127373</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">C07D491/22</further-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商蜂鳥生物科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUMMINGBIRD BIOSCIENCE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博伊德　柯克普　傑羅姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYD-KIRKUP, JEROME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英格拉姆　皮爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INGRAM, PIERS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱　思賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHOO, GARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢森　布蘭登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSON, BRENDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔卡爾　迪普第</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAKKAR, DIPTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾斯　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AYERS, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　安琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOI, LISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　方正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAU, KEVIN FONGCHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔榮周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YOUNGJOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈　修立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIM, XIU LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/673,373</doc-number>
          <date>20240719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ＴＲＯＰ２結合分子</chinese-title>
        <english-title>TROP2-BINDING MOLECULES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供結合至TROP2之抗原結合分子，其包含(i) TROP2結合部分，及(ii)至少一個連接子-酬載部分，其中該抗原結合分子包含(a) DNA損傷反應(DDR)抑制劑部分，及(b) DNA拓撲異構酶I (TOP1)抑制劑部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided here are antigen-binding molecules that bind to TROP2, comprising (i) a TROP2-binding moiety, and (ii) at least one linker-payload moiety, wherein the antigen-binding molecule comprises (a) a DNA damage response (DDR) inhibitor moiety, and (b) a DNA topoisomerase I (TOP1) inhibitor moiety.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10050.JPG" file="ed10050.JPG" height="350px" img-content="tif" inline="yes" orientation="portrait" width="748px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622114</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127374</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">C07D491/22</further-classification>
        <further-classification edition="200601120260302B">C07D413/04</further-classification>
        <further-classification edition="200601120260302B">C07D403/12</further-classification>
        <further-classification edition="200601120260302B">C07D487/04</further-classification>
        <further-classification edition="200601120260302B">C07D471/04</further-classification>
        <further-classification edition="200601120260302B">C07D413/14</further-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商蜂鳥生物科技私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUMMINGBIRD BIOSCIENCE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博伊德　柯克普　傑羅姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYD-KIRKUP, JEROME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英格拉姆　皮爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INGRAM, PIERS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱　思賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHOO, GARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢森　布蘭登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSON, BRENDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔卡爾　迪普第</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THAKKAR, DIPTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾爾斯　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AYERS, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　安琪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOI, LISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　方正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAU, KEVIN FONGCHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈　修立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIM, XIU LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達摩迪卡里　布沙恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHARMADHIKARI, BHUSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯里尼瓦桑　拉賈維爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRINIVASAN, RAJAVEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/673,425</doc-number>
          <date>20240719</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/743,028</doc-number>
          <date>20250108</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>Ｂ７Ｈ３結合分子</chinese-title>
        <english-title>B7H3-BINDING MOLECULES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供結合至B7H3之抗原結合分子，其包含(i) B7H3部分，及(ii)至少一個連接子-酬載部分，其中該抗原結合分子包含(a) DNA損傷反應(DDR)抑制劑部分，及(b) DNA拓撲異構酶I (TOP1)抑制劑部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided here are antigen-binding molecules that bind to B7H3, comprising (i) a B7H3-binding moiety, and (ii) at least one linker-payload moiety, wherein the antigen-binding molecule comprises (a) a DNA damage response (DDR) inhibitor moiety, and (b) a DNA topoisomerase I (TOP1) inhibitor moiety.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10196.JPG" file="ed10196.JPG" height="316px" img-content="tif" inline="yes" orientation="portrait" width="736px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623452</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127409</doc-number>
          <kind></kind>
          <date>114/07/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/85</main-classification>
        <further-classification edition="202501120260302B">H10D30/00</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D62/40</further-classification>
        <further-classification edition="202501120260302B">H10D62/83</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴範璡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BEOMJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴起丙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KIBYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴俊模</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUNMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KANG-ILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/683,351</doc-number>
          <date>20240815</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/089,809</doc-number>
          <date>20250325</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括基板、基板上的下部通道堆疊、下部通道堆疊上的上部通道堆疊、延伸圍繞下部通道堆疊和上部通道堆疊的閘極電極、在基板上並包括絕緣材料的閘極切割區域、在上部通道堆疊和閘極切割區域之間的半導體材料層、以及在半導體材料層和上部通道堆疊之間的絕緣層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a substrate, a lower channel stack on the substrate, an upper channel stack on the lower channel stack, a gate electrode extending around the lower channel stack and the upper channel stack, a gate cut region that is on the substrate and includes an insulating material, a semiconductor material layer between the upper channel stack and the gate cut region, and an insulating layer that is between the semiconductor material layer and the upper channel stack.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">106:基板</p>
        <p type="p">118:閘極電極</p>
        <p type="p">120:閘極接觸結構</p>
        <p type="p">122:閘極切割區域</p>
        <p type="p">138:源極/汲極電極</p>
        <p type="p">139:源極/汲極接觸結構</p>
        <p type="p">A-A、B-B:虛線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="902px" img-content="tif" inline="yes" orientation="portrait" width="757px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622279</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127457</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C23C16/44</main-classification>
        <further-classification edition="200601120260224B">C23C16/455</further-classification>
        <further-classification edition="200601120260224B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商卡納圖芬蘭有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANATU FINLAND OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯內　湯米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSKINEN, TOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>君圖寧　塔內利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNTUNEN, TANELI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利馬塔南　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIIMATAINEN, MARKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>芬蘭</country>
          <doc-number>20245917</doc-number>
          <date>20240723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於CVD系統的閥控制方法</chinese-title>
        <english-title>METHOD OF VALVE CONTROL FOR CVD SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種用於化學氣相沉積的方法和系統。當用於收集室的旁路閥打開時，同時將反應器和收集室之間的收集閥以及收集閥和收集室之間的吹掃閥打開，以將來自收集閥和旁路閥之間的碎屑吹掃通過旁路閥。此後，關閉吹掃閥並打開收集閥，以將沉積產物自反應器引導至收集室以進行處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method and a system for chemical vapor deposition. A collection valve between a reactor and a collection chamber and a purge valve between the collection valve and the collection chamber is open while a bypass valve for the collection chamber is open for purging debris from between the collection valve and the bypass valve through the bypass valve. Thereafter, the purge valve is closed and the collection valve open for directing the deposition product from the reactor to the collection chamber for treatment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:化學氣相沉積系統</p>
        <p type="p">110:反應器</p>
        <p type="p">120:收集室</p>
        <p type="p">130:氣體分配系統</p>
        <p type="p">132:反應器臂</p>
        <p type="p">134:收集臂</p>
        <p type="p">136:旁路臂</p>
        <p type="p">138:視窗</p>
        <p type="p">140:收集閥</p>
        <p type="p">142:旁路閥</p>
        <p type="p">144:吹掃閥</p>
        <p type="p">146:排放閥</p>
        <p type="p">150:控制器</p>
        <p type="p">152:處理器</p>
        <p type="p">154:記憶體</p>
        <p type="p">160:碎屑</p>
        <p type="p">170:引導</p>
        <p type="p">172:吹掃</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="976px" img-content="tif" inline="yes" orientation="portrait" width="740px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622888</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127461</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120260226B">G06T7/00</main-classification>
        <further-classification edition="200601120260226B">G01N21/33</further-classification>
        <further-classification edition="200601120260226B">G01N21/956</further-classification>
        <further-classification edition="201201120260226B">G03F1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉詹德蘭　拉吉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJENDRAN, RAJEEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛特瑞　法里德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATRY, FARID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
              <english-address>IR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>是　瑞方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, RUI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,956</doc-number>
          <date>20240812</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/267,050</doc-number>
          <date>20250711</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用微型EUV校準目標之EUV光罩檢測及成像系統之光化運行時系統診斷</chinese-title>
        <english-title>ACTINIC RUN TIME SYSTEM DIAGNOSTICS OF EUV RETICLE INSPECTION AND IMAGING SYSTEMS USING MINIATURIZED EUV CALIBRATION TARGETS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種檢測系統包含：一載台，其用於定位待檢測之一基板；一或多個基於光罩之診斷目標，其定位於該載台上；以及一光罩檢測子系統，其具有涵蓋該載台之一視野。該系統包含一控制器，該控制器經組態以使該視野在該載台之部分之間移動以便選擇性地執行基板檢測及預定義影像品質度量之運行時診斷(RTD)。在實施例中，該系統可係用於EUV遮罩檢測之一APMI系統，且該等診斷目標可係具有預定義EUV效能圖案化之基於EUV光罩之診斷目標。在實施例中，該等診斷目標可定位成毗鄰於待檢測遮罩以准許進行連續掃描來執行檢測及RTD。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An inspection system includes a stage for positioning a substrate to be inspected, one or more reticle-based diagnostic targets positioned on the stage, and a reticle inspection sub-system having a field of view encompassing the stage. The system includes a controller configured to move the field of view between portions of the stage to selectively perform substrate inspection and run time diagnostics (RTD) of predefined image quality metrics. In embodiments, the system may be an APMI system for EUV mask inspection and the diagnostic targets may be EUV reticle-based diagnostic targets having predefined EUV performance patterning. In embodiments, the diagnostic targets may be positioned adjacent to the mask to be inspected to permit contiguous scanning to perform inspection and RTD.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微影遮罩檢測系統/檢測系統/極紫外線檢測系統</p>
        <p type="p">102:光罩檢測子系統</p>
        <p type="p">104:照明源</p>
        <p type="p">106:照明束</p>
        <p type="p">108:照明光學器件</p>
        <p type="p">110:載台</p>
        <p type="p">112:第二組光學器件</p>
        <p type="p">114:偵測器</p>
        <p type="p">116:基板/微影遮罩</p>
        <p type="p">118:診斷目標</p>
        <p type="p">120:收集路徑</p>
        <p type="p">122:控制器</p>
        <p type="p">124:處理器</p>
        <p type="p">126:記憶體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="743px" img-content="tif" inline="yes" orientation="portrait" width="989px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623001</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127466</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">H01C7/02</main-classification>
        <further-classification edition="200601120260226B">H01C7/18</further-classification>
        <further-classification edition="200601120260226B">H02H9/02</further-classification>
        <further-classification edition="200601120260226B">H05B3/12</further-classification>
        <further-classification edition="200601120260226B">H05B3/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商力特福斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITTELFUSE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>符　棟強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POO, TONGKIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SKY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王冰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110175063</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>保護裝置、正溫度係數裝置及正溫度係數電阻器</chinese-title>
        <english-title>PROTECTION DEVICE, POSITIVE TEMPERATURE COEFFICIENT DEVICE AND POSITIVE TEMPERATURE COEFFICIENT RESISTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及一種保護裝置，該保護裝置包括正溫度係數（PTC）元件和熱裝置，所述PTC元件具有與第二主側相對的第一主側，所述熱裝置通過導電材料連接到PTC元件。熱裝置可以包括主體、連接到主體的第一側的第一加熱元件、以及連接到主體的第二側的第二加熱元件，其中，第一加熱元件被直接連接到PTC元件的第二主側。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure is directed to protection devices including a positive temperature coefficient (PTC) element having a first main side opposite a second main side, and a thermal device coupled to the PTC element by a conductive material. The thermal device may include a main body, a first heating element coupled to a first side of the main body, and a second heating element coupled to a second side of the main body, wherein the first heating element is directly coupled to the second main side of the PTC element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:裝置</p>
        <p type="p">102:盤</p>
        <p type="p">105:熱裝置</p>
        <p type="p">106:本體</p>
        <p type="p">108:第一主側</p>
        <p type="p">110:第二主側</p>
        <p type="p">112:本體</p>
        <p type="p">114:第一主側</p>
        <p type="p">116:第二主側</p>
        <p type="p">120:第一端接件</p>
        <p type="p">122:第二端接件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="913px" img-content="tif" inline="yes" orientation="portrait" width="602px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622559</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127476</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G02B6/12</main-classification>
        <further-classification edition="200601120260224B">G02B6/26</further-classification>
        <further-classification edition="200601120260224B">G02F1/025</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商爾雅實驗室公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AYAR LABS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布赫賓德　西德尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHBINDER, SIDNEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉維吉安　哈伊格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEVORGYAN, HAYK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AM</english-country>
              <english-address>AM</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲尼　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINI, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇樓　阿納托爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHILO, ANATOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BY</english-country>
              <english-address>BY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基塔　德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITA, DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡　奥登　德瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN ORDEN, DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威克魯斯　德雷斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERCRUYSSE, DRIES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　馬諾基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, MANUJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,195</doc-number>
          <date>20240722</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有改良之可靠性的微環共振器裝置加熱器</chinese-title>
        <english-title>MICRORING RESONATOR DEVICE HEATER WITH IMPROVED RELIABILITY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電光半導體晶片包括包圍微環共振器裝置內部區域之環形光波導。主光波導延伸超過環形光波導，使得兩者之間存在光學耦合區。摻雜矽環設置於微環共振器裝置之內部區域內。沿摻雜矽環之內緣形成矽化矽內區。沿摻雜矽環之外緣形成矽化矽外區。第一複數電觸點與矽化矽外區電接觸。第二複數電觸點與矽化矽內區電接觸。第一與第二複數電觸點之間的電壓差控制流經摻雜矽環之電流，從而控制環形光波導的溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electro-optical semiconductor chip includes a ring-shaped optical waveguide circumscribing an interior region of a microring resonator device. A bus optical waveguide extends past the ring-shaped optical waveguide, such that an optical coupling region exists therebetween. A doped ring of silicon is disposed within the interior region of the microring resonator device. An inner region of silicided silicon is formed along an inner edge of the doped ring of silicon. An outer region of silicided silicon is formed along an outer edge of the doped ring of silicon. A first plurality of electrical contacts electrically contact the outer region of silicided silicon. A second plurality of electrical contacts electrically contact the inner region of silicided silicon. A voltage differential between the first and second pluralities of electrical contacts controls an electrical current flow through the doped ring of silicon to control a temperature of the ring-shaped optical waveguide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微環共振器裝置</p>
        <p type="p">101:摻雜矽非矽化電阻式徑向電流加熱器</p>
        <p type="p">103:環形光波導</p>
        <p type="p">105:光波導</p>
        <p type="p">107:光學耦合區</p>
        <p type="p">109:矽化矽外環</p>
        <p type="p">111:矽化矽內環</p>
        <p type="p">113:第一複數電觸點</p>
        <p type="p">115:第二複數電觸點</p>
        <p type="p">117:箭頭</p>
        <p type="p">119:箭頭</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10031.JPG" file="ed10031.JPG" height="812px" img-content="tif" inline="yes" orientation="portrait" width="758px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622633</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127482</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G03F7/004</main-classification>
        <further-classification edition="200601120260224B">G03F7/11</further-classification>
        <further-classification edition="200601120260224B">G03F7/16</further-classification>
        <further-classification edition="200601120260224B">G03F7/20</further-classification>
        <further-classification edition="200601120260224B">G03F7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>墨菲　邁克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURPHY, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格熱希科維亞克　約迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRZESKOWIAK, JODI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡特勒　夏洛特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUTLER, CHARLOTTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NZ</english-country>
              <english-address>NZ</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康克林　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONKLIN, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/784,631</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>EUV成像之節距分離</chinese-title>
        <english-title>PITCH SPLITTING FOR EUV IMAGING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種圖案化基板的方法包含使用極紫外(EUV)光阻在該基板上方形成模板(mandrel)，以及從由第一溶劑、第一聚合物，以及試劑產生劑或酸構成的第一溶液將第一被覆層沉積在該模板上方。選擇性移除該第一被覆層，留下被第二模板部分圍繞的第一模板部分，該第二模板部分係透過以該第一被覆層改質該模板的外部而形成。從由第二溶劑及第二聚合物構成的第二溶液將第二被覆層沉積在該第二模板部分上方，該第二被覆層與該第一模板部分係被該第二模板部分隔開。透過相對於該第一模板部分選擇性移除該第二模板部分，從而沿著該第一模板部分的側壁形成第二模板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of patterning a substrate includes forming a mandrel over the substrate using an extreme ultraviolet (EUV) resist, and depositing a first overcoat layer over the mandrel from a first solution of a first solvent, a first polymer, and an agent generator or an acid. Selectively removing the first overcoat layer leaving a first mandrel portion surrounded by a second mandrel portion, the second mandrel portion formed by modifying an outer portion of the mandrel by the first overcoat layer. A second overcoat layer is deposited over the second mandrel portion from a second solution of a second solvent and a second polymer, the second overcoat layer being separated from the first mandrel portion by the second mandrel portion. A second mandrel is formed along a sidewall of the first mandrel portion by selectively removing the second mandrel portion relative to the first mandrel portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體工件</p>
        <p type="p">102:圖案化處理</p>
        <p type="p">104:基板</p>
        <p type="p">106:中間層</p>
        <p type="p">119:第一模板部分</p>
        <p type="p">122:第二模板</p>
        <p type="p">123:圖案化結構</p>
        <p type="p">124:凹槽</p>
        <p type="p">H&lt;sub&gt;3&lt;/sub&gt;:高度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="369px" img-content="tif" inline="yes" orientation="portrait" width="650px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622783</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127492</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120251014B">G06F21/64</main-classification>
        <further-classification edition="200601120251014B">H01M10/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文　司華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411717262X</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電池單元保護方法和電池系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">依據本發明的實施例揭露了一種電池單元保護方法和電池系統，電池單元保護方法包括：所述主機根據對稱加密演算法和臨時共享金鑰將第一訊號轉換為第一密文，並將所述第一密文發送給所述第一晶片，其中，所述第一訊號被配置為根據隨機數和包括第一命令的明文產生的訊號；以及所述第一晶片接收所述第一密文，並根據所述對稱加密演算法和所述臨時共享金鑰將所述第一密文轉換為包括第一命令的明文，所述第一晶片執行第一命令以進入第一工作模式。本發明的電池單元保護方法透過至少加密主機發送給第一晶片的命令，以使得第一命令本身不能被直接獲取，保護了第一晶片中電池相關的資訊不被更改，從而防止了非官方電池被誤判為官方電池。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="522px" img-content="tif" inline="yes" orientation="portrait" width="565px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622651</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127493</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">G05B11/28</main-classification>
        <further-classification edition="200601120251103B">G05B11/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商矽力杰半導體技術（杭州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭智文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓雲龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117209446</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>控制器以及應用其的電子系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種控制器以及應用其的電子系統。本發明實施例的技術方案通過觸發信號發生器產生多個觸發信號來協調不同外設模組進行交互，以在無MCU的情況下完成輸出信號的採樣，以及環路控制參數的計算，並且產生可調脈衝寬度的PWM信號控制電子系統完成回饋控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:匯流排</p>
        <p type="p">11:參數調節模組</p>
        <p type="p">12:脈衝寬度調變模組</p>
        <p type="p">13:觸發信號發生器</p>
        <p type="p">14:採樣模組</p>
        <p type="p">100:制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="290px" img-content="tif" inline="yes" orientation="portrait" width="527px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623704</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127498</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W90/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="200601120260302B">B32B9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔奇曼　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUCHMAN, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木歩太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, AYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　德寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, TEK PO RINUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫　錫久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, ILSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,184</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/818,447</doc-number>
          <date>20240828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>導熱性基板接合介面</chinese-title>
        <english-title>THERMALLY CONDUCTIVE SUBSTRATE BONDING INTERFACE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種接合基板結構，包含：第一基板；第二基板；以及接合區，將第一基板接合至第二基板。接合區包含直接接觸氮化鋁層之氧化鋁接合層，且在氧化鋁接合層與第一基板或第二基板之接合表面之間具有接合介面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonded substrate structure includes a first substrate; a second substrate; and a bonding region bonding the first substrate to the second substrate. The bonding region includes an aluminum oxide bonding layer directly contacting an aluminum nitride layer, and a bonding interface between the aluminum oxide bonding layer and a bonding surface of the first substrate or the second substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:接合基板結構</p>
        <p type="p">110:基板</p>
        <p type="p">112:接合介面</p>
        <p type="p">113:接合表面</p>
        <p type="p">118:接合區</p>
        <p type="p">120:第一導熱性層</p>
        <p type="p">124:導熱性層厚度</p>
        <p type="p">130:第二導熱性層</p>
        <p type="p">134:接合層厚度</p>
        <p type="p">140:第二基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.bmp" file="ed10008.bmp" height="587px" img-content="tif" inline="yes" orientation="portrait" width="602px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622243</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114127509</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/86</main-classification>
        <further-classification edition="200601120260302B">C07K14/005</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法希里　朱莉婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAKHIRI, JULIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧特爾　維羅妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OETTL, VERONIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席伯　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEEBER, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史坦吉爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEININGER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24190010.9</doc-number>
          <date>20240722</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>歐洲專利局</country>
          <doc-number>25151734.8</doc-number>
          <date>20250114</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>新穎ＡＡＶ　ＲＥＰ　ＯＲＦ　及　ＲＥＰ　多肽</chinese-title>
        <english-title>NOVEL AAV REP ORFS AND REP POLYPEPTIDES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文報導了一種核酸，其編碼功能性腺相關病毒 Rep 蛋白，其中該核酸在 5' 至 3' 方向上包含第一 5' 末端部分、第二 5' 末端部分、中央部分、第二 3' 末端部分及第一 3' 末端部分，其中該第一 5' 末端部分係與 AAV2 或 AAV6 血清型之 rep 基因的一部分相似，且第二 5' 末端部分係與 AAV1 血清型之 rep 基因的一部分相似，並且該第二 3' 末端部分係與 AAV10 或 AAV11 血清型之 rep 基因的一部分相似，且第一 3' 末端部分係與 AAV13 血清型之 rep 基因的一部分相似。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Herein is reported a nucleic acid encoding a functional adeno-associated virus Rep protein, characterized in that the nucleic acid comprises in 5’- to 3’-direction a first 5’-terminal part, a second 5’-terminal part, a central part, a second 3’-terminal part and a first 3’-terminal part, wherein the first 5’-terminal part is similar to a part of the rep gene of the AAV2 or AAV6 serotype and a second 5’-terminal part is similar to a part of the rep gene of an AAV1 serotype and the second 3’-terminal part is similar to a part of the rep gene of the AAV10 or AAV11 serotype and a first 3’-terminal part is similar to a part of the rep gene of an AAV13 serotype.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="338px" img-content="tif" inline="yes" orientation="portrait" width="412px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621666</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127519</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/25</main-classification>
        <further-classification edition="200601120260302B">A61K8/24</further-classification>
        <further-classification edition="200601120260302B">A61K8/28</further-classification>
        <further-classification edition="200601120260302B">A61K8/19</further-classification>
        <further-classification edition="200601120260302B">A61K8/365</further-classification>
        <further-classification edition="200601120260302B">A61K8/68</further-classification>
        <further-classification edition="200601120260302B">A61K8/34</further-classification>
        <further-classification edition="200601120260302B">A61K8/60</further-classification>
        <further-classification edition="200601120260302B">A61K8/02</further-classification>
        <further-classification edition="200601120260302B">A61K8/06</further-classification>
        <further-classification edition="200601120260302B">A61Q19/08</further-classification>
        <further-classification edition="200601120260302B">A61Q19/02</further-classification>
        <further-classification edition="200601120260302B">A61Q1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹宜潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, YI-CHIEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江佩珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, PEI-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付　強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許正宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHENG-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許瑋倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, WEI-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史東威斯　尼可拉斯麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STONE-WEISS, NICHOLAS MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/673,895</doc-number>
          <date>20240722</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含生物活性玻璃之化妝品產品及組成物</chinese-title>
        <english-title>COSMETIC PRODUCTS AND COMPOSITIONS COMPRISING BIOACTIVE GLASS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案提供一種化妝品產品，其包含：經組態以容納化妝品組成物之容器；及經組態以至少部分封閉該容器的封閉組件；其中該化妝品組成物係安置於該容器內且包含：載體；及生物活性玻璃，該生物活性玻璃包含：15-55重量%的SiO&lt;sub&gt;2&lt;/sub&gt;；0.1-15重量%的ZrO&lt;sub&gt;2&lt;/sub&gt;；20-60重量%的CaO；及5-30重量%的P&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;。還提供一種用於製備該化妝品產品之方法，其包含將該化妝品組成物安置於該容器中且用該封閉組件至少部分封閉該容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cosmetic product, comprising: a vessel configured to contain a cosmetic composition; and a closing component configured to at least partially close the vessel; wherein the cosmetic composition is disposed within the vessel and comprises: a carrier; and a bioactive glass, comprising: 15-55 wt.% SiO&lt;sub&gt;2&lt;/sub&gt;; 0.1-15 wt.% ZrO&lt;sub&gt;2&lt;/sub&gt;; 20-60 wt.% CaO; and 5-30 wt.% P&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;5&lt;/sub&gt;. A method for preparing the cosmetic product comprises disposing the cosmetic composition into the vessel and at least partially closing the vessel with the closing component.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="667px" img-content="tif" inline="yes" orientation="portrait" width="758px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623651</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127566</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W42/80</main-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
        <further-classification edition="202501120260302B">H10D89/60</further-classification>
        <further-classification edition="202601120260302B">H10W70/65</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　鉦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李一明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣　航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, HUNT HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/791,387</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積體電路及其封裝中的導電連接器</chinese-title>
        <english-title>INTEGRATED CIRCUIT AND ITS PACKAGE WITH ELECTRICALLY CONDUCTIVE CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示了一種積體電路(Integrated Circuit，IC)及其封裝中的導電連接器。該IC包括導線框架、IC晶粒以及導電連接器。IC晶粒安裝在導線框架的第一部分上並具有連接到導線框架的第一部分的晶粒底面以及形成有第一接觸焊墊的晶粒頂面。導電連接器耦接在第一接觸焊墊與導線框架的第二部分之間，其中導電連接器包括連接器橋接部分，該連接器橋接部分具有與導電連接器的其餘部分相比減小的尺寸。該連接器橋接部分具有抬高部分，該抬高部分相對於IC的底面在豎直方向上高於導電連接器的其餘部分。當過大電流流過導電連接器的故障事件發生時，連接器橋接部分會熔化或燒毀以形成開路，從而給IC提供及時的保護，且無需額外成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit ("IC”) and its package with an electrically conductive connector are disclosed. The IC includes a lead frame, an IC bare die and the electrically conductive connector. The IC bare die is mounted on a first portion of the lead frame with a die bottom surface of the IC bare die attached to the first portion and a die top surface of the IC bare die having a first contact pad formed. The electrically conductive connector is coupled between the first contact pad and the second portion of the lead frame. The electrically conductive connector includes a connector bridging portion having a reduced size in comparison with a remainder of the electrically conductive connector. The connector bridging portion has an elevated portion being vertically higher than the remainder of the electrically conductive connector with reference to a bottom surface of the IC. When a fault event occurs in which a large current flows through the electrically conductive connector, the connector bridging portion is melt or blown up to form an open circuit, thereby providing timely protection for IC without additional cost.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">110:IC</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">IN:輸入接腳</p>
        <p type="p">OUT:輸出接腳</p>
        <p type="p">EN:致能接腳</p>
        <p type="p">GND:接地接腳</p>
        <p type="p">TS:溫度偵測接腳</p>
        <p type="p">Io:輸出電流</p>
        <p type="p">FUSE:類熔斷式保護接腳</p>
        <p type="p">Vfuse:熔斷電壓</p>
        <p type="p">C1:電容性元件</p>
        <p type="p">OLD:開路負載偵測接腳</p>
        <p type="p">VOUT:輸出電壓</p>
        <p type="p">VGND:接地電壓</p>
        <p type="p">FLT:故障指示接腳</p>
        <p type="p">R7:電阻性元件</p>
        <p type="p">VCS:電流偵測訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="785px" img-content="tif" inline="yes" orientation="portrait" width="803px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622053</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127571</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/12</main-classification>
        <further-classification edition="200601120260302B">C07D471/04</further-classification>
        <further-classification edition="200601120260302B">C07D487/04</further-classification>
        <further-classification edition="200601120260302B">C07D405/12</further-classification>
        <further-classification edition="200601120260302B">C07D417/12</further-classification>
        <further-classification edition="200601120260302B">C07D519/00</further-classification>
        <further-classification edition="200601120260302B">C07D413/14</further-classification>
        <further-classification edition="200601120260302B">C07D401/14</further-classification>
        <further-classification edition="200601120260302B">C07D491/048</further-classification>
        <further-classification edition="200601120260302B">C07D498/04</further-classification>
        <further-classification edition="200601120260302B">A61K31/4709</further-classification>
        <further-classification edition="200601120260302B">A61K31/4375</further-classification>
        <further-classification edition="200601120260302B">A61K31/5377</further-classification>
        <further-classification edition="200601120260302B">A61K31/517</further-classification>
        <further-classification edition="200601120260302B">A61K31/4985</further-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61K31/53</further-classification>
        <further-classification edition="200601120260302B">A61K31/5025</further-classification>
        <further-classification edition="200601120260302B">A61K31/5365</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商沃若諾伊公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VORONOI, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田鉉琥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, HYEONHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全國峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUAN, GUOFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔允夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YUNHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜惠瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HYESEUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張賢秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, HYUNSOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高利炅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, YIKYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺瑞賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, SEOHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李尹鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金大權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DAEKWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0096600</doc-number>
          <date>20240722</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>雜芳基衍生物化合物及其用途</chinese-title>
        <english-title>HETEROARYL DERIVATIVE COMPOUNDS, AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及雜芳基衍生化合物及其醫藥用途。本發明的雜芳基衍生物對c-MET激酶和c-MET突變細胞表現出優異的抑制活性，因此可以有效地用於預防或治療c-MET相關疾病。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a heteroaryl derivative compound and medicinal uses thereof. The heteroaryl derivative of the present invention exhibits excellent inhibitory activity against c-MET kinase and c-MET mutant cells, and thus can be effectively employed for the prevention or treatment of c-MET-related diseases.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622800</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127581</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">G06K7/10</main-classification>
        <further-classification edition="200601120260223B">G06K19/07</further-classification>
        <further-classification edition="202401120260223B">H04B5/77</further-classification>
        <further-classification edition="200601120260223B">H04L9/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英頻杰股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMPINJ, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪歐里歐　克里斯多夫　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIORIO, CHRISTOPHER J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬丁內斯　雷內　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTINEZ, RENE DOMINIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伯蕭　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBSHAW, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,226</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>從標籤回覆識別RFID標籤特徵之技術</chinese-title>
        <english-title>IDENTIFYING RFID TAG FEATURES FROM TAG REPLY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用以對一無線電IC之一製造商以及該無線電IC之一或多個特徵進行識別之方法。無線電IC可組配有至少兩種操作狀態。如果無線電IC處於一第一狀態，則無線電IC可憑藉與任何無線電IC資訊不相關之一衝突解決代碼來回應於盤點命令。如果無線電IC處於一第二狀態，則無線電IC可憑藉與一些無線電IC資訊相關、及使用對標籤及讀取器已知之一產生程序所運算之一特殊衝突解決代碼來回應於盤點命令。讀取器可接著發送一確認命令，且無線電IC可藉由向讀取器提供一識別符來回應。讀取器本身可使用該產生程序，並判斷特殊衝突解決代碼是否經正確運算，且如果經正確運算，則讀取器可確定無線電IC之製造商及/或特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method to identify a manufacturer of a radio IC and one or more features of the radio IC is provided. The radio IC may be configured with at least two operating states. If the radio IC is in a first state, then the radio IC may respond to inventorying commands with a collision-resolution code uncorrelated to any radio IC information. If the radio IC is in a second state, then the radio IC may respond to inventorying commands with a special collision-resolution code correlated to some radio IC information and computed using a generation process known to the tag and the reader. The reader may then send an acknowledgement command, and the radio IC may respond by providing an identifier to the reader. The reader may itself use the generation process and determine if the special collision-resolution code is correctly computed, and if so, the reader may be able to determine a manufacturer and/or features of the radio IC.</p>
      </isu-abst>
      <representative-img>
        <p type="p">802:步驟</p>
        <p type="p">804:步驟</p>
        <p type="p">806:步驟</p>
        <p type="p">808:步驟</p>
        <p type="p">810:步驟</p>
        <p type="p">812:步驟</p>
        <p type="p">814:步驟</p>
        <p type="p">816:步驟</p>
        <p type="p">818:步驟</p>
        <p type="p">820:步驟</p>
        <p type="p">822:步驟</p>
        <p type="p">824:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="932px" img-content="tif" inline="yes" orientation="portrait" width="737px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622076</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127604</doc-number>
          <kind></kind>
          <date>114/07/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D471/16</main-classification>
        <further-classification edition="200601120260302B">C07D471/06</further-classification>
        <further-classification edition="200601120260302B">C07D471/04</further-classification>
        <further-classification edition="200601120260302B">C07D519/00</further-classification>
        <further-classification edition="200601120260302B">C07D491/147</further-classification>
        <further-classification edition="200601120260302B">A61K31/444</further-classification>
        <further-classification edition="200601120260302B">A61K31/5025</further-classification>
        <further-classification edition="200601120260302B">A61K31/506</further-classification>
        <further-classification edition="200601120260302B">A61K31/437</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
        <further-classification edition="200601120260302B">A61P11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖華玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, HUALING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳國林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, GUOLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202410980405X</doc-number>
          <date>20240719</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024112689343</doc-number>
          <date>20240910</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2024114583432</doc-number>
          <date>20241017</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2024117540053</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>雜環羰基類衍生物調節劑、其製備方法和應用</chinese-title>
        <english-title>HETEROCYCLIC CARBONYL DERIVATIVE MODULATORS, THEIR PREPARATION METHODS AND APPLICATIONS THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及雜環羰基類衍生物調節劑、其製備方法和應用。特別地，本發明涉及通式( VIII-1A )所示的化合物、其製備方法及含有該化合物的藥物組合物，及其作為調節劑在治療阿爾茨海默病、精神分裂症、疼痛、成癮和睡眠障礙中的用途，其中通式( VIII-1A )中的各取代基與說明書中的定義相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to heterocyclic carbonyl derivative modulators, their preparation methods, and applications thereof. In particular, the present invention relates to compounds represented by a general formula (VIII-1A), their preparation methods, and pharmaceutical compositions containing the compounds, as well as their uses as modulators in the treatment of Alzheimer's disease, schizophrenia, pain, addiction, and sleep disorders. The substituents in the general formula (VIII-1A) have the same definitions as in the specification.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621740</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127623</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120260302B">A61K47/54</main-classification>
        <further-classification edition="200601120260302B">A61K31/7028</further-classification>
        <further-classification edition="200601120260302B">A61K31/203</further-classification>
        <further-classification edition="200601120260302B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>至善生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASTERY BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林伯霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, BO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顏畿府</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEN, CHI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳孚竹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/673,859</doc-number>
          <date>20240722</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>預防或治療神經退化性疾病的組成物及方法</chinese-title>
        <english-title>COMPOSITION AND METHOD FOR PREVENTING OR TREATING NEURODEGENERATIVE DISEASES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供用於預防或治療神經退化性疾病的方法。本揭露亦提供組成物用於預防或治療神經退化性疾病的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are methods for prevention or treatment of neurodegenerative diseases. Also provided are compositions for use in preventing or treating neurodegenerative diseases.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="698px" img-content="tif" inline="yes" orientation="portrait" width="820px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623433</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127644</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202501120260302B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　世海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEONG, SAI HOOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科斯特里尼　葛雷戈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COSTRINI, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕爾　阿希什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAL, ASHISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維亞斯　普拉蒂克Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VYAS, PRATIK B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博薩勒　普拉薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHOSALE, PRASAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴斯克　維拉拉格萬Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASKER, VEERARAGHAVAN S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴吉吉　艾爾梅蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAZIZI, EL MEHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥倫布　班傑明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLOMBEAU, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普蘭薩西哈蘭　巴拉薩拉瑪年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRANATHARTHIHARAN, BALASUBRAMANIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/683,894</doc-number>
          <date>20240816</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/727,775</doc-number>
          <date>20241204</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電晶體雙層介電壁</chinese-title>
        <english-title>TRANSISTOR BILAYER DIELECTRIC WALL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了具有雙層介電壁的半導體裝置，例如GAA、FinFET、CFET。形成半導體裝置的方法在淺溝槽隔離(STI)的形成期間形成雙層介電壁。雙層介電壁的第一或襯墊介電層經設計為允許第二或核心介電層承受下游蝕刻並在源極/汲極磊晶區域形成之前移除。在一些實施例中，核心介電層經移除以形成氣隙，從而減輕與雙層介電壁相關聯的效能損失。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described are semiconductor devices, e.g., GAA, FinFET, CFET, having a bilayer dielectric wall. Methods of forming a semiconductor device form a bilayer dielectric wall during the formation of the shallow trench isolation (STI). The first or liner dielectric layer of the bilayer dielectric wall is designed to allow the second or core dielectric layer to withstand downstream etching and to be removed prior to formation of the source/drain epitaxial regions. In some embodiments, the core dielectric layer is removed to form an airgap, mitigating the performance penalty associated with the bilayer dielectric wall.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:基板</p>
        <p type="p">206:半導體材料層</p>
        <p type="p">212:外部或襯墊介電層</p>
        <p type="p">214:凹陷區域/氣隙</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10072.JPG" file="ed10072.JPG" height="358px" img-content="tif" inline="yes" orientation="portrait" width="358px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623034</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127655</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H01J37/305</main-classification>
        <further-classification edition="200601120260223B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾巴　索娜姆多爾吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHERPA, SONAM DORJE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加西亞德哥羅多　艾拉羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARCIA DE GORORDO, ALVARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利夫曼　格烏斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REEFMAN, GUUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉維　桑卡納拉亞南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVI, SANKARANARAYANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁子昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, ZIHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭詹　亞洛克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANJAN, ALOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳川匠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGAWA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/US24/41500</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於反應性離子蝕刻的負載蝕刻效應緩解</chinese-title>
        <english-title>LOADING ETCH EFFECT MITIGATION FOR REACTIVE ION ETCHING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">蝕刻基板的方法包括在給定頻率下脈衝化RF電力以產生電漿來蝕刻基板，其中每個脈衝週期具有包括工作週期的ON狀態和OFF狀態，至少部分基於重新引燃電漿的第一持續時間、為提供RF電力的RF給定電源的最低開啟時間的第二持續時間，以及電漿達到穩定狀態的第三持續時間來選擇工作週期的ON狀態持續時間，為每個脈衝週期選擇工作週期的OFF狀態持續時間，以改變與要在基板上形成的特徵相關的剖面負載、均勻密度深度負載或臨界尺寸（CD）負載蝕刻效應，並藉由使用RF電力的工作週期來蝕刻基板以形成該特徵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for etching a substrate includes pulsing an RF power at a given frequency to generate a plasma for etching the substrate where each pulse period has an ON-state and an OFF-state comprising a duty cycle, selecting an ON-state duration of the duty cycle based on, at least in part, a first duration for restriking the plasma, a second duration for a minimum on-time per a given RF power source providing the RF power, and a third duration for the plasma to reach a steady state, selecting an OFF-state duration of the duty cycle for each pulse period to alter a profile loading, a iso-dense depth loading, or a critical dimension (CD) loading etching effect associated with a feature to be formed on the substrate, and forming the feature by using the duty cycle for the RF power to etch the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1200:視圖</p>
        <p type="p">1202:電感耦合電漿(ICP)腔室</p>
        <p type="p">1204:基板支撐</p>
        <p type="p">1206:基板</p>
        <p type="p">1210:線圈組</p>
        <p type="p">1212:氣體供應</p>
        <p type="p">1214:直徑</p>
        <p type="p">1216:RF電源</p>
        <p type="p">1218:匹配網路</p>
        <p type="p">1220:一個偏壓電源</p>
        <p type="p">1222:第二匹配網路</p>
        <p type="p">1224:真空泵</p>
        <p type="p">1226:流動方向</p>
        <p type="p">1228:製程空間</p>
        <p type="p">1230:控制器</p>
        <p type="p">1232:中央處理單元(CPU)</p>
        <p type="p">1234:記憶體</p>
        <p type="p">1236:支援電路</p>
        <p type="p">1240:電漿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="602px" img-content="tif" inline="yes" orientation="portrait" width="734px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622475</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127721</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">G01L19/08</main-classification>
        <further-classification edition="202201120260225B">G01F15/06</further-classification>
        <further-classification edition="200601120260225B">C23C16/455</further-classification>
        <further-classification edition="200601120260225B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴巴爾　猶佳斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BABBAR, YOGESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷耶斯　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REYES, JORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安琪拉　德　拉　羅莎　莫內羅　阿馬里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANGELA DE LA ROSA-MORENO, AMARIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊茵尼斯　克里斯蒂安　卡瓦拉羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHEINISCH, CRISTIAN CAVALLERO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥　約書亞　納撒尼爾　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAK, JOSHUA NATHANIEL ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,126</doc-number>
          <date>20240724</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>噴淋頭計量及處理站</chinese-title>
        <english-title>SHOWERHEAD METROLOGY AND PROCESSING STATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">此處揭露一種方法及設備，用以在一噴淋頭面板之中偵測孔口的阻塞物。該設備至少包含：一龍門系統；一感測器陣列，機械耦接至該龍門系統；及一噴淋頭安裝夾具。該龍門系統係可操作以使該感測器陣列掃描在該噴淋頭的面板上方，其中該面板包含多數個孔口。該龍門系統係可操作以將該感測器陣列定位在該多數個孔口的個別孔口上方，以測量通過一個以上孔口的一測試氣體的流速，取得具有明顯的阻塞物之孔口的擴大影像，及測量該噴淋頭的靜態內壓力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein is a method and apparatus to detect blockage of holes in a showerhead faceplate. The apparatus comprises at minimum a gantry system, a sensor array mechanically coupled to the gantry system, and a showerhead mounting fixture. The gantry system is operable to scan the sensor array over the faceplate of the showerhead, where the faceplate comprises a plurality of holes. The gantry system is operable to position the sensory array over individual holes of the plurality of holes to measure a flow velocity of a test gas passing through one or more holes, obtain enlarged images of holes having apparent blockage, and measure static internal pressure of the showerhead.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:噴淋頭</p>
        <p type="p">102:面板</p>
        <p type="p">114:孔口</p>
        <p type="p">116:表面</p>
        <p type="p">200:噴淋頭檢查設備</p>
        <p type="p">202:感測器陣列</p>
        <p type="p">204:龍門系統</p>
        <p type="p">205:噴淋頭安裝夾具</p>
        <p type="p">206:測試氣體導管</p>
        <p type="p">208:計算系統</p>
        <p type="p">210:馬達驅動電路</p>
        <p type="p">212:驅動馬達</p>
        <p type="p">213:全域相機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="912px" img-content="tif" inline="yes" orientation="portrait" width="723px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623364</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127730</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260224B">H10B51/20</main-classification>
        <further-classification edition="202301120260224B">H10B51/30</further-classification>
        <further-classification edition="202301120260224B">H10B53/30</further-classification>
        <further-classification edition="202301120260224B">H10B63/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻沙羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, SARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/784,018</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有金屬氧化物側壁間隔物之鐵電裝置的形成方法</chinese-title>
        <english-title>METHODS OF FORMING FERROELECTRIC DEVICES WITH METAL OXIDE SIDEWALL SPACERS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置的形成方法包括：形成圖案化堆疊，該圖案化堆疊包括沉積在基板上的第一電極層、設置在第一電極層上的鐵電材料層以及設置在鐵電材料層上的硬遮罩層；沿圖案化堆疊的側壁形成側壁間隔物，該側壁間隔物包括金屬氧化物；相對於硬遮罩層選擇性地蝕刻該側壁間隔物，以曝露鐵電材料層的側壁的一部分；以及在去除該硬遮罩層後，在鐵電材料層上沉積第二電極層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of forming an electronic device includes forming a patterned stack including a first electrode layer deposited over a substrate, a ferroelectric material layer disposed over the first electrode layer, and a hard mask layer disposed over the ferroelectric material layer; forming a sidewall spacer along a sidewall of the patterned stack, the sidewall spacer including a metal oxide; etching the sidewall spacer selectively relative to the hard mask layer to expose a portion of a sidewall of the ferroelectric material layer; and depositing a second electrode layer over the ferroelectric material layer after removing the hard mask layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">302:基板</p>
        <p type="p">304:電極層</p>
        <p type="p">306:鐵電材料層</p>
        <p type="p">316:蝕刻間隔物</p>
        <p type="p">320:介電材料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="306px" img-content="tif" inline="yes" orientation="portrait" width="471px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622256</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127733</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">C22B1/16</main-classification>
        <further-classification edition="200601120260102B">C22B1/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＦＥ鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤原慎平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIWARA, SHIMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩見友司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMI, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-203746</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>燒結礦之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種燒結礦之製造方法，其係即使在為了減低二氧化碳之排出量而對燒結原料混合PKS炭，又，為了提升總Fe量而對燒結原料混合精礦的情況，仍可提升燒結原料之造粒性。  &lt;br/&gt;　　一種燒結礦之製造方法，其具有：摻合鐵原料與包含第1炭材及第2炭材之固體炭材並一同進行造粒來製造燒結原料的原料摻合步驟(階段S101)、將燒結原料供給至燒結機之棧板上而形成原料層的原料層形成步驟(階段S102)，及，在原料層之上面點火進行燒成來製造燒結礦的燒結步驟(階段S103)，其中原料摻合步驟(階段S101)中，摻合棕櫚殼炭作為第1炭材，摻合源自化石燃料之炭材作為第2炭材，且棕櫚殼炭之算術平均粒徑小於第2炭材之算術平均粒徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="552px" img-content="tif" inline="yes" orientation="portrait" width="414px">
          </img>
        </representative>
      </representative-img>
    </description>
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  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622737</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127740</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G06F11/07</main-classification>
        <further-classification edition="201901120260226B">G06F16/9032</further-classification>
        <further-classification edition="201901120260226B">G06F16/9038</further-classification>
        <further-classification edition="201301120260226B">G06F3/0482</further-classification>
        <further-classification edition="201301120260226B">G06F3/0483</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛雷斯　布里奇特　希爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FREESE, BRIDGET HILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特扎　科爾　傑弗裡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEZA, COLE JEFFREY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩德雷諾　瓦萊麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEDRENO, VALERIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅葛森　克利斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THORGRIMSSON, CHRIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,769</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理系統之錯誤復原系統</chinese-title>
        <english-title>ERROR RECOVERY SYSTEM FOR SUBSTRATE PROCESSING SYSTEMS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板處理工具之錯誤復原系統包含處理器以及儲存指令的非暫時性記憶體。該系統在顯示基板處理工具中的錯誤的GUI上顯示復原助理按鈕；回應於復原助理按鈕的啟動，從資料庫中提取與該錯誤相關的資料；藉由分析該資料產生指示該錯誤的根本原因的診斷報告；在GUI上顯示指示該錯誤的根本原因的診斷報告；產生一組步驟以基於根本原因從該錯誤中復原；在GUI上顯示這組步驟；在GUI上自動地、互動地或使用其組合的方式執行至少部分的這組步驟；並且執行複數復原選項中的一復原選項，以將基板處理工具置於正常操作狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An error recovery system for a substrate processing tool includes a processor and non-transitory memory storing instructions. The system displays a recovery assistant button on a GUI that displays an error in the substrate processing tool; and in response to activation of the recovery assistant button, retrieves data relevant to the error from a database; generates a diagnostic report indicating a root cause of the error by analyzing the data; displays the diagnostic report indicating the root cause of the error on the GUI; generates a set of steps to recover from the error based on the root cause; display the set of steps on the GUI; executes at least portions of the set of steps automatically, interactively, or using a combination thereof on the GUI; and executes a recovery option from a plurality of recovery options to place the substrate processing tool in normal operating condition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">R1、R2:機器人</p>
        <p type="p">100:工具</p>
        <p type="p">102-1~102-8:製程模組(PM)</p>
        <p type="p">104:真空搬運模組(VTM)</p>
        <p type="p">108:緩衝器</p>
        <p type="p">110-1~110-8:氣體箱、電源供應器和冷卻系統</p>
        <p type="p">120-1、120-2:氣閘</p>
        <p type="p">130:裝載埠模組(LPM)</p>
        <p type="p">132:前開式晶圓搬運盒</p>
        <p type="p">134:設備前端模組(EFEM)</p>
        <p type="p">138:電力鎖定掛牌(LOTO)組合件</p>
        <p type="p">150:系統控制器</p>
        <p type="p">152:顯示器</p>
        <p type="p">160:錯誤復原模組、復原助理</p>
        <p type="p">170:GUI</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="726px" img-content="tif" inline="yes" orientation="portrait" width="976px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621693</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127746</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/5377</main-classification>
        <further-classification edition="200601120260302B">A61P3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商律森製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHYTHM PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格魯吉克　丹尼卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRUJIC, DANICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西米亞　瑪麗亞　塞西莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCIMIA, MARIA CECILIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,234</doc-number>
          <date>20240722</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/840,590</doc-number>
          <date>20250708</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於處置下視丘肥胖的化合物</chinese-title>
        <english-title>COMPOUNDS FOR THE TREATMENT OF HYPOTHALAMIC OBESITY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供用MC4R促效劑處置非遺傳性肥胖及/或後天性肥胖及相關病症(例如，下視丘肥胖)之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods for treating non-genetic obesity and/or acquired obesity and related disorders (e.g., hypothalamic obesity) with an MC4R agonist.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="561px" img-content="tif" inline="yes" orientation="portrait" width="967px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622997</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127751</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260302B">G16H50/30</main-classification>
        <further-classification edition="201801120260302B">G16H20/00</further-classification>
        <further-classification edition="200601120260302B">G01N21/77</further-classification>
        <further-classification edition="200601120260302B">G01N33/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商優利亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUUREA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水野将吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUNO, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤憲司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山慎太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OYAMA, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-117189</doc-number>
          <date>20240722</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用尿液檢驗套件的身體狀態評估方法、身體狀態評估系統及身體狀態評估程式以及用於其中的尿液檢驗套件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種身體狀態評估方法，其使用預定的尿液檢驗套件，迅速且簡便地解析受試者身體狀態，並能將尿液檢驗所獲得的資訊活用於各個領域。  &lt;br/&gt;　　[解決手段]其特徵在於，具有使配設於預定尿液檢驗套件的反應墊接觸受試者尿液的步驟、以攝像手段拍攝前述反應墊的步驟、基於拍攝的前述墊的影像進行前述尿液的解析的步驟、以及從前述解析的結果評估前述受試者身體狀態的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">ES:外部伺服器</p>
        <p type="p">H:受試者端末</p>
        <p type="p">N:網路</p>
        <p type="p">SV:身體狀態評估伺服器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="516px" img-content="tif" inline="yes" orientation="portrait" width="702px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623197</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127783</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H03H3/02</main-classification>
        <further-classification edition="200601120260224B">H03H9/02</further-classification>
        <further-classification edition="200601120260224B">H03H9/13</further-classification>
        <further-classification edition="200601120260224B">H03H9/17</further-classification>
        <further-classification edition="200601120260224B">H03H9/205</further-classification>
        <further-classification edition="200601120260224B">H03H9/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科沃美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QORVO US, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛格　薩賈爾薩戈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SAJAL SAGAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆達雷斯扎達　穆罕默德Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MODARRES-ZADEH, MOHAMMAD J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,480</doc-number>
          <date>20240723</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/US25/37293</doc-number>
          <date>20250711</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於ＢＡＷ裝置之導電布拉格反射器中的ＥＳＤ保護層</chinese-title>
        <english-title>ESD PROTECTION LAYER IN ELECTRICALLY CONDUCTIVE BRAGG REFLECTOR FOR BAW DEVICES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於一種具有靜電放電（ESD）保護之體聲波（BAW）裝置。所揭露之BAW裝置包括一基板、該基板上方之一ESD保護層、該ESD保護層上方之一第一底反射器、該第一底反射器上方之一第一底電極、與該第一底電極豎直地對準之一第一頂電極及豎直地位於該第一底電極與該第一頂電極之間的一壓電層。在本文中，該ESD保護層為電絕緣的且符合在一200 nm厚度下達成至少一400 V崩潰電壓之條件。該第一底反射器包括交替的高聲阻抗傳導層及低聲阻抗傳導層之一堆疊。該第一底電極電連接至該第一底反射器。該壓電層之一崩潰電壓不超過該ESD保護層之該崩潰電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a bulk acoustic wave (BAW) device with electrostatic discharge (ESD) protection. The disclosed BAW device includes a substrate, an ESD protection layer over the substrate, a first bottom reflector over the ESD protection layer, a first bottom electrode over the first bottom reflector, a first top electrode vertically aligned with the first bottom electrode, and a piezoelectric layer vertically between the first bottom electrode and the first top electrode. Herein, the ESD protection layer is electrically insulating and eligible to achieve at least a 400 V breakdown voltage with a 200 nm thickness. The first bottom reflector includes a stack of alternating high acoustic impedance conductive layers and low acoustic impedance conductive layers. The first bottom electrode is electrically connected to the first bottom reflector. A breakdown voltage of the piezoelectric layer is no more than the breakdown voltage of the ESD protection layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621689</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127784</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/519</main-classification>
        <further-classification edition="200601120260302B">A61P7/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商普林斯匹亞生物製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRINCIPIA BIOPHARMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍里錫　克萊兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANGRISH, CLAIRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑟歐朵　琳賽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THEODORE, LINDSAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史托雷克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOREK, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CZ</english-country>
              <english-address>CZ</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼可拉森　菲利浦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICOLSON, PHILLIP R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>華森　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATSON, STEVE P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　克里斯托福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, CHRISTOPHER W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱漢　阿布海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUAHAN, ABHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,533</doc-number>
          <date>20240723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>藉由投與特定化合物減少靜脈血栓形成之方法</chinese-title>
        <english-title>METHODS OF REDUCING VENOUS THROMBOSIS BY ADMINISTERING SPECIFIC COMPOUNDS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了涉及用某些BTK抑制劑和/或其醫藥上可接受的鹽抑制CLEC-2和治療靜脈血栓形成之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods related to inhibiting CLEC-2 and treating venous thrombosis with certain BTK inhibitors and/or pharmaceutically acceptable salts thereof are provided.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10030.JPG" file="ed10030.JPG" height="755px" img-content="tif" inline="yes" orientation="portrait" width="793px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621678</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127787</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/17</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商藍騰製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANTERN PHARMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴蒂亞　基紹爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHATIA, KISHOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫爾卡尼　阿迪亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULKARNI, ADITYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　建利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU,JIANLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,475</doc-number>
          <date>20240723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>以免疫療法與醯基富烯之組合來治療三陰性乳癌(TNBC)</chinese-title>
        <english-title>TREATING TRIPLE NEGATIVE BREAST CANCER (TNBC) WITH COMBINATIONS OF IMMUNOTHERAPY AND ACYLFULVENES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示提供一種用於治療三陰性乳癌(TNBC)的組合方案及組成物。對有需要的受試者投與一治療有效量的羥基脲甲基醯基富烯及一治療有效量的免疫療法，如PD-1或PD-L1檢查點抑制劑。還揭示一種含有該醯基富烯、該免疫療法組分或兩者與藥學上可接受的載劑混合的藥學組成物及套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides combination regimens and compositions for the treatment of triple‑negative breast cancer (TNBC). A subject in need thereof is administered a therapeutically effective amount of hydroxyureamethyl acylfulvene and a therapeutically effective amount of an immunotherapy such as a PD‑1 or PD‑L1 checkpoint inhibitor. Also disclosed are pharmaceutical compositions and kits containing the acylfulvene, the immunotherapy component, or both in admixture with pharmaceutically acceptable carriers.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622082</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127799</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D491/20</main-classification>
        <further-classification edition="200601120260302B">C07D498/14</further-classification>
        <further-classification edition="200601120260302B">C07D487/14</further-classification>
        <further-classification edition="200601120260302B">C07D519/00</further-classification>
        <further-classification edition="200601120260302B">A61K31/506</further-classification>
        <further-classification edition="200601120260302B">A61K31/5386</further-classification>
        <further-classification edition="200601120260302B">A61K31/553</further-classification>
        <further-classification edition="200601120260302B">A61K31/5513</further-classification>
        <further-classification edition="200601120260302B">A61K31/4709</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張志高</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHIGAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳露</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉柏年</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, BONIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024109813222</doc-number>
          <date>20240722</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024113827853</doc-number>
          <date>20240930</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2024116739924</doc-number>
          <date>20241121</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2025101100984</doc-number>
          <date>20250123</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>2025104995958</doc-number>
          <date>20250421</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>四環化合物、其製備方法及其在醫藥上的應用</chinese-title>
        <english-title>TETRACYCLIC COMPOUND, A PREPARATION METHOD THEREOF AND A MEDICAL USE THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及四環化合物、其製備方法及其在醫藥上的應用。具體而言，本揭露涉及一種通式(I)所示的四環化合物、其製備方法及含有該四環化合物的醫藥組成物以及其作為治療劑的用途，特別是作為BCL6抑制劑或降解劑的用途和在製備用於治療和/或預防BCL6介導的或依賴性的疾病或病症的藥物中的用途。其中通式(I)中各基團如說明書中所定義。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="164px" width="479px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a tetracyclic compound, a preparation method thereof and a medical use thereof. In particular, the present disclosure relates to a tetracyclic compound shown in general formula (I), its preparation method, a pharmaceutical composition containing such tetracyclic compound and its use as a therapeutic agent, especially as a BCL6 inhibitor or degrader, and its use in the preparation of a medicament for the treatment and/or prevention a disease or condition. Wherein each group in the general formula (I) is as defined in the specification.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="164px" width="443px" file="d10003.TIF" alt="化學式ed10003.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10003.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623356</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127807</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260225B">H10B12/00</main-classification>
        <further-classification edition="202501120260225B">H10D84/83</further-classification>
        <further-classification edition="202501120260225B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUN HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金廷奐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNG-HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裵泰彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAE, TAE-EON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安皓均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, HO KYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹姬周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, HEE JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李佶運</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, GIL WOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭天炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHUN HYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0105890</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體裝置。所述半導體裝置包括：基板；主動區，設置於基板上或基板中；閘極介面膜，與主動區接觸；介電膜結構，設置於閘極介面膜上且包含金屬矽氧化物；閘極電極，位於介電膜結構上；以及源極/汲極圖案，設置於閘極電極的兩個側上。介電膜結構包含摻雜至金屬矽氧化物的雜質元素，介電膜結構包括第一介電膜區及第二介電膜區，且第一介電膜區的矽濃度大於第二介電膜區的矽濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The semiconductor device comprises a substrate, an active region disposed on or in the substrate, a gate interface film which is in contact with the active region, a dielectric film structure which is disposed on the gate interface film, and includes a metal silicon oxide, a gate electrode on the dielectric film structure, and a source/drain pattern which is disposed on both sides of the gate electrode. The dielectric film structure includes an impurity element doped to the metal silicon oxide, the dielectric film structure includes a first dielectric film region and a second dielectric film region, and a concentration of silicon of the first dielectric film region is greater than the concentration of silicon of the second dielectric film region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:閘極介面膜</p>
        <p type="p">207:介電膜結構</p>
        <p type="p">207B:第二表面</p>
        <p type="p">207U:第一表面</p>
        <p type="p">301:閘極電極</p>
        <p type="p">301B:下表面</p>
        <p type="p">ACT:主動區</p>
        <p type="p">P1、R1、R2:區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10041.JPG" file="ed10041.JPG" height="634px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623530</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127810</doc-number>
          <kind></kind>
          <date>114/07/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/20</main-classification>
        <further-classification edition="202601120260302B">H10P50/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科羅拉多大學董事會　法人團體</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE REGENTS OF THE UNIVERSITY OF COLORADO, A BODY CORPORATE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞斯敏　蘇美拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASMEEN, SUMAIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
              <english-address>PK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬治　史蒂文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEORGE, STEVEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席姆卡　哈索諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMKA, HARSONO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
              <english-address>ID</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,633</doc-number>
          <date>20240723</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/275,028</doc-number>
          <date>20250721</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於對膜進行電子增強型化學氣相蝕刻的方法</chinese-title>
        <english-title>METHOD FOR ELECTRON-ENHANCED CHEMICAL VAPOR ETCHING OF FILM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於對薄膜進行蝕刻的方法，包括：利用至少一種反應性背景氣體及電子進行電子增強型化學氣相蝕刻，以利用正基板電壓對位於基板上的薄膜進行蝕刻。在實施例中，所述方法是用於對矽薄膜進行蝕刻的方法，對矽薄膜進行蝕刻的方法包括利用至少一種反應性背景氣體及電子進行電子增強型化學氣相蝕刻，以利用正基板電壓對位於基板上的矽薄膜進行蝕刻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for etching a thin film includes conducting electron-enhanced chemical vapor etching with at least one reactive background gas and electrons to etch a thin film on a substrate with a positive substrate voltage. In an embodiment, the method is a method for etching a silicon thin film, including conducting electron-enhanced chemical vapor etching with at least one reactive background gas and electrons to etch a silicon thin film on a substrate with a positive substrate voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10、S20、S30、S40、S50:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10071.JPG" file="ed10071.JPG" height="766px" img-content="tif" inline="yes" orientation="portrait" width="488px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621933</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127828</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251023B">B62K21/02</main-classification>
        <further-classification edition="200601120251023B">B62K21/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商福克斯制造有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOX FACTORY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝克　威廉　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BECKER, WILLIAM M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉爾伯特　達蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILBERT, DAMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/720,875</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/226,990</doc-number>
          <date>20250603</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有空氣彈簧總成之倒置避震叉</chinese-title>
        <english-title>INVERTED SUSPENSION FORK WITH AIR SPRING ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種避震系統包括：一上管；一下管，下管與上管可滑動地接合；及一空氣彈簧總成，空氣彈簧總成設置於下管內。空氣彈簧總成包括：一空氣活塞，空氣活塞定位於一缸內，缸配置以保持一定量之浴油；一空氣入口，空氣入口定位於缸之一下端上；一延伸管，延伸管與空氣入口連通；及一空氣出口口孔，空氣出口口孔在延伸管上定位於浴油之一最大填充量上方的一位置處。避震系統在一倒置叉配置中提供改良之空氣彈簧效能及潤滑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A suspension system includes an upper tube, a lower tube slidably engaged with the upper tube, and an air spring assembly disposed within the lower tube. The air spring assembly comprises an air piston positioned within a cylinder configured to retain an amount of bath oil, an air inlet positioned on a lower end of the cylinder, an extension tube in communication with the air inlet, and an air exit aperture positioned on the extension tube at a location above a maximum fill amount of the bath oil. The suspension system provides improved air spring performance and lubrication in an inverted fork configuration.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:倒置避震叉</p>
        <p type="p">103a:管/上管/第一上管</p>
        <p type="p">103b:管/上管/第二上管</p>
        <p type="p">106a:管/下管/第一下管</p>
        <p type="p">106b:管/下管/第二下管</p>
        <p type="p">109:舵管</p>
        <p type="p">112:冠部</p>
        <p type="p">121:阻尼器總成</p>
        <p type="p">124:空氣彈簧總成</p>
        <p type="p">127:正空氣腔室</p>
        <p type="p">130:負空氣腔室</p>
        <p type="p">133a:壓縮調整器</p>
        <p type="p">133b:頂蓋</p>
        <p type="p">136a,136b:上襯套</p>
        <p type="p">139a,139b:下襯套</p>
        <p type="p">142:空氣活塞</p>
        <p type="p">145:軸桿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="1037px" img-content="tif" inline="yes" orientation="portrait" width="566px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623027</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127847</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01J37/04</main-classification>
        <further-classification edition="200601120260224B">H01J37/12</further-classification>
        <further-classification edition="200601120260224B">H01J37/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>文斯特拉　羅伊　拉蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VEENSTRA, ROY RAMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆德列斯夫　迪米崔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUDRETSOV, DMITRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
              <english-address>RU</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特格曼　阿爾穆特　約翰娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEGEMANN, ALMUT JOHANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克雷辛尼克　法魯克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRECINIC, FARUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫柏　芬森特　席爾菲斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUIPER, VINCENT SYLVESTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24190998.5</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>帶電粒子光學元件、帶電粒子光學裝置、及製造電極之方法</chinese-title>
        <english-title>CHARGED PARTICLE-OPTICAL ELEMENT, CHARGED PARTICLE-OPTICAL DEVICE AND METHODS OF MANUFACTURING ELECTRODES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種帶電粒子光學元件，其包含一第一電極及一第二電極，各電極具有經組態及配置以使一射束柵格陣列之個別細射束穿過該帶電粒子光學元件的複數個孔徑，其中  &lt;br/&gt;該第一電極具有一第一電極表面，該第一電極表面具有形成有該複數個孔徑之一第一彎曲區，該第一彎曲區在兩個維度上彎曲；  &lt;br/&gt;該第二電極具有一第二電極表面，該第二電極表面具有形成有該複數個孔徑之一第二彎曲區，該第二彎曲區在兩個維度上彎曲；  &lt;br/&gt;該第一彎曲區與該第二彎曲區面向彼此以形成具有一實質上恆定寬度之一間隙；且  &lt;br/&gt;該第二電極具有在與該第二電極表面相對側之一第三電極表面，且該第三電極表面為實質上平坦的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charged particle-optical element comprising a first electrode and a second electrode, each having a plurality of apertures configured and arranged for passing individual beamlets of a beam grid array through the charged particle-optical element, wherein &lt;br/&gt;the first electrode has a first electrode surface having a first curved region in which the plurality of apertures is formed, the first curved region being curved in two dimensions; &lt;br/&gt;the second electrode has a second electrode surface having a second curved region in which the plurality of apertures is formed, the second curved region being curved in two dimensions; &lt;br/&gt;the first curved region and second curved region face each other to form a gap having a substantially constant width; and &lt;br/&gt;the second electrode has a third electrode surface on the opposite side to the second electrode surface and the third electrode surface is substantially planar.</p>
      </isu-abst>
      <representative-img>
        <p type="p">211:初級射束(子射束、細射束)</p>
        <p type="p">301:第一電極</p>
        <p type="p">302:第二電極</p>
        <p type="p">303:第三電極</p>
        <p type="p">304,305,306:孔徑</p>
        <p type="p">307:第三彎曲區</p>
        <p type="p">308:第一彎曲區</p>
        <p type="p">309:第二彎曲區</p>
        <p type="p">310:平坦區</p>
        <p type="p">311:頂表面</p>
        <p type="p">312:底表面</p>
        <p type="p">313,314:等電位表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="433px" img-content="tif" inline="yes" orientation="portrait" width="708px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623244</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127865</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">H04N1/031</main-classification>
        <further-classification edition="200601120251103B">H04N1/193</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商維納科斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIENEX CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤章人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207212</doc-number>
          <date>20241128</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-090929</doc-number>
          <date>20250530</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學線感測器</chinese-title>
        <english-title>OPTICAL LINE SENSOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠有效地防止雜散光入射到各受光元件陣列的光學線感測器。多個受光透鏡（111）沿著主掃描方向配置為線狀，使來自被照明的對象物的光透過。在孔徑部件（113）形成有供透過所述多個受光透鏡（111）後的光分別通過的多個開口（113E）。多個受光元件構成與多個開口（113E）對應地分別沿著主掃描方向延伸的多個受光元件陣列（12）。在孔徑部件（113）與多個受光元件陣列（12）之間設置有遮光塊（114），所述遮光塊（114）用於阻止通過與各受光元件陣列（12）所對應的開口（113E）相鄰的開口（113E）後的光侵入各受光元件陣列（12）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:受光元件陣列</p>
        <p type="p">13:基板</p>
        <p type="p">111、1111、1112:受光透鏡</p>
        <p type="p">113、1131、1132:孔徑部件</p>
        <p type="p">113E:開口</p>
        <p type="p">113F:遮光膜</p>
        <p type="p">114、1141、1142:遮光塊</p>
        <p type="p">121、122:受光元件陣列</p>
        <p type="p">X、Y、Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10054.JPG" file="ed10054.JPG" height="546px" img-content="tif" inline="yes" orientation="portrait" width="658px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623046</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127885</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥斯　亞當　克利斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACE, ADAM CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲利普斯　彼得　布拉德利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHILLIPS, PETER BRADLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,568</doc-number>
          <date>20240723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有浮接節段的分段式電極用的阻隔封件</chinese-title>
        <english-title>BARRIER SEALS FOR SEGMENTED ELECTRODES WITH FLOATING SEGMENTS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種阻隔封件，建構以密封一電漿處理系統的一分段式電極的相鄰節段，該阻隔封件包含：一環形體，由一抗電漿材料製成。該環形體在一平面之中周向延伸且包括：一底部部分，平行於該平面而延伸；一第一支腳，相對於垂直於該平面的一線以第一角度自該底部部分延伸；一第二支腳，相對於垂直於該平面的一線以第二角度自該底部部分延伸；及一環形凹槽，界定在該第一支腳與該第二支腳之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A barrier seal configured to seal adjacent segments of a segmented electrode of a plasma processing system includes an annular body made of a plasma resistant material. The annular body extends circumferentially in a plane and includes a bottom portion extending parallel to the plane, a first leg extending from the bottom portion at a first angle relative to a line perpendicular to the plane, a second leg extending from the bottom portion at a second angle relative to a line perpendicular to the plane, and an annular groove defined between the first leg and the second leg.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1010:阻隔封件</p>
        <p type="p">1012:環形體</p>
        <p type="p">1014,1016:臂</p>
        <p type="p">1018:環形凹槽</p>
        <p type="p">1020:內表面</p>
        <p type="p">1022,1028:表面</p>
        <p type="p">1024:基部部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="349px" img-content="tif" inline="yes" orientation="portrait" width="372px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622999</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127892</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01B1/02</main-classification>
        <further-classification edition="200601120260302B">H01B5/14</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/10</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="200601120260302B">C23C16/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇佐美太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USAMI, TARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久野達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUNO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-203761</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2025/015620</doc-number>
          <date>20250422</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>栓塞以及半導體製造設備用零件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">栓塞55包括為絕緣性且緻密質的栓塞主體56、從栓塞主體56的下部貫通而在上表面開口並且當俯視時其一部分作為凹部而露出於表面的氣體流路57、以及連接於氣體流路57中前述凹部的壁面以及栓塞主體的上表面而形成的栓塞導電膜58。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:陶瓷板</p>
        <p type="p">27:凹部</p>
        <p type="p">55:栓塞</p>
        <p type="p">56:栓塞主體</p>
        <p type="p">57:氣體流路</p>
        <p type="p">57a:表面凹部</p>
        <p type="p">57b:內部流路</p>
        <p type="p">58,58a,58b:栓塞導電膜</p>
        <p type="p">60:聚焦環</p>
        <p type="p">a,b:長度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="363px" img-content="tif" inline="yes" orientation="portrait" width="540px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622839</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127917</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260223B">G06Q20/34</main-classification>
        <further-classification edition="202301120260223B">G06Q40/02</further-classification>
        <further-classification edition="201301120260223B">G06F21/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商旅行錢包股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAVEL-WALLET CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炯佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0102829</doc-number>
          <date>20240802</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2024-0117690</doc-number>
          <date>20240830</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用以控制發卡的方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR CONTROLLING CARD ISSUANCE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露可提供一種用以控制發卡的系統及一種其之方法，其中此方法包括：一卡片管理伺服器，接收來自一使用者的電子裝置的一卡片發行申請；一發卡設備，回應於一請求，請求及接收認證資料；此設備基於此資料產生一認證碼且顯示此碼；電子裝置辨識此碼及利用此伺服器執行驗證；此設備請求及接收一認證結果；以及回應於認證完成，此設備透過寫入資訊於一臨時卡片上來產生一卡片及發行此卡片。本揭露可改善發卡的便利性、及時性、效率、及/或可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system for controlling card issuance and a method therefor may be provided, wherein the method comprises: a card management server receiving a card issuance application from a user's electronic device; a card issuing apparatus requesting and receiving authentication data in response to a request; the apparatus generating an authentication code based on the data and displaying the code; the electronic device recognizing the code and performing verification with the server; the apparatus requesting and receiving an authentication result; and in response to authentication completion, the apparatus generating a card by writing information onto a provisional card and issuing the card. The present disclosure can improve the convenience, promptness, efficiency, and/or reliability of card issuance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:卡片管理伺服器</p>
        <p type="p">200:使用者裝置、電子裝置</p>
        <p type="p">300:發卡設備</p>
        <p type="p">400:發行設備管理伺服器</p>
        <p type="p">S201~S241:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="1084px" img-content="tif" inline="yes" orientation="portrait" width="815px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621731</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127951</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/395</main-classification>
        <further-classification edition="200601120260302B">C07K16/28</further-classification>
        <further-classification edition="200601120260302B">A61P17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商阿爾米雷爾有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALMIRALL, S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔蘭森恩庫恩特拉　吉馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TARRASON ENCUENTRA, GEMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈德薩特瑪麗娜　紐裡亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODESSART MARINA, NURIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>EP24382814</doc-number>
          <date>20240724</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ＩＬ－１ＲＡＰ抑制劑在製備用於治療或預防化膿性汗腺炎的藥劑的用途</chinese-title>
        <english-title>USE OF IL-1RAP INHIBITOR IN MANUFACTURE OF A MEDICAMENT FOR TREATING OR PREVENTING HIDRADENITIS SUPPURATIVA</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及炎症性皮膚病症領域。具體而言，本發明提供IL-1RAP抑制劑以及包含其的藥物組合物用於治療化膿性汗腺炎的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to the field of inflammatory skin disorders. Particularly, the present invention provides the use of IL-1RAP inhibitors, as well as of pharmaceutical compositions comprising thereof, for treating Hidradenitis suppurativa.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="991px" img-content="tif" inline="yes" orientation="portrait" width="678px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621701</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127961</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/702</main-classification>
        <further-classification edition="200601120260302B">A61P3/04</further-classification>
        <further-classification edition="200601120260302B">A61P3/10</further-classification>
        <further-classification edition="200601120260302B">A61P9/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校法人東京農業大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO UNIVERSITY OF AGRICULTURE EDUCATIONAL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商養樂多本社股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KABUSHIKI KAISHA YAKULT HONSHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>志波優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIWA, YUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野本康二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMOTO, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法橋亜都子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOKKYO, ATSUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柿山明香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKIYAMA, SAYAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加賀千晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAGA, CHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林稔秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, TOSHIHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUSAWA, NAOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-120759</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>屬於消化鏈球菌科（Ｐｅｐｔｏｓｔｒｅｐｔｏｃｏｃｃａｃｅａｅ）微生物之增殖抑制劑及斯拉克氏菌屬（Ｓｌａｃｋｉａ）微生物增殖劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題係提供一種預防、改善劑，其安全性高且可持續攝取，其為基於在腸內對屬於消化鏈球菌科(Peptostreptococcaceae)微生物產生增殖抑制作用，或對斯拉克氏菌屬(Slackia)微生物產生增殖促進作用，對該些微生物所引起之疾病，或者對因該些微生物所產生的成分而可以期待預防、改善疾病之預防、改善劑。  &lt;br/&gt;　　解決本發明課題之屬於消化鏈球菌科微生物之增殖抑制劑或斯拉克氏菌屬微生物增殖劑，含有半乳寡糖作為有效成分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622090</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127965</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D519/00</main-classification>
        <further-classification edition="200601120260302B">C07D471/16</further-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61K31/5377</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海和譽生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABBISKO THERAPEUTICS CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧海兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, HAIBING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YONGXIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喻　紅平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HONGPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　椎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110103192</doc-number>
          <date>20240725</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>202411899152X</doc-number>
          <date>20241220</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種具有ＫＲＡＳ抑制活性的化合物及其在藥學上的應用</chinese-title>
        <english-title>A COMPOUND WITH KRAS INHIBITORY ACTIVITY AND ITS PHARMACEUTICAL APPLICATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種具有KRAS抑制活性的化合物及其在藥學上的應用。特別地，本發明涉及一種具有式(I)結構的KRAS抑制劑、含有其的醫藥組成物，以及其作為KRAS抑制劑的用途和其在治療和/或預防與KRAS相關的癌症或腫瘤中的用途。其中式(I)的各取代基與說明書中的定義相同。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="235px" width="243px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a compound with KRAS inhibitory activity and its pharmaceutical application. In particular, the present invention relates to a KRAS inhibitor having a structure shown as formula (I), a pharmaceutical composition containing the same, and an use thereof as a KRAS inhibitor and an use thereof in treating and/or preventing cancer or tumor related to KRAS. Wherein each substituent of the formula (I) being as defined in the description.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="230px" width="269px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622115</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127966</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">C07K16/30</further-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商安斯泰來有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTELLAS US LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商ＣＹＴＯＭＸ生物製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYTOMX THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布斯塔尼　萊拉　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOUSTANY, LEILA M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹尼爾　迪倫　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANIEL, DYLAN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡　哲宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, ZHEHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勒　斯科蘭　埃爾萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LE SCOLAN, ERWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕德洪加特　馬丹　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAIDHUNGAT, MADAN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武　莊　Ｔ　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, TRANG T. T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯隆　南希　巴林頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SLOAN, NANCY BARRINGTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦西里耶娃　奧爾加</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VASILJEVA, OLGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫特　麥可　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINTER, MICHAEL B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭根　范吉普拉姆　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANGAN, VANGIPURAM S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達拉爾　維吉特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DALAL, VIJIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤雅人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, MASAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地綾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, AYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,842</doc-number>
          <date>20240724</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/812,390</doc-number>
          <date>20250527</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>結合ＣＤ３及ＭＵＣ１的雙特異性抗體及其使用方法</chinese-title>
        <english-title>BISPECIFIC ANTIBODIES THAT BIND CD3 AND MUC1 AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於結合MUC1及/或CD3的抗體，例如單株抗體、雙特異性抗體、及雙特異性可活化抗體，以及此類抗體之用途，特定而言其在疾病例如癌症的治療中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is directed to antibodies, &lt;i&gt;e.g.,&lt;/i&gt; monoclonal antibodies, bispecific antibodies and bispecific activatable antibodies that bind MUC1 and/or CD3, and uses of such antibodies, in particular use thereof in the treatment of diseases, &lt;i&gt;e.g.,&lt;/i&gt; cancers.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.JPG" file="ed10025.JPG" height="383px" img-content="tif" inline="yes" orientation="portrait" width="408px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621796</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127972</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260121B">B05B1/04</main-classification>
        <further-classification edition="201801120260121B">B05B15/40</further-classification>
        <further-classification edition="200601120260121B">C23C16/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＥＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMEIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平松孝浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAMATSU, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤洸聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTOH, KOHSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩尾有佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波戸信義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAMITO, NOBUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/040640</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>成膜裝置</chinese-title>
        <english-title>FILM FORMATION APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的目的在於提供一種可抑制從霧氣噴出口供給的原料溶液霧氣的品質劣化的成膜裝置之結構。而且，本揭示的成膜裝置(101)係具備：噴嘴(11)，係於將原料溶液霧氣(MT)自超音波霧化器(50)引入至噴嘴內部空間(SP1)之後，將原料溶液霧氣(MT)從霧氣噴出口(33)供給至外部。噴嘴(11)係在噴嘴內部空間(SP1)具有蓄液機構(21)，蓄液機構(21)係具有：收容區域(A21)，係用以收容因原料溶液霧氣(MT)的液狀化所產生之噴嘴內部液狀物。蓄液機構(21)的收容區域(A21)係在噴嘴內部空間(SP1)中配置於原料溶液霧氣(MT)所流通的噴嘴內部霧氣路徑上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present disclosure is to provide a structure of a film formation apparatus suppressing deterioration of quality of a material solution mist supplied from a mist spray outlet. A film formation apparatus (101) according to the present disclosure includes a nozzle (11) taking a material solution mist (MT) in an in-nozzle space (SPI) from an ultrasonic atomizer (50), and subsequently supplying the material solution mist (MT) outside from a mist spray outlet (33). The nozzle (11) includes a liquid collection mechanism (21) in the in-nozzle space (SPI), and the liquid collection mechanism (21) includes a housing region (A21) housing an in-nozzle liquid material occurring by liquidization of the material solution mist (MT). The housing region (A21) in the liquid collection mechanism (21) is disposed on an in-nozzle mist route in which the material solution mist (MT) flows in the in-nozzle space (SPI).</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:噴嘴</p>
        <p type="p">11w:內壁</p>
        <p type="p">18:平台</p>
        <p type="p">20:基材</p>
        <p type="p">21:蓄液機構</p>
        <p type="p">21b:底面部</p>
        <p type="p">21s:側面部</p>
        <p type="p">21w:內壁</p>
        <p type="p">31:霧氣供給管</p>
        <p type="p">32:霧氣供給口</p>
        <p type="p">33:霧氣噴出口</p>
        <p type="p">101:成膜裝置</p>
        <p type="p">A21:收容區域</p>
        <p type="p">MT:原料溶液霧氣</p>
        <p type="p">O21:開口部</p>
        <p type="p">SP1:噴嘴內部空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="959px" img-content="tif" inline="yes" orientation="portrait" width="702px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622091</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127977</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D519/00</main-classification>
        <further-classification edition="200601120260302B">A61K31/5025</further-classification>
        <further-classification edition="200601120260302B">A61K31/437</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英塞特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INCYTE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹瑞英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SEOYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧　姮詩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANG, HANG THI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯　迪彭度</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAS, DIPENDU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道堤　布侖特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOUTY, BRENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古彥　明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, MINH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西門斯　漢特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMS, HUNTER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史迪杜赫　艾文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STYDUHAR, EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦卡　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWYKA, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維克洛金　奧利格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VECHORKIN, OLEG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
              <english-address>UA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛路萊斯卡斯　達利奧斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VRUBLIAUSKAS, DARIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LT</english-country>
              <english-address>LT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王安來</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ANLAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　海芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, HAI FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤伊　艾迪　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUE, EDDY W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, KE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="18">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,113</doc-number>
          <date>20240724</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/738,971</doc-number>
          <date>20241226</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/783,499</doc-number>
          <date>20250404</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>美國</country>
          <doc-number>63/789,774</doc-number>
          <date>20250416</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>作為激酶抑制劑之雙環脲</chinese-title>
        <english-title>BICYCLIC UREAS AS KINASE INHIBITORS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案提供調節JAK2活性之雙環脲化合物，其可用於治療包括癌症在內的各種疾病。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides bicyclic urea compounds that modulate the activity of JAK2, which are useful in the treatment of various diseases, including cancer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621565</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127978</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A01N47/36</main-classification>
        <further-classification edition="202001120260302B">A01N63/22</further-classification>
        <further-classification edition="202001120260302B">A01N63/23</further-classification>
        <further-classification edition="202001120260302B">A01N63/25</further-classification>
        <further-classification edition="202001120260302B">A01N63/27</further-classification>
        <further-classification edition="202001120260302B">A01N63/30</further-classification>
        <further-classification edition="202001120260302B">A01N63/38</further-classification>
        <further-classification edition="202001120260302B">A01N63/40</further-classification>
        <further-classification edition="200601120260302B">A01P7/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科迪華農業科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORTEVA AGRISCIENCE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋斯帕　亞當　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GASPAR, ADAM P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹派特羅　娜塔莉　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIAMPIETRO, NATALIE C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯克　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRK, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐尼爾　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'NEAL, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魯爾　德維恩　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RULE, DWAIN M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃森　吉拉德　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATSON, GERALD BRYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,893</doc-number>
          <date>20240724</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含四氫噻唑和生物製劑的殺有害生物組成物</chinese-title>
        <english-title>PESTICIDAL COMPOSITIONS COMPRISING A THIAZOLIDINE AND A BIOLOGICAL AGENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭露了組成物，其包含A) 具有式I的化合物 (F1) 或具有式II的化合物 (F2)；以及B) 生物製劑，該生物製劑選自由以下組成之群組：芽孢桿菌屬物種、桿狀病毒屬物種、假單胞菌屬物種、白僵菌屬物種、分枝桿菌屬物種、菌根真菌、木黴屬物種和綠僵菌屬物種。&lt;br/&gt;&lt;img align="absmiddle" height="454px" width="478px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are compositions comprising A) compound of Formula One (F1) or Formula Two (F2); and B) biological agent selected from the group consisting of Bacillus species, Baclovirus species, Pseudomonas species, Beauveria species, Mycobacterium species, Mycorrhizal fungi, Trichoderma species, and Metarhizium species.&lt;br/&gt;&lt;img align="absmiddle" height="445px" width="455px" file="ed10019.JPG" alt="ed10019.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622283</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127980</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C23C16/455</main-classification>
        <further-classification edition="200601120260223B">B08B9/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大陽日酸股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO NIPPON SANSO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉永純也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINAGA, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田貞弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, SADAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-128138</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔方法及氣相成長裝置</chinese-title>
        <english-title>CLEANING METHOD AND VAPOR PHASE GROWTH APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能輕易清除附著在氣流通道內壁之含碳的堆積物的清潔方法及氣相成長裝置。一種清潔方法，係採用電加熱爐(10)以加熱反應管(1)的氣相成長裝置(100)中之堆積物(24)的清潔方法，其中，將氧氣通入至配置於前述反應管(1)內的氣流通道，藉此清潔附著在前述氣流通道之內壁的含碳的堆積物(24)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a cleaning method that can easily remove carbon-containing deposits adhering to the inner walls of a flow channel and a vapor phase growth apparatus. A method for cleaning deposits (24) in a vapor phase growth apparatus (100) in which an electric furnace (10) is used to heat a reaction tube (1) cleans carbon-containing deposits (24) adhering to the inner walls of a flow channel arranged in the reaction (1) by flowing oxygen gas through the flow channel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:反應管</p>
        <p type="p">2:基板</p>
        <p type="p">3:懸吊式基板固定器</p>
        <p type="p">10:電加熱爐</p>
        <p type="p">11:上游加熱用加熱器</p>
        <p type="p">12:中間加熱用加熱器</p>
        <p type="p">13:下游加熱用加熱器</p>
        <p type="p">20:上游氣流通道</p>
        <p type="p">21:上部通道</p>
        <p type="p">22:中部通道</p>
        <p type="p">23:下部通道</p>
        <p type="p">24:堆積物</p>
        <p type="p">26:中間氣流通道</p>
        <p type="p">27:上面開口部</p>
        <p type="p">29:下游氣流通道</p>
        <p type="p">31:第一原料氣體供給管</p>
        <p type="p">32a,32b:第二原料氣體供給管</p>
        <p type="p">100:氣相成長裝置</p>
        <p type="p">A:匯流位置</p>
        <p type="p">G1:第一原料氣體</p>
        <p type="p">G2:第二原料氣體</p>
        <p type="p">H:加熱區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="598px" img-content="tif" inline="yes" orientation="portrait" width="799px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623577</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127987</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="200601120260302B">B25J9/02</further-classification>
        <further-classification edition="200601120260302B">B25J9/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口侑宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, YUKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村瀬大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURASE, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松崎公治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSAKI, KOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水一平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, IPPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-120908</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>機器人系統</chinese-title>
        <english-title>ROBOT SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">機器人系統（6）包括第一載置部（5R）、第二載置部（5L）以及搬運機器人（2），第二載置部（5L）位於第一載置部的側邊，搬運機器人（2）為水平多關節型搬運機器人（2），其向第一載置部及第二載置部搬運基板（9），搬運機器人具有保持基板的第一手部（31）及第二手部（32），且在第一手部接近第一載置部且第二手部接近第二載置部的過程中，第一手部與第二手部中的至少一者向第一手部與第二手部彼此遠離的方向位移。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A robot system (6) according to the present invention includes a first placement unit (5R); a second placement unit (5L) disposed next to the first placement unit; and a transport robot (2) of horizontal articulated type that transports substrates (9) to the first placement unit and the second placement unit. The transport robot (2) has a first hand (31) and a second hand (32) that hold the substrates, and at least one of the first and second hands moves in a direction that separates them from each other while the first hand is approaching the first placement unit and the second hand is approaching the second placement unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5R:第一對準器</p>
        <p type="p">5L:第二對準器</p>
        <p type="p">9:基板</p>
        <p type="p">31:第一手部</p>
        <p type="p">32:第二手部</p>
        <p type="p">51:主軸</p>
        <p type="p">52a:支承面</p>
        <p type="p">CL:中央線</p>
        <p type="p">D1:間距</p>
        <p type="p">L1:第一距離</p>
        <p type="p">TR1:移動軌跡</p>
        <p type="p">TR2:移動軌跡</p>
        <p type="p">Z3:第三軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="984px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621690</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114127992</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/519</main-classification>
        <further-classification edition="200601120260302B">A61P7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商普林斯匹亞生物製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRINCIPIA BIOPHARMA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達克　艾哈邁德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAAK, AHMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SD</english-country>
              <english-address>SD</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王蕾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,136</doc-number>
          <date>20240724</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/804,986</doc-number>
          <date>20250513</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>藉由投與（Ｒ）－２－［３－［４－胺基－３－（２－氟－４－苯氧基－苯基）吡唑并［３，４－ｄ］嘧啶－１－基］哌啶－１－羰基］－４－甲基－４－［４－（氧環丁烷－３－基）哌－１－基］戊－２－烯腈治療溫抗體型自體免疫性溶血性貧血之方法</chinese-title>
        <english-title>METHODS FOR TREATING WARM ANTIBODY AUTOIMMUNE HEMOLYTIC ANEMIA BY ADMINISTERING (R)-2-[3-[4-AMINO-3-(2-FLUORO-4-PHENOXY-PHENYL)PYRAZOLO[3,4-D]PYRIMIDIN-1-YL]PIPERIDINE-1-CARBONYL]-4-METHYL-4-[4-(OXETAN-3-YL)PIPERAZIN-1-YL]PENT-2-ENENITRILE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了用於治療患有wAIHA的患者之方法，該等方法包括投與選自(R)-2-[3-[4-胺基-3-(2-氟-4-苯氧基-苯基)吡唑并[3,4-d]嘧啶-1-基]哌啶-1-羰基]-4-甲基-4-[4-(氧環丁烷-3-基)哌𠯤-1-基]戊-2-烯腈(瑞紮布魯替尼)及其藥學上可接受的鹽的至少一種化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for treating patients with wAIHA comprising administering at least one compound chosen from (R)-2-[3-[4-amino-3-(2-fluoro-4-phenoxy-phenyl)pyrazolo[3,4-d]pyrimidin-1-yl]piperidine-1-carbonyl]-4-methyl-4-[4-(oxetan-3-yl)piperazin-1-yl]pent-2-enenitrile (rilzabrutinib) and pharmaceutically acceptable salts thereof are disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621826</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128003</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">B23K20/26</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商庫利克和索夫工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULICKE AND SOFFA INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派瑞許　傑西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARISH, JESSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉洛帝　蓋瑞Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILLOTTI, GARY S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　金城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, KAM-SHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾頓　巴西爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILTON, BASIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,872</doc-number>
          <date>20240724</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>引線接合系統及形成垂直引線結構的相關方法</chinese-title>
        <english-title>WIRE BONDING SYSTEMS AND RELATED METHODS OF FORMING A VERTICAL WIRE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種引線接合系統。該引線接合系統包含一接合頭組件，配置為承載一引線接合工具。該引線接合系統也包含一支撐結構，配置為支撐一工件。該工件配置為用於引線接合。該引線接合系統也包含一可移動臺組件，包含一可移動臺，配置為相對於該引線接合工具移動。該引線接合工具配置為將與該引線接合工具咬合的一引線相對於該可移動臺壓靠，以產生該引線的一變形部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wire bonding system is provided. The wire bonding system includes a bond head assembly configured to carry a wire bonding tool. The wire bonding system also includes a support structure configured to support a workpiece. The workpiece is configured for wire bonding. The wire bonding system also includes a movable stage assembly including a movable stage configured to move with respect to the wire bonding tool. The wire bonding tool is configured to press a wire engaged with the wire bonding tool against the movable stage to create a deformed portion of the wire.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:引線接合系統</p>
        <p type="p">102:支撐結構</p>
        <p type="p">104:工件</p>
        <p type="p">104a:接合焊墊</p>
        <p type="p">106:接合頭組件</p>
        <p type="p">108:換能器</p>
        <p type="p">110:引線接合工具</p>
        <p type="p">110a:尖端</p>
        <p type="p">112:引線</p>
        <p type="p">112a:端部</p>
        <p type="p">112a1:末端</p>
        <p type="p">114,116:引線夾</p>
        <p type="p">120:運動系統</p>
        <p type="p">122:手臂組件</p>
        <p type="p">124:可移動臺</p>
        <p type="p">126:引線張力器</p>
        <p type="p">130:可移動臺組件</p>
        <p type="p">L:長度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.JPG" file="ed10026.JPG" height="670px" img-content="tif" inline="yes" orientation="portrait" width="546px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622266</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128005</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C23C14/35</main-classification>
        <further-classification edition="200601120260225B">C23C14/54</further-classification>
        <further-classification edition="200601120260225B">C23C14/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＡＰ系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AP SYSTEMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安孝承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, HYO SEUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炯佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYEONG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴俊雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JUN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0107542</doc-number>
          <date>20240812</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>濺鍍設備</chinese-title>
        <english-title>SPUTTERING APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及一種能夠通過穩定地供應電力而將薄膜均勻地沉積在襯底上的濺鍍裝置。根據本公開實施例的濺鍍裝置包括：腔室，被配置成提供處理空間；支撐件，設置在處理空間中以對襯底進行支撐；濺鍍靶單元，被設置成面對所述支撐件；射頻功率供應單元，被配置成向濺鍍靶單元供應射頻功率；以及第一電極單元，被配置成從射頻功率供應單元接收射頻功率，以將所述射頻功率傳送到濺鍍靶單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a sputtering apparatus capable of uniformly depositing a thin film on a substrate by stably supplying power. A sputtering apparatus according to an embodiment of the present disclosure includes a chamber configured to provide a processing space, a support provided in the processing space to support a substrate, a sputter target unit provided to face the support, a radio frequency power supply unit configured to supply radio frequency power to the sputter target unit, and a first electrode unit configured to receive the radio frequency power from the radio frequency power supply unit so as to transmit the radio frequency power to the sputter target unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:腔室</p>
        <p type="p">110:絕緣構件</p>
        <p type="p">120:真空泵</p>
        <p type="p">130:氣體供應部</p>
        <p type="p">200:支撐件</p>
        <p type="p">300:濺鍍靶單元</p>
        <p type="p">310:濺鍍靶</p>
        <p type="p">320:背襯板</p>
        <p type="p">400:射頻功率供應單元</p>
        <p type="p">510:第一連接電極</p>
        <p type="p">520:下部電極</p>
        <p type="p">530:上部電極</p>
        <p type="p">540:連接電極</p>
        <p type="p">600:直流(DC)功率供應單元</p>
        <p type="p">700:第二連接電極</p>
        <p type="p">800:磁體組合件單元</p>
        <p type="p">810:旋轉驅動單元</p>
        <p type="p">820:旋轉軸</p>
        <p type="p">830:旋轉軸支撐單元</p>
        <p type="p">900:冷卻水容納單元</p>
        <p type="p">910、920:冷卻水入口</p>
        <p type="p">C:內部空間</p>
        <p type="p">S:襯底</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="688px" img-content="tif" inline="yes" orientation="portrait" width="669px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621732</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128019</doc-number>
          <kind></kind>
          <date>114/07/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/395</main-classification>
        <further-classification edition="200601120260302B">C07K16/18</further-classification>
        <further-classification edition="200601120260302B">C07K16/30</further-classification>
        <further-classification edition="200601120260302B">A61K31/4745</further-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61K31/513</further-classification>
        <further-classification edition="200601120260302B">A61K31/555</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健生生物科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSSEN BIOTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史內普　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEPP, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩澤遼太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAWA, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/674,612</doc-number>
          <date>20240723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療結腸直腸癌之組合療法(二)</chinese-title>
        <english-title>COMBINATION THERAPIES FOR THE TREATMENT OF COLORECTAL CANCER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示（例如，在前線情況下）使用雙特異性抗EGFR/c-Met抗體及FOLFIRI或mFOLFOX6治療轉移性結腸直腸癌之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are methods of treating metastatic colorectal cancer (e.g., in the frontline setting) with a bispecific anti-EGFR/c-Met antibody and FOLFIRI or mFOLFOX6.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622066</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128039</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D405/06</main-classification>
        <further-classification edition="200601120260302B">C07D309/36</further-classification>
        <further-classification edition="200601120260302B">C07F5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商海思科製藥(眉山)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAISCO PHARMACEUTICAL (MEISHAN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱鳳飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, FENGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉振平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHENPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, ZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧顯華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, XIANHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竇贏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOU, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110028030</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>CYP11A1抑制劑的製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種CYP11A1抑制劑（式（E）化合物）的製備方法，該方法原料易得、步驟簡單、後處理方便，成本低，中間體穩定性好、純度高、收率高，適宜大規模工業化生產。  &lt;br/&gt;&lt;img align="absmiddle" height="122px" width="251px" file="ed10060.JPG" alt="ed10060.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622051</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128051</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D333/54</main-classification>
        <further-classification edition="200601120260302B">C07D409/04</further-classification>
        <further-classification edition="200601120260302B">C07D409/10</further-classification>
        <further-classification edition="200601120260302B">C09K19/34</further-classification>
        <further-classification edition="200601120260302B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>饒真瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAO, MOBIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>少爾　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAUER, MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科狄　索斯頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODEK, THORSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MINGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛特　羅可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORTTE, ROCCO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞特　史分　克里斯丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUT, SVEN CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/107669</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>液晶化合物</chinese-title>
        <english-title>LIQUID CRYSTALLINE COMPOUNDS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於如藉由化學式所提供具有末端5,6-二氟-苯并[&lt;i&gt;b&lt;/i&gt;]噻吩環之液晶化合物、使用該等化合物之液晶混合物、其在電光顯示器中、尤其在基於IPS或FFS效應之主動矩陣顯示器中之用途及含有此類液晶材料之液晶顯示器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Liquid-crystalline compounds with a terminal 5,6-difluoro-benzo[&lt;i&gt;b&lt;/i&gt;]thiophene ring as provided by the formulae, liquid crystal mixtures using the compounds, the use thereof in an electro-optical display, particularly in an active-matrix display based on the IPS or FFS effect, and liquid crystal displays which contain a liquid crystal material of this type.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623385</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128054</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/01</main-classification>
        <further-classification edition="202501120260302B">H10D30/47</further-classification>
        <further-classification edition="202501120260302B">H10D62/85</further-classification>
        <further-classification edition="202601120260302B">H10P14/69</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W74/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商德州儀器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEXAS INSTRUMENTS INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　東燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG SEUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　成莫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SEONGMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　廷祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOH, JUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂正忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/794,301</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有介電質區段之基於氮化鎵的半導體裝置及其製造方法</chinese-title>
        <english-title>GALLIUM NITRIDE-BASED SEMICONDUCTOR DEVICES WITH DIELECTRIC SEGMENTS AND METHODS OF FABRICATION THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述半導體裝置及其製造方法。舉例而言，一半導體裝置包括安置於一基板上的一GaN異質接面結構。該GaN異質接面結構包括安置於一GaN層上的一障壁層。該半導體裝置進一步包括一源極觸點、一汲極觸點及一閘極電極。該閘極電極安置於該GaN異質接面結構上方及該源極觸點與該汲極觸點之間。該半導體裝置又進一步包括安置於該源極觸點與該汲極觸點之間的該障壁層上的複數個介電材料區段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Semiconductor devices and fabrication methods thereof are described. For example, a semiconductor device includes a GaN heterojunction structure disposed on a substrate. The GaN heterojunction structure includes a barrier layer disposed on a GaN layer. The semiconductor device further includes a source contact, a drain contact, and a gate electrode. The gate electrode is disposed above the GaN heterojunction structure and between the source contact and the drain contact. The semiconductor device still further includes a plurality of segments of dielectric material disposed on the barrier layer between the source contact and the drain contact.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:GaN裝置</p>
        <p type="p">102:基板</p>
        <p type="p">104:緩衝層</p>
        <p type="p">106:GaN層</p>
        <p type="p">108:障壁層/AlGaN層</p>
        <p type="p">110:2DEG層</p>
        <p type="p">112:介電材料區段/第一介電層</p>
        <p type="p">113:開口</p>
        <p type="p">114:第二介電層</p>
        <p type="p">120:源極觸點</p>
        <p type="p">122:場板支撐件</p>
        <p type="p">124:第一場板</p>
        <p type="p">126:第二場板</p>
        <p type="p">130:汲極觸點</p>
        <p type="p">132:場板支撐件</p>
        <p type="p">134:第一場板</p>
        <p type="p">136:第二場板</p>
        <p type="p">140:閘極介電層</p>
        <p type="p">142:閘極電極</p>
        <p type="p">150:介電層</p>
        <p type="p">160:源極區</p>
        <p type="p">161:源極存取區</p>
        <p type="p">162:閘極區</p>
        <p type="p">163:汲極存取區</p>
        <p type="p">164:汲極區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="690px" img-content="tif" inline="yes" orientation="portrait" width="1043px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621975</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128060</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">B66C1/34</main-classification>
        <further-classification edition="200601120260223B">B66C1/66</further-classification>
        <further-classification edition="200601120260223B">F16B45/00</further-classification>
        <further-classification edition="200601120260223B">G01B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商開道股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中健志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-119218</doc-number>
          <date>20240725</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-061172</doc-number>
          <date>20250402</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>吊掛用鉤及檢查夾具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種吊掛用鉤，包括：自吊掛用的連結部（32）向下延伸之基端部（11）、自基端部（11）下端呈圓弧狀形成之彎曲部（13）、連接彎曲部（13）並向上延伸之前端部（12）所圍成的內側部（30），包括與內側部（30）相接之內周部（10a）、及與內周部（10a）相反側之外周部（10c）；基端部（11）的外周部（10c）具有直線延伸，且位於彎曲部（13）彎曲中心上方之第一外周面（11b），前端部（12）的外周部（10c）具有直線延伸，且位於自彎曲部（13）彎曲中心的下方朝向上方之位置的第二外周面（12b）；第一外周面（11b）與第二外周面（12b）彼此向外且平行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:吊掛用鉤</p>
        <p type="p">10a:內緣面(內周部)</p>
        <p type="p">10b:內緣部</p>
        <p type="p">10c:外緣部(外周部)</p>
        <p type="p">11:基端部</p>
        <p type="p">11a:邊界臺階部</p>
        <p type="p">11b:外緣面(第一外周面)</p>
        <p type="p">11c:外緣面</p>
        <p type="p">12:前端部</p>
        <p type="p">12a:邊界臺階部</p>
        <p type="p">12b:外緣面(第二外周面)</p>
        <p type="p">13:彎曲部</p>
        <p type="p">13a:邊界臺階部</p>
        <p type="p">13b:外緣面</p>
        <p type="p">14:基端側凹部</p>
        <p type="p">15:前端側凹部</p>
        <p type="p">16:薄壁部</p>
        <p type="p">16a:平坦面</p>
        <p type="p">17:厚壁部</p>
        <p type="p">17a:平坦面</p>
        <p type="p">18:邊界部</p>
        <p type="p">18a:傾斜面</p>
        <p type="p">18c:邊界直線部</p>
        <p type="p">19:彎曲力最大之位置</p>
        <p type="p">21:鉤舌鎖扣</p>
        <p type="p">22:支撐軸(轉動軸)</p>
        <p type="p">23:扭力螺旋彈簧</p>
        <p type="p">24:狹小部</p>
        <p type="p">30:內側部(鉤喉部)</p>
        <p type="p">31:虛擬圓</p>
        <p type="p">32:連結部</p>
        <p type="p">θa:(吊掛用鉤處於吊掛狀態下之作為水平面的X軸與外緣面11b所成之)角度</p>
        <p type="p">θb:(X軸與外緣面11b所形成之)角度</p>
        <p type="p">θc:(X軸與邊界臺階部11a所形成之)角度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="871px" img-content="tif" inline="yes" orientation="portrait" width="796px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621977</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128062</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">B66D3/16</main-classification>
        <further-classification edition="200601120260223B">B66D5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商開道股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>城田明典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIROTA, AKINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中健志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河西貴幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASAI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-119229</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>捲揚機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種在驅動軸附近的結構方面，能夠實現對於驅動軸的結構及製造步驟的改進之捲揚機；該捲揚機係利用負載滑輪進行貨物的上升或下降，其中，用於吊起貨物之負載鏈掛繞於負載滑輪，上述捲揚機包括：驅動軸（40），係將使貨物上升或下降之驅動力傳遞至負載滑輪、制動器托架部（42），係被設置為不能相對於驅動軸（40）旋轉、制動板，係相對於制動器托架部（42）滑動；驅動軸（40）和制動器托架部（42）一體成形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">40:驅動軸</p>
        <p type="p">41:陽螺紋部</p>
        <p type="p">42:凸緣部</p>
        <p type="p">42a:大徑部</p>
        <p type="p">42b:凸緣部</p>
        <p type="p">42b2:背面</p>
        <p type="p">43:螺母螺合部</p>
        <p type="p">43a:銷插入孔</p>
        <p type="p">44:第一軸承安裝部</p>
        <p type="p">45:第二軸承安裝部</p>
        <p type="p">46:小齒輪</p>
        <p type="p">47:軸狀部分</p>
        <p type="p">49:內圈抵接部</p>
        <p type="p">49R:彎曲部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="820px" img-content="tif" inline="yes" orientation="portrait" width="671px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623560</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128071</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="202601120260302B">H10P72/76</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>列斐伏爾　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEFEVRE, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普雷茲　亨利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PURETZ, HENRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴思里克　布蘭登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BATHRICK, BRENDAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拜拉吉恩　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAILLARGEON, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/787,827</doc-number>
          <date>20240729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學晶圓監測</chinese-title>
        <english-title>OPTICAL WAFER MONITORING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種監測晶圓解持的方法包括使用光源所產生的光線照亮設置於處理腔室中的晶圓固持器上的晶圓。本方法更包括利用設置於晶圓固持器中的定位銷舉升晶圓，且於舉升期間，於光偵測器處收集光線的一部分。且本方法更包括依據光線的收集部分，判斷是否繼續舉升以完成解持。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for monitoring a dechucking of a wafer includes illuminating, using light generated from a light source, the wafer disposed on a wafer holder in a processing chamber. The method further includes lifting, using pins disposed in the wafer holder, the wafer, and during the lifting, collecting a portion of the light at a light detector. And the method further includes, based on the collected portion of the light, determining whether to continue the lifting to complete the dechucking.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:晶圓監測系統</p>
        <p type="p">100:晶圓</p>
        <p type="p">102:處理腔室</p>
        <p type="p">104:密封帶</p>
        <p type="p">106:晶圓固持器</p>
        <p type="p">108a:定位銷</p>
        <p type="p">180b:定位銷</p>
        <p type="p">108c:定位銷</p>
        <p type="p">110:光源</p>
        <p type="p">112:入射視窗</p>
        <p type="p">114:收集視窗</p>
        <p type="p">116:光偵測器</p>
        <p type="p">118:控制器</p>
        <p type="p">120:處理器</p>
        <p type="p">122:記憶體</p>
        <p type="p">124:扭矩監測器</p>
        <p type="p">20:處理工具</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="863px" img-content="tif" inline="yes" orientation="portrait" width="714px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623310</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128092</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H05H1/46</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="200601120260302B">H02N13/00</further-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諏訪亘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUWA, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-129714</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置及電漿處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之電漿處理裝置包含腔室、基板支持部及至少一個電源。基板支持部包含靜電吸盤、氣孔及絕緣構件。氣孔係為了向靜電吸盤與基板之背面之間之間隙供給傳熱氣體而於靜電吸盤之上表面開口。絕緣構件配置於氣孔中。靜電吸盤包含介電部、第1電極及第2電極。第1電極係為了藉由靜電吸盤產生靜電引力而配置於介電部中。第2電極於介電部中且於第1電極與絕緣構件之間以包圍絕緣構件之方式延伸。至少一個電源構成為向第1電極及第2電極之各者施加獨立之電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基板支持部</p>
        <p type="p">11h:氣孔</p>
        <p type="p">14:絕緣構件</p>
        <p type="p">14a:第1部分</p>
        <p type="p">14b:第2部分</p>
        <p type="p">16:套筒</p>
        <p type="p">34:電源</p>
        <p type="p">34a:電源(第1電源)</p>
        <p type="p">34b:電源(第2電源)</p>
        <p type="p">36:傳熱氣體之供給部</p>
        <p type="p">150:介電部</p>
        <p type="p">151:第1電極</p>
        <p type="p">152:第2電極</p>
        <p type="p">1110:基台</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">1111p:凸部</p>
        <p type="p">G:間隙</p>
        <p type="p">W:基板</p>
        <p type="p">Wb:背面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="653px" img-content="tif" inline="yes" orientation="portrait" width="636px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622489</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128106</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G01N21/88</main-classification>
        <further-classification edition="201901120260224B">G06N20/00</further-classification>
        <further-classification edition="201701120260224B">G06T7/00</further-classification>
        <further-classification edition="200601120260224B">G06F11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古莫　巴斯卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, BHASKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳沁懌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QINYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕迪　迪內什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PADHI, DEENESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　鶴璇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HEXUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　阿比納夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ABHINAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/783,230</doc-number>
          <date>20240724</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基於多種資料類型的基板缺陷分析</chinese-title>
        <english-title>SUBSTRATE DEFECT ANALYSIS BASED ON MULTIPLE DATA TYPES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包含獲取與基板相關聯的缺陷資料和上下文資料，並將缺陷資料和上下文資料作為輸入提供給第一經訓機器學習模型。該方法還包含基於缺陷資料和上下文資料從第一經訓機器學習模型獲取輸出。該輸出指示與缺陷資料相關聯的預測根本原因。該方法還包含根據該輸出執行校正行動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes obtaining defect data and context data in association with a substrate, and providing the defect data and the context data to a first trained machine learning model as input. The method further includes obtaining output from the first trained machine learning model based on the defect data and the context data. The output is indicative of a predicted root cause in association with the defect data. The method further includes performing a corrective action in view of the output.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:資料流</p>
        <p type="p">502:缺陷特徵</p>
        <p type="p">504:上下文資料</p>
        <p type="p">506:缺陷資料</p>
        <p type="p">508:影像特徵</p>
        <p type="p">510:缺陷高度</p>
        <p type="p">512:缺陷組成</p>
        <p type="p">514:空間簽名</p>
        <p type="p">516:缺陷分類</p>
        <p type="p">518:缺陷分析模型</p>
        <p type="p">520:分析模型輸出</p>
        <p type="p">522:預測/根本原因預測</p>
        <p type="p">524:分區計劃</p>
        <p type="p">526:圖形分析</p>
        <p type="p">528:回饋迴路</p>
        <p type="p">530:模型選擇</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="700px" img-content="tif" inline="yes" orientation="portrait" width="1005px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622810</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128108</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120251001B">G06N5/04</main-classification>
        <further-classification edition="200601120251001B">D06H3/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＴ機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMT MACHINERY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻崇紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本欣三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, KINZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林靖史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, YASUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-203969</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>資訊處理裝置、推定方法、推定程式、及程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供使用假撚加工前之原絲來推定假撚加工絲之染色品質之技術。能針對藉由對原絲進行假撚加工而製造之假撚加工絲來推定染色品質之資訊處理裝置具備控制裝置。控制裝置執行以下處理：獲取藉由對多個學習用資料之各者規定的說明變數與目標變數之相關關係進行機器學習而生成之推定模型，說明變數包含針對學習用之原絲測定出之多個物性。目標變數包含針對學習用之假撚加工絲測定出之染色品質，該學習用之假撚加工絲係藉由對學習用之原絲進行假撚加工而製造出的。執行以下處理：針對推定對象之原絲獲取多個物性；以及將針對推定對象之原絲獲取到之多個物性輸入至推定模型，由此，輸出自該推定模型得到的染色品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資訊處理裝置</p>
        <p type="p">101:控制裝置</p>
        <p type="p">124:推定模型</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="462px" img-content="tif" inline="yes" orientation="portrait" width="697px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623047</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128111</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩羅德比許瓦那　尤甘南達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARODE VISHWANATH, YOGANANDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庖洛斯　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POULOSE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/787,734</doc-number>
          <date>20240729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>利用電磁電漿局限進行半導體晶圓處理</chinese-title>
        <english-title>SEMICONDUCTOR WAFER PROCESSING WITH ELECTROMAGNETIC PLASMA CONFINEMENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種形成膜的系統和方法，包括在處理腔室的處理體積內生成電漿，以在基板上形成該膜。該處理腔室包括電漿局限系統。該電漿局限系統包括具有環形主體的腔室壁襯墊。該腔室壁襯墊具有內壁；狹縫開口，該狹縫開口穿過該內壁形成，該狹縫開口定大小以讓基板穿過該狹縫開口；以及第一腔體，該第一腔體具有後壁。該電漿局限系統包括電漿局限組件。該電漿局限組件具有第一磁體，該第一磁體設置在該第一腔體中，靠近該後壁；以及第一窗口，該第一窗口設置在該第一腔體中，介於該第一磁體與該內壁之間，其中該第一窗口密封該第一磁體以與外部環境隔離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for forming a film that includes generating a plasma in a processing volume of a processing chamber to form the film on a substrate. The processing chamber includes a plasma confinement system. The plasma confinement system includes a chamber wall liner having a ring shaped body. The chamber wall liner has an inner wall, a slit opening formed through the inner wall and sized for a substrate to pass therethrough the slit opening, and a first cavity having a back wall. The plasma confinement system includes a plasma confinement assembly. The plasma confinement assembly has a first magnet disposed in the first cavity adjacent the back wall, and a first window disposed in the first cavity between the first magnet and the inner wall, wherein the first window seals the first magnet from an outside environment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:基板支撐件</p>
        <p type="p">110:電漿</p>
        <p type="p">120:處理體積</p>
        <p type="p">126:狹縫開口</p>
        <p type="p">128:第一電源</p>
        <p type="p">129:第二電源</p>
        <p type="p">154:基板</p>
        <p type="p">199:中心線</p>
        <p type="p">300:電漿局限系統</p>
        <p type="p">331:第一光學窗口</p>
        <p type="p">332:第二光學窗口</p>
        <p type="p">341:第一電磁體</p>
        <p type="p">342:第二電磁體</p>
        <p type="p">347:角度</p>
        <p type="p">349:磁軸</p>
        <p type="p">351:距離</p>
        <p type="p">352:空間</p>
        <p type="p">360:第一B場</p>
        <p type="p">362:第二B場</p>
        <p type="p">399:垂直線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="607px" img-content="tif" inline="yes" orientation="portrait" width="839px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621793</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128130</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260228B">B01L1/00</main-classification>
        <further-classification edition="200601120260228B">G02B5/20</further-classification>
        <further-classification edition="202101120260228B">G02B7/00</further-classification>
        <further-classification edition="200601120260228B">F16B1/00</further-classification>
        <further-classification edition="200601120260228B">H01F7/02</further-classification>
        <further-classification edition="200601120260228B">H01F7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商Ｒ　Ｐ　先靈爾科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>R.P. SCHERER TECHNOLOGIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史圖茲曼　陶德　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STUTZMAN, TODD ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥高斯基　馬修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKOWSKI, MATTHEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,563</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基於磁鐵的遮光系統及製造光敏產品的方法</chinese-title>
        <english-title>MAGNET-BASED LIGHT-BLOCKING SYSTEMS AND METHODS FOR MANUFACTURING LIGHT-SENSITIVE PRODUCTS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述用於將遮光膜附接至用於製造光敏產品之裝置之基於磁鐵之系統及方法。經構形以製造一光敏產品之一例示性基於磁鐵之裝置可包括一透明窗口、包括一UV阻擋劑之一膜，其中該膜經構形以阻擋UV光之至少一部分通過該透明窗口，以及經構形以將該膜附接至該裝置之複數個磁鐵。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are magnet-based systems and methods for attaching light-blocking films to devices for manufacturing light-sensitive products. An exemplary magnet-based device configured to manufacture a light-sensitive product can comprise a transparent window, a film comprising an UV blocker, wherein the film is configured to block at least a portion of UV light from passing through the transparent window, and a plurality of magnets configured to attach the film to the device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:裝置</p>
        <p type="p">103:製造腔室</p>
        <p type="p">104:透明窗口</p>
        <p type="p">106:遮光膜</p>
        <p type="p">108:磁鐵</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="810px" img-content="tif" inline="yes" orientation="portrait" width="630px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622107</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128132</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K14/575</main-classification>
        <further-classification edition="200601120260302B">A61K38/26</further-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61P3/00</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美國禮來大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELI LILLY AND COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　羅伯　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, ROBERT ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔻茲　古勒莫　Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORTEZ, GUILLERMO S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊因德爾　保羅　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLEINDL, PAUL JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康達辛赫　達罕松達蓋　努萬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDASINGHE, DAHAMSONDAGE NUWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
              <english-address>LK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅佩斯　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOPES, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆罕默德　費斯　阿麥德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOHAMMED, FAIZ AHMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆匹迪　亞維納許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUPPIDI, AVINASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯托克爾　大衛　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOKELL, DAVID JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,095</doc-number>
          <date>20240724</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>Fc-醯化多肽結合物</chinese-title>
        <english-title>FC-ACYLATED POLYPEPTIDE CONJUGATES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供包含治療多肽Fc結合物之化合物，其在GIP、GLP-1及升糖素受體中之一者或多者處具有活性。該等化合物具有在此等受體中之一者或多者處導致活性及延長作用持續時間之結構特徵。亦提供治療疾病及/或病狀(諸如肥胖、長期體重管理及2型糖尿病)之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Compounds comprising therapeutic polypeptide Fc conjugates are provided that have activity at one or more of the GIP, GLP-1 and glucagon receptors. The compounds have structural features resulting in activity and extended duration of action at one or more of these receptors. Methods also are provided for treating diseases and/or conditions such as obesity, chronic weight management, and type 2 diabetes mellitus.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10317.JPG" file="ed10317.JPG" height="726px" img-content="tif" inline="yes" orientation="portrait" width="919px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621667</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128144</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/36</main-classification>
        <further-classification edition="200601120260302B">A61K8/86</further-classification>
        <further-classification edition="200601120260302B">A61K8/85</further-classification>
        <further-classification edition="200601120260302B">A61K8/39</further-classification>
        <further-classification edition="200601120260302B">A61Q19/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芳珂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANCL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三譯秀樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIWAKE, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-176684</doc-number>
          <date>20241008</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>卸妝料</chinese-title>
        <english-title>CLEANSING AGENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種卸妝料，其為相對於卸妝料總量，含有51質量％以上之大量的水的系統，且去除化妝品汙垢的效果(洗淨力/完成洗淨的速度)優異。作為解決手段，本發明提供之卸妝料含有(A)HLB為8至13且烷基酯化度為1或2的非離子性界面活性劑、(B)烷基之碳鏈長為6的烷基甘油醚及/或烷基之碳鏈長為6的烷二醇、(C)相對於卸妝料總量，為51至95質量%的水。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An objective of the present invention is to provide a cleansing agent that is a system contains a large amount of water, at least 51% by mass, relative to the total amount of the cleansing agent, and exhibits excellent makeup stain removal effectiveness (cleansing power/cleansing completion speed). As a solution, the cleansing agent provided by the present invention includes (A) a nonionic surfactant with an HLB of 8 to 13 and a degree of alkyl esterification of 1 or 2, (B) an alkyl glyceryl ether having an alkyl carbon chain length of 6 and/or an alkanediol having an alkyl carbon chain length of 6, and (C) 51 to 95% by mass of water relative to the total amount of the cleansing agent.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622794</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128157</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120260226B">G06F30/398</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李智慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JIHYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賽彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SATBYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鉉在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, HYUNJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEONGRYEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鈴九</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNGGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0107079</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用圖案叢集方法之評估方法及模擬方法以及圖案叢集系統</chinese-title>
        <english-title>EVALUATION METHOD AND SIMULATION METHOD USING PATTERN CLUSTERING METHOD, AND PATTERN CLUSTERING SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種評估一積體電路之方法。該方法包括：獲得表示該積體電路之一佈局的多個圖案；基於該等多個圖案之幾何特徵及藉由模擬該等多個圖案之性質而獲得的模擬結果將該等多個圖案叢集化形成多個叢集；選擇該等多個叢集中之至少一個叢集中之各者的一代表性圖案；以及驗證至少一個叢集中之各者的該代表性圖案且基於此來評估該積體電路之效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a method of evaluating an integrated circuit. The method includes obtaining a plurality of patterns representing a layout of the integrated circuit; clustering the plurality of patterns into a plurality of clusters based on geometric features of the plurality of patterns, and simulation results obtained by simulating properties of the plurality of patterns; selecting a representative pattern of each of at least one cluster of the plurality of clusters; and verifying the representative pattern of each of at least one cluster and evaluating performance of the integrated circuit based on this.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:圖案叢集化系統</p>
        <p type="p">11:叢集化產生器</p>
        <p type="p">12:叢集化分析器</p>
        <p type="p">13:代表性圖案產生器</p>
        <p type="p">RP:代表性圖案</p>
        <p type="p">X:圖案影像</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="475px" img-content="tif" inline="yes" orientation="portrait" width="671px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622086</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128165</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D513/04</main-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商田邊三菱製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI TANABE PHARMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石毛孝征</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIGE, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福永謙二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUNAGA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松平鉄二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDAIRA, TETSUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>四辻慶佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOTSUJI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬戸雅之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SETO, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-118891</doc-number>
          <date>20240724</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>（２Ｒ）－Ｎ－芐基－１－［５－（２－氟丙烷－２－基）－７－側氧基－６，７－二氫［１，３］噻唑［５，４－ｄ］嘧啶－２－基］吡咯啶－２－甲醯胺的新穎結晶及其製造方法</chinese-title>
        <english-title>NOVEL CRYSTAL FORM OF (2R)-N-BENZYL-1-[5-(2-FLUOROPROPAN-2-YL)-7-OXO-6,7-DIHYDRO[1,3]THIAZOLO[5,4-D]PYRIMIDIN-2-YL]PYRROLIDINE-2-CARBOXAMIDE AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供以例如選自粉末X射線繞射光譜中之特定的繞射峰及示差掃描量熱法中之特定的吸熱峰之至少1種物理化學性質為特徵之(2R)-N-苄基-1-[5-(2-氟丙烷-2-基)-7-側氧基-6,7-二氫[1,3]噻唑[5,4-d]嘧啶-2-基]吡咯啶-2-甲醯胺的C型結晶及D型結晶、含有其等之醫藥組成物、其等的製造方法、包含此結晶及/或醫藥組成物之醫療用套組以及此結晶及醫藥組成物的醫藥用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides C-type and D-type crystals of (2R)-N-benzyl-1-[5-(2-fluoropropan-2-yl)-7-oxo-6,7-dihydro[1,3]thiazolo[5,4-d]pyrimidin-2-yl]pyrrolidine-2-carboxamide, characterized by at least one physicochemical property, such as specific diffraction peaks in powder X-ray diffraction spectra and specific endothermic peaks in differential scanning calorimetry, pharmaceutical compositions containing them, methods for their manufacture, medical kits comprising these crystals and/or pharmaceutical compositions, and medical uses of these crystals and pharmaceutical compositions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622064</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128193</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D405/04</main-classification>
        <further-classification edition="200601120260302B">C07D405/14</further-classification>
        <further-classification edition="200601120260302B">C07D409/14</further-classification>
        <further-classification edition="200601120260302B">C07D405/10</further-classification>
        <further-classification edition="200601120260302B">C07D409/10</further-classification>
        <further-classification edition="200601120260302B">C07D307/91</further-classification>
        <further-classification edition="200601120260302B">C07D407/12</further-classification>
        <further-classification edition="200601120260302B">C09K11/06</further-classification>
        <further-classification edition="202301120260302B">H10K85/60</further-classification>
        <further-classification edition="202301120260302B">H10K50/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＴ素材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LT MATERIALS CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正娥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JEONG A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牟晙兌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MO, JUN TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔大赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, DAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0125716</doc-number>
          <date>20240913</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>雜環化合物、包括雜環化合物的有機發光裝置和用於有機材料層的組合物</chinese-title>
        <english-title>HETEROCYCLIC COMPOUND, ORGANIC LIGHT EMITTING DEVICE COMPRISING THE SAME AND COMPOSITION FOR ORGANIC MATERIAL LAYER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及由化學式1表示的雜環化合物、包括雜環化合物的有機發光裝置和用於有機材料層的組合物。所述雜環化合物由下面的化學式1表示：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="360px" width="438px" file="ed10480.JPG" alt="ed10480.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;在化學式1中，各取代基的定義與說明書所定義的相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a heterocyclic compound represented by Chemical Formula 1, an organic light emitting device including the same, and a composition for an organic material layer. The heterocyclic compound represented by the following Chemical Formula 1: &lt;br/&gt;&lt;br/&gt; &lt;img align="absmiddle" height="377px" width="411px" file="ed10481.JPG" alt="ed10481.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;in Chemical Formula 1, The definitions of each substituent are the same as those defined in the specification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">200:正電極</p>
        <p type="p">300:有機材料層</p>
        <p type="p">400:負電極</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10483.JPG" file="ed10483.JPG" height="468px" img-content="tif" inline="yes" orientation="portrait" width="616px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622070</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128201</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D413/12</main-classification>
        <further-classification edition="200601120260302B">C07D413/14</further-classification>
        <further-classification edition="200601120260302B">A61K31/422</further-classification>
        <further-classification edition="200601120260302B">A61K31/506</further-classification>
        <further-classification edition="200601120260302B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳信立泰藥業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN SALUBRIS PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴　英傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YINGJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田澤兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, ZEBING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂曉亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUE, XIAOLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向傑豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIANG, JIEHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇少彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, SHAOBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱曉莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, XIAOLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>肖瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段振芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUAN, ZHENFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉文娟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, WENJUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110085936</doc-number>
          <date>20240725</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>202411445380X</doc-number>
          <date>20241015</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2024118169179</doc-number>
          <date>20241209</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2025108903476</doc-number>
          <date>20250630</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>2025109834204</doc-number>
          <date>20250716</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種取代的血管收縮肽和內皮肽受體拮抗劑及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明屬於化學藥物技術領域，提供了一種取代的血管收縮肽和內皮肽受體拮抗劑化合物及其製備方法和醫藥用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10570.JPG" file="ed10570.JPG" height="456px" img-content="tif" inline="yes" orientation="portrait" width="712px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622237</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128203</doc-number>
          <kind></kind>
          <date>114/07/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201001120260302B">C12N15/113</main-classification>
        <further-classification edition="200601120260302B">A61K31/713</further-classification>
        <further-classification edition="201701120260302B">A61K47/54</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="200601120260302B">A61P3/00</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
        <further-classification edition="200601120260302B">A61P1/16</further-classification>
      </classification-ipc>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>大陸商齊魯製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QILU PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商山東安舜製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANDONG ANSHUN PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>盧昱辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YUCHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特拉維斯　格里姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAVIS, GRIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　科明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, KEMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶　維康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, WEIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/107839</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2025109981203</doc-number>
          <date>20250718</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025109980732</doc-number>
          <date>20250718</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ｉＲＮＡ組合物及其使用方法</chinese-title>
        <english-title>IRNA COMPOSITION AND METHOD OF USING SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種iRNA組合物及其使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses an iRNA composition and method of using same.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.JPG" file="ed10027.JPG" height="505px" img-content="tif" inline="yes" orientation="portrait" width="596px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623386</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128224</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/01</main-classification>
        <further-classification edition="202501120260302B">H10D64/23</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
        <further-classification edition="202601120260302B">H10W20/42</further-classification>
        <further-classification edition="202601120260302B">H10W20/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張相信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SANGSHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭元根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, WONKEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYOUNGHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KANG-ILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,478</doc-number>
          <date>20240805</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/067,247</doc-number>
          <date>20250228</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括埋入式背面隔離結構和自對準背面接觸結構的半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INCLUDING BURIED BACKSIDE ISOLATION STRUCTURE AND SELF-ALIGNED BACKSIDE CONTACT STRUCTURE AND MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供半導體裝置包括：通道結構；通道結構上的閘極結構；閘極結構上的背面隔離結構；背面隔離結構的下側表面上的對準間隔層，對準間隔層包括與背面隔離結構不同的材料；通道結構上的源極/汲極圖案；以及源極/汲極圖案上的背面接觸結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a semiconductor device including: a channel structure; a gate structure on the channel structure; a backside isolation structure on the gate structure; an alignment spacer layer on a lower side surface of the backside isolation structure, the alignment spacer layer comprising a material different from the backside isolation structure; a source/drain pattern on the channel structure; and a backside contact structure on the source/drain pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:中間半導體裝置</p>
        <p type="p">105:STI結構</p>
        <p type="p">110:通道結構</p>
        <p type="p">115:閘極結構</p>
        <p type="p">120:源極/汲極圖案</p>
        <p type="p">125:前側隔離結構</p>
        <p type="p">128:第一襯層</p>
        <p type="p">140:背面隔離結構</p>
        <p type="p">170:背面接觸結構</p>
        <p type="p">D1,D2,D3:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.png" file="d10025.TIF" giffile="ed10025.png" height="503px" img-content="tif" inline="yes" orientation="portrait" width="617px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621594</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128257</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">A44B19/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＹＫＫ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YKK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小澤貴敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZAWA, TAKANORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/027039</doc-number>
          <date>20240729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>滑件及包含其之拉鏈</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之滑件(9)之第1及第2引導部(6、7)包含於滑件主要部分(4)之寬度方向上互相對向之第1及第2鏈齒引導面(65、75)。第1及第2鏈齒引導面(65、75)具有適合引導以單絲為基準之拉鏈鏈齒之形狀。滑件(9)之第2翼板(42)具有偏移緣(21)，該偏移緣(21)與最遠離中心線(CL)之第1側緣(11)之最遠位置(11f)相比，更於滑件主要部分(4)之寬度方向上靠向中心線(CL)偏移。偏移緣(21)於第2翼板(42)之前緣(23)與第2翼板(42)之後緣(24)之間延伸。偏移緣(21)與第2翼板(42)之前緣(23)之連接點(P1)於與中心線(CL)平行之方向上位於較第1鏈齒引導面(65)之前端更前方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">6:第1引導部</p>
        <p type="p">6a:前表面</p>
        <p type="p">6b:內側面</p>
        <p type="p">6c:外側面</p>
        <p type="p">6d:端面</p>
        <p type="p">7:第2引導部</p>
        <p type="p">7a:前表面</p>
        <p type="p">7b:內側面</p>
        <p type="p">7c:外側面</p>
        <p type="p">7d:端面</p>
        <p type="p">7z:緣</p>
        <p type="p">8:第3引導部</p>
        <p type="p">9:滑件</p>
        <p type="p">21:偏移緣</p>
        <p type="p">29:傾斜面</p>
        <p type="p">41:第1翼板</p>
        <p type="p">42:第2翼板</p>
        <p type="p">45:傾斜面</p>
        <p type="p">63:第1側面</p>
        <p type="p">64:第1側面</p>
        <p type="p">65:第1鏈齒引導面</p>
        <p type="p">65j:端邊</p>
        <p type="p">66:退避面</p>
        <p type="p">66a:第1緣</p>
        <p type="p">66b:第2緣</p>
        <p type="p">66c:第3緣</p>
        <p type="p">66m:前區域</p>
        <p type="p">66n:後區域</p>
        <p type="p">67:第2側面</p>
        <p type="p">68:第2側面</p>
        <p type="p">75:第2鏈齒引導面</p>
        <p type="p">G1:鏈布插通槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="430px" img-content="tif" inline="yes" orientation="portrait" width="609px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622043</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128263</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D207/48</main-classification>
        <further-classification edition="200601120260302B">C07D401/04</further-classification>
        <further-classification edition="200601120260302B">C07D403/04</further-classification>
        <further-classification edition="200601120260302B">C07D401/12</further-classification>
        <further-classification edition="200601120260302B">C07D401/14</further-classification>
        <further-classification edition="200601120260302B">C07D403/12</further-classification>
        <further-classification edition="200601120260302B">A61K31/40</further-classification>
        <further-classification edition="200601120260302B">A61K31/4439</further-classification>
        <further-classification edition="200601120260302B">A61K31/506</further-classification>
        <further-classification edition="200601120260302B">A61K31/498</further-classification>
        <further-classification edition="200601120260302B">A61K31/444</further-classification>
        <further-classification edition="200601120260302B">A61P1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商一洋药品有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IL-YANG PHARM. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭裕錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, YOO SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申在洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, JAE SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李俊淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUN YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙貴亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, KWI HYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金希姸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HEE YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鍾倬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JONG TAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙民濟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, MIN JE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鎬銀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, HO EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜周延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, JU YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李澈重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHEOL JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林在赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JAE HYEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李動潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金喜範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HEE BUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金相潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANG YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="17">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金希鍾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HEE JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="18">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOON SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="19">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱玹秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JU, HYUN SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="20">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林惠慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, HAE KYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="21">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WON JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0103324</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化合物、其醫藥上可接受之鹽及醫藥組合物</chinese-title>
        <english-title>COMPOUND, PHARMACEUTICALLY ACCEPTABLE SALT THEREOF, AND PHARMATCEUTICAL COMPOSITION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種表現質子泵抑制活性的新4-環丙基吡咯衍生物，特別係關於一種表現優異質子泵抑制活性的4-環丙基吡咯衍生物或醫藥上可接受之鹽，以及其預防或治療消化道發炎疾病或胃酸相關疾病的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to novel 4-cyclopropyl pyrrole derivatives exhibiting proton pump inhibitory activity, and more particularly to 4-cyclopropyl pyrrole derivatives or pharmaceutically acceptable salts thereof exhibiting superior proton pump inhibitory activity, and their use in the prevention or treatment of gastrointestinal tract inflammatory diseases or gastric acid-related diseases.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621569</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128270</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">A23C20/02</main-classification>
        <further-classification edition="200601120260302B">A23J3/14</further-classification>
        <further-classification edition="201601120260302B">A23L29/206</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雪印惠乳業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEGMILK SNOW BRAND CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙澤千智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAZAWA, CHISATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀切良絵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIKIRI, YOSHIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下村純美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOMURA, ATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>太田丈尋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTA, TAKEHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-121344</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-121345</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>乾酪狀食品及乾酪狀食品之製造方法</chinese-title>
        <english-title>CHEESE-LIKE FOOD AND METHOD FOR PRODUCING CHEESE-LIKE FOOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題在於提供一種具備填充適性及較佳的口感之含有植物性蛋白質之乾酪狀食品及該乾酪狀食品之製造方法。  &lt;br/&gt;前述課題能夠藉由下述而解決：乾酪狀食品含有澱粉、水分、油脂、乳化劑、及植物性蛋白質材料，以極度硬化油相對於總油脂之質量比成為0.05以上且未達0.30之量含有前述極度硬化油作為油脂的一部分。又，前述課題亦能夠藉由下述而解決：乾酪狀食品含有澱粉、水分、油脂、乳化劑、瓊脂、及植物性蛋白質材料，以相對於乾酪狀食品而言成為0.1質量%以上3.0質量%以下之量含有瓊脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623048</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128284</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡里諾夫斯基　伊利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KALINOVSKI, ILIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊子昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, ZICHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭順旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, SOONWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多達哈努邁亞　德瓦拉賈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DODDAHANUMAIAH, DEVARAJA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　偉義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, WEI YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅　世禮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUI, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱克希　依曼徐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOKSHI, HIMANSHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派特森　亞歷山大　米勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATERSON, ALEXANDER MILLER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福姆拉　德魯夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOMRA, DHRUV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,698</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>利用遠程電漿的基板處理系統的脈衝DC偏壓</chinese-title>
        <english-title>PULSED DC BIAS FOR SUBSTRATE PROCESSING SYSTEM WITH REMOTE PLASMA</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種遠程電漿處理系統包含電漿產生器，其配置成在處理腔室的上部區域中產生電漿。雙氣體擴散裝置係安置在處理腔室的上部區域和下部區域之間。雙氣體擴散裝置係配置成將來自上部區域的亞穩態物種和離子供應至下部區域，並以與亞穩態物種和離子分開的方式將反應氣體供應至下部區域。基板支撐件係安置於遠程電漿處理系統的下部區域中，並包含電阻式加熱器。第一電壓源係配置成將電力供應至電阻式加熱器。脈衝DC電壓源係配置成將脈衝DC偏壓供應至電阻式加熱器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A remote plasma processing system includes a plasma generator configured to generate plasma in an upper region of a processing chamber. A dual gas diffusing device is arranged between the upper region and a lower region of the processing chamber. The dual gas diffusing device is configured to supply metastable species and ions from the upper region to the lower region and a reactant gas to the lower region separately from the metastable species and ions. A substrate support is arranged in the lower region of the remote plasma processing system and includes a resistive heater. A first voltage source is configured to supply power to the resistive heater. A pulsed DC voltage source is configured to supply a pulsed DC bias to the resistive heater.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板處理系統</p>
        <p type="p">110:處理腔室</p>
        <p type="p">112:上部區域</p>
        <p type="p">114:雙氣體擴散裝置</p>
        <p type="p">116:下部區域</p>
        <p type="p">120:基板支撐件</p>
        <p type="p">124:最小接觸面積(MCA)凸部</p>
        <p type="p">128:電阻式加熱器</p>
        <p type="p">130:基板</p>
        <p type="p">134:電漿產生系統</p>
        <p type="p">135:感應線圈</p>
        <p type="p">136:RF源</p>
        <p type="p">138:匹配網路</p>
        <p type="p">140:第一氣體輸送系統</p>
        <p type="p">146:第二氣體輸送系統</p>
        <p type="p">154:節流閥</p>
        <p type="p">156:泵浦</p>
        <p type="p">164:加熱器控制器</p>
        <p type="p">170:控制器</p>
        <p type="p">172:脈衝DC源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="769px" img-content="tif" inline="yes" orientation="portrait" width="1013px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622233</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128290</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/10</main-classification>
        <further-classification edition="200601120260302B">C12N15/90</further-classification>
        <further-classification edition="200601120260302B">C12N9/22</further-classification>
        <further-classification edition="201801120260302B">C12Q1/6811</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德勒斯登工業大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNISCHE UNIVERSITAET DRESDEN KOERPERSCHAFT DES OEFFENTLICHEN RECHTS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅荷羅曼諾斯　特蕾莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROJO ROMANOS, TERESA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施耐德　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHNEIDER, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭辛　菲利克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANSING, FELIX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布赫霍爾茨　法蘭克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BUCHHOLZ, FRANK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24191012.4</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>修飾具有不對稱目標位點之核酸序列</chinese-title>
        <english-title>MODIFYING NUCLEIC ACID SEQUENCES HAVING ASYMMETRIC TARGET SITES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及修飾具有不對稱目標位點的核酸序列。具體地，本發明提供了一種方法，用於將包含在雙股供體核酸中的感興趣雙股核酸序列（nucleic acid sequence of interest ，NAI）插入雙股受體核酸中，並視需要地將包含在雙股受體核酸中的待替換核酸序列（nucleic acid sequence to be replaced，NAR）替換為NAI，其中供體核酸和受體核酸中的第一目標位點的第一半位點在至少一個核苷酸上有所不同，並且如果需要替換NAR，則供體核酸和受體核酸中的第二目標位點的第二半位點在至少一個核苷酸上有所不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to modifying nucleic acid sequences having asymmetric target sites. Specifically, the present invention provides a method for inserting a double stranded nucleic acid sequence of interest (NAI) comprised in a double stranded donor nucleic acid into a double stranded acceptor nucleic acid, optionally exchanging a nucleic acid sequence to be replaced (NAR) comprised in the double stranded acceptor nucleic acid by the NAI, wherein the first half sites of the first target sites in the donor nucleic acid and the acceptor nucleic acid differ in at least one nucleotide, and, if a NAR is to be exchanged, the second half sites of the second target sites in the donor nucleic acid and the acceptor nucleic acid differ in at least one nucleotide.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621894</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128297</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120251201B">B32B7/023</main-classification>
        <further-classification edition="200601120251201B">B32B7/12</further-classification>
        <further-classification edition="200601120251201B">C09J11/04</further-classification>
        <further-classification edition="200601120251201B">C09J201/00</further-classification>
        <further-classification edition="200601120251201B">G02B5/30</further-classification>
        <further-classification edition="200601120251201B">G02F1/13363</further-classification>
        <further-classification edition="200601120251201B">G09F9/30</further-classification>
        <further-classification edition="200601120251201B">H05B33/02</further-classification>
        <further-classification edition="202301120251201B">H10K50/11</further-classification>
        <further-classification edition="202301120251201B">H10K50/86</further-classification>
        <further-classification edition="202301120251201B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原情菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, MOTONA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206866</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積層光學薄膜及影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種積層光學薄膜，係依序積層有第1光學薄膜、第1接著劑層、第2光學薄膜、第2接著劑層及第3光學薄膜者；且，第1接著劑層及第2接著劑層係含有硬化性成分及金屬氧化物粒子之積層光學薄膜用接著劑組成物之硬化物層。第1接著劑層及第2接著劑層之折射率宜皆為1.55以上。第1光學薄膜及第2光學薄膜之折射率宜皆為1.55以上。第1光學薄膜及第2光學薄膜宜皆為液晶系相位差薄膜，且第3光學薄膜宜為至少具備偏光件之偏光薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第1光學薄膜</p>
        <p type="p">2:第2光學薄膜</p>
        <p type="p">3:第3光學薄膜</p>
        <p type="p">4:第1接著劑層</p>
        <p type="p">5:第2接著劑層</p>
        <p type="p">6:黏著劑層</p>
        <p type="p">7:有機發光二極體面板</p>
        <p type="p">10:積層光學薄膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="432px" img-content="tif" inline="yes" orientation="portrait" width="643px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621895</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128298</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120260115B">B32B7/023</main-classification>
        <further-classification edition="200601120260115B">B32B7/12</further-classification>
        <further-classification edition="201801120260115B">C09J7/30</further-classification>
        <further-classification edition="200601120260115B">G02B1/04</further-classification>
        <further-classification edition="200601120260115B">G02F1/1335</further-classification>
        <further-classification edition="202301120260115B">H10K77/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石田雅子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIDA, MASAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206864</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積層光學薄膜及影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明課題在於提供一種積層光學薄膜及具備該積層光學薄膜之影像顯示裝置，該積層光學薄膜之干涉不均受到抑制，且視辨性優異。&lt;br/&gt;  作為其解決手段，一種積層光學薄膜，係依序積層有第1光學薄膜、黏著劑層、第2光學薄膜、接著劑層及第3光學薄膜者；黏著劑層之厚度為3000~20000nm；且，接著劑層係含有硬化性成分及金屬氧化物粒子之積層光學薄膜用接著劑組成物之硬化物層。接著劑層之厚度宜為100~3000nm。黏著劑層及接著劑層之折射率宜皆為1.52以上。第1光學薄膜及第2光學薄膜之折射率宜皆為1.55以上。第1光學薄膜及第2光學薄膜宜皆為液晶系相位差薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第1光學薄膜</p>
        <p type="p">2:第2光學薄膜</p>
        <p type="p">3:第3光學薄膜</p>
        <p type="p">4:黏著劑層</p>
        <p type="p">5:接著劑層</p>
        <p type="p">6:第2黏著劑層</p>
        <p type="p">7:有機發光二極體面板</p>
        <p type="p">10:積層光學薄膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="312px" img-content="tif" inline="yes" orientation="portrait" width="559px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622542</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128299</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">G02B1/04</main-classification>
        <further-classification edition="201901120251201B">B32B7/023</further-classification>
        <further-classification edition="200601120251201B">B32B7/12</further-classification>
        <further-classification edition="200601120251201B">G02B5/30</further-classification>
        <further-classification edition="200601120251201B">C09J183/04</further-classification>
        <further-classification edition="200601120251201B">C09J133/10</further-classification>
        <further-classification edition="202301120251201B">H10K59/38</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原情菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, MOTONA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206874</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積層光學薄膜及影像顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明課題在於提供一種積層光學薄膜及具備該積層光學薄膜之影像顯示裝置，該積層光學薄膜之干涉不均受到抑制，且視辨性優異。&lt;br/&gt;  作為解決手段，一種積層光學薄膜，係依序積層有第1光學薄膜、第1接著劑層、第2光學薄膜、第2接著劑層及第3光學薄膜者；第1接著劑層係有機矽化合物系接著劑之硬化物層，該有機矽化合物系接著劑具有選自於由矽醇基及烷氧矽基所構成群組中之至少1種反應性基；且，第2接著劑層係含有硬化性成分及金屬氧化物粒子之積層光學薄膜用接著劑組成物之硬化物層。第1接著劑層之厚度宜為1~300nm，第2接著劑層之厚度宜為100~3000nm。第1光學薄膜及第2光學薄膜宜皆為液晶系相位差薄膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第1光學薄膜</p>
        <p type="p">2:第2光學薄膜</p>
        <p type="p">3:第3光學薄膜</p>
        <p type="p">4:第1接著劑層</p>
        <p type="p">5:第2接著劑層</p>
        <p type="p">6:黏著劑層</p>
        <p type="p">7:有機發光二極體面板</p>
        <p type="p">10:積層光學薄膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="410px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623049</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128301</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="202601120260302B">H10P72/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里斯納帕　薩蒂莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAPPA, SATHISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達斯　索瑞什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAS, SAURISH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡尼夫　賈斯汀　查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANNIFF, JUSTIN CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　承翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, BENNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬侯羅　丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAROHL, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/678,461</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>針對更佳溫度均勻性及控制的高溫ESC</chinese-title>
        <english-title>HIGH TEMPERATURE ESC FOR BETTER TEMPERATURE UNIFORMITY AND CONTROL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於電漿處理腔室的靜電吸盤 （ESC），包括具有複數個冷卻劑通道以多個階段設置的一底板，以及具有至少多層射頻 （RF） 柵格層以從 RF 源傳輸 RF 功率，和多區加熱器層以向晶圓提供熱量的一介電板。ESC 內部定義了複數個多孔插塞，以用於輸送導電氣體以填充 ESC 與接收用於處理的晶圓之間的間隙，從而實現向晶圓的均勻熱傳遞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrostatic chuck (ESC) for use in a plasma processing chamber includes a baseplate with a plurality of coolant channels disposed in multiple steps and a dielectric plate with at least a multi-layer radio frequency (RF) grid layer to deliver RF power from an RF source and a multi-zone heater layer to provide heat to the wafer. A plurality of porous plugs are defined within the ESC to deliver conductive gas to fill a gap between the ESC and a wafer received for processing so as to enable uniform heat transfer to the wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">19:邊緣環</p>
        <p type="p">20:靜電吸盤(ESC)</p>
        <p type="p">101:底板</p>
        <p type="p">101a:底部表面</p>
        <p type="p">101b:頂部表面</p>
        <p type="p">101c:側邊</p>
        <p type="p">102:介電板/陶瓷板</p>
        <p type="p">103:加熱器層</p>
        <p type="p">104:射頻(RF)柵格層</p>
        <p type="p">105:多孔插塞</p>
        <p type="p">106:接合層</p>
        <p type="p">107:冷卻劑通道</p>
        <p type="p">108:RF墊圈</p>
        <p type="p">110:邊緣密封O形環</p>
        <p type="p">111:熱噴塗</p>
        <p type="p">121:運動學支撐銷/凸台</p>
        <p type="p">122:ESC對晶圓間隙</p>
        <p type="p">132:第二密封O形環</p>
        <p type="p">s1:第一階段</p>
        <p type="p">s2:第二階段</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="629px" img-content="tif" inline="yes" orientation="portrait" width="951px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621694</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128327</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/5517</main-classification>
        <further-classification edition="200601120260302B">A61P25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾尼納製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARENA PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐里維羅　查維克　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OREVILLO, CHADWICK J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱伊　藍多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAYE, RANDALL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯里尼瓦斯　努吉哈利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRINIVAS, NUGGEHALLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,964</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>治療方法</chinese-title>
        <english-title>METHODS OF TREATMENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了治療方法，該等治療方法包括向有需要的患者投予5-羥色胺（HT）&lt;sub&gt;2C&lt;/sub&gt;受體促效劑。示例性方法包括治療或預防有需要的患者的5-羥色胺（HT）&lt;sub&gt;2C&lt;/sub&gt;受體相關障礙，其中該方法包括向該患者投予(&lt;i&gt;R&lt;/i&gt;)-N-(2,2-二氟乙基)-7-甲基-l,2,3,4,6,7-六氫-[l,4]二氮呯并[6,7,l-&lt;i&gt;hi&lt;/i&gt;]吲哚-8-甲醯胺（化合物1）或其藥學上可接受的鹽，其中化合物1或其藥學上可接受的鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are treatment methods including administering a 5-hydroxytryptamine (HT)&lt;sub&gt;2C&lt;/sub&gt; receptor agonist to a patient in need thereof. An exemplary method includes treating or preventing a 5-hydroxytryptamine (HT)&lt;sub&gt;2C&lt;/sub&gt; receptor-associated disorder in a patient in need thereof, wherein the method comprises administering to the patient (&lt;i&gt;R&lt;/i&gt;)-N-(2,2-difluoroethyl)-7-methyl-l,2,3,4,6,7-hexahydro-[l,4]diazepino[6,7,l-&lt;i&gt;hi&lt;/i&gt;]indole-8-carboxamide (Compound 1), or a pharmaceutically acceptable salt thereof, wherein Compound 1, or a pharmaceutically acceptable salt thereof.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="471px" img-content="tif" inline="yes" orientation="portrait" width="783px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622513</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128331</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G01R1/067</main-classification>
        <further-classification edition="200601120260224B">G01R1/073</further-classification>
        <further-classification edition="200601120260224B">G01R1/36</further-classification>
        <further-classification edition="200601120260224B">G01R31/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商色拉頓系統公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CELADON SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伊爾　道爾頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROEHL, DALTON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特蘭坤洛　加勒特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRANQUILLO, GARRETT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史奇賽爾　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHISEL, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫希普　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINSHIP, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,872</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶圓測試環境中的電弧抑制</chinese-title>
        <english-title>ARC SUPPRESSION IN A WAFER TESTING ENVIRONMENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">測試一半導體裝置之效能包含：經由一剛性氣體歧管將來自一外部源之一經加熱氣體重新引導至一封閉探針卡總成中以靠近一被測裝置(DUT)產生一加壓區；及經由一剛性回流氣體歧管使該經加熱氣體之一取樣自該加壓區回流至該封閉探針總成外部之一控制器裝置。在壓力及溫度之一範圍內注入該經加熱氣體以增加該DUT上之電弧抑制，且在該控制器處監測該經加熱氣體之該壓力及該溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Testing performance of a semiconductor device includes redirecting a heated gas from an external source into a closed probe card assembly via a rigid gas manifold to create a pressurized region proximate to a device under test (DUT) and returning a sampling of the heated gas from the pressurized region to a controller device external to the closed probe assembly via a rigid return gas manifold. The heated gas is injected within a range of pressure and temperature to increase arc suppression on the DUT, and the pressure and the temperature of the heated gas is monitored at the controller.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:氣體加熱器總成/氣體加熱器</p>
        <p type="p">110:氣體入口埠</p>
        <p type="p">115:回流氣體埠</p>
        <p type="p">120:剛性氣體歧管</p>
        <p type="p">125:剛性回流氣體歧管</p>
        <p type="p">130:氣體管線</p>
        <p type="p">135:回流氣體管線</p>
        <p type="p">140:蓋</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="733px" img-content="tif" inline="yes" orientation="portrait" width="882px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623321</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128341</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">H05K1/05</main-classification>
        <further-classification edition="200601120260226B">H05K1/11</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幸内貴耶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOUCHI, TAKAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田周作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, SHUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平田真樹子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATA, MAKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-125132</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>配線電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之配線電路基板1具備配線部2、及支持配線部2之一端部之第1支持部3A。配線部2具有金屬支持層11、導體層12、第1絕緣層13、及配線143A。金屬支持層11之厚度T1相對於金屬支持層11之寬度W1之比率(T1/W1)未達1。導體層12於金屬支持層11之厚度方向上，配置於金屬支持層11之一側表面S1上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:配線電路基板</p>
        <p type="p">2:配線部</p>
        <p type="p">3:支持部</p>
        <p type="p">3A:第1支持部</p>
        <p type="p">3B:第2支持部</p>
        <p type="p">11:金屬支持層</p>
        <p type="p">12:導體層</p>
        <p type="p">13:第1絕緣層(絕緣層之一例)</p>
        <p type="p">14:電路圖案(第1電路圖案之一例)</p>
        <p type="p">15:第2絕緣層</p>
        <p type="p">141A:端子(第1端子之一例)</p>
        <p type="p">142A:端子</p>
        <p type="p">143A:配線</p>
        <p type="p">143B:配線</p>
        <p type="p">E:外周端部</p>
        <p type="p">S1:金屬支持層之一側表面</p>
        <p type="p">T1:金屬支持層之厚度</p>
        <p type="p">T2:導體層之厚度</p>
        <p type="p">W1:第2方向上之金屬支持層之尺寸</p>
        <p type="p">W2:第2方向上之導體層之尺寸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="812px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622077</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128356</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D471/18</main-classification>
        <further-classification edition="200601120260302B">C07D487/18</further-classification>
        <further-classification edition="200601120260302B">C07D519/00</further-classification>
        <further-classification edition="200601120260302B">C07D491/22</further-classification>
        <further-classification edition="200601120260302B">C07D471/22</further-classification>
        <further-classification edition="200601120260302B">C07D487/22</further-classification>
        <further-classification edition="200601120260302B">A61K31/55</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海瀚辰星泰醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI PEPTIDSTAR THERAPEUTICS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王中利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHONGLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　海兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, HAIBING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭淑春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, SHUCHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉力鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LIFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110156715</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024114545214</doc-number>
          <date>20241017</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2024116549277</doc-number>
          <date>20241119</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2024119514034</doc-number>
          <date>20241227</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>2025100177809</doc-number>
          <date>20250106</date>
        </priority-claim>
        <priority-claim sequence="6">
          <country>中國大陸</country>
          <doc-number>2025100716984</doc-number>
          <date>20250116</date>
        </priority-claim>
        <priority-claim sequence="7">
          <country>中國大陸</country>
          <doc-number>2025101104203</doc-number>
          <date>20250123</date>
        </priority-claim>
        <priority-claim sequence="8">
          <country>中國大陸</country>
          <doc-number>2025102117056</doc-number>
          <date>20250225</date>
        </priority-claim>
        <priority-claim sequence="9">
          <country>中國大陸</country>
          <doc-number>2025102250156</doc-number>
          <date>20250227</date>
        </priority-claim>
        <priority-claim sequence="10">
          <country>中國大陸</country>
          <doc-number>2025102638886</doc-number>
          <date>20250306</date>
        </priority-claim>
        <priority-claim sequence="11">
          <country>中國大陸</country>
          <doc-number>2025103352867</doc-number>
          <date>20250320</date>
        </priority-claim>
        <priority-claim sequence="12">
          <country>中國大陸</country>
          <doc-number>2025104196813</doc-number>
          <date>20250403</date>
        </priority-claim>
        <priority-claim sequence="13">
          <country>中國大陸</country>
          <doc-number>2025105653572</doc-number>
          <date>20250430</date>
        </priority-claim>
        <priority-claim sequence="14">
          <country>中國大陸</country>
          <doc-number>2025110094215</doc-number>
          <date>20250721</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種多環化合物及其製備方法和應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種多環化合物及其製備方法和應用。本發明的多環化合物有如式(A-I)所示化合物、其立體異構體或其藥學上可接受的鹽，其可作為人類TNFα活性的有效調節劑，應用前景良好。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="195px" width="321px" file="ed13007.JPG" alt="ed13007.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621733</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128366</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/395</main-classification>
        <further-classification edition="200601120260302B">C07K16/18</further-classification>
        <further-classification edition="200601120260302B">A61B5/055</further-classification>
        <further-classification edition="200601120260302B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛爾蘭商歐薩爾普羅席納有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTHAIR PROTHENA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
              <english-address>IE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎保　布萊恩　麥克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAMPBELL, BRIAN MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦森　查德　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWANSON, CHAD JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩果　瓦格奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZAGO, WAGNER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,246</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/676,249</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/676,253</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>以抗類澱粉β（ＡＢＥＴＡ）抗體治療神經病症之方法</chinese-title>
        <english-title>METHODS OF TREATING NEUROLOGICAL DISORDERS WITH ANTI-ABETA ANTIBODIES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供治療人類個體之類澱粉生成性疾病之方法，包括用於偵測及管理類澱粉相關成像異常(ARIA)之監測方案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of treating amyloidogenic disorders in a human subject including monitoring regimes for detection and management of Amyloid Related Imaging Abnormality (ARIA) are provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623408</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128367</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/10</main-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="200601120260302B">G11C5/14</further-classification>
        <further-classification edition="200601120260302B">G11C11/40</further-classification>
        <further-classification edition="201101120260302B">B82Y30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都楨湖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DO, JUNGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>全相仲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, SANGJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南乾佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAM, GEONWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪炫圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOU, HYEONGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭珉在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, MINJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙財喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, JAEHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0167749</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括合併奈米片的積體電路</chinese-title>
        <english-title>INTEGRATED CIRCUIT INCLUDING MERGED NANOSHEET</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容係關於一種包括一合併奈米片之積體電路。一示例性積體電路包括在一第一方向上彼此相鄰之一功能胞元及一分接頭胞元。該功能胞元包括複數個奈米片，該等複數個奈米片中之各者在該第一方向上延伸，且各自在與該第一方向相交之一第二方向上具有一第一寬度。該分接頭胞元包括具有一第一傳導型式之一第一井、至少一個合併奈米片，以及經組配以向該第一井施加一第一供應電壓之至少一個第一通孔。該至少一個合併奈米片在該第一方向上延伸，且在該第二方向上具有大於該第一寬度之一第二寬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an integrated circuit including a merged nanosheet. An example integrated circuit includes a function cell and a tap cell adjacent to each other in a first direction. The function cell includes a plurality of nanosheets, each of the plurality of nanosheets extending in the first direction and each having a first width in a second direction intersecting the first direction. The tap cell includes a first well having a first conductivity type, at least one merged nanosheet, and at least one first via configured to apply a first supply voltage to the first well. The at least one merged nanosheet extends in the first direction and has a second width that is greater than the first width in the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10a:分接頭胞元</p>
        <p type="p">BD:胞元邊界</p>
        <p type="p">H:第一胞元高度</p>
        <p type="p">mNS:合併奈米片</p>
        <p type="p">N+:N+型區，第一雜質區</p>
        <p type="p">nNS:正常奈米片</p>
        <p type="p">NS:奈米片</p>
        <p type="p">NTAP:井分接頭，N分接頭，第一分接頭</p>
        <p type="p">NW:第一井，N井</p>
        <p type="p">P+:P+型區，第二雜質區</p>
        <p type="p">PTAP:基體分接頭，P分接頭，第二分接頭</p>
        <p type="p">PW:第二井，P井，P型基體</p>
        <p type="p">VA:通孔</p>
        <p type="p">W1:第一寬度</p>
        <p type="p">W2:第二寬度</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:豎直方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="453px" img-content="tif" inline="yes" orientation="portrait" width="697px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622302</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128390</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C30B15/10</main-classification>
        <further-classification edition="200601120260225B">C30B29/06</further-classification>
        <further-classification edition="200601120260225B">C30B35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>環球晶圓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GLOBALWAFERS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲力浦　理查　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHILLIPS, RICHARD JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,564</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有透射率改性之坩堝及其使用方法</chinese-title>
        <english-title>CRUCIBLES WITH TRANSMISSION MODIFICATION AND METHODS FOR USING SUCH CRUCIBLES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露用於藉由丘克拉斯基方法生長單晶矽晶錠之坩堝及用於製備一單晶矽晶錠之方法。該等坩堝由坩堝主體之透射率改性表徵。該坩堝主體之一下部區段可由摻雜有矽之二氧化矽製成。一上部區段可由不具有石英摻雜劑之二氧化矽製成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Crucibles for growing single crystal silicon ingots by the Czochralski method and methods for preparing a single crystal silicon ingot. The crucibles are characterized by transmission modification of the crucible body. A lower section of the crucible body may be made of silica doped with silicon. An upper section may be made of silica without quartz dopant.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:坩堝</p>
        <p type="p">103:坩堝主體/主體</p>
        <p type="p">106:基座</p>
        <p type="p">112:內表面</p>
        <p type="p">114:側壁/坩堝側壁</p>
        <p type="p">115:頂部</p>
        <p type="p">120:外表面</p>
        <p type="p">147:彎曲部分</p>
        <p type="p">150:第一區段/下部區段</p>
        <p type="p">157:第二區段/上部區段</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="797px" img-content="tif" inline="yes" orientation="portrait" width="771px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621687</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128395</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/506</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商輝瑞大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFIZER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商榮昌生物製藥（煙臺）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REMEGEN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德斯　拉爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDERS, LARS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　大男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威利斯　凱爾西　雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIS, KELSI RAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁　靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, JING TANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　亮林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIANGLIN EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,031</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/720,348</doc-number>
          <date>20241114</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於癌症治療之使用CDK4抑制劑之組合療法</chinese-title>
        <english-title>COMBINATION THERAPY USING CDK4 INHIBITORS FOR CANCER TREATMENTS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於包括本文所揭示之式(I)之細胞週期蛋白依賴性激酶4 (cyclin dependent kinase 4；CDK4)抑制劑及單株抗體或抗體-藥物偶聯物(antibody-drug conjugate)之組合療法，視情況進一步與內分泌治療劑組合；及相關治療方法、醫藥組合物及其用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to combination therapies comprising a cyclin dependent kinase 4 (CDK4) inhibitor of Formula (I) disclosed herein, and a monoclonal antibody or an antibody-drug conjugate, optionally in further combination with an endocrine therapy agent, and associated methods of treatment, pharmaceutical compositions, and uses thereof.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10040.JPG" file="ed10040.JPG" height="809px" img-content="tif" inline="yes" orientation="portrait" width="657px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622325</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128409</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">D21H27/00</main-classification>
        <further-classification edition="200601120260223B">D21H19/36</further-classification>
        <further-classification edition="200601120260223B">D21H19/44</further-classification>
        <further-classification edition="200601120260223B">B32B27/10</further-classification>
        <further-classification edition="201801120260223B">C09J7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製紙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON PAPER INDUSTRIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>登坂昌也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSAKA, MASAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田義雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, YOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部裕暁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畠山雄斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATAKEYAMA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊雄飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, YUHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-127764</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>剝離紙用原紙及剝離紙</chinese-title>
        <english-title>BASE PAPER FOR RELEASE PAPER, AND RELEASE PAPER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係提供一種填孔性優異，可形成均勻的剝離劑層且可循環使用的剝離紙用原紙、以及具有形成於此剝離紙用原紙上的剝離劑層之剝離紙。就解決手段而言，本發明係提供一種剝離紙用原紙、以及於此剝離紙用原紙的填孔層上具有剝離劑層之剝離紙，其中，該剝離紙用原紙係具備基紙、及在前述基紙之至少一面的填孔層；前述填孔層以70/30至80/20的質量比(顏料/接著劑：乾燥質量)含有顏料及接著劑；前述顏料含有90質量%以上之扁平顏料；前述接著劑至少含有澱粉系化合物與合成樹脂乳膠；相對於前述顏料100質量份，前述合成樹脂乳膠之摻合量為22質量份以上30質量份以下；前述填孔層表面根據ISO535：1991所測得之可勃吸水度(30秒)為5g/m&lt;sup&gt;2&lt;/sup&gt;以上25g/m&lt;sup&gt;2&lt;/sup&gt;以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a base paper for release paper which has excellent seal property, is capable of forming a uniform release agent layer and is capable of being recycled; and to provide a release paper which has a release agent layer formed on the base paper for release paper. As a solution to this problem, the present invention provides a base paper for release paper, and a release paper having a release agent layer on a sela layer of the base paper for release paper, wherein the base paper for release paper includes a base paper and the sela layer on at least one surface of the base paper, wherein the seal layer contains a pigment and an adhesive at a mass ratio of 70/30 to 80/20 (pigment/adhesive: dry mass), the pigment contains 90% by mass or more of a flat pigment, the adhesive contains at least a starch-based compound and a synthetic resin latex, and a blending amount of the synthetic resin latex with respect to 100 parts by mass of the pigment is 22 parts by mass or more and 30 parts by mass or less, and the Cobb water absorption (30 seconds) of the surface of the sela layer measured in accordance with ISO 535:1991 is 5 g/m&lt;sup&gt;2&lt;/sup&gt; or more and 25 g/m&lt;sup&gt;2&lt;/sup&gt; or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621705</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128419</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/713</main-classification>
        <further-classification edition="200601120260302B">A61K31/7105</further-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="201001120260302B">C12N15/113</further-classification>
        <further-classification edition="200601120260302B">C07K16/18</further-classification>
        <further-classification edition="200601120260302B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商渤健麻塞諸塞州股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOGEN MA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴海堤　高塔姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAHETI, GAUTAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎達迪　穆拉里德哈倫　巴拉特　庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANDADI MURALIDHARAN, BHARATH KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威利斯　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIS, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/675,586</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>治療阿茲海默氏病之方法</chinese-title>
        <english-title>METHODS FOR TREATING ALZHEIMER'S DISEASE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供投與BIIB080以在有需要之人類受試者中治療阿茲海默氏病(Alzheimer's disease)、減少Tau RNA、Tau蛋白及/或減少Tau神經原纖維纏結(NFT)之方法，該人類受試者在開始用BIIB080治療之前已用抗β類澱粉蛋白抗體治療。該阿茲海默氏病可為例如早期阿茲海默氏病、由阿茲海默氏病引起之輕度認知障礙及/或阿茲海默氏病失智症(例如，輕度阿茲海默氏病失智症)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods of administering BIIB080 for treating Alzheimer's disease, reducing Tau RNA, Tau protein and/or reducing Tau neurofibrillary tangles (NFTs) in a human subject in need thereof that has been treated with an anti-beta amyloid antibody prior to initiation of treatment with BIIB080. The Alzheimer's disease can be, for example, early Alzheimer's disease, mild cognitive impairment due to Alzheimer's disease, and/or Alzheimer's disease dementia (e.g., mild Alzheimer's disease dementia).</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="951px" img-content="tif" inline="yes" orientation="portrait" width="653px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622252</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128435</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C21B7/00</main-classification>
        <further-classification edition="200601120260224B">C21B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧森堡商保爾伍斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAUL WURTH S.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
              <english-address>LU</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金賽爾　克勞斯　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINZEL, KLAUS PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
              <english-address>LU</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴尼亞薩迪　麥迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANIASADI, MEHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LU</english-country>
              <english-address>LU</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>102024121683.2</doc-number>
          <date>20240730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>提供電漿輔助之烴裂解的鐵礦還原及熔化設備</chinese-title>
        <english-title>IRON ORE REDUCING AND MELTING APPARATUS PROVIDING PLASMA ASSISTED HYDROCARBON CRACKING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包括鼓風爐之鐵礦還原及熔化設備，該爐包括：  &lt;br/&gt;位在風口層級之至少一個氣體注射器，其適於將甲烷氣體引入該爐中，  &lt;br/&gt;至少一個加熱器，其適於將擬引入該爐中之該甲烷氣體加熱至高於500℃；  &lt;br/&gt;位在風口層級之至少一個氧氣注射埠，其適於提供包括至少80 vol.-%氧之氧氣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An iron ore reducing and melting apparatus comprising a blast furnace said furnace comprising: &lt;br/&gt;- at least one gas injector on the tuyere level adapted to introduce methane gas into the furnace, &lt;br/&gt;- at least one heater adapted to heat the methane gas to be introduced into the furnace to above 500℃; &lt;br/&gt;- at least one oxygen gas injector port on the tuyere level adapted to provide oxygen gas comprising at least 80 vol.-% oxygen.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:鐵礦還原及熔化設備</p>
        <p type="p">2:鼓風爐</p>
        <p type="p">3:副產品氣體注射埠</p>
        <p type="p">4:副產品注射器</p>
        <p type="p">5:氫注射埠</p>
        <p type="p">6:氫氣注射器</p>
        <p type="p">7:甲烷氣體注射埠</p>
        <p type="p">8:甲烷氣體注射器</p>
        <p type="p">9:氧氣注射埠</p>
        <p type="p">10:氧氣注射器</p>
        <p type="p">11:爐膛</p>
        <p type="p">12:風口層級</p>
        <p type="p">13:爐腹</p>
        <p type="p">14:爐頸層級</p>
        <p type="p">15:頂部層級</p>
        <p type="p">16:閉鎖式料斗</p>
        <p type="p">17:副產品氣體加熱器</p>
        <p type="p">18:氫氣加熱器</p>
        <p type="p">19:甲烷氣體加熱器</p>
        <p type="p">20:氧氣加熱器</p>
        <p type="p">21:第一去水裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="757px" img-content="tif" inline="yes" orientation="portrait" width="902px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621931</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128451</doc-number>
          <kind></kind>
          <date>114/07/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B62H5/16</main-classification>
        <further-classification edition="201401120260224B">E05B81/34</further-classification>
        <further-classification edition="200601120260224B">E05B47/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>印度商ＴＶＳ電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TVS MOTOR COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇契奇　茲沃尼米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUCIC, ZVONIMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HR</english-country>
              <english-address>HR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈拉瓦拉　胡札伊法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARARWALA, HUZAIFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博斯拉　尼萊許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOTHRA, NILESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>印度</country>
          <doc-number>202441056757</doc-number>
          <date>20240725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>車輛鎖定系統及其鎖定方法</chinese-title>
        <english-title>LOCKING SYSTEM FOR VEHICLE AND METHOD FOR LOCKING THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種車輛鎖定系統（100）。該鎖定系統（100）包括電子鎖組件（102），設置在該鎖定系統（100）的殼體（106）中。該電子鎖組件（102）能夠在鎖定位置與解鎖位置之間操作。該電子鎖組件（102）適於將該車輛的車輪固定在該鎖定位置中。纜線鎖組件（148）也設置在該殼體（106）中。該纜線鎖組件（148）能夠在鎖定位置與解鎖位置之間操作。該纜線鎖組件（148）適於在鎖定位置中將纜線鎖（132）固定在該殼體（106）內，其中，當電子鎖組件（102）處於解鎖位置中時，該纜線鎖組件（148）能夠在鎖定位置與該解鎖位置之間操作。這種結構為車輛提供防篡改鎖定系統（100），從而確保車輛安全。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Present invention provides a locking system (100) for a vehicle. The locking system (100) comprises an electronic lock assembly (102) disposed in a housing (106) of the locking system (100). The electronic lock assembly (102) is operable between a locked position and an unlocked position. The electronic lock assembly (102) being adapted to secure a wheel of the vehicle in the locked position. A cable lock assembly (148) is also disposed in the housing (106). The cable lock assembly (148) is operable between a lock position and an unlock position. The cable lock assembly (148) is adapted to secure a cable lock (132) within the housing (106) in the lock position, wherein the cable lock assembly (148) is operable between lock position and unlock position when the electronic lock assembly (102) is in unlocked position. Such a construction provides tamper-proof locking system (100) for vehicle, thereby ensuring vehicle safety.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鎖定系統</p>
        <p type="p">102:電子鎖組件</p>
        <p type="p">108:安裝支架</p>
        <p type="p">108a:安裝支架上的開口</p>
        <p type="p">112:中間蓋</p>
        <p type="p">114:機構蓋</p>
        <p type="p">116:齒輪傳動系統</p>
        <p type="p">118:致動器</p>
        <p type="p">120:一個或多個鎖定軸</p>
        <p type="p">122:小齒輪</p>
        <p type="p">124:齒條</p>
        <p type="p">126:開關</p>
        <p type="p">128:柱塞</p>
        <p type="p">130:柱塞上的狹槽</p>
        <p type="p">132:纜線鎖</p>
        <p type="p">132a:纜線鎖的扣件部分</p>
        <p type="p">134:柱塞上的突出部</p>
        <p type="p">136:齒條上的止動器</p>
        <p type="p">138:內蓋</p>
        <p type="p">138a:內蓋上的一個或多個開口</p>
        <p type="p">140:外蓋</p>
        <p type="p">140a:外蓋上的切口</p>
        <p type="p">140b:外蓋上的孔</p>
        <p type="p">142:彈性構件</p>
        <p type="p">144:內蓋上的突出表面</p>
        <p type="p">146:柔性密封構件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="820px" img-content="tif" inline="yes" orientation="portrait" width="675px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622269</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128454</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/04</main-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　品成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, TONY PING-CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚塔拉姆　阿維納什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANTARAM, AVINASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邊　喬伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, JOY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴爾塞努　米哈埃拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALSEANU, MIHAELA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,928</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURES AND METHODS FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明技術之各種實施例可提供一種用於製造一半導體結構之方法。該方法可包括：接收具有一介電層及一導電特徵之一源基板；僅在該導電特徵之一頂表面上選擇性地沉積一障壁層；對該介電層之一頂表面進行改質；以及在對該介電層進行改質之後移除該障壁層。該方法亦可包括在沉積該障壁層之前清潔介電及導電特徵之一頂層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various embodiments of the present technology may provide a method for fabricating a semiconductor structure. The method may include receiving a source substrate having a dielectric layer and a conductive feature, selectively depositing a barrier layer only on a top surface of the conductive feature, modifying a top surface of the dielectric layer, and removing the barrier layer after modifying the dielectric layer. The method may also include cleaning a top layer of the dielectric and conductive feature prior to depositing the barrier layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:製造步驟(步驟)</p>
        <p type="p">605:製造步驟(步驟)</p>
        <p type="p">610:製造步驟(步驟)</p>
        <p type="p">615:製造步驟(步驟)</p>
        <p type="p">625:製造步驟(步驟)</p>
        <p type="p">630:接合步驟(步驟)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10029.JPG" file="ed10029.JPG" height="653px" img-content="tif" inline="yes" orientation="portrait" width="607px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623656</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128455</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/20</main-classification>
        <further-classification edition="202601120260302B">H10W70/40</further-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商半導體組件工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何鹏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王建峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIANFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石晓敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, XIAOMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢安安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING, ANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金新城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, XINCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/957,237</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體設備、及形成半導體結構方法</chinese-title>
        <english-title>SEMICONDUCTOR APPARATUS, AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所述之實施例提供一種設備，其包括：一直接接合金屬（DBM）基板，其至少包括耦接至一介電層的一金屬層；一半導體裝置，其耦接至此DBM基板；一第一凸部，其與此金屬層相關聯；及一封裝的一導電部分，其包括一第二凸部，此第二凸部配置以與此第一凸部接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described implementations provide an apparatus that includes a direct bonded metal (DBM) substrate including at least a metal layer coupled to a dielectric layer, a semiconductor device coupled to the DBM substrate, a first protrusion associated with the metal layer, and a conductive portion of a package including a second protrusion that is configured to engage with the first protrusion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">9:半導體裸晶</p>
        <p type="p">100:半導體裝置封裝</p>
        <p type="p">108:直接接合金屬基板</p>
        <p type="p">110A:導線架</p>
        <p type="p">120:定位凸部</p>
        <p type="p">134:圖案化金屬層</p>
        <p type="p">136:介電層</p>
        <p type="p">310:下金屬層；第二金屬層</p>
        <p type="p">312:導線架凸部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="585px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622957</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128483</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120260224B">G10L19/008</main-classification>
        <further-classification edition="201301120260224B">G10L19/08</further-classification>
        <further-classification edition="202301120260224B">G06N3/045</further-classification>
        <further-classification edition="200601120260224B">H04S3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雪吉兒　艾瑞克　哥蘇納斯　佩托拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUIJERS, ERIK GOSUINUS PETRUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克奇奇安　派翠克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KECHICHIAN, PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24191760.8</doc-number>
          <date>20240730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>音訊設備及其操作方法</chinese-title>
        <english-title>AUDIO APPARATUS AND METHOD OF OPERATION THEREFOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一編碼器包含一暫態提取器(103)，其藉由提取單聲道暫態信號分量來產生一殘餘多聲道音訊信號。一組合器電路(105)藉由組合單聲道暫態信號分量來產生一組單聲道暫態信號分量。一降混電路(107)藉由對該殘餘多聲道音訊信號及該等單聲道暫態信號分量進行降混來產生降混音訊資料，且產生用於對該殘餘多聲道音訊信號進行升混的信號升混參數，及用於對該等單聲道暫態信號分量進行升混的暫態升混參數。一輸出電路(109)產生包含所產生的該資料的一經編碼音訊資料信號。一解碼器具有升混器，該等升混器使用所接收的該等參數對所接收的該降混殘餘信號及該等單聲道暫態信號分量進行升混，包括針對所接收的一個單聲道暫態信號分量產生複數個暫態信號分量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An encoder comprises a transient extractor (103) generating a residual multichannel audio signal by extracting single channel transient signal components. A combiner circuit (105) generates a set of mono transient signal components by combining single channel transient signal components. A downmix circuit (107) generates downmix audio data by downmixing the residual multichannel audio signal and the mono channel transient signal components, and generates signal upmix parameters for upmixing the residual multichannel audio signal and transient upmix parameters for upmixing the mono channel transient signal components. An output circuit (109) generates an encoded audio data signal comprising the generated data. A decoder has upmixers that upmix the received downmixed residual signal and the mono transient signal components using the received parameters, including generating a plurality of transient signal components for one received mono transient signal component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:接收器</p>
        <p type="p">103:暫態偵測器</p>
        <p type="p">105:組合器電路</p>
        <p type="p">107:降混器</p>
        <p type="p">109:資料輸出電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="444px" img-content="tif" inline="yes" orientation="portrait" width="805px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622244</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128486</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/86</main-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="200601120260302B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱特治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙納瓦爾費沙泥　阿布札爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONAVARFESHANI, ABOOZAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯謝德里　沙奧拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SESHADRI, SAURAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔必包德巴爾　謝里夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABEBORDBAR, SHARIF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔必包德巴爾　沙雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABEBORDBAR, SHAYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,141</doc-number>
          <date>20240730</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/687,987</doc-number>
          <date>20240828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療肢帶型肌營養不良２Ａ型的腺相關病毒組成物</chinese-title>
        <english-title>ADENO-ASSOCIATED VIRUS COMPOSITIONS FOR THE TREATMENT OF LIMB GIRDLE MUSCULAR DYSTROPHY 2A</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了用於在治療肢帶型肌營養不良2A型（LGMD2A）中使用的新穎的基因療法組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides novel gene therapy compositions for use in treatment of limb girdle muscular dystrophy 2A (LGMD2A).</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="669px" img-content="tif" inline="yes" orientation="portrait" width="966px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622072</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128492</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D417/06</main-classification>
        <further-classification edition="200601120260302B">C07D417/14</further-classification>
        <further-classification edition="200601120260302B">C07D211/60</further-classification>
        <further-classification edition="200601120260302B">C07D413/06</further-classification>
        <further-classification edition="200601120260302B">C07D413/14</further-classification>
        <further-classification edition="200601120260302B">A61K31/454</further-classification>
        <further-classification edition="200601120260302B">A61K31/4545</further-classification>
        <further-classification edition="200601120260302B">A61K31/496</further-classification>
        <further-classification edition="200601120260302B">A61K31/5377</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大塚製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKA PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植松満香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEMATSU, MIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
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                <last-name>康士　班傑明　大衛</last-name>
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                <last-name>戴　詹姆斯　愛得華　哈維</last-name>
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                <last-name>DAY, JAMES EDWARD HARVEY</last-name>
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                <last-name>宮本素行</last-name>
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                <last-name>山口敦史</last-name>
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                <last-name>里貝奇茲　約翰　華特</last-name>
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                <last-name>聖丹尼斯　傑佛瑞　大衛</last-name>
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                <last-name>WALSH, LOUISE MARIE</last-name>
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                <last-name>查撒利　吉尼</last-name>
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                <last-name>OSBORNE, JAMES DANIEL</last-name>
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                <last-name>瓦德　史都華　伊恩</last-name>
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                <last-name>史密特　沃夫岡</last-name>
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                <last-name>SCHMIDT, WOLFGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
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        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/080123</doc-number>
          <date>20240729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>作為SORT1抑制劑之化合物</chinese-title>
        <english-title>COMPOUNDS AS SORT1 INHIBITORS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示具有分選蛋白(sortilin)結合抑制活性之化合物或其鹽，其用於治療、預防及/或診斷與分選蛋白配體相關之疾病或病症的醫療用途，以及製備該等化合物或其鹽之方法。本發明提供一種式(I)化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="188px" width="206px" file="ed10802.JPG" alt="ed10802.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;或其鹽，其中取代基為如說明書中所定義之取代基；及相關態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are compounds, or salts thereof, with sortilin-binding inhibitory activity, medical use thereof for treating, preventing, and/or diagnosing diseases or disorders associated with sortilin ligands, and methods of preparing said compounds or salts thereof. Provided are a compound of formula (I): &lt;br/&gt;&lt;img align="absmiddle" height="200px" width="208px" file="ed10803.JPG" alt="ed10803.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;, &lt;br/&gt;or a salt thereof, wherein substituents are those as defined in the specification; and related aspects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621723</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128501</doc-number>
          <kind></kind>
          <date>111/04/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K38/26</main-classification>
        <further-classification edition="200601120260302B">A61K47/18</further-classification>
        <further-classification edition="200601120260302B">A61K47/26</further-classification>
        <further-classification edition="200601120260302B">A61K47/10</further-classification>
        <further-classification edition="200601120260302B">A61K9/08</further-classification>
        <further-classification edition="200601120260302B">A61P3/10</further-classification>
        <further-classification edition="200601120260302B">A61P3/04</further-classification>
        <further-classification edition="200601120260302B">A61P1/16</further-classification>
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                <last-name>大陸商信達生物製藥（蘇州）有限公司</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>INNOVENT BIOLOGICS (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙呈呈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪音爵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王景達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202110485578.0</doc-number>
          <date>20210430</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>202210420561.1</doc-number>
          <date>20220420</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種OXM3儲存劑、OXM3製劑及製備方法</chinese-title>
        <english-title>OXM3 STORAGE AGENT, OXM3 PREPARATION, AND PREPARATION METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種OXM3儲存劑、OXM3製劑及製備方法。所述OXM3儲存劑包含0.5-5mg/ml的胺丁三醇、0.1-100mg/ml的穩定劑、0.01-5mg/ml的螯合劑和溶劑，所述穩定劑包括以下一種或多種：甘露醇、丙二醇、精胺酸、精胺酸鹽酸鹽、組胺酸和組胺酸鹽酸鹽，所述螯合劑包括依地酸二鈉，所述溶劑包括水。由所述OXM3儲存劑配置的OXM3製劑可以保證活性成分OXM3至少穩定存儲6個月，較佳可達12個月以上，更佳可達18-24個月以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="470px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623640</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128514</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/20</main-classification>
        <further-classification edition="202601120260302B">H10W20/42</further-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="202601120260302B">H10W20/44</further-classification>
        <further-classification edition="202601120260302B">H10W80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡特卡　拉杰詡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATKAR, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥卡雷米　蘿拉　威爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRKARIMI, LAURA WILLS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方騰二世　蓋烏斯　吉爾曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUNTAIN, JR., GAIUS GILLMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏佐　賽普里恩　艾米卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UZOH, CYPRIAN EMEKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　貝高森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,757</doc-number>
          <date>20240729</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/938,132</doc-number>
          <date>20241105</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於晶粒中的散熱的結構及方法</chinese-title>
        <english-title>STRUCTURES AND METHODS FOR THERMAL DISSIPATION IN DIES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種經接合結構，其包括具有接合表面之元件，該接合表面具有介電區及與該介電區側向間隔開之第一半導體區。該經接合結構進一步包括在無介入黏著劑之情況下直接接合至該元件之該介電區的第一晶粒。該經接合結構進一步包括具有第二接合表面之第二晶粒，該第二接合表面具有第二半導體區，該第二半導體區在無介入黏著劑之情況下且在無介入經沉積介電材料之情況下接合至該元件之該第一半導體區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a bonded structure including an element with a bonding surface, the bonding surface having a dielectric region and a first semiconductor region laterally spaced from the dielectric region. The bonded structure further includes a first die directly bonded to the dielectric region of the element without an intervening adhesive. The bonded structure further includes a second die having a second bonding surface having a second semiconductor region, the second semiconductor region being bonded to the first semiconductor region of the element without an intervening adhesive and without an intervening deposited dielectric material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300B:經接合結構</p>
        <p type="p">304:背側</p>
        <p type="p">310B:底部組件</p>
        <p type="p">312B:基板</p>
        <p type="p">314:配線層</p>
        <p type="p">316:TSV</p>
        <p type="p">317:導電襯墊</p>
        <p type="p">320:第一區</p>
        <p type="p">322:第二區</p>
        <p type="p">332B:介電接合層</p>
        <p type="p">338B:接合界面</p>
        <p type="p">350:頂部晶粒</p>
        <p type="p">352:基板</p>
        <p type="p">354:配線層</p>
        <p type="p">356:襯墊</p>
        <p type="p">370B:散熱晶粒</p>
        <p type="p">372B:基板</p>
        <p type="p">374:原生氧化物</p>
        <p type="p">376:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.JPG" file="ed10032.JPG" height="459px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621578</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128516</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">A23L15/00</main-classification>
        <further-classification edition="200601120260302B">A23J3/22</further-classification>
        <further-classification edition="200601120260302B">A23J1/14</further-classification>
        <further-classification edition="201601120260302B">A23L29/269</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱商事生命科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CORPORATION LIFE SCIENCES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松山勇介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUYAMA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-123721</doc-number>
          <date>20240730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>經加熱之類蛋組成物及其製造方法</chinese-title>
        <english-title>HEATED EGG-LIKE COMPOSITION AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題係得到一種經加熱之類蛋組成物，其即使不含有或大幅降低蛋量，仍會得到如同將整顆蛋打散並緩慢加熱或加熱至半熟狀之程度般柔軟的口感及外觀。  &lt;br/&gt;使豆漿、燕麥奶、杏仁奶等植物奶中含有氯化鎂、鹽滷等凝固劑及卡特蘭多醣，並藉由其凝固作用及膠凝作用使其固體化，藉此可以得到具有柔軟的口感及外觀之經加熱之類蛋組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">It is an object of the present invention to provide a heated egg-like composition having a soft texture and appearance similar to that obtained by gently heating beaten whole eggs to a semi-cooked or loosely coagulated state, despite the fact that the composition contains no egg or only a significantly reduced amount thereof. &lt;br/&gt;A heated egg-like composition having a soft texture and appearance can be obtained by solidifying plant-based milks such as soy milk, oat milk, and almond milk through the coagulating and gelling actions of coagulants such as magnesium chloride or bittern, in combination with curdlan.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622088</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128517</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D513/22</main-classification>
        <further-classification edition="200601120260302B">A61K31/5025</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桂悦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUI, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/108187</doc-number>
          <date>20240729</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/104614</doc-number>
          <date>20250627</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ＲＡＳ抑制劑之固體形式</chinese-title>
        <english-title>SOLID FORMS OF RAS INHIBITOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及化合物 (I)，  &lt;br/&gt;&lt;img align="absmiddle" height="247px" width="307px" file="ed10023.JPG" alt="ed10023.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，  &lt;br/&gt;(1r,2R,3S)-N-[(7S,13S)-(20M)-20-[2-[(1S)-1-甲氧基乙基]-5-(4-甲基哌𠯤-1-基)-3-吡啶基]-17,17-二甲基-8,14-二側氧-15-氧雜-4-硫雜-9,21,30,31-四氮雜六環[23.3.1.1&lt;sup&gt;2,5&lt;/sup&gt;.1&lt;sup&gt;9,13&lt;/sup&gt;.0&lt;sup&gt;19,27&lt;/sup&gt;.0&lt;sup&gt;21,26&lt;/sup&gt;]三十一基-1(28),2,5(31),19,25(29),26-六烯-7-基]-2,3-二甲基-環丙烷甲醯胺之新型固體形式，以及其製備方法及其在醫藥組成物中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to novel solid forms of compound (I), &lt;br/&gt;&lt;img align="absmiddle" height="251px" width="312px" file="ed10024.JPG" alt="ed10024.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;(1r,2R,3S)-N-[(7S,13S)-(20M)-20-[2-[(1S)-1-methoxyethyl]-5-(4-methylpiperazin-1-yl)-3-pyridyl]-17,17-dimethyl-8,14-dioxo-15-oxa-4-thia-9,21,30,31-tetrazahexacyclo[23.3.1.1&lt;sup&gt;2,5&lt;/sup&gt;.1&lt;sup&gt;9,13&lt;/sup&gt;.0&lt;sup&gt;19,27&lt;/sup&gt;.0&lt;sup&gt;21,26&lt;/sup&gt;]hentriaconta-1(28),2,5(31),19,25(29),26-hexaen-7-yl]-2,3-dimethyl-cyclopropanecarboxamide, and the processes for their preparation and their use in pharmaceutical composition.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.JPG" file="ed10026.JPG" height="411px" img-content="tif" inline="yes" orientation="portrait" width="612px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623297</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128523</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120260223B">H04W74/08</main-classification>
        <further-classification edition="201801120260223B">H04W4/80</further-classification>
        <further-classification edition="202301120260223B">H04W72/23</further-classification>
        <further-classification edition="200901120260223B">H04W52/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　昱含</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YUHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福亞德　亞瑟　穆罕默德　穆斯塔法　卡梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOUAD, YASER MOHAMED MOSTAFA KAMAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩托里　菲利普　瓊　馬克　米歇爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARTORI, PHILIPPE JEAN MARC MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許允亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEO, YOUN HYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,135</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/280,725</doc-number>
          <date>20250725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>非暫時性電腦可讀媒體與用於環境物聯網裝置的隨機存取方法</chinese-title>
        <english-title>NON-TRANSITORY COMPUTER-READABLE MEDIUM AND METHOD FOR RANDOM ACCESS FOR AMBIENT INTERNET OF THINGS DEVICES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">系統和方法包括藉由環境物聯網（A-IoT）裝置接收激勵信號；藉由A-IoT裝置從網路節點接收呼叫訊息，呼叫訊息包括一個或多個配置參數，使用呼叫訊息中的一個或多個配置參數確定來自A-IoT裝置的隨機存取傳輸的資源，以及藉由A-IoT裝置回應呼叫訊息向網路節點傳輸隨機存取傳輸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and a method includes receiving, by an ambient Internet of Things (A-IoT) device, an energizing signal; receiving, by the A-IoT device, a paging message from a network node, the paging message including one or more configuration parameters, determining a resource for a random access transmission from the A-IoT device using the one or more configuration parameters in the paging message, and transmitting, by the A-IoT device, a random access transmission to the network node in response to the paging message.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1301~1304:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.png" file="d10025.TIF" giffile="ed10025.png" height="848px" img-content="tif" inline="yes" orientation="portrait" width="503px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622250</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128535</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260302B">C12Q1/6844</main-classification>
        <further-classification edition="201801120260302B">C12Q1/686</further-classification>
        <further-classification edition="201801120260302B">C12Q1/68</further-classification>
        <further-classification edition="200601120260302B">C12N9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商金斯瑞美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENSCRIPT USA INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒翰　莎姆哈菲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHUBHAM, SHAMBHAVI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　政憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHENG-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,071</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於非引物依賴性無細胞ＤＮＡ擴增的方法和組成物</chinese-title>
        <english-title>METHODS AND COMPOSITIONS FOR PRIMER-INDEPENDENT CELL-FREE DNA AMPLIFICATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供了一種用於擴增DNA範本的方法，該方法包括：a) 提供包含以下的組成物：DNA範本、RNA聚合酶、DNA聚合酶和去氧核糖核苷酸，其中所述組成物不包含核糖核苷酸；及b) 在合適的條件下孵育所述組成物以允許所述DNA範本的擴增。本案還提供了一種用於從DNA範本引發DNA擴增的方法，該方法包括：在合適的條件下孵育DNA範本、RNA聚合酶和去氧核糖核苷酸以允許活化DNA擴增；其中所述方法不包括添加核糖核苷酸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for amplifying a DNA template, comprising: a) providing a composition comprising a DNA template, an RNA polymerase, a DNA polymerase, and a deoxyribonucleotide, wherein said composition does not comprise a ribonucleotide; and b) incubating said composition in a suitable condition to allow amplification of said DNA template. Also provided is a method for priming DNA amplification from a DNA template, comprising: incubating a DNA template, an RNA polymerase and a deoxyribonucleotide in a suitable condition to allow the initiation of DNA amplification; wherein said method does not comprise adding a ribonucleotide.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="743px" img-content="tif" inline="yes" orientation="portrait" width="484px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622245</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128549</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/86</main-classification>
        <further-classification edition="200601120260302B">C12N7/00</further-classification>
        <further-classification edition="200601120260302B">C12N9/20</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="201501120260302B">A61K35/76</further-classification>
        <further-classification edition="200601120260302B">A61P3/06</further-classification>
        <further-classification edition="200601120260302B">A61P1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FENG GRAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗林　喬納森　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLYNN, JONATHAN ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　艾米　秀蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, AMY HSIU-TI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>毛　小洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAO, XIAOHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫曼　喬納斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEINMANN, JONAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,736</doc-number>
          <date>20240729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療溶酶體酸性脂肪酶缺乏症（ＬＡＬ—Ｄ）之組成物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS FOR THE TREATMENT OF LYSOSOMAL ACID LIPASE DEFICIENCY (LAL-D)</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於基因療法組成物及其製備方法和用途，用於治療溶酶體酸性脂肪酶缺乏症（LAL-D）障礙，例如沃爾曼病和膽固醇酯貯積病（CESD）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to gene therapy compositions and methods for the preparation and use thereof, for the treatment of Lysosomal Acid Lipase Deficiency (LAL-D) disorders, such as Wolman Disease and cholesterol ester storage disease (CESD).</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10052.JPG" file="ed10052.JPG" height="711px" img-content="tif" inline="yes" orientation="portrait" width="837px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622246</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128572</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/86</main-classification>
        <further-classification edition="200601120260302B">C12N7/00</further-classification>
        <further-classification edition="200601120260302B">C07K14/07</further-classification>
        <further-classification edition="201501120260302B">A61K35/768</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加州大學董事會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE REGENTS OF THE UNIVERSITY OF CALIFORNIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希弗雷克　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHIEFERECKE, ADAM JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　賢哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUNCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜伯　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUEBER, JOHN E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝弗　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAFFER, DAVID V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,672</doc-number>
          <date>20240729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>重組牛痘病毒載體及其使用方法</chinese-title>
        <english-title>RECOMBINANT VACCINIA VECTORS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供包含變異體A34R蛋白的重組牛痘病毒載體（recombinant vaccinia vector，rVACV）。與包含野生型A34R蛋白的牛痘病毒載體相比，本發明所述的rVACV表現出增加的細胞外套膜病毒粒子（extra-cellular enveloped virion ，EEV）產量。本發明還描述了變異體A34R蛋白、編碼變異體A34R蛋白的核酸，以及含有該等核酸的細胞。此外，本發明提供了生產rVACV的方法，該方法包含培養含有變異體A34R蛋白編碼核酸的細胞，並純化rVACV。進一步地，本發明提供了一種治療受試者癌症的方法，該方法包含向受試者投予包含變異體A34R蛋白的rVACV。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides recombinant vaccinia vectors (rVACV) comprising variant A34R proteins. As compared to a vaccinia vector comprising the wild-type A34R protein, the rVACVs described herein exhibit increased production of extra-cellular enveloped virion (EEV). Also described herein are variant A34R proteins, nucleic acids encoding variant A34R proteins, and cells containing the nucleic acids encoding variant A34R proteins. The disclosure further provides methods of producing rVACV by culturing the cells containing the nucleic acids encoding variant A34R proteins and purifying the rVACV. Furthermore, provided are methods of treating a cancer in a subject by administering to the subject rVACVs comprising the variant A34R proteins.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621665</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128581</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/11</main-classification>
        <further-classification edition="200601120260302B">A61K8/92</further-classification>
        <further-classification edition="200601120260302B">A61K8/63</further-classification>
        <further-classification edition="200601120260302B">A61K8/73</further-classification>
        <further-classification edition="200601120260302B">A61Q19/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芳珂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANCL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>益川直子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUKAWA, NAOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-208086</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>水中油型乳化化妝料</chinese-title>
        <english-title>OIL-IN-WATER EMULSION COSMETICS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種新穎的水中油型乳化化妝料，又，提供一種水中油型乳化化妝料，其抑制經皮水分蒸發之效果優異，並且保濕持續效果、緊緻度及彈力感、皮膚滲透感優異，且少有黏膩感及乾澀感等不適感。  &lt;br/&gt;本發明的解決手段為提供一種水中油型乳化化妝料，其含有下述(A)至(C)成分：  &lt;br/&gt;(A)氫化荷荷巴油；  &lt;br/&gt;(B)月桂醯基麩胺酸二(植物固醇基/辛基十二烷基)酯、月桂醯基麩胺酸二(辛基十二烷基/植物固醇基/二十二基)酯之任一者或兩者；  &lt;br/&gt;(C)海藻糖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An objective of the present invention is to provide novel oil-in-water emulsion cosmetics that exhibit excellent transepidermal moisture loss suppression, sustained moisturizing effects, firmness and elasticity, and excellent skin compatibility, while minimizing discomfort such as stickiness and squeaky feeling. &lt;br/&gt;Provided as a solution are oil-in-water emulsion cosmetics containing the following ingredients (A) to (C): &lt;br/&gt;(A) hydrogenated jojoba oil; &lt;br/&gt;(B) one or both of di(phytosteryl/octyldodecyl) lauroyl glutamate and di(octyldodecyl/phytosteryl/behenyl) lauroyl glutamate; and &lt;br/&gt;(C) trehalose.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621669</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128584</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/44</main-classification>
        <further-classification edition="200601120260302B">A61K8/37</further-classification>
        <further-classification edition="200601120260302B">A61Q19/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芳珂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANCL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯塚悠弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIZUKA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-204599</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>皮膚洗淨料</chinese-title>
        <english-title>SKIN CLEANSER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題為提供一種新穎的皮膚洗淨料，尤其是清洗完成後的光滑感優異之皮膚洗淨料。本發明的解決手段為提供一種皮膚洗淨料，其係至少含有(A)油醯肌胺酸或其鹽、及(B)2個以上脂肪酸鍵結而成的聚甘油脂肪酸酯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a novel skin cleanser, particularly a skin cleanser having an excellent tempering feeling after washing. As a solution, the present invention provides a skin cleanser which comprises at least (A) oleoylsarcosine or a salt thereof and (B) a polyglycerol fatty acid ester having two or more fatty acids bonded thereto.</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622983</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128603</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120260302B">G16B30/10</main-classification>
        <further-classification edition="201901120260302B">G16B40/00</further-classification>
        <further-classification edition="201801120260302B">C12Q1/6869</further-classification>
        <further-classification edition="201801120260302B">C12Q1/6883</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>創新診斷科技中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRE FOR NOVOSTICS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧　煜明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YUK-MING DENNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　君賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KWAN CHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江培勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, PEIYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬立真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, LIZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊東彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, DONGYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIAO, RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,294</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/810,612</doc-number>
          <date>20250522</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/838,377</doc-number>
          <date>20250703</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於分析游離ＤＮＡ之末端前模體、末端後模體、５Ｍ及３－ＥＭ以及其組合</chinese-title>
        <english-title>PRE-END MOTIFS, POST-END MOTIFS, 5-EM, AND 3-EM AND COMBINATIONS FOR ANALYSIS OF CELL-FREE DNA</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了用於分析末端模體(例如，在比對之定序片段的最外側座標之外的參考基因體中的核苷酸)的技術，以及使用多維資料結構以在確定樣本或自其中獲得樣本的個體之特性(例如，病變或臨床相關DNA之比例濃度的分類)中實現提高的準確度的機器學習技術。描述了各種末端模體且將其用於確定此類特性。亦描述了cfDNA分子之各種編碼，例如用於分子水平及樣本水平模型。描述了減少二聚體假像之4-末端定序技術。CpG位點周圍的3'末端的裂解譜亦被用於偵測病變。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides techniques for analyzing end motifs, e.g., nucleotides in a reference genome outside the outmost coordinates of an aligned sequenced fragment, as well as machine learning techniques that use multidimensional data structures to achieve increased accuracy in determining a property (e.g., classification of a pathology or fractional concentration of clinically-relevant DNA) of a sample or of the subject from which a sample is obtained. Various end motifs are described and used for determining such properties. Various encodings of cfDNA molecules are also described, e.g., for use with molecule-level and sample-level models. 4-end sequencing techniques are described that reduce dimer artifacts. Cleavage profiles of 3' ends around CpG sites are also used to detect pathologies.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:DNA片段</p>
        <p type="p">106:股</p>
        <p type="p">107:股</p>
        <p type="p">110:參考序列</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10179.JPG" file="ed10179.JPG" height="566px" img-content="tif" inline="yes" orientation="portrait" width="906px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622062</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128610</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D403/12</main-classification>
        <further-classification edition="200601120260302B">C07D413/12</further-classification>
        <further-classification edition="200601120260302B">C07D491/044</further-classification>
        <further-classification edition="200601120260302B">C07D401/12</further-classification>
        <further-classification edition="200601120260302B">C07D403/14</further-classification>
        <further-classification edition="200601120260302B">C07D401/14</further-classification>
        <further-classification edition="200601120260302B">C07D498/08</further-classification>
        <further-classification edition="200601120260302B">C07D491/147</further-classification>
        <further-classification edition="200601120260302B">C07D417/14</further-classification>
        <further-classification edition="200601120260302B">C07D413/14</further-classification>
        <further-classification edition="200601120260302B">C07D405/14</further-classification>
        <further-classification edition="200601120260302B">A61K31/506</further-classification>
        <further-classification edition="200601120260302B">A61K31/5377</further-classification>
        <further-classification edition="200601120260302B">A61K31/517</further-classification>
        <further-classification edition="200601120260302B">A61K31/5386</further-classification>
        <further-classification edition="200601120260302B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰利斯　約翰　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TELLIS, JOHN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　文淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNG, MAN UN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
              <english-address>PT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布勞恩　德比恩　瑪麗　加布里埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRAUN DEBIEN, MARIE-GABRIELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭德瑞　馬修　里歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANDRY, MATTHEW LEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派斯特　理查　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASTOR, RICHARD MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉维茨　班傑明　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVETZ, BENJAMIN DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,025</doc-number>
          <date>20240726</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/753,352</doc-number>
          <date>20250203</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療神經退化性疾病之ＴＭＥＭ１７５調節劑</chinese-title>
        <english-title>7TMEM175 MODULATORS FOR THE TREATMENT OF NEURODEGENERATIVE DISORDERS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案提供式 (I) 化合物及式 (II) 化合物   &lt;br/&gt;&lt;img align="absmiddle" height="157px" width="191px" file="ed10749.JPG" alt="ed10749.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; 、&lt;img align="absmiddle" height="158px" width="198px" file="ed10750.JPG" alt="ed10750.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; ，  &lt;br/&gt;及其醫藥上可接受之鹽，其為 TMEM175 之調節劑。還提供主題化合物之醫藥組成物，以及使用該等醫藥組成物治療神經退化性疾病之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides compounds of Formula (I) and Formula (II) &lt;br/&gt;&lt;img align="absmiddle" height="160px" width="194px" file="ed10751.JPG" alt="ed10751.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;img align="absmiddle" height="160px" width="203px" file="ed10752.JPG" alt="ed10752.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; , &lt;br/&gt;and pharmaceutically acceptable salts thereof, that are modulators of TMEM175. Also provided are pharmaceutical compositions of the subject compounds, and methods of treating neurodegenerative disorders using the same.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622396</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128615</doc-number>
          <kind></kind>
          <date>114/07/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">F16F7/08</main-classification>
        <further-classification edition="200601120260223B">F16F15/02</further-classification>
        <further-classification edition="200601120260223B">E04H9/02</further-classification>
        <further-classification edition="200601120260223B">E04B1/98</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大林組股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBAYASHI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内海良和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTSUMI, YOSHIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富居勝宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMII, KATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平田寬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRATA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向中野泰行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUKAINAKANO, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-121136</doc-number>
          <date>20240726</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>摩擦阻尼器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於，即便為滑移面為4面以上之摩擦阻尼器，亦能抑制挫屈而不會影響螺栓。  &lt;br/&gt;一種摩擦阻尼器，其配置於在規定方向上相對移動之一對構件間，藉由隨著上述相對移動而滑移之壓接板間之摩擦力來抑制上述相對移動，且具有：第1壓接板，其與上述一對構件中之一構件一體地設置；一對第2壓接板，其與上述一對構件中之另一構件一體地設置，將上述第1壓接板自兩面以規定之壓接力夾入；一側之第3壓接板，其與上述一構件一體地設置，與上述第1壓接板一起將上述一對第2壓接板中之一側之第2壓接板自上述一側以上述規定之壓接力夾入；另一側之第3壓接板，其與上述一構件一體地設置，與上述第1壓接板一起將上述一對第2壓接板中之另一側之第2壓接板自上述另一側以上述規定之壓接力夾入；及第1緊固構件，其穿通設置於上述第1壓接板之貫通孔、上述一對第2壓接板之貫通孔以及上述一側及上述另一側之第3壓接板之貫通孔中，並於上述第1壓接板與上述一對第2壓接板之對向面正交之板厚方向上，使上述第1壓接板、上述一對第2壓接板以及上述一側及上述另一側之第3壓接板壓接；上述一對第2壓接板之貫通孔係長孔，上述第1壓接板之貫通孔以及上述一側及上述另一側之第3壓接板之貫通孔係螺栓孔，上述第1緊固構件具有：螺栓，其穿通於上述長孔及上述螺栓孔中；螺帽，其螺合於上述螺栓；及管件，其供上述螺栓穿通，且收容於上述長孔及上述螺栓孔中；軸向力沿上述規定方向作用於該摩擦阻尼器，與上述長孔之短徑方向之內表面接觸之上述管件抑制了上述滑移之壓接板間之滑移面於面內方向上之挫屈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5f:翼板</p>
        <p type="p">5m:摩擦板</p>
        <p type="p">5w:腹板(第1壓接板)</p>
        <p type="p">7a:長孔</p>
        <p type="p">7c:內表面</p>
        <p type="p">7f:翼板</p>
        <p type="p">7s:滑動板</p>
        <p type="p">7w:腹板(第2壓接板)</p>
        <p type="p">8:拼接構件(扁鋼，第3壓接板)</p>
        <p type="p">8m:摩擦板</p>
        <p type="p">10:摩擦阻尼器</p>
        <p type="p">20a:第1緊固構件</p>
        <p type="p">21:螺栓</p>
        <p type="p">22:螺帽</p>
        <p type="p">23:墊圈</p>
        <p type="p">24:碟形彈簧</p>
        <p type="p">25:導套</p>
        <p type="p">26:拼接板</p>
        <p type="p">27:管件</p>
        <p type="p">d1:間隙</p>
        <p type="p">d2:間隙</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="1017px" img-content="tif" inline="yes" orientation="portrait" width="621px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623561</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128636</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="200601120260302B">F16K3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班納　薩梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANNA, SAMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹蒂旺　凱爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANTIWONG, KYLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,863</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>閘閥總成、包括閘閥總成之反應器系統及在閘閥總成內執行並行操作之方法</chinese-title>
        <english-title>GATE VALVE ASSEMBLIES, REACTOR SYSTEMS INCLUDING GATE VALVE ASSEMBLIES, AND METHODS OF PERFORMING PARALLEL OPERATIONS WITHIN GATE VALVE ASSEMBLIES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了閘閥總成、包括閘閥總成之反應器系統及在一閘閥總成內執行並行操作之方法。所揭露之該等閘閥總成包括經組態用於收納一第一密封部件及一第二密封部件之一閘閥塊體。所揭露之該等反應器系統包括一後端傳送模組、一製程模組以及包括第一及第二密封部件之一閘閥總成。所揭露的在一閘閥總成內執行並行操作之該等方法包括穿過一閘閥總成內之一通路傳送一基板，同時感測該基板之一或多個特性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Gate valve assemblies, reactor systems including gate valve assemblies, and methods of performing parallel operation within a gate valve assembly are disclosed. The gate valve assemblies disclosed include a gate valve block body configured for receiving a ﬁrst sealing member and a second sealing member. The reactor systems disclosed include a back-end transfer module, a process module, and a gate valve assembly, including first and second sealing members. The methods of performing parallel operation within a gate valve assembly disclosed include transferring a substrate through a passthrough within a gate valve assembly while sensing one or more properties of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:製程模組</p>
        <p type="p">104:後端傳送模組</p>
        <p type="p">118:基板</p>
        <p type="p">130:後端基板傳送機器人</p>
        <p type="p">200:反應器系統</p>
        <p type="p">202:閘閥塊體</p>
        <p type="p">204:通路</p>
        <p type="p">206:第一閘閥裝置</p>
        <p type="p">208:第一閘閥致動器</p>
        <p type="p">210:第一密封部件</p>
        <p type="p">212:第一致動部件</p>
        <p type="p">214:第二閘閥裝置</p>
        <p type="p">216:第二閘閥致動器</p>
        <p type="p">218:第二密封部件</p>
        <p type="p">220:第二致動部件</p>
        <p type="p">222:第一檢修通道</p>
        <p type="p">224:閘閥總成(雙閘閥總成)</p>
        <p type="p">226:第一可拆卸檢修蓋(可拆卸檢修蓋)</p>
        <p type="p">228:第二檢修通道</p>
        <p type="p">230:第二可拆卸檢修蓋(可拆卸檢修蓋)</p>
        <p type="p">232:感測器總成</p>
        <p type="p">234:凸緣總成</p>
        <p type="p">236:內部冷卻通道</p>
        <p type="p">238:觀察口</p>
        <p type="p">404:第一側向孔隙</p>
        <p type="p">504:第二側向孔隙</p>
        <p type="p">602:第三側向孔隙</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="774px" img-content="tif" inline="yes" orientation="portrait" width="581px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621871</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128637</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">B25J11/00</main-classification>
        <further-classification edition="200601120260223B">B25J9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>班納　薩梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANNA, SAMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,904</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板傳送機器人組件、基板處理系統、在裝載鎖定模組與各別處理模組之間傳送基板之方法</chinese-title>
        <english-title>SUBSTRATE TRANSFER ROBOT ASSEMBLIES, SUBSTRATE PROCESSING SYSTEMS, AND METHODS OF TRANSFERRING SUBSTRATES BETWEEN A LOAD LOCK MODULE AND A RESPECTIVE PROCESSING MODULE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種基板傳送機器人組件。基板傳送機器人組件包括一塔架、具有一第一末端執行器的一第一臂、具有一第二末端執行器及一第三末端執行器的一第二臂。塔架界定一塔架軸線。第一臂及一第二臂自塔架徑向向外延伸。第一末端執行器由第一臂耦接至塔架。第二末端執行器及第三末端執行器由第二臂耦接至塔架。第一末端執行器由第一臂支撐，以用於相對於塔架軸線進行徑向平移。第二末端執行器及第三末端執行器由第二臂支撐，以用於相對於塔架軸線進行徑向平移。本揭露亦描述了基板處理系統、基板處理系統之製造方法、基板傳送方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate transfer robot assembly includes a tower, a first arm with a first end effector, and a second arm with a second end effector and a third end effector. The tower defines a tower axis, the first arm and the second arm extend radially outward from the tower, the first end effector is coupled to the tower by the first arm, and the second end effector and a third end effector are coupled to the tower by the second arm. The first end effector is supported by the first arm for translation from the tower radially relative to the tower axis, and the second end effector and the third end effector are supported by the second arm for translation from the tower radially relative to the tower axis. Substrate processing systems, methods of making substrate processing systems, and substrate transfer methods are also described.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:基板傳送機器人組件</p>
        <p type="p">202:可旋轉塔架/致動器</p>
        <p type="p">210:臂/機械手臂/第一臂</p>
        <p type="p">210d:距離</p>
        <p type="p">212:末端執行器</p>
        <p type="p">212-1:指形件</p>
        <p type="p">212-2:指形件</p>
        <p type="p">220:臂/機械手臂/第二臂</p>
        <p type="p">220d:距離</p>
        <p type="p">222:末端執行器</p>
        <p type="p">222-1:指形件</p>
        <p type="p">222-2:指形件</p>
        <p type="p">224:末端執行器</p>
        <p type="p">224-1:指形件</p>
        <p type="p">224-2:指形件</p>
        <p type="p">226:叉形區段/叉形件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="753px" img-content="tif" inline="yes" orientation="portrait" width="642px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622547</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128641</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120260226B">G02B1/14</main-classification>
        <further-classification edition="200601120260226B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林忠弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, TADAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野敏幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中田啓貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKATA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田涼華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, SUZUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134337</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積層體及偏光積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可抑制高溫條件下之相位差性能之劣化的積層體等。  &lt;br/&gt;積層體依序包含第一保護層、液晶硬化層、及第二保護層。積層體之正面方向之全光線透過率為80%以上，上述積層體之透濕度為20 g/m&lt;sup&gt;2&lt;/sup&gt;/day以下，使光自上述第一保護層側入射至上述第一保護層之表面之法線方向進行測定所得之上述積層體之單體色相之a*值為-5.0～4.0，單體色相之b*值為-5.0～7.0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一保護層</p>
        <p type="p">20:液晶硬化層</p>
        <p type="p">30:第二保護層</p>
        <p type="p">100:積層體</p>
        <p type="p">200:偏光板</p>
        <p type="p">300:偏光積層體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10029.JPG" file="ed10029.JPG" height="476px" img-content="tif" inline="yes" orientation="portrait" width="658px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622102</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128643</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K7/64</main-classification>
        <further-classification edition="200601120260302B">A61K38/12</further-classification>
        <further-classification edition="200601120260302B">A61P1/16</further-classification>
        <further-classification edition="200601120260302B">A61P17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商西藏海思科製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIZANG HAISCO PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張浩亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HAOLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石宗軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, ZONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴龐科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, PANGKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯春岑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110588193</doc-number>
          <date>20240730</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024111857394</doc-number>
          <date>20240823</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2024112813552</doc-number>
          <date>20240912</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>202411558061X</doc-number>
          <date>20241031</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>2024115672630</doc-number>
          <date>20241105</date>
        </priority-claim>
        <priority-claim sequence="6">
          <country>中國大陸</country>
          <doc-number>2024117692465</doc-number>
          <date>20241204</date>
        </priority-claim>
        <priority-claim sequence="7">
          <country>中國大陸</country>
          <doc-number>2025100316341</doc-number>
          <date>20250109</date>
        </priority-claim>
        <priority-claim sequence="8">
          <country>中國大陸</country>
          <doc-number>202510109978X</doc-number>
          <date>20250123</date>
        </priority-claim>
        <priority-claim sequence="9">
          <country>中國大陸</country>
          <doc-number>202510465319X</doc-number>
          <date>20250415</date>
        </priority-claim>
        <priority-claim sequence="10">
          <country>中國大陸</country>
          <doc-number>202510514290X</doc-number>
          <date>20250423</date>
        </priority-claim>
        <priority-claim sequence="11">
          <country>中國大陸</country>
          <doc-number>2025107595035</doc-number>
          <date>20250609</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>白介素-23受體的肽抑制劑及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種白介素-23受體的肽抑制劑及其用途。特別地，本發明涉及白介素-23受體的肽抑制劑、其立體異構體或藥學上可接受的鹽或溶劑化物、其藥物組合物，以及所述肽抑制劑在治療或預防包括炎症性腸病、克羅恩病和銀屑病等疾病或病症中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10740.JPG" file="ed10740.JPG" height="448px" img-content="tif" inline="yes" orientation="portrait" width="761px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622071</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128644</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D413/14</main-classification>
        <further-classification edition="200601120260302B">A01N43/50</further-classification>
        <further-classification edition="200601120260302B">A01N43/56</further-classification>
        <further-classification edition="200601120260302B">A01N43/647</further-classification>
        <further-classification edition="200601120260302B">A01N43/713</further-classification>
        <further-classification edition="200601120260302B">A01P3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商富曼西公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FMC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南迪　喬蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANDI, JYOTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　昇穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, SHENG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷特博伊納　斯里尼瓦斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VHITTABOINA, SRINIVAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　薩普塔什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE, SAPTARSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱密樂蒂　布瑞迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIREDDY, BALREDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林發立</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,594</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>殺真菌的取代的唑</chinese-title>
        <english-title>FUNGICIDAL SUBSTITUTED AZOLES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了具有式&lt;b&gt;1&lt;/b&gt;和式&lt;b&gt;6&lt;/b&gt;的化合物，包括其所有幾何和立體異構物、互變異構物、&lt;i&gt;N&lt;/i&gt;-氧化物和鹽，  &lt;br/&gt;&lt;img align="absmiddle" height="139px" width="173px" file="ed10225.JPG" alt="ed10225.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;或    &lt;img align="absmiddle" height="114px" width="109px" file="ed10226.JPG" alt="ed10226.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、R&lt;sup&gt;4&lt;/sup&gt;、Q、Y、W、A和Z係如本揭露中所定義的。還揭露了含有該等具有式&lt;b&gt;1&lt;/b&gt;的化合物的組成物和用於控制由真菌病原體引起的植物病害之方法，該等方法包括施用有效量的本發明之化合物或組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are compounds of Formula &lt;b&gt;1&lt;/b&gt; and Formula &lt;b&gt;6&lt;/b&gt; including all geometric and stereoisomers, tautomers, &lt;i&gt;N&lt;/i&gt;‑oxides, and salts thereof, &lt;br/&gt;&lt;img align="absmiddle" height="136px" width="172px" file="ed10227.JPG" alt="ed10227.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;or        &lt;img align="absmiddle" height="125px" width="106px" file="ed10228.JPG" alt="ed10228.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;wherein &lt;br/&gt;R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, R&lt;sup&gt;4&lt;/sup&gt;, Q, Y, W, A and Z are as defined in the disclosure. &lt;br/&gt;Also disclosed are compositions containing the compounds of Formula &lt;b&gt;1&lt;/b&gt; and methods for controlling plant disease caused by a fungal pathogen comprising applying an effective amount of a compound&lt;b/&gt;or a composition of the invention.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621978</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128653</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">B81C1/00</main-classification>
        <further-classification edition="200601120260226B">B81B7/00</further-classification>
        <further-classification edition="200601120260226B">G01L9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商忒克塔系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACTA SYSTEMS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢伯　安德烈斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIBL, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>果達　達瑞爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDA, DARIUSZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　派翠克　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, PATRICK M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱日嵩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,840</doc-number>
          <date>20240729</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/959,288</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>嵌入式數位感測器結構</chinese-title>
        <english-title>EMBEDDED DIGITAL SENSOR STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述嵌入式感測器結構及包括複數個嵌入式感測器封裝的可拉伸嵌入式感測器膜。嵌入式感測器結構可包括一感測器封裝，該感測器封裝包括一積體電路(IC)晶粒及接合至IC晶粒的一前側的感測器晶粒，其中該感測器晶粒包括可朝向一空腔偏轉的一膜片。平坦化層側向圍繞該感測器封裝，且金屬佈線形成於該感測器晶粒的一頂部側上，並橫跨該平坦化層上方。亦描述並主張其他態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embedded sensor structures and stretchable embedded sensor films including a plurality of embedded sensor packages are described. An embedded sensor structure may include a sensor package including an integrated circuit (IC) die and sensor die bonded to a front side of the IC die, with the sensor die including a diaphragm that is deflectable toward a cavity. A planarization layer laterally surrounds the sensor package, and metal routing is formed on a top side of the sensor die and spanning over the planarization layer. Other aspects are also described and claimed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:感測器封裝</p>
        <p type="p">120:平坦化層</p>
        <p type="p">122:金屬佈線</p>
        <p type="p">126:封裝材料突起</p>
        <p type="p">134:應變回應材料層</p>
        <p type="p">162:集線器平台</p>
        <p type="p">164:可撓性臂</p>
        <p type="p">CLK:時脈</p>
        <p type="p">GND:接地</p>
        <p type="p">OUT:輸出</p>
        <p type="p">SEL:選擇線</p>
        <p type="p">VDD:電源</p>
        <p type="p">VSS:接地/低電源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="821px" img-content="tif" inline="yes" orientation="portrait" width="808px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623050</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128658</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01J37/32</main-classification>
        <further-classification edition="200601120260225B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松山昇一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUYAMA, SHOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口伸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,007</doc-number>
          <date>20240730</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-176379</doc-number>
          <date>20241008</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2025/025489</doc-number>
          <date>20250716</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之電漿處理裝置，包含：處理室、基板支持部、電漿生成部，以及偏壓電源。基板支持部，配置在處理室內。基板支持部的介電體部，包含：中央區域、邊緣區域，以及中央區域與邊緣區域之間的中間區域。中央區域、中間區域以及邊緣區域，提供了基板支持面。靜電吸盤，更包含與偏壓電源電耦合的偏壓電極。偏壓電極，沿著徑向具有偏壓電極與基板支持面之間的距離的分布，或者，在中央區域、中間區域以及邊緣區域之中並未形成於中央區域或中間區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11A:基板支持部</p>
        <p type="p">31a:第1射頻信號生成部</p>
        <p type="p">31m:匹配器</p>
        <p type="p">51a:偏壓電源</p>
        <p type="p">51m:匹配器</p>
        <p type="p">52a:偏壓電源</p>
        <p type="p">52m:匹配器</p>
        <p type="p">61:介電體部</p>
        <p type="p">62:靜電吸盤電極</p>
        <p type="p">62e:邊緣電極</p>
        <p type="p">62m:中間電極</p>
        <p type="p">62c:中央電極</p>
        <p type="p">64:偏壓電極</p>
        <p type="p">64e:邊緣部</p>
        <p type="p">64m:中間部</p>
        <p type="p">64c:中央部</p>
        <p type="p">65:偏壓電極</p>
        <p type="p">111a:中央區域</p>
        <p type="p">111b:環狀區域</p>
        <p type="p">611:中央區域</p>
        <p type="p">612:中間區域</p>
        <p type="p">613:邊緣區域</p>
        <p type="p">631,632:靜電吸盤電極</p>
        <p type="p">1110:基台</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">AX:軸線</p>
        <p type="p">ER:邊緣環</p>
        <p type="p">Le,Lm,Lc:距離</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="772px" img-content="tif" inline="yes" orientation="portrait" width="1052px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622085</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128665</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D498/22</main-classification>
        <further-classification edition="200601120260302B">A61K31/437</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商榮山醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLOSSOMHILL THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　景榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, JINGRONG JEAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江　萬龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, WANLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵　澤智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, Z. JESSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛里多　蒙塔爾　安東尼歐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARRIDO-MONTALBAN, ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅傑斯　伊凡　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROGERS, EVAN W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芮　元金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RUI, EUGENE YUANJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,368</doc-number>
          <date>20240730</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/815,539</doc-number>
          <date>20250531</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/846,511</doc-number>
          <date>20250718</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>氮雜吲唑大環化合物固體形式</chinese-title>
        <english-title>AZAINDAZOLE MACROCYCLE SOLID FORMS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於(2S)-2-[(10S,17E)-16-乙氧基-6,8,10,12,20-五甲基-2,8,10,11,12,13-六氫-14H-5,3-(氮烯基亞甲橋)三吡唑并[3,4-f:3',4'-j:4'',3''-n][1,4]氧雜氮雜環十五炔-14-基]丙-1-醇之固體形式，其適用於治療哺乳動物之疾病，諸如癌症。本發明亦關於此等固體形式，包括同質異晶物、鹽、共晶體、溶劑合物、水合物或其組合之製備。本發明亦關於包括此等固體形式之組合物，以及使用此等組合物治療哺乳動物，尤其人類之疾病，諸如癌症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to solid forms of (2S)-2-[(10S,17E)-16-ethoxy-6,8,10,12,20-pentamethyl-2,8,10,11,12,13-hexahydro-14H-5,3-(azenometheno)tripyrazolo[3,4-f:3',4'-j:4'',3''-n][1,4]oxazacyclopentadecin-14-yl]propan-1-ol&lt;b/&gt;that are useful in the treatment of disease, such as cancer, in mammals. This disclosure also relates to the preparation of such solid forms, including polymorphs, salts, cocrystals, solvates, hydrates, or a combination thereof. This disclosure also relates to compositions including such solid forms, and to methods of using such compositions in the treatment of diseases, such as cancer, in mammals, especially in humans.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10058.JPG" file="ed10058.JPG" height="550px" img-content="tif" inline="yes" orientation="portrait" width="726px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623578</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128670</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
        <further-classification edition="200601120260302B">B65G47/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越石和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSHIISHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤榮幾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, EIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川口翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAGUCHI, TSUBASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林典之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, NORIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-130929</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板搬送方法及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用具備多層會保持基板的拾取具的搬送臂來適當地搬送多個基板。  &lt;br/&gt;一種基板搬送方法，係在基板處理裝置進行；基板處理裝置具有：處理模組，係對多個基板進行處理；以及搬送機構，係具有具備多層會保持基板的拾取具的搬送臂來相對處理模組搬送基板；基板搬送方法係包含：工序(a)，係當多層拾取具中的一個拾取具所保持的基板與其他拾取具所保持的基板不會互相影響的無影響的情形，會決定成以多層拾取具來保持基板的第1搬送模式，而當一個拾取具所保持的基板與其他拾取具所保持的基板會互相影響的有影響的情形，會決定成以多層拾取具的任一者來保持基板的第2搬送模式；以及工序(b)，係在前述工序(a)中決定的第1搬送模式或第2搬送模式下搬送基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="563px" img-content="tif" inline="yes" orientation="portrait" width="707px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621838</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128682</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">B23Q1/25</main-classification>
        <further-classification edition="200601120260225B">B23Q3/157</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>越本崇仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSHIMOTO, TAKAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石山尚彌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIYAMA, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/029523</doc-number>
          <date>20240820</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>工具機與工具匣之位置調整機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可以簡單且正確地進行工具機與工具匣之位置的調整之工具機與工具匣之位置調整機構。&lt;br/&gt;  一種工具機10與工具匣30之位置調整機構，具備：旋轉凸輪41，設置於基座部11，且能以旋轉中心為中心來進行旋轉動作；溝部31a，設置於匣基座31，且抵接於旋轉凸輪41的凸輪面41e；及引導溝31b，當旋轉凸輪41推壓溝部31a時，將基座部11與匣基座31之相對的移動在一方向上引導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基座部</p>
        <p type="p">31:匣基座</p>
        <p type="p">31a:溝部</p>
        <p type="p">31b:引導溝、引導部</p>
        <p type="p">40:位置調整機構</p>
        <p type="p">41:旋轉凸輪</p>
        <p type="p">41b:護緣部</p>
        <p type="p">41c:平面部</p>
        <p type="p">42:固定螺栓</p>
        <p type="p">43:按壓構件</p>
        <p type="p">44:凸輪螺栓</p>
        <p type="p">44c:頭部</p>
        <p type="p">44d:六角孔</p>
        <p type="p">B-B:箭頭</p>
        <p type="p">J9:凸輪旋轉中心</p>
        <p type="p">+X,-X,+Y,-Y:側</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="1011px" img-content="tif" inline="yes" orientation="portrait" width="667px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621747</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128697</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61L2/00</main-classification>
        <further-classification edition="202601120260302B">A61L2/08</further-classification>
        <further-classification edition="200601120260302B">G01N27/30</further-classification>
        <further-classification edition="200601120260302B">G01N33/48</further-classification>
        <further-classification edition="200601120260302B">G01N33/543</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澳大利亞商ＮＵＴＲＯＭＩＣＳ科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NUTROMICS TECHNOLOGY PTY LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
              <english-address>AU</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍根　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOGAN, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
              <english-address>AU</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉爾森　米克爾弗雷澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARSON, MIKEL FRASER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法恩科普夫　阿什利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FARNKOPF, ASHLEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,469</doc-number>
          <date>20240729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>降低分析物識別元件或感測器的工作電極的生物負載的方法、製造的工作電極的方法、降低封裝的感測器的生物負載的方法及封裝</chinese-title>
        <english-title>METHOD OF REDUCING BIOBURDEN OF ANALYTE RECOGNITION ELEMENT OR WORKING ELECTRODE OF SENSOR, METHOD OF PRODUCING WORKING ELECTRODE, METHOD OF REDUCING BIOBURDEN OF PACKAGED SENSOR AND PACKET</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於製備用於動物受試者的基於適體的感測器的消毒或滅菌的多種方法。已發現，包括於滅菌劑量的電子束輻射的輻射，可使感測器具有對目標分析物有用的靈敏度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for disinfecting or sterilizing aptamer-based sensors in preparation for application to an animal subject. Irradiation, including e-beam irradiation at sterilizing doses, is found to result in sensors having useful sensitivity to a target analyte.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.JPG" file="ed10027.JPG" height="633px" img-content="tif" inline="yes" orientation="portrait" width="264px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623311</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128727</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H05H1/46</main-classification>
        <further-classification edition="200601120260225B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野裕仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, HIROHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-130128</doc-number>
          <date>20240806</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-006347</doc-number>
          <date>20250116</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2025/026477</doc-number>
          <date>20250725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之電漿處理裝置具備：電漿處理腔室，其於內部具有電漿處理空間；基板支持部，其設置於上述電漿處理腔室之內部，對基板予以支持；電漿產生部，其於上述電漿處理空間產生電漿；及磁場產生部，其設置於上述基板支持部之上方，於上述電漿處理空間產生磁場。上述磁場產生部包含：複數個電磁鐵，其等排列於水平方向；及磁鐵，其設置於較上述複數個電磁鐵中位於最靠近上述基板支持部之中心軸線之位置的電磁鐵更靠內側、且接近上述基板支持部之位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">2:控制部</p>
        <p type="p">2a:電腦</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通信介面</p>
        <p type="p">10:電漿處理腔室</p>
        <p type="p">10a:側壁</p>
        <p type="p">10e:氣體排出口</p>
        <p type="p">10s:電漿處理空間</p>
        <p type="p">11:基板支持部</p>
        <p type="p">13:簇射頭</p>
        <p type="p">13a:氣體供給口</p>
        <p type="p">13b:氣體擴散室</p>
        <p type="p">13c:氣體導入口</p>
        <p type="p">20:氣體供給部</p>
        <p type="p">21:氣體源</p>
        <p type="p">22:流量控制器</p>
        <p type="p">30:電源</p>
        <p type="p">31:RF電源</p>
        <p type="p">31a:第1RF產生部</p>
        <p type="p">31b:第2RF產生部</p>
        <p type="p">32:DC電源</p>
        <p type="p">32a:第1DC產生部</p>
        <p type="p">32b:第2DC產生部</p>
        <p type="p">40:排氣系統</p>
        <p type="p">50:磁場產生部</p>
        <p type="p">51:電磁鐵</p>
        <p type="p">51a:第1電磁鐵</p>
        <p type="p">51b:第2電磁鐵</p>
        <p type="p">51c:第3電磁鐵</p>
        <p type="p">51d:第4電磁鐵</p>
        <p type="p">51e:第5電磁鐵</p>
        <p type="p">52:中心區域用電磁鐵</p>
        <p type="p">59:電磁鐵激發電路</p>
        <p type="p">111:本體部</p>
        <p type="p">111a:中央區域</p>
        <p type="p">111b:環狀區域</p>
        <p type="p">112:環組件</p>
        <p type="p">1110:基台</p>
        <p type="p">1110a:流路</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">1111a:陶瓷構件</p>
        <p type="p">1111b:靜電電極</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="778px" img-content="tif" inline="yes" orientation="portrait" width="1041px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623362</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128744</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260226B">H10B43/10</main-classification>
        <further-classification edition="202301120260226B">H10B43/27</further-classification>
        <further-classification edition="202301120260226B">H10B43/35</further-classification>
        <further-classification edition="200601120260226B">G11C16/08</further-classification>
        <further-classification edition="200601120260226B">G11C16/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美光科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福住嘉晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUZUMI, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川健一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, KENICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏爾馬　潘卡吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARMA, PANKAJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,515</doc-number>
          <date>20240729</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/247,782</doc-number>
          <date>20250624</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>在製造過程中增加矽柱之Ｐ型區域之深度之製造電子電路之方法</chinese-title>
        <english-title>METHODS OF MANUFACTURING AN ELECTRONIC CIRCUIT TO INCREASE THE DEPTH OF A P-TYPE REGION OF A SILICON COLUMN DURING MANUFACTURING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示包含以下項之系統及方法：形成一電子電路之一交替層堆疊，該交替層堆疊包括複數個交替之導電層及介電層；在該交替層堆疊中形成一組記憶體胞元柱，其中該組記憶體胞元柱之一底側接合至控制電路系統；及用一摻雜劑摻雜該組記憶體胞元柱之一頂側，其中藉由以一預定角度朝向該組記憶體胞元柱之該頂側發射該摻雜劑以在該組記憶體胞元柱之各記憶體胞元柱中形成材料之一摻雜區域來執行該摻雜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Systems and methods are disclosed including forming an alternating layer stack of an electronic circuit, the alternating layer stack comprising a plurality alternating conductive and dielectric layers; forming a set of memory cell columns in the alternating layer stack, wherein a bottom side of the set of memory cell columns is bonded to control circuitry; and doping, with a dopant, a top side of the set of memory cell columns, wherein the doping is performed by emitting the dopant toward the top side of the set of memory cell columns at a predetermined angle to form a doped region of material in each memory cell column of the set of memory cell columns.</p>
      </isu-abst>
      <representative-img>
        <p type="p">164:金屬矽化物層</p>
        <p type="p">202A-202D:字線</p>
        <p type="p">204B:柱</p>
        <p type="p">210:路徑</p>
        <p type="p">212:路徑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.JPG" file="ed10026.JPG" height="725px" img-content="tif" inline="yes" orientation="portrait" width="1025px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622928</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128767</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G09B23/30</main-classification>
        <further-classification edition="200601120260302B">A61B1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東北大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHOKU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮脇真奈美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAWAKI, MANAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福田祐子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDA, YUKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅野武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANNO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒田悠太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARATA, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>正宗淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASAMUNE, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-122935</doc-number>
          <date>20240730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>黏膜模型</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種黏膜模型，其能夠於表面施加標記時，輕鬆目視確認標記位置。  &lt;br/&gt;一種黏膜模型，其具有第一層、和層疊於第一層上之第二層，其中，該第一層之厚度為0.01～3mm，該第二層之整個表面或一部分之體積電阻率為1.0×10&lt;sup&gt;1&lt;/sup&gt;～1.0×10&lt;sup&gt;7&lt;/sup&gt;Ω·cm，該第一層與該第二層之色差ΔE為20以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:黏膜模型</p>
        <p type="p">2:模擬黏膜層</p>
        <p type="p">21:第一層</p>
        <p type="p">22:第二層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="301px" img-content="tif" inline="yes" orientation="portrait" width="622px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622649</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128776</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G03F9/00</main-classification>
        <further-classification edition="200601120260224B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商迪睿合股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEXERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東北大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOHOKU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金杉駿介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANASUGI, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梶谷俊一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAJIYA, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, MASARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早川俊昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYAKAWA, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-123219</doc-number>
          <date>20240730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>位置對合方法、製造方法、微影方法、位置對合裝置以及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實施形態的位置對合方法係包含：積層形成有第一排列體之第一物體以及形成有具有前述第一週期構造的第二排列體之第二物體；對所積層的前述第一物體以及前述第二物體照射光；檢測分別穿透了前述第一物體的前述第一排列體以及前述第二物體的前述第二排列體的前述光的訊號；以及基於複數個前述訊號算出所積層的前述第一物體以及前述第二物體的位置偏移；於前述第一物體的任一方的面形成有前述第一排列體；於前述第二物體的表面與背面中之未與前述第一物體對向之面形成有前述第二排列體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:位置對合裝置</p>
        <p type="p">20:攝影機</p>
        <p type="p">22:透鏡</p>
        <p type="p">30:固定台</p>
        <p type="p">40:XYZθ軸可動台</p>
        <p type="p">50:照明裝置</p>
        <p type="p">100:控制裝置</p>
        <p type="p">OB1:第一物體</p>
        <p type="p">OB2:第二物體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="881px" img-content="tif" inline="yes" orientation="portrait" width="737px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622087</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128785</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D513/04</main-classification>
        <further-classification edition="200601120260302B">C07D519/00</further-classification>
        <further-classification edition="200601120260302B">A61K31/429</further-classification>
        <further-classification edition="200601120260302B">A61K31/5383</further-classification>
        <further-classification edition="200601120260302B">A61K31/537</further-classification>
        <further-classification edition="200601120260302B">A61K31/433</further-classification>
        <further-classification edition="200601120260302B">A61K31/5365</further-classification>
        <further-classification edition="200601120260302B">A61K31/424</further-classification>
        <further-classification edition="200601120260302B">A61K31/438</further-classification>
        <further-classification edition="200601120260302B">A61K31/437</further-classification>
        <further-classification edition="200601120260302B">A61K31/4188</further-classification>
        <further-classification edition="200601120260302B">A61P3/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海美悅生物科技發展有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI MEIYUE BIOTECH DEVELOPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳友喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YOUXI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳現民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIANMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳永凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YONGKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付賢磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, XIANLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110262574</doc-number>
          <date>20240730</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>202411429329X</doc-number>
          <date>20241014</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025100888406</doc-number>
          <date>20250121</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2025102337770</doc-number>
          <date>20250228</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>2025105883165</doc-number>
          <date>20250508</date>
        </priority-claim>
        <priority-claim sequence="6">
          <country>中國大陸</country>
          <doc-number>2025108806512</doc-number>
          <date>20250627</date>
        </priority-claim>
        <priority-claim sequence="7">
          <country>中國大陸</country>
          <doc-number>2025110218330</doc-number>
          <date>20250723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種雜環化合物、其製備方法和用途</chinese-title>
        <english-title>HETEROCYCLIC COMPOUND, PREPARATION METHODS THEREFOR AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種雜環化合物、其製備方法和用途。具體提供了一類式(IG)所示的雜環化合物或其藥學上可接受的鹽。本發明所提供的雜環化合物或其藥學上可接受的鹽可用於製備預防和/或治療c-kit介導的疾病或病症的藥物。  &lt;br/&gt;&lt;img align="absmiddle" height="170px" width="215px" file="ed10832.JPG" alt="ed10832.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention discloses a heterocyclic compound, preparation methods therefor, and uses thereof. Specifically, it provides a heterocyclic compound represented by formula (IG) or a pharmaceutically acceptable salt thereof. The heterocyclic compound or a pharmaceutically acceptable salt thereof provided by this invention can be used to prepare remedies for the prevention and/or treatment of c-kit-mediated diseases or conditions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622049</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128789</doc-number>
          <kind></kind>
          <date>114/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D271/10</main-classification>
        <further-classification edition="200601120260302B">C07D207/448</further-classification>
        <further-classification edition="200601120260302B">C07D249/04</further-classification>
        <further-classification edition="200601120260302B">C07D413/12</further-classification>
        <further-classification edition="201001120260302B">C12N15/113</further-classification>
        <further-classification edition="201701120260302B">A61K47/54</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛羅海德製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARROWHEAD PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納克勒爾里歐　喬治　三世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NACLERIO, GEORGE, III</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎　克里斯多夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAIN, CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　曉愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAOKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>裴　濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEI, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/676,686</doc-number>
          <date>20240729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於遞送治療劑的脂質結合物</chinese-title>
        <english-title>LIPID CONJUGATES FOR THE DELIVERY OF THERAPEUTIC AGENTS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示包含PK/PD調節劑的根據式(&lt;b&gt;I&lt;/b&gt;)之化合物，其用於將基於寡核苷酸之藥劑(例如雙股RNAi藥劑)遞送至活體內某些細胞類型，例如心肌細胞。本文所揭示之化合物當與基於寡核苷酸之治療劑或診斷劑(諸如RNAi藥劑)結合時可增強組合物遞送至所靶向之特定細胞，以促進抑制該等細胞中基因表現。  &lt;br/&gt;&lt;img align="absmiddle" height="149px" width="293px" file="ed10262.JPG" alt="ed10262.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are compounds according to Formula (&lt;b&gt;I&lt;/b&gt;) comprising PK/PD modulators for delivery of oligonucleotide-based agents, e.g., double stranded RNAi agents, to certain cell types, for example cardiomyocytes, &lt;i&gt;in vivo&lt;/i&gt;. The compounds disclosed herein, when conjugated to an oligonucleotide-based therapeutic or diagnostic agent, such as an RNAi agent, can enhance the delivery of the composition to the specified cells being targeted to facilitate the inhibition of gene expression in those cells. &lt;br/&gt;&lt;img align="absmiddle" height="139px" width="315px" file="ed10263.JPG" alt="ed10263.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623051</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128847</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01J37/32</main-classification>
        <further-classification edition="200601120260225B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長井紀樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAI, YOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134004</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所揭示之電漿處理裝置具備腔室、電漿產生部、基板支持部、邊緣環、升降機構及氣流發生器。升降機構包含導電環及致動器。導電環以包圍靜電吸盤之方式配置。致動器構成為使其上支持有邊緣環之狀態之導電環與邊緣環一起上下移動。導電環提供氣體流路及一個以上之氣孔。一個以上之氣孔經由氣體流路而連接於氣流發生器。一個以上之氣孔包含至少一個氣孔。至少一個氣孔朝向導電環與靜電吸盤之間的間隙開口。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電漿處理裝置</p>
        <p type="p">11:基板支持部</p>
        <p type="p">50:升降機構</p>
        <p type="p">51:導電環</p>
        <p type="p">51a,51b,51c,51d,51e,51x:氣孔</p>
        <p type="p">52:桿</p>
        <p type="p">53:致動器</p>
        <p type="p">54:連接構件</p>
        <p type="p">54a:上部</p>
        <p type="p">54b:變形部</p>
        <p type="p">54c:下部</p>
        <p type="p">55:氣體供給部</p>
        <p type="p">56:第1加熱器</p>
        <p type="p">111:本體部</p>
        <p type="p">111a:中央區域</p>
        <p type="p">111b:環狀區域</p>
        <p type="p">111s:側壁面</p>
        <p type="p">510:內周面</p>
        <p type="p">511:第1上表面</p>
        <p type="p">512:第2上表面</p>
        <p type="p">513,515:外周面</p>
        <p type="p">514:內周面</p>
        <p type="p">516:第1下表面</p>
        <p type="p">1110:基台</p>
        <p type="p">1110b:第1上表面</p>
        <p type="p">1110c:第2上表面</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">1111b:靜電吸盤電極</p>
        <p type="p">1111c:多孔質構件</p>
        <p type="p">BEa:電極</p>
        <p type="p">BEb:電極</p>
        <p type="p">CR:蓋環</p>
        <p type="p">FP:氣體流路</p>
        <p type="p">FP1:第1氣體流路</p>
        <p type="p">FP2:第2氣體流路</p>
        <p type="p">FP3:第3氣體流路</p>
        <p type="p">GF:氣流發生器</p>
        <p type="p">IM:絕緣構件</p>
        <p type="p">LR:邊緣環</p>
        <p type="p">P1:第1部分</p>
        <p type="p">P2:第2部分</p>
        <p type="p">UR:邊緣環</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="867px" img-content="tif" inline="yes" orientation="portrait" width="748px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623503</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128860</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10N30/072</main-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
        <further-classification edition="202601120260302B">H10P90/00</further-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商索泰克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOITEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德慕茲蒂亞　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE MOUSTIER, EDOUARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>法國</country>
          <doc-number>FR2408483</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於製備單域鐵電材料薄層之方法</chinese-title>
        <english-title>METHOD FOR PREPARING A THIN LAYER OF MONODOMAIN FERROELECTRIC MATERIAL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於製備鐵電材料之一單域薄層之方法，該方法包括將鐵電層從一供體基板移轉至一接收基板，然後進行熱處理(Stab)及薄化(Thin)，熱處理包括：使溫度升至一高溫，該高溫在400°C與形成鐵電層之鐵電材料的居里溫度之間；使溫度維持大於或等於30分鐘的時間；然後使溫度下降，該升溫包括一升溫梯度，其溫度變化速率大於7°C/min，使得移轉的鐵電層於升溫梯度結束時達到介於400°C與居里溫度之間的溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a method for preparing a thin monodomain layer of ferroelectric material, the method comprising transferring the layer from a donor substrate to a receiving substrate, followed by thermal treatment (Stab) and then thinning (Thin), the thermal treatment comprising: raising the temperature to a high temperature of between 400°C and the Curie temperature of the ferroelectric material forming the layer; maintaining the temperature for a time greater than or equal to 30 min; then lowering the temperature, the temperature rise comprising a temperature ramp-up performed at a rate of temperature change greater than 7°C/min and such that the transferred ferroelectric layer reaches a temperature of between 400°C and the Curie temperature at the end of the ramp.</p>
      </isu-abst>
      <representative-img>
        <p type="p">DevSub:元件基板</p>
        <p type="p">DonSub:供體基板</p>
        <p type="p">Fract:斷裂</p>
        <p type="p">Frgl:脆化平面</p>
        <p type="p">Set:接合件</p>
        <p type="p">Stab:穩定熱處理</p>
        <p type="p">SurfTreat:表面處理</p>
        <p type="p">Thin:薄化</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="633px" img-content="tif" inline="yes" orientation="portrait" width="650px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202623616</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128861</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P90/00</main-classification>
        <further-classification edition="202601120260302B">H10W10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商索泰克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOITEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅達尼未　西薩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RODA NEVE, CESAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高丁　葛威塔茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAUDIN, GWELTAZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于耶　伊莎貝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUYET, ISABELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　璧顏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, BICH-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希卡維　安德烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIKAVYY, ANDRIY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>法國</country>
          <doc-number>FR2408487</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於製造量子應用矽基板之方法</chinese-title>
        <english-title>PROCESS FOR FABRICATING A SILICON SUBSTRATE FOR QUANTUM APPLICATIONS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於製造一結構之方法(100)，該結構包含支撐一矽層(28Si&lt;sub&gt;Don&lt;/sub&gt;)之一載體基板(Si_Waf&lt;sub&gt;Car&lt;/sub&gt;)，以及一氧化層(28SiO2)夾置於該載體基板與該矽層之間，該方法包括將形成於一供體結構(Don)的矽鍺合金層(SiGe)上之第一矽層(28Si&lt;sub&gt;Don&lt;/sub&gt;)移轉到該載體基板(Si_Waf&lt;sub&gt;Car&lt;/sub&gt;)上，然後移除該供體結構的基板(Si_Waf&lt;sub&gt;Don&lt;/sub&gt;)和矽鍺合金層(SiGe)，該第一矽層(28Si&lt;sub&gt;Don&lt;/sub&gt;)由至少99.92%的矽同位素矽28(&lt;sup&gt;28&lt;/sup&gt;Si)所構成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Process (100) for fabricating a structure comprising a carrier substrate (Si_Waf&lt;sub&gt;Car&lt;/sub&gt;) supporting a silicon layer (28Si&lt;sub&gt;Don&lt;/sub&gt;) and an oxide layer (28SiO2) interposed between the silicon layer and the carrier substrate, the process comprising transferring the first silicon layer (28Si&lt;sub&gt;Don&lt;/sub&gt;), formed on a layer (SiGe) of a silicon-germanium alloy on a donor structure (Don), onto the carrier substrate (Si_Waf&lt;sub&gt;Car&lt;/sub&gt;), and then removing the substrate (Si_Waf&lt;sub&gt;Don&lt;/sub&gt;) of the donor structure and the layer (SiGe) of silicon-germanium, the silicon layer (28Si&lt;sub&gt;Don&lt;/sub&gt;) being constituted of at least 99.92% of the &lt;sup&gt;28&lt;/sup&gt;Si isotope of silicon.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">110&lt;sub&gt;Car&lt;/sub&gt;,110&lt;sub&gt;Don&lt;/sub&gt;,120&lt;sub&gt;Car&lt;/sub&gt;,120&lt;sub&gt;Don&lt;/sub&gt;,130&lt;sub&gt;Car&lt;/sub&gt;,130&lt;sub&gt;Don&lt;/sub&gt;,140&lt;sub&gt;Don&lt;/sub&gt;,150~190:步驟</p>
        <p type="p">28SiO2:氧化層</p>
        <p type="p">28Si&lt;sub&gt;Car&lt;/sub&gt;:阻擋層</p>
        <p type="p">28Si&lt;sub&gt;Don&lt;/sub&gt;:表面層</p>
        <p type="p">Etch(Si_Waf&lt;sub&gt;Don-1&lt;/sub&gt;),Etch(SiGe):選擇性蝕刻</p>
        <p type="p">Fgrl:弱化平面</p>
        <p type="p">Strct:結構</p>
        <p type="p">SiGe:矽鍺合金層/蝕刻停止層</p>
        <p type="p">Si_Waf&lt;sub&gt;Car&lt;/sub&gt;:載體基板</p>
        <p type="p">Si_Waf&lt;sub&gt;Don&lt;/sub&gt;:供體基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="830px" img-content="tif" inline="yes" orientation="portrait" width="701px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623021</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128873</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H01H13/52</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＩＳＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TISM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中嶋友和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, TOMOKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-129804</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>開關及開關模組</chinese-title>
        <english-title>SWITCH AND SWITCH MODULE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的開關（10）依序積層有具有第1電極部（41）的內層（20）、間隔物（60）、具有第2電極部（51）的外層（30）。第1電極部（41）為藉由通過上線及下線的車縫而形成在內層（20）上者。形成第1電極部（41）的上線及下線當中，在朝向第2電極部（51）的面上露出的比例較高的線為導電絲。第2電極部（51）為藉由通過上線及下線的車縫而形成在外層（30）上者。形成第2電極部（51）的上線及下線當中，在朝向第1電極部（41）的面上露出的比例較高的線為導電絲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:開關</p>
        <p type="p">20:內層</p>
        <p type="p">30:外層</p>
        <p type="p">41:第1電極部</p>
        <p type="p">51:第2電極部</p>
        <p type="p">60:間隔物</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="591px" img-content="tif" inline="yes" orientation="portrait" width="559px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622227</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128882</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12C12/00</main-classification>
        <further-classification edition="200601120260302B">C12C5/00</further-classification>
        <further-classification edition="201901120260302B">C12G3/02</further-classification>
        <further-classification edition="200601120260302B">A23L2/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商麒麟控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIN HOLDINGS KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋沙織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藝萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKI, MEBAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋友理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-128068</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>啤酒風味發酵飲料及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種新穎之啤酒風味發酵飲料，其嘌呤體濃度降低，並且因嘌呤體濃度降低所致之香味之惡化得到改善。根據本發明，提供一種啤酒風味發酵飲料，其嘌呤體濃度為35,000 ppb以下，或腺苷濃度為15,000 ppb以下，或鳥苷濃度為56,000 ppb以下，且γ-壬內酯濃度為10 ppb以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622228</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128884</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C12C12/00</main-classification>
        <further-classification edition="200601120260223B">C12C11/00</further-classification>
        <further-classification edition="200601120260223B">C12C7/00</further-classification>
        <further-classification edition="200601120260223B">C12C5/02</further-classification>
        <further-classification edition="200601120260223B">C12H1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商麒麟控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIN HOLDINGS KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋沙織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藝萌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKI, MEBAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋友理</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-128072</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>啤酒風味發酵飲料及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種新穎之啤酒風味發酵飲料，其嘌呤體濃度降低，並且因嘌呤體濃度降低所致之香味之惡化得到改善。根據本發明，提供一種啤酒風味發酵飲料，其嘌呤體濃度為35,000 ppb以下，或腺苷濃度為15,000 ppb以下，或鳥苷濃度為56,000 ppb以下，且糠醛濃度為10 ppb以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622116</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128886</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">C07D491/22</further-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商西雅圖免疫公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYSTIMMUNE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓識</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHUO, SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬維李</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, WEILI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李剛銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GANGRUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110304543</doc-number>
          <date>20240730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>抗人ＲＯＲ１抗體－藥物偶聯物及其用途</chinese-title>
        <english-title>ANTI-HUMAN ROR1 ANTIBODY-DRUG CONJUGATE AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案涉及一種抗人ROR1抗體與喜樹堿類藥物形成的抗體-藥物偶聯物，以及該抗體-藥物偶聯物的醫藥用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application relates to an antibody-drug conjugate formed with an anti-human ROR1 antibody and a camptothecin derivative, and a medicinal use of the antibody-drug conjugate.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10659.JPG" file="ed10659.JPG" height="395px" img-content="tif" inline="yes" orientation="portrait" width="627px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622441</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128895</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">F28D15/02</main-classification>
        <further-classification edition="200601120260224B">F28F3/12</further-classification>
        <further-classification edition="200601120260224B">F28D1/03</further-classification>
        <further-classification edition="200601120260224B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商雅洛伊企業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALLOY ENTERPRISES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛拉赫堤　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLAHERTY, WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西蒙　凱文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIMON, KEVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐葛科夫　艾雷克桑德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGARKOV, ALEKSANDR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧希爾　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUSSIER, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆勒　瑟賽里亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MULLER, CECELIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波茲傑姆斯基　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRZYJEMSKI, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,110</doc-number>
          <date>20240730</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/791,225</doc-number>
          <date>20250418</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/US25/32985</doc-number>
          <date>20250610</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於兩相冷卻的格狀結構</chinese-title>
        <english-title>LATTICE STRUCTURES FOR TWO-PHASE COOLING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示用於兩相冷卻的格狀結構部件之方法及構形。實施例包含：一部件，其包括經構形用於兩相流體流動之一流動路徑；及一格狀結構，其界定該部件內之該流動路徑之至少一部分，其中該格狀結構經構形以具有沿該流動路徑動態變動之一水力直徑以增加氣相之內部體積。一些實施例包含經由層壓物體製造方法製造格狀結構部件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and configurations for lattice structured parts for two-phase cooling. Embodiments include a part comprising a flow path configured for two-phase fluid flow and a lattice structure defining at least a portion of the flow path within the part, wherein the lattice structure is configured to have a hydraulic diameter that varies dynamically along the flow path to increase internal volume for vapor phase. Some embodiments include the manufacture of lattice structured parts via laminated object manufacturing methods.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:格狀結構</p>
        <p type="p">102:結構橫桿</p>
        <p type="p">103:空隙空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="783px" img-content="tif" inline="yes" orientation="portrait" width="756px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621677</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128899</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/155</main-classification>
        <further-classification edition="200601120260302B">A61K31/7048</further-classification>
        <further-classification edition="200601120260302B">A61K9/24</further-classification>
        <further-classification edition="200601120260302B">A61K47/38</further-classification>
        <further-classification edition="200601120260302B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商韓美藥品股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANMI PHARM. CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>咸謹柱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAM, GUN JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金載學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE HAK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金載鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAE HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權宅灌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, TAEK KWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁鐵生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0100858</doc-number>
          <date>20240730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有改善的溶解率和生產率之包含二甲雙胍和恩格列淨之醫藥組合調配物</chinese-title>
        <english-title>PHARMACEUTICAL COMBINATION FORMULATION COMPRISING METFORMIN AND EMPAGLIFLOZIN WITH IMPROVED DISSOLUTION RATE AND PRODUCTIVITY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明相關於一種包含二甲雙胍(metformin)和恩格列淨(empagliflozin)之醫藥組合調配物，其具有優異之穩定性並顯示出與單一藥物投藥時相似之溶解曲線，以及一種以高生產率製備該醫藥組合調配物之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a pharmaceutical combination formulation comprising metformin and empagliflozin, which has excellent stability and shows a dissolution profile similar to that when single drugs are administered, and a method for producing the pharmaceutical combination formulation with high productivity.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="478px" img-content="tif" inline="yes" orientation="portrait" width="737px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622521</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128909</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">G01R31/11</main-classification>
        <further-classification edition="200601120260225B">H01F6/02</further-classification>
        <further-classification edition="200601120260225B">H02H7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>義大利商埃尼公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENI S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧特羅塔　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TROTTA, ANTONIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>義大利</country>
          <doc-number>102024000018394</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用以檢測超導體中電阻性轉變區之方法及裝置</chinese-title>
        <english-title>METHOD AND DEVICE FOR DETECTING A RESISTIVE TRANSITION ZONE IN A SUPERCONDUCTOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以檢測設置有一冷卻系統(3)之一超導體(2)中之一電阻性轉變區的裝置，該冷卻系統使超導體(2)維持處於比臨界溫度更低之一溫度，該裝置包含：一發射器裝置(5)，其被組配用以將一脈衝列T(x)注入到超導體(2)中；一第一檢測器(7)，用以檢測因脈衝列T(x)在超導體(2)之超導性介質中之反射所產生之信號；第一檢測器(7)係耦合於該超導體之一第一端(2-a)；一第二檢測器(9)，用以檢測因脈衝列T(x)在該超導性介質中之折射所產生之信號；第二檢測器(9)係耦合於超導體(2)之一第二端(2-b)；一處理單元(12)，組配來在下列情況下檢測超導體(2)中之一電阻性轉變區之形成：第一感測器(7)檢測到因脈衝列T(x)在超導性介質中之反射所產生之信號S&lt;sub&gt;R&lt;/sub&gt;(x)；及/或第二感測器(9)檢測到因脈衝列T(x)在超導性介質中之折射所產生之信號S&lt;sub&gt;F&lt;/sub&gt;(x)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Device for detecting a resistive transition zone in a superconductor (2) provided with a cooling system (3) which maintains the superconductor (2) at a temperature lower than the critical temperature comprising: an emitter device (5) configured to inject a pulse train T(x) into the superconductor (2); a first detector (7) for detecting signals resulting from the reflection of the pulse train T(x) in the superconductive medium of the superconductor (2); the first detector (7) is coupled to a first end (2-a) of the superconductor; a second detector (9) for detecting signals resulting from the refraction of the pulse train T(x) in the superconductive medium; the second detector (9) is coupled to a second end (2-b) of the superconductor (2); a processing unit (12) configured to detect the formation of a resistive transition zone in the superconductor (2) when: the first sensor (7) detects signals S&lt;sub&gt;R&lt;/sub&gt;(x) resulting from the reflection of the pulse train T(x) in the superconductive medium; and/or the second sensor (9) detects signals S&lt;sub&gt;F&lt;/sub&gt;(x) resulting from the refraction of the pulse train T(x) in the superconductive medium.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:裝置</p>
        <p type="p">2:超導體</p>
        <p type="p">2-a:第一端，末端</p>
        <p type="p">2-b:第二對立端，第二端，末端</p>
        <p type="p">3:冷卻系統</p>
        <p type="p">5:發射器裝置，裝置</p>
        <p type="p">7:第一檢測器</p>
        <p type="p">9:第二檢測器，檢測器</p>
        <p type="p">12:處理單元，電子單元，電子處理單元</p>
        <p type="p">R:電阻</p>
        <p type="p">S&lt;sub&gt;F&lt;/sub&gt;(x):信號，經折射信號</p>
        <p type="p">S&lt;sub&gt;R&lt;/sub&gt;(x):信號，經反射脈衝</p>
        <p type="p">T2:區</p>
        <p type="p">T(X):脈衝列</p>
        <p type="p">△V:電位降</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="459px" img-content="tif" inline="yes" orientation="portrait" width="705px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622203</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128911</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09J163/00</main-classification>
        <further-classification edition="200601120260302B">C09J133/00</further-classification>
        <further-classification edition="200601120260302B">C09J161/06</further-classification>
        <further-classification edition="200601120260302B">C09J11/08</further-classification>
        <further-classification edition="200601120260302B">C09J11/04</further-classification>
        <further-classification edition="201801120260302B">C09J7/30</further-classification>
        <further-classification edition="201801120260302B">C09J7/10</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>入江瞳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIE, HITOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中浦宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAURA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-133885</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>接著片材</chinese-title>
        <english-title>ADHESIVE SHEET</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之接著片材具備包含接著劑組合物之接著劑層，該接著片材於室溫下之斷裂伸長率為50%以上且400%以下，於室溫下之斷裂強度為7 MPa以上且100 MPa以下，且晶片剪切強度為17 MPa以上且50 MPa以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adhesive sheet according to the present invention includes an adhesive layer including an adhesive composition, and has a breaking elongation at room temperature of 50 % or more and 400 % or less, a breaking strength at room temperature of 7 MPa or more and 100 MPa or less, and a die shear strength of 17 MPa or more and 50 MPa or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:接著片材</p>
        <p type="p">2a:半導體晶圓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="521px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623359</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128912</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260226B">H10B41/10</main-classification>
        <further-classification edition="202301120260226B">H10B41/35</further-classification>
        <further-classification edition="202301120260226B">H10B41/50</further-classification>
        <further-classification edition="202301120260226B">H10B43/10</further-classification>
        <further-classification edition="202301120260226B">H10B43/35</further-classification>
        <further-classification edition="202301120260226B">H10B43/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商美光科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICRON TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康堤　安娜　瑪莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONTI, ANNA MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬佐内　吉歐法尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAZZONE, GIOVANNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰莎瑞爾　帕洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESSARIOL, PAOLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古普塔　席德哈沙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUPTA, SIDHARTHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,332</doc-number>
          <date>20240730</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/255,941</doc-number>
          <date>20250630</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有延伸至具有部分導電層級之分層堆疊之字線觸點的微電子裝置及相關方法</chinese-title>
        <english-title>MICROELECTRONIC DEVICES WITH WORD LINE CONTACTS EXTENDING INTO A TIERED STACK HAVING PARTIALLY CONDUCTIVE LEVELS, AND RELATED METHODS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案係關於具有延伸至具有部分導電層級之一分層堆疊之字線觸點的微電子裝置及相關方法。一種微電子裝置包含分成區塊且具有階層之一垂直重複序列之一堆疊。該等階層包含(若干)絕緣層級及(若干)其他層級。該等其他層級係部分導電及部分非導電的。在該堆疊之一第一區域中，一支柱陣列實質上垂直延伸穿過該堆疊之一高度，且該等階層包含該(等)絕緣層級及該(等)其他層級中之(若干)導電部分。在該堆疊之一第二區域中，導電觸點延伸至各種深度，且該等階層包含該(等)絕緣層級及該(等)其他層級中之導電及非導電部分兩者。在形成一微電子裝置之方法中，形成包含絕緣結構及部分犧牲結構之一前體堆疊。在其中導電觸點形成至該堆疊之各種層級之一區域中，移除該等部分犧牲結構之部分且用導電結構替換以留下該等部分犧牲結構之剩餘部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application relates to microelectronic devices with word line contacts extending into a tiered stack having partially conductive levels, and related methods. A microelectronic device includes a stack divided into blocks and having a vertically repeated sequence of tiers. The tiers include insulative level(s) and other level(s). The other levels are partially conductive and partially non-conductive. In a first area of the stack, an array of pillars extends substantially vertically through a height of the stack, and the tiers include the insulative level(s) and conductive portion(s) in the other level(s). In a second area of the stack, conductive contacts extend to various depths, and the tiers include the insulative level(s) and both conductive and non-conductive portion(s) in the other level(s). In methods of forming a microelectronic device, a precursor stack is formed including insulative structures and partially-sacrificial structures. In an area in which conductive contacts are formed to various levels of the stack, portions of the partially-sacrificial structures are removed and replaced with conductive structures, leaving remnants of the partially-sacrificial structures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:前體堆疊</p>
        <p type="p">104:階層</p>
        <p type="p">106:絕緣結構</p>
        <p type="p">108:部分犧牲結構</p>
        <p type="p">110:字線(WL)觸點區域</p>
        <p type="p">112:陣列區域</p>
        <p type="p">202:支撐件</p>
        <p type="p">208:WL觸點開口</p>
        <p type="p">210:支柱</p>
        <p type="p">402:襯層結構</p>
        <p type="p">502:擴大基底</p>
        <p type="p">704:區塊</p>
        <p type="p">706:區塊間開口</p>
        <p type="p">802:距離</p>
        <p type="p">1004:區域</p>
        <p type="p">1102:堆疊</p>
        <p type="p">1104:導電材料</p>
        <p type="p">1106:導電結構</p>
        <p type="p">1108:階層</p>
        <p type="p">1202:額外導電材料</p>
        <p type="p">1204:WL觸點</p>
        <p type="p">1206:區塊間結構</p>
        <p type="p">1208:導電軌</p>
        <p type="p">1302:整合著陸區域</p>
        <p type="p">1700:微電子裝置結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10058.JPG" file="ed10058.JPG" height="502px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621673</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128932</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/49</main-classification>
        <further-classification edition="200601120260302B">A61Q3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商麗魁公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIQWD, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍克　克雷格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAWKER, CRAIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝茨　克里斯多福　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BATES, CHRISTOPHER M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　阿拉尼斯　賈維爾　里德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE ALANIZ, JAVIER READ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝茨　摩根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BATES, MORGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾巴尼斯　凱特琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALBANESE, KAITLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,372</doc-number>
          <date>20240730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括含硫劑之指甲組合物及其用途</chinese-title>
        <english-title>NAIL COMPOSITIONS INCLUDING SULFUR-CONTAINING AGENTS AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述包括能夠反應且形成指甲塗層之含硫活性劑之指甲組合物以及使用該等指甲組合物之方法。該等指甲組合物可例如呈指甲強化劑、指甲底油、指甲亮光油、指甲塗漆、凝膠指甲或浸甲劑之形式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Nail compositions including sulfur-containing active agents which are capable of reacting and forming a nail coating, as well as methods of using the nail compositions are described herein. The nail compositions can be, for instance, in the form of nail strengtheners, nail primers, nail polishes, nail lacquers, gel nails, or dip nails.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="367px" img-content="tif" inline="yes" orientation="portrait" width="371px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622272</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128942</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C23C16/16</main-classification>
        <further-classification edition="200601120260224B">C23C16/18</further-classification>
        <further-classification edition="200601120260224B">C23C14/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔚山科學技術院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商田中貴金屬工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA PRECIOUS METAL TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金秀賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SOO-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫藝瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, YESEUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小次洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTSUGI, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田了輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>津川智広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUGAWA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-127602</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鉑－釕合金薄膜之形成方法</chinese-title>
        <english-title>METHOD FOR FORMING PLATINUM-RUTHENIUM ALLOY THIN FILM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於藉由原子層調變(ALM)形成貴金屬二元系合金薄膜之方法。依據本發明之鉑-釕合金薄膜，提供使用作為鉑前驅物之二甲基(N,N-二甲基-3-丁烷-1-胺-N)鉑(DDAP：C&lt;sub&gt;8&lt;/sub&gt;H&lt;sub&gt;19&lt;/sub&gt;NPt)與作為釕前驅物之三羰基(三亞甲基甲烷)釕([Ru(TMM)(CO)&lt;sub&gt;3&lt;/sub&gt;])，以及使用作為反應氣體之氧，藉此提供將2個元素完全混合之合金薄膜。依據本發明，可進行原子單位水準之精密組成控制之鉑-釕合金薄膜之成膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To be provided is a method for forming a platinum-ruthenium alloy thin film that allows precise composition control of multi-component alloys at the atomic unit level. More specifically, this is a method for forming a precious metal binary alloy thin film by atomic layer modulation (ALM), and the platinum-ruthenium alloy thin film is provided by using dimethyl(N,N-dimethyl-3-butane-1-amine-N)platinum (DDAP:C8H19NPt) as a platinum precursor, tricarbonyl(trimethylenemethane)ruthenium ([Ru(TMM)(CO)3]) as a ruthenium precursor, and oxygen as a reactant gas to provide an alloy thin film in which two elements are completely mixed.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="321px" img-content="tif" inline="yes" orientation="portrait" width="575px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621734</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114128990</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/395</main-classification>
        <further-classification edition="200601120260302B">C07K16/28</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾克塞里克斯公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EXELIXIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坎特克　希瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANTAK, SEEMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈　美貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIM, BEE-CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史東　傑佛瑞　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STONE, GEOFFREY WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,890</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>結合至ＮＫＧ２Ａ及ＰＤ－Ｌ１之劑之使用方法</chinese-title>
        <english-title>METHODS OF USE OF AGENTS THAT BIND TO NKG2A AND PD-L1</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案提供與化合物I組合用結合至NKG2A及PD-L1之多特異性結合劑(例如多特異性抗體，例如雙特異性抗體)治療疾病或病症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods of treating diseases or disorders with multispecific binding agents that bind to NKG2A and PD-L1 (&lt;i&gt;e.g.&lt;/i&gt;, multispecific antibodies such as bispecific antibodies) in combination with Compound I.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10181.JPG" file="ed10181.JPG" height="925px" img-content="tif" inline="yes" orientation="portrait" width="771px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623025</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129003</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01J27/02</main-classification>
        <further-classification edition="200601120260224B">H01J27/26</further-classification>
        <further-classification edition="200601120260224B">H01J29/48</further-classification>
        <further-classification edition="200601120260224B">H01J35/00</further-classification>
        <further-classification edition="200601120260224B">H01J37/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商諾威量測設備公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVA MEASURING INSTRUMENTS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加希亞　魯迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARCIA, RUDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴加多　吉爾達多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELGADO, GILDARDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里德　大衛Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REED, DAVID A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒伊勒　布魯諾Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHUELER, BRUNO W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托斯　加博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOTH, GABOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍登　羅尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORDON, LONNIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,043</doc-number>
          <date>20240730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>維持分析真空室和電子槍真空室中的真空</chinese-title>
        <english-title>MAINTAINING VACUUM IN AN ANALYSIS VACUUM CHAMBER AND AN ELECTRON GUN VACUUM CHAMBER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子束元件，包括：電子槍真空室；分析真空室；電子槍閥，配置為隔離電子槍室；分析真空室閥，配置為隔離分析真空室；以及控制系統，配置為控制電子槍閥和分析真空室閥，其中，當電子槍閥和分析真空室閥都處於關閉位置時，電子槍室能與分析真空室分隔開，同時維持電子槍真空室和分析真空室中的真空狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electron beam assembly, including an electron gun vacuum chamber; an analysis vacuum chamber; an electron gun valve configured to isolate the electron gun chamber; an analysis vacuum chamber valve configured to isolate the analysis vacuum chamber; and a control system configured to control the electron gun valve and the analysis vacuum chamber valve, wherein when both the electron gun valve and the analysis vacuum chamber valve are in a closed position, the electron gun chamber is separable from the analysis vacuum chamber while maintaining vacuum conditions in the electron gun vacuum chamber and in the other analysis vacuum chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">31:高電壓連接插座</p>
        <p type="p">32:電子源對準機構</p>
        <p type="p">33:聚光透鏡</p>
        <p type="p">34:柱間隔件</p>
        <p type="p">35:物鏡</p>
        <p type="p">36:安裝板</p>
        <p type="p">39:對接結構</p>
        <p type="p">40:分析真空室閥致動器/致動器</p>
        <p type="p">50:電子槍閥致動器</p>
        <p type="p">99:控制系統</p>
        <p type="p">100:電子束組件/XPF/XRS系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="897px" img-content="tif" inline="yes" orientation="portrait" width="727px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621735</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129007</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/395</main-classification>
        <further-classification edition="200601120260302B">C07K16/24</further-classification>
        <further-classification edition="200601120260302B">C07K16/28</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　奇亨特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, CHIHUNT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫柏　詹姆士　尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COOPER, JAMES NIALL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>娜卡慕拉　凜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, RIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩米尼　狄維亞　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMINENI, DIVYA ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>住吉亭子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMIYOSHI, TEIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇西洛　摩妮卡　埃塞琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUSILO, MONICA ETELINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
              <english-address>ID</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,374</doc-number>
          <date>20240730</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/727,146</doc-number>
          <date>20241202</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用抗ＦＣＲＨ５／抗ＣＤ３雙特異性抗體進行治療之方法</chinese-title>
        <english-title>METHODS OF TREATMENT WITH ANTI-FCRH5/ANTI-CD3 BISPECIFIC ANTIBODIES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供用於用抗片段可結晶受體樣 5 (FcRH5)/抗分化簇 3 (CD3) 雙特異性抗體 (例如，頭孢他單抗) 治療癌症諸如多發性骨髓瘤之給藥的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides methods of dosing for the treatment of cancers, such as multiple myelomas, with anti-fragment crystallizable receptor-like 5 (FcRH5)/anti-cluster of differentiation 3 (CD3) bispecific antibodies (e.g., cevostamab).</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10077.JPG" file="ed10077.JPG" height="393px" img-content="tif" inline="yes" orientation="portrait" width="683px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623117</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129015</doc-number>
          <kind></kind>
          <date>114/07/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250902B">H01R13/631</main-classification>
        <further-classification edition="201101120250902B">H01R12/57</further-classification>
        <further-classification edition="201101120250902B">H01R12/65</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾威勒電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀永良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHI, YUNG-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,553</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>浮動連接器</chinese-title>
        <english-title>FLOATING CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種浮動連接器包括基座、殼體及浮動插頭。殼體連接基座並在殼體內與基座形成限位空間。浮動插頭電性連接基座和殼體，其中浮動插頭具有容置於殼體內的本體，及延伸通過殼體的對接部，其中對接部配置以受力而帶動本體有限地移動於限位空間內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A floating connector includes a base, a housing and a floating plug. The housing is connected to the base and defines a retaining room with the base. The floating plug is electrically connected to the base and the housing. The floating plug has a main body located within the housing and a mating portion that extends through the housing. The mating portion is configured to receive a force so as to drive the main body portion to move limitedly within the retaining room.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:浮動連接器</p>
        <p type="p">110:基座</p>
        <p type="p">111:連接部</p>
        <p type="p">130:殼體</p>
        <p type="p">150:浮動插頭</p>
        <p type="p">153:對接部</p>
        <p type="p">C:剖面線</p>
        <p type="p">X:第一軸向</p>
        <p type="p">Y:第二軸向</p>
        <p type="p">Z:第三軸向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="706px" img-content="tif" inline="yes" orientation="portrait" width="746px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623509</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129036</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="201401120260302B">B23K26/70</further-classification>
        <further-classification edition="201401120260302B">B23K26/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大川瑞生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAWA, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134327</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理系統及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明，能夠從以第一基板與第二基板接合成之重合基板分離出第一基板，並適當進行對於該分離出的第一基板之處理。  &lt;br/&gt;本發明係對以第一基板與第二基板接合成之重合基板進行處理之基板處理系統，該基板處理系統，具有：雷射照射裝置，包含用於朝向該重合基板照射雷射光的雷射頭與透鏡；分離裝置，將該第一基板從該重合基板分離出；以及檢測裝置，檢測藉由該分離裝置所分離出的該第一基板上產生的裂痕，並計算該裂痕的深度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">St1~St15:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="753px" img-content="tif" inline="yes" orientation="portrait" width="994px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623052</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129042</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="202601120260302B">H10P72/72</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川真矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>須川直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊地孝明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, TAKAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木真也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小花純一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OBANA, JUNICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤村恭輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWAMURA, KYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134055</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;本發明旨在提供一種電漿處理裝置，可檢測電介質部分的破損。  &lt;br/&gt;[解決手段]  &lt;br/&gt;一種電漿處理裝置，其包括：電漿處理腔室；基座，其配置於前述電漿處理腔室內，於其頂面載置靜電吸盤；電介質部分，其以包圍前述靜電吸盤的方式配置於前述基座之頂面，且內部形成有傳熱流體流路；破損檢測機構，其檢測前述電介質部分之破損；以及傳熱流體控制部，其與前述破損檢測機構連接，並控制對前述傳熱流體流路供給傳熱流體之傳熱流體供給部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">111a:中央區域</p>
        <p type="p">111b:環狀區域</p>
        <p type="p">112A:邊緣環</p>
        <p type="p">1110:基座</p>
        <p type="p">1110a:流路</p>
        <p type="p">1110b:中央區域</p>
        <p type="p">1110c:環狀區域</p>
        <p type="p">1111:靜電吸盤</p>
        <p type="p">1111a:陶瓷構件</p>
        <p type="p">1111b:靜電電極</p>
        <p type="p">1112-1:環固持構件</p>
        <p type="p">1112a:陶瓷構件</p>
        <p type="p">1112b:靜電電極</p>
        <p type="p">1112c:內部空間</p>
        <p type="p">1112d:加熱器</p>
        <p type="p">1113:聚合物薄膜</p>
        <p type="p">1114:傳熱性接著劑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="612px" img-content="tif" inline="yes" orientation="portrait" width="713px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623519</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129044</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/60</main-classification>
        <further-classification edition="202601120260302B">H10P14/692</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈因　阿克夏特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAIN, AKSHAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維尼拉西加瑪尼　桑克吉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENNILA SIGAMANI, SANKGEETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕迪特　瑪達爾Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDIT, MANDAR B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加　普拉凱特佩拉卡希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHA, PRAKET PRAKASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　璟梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JINGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳育偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YU-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/790,057</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於控制含氧材料之厚度的處理</chinese-title>
        <english-title>TREATMENTS TO CONTROL THICKNESS OF OXYGEN-CONTAINING MATERIALS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">示範性處理方法可包括向半導體處理腔室的處理區域提供一或多種沉積前驅物。包含含矽材料的複數個層的基板可容納於該處理區域內。該含矽材料的相鄰層可垂直間隔開，以限定複數個側向間隙。一或多個特徵可延伸穿過該含矽材料的該複數個層並進入基板。該等方法可包括在複數個側向間隙中並且在延伸進入基板的一或多個特徵中，在基板上沉積可流動的含氧材料。該等方法可包括向半導體處理腔室的處理區域提供含氫前驅物。該等方法可包括在施加偏壓能量的同時，使基板與含氫前驅物接觸。該接觸可減小可流動的含氧材料的厚度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary processing methods may include providing one or more deposition precursors to a processing region of a semiconductor processing chamber. A substrate including a plurality of layers of a silicon-containing material may be housed within the processing region. Adjacent layers of the silicon-containing material may be vertically spaced apart to define a plurality of lateral gaps. One or more features may extend through the plurality of layers of the silicon-containing material and into the substrate. The methods may include depositing a flowable oxygen-containing material on the substrate in the plurality of lateral gaps and in the one or more features extending into the substrate. The methods may include providing a hydrogen-containing precursor to the processing region of the semiconductor processing chamber. The methods may include contacting the substrate with the hydrogen-containing precursor while applying a bias power. The contacting may reduce a thickness of the flowable oxygen-containing material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">205:操作</p>
        <p type="p">210:操作</p>
        <p type="p">215:操作</p>
        <p type="p">220:操作</p>
        <p type="p">225:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="766px" img-content="tif" inline="yes" orientation="portrait" width="615px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623586</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129045</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/70</main-classification>
        <further-classification edition="202601120260302B">H10P72/78</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池本大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEMOTO, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島秀行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, HIDEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曉谷純平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GYOYA, JUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-135086</doc-number>
          <date>20240813</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置及基板載置方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種可以提升基板之接合精度的技術。  &lt;br/&gt;　　[解決手段]基板處理裝置具備保持部，且該保持部在吸附基板的吸附面具有圓狀之中央區域，和被配置在較上述中央區域更外側的圓環狀之外側區域。上述吸附面在將上述外側區域在圓周方向分割後的區域及上述中央區域中設定複數區塊。基板處理裝置具備在上述複數區塊的各個中產生壓力的壓力產生部。上述壓力產生部在將上述基板載置於上述吸附面之狀態，且在上述複數區塊中之至少一個施加負壓的狀態下，對未施加上述負壓的上述複數區塊中之至少一個施加正壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">231:下夾盤</p>
        <p type="p">300:吸附面</p>
        <p type="p">ch1~ch10:區塊</p>
        <p type="p">P2x,P2y:各基準點</p>
        <p type="p">W2:第2基板</p>
        <p type="p">W2j:接合面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.JPG" file="ed10028.JPG" height="1026px" img-content="tif" inline="yes" orientation="portrait" width="723px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622643</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129056</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">G03F7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>娜卡　普里亞　沙克蒂坎特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAIK, PRIYA SHASHIKANT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾德曼　奧斯卡　法蘭西斯　喬瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOORDMAN, OSCAR FRANCISCUS JOZEPHUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PO-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥格羅根　尚恩　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGROGAN, SEAN W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪　奧利維拉　莫里西歐　卡瓦略</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE OLIVEIRA, MAURICIO CARVALHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉格沃夫　馬里納斯　詹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAGERWERF, MARINUS JAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　金德瑞　羅尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DER KINDEREN, RONNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德希穆克　奇坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESHMUKH, CHETAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,605</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>曝光程序及設備</chinese-title>
        <english-title>EXPOSURE PROCESS AND APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種判定由一微影設備曝光之一基板之一修復劑量的方法，該方法包括：判定一曝光之一劑量輪廓，該劑量輪廓包括一移動照明狹縫內在複數個離散時間點量測到之在一時段內遞送至該基板之輻射能量的一累加量；判定該時段之一目標劑量；及同時基於各離散時間點之所遞送劑量與該目標劑量之間的一差而判定一修復劑量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of determining a reparation dose for a substrate exposed by a lithographic apparatus, the method including: determining a dose profile of an exposure, the dose profile including an accumulated amount of radiation energy within a moving illumination slit delivered to the substrate in a time period measured at a plurality of discrete time points; determining a target dose for the time period; and determining a reparation dose based on a difference between the delivered dose and the target dose for each discrete time point simultaneously.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210a:劑量誤差遮罩</p>
        <p type="p">210b:劑量誤差遮罩</p>
        <p type="p">220:最大劑量誤差遮罩臨限值</p>
        <p type="p">230:最小劑量誤差遮罩臨限值</p>
        <p type="p">240:所遞送劑量</p>
        <p type="p">250:劑量輪廓</p>
        <p type="p">260:目標劑量</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="335px" img-content="tif" inline="yes" orientation="portrait" width="557px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623434</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129059</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202501120260302B">H10D84/85</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202501120260302B">H10D64/01</further-classification>
        <further-classification edition="202501120260302B">H10D30/67</further-classification>
        <further-classification edition="202501120260302B">H10D30/43</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞寶　沙耶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REBOH, SHAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>可汗　沙魯克罕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAN, SHAHRUKH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藤崇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史傳恩　杰　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRANE, JAY WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/791,720</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有雙功函數金屬閘極之單晶片堆疊互補式電晶體結構</chinese-title>
        <english-title>MONOLITHIC STACKED COMPLEMENTARY TRANSISTOR STRUCTURES WITH DUAL WORK FUNCTION METAL GATES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種裝置，其包含一堆疊電晶體結構及一共用閘極結構。該堆疊電晶體結構包含一第一類型之一第一電晶體及與該第一類型相反之一第二類型的且安置於該第一電晶體上方的一第二電晶體。該共用閘極結構包含該第一電晶體之一第一金屬閘極結構、該第二電晶體之一第二金屬閘極結構及一金屬連接層。該第二金屬閘極結構嵌入於該第一金屬閘極結構中，其中一介電層安置於該第一金屬閘極結構與該第二金屬閘極結構之間。該金屬連接層電連接該第一金屬閘極結構及該第二金屬閘極結構之上部區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device comprises a stacked transistor structure and a shared gate structure. The stacked transistor structure comprises a first transistor of a first type, and a second transistor of a second type which is opposite the first type, and which is disposed over the first transistor. The shared gate structure comprises a first metal gate structure of the first transistor, a second metal gate structure of the second transistor, and a metallic connection layer. The second metal gate structure is embedded in the first metal gate structure with a dielectric layer disposed between the first metal gate structure and the second metal gate structure. The metallic connection layer electrically connects upper regions of the first metal gate structure and the second metal gate structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體積體電路裝置/裝置</p>
        <p type="p">102:基板</p>
        <p type="p">104:淺溝槽隔離層</p>
        <p type="p">106:介電層/預金屬化介電層</p>
        <p type="p">108:堆疊互補式電晶體結構</p>
        <p type="p">110:第一電晶體</p>
        <p type="p">111:通道層</p>
        <p type="p">112:通道層</p>
        <p type="p">118-1:第一源極/汲極元件</p>
        <p type="p">118-2:第二源極/汲極元件</p>
        <p type="p">120:第二電晶體</p>
        <p type="p">121:通道層</p>
        <p type="p">122:通道層</p>
        <p type="p">123:通道層</p>
        <p type="p">125:介電隔離層/中間介電隔離層</p>
        <p type="p">128-1:第一源極/汲極元件</p>
        <p type="p">128-2:第二源極/汲極元件</p>
        <p type="p">130:閘極側壁間隔件</p>
        <p type="p">132:閘極側壁間隔件</p>
        <p type="p">140:金屬閘極</p>
        <p type="p">141:高k閘極介電層</p>
        <p type="p">141A:殘餘介電層</p>
        <p type="p">142:第一金屬閘極電極</p>
        <p type="p">143:高k閘極介電層</p>
        <p type="p">143A:殘餘介電層</p>
        <p type="p">144:第二金屬閘極電極</p>
        <p type="p">146:金屬搭接片</p>
        <p type="p">L:長度</p>
        <p type="p">L&lt;sub&gt;G&lt;/sub&gt;:閘極長度</p>
        <p type="p">L&lt;sub&gt;S&lt;/sub&gt;:初始堆疊長度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10039.JPG" file="ed10039.JPG" height="975px" img-content="tif" inline="yes" orientation="portrait" width="735px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623435</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129060</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10D84/01</main-classification>
        <further-classification edition="202501120260302B">H10D84/85</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202501120260302B">H10D64/01</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D30/67</further-classification>
        <further-classification edition="202501120260302B">H10D30/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安藤崇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞寶　沙耶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REBOH, SHAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>可汗　沙魯克罕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAN, SHAHRUKH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史傳恩　杰　威廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRANE, JAY WILLIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/791,644</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有雙功函數金屬閘極之單晶片堆疊互補式電晶體結構</chinese-title>
        <english-title>MONOLITHIC STACKED COMPLEMENTARY TRANSISTOR STRUCTURES WITH DUAL WORK FUNCTION METAL GATES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種裝置，其包含一堆疊電晶體結構及一共用閘極結構。該堆疊電晶體結構包含一第一類型之一第一電晶體及與該第一類型相反之一第二類型的且安置於該第一電晶體上方的一第二電晶體。該共用閘極結構包含該第一電晶體之一第一金屬閘極結構及該第二電晶體之一第二金屬閘極結構。該第二金屬閘極結構嵌入於該第一金屬閘極結構中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device comprises a stacked transistor structure, and a shared gate structure. The stacked transistor structure comprises a first transistor of a first type, and a second transistor of a second type which is opposite the first type, and disposed over the first transistor. The shared gate structure comprises a first metal gate structure of the first transistor, and a second metal gate structure of the second transistor. The second metal gate structure is embedded in the first metal gate structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體積體電路裝置/裝置</p>
        <p type="p">102:基板</p>
        <p type="p">104:淺溝槽隔離層</p>
        <p type="p">106:介電層/預金屬化介電層</p>
        <p type="p">108:堆疊互補式電晶體結構</p>
        <p type="p">110:第一電晶體</p>
        <p type="p">111:通道層</p>
        <p type="p">112:通道層</p>
        <p type="p">118-1:第一源極/汲極元件</p>
        <p type="p">118-2:第二源極/汲極元件</p>
        <p type="p">120:第二電晶體</p>
        <p type="p">121:通道層</p>
        <p type="p">122:通道層</p>
        <p type="p">123:通道層</p>
        <p type="p">125:介電隔離層/中間介電隔離層</p>
        <p type="p">128-1:第一源極/汲極元件</p>
        <p type="p">128-2:第二源極/汲極元件</p>
        <p type="p">130:閘極側壁間隔件</p>
        <p type="p">132:閘極側壁間隔件</p>
        <p type="p">140:金屬閘極</p>
        <p type="p">142:高k介電層</p>
        <p type="p">144:第一功函數金屬層</p>
        <p type="p">146:第二功函數金屬層</p>
        <p type="p">148-2:第二金屬閘極電極</p>
        <p type="p">L:長度</p>
        <p type="p">L&lt;sub&gt;G&lt;/sub&gt;:閘極長度</p>
        <p type="p">L&lt;sub&gt;S&lt;/sub&gt;:初始堆疊長度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.JPG" file="ed10028.JPG" height="962px" img-content="tif" inline="yes" orientation="portrait" width="772px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621736</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129080</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/395</main-classification>
        <further-classification edition="200601120260302B">C07K16/28</further-classification>
        <further-classification edition="200601120260302B">C07K16/30</further-classification>
        <further-classification edition="200601120260302B">C07K16/46</further-classification>
        <further-classification edition="200601120260302B">A61K9/19</further-classification>
        <further-classification edition="200601120260302B">A61K9/08</further-classification>
        <further-classification edition="200601120260302B">A61K47/26</further-classification>
        <further-classification edition="200601120260302B">A61K47/10</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海齊魯製藥研究中心有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI QILU PHARMACEUTICAL RESEARCH AND DEVELOPMENT CENTRE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安多朋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, DUOPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方言</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>温云平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, YUNPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪泓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110530525</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>結合人GPRC5D/BCMA/CD3的三特異性抗體製劑及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開關於一種結合人GPRC5D/BCMA/CD3的三特異性抗體的藥物製劑及其用途。所述藥物製劑含有結合人GPRC5D/BCMA/CD3的三特異性抗體，還包含穩定劑、緩衝劑和/或表面活性劑。本公開的GPRC5D/BCMA/CD3三特異性抗體藥物製劑穩定性好，經長時間保存、強光、高溫後仍能夠符合藥學使用要求，有著廣泛的應用前景。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="350px" img-content="tif" inline="yes" orientation="portrait" width="504px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623610</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129083</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/20</main-classification>
        <further-classification edition="200601120260302B">G01R1/073</further-classification>
        <further-classification edition="200601120260302B">G01R1/067</further-classification>
        <further-classification edition="202001120260302B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西顯太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邊晃太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134377</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>檢查裝置及檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠降低檢查成本且能夠良好地檢查半導體元件的技術。  &lt;br/&gt;  檢查裝置係檢查半導體元件的電性特性。檢查裝置係具備：接觸構件，係在一面具有會接觸半導體元件之電極墊的多個第1接觸部，且在另一面具有分別導通於多個第1接觸部的多個第2接觸部；以及測試器，係在接觸構件的另一面接觸多個第2接觸部，可透過接觸構件對半導體元件供給電力。接觸構件係能夠使2個以上的第1接觸部接觸電極墊。測試器係藉由對接觸電極墊後之2個以上的第1接觸部之間施加電壓以產生微動現象，來使電極墊與第1接觸部導通。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:測試器</p>
        <p type="p">21:介面基板</p>
        <p type="p">211:板體</p>
        <p type="p">212,212a,212b:下側端子</p>
        <p type="p">213,213a,213b:上側端子</p>
        <p type="p">214:配線</p>
        <p type="p">22:接觸構件</p>
        <p type="p">221:片本體</p>
        <p type="p">222,222a,222b:第1接觸部</p>
        <p type="p">223,223a,223b:第2接觸部</p>
        <p type="p">224:導電線</p>
        <p type="p">225:分割片</p>
        <p type="p">30:台座</p>
        <p type="p">30s:載置面</p>
        <p type="p">31:載置台</p>
        <p type="p">DP:電極墊</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="978px" img-content="tif" inline="yes" orientation="portrait" width="667px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622717</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129086</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G06F3/041</main-classification>
        <further-classification edition="200601120260226B">G06F3/044</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瑟克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIRQUE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹尼爾　弗格森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DANIEL, FERGUSON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/809,924</doc-number>
          <date>20240820</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/946,357</doc-number>
          <date>20241113</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電容輸入的雜訊干擾</chinese-title>
        <english-title>NOISE INTERFERENCE OF A CAPACITANCE INPUT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種電容模組，其可以包括：一組電極；控制器，與該組電極通訊；以及記憶體，與控制器通訊。記憶體可以包括程式設計指令，程式設計指令在被執行時使控制器：接收使用者輸入；發送命令以引起對使用者輸入的雜訊干擾；在將雜訊干擾施加到使用者輸入期間進行電容測量；存儲與電容測量值相關聯的受雜訊影響的屬性；並且通過將非提示使用者輸入與存儲的受雜訊影響的屬性進行比較來對非提示使用者輸入進行分類。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">102:鍵盤</p>
        <p type="p">103:殼體</p>
        <p type="p">104:觸控板</p>
        <p type="p">106:顯示器</p>
        <p type="p">108:按鍵</p>
        <p type="p">114:連接機構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10037.JPG" file="ed10037.JPG" height="746px" img-content="tif" inline="yes" orientation="portrait" width="721px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623312</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129099</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H05H1/46</main-classification>
        <further-classification edition="200601120260224B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-133201</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置及電源系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提高電漿處理裝置中之電漿處理性能之技術。電漿處理裝置具備：腔室；基板支持部，其配置於腔室內，具有下部電極；電壓脈衝信號產生器，其電性連接於下部電極，構成為產生電壓脈衝信號，電壓脈衝信號於重複週期之第1期間內具有電壓脈衝之序列；及RF信號產生器，其構成為產生RF信號以於腔室內產生電漿，RF信號於第1期間內具有從第1功率位準逐漸減小至第2功率位準之梯度功率模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">C(1):重複週期</p>
        <p type="p">C(2):重複週期</p>
        <p type="p">DP1:電壓脈衝</p>
        <p type="p">P1:第1功率位準</p>
        <p type="p">P2:第2功率位準</p>
        <p type="p">P3:第3功率位準</p>
        <p type="p">S1:梯度功率模式</p>
        <p type="p">SC1:電壓脈衝之序列</p>
        <p type="p">T1:第1期間</p>
        <p type="p">T2:第2期間</p>
        <p type="p">v&lt;sub&gt;ref1&lt;/sub&gt;:基準電壓位準</p>
        <p type="p">V1:第1電壓位準</p>
        <p type="p">V2:第2電壓位準</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="638px" img-content="tif" inline="yes" orientation="portrait" width="893px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623587</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129100</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/70</main-classification>
        <further-classification edition="200601120260302B">H05B3/00</further-classification>
        <further-classification edition="200601120260302B">H05B3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查達　阿文德曼莫漢辛格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHADHA, ARVINDER MANMOHAN SINGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿珊　薩義德納茲穆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHSAN, SYED NAZMUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BD</english-country>
              <english-address>BD</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/791,043</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板支撐件的熱管理</chinese-title>
        <english-title>THERMAL MANAGEMENT IN SUBSTRATE SUPPORTS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種系統，包括陶瓷基座和嵌入在陶瓷基座中的電阻性加熱線。該電阻性加熱線包括複數個延長的平行線段，其中每個線段延伸穿過陶瓷基座的主表面。該電阻性加熱線進一步包括連接到複數個延長平行線段中的第一延長平行線段的第一端子，並且該端子與陶瓷基座的中心保持第一徑向距離。該電阻性加熱線進一步包括連接到複數個延長平行線段中的第二延長平行線段的第二端子，並且該端子與陶瓷基座的中心保持第二徑向距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system, including a ceramic base and a resistive heating trace embedded in the ceramic base. The resistive heating trace includes a plurality of elongated parallel trace segments, where each trace segment extends across a major surface of the ceramic base. The resistive heating trace further includes a first terminal coupled to a first elongated parallel trace segment of the plurality of elongated parallel trace segments and disposed a first radial distance from a center of the ceramic base. The resistive heating trace further includes a second terminal coupled to a second elongated parallel trace segment of the plurality of elongated parallel trace segments and disposed a second radial distance from the center of the ceramic base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200B:系統</p>
        <p type="p">211B:第一端子</p>
        <p type="p">212B:第二端子</p>
        <p type="p">221B:橋接線段</p>
        <p type="p">222B:橋接線段</p>
        <p type="p">230B:陶瓷基座</p>
        <p type="p">240B:電阻性加熱線</p>
        <p type="p">241B:延長平行線段</p>
        <p type="p">242B:延長平行線段</p>
        <p type="p">243B:延長平行線段</p>
        <p type="p">251B:第一徑向距離</p>
        <p type="p">252B:第二徑向距離</p>
        <p type="p">260B:中心</p>
        <p type="p">280B:匯流排</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="740px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623053</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129101</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01J37/32</main-classification>
        <further-classification edition="200601120260225B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今野洋生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONNO, HIROO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-133249</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置及電源系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提高電漿處理裝置中之電漿處理性能之技術。電漿處理裝置具備：腔室；基板支持部，其配置於腔室內，具有下部電極；上部電極，其配置於基板支持部之上方；下部電壓信號產生器，其電性連接於下部電極且構成為產生下部電壓信號，下部電壓信號於重複週期之第1期間內具有電壓脈衝之序列；RF信號產生器，其構成為產生RF信號以於腔室內產生電漿；及上部電壓信號產生器，其電性連接於上部電極且構成為產生上部電壓信號，上部電壓信號於第1期間內具有從第1電壓位準逐漸變化至第2電壓位準之梯度電壓模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">C(1):重複週期</p>
        <p type="p">C(2):重複週期</p>
        <p type="p">DP1:電壓脈衝</p>
        <p type="p">P1:第1功率位準</p>
        <p type="p">P2:第2功率位準</p>
        <p type="p">S1:梯度電壓模式</p>
        <p type="p">SC1:電壓脈衝之序列</p>
        <p type="p">T1:第1期間</p>
        <p type="p">T2:第2期間</p>
        <p type="p">V1:第1電壓位準</p>
        <p type="p">V2:第2電壓位準</p>
        <p type="p">V3:第電壓位準</p>
        <p type="p">V4:第4電壓位準</p>
        <p type="p">v&lt;sub&gt;ref1&lt;/sub&gt;:基準電壓位準</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="643px" img-content="tif" inline="yes" orientation="portrait" width="968px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621684</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129103</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/4545</main-classification>
        <further-classification edition="200601120260302B">A61P11/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商基奈賽特治療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINASET THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩根　弗雷澤　賈爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORGAN, FRAZER GILES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧布萊恩　克里斯托弗　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'BRIEN, CHRISTOPHER D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,685</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>COPD患者群體之治療</chinese-title>
        <english-title>TREATMENT OF COPD PATIENT POPULATIONS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用包含以下物質的調配物治療哮喘、COPD、哮喘-COPD重疊症候群(Asthma-COPD Overlap Syndrome；ACOS)及慢性支氣管炎或其組合的方法：(S)-3-(3-(1-甲基-2-側氧基-5-(吡唑并[1,5-a]吡啶-3-基)-1,2-二氫-3H-咪唑并[4,5-b]吡啶-3-基)哌啶-1-基)-3-側氧基丙腈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to methods of treatment of asthma, COPD, Asthma-COPD Overlap Syndrome (ACOS), and chronic bronchitis, or a combination thereof, with formulations comprising (S)-3-(3-(1-methyl-2-oxo-5-(pyrazolo[1,5-a]pyridin-3-yl)-1,2-dihydro-3H-imidazo[4,5-b]pyridin-3-yl)piperidin-1-yl)-3-oxopropanenitrile.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:位置</p>
        <p type="p">2:位置</p>
        <p type="p">3:位置</p>
        <p type="p">4:位置</p>
        <p type="p">5:位置</p>
        <p type="p">6:位置</p>
        <p type="p">7:位置</p>
        <p type="p">8:位置</p>
        <p type="p">9:位置</p>
        <p type="p">10:位置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="849px" img-content="tif" inline="yes" orientation="portrait" width="618px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622092</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129105</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D519/00</main-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61K31/4985</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿雷希昂製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALEXION PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加達查達　文卡特拉奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADHACHANDA, VENKAT RAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗里茨邁爾　魯西爾格倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRITZEMEIER, RUSSELL GLENN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧尼安戈　伊凡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONYANGO, EVANS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　秦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>懷特豪斯　達倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WHITEHOUSE, DARREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加迪亞　薩蒂什庫馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GADHIYA, SATISHKUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珍妮特　喬恩保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANET, JON PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾斯　傑森艾倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILES, JASON ALLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿金斯　尼可拉斯Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKINS, NICHOLAS S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/678,250</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療補體介導之病症之醫藥化合物</chinese-title>
        <english-title>PHARMACEUTICAL COMPOUNDS FOR THE TREATMENT OF COMPLEMENT MEDIATED DISORDERS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供化合物、組成物、及方法，用以治療醫學病症，諸如補體介導之病症，包括補體C1s介導之病症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure provides compounds, compositions, and methods to treat medical disorders, such as complement-mediated disorders, including complement C1s-mediated disorders.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622048</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129155</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D251/18</main-classification>
        <further-classification edition="200601120260302B">A61K31/53</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商和記黃埔醫藥（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUTCHMED LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李文姬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, WENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110545855</doc-number>
          <date>20240801</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2025100331799</doc-number>
          <date>20250108</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化合物的晶型</chinese-title>
        <english-title>THE CRYSTALLINE FORMS OF A COMPOUND</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露屬於藥學領域，提供了化合物(S)-3-(4,6-二(((R)-1,1,1-三氟丙-2-基)胺基)-1,3,5-三嗪-2-基)-2,6,6-三氟環己-2-烯-1-醇的晶型、溶劑合物及其晶型，以及它們的醫藥組成物、製備方法和應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention belongs to the pharmaceutical field, and provides crystalline forms, solvates and the crystalline forms thereof of the compound (S)-3-(4,6-bis(((R)-1,1,1-trifluoropropan-2-yl)amino)-1,3,5-triazin-2-yl)-2,6,6-trifluorocyclohex-2-en-1-ol, and the pharmaceutical compositions comprising the same as well as the methods of preparing the same and the use thereof.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="477px" img-content="tif" inline="yes" orientation="portrait" width="674px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621679</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129171</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/192</main-classification>
        <further-classification edition="200601120260302B">A61P1/16</further-classification>
        <further-classification edition="200601120260302B">A61P3/06</further-classification>
        <further-classification edition="200601120260302B">G01N33/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賽馬拜製藥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYMABAY THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡羅爾　蘇希菈　Ｙ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARROLL, SUSHEELA Y.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　于中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YUN-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里滕登　達里亞　Ｂ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRITTENDEN, DARIA B.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬丁　羅伯特　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTIN, ROBERT L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥克惠特　查爾斯　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCWHERTER, CHARLES A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普羅爾　莎拉　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROEHL, SARAH C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史坦伯格　亞歷山卓　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEINBERG, ALEXANDRA V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/677,952</doc-number>
          <date>20240731</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/683,179</doc-number>
          <date>20240814</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/827,704</doc-number>
          <date>20250620</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療肝病之方法</chinese-title>
        <english-title>METHODS FOR TREATING LIVER DISEASE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露大致上係關於治療肝病，諸如原發性膽汁性膽管炎(PBC)，其包含投予治療有效量的塞拉德帕或其醫藥上可接受之鹽</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates generally to treating liver diseases, such as primary biliary cholangitis (PBC), comprising administering a therapeutically effective amount of seladelpar or a pharmaceutically acceptable salt thereof</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10033.JPG" file="ed10033.JPG" height="460px" img-content="tif" inline="yes" orientation="portrait" width="792px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622966</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129175</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G11C11/16</main-classification>
        <further-classification edition="200601120260224B">G11C8/14</further-classification>
        <further-classification edition="200601120260224B">G11C8/08</further-classification>
        <further-classification edition="200601120260224B">G11C7/12</further-classification>
        <further-classification edition="200601120260224B">G11C7/04</further-classification>
        <further-classification edition="200601120260224B">G11C5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元祥景</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WON, SANGGYEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金奎星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GYUSEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0102688</doc-number>
          <date>20240801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括輔助電晶體的記憶體裝置及其操作方法</chinese-title>
        <english-title>MEMORY DEVICE INCLUDING AUXILIARY TRANSISTORS AND METHOD OF OPERATING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括：一記憶體胞元陣列，其包括連接至一第一位元線或一第一源極線之複數個磁性記憶體胞元；複數個輔助電晶體，其連接至該第一位元線或該第一源極線且彼此並聯連接；以及一控制邏輯電路，其連接至該等複數個輔助電晶體中之各者的一閘極電極。該控制邏輯電路可回應於針對連接至一第一字元線之一第一磁性記憶體胞元的一操作命令，接通該等複數個輔助電晶體當中與該第一字元線相對應的一第一數目個輔助電晶體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes a memory cell array including a plurality of magnetic memory cells connected to a first bitline or a first source line, a plurality of auxiliary transistors connected to the first bitline or the first source line, and connected in parallel to each other, and a control logic circuit connected to a gate electrode of each of the plurality of auxiliary transistors. The control logic circuit may turn on a first number of auxiliary transistors corresponding to a first wordline, among the plurality of auxiliary transistors, in response to an operation command for a first magnetic memory cell connected to the first wordline.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:記憶體裝置</p>
        <p type="p">111:記憶體胞元陣列</p>
        <p type="p">112:周邊電路</p>
        <p type="p">130:控制邏輯電路</p>
        <p type="p">140:輸入/輸出驅動器</p>
        <p type="p">141:感測放大器</p>
        <p type="p">142:寫入驅動器</p>
        <p type="p">151:列解碼器</p>
        <p type="p">152:行解碼器</p>
        <p type="p">160:輔助電路</p>
        <p type="p">181:多工器</p>
        <p type="p">ADDR:位址</p>
        <p type="p">ATR1s:第一輔助電晶體</p>
        <p type="p">BL1:位元線，第一位元線</p>
        <p type="p">BLn:位元線</p>
        <p type="p">CMD:命令</p>
        <p type="p">CTRL1,CTRL2:控制信號</p>
        <p type="p">DC1:虛設胞元，第一虛設胞元</p>
        <p type="p">DCm:虛設胞元</p>
        <p type="p">DCA:虛設胞元區域</p>
        <p type="p">IO1~IOn:輸入/輸出線</p>
        <p type="p">MC11:磁性記憶體胞元，第(1-1)磁性記憶體胞元</p>
        <p type="p">MC12:磁性記憶體胞元，第(1-2)磁性記憶體胞元</p>
        <p type="p">MCnm:磁性記憶體胞元</p>
        <p type="p">PWR:外部電力</p>
        <p type="p">RBL:參考位元線</p>
        <p type="p">RC1:參考胞元，第一參考胞元</p>
        <p type="p">RCm:參考胞元</p>
        <p type="p">RCA:參考胞元區域</p>
        <p type="p">RSL:參考源極線</p>
        <p type="p">SL1:源極線，第一源極線</p>
        <p type="p">SLn:源極線</p>
        <p type="p">VDD:電力供應電壓</p>
        <p type="p">WL1:字元線，第一字元線</p>
        <p type="p">WL2:字元線，第二字源線</p>
        <p type="p">WLm:字元線</p>
        <p type="p">XADD:列位址</p>
        <p type="p">YADD:行位址</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="692px" img-content="tif" inline="yes" orientation="portrait" width="713px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621742</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129180</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120260302B">A61K47/68</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61K31/555</further-classification>
        <further-classification edition="200601120260302B">A61K31/513</further-classification>
        <further-classification edition="200601120260302B">A61K31/7068</further-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商常州恆邦藥業有限公司 中國江蘇省常州市新北區遼河路1028號　郵編：213001</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGZHOU HANSOH PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫丹妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, DANNI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳國梁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUOLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周遠鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YUANFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110607334</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>抗體藥物偶聯物和抗VEGF抗體的聯合應用</chinese-title>
        <english-title>COMBINATION APPLICATION OF ANTIBODY DRUG CONJUGATES AND ANTI VEGF ANTIBODIES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種抗體藥物偶聯物，單藥或聯合使用在製備用於預防和/或治療癌症藥物中的用途。具體而言，本發明提供一種抗體藥物偶聯物或其藥學上可接受的鹽、代謝物或溶劑化合物聯合抗VEGF抗體，或聯合抗VEGF抗體以及一種或多種化療藥物在製備用於預防和/或治療癌症藥物中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an antibody-drug conjugate, used alone or in combination, for the preparation of drugs for the prevention and/or treatment of cancer. Specifically, the present invention provides the use of an antibody-drug conjugate or its pharmaceutically acceptable salt, metabolite or solvent compound in combination with an anti-VEGF antibody, or in combination with an anti-VEGF antibody and one or more chemotherapy drugs in the preparation of drugs for the prevention and/or treatment of cancer.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="384px" img-content="tif" inline="yes" orientation="portrait" width="604px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623326</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129208</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">H05K3/00</main-classification>
        <further-classification edition="200601120251201B">B41F31/00</further-classification>
        <further-classification edition="200601120251201B">B41F31/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳市深逸通電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄俊祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳瑞田</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金玉書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117334501</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>PCB板垂直真空塞孔機</chinese-title>
        <english-title>A VERTICAL VACUUM PLUGGING MACHINE FOR PCB BOARDS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種PCB板垂直真空塞孔機，包括LCS供墨系統和塞孔系統，LCS供墨系統與塞孔系統連接，LCS供墨系統包括高真空倉體、過濾裝置、攪拌脫泡裝置、供油組件和工位切換組件，過濾裝置設置在高真空倉體外側，工位切換組件、攪拌脫泡裝置和供油組件設置在高真空倉體中，高真空倉體中與過濾裝置對應設置有過濾工位，與攪拌脫泡裝置對應設置有攪拌脫泡工位，與供油組件對應設置有供油工位，供油組件與塞孔系統連接，塞孔系統內的塞頭部位，後塞頭為可自動升降設計，對於雙面盲孔與雙面背鑽等板，可實現自動翻面塞孔，有更自動化的塞孔能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a vertical vacuum plugging machine for PCB boards, comprising an LCS resin supply system and a plugging system, wherein the LCS resin supply system is connected to the plugging system, and the LCS resin supply system comprises a high vacuum warehouse, a filtering device, a stirring and degassing device, an oil supply component and a station switching component, wherein the filtering device is arranged outside the high vacuum warehouse, and the station switching component, the stirring and degassing device and the oil supply component are arranged in the high vacuum warehouse, wherein a filtering station is arranged in the high vacuum warehouse corresponding to the filtering device, a stirring and degassing station is arranged corresponding to the stirring and degassing device, and an oil supply station is arranged corresponding to the oil supply component, and the oil supply component is connected to the plugging system, and the plug head part in the plugging system is designed to be automatically raised and lowered, and for boards such as double-sided blind holes and double-sided back drilling, automatic flipping and plugging can be realized, and more automated plugging capability is provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:過濾裝置</p>
        <p type="p">121:過濾斗</p>
        <p type="p">134:攪拌升降氣缸</p>
        <p type="p">14:供油組件</p>
        <p type="p">141:電機螺杆牙箱</p>
        <p type="p">142:活塞盤</p>
        <p type="p">15:工位切換組件</p>
        <p type="p">152:轉盤</p>
        <p type="p">153:油墨罐升降氣缸</p>
        <p type="p">3:油墨罐</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="826px" img-content="tif" inline="yes" orientation="portrait" width="693px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622510</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129216</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01R1/06</main-classification>
        <further-classification edition="202001120260302B">G01R31/26</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商睿進記憶體有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTELLIGENT MEMORY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濮　必得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POECHMUELLER, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/952,964</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>芯片或晶圓以及用於探測芯片或晶圓的系統</chinese-title>
        <english-title>CHIP OR WAFER AND SYSTEM FOR PROBING CHIP OR WAFER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">芯片或晶圓具有至少兩個導電對準標記，至少兩個導電對準標記與探針卡上的至少兩個導電探針接觸。至少兩個導電對準標記各自具有電訊號，該電訊號可從對準標記傳遞到導電探針。兩個電訊號可以具有彼此不同的電壓水平或不同的訊號頻率。電訊號用於計算芯片或晶圓相對於探針卡的旋轉偏差和/或橫向偏差，以進行精確的晶圓對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip or wafer has at least two electrically conducting alignment marks that contact at least two electrically conductive probe needles on a probe card. The at least two electrically conducting alignment marks each have an electrical signal that can transfer from the alignment marks to the electrically conductive probe needles. The two electrical signals can have a different voltage level or a different signal frequency than one another. The electrical signals are used to calculate a rotational deviation and/or lateral deviation of the chip or wafer relative to the probe card for precise wafer alignment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1090:晶圓</p>
        <p type="p">1091、1092、1093:焊點</p>
        <p type="p">1094、1095、1096、1097:探針測試標記</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10048.JPG" file="ed10048.JPG" height="450px" img-content="tif" inline="yes" orientation="portrait" width="552px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623193</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129222</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H03F1/32</main-classification>
        <further-classification edition="202301120260224B">G06N3/08</further-classification>
        <further-classification edition="200601120260224B">H04L25/49</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOONTAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴敏宰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, MINJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪炫碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HYUNSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹永埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, YOUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0105745</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>自適應數位預失真裝置、電子裝置及其操作方法</chinese-title>
        <english-title>ADAPTIVE DIGITAL PRE-DISTORTION DEVICE, ELECTRONIC DEVICE AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自適應數位預失真裝置包括傳統數位預失真（DPD）裝置、包括處理電路的一或多個處理器、以及儲存指令的記憶體。指令在由一或多個處理器個別或共同執行時，使得自適應DPD裝置接收複數個系統參數、使用神經網路估計傳統DPD裝置的一或多個係數、以及將一或多個係數應用到傳統DPD裝置。神經網路經組態以基於複數個系統參數產生一或多個係數作為輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adaptive digital pre-distortion device includes a legacy digital pre-distortion (DPD) device, one or more processors including a processing circuitry, and a memory storing instructions. The instructions, when executed by the one or more processors individually or collectively, cause the adaptive DPD device to receive a plurality of system parameters, estimate, using a neural network, one or more coefficients of the legacy DPD device, and apply the one or more coefficients to the legacy DPD device. The neural network is configured to generate, as outputs, the one or more coefficients based on the plurality of system parameters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子裝置</p>
        <p type="p">110:通訊電路</p>
        <p type="p">115:自適應數位預失真區塊</p>
        <p type="p">120:記憶體</p>
        <p type="p">130:處理器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="548px" img-content="tif" inline="yes" orientation="portrait" width="679px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622038</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129242</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C253/30</main-classification>
        <further-classification edition="200601120260302B">C07C255/57</further-classification>
        <further-classification edition="200601120260302B">C07K14/605</further-classification>
        <further-classification edition="200601120260302B">C07K1/04</further-classification>
        <further-classification edition="200601120260302B">C07K1/10</further-classification>
        <further-classification edition="200601120260302B">C07K1/18</further-classification>
        <further-classification edition="201701120260302B">A61K47/54</further-classification>
        <further-classification edition="200601120260302B">A61P3/04</further-classification>
        <further-classification edition="200601120260302B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商卡默療法股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARMOT THERAPEUTICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里希那　希亞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAN, SHYAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比格勒　拉斐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIGLER, RAPHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安格爾　帕斯卡爾　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENGL, PASCAL STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福克　卡爾　弗洛里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FALK, CARL FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費提斯　亞列克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FETTES, ALEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘莫洛　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMMERER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩斯尼爾　克里斯汀　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOESSNER, CHRISTIAN STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　帕斯卡　亞諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, PASCAL JARNO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃雷布　海倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLLEB, HELENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼斯　瑪蒂娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIESS, MARTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋伯　菲力　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEBER, PHILIPP STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/678,026</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>中間體之合成及其用於GLP1R/GIPR促效劑之製備之用途</chinese-title>
        <english-title>SYNTHESIS OF AN INTERMEDIATE AND ITS USE FOR THE PREPARATION OF GLP1R/GIPR AGONISTS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於合成2-(3-氰基-5-氟苯基)-2-甲基丙酸之方法及2-(3-氰基-5-氟苯基)-2-甲基丙酸在GLP-1R/GIPR促效劑之製備中作為中間體之用途。本發明亦係關於製備GLP-1R/GIPR促效劑之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to processes for the synthesis of 2-(3-cyano-5-fluorophenyl)-2-methylpropanoic acid and its use as intermediate in the preparation of GLP-1R/GIPR agonists. The invention also relates to a process of preparing a GLP-1R/GIPR agonist.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10047.JPG" file="ed10047.JPG" height="660px" img-content="tif" inline="yes" orientation="portrait" width="941px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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          <doc-number>202621795</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129252</doc-number>
          <kind></kind>
          <date>114/07/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B01L3/00</main-classification>
        <further-classification edition="200601120260302B">B01L7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商特仕美健康股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESTMATE HEALTH SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛佛德　珍妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEPHERD, JENNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪赫　蒂沃達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACH, TIVADAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬德里　瓦吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAUDHRY, WAJEEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯爾　史都華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURR, STEWART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈沃斯　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAWORTH, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷伯　克雷　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REBER, CLAY D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷佐茨基　凱莉　路易士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREZOCZKY, KELLY LEWIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷佐茨基　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREZOCZKY, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米特拉　戴基索</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITRA, DEBKISHORE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩希　希優　維納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAHI, SIEW-VEENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>恰帝爾　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHARTIER, NICOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>奈維吾　路易絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEVEU, LOUIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾　安卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELL, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="14">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈里斯　威爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRIS, WILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/678,013</doc-number>
          <date>20240731</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>核酸擴增裝置</chinese-title>
        <english-title>NUCLEIC ACID AMPLIFICATION DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於用於測試體液試樣中生物分析物之核酸擴增裝置及其使用方法。本文中揭示針對未經培訓之使用者或業外人士之核酸擴增系統。該等核酸擴增裝置具有(例如)帶有閥門之外殼、經構形以能夠擴增及檢測核酸之一或多個培育及檢測室。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to nucleic acid amplification devices for testing a bodily fluid sample for a biological analyte and their methods of use. Disclosed herein are nucleic acid amplification systems for untrained users or lay persons. The nucleic acid amplification devices have, e.g., a housing with valves, one or more incubation and detection chambers configured to enable the amplification and the detection of nucleic acids.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">104:試樣製備裝置</p>
        <p type="p">108:系統外殼</p>
        <p type="p">112:擴增裝置</p>
        <p type="p">116:窗口</p>
        <p type="p">120:閥門</p>
        <p type="p">124:檢測室外殼</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="728px" img-content="tif" inline="yes" orientation="portrait" width="645px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621887</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129267</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251028B">B29C43/58</main-classification>
        <further-classification edition="202201120251028B">G01J5/48</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＯＷＡ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田雄介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-201077</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂成形裝置及樹脂成形品的製造方法</chinese-title>
        <english-title>RESIN MOLDING APPARATUS AND RESIN MOLDED PRODUCT MANUFACTURING METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種樹脂成形裝置100，以非接觸的方式準確地測定空腔2C表面的溫度分佈，包括具有空腔2C的下模2及與下模2相向配置的上模3，使下模2及上模3合模而進行樹脂成形，所述樹脂成形裝置100包括：被覆構件供給部7，將輻射率較下模2高的片狀或膜狀的被覆構件6供給至下模2；吸附機構5，使被覆構件6吸附於空腔2C的表面；以及熱成像照相機8，在藉由吸附機構5使被覆構件6吸附於空腔2C的表面的狀態下，獲取表示被覆構件6的溫度分佈的熱成像圖像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a resin molding apparatus 100, which accurately measures the temperature distribution of the surface of a cavity 2C in a contactless manner and includes a lower mold 2 having the cavity 2C and an upper mold 3 arranged opposite to the lower mold 2, so that the lower mold 2 and the upper mold 3 are combined to perform resin molding. The resin molding apparatus 100 includes: a cover member supplying part 7 suppling a sheet-like or film-like cover member 6 with emissivity higher than the lower mold 2 to the lower mold 2; an adsorption mechanism 5 adsorbing the cover member 6 to the surface of the cavity 2C; and a thermal imaging camera 8 obtaining a thermal imaging image representing the temperature distribution of the cover member 6 when the cover member 6 is adsorbed to the surface of the cavity 2C by the adsorption mechanism 5.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:下模(第一模)</p>
        <p type="p">2C:空腔</p>
        <p type="p">3:上模(第二膜)</p>
        <p type="p">5:吸附機構</p>
        <p type="p">6:被覆構件</p>
        <p type="p">8:熱成像照相機</p>
        <p type="p">13:搬送機構(搬送對象物搬送部)</p>
        <p type="p">51、53:抽吸口</p>
        <p type="p">52、54:抽吸流路</p>
        <p type="p">201:底面構件</p>
        <p type="p">202:側面構件</p>
        <p type="p">203:底板</p>
        <p type="p">204:彈性構件</p>
        <p type="p">F:脫模膜</p>
        <p type="p">P:樹脂成形品</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="663px" img-content="tif" inline="yes" orientation="portrait" width="1033px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622067</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129273</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D405/14</main-classification>
        <further-classification edition="200601120260302B">C07D401/14</further-classification>
        <further-classification edition="200601120260302B">C07D413/14</further-classification>
        <further-classification edition="200601120260302B">C07D417/14</further-classification>
        <further-classification edition="200601120260302B">C07D491/048</further-classification>
        <further-classification edition="200601120260302B">A61K31/4545</further-classification>
        <further-classification edition="200601120260302B">A61K31/454</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商必治妥美雅史谷比公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRISTOL-MYERS SQUIBB COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡許恩　丹尼爾　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASHION, DANIEL K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊格斯　珍妮佛　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIGGS, JENNIFER R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛德華茲　賈可伯　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDWARDS, JACOB T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩彼恩茲　約翰　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAPIENZA, JOHN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/678,740</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>WEE1降解化合物及其用途</chinese-title>
        <english-title>WEE1 DEGRADING COMPOUNDS AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中提供減小WEE1激酶蛋白質含量之化合物及其組合物。在一些實施例中，提供用於治療WEE1相關疾病、例如癌症之該等化合物及組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds and compositions thereof that reduce WEE1 kinase protein levels. In some embodiments, the compounds and compositions are provided for treatment WEE1 associated diseases such as cancer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623539</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129328</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/60</main-classification>
        <further-classification edition="202601120260302B">H10P74/20</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
        <further-classification edition="202301120260302B">H10B41/20</further-classification>
        <further-classification edition="202301120260302B">H10B41/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　三貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SAN-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏拉曼央　普拉迪庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAHMANYAN, PRADEEP KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/678,393</doc-number>
          <date>20240801</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/252,404</doc-number>
          <date>20250627</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>元件製造中的局部變形及應力控制</chinese-title>
        <english-title>LOCAL DEFORMATION AND STRESS CONTROL IN DEVICE MANUFACTURING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭露的系統和技術旨在改善半導體製造。在一個實施例中，所揭露的技術包括在目標基板上形成變形適應層（DAL）。目標基板可以包括支撐一或多個製造特徵的第一基板，或是第二基板。技術進一步包括移除DAL的一或多個部分，造成第一基板和第二基板形成複合結構，並將第一基板薄化以曝露一或多個製造特徵的至少一子集，其中回應於薄化移除的DAL的一或多個部分造成複合結構的變形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed systems and techniques are directed to improvement of semiconductor manufacturing. In one embodiment, the disclosed techniques include forming a deformation-accommodating layer (DAL) on a target substrate. The target substrate can include a first substrate supporting one or more manufactured features, or a second substrate. The techniques further include removing one or more portions of the DAL, causing the first substrate and the second substrate to form a composite structure, and thinning the first substrate to expose at least a subset of the one or more manufactured features, wherein the one or more portions of the DAL are removed to cause, responsive to the thinning, a deformation of the composite structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:第一基板</p>
        <p type="p">104:堆疊</p>
        <p type="p">205:特徵</p>
        <p type="p">206:變形適應層(DAL)</p>
        <p type="p">208:保護遮罩</p>
        <p type="p">212:劑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10129.JPG" file="ed10129.JPG" height="434px" img-content="tif" inline="yes" orientation="portrait" width="513px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622044</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129337</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D231/12</main-classification>
        <further-classification edition="200601120260302B">A61K51/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商白鳥製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRATORI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>地方獨立行政法人東京都健康長壽醫療中心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO METROPOLITAN INSTITUTE FOR GERIATRICS AND GERONTOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉野博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHINO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薦田太一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMODA, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤雅彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊原潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOHARA, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-128131</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>放射性三苯基吡唑化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種放射性三苯基吡唑化合物，其可用作醫藥組合物、尤其是造影劑的有效成分，並且在活體內穩定。作為本發明的放射性三苯基吡唑化合物，能夠使用4-(4-[&lt;sup&gt;18&lt;/sup&gt;F]氟-2-(1-苯基-5-(2-(三氟甲基)苯基)-1H-吡唑-3-基)苯氧基)丁酸或其鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623313</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129342</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">H05H1/46</main-classification>
        <further-classification edition="202001120260226B">G06F30/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西口賢弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIGUCHI, KENYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-135702</doc-number>
          <date>20240815</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>預測方法、電漿處理裝置、模型產生方法及資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於預測腔室之阻抗變化。  &lt;br/&gt;本發明之預測方法包含工序(a)及工序(b)。工序(a)係獲取向在腔室內部產生電漿之電極施加之RF(Radio Frequency)電力之頻率，以及從RF電力流經之饋電線上設置之匹配電路獲取藉由RF電力而產生了電漿之腔室之阻抗。工序(b)係使用預測模型，根據工序(a)中獲取之RF電力之頻率及腔室之阻抗的時間序列資料，來預測腔室之阻抗變化，該預測模型至少根據RF電力之頻率及腔室之阻抗的時間序列資料來預測腔室之阻抗變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S20~S24:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="564px" img-content="tif" inline="yes" orientation="portrait" width="494px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622039</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129344</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C253/30</main-classification>
        <further-classification edition="200601120260302B">C07C255/57</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商赫孚孟拉羅股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>F. HOFFMANN-LA ROCHE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比格勒　拉斐爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIGLER, RAPHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西爾布蘭德　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HILDBRAND, STEFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩斯尼爾　克里斯汀　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOESSNER, CHRISTIAN STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普恩提納　柯特　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PUENTENER, KURT ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽達梅爾　約爾格　馬賽爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEDELMEIER, JOERG MATHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>特拉赫賽爾　艾蒂安　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRACHSEL, ETIENNE MARC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王淑靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24192480.2</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>製備２－（３－氰基－５－氟苯基）－２－甲基－丙酸之方法</chinese-title>
        <english-title>PROCESS FOR THE PREPARATION OF 2-(3-CYANO-5-FLUOROPHENYL)-2-METHYL-PROPIONIC ACID</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及製備式 (I) 之 2-(3-氰基-5-氟苯基)-2-甲基-丙酸之新穎方法  &lt;br/&gt;&lt;img align="absmiddle" height="160px" width="185px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。  &lt;br/&gt;該式 (I) 之該 2-(3-氰基-5-氟苯基)-2-甲基-丙酸為活性醫藥成分之合成中的多功能中間體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to novel processes for the preparation of 2-(3-cyano-5-fluorophenyl)-2-methyl-propionic acid of the formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="153px" width="182px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. &lt;br/&gt;The 2-(3-cyano-5-fluorophenyl)-2-methyl-propionic acid of the formula (I) is a versatile intermediate in the synthesis of active pharmaceutical ingredients.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623146</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129361</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H02J3/46</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商光寶科技新加坡私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南洋理工大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYANG TECHNOLOGICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐燚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖子衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, ZIHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, ZHIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　翊勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, YI CHYN CASSANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,500</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/093,586</doc-number>
          <date>20250328</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>分散式發電單元、微電網系統以及在微電網系統中的分流控制方法</chinese-title>
        <english-title>DISTRIBUTED GENERATION UNIT, ELECTRICAL MICROGRID SYSTEM, AND METHOD OF CURRENT-SHARING CONTROL IN ELECTRICAL MICROGRID SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種分散式發電單元，包括一電表與一處理器。電表根據分散式發電單元之功率定額產出一單位電流。處理器耦接在一控制區域網路匯流排與電路區塊之間。處理器使分散式發電單元在一初始時間辨識出一第一電訊號，並實施一主單元選擇流程。主單元選擇流程包括：根據單位電流與最大單位電流決定延遲時間；從初始時間起算，在延遲時間過去後將單位電流認定為最大單位電流；並透過控制區域網路匯流排廣播最大單位電流與一第二電訊號。處理器進一步被配置為：在第二電訊號被廣播後，實施一衰減係數調整流程以維持分散式發電單元當前的狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A distributed generation unit (DGU) is provided. The DGU includes a meter and a processor. The meter generates a per-unit current based on the rated power value of the DGU. The processor is coupled between a control area network (CAN) bus and the circuit block. The processor causes the DGU to identify a first electrical signal at an initial time and perform a master selection process. The master selection process includes determining the delay time based on the per-unit current and the maximum per-unit current, identifying the per-unit current as the maximum per-unit current when the delay time has elapsed since the initial time, and broadcasting the maximum per-unit current and a second electrical signal through the CAN bus. The processor is further configured to perform a droop coefficient regulation process to maintain the current state of the DGU after the second electrical signal is broadcast.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微電網系統</p>
        <p type="p">110,120:分散式發電單元</p>
        <p type="p">112,122:電路區塊</p>
        <p type="p">114,124:數位訊號處理器</p>
        <p type="p">116,126:電表</p>
        <p type="p">130:控制區域網路匯流排</p>
        <p type="p">140:直流匯流排</p>
        <p type="p">RL1,RL2:線阻抗</p>
        <p type="p">Ipu1,Ipu2,Imax:單位電流</p>
        <p type="p">FS,FR:電訊號</p>
        <p type="p">S1,S2:控制訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="644px" img-content="tif" inline="yes" orientation="portrait" width="981px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621670</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129367</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/44</main-classification>
        <further-classification edition="200601120260302B">A61K8/06</further-classification>
        <further-classification edition="200601120260302B">A61K8/92</further-classification>
        <further-classification edition="200601120260302B">A61K8/894</further-classification>
        <further-classification edition="200601120260302B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三得利控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNTORY HOLDINGS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田絵理花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, ERIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-127643</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>Ｗ／Ｏ／Ｗ型乳劑及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供含有甜菜鹼，經時安定性良好且具有優良使用感之W/O/W型乳劑及其製造方法。本發明是有關於一種W/O/W型乳劑，其為包含內水相、油相及外水相之W/O/W型乳劑，上述內水相含有甜菜鹼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623416</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129370</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260225B">H10D64/00</main-classification>
        <further-classification edition="202501120260225B">H10D30/01</further-classification>
        <further-classification edition="202501120260225B">H10D30/47</further-classification>
        <further-classification edition="202501120260225B">H10D62/85</further-classification>
        <further-classification edition="202501120260225B">H10D64/01</further-classification>
        <further-classification edition="202501120260225B">H10D64/27</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商芬威半導體公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FINWAVE SEMICONDUCTOR, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾默　霍爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMMER, HAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　相珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,189</doc-number>
          <date>20240805</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/283,906</doc-number>
          <date>20250729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有場板之ＩＩＩ族氮化物電晶體及製法</chinese-title>
        <english-title>III-NITRIDE TRANSISTORS WITH FIELD PLATE AND METHODS OF FABRICATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了一種新的半導體結構及製法。此半導體結構包括一源極連接場板，在一些實施例中，其至少與閘極場板(如果存在)一樣靠近阻障層。源極連接場板是藉由圖案化介電層以形成一個腔體及沉積金屬於其中以形成所述源極連接場板所形成。在一些實施例中，可以存在多個源極連接場板，每個源極連接場板與阻障層的距離不同。這些多個源極連接場板可以透過單一金屬沉積製程所建立。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A new semiconductor structure and method of fabrication is disclosed. The semiconductor structure includes a source-connected field plate, which in some embodiments, is located at least as close to the barrier layer as the gate field plate, if present. The source-connected field plate is formed by patterning the dielectric layer to create a cavity in which metal will be deposited to form the source-connected field plate. In some embodiments, there may be multiple source-connected field plates, which are each at a different distance from the barrier layer. These multiple source-connected field plates may be created using a single metal deposition process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板</p>
        <p type="p">2:緩衝層</p>
        <p type="p">3:通道層</p>
        <p type="p">4:阻障層</p>
        <p type="p">5a:第一介電子層</p>
        <p type="p">5b:第二介電子層</p>
        <p type="p">6:閘極電極</p>
        <p type="p">7:源極電極</p>
        <p type="p">8:汲極電極</p>
        <p type="p">9a:第一源極連接場板</p>
        <p type="p">9b:第二源極連接場板</p>
        <p type="p">10:閘極場板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="693px" img-content="tif" inline="yes" orientation="portrait" width="457px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621872</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129395</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">B25J13/00</main-classification>
        <further-classification edition="200601120260225B">B25J5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商川崎重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI JUKOGYO KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子慶太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, KEITARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福井将司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBO, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-129111</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>機器人的控制方法及機器人</chinese-title>
        <english-title>ROBOT CONTROL METHOD AND ROBOT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開旨在提供一種機器人的控制方法及機器人，能夠使機器人開啟到通過滑動門為止的動作順暢進行。  &lt;br/&gt;機器人的控制方法包括：使特定臂部（第一臂部200A、第二臂部200B）向滑動門SD的把手H移動末端執行器（第一末端執行器210、第二末端執行器220）；在使機器人1與滑動門SD正對的狀態下，使特定臂部移動末端執行器，以使把手H向滑動門SD的開啟方向移動，從而開啟滑動門SD；在開啟滑動門SD的狀態下，使特定臂部移動末端執行器以解除末端執行器與把手H的接觸狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure aims to provide a robot control method and a robot, where the robot is operated to do smoothly the actions from opening a sliding door to passing through the door. &lt;br/&gt;A control method for a robot (1) according to the present disclosure includes: causing a specific arm (first arm 200A, second arm 200B) to move an end effector (first end effector 210, second end effector 220) toward a handle H of the sliding door SD; causing the specific arm to move the end effector so that the handle H is moved in the direction of opening the sliding door SD while the robot (1) is facing the sliding door SD, so as to open the sliding door SD; and moving the end effector to the specific arm to release the contact between the end effector and the handle H while the sliding door SD is open.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:接收指令</p>
        <p type="p">S102:啟動程式</p>
        <p type="p">S103:移動</p>
        <p type="p">S104:到達</p>
        <p type="p">S105:決定滑動門的開啟方法</p>
        <p type="p">S106:使把手與第一臂部正對</p>
        <p type="p">S107:移動第一臂部</p>
        <p type="p">S108:藉由第一末端執行器把持把手</p>
        <p type="p">S109:開啟滑動門</p>
        <p type="p">S110:藉由第二末端執行器保持滑動門</p>
        <p type="p">S111:釋放第一末端執行器</p>
        <p type="p">S112:前進</p>
        <p type="p">S113:移動第二臂部</p>
        <p type="p">S114:檢測移動裝置的通過</p>
        <p type="p">S115:停止第二臂部</p>
        <p type="p">S116:向目的地移動</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="1090px" img-content="tif" inline="yes" orientation="portrait" width="794px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622050</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129432</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D311/30</main-classification>
        <further-classification edition="200601120260302B">C07C31/26</further-classification>
        <further-classification edition="200601120260302B">A61K31/352</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商坤騰生物橋接私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUANTUM BIOBRIDGE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯曼姆　斯隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMANMOO, SRUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
              <english-address>TH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋騰塔維蘇布　蘇拉切特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOONTONTAWEESUB, SURACHET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
              <english-address>TH</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/IB2024/057498</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>槲皮素—六元醇共結晶及其製備方法</chinese-title>
        <english-title>QUERCETIN-HEXAHYDRIC ALCOHOL COCRYSTAL AND PROCESS FOR PREPARING THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示與六元醇組合之槲皮素之新穎固態形式，從而形成槲皮素-六元醇共結晶。該等共結晶已經研發為創新性醫藥調配物。本發明涵蓋用於產生該等共結晶材料之方法，以及其作為生物增強劑用於活性醫藥成分、植物化學物、維他命及礦物質之應用。所揭示之用於製備槲皮素-六元醇共結晶之方法涉及經由動力學受控之共結晶製程來形成該共結晶，從而增強生物活性化合物之生物可用性及效能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a novel solid-state form of quercetin combined with hexahydric alcohol, resulting in the formation of quercetin-hexahydric alcohol cocrystals. These cocrystals have been developed as innovative pharmaceutical formulations. The present invention encompasses methods for producing these cocrystal materials, as well as their application as bioenhancers for active pharmaceutical ingredients, phytochemicals, vitamins, and minerals. The disclosed process for preparing quercetin-hexahydric alcohol cocrystals involves the formation of the cocrystal through a kinetic-controlled cocrystallization process, enhancing the bioavailability and efficacy of bioactive compounds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:圖形表示</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10030.JPG" file="ed10030.JPG" height="565px" img-content="tif" inline="yes" orientation="portrait" width="685px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622065</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129442</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D405/04</main-classification>
        <further-classification edition="200601120260302B">C07D401/04</further-classification>
        <further-classification edition="200601120260302B">C07D239/42</further-classification>
        <further-classification edition="200601120260302B">C07D498/04</further-classification>
        <further-classification edition="200601120260302B">C07D498/08</further-classification>
        <further-classification edition="200601120260302B">C07D487/04</further-classification>
        <further-classification edition="200601120260302B">C07D413/14</further-classification>
        <further-classification edition="200601120260302B">C07D401/14</further-classification>
        <further-classification edition="200601120260302B">C07D413/04</further-classification>
        <further-classification edition="200601120260302B">C07D401/10</further-classification>
        <further-classification edition="200601120260302B">C07D413/10</further-classification>
        <further-classification edition="200601120260302B">C07D487/08</further-classification>
        <further-classification edition="200601120260302B">C07D491/08</further-classification>
        <further-classification edition="200601120260302B">C07D491/18</further-classification>
        <further-classification edition="200601120260302B">C07D498/22</further-classification>
        <further-classification edition="200601120260302B">A61K31/506</further-classification>
        <further-classification edition="200601120260302B">A61K31/5383</further-classification>
        <further-classification edition="200601120260302B">A61K31/5377</further-classification>
        <further-classification edition="200601120260302B">A61K31/4995</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商勁方醫藥科技(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENFLEET THERAPEUTICS (SHANGHAI) INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周福生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, FUSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧彥冬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YANDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐曉明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, XIAOMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡禮健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, LIJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林崇懶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHONGLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于巷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭　炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂　強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110645783</doc-number>
          <date>20240802</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>202411199143X</doc-number>
          <date>20240828</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2024113307628</doc-number>
          <date>20240923</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2024114658231</doc-number>
          <date>20241018</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>2024117251725</doc-number>
          <date>20241127</date>
        </priority-claim>
        <priority-claim sequence="6">
          <country>中國大陸</country>
          <doc-number>2025100167224</doc-number>
          <date>20250103</date>
        </priority-claim>
        <priority-claim sequence="7">
          <country>中國大陸</country>
          <doc-number>2025101696032</doc-number>
          <date>20250214</date>
        </priority-claim>
        <priority-claim sequence="8">
          <country>中國大陸</country>
          <doc-number>2025105781458</doc-number>
          <date>20250430</date>
        </priority-claim>
        <priority-claim sequence="9">
          <country>中國大陸</country>
          <doc-number>2025110392500</doc-number>
          <date>20250725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>丙烯醯基類化合物及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種丙烯醯基類化合物及其用途。本發明提供了一種如式I所示化合物、其立體異構體、其同位素標記化合物、其溶劑合物、其前藥、其氮氧化物或其藥學上可接受的鹽。本發明的化合物對癌症具有良好的治療作用。  &lt;br/&gt;&lt;img align="absmiddle" height="235px" width="173px" file="ed11545.JPG" alt="ed11545.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622054</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129446</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/12</main-classification>
        <further-classification edition="200601120260302B">C07D471/04</further-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇豪森藥業集團有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HANSOH PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海翰森生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HANSOH BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭佳志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, JIAZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊雨晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110620625</doc-number>
          <date>20240802</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種含氮雜環類衍生物的製備方法及其中間體</chinese-title>
        <english-title>PREPARATION METHOD OF NITROGEN-CONTAINING HETEROCYCLIC DERIVATIVES AND INTERMEDIATES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種含氮雜環類衍生物的製備方法。本發明方法克服了現有技術中存在的缺陷，大大縮減了成本，所得產物純度好、收率高、工藝可操作性強，工藝安全性高。因此，適合工業化應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a preparation method of nitrogen-containing heterocyclic derivatives. This method overcomes the defects existing in the prior art, significantly reduces costs, and yields products with high purity and yield. The process demonstrates strong operability, high safety, and is suitable for industrial application.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621699</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129457</doc-number>
          <kind></kind>
          <date>114/08/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/675</main-classification>
        <further-classification edition="200601120260302B">C07F9/6558</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商石藥集團中奇製藥技術（石家莊）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CSPC ZHONGQI PHARMACEUTICAL TECHNOLOGY (SHIJIAZHUANG) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張朝再</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHAOZAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王礦磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUANGLEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊漢煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HANYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范麗雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, LIXUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋云龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YUNLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>褚文浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, WENHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雪嬌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XUEJIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭文敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, WENMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛嶺嶺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIN, LINGLING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱興博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, XINGBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110480916</doc-number>
          <date>20240801</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024117328074</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025101219086</doc-number>
          <date>20250126</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2025103630909</doc-number>
          <date>20250326</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種ＥＧＦＲ降解劑及其製備方法和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種式(I)所示的靶向表皮生長因子受體(EGFR)的雙功能嵌合體雜環化合物及其藥物組合物、製備方法和用途，其通過招募泛素連接酶到EGFR，從而促進EGFR的泛素化及蛋白酶體對其的降解。研究結果顯示，這些化合物表現出較好的EGFR降解活性，可用於治療由EGFR介導的疾病。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="132px" width="373px" file="ed10576.JPG" alt="ed10576.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623344</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129500</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H05K7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波特克　古斯塔沃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POTTKER, GUSTAVO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,686</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用對流增幅器的兩相浸沒式冷卻</chinese-title>
        <english-title>TWO-PHASE IMMERSION COOLING WITH CONVECTIVE BOOSTER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種浸沒式冷卻系統包括：一浸沒式冷卻槽，其界定容納一流體的一空腔；一電氣組件，其設置於該空腔內，其中該電氣組件之至少一部分係浸沒於容納在該空腔內的該流體中；一冷板，其可操作地耦接至該電氣組件，該冷板與該電氣組件及該流體熱連通；及一泵，該泵從該空腔抽取流體並實現圍繞該冷板的流體之流動，以誘發圍繞該冷板流動的該流體之強制對流沸騰。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An immersion cooling system includes an immersion cooling tank defining a cavity retaining a fluid, an electrical component disposed within the cavity, wherein at least a portion of the electrical component is immersed in the fluid retained within the cavity, a cold plate operably coupled to the electrical component, the cold plate in thermal communication with the electrical component and the fluid, and a pump, the pump drawing fluid from the cavity and effectuating a flow of fluid about the cold plate to induce forced convective boiling of the fluid flowing about the cold plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:浸沒式冷卻系統</p>
        <p type="p">12:浸沒槽</p>
        <p type="p">14:側面</p>
        <p type="p">16:下表面</p>
        <p type="p">18:上表面</p>
        <p type="p">20:內表面</p>
        <p type="p">22:空腔</p>
        <p type="p">24:底表面</p>
        <p type="p">26:流體</p>
        <p type="p">28:電氣組件</p>
        <p type="p">30:基材</p>
        <p type="p">32:晶片</p>
        <p type="p">34:冷板</p>
        <p type="p">38:流體之表面</p>
        <p type="p">40:氣體-蒸汽混合物</p>
        <p type="p">42:富含蒸氣之混合物</p>
        <p type="p">44:富含空氣之混合物</p>
        <p type="p">46:泵</p>
        <p type="p">50:閥</p>
        <p type="p">60:流體冷卻迴路</p>
        <p type="p">62:冷凝器</p>
        <p type="p">62a:冷凝器之出口</p>
        <p type="p">64:流體冷卻器</p>
        <p type="p">64a:流體冷卻器之入口</p>
        <p type="p">66:泵</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="925px" img-content="tif" inline="yes" orientation="portrait" width="697px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622270</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129512</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C23C16/04</main-classification>
        <further-classification edition="200601120260225B">C23C16/34</further-classification>
        <further-classification edition="200601120260225B">C23C16/40</further-classification>
        <further-classification edition="200601120260225B">C23C16/505</further-classification>
        <further-classification edition="200601120260225B">C23C16/56</further-classification>
        <further-classification edition="200601120260225B">H01J37/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫迪　普范</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MODI, PURVAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>強森　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON, ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席特拉　巴加夫Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CITLA, BHARGAV S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奈馬尼　史林尼法斯Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMANI, SRINIVAS D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　怡利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIEH, ELLIE Y.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/680,009</doc-number>
          <date>20240806</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/909,425</doc-number>
          <date>20241008</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>氙電漿固化可增強低K介電膜中之交聯</chinese-title>
        <english-title>XENON PLASMA CURES TO ENABLE INCREASED CROSSLINKING IN LOW-K DIELECTRIC FILMS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例大體係關於對在基板上形成的介電材料層進行電漿固化的方法。更具體地說，本揭露的方法利用含氙（Xe）的氣體來產生電漿，以實現更大的介電成分調整。在某些實施例中，對基板進行固化的方法包括將介電膜沉積在基板上，以在基板的表面上形成介電層，並對所形成的介電層進行電漿固化操作。電漿固化操作包括藉由將射頻電力傳遞至電漿處理氣體，在形成的介電層的表面上產生電漿。電漿處理氣體包含Xe和H&lt;sub&gt;2&lt;/sub&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure generally relate to methods of plasma curing a dielectric material layer formed on a substrate. More specifically, the methods disclosed herein utilize a xenon (Xe) containing gas to generate a plasma that allows for greater dielectric compositional modulation. In some embodiments, a method of curing a substrate includes depositing a dielectric film onto a substrate to form a dielectric layer on a surface of a substrate, and performing a plasma cure operation on the formed dielectric layer. The plasma cure operation includes generating a plasma over a surface of the formed dielectric layer by delivering a RF power to a plasma process gas. The plasma process gas include Xe and H&lt;sub&gt;2&lt;/sub&gt;.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="718px" img-content="tif" inline="yes" orientation="portrait" width="625px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623520</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129521</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/60</main-classification>
        <further-classification edition="202601120260302B">H10P10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深澤篤毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAZAWA, ATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦仁嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-136964</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>保護膜之形成方法及半導體元件之製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明形成一種以防止自半導體元件中之金屬配線擴散或抑制表面氧化為目的之高功能且薄膜化之保護膜。  &lt;br/&gt;本發明係一種半導體元件中之保護膜之形成方法，上述保護膜係以防水膜及防擴散膜彼此相鄰地積層之方式構成，該形成方法包含以下步驟：形成上述防水膜；及利用二維材料薄膜形成上述防擴散膜。形成以防止自半導體元件中之金屬配線擴散或抑制表面氧化為目的之高功能且薄膜化之保護膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">300:保護膜</p>
        <p type="p">310:防擴散膜</p>
        <p type="p">320:防水膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="218px" img-content="tif" inline="yes" orientation="portrait" width="355px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623054</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129531</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾嘉沃　達克什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGARWAL, DAKSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃斯瓦拉　薩爾瑪　桑卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESWARA SARMA, SANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　相哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANGCHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈德基　南迪塔　維拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GHODKI, NANDITA VILAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>穆拉利　迪普蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURALI, DEEPTI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮斯昆　伊利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PISKUN, ILYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮爽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PI, SHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧澤爾　塔內爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZEL, TANER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　晴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, QING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,346</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>藉由多階段脈衝的高深寬比特徵部蝕刻</chinese-title>
        <english-title>HIGH ASPECT RATIO FEATURE ETCHING BY MULTI-STATE PULSING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種在基板中蝕刻特徵部的方法，包含：在蝕刻腔室中接收基板，基板包含將被蝕刻之第一層以及在第一層上的遮罩，以及藉由暴露基板於包含多階段脈衝方案之蝕刻條件以在第一層中蝕刻特徵部，多階段脈衝方案具有至多約3000微秒之脈衝週期，並包含在脈衝週期內皆發生一次之第一階段S1、第二階段S2、第三階段S3以及第四階段S4。於階段S1、S2、S3及S4中，階段S1具有電漿來源功率以及電漿偏壓功率之最高幅值，S2不具有偏壓功率，S3及S4具有不同之電漿來源功率及/或電漿偏壓功率，以及S3具有低於S1偏壓功率之偏壓功率，且S4具有低於S1偏壓功率之偏壓功率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of etching features in the substrate includes receiving in an etch chamber a substrate including a first layer to a first layer to be etched and a mask over the first layer, and etching features in the first layer by exposing the substrate to etch conditions including a multi-state pulsing scheme having a pulse period of at most about 3000 microseconds and including a first state S1, a second state S2, a third state S3, and a fourth state S4 all occurring once within the pulse period. Among the states S1, S2, S3, and S4, state S1 has the highest magnitude of plasma source power and plasma bias power, S2 has no bias power, S3 and S4 have source plasma powers and/or bias plasma powers that are different, and S3 has a bias power that is lower than the S1 bias power, and S4 has a bias power that is lower than the S1 bias power.</p>
      </isu-abst>
      <representative-img>
        <p type="p">600:處理</p>
        <p type="p">610,620,630,640,650,660:方塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="876px" img-content="tif" inline="yes" orientation="portrait" width="583px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623030</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129533</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H01J37/20</main-classification>
        <further-classification edition="200601120260223B">H01J37/22</further-classification>
        <further-classification edition="200601120260223B">H01J37/28</further-classification>
        <further-classification edition="200601120260223B">C23C16/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴光緒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, GWANGSEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/027865</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>帶電粒子束裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">
        &lt;b&gt;　　&lt;/b&gt;本揭示之目的，在於提供一種能夠判別光的照射所造成的對於帶電的除電效果以及圖像的改善效果是否飽和或不足之技術，尤其是提供一種能夠決定用來獲得最佳的除電效果及圖像的改善效果的修正量之帶電粒子束裝置。本揭示之帶電粒子束裝置，依對試料的前述光的每一照射量取得前述試料的特徵量，計算每一前述照射量的試料圖像的特徵量間的差分滿足規定條件的前述照射量，並且控制光源以便照射計算出的前述照射量的前述光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S301~S308:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="719px" img-content="tif" inline="yes" orientation="portrait" width="1011px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622093</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129535</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C07F7/18</main-classification>
        <further-classification edition="200601120260226B">C08F8/42</further-classification>
        <further-classification edition="200601120260226B">C08L101/00</further-classification>
        <further-classification edition="201401120260226B">C09D11/02</further-classification>
        <further-classification edition="200601120260226B">G02F1/061</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤木秀成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKI, SHUSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤貴広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-131021</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化合物、光電用墨水組合物、膜、光電元件及化合物之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種含有可提高電場極化時之配向度之受體部之EO化合物。  &lt;br/&gt;一種下述式(1)所表示之化合物。式(1)中，A表示式(1-A)所表示之基(但R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;均為氟基且m及n均為1之基除外)。式(1-A)中，R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;分別獨立地表示氫原子以外之取代基。m及n分別獨立地表示0～5之整數。但m＋n不為0。於m為2～5之情形時，存在複數個之R&lt;sup&gt;1&lt;/sup&gt;分別可相同亦可不同。於n為2～5之情形時，存在複數個之R&lt;sup&gt;2&lt;/sup&gt;分別可相同亦可不同。L表示單鍵或2價之共軛系連結基，D表示供電子性基。  &lt;br/&gt;&lt;img align="absmiddle" height="265px" width="270px" file="ed10058.JPG" alt="ed10058.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621958</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129554</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B65D81/34</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大和製罐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIWA CAN COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>犬丸彰子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INUMARU, AYAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上野美空</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENO, MIKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>権藤僚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONDOU, RYOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村保昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YASUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-135232</doc-number>
          <date>20240814</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-144175</doc-number>
          <date>20240826</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>日本</country>
          <doc-number>2024-146869</doc-number>
          <date>20240828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>微波爐加熱用治具</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種技術，其在被容納於金屬製罐容器的物品透過微波爐來加熱時，可抑制由金屬引起的缺陷之產生。微波爐加熱用治具(10A)為非金屬製的微波爐加熱用治具，使用於透過微波爐將被容納在金屬製罐容器(21)的物品(22)進行加熱時，將前述金屬製罐容器(21)以與前述微波爐的庫內底面(W1)的距離擴大的狀態下設置在庫內；包含：支承部(11)，具有筒形狀；以及平板狀的補強部(12)，被連接至前述支承部(11)的一方的開口；其中，前述支承部(11)是被構成為與形狀及尺寸的至少一者為相互不同的第一罐頭製品端部及第二罐頭製品端部的雙方相嵌合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:微波爐加熱用治具</p>
        <p type="p">11:支承部</p>
        <p type="p">11b:基部或下部</p>
        <p type="p">11e:擴徑部</p>
        <p type="p">11g1:第一嵌合部</p>
        <p type="p">11g2:第二嵌合部</p>
        <p type="p">12:補強部</p>
        <p type="p">20A:罐頭製品</p>
        <p type="p">21:金屬製罐容器</p>
        <p type="p">21a:罐體</p>
        <p type="p">21b:罐底</p>
        <p type="p">21c:罐蓋</p>
        <p type="p">21c1’:罐蓋本體</p>
        <p type="p">21e1:大徑部</p>
        <p type="p">21e2:大徑部</p>
        <p type="p">22:物品</p>
        <p type="p">22a:第一食品</p>
        <p type="p">22b:第二食品</p>
        <p type="p">112:底板</p>
        <p type="p">W1:庫內底面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="853px" img-content="tif" inline="yes" orientation="portrait" width="792px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623531</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129557</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/20</main-classification>
        <further-classification edition="202601120260302B">H10P50/28</further-classification>
        <further-classification edition="202601120260302B">H10W70/652</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉姆齊　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMSEY, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拜拉吉恩　約書亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAILLARGEON, JOSHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>多夫納　亞力克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DORFNER, ALEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴玟俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, MINJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/797,786</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿蝕刻期間利用含金屬遮罩的原位側壁清理</chinese-title>
        <english-title>IN SITU SIDEWALL CLEANING DURING PLASMA ETCH WITH METAL-CONTAINING MASK</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電漿蝕刻的方法，包含循環地執行下列步驟：蝕刻下方材料，如介電材料，透過在含金屬遮罩層（例如，矽化鎢）中之開口以延伸凹部進入下方材料，使用包含至少一種氫氟碳蝕刻劑物種（例如，三氟甲烷）的蝕刻劑氣體所激發之電漿；以及使用由純氧氣體（例如，純雙原子氧氣體）所激發之電漿，自凹部之側壁蝕刻殘留材料，殘留材料係在蝕刻下方材料時被沉積。蝕刻劑氣體的所有物種包含不多於一個碳且包含氟與碳以外之元素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of plasma etching includes cyclically performing the following steps: etching an underlying material, such as a dielectric material, to extend recesses into the underlying material through openings in a metal-containing mask layer, such as a tungsten silicide, using plasma excited from an etchant gas including at least one hydrofluorocarbon etchant species, such as trifluoromethane; and etching residual material from sidewalls of the recesses using plasma excited from a pure oxygen gas, such as pure diatomic oxygen gas, the residual material being deposited while etching the underlying material. All species of the etchant gas include no more than one carbon and include an element other than fluorine and carbon.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電漿蝕刻處理</p>
        <p type="p">101:精實蝕刻步驟</p>
        <p type="p">102:側壁清理步驟</p>
        <p type="p">109:循環</p>
        <p type="p">110:蝕刻電漿</p>
        <p type="p">112:蝕刻劑氣體</p>
        <p type="p">114:蝕刻劑物種</p>
        <p type="p">120:清理電漿</p>
        <p type="p">122:純氧氣體</p>
        <p type="p">130:遮罩堆積</p>
        <p type="p">131:側壁堆積</p>
        <p type="p">132:初始遮罩高度</p>
        <p type="p">133:損失</p>
        <p type="p">134:蝕刻深度</p>
        <p type="p">136:精實蝕刻步驟持續時間</p>
        <p type="p">140:氧化物堆積</p>
        <p type="p">143:遮罩清理損失</p>
        <p type="p">145:側壁</p>
        <p type="p">146:側壁清理步驟持續時間</p>
        <p type="p">160:基板</p>
        <p type="p">162:下方材料</p>
        <p type="p">163:殘留材料</p>
        <p type="p">164:凹部</p>
        <p type="p">165:側壁</p>
        <p type="p">166:含金屬遮罩層</p>
        <p type="p">167:開口</p>
        <p type="p">170:電漿蝕刻腔室</p>
        <p type="p">M:金屬或類金屬</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="983px" img-content="tif" inline="yes" orientation="portrait" width="754px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623546</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129563</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P52/40</main-classification>
        <further-classification edition="201201120260302B">B24B37/005</further-classification>
        <further-classification edition="201201120260302B">B24B37/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　浩權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, JUSTIN HO KUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　湯姆Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TOM C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧加森　艾蜜莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUGASON, EMILY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/820,194</doc-number>
          <date>20240829</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>在化學機械拋光系統中尋找基板上的基板凹槽</chinese-title>
        <english-title>FINDING SUBSTRATE NOTCH ON SUBSTRATE IN A CHEMICAL MECHANICAL POLISHING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">拋光裝置具有拋光站、尋找凹槽的站，以及基板搬運系統，用於在兩者之間移動基板。尋找凹槽的站包括外殼，該外殼具有內部容積，提供儲庫，該儲庫有地板、天花板，以及從地板延伸到天花板的第一側壁。儲庫的天花板上有孔，並且有側通道從儲庫在孔下方的區域向側面延伸到入口埠，使得經由入口埠注入的液體從孔中流出，形成液體柱。光纖穿過儲庫的地板，並經定位以將光束經由孔及液體柱照射到在尋找凹槽的站上保持的基板，並接收來自基板的光束反射。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A polishing apparatus has a polishing station, a notch finding station, and a substrate handling system to move a substrate therebetween. The notch finding station includes a housing having an internal volume that provides forms a reservoir with a floor, a ceiling, and first sidewalls that extend from the floor to the ceiling. An aperture extends through the ceiling of the reservoir and a side-passage extends laterally from a region of the reservoir below the aperture to an entry port such that a liquid injected through the entry port flows emerges from the aperture to form a liquid column. An optical fiber extends through a floor of the reservoir and is positioned to direct a light beam through the aperture and through the liquid column onto a substrate when held at the notch finding station and to receive reflections of the light beam from the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">110:拋光站</p>
        <p type="p">120:平臺</p>
        <p type="p">140:承載頭</p>
        <p type="p">142:扣環</p>
        <p type="p">146:膜</p>
        <p type="p">150:支撐結構</p>
        <p type="p">152:軸</p>
        <p type="p">154:驅動軸</p>
        <p type="p">156:馬達</p>
        <p type="p">200:凹槽尋找站</p>
        <p type="p">224:感測區域</p>
        <p type="p">240:光學板或框架</p>
        <p type="p">242:致動器</p>
        <p type="p">302:外殼</p>
        <p type="p">304:地板</p>
        <p type="p">306:側壁</p>
        <p type="p">308:儲庫</p>
        <p type="p">310:通道</p>
        <p type="p">312:上部</p>
        <p type="p">314:下部</p>
        <p type="p">316:上邊緣/第二側壁</p>
        <p type="p">320:液體柱</p>
        <p type="p">340:距離</p>
        <p type="p">350:控制器</p>
        <p type="p">360:液體源</p>
        <p type="p">410:光束</p>
        <p type="p">420:光纖</p>
        <p type="p">430:透鏡</p>
        <p type="p">432:致動器</p>
        <p type="p">440:組件</p>
        <p type="p">440a:光源</p>
        <p type="p">440b:偵測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="767px" img-content="tif" inline="yes" orientation="portrait" width="995px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623055</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129629</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01J37/32</main-classification>
        <further-classification edition="200601120260225B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商先驅能源工業公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED ENERGY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞拉斯蘭　法利赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALSKRAN, FALEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/794,876</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>偏壓電源中的脈衝模式控制</chinese-title>
        <english-title>PULSE-MODE CONTROL IN A BIAS SUPPLY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容揭示偏壓電源及偏壓控制方法。一種方法包含：在導通脈衝期間，使用與DC電壓配合之切換來施加波形；在截止脈衝期間移除該DC電壓，同時使電流循環；在另一導通脈衝之前重新施加該DC電壓；以及在重新施加該DC電壓之後起始該切換，以在另一導通脈衝期間重新施加該波形。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Bias supplies and bias control methods are disclosed. One method comprises applying, during an ON pulse, a waveform using switching in connection with a DC voltage, removing the DC voltage while circulating current during an OFF pulse, reapplying he DC voltage, in advance of another ON pulse, and initiating the switching after reapplying the DC voltage to reapply the waveform during another ON pulse.</p>
      </isu-abst>
      <representative-img>
        <p type="p">208:偏壓電源</p>
        <p type="p">210:第一節點</p>
        <p type="p">211:第二節點</p>
        <p type="p">212:第三節點</p>
        <p type="p">213:第一電感器</p>
        <p type="p">214:第二電感器</p>
        <p type="p">216:電源供應器</p>
        <p type="p">220:開關</p>
        <p type="p">221:二極體</p>
        <p type="p">224:外殼</p>
        <p type="p">226:緩衝電容器</p>
        <p type="p">227:電阻器</p>
        <p type="p">230:控制器</p>
        <p type="p">232:偏壓控制部分</p>
        <p type="p">234:脈衝模式控制模組</p>
        <p type="p">236:訊號</p>
        <p type="p">238:訊號</p>
        <p type="p">240:閘極驅動訊號</p>
        <p type="p">Ib:電感器電流</p>
        <p type="p">I&lt;sub&gt;out&lt;/sub&gt;:輸出電流</p>
        <p type="p">S:訊號</p>
        <p type="p">Sync_in:同步訊號</p>
        <p type="p">Sync_out:同步訊號</p>
        <p type="p">V&lt;sub&gt;210&lt;/sub&gt;:週期性電壓波形/輸出電壓</p>
        <p type="p">V&lt;sub&gt;210_control&lt;/sub&gt;:訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="601px" img-content="tif" inline="yes" orientation="portrait" width="681px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623579</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129641</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="200601120260302B">B25J5/02</further-classification>
        <further-classification edition="200601120260302B">B25J9/06</further-classification>
        <further-classification edition="200601120260302B">B25J9/10</further-classification>
        <further-classification edition="200601120260302B">B25J11/00</further-classification>
        <further-classification edition="200601120260302B">B25J15/00</further-classification>
        <further-classification edition="200601120260302B">B25J18/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商布魯克斯自動機械美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格西諾　胡斯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRACIANO, JUSTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,432</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>裝載埠晶圓突出裝置、包含此裝置之裝載埠及用於此裝置之方法</chinese-title>
        <english-title>LOAD PORT WAFER PROTRUSION APPARATUS, LOAD PORT INCLUDING THE APPARATUS AND METHOD THEREFOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">工件運輸裝置包括：框架；桅桿，可旋轉地耦合於框架；以及二或更多個運輸臂，可移動地耦合於桅桿以沿著桅桿進行往復移動。設置了驅動區段，耦合於二或更多個運輸埠臂中的每一者且建構成沿著桅桿來移動二或更多個運輸埠臂中的每一者而獨立於每一其他運輸臂沿著桅桿的移動，其中二或更多個運輸臂中之一者的末端執行器被預先定位而以沿著桅桿運動的二或更多個運輸臂中之另一者的另一末端執行器來進行半導體晶圓拾取或放置操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A workpiece transport apparatus includes a frame, a mast rotatably coupled to the frame, and two or more transport arms movably coupled to the mast for reciprocating movement along the mast. A drive section is provided and is coupled to and configured to move each of the two or more transport port arms along the mast independent of movement of each other transport arm along the mast, where an end effector of one of the two or more transport arms is pre-positioned for a semiconductor wafer pick or place operation with another end effector of another of the two or more transport arms in motion along the mast.</p>
      </isu-abst>
      <representative-img>
        <p type="p">108:工件運輸裝置</p>
        <p type="p">199:控制器</p>
        <p type="p">250:驅動區段</p>
        <p type="p">298,298A,298B:方向</p>
        <p type="p">310:升降機立柱或桅桿</p>
        <p type="p">321:第一機器手臂</p>
        <p type="p">322:第二機器手臂</p>
        <p type="p">350A,350B:滑動體</p>
        <p type="p">351A:第一末端執行器、基板固持器</p>
        <p type="p">351B:第二末端執行器、基板固持器</p>
        <p type="p">370:基座</p>
        <p type="p">ALTA:鉸接式連桿臂</p>
        <p type="p">ED1,ED2:末端執行器驅動器</p>
        <p type="p">ELV1:第一升降機</p>
        <p type="p">ELV2:第二升降機</p>
        <p type="p">R:共同方向</p>
        <p type="p">R1,R2:延伸和撤回方向、延伸和撤回軸線</p>
        <p type="p">VD:垂直距離或節距</p>
        <p type="p">Z1:第一馬達、Z軸驅動器</p>
        <p type="p">Z2:第二馬達、Z軸驅動器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="925px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622234</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129674</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/11</main-classification>
        <further-classification edition="200601120260302B">C12N15/10</further-classification>
        <further-classification edition="201801120260302B">C12Q1/6806</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商生物狀態人工智慧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOSTATE AI, INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高皮納斯　艾許溫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOPINATH, ASHWIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後補　後補</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DAVID YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,268</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>過量RNA消耗探針用於反轉錄製備高價值cDNA</chinese-title>
        <english-title>EXCESS RNA DEPLETION PROBES FOR HIGH-VALUE CDNA PREPARATION WITH REVERSE TRANSCRIPTION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於自總RNA之試樣製備cDNA之系統/套組及方法，其中透過DNA寡核苷酸探針之競爭性結合來阻止隨機反向引物之結合及/或延伸之反轉錄，從而消耗cDNA產物中過量RNA物質(諸如rRNA及tRNA)。此方法使得能夠對從該cDNA製備之庫進行下游高通量定序以有效地分析RNA表現，而不會因過量RNA物質佔據過多讀段而顯著降低準確度。與用於消耗過量RNA之其他方式(諸如基於RNAse H系統之彼等)相比，本文所提供之系統及方法既不需要除反轉錄酶外之其他酶，亦不需要在反轉錄之前進行額外純化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are systems/kits and methods for the preparation of cDNA from a sample of total RNA, in which excess RNA species such as rRNA and tRNA are depleted from the cDNA products via prevention of reverse transcription through competitive binding of DNA oligonucleotide probes that prevent binding and/or extension of randomer reverse primers. This process allows downstream high-throughput sequencing on a library prepared from the cDNA to efficiently profile RNA expression without significant loss of accuracy due to excess RNA species occupying too many reads. Compared to other approaches for excess RNA depletion, such as those based on RNAse H systems, the systems and methods provided herein neither require additional enzymes beyond reverse transcriptase, nor extra purification before reverse transcription.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="801px" img-content="tif" inline="yes" orientation="portrait" width="939px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621737</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129678</doc-number>
          <kind></kind>
          <date>114/08/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/395</main-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商默沙東有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK SHARP &amp; DOHME LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一三共股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIICHI SANKYO COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴爾　埃利亞夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARR, ELIAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格拉姆扎　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAMZA, ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOW, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡蘭扎　瓦西里基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARANTZA, VASSILIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>內夫　托比亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEFF, TOBIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃爾　奧斯塔　哈茲姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EL OSTA, HAZEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳建宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JIAN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>傅瑞斯瓦特　友子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRESHWATER, TOMOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, MIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維迪亞　索尼婭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAIDYA, SONIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索瑪維拉　羅伯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOMMAVILLA, ROBERTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　迦勒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CALEB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,529</doc-number>
          <date>20240805</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/742,386</doc-number>
          <date>20250106</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療癌症之組合</chinese-title>
        <english-title>COMBINATIONS FOR THE TREATMENT OF CANCER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個態樣中，本文提供使用包含抗人類B7-H3抗體-藥物偶聯物及DLL3靶向三特異性蛋白之組合療法治療癌症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one aspect, provided herein are methods of treating cancer with a combination therapy comprising an anti-human B7-H3 antibody-drug conjugate and a DLL3 targeting trispecific protein.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="919px" img-content="tif" inline="yes" orientation="portrait" width="614px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623056</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129684</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01J37/32</main-classification>
        <further-classification edition="200601120260225B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許松惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERR, SONGWHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,294</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理設備以及判定用於基板處理設備之電漿控制系統中之阻抗匹配區域之方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS AND METHOD OF DETERMINING IMPEDANCE MATCHING AREA IN PLASMA CONTROL SYSTEM FOR SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種具有電漿控制能力之基板處理設備。該設備包含一射頻(RF)源、一電漿腔室以及一電漿控制系統，該電漿控制系統包含：一阻抗匹配網路，其包含一第一可變阻抗匹配裝置及一第二可變阻抗匹配裝置；以及一控制電路，其經組態以：判定該第一可變阻抗匹配裝置之一第一參數及該第二可變阻抗匹配裝置之一第二參數，以及經反射回至該RF源的一經反射RF功率值(P&lt;sub&gt;r&lt;/sub&gt;)；判定一匹配點(MP)，其中該P&lt;sub&gt;r&lt;/sub&gt;為一特定值(P&lt;sub&gt;0&lt;/sub&gt;)；基於該MP判定複數個匹配邊緣點，該等匹配邊緣點表示比P&lt;sub&gt;0&lt;/sub&gt;大一預定餘量(P&lt;sub&gt;M&lt;/sub&gt;)之一邊緣RF功率值(P&lt;sub&gt;E&lt;/sub&gt;)，其中P&lt;sub&gt;E&lt;/sub&gt; = P&lt;sub&gt;0&lt;/sub&gt; + P&lt;sub&gt;M&lt;/sub&gt;；並且判定一阻抗匹配區域之一大小及一中心位置中的至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate processing apparatus with plasma control capabilities is disclosed. The apparatus comprises, a radio frequency (RF) source, a plasma chamber, and a plasma control system comprising: an impedance matching network comprising a first variable impedance matching device and a second variable impedance matching device; and a control circuit configured to: determine a first parameter of the first variable impedance matching device and a second parameter of the second variable impedance matching device, and a reflected RF power value (P&lt;sub&gt;r&lt;/sub&gt;) reflected back to the RF source, determine a matching point (MP) where the P&lt;sub&gt;r&lt;/sub&gt; is a specific value (P&lt;sub&gt;0&lt;/sub&gt;), determine a plurality of matching edge points representing an edge RF power value (P&lt;sub&gt;E&lt;/sub&gt;) that is greater than P&lt;sub&gt;0&lt;/sub&gt; by a predetermined margin (P&lt;sub&gt;M&lt;/sub&gt;) based on the MP, wherein P&lt;sub&gt;E&lt;/sub&gt; = P&lt;sub&gt;0&lt;/sub&gt; + P&lt;sub&gt;M&lt;/sub&gt;, and determine at least one of a size and a center location of an impedance matching area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">C1:第一參數</p>
        <p type="p">C2:第二參數</p>
        <p type="p">Z1:電漿腔室阻抗/阻抗值</p>
        <p type="p">Z2:匹配器-電漿腔室阻抗/阻抗值</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="647px" img-content="tif" inline="yes" orientation="portrait" width="650px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623032</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129709</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01J37/26</main-classification>
        <further-classification edition="200601120260224B">G06T5/50</further-classification>
        <further-classification edition="201701120260224B">G06T7/00</further-classification>
        <further-classification edition="201701120260224B">G06T7/30</further-classification>
        <further-classification edition="201701120260224B">G06T7/68</further-classification>
        <further-classification edition="202301120260224B">G06N3/045</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉真詹　萊霍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAJENDRAN, RAHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈亞迪凡　維傑　索塔席</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAYADEVAN, VIJAI THOTTATHIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉凡法　莫哈瑪卓拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAVANFAR, MOHAMMADREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
              <english-address>IR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方浩任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, HAWREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, HUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,174</doc-number>
          <date>20240805</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/285,837</doc-number>
          <date>20250730</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於掃描電子顯微鏡(SEM)至設計之影像對位的對稱循環生成對抗網路(CycleGAN)</chinese-title>
        <english-title>SYMMETRIC CYCLEGAN FOR SEM-TO-DESIGN IMAGE REGISTRATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用一對稱CycleGAN自一設計影像產生一半導體裝置結構之一合成影像。該對稱CycleGAN包含學習一設計影像域與一工件影像域之間之雙向映射的一神經網路架構。將該合成影像對準至該工件上對應於該合成影像之該裝置結構之一工件影像(例如，一SEM影像)，藉此產生一經對準影像。該對準係藉由由該對稱CycleGAN執行之域轉譯提供。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A synthetic image of a semiconductor device structure is generated from a design image using a symmetric CycleGAN. The symmetric CycleGAN includes a neural network architecture that learns bidirectional mappings between a design image domain and a workpiece image domain. The synthetic image is aligned to a workpiece image (e.g., a SEM image) of the device structure on the workpiece corresponding to the synthetic image thereby generating an aligned image. The aligning is provided by domain translation performed by the symmetric CycleGAN.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10109.JPG" file="ed10109.JPG" height="545px" img-content="tif" inline="yes" orientation="portrait" width="937px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623667</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129739</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/63</main-classification>
        <further-classification edition="202601120260302B">H10W70/692</further-classification>
        <further-classification edition="200601120260302B">H05K1/11</further-classification>
        <further-classification edition="200601120260302B">H05K1/14</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉持悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAMOCHI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-129011</doc-number>
          <date>20240805</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-129020</doc-number>
          <date>20240805</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>日本</country>
          <doc-number>2024-130662</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>貫通電極基板、附有元件貫通電極基板、連接基板及半導體裝置</chinese-title>
        <english-title>THROUGH ELECTRODE SUBSTRATE, THROUGH ELECTRODE SUBSTRATE PROVIDED WITH ELEMENT, CONNECTION SUBSTRATE AND SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係提供關於連接至配線基板的貫通電極基板，具有：具有第1面以及對向於上述第1面的第2面、並具有第1貫通孔的玻璃基板；配置於上述玻璃基板的上述第1貫通孔內的貫通電極；配置於上述玻璃基板的上述第1面側、並具有複數絕緣層的多層絕緣層；以及配置於上述各絕緣層之間、並電性連接至上述貫通電極的導電層；以上述多層絕緣層的剪切彈性率為G1(GPa)，以上述配線基板與上述玻璃基板之間的應變量差異為γ1(mm)，以上述多層絕緣層的總厚度為h1(mm)時，上述剪切彈性率G1為0.036GPa以上，並且由以下(式1-1)計算出的應力F1&lt;sub&gt;A&lt;/sub&gt;為4.35GPa以下的貫通電極基板。  &lt;br/&gt;&lt;img align="absmiddle" height="33px" width="372px" file="ed10065.JPG" alt="ed10065.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides &lt;br/&gt; a through electrode substrate connected to a wiring substrate, the through electrode substrate comprising: &lt;br/&gt; a glass substrate including a first surface and a second surface facing the first surface, and including a first through hole; &lt;br/&gt; a through electrode disposed in the first through hole of the glass substrate; &lt;br/&gt; a multi-layer insulating layer disposed on a first surface side of the glass substrate, and including a plurality of insulating layers; and &lt;br/&gt; a conductive layer disposed between each of the insulating layers, and electrically connected to the through electrode, wherein &lt;br/&gt; regarding a shearing elastic modulus of the multi-layer insulating layer as G1 (GPa), a distortion difference between the wiring substrate and the glass substrate as γ1 (mm), and a total thickness of the multi-layer insulating layer as h1 (mm),the shearing elastic modulus G1 is 0.036 GPa or more; and &lt;br/&gt; a force F1&lt;sub&gt;A&lt;/sub&gt; calculated from the following (formula 1-1) is 4.35 GPa or less: &lt;br/&gt; F1&lt;sub&gt;A&lt;/sub&gt; = (G1 × γ1)/h1 (formula 1-1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:貫通電極基板</p>
        <p type="p">2:玻璃基板</p>
        <p type="p">2a:玻璃基板的第1面</p>
        <p type="p">2b:玻璃基板的第2面</p>
        <p type="p">2c:第1貫通孔</p>
        <p type="p">3:貫通電極</p>
        <p type="p">4:多層絕緣層</p>
        <p type="p">4a:第1絕緣層</p>
        <p type="p">5:第1導電層</p>
        <p type="p">6:第1導通孔</p>
        <p type="p">7:第2導通孔</p>
        <p type="p">11:配線基板連接用墊部</p>
        <p type="p">12:阻焊層</p>
        <p type="p">14a:第2絕緣層</p>
        <p type="p">15:第2導電層</p>
        <p type="p">16:第3導通孔</p>
        <p type="p">17:第4導通孔</p>
        <p type="p">21:元件連接用墊部</p>
        <p type="p">41:第1被覆絕緣層</p>
        <p type="p">41c:第2貫通孔</p>
        <p type="p">141:第2被覆絕緣層</p>
        <p type="p">141c:第4貫通孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10066.JPG" file="ed10066.JPG" height="607px" img-content="tif" inline="yes" orientation="portrait" width="645px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622553</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129741</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">G02B5/30</main-classification>
        <further-classification edition="202301120260225B">H10K59/10</further-classification>
        <further-classification edition="202301120260225B">H10K50/86</further-classification>
        <further-classification edition="200601120260225B">G02B27/02</further-classification>
        <further-classification edition="201901120260225B">B32B7/023</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-133304</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學積層體之組合件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即便在嚴酷環境下光學特性仍穩定之可用於顯示系統的光學積層體。&lt;br/&gt;  本發明實施形態之光學積層體之組合件，係第1光學積層體與第2光學積層體之組合件；該第1光學積層體在65℃/90%之環境下放置500小時後之面內相位差(590)之變化(相位差變化XD)與該第2光學積層體在65℃/90%之環境下放置500小時後之面內相位差(590)之變化(相位差變化XL)滿足｜XD-XL｜≦3nm之關係。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:顯示系統</p>
        <p type="p">4:透鏡部</p>
        <p type="p">10:偏光構件</p>
        <p type="p">12:顯示元件</p>
        <p type="p">12':顯示面</p>
        <p type="p">14:反射型偏光構件</p>
        <p type="p">16:第一透鏡部</p>
        <p type="p">18:半反射鏡</p>
        <p type="p">20:第一相位差構件</p>
        <p type="p">22:第二相位差構件</p>
        <p type="p">24:第二透鏡部</p>
        <p type="p">26:使用者之眼睛</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="370px" img-content="tif" inline="yes" orientation="portrait" width="581px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623593</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129742</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/72</main-classification>
        <further-classification edition="200601120260302B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商巴川集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMOEGAWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒島純彌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARASHIMA, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134830</doc-number>
          <date>20240813</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>靜電夾頭、半導體製造裝置及電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種可抑制電極異常放電之靜電夾頭、半導體製造裝置及電漿處理裝置。靜電夾頭具備：基台(10)；載置構件(13)，其具備供載置被載置物之載置面(15)；及，第一導電層(11)，其配備於載置構件(13)之內部；其中，由基台(10)構成之第二導電層(12)或配備於基台(10)與第一導電層(11)之間之第二導電層(12)係與第一導電層(11)一起沿著載置面(15)配置；對載置面(15)俯視下，第二導電層(12)係包著第一導電層(11)並與其相互疊合，並且，第二導電層(12)包含不與第一導電層(11)相互疊合之區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623415</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129749</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/83</main-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
        <further-classification edition="202501120260302B">H10D84/83</further-classification>
        <further-classification edition="202501120260302B">H10D84/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿蘿拉　希瑪尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARORA, HIMANI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張子辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托勒　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOLLE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任　河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, HE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康拉德　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONRAD, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋爾　拉曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAIRE, RAMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
              <english-address>NP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,386</doc-number>
          <date>20240805</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/679,444</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用碳摻雜和層狀中間介電隔離之完全應變和無缺陷CFET超晶格的磊晶生長</chinese-title>
        <english-title>EPITAXIAL GROWTH OF FULLY-STRAINED AND DEFECT-FREE CFET SUPERLATTICES USING CARBON DOPING AND LAYERED MIDDLE DIELECTRIC ISOLATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露的實施例涉及電子元件製造領域，特別是多層磊晶堆疊，例如互補型場效電晶體（cFET）。使用一方法來製造層狀中間介電隔離（MDI）結構並在cFET中對磊晶生長的矽鍺層一起進行碳摻雜。在某些實施例中，通過將層狀MDI結構與矽鍺層的碳摻雜整合併入cFET中，相較於傳統堆疊，堆疊中的鬆弛、晶圓彎曲和缺陷有顯著降低。有利的是，與傳統堆疊相比，多層磊晶堆疊包含更多的矽通道（例如，pMOS和nMOS通道）。此外，下游製程中的選擇性提高了一個數量級。因此，具有高深寬比的溝槽分隔特徵，使每個特徵包含多層磊晶堆疊，該堆疊包含位於上下FET模組之間的MDI膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure relate to the field of electronic device manufacturing, and in particular, to multi-layered epitaxial stacks, such as complementary field-effect-transistors (cFETs). A method is used to fabricate a layered middle dielectric isolation (MDI) structure and carbon-doping of epitaxially grown silicon germanium layers together in the cFETs. In some embodiments, by integrating the layered MDI structure together with carbon-doping of SiGe layers into the cFETs, relaxation, wafer bow, and defects in a stack have been significantly reduced when compared to traditional stacks. Advantageously, multi-layered epitaxial stacks incorporate a greater number of silicon channels (e.g., pMOS and nMOS channels) when compared to traditional stacks. Furthermore, the selectivity in the downstream processes is improved by an order of magnitude. As such, trenches with high aspect ratio separate features, such that each feature includes the multi-layered epitaxial stack containing the MDI film disposed between the top and bottom FET modules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工件</p>
        <p type="p">102:基板</p>
        <p type="p">110:底部FET模組</p>
        <p type="p">112a:第一矽鍺層</p>
        <p type="p">112b:第一矽鍺層</p>
        <p type="p">112c:第一矽鍺層</p>
        <p type="p">114a:矽通道層</p>
        <p type="p">114b:矽通道層</p>
        <p type="p">120:MDI膜</p>
        <p type="p">122a:底部矽磊晶層</p>
        <p type="p">122b:頂部矽磊晶層</p>
        <p type="p">124a:第二矽鍺層</p>
        <p type="p">124b:第二矽鍺層</p>
        <p type="p">124c:第二矽鍺層</p>
        <p type="p">126a:第一矽鍺層</p>
        <p type="p">126b:第一矽鍺層</p>
        <p type="p">130:上部FET模組</p>
        <p type="p">132a:第一矽鍺層</p>
        <p type="p">132b:第一矽鍺層</p>
        <p type="p">134a:矽通道層</p>
        <p type="p">134b:矽通道層</p>
        <p type="p">140:多層磊晶堆疊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="563px" img-content="tif" inline="yes" orientation="portrait" width="509px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621852</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129753</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B24B55/00</main-classification>
        <further-classification edition="201201120260224B">B24B37/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅明濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, MINGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/111373</doc-number>
          <date>20240812</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>壓板液滴污染減少裝置</chinese-title>
        <english-title>PLATEN DROPLET CONTAMINATION REDUCTION APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供用於一種研磨半導體基板的方法和裝置。在一個實施例中，提供了一種用於研磨半導體基板的研磨系統。該研磨系統包括研磨墊組件和載體頭組件。該載體頭組件位於研磨墊組件之上，且包括主體，其下表面面向研磨墊組件，並有軸將載體與主體連接，該軸穿過下表面，下表面面向載體和研磨墊組件，並在下表面上設置有液滴減少系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus for polishing a semiconductor substrate are provided. In one embodiment a polishing system for polishing a semiconductor substrate is provided. The polishing system includes a polishing pad assembly and a carrier head assembly. The is carrier head assembly disposed over the polishing pad assembly and includes a body having a lower surface facing the polishing pad assembly, a shaft coupling a carrier to the body, the shaft disposed through the lower surface, the lower surface facing the carrier and the polishing pad assembly, and a droplet reduction system disposed on the lower surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105:液滴減少系統</p>
        <p type="p">106:蓋</p>
        <p type="p">108:泵</p>
        <p type="p">109:孔</p>
        <p type="p">110:腔體</p>
        <p type="p">113a:第一區域</p>
        <p type="p">113b:第二區域</p>
        <p type="p">115:親水性材料</p>
        <p type="p">A1:載體軸</p>
        <p type="p">T1:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="528px" img-content="tif" inline="yes" orientation="portrait" width="711px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623668</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129766</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/63</main-classification>
        <further-classification edition="202601120260302B">H10W70/692</further-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
        <further-classification edition="200601120260302B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>倉持悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAMOCHI, SATORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-129224</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>配線基板及其製造方法、以及半導體封裝</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之摘要係配線基板，係具備核心基板，其包含第1面、位於第1面之相反側之第2面、以及從第1面朝第2面貫通之複數貫通孔，並具備玻璃製之核心層；複數貫通電極，係位於複數貫通孔之各者；第1再配線層，係位於第1面；以及第2再配線層，係位於第2面。第1再配線層及第2再配線層，係皆具備在厚度方向層積之複數絕緣層、以及包含貫通絕緣層之貫通部與位於絕緣層之表面之配線或銲墊之導電部。第1再配線層及第2再配線層，係皆具備包含複數絕緣層之中之至少1個絕緣層之低膨脹部。第1再配線層之低膨脹部之絕緣層、以及第2再配線層之低膨脹部之絕緣層，係皆包含玻璃纖維製之纖維構件、與含浸於纖維構件之樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:配線基板</p>
        <p type="p">12:核心基板</p>
        <p type="p">13:核心層</p>
        <p type="p">15:貫通孔</p>
        <p type="p">16:壁面</p>
        <p type="p">20:貫通電極</p>
        <p type="p">30:第1再配線層</p>
        <p type="p">31:絕緣層</p>
        <p type="p">32:導電部</p>
        <p type="p">40:第2再配線層</p>
        <p type="p">41:絕緣層</p>
        <p type="p">42:導電部</p>
        <p type="p">121:第1面</p>
        <p type="p">122:第2面</p>
        <p type="p">301:內面</p>
        <p type="p">302:外面</p>
        <p type="p">321:貫通部</p>
        <p type="p">322:配線</p>
        <p type="p">323:銲墊</p>
        <p type="p">401:內面</p>
        <p type="p">402:外面</p>
        <p type="p">421:貫通部</p>
        <p type="p">422:配線</p>
        <p type="p">423:銲墊</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D3:第3方向</p>
        <p type="p">T1:第1厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="707px" img-content="tif" inline="yes" orientation="portrait" width="626px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622238</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129775</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201001120260302B">C12N15/113</main-classification>
        <further-classification edition="200601120260302B">A61K31/7125</further-classification>
        <further-classification edition="200601120260302B">A61K47/36</further-classification>
        <further-classification edition="201701120260302B">A61K47/42</further-classification>
        <further-classification edition="200601120260302B">A61P21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本新藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON SHINYAKU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村有輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎開智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, KAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-128900</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含磷醯二胺嗎啉代寡聚物(PMO)及聚陰離子之PMO複合體</chinese-title>
        <english-title>PMO CONJUGATE COMPRISING PHOSPHORODIAMIDATE MORPHOLINO OLIGO MER (PMO) AND POLYANION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一個目的在於提供一種新穎的遞送磷醯二胺嗎啉代寡聚物(PMO)的方式。提供一種包含磷醯二胺嗎啉代寡聚物(PMO)及聚陰離子之PMO複合體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object is to provide a new means for delivering a phosphorodiamidate morpholino oligomer (PMO). A PMO conjugate comprising phosphorodiamidate morpholino oligomer (PMO) and a polyanion is provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622100</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129784</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K7/08</main-classification>
        <further-classification edition="200601120260302B">A61K38/10</further-classification>
        <further-classification edition="200601120260302B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商巴塞利亞阿爾斯維爾藥業國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BASILEA PHARMACEUTICA INTERNATIONAL AG, ALLSCHWIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇黎世大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITAT ZURICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布拉伯特　埃米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRABET, EMILE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邦扎爾　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BENGHEZAL, MOHAMMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屋伯特　格雷戈里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UPERT, GREGORY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榮格　法蘭西絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, FRANCOISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達科　卡洛琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D'ARCO, CAROLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施蒂格勒　莎拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STIEGELER, SARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24193117.9</doc-number>
          <date>20240806</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/679,696</doc-number>
          <date>20240806</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>歐洲專利局</country>
          <doc-number>25169131.7</doc-number>
          <date>20250408</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>抗微生物擬肽</chinese-title>
        <english-title>ANTIMICROBIAL PEPTIDOMIMETICS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於具有抗細菌活性，特別是針對革蘭氏陰性菌的擬肽。本發明之擬肽係通式 (&lt;b&gt;I&lt;/b&gt;) 之化合物，  &lt;br/&gt;P&lt;sup&gt;1&lt;/sup&gt;-P&lt;sup&gt;2&lt;/sup&gt;-P&lt;sup&gt;3&lt;/sup&gt;-P&lt;sup&gt;4&lt;/sup&gt;-P&lt;sup&gt;5&lt;/sup&gt;-P&lt;sup&gt;6&lt;/sup&gt;-P&lt;sup&gt;7&lt;/sup&gt;-P&lt;sup&gt;8&lt;/sup&gt;-P&lt;sup&gt;9&lt;/sup&gt;-P&lt;sup&gt;10&lt;/sup&gt;-P&lt;sup&gt;11&lt;/sup&gt;-P&lt;sup&gt;12&lt;/sup&gt;-P&lt;sup&gt;13&lt;/sup&gt;-P&lt;sup&gt;14&lt;/sup&gt;-P&lt;sup&gt;15&lt;/sup&gt;-P&lt;sup&gt;16&lt;/sup&gt;&lt;br/&gt;(&lt;b&gt;I&lt;/b&gt;)  &lt;br/&gt;及其鹽，特別是其藥學上可接受的鹽，如說明書和申請專利範圍中所述。本發明還關於該等擬肽用於治療或預防細菌感染和與細菌感染相關的疾病的治療用途，以及該等擬肽用於防腐或消毒食品、化妝品、藥物或其他含營養素的物質的非治療用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is directed to peptidomimetics having antibacterial activity, especially against Gram-negative bacteria. The peptidomimetics of the invention are compounds of the general formula (&lt;b&gt;I&lt;/b&gt;), &lt;br/&gt;P&lt;sup&gt;1&lt;/sup&gt;-P&lt;sup&gt;2&lt;/sup&gt;-P&lt;sup&gt;3&lt;/sup&gt;-P&lt;sup&gt;4&lt;/sup&gt;-P&lt;sup&gt;5&lt;/sup&gt;-P&lt;sup&gt;6&lt;/sup&gt;-P&lt;sup&gt;7&lt;/sup&gt;-P&lt;sup&gt;8&lt;/sup&gt;-P&lt;sup&gt;9&lt;/sup&gt;-P&lt;sup&gt;10&lt;/sup&gt;-P&lt;sup&gt;11&lt;/sup&gt;-P&lt;sup&gt;12&lt;/sup&gt;-P&lt;sup&gt;13&lt;/sup&gt;-P&lt;sup&gt;14&lt;/sup&gt;-P&lt;sup&gt;15&lt;/sup&gt;-P&lt;sup&gt;16&lt;/sup&gt;&lt;br/&gt;(&lt;b&gt;I&lt;/b&gt;) &lt;br/&gt;and salts thereof, in particular pharmaceutically acceptable salts thereof, as described in the description and in the claims. The invention is also directed to therapeutic uses of the peptidomimetics for the treatment or prevention of bacterial infections and diseases related to bacterial infections and to non-therapeutic uses of the peptidomimetics for preserving or disinfecting foodstuffs, cosmetics, medicaments or other nutrient-containing materials.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="440px" img-content="tif" inline="yes" orientation="portrait" width="674px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622501</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129799</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01N33/533</main-classification>
        <further-classification edition="201001120260302B">C12N5/0783</further-classification>
        <further-classification edition="202501120260302B">A61K40/11</further-classification>
        <further-classification edition="202501120260302B">A61K40/31</further-classification>
        <further-classification edition="202501120260302B">A61K40/42</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">A61P31/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商武田藥品工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA PHARMACEUTICAL COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡蘭迪卡　蘇克魯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARANDIKAR, SUKRUT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧蓋瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, GARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索巴納　南杜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOBHANA, NANDHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米斯拉　拉比</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MISHIRA, RABI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瓦伊迪亞　尚塔什里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAIDYA, SHANTASHRI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬希　普里揚卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOSHI, PRIYANKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,552</doc-number>
          <date>20240805</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>γδＴ細胞之適宜供體之鑑別</chinese-title>
        <english-title>IDENTIFICATION OF SUITABLE DONORS OF γδ T CELLS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案提供用於鑑別適於獲得Vδ1&lt;sup&gt;+&lt;/sup&gt;伽瑪德爾塔(γδ)T細胞群體之人類供體或供體血液樣品的方法，該方法包含藉由偵測表現CD27、CD127、CD73或其任何組合之細胞之存在來檢定該供體血液樣品中幼稚Vδ1&lt;sup&gt;+&lt;/sup&gt; γδ T細胞之存在。進一步提供自該適宜之供體血液樣品獲得之γδ T細胞群體及其使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides methods for identifying a human donor or a donor blood sample that is suitable for obtaining a population of Vδ1&lt;sup&gt;+&lt;/sup&gt; gamma delta (γδ) T cells, the method comprising assaying for the presence of naïve Vδ1&lt;sup&gt;+&lt;/sup&gt; γδ T cells in the donor blood sample by detecting the presence of cells that express CD27, CD127, CD73, or any combination thereof. Further provided are populations of γδ T cells obtained from the suitable donor blood sample and methods of using the same.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.JPG" file="ed10023.JPG" height="769px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622059</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129803</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/14</main-classification>
        <further-classification edition="200601120260302B">C07D413/14</further-classification>
        <further-classification edition="200601120260302B">C07D471/04</further-classification>
        <further-classification edition="200601120260302B">C07D487/04</further-classification>
        <further-classification edition="200601120260302B">C07D417/14</further-classification>
        <further-classification edition="200601120260302B">C07D405/14</further-classification>
        <further-classification edition="200601120260302B">C07D513/04</further-classification>
        <further-classification edition="200601120260302B">C07D471/08</further-classification>
        <further-classification edition="200601120260302B">C07D487/08</further-classification>
        <further-classification edition="200601120260302B">C07D491/08</further-classification>
        <further-classification edition="200601120260302B">A61K31/506</further-classification>
        <further-classification edition="200601120260302B">A61K31/497</further-classification>
        <further-classification edition="200601120260302B">A61K31/5377</further-classification>
        <further-classification edition="200601120260302B">A61K31/5386</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">A61P17/00</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商阿克思生物科學有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARCUS BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯爾濱　喬舒亞　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORBIN, JOSHUA R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>但鞠　桑迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DHANJU, SANDEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NP</english-country>
              <english-address>NP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛洛伊　肯妮　妮可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOLEY, CORINNE NICOLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛尼爾　傑瑞米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOURNIER, JEREMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡塔木里　帕德曼諾哈　Ｖ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATTAMURI, PADMANABHA V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樂曼倪　曼哲納司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMANI, MANJUNATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴勒提　曼摩漢　瑞迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LELETI, MANMOHAN REDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納瑞狄　普拉笛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAREDDY, PRADEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莎瑞菲　荷森　厄爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHARIF, EHESAN UL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯瑪氏　喬伊絲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS, JOICE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞達夫　莫妮卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YADAV, MONIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/680,550</doc-number>
          <date>20240807</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/688,773</doc-number>
          <date>20240829</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/755,602</doc-number>
          <date>20250207</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>美國</country>
          <doc-number>63/842,513</doc-number>
          <date>20250711</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>哌啶基脲化合物及其使用方法</chinese-title>
        <english-title>PIPERIDYLUREA COMPOUNDS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示具有式II之結構之化合物，及含有彼等化合物之組合物。本文亦闡述製備該等化合物之方法及使用該等化合物治療疾病、病症或疾患之方法。  &lt;br/&gt;&lt;img align="absmiddle" height="187px" width="593px" file="ed11755.JPG" alt="ed11755.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are compounds having a structure according to Formula II, and compositions containing those compounds. Methods of preparing the compounds, and methods of using the compounds for the treatment of diseases, disorders, or conditions are also described. &lt;br/&gt;&lt;img align="absmiddle" height="187px" width="643px" file="ed11756.JPG" alt="ed11756.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622674</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129847</doc-number>
          <kind></kind>
          <date>114/08/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120260225B">G05D1/648</main-classification>
        <further-classification edition="202401120260225B">G05D1/246</further-classification>
        <further-classification edition="202401120260225B">G05D1/43</further-classification>
        <further-classification edition="202401320260225B">G05D105/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110877776</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔設備的路徑規劃方法、系統、設備及儲存介質</chinese-title>
        <english-title>PATH PLANNING METHOD, SYSTEM, EQUIPMENT, AND STORAGE MEDIUM FOR CLEANING EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及自動清潔設備技術領域，提出一種清潔設備的路徑規劃方法、系統、設備及儲存介質，該方法包括：根據獲取的地圖資訊識別待行走範圍的第一邊界，並控制清潔設備在第一邊界內以沿邊模型行走；在清潔設備在第一邊界內以沿邊模型行走過程中，回應於第一邊界存在間斷，感知間斷對應的第一邊界外的未知區域；若未知區域符合預設條件，則控制清潔設備切至未知區域行走；當未知區域行走完全後，控制清潔設備切回第一邊界內繼續行走。本申請提供的方法能夠優先保證小區域的清潔效果，避免清潔設備受困於小區域或使小區域遺漏，既保證了清潔效果又提高了清潔效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application pertains to the technical field of automatic cleaning equipment and proposes a path planning method, system, equipment, and storage medium for cleaning equipment. The method comprises the following steps: identifying the first boundary of the area to be traversed based on acquired map information and controlling the cleaning equipment to move along the edge model within the first boundary; during the process of the cleaning equipment moving along the edge model within the first boundary, in response to the presence of discontinuities in the first boundary, sensing the unknown area outside the first boundary corresponding to the discontinuities; if the unknown area meets preset conditions, controlling the cleaning equipment to switch to and move within the unknown area; after the cleaning equipment has completely traversed the unknown area, controlling it to switch back and continue moving within the first boundary. The method provided in this application can prioritize ensuring the cleaning effectiveness in small areas, preventing the cleaning equipment from getting trapped in or missing small areas, thereby ensuring cleaning effectiveness while improving cleaning efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S140:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="589px" img-content="tif" inline="yes" orientation="portrait" width="747px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622817</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129875</doc-number>
          <kind></kind>
          <date>114/08/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120260226B">G06N20/20</main-classification>
        <further-classification edition="202301120260226B">G06N3/096</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席茲　史蒂芬　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEETS, STEVEN ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>路羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,347</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於生成製造程序模型的轉移式學習</chinese-title>
        <english-title>TRANSFER LEARNING FOR GENERATING FABRICATION PROCESS MODELS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供利用轉移式學習生成製造程序模型的技術。在一些實施例中，該技術可涉及確定與表示第一製造程序之第一模型相關的後驗分佈。該技術可進一步涉及識別與第一模型相關之待轉移的一或更多組件，其作為表示第二製造程序之第二模型的模型參數值。該技術可進一步涉及使用與第一模型相關之後驗分佈以及與第一模型相關之該所識別的一或更多組件來生成第二模型之模型參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques for utilizing transfer learning for generating fabrication process models are provided herein. In some embodiments, the techniques may involve determining a posterior distribution associated with a first model representing a first fabrication process. The techniques may further involve identifying one or more components associated with the first model to be transferred as a model parameter value for a second model representing a second fabrication process. The techniques may further involve generating model parameters for the second model using the posterior distribution associated with the first model and the identified one or more components associated with the first model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:程序</p>
        <p type="p">102:方塊</p>
        <p type="p">104:方塊</p>
        <p type="p">106:方塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="667px" img-content="tif" inline="yes" orientation="portrait" width="740px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622308</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129895</doc-number>
          <kind></kind>
          <date>114/08/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">D01F9/22</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川透</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中文彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, FUMIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>風間勇悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAZAMA, YUGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-133845</doc-number>
          <date>20240809</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-191684</doc-number>
          <date>20241031</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>日本</country>
          <doc-number>2024-208201</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>碳纖維束及其製造方法、預浸材暨碳纖維強化複合材料</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供股束強度與股束彈性模數均優異、且即使承受扭轉變形仍不易發生單纖維斷裂、操作性優異的碳纖維束及其製造方法。  &lt;br/&gt;本發明的碳纖維束，係由複數碳纖維構成的碳纖維束，股束彈性模數E為280GPa以上且400GPa以下，上述碳纖維的晶粒尺寸Lc為1.80nm以上且2.60nm以下，上述碳纖維的密度ρ為1.780g/cm&lt;sup&gt;3&lt;/sup&gt;以上且1.830g/cm&lt;sup&gt;3&lt;/sup&gt;以下，且密度ρ、晶粒尺寸Lc[nm]及股束彈性模數E滿足下式(1)及式(2)的關係：  &lt;br/&gt;1.860≦ρ+0.0333Lc≦1.895 ・・・(1)  &lt;br/&gt;6.67×10&lt;sup&gt;-5&lt;/sup&gt;×(E-207)&lt;sup&gt;2&lt;/sup&gt;+1.60≧Lc ・・・(2)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623588</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129909</doc-number>
          <kind></kind>
          <date>114/08/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/70</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　漢欽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, HANG KHIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾布德　穆托利布　穆罕默德　扎卡利亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABD MUTHOLIB, MOHAMAD ZAKARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/680,017</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>卡匣彈簧尺寸適配系統</chinese-title>
        <english-title>CASSETTE SPRING SIZE ADAPTING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於一基板容器之尺寸適配器，其包含能夠接合設置於該基板容器中之一卡匣彈簧之一接合特徵。該尺寸適配器進一步包含一卡匣接觸表面。該尺寸適配器可經構形使得該卡匣接觸表面定位於該基板容器之一內部空間內，使得該卡匣接觸表面可保持具有比該基板容器經構形以容納之一尺寸更小之一尺寸之一卡匣之一位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A size adapter for a substrate container includes an engagement feature capable of engaging a cassette spring provided in the substrate container. The size adapter further includes a cassette contact surface. The size adapter can be configured such that the cassette contact surface is positioned within an internal space of the substrate container such that the cassette contact surface can retain a position of a cassette that is of a size smaller than a size the substrate container is configured to accommodate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板容器</p>
        <p type="p">102:艙頂</p>
        <p type="p">104:卡匣彈簧</p>
        <p type="p">106:卡匣</p>
        <p type="p">108:艙門</p>
        <p type="p">110:尺寸適配器</p>
        <p type="p">112:卡匣彈簧接合特徵</p>
        <p type="p">114:卡匣接觸表面</p>
        <p type="p">116:支柱</p>
        <p type="p">118:基座</p>
        <p type="p">120:卡匣導件</p>
        <p type="p">Z1:距離</p>
        <p type="p">Z2:高度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="787px" img-content="tif" inline="yes" orientation="portrait" width="677px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622762</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129935</doc-number>
          <kind></kind>
          <date>114/08/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">G06F15/78</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商谷歌有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOOGLE LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙　英宰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, BENJAMIN YOUNGJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹洪日</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HONGIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　仁浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, INHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/680,043</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>利用輸入及輸出稀疏性進行記憶體中機器學習計算</chinese-title>
        <english-title>EXPLOITING INPUT AND OUTPUT SPARSITY FOR IN-MEMORY MACHINE-LEARNING COMPUTATIONS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了用於利用輸入及輸出稀疏性進行記憶體中機器學習計算的方法及系統，包括編碼在計算機可讀介質上之計算指令/程式。一種用於積體記憶體裝置之記憶體中處理(「PiM」)架構包括計算單元、耦合至各計算單元之共用佇列、縮減電路系統及共用資料路徑。該佇列儲存(i)沿共用資料路徑路由以用于由計算單元處理之輸入，及(ii)在計算單元處理該等輸入之後産生之輸出。各計算單元包括用于計算來自該等輸入的累加值之算術電路系統。該縮減電路系統基于對自計算單元接收到之累加值執行的縮減運算來產生該等輸出。使用將歸約電路系統耦合至共用佇列的共用資料路徑部分將該等輸出路由至該佇列以供儲存。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems, including computational instructions/programs encoded on computer-readable media, are described for exploiting input and output sparsity for in-memory machine-learning computations. A Processing-in-Memory (“PiM”) architecture for an integrated memory device includes compute units, a shared queue coupled to each compute unit, reduction circuitry, and a shared datapath. The queue stores (i) inputs that are routed along the shared datapath for processing by the compute units and (ii) outputs that are generated after the compute units process the inputs. Each compute unit includes arithmetic circuitry for computing accumulated values from the inputs. The reduction circuitry generates the outputs based on reduction operations performed on accumulated values received from the compute units. The outputs are routed to the queue for storage using a portion of the shared datapath that couples the reduction circuitry to the shared queue.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:系統單晶片</p>
        <p type="p">104:中央處理單元</p>
        <p type="p">108:資源管理器</p>
        <p type="p">110:IP/電路區塊</p>
        <p type="p">120:匯流排</p>
        <p type="p">122:記憶體裝置</p>
        <p type="p">200:PiM架構</p>
        <p type="p">202:PiM區塊</p>
        <p type="p">204-1:模式暫存器</p>
        <p type="p">204-2:模式暫存器</p>
        <p type="p">206:控制信號</p>
        <p type="p">206-1:處理單元</p>
        <p type="p">206-2:處理單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="1017px" img-content="tif" inline="yes" orientation="portrait" width="692px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621664</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129939</doc-number>
          <kind></kind>
          <date>109/10/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/04</main-classification>
        <further-classification edition="200601120260302B">A61K8/20</further-classification>
        <further-classification edition="200601120260302B">A61K8/49</further-classification>
        <further-classification edition="200601120260302B">A61K8/73</further-classification>
        <further-classification edition="200601120260302B">A61K8/81</further-classification>
        <further-classification edition="200601120260302B">A61K8/85</further-classification>
        <further-classification edition="200601120260302B">A61K8/86</further-classification>
        <further-classification edition="200601120260302B">A61L27/18</further-classification>
        <further-classification edition="200601120260302B">A61L27/20</further-classification>
        <further-classification edition="200601120260302B">A61L27/52</further-classification>
        <further-classification edition="200601120260302B">A61L27/54</further-classification>
        <further-classification edition="200601120260302B">A61L27/58</further-classification>
        <further-classification edition="200601120260302B">A61Q19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商葛德瑪控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALDERMA HOLDING SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩根　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORGAN, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪加柯娃　露比嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACAKOVA, LUBICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/926,935</doc-number>
          <date>20191028</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>即用型美容組成物</chinese-title>
        <english-title>READY-TO-USE ESTHETIC COMPOSITIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述即用型可注射組成物，其包含非動物來源之聚合物微球或微米粒子、包含水及纖維素衍生物膠凝劑之水凝膠、及聚山梨醇酯80。進一步描述使用該等即用型可注射組成物進行修復或整形手術、美容皮膚醫學、面部輪廓整形、身體輪廓整形及牙齦豐隆之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described are ready-to-use injectable compositions comprising polymeric microspheres or microparticles of non-animal origin, a hydrogel comprising water and a cellulose-derivative gelling agent, and polysorbate 80. Further described are methods of using the ready-to-use injectable compositions for reparative or plastic surgery, esthetic dermatology, facial contouring, body contouring, and gingival augmentation.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="621px" img-content="tif" inline="yes" orientation="portrait" width="935px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622036</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129956</doc-number>
          <kind></kind>
          <date>114/08/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C209/62</main-classification>
        <further-classification edition="200601120260302B">C07D261/04</further-classification>
        <further-classification edition="200601120260302B">A01N43/80</further-classification>
        <further-classification edition="200601120260302B">A01P7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商齊魯動物保健品有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QILU ANIMAL HEALTH PRODUCTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商齊魯製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QILU PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范傳文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHUANWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONG, MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冷傳新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LENG, CHUANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張永暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YONGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭秀麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, XIULI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫朋威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, PENGWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛餘傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, YUJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高藝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>房璽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, XI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李雙民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHUANGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110752342</doc-number>
          <date>20240807</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2025110443432</doc-number>
          <date>20250728</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>異噁唑啉類藥物中間體的製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種式(I)化合物酸式鹽的製備方法，藉由Boc酸酐保護、與卡賓試劑反應以及先後用鹼性試劑和酸性試劑脫保護反應制得，該方法收率較高，反應條件溫和，適合工業化生產。本發明還提供式(I)化合物作為中間體合成異噁唑啉類藥物的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10030.JPG" file="ed10030.JPG" height="420px" img-content="tif" inline="yes" orientation="portrait" width="594px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623474</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129960</doc-number>
          <kind></kind>
          <date>114/08/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260223B">H10H20/85</main-classification>
        <further-classification edition="202501120260223B">H10H20/855</further-classification>
        <further-classification edition="202501120260223B">H10H20/856</further-classification>
        <further-classification edition="202501120260223B">H10H20/857</further-classification>
        <further-classification edition="200601120260223B">G02B3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科銳ＬＥＤ公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CREELED, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇伊希　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUICH, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克萊爾　Ｆ　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLAIRE, F. JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　德里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLER, DEREK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布萊克利　科林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BLAKELY, COLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索科爾　約瑟夫　Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOKOL, JOSEPH G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威爾科克斯　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILCOX, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/806,014</doc-number>
          <date>20240815</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>發光二極體封裝件中的透鏡結構</chinese-title>
        <english-title>LENS STRUCTURES IN LIGHT-EMITTING DIODE PACKAGES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示發光二極體（LED）裝置，且更尤其揭示LED封裝件中之透鏡結構。透鏡結構包括用於實現LED封裝件中之各種發射圖案的複雜形狀。複雜透鏡形狀包括大於支撐元件之對應寬度的透鏡寬度，所述支撐元件包括引線框架結構或基座結構。複雜透鏡形狀進一步包括相對於下方LED晶片定位之向內凹陷，以用於導引峰值發射強度相對於LED封裝件而偏離中心。例示性LED封裝件進一步包括定位於透鏡與下方LED晶片之間的囊封層，以用於提供用於透鏡形成之經改良表面及經改良黏著性中之一或多者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Light-emitting diode (LED) devices and more particularly lens structures in LED packages are disclosed. Lens structures include complex shapes for achieving various emission patterns in LED packages. Complex lens shapes include lens widths that are greater than corresponding widths of support elements, including lead frame structures or submount structures. Complex lens shapes further include inward depressions positioned relative to underlying LED chips for directing peak emission intensities off center relative to LED packages. Exemplary LED packages further include encapsulant layers positioned between lenses and underlying LED chips for providing one or more of improved surfaces for lens formation and improved adhesion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:LED封裝件</p>
        <p type="p">12-1:引線</p>
        <p type="p">12-2:引線</p>
        <p type="p">14:殼體</p>
        <p type="p">14&lt;sub&gt;F&lt;/sub&gt;:凹部底面</p>
        <p type="p">14&lt;sub&gt;R&lt;/sub&gt;:凹部</p>
        <p type="p">14&lt;sub&gt;S&lt;/sub&gt;:凹部側壁</p>
        <p type="p">14&lt;sub&gt;T&lt;/sub&gt;:頂部表面</p>
        <p type="p">16:LED晶片</p>
        <p type="p">18:透鏡</p>
        <p type="p">18&lt;sub&gt;D&lt;/sub&gt;:凹陷</p>
        <p type="p">18&lt;sub&gt;S&lt;/sub&gt;:側壁</p>
        <p type="p">19:陽極墊</p>
        <p type="p">20:陰極墊</p>
        <p type="p">22:囊封層</p>
        <p type="p">22-1:第一子層</p>
        <p type="p">22-2:第二子層</p>
        <p type="p">22&lt;sub&gt;T&lt;/sub&gt;:頂部表面</p>
        <p type="p">W1:第一寬度</p>
        <p type="p">W2:第二寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="814px" img-content="tif" inline="yes" orientation="portrait" width="814px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623698</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114129962</doc-number>
          <kind></kind>
          <date>114/08/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/15</main-classification>
        <further-classification edition="202601120260302B">H10W76/42</further-classification>
        <further-classification edition="202601120260302B">H10W90/20</further-classification>
        <further-classification edition="202601120260302B">H05K1/18</further-classification>
        <further-classification edition="202601120260302B">H10D80/30</further-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泰宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, TAI-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈奕廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YIH-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李昱瑾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, YU-JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林秉燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PING-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鈞奕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/679,669</doc-number>
          <date>20240806</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/222,058</doc-number>
          <date>20250529</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝組件</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝組件包括：基板；設置於該基板上的中介層，其中該中介層具有中心區域和周邊區域，該周邊區域包括角落區域和非角落區域；第一晶片，設置於該中介層的該中心區域；第二晶片，設置於該第一晶片旁並位於該中介層的該周邊區域的該非角落區域；以及虛擬晶片結構，設置於該第一晶片和該第二晶片旁並位於該中介層的該周邊區域的該角落區域，其中該虛擬晶片結構包括在第一方向上彼此堆疊的多個虛擬晶片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package assembly, comprising: a substrate; an interposer disposed on the substrate, wherein the interposer comprises a central region and a peripheral region, wherein the peripheral region further comprises a corner region and a non-corner region; a first die disposed on the interposer in the central region; a second die disposed beside the first die and located in the non-corner region of the peripheral region of the interposer; and a dummy die structure disposed beside the first die and the second die and located in the corner region of the peripheral region of the interposer, wherein the dummy die structure comprises dummy dies stacked on each other in a first direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">316:中介層</p>
        <p type="p">306A:虛擬晶片結構</p>
        <p type="p">200:基板</p>
        <p type="p">D2,D1,D3:方向</p>
        <p type="p">32:粘合層</p>
        <p type="p">322,307:導電結構</p>
        <p type="p">30AB:背面</p>
        <p type="p">TA:厚度</p>
        <p type="p">315:底部填充物</p>
        <p type="p">30AT:主動表面</p>
        <p type="p">312:模塑化合物</p>
        <p type="p">30A:虛擬晶片</p>
        <p type="p">310:粘合聚合物層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="535px" img-content="tif" inline="yes" orientation="portrait" width="615px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621753</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130004</doc-number>
          <kind></kind>
          <date>114/08/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">A61M37/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商丘比股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEWPIE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校法人早稻田大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WASEDA UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤川俊一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKAWA, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>会津貴大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIZU, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>笹倉瑛里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKURA, ERI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩瀬英治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASE, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺嶋真伍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERASHIMA, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-130199</doc-number>
          <date>20240806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>微針陣列及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種微針陣列，其係由具有光交聯基之光反應性玻尿酸之交聯體所形成之複數根微針排列於基板之表面而成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622577</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130008</doc-number>
          <kind></kind>
          <date>114/08/06</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120251229B">G02B9/62</main-classification>
        <further-classification edition="200601120251229B">G02B11/32</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曺聖日</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHO, SEONG IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林台淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, TAE YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金宇英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WOO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0172708</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">光學成像系統包括：第一透鏡群組，包括第一透鏡和第二透鏡，從物側沿第一光軸方向依序設置；第二透鏡群組，包括第三透鏡、第四透鏡、第五透鏡、以及第六透鏡，沿垂直於第一光軸方向的第二光軸方向依序設置；以及光路徑改變元件，設置於第一透鏡群組和第二透鏡群組之間，配置為將光的傳播方向從第一光軸方向改變為第二光軸方向，其中光學成像系統滿足條件表達式0.5 ≤ |f/f1|+|f/f2| ≤ 2.0，其中f為光學成像系統的焦距，f1為第一透鏡的焦距，以及f2為第二透鏡的焦距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens group including a first lens and a second lens, sequentially disposed in a first optical axis direction from an object side, a second lens group including a third lens, a fourth lens, a fifth lens, and a sixth lens, sequentially disposed in a second optical axis direction perpendicular to the first optical axis direction, and an optical path changing member disposed between the first lens group and the second lens group configured to change a propagation direction of light from the first optical axis direction to the second optical axis direction, in which the optical imaging system satisfies a conditional expression of 0.5 ≤ |f/f1|+|f/f2| ≤ 2.0, where f is a focal length of the optical imaging system, f1 is a focal length of the first lens, and f2 is a focal length of the second lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">F:濾光片</p>
        <p type="p">IP:成像平面</p>
        <p type="p">IS:影像感測器</p>
        <p type="p">LG1:第一透鏡群組</p>
        <p type="p">LG2:第二透鏡群組</p>
        <p type="p">P:光路改變元件</p>
        <p type="p">OA1:第一光軸</p>
        <p type="p">OA2:第二光軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="877px" img-content="tif" inline="yes" orientation="portrait" width="534px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622061</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130029</doc-number>
          <kind></kind>
          <date>114/08/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D403/06</main-classification>
        <further-classification edition="200601120260302B">C07D471/04</further-classification>
        <further-classification edition="200601120260302B">C07D487/04</further-classification>
        <further-classification edition="200601120260302B">C07D491/052</further-classification>
        <further-classification edition="200601120260302B">C07D498/10</further-classification>
        <further-classification edition="200601120260302B">C07D401/14</further-classification>
        <further-classification edition="200601120260302B">C07D487/10</further-classification>
        <further-classification edition="200601120260302B">C07D403/14</further-classification>
        <further-classification edition="200601120260302B">C07D405/14</further-classification>
        <further-classification edition="200601120260302B">C07D417/14</further-classification>
        <further-classification edition="200601120260302B">C07D495/04</further-classification>
        <further-classification edition="200601120260302B">C07D409/14</further-classification>
        <further-classification edition="200601120260302B">A61K31/437</further-classification>
        <further-classification edition="200601120260302B">A61K31/4196</further-classification>
        <further-classification edition="200601120260302B">A61K31/4439</further-classification>
        <further-classification edition="200601120260302B">A61P13/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瑞太克醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RETEX PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇　振偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, ZHENWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　巍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙樹海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, SHUHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜佩佩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, PEIPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李洪斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, HONGBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王利莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪朱瑞　史蒂凡　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DJURIC, STEVAN W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/110085</doc-number>
          <date>20240806</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/687,902</doc-number>
          <date>20240828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>血管加壓素受體2調節劑及其使用方法</chinese-title>
        <english-title>VASOPRESSIN RECEPTOR 2 MODULATORS AND METHODS OF USE THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供例如式I化合物之化合物及其等在治療醫學疾病或病症(例如腎臟病症)中之用途。該等化合物經深思熟慮視為血管加壓素受體2 (vasopressin receptor 2；V2R)之調節劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides compounds, e.g., compounds of Formula I, and their use in treating medical diseases or disorders, for example, kidney disorders. The compounds are contemplated to be modulators of vasopressin receptor 2 (V2R).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621815</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130052</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260227B">B21D51/26</main-classification>
        <further-classification edition="200601120260227B">B65D1/16</further-classification>
        <further-classification edition="200601120260227B">B05D7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東洋製罐股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYO SEIKAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真能武俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MANOU, TAKETOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-135451</doc-number>
          <date>20240814</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>罐體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠抑制製造成本之罐體之製造方法。  &lt;br/&gt;罐體之製造方法係具備底部12及罐身部11之罐體之製造方法，包括：預成型罐形成步驟S1，其係形成底部12具有成為第一接地部15之環狀腳部13之預成型罐10；底部塗佈步驟S2，其係於預成型罐10之包含第一接地部15之第一接地部區域R1塗佈塗佈劑；以及無縫罐形成步驟S4，其係使預成型罐10之底部12再次變形，形成成為第二接地部15之環狀突出部21，從而具有凹陷部；且於底部塗佈步驟S2中，對預定成為包含第二接地部24之第二接地部區域R2之預定接地部區域亦塗佈塗佈劑來進行塗佈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:預成型罐形成步驟</p>
        <p type="p">S2:底部塗佈步驟</p>
        <p type="p">S3:塗裝步驟</p>
        <p type="p">S4:無縫罐形成步驟</p>
        <p type="p">S11:凹壓步驟</p>
        <p type="p">S12:預成型罐成型步驟</p>
        <p type="p">S13:修邊步驟</p>
        <p type="p">S14:清洗步驟</p>
        <p type="p">S31:印刷步驟</p>
        <p type="p">S32:內面塗裝步驟</p>
        <p type="p">S41:底部再成型步驟</p>
        <p type="p">S42:縮頸翻邊加工步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="803px" img-content="tif" inline="yes" orientation="portrait" width="558px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621566</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130064</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A21D8/04</main-classification>
        <further-classification edition="201701120260302B">A21D13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商敷島麵包製造股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASCO SHIKISHIMA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田志保</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, SHIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村友音</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TOMONE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西尾直人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIO, NAOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西崎陽介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIZAKI, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, DAIJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-130783</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>麵包類之製造方法、麵包製作性以及麵包類之品質之預測方法、以及將麵包類製造用湯種麵糰使用於麵包類之製造的方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種麵包類之製造方法，其特徵在於包含下列步驟：(a)製備湯種麵糰之步驟，係藉由將小麥麵粉與溫水混合來製備湯種麵糰、或藉由將小麥麵粉與水混合後進行加熱來製備湯種麵糰；(b)使用快速黏度分析儀來測定漿料的最終黏度及尖峰黏度之步驟，前述漿料係藉由於前述湯種麵糰的一部分中添加水而製作為懸浮液之方式所得到；以及(c)使用前述湯種麵糰來製備麵包麵糰之步驟；將前述最終黏度/前述尖峰黏度之值調節為0.9至1.5。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622033</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130065</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C43/12</main-classification>
        <further-classification edition="200601120260302B">C09K3/30</further-classification>
        <further-classification edition="200601120260302B">C09K5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鹽田英史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIOTA, HIDEFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川上貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAKAMI, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-133198</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>氫氟醚組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可抑制流動帶電且即便在150℃的高溫下仍具優異穩定性之氫氟醚組成物。本發明之氫氟醚組成物包含1,1,1,2,3,3-六氟-3-[2-(1,1,2,3,3,3-六氟丙氧基)乙氧基]丙烷及水，且水之含量為5~600質量ppm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623613</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130073</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P76/00</main-classification>
        <further-classification edition="200601120260302B">B29C59/02</further-classification>
        <further-classification edition="200601120260302B">B05C5/00</further-classification>
        <further-classification edition="200601120260302B">B05C11/10</further-classification>
        <further-classification edition="200601120260302B">B05C9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樹
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-143351</doc-number>
          <date>20240823</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-143352</doc-number>
          <date>20240823</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>平坦化系統，平坦化方法，及物件製造方法</chinese-title>
        <english-title>PLANARIZATION SYSTEM, PLANARIZATION METHOD, AND ARTICLE MANUFACTURING METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種平坦化系統，其包括一第一平坦化設備，其經組態以藉由使一覆層與配置在一基材上之一可硬化組成物的複數液滴接觸來形成一平坦化膜；一第二平坦化設備，其經組態以藉由一旋塗方法來形成一液體膜；及一熱處理設備，其經組態以履行一熱處理，以用於固化由該第二平坦化設備所形成之該液體膜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A planarization system includes a first planarization apparatus configured to form a planarization film by bringing a superstrate into contact with a plurality of droplets of a curable composition arranged on a substrate, a second planarization apparatus configured to form a liquid film by a spin coating method, and a heat treatment apparatus configured to perform a heat treatment for curing the liquid film formed by the second planarization apparatus.</p>
      </isu-abst>
      <representative-img>
        <p type="p">BK:熱處理設備</p>
        <p type="p">CNT:控制器</p>
        <p type="p">HPS1:平坦化系統</p>
        <p type="p">HR:機器人</p>
        <p type="p">JM:液滴配置設備</p>
        <p type="p">LD:載入設備</p>
        <p type="p">PA:預對準器</p>
        <p type="p">PS:第一平坦化設備</p>
        <p type="p">R1:第一區</p>
        <p type="p">R2:第二區</p>
        <p type="p">R3:第三區</p>
        <p type="p">R4:第四區</p>
        <p type="p">RS:中繼區段</p>
        <p type="p">SC:第二平坦化設備</p>
        <p type="p">TS:輸送機制</p>
        <p type="p">VC:黏合層形成設備</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="708px" img-content="tif" inline="yes" orientation="portrait" width="953px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623450</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130082</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260225B">H10D84/83</main-classification>
        <further-classification edition="202501120260225B">H10D30/43</further-classification>
        <further-classification edition="202501120260225B">H10D30/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芭帕　厄特卡爾施</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAJPAI, UTKARSH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩卡　德巴吉雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARKAR, DEBARGHYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　敬慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-TZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屋多墨　亨利　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UTOMO, HENRY K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ID</english-country>
              <english-address>ID</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/798,067</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有金屬源極/汲極接點之堆疊場效電晶體</chinese-title>
        <english-title>STACKED FET WITH METALLIC SOURCE/DRAIN CONTACT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其包括堆疊於一第二場效電晶體上之一第一場效電晶體。該第一場效電晶體具有一金屬源極/汲極區。藉由一中間介電隔離層使該第二場效電晶體之一第二源極/汲極區與該金屬源極/汲極區分離。一貫通接點穿過該中間介電隔離層以將該金屬源極/汲極區連接至該第二源極/汲極區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a first field effect transistor stacked on a second field effect transistor. The first field effect transistor has a metallic source/drain region. A second source/drain region of the second field effect transistor is separated from the metallic source/drain region by a middle dielectric isolation layer. A through contact passes through the middle dielectric isolation layer to connect the metallic source/drain region to the second source/drain region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:晶圓</p>
        <p type="p">102:閘極線</p>
        <p type="p">104:作用區線</p>
        <p type="p">105:插圖</p>
        <p type="p">106:基板</p>
        <p type="p">108:閘極介電層</p>
        <p type="p">114:通道</p>
        <p type="p">115:第一層級</p>
        <p type="p">116:底部閘極</p>
        <p type="p">122:源極/汲極區</p>
        <p type="p">124:源極/汲極區</p>
        <p type="p">130:介電層</p>
        <p type="p">140:內部間隔物</p>
        <p type="p">142:犧牲性預留位置</p>
        <p type="p">148:層間介電質(ILD)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="695px" img-content="tif" inline="yes" orientation="portrait" width="480px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622624</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130100</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260302B">G03F1/24</main-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田惇弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, ATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>棟安陸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUNEYASU, RIKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134298</doc-number>
          <date>20240809</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-087509</doc-number>
          <date>20250526</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>反射型空白光罩及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種反射型空白光罩及其製造方法，可以用更低價格且更高生產量來製造基準標記，提升檢測器的位置檢測精確度。  &lt;br/&gt;　　[解決手段]一種反射型空白光罩，其特徵係至少具備，基板；多層反射層，是設置在該基板上來反射曝光光；以及吸收體膜，是設置在該多層反射膜上來吸收前述曝光光；並具備基準標記，是形成在前述反射型空白光罩中與前述多層反射膜同一側的面上，當作檢測缺陷位置用的基準位置；至少具有兩組平行線段對，該平行線段對是由兩條互相平行之凹形狀或凸形狀的線條所構成，而前述基準標記就在前述兩組平行線段對之方向互相正交的位置上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本發明的反射型空白光罩</p>
        <p type="p">10:基板</p>
        <p type="p">20:多層反射膜</p>
        <p type="p">21:對EUV光折射率相對高的層(Si層)</p>
        <p type="p">22:對EUV光折射率相對低的層(Mo層或Ru層)</p>
        <p type="p">25:層積部(Si/Mo層積部或Si/Ru層積部)</p>
        <p type="p">30:吸收體膜</p>
        <p type="p">40:基準標記</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="297px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623614</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130112</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P76/00</main-classification>
        <further-classification edition="200601120260302B">B29C59/02</further-classification>
        <further-classification edition="200601120260302B">B05C5/00</further-classification>
        <further-classification edition="200601120260302B">B05C11/10</further-classification>
        <further-classification edition="200601120260302B">B05C9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤真樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-143353</doc-number>
          <date>20240823</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-143354</doc-number>
          <date>20240823</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>平坦化系統，平坦化方法，及物件製造方法</chinese-title>
        <english-title>PLANARIZATION SYSTEM, PLANARIZATION METHOD, AND ARTICLE MANUFACTURING METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種平坦化系統包括一旋塗器，其經組態以藉由一旋塗方法來在一基材上形成一液體膜；一熱處理設備，其經組態以履行一熱處理以用於硬化由該旋塗器所形成之該液體膜；一液滴配置設備，其經組態以在該基材上配置一可硬化組成物之複數液滴；一平坦化設備，其經組態以藉由使一覆層與藉由該液滴配置設備而配置在該基材上的該可硬化組成物之該等複數液滴接觸來形成一平坦化膜；及一輸送機制，其經組態以將該基材依此順序輸送至該旋塗器、該熱處理設備、該液滴配置設備、及該平坦化設備。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A planarization system includes a spin coater configured to form a liquid film on a substrate by a spin coating method, a heat treatment apparatus configured to perform a heat treatment for curing the liquid film formed by the spin coater, a droplet arrangement apparatus configured to arrange a plurality of droplets of a curable composition on the substrate, a planarization apparatus configured to form a planarization film by bringing a superstrate into contact with the plurality of droplets of the curable composition arranged on the substrate by the droplet arrangement apparatus, and a conveyance mechanism configured to convey the substrate to the spin coater, the heat treatment apparatus, the droplet arrangement apparatus, and the planarization apparatus in this order.</p>
      </isu-abst>
      <representative-img>
        <p type="p">BK:熱處理設備</p>
        <p type="p">CNT:控制器</p>
        <p type="p">HPS1:平坦化系統</p>
        <p type="p">HR:機器人</p>
        <p type="p">JM:液滴配置設備</p>
        <p type="p">LD:載入設備</p>
        <p type="p">PA:預對準器</p>
        <p type="p">PS:第一平坦化設備</p>
        <p type="p">R1:第一區</p>
        <p type="p">R2:第二區</p>
        <p type="p">R3:第三區</p>
        <p type="p">R4:第四區</p>
        <p type="p">RS:中繼區段</p>
        <p type="p">SC:第二平坦化設備</p>
        <p type="p">TS:輸送機制</p>
        <p type="p">VC:黏合層形成設備</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="682px" img-content="tif" inline="yes" orientation="portrait" width="970px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623528</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130116</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/00</main-classification>
        <further-classification edition="202601120260302B">H10P14/24</further-classification>
        <further-classification edition="200601120260302B">C23C16/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大宮裕之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMIYA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>醍醐佳明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIGO, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋元敏和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIMOTO, TOSHIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅下尚己</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMESHITA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-140068</doc-number>
          <date>20240821</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種提昇基板表面處理之處理量之技術。  &lt;br/&gt;本發明之基板處理裝置具備：腔室；基板支持部，其構成為於腔室內支持基板；氣體供給部，其構成為向腔室內供給處理氣體；雷射照射部，其構成為向基板照射雷射而於基板之表面產生近場光，且上述雷射具有使處理氣體因近場光而解離之波長；及電源，其構成為向基板支持部供給偏壓信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板處理裝置</p>
        <p type="p">2:控制部</p>
        <p type="p">2a:電腦</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通訊介面</p>
        <p type="p">10:腔室</p>
        <p type="p">10a:氣體供給口</p>
        <p type="p">10b:氣體排氣口</p>
        <p type="p">10c:頂板部</p>
        <p type="p">11:基板支持部</p>
        <p type="p">11a:基台</p>
        <p type="p">11b:靜電吸盤</p>
        <p type="p">11c:陶瓷構件</p>
        <p type="p">11d:靜電吸盤電極</p>
        <p type="p">12:旋轉部</p>
        <p type="p">20:氣體供給部</p>
        <p type="p">20a:氣體源</p>
        <p type="p">20b:流量控制器</p>
        <p type="p">30:雷射照射部</p>
        <p type="p">40:電源</p>
        <p type="p">41:DC電源</p>
        <p type="p">42:RF電源</p>
        <p type="p">50:光學構件</p>
        <p type="p">50a:聚光透鏡</p>
        <p type="p">50b:檢流計鏡</p>
        <p type="p">60:排氣系統</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="787px" img-content="tif" inline="yes" orientation="portrait" width="1011px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621910</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130119</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">B60L1/00</main-classification>
        <further-classification edition="201401120260223B">E05B77/12</further-classification>
        <further-classification edition="201401120260223B">E05B81/86</further-classification>
        <further-classification edition="201301120260223B">H01G11/08</further-classification>
        <further-classification edition="201301120260223B">H01G11/24</further-classification>
        <further-classification edition="201301120260223B">H01G11/28</further-classification>
        <further-classification edition="201301120260223B">H01G11/34</further-classification>
        <further-classification edition="201301120260223B">H01G11/52</further-classification>
        <further-classification edition="201301120260223B">H01G11/62</further-classification>
        <further-classification edition="201301120260223B">H01G11/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商京瓷ＡＶＸ元件公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOCERA AVX COMPONENTS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　小榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XIAORONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田努透　馬特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENUTO, MATT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱歐立　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAOILE, BRYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾普斯奈德　強納森　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNOPSNYDER, JONATHAN ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉德　尚　伊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALLARD, JEAN-YVES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/680,126</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於電子閂鎖應用之超級電容器</chinese-title>
        <english-title>ULTRACAPACITORS FOR E-LATCH APPLICATIONS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種超級電容器，其包括一第一電極、一第二電極、一隔膜、一非水性電解質及一外殼。該第一電極包括電耦合至包括具有第一複數個孔之活性碳粒子之一第一碳質塗層之一第一集電極，且該第二電極包括電耦合至包括具有第二複數個孔之活性碳粒子之一第二碳質塗層之一第二集電極。該隔膜定位於該第一電極與該第二電極之間。該非水性電解質與該第一電極及該第二電極離子接觸且含有包括溶解於一非水性溶劑中之一陽離子物種及一反離子之一離子液體。該第一碳質塗層之該第一複數個孔具有一中值孔徑大小，該反離子具有一中值離子半徑大小，且該第一複數個孔之該中值孔徑大小與該反離子之該中值離子半徑大小之比率係約0.5至約1.5。亦提供一種包括至少兩個超級電容器之模組、一種用於電子閂鎖總成之儲能系統及一種具有用於電子閂鎖總成之一儲能系統之交通工具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultracapacitor that comprises a first electrode, a second electrode, a separator, a nonaqueous electrolyte, and a housing is provided. The first electrode comprises a first current collector electrically coupled to a first carbonaceous coating that comprises activated carbon particles having a first plurality of pores and the second electrode comprises a second current collector electrically coupled to a second carbonaceous coating that comprises activated carbon particles having a second plurality of pores. The separator is positioned between the first electrode and the second electrode. The nonaqueous electrolyte is in ionic contact with the first electrode and the second electrode and contains an ionic liquid comprising a cationic species and a counterion dissolved in a nonaqueous solvent. The first plurality of pores of the first carbonaceous coating has a median pore diameter size, the counterion has a median ionic radius size, and the ratio of the median pore diameter size of the first plurality of pores to the median ionic radius size of the counterion is about 0.5 to about 1.5. A module comprising at least two ultracapacitors, an energy reserve system for electronic latch assemblies, and a vehicle with an energy reserve system for electronic latch assemblies is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">150:電子控制單元</p>
        <p type="p">190:鎖定機構</p>
        <p type="p">200:超級電容器</p>
        <p type="p">210:一次能源</p>
        <p type="p">300:交通工具</p>
        <p type="p">310:框架</p>
        <p type="p">320:門</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="374px" img-content="tif" inline="yes" orientation="portrait" width="650px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621911</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130124</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">B60L1/00</main-classification>
        <further-classification edition="201401120260223B">E05B77/12</further-classification>
        <further-classification edition="201401120260223B">E05B81/86</further-classification>
        <further-classification edition="201301120260223B">H01G11/08</further-classification>
        <further-classification edition="201301120260223B">H01G11/24</further-classification>
        <further-classification edition="201301120260223B">H01G11/28</further-classification>
        <further-classification edition="201301120260223B">H01G11/34</further-classification>
        <further-classification edition="201301120260223B">H01G11/52</further-classification>
        <further-classification edition="201301120260223B">H01G11/62</further-classification>
        <further-classification edition="201301120260223B">H01G11/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商京瓷ＡＶＸ元件公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYOCERA AVX COMPONENTS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　小榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XIAORONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田努透　馬特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TENUTO, MATT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布朗　肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROWN, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱歐立　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAOILE, BRYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾普斯奈德　強納森　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNOPSNYDER, JONATHAN ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕拉德　尚　伊夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALLARD, JEAN-YVES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/680,128</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於電子閂鎖應用之超級電容器</chinese-title>
        <english-title>ULTRACAPACITORS FOR E-LATCH APPLICATIONS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種超級電容器，其包括一第一電極、一第二電極、一隔膜、一非水性電解質及一外殼。該第一電極包括電耦合至包括具有第一複數個孔之活性碳粒子之一第一碳質塗層之一第一集電極，且該第二電極包括電耦合至包括具有第二複數個孔之活性碳粒子之一第二碳質塗層之一第二集電極。該隔膜定位於該第一電極與該第二電極之間。該非水性電解質與該第一電極及該第二電極離子接觸且含有包括溶解於一非水性溶劑中之一陽離子物種及一反離子之一離子液體。該第一複數個孔具有一第一總孔體積，該第一總孔體積包括具有約2奈米或更小之一中值孔徑大小之約50體積%或更多之孔。本發明亦提供一種包括至少兩個超級電容器之模組、一種用於電子閂鎖總成之儲能系統及一種具有用於電子閂鎖總成之一儲能系統之交通工具。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An ultracapacitor that comprises a first electrode, a second electrode, a separator, a nonaqueous electrolyte, and a housing is provided. The first electrode comprises a first current collector electrically coupled to a first carbonaceous coating that comprises activated carbon particles having a first plurality of pores and the second electrode comprises a second current collector electrically coupled to a second carbonaceous coating that comprises activated carbon particles having a second plurality of pores. The separator is positioned between the first electrode and the second electrode. The nonaqueous electrolyte is in ionic contact with the first electrode and the second electrode and contains an ionic liquid comprising a cationic species and a counterion dissolved in a nonaqueous solvent. The first plurality of pores has a first total pore volume, the first total pore volume comprising about 50 vol. % or more of pores having a median pore diameter size of about 2 nanometers or less. A module comprising at least two ultracapacitors, an energy reserve system for electronic latch assemblies, and a vehicle with an energy reserve system for electronic latch assemblies is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">150:電子控制單元</p>
        <p type="p">190:鎖定機構</p>
        <p type="p">200:超級電容器</p>
        <p type="p">210:一次能源</p>
        <p type="p">300:交通工具</p>
        <p type="p">310:框架</p>
        <p type="p">320:門</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="552px" img-content="tif" inline="yes" orientation="portrait" width="711px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623619</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130127</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P95/00</main-classification>
        <further-classification edition="200601120260302B">G06K19/06</further-classification>
        <further-classification edition="200601120260302B">G06K7/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康閎森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, HUNG-SEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　志仰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHIH-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　燿宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　一莘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YIXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/796,901</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基於矩陣二維碼標籤的追蹤系統</chinese-title>
        <english-title>TRACKING SYSTEM ON MATRIX TWO-DIMENSIONAL CODE LABELS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種追蹤半導體腔室零件的方法使用嵌入追蹤特徵的矩陣二維（2D）碼標籤。在某些實施例中，該方法可包括選擇特徵以嵌入到矩陣2D碼標籤中，以產生修改過的矩陣2D碼標籤，其中該特徵在嵌入矩陣2D碼標籤時不會導致誤讀訊息，且該特徵可根據半導體腔室零件的處理而變更，將修改過的矩陣2D碼標籤形成到半導體腔室零件中，對修改過的矩陣2D碼標籤進行光學檢查以決定特徵的變化，並分析特徵的變化以決定半導體腔室零件所經歷的清洗循環數，這至少部分基於特徵的變化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for tracking of a semiconductor chamber part uses a matrix two-dimensional (2D) code label embedded with a tracking feature. In some embodiments, the method may include selecting a feature to embed into the matrix 2D code label to create a modified matrix 2D code label where the feature does not cause misreading of information from the matrix 2D code label when embedded into the matrix 2D code label and where the feature is configured to change based on treatment of the semiconductor chamber part, forming the modified matrix 2D code label into the semiconductor chamber part, optically inspecting the modified matrix 2D code label to determine changes to the feature, and analyzing the changes to the feature to determine a number of cleaning cycles undergone by the semiconductor chamber part based, at least in part, on the changes to the feature.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:視圖</p>
        <p type="p">802:標籤</p>
        <p type="p">804:區域</p>
        <p type="p">806:區域</p>
        <p type="p">808:特徵</p>
        <p type="p">810:特徵</p>
        <p type="p">812:子特徵</p>
        <p type="p">814:寬度</p>
        <p type="p">816:長度</p>
        <p type="p">818:高度</p>
        <p type="p">820:寬度</p>
        <p type="p">822:寬度</p>
        <p type="p">824:長度</p>
        <p type="p">826:寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="532px" img-content="tif" inline="yes" orientation="portrait" width="656px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621829</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130141</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260223B">B23K26/046</main-classification>
        <further-classification edition="201401120260223B">B23K26/062</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本直也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡辺向陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, KOYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>奈良康永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARA, YASUNAGA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡崎茂俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAZAKI, SHIGETOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤晴康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, HARUYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田丈史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本剛志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-146336</doc-number>
          <date>20240828</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-007069</doc-number>
          <date>20250117</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>雷射加工裝置、光學裝置之製造方法、及雷射加工方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之雷射加工裝置1A包含：光產生部20A，其產生徑向偏光或角向偏光且具有螺旋相位分佈之雷射光L3；集光光學系統30，其將雷射光L3集光至單軸性雙折射晶體內之集光位置；及控制部40A，其使集光位置在單軸性雙折射晶體內移動而形成光學構造。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:雷射加工裝置</p>
        <p type="p">20A:光產生部</p>
        <p type="p">21:雷射光源</p>
        <p type="p">22:相位板</p>
        <p type="p">23:雙側遠心中繼透鏡系統</p>
        <p type="p">24:矢量偏光件</p>
        <p type="p">25:雙側遠心中繼透鏡系統</p>
        <p type="p">30:集光光學系統</p>
        <p type="p">40A:控制部</p>
        <p type="p">231,232,251,252:透鏡</p>
        <p type="p">L1~L3:雷射光</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.JPG" file="ed10027.JPG" height="729px" img-content="tif" inline="yes" orientation="portrait" width="1011px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623366</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130152</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260225B">H10B61/00</main-classification>
        <further-classification edition="202301120260225B">H10N50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京科學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林宏之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角嶋邦之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKUSHIMA, KUNIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呉研</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鬼村和志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONIMURA, KAZUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-131094</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>磁性記憶體元件、磁性記憶體、及控制磁性記憶體之控制方法</chinese-title>
        <english-title>MAGNETIC MEMORY ELEMENT, MAGNETIC MEMORY, AND CONTROL METHOD FOR CONTROLLING MAGNETIC MEMORY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之磁性記憶體元件包含：鐵磁性層，其磁化能夠反轉；及鐵電層，其與上述鐵磁性層積層，且於積層方向上具有極化方向分量；於上述鐵電層之極化方向處於第1極化方向之狀態、及處於不同於上述第1極化方向之第2極化方向之狀態下，上述鐵磁性層之易磁化反轉性不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:第1鐵磁性層</p>
        <p type="p">120:鐵電層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="258px" img-content="tif" inline="yes" orientation="portrait" width="683px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623538</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130155</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/28</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車適</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHE, SHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱拉拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, LALA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃一敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　安川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ANCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英格爾　尼汀Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INGLE, NITIN K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/796,747</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>均勻氧化矽蝕刻方法</chinese-title>
        <english-title>UNIFORM SILICON OXIDE ETCHING METHODS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">示範性半導體處理方法可能包含將第一含氟前驅物和含氮前驅物提供至半導體處理腔室的處理區域。基板可能安置於處理區域內。一或多個特徵可能延伸穿過含矽和氧的材料與含矽和氮的材料的交替層，這些材料均安置於基板上。這些方法可能包含將第二含氟前驅物提供至半導體處理腔室的處理區域。這些方法可能包含使基板接觸第一含氟前驅物、含氮前驅物及第二含氟前驅物。該接觸可能蝕刻含矽和氧的材料的部分，並且其中自上而下的裝載特徵化為小於1.2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary semiconductor processing methods may include providing a first fluorine-containing precursor and a nitrogen-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region. One or more features may extend through alternating layers of a silicon-and-oxygen-containing material and a silicon-and-nitrogen-containing material are disposed on the substrate. The methods may include providing a second fluorine-containing precursor to the processing region of the semiconductor processing chamber. The methods may include contacting the substrate with the first fluorine-containing precursor, the nitrogen-containing precursor, and the second fluorine-containing precursor. The contacting may etch a portion of the silicon-and-oxygen-containing material, and wherein a top-to-bottom loading is characterized by less than 1.2.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">405:可選操作</p>
        <p type="p">410:操作</p>
        <p type="p">415:操作</p>
        <p type="p">420:操作</p>
        <p type="p">425:可選操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="725px" img-content="tif" inline="yes" orientation="portrait" width="501px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622089</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130170</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D513/22</main-classification>
        <further-classification edition="200601120260302B">C07D519/00</further-classification>
        <further-classification edition="200601120260302B">A61K31/541</further-classification>
        <further-classification edition="200601120260302B">A61K31/5377</further-classification>
        <further-classification edition="200601120260302B">A61K31/5025</further-classification>
        <further-classification edition="200601120260302B">A61K31/5386</further-classification>
        <further-classification edition="200601120260302B">A61K31/553</further-classification>
        <further-classification edition="200601120260302B">A61K31/551</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商江蘇恆瑞醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANGSU HENGRUI PHARMACEUTICALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海恆瑞醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI HENGRUI PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李心</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桂斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUI, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JUNZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王勝藍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHENGLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵啟雲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAO, QIYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024110791031</doc-number>
          <date>20240807</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024113520173</doc-number>
          <date>20240926</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2024115527497</doc-number>
          <date>20241101</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2024119886959</doc-number>
          <date>20241231</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>2025102779511</doc-number>
          <date>20250310</date>
        </priority-claim>
        <priority-claim sequence="6">
          <country>中國大陸</country>
          <doc-number>2025104307144</doc-number>
          <date>20250408</date>
        </priority-claim>
        <priority-claim sequence="7">
          <country>中國大陸</country>
          <doc-number>202510575969X</doc-number>
          <date>20250506</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種多環化合物、其製備方法及其在醫藥上的應用</chinese-title>
        <english-title>A POLYCYCLIC COMPOUND, A PREPARATION METHOD THEREOF AND A MEDICAL USE THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種多環化合物、其製備方法及其在醫藥上的應用。具體而言，本揭露涉及一種通式(I)所示的多環化合物、其製備方法及含有該化合物的醫藥組成物以及其作為治療劑的用途，特別是作為RAS抑制劑的用途和在製備用於治療和/或預防RAS介導的或依賴性的疾病或病症的藥物中的用途。其中通式(I)中各基團如說明書中所定義。</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="260px" width="290px" file="d10001.TIF" alt="化學式ed10001.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10001.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a polycyclic compound, a preparation method thereof, and a medical use thereof. Specifically, the disclosure relates to a polycyclic compound represented by general formula (I), its preparation method, and pharmaceutical compositions containing the same, as well as its use as a therapeutic agent, particularly as a RAS inhibitor, and in the preparation of medicaments for the treatment and/or prevention of RAS-mediated or RAS-dependent diseases or conditions. The groups in general formula (I) are defined as the specification.</p>
        <p type="p">
        &lt;figure&gt;
          &lt;img align="absmiddle" height="253px" width="286px" file="d10002.TIF" alt="化學式ed10002.png" img-content="tif" orientation="portrait" inline="yes" giffile="ed10002.png"&gt;
          &lt;/img&gt;
        &lt;/figure&gt;
      </p>
      </isu-abst>
      <representative-img>
      </representative-img>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622122</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130180</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
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      <classification-ipc>
        <main-classification edition="200601120260302B">C07K19/00</main-classification>
        <further-classification edition="200601120260302B">C07K14/78</further-classification>
        <further-classification edition="200601120260302B">C07K16/28</further-classification>
        <further-classification edition="200601120260302B">C12N5/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商海珀瑞恩藥物發現有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HYPERION DRUG DISCOVERY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山賢二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OYAMA, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嶽北和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEKITA, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-131489</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>新穎黏附分子</chinese-title>
        <english-title>NOVEL ADHESION MOLECULE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所欲解決之問題是：簡便地利用幾丁質或幾丁聚糖等生物相容性材料作為細胞培養表面；以及，提供一種融合蛋白，該融合蛋白能夠簡便地利用於目標細胞的純化及增殖。本發明提供一種融合蛋白，其包含至少一個以上的包含可黏附於幾丁質類的胜肽之區域、及至少一個以上的包含可黏附於細胞的胜肽或蛋白質之區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="297px" img-content="tif" inline="yes" orientation="portrait" width="588px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622073</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130182</doc-number>
          <kind></kind>
          <date>114/08/07</date>
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        <main-classification edition="200601120260302B">C07D471/04</main-classification>
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        <further-classification edition="200601120260302B">A61K31/501</further-classification>
        <further-classification edition="200601120260302B">A61K31/5025</further-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61P43/00</further-classification>
        <further-classification edition="200601120260302B">A61P19/08</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商Ｖ6醫療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>V6 THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘迪　安嘉莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANDEY, ANJALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪西潘德　阿尼爾　暮理德哈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESHPANDE, ANIL MURLIDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾西賽亞瑪尼　傑亞拉　杜萊斯瓦米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATHISAYAMANI, JEYARAJ DURAISWAMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈帕爾　薩特維克　柯塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOPAL, SATVIK KOTHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯力　斯里尼瓦斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOLLI, SRINIVAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥迪卡　克里希納　普拉薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADICA, KRISHNA PRASAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅施　布魯斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROTH, BRUCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克曼　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VOLKMANN, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,037</doc-number>
          <date>20240808</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/851,058</doc-number>
          <date>20250725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>選擇性JAK2抑制劑及其用途</chinese-title>
        <english-title>SELECTIVE JAK2 INHIBITORS AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述作為JAK2抑制劑之化合物；製備此等化合物之方法；包含此等化合物之醫藥組合物及藥劑；及使用此等化合物治療將得益於JAK2活性調節之病狀、疾病或病症的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are compounds that are JAK2 inhibitors, methods of making such compounds, pharmaceutical compositions and medicaments comprising such compounds, and methods of using such compounds in the treatment of conditions, diseases, or disorders that would benefit from modulation of JAK2 activity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202621692</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114130218</doc-number>
          <kind></kind>
          <date>114/08/07</date>
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        <main-classification edition="200601120260302B">A61K31/522</main-classification>
        <further-classification edition="200601120260302B">A61K47/32</further-classification>
        <further-classification edition="200601120260302B">A61K47/38</further-classification>
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        <further-classification edition="200601120260302B">A61P9/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>美商天恩治療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEON THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>卡拉波爾尼　珊米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARABORNI, SAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/680,291</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>腺苷受體拮抗劑調配物</chinese-title>
        <english-title>FORMULATIONS OF ADENOSINE RECEPTOR ANTAGONIST</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了含有A&lt;sub&gt;2B&lt;/sub&gt;腺苷受體拮抗劑及一種或多種賦形劑之醫藥調配物。亦提供了治療與A&lt;sub&gt;2B&lt;/sub&gt;腺苷受體活性調節相關或將受益於A&lt;sub&gt;2B&lt;/sub&gt;腺苷受體活性調節之疾病或病症的方法及其組合治療。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided here are pharmaceutical formulations containing A&lt;sub&gt;2B&lt;/sub&gt; adenosine receptor antagonists and one or more excipients. The method of treating diseases or disorders associated with or would benefit from modulation of A&lt;sub&gt;2B&lt;/sub&gt; adenosine receptor activity, and the combination treatment thereof are also provided.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="783px" img-content="tif" inline="yes" orientation="portrait" width="979px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622078</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130220</doc-number>
          <kind></kind>
          <date>114/08/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D487/04</main-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61P31/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾森伯利生物科學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASSEMBLY BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派喬哈遜　海森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAJOUHESH, HASSAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALKER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾　民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布爾斯　馬克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURES, MARK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史崔頓　湯瑪士　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STRATTON, THOMAS P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/680,398</doc-number>
          <date>20240807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療ＨＳＶ之三環化合物</chinese-title>
        <english-title>TRICYCLIC COMPOUNDS FOR TREATMENT OF HSV</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明部分地提供三環化合物及其醫藥組合物，及治療及預防HSV感染之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides, in part, tricyclic compounds, and pharmaceutical compositions thereof, and methods of the treatment and prophylaxis of HSV infections.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621760</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130227</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">A62C3/00</main-classification>
        <further-classification edition="200601120260225B">A62C3/07</further-classification>
        <further-classification edition="200601120260225B">A62C5/00</further-classification>
        <further-classification edition="200601120260225B">A62C35/13</further-classification>
        <further-classification edition="200601120260225B">A62C37/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商雅托普羅德克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMATO PROTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小山竜矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOYAMA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙明修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, MINGXIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>濱田悠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMADA, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久保田哲史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, AKIFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤辰基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, TATSUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134149</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>控制裝置及包含控制裝置之滅火設備</chinese-title>
        <english-title>CONTROL DEVICE AND FIRE EXTINGUISHING EQUIPMENT INCLUDING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可抑制控制裝置的電源的要求水準的氣溶膠氣體放射器之控制裝置、及包含該控制裝置之滅火設備。本發明的控制裝置包含：釋出電路，對複數氣溶膠氣體放射器的各個，分別輸出釋出指示訊號；及釋出控制電路，控制該釋出電路；該釋出控制電路對於該釋出電路，令其以設定之時間間隔，輸出該釋出指示訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a control device of aerosol gas dischargers, which can suppress the level of demand on the power supply of the control device, and a fire extinguishing equipment including said control device. The control device of the present invention contains: a release circuit, which outputs release instructing signals to each of a plurality of aerosol gas dischargers; and a release control circuit, which controls said release circuit. Said release control circuit is characterized in that it outputs said release instructing signal at a set time interval to said release circuit.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="592px" img-content="tif" inline="yes" orientation="portrait" width="987px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623510</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130243</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>作山努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKUYAMA, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-139133</doc-number>
          <date>20240820</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板接合裝置以及基板接合方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板接合裝置係具備：控制部，係根據屬於藉由基準標記拍攝部所拍攝的第一基準標記與第二基準標記重疊而得的圖像之重疊圖像的焦點的對焦程度，取得第一台及第二台中的至少一者的傾斜狀態，該基準標記拍攝部係拍攝從鉛直方向觀看時重疊的第一基準標記與第二基準標記。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">51:上台</p>
        <p type="p">51a:上夾具</p>
        <p type="p">51b:上側自轉馬達</p>
        <p type="p">51c:上側基台部</p>
        <p type="p">51d:上側積層部</p>
        <p type="p">61:下台</p>
        <p type="p">61a:下夾具</p>
        <p type="p">61b:下側自轉馬達</p>
        <p type="p">61c:下側基台部</p>
        <p type="p">61d:下側積層部</p>
        <p type="p">72:基準標記拍攝部</p>
        <p type="p">AM1:上側對準標記</p>
        <p type="p">AM2:下側對準標記</p>
        <p type="p">L1,L3:中心軸線</p>
        <p type="p">L2:軸線</p>
        <p type="p">MA1:上側基準標記</p>
        <p type="p">MA2:下側基準標記</p>
        <p type="p">W1:第一基板</p>
        <p type="p">W2:第二基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="824px" img-content="tif" inline="yes" orientation="portrait" width="754px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623057</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130246</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡多納　艾迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDONA, EDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>生野　艾瑞克木原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHONO, ERIC KIHARA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷普利　馬丁約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIPLEY, MARTIN JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱　恒超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, HANSEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧森　克里斯多夫Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLSEN, CHRISTOPHER S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/805,721</doc-number>
          <date>20240815</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>藉由電漿源及化學反應器之間的二維壓縮而幾何控制低流量自由基氣體</chinese-title>
        <english-title>LOW-FLOW RADICAL GAS GEOMETRICAL CONTROL THROUGH TWO-DIMENSIONAL COMPRESSION BETWEEN PLASMA SOURCE AND CHEMICAL REACTOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露一般涉及一種處理系統，該系統包括氣流組件，該氣流組件用於以低流動速率處理薄基板。該氣流組件包括至少一個壓縮部件，該壓縮部件配置為在二維中壓縮以約0.1slm至5slm的速率從電漿源流向腔室的氣體自由基所佔的體積。該至少一個壓縮部件將氣體自由基所佔的體積從該處理腔室進口的初始剖面積壓縮約50%至約90%。在某些實施例中，該至少一個壓縮部件是兩個壓縮部件，其中連接到該處理腔室進口的第一壓縮部件的體積大於連接到該第一壓縮部件和該腔室的第二壓縮部件。在這種實施例中，該第一壓縮部件和第二壓縮部件是可拆卸的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure generally relates to a processing system comprising a flow assembly for processing thin substrates using low flow rates. The flow assembly comprises at least one compression part configured to compress a volume occupied by gas radicals flowing at a rate of about 0.1 slm to 5 slm from a plasma source to a chamber in two dimensions. The at least one compression part compresses the volume occupied by the gas radicals about 50% to about 90% from an initial cross-sectional area of the port of the process chamber. In some embodiments, the at least one compression part is a two compression parts, where a first compression part coupled to the port of the process chamber is larger in volume than a second compression part coupled to the first compression part and the chamber. In such an embodiment, the first and second compression parts are removable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:氣流組件</p>
        <p type="p">202:自由基</p>
        <p type="p">204:壓縮部件</p>
        <p type="p">204a:第一開口</p>
        <p type="p">204b:第二開口</p>
        <p type="p">206:壓縮部件</p>
        <p type="p">206a:第一開口</p>
        <p type="p">206b:第二開口</p>
        <p type="p">208:腔室/反應器</p>
        <p type="p">210:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="781px" img-content="tif" inline="yes" orientation="portrait" width="1018px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623464</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130255</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120250901B">H10F39/12</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商武漢新芯集成電路股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, ZHIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹開瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, KAIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張霞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, XIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>易開樣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YI, KAIYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116979171</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>垂直電荷轉移成像感測器及其製作方法</chinese-title>
        <english-title>VERTICALLY CHARGE TRANSFERRING PIXEL SENSORS AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種垂直電荷轉移成像感測器及其製作方法。所述垂直電荷轉移成像感測器中，襯底包括被貫穿其中的深溝槽隔離結構隔離的多個像素襯底單元，淺溝槽隔離結構使每個像素襯底單元形成感光區和電荷讀取區，浮閘型電晶體對應於所述電荷讀取區形成，且其中浮置閘極、閘極間介電層及控制閘極的疊層從相應像素襯底單元的電荷讀取區橫跨至感光區，背面電連接層從襯底背面覆蓋連接各像素襯底單元，所述背面電連接層包括透光導電的金屬化合物，便於向各像素襯底單元構成的電容極板施加電壓，能夠降低垂直電荷轉移成像感測器的製作難度，優化垂直電荷轉移成像感測器的性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a vertically charge transferring pixel sensor and a manufacturing method thereof. In the vertically charge transferring pixel sensor, the substrate includes multiple pixel substrate units isolated by deep trench isolation structures penetrating it. Shallow trench isolation structures divide each pixel substrate unit into a photosensitive region and a charge readout region. A floating-gate type transistor is formed corresponding to the charge readout region. The stack of a floating gate, a gate dielectric layer, and a control gate extends from the charge readout region of the corresponding pixel substrate unit across to the photosensitive region. A back-side electrical connection layer covers and connects each pixel substrate unit from the back of the substrate. The back-side electrical connection layer includes a transparent conductive metal compound, allowing a voltage to be applied to the capacitor electrode plate formed by each pixel substrate unit. This design reduces the manufacturing difficulty of the vertically charge transferring pixel sensor and optimizes its performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:像素襯底單元</p>
        <p type="p">11:感光區</p>
        <p type="p">12:電荷讀取區</p>
        <p type="p">100:襯底</p>
        <p type="p">100a:正面</p>
        <p type="p">100b:背面</p>
        <p type="p">101:線性氧化層</p>
        <p type="p">102:正面溝槽覆蓋層</p>
        <p type="p">103:閘極介電層</p>
        <p type="p">104:閘極間介電層</p>
        <p type="p">105:背面溝槽覆蓋層</p>
        <p type="p">106:背面電連接層</p>
        <p type="p">107:背面介電層</p>
        <p type="p">CG:控制閘極</p>
        <p type="p">DTI:深溝槽隔離結構</p>
        <p type="p">FG:浮置閘極</p>
        <p type="p">STI:淺溝槽隔離結構</p>
        <p type="p">TE:溝槽電極</p>
        <p type="p">WL:字線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="300px" img-content="tif" inline="yes" orientation="portrait" width="450px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622644</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130268</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G03F7/20</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野瀬　亞力山卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONOSE, ALEXANDRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RO</english-country>
              <english-address>RO</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凡斯勒　喬漢斯　吉賽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENSELAAR, JOANNES JITSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博塔里　蒂亞戈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOTARI, TIAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
              <english-address>BR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克瑞馬　雨果　奧格斯提納斯　約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRAMER, HUGO AUGUSTINUS JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>因凡尼茲　安德烈亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVERNIZZI, ANDREA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24195199.5</doc-number>
          <date>20240819</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>應用於晶圓度量衡之用於參數推斷之擴散模型</chinese-title>
        <english-title>DIFFUSION MODELS FOR PARAMETER INFERENCE WITH APPLICATION TO WAFER METROLOGY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">使用依據自至少一個經圖案化基板獲得之度量衡資料的一生成網路來處理一輸入，以產生一輸出。該輸入為定義該至少一個基板之一基板模型之基板模型資料，且該生成網路之該輸出用以產生定義一經更新基板模型之經更新基板模型資料。在一或多次進一步反覆中，該生成網路處理基於前一操作中所產生之該經更新基板模型之一輸入。在最後反覆中的該生成網路之該輸出用以產生描述該至少一個基板之基板描述資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A generative network, conditioned on metrology data obtained from at least one patterned substrate, is used to process an input, to generate an output. The input is substrate model data defining a substrate model of the at least one substrate, and the output of the generative network is used to produce updated substrate model data defining an updated substrate model. In one or more further iterations, the generative network processes an input based on the updated substrate model generated in the preceding operation. The output of the generative network in the last iteration is used to generate substrate description data describing the at least one substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:擴散模型</p>
        <p type="p">
        &lt;i&gt;t&lt;/i&gt;:索引</p>
        <p type="p">
        &lt;i&gt;p&lt;/i&gt;:估計</p>
        <p type="p">
        &lt;img align="absmiddle" height="20px" width="18px" file="d10001.TIF" alt="其他非圖式ed10001.png" img-content="character" orientation="portrait" inline="no" giffile="ed10001.png"&gt;
        &lt;/img&gt;:對應工具組態資料</p>
        <p type="p">
        &lt;i&gt;m&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;j&lt;/i&gt;
        &lt;/sub&gt;:量測</p>
        <p type="p">
        &lt;img align="absmiddle" height="24px" width="23px" file="d10002.TIF" alt="其他非圖式ed10002.png" img-content="character" orientation="portrait" inline="no" giffile="ed10002.png"&gt;
        &lt;/img&gt;:基板模型資料</p>
        <p type="p">
        &lt;img align="absmiddle" height="24px" width="33px" file="d10003.TIF" alt="其他非圖式ed10003.png" img-content="character" orientation="portrait" inline="no" giffile="ed10003.png"&gt;
        &lt;/img&gt;:經更新基板模型資料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10084.JPG" file="ed10084.JPG" height="236px" img-content="tif" inline="yes" orientation="portrait" width="631px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622109</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130287</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/00</main-classification>
        <further-classification edition="200601120260302B">C07K16/28</further-classification>
        <further-classification edition="201001120260302B">C12N5/071</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商普瑞里斯生物製劑公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRELLIS BIOLOGICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米蘭達　列斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIRANDA, LES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昝　虹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZAN, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞波希歐羅　喬凡納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPPOCCIOLO, GIOVANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,595</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>產生自一開始便為人類的抗體之方法</chinese-title>
        <english-title>METHODS OF GENERATING ANTIBODIES THAT ARE HUMAN FROM THE START</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供在淋巴結類器官中產生抗體之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are methods of producing antibodies in lymph node organoids.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10036.JPG" file="ed10036.JPG" height="475px" img-content="tif" inline="yes" orientation="portrait" width="941px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623695</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130304</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/10</main-classification>
        <further-classification edition="202601120260302B">H10W44/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W70/65</further-classification>
        <further-classification edition="202601120260302B">H10W74/40</further-classification>
        <further-classification edition="202601120260302B">H10D80/30</further-classification>
        <further-classification edition="202601120260302B">H10D80/20</further-classification>
        <further-classification edition="200601120260302B">H01F27/28</further-classification>
        <further-classification edition="200601120260302B">H01F27/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫至堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, ZHIJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洸洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KWANG-SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓笛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜　劍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,799</doc-number>
          <date>20240810</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/054,754</doc-number>
          <date>20250214</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積體電感元件的封裝模組</chinese-title>
        <english-title>PACKAGED MODULE WITH INTEGRATED INDUCTIVE COMPONENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請請求保護一種封裝模組，包括安裝在基板上的導電線圈。該封裝模組採用磁性模塑料封裝，該化合物覆蓋導電線圈。該導電線圈為無磁芯線圈，其中未設置磁芯。該封裝模組還可包括設置於其內的積體電路(“IC”)晶片。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A packaged module including an electrically conductive coil mounted on a substrate. The packaged module is encapsulated with a magnetic molding compound covering the electrically conductive coil. The electrically conductive coil is core-less without a magnetic core disposed therein. The packaged module may further include an integrated circuit (“IC”) die disposed in the packaged module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:封裝模組</p>
        <p type="p">11:基板</p>
        <p type="p">11D:第二表面</p>
        <p type="p">11U:第一表面</p>
        <p type="p">12:功率開關單元</p>
        <p type="p">12B:背面</p>
        <p type="p">12T:頂面</p>
        <p type="p">13:導電線圈</p>
        <p type="p">14:磁性模塑料(MMC)</p>
        <p type="p">15:電容性儲能裝置</p>
        <p type="p">111:導電佈線結構</p>
        <p type="p">112:焊墊</p>
        <p type="p">113:接腳</p>
        <p type="p">121:導電焊墊</p>
        <p type="p">122:底部填充材料</p>
        <p type="p">123:導電柱/凸塊</p>
        <p type="p">124:導電晶片附著材料</p>
        <p type="p">131:第一線圈端子</p>
        <p type="p">132:第二線圈端子</p>
        <p type="p">133:導電附著材料</p>
        <p type="p">136:薄絕緣層</p>
        <p type="p">141:非磁性材料</p>
        <p type="p">142:包覆型磁性金屬顆粒</p>
        <p type="p">143:磁性金屬顆粒</p>
        <p type="p">144:絕緣包覆層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10046.JPG" file="ed10046.JPG" height="565px" img-content="tif" inline="yes" orientation="portrait" width="1050px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622385</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130321</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">F16B25/00</main-classification>
        <further-classification edition="200601120260224B">F16B25/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬歇爾　布萊恩修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARSHALL, BRYAN HUGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
              <english-address>AU</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安德羅尼科斯　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANDRONIKOS, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AU</english-country>
              <english-address>AU</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>澳大利亞</country>
          <doc-number>2024902460</doc-number>
          <date>20240808</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>澳大利亞</country>
          <doc-number>2025208565</doc-number>
          <date>20250728</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>緊固件</chinese-title>
        <english-title>FASTENER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種緊固件，其包括：一軸，延伸於該緊固件之頭部與其尖端之間；一啟始於尖端處或尖端處附近並沿該軸之一部分延伸且具有一第一螺紋之接合部；以及沿至少一部分的該接合部延伸的一縱向槽，其中，該槽被配置以在該緊固件被驅入一基板時接收所產生之碎屑，從而在安裝該緊固件時減低基板之膨脹。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A fastener, comprising: a shaft extending between a head of the fastener and a tip thereof; an engagement section beginning at or near the tip and extending along a portion of the shaft and having a first thread; and a longitudinal groove that extends along at least part of the engagement section, wherein the groove is configured to receive debris generated as the fastener is driven into a substrate to thereby reduce swelling of the substrate as the fastener is installed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:緊固件</p>
        <p type="p">12:頭部</p>
        <p type="p">14:軸</p>
        <p type="p">20:螺紋部</p>
        <p type="p">22:尖端</p>
        <p type="p">24:槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="575px" img-content="tif" inline="yes" orientation="portrait" width="806px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622045</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130326</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D237/20</main-classification>
        <further-classification edition="200601120260302B">C07D405/12</further-classification>
        <further-classification edition="200601120260302B">C07D405/14</further-classification>
        <further-classification edition="200601120260302B">C07D401/12</further-classification>
        <further-classification edition="200601120260302B">C07D491/107</further-classification>
        <further-classification edition="200601120260302B">C07D491/048</further-classification>
        <further-classification edition="200601120260302B">C07D498/04</further-classification>
        <further-classification edition="200601120260302B">C07D487/04</further-classification>
        <further-classification edition="200601120260302B">C07D471/10</further-classification>
        <further-classification edition="200601120260302B">C07D491/08</further-classification>
        <further-classification edition="200601120260302B">C07D491/113</further-classification>
        <further-classification edition="200601120260302B">C07D491/056</further-classification>
        <further-classification edition="200601120260302B">A61K31/50</further-classification>
        <further-classification edition="200601120260302B">A61K31/501</further-classification>
        <further-classification edition="200601120260302B">A61K31/502</further-classification>
        <further-classification edition="200601120260302B">A61K31/53</further-classification>
        <further-classification edition="200601120260302B">A61K31/5383</further-classification>
        <further-classification edition="200601120260302B">A61K31/553</further-classification>
        <further-classification edition="200601120260302B">A61K31/5386</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO PHARMA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船越雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAKOSHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相原佳典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIHARA, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤圭悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山岸純也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGISHI, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>榎本健史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENOMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中嶋大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134244</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>胺基甲基環己烷衍生物</chinese-title>
        <english-title>AMINOMETHYLCYCLOHEXANE DERIVATIVE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種作為醫藥有用之胺基甲基-環己烷衍生物及其製藥學上容許之鹽、以及含有該等作為有效成分之醫藥組合物或對蕈毒鹼M4受體之拮抗作用所參與之疾病之治療劑及/或預防劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an aminomethylcyclohexane derivative or a pharmaceutically acceptable salt thereof that is useful as pharmaceuticals, as well as a pharmaceutical composition comprising it as an active ingredient, or a medicament for treating and/or preventing a disease associated with antagonism to muscarinic M4 receptors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621668</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130328</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/36</main-classification>
        <further-classification edition="200601120260302B">A61K8/34</further-classification>
        <further-classification edition="200601120260302B">A61K8/37</further-classification>
        <further-classification edition="200601120260302B">A61K8/46</further-classification>
        <further-classification edition="200601120260302B">A61Q5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森岡智紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIOKA, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134586</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>毛髮清潔劑組合物或頭飾製品用纖維清潔劑組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種毛髮清潔劑組合物或頭飾製品用纖維清潔劑組合物，其保存穩定性優異，應用於毛髮或假髮等頭飾製品用纖維時之清潔時之起泡性良好，且清潔時及沖洗時之順滑性等使用感亦優異。  &lt;br/&gt;即，本發明提供一種毛髮清潔劑組合物或頭飾製品用纖維清潔劑組合物，其含有以下成分(A)～(C)：(A)包含碳數為16以下之脂肪酸(A1)、碳數為16以下之脂肪族醇(A2)、及醯基之碳數為16以下之單脂肪酸甘油酯(A3)之疏水性兩親媒性物質；(B)包含陰離子性界面活性劑(B1)之界面活性劑；及(C)水；上述成分(A1)～(A3)之合計含量為3質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622429</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130335</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">F24F13/08</main-classification>
        <further-classification edition="200601120260224B">H01T23/00</further-classification>
        <further-classification edition="200601120260224B">H01T19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伊利諾工具工程公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ILLINOIS TOOL WORKS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅契可夫　亞力斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLOCHKOV, ALEKSEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛雷洛　祖安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUERRERO, JUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐德尼斯基　愛德華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLDYNSKI, EDWARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海曼　史蒂芬班諾德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEYMANN, STEVEN BERNARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,308</doc-number>
          <date>20240809</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/293,430</doc-number>
          <date>20250807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於具有角度／可旋轉準直的離子化風機的方法和裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR IONIZING BLOWERS HAVING ANGLED/ROTATABLE COLLIMATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭露的用於離子化風機的範例角度準直器包括：準直器主體，該準直器主體包括截錐體或截稜錐體中的至少一者，該準直器主體具有第一開口及第二開口，其中該第二開口與該第一開口不平行；以及位於該準直器主體內的擋板，該擋板橫向於該第一開口及該第二開口兩者而定向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed example angled collimators for ionizing blowers include: a collimator body comprising at least one of a truncated cone or a truncated pyramid, the collimator body having a first opening and a second opening, wherein the second opening is not parallel with the first opening; and a baffle within the collimator body and oriented transverse to both the first opening and the second opening.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="547px" img-content="tif" inline="yes" orientation="portrait" width="416px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622280</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130337</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/44</main-classification>
        <further-classification edition="200601120260302B">C23C16/458</further-classification>
        <further-classification edition="200601120260302B">C23C16/50</further-classification>
        <further-classification edition="200601120260302B">C23C16/52</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊斯　麥可Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICE, MICHAEL R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡度希　詹姆士Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARDUCCI, JAMES D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/799,755</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>偏壓電極與可移除電極間之靜電卡盤聚焦電漿清潔</chinese-title>
        <english-title>ELECTROSTATIC CHUCK FOCUSED PLASMA CLEAN BETWEEN BIAS ELECTRODE AND REMOVABLE ELECTRODE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露一般提供基板處理系統及其方法。基板處理系統包括包含移送埠的基板處理腔室。基板支撐組件配置於基板處理腔室內。基板支撐組件具有靜電卡盤和基板支撐面。運輸機器人配置用來通過移送埠將陰極環運輸進出基板處理腔室。控制器配置用來使基板處理系統使用運輸機器人將陰極環放置在基板支撐組件的基板支撐面上，並在陰極環位於基板支撐面上期間為靜電卡盤供電達一清潔時間段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure generally provides substrate processing systems and methods thereof. The substrate processing systems include a substrate processing chamber including a transfer port. A substrate support assembly is disposed within the substrate processing chamber. The substrate support assembly having an electrostatic chuck and a substrate support surface. A transport robot is configured to transport a cathode ring in and out of the substrate processing chamber through the transfer port. A controller is configured to cause the substrate processing system to place the cathode ring on the substrate support surface of the substrate support assembly using the transport robot, and power the electrostatic chuck for a cleaning period while the cathode ring is disposed over the substrate support surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:陰極組件</p>
        <p type="p">115:基板支撐件</p>
        <p type="p">118A:基板支撐面</p>
        <p type="p">185:基板移送埠</p>
        <p type="p">200:陰極環</p>
        <p type="p">202:環形主體</p>
        <p type="p">204:中央孔</p>
        <p type="p">212:電接地</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="566px" img-content="tif" inline="yes" orientation="portrait" width="1021px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622267</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130338</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C23C14/50</main-classification>
        <further-classification edition="200601120260225B">C23C14/06</further-classification>
        <further-classification edition="200601120260225B">C23C14/34</further-classification>
        <further-classification edition="200601120260225B">C23C14/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳哲遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHEYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那雅客　亞文內許</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAYAK, AVINASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷建新</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, JIANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷迪　桑達拉潘迪恩拉馬林佳維傑亞拉席米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, SUNDARAPANDIAN RAMALINGA VIJAYALAKSHMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芙　艾利森Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VU, ALLYSON N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/799,554</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於物理氣相沉積腔室的沉積環</chinese-title>
        <english-title>DEPOSITION RING FOR PHYSICAL VAPOR DEPOSITION CHAMBER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了物理氣相沉積（PVD）腔室及用於物理氣相沉積（PVD）腔室的沉積環。該沉積環包括環形主體，具有上部和下部，上部和下部中的每一者獨立地包括用於限定上部厚度和下部厚度的內徑表面和外徑表面，以及用於限定上部高度和下部高度的頂表面和底表面，上部高度大於下部高度；以及複數個周向間隔的槽口，該複數個周向間隔的槽口沿著下部的內徑表面的邊緣形成，其中上部的至少部分限定凸形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Physical vapor deposition (PVD) chambers and deposition rings for physical vapor deposition (PVD) chambers are described. The deposition ring comprises a ring-shaped body having an upper portion and a lower portion, each of the upper portion and the lower portion independently comprising an inner diameter surface and an outer diameter surface defining an upper portion thickness and a lower portion thickness, and a top surface and a bottom surface defining an upper portion height and a lower portion height, the upper portion height greater than the lower portion height; and a plurality of circumferentially spaced notches formed along an edge of the inner diameter surface of the lower portion, wherein at least a portion of the upper portion defines a convex shape.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:沉積環</p>
        <p type="p">101:環形主體</p>
        <p type="p">102:上部</p>
        <p type="p">102A:內徑表面</p>
        <p type="p">102B:外徑表面</p>
        <p type="p">102C:頂表面</p>
        <p type="p">102D:底表面</p>
        <p type="p">104:下部</p>
        <p type="p">104A:內徑表面</p>
        <p type="p">104C:頂表面</p>
        <p type="p">104D:底表面</p>
        <p type="p">105:環形環</p>
        <p type="p">110:槽口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="665px" img-content="tif" inline="yes" orientation="portrait" width="727px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623655</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130345</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/05</main-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W40/22</further-classification>
        <further-classification edition="202601120260302B">H10W44/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔榮仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, YOUNGIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李琇彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUPIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋智娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>CN2024111251721</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝組件和用於其形成的方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE ASSMEBLY AND METHOD FOR FORMING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝組件，包括：半導體封裝，包括：基板；安裝在基板上的半導體裸片；互連塊對，安裝在基板上並位於半導體裸晶的相對側處；以及密封劑層，形成於基板上以密封半導體裸晶和互連塊對，互連塊對具有暴露於密封劑層的相應頂面，並且半導體裸晶的頂面暴露於密封劑層；以及電感器塊，安裝在半導體封裝上，其包括：絕緣體；電感器，電感器在絕緣體的水平方向上延伸穿過絕緣體，並且具有暴露於絕緣體的底面的電感器接觸墊對，電感器接觸墊對與互連塊對對準並電耦合；以及導熱塗層，形成於絕緣體的外表面處並在絕緣體的豎直方向上從絕緣體的底面延伸到頂面，其中導熱塗層與半導體裸晶熱耦合，以允許由半導體裸晶產生的熱通過導熱塗層耗散。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝組件</p>
        <p type="p">110:半導體封裝</p>
        <p type="p">111:基板</p>
        <p type="p">112:半導體裸晶</p>
        <p type="p">113:互連塊對</p>
        <p type="p">114:密封劑層</p>
        <p type="p">115:散熱器</p>
        <p type="p">116:熱介面材料層</p>
        <p type="p">117:電子元件</p>
        <p type="p">120:電感器塊</p>
        <p type="p">121:絕緣體</p>
        <p type="p">122:電感器</p>
        <p type="p">123:電感器接觸墊對</p>
        <p type="p">124:導熱塗層</p>
        <p type="p">130:焊膏</p>
        <p type="p">140:可選的熱介面材料層</p>
        <p type="p">150:底部填充材料層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="558px" img-content="tif" inline="yes" orientation="portrait" width="731px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622079</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130351</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D487/04</main-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯塔諾利　卡羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASTAGNOLI, CARLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈德格　利奧　阿爾伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARDEGGER, LEO ALBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯迪考斯基　安德列亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORDIKOWSKI, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃裕煦</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/682,044</doc-number>
          <date>20240812</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>CDK2抑制劑的合成和結晶形式</chinese-title>
        <english-title>SYNTHESIS AND CRYSTALLINE FORMS OF A CDK2 INHIBITOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明總體上關於CDK2抑制劑2'-((3-乙氧基-1H-吡唑-4-基)胺基)-7'-((1R,3R)-3-羥基環己基)螺[環丙烷-1,5'-吡咯并[2,3-d]嘧啶]-6'(7'H)-酮或其鹽和/或溶劑合物的結晶形式，其合成，以及在癌症治療中使用該等形式的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention generally relates to crystalline forms of the CDK2 inhibitor 2'-((3-ethoxy-1H-pyrazol-4-yl)amino)-7'-((1R,3R)-3-hydroxycyclohexyl)spiro[cyclopropane-1,5'-pyrrolo[2,3-d]pyrimidin]-6'(7'H)-one or a salt and/or solvate thereof, the synthesis thereof, as well as methods of using the forms in the treatment of cancer.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10031.JPG" file="ed10031.JPG" height="525px" img-content="tif" inline="yes" orientation="portrait" width="929px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622117</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130354</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商再鼎醫藥（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZAI LAB (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商再鼎醫藥（美國）有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZAI LAB (US) LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張路瑤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LUYAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王荔娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李收</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻閃閃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, SHANSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴薪傳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI, XINCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, LINDA N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/110968</doc-number>
          <date>20240809</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/098372</doc-number>
          <date>20250530</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有白細胞介素－３１受體亞基α－抗原結合域的結合分子及其用途</chinese-title>
        <english-title>BINDING MOLECULES WITH AN INTERLEUKIN-31 RECEPTOR SUBUNIT ALPHA-ANTIGEN-BINDING DOMAIN AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文公開了具有能夠抑制IL-31活性的至少一個白細胞介素-31 (IL-31)受體亞基α-抗原結合域(IL-31RA-抗原結合域)的結合分子，用於治療IL-31介導的病症的該結合分子的組合物，該結合分子作為用於治療IL-31介導的病症的藥物的用途，以及使用該結合分子治療IL-31介導的病症的方法。本文還公開了具有能夠抑制IL-31活性的L-31RA-抗原結合域和能夠抑制IL-13活性的IL-13抗原結合域的結合分子，用於治療IL-31介導的病症和/或IL-13介導的病症的該結合分子的組合物，該結合分子作為用於治療IL-31介導的病症和/或IL-13介導的病症的藥物的用途，以及使用該結合分子治療IL-31介導的病症和/或IL-13介導的病症的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein arebinding molecules with at least oneinterleukin-31 (IL-31) receptor subunit alpha-antigen-binding domain (IL-31RA-antigen-binding domain)capable of inhibiting IL-31activity,compositions of such binding molecules for treating IL-31-mediated disorders, uses of such binding moleculesas medicamentsfor treating IL-31-mediated disorders, and methods oftreating IL-31-mediated disordersusing such binding molecules.Also disclosed herein are binding molecules with an IL-31RA-antigen-binding domaincapable of inhibiting IL-31 activity and an IL-13-antigenbinding domain capable of inhibiting IL-13activity, compositions of such binding molecules for treating IL-31-mediated disorders and/or IL-13-mediated disorders,uses of such binding molecules as medicaments for treating IL-31-mediated disordersand/or IL-13-mediateddisorders, and methods of treating IL-31-mediated disorders and/or IL-13-mediated disorders using such binding molecules.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10053.JPG" file="ed10053.JPG" height="464px" img-content="tif" inline="yes" orientation="portrait" width="520px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623498</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130356</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120251017B">H10K59/123</main-classification>
        <further-classification edition="202301120251017B">H10K59/122</further-classification>
        <further-classification edition="202301120251017B">H10K59/40</further-classification>
        <further-classification edition="202301120251017B">H10K50/844</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申東菜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, DONGCHAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔善英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, SUN YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭美眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, MIJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭柱熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JU HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0167671</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示設備</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於一種顯示設備。顯示設備具有顯示區域及圍繞顯示區域之非顯示區域，並包含：基板；設置於基板上之第一、二薄膜電晶體；設置於第一、二薄膜電晶體上之發光裝置，發光裝置包含第一電極、發光層及第二電極；以及設置於發光裝置上之封裝層，其中第一電極、發光層及第二電極在發光區域之至少一部分中具有凹凸結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a display device. The display apparatus has a display area and a non-display area surrounding the display area and comprises: a substrate; a first thin film transistor and a second thin film transistor disposed on the substrate; a light emitting device disposed on the first thin film transistor and the second thin film transistor and comprising a first electrode, an emission layer and a second electrode; and an encapsulation layer disposed on the light emitting device, wherein the first electrode, the emission layer and the second electrode are formed to have a concave-convex structure in at least a portion of an emission region. The display apparatus can improve color viewing angle and light extraction efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示面板</p>
        <p type="p">CSP:裂紋感測圖案</p>
        <p type="p">DA:顯示區域</p>
        <p type="p">DIC:資料驅動器</p>
        <p type="p">FPCB:印刷電路板</p>
        <p type="p">G1P:閘極驅動器</p>
        <p type="p">NDA:非顯示區域</p>
        <p type="p">NDA_S:感測器非顯示區域</p>
        <p type="p">PA1:接墊區域</p>
        <p type="p">PA2:接墊區域</p>
        <p type="p">SH,SH1,SH2:感測孔</p>
        <p type="p">VSSL:低電位電壓線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="909px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621704</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130362</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/7125</main-classification>
        <further-classification edition="200601120260302B">A61K31/712</further-classification>
        <further-classification edition="200601120260302B">A61K38/46</further-classification>
        <further-classification edition="201001120260302B">C12N15/113</further-classification>
        <further-classification edition="202501120260302B">A61K9/127</further-classification>
        <further-classification edition="200601120260302B">A61K47/14</further-classification>
        <further-classification edition="200601120260302B">A61K47/28</further-classification>
        <further-classification edition="200601120260302B">A61K47/24</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
        <further-classification edition="200601120260302B">A61P9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商維爾夫醫療股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERVE THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　阿梅塔　品托　葛西亞　莎拉　克莉絲緹娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE ALMEIDA PINTO GARCIA, SARA CRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
              <english-address>PT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>焦洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAO, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科內爾　利亞姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNELL, LIAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瑞達　斯里尼迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SRIDHAR, SRINIDHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　克里斯多福　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHRISTOPHER J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞斯　卡洛琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REISS, CAROLINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡席微茲　麗莎　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASIEWICZ, LISA N.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寇斯　尼可拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COX, NICHOLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,458</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>活體內基於切口酶之血管收縮素原基因編輯</chinese-title>
        <english-title>IN VIVO NICKASE-BASED EDITING OF THE ANGIOTENSINOGEN GENE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供針對在&lt;i&gt;AGT&lt;/i&gt;基因中實現活體內編輯之基因編輯系統及組合物。本文揭示透過經由基因編輯破壞血管收縮素原之產生來治療或預防疾病，諸如高血壓。本文所揭示者係基於切口酶之基因編輯系統，其經設計成在&lt;i&gt;AGT&lt;/i&gt;之編碼序列中實現插入及/或缺失(插入或缺失變體(indel variants))及/或非同義變體之安裝。該等基於切口酶之基因編輯系統一般包含編碼一或多種切口酶之一或多種mRNA及複數種引導寡核苷酸(例如gRNA)，且可經由合適的遞送系統，諸如脂質奈米顆粒(lipid nanoparticle；LNP) (具有或不具有GalNAc靶向部分)經靜脈內活體內遞送至有需要之哺乳動物個體，或以其他方式作為潛在的單療程或一次性治療向患者投與。本發明亦揭示該等基因編輯系統及組合物之製造、用途及調配。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are gene editing systems and compositions directed to effectuate &lt;i&gt;in vivo&lt;/i&gt; edits in the &lt;i&gt;AGT&lt;/i&gt; gene. Treatment or prevention of a disease, such as hypertension, through disruption of the production of angiotensinogen via genetic editing is disclosed herein. Disclosed are nickase-based gene editing systems designed to effectuate the installation of insertions and/or deletions (indel variants) and/or non-synonymous variants in the coding sequence of &lt;i&gt;AGT&lt;/i&gt;. The nickase-based gene editing systems generally comprise one or more mRNAs that encode one or more nickases and a plurality of guide oligonucleotides (&lt;i&gt;e.g.&lt;/i&gt;, gRNAs) and may be delivered &lt;i&gt;in vivo&lt;/i&gt; to a mammalian subject in need thereof via a suitable delivery system, such as lipid nanoparticles (LNPs) (with or without GalNAc targeting moieties) intravenously, or otherwise, administered to a patient as potentially a single-course or once-and-done therapeutic. The manufacturing, use, and formulation of the gene editing systems and compositions are also disclosed.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10090.JPG" file="ed10090.JPG" height="801px" img-content="tif" inline="yes" orientation="portrait" width="1043px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623218</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130384</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120260223B">H04B10/079</main-classification>
        <further-classification edition="201301120260223B">H04B10/291</further-classification>
        <further-classification edition="201301120260223B">H04B10/54</further-classification>
        <further-classification edition="201301120260223B">H04B10/61</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商無蓋燈光電公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OPENLIGHT PHOTONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派克　瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARKER, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮萊斯　莫莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIELS, MOLLY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史　寒星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, HANXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/798,092</doc-number>
          <date>20240808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具半導體光學放大器之矽光子共用雷射</chinese-title>
        <english-title>SILICON PHOTONIC SHARED LASER WITH SEMICONDUCTOR OPTICAL AMPLIFIERS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種多通道光學發射器包含一分光器，其用於接收由至少一個雷射產生之光且將該光分成複數個部分。複數個半導體光學放大器(SOA)經組態以接收該光之各別部分且放大該等部分以產生放大光。該光學發射器亦包含複數個輸出，其等經組態以輸出由該等SOA產生之該放大光之部分。實例可包含用以調變各通道中之光之調變器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-lane optical transmitter includes an optical splitter to receive light generated by at least one laser and split the light into a plurality of portions. A plurality of semiconductor optical amplifiers (SOAs) are configured to receive respective portions of the light and amplify the portions to generate amplified light. The optical transmitter also includes a plurality of outputs configured to output portions of the amplified light generated by the SOAs. Examples can include modulators to modulate the light in each lane.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:第一光學發射器</p>
        <p type="p">302:矽光子晶粒</p>
        <p type="p">304:共用雷射</p>
        <p type="p">306:1×2分離器</p>
        <p type="p">308:半導體光學放大器(SOA)</p>
        <p type="p">310:1×2分離器</p>
        <p type="p">312:調變器</p>
        <p type="p">314:光纖</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="735px" img-content="tif" inline="yes" orientation="portrait" width="1086px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622502</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130385</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01N33/567</main-classification>
        <further-classification edition="200601120260302B">G01N33/53</further-classification>
        <further-classification edition="202601120260302B">G01N33/575</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関口美知留</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKIGUCHI, MICHIRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋康彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, YASUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-134174</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>癌的檢查劑</chinese-title>
        <english-title>TEST AGENT FOR CANCER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種利用嗅覺受體之癌檢查技術。藉由癌的檢查劑解決上述課題，該癌的檢查劑係包含對於複數種癌具有反應性且該反應性的方向為相同之昆蟲嗅覺受體蛋白質B’。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a cancer testing technique using an olfactory receptor. The aforementioned problem is solved by an agent for testing cancer, which comprises an insect olfactory receptor protein B' having reactivity to a plurality of types of cancers, the direction of whose reactivity is the same.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623666</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130386</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/62</main-classification>
        <further-classification edition="202601120260302B">H10W70/66</further-classification>
        <further-classification edition="200601120260302B">H05K3/38</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
        <further-classification edition="200601120260302B">C03C17/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商愛玻索立克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABSOLICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申東俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, DONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓孟儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/682,787</doc-number>
          <date>20240813</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/292,832</doc-number>
          <date>20250806</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>封裝基板及其製造方法</chinese-title>
        <english-title>PACKAGING SUBSTRATE AND MANUFAACTURING METHOD FOR THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">實例的封裝基板包括：玻璃芯；及附著強化層配置於所述玻璃芯上。附著強化層包括：第一附著強化層；及第二附著強化層，配置於所述第一附著強化層。第一附著強化層包含過渡金屬及矽。第二附著強化層包含過渡金屬。在這種情況下，可以提高電導層相對於玻璃芯的接合力，並可以有效地抑制由玻璃芯和電導層之間的熱膨脹特性差異引起的封裝基板的受損。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">According to the present disclosure, a packaging substrate includes a glass core and an adhesion reinforcement layer disposed on the glass core. The adhesion reinforcement layer includes a first adhesion reinforcement layer and a second adhesion reinforcement layer disposed on the first adhesion reinforcement layer. The first adhesion reinforcement layer includes a transition metal and silicon. The second adhesion reinforcement layer includes a transition metal. In such a case, it is possible to improve the bonding strength of the conductive layer with respect to the glass core, while effectively suppressing damage to the packaging substrate caused by the difference in thermal expansion properties between the glass core and the conductive layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:封裝基板</p>
        <p type="p">10:玻璃芯</p>
        <p type="p">21:附著強化層</p>
        <p type="p">22:第一附著強化層</p>
        <p type="p">23:第二附著強化層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="432px" img-content="tif" inline="yes" orientation="portrait" width="663px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622110</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130429</doc-number>
          <kind></kind>
          <date>114/08/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/24</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商派拉岡醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARAGON THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏席恩　胡桑　席夏姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHAHEEN, HUSSAM HISHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米利根　賈可伯　柯爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLIGAN, JACOB COLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾拉姆　穆罕默德　穆許德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALAM, MOHAMMAD MURSHID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐　傑森　齊　塞格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, JASON ZEE SEUG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈文　彼得　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARWIN, PETER EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇賽拉克　托瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISELAK, TOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>湯普森　肯尼斯　伊凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMPSON, KENNETH EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬汀斯　費爾南多　喬治　內多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTINS, FERNANDO JORGE NETO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
              <english-address>PT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　卡斯特羅　席爾瓦　瑪莉亞　因內斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE CASTRO SILVA, MARIA INES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
              <english-address>PT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　席爾瓦　安娜　瑞塔　阿爾維斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DA SILVA, ANA RITA ALVES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
              <english-address>PT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥斯達　席爾瓦　瑪麗安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COSTA SILVA, MARIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
              <english-address>PT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>道斯　聖多斯　瑪塔　亞歷山卓　馬奎斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOS SANTOS, MARTA ALEXANDRA MARQUES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PT</english-country>
              <english-address>PT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,634</doc-number>
          <date>20240809</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/688,720</doc-number>
          <date>20240829</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/717,144</doc-number>
          <date>20241106</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>美國</country>
          <doc-number>63/758,947</doc-number>
          <date>20250214</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>美國</country>
          <doc-number>63/803,124</doc-number>
          <date>20250509</date>
        </priority-claim>
        <priority-claim sequence="6">
          <country>美國</country>
          <doc-number>63/827,527</doc-number>
          <date>20250620</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含TSLP與IL-13抗體組合之組成物及方法</chinese-title>
        <english-title>COMPOSITIONS AND METHODS COMPRISING COMBINATIONS OF TSLP AND IL-13 ANTIBODIES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文描述結合胸腺基質淋巴生成素(TSLP)與介白素(IL)-13組合的抗體或其抗原結合片段；及其使用方法。在某些態樣中，本文描述抑制TSLP及IL-13生物活性的方法。在某些態樣中，本文描述包含抗TSLP抗體及抗IL-13抗體或其抗原結合片段的醫藥組成物。在某些態樣中，本文所述之抗體及方法用於治療與TSLP及/或IL-13含量升高相關的發炎疾病或病症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are antibodies, or antigen binding fragments thereof, that bind thymic stromal lymphopoietin (TSLP) and interleukin (IL)-13 in combination and methods of use thereof. In certain aspects, described herein are methods of inhibiting TSLP and IL-13 biological activity. In certain aspects, described herein are pharmaceutical compositions comprising the anti-TSLP and anti-IL-13 antibodies, or antigen binding fragments thereof. In certain aspects, the antibodies and methods described herein are used for treatment of an inflammatory disease or disorder associated with elevated levels of TSLP and/or IL-13.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10052.JPG" file="ed10052.JPG" height="394px" img-content="tif" inline="yes" orientation="portrait" width="682px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622288</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130466</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C23C16/46</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本碍子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGK INSULATORS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山名啓太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMANA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昇和宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOBORI, KAZUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村圭一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, KEIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部哲久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TETSUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合祐作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, YUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉武尚輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHITAKE, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-137019</doc-number>
          <date>20240816</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/ JP2025/001931</doc-number>
          <date>20250122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>陶瓷加熱器及陶瓷加熱器之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種陶瓷加熱器，可在板件及軸件接合時抑制熱電偶通路的塌陷或是板件的破裂等情形產生，並可提高板件的均熱性。本發明之陶瓷加熱器包含：具有載置晶圓之第一主面及與第一主面在厚度方向上隔著間隔而配置的第二主面，且內設有藉由通電而發熱之電阻發熱體的板狀之板件、在第二主面中支持板件的筒狀之軸件，及接合於板件的板狀之補助構件。在板件形成有從第二主面往第一主面之方向凹陷，且從位於軸件之內側的起始端延伸至位於軸件之外側之終端的溝槽。補助構件包含：沿著溝槽中位於軸件之外側的外側部分而延伸，且將該外側部分覆蓋住的蓋部，及夾設於板件及軸件，且供軸件之前端部接合的連接部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:依實施態樣1之陶瓷加熱器</p>
        <p type="p">2:板件</p>
        <p type="p">3:軸件</p>
        <p type="p">4:補助構件</p>
        <p type="p">21:第二主面</p>
        <p type="p">22:凹部</p>
        <p type="p">23:第一凹部</p>
        <p type="p">24:第二凹部</p>
        <p type="p">25:突起部</p>
        <p type="p">26:溝槽</p>
        <p type="p">27:第一溝槽部</p>
        <p type="p">28:第二溝槽部</p>
        <p type="p">31:第二開口</p>
        <p type="p">32:軸件之前端部</p>
        <p type="p">33:軸件之基端部</p>
        <p type="p">34:軸件之小徑部</p>
        <p type="p">35:軸件之大徑部</p>
        <p type="p">40:蓋部</p>
        <p type="p">41:連接部</p>
        <p type="p">220:凹部之底面</p>
        <p type="p">230:第一凹部之起始端</p>
        <p type="p">231:第一凹部之終端</p>
        <p type="p">233:第一凹部之底面</p>
        <p type="p">242:第二凹部之底面</p>
        <p type="p">260:溝槽之起始端</p>
        <p type="p">261:溝槽之終端</p>
        <p type="p">262:溝槽之外側部分</p>
        <p type="p">263:溝槽之內側部分</p>
        <p type="p">402:蓋部之第二面</p>
        <p type="p">413:連接部之第二面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="706px" img-content="tif" inline="yes" orientation="portrait" width="668px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202623535</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130468</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
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        <main-classification edition="202601120260302B">H10P50/24</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王柏瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, BAIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　小林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIAOLIN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐萬興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WANXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　振江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUI, ZHENJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　安川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ANCHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/805,783</doc-number>
          <date>20240815</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含矽及鍺材料之選擇性蝕刻</chinese-title>
        <english-title>SELECTIVE ETCHING OF SILICON-AND-GERMANIUM-CONTAINING MATERIAL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">示範性的半導體處理方法可能包含提供含氟前驅物和次級前驅物至半導體處理腔室的處理區域。次級前驅物可能為或包含含碳前驅物、含氫前驅物、含氮前驅物或含氧前驅物。基板可能裝設於處理區域內。含矽材料和含矽及鍺材料可能安置於基板上。這些方法可能包含將基板與含氟前驅物及次級前驅物接觸。這些方法可能包含選擇性地從基板上移除含矽及鍺材料的至少一部分。處理區域可能維持在高於或約200°C的溫度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary semiconductor processing methods may include providing a fluorine-containing precursor and a secondary precursor to a processing region of a semiconductor processing chamber. The secondary precursor may be or include a carbon-containing precursor, a hydrogen-containing precursor, a nitrogen-containing precursor, or an oxygen-containing precursor. A substrate may be housed within the processing region. A silicon-containing material and a silicon-and-germanium-containing material may be disposed on the substrate. The methods may include contacting the substrate with the fluorine-containing precursor and the secondary precursor. The methods may include selectively removing at least a portion of the silicon-and-germanium-containing material from the substrate. The processing region may be maintained at a temperature of greater than or about 200 °C.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">405:操作</p>
        <p type="p">410:操作</p>
        <p type="p">415:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="602px" img-content="tif" inline="yes" orientation="portrait" width="589px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622284</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130475</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C23C16/455</main-classification>
        <further-classification edition="200601120260224B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐德　羅西特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODE, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/804,980</doc-number>
          <date>20240814</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有精確溫度和流量控制的多站基板處理腔室</chinese-title>
        <english-title>MULTI-STATION SUBSTRATE PROCESSING CHAMBER WITH PRECISE TEMPERATURE AND FLOW CONTROL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供多站基板處理腔室和方法，該腔室多站基板處理包括在腔室壁內的四個空間上分離的基板處理站。對四個空間上分離的基板處理站中的每一者的獨立控制的加熱區以及獨立加熱的供應導管改善了在四個空間上分離的基板處理站中每一者中同時處理的基板的沉積均勻性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Multiple station substrate processing chambers and methods are provided comprising four spatially separated substrate processing stations within a chamber wall are described. Independently controlled heating zones to the each of four spatially separated substrate processing stations and independently heated supply lines improve deposition uniformity of substrates simultaneously processed in each of the each of four spatially separated substrate processing stations.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多站基板處理腔室</p>
        <p type="p">104:腔室壁</p>
        <p type="p">110:基板處理站</p>
        <p type="p">111a:第一傳送導管</p>
        <p type="p">111c:第三傳送導管</p>
        <p type="p">111d:第四傳送導管</p>
        <p type="p">113a:第一加熱區</p>
        <p type="p">113b:第三加熱區</p>
        <p type="p">113c:第五加熱區</p>
        <p type="p">113d:第七加熱區</p>
        <p type="p">115a:第二加熱區</p>
        <p type="p">115b:第四加熱區</p>
        <p type="p">115c:第六加熱區</p>
        <p type="p">115d:第八加熱區</p>
        <p type="p">117a:第一站出口</p>
        <p type="p">117b:第三站出口</p>
        <p type="p">117c:第三站出口</p>
        <p type="p">117d:第七站出口</p>
        <p type="p">119a:第二站出口</p>
        <p type="p">119b:第四站出口</p>
        <p type="p">119c:第四站出口</p>
        <p type="p">119d:第八站出口</p>
        <p type="p">120:基板處理站</p>
        <p type="p">130:基板處理站</p>
        <p type="p">140:基板處理站</p>
        <p type="p">152:第一供應導管</p>
        <p type="p">154:第二供應導管</p>
        <p type="p">160:頂板</p>
        <p type="p">200:第一前驅物供應</p>
        <p type="p">210:第二前驅物供應</p>
        <p type="p">250:第一控制器</p>
        <p type="p">252:電源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="670px" img-content="tif" inline="yes" orientation="portrait" width="783px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622985</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130479</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120251001B">G16H10/40</main-classification>
        <further-classification edition="201301120251001B">G06F3/0482</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉厚志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森弘樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飛田史子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBITA, FUMIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小西弥生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONISHI, YAYOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合知玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, TOMOAKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202970</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>自動分析系統及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 在自動分析裝置中將已發生的多個事件彙整為單一的標記來顯示的情況下，能夠容易掌握單一的標記所代表的多個事件中包含的異常事件。  &lt;br/&gt;　　[解決手段] 有關本發明的自動分析系統，係將自動分析裝置中發生之多個事件中，發生時刻在規定時距內連續者，彙整為單一標記並顯示，並且強調顯示符合規定條件的前述標記。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="649px" img-content="tif" inline="yes" orientation="portrait" width="790px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621902</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130509</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120260224B">B33Y80/00</main-classification>
        <further-classification edition="200601120260224B">C23C16/44</further-classification>
        <further-classification edition="200601120260224B">C23C16/448</further-classification>
        <further-classification edition="200601120260224B">C23C16/455</further-classification>
        <further-classification edition="200601120260224B">C23C16/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛　沙拉傑特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, SARAVJEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇柏拉曼央　普拉迪庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUBRAHMANYAN, PRADEEP KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐內坎蒂　哈里基申</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PONNEKANTI, HARI KISHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　賢奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYEON GEU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪莫爾　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEEMER, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　元在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WONJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/682,234</doc-number>
          <date>20240812</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/293,902</doc-number>
          <date>20250807</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於處理腔室的多通道噴淋頭</chinese-title>
        <english-title>MULTICHANNEL SHOWERHEAD FOR PROCESSING CHAMBERS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭露的實施例包含部署了氣體噴淋頭的系統和技術，該氣體噴淋頭具有第一表面、第二表面和側表面。該氣體噴淋頭包含一或多個輸送通道，每個輸送通道包含通過第一表面或側表面中的至少一者的一或多個入口埠，以及通過第二表面的複數個出口埠。該氣體噴淋頭進一步包含排放通道，該排放通道具有通過第二表面的複數個排放入口埠，以及通過第一表面、第二表面或側表面中的至少一者的一或多個排放出口埠。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed embodiments include systems and techniques that deploy a gas showerhead having a first surface, a second surface, and a side surface. The gas showerhead includes one or more delivery channels, each delivery channel including one or more inlet ports through at least one of the first surface or the side surface, and a plurality of outlet ports through the second surface. The gas showerhead further includes an exhaust channel having a plurality of exhaust inlet ports through the second surface, and one or more exhaust outlet ports through at least one of the first surface, the second surface, or the side surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">106:處理腔室</p>
        <p type="p">110:基板</p>
        <p type="p">140:腔室主體</p>
        <p type="p">142:內部空間</p>
        <p type="p">162:吸盤</p>
        <p type="p">164:軸線</p>
        <p type="p">300:多通道噴淋頭</p>
        <p type="p">302:輸送通道</p>
        <p type="p">302-1:垂直導管</p>
        <p type="p">302-2:垂直導管</p>
        <p type="p">302-3:垂直導管</p>
        <p type="p">302-4:垂直導管</p>
        <p type="p">304:輸送通道</p>
        <p type="p">304-1:出口埠</p>
        <p type="p">304-2:出口埠</p>
        <p type="p">304-3:出口埠</p>
        <p type="p">304-4:出口埠</p>
        <p type="p">306:排放通道</p>
        <p type="p">306-1:排放入口埠</p>
        <p type="p">306-2:排放入口埠</p>
        <p type="p">306-3:排放入口埠</p>
        <p type="p">306-4:排放入口埠</p>
        <p type="p">306-5:排放入口埠</p>
        <p type="p">310:法蘭</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="618px" img-content="tif" inline="yes" orientation="portrait" width="637px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621892</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130510</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120260226B">B31D5/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商普里吉斯有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PREGIS LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋茨奇　湯瑪斯Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WETSCH, THOMAS D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>切斯　肯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHESS, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬伊斯　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOYCE, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬扎萊克　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARSZALEK, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,757</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於緩衝材裝置的後揉皺器卡紙偵測器</chinese-title>
        <english-title>POST-CRUMPLER JAM DETECTOR FOR DUNNAGE DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於產生緩衝材的裝置包括卡紙偵測器，卡紙偵測器係位於揉皺器的下游與裝置的出口導槽的上游，並經配置以偵測揉皺器與出口導槽之間的緩衝材的卡紙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for producing dunnage includes a jam detector located downstream of a crumpler and upstream of an outlet chute of the device and configured to detect a jam of the dunnage between the crumpler and the outlet chute.</p>
      </isu-abst>
      <representative-img>
        <p type="p">15:緩衝材</p>
        <p type="p">62:出口導槽</p>
        <p type="p">201:切割馬達組件</p>
        <p type="p">202:切割馬達</p>
        <p type="p">400:下游卡紙偵測器</p>
        <p type="p">402:活門</p>
        <p type="p">403:出口導槽側壁</p>
        <p type="p">406:主表面</p>
        <p type="p">407:距離</p>
        <p type="p">418:銷</p>
        <p type="p">420:凹部</p>
        <p type="p">422:感測器</p>
        <p type="p">424:背表面</p>
        <p type="p">428:主體</p>
        <p type="p">448:導引器</p>
        <p type="p">500:區域</p>
        <p type="p">600:驅動組件</p>
        <p type="p">610:輥輪</p>
        <p type="p">611:軸件</p>
        <p type="p">620:輥輪</p>
        <p type="p">621:軸件</p>
        <p type="p">700:上游卡紙偵測器</p>
        <p type="p">701:導引器</p>
        <p type="p">702:致動器</p>
        <p type="p">722:感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.JPG" file="ed10026.JPG" height="701px" img-content="tif" inline="yes" orientation="portrait" width="910px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622222</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130511</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C11D3/14</main-classification>
        <further-classification edition="200601120260226B">C11D3/22</further-classification>
        <further-classification edition="200601120260226B">C11D17/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商3Ｍ新設資產公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>3M INNOVATIVE PROPERTIES COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　麗蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LYLIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　亦帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋　禮明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, LIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鉉濬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUNJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞弗　約瑟夫　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYPHER, JOSEPH J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡偉立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, WEI LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>費納　薩拉　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FEINER, SARAH J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤林斯基　傑佛瑞　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZELINSKY, JEFFREY E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫寶成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024111014603</doc-number>
          <date>20240812</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>適用於水可崩解基底的界面活性劑塗層組成物及方法</chinese-title>
        <english-title>SURFACTANT COATING COMPOSITIONS AND PROCESSES TAILORED FOR WATER-DISINTEGRABLE SUBSTRATES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種製品，該製品包括水可崩解基底及施加至該基底的表面上的組成物。該組成物包含約3重量%至約50重量%的界面活性劑、約0.01重量%至約5重量%的水溶性增稠劑、及約0.5重量%至約55重量%的磨料。該製品具有根據INDA FG502.R1(18)晃動箱測試方法的至少約40%的崩解因子。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is an article including a water-disintegrable substrate and a composition applied onto a surface of the substrate. The composition includes between about 3% to about 50% by weight of a surfactant, between about 0.01% to about 5% by weight of water-soluble thickener, and between about 0.5% to about 55% by weight of an abrasive. The article has a disintegration factor according to the INDA FG502.R1(18) Slosh Box Test Method of at least about 40%.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="170px" img-content="tif" inline="yes" orientation="portrait" width="393px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623174</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130533</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">H02M3/335</main-classification>
        <further-classification edition="200601120251103B">H02M3/04</further-classification>
        <further-classification edition="200601120251103B">H02M7/217</further-classification>
        <further-classification edition="200601120251103B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商光寶科技新加坡私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡南洋理工大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANYANG TECHNOLOGICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, ZHIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐燚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖子衡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, ZIHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄧飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENG, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, SHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　翊勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, YI CHYN CASSANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林素華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>涂綺玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,506</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/228,951</doc-number>
          <date>20250605</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多級LLC諧振轉換器及用於其的操作方法</chinese-title>
        <english-title>MULTI-LEVEL LLC CONVERTER AND OPERATION METHOD THEREFOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">於本揭露的一方面中，一種用於平衡多級LLC諧振轉換器的橋接電路的電容電壓的操作方法包括：測量橋接電路的電容開關模組的電容電壓、多級LLC諧振轉換器的整流電路的輸出負載的輸出電壓及輸出電流、及橋接電路的輸入電壓；根據輸出負載的輸出電壓及橋接電路的輸入電壓從對應多個電容的數量的多個電壓位準區域的數量中，選擇橋接電路的所需輸出電壓的電壓位準區域；從對應於電壓位準區域的至少一電路模式中，選擇具有橋接電路的所需輸出電壓的最高值的電路模式；以及輸出對應於電路模式的具有切換頻率的脈衝寬度調變訊號至電容開關模組的開關。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In an aspect of the disclosure, an operation method, for balancing voltage of capacitors of a bridge circuit of a multi-level LLC resonant converter, includes: measuring voltages of the capacitors of the bridge circuit, an output voltage and an output current of an output load the multi-level LLC resonant converter, and an input voltage of the bridge circuit; selecting a voltage-level zone of a required output voltage of the bridge circuit according to the output voltage of the output load, and the input voltage of the bridge circuit; selecting a circuit mode, with a highest value of the required output voltage; and outputting PWM signals corresponding to the circuit mode, with a switching frequency, to switches of the multiple capacitor-switch modules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:多級LLC諧振轉換器</p>
        <p type="p">110:橋接電路</p>
        <p type="p">111-1~111-n:電容開關模組</p>
        <p type="p">120:LLC諧振槽</p>
        <p type="p">130:整流電路</p>
        <p type="p">131:輸出負載</p>
        <p type="p">140:控制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="564px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622404</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130550</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">F16K27/02</main-classification>
        <further-classification edition="200601120260225B">F16K11/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭有機材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI YUKIZAI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松元一樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, KAZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-140923</doc-number>
          <date>20240822</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>歧管閥</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種能夠減少在流路內產生的滯留部的歧管閥。  &lt;br/&gt;　　本歧管閥(1)，其結構為具有流體從各閥室(2b、2c)的上部朝切線方向流入的入口迴旋流路(32)，並具有流體從各閥室(2b、2c)的下部朝切線方向流出的出口迴旋流路(33)，且具備在每個閥室(2b、2c)連續地產生迴旋流(RF)的流路結構(31)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:第1閥室(上游側閥室)</p>
        <p type="p">2b:第2閥室(閥室)</p>
        <p type="p">2c:第3閥室(閥室)</p>
        <p type="p">2d:第4閥室(閥室)</p>
        <p type="p">7:第1閥室in埠</p>
        <p type="p">8:第1閥室out流路</p>
        <p type="p">11:第4閥室in流路</p>
        <p type="p">12:第4閥室out埠</p>
        <p type="p">31:流路結構</p>
        <p type="p">32:入口迴旋流路</p>
        <p type="p">33:出口迴旋流路</p>
        <p type="p">36:第2閥室in流路</p>
        <p type="p">37:第2閥室out流路</p>
        <p type="p">38:第3閥室in流路</p>
        <p type="p">39:第3閥室out流路</p>
        <p type="p">RF:迴旋流</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10030.JPG" file="ed10030.JPG" height="645px" img-content="tif" inline="yes" orientation="portrait" width="1013px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623058</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130552</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊諾森德勒　約翰　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INNOCENT-DOLOR, JON-L</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/806,542</doc-number>
          <date>20240815</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>利用連續偏壓功率及源功率的電漿處理系統</chinese-title>
        <english-title>PLASMA PROCESSING SYSTEM WITH CONTINUOUS BIAS POWER AND SOURCE POWER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電漿處理系統包含：一腔室，設置以容置電漿於一處理空間內；一晶圓固持件，設置以放置一構造於該腔室內，其中該構造設置以由該電漿蝕刻；一第一腔室元件，布置於該晶圓固持件的一第一側並施加以一第一訊號；及一第二腔室元件，布置在該晶圓固持件的一第二側並施加以一第二訊號，該第二側相對於該第一側。該第一訊號與一第一固定頻率相關聯，且該第二訊號與一第二固定頻率相關聯。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A plasma processing system includes a chamber configured to house plasma in a process space; a wafer holder configured to place a structure in the chamber, wherein the structure is configured to be etched by the plasma; a first chamber component arranged on a first side of the wafer holder and is applied with a first signal; and a second chamber component arranged on a second side of the wafer holder and is applied with a second signal, the second side opposite to the first side. The first signal is associated with a first constant frequency, and the second signal is associated with a second constant frequency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電漿處理系統</p>
        <p type="p">110:電漿處理腔室</p>
        <p type="p">112:處理空間</p>
        <p type="p">114:電漿</p>
        <p type="p">120:上總成</p>
        <p type="p">126:上電極盤</p>
        <p type="p">128:上電極</p>
        <p type="p">129:功率供應器</p>
        <p type="p">130:側總成</p>
        <p type="p">139:功率供應器</p>
        <p type="p">140:基板固持件</p>
        <p type="p">142:下電極</p>
        <p type="p">145:基板</p>
        <p type="p">150:幫浦風管</p>
        <p type="p">160:聚焦環</p>
        <p type="p">162:屏蔽環</p>
        <p type="p">164:貝婁屏蔽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.bmp" file="ed10004.bmp" height="630px" img-content="tif" inline="yes" orientation="portrait" width="910px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623059</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130572</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01J37/32</main-classification>
        <further-classification edition="200601120260224B">H05H1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅茲　安祖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>METZ, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊利　安潔莉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RALEY, ANGELIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/807,728</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>斜角特徵部形成方法</chinese-title>
        <english-title>METHOD FOR ANGLED FEATURE FORMATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板處理方法，包含將該基板裝載到基板固持件上，該基板固持件係耦接至掃描工具且被設置在處理腔室中，該基板包含被設置在下方層上方的蝕刻遮罩。該方法更包含使用該掃描工具，將該基板固持件相對於電漿炬以一傾斜角度進行定向，該電漿炬係設置在該處理腔室中且包含電漿噴嘴。該方法更包含使用該電漿炬在該基板固持件的一區域上方產生電漿射流，且在維持該電漿噴嘴的端部與該基板的表面之間的距離的同時，將該基板相對於該電漿射流進行掃描，從而在該下方層上以該傾斜角度形成特徵部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for processing a substrate includes loading the substrate on a substrate holder coupled to a scanning tool and disposed in a processing chamber, the substrate including an etch mask disposed over an underlying layer. The method further includes orienting, using the scanning tool, the substrate holder relative to a plasma torch at a tilt angle, the plasma torch being disposed in the processing chamber and including a plasma nozzle, the tilt angle being an angle between the plasma torch and a normal direction of the substrate holder. And the method further includes generating, using the plasma torch, a plasma jet over an area of the substrate holder, and scanning, while maintaining a distance between an end of the plasma nozzle and a surface of the substrate, the substrate relative to the plasma jet to form features on the underlying layer at the tilt angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">52:蝕刻遮罩</p>
        <p type="p">54:待圖案化層</p>
        <p type="p">56:下方層</p>
        <p type="p">58:電漿粒子</p>
        <p type="p">59a,59b,59c:特徵部</p>
        <p type="p">140:晶圓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="446px" img-content="tif" inline="yes" orientation="portrait" width="746px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623060</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130577</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01J37/32</main-classification>
        <further-classification edition="200601120260224B">H05H1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪瑞卡塔諾　艾力西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARAKHTANOV, ALEXEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智　賓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, BING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>露千西　肯尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUCCHESI, KENNETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍藍德　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLLAND, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/684,284</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>利用對上電極之高頻RF訊號及從屬低頻RF訊號進行電漿製程控制的電漿腔室</chinese-title>
        <english-title>PLASMA CHAMBER WITH HIGH FREQUENCY RF SIGNAL AND SLAVE LOW FREQUENCY RF SIGNAL TO UPPER ELECTRODE FOR PLASMA PROCESS CONTROL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文說明一種系統，包含具有位於下電極上方之上電極的電漿室。第一低頻射頻(RF)產生器係電耦合至下電極，用於在一頻率及第一相位下供應第一低頻RF訊號。第二低頻RF產生器係電耦合至上電極，用於以第一頻率及第二相位來供應第二低頻RF訊號。相位控制器係基於預定時間區間來決定第一及第二低頻RF訊號之間的相位偏移，該預定時間區間係與第一低頻RF訊號之最大值的出現時間及第二低頻RF訊號之最小值的出現時間相關，其中第二相位係基於該相位偏移來設定。高頻RF產生器係電耦合至上電極，以供應高頻RF訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system including a plasma chamber with an upper electrode above a lower electrode. A first low frequency radio frequency (RF) generator is electrically coupled to the lower electrode to supply a first low frequency RF signal at a frequency and a first phase. A second low frequency RF generator is electrically coupled to the upper electrode to supply a second low frequency RF signal at the first frequency and a second phase. A phase controller determines a phase offset between the first and second low frequency RF signals based on a predetermined time period related to an occurrence of a maximum of the first low frequency RF signal and an occurrence of a minimum of the second low frequency RF signal, wherein the second phase is based on the phase offset. A high frequency RF generator is electrically coupled the upper electrode to supply a high frequency RF signal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:雙頻匹配電路</p>
        <p type="p">310:高頻RF匹配電路</p>
        <p type="p">311:輸入節點</p>
        <p type="p">312:節點</p>
        <p type="p">320:低頻RF匹配電路</p>
        <p type="p">321:輸入節點</p>
        <p type="p">322:節點</p>
        <p type="p">323:節點</p>
        <p type="p">324:節點</p>
        <p type="p">328:直流電壓(VDC)感測器系統</p>
        <p type="p">329:電壓(V)感測器系統</p>
        <p type="p">350:輸出節點</p>
        <p type="p">C1~C8:電容器</p>
        <p type="p">L1~L4:電感器</p>
        <p type="p">R1~R2:電阻器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="777px" img-content="tif" inline="yes" orientation="portrait" width="1035px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621738</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130608</doc-number>
          <kind></kind>
          <date>114/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/395</main-classification>
        <further-classification edition="200601120260302B">C07K16/18</further-classification>
        <further-classification edition="200601120260302B">A61P25/28</further-classification>
        <further-classification edition="200601120260302B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商賽神醫藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCINEURO THERAPEUTICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩姆塞爾　雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSEL, JAKOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　祖盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZUSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴　永哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YOUNG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯　瑪麗　伊莉莎白</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS, MARY ELIZABETH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬汀　尤香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARTENS, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安　剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AN, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>利　民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/681,564</doc-number>
          <date>20240809</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>強效之聚集體選擇性抗Aβ抗體及其用途</chinese-title>
        <english-title>POTENT, AGGREGATE-SELECTIVE ANTI-AΒ ANTIBODIES AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供靶向聚集形式之類澱粉蛋白-β (Aβ)肽的結合劑、包含本發明結合劑之核酸、包含本發明核酸之載體及細胞以及其醫藥組合物。本發明亦提供藉由投與該等結合劑或其組合物來治療或預防哺乳動物之疾病、病症或病狀，尤其阿茲海默氏病(Alzheimer's disease)的方法。本發明進一步提供用於誘導哺乳動物清除聚集形式之類澱粉蛋白-β (Aβ)肽的方法，該方法包含投與本文所描述之本發明結合劑及醫藥組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides binding agents targeted to the aggregated form of amyloid-beta (Aβ) peptide, nucleic acids comprising the inventive binding agents, vectors and cells comprising the inventive nucleic acids, and pharmaceutical compositions thereof. The invention also provides methods for treating or preventing a disease, disorder, or condition, in particular, Alzheimer's disease, in a mammal, by administering the binding agents or compositions thereof. The invention further provides methods for inducing clearance of an aggregated form of amyloid-beta (Aβ) peptide in a mammal, comprising administering the inventive binding agents and pharmaceutical compositions described herein.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10077.JPG" file="ed10077.JPG" height="662px" img-content="tif" inline="yes" orientation="portrait" width="724px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622138</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130686</doc-number>
          <kind></kind>
          <date>114/08/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C08G18/18</main-classification>
        <further-classification edition="200601120260226B">C09D175/12</further-classification>
        <further-classification edition="200601120260226B">C08K5/33</further-classification>
        <further-classification edition="200601120260226B">C08F2/38</further-classification>
        <further-classification edition="200601120260226B">C11D1/40</further-classification>
        <further-classification edition="200601120260226B">C09D5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東楚股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野口周人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOGUCHI, SHUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田斉弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小山貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OYAMA, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-172596</doc-number>
          <date>20241001</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>塗料組合物及塗膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種塗料組合物，其含有（A）多元醇、（B）封閉型聚異氰酸酯（blocked polyisocyanate）及（C）封閉劑解離觸媒，前述（A）成分的酸值為3～30mgKOH／g，前述（C）成分包含四級銨鹽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623387</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130700</doc-number>
          <kind></kind>
          <date>114/08/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260224B">H10D30/01</main-classification>
        <further-classification edition="202501120260224B">H10D30/67</further-classification>
        <further-classification edition="202501120260224B">H10D30/62</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　雨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪榮軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RONGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛吉斯　莫西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERGHESE, MOHITH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉冰倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, BINGQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳哲遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHEYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅米洛　荷西</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROMERO, JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐　先敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, XIANMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龔　則敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUNG, TZA-JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/683,734</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>將鉬塞或溝槽外表面進行化學鈍化，以防止鉬氮化或氧化並保持低接觸電阻</chinese-title>
        <english-title>CHEMICAL PASSIVATION OF MOLYBDENUM PLUG OR TRENCH'S OUTER SURFACE TO PREVENT MO NITRIDATION OR OXIDATION AND MAINTAIN LOW CONTACT RESISTANCE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包含在半導體元件結構的介電層內形成的特徵中所形成的至少一個電氣連接上，形成金屬填充材料。該金屬填充材料部分填充該特徵，該部分填充的特徵包括金屬填充材料和特徵的側壁的暴露第一部分，該部分包括介電層的材料，以及在側壁的第二部分和金屬填充材料的側壁之間形成的間隙區域，並對半導體元件結構執行浸泡製程，以在金屬填充材料表面上形成鈍化層，且包含安置於間隙內的金屬填充材料的一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes forming a metal fill material on at least one electrical connection formed in a feature formed within a dielectric layer of a semiconductor device structure. The metal fill material partially fills the feature, the partially filled feature comprises the metal fill material and an exposed first portion of a sidewall of the feature that comprises the material of the dielectric layer, and a gap region formed between a second portion of the sidewall and a sidewall of the metal fill material, and performing a soaking process on the semiconductor device structure to form a passivation layer over a surface of the metal fill material and including a portion of the metal fill material disposed within the gap.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301:介電層</p>
        <p type="p">302:元件基板</p>
        <p type="p">303:下伏金屬層</p>
        <p type="p">304:介電層</p>
        <p type="p">304u:上表面</p>
        <p type="p">305:蝕刻終止層</p>
        <p type="p">307:電氣連接</p>
        <p type="p">320:金屬填充材料</p>
        <p type="p">D2:第二深度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="403px" img-content="tif" inline="yes" orientation="portrait" width="596px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623361</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130761</doc-number>
          <kind></kind>
          <date>114/08/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B41/27</main-classification>
        <further-classification edition="202301120260302B">H10B43/27</further-classification>
        <further-classification edition="202601120260302B">H10P34/42</further-classification>
        <further-classification edition="202601120260302B">H10W10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮地克典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYACHI, KATSUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206940</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體記憶裝置及半導體記憶裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於使通道層充分結晶化。  &lt;br/&gt;本發明係關於一種半導體記憶裝置及半導體記憶裝置之製造方法。實施方式之半導體記憶裝置具備：第1積層體，其係複數個第1導電層與複數個第1絕緣層於第1方向交替積層；第2積層體，其係複數個第2導電層與複數個第2絕緣層於上述第1方向交替積層，且沿垂直於上述第1方向之第2方向與上述第1積層體分開；板狀部，其設置於上述第1積層體與上述第2積層體之間，沿垂直於上述第1方向及上述第2方向之第3方向延伸；柱，其於上述第2方向與上述板狀部分開設置，包含沿上述第1方向於上述第1積層體內延伸之第1半導體層；位元線，其設置於較上述第1積層體及上述第2積層體更下側，與上述柱電性連接；第2半導體層，其設置於較上述第1積層體及上述第2積層體更上側；第3半導體層，其設置於較上述第2半導體層更上側；第3絕緣層，其設置於上述板狀部與上述第3半導體層之間；及第4半導體層，其以覆蓋上述柱及上述第3半導體層之方式設置，與上述第1半導體層連接；上述板狀部具有較上述第2半導體層位於更上方之突出部，上述第3半導體層覆蓋上述突出部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">24:導電層</p>
        <p type="p">52:絕緣層</p>
        <p type="p">53:絕緣層</p>
        <p type="p">54:絕緣層</p>
        <p type="p">55:絕緣層</p>
        <p type="p">60:絕緣層</p>
        <p type="p">ASL:輔助源極線</p>
        <p type="p">BL:位元線</p>
        <p type="p">BM:障壁金屬層</p>
        <p type="p">CH:插塞</p>
        <p type="p">CN:通道層</p>
        <p type="p">CP:蓋層</p>
        <p type="p">CR:核心層</p>
        <p type="p">DSLa:阻擋層</p>
        <p type="p">DSLb:主源極線</p>
        <p type="p">LI:板狀觸點</p>
        <p type="p">LM:積層體</p>
        <p type="p">LMa:積層體</p>
        <p type="p">LMb:積層體</p>
        <p type="p">ME:記憶體層</p>
        <p type="p">OL:絕緣層</p>
        <p type="p">OSL:中間絕緣層</p>
        <p type="p">PL:柱</p>
        <p type="p">SGD0:選擇閘極線</p>
        <p type="p">SGD1:選擇閘極線</p>
        <p type="p">SGS0:選擇閘極線</p>
        <p type="p">SGS1:選擇閘極線</p>
        <p type="p">SHE:分離層</p>
        <p type="p">SL:源極線</p>
        <p type="p">TS:金屬層</p>
        <p type="p">WL:字元線</p>
        <p type="p">Y:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="562px" img-content="tif" inline="yes" orientation="portrait" width="700px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623562</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130772</doc-number>
          <kind></kind>
          <date>114/08/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
        <further-classification edition="202601120260302B">H10P95/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商布魯克斯自動機械美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格西諾　胡斯托</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRACIANO, JUSTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾森　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARLSON, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/682,610</doc-number>
          <date>20240813</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有可選擇的容器介面及埠配置的處理工具</chinese-title>
        <english-title>PROCESSING TOOL WITH SELECTABLE CONTAINER INTERFACE AND PORT CONFIGURATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝載埠，用於基板處理設備，包括：框體，具有可關閉的開口，其與匹配於裝載埠的基板載體連通，載體具有使載體開啟和關閉的載體門；以及裝載埠門，連接到框體且佈置為開啟和關閉開口。裝載埠門具有裝載埠門對載體門介面，其使裝載埠門與載體門耦接並開啟載體門。裝載埠門對載體門介面為可重新配置的，使得介面將配置從第一介面配置切換為第二介面配置，第一和第二介面配置分別與不同的載體門之不同的對應載體門適配相符合，使得裝載埠門共用地裝配並耦接到各具有彼此不同的載體門適配佈置之不同的載體門。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A load port, for a substrate processing apparatus, includes: a frame with a closable opening that communicates with a substrate carrier mated to the load port, the carrier has a carrier door that opens and closes the carrier; and a load port door connected to the frame and arranged to open and close the opening. The load port door having a load port door to carrier door interface that couples the load port door with and opens the carrier door. The load port door to carrier door interface is re-configurable so that the interface switches configurations from a first interface configuration to a second interface configuration, the first and second interface configurations respectively conform with different corresponding carrier door fits, of different carrier doors, so that the load port door commonly fits up and couples with different carrier doors each with carrier door fit arrangements different from each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">130D:裝載埠門</p>
        <p type="p">600A,600B,600C:(定位)銷</p>
        <p type="p">610A,610B,610C,610D:閂鎖鍵</p>
        <p type="p">LPF:介面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.png" file="d10016.TIF" giffile="ed10016.png" height="616px" img-content="tif" inline="yes" orientation="portrait" width="692px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622074</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130809</doc-number>
          <kind></kind>
          <date>114/08/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D471/04</main-classification>
        <further-classification edition="200601120260302B">C07D239/60</further-classification>
        <further-classification edition="200601120260302B">C07C275/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商海思科醫藥集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAISCO PHARMACEUTICAL GROUP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭軍輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, JUNHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳清平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, QINGPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊代勝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, DAISHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甘滿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAN, MAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾佳翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, JIAHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>隆元強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONG, YUANQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王世明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SHIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋世鏵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, SHIHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, JIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竇贏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOU, YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024111105161</doc-number>
          <date>20240814</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024117219753</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>三環稠雜環類ＰＤＥ３／４雙重抑制劑及其中間體的製備方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種三環稠雜環類PDE3/4雙重抑制劑（式（I））及其關鍵中間體的製備方法，該方法反應路線新穎，反應條件溫和，操作簡單，反應產率高，產品純度高，後處理方便，適合於工業化生產。&lt;br/&gt;&lt;img align="absmiddle" height="147px" width="285px" file="ed10063.JPG" alt="ed10063.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622630</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130817</doc-number>
          <kind></kind>
          <date>114/08/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260226B">G03F1/84</main-classification>
        <further-classification edition="200601120260226B">G01N21/88</further-classification>
        <further-classification edition="200601120260226B">G01N21/95</further-classification>
        <further-classification edition="200601120260226B">G01N21/956</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科磊股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KLA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>愛特瑞　法里德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ATRY, FARID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
              <english-address>IR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢卡諾維　亞歷山德爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYKANOV, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅森瑟　亞隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSENTHAL, ALON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>是　瑞方</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHI, RUI-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/682,425</doc-number>
          <date>20240813</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/295,224</doc-number>
          <date>20250808</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於檢測工具之光子高效場均勻性增強</chinese-title>
        <english-title>PHOTON EFFICIENT FIELD UNIFORMITY ENHANCEMENT FOR INSPECTION TOOLS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種掃描帶(swath)成像系統，其可包含：一照明源，其經組態以用一照明光束照明一樣本；一載物台，其用以在實施檢測配方時用包含沿著一掃描方向延伸之掃描帶之一掃描圖案掃描該樣本；一或多個TDI感測器，其經組態以擷取該樣本之掃描帶影像；及一控制器。該複數個掃描帶可沿著正交於該掃描方向之一步進方向分佈，且該複數個掃描帶影像之至少一些沿著該步進方向重疊。該控制器可藉由以下實施該檢測配方：接收該複數個掃描帶影像；將該複數個掃描帶影像組合成一均勻化影像，其中該複數個掃描帶影像之重疊部分在該均勻化影像內被組合；及基於該均勻化影像產生該樣本之一或多個量測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A swath imaging system may include an illumination source configured to illuminate a sample with an illumination beam, a stage to scan the sample with a scan pattern including swaths extending along a scan direction when implementing the inspection recipe, one or more TDI sensors configured to capture swath images of the sample, and a controller. The plurality of swaths may be distributed along a step direction orthogonal to the scan direction, and at least some of the plurality of swath images overlap along the step direction. The controller may implement the inspection recipe by receiving the plurality of swath images, combining the plurality of swath images into a uniformized image where overlapping portions of the plurality of swath images are combined within the uniformized image, and generating one or more measurements of the sample based on the uniformized image.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:方法</p>
        <p type="p">202:步驟</p>
        <p type="p">204:步驟</p>
        <p type="p">206:步驟</p>
        <p type="p">208:步驟</p>
        <p type="p">210:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10070.JPG" file="ed10070.JPG" height="771px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622249</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130819</doc-number>
          <kind></kind>
          <date>114/08/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260302B">C12Q1/6827</main-classification>
        <further-classification edition="201801120260302B">C12Q1/6837</further-classification>
        <further-classification edition="201901120260302B">G16B20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商贏創運營有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EVONIK OPERATIONS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛伊　蘇其</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROY, SUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　靈芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, LINGZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納格拉傑　桑賈納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGARAJAN, SANJANAA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　潔盈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, KIT YENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊格維　伊米卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IGWE, EMEKA IGNATIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯爾　弗洛里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHL, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24194837.1</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於ＣＨＯ細胞之表觀遺傳時鐘</chinese-title>
        <english-title>AN EPIGENETIC CLOCK FOR CHO CELLS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關一種用於預測測試中國倉鼠卵巢(CHO)細胞或測試CHO細胞之群體之實足年齡之活體外方法，該方法包含下列步驟：  &lt;br/&gt;　　　(a)     使用基於DNA-甲基化珠粒之陣列，測定來自從CHO細胞株之該測試CHO細胞或從該測試CHO細胞之群體獲得之基因組材料之一組特定CpG位點之測試甲基化水平；  &lt;br/&gt;　　　(b)     將由步驟(a)測定之該測試甲基化水平與來自與年齡相關之參考樣本之同一組特定CpG位點之參考甲基化水平做比較，  &lt;br/&gt;　　從而建立該測試CHO細胞或該測試CHO細胞之群體之表觀遺傳年齡且預測該測試CHO細胞或該測試CHO細胞之群體之實足年齡，其中該組特定CpG位點包含表1所示之至少10%，較佳為30%，更佳為50%的CpG位點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to an &lt;i&gt;in vitro&lt;/i&gt; method for predicting the chronological age of a test Chinese Hamster Ovary (CHO) cell or population of test CHO cells, the method comprising the steps of: &lt;br/&gt;(a) determining the test methylation level of a set of specific CpG sites from genomic material obtained from the test CHO cell or from the population of test CHO cells from a CHO cell line using a DNA-methylation bead-based array; &lt;br/&gt;(b) comparing the test methylation level determined from step (a) with a reference methylation level of the same set of specific CpG sites from an age-correlated reference sample, &lt;br/&gt;thereby establishing the epigenetic age and predicting the chronological age of the test CHO cell or the population of test CHO cells wherein the set of specific CpG sites comprises at least 10%, preferably 30%, more preferably 50% of the CpG sites indicated in Table 1.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="493px" img-content="tif" inline="yes" orientation="portrait" width="769px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622285</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130829</doc-number>
          <kind></kind>
          <date>114/08/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C23C16/455</main-classification>
        <further-classification edition="201501120260226B">B33Y10/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　珊亨杉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SAM HYUNGSAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊　燿宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAO-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡迪瓦拉　薩吉爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADIWALA, SAGIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/808,751</doc-number>
          <date>20240819</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有光滑內壁的混合半導體氣流部件</chinese-title>
        <english-title>HYBRID SEMICONDUCTOR GAS FLOW COMPONENTS WITH SMOOTH INTERNAL WALLS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體處理系統的示範性典型氣流部件可能包含限定氣流部件的外部主體的3D列印部件。該3D列印部件可能包含外表面。這些部件可能包含至少部分包覆在3D列印部件內的預製部件。該預製部件可能限定具有入口和出口的非線性流體流道。入口和出口各自可能延伸穿過3D列印部件的外表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Exemplary gas flow components for a semiconductor processing system may include a 3D printed component that defines an outer body of the gas flow component. The 3D printed component may include an outer surface. The components may include a prefabricated component that is at least partially encapsulated within the 3D printed component. The prefabricated component may define a non-linear fluid flow lumen having an inlet and an outlet. The inlet and the outlet may each extend through the outer surface of the 3D printed component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:氣流部件</p>
        <p type="p">205:主體</p>
        <p type="p">206:第一端</p>
        <p type="p">208:第二端</p>
        <p type="p">210:中央孔口</p>
        <p type="p">216:入口</p>
        <p type="p">220:3D列印部件</p>
        <p type="p">225:預製部件</p>
        <p type="p">230:第一部分</p>
        <p type="p">235:第二部分</p>
        <p type="p">240:第三部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="856px" img-content="tif" inline="yes" orientation="portrait" width="674px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622205</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130850</doc-number>
          <kind></kind>
          <date>114/08/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K3/14</main-classification>
        <further-classification edition="200601120260302B">C09G1/02</further-classification>
        <further-classification edition="201201120260302B">B24B37/00</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安徳七海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANTOKU, NANAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/029506</doc-number>
          <date>20240820</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>漿料、複數液型漿料、研磨方法及零件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種漿料，其含有：磨粒；選自由糖醇及肌醇組成的組中之至少一種化合物A；選自由具有羥基之胺化合物及具有含氮六員環之化合物組成的組中之至少一種化合物B；及選自由羧酸、羧酸鹽、硝酸及硝酸鹽組成的組中之至少一種化合物C，前述磨粒包含鈰系粒子。一種研磨方法，其包括使用前述漿料對被研磨構件進行研磨之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">
        </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623069</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130854</doc-number>
          <kind></kind>
          <date>114/08/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201001120260225B">H01M4/485</main-classification>
        <further-classification edition="200601120260225B">C08F4/48</further-classification>
        <further-classification edition="200601120260225B">H01M4/30</further-classification>
        <further-classification edition="201001120260225B">H01M10/0525</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>古爾德　班傑明</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>GOULD, BENJAMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>康納　庫爾奇茨基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KULCZYTZKY, CONNOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　亞當　保羅</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>SMITH, ADAM PAUL·</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏帕薩尼　泰哈斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UPASANI, TEJAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特斯　克里斯多　Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATERS, CRYSTAL K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荀士第</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUN, SHIDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/683,404</doc-number>
          <date>20240815</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於鋰離子電池組之乾式電極組成物</chinese-title>
        <english-title>DRY ELECTRODE COMPOSITIONS FOR LITHIUM-ION BATTERIES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供一種由乾式程序形成之電極膜，其具有至少8%之伸長率，其中該膜包含至少95 wt%之電極活性材料，其具有小粒徑（3 µm或更小的D&lt;sub&gt;50&lt;/sub&gt;）。本文提供涉及製備該電極膜之組成物及方法，以及包含此等材料之電極及鋰離子電池組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrode film formed from a dry process is provided having an elongation of at least 8 % is provided, wherein said film comprises at least 95 wt% electrode active material having a small particle size (D&lt;sub&gt;50&lt;/sub&gt; of 3 µm or less). Compositions and methods related to preparing the electrode film are provided as well as electrodes and lithium-ion batteries comprises these materials.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電池組</p>
        <p type="p">102:陰極集電器</p>
        <p type="p">104:陰極</p>
        <p type="p">106:陽極集電器</p>
        <p type="p">108:陽極</p>
        <p type="p">110:電解質</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="562px" img-content="tif" inline="yes" orientation="portrait" width="721px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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          <doc-number>202622123</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114130930</doc-number>
          <kind></kind>
          <date>114/08/13</date>
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        <main-classification edition="200601120260302B">C07K19/00</main-classification>
        <further-classification edition="200601120260302B">C12N15/62</further-classification>
        <further-classification edition="200601120260302B">C12N15/63</further-classification>
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        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="200601120260302B">A61P27/02</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>徐　立忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JOHN LIUZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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                <last-name>雷　鳴</last-name>
                <first-name></first-name>
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                <last-name>LEI, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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                <last-name>徐小培</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>XU, XIAOPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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                <last-name>楚雪斌</last-name>
                <first-name></first-name>
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                <last-name>CHU, XUEBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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              <chinese-name name-type="organization">
                <last-name>王群</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>WANG, QUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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                <last-name>黃薪宇</last-name>
                <first-name></first-name>
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                <last-name>HUANG, XINYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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                <last-name>劉寧</last-name>
                <first-name></first-name>
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                <last-name>LIU, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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              <chinese-name name-type="organization">
                <last-name>張春生</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>ZHANG, CHUNSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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              <chinese-name name-type="organization">
                <last-name>劉娜</last-name>
                <first-name></first-name>
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                <last-name>LIU, NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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                <last-name>柯頌</last-name>
                <first-name></first-name>
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                <last-name>KE, SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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                <last-name>劉灝</last-name>
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                <last-name>LIU, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SIQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
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              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024111097292</doc-number>
          <date>20240813</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024111699314</doc-number>
          <date>20240823</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025101249236</doc-number>
          <date>20250126</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2025103611448</doc-number>
          <date>20250325</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>能夠結合ＶＥＧＦ的Ｆｃ融合蛋白及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了能夠抑制VEGF信號傳導的多肽構建體，含有所述多肽構建體的藥物組合物，以及相關用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.JPG" file="ed10027.JPG" height="324px" img-content="tif" inline="yes" orientation="portrait" width="508px">
          </img>
        </representative>
      </representative-img>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202623035</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114130933</doc-number>
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          <date>114/08/13</date>
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        <main-classification edition="200601120260223B">H01J37/305</main-classification>
        <further-classification edition="200601120260223B">H01J37/26</further-classification>
        <further-classification edition="201701120260223B">G06T7/00</further-classification>
        <further-classification edition="200601120260223B">G03F7/20</further-classification>
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                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
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                <last-name>柯柏　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORB, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
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                <last-name>梅爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAYER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
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              <chinese-name name-type="organization">
                <last-name>溫索拉　雅各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENSORRA, JAKOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
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              <chinese-name name-type="organization">
                <last-name>胡伯　弗洛里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUBER, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹森　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANTZEN, STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>10 2024 207 732.1</doc-number>
          <date>20240814</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>三維斷層掃描檢測設備的改良架構</chinese-title>
        <english-title>IMPROVED ARCHITECTURE OF INSPECTION APPARATUS FOR 3D TOMOGRAPHY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種具有改良機械特性的晶圓檢測系統的架構。該晶圓檢測系統包含帶電粒子成像系統和用於晶圓對位的光學成像系統。在該晶圓檢測系統內部，晶圓可以在晶圓表面上的任何檢測位置繞著晶圓表面的法線旋轉360°。通過減小真空外殼的足印面積以實現這種改良。這個面積或尺寸縮減的真空外殼容納了晶圓平台，進而允許在晶圓表面的任何位置和任何旋轉角度下進行晶圓檢測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An architecture of a wafer inspection system is provided with improved mechanical properties. The wafer inspection system comprises a charged particle imaging system and an optical imaging system for wafer registration. Within the wafer inspection system, a wafer can be rotated around an normal to the wafer surface by 360° at any inspection position of the wafer surface. The improvement is achieved by a reduction of an area of a footprint of a vacuum enclosure. The vacuum enclosure of reduced area or size is accommodating a wafer stage, allowing an inspection of a wafer surface at any position and any rotation angle of the wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">AREA1、AREA2、AREA3、AREA4:面積</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="745px" img-content="tif" inline="yes" orientation="portrait" width="627px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621700</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130938</doc-number>
          <kind></kind>
          <date>114/08/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/675</main-classification>
        <further-classification edition="200601120260302B">C07F9/6561</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商弗沃德醫療公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FORWARD THERAPEUTICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞迪　賈亞錢德拉　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REDDY, JAYACHANDRA P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓克西　希特什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOKSHI, HITESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/683,662</doc-number>
          <date>20240815</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>TNF-α活性調節劑及其鹽之固態形式</chinese-title>
        <english-title>SOLID STATE FORMS OF MODULATORS OF TNF-ALPHA ACTIVITY AND SALTS THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於(7R,14R)-1-(二氟甲氧基)-11-(4-(二甲基磷醯基)-3-氟苯基)-10-氟-6-(甲基-d3)-6,7-二氫-7,14-甲橋苯并[f]苯并[4,5]咪唑并[1,2-a][1,4]二氮㖕-5(14H)-酮及其鹽之固態形式。此類固態形式適用於製備用於治療疾病之醫藥組合物及劑型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to solid state forms of (7R,14R)-1-(difluoromethoxy)-11-(4-(dimethylphosphoryl)-3-fluorophenyl)-10-fluoro-6-(methyl-d3)-6,7-dihydro-7,14-methanobenzo[f]benzo[4,5]imidazo[1,2-a][1,4]diazocin-5(14H)-one and salts thereof. Such solid state forms are useful in preparation of pharmaceutical compositions and dosage forms for the treatment of disease.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10049.JPG" file="ed10049.JPG" height="715px" img-content="tif" inline="yes" orientation="portrait" width="1036px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622124</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130939</doc-number>
          <kind></kind>
          <date>114/08/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K19/00</main-classification>
        <further-classification edition="200601120260302B">C12N15/62</further-classification>
        <further-classification edition="200601120260302B">C12N15/63</further-classification>
        <further-classification edition="200601120260302B">C12N5/10</further-classification>
        <further-classification edition="200601120260302B">A61K38/17</further-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="200601120260302B">A61P27/02</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長春金賽藥業有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANGCHUN GENESCIENCE PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　立忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JOHN LIUZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEI, MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐小培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, XIAOPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楚雪斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHU, XUEBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, QUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃薪宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, XINYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張春生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHUNSHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯頌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KE, SONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉灝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王思勤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, SIQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="13">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024111097292</doc-number>
          <date>20240813</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024111699314</doc-number>
          <date>20240823</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025101249236</doc-number>
          <date>20250126</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2025103614094</doc-number>
          <date>20250325</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>融合蛋白及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了能夠抑制VEGF信號傳導的多肽，含有所述多肽的藥物組合物，以及相關用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10034.JPG" file="ed10034.JPG" height="331px" img-content="tif" inline="yes" orientation="portrait" width="595px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622585</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130963</doc-number>
          <kind></kind>
          <date>114/08/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251128B">G02B11/34</main-classification>
        <further-classification edition="202101120251128B">G02B7/02</further-classification>
        <further-classification edition="200601120251128B">G02B9/64</further-classification>
        <further-classification edition="200601120251128B">G02B13/18</further-classification>
        <further-classification edition="200601120251128B">G02B15/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金琴鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KUM HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張東赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, DONG HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秀赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SU HYEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭弼鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, PHIL HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任敏爀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IM, MIN HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁東晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, DONG SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175230</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2025-0047539</doc-number>
          <date>20250411</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統包括：第一透鏡，具有正的折射力；第二透鏡，具有折射力；第三透鏡，具有正的折射力；第四透鏡，具有負的折射力；第五透鏡，具有折射力；第六透鏡，具有凸的物體側表面；以及第七透鏡，具有負的折射力，其中第一透鏡至第七透鏡自物體側起依次設置，且其中滿足以下條件表達式：2.7＜SD1/SD5＜3.3，其中SD1是第一透鏡的物體側表面的有效半徑，且SD5是第三透鏡的物體側表面的有效半徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens having positive refractive power, a second lens having refractive power, a third lens having positive refractive power, a fourth lens having negative refractive power, a fifth lens having refractive power, a sixth lens having a convex object-side surface, and a seventh lens having negative refractive power, wherein the first to seventh lenses are disposed in order from an object side, and wherein the following conditional expression is satisfied: 2.7＜SD1/SD5＜3.3, where SD1 is an effective radius of an object-side surface of the first lens, and SD5 is an effective radius of an object-side surface of the third lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">IF:濾光片</p>
        <p type="p">IP:成像平面</p>
        <p type="p">IS:影像感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="733px" img-content="tif" inline="yes" orientation="portrait" width="588px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623580</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114130976</doc-number>
          <kind></kind>
          <date>114/08/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="202601120260302B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩﨑旭紘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWASAKI, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-138961</doc-number>
          <date>20240820</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板搬送裝置及具備其之基板處理系統以及基板處理裝置</chinese-title>
        <english-title>SUBSTRATE TRANSFER APPARATUS, AND SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之乾燥基板用手部具備：第1分支叉爪；一對基端引導件，其等設置於第1分支叉爪之基端部，與基板端部接觸；及一對末端引導件，其等設置於第1分支叉爪之末端部，與基板端部接觸；潤濕基板用手部具備：第2分支叉爪；一對基端突起，其等設置於第2分支叉爪之基端部，與基板之下表面接觸而支承基板；及一對末端突起，其等設置於第2分支叉爪之末端部，與基板之下表面接觸而支承基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dry substrate hand of the present invention includes a first branch blade, a pair of proximal end guides provided at a proximal end portion of the first branch blade and in contact with a substrate end portion, and a pair of distal end guides provided at a distal end portion of the first branch blade and in contact with the substrate end portion. The wet substrate hand of the present invention includes a second branch blade, a pair of proximal end protrusions provided at a proximal end portion of the second branch blade and in contact with a lower surface of a substrate to support the substrate, and a pair of distal end protrusions provided at a distal end portion of the second branch blade and in contact with the lower surface of the substrate to support the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">81:乾燥基板用手部</p>
        <p type="p">81b:第1分支叉爪</p>
        <p type="p">82:潤濕基板用手部</p>
        <p type="p">82b:第2分支叉爪</p>
        <p type="p">83:手部推送器</p>
        <p type="p">91:第1末端臂</p>
        <p type="p">94:第1基端臂</p>
        <p type="p">96:第2末端臂</p>
        <p type="p">98:第2基端臂</p>
        <p type="p">301:機器人基座</p>
        <p type="p">302:升降旋轉機構</p>
        <p type="p">311:移動扁平盤</p>
        <p type="p">312:頂板部</p>
        <p type="p">313:連結部</p>
        <p type="p">314:基體</p>
        <p type="p">315:進退機構</p>
        <p type="p">316:固定扁平盤</p>
        <p type="p">317:壁部</p>
        <p type="p">318:壁部</p>
        <p type="p">811:末端引導件</p>
        <p type="p">812:基端引導件</p>
        <p type="p">821:末端突起</p>
        <p type="p">822:基端突起</p>
        <p type="p">B:延伸方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10059.JPG" file="ed10059.JPG" height="639px" img-content="tif" inline="yes" orientation="portrait" width="654px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621671</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131015</doc-number>
          <kind></kind>
          <date>114/08/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/46</main-classification>
        <further-classification edition="200601120260302B">A61K8/34</further-classification>
        <further-classification edition="200601120260302B">A61K8/41</further-classification>
        <further-classification edition="200601120260302B">A61K8/86</further-classification>
        <further-classification edition="200601120260302B">A61K8/891</further-classification>
        <further-classification edition="200601120260302B">A61Q5/08</further-classification>
        <further-classification edition="200601120260302B">A61Q5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野裕司郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, YUJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿保芙美奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABO, FUMINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白附洸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRATSUKI, KO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔵本京子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAMOTO, KYOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-135416</doc-number>
          <date>20240814</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多劑式化妝料組合物、及多劑式染毛用或脫色用組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種兼具如下物性之多劑式化妝料組合物，上述物性係於使用時之混合時或向皮膚或毛髮等角蛋白組織塗抹時表現出防止滴落之良好之密接性之物性、及於塗抹後時表現出塗抹延展容易性之物性。  &lt;br/&gt;即，本發明提供一種多劑式化妝料組合物，其係具備複數種構成劑，且使用時將全部之構成劑混合而使用者，上述複數種構成劑含有以下之成分(A)離子性界面活性劑、成分(B)陽離子性聚合物、成分(C)高級醇、及成分(D)非離子性界面活性劑且至少包含30℃下之黏度不同之I劑及II劑，且  &lt;br/&gt;II劑之30℃下之黏度與I劑之30℃下之黏度之黏度比(II劑/I劑)為3以上，且  &lt;br/&gt;混合全部之構成劑而成之混合物中，於25℃下藉由流變儀所測定之使剪切速度於0.001 S&lt;sup&gt;-1&lt;/sup&gt;～1000 S&lt;sup&gt;-1&lt;/sup&gt;之間變化時之剪切速度0.0037 S&lt;sup&gt;-1&lt;/sup&gt;下之剪切黏度a與剪切速度139 S&lt;sup&gt;-1&lt;/sup&gt;下之剪切黏度b之比(剪切黏度a/剪切黏度b)為5000以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621672</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131018</doc-number>
          <kind></kind>
          <date>114/08/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K8/46</main-classification>
        <further-classification edition="200601120260302B">A61K8/34</further-classification>
        <further-classification edition="200601120260302B">A61K8/41</further-classification>
        <further-classification edition="200601120260302B">A61K8/86</further-classification>
        <further-classification edition="200601120260302B">A61K8/891</further-classification>
        <further-classification edition="200601120260302B">A61Q5/08</further-classification>
        <further-classification edition="200601120260302B">A61Q5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商花王股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野裕司郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, YUJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿保芙美奈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABO, FUMINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白附洸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRATSUKI, KO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔵本京子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAMOTO, KYOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新免愛実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINMEN, MANAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-135416</doc-number>
          <date>20240814</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多劑式化妝料組合物、及多劑式染毛用或脫色用組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種兼具如下物性之多劑式化妝料組合物，上述物性係於使用時之混合時或向皮膚或毛髮等角蛋白組織塗抹時表現出防止滴落之良好之密接性之物性、及於塗抹後時表現出塗抹延展容易性之物性。  &lt;br/&gt;即，本發明係一種多劑式化妝料組合物，其係具備複數種構成劑，且使用時將全部之構成劑混合而使用者，上述複數種構成劑含有以下之成分(A)離子性界面活性劑、成分(B)陽離子性聚合物、成分(C)高級醇、及成分(D)非離子性界面活性劑且至少包含30℃下之黏度不同之I劑及II劑，且  &lt;br/&gt;II劑之30℃下之黏度與I劑之30℃下之黏度之黏度比(II劑/I劑)為3以上，且  &lt;br/&gt;混合全部之構成劑而成之混合物中，於25℃下藉由流變儀所測定之使剪切速度於0.001 S&lt;sup&gt;-1&lt;/sup&gt;～1000 S&lt;sup&gt;-1&lt;/sup&gt;之間變化時之剪切速度0.0037 S&lt;sup&gt;-1&lt;/sup&gt;下之剪切黏度a與剪切速度139 S&lt;sup&gt;-1&lt;/sup&gt;下之剪切黏度b之比(剪切黏度a/剪切黏度b)為5000以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622247</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131021</doc-number>
          <kind></kind>
          <date>114/08/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/86</main-classification>
        <further-classification edition="200601120260302B">C12N7/01</further-classification>
        <further-classification edition="200601120260302B">C07K14/005</further-classification>
        <further-classification edition="201501120260302B">A61K35/761</further-classification>
        <further-classification edition="200601120260302B">A61K48/00</further-classification>
        <further-classification edition="200601120260302B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高等教育聯邦系統　匹茲堡大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSITY OF PITTSBURGH - OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托馬斯　伯恩　莉亞　卡羅琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THOMAS BYRNE, LEAH CAROLINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約翰遜　莫莉　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOHNSON, MOLLY E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯塔弗　威廉　Ｒ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STAUFFER, WILLIAM R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧茲特克　比爾吉　艾辛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OZTURK, BILGE ESIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/684,071</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>腺相關病毒載體</chinese-title>
        <english-title>ADENO-ASSOCIATED VIRUS VECTORS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示案係關於AAV載體（例如AAV2載體）。舉例而言，提供包含AAV衣殼多肽之AAV載體（例如AAV2載體），該AAV衣殼多肽包含SEQ ID NO: 5-9中之任一者（或其變異體）中所示之胺基酸序列或根據基於此一所示序列之式A之胺基酸序列；此類AAV衣殼多肽；編碼此類載體之核酸分子；編碼此類AAV衣殼多肽之核酸分子；含有及∕或表現此類核酸分子之宿主細胞；以及用於製備或使用此類載體及∕或AAV衣殼多肽之方法及材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to AAV vectors (&lt;i&gt;e.g.&lt;/i&gt;, AAV2 vectors). For example, AAV vectors (&lt;i&gt;e.g.&lt;/i&gt;, AAV2 vectors) comprising an AAV capsid polypeptide that comprises an amino acid sequence set forth in any one of SEQ ID NOs: 5-9 (or a variant thereof) or according to Formula A based on such a set forth sequence, such AAV capsid polypeptides, nucleic acid molecules encoding such vectors, nucleic acid molecules encoding such AAV capsid polypeptides, host cells containing and/or expressing such nucleic acid molecules, and methods and materials for making or using such vectors and/or AAV capsid polypeptides are provided.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623401</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131043</doc-number>
          <kind></kind>
          <date>114/08/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/67</main-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202601120260302B">H10P14/20</further-classification>
        <further-classification edition="201801120260302B">G01N23/20</further-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
        <further-classification edition="202001120260302B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商齊耐特股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZINITE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴萊吉　道格拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARLAGE, DOUGLAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫克　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COOK, KATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉鳳麟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, FENGLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曉泰　傑姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOUTE, GEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/682,985</doc-number>
          <date>20240814</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有氧化錫半導體之電晶體</chinese-title>
        <english-title>TRANSISTORS WITH TIN OXIDE SEMICONDUCTOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了一種薄膜電晶體(TFT)及其生產方法。在較佳實施例中，該TFT包含：基板；安置於該基板處的源極；安置於該基板處的汲極；閘極；以及氧化錫薄膜，該氧化矽薄膜在該源極與該汲極之間安置於該閘極的影響範圍內，當在該閘極處施加足夠電壓時，該氧化錫薄膜在該源極與該汲極之間形成載流子通道。有利地，在較佳實施例中，該氧化錫薄膜具有小於或等於1.0×10&lt;sup&gt;19&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt;的載流子濃度及大於或等於100 cm&lt;sup&gt;2&lt;/sup&gt;/V⋅s的遷移率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There is described a thin-film transistor (TFT) and a method for production thereof. In a preferred embodiment, the TFT comprises: a substrate; a source disposed at the substrate; a drain disposed at the substrate; a gate; and a thin film of tin oxide disposed within the influence of the gate between the source and the drain, the thin film of tin oxide to form a carrier channel between the source and the drain when sufficient voltage is applied at the gate. Advantageously, in a preferred embodiment, the thin film of tin oxide has carrier concentration of less than or equal to 1.0×10&lt;sup&gt;19&lt;/sup&gt; cm&lt;sup&gt;-3&lt;/sup&gt; and a mobility of greater than or equal to 100 cm&lt;sup&gt;2&lt;/sup&gt;/V⋅s.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101,110,200,211:密勒指數</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="602px" img-content="tif" inline="yes" orientation="portrait" width="760px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621850</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131051</doc-number>
          <kind></kind>
          <date>114/08/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260226B">B24B37/34</main-classification>
        <further-classification edition="200601120260226B">B24B47/22</further-classification>
        <further-classification edition="201201120260226B">B24B37/005</further-classification>
        <further-classification edition="200601120260226B">B24B41/00</further-classification>
        <further-classification edition="201201120260226B">B24B37/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋　熺奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, KEVIN H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘　班尼狄克Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, BENEDICT W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/807,715</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ＣＭＰ系統的自動ＣＭＰ墊更換</chinese-title>
        <english-title>AUTOMATED CMP PAD CHANGE FOR CMP SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了一種自動更換化學機械研磨（CMP）系統拋光墊的系統、控制器和方法。在一個態樣，CMP系統包含平臺，該平臺具有墊安裝表面，該表面上可以安置墊或替換墊。該平臺形成複數個孔，這些孔延伸至墊安裝表面。CMP系統還包含墊固持器，該墊固持器被佈置以在墊安裝製程期間選擇性地將墊移動至墊安裝表面，以及在墊移除製程期間選擇性地將墊從墊安裝表面移開。CMP系統還包含真空泵，該真空泵被佈置以例如在對基板進行CMP處理期間在複數個孔中選擇性地施加真空，以將墊固持在墊安裝表面上。該真空泵可以在自動墊更換製程期間停止施加真空。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system, controller, and method of automatically changing a polishing pad of a chemical mechanical polishing (CMP) system are provided. In one aspect, a CMP system includes a platen having a pad mounting surface upon which a pad, or replacement pad, can be disposed. The platen forms a plurality of apertures that extend to the pad mounting surface. The CMP system also includes a pad handler arranged to selectively move a pad onto the pad mounting surface during a pad installation process, and to selectively move the pad from the pad mounting surface during a pad removal process. The CMP system further includes a vacuum pump arranged to selectively apply a vacuum within the plurality of apertures so as to hold the pad to the pad mounting surface, such as during CMP processing of a substrate. The vacuum pump can cease applying the vacuum during an automated pad change process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:自動墊更換系統</p>
        <p type="p">202:處理腔室</p>
        <p type="p">204:下隔室</p>
        <p type="p">206:基底板</p>
        <p type="p">210:平臺</p>
        <p type="p">212:平臺軸</p>
        <p type="p">214:內部</p>
        <p type="p">216:墊安裝表面</p>
        <p type="p">218:孔</p>
        <p type="p">220:歧管通道</p>
        <p type="p">230:墊</p>
        <p type="p">230N:墊</p>
        <p type="p">230U:已使用墊</p>
        <p type="p">232:平臺安裝表面</p>
        <p type="p">234:拋光表面</p>
        <p type="p">250:真空系統</p>
        <p type="p">252:真空泵</p>
        <p type="p">254:真空導管</p>
        <p type="p">256:旋轉接頭</p>
        <p type="p">260:墊固持器</p>
        <p type="p">270:墊儲存單元</p>
        <p type="p">272N:新墊匣</p>
        <p type="p">272U:已使用墊匣</p>
        <p type="p">274N:支撐板</p>
        <p type="p">274U:支撐板</p>
        <p type="p">275:輪子</p>
        <p type="p">276N:門</p>
        <p type="p">276U:門</p>
        <p type="p">277:軌道</p>
        <p type="p">278N:彈簧</p>
        <p type="p">278U:彈簧</p>
        <p type="p">279N:匣輥</p>
        <p type="p">279U:匣輥</p>
        <p type="p">280:墊停止器</p>
        <p type="p">290:控制器</p>
        <p type="p">292:處理器</p>
        <p type="p">294:記憶體裝置</p>
        <p type="p">AX1:旋轉軸</p>
        <p type="p">AX2:旋轉軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="702px" img-content="tif" inline="yes" orientation="portrait" width="1018px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622482</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131098</doc-number>
          <kind></kind>
          <date>114/08/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G01N21/25</main-classification>
        <further-classification edition="200601120260226B">G01J3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商ＰＶＡ願景有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PVA VISION GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾徹　史蒂夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELCHER, STEVE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格雷勒策　伍爾夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAHLERT, WULF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃爾曼　菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOLLMANN, PHILIPP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>10 2024 123 393.1</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>確定樣品表面表面能量之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於測定樣品表面(110)的表面能量的方法(200)，包括以下步驟：接收特性化樣品表面(110)的光譜數據(414)，其中光譜數據(414)代表樣品表面(110)上複數位置(112)的每個位置的相應光譜，其中光譜數據(414)為多光譜數據或超光譜數據；利用光譜數據(414)測定複數位置(112)中至少一個位置的光譜特徵；利用光譜特徵測定預測的接觸角(θ')，其中接觸角(θ')代表樣品表面(110)在至少一個位置的表面能量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">104:基板</p>
        <p type="p">106:表面結構</p>
        <p type="p">110:樣品表面</p>
        <p type="p">400:裝置</p>
        <p type="p">402:控制裝置</p>
        <p type="p">404:處理室</p>
        <p type="p">406:控制模型</p>
        <p type="p">408:處理參數</p>
        <p type="p">410:處理單元</p>
        <p type="p">412:獲得單元</p>
        <p type="p">414:光譜數據</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="674px" img-content="tif" inline="yes" orientation="portrait" width="737px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623529</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131150</doc-number>
          <kind></kind>
          <date>114/08/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/00</main-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
        <further-classification edition="200601120260302B">B08B3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛斯特　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FOSTER, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龍　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LONG, JOHNATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅伯茲　連恩Ｓ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERTS, LIAM S.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/813,870</doc-number>
          <date>20240823</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於化學機械拋光清潔器的水平非接觸式清潔站</chinese-title>
        <english-title>HORIZONTAL NON-CONTACT CLEAN STATION FOR CHEMICAL MECHANICAL POLISHING CLEANER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">呈現用於化學機械拋光系統的非接觸式清潔模組。該非接觸式清潔模組包括置於處理區域內的真空台、置於處理區域內的噴嘴定位臂，該臂具有配置為提供清潔液噴射的清潔噴嘴陣列，以及具有中心沖洗棒和一或多個噴淋棒的沖洗歧管。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A noncontact cleaning module for a chemical mechanical polishing system is presented. The non-contact cleaning module comprises a vacuum table disposed within a processing area, a nozzle positioning arm disposed within the processing area and having a cleaning nozzle array configured to provide a cleaning fluid jet spray, and a rinse manifold having a center rinse bar and one or more spray bars.</p>
      </isu-abst>
      <representative-img>
        <p type="p">212:處理區域</p>
        <p type="p">230:真空台</p>
        <p type="p">402:角度</p>
        <p type="p">404:外部清潔噴嘴</p>
        <p type="p">406:噴嘴主體</p>
        <p type="p">408:惰性氣體供應</p>
        <p type="p">410:惰性氣體流</p>
        <p type="p">412:清潔液供應</p>
        <p type="p">414:清潔液流</p>
        <p type="p">416:清潔液噴射</p>
        <p type="p">418:尖端</p>
        <p type="p">422:扁平風扇噴嘴</p>
        <p type="p">426:扁平噴射</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="447px" img-content="tif" inline="yes" orientation="portrait" width="588px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623511</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131174</doc-number>
          <kind></kind>
          <date>114/08/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="200601120260302B">C23C16/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冀翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　晶粲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNG CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加　普拉凱特普拉卡什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JHA, PRAKET PRAKASH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁　璟梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, JINGMEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/683,599</doc-number>
          <date>20240815</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於窄溝槽上介電質沉積完全填滿之原位循環原子層蝕刻（ＡＬＥ）方法</chinese-title>
        <english-title>IN-SITU CYCLE ALE METHOD FOR DIELECTRIC DEPOSITION FULL-FILL ON NARROW TRENCH</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種元件包括基板，該基板包含複數個結構和介電層。複數個結構中的第一結構與該複數個基板的第二結構之間有第一距離。複數個結構的每一結構深寬比為約5:1至約15:1。介電層位於基板的上表面、複數個結構的第一側壁和第二側壁，以及複數個結構的上表面上。介電層在複數個結構的側壁上的厚度為約1nm至約5nm。一種形成元件的方法包括在基板上沉積介電層。修改介電層的一部分以形成修改過的介電層。執行原子層蝕刻以去除該修改過的介電層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a substrate comprising a plurality of structures and a dielectric layer. A first structure of the plurality of structures is separated from a second structure of the plurality of structures by a first distance. Each structure of the plurality of structures has an aspect ratio of about 5:1 to about 15:1. The dielectric layer is disposed on an upper surface of the substrate, a first sidewall and a second sidewall of the plurality of structures, and an upper surface of the plurality of structures. The dielectric layer has a thickness of about 1 nm to about 5 nm on the sidewalls of the plurality of structures. A method of forming a device includes depositing the dielectric layer over the substrate. A portion of the dielectric layer is modified to form a modified dielectric layer. An atomic layer etch is performed to remove the modified dielectric layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:基板</p>
        <p type="p">102A:上表面</p>
        <p type="p">103:結構</p>
        <p type="p">103A:第一結構</p>
        <p type="p">103B:第二結構</p>
        <p type="p">104:溝槽</p>
        <p type="p">104A:溝槽</p>
        <p type="p">105:介電層/介電材料</p>
        <p type="p">105A:上表面</p>
        <p type="p">105B:上表面</p>
        <p type="p">106A:第一側壁</p>
        <p type="p">106B:第二側壁</p>
        <p type="p">107:上表面</p>
        <p type="p">d1:深度</p>
        <p type="p">D1:距離</p>
        <p type="p">D2:距離</p>
        <p type="p">H1:高度</p>
        <p type="p">T1:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="840px" img-content="tif" inline="yes" orientation="portrait" width="724px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621843</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131215</doc-number>
          <kind></kind>
          <date>114/08/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260225B">B24B37/005</main-classification>
        <further-classification edition="200601120260225B">B24B51/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　重陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHONGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳祈宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHI HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納佳芮　瑞斯凱斯山姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGARE, RISHIKESH SHAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝諾伊　尼辛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENOY, NITHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達塔爾　蘇契維拉特穆拉利達爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DATAR, SHUCHIVRAT MURLIDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀康浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希賈許　派翠克阿基拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIGASHI, PATRICK AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　浩權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONG, JUSTIN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德什潘德　山彌爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DESHPANDE, SAMEER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方塔任斯基　皮耶艾曼紐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FONTARENSKY, PIERRE EMMANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施乃云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIH, NAIYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　馥彤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, FU-TUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/683,853</doc-number>
          <date>20240816</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/889,779</doc-number>
          <date>20240919</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理操作的節奏控制</chinese-title>
        <english-title>PACE CONTROL FOR SUBSTRATE PROCESSING OPERATIONS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種方法包括決定由基板處理系統執行的製程序列中，複數個製程的持續時間。每個製程由基板處理系統的子系統執行。該方法進一步包括決定複數個製程中持續時間最長的製程的持續時間。該方法還包括至少部分地根據決定的第一持續時間計算基板處理系統的節奏。該方法進一步包括使多個基板按計算出的節奏依序引入基板處理系統，以執行關於多個基板中每個基板的第一製程序列。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method includes determining durations of a plurality of processes in a sequence of processes to be performed by a substrate processing system. Each process is performed by a subsystem of the substrate processing system. The method further includes determining a duration for a process of the plurality of processes that is a longest duration among the durations. The method further includes calculating a pace for the substrate processing system based at least in part on the determined first duration. The method further includes causing multiple substrates to be introduced sequentially into the substrate processing system at the calculated pace for execution of the first sequence of processes with respect to each of the multiple substrates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">122:節奏元件</p>
        <p type="p">152:操作持續時間資料</p>
        <p type="p">154:拋光操作資料</p>
        <p type="p">156:清洗操作資料</p>
        <p type="p">200:資料流</p>
        <p type="p">222:拋光節奏模組</p>
        <p type="p">224:清洗節奏模組</p>
        <p type="p">232:系統節奏模組</p>
        <p type="p">240:系統節奏資料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="553px" img-content="tif" inline="yes" orientation="portrait" width="708px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623422</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131223</doc-number>
          <kind></kind>
          <date>114/08/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260225B">H10D64/66</main-classification>
        <further-classification edition="202501120260225B">H10D64/64</further-classification>
        <further-classification edition="202501120260225B">H10D64/62</further-classification>
        <further-classification edition="202501120260225B">H10D64/01</further-classification>
        <further-classification edition="202501120260225B">H10D30/67</further-classification>
        <further-classification edition="202501120260225B">H10D30/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴格　希法</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAG, SEFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴吉吉　艾爾梅蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAZIZI, EL MEHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　哲擘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ZHEBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>珍森　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANSEN, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/807,144</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有降低的接觸電阻率之半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICES HAVING REDUCED CONTACT RESISTIVITY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本技術包括具有改善接觸電阻率的半導體裝置和方法。半導體裝置包括基板，以及接觸件，該接觸件包括覆蓋於一或多個特徵中的基板至少部分區域的矽化物，其接觸長度小於40埃。生成減少接觸長度的矽化物層的方法包括沉積第一金屬，並執行至少一個熱退火以產生具有減少接觸長度的矽化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present technology includes semiconductor devices and methods with improved contact resistivity. Semiconductor devices include a substrate base, a contact including a silicide overlying at least a portion of the substrate in the one or more features, which has a contact length of less than 40 Angstroms. The methods for generating a reduced contact length silicide layer includes depositing a first metal, and performing at least one thermal anneal to generate a silicide having a reduced contact length.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:結構</p>
        <p type="p">302:特徵</p>
        <p type="p">304:氧化矽</p>
        <p type="p">305:基板</p>
        <p type="p">306:界面</p>
        <p type="p">307:表面</p>
        <p type="p">308:第一金屬層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="573px" img-content="tif" inline="yes" orientation="portrait" width="1004px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621777</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131234</doc-number>
          <kind></kind>
          <date>114/08/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">B01D24/20</main-classification>
        <further-classification edition="200601120260224B">B65D75/58</further-classification>
        <further-classification edition="202301120260224B">C02F1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商清淨濾水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLEARLY FILTERED, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯瓦特　亞撒雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASSWATER, ASAIAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰內斯基　富蘭克　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYNESKI, FRANK M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭布里　強尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMPLEY, JOHNNY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/809,285</doc-number>
          <date>20240819</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>手持式濾水器灌注袋裝置、系統及方法</chinese-title>
        <english-title>WATER FILTER PRIMING BAG APPARATUS, SYSTEMS AND METHODS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於灌注高效能重力饋入濾水器之手持式濾水器灌注袋，其具有永久地密封至帶螺紋過濾器連接器組件之撓性水容器部分。把手沿著該過濾器連接器組件之基底區段之至少實質上整個直徑縱向延伸。該把手包含實質上橫跨該基底區段之該直徑且圍繞延伸穿過該基底區段之出口的連續凸緣。撓性水容器部分密封至該連續凸緣。該水容器部分之內部經由該出口與該袋之外部流體連通。該袋出口經組態以用於高效能過濾器之高度針對性加壓。灌注袋系統包括該手持式濾水器灌注袋。灌注方法允許高效地完全灌注高效能過濾器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A hand-held water filter priming bags for priming a high performance gravity fed water filters has a flexible water container portion permanently sealed to a threaded filter connector component. A handle extends longitudinally along at least substantially the entire diameter of a base section of the filter connector component. The handle comprises a continuous flange spanning substantially the diameter of the base section and surrounding an outlet extending through the base section. Flexible water container portion is sealed to the continuous flange. An interior of the water container portion is in fluid communication with an exterior of the bag via the outlet. The bag outlet is configured for highly targeted pressurization of high-performance filters. A priming bag system includes the hand-held water filter priming bag. Methods of priming allow for efficient fully priming of high performance filters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3-3:線</p>
        <p type="p">10:一個手持式濾水器灌注袋</p>
        <p type="p">11:水容器部分第一及第二側壁密封邊緣</p>
        <p type="p">12:水容器部分上部端</p>
        <p type="p">13:水容器部分上部角板</p>
        <p type="p">14:水容器部分底部端</p>
        <p type="p">15:水容器上部端</p>
        <p type="p">16:水容器部分內部</p>
        <p type="p">17:手持式濾水器灌注袋</p>
        <p type="p">18:扭轉把手</p>
        <p type="p">19:水容器部分基底區段</p>
        <p type="p">20:出口孔隙</p>
        <p type="p">22:單主體帶螺紋過濾器連接器組件</p>
        <p type="p">23:水容器部分基底區段上部側</p>
        <p type="p">24:連續凸緣密封表面</p>
        <p type="p">25:帶螺紋外部輪緣</p>
        <p type="p">26:上部側平坦表面</p>
        <p type="p">27:連續凸緣</p>
        <p type="p">28:扭轉把手相對端</p>
        <p type="p">29:扭轉把手相對端</p>
        <p type="p">40:水容器部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="829px" img-content="tif" inline="yes" orientation="portrait" width="616px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621683</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131241</doc-number>
          <kind></kind>
          <date>114/08/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/451</main-classification>
        <further-classification edition="200601120260302B">A61K9/50</further-classification>
        <further-classification edition="200601120260302B">A61K47/38</further-classification>
        <further-classification edition="200601120260302B">A61K47/02</further-classification>
        <further-classification edition="200601120260302B">A61K47/32</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
        <further-classification edition="200601120260302B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商普瑞尼亞神經治療有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PRILENIA NEUROTHERAPEUTICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>別列洛維奇　埃琳娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BERELOVICH, ELENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕特爾　阿尼爾庫馬爾　Ｎ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATEL, ANILKUMAR NATUBHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>以色列</country>
          <doc-number>315049</doc-number>
          <date>20240815</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>掩味普多比啶（ＰＲＩＤＯＰＩＤＩＮＥ）調配物、其使用方法及其製備方法</chinese-title>
        <english-title>TASTE-MASKED PRIDOPIDINE FORMULATIONS, METHOD OF USE THEREOF AND PROCESS FOR PREPARATION THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請案提供一種呈顆粒形式之普多比啶(pridopidine)藥物之新穎調配物，其經設計以掩蓋普多比啶之強烈苦味，同時實現快速藥物釋放。該調配物提供改良之掩味及溶解特徵，使其適合於經口投與。本發明亦關於用於製備該等顆粒之方法、投與該等顆粒之方法以及使用該調配物治療神經退化性或神經發育性疾病或病症之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a novel formulation of pridopidine drug in the form of particles designed to mask the intensely bitter taste of pridopidine while enabling rapid drug release. The formulation provides improved taste masking and dissolution characteristics, making it suitable for oral administration. The invention further relates to the process for preparation of the particles, methods of their administration, and to methods of using the formulation in the treatment of neurodegenerative or neurodevelopmental disease or disorder.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623532</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131257</doc-number>
          <kind></kind>
          <date>114/08/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/20</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>板垣雄翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITAGAKI, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>都築伶子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUZUKI, REIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土橋和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOBASHI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-147096</doc-number>
          <date>20240829</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種提升光阻膜之蝕刻耐性的基板處理方法。  &lt;br/&gt;　　[解決手段]基板處理方法，係具有：準備具有光阻膜之基板的工程，該光阻膜，係在蝕刻對象層之上形成有開口的圖案；將前述基板暴露於含金屬氣體，使金屬浸潤於前述光阻膜的工程；及將前述基板暴露於蝕刻氣體，經由前述光阻膜之開口，蝕刻前述蝕刻對象層的工程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="717px" img-content="tif" inline="yes" orientation="portrait" width="468px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622598</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131264</doc-number>
          <kind></kind>
          <date>114/08/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B27/01</main-classification>
        <further-classification edition="200601120260302B">G02B6/34</further-classification>
        <further-classification edition="200601120260302B">G02B5/18</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王澤芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZEFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江　雷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　文輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　永安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, YONGAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁皮亞　拉尼達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONGPIYA, RANIDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TH</english-country>
              <english-address>TH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉福斯　伊莉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAFFOSSE, ELISE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高德　路迪維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODET, LUDOVIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/684,028</doc-number>
          <date>20240816</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於形成具有減少的頂部和底部臨界尺寸之階梯狀光柵之方法</chinese-title>
        <english-title>METHOD FOR FORMING STAIRCASE GRATINGS WITH REDUCED TOP AND BOTTOM CRITICAL DIMENSIONS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供了用於形成波導結構的方法。更具體而言，這裡所描述的實施例提供了形成具有減少的頂部和底部臨界尺寸之階梯狀光柵的技術。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for forming waveguide structures is provided. More specifically, embodiments described herein provide techniques for forming staircase gratings with reduced top and bottom critical dimensions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:波導結構</p>
        <p type="p">302:裝置層</p>
        <p type="p">368:第一階梯狀光柵結構</p>
        <p type="p">380:第二複數個階梯狀光柵結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="315px" img-content="tif" inline="yes" orientation="portrait" width="762px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622104</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131265</doc-number>
          <kind></kind>
          <date>114/08/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K14/495</main-classification>
        <further-classification edition="200601120260302B">C07K14/575</further-classification>
        <further-classification edition="200601120260302B">C07K14/60</further-classification>
        <further-classification edition="200601120260302B">C07K14/605</further-classification>
        <further-classification edition="200601120260302B">C07K14/71</further-classification>
        <further-classification edition="200601120260302B">C07K16/26</further-classification>
        <further-classification edition="200601120260302B">A61K38/18</further-classification>
        <further-classification edition="200601120260302B">A61K38/22</further-classification>
        <further-classification edition="200601120260302B">A61K38/26</further-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P3/04</further-classification>
        <further-classification edition="200601120260302B">A61P3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商博圖奧索私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROTUOSO PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧　冠達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, TIMOTHY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　世凱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SEE KHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YOW-SIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/684,017</doc-number>
          <date>20240816</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/785,277</doc-number>
          <date>20250408</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/843,605</doc-number>
          <date>20250714</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>融合分子</chinese-title>
        <english-title>FUSION MOLECULES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種融合分子，其包含與肌肉抑制素路徑抑制劑部分融合的肥胖症相關肽部分。亦揭示編碼該等融合分子之核酸及表現載體、包含該等融合分子的組成物、及使用該等融合分子的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Fusion molecules comprising an obesity-related peptide moiety, fused to a myostatin pathway inhibitor moiety are disclosed. Also disclosed are nucleic acids and expression vectors encoding, compositions comprising, and methods of using, the fusion molecules.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10038.JPG" file="ed10038.JPG" height="374px" img-content="tif" inline="yes" orientation="portrait" width="745px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623105</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131301</doc-number>
          <kind></kind>
          <date>114/08/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120251104B">H01R12/72</main-classification>
        <further-classification edition="200601120251104B">H01R13/213</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾威勒電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪世揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, SHIH-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,421</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>線對板連接器組件及其線端連接器與板端連接器</chinese-title>
        <english-title>WIRE-TO-BOARD CONNECTOR ASSEMBLY AND ITS WIRE-END CONNECTOR AND BOARD-END CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種線端連接器包含第一殼體及第一端子。第一端子設置於第一殼體中並包含相連的第一主板及複數個導線結合部。導線結合部配置以連接至少一導線。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wire-end connector includes a first housing and a first terminal. The first terminal is disposed in the first housing and includes a first main plate and a plurality of wire coupling portions connected thereto. The wire coupling portions are configured to connect at least one wire.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:線對板連接器組件</p>
        <p type="p">100:線端連接器</p>
        <p type="p">110:第一殼體</p>
        <p type="p">111:第一容置通道</p>
        <p type="p">112:第三容置通道</p>
        <p type="p">120:第一端子</p>
        <p type="p">121:第一主板</p>
        <p type="p">122:導線結合部</p>
        <p type="p">130:閂鎖</p>
        <p type="p">200:板端連接器</p>
        <p type="p">210:第二殼體</p>
        <p type="p">220:第二端子</p>
        <p type="p">222:接腳</p>
        <p type="p">300:電路板</p>
        <p type="p">A-A,B-B:橫截面</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:第三方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.png" file="d10013.TIF" giffile="ed10013.png" height="726px" img-content="tif" inline="yes" orientation="portrait" width="984px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622705</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131389</doc-number>
          <kind></kind>
          <date>114/08/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G06F3/01</main-classification>
        <further-classification edition="201301120260224B">G06F3/0346</further-classification>
        <further-classification edition="200601120260224B">A44C9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞梅德　莫哈梅德伊姆提亞茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHMED, MOHAMED IMTIAZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧特曼　內森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALTMAN, NATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫布蘭德　瓦迪姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WINEBRAND, VADIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜魯多　科爾比</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUDEAU, COLBY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈利勒　蘇海爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JALIL, SUHAIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿米莉安　湯瑪斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMILIEN, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/809,165</doc-number>
          <date>20240819</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>經組態用於與其他裝置及系統互動的超音波啟用之戒指</chinese-title>
        <english-title>ULTRASOUND-ENABLED RINGS CONFIGURED FOR INTERACTING WITH OTHER DEVICES AND SYSTEMS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備可包括：一殼體，其經組態以配戴在人類手部或手腕的至少一部分上；一慣性測量單元(IMU)，其附接至該殼體且經組態以產生對應於該設備的一定向的IMU資料；一無線傳輸器，其附接至該殼體且經組態以傳輸對應於該IMU資料的射頻(RF)信號；一超音波傳輸器系統，其附接至該殼體且包含一或多個超音波傳輸器；及一控制系統，其附接至該殼體且經組態以：控制該超音波傳輸器系統的一第一超音波傳輸器以產生一第一超音波傳輸類型的第一超音波傳輸；且控制該無線傳輸器以傳輸對應於該IMU資料的RF信號，該等RF信號與該等第一超音波傳輸同步。該設備可係經組態以配戴在人類指頭上的一戒指。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus may include: a housing configured to be worn on at least a portion of a human hand or wrist; an inertial measurement unit (IMU) attached to the housing and configured to generate IMU data corresponding to an orientation of the apparatus; a wireless transmitter attached to the housing and configured to transmit radio frequency (RF) signals corresponding to the IMU data; an ultrasonic transmitter system attached to the housing and comprising one or more ultrasonic transmitters; and a control system attached to the housing and configured to: control a first ultrasonic transmitter of the ultrasonic transmitter system to produce first ultrasonic transmissions of a first ultrasonic transmission type; and control the wireless transmitter to transmit RF signals corresponding to the IMU data, the RF signals being synchronized with the first ultrasonic transmissions. The apparatus may be a ring that is configured to be worn on a human digit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101a,101b:設備</p>
        <p type="p">107a,107b:無線傳輸器</p>
        <p type="p">201:HMD</p>
        <p type="p">207:無線接收器</p>
        <p type="p">301:系統</p>
        <p type="p">302a,302b:超音波傳輸器</p>
        <p type="p">305:超音波</p>
        <p type="p">310a:RF信號</p>
        <p type="p">312a,312b:麥克風</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="875px" img-content="tif" inline="yes" orientation="portrait" width="649px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622543</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131515</doc-number>
          <kind></kind>
          <date>114/08/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250912B">G02B1/04</main-classification>
        <further-classification edition="201501120250912B">G02B1/113</further-classification>
        <further-classification edition="201501120250912B">G02B1/115</further-classification>
        <further-classification edition="200601120250912B">G02B11/02</further-classification>
        <further-classification edition="202101120250912B">G03B11/04</further-classification>
        <further-classification edition="202101120250912B">G03B17/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商玉晶光電（廈門）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENIUS ELECTRONIC OPTICAL (XIAMEN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方契盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, CHI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊岳霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUE-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬靜如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116974375</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學成像鏡頭及其光學塑膠透鏡組</chinese-title>
        <english-title>OPTICAL IMAGING LENS AND OPTICAL PLASTIC LENS ASSEMBLY THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供之光學成像鏡頭及其光學塑膠透鏡組從物側到像側沿光軸包括第一塑膠透鏡與第二塑膠透鏡，第一塑膠透鏡與第二塑膠透鏡皆包含徑向上由內向外形成之光學部與組裝部，組裝部包括朝向物側的物側承靠面與朝向像側的像側承靠面。第一塑膠透鏡的像側承靠面與第二塑膠透鏡的物側承靠面之間設置有至少一第一混鍍膜層及至少一第二混鍍膜層，第一混鍍膜層至少包括鋁與鋯，並且第二混鍍膜層至少包括磷、氧以及鈰、鎢、鐵、鎵與鉍中的至少一個金屬元素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging lens and an optical plastic lens assembly are provided by the present invention. The optical plastic lens assembly comprises a first plastic lens element and a second plastic lens element, positioned from an object side to an image side. Each of the first and second plastic lens elements comprises an optical portion and a mounting portion, formed in a radial direction, from center to edge. The mounting portion comprises an object-side supporting surface facing the object side and an image-side supporting surface facing the image side. At least one first coevaporate and at least one second coevaporate are positioned between the image-side supporting surface of the first plastic lens element and object-side supporting surface of the second plastic lens element. The first coevaporate at least comprises aluminum and zirconium. The second coevaporate at least comprises phosphorus, oxygen, and at least one metal element of cerium, tungsten, iron, gallium and bismuth.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104、204:物側面</p>
        <p type="p">105、205:像側面</p>
        <p type="p">106、206:第一混鍍膜層</p>
        <p type="p">107、207第二混鍍膜層</p>
        <p type="p">100:第一塑膠透鏡</p>
        <p type="p">101、201:組裝部</p>
        <p type="p">101A、201A:物側承靠面</p>
        <p type="p">101B、201B:像側承靠面</p>
        <p type="p">103、203:光學部</p>
        <p type="p">200:第二塑膠透鏡</p>
        <p type="p">A1:物側</p>
        <p type="p">A2:像側</p>
        <p type="p">I:光軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="854px" img-content="tif" inline="yes" orientation="portrait" width="509px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621918</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131523</doc-number>
          <kind></kind>
          <date>114/08/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">B60N2/28</main-classification>
        <further-classification edition="200601120260225B">B60N2/14</further-classification>
        <further-classification edition="200601120260225B">B60N2/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塞繆爾　吉爾哈特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMUEL, GEARHART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯林Ｆ　艾格特　克羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLIN F., EGGERT-CROWE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯蒂斯Ｍ　哈滕斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURTIS M., HARTENSTINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茱莉亞　彭澤克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JULIA, PONZEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/685,516</doc-number>
          <date>20240821</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/689,380</doc-number>
          <date>20240830</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/861,614</doc-number>
          <date>20250811</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>美國</country>
          <doc-number>63/861,649</doc-number>
          <date>20250811</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>美國</country>
          <doc-number>63/861,661</doc-number>
          <date>20250811</date>
        </priority-claim>
        <priority-claim sequence="6">
          <country>美國</country>
          <doc-number>63/861,689</doc-number>
          <date>20250811</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於兒童汽車安全座椅之可移動底座</chinese-title>
        <english-title>MOVABLE BASE FOR CHILD CAR SEAT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種兒童約束系統包括可安裝至一車輛座椅之一支撐底座。該支撐底座包括一第一底座部分及一第二底座部分。該第一底座部分可相對於該第二底座部分在一行進位置與一裝載位置之間旋轉。一兒童安全座椅以可拆卸方式連接至該第一底座部分且具有一安裝組件。該第一底座部分包括一引導件及一接收組件。該接收組件經組態以與該安裝組件正向接合。該第一底座部分之該引導件經組態以促進該安裝組件朝向該接收組件移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A child restraint system includes a support base mountable to a vehicle seat. The support base includes a first base portion and a second base portion. The first base portion is rotatable relative to the second base portion between a travel position and a loading position. A child seat is removably connected to the first base portion and has a mounting component. The first base portion includes a guide and a receiving component. The receiving component is configured to positively engage with the mounting component. The guide of the first base portion is configured to promote movement of the mounting component toward the receiving component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">620:兒童約束系統</p>
        <p type="p">622:支撐底座</p>
        <p type="p">640:兒童安全座椅</p>
        <p type="p">642a:第一安裝組件</p>
        <p type="p">642b:第二安裝組件</p>
        <p type="p">646:前端</p>
        <p type="p">648:後端</p>
        <p type="p">650:第一底座部分</p>
        <p type="p">654:上表面</p>
        <p type="p">655:前端</p>
        <p type="p">657:後端</p>
        <p type="p">660:波狀外殼或殼體</p>
        <p type="p">662:第一滑動表面</p>
        <p type="p">664:第一槽</p>
        <p type="p">666:第二引導件或第二滑動表面</p>
        <p type="p">668:斜坡表面</p>
        <p type="p">670:座椅固持總成</p>
        <p type="p">672a:第一接收組件</p>
        <p type="p">672b:第二接收組件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10051.JPG" file="ed10051.JPG" height="1011px" img-content="tif" inline="yes" orientation="portrait" width="617px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622189</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131544</doc-number>
          <kind></kind>
          <date>114/08/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260113B">C09D5/20</main-classification>
        <further-classification edition="200601120260113B">C08K5/053</further-classification>
        <further-classification edition="200601120260113B">C08J5/22</further-classification>
        <further-classification edition="200601120260113B">B29C51/04</further-classification>
        <further-classification edition="200601120260113B">B32B27/36</further-classification>
        <further-classification edition="202001120260113B">C08J7/04</further-classification>
        <further-classification edition="200601120260113B">B32B27/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商賽諾世股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZACROS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤蒼思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, SOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205109</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>剝離膜的製造方法、剝離膜以及積層膜</chinese-title>
        <english-title>METHOD FOR MANUFACTURING RELEASE FILM, RELEASE FILM, AND LAYERED FILM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種剝離膜的製造方法、剝離膜以及積層膜。本發明的課題在於不使用有機溶劑而將烷基側鏈聚合物型的非矽酮非氟系剝離劑樹脂塗敷於基材膜的表面、並且在塗佈液不被基材膜的表面排斥的情況下形成塗膜及剝離層。剝離膜的製造方法依次包括：藉由在具備第一表面（11a）及第二表面（11b）的基材膜（11）的上述第一表面（11a）塗佈非矽酮非氟系剝離劑樹脂的水分散液而得到剝離膜前驅物的步驟，上述基材膜在第一表面（11a）包含聚酯系樹脂；以及使剝離膜前驅物乾燥的步驟，水分散液包含水、剝離劑樹脂以及界面活性劑，上述剝離劑樹脂是非矽酮非氟系剝離劑樹脂、並且是烷基側鏈聚合物，界面活性劑包含HLB值為11以上的炔二醇系非離子性界面活性劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a method for manufacturing a release film, a release film, and a layered film. An object of the present invention is to form a coating film and a release layer by coating, on a surface of a base film, an alkyl pendant polymer-type non-silicone, non-fluorine release agent resin without using an organic solvent, while preventing a coating liquid from being repelled on the surface of the base film. The method for manufacturing a release film includes, in this order: a step of obtaining a release-film precursor by applying an aqueous dispersion of a non-silicone, non-fluorine release agent resin onto a first surface (11a) of a base film (11) having the first surface (11a) and a second surface (11b), the base film including a polyester resin in the first surface (11a); and a step of drying the release-film precursor. The aqueous dispersion includes water, a release agent resin, and a surfactant. The release agent resin is a non-silicone, non-fluorine release agent resin and an alkyl pendant polymer. The surfactant includes an acetylenic glycol-based nonionic surfactant having an HLB value of 11 or more.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:剝離膜</p>
        <p type="p">11:基材膜</p>
        <p type="p">11a:第一表面</p>
        <p type="p">11b:第二表面</p>
        <p type="p">12:剝離層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="231px" img-content="tif" inline="yes" orientation="portrait" width="669px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623543</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131553</doc-number>
          <kind></kind>
          <date>114/08/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P52/00</main-classification>
        <further-classification edition="200601120260302B">B08B3/02</further-classification>
        <further-classification edition="200601120260302B">B08B5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＥＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMEIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平松孝浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAMATSU, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤洸聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTOH, KOHSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森連太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, RENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田圭児</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳本博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGIMOTO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲岡宏弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAOKA, HIROYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲垣功二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAGAKI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤晃次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, AKITSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/035652</doc-number>
          <date>20241004</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基材洗淨裝置</chinese-title>
        <english-title>BASE MATERIAL CLEANING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的在於提供一種可抑制洗淨用液的使用量，並且可將附著在基材之洗淨面的被去除物無遺漏地洗淨並去除的基材洗淨裝置。  &lt;br/&gt;本揭示的基材洗淨裝置(70)中，洗淨用噴霧氣體(MG1)與空氣(AG0)匯流而得到的基材吹送用噴霧氣體(MG2)係被供應至基材(1)的表面(1s)。旋轉機構(30)使旋轉用馬達(35)執行平台旋轉動作而使基材(1)旋轉。此時，一併執行切換旋轉方向的旋轉方向控制處理及變更旋轉速度的旋轉速度控制處理。此外，可使振動用馬達(34)執行平台振動動作，對於基材(1)賦予振動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">It is an object of the present disclosure to provide a base material cleaning apparatus that can suppress usage of a cleaning solution and can completely remove a removed object adhering to a cleaning surface of a base material. In a base material cleaning apparatus (70) according to the present disclosure, a base material blowing mist gas (MG2) obtained by merging a cleaning mist gas (MG1) and an air gas (AG0) is supplied to a front surface (1s) of a base material (1). A rotation mechanism (30) causes a rotation motor (35) to perform stage rotation operation to rotate the base material (1). In this case, rotation direction control processing of switching a rotation direction and rotation speed control processing of changing a rotation speed are also performed. Furthermore, the vibration motor (34) is caused to perform stage vibration operation to impart vibration to the base material (1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">1a:凹部</p>
        <p type="p">1b:凸部</p>
        <p type="p">1s:表面</p>
        <p type="p">2:噴霧氣體供應機構</p>
        <p type="p">3:空氣供應機構</p>
        <p type="p">11:超音波霧化器</p>
        <p type="p">12:噴霧供應配管</p>
        <p type="p">13:搬送氣體供應配管</p>
        <p type="p">14:空氣供應配管</p>
        <p type="p">18:凹凸區域</p>
        <p type="p">21:噴霧用噴嘴</p>
        <p type="p">23:空氣用噴嘴</p>
        <p type="p">70:基材洗淨裝置</p>
        <p type="p">AG0:空氣</p>
        <p type="p">R1:旋轉方向</p>
        <p type="p">R2:旋轉方向</p>
        <p type="p">TG:搬送氣體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="690px" img-content="tif" inline="yes" orientation="portrait" width="884px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621845</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131558</doc-number>
          <kind></kind>
          <date>114/08/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260302B">B24B37/08</main-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＡＧＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGC INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠下颯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUSHITA, HAYATE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢川啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAGAWA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, RYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布施歩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUSE, AYUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-138518</doc-number>
          <date>20240820</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>工件研磨方法、使用該工件研磨方法研磨之工件及玻璃基板製造方法</chinese-title>
        <english-title>METHOD FOR POLISHING A WORKPIECE AND WORKPIECE POLISHED BY THE METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠更有效地提高工件之平坦性之雙面研磨方法。本發明之方法係藉由具備設置有第1研磨墊(140)之上壓盤(120)及設置有第2研磨墊(150)之下壓盤(130)之雙面研磨裝置研磨工件，且包含如下步驟：(1)在工件之研磨過程中，從安裝於雙面研磨裝置之複數個感測器獲取感測器資訊，該感測器資訊包括上壓盤(120)與下壓盤(130)之間之距離資訊及/或上壓盤(120)或下壓盤(130)之溫度資訊；(2)根據感測器資訊預測兩個研磨墊與工件之抵接狀態，並導出對象壓盤之目標溫度分佈；以及(3)基於目標溫度分佈調整研磨參數，使用該調整後之研磨參數來研磨工件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110~S160:工序</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="726px" img-content="tif" inline="yes" orientation="portrait" width="669px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622533</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131569</doc-number>
          <kind></kind>
          <date>114/08/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G01S7/52</main-classification>
        <further-classification edition="202201120260224B">G06V40/13</further-classification>
        <further-classification edition="202301120260224B">H10K59/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯特洛夫曼　潔西卡劉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STROHMANN, JESSICA LIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧義鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, YIPENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王宏仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUNG-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李紹瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHAOJUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/814,196</doc-number>
          <date>20240823</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有折射微透鏡的聲學感測器</chinese-title>
        <english-title>ACOUSTIC SENSORS WITH REFRACTIVE MICROLENS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文揭示具有一或多個微透鏡結構的聲學感測器，及用於製造並操作此類聲學感測器系統的方法。在一些實施例中，一種設備可包括：一聲學感測元件；一顯示器堆疊；一第一材料層，其具有一第一聲學折射率及設置在該第一材料層之一第一表面處的一或多個微透鏡結構；及一第二材料層，其設置在該第一材料層及該一或多個微透鏡結構上，該第二材料層具有不同於該第一聲學折射率的一第二聲學折射率。該一或多個微透鏡結構可經組態以自由該聲學感測元件發射的一或多個聲學信號形成一聚焦壓力波。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Acoustic sensors with one or more microlens structures, as well as methods for fabricating and operating such acoustic sensor systems are disclosed. In some embodiments, an apparatus may include: an acoustic sensing element; a display stack; a first layer of material having a first acoustic refractive index and one or more microlens structures disposed at a first surface of the first layer of material; and a second layer of material disposed on the first layer of material and the one or more microlens structures, the second layer of material having a second acoustic refractive index that is different from the first acoustic refractive index. The one or more microlens structures may be configured to form a focused pressure wave from one or more acoustic signals emitted by the acoustic sensing element.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:實例聲學感測器堆疊</p>
        <p type="p">902:感測元件</p>
        <p type="p">904:第一材料層</p>
        <p type="p">905:接收器像素</p>
        <p type="p">906:TFT電路系統</p>
        <p type="p">908:壓電層</p>
        <p type="p">910:電極層</p>
        <p type="p">912:鈍化層</p>
        <p type="p">914:微透鏡結構</p>
        <p type="p">920:聲學信號</p>
        <p type="p">922:聲學信號</p>
        <p type="p">924:第二材料層</p>
        <p type="p">930:壓板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.JPG" file="ed10032.JPG" height="760px" img-content="tif" inline="yes" orientation="portrait" width="743px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202621801</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131606</doc-number>
          <kind></kind>
          <date>114/08/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B08B3/02</main-classification>
        <further-classification edition="202401120260302B">B08B1/40</further-classification>
        <further-classification edition="200601120260302B">B05B1/12</further-classification>
        <further-classification edition="200601120260302B">B05B1/18</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＥＩＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMEIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平松孝浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAMATSU, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤洸聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTOH, KOHSEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森連太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, RENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田圭児</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳本博</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGIMOTO, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲岡宏弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAOKA, HIROYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲垣功二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INAGAKI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤晃次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, AKITSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/035587</doc-number>
          <date>20241004</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基材洗淨裝置</chinese-title>
        <english-title>BASE MATERIAL CLEANING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之目的係提供一種基材洗淨裝置，該基材洗淨裝置係可謀求縮短去除附著於基材之洗淨面的被去除物的洗淨時間。基材洗淨裝置(71)係具備在內部具有氣體收容空間(S25)之內部匯流噴嘴(25)。在氣體收容空間(S25)內，噴霧氣體供給配管(15)之噴霧氣體輸出口(15a)與空氣氣體供給配管(16)之空氣氣體輸出口(16a)係配置為相互隔著碰撞區域(80)而相對向，內部匯流噴嘴(25)之氣體輸出面(F25)係位於碰撞區域(80)之下方。洗淨用噴霧氣體(MG1)與空氣氣體(AG1)係在碰撞區域(80)中因碰撞而匯流，而在氣體收容空間(S25)內獲得基材供給用氣體(MG3)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">It is an object of the present disclosure to provide a base material cleaning apparatus that can reduce a cleaning time to remove a removed object adhering to a cleaning surface of a base material. A base material cleaning apparatus (71) includes an internal merging nozzle (25) having a gas containment space (S25) therein. A mist gas outlet (15a) of mist gas supply piping (15) and an air gas outlet (16a) of air gas supply piping (16) are arranged to face each other across a collision region (80) in the gas containment space (S25), and a gas output surface (F25) of the internal merging nozzle (25) is located below the collision region (80). A cleaning mist gas (MG1) and an air gas (AG1) collide in the collision region (80) to be merged to obtain a base material supply gas (MG3) in the gas containment space (S25).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">1a:凹部</p>
        <p type="p">1b:凸部</p>
        <p type="p">1s:表面</p>
        <p type="p">11:超音波霧化器</p>
        <p type="p">13:搬送氣體供給配管</p>
        <p type="p">15:噴霧氣體供給配管</p>
        <p type="p">16:空氣氣體供給配管</p>
        <p type="p">18:凹凸區域</p>
        <p type="p">23:側面</p>
        <p type="p">25:內部匯流噴嘴</p>
        <p type="p">71:基材洗淨裝置</p>
        <p type="p">AG1:空氣氣體</p>
        <p type="p">MG3:基材供給用氣體</p>
        <p type="p">R1,R2:旋轉方向</p>
        <p type="p">TG:搬送氣體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="703px" img-content="tif" inline="yes" orientation="portrait" width="898px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623533</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131665</doc-number>
          <kind></kind>
          <date>114/08/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/20</main-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤村幹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMURA, MOTOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤高充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, TAKAMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-140693</doc-number>
          <date>20240822</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2025/026834</doc-number>
          <date>20250729</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理方法及基板處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係一種基板處理方法，包含以下步驟：  &lt;br/&gt;(a)將基板提供至腔室內之基板支持部上；  &lt;br/&gt;該基板包含蝕刻對象層及圖案層，該圖案層係在該蝕刻對象層上交互分隔地形成有具有第1線寬之第1圖案、及具有比該第1線寬小之第2線寬之第2圖案；  &lt;br/&gt;該第1圖案，從該蝕刻對象層側依序包含第1遮罩材料層及第2遮罩材料層；  &lt;br/&gt;該第2圖案，從該蝕刻對象層側依序包含該第1遮罩材料層、第3遮罩材料層及第4遮罩材料層；  &lt;br/&gt;至少該第1遮罩材料層與該第3遮罩材料層可彼此選擇性去除；  &lt;br/&gt;(b)藉由第1電漿處理，將該第2遮罩材料層選擇性去除，而使該第1圖案中之該第1遮罩材料層及該第2圖案中之該第3遮罩材料層露出；  &lt;br/&gt;(c)藉由第2電漿處理，將該第1遮罩材料層選擇性去除，而使該第1圖案及該第2圖案成為比該第1線寬小之第3線寬；以及，  &lt;br/&gt;(d)藉由第3電漿處理，對受到具有該第3線寬之該第1圖案及該第2圖案遮蓋之該蝕刻對象層進行蝕刻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">ST2,ST21~ST23:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="391px" img-content="tif" inline="yes" orientation="portrait" width="527px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202623589</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131697</doc-number>
          <kind></kind>
          <date>114/08/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/70</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商巴川集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMOEGAWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菅原大和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGAWARA, MASAKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206678</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>靜電夾頭</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種電特性(放電抑制、靜電特性等)良好之靜電夾頭。本發明之靜電夾頭(10)係於載置面(11)具有凹部(12)，該靜電夾頭(10)具備：一個或複數個電極(13)，係沿著載置面(11)配置；基台(14)；及，介電層(15)，係於基台(14)與載置面(11)之間積層有電極(13)；並且，在從與載置面(11)垂直之方向觀看之俯視下，具有凹部(12)與電極(13)重疊之區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:對稱軸</p>
        <p type="p">L1,L2,L3,L4:長度</p>
        <p type="p">10:靜電夾頭</p>
        <p type="p">11:載置面</p>
        <p type="p">12:凹部</p>
        <p type="p">12i:內周側壁</p>
        <p type="p">12o:外周側壁</p>
        <p type="p">13:電極</p>
        <p type="p">14:基台</p>
        <p type="p">14a:導電層</p>
        <p type="p">15:介電層</p>
        <p type="p">15a:接著劑層</p>
        <p type="p">15b:樹脂薄膜</p>
        <p type="p">16:陶瓷層</p>
        <p type="p">17:密著層</p>
        <p type="p">18:接著層</p>
        <p type="p">19:堤部</p>
        <p type="p">20:樹脂層</p>
        <p type="p">30:構件；被載置構件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="696px" img-content="tif" inline="yes" orientation="portrait" width="706px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622786</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131717</doc-number>
          <kind></kind>
          <date>114/08/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120251001B">G06F30/12</main-classification>
        <further-classification edition="202001120251001B">G06F30/31</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本将史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, SHOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林真悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新岡正彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIOKA, MASAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>立川智基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TACHIKAWA, TOMOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206158</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>圖面作業支援系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於在作業終端上顯示圖面以支援作業之情形下，自圖面自動地擷取起點、終點、及起點終點間之整個路徑。  &lt;br/&gt;本發明之圖面作業支援系統產生圖面內之配線與圖面符號之間之連接資訊，將前述配線或前述圖面符號作為表示前述連接之起點或終點之起點終點要素而擷取，自前述起點終點要素判別前述起點與前述終點且擷取前述起點與前述終點之間之路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:圖面作業支援系統</p>
        <p type="p">110:圖面</p>
        <p type="p">120:圖面要素擷取部</p>
        <p type="p">130:起點終點要素擷取部</p>
        <p type="p">140:起點終點間路徑擷取部</p>
        <p type="p">150:資料庫</p>
        <p type="p">151:圖面符號</p>
        <p type="p">152:配線</p>
        <p type="p">153:文字</p>
        <p type="p">154:起點終點要素</p>
        <p type="p">155:路徑</p>
        <p type="p">200:收發伺服器</p>
        <p type="p">300:可攜式終端</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10038.JPG" file="ed10038.JPG" height="579px" img-content="tif" inline="yes" orientation="portrait" width="715px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622731</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131738</doc-number>
          <kind></kind>
          <date>114/08/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120251118B">G06F9/44</main-classification>
        <further-classification edition="200601120251118B">G06F15/16</further-classification>
        <further-classification edition="201901120251118B">G06F16/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國銀聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫曉良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XIAOLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁克會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, KEHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, RUITAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117109147</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種資料庫混合部署方法及裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種資料庫混合部署方法及裝置，其方法包括：獲取第一請求，用於請求在資料庫平台申請創建第一資料庫服務，資料庫平台包括至少一個伺服器集群以及支援多種晶片類型的軟體鏡像，每個伺服器集群包括支援至少一種晶片類型的伺服器；在資料庫軟體部署過程中，針對每個資料庫節點，根據使用者為該第一資料庫服務選擇的晶片架構，在資料庫集群中篩選支援該資料庫節點對應的晶片類型的伺服器以及從資料庫平台篩選支援該資料庫節點對應的晶片類型的軟體鏡像，根據第一軟體鏡像，在第一伺服器上部署資料庫節點。從而在多晶片類型伺服器同時使用的場景下，實現根據使用者需求自行選擇的晶片架構來部署資料庫服務，從而快速滿足業務需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">210-220:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="421px" img-content="tif" inline="yes" orientation="portrait" width="677px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621769</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131742</doc-number>
          <kind></kind>
          <date>114/08/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260225B">A63F13/5252</main-classification>
        <further-classification edition="201401120260225B">A63F13/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商天舞矽谷有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKYDANCE SILICON VALLEY, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊薩克　傑瑞米　路克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISAAK, JEREMY LUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓋斯特　布雷克　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUEST, BLAKE STEPHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比克　朱利安　安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEAK, JULIAN ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨尼格　艾米　珍妮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HENNIG, AMY JEANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/686,333</doc-number>
          <date>20240823</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/300,586</doc-number>
          <date>20250814</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>在互動式遊戲中完全控制的相機系統</chinese-title>
        <english-title>FULLY CONTROLLED CAMERA SYSTEMS IN INTERACTIVE GAMES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中所描述之具體實例教示了用於互動式遊戲環境之完全控制的相機系統，這些完全控制的相機系統使相機視角改變自動化以創建一電影體驗，而無需玩家手動輸入。在一給定遊戲環境內，建立複數個潛在相機點，其各自表示一可能的視圖。當作為基於遊戲進程、敘述事件或一技術評估之一觸發點的一切換點出現時，該系統會啟動一選擇程序。該選擇程序針對各可用相機點產生一相機得分。此得分為一數值，其基於各種資料表示彼視角之品質及適用性。該系統接著自動將所呈現視圖切換至具有最高的當前相機得分之相機點。此確保始終向玩家提供最佳且最具沉浸感的視點，從而增強故事敘述並降低相機管理之複雜性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein teach of fully controlled camera systems for interactive game environments that automate camera perspective changes to create a cinematic experience without requiring manual player input. Within a given game environment, a plurality of potential camera points are established, each representing a possible view. When a cut point, which is a trigger based on gameplay, narrative events, or a technical evaluation, occurs, the system initiates a selection process. It generates a camera score for each available camera point. This score is a numerical value representing the quality and suitability of that perspective based on various data. The system then automatically cuts the rendered view to the camera point with the highest current camera score. This ensures the player is always presented with the most optimal and immersive viewpoint, enhancing storytelling and reducing the complexity of camera management.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電動遊戲生態系統</p>
        <p type="p">110:中央伺服器</p>
        <p type="p">120:網際網路</p>
        <p type="p">130:個人電腦</p>
        <p type="p">140:行動遊戲控制台</p>
        <p type="p">145:家用遊戲控制台</p>
        <p type="p">150:路由器</p>
        <p type="p">160:智慧型手機</p>
        <p type="p">170:遊戲膝上型電腦</p>
        <p type="p">180:平板電腦</p>
        <p type="p">190:可穿戴裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="754px" img-content="tif" inline="yes" orientation="portrait" width="1038px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623009</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131755</doc-number>
          <kind></kind>
          <date>114/08/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">H01F27/28</main-classification>
        <further-classification edition="200601120260226B">H01F17/04</further-classification>
        <further-classification edition="200601120260226B">H02M3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛挺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃道成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, DAOCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃文洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WENYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇禕世</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, YISHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/811,329</doc-number>
          <date>20240821</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電源模組及其電感器組件</chinese-title>
        <english-title>A POWER SUPPLY MODULE AND INDUCTOR ASSEMBLY THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種電源模組及其電感器組件。電源模組包括電感器組件和位於其下方的元件基板。電感器組件具有彼此相對的第一表面和第二表面，並包括磁芯和至少部分嵌入在磁芯內的第一線圈與第二線圈。第一線圈和第二線圈均包括第一部分、至少部分暴露在電感器組件的第一表面的第二部分、連接第一部分和第二部分的第三部分、以及第四部分。元件基板包括至少部分嵌入在元件基板內的第一功率元件晶片和第二功率元件晶片。第一線圈具有電連接至第一功率元件晶片的第一端部和電連接至第一輸出電壓端子的第二端部。第二線圈具有電連接至第二輸出電壓端子的第一端部和電連接至第二功率元件晶片的第二端部。本公開的電源模組具有高效率、高整合度、以及快速的暫態響應。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power module and an inductor assembly thereof are disclosed. The power module comprises an inductor assembly and a device substrate disposed below the inductor assembly. The inductor assembly has a first surface and a second surface opposite each other and comprises a magnetic core and a first winding and a second winding which are at least partially embedded within the magnetic core. The first winding and the second winding each comprise a first portion, a second portion which is at least partially exposed on the first surface of the inductor assembly, a third portion connecting the first portion and the second portion, and a fourth portion. The device substrate comprises a first power device die and a second power device die which are at least partially embedded within the device substrate. The first winding has a first end electrically connected to the first power device die and a second end electrically connected to the first output voltage terminal. The second winding has a first end electrically connected to the second output voltage terminal and a second end electrically connected to the second power device die. The power module of the present disclosure has high efficiency, high integration, and fast transient response.</p>
      </isu-abst>
      <representative-img>
        <p type="p">50:電源模組</p>
        <p type="p">501:底部基板</p>
        <p type="p">502:元件基板</p>
        <p type="p">503-1:第一線圈</p>
        <p type="p">503-2:第二線圈</p>
        <p type="p">503-5:磁芯</p>
        <p type="p">503-6:二次線圈</p>
        <p type="p">502-a:第一表面</p>
        <p type="p">502-b:第二表面</p>
        <p type="p">502-1:第一功率元件晶片</p>
        <p type="p">502-2:第二功率元件晶片</p>
        <p type="p">502-3:連接器</p>
        <p type="p">502-4:連接器</p>
        <p type="p">502-5:連接器</p>
        <p type="p">502-6:連接器</p>
        <p type="p">502-7:頂部散熱層</p>
        <p type="p">502-8:頂部散熱層</p>
        <p type="p">502-9:連接器</p>
        <p type="p">502-10:連接器</p>
        <p type="p">502-p:被動組件</p>
        <p type="p">503-1a:第一部分</p>
        <p type="p">503-1b:第二部分</p>
        <p type="p">503-1c:第三部分</p>
        <p type="p">503-1d:第四部分</p>
        <p type="p">503-2a:第一部分</p>
        <p type="p">503-2b:第二部分</p>
        <p type="p">503-2c:第三部分</p>
        <p type="p">503-2d:第四部分</p>
        <p type="p">503-6a:第一部分</p>
        <p type="p">503-6b:第二部分</p>
        <p type="p">503-6c:第三部分</p>
        <p type="p">503-6d:第四部分</p>
        <p type="p">503-6e:第五部分</p>
        <p type="p">503-5a:第一磁芯部分</p>
        <p type="p">503-5b:第二磁芯部分</p>
        <p type="p">503-5c:第三磁芯部分</p>
        <p type="p">503-a:第一表面</p>
        <p type="p">503-b:第二表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10052.png" file="d10052.TIF" giffile="ed10052.png" height="904px" img-content="tif" inline="yes" orientation="portrait" width="703px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622514</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131840</doc-number>
          <kind></kind>
          <date>114/08/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250924B">G01R1/067</main-classification>
        <further-classification edition="200601120250924B">G01R1/073</further-classification>
        <further-classification edition="202001120250924B">G01R31/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商宇德曼斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WITHMEMS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夫鐘郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BU, JONG-UK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丘璜燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, HWANG-SUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鎬根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HO GEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方鎬燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANG, HO SUB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鍾翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JONG HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李載一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JAE IL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴光英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PAKR, KWANG YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丘瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, SEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車在祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHA, JAEWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉錫奐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, SEOK HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相協</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANGHYEOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0172220</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有可動型接觸凸塊陣列的探針探頭以及適用該探針探頭的探針卡</chinese-title>
        <english-title>PROBE HEAD WITH A MOVABLE CONTACT BUMP ARRAY AND PROBE CARD APPLYING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種具有可動型接觸凸塊陣列的探針探頭以及適用該探針探頭的探針卡。根據本發明的具有可動型接觸凸塊陣列的探針探頭，作為用於對電子元件進行檢查的探針探頭，包括：一可動型接觸凸塊陣列，包括與該電子元件的一被測定部位電性接觸的多個可動型接觸凸塊模組，將多個可動型接觸凸塊模組按照預定的排列配備；該可動型接觸凸塊模組，包括：一接觸凸塊，與該被測定部位電性接觸；一可動板，與該接觸凸塊以結合型或一體型配備，通過在與該被測定部位電性接觸時的外力作用而沿著上下方向移動；一個以上的懸架彈簧，一側對該可動板進行彈性支撐；以及一個以上的支柱，對該懸架彈簧的另一側進行固定支撐。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">110:可動型接觸凸塊模組</p>
        <p type="p">111:支柱</p>
        <p type="p">112:懸架彈簧</p>
        <p type="p">113:可動板</p>
        <p type="p">114:接觸凸塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="404px" img-content="tif" inline="yes" orientation="portrait" width="742px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622621</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131891</doc-number>
          <kind></kind>
          <date>114/08/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120260225B">G03B11/04</main-classification>
        <further-classification edition="200601120260225B">G02B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商凸版控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOPPAN HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古賀由泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>碓冰數馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUI, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松隈香織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUGUMA, KAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林昭彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-143375</doc-number>
          <date>20240823</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>遮光板用基材、金屬遮光板、相機模組及電子機器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於製作金屬遮光板的遮光板用基材，其表面具有鈍化膜，且鈍化膜的厚度為50Å以上100Å以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623626</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131897</doc-number>
          <kind></kind>
          <date>114/08/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W15/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="200601120260302B">H01B3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｒａｐｉｄｕｓ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAPIDUS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇佐美達矢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USAMI, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,145</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2025/026590</doc-number>
          <date>20250728</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">構成一種半導體裝置，具有：複數下層導電圖案，其係被形成在基板之上方；下層絕緣膜，其係在使上述複數下層導電圖案的上部突出之狀態下，埋入上述下層導電圖案間；中間絕緣膜，其係以從上述下層導電圖案突出的膜厚相對於上述下層絕緣膜自對準地被設置；複數上層導電圖案，其係在從上述中間絕緣膜突出的狀態下，在上述中間絕緣膜間與上述複數下層導電圖案接合而被設置；以及上層絕緣膜，其係在埋入上述複數上層導電圖案間的狀態下被設置在上述中間絕緣膜的上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體裝置</p>
        <p type="p">10:下層導電圖案</p>
        <p type="p">10a:上面(下層導電圖案)</p>
        <p type="p">20:上層導電圖案</p>
        <p type="p">100:下層絕緣膜</p>
        <p type="p">200:中間絕緣膜</p>
        <p type="p">200a,200b:界面</p>
        <p type="p">300:上層絕緣膜</p>
        <p type="p">300’:上層阻擋絕緣膜</p>
        <p type="p">301:導通孔缺口</p>
        <p type="p">M1:下層配線</p>
        <p type="p">M2:上層配線</p>
        <p type="p">M1a,M2a:蓋層</p>
        <p type="p">V2:上層導通孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="616px" img-content="tif" inline="yes" orientation="portrait" width="776px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621821</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131934</doc-number>
          <kind></kind>
          <date>114/08/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B22F7/08</main-classification>
        <further-classification edition="200601120260302B">H01B1/22</further-classification>
        <further-classification edition="200601120260302B">H01B1/00</further-classification>
        <further-classification edition="202201120260302B">B22F1/00</further-classification>
        <further-classification edition="200601120260302B">B22F7/04</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱綜合材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI MATERIALS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森優太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, YUTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古山大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUYAMA, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中川卓眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAGAWA, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-139408</doc-number>
          <date>20240821</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2025/029291</doc-number>
          <date>20250821</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>接合體及接合體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">適當地接合構件彼此，抑制構件彼此的接合強度之降低。接合體(100)具有第1構件(20)、第2構件(30)與銅製接合層(10A)，其中銅製接合層(10A)位於第1構件(20)與第2構件(30)之間，接合層(10A)之密度為50%以上99%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:接合層</p>
        <p type="p">20:第1構件</p>
        <p type="p">22,32:元件層</p>
        <p type="p">24,34:突起電極</p>
        <p type="p">24a,34a:表面</p>
        <p type="p">30:第2構件</p>
        <p type="p">100:接合體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="505px" img-content="tif" inline="yes" orientation="portrait" width="731px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621898</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114131940</doc-number>
          <kind></kind>
          <date>114/08/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">B32B27/18</main-classification>
        <further-classification edition="200601120251103B">B32B27/28</further-classification>
        <further-classification edition="201901120251103B">B32B7/02</further-classification>
        <further-classification edition="200601120251103B">B32B7/12</further-classification>
        <further-classification edition="200601120251103B">C09J11/04</further-classification>
        <further-classification edition="200601120251103B">C09J133/00</further-classification>
        <further-classification edition="200601120251103B">C09J9/00</further-classification>
        <further-classification edition="200601120251103B">C08L79/08</further-classification>
        <further-classification edition="200601120251103B">C08L63/00</further-classification>
        <further-classification edition="200601120251103B">C08K3/22</further-classification>
        <further-classification edition="200601120251103B">C08J5/18</further-classification>
        <further-classification edition="200601120251103B">C09D179/08</further-classification>
        <further-classification edition="201801120251103B">C09D7/65</further-classification>
        <further-classification edition="201801120251103B">C09D7/61</further-classification>
        <further-classification edition="200601120251103B">C09K5/14</further-classification>
        <further-classification edition="200601120251103B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞洲電材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASIA ELECTRONIC MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李韋志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WEI CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何家華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIA HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIH MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜伯賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, BO SIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHIEN HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>潘柏均</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116616106</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>高導熱複合膜及其製備方法</chinese-title>
        <english-title>HIGH THERMAL CONDUCTIVE COMPOSITE FILM AND PREPARATION METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種高導熱複合膜及其製備方法，該高導熱複合膜包括至少兩層高分子薄膜及位於相鄰兩層該高分子薄膜之間的至少一層具有導熱粉體的導熱黏著層，其中，該高分子薄膜係塗佈型聚醯亞胺薄膜或拉伸型聚醯亞胺薄膜。該導熱黏著層中的導熱粉體含量為50至85重量%，且該導熱粉體的粒徑為0.5至10μm；該導熱黏著層及高導熱複合膜的厚度分別為5至100μm及15至800μm。本發明的塗佈型聚醯亞胺薄膜或拉伸型聚醯亞胺薄膜可令高導熱複合膜具有優異的絕緣性能，使產品整體厚度更薄、散熱效率高，並搭配導熱黏著層來補足整體的散熱與絕緣效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a high thermal conductive composite film and a preparation method thereof, wherein the high thermal conductive composite film comprises at least two layers of polymer film and at least one layer of thermal conductive powder-containing thermal conductive adhesive layer disposed between two adjacent layers of the polymer film, wherein the polymer film is coated polyimide film or stretched polyimide film. Content of the thermal conductive powder in the thermal conductive adhesive layer is 50 to 85 wt%, and the particle size of the thermal conductive powder is 0.5 to 10 μm. Thickness of the thermal conductive adhesive layer and the high thermal conductive composite film are 5 to 100 μm and 15 to 800 μm respectively. The high thermal conductive composite film of the present invention has excellent insulating performance, thinner product thickness and high heat dissipation efficiency by using the coated polyimide film or stretched polyimide film. The thermal conductive adhesive layer is also applied for overall heat dissipation and insulating effects.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:高分子薄膜</p>
        <p type="p">200:導熱黏著層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="412px" img-content="tif" inline="yes" orientation="portrait" width="501px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622900</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132009</doc-number>
          <kind></kind>
          <date>114/08/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260211B">G06V10/26</main-classification>
        <further-classification edition="202201120260211B">G06V10/42</further-classification>
        <further-classification edition="202201120260211B">G06V10/82</further-classification>
        <further-classification edition="202301120260211B">G06N3/08</further-classification>
        <further-classification edition="201801120260211B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＣＫＤ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CKD CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊池和義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUCHI, KAZUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205104</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>焊料檢查裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]&lt;br/&gt;  本發明的目的在於提供能夠減少在獲得AI模型之形式的識別手段時的勞力和負擔，並且即便焊盤的尺寸不同，識別手段仍能夠共通利用的焊料檢查裝置。&lt;br/&gt;  [解決手段]&lt;br/&gt;  令預定的神經網路僅以良品的焊料膏的圖像資料作為學習資料進行學習而生成AI模型101，對該AI模型101輸入依據藉由攝像機32d所取得的圖像資料的檢查用圖像資料而取得重建圖像資料，將檢查用圖像資料及重建圖像資料進行比較，藉此判定焊料膏的良否。學習資料及檢查用圖像資料係設為將對焊料區域圖像進行二分割或四分割所獲得之分割焊料圖像設置於圖像框而成，學習資料的圖像框與檢查用圖像資料的圖像框係設為相同尺寸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">90:神經網路</p>
        <p type="p">91:編碼器部</p>
        <p type="p">92:解碼器部</p>
        <p type="p">93:卷積層</p>
        <p type="p">94,96:過濾器(核)</p>
        <p type="p">95:逆卷積層</p>
        <p type="p">GA,GB:圖像資料</p>
        <p type="p">TA:特徵量(潛在變數)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10057.JPG" file="ed10057.JPG" height="975px" img-content="tif" inline="yes" orientation="portrait" width="530px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622406</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132010</doc-number>
          <kind></kind>
          <date>114/08/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">F16K31/60</main-classification>
        <further-classification edition="200601120260225B">F16K7/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士金股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKIN INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田和大典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAWA, TAKENORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石橋圭介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIBASHI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藥師神忠幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAKUSHIJIN, TADAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田章弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻田敏之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INADA, TOSHIYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-141806</doc-number>
          <date>20240823</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>閥</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]&lt;br/&gt;  提供一種閥，該閥在操作用手柄的安裝時和卸除時不會產生粒子，且可防止操作用手柄的脫落。&lt;br/&gt;  [解決手段]&lt;br/&gt;  操作用手柄4係具備覆蓋固定於閥帽3之圓筒狀指示器9的筒狀部41，在筒狀部41的內周面形成有通過形成於指示器9的溝部90之突起狀引導件43，藉由偏置手段10恆常被偏置於解除操作用手柄4與閥桿5之卡合的方向。形成於指示器9的溝部90，係由容許操作用手柄4轉動的圓周方向溝90a、及容許操作用手柄4軸向移動且遍及指示器9的軸向全長的軸向溝90d所構成，在該軸向溝90d配備有彈性卡止構件6，該彈性卡止構件6於引導件43通過時藉由既定按壓力之賦予而撓曲，以容許引導件43通過。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:閥</p>
        <p type="p">2:閥本體</p>
        <p type="p">3:閥帽</p>
        <p type="p">4:操作用手柄</p>
        <p type="p">5:閥桿</p>
        <p type="p">6:彈性卡止構件</p>
        <p type="p">7:隔膜壓板</p>
        <p type="p">8:隔膜</p>
        <p type="p">9:指示器</p>
        <p type="p">10:偏置手段</p>
        <p type="p">20:流體流路</p>
        <p type="p">20A:流入路</p>
        <p type="p">20B:流出路</p>
        <p type="p">21:閥座</p>
        <p type="p">22:陰螺紋部</p>
        <p type="p">30:陽螺紋部</p>
        <p type="p">31:陰螺紋部</p>
        <p type="p">32:隔膜固定構件</p>
        <p type="p">40:操作部</p>
        <p type="p">41:筒狀部</p>
        <p type="p">43:引導件</p>
        <p type="p">44:插通口</p>
        <p type="p">55:卡合片</p>
        <p type="p">61:豎設部</p>
        <p type="p">90:溝部</p>
        <p type="p">90d:軸向溝</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="922px" img-content="tif" inline="yes" orientation="portrait" width="601px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622552</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132050</doc-number>
          <kind></kind>
          <date>114/08/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B5/22</main-classification>
        <further-classification edition="201501120260302B">G02B1/11</further-classification>
        <further-classification edition="202501120260302B">H10H29/855</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼集團公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY GROUP CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長谷川万里子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASEGAWA, MARIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西中逸平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHINAKA, IPPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤阪慎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKASAKA, SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀越涼子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIKOSHI, RYOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-178814</doc-number>
          <date>20241011</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置，面板片，顯示裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題是在於實現以較少層數使兼具防眩光與反射降低效果的面板表面構造。  &lt;br/&gt;　　其解決手段是顯示裝置具備影像顯示面的層構造，該構造是藉由第一層及第二層所密封，且具有第三層，  &lt;br/&gt;　　該第一層是藉由光吸收材料的添加而呈現第一黑色濃度的同時，在成為畫面的表面側的面上包含用以取得防眩光功能的凹凸，  &lt;br/&gt;　　該第二層是藉由光吸收材料的添加而呈現比前述第一黑色濃度更高的第二黑色濃度，並接觸於成為前述第一層的非表面側的面，  &lt;br/&gt;　　該第三層是形成於安裝有用以構成像素的發光元件的基板的安裝面上，而與前述第二層接觸的同時，呈現第二黑色濃度以上的第三黑色濃度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:基板</p>
        <p type="p">3:防焊光阻層</p>
        <p type="p">7,7B,7G 7R:LED</p>
        <p type="p">11:第一層</p>
        <p type="p">11a:凹凸形狀</p>
        <p type="p">12:第二層</p>
        <p type="p">12a:發光面覆蓋部分</p>
        <p type="p">12b:側面覆蓋部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="578px" img-content="tif" inline="yes" orientation="portrait" width="747px">
          </img>
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      <volno>24</volno>
      <isuno>11</isuno>
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          <doc-number>202623516</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132098</doc-number>
          <kind></kind>
          <date>114/08/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/40</main-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商中央硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CENTRAL GLASS COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山田真輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMADA, MASAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮崎達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAZAKI, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口敬寿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TAKAHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-142335</doc-number>
          <date>20240823</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>矽氧化膜的製造方法、半導體器件的製造方法、半導體器件及藥液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種經充分氧化之薄的矽氧化膜的製造方法。本揭露係關於一種矽氧化膜的製造方法，其特徵在於包含：使包含磺酸化合物及氧化性物質的藥液與矽接觸以形成矽氧化膜的工序，所述磺酸化合物具有一部分或全部之氫原子經鹵原子取代的碳數1～8的烴基。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:矽氧化膜</p>
        <p type="p">3:金屬氧化物膜</p>
        <p type="p">11:形成矽氧化膜的工序</p>
        <p type="p">13:形成金屬氧化物膜的工序</p>
        <p type="p">Si:單晶矽膜</p>
        <p type="p">(100):單晶矽膜的(100)面</p>
        <p type="p">(110):單晶矽膜的(110)面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="965px" img-content="tif" inline="yes" orientation="portrait" width="425px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623512</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132235</doc-number>
          <kind></kind>
          <date>114/08/25</date>
        </document-id>
      </application-reference>
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        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商荏原製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBARA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐鳥博俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATORI, HIROTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸山浩二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUYAMA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳凱智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-150462</doc-number>
          <date>20240902</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>接合複數基板之積層基板的製作方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於將複數基板（例如晶圓）貼合以製作積層基板的方法。積層基板（Ws）的製作方法包含下述步驟：藉由修整裝置在第1基板（W1）的周緣部形成段部；藉由填充裝置將填充材（5）填充至段部；藉由平坦化裝置將填充材（5）的一部分去除到填充材（5）的露出面與第1基板（W1）的第1表面（1a）位於同一平面內為止；將經去除填充材（5）的一部分的第1基板（W1）的第1表面（1a）接合於第2基板（W2）；藉由薄化裝置研削第1基板（W1）中與第1表面（1a）相反側的第2表面（1b）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:第1表面</p>
        <p type="p">1b:第2表面</p>
        <p type="p">2a:第1表面</p>
        <p type="p">3,7:段部</p>
        <p type="p">4:內側角部</p>
        <p type="p">5,8:填充材</p>
        <p type="p">W1:第1基板</p>
        <p type="p">W2:第2基板</p>
        <p type="p">Ws:積層基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="997px" img-content="tif" inline="yes" orientation="portrait" width="609px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202623594</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114132242</doc-number>
          <kind></kind>
          <date>114/08/25</date>
        </document-id>
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        <main-classification edition="202601120260302B">H10P72/72</main-classification>
        <further-classification edition="202601120260302B">H10P95/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商巴川集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMOEGAWA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小久井(山路)舞香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOKUI(YAMAJI), MAIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-196563</doc-number>
          <date>20241111</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電性電路連接部、導電片、靜電夾頭及加熱器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可良好地連接電極電路與連接電路且具優異耐久性(長壽命、電特性(導電性、絕緣性)等)之電性電路連接部、導電片、靜電夾頭及加熱器。本發明之電性電路連接部(31)連接電極電路(10)與連接電路(20)。電極電路(10)具有由第1導電材料(12)構成之電極導體(11)，連接電路(20)具有由第2導電材料(22)構成之連接導體(21)，電性電路連接部(31)在電極導體(11)與連接導體(21)之間具有混合區域(32)，前述混合區域(32)係由第1導電材料(12)及第2導電材料(22)所含材料構成，且第1導電材料(12)與第2導電材料(22)係混合存在而接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電極電路</p>
        <p type="p">11:電極導體</p>
        <p type="p">12:第1導電材料</p>
        <p type="p">13:絕緣樹脂膜</p>
        <p type="p">14:缺口部</p>
        <p type="p">20:連接電路</p>
        <p type="p">21:連接導體</p>
        <p type="p">22:第2導電材料</p>
        <p type="p">31:電性電路連接部</p>
        <p type="p">32:混合區域</p>
        <p type="p">33:非接合部</p>
        <p type="p">34:凹凸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="515px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622460</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114132250</doc-number>
          <kind></kind>
          <date>114/08/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260204B">G01B11/25</main-classification>
        <further-classification edition="202101120260204B">G03B17/02</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＣＫＤ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CKD CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高村健介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAMURA, KENSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大山剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHYAMA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205102</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
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        <chinese-title>三維測量裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">[課題]&lt;br/&gt;  提供一種三維測量裝置，該三維測量裝置在使用DMD等反射型光調變元件的情形下，既可更確實地防止測量精度的降低，又能達成延長光源壽命。&lt;br/&gt;  [解決手段]&lt;br/&gt;  控制第一投影裝置、第二投影裝置及攝影機，對複數種條紋圖案依序投影、拍攝，藉此取得光強度分布不同的複數個影像資料。在取得影像資料時，投影裝置4x、4y分別會依序執行相位變化亮燈處理，該處理係開始投影裝置4x、4y的光源亮燈且經過由該光源發出的光的亮度呈穩定為止所需的上升時間之後，於保持使該光源亮燈的狀態下使條紋圖案的相位變化複數次之後，再將該光源熄燈。此外，在光源亮燈中且由該光源發出的光的亮度呈穩定時，攝影機5執行對相位不同的複數種條紋圖案分別拍攝的連續拍攝處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="990px" img-content="tif" inline="yes" orientation="portrait" width="657px">
          </img>
        </representative>
      </representative-img>
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  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621927</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132275</doc-number>
          <kind></kind>
          <date>114/08/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120250908B">B61D17/10</main-classification>
        <further-classification edition="200601120250908B">B61D49/00</further-classification>
        <further-classification edition="200601120250908B">G10K11/16</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立製作所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口航希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢部慎太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YABE, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤郁也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, FUMIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>金保忠正</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEYASU, TADAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下慎二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武藤大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MUTO, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-201825</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鐵道車輛</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 被封入鐵道車輛之結構體-內裝之間、或者地板芯材等的雙層壁構造內部的吸音材中，就算鐵道車輛之結構體的尺寸精度為不佳之情況，在減低吸音材封入工時的同時，實現車內噪音之減低。  &lt;br/&gt;　　[解決手段] 一種鐵道車輛，在車體的結構體-內裝間、或地板芯材中，被封入有吸音材；其中，該吸音材是相對於被封入在吸音材安裝部件之中央部的設置有壓縮裕度(壓縮量)的纖維材而言，透過將容積密度變疏鬆、且厚度變小的纖維材進行鄰接配置，從而被疏密配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">15:上地板邊緣材</p>
        <p type="p">51:吸音材(壓縮對象)</p>
        <p type="p">52:吸音材(等倍封入)</p>
        <p type="p">50:吸音材疏密配置單元</p>
        <p type="p">67:內裝面板安裝金屬件</p>
        <p type="p">80:吸音材固定側部件(結構體激振側)</p>
        <p type="p">81:吸音材按壓部件(內裝響應側)</p>
        <p type="p">82:壓縮裕度</p>
        <p type="p">83:構造厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.png" file="d10021.TIF" giffile="ed10021.png" height="708px" img-content="tif" inline="yes" orientation="portrait" width="868px">
          </img>
        </representative>
      </representative-img>
    </description>
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  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622298</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114132284</doc-number>
          <kind></kind>
          <date>114/08/25</date>
        </document-id>
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        <main-classification edition="200601120251216B">C30B11/00</main-classification>
        <further-classification edition="200601120251216B">C30B15/10</further-classification>
        <further-classification edition="200601120251216B">C30B15/20</further-classification>
        <further-classification edition="200601120251216B">C30B15/14</further-classification>
        <further-classification edition="200601120251216B">C30B29/42</further-classification>
        <further-classification edition="200601120251216B">C30B29/40</further-classification>
        <further-classification edition="200601120251216B">C30B31/00</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐田野正崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATANO, MASATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西岡志行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIOKA, MUNEYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋尾克司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIO, KATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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          </inventor>
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        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/041980</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化合物半導體基板及化合物半導體基板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之化合物半導體基板具有主面。化合物半導體基板包含雜質。化合物半導體基板由砷化鎵或磷化銦形成。於主面之X射線形貌像中，確認到因雜質而產生之波紋樣圖案。波紋樣圖案的形狀相當於從波源呈同心圓狀擴散之波紋之一部分。相當於從波源呈同心圓狀擴散之波紋之一部分。主面之中心與波源之間的距離除以主面之半徑所得之值為0.1以上0.9以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第1主面</p>
        <p type="p">8:外緣</p>
        <p type="p">91:圓</p>
        <p type="p">92:圓弧</p>
        <p type="p">100:化合物半導體基板</p>
        <p type="p">A:中心</p>
        <p type="p">D:直徑</p>
        <p type="p">E1:第1距離</p>
        <p type="p">P:波紋樣圖案</p>
        <p type="p">R1:第1半徑</p>
        <p type="p">X:波源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="805px" img-content="tif" inline="yes" orientation="portrait" width="694px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202622948</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132291</doc-number>
          <kind></kind>
          <date>114/08/25</date>
        </document-id>
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        <main-classification edition="200601120260302B">G09G3/34</main-classification>
        <further-classification edition="201901120260302B">G02F1/167</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商電子墨水股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>E INK CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶　德強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAO, DUC-CUONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　水晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, CRYSTAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>哈瑞斯　喬治Ｇ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRIS, GEORGE G.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　天佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, BRYAN HANS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/688,468</doc-number>
          <date>20240829</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有擴充調色板的電泳顯示器</chinese-title>
        <english-title>ELECTROPHORETIC DISPLAYS WITH EXPANDED COLOR PALETTES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種驅動彩色電泳顯示器的方法包括：(a)接收待顯示的一影像；以及(b)藉由在該顯示器的像素電極與透光電極之間施加波形的時間相依電壓來驅動該電泳顯示器的每個顯示像素至一目標顏色狀態以顯現該影像。為了在一顯示像素處產生一原色，從該組原色波形選擇與該原色相對應的一原色波形並將其施加至該顯示像素。為了在一顯示像素處產生一原色的一變型，從該組調整因數選擇與該變型相對應的一調整因數並將其應用於該對應原色波形，以產生一調整波形，然後將該調整波形施加至該顯示像素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for driving a color electrophoretic display includes (a) receiving an image to be displayed; and (b) driving each display pixel of the electrophoretic display to a targeted color state by applying time-dependent voltages of waveforms between the pixel electrodes and the light-transmissive electrode of the display to render the image. To produce a primary color at a display pixel, a primary color waveform corresponding to the primary color is selected from the set of primary color waveforms and applied to the display pixel. To produce a variation of a primary color at a display pixel, a scaling factor corresponding to the variation is selected from the set of scaling factors and applied to the corresponding primary color waveform to generate a scaled waveform, and the scaled waveform is applied to the display pixel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621877</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132309</doc-number>
          <kind></kind>
          <date>114/08/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B25J19/04</main-classification>
        <further-classification edition="200601120260302B">B25J9/16</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
        <further-classification edition="200601120260302B">B25J13/08</further-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商布魯克斯自動機械美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　洛伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ROY R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓森　賈斯伯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANSON, CASPAR H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/686,285</doc-number>
          <date>20240823</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>機器視覺基板滑移檢測</chinese-title>
        <english-title>MACHINE VISION SUBSTRATE SLIPPAGE DETECTION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板運送設備包括一連接至基座之機械手臂，此手臂具有一末端執行器。控制器係連接至此手臂。至少一台照相機係通訊地連接至控制器，且被配置成對就位於末端執行器上的基板之預定邊緣部分進行成像。藉由該至少一台照相機成像的預定邊緣部分具有基板之姿勢的預定特徵決定性。控制器登錄藉由至少一台照相機所產生之敘述基板之運動前姿勢的預定邊緣部分的第一影像，且登錄藉由至少一台照相機所產生之敘述基板之運動後姿勢的預定邊緣部分的第二影像。控制器基於基板的運動前姿勢與運動後姿勢之間的差異確定基板在末端執行器上之滑移狀況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate transport apparatus includes a robot arm connected to a base, the arm having an end effector. A controller is connected to the arm. At least one camera is communicably connected to the controller and is arranged to image a predetermined edge part of a substrate seated on the end effector. The predetermined edge part imaged by the at least one camera has a predetermined characteristic determinative of a pose of the substrate. The controller registers a first image generated by the at least one camera of the predetermined edge part describing a pre-movement pose of the substrate, and registers a second image, generated by the at least one camera, of the predetermined edge part describing a post-movement pose of the substrate. The controller determines a slip condition of the substrate on the end effector, based on a variance between the pre-movement pose and post-movement pose of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:匣盒</p>
        <p type="p">130F:基座</p>
        <p type="p">140:工件製程模組</p>
        <p type="p">180:工件運送器</p>
        <p type="p">180TA:運送手臂</p>
        <p type="p">195:基板運送器</p>
        <p type="p">197A:基板檢測器</p>
        <p type="p">197B:基板檢測器</p>
        <p type="p">200:末端執行器</p>
        <p type="p">220:滑動本體</p>
        <p type="p">240:運動基座</p>
        <p type="p">241:基座</p>
        <p type="p">241S:滑軌</p>
        <p type="p">242:驅動器</p>
        <p type="p">242T:傳動裝置</p>
        <p type="p">280:Z-驅動柱</p>
        <p type="p">WHS:基板或工件固持站</p>
        <p type="p">P1:第一位置</p>
        <p type="p">P2:第二位置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="744px" img-content="tif" inline="yes" orientation="portrait" width="988px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622749</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132318</doc-number>
          <kind></kind>
          <date>114/08/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120251001B">G06F12/0802</main-classification>
        <further-classification edition="200601120251001B">G06F3/06</further-classification>
        <further-classification edition="200601120251001B">G06F13/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦東潤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QIN, DONG-RUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/133602</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>計算存儲系統及其操作方法、電子系統</chinese-title>
        <english-title>COMPUTATIONAL STORAGE SYSTEM AND OPERATION METHOD THEREOF, ELECTRONIC SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種計算存儲系統及其操作方法、電子系統，該計算存儲系統包括控制器、與所述控制器耦接的第一記憶體以及用於執行程式的計算處理元件；所述第一記憶體包括為所述計算處理元件執行所述程式過程中的輸入資料/輸出資料配置的相應的存儲區域；所述控制器被配置為：將所述程式執行過程中的輸入資料/輸出資料分批依次刷新至相應的存儲區域中；所述程式執行過程中的輸入資料/輸出資料的大小大於相應的存儲區域的容量大小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosed embodiments provide a computational storage system and an operation method thereof, and an electronic system. The computational storage system includes a controller, a first memory coupled to the controller, and a computational processing component for executing programs; the first memory includes corresponding storage regions configured for input data/output data during execution of the program by the computational processing component; the controller is configured to: refresh the input data/output data in batches and sequentially into the corresponding storage region during the execution of the program; a size of the input data/output data during the execution of the program is greater than a capacity of the corresponding storage region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100、S200:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.JPG" file="ed10028.JPG" height="413px" img-content="tif" inline="yes" orientation="portrait" width="723px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621899</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132373</doc-number>
          <kind></kind>
          <date>114/08/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">B32B27/30</main-classification>
        <further-classification edition="201901120260225B">B32B7/023</further-classification>
        <further-classification edition="200601120260225B">G02F1/13357</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>春木暁人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARUKI, AKIHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>工藤卓磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUDO, TAKUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯田祥人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIDA, YOSHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂木菜菜可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOKI, NANAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂本武士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAMOTO, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-145692</doc-number>
          <date>20240827</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置用障壁膜及使用其之顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種即便於使用矽氧化物時，障壁性亦良好，且能夠抑制顯示裝置之顯示品質之下降的顯示裝置用障壁膜。本發明之顯示裝置用障壁膜依序具有基材、無機氧化物層及外覆層，上述無機氧化物層包含矽氧化物，且厚度為30 nm以上，上述外覆層包含丙烯酸系樹脂，且厚度超過2.0 μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:基材</p>
        <p type="p">12:無機氧化物層</p>
        <p type="p">14:外覆層</p>
        <p type="p">100:顯示裝置用障壁膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="263px" img-content="tif" inline="yes" orientation="portrait" width="402px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622068</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132450</doc-number>
          <kind></kind>
          <date>114/08/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D409/10</main-classification>
        <further-classification edition="200601120260302B">C07D495/04</further-classification>
        <further-classification edition="202301120260302B">H10K85/60</further-classification>
        <further-classification edition="202301120260302B">H10K30/30</further-classification>
        <further-classification edition="202301120260302B">H10K30/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐佐木晃逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SASAKI, KOUITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-146537</doc-number>
          <date>20240828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光電轉換元件、攝像元件、攝像元件之製造方法、光感測器、化合物</chinese-title>
        <english-title>PHOTOELECTRIC CONVERSION ELEMENT, IMAGE CAPTURE ELEMENT, MANUFACTURING METHOD OF IMAGE CAPTURE ELEMENT, OPTICAL SENSOR, AND COMPOUND</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的第1課題為提供一種對藍綠色光之響應速度的電場強度依賴性小的光電轉換元件。又，本發明的第2課題為提供一種攝像元件、攝像元件之製造方法、光感測器及化合物。本發明的光電轉換元件係依序具有導電性膜、光電轉換膜及透明導電性膜之光電轉換元件，其中，上述光電轉換膜包含式（1-1）或式（1-2）所表示之化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="172px" width="605px" file="ed10046.JPG" alt="ed10046.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621775</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132475</doc-number>
          <kind></kind>
          <date>114/08/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">B01D15/00</main-classification>
        <further-classification edition="200601120260225B">B01D35/05</further-classification>
        <further-classification edition="200601120260225B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商科慕ＦＣ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE CHEMOURS COMPANY FC, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>範　瓦塞納　比蓋爾　羅斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN WASSEN, ABIGAIL ROSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布蘭特　德魯　理查德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRANDT, DREW RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波特克　古斯塔沃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POTTKER, GUSTAVO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布雷斯克　史蒂芬　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRESKE, STEPHEN THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/687,803</doc-number>
          <date>20240828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於改善槽效率的被動式過濾</chinese-title>
        <english-title>PASSIVE FILTRATION FOR IMPROVED TANK EFFICIENCY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種浸沒式冷卻系統，其包括：一浸沒槽，其界定容納一介電流體的一空腔；一電氣組件，其設置於該空腔內，其中該電氣組件之至少一部分係浸沒於容納於該空腔內之該介電流體中；及一吸著劑材料，其設置於該空腔內且與該介電流體流體連通，其中與該吸著劑材料接觸的介電流體係藉由與該電氣組件熱連通使該介電流體沸騰而循環，以吸附在該介電流體中之污染物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An immersion cooling system includes an immersion tank defining a cavity retaining a dielectric fluid, an electrical component disposed within the cavity, wherein at least a portion of the electrical component is immersed in the dielectric fluid retained within the cavity, and a sorbent material disposed within the cavity and in fluid communication with the dielectric fluid, wherein dielectric fluid in contact with the sorbent material is circulated by boiling of the dielectric fluid in thermal communication with the electrical component to adsorb contaminants within the dielectric fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:浸沒式冷卻系統</p>
        <p type="p">12:浸沒槽</p>
        <p type="p">14:側面</p>
        <p type="p">16:下表面</p>
        <p type="p">18:上表面</p>
        <p type="p">20:內表面</p>
        <p type="p">22:空腔</p>
        <p type="p">26:流體</p>
        <p type="p">28:電氣組件</p>
        <p type="p">30:基材</p>
        <p type="p">32:晶片</p>
        <p type="p">34:鍋爐板</p>
        <p type="p">36:流體之表面</p>
        <p type="p">38:氣體-蒸氣混合物</p>
        <p type="p">40:富含蒸氣之混合物</p>
        <p type="p">42:富含空氣之混合物</p>
        <p type="p">50:流體冷卻迴路</p>
        <p type="p">52:冷凝器</p>
        <p type="p">52a:冷凝器之出口</p>
        <p type="p">54:流體冷卻器</p>
        <p type="p">54a:流體冷卻器之入口</p>
        <p type="p">56:泵</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="854px" img-content="tif" inline="yes" orientation="portrait" width="579px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622175</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132526</doc-number>
          <kind></kind>
          <date>114/08/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08L63/04</main-classification>
        <further-classification edition="200601120260225B">C08G59/22</further-classification>
        <further-classification edition="200601120260225B">C09K5/08</further-classification>
        <further-classification edition="200601120260225B">C08K3/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商力森諾科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RESONAC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三浦智弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIURA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口翔平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-145882</doc-number>
          <date>20240827</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>密封用樹脂組成物及電子零件裝置</chinese-title>
        <english-title>ENCAPSULATING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種密封用樹脂組成物，包括環氧樹脂、硬化劑、以及包含氧化鋁的無機填充材，所述氧化鋁的水分含量為0.190質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sealing resin composition includes an epoxy resin, a curing agent, and an inorganic filler containing alumina, in which a moisture content of the alumina is 0.190% by mass or less.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622730</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132609</doc-number>
          <kind></kind>
          <date>114/08/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120251001B">G06F9/38</main-classification>
        <further-classification edition="201801120251001B">G06F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王天一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TIANYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/133601</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>計算存儲系統及其操作方法、電子系統</chinese-title>
        <english-title>COMPUTING STORAGE SYSTEM AND OPERATING METHOD THEREFOR, AND ELECTRONIC SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種計算存儲系統及其操作方法、電子系統，該計算存儲系統包括控制器、與所述控制器耦接的第一記憶體以及用於執行程式的計算處理元件；所述控制器被配置為：接收與所述計算存儲系統耦接的主機發送的命令，所述命令用於指示所述計算處理元件執行程式，且所述命令被配置為定義所述程式執行過程中的輸入資料及/或輸出資料在所述第一記憶體中的相應位址的關聯資訊；根據所述關聯資訊，從所述主機得到所述程式執行過程中的輸入資料及/或輸出資料在所述第一記憶體中的相應位址。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide a computing storage system and operating method therefor, and an electronic system. The computing storage system includes a controller, a first memory coupled to the controller, and a computing processing component for executing a program. The controller is configured to: receive a command sent by a host coupled to the computing storage system, the command being used to instruct the computing processing component to execute the program, and being configured to define associated information of a corresponding address of input data and/or output data in the first memory during a program execution process; and according to the associated information, obtain the corresponding address of the input data and/or output data in the first memory during the program execution process from the host.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S200、S201:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="441px" img-content="tif" inline="yes" orientation="portrait" width="749px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622834</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132629</doc-number>
          <kind></kind>
          <date>114/08/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120251008B">G06Q10/20</main-classification>
        <further-classification edition="201301120251008B">G06F3/048</further-classification>
        <further-classification edition="201801120251008B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日立全球先端科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HITACHI HIGH-TECH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉厚志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森弘樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川目康平</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>KONISHI, YAYOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <english-country>JP</english-country>
              <english-address>JP</english-address>
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                <last-name>河合知玲</last-name>
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                <last-name>KAWAI, TOMOAKIRA</last-name>
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              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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                <last-name>小口邦彦</last-name>
                <first-name></first-name>
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                <last-name>OGUCHI, KUNIHIKO</last-name>
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                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
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              <address>臺北市</address>
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          </agent>
        </agents>
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        <p type="p">[課題] 提供一種技術，使使用者可以快速解析自動分析裝置所輸出的日誌。  &lt;br/&gt;　　[解決手段] 本發明相關的自動分析系統，係取得記述自動分析裝置狀態的日誌，並在顯示裝置上平行顯示：表示時序的第1行、顯示異常動作或正常動作的警報標記的第2行、以及顯示與異常不同的事件的事件標記的第3行，並且當前述顯示裝置上的指標移動到前述事件標記上時，會顯示前述事件的詳細資訊。</p>
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        </p>
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                <last-name>DAICEL CORPORATION</last-name>
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                <last-name>THE UNIVERSITY OF OSAKA</last-name>
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                <last-name>NAKAJIMA, MAKOTO</last-name>
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              <english-country>JP</english-country>
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                <last-name>亞古托　維達　卡尼拉</last-name>
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                <last-name>AGULTO, VERDAD CANILA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>PH</english-country>
              <english-address>PH</english-address>
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                <last-name>加藤康作</last-name>
                <first-name></first-name>
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                <last-name>KATO, KOSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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        <agents>
          <agent rep-type="agent" sequence="1">
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                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
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              <address>臺北市</address>
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          <country>日本</country>
          <doc-number>2024-150251</doc-number>
          <date>20240830</date>
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      <invention-title>
        <chinese-title>樹脂成形體</chinese-title>
        <english-title></english-title>
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      <physical-examination>無</physical-examination>
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        <p type="p">本發明係一種樹脂成形體，其包含樹脂及線圈形狀之導電性構件，且上述線圈形狀之至少一部分為線圈半徑逐漸增加或減少之錐（taper）形狀，上述線圈半徑之最小值為5.0 μm以上，上述線圈半徑之最大值為1000.0 μm以下。</p>
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        <p type="p">無 </p>
      </isu-abst>
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        <p type="p">X,Y:側</p>
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                <last-name>SMC CORPORATION</last-name>
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                <first-name></first-name>
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                <last-name>小林悠理</last-name>
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                <last-name>KOBAYASHI, YURI</last-name>
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              <english-address>JP</english-address>
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              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
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              <address>臺北市</address>
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          <doc-number>2024-148191</doc-number>
          <date>20240830</date>
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      <invention-title>
        <chinese-title>模組系統及外部輸出模組</chinese-title>
        <english-title>MODULE SYSTEM AND EXTERNAL OUTPUT MODULE</english-title>
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      <physical-examination>無</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">模組系統(20)，包含安全模組(32)及外部輸出模組(36)。外部輸出模組，具有電連接至電源(26)的正極(26p)的第1正輸入端子(170a)、電連接至電源的負極(26n)的負輸入端子(180)、電連接至第1正輸入端子且可電連接至外部裝置(22)的正供電端子(176)、及電連接至負輸入端子且可電連接至外部裝置的負供電端子(186)。</p>
      </isu-abst>
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        <p type="p">A module system (20) includes a safety module (32) and an external output module (36). The external output module includes: a first plus input terminal (170a) to be electrically connected to a positive electrode (26p) of a power source (26); a minus input terminal (180) to be electrically connected to a negative electrode (26n) of the power source; a plus power supply terminal (176) to be electrically connected to the first plus input terminal and to an external device (22); and a minus power supply terminal (186) to be electrically connected to the minus input terminal and to the external device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:控制系統</p>
        <p type="p">20:模組系統</p>
        <p type="p">22:外部裝置</p>
        <p type="p">24:控制裝置</p>
        <p type="p">26:電源</p>
        <p type="p">26p:正極</p>
        <p type="p">26n:負極</p>
        <p type="p">30:通信模組</p>
        <p type="p">32:安全模組</p>
        <p type="p">32h:第1殼</p>
        <p type="p">32hb:後面</p>
        <p type="p">32hf:前面</p>
        <p type="p">34:閥門模組</p>
        <p type="p">34a:第1閥門模組</p>
        <p type="p">34b:第2閥門模組</p>
        <p type="p">34c:第3閥門模組</p>
        <p type="p">34d:驅動電路</p>
        <p type="p">34h:第3殼</p>
        <p type="p">34hb:後面</p>
        <p type="p">34hf:前面</p>
        <p type="p">34v:複數閥門</p>
        <p type="p">36:外部輸出模組</p>
        <p type="p">36a:第1外部輸出模組</p>
        <p type="p">36b:第2外部輸出模組</p>
        <p type="p">36c:第3外部輸出模組</p>
        <p type="p">36h:第2殼</p>
        <p type="p">36hb:後面</p>
        <p type="p">36hc:連接面</p>
        <p type="p">36hf:前面</p>
        <p type="p">40:控制通信處理電路</p>
        <p type="p">42:安全控制用通信線路</p>
        <p type="p">44:安全控制用通信端子</p>
        <p type="p">46:運轉控制用通信線路</p>
        <p type="p">48:運轉控制用通信端子</p>
        <p type="p">50:內部通信處理電路</p>
        <p type="p">52:正輸出端子</p>
        <p type="p">54:負輸出端子</p>
        <p type="p">60:控制通信線路</p>
        <p type="p">62:正極連接電力線</p>
        <p type="p">64:負極連接電力線</p>
        <p type="p">70:安全控制處理電路</p>
        <p type="p">72:安全控制用通信端子</p>
        <p type="p">74:安全控制用通信線路</p>
        <p type="p">80:運轉控制處理電路</p>
        <p type="p">82:運轉控制用信號輸入端子</p>
        <p type="p">84:運轉控制用通信線路</p>
        <p type="p">86:運轉控制用信號輸出端子</p>
        <p type="p">88:正輸入端子</p>
        <p type="p">90:正輸出端子</p>
        <p type="p">90a:第1正輸出端子</p>
        <p type="p">90b:第2正輸出端子</p>
        <p type="p">90c:第3正輸出端子</p>
        <p type="p">92:正極連接電力線</p>
        <p type="p">92a:第1正極連接電力線</p>
        <p type="p">92b:第2正極連接電力線</p>
        <p type="p">92c:第3正極連接電力線</p>
        <p type="p">94:高側開關</p>
        <p type="p">94a:高側開關</p>
        <p type="p">94b:高側開關</p>
        <p type="p">94c:高側開關</p>
        <p type="p">96:負輸入端子</p>
        <p type="p">98:負輸出端子</p>
        <p type="p">100:負極連接電力線</p>
        <p type="p">102:低側開關</p>
        <p type="p">120:運轉控制用信號輸入端子</p>
        <p type="p">122:運轉控制用信號輸出端子</p>
        <p type="p">124:運轉控制用通信線路</p>
        <p type="p">126:運轉控制用信號連接配線</p>
        <p type="p">130:正輸入端子</p>
        <p type="p">130a:第1正輸入端子</p>
        <p type="p">130b:第2正輸入端子</p>
        <p type="p">130c:第3正輸入端子</p>
        <p type="p">132:正輸出端子</p>
        <p type="p">132a:第1正輸出端子</p>
        <p type="p">132b:第2正輸出端子</p>
        <p type="p">132c:第3正輸出端子</p>
        <p type="p">134:正連接中繼配線</p>
        <p type="p">134a:第1正連接中繼配線</p>
        <p type="p">134b:第2正連接中繼配線</p>
        <p type="p">134c:第3正連接中繼配線</p>
        <p type="p">136:正連接供電配線</p>
        <p type="p">140:負輸入端子</p>
        <p type="p">142:負輸出端子</p>
        <p type="p">144:負連接中繼配線</p>
        <p type="p">146:負連接供電配線</p>
        <p type="p">160:信號輸入端子</p>
        <p type="p">162:信號輸出端子</p>
        <p type="p">164:運轉控制用通信線路</p>
        <p type="p">170:正輸入端子</p>
        <p type="p">170a:第1正輸入端子</p>
        <p type="p">170b:第2正輸入端子</p>
        <p type="p">170c:第3正輸入端子</p>
        <p type="p">172:正輸出端子</p>
        <p type="p">172a:第1正輸出端子</p>
        <p type="p">172b:第2正輸出端子</p>
        <p type="p">172c:第3正輸出端子</p>
        <p type="p">174:正連接中繼配線</p>
        <p type="p">174a:第1正連接中繼配線</p>
        <p type="p">174b:第2正連接中繼配線</p>
        <p type="p">176:正供電端子</p>
        <p type="p">178:正連接供電配線</p>
        <p type="p">180:負輸入端子</p>
        <p type="p">182:負輸出端子</p>
        <p type="p">184:負連接中繼配線</p>
        <p type="p">186:負供電端子</p>
        <p type="p">188:負連接供電配線</p>
        <p type="p">F:流體</p>
        <p type="p">Ga:模組群組</p>
        <p type="p">Gb:模組群組</p>
        <p type="p">Gc:模組群組</p>
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        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">B65D71/38</main-classification>
        <further-classification edition="200601120260225B">B65D5/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商偉斯特洛克包裝系統有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WESTROCK PACKAGING SYSTEMS, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達　科斯塔　科勒爾　阿德里亞諾　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DA COSTA KOHLER, ADRIANO A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/687,893</doc-number>
          <date>20240828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>物品攜具及其胚片</chinese-title>
        <english-title>ARTICLE CARRIER AND BLANK THEREFOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容之態樣係關於一種用於包裝複數個物品之物品攜具（90；190）及一種用於形成該物品攜具之胚片（10；110）。該紙箱胚片（10；110）包含複數個面板，該複數個面板包括第一主面板（12；112），該第一主面板包含至少部分地由其形成之至少兩個隔板。該至少兩個隔板包含第一隔板（40、48；140、148）及第二隔板（44、52；144、152），該第二隔板（44、52；144、152）與該第一隔板（40、48；140、148）分開。該第一隔板（40、48；140、148）沿著第一線（41、49；141、149）以鉸接方式連接至該第一主面板（12；112），且該第二隔板（44、52；144、152）沿著第二摺疊線（45、53；145、153）以鉸接方式連接至該第一主面板（12；112），使得該第一隔板（40、48；140、148）及該第二隔板（44、52；144、152）中之各者可相對於該第一主面板（12；112）獨立摺疊。該第一隔板（40、48；140、148）及該第二隔板（44、52；144、152）自其各別摺疊線（41、49、45、53；141、149、145、153）沿相反方向延伸至各別膠黏薄片(glue tab)（42、50、46、54；142、150、146、154）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of the disclosure relate to an article carrier (90; 190) for packaging a plurality of articles and a blank (10; 110) for forming the same. The carton blank (10; 110) comprises a plurality of panels including a first primary panel (12; 112) which comprises at least two partition panels formed at least in part therefrom. The at least two partition panels comprise a first partition panel (40, 48; 140, 148) and a second partition panel (44, 52; 144, 152), the second partition panel (44, 52; 144, 152) being separate from the first partition panel (40, 48; 140, 148). The first partition panel (40, 48; 140, 148) is hingedly connected to the first primary panel (12; 112) along a first line (41, 49; 141, 149) and the second partition panel (44, 52; 144, 152) is hingedly connected to the first primary panel (12; 112) along a second fold line (45, 53; 145, 153) such that each of the first partition panel (40, 48; 140, 148) and the second partition panel (44, 52; 144, 152) is independently foldable with respect to the first primary panel (12; 112). The first and second partition panels (40, 48, 44, 52; 140, 148, 144, 152) extend in opposite directions from their respective fold lines (41, 49, 45, 53; 141, 149, 145, 153) to respective glue tabs (42, 50, 46, 54; 142, 150, 146, 154).</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:固定折片/第一及第四固定面板</p>
        <p type="p">9:摺疊線</p>
        <p type="p">10:胚片</p>
        <p type="p">12:面板/分隔面板/中間隔板/第一主面板</p>
        <p type="p">12a:第一手柄面板/下部部分</p>
        <p type="p">12b:第一手柄面板</p>
        <p type="p">13:摺疊線</p>
        <p type="p">14:面板/內端部面板/內面板</p>
        <p type="p">15:摺疊線</p>
        <p type="p">16:面板/外面板/第一側面板</p>
        <p type="p">17:摺疊線</p>
        <p type="p">17a:摺疊線</p>
        <p type="p">18:面板/外面板/第一端部面板</p>
        <p type="p">19:摺疊線</p>
        <p type="p">20:面板/外面板/第二側面板</p>
        <p type="p">21:摺疊線</p>
        <p type="p">21a:摺疊線</p>
        <p type="p">22:面板/外面板/第二端部面板</p>
        <p type="p">23:摺疊線</p>
        <p type="p">24:第二手柄面板</p>
        <p type="p">25:摺疊線</p>
        <p type="p">26:連接面板</p>
        <p type="p">27:摺疊線</p>
        <p type="p">28:第三手柄面板</p>
        <p type="p">29:摺疊線</p>
        <p type="p">30:第二連接面板</p>
        <p type="p">31:摺疊線</p>
        <p type="p">32:第一底面板/複合底壁/複合底面板</p>
        <p type="p">33:摺疊線</p>
        <p type="p">34:第二底面板/複合底壁/複合底面板</p>
        <p type="p">A1:手柄孔隙</p>
        <p type="p">A2:孔隙</p>
        <p type="p">C1:切割線</p>
        <p type="p">C2:切割線</p>
        <p type="p">F:鎖定機構/第一部件/凹接片</p>
        <p type="p">H1:第一手柄結構</p>
        <p type="p">H2:第二手柄結構</p>
        <p type="p">M:鎖定機構/第二部件/凸接片</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="520px" img-content="tif" inline="yes" orientation="portrait" width="988px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621953</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132809</doc-number>
          <kind></kind>
          <date>114/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">B65D5/36</main-classification>
        <further-classification edition="200601120260226B">B65D5/02</further-classification>
        <further-classification edition="200601120260226B">B65D5/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商羅蒂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOTTE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本村茜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOMURA, AKANE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-147721</doc-number>
          <date>20240829</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包裝容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之包裝容器10包含：拆解用前撕裂線81、82，其等被形成在前側面構件3與左側面構件4之連設邊緣及前側面構件3與右側面構件5之連設邊緣，其等用於拆解包裝容器10；第1拆解用輔助撕裂線83a、83b，其等被形成在上表面構件1與前折片13之連設邊緣且位於左右對稱之一對開封線70a、70b之左側及右側的連設邊緣部；拆解用後撕裂線84、85，其等被形成在上表面構件1之後端並沿著一對開封線70a、70b之延長方向延伸且在後側面構件6自上端延伸至下端，其等用於拆解包裝容器10；第2拆解用輔助撕裂線86a、86b，其等被形成在位於拆解用後撕裂線之左右外側的上表面構件1與後側面構件6之連設邊緣部；以及第3拆解用輔助撕裂線87a、87b，其等被形成在位於拆解用後撕裂線之左右外側的後側面構件6與底面構件2之連設邊緣部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:上表面構件</p>
        <p type="p">2:底面構件</p>
        <p type="p">3:前側面構件</p>
        <p type="p">4:左側面構件</p>
        <p type="p">5:右側面構件</p>
        <p type="p">6:後側面構件</p>
        <p type="p">10:包裝容器</p>
        <p type="p">12:上表面構件1之前緣</p>
        <p type="p">13:前折片</p>
        <p type="p">14:上表面構件1之左緣</p>
        <p type="p">15:左折片</p>
        <p type="p">16:上表面構件1之右緣</p>
        <p type="p">17:右折片</p>
        <p type="p">31:前側面板</p>
        <p type="p">34:卡止細縫</p>
        <p type="p">62:左後滑動折片</p>
        <p type="p">70b:開封線</p>
        <p type="p">71a,71b:耳部</p>
        <p type="p">72:折線</p>
        <p type="p">73:開口</p>
        <p type="p">81,82:拆解用前撕裂線</p>
        <p type="p">83a,83b:第1拆解用輔助撕裂線</p>
        <p type="p">85:拆解用後撕裂線</p>
        <p type="p">86b:第2拆解用輔助撕裂線</p>
        <p type="p">131:前折片13之下端中央部</p>
        <p type="p">132:舌片</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="820px" img-content="tif" inline="yes" orientation="portrait" width="589px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621923</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132815</doc-number>
          <kind></kind>
          <date>114/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">B60S1/40</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＰＩＡＡ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIAA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>門倉彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KADOKURA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-146558</doc-number>
          <date>20240828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>將刮水片連結於刮水臂之連結機構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種連結機構(1)，其中，滑動件(50)具有一對的引導片(54)。一對的引導片(54)各別具有突出端部(54a)，在滑動件(50)被安裝於刮水臂(10)時該突出端部(54a)以使頂端面(54b)位於臂內空間(S)的方式突出。夾具(40)具有彈性變形自如的槓桿片(44)。槓桿片(44)，被收容於臂內空間(S)並且抵接於突出端部(54a)的頂端面(54b)，又在抵接於突出端部(54a)的頂端面(54b)的一側的表面(44d)具有卡止爪(44c)，在滑動件(50)位於限制位置時該卡止爪(44c)自與將刮水臂(10)插入滑動件(50)的方向相反的方向卡止於突出端部(54a)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:刮水臂</p>
        <p type="p">10a:臂頂端部</p>
        <p type="p">11:頂壁部</p>
        <p type="p">12:側壁部</p>
        <p type="p">30:夾具基底</p>
        <p type="p">32a:軸體</p>
        <p type="p">40:夾具</p>
        <p type="p">42a:卡合孔</p>
        <p type="p">43:突起部</p>
        <p type="p">44:槓桿片</p>
        <p type="p">44a:頂端片部</p>
        <p type="p">44b:臂片部</p>
        <p type="p">44c:卡止爪</p>
        <p type="p">44d:表面</p>
        <p type="p">50:滑動件</p>
        <p type="p">51:頂壁部</p>
        <p type="p">53:肋材</p>
        <p type="p">54:引導片</p>
        <p type="p">54a:突出端部</p>
        <p type="p">54b:頂端面</p>
        <p type="p">55:前壁部</p>
        <p type="p">AX1:旋轉軸</p>
        <p type="p">AX2:假想軸</p>
        <p type="p">S:臂內空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="474px" img-content="tif" inline="yes" orientation="portrait" width="708px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622225</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132854</doc-number>
          <kind></kind>
          <date>114/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C11D7/26</main-classification>
        <further-classification edition="200601120260302B">C11D1/08</further-classification>
        <further-classification edition="200601120260302B">C11D1/62</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商默克專利有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳田浩志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGITA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本和磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>角椋太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMI, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井牧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, MAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王彥評</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-146945</doc-number>
          <date>20240828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>製造電子裝置之水溶液、製造光阻圖案之方法及製造裝置之方法</chinese-title>
        <english-title>ELECTRONIC DEVICE MANUFACTURING AQUEOUS SOLUTION, METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR MANUFACTURING DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[問題]&lt;br/&gt;  本發明提供一種可減少缺陷之製造電子裝置之水溶液。&lt;br/&gt;  [解決方法]&lt;br/&gt;  本發明提供一種製造電子裝置之水溶液，其包含離子性界面活性劑(A)及溶劑(S)，其中溶劑(S)包含水(S-1)，及該製造電子裝置之水溶液的pH為7.5至12.0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Problem]&lt;br/&gt; To provide an electronic device manufacturing aqueous solution that can reduce defects.&lt;br/&gt; [Solution]&lt;br/&gt; An electronic device manufacturing aqueous solution comprising an ionic surfactant (A) and a solvent (S) is provided, wherein the solvent (S) comprises water (S-1), and a pH of the electronic device manufacturing aqueous solution is 7.5 to 12.0.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622364</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132861</doc-number>
          <kind></kind>
          <date>114/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">F04D19/04</main-classification>
        <further-classification edition="200601120260225B">F04D29/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商埃地沃茲日本有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EDWARDS JAPAN LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田代功</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TASHIRO, ISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横塚克久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOZUKA, KATSUHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-146445</doc-number>
          <date>20240828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>真空泵、真空泵零件及其製造方法</chinese-title>
        <english-title>VACUUM PUMP, VACUUM PUMP COMPONENT, AND METHOD FOR MANUFACTURING SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種真空泵、真空泵零件及其製造方法，其實現在電磁感應加熱中藉由電磁感應加熱有效地加熱由具有低加熱效率之一材料形成之一部分。  &lt;br/&gt;一真空泵300包含：一殼體310；一轉子軸113，其安置於該殼體310中；一轉子葉片102，其可與該轉子軸113一起旋轉；及一加熱構件340，其用於藉由致使一交流電流流過一線圈342而憑藉電磁感應執行加熱，其中該真空泵300藉由該轉子葉片102之旋轉而排出一氣體，且由該加熱構件340加熱之一經加熱部分350包含具有磁性之一金屬電鍍層351。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a vacuum pump, a vacuum pump component, and a method for manufacturing the same, enabling effectively to heat a portion, formed of a material having low heating efficiency, in electromagnetic induction heating by electromagnetic induction heating. &lt;br/&gt;A vacuum pump 300 includes a casing 310, a rotor shaft 113 disposed in the casing 310, a rotor blade 102 rotatable together with the rotor shaft 113, and a heating means 340 for performing heating by electromagnetic induction by causing an alternating current to flow through a coil 342, wherein the vacuum pump 300 exhausts a gas by rotation of the rotor blade 102, and a heated portion 350 heated by the heating means 340 includes a metal plating layer 351 having magnetism.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:入口埠</p>
        <p type="p">102:轉子葉片</p>
        <p type="p">102a:轉子葉片</p>
        <p type="p">102b:轉子葉片</p>
        <p type="p">102c:轉子葉片</p>
        <p type="p">102d:圓筒形部分</p>
        <p type="p">103:轉子</p>
        <p type="p">104:上徑向電磁鐵</p>
        <p type="p">105:下徑向電磁體</p>
        <p type="p">106A:軸向電磁體</p>
        <p type="p">106B:軸向電磁體</p>
        <p type="p">107:上徑向感測器</p>
        <p type="p">108:下徑向感測器</p>
        <p type="p">111:圓盤形金屬盤</p>
        <p type="p">113:轉子軸</p>
        <p type="p">120:保護軸承</p>
        <p type="p">121:馬達</p>
        <p type="p">122:定子柱</p>
        <p type="p">123a:定子葉片</p>
        <p type="p">123b:定子葉片</p>
        <p type="p">123c:定子葉片</p>
        <p type="p">125a:堆疊式定子葉片間隔件</p>
        <p type="p">125b:堆疊式定子葉片間隔件</p>
        <p type="p">125c:堆疊式定子葉片間隔件</p>
        <p type="p">129:基座部分</p>
        <p type="p">131:螺紋溝槽間隔件</p>
        <p type="p">131a:螺紋溝槽</p>
        <p type="p">133:出口埠</p>
        <p type="p">141:電子電路單元</p>
        <p type="p">143:基板</p>
        <p type="p">145:氣密底部蓋</p>
        <p type="p">149:環狀水冷管</p>
        <p type="p">300:真空泵</p>
        <p type="p">310:殼體</p>
        <p type="p">320:磁軸承</p>
        <p type="p">340:加熱構件</p>
        <p type="p">341:高磁導率磁主體</p>
        <p type="p">342:線圈</p>
        <p type="p">344:前表面</p>
        <p type="p">350:經加熱部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="939px" img-content="tif" inline="yes" orientation="portrait" width="753px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623643</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132863</doc-number>
          <kind></kind>
          <date>114/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/25</main-classification>
        <further-classification edition="200601120260302B">C09K5/14</further-classification>
        <further-classification edition="200601120260302B">C08L83/04</further-classification>
        <further-classification edition="201901120260302B">B32B7/027</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商拓自達電線股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATSUTA ELECTRIC WIRE &amp; CABLE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯原友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIHARA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤龍也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITOU, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207031</doc-number>
          <date>20241128</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-040959</doc-number>
          <date>20250314</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>熱傳導性構件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種熱傳導性構件，其具有絕緣性，且熱阻值低於同等厚度之熱傳導性樹脂層。熱傳導性構件1具備基板2、貼合於基板2之一面的第一熱傳導性樹脂層3、及貼合於基板2之另一面的第二熱傳導性樹脂層4。基板2為半導體或絕緣體。第一熱傳導性樹脂層3及第二熱傳導性樹脂層4各自包含黏結劑樹脂11及熱傳導性填料12。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:熱傳導性構件</p>
        <p type="p">2:基板</p>
        <p type="p">3:第一熱傳導性樹脂層</p>
        <p type="p">4:第二熱傳導性樹脂層</p>
        <p type="p">5,6:脫模膜</p>
        <p type="p">11:黏結劑樹脂</p>
        <p type="p">12:熱傳導性填料</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="531px" img-content="tif" inline="yes" orientation="portrait" width="671px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622299</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132866</doc-number>
          <kind></kind>
          <date>114/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260218B">C30B11/00</main-classification>
        <further-classification edition="200601120260218B">C30B29/40</further-classification>
        <further-classification edition="202501120260218B">H10D62/85</further-classification>
        <further-classification edition="200601120260218B">C30B33/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弘田龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROTA, RYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鴻池一暁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONOIKE, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳澤拓弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGISAWA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大驛悠一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OEKI, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山村昌敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMURA, MASATAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣瀨光太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSE, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/041267</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化合物半導體單晶基板及化合物半導體單晶之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之化合物半導體單晶基板於第1解理面及第2解理面之至少一者中觀測到第1條紋狀圖案，且於第3解理面及第4解理面之至少一者中觀測到第2條紋狀圖案。第1條紋狀圖案由複數條第1線形成。第2條紋狀圖案由複數條第2線形成。如下任意兩點之間之於第1方向上之距離設為第1距離，該任意兩點係與複數條第1線中之任一者重疊，於第2方向上與外周面之距離長於5 mm，且於第2方向上之彼此之距離為5 mm的兩點。如下任意兩點之間之於第1方向上之距離設為第2距離，該任意兩點係與複數條第2線中之任一者重疊，於第2方向上與外周面之距離長於5 mm，且於第3方向上之彼此之距離為5 mm的兩點。第1距離及第2距離之至少一者為0.5 mm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第1主面</p>
        <p type="p">2:第2主面</p>
        <p type="p">3:外周面</p>
        <p type="p">11:第1解理面</p>
        <p type="p">31:第1條紋狀圖案</p>
        <p type="p">36:第1線</p>
        <p type="p">61:第1端部區域</p>
        <p type="p">62:第1中間區域</p>
        <p type="p">71:第1假想點</p>
        <p type="p">72:第2假想點</p>
        <p type="p">101:第1方向</p>
        <p type="p">102:第2方向</p>
        <p type="p">A1:第1中心軸</p>
        <p type="p">E1:第1距離</p>
        <p type="p">E3:第3距離</p>
        <p type="p">E4:第4距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10039.JPG" file="ed10039.JPG" height="475px" img-content="tif" inline="yes" orientation="portrait" width="762px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622300</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132868</doc-number>
          <kind></kind>
          <date>114/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">C30B11/00</main-classification>
        <further-classification edition="200601120260202B">C30B29/40</further-classification>
        <further-classification edition="202501120260202B">H10D62/85</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO ELECTRIC INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大驛悠一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OEKI, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳澤拓弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGISAWA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青山浩一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAMA, KOICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/041982</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>磷化銦基板及磷化銦結晶之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之磷化銦基板具有主面。主面之直徑為149 mm以上205 mm以下。主面由外周區域及中央區域形成。中央區域被一邊之長度為1 mm且呈格子狀配置之第1正方區域劃分。於使包圍9個第1正方區域且一邊之長度為3 mm之正方形沿著第1方向及第2方向分別每移動1 mm時，由正方形特定出之區域設為複數個第2正方區域。錯位密度為0/cm&lt;sup&gt;2&lt;/sup&gt;之複數個第2正方區域之數量相對於複數個第2正方區域之總數的比率為30%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第1主面</p>
        <p type="p">8:外周緣</p>
        <p type="p">18:外周區域</p>
        <p type="p">19:中央區域</p>
        <p type="p">51:第1正方區域</p>
        <p type="p">52:第2正方區域</p>
        <p type="p">100:磷化銦基板(InP基板)</p>
        <p type="p">101:第1方向</p>
        <p type="p">102:第2方向</p>
        <p type="p">A2:第2中心</p>
        <p type="p">E1:第1距離</p>
        <p type="p">L3:第3長度</p>
        <p type="p">X:正方形</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.JPG" file="ed10026.JPG" height="751px" img-content="tif" inline="yes" orientation="portrait" width="705px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621574</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132967</doc-number>
          <kind></kind>
          <date>114/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A23L2/52</main-classification>
        <further-classification edition="201601120260302B">A23L29/30</further-classification>
        <further-classification edition="201601120260302B">A23L29/212</further-classification>
        <further-classification edition="201601120260302B">A23L33/15</further-classification>
        <further-classification edition="201601120260302B">A23L33/175</further-classification>
        <further-classification edition="201601120260302B">A23L33/105</further-classification>
        <further-classification edition="200601120260302B">A61K47/36</further-classification>
        <further-classification edition="200601120260302B">A61K47/18</further-classification>
        <further-classification edition="200601120260302B">A61K47/22</further-classification>
        <further-classification edition="200601120260302B">A61K47/46</further-classification>
        <further-classification edition="200601120260302B">A61P3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商提升保濕有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIFT HYDRATION LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾克斯　安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNOX, ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米哈伊爾　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKHAIL, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米哈伊爾　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKHAIL, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諾克斯　史考特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNOX, SCOTT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/688,426</doc-number>
          <date>20240829</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>遞送組成物及其製造與使用方法</chinese-title>
        <english-title>DELIVERY COMPOSITION AND METHODS OF MANUFACTURE AND USE THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種遞送組成物，其含有抗性澱粉(諸如馬鈴薯、甘藷、白米或糙米、麵食、燕麥或豆科植物(諸如豆類或扁豆))、胺基酸、維生素及額外組分。本發明亦提供含有遞送組成物的產品，諸如補水飲料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A delivery composition containing a resistant starch such as potato, sweet potato, white or brown rice, pasta, oats, or a legume such as beans or lentils, amino acids, vitamins, and additional components is described. Products such as hydration drinks containing the delivery composition are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">（無）</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622635</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114132968</doc-number>
          <kind></kind>
          <date>114/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G03F7/16</main-classification>
        <further-classification edition="200601120260302B">G03F7/30</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商瀋陽芯源微電子設備股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENYANG KINGSEMI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, HU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王超群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHAOQUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳艷雙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YANSHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116950544</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>塗膠顯影裝置及其控制方法</chinese-title>
        <english-title>GLUE COATING AND DEVELOPING APPARATUS AND A CONTROL METHOD THEREFOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及塗膠顯影裝置及其控制方法，該裝置包括片盒模組、塗膠模組、顯影模組及相應機器人。片盒模組含進出站、傳片機械手、進片/回片工位及裝載工位。進出站機器人負責晶圓在裝載工位與進片/回片工位間的傳送；傳片機械手則在進片總工位與片盒進片支路間傳送晶圓。塗膠模組含塗佈機器人和塗膠單元，顯影模組含顯影機器人和顯影單元，兩者位於片盒模組同側，顯影模組在塗膠模組下方。塗佈機器人將晶圓送至塗膠單元，顯影機器人將完成顯影的晶圓送回。片盒進片/回片支路分別與塗膠/顯影框架對應。該裝置用於通過減少冗餘工位和機械手來提高生產效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a glue coating and developing apparatus and a control method therefor. The apparatus comprises a wafer box module, a glue coating module, a developing module and a plurality of corresponding robots. The wafer box module comprises an access robot, a wafer transfer manipulator, a wafer inlet/return station, and a loading station. The access robot is responsible for transferring the wafer between the loading station and the wafer inlet/return station; the wafer transfer manipulator transfers the wafer between an wafer inlet main-station and a wafer inlet branch. The glue coating module comprises a coating robot and a gluing unit, the developing module comprises a developing robot and a developing unit, while both are located on a same side of the wafer box module, and the developing module is located below the glue coating module. The coating robot sends the wafer to the glue coating unit, while the developing robot sends back a wafer having been developed. A wafer box inlet/return branch corresponds respectively to a glue coating/developing frame. The apparatus is configured to improve production efficiency by reducing a redundant station and a mechanical arm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:機械手</p>
        <p type="p">2:傳片機械手</p>
        <p type="p">14:塗膠框架中的機械手</p>
        <p type="p">24:進片熱處理框架中的機械手</p>
        <p type="p">31:背洗機械手</p>
        <p type="p">32:正洗機械手</p>
        <p type="p">33:介面機械手</p>
        <p type="p">100:片盒模組</p>
        <p type="p">200:液處理模組</p>
        <p type="p">300:層間模組</p>
        <p type="p">400:熱處理模組</p>
        <p type="p">500:介面模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="471px" img-content="tif" inline="yes" orientation="portrait" width="805px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623495</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133051</doc-number>
          <kind></kind>
          <date>114/08/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120251008B">H10K59/12</main-classification>
        <further-classification edition="202301120251008B">H10K59/122</further-classification>
        <further-classification edition="202301120251008B">H10K50/844</further-classification>
        <further-classification edition="200601120251008B">G02B3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳世完</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SE-WAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李龍求</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YONG-KU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹娥羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, A-RA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李榮福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YOUNG-BOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金Ｇ　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, GO-EUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0167293</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置可包含：顯示區及在顯示區外側的非顯示區；設置於顯示區中及基板上的發光二極體；覆蓋發光二極體並設置於顯示區及非顯示區中的絕緣層；設置於顯示區中及絕緣層上的多個透鏡；設置於非顯示區中及絕緣層上的阻擋器；設置在顯示區與阻擋器之間的多個第一平度增強圖案；以及覆蓋多個透鏡、阻擋器及多個第一平度增強圖案的平坦化層。非顯示區可包含在自顯示區第一方向上的第一非顯示區以及在自顯示區第二方向上的第二非顯示區。多個第一平度增強圖案可被設置於第一非顯示區中並包含凸起圖案或凹陷圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device may include: a display area and a non-display area outside the display area; a light emitting diode disposed in the display area and on a substrate; an insulating layer covering the light emitting diode and disposed in the display area and the non-display area; lenses disposed in the display area and on the insulating layer; a stopper disposed in the non-display area and on the insulating layer; first flatness-enhancing patterns disposed between the display area and the stopper; and a planarization layer covering the lenses, the stopper and the first flatness-enhancing patterns. The non-display area may include a first non-display area at a first direction from the display area and a second non-display area at a second direction from the display area. The first flatness-enhancing patterns may be disposed in the first non-display area and include a convex pattern or a concave pattern.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:有機發光顯示裝置</p>
        <p type="p">202:基板</p>
        <p type="p">206:第一緩衝層</p>
        <p type="p">208:像素電路層</p>
        <p type="p">209:訊號線</p>
        <p type="p">250:第一平坦化層</p>
        <p type="p">256:堤部</p>
        <p type="p">262:封裝層</p>
        <p type="p">262a,262b,262c:絕緣層</p>
        <p type="p">264:第二緩衝層</p>
        <p type="p">268:黑色矩陣</p>
        <p type="p">270:層間絕緣層</p>
        <p type="p">272:觸控電極</p>
        <p type="p">274:無機絕緣層</p>
        <p type="p">280:透鏡</p>
        <p type="p">282:阻擋器</p>
        <p type="p">284:第二平坦化層</p>
        <p type="p">290:平度增強圖案</p>
        <p type="p">B:溝槽結構</p>
        <p type="p">D:發光二極體</p>
        <p type="p">DA:顯示區</p>
        <p type="p">DAM1,DAM2,DAM3:壩</p>
        <p type="p">GIP:閘極驅動部</p>
        <p type="p">NDA:非顯示區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="669px" img-content="tif" inline="yes" orientation="portrait" width="961px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622455</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133062</doc-number>
          <kind></kind>
          <date>114/08/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260115B">G01B11/00</main-classification>
        <further-classification edition="202101120260115B">G03B13/36</further-classification>
        <further-classification edition="200601120260115B">H05K3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商維亞機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIA MECHANICS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻治明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, HARUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎雅幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簑島悠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINOSHIMA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-208626</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>對焦判定裝置、自動對焦系統及基板加工系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於對焦判定裝置、自動對焦系統及基板加工系統。自動且高精度地判定是否對焦。對焦判定裝置12具備：銳度計算單元510，計算孔圖像的銳度，前述孔圖像映現有在基板上加工的孔；以及對焦判定單元520，基於由銳度計算單元510計算出的銳度，判定孔圖像的焦點是否對準。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:推論單元</p>
        <p type="p">4:特徵量提取單元</p>
        <p type="p">5:銳度檢測單元</p>
        <p type="p">10:孔識別系統</p>
        <p type="p">11:學習裝置</p>
        <p type="p">12:對焦判定裝置/孔識別裝置</p>
        <p type="p">14:印刷基板</p>
        <p type="p">15:定位台</p>
        <p type="p">100:雷射加工裝置</p>
        <p type="p">110:定位台控制裝置</p>
        <p type="p">120:雷射源控制裝置</p>
        <p type="p">121:雷射源</p>
        <p type="p">130:電流掃描器控制裝置</p>
        <p type="p">131,132:電流掃描器</p>
        <p type="p">133:Fθ透鏡</p>
        <p type="p">134:相機</p>
        <p type="p">135:加工頭</p>
        <p type="p">140:雷射加工控制裝置</p>
        <p type="p">221,222:多層神經網路模型</p>
        <p type="p">510:銳度計算單元</p>
        <p type="p">520:對焦判定單元/銳度評價單元</p>
        <p type="p">1000:雷射加工系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="762px" img-content="tif" inline="yes" orientation="portrait" width="1022px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622909</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133094</doc-number>
          <kind></kind>
          <date>114/08/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120251001B">G06V10/82</main-classification>
        <further-classification edition="202201120251001B">G06V10/46</further-classification>
        <further-classification edition="200601120251001B">H05K3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商維亞機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VIA MECHANICS, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻治明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTSUKI, HARUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎雅幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-208625</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>孔識別系統及基板加工系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及孔識別系統及基板加工系統。提高在基板上打孔的孔的識別精度。孔識別系統10包括確定單元3，確定單元3包括學習完畢模型201並輸出使用學習完畢模型201來確定輸入的基板的圖像中的孔區域的孔區域資訊，此學習完畢模型以從實施了打孔加工的基板的圖像推論此圖像中的孔區域的方式學習；以及特徵量計算單元4，基於確定單元3輸出的孔區域資訊，計算在所述基板上加工的孔的特徵量。</p>
      </isu-abst>
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        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:訓練資料製作部</p>
        <p type="p">2:學習處理部</p>
        <p type="p">3:確定單元(推論處理部)</p>
        <p type="p">4:特徵量計算部(特徵量計算單元)</p>
        <p type="p">5:顯示裝置</p>
        <p type="p">10:孔識別系統</p>
        <p type="p">11:學習裝置</p>
        <p type="p">12:孔識別裝置</p>
        <p type="p">13:相機</p>
        <p type="p">14:基板</p>
        <p type="p">20:圖像集成部</p>
        <p type="p">101:正解資料製作部</p>
        <p type="p">102:訓練資料化處理部</p>
        <p type="p">103:資料分割處理部</p>
        <p type="p">201:學習完畢模型(多層神經網路模型)</p>
        <p type="p">202:正向處理</p>
        <p type="p">203:反向傳播處理</p>
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                <last-name>特拉維斯　格里姆</last-name>
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                <last-name>張寧</last-name>
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                <last-name>ZHANG, NING</last-name>
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                <last-name>程哲</last-name>
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                <last-name>CHENG, ZHE</last-name>
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              <english-country>CN</english-country>
              <english-address>CN</english-address>
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              <chinese-name name-type="organization">
                <last-name>梁　詩莉</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LEUNG, SZE LEE CECILIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>周　科明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, KE-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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                <last-name>陶　維康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAO, WEI-KANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
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          </agent>
        </agents>
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          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/116167</doc-number>
          <date>20240831</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2025111642611</doc-number>
          <date>20250819</date>
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        <chinese-title>ｄｓＲＮＡ　分子、藥物組合物及其在肝外遞送中的應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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        <p type="p">含有膨出結構的dsRNA分子及其製備方法，包含該dsRNA分子的藥物組合物以及所述dsRNA分子和藥物組合物在肝外遞送中的應用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202622202</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114133216</doc-number>
          <kind></kind>
          <date>114/08/29</date>
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        <main-classification edition="200601120260302B">C09J153/02</main-classification>
        <further-classification edition="200601120260302B">C09J123/16</further-classification>
        <further-classification edition="200601120260302B">C09J11/08</further-classification>
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        <further-classification edition="202101120260302B">H01M50/193</further-classification>
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          <applicant app-type="applicant" sequence="1">
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                <last-name>日商霓佳斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICHIAS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>白井大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAI, HIROTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>久野優介</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>KUNO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          <country>日本</country>
          <doc-number>2024-203359</doc-number>
          <date>20241121</date>
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        <chinese-title>黏著劑組成物、片狀墊圈、地板材、緩衝材及密封材</chinese-title>
        <english-title></english-title>
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        <p type="p">一種黏著劑組成物，其特徵在於含有：(共)聚合物（A），具有（a）甲基苯乙烯單量體的聚合物嵌段；一種以上的烯烴系聚合物（B），包含（c）一種以上的脂肪族單烯烴及/或一種以上的脂肪族多烯的(共)聚合物嵌段或者其部分或完全氫化體嵌段，該（c）的嵌段的含有比例為超過87質量%且100質量%以下；以及一種以上的黏著賦予劑（C）。根據本發明，可提供一種黏著劑組成物，可於高溫（100℃以上，例如120℃）與25℃左右的常溫兩者下形成黏著性優異的黏著劑層。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
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        <p type="p">無</p>
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          <date>115/06/01</date>
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        <further-classification edition="200601120260302B">B32B9/04</further-classification>
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                <last-name>日商蓋亞尼克斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAIANIXX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>木島健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIJIMA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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                <last-name>關雅志</last-name>
                <first-name></first-name>
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                <last-name>SEKI, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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                <last-name>洪武雄</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          <country>日本</country>
          <doc-number>2024-159645</doc-number>
          <date>20240913</date>
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      <invention-title>
        <chinese-title>積層構造體</chinese-title>
        <english-title>LAMINATED STRUCTURE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種積層構造體，可穩定地形成具有相同之結晶構造之緩衝膜，並可於緩衝膜上穩定地形成具有相同之配向方向及膜質之導電膜。本發明之解決手段的積層構造體10係具有包含主面11p的基板11、及形成於主面11p上的緩衝膜12。基板11係由Si(100)基板所構成、或者由SOI基板所構成，該SOI基板係包含由Si(100)膜所構成之SOI層。緩衝膜12包含第一部分PR1及與第一部分PR1不同的第二部分PR2。第一部分PR1係由第一金屬氧化物所構成，該第一金屬氧化物係包含選自由Hf以外之第四族元素所構成之群之一種以上之金屬元素；第二部分PR2係由包含Hf之第二金屬氧化物所構成。第一金屬氧化物及第二金屬氧化物之中之一方係具有立方晶之結晶構造而且呈(100)配向，另一方係具有正方晶之結晶構造而且呈(001)配向。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide a laminated structure capable of stably forming a buffer film having the same crystal structure, and capable of stably forming a conductive film having the same orientation and film quality on the buffer film. A laminated structure 10 as a solution of the present invention has a substrate 11 including a main surface 11p, and a buffer film 12 formed on the main surface 11p. The substrate 11 is composed of a Si(100) substrate or an SOI substrate including an SOI layer composed of a Si(100) film. The buffer film 12 includes a first portion PR1 and a second portion PR2 different from the first portion PR1. The first portion PR1 is composed of a first metal oxide containing one or more metal elements selected from the group consisting of Group 4 elements other than Hf. The second portion PR2 is composed of a second metal oxide containing Hf. One of the first metal oxide and the second metal oxide has a cubic crystal structure and is (100) oriented, and the other has a tetragonal crystal structure and is (001) oriented.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10,10a:積層構造體</p>
        <p type="p">11:基板</p>
        <p type="p">11p:主面</p>
        <p type="p">12:緩衝膜</p>
        <p type="p">12a:膜部</p>
        <p type="p">12b:角錐部</p>
        <p type="p">a1:角度</p>
        <p type="p">PR1:第一部分</p>
        <p type="p">PR2:第二部分</p>
        <p type="p">SD1:側邊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10041.JPG" file="ed10041.JPG" height="487px" img-content="tif" inline="yes" orientation="portrait" width="636px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622206</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133390</doc-number>
          <kind></kind>
          <date>114/09/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K3/14</main-classification>
        <further-classification edition="200601120260302B">C09G1/02</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商福吉米股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIMI INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大西正悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONISHI, SHOGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾森　亞歷珊卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARLSON, ALEXANDRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/698,658</doc-number>
          <date>20240925</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>研磨用組合物</chinese-title>
        <english-title>POLISHING COMPOSITION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可實現改善包含銅、鉭及TEOS之圖案化基材之平坦度之障壁研磨的研磨用組合物及方法。  &lt;br/&gt;本發明提供一種研磨用組合物，其包含具有100 nm～150 nm之平均粒徑(MPS)之研磨劑、磷酸酯界面活性劑、電子傳導度(EC)控制劑、有機酸、及水溶性高分子，且上述研磨劑之濃度相對於上述磷酸酯界面活性劑之濃度之比為50以上且未達1040。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Polishing compositions and methods are provided which enable barrier polishing with improved flatness for patterned substrates comprising copper, tantalum, and TEOS. &lt;br/&gt;Provided are polishing compositions comprising: an abrasive with a mean particle size (MPS) of 100 nm to 150 nm; a phosphate surfactant; an electronic conductivity (EC) controller; an organic acid; and a water-soluble polymer, wherein a ratio of a concentration of the abrasive to a concentration of the phosphate surfactant is greater than or equal to 50 and less than or equal to 1040.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:溝槽</p>
        <p type="p">B:溝槽間間隔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="578px" img-content="tif" inline="yes" orientation="portrait" width="645px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622791</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133394</doc-number>
          <kind></kind>
          <date>114/09/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120260226B">G06F30/30</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商登帕福魯克斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENPAFLUX GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尼爾森　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NELSON, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納亞克　蒙娜麗莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAYAK, MONALISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德　門迪薩巴爾　巴斯克斯　伊格納西奧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DE MENDIZABAL VAZQUEZ, IGNACIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科普克　朱利安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOEPKE, JULIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>102024125158.1</doc-number>
          <date>20240903</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>分析電子裝置設計之方法、系統、電腦程式產品及電腦可讀取儲存媒體</chinese-title>
        <english-title>METHOD OF ANALYZING A DESIGN OF AN ELECTRONIC DEVICE, SYSTEM, COMPUTER PROGRAM PRODUCT, AND COMPUTER-READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於一種用於分析電子裝置設計的方法。該方法包括以下步驟：由資料處理裝置取得電子裝置之設計檔案，其中該設計檔案包括該電子裝置之設計；由該資料處理裝置判定基於所取得設計檔案的該電子裝置的設計之該電子裝置的電磁相容性(EMC)資訊，其中，該EMC資訊的判定包括：由該資料處理裝置取得有關於基於該電子裝置設計的該電子裝置中所包括的至少一組件的組件資訊，以及由該資料處理裝置判定基於該組件資訊的功能資訊，其中，使用圖神經網路(GNN)判定該功能資訊。該方法復包括：由該資料處理裝置分析該EMC資訊以判定該EMC資訊中是否偵測到至少一EMC問題，其中，分析該EMC資訊包括分析該功能資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a method (100) of analyzing a design of an electronic device. The method (100) comprises the following steps: obtaining (101), by a data processing device, a design file of the electronic device, wherein the design file comprises a design of the electronic device; determining (102), by the data processing device, electromagnetic compatibility, EMC, information of the electronic device based on the design of the electronic device of the obtained design file, wherein the determining of EMC information comprises: obtaining (103), by the data processing device, component information regarding at least one component comprised in the electronic device based on the design of the electronic device, and determining (104), by the data processing device, functional information based on the component information, wherein the functional information is determined using a graph neural network, GNN. The method comprises further: analyzing (106), by the data processing device, the EMC information to determine whether at least one EMC issue is detected in the EMC information, wherein the analyzing the EMC information comprises analyzing the functional information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">101-107:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="441px" img-content="tif" inline="yes" orientation="portrait" width="616px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622311</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133399</doc-number>
          <kind></kind>
          <date>114/09/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120251130B">D04H1/435</main-classification>
        <further-classification edition="200601120251130B">D21H13/24</further-classification>
        <further-classification edition="200601320251130B">D06M101/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大王製紙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIO PAPER CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本大昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>豊田純也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-201870</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電磁波屏蔽材用不織布</chinese-title>
        <english-title>NONWOVEN FABRIC FOR ELECTROMAGNETIC SHIELDING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為電磁波屏蔽材用不織布，其係由使用原料纖維所得到的不織布所構成，該原料纖維含有聚酯系的延伸纖維與聚酯系的未延伸纖維，前述聚酯系的未延伸纖維的調配比率為原料纖維的25至80質量%，前述聚酯系的延伸纖維與前述聚酯系的未延伸纖維之至少一種包含再生聚酯纖維，前述再生聚酯纖維的最小調配比率為原料纖維的20質量%以上，該電磁波屏蔽材用不織布的縱向的拉伸強度為0.10kN/m以上2.00kN/m以下，弗雷澤透氣度為10.0cm&lt;sup&gt;3&lt;/sup&gt;/(cm&lt;sup&gt;2&lt;/sup&gt;･s)以上，厚度為5μm以上30μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A nonwoven fabric for electromagnetic shielding according to the present invention is formed of a nonwoven fabric obtained by using raw fibers containing polyester-based stretched fibers and polyester-based unstretched fibers. The blend ratio of the polyester-based unstretched fibers is 25 to 80% by mass of the raw fibers, and at least one of the polyester-based stretched fibers and the polyester-based unstretched fibers contain recycled polyester fibers. The minimum blend ratio of the recycled polyester fibers is 20% by mass or more of the raw fibers. The nonwoven fabric for electromagnetic shielding has a longitudinal tensile strength of 0.10 kN/m to 2.00 kN/m, a Frazier air permeability of 10.0 cm&lt;sup&gt;3&lt;/sup&gt;(cm&lt;sup&gt;2&lt;/sup&gt;・s) or more, and a thickness of 5 μm to 30 μm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622816</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133422</doc-number>
          <kind></kind>
          <date>114/09/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120251201B">G06N20/00</main-classification>
        <further-classification edition="202301120251201B">G06N3/0442</further-classification>
        <further-classification edition="202001120251201B">G06F40/20</further-classification>
        <further-classification edition="201801120251201B">G06F9/445</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李沅祚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WON-JO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉載勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JAEHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔珉晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, MINJEONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0168607</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具動態量化之方法與設備及其相關非暫時性電腦可讀儲存媒體</chinese-title>
        <english-title>METHOD AND APPARATUS WITH DYNAMIC QUANTIZATION AND NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM RELATED THERETO</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了一種動態量化方法及一種動態量化設備。該動態量化方法包括藉由將一正交矩陣施加至輸入資料來獲得用於量化之統計資訊；基於該統計資訊來判定一縮放因數；藉由該縮放因數對該輸入資料執行縮放；以及基於該縮放之一結果來執行動態量化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A dynamic quantization method and a dynamic quantization apparatus are disclosed. The dynamic quantization method includes obtaining statistical information for quantization by applying an orthogonal matrix to input data, determining a scaling factor based on the statistical information, performing scaling on the input data by the scaling factor, and performing dynamic quantization based on a result of the scaling.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:輸入資料</p>
        <p type="p">220:正交矩陣O</p>
        <p type="p">230:縮放S</p>
        <p type="p">240:量化</p>
        <p type="p">250:逆數S&lt;sup&gt;-1&lt;/sup&gt;</p>
        <p type="p">260:轉置矩陣O&lt;sup&gt;T&lt;/sup&gt;</p>
        <p type="p">270:權重W</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="529px" img-content="tif" inline="yes" orientation="portrait" width="992px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621973</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133444</doc-number>
          <kind></kind>
          <date>114/09/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65G54/02</main-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商布魯克斯自動機械美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩拉　傑羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOURA, JAIRO TERRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡維尼　羅勃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAVENEY, ROBERT T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾略特　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELLIOTT, MARTIN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾　文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSANG, VINCENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/689,374</doc-number>
          <date>20240830</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>隔離牆及包括隔離牆的傳送室</chinese-title>
        <english-title>ISOLATION WALL AND TRANSFER CHAMBER INCLUDING THE ISOLATION WALL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體基板運輸設備包括真空室和電磁鐵陣列。真空室具有複數個運輸埠，各調適成連接至個別的處理室。真空室具有頂部、側牆、界定真空室裡之實質水平參考平面的底部。真空室能夠免於外部環境而密封於真空。電磁鐵陣列連接至真空室以相對於實質水平參考平面而在預定高度形成驅動平面。底部是由薄量規金屬片所形成，包住且密封真空室裡的真空。薄量規金屬片具有內表面，形成半導體運輸真空室裡的水平參考平面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor substrate transport apparatus includes a vacuum chamber and an array of electromagnets. The vacuum chamber has a plurality of transport ports that are each adapted to connect to a respective processing chamber. The vacuum chamber has a top, side walls, and a bottom that defines a substantially level reference plane inside the vacuum chamber. The vacuum chamber being capable of being sealed from an external environment in vacuum. The array of electromagnets is connected to the vacuum chamber to form a drive plane at a predetermined height relative to the substantially level reference plane. The bottom is formed of a thin gauge metal sheet that bounds and seals the vacuum inside the vacuum chamber. The thin gauge metal sheet has an inner surface that forms the level reference plane inside the semiconductor transport vacuum chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體基板運輸真空室、基板運輸室</p>
        <p type="p">100B:底部</p>
        <p type="p">100F:框架</p>
        <p type="p">100SW:側牆</p>
        <p type="p">100T:頂部</p>
        <p type="p">101:內部</p>
        <p type="p">102:驅動區段</p>
        <p type="p">102C:線圈驅動系統</p>
        <p type="p">102CE:電磁鐵或線圈陣列</p>
        <p type="p">110:基板操持器</p>
        <p type="p">150:隔離牆</p>
        <p type="p">DP:驅動平面</p>
        <p type="p">EXT:外部環境</p>
        <p type="p">H:預定高度</p>
        <p type="p">PS:電源</p>
        <p type="p">RP:參考平面</p>
        <p type="p">VAC:真空</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="227px" img-content="tif" inline="yes" orientation="portrait" width="740px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623590</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133445</doc-number>
          <kind></kind>
          <date>114/09/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/70</main-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商布魯克斯自動機械美國公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BROOKS AUTOMATION US, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡維尼　羅勃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAVENEY, ROBERT T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾　文森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSANG, VINCENT W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴比斯　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BABBS, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅　克里斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAY, CHRIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩拉　傑羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOURA, JAIRO TERRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫魯比雪　亞力山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRUPYSHEV, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈里斯　柯林頓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARIS, CLINTON M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾略特　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ELLIOTT, MARTIN R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/689,412</doc-number>
          <date>20240830</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>負載鎖定件及包含該負載鎖定件的基板處理設備</chinese-title>
        <english-title>LOAD LOCK AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE LOAD LOCK</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基板負載鎖定設備，包含：框架，形成至少兩個腔室，及基板支撐體，可移動地安裝到該框架。該基板支撐體具有至少兩個彼此分離且獨立的支撐區域，彼此間距錯開。當該基板支撐體從初始位置移動至最終位置時，至少一個支撐區域會隨之移動，從而切換腔室。所述至少兩個腔室中的其中一個腔室經組構以具有可變大氣環境且位於所述至少兩個腔室中的另一個腔室之上或之下。該另一個腔室具有與輸送腔室相連通的基板輸送側開口。該另一個腔室經配置以在其內部維持穩態密封的環境，所述至少兩個腔室中各腔室的可變大氣環境相互隔離，且與基板輸送腔室環境共用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A substrate load lock apparatus including a frame forming at least two chambers and a substrate support movably mounted to the frame. The substrate support having at least two separate and distinct support areas offset at a distance from each other. At least one support area being moved so as to switch chambers with movement of the substrate support from an initial position to a final position. One chamber of the at least two chambers is configured so as to have a variable atmosphere and is located over or below another chamber of the at least two chambers. The other chamber has a side substrate transport opening communicating with a transport chamber. The other chamber is arranged to hold therein a steady state sealed environment, sealed from the variable atmosphere of each other chamber of the at least two chambers, and common with a substrate transport chamber environment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:處理部</p>
        <p type="p">145:電磁鐵陣列</p>
        <p type="p">146:交流電源</p>
        <p type="p">150A:負載鎖定件</p>
        <p type="p">150B:負載鎖定件</p>
        <p type="p">160:轉移腔室</p>
        <p type="p">165:處理模組</p>
        <p type="p">165C:雙腔室</p>
        <p type="p">170:基板搬運器</p>
        <p type="p">171:反應台板</p>
        <p type="p">172:末端效應器</p>
        <p type="p">199:控制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="725px" img-content="tif" inline="yes" orientation="portrait" width="987px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623552</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133465</doc-number>
          <kind></kind>
          <date>114/09/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P70/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商芝浦機械電子裝置股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAURA MECHATRONICS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
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              <english-address>JP</english-address>
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        <inventors>
          <inventor app-type="applicant" sequence="1">
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                <last-name>石原淳司</last-name>
                <first-name></first-name>
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                <last-name>ISHIHARA, JUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
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              <english-address>JP</english-address>
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                <last-name>宮迫久顕</last-name>
                <first-name></first-name>
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                <last-name>MIYASAKO, HISAAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
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                <last-name>西部幸伸</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>NISHIBE, YUKINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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              <english-address>JP</english-address>
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                <last-name>福岡洋太郎</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>FUKUOKA, YOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          </agent>
        </agents>
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        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-154172</doc-number>
          <date>20240906</date>
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      <invention-title>
        <chinese-title>晶片收納容器清洗裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本發明的課題在於效率良好地進行清洗。實施方式的晶片收納容器清洗裝置包括：第一清洗槽，對具有門及晶片收納容器主體的晶片收納容器的晶片收納容器主體進行清洗；以及第二清洗槽，位於第一清洗槽的上方，對門進行清洗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">203:底部</p>
        <p type="p">204:供給口</p>
        <p type="p">205:排出口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="520px" img-content="tif" inline="yes" orientation="portrait" width="642px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <isuno>11</isuno>
      <kindcode>A</kindcode>
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          <doc-number>202621743</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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          <doc-number>114133568</doc-number>
          <kind></kind>
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        </document-id>
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        <main-classification edition="201701120260302B">A61K47/68</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>大陸商石藥集團巨石生物製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CSPC MEGALITH BIOPHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
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              <chinese-name name-type="organization">
                <last-name>張利瓊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIQIONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郝金恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAO, JINHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉勝男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHENGNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>萬學超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, XUECHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, MINGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈冉冉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, RANRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張麗軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LIXUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淡墨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAN, MO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏苗苗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, MIAOMIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>惠希武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUI, XIWU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024112188015</doc-number>
          <date>20240902</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種抗體藥物偶聯物與免疫檢查點抑制劑的組合</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本申請提供一種聯合治療腫瘤的藥物，其包括抗體藥物偶聯物和PD-1抗體或其抗原結合片段。同時提供一種治療腫瘤的方法，所述方法包括向需要治療的患者或者受試者施用治療有效量的抗體偶聯藥物和PD-1抗體或其抗原結合片段。還提供抗體偶聯藥物在製備與PD-1抗體或其抗原結合片段聯用治療腫瘤的藥物中的用途。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621970</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114133618</doc-number>
          <kind></kind>
          <date>114/09/02</date>
        </document-id>
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        <main-classification edition="200601120260302B">B65G49/07</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
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                <last-name>家登精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDENG PRECISION INDUSTRIAL CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
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              <chinese-name name-type="organization">
                <last-name>邱銘乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MING-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
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              <chinese-name name-type="organization">
                <last-name>李奇霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHI-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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                <last-name>林家齊</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>LIN, CHIA-CH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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                <last-name>潘詠晉</last-name>
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                <last-name>PAN, YUNG-CHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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              <chinese-name name-type="organization">
                <last-name>陳慧玲</last-name>
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              <address>臺北市</address>
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          <doc-number>63/721,583</doc-number>
          <date>20241118</date>
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      <invention-title>
        <chinese-title>固定裝置及應用其之上開式基板載具</chinese-title>
        <english-title>FIXING DEVICE AND TOP-OPENING SUBSTRATE CARRIER USING THE SAME</english-title>
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      <physical-examination>有</physical-examination>
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        <p type="p">一種固定裝置及應用其之上開式基板載具，上開式基板載具用來收容基板托盤，固定裝置包括固定座以及滑動桿，固定座固定於上開式基板載具之側壁，滑動桿可滑動地與固定座組裝，藉以間接地連接至上開式基板載具。當上開式基板載具之門體進行鎖固時，滑動桿被門體推動至壓抵位置，使滑動桿之多個定位塊用以壓抵並固定住基板托盤。</p>
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        <p type="p">
        </p>
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        <p type="p">111:滑動斜面</p>
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        <p type="p">133:彈性件</p>
        <p type="p">135:定位塊</p>
        <p type="p">135a:定位斜面</p>
        <p type="p">136:凸肋</p>
        <p type="p">137:滑動栓</p>
        <p type="p">138:導引斜槽</p>
        <p type="p">150:殼體</p>
        <p type="p">170:基板托盤</p>
        <p type="p">171:本體</p>
        <p type="p">172:階梯結構</p>
        <p type="p">173:第一階段</p>
        <p type="p">174:第二階段</p>
        <p type="p">X:方向</p>
        <p type="p">Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="1048px" img-content="tif" inline="yes" orientation="portrait" width="674px">
          </img>
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      <isuno>11</isuno>
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          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114133662</doc-number>
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          <date>114/09/03</date>
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        <main-classification edition="200601120260302B">G06F3/046</main-classification>
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        <further-classification edition="200601120260302B">G02F1/1333</further-classification>
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                <last-name>日商和冠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WACOM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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                <last-name>小谷佳宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOTANI, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉山義久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIYAMA, YOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土橋慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOBASHI, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大亀正裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAME, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今西恒太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMANISHI, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202810</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>附光源感測器基板及顯示裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種能夠使關連於位置檢測功能以及發光功能的基板之設計自由度提升之附光源感測器基板及顯示裝置。  &lt;br/&gt;　　[解決手段]附光源感測器基板(SB1)，係具備有複數之安裝層(LY11、LY14)、和將複數之安裝層(LY11、LY14)之中之相鄰之層彼此作絕緣之1個以上的絕緣層(LY12)。複數之安裝層(LY11、LY14)，係包含有：第1安裝層(LY11)  &lt;br/&gt;，係至少被設置有發光元件陣列以及驅動配線部之一部分；和第2安裝層(LY14)，係至少被設置有線圈配線部之一部分或者是全部。在第1安裝層(LY11)處，係更進而被設置有線圈配線部之一部分，以及/或者是，在第2安裝層(LY14)處，係更進而被設置有驅動配線部之另外一部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">SB1:附光源感測器基板</p>
        <p type="p">LY11:單獨安裝層(光源側)</p>
        <p type="p">LY12:絕緣層</p>
        <p type="p">LY13:任意構成層</p>
        <p type="p">LY14:共存安裝層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.png" file="d10032.TIF" giffile="ed10032.png" height="455px" img-content="tif" inline="yes" orientation="portrait" width="587px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623596</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133934</doc-number>
          <kind></kind>
          <date>114/09/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/76</main-classification>
        <further-classification edition="202601120260302B">H10W40/00</further-classification>
        <further-classification edition="202601120260302B">H10W40/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商麥克羅斯技術有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIKROS TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇利文　約瑟夫　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SULLIVAN, JOSEPH T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥葛溫　傑西　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MCGOWAN, JESSE D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬特　德魯　Ｍ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATTER, DREW M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,375</doc-number>
          <date>20241126</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/289,570</doc-number>
          <date>20250804</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有多區熱控制的晶圓卡盤</chinese-title>
        <english-title>WAFER CHUCK WITH MULTI-ZONE THERMAL CONTROL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種卡盤總成，其包括一歧管基座及冷卻板，該歧管基座在其中界定一或多個通道，該等冷卻板耦接至該歧管基座且經組配來支撐一晶圓。該歧管基座包括入口埠，其與該一或多個通道流體連通；以及出口埠，其與該一或多個通道流體連通。每個冷卻板界定與該歧管基座之該一或多個通道流體連通之一冷卻板通道。額外地，一流體係組配為經由該等入口埠進入該歧管基座之該一或多個通道，選擇性地流動通過該等冷卻板通道之至少一部分以局部地熱調節該晶圓之一區，且經由該等出口埠離開該歧管基座之該一或多個通道。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chuck assembly that includes a manifold base defining one or more channels therein and cold plates coupled to the manifold base and configured to support a wafer. The manifold base includes inlet ports in fluid communication with the one or more channels and outlet ports in fluid communication with the one or more channels. Each cold plate defines a cold plate channel that is in fluid communication with the one or more channels of the manifold base. Additionally, a fluid is configured to enter the one or more channels of the manifold base through the inlet ports, selectively flow through at least a portion of the cold plate channels to locally thermally regulate a region of the wafer, and exit the one or more channels of the manifold base through the outlet ports.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:組態</p>
        <p type="p">402:卡盤總成</p>
        <p type="p">404:晶圓</p>
        <p type="p">406:歧管基座</p>
        <p type="p">408:入口埠，第一入口埠</p>
        <p type="p">410:入口埠，第二入口埠</p>
        <p type="p">412:入口埠，第三入口埠</p>
        <p type="p">414:入口埠，第四入口埠</p>
        <p type="p">416:入口埠，第五入口埠</p>
        <p type="p">418:出口埠，第一出口埠</p>
        <p type="p">420:出口埠，第二出口埠</p>
        <p type="p">422:出口埠，第三出口埠</p>
        <p type="p">424:出口埠，第四出口埠</p>
        <p type="p">426:出口埠，第五出口埠</p>
        <p type="p">428:冷卻板</p>
        <p type="p">430:切口</p>
        <p type="p">432,434:頂表面</p>
        <p type="p">444:間隙</p>
        <p type="p">446:真空埠</p>
        <p type="p">448:密封件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.bmp" file="ed10003.bmp" height="597px" img-content="tif" inline="yes" orientation="portrait" width="930px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622240</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133971</doc-number>
          <kind></kind>
          <date>114/09/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N15/62</main-classification>
        <further-classification edition="201001120260302B">C12N5/0783</further-classification>
        <further-classification edition="200601120260302B">C12N5/10</further-classification>
        <further-classification edition="200601120260302B">C07K14/705</further-classification>
        <further-classification edition="200601120260302B">C07K16/28</further-classification>
        <further-classification edition="200601120260302B">C07K16/30</further-classification>
        <further-classification edition="202501120260302B">A61K40/11</further-classification>
        <further-classification edition="202501120260302B">A61K40/31</further-classification>
        <further-classification edition="202501120260302B">A61K40/32</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商亞森諾生物科學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARSENAL BIOSCIENCES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加德納　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARDNER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚安之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, ANZHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南　虹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAN, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米拉爾　畢特里茲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLARE, BEATRIZ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮為棟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, WEIDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/690,719</doc-number>
          <date>20240904</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/816,448</doc-number>
          <date>20250602</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>合成路徑活化劑</chinese-title>
        <english-title>SYNTHETIC PATHWAY ACTIVATORS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供包含跨膜結構域及覆瓦狀細胞內傳訊結構域之新穎合成路徑活化劑，該等傳訊結構域包含組合傳訊結構域，該組合傳訊結構域包含兩個或更多個信號轉導物及轉錄活化劑(STAT)1、STAT3、STAT4、STAT5及/或類鐸受體(TLR)/IL-1R (TIR)傳訊結構域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are novel synthetic pathway activators comprising transmembrane domains and tiled intracellular signaling domains comprising a combinatorial signaling domain comprising two or more Signal Transducer and Activator of Transcription (STAT)1, STAT3, STAT4, STAT5 and/or Toll-like receptor (TLR)/IL-1R (TIR) signaling domains(s).</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="485px" img-content="tif" inline="yes" orientation="portrait" width="621px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622551</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133978</doc-number>
          <kind></kind>
          <date>114/09/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260115B">G02B5/20</main-classification>
        <further-classification edition="200601120260115B">A61B5/02</further-classification>
        <further-classification edition="200601120260115B">A61B5/022</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下河広幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOGAWA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-201489</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學濾波器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可佩戴於人體的任意位置且可任意選擇取入至檢測裝置的光的光學濾波器。使透光膜含有色素且在波長為400 nm～1000 nm的範圍內具有透光波段及遮光波段。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光檢測裝置</p>
        <p type="p">2:手指</p>
        <p type="p">10:光學膜</p>
        <p type="p">11:光感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="495px" img-content="tif" inline="yes" orientation="portrait" width="619px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622484</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114133985</doc-number>
          <kind></kind>
          <date>114/09/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120251008B">G01N21/35</main-classification>
        <further-classification edition="200601120251008B">G01N21/84</further-classification>
        <further-classification edition="200601120251008B">G01N33/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>下河広幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMOGAWA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋駿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>横田知之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOTA, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳虹婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-201369</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光檢測裝置、生物體資訊獲取方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種光檢測裝置及使用該光檢測裝置的生物體資訊獲取方法，所述光檢測裝置無需複雜的結構，便能夠獲取更多的生物體資訊，並且能夠佩戴於人體的任意位置，且通用性進一步提高。一種光檢測裝置，對環境光進行檢測，所述光檢測裝置包括：光學濾波器，使透光膜含有色素且在波長為400 nm～1000 nm的範圍內具有透光波段及遮光波段；以及薄膜狀的光感測器，形成於光學濾波器的表面，對環境光中的屬於光學濾波器的透光波段的光的至少一部分進行檢測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光檢測裝置</p>
        <p type="p">2:手指</p>
        <p type="p">10:光學膜</p>
        <p type="p">11:光感測器</p>
        <p type="p">L1:環境光</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="425px" img-content="tif" inline="yes" orientation="portrait" width="588px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621997</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134106</doc-number>
          <kind></kind>
          <date>114/09/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260210B">C02F1/02</main-classification>
        <further-classification edition="200601120260210B">G05D27/02</further-classification>
        <further-classification edition="200601120260210B">A61L2/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商野村微科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA MICRO SCIENCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本克美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199908</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>溫度控制系統、溫度控制方法、醫藥用水製造裝置的殺菌方法及二次純水製造方法</chinese-title>
        <english-title>TEMPERATURE CONTROL SYSTEM, METHOD FOR TEMPERATURE CONTROL, STERILIZATION METHOD FOR MEDICAL WATER PRODUCTION APPARATUS, AND METHOD FOR PRODUCING SECONDARY PURE WATER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種能夠抑制被處理水在升溫或降溫時的過衝之溫度控制系統及溫度控制方法。在純水裝置中，溫度控制系統包括：溫度調節器、用以將被處理水從該溫度調節器送水至後段的送水管、用以對溫度調節器供應熱媒體的熱媒體管、於熱媒體管並由上游側依序設置的第一調節閥及第二調節閥、用以檢測該送水管內的被處理水的溫度的溫度計、用以檢測熱媒體的壓力的壓力計、根據溫度計的檢測值來控制該第二調節閥的開度的溫度控制部以及根據壓力計的檢測值來控制該第一調節閥的開度的壓力控制部，其中壓力控制部係藉由預先設定的壓力變化模式與該壓力計的檢測值的偏差，來控制該第一調節閥的開度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A temperature control system and method capable of suppressing overshoot of treated water during temperature increase or decrease. In a pure water device, the temperature control system includes: a temperature regulator, a water supply pipe configured to supply treated water from the temperature regulator to a back section, a heat medium pipe configured to supply heat medium to the temperature regulator, a first regulating valve and a second regulating valve sequentially disposed from upstream of the heat medium pipe, a thermometer configured to detect the temperature of the treated water in the water supply pipe, a pressure gauge configured to detect the pressure of the heat medium, a temperature controller configured to control the opening degree of the second regulating valve according to the value detected by the thermometer, and a pressure controller configured to control the opening degree of the first regulating valve according to the value detected by the pressure gauge, wherein the pressure controller controls the opening degree of the first regulating valve by a deviation between a predetermined pressure variation pattern and the value detected by the pressure gauge.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:溫度控制系統</p>
        <p type="p">10:熱交換器</p>
        <p type="p">11a:供應管</p>
        <p type="p">11b:送水管</p>
        <p type="p">12a:供應管</p>
        <p type="p">12b:排出管</p>
        <p type="p">13:第一調節閥</p>
        <p type="p">14:第二調節閥</p>
        <p type="p">15:溫度計</p>
        <p type="p">16:壓力計</p>
        <p type="p">18a:壓力控制部</p>
        <p type="p">18b:溫度控制部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="952px" img-content="tif" inline="yes" orientation="portrait" width="776px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623662</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134122</doc-number>
          <kind></kind>
          <date>114/09/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/60</main-classification>
        <further-classification edition="202601120260302B">H10W74/40</further-classification>
        <further-classification edition="202601120260302B">H10W20/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金洸洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KWANG-SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓笛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/958,395</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電源模組以及用於電源模組的基板</chinese-title>
        <english-title>POWER MODULE AND SUBSTRATE FOR POWER MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用於功率傳輸階段的功率裝置、控制器以及其他元件可以被整合於小型緊密封裝來滿足伺服器/網路及汽車應用中愈來愈大的電流容量。然而，這些功率裝置運作期間產生的大量的熱可能藉由基板被傳遞至鄰近的控制器，而導致不希望的熱關斷。藉由提供的基板，基板包含具有精細地設計凹槽的導熱底板，熱可以藉由基板被正確引導並傳遞。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Power devices, controllers and other components needed for a power delivery stage can be integrated in a small compact package to meet the larger and larger current capacities. However, significant amounts of heat generating by these power devices during operation may be conducted to the nearby controllers through the substrate and cause undesired thermal shutdown. By providing a substrate which includes a thermal conductive base plate with carefully designed recess, the heat can be properly directed and conducted through the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基板</p>
        <p type="p">11:金屬化層</p>
        <p type="p">13:外殼</p>
        <p type="p">14~21:功率裝置</p>
        <p type="p">22~25:控制器</p>
        <p type="p">30:導線</p>
        <p type="p">42:槽</p>
        <p type="p">121,122:接腳</p>
        <p type="p">300:電源模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="739px" img-content="tif" inline="yes" orientation="portrait" width="966px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622491</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134179</doc-number>
          <kind></kind>
          <date>114/09/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260217B">G01N21/95</main-classification>
        <further-classification edition="201701120260217B">G06T7/00</further-classification>
        <further-classification edition="200601120260217B">B07C5/342</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威爾斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO WELD CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松下雅司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUSHITA, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井勇志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202675</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>檢查系統及檢查方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種檢查系統及檢查方法。檢查系統具備：輸送部，對多個電子部件（W）進行輸送；拍攝部，獲取拍攝區域的拍攝圖像；圖像分析部，對拍攝圖像進行分析；以及檢查裝置，對被分類為檢查物件的電子部件進行檢查，拍攝圖像包括拍攝區域中的拍攝檢查區域的圖像即檢查圖像區域、以及拍攝區域中的拍攝周邊區域的圖像即周邊圖像區域，圖像分析部在判定為在檢查圖像區域中包含單一的電子部件的圖像，且在周邊圖像區域中不包含電子部件的圖像作為分析的結果的情況下，將該單一的電子部件分類為檢查對象。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">Mc:拍攝圖像</p>
        <p type="p">Ms:周邊圖像區域</p>
        <p type="p">Mt:檢查圖像區域</p>
        <p type="p">Rc:拍攝區域</p>
        <p type="p">Rs:拍攝周邊區域</p>
        <p type="p">Rt:拍攝檢查區域</p>
        <p type="p">W:工件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="527px" img-content="tif" inline="yes" orientation="portrait" width="725px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622158</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134219</doc-number>
          <kind></kind>
          <date>114/09/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08G77/445</main-classification>
        <further-classification edition="200601120260225B">C08L83/10</further-classification>
        <further-classification edition="200601120260225B">C09D183/14</further-classification>
        <further-classification edition="201801120260225B">C09J7/40</further-classification>
        <further-classification edition="201901120260225B">B32B7/06</further-classification>
        <further-classification edition="200601120260225B">C08F4/26</further-classification>
        <further-classification edition="200601120260225B">C08F290/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川内宏紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAUCHI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中山健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAYAMA, KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-160370</doc-number>
          <date>20240917</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>硬化性有機聚矽氧烷組成物、剝離塗佈劑、剝離紙及剝離膜以及剝離紙及剝離膜的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的第一目的在於提供一種可向基材提供如下剝離層的硬化性有機聚矽氧烷組成物：自黏著層以低速及高速剝離時的剝離力均小、低速剝離及高速剝離時均可以低的剝離力自黏著帶良好地剝離的剝離層。進而，本發明的第二目的在於提供一種可提供如下剝離層的硬化性有機聚矽氧烷組成物：低速剝離及高速剝離時均可以低的剝離力自黏著帶良好地剝離，因向大氣的暴露而發生重剝離化的現象得到抑制，即，具有良好的耐暴露性的剝離層。一種硬化性有機聚矽氧烷組成物，含有下述（A）成分～（C）成分，  &lt;br/&gt;（A）下述平均組成式（1）所表示的含烯基的有機聚矽氧烷：100質量份、  &lt;br/&gt;&lt;img align="absmiddle" height="136px" width="608px" file="ed10001.jpg" alt="ed10001.jpg" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（式中，R&lt;sup&gt;1&lt;/sup&gt;相互獨立地為碳數3～20的烯基，R&lt;sup&gt;2&lt;/sup&gt;表示連結基，且為碳數1～10的二價烴基，另外，R&lt;sup&gt;3&lt;/sup&gt;相互獨立地為選自經取代或未經取代的、碳數1～20的一價烴基、碳數1～20的烷氧基、碳數1～10的鹵化烷基、具有羥基的有機基、及具有醯氧基的有機基中的基，進而，a、b、c、d、e、f及g為a≥0、b≥0、c≥0、d≥0、e≥0、f≥0、g≥0，且a+c+e為1以上，且滿足2≤a+b+c+d+e+f+g≤15000）  &lt;br/&gt;（B）在一分子中平均具有兩個以上的矽原子鍵結氫原子（Si-H基）的有機氫聚矽氧烷：相對於（A）成分中的烯基的莫耳數而（B）成分中的Si-H基的莫耳數相當於0.5～10倍的量、及  &lt;br/&gt;（C）鉑族金屬系觸媒：觸媒量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623553</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134248</doc-number>
          <kind></kind>
          <date>114/09/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P70/00</main-classification>
        <further-classification edition="200601120260302B">B08B3/08</further-classification>
        <further-classification edition="200601120260302B">B05D3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱瓦斯化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI GAS CHEMICAL COMPANY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安福悠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUFUKU, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤利樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDO, RIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安孫子洋平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABIKO, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米浜伸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEHAMA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林郁君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199609</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體晶圓之製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING SEMICONDUCTOR WAFER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供可獲得基板端部、背面無樹脂殘留物之半導體晶圓的半導體晶圓之製造方法。  &lt;br/&gt;前述半導體晶圓，係具有於支持基材上形成含聚醯亞胺樹脂前驅物之層或含聚醯亞胺樹脂之層之步驟1、及利用含有酮系有機溶劑(R1)及醇系有機溶劑(R2)之淋洗液，來清洗前述支持基材之端部區域之步驟2的半導體晶圓之製造方法、以及利用該方法所製造之半導體晶圓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the invention is to provide a method for producing a semiconductor wafer that can obtain a semiconductor wafer with no resin residue on the edges or rear surface of the substrate. &lt;br/&gt;The invention provides: a method for producing a semiconductor wafer that includes a step 1 of forming a polyimide resin precursor-containing layer or a polyimide resin-containing layer on a support substrate, and a step 2 of cleaning the edge region of the support substrate using a rinsing liquid that contains a ketone-based organic solvent (R1) and an alcohol-based organic solvent (R2); and a semiconductor wafer produced using this method.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621802</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134277</doc-number>
          <kind></kind>
          <date>114/09/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B08B3/02</main-classification>
        <further-classification edition="200601120260302B">B08B3/04</further-classification>
        <further-classification edition="200601120260302B">B08B11/00</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＳＵＭＣＯ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMCO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中尾文彰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAO, FUMIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芦馬渓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASHIBA, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥田幸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUDA, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳井涼一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAI, RYOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野田魁人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NODA, KAITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-203517</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶圓清洗裝置</chinese-title>
        <english-title>WAFER CLEANING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 提供使用雙流體噴射而可以得到高潔淨度的晶圓的晶圓清洗裝置。  &lt;br/&gt;[解決方案] 一種晶圓清洗裝置，具有：複數個旋轉輥，經由將晶圓保持在立起的狀態並使其旋轉而為保持旋轉狀態，前述晶圓具有第一面以及前述第一面的相反側的第二面；第一噴嘴，為雙流體噴射式，進行第一清洗動作，前述第一清洗動作清洗前述保持旋轉狀態的前述晶圓的前述第一面；第一升降驅動部，使前述第一噴嘴在上下方向移動，以藉由掃描而進行前述第一清洗動作；第二噴嘴，為雙流體噴射式，進行第二清洗動作，前述第二清洗動作清洗前述保持旋轉狀態的前述晶圓的前述第二面；以及第二升降驅動部，使前述第二噴嘴在前述上下方向移動，以藉由掃描而進行前述第二清洗動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">[Subject] To provide a wafer cleaning device capable of obtaining highly clean wafers using a two-fluid jet. &lt;br/&gt;[Solution] A wafer cleaning device includes:a plurality of rotating rollers for holding and rotating a wafer in an upright position to make the wafer in an holding and rotating state, and the wafer has a first side and a second side opposite to the first side; a first nozzle, which is a two-fluid jet type, for performing a first cleaning operation cleaning the first side of the wafer in the holding and rotating state; a first lifting driving portion for moving the first nozzle in a vertical direction to perform the first cleaning operation by scanning; a second nozzle, which is a two-fluid jet type, for performing a second cleaning operation cleaning the second side of the wafer in the holding and rotating state; and a second lifting driving portion for moving the second nozzle in the vertical direction to perform the second cleaning operationby scanning.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶圓清洗裝置</p>
        <p type="p">2:晶圓</p>
        <p type="p">2a:第一面</p>
        <p type="p">2b:第二面</p>
        <p type="p">2c:外周端面</p>
        <p type="p">3:旋轉輥</p>
        <p type="p">3a:周槽</p>
        <p type="p">4:第一噴嘴</p>
        <p type="p">4a,6a:噴嘴噴出口</p>
        <p type="p">5:第一升降驅動部</p>
        <p type="p">5a:第一導軌</p>
        <p type="p">6:第二噴嘴</p>
        <p type="p">7:第二升降驅動部</p>
        <p type="p">7a:第二導軌</p>
        <p type="p">8:驅動輥</p>
        <p type="p">9:引導輥</p>
        <p type="p">11:第一散佈裝置</p>
        <p type="p">12:第二散佈裝置</p>
        <p type="p">13:殼體</p>
        <p type="p">13a:吸氣口</p>
        <p type="p">13a1:第一長邊</p>
        <p type="p">13a2:第二長邊</p>
        <p type="p">13b:吸氣口調節裝置</p>
        <p type="p">13b1:第一擋板</p>
        <p type="p">13b2:第二擋板</p>
        <p type="p">14:排氣裝置</p>
        <p type="p">O,P:旋轉中心軸線</p>
        <p type="p">S:收容空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="819px" img-content="tif" inline="yes" orientation="portrait" width="563px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623663</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134300</doc-number>
          <kind></kind>
          <date>114/09/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/60</main-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
        <further-classification edition="202601120260302B">H10W76/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴完春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, WAN CHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林貞和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JUNG HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張慜珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, MIN JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫晧榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SON, HO YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0163963</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶片堆疊封裝件</chinese-title>
        <english-title>CHIP STACK PACKAGE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容的實施方式提供一種晶片堆疊封裝件，所述晶片堆疊封裝件包括：第一半導體晶片，其在第一表面上具有前凸塊；第二半導體晶片，其堆疊在與所述第一表面相對的所述第一半導體晶片的第二表面上；載體凸塊，其接合到所述前凸塊；模製構件，其圍繞所述第一半導體晶片、所述第二半導體晶片和所述載體凸塊；以及外部連接凸塊，其設置在所述載體凸塊上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments of the present disclosure provide a chip stack package including a first semiconductor chip having a front bump on a first surface, a second semiconductor chip stacked on a second surface of the first semiconductor chip opposite the first surface, a carrier bump bonded to the front bump, a mold member surrounding the first semiconductor chip, the second semiconductor chip, and the carrier bump, and an external connection bump disposed on the carrier bump.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一半導體晶片</p>
        <p type="p">11:第一基板</p>
        <p type="p">12:第一佈線結構</p>
        <p type="p">13A:第一前凸塊</p>
        <p type="p">13Aa:導電柱</p>
        <p type="p">13Ab:焊料層</p>
        <p type="p">13B:第一虛設凸塊</p>
        <p type="p">13Ba:導電柱</p>
        <p type="p">13Bb:焊料層</p>
        <p type="p">13C:第一測試凸塊</p>
        <p type="p">13Ca:導電柱</p>
        <p type="p">13Cb:焊料層</p>
        <p type="p">14:第一後凸塊</p>
        <p type="p">15:第一通孔</p>
        <p type="p">16:第一絕緣層</p>
        <p type="p">20:第二半導體晶片</p>
        <p type="p">21:第二基板</p>
        <p type="p">22:第二佈線結構</p>
        <p type="p">23:第二前凸塊</p>
        <p type="p">23a:導電柱</p>
        <p type="p">23b:焊料層</p>
        <p type="p">24:第二後凸塊</p>
        <p type="p">25:第二通孔</p>
        <p type="p">26:第二絕緣層</p>
        <p type="p">30:第三半導體晶片</p>
        <p type="p">31:第三基板</p>
        <p type="p">32:第三佈線結構</p>
        <p type="p">33:第三前凸塊</p>
        <p type="p">33a:導電柱</p>
        <p type="p">33b:焊料層</p>
        <p type="p">40:模製構件</p>
        <p type="p">51:載體凸塊</p>
        <p type="p">52:第二虛設凸塊</p>
        <p type="p">53:第二測試凸塊</p>
        <p type="p">61:外部連接凸塊</p>
        <p type="p">61a:第一銅層</p>
        <p type="p">61b:第一鎳層</p>
        <p type="p">61c:第二銅層</p>
        <p type="p">61d:焊料層</p>
        <p type="p">62:測試墊</p>
        <p type="p">71a:第一UBM圖案</p>
        <p type="p">71b:第二UBM圖案</p>
        <p type="p">80:鈍化層</p>
        <p type="p">100:晶片堆疊封裝件</p>
        <p type="p">A:部分</p>
        <p type="p">AK1:第一對準鍵</p>
        <p type="p">OP1:第一開口</p>
        <p type="p">OP2:第二開口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="648px" img-content="tif" inline="yes" orientation="portrait" width="883px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622084</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134307</doc-number>
          <kind></kind>
          <date>114/09/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D495/04</main-classification>
        <further-classification edition="200601120260302B">C07D513/04</further-classification>
        <further-classification edition="200601120260302B">C07D495/14</further-classification>
        <further-classification edition="200601120260302B">C07D493/04</further-classification>
        <further-classification edition="200601120260302B">C07D517/14</further-classification>
        <further-classification edition="202301120260302B">H10K30/60</further-classification>
        <further-classification edition="202301120260302B">H10K30/30</further-classification>
        <further-classification edition="202301120260302B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士軟片股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIFILM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>和泉彩香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IZUMI, SAIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉浦寛記</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIURA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米久田康智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEKUTA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-164008</doc-number>
          <date>20240920</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光電轉換元件、攝像元件、光感測器、攝像元件的製造方法、化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種對藍綠光之量子效率的電場強度依賴性小的光電轉換元件。又，本發明提供一種與上述光電轉換元件相關之攝像元件、光感測器、攝像元件的製造方法及化合物。本發明的光電轉換元件依序具有導電性膜、光電轉換膜及透明導電性膜，其中，上述光電轉換膜包含式（1）所表示之化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="368px" width="542px" file="ed10038.JPG" alt="ed10038.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622949</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134409</doc-number>
          <kind></kind>
          <date>114/09/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">G09G3/36</main-classification>
        <further-classification edition="200601120251201B">G09G3/20</further-classification>
        <further-classification edition="200601120251201B">G02F1/133</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊武璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WU CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/135149</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置及膽固醇液晶顯示裝置的驅動方法</chinese-title>
        <english-title>DISPLAY DEVICE AND METHOD FOR DRIVING CHOLESTERIC LIQUID-CRYSTAL DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，其包括液晶顯示面板。液晶顯示面板包括第一基板、第二基板、膽固醇液晶層及驅動電路。第一基板包括在第一方向延伸的複數個掃描電極。第二基板包括與第一方向不同的第二方向延伸的的複數個資料電極。膽固醇液晶層形成在第一基板及第二基板之間。驅動電路經配置以對在已啟動的一掃描電極上的多個像素電路施加一共用電壓及個別的多個資料電壓。在該液晶顯示面板的一動態驅動方式(DDS)掃描程序中的複數個階段之各者的期間，施加至在一偶數列的已啟動的該掃描電極上的該等像素電路的該共用電壓及個別的該等資料電壓的複數個交流電壓脈衝具有施加至在一奇數列的已啟動的該掃描電極上的該等像素電路的該共用電壓及個別的該等資料電壓的該等交流電壓脈衝之反向極性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device is provided, which includes a liquid crystal display panel and a driving circuit. The liquid crystal display panel includes a first substrate, a second substrate, a cholesteric liquid crystal layer, and a driving circuit. The first substrate includes a plurality of scanning electrodes extending in a first direction. The second substrate includes a plurality of data electrodes extending in a second direction different from the first direction. The cholesteric liquid crystal layer is formed between the first substrate and the second substrate. The driving circuit is configured to apply a common voltage and respective data voltages to pixel circuits on an activated scanning electrode. During each of a plurality of phases within a dynamic driving scheme scanning procedure of the liquid crystal display panel, alternating-current voltage pulses of the common voltage and the respective data voltages applied to the pixel circuits on the activated scanning electrode on an even-numbered row have inverted polarities of those applied to the pixel circuits on the activated scanning electrode on an odd-numbered row.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:方法</p>
        <p type="p">810:步驟</p>
        <p type="p">820:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="618px" img-content="tif" inline="yes" orientation="portrait" width="806px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621691</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134417</doc-number>
          <kind></kind>
          <date>114/09/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/519</main-classification>
        <further-classification edition="200601120260302B">A61K31/635</further-classification>
        <further-classification edition="200601120260302B">A61K31/573</further-classification>
        <further-classification edition="200601120260302B">A61P35/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商阿斯特捷利康公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTRAZENECA AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴里　西蒙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARRY, SIMON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威利斯　布蘭登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WILLIS, BRANDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/692,940</doc-number>
          <date>20240910</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ＡＫＴ抑制劑、ＢＣＬ－２抑制劑、及糖皮質素之治療組合</chinese-title>
        <english-title>THERAPEUTIC COMBINATIONS OF AN AKT INHIBITOR, A BCL-2 INHIBITOR, AND A GLUCOCORTICOID</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述下列者之治療組合：AKT抑制劑及BCL-2抑制劑；AKT抑制劑及糖皮質素；以及AKT抑制劑、BCL-2抑制劑、及糖皮質素。該等組合可用於治療急性淋巴母細胞白血病(ALL)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Therapeutic combinations of an AKT inhibitor and a BCL-2 inhibitor; an AKT inhibitor and a glucocorticoid; and an AKT inhibitor, a BCL-2 inhibitor and a glucocorticoid are described. The combinations can be useful in the treatment of acute lymphoblastic leukemia (ALL).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622492</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134581</doc-number>
          <kind></kind>
          <date>114/09/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G01N21/95</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商納科新股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEXTIN, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴泰勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, TAE HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權五炯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, OH HYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓宇濬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, WOOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0123135</doc-number>
          <date>20240910</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶圓檢測裝置及方法</chinese-title>
        <english-title>WAFER INSPECTION DEVICE AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種晶圓檢測裝置，該裝置包括：光源；設置在從光源發射的光傳播路徑上的照明光學系統；用於使穿透過照明光學系統的光聚焦至檢測區域的物鏡；用於使用物鏡接收來自檢測區域的反射光和散射光的光接收光學系統；及用於分別偵檢反射光訊號和散射光訊號的偵檢單元，其中光接收光學系統包括用於傳輸穿透過物鏡的反射光和散射光的孔徑光闌；及設置在孔徑光闌後部處的訊號分離器，用於沿著第一路徑引導反射光並沿著不同於第一路徑的第二路徑引導散射光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a wafer inspection device, and the device includes: a light source; an illumination optical system disposed on a propagation path of light emitted from the light source; an objective lens for focusing light passing through the illumination optical system onto an inspection region; a light-receiving optical system for receiving reflected light and scattered light from the inspection region by using the objective lens; and a detection unit for detecting a reflected light signal and a scattered light signal, respectively, wherein the light-receiving optical system includes an aperture stop for transmitting reflected light and scattered light passing through the objective lens, and a signal separator disposed at the rear of the aperture stop, guiding reflected light along a first path, and guiding scattered light along a second path different from the first path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:檢測區域</p>
        <p type="p">15:光束分光器</p>
        <p type="p">20:物鏡</p>
        <p type="p">21:孔徑光闌</p>
        <p type="p">30:中繼光學元件</p>
        <p type="p">40A:繞射光學元件</p>
        <p type="p">41:繞射光柵</p>
        <p type="p">42:主體</p>
        <p type="p">50:成像透鏡</p>
        <p type="p">60:偵檢單元</p>
        <p type="p">61:第一影像感測器</p>
        <p type="p">62:第二影像感測器</p>
        <p type="p">P1:第一空間域</p>
        <p type="p">P2:第二空間域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="444px" img-content="tif" inline="yes" orientation="portrait" width="725px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622602</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134586</doc-number>
          <kind></kind>
          <date>114/09/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251114B">G02B27/18</main-classification>
        <further-classification edition="200601120251114B">G02B27/44</further-classification>
        <further-classification edition="201501120251114B">G02B1/11</further-classification>
        <further-classification edition="200601120251114B">G02B1/00</further-classification>
        <further-classification edition="200601120251114B">G02B27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商賽悧德股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CELLID, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丸井敬太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUI, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>生水利明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHOZU, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稲畑達雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INABATA, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/040991</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>投影基板及眼鏡型終端</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種投影基板，包括：第一基板；第一入射繞射光柵，供用於投影出圖像光的投影光入射，並將所入射的投影光的至少一部分朝向第一基板內的規定的方向進行導波；第一射出繞射光柵，供藉由第一入射繞射光柵而經導波的投影光入射，並將所入射的投影光的至少一部分作為圖像光而自顯示面射出；防反射膜，形成於第一基板的至少一個面上，且與第一入射繞射光柵或第一射出繞射光柵中的至少一個繞射光柵在俯視時重疊；以及第一低折射材料，與第一入射繞射光柵或第一射出繞射光柵中的至少一個繞射光柵在俯視時重疊，且折射率較第一基板小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:投影基板</p>
        <p type="p">101:第一基板</p>
        <p type="p">102:第一面</p>
        <p type="p">103:第二面</p>
        <p type="p">210:第一入射繞射光柵</p>
        <p type="p">230:第一射出繞射光柵</p>
        <p type="p">250:第一防反射膜</p>
        <p type="p">260:第一低折射材料</p>
        <p type="p">X、Y:軸</p>
        <p type="p">Z:軸/方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="704px" img-content="tif" inline="yes" orientation="portrait" width="631px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621791</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134610</doc-number>
          <kind></kind>
          <date>114/09/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260128B">B01J23/16</main-classification>
        <further-classification edition="200601120260128B">F01N3/035</further-classification>
        <further-classification edition="200601120260128B">B01J21/00</further-classification>
        <further-classification edition="200601120260128B">B01D53/56</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱重工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>垣谷健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKITANI, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝木将利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATSUKI, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>浅井由季</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>甲斐啓一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAI, KEIICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>
                </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEMURA, MASANAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兼田慎平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEDA, SHIMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-203696</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>觸媒及具備此觸媒之去硝裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之觸媒為包含釩及錳之觸媒，且相對於作為五氧化二釩所換算之氧化釩之作為三氧化二錳所換算之氧化錳之質量比為0.179~1.52。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621584</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134660</doc-number>
          <kind></kind>
          <date>114/09/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260123B">A41D13/005</main-classification>
        <further-classification edition="201901120260123B">A41D31/04</further-classification>
        <further-classification edition="200601120260123B">A41D27/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商里布玏股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIBLE, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀井邦彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORII, KUNIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/040672</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>調溫裝具</chinese-title>
        <english-title>TEMPERATURE-CONTROL WEARABLE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於藉由做到傳熱面所接觸的部位可調整而提供一種具有通用性且易用性好的調溫裝具，本發明的調溫裝具（1）可以安裝帕耳帖元件單元（30），所述帕耳帖元件單元（30）包括借助帕耳帖元件（PE）而進行冷卻或加熱的傳熱面（31），此調溫裝具（1）具有可安裝帕耳帖元件單元（30）的主體（2）和可連結於主體（2）的連結構件（3），主體（2）具有與連結構件（3）連結用的複數個被連結部（9），連結構件（3）具有可連接於人的穿著物（CP）的連接部（4），藉由從複數個被連結部（9）中以複數個以下而且是必要數量的被連結部（9）與連結構件（3）相連結並進行連接部（4）與人的穿著物（CP）的連接，可以調整傳熱面（31）接觸身體的部位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A purpose is to provide a temperature-control wearable device capable of adjusting a contact site of a heat transfer surface, and being versatile and easy to use. The temperature-control wearable device (1) includes a Peltier element unit (30) having the heat transfer surface (31) cooled or heated by a Peltier element (PE), a main body (2) to which the Peltier element unit (30) is attachable, and a coupling member (3) connectable to the main body (2). The main body (2) includes a plurality of coupled parts (9) for coupling to the coupling member (3) that includes a connection part (4) connectable to a person’s clothing item (CP). A contact portion of the heat transfer surface (31) with a person’s body by coupling the required number of coupled parts (9) selected from the plurality of coupled parts (9), the number required being not more than the plurality of coupled parts (9), to the coupling member (3), and connecting the connection part (4) to the person’s clothing item (CP).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:調溫裝具</p>
        <p type="p">2:裝具主體</p>
        <p type="p">3:連結構件</p>
        <p type="p">3A:第一連結構件</p>
        <p type="p">9:被連結圓形開口</p>
        <p type="p">9A:第一被連結圓形開口</p>
        <p type="p">9B:第二被連結圓形開口</p>
        <p type="p">30:帕耳帖元件單元</p>
        <p type="p">30A:第一帕耳帖元件單元</p>
        <p type="p">30B:第二帕耳帖元件單元</p>
        <p type="p">CP:帽子</p>
        <p type="p">HM:穿戴者</p>
        <p type="p">LN:左背面</p>
        <p type="p">RN:右背面</p>
        <p type="p">U:上側</p>
        <p type="p">W:下側</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10036.JPG" file="ed10036.JPG" height="703px" img-content="tif" inline="yes" orientation="portrait" width="782px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623563</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134683</doc-number>
          <kind></kind>
          <date>114/09/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="202501120260302B">H05K5/10</further-classification>
        <further-classification edition="200601120260302B">G05B19/4155</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商無錫華瑛微電子技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAYING RESEARCH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫　子瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, ZIYING SOPHIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117396067</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體處理裝置</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體處理裝置，其包括底板、氣囊、下固定板、下腔體、上固定板、上腔體、外壁、導向柱、頂板和行程控制裝置，所述上腔體位置固定，所述行程控制裝置能夠調節所述下腔體和所述上腔體之間的距離並保持所述下腔體的平衡。本發明採用至少3個半球形凸起形成支點，用以保持下腔體頂部的水平狀態，防止下腔體傾斜。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a semiconductor processing device, which includes a base plate, an airbag, a lower fixing plate, a lower chamber, an upper fixing plate, an upper chamber, an outer wall, guide pillars, a top plate, and a positioning actuator. The position of the upper chamber is fixed, and the positioning actuator can adjust a distance between the lower chamber and the upper chamber and maintain the balance of the lower chamber. The invention employs at least three hemispherical protrusions to form support points to keep the top of the lower chamber level and to prevent the lower chamber from tilting.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:底板</p>
        <p type="p">20:氣囊</p>
        <p type="p">30:上固定板</p>
        <p type="p">40:上腔體</p>
        <p type="p">50:下固定板</p>
        <p type="p">60:下腔體</p>
        <p type="p">70:行程控制裝置</p>
        <p type="p">80:導向柱</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="456px" img-content="tif" inline="yes" orientation="portrait" width="706px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623010</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134710</doc-number>
          <kind></kind>
          <date>114/09/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01F27/28</main-classification>
        <further-classification edition="200601120260302B">H01F17/08</further-classification>
        <further-classification edition="200601120260302B">H01F38/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>乾坤科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CYNTEC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝其軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIE, CHI-SHIUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周佳行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, CHIA-HSING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/694,219</doc-number>
          <date>20240913</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/324,064</doc-number>
          <date>20250909</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>耦合電感</chinese-title>
        <english-title>COUPLED INDUCTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種耦合電感器包含核心組件、至少兩個第一繞組以及第二繞組。核心組件包含第一核心以及第二核心。第一核心包含第一基板、兩個第一非繞線柱，以及至少兩個設置於兩個第一非繞線柱之間的第一繞線柱。兩個第一非繞線柱及第一繞線柱連接至第一基板。每一第一繞組繞設於對應的第一繞線柱。第二繞組覆蓋所述至少兩個第一繞組。所述至少兩個第一繞組與第二繞組係沿著第一方向設置。所述至少兩個第一繞組的第一繞線方向與第二繞組的第二繞線方向係相互平行。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A coupled inductor includes a core assembly, at least two first windings, and a second winding. The core assembly includes a first core and a second core. The first core includes a first base plate, two first non-winding posts, and at least two first winding posts disposed between the two first non-winding posts. The two first non-winding posts and the first winding posts are connected to the first base plate. Each of the first windings is wound around a corresponding first winding post. The second winding covers the at least two first windings. The at least two first windings and the second winding are disposed along a first direction. A first wound direction of the at least two first windings and a second wound direction of the second winding are parallel to each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:耦合電感器</p>
        <p type="p">20:第一核心</p>
        <p type="p">21:第一基板</p>
        <p type="p">22:第一非繞線柱</p>
        <p type="p">24:第一繞線柱</p>
        <p type="p">30:第二核心</p>
        <p type="p">31:第二基板</p>
        <p type="p">32:第二非繞線柱</p>
        <p type="p">34:第二繞線柱</p>
        <p type="p">50A:第一繞組</p>
        <p type="p">50B:第一繞組</p>
        <p type="p">80:第二繞組</p>
        <p type="p">81:頂板</p>
        <p type="p">82:第一外側板</p>
        <p type="p">83:第二外側板</p>
        <p type="p">84:第一外底板</p>
        <p type="p">85:第二外底板</p>
        <p type="p">X、Y、Z:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="696px" img-content="tif" inline="yes" orientation="portrait" width="923px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621722</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134849</doc-number>
          <kind></kind>
          <date>114/09/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K38/22</main-classification>
        <further-classification edition="200601120260302B">A61P3/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商梅迪繆思有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIMMUNE LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹森　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANZEN, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞謝克　米特拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAUSCHECKER, MITRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屠　曉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, XIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡爾松　艾琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARLSSON, ELIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅林　喬安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MELIN, JOHANNA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧馬爾　薩米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMAR, SAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗里克爾頓　塞萊斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRICKLETON, CELESTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/694,086</doc-number>
          <date>20240912</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/715,293</doc-number>
          <date>20241101</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/796,841</doc-number>
          <date>20250429</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>美國</country>
          <doc-number>63/808,424</doc-number>
          <date>20250519</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多肽劑量方案</chinese-title>
        <english-title>POLYPEPTIDE DOSAGE REGIMENS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種減輕對象之體重之方法，該方法包含向該對象投予約1 mg至約15 mg之澱粉素受體(AMYR)促效劑。亦提供對應之組成物及套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method of reducing the body weight of a subject, the method comprising administering to the subject about 1 mg to about 15 mg of an amylin receptor (AMYR) agonist. Also provided are corresponding compositions and kits.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="882px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621744</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134850</doc-number>
          <kind></kind>
          <date>114/09/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120260302B">A61K47/68</main-classification>
        <further-classification edition="200601120260302B">C07K16/28</further-classification>
        <further-classification edition="200601120260302B">C07D491/22</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商阿斯特捷利康公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTRAZENECA AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤隆　梅迪納庫伊蘭　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZERON-MEDINA CUAIRAN, JORGE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MX</english-country>
              <english-address>MX</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗蘭克爾　寶拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAENKEL, PAULA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布賴爾　提姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRIER, TIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽克斯　安德魯菲利普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYKES, ANDREW PHILIP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/693,823</doc-number>
          <date>20240912</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用治療性結合分子之癌症治療</chinese-title>
        <english-title>TREATMENT OF CANCER WITH THERAPEUTIC BINDING MOLECULES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了一種治療有需要之對象之癌症的方法，該方法包含向該對象投予約0.8 mg/kg至約5.0 mg/kg的量的抗體藥物接合物(ADC)，其中該ADC包含與細胞毒素連接的抗FRα抗體或其抗原結合片段，其中該細胞毒素係拓撲異構酶I抑制劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of treating cancer in a subject in need thereof is provided herein, the method comprising administering to the subject an antibody-drug conjugate (ADC) in an amount from about 0.8 mg/kg to about 5.0 mg/kg, wherein the ADC comprises an anti-FRα antibody or antigen-binding fragment thereof linked to a cytotoxin, wherein the cytotoxin is a topoisomerase I inhibitor.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10104.JPG" file="ed10104.JPG" height="480px" img-content="tif" inline="yes" orientation="portrait" width="626px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <isuno>11</isuno>
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          <doc-number>114134924</doc-number>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東曹股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東曹精細化工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOSOH FINECHEM CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本有紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海老原良介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBIHARA, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池村周也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEMURA, SHUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, HAJIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩永宏平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWANAGA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>住田渉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMIDA, WATARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田邊綾治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANABE, RYOUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-159247</doc-number>
          <date>20240913</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>氧化鋁膜形成用原料組成物、氧化鋁膜的形成方法、氧化鋁膜及氧化鋁膜製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本發明揭示一種氧化鋁膜形成用原料組成物，其包含三甲基鋁與二甲基氫化鋁。氧化鋁膜形成用原料組成物中的二甲基氫化鋁的含量為超過0質量ppm且1000質量ppm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:原料供給部</p>
        <p type="p">20:反應氣體供給部</p>
        <p type="p">30:反應腔室</p>
        <p type="p">31:基體</p>
        <p type="p">32:支撐部</p>
        <p type="p">40:載體/稀釋氣體供給部</p>
        <p type="p">50:排氣泵</p>
        <p type="p">100:氧化鋁膜製造裝置</p>
        <p type="p">L1:反應氣體沖洗管線</p>
        <p type="p">L2:淨化氣體管線</p>
        <p type="p">L3:原料氣體沖洗管線</p>
        <p type="p">L4:原料氣體供給管線</p>
        <p type="p">L5:反應氣體供給管線</p>
        <p type="p">L6:排氣管線</p>
        <p type="p">L7:分支管線</p>
        <p type="p">M1、M2、M3、M4、M5:質量流量控制器</p>
        <p type="p">V1、V3:閥</p>
        <p type="p">V2:流量可變閥</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="830px" img-content="tif" inline="yes" orientation="portrait" width="727px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621725</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134946</doc-number>
          <kind></kind>
          <date>114/09/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K38/45</main-classification>
        <further-classification edition="200601120260302B">A61K38/10</further-classification>
        <further-classification edition="200601120260302B">A61P9/04</further-classification>
        <further-classification edition="200601120260302B">A61P9/10</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
        <further-classification edition="201601120260302B">A23L33/17</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商珍白斯凱爾有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GEMVAX &amp; KAEL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金商在</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANG JAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0123882</doc-number>
          <date>20240911</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2025-0128031</doc-number>
          <date>20250909</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含ＧＶ１００１肽作為有效成分的用於預防或治療由抗癌化學療法所致副作用的組成物</chinese-title>
        <english-title>A COMPOSITION FOR PREVENTING OR TREATING SIDE EFFECT CAUSED BY AN ANTICANCER CHEMOTHERPAY COMPRISING GV1001 PEPTIDE AS AN ACTIVE INGREDIENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種用於預防、治療或改善由利用抗癌化學療法藥物的抗癌化學療法所致副作用的組成物，更詳細地，涉及一種由序列編號1的胺基酸序列構成的肽及包含其作為有效成分的組成物，其具有抑制和/或緩解由利用蒽環類抗癌藥物的抗癌化學療法所致諸如心臟毒性、血管障礙、炎症等副作用的活性。本發明的由序列編號1的胺基酸序列構成的肽及包含其作為有效成分的組成物可有用地用作可緩解抗癌化學療法藥物特別是蒽環類抗癌藥物的副作用並提高抗癌藥物效果的抗癌輔助劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a composition for use in preventing, treating, or improving side effects caused by anticancer chemotherapy using an anticancer chemotherapeutic agent, and more particularly, to a peptide consisting of the amino acid sequence of SEQ ID NO: 1, which has the activity of suppressing and/or alleviating side effects such as cardiotoxicity, vascular disorder, inflammation, etc. caused by anticancer chemotherapy using the anthracycline anticancer agent, and to a composition comprising the same as an active ingredient. The peptide consisting of the amino acid sequence of SEQ ID NO: 1 according to the present invention and the composition comprising the same as an active ingredient can be usefully used as an anticancer adjuvant that can alleviate side effects of anticancer chemotherapy agents, particularly anthracycline anticancer agents, and enhance the effectiveness of anticancer agents.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="597px" img-content="tif" inline="yes" orientation="portrait" width="635px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623124</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114134998</doc-number>
          <kind></kind>
          <date>114/09/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120260302B">H01R13/6586</main-classification>
        <further-classification edition="200601120260302B">H01R13/506</further-classification>
        <further-classification edition="200601120260302B">H01R13/518</further-classification>
        <further-classification edition="201101120260302B">H01R12/72</further-classification>
        <further-classification edition="201101120260302B">H01R24/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉琨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李興玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭金闖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAN, JINCHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汪元鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, YUANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024114216293</doc-number>
          <date>20241011</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>第一端子模組以及第一背板連接器</chinese-title>
        <english-title>FIRST TERMINAL MODULE AND FIRST BACKPLANE CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種第一端子模組包括第一線纜模組、第一屏蔽套筒以及延伸屏蔽殼體組件。前述第一線纜模組包括複數第一導電端子以及與前述第一導電端子相連的第一線纜。前述第一屏蔽套筒至少部分套接在前述第一線纜模組上。前述延伸屏蔽殼體組件包括屏蔽腔體。前述延伸屏蔽殼體組件與前述第一屏蔽套筒相接觸。如此設置，本發明有利於改善對第一導電端子的屏蔽效果。本發明還揭示了一種具有前述第一端子模組的背板連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first terminal module includes a first cable module, a first shielding sleeve and an extension shielding shell assembly. The first cable module includes a number of first conductive terminals and a first cable connected to the first conductive terminals. The first shielding sleeve is at least partially sleeved on the first cable module. The extension shielding shell assembly includes a shielding chamber. The extension shielding shell assembly is in contact with the first shielding sleeve. With this arrangement, it is beneficial to improving the shielding effect on the first conductive terminal. A backplane connector having the first terminal module is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:第一線纜模組</p>
        <p type="p">25:第一屏蔽套筒</p>
        <p type="p">26:延伸屏蔽殼體組件</p>
        <p type="p">27:第一線纜</p>
        <p type="p">29:第一固定塊</p>
        <p type="p">291:第一定位塊</p>
        <p type="p">2911:第一凹口</p>
        <p type="p">292:第二定位塊</p>
        <p type="p">2921:第二凹口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10151.JPG" file="ed10151.JPG" height="645px" img-content="tif" inline="yes" orientation="portrait" width="673px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622153</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135044</doc-number>
          <kind></kind>
          <date>114/09/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">C08G73/10</main-classification>
        <further-classification edition="200601120251103B">C08L79/08</further-classification>
        <further-classification edition="200601120251103B">C08K5/103</further-classification>
        <further-classification edition="200601120251103B">C08K5/1515</further-classification>
        <further-classification edition="200601120251103B">C08K5/1545</further-classification>
        <further-classification edition="200601120251103B">C08K5/18</further-classification>
        <further-classification edition="200601120251103B">C08K5/20</further-classification>
        <further-classification edition="200601120251103B">C08K5/3415</further-classification>
        <further-classification edition="200601120251103B">C08K5/3467</further-classification>
        <further-classification edition="200601120251103B">C08K5/3492</further-classification>
        <further-classification edition="200601120251103B">C08K5/378</further-classification>
        <further-classification edition="200601120251103B">C08K5/5419</further-classification>
        <further-classification edition="200601120251103B">C08K5/5435</further-classification>
        <further-classification edition="200601120251103B">G02F1/1337</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤下翔平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJISHITA, SHOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>近藤一幸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONDOU, KAZUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199697</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>液晶配向劑、液晶配向膜及液晶配向膜的製造方法、以及液晶元件及液晶元件的製造方法</chinese-title>
        <english-title>LIQUID CRYSTAL ALIGNMENT AGENT, LIQUID CRYSTAL ALIGNMENT FILM AND METHOD FOR MANUFACTURING LIQUID CRYSTAL ALIGNMENT FILM, AND LIQUID CRYSTAL ELEMENT AND METHOD FOR MANUFACTURING LIQUID CRYSTAL ELEMENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種液晶配向劑，含有：（A）聚合物，包含源自具有式（1）所表示的部分結構的單體的結構單元；以及（B）化合物，在一分子內具有合計兩個以上的基F&lt;sup&gt;1&lt;/sup&gt;且不具有芳香環，所述基F&lt;sup&gt;1&lt;/sup&gt;為選自由含聚合性碳-碳不飽和鍵的基、異氰酸酯基、經保護的異氰酸酯基、環狀碳酸酯基、具烯酮結構的基、具米氏酸結構的基、環狀醚基、環狀硫醚基、噁唑啉基、經保護的羥基烷基醯胺基、經保護的硫醇基及經保護的二級胺基所組成的群組中的至少一種。式（1）中，Ar&lt;sup&gt;1&lt;/sup&gt;及Ar&lt;sup&gt;2&lt;/sup&gt;為二價芳香環基等。R&lt;sup&gt;1&lt;/sup&gt;為氫原子等。X&lt;sup&gt;1&lt;/sup&gt;為-O-等。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="112px" width="306px" file="ed10029.JPG" alt="ed10029.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622841</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135059</doc-number>
          <kind></kind>
          <date>114/09/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120251001B">G06Q20/40</main-classification>
        <further-classification edition="201201120251001B">G06Q20/34</further-classification>
        <further-classification edition="201201120251001B">G06Q20/32</further-classification>
        <further-classification edition="202401120251001B">G06Q50/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳敬奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,131</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>供電設備與其供電管理方法</chinese-title>
        <english-title>POWER SUPPLY APPARATUS AND POWER SUPPLY MANAGEMENT METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種供電設備與其供電管理方法。供電設備包括資訊擷取裝置與處理器。處理器耦接資訊擷取裝置。響應於資訊擷取裝置偵測一支付載具，處理器識別支付載具的支付類別。處理器根據支付類別執行支付載具的一充電授權驗證。響應於充電授權驗證成功，處理器啟動一電力傳輸作業並根據支付載具進行一充電交易。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power supply apparatus and a power supply management method thereof are provided. The power supply apparatus includes an information capturing device and a processor. The processor is coupled to the information capturing device. In response to the information capturing device detecting a payment carrier, the processor identifies a payment type of the payment carrier. The processor performs a charging authorization verification of the payment carrier according to the payment type. In response to that the charging authorization verification is determined successful, the processor initiates a power transfer operation and performs a charging transaction using the payment carrier.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S310~S330:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="503px" img-content="tif" inline="yes" orientation="portrait" width="712px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622345</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135108</doc-number>
          <kind></kind>
          <date>114/09/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">E04F15/024</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商利達旺金屬系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RITTERWAND GMBH &amp; CO. KG METALL-SYSTEMBAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉斯多夫　奧拉夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RASCHDORFF, OLAF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>102024127397.6</doc-number>
          <date>20240923</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>潔淨室地板系統和高強度架高地板板材</chinese-title>
        <english-title>CLEANROOM FLOOR SYSTEM AND HEAVY-DUTY RAISED FLOOR PANEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種潔淨室地板系統（1），包含一支柱框架（12）及設置於支柱框架（12）上的複數個架高地板板材（10）。支柱框架（12）包含複數個垂直支柱（14），其排列於一矩形格狀結構（13）之交叉點處，使得每一個架高地板板材（10）之四個角皆由一個垂直支柱（14）支撐。架高地板板材（10）中的至少一者被設計為一高強度架高地板板材（20），其具有對齊於其至少一邊緣的一無支柱部分（22），其具有至少100公分之長度。高強度架高地板板材（20）包含用於支撐於至少四個垂直支柱（14）上的一外部承重框架（24），較佳為配置於角落處，配置有波紋板（30）的一下殼體（26），以及設置於波紋板（30）上的一上殼體（28）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a cleanroom floor system (1) comprising a pedestal frame (12) and a plurality of raised floor panels (10) placed on the pedestal frame (12). The pedestal frame (12) comprises a plurality of vertical pedestals (14) arranged at intersection points of a rectangular grid (13), such that each raised floor panel (10) is supported at each of its four corners by a vertical pedestal (14). At least one of the raised floor panels (10) is designed as a heavy-duty raised floor panel (20) which has a pedestal-free portion (22) aligned along at least one of its edges and having a length of at least 100 cm. The heavy-duty raised floor panel (20) comprises an outer load-bearing frame (24) for resting on at least four vertical pedestals (14), preferably arranged in the corners, a lower shell (26) on which a corrugated sheet (30) is arranged, and an upper shell (28) resting on the corrugated sheet (30).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:潔淨室地板系統</p>
        <p type="p">14:垂直支柱</p>
        <p type="p">20:高強度架高地板板材</p>
        <p type="p">24:承重框架</p>
        <p type="p">26:下殼體</p>
        <p type="p">28:上殼體</p>
        <p type="p">30:波紋板</p>
        <p type="p">34:導電連接元件</p>
        <p type="p">42:凸出部</p>
        <p type="p">44:凹槽</p>
        <p type="p">210:上側面</p>
        <p type="p">220:側表面</p>
        <p type="p">230:平坦重疊區</p>
        <p type="p">241:水平子區域</p>
        <p type="p">242:垂直子區域</p>
        <p type="p">244:上側面</p>
        <p type="p">284:上側面</p>
        <p type="p">310:水平部分</p>
        <p type="p">320:垂直部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="663px" img-content="tif" inline="yes" orientation="portrait" width="965px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622137</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135151</doc-number>
          <kind></kind>
          <date>114/09/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C08G2/04</main-classification>
        <further-classification edition="200601120260226B">C08J3/12</further-classification>
        <further-classification edition="200601120260226B">C08F2/36</further-classification>
        <further-classification edition="200601120260226B">C08L101/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>綜研化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOKEN CHEMICAL &amp; ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根岸純平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGISHI, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増田順也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, JUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-162676</doc-number>
          <date>20240919</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂粒子、樹脂粉末、成形體、樹脂粒子之製造方法、及第2成形體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種對於基材樹脂之分散性優異的樹脂粒子。根據本案，提供一種樹脂粒子，其包含具有來自鏈轉移劑之結構的聚合物，鏈轉移劑根據Fedors法算出之SP值為9.0～20.0(cal/cm&lt;sup&gt;3&lt;/sup&gt;)&lt;sup&gt;1/2&lt;/sup&gt;。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622129</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135180</doc-number>
          <kind></kind>
          <date>114/09/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">C08F18/12</main-classification>
        <further-classification edition="200601120260102B">C09D131/02</further-classification>
        <further-classification edition="201801120260102B">C09D7/61</further-classification>
        <further-classification edition="200601120260102B">B32B27/18</further-classification>
        <further-classification edition="200601120260102B">B32B27/30</further-classification>
        <further-classification edition="200601120260102B">B32B37/02</further-classification>
        <further-classification edition="200601120260102B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家原惠太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IEHARA, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205230</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>定向膜用塗敷液、積層體、及光學積層體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案課題在於提供：可適宜製作可抑制漏光之液晶化合物之定向固化層的定向膜用塗敷液、及包含從該定向膜用塗敷液獲得之定向膜的積層體、以及光學積層體之製造方法。&lt;br/&gt;  作為其解決手段，本發明實施形態之定向膜用塗敷液，包含膜形成成分、以及鹼金屬及/或鹼土族金屬；且，相對於所形成之定向膜的總重量，包含700ppm以上之該鹼金屬及/或該鹼土族金屬。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623198</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135265</doc-number>
          <kind></kind>
          <date>114/09/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260115B">H03H7/00</main-classification>
        <further-classification edition="200601120260115B">H03F3/189</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅德與舒瓦茲公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROHDE &amp; SCHWARZ GMBH &amp; CO. KG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯佩克　哈拉爾德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPECKER, HARALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒂策　沃爾夫勒姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TITZE, WOLFRAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧尼穆斯　弗洛里安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHNIMUS, FLORIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>10 2024 135 386.4</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於電漿處理的電漿激發的射頻產生器系統及電漿產生系統以及用於電漿處理的激發電漿的方法</chinese-title>
        <english-title>RADIO FREQUENCY GENERATOR SYSTEM AND PLASMA GENERATION SYSTEM FOR PLASMA EXCITATION FOR A PLASMA PROCESS AND METHOD OF EXCITING A PLASMA FOR A PLASMA PROCESS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於一電漿處理之電漿激發之射頻產生器系統(12)，該射頻產生器系統(12)具有經組態以產生具有不同頻率之至少三個射頻訊號之一訊號產生器單元(18)。該射頻產生器系統(12)包括一寬頻放大器級(24)，該寬頻放大器級經組態以放大該等射頻訊號以在該放大器級(24)之一放大器級輸出(26)處輸出經放大射頻訊號。該射頻產生器系統(12)具有一匹配網路(28)，該匹配網路經組態以設定該放大器級(24)之該放大器級輸出(26)之一預限定阻抗，該放大器級輸出(26)與該匹配網路(28)之間的該阻抗不等於50 ohms。該射頻產生器系統(12)具有：一電漿處理阻抗獲取單元(34)，該電漿處理阻抗獲取單元(34)經組態以獲取該電漿處理之一複合值阻抗(Z&lt;sub&gt;P&lt;/sub&gt;)；一控制單元(42)，該控制單元(42)經組態以基於所獲取的該電漿處理之該複合值阻抗(Z&lt;sub&gt;P&lt;/sub&gt;)而控制該訊號產生器單元(18)、該放大器級(24)及/或該匹配網路(28)。進一步闡述一種針對一電漿處理激發一電漿之電漿產生系統(10)及方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a radio frequency generator system (12) for plasma excitation for a plasma process, having a signal generator unit (18) configured to generate at least three radio frequency signals having different frequencies. The radio frequency generator system (12) includes a broadband amplifier stage (24) configured to amplify the radio frequency signals to output amplified radio frequency signals at an amplifier stage output (26) of the amplifier stage (24). The radio frequency generator system (12) has a matching network (28) that is configured to set a predefined impedance for the amplifier stage output (26) of the amplifier stage (24), the impedance between the amplifier stage output (26) and the matching network (28) being unequal to 50 ohms. The radio frequency generator system (12) has a plasma process impedance acquisition unit (34) configured to acquire a complex-valued impedance (Z&lt;sub&gt;P&lt;/sub&gt;) of the plasma process, a control unit (42) being configured to control the signal generator unit (18), the amplifier stage (24), and/or the matching network (28) based on the acquired complex-valued impedance (Z&lt;sub&gt;P&lt;/sub&gt;) of the plasma process. Further described are a plasma generation system (10) and a method of exciting a plasma for a plasma process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電漿產生系統</p>
        <p type="p">12:射頻產生器系統</p>
        <p type="p">14:電漿腔室</p>
        <p type="p">16:電極</p>
        <p type="p">18:訊號產生器單元</p>
        <p type="p">20:共用訊號產生器輸出/訊號產生器輸出</p>
        <p type="p">22:訊號產生器</p>
        <p type="p">24:寬頻放大器級/放大器級</p>
        <p type="p">26:放大器級輸出</p>
        <p type="p">28:匹配網路</p>
        <p type="p">30:可調整電容器</p>
        <p type="p">32:網路</p>
        <p type="p">34:電漿製程阻抗獲取單元</p>
        <p type="p">36:輸出</p>
        <p type="p">38:定向耦合器</p>
        <p type="p">40:量測單元</p>
        <p type="p">42:控制單元</p>
        <p type="p">44:感測器</p>
        <p type="p">46:輸入介面</p>
        <p type="p">48:切換單元</p>
        <p type="p">50:旁路</p>
        <p type="p">52:控制單元介面</p>
        <p type="p">I&lt;sub&gt;P&lt;/sub&gt;:電流</p>
        <p type="p">U&lt;sub&gt;P&lt;/sub&gt;:電壓</p>
        <p type="p">Z&lt;sub&gt;P&lt;/sub&gt;:複合值阻抗</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="776px" img-content="tif" inline="yes" orientation="portrait" width="1075px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623081</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135360</doc-number>
          <kind></kind>
          <date>114/09/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120260209B">H01M50/183</main-classification>
        <further-classification edition="202101120260209B">H01M50/291</further-classification>
        <further-classification edition="202101120260209B">H01M50/249</further-classification>
        <further-classification edition="202101120260209B">H01M50/466</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ新能源股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ENERGY SOLUTION, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旻珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUR, JAE YONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林正勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JEONG HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174523</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有剛性結構的電池組</chinese-title>
        <english-title>BATTERY PACK HAVING RIGID STRUCTURE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露的電池組包含單元組件、覆蓋單元組件的外殼、以及位於單元組件和外殼之間的支架，其中支架具有U形結構，其中U形結構包含耦合到單元組件一個表面的基座部分、以及分別從基座部分兩端彎曲並突出形成的第一和第二側表面部分，以及其中第一和第二側表面部分耦合到外殼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A battery pack according to the present disclosure comprises a cell assembly, an outer case that covers the cell assembly, and a bracket located between the cell assembly and the case, wherein the bracket has a U-shaped structure, wherein the U-shaped structure comprises a base portion coupled to one surface of the cell assembly, and first and second side surface portions that are bent and protrusively formed from both ends of the base portion, respectively, and wherein the first and second side surface portions are coupled to the outer case.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:電池組</p>
        <p type="p">200a:第一外殼</p>
        <p type="p">200b:第二外殼</p>
        <p type="p">530:第三緊固構件</p>
        <p type="p">515:密封蓋部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="741px" img-content="tif" inline="yes" orientation="portrait" width="595px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623494</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135442</doc-number>
          <kind></kind>
          <date>114/09/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120251103B">H10K59/10</main-classification>
        <further-classification edition="202301120251103B">H10K59/38</further-classification>
        <further-classification edition="202301120251103B">H10K65/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔惠珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, HYEJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋泰俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, TAEJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0173294</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置及其製造方法</chinese-title>
        <english-title>DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置，包括：第一、第二和第三發光元件，設置在第一基板上；光學間隙層，設置在該第一、第二和第三發光元件上；第二基板，設置在該光學間隙層上；第一、第二和第三彩色濾光片，設置在該第二基板上；第一、第二和第三凹面部，位於該第二基板的下表面；以及第一、第二和第三透鏡，位於該光學間隙層的上表面，其中，該第一、第二和第三透鏡分別填充該第一、第二和第三凹面部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device can include first, second and third light-emitting elements disposed on a first substrate, an optical gap layer disposed on the first, second and third light-emitting elements, a second substrate disposed on the optical gap layer, first, second and third color filters disposed on the second substrate, first, second and third concave portions on a lower surface of the second substrate, and first, second and third lenses on an upper surface of the optical gap layer, in which the first, second and third lenses fill the first, second and third concave portions, respectively.</p>
      </isu-abst>
      <representative-img>
        <p type="p">PA:焊墊區</p>
        <p type="p">PX:像素</p>
        <p type="p">DM:壩部</p>
        <p type="p">AA:主動區域</p>
        <p type="p">NAA:非主動區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="465px" img-content="tif" inline="yes" orientation="portrait" width="646px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622255</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135516</doc-number>
          <kind></kind>
          <date>114/09/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C21D1/613</main-classification>
        <further-classification edition="200601120260226B">C22F1/11</further-classification>
        <further-classification edition="200601120260226B">C22C38/18</further-classification>
        <further-classification edition="201501120260226B">A63B53/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>復盛應用科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUSHENG PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳昭林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, ZHAO-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAO, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鐘程華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, CHENG-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張景淮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHING-HUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃耀霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>越南</country>
          <doc-number>1-2024-07374</doc-number>
          <date>20241001</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用以製作高爾夫球桿頭的合金之熱處理方法</chinese-title>
        <english-title>HEAT TREATMENT METHOD FOR AN ALLOY USED TO MAKE GOLF CLUB HEADS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用以製作高爾夫球桿頭的合金之熱處理方法，用以解決習知桿頭調角不易的問題。係包含：以一合金基材成型一桿頭半成品，該合金基材包含以重量百分比計為0.22～0.27％的碳、0.6～1％的矽、0.3～0.7％的錳、0.05～0.27％的鎳、16.4～17.4％的鉻、0.1～0.3％的鉬、0.1～0.3％的銅、平衡量的鐵及不可避免的雜質；以1000～1060℃對該桿頭半成品進行一固溶處理60～120分鐘；及對進行該固溶處理後的桿頭半成品進行一回火處理，該回火處理包含加熱該固溶處理後的桿頭半成品至650～865℃並維持90～240分鐘後，以一回火介質冷卻該桿頭半成品至90℃以下。係具有易於調整高爾夫球桿頭角度的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A heat treatment method for an alloy used to make golf club heads is disclosed, which addresses the problem of difficult golf club head angle adjustment in conventional golf club heads. Includes: forming a semi-finished golf club head from an alloy substrate, wherein the alloy substrate comprises, by weight, 0.22-0.27% carbon, 0.6-1% silicon, 0.3-0.7% manganese, 0.05-0.27% nickel, 16.4-17.4% chromium, 0.1-0.3% molybdenum, 0.1-0.3% copper, and the balance iron and unavoidable impurities; subjecting the semi-finished golf club head to a solution treatment at 1000-1060°C for 60-120 minutes; and subjecting the solution-treated semi-finished golf club head to a tempering treatment, wherein the tempering treatment comprises heating the solution-treated semi-finished golf club head to 650-865°C and maintaining the temperature for 90-240 minutes, followed by cooling the semi-finished golf club head to below 90°C using a tempering medium. It is easy to adjust the angle of the golf club head.</p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623357</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135539</doc-number>
          <kind></kind>
          <date>114/09/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安東浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHN, DONGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳世忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OH, SECHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹敏瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, MINSEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鎭宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JINWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔珍銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JINMYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀井秀樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORII, HIDEKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0141452</doc-number>
          <date>20241016</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種半導體裝置。該半導體裝置包括：一位元線，其設置在一基體上且沿著一第一水平方向延伸；一模結構，其設置在該位元線上、沿著與該第一水平方向相交之一第二水平方向延伸且包括一金屬層；一作用半導體層，其沿著一垂直方向在該模結構之一側壁上延伸且包括氧化物半導體；以及一字線，其設置在該作用半導體層之一側壁上且沿著該第二水平方向延伸。該作用半導體層之該側壁之至少一部分係與該金屬層接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device is provided. The semiconductor device includes: a bit line provided on a substrate and extending along a first horizontal direction; a mold structure provided on the bit line, extending along a second horizontal direction crossing the first horizontal direction, and including a metal layer; an active semiconductor layer extending along a vertical direction on a side wall of the mold structure and including an oxide semiconductor; and a word line provided on a side wall of the active semiconductor layer and extending along the second horizontal direction. At least a portion of the side wall of the active semiconductor layer is in contact with the metal layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:基體</p>
        <p type="p">120:周邊電路佈線結構</p>
        <p type="p">122:周邊電路佈線</p>
        <p type="p">124:周邊電路接點</p>
        <p type="p">126:周邊電路絕緣層</p>
        <p type="p">130:模結構</p>
        <p type="p">132:第一絕緣層</p>
        <p type="p">134:金屬層</p>
        <p type="p">136:第二絕緣層</p>
        <p type="p">138:覆蓋層</p>
        <p type="p">142:絕緣襯裡</p>
        <p type="p">144:埋入式絕緣層</p>
        <p type="p">156:位元線接點</p>
        <p type="p">158:位元線接點間隔體</p>
        <p type="p">176:絕緣層</p>
        <p type="p">A1-A1’:線</p>
        <p type="p">AC:作用區</p>
        <p type="p">AP:作用半導體層</p>
        <p type="p">BL:位元線</p>
        <p type="p">CAP:胞元電容器</p>
        <p type="p">CTR:胞元電晶體</p>
        <p type="p">CX1:部分</p>
        <p type="p">GI:閘極絕緣層</p>
        <p type="p">LP:焊著墊</p>
        <p type="p">MCA:胞元陣列區</p>
        <p type="p">PCA:周邊電路區</p>
        <p type="p">PTG:閘極電極</p>
        <p type="p">PTI:閘極絕緣層</p>
        <p type="p">PTR:周邊電路電晶體</p>
        <p type="p">PTS:源極/汲極區</p>
        <p type="p">WL:字線</p>
        <p type="p">X:第一水平方向</p>
        <p type="p">Y:第二水平方向</p>
        <p type="p">Z:垂直方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10036.bmp" file="ed10036.bmp" height="701px" img-content="tif" inline="yes" orientation="portrait" width="709px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622799</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135602</doc-number>
          <kind></kind>
          <date>114/09/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">G06G7/16</main-classification>
        <further-classification edition="200601120260223B">G06G7/18</further-classification>
        <further-classification edition="202301120260223B">G06N3/065</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥可金　查爾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MACKIN, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧金　喬瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUQUIN, JOSE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/901,565</doc-number>
          <date>20240930</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於類比記憶體式運算(AIMC)之振盪向量矩陣相乘</chinese-title>
        <english-title>OSCILLATORY VECTOR MATRIX MULTIPLICATION FOR ANALOG IN-MEMORY COMPUTE (AIMC)</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種振盪矩陣向量相乘裝置，其包括一或多個振盪矩陣向量相乘電路。各振盪矩陣向量相乘電路包括：一第一可調諧電阻電路，其包含一第一互補金屬氧化物半導體(CMOS)電晶體、一第一啟動輸入及一第一可調諧電阻電路輸出，其中該第一互補金屬氧化物半導體(CMOS)電晶體包含一第一閘極輸入、耦接至該第一啟動輸入之一第一輸入及耦接至該第一可調諧電阻電路輸出之一第一輸出，且其中該第一啟動輸入經組態以接收一啟動信號；及一可程式化振盪器電路，其耦接至該第一可調諧電阻電路之該第一閘極輸入且經組態以基於一給定電導產生一控制信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An oscillatory matrix-vector multiplication device includes one or more oscillatory matrix-vector multiplication circuits. Each oscillatory matrix-vector multiplication circuit includes a first tunable resistive circuit that comprises a first complementary metal-oxide semiconductor (CMOS) transistor, a first activation input, and a first tunable resistive circuit output, wherein the first complementary metal-oxide semiconductor (CMOS) transistor includes a first gate input, a first input coupled to the first activation input and a first output coupled to the first tunable resistive circuit output, and wherein the first activation input is configured to receive an activation signal; and a programmable oscillator circuit coupled to the first gate input of the first tunable resistive circuit and configured to produce a control signal based on a given conductance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">224:啟動信號/輸入啟動/經脈寬調變啟動</p>
        <p type="p">254-1:互補金屬氧化物半導體電晶體/第一互補金屬氧化物半導體(CMOS)電晶體</p>
        <p type="p">254-2:互補金屬氧化物半導體電晶體/並聯互補金屬氧化物半導體(CMOS)電晶體</p>
        <p type="p">
        &lt;i&gt;Φ&lt;/i&gt;
        &lt;sub&gt;11&lt;/sub&gt;:振盪信號</p>
        <p type="p">
        &lt;i&gt;Φ&lt;/i&gt;
        &lt;sub&gt;
          &lt;i&gt;MN&lt;/i&gt;
        &lt;/sub&gt;:開關頻率</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10046.JPG" file="ed10046.JPG" height="548px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622812</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135604</doc-number>
          <kind></kind>
          <date>114/09/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260228B">G06N10/70</main-classification>
        <further-classification edition="202201120260228B">G06N10/20</further-classification>
        <further-classification edition="200601120260228B">G06F17/18</further-classification>
        <further-classification edition="200601120260228B">G06F17/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萬國商業機器公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERNATIONAL BUSINESS MACHINES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬茱達爾　瑞塔傑特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAJUMDAR, RITAJIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里維羅　拉米雷斯　佩德羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RIVERO RAMIREZ, PEDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬茱德爾　史瓦納迪普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAJUMDER, SWARNADEEP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>麥尼夫　茲拉特科　克里斯提夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEV, ZLATKO KRISTEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃章典</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊名宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/910,520</doc-number>
          <date>20241009</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>針對機率分佈之量子誤差緩解</chinese-title>
        <english-title>QUANTUM ERROR MITIGATION FOR PROBABILITY DISTRIBUTIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了用於判定經誤差緩解之機率分佈的一或多種系統、裝置、電腦程式產品及/或電腦實施方法。一種系統可包含可儲存電腦可執行組件之一記憶體。該系統可進一步包含一處理器，該處理器執行可進行以下操作的該等電腦可執行組件中之至少一者：執行一量子電路之複數次運行以獲得可觀察量之雜訊機率；獲得該等雜訊機率之一機率分佈；使用該機率分佈來判定該等可觀察量之期望值；對該等期望值執行誤差緩解以獲得一經誤差緩解之機率分佈；及將該等經誤差緩解之期望值變換為一經誤差緩解之機率分佈。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">One or more systems, devices, computer program products and/or computer-implemented methods for determining error mitigated probability distributions are provided. A system can comprise a memory that can store computer-executable components. The system can further comprise a processor that executes at least one of the computer executable components that can execute a plurality of shots of a quantum circuit to obtain noise probabilities of observables; obtain a probability distribution of the noise probabilities; determine, using the probability distribution, expectation values of the observables; perform error mitigation on the expectation values to obtain an error mitigated probability distribution; and transform the error mitigated expectation values into an error mitigated probability distribution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">101:機率分佈產生組件</p>
        <p type="p">102:經誤差緩解之機率分佈產生系統/系統</p>
        <p type="p">104:處理器</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:系統匯流排</p>
        <p type="p">110:執行組件</p>
        <p type="p">112:評估組件</p>
        <p type="p">114:誤差緩解組件</p>
        <p type="p">116:變換組件</p>
        <p type="p">118:量子電路</p>
        <p type="p">1602:量子系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10056.JPG" file="ed10056.JPG" height="665px" img-content="tif" inline="yes" orientation="portrait" width="986px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622645</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135610</doc-number>
          <kind></kind>
          <date>114/09/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G03F7/20</main-classification>
        <further-classification edition="200601120260226B">H05K1/14</further-classification>
        <further-classification edition="200601120260226B">G02B5/09</further-classification>
        <further-classification edition="200601120260226B">G02B6/00</further-classification>
        <further-classification edition="200601120260226B">G02B6/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商卡爾蔡司ＳＭＴ有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARL ZEISS SMT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威斯　史蒂芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAAS, STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>10 2024 209 176.6</doc-number>
          <date>20240924</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學系統、配置與微影設備</chinese-title>
        <english-title>OPTICAL SYSTEM, ARRANGEMENT AND LITHOGRAPHY APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於微影設備(1)的光學系統(100)，包括：至少一個光學元件(202)，至少一個致動器/感測器裝置(202)，其指派給該至少一個光學元件(202)，一介面裝置(206)，其透過光學方式連接到該至少一個致動器/感測器裝置(202)以進行資料傳輸，並且可電連接和/或光連接至一控制器(300)，其中該介面裝置(206)包括第一微型組件(212)，該第一微型組件具有第一處理器元件(214)和與其整合的第一光學介面元件(216)，以及該至少一個致動器/感測器裝置(204)包括一第二微型組件(218)，該第二微型組件具有第二處理器元件(220)和與其整合的第二光學介面元件(222)，後者透過光學方式連接到該第一光學介面元件(216)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical system (100) for a lithography apparatus (1), comprising at least one optical element (202), at least one actuator/sensor device (202) assigned to the at least one optical element (202), an interface device (206) that is optically connected to the at least one actuator/sensor device (202) for data transmission purposes and is electrically and/or optically connectable to a controller (300), wherein the interface device (206) comprises a first micro-component (212) having a first processor element (214) and a first optical interface element (216) integrated therewith and the at least one actuator/sensor device (204) comprises a second micro-component (218) having a second processor element (220) and a second optical interface element (222) integrated therewith, the latter being optically connected to the first optical interface element (216).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:配置</p>
        <p type="p">200:光學系統</p>
        <p type="p">202:光學元件</p>
        <p type="p">204:致動器/感測器裝置</p>
        <p type="p">206:介面裝置</p>
        <p type="p">208:光波導</p>
        <p type="p">210:連接</p>
        <p type="p">212:微型組件</p>
        <p type="p">214:處理器元件</p>
        <p type="p">216:介面元件</p>
        <p type="p">218:微型組件</p>
        <p type="p">220:處理器元件</p>
        <p type="p">222:介面元件</p>
        <p type="p">248:真空外殼</p>
        <p type="p">250:表面</p>
        <p type="p">252:保護外殼</p>
        <p type="p">254:區域</p>
        <p type="p">256:真空饋通道</p>
        <p type="p">300:控制器</p>
        <p type="p">A:大氣壓力</p>
        <p type="p">R:外部空間；無塵室</p>
        <p type="p">V:真空環境</p>
        <p type="p">Z:指派</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="881px" img-content="tif" inline="yes" orientation="portrait" width="664px">
          </img>
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      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202623437</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114135647</doc-number>
          <kind></kind>
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        </document-id>
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        <main-classification edition="202501120260302B">H10D84/03</main-classification>
        <further-classification edition="202301120260302B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU HANDOTAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大槻剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHTSUKI, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松原壽樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUBARA, TOSHIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木温</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>上東洋太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEHIGASHI, YOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部達夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-189927</doc-number>
          <date>20241029</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>HBM用半導體記憶裝置及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之HBM用半導體記憶裝置具有基體部、及該基體部上之由矽構成之半導體記憶元件部；前述基體部具備由矽構成之第1基體部及該第1基體部上之由3C-SiC構成之第2基體部，或僅由3C-SiC構成。藉此，提供一種可抑制破裂、且改善了散熱特性之HBM用半導體記憶裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:HBM用半導體記憶裝置/記憶裝置</p>
        <p type="p">2:基體部</p>
        <p type="p">2A:第1基體部/基體部</p>
        <p type="p">2B:第2基體部</p>
        <p type="p">3:半導體記憶元件部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="258px" img-content="tif" inline="yes" orientation="portrait" width="598px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622173</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114135699</doc-number>
          <kind></kind>
          <date>114/09/17</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120260224B">C08L63/02</main-classification>
        <further-classification edition="200601120260224B">C08G59/66</further-classification>
        <further-classification edition="200601120260224B">C08G61/10</further-classification>
        <further-classification edition="201801120260224B">C08K3/011</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商味之素股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AJINOMOTO CO., INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林拓夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, TAKUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小椋一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGURA, ICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哉
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中駿介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>進藤有希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINDO, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荻野啓志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGINO, KEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-168626</doc-number>
          <date>20240927</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種樹脂組成物，其是包含(A)環氧樹脂、(B)含有特定結構的硫醇化合物和(C)固化促進劑的樹脂組成物，其中，(A)環氧樹脂包含：(A-1)含有芳族骨架的環氧樹脂，相對於100質量%的(A)環氧樹脂，(A-1)含有芳族骨架的環氧樹脂的量為30質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623167</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135735</doc-number>
          <kind></kind>
          <date>114/09/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200701120260302B">H02M1/44</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王蕾越</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LEI YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王景遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JING YUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東彧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, DONG YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117200812</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>通信控制方法及相關裝置</chinese-title>
        <english-title>COMMUNICATION CONTROL METHOD AND RELATED DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種通信控制方法及相關裝置，通信控制方法藉由脈衝電源的控制器，監控模數轉換器的目標引腳感應的雜訊信號及控制模組的中斷資訊，基於監控的雜訊信號得到雜訊資訊，並基於雜訊資訊和中斷資訊，得到雜訊等級，最後基於雜訊等級，配置控制模組的通信參數，實現在不同雜訊等級下，配置相應的通信參數的目的，使得控制模組在不同的雜訊等級下，可以基於不同的通信參數與其他硬體模組進行通信，實現通信參數隨雜訊等級的自我調整調節，有利於保障通信模組在不同雜訊環境中與其他硬體模組的正常通信，從而提升脈衝電源的抗雜訊水平。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a communication control method and related device. The communication control method, through the controller of a pulse power supply, monitors the noise signal sensed at the target pin of an analog-to-digital converter and the interrupt information of a control module. Based on the monitored noise signal, noise information is obtained, and based on the noise information and interrupt information, a noise level is determined. Finally, based on the noise level, the communication parameters of the control module are configured. This achieves the purpose of configuring corresponding communication parameters under different noise levels, allowing the control module to communicate with other hardware modules using different communication parameters according to the noise level. This enables self-adjustment and regulation of communication parameters according to the noise level, which helps ensure normal communication between the communication module and other hardware modules in different noise environments, thereby improving the noise immunity of the pulse power supply.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:獲取控制模組的中斷資訊，中斷資訊包括控制模組中因雜訊觸發的目標中斷的被觸發資訊</p>
        <p type="p">S102:獲取控制模組的中斷資訊</p>
        <p type="p">S103:基於雜訊資訊和中斷資訊，得到雜訊等級</p>
        <p type="p">S104:基於雜訊等級，配置控制模組的通信參數</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="489px" img-content="tif" inline="yes" orientation="portrait" width="534px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622183</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135766</doc-number>
          <kind></kind>
          <date>114/09/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C08L83/07</main-classification>
        <further-classification edition="200601120260226B">C08G77/18</further-classification>
        <further-classification edition="200601120260226B">C08K3/22</further-classification>
        <further-classification edition="200601120260226B">C08J5/18</further-classification>
        <further-classification edition="200601120260226B">B32B27/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日鐵化學材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CHEMICAL &amp; MATERIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河谷俊宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWATANI, TOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-167639</doc-number>
          <date>20240926</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>熱硬化性矽酮樹脂組成物、積層體及積層體的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種熱硬化性矽酮樹脂組成物、以及積層體及所述積層體的製造方法，所述熱硬化性矽酮樹脂組成物相對於環狀烯烴樹脂基材（I）具有優異的附著性且可賦予耐光性等特性，所述積層體是積層所述基材（I）、由所述組成物形成的硬化被膜層（II）而成。一種積層體，為上文敘述的積層體，其中，硬化被膜層（II）包含反應性矽酮樹脂（A）、多官能(甲基)丙烯酸酯單體（B）、有機過氧化物（C）、以及紫外線吸收劑（D），相對於（A）～（D）的合計100重量份，以重量份計包含30～75的（A）、20～65的（B）、0.5～10的（C）、0.1～30的（D），且組成物100 g中的（B）的(甲基)丙烯酸莫耳數為0.20～0.60，（A）是式（i）的烷氧基矽烷、與包含式（ii）的矽酸烷基酯或其部分水解物的化合物進行水解及縮合而獲得，相對於Si成分的合計100莫耳，[源自包含（ii）成分的化合物的Si莫耳/源自（i）成分的Si莫耳]滿足0.5～4.0的範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622579</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135832</doc-number>
          <kind></kind>
          <date>114/09/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">G02B9/64</main-classification>
        <further-classification edition="200601120251201B">G02B13/18</further-classification>
        <further-classification edition="202101120251201B">G02B7/04</further-classification>
        <further-classification edition="200601120251201B">G02B15/14</further-classification>
        <further-classification edition="202101120251201B">G02B7/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭弼鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, PHIL HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張東赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, DONG HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金琴鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KUM HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0173967</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統，包括多個透鏡，沿著光學成像系統的光軸從多個透鏡的物體側向光學成像系統的成像平面依序設置，以及反射構件，設置在多個透鏡的前方並具有反射表面，其中多個透鏡包括第一透鏡，設置在最靠近反射構件的位置，並具有正的折射力以及第二透鏡，設置在第一透鏡的影像側，與第一透鏡相鄰，並具有負的折射力，且滿足條件表達式60°＜FOV＜90°和1.3＜Fno＜1.7，其中FOV是光學成像系統的視場，且Fno是光學成像系統的F數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a plurality of lenses sequentially disposed along an optical axis of the optical imaging system from an object side of the plurality of lenses toward an imaging plane of the optical imaging system; and a reflective member disposed in front of the plurality of lenses and having a reflective surface, wherein the plurality of lenses includes a first lens disposed closest to the reflective member and having a positive refractive power, and a second lens disposed adjacent to the first lens on an image side of the first lens and having a negative refractive power, and the conditional expressions 60° ＜ FOV ＜ 90° and 1.3 ＜ Fno ＜ 1.7 are satisfied, where FOV is a field of view of the optical imaging system, and Fno is an F-number of the optical imaging system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:第六透鏡</p>
        <p type="p">170:第七透鏡</p>
        <p type="p">180:第八透鏡</p>
        <p type="p">IF:濾光片</p>
        <p type="p">IP:成像平面</p>
        <p type="p">R:反射構件</p>
        <p type="p">ST:光闌</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="789px" img-content="tif" inline="yes" orientation="portrait" width="550px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623597</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135869</doc-number>
          <kind></kind>
          <date>114/09/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/76</main-classification>
        <further-classification edition="200601120260302B">C25D17/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商先進尼克斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASMPT NEXX, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱格勒　阿瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KEIGLER, ARTHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古德曼　丹尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOODMAN, DANIEL L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昱宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/921,364</doc-number>
          <date>20241021</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於濕法化學半導體處理的鎖定框架固持器和工件裝載器</chinese-title>
        <english-title>LOCKING FRAME HOLDER AND WORKPIECE LOADER FOR WET CHEMICAL SEMICONDUCTOR PROCESSING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明介紹了一種用於濕法化學半導體處理的工件固持器和一種用於將工件裝載至固持器的裝置。所述工件固持器包括兩個周邊密封板、電氣接觸外掛程式以及鎖定板。當所述鎖定板處於鎖定位置時，這些周邊密封板為流體密封和電氣接觸提供力。所述鎖定板還可作為電氣匯流排，為這些電氣接觸外掛程式提供電流。工件裝載器包括將工件插入所述工件固持器或從其中取出的工作臺。所述裝載器還包括真空卡盤，用於在裝載之前對周邊密封板進行定位，並在鎖定和解鎖期間對所述周邊密封板進行壓縮。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A workpiece holder and an apparatus for loading workpieces onto the holder for use in wet chemical semiconductor processing is described. The workpiece holder comprises two perimeter seal plates, electrical contact inserts and a locking plate. The perimeter seal plates provide force for both fluid sealing and electrical contact when the locking plate is in a locked position. The locking plate also functions as an electrical bus to provide current to the electrical contact inserts. The workpiece loader comprises a stage to insert or remove a workpiece from the workpiece holder. The loader also comprises vacuum chucks to position the perimeter seal plates prior to loading and to compress the perimeter seal plates during locking and unlocking.</p>
      </isu-abst>
      <representative-img>
        <p type="p">60:工件</p>
        <p type="p">100:工件固持器</p>
        <p type="p">110:中心支撐框架</p>
        <p type="p">111:延伸部</p>
        <p type="p">150:第一周邊密封板</p>
        <p type="p">170:運輸手柄</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="927px" img-content="tif" inline="yes" orientation="portrait" width="794px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623097</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114135938</doc-number>
          <kind></kind>
          <date>114/09/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01Q15/10</main-classification>
        <further-classification edition="201901120260224B">B32B7/05</further-classification>
        <further-classification edition="200601120260224B">H01P1/20</further-classification>
        <further-classification edition="200601120260224B">B32B15/08</further-classification>
        <further-classification edition="200601120260224B">E06B7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤木良教</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKAGI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>野本之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMOTO, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-161618</doc-number>
          <date>20240919</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電波穿透體及窗材</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於電波反射體中維持電波之穿透性並同時提高光之穿透性。電波穿透體4係配置於窗材1之表面的透光性電波穿透體4，上述窗材具備具備至少一個透明板2及積層於至少一個透明板2之金屬層3；上述電波穿透體具備：導電層41；及支持導電層41之基材層43；導電層41以具有導電區域41及包圍導電區域41之非導電區域42之圖案40的方式，縱橫週期性地配置複數個，各圖案40中，於導電區域41，沿第1方向X交替地形成複數線狀之導電圖案410及具有透光性之複數線狀之非導電圖案420。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">40:分環諧振部</p>
        <p type="p">41:導電層(導電區域)</p>
        <p type="p">42,42A,42B:非導電區域</p>
        <p type="p">400:外緣</p>
        <p type="p">410:導電圖案</p>
        <p type="p">420:非導電圖案</p>
        <p type="p">L8:導電圖案之寬度</p>
        <p type="p">L9:非導電圖案之寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="712px" img-content="tif" inline="yes" orientation="portrait" width="606px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622555</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136028</doc-number>
          <kind></kind>
          <date>114/09/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B6/00</main-classification>
        <further-classification edition="200601120260302B">G02F1/1335</further-classification>
        <further-classification edition="200601120260302B">G02F1/13357</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中強光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORETRONIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭增科</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIAU, TZENG-KE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐英舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYU, YING-SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱文彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, WEN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康家梁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHIA-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113140302</doc-number>
          <date>20241023</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>導光板、光源模組與顯示裝置</chinese-title>
        <english-title>LIGHT GUIDE PLATE, LIGHT SOURCE MODULE AND DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種導光板包括板體與多個光學微結構。板體具有第一表面。多個光學微結構形成於板體的第一表面。多個光學微結構各自具有光學曲面以及用於劃分光學曲面的多個光學參考面。多個光學參考面垂直於第一表面。光學曲面與多個光學參考面的交界分別形成多個光學輪廓線。多個光學輪廓線各自與第一表面之間形成有一光學角，且至少部分光學角的角度彼此不同。一種採用所述導光板的光源模組和顯示裝置也被提出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light guide plate including a plate body and a plurality of optical microstructures is provided. The plurality of optical microstructures are formed on a first surface of the plate body. Each of the plurality of optical microstructures has an optical curved surface and a plurality of optical reference surfaces used to divide the optical curved surface. The plurality of optical reference surfaces are perpendicular to the first surface. The intersections of the optical curved surfaces and the plurality of optical reference surfaces respectively form a plurality of optical contour lines. An optical angle is formed between each of the plurality of optical contour lines and the first surface, and the values of at least part of the optical angles are different from each other. A light source module and a display apparatus adopting the light guide plate are also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">111:光學微結構</p>
        <p type="p">BS:光學面</p>
        <p type="p">CS:光學曲面</p>
        <p type="p">IL1:第一交界線</p>
        <p type="p">IL2:第二交界線</p>
        <p type="p">L1:第一連線</p>
        <p type="p">L2:第二連線</p>
        <p type="p">O:參考點</p>
        <p type="p">P1:第一端點</p>
        <p type="p">P2:第二端點</p>
        <p type="p">PL1、PL2、PL3、PL4:光學輪廓線</p>
        <p type="p">RS1、RS2、RS3、RS4:光學參考面</p>
        <p type="p">S1:第一表面</p>
        <p type="p">θ1、θ2、θ3、θ4:光學角</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="503px" img-content="tif" inline="yes" orientation="portrait" width="551px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622573</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136046</doc-number>
          <kind></kind>
          <date>114/09/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120260129B">G02B7/02</main-classification>
        <further-classification edition="200601120260129B">G02B9/60</further-classification>
        <further-classification edition="200601120260129B">G02B13/18</further-classification>
        <further-classification edition="200601120260129B">G02B15/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任敏爀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IM, MIN HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁東晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, DONG SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0172695</doc-number>
          <date>20241127</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2025-0062152</doc-number>
          <date>20250513</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鏡頭模組</chinese-title>
        <english-title>LENS MODULE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">透鏡模組包括具有內部空間的鏡筒；以及沿著光軸方向設置在鏡筒中的第一透鏡和第二透鏡，其中第一透鏡和第二透鏡中的每一個包括展現光學特性的光學部分、以及從光學部分在外徑方向延伸的支撐部分，第一透鏡的支撐部分包括多個溝槽和多個突出物中的一個，在面向第二透鏡的表面上在圓周方向彼此間隔開，以及第二透鏡的支撐部分包含多個溝槽和多個突出物中的另一個，在面向第一透鏡的表面上在圓周方向彼此間隔開，以及多個溝槽和多個突出物在圓周方向彼此接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A lens module includes a lens barrel having an internal space; and a first lens and a second lens disposed in the lens barrel along an optical axis direction, wherein each of the first lens and the second lens includes an optical portion exhibiting an optical characteristic, and a support portion extending from the optical portion in an outer diameter direction, the support portion of the first lens includes one of a plurality of grooves and a plurality of protrusions spaced apart from each other in a circumferential direction on a surface facing the second lens, and the support portion of the second lens comprises another one of the plurality of grooves and the plurality of protrusions spaced apart from each other in the circumferential direction on a surface facing the first lens, and the plurality of grooves and the plurality of protrusions contact each other in the circumferential direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">A:部分</p>
        <p type="p">L1:第一透鏡/透鏡</p>
        <p type="p">G、g1、g2、g3:溝槽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="392px" img-content="tif" inline="yes" orientation="portrait" width="326px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623215</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136050</doc-number>
          <kind></kind>
          <date>114/09/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120260223B">H04B7/0408</main-classification>
        <further-classification edition="200601120260223B">H04L25/02</further-classification>
        <further-classification edition="200601120260223B">H01Q21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江忠信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHUNG-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/698,096</doc-number>
          <date>20240924</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/698,099</doc-number>
          <date>20240924</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有基帶訊號重構的射頻多輸入多輸出（MIMO）通信系統</chinese-title>
        <english-title>RF MIMO COMMUNICATION SYSTEM WITH BASEBAND SIGNAL RESTRUCTURING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種無線通信系統，包括用於數位基頻信號處理的數位處理電路；一個發射器（TX）訊號重構單元和一個接收器（RX）訊號重構單元，用於數位基頻信號的處理。該TX訊號重構單元包括接收單端輸入訊號並應用可調權重係數以通過數學運算轉換生成共模和差模輸出訊號。該RX訊號重構單元執行反向操作，接收共模和差模輸入訊號並使用相應的權重矩陣恢復原始單端訊號。該RF通信系統將訊號重構單元與數位處理電路和收發器及天線集成，以實現多輸入多輸出（MIMO）操作。該系統提供了改進的隔離性並減小了天線尺寸，提供可重構的操作並保持訊號完整性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wireless communication system includes TX and RX signal restructure units for digital baseband signal processing. The TX signal restructure unit receives single-ended input signals and applies configurable weight coefficients to generate common-mode and differential-mode output signals through mathematical transformation operations. The RX signal restructure unit performs inverse operations, receiving common-mode and differential-mode input signals and recovering original single-ended signals using corresponding weight matrices. Both restructure units operate in multiple modes with different coefficient configurations, enabling adaptive signal processing based on channel conditions. The units are positioned in the baseband section to reduce RF front-end losses while providing precise control of signal relationships. An RF communication system integrates the restructure units with digital processing circuits, transceivers and antennas to achieve MIMO operation. The system provides improved isolation and reduces antenna size, offering reconfigurable operation and maintaining signal integrity to enhance wireless communication efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訊號重構單元</p>
        <p type="p">101:第一端口</p>
        <p type="p">102:第二端口</p>
        <p type="p">103:第三端口</p>
        <p type="p">104:第四端口</p>
        <p type="p">105:訊號路由電路</p>
        <p type="p">106:MIMO天線</p>
        <p type="p">RF1、RF2:RF訊號</p>
        <p type="p">RF1_r、RF2_r:重構訊號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="391px" img-content="tif" inline="yes" orientation="portrait" width="522px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622962</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136073</doc-number>
          <kind></kind>
          <date>114/09/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">G11C7/14</main-classification>
        <further-classification edition="200601120260202B">G11C7/12</further-classification>
        <further-classification edition="200601120260202B">G11C11/4063</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐昊瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, HOYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金訓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金絃峻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HYUNJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0171738</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含有負電壓產生器的記憶體裝置</chinese-title>
        <english-title>MEMORY DEVICE INCLUDING NEGATIVE VOLTAGE GENERATOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種記憶體裝置，其含有：第一記憶體胞元及第二記憶體胞元；一第一寫入驅動器，其被組配來將寫入資料提供至該第一記憶體胞元；一第二寫入驅動器，其被組配來將寫入資料提供至該第二記憶體胞元；以及一負電壓產生器，其被組配來將一負電壓提供至該第一寫入驅動器及該第二寫入驅動器。該負電壓產生器含有：一第一耦合電容器，其被組配來將該負電壓提供至該第一寫入驅動器；以及一第二耦合電容器，其被組配來將該負電壓提供至該第二寫入驅動器。該第一耦合電容器與該第二耦合電容器彼此電氣連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device includes first and second memory cells, a first write driver configured to provide write data to the first memory cell, a second write driver configured to provide write data to the second memory cell, and a negative voltage generator configured to provide a negative voltage to the first and second write drivers. The negative voltage generator includes a first coupling capacitor configured to provide the negative voltage to the first write driver, and a second coupling capacitor configured to provide the negative voltage to the second write driver. The first and second coupling capacitors are electrically connected to one another.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100:記憶體裝置</p>
        <p type="p">1130:行選擇電路</p>
        <p type="p">1141:第一寫入驅動器</p>
        <p type="p">1142:第二寫入驅動器</p>
        <p type="p">114n:第n寫入驅動器</p>
        <p type="p">2000:負電壓產生器</p>
        <p type="p">BL1:第一位元線</p>
        <p type="p">BL2:第二位元線</p>
        <p type="p">BLz:第z位元線</p>
        <p type="p">BLB1:第一互補位元線</p>
        <p type="p">BLB2:第二互補位元線</p>
        <p type="p">BLBz:第z互補位元線</p>
        <p type="p">C1a,C1b,C2a,C2b,Cna,Cnb:電容器</p>
        <p type="p">Ccom:共用耦合電容器</p>
        <p type="p">DATA1,DATA2,DATAn:資料信號</p>
        <p type="p">IO1:第一輸入/輸出線路</p>
        <p type="p">IO2,IOn:輸入/輸出線路</p>
        <p type="p">MC1:第一記憶體胞元</p>
        <p type="p">MC2:第二記憶體胞元</p>
        <p type="p">MCz:第z記憶體胞元</p>
        <p type="p">NBL_ENB:控制信號</p>
        <p type="p">VSSNcom:共用耦合負電壓</p>
        <p type="p">VSSPcom:共用耦合正電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.png" file="d10026.TIF" giffile="ed10026.png" height="773px" img-content="tif" inline="yes" orientation="portrait" width="954px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622944</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136143</doc-number>
          <kind></kind>
          <date>114/09/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120251202B">G09G3/32</main-classification>
        <further-classification edition="202501120251202B">H10H29/49</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ顯示器股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權香明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GWON, HYANGMYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JIHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李娄多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RHE, RUDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0168967</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置</chinese-title>
        <english-title>DISPLAY DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種根據本發明實施例的顯示裝置可包括：基板；複數個發光裝置，其設置在該基板上且位於顯示區域中；複數條行線，其電性連接至該複數個發光裝置中的每一者的第一電極；複數條列線，其電性連接至該複數個發光裝置中的每一者的第二電極；複數個驅動器，其配置以驅動該複數條行線及該複數條列線；以及複數條列連接線，其電性連接該複數條列線與該複數個驅動器。該複數條列連接線中的至少一條可包含多重佈線區，該多重佈線區包含兩個或兩個以上導電層，該些導電層彼此垂直地重疊，其間插入有絕緣層。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device according to embodiments of the present disclosure may include a substrate, a plurality of light emitting devices disposed on the substrate and positioned in a display area, a plurality of column lines electrically connected to a first electrode of each of the plurality of light emitting devices, a plurality of row lines electrically connected to a second electrode of each of the plurality of light emitting devices, a plurality of drivers configured to drive the plurality of column lines and the plurality of row lines, and a plurality of row connection lines electrically connecting the plurality of row lines and the plurality of drivers. At least one of the plurality of row connection lines may include a multi-wiring section including two or more conductive layers vertically overlapping with each other with an insulating layer interposed therebetween.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">102:撓性印刷電路</p>
        <p type="p">104:印刷電路板</p>
        <p type="p">106:支撐基板</p>
        <p type="p">110:顯示面板</p>
        <p type="p">112:第一黏著層</p>
        <p type="p">114:偏光層</p>
        <p type="p">116:第二黏著層</p>
        <p type="p">118:蓋構件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="753px" img-content="tif" inline="yes" orientation="portrait" width="703px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621992</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136155</doc-number>
          <kind></kind>
          <date>114/09/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C01G7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松田產業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA SANGYO COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>水橋正英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZUHASHI, SHOEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤優介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-191280</doc-number>
          <date>20241031</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>亞硫酸金鹽之製造方法及亞硫酸金鹽溶液</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種生成作為中間物質之雷酸金來製造亞硫酸金鹽之方法，且為安全性高之方法。藉由包括下述步驟之製造方法來解決課題：將金原料進行酸溶解，製備金酸溶液之步驟；於金酸溶液添加氨水，使雷酸金沉澱之步驟；以純水及鹼水溶液清洗上述雷酸金之步驟；及於經清洗之雷酸金添加金屬之亞硫酸鹽，製備亞硫酸金鹽溶液之步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623497</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136213</doc-number>
          <kind></kind>
          <date>114/09/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120251114B">H10K59/122</main-classification>
        <further-classification edition="202301120251114B">H10K59/121</further-classification>
        <further-classification edition="202301120251114B">H10K59/35</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔孝晙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, HYOJOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0169796</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>有機發光顯示設備</chinese-title>
        <english-title>ORGANIC LIGHT EMITTING DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種有機發光顯示設備，包含：具有多個子像素之基板；設置於此基板上並限定發光開口之像素限定層；設置於此像素限定層上並限定對應於發光開口之間隔壁開口之間隔壁；及對應於間隔壁開口之發光元件，間隔壁開口包含：中心開口；設置成從中心開口沿第一方向延伸之第一間隔壁開口；設置成從中心開口沿與第一方向相交之第二方向延伸之第二間隔壁開口；以及設置成從中心開口分別沿與第一方向及第二方向相交之第三方向延伸之第三間隔壁開口，其中子像素分別設置於第一、第二、三間隔壁開口之每一者中，使得能夠在共用結構內分離並佈置子像素。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An organic light emitting display apparatus is disclosed, including a substrate having a plurality of subpixels; a pixel defining layer on the substrate and defining a light emitting opening; a partition wall on the pixel defining layer and defining a partition wall opening corresponding to the light emitting opening; and a light emitting element corresponding to the partition wall opening. The partition wall opening includes a center opening, a first partition wall opening extending in a first direction from the center opening, a second partition wall opening extending in a second direction overlapping the first direction, and a third partition wall opening extending in a third direction overlapping both the first and second directions. One subpixel is disposed in each of the first, second, and third partition wall openings, enabling separation and arrangement of subpixels within a shared structure for efficient light emission without using a fine metal mask.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板</p>
        <p type="p">101:電路元件層</p>
        <p type="p">105:間隔壁/間隔結構</p>
        <p type="p">AA:顯示區域</p>
        <p type="p">AE1:第一陽極電極</p>
        <p type="p">AE2:第二陽極電極</p>
        <p type="p">AE3:第三陽極電極</p>
        <p type="p">OPP:間隔壁開口</p>
        <p type="p">OPPa:中心開口</p>
        <p type="p">OPPb:第一間隔壁開口</p>
        <p type="p">OPPc:第二間隔壁開口</p>
        <p type="p">OPPd:第三間隔壁開口</p>
        <p type="p">PDL:像素限定層</p>
        <p type="p">SP1:第一子像素</p>
        <p type="p">SP2:第二子像素</p>
        <p type="p">SP3:第三子像素</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="872px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622155</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136216</doc-number>
          <kind></kind>
          <date>114/09/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C08G73/12</main-classification>
        <further-classification edition="200601120260224B">C08L79/08</further-classification>
        <further-classification edition="200601120260224B">C08L63/00</further-classification>
        <further-classification edition="200601120260224B">C08J5/22</further-classification>
        <further-classification edition="201801120260224B">C08K3/011</further-classification>
        <further-classification edition="200601120260224B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商積水化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKISUI CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KENTAROU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林達史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, TATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-163629</doc-number>
          <date>20240920</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂材料、硬化物及多層印刷佈線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠抑制硬化物之翹曲，並且能夠提高對金屬層之剝離強度之樹脂材料。  &lt;br/&gt;本發明之樹脂材料包含硬化性化合物(A)、硬化劑(B)、及熱塑性樹脂(C)，上述熱塑性樹脂(C)包含軟化點為120℃以上之熱塑性樹脂(C1)、及軟化點為110℃以下之聚醯亞胺樹脂(C2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">11:多層印刷佈線板</p>
        <p type="p">12:電路基板</p>
        <p type="p">12a:上表面</p>
        <p type="p">13~16:絕緣層</p>
        <p type="p">17:金屬層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="550px" img-content="tif" inline="yes" orientation="portrait" width="713px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623544</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136260</doc-number>
          <kind></kind>
          <date>114/09/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P52/00</main-classification>
        <further-classification edition="201201120260302B">B24B37/24</further-classification>
        <further-classification edition="201201120260302B">B24B37/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士紡控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIBO HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>前田敏秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAEDA, TOSHIHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川崎哲明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASAKI, TETSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒川祐樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROKAWA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森明竜馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIAKE, RYOMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-168641</doc-number>
          <date>20240927</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>研磨墊及研磨裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;本發明提供被研磨物之中心部亦能夠穩定地研磨之研磨墊及具備該研磨墊之研磨裝置。  &lt;br/&gt;[解決手段]  &lt;br/&gt;根據本發明之一態樣，提供一種研磨墊，其於自研磨面30A之法線方向俯視研磨面30A時，於各研磨區域R中，第1凸部32之直徑為100 μm以上500 μm以下，複數個第1凸部32整體沿研磨面30A之第1方向DR1，並且以下述方式隔開特定間隔地排列：以研磨面30A之基準點RF為中心之輻射狀的方式；且以沿第2方向DR2呈螺旋狀，該第2方向DR2為隨著以基準點RF為中心迴旋並逐漸遠離基準點RF的方式，第1中心距離D1為第1凸部32之直徑之2倍以上4倍以下，第1凸部32之第2中心距離D2為第1凸部32之直徑之2.5倍以上5倍以下，距離D3為第1凸部32之直徑之1/4倍以上1倍以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <p type="p">30:研磨層</p>
        <p type="p">30A:研磨面</p>
        <p type="p">R:研磨區域</p>
        <p type="p">RF:基準點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="543px" img-content="tif" inline="yes" orientation="portrait" width="550px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622978</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136261</doc-number>
          <kind></kind>
          <date>114/09/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">G11C16/10</main-classification>
        <further-classification edition="200601120260223B">G11C11/56</further-classification>
        <further-classification edition="200601120260223B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商超捷公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SILICON STORAGE TECHNOLOGY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　祥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴托里　賽門</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARTOLI, SIMONE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>席維洛　史蒂芬諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIVERO, STEFANO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑟里哥　史蒂芬諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SURICO, STEFANO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫約利　朱塞佩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOIOLI, GIUSEPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝達利達　羅倫佐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEDARIDA, LORENZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錫耶里　讓弗朗索瓦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THIERY, JEAN FRANCOIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬巴　謝爾蓋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOURBA, SERGUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪柯柏　凱瑟琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DECOBERT, CATHERINE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　恩漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DO, NHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金　珍浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JINHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　秋蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEE, LATT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/948,227</doc-number>
          <date>20241114</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/US25/14805</doc-number>
          <date>20250206</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>在系統操作期間更新快閃記憶體中軟體碼的演算法</chinese-title>
        <english-title>ALGORITHMS FOR UPDATING SOFTWARE CODE IN FLASH MEMORY DURING SYSTEM OPERATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在一個實施例中，一種方法包括：將一第一碼映像之(&lt;i&gt;n-1&lt;/i&gt;)個分區以單層級胞元格式儲存在一第一組儲存庫中，其中該第一組儲存庫包括&lt;i&gt;n&lt;/i&gt;個快閃記憶體胞元儲存庫中之(&lt;i&gt;n-1&lt;/i&gt;)個；以及將該第一映像之(&lt;i&gt;n-1&lt;/i&gt;)個分區及一第二碼映像之(&lt;i&gt;n-1&lt;/i&gt;)個分區以多層級胞元格式儲存在一第二組儲存庫中，其中該第二組儲存庫包括該&lt;i&gt;n&lt;/i&gt;個儲存庫中之(&lt;i&gt;n-1&lt;/i&gt;)個且該第二組儲存庫包括該第一組儲存庫中未含有之一儲存庫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In one example, a method comprises storing &lt;i&gt;(n-1&lt;/i&gt;) partitions of a first image of code in a first set of banks in single-level cell format, wherein the first set of banks comprise (&lt;i&gt;n-1&lt;/i&gt;) of &lt;i&gt;n&lt;/i&gt; banks of flash memory cells; and storing (&lt;i&gt;n-1&lt;/i&gt;) partitions of the first image and (&lt;i&gt;n-1&lt;/i&gt;) partitions of a second image of code in a second set of banks in multi-level cell format, wherein the second set of banks comprise (&lt;i&gt;n-1&lt;/i&gt;) of the &lt;i&gt;n&lt;/i&gt; banks and the second set of banks comprises a bank not contained in the first set of banks.</p>
      </isu-abst>
      <representative-img>
        <p type="p">800:演算法</p>
        <p type="p">801:事件</p>
        <p type="p">802:事件</p>
        <p type="p">803:事件</p>
        <p type="p">804:事件</p>
        <p type="p">805:事件</p>
        <p type="p">806:選擇性之事件</p>
        <p type="p">850:映像</p>
        <p type="p">850-1:分區</p>
        <p type="p">850-2:分區</p>
        <p type="p">850-3:分區</p>
        <p type="p">850-4:分區</p>
        <p type="p">860:映像</p>
        <p type="p">860-1:分區</p>
        <p type="p">860-2:分區</p>
        <p type="p">860-3:分區</p>
        <p type="p">860-4:分區</p>
        <p type="p">601-1:儲存庫</p>
        <p type="p">601-2:儲存庫</p>
        <p type="p">601-3:儲存庫</p>
        <p type="p">601-4:儲存庫</p>
        <p type="p">601-5:儲存庫</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="587px" img-content="tif" inline="yes" orientation="portrait" width="869px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623465</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136303</doc-number>
          <kind></kind>
          <date>114/09/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260228B">H10F39/18</main-classification>
        <further-classification edition="202301120260228B">H04N25/704</further-classification>
        <further-classification edition="202301120260228B">H04N25/621</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商索尼半導體解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONY SEMICONDUCTOR SOLUTIONS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内田哲弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古谷勇人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUYA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-194015</doc-number>
          <date>20241105</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光檢測裝置及電子設備</chinese-title>
        <english-title>LIGHT DETECTION DEVICE AND ELECTRONIC APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像裝置包括一半導體基板及一第一像素。該第一像素包括：一第一光電轉換區，其安置於該半導體基板中；一第二光電轉換區，其在一平面視圖中安置於該半導體基板中鄰近該第一光電轉換區；一第一浮動擴散區，其安置於該半導體基板中；一第一電晶體，其耦合至該第一光電轉換區及該第一浮動擴散區；及一第二電晶體，其耦合至該第二光電轉換區及該第一浮動擴散區。在該平面視圖中，該第二電晶體可鄰近該第一電晶體且具有與該第一電晶體不同之一大小。該成像裝置可包含於一電子設備及/或用於包括一信號處理電路之一系統之一控制車輛中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging device comprises a semiconductor substrate a first pixel. The first pixel comprises a first photoelectric conversion region disposed in the semiconductor substrate, a second photoelectric conversion region disposed in the semiconductor substrate adjacent to the first photoelectric conversion region in a plan view, a first floating diffusion region disposed in the semiconductor substrate, a first transistor coupled to the first photoelectric conversion region and the first floating diffusion region, and a second transistor coupled to the second photoelectric conversion region and the first floating diffusion region. In the plan view, the second transistor may be adjacent to the first transistor and have a different size than the first transistor. The imaging device may be included in an electronic apparatus and/or a control vehicle for a system that comprises a signal processing circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:大像素</p>
        <p type="p">21:像素電路</p>
        <p type="p">22a:小像素</p>
        <p type="p">22b:小像素</p>
        <p type="p">AMP:放大電晶體</p>
        <p type="p">Cp:電容器</p>
        <p type="p">FD1:浮動擴散區</p>
        <p type="p">FD2:浮動擴散區</p>
        <p type="p">FDG:轉換效率電晶體/第三電晶體</p>
        <p type="p">MIMVDD:預定高電壓節點</p>
        <p type="p">PD:光電轉換裝置/光電轉換區</p>
        <p type="p">PD1:光電轉換裝置/第一光電轉換裝置</p>
        <p type="p">PD2:光電轉換裝置/第二光電轉換裝置</p>
        <p type="p">RST:放電電晶體</p>
        <p type="p">SEL:選擇電晶體</p>
        <p type="p">TG:傳送電晶體/傳送電路</p>
        <p type="p">TG1:傳送電晶體/第一電晶體</p>
        <p type="p">TG2:傳送電晶體/第二電晶體</p>
        <p type="p">TRN:傳送區/第一半導體區</p>
        <p type="p">VDD:預定高電壓節點</p>
        <p type="p">Vimg:像素信號</p>
        <p type="p">VSL:垂直信號線</p>
        <p type="p">VSS:預定參考電壓節點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10038.JPG" file="ed10038.JPG" height="517px" img-content="tif" inline="yes" orientation="portrait" width="510px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623284</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136464</doc-number>
          <kind></kind>
          <date>114/09/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260302B">H04W4/48</main-classification>
        <further-classification edition="200601120260302B">B60R16/023</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田浩史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/932,645</doc-number>
          <date>20241031</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>人力車輛組件</chinese-title>
        <english-title>HUMAN-POWERED VEHICLE COMPONENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種人力車輛組件包括無線通信器電路系統。該無線通信器電路系統經組態以回應於一第一使用者輸入而使用一第一通信協定將一第一無線信號傳輸至一第一額外人力車輛組件。該無線通信器電路系統經組態以回應於不同於該第一使用者輸入之一第二使用者輸入而使用不同於該第一通信協定之一第二通信協定將一第二無線信號傳輸至一第二額外人力車輛組件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A human-powered vehicle component comprises wireless communicator circuitry. The wireless communicator circuitry is configured to transmit a first wireless signal to a first additional human-powered vehicle component using a first communication protocol in response to a first user input. The wireless communicator circuitry is configured to transmit a second wireless signal to a second additional human-powered vehicle component using a second communication protocol different from the first communication protocol in response to a second user input different from the first user input.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:人力車輛系統</p>
        <p type="p">12:齒輪變速器</p>
        <p type="p">12B:可移動結構</p>
        <p type="p">12E:電動致動器</p>
        <p type="p">16:懸架</p>
        <p type="p">16E:電動致動器</p>
        <p type="p">16F:狀態改變結構</p>
        <p type="p">16G:電動致動器</p>
        <p type="p">16H:狀態改變結構</p>
        <p type="p">24:操作裝置</p>
        <p type="p">24B:使用者介面電路系統</p>
        <p type="p">24X:第一使用者介面電路系統</p>
        <p type="p">24Z:第二使用者介面電路系統</p>
        <p type="p">26:操作裝置</p>
        <p type="p">BC1:人力車輛組件</p>
        <p type="p">BC2:人力車輛組件</p>
        <p type="p">BC3:第一額外人力車輛組件</p>
        <p type="p">BC4:第二額外人力車輛組件</p>
        <p type="p">BC11:使用者介面電路系統</p>
        <p type="p">BC11X:第一使用者介面電路系統</p>
        <p type="p">BC11Z:第二使用者介面電路系統</p>
        <p type="p">BC12:通知裝置</p>
        <p type="p">BC15:電源</p>
        <p type="p">BC16:電源固持器</p>
        <p type="p">BC31:第一額外使用者介面電路系統</p>
        <p type="p">BC32:通知裝置</p>
        <p type="p">BC33:第一電動致動器</p>
        <p type="p">BC35:電源</p>
        <p type="p">BC36:電源固持器</p>
        <p type="p">BC41:第二額外使用者介面電路系統</p>
        <p type="p">BC42:通知裝置</p>
        <p type="p">BC43:第二電動致動器</p>
        <p type="p">BC45:電源</p>
        <p type="p">BC46:電源固持器</p>
        <p type="p">EC1:控制器電路系統</p>
        <p type="p">EC3:第一額外控制器電路系統</p>
        <p type="p">EC4:第二額外控制器電路系統</p>
        <p type="p">EC11:處理器</p>
        <p type="p">EC12:記憶體電路系統</p>
        <p type="p">EC13:電路板</p>
        <p type="p">EC14:系統匯流排</p>
        <p type="p">EC31:處理器</p>
        <p type="p">EC32:記憶體電路系統</p>
        <p type="p">EC33:電路板</p>
        <p type="p">EC34:系統匯流排</p>
        <p type="p">EC41:處理器</p>
        <p type="p">EC42:記憶體電路系統</p>
        <p type="p">EC43:電路板</p>
        <p type="p">EC44:系統匯流排</p>
        <p type="p">SG11:第一無線信號</p>
        <p type="p">SG11A:第一配對開始信號</p>
        <p type="p">SG12:第二無線信號</p>
        <p type="p">SG12A:第二配對開始信號</p>
        <p type="p">SG13X:第三無線信號</p>
        <p type="p">SG13Y:第三無線信號</p>
        <p type="p">SG14X:第四無線信號</p>
        <p type="p">SG14Y:第四無線信號</p>
        <p type="p">SG31:第一配對需求信號</p>
        <p type="p">SG33:第一確認信號</p>
        <p type="p">SG41:第二配對需求信號</p>
        <p type="p">SG43:第二確認信號</p>
        <p type="p">SW1X:第一開關</p>
        <p type="p">SW1Y:第一開關</p>
        <p type="p">SW1Z:第二開關</p>
        <p type="p">U1X:第一使用者輸入</p>
        <p type="p">U1Z:第二使用者輸入</p>
        <p type="p">U3:第一額外使用者輸入</p>
        <p type="p">U4:第二額外使用者輸入</p>
        <p type="p">U5:重設輸入</p>
        <p type="p">U13X:第三使用者輸入</p>
        <p type="p">U13Y:第三使用者輸入</p>
        <p type="p">U14X:第四使用者輸入</p>
        <p type="p">U14Y:第四使用者輸入</p>
        <p type="p">WC1:無線通信器電路系統</p>
        <p type="p">WC3:第一額外無線通信器電路系統</p>
        <p type="p">WC4:第二額外無線通信器電路系統</p>
        <p type="p">WC11:第一無線通信器電路系統</p>
        <p type="p">WC12:第二無線通信器電路系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10033.JPG" file="ed10033.JPG" height="1106px" img-content="tif" inline="yes" orientation="portrait" width="792px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622464</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136468</doc-number>
          <kind></kind>
          <date>114/09/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01B11/30</main-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北村藤和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAMURA, FUJIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207474</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板資訊取得裝置及基板處理裝置</chinese-title>
        <english-title>SUBSTRATE INFORMATION ACQUISITION APPARATUS AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">基板資訊取得裝置(60)的光出射部(63)朝向基板(9)的上表面(91)出射光線，於上表面(91)上形成複數個光束點(S1)，而複數個光束點(S1)朝Y方向呈直線狀並排。手部移動機構掃描在基板(9)的上表面(91)上朝X方向之複數個光束點(S1)。反射光分歧部(64)使各光束點(S1)之反射光(R0)分歧成光路長互不相同之第1反射光(R1)及第2反射光(R2)。攝像裝置(66)將各光束點(S1)之第1反射光(R1)及第2反射光(R2)聚集而攝像。資訊取得部根據與掃描機構所進行之複數個光束點(S1)的掃描並行地由攝像裝置(66)所取得之複數個攝像圖像，而取得基板(9)的形狀資訊。藉此，其可簡化基板資訊取得裝置(60)之裝置構造，且高精度地取得基板(9)的形狀資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The light emitting part (63) of the substrate information acquiring apparatus (60) emits light toward the upper surface (91) of the substrate (9) and forms a plurality of beam spots (S1) arranged in a straight line in the Y direction on the upper surface (91). The hand movement mechanism scans the plurality of beam spots (S1) on the upper surface (91) of the substrate (9) in the X direction. The reflected light branching part (64) branches the reflected light (R0) at each beam spot (S1) into first reflected light (R1) and second reflected light (R2) having different optical path lengths. The imaging device (66) images the first reflected light (R1) and second reflected light (R2) at each beam spot (S1) together. The information acquiring part acquires information on the shape of the substrate (9) based on multiple images acquired by the imaging device (66) in parallel with scanning of multiple beam spots (S1) by the scanning mechanism. This makes it possible to accurately acquire information on the shape of the substrate (9) while simplifying the device structure of the substrate information acquiring apparatus (60).</p>
      </isu-abst>
      <representative-img>
        <p type="p">9:基板</p>
        <p type="p">22:中央機器人</p>
        <p type="p">60:基板資訊取得裝置</p>
        <p type="p">61:資訊取得頭部</p>
        <p type="p">63:光出射部</p>
        <p type="p">64:反射光分歧部</p>
        <p type="p">65:屏幕</p>
        <p type="p">66:攝像裝置</p>
        <p type="p">67:頭部蓋</p>
        <p type="p">91:上表面</p>
        <p type="p">221:搬送手部</p>
        <p type="p">641:半反射鏡</p>
        <p type="p">642:反射鏡</p>
        <p type="p">651:第1光點像</p>
        <p type="p">652:第2光點像</p>
        <p type="p">B1:光束</p>
        <p type="p">R0:反射光</p>
        <p type="p">R1:第1反射光</p>
        <p type="p">R2:第2反射光</p>
        <p type="p">S1:光束點</p>
        <p type="p">X、Y、Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.JPG" file="ed10025.JPG" height="638px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622334</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136479</doc-number>
          <kind></kind>
          <date>114/09/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">E03D9/08</main-classification>
        <further-classification edition="200601120251201B">E03D11/13</further-classification>
        <further-classification edition="200601120251201B">E03D11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下住空間股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC HOUSING SOLUTIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廣崎和也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIROSAKI, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古閑良一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOGA, RYOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207686</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>衛生清洗裝置</chinese-title>
        <english-title>SANITARY WASHING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種衛生清洗裝置，能夠以不使用泵之方式，選擇性且穩定地產生間歇性的水流、及混入了氣泡之連續的水流。衛生清洗裝置（1）的噴嘴（2），具備第一筒部（5）、第二筒部（6）、及蓋部（7）。第二筒部（6）的流入孔（61）與供氣孔（62），和第一筒部（5）與第二筒部（6）之間的間隙（21）連通。第一筒部（5）的流入孔（51）之剖面積，較其上側的內部空間之剖面積更小，且較蓋部（7）的通過孔（72）之剖面積更小。通過孔（72），越靠上側之部分則剖面積越大。衛生清洗裝置（1），藉由變更流入至流入孔（51、61）之流量比，而在「使連續的水流，以與通過孔（72）的內周面（720）之間形成有間隙的狀態噴吐出後，於空間中改變為間歇性的水流之第一狀態」與「使混入了氣泡之連續的水流以擴散至內周面（720）的狀態噴吐出之第二狀態」之間，將水流切換。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object is to provide a sanitary washing apparatus configured to selectively and stably generate the intermittent water stream and the continuous water stream including air bubbles mixed therein without using a pump. A nozzle (2) of a sanitary washing apparatus (1) includes a first cylindrical part (5), a second cylindrical part (6), and a lid part (7). The second cylindrical part (6) has an inflow hole (61) and an air supply hole (62) which are communicated with a gap (21) between the first cylindrical part (5) and the second cylindrical part (6). The first cylindrical part (5) has an inflow hole (51) having a sectional area smaller than a sectional area of an upper internal space above the inflow hole and smaller than a sectional area of a passage hole (72) of the lid part (7). The sectional area of the passage hole (72) of the lid part (7) increases upward. The sanitary washing apparatus (1) changes a flow ratio of inflow to the inflow holes (51, 61) and to switch the water stream between a first state where a continuous water stream changes to an intermittent water stream in a space after the continuous water stream passing through the through hole with a gap between the continuous water stream and an inner peripheral surface (720) of the passage hole (72) is discharged from the passage hole (72) and a second state where a continuous water stream including air bubble mixed therein and spreading to the inner peripheral surface (720) is discharged.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:噴嘴</p>
        <p type="p">21:第一間隙</p>
        <p type="p">22:第二間隙</p>
        <p type="p">5:第一筒部</p>
        <p type="p">50:中心軸</p>
        <p type="p">51:第一流入孔</p>
        <p type="p">52:上側之部分</p>
        <p type="p">6:第二筒部</p>
        <p type="p">60:中心軸</p>
        <p type="p">61:第二流入孔</p>
        <p type="p">62:供氣孔</p>
        <p type="p">7:蓋部</p>
        <p type="p">70:蓋部本體</p>
        <p type="p">71:筒部</p>
        <p type="p">72:通過孔</p>
        <p type="p">720:內周面</p>
        <p type="p">721:上端開口</p>
        <p type="p">722:下端開口</p>
        <p type="p">9:第二連接部</p>
        <p type="p">G1:長度</p>
        <p type="p">L1:內徑</p>
        <p type="p">L2:直徑</p>
        <p type="p">L3:直徑</p>
        <p type="p">S1:剖面積</p>
        <p type="p">S2:剖面積</p>
        <p type="p">S3:剖面積</p>
        <p type="p">S4:剖面積</p>
        <p type="p">W1:第一水</p>
        <p type="p">W2:第二水</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="1011px" img-content="tif" inline="yes" orientation="portrait" width="706px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621739</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136520</doc-number>
          <kind></kind>
          <date>114/09/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">A61K40/11</main-classification>
        <further-classification edition="202501120260302B">A61K40/22</further-classification>
        <further-classification edition="202501120260302B">A61K40/31</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">A61P25/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿迪維賈亞　班邦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADIWIJAYA, BAMBANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿瓦斯蒂　拉凱什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AWASTHI, RAKESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>培生　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEARSON, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯坦格爾　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STANGEL, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/698,888</doc-number>
          <date>20240925</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用表現ＣＤ１９　ＣＡＲ的細胞群體治療神經免疫疾病</chinese-title>
        <english-title>TREATMENT OF NEUROIMMUNE DISEASES USING A POPULATION OF CD19 CAR-EXPRESSING CELLS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了使用表現CD19 CAR的細胞群體（例如瑞達基奧侖賽）來治療神經免疫疾病或障礙之方法。還揭露了製備表現CD19 CAR的細胞群體之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides methods of using a population of CD19 CAR-expressing cells (for example, rapcabtagene autoleucel) for treating neuroimmune diseases or disorders. Also disclosed are methods of making a population of CD19 CAR-expressing cells.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="591px" img-content="tif" inline="yes" orientation="portrait" width="946px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621617</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136679</doc-number>
          <kind></kind>
          <date>114/09/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251217B">A47J31/42</main-classification>
        <further-classification edition="200601120251217B">A47J42/16</further-classification>
        <further-classification edition="200601120251217B">A47J42/20</further-classification>
        <further-classification edition="200601120251217B">A47J42/22</further-classification>
        <further-classification edition="200601120251217B">A47J42/26</further-classification>
        <further-classification edition="200601120251217B">A47J42/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大都娛樂股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAITO ENTERTAINMENT, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齋藤俊雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, TOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>織田精司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODA, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-200616</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-092960</doc-number>
          <date>20250603</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>咖啡機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種具備研磨咖啡豆之上刃與下刃之咖啡機，且縮短磨豆時間。下刃541於自貫通孔5310投入之咖啡豆落下之位置具備具有複數片葉片70B之葉輪70，葉輪70係藉由向與規定之旋轉方向相同之正旋轉方向旋轉，而將落下至下刃541之咖啡豆誘導至第二刃541b者，第二刃541b係位於較葉輪70外側者，複數片葉片70B各者係自葉輪70之內周側之上端部720向外側延伸，且將較上述上端部720下方之空間於周向上均等地區分者，第二刃541b係外周側較第二刃541b之內周側高者，複數片葉片各者皆為自上端部720相連之上表面70B3全部，高於第二刃541b之內周側與外周側之中間位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">70:葉輪</p>
        <p type="p">70B:葉片</p>
        <p type="p">70B1:連接面</p>
        <p type="p">70B2:立起面</p>
        <p type="p">70B3:上表面</p>
        <p type="p">71:本體部</p>
        <p type="p">701:第1葉片</p>
        <p type="p">702:第2葉片</p>
        <p type="p">703:第3葉片</p>
        <p type="p">710:中心孔</p>
        <p type="p">711:側面</p>
        <p type="p">712:底面</p>
        <p type="p">712o:外周緣</p>
        <p type="p">720:頂面(上端部)</p>
        <p type="p">731:第1區塊</p>
        <p type="p">732:第2區塊</p>
        <p type="p">733:第3區塊</p>
        <p type="p">Bd:下游側側面</p>
        <p type="p">Bdo:外側部分</p>
        <p type="p">Bt:厚度</p>
        <p type="p">Bu:上游側側面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="531px" img-content="tif" inline="yes" orientation="portrait" width="687px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623080</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136715</doc-number>
          <kind></kind>
          <date>114/09/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120260224B">H01M50/102</main-classification>
        <further-classification edition="200601120260224B">H01M10/38</further-classification>
        <further-classification edition="200601120260224B">C08L29/04</further-classification>
        <further-classification edition="200601120260224B">D01F6/30</further-classification>
        <further-classification edition="200601120260224B">D04H11/00</further-classification>
        <further-classification edition="201601120260224B">H01M8/083</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商可樂麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURARAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀越敬史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIKOSHI, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楠木敏道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUNOKI, TOSHIMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勝谷鄉史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATSUYA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴碧宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑美</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-165887</doc-number>
          <date>20240925</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鹼性電池用隔離材及其製造方法、以及鹼性電池</chinese-title>
        <english-title>ALKALINE BATTERY SEPARATOR AND METHOD FOR PRODUCING SAME, AND ALKALINE BATTERY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種保液狀態下的耐壓縮性優異同時壓迫時的保液性優異之鹼性電池用隔離材。前述鹼性電池用隔離材係包括不織布，該不織布包含耐鹼性纖維與聚乙烯醇系黏合纖維，耐鹼性纖維包含聚乙烯醇系纖維，該不織布經由碘染色後的聚乙烯醇系黏合纖維之纖維寬度為13至130μm。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is an alkaline battery separator excellent in resistance to compression in a liquid retention state as well as in liquid retentivity when pressed. The alkaline battery separator includes a nonwoven fabric containing alkaline-resistant fibers and polyvinyl alcohol-based binder fibers, wherein the alkaline-resistant fibers include polyvinyl alcohol-based fibers, and a fiber width of the polyvinyl alcohol-based binder fibers is 13 to 130 µm as measured after dyeing the nonwoven fabric with iodine.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622763</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136760</doc-number>
          <kind></kind>
          <date>114/09/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260228B">G06F15/80</main-classification>
        <further-classification edition="201801120260228B">G06F9/38</further-classification>
        <further-classification edition="201801120260228B">G06F8/41</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞對策與網路公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA SOLUTIONS AND NETWORKS OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博格斯　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BORGHS, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊瓦內斯庫　米哈艾拉　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIVANESCU, MIHAELA ANDREEA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RO</english-country>
              <english-address>RO</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>英國</country>
          <doc-number>2414194.7</doc-number>
          <date>20240927</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於平行處理多指令之處理器架構</chinese-title>
        <english-title>PROCESSOR ARCHITECTURE FOR PROCESSING MULTIPLE INSTRUCTIONS IN PARALLEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">處理器，包含：用於儲存指令的程式記憶體；適於將指令轉換成所對應之操作碼及賦能信號的解碼器；含有由指令槽組成的指令字組以用於將指令提供給解碼器的控制器；數個處理元件，各處理元件被組配來依據提供給所考量處理元件之輸入的操作碼而在時間槽當中操作，以對輸入資料元素施行數學運算並產生輸出資料元素，其中，經由一指令槽所提供的一指令識別要被使用來執行所考量指令的一或多個目標處理元件，該等賦能信號適於控制對處理元件的操作碼分派；適於在各時間槽將任一操作碼提供給任一處理元件且受組配成依據賦能信號受操作的互連電路。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processor comprising: a program memory for storing instructions; a decoder adapted to convert the instructions into respective operation codes and enable signals; a controller including an instruction word consisting of a plurality of instruction slots for providing the instructions to the decoder; a plurality of processing elements, each processing element being configured to operate during a time slot in accordance with an operation code provided to an input of the considered processing element so as to apply a mathematical operation to an input data element and generate an output data element, wherein an instruction provided via an instruction slot identifies one or more target processing elements to be used for executing the considered instruction, wherein the enable signals are adapted to control assignment of the operation codes to the processing elements; interconnection circuitry adapted to provide any of the operation codes to any of the processing elements at each time slot and configured to be operated in accordance with the enable signals.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:向量通道</p>
        <p type="p">120:程式記憶體</p>
        <p type="p">130:控制器</p>
        <p type="p">131,132,133,134:指令槽</p>
        <p type="p">135:提取單元</p>
        <p type="p">140:解碼器</p>
        <p type="p">141,142,143,144:解碼器槽</p>
        <p type="p">150:互連電路</p>
        <p type="p">1000:處理器</p>
        <p type="p">EN1,EN2,EN3,EN4:賦能信號</p>
        <p type="p">OP1,OP2,OP3,OP4:操作碼</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="731px" img-content="tif" inline="yes" orientation="portrait" width="1021px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621785</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136780</doc-number>
          <kind></kind>
          <date>114/09/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">B01D53/48</main-classification>
        <further-classification edition="200601120260226B">B01D53/78</further-classification>
        <further-classification edition="200601120260226B">B01D47/00</further-classification>
        <further-classification edition="200601120260226B">C01B17/02</further-classification>
        <further-classification edition="200601120260226B">B65D90/24</further-classification>
        <further-classification edition="200601120260226B">F17C3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY DEVELOPMENT COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟凡飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴金玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>花瑞銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>高雄市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024113315573</doc-number>
          <date>20240924</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>液硫儲運廢氣處理系統及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及液硫儲運廢氣治理技術領域，公開了一種液硫儲運廢氣處理系統及方法。通過對廢氣進行洗滌並對洗滌出的硫磺塊進行液下粉碎，可以在回收硫磺的同時避免在輸送過程中堵塞管線，而且廢氣經洗滌後產生的廢氣會變為常溫氣體，利於廢氣的增壓輸送，在將廢氣增壓輸送至製硫反應爐的助燃風管線時，由於硫蒸氣已被充分洗滌回收，因此能夠避免高溫含硫蒸氣與常溫助燃空氣混合凝固成硫磺固體而堵塞管道和機泵；通過對來自洗滌塔的漿液進行過濾，將過濾出的硫磺顆粒濾餅排入設置在液硫供給管線與液硫儲運設備之間的儲硫器中，可以利用來自液硫供給管線的進料液硫將儲硫器中的濾餅一同輸送至液硫儲運設備，從而實現廢氣中硫磺資源的就地回用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:液硫供給管線</p>
        <p type="p">2:廢氣收集管線</p>
        <p type="p">3:洗滌塔</p>
        <p type="p">4:漿液輸送泵</p>
        <p type="p">5:第一過濾器</p>
        <p type="p">6:第二過濾器</p>
        <p type="p">7:中間罐</p>
        <p type="p">8:循環泵</p>
        <p type="p">9:引風設備</p>
        <p type="p">10:廢氣排放管線</p>
        <p type="p">11:廢氣吹掃管線</p>
        <p type="p">12:惰性氣體吹掃管線</p>
        <p type="p">13:液硫進料管線</p>
        <p type="p">14:伴熱設施</p>
        <p type="p">15:液硫儲運設備</p>
        <p type="p">16:排液管線</p>
        <p type="p">17:儲硫器</p>
        <p type="p">18:補液管線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="633px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623390</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136792</doc-number>
          <kind></kind>
          <date>114/09/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/47</main-classification>
        <further-classification edition="202501120260302B">H10D62/852</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>超赫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ULTRABAND TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳展興</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, CHAN-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/699,227</doc-number>
          <date>20240926</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置及其製造方法。該半導體裝置包括：一基板，其係一n+型摻雜之碳化矽基板、一n型摻雜之碳化矽基板或一p型摻雜之碳化矽基板；一緩衝層，設置於該基板上方，且該緩衝層包含經摻雜之氮化鎵，並具有一崩潰電場大於等於80 V/μm；一主動區域，設置於該緩衝層上方，其包括：一通道層，其包含未摻雜或非故意摻雜之氮化鎵；一阻障層，設置於該通道層上方，其包含未摻雜或非故意摻雜之氮化鋁鎵；一源極、一閘極及一汲極，設置於該主動區域上方，且該閘極設置於該源極及該汲極之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a semiconductor device and a method for manufacturing the same. The semiconductor device comprises: a substrate, which is an n⁺-type doped silicon carbide substrate, an n-type doped silicon carbide substrate, or a p-type doped silicon carbide substrate; a buffer layer disposed over the substrate, wherein the buffer layer comprises doped gallium nitride and having a breakdown electric field greater than or equal to 80 V/μm; and an active region disposed over the buffer layer, wherein the active region comprises: a channel layer comprising undoped or unintentionally doped gallium nitride; a barrier layer disposed over the channel layer, wherein the barrier layer comprises undoped or unintentionally doped aluminum gallium nitride; and a source electrode, a gate electrode, and a drain electrode disposed over the active region, wherein the gate electrode is disposed between the source electrode and the drain electrode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100~S106:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="731px" img-content="tif" inline="yes" orientation="portrait" width="545px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621662</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136845</doc-number>
          <kind></kind>
          <date>114/09/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260129B">A61H23/02</main-classification>
        <further-classification edition="200601120260129B">A61H39/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧績技研有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OG WELLNESS TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤伸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真梶優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINKAJI, MASARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>久住芳男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSUMI, YOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205759</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>手持件以及衝擊波裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種在輸出衝擊波時不易搖擺、能夠穩定保持的手持件，以及具備此種手持件的衝擊波裝置。其具有治療者握持的握把部2、在握把部2的上端部2a附近朝前方設置且在前端部配置對被治療者施加衝擊波的施加器5的本體部3、以及設置在握把部2，藉由握持握把部2狀態的手進行操作的觸發開關4，在握把部2的後面且包含本體部3的軸心線C上的位置，形成朝前方彎曲的彎曲部2b。X軸是沿著前後方向的座標軸，箭頭指示的方向為前方，相反方向為後方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:手持件</p>
        <p type="p">2:握把部</p>
        <p type="p">2a:上端部(凸部)</p>
        <p type="p">2b:彎曲部</p>
        <p type="p">3:本體部</p>
        <p type="p">3a:大直徑部</p>
        <p type="p">4:觸發開關</p>
        <p type="p">5:施加器</p>
        <p type="p">6:輸出調整開關(輸出調整部)</p>
        <p type="p">7:電線連接部</p>
        <p type="p">8:握把部與本體部的連接部分</p>
        <p type="p">A-A:線</p>
        <p type="p">C:軸心線</p>
        <p type="p">D:箭頭</p>
        <p type="p">H:高度</p>
        <p type="p">L:直徑</p>
        <p type="p">X、Y、Z:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="674px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621745</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136864</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120260302B">A61K47/68</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商四川科倫博泰生物醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SICHUAN KELUN-BIOTECH BIOPHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉心怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XINYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣　家驊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JIAHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李如玉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, RUYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>譚　向陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, XIANGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛均友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, JUNYON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024113693401</doc-number>
          <date>20240929</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024118902653</doc-number>
          <date>20241220</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025113521363</doc-number>
          <date>20250922</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>抗體或者抗體藥物偶聯物與其他治療劑的組合的應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">抗體藥物偶聯物與其他治療劑在製備治療腫瘤或癌症的藥物中的用途；該其他治療劑選自抗EGFR抗體及VEGF抗體中的一種或兩種以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202621836</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136870</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
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        <main-classification edition="201401120260226B">B23K26/70</main-classification>
        <further-classification edition="202501120260226B">B23K37/00</further-classification>
        <further-classification edition="200601120260226B">B23Q11/10</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克羅謝爾　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KROSCHEL, ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡卡爾　阿曼　辛格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKAR, AMAN SINGH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奎斯特　丹尼斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUEST, DENNIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉柏森　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GILBERTSON, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伯格　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BURGER, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊尼　馬汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REINIG, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基德羅斯基　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIEDROWSKI, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛拉夫　烏利希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAF, ULRICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>102024209373.4</doc-number>
          <date>20240927</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於處理電化學電池用基板的處理裝置以及用於處理電化學電池用基板的方法</chinese-title>
        <english-title>MACHINING DEVICE FOR MACHINING A SUBSTRATE FOR AN ELECTROCHEMICAL CELL, AND METHOD FOR MACHINING A SUBSTRATE FOR AN ELECTROCHEMICAL CELL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於處理電化學電池用基板（12）之處理裝置（10），以及一種用於藉助於此類處理裝置（10）來處理電化學電池用基板（12）之方法。提出了藉助於液槽（18）冷卻該基板（12），尤其主動地冷卻該基板（12）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a machining device (10) for machining a substrate (12) for an electrochemical cell, and to a method for machining a substrate (12) for an electrochemical cell by means of such a machining device (10). It is proposed to cool the substrate (12), in particular actively, by means of a liquid bath (18).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:處理裝置</p>
        <p type="p">12:基板</p>
        <p type="p">14:處理單元</p>
        <p type="p">16:固持器</p>
        <p type="p">18:液槽</p>
        <p type="p">22:第一部分</p>
        <p type="p">24:第二部分</p>
        <p type="p">26:表面</p>
        <p type="p">28:雷射脈衝</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="589px" img-content="tif" inline="yes" orientation="portrait" width="560px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622118</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136898</doc-number>
          <kind></kind>
          <date>110/03/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61P27/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商建南德克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENENTECH, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴　民宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, MINHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　穀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, GU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿嘉爾　尼古拉斯　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGARD, NICHOLAS JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪卡拉　丹尼爾　馬利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DICARA, DANIELLE MARIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀斯　菲利浦　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASS, PHILIP E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杭　綺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANG, JULIE Q.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>康斯坦丁　艾林　Ｌ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHRISTENSEN, ERIN L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>摩斯　羅伯特　保羅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORSE, ROBERT PAUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩諾瓦爾　莎拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANOWAR, SARAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>習瓦　維塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIVVA, VITTAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/993,930</doc-number>
          <date>20200324</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/046,318</doc-number>
          <date>20200630</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>TIE2　結合劑及其使用方法</chinese-title>
        <english-title>TIE2-BINDING AGENTS AND METHODS OF USE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供 Tie-2 抗體及其片段與共軛物以及其使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides Tie-2 antibodies and fragments thereof and conjugates and methods of using the same.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10088.JPG" file="ed10088.JPG" height="562px" img-content="tif" inline="yes" orientation="portrait" width="708px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623644</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136909</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/40</main-classification>
        <further-classification edition="202601120260302B">H10W40/10</further-classification>
        <further-classification edition="202601120260302B">H10W40/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷斯堤格　艾巴斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RASTEGAR, ABBAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/960,809</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於處理系統、腔室之冷卻配置以及修飾基板溫度分佈的相關方法</chinese-title>
        <english-title>COOLING ARRANGEMENTS FOR PROCESSING SYSTEMS, CHAMBERS, AND RELATED METHODS TO MODIFY SUBSTRATE TEMPERATURE PROFILES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種適用於半導體製造的處理系統，包括腔室。該腔室包括腔室主體，至少部分定義了內部空間，內部空間中設有一或多個視窗、至少部分位於內部空間中的基板支撐、一或多個可加熱內部空間的熱源，以及一或多個冷卻通道。這些冷卻通道至少部分延伸於一或多個熱源與一或多個視窗之間。這些冷卻通道能夠流動冷卻流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processing system applicable for use in semiconductor manufacturing, including a chamber. The chamber including a chamber body at least partially defining an internal volume, one or more windows disposed in the internal volume, a substrate support at least partially disposed in the internal volume, one or more heat sources operable to heat the internal volume, and one or more cooling channels. The one or more cooling channels extend at least partially between the one or more heat sources and the one or more windows. The one or more cooling channels are operable to flow a cooling fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:腔室</p>
        <p type="p">143:冷卻系統</p>
        <p type="p">144:控制器</p>
        <p type="p">200:預熱環</p>
        <p type="p">202:基板</p>
        <p type="p">203:中心軸</p>
        <p type="p">204:第二根軸</p>
        <p type="p">206:基板支撐</p>
        <p type="p">207:升舉銷孔</p>
        <p type="p">208:上視窗</p>
        <p type="p">209:襯墊</p>
        <p type="p">210:視窗</p>
        <p type="p">212:流動模組</p>
        <p type="p">213:襯墊</p>
        <p type="p">214:氣體進口</p>
        <p type="p">216:氣體排氣出口</p>
        <p type="p">218:軸</p>
        <p type="p">221:運動組件</p>
        <p type="p">222:上襯墊</p>
        <p type="p">223:支撐面</p>
        <p type="p">225:反應器部分</p>
        <p type="p">232:升舉銷</p>
        <p type="p">234:升舉銷停止塊</p>
        <p type="p">236:製程空間</p>
        <p type="p">238:淨化空間</p>
        <p type="p">241:熱源</p>
        <p type="p">243:熱源</p>
        <p type="p">244:加熱器</p>
        <p type="p">245:熱源模組</p>
        <p type="p">248:體</p>
        <p type="p">250:頂表面</p>
        <p type="p">251:製程氣體源</p>
        <p type="p">252:地板</p>
        <p type="p">253:清洗氣體源</p>
        <p type="p">254:蓋子</p>
        <p type="p">255:上熱源模組</p>
        <p type="p">256:上體</p>
        <p type="p">257:排氣泵</p>
        <p type="p">262:淨化氣體源</p>
        <p type="p">264:淨化氣體進口</p>
        <p type="p">270:通道</p>
        <p type="p">271:通道</p>
        <p type="p">272:供應管線</p>
        <p type="p">273:回流管線</p>
        <p type="p">274:貯槽儲存槽</p>
        <p type="p">275:質量流量控制</p>
        <p type="p">276:壓力控制閥</p>
        <p type="p">278:排氣系統</p>
        <p type="p">279:中心軸</p>
        <p type="p">282:感測器</p>
        <p type="p">290:感測器</p>
        <p type="p">291:感測器</p>
        <p type="p">P1:製程氣體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="763px" img-content="tif" inline="yes" orientation="portrait" width="1106px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621991</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136912</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">C01F11/18</main-classification>
        <further-classification edition="200601120260223B">B01J20/04</further-classification>
        <further-classification edition="200601120260223B">B01D53/74</further-classification>
        <further-classification edition="200601120260223B">C04B18/10</further-classification>
        <further-classification edition="202201120260223B">B09B3/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商神島化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONOSHIMA CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松井誠二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUI, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里村秀昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATOMURA, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>内田悠斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, YUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-194001</doc-number>
          <date>20241105</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含CaO組成物、鈣系碳酸化合物之製造方法、鈣系碳酸化合物、無機質成形體及提升無機質成形體之CO2固定化率之方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明提供一種能夠抑制對於環境之負荷，有效率地進行碳酸化反應之含CaO組成物、使用上述含CaO組成物之鈣系碳酸化合物之製造方法、鈣系碳酸化合物、無機質成形體及提升無機質成形體之CO&lt;sub&gt;2&lt;/sub&gt;固定化率之方法。  &lt;br/&gt;[解決手段]本發明之含CaO組成物之游離CaO之含有率為15質量%以上且未達50質量%，SiO&lt;sub&gt;2&lt;/sub&gt;之含有率為5質量%以上且50質量%以下，Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;之含有率為1質量%以上且20質量%以下，Fe&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;之含有率為0.5質量%以上且15質量%以下，藉由雷射繞射法測得之平均粒徑為1 μm以上且50 μm以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無 </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="516px" img-content="tif" inline="yes" orientation="portrait" width="606px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622695</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114136986</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251028B">G06F1/20</main-classification>
        <further-classification edition="200601120251028B">F28F11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童凱煬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, KAI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳虹汝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>液冷組件</chinese-title>
        <english-title>LIQUID COOLING ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種液冷組件，包含一液體輸送件及一吸液材。液體輸送件包含一殼體、一入液接頭及至少一出液接頭，入液接頭及至少一出液接頭設置於殼體。吸液材設置於殼體並對應於入液接頭及至少一出液接頭。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid cooling assembly includes a liquid delivering component and an absorbent material. The liquid delivering component includes a casing, an inlet joint and at least one outlet joint. The inlet joint and the at least one outlet joint are disposed on the casing. The absorbent material is disposed on the casing and corresponds to the inlet joint and the at least one outlet joint.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:液冷組件</p>
        <p type="p">10a:液體輸送件</p>
        <p type="p">11a:殼體</p>
        <p type="p">13a:出液接頭</p>
        <p type="p">20a:吸液材</p>
        <p type="p">22a:第二吸收部</p>
        <p type="p">50a:第二漏液偵測件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="697px" img-content="tif" inline="yes" orientation="portrait" width="859px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622105</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137007</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K14/56</main-classification>
        <further-classification edition="200601120260302B">C12N15/19</further-classification>
        <further-classification edition="200601120260302B">C12N15/85</further-classification>
        <further-classification edition="200601120260302B">C12P21/04</further-classification>
        <further-classification edition="200601120260302B">A61K38/21</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藥華醫藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHARMAESSENTIA CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　國鐘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, KO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許明彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, MING-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡有癸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, YU-KUEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尤儀德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YO, YI-TE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊景光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, JIING-GUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李欣潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SHIN-JYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/709,808</doc-number>
          <date>20241021</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>干擾素α　2b具其修飾序列之混合物</chinese-title>
        <english-title>MIXTURE OF INTERFERON ALPHA 2B WITH MODIFIED SEQUENCES THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種組合物及製造並產生此組合物之新方法，該組合物包括具有經修飾Nle取代之經修飾干擾素α 2b、位置45處之Gly經取代為Asp及/或位置66處之Asn經取代為Lys取代之經修飾干擾素α 2b，及/或其混合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition and a new method of manufacturing and producing such composition including modified interferon alpha 2 b with modified Nle substituted, Gly at position 45 substituted to Asp and/or Asn at position 66 substituted to Lys substituted modified interferon alpha 2 b, and/or a mixture thereof is disclosed herein.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="541px" img-content="tif" inline="yes" orientation="portrait" width="708px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622772</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137011</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120251103B">G06F16/90</main-classification>
        <further-classification edition="201901120251103B">G06F16/907</further-classification>
        <further-classification edition="201901120251103B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孵大股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>X-UNIV. CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝昆霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, KUN-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃維嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WEI-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳致浤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/726423</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於知識管理的檢索擴增生成方法及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於知識管理的檢索擴增生成方法，包含有由一處理單元將一第一提示詞輸入一第一大型語言模型，輸出一問題描述以及一關鍵字集；處理單元將問題描述與關鍵字集向量嵌入後，在一向量化知識資料庫中執行檢索；處理單元將問題描述、關鍵字集以及各知識內容片段輸入一排序模型，輸出一檢索結果清單；處理單元將一結構化框架輸入一第二大型語言模型，輸出一回應內容或至少一動態提示。藉此，透過第一大型語言模型、排序模型以及第二大型語言模型進行理解、篩選、組合和結構化，有效運用大型語言模型，同時保護資料機密性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:用於知識管理的檢索擴增生成方法</p>
        <p type="p">S10、S20、S30、S40:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="817px" img-content="tif" inline="yes" orientation="portrait" width="714px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623202</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137026</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260221B">H03H7/42</main-classification>
        <further-classification edition="200601120260221B">H01P1/18</further-classification>
        <further-classification edition="200601120260221B">H01F19/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＪＣＥＴ　星科金朋韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JCET STATS CHIPPAC KOREA LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳智馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, JIHYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金明基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MYUNGKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/962,190</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及製作具有改良共模拒斥比的平衡不平衡轉換器之方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD OF MAKING A BALUN WITH AN IMPROVED COMMON-MODE REJECTION RATIO</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電子裝置具有第一變壓器及第二變壓器。該第一變壓器之第一線圈透過互連傳輸線耦接至該第二變壓器之第一線圈。相位補償傳輸線耦接至該第一變壓器之第二線圈。該相位補償傳輸線經組態以與該互連傳輸線之阻抗匹配。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device has a first transformer and a second transformer. A first coil of the first transformer is coupled to a first coil of the second transformer through an interconnection transmission line. A phase-compensation transmission line is coupled to a second coil of the first transformer. The phase-compensation transmission line is configured to match an impedance of the interconnection transmission line.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3b:圖</p>
        <p type="p">3c:圖</p>
        <p type="p">3d:圖</p>
        <p type="p">150:平衡不平衡轉換器</p>
        <p type="p">152:第一層/頂部層/頂部裝置層</p>
        <p type="p">154:第二層/裝置層/第二裝置層</p>
        <p type="p">156:第三層/裝置層</p>
        <p type="p">158:第四層/裝置層</p>
        <p type="p">160:第五層/裝置層</p>
        <p type="p">162:第六層/裝置層</p>
        <p type="p">164:第七層/裝置層</p>
        <p type="p">170:第八層/裝置層/層</p>
        <p type="p">172:第九層/裝置層/層</p>
        <p type="p">174:第十層/裝置層/層</p>
        <p type="p">176:第十一層/底部層/底部裝置層</p>
        <p type="p">181:端子/外部電極</p>
        <p type="p">182:端子/外部電極</p>
        <p type="p">183:端子/外部電極</p>
        <p type="p">184:端子/外部電極</p>
        <p type="p">185:端子/外部電極</p>
        <p type="p">186:端子/外部電極</p>
        <p type="p">190:導電層</p>
        <p type="p">200:導電層</p>
        <p type="p">210:導電層</p>
        <p type="p">220:導電層</p>
        <p type="p">230:導電層</p>
        <p type="p">240:導電層</p>
        <p type="p">250:導電層</p>
        <p type="p">260:導電層</p>
        <p type="p">270:導電層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="979px" img-content="tif" inline="yes" orientation="portrait" width="769px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623657</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137055</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/20</main-classification>
        <further-classification edition="202601120260302B">H10W70/656</further-classification>
        <further-classification edition="202601120260302B">H10W72/29</further-classification>
        <further-classification edition="202601120260302B">H10W90/10</further-classification>
        <further-classification edition="202601120260302B">H05K1/181</further-classification>
        <further-classification edition="200601120260302B">H05K3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商哈納米克羅恩公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANA MICRON INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張湧圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, YONG GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張商圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SANG GYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張柱煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, JU HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0140702</doc-number>
          <date>20241015</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝體及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種半導體封裝體，其包括：一基板，其包括一第一增層(build-up)基板層與一第二增層基板層，所述第二增層基板層係由所述第一增層基板層之上表面中之至少一部分積層者；一個以上之連接構造體，配置於所述第一增層基板層上；及複數個半導體晶片，配置於所述第二增層基板層及所述連接構造體之上部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝體</p>
        <p type="p">110:基板、印刷電路基板</p>
        <p type="p">111:第一增層基板層</p>
        <p type="p">112:第二增層基板層</p>
        <p type="p">115:連接焊墊</p>
        <p type="p">120:連接構造體</p>
        <p type="p">130:模塑構件</p>
        <p type="p">140:加強板</p>
        <p type="p">150:半導體晶片</p>
        <p type="p">160:外部連接構件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="488px" img-content="tif" inline="yes" orientation="portrait" width="905px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622623</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137063</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202101120251128B">G03B17/02</main-classification>
        <further-classification edition="202101120251128B">G03B17/12</further-classification>
        <further-classification edition="202101120251128B">G02B7/02</further-classification>
        <further-classification edition="202101120251128B">G03B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴載然</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JAE YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175247</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鏡筒及具有此鏡筒的相機模組</chinese-title>
        <english-title>LENS BARREL AND CAMERA MODULE HAVING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供相機模組及鏡筒。相機模組包括：鏡筒主體，經配置以在其中容納一或多個透鏡並且包括在徑向方向上延伸的凸緣；夾具，經配置以耦合到凸緣；以及外殼，經配置以耦合到夾具。相機模組在鏡筒和外殼之間牢固地耦合，並且凸緣由與夾具的材料不同的材料形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera module and a lens barrel are provided. The camera module includes a barrel body configured to accommodate one or more lenses therein and including a flange that extends in a radial direction; a clamp configured to be coupled to the flange; and a housing configured to be coupled to the clamp. The camera module is firmly coupled between the lens barrel and the housing, and the flange is formed of a material that is different from a material of the clamp.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鏡筒</p>
        <p type="p">110:鏡筒主體</p>
        <p type="p">112:容納空間</p>
        <p type="p">182,184:螺紋</p>
        <p type="p">200:凸緣</p>
        <p type="p">210:外圓周表面</p>
        <p type="p">212:第一外圓周部分</p>
        <p type="p">214:第二外圓周部分</p>
        <p type="p">320:突出部</p>
        <p type="p">300:夾具</p>
        <p type="p">310:內圓周表面</p>
        <p type="p">330:肋條</p>
        <p type="p">C:光軸</p>
        <p type="p">d,RC1,RC2,RC3,RF1,RF2:距離</p>
        <p type="p">t:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="643px" img-content="tif" inline="yes" orientation="portrait" width="664px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622047</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137094</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D249/18</main-classification>
        <further-classification edition="200601120260302B">A61K31/4192</further-classification>
        <further-classification edition="200601120260302B">A61P31/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊斯特生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIGHTEST BIOMEDICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊佳昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHIA-SHIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佑俞</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/698,660</doc-number>
          <date>20240925</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於治療細菌感染的化合物</chinese-title>
        <english-title>COMPOUND FOR TREATING BACTERIAL INFECTIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本內容公開了一種含有LB001的組合物及其用於治療細菌感染的用途。具體而言，本發明涉及式(I)所示化合物或其藥學上可接受的鹽在增強抗生素抗菌作用中的用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The instant disclosure provides a composition containing LB001 and use of the composition for bacterial infections. In particular, the present disclosure relates to use of a compound represented by formula (I) or a pharmaceutically acceptable salt thereof in enhancing the antibacterial effect of antibiotics.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.JPG" file="ed10028.JPG" height="444px" img-content="tif" inline="yes" orientation="portrait" width="324px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621741</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137108</doc-number>
          <kind></kind>
          <date>114/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120260302B">A61K47/54</main-classification>
        <further-classification edition="200601120260302B">C07H15/04</further-classification>
        <further-classification edition="200601120260302B">A61K31/7028</further-classification>
        <further-classification edition="200601120260302B">A61K31/713</further-classification>
        <further-classification edition="200601120260302B">A61P1/16</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
        <further-classification edition="200601120260302B">A61P3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京悅康科創醫藥科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING YOUCARE KECHUANG PHARMACEUTICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃澤傲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZEAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋更申</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, GENGSHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田志康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, ZHIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳玉成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>付銳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FU, RUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411356805X</doc-number>
          <date>20240926</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含有核糖環或其衍生結構的GalNAc單體及其在小核酸藥物肝靶向遞送中的應用</chinese-title>
        <english-title>GALNAC MONOMER COMPRISING RIBOSE RING OR DERIVATIVE STRUCTURE THEREOF AND USE THEREOF IN LIVER-TARGETED DELIVERY OF SMALL NUCLEIC ACID DRUGS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種含有核糖環或其衍生結構的GalNAc單體及其在小核酸藥物肝靶向遞送中的應用。具體提供了一種式（I）化合物或其藥學上可接受的鹽。本發明提供的GalNAc化合物製備的GalNAc綴合的寡核苷酸，可實現高效的肝靶向遞送，提高了藥物療效。  &lt;br/&gt;&lt;img align="absmiddle" height="158px" width="252px" file="ed10073.JPG" alt="ed10073.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a GalNAc monomer comprising a ribose ring or a derivative structure thereof and use thereof in liver-targeted delivery of small nucleic acid drugs. Specifically, a compound of formula (I) or a pharmaceutically acceptable salt thereof is provided. The GalNAc-conjugated oligonucleotides prepared from the GalNAc compound provided by this invention can achieve highly efficient liver-targeted delivery, improving drug efficacy. &lt;br/&gt;&lt;img align="absmiddle" height="147px" width="252px" file="ed10074.JPG" alt="ed10074.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623262</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137202</doc-number>
          <kind></kind>
          <date>114/09/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260228B">H04N23/56</main-classification>
        <further-classification edition="200601120260228B">G01R19/165</further-classification>
        <further-classification edition="202001120260228B">H05B47/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商安訊士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AXIS AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛瑞　馬克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAWE, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳弈錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24209692.3</doc-number>
          <date>20241030</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有電流控制照明之影像擷取系統</chinese-title>
        <english-title>IMAGE-CAPTURING SYSTEM WITH CURRENT-CONTROLLED ILLUMINATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示係關於一種影像擷取系統(100)，其包括：一影像感測器(101)，其被組態成以一週期性速率擷取一場景之影像；一照明源(102)，其用於照明該場景；量測與控制電路系統(108)，其被組態成：連續地量測去往/來自該影像感測器(101)之一電流(200)；連續地偵測該所量測電流(200)之週期性交替之高位準及低位準(202；203)；且控制該照明源(102)以與該所量測電流(200)之該等所偵測到之週期性交替之高位準及低位準(202；203)之一切換頻率相等之一照明頻率在一接通狀態與一關斷狀態之間交替，使得該照明源(102)在該影像感測器(101)之曝光期間處於該接通狀態。本揭示進一步係關於一種控制一照明源以在影像感測器曝光期間照明一場景之方法(300)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to an image-capturing system (100) comprising: an image sensor (101) configured to capture images of a scene at a periodic rate; an illumination source (102) for illuminating the scene; measurement and control circuitry (108) configured to: continuously measure a current (200) to/from the image sensor (101); continuously detect periodically alternating high and low levels (202; 203) of the measured current (200); and control the illumination source (102) to alternate between an on state and an off state with an illumination frequency equal to a switching frequency of the detected periodically alternating high and low levels (202; 203) of the measured current (200) such that the illumination source (102) is in the on state during exposure of the image sensor (101). The disclosure further relates to a method (300) of controlling an illumination source for illuminating a scene during image sensor exposures.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:方法</p>
        <p type="p">301:步驟</p>
        <p type="p">302:步驟</p>
        <p type="p">303:步驟</p>
        <p type="p">304:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="647px" img-content="tif" inline="yes" orientation="portrait" width="652px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622216</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137220</doc-number>
          <kind></kind>
          <date>114/09/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K13/06</main-classification>
        <further-classification edition="202601120260302B">H10P50/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜恩杜拉基斯　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOUNDOULAKIS, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>里皮　史帝芬　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIPPY, STEVEN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/700,608</doc-number>
          <date>20240927</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>選擇性蝕刻抑制劑化合物及相關方法</chinese-title>
        <english-title>SELECTIVE ETCH INHIBITOR COMPOUNDS AND RELATED METHODS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供選擇性蝕刻抑制劑化合物及相關方法。方法包括獲得包含抑制劑化合物之組合物；及自包含氮化矽之結構選擇性蝕刻氮化矽。組合物包含磷酸化合物、矽酸烷基銨化合物及基於該組合物之總重量計1重量%至25重量%抑制劑化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Selective etch inhibitor compounds and related methods are provided. A method comprises obtaining a composition comprising an inhibitor compound; and selectively etching silicon nitride from a structure comprising silicon nitride. A composition comprises a phosphoric acid compound, an alkyl ammonium silicate compound, and 1% to 25% by weight of an inhibitor compound based on a total weight of the composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10050.JPG" file="ed10050.JPG" height="511px" img-content="tif" inline="yes" orientation="portrait" width="769px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622101</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137272</doc-number>
          <kind></kind>
          <date>114/09/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K7/08</main-classification>
        <further-classification edition="200601120260302B">A61K38/10</further-classification>
        <further-classification edition="201701120260302B">A61K47/54</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">A61P17/02</further-classification>
        <further-classification edition="200601120260302B">A61P7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商肽夢想股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEPTIDREAM INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木芳典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, YOSHINORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤田翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWADA, SHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本田尚三</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONDA, SHOZO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴田憲宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBATA, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松井克磨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUI, KATSUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWABARA, MOTOI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-169014</doc-number>
          <date>20240927</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>胜肽、胜肽複合體、細胞培養用組成物、醫療用組成物、診斷用組成物、研究用組成物、以及胜肽複合體之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種胜肽，係含有式A1所示之胺基酸序列、或在式A1所示之胺基酸序列中之1個以上之胺基酸殘基經取代、缺失、附加或插入而成之胺基酸序列。&lt;br/&gt;  A1：X1-X2-X3-X4-X5-X6-X7-X8-X9-X10-X11-X12-X13-X14-X15</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621727</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137327</doc-number>
          <kind></kind>
          <date>114/09/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K39/108</main-classification>
        <further-classification edition="200601120260302B">A61K9/00</further-classification>
        <further-classification edition="200601120260302B">A61P11/06</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>昱厚生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVAGENE BIOPHARMA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭漢彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, HAN-PIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐悠深</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-SHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張銘一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, MING-I</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃一旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, YI-SHIUH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚金梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/704,305</doc-number>
          <date>20241007</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用用於黏膜投與之組合物減輕嗜酸性白血球驅動之發炎的方法</chinese-title>
        <english-title>METHOD FOR ATTENUATING EOSINOPHILS-DRIVEN INFLAMMATION USING A COMPOSITION FOR MUCOSAL ADMINISTRATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於治療患有諸如重度氣喘的嗜酸性白血球相關發炎之個體的方法，其包含向該個體投與治療有效量之包含去毒大腸桿菌不穩定毒素(LT)之組合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method for treating a subject having eosinophil-associated inflammation, such as severe asthma, comprising administering to the subject a therapeutically effective amount of a composition comprising detoxified&lt;i&gt; Escherichia coli&lt;/i&gt; labile toxin (LT).</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="476px" img-content="tif" inline="yes" orientation="portrait" width="576px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622719</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114137337</doc-number>
          <kind></kind>
          <date>114/09/26</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120251201B">G06F3/044</main-classification>
        <further-classification edition="201601120251201B">G09G3/32</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金塤培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HOON-BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孔南容</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GONG, NAMYONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成撤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNG-CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
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          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金善燁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUN-YEOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
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          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜成珍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, SUNG-JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鍾成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JONGSUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0170704</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示設備</chinese-title>
        <english-title>DISPLAY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示設備包含：顯示面板，包含多個像素驅動電路；觸控面板，配置於顯示面板上；以及觸控輔助線，配置於顯示面板或觸控面板處。觸控面板包含第一至第n（n為大於或等於4之自然數）觸控驅動線，及第一至第m（m為大於或等於4之自然數）觸控感測線，該些觸控感測線被配置為與該第一至第n觸控驅動線之相鄰觸控驅動線形成互電容。觸控輔助線與第一至第n觸控驅動線之每一者之一端間隔開，且被配置為與第一至第m觸控感測線中之至少一些形成互電容。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display apparatus is capable of improving touch sensitivity at an edge portion of a screen. The display apparatus can include a display panel having a plurality of pixel driving circuits, a touch panel configured on the display panel, and a touch auxiliary line configured at the display panel or the touch panel. The touch panel comprises first to nth touch driving lines, and first to mth touch sensing lines configured to form a mutual capacitance with adjacent touch driving lines of the first to nth touch driving lines, where n and m are each a natural number equal to or greater than 4. The touch auxiliary line is spaced apart from an end of each of the first to nth touch driving lines and is configured to form the mutual capacitance with at least some of the first to mth touch sensing lines.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示面板</p>
        <p type="p">120:覆蓋構件</p>
        <p type="p">180:偏光層</p>
        <p type="p">185:第二黏著層</p>
        <p type="p">190:支撐基板</p>
        <p type="p">200:觸控面板</p>
        <p type="p">310:可撓性電路板</p>
        <p type="p">330:印刷電路板</p>
        <p type="p">331:孔</p>
        <p type="p">400:觸控輔助線</p>
        <p type="p">1000:顯示設備</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="810px" img-content="tif" inline="yes" orientation="portrait" width="766px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621720</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137422</doc-number>
          <kind></kind>
          <date>114/09/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K38/06</main-classification>
        <further-classification edition="200601120260302B">A61K36/28</further-classification>
        <further-classification edition="200601120260302B">A61K36/752</further-classification>
        <further-classification edition="200601120260302B">A61K36/63</further-classification>
        <further-classification edition="200601120260302B">A61P39/06</further-classification>
        <further-classification edition="200601120260302B">A61K8/64</further-classification>
        <further-classification edition="200601120260302B">A61Q19/08</further-classification>
        <further-classification edition="201601120260302B">A23L33/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱商事生命科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI CORPORATION LIFE SCIENCES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金田知美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEDA, TOMOMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福留瑞葵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUDOME, MIZUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>打田慶明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UCHIDA, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐久間絢子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKUMA, AYAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-167921</doc-number>
          <date>20240926</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含有穀胱甘肽和多酚類的抗氧化組成物</chinese-title>
        <english-title>ANTIOXIDANT COMPOSITION CONTAINING GLUTATHIONE AND POLYPHENOLS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提供一種與穀胱甘肽單獨相比展現優異的抗氧化能力的抗氧化組成物、及該抗氧化組成物的製造方法、以及增強穀胱甘肽的抗氧化能力的方法。其藉由組合穀胱甘肽與多酚類，能提供一種與分別單獨相比具有優異的抗氧化能力的抗氧化組成物。此外，藉由使穀胱甘肽與多酚類共存，以增強穀胱甘肽的抗氧化能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the present invention is to provide an antioxidant composition exhibiting excellent antioxidant ability as compared with glutathione alone, a method for producing the antioxidant composition, and a method for enhancing the antioxidant ability of glutathione. To provide an antioxidant composition having excellent antioxidant ability as compared with each alone by combining glutathione and polyphenols. In addition, the antioxidant ability of glutathione can be enhanced by allowing glutathione and polyphenols to coexist.</p>
      </isu-abst>
      <representative-img>
        <p type="p">（無）</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623227</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137554</doc-number>
          <kind></kind>
          <date>114/09/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">H04L25/02</main-classification>
        <further-classification edition="201501120251103B">H04B17/309</further-classification>
        <further-classification edition="200601120251103B">H04L5/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞昱半導體股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REALTEK SEMICONDUCTOR CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭紹余</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, SHAU-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林哲毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, JHE-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, YI-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳德政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DER-ZHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,548</doc-number>
          <date>20241117</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/726,244</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>通訊裝置</chinese-title>
        <english-title>COMMUNICATION APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種通訊裝置，包括第一傳送訊號處理電路、第一接收訊號處理電路、基頻訊號處理電路以及控制單元。第一傳送訊號處理電路在感測模式下被啟用，並且在無線通訊環境內傳送第一射頻訊號。第一射頻訊號包含一既定封包。第一接收訊號處理電路在感測模式下被啟用，並且接收第二射頻訊號。第二射頻訊號包含源自於既定封包的一第一封包。基頻訊號處理電路根據一位元串流資料產生提供給第一傳送訊號處理電路的既定封包，並且從第一接收訊號處理電路接收第一封包，其中基頻訊號處理電路更根據第一封包執行通道估計以產生一通道資訊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A communication apparatus includes a first transmitting signal processing circuit, a first receiving signal processing circuit, a baseband signal processing circuit and a control unit. The first transmitting signal processing circuit is enabled in a sensing mode and transmits a first radio frequency signal in a wireless communication environment. The first radio frequency signal comprises a predetermined packet. The first receiving signal processing circuit is enabled in the sensing mode and receives a second radio frequency signal. The second radio frequency signal comprises a first packet originated from the predetermined packet. The baseband signal processing circuit generates the predetermined packet to be provided to the first transmitting signal processing circuit according to bit stream data, and receives the first packet from the first receiving signal processing circuit. The baseband signal processing circuit further performs channel estimation according to the first packet to generate channel information.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:通訊裝置</p>
        <p type="p">110:傳送訊號處理電路</p>
        <p type="p">120:接收訊號處理電路</p>
        <p type="p">130:基頻訊號處理電路</p>
        <p type="p">131:調變電路</p>
        <p type="p">132,133:轉換電路</p>
        <p type="p">134:通道估計裝置</p>
        <p type="p">140:控制單元</p>
        <p type="p">150:數位至類比轉換器</p>
        <p type="p">160:類比至數位轉換器</p>
        <p type="p">Ant_A,Ant_B:天線</p>
        <p type="p">CSI:通道狀態資訊</p>
        <p type="p">Ctrl_BB,Ctrl_Tx,Ctrl_Rx:控制訊號</p>
        <p type="p">Target_1,Target_2:目標物件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="706px" img-content="tif" inline="yes" orientation="portrait" width="1117px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622462</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137572</doc-number>
          <kind></kind>
          <date>114/09/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G01B11/255</main-classification>
        <further-classification edition="200601120260224B">G01B11/16</further-classification>
        <further-classification edition="200601120260224B">G01B11/24</further-classification>
        <further-classification edition="200601120260224B">G01D5/353</further-classification>
        <further-classification edition="200601120260224B">H01B11/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商古河電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>忠隈昌輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADAKUMA, MASATERU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩倉大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAKURA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新子谷悦宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARASHITANI, YOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-170877</doc-number>
          <date>20240930</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>纜線之形狀感測系統以及電力纜線</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">纜線之形狀感測系統，包括：光纖纜線，具有包含多條光纖的光纖帶式芯線、以及具有沿長度方向形成並以撚繞方式形成的槽構件；前述光纖帶式芯線收容於前述槽內；應變測量裝置，用於測量前述光纖帶式芯線所包含的前述多條光纖中，位於寬度方向中心的1條光纖或位於寬度方向上相對於中心對稱位置的2條光纖，在長度方向各位置的應變量；以及，計算裝置，基於前述測量得的應變量，計算前述光纖纜線在長度方向各位置的曲率半徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:光纖纜線</p>
        <p type="p">11:纜線主體</p>
        <p type="p">12:輸入端部</p>
        <p type="p">13:遠端部</p>
        <p type="p">20:應變測量裝置</p>
        <p type="p">30:計算裝置</p>
        <p type="p">40:連接光纖</p>
        <p type="p">100:形狀感測系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10077.JPG" file="ed10077.JPG" height="457px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623491</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137583</doc-number>
          <kind></kind>
          <date>114/09/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120251114B">H10K50/80</main-classification>
        <further-classification edition="202301120251114B">H10K50/81</further-classification>
        <further-classification edition="202301120251114B">H10K50/814</further-classification>
        <further-classification edition="202301120251114B">H10K59/131</further-classification>
        <further-classification edition="202301120251114B">H10K59/38</further-classification>
        <further-classification edition="202301120251114B">H10K59/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金東律</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONGYUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜昌憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, CHANGHEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓鍾賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JONG-HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭聖雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, SEONGWOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174087</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置及顯示面板</chinese-title>
        <english-title>DISPLAY DEVICE AND DISPLAY PANEL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種顯示裝置及顯示面板。該顯示裝置可包含：基板，其中限定有多個子像素及多個假像素；陽極，設置於基板並被設置為對應於該些子像素之每一者；假陽極，設置於基板上並被設置為上以對應於該些假像素之每一者；輔助電極，設置於假陽極下方且電性連接至假陽極；堤岸，覆蓋陽極之邊緣以限定開口區域；陰極，設置於陽極及假陽極上；封裝層，其位於陰極上；多個彩色濾光器，設置於封裝層上且對應於該些子像素及該些假像素；及黑色矩陣，其插置於該些彩色濾光器之相鄰彩的色濾光器之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a display device and a display panel. The display device may include a substrate in which a plurality of sub pixels and a plurality of dummy pixels are defined; an anode which is disposed on the substrate and is disposed so as to correspond to each of the plurality of sub pixels; a dummy anode which is disposed on the substrate and is disposed so as to correspond to each of the plurality of dummy pixels; an auxiliary electrode which is disposed below the dummy anode and is electrically connected to the dummy anode; a bank which covers an edge of the anode to define an open area; a cathode disposed on the anode and the dummy anode; an encapsulation layer on the cathode; a plurality of color filters which is disposed on the encapsulation layer and corresponds to the plurality of sub pixels and the plurality of dummy pixels; and a black matrix interposed between adjacent color filters of the plurality of color filters.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:基板</p>
        <p type="p">111:第一緩衝層</p>
        <p type="p">111a:多重緩衝層</p>
        <p type="p">111b:主動緩衝層</p>
        <p type="p">112a:第一閘極絕緣層</p>
        <p type="p">112b:第二閘極絕緣層</p>
        <p type="p">113a:第一層間絕緣層</p>
        <p type="p">113b:第二層間絕緣層</p>
        <p type="p">114:第二緩衝層</p>
        <p type="p">115:平坦化層</p>
        <p type="p">115a:第一平坦化層</p>
        <p type="p">115b:第二平坦化層</p>
        <p type="p">116:堤岸</p>
        <p type="p">125:金屬層</p>
        <p type="p">130:發光二極體</p>
        <p type="p">131:陽極</p>
        <p type="p">132:共同層</p>
        <p type="p">133:發光層</p>
        <p type="p">134:陰極</p>
        <p type="p">135:假陽極</p>
        <p type="p">140:封裝層</p>
        <p type="p">141:第一無機層</p>
        <p type="p">142:有機層</p>
        <p type="p">143:第二無機層</p>
        <p type="p">150:觸控感測器單元</p>
        <p type="p">151:觸控電極</p>
        <p type="p">152:觸控保護層</p>
        <p type="p">160:抗反射層</p>
        <p type="p">161:第三緩衝層</p>
        <p type="p">162a:第一彩色濾光器</p>
        <p type="p">162d:第四彩色濾光器</p>
        <p type="p">163:黑色矩陣</p>
        <p type="p">164:覆蓋層</p>
        <p type="p">A1:第一主動層</p>
        <p type="p">A2:第二主動層</p>
        <p type="p">AE:輔助電極</p>
        <p type="p">C1:第一電容器電極</p>
        <p type="p">C2:第二電容器電極</p>
        <p type="p">Cst:儲存電容器</p>
        <p type="p">CE1:第一連接電極</p>
        <p type="p">CE2:第二連接電極</p>
        <p type="p">D1:第一汲極電極</p>
        <p type="p">D2:第二汲極電極</p>
        <p type="p">DSP:假像素</p>
        <p type="p">G1:第一閘極電極</p>
        <p type="p">G2:第二閘極電極</p>
        <p type="p">S1:第一源極電極</p>
        <p type="p">S2:第二源極電極</p>
        <p type="p">SP1:第一子像素</p>
        <p type="p">T1:第一薄膜電晶體</p>
        <p type="p">T2:第二薄膜電晶體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="855px" img-content="tif" inline="yes" orientation="portrait" width="817px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621649</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137596</doc-number>
          <kind></kind>
          <date>114/09/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120260122B">A61B50/20</main-classification>
        <further-classification edition="200601120260122B">A61H9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧績技研有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OG WELLNESS TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤伸一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>真梶優</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINKAJI, MASARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205760</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>手持件的支撐台以及衝擊波裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠以幾乎相同姿勢放置衝擊波手持件的支撐台，以及具備所述支撐台的衝擊波裝置。支撐台4具有支撐手持件3的主體部9的主體部支撐4a，在主體部支撐4a的前端部，主體部支撐4a的底面設置有對應於手持件3的大直徑部9a的凹陷部4c。在主體部支撐4a設置移動防止部（先端凸部4d），用於防止放置在支撐台4上的手持件3向前方移動，手持件3的大直徑部9a位於主體部支撐4a的凹陷部4c。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:手持件</p>
        <p type="p">3a:電線連接部</p>
        <p type="p">4:支撐台</p>
        <p type="p">4a:主體部支撐</p>
        <p type="p">4a1:直線部分</p>
        <p type="p">4b1:脫落防止部件的先端部</p>
        <p type="p">4bL:脫落防止部件</p>
        <p type="p">4c:凹陷部</p>
        <p type="p">4d:先端凸部</p>
        <p type="p">4d1:傾斜面</p>
        <p type="p">4e:後方支撐部</p>
        <p type="p">4f:開口部</p>
        <p type="p">7:握把部</p>
        <p type="p">7a:上端部</p>
        <p type="p">8:施加器</p>
        <p type="p">8a:活塞</p>
        <p type="p">9:主體部</p>
        <p type="p">9a:大直徑部</p>
        <p type="p">9a1:擴大部</p>
        <p type="p">9a2:固定部</p>
        <p type="p">10:觸發開關</p>
        <p type="p">10a:軸</p>
        <p type="p">11:調整開關</p>
        <p type="p">F:箭頭</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="668px" img-content="tif" inline="yes" orientation="portrait" width="657px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621681</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137647</doc-number>
          <kind></kind>
          <date>114/09/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/4422</main-classification>
        <further-classification edition="200601120260302B">A61K31/4184</further-classification>
        <further-classification edition="200601120260302B">A61K31/407</further-classification>
        <further-classification edition="200601120260302B">A61K31/554</further-classification>
        <further-classification edition="200601120260302B">A61K31/34</further-classification>
        <further-classification edition="200601120260302B">A61K31/21</further-classification>
        <further-classification edition="200601120260302B">A61K31/517</further-classification>
        <further-classification edition="200601120260302B">A61K31/5575</further-classification>
        <further-classification edition="200601120260302B">A61K31/45</further-classification>
        <further-classification edition="200601120260302B">A61K31/27</further-classification>
        <further-classification edition="200601120260302B">A61K31/55</further-classification>
        <further-classification edition="200601120260302B">A61K31/41</further-classification>
        <further-classification edition="200601120260302B">A61K31/05</further-classification>
        <further-classification edition="200601120260302B">A61K31/506</further-classification>
        <further-classification edition="200601120260302B">A61P1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>學校法人東日本學園</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHOOL JURIDICAL PERSON HIGASHI-NIPPON-GAKUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷村明彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIMURA, AKIHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根津顯弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEZU, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-174117</doc-number>
          <date>20241003</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於促進唾液分泌之醫藥組成物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種局部投與至唾液腺用於促進唾液分泌之醫藥組成物，其含有血管擴張藥。醫藥組成物藉由投與至唾液腺，可促進唾液分泌，並可用於改善、預防或治療口乾症。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622162</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137719</doc-number>
          <kind></kind>
          <date>114/09/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08J5/18</main-classification>
        <further-classification edition="200601120260225B">B29C55/02</further-classification>
        <further-classification edition="200601120260225B">B32B27/34</further-classification>
        <further-classification edition="200601120260225B">G02B5/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尤尼吉可股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNITIKA LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤万琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中原純一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAHARA, JUN-ICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡部貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKABE, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-169734</doc-number>
          <date>20240930</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半芳香族聚醯胺膜及其製造方法</chinese-title>
        <english-title>SEMI-AROMATIC POLYAMIDE FILM AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種鬆弛量充分地小之半芳香族聚醯胺膜。  &lt;br/&gt;本發明之半芳香族聚醯胺膜係具有沿著MD方向之邊與沿著TD方向之邊之矩形的半芳香族聚醯胺膜，從下述式(1)所算出之折射率差n&lt;sub&gt;D&lt;/sub&gt;為-0.0010至0.0045，  &lt;br/&gt;折射率差n&lt;sub&gt;D&lt;/sub&gt;={(n&lt;sub&gt;C&lt;/sub&gt;-n&lt;sub&gt;L&lt;/sub&gt;)-(n&lt;sub&gt;C&lt;/sub&gt;-n&lt;sub&gt;R&lt;/sub&gt;)}/2   (1)  &lt;br/&gt;式中，n&lt;sub&gt;C&lt;/sub&gt;為膜的中央部在MD方向上的折射率，n&lt;sub&gt;L&lt;/sub&gt;為相距於膜的左端部為膜寬的10%內側之位置在MD方向上的折射率，n&lt;sub&gt;R&lt;/sub&gt;為相距於膜的右端部為膜寬的10%內側之位置在MD方向上的折射率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a semi-aromatic polyamide film having a sufficiently small sagging amount. &lt;br/&gt;The semi-aromatic polyamide film of the present invention is a rectangular semi-aromatic polyamide film having sides along the MD direction and TD direction, wherein the refractive index difference n&lt;sub&gt;D&lt;/sub&gt; calculated from the following Formula (1) is from -0.0010 to 0.0045. &lt;br/&gt;refractive index difference n&lt;sub&gt;D&lt;/sub&gt;={(n&lt;sub&gt;C&lt;/sub&gt;-n&lt;sub&gt;L&lt;/sub&gt;)-(n&lt;sub&gt;C&lt;/sub&gt;-n&lt;sub&gt;R&lt;/sub&gt;)}/2 (1) &lt;br/&gt;Wherein n&lt;sub&gt;C&lt;/sub&gt; is the refractive index in the MD direction at the central part of the film; n&lt;sub&gt;L&lt;/sub&gt; is the refractive index in the MD direction at a position located inward from the left end of the film by 10% of the film width; and n&lt;sub&gt;R&lt;/sub&gt; is the refractive index in the MD direction at a position located inward from the right end of the film by 10% of the film width.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622945</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137749</doc-number>
          <kind></kind>
          <date>114/09/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120251114B">G09G3/32</main-classification>
        <further-classification edition="200601120251114B">G09G5/06</further-classification>
        <further-classification edition="200601120251114B">G09G5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商樂金顯示科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG DISPLAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金正謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUNG-GYUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0171492</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置及包含其之電子裝置</chinese-title>
        <english-title>DISPLAY DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種顯示裝置。此顯示裝置包含基於對應於使用者視線之輸入影像產生影像資料的時序控制器。顯示裝置更包含基於影像資料顯示影像的顯示面板。時序控制器包含接收對應於使用者視線之運動資訊並基於對應於使用者視線變化之運動資訊之變化及對應於使用者視線變化之輸入影像之變化來控制驅動模式的模式控制器。時序控制器更包含處理輸入影像的影像處理器。影像處理器中所包含之多個模組之至少一部分根據驅動模式而被停用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device includes a timing controller which generates image data based on an input image corresponding to a user’s gaze. The display device further includes a display panel which displays an image based on the image data. The timing controller includes a mode controller which receives motion information corresponding to the user’s gaze and controls a driving mode based on a variance of the motion information corresponding to the user’s gaze change and the variance of the input image. The timing controller further includes an image processor which processes the input image. At least a part of a plurality of modules included in the image processor is deactivated according to the driving mode.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">100:顯示裝置</p>
        <p type="p">110:時序控制器</p>
        <p type="p">111:影像處理器</p>
        <p type="p">120:閘極驅動器</p>
        <p type="p">130:資料驅動器</p>
        <p type="p">140:顯示面板</p>
        <p type="p">200:處理器</p>
        <p type="p">300:記憶體</p>
        <p type="p">400:供電單元</p>
        <p type="p">500:感測器</p>
        <p type="p">CS:輸入控制訊號</p>
        <p type="p">DATA:影像資料</p>
        <p type="p">DCS:資料控制訊號</p>
        <p type="p">DL:資料線</p>
        <p type="p">GCS:閘極控制訊號</p>
        <p type="p">GL:閘極線</p>
        <p type="p">MTD:運動資訊</p>
        <p type="p">RGB:輸入影像</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="701px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622788</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137774</doc-number>
          <kind></kind>
          <date>114/09/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120260302B">G06F30/20</main-classification>
        <further-classification edition="200601120260302B">G06F17/10</further-classification>
        <further-classification edition="202601120260302B">H10P74/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商出光興產股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDEMITSU KOSAN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口幸士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍間勇輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUMA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川嶋絵美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, EMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神谷利夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAMIYA, TOSHIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片瀬貴義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATASE, TAKAYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井手啓介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDE, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村睦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, MUTSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平松雅人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAMATSU, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-170926</doc-number>
          <date>20240930</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體之器件模擬方法及計算程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可更準確地計算各種氧化物半導體材料之遷移率之氧化物半導體之遷移率之計算方法。本發明係一種藉由電腦計算氧化物半導體之遷移率之方法，且包含如下步驟：使電腦執行以使用氧化物半導體中之自由載子濃度計算之2個以上之項，計算遷移率；2個以上之項係藉由基於氧化物半導體中之自由載子濃度而考慮產生並導出之散射模型、或基於遷移率及自由載子濃度之實測值而產生之回歸模型而計算。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623605</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137805</doc-number>
          <kind></kind>
          <date>114/10/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="200601120260302B">H01J37/28</further-classification>
        <further-classification edition="200601120260302B">H01J37/147</further-classification>
        <further-classification edition="200601120260302B">H01J37/10</further-classification>
        <further-classification edition="201801120260302B">G01N23/2251</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭＬ荷蘭公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASML NETHERLANDS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威蘭德　瑪寇　傑　加寇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIELAND, MARCO JAN-JACO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡亦強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24204241.4</doc-number>
          <date>20241002</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>帶電粒子光學裝置及評估方法</chinese-title>
        <english-title>CHARGED PARTICLE-OPTICAL DEVICE AND METHOD OF ASSESSING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種經組態以沿著各別射束路徑朝向一樣本表面引導複數個帶電粒子射束之帶電粒子光學裝置，該帶電粒子光學裝置包含：  &lt;br/&gt;一物鏡配置，其具有複數個電極板，該複數個電極板經配置以將該複數個帶電粒子射束以一柵格形式聚焦至該樣本表面上；以及  &lt;br/&gt;一偏轉器陣列，其相鄰於該複數個電極板中之一者而定位，其中該偏轉器陣列經組態以使該複數個帶電粒子射束中之一或多者偏轉，以使得該複數個帶電粒子射束中之至少一者相對於其最近的相鄰者具有一不同間距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A charged particle-optical device configured to direct a plurality of charged particle beams along respective beam paths towards a sample surface, the charged particle-optical device comprising: &lt;br/&gt;an objective lens arrangement having a plurality of electrode plates arranged to focus the plurality of charged particle beams onto the sample surface in a grid; and &lt;br/&gt;a deflector array located adjacent one of the plurality of electrode plates, wherein the deflector array is configured to deflect one or more of the plurality of charged particle beams so that at least one of the plurality of charged particle beams has a different pitch with respect to its nearest neighbors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">302:掃描區</p>
        <p type="p">304:偏轉範圍</p>
        <p type="p">305a:入射點</p>
        <p type="p">305b:入射點</p>
        <p type="p">305c:入射點</p>
        <p type="p">305d:入射點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="445px" img-content="tif" inline="yes" orientation="portrait" width="553px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622196</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137828</doc-number>
          <kind></kind>
          <date>114/10/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09G1/02</main-classification>
        <further-classification edition="200601120260302B">C09K3/14</further-classification>
        <further-classification edition="202601120260302B">H10P52/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊雨青</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YUQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞斯　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REISS, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納普頓　艾略特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KNAPTON, ELLIOT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/701,823</doc-number>
          <date>20241001</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含改質氧化矽磨料之化學機械拋光組合物</chinese-title>
        <english-title>CHEMICAL-MECHANICAL POLISHING COMPOSITION CONTAINING MODIFIED SILICA ABRASIVES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種化學機械拋光組合物，其包括：(a)膠體氧化矽顆粒，其中該等膠體氧化矽顆粒使用胺基矽烷化合物進行表面改質，且其中該等膠體氧化矽顆粒具有約6至約10之一等電點；(b)一緩衝劑；及(c)水，其中該拋光組合物具有約1至約6之一pH。本發明亦提供一種使用該組合物來化學機械拋光一基板之方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a chemical-mechanical polishing composition comprising: (a) colloidal silica particles, wherein the colloidal silica particles are surface-modified with an aminosilane compound, and wherein the colloidal silica particles have an isoelectric point of about 6 to about 10, (b) a buffering agent, and (c) water, wherein the polishing composition has a pH of about 1 to about 6. The invention also provides a method of chemically-mechanically polishing a substrate using said composition.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622013</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137881</doc-number>
          <kind></kind>
          <date>114/10/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C03C3/087</main-classification>
        <further-classification edition="200601120260302B">C03C3/091</further-classification>
        <further-classification edition="200601120260302B">C03C3/093</further-classification>
        <further-classification edition="200601120260302B">C03C3/097</further-classification>
        <further-classification edition="200601120260302B">C03C3/11</further-classification>
        <further-classification edition="200601120260302B">C03C15/00</further-classification>
        <further-classification edition="200601120260302B">C03C21/00</further-classification>
        <further-classification edition="202601120260302B">H10W70/692</further-classification>
        <further-classification edition="202601120260302B">H10W70/62</further-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格雷尼爾　傑森羅伊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRENIER, JASON ROY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯瑞許可夫　康士坦丁謝爾蓋耶維奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KORESHKOV, KONSTANTIN SERGEEVICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
              <english-address>RU</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藍伯森　里沙安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAMBERSON, LISA ANN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷奇　彼德約瑟夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEZZI, PETER JOSEPH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史喬特　羅伯特安東尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHAUT, ROBERT ANTHONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莎羅法　瑪莉亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEROVA, MARIIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
              <english-address>RU</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西古史凱伊　史坦尼拉芙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SIKULSKYI, STANISLAV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
              <english-address>UA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史密斯　尼可拉斯詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SMITH, NICHOLAS JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威勒　馬克歐恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WELLER, MARK OWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,186</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>強化玻璃基板及其玻璃組合物</chinese-title>
        <english-title>STRENGTHENED GLASS SUBSTRATES AND GLASS COMPOSITIONS THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種玻璃基板，其包括延伸穿過該玻璃基板之複數個玻璃穿孔，鄰近的玻璃穿孔以一最小平均距離D&lt;sub&gt;M&lt;/sub&gt;分離。該玻璃基板進一步包括一化學強化區，該化學強化區具有一層深度，使得該層深度自該玻璃基板之一表面延伸至該玻璃基板之一主體內的一距離，該化學強化區具有比該玻璃基板之一剩餘部分更高的一壓縮應力，其中該化學強化區之該層深度為該距離D&lt;sub&gt;M&lt;/sub&gt;之約30%或更小，且其中該玻璃基板之一組合物包含以下組分：約65.0 mol%至約85.0 mol%之SiO&lt;sub&gt;2&lt;/sub&gt;、約3.0 mol%至約15 mol%之Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;及約1.0 mol%至約5.0 mol%之Li&lt;sub&gt;2&lt;/sub&gt;O。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A glass substrate that includes a plurality of through-glass vias extending through the glass substrate, adjacent through-glass vias being separated by a minimum average distance D&lt;sub&gt;M&lt;/sub&gt;. The glass substrate further including a chemically strengthened region with a depth of layer such that the depth of layer extends from a surface of the glass substrate to a distance within a bulk of the glass substrate, the chemically strengthened region having a higher compressive stress than a remainder of the glass substrate, wherein the depth of layer of the chemically strengthened region is about 30% or less of the distance D&lt;sub&gt;M&lt;/sub&gt;, and wherein a composition of the glass substrate comprises the following components SiO&lt;sub&gt;2&lt;/sub&gt; from about 65.0 mol% to about 85.0 mol%, Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; from about 3.0 mol% to about 15 mol%, and Li&lt;sub&gt;2&lt;/sub&gt;O from about 1.0 mol% to about 5.0 mol%.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:玻璃中介層面板</p>
        <p type="p">12:分界線</p>
        <p type="p">20:玻璃基板</p>
        <p type="p">30:玻璃穿孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="491px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622098</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137912</doc-number>
          <kind></kind>
          <date>113/01/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C07F17/00</main-classification>
        <further-classification edition="200601120260224B">C07F5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商恩特葛瑞斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENTEGRIS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴拉桑堤蘭　瓦古萊簡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BALASANTHIRAN, VAGULEJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LK</english-country>
              <english-address>LK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭曼　史考特　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANEMAN, SCOTT A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳初梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/438,741</doc-number>
          <date>20230112</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>釔錯合物及相關方法</chinese-title>
        <english-title>YTTRIUM COMPLEXES AND RELATED METHODS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供釔錯合物及相關方法。一種製備釔錯合物之方法包括將金屬烷基環戊二烯基化合物與三鹵化釔化合物在非配位溶劑中接觸，以獲得參(烷基環戊二烯基)釔錯合物。一種組合物包括參(烷基環戊二烯基)釔錯合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Yttrium complexes and related methods are provided. A method for preparing a yttrium complex comprises contacting a metal alkylcyclopentadienyl compound and a yttrium trihalide compound in a non-coordinating solvent, so as to obtain a tris(alkylcyclopentadienyl)yttrium complex. A composition comprises a tris(alkylcyclopentadienyl)yttrium complex.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:步驟</p>
        <p type="p">104:步驟</p>
        <p type="p">106:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="789px" img-content="tif" inline="yes" orientation="portrait" width="718px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621620</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137929</doc-number>
          <kind></kind>
          <date>114/10/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">A47L11/24</main-classification>
        <further-classification edition="200601120260224B">A47L11/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東財</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONGJAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓昇佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, SEUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權賢重</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, HYEONJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0155543</doc-number>
          <date>20241105</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清掃機器人工作站及其控制方法</chinese-title>
        <english-title>STATION FOR ROBOT CLEANER AND CONTROL METHOD FOR STATION FOR ROBOT CLEANER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本發明一個實施方式的清掃機器人工作站包括：主體；第一供應流路；流量控制閥；以及加熱器。清掃機器人工作站進一步包括溫度感測器。在加熱器加熱第一供應流路中的水時，流量控制閥控制流過第一供應流路的水的流速，且因此，可控制所需的熱水溫度及/或蒸汽量。另外，在溫度感測器感測第一供應流路的溫度時可控制流量控制閥，且因此，可更精確地控制所需的熱水溫度及/或蒸汽量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A station for a robot cleaner according to one embodiment of the present disclosure includes a main body, a first supply flow path, a flow control valve, and a heater. The station for a robot cleaner further includes a temperature sensor. A flow rate of water moving through the first supply flow path is controlled by the flow control valve while the water in the first supply flow path is heated by the heater, and accordingly the temperature of hot water and/or the amount of steam required may be controlled. In addition, the flow control valve may be controlled while sensing the temperature of the first supply flow path by the temperature sensor, and accordingly the temperature of hot water and/or the amount of steam required may be controlled more accurately.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:清掃機器人工作站、工作站</p>
        <p type="p">3:清掃機器人</p>
        <p type="p">100:主體</p>
        <p type="p">115:噴射區域</p>
        <p type="p">117:第一回收流路</p>
        <p type="p">118:第二回收流路</p>
        <p type="p">131:供應流路</p>
        <p type="p">132:流路控制閥</p>
        <p type="p">132a:原水入口</p>
        <p type="p">132b:第一出口</p>
        <p type="p">132c:第二出口</p>
        <p type="p">133:第一供應流路</p>
        <p type="p">134:第二供應流路</p>
        <p type="p">135:水處理過濾器</p>
        <p type="p">136:流量控制閥</p>
        <p type="p">137:加熱器</p>
        <p type="p">138:溫度感測器</p>
        <p type="p">139:第二流路控制閥</p>
        <p type="p">141:球閥</p>
        <p type="p">142:減壓閥</p>
        <p type="p">143:流量感測器</p>
        <p type="p">145:清潔劑流路</p>
        <p type="p">146:清潔劑箱</p>
        <p type="p">147:清潔劑泵</p>
        <p type="p">151:排水流路</p>
        <p type="p">152:廢水箱</p>
        <p type="p">153:止回閥</p>
        <p type="p">154:第一空氣泵</p>
        <p type="p">155:空氣止回閥</p>
        <p type="p">156:第二空氣泵</p>
        <p type="p">157:止回閥</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="587px" img-content="tif" inline="yes" orientation="portrait" width="730px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623277</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137954</doc-number>
          <kind></kind>
          <date>114/10/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H04R9/06</main-classification>
        <further-classification edition="200601120260302B">H04R9/04</further-classification>
        <further-classification edition="200601120260302B">H04R9/02</further-classification>
        <further-classification edition="200601120260302B">H04R7/02</further-classification>
        <further-classification edition="202601120260302B">H04R1/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鐵三角有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUDIO-TECHNICA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉田康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIDA, KOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-172908</doc-number>
          <date>20241002</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電聲轉換器及頭戴式耳機</chinese-title>
        <english-title>ELECTROACOUSTIC TRANSDUCER AND HEADPHONES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於可維持穩定的性能。  &lt;br/&gt;本發明之電聲轉換器1，係將振動傳遞至人體者，該電聲轉換器1係包含：可動部10，係根據輸入的訊號而振動的；凝膠狀素材30，係與可動部連結；及固定部20，係具備供可動部的至少一部分插通的線圈21，並經由凝膠狀素材而與可動部連結。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention aims to maintain stable performance. &lt;br/&gt;An electroacoustic transducer 1 proposed as a solution in the present invention transmits vibrations to human body, and includes a movable part 10 that vibrates in response to an input signal, a gel-like material 30 connected to the movable part, and a coil 21 through which at least a portion of the movable part is inserted. The electroacoustic transducer further includes a fixed part 20 connected to the movable part via the gel-like material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:電聲轉換器</p>
        <p type="p">10:可動部</p>
        <p type="p">11:罩蓋軛鐵</p>
        <p type="p">12:磁體</p>
        <p type="p">13:中心軛鐵</p>
        <p type="p">20:固定部</p>
        <p type="p">21:線圈</p>
        <p type="p">22:單元基座</p>
        <p type="p">23:孔</p>
        <p type="p">30:凝膠狀素材</p>
        <p type="p">S:間隙</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="803px" img-content="tif" inline="yes" orientation="portrait" width="751px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623229</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137974</doc-number>
          <kind></kind>
          <date>114/10/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260228B">H04L25/49</main-classification>
        <further-classification edition="200601120260228B">H03K5/08</further-classification>
        <further-classification edition="200601120260228B">H03K5/24</further-classification>
        <further-classification edition="200601120260228B">G11C7/10</further-classification>
        <further-classification edition="200601120260228B">H04L25/03</further-classification>
        <further-classification edition="200601120260228B">H04L1/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　阿爾溫德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, ARVIND</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬希卡爾　馬赫什Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMASHIKAR, MAHESH K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納拉馬爾普　安基雷迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALAMALPU, ANKIREDDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/702,607</doc-number>
          <date>20241002</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/702,615</doc-number>
          <date>20241002</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>19/337,063</doc-number>
          <date>20250923</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體控制器及應用於記憶體控制器之方法</chinese-title>
        <english-title>MEMORY CONTROLLER WITH OVERSAMPLING MEMORY I/O</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">積體電路系統中的記憶體控制器包括一個接收器電路，該電路在時間和電壓上執行過取樣。接收器電路通過資料通道從記憶體模組接收一個以脈衝振幅調變（pulse amplitude modulation，簡稱 PAM）調製的資料訊號，該訊號具有N個訊號層級，N ＞ 2。接收器電路通過在一個單位時間間隔內的時間點序列中對資料訊號進行取樣來生成K個樣本。接收器電路使用R個電壓比較器模組從K個樣本中的同一個樣本生成R個訊號層級估計。電壓比較器模組將同一樣本與(N-1)個電壓閾值進行比較，這些閾值具有為不同電壓比較器模組配置的不同偏移量。接收器電路基於從K個樣本生成的所有訊號層級估計，識別該N個訊號層級中的一個資料訊號被映射到的訊號層級，並輸出對應於該識別的訊號層級的符號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory controller in an integrated circuit system includes a receiver circuit that performs oversampling in time and voltage. The receiver circuit receives a data signal modulated with pulse amplitude modulation (PAM) having N signal levels from a memory module over a data lane, N ＞ 2. The receiver circuit generates K samples by sampling the data signal at a sequence of time points in a unit time interval. The receiver circuit uses R voltage comparator blocks to generate R signal level estimates from the same sample out of the K samples. The voltage comparator blocks compare the same sample against (N-1) voltage thresholds with different offsets configured for different voltage comparator blocks. The receiver circuit identifies one of the N signal levels to which the data signal is mapped based on all signal level estimates generated from the K samples, and outputs a symbol corresponding to the identified signal level.</p>
      </isu-abst>
      <representative-img>
        <p type="p">310:比較器</p>
        <p type="p">340:訊號層級檢測器</p>
        <p type="p">330、330-1、330-2:電壓比較器模組</p>
        <p type="p">350:決策電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.bmp" file="ed10004.bmp" height="569px" img-content="tif" inline="yes" orientation="portrait" width="973px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621696</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114137995</doc-number>
          <kind></kind>
          <date>114/10/01</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/606</main-classification>
        <further-classification edition="200601120260302B">A61K47/38</further-classification>
        <further-classification edition="200601120260302B">A61K47/36</further-classification>
        <further-classification edition="200601120260302B">A61K47/32</further-classification>
        <further-classification edition="200601120260302B">A61K47/14</further-classification>
        <further-classification edition="200601120260302B">A61K47/26</further-classification>
        <further-classification edition="200601120260302B">A61K9/58</further-classification>
        <further-classification edition="200601120260302B">A61P1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾伸堂生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLY STONE HEALTHCARE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳宗忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, TSUNG-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳玉芝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡書慈</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳嘉敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/904,150</doc-number>
          <date>20241002</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>延遲釋放口服藥物組合物</chinese-title>
        <english-title>DELAYED RELEASE ORAL PHARMACEUTICAL COMPOSITION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在此揭示用以治療發炎性腸道疾病的組合物與方法。根據某些實施方式，所述組合物與方法涉及使用含有美沙拉嗪層、透明質酸層以及至少一包衣層的延遲釋放膠囊製劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are compositions and methods for the treatment of inflammatory bowel disease. According to some embodiments, the compositions and methods involve the use of a delayed-release capsule formulation containing a mesalamine layer, a hyaluronan layer, and at least one coating layer.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="561px" img-content="tif" inline="yes" orientation="portrait" width="769px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623325</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138025</doc-number>
          <kind></kind>
          <date>114/10/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H05K1/185</main-classification>
        <further-classification edition="200601120260302B">H05K3/28</further-classification>
        <further-classification edition="200601120260302B">H05K3/42</further-classification>
        <further-classification edition="202401120260302B">D06F39/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大江將司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OE, MASASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本忠彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, TADAHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小谷幸男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KODANI, YUKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>糀幸久</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOJI, YOSHIHISA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-209045</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>安裝基板、基板單元、衣物處理裝置及基板單元的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可以抑制灌封樹脂的使用量之安裝基板、基板單元、衣物處理裝置及基板單元的製造方法。安裝基板(103)設置複數個在板厚方向上從第1面貫通到第2面的貫通孔，在前述貫通孔的至少一部分安裝電子零件(104)，未安裝電子零件(104)的前述貫通孔被焊料(115)堵住。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">103:安裝基板</p>
        <p type="p">103A:零件面</p>
        <p type="p">113:通孔</p>
        <p type="p">115:焊料</p>
        <p type="p">120:基材</p>
        <p type="p">121:銅箔</p>
        <p type="p">123:阻劑</p>
        <p type="p">125:通孔鍍敷</p>
        <p type="p">127:焊盤</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="456px" img-content="tif" inline="yes" orientation="portrait" width="662px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622570</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138037</doc-number>
          <kind></kind>
          <date>114/10/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B6/42</main-classification>
        <further-classification edition="200601120260302B">H01R13/629</further-classification>
        <further-classification edition="200601120260302B">H01R13/642</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商莫仕有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOLEX, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾克哈特　安德魯　卡爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ECKHART, ANDREW KARL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫普林　伊戈爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUPRIN, IGOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克蘭茲　約書亞　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRANTZ, JOSHUA JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舒茲　湯瑪斯　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHILTZ, THOMAS D.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　文宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEN-ZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/705,498</doc-number>
          <date>20241009</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/779,822</doc-number>
          <date>20250328</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>線纜端光纖連接器組件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">說明線纜端光纖連接器組件的多個方面。一種示例線纜端光纖連接器組件包括：一光纜；一線纜端殼體，在所述光纜的一端部；以及一光纖插芯和一夾頭，位於所述殼體內。所述光纜的一光波導在所述殼體內延伸穿過所述夾頭並端接於所述光纖插芯。所述線纜端殼體包括一接口端，所述接口端包括一上壁、一下壁以及在所述上壁和所述下壁之間延伸的一對溝槽狀凹部。所述上壁的內表面包括在兩側的第一彎曲的表面和第二彎曲的表面。所述接口端還包括帶有彎曲的表面的第一、第二插芯保險桿。所述光纖插芯的外表面倚靠所述第一彎曲的保險桿表面和所述第二彎曲的保險桿表面，其中，所述光纖插芯以一對接角度倚靠在所述線纜端殼體內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:線纜端光纖連接器組件</p>
        <p type="p">12:互連適配器</p>
        <p type="p">20:線纜端殼體</p>
        <p type="p">20A:接口端</p>
        <p type="p">20B:線纜對接端</p>
        <p type="p">22:上壁</p>
        <p type="p">24:下壁</p>
        <p type="p">26A:溝槽狀凹部</p>
        <p type="p">26B:溝槽狀凹部</p>
        <p type="p">30:釋放套筒</p>
        <p type="p">40:光纜</p>
        <p type="p">50:光纖插芯</p>
        <p type="p">60:光波導帶</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="457px" img-content="tif" inline="yes" orientation="portrait" width="989px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622034</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138057</doc-number>
          <kind></kind>
          <date>114/10/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C07C43/12</main-classification>
        <further-classification edition="200601120260226B">C09K5/04</further-classification>
        <further-classification edition="200601120260226B">C10M131/10</further-classification>
        <further-classification edition="200601320260226B">C10N30/08</further-classification>
        <further-classification edition="200601320260226B">C10N40/30</further-classification>
        <further-classification edition="200601320260226B">C10N50/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大金工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAIKIN INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸本誠之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIMOTO, MASAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井岡和恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IOKA, KAZUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒木克親</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROKI, YOSHICHIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶山誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUYAMA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-174217</doc-number>
          <date>20241003</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含氟二醚之化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供一種新穎之含氟二醚之化合物。  &lt;br/&gt;　　作為解決手段，為提供一種下述式(1)表示之含氟二醚之化合物，  &lt;br/&gt;&lt;img align="absmiddle" height="130px" width="246px" file="ed10013.JPG" alt="ed10013.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;　　(式(1)中，R&lt;sub&gt;1&lt;/sub&gt;表示氟原子，或碳數1以上10以下之全氟烷基，  &lt;br/&gt;　　R&lt;sub&gt;2&lt;/sub&gt;相同或相異地表示甲基、乙基、-CH&lt;sub&gt;2&lt;/sub&gt;CF&lt;sub&gt;3&lt;/sub&gt;，或  &lt;br/&gt;-CH&lt;sub&gt;2&lt;/sub&gt;(C&lt;sub&gt;2&lt;/sub&gt;F&lt;sub&gt;4&lt;/sub&gt;)&lt;sub&gt;n&lt;/sub&gt;H，  &lt;br/&gt;　　n表示1以上且10以下之整數。)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622842</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138125</doc-number>
          <kind></kind>
          <date>114/10/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120251103B">G06Q20/40</main-classification>
        <further-classification edition="202301120251103B">G06F18/22</further-classification>
        <further-classification edition="202301120251103B">G06F18/23</further-classification>
        <further-classification edition="202301120251103B">G06N5/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國銀聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周京生</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡鵬飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章政</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>才華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖俊龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116518067</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>風險交易識別方法、裝置、電子設備、介質和程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種風險交易識別方法、裝置、電子設備、介質和程式產品，可用於資料處理領域；上述方法包括：獲取用戶方與商戶方之間的目標交易資訊，並獲取商戶方的第一基礎資訊以及用戶方的第二基礎資訊；根據目標交易資訊獲取風險要素特徵，並根據風險要素特徵確定目標群組對應的團隊特徵，目標群組包含用戶方以及商戶方中的至少一個；根據第一基礎資訊確定商戶方的第一推理特徵，並根據第二基礎資訊用戶方的第二推理特徵；根據風險要素特徵、團隊特徵、第一推理特徵以及第二推理特徵，確定用戶方與商戶方之間的交易風險參數，並根據交易風險參數，確定用戶方與商戶方是否存在交易風險。本發明中，提高了交易風險的判斷準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S201,S202,S203,S204:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="680px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622487</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138156</doc-number>
          <kind></kind>
          <date>114/10/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260228B">G01N21/64</main-classification>
        <further-classification edition="200601120260228B">G01N21/75</further-classification>
        <further-classification edition="200601120260228B">B32B15/02</further-classification>
        <further-classification edition="202201120260228B">B22F1/054</further-classification>
        <further-classification edition="201101120260228B">B82Y15/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福浦知浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUURA, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡晋太朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKA, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木下香織</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINOSHITA, KAORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-175291</doc-number>
          <date>20241004</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積層體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之積層體具備基板、形成於基板上之金屬系粒子集合體層、及形成於金屬系粒子集合體層上之保護層，金屬系粒子集合體層為將複數個金屬系粒子相互分開配置而成之層，複數個金屬系粒子之平均粒徑為200～1600 nm，平均高度為55～500 nm，且平均粒徑相對於平均高度之比為1～8，保護層滿足以下條件(1)及條件(2)之至少一者。  &lt;br/&gt;條件(1)：將保護層之平均挖掘速度設為K、標準平均挖掘速度設為Ks時，K相對於Ks之比(K/Ks)超過0且未達1。  &lt;br/&gt;條件(2)：將保護層之平均外插挖掘速度設為Kg、標準平均外插挖掘速度設為Kgs時，Kg相對於Kgs之比(Kg/Kgs)超過0且未達1。</p>
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        <p type="p">
        </p>
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        <p type="p">20:金屬系粒子集合體層</p>
        <p type="p">30:保護層</p>
        <p type="p">100:積層體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="337px" img-content="tif" inline="yes" orientation="portrait" width="615px">
          </img>
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          <kind></kind>
          <date>115/06/01</date>
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          <doc-number>114138166</doc-number>
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        <main-classification edition="201901120260226B">G06F1/3228</main-classification>
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        <further-classification edition="201601120260226B">G06F12/0871</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商記憶體科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEMORY TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>米立　齊莫　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MYLLY, KIMMO J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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            <addressbook>
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                <last-name>羅文妙</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          <country>美國</country>
          <doc-number>13/451,951</doc-number>
          <date>20120420</date>
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        <chinese-title>記憶體模組、在該記憶體模組中管理操作狀態資料的方法、及主機裝置</chinese-title>
        <english-title>MEMORY MODULE, METHOD FOR MANAGING OPERATIONAL STATE DATA IN SAID MEMORY MODULE, AND HOST DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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        <p type="p">本說明書及圖式提出了一種新的裝置及方法，用於在該記憶體模組的各種操作模式/情況與該主機系統記憶體之間，藉由記憶體模組控制器管理/配置存儲供操作該記憶體模組控制器之操作狀態資料到一延伸隨機存取記憶體內之儲存，該延伸隨機存取記憶體係包含在一記憶體模組內以及一主機裝置的主機系統記憶體內。基本上，該記憶體模組控制器係運作作為本文所述的資料傳送之主控制器。該操作狀態資料一般包括狀態資訊、一邏輯到實體(L2P)對映表及暫存器設定。</p>
      </isu-abst>
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        <p type="p">The specification and drawings present a new apparatus and method for managing/configuring by the memory module controller storing operational state data for operating the memory module controller into an extended random access memory comprised in a memory module and in a host system memory of a host device during various operational modes/conditions of the memory module and the host system memory. Essentially, the memory module controller operated as a master for the data transfers as described herein. The operational state data typically comprises state information, a logical to physical (L2P) mapping table and register settings.</p>
      </isu-abst>
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        <p type="p">10:主機系統或裝置</p>
        <p type="p">12:中央處理單元</p>
        <p type="p">14:隨機存取記憶體</p>
        <p type="p">16:大量儲存記憶體匯流排介面</p>
        <p type="p">17:內部匯流排</p>
        <p type="p">18:大量儲存記憶體匯流排</p>
        <p type="p">20:大量儲存記憶體</p>
        <p type="p">22:控制器</p>
        <p type="p">24:揮發性隨機存取記憶體</p>
        <p type="p">24A:元資料</p>
        <p type="p">26:非揮發性大量記憶體</p>
        <p type="p">26A:檔案系統</p>
        <p type="p">27:內部匯流排</p>
        <p type="p">28:大量儲存記憶體匯流排介面</p>
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          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="530px" img-content="tif" inline="yes" orientation="portrait" width="781px">
          </img>
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      <volno>24</volno>
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          <kind></kind>
          <date>115/06/01</date>
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        <further-classification edition="200601120260302B">C23C14/34</further-classification>
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              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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          </applicant>
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                <last-name>具　本雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOO, BON-WOONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>利坎斯奇　亞歷山大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIKHANSKII, ALEXANDRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>RU</english-country>
              <english-address>RU</english-address>
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              <chinese-name name-type="organization">
                <last-name>謝　澤仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, TSEH-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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                <last-name>斯特拉托蒂　葛雷哥里　Ｅ</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>STRATOTI, GREGORY E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>帕爾瑪　索拉布辛　迪帕克辛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARMAR, SAURABHSINH DIPAKSINH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
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              <chinese-name name-type="organization">
                <last-name>墨菲　保羅　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURPHY, PAUL J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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          </inventor>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          <agent rep-type="agent" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/719,866</doc-number>
          <date>20241113</date>
        </priority-claim>
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          <country>美國</country>
          <doc-number>18/999,759</doc-number>
          <date>20241223</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於光束線離子注入機的缺陷控制的光束調節</chinese-title>
        <english-title>BEAM CONDITIONING FOR DEFECT CONTROL IN BEAMLINE ION IMPLANTER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
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      <isu-abst lang="tw">
        <p type="p">一種減少束線離子植入裝置缺陷的方法。此方法可包括在使用包含第一離子物質的第一離子束對設置在離子植入裝置的束線的製程腔室中的基板組執行植入程序之後，執行額外程序：對束線的至少一部分執行束調節操作。束調節操作可能包括產生第二離子束並沿著傳播方向將第二離子束導向製程腔室，以及在製程腔室內沿掃描方向移動第二離子束，掃描方向相對於傳播方向成角度，其中製程腔室的目標區域被第二離子束撞擊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of reducing defects in a beamline ion implanter. The method may entail, after performing an implantation procedure on a set of substrates disposed in a process chamber of a beamline of the ion implanter, using a first ion beam comprising a first ion species, the additional procedure of: performing a beam conditioning operation of at least a portion of the beamline. The beam conditioning operation may include generating a second ion beam and conducting the second ion beam to the process chamber along a direction of propagation, and moving the second ion beam within the process chamber, in a sweep direction, at an angle with respect to the direction of propagation, wherein a targeted region of the process chamber is impacted by the second ion beam.</p>
      </isu-abst>
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        <p type="p">100:離子植入裝置</p>
        <p type="p">102:離子源</p>
        <p type="p">104:分析器</p>
        <p type="p">106:離子束</p>
        <p type="p">108:校正器</p>
        <p type="p">110:能量過濾器</p>
        <p type="p">112:終端站</p>
        <p type="p">114:束線組件</p>
        <p type="p">120:控制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="401px" img-content="tif" inline="yes" orientation="portrait" width="707px">
          </img>
        </representative>
      </representative-img>
    </description>
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          <doc-number>202623288</doc-number>
          <kind></kind>
          <date>115/06/01</date>
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        <document-id>
          <doc-number>114138246</doc-number>
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          <date>114/10/03</date>
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        <main-classification edition="200901120260228B">H04W24/02</main-classification>
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                <last-name>美商內數位專利控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTERDIGITAL PATENT HOLDINGS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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                <last-name>史塔斯尼克　麥克</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>STARSINIC, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>泰耶布　歐梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEYEB, OUMER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
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                <last-name>奧維拉　赫恩安德茨　烏利斯</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>OLVERA-HERNANDEZ, ULISES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>艾哈邁德　薩德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHMAD, SAAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米勒　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLER, JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佛迪　沙米爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FERDI, SAMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩勒特爾　基斯蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PELLETIER, GHYSLAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕尼　戴安娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANI, DIANA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿巴斯　泰穆爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABBAS, TAIMOOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛伊　米契爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROY, MICHEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡清福</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡馭理</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/703,018</doc-number>
          <date>20241003</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>經使用者平面支援WTRU資料收集之AI/ML框架</chinese-title>
        <english-title>AI/ML FRAMEWORK TO SUPPORT WTRU DATA COLLECTION OVER THE USER PLANE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">WTRU可接收DL-NAS訊息，DL-NAS訊息包括WTRU應建立PDU對話以用於資料收集目的的指示。WTRU可發送對DL-NAS訊息進行應答的UL NAS訊息。WTRU可發送NAS-MM訊息，NAS-MM訊息包括PDU對話建立請求以及PDU對話是用於資料收集的指示。WTRU可接收包括PDU對話建立接受訊息的RRC訊息。WTRU可收集資料且產生非結構化PDU，非結構化PDU包括表明酬載中的資料類型的第一部分、是序號的第二部分及/或攜帶所收集的資料的第三部分。WTRU可在PDU對話中發送非結構化PDU。RAN可接收用於PDU對話的PDU)對話建立接受訊息及用於PDU對話的N2訊息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A WTRU may receive a DL-NAS message that comprises an indication that the WTRU should establish a PDU session for the purpose of data collection. The WTRU may send a UL NAS message acknowledging the DL-NAS message. The WTRU may send a NAS-MM message that comprises a PDU session establishment request and an indication that the PDU Session is for data collection. The WTRU may receive an RRC Message that comprises a the PDU session establishment accept message. The WTRU may collect data and generate an unstructured PDU that comprises a first part indicating the type of data in the payload, a second part being a sequence number, and/or a third part which carries collected data. The WTRU may send the unstructured PDU in the PDU session. A RAN may receive a PDU) session establishment accept message for a PDU session and an N2 Message for the PDU Session.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500:程序</p>
        <p type="p">501:無線傳輸/接收單元(WTRU)</p>
        <p type="p">502、504、506、508、510、512、514、516、518、520、522、524、526、528、530:步驟</p>
        <p type="p">503:無線電存取網路(RAN)節點</p>
        <p type="p">505:存取與行動管理功能(AMF)</p>
        <p type="p">507:對話管理功能(SMF)</p>
        <p type="p">509:資料管理/統一資料儲存庫(UDM/UDR)</p>
        <p type="p">511:策略控制功能(PCF)</p>
        <p type="p">513:使用者平面功能(UPF)</p>
        <p type="p">515:資料收集伺服器功能(DCSF)</p>
        <p type="p">N2、N4:介面</p>
        <p type="p">PDU:封包資料單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="814px" img-content="tif" inline="yes" orientation="portrait" width="1099px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623702</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138253</doc-number>
          <kind></kind>
          <date>109/02/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W80/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="202601120260302B">H10W70/60</further-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/42</further-classification>
        <further-classification edition="202501120260302B">H10H29/02</further-classification>
        <further-classification edition="202501120260302B">H10H29/45</further-classification>
        <further-classification edition="202501120260302B">H10H20/857</further-classification>
        <further-classification edition="201601120260302B">G09G3/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商弗瑞爾公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUEREAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查吉　格拉姆瑞札</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAJI, GHOLAMREZA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法西　伊莎諾拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FATHI, EHSANOLLAH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維爾斯瑪　艾倫　丹尼爾　特倫特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIERSMA, AARON DANIEL TRENT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>訶元奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, WON KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/809,163</doc-number>
          <date>20190222</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>62/823,350</doc-number>
          <date>20190325</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>16/546,929</doc-number>
          <date>20190821</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>交錯及拼塊堆疊的微裝置整合及驅動</chinese-title>
        <english-title>STAGGERED AND TILE STACKED MICRODEVICE INTEGRATION AND DRIVING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示用於將微裝置整合至系統或接收器基板中之結構及方法。藉由在轉移之前或之後將分級墊添加至微裝置來促進微裝置之該整合。在將一第一微裝置轉移至一基板之後，創建級以用於該第一(或第二)微裝置轉移之後的微裝置轉移。該級改良該基板之表面輪廓，使得可轉移下一微裝置而該基板上之該第一微裝置不會被供體或轉移頭之表面損壞或干擾。一些實施例進一步係關於拼裝顯示裝置，且更特定言之係關於將拼塊堆疊至一背板以形成該拼裝顯示裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">What is disclosed is structures and methods to integrate microdevices into system or receiver substrates. The integration of microdevices is facilitated by adding staging pads to microdevices before or after transferring. Creating stages after the transfer of a first microdevice to a substrate for the subsequent microdevice transfer to the first (or the second) microdevice transfer. The stage improves the surface profile of the substrate so that next microdevice can be transferred without the first microdevice on the substrate get damaged by or interfere with the surface of the donor or transfer head. Some embodiments further relate to tiled display device and more particularly, to stacking tiles to a backplane to form the tiled display device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方塊圖/供體基板</p>
        <p type="p">104:供體基板</p>
        <p type="p">106:供體基板</p>
        <p type="p">108:轉移機構</p>
        <p type="p">110:系統基板/第一步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10055.JPG" file="ed10055.JPG" height="459px" img-content="tif" inline="yes" orientation="portrait" width="669px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623289</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138345</doc-number>
          <kind></kind>
          <date>114/10/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200901120260223B">H04W36/00</main-classification>
        <further-classification edition="200901120260223B">H04W36/30</further-classification>
        <further-classification edition="202401120260223B">H04W74/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克拉斯　阿勒姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHLASS, AHLEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩伊德哈桑　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAYED HASSAN, MOHAMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯斯凱拉　賈古　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSKELA, JARKKO TUOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/IB2024/059724</doc-number>
          <date>20241004</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具PRACH適應之條件式交遞</chinese-title>
        <english-title>CONDITIONAL HANDOVER WITH PRACH ADAPTATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供用於(例如，啟用/促進/實現)具PRACH適應(或換言之，額外PRACH資源)之條件式交遞的措施。舉例而言，此等措施可包含一使用者裝備為該使用者裝備自該使用者裝備之一伺服胞元至一條件式交遞之一候選目標胞元的該條件式交遞進行組配；以及獲得關於在該條件式交遞之該候選目標胞元處組配用於該條件式交遞的一或多個額外實體隨機存取通道PRACH資源之可用性的資訊</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There are provided measures for (e.g. enabling/facilitating/realizing) conditional handover with PRACH adaptation (or, stated differently, additional PRACH resources). Such measures may, for example, comprise that a user equipment configures for a conditional handover of the user equipment from a serving cell of the user equipment to a candidate target cell of the conditional handover, and obtains information about usability of one or more additional physical random access channel, PRACH, resources, which are configured at the candidate target cell of the conditional handover, for the conditional handover</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110,S120,S130,S140:步驟，操作，區塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="471px" img-content="tif" inline="yes" orientation="portrait" width="867px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623290</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138370</doc-number>
          <kind></kind>
          <date>114/10/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200901120260223B">H04W36/00</main-classification>
        <further-classification edition="200901120260223B">H04W36/30</further-classification>
        <further-classification edition="202401120260223B">H04W74/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芬蘭商諾基亞科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOKIA TECHNOLOGIES OY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克拉斯　阿勒姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHLASS, AHLEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩伊德哈桑　穆罕默德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAYED HASSAN, MOHAMAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯斯凱拉　賈古　Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSKELA, JARKKO TUOMO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24204731.4</doc-number>
          <date>20241004</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具PRACH適應之條件式交遞</chinese-title>
        <english-title>CONDITIONAL HANDOVER WITH PRACH ADAPTATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供用於(例如，啟用/促進/實現)具PRACH適應(或換言之，額外PRACH資源)之條件式交遞的措施。舉例而言，此等措施可包含一使用者裝備自該使用者裝備之一伺服胞元的一基地台接收用於該使用者裝備之一條件式交遞的一條件式交遞組配及在該條件式交遞之一候選目標胞元處的一或多個額外實體隨機存取通道PRACH資源之一資源組配的一指示；將該候選目標胞元識別為該條件式交遞之一目標胞元；以及將對通知在該候選目標胞元處組配之該一或多個額外PRACH資源之啟動的一請求傳輸至該使用者裝備之該伺服胞元的該基地台。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">There are provided measures for (e.g. enabling/facilitating/realizing) conditional handover with PRACH adaptation (or, stated differently, additional PRACH resources). Such measures may, for example, comprise that a user equipment receives, from a base station of a serving cell of the user equipment, a conditional handover configuration for a conditional handover of the user equipment and an indication of a resource configuration of one or more additional physical random access channel, PRACH, resources at a candidate target cell of the conditional handover, identifies the candidate target cell as a target cell of the conditional handover, and transmits, to the base station of the serving cell of the user equipment, a request for informing about activation of the one or more additional PRACH resources configured at the candidate target cell.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="770px" img-content="tif" inline="yes" orientation="portrait" width="1001px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621746</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138407</doc-number>
          <kind></kind>
          <date>107/09/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K48/00</main-classification>
        <further-classification edition="201501120260302B">A61K35/761</further-classification>
        <further-classification edition="200601120260302B">C12N15/86</further-classification>
        <further-classification edition="200601120260302B">C12N7/00</further-classification>
        <further-classification edition="201001120260302B">C12N15/113</further-classification>
        <further-classification edition="200601120260302B">A61P25/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商健臻公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENZYME CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧瑞沃丹　凱薩琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O'RIORDAN, CATHERINE R.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴勒莫　亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PALERMO, ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>理查德斯　布蘭達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RICHARDS, BRENDA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯坦尼克　莉莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STANEK, LISA M.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳彥希</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何愛文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/561,843</doc-number>
          <date>20170922</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>變體RNAi</chinese-title>
        <english-title>VARIANT RNAI</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供治療亨廷頓氏病的RNAi分子。本文還提供含有該RNAi的表現盒、載體(例如，rAAV、重組腺病毒、重組慢病毒和重組HSV載體)、細胞、病毒顆粒和藥物組合物。本文還提供了與使用該RNAi例如治療亨廷頓氏病相關的方法和套組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are RNAi molecules for treating Huntington’s disease. Further provided herein are expression cassettes, vectors (e.g., rAAV, recombinant adenoviral, recombinant lentiviral, and recombinant HSV vectors), cells, viral particles, and pharmaceutical compositions containing the RNAi. Yet further provided herein are methods and kits related to the use of the RNAi, for example, to treat Huntington’s disease.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621627</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138413</doc-number>
          <kind></kind>
          <date>114/10/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260130B">A47L11/40</main-classification>
        <further-classification edition="200601120260130B">A47L11/24</further-classification>
        <further-classification edition="200601120260130B">A47L9/28</further-classification>
        <further-classification edition="200601120260130B">D06F29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＧ電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LG ELECTRONICS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李國行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KOOKHAENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳廷玩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, JUNGWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金成埈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUNGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯德銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0166127</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清掃機器人</chinese-title>
        <english-title>ROBOT CLEANER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種清掃機器人，其中，用於清掃的流體被供應到可根據需要進行旋轉和垂直移動的拖布。根據本發明的一態樣，清掃機器人包括：主體；拖布部件，具有安裝在主體下側的拖布，拖布配置為繞著縱向的拖布旋轉軸旋轉；以及流體供應部件，其配置為向拖布部件供應流體。拖布部件包含：拖布盤，其上安裝有拖布，拖布盤配置為繞著拖布旋轉軸旋轉，以允許流體流入，並透過形成在拖布旋轉軸中的第一流動路徑向拖布供應流體；以及支座，安裝為在拖布盤旋轉時被限制為不旋轉，該支座配置為將第一流動路徑與流體供應部件連接，並透過沿橫向形成的第二流動路徑向拖布盤供應流體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a robot cleaner, in which a fluid for cleaning is supplied to a mop that performs rotation and vertical movement as needed. According to an aspect of the present disclosure, a robot cleaner includes: a main body; a mop part having a mop installed on a lower side of the main body and configured to rotate about a longitudinal mop rotation shaft; and a fluid supply part configured to supply a fluid to the mop part. The mop part includes: a mop plate on which the mop is installed, the mop plate being configured to rotate about the mop rotation shaft, to allow an inflow of fluid, and to supply the fluid to the mop through a first flow path formed in the mop rotation shaft; and a holder installed to be restricted from rotating when the mop plate rotates, the holder being configured to connect the first flow path and the fluid supply part and to supply the fluid to the mop plate through a second flow path formed along a lateral direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:清掃機器人</p>
        <p type="p">100:主體</p>
        <p type="p">110:緩衝器</p>
        <p type="p">700,710:拖布</p>
        <p type="p">730:拖布盤</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="425px" img-content="tif" inline="yes" orientation="portrait" width="758px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622550</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138424</doc-number>
          <kind></kind>
          <date>114/10/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251128B">G02B5/04</main-classification>
        <further-classification edition="200601120251128B">G02B3/10</further-classification>
        <further-classification edition="202101120251128B">G03B30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大立光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LARGAN PRECISION CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范丞緯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, CHEN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥盉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YO HIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程俊嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, JYUN-JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,653</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>成像鏡頭及電子裝置</chinese-title>
        <english-title>IMAGING LENS ASSEMBLY AND ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像鏡頭包含一塑膠光學元件。塑膠光學元件包含一入射面、一反射面、一出射面以及至少一連接面。連接面用於連接入射面、反射面與出射面，其中連接面包含一注料痕、一漸擴噴嘴面以及一切割痕。注料痕設置於連接面上，且注料痕相對於連接面的一相鄰部抬升。漸擴噴嘴面連接注料痕與相鄰部，且漸擴噴嘴面自注料痕朝向相鄰部的方向漸擴延伸。切割痕設置於注料痕的表面，切割痕的輪廓為線形，且切割痕延伸通過注料痕的表面。藉此，藉由漸擴噴嘴面的設置，有利於後續遮光工程施作，進而減少注料痕周邊產生雜散光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging lens assembly includes a plastic optical element. The plastic optical element includes an incident surface, a reflection surface, an exit surface, and at least one connection surface. The connection surface is used to connect the incident surface, the reflection surface and the exit surface, wherein the connection surface includes a gate vestige, a divergent nozzle surface and a cut vestige. The gate vestige is disposed on the connection surface and is elevated relative to an adjacent portion of the connection surface. The divergent nozzle surface is connected to the gate vestige and the adjacent portion, and the divergent nozzle surface diverges and extends from the gate vestige toward a direction of the adjacent portion. The cut vestige is disposed on a surface of the gate vestige. An outline of the cut vestige is linear, and the cut vestige extends across the surface of the gate vestige. Thus, it is favorable for the subsequent light shielding work, thereby reducing a stray light generated around the gate vestige by arranging the divergent nozzle surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成像鏡頭</p>
        <p type="p">110:塑膠光學元件</p>
        <p type="p">120:光學成像透鏡組</p>
        <p type="p">O:光軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10035.png" file="d10035.TIF" giffile="ed10035.png" height="694px" img-content="tif" inline="yes" orientation="portrait" width="944px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622580</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138426</doc-number>
          <kind></kind>
          <date>114/10/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260131B">G02B9/64</main-classification>
        <further-classification edition="200601120260131B">G02B13/00</further-classification>
        <further-classification edition="202101120260131B">G02B7/02</further-classification>
        <further-classification edition="200601120260131B">G02B5/20</further-classification>
        <further-classification edition="200601120260131B">G02B15/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許宰赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUH, JAE HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭有鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, YOU JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁召渼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SO MI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河水彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HA, SOO BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174945</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2025-0101494</doc-number>
          <date>20250725</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統，包括複數個透鏡以及反射構件，複數個透鏡沿著光學成像系統的光軸從複數個透鏡的物側朝向光學成像系統的成像平面依序設置；反射構件設置在複數個透鏡的前方並包括反射面，其中複數個透鏡包括最接近反射構件設置的第一透鏡，以及在第一透鏡的像側與第一透鏡相鄰設置的第二透鏡，第一透鏡和第二透鏡的複合焦距f12具有正值，並且滿足條件表達式0.9 ＜ |（R1+R2）/（R1-R2）| ＜ 1.1，其中R1為第一透鏡的物側表面的曲率半徑，以及R2為第一透鏡的像側表面的曲率半徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a plurality of lenses sequentially disposed along an optical axis of the optical imaging system from an object side of the plurality of lenses toward an imaging plane of the optical imaging system; and a reflective member disposed in front of the plurality of lenses and including a reflective surface, wherein the plurality of lenses includes a first lens disposed closest to the reflective member, and a second lens disposed adjacent to the first lens on an image side of the first lens, a composite focal length f12 of the first lens and the second lens has a positive value, and a conditional expression 0.9 ＜ |(R1+R2)/(R1-R2)| ＜ 1.1 is satisfied, where R1 is a radius of curvature of an object-side surface of the first lens, and R2 is a radius of curvature of an image-side surface of the first lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">IF:濾光器</p>
        <p type="p">IP:成像平面</p>
        <p type="p">R:反射構件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="557px" img-content="tif" inline="yes" orientation="portrait" width="962px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623122</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138445</doc-number>
          <kind></kind>
          <date>114/10/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251023B">H01R13/648</main-classification>
        <further-classification edition="201101120251023B">H01R13/658</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳小平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, XIAOPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范立</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄彪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117470582</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器包括絕緣本體、第一接地板片以及第一端子模組。絕緣本體設有配置為收容對接模組的收容插槽。第一接地板片設於絕緣本體。第一端子模組包括複數第一訊號端子以及第一接地片，第一接地片設有第一基部、自第一基部延伸的複數第一接地端子以及自第一基部延伸的第一接地凸出部。第一訊號端子以及第一接地端子均設有第一彈性臂，第一彈性臂設有凸伸入收容插槽中的第一接觸部，第一接觸部配置為與對接模組電性接觸。第一接地凸出部與第一接地板片相接觸，從而改進接地效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes an insulating body, a first ground plate and a first terminal module. The insulating body includes a receiving slot configured to receive a mating module. The first terminal module includes a number of first signal terminals and a first ground piece. The first ground piece includes a first base portion, a number of first ground terminals extending from the first base portion, and a first ground protruding portion extending from the first base portion. Each of the first signal terminals and the first ground terminals includes a first elastic arm. The first elastic arm includes a first contact portion protruding into the receiving slot to be in electrical contact with the mating module. The first ground protruding portion is in contact with the first ground plate to improve the grounding effect.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:絕緣本體</p>
        <p type="p">151:第一接地板片</p>
        <p type="p">152:第二接地板片</p>
        <p type="p">21:第一接地板</p>
        <p type="p">22:第二接地板</p>
        <p type="p">4a:第一接地片</p>
        <p type="p">4a3:第一接地凸出部</p>
        <p type="p">4a4:第三接地凸出部</p>
        <p type="p">4b:第二接地片</p>
        <p type="p">4b3:第二接地凸出部</p>
        <p type="p">4b4:第四接地凸出部</p>
        <p type="p">9:安裝塊</p>
        <p type="p">9a:第一絕緣體</p>
        <p type="p">9a12:第一安裝尾部</p>
        <p type="p">9b:第二絕緣體</p>
        <p type="p">9b12:第二安裝尾部</p>
        <p type="p">9c:第三絕緣體</p>
        <p type="p">9c12:第三安裝尾部</p>
        <p type="p">9d:第四絕緣體</p>
        <p type="p">9d12:第四安裝尾部</p>
        <p type="p">C:圖19中畫框部分</p>
        <p type="p">TM1:第一端子模組</p>
        <p type="p">TM2:第二端子模組</p>
        <p type="p">TM3:第三端子模組</p>
        <p type="p">TM4:第四端子模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10040.JPG" file="ed10040.JPG" height="473px" img-content="tif" inline="yes" orientation="portrait" width="706px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623118</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138448</doc-number>
          <kind></kind>
          <date>114/10/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01R13/631</main-classification>
        <further-classification edition="201101120260202B">H01R24/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊藤芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, TENGFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚坤磷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宏基</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾晨輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, CHENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁雙峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, SHUANGFENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116702582</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器包括殼體、第一導電端子、第二導電端子以及滑塊。第一導電端子包括第一彈性接觸臂，第一彈性接觸臂包括第一接觸部。第二導電端子包括第二彈性接觸臂，第二彈性接觸臂包括第二接觸部。滑塊配置為在對接模組插入電連接器中時抵接第一彈性接觸臂和第二彈性接觸臂，使第一彈性接觸臂和第二彈性接觸臂發生彈性變形，並使第一接觸部以及第二接觸部與對接模組相接觸以實現電性連接。本發明藉由設置滑塊，降低第一導電端子以及第二導電端子容易被異物插壞的風險，提高了可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes a housing, a first conductive terminal, a second conductive terminal and a slider. The first conductive terminal includes a first elastic contact arm having a first contact portion. The second conductive terminal includes a second elastic contact arm having a second contact portion. The slider is configured to abut against the first elastic contact arm and the second elastic contact arm when a mating module is inserted into the electrical connector, so that the first elastic contact arm and the second elastic contact arm are elastically deformed, and the first contact portion and the second contact portion are brought into contact with the mating module to achieve electrical connection. By providing the slider, it reduces the risk that the first conductive terminal and the second conductive terminal are easily damaged by foreign matter, thereby improving reliability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:第一絕緣塊</p>
        <p type="p">22:第二絕緣塊</p>
        <p type="p">300:對接模組</p>
        <p type="p">310:第一彈性接觸臂</p>
        <p type="p">3101:第一接觸部</p>
        <p type="p">3102:第一末端部</p>
        <p type="p">320:第二彈性接觸臂</p>
        <p type="p">3201:第二接觸部</p>
        <p type="p">3202:第二末端部</p>
        <p type="p">41:第一接地片</p>
        <p type="p">42:第二接地片</p>
        <p type="p">81:滑塊</p>
        <p type="p">A1-A1:第一方向</p>
        <p type="p">A2-A2:第二方向</p>
        <p type="p">B:圖17中畫框部分</p>
        <p type="p">T1:距離</p>
        <p type="p">T2:厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10039.JPG" file="ed10039.JPG" height="470px" img-content="tif" inline="yes" orientation="portrait" width="749px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623107</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138449</doc-number>
          <kind></kind>
          <date>114/10/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251023B">H01R13/02</main-classification>
        <further-classification edition="200601120251023B">H01R13/648</further-classification>
        <further-classification edition="200601120251023B">H01R13/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貴志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUI, ZHIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾晨輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, CHENHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚坤磷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張倩麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QIANLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116396356</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>第一端子模組以及電連接器</chinese-title>
        <english-title>FIRST TERMINAL MODULE AND ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種第一端子模組包括第一導電端子以及第一接地片。前述第一導電端子包括第一訊號端子、第二訊號端子、第一接地端子以及第二接地端子。每一個第一導電端子包括第一主體部以及第一折彎部。前述第一接地片包括第一抵接部、第二抵接部、第三抵接部和第四抵接部。前述第一抵接部與前述第一接地端子的第一主體部相接觸。前述第二抵接部與前述第二接地端子的第一主體部相接觸。前述第三抵接部與前述第一接地端子的第一折彎部相接觸。前述第四抵接部與前述第二接地端子的第一折彎部相接觸。本發明實施方式還揭示了一種具有前述第一端子模組的電連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first terminal module includes a plurality of first conductive terminals and a first grounding plate. The first conductive terminals includes a first signal terminal, a second signal terminal, a first grounding terminal, and a second grounding terminal. Each first conductive terminal includes a first main body portion and a first bent portion. The first grounding plate includes a first contact portion, a second contact portion, a third contact portion, and a fourth contact portion. The first contact portion contacts the first main body portion of the first grounding terminal. The second contact portion contacts the first main body portion of the second grounding terminal. The third contact portion contacts the first bent portion of the first grounding terminal. The fourth contact portion contacts the first bent portion of the second grounding terminal. An electrical connector having the first terminal module is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2a:第一導電端子</p>
        <p type="p">2a1:第一中間部</p>
        <p type="p">2a11:第一主體部</p>
        <p type="p">2a12:第一折彎部</p>
        <p type="p">2a13:第一延伸部</p>
        <p type="p">2a14:第一弧形部</p>
        <p type="p">2a15:第二延伸部</p>
        <p type="p">2a2:第一接觸臂</p>
        <p type="p">2a3:第一尾部</p>
        <p type="p">2a4:第二折彎部</p>
        <p type="p">31:第一接地片</p>
        <p type="p">311:第一基部</p>
        <p type="p">311a:第一抵接部</p>
        <p type="p">311b:第二抵接部</p>
        <p type="p">312:第一傾斜部</p>
        <p type="p">312a:第三抵接部</p>
        <p type="p">312b:第四抵接部</p>
        <p type="p">313b:第六抵接部</p>
        <p type="p">314:第二弧形部</p>
        <p type="p">315:第二延展部</p>
        <p type="p">315a:第七抵接部</p>
        <p type="p">315b:第八抵接部</p>
        <p type="p">41:第一絕緣塊</p>
        <p type="p">411:第一抵接凸塊</p>
        <p type="p">4111:第一導引斜面</p>
        <p type="p">4112:第一抵接面</p>
        <p type="p">413:第三抵接凸塊</p>
        <p type="p">4131:第三導引斜面</p>
        <p type="p">4132:第三抵接面</p>
        <p type="p">A1-A1:第一方向</p>
        <p type="p">A2-A2:第二方向</p>
        <p type="p">A3-A3:第三方向</p>
        <p type="p">DP1:第一差分對</p>
        <p type="p">G1:第一接地端子</p>
        <p type="p">G2:第二接地端子</p>
        <p type="p">S1:第一訊號端子</p>
        <p type="p">S2:第二訊號端子</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10041.JPG" file="ed10041.JPG" height="958px" img-content="tif" inline="yes" orientation="portrait" width="758px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622863</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138471</doc-number>
          <kind></kind>
          <date>109/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260228B">G06Q30/0601</main-classification>
        <further-classification edition="202401120260228B">G06Q10/083</further-classification>
        <further-classification edition="200601120260228B">G06K7/10</further-classification>
        <further-classification edition="200601120260228B">G06K19/06</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商値來股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NERAI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商關連風科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CONNECTFREE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帝都　久利寿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATE, KRISTOPHER ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帝都　久利寿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATE, KRISTOPHER ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2019-158273</doc-number>
          <date>20190830</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>商品交易系統、商品交易方法以及商品交易程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種平台，其亦可於生產者與買主之間進行商品的直接的交易。本發明提供一種用於進行買主與供給者之間的商品交易的商品交易系統。商品交易系統包括：第一受理部件，自買主受理特定的商品的包含希望購入價格的購入要求；第二受理部件，自供給者受理特定的商品的包含希望銷售價格的銷售要求；以及判斷部件，於反映了用於將特定的商品自供給者配送至買主為止的配送費後，判斷購入要求與銷售要求是否匹配。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:商品交易系統</p>
        <p type="p">10:買主</p>
        <p type="p">12:購入要求</p>
        <p type="p">20:供給者</p>
        <p type="p">22:銷售要求</p>
        <p type="p">30:配送者</p>
        <p type="p">100:運營伺服器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="649px" img-content="tif" inline="yes" orientation="portrait" width="868px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <isuno>11</isuno>
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        <document-id>
          <doc-number>202622257</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138512</doc-number>
          <kind></kind>
          <date>114/10/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C22B3/06</main-classification>
        <further-classification edition="200601120260226B">C22B7/04</further-classification>
        <further-classification edition="200601120260226B">C22B1/248</further-classification>
        <further-classification edition="202001120260226B">C01F17/10</further-classification>
        <further-classification edition="201901120260226B">C02F11/122</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉匠平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相本道宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIMOTO, MICHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻典宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, NORIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村尾玲子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAO, REIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199889</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>稀土族元素之回收方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本發明目的在於提供一種稀土族元素之回收方法，其可從高爐爐渣回收稀土族元素，且可從稀土族元素進行某稀土族元素與其以外之稀土族元素的粗分離。&lt;br/&gt;  一種稀土族元素之回收方法，包含以下步驟：&lt;br/&gt;  浸出步驟，係使高爐爐渣接觸酸進行浸出，而獲得含有前述稀土族元素之浸出液1；&lt;br/&gt;  析出步驟，係於前述浸出液1添加鹼調整成預定之pH，而獲得包含含前述稀土族元素之析出物的浸出液2；及&lt;br/&gt;  固液分離步驟，係從前述浸出液2分離前述析出物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="432px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
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          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114138514</doc-number>
          <kind></kind>
          <date>114/10/07</date>
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        <main-classification edition="200601120260224B">C22B59/00</main-classification>
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        <further-classification edition="200601120260224B">C22B7/04</further-classification>
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      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本製鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小泉匠平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOIZUMI, SHOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>相本道宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIMOTO, MICHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
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          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辻典宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUJI, NORIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村尾玲子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAO, REIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199883</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>稀土族元素之回收方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明目的在於提供一種新穎之高爐爐渣中REE回收方法，該方法可在從高爐爐渣浸出REE時一邊抑制高爐爐渣中之Si浸出，一邊浸出REE。&lt;br/&gt;  一種稀土族元素之回收方法，係從高爐爐渣回收稀土族元素的方法，該方法包含以下步驟：&lt;br/&gt;  酸浸步驟，係使前述高爐爐渣與酸接觸而獲得含有從前述高爐爐渣浸出之稀土族元素的含稀土族元素之浸出液，其中前述高爐爐渣為結晶質；及&lt;br/&gt;  固液分離步驟，係從前述含稀土族元素之浸出液中分離固體成分；並且&lt;br/&gt;  前述高爐爐渣與前述酸之接觸時間為1分鐘以上且20分鐘以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="370px" img-content="tif" inline="yes" orientation="portrait" width="741px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623061</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138515</doc-number>
          <kind></kind>
          <date>114/10/07</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="200601120260302B">H05H1/46</further-classification>
        <further-classification edition="200601120260302B">H03H7/38</further-classification>
        <further-classification edition="200601120260302B">H01P5/12</further-classification>
        <further-classification edition="202601120260302B">H10P95/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商應用材料股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED MATERIALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫姆　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COUMOU, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈瑞歐　傑高</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARRELL, JACOB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾法雷茲　布萊恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALVAREZ, BRIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　勁文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAN, KELVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/917,917</doc-number>
          <date>20241016</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>分散式射頻系統中射頻功率傳輸與分配的控制</chinese-title>
        <english-title>CONTROL OF RF POWER DELIVERY AND SPLITTING IN A DISTRIBUTED RF SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文所描述的實施例涉及一種設備，包括一個RF功率供應器和一個具有切換輸出的RF功率分配器。在一個實施例中，該設備包括一個射頻（RF）功率供應器和電氣上耦接至RF功率供應器的RF功率分配器。在一個實施例中，RF功率分配器包括複數個輸出。在一個實施例中，複數個RF阻抗匹配的各者電氣上耦接至RF功率分配器的複數個輸出中的一不同者。在一個實施例中，複數個開關沿著複數個RF電纜中的一不同者，複數個RF電纜將RF功率分配器的複數個輸出的各者耦接至複數個RF阻抗匹配的一不同者。在一個實施例中，該設備進一步包括一控制器，控制器與複數個開關和複數個RF阻抗匹配通訊耦接，該控制器被配置為調諧複數個RF阻抗匹配至匹配輸入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Embodiments described herein relate to an apparatus that includes an RF power supply and an RF power splitter with switched outputs. In an embodiment, an apparatus includes a radio frequency (RF) power supply, and an RF power splitter electrically coupled to the RF power supply. In an embodiment, the RF power splitter includes a plurality of outputs. In an embodiment, each one of a plurality of RF impedance matches are electrically coupled to a different one of the plurality of outputs of the RF power splitter. In an embodiment, a plurality of switches are along a different one of a plurality of RF cables that couple each of the plurality of outputs of the RF power splitter to a different one of the plurality of RF impedance matches. In an embodiment, the apparatus further includes a controller communicatively coupled to the plurality of switches and the plurality of RF impedance matches, and the controller is configured to tune the plurality of RF impedence matches to a matched input.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:RF功率傳輸系統</p>
        <p type="p">105:RF功率供應器</p>
        <p type="p">106:傳輸線</p>
        <p type="p">110:分配器</p>
        <p type="p">111&lt;sub&gt;A&lt;/sub&gt;:傳輸線</p>
        <p type="p">111&lt;sub&gt;B&lt;/sub&gt;:傳輸線</p>
        <p type="p">111&lt;sub&gt;C&lt;/sub&gt;:傳輸線</p>
        <p type="p">111&lt;sub&gt;D&lt;/sub&gt;:傳輸線</p>
        <p type="p">115&lt;sub&gt;A&lt;/sub&gt;:RF阻抗匹配</p>
        <p type="p">115&lt;sub&gt;B&lt;/sub&gt;:RF阻抗匹配</p>
        <p type="p">115&lt;sub&gt;C&lt;/sub&gt;:RF阻抗匹配</p>
        <p type="p">115&lt;sub&gt;D&lt;/sub&gt;:RF阻抗匹配</p>
        <p type="p">120&lt;sub&gt;A&lt;/sub&gt;:電漿腔室</p>
        <p type="p">120&lt;sub&gt;B&lt;/sub&gt;:電漿腔室</p>
        <p type="p">120&lt;sub&gt;C&lt;/sub&gt;:電漿腔室</p>
        <p type="p">120&lt;sub&gt;D&lt;/sub&gt;:電漿腔室</p>
        <p type="p">124:晶圓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10029.JPG" file="ed10029.JPG" height="692px" img-content="tif" inline="yes" orientation="portrait" width="998px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202622001</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114138534</doc-number>
          <kind></kind>
          <date>114/10/07</date>
        </document-id>
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        <main-classification edition="202301120260224B">C02F1/44</main-classification>
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        <further-classification edition="200601120260224B">B01D65/08</further-classification>
        <further-classification edition="200601120260224B">B01D61/00</further-classification>
        <further-classification edition="202301120260224B">G06Q10/06</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商奧璐佳瑙股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORGANO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
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              <chinese-name name-type="organization">
                <last-name>中野徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村勇規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
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          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-179164</doc-number>
          <date>20241011</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>水處理系統、逆滲透膜裝置之運轉方法、控制裝置及程式</chinese-title>
        <english-title>WATER TREATMENT SYSTEM, METHOD FOR OPERATING REVERSE OSMOSIS MEMBRANE DEVICE, CONTROL DEVICE, AND PROGRAM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可依據2種以上之原水的積垢風險進行最適當之堵塞抑制處理的水處理系統。  &lt;br/&gt;水處理系統1具有：逆滲透膜裝置6，其將混合水質不同之多數原水而得的混合水分離成透過水及濃縮水；堵塞抑制設備9，其抑制逆滲透膜裝置之逆滲透膜的堵塞；流量測量設備11，其測量多數原水之各自流量；及控制裝置10，其依據流量測量設備11之測量值取得多數原水之流量比率，依據該流量比率階段地控制堵塞抑制設備9之堵塞抑制動作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An object of the invention is to provide a water treatment system capable of conducting a fouling suppression treatment optimized according to the fouling risk associated with two or more types of raw water. &lt;br/&gt;The water treatment system 1 has a reverse osmosis membrane device 6 which separates a mixed water composed of a mixture of a plurality of raw waters of different water quality into a permeate and a concentrate, a fouling suppression device 9 which suppresses fouling of the reverse osmosis membrane of the reverse osmosis membrane device, a flow rate measurement device 11 which measures the flow rates of each of the plurality of raw waters, and a control device 10 which acquires a flow rate ratio between the plurality of raw waters based on the measurement values of the flow rate measurement device 11 and controls the fouling suppression operation of the fouling suppression device 9 in a stepwise manner in accordance with the flow rate ratio.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:水處理系統</p>
        <p type="p">2:原水槽</p>
        <p type="p">3:前處理設備</p>
        <p type="p">4:RO原水槽</p>
        <p type="p">5,96:泵</p>
        <p type="p">6,61:RO膜裝置</p>
        <p type="p">7:濃縮水槽</p>
        <p type="p">9:堵塞抑制設備</p>
        <p type="p">9a,9b,9c,9e,9f:配管</p>
        <p type="p">9d:分支配管</p>
        <p type="p">10:控制裝置</p>
        <p type="p">11:流量測量設備</p>
        <p type="p">11a,11b:流量計</p>
        <p type="p">62:鹵水逆滲透(B-RO)膜裝置</p>
        <p type="p">91,92,93,94,95:壓力調整用自動閥</p>
        <p type="p">96a:換流器</p>
        <p type="p">97:分散劑注入設備</p>
        <p type="p">98,99:pH調整設備</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="541px" img-content="tif" inline="yes" orientation="portrait" width="837px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621971</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138614</doc-number>
          <kind></kind>
          <date>114/10/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65G49/07</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家登精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDENG PRECISION INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MING-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊家和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIA-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾承梧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHENG-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粟勁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOU, JING-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祐憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏子翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, TZU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/720,780</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/722,082</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>支撐裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種支撐裝置，適於配置於一半導體容器內，該支撐裝置包括：本體及承載面。承載面位於本體之上表面。承載面包括：第一傾斜面自承載面朝向半導體容器之開口處逐漸傾斜突起；及第二傾斜面朝向半導體容器的內後壁逐漸傾斜突起。承載面用以承載一半導體基板之接觸面，接觸面沿著第一傾斜面與第二傾斜面之不同傾斜面貼合接觸。藉此支撐裝置可以有效降低承載時的變形量與摩擦接觸所產生的汙染。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200A:支撐裝置</p>
        <p type="p">1:本體</p>
        <p type="p">2:承載面</p>
        <p type="p">2a:第一傾斜面</p>
        <p type="p">2b:第二傾斜面</p>
        <p type="p">21:最低點</p>
        <p type="p">22:中心點</p>
        <p type="p">L:水平面</p>
        <p type="p">θ1:夾角</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="777px" img-content="tif" inline="yes" orientation="portrait" width="680px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622046</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138618</doc-number>
          <kind></kind>
          <date>114/10/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D239/34</main-classification>
        <further-classification edition="200601120260302B">C07D239/52</further-classification>
        <further-classification edition="200601120260302B">C07D487/08</further-classification>
        <further-classification edition="200601120260302B">C07D239/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商先正達農作物保護股份公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYNGENTA CROP PROTECTION AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩爾齊克　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SARDZIK, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SK</english-country>
              <english-address>SK</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24205970.7</doc-number>
          <date>20241010</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化學方法</chinese-title>
        <english-title>CHEMICAL PROCESS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明尤其提供了一種用於製備具有式 (I) 的化合物之方法，  &lt;br/&gt;&lt;img align="absmiddle" height="150px" width="199px" file="ed10021.JPG" alt="ed10021.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;其中取代基係如請求項1中所定義的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides, &lt;i&gt;inter alia&lt;/i&gt;, a process for preparing a compound of formula (I) &lt;br/&gt;&lt;img align="absmiddle" height="165px" width="188px" file="ed10022.JPG" alt="ed10022.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;wherein the substituents are as defined in claim 1.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622135</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138640</doc-number>
          <kind></kind>
          <date>114/10/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C08F265/06</main-classification>
        <further-classification edition="200601120260226B">C08F22/28</further-classification>
        <further-classification edition="202001120260226B">A61K6/64</further-classification>
        <further-classification edition="200601120260226B">C08L33/10</further-classification>
        <further-classification edition="200601120260226B">C07C209/28</further-classification>
        <further-classification edition="200601120260226B">C09J133/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芹澤伸也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERIZAWA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-175967</doc-number>
          <date>20241007</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>組成物、物品及馬達</chinese-title>
        <english-title>COMPOSITION,ARTICLE,AND MOTOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組成物，其包含聚合性單體（A）、彈性體（B）、聚合起始劑（C）及還原劑（D），前述彈性體（B）包含在23℃下為液態的彈性體（B1），在將前述彈性體（B）的總量設為100質量份時，前述彈性體（B）中的前述在23℃下為液態的彈性體（B1）的含量為80質量份以上且100質量份以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition comprising a polymerizable monomer (A), an elastomer (B), a polymerization initiator (C), and a reducing agent (D), wherein the elastomer (B) includes a liquid elastomer (B1) that is liquid at 23°C, and the content of the liquid elastomer (B1) within said elastomer (B) at 23°C is 80 to 100 parts by mass or less when the total amount of the elastomer (B) is taken as 100 parts by mass.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622199</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138642</doc-number>
          <kind></kind>
          <date>114/10/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C09J4/02</main-classification>
        <further-classification edition="202001120260226B">A61K6/64</further-classification>
        <further-classification edition="200601120260226B">C08F265/06</further-classification>
        <further-classification edition="200601120260226B">C07C209/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>芹澤伸也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SERIZAWA, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-175954</doc-number>
          <date>20241007</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>組成物、物品及馬達</chinese-title>
        <english-title>COMPOSITION,ARTICLE,AND MOTOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組成物，其包含聚合性單體（A）、彈性體（B）、聚合起始劑（C）及還原劑（D），依據JIS K 6833-1：2008，使用B型黏度計，且在轉速20rpm、測量時間2分鐘、測量環境溫度25℃的條件下測量之黏度為10Pa･s以下，藉由下述方法1求出之斷裂伸長率為10%以上且150%以下。（方法1）藉由將前述組成物在23℃、相對濕度50%的環境下養護24小時而使其硬化，從而製作JIS K 7161-2：2014附錄A中所規定之1BA型啞鈴形狀的試驗片。接著，使用拉伸試驗機，依據JIS K7161-1：2014及JIS K7161-2：2014，在23℃的環境下，且以拉伸速度10mm/分鐘的條件，對前述試驗片進行拉伸試驗，測量前述斷裂伸長率（%）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition comprising a polymerizable monomer (A), an elastomer (B), a polymerization initiator (C), and a reducing agent (D), wherein the viscosity, as measured according to JIS K 6833-1:2008 using a type-B viscometer under the conditions of a rotational speed of 20 rpm, a measurement time of 2 minutes, and an ambient temperature of 25°C, is 10 Pa·s or less, and the elongation at break determined by the following Method 1 is 10% or more and 150% or less. &lt;br/&gt;(Method 1) &lt;br/&gt;The composition is cured by ageing for 24 hours in an environment of 23°C and 50% relative humidity, and a 1BA-type dumbbell-shaped test specimen is prepared in accordance with Annex A of JIS K7161-2:2014. &lt;br/&gt;A tensile test is then conducted using a tensile testing machine in accordance with JIS K7161-1:2014 and JIS K7161-2:2014, under conditions of an ambient temperature of 23°C and a tensile speed of 10 mm/min, to measure the elongation at break (%).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623502</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138669</doc-number>
          <kind></kind>
          <date>114/10/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260226B">H10N10/85</main-classification>
        <further-classification edition="202301120260226B">H10N15/00</further-classification>
        <further-classification edition="200601120260226B">G01K17/00</further-classification>
        <further-classification edition="200601120260226B">G01R19/00</further-classification>
        <further-classification edition="200601120260226B">C30B29/52</further-classification>
        <further-classification edition="200601120260226B">G01D5/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤英治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITOH, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関真一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKI, SHINICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉川貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKKAWA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　維慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, DUY KHANH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>VN</english-country>
              <english-address>VN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有澤洋希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARISAWA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-178678</doc-number>
          <date>20241011</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>檢測元件及檢測模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之一實施形態之檢測元件包含：檢測部，其包含極性金屬及極性半導體之一者或兩者；及輸出部，其將前述檢測部之相對於空間反演對稱性之破缺之方向正交之方向之物理量之波動、且為檢測對象之物理量之波動，作為檢測信號而輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:檢測元件</p>
        <p type="p">202:檢測部</p>
        <p type="p">202S:檢測部之表面</p>
        <p type="p">207a,207b:輸出部</p>
        <p type="p">B:外部磁場</p>
        <p type="p">C:正交座標系</p>
        <p type="p">H:熱流</p>
        <p type="p">X,Y,Z:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="612px" img-content="tif" inline="yes" orientation="portrait" width="670px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623504</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138682</doc-number>
          <kind></kind>
          <date>114/10/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260226B">H10N50/85</main-classification>
        <further-classification edition="202301120260226B">H10N52/85</further-classification>
        <further-classification edition="200601120260226B">C01B35/04</further-classification>
        <further-classification edition="200601120260226B">H01F1/40</further-classification>
        <further-classification edition="202301120260226B">H10N15/00</further-classification>
        <further-classification edition="200601120260226B">G01D5/12</further-classification>
        <further-classification edition="200601120260226B">G01N27/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE UNIVERSITY OF TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>齊藤英治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITOH, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, TSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>有澤洋希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARISAWA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>永井隆之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAI, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-178714</doc-number>
          <date>20241011</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>檢測元件及檢測模組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之一實施形態之檢測元件包含：檢測部，其包含磁性金屬及磁性半導體之一者或兩者，具有因磁有序造成之空間反演對稱性之破缺；及輸出部，其將前述檢測部之相對於空間反演對稱性之破缺之方向正交之方向之物理量之波動、且為檢測對象之物理量之波動作為檢測信號而輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:檢測元件</p>
        <p type="p">202:檢測部</p>
        <p type="p">202S:檢測部之表面</p>
        <p type="p">207a,207b:輸出部</p>
        <p type="p">B:外部磁場</p>
        <p type="p">C:正交座標系</p>
        <p type="p">H:熱流</p>
        <p type="p">X,Y,Z:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="575px" img-content="tif" inline="yes" orientation="portrait" width="682px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622156</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138709</doc-number>
          <kind></kind>
          <date>114/10/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C08G73/12</main-classification>
        <further-classification edition="200601120260226B">C08L79/06</further-classification>
        <further-classification edition="200601120260226B">G03F7/028</further-classification>
        <further-classification edition="200601120260226B">C08F2/50</further-classification>
        <further-classification edition="202301120260226B">H10K71/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY INDUSTRIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹山祐貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEYAMA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橋本啓華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASHIMOTO, KEIKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>増田有希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASUDA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-179547</doc-number>
          <date>20241015</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂組成物、硬化膜、硬化膜的製造方法、電子零件及半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種兼顧優異的邊緣切割性與膜厚的面內均勻性的樹脂組成物。一種樹脂組成物，含有：（A）選自由聚醯亞胺、聚醯亞胺前驅物、聚苯並噁唑、聚苯並噁唑前驅物及該些的共聚物所組成的群組中的一種以上的樹脂；（B1）20℃下的蒸氣壓為0.40 kPa以上且未滿2.00 kPa的有機溶劑；（B2）20℃下的蒸氣壓為0.10 kPa以上且未滿0.40 kPa的有機溶劑；及（C）20℃下的蒸氣壓為0.01 kPa以上且未滿0.10 kPa的含醯胺基的胺化合物，於設所述（B1）有機溶劑的質量為BW1、（B2）有機溶劑的質量為BW2時，0.10≦BW1/（BW1+BW2）≦0.40。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:1a(模襯墊)+1b(引線)</p>
        <p type="p">1a:模襯墊</p>
        <p type="p">1b:引線</p>
        <p type="p">2:半導體元件</p>
        <p type="p">3:底塗層</p>
        <p type="p">4:導線</p>
        <p type="p">5:樹脂密封層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="337px" img-content="tif" inline="yes" orientation="portrait" width="593px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622253</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138731</doc-number>
          <kind></kind>
          <date>114/10/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C21C7/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溝端圭介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIZOBATA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大東祐汰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHIGASHI, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根岸秀光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEGISHI, HIDEMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川畑涼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWABATA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-176254</doc-number>
          <date>20241008</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>熔鋼之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所提供的熔鋼之製造方法，係即使二次精煉步驟的成分濃度變化量預測值出現變動，仍可穩定地製造目標成分濃度範圍內之熔鋼。  &lt;br/&gt;本發明的熔鋼之製造方法，係在二次精煉步驟中添加管理成分X之成分含量不同的複數種合金，而製造目標成分濃度範圍內之熔鋼的熔鋼之製造方法，其包括有：合金添加量決定步驟與合金添加步驟；該合金添加量決定步驟係以管理成分X的成分濃度變化量滿足下述(1)、(2)式之方式，決定複數種合金的個別添加量；該合金添加步驟係將由合金添加量決定步驟所決定添加量的上述複數種合金，添加於上述熔鋼中。  &lt;br/&gt;[X]&lt;sub&gt;ini&lt;/sub&gt;+[X]&lt;sub&gt;est&lt;/sub&gt;≦[X]&lt;sub&gt;max&lt;/sub&gt;-d×σ&lt;sub&gt;x&lt;/sub&gt;・・・(1)  &lt;br/&gt;[X]&lt;sub&gt;ini&lt;/sub&gt;+[X]&lt;sub&gt;est&lt;/sub&gt;≧[X]&lt;sub&gt;min&lt;/sub&gt;+d×σ&lt;sub&gt;x&lt;/sub&gt;・・・(2)  &lt;br/&gt;[X]&lt;sub&gt;ini&lt;/sub&gt;係二次精煉步驟前或二次精煉步驟中的管理成分X之成分濃度(質量%)；[X]&lt;sub&gt;est&lt;/sub&gt;係二次精煉步驟中的上述管理成分X之成分濃度變化量預測值(質量%)；[X]&lt;sub&gt;max&lt;/sub&gt;係目標之上述管理成分X的成分濃度範圍最大值(質量%)；[X]&lt;sub&gt;min&lt;/sub&gt;係目標之上述管理成分X的成分濃度範圍最小值(質量%)；σ&lt;sub&gt;x&lt;/sub&gt;係上述管理成分X依成分變化量預測模型的推定誤差之標準偏差；d係1~3之常數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:RH真空脫氣裝置</p>
        <p type="p">12:盛桶</p>
        <p type="p">14:熔鋼</p>
        <p type="p">16:爐渣</p>
        <p type="p">18:真空槽</p>
        <p type="p">20:上部槽</p>
        <p type="p">22:下部槽</p>
        <p type="p">24:上升側浸漬管</p>
        <p type="p">26:下降側浸漬管</p>
        <p type="p">28:環流用氣體吹入管</p>
        <p type="p">30:排氣風管</p>
        <p type="p">32:原料投入口</p>
        <p type="p">34:頂吹噴槍</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="897px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621828</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138759</doc-number>
          <kind></kind>
          <date>114/10/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260302B">B23K26/04</main-classification>
        <further-classification edition="201401120260302B">B23K26/062</further-classification>
        <further-classification edition="200601120260302B">B23K26/067</further-classification>
        <further-classification edition="201401120260302B">B23K26/36</further-classification>
        <further-classification edition="201401120260302B">B23K26/50</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商細美事有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李東和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DONG HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張碩元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SUK WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金埈煜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUN WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG HWA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0171314</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶圓加工裝置以及晶圓加工方法</chinese-title>
        <english-title>WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種加工晶圓的裝置以及晶圓加工方法，涉及一種利用多個雷射光束來修整晶圓的邊緣的晶圓加工裝置以及利用其的晶圓加工方法。本發明提供一種修整晶圓的邊緣部的晶圓加工裝置，所述晶圓加工裝置包括：第一雷射頭，在所述邊緣部沿著所述晶圓的高度方向形成第一改性面；以及第二雷射頭，在所述邊緣部沿著所述晶圓的直徑方向形成第二改性面，當通過外力去除所述邊緣部時，所述第一改性面和所述第二改性面作用為可剝離的分界面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a wafer processing apparatus and a wafer processing method. The present invention relates to a wafer processing apparatus for trimming the edge of a wafer using a plurality of laser beams and a wafer processing method using the same. The present invention provides a wafer processing apparatus for trimming the edge of a wafer; the wafer processing apparatus comprises: a first laser head forming a first modified surface on the edge portion along the height direction of the wafer; and a second laser head forming a second modified surface on the edge portion along the diameter direction of the wafer, wherein the first modified surface and the second modified surface serve as a removable boundary surface when the edge is removed by an external force.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一晶圓</p>
        <p type="p">11:第一晶圓外表面</p>
        <p type="p">20:第二晶圓</p>
        <p type="p">40:第一雷射頭</p>
        <p type="p">41:第一雷射光束</p>
        <p type="p">50:第二雷射頭</p>
        <p type="p">51:第二雷射光束</p>
        <p type="p">60:高度測量感測器</p>
        <p type="p">110:控制部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="828px" img-content="tif" inline="yes" orientation="portrait" width="774px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622759</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138795</doc-number>
          <kind></kind>
          <date>114/10/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">G06F13/38</main-classification>
        <further-classification edition="200601120260202B">G06F13/42</further-classification>
        <further-classification edition="200601120260202B">G06F13/40</further-classification>
        <further-classification edition="202201120260202B">H04L49/90</further-classification>
        <further-classification edition="202201120260202B">H04L47/10</further-classification>
        <further-classification edition="200601120260202B">H04L12/40</further-classification>
        <further-classification edition="200601120260202B">G06F3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾爾波科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHAWAVE SEMI, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔瓦拉吉里　阿布希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAVARAGIRI, ABHAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖瑪拉　艾索克庫瑪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUMMALA, ASHOK KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢彌爾頓　崔維斯貝利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMILTON, TRAVIS BAILEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯卡雷拉　藍道約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASCARELLA, RANDALL JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉米瑞茲　凱薩亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMIREZ, CESAR AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查克拉亞　維什瓦納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAKRALA, VISWANATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉費爾　查爾斯安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIEFER, CHARLES ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里希那穆提　戈皮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAMURTHY, GOPI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>印度</country>
          <doc-number>202411088573</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>內部通訊鏈路</chinese-title>
        <english-title>INTERNAL COMMUNICATION LINK</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包含經配置為在記憶體系統互連與埠控制器之間橋接的橋接電路系統。在第一狀態下，該橋接電路系統經配置為控制內部通訊鏈路介面使用第一類型的信用將給定類型的封包傳輸到埠控制器。在第二狀態下，該橋接電路系統經配置為控制內部通訊鏈路介面將給定類型的封包傳輸到埠控制器而不使用第一類型的信用。第一類型的信用表示在鏈路夥伴處的緩衝儲存器的可用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus comprises bridge circuitry configured to bridge between a memory system interconnect and a port controller. In a first state, the bridge circuitry is configured to control the internal communication link interface to transmit a given type of packet to the port controller using a first type of credit. In a second state, the bridge circuitry is configured to control the internal communication link interface to transmit the given type of packet to the port controller without using the first type of credit. The first type of credit represents availability of buffer storage at the link partner.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:積體電路</p>
        <p type="p">4:計算電路單元</p>
        <p type="p">6:計算電路單元</p>
        <p type="p">8:記憶體系統互連</p>
        <p type="p">9:歸屬節點電路系統</p>
        <p type="p">10:記憶體儲存電路系統</p>
        <p type="p">12:橋接電路系統</p>
        <p type="p">14:根埠</p>
        <p type="p">16:外部通訊鏈路</p>
        <p type="p">18:鏈路夥伴</p>
        <p type="p">20:交換機</p>
        <p type="p">22:晶片到晶片鏈路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="750px" img-content="tif" inline="yes" orientation="portrait" width="995px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622617</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138835</doc-number>
          <kind></kind>
          <date>114/10/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260204B">G02F1/1337</main-classification>
        <further-classification edition="200601120260204B">G02F1/061</further-classification>
        <further-classification edition="200601120260204B">C09K19/36</further-classification>
        <further-classification edition="202101120260204B">C25B11/067</further-classification>
        <further-classification edition="200601120260204B">G09G3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林洋鉅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YANG CHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚正宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, CHENG HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/133554</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>液晶顯示裝置、電子紙及器件</chinese-title>
        <english-title>LIQUID CRYSTAL DEVICE, ELECTRONIC PAPER, AND COMPONENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的一些實施例提供一種液晶顯示裝置，其包括第一基板、第二基板、第一電極、第二電極、第一配向控制膜、第二配向控制膜以及液晶層。第一電極設置於第一基板上。第二電極設置於第二基板上。第一配向控制膜設置於第一電極上。第二配向控制膜設置於第二電極上。液晶層設置於第一配向控制膜及第二配向控制膜之間。第一配向控制膜的厚度小於或等於600埃。液晶層包括向列液晶及手性劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid crystal device is provided. The liquid crystal device includes a first substrate, a second substrate, a first electrode, a second electrode, a first alignment control film, a second alignment control film, and a liquid crystal layer. The first electrode is disposed on the first substrate. The second electrode is disposed on the second substrate. The first alignment control film is disposed on the first electrode. The second alignment control film is disposed on the second electrode. The liquid crystal layer is disposed between the first alignment control film and the second alignment control film. A thickness of the first alignment control film is equal to or less than 600 Å. The liquid crystal layer includes a nematic liquid crystal and a chiral material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:液晶顯示裝置</p>
        <p type="p">41:基板</p>
        <p type="p">42:基板</p>
        <p type="p">43:電極</p>
        <p type="p">44:電極</p>
        <p type="p">45:配向控制膜</p>
        <p type="p">46:配向控制膜</p>
        <p type="p">47:液晶層</p>
        <p type="p">48:光吸收層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="591px" img-content="tif" inline="yes" orientation="portrait" width="837px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623111</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138905</doc-number>
          <kind></kind>
          <date>114/10/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251128B">H01R13/24</main-classification>
        <further-classification edition="201101120251128B">H01R12/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾威勒電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>登　羅伯特赫拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THEIN, ROBERT HLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡志明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, CHIH-MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾瑟拉　吉米安立奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACERA, JIMMY ENRIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
              <english-address>PH</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,423</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>連接器</chinese-title>
        <english-title>CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種連接器包含連接件、連接座以及盤狀彈簧端子。連接件包含相連接之限位部以及插頭部，插頭部沿連接方向延伸。連接座具有相連通之容置空間以及開口，限位部位於容置空間，插頭部穿越開口。盤狀彈簧端子位於容置空間，並沿上述之連接方向夾置於連接座與限位部之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A connector includes a connecting piece, a connecting base and a disc-shaped spring terminal. The connecting piece includes a limiting portion and a plug portion connected with the limiting portion. The plug portion extends along a mating direction. The connecting base has an accommodation space and an opening communicated with the accommodation space. The limiting portion is located in the accommodation space. The plug portion penetrates through the opening. The disc-shaped spring terminal is located in the accommodation space and sandwiched between the connecting base and the limiting portion along the mating direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接器</p>
        <p type="p">110:連接件</p>
        <p type="p">111:限位部</p>
        <p type="p">111sa:第一斜面</p>
        <p type="p">112:插頭部</p>
        <p type="p">120:連接座</p>
        <p type="p">121:底殼</p>
        <p type="p">1211:底壁</p>
        <p type="p">1212:側壁</p>
        <p type="p">122:蓋體</p>
        <p type="p">122si:內壁面</p>
        <p type="p">122sa:第二斜面</p>
        <p type="p">130:盤狀彈簧端子</p>
        <p type="p">131:外環</p>
        <p type="p">132:彈性臂</p>
        <p type="p">140:C型扣環</p>
        <p type="p">500:印刷電路板</p>
        <p type="p">DA:調整方向</p>
        <p type="p">DM:連接方向</p>
        <p type="p">OP:開口</p>
        <p type="p">SP:容置空間</p>
        <p type="p">SR:凹陷空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.bmp" file="ed10022.bmp" height="954px" img-content="tif" inline="yes" orientation="portrait" width="766px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622664</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138935</doc-number>
          <kind></kind>
          <date>114/10/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120260302B">G05D1/24</main-classification>
        <further-classification edition="200601120260302B">A47L9/00</further-classification>
        <further-classification edition="200601120260302B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁勝軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QI, SHENGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024114258949</doc-number>
          <date>20241012</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清掃機器人的尋樁方法和裝置、清掃機器人及儲存媒體</chinese-title>
        <english-title>METHOD AND APPARATUS OF SEARCHING FOR STATION FOR CLEANING ROBOT, CLEANING ROBOT, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種清掃機器人的尋樁方法和裝置、清掃機器人及儲存媒體，涉及智能清潔技術領域。該方法根據接收到的初步尋樁訊號，確定靠近樁的初步移動策略；在執行完成初步移動策略後，控制清掃機器人轉動，並在清掃機器人轉動的過程中，收集多個轉動角度下接收到的尋樁訊號；根據多個轉動角度下接收到的尋樁訊號，確定清掃機器人的對樁角度；控制清掃機器人按照對樁角度向樁移動。本實施例在全局尋樁完成後，先根據接收到的初步尋樁訊號，確定靠近樁的初步移動策略，使得清掃機器人靠近樁，這樣為下一步動作打好基礎；在完成初步的位置移動後，接下來確定清掃機器人與樁中心最佳的對樁角度，從而按照對樁角度準確和高效的進行向樁移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a method and an apparatus of searching for a station for a cleaning robot, a cleaning robot, and a storage medium,relating to the field of intelligent cleaning technology. The method includes: determining a preliminary movement strategy for approaching a station based on a received preliminary station-searching signal; after performing the preliminary movement strategy, controlling the cleaning robot to rotate, and during rotation of the cleaning robot, acquiring station-searching signals received at a plurality of rotation angles; determining a station-aligning angle for the cleaning robot based on the station-searching signals received at the plurality of rotation angles; controlling the cleaning robot to move towards the station according to the station-aligning angle. In this embodiment, after a global station-searching is completed, the preliminary movement strategy for approaching the station is determined based on the received preliminary station-searching signal, to enable cleaning robot to approach the station, thus laying a better foundation for the next action. After completing a preliminary position movement, an optimal station-aligning angle between the cleaning robot and a center of the sateion is determined next, to accurately and efficiently control the cleaning robot to move towards the station according to the station-aligning angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102、S103、S104:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="636px" img-content="tif" inline="yes" orientation="portrait" width="740px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623014</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114138963</doc-number>
          <kind></kind>
          <date>114/10/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">H01F27/30</main-classification>
        <further-classification edition="200601120260225B">H01F27/29</further-classification>
        <further-classification edition="201601120260225B">H01F41/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商伍爾特電子明康有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WURTH ELECTRONICS MIDCOM INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅爾茲　克里斯蒂安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERZ, CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松　建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOM, CEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡秀如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>102024129481.7</doc-number>
          <date>20241011</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電感組件及用於製造電感組件之方法</chinese-title>
        <english-title>INDUCTIVE COMPONENT AND METHOD FOR PRODUCING AN INDUCTIVE COMPONENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種電感組件，其具有一導線繞組、磁性傳導材料之一底板以及位於該底板之一下側上之至少兩個導電連接表面，以藉由SMT (表面安裝技術)進行裝配，該導線繞組被形成為一扁平螺旋繞組，該導線繞組被配置在該底板之一上部側上，且設置具有兩個支腿及連接該等支腿之一底座之至少四個U形夾子，該等U形夾子被配置在該底板上，使得一第一支腿分別被配置在該底板之該上部側上且一第二支腿分別被配置在該底板之該下側上，該第二支腿之至少一部分在一第一夾子之情形中及在一第二夾子之情形中分別形成一連接表面，該導線繞組之一第一繞組端連接至該第一夾子之該第一支腿且該導線繞組之一第二繞組端連接至該第二夾子之一第一支腿，並且一第三夾子及一第四夾子在該底板之圓周上被配置成彼此相距一定距離且與該第一夾子及該第二夾子相距一定距離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to an inductive component with a wire winding, a baseplate of magnetically conductive material and at least two electrically conductive connection surfaces on an underside of the baseplate for assembly by SMT (Surface Mounted Technology), the wire winding being formed as a flat spiral winding, the wire winding being arranged on an upper side of the baseplate and at least four U-shaped clips being provided with two legs and a base connecting the legs, the U-shaped clips being arranged on the baseplate such that a first leg is respectively arranged on the upper side of the baseplate and a second leg is respectively arranged on the underside of the baseplate, at least a part of the second leg in the case of a first clip and in the case of a second clip respectively forming a connection surface, a first winding end of the wire winding being connected to the first leg of the first clip and a second winding end of the wire winding being connected to a first leg of the second clip and a third clip and a fourth clip being arranged on the circumference of the baseplate at a distance from each other and at a distance from the first and the second clip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電感組件</p>
        <p type="p">12:導線繞組/螺旋形導線繞組</p>
        <p type="p">14:底板</p>
        <p type="p">16:U形夾子/第一夾子/夾子</p>
        <p type="p">17:U形夾子/第二夾子/夾子</p>
        <p type="p">18:U形夾子/第三夾子/夾子</p>
        <p type="p">19:U形夾子/第四夾子/夾子</p>
        <p type="p">20:第一繞組端/繞組端</p>
        <p type="p">21:U形夾子/第五夾子/夾子</p>
        <p type="p">22:第二繞組端/繞組端</p>
        <p type="p">30:中央圓柱形凸起/中央凸起/凸起</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="485px" img-content="tif" inline="yes" orientation="portrait" width="665px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622119</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139006</doc-number>
          <kind></kind>
          <date>114/10/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">A61K39/395</further-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">G01N33/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商麥迪紐有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIMMUNE, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬雷利　馬塞洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARELLI, MARCELLO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓　慧穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, HUIYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, QUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃宇澤</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/706,134</doc-number>
          <date>20241011</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/718,026</doc-number>
          <date>20241108</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ＣＤ２２抗體及藥物接合物與其用途</chinese-title>
        <english-title>CD22 ANTIBODY AND DRUG CONJUGATES AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及用於治療癌症之CD22結合分子（諸如抗CD22抗體）、及相關的抗體藥物接合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to CD22 binding molecules, such as anti-CD22 antibodies, for the treatment of cancer, and related antibody-drug conjugates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622120</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139007</doc-number>
          <kind></kind>
          <date>114/10/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07K16/28</main-classification>
        <further-classification edition="200601120260302B">C07D491/22</further-classification>
        <further-classification edition="201701120260302B">A61K47/68</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
        <further-classification edition="200601120260302B">C07H19/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞典商阿斯特捷利康公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASTRAZENECA AB</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SE</english-country>
              <english-address>SE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加蘭科卡　阿爾巴諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GALAN COCA, ALBANO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比德爾　喬納森大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEADLE, JONATHAN DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉君怡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24205979.8</doc-number>
          <date>20241010</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含可裂解連接子之接合物</chinese-title>
        <english-title>CONJUGATES COMPRISING CLEAVABLE LINKERS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本說明書係關於式(I)之接合物：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="113px" width="190px" file="ed10161.JPG" alt="ed10161.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;及其醫藥上可接受之鹽。本說明書亦關於該等接合物用於治療諸如癌症之疾病中的用途，以及用於合成該等接合物之有用中間物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The specification relates to conjugates of Formula (I): &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="106px" width="189px" file="ed10162.JPG" alt="ed10162.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;and pharmaceutically acceptable salts thereof. The specification also relates the use of the conjugates for the treatment of diseases such as cancer, and intermediates useful for the synthesis of the conjugates.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623226</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139126</doc-number>
          <kind></kind>
          <date>114/10/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260205B">H04L7/02</main-classification>
        <further-classification edition="200601120260205B">H04L7/04</further-classification>
        <further-classification edition="201501120260205B">H04B3/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴正原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOUNG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金在協</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAEHYUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜大賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, DAE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,844</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/232,856</doc-number>
          <date>20250609</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於資料傳輸的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DATA TRANSMISSION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於資料傳輸的系統及方法。在一些實施例中，一種系統包括相位測試電路，所述相位測試電路包括差偵測電路、低通濾波器電路以及參考比較電路。差偵測電路可被配置成生成具有和第一輸入訊號與第二輸入訊號之間的相位差對應的負載循環的輸出訊號。低通濾波器電路可連接至差偵測電路的輸出，且參考比較電路可被配置成將低通濾波器電路的輸出訊號與臨限值進行比較。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for data transmission. In some embodiments a system includes: a phase-testing circuit, including a difference-detecting circuit, a low-pass filter circuit, and a reference-comparison circuit. The difference-detecting circuit may be configured to produce an output signal having a duty cycle corresponding to a phase difference between a first input signal, and a second input signal. The low-pass filter circuit may be connected to an output of the difference-detecting circuit, and the reference-comparison circuit may be configured to compare an output signal of the low-pass filter circuit and a threshold.</p>
      </isu-abst>
      <representative-img>
        <p type="p">205:相位測試電路</p>
        <p type="p">210:第三輸入</p>
        <p type="p">215:輸出</p>
        <p type="p">220:分頻器</p>
        <p type="p">225:重定時級</p>
        <p type="p">230:差偵測電路</p>
        <p type="p">235、247:低通濾波器</p>
        <p type="p">240:時脈比較器</p>
        <p type="p">245:數位至類比轉換器</p>
        <p type="p">250:數位累加器</p>
        <p type="p">255:可程式化電壓參考電路</p>
        <p type="p">260:比較電路</p>
        <p type="p">CKN:訊號/第二時脈訊號</p>
        <p type="p">CKP:訊號/第一時脈訊號</p>
        <p type="p">VDD/2:值</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="695px" img-content="tif" inline="yes" orientation="portrait" width="971px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623591</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139137</doc-number>
          <kind></kind>
          <date>114/10/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/70</main-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家登精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDENG PRECISION INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MING-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊家和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIA-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾承梧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, CHENG-WU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>粟勁傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOU, JING-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李祐憲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, YU-HSIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏子翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, TZU-HSIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃思婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, SZU-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/722,082</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>支撐裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種支撐裝置，適於配置於一半導體容器內，該支撐裝置包括：一本體，具有相對的一上表面與一下表面；及一承載體，設置於該本體之該上表面，該承載體包括一共用承載部、一第一承載部與一第二承載部；其中，該承載體依據一半導體基板之設計態樣將其配置於該共用承載部與該第一承載部、或該共用承載部與該第二承載部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:本體</p>
        <p type="p">11:上表面</p>
        <p type="p">12:下表面</p>
        <p type="p">2:承載體</p>
        <p type="p">2a:共用承載部</p>
        <p type="p">2b:第一承載部</p>
        <p type="p">2c:第二承載部</p>
        <p type="p">21:接觸面</p>
        <p type="p">22:側壁</p>
        <p type="p">23:承載肋</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="782px" img-content="tif" inline="yes" orientation="portrait" width="642px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623132</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139146</doc-number>
          <kind></kind>
          <date>114/10/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01R31/06</main-classification>
        <further-classification edition="201101120260302B">H01R24/60</further-classification>
        <further-classification edition="201101120260302B">H01R12/72</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商安費諾商用電子産品（成都）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AMPHENOL COMMERCIAL PRODUCTS (CHENGDU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊興瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, XINGRUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒超</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, YAOHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬登斯　科恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MADDENS, KOEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　奇嘉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, KI KA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024225189223</doc-number>
          <date>20241017</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024228365176</doc-number>
          <date>20241120</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2024116668401</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>設備適配器及其電連接器</chinese-title>
        <english-title>DEVICE ADAPTER AND ELECTRICAL CONNECTOR THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備適配器及其電連接器，能夠在保持或提高連接的可靠性的同時快速地將連接器與設備連接和釋放。適配器被配置為固定地設置在設備上。該設備具有配合面和用於與連接器配合的卡邊緣。適配器包括主體，該主體設置在設備的頂部並且延伸超出設備的配合面，以便插入連接器的外殼的上槽中。適配器包括鎖扣，該鎖扣可移動地連接到主體，並且被配置為與連接器鎖定和解鎖。連接器的外殼包括上槽和疊加在上槽的下方的下槽，並且內殼容納在其中。內殼容納導電元件，並且具有被配置為接收設備的卡邊緣的槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Device adapters and electrical connectors thereof that enable quick connection and release of devices with connectors while maintaining or improving connection reliability. An adapter is configured for fixedly disposed on a device. The device has a mating face and a card edge configured for mating with a connector. The adapter comprises a body disposed on a top of the device and extending beyond the mating face of the device so as to insert into an upper slot of an outer housing of the connector. The adapter comprises a latch movably connected to the body and configured for locking and unlocking from the connector. The outer housing of the connector includes the upper slot and a lower slot stacked below the upper slot and holding an inner housing therein. The inner housing holds conductive elements and has a slot configured for receiving the card edge of the device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電子系統</p>
        <p type="p">102:連接器、板連接器</p>
        <p type="p">104:適配器</p>
        <p type="p">106:PCB</p>
        <p type="p">108:設備</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.JPG" file="ed10027.JPG" height="649px" img-content="tif" inline="yes" orientation="portrait" width="1030px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623291</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139154</doc-number>
          <kind></kind>
          <date>114/10/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200901120260223B">H04W36/00</main-classification>
        <further-classification edition="200901120260223B">H04W36/30</further-classification>
        <further-classification edition="200901120260223B">H04W48/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商豐田自動車股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOYOTA JIDOSHA KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇內爾　凱埃里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUNELL, KAI-ERIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水崇之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿澤利爾　克勞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARZELIER, CLAUDE J.F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/705,774</doc-number>
          <date>20241010</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>終端、方法、基地台及通訊系統</chinese-title>
        <english-title>TERMINAL, METHOD, BASE STATION AND COMMUNICATION SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據本揭露之一態樣之一種終端，包括：接收器，配置為接收來自多個小區的訊號；以及處理器，配置為：管理多個第一小區特定計數器，每一計數器分別與該多個小區中的一個相關聯；以及基於各該小區特定計數器的值，自該多個小區中選擇一小區以進行駐留(camp on)。根據本揭露之一態樣，可適當地減少不必要的小區重選擇及/或相關的信令負載。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A terminal according to one aspect of the present disclosure comprising: a receiver configured to receive signals from a plurality of cells; and a processor configured to: manage a plurality of first cell-specific counters, each counter being associated with a respective one of the plurality of cells; and select a cell to camp on from the plurality of cells based on the values of the respective cell-specific counters. According to one aspect of the present disclosure, unnecessary cell reselections and/or the associated signaling load can be reduced appropriately.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.bmp" file="ed10004.bmp" height="712px" img-content="tif" inline="yes" orientation="portrait" width="998px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622335</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139211</doc-number>
          <kind></kind>
          <date>114/10/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251209B">E03D9/08</main-classification>
        <further-classification edition="200601120251209B">A47K7/08</further-classification>
        <further-classification edition="200601120251209B">B05B1/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下住空間股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC HOUSING SOLUTIONS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田達哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207684</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>衛生清洗裝置</chinese-title>
        <english-title>SANITARY WASHING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種衛生清洗裝置，其能以不使用泵之方式，選擇性地產生複數狀態的水流，且進行水流的流量調整。衛生清洗裝置(1)具備噴嘴(2)及切換裝置(47)。噴嘴(2)包含噴嘴頭(20)、主流路(21)及副流路(22)。切換裝置(47)包含第一構件(6)、及對其相對旋轉之第二構件(7)。第一構件(6)包含：主溝部(61)，設有連結至主流路(21)的開口(610)；及副溝部(62)，設有連結至副流路(22)的開口(620)。第二構件(7)包含：主開口(71)，能依照其相對旋轉位置，連通於第一構件(6)的主溝部(61)；及副開口(72)，能依照其相對旋轉位置，連通於第一構件(6)的副溝部(62)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sanitary washing apparatus is provided which is configured to selectively generate water streams in a plurality of states and to adjust flow rates of the water streams without using a flow rate adjusting pump. A sanitary washing apparatus (1) includes a nozzle (2) and a switching device (47). The nozzle (2) includes a nozzle head (20), a main flow path (21), and a sub-flow path (22). The switching device (47) includes a first member (6) and a second member (7) configured to rotate relative to the first member. The first member (6) includes: a main groove part (61) having an opening (610) connected to the main flow path (21); and a sub-groove part (62) having an opening (620) connected to the sub-flow path (22). The second member (7) has: a main opening (71) configured to be communicated with the main groove part (61) of the first member (6) in accordance with a relative rotational position of the second member (7); and a sub-opening (72) configured to be communicated with the sub-groove part (62) of the first member (6) in accordance with the relative rotational position of the second member (7).</p>
      </isu-abst>
      <representative-img>
        <p type="p">6:第一構件</p>
        <p type="p">61:主溝部(溝部)</p>
        <p type="p">610:開口</p>
        <p type="p">615:有底溝部</p>
        <p type="p">62:副溝部(溝部)</p>
        <p type="p">620:開口</p>
        <p type="p">621:有底溝</p>
        <p type="p">622:有底溝</p>
        <p type="p">624:有底溝</p>
        <p type="p">63:淨身用溝部(溝部)</p>
        <p type="p">64:潔淨用溝部(溝部)</p>
        <p type="p">65:中央溝</p>
        <p type="p">7:第二構件</p>
        <p type="p">71:主開口</p>
        <p type="p">72:副開口</p>
        <p type="p">75:中央孔</p>
        <p type="p">d1:第一方向</p>
        <p type="p">R11:第一區域</p>
        <p type="p">R12:第二區域</p>
        <p type="p">R16:最大寬度區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="790px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623460</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139239</doc-number>
          <kind></kind>
          <date>114/10/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10F39/10</main-classification>
        <further-classification edition="202501120260302B">H10F77/14</further-classification>
        <further-classification edition="202501120260302B">H10F77/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桑原洋介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUWAHARA, YOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中野充喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKANO, MITSUYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-200858</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光檢測元件及光檢測元件之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之光檢測元件包含：基板、絕緣層、及具有第1主面及第2主面之半導體層。半導體層具有：第1半導體區域；第2半導體區域，其包圍第1半導體區域；第3半導體區域，其位於較第1半導體區域及第2半導體區域更靠近第2主面，且與第1半導體區域重合；及第4半導體區域，其將第2半導體區域與第3半導體區域電性連接。於半導體層形成有自第1主面到達第3半導體區域之孔部。孔部具有四角錐台形狀或四角錐形狀。第4半導體區域沿著孔部之側面形成。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光檢測元件</p>
        <p type="p">2:基板</p>
        <p type="p">2a,2b:主面</p>
        <p type="p">3:絕緣層(第1絕緣層)</p>
        <p type="p">4:半導體層</p>
        <p type="p">4a:主面(第1主面)</p>
        <p type="p">4b:主面(第2主面)</p>
        <p type="p">4e:外緣</p>
        <p type="p">4f:區域</p>
        <p type="p">5:絕緣層(第2絕緣層)</p>
        <p type="p">5a,6a:表面</p>
        <p type="p">5e:外緣</p>
        <p type="p">6:電極(遮光層)</p>
        <p type="p">6b:部分</p>
        <p type="p">6c:開口</p>
        <p type="p">6e:外緣部分</p>
        <p type="p">7:電極</p>
        <p type="p">41:半導體區域(第1半導體區域)</p>
        <p type="p">42:半導體區域(第2半導體區域)</p>
        <p type="p">43:半導體區域(第3半導體區域)</p>
        <p type="p">44:半導體區域(第4半導體區域)</p>
        <p type="p">47:側面</p>
        <p type="p">51:第1層</p>
        <p type="p">51b,52b:部分</p>
        <p type="p">51c:開口</p>
        <p type="p">52:第2層</p>
        <p type="p">52a:表面</p>
        <p type="p">X,Y,Z:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="726px" img-content="tif" inline="yes" orientation="portrait" width="950px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622465</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139254</doc-number>
          <kind></kind>
          <date>114/10/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260219B">G01B21/20</main-classification>
        <further-classification edition="200601120260219B">G01B11/16</further-classification>
        <further-classification edition="200601120260219B">B29D7/01</further-classification>
        <further-classification edition="200601120260219B">B65H23/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>細谷涼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOSOYA, RYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村岡敦史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAOKA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207317</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>薄膜之捲曲評價方法及薄膜製品之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]正確地評價薄膜片的實際的捲曲的程度。&lt;br/&gt;  [解決手段]一種捲曲評價方法，具有以下步驟：將薄膜片1的第1方向D1設成與鉛直方向V大致平行，且使前述薄膜片1的與第1方向D1正交之方向即第2方向中央部附著於支撐構件3，藉此以已將附著於前述支撐構件3之區域以外的區域設為自由之狀態來使前述薄膜片1支撐於前述支撐構件3；及評價前述薄膜片1的沿著第2方向D2之捲曲的程度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:薄膜片</p>
        <p type="p">1a:薄膜片的第1方向一端部</p>
        <p type="p">1b:薄膜片的第1方向相反端部</p>
        <p type="p">1c:薄膜片的第2方向一邊緣</p>
        <p type="p">1d:薄膜片的第2方向相反邊緣</p>
        <p type="p">1W:薄膜片1的第2方向的最大長度</p>
        <p type="p">3:支撐構件</p>
        <p type="p">31:支撐面部</p>
        <p type="p">33:腳部</p>
        <p type="p">5:固定構件</p>
        <p type="p">51:固定部本體</p>
        <p type="p">52:提鈕部</p>
        <p type="p">6:載置台</p>
        <p type="p">A:捲曲測定裝置</p>
        <p type="p">D1:薄膜片的第1方向</p>
        <p type="p">D2:薄膜片的第2方向</p>
        <p type="p">V:鉛直方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.png" file="d10028.TIF" giffile="ed10028.png" height="935px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623584</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139258</doc-number>
          <kind></kind>
          <date>114/10/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/50</main-classification>
        <further-classification edition="200601120260302B">G01B11/03</further-classification>
        <further-classification edition="201201120260302B">G03F1/72</further-classification>
        <further-classification edition="201201120260302B">G03F1/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東方晶源微電子科技(北京)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGFANG JINGYUAN ELECTRON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓春營</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, CHUN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MI, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊延德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YAN-DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓曉輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, XIAO-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林坤成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116771313</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鐳射定位裝置及晶圓檢測系統</chinese-title>
        <english-title>LASER POSITIONING DEVICE AND WAFER INSPECTION SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開了一種鐳射定位裝置及晶圓檢測系統，該鐳射定位裝置包括載物台、正交性測試回饋元件和光路元件；所述載物台包括移動機構、承載件和測量鏡，所述移動機構用於帶動所述承載件在第一方向和第二方向上移動，所述測量鏡安裝在所述承載件上，所述測量鏡的第一測量面與所述第一方向相交、第二測量面與所述第二方向相交；所述正交性測試回饋元件設有第一測量頭和第二測量頭，所述第一測量頭沿所述第一方向朝所述第一測量面發射第一雷射光束，所述第二測量頭發射第二雷射光束；所述光路元件用於將所述第二雷射光束分為多束第三雷射光束並沿所述第二方向射向所述第二測量面。通過第一雷射光束與多束第三雷射光束可提供多點的高精度定位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The disclosure provides a laser positioning device and a wafer inspection system. The laser positioning device includes a wafer stage, an orthogonality test feedback component, and an optical path component. The wafer stage includes a moving mechanism, a carrying member, and a measurement mirror. The moving mechanism drives the carrying member to move in a first direction and a second direction. The measurement mirror is mounted on the carrying member, with a first measurement surface of the measurement mirror intersecting the first direction and a second measurement surface intersecting the second direction. The orthogonality test feedback component is provided with a first measurement head and a second measurement head. The first measurement head emits a first laser beam toward the first measurement surface along the first direction, and the second measurement head emits a second laser beam. The optical path component splits the second laser beam into a plurality of third laser beams and direct them toward the second measurement surface along the second direction. High-precision multi-point positioning can be achieved through the first laser beam and the third laser beams.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:載物台</p>
        <p type="p">11:移動機構</p>
        <p type="p">111:第二移動機構</p>
        <p type="p">1111:第二光柵尺</p>
        <p type="p">112:第一移動機構</p>
        <p type="p">1121:第一光柵尺</p>
        <p type="p">12:承載件</p>
        <p type="p">13:測量鏡</p>
        <p type="p">131:第一測量面</p>
        <p type="p">132:第二測量面</p>
        <p type="p">2:正交性測試回饋組件</p>
        <p type="p">21:第一測量頭</p>
        <p type="p">22:第二測量頭</p>
        <p type="p">23:正交性測試回饋主體</p>
        <p type="p">3:光路組件</p>
        <p type="p">4:晶圓</p>
        <p type="p">5:第一雷射光束</p>
        <p type="p">6:第二雷射光束</p>
        <p type="p">7:第三雷射光束</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="505px" img-content="tif" inline="yes" orientation="portrait" width="722px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623314</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139268</doc-number>
          <kind></kind>
          <date>114/10/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260210B">H05H1/46</main-classification>
        <further-classification edition="200601120260210B">C23C16/455</further-classification>
        <further-classification edition="200601120260210B">C23C16/50</further-classification>
        <further-classification edition="200601120260210B">B01D53/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓國核融合能源研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOREA INSTITUTE OF FUSION ENERGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪鏞澈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, YOUNGCHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申東勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, DONGHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>千世珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEON, SEMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭相允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, SANGYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>時渝恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0164457</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於分解並氧化在低壓工藝中產生的未反應物質的等離子體系統</chinese-title>
        <english-title>PLASMA SYSTEM FOR DECOMPOSING AND OXIDIZING UNREACTED SUBSTANCES GENERATED IN A LOW-PRESSURE PROCESS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種用於分解並氧化在低壓工藝中產生的未反應物質的等離子體系統，其中，包括：真空泵，用於維持執行低壓工藝的低壓腔室的低壓；流路，設置於該真空泵與該工藝腔室之間；以及等離子體發生裝置，安裝在該流路上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a plasma system for decomposing and oxidizing unreacted substances generated in a low-pressure process. The system includes: a vacuum pump configured to maintain a low pressure in a chamber where the low-pressure process is performed; a flow path disposed between the vacuum pump and the process chamber; and a plasma generating device installed on the flow path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:工藝腔室</p>
        <p type="p">200:真空泵</p>
        <p type="p">300:流路</p>
        <p type="p">400:等離子體發生裝置</p>
        <p type="p">500:洗滌器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="743px" img-content="tif" inline="yes" orientation="portrait" width="689px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622055</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139295</doc-number>
          <kind></kind>
          <date>114/10/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/12</main-classification>
        <further-classification edition="200601120260302B">C07D207/16</further-classification>
        <further-classification edition="200601120260302B">A61K31/4439</further-classification>
        <further-classification edition="200601120260302B">A61K31/40</further-classification>
        <further-classification edition="200601120260302B">A61K31/454</further-classification>
        <further-classification edition="200601120260302B">A61P3/10</further-classification>
        <further-classification edition="200601120260302B">A61P3/00</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商輝瑞大藥廠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFIZER INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲里斯基　凱文　詹姆士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FILIPSKI, KEVIN JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
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                <last-name>里維　山繆　麥可</last-name>
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                <last-name>LEVI, SAMUEL MICHAEL</last-name>
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                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>馬堤奈茲　艾爾席那　路易斯　安琪</last-name>
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              <english-name name-type="organization">
                <last-name>MARTINEZ ALSINA, LUIS ANGEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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                <last-name>李斯　馬修　理查德</last-name>
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                <last-name>REESE, MATTHEW RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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              <chinese-name name-type="organization">
                <last-name>薩蒙斯　馬修　佛瑞斯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMMONS, MATTHEW FORREST</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王陽</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>WANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
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              <address>臺北市</address>
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          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣大中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/706,706</doc-number>
          <date>20241013</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/874,204</doc-number>
          <date>20250902</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>葡萄糖依賴性胰島素促分泌多肽受體拮抗劑及其用途</chinese-title>
        <english-title>GLUCOSE-DEPENDENT INSULINOTROPIC POLYPEPTIDE RECEPTOR ANTAGONISTS AND USES THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文闡述式I化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="424px" width="418px" file="ed10077.JPG" alt="ed10077.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;及其醫藥上可接受之鹽，其中R&lt;sup&gt;1&lt;/sup&gt;、R&lt;sup&gt;2&lt;/sup&gt;、R&lt;sup&gt;3&lt;/sup&gt;、A&lt;sup&gt;1&lt;/sup&gt;、L&lt;sup&gt;1&lt;/sup&gt;、L&lt;sup&gt;2&lt;/sup&gt;、T&lt;sup&gt;1&lt;/sup&gt;、T&lt;sup&gt;2&lt;/sup&gt;、T&lt;sup&gt;3&lt;/sup&gt;、T&lt;sup&gt;4&lt;/sup&gt;、n1、t1及t2如本文所定義；其作為GIPR拮抗劑之用途；含有該等化合物及鹽之醫藥組合物；及該等化合物及鹽之用途，其用於治療或預防例如肥胖症、增重及/或T2DM。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Described herein are compounds of Formula I: &lt;br/&gt;&lt;img align="absmiddle" height="420px" width="442px" file="ed10078.JPG" alt="ed10078.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;and their pharmaceutically acceptable salts, wherein R&lt;sup&gt;1&lt;/sup&gt;, R&lt;sup&gt;2&lt;/sup&gt;, R&lt;sup&gt;3&lt;/sup&gt;, A&lt;sup&gt;1&lt;/sup&gt;, L&lt;sup&gt;1&lt;/sup&gt;, L&lt;sup&gt;2&lt;/sup&gt;, T&lt;sup&gt;1&lt;/sup&gt;, T&lt;sup&gt;2&lt;/sup&gt;, T&lt;sup&gt;3&lt;/sup&gt;, T&lt;sup&gt;4&lt;/sup&gt; , n1, t1, and t2 are defined herein; their use as GIPR antagonists; pharmaceutical compositions containing such compounds and salts; and the use of such compounds and salts to treat or prevent, for example, obesity, weight gain, and/or T2DM.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
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          <kind></kind>
          <date>115/06/01</date>
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          <doc-number>114139331</doc-number>
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        <main-classification edition="200601120260202B">G06T1/20</main-classification>
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        <further-classification edition="201801120260202B">G06F9/38</further-classification>
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                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
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              <english-address>US</english-address>
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          </applicant>
        </applicants>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>杜　云</last-name>
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                <last-name>DU, YUN</last-name>
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                <last-name>魏斐</last-name>
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                <last-name>WEI, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
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                <last-name>夏陽</last-name>
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                <last-name>何　建德</last-name>
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                <last-name>HO, CHIENTE</last-name>
                <middle-name></middle-name>
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              <english-address>US</english-address>
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                <last-name>周夢博</last-name>
                <first-name></first-name>
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                <last-name>ZHOU, MENGBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
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              <chinese-name name-type="organization">
                <last-name>威博沃　巴古斯　普拉塞提約</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIBOWO, BAGUS PRASETYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>ID</english-country>
              <english-address>ID</english-address>
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              <chinese-name name-type="organization">
                <last-name>姚嘉</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>YAO, JIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古魯伯　安德魯　伊文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRUBER, ANDREW EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>于　春</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>YU, CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德梅爾　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMERS, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
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        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/962,979</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>加速圖形處理中的基本功能單元（ＥＦＵ）執行</chinese-title>
        <english-title>ACCELERATING ELEMENTARY FUNCTION UNIT (EFU) EXECUTION IN GRAPHICS PROCESSING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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    <description>
      <isu-abst lang="tw">
        <p type="p">本文呈現的態樣係關於用於圖形處理的方法及裝置，其包括一設備，例如GPU。該設備可獲得一圖形操作之一指示，其中該圖形操作與一資料區塊中的資料相關聯。該設備亦可判定該資料區塊中的至少一些資料的一值是否與該資料區塊中的至少一些其他資料的一值一致。進一步地，該設備可基於該資料區塊中的該至少一些資料的該值與該資料區塊中的該至少一些其他資料的該值一致而避免執行該資料區塊中的該至少一些資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects presented herein relate to methods and devices for graphics processing including an apparatus, e.g., a GPU. The apparatus may obtain an indication of a graphics operation, where the graphics operation is associated with data in a data block. The apparatus may also determine whether a value for at least some data in the data block is identical to a value for at least some other data in the data block. Further, the apparatus may refrain from executing the at least some data in the data block based on the value for the at least some data in the data block being identical to the value for the at least some other data in the data block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1400:通訊流程圖</p>
        <p type="p">1402:圖形處理器</p>
        <p type="p">1404:CPU/GPU</p>
        <p type="p">1406:記憶體</p>
        <p type="p">1410:步驟</p>
        <p type="p">1412:指示</p>
        <p type="p">1420,1430,1440,1450,1460,1470,1480:步驟</p>
        <p type="p">1482,1484:指示</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="749px" img-content="tif" inline="yes" orientation="portrait" width="1045px">
          </img>
        </representative>
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          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114139371</doc-number>
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                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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          </applicant>
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                <last-name>宋濤</last-name>
                <first-name></first-name>
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                <last-name>SONG, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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                <last-name>劉琨</last-name>
                <first-name></first-name>
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                <last-name>LIU, KUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
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                <last-name>鄭峰</last-name>
                <first-name></first-name>
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                <last-name>ZHENG, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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                <last-name>李興玉</last-name>
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                <last-name>LI, XINGYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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                <last-name>蘭金闖</last-name>
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                <last-name>LAN, JINCHUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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                <last-name>汪元鑫</last-name>
                <first-name></first-name>
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                <last-name>WANG, YUANXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
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              <chinese-name name-type="organization">
                <last-name>苟中凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOU, ZHONGFA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024114189351</doc-number>
          <date>20241011</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>第一端子模組以及第一背板連接器</chinese-title>
        <english-title>FIRST TERMINAL MODULE AND FIRST BACKPLANE CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種第一端子模組包括複數第一導電端子、第一屏蔽套筒以及延伸屏蔽殼體組件。前述第一導電端子包括第一訊號端子以及第二訊號端子，前述第一訊號端子以及前述第二訊號端子均包括第一接觸部。前述延伸屏蔽殼體組件包括屏蔽腔體以及暴露於前述屏蔽腔體中的第二彈片。前述第一訊號端子的第一接觸部以及前述第二訊號端子的第一接觸部凸伸入前述延伸屏蔽殼體組件的屏蔽腔體中。前述第二彈片始終與前述第一屏蔽套筒相接觸。如此設置，本發明有利於改善對第一導電端子的屏蔽效果。本發明還揭示了具有前述第一端子模組的第一背板連接器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A first terminal module includes a number of first conductive terminals, a first shielding sleeve and an extension shielding shell assembly. The first conductive terminals include a first signal terminal and a second signal terminal. Each of the first signal terminal and the second signal terminal includes a first contact portion. The extension shielding shell assembly includes a shielding chamber and a second elastic piece exposed in the shielding chamber. The first contact portion of the first signal terminal and the first contact portion of the second signal terminal protrude into the shielding chamber. The second elastic piece is always in contact with the first shielding sleeve. With this arrangement, the present disclosure is beneficial to improving the shielding effect on the first conductive terminal. A first backplane connector having the first terminal module is also disclosed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">25:第一屏蔽套筒</p>
        <p type="p">263:第一連接屏蔽片</p>
        <p type="p">264:第二連接屏蔽片</p>
        <p type="p">265a1:第一彈臂</p>
        <p type="p">265a2:第二彈臂</p>
        <p type="p">265b1:第三彈臂</p>
        <p type="p">265b2:第四彈臂</p>
        <p type="p">266a1:第五彈臂</p>
        <p type="p">266a2:第六彈臂</p>
        <p type="p">266b1:第七彈臂</p>
        <p type="p">266b2:第八彈臂</p>
        <p type="p">65:第二屏蔽套筒</p>
        <p type="p">H:圖55中畫框部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10134.JPG" file="ed10134.JPG" height="519px" img-content="tif" inline="yes" orientation="portrait" width="751px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622172</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139402</doc-number>
          <kind></kind>
          <date>114/10/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">C08L61/34</main-classification>
        <further-classification edition="200601120251201B">C08L79/04</further-classification>
        <further-classification edition="200601120251201B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商第一工業製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DKS CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉岡汰玖哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIOKA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村上賢志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAMI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206469</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>樹脂組成物及其硬化物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的課題在於提高硬化物的玻璃轉移溫度。實施形態的樹脂組成物包含式（1）所表示的化合物以及式（2）所表示的化合物。式（1）中，R&lt;sup&gt;1&lt;/sup&gt;表示可包含雜原子的二價烴基，R&lt;sup&gt;2&lt;/sup&gt;及R&lt;sup&gt;3&lt;/sup&gt;分別獨立地表示碳數1～10的烷二基，R&lt;sup&gt;4&lt;/sup&gt;及R&lt;sup&gt;5&lt;/sup&gt;分別獨立地表示氫原子或甲基，R&lt;sup&gt;6&lt;/sup&gt;及R&lt;sup&gt;7&lt;/sup&gt;分別獨立地表示甲基或乙基，p及q分別獨立地表示0～2的整數。式（2）中，R&lt;sup&gt;8&lt;/sup&gt;表示可包含雜原子的二價烴基。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="347px" width="554px" file="ed10031.JPG" alt="ed10031.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621615</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139428</doc-number>
          <kind></kind>
          <date>114/10/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260227B">A47J31/06</main-classification>
        <further-classification edition="200601120260227B">A47J31/02</further-classification>
        <further-classification edition="200601120260227B">B65D85/812</further-classification>
        <further-classification edition="200601120260227B">B65D85/804</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大紀商事股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHKI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斎藤充範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAITO, MITSUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-188632</doc-number>
          <date>20241025</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>濾掛袋</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之濾掛袋1A包含：袋本體11，其由通水過濾性片材形成；鉤掛構件20，其由設置於袋本體11之對向之2個外表面之薄板狀材料形成；及萃取材料，其填充於袋本體11。濾掛袋1A之開封用穿孔線30係沿著濾掛袋之上邊2自濾掛袋A之對向之一對側邊3a、3b之一者形成至另一者。開封用穿孔線30具有袋本體11之穿孔線31與鉤掛構件之穿孔線32之重疊區域，具有朝濾掛袋1A之上邊側凸出或朝下邊側凸出之凸形狀S1，凸形狀S1與濾掛袋之寬度之中心線Lc重疊。根據濾掛袋1A，開封用穿孔線30容易撕開，可獲得較大之開口形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:濾掛袋</p>
        <p type="p">2:濾掛袋之上邊</p>
        <p type="p">3a,3b:濾掛袋之側邊</p>
        <p type="p">4:濾掛袋之下邊</p>
        <p type="p">10:通水過濾性片材</p>
        <p type="p">11:袋本體</p>
        <p type="p">20:鉤掛構件</p>
        <p type="p">21:鉤掛部</p>
        <p type="p">22:上部貼著部</p>
        <p type="p">22a:正反之上部貼著部之連續部分</p>
        <p type="p">23:開口端支持用貼著部</p>
        <p type="p">24:第1中央貼著部</p>
        <p type="p">25:第2中央貼著部</p>
        <p type="p">26:補強部</p>
        <p type="p">27:缺口</p>
        <p type="p">30:開封用穿孔線</p>
        <p type="p">31:袋本體之穿孔線</p>
        <p type="p">32:鉤掛構件之穿孔線</p>
        <p type="p">33:階差</p>
        <p type="p">Lc:濾掛袋之寬度之中心線</p>
        <p type="p">P1:凸形狀之頂點、V字型之頂點</p>
        <p type="p">S1:凸形狀</p>
        <p type="p">S2:V字型</p>
        <p type="p">W1:濾掛袋之寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="753px" img-content="tif" inline="yes" orientation="portrait" width="660px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622778</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139504</doc-number>
          <kind></kind>
          <date>114/10/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260112B">G06F17/16</main-classification>
        <further-classification edition="200601120260112B">G06F7/38</further-classification>
        <further-classification edition="200601120260112B">G06F9/302</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西班牙商半動力科技服務有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMIDYNAMICS TECHNOLOGY SERVICES, S.L.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒙塔內斯　約瑟　瑪利亞　阿諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONTANES, JOSE MARIA ARNAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬賽羅　帕斯卡爾　佩德洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARCUELLO PASCUAL, PEDRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莫亞　戴爾　巴里歐　維克多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOYA DEL BARRIO, VICTOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾斯帕薩　桑斯　羅傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ESPASA SANS, ROGER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24383246.6</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>執行矩陣乘法之電腦指令</chinese-title>
        <english-title>PERFORMING A COMPUTER INSTRUCTION OF MATRIX MULTIPLICATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供在具有控制暫存器及向量暫存器之處理器中執行矩陣乘法指令之方法，這些向量暫存器之長度在該控制暫存器中指示，該矩陣乘法為A×B=C，其中A為具有位元寬度1之元素之M×K矩陣，B為具有位元寬度2之分量之K×N矩陣，且C為具有位元寬度3之項之M×N矩陣。該指令對欲執行之一乘法類型進行編碼，且具有參數1、參數2及參數3，分別指示這些元素、這些分量及這些項被依序儲存於哪些向量暫存器中。此類方法包含在運行時間中執行以下步驟：自控制暫存器獲得長度；對指令進行解碼以獲得乘法類型；取決於乘法類型而判定位元寬度1及位元寬度2；取決於該長度以及該位元寬度1及該位元寬度2而判定M值、N值及K值；以及考慮到參數1、參數2及參數3、位元寬度1及位元寬度2以及M值、N值及K值而執行該矩陣乘法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods of performing matrix multiplication instruction in a processor having control register and vector registers whose length is indicated in the control register, the matrix multiplication being A×B=C, wherein A is an M×K matrix of elements with bitwidth-1, B is a K×N matrix of components with bitwidth-2, and C is an M×N matrix of items with bitwidth-3. The instruction codifies a multiplication type to be performed and has parameter-1, parameter-2 and parameter-3 indicating in which vector registers the elements, components and items are sequentially stored, respectively. Such methods comprise performing, in runtime, following steps: obtaining length from control register; decoding instruction to obtain multiplication type; determining bitwidth-1 and bitwidth- 2 depending on multiplication type; determining value of M, N and K depending on the length and bitwidth-1 and bitwidth-2; and performing the matrix multiplication taking into account parameter-1, parameter-2 and parameter-3, bitwidth-1 and bitwidth-2, and value of M, N and K.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統/矩陣乘法系統</p>
        <p type="p">101:長度模組</p>
        <p type="p">102:解碼模組</p>
        <p type="p">103:位元寬度模組</p>
        <p type="p">104:維度模組</p>
        <p type="p">105:乘法模組</p>
        <p type="p">106:作業碼</p>
        <p type="p">107:欲執行之乘法之類型/欲執行之相乘之類型</p>
        <p type="p">108:向量長度</p>
        <p type="p">109:第一及第二位元寬度</p>
        <p type="p">110:M值、N值及K值</p>
        <p type="p">111:第一、第二及第三矩陣參數</p>
        <p type="p">112:向量暫存器</p>
        <p type="p">113:第n控制暫存器</p>
        <p type="p">114:第一控制暫存器</p>
        <p type="p">115:第二控制暫存器(sCR)</p>
        <p type="p">116:處理器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="694px" img-content="tif" inline="yes" orientation="portrait" width="932px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621948</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139529</doc-number>
          <kind></kind>
          <date>114/10/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251128B">B65B17/00</main-classification>
        <further-classification edition="200601120251128B">B65D85/48</further-classification>
        <further-classification edition="200601120251128B">B65G49/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大藤正直</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OFUJI, MASANAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205464</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>玻璃板捆包體的製造方法以及製造裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種玻璃板捆包體的製造方法。所述製造方法包括：藉由裝載裝置5搬送重疊玻璃板1以及保護片2而成的堆疊體3的搬送工程；以及藉由裝載裝置5將堆疊體3裝載於托板4的裝載工程。保護片2具有從玻璃板1的外周突出的突出部2a、2b。裝載裝置5包括吸附部9、10以及夾持部11。在搬送工程中，在藉由吸附部9、10吸附玻璃板1以及突出部2a，2b，且藉由夾持部11夾持了突出部2a的狀態下，搬送堆疊體3。在裝載工程中，在解除藉由夾持部11對突出部2a的夾持，且藉由吸附部9、10吸附玻璃板1以及突出部2a、2b的狀態下，將堆疊體3裝載於托板4。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:玻璃板</p>
        <p type="p">1x、2x:第一主面</p>
        <p type="p">1y、2y:第二主面</p>
        <p type="p">2:保護片</p>
        <p type="p">2a:第一突出部</p>
        <p type="p">3:堆疊體</p>
        <p type="p">7:保持部</p>
        <p type="p">8:基體</p>
        <p type="p">9:第一吸附部</p>
        <p type="p">10:第二吸附部</p>
        <p type="p">11:夾持部</p>
        <p type="p">11a:可動爪部</p>
        <p type="p">11b:固定爪部</p>
        <p type="p">12、13:支撐體</p>
        <p type="p">14:退避機構</p>
        <p type="p">P1:夾持位置</p>
        <p type="p">P2:退避位置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="613px" img-content="tif" inline="yes" orientation="portrait" width="656px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622971</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139601</doc-number>
          <kind></kind>
          <date>114/10/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">G11C11/419</main-classification>
        <further-classification edition="200601120260202B">G11C11/413</further-classification>
        <further-classification edition="200601120260202B">G11C7/22</further-classification>
        <further-classification edition="200601120260202B">G11C7/06</further-classification>
        <further-classification edition="200601120260202B">H03K5/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南丹瓦爾　達尚　庫馬爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANDANWAR, DARSHAN KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哥薩利亞　安基特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOSALIA, ANKIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽義德　卡里穆拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYED, KARIMULLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬雷　羅希特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAUREY, ROHIT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克里希納普莉亞　坎班帕蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRISHNAPRIYA, KAMBHAMPATI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/959,239</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體中之時序邊限誤差的偵測及補償</chinese-title>
        <english-title>DETECTION AND COMPENSATION OF TIMING MARGIN ERRORS IN MEMORY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露係關於一種用於操作一記憶體之方法。該方法包括：當從該記憶體之一或多個記憶體單元讀取資料時或當向該記憶體之該一或多個記憶體單元寫入資料時，感測該記憶體之一位元線的在一第一狀態與一第二狀態之間轉變的一位元線信號。該方法包括：至少部分地基於與在該第一狀態與該第二狀態之間轉變的該位元線信號相關聯的一延遲，而偵測該記憶體中之一時序邊限誤差。該方法包括：調整與該記憶體相關聯的一參數以補償該時序邊限誤差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure is directed to a method for operating a memory. The method includes sensing a bit line signal for a bit line of the memory transitioning between a first state and a second state when data is read from one or more memory cells of the memory or when data is written to the one or more memory cells of the memory. The method includes detecting a timing margin error in the memory based, at least in part, on a delay associated with the bit line signal transitioning between the first state and the second state. The method includes adjusting a parameter associated with the memory to compensate for the timing margin error.</p>
      </isu-abst>
      <representative-img>
        <p type="p">700:比較器；轉變比較器</p>
        <p type="p">702:第一逆變器</p>
        <p type="p">704:第二逆變器</p>
        <p type="p">706:第一NAND閘</p>
        <p type="p">708:第二NAND閘</p>
        <p type="p">710:正反器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.png" file="d10021.TIF" giffile="ed10021.png" height="1089px" img-content="tif" inline="yes" orientation="portrait" width="783px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622885</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139602</doc-number>
          <kind></kind>
          <date>114/10/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">G06T1/60</main-classification>
        <further-classification edition="200601120260223B">G06T1/20</further-classification>
        <further-classification edition="200601120260223B">G06F9/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杜　云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DU, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏斐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚洪江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANG, HONGJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　建德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, CHIENTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONG, GANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧昇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比哈拉瓦喬蘇拉　賽　拉梅什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHYRAVAJOSULA, SAI RAMESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾　其鴻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHIHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古魯伯　安德魯　伊文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRUBER, ANDREW EVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>于　春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="12">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德梅爾　艾瑞克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMERS, ERIC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/962,914</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>加速圖形處理中的基本功能單元（ＥＦＵ）及算術邏輯單元（ＡＬＵ）執行</chinese-title>
        <english-title>ACCELERATING ELEMENTARY FUNCTION UNIT (EFU) AND ARITHMETIC LOGIC UNIT (ALU) EXECUTION IN GRAPHICS PROCESSING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文呈現的態樣係關於用於圖形處理的方法及裝置，其包括一設備，例如GPU。該設備可獲得用於在一GPU的一資料讀取/寫入程序的一指令集。該設備亦可獲得在用於該指令集中的一第一指令的第一資訊與用於該指令集中的一第二指令的第二資訊之間的一相依性的一指示，其中該第一指令與一第一組件相關聯，且該第二指令與一第二組件相關聯。進一步地，該設備可判定在該GPU之用於該第一指令的該第一資訊的儲存空間的一量。該設備亦可基於在該GPU的該儲存空間的該量，將用於該第一指令的該第一資訊儲存在在該GPU的一第一記憶體或在該GPU的一第二記憶體中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects presented herein relate to methods and devices for graphics processing including an apparatus, e.g., a GPU. The apparatus may obtain a set of instructions for a data read/write process at a GPU. The apparatus may also obtain an indication of a dependency between first information for a first instruction in the set of instructions and second information for a second instruction in the set of instructions, where the first instruction is associated with a first component and the second instruction is associated with a second component. Further, the apparatus may determine an amount of storage space at the GPU for the first information for the first instruction. The apparatus may also store, based on the amount of the storage space at the GPU, the first information for the first instruction in a first memory at the GPU or a second memory at the GPU.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1300:通訊流程圖；圖</p>
        <p type="p">1302:GPU</p>
        <p type="p">1304:CPU</p>
        <p type="p">1306:記憶體</p>
        <p type="p">1310:步驟</p>
        <p type="p">1312:指示</p>
        <p type="p">1314:步驟</p>
        <p type="p">1316:步驟</p>
        <p type="p">1318:步驟</p>
        <p type="p">1320:步驟</p>
        <p type="p">1330:步驟</p>
        <p type="p">1332:指示</p>
        <p type="p">1340:步驟</p>
        <p type="p">1350:步驟</p>
        <p type="p">1360:步驟</p>
        <p type="p">1370:步驟</p>
        <p type="p">1380:步驟</p>
        <p type="p">1382:指示</p>
        <p type="p">1384:指示</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.JPG" file="ed10028.JPG" height="758px" img-content="tif" inline="yes" orientation="portrait" width="1042px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623296</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139624</doc-number>
          <kind></kind>
          <date>114/10/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260228B">H04W72/541</main-classification>
        <further-classification edition="202401120260228B">H04W74/0808</further-classification>
        <further-classification edition="200901120260228B">H04W16/14</further-classification>
        <further-classification edition="200901120260228B">H04W24/02</further-classification>
        <further-classification edition="200901120260228B">H04W84/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商皇家飛利浦有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KONINKLIJKE PHILIPS N.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴伊卡斯　圖瑟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAYKAS, TUNCER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪南　埃斯梅爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DINAN, ESMAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃爾庫克　塞爾哈特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ERKUCUK, SERHAT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金丁起</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JEONGKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉南特　萊昂納多　阿利薩西斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LANANTE, LEONARDO ALISASIS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
              <english-address>PH</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/706,866</doc-number>
          <date>20241014</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>非主通道存取（ＮＰＣＡ）切換操作</chinese-title>
        <english-title>NON-PRIMARY CHANNEL ACCESS (NPCA) SWITCHING OPERATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">通道切換係一種用以幫助應對干擾的機制。為了促進通道切換，提供一種方法，其包含：由一第一或第二站(station, STA)且經由一主通道偵測一重疊基本服務集(overlapping basic service set, OBSS)實體層協定資料單元(physical layer protocol data unit, PPDU)。在偵測到該OBSS PPDU之後，該方法包含：由第一STA基於由該第一STA使用的一第一非主通道存取(non-primary channel access, NPCA)切換模式自該主通道切換至一NPCA主通道；及由該第一STA經由包含該NPCA主通道的一頻寬向接收一第一訊框的一第二STA傳輸該第一訊框，其中該第一訊框的一傳輸時間係基於由該第二STA使用的一第二NPCA切換模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Channel switching is a mechanism used to help cope with interference. To facilitate channel switching, there is provided a method which comprises detecting, by a first or second station (STA) and via a primary channel, an overlapping basic service set (OBSS) physical layer protocol data unit (PPDU). After detecting the OBSS PPDU, the method comprises switching, by first STA, from the primary channel to a non-primary channel access (NPCA) primary channel based on a first NPCA switching mode used by the first STA and transmitting, by the first STA to a second STA, which receives it, a first frame via a bandwidth comprising the NPCA primary channel, wherein a transmission time of the first frame is based on a second NPCA switching mode used by the second STA.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1400:實例</p>
        <p type="p">1402,1404:STA</p>
        <p type="p">1406,1408,1410,1414,1416,1418,1420:訊框</p>
        <p type="p">1412:OBSS PPDU/PPDU</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="1047px" img-content="tif" inline="yes" orientation="portrait" width="652px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622991</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139652</doc-number>
          <kind></kind>
          <date>114/10/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260223B">G16H30/20</main-classification>
        <further-classification edition="201701120260223B">G06T7/11</further-classification>
        <further-classification edition="201601120260223B">A61B34/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>智捷醫學科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INTELLIGEN TECHNOLOGY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫継信</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, CHI-SING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/714,875</doc-number>
          <date>20241101</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/714,876</doc-number>
          <date>20241101</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/714,878</doc-number>
          <date>20241101</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>美國</country>
          <doc-number>63/714,879</doc-number>
          <date>20241101</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>醫學影像處理系統</chinese-title>
        <english-title>MEDICAL IMAGE PROCESSING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種醫學影像處理系統，包括通訊模組、影像處理模組及三維建模模組。上述通訊模組通訊連接使用者裝置。上述選擇比對模組供主機選擇多個醫療影像的轉換部位後，與預設部位資訊進行比對，以確認轉換部位符合預設部位資訊中所對應之器官或組織部位。上述影像處理模組判別醫療影像之種類，並將其轉換為RAS（Right-Anterior-Superior）座標系統之格式，並對轉換後之醫療影像執行器官或病灶區域之自動辨識與分割，產生對應之一彩色分割遮罩。上述三維建模模組依據彩色分割遮罩產生對應之一三維立體模型，並生成立體模型檔案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a medical image processing system, which includes a communication module, an image processing module, and a three-dimensional modeling module. The communication module is configured for communication with a user device. A selection and comparison module enables a host to select conversion regions of multiple medical images and compare the selected regions with preset region information, so as to verify that the conversion regions correspond to organs or tissue regions defined in the preset region information. The image processing module identifies the type of medical image, converts the image into a format of the RAS (Right-Anterior-Superior) coordinate system, and performs automatic recognition and segmentation of organs or lesion areas in the converted medical image to generate a corresponding color segmentation mask. The three-dimensional modeling module generates a corresponding three-dimensional model based on the color segmentation mask and produces a three-dimensional model file.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:醫學影像處理系統</p>
        <p type="p">110:通訊模組</p>
        <p type="p">120:選擇比對模組</p>
        <p type="p">122:預設部位資訊</p>
        <p type="p">130:影像處理模組</p>
        <p type="p">140:三維建模模組</p>
        <p type="p">142:三維立體模型</p>
        <p type="p">150:影像遮罩資料庫</p>
        <p type="p">160:使用者裝置</p>
        <p type="p">170:主機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="654px" img-content="tif" inline="yes" orientation="portrait" width="567px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621830</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139762</doc-number>
          <kind></kind>
          <date>114/10/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260217B">B23K26/08</main-classification>
        <further-classification edition="201401120260217B">B23K26/36</further-classification>
        <further-classification edition="200601120260217B">G01N1/32</further-classification>
        <further-classification edition="200601120260217B">G02B26/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原佳祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武田昂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEDA, AKIRA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大石大輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OISHI, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福神純平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUJIN, JUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202101</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯微鏡裝置及觀察方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本揭示係一種觀察方法，其係藉由向對象物之表面照射雷射光，而於對象物形成具有與表面交叉之加工剖面之加工區，並觀察加工剖面之方法，且具備：加工工序，其於表面垂直於第1方向之情形時，於加工區包含排列於第2方向之複數個線、即分別於第3方向延伸之複數個線時，於雷射光相對於表面之入射方向相對於第1方向朝第2方向上之一側傾斜之狀態下，一面將雷射光朝向對象物聚光一面使雷射光之照射區域沿複數個線各者移動；及觀察工序，其將加工區中第2方向上之一側之端面作為加工剖面而觀察。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A:試料(對象物)</p>
        <p type="p">A1:表面</p>
        <p type="p">CV:凹部</p>
        <p type="p">D0:入射方向</p>
        <p type="p">D1:第1方向</p>
        <p type="p">D2:第2方向</p>
        <p type="p">D3:第3方向</p>
        <p type="p">E1:第1端面(端面)</p>
        <p type="p">E2:第2端面(端面)</p>
        <p type="p">L:雷射光</p>
        <p type="p">Ls:加工剖面</p>
        <p type="p">PA:加工區</p>
        <p type="p">R:照射區域</p>
        <p type="p">S,S1:線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.JPG" file="ed10028.JPG" height="892px" img-content="tif" inline="yes" orientation="portrait" width="653px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622829</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139769</doc-number>
          <kind></kind>
          <date>114/10/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260223B">G06Q10/0833</main-classification>
        <further-classification edition="202401120260223B">G06Q10/08</further-classification>
        <further-classification edition="201801120260223B">H04W4/029</further-classification>
        <further-classification edition="201801120260223B">H04W4/80</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商卡若斯維股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHORUSVIEW, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>焦學敬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAO, XUEJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　培根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, PEIKENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅林　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEHRING, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, BIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>初翁　昆汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRUONG, QUENTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盛方芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENG, FANGFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邵而康</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/707,513</doc-number>
          <date>20241015</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於追蹤裝置之推斷配對</chinese-title>
        <english-title>INFERRED PAIRING FOR TRACKING DEVICES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之態樣提供物件及/或追蹤裝置與行程之推斷配對。例如，可自一第一讀取器裝置接收與由附著至一第一物件之一第一追蹤裝置產生之一第一信標信號相關聯之資訊。可識別在一時段內接收到由該第一追蹤裝置產生之任何信標信號之一或多個讀取器裝置。可識別一第二追蹤裝置，由該經識別之一或多個讀取器裝置在該時段內接收到該第二追蹤裝置之一第二信標信號。此第二追蹤裝置可附著至一第二物件。回應於識別到該第二追蹤裝置，該第二追蹤裝置可與一行程相關聯，以便在該第二物件及該第一物件在該行程中時追蹤該第二追蹤裝置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of the disclosure provide for inferred pairing of objects and/or tracking devices to trips. For example, information associated with a first beacon signal generated by a first tracking device attached to a first object may be received from a first reader device. One or more reader devices that received any beacon signal generated by the first tracking device within a period of time may be identified. A second tracking device for which a second beacon signal was received by the identified one or more reader devices within the period of time may be identified. This second tracing device may be attached to a second object. In response to identifying the second tracking device, the second tracking device may be associated with a trip in order to track the second tracking device while the second object and the first object are on the trip.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:追蹤裝置</p>
        <p type="p">104:追蹤裝置</p>
        <p type="p">106:讀取器裝置</p>
        <p type="p">108:伺服器運算裝置</p>
        <p type="p">200:系統</p>
        <p type="p">220:客戶端運算裝置</p>
        <p type="p">224:顯示器</p>
        <p type="p">226:使用者輸入裝置</p>
        <p type="p">230:客戶端運算裝置</p>
        <p type="p">234:顯示器</p>
        <p type="p">236:使用者輸入裝置</p>
        <p type="p">240:客戶端運算裝置</p>
        <p type="p">244:顯示器</p>
        <p type="p">246:使用者輸入裝置</p>
        <p type="p">250:儲存系統</p>
        <p type="p">260:網路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="729px" img-content="tif" inline="yes" orientation="portrait" width="963px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621972</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139788</doc-number>
          <kind></kind>
          <date>114/10/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B65G49/07</main-classification>
        <further-classification edition="200601120260302B">B08B5/02</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>家登精密工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUDENG PRECISION INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱銘乾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, MING-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊家和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHIA-HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李國華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KUO-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/720,780</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>氣體擴散裝置及其應用之半導體容器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於半導體容器的氣體擴散裝置，以解決半導體容器內部吹洗效果不佳的問題。氣體擴散裝置包含：擴散器本體及設置於擴散器本體上的第一部分、第二部分。第一部分具有第一出風量，第二部分具有第二出風量；其中，第一出風量與第二出風量不同。本發明適用於半導體容器之清潔吹洗，提升半導體容器之潔淨度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:氣體擴散裝置</p>
        <p type="p">101:擴散器本體</p>
        <p type="p">110:第一部分</p>
        <p type="p">120:第二部分</p>
        <p type="p">AF:氣流</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="728px" img-content="tif" inline="yes" orientation="portrait" width="912px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622696</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139789</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251028B">G06F1/20</main-classification>
        <further-classification edition="200601120251028B">F28F11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英業達股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INVENTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童凱煬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUNG, KAI-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳虹汝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUNG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>液冷組件</chinese-title>
        <english-title>LIQUID COOLING ASSEMBLY</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種液冷組件，包含一液體輸送件、一吸液材及一導液件。液體輸送件包含一殼體、一入液接頭及一出液接頭，入液接頭及出液接頭設置於殼體。吸液材裝設於殼體的積液槽且對應於該入液接頭及該至少一出液接頭。導液件連接於該吸液材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid cooling assembly includes a liquid delivering component, an absorbent material and a liquid guide component. The liquid delivering component includes a casing, an inlet joint and an outlet joint. The casing includes a liquid retention recess. The inlet joint and the outlet joint are disposed on the casing. The absorbent material is mounted in the liquid retention recess and corresponding to the inlet joint and the outlet joint .. The liquid guide component is connected to the absorbent material.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1a:液冷組件</p>
        <p type="p">10a:液體輸送件</p>
        <p type="p">11a:殼體</p>
        <p type="p">13a:出液接頭</p>
        <p type="p">20a:吸液材</p>
        <p type="p">22a:第二吸收部</p>
        <p type="p">30a:阻水蓋</p>
        <p type="p">31a:第一導液部</p>
        <p type="p">311a:第一防水殼</p>
        <p type="p">312a:第一導液層</p>
        <p type="p">32a:第二導液部</p>
        <p type="p">321a:第二防水殼</p>
        <p type="p">322a:第二導液層</p>
        <p type="p">50a:儲液容器</p>
        <p type="p">70a:第二漏液偵測件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="674px" img-content="tif" inline="yes" orientation="portrait" width="971px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622459</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139798</doc-number>
          <kind></kind>
          <date>114/10/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01B11/24</main-classification>
        <further-classification edition="202201120260302B">G06V10/56</further-classification>
        <further-classification edition="202201120260302B">G06V10/82</further-classification>
        <further-classification edition="202601120260302B">H10P74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商昂圖創新公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONTO INNOVATION INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁　建</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊旻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/954,038</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>使用雷射三角測量的表面檢測</chinese-title>
        <english-title>SURFACE INSPECTION USING LASER TRIANGULATION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於檢測一基材的技術可包括使用一詢問光束橫跨複數個掃描位置掃描該基材，以產生掃描結果，其中該詢問光束的寬度實質上等於或大於該基材的一表面上的至少一個表面特徵的一直徑。一組原始形心計算結果可基於該等掃描結果來產生。一誤差性質可經判定並從該等原始形心計算結果中移除，以產生改善的形心計算結果。該表面特徵的一特性可基於該等形心計算結果來判定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques for inspecting a substrate can include scanning the substrate across a plurality of scan positions using an interrogation beam having a width substantially equal to or greater than a diameter of at least one surface feature on a surface of the substrate to generate scanning results. A set of raw centroid calculation results can be generated based on the scanning results. An error property can be determined and removed from the raw centroid calculation results to generated refined centroid calculation results. A characteristic of the surface feature can be determined based on the centroid calculation results.</p>
      </isu-abst>
      <representative-img>
        <p type="p">400:方法</p>
        <p type="p">402,404,406,408,410:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="728px" img-content="tif" inline="yes" orientation="portrait" width="728px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622530</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139832</doc-number>
          <kind></kind>
          <date>114/10/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201901120260302B">G01R31/392</main-classification>
        <further-classification edition="202401120260302B">G06Q50/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商富安能源有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FLUENCE ENERGY, LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博辛斯基　艾米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOHINSKY, AMY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普雷沃斯特　理查德　詹姆斯　ＪＲ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PREVOST, RICHARD JAMES JR.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林　約翰　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUERIN, JOHN THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪巴吉　梅赫蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DIBAJI, MEHRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/708,118</doc-number>
          <date>20241016</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多系統層級電池組能量儲存系統壽命模型評估</chinese-title>
        <english-title>MULTISYSTEM LEVEL BATTERY ENERGY STORAGE SYSTEM LIFE MODEL ESTIMATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於評估及控制一電池組能量儲存系統(BESS)壽命模型的方法。接收一BESS壽命模型，該BESS壽命模型評估該BESS在多個階層式層級上的一預期剩餘使用壽命。該BESS壽命模型由包括以下的一程序產生：基於表示複數個電池組單元的退化行為之實驗室測試資料來建構一單元級退化模型；藉由執行一蒙地卡羅模擬法產生單元壽命預測；藉由選擇一性能最差單元，將該等單元壽命預測匯總成包裝壽命模型；將該等包裝壽命模型匯總成一節點壽命模型；及基於該節點壽命模型產生一系統級壽命評估。基於該接收到的BESS壽命模型調整該BESS的一操作參數，其中該操作參數包括一充電速率、一放電速率、一放電深度、一冷卻系統設定點、及一模組級平衡中之一或多者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for estimating and controlling a battery energy storage system (BESS) life model. Receiving a BESS life model that estimates an expected remaining useful life of the BESS at multiple hierarchical levels. The BESS life model is generated by a process including constructing a cell-level degradation model based on laboratory test data representing degradation behavior of a plurality of battery cells; generating cell life predictions by executing a Monte Carlo simulation; aggregating the cell life predictions into pack life models by selecting a worst-performing cell; aggregating the pack life models into a node life model; and generating a system-level life estimate based on the node life model. Adjusting an operational parameter of the BESS based on the received BESS life model, wherein the operational parameter includes one or more of a charge rate, a discharge rate, a depth of discharge, a cooling system setpoint, and a module-level balancing.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622063</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139886</doc-number>
          <kind></kind>
          <date>114/10/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D403/14</main-classification>
        <further-classification edition="200601120260302B">C07D403/04</further-classification>
        <further-classification edition="200601120260302B">C07D401/14</further-classification>
        <further-classification edition="202301120260302B">H10K30/86</further-classification>
        <further-classification edition="202301120260302B">H10K85/60</further-classification>
        <further-classification edition="202301120260302B">H10K30/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商保土谷化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HODOGAYA CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三枝優太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAEGUSA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加瀬幸喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASE, KOUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋秀聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, HIDEAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉澤由香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOSHIZAWA, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-186864</doc-number>
          <date>20241023</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>化合物、電洞傳輸材料、及使用所述電洞傳輸材料的光電轉換元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種有效用作能夠效率良好地取出電流的光電轉換元件用的電洞傳輸材料的化合物。  &lt;br/&gt;通式（1）所表示的化合物：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="549px" width="437px" file="ed10039.JPG" alt="ed10039.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;br/&gt;通式（1）中，L&lt;sup&gt;1&lt;/sup&gt;～L&lt;sup&gt;3&lt;/sup&gt;選自通式（2）所表示的基、氫原子、烷基、烷氧基、胺基、硫基、烷基亞磺醯基、烷基磺醯基、芳香族烴基及雜環基等，L&lt;sup&gt;1&lt;/sup&gt;～L&lt;sup&gt;3&lt;/sup&gt;中的至少一個為通式（2）所表示的基，通式（2）中，R&lt;sup&gt;1&lt;/sup&gt;～R&lt;sup&gt;20&lt;/sup&gt;選自氫原子及烷氧基等，A&lt;sup&gt;1&lt;/sup&gt;～A&lt;sup&gt;3&lt;/sup&gt;表示氮原子或C(R&lt;sup&gt;1a&lt;/sup&gt;)，A&lt;sup&gt;1&lt;/sup&gt;～A&lt;sup&gt;3&lt;/sup&gt;中的任意兩個為氮原子，R&lt;sup&gt;1a&lt;/sup&gt;選自氫原子及苯基等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622008</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139927</doc-number>
          <kind></kind>
          <date>114/10/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C03B20/00</main-classification>
        <further-classification edition="200601120260226B">C03B19/01</further-classification>
        <further-classification edition="200601120260226B">C03B23/043</further-classification>
        <further-classification edition="200601120260226B">C30B13/10</further-classification>
        <further-classification edition="200601120260226B">H01S3/225</further-classification>
        <further-classification edition="200601120260226B">B32B17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越石英股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU QUARTZ PRODUCTS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>橫澤裕也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOKOSAWA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嶋田敦之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMADA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>折笠勝英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORIKASA, KATSUHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田畑慶祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TABATA, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-181345</doc-number>
          <date>20241016</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>紫外線用合成石英玻璃管及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種紫外線用合成石英玻璃管，前述合成石英玻璃管中，OH基濃度為5～500wt．ppm，在前述合成石英玻璃管的的管壁厚度方向上的OH基濃度分布中，呈最大OH基濃度的位置存在於前述合成石英玻璃管的外側表面與自該外側表面起至2/3深度之間的範圍，並且，當將前述合成石英玻璃管的內側表面部的OH基濃度設為A[wt．ppm]，將前述最大OH基濃度設為B[wt．ppm]，將前述合成石英玻璃管的外側表面部的OH基濃度設為C[wt．ppm]時，各OH基濃度A、B、C滿足下述公式(1)及(2)，  B≧C＞A･････････････公式(1)  B－A≧20[wt．ppm]････公式(2)。  藉此可提供一種紫外線用合成石英玻璃管及其製造方法，該紫外線用合成石英玻璃管抑制了照射紫外線時的應變產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">無</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:紫外線用合成石英玻璃管</p>
        <p type="p">11:紫外線用合成石英玻璃管的內側表面</p>
        <p type="p">12:紫外線用合成石英玻璃管的內側1/3部位(內側區域)</p>
        <p type="p">14:紫外線用合成石英玻璃管的中間1/3部位(中間區域)</p>
        <p type="p">16:紫外線用合成石英玻璃管的外側1/3部位(外側區域)</p>
        <p type="p">17:紫外線用合成石英玻璃管的外側表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="340px" img-content="tif" inline="yes" orientation="portrait" width="431px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623477</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114139960</doc-number>
          <kind></kind>
          <date>114/10/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10H20/858</main-classification>
        <further-classification edition="202601120260302B">H10P58/00</further-classification>
        <further-classification edition="202501120260302B">H10H20/831</further-classification>
        <further-classification edition="200601120260302B">B32B3/30</further-classification>
        <further-classification edition="202501120260302B">H10H20/84</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日亞化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICHIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村本衛司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAMOTO, EIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-193042</doc-number>
          <date>20241101</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>發光元件之製造方法及發光元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提高散熱性之發光元件之製造方法及發光元件。  &lt;br/&gt;本發明之發光元件之製造方法具備：準備步驟、絕緣層形成步驟、金屬層形成步驟、單片化步驟。上述準備步驟中，準備於半導體層之下配置有導電層之晶圓。上述絕緣層形成步驟中，於上述導電層之一部分之下形成絕緣層。上述金屬層形成步驟中，形成如下金屬層，該金屬層覆蓋上述導電層之下表面及上述絕緣層之下表面，且於俯視下與上述絕緣層重疊之位置具有向上方凹陷之槽。上述單片化步驟中，上述金屬層形成步驟之後，於俯視下與上述絕緣層重疊之位置將上述晶圓單片化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5:晶圓</p>
        <p type="p">10:第1基板</p>
        <p type="p">20:半導體層</p>
        <p type="p">21:開口</p>
        <p type="p">22:導電構件</p>
        <p type="p">23:被覆膜</p>
        <p type="p">25:第1層間絕緣膜</p>
        <p type="p">26:第2層間絕緣膜</p>
        <p type="p">31:第1導電層</p>
        <p type="p">32:第2導電層</p>
        <p type="p">33:第3導電層</p>
        <p type="p">40:絕緣層</p>
        <p type="p">50:金屬層</p>
        <p type="p">51:第1金屬區域</p>
        <p type="p">52:第2金屬區域</p>
        <p type="p">53:槽</p>
        <p type="p">T1:厚度</p>
        <p type="p">T2:厚度</p>
        <p type="p">Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10052.JPG" file="ed10052.JPG" height="536px" img-content="tif" inline="yes" orientation="portrait" width="1129px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623175</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140003</doc-number>
          <kind></kind>
          <date>114/10/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260115B">H02M3/335</main-classification>
        <further-classification edition="200601120260115B">H02M3/24</further-classification>
        <further-classification edition="200601120260115B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　美莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, MISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
              <english-address>BR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/722,763</doc-number>
          <date>20241120</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/326,574</doc-number>
          <date>20250911</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>直流直流電源供應器及其控制方法</chinese-title>
        <english-title>DC-DC POWER SUPPLY AND CONTROL METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種直流直流電源供應器及其控制方法，直流直流電源供應器包括變壓器、原邊電路、副邊電路及控制器，變壓器包括原邊繞組及副邊繞組，原邊電路與原邊繞組連接且包括複數個第一原邊開關及複數個第二原邊開關，副邊電路與副邊繞組連接，控制器架構為交替地控制複數個第一原邊開關及複數個第二原邊開關的運作，以週期地調整複數個第一原邊開關與複數個第二原邊開關之間的一關斷損耗差。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A DC-DC power supply and control method thereof are provided. The DC-DC power supply includes a transformer, a primary circuit, a secondary circuit and a controller. The transformer includes a primary winding and a secondary winding. The primary circuit is connected with the primary winding and includes a plurality of first primary switches, and a plurality of second primary switches. The secondary circuit is connected with the secondary winding. The controller is configured to alternately control the operation of the first primary switches and the second primary switches for periodically adjusting a turn-off loss difference therebetween.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:直流直流電源供應器</p>
        <p type="p">2:變壓器</p>
        <p type="p">21:原邊繞組</p>
        <p type="p">22:副邊繞組</p>
        <p type="p">3:原邊電路</p>
        <p type="p">31、32、41、42:橋臂</p>
        <p type="p">33:第一諧振子電路</p>
        <p type="p">4:副邊電路</p>
        <p type="p">43:第二諧振子電路</p>
        <p type="p">5:控制器</p>
        <p type="p">A~D:連接節點</p>
        <p type="p">Cin:輸入電容器</p>
        <p type="p">Co:輸出電容器</p>
        <p type="p">Crp:第一諧振電容器</p>
        <p type="p">Crs:第二諧振電容器</p>
        <p type="p">Lrp:第一諧振電感器</p>
        <p type="p">Lrm:第二諧振電感器</p>
        <p type="p">Lrs:第三諧振電感器</p>
        <p type="p">Q1~Q4:原邊開關</p>
        <p type="p">SR1~SR4:副邊開關</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="665px" img-content="tif" inline="yes" orientation="portrait" width="978px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623023</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140049</doc-number>
          <kind></kind>
          <date>114/10/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">H01H13/705</main-classification>
        <further-classification edition="200601120260202B">H01H13/70</further-classification>
        <further-classification edition="200601120260202B">G06F3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達方電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DARFON ELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝育群</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, YU-CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊宸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張俊樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUN-HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李貞儀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,654</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鍵盤及其按鍵結構</chinese-title>
        <english-title>KEYBOARD AND KEYSWITCH STRUCTURE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">鍵盤包含第一按鍵、第二按鍵及磁鐵，其中第一按鍵包含第一屏蔽件及第一霍爾感測器；第二按鍵相鄰第一按鍵設置且包含第二屏蔽件及第二霍爾感測器；磁鐵設置於第一按鍵及第二按鍵之間，磁鐵與第一霍爾感測器保持第一固定距離，磁鐵與第二霍爾感測器保持第二固定距離，其中按壓第一按鍵時，第一屏蔽件相對於磁鐵移動，以改變第一霍爾感測器感測到的磁鐵之磁場強度；按壓第二按鍵時，第二屏蔽件相對於磁鐵移動，以改變第二霍爾感測器感測到的磁鐵之磁場強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A keyboard includes a first keyswitch including a first shielding member and a first Hall sensor, a second keyswitch including a second shielding member and a second Hall sensor, a magnet disposed between the first keyswitch and the second keyswitch and spaced apart from the first Hall sensor by a first fixed distance and the second Hall sensor by a second fixed distance. When the first keyswitch is pressed, the first shielding member moves relative to the magnet and changes the strength of the magnetic field of the magnet sensed by the first Hall sensor; when the second keyswitch is pressed, the second shielding member moves relative to the magnet and changes the strength of the magnetic field of the magnet sensed by the second Hall sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10A:第一按鍵</p>
        <p type="p">10B:第二按鍵</p>
        <p type="p">110A:第一霍爾感測器</p>
        <p type="p">110B:第二霍爾感測器</p>
        <p type="p">120:殼體</p>
        <p type="p">122:上殼體</p>
        <p type="p">124:下殼體</p>
        <p type="p">130A、130B:可活動軸</p>
        <p type="p">140A、140B:彈性件</p>
        <p type="p">20:磁鐵</p>
        <p type="p">30:電路板</p>
        <p type="p">40:定位框</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="501px" img-content="tif" inline="yes" orientation="portrait" width="744px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622025</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140080</doc-number>
          <kind></kind>
          <date>114/10/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07C25/18</main-classification>
        <further-classification edition="200601120260102B">C07C255/46</further-classification>
        <further-classification edition="200601120260102B">C07C381/12</further-classification>
        <further-classification edition="200601120260102B">C07D307/33</further-classification>
        <further-classification edition="200601120260102B">C07D307/77</further-classification>
        <further-classification edition="200601120260102B">C07D321/10</further-classification>
        <further-classification edition="200601120260102B">C07D327/06</further-classification>
        <further-classification edition="200601120260102B">C07D333/08</further-classification>
        <further-classification edition="200601120260102B">C07D333/76</further-classification>
        <further-classification edition="200601120260102B">C07D335/02</further-classification>
        <further-classification edition="200601120260102B">C07J9/00</further-classification>
        <further-classification edition="200601120260102B">C09K3/00</further-classification>
        <further-classification edition="200601120260102B">G03F7/004</further-classification>
        <further-classification edition="200601120260102B">G03F7/038</further-classification>
        <further-classification edition="200601120260102B">G03F7/039</further-classification>
        <further-classification edition="200601120260102B">G03F7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口拓弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, TAKUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植草宏哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEKUSA, KOUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206449</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>感放射線性組成物、抗蝕劑圖案形成方法、感放射線性酸產生劑及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題在於獲得感度高、LWR性能優異的感放射線性組成物。一種感放射線性組成物，含有聚合物（P）且滿足第一要件及第二要件中的一個以上，所述聚合物（P）包含具有酸解離性基的結構單元。第一要件：更含有式（1）所表示的化合物。第二要件：聚合物（P）更包含源自式（1）所表示的鎓鹽化合物的結構單元。式（1）中，R&lt;sup&gt;A&lt;/sup&gt;為鹵素原子、-NO&lt;sub&gt;2&lt;/sub&gt;、-OH、-SH、-COOH或式（i）所表示的基。R&lt;sup&gt;B&lt;/sup&gt;為-CN、氫原子、鹵素原子、-NO&lt;sub&gt;2&lt;/sub&gt;、-OH、-SH、-COOH或式（i）所表示的基。Z&lt;sup&gt;+&lt;/sup&gt;為感放射線性鎓陽離子。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="119px" width="228px" file="ed10054.JPG" alt="ed10054.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622467</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140123</doc-number>
          <kind></kind>
          <date>114/10/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251231B">G01F1/42</main-classification>
        <further-classification edition="200601120251231B">G05D7/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士金股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKIN INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>執行耕平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIGYOU, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陶山正裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUYAMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199851</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>墊片型孔口及壓力式流量控制裝置</chinese-title>
        <english-title>GASKET-TYPE ORIFICE AND PRESSURE-TYPE FLOW CONTROL DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之墊片型孔口具備第一孔口基底、藉由螺合而與第一孔口基底連結且形成有用以收容第一孔口基底之凸部之凹部之第二孔口基底、及夾於第一孔口基底與第二孔口基底之間之孔口板，孔口板的硬度大於第一孔口基底及第二孔口基底的硬度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A gasket-type orifice according to the present invention is comprising a first orifice base, a second orifice base being threadedly engaged with the first orifice base and having a recess formed to accommodate a protrusion of the first orifice base, and an orifice plate sandwiched between the first orifice base and the second orifice base. Wherein the hardness of the orifice plate is greater than that of the first orifice base and the second orifice base.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:第一孔口基底</p>
        <p type="p">2:第二孔口基底</p>
        <p type="p">3:孔口板</p>
        <p type="p">11:環狀部</p>
        <p type="p">12:凸部</p>
        <p type="p">13:第一流路</p>
        <p type="p">21:第三端面</p>
        <p type="p">22:凹部</p>
        <p type="p">23:第四端面</p>
        <p type="p">24:第二流路</p>
        <p type="p">25:第二平面</p>
        <p type="p">26:外周面</p>
        <p type="p">100:墊片型孔口</p>
        <p type="p">111:第一圓弧面</p>
        <p type="p">112:第一平面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="454px" img-content="tif" inline="yes" orientation="portrait" width="512px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622969</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140187</doc-number>
          <kind></kind>
          <date>114/10/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C11/40</main-classification>
        <further-classification edition="200601120260302B">G11C8/14</further-classification>
        <further-classification edition="200601120260302B">G11C7/18</further-classification>
        <further-classification edition="200601120260302B">G11C7/06</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JUN SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0165843</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體裝置及其製造方法</chinese-title>
        <english-title>MEMORY DEVICE AND MANUFACTURING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置，包括：第一基板，該第一基板包括單元區域和被設置在單元區域周圍的周邊區域；記憶體單元陣列，該記憶體單元陣列被設置在第一基板的單元區域中；第二基板，該第二基板被設置在記憶體單元陣列上；周邊電晶體，這些周邊電晶體被設置在第二基板上並且連接到記憶體單元陣列；第一絕緣層，該第一絕緣層被設置在位於第一基板的周邊區域中的溝槽中，並且包括高密度電漿氧化物；以及第二絕緣層，該第二絕緣層在第一絕緣層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory device including a first substrate including a cell region and a peripheral region disposed around the cell region; a memory cell array disposed in the cell region of the first substrate; a second substrate disposed on the memory cell array; peripheral transistors disposed on the second substrate and connected to the memory cell array; a first insulating layer disposed in a trench that is located in the peripheral region of the first substrate, and including high density plasma oxide; and a second insulating layer on the first insulating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:記憶體裝置</p>
        <p type="p">110:記憶體單元陣列</p>
        <p type="p">300:第一絕緣層</p>
        <p type="p">310:主動區</p>
        <p type="p">410:第一基板</p>
        <p type="p">420:第二基板</p>
        <p type="p">430:第一層間絕緣層</p>
        <p type="p">440:第二層間絕緣層</p>
        <p type="p">501:隔離層</p>
        <p type="p">502:內襯絕緣層</p>
        <p type="p">503:第二絕緣層</p>
        <p type="p">505:第三絕緣層</p>
        <p type="p">506:位元線接觸件</p>
        <p type="p">508:下接觸插塞</p>
        <p type="p">509:上接觸插塞</p>
        <p type="p">510:閘極結構</p>
        <p type="p">512:閘極覆蓋層</p>
        <p type="p">513:閘極絕緣層</p>
        <p type="p">518:著陸襯墊</p>
        <p type="p">521:第四絕緣層</p>
        <p type="p">530:電容器</p>
        <p type="p">531:下電極</p>
        <p type="p">532:電介質層</p>
        <p type="p">533:上電極</p>
        <p type="p">550:支撐層</p>
        <p type="p">560:字線連接接觸件</p>
        <p type="p">570:閘極電極</p>
        <p type="p">571:閘極絕緣層</p>
        <p type="p">572:源極區</p>
        <p type="p">573:汲極區</p>
        <p type="p">574:源極接觸件</p>
        <p type="p">575:汲極接觸件</p>
        <p type="p">581:第一接觸件</p>
        <p type="p">582:第二接觸件</p>
        <p type="p">583:第三接觸件</p>
        <p type="p">591:第一佈線</p>
        <p type="p">592:第二佈線</p>
        <p type="p">593:第三佈線</p>
        <p type="p">BL:位元線</p>
        <p type="p">CR:單元區域</p>
        <p type="p">FD:第一方向</p>
        <p type="p">I-I’:線</p>
        <p type="p">II-II’:線</p>
        <p type="p">PR:周邊區域</p>
        <p type="p">S1:第一半導體結構</p>
        <p type="p">S2:第二半導體結構</p>
        <p type="p">SD:第二方向</p>
        <p type="p">TD:第三方向</p>
        <p type="p">TR1:第一周邊電晶體</p>
        <p type="p">TRE:溝槽</p>
        <p type="p">VD:垂直方向</p>
        <p type="p">WL:字線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="947px" img-content="tif" inline="yes" orientation="portrait" width="730px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623664</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140212</doc-number>
          <kind></kind>
          <date>114/10/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W70/60</main-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商索泰克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOITEC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比阿德　雨果</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIARD, HUGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳絲倩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭建中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>法國</country>
          <doc-number>FR2412953</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於製造多層結構及中間多層結構之方法</chinese-title>
        <english-title>PROCESS FOR FABRICATING A MULTILAYER STRUCTURE AND INTERMEDIATE MULTILAYER STRUCTURE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之一態樣涉及一種用於製造一多層結構(1)之方法，包括以下步驟：&lt;br/&gt; -     提供由一第一材料製成之一臨時基板(2)，該臨時基板包含一第一面(2a)、第二面(2b)，以及一側表面(2c)；&lt;br/&gt; -     在該臨時基板(2)上沉積由不同於該第一材料之一第二材料製成之一支撐層(11)，該支撐層(11)包含設置在該臨時基板(2)之第一面(2a)上的一第一部分(111)，以及位於該第一部分(111)周邊與該臨時基板(2)周邊的一第二部分(112)；&lt;br/&gt; -     將一工作層(12)移轉到該支撐層(11)的第一部分(111)上；&lt;br/&gt; -     形成(S4)一溝槽(3)，該溝槽(3)延伸於該支撐層(11)中並直達該臨時基板(2)，以分隔該支撐層(11)的第一部分(111)與第二部分(112)，或分隔該第二部分(112)中鄰接該第一部分(111)的一第一區及該第二部分(112)中延伸至該臨時基板(2)之側表面(2c)上的一第二區；以及&lt;br/&gt; -     移除該臨時基板(2)，以使該第二部分(112)或該第二部分(112)的第二區脫離。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">One aspect of the invention relates to a process for fabricating a multilayer structure (1), comprising the following steps:&lt;br/&gt; - providing a temporary substrate (2) formed of a first material and comprising a first face (2a), a second face (2b) and a lateral surface (2c);&lt;br/&gt; - depositing, on the temporary substrate (2), a support semiconductor layer (11) formed of a second material different from the first material, the support semiconductor layer (11) comprising a first portion (111) disposed on the first face (2a) of the temporary substrate (2) and a second portion (112) located at the periphery of the first portion (111) and at the periphery of the temporary substrate (2);&lt;br/&gt; - transferring a working semiconductor layer (12) onto the first portion (111) of the support semiconductor layer (11);&lt;br/&gt; - forming (S4) a groove (3) which extends in the support semiconductor layer (11) and up to the temporary substrate (2), so as to separate the first portion (111) and the second portion (112) of the support semiconductor layer (11) or to separate a first part of the second portion (112) adjacent to the first portion (111) and a second part of the second portion (112) extending over the lateral surface (2c) of the temporary substrate (2); and&lt;br/&gt; - removing the temporary substrate (2), so as to detach the second portion (112) or the second part of the second portion (112).</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:臨時基板</p>
        <p type="p">3:溝槽</p>
        <p type="p">11:支撐層</p>
        <p type="p">11a:第一面</p>
        <p type="p">12:工作層</p>
        <p type="p">111:第一部分</p>
        <p type="p">112:第二部分</p>
        <p type="p">113:第三部分</p>
        <p type="p">S4:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="396px" img-content="tif" inline="yes" orientation="portrait" width="538px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622976</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140234</doc-number>
          <kind></kind>
          <date>114/10/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260211B">G11C16/06</main-classification>
        <further-classification edition="200601120260211B">G11C16/32</further-classification>
        <further-classification edition="200601120260211B">G11C16/20</further-classification>
        <further-classification edition="200601120260211B">G11C16/34</further-classification>
        <further-classification edition="200601120260211B">G11C16/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴圭泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, KYU TAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴元善</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, WON SUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SEUNG NAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0165087</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體裝置</chinese-title>
        <english-title>MEMORY APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種記憶體裝置包括指令記憶體和多個微控制單元。指令記憶體根據多個位址訊號和多個分頻時脈訊號以預定的時間間隔輸出多個指令代碼。多個微控制單元耦接到多個記憶體區域中的每一個，根據多個分頻時脈訊號中的每一個將多個位址訊號中的每一個提供給指令記憶體，並且根據多個指令代碼之中的相應指令代碼執行操作。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A memory apparatus includes an instruction memory and a plurality of micro control units. The instruction memory outputs a plurality of instruction codes at a predetermined time interval in accordance with a plurality of address signals and a plurality of divided clock signals. The plurality of micro control units are coupled to each of a plurality of memory regions, provide each of the plurality of address signals to the instruction memory in accordance with each of the plurality of divided clock signals, and perform operations in accordance with corresponding instruction codes among the plurality of instruction codes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:資料儲存裝置</p>
        <p type="p">1-1:記憶體裝置</p>
        <p type="p">1-2:控制器</p>
        <p type="p">2:主機</p>
        <p type="p">CMDe:命令</p>
        <p type="p">CMDi:命令</p>
        <p type="p">CRTLs:控制訊號</p>
        <p type="p">DATA:資料</p>
        <p type="p">LU0~LUn:邏輯單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="742px" img-content="tif" inline="yes" orientation="portrait" width="618px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622026</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140324</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C25/18</main-classification>
        <further-classification edition="200601120260302B">C07C309/12</further-classification>
        <further-classification edition="200601120260302B">C07C309/17</further-classification>
        <further-classification edition="200601120260302B">C07C309/25</further-classification>
        <further-classification edition="200601120260302B">C07C317/18</further-classification>
        <further-classification edition="200601120260302B">C07C317/44</further-classification>
        <further-classification edition="200601120260302B">C07C381/12</further-classification>
        <further-classification edition="200601120260302B">C07D307/33</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錦織克聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKORI, KATSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白谷宗大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRATANI, MOTOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大宮拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMIYA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川翔也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河合孝広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWAI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202645</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種於圖案形成時可以充分的水準發揮LWR及顯影缺陷抑制性的感放射線性組成物、圖案形成方法及化合物。一種感放射線性組成物，含有：下述式（1）所表示的化合物、包含具有酸解離性基的結構單元的聚合物、及溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="226px" width="383px" file="ed10056.JPG" alt="ed10056.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（1）中，W為具有經取代或未經取代的橋環脂環及與該橋環脂環分別縮合的兩個以上的經取代或未經取代的芳香環的縮合環結構；L為單鍵或二價連結基；R&lt;sup&gt;1&lt;/sup&gt;為-CN、-NO&lt;sub&gt;2&lt;/sub&gt;、-F、-SO&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;a&lt;/sup&gt;或-COR&lt;sup&gt;b&lt;/sup&gt;；R&lt;sup&gt;2&lt;/sup&gt;為氫原子、-CN、-NO&lt;sub&gt;2&lt;/sub&gt;、-F、-CF&lt;sub&gt;2&lt;/sub&gt;H、-SO&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;a&lt;/sup&gt;、-COR&lt;sup&gt;b&lt;/sup&gt;或-R&lt;sup&gt;c&lt;/sup&gt;；其中，於R&lt;sup&gt;1&lt;/sup&gt;為-F的情況下，R&lt;sup&gt;2&lt;/sup&gt;不包含氟原子；於R&lt;sup&gt;1&lt;/sup&gt;及R&lt;sup&gt;2&lt;/sup&gt;中，R&lt;sup&gt;a&lt;/sup&gt;、R&lt;sup&gt;b&lt;/sup&gt;及R&lt;sup&gt;c&lt;/sup&gt;分別獨立地為不包含-CF&lt;sub&gt;2&lt;/sub&gt;-或-CF&lt;sub&gt;3&lt;/sub&gt;的碳數1～20的一價有機基；Z&lt;sup&gt;+&lt;/sup&gt;為一價有機陽離子）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621799</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140328</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260213B">B05C13/00</main-classification>
        <further-classification edition="200601120260213B">G05B19/402</further-classification>
        <further-classification edition="200601120260213B">B05C5/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商環旭電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSAL SCIENTIFIC INDUSTRIAL ( SHANGHAI ) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林朝宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHAO-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王志豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHIH-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116587419</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種點膠機針頭校正方法、裝置及系統</chinese-title>
        <english-title>NEEDLE CALIBRATION METHOD, DEVICE AND SYSTEM FOR DISPENSING MACHINE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種點膠機針頭校正方法、裝置及系統，該方法包括：獲取更換前的針頭相對基準平臺上承接膠水的目標位置在X方向的第一偏移量和在Y方向的第一偏移量；對更換後的針頭移動X方向的第一偏移量和Y方向的第一偏移量，使其向目標位置移動，然後吐膠水至基準平臺上；獲取膠水的中心與目標位置在X、Y方向的偏移量dx和dy；根據X方向的偏移量dx和Y方向的偏移量dy，分別更新更換後的針頭與作業位置之間在X方向和Y方向的距離。本發明可以自動檢測更換後的針頭在X和Y方向的偏移量，並據此對點膠針頭進行調整，校正精確、效率高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a needle calibration method, device, and system for a dispensing machine. The method comprises: acquiring a first offset in the X direction and a first offset in the Y direction of a target position, where glue is received on a reference platform, relative to the needle before replacement; moving the replaced needle in the X and Y directions by the first offsets so that it moves toward the target position, and then dispensing glue onto the reference platform; acquiring offsets dx and dy between the center of the dispensed glue and the target position in the X and Y directions; and updating the distances between the replaced needle and the working position in the X and Y directions according to the offsets dx and dy. The present invention can automatically detect the offsets of the replaced needle in the X and Y directions, and adjust the dispensing needle accordingly, achieving precise calibration with high efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:獲取更換前的針頭相對目標位置在X、Y方向的第一偏移量</p>
        <p type="p">S200:根據第一偏移量移動更換後的針頭，針頭吐膠水於基準平臺上</p>
        <p type="p">S300:獲取膠水中心相對目標位置在X、Y方向的偏移量dx和dy</p>
        <p type="p">S400:根據偏移量dx和dy更新更換後的針頭與作業位置之間的距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="785px" img-content="tif" inline="yes" orientation="portrait" width="774px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623487</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140336</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10H29/853</main-classification>
        <further-classification edition="202301120260302B">H10K59/80</further-classification>
        <further-classification edition="202501120260302B">H10H29/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>光寶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITE-ON TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明松</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING-SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李承穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHENG-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇偉樂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, WEI-LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡杰廷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, JIE-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/710,032</doc-number>
          <date>20241022</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/340,893</doc-number>
          <date>20250926</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>發光封裝結構及其製造方法</chinese-title>
        <english-title>LIGHT-EMITTING PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種發光封裝結構及其製造方法。所述發光封裝結構包含一基板、一發光模組及一包覆體。所述基板具有彼此相反的一第一頂面及一第一底面以及多個第一側面。一第一導電層形成於所述第一頂面且一第二導電層形成於。所述發光模組是設置於所述第一導電層。所述包覆體覆蓋於所述第一導電層、所述發光模組的多個側面以及所述基板的所述第一頂面及多個所述第一側面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting package structure and method for producing the same are provided. The light-emitting package structure includes a substrate, a light-emitting module, and an encapsulant. The substrate has a first top surface and a first bottom surface opposite to each other and a plurality of first side surfaces. A first conductive layer is formed on the first top surface and a second conductive layer is the first bottom surface. The light-emitting module is disposed on the first conductive layer. The encapsulant covers the first conductive layer, a plurality of side surfaces of the light-emitting module, and the first top surface and the plurality of first side surfaces of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:發光封裝結構</p>
        <p type="p">1:基板</p>
        <p type="p">1a:第一頂面</p>
        <p type="p">1b:第一底面</p>
        <p type="p">1c:第一側面</p>
        <p type="p">11:第一導電層</p>
        <p type="p">12:第二導電層</p>
        <p type="p">2:發光模組</p>
        <p type="p">21:發光件</p>
        <p type="p">22:光穿透件</p>
        <p type="p">3:包覆體</p>
        <p type="p">3a:第二頂面</p>
        <p type="p">3b:第二底面</p>
        <p type="p">3c:第二側面</p>
        <p type="p">4:透光層</p>
        <p type="p">5:齊納二極體</p>
        <p type="p">W:導線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.png" file="d10021.TIF" giffile="ed10021.png" height="700px" img-content="tif" inline="yes" orientation="portrait" width="954px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622527</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140343</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">G01R31/28</main-classification>
        <further-classification edition="200601120251103B">G01R31/317</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萬政典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WAN, CHENG-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹博昭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAO, PO-CHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳偉廉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WEI-LIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
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                <last-name>李名鎮</last-name>
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                <last-name>LEE, MING-CHENG</last-name>
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                <first-name></first-name>
              </english-name>
              <address></address>
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              <english-address>TW</english-address>
            </addressbook>
          </inventor>
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                <last-name>李東興</last-name>
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              </chinese-name>
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                <last-name>LEE, TUNG-HSING</last-name>
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                <first-name></first-name>
              </english-name>
              <address></address>
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              <english-address>TW</english-address>
            </addressbook>
          </inventor>
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                <last-name>黃建富</last-name>
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                <last-name>HUANG, CHIEN-FU</last-name>
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              <address></address>
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                <last-name>蘇郁荃</last-name>
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                <last-name>楊瑞穎</last-name>
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                <last-name>YANG, JUI-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
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              <english-address>TW</english-address>
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                <last-name>黃閔珊</last-name>
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                <last-name>HUANG, MIN-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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                <last-name>倪佳蓉</last-name>
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                <last-name>NI, CHIA-JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>丁奕如</last-name>
                <first-name></first-name>
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                <last-name>TING, YI-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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              <chinese-name name-type="organization">
                <last-name>邱泓瑜</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>CHIOU, HUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>官亭宇</last-name>
                <first-name></first-name>
              </chinese-name>
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                <last-name>KUAN, TING-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="15">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="16">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張幼蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YU-LAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳宥任</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YU-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
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        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116397683</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用以最佳化測試線效率的適應性集成電路測試方法和適應性集成電路測試系統</chinese-title>
        <english-title>ADAPTIVE INTEGRATED CIRCUIT TESTING METHOD AND ADAPTIVE INTEGRATED CIRCUIT TESTING SYSTEM CAPABLE OF OPTIMIZING TESTING LINE EFFICIENCY</english-title>
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      <physical-examination>有</physical-examination>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種適應性集成電路 (IC) 測試方法包括獲取複數個IC的量產資料，通過訓練模型分析量產資料以生成複數個IC的預測資料，根據預測資料將複數個IC劃分為至少兩個IC群組，並根據至少兩個IC群組調整至少兩個測試流程。至少兩個IC群組是非重疊的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An adaptive integrated circuit (IC) testing method includes acquiring mass production data of a plurality of ICs, analyzing the mass production data by a training model for generating predicted data of the plurality of ICs, partitioning the plurality of ICs into at least two IC groups according to the predicted data, and adjusting at least two testing processes according to the at least two IC groups. The at least two IC groups are non-overlapped.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S701:步驟</p>
        <p type="p">S702:步驟</p>
        <p type="p">S703:步驟</p>
        <p type="p">S704:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="792px" img-content="tif" inline="yes" orientation="portrait" width="590px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202622904</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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          <doc-number>114140369</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
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        <main-classification edition="202201120251110B">G06V10/764</main-classification>
        <further-classification edition="202201120251110B">G06V10/82</further-classification>
        <further-classification edition="202201120251110B">G06V10/40</further-classification>
        <further-classification edition="202401120251110B">G06T5/94</further-classification>
        <further-classification edition="202301120251110B">G06N3/08</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏全球科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW GLOBAL TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾默生　吉利安Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EMERSON, JILLIAN A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　自琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUO, TZU-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
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              <chinese-name name-type="organization">
                <last-name>辛格　帕特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SINGH, PARTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
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              <chinese-name name-type="organization">
                <last-name>利基亞　提姆Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LICQUIA, TIM C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃　文江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, WENJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/720,882</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>相分離學習模型</chinese-title>
        <english-title>PHASE SEPARATION LEARNING MODEL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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    <description>
      <isu-abst lang="tw">
        <p type="p">一種相分離學習模型可以接收流體樣本影像，並進行操作以判定該等流體樣本影像中存在或不存在相分離。為此，可以經由轉移學習利用第一複數個流體樣本影像來訓練一電腦視覺學習模型以識別影像中之物件，從而產生該相分離學習模型。可以將第二複數個流體樣本影像輸入至該相分離學習模型中，且該相分離學習模型可以根據該相分離學習模型之一操作結果做出關於該第二複數個流體樣本影像內存在或不存在相分離之一建議。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A phase separation learning model can receive fluid sample images and be operated to determine a presence or absence of phase separation in the fluid sample images. To do so, a computer vision learning model can be trained to identify objects in images via transfer learning utilizing a first plurality of fluid sample images to result in the phase separation learning model. A second plurality of fluid sample images can be input into the phase separation learning model, and the phase separation learning model can make a recommendation regarding the presence or the absence of phase separation within the second plurality of fluid sample images as a result of operation of the phase separation learning model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:方塊圖</p>
        <p type="p">121:小瓶托盤</p>
        <p type="p">122:樣本台</p>
        <p type="p">123:腕式振動器</p>
        <p type="p">124:旋轉混合器</p>
        <p type="p">125:成像部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="369px" img-content="tif" inline="yes" orientation="portrait" width="543px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621772</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140401</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251231B">A63H23/10</main-classification>
        <further-classification edition="200601120251231B">A63F9/30</further-classification>
        <further-classification edition="200601120251231B">A23G3/50</further-classification>
        <further-classification edition="200601120251231B">A23G3/54</further-classification>
        <further-classification edition="200601120251231B">A23G1/54</further-classification>
        <further-classification edition="200601120251231B">A23G3/34</further-classification>
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          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>日商萬代股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高垣晴馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGAKI, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福井菜摘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUI, NATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤凛太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, RINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202358</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>玩具及玩具組</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種提高趣味性之玩具及玩具組。  &lt;br/&gt;本發明之玩具組100包含：玩具40，其具備可動作之本體部40a，本體部40a構成為於一部包含握持部41c，於中間部包含動作部43，於另一部包含扣止部42b；點心1，其可由玩具40釣起；及容器101，其可收容點心1。藉由模仿釣具而可釣起點心1之玩具40、與收容於容器101並具有黏著性之點心1之組合，可提供藉由釣竿玩具40自容器101釣起點心1之遊戲感之點心1。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:點心</p>
        <p type="p">10h:孔部</p>
        <p type="p">20:路徑部</p>
        <p type="p">30:終點部</p>
        <p type="p">40:玩具</p>
        <p type="p">41:第1本體部</p>
        <p type="p">42:第2本體部</p>
        <p type="p">42b:扣止部</p>
        <p type="p">43:動作部</p>
        <p type="p">50:指尖</p>
        <p type="p">51:指尖</p>
        <p type="p">100:玩具組</p>
        <p type="p">101:容器</p>
        <p type="p">102c:凸部</p>
        <p type="p">102g:槽部</p>
        <p type="p">108:薄膜撕開部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="1025px" img-content="tif" inline="yes" orientation="portrait" width="773px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621571</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140402</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251029B">A23G1/20</main-classification>
        <further-classification edition="200601120251029B">A23G1/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商萬代股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BANDAI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>片野裕太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATANO, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤凛太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, RINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米山優花</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YONEYAMA, YUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>竹財菜摘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKEZAI, NATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白濱奏祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAHAMA, SOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川明日佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, ASUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高垣晴馨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAGAKI, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>窪田亜美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUBOTA, AMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206815</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>點心及點心之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種提高趣味性之點心。  &lt;br/&gt;本發明之點心1具備：本體部10，其以複數色形成；角色部20，其形成於本體部10；及背景部30，其位於角色部20之周圍，形成於本體部10；且複數色中之第1色之部位21及第2色之部位22以相同或類似之填充率構成。藉由將板狀之本體部10上之角色部20以第1色之部位21、及第2色之部位22形成，且兩部位之填充率相同或類似地構成，可相同程度地使角色部分之不同味道不偏向一方，大致享用。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:點心</p>
        <p type="p">10:本體部</p>
        <p type="p">10f:正側面(一面)</p>
        <p type="p">10r:背側面(另一面)</p>
        <p type="p">20:角色部</p>
        <p type="p">21:第1色之部位</p>
        <p type="p">21a:零件部</p>
        <p type="p">21b:零件部</p>
        <p type="p">22:第2色之部位</p>
        <p type="p">22a:零件部</p>
        <p type="p">22b:零件部</p>
        <p type="p">22c:零件部</p>
        <p type="p">22d:零件部</p>
        <p type="p">22e:頭部內側部</p>
        <p type="p">30:背景部</p>
        <p type="p">31:第1背景部(背景部)</p>
        <p type="p">32:第2背景部(背景部)</p>
        <p type="p">38:文本資訊部</p>
        <p type="p">38a:文本資訊</p>
        <p type="p">40:槽部</p>
        <p type="p">50:基底部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="975px" img-content="tif" inline="yes" orientation="portrait" width="760px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623571</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140418</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/10</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="200601120260302B">C23C16/54</further-classification>
        <further-classification edition="200601120260302B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（廣州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. GUANGZHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周　寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃潔潔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳青友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116617344</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板支撐裝置、真空處理設備及基板溫度的調節方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基板支撐裝置、真空處理設備及方法，所述基板支撐設備設置在真空處理設備的可被抽真空的處理室內，包含：基座，其具有矩形結構，用於承載基板；所述基座的內部設有至少一個主加熱元件；多個輔助加熱元件，分別設置在所述基座的四個頂角處； 所述主加熱元件、所述輔助加熱元件被配置為獨立地加熱所述基座。本發明的優點是：能夠補償基板表面各區域薄膜生長速率不一致，實現在基板上生長厚度均勻的薄膜，並且本發明不受薄膜材料及工藝條件的限制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">220:基座</p>
        <p type="p">230:主加熱元件</p>
        <p type="p">2301:第一主加熱元件</p>
        <p type="p">2302:第二主加熱元件</p>
        <p type="p">2303:第三主加熱元件</p>
        <p type="p">231:耳部</p>
        <p type="p">260:輔助加熱元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="662px" img-content="tif" inline="yes" orientation="portrait" width="672px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623062</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140423</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="200601120260302B">H02N13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　如彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116603801</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>下電極組件及電漿處理設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種下電極組件及電漿處理設備。所述下電極組件用於電漿工藝處理，包括：靜電吸盤，其上表面用於承載基片；位於靜電吸盤中的第一電極，其與一脈衝式直流偏壓源電連接；位於靜電吸盤中的第二電極，其通過一隔離電路與一直流電壓源電連接，所述第二電極位於所述第一電極的上方；所述隔離電路包含一二極體，所述二極體的負極與所述直流電壓源的負極電連接、正極與所述第二電極電連接。本發明通過消除脈衝式直流偏壓源對箝位電壓的影響，解決在工藝過程中基片箝位電壓的失穩問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">24:隔離電路</p>
        <p type="p">A:節點</p>
        <p type="p">B:節點</p>
        <p type="p">C&lt;sub&gt;1&lt;/sub&gt;:電容</p>
        <p type="p">C&lt;sub&gt;2&lt;/sub&gt;:電容</p>
        <p type="p">C&lt;sub&gt;W&lt;/sub&gt;:電容</p>
        <p type="p">C&lt;sub&gt;SH&lt;/sub&gt;:電容</p>
        <p type="p">D:二極體</p>
        <p type="p">DC:直流電壓源</p>
        <p type="p">D&lt;sub&gt;SH&lt;/sub&gt;:二極體</p>
        <p type="p">D&lt;sub&gt;W&lt;/sub&gt;:二極體</p>
        <p type="p">I&lt;sub&gt;SH&lt;/sub&gt;:電流源</p>
        <p type="p">I&lt;sub&gt;W&lt;/sub&gt;:電流源</p>
        <p type="p">PDC:脈衝式直流偏壓源</p>
        <p type="p">R&lt;sub&gt;pl&lt;/sub&gt;:電阻</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="374px" img-content="tif" inline="yes" orientation="portrait" width="421px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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          <doc-number>202623564</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140424</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
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        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="200601120260302B">H05K5/06</further-classification>
        <further-classification edition="200601120260302B">H05K5/03</further-classification>
        <further-classification edition="202501120260302B">H05K5/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡玲鋼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張海龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁冬冬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉萊昂納多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒煜申</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117231613</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體工藝設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種半導體工藝設備，包括腔體、腔蓋、機架組件、升降組件和驅動組件。腔蓋設置於腔體上方；機架組件設置於腔蓋上方且一端固定連接於腔蓋；升降組件包括第一固定桿和活動桿，第一固定桿的一端固定連接於腔體上側，另一端穿過腔蓋向上延伸；驅動組件驅動活動桿相對第一固定桿運動。本發明的半導體工藝設備，通過升降組件帶動腔蓋向上運動以使得腔蓋和腔體脫離，減少半導體工藝設備周圍空間的佔用；腔蓋蓋合於腔體上時，靠腔蓋的自重以及其他鎖緊結構鎖緊腔蓋和腔體，避免升降組件對腔蓋和腔體之間施加過大的載荷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:半導體工藝設備</p>
        <p type="p">110:腔體</p>
        <p type="p">111:反應腔</p>
        <p type="p">120:腔蓋</p>
        <p type="p">130:機架組件</p>
        <p type="p">131:第一橫樑</p>
        <p type="p">132:支撐柱</p>
        <p type="p">133:連接板</p>
        <p type="p">134:第二橫樑</p>
        <p type="p">140:升降組件</p>
        <p type="p">141:第一固定桿</p>
        <p type="p">142:活動桿</p>
        <p type="p">150:驅動組件</p>
        <p type="p">160:聯軸器</p>
        <p type="p">170:馬達安裝板</p>
        <p type="p">190:導向組件</p>
        <p type="p">220:下支撐架組件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="819px" img-content="tif" inline="yes" orientation="portrait" width="661px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623598</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140425</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/76</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. LINGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王棟輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭振宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈捷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116412861</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>托盤組件和半導體工藝設備</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種托盤組件和半導體工藝設備，托盤組件包含中心盤、基座盤、定位部、晶圓托環和外圈環。中心盤與旋轉筒之間卡接；基座盤位於旋轉筒上方；晶圓托環位於基座盤上方；外圈環位於基座盤上方，且外圈環位於晶圓托環的外側。本發明的托盤組件和半導體工藝設備，在托盤組件中心設置中心盤，避免旋轉筒內的吹掃氣體向上吹掃時托盤組件中的部件與晶圓之間發生碰撞；並且設置基座盤、晶圓托環以及外圈環，僅需單單設置機械手即可通過基座盤將晶圓取出，簡化取放晶圓所需的機械結構，減少了取放晶圓所需的步驟，提高晶圓取放效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:托盤組件</p>
        <p type="p">110:中心盤</p>
        <p type="p">120:基座盤</p>
        <p type="p">140:晶圓托環</p>
        <p type="p">150:外圈環</p>
        <p type="p">200:旋轉筒</p>
        <p type="p">30:晶圓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="727px" img-content="tif" inline="yes" orientation="portrait" width="671px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623063</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140429</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01J37/32</main-classification>
        <further-classification edition="202601120260302B">H10P72/50</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中微半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張一川</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉　如彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YE, RUBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116685341</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電漿處理裝置，包括：反應腔；氣體噴淋頭，設於所述反應腔的頂部；下電極組件，設於所述反應腔內的底部，所述下電極組件與所述氣體噴淋頭相對設置；導電的移動環，設於所述氣體噴淋頭的週邊，可上下移動；接地的電漿約束環，設於所述下電極組件的週邊；導電墊片，設於所述電漿約束環與移動環之間，當所述移動環向下移動至工藝位置時，所述移動環通過所述導電墊片與電漿約束環電連接接地。所述電漿處理裝置，有利於降低移動環表面聚合物的沉積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電漿處理裝置</p>
        <p type="p">101:反應腔</p>
        <p type="p">102:氣體噴淋頭</p>
        <p type="p">103:下電極組件</p>
        <p type="p">104:移動環</p>
        <p type="p">105:電漿約束環</p>
        <p type="p">106:導電墊片</p>
        <p type="p">107:上接地環</p>
        <p type="p">140:排氣口</p>
        <p type="p">A:區域</p>
        <p type="p">P:電漿區域</p>
        <p type="p">W:基片</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="468px" img-content="tif" inline="yes" orientation="portrait" width="703px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622210</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140489</doc-number>
          <kind></kind>
          <date>114/10/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251103B">C09K5/10</main-classification>
        <further-classification edition="200601120251103B">C08G77/18</further-classification>
        <further-classification edition="200601120251103B">C08L83/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商瓦克化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WACKER CHEMIE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張思原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范勝華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, SHENGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/135621</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種矽酮組合物</chinese-title>
        <english-title>A SILICONE COMPOSITION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種傳熱流體組合物，其中含有具有式（I）烷氧基矽酮A及／或由烷氧基矽酮A縮合而成的矽氧烷低聚物B；前提是該矽氧烷低聚物B包含至少一個與矽原子鍵合的OR基團。該組合物可用於冷卻流體領域，例如浸沒式冷卻流體，以及使用浸沒式冷卻流體的製程和系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a heat transfer fluid composition. It contains an alkoxy silicone A with the formula (I); and/or the siloxane oligomer B condensed by alkoxy silicone A; with the proviso that siloxane oligomer B contains at least one OR group bonded on the silicon atom. The composition can be used in the field of cooling fluids, such as immersion cooling fluids, processes and systems using immersion cooling fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621577</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140579</doc-number>
          <kind></kind>
          <date>114/10/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120260302B">A23L7/10</main-classification>
        <further-classification edition="201601120260302B">A23L29/206</further-classification>
        <further-classification edition="201601120260302B">A23L29/269</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商不二製油股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJI OIL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小松明日香</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOMATSU, ASUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-192363</doc-number>
          <date>20241031</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>穀類加工食品用品質改善劑</chinese-title>
        <english-title>PROCESSED CEREAL FOOD QUALITY ENHANCER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種使穀類加工食品的鬆散性良好且提高色澤的穀類加工食品用品質改善劑以及使用了穀類加工食品用品質改善劑的穀類加工食品。發現能夠通過使用包含(A)特定的澱粉、以及(B)源自豆類的水溶性半纖維素和/或(C)選自於阿拉伯膠、普魯蘭(pullulan)多糖、果膠、黃原膠、琥珀醯聚糖、瓜爾膠、刺槐豆膠、白木耳多糖類、角叉菜膠、羅望子膠、塔拉膠(tara gum)、肉桂膠(cassia gum)、羧甲基纖維素以及海藻酸之群組的多糖類中的一種或兩種以上的穀類加工食品用品質改善劑，使穀類加工食品的鬆散性良好，並且提高色澤。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An objective of the present invention is to provide a cereal processed food quality enhancer that improves separability and gloss of processed cereal foods, as well as processed cereal foods using the processed food quality enhancer. &lt;br/&gt;The present inventor(s) discovered that by using a cereal processed food quality enhancer comprising: &lt;br/&gt;(A) a specific starch, as well as &lt;br/&gt;(B) a water-soluble hemicellulose derived from legumes, and/or &lt;br/&gt;(C) one or more polysaccharides selected from the group consisting of arabic gum, pullulan, pectin, xanthan gum, succinoglycan, guar gum, locust bean gum, white jelly fungus polysaccharide, carrageenan, tamarind seed gum, tara gum, cassia gum, carboxymethyl cellulose, and alginic acid, &lt;br/&gt;the separability and gloss of processed cereal foods can be improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622524</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140632</doc-number>
          <kind></kind>
          <date>114/10/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01R31/265</main-classification>
        <further-classification edition="201801120260302B">G01N23/083</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茅根慎通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINONE, NORIMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石井淳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHII, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/710,604</doc-number>
          <date>20241023</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>解析裝置及解析方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之解析裝置1A包含：X射線照射裝置11，其對半導體器件D照射以具有第1頻率F1之調變信號Sm進行強度調變後之X射線R；檢測器15，其檢測因照射X射線R引起之半導體器件D之狀態變化，且輸出基於檢測結果之檢測信號Sd；及信號處理裝置16，其對檢測信號Sd進行基於第1頻率F1之信號處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1A:解析裝置</p>
        <p type="p">11:X射線照射裝置</p>
        <p type="p">12:X射線控制部</p>
        <p type="p">13:掃描光學系統</p>
        <p type="p">14:電源</p>
        <p type="p">15:檢測器</p>
        <p type="p">16:信號處理裝置</p>
        <p type="p">17:電腦</p>
        <p type="p">D:半導體器件</p>
        <p type="p">I:電流值</p>
        <p type="p">R:X射線</p>
        <p type="p">Sd:檢測信號</p>
        <p type="p">Sk:輸出信號</p>
        <p type="p">Sm:調變信號</p>
        <p type="p">V:電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="651px" img-content="tif" inline="yes" orientation="portrait" width="987px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622494</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140633</doc-number>
          <kind></kind>
          <date>114/10/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260302B">G01N23/083</main-classification>
        <further-classification edition="201801120260302B">G01N23/041</further-classification>
        <further-classification edition="200601120260302B">G01R31/265</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商濱松赫德尼古斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMAMATSU PHOTONICS K.K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松本徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUMOTO, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茅根慎通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINONE, NORIMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/710,605</doc-number>
          <date>20241023</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>解析裝置及解析方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之解析裝置1包含：測試器10，其朝半導體器件D輸入具有規定頻率之測試信號St；X射線照射裝置11，其對半導體器件D照射X射線R；檢測器15，其檢測因照射X射線R而產生之來自半導體器件D之X射線(透過X射線Rt)，輸出基於檢測結果之檢測信號Sd；及信號處理裝置16，其對檢測信號Sd進行基於規定頻率之信號處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:解析裝置</p>
        <p type="p">10:測試器</p>
        <p type="p">11:X射線照射裝置</p>
        <p type="p">12:會聚光學系統</p>
        <p type="p">14:載台</p>
        <p type="p">15:檢測器</p>
        <p type="p">16:信號處理裝置</p>
        <p type="p">17:電腦</p>
        <p type="p">D:半導體器件</p>
        <p type="p">R:X射線</p>
        <p type="p">Rt:透過X射線</p>
        <p type="p">Sd:檢測信號</p>
        <p type="p">Sk:輸出信號</p>
        <p type="p">St:測試信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="656px" img-content="tif" inline="yes" orientation="portrait" width="974px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622226</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140693</doc-number>
          <kind></kind>
          <date>114/10/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C11D7/50</main-classification>
        <further-classification edition="200601120260302B">G03F7/42</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏全球科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW GLOBAL TECHNOLOGIES LLC</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/134399</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於微影之剝離溶劑</chinese-title>
        <english-title>STRIPPING SOLVENT FOR PHOTOLITHOGRAPHY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種正光阻之有效剝離溶液，其含有：&lt;br/&gt;•     超過70重量百分比之水；&lt;br/&gt;•     5至19重量百分比之烷醇胺；&lt;br/&gt;•     10至24重量百分比之二醇醚；及&lt;br/&gt;•     可選地，基本上不含其他溶劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An effective stripping solution for positive photoresists contains:&lt;br/&gt;• more than 70 weight percent water;&lt;br/&gt;• From 5 to 19 weight percent alkanolamine; &lt;br/&gt;• From 10 to 24 weight percent glycol ether; and&lt;br/&gt;• Optionally, essentially no other solvents.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622027</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140722</doc-number>
          <kind></kind>
          <date>114/10/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C25/18</main-classification>
        <further-classification edition="200601120260302B">C07C309/17</further-classification>
        <further-classification edition="200601120260302B">C07C381/00</further-classification>
        <further-classification edition="200601120260302B">C07C381/12</further-classification>
        <further-classification edition="200601120260302B">C07D317/64</further-classification>
        <further-classification edition="200601120260302B">C07D317/70</further-classification>
        <further-classification edition="200601120260302B">C07D327/04</further-classification>
        <further-classification edition="200601120260302B">C07D327/06</further-classification>
        <further-classification edition="200601120260302B">C07D333/46</further-classification>
        <further-classification edition="200601120260302B">C07D333/54</further-classification>
        <further-classification edition="200601120260302B">C07D333/76</further-classification>
        <further-classification edition="200601120260302B">C07D493/08</further-classification>
        <further-classification edition="200601120260302B">C07D493/18</further-classification>
        <further-classification edition="200601120260302B">C07J9/00</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部祐大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, YUDAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福原良太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUHARA, RYOUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡嵜聡司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAZAKI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柄川冬輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGAWA, FUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古川泰一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUKAWA, TAIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根本龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMOTO, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202622</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種於圖案形成時可以充分的水準發揮感度、LWR、CDU、EL、DOF、顯影缺陷數、圖案矩形性、圖案圓形性及MEEF的感放射線性組成物等。一種感放射線性組成物，含有：下述式（A）所表示的化合物、包含具有酸解離性基的結構單元（I）的聚合物、及溶劑。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="217px" width="326px" file="ed10064.JPG" alt="ed10064.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式中，R&lt;sup&gt;z&lt;/sup&gt;為-F、-CN、-SO&lt;sub&gt;2&lt;/sub&gt;R&lt;sup&gt;a&lt;/sup&gt;、-CF&lt;sub&gt;2&lt;/sub&gt;H、-SF&lt;sub&gt;5&lt;/sub&gt;或-CF&lt;sub&gt;3&lt;/sub&gt;；R&lt;sup&gt;a&lt;/sup&gt;為氫原子或碳數1～20的一價有機基；R&lt;sup&gt;1&lt;/sup&gt;為-H、-CN、-SF&lt;sub&gt;5&lt;/sub&gt;或碳數1～10的一價有機基；Y為-O-或-NR&lt;sup&gt;b&lt;/sup&gt;-；L為單鍵或二價有機基；其中，於R&lt;sup&gt;z&lt;/sup&gt;為-F的情況下，所述二價有機基的碳數為4以下；W為一價縮合環式基或具有取代基的一價縮合環式基；所述縮合環式基或所述取代基具有雜原子；Z&lt;sup&gt;+&lt;/sup&gt;為一價有機陽離子）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622028</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140732</doc-number>
          <kind></kind>
          <date>114/10/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C25/18</main-classification>
        <further-classification edition="200601120260302B">C07C309/25</further-classification>
        <further-classification edition="200601120260302B">C07C309/27</further-classification>
        <further-classification edition="200601120260302B">C07C309/42</further-classification>
        <further-classification edition="200601120260302B">C07C309/51</further-classification>
        <further-classification edition="200601120260302B">C07C309/59</further-classification>
        <further-classification edition="200601120260302B">C07C321/06</further-classification>
        <further-classification edition="200601120260302B">C07C381/12</further-classification>
        <further-classification edition="200601120260302B">C07D307/33</further-classification>
        <further-classification edition="200601120260302B">C07D317/70</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山川翔也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAKAWA, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>錦織克聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKORI, KATSUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柄川冬輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGAWA, FUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202617</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>感放射線性組成物、圖案形成方法及化合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種於圖案形成時可以充分的水準發揮感度及製程窗口的感放射線性組成物、圖案形成方法及化合物。一種感放射線性組成物，含有化合物、包含具有酸解離性基的結構單元的聚合物、及溶劑，所述化合物至少包含具有經取代或未經取代的橋環脂環及與該橋環脂環分別縮合的兩個以上的經取代或未經取代的芳香環的縮合環結構、以及下述式（1a）或式（1b）所表示的部分結構。  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="354px" width="283px" file="ed10069.JPG" alt="ed10069.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（1a）及式（1b）中，W&lt;sup&gt;1&lt;/sup&gt;及W&lt;sup&gt;2&lt;/sup&gt;分別獨立地為所述縮合環結構或所述縮合環結構以外的環結構；L&lt;sup&gt;1&lt;/sup&gt;分別獨立地為單鍵或二價連結基；碳-碳間的下述式表示單鍵或雙鍵；  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="156px" width="139px" file="ed10070.JPG" alt="ed10070.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;*及**分別為與所述化合物中的其他結構的鍵結鍵；A分別獨立地為下述式（A-1）～式（A-7）的任一者所表示的基；  &lt;br/&gt;&lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="416px" width="520px" file="ed10071.JPG" alt="ed10071.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;（式（A-1）～式（A-7）中，***為與L&lt;sup&gt;1&lt;/sup&gt;的鍵結鍵；**與所述式（1a）及式（1b）為相同含義）  &lt;br/&gt;n&lt;sub&gt;1&lt;/sub&gt;為0～4的整數；n&lt;sub&gt;2&lt;/sub&gt;為0或1；其中，於A為所述式（A-1）～式（A-5）的任一者所表示的基的情況下，n&lt;sub&gt;2&lt;/sub&gt;為0；Z&lt;sup&gt;+&lt;/sup&gt;分別獨立地為有機陽離子）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
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          <doc-number>202621809</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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          <doc-number>114140789</doc-number>
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        <main-classification edition="202201120260225B">B09B3/35</main-classification>
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        <further-classification edition="200601120260225B">A47C23/00</further-classification>
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        <further-classification edition="200601120260225B">A47C27/045</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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                <last-name>日商系統技研股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYSTEM ENGINEERING CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>北畑悦郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAHATA, ETSURO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
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              <chinese-name name-type="organization">
                <last-name>長峯隆介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAMINE, RYUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柿直樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAKI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭明</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王奕軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-187831</doc-number>
          <date>20241025</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>獨立筒床墊的分類拆解方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種進行獨立筒床墊之分類拆解的分類拆解方法。&lt;br/&gt;  根據本發明相關之床墊的分類拆解方法，係朝向雷射切割器而以使床墊之1之長邊部成為與地面垂直之方式設置，故而不存在存有關於床墊尺寸之限制的步驟。又，由於使用雷射切割器而非接觸性地進行布料的裁切，故而不會產生因刃部的磨耗所導致之劣化，且裁切速度亦較快。從而，藉由使用本發明相關之床墊的分類拆解方法，便可將複數尺寸的床墊一致地、大量地進行處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="443px" img-content="tif" inline="yes" orientation="portrait" width="582px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621939</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140799</doc-number>
          <kind></kind>
          <date>114/10/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251231B">B62M3/08</main-classification>
        <further-classification edition="202201120251231B">A43B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臼井哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>USUI, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青木寿明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOKI, TOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菊田潤一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIKUTA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾文岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>102024211257.7</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於人力驅動車之踏版的扣片</chinese-title>
        <english-title>CLEAT FOR PEDAL OF HUMAN-POWERED VEHICLE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示一種用於人力驅動車V的踏板12之扣片16。扣片16包括用於接合踏板12的第一扣片緊固構件24之第一接合部分60、用於接合踏板12的第二扣片緊固構件26之第二接合部分62，以及設置成通過緊固件36附接到鞋子的鞋底32之鞋附接部分64。第二接合部分62在第一方向D1上與第一接合部分60相隔。鞋附接部分64包括第一附接孔70、第二附接孔72和第三附接孔74。第一附接孔70、第二附接孔72和第三附接孔74在垂直於第一方向D1的第二方向D2上延伸之長度大於其在第一方向D1上延伸之長度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cleat 16 for a pedal 12 of a human-powered vehicle V. The cleat 16 includes a first engagement portion 60 for engaging a first cleat securing member 24 of the pedal 12, a second engagement portion 62 for engaging a second cleat securing member 26 of the pedal 12 and a shoe attachment portion 64 configured to be attached to a sole 32 of a shoe via fasteners 36. The second engagement portion 62 is spaced from the first engagement portion 60 in a first direction D1. The shoe attachment portion 64 includes a first attachment hole 70, a second attachment hole 72 and a third attachment hole 74. The first attachment hole 70, the second attachment hole 72 and the third attachment hole 74 have lengths extending in a second direction D2 perpendicular to the first direction D1 that are larger than their lengths in the first direction D1.</p>
      </isu-abst>
      <representative-img>
        <p type="p">16:扣片</p>
        <p type="p">16a:第一邊緣</p>
        <p type="p">16b:第二邊緣</p>
        <p type="p">60:第一接合部分</p>
        <p type="p">60b:第一止動表面</p>
        <p type="p">62:第二接合部分</p>
        <p type="p">62d:彎曲的底部邊緣表面</p>
        <p type="p">64:鞋附接部分</p>
        <p type="p">66:第一墊片</p>
        <p type="p">68:第二墊片</p>
        <p type="p">70:第一附接孔</p>
        <p type="p">72:第二附接孔</p>
        <p type="p">74:第三附接孔</p>
        <p type="p">78:第二角週緣</p>
        <p type="p">80:中心週緣</p>
        <p type="p">82:貫穿孔</p>
        <p type="p">91:(第一)指示器</p>
        <p type="p">92:(第二)指示器</p>
        <p type="p">93:(第三)指示器</p>
        <p type="p">94:(第四)指示器</p>
        <p type="p">95:(第一)附加指示器</p>
        <p type="p">96:(第二)附加指示器</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.JPG" file="ed10032.JPG" height="585px" img-content="tif" inline="yes" orientation="portrait" width="742px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623251</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140877</doc-number>
          <kind></kind>
          <date>114/10/22</date>
        </document-id>
      </application-reference>
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        <main-classification edition="201401120260202B">H04N19/119</main-classification>
        <further-classification edition="201401120260202B">H04N19/176</further-classification>
        <further-classification edition="201401120260202B">H04N19/426</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金仁煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, IN-HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174780</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/346,980</doc-number>
          <date>20251001</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>操作多編解碼器電路的方法</chinese-title>
        <english-title>METHOD OF OPERATING A MULTI-CODEC CIRCUIT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種操作多編解碼器電路的方法，所述多編解碼器電路經組態以支援複數個編解碼器，方法可包括從輸入影像分割的複數個編碼樹單元（coding tree unit，CTU）中選擇當前編碼樹單元，從當前編碼樹單元分割的複數個編碼單元（coding unit，CU）中選擇當前編碼單元，基於編碼單元點陣圖確定當前編碼單元的相鄰編碼單元的可用性，以及使用確定為可用的相鄰編碼單元中的至少一者對當前編碼單元執行信號處理。編碼單元點陣圖可包括複數個位元，每一者指示是否已對複數個編碼單元中的對應編碼單元執行信號處理。複數個位元中的每一者可對應於複數個編解碼器中的每一者支援的最小編碼單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method of operating a multi-codec circuit configured to support a plurality of codecs, may include selecting a current coding tree unit (CTU) from a plurality of CTUs partitioned from an input image, selecting a current coding unit (CU) from a plurality of CUs partitioned from the current CTU, determining availability of neighbor CUs of the current coding unit based on a coding unit bitmap, and performing signal processing on the current CU using at least one of the neighbor CUs that is determined to be available. The coding unit bitmap may include a plurality of bits, each indicating whether signal processing has been performed for a corresponding coding unit, among the plurality of CUs. Each of the plurality of bits may correspond to a minimum CU supported by each of the plurality of codecs.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S1100、S1200、S1300、S1400、S1500、S1600、S1700、S1800、S1001、S1002:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10038.JPG" file="ed10038.JPG" height="928px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622032</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140892</doc-number>
          <kind></kind>
          <date>114/10/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C07C41/16</main-classification>
        <further-classification edition="200601120260226B">C07C43/23</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商本州化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONSHU CHEMICAL INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西川大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIKAWA, DAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圓井邦昌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARUI, KUNIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤岡利恵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIOKA, RIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-186299</doc-number>
          <date>20241023</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-186300</doc-number>
          <date>20241023</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>日本</country>
          <doc-number>2024-186301</doc-number>
          <date>20241023</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>含有聯菲骨架之二羥基化合物的製造方法</chinese-title>
        <english-title>METHOD FOR PRODUCING BIPHENANTHRENE SKELETON-CONTAINING DIHYDROXY COMPOUND</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種可更有效率且穩定地製造含有聯菲骨架之二羥基化合物的方法。解決手段係提供一種以通式(1a)所表示之含有聯菲骨架之二羥基化合物的製造方法，係包含：於鹼性化合物及碳原子數5至9之脂肪族酮溶劑的存在下，以通式(2a)所表示之聯菲酚類與羥基伸烷氧基化劑進行反應，而得到含有以通式(1a)所表示之含有聯菲骨架之二羥基化合物的反應液之反應步驟。  &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="290px" file="ed10015.JPG" alt="ed10015.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，R&lt;sub&gt;1&lt;/sub&gt;各自獨立地表示碳原子數2至4的伸烷基，R&lt;sub&gt;2&lt;/sub&gt;各自獨立地表示碳原子數1至6的烷基、碳數6至18的芳基或鹵素原子，n各自獨立地表示0或1至4的整數；  &lt;br/&gt;&lt;img align="absmiddle" height="178px" width="297px" file="ed10016.JPG" alt="ed10016.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;式中，R&lt;sub&gt;2&lt;/sub&gt;、n係與通式(1a)的定義相同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The purpose of the present invention is to provide a method for producing a biphenanthrene skeleton-containing dihydroxy compound more efficiently and stably. As a solution, the present invention provides a method for producing a biphenanthrene skeleton-containing dihydroxy compound represented by general formula (1a), which includes a reaction step of reacting a biphenanthrol compound represented by general formula (2a) with a hydroxyalkyleneoxy agent in the presence of a basic compound and an aliphatic ketone solvent having 5 to 9 carbon atoms, to obtain a reaction solution containing the biphenanthrene skeleton-containing dihydroxy compound represented by general formula (1a). &lt;br/&gt;&lt;img align="absmiddle" height="185px" width="293px" file="ed10017.JPG" alt="ed10017.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(in formula, R&lt;sub&gt;1&lt;/sub&gt; each independently represents an alkylene group having 2 to 4 carbon atoms, R&lt;sub&gt;2&lt;/sub&gt; each independently represents an alkyl group having 1 to 6 carbon atoms, an aryl group having 6 to 18 carbon atoms or a halogen atom, n each independently represents 0 or an integer of 1 to 4.) &lt;br/&gt;&lt;img align="absmiddle" height="168px" width="297px" file="ed10018.JPG" alt="ed10018.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(in formula, R&lt;sub&gt;2&lt;/sub&gt;, n have definition as sams as those defined in general formula (1a))</p>
      </isu-abst>
      <representative-img>
        <p type="p">本案無圖式。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622956</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114140946</doc-number>
          <kind></kind>
          <date>114/10/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120260302B">G10L19/00</main-classification>
        <further-classification edition="201401120260302B">H04N19/40</further-classification>
        <further-classification edition="200601120260302B">H04L9/32</further-classification>
        <further-classification edition="201301120260302B">G06F21/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗勞恩霍夫爾協會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕雅夫　強納森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFAFF, JONATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛茲　托比亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HINZ, TOBIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇荷寧　卡斯登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUEHRING, KARSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史瓦茲　希克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHWARZ, HEIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史庫濱　羅伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SKUPIN, ROBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏契茲德拉富恩特　雅構</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANCHEZ DE LA FUENTE, YAGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黑爾吉　寇尼拉斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HELLGE, CORNELIUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏以爾　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHIERL, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬皮　迪特利夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARPE, DETLEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>威剛德　湯瑪士</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WIEGAND, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24208515.7</doc-number>
          <date>20241023</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>數據流認證中驗證鏈的處理</chinese-title>
        <english-title>HANDLING OF VERIFICATION CHAINS IN THE AUTHENTICATION OF DATA STREAMS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了用於檢查數據流的可信度的裝置和方法。根據一方面，數據流指示段是否是指派段序列中的第一段或者段是否是指派段序列中的最後段。根據另一方面，一種用於對數據流進行解碼的裝置，被配置為從數據流中導出段的時間序列內的驗證鏈是否在段處中斷。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Apparatuses and methods for checking a data stream on trustworthiness are described. According to an aspect, the data stream indicates, whether a segment is a first segment or whether a segment is a last segment of assigned sequence of segments. According to another aspect, a apparatus for decoding a data stream is configured for deriving, from the data stream, whether a verification chain within a temporal sequence of segments is interrupted at a segment.</p>
      </isu-abst>
      <representative-img>
        <p type="p">13:預定部分</p>
        <p type="p">14:數據流</p>
        <p type="p">16:有效載荷分組</p>
        <p type="p">18:補充信息分組</p>
        <p type="p">19:補充信息消息</p>
        <p type="p">20:裝置；解碼器</p>
        <p type="p">21:提取器；導出</p>
        <p type="p">30:部分確定器；確定</p>
        <p type="p">41:驗證模組；可信度檢查</p>
        <p type="p">43:數位簽名</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="708px" img-content="tif" inline="yes" orientation="portrait" width="852px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622720</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141064</doc-number>
          <kind></kind>
          <date>114/10/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G06F3/044</main-classification>
        <further-classification edition="201301120260224B">G06F3/0487</further-classification>
        <further-classification edition="200601120260224B">G06F3/02</further-classification>
        <further-classification edition="200601120260224B">G02F1/133</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英國商微晶片觸控解決方案公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MICROCHIP TOUCH SOLUTIONS LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德魯　傑克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DREW, JAKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/710,718</doc-number>
          <date>20241023</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/365,470</doc-number>
          <date>20251022</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含力度偵測的力度區域之電容式觸控感測器，以及相關方法、設備及系統</chinese-title>
        <english-title>CAPACITIVE TOUCH SENSOR INCLUDING FORCE REGIONS FOR FORCE DETECTION, AND RELATED METHODS, APPARATUSES, AND SYSTEMS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包含電容式觸控感測器。該電容式觸控感測器係回應於該電容式觸控感測器之電容式觸控靈敏區內之多個觸控點中之各別者處的觸控，而提供電容式觸控偵測之第一電容式節點量測值。諸第一電容式節點量測值指示該電容式觸控感測器之一或多個第一電容式節點處的電容之減小。該電容式觸控感測器亦回應於該電容式觸控感測器之一或多個力度區域中之各別者處的觸控表面下壓，而提供力度偵測之第二電容式節點量測值。諸第二電容式節點量測值指示該電容式觸控感測器之一或多個第二電容式節點處的電容之增加。其一或多個實例中，該一或多個力度區域為該電容式觸控感測器之一或多個豎直堆疊層的豎直可移位分段部分。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus includes a capacitive touch sensor. The capacitive touch sensor is to provide first capacitive node measurements for capacitive touch detection responsive to touch at a respective one of multiple touch points within a capacitive touch-sensitive area of the capacitive touch sensor. The first capacitive node measurements indicate a reduction in capacitance at one or more first capacitive nodes of the capacitive touch sensor. The capacitive touch sensor is to also provide second capacitive node measurements for force detection responsive to touch surface depression at a respective one of one or more force regions of the capacitive touch sensor. The second capacitive node measurements indicate an increase in capacitance at one or more second capacitive nodes of the capacitive touch sensor. In one or more examples, the one or more force regions are vertically-displaceable, sectioned portions of one or more vertically-stacked layers of the capacitive touch sensor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:觸控螢幕</p>
        <p type="p">104:電容式觸控靈敏區</p>
        <p type="p">106:觸控螢幕按鈕</p>
        <p type="p">108:觸控螢幕按鈕</p>
        <p type="p">110:觸控螢幕構件</p>
        <p type="p">112:顯示器上旋鈕(KoD)構件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="707px" img-content="tif" inline="yes" orientation="portrait" width="881px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622042</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141104</doc-number>
          <kind></kind>
          <date>114/10/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">C07D207/444</main-classification>
        <further-classification edition="200601120251201B">C07F7/18</further-classification>
        <further-classification edition="200601120251201B">C07F15/00</further-classification>
        <further-classification edition="200601120251201B">C08K3/08</further-classification>
        <further-classification edition="200601120251201B">C08K5/3415</further-classification>
        <further-classification edition="200601120251201B">C08K5/5425</further-classification>
        <further-classification edition="200601120251201B">C08L101/00</further-classification>
        <further-classification edition="200601120251201B">C08J3/12</further-classification>
        <further-classification edition="200601120251201B">B01J31/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商陶氏有機矽公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW SILICONES CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商陶氏東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW TORAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福井弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUI, HIROSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　佔傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, ZHANJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>今泉徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IMAIZUMI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,933</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鉑-順丁烯二醯亞胺錯合物</chinese-title>
        <english-title>PLATINUM MALEIMIDE COMPLEX</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種微粒鉑-順丁烯二醯亞胺樹脂錯合物，其包含：  &lt;br/&gt;a)    式1之化合物：  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="147px" width="176px" file="ed10008.JPG" alt="ed10008.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;其中R係如本文所定義；及  &lt;br/&gt;b)    包埋該式1之化合物之熱塑性樹脂。  &lt;br/&gt;本發明藉由提供微粒鉑-順丁烯二醯亞胺樹脂錯合物來解決所屬技術領域中之需求，該錯合物可用於提供藉由矽氫化快速固化之儲存穩定的組成物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a microparticle platinum-maleimide resin complex comprising: &lt;br/&gt;a) a compound of Formula 1: &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="148px" width="186px" file="ed10009.JPG" alt="ed10009.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;br/&gt;where R is as defined herein; and &lt;br/&gt;b) a thermoplastic resin embedding the compound of Formula 1. &lt;br/&gt;The present invention addresses a need in the art by providing a microparticle platinum-maleimide resin complex that can be used to provide shelf-stable compositions cured rapidly by hydrosilylation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622760</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141105</doc-number>
          <kind></kind>
          <date>114/10/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">G06F13/40</main-classification>
        <further-classification edition="200601120251201B">G06F13/42</further-classification>
        <further-classification edition="200601120251201B">G06F13/24</further-classification>
        <further-classification edition="200601120251201B">G06F13/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>英商ＡＲＭ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARM LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>GB</english-country>
              <english-address>GB</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>圖馬拉　阿肖克庫馬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TUMMALA, ASHOK KUMAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯卡雷拉　蘭德爾約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASCARELLA, RANDALL JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>塔瓦拉吉里　阿布海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAVARAGIRI, ABHAY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢密爾頓　崔維斯貝利</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAMILTON, TRAVIS BAILEY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉弗　查爾斯安德魯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIEFER, CHARLES ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>拉米雷斯　凱撒亞倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMIREZ, CESAR AARON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>查克拉拉　維斯瓦納特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAKRALA, VISWANATH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>印度</country>
          <doc-number>202411088574</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>橋接電路系統</chinese-title>
        <english-title>BRIDGE CIRCUITRY</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種設備包含：一外部埠控制器，其經組態以控制根據一外部鏈路協定所定義之外部鏈路協定封包的通訊，該通訊係經由用於與一鏈路夥伴通訊的一外部通訊鏈路來進行；及橋接電路系統，其經組態以在該等外部鏈路協定封包與記憶體系統互連件異動之間進行映射，該等記憶體系統互連件異動係根據由一記憶體系統互連件所使用的一記憶體系統互連件協定來定義。該橋接電路系統及該外部埠控制器經由一內部通訊鏈路耦接，且經組態以使用一內部鏈路協定在該橋接電路系統與該外部埠控制器之間輸送該等外部鏈路協定封包。該橋接電路系統包含異動排序電路系統，該異動排序電路系統經組態以執行由該外部鏈路協定所施加的外部鏈路協定異動排序規則，以限制對應於在該外部通訊鏈路上與該鏈路夥伴通訊的外部鏈路協定封包的各別資料存取異動之間的排序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus comprises: an external port controller configured to control communication, via an external communication link for communicating with a link partner, of external link protocol packets defined according to an external link protocol; and bridge circuitry configured to map between the external link protocol packets and memory system interconnect transactions defined according to a memory system interconnect protocol used by a memory system interconnect. The &lt;br/&gt;bridge circuitry and the external port controller are coupled via an internal communication link and are configured to use an internal link protocol to transport the external link protocol packets between the bridge circuitry and the external port controller. The bridge circuitry comprises transaction ordering circuitry configured to enforce external link protocol transaction ordering rules imposed by the external link protocol to restrict ordering between respective data access transactions corresponding to external link protocol packets communicated with the link partner on the external communication link.</p>
      </isu-abst>
      <representative-img>
        <p type="p">8:主機記憶體系統互連件</p>
        <p type="p">12:橋接器</p>
        <p type="p">15:外部埠控制器</p>
        <p type="p">16:外部鏈路協定</p>
        <p type="p">18:鏈路夥伴</p>
        <p type="p">40:資料鏈路層編碼/解碼電路系統</p>
        <p type="p">54:協定映射電路系統</p>
        <p type="p">70:內部鏈路協定</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="769px" img-content="tif" inline="yes" orientation="portrait" width="650px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623691</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141213</doc-number>
          <kind></kind>
          <date>114/10/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W40/00</further-classification>
        <further-classification edition="202601120260302B">H10W10/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕提爾　安尼基特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATIL, ANIKET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿爾德雷特　馬努埃爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALDRETE, MANUEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　志傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHIJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/949,873</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含整合裝置、金屬化部分、及偏移記憶體裝置的封裝</chinese-title>
        <english-title>PACKAGE COMPRISING AN INTEGRATED DEVICE, A METALLIZATION PORTION AND AN OFFSET MEMORY DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種封裝，其包含：一基材；一整合裝置，其耦接至該基材；一金屬化部分，其耦接至該整合裝置之一背側；複數個打線接合，其耦接至該基材及該金屬化部分；及一囊封層，其耦接至該金屬化部分及該基材，其中該囊封層至少部分地囊封該整合裝置及該複數個打線接合。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A package comprising a substrate; an integrated device coupled to the substrate; a metallization portion coupled to a back side of the integrated device; a plurality of wire bonds coupled to the substrate and the metallization portion; and an encapsulation layer coupled to the metallization portion and the substrate, wherein the encapsulation layer at least partially encapsulates the integrated device and the plurality of wire bonds.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:封裝</p>
        <p type="p">101:板</p>
        <p type="p">102:基材</p>
        <p type="p">103:整合裝置</p>
        <p type="p">104:金屬化部分</p>
        <p type="p">105:散熱器</p>
        <p type="p">106:囊封層</p>
        <p type="p">107:整合裝置</p>
        <p type="p">108:打線接合</p>
        <p type="p">110:板介電層</p>
        <p type="p">111:板互連件</p>
        <p type="p">114:焊料互連件</p>
        <p type="p">120:介電層</p>
        <p type="p">122:互連件</p>
        <p type="p">124:阻焊層</p>
        <p type="p">130:柱互連件</p>
        <p type="p">132:焊料互連件</p>
        <p type="p">140:介電層</p>
        <p type="p">142:金屬化互連件</p>
        <p type="p">150:熱界面材料(TIM)</p>
        <p type="p">160:底部填充物</p>
        <p type="p">170:焊料互連件</p>
        <p type="p">180:球接合</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="674px" img-content="tif" inline="yes" orientation="portrait" width="1053px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623093</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141220</doc-number>
          <kind></kind>
          <date>114/10/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01Q1/38</main-classification>
        <further-classification edition="200601120260302B">H01Q1/48</further-classification>
        <further-classification edition="200601120260302B">G06F1/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳鶴中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HO-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪崇育</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/711,734</doc-number>
          <date>20241025</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/365,376</doc-number>
          <date>20251022</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>可穿戴電子裝置</chinese-title>
        <english-title>WEARABLE ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種可穿戴電子裝置。該可穿戴電子裝置包括第一結構和第二結構。該第一結構包括第一天線模組。該第一天線模組嵌入在該第一結構中。該第二結構可移動地安裝在該第一結構上。該第二結構包括設置在該第二結構中或上的第二天線模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A wearable electronic device is provided. The wearable electronic device includes a first structure and a second structure. The first structure includes a first antenna module. The first antenna module is embedded in the first structure. The second structure is movably mounted on the first structure. The second structure includes a second antenna module disposed in or on the second structure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">500,500A:可穿戴電子裝置</p>
        <p type="p">100:第一結構</p>
        <p type="p">102:顯示模組</p>
        <p type="p">102T:頂表面</p>
        <p type="p">104:外殼</p>
        <p type="p">106:第一天線</p>
        <p type="p">108:第一接地元件</p>
        <p type="p">110:第一天線模組</p>
        <p type="p">150:圖標</p>
        <p type="p">200:第二結構</p>
        <p type="p">206:第二天線</p>
        <p type="p">208:第二接地元件</p>
        <p type="p">210:第二天線模組</p>
        <p type="p">280:鉸鏈</p>
        <p type="p">210AE:邊緣</p>
        <p type="p">300:腕帶</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="715px" img-content="tif" inline="yes" orientation="portrait" width="946px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621767</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141224</doc-number>
          <kind></kind>
          <date>114/10/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260122B">A63F13/211</main-classification>
        <further-classification edition="201401120260122B">A63F13/428</further-classification>
        <further-classification edition="201401120260122B">A63F13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁寶電腦工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COMPAL ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林蔚繻</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEI-RU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉昆艷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KUN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴自堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, TZU-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>游宏裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, HUNG-YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡佳韋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, JIA-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王弘典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HONG-TIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉志堅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIH-CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡易軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, I-HSUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,881</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>手持電子裝置</chinese-title>
        <english-title>HANDHELD ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種手持電子裝置，包括一裝置主體、一顯示螢幕、一動態感測單元及一控制單元。顯示螢幕沿一第一轉動軸線可轉動地設置於裝置主體且具有一顯示面。動態感測單元配置於裝置主體且適於感測顯示面相對於一水平面的一傾斜角度，水平面垂直於重力方向。控制單元耦接於動態感測單元及裝置主體。當傾斜角度小於一預定角度時，控制單元控制裝置主體禁止顯示螢幕沿第一轉動軸線相對於裝置主體轉動。當傾斜角度不小於預定角度時，控制單元控制裝置主體允許顯示螢幕相對於裝置主體沿第一轉動軸線轉動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A handheld electronic device includes a device body, a display screen, a dynamic sensing unit and a control unit. The display screen is rotatably disposed on the device body along a first rotation axis and has a display surface. The dynamic sensing unit is disposed on the device body and is adapted to sense an inclination angle of the display surface relative to a horizontal plane, and the horizontal plane is perpendicular to a direction of gravity. The control unit is coupled to the dynamic sensing unit and the device body. When the inclination angle is less than a predetermined angle, the control unit controls the device body to prohibit the display screen from rotating along the first rotation axis relative to the device body. When the inclination angle is not less than the predetermined angle, the control unit controls the device body to allow the display screen to rotate along the first rotation axis relative to the device body.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:手持式電子裝置</p>
        <p type="p">110:裝置主體</p>
        <p type="p">1101:手把部</p>
        <p type="p">1102:容置槽</p>
        <p type="p">1102a:弧形內緣</p>
        <p type="p">110a:按鍵</p>
        <p type="p">110b:搖桿</p>
        <p type="p">110c、110d:按鈕</p>
        <p type="p">112:機體</p>
        <p type="p">120:顯示螢幕</p>
        <p type="p">1201:弧形外緣</p>
        <p type="p">120a:顯示面</p>
        <p type="p">A1:第一轉動軸線</p>
        <p type="p">A2:第二轉動軸線</p>
        <p type="p">L1:長邊</p>
        <p type="p">L2:短邊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10029.png" file="d10029.TIF" giffile="ed10029.png" height="688px" img-content="tif" inline="yes" orientation="portrait" width="1008px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623108</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141245</doc-number>
          <kind></kind>
          <date>114/10/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">H01R13/05</main-classification>
        <further-classification edition="200601120251201B">H01R13/652</further-classification>
        <further-classification edition="200601120251201B">H01R13/426</further-classification>
        <further-classification edition="201101120251201B">H01R12/52</further-classification>
        <further-classification edition="200601120251201B">H01R43/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚坤磷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊藤芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, TENGFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申歡歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HUANHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116789425</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器包括安裝殼體以及第一端子模組。第一端子模組包括第一訊號端子、第二訊號端子、第一接地端子以及第二接地端子。每一個第一導電端子均包括第一接觸彈臂，第一接觸彈臂設有第一弧形端部。第一接地端子的第一弧形端部的高度大於第一訊號端子的第一弧形端部的高度，第一接地端子的第一弧形端部的高度大於第二訊號端子的第一弧形端部的高度，第二接地端子的第一弧形端部的高度大於第一訊號端子的第一弧形端部的高度，第二接地端子的第一弧形端部的高度大於第二訊號端子的第一弧形端部的高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes a mounting housing and a first terminal module. The first terminal module includes a first signal terminal, a second signal terminal, a first ground terminal and a second ground terminal. Each first conductive terminal includes a first contact elastic arm having a first arc-shaped end portion. A dimension of the first arc-shaped end portion of the first ground terminal is larger than a dimension of the first arc-shaped end portion of the first signal terminal, and is also larger than a dimension of the first arc-shaped end portion of the second signal terminal. A dimension of the first arc-shaped end portion of the second ground terminal is larger than the dimension of the first arc-shaped end portion of the first signal terminal, and is also larger than the dimension of the first arc-shaped end portion of the second signal terminal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">411:第一接觸彈臂</p>
        <p type="p">4111:第一弧形端部</p>
        <p type="p">C:圖28中畫圈部分</p>
        <p type="p">G1:第一接地端子</p>
        <p type="p">G2:第二接地端子</p>
        <p type="p">S1:第一訊號端子</p>
        <p type="p">S2:第二訊號端子</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10062.JPG" file="ed10062.JPG" height="624px" img-content="tif" inline="yes" orientation="portrait" width="712px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623109</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141246</doc-number>
          <kind></kind>
          <date>114/10/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">H01R13/05</main-classification>
        <further-classification edition="200601120251201B">H01R13/652</further-classification>
        <further-classification edition="201101120251201B">H01R12/52</further-classification>
        <further-classification edition="200601120251201B">H01R43/16</further-classification>
        <further-classification edition="200601120251201B">H01R13/426</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商東莞立訊技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚坤磷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, KUNLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊藤芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIONG, TENGFANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申歡歡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, HUANHUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李有財</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116789425</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電連接器</chinese-title>
        <english-title>ELECTRICAL CONNECTOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電連接器包括安裝殼體以及第一端子模組。第一端子模組包括第一訊號端子、第二訊號端子、第一接地端子以及第二接地端子。每一個第一導電端子均包括第一接觸彈臂，第一接觸彈臂設有第一弧形端部。第一接地端子的第一弧形端部的高度大於第一訊號端子的第一弧形端部的高度，第一接地端子的第一弧形端部的高度大於第二訊號端子的第一弧形端部的高度，第二接地端子的第一弧形端部的高度大於第一訊號端子的第一弧形端部的高度，第二接地端子的第一弧形端部的高度大於第二訊號端子的第一弧形端部的高度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electrical connector includes a mounting housing and a first terminal module. The first terminal module includes a first signal terminal, a second signal terminal, a first ground terminal and a second ground terminal. Each first conductive terminal includes a first contact elastic arm having a first arc-shaped end portion. A dimension of the first arc-shaped end portion of the first ground terminal is larger than a dimension of the first arc-shaped end portion of the first signal terminal, and is also larger than a dimension of the first arc-shaped end portion of the second signal terminal. A dimension of the first arc-shaped end portion of the second ground terminal is larger than the dimension of the first arc-shaped end portion of the first signal terminal, and is also larger than the dimension of the first arc-shaped end portion of the second signal terminal.</p>
      </isu-abst>
      <representative-img>
        <p type="p">411:第一接觸彈臂</p>
        <p type="p">4111:第一弧形端部</p>
        <p type="p">C:圖28中畫圈部分</p>
        <p type="p">G1:第一接地端子</p>
        <p type="p">G2:第二接地端子</p>
        <p type="p">S1:第一訊號端子</p>
        <p type="p">S2:第二訊號端子</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10062.JPG" file="ed10062.JPG" height="568px" img-content="tif" inline="yes" orientation="portrait" width="663px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621934</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141338</doc-number>
          <kind></kind>
          <date>114/10/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251231B">B62K23/02</main-classification>
        <further-classification edition="200601120251231B">B62M25/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高山仁志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAYAMA, HITOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日高祐一郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDAKA, YUICHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>102024211416.2</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於人力交通工具之操作系統</chinese-title>
        <english-title>OPERATING SYSTEM FOR HUMAN-POWERED VEHICLE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於一人力交通工具V之操作系統10。該操作系統10包括一第一操作裝置12、一第二操作裝置14、至少一個無線通信器24、26、一電池28及一充電埠30。該第一操作裝置12包含一第一基座部件68及至少一個第一電開關。該第二操作裝置14包含一第二基座部件78及至少一個第二電開關。該至少一個無線通信器24、26經設置至該第一操作裝置12及該第二操作裝置14之至少一者。該電池28僅設置至該第一操作裝置12及該第二操作裝置14之其中一者。該充電埠30僅設置至該第一操作裝置12及該第二操作裝置14之其中一者。該第一操作裝置12及該第二操作裝置14經由一電線W1電連接以由該電池28供應電力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operating system 10 is provided for a human-powered vehicle V. The operating system 10 comprises a first operating device 12, a second operating device 14, at least one wireless communicator 24, 26, a battery 28 and a charging port 30. The first operating device 12 includes a first base member 68 and at least one first electrical switch. The second operating device 14 includes a second base member 78 and at least one second electrical switch. The at least one wireless communicator 24, 26 is provided to at least one of the first operating device 12 and the second operating device 14. The battery 28 is provided to only one of the first operating device 12 and the second operating device 14. The charging port 30 is provided to only one of the first operating device 12 and the second operating device 14. The first operating device 12 and the second operating device 14 are electrically connected via an electrical wire W1 to be supplied with electrical power from the battery 28.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:操作系統</p>
        <p type="p">12:第一操作裝置/制動-換檔操作裝置</p>
        <p type="p">14:第二操作裝置/制動-換檔操作裝置</p>
        <p type="p">16:第三操作裝置/第一無線開關/換檔操作裝置</p>
        <p type="p">18:第四操作裝置/第二無線開關/換檔操作裝置</p>
        <p type="p">20:第五操作裝置(第一額外電開關)</p>
        <p type="p">22:第六操作裝置(第二額外電開關)</p>
        <p type="p">CC1:第一鏈條籠</p>
        <p type="p">CC2:第二鏈條籠</p>
        <p type="p">CP:中心平面</p>
        <p type="p">FD:前變速器/經操作裝置</p>
        <p type="p">H1:車把</p>
        <p type="p">H2:輔助車把</p>
        <p type="p">M1:第一電動馬達</p>
        <p type="p">M2:第二電動馬達</p>
        <p type="p">RD:後變速器/經操作裝置</p>
        <p type="p">W1:電線</p>
        <p type="p">W2:第二電線</p>
        <p type="p">W3:第三電線</p>
        <p type="p">WU1:第一無線通信單元</p>
        <p type="p">WU2:第二無線通信單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="1041px" img-content="tif" inline="yes" orientation="portrait" width="751px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623540</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141339</doc-number>
          <kind></kind>
          <date>114/10/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/60</main-classification>
        <further-classification edition="200601120260302B">B05B13/04</further-classification>
        <further-classification edition="201801120260302B">B05B15/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島章宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福本将也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUMOTO, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-191033</doc-number>
          <date>20241030</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明於致動器與噴嘴本體之間之空間中，可以任意形狀設計壓力感測器，實現基板處理裝置之構成之小型化。處理單元具備：噴嘴本體，其朝向基板之下表面周緣部噴出處理液；軸，其藉由馬達之驅動而於基板之半徑方向進退移動；壓力感測器，其取得於馬達與噴嘴本體之間產生之壓力值；及原點位置檢測部，其當壓力值成為預先設定之閾值以上時，檢測為噴嘴本體返回至原點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:噴嘴塊</p>
        <p type="p">51,51A:處理液噴出噴嘴部</p>
        <p type="p">52:噴嘴本體</p>
        <p type="p">52a:噴嘴頭部</p>
        <p type="p">52b:軸形狀部</p>
        <p type="p">53:噴嘴驅動部</p>
        <p type="p">54:支持基座</p>
        <p type="p">55:壓力感測器</p>
        <p type="p">55F:平面</p>
        <p type="p">521:噴出口</p>
        <p type="p">522:歧管部</p>
        <p type="p">523:軸孔</p>
        <p type="p">524:螺母</p>
        <p type="p">531:馬達</p>
        <p type="p">531A:旋轉軸部</p>
        <p type="p">531E:端部</p>
        <p type="p">532:軸</p>
        <p type="p">533:軸承</p>
        <p type="p">533A:套筒型軸承</p>
        <p type="p">533F:內周面</p>
        <p type="p">534:殼體</p>
        <p type="p">534a:槽</p>
        <p type="p">535:馬達固持器</p>
        <p type="p">536:密封環</p>
        <p type="p">537:按壓構件</p>
        <p type="p">542:耳部</p>
        <p type="p">543:螺釘</p>
        <p type="p">572:凸緣部位</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="615px" img-content="tif" inline="yes" orientation="portrait" width="836px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623541</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141342</doc-number>
          <kind></kind>
          <date>114/10/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/60</main-classification>
        <further-classification edition="201801120260302B">B05B15/16</further-classification>
        <further-classification edition="201801120260302B">B05B15/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福本将也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUMOTO, SHOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>根本脩平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NEMOTO, SHUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-191035</doc-number>
          <date>20241030</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可進行噴嘴之位置調整、蝕刻寬度之處理精度亦較高，且還可抑制微粒向基板處理區域流出的機構。噴嘴機構具有噴嘴本體、與使噴嘴本體於基板之半徑方向往復移動之噴嘴驅動部，噴嘴本體於與噴出口相反側具有軸形狀部。噴嘴驅動部具備連接於致動器並卡合於軸形狀部之軸、支持軸形狀部之軸承、及以固定且覆蓋之方式收容致動器及軸承之收容固定部，軸及軸承係同軸配置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">50:噴嘴塊(噴嘴機構)</p>
        <p type="p">51,51A:處理液噴出噴嘴部</p>
        <p type="p">52:噴嘴本體</p>
        <p type="p">52a:噴嘴頭部</p>
        <p type="p">52b:軸形狀部</p>
        <p type="p">53:噴嘴驅動部</p>
        <p type="p">54:支持基座</p>
        <p type="p">521:噴出口</p>
        <p type="p">522:歧管部</p>
        <p type="p">523:軸孔</p>
        <p type="p">524:螺母</p>
        <p type="p">531:馬達(致動器)</p>
        <p type="p">532:軸</p>
        <p type="p">533:軸承</p>
        <p type="p">533A:套筒型軸承</p>
        <p type="p">534:殼體(收容固定部)</p>
        <p type="p">534a:槽</p>
        <p type="p">535:馬達固持器</p>
        <p type="p">536:密封環</p>
        <p type="p">537:按壓構件</p>
        <p type="p">542:耳部</p>
        <p type="p">543:螺釘</p>
        <p type="p">572:凸緣部位</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="589px" img-content="tif" inline="yes" orientation="portrait" width="865px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622894</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141465</doc-number>
          <kind></kind>
          <date>114/10/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260228B">G06T9/00</main-classification>
        <further-classification edition="200601120260228B">G06T17/20</further-classification>
        <further-classification edition="201401120260228B">H04N19/103</further-classification>
        <further-classification edition="201101120260228B">G06T19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿克塔　安尼克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKHTAR, ANIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PK</english-country>
              <english-address>PK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>汎　德　奧維拉　葛特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DER AUWERA, GEERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞瑪蘇布雷蒙尼安　阿達許　克里許納</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMASUBRAMONIAN, ADARSH KRISHNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡達　雷圖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOODA, REETU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡茲維克茲　馬塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KARCZEWICZ, MARTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/712,120</doc-number>
          <date>20241025</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/366,792</doc-number>
          <date>20251023</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>Ｖ－ＤＭＣ基礎網格寫碼器中的法線向量編碼的定點整數實施方案</chinese-title>
        <english-title>FIXED-POINT INTEGER IMPLEMENTATION OF NORMAL VECTOR ENCODING IN V-DMC BASE MESH CODER</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於處理網格資料的裝置經組態以將多平行四邊形預測或叉積預測的一者選擇為用於該網格資料的一網格的一經選擇預測程序；回應於針對該網格的一第一頂點判定一第一組已解碼法線向量可用，使用該經選擇預測程序判定該第一頂點的一經預測法線向量；正規化及擴縮該第一頂點的該經預測法線向量，以產生一經正規化及擴縮法線向量；及基於該經正規化及擴縮法線向量，輸出該網格的一經解碼版本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device for processing mesh data is configured to select one of multi-parallelogram prediction or cross product prediction as a selected prediction process for a mesh of the mesh data; in response to determining for a first vertex of the mesh that a first set of already decoded normal vectors are available, determine a predicted normal vector for the first vertex using the selected prediction process; normalize and scale the predicted normal vector for the first vertex to generate a normalized and scaled normal vector; and output a decoded version of the mesh based on the normalized and scaled normal vector.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1502:方塊；步驟</p>
        <p type="p">1504:方塊；步驟</p>
        <p type="p">1506:方塊；步驟</p>
        <p type="p">1510:步驟</p>
        <p type="p">1512:步驟</p>
        <p type="p">1514:步驟</p>
        <p type="p">1516:步驟</p>
        <p type="p">1518:步驟</p>
        <p type="p">1520:步驟</p>
        <p type="p">1522:步驟</p>
        <p type="p">1524:步驟</p>
        <p type="p">1526:步驟</p>
        <p type="p">1528:步驟</p>
        <p type="p">1530:步驟</p>
        <p type="p">1532:步驟</p>
        <p type="p">1534:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10114.JPG" file="ed10114.JPG" height="1066px" img-content="tif" inline="yes" orientation="portrait" width="801px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622964</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141488</doc-number>
          <kind></kind>
          <date>114/10/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C7/18</main-classification>
        <further-classification edition="200601120260302B">G11C8/14</further-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
        <further-classification edition="202601120260302B">H10D80/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳成男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LYU, SUNGNAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金碩壎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SUKHOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧孝貞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOH, HYOJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李道仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DOSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓栽勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JAEHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0164011</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括：基板；基板上的多個半導體圖案；接觸每個半導體圖案在第一方向上的第一端部分並在垂直於基板的上表面的第三方向上延伸的位元線；分別在第三方向上與多個半導體圖案重疊並在與第一方向相交的第二方向上延伸的多個字元線；以及接觸每個半導體圖案沿著第一方向的第二端部分的多個電容器。每個字元線包括依序定位在每個半導體圖案上的第一導電襯裡層、第二導電襯裡層、以及導電層。第一導電襯裡層和第二導電襯裡層包括彼此不同的材料或包括具有彼此不同的組成比率的相同材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device including a substrate, a plurality of semiconductor patterns on the substrate, a bit line contacting a first end portion of each semiconductor pattern in a first direction and extending in a third direction perpendicular to an upper surface of the substrate, a plurality of word lines overlapping the plurality of semiconductor patterns, respectively, in the third direction and extending in a second direction intersecting the first direction, and a plurality of capacitors contacting a second end portion of each semiconductor pattern along the first direction. Each word line includes a first conductive liner layer, a second conductive liner layer, and a conductive layer sequentially positioned on each semiconductor pattern. The first conductive liner layer and the second conductive liner layer include different materials from each other or include same materials having different composition ratios from each other.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:基板</p>
        <p type="p">120:第一絕緣圖案</p>
        <p type="p">130:層間絕緣層</p>
        <p type="p">140:半導體圖案</p>
        <p type="p">151,153:導電襯裡層</p>
        <p type="p">155:導電層</p>
        <p type="p">160:第二絕緣圖案</p>
        <p type="p">170:電容器</p>
        <p type="p">171:第一電極</p>
        <p type="p">173:介電層</p>
        <p type="p">175:第二電極</p>
        <p type="p">177:板電極</p>
        <p type="p">A-A':線</p>
        <p type="p">BL:位元線</p>
        <p type="p">DR1:第一方向</p>
        <p type="p">DR2:第二方向</p>
        <p type="p">DR3:第三方向</p>
        <p type="p">Gox:閘極絕緣圖案</p>
        <p type="p">MC:記憶體單元</p>
        <p type="p">WL:字元線</p>
        <p type="p">WLC:字元線頂蓋圖案</p>
        <p type="p">WLS:字元線結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.bmp" file="ed10005.bmp" height="913px" img-content="tif" inline="yes" orientation="portrait" width="717px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621827</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141532</doc-number>
          <kind></kind>
          <date>114/10/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251125B">B23K26/03</main-classification>
        <further-classification edition="201401120251125B">B23K26/062</further-classification>
        <further-classification edition="201401120251125B">B23K26/04</further-classification>
        <further-classification edition="201401120251125B">B23K26/064</further-classification>
        <further-classification edition="201401120251125B">B23K26/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立臺灣大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NATIONAL TAIWAN UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁健芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, CHIEN-FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉　承峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAU, SHING-FUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, DARREN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡秀玫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡依庭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113144158</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>雷射標記系統</chinese-title>
        <english-title>LASER MARKING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種雷射標記系統，其係應用於一輸送裝置，該輸送裝置輸送一目標物，本發明之雷射標記系統係包含一控制單元、一第一影像單元以及一雷射模組，且該雷射模組係包含一光源以及一振鏡組，其中該第一影像單元擷取一第一影像資料並傳送至該控制單元後，該控制單元依據該第一影像資料控制該雷射模組，使該雷射模組與該目標物之間產生一目標距離，且該控制單元藉由計算一參數產生一計算結果，該控制單元依據該計算結果控制該光源發射一雷射光線並控制該振鏡組以投射該雷射光線至該目標物之一目標位置，以解決習知在進行肉品標記時會產生大量廢棄標籤之問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a laser marking system, which is applied to a conveying device. The conveying device conveys a target object. The laser marking system includes a control unit, a first image unit and a laser module. The laser module includes a light source and an optical lens group. Wherein the first image unit captures a first image data and transmits it to the control unit, the control unit controls the laser module based on the first image data for generating a target distance between the laser module and the target object, and the control unit generates a calculation result by calculating a parameter. The control unit controls the light source to emit a laser beam based on the calculation result. The laser beam is controlled by the optical lens group to project the laser beam to a target position of the target object, so as to solve the prior art issue of producing a large number of discarded labels as marking meat.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雷射標記系統</p>
        <p type="p">3:輸送裝置</p>
        <p type="p">5:目標物</p>
        <p type="p">51:目標位置</p>
        <p type="p">53:目標距離</p>
        <p type="p">10:控制單元</p>
        <p type="p">11:打標資料</p>
        <p type="p">15:參數</p>
        <p type="p">151:計算結果</p>
        <p type="p">20:第一影像單元</p>
        <p type="p">21:第一影像資料</p>
        <p type="p">30:雷射模組</p>
        <p type="p">31:光源</p>
        <p type="p">310:雷射光線</p>
        <p type="p">33:振鏡組</p>
        <p type="p">W:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="715px" img-content="tif" inline="yes" orientation="portrait" width="939px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623154</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141554</doc-number>
          <kind></kind>
          <date>114/10/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120260129B">H02K11/38</main-classification>
        <further-classification edition="201601120260129B">H02K11/22</further-classification>
        <further-classification edition="200601120260129B">H02K7/12</further-classification>
        <further-classification edition="200601120260129B">H02K7/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>植松秀俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UEMATSU, HIDETOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尾高俊一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODAKA, SHUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田口泰地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAGUCHI, TAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/042214</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>致動器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示之致動器包含：馬達；減速機；第一中空軸，其構成上述馬達之轉子；第二中空軸，其固定於上述減速機之輸出軸；主編碼器，其檢測上述馬達之馬達軸之位置；及副編碼器，其檢測上述減速機之輸出軸之位置。上述主編碼器之第一檢測部固定於上述馬達之上述定子或上述致動器之殼體。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">5a:致動器</p>
        <p type="p">6a:單元</p>
        <p type="p">10:馬達</p>
        <p type="p">10a:殼體</p>
        <p type="p">10b:凸緣</p>
        <p type="p">11:定子</p>
        <p type="p">12:轉子</p>
        <p type="p">13:馬達軸</p>
        <p type="p">15:主編碼器</p>
        <p type="p">15A:旋轉盤</p>
        <p type="p">15B:檢測部</p>
        <p type="p">18:第一支持構件</p>
        <p type="p">18a:突起部</p>
        <p type="p">18b:延長部</p>
        <p type="p">20:減速機</p>
        <p type="p">22:中空部分</p>
        <p type="p">23:輸出部</p>
        <p type="p">23a:延長部</p>
        <p type="p">25:次編碼器</p>
        <p type="p">25A:旋轉盤</p>
        <p type="p">25B:檢測部</p>
        <p type="p">28:第二支持構件</p>
        <p type="p">29:軸承</p>
        <p type="p">31:第一耦合部</p>
        <p type="p">39:連接器</p>
        <p type="p">41:延長構件</p>
        <p type="p">42:基板</p>
        <p type="p">B:電磁制動器</p>
        <p type="p">E:編碼器</p>
        <p type="p">S:力感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="767px" img-content="tif" inline="yes" orientation="portrait" width="986px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622347</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141595</doc-number>
          <kind></kind>
          <date>114/10/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260228B">E04H4/00</main-classification>
        <further-classification edition="200601120260228B">E04H4/02</further-classification>
        <further-classification edition="200601120260228B">E04H4/14</further-classification>
        <further-classification edition="200601120260228B">E04H3/16</further-classification>
        <further-classification edition="200601120260228B">A63G31/00</further-classification>
        <further-classification edition="202401120260228B">G06Q50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商水晶潟湖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CRYSTAL LAGOONS TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲斯曼　費爾南多</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FISCHMANN, FERNANDO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CL</english-country>
              <english-address>CL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/720,570</doc-number>
          <date>20241114</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/051,926</doc-number>
          <date>20250212</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>19/095,944</doc-number>
          <date>20250331</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括數位處理設施和向此設施提供冷卻的娛樂人造游泳潟湖的被配置為促進環境可持續性和社區效益的可持續熱傳遞系統</chinese-title>
        <english-title>A SUSTAINABLE HEAT TRANSFER SYSTEM THAT INCLUDES A DIGITAL PROCESSING FACILITY AND A RECREATIONAL MAN-MADE SWIMMING LAGOON THAT PROVIDES COOLING TO SUCH FACILITY, THE SYSTEM BEING CONFIGURED FOR CONTRIBUTING TO ENVIRONMENTAL SUSTAINABILITY AND COMMUNITY BENEFITS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可持續熱傳遞系統，包括數位處理設施和為該設施提供冷卻的娛樂人造游泳潟湖，該系統被配置用於促進環境可持續性和社區效益，該系統包括人造游泳潟湖、高溫水處理系統和廢熱傳遞機構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sustainable heat transfer system that includes a digital processing facility and a recreational man-made swimming lagoon that provides cooling for such facility, the system being configured for contributing to environmental sustainability and community benefits, comprising a man-made swimming lagoon, a High Temperature Water Treatment System, and a waste heat transfer mechanism.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:數文書處理設施</p>
        <p type="p">2:人造游泳潟湖</p>
        <p type="p">3:高溫水處理系統</p>
        <p type="p">4:氧化劑注入單元</p>
        <p type="p">5:廢熱傳遞機構</p>
        <p type="p">6:廢熱再迴圈回路</p>
        <p type="p">7:泵</p>
        <p type="p">8:熱帶沐浴區</p>
        <p type="p">9:溫泉水區</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10063.JPG" file="ed10063.JPG" height="359px" img-content="tif" inline="yes" orientation="portrait" width="644px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621870</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141607</doc-number>
          <kind></kind>
          <date>114/10/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260121B">B25J9/22</main-classification>
        <further-classification edition="200601120260121B">B25J9/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新村星太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIIMURA, SHINTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>稻葉豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INABA, GOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/042197</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>控制裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">控制裝置是產業機械的控制裝置，具備：安全訊號控制部，處理已雙重化的安全訊號；非安全訊號控制部，處理非安全訊號；及切換部，針對對控制裝置輸入或從控制裝置輸出之一個或複數個訊號，可切換是要讓安全訊號控制部作為安全訊號來處理、或是要讓非安全訊號控制部作為非安全訊號來處理。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:機器人、產業機械</p>
        <p type="p">51:CPU、符號</p>
        <p type="p">51a,51b:CPU</p>
        <p type="p">54:伺服控制器</p>
        <p type="p">151:非安全訊號控制部</p>
        <p type="p">152:安全訊號控制部</p>
        <p type="p">153:切換部</p>
        <p type="p">154:設定部</p>
        <p type="p">155:安全訊號設定資訊</p>
        <p type="p">158:切換診斷部</p>
        <p type="p">161,162:符號</p>
        <p type="p">163:安全訊號</p>
        <p type="p">171:動作控制部</p>
        <p type="p">180:動作程式</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="719px" img-content="tif" inline="yes" orientation="portrait" width="1075px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621905</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141625</doc-number>
          <kind></kind>
          <date>114/10/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B41J2/11</main-classification>
        <further-classification edition="200601120260302B">B05D1/02</further-classification>
        <further-classification edition="200601120260302B">G03F7/16</further-classification>
        <further-classification edition="200601120260302B">B29C59/02</further-classification>
        <further-classification edition="202601120260302B">H10P14/68</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木島広夢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIJIMA, HIROMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-201655</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>模製設備，資訊處理設備，模製方法，非暫態電腦可讀取儲存媒體，及物件製造方法</chinese-title>
        <english-title>MOLDING APPARATUS, INFORMATION PROCESSING APPARATUS, MOLDING METHOD, NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM, AND ARTICLE MANUFACTURING METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於在基板及模具之間的空間中藉由使該模具與安置在該基板上之可固化組成物之複數個液滴接觸來形成包括該可固化組成物之液體薄膜的模製設備包含控制單元，該控制單元被組構成用以基於散佈區域及外周邊邊界來判定該複數個液滴之配置的調整方法，該散佈區域係基於在該基板上之該複數個液滴之該配置而獲取，且是其中該複數個液滴由於與該模具之該接觸而散佈之區域，而該外周邊邊界由該基板之外周邊部分的形狀所判定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A molding apparatus for forming a liquid film comprising a curable composition in a space between a substrate and a mold by bringing the mold into contact with a plurality of droplets of the curable composition disposed on the substrate, including, a control unit configured to determine an adjustment method of an arrangement of the plurality of droplets based on a spread region which is acquired based on the arrangement of the plurality of droplets on the substrate and is a region where the plurality of droplets spread due to the contact with the mold, and an outer peripheral boundary determined based on a shape of an outer peripheral portion of the substrate.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10031.png" file="d10031.TIF" giffile="ed10031.png" height="593px" img-content="tif" inline="yes" orientation="portrait" width="592px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623243</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141757</doc-number>
          <kind></kind>
          <date>114/10/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">H04M1/66</main-classification>
        <further-classification edition="202101120260202B">H04W12/12</further-classification>
        <further-classification edition="200601120260202B">H04L9/32</further-classification>
        <further-classification edition="202201120260202B">H04L9/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉慧君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, HUICHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙素麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, SULI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>巴塔查里亞　安庫爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BHATTACHARJEE, ANKUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昌坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHANGKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉展義</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, ZHANYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳琛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/132901</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於通話欺騙偵測的系統及方法</chinese-title>
        <english-title>SYSTEMS AND METHODS FOR CALL SPOOFING DETECTION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種裝置包括一記憶體，該記憶體經組態以儲存由一通話邀請訊息指示的一第一電話號碼。該裝置亦包括一或多個處理器，該一或多個處理器耦接至該記憶體且經組態以從一第二裝置接收與來自該第二裝置的一通話相關聯的該通話邀請訊息。該通話邀請訊息指示該第一電話號碼作為該通話的一發起電話號碼。該一或多個處理器經組態以：向該第二裝置發送包括該第一電話號碼的一註冊表檢查請求；及從該第二裝置接收一註冊表檢查回應，該註冊表檢查回應指示該第一電話號碼是否包括在與該第二裝置相關聯的一註冊表中。該一或多個處理器經組態以輸出與該通話相關聯的一通話欺騙指示符，該通話欺騙指示符係基於該第一電話號碼是否包括該在註冊表中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A device includes a memory configured to store a first phone number indicated by a call invitation message. The device also includes one or more processors coupled to the memory and configured to receive, from a second device, the call invitation message associated with a call from the second device. The call invitation message indicates the first phone number as an originating phone number of the call. The one or more processors are configured to send, to the second device, a registry check request that includes the first phone number, and to receive, from the second device, a registry check response that indicates whether the first phone number is included in a registry associated with the second device. The one or more processors are configured to output a call spoofing indicator associated with the call and that is based on whether the first phone number is included in the registry.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:系統</p>
        <p type="p">102:裝置</p>
        <p type="p">106:記憶體</p>
        <p type="p">108:處理器</p>
        <p type="p">109:指令</p>
        <p type="p">110:麥克風</p>
        <p type="p">111:音訊資料</p>
        <p type="p">112:影像感測器</p>
        <p type="p">113:影像資料</p>
        <p type="p">114:輸入裝置</p>
        <p type="p">115:輸入資料</p>
        <p type="p">116:顯示裝置</p>
        <p type="p">117:揚聲器</p>
        <p type="p">118:數據機</p>
        <p type="p">120:元件符號；通話欺騙管理器</p>
        <p type="p">122:通話註冊表驗證器</p>
        <p type="p">124:通話欺騙偵測器</p>
        <p type="p">130:註冊表</p>
        <p type="p">132:經註冊(識別符)ID；經註冊ID</p>
        <p type="p">134:通話相關的電話號碼</p>
        <p type="p">140:註冊表檢查回應</p>
        <p type="p">142:授權請求</p>
        <p type="p">144:註冊表檢查請求</p>
        <p type="p">146:通話欺騙指示符</p>
        <p type="p">150:網路</p>
        <p type="p">152:裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="770px" img-content="tif" inline="yes" orientation="portrait" width="1091px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623207</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141788</doc-number>
          <kind></kind>
          <date>114/10/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">H03L7/081</main-classification>
        <further-classification edition="200601120260202B">H03L7/099</further-classification>
        <further-classification edition="200601120260202B">H03K5/135</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴正原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOUNG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金在協</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAEHYUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜大賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, DAE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,879</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/239,889</doc-number>
          <date>20250616</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括相位內插器的系統及其方法</chinese-title>
        <english-title>SYSTEM INCLUDING PHASE INTERPOLATOR AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可變速相位內插器。在一些實施例中，一種系統包括：鎖相迴路；相位內插器；以及內插器控制電路。鎖相迴路可包括振盪器和振盪器控制電路。振盪器控制電路可經組態以設定振盪器參數的值以控制振盪器的振盪頻率。內插器控制電路可經組態以基於振盪器參數的值調整相位內插器的相位內插器參數。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A variable-speed phase interpolator is provided. In some embodiments, a system includes: a phase-locked loop; a phase interpolator; and an interpolator control circuit. The phase-locked loop may include an oscillator and an oscillator control circuit. The oscillator control circuit may be configured to set a value of an oscillator parameter to control a frequency of oscillation of the oscillator. The interpolator control circuit may be configured to adjust a phase interpolator parameter of the phase interpolator based on the value of the oscillator parameter.</p>
      </isu-abst>
      <representative-img>
        <p type="p">505、510:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="312px" img-content="tif" inline="yes" orientation="portrait" width="759px">
          </img>
        </representative>
      </representative-img>
    </description>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622303</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141846</doc-number>
          <kind></kind>
          <date>114/10/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260218B">C30B15/22</main-classification>
        <further-classification edition="200601120260218B">C30B15/26</further-classification>
        <further-classification edition="200601120260218B">C30B15/20</further-classification>
        <further-classification edition="200601120260218B">G01B11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中環領先半導體科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHONGHUAN ADVANCED SEMICONDUCTOR TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃末</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, MO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣利洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, LIYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李向陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIANGYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮厚坤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, HOUKUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411676671X</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>晶棒生長控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶棒生長控制方法，包括：在等徑生長階段，偵測晶棒的所有生長棱線；當晶棒的所有生長棱線均沒有斷線時，偵測晶棒的實際直徑；根據偵測晶棒的實際直徑，調整晶棒的生長技術；其中，偵測晶棒的實際直徑，包括：獲取每個位置生長棱線對應的設定弧段的弧長，根據設定弧段的弧長計算得到對應的生長棱線位置處晶棒的直徑；剔除生長棱線所在位置處的直徑資料中的離群資料，並根據剩下的直徑資料，獲得晶棒的實際直徑。根據晶棒生長控制方法獲得的晶棒直徑資料更準確，從而使得調整晶棒的生長技術更為準確。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1~S5:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="672px" img-content="tif" inline="yes" orientation="portrait" width="695px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622150</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141848</doc-number>
          <kind></kind>
          <date>114/10/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">C08G65/26</main-classification>
        <further-classification edition="200601120260226B">G03F7/022</further-classification>
        <further-classification edition="200601120260226B">C08F220/70</further-classification>
        <further-classification edition="200601120260226B">C08F118/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＪＳＲ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JSR CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赤塚玄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKATSUKA, GEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林恵佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, KEISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>成子朗人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NARUKO, AKITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-190620</doc-number>
          <date>20241030</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>感放射線性組成物、硬化膜、半導體元件、顯示元件、及硬化膜的製造方法</chinese-title>
        <english-title>RADIATION-SENSITIVE COMPOSITION, CURED FILM, SEMICONDUCTOR ELEMENT, DISPLAY ELEMENT, AND METHOD FOR PRODUCING CURED FILM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明所欲解決的課題在於提供一種可形成可兼顧放射線感度與耐乾式蝕刻性的硬化膜的感放射線性組成物、由所述組成物所形成的硬化膜、包括所述硬化膜的半導體元件及顯示元件、以及硬化膜的製造方法。本發明是有關於一種感放射線性組成物，其含有：聚合物（A），包含源自具有環員數5以上的雜環結構的化合物的結構單元（I）；鹼可溶性聚合物（B）；醌二疊氮化合物（C）；以及溶劑（S），所述雜環結構為選自由環狀醚結構、環狀酯結構、環狀醯亞胺結構、及含三唑環的結構所組成的群組中的至少一種，相對於構成聚合物（A）的全部結構單元，所述結構單元（I）的含量為50質量%以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623696</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141850</doc-number>
          <kind></kind>
          <date>114/10/29</date>
        </document-id>
      </application-reference>
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        <main-classification edition="202601120260302B">H10W74/10</main-classification>
        <further-classification edition="202601120260302B">H10W74/40</further-classification>
        <further-classification edition="202601120260302B">H10W40/25</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AIROHA TECHNOLOGY CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊明宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MING-TZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張程皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHENG-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐啓富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHI-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪建州</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNG, CHENG-CHOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高銘良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,417</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/074,460</doc-number>
          <date>20250310</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝結構</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體封裝結構，包含一功能晶粒、一散熱元件、一黏著劑、一模塑料以及一導熱材料。該散熱元件的一下表面透過該黏著劑而黏著至該功能晶粒的一上表面。該功能晶粒與該散熱元件由該模塑料所封裝。該導熱材料與該散熱元件的一上表面具有物理接觸，其中該散熱元件的熱導率高於該模塑料的熱導率，以及該導熱材料的熱導率高於該散熱元件的該熱導率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package structure includes a functional die, a heat dissipation component, an adhesive, a molding compound, and a thermally conductive material. A bottom surface of the heat dissipation component is bonded to a top surface of the functional die via the adhesive. The functional die and the heat dissipation component are encapsulated by the molding compound. The thermally conductive material has a physical contact with a top surface of the heat dissipation component, wherein thermal conductivity of the heat dissipation component is higher than thermal conductivity of the modeling compound, and thermal conductivity of the thermally conductive material is higher than the thermal conductivity of the heat dissipation component.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基於打線接合的半導體封裝結構</p>
        <p type="p">102:基板</p>
        <p type="p">104:功能晶粒</p>
        <p type="p">106:散熱元件</p>
        <p type="p">108:導熱材料</p>
        <p type="p">110:模塑料</p>
        <p type="p">112:錫球</p>
        <p type="p">114,116:黏著劑</p>
        <p type="p">118:打線</p>
        <p type="p">101,105,109:下表面</p>
        <p type="p">103,107,111,113:上表面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="603px" img-content="tif" inline="yes" orientation="portrait" width="929px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622080</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141871</doc-number>
          <kind></kind>
          <date>114/10/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D487/04</main-classification>
        <further-classification edition="200601120260302B">A61K31/519</further-classification>
        <further-classification edition="200601120260302B">A61K31/55</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商諾華公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVARTIS AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>約瑟夫　薩揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOSEPH, SAJAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮菲斯特　凱斯　布魯斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PFISTER, KEITH BRUCE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮尼亞　微微克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAUNIYAR, VIVEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　曉芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, XIAOYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24210312.5</doc-number>
          <date>20241031</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>歐洲專利局</country>
          <doc-number>25152482.3</doc-number>
          <date>20250117</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>歐洲專利局</country>
          <doc-number>25180272.4</doc-number>
          <date>20250602</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>週期蛋白依賴性激酶抑制劑</chinese-title>
        <english-title>CYCLIN-DEPENDENT KINASE INHIBITORS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於抑制CDK4（週期蛋白依賴性激酶4或細胞分裂蛋白激酶4）的化合物，並且關於用於製備所述化合物之方法、包含所述化合物的藥物組成物以及所述化合物在治療由CDK4介導的病狀、疾病和病症中之用途。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to compounds which inhibit CDK4 (Cyclin-Dependent Kinase 4 or Cell Division protein Kinase 4), and to processes for the preparation of said compounds, pharmaceutical compositions comprising said compounds, and use of said compounds in the treatment of conditions, diseases and disorders mediated by CDK4.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10359.JPG" file="ed10359.JPG" height="729px" img-content="tif" inline="yes" orientation="portrait" width="951px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622988</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141873</doc-number>
          <kind></kind>
          <date>114/10/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260202B">G16H20/00</main-classification>
        <further-classification edition="201801120260202B">G16H50/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商江崎固力菓股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EZAKI GLICO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阪井直哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>由井慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUI, KEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>飯塚裕之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IIZUKA, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>常盤颯志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKIWA, SOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205584</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>資訊提示方法、資訊處理系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種自複數個疲勞恢復方法之中提議適於使用者之疲勞狀態之疲勞恢復方法之資訊提示方法。  &lt;br/&gt;推薦系統於使用者之肌肉硬度為第2臨限值以上時，將使用者之疲勞狀態分類為第3狀態，於肌肉硬度為第1臨限值以上、且小於第2臨限值時，將使用者之疲勞狀態分類為第1狀態。又，推薦系統於自律神經指標為第3臨限值以下時，將使用者之疲勞狀態分類為第2狀態，於皮質醇值為第4臨限值以上時，將使用者之疲勞狀態分類為第2狀態。且，推薦系統推薦與分類出之疲勞狀態相應之疲勞恢復方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S21~S28:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="1050px" img-content="tif" inline="yes" orientation="portrait" width="802px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621695</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141916</doc-number>
          <kind></kind>
          <date>111/09/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/575</main-classification>
        <further-classification edition="200601120260302B">A61K31/365</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吉亞生物科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARJIL PHARMACEUTICALS LLC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳　郁彬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YEH B</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅吉孟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, JIR-MEHNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁惠如</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, HUI-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林佩欣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, PEI-HSIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭志玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/243,392</doc-number>
          <date>20210913</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>萜類化合物製備治療肥大細胞瘤藥物的用途</chinese-title>
        <english-title>USE OF TERPENOIDS IN MANUFACTURING A MEDICAMENT FOR THE TREATMENT OF MASTOCYTOMA</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種預防或治療肥大細胞瘤的方法，包括向有需要的受試者施用有效量的組合物；其中該組合物包含從樟芝或魚針草中萃取的三萜化合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a method of treating mast cell tumor, comprising administering an effective amount of composition to a subject in need thereof; wherein the composition comprises terpenoids extracted from &lt;i&gt;antrodia camphorate&lt;/i&gt; or &lt;i&gt;anisomeles indica&lt;/i&gt;.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10047.JPG" file="ed10047.JPG" height="703px" img-content="tif" inline="yes" orientation="portrait" width="601px">
          </img>
        </representative>
      </representative-img>
    </description>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623209</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114141993</doc-number>
          <kind></kind>
          <date>114/10/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">H04B1/04</main-classification>
        <further-classification edition="200601120260202B">H03F1/30</further-classification>
        <further-classification edition="200601120260202B">H03F3/189</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴正原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOUNG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>比奈　阿里</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BINAIE, ALI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
              <english-address>IR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,412</doc-number>
          <date>20241126</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/258,847</doc-number>
          <date>20250702</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>類比前端（ＡＦＥ）電路、通訊裝置與信號放大方法</chinese-title>
        <english-title>ANALOG FRONT-END (AFE) AMPLIFICATION CIRCUIT, COMMUNICATION DEVICE AND METHOD FOR SIGNAL AMPLIFICATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種類比前端電路（analog front-end，AFE）包括第一級電路，第一級電路包括第一第一級電晶體以及連接到AFE電路的輸出節點的偏壓級電路，第一第一級電晶體包括連接到AFE電路的輸入節點的第一第一級閘極電極、連接到第一供應電壓節點的第一第一級源極電極、以及連接到AFE電路的輸出節點的第一第一級汲極電極，偏壓級電路包括第一偏壓級電晶體以及第二偏壓級電晶體，第一偏壓級電晶體包括第一偏壓級閘極電極、連接到第一供應電壓節點的第一偏壓級源極電極、以及連接到第一偏壓級閘極電極的第一偏壓級汲極電極，第二偏壓級電晶體包括連接到第一偏壓級閘極電極的第二偏壓級閘極電極、連接到第一供應電壓節點的第二偏壓級源極電極、以及連接到AFE電路的輸出節點的第二偏壓級汲極電極。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An analog front-end (AFE) circuit includes a first-stage circuit including a first first-stage transistor including a first first-stage gate electrode connected to an input node of the AFE circuit, a first first-stage source electrode connected to a first supply-voltage node, and a first first-stage drain electrode connected to an output node of the AFE circuit, and a bias-stage circuit connected to the output node of the AFE circuit, the bias-stage circuit including a first bias-stage transistor including a first bias-stage gate electrode, a first bias-stage source electrode connected to the first supply-voltage node, and a first bias-stage drain electrode connected to the first bias-stage gate electrode, and a second bias-stage transistor including a second bias-stage gate electrode connected to the first bias-stage gate electrode, a second bias-stage source electrode connected to the first supply-voltage node, and a second bias-stage drain electrode connected to the output node of the AFE circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:接收器</p>
        <p type="p">200:類比前端電路</p>
        <p type="p">210:輸入放大級電路/第一級電路</p>
        <p type="p">220:偏壓級電路</p>
        <p type="p">230:二級放大電路</p>
        <p type="p">AP1、AP2、AP3:輔助路徑</p>
        <p type="p">C1:第一電容器</p>
        <p type="p">C2:第二電容器</p>
        <p type="p">CMOS:互補金屬氧化物半導體</p>
        <p type="p">D:汲極電極</p>
        <p type="p">G:閘極電極</p>
        <p type="p">MB1、MB2、MB3、MB4、MB5、MB6:偏壓級電晶體</p>
        <p type="p">MBR1、MBR2、MBR3、MBR4、MBR5、MBR6:偏壓級電阻器/電晶體</p>
        <p type="p">MF1、MF2、MF3、MF4:第一級電晶體</p>
        <p type="p">MP:主路徑</p>
        <p type="p">MR、MR1、MR2、MR3、MR4、MR5、MR6、MR7、MR8:金屬氧化物半導體(MOS)電阻器</p>
        <p type="p">MS1、MS2:第二級電晶體</p>
        <p type="p">NMOS:n通道MOS</p>
        <p type="p">N(in):輸入節點</p>
        <p type="p">N(out):輸出節點</p>
        <p type="p">PMOS:p通道MOS</p>
        <p type="p">RN1:第一MOS電阻網路</p>
        <p type="p">RN2:第二MOS電阻網路</p>
        <p type="p">Rout:輸出電阻器</p>
        <p type="p">S:源極電極</p>
        <p type="p">VDD:第一供應電壓</p>
        <p type="p">VSS:第二供應電壓</p>
        <p type="p">V(inp):接收器輸入信號</p>
        <p type="p">V(out1):第一輸出</p>
        <p type="p">V(out2):第二輸出</p>
        <p type="p">V(ref):參考電壓</p>
        <p type="p">ZN1:第一阻抗網路</p>
        <p type="p">ZN2:第二阻抗網路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="687px" img-content="tif" inline="yes" orientation="portrait" width="919px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623684</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142087</doc-number>
          <kind></kind>
          <date>114/10/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="200601120260302B">B23P19/10</further-classification>
        <further-classification edition="200601120260302B">B25J15/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商先進科技新加坡有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASMPT SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張　悅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋　景耀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, KENG YEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱豐友</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, FENG YOU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣生輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, SHENG HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱昱宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116664720</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>自動鍵合工具更換設備</chinese-title>
        <english-title>AUTOMATIC BONDING TOOL REPLACEMENT APPARATUS AND METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於將鍵合工具插入引線鍵合設備的固持孔中的鍵合工具更換設備，包括框架、鍵合工具夾持器以及柔性結構。所述鍵合工具夾持器由所述框架支撐，並被配置成夾取所述鍵合工具，並通過將所述鍵合工具朝向所述固持孔移動，在與所述引線鍵合設備相關聯的操作位置處將所述鍵合工具插入所述固持孔中。所述柔性結構將所述鍵合工具夾持器柔性耦合至所述框架，以使所述鍵合工具夾持器能夠相對於所述框架進行相對運動。所述柔性結構被配置成在插入期間回應於所述鍵合工具夾持器夾取的所述鍵合工具與所述固持孔之間的錯位而變形，以便在所述鍵合工具和所述固持孔發生錯位時，允許所述鍵合工具偏轉至與所述固持孔對齊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A bonding tool replacement apparatus for inserting a bonding tool into a retaining hole of a wire bonding apparatus includes a frame, a bonding tool gripper and a compliant structure. The bonding tool gripper is supported by the frame and configured to grip the bonding tool and insert it into the retaining hole at an operation position associated with the wire bonding apparatus by moving the bonding tool toward the retaining hole. The compliant structure flexibly couples the bonding tool gripper to the frame to enable relative movement of the bonding tool gripper with respect to the frame. The compliant structure is configured to deform in response to misalignment between the bonding tool gripped by the bonding tool gripper and the retaining hole during insertion to allow the bonding tool to deflect into alignment with the retaining hole when the bonding tool and the retaining hole are misaligned.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:鍵合工具更換裝置</p>
        <p type="p">101:框架</p>
        <p type="p">101a:滑柱</p>
        <p type="p">102:鍵合工具夾持器</p>
        <p type="p">102a:夾持指</p>
        <p type="p">102b:第一致動器</p>
        <p type="p">103:柔性結構</p>
        <p type="p">103a:第一剛性元件</p>
        <p type="p">103b:第二剛性元件</p>
        <p type="p">103c:第三剛性組件</p>
        <p type="p">104:位置指示器</p>
        <p type="p">20:鍵合工具</p>
        <p type="p">20’:鍵合工具</p>
        <p type="p">200:引線鍵合設備</p>
        <p type="p">210:鍵合工具固持器</p>
        <p type="p">211:固持孔</p>
        <p type="p">212:銅套件</p>
        <p type="p">D:延伸方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="539px" img-content="tif" inline="yes" orientation="portrait" width="636px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621592</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142088</doc-number>
          <kind></kind>
          <date>114/10/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251117B">A44B11/25</main-classification>
        <further-classification edition="200601120251117B">A44B18/00</further-classification>
        <further-classification edition="200601120251117B">A45F3/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐斯瑪扣具有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OSMAR BUCKLE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺中市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李邱宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIU-ZONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>嚴天琮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺南市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117387195</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>磁性扣具及水壺裝置</chinese-title>
        <english-title>MAGNETIC BUCKLE AND KETTLE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種磁性扣具和水壺裝置，水壺裝置包括水壺主體和磁性扣具，磁性扣具包括公扣和母扣，母扣中設有可轉動的釋鎖操作件，通過釋鎖操作件可驅使公扣和母扣脫離接合；母扣可固定設於所述水壺主體上或與所述水壺主體可拆卸連接，所述公扣用於固定於使用場所；本發明的水壺裝置通過公扣與母扣的可拆卸連接而實現水壺主體的掛載和拆取，且解鎖操作的施力方向是朝遠離公扣的方向進行，與用戶握取水壺時的握力方向一致，因此，握取水壺的同時可同時進行解鎖，動作一氣呵成，無需過多動作便可將水壺主體從使用場所上取下，其操作十分人性化，具有很強的實用性，宜大力推廣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A magnetic buckle and kettle device, the kettle device includes a kettle body and a magnetic buckle, the magnetic buckle includes a male buckle and a female buckle, the female buckle is provided with a rotatable release operating member, and the male buckle and the female buckle can be disengaged by the release operating member; the female buckle can be fixed on the kettle body or detachably connected to the kettle body, and the male buckle is used to be fixed at the place of use; the kettle device of the present invention is connected to the kettle body by the male buckle. The kettle body can be mounted and removed by means of a detachable connection with a buckle, and the direction of force applied during the unlocking operation is away from the male buckle, which is consistent with the direction of the user's grip when grasping the kettle. Therefore, the kettle can be unlocked at the same time as it is grasped, and the action is completed in one go. The kettle body can be removed from the place of use without excessive movement. Its operation is very user-friendly and has strong practicality, and it should be widely promoted.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:母扣</p>
        <p type="p">12:卡鎖件</p>
        <p type="p">121:卡鎖部</p>
        <p type="p">142:操作部</p>
        <p type="p">143:聯動部</p>
        <p type="p">16:第一殼體</p>
        <p type="p">17:第二殼體</p>
        <p type="p">19:磁體座</p>
        <p type="p">120:凸條部</p>
        <p type="p">20:公扣</p>
        <p type="p">21:配鎖部</p>
        <p type="p">211:鎖止槽</p>
        <p type="p">23:基板部</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <p type="p">Z:連接方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="901px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621674</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142105</doc-number>
          <kind></kind>
          <date>114/10/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">A61K9/127</main-classification>
        <further-classification edition="200601120260302B">A61K47/24</further-classification>
        <further-classification edition="200601120260302B">A61K47/28</further-classification>
        <further-classification edition="200601120260302B">A61K39/39</further-classification>
        <further-classification edition="200601120260302B">A61K39/00</further-classification>
        <further-classification edition="200601120260302B">A61P31/00</further-classification>
        <further-classification edition="200601120260302B">A61P33/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商遠大賽威信生命科學(南京)有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRAND THERAVAC LIFE SCIENCES (NANJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葛君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GE, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李建強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JIANQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫立瀧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, LILONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIANG, XUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, KE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周童</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116348206</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種脂質薄膜、脂質體及其製備方法和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種脂質薄膜、脂質體及其製備方法和用途。其中，本發明的脂質體的平均粒徑為75-110 nm，優選為85-110 nm，更優選為88-99 nm；且多分散性指數不超過0.2，優選為0.06-0.08。本發明的脂質體顆粒具有較好的均一性和穩定性。與市售脂質體相比，顯著提高了顆粒均一度。本發明的脂質體溶液可長時間維持澄清狀態，免於沉降長達3年，極大提高了脂質體溶液的穩定性，降低了批次不良率，節約了生產成本，適應於大規模生產。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="397px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623425</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142116</doc-number>
          <kind></kind>
          <date>114/10/30</date>
        </document-id>
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        <main-classification edition="202601120260302B">H10D80/20</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202501120260302B">H10D89/10</further-classification>
        <further-classification edition="202501120260302B">H10D89/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱　約翰建宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, JOHN JIANHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包　均經</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAO, JUNJING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈茵　阿比舍克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAIN, ABHISHEK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>娜拉帕帝　吉里德爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NALLAPATI, GIRIDHAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/946,332</doc-number>
          <date>20241113</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有前側及背側層組合的高密度金屬指狀電容器</chinese-title>
        <english-title>HIGH DENSITY METAL FINGER CAPACITOR WITH FRONTSIDE AND BACKSIDE LAYER COMBINATION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種晶片包括一組合型電容器。該組合型電容器包括一前側電容器、一背側電容器、及將該前側電容器及該背側電容器並聯耦接的垂直耦接結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A chip includes a combined capacitor. The combined capacitor includes a frontside capacitor, a backside capacitor, and vertical coupling structures coupling the frontside capacitor and the backside capacitor in parallel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">405:單位電容器</p>
        <p type="p">410:前側電容器</p>
        <p type="p">412:第一端子</p>
        <p type="p">414:第二端子</p>
        <p type="p">416:第一指</p>
        <p type="p">418:第二指</p>
        <p type="p">420:背側電容器</p>
        <p type="p">422:第一端子</p>
        <p type="p">424:第二端子</p>
        <p type="p">426:第一指</p>
        <p type="p">428:第二指</p>
        <p type="p">430,435:垂直耦接結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10029.JPG" file="ed10029.JPG" height="885px" img-content="tif" inline="yes" orientation="portrait" width="674px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622217</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142117</doc-number>
          <kind></kind>
          <date>114/10/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K13/08</main-classification>
        <further-classification edition="200601120260302B">C23F1/26</further-classification>
        <further-classification edition="202601120260302B">H10P50/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商凱斯科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KCTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金曜漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YO HAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪亨杓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, HYUNG PYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李浚宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUN WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0150319</doc-number>
          <date>20241030</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>蝕刻液組合物及使用其的蝕刻方法</chinese-title>
        <english-title>ETCHING AGENT COMPOSITION AND ETCHING METHOD USING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">根據一實施例的蝕刻液組合物，包含：氧化劑；包含含氟（F）化合物的蝕刻劑；包含雜環化合物的抑制劑，所述雜環化合物具有一個或多個碳數為6至20的芳環取代基，並且，所述雜環化合物包含氮（N）、硫（S）和氧（O）中的一種或多種。根據一實施例的蝕刻對象膜的蝕刻方法，包括準備包含鉬（Mo）膜和氮化鈦矽（Titanium Silicon Nitride）膜的蝕刻對象膜；及使用所述蝕刻液組合物對所述蝕刻對象膜進行蝕刻的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202623085</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142124</doc-number>
          <kind></kind>
          <date>114/10/30</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120260228B">H01P1/14</main-classification>
        <further-classification edition="200601120260228B">H01J17/64</further-classification>
        <further-classification edition="200601120260228B">H01P5/12</further-classification>
        <further-classification edition="200601120260228B">G01S7/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商諾斯洛普格拉曼系統公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NORTHROP GRUMMAN SYSTEMS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史坦傑　彼得　Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STENGER, PETER A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>埃德白特　阿德耶米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEGBITE, ADEYEMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米爾斯　葛蘭特　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIARS, GRANT C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
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        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/934,977</doc-number>
          <date>20241101</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電漿射頻波導開關</chinese-title>
        <english-title>PLASMA RADIO-FREQUENCY WAVEGUIDE SWITCH</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電漿射頻(RF)波導開關利用電離氣體(電漿)之RF傳輸截止頻率性質實施波導中之一RF開關。該電漿RF波導開關包含：一波導，其界定一內部空間且具有用於接收一RF信號之一輸入埠及一輸出埠；一電漿室，其放置於該內部空間中；可電離氣體，其收容於該電漿室中；及至少一個活化器，其經組態以將該可電離氣體活化成一電漿狀態。該電漿室係自含型及密封的，且因此，該電漿RF波導開關不需要一外部氣罐或氣體供應裝置。該電漿室包含位於該電漿室之一側之一第一電介質密封波導窗及位於該電漿室之一相對側之一第二電介質密封波導窗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The plasma radio-frequency (RF) waveguide switch utilizes the RF transmission cutoff frequency property of ionized gas (plasma) to implement an RF switch in waveguide. The plasma RF waveguide switch includes a waveguide defining an inner space and having an input port for receiving an RF signal and an output port, a plasma chamber placed in the inner space, ionizable gas contained in the plasma chamber, and at least one activator configured to activate the ionizable gas into a plasma state. The plasma chamber is self-contained and hermetically sealed, and therefore, the plasma RF waveguide switch does not require an external gas tank or gas supply device. The plasma chamber includes a first dielectric hermetic waveguide window at a side of the plasma chamber and a second dielectric hermetic waveguide window at an opposite side of the plasma chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電漿射頻(RF)波導開關</p>
        <p type="p">110:波導</p>
        <p type="p">110a:寬壁</p>
        <p type="p">110b:窄壁</p>
        <p type="p">110c:內部空間</p>
        <p type="p">111:輸入埠</p>
        <p type="p">112:輸出埠</p>
        <p type="p">120:活化器</p>
        <p type="p">130:電漿室</p>
        <p type="p">130a:寬度</p>
        <p type="p">132:電介質密封波導窗</p>
        <p type="p">133:電介質密封波導窗</p>
        <p type="p">141:入射RF信號/波</p>
        <p type="p">142:RF信號/波/輸出RF波</p>
        <p type="p">150:惰性可電離氣體</p>
        <p type="p">150a:電漿</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="400px" img-content="tif" inline="yes" orientation="portrait" width="572px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623086</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142152</doc-number>
          <kind></kind>
          <date>114/10/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251119B">H01P3/10</main-classification>
        <further-classification edition="200601120251119B">H01P5/02</further-classification>
        <further-classification edition="200601120251119B">H01P5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商梅克科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEKTEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>熊谷賢司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAGAI, KENJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206573</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基片整合波導</chinese-title>
        <english-title>SUBSTRATE INTEGRATED WAVEGUIDES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種能夠在保持傳輸特性的同時減小波導寬度的基片整合波導。該基片整合波導（1）包括：電介質部（10）、下部導電層（21）、上部導電層（22）、柱列（PC1）、柱列（PC2）以及內部導電層（31）。下部導電層（21）配置於電介質部（10）的下面。上部導電層（22）配置於電介質部（10）的上面。柱列（PC1）由沿著電介質部（10）的長邊方向排列的多個導電柱（41）構成。柱列（PC2）由沿著長邊方向排列的多個導電柱（42）構成，且平行於柱列（PC1）。內部導電層（31），配置於電介質部（10）的內部，藉由柱列（PC1）、（PC2）與下部導電層（21）和上部導電層（22）電連接，並包括沿著長邊方向延伸的且設置於柱列（PC1）側的間隙（G1）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基片整合波導</p>
        <p type="p">10:電介質部</p>
        <p type="p">11、12:電介質層</p>
        <p type="p">21:下部導電層</p>
        <p type="p">22:上部導電層</p>
        <p type="p">31:內部導電層</p>
        <p type="p">41、42:導電柱</p>
        <p type="p">G1:間隙</p>
        <p type="p">PC1、PC2:導電柱</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="856px" img-content="tif" inline="yes" orientation="portrait" width="606px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623223</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142188</doc-number>
          <kind></kind>
          <date>114/10/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120260202B">H04B17/345</main-classification>
        <further-classification edition="201501120260202B">H04B17/30</further-classification>
        <further-classification edition="201501120260202B">H04B17/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商萊特波因特公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LITEPOINT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAO, CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖明堃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, VITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧萊　克里斯敦　沃夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OLGAARD, CHRISTIAN VOLF</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　瑞祖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, RUIZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧慶杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, QINGJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116664190</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>判定通訊通道中的干擾</chinese-title>
        <english-title>DETERMINING INTERFERENCE IN A COMMUNICATION CHANNEL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種實例系統經組態為基於第一頻帶中的第一信號測量功率。該第一信號包含第二信號之干擾分量，該第二信號係位於與第一頻帶相鄰之第二頻帶內。該系統包括具有固定頻率的低通濾波器(LPF)。該系統包含電路系統，該電路系統經組態為執行操作，該操作包括使用本地振盪器改變頻率，以將該第一信號的中心頻率移位至LPF中；獲得該第一頻帶中的窗口處的該干擾分量的功率的測量，其中該LPF的衰減等於或高於預定義值；及基於該等測量來判定該第一頻帶中的該干擾分量的功率，從而減少由該LPF引起的該第一信號中的混疊分量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An example system is configured to measure power based on a first signal in a first frequency band. The first signal includes an interference component of a second signal in a second frequency band that is adjacent to the first frequency band. The system includes a lowpass filter (LPF) having a fixed frequency. The system includes circuitry configured to perform operations that include changing a frequency using a local oscillator to shift a center frequency of the first signal into an LPF; obtaining measurements of power of the interference component at windows in the first frequency band where an attenuation of the LPF is at or above a predefined value; and determining the power of the interference component in the first frequency band based on the measurements so as to reduce an aliasing component in the first signal caused by the LPF.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:VSA</p>
        <p type="p">11:信號，天線</p>
        <p type="p">14:帶選擇濾波器</p>
        <p type="p">15:低雜訊放大器(LNA)</p>
        <p type="p">16:混頻器</p>
        <p type="p">17:低通濾波器(LPF)</p>
        <p type="p">19:放大器</p>
        <p type="p">20:類比轉數位轉換器(ADC)</p>
        <p type="p">52:控制系統</p>
        <p type="p">54:通訊</p>
        <p type="p">56:處理裝置</p>
        <p type="p">58:記憶體</p>
        <p type="p">60:機器可執行指令</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10046.JPG" file="ed10046.JPG" height="862px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622965</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142192</doc-number>
          <kind></kind>
          <date>114/10/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C7/18</main-classification>
        <further-classification edition="200601120260302B">G11C8/14</further-classification>
        <further-classification edition="202601120260302B">H10W10/20</further-classification>
        <further-classification edition="202501120260302B">H10D62/17</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10B80/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金和瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, WHA YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴徑徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, GYEONG CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禹政旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WOO, JUNG WOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李炳錫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, BYOUNG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>車俊會</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHA, JUN HWE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0165691</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置包括：第一通道結構；第一空氣層，該第一空氣層包圍第一通道結構的側表面；第一位元線，該第一位元線接觸第一通道結構的側表面；第一字線，該第一字線接觸第一通道結構的下部；儲存節點，該儲存節點具有接觸第一通道結構的上部的一個端部；第二通道結構，該第二通道結構接觸儲存節點的上部；第二空氣層，該第二空氣層被配置為包圍第二通道結構的側表面；第二位元線，該第二位元線接觸第二通道結構的側表面；以及第二字線，該第二字線接觸第二通道結構的上部。第一位元線沿與第一通道結構延伸的方向垂直的方向延伸。第二字線沿與第二通道結構延伸的方向垂直的方向延伸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The semiconductor device includes a first channel structure; a first air layer surrounding a side surface of the first channel structure; a first bitline contacting the side surface of the first channel structure; a first wordline contacting a lower portion of the first channel structure; a storage node having one end contacting an upper portion of the first channel structure; a second channel structure contacting an upper portion of the storage node; a second air layer surrounding a side surface of the second channel structure; a second bitline contacting the side surface of the second channel structure; and a second wordline contacting an upper portion of the second channel structure. The first bitline extends in a direction perpendicular to a direction in which the first channel structure extends. The second wordline extends in a direction perpendicular to a direction in which the second channel structure extends.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:一部分</p>
        <p type="p">BL1:第一位元線</p>
        <p type="p">BL2:第二位元線</p>
        <p type="p">CS1:第一通道結構</p>
        <p type="p">CS2:第二通道結構</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">SN:儲存節點</p>
        <p type="p">TR1:第一電晶體</p>
        <p type="p">TR2:第二電晶體</p>
        <p type="p">WL1:第一字線</p>
        <p type="p">WL2:第二字線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10075.JPG" file="ed10075.JPG" height="678px" img-content="tif" inline="yes" orientation="portrait" width="731px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622163</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142293</doc-number>
          <kind></kind>
          <date>114/10/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251120B">C08J5/18</main-classification>
        <further-classification edition="200601120251120B">C08L27/18</further-classification>
        <further-classification edition="200601120251120B">C08K9/06</further-classification>
        <further-classification edition="200601120251120B">C08K3/36</further-classification>
        <further-classification edition="200601120251120B">B32B27/20</further-classification>
        <further-classification edition="200601120251120B">H05K1/03</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商霓佳斯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NICHIAS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勅使川原壮平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TESHIGAWARA, SOUHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>藤木洋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJIKI, HIRONARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤亮太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇梶友乃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UKAJI, YUNO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡邉智和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATANABE, TOMOKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206018</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>氟樹脂膜、氟樹脂膜的製造方法、覆銅積層板、及電路基板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種為低熱膨脹性、且於熱處理後亦可維持低吸濕性的氟樹脂膜、氟樹脂膜的製造方法、覆銅積層板、及電路基板。一種氟樹脂膜，為包含氟樹脂、以及無機填料的氟樹脂膜，溫度40℃、相對濕度90%下的所述氟樹脂膜的吸濕率小於0.06質量%。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623163</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142335</doc-number>
          <kind></kind>
          <date>114/10/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200701120260219B">H02M1/32</main-classification>
        <further-classification edition="202001120260219B">H05B45/37</further-classification>
        <further-classification edition="200701120260219B">H02M1/36</further-classification>
        <further-classification edition="202201120260219B">H05B45/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凹凸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O2MICRO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>冉　凱平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAN, KAIPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋嵬煒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, WEIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝振中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,512</doc-number>
          <date>20241126</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2025106697582</doc-number>
          <date>20250522</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>19/289,853</doc-number>
          <date>20250804</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於控制開關轉換器的控制器、電力轉換系統及方法</chinese-title>
        <english-title>CONTROLLERS, POWER CONVERTER SYSTEMS, AND METHODS FOR CONTROLLING SWITCHING CONVERTERS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了用於控制開關轉換器的控制器、電力轉換系統及方法。控制器包括驅動端子、多功能端子以及控制電路系統，該控制電路系統耦接至驅動端子和多功能端子。驅動端子提供驅動信號，以便以驅動信號的頻率交替地導通和關斷開關轉換器中的功率開關。在正常模式下，多功能端子提供用於控制驅動信號的頻率的控制電流。在保護模式下，多功能端子提供指示在包括控制器的系統中存在異常狀況的控制電壓。如果在正常模式下檢測到異常狀況，則控制電路系統啟動警報信號。當警報信號有效時，控制電路系統還將操作切換至保護模式並且在多功能端子處產生控制電壓。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides controllers, power converter systems, and methods for controlling switching converters. The controller includes a drive terminal, a multi-function terminal, and control circuitry coupled to the drive terminal and the multi-function terminal. The drive terminal provides a drive signal to alternately turn on and turn off a power switch in a switching converter at a frequency of the drive signal. In a normal mode, the multi-function terminal provides a control current to control the frequency of the drive signal. In a protection mode, the multi-function terminal provides a control voltage indicating that an abnormal condition is present in a system including the controller. The control circuitry activates an alert signal if the abnormal condition is detected in the normal mode. The control circuitry also switches operation to the protection mode and generates the control voltage at the multi-function terminal when the alert signal is active.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電力轉換系統</p>
        <p type="p">202:控制器</p>
        <p type="p">204:開關轉換器</p>
        <p type="p">206:負載</p>
        <p type="p">216:端子</p>
        <p type="p">218:電力轉換電路</p>
        <p type="p">220:開關電路</p>
        <p type="p">222:驅動信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="706px" img-content="tif" inline="yes" orientation="portrait" width="801px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622193</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142336</doc-number>
          <kind></kind>
          <date>114/10/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">C09D175/04</main-classification>
        <further-classification edition="200601120260224B">C08F2/48</further-classification>
        <further-classification edition="200601120260224B">C08G77/10</further-classification>
        <further-classification edition="200601120260224B">C09D133/08</further-classification>
        <further-classification edition="200601120260224B">C09D5/16</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商ＰＰＧ塗料（天津）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PPG COATINGS (TIANJIN) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>季磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JI, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋元杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, YUANJIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹志鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YIN, ZHIXIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杨文服</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WENFU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋立明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, LIMING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024115423021</doc-number>
          <date>20241031</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>水性高光澤UV　固化塗料組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了一種水性高光澤UV固化塗料組合物，包括非離子型聚氨酯丙烯酸酯樹脂和含矽樹脂，其中所述非離子型聚氨酯丙烯酸酯樹脂包括具有4或更高的官能度的第一聚氨酯丙烯酸酯樹脂和具有小於4的官能度的第二聚氨酯丙烯酸酯樹脂，所述含矽樹脂包括含矽的非離子型聚氨酯丙烯酸酯樹脂。有揭露了一種包括上述UV固化塗料組合物的混合物。進一步揭露了一種經上述UV固化塗料組合物或混合物塗覆的基材。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622545</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142351</doc-number>
          <kind></kind>
          <date>114/10/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201501120260302B">G02B1/11</main-classification>
        <further-classification edition="200601120260302B">G02B5/22</further-classification>
        <further-classification edition="202501120260302B">H10H29/855</further-classification>
        <further-classification edition="202301120260302B">H10K59/80</further-classification>
        <further-classification edition="202501120260302B">H10H29/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>航特　柏伊德弗恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNTER, BOYD VERN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　沈平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHENPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>帕斯戴爾　大衛安祖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PASTEL, DAVID ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>皮耶希　卡列特安卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PIECH, GARRETT ANDREW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/716,848</doc-number>
          <date>20241106</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於透明顯示器之背光洩漏減少</chinese-title>
        <english-title>BACKLIGHT LEAKAGE REDUCTION FOR TRANSPARENT DISPLAYS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供了一種具有減少之背光洩漏的透明顯示器及其製造方法。該顯示器併有基板層、吸光元件及光學介面以控制光傳播。該透明顯示器考慮組件厚度與發光元件間隔之間的關係以管理跨越各種視角之反射光路徑。該透明顯示器可包括專用塗層、結構化光學元件及/或金屬絲網組態以進一步減少背光洩漏。藉由定位及對準此等組件以達成背光洩漏減少，此等元件共同地最小化不希望的背光透射，同時維持顯示品質及透明度。此等進步增強了跨越各種應用的透明顯示器之效能、隱私及視覺品質。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A transparent display with reduced backlight leakage and methods for its fabrication are provided herein. The display incorporates substrate layers, light-absorbing elements, and optical interfaces to control light propagation. The transparent display considers the relationship between component thicknesses and light-emitting element spacing to manage reflected light paths across various viewing angles. The transparent display may include specialized coatings, structured optical elements, and/or wire mesh configurations to further reduce backlight leakage. These elements collectively minimize unwanted backlight transmission while maintaining display quality and transparency by positioning and aligning these components to achieve backlight leakage reduction. These advancements enhance the performance, privacy, and visual quality of transparent displays across various applications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:透明顯示器</p>
        <p type="p">202:前蓋</p>
        <p type="p">204:第二基板</p>
        <p type="p">205,205&lt;sub&gt;a1&lt;/sub&gt;,205&lt;sub&gt;a2&lt;/sub&gt;,205&lt;sub&gt;ax&lt;/sub&gt;:像素</p>
        <p type="p">206:光學膠(OCA)層</p>
        <p type="p">208:顯示器之前部</p>
        <p type="p">210:顯示器之後部</p>
        <p type="p">220,222:點/前蓋材料與空氣介面</p>
        <p type="p">230:非透射區</p>
        <p type="p">250,251:光線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.JPG" file="ed10032.JPG" height="1062px" img-content="tif" inline="yes" orientation="portrait" width="655px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621807</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142363</doc-number>
          <kind></kind>
          <date>114/10/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260131B">B09B3/00</main-classification>
        <further-classification edition="200601120260131B">B09B1/00</further-classification>
        <further-classification edition="202201120260131B">B09B3/21</further-classification>
        <further-classification edition="202201120260131B">B09B3/40</further-classification>
        <further-classification edition="202201120260131B">B09B3/29</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商科技合同股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHNICA GOUDOU CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>寺尾好太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TERAO, KOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井之本佑介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOMOTO, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒木𤥨也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROKI, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205669</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>廢棄物的處理方法</chinese-title>
        <english-title>METHOD FOR WASTE TREATMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種廢棄物的處理方法，其可防止或抑制掩埋於土中的廢棄物對周邊的汙染擴大。  &lt;br/&gt;　　廢棄物的處理方法，其包含：於掩埋廢棄物之土地的地面挖掘坑洞的挖掘步驟、於坑洞投入廢棄物的投入步驟、以土砂回填坑洞的掩埋步驟、於回填後之土砂的表面散布包含熱塑性樹脂之處理藥劑的散布步驟、與於土砂的表面形成熱塑性樹脂之防水層的形成步驟；掩埋步驟中，以土砂形成堆土。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:地面</p>
        <p type="p">2:坑洞</p>
        <p type="p">3:挖掘手段</p>
        <p type="p">4:土砂</p>
        <p type="p">5:廢棄物</p>
        <p type="p">6:處理藥劑</p>
        <p type="p">7:熱塑性樹脂層(防水層)</p>
        <p type="p">8:藥液槽</p>
        <p type="p">9:泵</p>
        <p type="p">10:噴淋頭</p>
        <p type="p">11:散布裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="1029px" img-content="tif" inline="yes" orientation="portrait" width="800px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623176</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142403</doc-number>
          <kind></kind>
          <date>114/10/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">H02M7/217</main-classification>
        <further-classification edition="200601120260202B">H02M1/08</further-classification>
        <further-classification edition="202201120260202B">G01F1/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商富士電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUJI ELECTRIC CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木代雅巳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHIRO, MASAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207751</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電源電路、設備及超聲波流量計</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電源電路，具備：開關電路，根據基於由開關元件的開關操作所生成的輸出電壓而變化的反饋信號來控制所述開關操作，使得所述輸出電壓變為第1電壓，當所述反饋信號變化為所述輸出電壓高於所述第1電壓時的第1狀態時，使所述開關操作停止；及控制電路，在預定電路處理預定信號的第1期間內使所述反饋信號變化至所述第1狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電源電路</p>
        <p type="p">110:開關控制電路</p>
        <p type="p">130:控制電路</p>
        <p type="p">140:開關電路</p>
        <p type="p">150:反饋電路</p>
        <p type="p">11:誤差放大器</p>
        <p type="p">12:比較器</p>
        <p type="p">13:正反器</p>
        <p type="p">14:振盪器</p>
        <p type="p">15:NOR電路</p>
        <p type="p">16:驅動電路</p>
        <p type="p">20:分流調節器</p>
        <p type="p">C1,C2,C3,C4,C5:電容器</p>
        <p type="p">D1,D3:二極體</p>
        <p type="p">D2:齊納二極體</p>
        <p type="p">GND,GNDA:接地</p>
        <p type="p">IN:輸入端子</p>
        <p type="p">Ib:反饋電流</p>
        <p type="p">Ish:分流電流</p>
        <p type="p">L3:線圈</p>
        <p type="p">Np:一次側繞組</p>
        <p type="p">Ns:二次側繞組</p>
        <p type="p">OUT1,OUT2:輸出端子</p>
        <p type="p">P:驅動脈衝</p>
        <p type="p">Pcs:發光元件</p>
        <p type="p">Pcr:受光元件</p>
        <p type="p">PC:光耦合器</p>
        <p type="p">PW:控制端子</p>
        <p type="p">q:邏輯信號</p>
        <p type="p">Q,QB:信號</p>
        <p type="p">Q1:開關元件</p>
        <p type="p">Q2:開關</p>
        <p type="p">R:重置信號</p>
        <p type="p">R1~R3:電阻</p>
        <p type="p">R4~R10:電阻元件</p>
        <p type="p">REF:參考電壓</p>
        <p type="p">S:置位信號</p>
        <p type="p">T1~T3:端子</p>
        <p type="p">TR:變壓器</p>
        <p type="p">Va:閾值電壓</p>
        <p type="p">Vb:反饋電壓</p>
        <p type="p">Vd:電壓</p>
        <p type="p">Vs:檢測電壓</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">Wsig:控制信號</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="680px" img-content="tif" inline="yes" orientation="portrait" width="948px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623358</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142445</doc-number>
          <kind></kind>
          <date>114/10/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260302B">H10B12/00</main-classification>
        <further-classification edition="202601120260302B">H10D80/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宣姃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SUNJUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金錫源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SEOKWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李政河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JUNGHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李道仙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DOSUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0163406</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2024-0185695</doc-number>
          <date>20241213</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括資料儲存結構之半導體裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE INCLUDING DATA STORAGE STRUCTURE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體裝置包括：電晶體，其在一垂直方向上堆疊；一位元線，其電氣連接於該等電晶體中之每一者之一第一端；以及一資料儲存結構，其電氣連接於該等電晶體中之每一者之一第二端。該資料儲存結構包括：傳導柱體，其在一第一水平方向上延伸；一電極圖案，其覆蓋該等傳導柱體；以及一介電層，其在該等傳導柱體中之每一者與該電極圖案之間。該第一水平方向垂直於該垂直方向且係為從該位元線朝向該資料儲存結構之一方向，該等傳導柱體中之每一者具有相鄰於該等電晶體當中之一對應電晶體之一第一側表面、以及與該第一側表面相對之一第二側表面，且該等傳導柱體當中之一第一傳導柱體之該第二側表面具有一凸形形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes: transistors stacked in a vertical direction; a bit line electrically connected to a first end of each of the transistors; and a data storage structure electrically connected to a second end of each of the transistors. The data storage structure includes: conductive pillars extending in a first horizontal direction; an electrode pattern covering the conductive pillars; and a dielectric layer between each of the conductive pillars and the electrode pattern. The first horizontal direction is perpendicular to the vertical direction and is a direction oriented from the bit line to the data storage structure, each of the conductive pillars has a first side surface adjacent to a corresponding transistor among the transistors, and a second side surface opposite to the first side surface, and the second side surface of a first conductive pillar among the conductive pillars has a convex shape.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:絕緣層、第四絕緣層</p>
        <p type="p">9:絕緣層、第三絕緣層</p>
        <p type="p">12:絕緣層、第一絕緣層</p>
        <p type="p">21a:緩衝絕緣層</p>
        <p type="p">40a:傳導圖案</p>
        <p type="p">43:金屬半導體化合物區、餘留金屬半導體化合物區</p>
        <p type="p">45:氮化傳導區</p>
        <p type="p">50:傳導柱體、第一傳導柱體</p>
        <p type="p">50a:傳導柱體</p>
        <p type="p">50a1:顆粒、第一顆粒</p>
        <p type="p">50a2:顆粒、第二顆粒</p>
        <p type="p">50a3:顆粒、第三顆粒</p>
        <p type="p">50_S1:第一側表面</p>
        <p type="p">50_S2:第二側表面</p>
        <p type="p">55:介電層</p>
        <p type="p">60:電極圖案</p>
        <p type="p">60a:第一傳導層</p>
        <p type="p">60b:第二傳導層</p>
        <p type="p">65:圖案結構</p>
        <p type="p">A:區</p>
        <p type="p">CH:通道區</p>
        <p type="p">DS:記憶體胞元、資料儲存結構</p>
        <p type="p">GE:閘極、閘極電極</p>
        <p type="p">GO:閘極、閘極介電層</p>
        <p type="p">SD2:第二源極/汲極區</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10052.png" file="d10052.TIF" giffile="ed10052.png" height="559px" img-content="tif" inline="yes" orientation="portrait" width="789px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621583</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142456</doc-number>
          <kind></kind>
          <date>114/10/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120251114B">A24F40/95</main-classification>
        <further-classification edition="202001120251114B">A24F40/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本香煙產業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JAPAN TOBACCO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北原稔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAHARA, MINORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/041433</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>氣溶膠產生裝置和氣溶膠產生系統</chinese-title>
        <english-title>AEROSOL-GENERATING DEVICE AND AEROSOL-GENERATING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">問題：提供一種使得能夠更適當地執行無線充電的佈置。解決方案：一種氣溶膠產生裝置，該氣溶膠產生裝置包括：產生單元，該產生單元用於從氣溶膠源產生氣溶膠；控制單元，該控制單元用於控制該產生單元的操作；電池，該電池用於向該產生單元和該控制單元供電；電力接收線圈，該電力接收線圈用於從電力傳輸線圈接收用於對該電池充電的電力；一個或多個磁性體；以及殼體，其中，該一個或多個磁性體中的每個被佈置成與在該電力傳輸線圈在與該電力接收線圈對準的狀態下傳輸電力時產生的磁場間隔開。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">PROBLEM: To provide an arrangement enabling wireless charging to be performed more suitably. SOLUTION: An aerosol-generating device comprising: a generating unit for generating an aerosol from an aerosol source; a control unit for controlling operation of the generating unit; a battery for supplying power to the generating unit and the control unit; a power reception coil for receiving power for charging the battery from a power transmission coil; one or more magnetic bodies; and a housing, wherein each of the one or more magnetic bodies is arranged spaced apart from a magnetic field which is generated when the power transmission coil transmits power while in a state of alignment with the power reception coil.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:吸入裝置</p>
        <p type="p">101:主體</p>
        <p type="p">102:面板</p>
        <p type="p">102a:柔性部分</p>
        <p type="p">102b:透射部分</p>
        <p type="p">103:磁體</p>
        <p type="p">104:按鈕</p>
        <p type="p">105:LED</p>
        <p type="p">150:棒型基質</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="792px" img-content="tif" inline="yes" orientation="portrait" width="703px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622224</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142477</doc-number>
          <kind></kind>
          <date>114/10/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C11D7/06</main-classification>
        <further-classification edition="200601120260302B">C11D7/16</further-classification>
        <further-classification edition="200601120260302B">C11D7/26</further-classification>
        <further-classification edition="200601120260302B">C11D7/32</further-classification>
        <further-classification edition="200601120260302B">C11D7/36</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商安集微電子科技(上海)股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許曉佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, XIAOJIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　守田</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, SHOUTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寅斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YINBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張樂瀾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LELAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411635496X</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清洗組合物</chinese-title>
        <english-title>CLEANING COMPOSITION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種鹼性清洗組合物，其中包含絡合劑、有機胺化合物以及pH調節劑。其中絡合劑的添加可以與氧化鈰形成絡合鍵抑制氧化鈰與氧化矽表面的結合，同時也能達到反轉正電荷氧化鈰顆粒的作用，在鹼性條件下使得氧化鈰顆粒與晶圓表面形成較強的排斥作用。有機胺化合物的添加可以提升清洗液去除氧化鈰顆粒的能力。本發明公開的清洗組合物能夠有效去除TEOS表面黏附的氧化鈰顆粒，清洗後SEM表徵下顆粒數量小於3。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention discloses an alkaline cleaning composition comprising a chelating agent, an organic amine compound, and a pH adjuster. The addition of the chelating agent forms coordination bonds with cerium oxide to inhibit its binding to the silicon oxide surface while also reversing the positive charge of cerium oxide particles. Under alkaline conditions, this creates strong repulsion between cerium oxide particles and the wafer surface. The organic amine compound enhances the cleaning solution's ability to remove cerium oxide particles. The disclosed cleaning composition effectively removes cerium oxide particles adhered to TEOS surfaces, with post-cleaning SEM characterization showing particle counts below 3.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623120</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142486</doc-number>
          <kind></kind>
          <date>114/10/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260130B">H01R13/639</main-classification>
        <further-classification edition="200601120260130B">H01R13/631</further-classification>
        <further-classification edition="200601120260130B">H01R25/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾威勒電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BELLWETHER ELECTRONIC CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>登　羅伯特赫拉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THEIN, ROBERT HLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐信卿</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, HSIN-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>艾瑟拉　吉米安立奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACERA, JIMMY ENRIQUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PH</english-country>
              <english-address>PH</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,140</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>匯流排夾具組件、連接器組件和匯流排夾具</chinese-title>
        <english-title>BUSBAR CLIP ASSEMBLY, CONNECTOR ASSEMBLY, AND BUSBAR CLIP</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種匯流排夾具組件，包含：複數個匯流排夾具，分別配置於夾持複數個匯流排，其中，匯流排夾具的每一者包含一主體框架，以及一導電端子結構，安裝於主體框架中，且其中，匯流排夾具的一者的導電端子結構與匯流排夾具的另一者的導電端子結構直接連接或是透過一連接元件電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A busbar clip assembly includes: a plurality of busbar clips, each configured to clip a plurality of busbars respectively, wherein each busbar clip includes a main frame and a conductive terminal structure installed in the main frame, and wherein the conductive terminal structure of one busbar clip is directly connected to the conductive terminal structure of the other busbar clip or connected through a connecting element.&lt;br/&gt; .</p>
      </isu-abst>
      <representative-img>
        <p type="p">C1:匯流排夾具</p>
        <p type="p">B1:匯流排</p>
        <p type="p">402:定位元件</p>
        <p type="p">E2:連接元件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="778px" img-content="tif" inline="yes" orientation="portrait" width="1027px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623305</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142521</doc-number>
          <kind></kind>
          <date>114/11/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120260220B">H05B45/42</main-classification>
        <further-classification edition="202001120260220B">H05B45/345</further-classification>
        <further-classification edition="202201120260220B">H05B45/50</further-classification>
        <further-classification edition="202001120260220B">H05B45/382</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凹凸科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>O2MICRO, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHI, LI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝振中</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹縣</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117212646</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>負載驅動電路、光源裝置和驅動負載的方法</chinese-title>
        <english-title>LOAD DRIVING CIRCUIT, LIGHT SOURCE DEVICE AND METHOD FOR DRIVING A LOAD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種用於驅動第一通道負載和第二通道負載的負載驅動電路、包括該負載驅動電路的光源裝置和使用該負載驅動電路對負載進行驅動的方法。負載驅動電路包括：第一驅動支路，被配置為在用於為負載提供驅動電力的交流電力的正半週期內向第一通道負載和第二通道負載提供第一電流；以及第二驅動支路，被配置為在交流電力的負半週期內向第一通道負載和第二通道負載提供第二電流，其中，第一驅動支路和第二驅動支路中的每一個構成連接在所述交流電力的輸入端和所述第一通道負載和第二通道負載之間的單獨電流路徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a load driving circuit, light source device and method for driving a load. The present disclosure provides a load driving circuit for driving a first-channel load and a second-channel load, a light source device including the load driving circuit, and a method for driving the loads using the load driving circuit. The load driving circuit includes: a first driving branch configured to supply a first current to the loads during a positive half-cycle of an alternating current (AC) power supply; and a second driving branch configured to supply a second current to the loads during a negative half-cycle of the AC power supply. Each of the first and second driving branches forms a separate current path between an input terminal of the AC power supply and the loads.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:負載驅動電路</p>
        <p type="p">32:檢測模組</p>
        <p type="p">33:控制器</p>
        <p type="p">31:電力供應模組</p>
        <p type="p">311:電力變換模組</p>
        <p type="p">312、313:信號放大模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="613px" img-content="tif" inline="yes" orientation="portrait" width="719px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623064</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142648</doc-number>
          <kind></kind>
          <date>114/11/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251124B">H01J37/32</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張亞萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YA PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117192708</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>掃頻控制方法及掃頻控制裝置、半導體製程設備</chinese-title>
        <english-title>FREQUENCY SWEEP CONTROL METHOD, FREQUENCY SWEEP CONTROL DEVICE, AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供一種掃頻控制方法及掃頻控制裝置、半導體製程設備，屬於半導體製程設備技術領域。掃頻控制裝置包括：阻抗測量單元，被配置連接在匹配器和射頻電源之間，以獲取射頻電源後端的當前負載阻抗的阻抗值；數據處理單元，被配置為根據阻抗測量單元所獲取的當前負載阻抗的阻抗值、射頻電源的工作電壓，以及射頻電源的阻抗值，得到反應腔室能夠獲取的最大功率所對應的頻點；控制單元，被配置為將反應腔室能夠獲取的最大功率所對應的頻點，作為射頻電源的初始掃描頻點，並控制射頻電源開啟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a frequency sweep control method, a frequency sweep control device, and semiconductor process equipment, which belong to the technical field of semiconductor process equipment. The frequency sweep control device includes an impedance measurement unit, configured to be connected between a matcher and an RF power supply to obtain the value of the current load impedance at the output of the RF power supply; a data processing unit, configured to determine the frequency corresponding to the maximum power that a reaction chamber can receive, based on the current load impedance value obtained by the impedance measurement unit, the operating voltage of the RF power supply, and the impedance of the RF power supply; and a control unit, configured to use the frequency corresponding to the maximum power that the reaction chamber can receive as the initial frequency sweep of the RF power supply, and to control the RF power supply to turn on.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:掃頻控制裝置</p>
        <p type="p">201:阻抗測量單元</p>
        <p type="p">202:數據處理單元</p>
        <p type="p">203:控制單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="374px" img-content="tif" inline="yes" orientation="portrait" width="402px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621866</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142658</doc-number>
          <kind></kind>
          <date>114/11/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">B25J9/04</main-classification>
        <further-classification edition="200601120260102B">B25J9/08</further-classification>
        <further-classification edition="200601120260102B">B25J9/16</further-classification>
        <further-classification edition="200601120260102B">B25J18/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商星精密股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STAR MICRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田拓巳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, TAKUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-204014</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>工具機及工具機之控制方法</chinese-title>
        <english-title>MACHINE TOOL AND METHOD FOR CONTROLLING MACHINE TOOL</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種價格低廉且能夠實現小型化之工具機及工具機之控制方法。  &lt;br/&gt;本發明之工具機1具備：工具主軸4，其上可替換地安裝長度為規定長度以上之長條工具TL及較規定長度更短之普通工具TS；工具收納裝置5，其能夠同時收納長條工具TL及普通工具TS；工具替換裝置6，其具有第1工具抓持部642及第2工具抓持部643，將收納於工具收納裝置5中之長條工具TL或普通工具TS與安裝於工具主軸4之安裝工具T1進行替換；及替換動作控制部72，其基於安裝工具T1係長條工具TL還是普通工具TS及下一次要安裝於工具主軸4之下一次安裝工具T2係長條工具TL還是普通工具TS，決定使用工具替換裝置6之工具替換動作中之動作模式。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A machine tool includes: a tool spindle to which a long tool having a length that is at least a predetermined length, and a normal tool shorter than the predetermined length, can be interchangeably attached; a tool storage device capable of storing both the long tool and the normal tool; a tool exchange device having a first tool gripping unit and a second tool gripping unit, the tool exchange device configured to exchange the long tool or the normal tool stored in the tool storage device with an attached tool attached to the tool spindle; and an exchange operation control unit configured to determine an operation pattern to be used in a tool exchange operation performed using the tool exchange device, on the basis of whether the attached tool is the long tool or the normal tool and whether a next attached tool to be attached to the tool spindle next is the long tool or the normal tool.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S10,S11,S12,S13,S14,S15,S16,S17,S18:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10043.JPG" file="ed10043.JPG" height="1031px" img-content="tif" inline="yes" orientation="portrait" width="731px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623692</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142659</doc-number>
          <kind></kind>
          <date>114/11/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W40/47</further-classification>
        <further-classification edition="202601120260302B">H10W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商星科金朋管理私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STATS CHIPPAC MANAGEMENT PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李知宣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JISEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂紹凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪珮瑜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116853328</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有水冷卻系統的半導體封裝組件</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE ASSEMBLY WITH A WATER COOLING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種半導體封裝組件，包括：基板；中介層，其經由一組互連結構安裝在所述基板的前表面上；至少一個前側半導體元件，其安裝在所述中介層的前表面上；至少一個後側半導體元件，其安裝在所述中介層的後表面上，其中所述至少一個後側半導體元件通過所述一組互連結構與所述基板間隔開以在其間限定間隙；後側冷卻裝置，其安裝在所述至少一個後側半導體元件與所述基板之間的所述間隙中，其中所述後側冷卻裝置熱耦合到所述至少一個後側半導體元件；以及前側冷卻裝置，其安裝在所述至少一個前側半導體元件上且熱耦合到所述至少一個前側半導體元件。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝組件</p>
        <p type="p">110:基板</p>
        <p type="p">110a:前表面</p>
        <p type="p">110b:後表面</p>
        <p type="p">112:互連結構</p>
        <p type="p">120:前側半導體元件</p>
        <p type="p">130:後側冷卻裝置</p>
        <p type="p">131:閥</p>
        <p type="p">132:後側冷卻管</p>
        <p type="p">134a、134b:管</p>
        <p type="p">136:泵</p>
        <p type="p">138:散熱器</p>
        <p type="p">140:前側冷卻裝置</p>
        <p type="p">150:中介層</p>
        <p type="p">160:後側半導體元件</p>
        <p type="p">172:後側包封劑</p>
        <p type="p">174:前側包封劑</p>
        <p type="p">190:導電凸塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="947px" img-content="tif" inline="yes" orientation="portrait" width="575px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622562</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142679</doc-number>
          <kind></kind>
          <date>114/11/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B6/122</main-classification>
        <further-classification edition="202601120260302B">H10W20/43</further-classification>
        <further-classification edition="200601120260302B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商亦菲特光子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EFFECT PHOTONICS B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薩迪克　穆罕默德　Ｕ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SADIQ, MUHAMMAD USMAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱莉　尼爾　Ｐ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KELLY, NIALL PATRICK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IE</english-country>
              <english-address>IE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24212813.0</doc-number>
          <date>20241113</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光子積體電路及包含該光子積體電路的光電系統</chinese-title>
        <english-title>PHOTONIC INTEGRATED CIRCUIT AND OPTO-ELECTRONIC SYSTEM COMPRISING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種光子積體電路(1)，其包含接合墊(19)、RF組件(20)、具有一經摻雜磊晶半導體層(5)之一第一層堆疊(4)、與該第一層堆疊相關聯之一第二層堆疊(8)，以及導電材料之一第一組細長軌道(18a、18b)，該等細長軌道與該第二層堆疊相關聯且在使用該光子積體電路時可在該等接合墊與該等RF組件之間攜載一RF信號。該第二層堆疊包含包夾於一第一介電層(9)與一第二介電層(15)之間的一電氣接地屏蔽件(12)。在使用該光子積體電路時，該電氣接地屏蔽件最小化或防止由該RF信號引起之一電場與該經摻雜磊晶半導體層之間的重疊。&lt;br/&gt;    本發明亦關於一種包含該光子積體電路之光電系統(100)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a photonic integrated circuit (1) comprising bond pads (19), RF components (20), a first layer stack (4) having a doped epitaxial semiconductor layer (5), a second layer stack (8) that is associated with the first layer stack, and a first set of elongated tracks (18a, 18b) of electrically conductive material that are associated with the second layer stack and in use of the photonic integrated circuit can carry an RF signal between the bond pads and the RF components. The second layer stack comprises an electrical ground shield (12) that is sandwiched between a first dielectric layer (9) and a second dielectric layer (15). In use of the photonic integrated circuit, the electrical ground shield minimizes or prevents overlap between an electric field caused by said RF signal and said doped epitaxial semiconductor layer.&lt;br/&gt; The invention also relates to an opto-electronic system (100) comprising said photonic integrated circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光子積體電路</p>
        <p type="p">2:以InP為主之基體</p>
        <p type="p">3:第一表面</p>
        <p type="p">4:第一層堆疊</p>
        <p type="p">5:經摻雜磊晶半導體層</p>
        <p type="p">6:第二表面</p>
        <p type="p">7:第三表面</p>
        <p type="p">8:第二層堆疊</p>
        <p type="p">9:第一介電層</p>
        <p type="p">10:第四表面</p>
        <p type="p">11:第五表面</p>
        <p type="p">12:電氣接地屏蔽件</p>
        <p type="p">13:第六表面</p>
        <p type="p">14:第七表面</p>
        <p type="p">15:第二介電層</p>
        <p type="p">16:第八表面</p>
        <p type="p">17:第九表面</p>
        <p type="p">18a:第一組細長軌道，細長軌道，晶片上電氣互連件或饋入線，低損耗晶片上電氣互連件或饋入線，電鍍金軌道，55歐姆MZM饋入線，軌道，第一細長軌道</p>
        <p type="p">18b:第一組細長軌道，細長軌道，晶片上電氣互連件或饋入線，低損耗晶片上電氣互連件或饋入線，55歐姆MZM饋入線，軌道，第二細長軌道</p>
        <p type="p">19:電氣接合墊，接合墊</p>
        <p type="p">20:RF組件</p>
        <p type="p">T&lt;sub&gt;1&lt;/sub&gt;:第一厚度</p>
        <p type="p">T&lt;sub&gt;2&lt;/sub&gt;:第二厚度</p>
        <p type="p">T&lt;sub&gt;3&lt;/sub&gt;:第三厚度</p>
        <p type="p">T&lt;sub&gt;4&lt;/sub&gt;:第四厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="616px" img-content="tif" inline="yes" orientation="portrait" width="776px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623581</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142729</doc-number>
          <kind></kind>
          <date>114/11/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="200601120260302B">G05B19/418</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江頭篤嗣</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGASHIRA, ATSUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩生徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWABAE, TOHRU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋孝文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田中幸二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANAKA, KOJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宮田陸斗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYATA, RIKUTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良謀</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199297</doc-number>
          <date>20241114</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-134260</doc-number>
          <date>20250812</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理系統、基板處理方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">依本揭示一態樣之基板處理系統具備：批次處理部、單片處理部、介面部及控制電路，該批次處理部以批次配方統一處理包含複數片基板之批次；該單片處理部以單片配方將該批次內之該基板逐片處理；該介面部從該批次處理部將該基板搬運至該單片處理部；該控制電路執行下列步驟：依該批次內之各該基板，設定該單片配方；將業經以該批次處理部處理過之該批次內的該基板搬運至該單片處理部；以對於各該基板逐一設定之該單片配方處理該基板。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理配方</p>
        <p type="p">110:批次配方</p>
        <p type="p">120:單片配方</p>
        <p type="p">L:批</p>
        <p type="p">W:基板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.png" file="d10023.TIF" giffile="ed10023.png" height="520px" img-content="tif" inline="yes" orientation="portrait" width="832px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623606</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142783</doc-number>
          <kind></kind>
          <date>114/11/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="200601120260302B">H02K33/16</further-classification>
        <further-classification edition="200601120260302B">H02K33/18</further-classification>
        <further-classification edition="200601120260302B">G12B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友重機械工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO HEAVY INDUSTRIES, LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島龍太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAJIMA, RYUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土屋光樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSUCHIYA, KOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-200000</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>致動器、傾斜控制裝置、定位裝置、處理裝置、元件製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題] 本發明提供一種能夠適當地兼顧驅動的引導和負載的支承之致動器等。  &lt;br/&gt;　　[解決手段] 致動器(3)具備：固定部(5)；可動部(6)；驅動部，係將可動部(6)相對於固定部(5)沿著驅動方向進行驅動；氣體引導部(52)，係在比驅動部更靠外周側之位置，向相對向之固定部(5)的內周面與可動部(6)的外周面之間供給引導氣體(GG)，並將可動部(6)相對於固定部(5)沿著驅動方向進行引導；及負載支承部(56)，係向相對向之固定部(5)的上表面(55)與可動部(6)的下表面(64)之間供給支承氣體(SG)，並支承來自可動部(6)的負載。基於負載支承部(56)之可動部(6)的負載支承面遍及驅動部的外周側和內周側這兩側。基於負載支承部(56)之可動部(6)的負載支承面遍及驅動部的上方。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">3:致動器</p>
        <p type="p">5:固定部</p>
        <p type="p">6:可動部</p>
        <p type="p">51:基部</p>
        <p type="p">52:氣體引導部</p>
        <p type="p">53:馬達設置部</p>
        <p type="p">53A:底座</p>
        <p type="p">54:線圈</p>
        <p type="p">55:上表面</p>
        <p type="p">56:負載支承部</p>
        <p type="p">61:永久磁鐵</p>
        <p type="p">62:孔</p>
        <p type="p">63:孔</p>
        <p type="p">64:下表面</p>
        <p type="p">521:供給口</p>
        <p type="p">522:排出口</p>
        <p type="p">522A:排氣溝</p>
        <p type="p">GG:引導氣體</p>
        <p type="p">SG:支承氣體</p>
        <p type="p">SP:空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="677px" img-content="tif" inline="yes" orientation="portrait" width="869px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623677</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142823</doc-number>
          <kind></kind>
          <date>114/11/04</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/20</main-classification>
        <further-classification edition="200601120260302B">C25D3/56</further-classification>
        <further-classification edition="200601120260302B">C25D7/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廈門通富微電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAMEN TONGFU MICROELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊東曉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116615620</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>金銀合金凸塊結構及製備方法、半導體器件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明實施例提供一種金銀合金凸塊結構及製備方法、半導體器件，該製備方法包括：提供半導體器件，半導體器件的表面形成有種子層；通過電鍍技術在所述種子層上形成第一金銀合金凸塊，形成的第一金銀合金凸塊中金含量大於45%，且其厚度範圍為0.2μm~5μm；採用同一電鍍液在第一金銀合金凸塊上電鍍形成第二金銀合金凸塊，形成的第二金銀合金凸塊中金含量小於30%，且其厚度範圍為3μm~20μm。高金含量的第一金銀合金凸塊提升金銀合金凸塊結構底部與半導體器件的種子層的結合力，提高半導體器件的可靠性；低金含量的第二金銀合金凸塊可以避免金銀合金凸塊結構表面純在金瘤，控制金銀合金凸塊結構的硬度和形貌，保證後續封裝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="409px" img-content="tif" inline="yes" orientation="portrait" width="705px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622466</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114142883</doc-number>
          <kind></kind>
          <date>110/03/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G01D5/347</main-classification>
        <further-classification edition="200601120260226B">G02B5/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大日本印刷股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAI NIPPON PRINTING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤伸介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, SHINSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戶田剛史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哉
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ODA, NAOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2020-063476</doc-number>
          <date>20200331</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>編碼器用反射型光學尺及反射型光學式編碼器</chinese-title>
        <english-title>REFLECTION TYPE OPTICAL SCALE FOR ENCODER AND REFLECTION TYPE OPTICAL ENCODER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示的主要目的在於提供一種可將在低反射區域的反射率充分地降低之編碼器用反射型光學尺。本揭示是藉由提供一種編碼器用反射型光學尺來解決上述課題，前述編碼器用反射型光學尺在基材上交互地配置有高反射區域與低反射區域，上述低反射區域包含低反射部，前述低反射部是由形成於上述基材上之金屬鉻膜、與在上述金屬鉻膜上以任意順序形成之氧化鉻膜以及氮化鉻膜所構成，上述高反射區域為：從上述編碼器用反射型光學尺之和上述基材相反之側入射之光的反射率會比上述低反射區域更高。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A main object of the present disclosure is to provide a reflection type optical scale for an encoder capable of sufficiently decreasing the reflectance in a low reflection region. The present disclosure achieves the object by providing a reflection type optical scale for an encoder comprising a high reflection region and a low reflection region placed alternately on a substrate, wherein the low reflection region includes a low reflection part including a metal chromium film formed on the substrate, and a chromium oxide film and a chromium nitride film formed in no particular order on the metal chromium film; and a reflectance of an incident light in the high reflection region, from an opposite side to the substrate of the reflection type optical scale for an encoder, is higher than the low reflection region.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基材</p>
        <p type="p">2:金屬鉻膜</p>
        <p type="p">3:氮化鉻膜</p>
        <p type="p">4:氧化鉻膜</p>
        <p type="p">10:光學尺</p>
        <p type="p">11:低反射區域(第一實施形態)</p>
        <p type="p">12:高反射區域(第一實施形態)</p>
        <p type="p">20:低反射部(光反射部)</p>
        <p type="p">20A:第一規格的低反射部(第一規格的光反射部)</p>
        <p type="p">20B:第二規格的低反射部(第二規格的光反射部)</p>
        <p type="p">L1:光源之光(光)</p>
        <p type="p">L2:反射之光</p>
        <p type="p">P:垂直線</p>
        <p type="p">θ:入射角</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="714px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623137</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143014</doc-number>
          <kind></kind>
          <date>114/11/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251203B">H01S5/24</main-classification>
        <further-classification edition="202101120251203B">H01S5/0237</further-classification>
        <further-classification edition="200601120251203B">H01S5/026</further-classification>
        <further-classification edition="200601120251203B">H01S3/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔵本恭介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURAMOTO, KYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石村栄太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIMURA, EITARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202683</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光半導體裝置</chinese-title>
        <english-title>OPTICAL SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]獲得可防止頻帶降低的光半導體裝置。  &lt;br/&gt;[解決手段]連接於光調變器2的第1電極6的第1焊墊8與連接於光調變器2的第2電極7的第2焊墊9透過絕緣膜22而配置在第1平台11之上。在第1平台11中在第1焊墊8與第2焊墊9之間已去除第1導電型層13、14。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical semiconductor device includes: a substrate; an optical modulator including a semiconductor layer having a first conductivity type layer, an absorbing layer and a second conductivity type layer which are formed in this order on the substrate, a first electrode connected to the first conductivity type layer, and a second electrode connected to the second conductivity type layer; a first pad connected to the first electrode; and a second pad connected to the second electrode, wherein the semiconductor layer includes a waveguide, a first terrace and a second terrace positioned on opposite sides with respect to the waveguide, the first pad and the second pad are placed on the first terrace via an insulating film, and the first conductivity type layer is removed in the first terrace between the first pad and the second pad.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雷射部</p>
        <p type="p">2:光調變器</p>
        <p type="p">3:半絕緣性InP基板(基板)</p>
        <p type="p">4:陰極電極(電極)</p>
        <p type="p">5:陽極電極</p>
        <p type="p">6:陰極電極(第1電極)</p>
        <p type="p">7:陽極電極(第2電極)</p>
        <p type="p">8:陰極焊墊(第1焊墊)</p>
        <p type="p">9:陽極焊墊(第2焊墊)</p>
        <p type="p">10:導波路</p>
        <p type="p">11:第1平台</p>
        <p type="p">12:第2平台</p>
        <p type="p">V,W,X,Y,Z:區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.bmp" file="ed10006.bmp" height="344px" img-content="tif" inline="yes" orientation="portrait" width="626px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622214</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143025</doc-number>
          <kind></kind>
          <date>114/11/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C09K5/14</main-classification>
        <further-classification edition="200601120260225B">C08K3/28</further-classification>
        <further-classification edition="200601120260225B">C08K7/00</further-classification>
        <further-classification edition="200601120260225B">C10M107/02</further-classification>
        <further-classification edition="200601120260225B">C10M125/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商引能仕股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENEOS CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>栗原功</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURIHARA, ISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒澤修</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUROSAWA, OSAMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黒田　伊木悠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KURODA IKI, HARUKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡崎素也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAZAKI, MOTOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>酒井一泉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAI, KAZUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-193596</doc-number>
          <date>20241105</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>導熱性油脂組合物</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之導熱性油脂組合物含有基礎油(A)及導熱性粒子(B)，且上述導熱性粒子(B)包含平均粒徑D50未達70 μm之氮化鋁(B1)及平均粒徑D50為70 μm以上之氮化鋁(B2)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622041</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143028</doc-number>
          <kind></kind>
          <date>114/11/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C309/65</main-classification>
        <further-classification edition="200601120260302B">C08F212/14</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/038</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/38</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, SUGURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉原昌子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIHARA, MASAKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206764</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>負型抗蝕劑組成物及抗蝕劑圖案的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可形成解析性良好的抗蝕劑圖案的負型抗蝕劑組成物、及提供一種使用該負型抗蝕劑組成物的抗蝕劑圖案的製造方法。本發明是有關於一種負型抗蝕劑組成物、以及使用該負型抗蝕劑組成物的抗蝕劑圖案的製造方法，所述負型抗蝕劑組成物含有具有酚性羥基的樹脂（A1）、酸產生劑（B）、交聯劑（E）及淬滅劑（C），所述負型抗蝕劑組成物中，酸產生劑（B）包含具有醯胺骨架的化合物（B4）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10048.JPG" file="ed10048.JPG" height="338px" img-content="tif" inline="yes" orientation="portrait" width="655px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623648</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143111</doc-number>
          <kind></kind>
          <date>114/11/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W42/20</main-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W20/42</further-classification>
        <further-classification edition="202301120260302B">H10B12/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李多怜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, DAYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李仁榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, INYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0165605</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體記憶體裝置</chinese-title>
        <english-title>SEMICONDUCTOR MEMORY DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體記憶體裝置具有包括：一支撐基體；一記憶體胞元結構，其在該支撐基體上面，該記憶體胞元結構包括一主晶片區中之記憶體胞元；一周邊電路結構，其在該支撐基體上面，以使得該周邊電路結構及該記憶體胞元結構沿著一垂直方向堆疊，該周邊電路結構包括該主晶片區中之周邊電路電晶體；一中間基體，其位於該記憶體胞元結構與該周邊電路結構之間；一深隔離絕緣層，其在通過該中間基體之一深溝槽中；以及一防護環結構，其包括一防護環區中之一防護環通孔，其中該防護環結構通過該深隔離絕緣層且延伸超過該中間基體之一上表面且超過該中間基體之一下表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor memory device has includes: a support substrate; a memory cell structure above the support substrate, the memory cell structure including memory cells in a main chip region; a peripheral circuit structure above the support substrate such that the peripheral circuit structure and the memory cell structure are stacked along a vertical direction, the peripheral circuit structure including peripheral circuit transistors in the main chip region; an intermediate substrate located between the memory cell structure and the peripheral circuit structure; a deep isolation insulating layer in a deep trench passing through the intermediate substrate; and a guard ring structure including a guard ring via in a guard ring region, wherein the guard ring structure passes through the deep isolation insulating layer and extends beyond an upper surface of the intermediate substrate and beyond a lower surface of the intermediate substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體記憶體裝置</p>
        <p type="p">BDI:接合絕緣層</p>
        <p type="p">BSUB:基底基體</p>
        <p type="p">CGR:晶片防護環區</p>
        <p type="p">CGS:晶片防護環結構</p>
        <p type="p">CITS:胞元連接結構</p>
        <p type="p">CPIV:胞元周邊電路連接通孔</p>
        <p type="p">CR:晶片區</p>
        <p type="p">DTI:深隔離絕緣層</p>
        <p type="p">DTR:深溝槽</p>
        <p type="p">GR:防護環區</p>
        <p type="p">GRS:防護環結構</p>
        <p type="p">GSLP:防護下圖案</p>
        <p type="p">GSUP:防護上圖案</p>
        <p type="p">GV:防護環通孔</p>
        <p type="p">GVLP:通孔下線圖案</p>
        <p type="p">GVUP:通孔上線圖案</p>
        <p type="p">MCR:主晶片區</p>
        <p type="p">MCS:記憶體胞元結構</p>
        <p type="p">PCRT:周邊電路結構</p>
        <p type="p">PITS:周邊電路連接結構</p>
        <p type="p">PSUB:周邊電路基體</p>
        <p type="p">SL:切割道區</p>
        <p type="p">SGR:切割防護環區</p>
        <p type="p">SGS:切割防護環結構</p>
        <p type="p">X:第一水平方向、方向</p>
        <p type="p">Y:第二水平方向、方向</p>
        <p type="p">Z:垂直方向、方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.png" file="d10027.TIF" giffile="ed10027.png" height="771px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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          <doc-number>202623472</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143113</doc-number>
          <kind></kind>
          <date>114/11/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260209B">H10H20/81</main-classification>
        <further-classification edition="202501120260209B">H10H20/817</further-classification>
        <further-classification edition="202501120260209B">H10H20/825</further-classification>
        <further-classification edition="202501120260209B">H10H20/01</further-classification>
      </classification-ipc>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商愛麗迪亞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALEDIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任在元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REN, ZAIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丘爾菲安　皮耶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TCHOULFIAN, PIERRE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西普羅　羅曼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CIPRO, ROMAIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>法國</country>
          <doc-number>FR2412739</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光電裝置及其製造方法</chinese-title>
        <english-title>OPTOELECTRONIC DEVICE AND ITS MANUFACTURING PROCESS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目標為一種發光二極體(1)，其包含下列以堆疊方向安排者：&lt;br/&gt;  一以GaN為主的第一注入區域；&lt;br/&gt;  一以InGaN為主的第一障壁層，其具有銦濃度[In]1≤10原子%；&lt;br/&gt;  一配置成發射光輻射的主動區，其以InGaN為主，具有銦濃度[In]a＞[In]1，該主動區係與以InGaN為主的該第一障壁層直接接觸；&lt;br/&gt;  一第二注入區域。&lt;br/&gt;  有利的是，該第一InGaN基障壁層具有銦濃度波動，其在該第一障壁層內以條紋形式規則地分佈，及該第一障壁層具有一實質上固定的厚度。&lt;br/&gt;  本發明亦涵蓋一種製造此3D LED的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The object of the invention is a light-emitting diode (1) comprising, arranged in a stacking direction:&lt;br/&gt; a first injection region based on GaN,&lt;br/&gt; a first barrier layer based on InGaN, with an Indium concentration [In]1 ≤ 10%at.,&lt;br/&gt; an active region configured to emit light radiation, based on InGaN, having a concentration of Indium [In]a ＞ [In]1, said active region being directly in contact with the first barrier layer based on InGaN,&lt;br/&gt; a second injection region.&lt;br/&gt; Advantageously, the first InGaN-based barrier layer has Indium concentration fluctuations regularly distributed in the form of stripes within the first barrier layer, and the first barrier layer has a substantially constant thickness.&lt;br/&gt; The invention also covers a method for manufacturing such a 3D LED.</p>
      </isu-abst>
      <representative-img>
        <p type="p">21:核心/第一注入區域</p>
        <p type="p">22:主動區</p>
        <p type="p">23:外殼/第二注入區域</p>
        <p type="p">31:電子阻擋層(EBL)/EBL/阻擋層</p>
        <p type="p">41:第一障壁層/層/薄LT InGaN基第一障壁層/以InGaN為主的第一障壁層/厚LT InGaN基第一障壁層/LT InGaN基第一障壁層</p>
        <p type="p">42:以AlGaN為主的第二障壁層/第二障壁層</p>
        <p type="p">220:聚集</p>
        <p type="p">220,220a,220b,220c,220d,220e:富In聚集</p>
        <p type="p">410:條紋狀圖案/條紋/圖案/富In條紋/明亮條紋/高銦濃度條紋/第一條紋</p>
        <p type="p">410b,410c:條紋</p>
        <p type="p">411:條紋狀圖案/圖案/暗條紋/低銦濃度條紋/條紋/第二條紋</p>
        <p type="p">412:平滑界面/界面/共同界面/界面</p>
        <p type="p">e&lt;sub&gt;41&lt;/sub&gt;:厚度/整體厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="731px" img-content="tif" inline="yes" orientation="portrait" width="724px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623649</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143116</doc-number>
          <kind></kind>
          <date>114/11/05</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W42/20</main-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商環旭電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈冠穎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, KUAN-YING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張忠平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, CHUNG-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡弘毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, HUNG-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116588125</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>封裝模組及封裝方法</chinese-title>
        <english-title>PACKAGING MODULE AND PACKAGING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種封裝模組，包含電路結構、隔離單元以及隔離金屬件。電路結構包含基板及第一電子元件。第一電子元件設置於第一表面。隔離單元設置於第一表面且包含複數側牆板及開口。側牆板界定出隔離空間，第一電子元件容設於隔離空間，開口位於側牆板的二相鄰者之間。隔離金屬件設置於第一表面且對應於開口。藉此，可提升抗電磁干擾效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a packaging module including a circuit structure, a shielding unit and a shielding metal member. The circuit structure includes a substrate and a first electronic element. The first electronic element is disposed at a first surface. The shielding unit is disposed at the first surface and includes a plurality of walls and an opening. The walls define a shielding space, and the first electronic element is received in the shielding space. The opening is located between two adjacent members of the walls. The shielding metal member is disposed at the first surface and corresponds to the opening. Therefore, the shielding effect is improved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:封裝模組</p>
        <p type="p">110:電路結構</p>
        <p type="p">111:第一電子元件</p>
        <p type="p">112:第二電子元件</p>
        <p type="p">117:基板</p>
        <p type="p">120:隔離單元</p>
        <p type="p">121:開口</p>
        <p type="p">122:側牆板</p>
        <p type="p">123:頂板</p>
        <p type="p">130:隔離金屬件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="658px" img-content="tif" inline="yes" orientation="portrait" width="973px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623554</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143179</doc-number>
          <kind></kind>
          <date>114/11/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P70/00</main-classification>
        <further-classification edition="202401120260302B">B08B1/12</further-classification>
        <further-classification edition="202401120260302B">B08B1/36</further-classification>
        <further-classification edition="200601120260302B">B08B3/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商斯庫林集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCREEN HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部寿洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, TOSHIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>篠原智之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHINOHARA, TOMOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>船橋和雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUNAHASHI, KAZUMA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿部宏之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, HIROYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池本光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEMOTO, HIKARI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-197809</doc-number>
          <date>20241113</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之刷裝置可對刷保持部裝卸。刷保持部藉由移動裝置移動。刷裝置之刷壓抵於由基板保持部保持之基板之上表面而洗淨基板。於基板洗淨裝置內，於一個刷裝置安裝於刷保持部之狀態下，其他刷裝置保管於刷保管裝置中。刷保持部於卸除舊的刷裝置後，藉由移動裝置移動至刷保管裝置。將其他刷裝置安裝至刷保持部。移動裝置包含使刷保持部於互不相同之2個方向上分別移動之臂旋轉驅動部及臂移動驅動部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A brush device is attachable to and detachable from a brush holder. The brush holder is moved by a movement device. A brush of the brush device is pressed against an upper surface of a substrate held by a substrate holding device, and the substrate is cleaned. In a substrate cleaning device, with one brush device attached to the brush holder, another brush device is stored in a brush storage device. The brush holder is moved by a movement device to the brush storage device after an old brush device is detached. Another brush device is attached to the brush holder. The movement device includes an arm rotation driver and an arm movement driver that move the brush holder in two respective different directions.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:基板洗淨裝置</p>
        <p type="p">10:基板保持裝置</p>
        <p type="p">11:旋轉基座</p>
        <p type="p">12:保持銷</p>
        <p type="p">20:杯裝置</p>
        <p type="p">21:杯本體</p>
        <p type="p">22:杯升降驅動部</p>
        <p type="p">50:刷裝置</p>
        <p type="p">100:刷臂裝置</p>
        <p type="p">110:刷臂</p>
        <p type="p">111:刷保持部</p>
        <p type="p">112:按壓旋轉驅動部</p>
        <p type="p">120:旋轉軸</p>
        <p type="p">130:導軌</p>
        <p type="p">140:臂支持部</p>
        <p type="p">141:臂旋轉驅動部</p>
        <p type="p">142:臂移動驅動部</p>
        <p type="p">143:臂升降驅動部</p>
        <p type="p">210:待機艙</p>
        <p type="p">220:刷廢棄部</p>
        <p type="p">230:刷保管裝置</p>
        <p type="p">240:保管狀態檢測部</p>
        <p type="p">250:刷形狀檢測部</p>
        <p type="p">310:液體供給裝置</p>
        <p type="p">311:旋轉軸</p>
        <p type="p">312:臂</p>
        <p type="p">313:液體噴嘴</p>
        <p type="p">314:液體驅動部</p>
        <p type="p">320:氣體供給裝置</p>
        <p type="p">321:旋轉軸</p>
        <p type="p">322:臂</p>
        <p type="p">323:氣體噴嘴</p>
        <p type="p">324:氣體驅動部</p>
        <p type="p">330:噴霧裝置</p>
        <p type="p">331:旋轉軸</p>
        <p type="p">332:臂</p>
        <p type="p">333:噴霧嘴</p>
        <p type="p">334:噴霧驅動部</p>
        <p type="p">900:控制部</p>
        <p type="p">a1~a5:箭頭</p>
        <p type="p">CH:腔室</p>
        <p type="p">L1:假想直線</p>
        <p type="p">L2:假想直線</p>
        <p type="p">P1:待機位置</p>
        <p type="p">P2:卸除位置</p>
        <p type="p">P3:安裝位置</p>
        <p type="p">SC:旋轉中心</p>
        <p type="p">SW1:第1側壁</p>
        <p type="p">SW2:第2側壁</p>
        <p type="p">SW3:第3側壁</p>
        <p type="p">SW4:第4側壁</p>
        <p type="p">W:基板</p>
        <p type="p">X:方向</p>
        <p type="p">Y:方向</p>
        <p type="p">Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="750px" img-content="tif" inline="yes" orientation="portrait" width="964px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622146</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143184</doc-number>
          <kind></kind>
          <date>114/11/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C08G59/50</main-classification>
        <further-classification edition="200601120260302B">C08L63/00</further-classification>
        <further-classification edition="200601120260302B">C08K5/18</further-classification>
        <further-classification edition="200601120260302B">C08K3/22</further-classification>
        <further-classification edition="200601120260302B">C08K3/36</further-classification>
        <further-classification edition="202601120260302B">H10W74/47</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商旭化成股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHI KASEI KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大隣雅俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OTONARI, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本凌輔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, RYOSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松永隆秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUNAGA, TAKAHIDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大野裕司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONO, YUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-195565</doc-number>
          <date>20241108</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>底層填充材、硬化物、以及半導體封裝體及其製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之目的在於提供一種窄間隙及大面積下之滲透性及散熱性能優異之底層填充材、硬化物、以及半導體封裝體及其製造方法。即，本發明提供一種底層填充材，其係包含含有(A)環氧樹脂、(B)硬化劑、及(C)無機填充劑之環氧樹脂組合物者，上述(C)無機填充劑包含除二氧化矽以外之成分，上述(C)無機填充劑之平均粒徑為0.01 μm以上5.0 μm以下，上述(C)無機填充劑具有兩個以上之粒度分佈曲線中之峰。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623607</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143207</doc-number>
          <kind></kind>
          <date>114/11/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="200601120260302B">G01N21/84</further-classification>
        <further-classification edition="200601120260302B">G01N21/17</further-classification>
        <further-classification edition="200601120260302B">G01N21/01</further-classification>
        <further-classification edition="200601120260302B">G02B27/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬來西亞商正齊科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MI EQUIPMENT (M) SDN. BHD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　錦權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEH, JIN CHUEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林　子恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM, CHEE YIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　清純</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHING CHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　美琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONG, MEI KIEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳天賜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>馬來西亞</country>
          <doc-number>PI2024006672</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種用於對半導體元件側壁進行視覺檢測的系統</chinese-title>
        <english-title>A SYSTEM FOR PERFORMING VISION INSPECTION ON SIDEWALL OF SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了一種用於對半導體元件（107）側壁進行視覺檢測的系統（101），其中該系統（101）包括至少一組發光裝置，發光裝置被配置為向半導體元件（107）的側壁發射多束光線，該多束光線相對於半導體元件（107）平面的頂部呈斜角、相對於半導體元件（107）平面的底部呈斜角或二者結合，以檢測垂直的、傾斜的或其組合的側壁，這種傾斜可能是由於從晶圓上切割半導體元件而造成的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention provides a system (101) for performing vision inspection on sidewall of semiconductor device (107), wherein said system (101) comprises of at least one set of light emitting device configured to emit a plurality of light rays towards the sidewall of said semiconductor device (107), wherein said plurality of light rays are at an oblique angle towards the top of said plane of said semiconductor device (107), at an oblique angle towards the bottom of said plane of said semiconductor device (107) or combination thereof to inspect sidewalls that are vertical, slanted or combination thereof, said slant possibly caused by cutting of said semiconductor device from a wafer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101:系統</p>
        <p type="p">105:圖像捕獲裝置</p>
        <p type="p">107:半導體元件</p>
        <p type="p">115:第五光線</p>
        <p type="p">121:第五發光裝置</p>
        <p type="p">123:夾持裝置</p>
        <p type="p">109A:第一側壁</p>
        <p type="p">109C:第三側壁</p>
        <p type="p">113A:第一光線</p>
        <p type="p">113C:第三光線</p>
        <p type="p">117A:第一發光裝置</p>
        <p type="p">117AA:頂部第一發光裝置</p>
        <p type="p">117AB:平行第一發光裝置</p>
        <p type="p">117AC:底部第一發光裝置</p>
        <p type="p">117C:第三發光裝置</p>
        <p type="p">117CA:頂部第三發光裝置</p>
        <p type="p">117CB:平行第三發光裝置</p>
        <p type="p">117CC:底部第三發光裝置</p>
        <p type="p">119A:第一分光器</p>
        <p type="p">119C:第三分光器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="707px" img-content="tif" inline="yes" orientation="portrait" width="1007px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622837</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143218</doc-number>
          <kind></kind>
          <date>114/11/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260121B">G06Q20/10</main-classification>
        <further-classification edition="201201120260121B">G06Q20/38</further-classification>
        <further-classification edition="201201120260121B">G06Q20/32</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國銀聯股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA UNIONPAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳成錢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHENGQIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116427509</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>交易方法、交易裝置、電子設備、儲存媒體、程式產品及支付架構</chinese-title>
        <english-title>TRANSACTION METHOD, TRANSACTION APPARATUS, ELECTRONIC DEVICE, STORAGE MEDIUM, PROGRAM PRODUCT AND PAYMENT ARCHITECTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種交易方法、交易裝置、電子設備、儲存媒體、程式產品及支付架構。該方法包括：回應於使用者的支付操作，從支付應用服務端獲取付款碼。根據付款碼的數位內容，生成與付款碼對應的臨時銀行卡。使用臨時銀行卡與刷卡終端進行非接觸式支付交易。本申請的方法，使習慣使用掃碼支付的用戶，在針對只支援刷卡支付的支付場景下，能夠利用付款碼完成刷卡支付，提高了支付效率，從而提升用戶的支付體驗。臨時銀行卡存在時效性，降低了資訊洩露和被盜刷的風險，提升了支付安全性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a transaction method, a transaction apparatus, an electronic device, a storage medium, a program product and a payment architecture. The method includes: acquiring, in response to a payment operation of a user, a payment code from a payment application server; generating a temporary bank card corresponding to the payment code according to numerical content of the payment code; using the temporary bank card to perform a contactless payment transaction with a card swiping terminal. The method of the present application enables users who are accustomed to using a code scanning manner for payments to use a payment code to complete a card swiping payment in payment scenarios that only support card swiping payments, thereby improving payment efficiency and enhancing the user’s payment experience. Temporary bank cards have timeliness, reducing the risk of information leakage and theft, and enhancing payment security.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501、S502、S503:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="591px" img-content="tif" inline="yes" orientation="portrait" width="714px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623142</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143236</doc-number>
          <kind></kind>
          <date>114/11/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">H02H7/20</main-classification>
        <further-classification edition="200601120260202B">H03K17/08</further-classification>
        <further-classification edition="200601120260202B">G05F1/569</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊向一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, XIANGYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙倬毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHAO, ZHUOYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116889813</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子電路與積體電路以及反極性保護電路</chinese-title>
        <english-title>ELECTRONIC CIRCUIT AND INTEGRATED CIRCUIT AND REVERSE POLARITY PROTECTION CIRCUIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種反極性保護電路、積體電路及包括該積體電路的電子電路。該積體電路包括接收輸入電壓的輸入端子、提供輸出電壓的輸出端子、參考端子、功率接地端子、功率電晶體，主控制電路、可變電阻電路以及驅動電路。功率電晶體具有耦接在輸入端子與輸出端子之間的電流導通路徑和一控制端。主控制電路提供以參考端子的電位為基準的控制訊號至功率電晶體的控制端。可變電阻電路耦接在參考端子與功率接地端子之間，基於施加在可變電阻電路一控制端上的驅動電壓在導通狀態和阻斷狀態之間切換。驅動電路基於輸入電壓或輸出電壓的電壓極性調節該驅動電壓。採用本發明的實施例，在保證小導通損耗的同時保證了保護電路的可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reverse polarity protection circuit and associated integrated circuit and an electronic circuit including the same are disclosed. The integrated circuit includes an input terminal for receiving an input voltage, an output terminal for providing an output voltage, a reference terminal, a power ground terminal, a power transistor, a main control circuit, a variable resistance circuit, and a driving circuit. The power switch provides a current conduction path coupled between the input terminal and the output terminal and has a control terminal. The main control circuit provides a control signal relative to a voltage level at the reference terminal to the control terminal of the power transistor. The variable resistance circuit is coupled between the reference terminal and the power ground terminal, and switches between an ON state and an OFF state based on a driving voltage applied to a control terminal of the variable resistance circuit. The driving circuit adjusts the driving voltage based on a polarity of the input voltage or the output voltage. With the embodiments of the present disclosure, the reliability of the protection circuit is ensured while ensuring a small conduction loss.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積體電路</p>
        <p type="p">100:電子電路</p>
        <p type="p">101,102:功率電晶體對</p>
        <p type="p">103:主控制電路</p>
        <p type="p">104:反極性保護電路</p>
        <p type="p">401:可變電阻電路</p>
        <p type="p">402:驅動電路</p>
        <p type="p">CIN:輸入電容器</p>
        <p type="p">COUT:輸出電容器</p>
        <p type="p">C&lt;sub&gt;VCC&lt;/sub&gt;:供電電容器</p>
        <p type="p">GND:功率接地端子</p>
        <p type="p">ILIM:電流限定端</p>
        <p type="p">IN:輸入端子</p>
        <p type="p">OUT:輸出端子</p>
        <p type="p">R&lt;sub&gt;LIM&lt;/sub&gt;:限流電阻器</p>
        <p type="p">RTN:參考端子</p>
        <p type="p">VCC:供電端子</p>
        <p type="p">VG1:驅動電壓</p>
        <p type="p">VIN:輸入電壓</p>
        <p type="p">VOUT:輸出電壓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="719px" img-content="tif" inline="yes" orientation="portrait" width="691px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622735</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143250</doc-number>
          <kind></kind>
          <date>114/11/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260217B">G06F9/50</main-classification>
        <further-classification edition="200601120260217B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭燦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, CAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>派翠克　理查</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATRICK, RICHARD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何曉森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, XIAOSEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁　宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VUONG, HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阮　寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NGUYEN, BAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尚瓦尼亞　庫納爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SANVANIYA, KUNAL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　桑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TRAN, SANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/132212</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>在處理設備中之多個命令佇列之間的負載平衡</chinese-title>
        <english-title>LOAD BALANCING AMONG MULTIPLE COMMAND QUEUES IN PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露之態樣提供用於策略性地在複數個完成佇列(CQ)之間分布完成佇列(CQ)條目的各種系統、設備、及技術。在一些態樣中，主機控制器可將CQ條目(CQE)分布至不同處理核心之間的CQ，而不受限於特定的提交佇列(SQ)及（多個）CQ綁定。主機控制器可使用任何合適的演算法來跨不同的處理核心分布CQE，以最佳化處理核心上的負載。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Aspects of the disclosure provides various systems, apparatuses, and techniques for distributing completion queue (CQ) entries among a plurality of completion queues (CQs) strategically. In some aspects, a host controller can distribute the CQ entries (CQEs) to the CQs among different processing cores without being limited to a specific submission queue (SQ) and CQ(s) binding. The host controller can distribute the CQEs across different processing cores using any suitable algorithm to optimize the load on the processing cores.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:方法</p>
        <p type="p">902,904,906,908:方塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="843px" img-content="tif" inline="yes" orientation="portrait" width="768px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623409</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143301</doc-number>
          <kind></kind>
          <date>114/11/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/10</main-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>澤井寛美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAWAI, HIROMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>村川努</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAKAWA, TSUTOMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安達広樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADACHI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松木充弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUKI, MITSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199915</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2024-207987</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>日本</country>
          <doc-number>2025-016936</doc-number>
          <date>20250204</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種具有良好特性的半導體裝置。半導體裝置包括第一絕緣層、第一絕緣層上的半導體層、半導體層上的第二絕緣層以及第二絕緣層上的第一導電層，第一導電層與半導體層以在其間夾持第二絕緣層的方式彼此重疊，第一絕緣層包括第一層及第一層上的第二層，第二層包含氧化鎵，第一層包含選自氧化鉿、氮化矽和氧化矽中的一個以上，第二絕緣層包括第三層及第三層上的第四層，第三層包含氧化鎵，第四層包含選自氧化鉿、氮化矽和氧化矽中的一個以上，半導體層包含氧化銦。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:基板</p>
        <p type="p">30:半導體層</p>
        <p type="p">50:絕緣層</p>
        <p type="p">51:絕緣層</p>
        <p type="p">60:導電層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10038.JPG" file="ed10038.JPG" height="226px" img-content="tif" inline="yes" orientation="portrait" width="304px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622967</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143356</doc-number>
          <kind></kind>
          <date>114/11/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251114B">G11C11/21</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商廈門半導體工業技術研發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIAMEN INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳安喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, ANQIAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱泰瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, TAIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘇小麗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SU, XIAOLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃柏璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116736729</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>ＲＲＡＭ的控制方法、系統和控制端、ＲＲＡＭ</chinese-title>
        <english-title>CONTROL METHOD, SYSTEM, AND CONTROL TERMINAL FOR RRAM, AND RRAM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種RRAM的控制方法、系統和控制端、RRAM，其中RRAM的控制方法包括：向存儲單元的讀寫控制端輸入第一控制信號和第二控制信號，以使所述存儲單元根據所述第一控制信號執行寫入操作；所述第一控制信號包括多個寫控制脈沖，所述第二控制信號包括各個所述寫控制脈沖分別對應的亞穩態消除脈沖，所述亞穩態消除脈沖與對應的所述寫控制脈沖的脈沖方向相反，且在對應寫控制脈沖和該寫控制脈沖之後的第一個讀寫控制脈沖之間發生。本發明中，亞穩態消除脈沖能夠在寫控制脈沖撤去之後抵消或者消除亞穩態，避免亞穩態幹擾後續存儲單元執行的讀校驗等過程，能夠提升存儲單元的數據保持性，從而提升存儲單元後續執行讀校驗等過程時的可靠性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention discloses a control method, a system, a control terminal for RRAM (Resistive Random Access Memory), and a RRAM. The control method for the RRAM includes steps of: inputting a first control signal and a second control signal to the read/write control terminal of a memory cell, so that the memory cell performs a write operation according to the first control signal. The first control signal includes a plurality of write control pulses, and the second control signal includes metastability elimination pulses corresponding to each of the write control pulses. The metastability elimination pulses have opposite pulse directions to their corresponding write control pulses and occur between the corresponding write control pulse and the first read/write control pulse that follows this write control pulse. In this invention, the metastability elimination pulses can counteract or eliminate metastability after the write control pulses are withdrawn, preventing metastability from interfering with subsequent processes such as read verification performed by the memory cell. This can enhance the data retention capability of the memory cell, thereby improving its reliability during subsequent processes, such as read verification .</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="940px" img-content="tif" inline="yes" orientation="portrait" width="774px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623444</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143361</doc-number>
          <kind></kind>
          <date>114/11/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D84/82</main-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴永國</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, YOUNG GOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林辰永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, JINYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>辛曉宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, HYO JONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐　康一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, KANG-ILL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/722,166</doc-number>
          <date>20241119</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/330,094</doc-number>
          <date>20250916</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包括Z形堆疊電晶體的積體電路裝置</chinese-title>
        <english-title>INTEGRATED CIRCUIT DEVICES INCLUDING STACKED TRANSISTORS IN Z-SHAPE SCHEME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">積體電路裝置可包括基底和在基底的上表面上的單元結構。單元結構可包括第一電晶體，其包括第一側壁和在與基底的上表面平行的第一方向上與第一側壁相對的第二側壁，以及第二電晶體，其包括第三側壁和在第一方向上與第三側壁相對的第四側壁，在與基底的上表面垂直的第二方向上位於基底的上表面和第一電晶體之間。第三側壁和第四側壁中的其中一個可在第二方向上與第一電晶體重疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated circuit device may include a substrate and a cell structure on an upper surface of the substrate. The cell structure may comprise a first transistor that comprises a first sidewall and a second sidewall that is opposite to the first sidewall in a first direction that is parallel with the upper surface of the substrate and a second transistor that comprises a third sidewall and a fourth sidewall that is opposite to the third sidewall in the first direction between the upper surface of the substrate and the first transistor in a second direction that is perpendicular to the upper surface of the substrate. One of the third sidewall and the fourth sidewall may overlap the first transistor in the second direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積體電路裝置</p>
        <p type="p">100:基底</p>
        <p type="p">102:第一電晶體/上電晶體</p>
        <p type="p">104:第一源極/汲極區</p>
        <p type="p">106:第一通道層/上通道層</p>
        <p type="p">108:第二電晶體/下電晶體</p>
        <p type="p">110:第二源極/汲極區</p>
        <p type="p">112:第二通道層/下通道層</p>
        <p type="p">114:絕緣體/中間介電隔離/閘極間絕緣體</p>
        <p type="p">116:前側導電走線</p>
        <p type="p">118:背側導電走線</p>
        <p type="p">120:前側導電通孔</p>
        <p type="p">122:前側上導電接觸件</p>
        <p type="p">124a:前側中間導電接觸件</p>
        <p type="p">124b:前側下導電接觸件</p>
        <p type="p">126a:背側上導電接觸件</p>
        <p type="p">126b:背側中間導電接觸件</p>
        <p type="p">128:背側下導電接觸件</p>
        <p type="p">130:背側導電通孔</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="701px" img-content="tif" inline="yes" orientation="portrait" width="629px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622168</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143431</doc-number>
          <kind></kind>
          <date>114/11/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251223B">C08K5/098</main-classification>
        <further-classification edition="201401120251223B">C09D11/30</further-classification>
        <further-classification edition="201401120251223B">C09D11/52</further-classification>
        <further-classification edition="200601120251223B">C09D5/24</further-classification>
        <further-classification edition="202201120251223B">B22F1/07</further-classification>
        <further-classification edition="200601120251223B">H01B1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商賀利氏印刷電子有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HERAEUS PRINTED ELECTRONICS GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝貝爾　馬庫斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHEIBEL, MARKUS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>貝爾　蘇珊娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEHL, SUSANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克雷默　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRAEMER, PETER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24213262.9</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>包含黏著性促進劑之銀墨水</chinese-title>
        <english-title>SILVER INK COMPRISING ADHESION PROMOTER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種用於在基材上產生導電結構之組成物。該組成物包含溶液，該溶液含有至少下列組份：a)有機溶劑，其選自由下列所組成之群組：芳族烴、脂族烴、及醇、及此等脂族烴之乙酸酯、及其混合物，b)至少一種羧酸銀，及c)至少一種羧酸鈦。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a composition for producing an electrically conductive structure on a substrate. The composition comprises a solution containing at least the following components: a) organic solvent selected from the group consisting of aromatic hydrocarbons, aliphatic hydrocarbons and alcohols and acetic acid esters of these aliphatic hydrocarbons, and mixtures thereof, b) at least one silver carboxylate, and c) at least one titanium carboxylate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622142</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143441</doc-number>
          <kind></kind>
          <date>114/11/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260225B">C08G59/22</main-classification>
        <further-classification edition="200601120260225B">C08G59/32</further-classification>
        <further-classification edition="200601120260225B">C08L63/02</further-classification>
        <further-classification edition="200601120260225B">C09D183/14</further-classification>
        <further-classification edition="200601120260225B">C07D233/16</further-classification>
        <further-classification edition="201801120260225B">C08K3/011</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茂木稜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTEGI, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>行
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUSHIHARA, NAOYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202590</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>環氧樹脂組合物及其用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種能夠以低溫、短時間硬化，保存安定性、硬化物性等仍優異的環氧樹脂組合物。  &lt;br/&gt;一種環氧樹脂組合物，包含：  &lt;br/&gt;(A)環氧樹脂，1分子中具有2個以上環氧基；  &lt;br/&gt;(B)芳香族胺硬化劑；  &lt;br/&gt;(C)鎵螯合化合物；以及  &lt;br/&gt;(D)有機矽化合物，選自下述式(1)所示的矽烷化合物或其部分水解化合物的1種以上，  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="150px" width="417px" file="ed10010.JPG" alt="ed10010.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;(式中，R&lt;sup&gt;1&lt;/sup&gt;為碳數1~4的烷基，n為1~3的整數)  &lt;br/&gt;上述(C)成分與上述(D)成分的質量比為(C)/(D)=1/1~1/30。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621708</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143462</doc-number>
          <kind></kind>
          <date>114/11/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/728</main-classification>
        <further-classification edition="201501120260302B">A61K35/741</further-classification>
        <further-classification edition="200601120260302B">A61K9/14</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>禾伸堂生技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOLY STONE HEALTHCARE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>唐錦榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANG, JING-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113143049</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中華民國</country>
          <doc-number>114124148</doc-number>
          <date>20250625</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種組合物</chinese-title>
        <english-title>A COMPOSITION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種組合物，其組成含有玻尿酸微粒、布拉迪氏酵母菌及益生菌。該微粒具有層狀特徵，其中，至少一層含有普蘭膠，以增加胃腸道滯留時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A composition, which includes a mixture of hyaluronic acid pellets, Saccharomyces boulardii, and probiotic. The pellet has a multilayer structure, wherein at least one layer contains pullulan to increase the retention time in the gastrointestinal tract.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:微粒</p>
        <p type="p">101:H層</p>
        <p type="p">102:M層</p>
        <p type="p">103:S層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="389px" img-content="tif" inline="yes" orientation="portrait" width="543px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621840</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143470</doc-number>
          <kind></kind>
          <date>114/11/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260121B">B23Q3/157</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商發那科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANUC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>五十部學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISOBE, GAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/042224</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>工具交換臂、工具交換裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">工具交換臂200是交換裝設於工具機10的主軸13之工具500之工具交換裝置(20、30)的工具交換臂200，具備：臂構件210，具有把持工具500之工具把持部212；旋動軸構件220，具有旋動軸222，可在繞著旋動軸222旋轉之方向上調整相對於臂構件210之固定位置，且固定於臂構件210；及作動構件230，安裝於旋動軸構件220，藉由抵接於外部的凸輪50，來使旋動軸構件220及臂構件210繞著旋動軸222旋動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:工具機單元</p>
        <p type="p">10:工具機</p>
        <p type="p">11:基座部</p>
        <p type="p">12:主軸頭</p>
        <p type="p">13:主軸</p>
        <p type="p">20:工具交換臂單元(工具交換裝置)</p>
        <p type="p">21:直線運動單元</p>
        <p type="p">22:升降軸</p>
        <p type="p">23:旋繞基座</p>
        <p type="p">24:旋繞軸</p>
        <p type="p">25:安裝板部</p>
        <p type="p">27:支撐台部</p>
        <p type="p">30:工具庫(工具交換裝置)</p>
        <p type="p">31:庫基座</p>
        <p type="p">32:庫本體</p>
        <p type="p">33:旋轉盤</p>
        <p type="p">34:存放臂</p>
        <p type="p">35:工具存放部</p>
        <p type="p">200:工具交換臂</p>
        <p type="p">500:工具</p>
        <p type="p">J1:主軸中心軸</p>
        <p type="p">J2:旋繞中心軸</p>
        <p type="p">J3:工具把持軸</p>
        <p type="p">J4:工具中心軸</p>
        <p type="p">J5,J7:旋動中心軸</p>
        <p type="p">J8:存放中心軸</p>
        <p type="p">+X,-X,-Z:側、朝向</p>
        <p type="p">+Z:側</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="1066px" img-content="tif" inline="yes" orientation="portrait" width="729px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622342</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143544</doc-number>
          <kind></kind>
          <date>114/11/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">E04C2/38</main-classification>
        <further-classification edition="200601120260302B">E04B2/60</further-classification>
        <further-classification edition="200601120260302B">E04B2/82</further-classification>
        <further-classification edition="200601120260302B">E04B2/96</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商利達旺金屬系統股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RITTERWAND GMBH &amp; CO. KG METALL-SYSTEMBAU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>克歇爾　尤爾根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOCHER, JURGEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>10 2024 132 733.2</doc-number>
          <date>20241108</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於室系統及無塵室系統的面板</chinese-title>
        <english-title>PANEL FOR A ROOM SYSTEM AND CLEANROOM SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一室系統的面板（10），特別是一無塵室系統（1）的面板（10），其中該面板（10）包括由複數個邊緣（14）限定的一中心表面部分（12），其中，在該等邊緣（14）中的至少一個上佈置有一V形套環（20），該V形套環（20）具有一第一套環部分（22）與一第二套環部分（24），其中該第一套環部分（22）連接至該表面部分（12），使得該表面部分（12）和該第一套環部分（22）形成小於90度的一角度，其中該第二套環部分（24）相對於該第一套環部分（22）向外彎曲，並且其中用於將該面板（10）抵靠該無塵室系統（1）的一對應部分而密封的一密封件（30）佈置在該套環（20）的一外表面（23, 29）上，該套環的外表面背向（face away from）該表面部分（12），及一種室系統，特別是無塵室系統（1），其中至少一個此類面板（10）抵靠該無塵室系統的部件（10, 41, 42）而密封地插入。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Panel (10) for a room system, in particular a cleanroom system (1), wherein the panel (10) comprises a central surface section (12) delimited by a plurality of edges (14), wherein, on at least one of the edges (14), a V-shaped collar (20) is arranged which has a first collar section (22) and a second collar section (24), wherein the first collar section (22) connects to the surface section (12) such that the surface section (12) and the first collar section (22) form an angle of less than 90 degrees, wherein the second collar section (24) is bent outwards compared to the first collar section (22), and wherein a seal (30) for sealing the panel (10) against a counterpart (41, 42) of the room system (1) is arranged on an outer surface (23, 29) of the collar (20), which outer surface faces away from the surface section (12), as well as a room system, in particular cleanroom system (1), with at least one such panel (10) which is sealingly inserted against components (10, 41, 42) of the room system (1).</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:面板、壁面板</p>
        <p type="p">12:中心表面部分</p>
        <p type="p">14:邊緣</p>
        <p type="p">20:套環</p>
        <p type="p">22:第一套環部分</p>
        <p type="p">24:第二套環部分</p>
        <p type="p">30:密封件</p>
        <p type="p">32:角密封件</p>
        <p type="p">34:切口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="833px" img-content="tif" inline="yes" orientation="portrait" width="671px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621628</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143614</doc-number>
          <kind></kind>
          <date>114/11/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251126B">A47L11/40</main-classification>
        <further-classification edition="200601120251126B">A47L11/24</further-classification>
        <further-classification edition="200601120251126B">A47L11/28</further-classification>
        <further-classification edition="202401120251126B">G05D1/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余文昊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, WENHAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, JIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116704592</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔機器人的清掃方法和裝置、清潔機器人及存儲介質</chinese-title>
        <english-title>CLEANING METHOD AND DEVICE FOR CLEANING ROBOTS, CLEANING ROBOT, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種清潔機器人的清掃方法和裝置、清潔機器人及存儲介質，涉及智能清潔技術領域。該方法在清潔機器人本次或當前分區清掃結束後，獲取清潔機器人在本次或當前分區清掃過程中懸崖Cliff訊號被觸發的一個或多個位置，以及獲取已清掃區域、未清掃區域；根據Cliff訊號被觸發的一個或多個位置、已清掃區域、未清掃區域，控制清潔機器人運動到未清掃區域，繼續執行清掃動作，這樣能夠完成對漏掃區域的清掃，提高清潔效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a cleaning method and device for cleaning robots, a cleaning robot, and a storage medium, which pertain to the field of intelligent cleaning technology. After the cleaning robot finishes cleaning the current or present partition, this method obtains one or more positions where the Cliff signal was triggered during the cleaning process of the current or present partition, as well as obtains the cleaned area and the uncleaned area. Based on the one or more positions where the Cliff signal was triggered, the cleaned area, and the uncleaned area, the cleaning robot is controlled to move to the uncleaned area and continue performing cleaning actions. This enables the cleaning of missed areas and improves cleaning efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="475px" img-content="tif" inline="yes" orientation="portrait" width="658px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622864</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143641</doc-number>
          <kind></kind>
          <date>114/11/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260205B">G06Q30/0601</main-classification>
        <further-classification edition="202301120260205B">G06Q10/0631</further-classification>
        <further-classification edition="202401120260205B">G06Q10/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商Ｄ4Ａｌｌ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>D4ALL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西郷孝一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAIGO, TAKAHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>池田雅人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IKEDA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>諸冨大樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOROTOMI, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-201940</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>訂購支援裝置</chinese-title>
        <english-title>ORDER SUPPORT DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於一種訂購支援裝置，使商品各自之訂購時間點盡可能一致，減輕店舖中的收貨應對、上架作業之工作量，追求店舖作業之效率提升。  &lt;br/&gt;該訂購支援裝置具有：商品資訊儲存手段，對在店舖銷售的商品，各自儲存庫存量與銷售量的趨勢；訂購閾值儲存手段，對該商品，各自儲存與該庫存量相關之第1閾值、及較該第1閾值更大之第2閾值；庫存量預測手段，依據該商品資訊儲存手段所儲存的資訊，對該商品，各自算出既定期間後之該庫存量的預測值；第1候選抽出手段，將該庫存量低於該第1閾值的商品抽出作為第1訂購候選商品；第2候選抽出手段，將該庫存量的預測值低於該第2閾值的商品抽出作為第2訂購候選商品；以及訂購手段，進行與該第1訂購候選商品及該第2訂購候選商品之訂購相關的處理。&lt;u&gt;  &lt;/u&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">To save labor of delivery correspondence/display work in a store and to improve efficiency of store work by arranging order timing for each commodity as much as possible. &lt;br/&gt;The inventory quantity prediction unit calculates a predicted value of the inventory quantity after a predetermined period of time for each commodity based on information stored in the commodity information storage unit, the first candidate extraction unit extracts a commodity whose inventory quantity is less than the first threshold value as a first order candidate commodity, the second candidate extraction unit extracts a commodity whose predicted value of the inventory quantity is less than the second threshold value as a second order candidate commodity, and the ordering unit performs processing related to ordering of the first order candidate commodity and the second order candidate commodity.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:訂購支援裝置</p>
        <p type="p">110:商品資訊儲存手段</p>
        <p type="p">120:訂購閾值儲存手段</p>
        <p type="p">130:商品位置儲存手段</p>
        <p type="p">140:庫存量預測手段</p>
        <p type="p">150:第1候選抽出手段</p>
        <p type="p">160:第2候選抽出手段</p>
        <p type="p">170:訂購手段</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="708px" img-content="tif" inline="yes" orientation="portrait" width="876px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622402</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143700</doc-number>
          <kind></kind>
          <date>114/11/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">F16K3/08</main-classification>
        <further-classification edition="200601120260302B">F16K47/08</further-classification>
        <further-classification edition="202601120260302B">H10P95/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＣＫＤ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CKD CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>猪股千春</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOMATA, CHIHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福川展弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUKAWA, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西村康典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIMURA, YASUNORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202704</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>非密閉式蝶閥</chinese-title>
        <english-title>NON-SEALED BUTTERFLY VALVE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[問題]本發明能在避免開閥狀態下流導減少的同時減少閉閥狀態或微小開度下的流導。  &lt;br/&gt;[解決手段]蝶閥體（9）包括以軸心（XL）為中心而設置成點對稱的最大外徑部（91A、91B）和第一倒角部（92A、92B），所述最大外徑部（91A、91B）在閉閥位置上與流路（30）的內周面相向，所述第一倒角部（92A、92B）從最大外徑部（91A）朝從閉閥位置往開閥位置的旋轉方向（K方向）的相反側使蝶閥體（9）縮徑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">In a non-sealed butterfly valve, a butterfly valve element includes maximum outer diameter portions facing the inner peripheral surface of a flow passage when the butterfly valve element is in a valve-closed position and first chamfered portions reducing the diameter of the butterfly valve element from the maximum outer diameter portions in a direction opposite a rotation direction of the butterfly valve element rotating from the valve-closed position to a valve-open position. The maximum outer diameter portions are provided point-symmetrically about the axis of a rotary shaft, and the first chamfered portions are provided point-symmetrically about the axis of the rotary shaft.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:接頭</p>
        <p type="p">6:接頭</p>
        <p type="p">8:閥主體</p>
        <p type="p">8a:閥孔</p>
        <p type="p">8b:輸入側流路</p>
        <p type="p">8c:輸出側流路</p>
        <p type="p">9:蝶閥體(閥體)</p>
        <p type="p">9A:部分</p>
        <p type="p">9B:部分</p>
        <p type="p">10:閥桿</p>
        <p type="p">30:流路</p>
        <p type="p">91A:最大外徑部</p>
        <p type="p">91B:最大外徑部</p>
        <p type="p">92A:第一倒角部</p>
        <p type="p">92B:第一倒角部</p>
        <p type="p">93A:第二倒角部</p>
        <p type="p">93B:第二倒角部</p>
        <p type="p">K:方向</p>
        <p type="p">XL:軸心</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="964px" img-content="tif" inline="yes" orientation="portrait" width="607px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622103</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143716</doc-number>
          <kind></kind>
          <date>114/11/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">C07K14/135</main-classification>
        <further-classification edition="200601120260102B">C12N15/45</further-classification>
        <further-classification edition="200601120260102B">C12N15/85</further-classification>
        <further-classification edition="200601120260102B">A61K39/155</further-classification>
        <further-classification edition="200601120260102B">A61P31/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商　傳信生物醫藥（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THEMEDIUM THERAPEUTICS CO., LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡雨恒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, YU HENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張文靜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, WEN JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張景明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, JING MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭薇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PENG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>臧陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZANG, YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯慶辰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116600837</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>呼吸道合胞病毒重構多肽及其應用</chinese-title>
        <english-title>RECOMBINANT POLYPEPTIDE OF RESPIRATORY SYNCYTIAL VIRUS AND ITS APPLICATIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種呼吸道合胞病毒(RSV)F蛋白重構多肽、編碼其的多核苷酸、包含該多核苷酸的核酸構建體、包含該核酸構建體的表達載體、其中轉化或轉染有上述多核苷酸、核酸構建體或表達載體的宿主細胞，由該重構多肽形成的穩定化多聚體，包含前述任一項的免疫原性組合物，及其在製備用於預防和/或治療呼吸道合胞病毒感染的疫苗中的用途。本發明的RSV F蛋白重構多肽具有很好的免疫原性，能夠激發機體產生高水平的中和抗體滴度，對於呼吸道合胞病毒的臨床治療和防控具有重大的意義。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a reconstructed respiratory syncytial virus (RSV) F protein polypeptide, a polynucleotide encoding the same, a nucleic acid construct containing the polynucleotide, an expression vector comprising the nucleic acid construct, a host cell transformed or transfected with the aforementioned polynucleotide, nucleic acid construct, or expression vector, a stabilized multimer formed by the reconstructed polypeptide, an immunogenic composition comprising any of the foregoing, and its use in the preparation of vaccines for the prevention and/or treatment of RSV infection. The reconstructed RSV F protein polypeptide of the present invention exhibits excellent immunogenicity, capable of inducing high levels of neutralizing antibody titers in the body, and has significant implications for the clinical treatment and prevention of respiratory syncytial virus infection.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622496</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143731</doc-number>
          <kind></kind>
          <date>114/11/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260302B">G01N23/2255</main-classification>
        <further-classification edition="200601120260302B">G01N1/42</further-classification>
        <further-classification edition="202601120260302B">H10K39/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東麗分析研究中心股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TORAY RESEARCH CENTER, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>淺原千鶴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHARA, CHIZURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白倉大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIRAKURA, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199399</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鈣鈦礦膜的分析方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明在使用Ar-GCIB對鈣鈦礦膜進行蝕刻時形成假影，難以以高深度解析度獲得反映了鈣鈦礦成分的本來分佈的深度剖面。在本發明中，課題在於提供一種成分分佈的分析方法，藉由在試樣冷卻下進行通常在室溫下進行的分析，可獲得更接近鈣鈦礦成分的本來的成分分佈的深度剖面，且以高深度解析度獲得深度剖面。本發明是一種鈣鈦礦膜的分析方法包括：在所述鈣鈦礦膜的冷卻下，對所述鈣鈦礦膜連續地或斷續地實施基於離子的蝕刻處理，在所述蝕刻處理之前、期間、結束時進行至少一次表面或基於所述蝕刻處理的所述鈣鈦礦膜的露出面的成分的分析。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="806px" img-content="tif" inline="yes" orientation="portrait" width="1056px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623595</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143753</doc-number>
          <kind></kind>
          <date>114/11/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/72</main-classification>
        <further-classification edition="200601120260302B">C23C16/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福井慎次</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUI, SHINJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-200565</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>保持部、具備保持部之處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">為在將構件進行保持的保持面的至少一部分的區域設有DLC膜(類鑽碳膜)的保持部，前述DLC膜，含有0.1at%以上4.0at%以下的硼，且含氫量為5.0at%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">18:基板保持盤</p>
        <p type="p">22:基部</p>
        <p type="p">23:突部</p>
        <p type="p">24:吸引孔部</p>
        <p type="p">25:貫通孔</p>
        <p type="p">26:覆蓋層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="322px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621663</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143798</doc-number>
          <kind></kind>
          <date>114/11/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260112B">A61J11/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商慕愛尤尤股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOYUUM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金明成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MYOUNG SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0162939</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>嬰兒用安撫奶嘴</chinese-title>
        <english-title>PACIFIER FOR INFANT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種嬰兒用安撫奶嘴，所述嬰兒用安撫奶嘴包括：奶嘴部，其呈內部形成有中空的奶嘴形狀，並由矽膠材料製成，其前端部插入到嬰兒的口腔，後端部形成有外徑擴大的法蘭部；擋板部，其形成有比所述奶嘴部更大的外徑的板狀，結合於所述奶嘴部並與嬰兒的皮膚接觸；奶嘴固定部，其結合於所述奶嘴部的法蘭部，使空氣與所述奶嘴部的中空流通，並結合於所述擋板部以將所述奶嘴部固定在所述擋板部；以及手柄部，結合於所述奶嘴固定部，所述擋板部由具有不同硬度的多種材料形成，使得所述奶嘴固定部結合的部分和與嬰兒皮膚接觸的部分的硬度形成得彼此不同。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:嬰兒用安撫奶嘴</p>
        <p type="p">100:奶嘴部</p>
        <p type="p">120:吸入孔</p>
        <p type="p">200:擋板部</p>
        <p type="p">400:手柄部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="674px" img-content="tif" inline="yes" orientation="portrait" width="552px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623513</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143864</doc-number>
          <kind></kind>
          <date>114/11/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P10/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
        <further-classification edition="202601120260302B">H10W10/20</further-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商沖電氣工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKI ELECTRIC INDUSTRY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊田孝寛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IDA, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小酒達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOSAKA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古田裕典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FURUTA, HIRONORI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷川兼一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGAWA, KENICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>十文字伸哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUMONJI, SHINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武士仁哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKESHI, JINYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北島由隆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAJIMA, YUTAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中井佑亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-203657</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構體、半導體結構體的製造方法、以及電子裝置的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">議題：使得能夠在基板上以可分離的方式支持半導體薄膜。解決方式：半導體結構體(1)具有作為基板的第一基板(101)、形成在第一基板(101)上的半導體薄膜(100)、以及支持體(108)。支持體(108)由阻劑材料構成，且以在半導體薄膜(100)與第一基板(101)之間形成空隙的方式，相對於第一基板(101)支持半導體薄膜(100)。支持體(108)接合於第一基板(101)以及半導體薄膜(100)的對向於第一基板(101)的作為第一面的下表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:半導體結構體</p>
        <p type="p">100:半導體薄膜</p>
        <p type="p">100c,108c:側面</p>
        <p type="p">101:第一基板</p>
        <p type="p">102:緩衝層</p>
        <p type="p">103:接觸層</p>
        <p type="p">104:漂移層</p>
        <p type="p">105:蕭特基電極</p>
        <p type="p">108:支持體</p>
        <p type="p">X,Y:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10082.JPG" file="ed10082.JPG" height="350px" img-content="tif" inline="yes" orientation="portrait" width="552px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623150</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143870</doc-number>
          <kind></kind>
          <date>114/11/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251230B">H02K7/18</main-classification>
        <further-classification edition="200601120251230B">H02K7/116</further-classification>
        <further-classification edition="200601120251230B">H02K1/12</further-classification>
        <further-classification edition="200601120251230B">H02K1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本他喜龍希愛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C.I.TAKIRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村有志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>增子達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASHIKO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桐原武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIHARA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口清和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, KIYOKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205446</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>小型發電機及輪轂發電機</chinese-title>
        <english-title>SMALL GENERATOR AND HUB DYNAMO</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種小型發電機及輪轂發電機，小型發電機（1）將以基軸線（J1）為中心旋轉的旋轉力轉換為電力。包括：發電部件（80），其布置於基軸線（J1）的周圍，以從基軸線（J1）偏離的旋轉軸線（J2）為中心旋轉而發電；以及變速部件（50），其以與發電部件（80）同軸地連結的狀態布置於基軸線（J1）的周圍。變速部件（50）將旋轉力的旋轉增速並傳達至發電部件（80）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The object of the present invention is to provide a small generator and a hub dynamo. The small generator 1 converts rotational force rotating around a base axis J1 into electric power. It includes a generator member 80 arranged around the base axis J1 and generating electricity by rotating around a rotation axis J2 eccentric from the base axis J1, and a speed-changing member 50 arranged around the base axis J1 and coaxially connected to the generator member 80. The speed-changing member 50 accelerates the rotation of the rotational force and transmits it to the generator member 80.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輪轂(輪轂發電機)</p>
        <p type="p">2:輪轂軸</p>
        <p type="p">3:輪轂主體</p>
        <p type="p">4:輪轂管</p>
        <p type="p">5:輪轂軸承</p>
        <p type="p">6:發電機單元(小型發電機)</p>
        <p type="p">7:接頭</p>
        <p type="p">8:馬達托架</p>
        <p type="p">20:旋轉力傳達機構</p>
        <p type="p">21:內齒齒輪</p>
        <p type="p">22:小齒輪</p>
        <p type="p">31:筒部</p>
        <p type="p">32:盤部</p>
        <p type="p">32a:凸緣部</p>
        <p type="p">32b:輻條孔</p>
        <p type="p">32c:輪轂凸起部</p>
        <p type="p">50:擺線增速機(變速部件)</p>
        <p type="p">80:無芯發電機(無芯馬達、發電部件)</p>
        <p type="p">81:輸入軸</p>
        <p type="p">J1:基軸線</p>
        <p type="p">J2:旋轉軸線</p>
        <p type="p">Y1:箭頭</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="766px" img-content="tif" inline="yes" orientation="portrait" width="590px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623151</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143871</doc-number>
          <kind></kind>
          <date>114/11/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251230B">H02K7/18</main-classification>
        <further-classification edition="200601120251230B">H02K7/116</further-classification>
        <further-classification edition="200601120251230B">H02K1/12</further-classification>
        <further-classification edition="200601120251230B">H02K1/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本他喜龍希愛股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>C.I.TAKIRON CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村有志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, YUSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>增子達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MASHIKO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>桐原武</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIRIHARA, TAKESHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山口清和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAGUCHI, KIYOKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205455</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>小型發電機及輪轂發電機</chinese-title>
        <english-title>SMALL GENERATOR AND HUB DYNAMO</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種小型發電機及輪轂發電機，小型發電機（1）將以基軸線（J1）為中心旋轉的旋轉力轉換為電力。包括：至少一個發電部件（80），布置在基軸線（J1）的周圍，藉由以從基軸線（J1）偏離的旋轉軸線（J2）為中心旋轉而發電；以及變速部件（50），以基軸線（J1）為中心布置，並與發電部件（80）連結。變速部件（50）以基軸線（J1）為中心旋轉，從而將旋轉力的旋轉增速並傳達至發電部件（80）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The object of the present invention is to provide a small generator and a hub dynamo. The small generator 1 converts rotational force rotating about a base axis J1 into electric power. It comprises at least one generator member 80 arranged around the base axis J1 and generating electric power by rotating about a rotation axis J2 eccentric from the base axis J1, and a speed-changing member 50 arranged about the base axis J1 and connected to the generator member 80. As the speed-changing member 50 rotates about the base axis J1, the rotation of the rotational force is accelerated and transmitted to the generator member 80.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:輪轂(輪轂發電機)</p>
        <p type="p">2:輪轂軸</p>
        <p type="p">3:輪轂主體</p>
        <p type="p">4:輪轂管</p>
        <p type="p">5:輪轂軸承</p>
        <p type="p">6:發電機單元(小型發電機)</p>
        <p type="p">8:馬達托架</p>
        <p type="p">20:輸入側旋轉力傳達機構</p>
        <p type="p">21:輸入側內齒</p>
        <p type="p">22:輸入側小齒輪</p>
        <p type="p">31:筒部</p>
        <p type="p">32:盤部</p>
        <p type="p">32a:凸緣部</p>
        <p type="p">32b:輻條孔</p>
        <p type="p">32c:輪轂凸起部</p>
        <p type="p">50:擺線增速機(變速部件)</p>
        <p type="p">80:無芯發電機(無芯馬達、發電部件)</p>
        <p type="p">J1:基軸線</p>
        <p type="p">J2:旋轉軸線</p>
        <p type="p">Y1:箭頭</p>
        <p type="p">Y2:箭頭</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="886px" img-content="tif" inline="yes" orientation="portrait" width="805px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623287</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143899</doc-number>
          <kind></kind>
          <date>114/11/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200901120260210B">H04W16/28</main-classification>
        <further-classification edition="201901120260210B">G06N20/00</further-classification>
        <further-classification edition="200901120260210B">H04W24/10</further-classification>
        <further-classification edition="202301120260210B">H04W72/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佩哲席克　哈米德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PEZESHKI, HAMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
              <english-address>IR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李喬羽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIAOYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱　濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫瑪　拉傑夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, RAJEEV</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/132557</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/087363</doc-number>
          <date>20250404</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>指示用於波束預測的候選相關聯識別符</chinese-title>
        <english-title>INDICATING CANDIDATE ASSOCIATED IDENTIFIERS FOR BEAM PREDICTION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述用於無線通訊的方法、系統、及裝置。所描述的技術可使一網路實體能夠向一使用者設備(UE)指示推論資訊的一或多個組合，諸如相關聯識別符、用於推論操作的組態資訊、及與推論操作相關聯的一或多個參數。該UE可判定哪些組合可與該網路實體的目前條件、該網路實體的未來條件、或一或多個額外網路實體的條件相關聯。該UE可基於該判定來相應地獲得與該等組合相關聯的模型，且可向該網路實體指示可用模型。該網路實體可針對推論操作啟動該等可用模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods, systems, and devices for wireless communications are described. The described techniques may enable a network entity to indicate, to a user equipment (UE), one or more combinations of inference information, such as associated identifiers, configuration information for an inference operation, and one or more parameters associated with the inference operations. The UE may determine which of the combinations may be associated with current conditions of the network entity, future conditions of the network entity, or conditions of one or more additional network entities. The UE may accordingly obtain models associated with the combinations based on the determination and may indicate the available models to the network entity. The network entity may activate the available models for the inference operation.</p>
      </isu-abst>
      <representative-img>
        <p type="p">105-c:網路實體</p>
        <p type="p">115-c:UE</p>
        <p type="p">400:程序流程</p>
        <p type="p">405,410,415,420,425,430:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="1023px" img-content="tif" inline="yes" orientation="portrait" width="709px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623565</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143908</doc-number>
          <kind></kind>
          <date>114/11/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊慧萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HUI PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈溢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117483826</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>保溫裝置及半導體製程設備</chinese-title>
        <english-title>INSULATION DEVICE AND SEMICONDUCTOR PROCESS EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種保溫裝置及半導體製程設備，涉及半導體設備領域。該保溫裝置包括本體，本體具有保溫腔和第一送氣通道，第一送氣通道與保溫腔不連通，第一送氣通道設有多個送氣口，送氣口均設於本體的外壁面。該半導體製程設備包括製程腔室和上述的保溫裝置，保溫裝置設於製程腔室，本體靠近腔室排氣口設置。該保溫裝置具有保溫和送氣的雙重功能，其送氣功能用於製程腔室的補償進氣時，可以增加用於出氣的送氣口所處區域及其附近區域的進氣量，從而有助於使製程腔室內氣體及其壓力的分佈更加均勻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides an insulation device and semiconductor process equipment, which relates to the field of semiconductor equipment. The insulation device includes a main body with an insulation cavity and a first air supply channel, which is not connected to the insulation cavity. The first air supply channel has multiple air supply ports, all located on the outer sidewall of the main body. The semiconductor process equipment includes a process chamber and the aforementioned insulation device. The insulation device is located within the process chamber, and the main body is positioned near the chamber's exhaust port. The insulation device has dual functions of insulation and air supply. When its air supply function is used to compensate for air intake in the process chamber, it can increase the air intake volume in the area where the air supply ports near the exhaust are located and in the vicinity, thereby making the gas and its pressure distribution within the process chamber more uniform.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:腔室組件</p>
        <p type="p">110:製程腔室</p>
        <p type="p">111:腔室進氣口</p>
        <p type="p">112:腔室排氣口</p>
        <p type="p">113:製程門</p>
        <p type="p">120:晶舟</p>
        <p type="p">200:保溫裝置</p>
        <p type="p">310:氣體輸送管</p>
        <p type="p">400:壓力檢測組件</p>
        <p type="p">410:測壓管</p>
        <p type="p">420:第一真空轉換接頭</p>
        <p type="p">430:第一金屬接管</p>
        <p type="p">440:第一氣閥</p>
        <p type="p">450:第二金屬接管</p>
        <p type="p">460:測壓真空規</p>
        <p type="p">470:第二真空轉換接頭</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="906px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623177</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143909</doc-number>
          <kind></kind>
          <date>114/11/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">H02M7/217</main-classification>
        <further-classification edition="200601120260202B">G05F1/565</further-classification>
        <further-classification edition="200601120260202B">H02M1/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王繼承</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JICHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李廣卓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, GUANGZHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117200028</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>交錯式切換式轉換器及積體控制電路、方法和數位控制器</chinese-title>
        <english-title>INTERLEAVED SWITCHING CONVERTER AND INTEGRATED CONTROL CIRCUIT, METHOD AND DIGITAL CONTROLLER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了交錯式切換式轉換器及其積體控制電路、控制方法和數位控制器。交錯式切換式轉換器包括第一切換式電路以及第二切換式電路，該控制方法包括：基於參考訊號和代表輸出電壓的回饋訊號，提供回饋補償訊號；接收輸入整流電壓，提供輸入整流電壓峰值訊號；基於輸入整流電壓峰值訊號和回饋補償訊號，提供第一導通時長；動態地指定第一與第二切換式電路中的一個為主切換式電路，另一個為從切換式電路；基於第一導通時長，提供第二導通時長；配置主切換式電路工作在臨界導通模式，主切換式電路的主開關管的導通時長為第一導通時長；以及配置從切換式電路工作在不連續導通模式，從切換式電路的從開關管的導通時長為第二導通時長。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Interleaved switching converters and integrated control circuits, control methods and digital controllers thereof are disclosed. The interleaved switching converter includes a first switching circuit and a second switching circuit, and the control method includes: providing a feedback compensation signal based on a reference signal and a feedback signal representing an output voltage; receiving an input rectified voltage and providing an input rectified voltage peak signal; providing a first on-time based on the input rectified voltage peak signal and the feedback compensation signal; dynamically designating one of the first switching circuit and the second switching circuit as a master switching circuit and the other as a slave switching circuit; providing a second on-time based on the first on-time; configuring the master switching circuit to operate in a boundary conduction mode, wherein an on-time of a master switch of the master switching circuit is the first on-time; and configuring the slave switching circuit to operate in a discontinuous conduction mode, wherein an on-time of a slave switch of the slave switching circuit is the second on-time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:積體控制電路</p>
        <p type="p">11:整流電路</p>
        <p type="p">12:回饋電路</p>
        <p type="p">100:交錯式切換式轉換器</p>
        <p type="p">101:峰值取樣電路</p>
        <p type="p">102:誤差放大電路</p>
        <p type="p">103:第一導通時長產生單元</p>
        <p type="p">104:指定單元</p>
        <p type="p">105:第二導通時長產生單元</p>
        <p type="p">106:主開關管控制單元</p>
        <p type="p">107:從開關管控制單元</p>
        <p type="p">ACIN:輸入檢測端子</p>
        <p type="p">C1,C2:輸入電容器</p>
        <p type="p">CSA,CSB:電流檢測端子</p>
        <p type="p">CTRLM,CTRLS:控制訊號</p>
        <p type="p">DA,DB:開關</p>
        <p type="p">FB:回饋端子</p>
        <p type="p">GA,GB:控制端子</p>
        <p type="p">GND:參考地端子</p>
        <p type="p">LA,LB:電感</p>
        <p type="p">R1,R2:分壓電阻器</p>
        <p type="p">QA,QB:功率開關管</p>
        <p type="p">TON1,TON2:導通時長</p>
        <p type="p">Vac:交流電壓</p>
        <p type="p">Vcomp:回饋補償訊號</p>
        <p type="p">VFB:回饋訊號</p>
        <p type="p">Vin:輸入電壓</p>
        <p type="p">VPK:輸入整流電壓峰值訊號</p>
        <p type="p">Vout:輸出電壓</p>
        <p type="p">Vreg:輸入整流電壓</p>
        <p type="p">V&lt;sub&gt;ZCDA&lt;/sub&gt;,V&lt;sub&gt;ZCDB&lt;/sub&gt;:過零檢測訊號</p>
        <p type="p">ZCDA,ZCDB:過零檢測端子</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="662px" img-content="tif" inline="yes" orientation="portrait" width="634px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622675</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143960</doc-number>
          <kind></kind>
          <date>114/11/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120251128B">G05D1/648</main-classification>
        <further-classification edition="200601120251128B">A47L11/40</further-classification>
        <further-classification edition="200601120251128B">A47L11/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>祁勝軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QI, SHENGJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116763463</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔設備的控制方法、裝置、清潔設備和可讀存儲介質</chinese-title>
        <english-title>CONTROL METHOD, APPARATUS, CLEANING EQUIPMENT, AND READABLE STORAGE MEDIUM FOR CLEANING EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種清潔設備的控制方法、裝置、清潔設備和可讀存儲介質，涉及智慧家居領域。該方法包括：控制清潔設備朝向基站移動，並在移動過程中獲取清潔設備與基站之間的即時距離；當即時距離小於或等於第一預設加速距離時，控制清潔設備進行第一加速移動，使清潔設備的清潔組件通過基站的坡道上的凸起結構，該凸起結構在清潔組件通過時，與清潔組件相接觸。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a control method, apparatus, cleaning equipment, and a readable storage medium for cleaning equipment, relating to the field of smart home. The method includes: controlling the cleaning equipment to move towards the base station and obtaining the real-time distance between the cleaning equipment and the base station during the movement; when the real-time distance is less than or equal to a first preset acceleration distance, controlling the cleaning equipment to perform a first accelerated movement, enabling the cleaning component of the cleaning equipment to pass over a raised structure on the ramp of the base station. This raised structure comes into contact with the cleaning component when the cleaning component passes over it.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201~202:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="358px" img-content="tif" inline="yes" orientation="portrait" width="654px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622081</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143991</doc-number>
          <kind></kind>
          <date>114/11/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D491/147</main-classification>
        <further-classification edition="200601120260302B">C07D519/00</further-classification>
        <further-classification edition="200601120260302B">A61K31/4545</further-classification>
        <further-classification edition="200601120260302B">A61K31/4985</further-classification>
        <further-classification edition="200601120260302B">A61K31/437</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商百濟神州Ｉ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEONE MEDICINES I GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐三甲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, SANJIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭益安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUO, YIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李菁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　志偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHIWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/131771</doc-number>
          <date>20241113</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/121345</doc-number>
          <date>20250915</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>橋接環狀5-胺基-6,8-二氫-1H-呋喃并[3,4-d]吡咯并[3,2-b]吡啶-2-甲醯胺化合物、其組合物及其治療方法</chinese-title>
        <english-title>BRIDGED CYCLIC 5-AMINO-6,8-DIHYDRO-1H-FURO[3,4-D]PYRROLO[3,2-B]PYRIDINE-2-CARBOXAMIDE COMPOUNDS, COMPOSITIONS THEREOF, AND METHODS OF TREATMENT THEREWITH</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供具有以下結構之化合物：  &lt;br/&gt;&lt;img align="absmiddle" height="214px" width="365px" file="ed11079.JPG" alt="ed11079.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，        &lt;br/&gt;&lt;br/&gt;或其N-氧化物、或其醫藥學上可接受之鹽、立體異構物、互變異構物或氘化類似物，其中取代基係如本文所定義；該等物質之醫藥組合物及用於與甲基硫腺苷(MTA)協同調節攜帶MTAP&lt;sup&gt;DEL&lt;/sup&gt;突變之腫瘤中PRMT5活性之用途；及該等物質之醫藥組合物及使用方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided herein are compounds having the following structure: &lt;br/&gt;&lt;img align="absmiddle" height="164px" width="353px" file="ed11080.JPG" alt="ed11080.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="32px" width="31px" file="ed11081.JPG" alt="ed11081.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;，&lt;br/&gt;or an N-oxide thereof, or a pharmaceutically acceptable salt, stereoisomer, tautomer, or a deuterated analog thereof, wherein the substituents are as defined herein, their pharmaceutical compositions and uses for modulating the activity of PRMT5 in cooperation with methylthioadenosine (MTA) in tumors bearing MTAPDEL mutations, and their pharmaceutical compositions and methods of use.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623301</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114143992</doc-number>
          <kind></kind>
          <date>114/11/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">H05B3/14</main-classification>
        <further-classification edition="200601120251201B">H01B3/10</further-classification>
        <further-classification edition="200601120251201B">C04B35/573</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友大阪水泥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO OSAKA CEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤悠哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, YUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川恭平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, KYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金原勇貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KINPARA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202034</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>SiC加熱器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種包括耐久性高的絕緣被膜的SiC加熱器。一種SiC加熱器，包括：發熱體，具有薄板狀的碳化矽燒結體與形成於碳化矽燒結體的表面的絕緣被膜；一對電極，用於對發熱體通電；以及加熱器基座，於絕熱來自發熱體的熱的同時自一表面側保持發熱體，絕緣被膜位於碳化矽燒結體的與加熱器基座相反之側的面上，絕緣被膜於常溫下的電阻為10&lt;sup&gt;9&lt;/sup&gt; Ω以上，絕緣被膜包括：基質，包含SiO&lt;sub&gt;2&lt;/sub&gt;與Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;及B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;的任一者或兩者；以及成分，添加至基質中，成分為選自由氧化鋅、氧化鎵、氧化鎂及氧化錫所組成的群組中的至少一種，相對於絕緣被膜整體，成分的合計含有率超過5.0質量%且為30.0質量%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:發熱體</p>
        <p type="p">1a:吸附面</p>
        <p type="p">1b:背面</p>
        <p type="p">2:第一狹縫/狹縫</p>
        <p type="p">3:第二狹縫/狹縫</p>
        <p type="p">4、5:(電極安裝用)貫通孔</p>
        <p type="p">6:(晶片吸附用)貫通孔</p>
        <p type="p">7、8:(導熱板吸附用)貫通孔</p>
        <p type="p">9、10:(導熱板吸附用)槽</p>
        <p type="p">11、12:(各種氣體供給用)貫通孔</p>
        <p type="p">13、14:(安裝螺釘插通用)貫通孔</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="464px" img-content="tif" inline="yes" orientation="portrait" width="554px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622563</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144035</doc-number>
          <kind></kind>
          <date>114/11/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251215B">G02B6/26</main-classification>
        <further-classification edition="200601120251215B">G02B6/36</further-classification>
        <further-classification edition="200601120251215B">G02B6/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧研發公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING RESEARCH &amp; DEVELOPMENT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坦漢夫　艾瑞克史提芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEN HAVE, ERIC STEPHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,258</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>溫度補償光學總成</chinese-title>
        <english-title>TEMPERATURE COMPENSATED OPTICAL ASSEMBLIES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學總成包括耦接至一第二光學組件之一第一光學組件。該第一光學組件具有：第一主體，具有一第一熱膨脹係數&lt;img align="absmiddle" height="38px" width="40px" file="ed10096.JPG" alt="ed10096.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；及第一複數個透光性構件，配置於一第一構件陣列中且具有一參考溫度間隔&lt;img align="absmiddle" height="33px" width="25px" file="ed10100.JPG" alt="ed10100.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;。該第二光學組件具有：第二主體，具有一第二熱膨脹係數&lt;img align="absmiddle" height="31px" width="32px" file="ed10101.JPG" alt="ed10101.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;；及第二複數個透光性構件，配置於一第二構件陣列中且具有根據方程式1之一參考溫度間隔&lt;img align="absmiddle" height="33px" width="28px" file="ed10102.JPG" alt="ed10102.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;：&lt;br/&gt;&lt;img align="absmiddle" height="76px" width="543px" file="ed10105.JPG" alt="ed10105.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;                     其中：&lt;img align="absmiddle" height="33px" width="28px" file="ed10104.JPG" alt="ed10104.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;為溫度；&lt;img align="absmiddle" height="19px" width="28px" file="ed10103.JPG" alt="ed10103.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;為一參考溫度；且&lt;img align="absmiddle" height="33px" width="35px" file="ed10097.JPG" alt="ed10097.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;為該第一光學組件及該第二光學組件耦接在一起時之一最佳化溫度，其中&lt;img align="absmiddle" height="50px" width="211px" file="ed10098.JPG" alt="ed10098.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; 。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical assembly includes a first optical component coupled to a second optical component. The first optical component has first body having a first coefficient of thermal expansion &lt;img align="absmiddle" height="30px" width="33px" file="ed10099.JPG" alt="ed10099.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; and a first plurality of light transmitting members arranged in a first member array and having a reference temperature spacing &lt;img align="absmiddle" height="35px" width="31px" file="ed10106.JPG" alt="ed10106.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;. The second optical component has second body having a second coefficient of thermal expansion &lt;img align="absmiddle" height="32px" width="32px" file="ed10107.JPG" alt="ed10107.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; and a second plurality of light transmitting members arranged in a second member array and having a reference temperature spacing &lt;img align="absmiddle" height="35px" width="30px" file="ed10108.JPG" alt="ed10108.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; according to Equation 1:&lt;br/&gt;&lt;img align="absmiddle" height="86px" width="529px" file="ed10109.JPG" alt="ed10109.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;                   wherein: &lt;img align="absmiddle" height="33px" width="28px" file="ed10104.JPG" alt="ed10104.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; is temperature; &lt;img align="absmiddle" height="19px" width="28px" file="ed10103.JPG" alt="ed10103.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; is a reference temperature; and&lt;img align="absmiddle" height="33px" width="35px" file="ed10097.JPG" alt="ed10097.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; is an optimization temperature for the first optical component and the second optical component when coupled together, wherein &lt;img align="absmiddle" height="36px" width="171px" file="ed10110.JPG" alt="ed10110.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt; .</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:波導基板</p>
        <p type="p">110:基板主體</p>
        <p type="p">112:波導基板介面表面</p>
        <p type="p">114:頂部表面</p>
        <p type="p">120:波導</p>
        <p type="p">200:多光纖套圈</p>
        <p type="p">210:套圈主體</p>
        <p type="p">212:套圈介面表面</p>
        <p type="p">216:導孔</p>
        <p type="p">300:光學總成</p>
        <p type="p">320:導銷</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10113.JPG" file="ed10113.JPG" height="483px" img-content="tif" inline="yes" orientation="portrait" width="660px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621941</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144039</doc-number>
          <kind></kind>
          <date>114/11/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">B62M25/08</main-classification>
        <further-classification edition="201001120251201B">B62M6/45</further-classification>
        <further-classification edition="201001120251201B">B62M6/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商島野股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMANO INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合田紘章</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>102024211411.1</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>人力驅動車輛之操作系統</chinese-title>
        <english-title>OPERATING SYSTEM FOR HUMAN-POWERED VEHICLE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種用於一人力驅動車輛V之操作系統10、110、210、310、410、510、610。該操作系統10、110、210、310、410、510、610包含一第一電開關26、126A、226、326、426、526、626、一第二電開關28、128A、228、328、428、528、628、一無線通信器36、136A、136B、236、336、436、536、636、一控制器30、130A、130B、230、330、430、530、630及一雙線電纜18、118A、118B、218A、218B、318、418、518、618。該無線通信器36、136A、136B、236、336、436、536、636經組態以傳輸一無線信號。該控制器30、130A、130B、230、330、430、530、630經組態以基於該第一電開關26、126A、226、326、426、526、626及該第二電開關28、128A、228、328、428、528、628之狀態來控制該無線通信器36、136A、136B、236、336、436、536、636。該雙線電纜18、118A、118B、218A、218B、318、418、518、618電連接一第一電路板22、122A、222、322、422、522、622與一第二電路板24、124A、224、324、424、524、624。該無線通信器36、136A、136B、236、336、436、536、636及該控制器30、130A、130B、230、330、430、530、630經設置至該第一電路板22、122A、222、322、422、522、622。該第一電開關26、126A、226、326、426、526、626及該第二電開關28、128A、228、328、428、528、628經設置至該第二電路板24、124A、224、324、424、524、624。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An operating system 10, 110, 210, 310, 410, 510, 610 is provided for a human-powered vehicle V. The operating system 10, 110, 210, 310, 410, 510, 610 includes a first electrical switch 26, 126A, 226, 326, 426, 526, 626, a second electrical switch 28, 128A, 228, 328, 428, 528, 628, a wireless communicator 36, 136A, 136B, 236, 336, 436, 536, 636, a controller 30, 130A, 130B, 230, 330, 430, 530, 630 and a two-wire electrical cable 18, 118A, 118B, 218A, 218B, 318, 418, 518, 618. The wireless communicator 36, 136A, 136B, 236, 336, 436, 536, 636 is configured to transmit a wireless signal. The controller 30, 130A, 130B, 230, 330, 430, 530, 630 is configured to control the wireless communicator 36, 136A, 136B, 236, 336, 436, 536, 636 based on states of the first electrical switch 26, 126A, 226, 326, 426, 526, 626 and the second electrical switch 28, 128A, 228, 328, 428, 528, 628. The two-wire electrical cable 18, 118A, 118B, 218A, 218B, 318, 418, 518, 618 electrically connects a first circuit board 22, 122A, 222, 322, 422, 522, 622 and a second circuit board 24, 124A, 224, 324, 424, 524, 624. The wireless communicator 36, 136A, 136B, 236, 336, 436, 536, 636 and the controller 30, 130A, 130B, 230, 330, 430, 530, 630 are provided to the first circuit board 22, 122A, 222, 322, 422, 522, 622. The first electrical switch 26, 126A, 226, 326, 426, 526, 626 and the second electrical switch 28, 128A, 228, 328, 428, 528, 628 are provided to the second circuit board 24, 124A, 224, 324, 424, 524, 624.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:操作系統</p>
        <p type="p">12:第一電組件</p>
        <p type="p">14:第二電組件</p>
        <p type="p">18:雙線電纜</p>
        <p type="p">18a:外罩殼</p>
        <p type="p">22:第一電路板</p>
        <p type="p">24:第二電路板</p>
        <p type="p">26:第一電開關</p>
        <p type="p">28:第二電開關</p>
        <p type="p">30:控制器</p>
        <p type="p">30A:處理器</p>
        <p type="p">30B:記憶體</p>
        <p type="p">32:第一二極體</p>
        <p type="p">34:第二二極體</p>
        <p type="p">36:無線通信器</p>
        <p type="p">38:電池</p>
        <p type="p">40:第一電阻器</p>
        <p type="p">42:第二電阻器</p>
        <p type="p">44:第三電阻器</p>
        <p type="p">46:第四電阻器</p>
        <p type="p">T1:第一電端子</p>
        <p type="p">T2:第二電端子</p>
        <p type="p">W1:第一電線</p>
        <p type="p">W2:第二電線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="726px" img-content="tif" inline="yes" orientation="portrait" width="1013px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623413</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144064</doc-number>
          <kind></kind>
          <date>114/11/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/17</main-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202601120260302B">H10P14/24</further-classification>
        <further-classification edition="202501120260302B">H10D30/62</further-classification>
        <further-classification edition="202501120260302B">H10D84/85</further-classification>
        <further-classification edition="202501120260302B">H10D30/01</further-classification>
        <further-classification edition="202501120260302B">H10D64/01</further-classification>
        <further-classification edition="202601120260302B">H10D84/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, JUNYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金昌炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHANGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳嬉堤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, HUIJE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴培權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BAEKWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪敏碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, MINSEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李鉉美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUNMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0163349</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置、製造其之方法及包括該半導體裝置的電子裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體裝置，其包括：一通道層，其包括一凡得瓦材料；一中間層，其配置於該通道層上，且包括一半導體或一絕緣體及一摻雜劑；一閘極絕緣層，其配置於該中間層上；以及一閘極電極，其配置於該閘極絕緣層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is a semiconductor device including a channel layer including a van der Waals material, an interlayer arranged on the channel layer and including a semiconductor or an insulator, and a dopant, a gate insulating layer arranged on the interlayer, and a gate electrode arranged on the gate insulating layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:基體</p>
        <p type="p">140:通道層</p>
        <p type="p">150:中間層</p>
        <p type="p">160:閘極絕緣層</p>
        <p type="p">170:閘極電極</p>
        <p type="p">180:源極電極</p>
        <p type="p">190:汲極電極</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.png" file="d10014.TIF" giffile="ed10014.png" height="482px" img-content="tif" inline="yes" orientation="portrait" width="700px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621818</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144100</doc-number>
          <kind></kind>
          <date>114/11/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260302B">B22F1/054</main-classification>
        <further-classification edition="202201120260302B">B22F1/10</further-classification>
        <further-classification edition="200601120260302B">B22F7/00</further-classification>
        <further-classification edition="200601120260302B">B22F7/04</further-classification>
        <further-classification edition="200601120260302B">B23K1/00</further-classification>
        <further-classification edition="200601120260302B">B23K35/02</further-classification>
        <further-classification edition="200601120260302B">B23K35/26</further-classification>
        <further-classification edition="200601120260302B">B23K35/36</further-classification>
        <further-classification edition="200601120260302B">B23K35/363</further-classification>
        <further-classification edition="200601120260302B">C09J11/04</further-classification>
        <further-classification edition="200601120260302B">C09J201/00</further-classification>
        <further-classification edition="201801120260302B">C09J7/10</further-classification>
        <further-classification edition="201801120260302B">C09J7/35</further-classification>
        <further-classification edition="200601120260302B">C09J9/02</further-classification>
        <further-classification edition="200601120260302B">H01B1/22</further-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
        <further-classification edition="202601120260302B">H10W72/30</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深道佑一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKAMICHI, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒔田克彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAKITA, KATSUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高橋聖和</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SEINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199526</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>燒結接合用片材、組合物及清漆、以及附有燒結接合用片材之切割帶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種不易產生片材之粒子不均或加工時之裂紋或缺口之燒結接合用片材。  &lt;br/&gt;本發明係一種燒結接合用片材，其包含含有導電性金屬之燒結性粒子、及黏合劑，  &lt;br/&gt;上述燒結性粒子之漢森溶解度參數與上述黏合劑之漢森溶解度參數之間之距離Db未達15.0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:附有燒結接合用片材之切割帶</p>
        <p type="p">10:燒結接合用片材</p>
        <p type="p">20:切割帶</p>
        <p type="p">21:基材</p>
        <p type="p">22:黏著劑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="223px" img-content="tif" inline="yes" orientation="portrait" width="620px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621629</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144158</doc-number>
          <kind></kind>
          <date>114/11/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251226B">A47L11/40</main-classification>
        <further-classification edition="200601120251226B">B25J5/00</further-classification>
        <further-classification edition="200601120251226B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117009948</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024228823155</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>移動機器人及機器人系統</chinese-title>
        <english-title>MOBILE ROBOT AND ROBOT SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種移動機器人及機器人系統，移動機器人包括移動主體、萬向輪模組、兩個主輪模組以及外延伸部件；萬向輪模組和主輪模組設置於移動主體；萬向輪模組位於移動主體在第一方向上的前端部，兩個主輪模組與萬向輪模組沿第一方向間隔佈置，兩個主輪模組沿垂直於第一方向的第二方向間隔佈置；外延伸部件設置於移動主體並能在收折狀態與展開狀態之間轉換；收折狀態下，外延伸部件的全部位於移動主體的正投影範圍之內；外延伸部件展開時，能部分伸出移動主體的正投影範圍之外；外延伸部件處於收折狀態或展開狀態時，移動機器人的整機重心均落在由萬向輪模組和兩個主輪模組定義出的三角形區域在水平面上的正投影區域中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a mobile robot and a robot system. The mobile robot includes a mobile main body, a universal wheel module, two main wheel modules, and an outward extending component. The universal wheel module and the main wheel modules are disposed on the mobile main body. The universal wheel module is located at a front end of the mobile main body in a first direction. The two main wheel modules are spaced apart from the universal wheel module along the first direction, and are also spaced apart from each other along a second direction perpendicular to the first direction. The outward extending component is disposed on the mobile main body and is switchable between a folded state and an unfolded state. In the folded state, the outward extending component is entirely located within an orthographic projection range of the mobile main body. When the outward extending component is unfolded, the outward extending component is partially extended beyond the orthographic projection range of the mobile main body. In the case that the outward extending component is in the folded state or the unfolded state, an overall center of gravity of the mobile robot falls within the orthographic projection area on a horizontal plane of a triangular region defined by the universal wheel module and the two main wheel modules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:容納倉</p>
        <p type="p">200:機械臂</p>
        <p type="p">310:萬向輪模組</p>
        <p type="p">320:主輪模組</p>
        <p type="p">321:第二輪架</p>
        <p type="p">322:驅動輪</p>
        <p type="p">O:中心線</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">S0:正投影區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="825px" img-content="tif" inline="yes" orientation="portrait" width="658px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622414</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144161</doc-number>
          <kind></kind>
          <date>114/11/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120260121B">F21S4/10</main-classification>
        <further-classification edition="201601120260121B">F21S4/22</further-classification>
        <further-classification edition="201601120260121B">F21S4/24</further-classification>
        <further-classification edition="201501120260121B">F21V23/00</further-classification>
        <further-classification edition="200601320260121B">F21W131/10</further-classification>
        <further-classification edition="200601320260121B">F21W131/301</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳信衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳信衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HSIN-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪榮宗</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀佩君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,805</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/729,481</doc-number>
          <date>20241209</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有可調式長度之燈串</chinese-title>
        <english-title>LIGHT STRING WITH ADJUSTABLE LENGTH</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提出一種燈串。該燈串包含：一第一導線；一第二導線；及一第三導線，其中該第二導線沿該第二導線的全長與該第一導線及該第三導線平行。該燈串進一步包含複數個光源，其各自包含兩引腳，其中該複數個光源的該兩引腳中的至少一者與該第二導線電性連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure proposes a light string. The light string includes: a first conductive wire; a second conductive wire; and a third conductive wire, wherein the second conductive wire is parallel to the first conductive wire and the third conductive wire throughout an entire length of the second conductive wire. The light string further includes a plurality of light sources, each including two leads, wherein at least one of the two leads of each of the plurality of light sources is electrically coupled to the second conductive wire.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:燈串</p>
        <p type="p">102:帶狀導線</p>
        <p type="p">102A:第一導線</p>
        <p type="p">102B:第二導線</p>
        <p type="p">102C:第三導線</p>
        <p type="p">104:光源</p>
        <p type="p">106:連接器</p>
        <p type="p">108:變壓器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.png" file="d10017.TIF" giffile="ed10017.png" height="678px" img-content="tif" inline="yes" orientation="portrait" width="1010px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621867</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144165</doc-number>
          <kind></kind>
          <date>114/11/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">B25J9/08</main-classification>
        <further-classification edition="200601120260102B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范紅城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, HONGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHANGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾令星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, LINGXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄育忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411698992X</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024228818392</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>連接座組件、機械臂和清潔設備</chinese-title>
        <english-title>CONNECTING BASE ASSEMBLY, ROBOTIC ARM, AND CLEANING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種連接座組件、機械臂和清潔設備。連接座組件包括：連接座組件包括：底板、安裝座、旋轉座和旋轉關節，安裝座和旋轉座連接於底板的同一側，安裝座設置有連接通道，旋轉關節安裝於安裝座的內部，並通過連接通道與旋轉座動力連接，旋轉關節用於驅動旋轉座相對於底板旋轉。由此，可以使旋轉關節和旋轉座佈局緊湊，能夠減小旋轉座與旋轉關節之間的距離，使得整個連接座組件結構緊湊、體積較小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a connecting base assembly, a robotic arm, and a cleaning apparatus. The connecting base assembly comprises: a base plate, a mounting seat, a rotating seat, and a rotating joint. The mounting seat and the rotating seat are connected to the same side of the base plate. The mounting seat is provided with a connecting channel. The rotating joint is installed inside the mounting seat and is power-connected to the rotating seat through the connecting channel. The rotating joint is used to drive the rotating seat to rotate relative to the base plate. In this way, the layout of the rotating joint and the rotating seat can be made compact, which can reduce the distance between the rotating seat and the rotating joint, resulting in a compact structure and a relatively small size for the entire connecting base assembly.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接座組件</p>
        <p type="p">110:底板</p>
        <p type="p">111:連接部</p>
        <p type="p">121:避讓孔</p>
        <p type="p">122:第一座體</p>
        <p type="p">1221:凹陷結構</p>
        <p type="p">123:第二座體</p>
        <p type="p">130:旋轉座</p>
        <p type="p">140:旋轉關節</p>
        <p type="p">141:驅動部</p>
        <p type="p">1411:馬達</p>
        <p type="p">1412:減速齒輪箱</p>
        <p type="p">142:傳動部</p>
        <p type="p">143:旋轉限位開關</p>
        <p type="p">144:旋轉開關本體</p>
        <p type="p">145:旋轉觸發件</p>
        <p type="p">150:緩衝件</p>
        <p type="p">160:支撐柱</p>
        <p type="p">170:升降觸發件</p>
        <p type="p">180:電路板</p>
        <p type="p">190:滾動組件</p>
        <p type="p">191:第一滾動組件</p>
        <p type="p">192:第二滾動組件</p>
        <p type="p">195:調節螺栓</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="663px" img-content="tif" inline="yes" orientation="portrait" width="721px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622416</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144177</doc-number>
          <kind></kind>
          <date>114/11/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">F22G3/00</main-classification>
        <further-classification edition="200601120251201B">F22G1/16</further-classification>
        <further-classification edition="200601120251201B">H05B6/10</further-classification>
        <further-classification edition="200601120251201B">H05B6/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商特電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUDEN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>外村徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONOMURA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202741</doc-number>
          <date>20241120</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-023510</doc-number>
          <date>20250217</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>過熱水蒸氣生成裝置</chinese-title>
        <english-title>SUPERHEATED STEAM GENERATOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供過熱水蒸氣生成裝置，在根據電力量控制生成的水蒸氣量的裝置中防止水蒸氣生成部的破損，具備：水蒸氣生成部（2），感應加熱螺旋狀的第1導體管（21）而從水生成水蒸氣；過熱水蒸氣生成部（3），感應加熱螺旋狀的第2導體管（31）而從水蒸氣生成過熱水蒸氣；控制部（61），根據向水蒸氣生成部（2）供給的電力量控制由水蒸氣生成部（2）生成的水蒸氣量；和安全裝置（12），基於水蒸氣生成部（2）中的水蒸氣的壓力或溫度防止水蒸氣生成部（2）或過熱水蒸氣生成部（3）的破損，第1導體管（21）具有捲繞成螺旋狀的第1捲繞管部（21a），第2導體管（31）具有捲繞成螺旋狀的第2捲繞管部（31a），安全裝置（12）設置於第1捲繞管部（21a）或將第1捲繞管部（21a）與第2捲繞管部（31a）連通的連通管部（CP）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention is directed to prevent damage to a steam generation unit in a superheated steam generator that controls the amount of steam to be generated, on the basis of the amount of electric power, the superheated steam generator including: a steam generation unit (2) that generates steam from water by inductively heating a first conductor pipe (21) having a spiral shape; a superheated steam generation unit (3) that generates superheated steam from the steam by inductively heating a second conductor pipe (31) having a spiral shape; a control unit (61) that controls an amount of steam to be generated by the steam generation unit (2) based on an amount of electric power to be supplied to the steam generation unit (2); and a safety device (12) that prevents damage to the steam generation unit (2) or the superheated steam generation unit (3), based on a pressure or a temperature of the steam in the steam generation unit (2), in which the first conductor pipe (21) has a first winding portion (21a) that is a spiral winding; the second conductor pipe (31) has a second winding portion (31a) that is a spiral winding; and the safety device (12) is provided to the first winding portion (21a), or to a communication pipe part (CP) communicably connecting the first winding portion (21a) and the second winding portion (31a).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:過熱水蒸氣生成裝置</p>
        <p type="p">12:安全裝置</p>
        <p type="p">12a:放出部</p>
        <p type="p">2:飽和水蒸氣生成部(水蒸氣生成部)</p>
        <p type="p">21:第1導體管</p>
        <p type="p">21a:第1捲繞管部</p>
        <p type="p">21b:第1導入管部</p>
        <p type="p">21c:第1導出管部</p>
        <p type="p">22:磁通產生機構</p>
        <p type="p">22a、32a:鐵芯</p>
        <p type="p">22b:感應線圈</p>
        <p type="p">3:過熱水蒸氣生成部</p>
        <p type="p">31:第2導體管</p>
        <p type="p">31a:第2捲繞管部</p>
        <p type="p">31b:第2導入管部</p>
        <p type="p">31c:第2導出管部</p>
        <p type="p">32:磁通產生機構</p>
        <p type="p">32b:感應線圈</p>
        <p type="p">61:水蒸氣量控制部(控制部)</p>
        <p type="p">63:溫度控制部</p>
        <p type="p">8:溫度檢測器</p>
        <p type="p">P1:第1導入口</p>
        <p type="p">P2:第1導出口</p>
        <p type="p">P3:第2導入口</p>
        <p type="p">P4:第2導出口</p>
        <p type="p">CP:連通管部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="762px" img-content="tif" inline="yes" orientation="portrait" width="1015px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622060</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144218</doc-number>
          <kind></kind>
          <date>114/11/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/14</main-classification>
        <further-classification edition="200601120260302B">C07D403/14</further-classification>
        <further-classification edition="200601120260302B">C07D519/00</further-classification>
        <further-classification edition="200601120260302B">C07D407/14</further-classification>
        <further-classification edition="200601120260302B">C07D409/14</further-classification>
        <further-classification edition="200601120260302B">C07D403/10</further-classification>
        <further-classification edition="200601120260302B">C07D498/04</further-classification>
        <further-classification edition="200601120260302B">C07D471/04</further-classification>
        <further-classification edition="202301120260302B">H10K50/86</further-classification>
        <further-classification edition="202301120260302B">H10K85/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商保土谷化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HODOGAYA CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加瀬幸喜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASE, KOUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三枝優太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAEGUSA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平井大貴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAI, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄文濽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, MOON-CHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平山雄太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAYAMA, YUTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮏川慶仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUKEGAWA, YOSHIHITO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江上直希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGAMI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-198647</doc-number>
          <date>20241113</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>三嗪化合物、以及使用該化合物的有機電致發光元件、電子設備、及電子元件</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種450 nm～750 nm的折射率高且消光係數低的化合物、及將該化合物用於覆蓋層的有機EL元件，以改善有機電致發光（EL）元件的光取出效率。本發明是一種化合物、及有機電致發光元件，所述化合物由下述通式（I）表示，所述有機電致發光元件至少依序具有陽極電極、電洞傳輸層、發光層、電子傳輸層、陰極電極及覆蓋層，其中所述覆蓋層含有下述通式（I）所表示的化合物。  &lt;br/&gt;&lt;br/&gt;&lt;img align="absmiddle" height="223px" width="246px" file="ed10045.JPG" alt="ed10045.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;（記號的定義參照說明書）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:玻璃基板</p>
        <p type="p">2:透明陽極/陽極</p>
        <p type="p">3:電洞注入層</p>
        <p type="p">4:電洞傳輸層</p>
        <p type="p">5:發光層</p>
        <p type="p">6:電子傳輸層</p>
        <p type="p">7:電子注入層</p>
        <p type="p">8:陰極</p>
        <p type="p">9:覆蓋層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10046.JPG" file="ed10046.JPG" height="422px" img-content="tif" inline="yes" orientation="portrait" width="618px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623294</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144273</doc-number>
          <kind></kind>
          <date>114/11/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200901120260102B">H04W68/02</main-classification>
        <further-classification edition="200601120260102B">H04B7/06</further-classification>
        <further-classification edition="200601120260102B">H04L1/08</further-classification>
        <further-classification edition="202301120260102B">H04W72/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商華為技術有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUAWEI TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, QIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚楚婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, CHUTING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳寧樺</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116419432</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>訊號傳輸方法及裝置</chinese-title>
        <english-title>A SIGNAL TRANSMISSION METHOD AND APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供一種訊號傳輸方法及裝置，涉及通訊技術領域。在該方法中，RAN節點通過m個不同方向的波束輪流發送n次第一資訊，第一資訊用於向終端指示存在待接收的尋呼訊息。在發送第一資訊的過程中，n次第一資訊分為a個部分，在不連續的時間段上依次發送。這樣，在發送尋呼訊息失敗的場景下，通過發送第一資訊指示終端存在待接收的尋呼訊息，能夠提高在訊號品質較低的場景下尋呼終端的成功率，提升用戶體驗。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a signal transmission method and apparatus, and relates to the field of communications technologies. In this method, a RAN node sends first information for n times in turn through beams in m different directions, where the first information is used to indicate to a terminal that there is a paging message to be received. In the process of sending the first information, the n pieces of first information are divided into different parts and sent sequentially in non-consecutive time periods. In this way, when a paging message fails to be sent, the first information is sent to indicate to the terminal that there is a paging message to be received, thereby improving the success rate of paging the terminal in scenarios with low signal quality and enhancing user experience.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S501,S502,S503:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10045.JPG" file="ed10045.JPG" height="387px" img-content="tif" inline="yes" orientation="portrait" width="672px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623217</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144274</doc-number>
          <kind></kind>
          <date>114/11/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">H04B7/185</main-classification>
        <further-classification edition="201801120260102B">H04W76/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商聯發科技（新加坡）私人有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK SINGAPORE PTE. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納耶米　馬各</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIEMI, MARKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FI</english-country>
              <english-address>FI</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>無　邦尼特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, PUNEET</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>印度</country>
          <doc-number>202421088535</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/132826</doc-number>
          <date>20251105</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於行動通訊中機載衛星架構的非地面網路用戶設備分離的方法與裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR NTN-UE DETACH FOR ONBOARD SATELLITE ARCHITECTURE IN MOBILE COMMUNICATIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了與行動通訊中機載衛星架構相關的非地面網路（non-terrestrial network；NTN）用戶設備（user equipment；UE）分離的技術。一種裝置（例如，用戶設備）從應用儲存與轉發（Store and Forward；S&amp;amp;F）操作的網路接收指示，該指示向該用戶設備指示即將失去衛星覆蓋。響應於該接收，該裝置執行以下任一操作：（a）響應於該用戶設備已經失去該衛星覆蓋或沒有足夠的時間與該網路執行用戶設備發起的分離或註銷程序，在本地執行分離或註銷程序；或者（b）響應於該用戶設備尚未失去該衛星覆蓋且有足夠的時間執行該用戶設備發起的分離或註銷程序，執行該用戶設備發起的分離或註銷程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Techniques pertaining to non-terrestrial network (NTN)-user equipment (UE) detach for onboard satellite architecture in mobile communications are described. An apparatus (e.g., a UE) receives an indication from a network applying a Store and Forward (S&amp;amp;F) operation, with the indication indicating that the UE is about to lose a satellite coverage. In response to the receiving, the apparatus performs either of the following: (a) detaching or deregistering locally responsive to either the UE already having lost the satellite coverage or there being no sufficient time to perform a UE-initiated detach or deregistration procedure with the network; or (b) the UE-initiated detach or deregistration procedure responsive to the UE having not lost the satellite coverage and there being sufficient time to perform the UE-initiated detach or deregistration procedure.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:流程</p>
        <p type="p">310~320:區塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="1036px" img-content="tif" inline="yes" orientation="portrait" width="720px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623517</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144329</doc-number>
          <kind></kind>
          <date>114/11/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/40</main-classification>
        <further-classification edition="202601120260302B">H10P54/00</further-classification>
        <further-classification edition="202501120260302B">H10D62/10</further-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202501120260302B">H10D62/80</further-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10D88/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁溵之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, EUNJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴培權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, BAEKWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金昌炫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHANGHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0163347</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置製造方法</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露內容係關於一種半導體裝置及一種半導體裝置製造方法。該半導體裝置包括：一基體；一源極電極，其在該基體上；一汲極電極，其與該源極電極隔開；一通道，其將該源極電極連接至該汲極電極且包括一二維材料；一閘極絕緣層，其在該通道上；以及一閘極電極，其在該閘極絕緣層上，其中該閘極電極包括在一垂直方向上面向該源極電極之一重疊區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a semiconductor device and a semiconductor device manufacturing method. The semiconductor device includes a substrate, a source electrode on the substrate, a drain electrode being apart from the source electrode, a channel connecting the source electrode to the drain electrode and including a two-dimensional material, a gate insulating layer on the channel, and a gate electrode on the gate insulating layer, wherein the gate electrode includes an overlap area facing the source electrode in a vertical direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:基體</p>
        <p type="p">121:源極電極</p>
        <p type="p">122:汲極電極</p>
        <p type="p">130:通道</p>
        <p type="p">131:通道層，第一通道層</p>
        <p type="p">132:通道層，第二通道層</p>
        <p type="p">133:通道層，第三通道層</p>
        <p type="p">140:閘極絕緣層</p>
        <p type="p">141:第一閘極絕緣層</p>
        <p type="p">142:第二閘極絕緣層</p>
        <p type="p">142a:底部部分</p>
        <p type="p">142b:第一側表面部分</p>
        <p type="p">142c:上部表面部分</p>
        <p type="p">142d:第二側表面部分</p>
        <p type="p">150:閘極電極</p>
        <p type="p">151:第一閘極電極</p>
        <p type="p">152:第二閘極電極</p>
        <p type="p">152a:第一部分</p>
        <p type="p">152b:第二部分</p>
        <p type="p">E:末端部分</p>
        <p type="p">X,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.bmp" file="ed10002.bmp" height="708px" img-content="tif" inline="yes" orientation="portrait" width="650px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621846</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144351</doc-number>
          <kind></kind>
          <date>114/11/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120251128B">B24B37/08</main-classification>
        <further-classification edition="201201120251128B">B24B37/34</further-classification>
        <further-classification edition="201201120251128B">B24B49/00</further-classification>
        <further-classification edition="200601120251128B">B24B49/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商創技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SPEEDFAM CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田山遊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAYAMA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岩本陽平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IWAMOTO, YOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-204288</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>雙面研磨裝置及工件的雙面研磨方法</chinese-title>
        <english-title>DOUBLE-SIDED GRINDING DEVICE AND DOUBLE-SIDED GRINDING METHOD FOR WORKPIECES</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種可在工件的雙面研磨中檢測貼附於下定盤的研磨墊的厚度和貼附於上定盤的研磨墊的厚度的雙面研磨裝置，包括貼附有下側研磨墊17的下定盤11和貼附有上側研磨墊18的上定盤12。在下定盤11與上定盤12間研磨由載體15保持的工件W雙面的雙面研磨裝置1中，包括設於上定盤12、在工件W的雙面研磨中可檢測至載體15的距離及至下定盤11的距離的距離感測器31；以及在工件W的雙面研磨中利用距離感測器31至載體15的距離演算上側研磨墊18厚度、利用距離感測器31至載體15的距離及距離感測器31至下定盤11的距離演算下側研磨墊17厚度的墊厚度演算部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A double-sided grinding device capable of detecting the thickness of a grinding pad attached to a lower platen and the thickness of a grinding pad attached to an upper platen during double-sided grinding of a workpiece is provided. The double-sided grinding device includes a lower platen 11 to which a lower grinding pad 17 is attached and an upper platen 12 to which an upper grinding pad 18 is attached. The double-sided grinding device 1, for grinding both sides of a workpiece W, which is held by a carrier 15, between the lower platen 11 and the upper platen 12, includes a distance sensor 31 disposed on the upper platen 12 and capable of detecting the distance to the carrier 15 and the distance to the lower platen 11 during double-sided grinding of the workpiece W; and a pad thickness calculator for calculating the thickness of the upper grinding pad 18 by using the distance from the distance sensor 31 to the carrier 15 and calculating the thickness of the lower grinding pad 17 by using the distance from the distance sensor 31 to the carrier 15 and the distance from the distance sensor 31 to the lower platen 11 during double-sided grinding of the workpiece W.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:雙面研磨裝置</p>
        <p type="p">10:研磨機</p>
        <p type="p">10a:基台</p>
        <p type="p">11:下定盤</p>
        <p type="p">11a:下定盤上表面</p>
        <p type="p">11d:第一驅動齒輪</p>
        <p type="p">12:上定盤</p>
        <p type="p">12a:上定盤下表面</p>
        <p type="p">12b:空隙</p>
        <p type="p">12c:測量孔</p>
        <p type="p">12d:第二驅動齒輪</p>
        <p type="p">12e:窗元件</p>
        <p type="p">13:太陽齒輪</p>
        <p type="p">13d:第三驅動齒輪</p>
        <p type="p">14:內齒輪</p>
        <p type="p">14d:第四驅動齒輪</p>
        <p type="p">15:載體</p>
        <p type="p">16:桿件</p>
        <p type="p">16a:吊掛元件</p>
        <p type="p">17:下側研磨墊</p>
        <p type="p">18:上側研磨墊</p>
        <p type="p">21:測量單元</p>
        <p type="p">21a:發送部</p>
        <p type="p">31:距離感測器</p>
        <p type="p">40:控制部</p>
        <p type="p">M1~4:馬達</p>
        <p type="p">O:軸線</p>
        <p type="p">W:工件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="1002px" img-content="tif" inline="yes" orientation="portrait" width="746px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622646</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144410</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260211B">G03F7/20</main-classification>
        <further-classification edition="200601120260211B">G01N21/47</further-classification>
        <further-classification edition="200601120260211B">G01N21/84</further-classification>
        <further-classification edition="200601120260211B">G01B11/03</further-classification>
        <further-classification edition="201801120260211B">G06F9/44</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>本島順一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOTOJIMA, JUNICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-204137</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>測量設備、測量方法、曝光方法、曝光設備及物品製造方法</chinese-title>
        <english-title>MEASUREMENT APPARATUS, MEASUREMENT METHOD, EXPOSURE METHOD, EXPOSURE APPARATUS AND ARTICLE MANUFACTURING METHOD</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種測量方法透過用光照射測量區域並用感測器檢測來自所述測量區域的反射光來測量所述測量區域的高度位置，所述方法包括：獲得與所述測量區域中的反射率分佈有關的資訊；以及基於所述資訊，在所述測量區域中，在由所述感測器檢測到的反射光量落在預定範圍內的區域中設置測量目標位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A measurement method of measuring a height position of a measurement region by irradiating the measurement region with light and detecting reflected light from the measurement region with a sensor, the method including obtaining information concerning a distribution of reflectances in the measurement region, and setting a measurement target location in a region where the amount of reflected light detected by the sensor falls within a predetermined range in the measurement region based on the information.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.bmp" file="ed10003.bmp" height="904px" img-content="tif" inline="yes" orientation="portrait" width="770px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621998</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144442</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260226B">C02F1/02</main-classification>
        <further-classification edition="202201120260226B">F24H15/305</further-classification>
        <further-classification edition="202201120260226B">F24H15/212</further-classification>
        <further-classification edition="202201120260226B">F24H15/242</further-classification>
        <further-classification edition="202201120260226B">F24H15/14</further-classification>
        <further-classification edition="200601120260226B">B01D61/04</further-classification>
        <further-classification edition="200601120260226B">A61L2/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商野村微科學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOMURA MICRO SCIENCE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本克美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, KATSUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝佩玲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王耀華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳仕勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199908</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2025/028854</doc-number>
          <date>20250818</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>溫度控制系統、溫度控制方法、醫藥用水製造裝置的殺菌方法及二次純水製造方法</chinese-title>
        <english-title>TEMPERATURE CONTROL SYSTEM, METHOD FOR TEMPERATURE CONTROL, STERILIZATION METHOD FOR MEDICAL WATER PRODUCTION APPARATUS, AND METHOD FOR PRODUCING SECONDARY PURE WATER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">溫度控制系統包括：溫度調節器、用以將被處理水從該溫度調節器送水至後段的送水管、用以對溫度調節器供應熱媒體的熱媒體管、於熱媒體管並由上游側依序設置的第一調節閥及第二調節閥、用以檢測該送水管內的被處理水的溫度的溫度計、用以檢測熱媒體的壓力的壓力計、使用溫度計的檢測值來控制該第二調節閥的開度的溫度控制部以及使用壓力計的檢測值來控制該第一調節閥的開度的壓力控制部，其中壓力控制部在每個微小檢測時間算出由預先設定的壓力變化模式求出的壓力設定值與該壓力計的檢測值的偏差，藉由算出的偏差來控制該第一調節閥的開度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:溫度控制系統</p>
        <p type="p">10:熱交換器</p>
        <p type="p">11a:供應管</p>
        <p type="p">11b:送水管</p>
        <p type="p">12a:供應管</p>
        <p type="p">12b:排出管</p>
        <p type="p">13:第一調節閥</p>
        <p type="p">14:第二調節閥</p>
        <p type="p">15:溫度計</p>
        <p type="p">16:壓力計</p>
        <p type="p">18a:壓力控制部</p>
        <p type="p">18b:溫度控制部</p>
        <p type="p">HEX:熱交換器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="622px" img-content="tif" inline="yes" orientation="portrait" width="843px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622075</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144452</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">C07D471/04</main-classification>
        <further-classification edition="200601120251201B">C07D487/04</further-classification>
        <further-classification edition="200601120251201B">C07D498/04</further-classification>
        <further-classification edition="200601120251201B">C07D498/14</further-classification>
        <further-classification edition="200601120251201B">C07D413/10</further-classification>
        <further-classification edition="200601120251201B">C07D401/10</further-classification>
        <further-classification edition="200601120251201B">A61K31/4545</further-classification>
        <further-classification edition="200601120251201B">A61K31/519</further-classification>
        <further-classification edition="200601120251201B">A61K31/5383</further-classification>
        <further-classification edition="200601120251201B">A61K31/553</further-classification>
        <further-classification edition="200601120251201B">A61K31/5513</further-classification>
        <further-classification edition="200601120251201B">A61K31/5386</further-classification>
        <further-classification edition="200601120251201B">A61K31/454</further-classification>
        <further-classification edition="200601120251201B">A61P29/00</further-classification>
        <further-classification edition="200601120251201B">A61P37/00</further-classification>
        <further-classification edition="200601120251201B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州百新生物醫藥科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU BAICREAT PHARMA-TECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張馮敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, FENGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>顧東炎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GU, DONGYAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張思成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SICHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡嘉慧</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116324663</doc-number>
          <date>20241115</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>202510004566X</doc-number>
          <date>20250102</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025100100690</doc-number>
          <date>20250103</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2025104518836</doc-number>
          <date>20250411</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>202510584094X</doc-number>
          <date>20250507</date>
        </priority-claim>
        <priority-claim sequence="6">
          <country>中國大陸</country>
          <doc-number>2025110273677</doc-number>
          <date>20250724</date>
        </priority-claim>
        <priority-claim sequence="7">
          <country>中國大陸</country>
          <doc-number>2025112280020</doc-number>
          <date>20250829</date>
        </priority-claim>
        <priority-claim sequence="8">
          <country>中國大陸</country>
          <doc-number>2025114285264</doc-number>
          <date>20251001</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種雜環化合物及其在醫藥上的應用</chinese-title>
        <english-title>HETEROCYCLIC COMPOUNDS AND PHARMACEUTICAL USES THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及醫藥技術領域，具體涉及VAV1降解劑、其製備方法及其在醫藥上的應用。本發明提供了一種式（&lt;b&gt;I&lt;/b&gt;）或（&lt;b&gt;II&lt;/b&gt;）所述VAV1降解劑及其組合物和用途，所述化合物可以用於治療或預防VAV1介導的疾病或病症及相關疾病或病症。&lt;br/&gt;&lt;img align="absmiddle" height="168px" width="379px" file="ed10234.JPG" alt="ed10234.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to the field of pharmaceutical technology, and in particular to VAV1 degraders, methods for preparing the same, and their pharmaceutical applications. Provided herein are VAV1 degraders of Formula (I) or Formula (II), compositions comprising the same, and uses thereof. The disclosed compounds are useful for treating or preventing VAV1-mediated diseases or disorders and related diseases or disorders.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10236.JPG" file="ed10236.JPG" height="337px" img-content="tif" inline="yes" orientation="portrait" width="641px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623159</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144453</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260204B">H02M1/08</main-classification>
        <further-classification edition="200601120260204B">H02M3/156</further-classification>
        <further-classification edition="200601120260204B">H02M3/04</further-classification>
        <further-classification edition="200601120260204B">G05F1/565</further-classification>
        <further-classification edition="200601120260204B">G05F3/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卜寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BU, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林揚盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YANG-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116585697</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>功率變換電路、以及功率開關裝置的驅動電路和驅動方法</chinese-title>
        <english-title>A POWER CONVERSION CIRCUIT, AND A DRIVING CIRCUIT AND METHOD FOR DRIVING A POWER SWITCHING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
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      <isu-abst lang="tw">
        <p type="p">一種用於驅動高側功率開關裝置的高側驅動電路，包括輸入端、輸出端和供電端。該輸入端用於接收高側開關控制訊號。該耦合至高側功率開關裝置的控制端並用於提供高側驅動訊號以控制高側功率開關裝置的導通與關斷。該供電端用於從自舉電容器接收自舉電壓。該高側驅動電路被配置為：在該高側驅動電路的啟動階段或初始化階段，因應於自舉電壓變得高於第一欠壓閾值，經過延遲時間之後，輸出高側驅動訊號；以及在該高側驅動電路的穩定工作階段，因應於自舉電壓變得低於第二欠壓閾值，停止輸出高側驅動訊號。第一欠壓閾值低於第二欠壓閾值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">230:高側驅動電路</p>
        <p type="p">231:輸入端</p>
        <p type="p">232:輸出端</p>
        <p type="p">233:供電端</p>
        <p type="p">234:驅動致能電路</p>
        <p type="p">234-1:欠壓鎖定電路</p>
        <p type="p">234-2:延時電路</p>
        <p type="p">235:邏輯電路</p>
        <p type="p">236:高側驅動器</p>
        <p type="p">237:工作狀態指示電路</p>
        <p type="p">238:電壓電流基準電路</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="715px" img-content="tif" inline="yes" orientation="portrait" width="708px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622035</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114144454</doc-number>
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        <main-classification edition="200601120260202B">C07C43/225</main-classification>
        <further-classification edition="200601120260202B">C08G65/34</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>義大利商世索科專業聚合物義大利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SYENSQO SPECIALTY POLYMERS ITALY S.P.A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮塔納　席莫內塔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FONTANA, SIMONETTA ANTONELLA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹尼索夫　伊凡尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENISOV, EVGENY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格茲　瑪麗娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGAZZI, MARINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬山諾比爾　格瑞奇安諾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAZZANOBILE, GRAZIANO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24214014.3</doc-number>
          <date>20241119</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>歐洲專利局</country>
          <doc-number>24214155.4</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>氫氟醚聚合物</chinese-title>
        <english-title>HYDROFLUOROETHER POLYMERS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明關於包含(全)(鹵代)芳香族基團的新聚合物、用於其製造之方法及其衍生物，該等衍生物係用於適用於各種工業和應用的組成物的有用的添加劑。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to new polymers comprising (per)(halo)aromatic groups, to methods for their manufacture and to derivatives thereof that are useful additives for compositions suitable for several industries and applications.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無  </p>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622132</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144464</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120260302B">C08F210/18</main-classification>
        <further-classification edition="200601120260302B">C08F232/08</further-classification>
        <further-classification edition="200601120260302B">B32B27/08</further-classification>
        <further-classification edition="200601120260302B">B32B27/32</further-classification>
        <further-classification edition="200601120260302B">B29C33/68</further-classification>
        <further-classification edition="200601120260302B">B29C43/32</further-classification>
        <further-classification edition="202601120260302B">H10W74/01</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平原賢志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRAHARA, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朝比奈浩太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASAHINA, KOTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-199501</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>耐熱脫模膜</chinese-title>
        <english-title>HEAT-REASISTANT RELEASE FILM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種耐熱脫模膜，包括：基材層（a）（10）、及包含具有交聯性基的烯烴系聚合物（A）的樹脂層（b）（20）。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基材層(a)</p>
        <p type="p">20:樹脂層(b)</p>
        <p type="p">200:脫模膜</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="286px" img-content="tif" inline="yes" orientation="portrait" width="549px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622765</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114144492</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
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        <main-classification edition="201901120260102B">G06F16/182</main-classification>
        <further-classification edition="200601120260102B">G06F3/06</further-classification>
        <further-classification edition="200601120260102B">G06F9/455</further-classification>
        <further-classification edition="200601120260102B">G06F9/50</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商摩爾綫程智能科技（北京）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOORE THREADS TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>發明人放棄姓名表示權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>This inventor has agreed to waive the entitlement to designation</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116406108</doc-number>
          <date>20241115</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種適配GPU集群訓練的分布式文件系統及創建方法、電子設備和存儲媒體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及一種適配GPU集群訓練的分布式文件系統及創建方法、電子設備和存儲媒體，所述系統包括：管理模組，用於在為目標訓練任務分配目標GPU集群之後，為目標GPU集群中包括的多個第一電腦節點創建服務端、以及為目標GPU集群中包括的多個第二電腦節點創建客戶端，目標GPU集群中包括的每個電腦節點上部署有至少一個硬體GPU；服務端，用於利用對應第一電腦節點上部署的預設本地內存空間，構建適配目標訓練任務的GPU集群分布式文件系統；客戶端，用於在利用目標GPU集群執行目標訓練任務的過程中，對GPU集群分布式文件系統執行IO操作。本公開實施例可以有效滿足GPU集群訓練場景下的IO需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="911px" img-content="tif" inline="yes" orientation="portrait" width="645px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621653</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144533</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260217B">A61F2/30</main-classification>
        <further-classification edition="200601120260217B">A61L27/38</further-classification>
        <further-classification edition="200601120260217B">A61L27/56</further-classification>
        <further-classification edition="200601120260217B">A61L27/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博晟生醫股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BIOGEND THERAPEUTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳超平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHAO-PING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李伯偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, PO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許詩婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, SHIH-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/954,292</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>軟骨用植入物及其相關裝置與方法</chinese-title>
        <english-title>IMPLANTS FOR CARTILAGE AND RELATED DEVICES AND METHODS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露涉及一種可移植之植入物，其包含一生物相容性支架，該生物相容性支架在植入至一病患之軟骨中後，其係能隨時間降解；該生物相容性支架包含複數個孔洞，且複數個軟骨細胞嵌入該支架中。在某些實施例中，該植入物係具有一縱向長度，且係供植入於軟骨上形成之植入孔中；其中，該植入孔具有一植入深度，且該縱向長度之全長與該軟骨厚度之比為約3或以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a transplantable implant comprising a biocompatible scaffold configured to be degraded over time when implanted to cartilage of a patient, the biocompatible scaffold comprising a plurality of pores, and a plurality of chondrocytes incorporated into the scaffold. In some embodiments, the implant has a longitudinal length to be implanted to an implantation hole created on the cartilage, wherein the implantation hole has an implantation depth, wherein the ratio of the full longitudinal length to the thickness of the cartilage is about 3 or less.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10017.JPG" file="ed10017.JPG" height="742px" img-content="tif" inline="yes" orientation="portrait" width="925px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622197</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144583</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09G1/02</main-classification>
        <further-classification edition="200601120260302B">C09G1/06</further-classification>
        <further-classification edition="200601120260302B">C09K3/14</further-classification>
        <further-classification edition="202601120260302B">H10P52/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG SDI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李知虎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, JI HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金智惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI HYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金眞敎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIN GYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李義郞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, EUI RANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白智元</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, JI WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭雅琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, A REUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹晙豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUN, JUN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴銀碧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, EUN BI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權玟我</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, MIN A</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧健培</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOH, KUN BAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0163687</doc-number>
          <date>20241116</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於拋光圖案化鎢晶圓的CMP漿料組成物及使用其拋光圖案化鎢晶圓的方法</chinese-title>
        <english-title>CMP SLURRY COMPOSITION FOR POLISHING PATTERNED TUNGSTEN WAFER AND METHOD OF POLISHING PATTERNED TUNGSTEN WAFER USING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種CMP漿料組成物用於拋光圖案化的鎢晶圓，以及使用CMP漿料組成物拋光圖案化的鎢晶圓的方法。CMP漿料組成物包括極性溶劑和非極性溶劑中的至少一者、研磨劑、以及催化劑。催化劑包括含銅催化劑，含銅催化劑為銅陽離子和在pH在3至6範圍內具有+1或更多電荷的絡合劑的絡合物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed herein are a CMP slurry composition for polishing patterned tungsten wafers, and a method of polishing patterned tungsten wafers using the CMP slurry composition. The CMP slurry composition includes at least one of a polar solvent and a nonpolar solvent, an abrasive agent, and a catalyst. The catalyst includes a copper-containing catalyst, the copper-containing catalyst being a complex of a copper cation and a complexing agent having a charge of +1 or more at a pH in a range of 3 to 6.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621630</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144586</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251126B">A47L11/40</main-classification>
        <further-classification edition="200601120251126B">A47L11/00</further-classification>
        <further-classification edition="202401120251126B">G05D1/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢雨涵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING, YUHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116484249</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔設備的控制方法、裝置、清潔設備和可讀存儲介質</chinese-title>
        <english-title>CONTROL METHOD, APPARATUS, CLEANING EQUIPMENT, AND READABLE STORAGE MEDIUM FOR CLEANING EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種清潔設備的控制方法、裝置、清潔設備和可讀存儲介質，涉及家居控制領域。該方法包括：在清潔任務過程中，記錄清潔設備的實際移動路徑，以及模擬清潔設備在穩定沿邊狀態下移動，得到模擬移動路徑；若根據實際移動路徑和模擬移動路徑的比較判定清潔區域是否需要補充清潔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a control method, apparatus, cleaning equipment, and readable storage medium for cleaning equipment, relating to the field of home control. The method comprises: during a cleaning task, recording the actual movement path of the cleaning equipment, and simulating the movement of the cleaning equipment in a stable edge-following state to obtain a simulated movement path; determining whether the cleaning area requires supplementary cleaning based on a comparison between the actual movement path and the simulated movement path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101:步驟</p>
        <p type="p">S102:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="304px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621626</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144587</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251124B">A47L11/28</main-classification>
        <further-classification edition="200601120251124B">G05B11/16</further-classification>
        <further-classification edition="200601120251124B">G05B19/04</further-classification>
        <further-classification edition="200601120251124B">G05B19/42</further-classification>
        <further-classification edition="200601120251124B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金國軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, GUOJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張蘭蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LANLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116792574</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔設備的邊拖控制方法、裝置、清潔設備及存儲介質</chinese-title>
        <english-title>EDGE MOP CONTROL METHOD, APPARATUS, CLEANING EQUIPMENT, AND STORAGE MEDIUM FOR CLEANING EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及清潔設備技術領域，提出一種清潔設備的邊拖控制方法、裝置、清潔設備及存儲介質，清潔設備包括：清潔單元和邊拖；清潔單元與邊拖的工作均為獨立控制；方法應用於邊拖，包括：獲取清潔單元的工作狀態；響應於清潔單元的工作狀態為不工作，控制邊拖不工作；響應於清潔單元的工作狀態為工作中，確定邊拖的工作策略，根據工作策略對邊拖進行控制。將邊拖採用與清潔單元不同的獨立控制，依照清潔設備的工作狀態對邊拖進行相應的策略控制，有效解決非獨立控制邊拖使用過程中邊拖過流影響清潔單元工作的問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application pertains to the technical field of cleaning equipment and proposes an edge mop control method, apparatus, cleaning equipment, and storage medium for cleaning equipment. The cleaning equipment comprises: a cleaning unit and an edge mop. Both the cleaning unit and the edge mop are independently controlled in their operations. The method is applied to the edge mop and includes the following steps: obtaining the working status of the cleaning unit; in response to the cleaning unit being in a non-working state, controlling the edge mop not to operate; in response to the cleaning unit being in operation, determining a working strategy for the edge mop and controlling the edge mop according to the working strategy. By employing independent control for the edge mop that differs from that of the cleaning unit and implementing corresponding strategic control over the edge mop based on the working status of the cleaning equipment, the problem of excessive flow from the edge mop affecting the operation of the cleaning unit during non-independent control is effectively resolved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S210,S220,S230:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="507px" img-content="tif" inline="yes" orientation="portrait" width="688px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622673</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144588</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120251121B">G05D1/622</main-classification>
        <further-classification edition="202401120251121B">G05D1/648</further-classification>
        <further-classification edition="202401320251121B">G05D107/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116875632</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔設備的避障控制方法、裝置、清潔設備及存儲介質</chinese-title>
        <english-title>OBSTACLE AVOIDANCE CONTROL METHOD, APPARATUS, CLEANING EQUIPMENT, AND STORAGE MEDIUM FOR CLEANING EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及清潔設備技術領域，提出一種清潔設備的避障控制方法、裝置、清潔設備及存儲介質，方法包括：判斷障礙物是否為可移動障礙物；若是，控制清潔設備移動障礙物；判斷障礙物是否被成功移動。本申請提出的方法，通過對障礙物是否可移動進行判斷，對判斷為可移動障礙物的障礙物進行移動後驗證障礙物是否被成功移動，從而有效解決可移動障礙物區域的行走遺漏問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application pertains to the technical field of cleaning equipment and proposes an obstacle avoidance control method, apparatus, cleaning equipment, and storage medium for cleaning equipment. The method comprises the following steps: determining whether an obstacle is a movable obstacle; if so, controlling the cleaning equipment to move the obstacle; and determining whether the obstacle has been successfully moved. The method proposed in this application effectively addresses the issue of walking omissions in areas with movable obstacles by judging whether an obstacle is movable and then verifying whether the obstacle has been successfully moved after moving the obstacle determined to be movable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S110、S120、S130:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="376px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621875</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144589</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251124B">B25J18/00</main-classification>
        <further-classification edition="200601120251124B">B25J17/00</further-classification>
        <further-classification edition="200601120251124B">A47L11/40</further-classification>
        <further-classification edition="200601120251124B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖智成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, ZHICHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾令星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, LINGXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范紅城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, HONGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄育忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116985929</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024228823865</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>連接臂、機械臂和清潔設備</chinese-title>
        <english-title>CONNECTING ARM, ROBOTIC ARM, AND CLEANING EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種連接臂、機械臂和清潔設備。其中，機械臂包括關節臂、以及與關節臂相對應並連接的機械關節，連接臂包括：臂主體和連接部，兩個連接部分別位於臂主體的兩端，兩個連接部配置為分別與一個機械關節連接，機械關節配置為使連接臂和相對應的關節臂可相互折疊或展開；其中，連接部配置為容納在相對應的關節臂設置的容納空間內，並可在容納空間內運動。由此，相對應的連接部和關節臂能夠較為貼合的設置，連接臂相對於關節臂展開或折疊後，均可容納在關節臂的容納空間內，滿足機械臂結構緊湊、體積較小的設計需求。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a connecting arm, a robotic arm, and a cleaning equipment. The robotic arm comprises joint arms and mechanical joints that correspond to and are connected with the joint arms. The connecting arm includes an arm body and two connecting portions. The two connecting portions are respectively located at both ends of the arm body, and are configured to be connected to one mechanical joint each. The mechanical joints are configured to enable the connecting arm and the corresponding joint arms to be folded or unfolded relative to each other. Among them, the connecting portions are configured to be accommodated within the accommodation spaces provided in the corresponding joint arms and can move within these accommodation spaces. As a result, the corresponding connecting portions and joint arms can be arranged in a relatively close-fitting manner. After the connecting arm is unfolded or folded relative to the joint arms, it can be accommodated within the accommodation spaces of the joint arms, meeting the design requirements for a compact structure and small size of the robotic arm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:連接臂</p>
        <p type="p">110:臂主體</p>
        <p type="p">111:底座</p>
        <p type="p">112:蓋板</p>
        <p type="p">113:過線孔</p>
        <p type="p">120:連接部</p>
        <p type="p">121:限位孔</p>
        <p type="p">122:第一夾持部</p>
        <p type="p">123:第二夾持部</p>
        <p type="p">130:鎖緊件</p>
        <p type="p">150:連接線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="389px" img-content="tif" inline="yes" orientation="portrait" width="758px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622676</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144590</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120260123B">G05D1/648</main-classification>
        <further-classification edition="202401120260123B">G05D1/644</further-classification>
        <further-classification edition="202401120260123B">G05D1/633</further-classification>
        <further-classification edition="202401120260123B">G05D1/43</further-classification>
        <further-classification edition="202401120260123B">G05D1/246</further-classification>
        <further-classification edition="202401120260123B">G05D1/243</further-classification>
        <further-classification edition="202401320260123B">G05D105/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張蘭蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LANLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116776444</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔機器人的控制方法和裝置、清潔機器人及存儲介質</chinese-title>
        <english-title>CONTROL METHOD AND DEVICE FOR CLEANING ROBOT, CLEANING ROBOT, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種清潔機器人的控制方法和裝置、清潔機器人及存儲介質，涉及智慧清潔技術領域。該方法在清潔機器人沿障礙物運動的過程中，實時獲取位於清潔機器人側部的訊息數據；基於訊息數據對清潔機器人執行相應的控制策略。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a control method and device for a cleaning robot, a cleaning robot, and a storage medium, which pertain to the field of intelligent cleaning technology. During the process where the cleaning robot moves along obstacles, this method obtains real-time information data located on the side of the cleaning robot. Based on this information data, corresponding control strategies are implemented for the cleaning robot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="296px" img-content="tif" inline="yes" orientation="portrait" width="704px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622669</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144595</doc-number>
          <kind></kind>
          <date>114/11/14</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120251229B">G05D1/43</main-classification>
        <further-classification edition="202401120251229B">G05D1/242</further-classification>
        <further-classification edition="202401120251229B">G05D1/622</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭孟秋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, MENGQIU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116877178</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔設備避障方法、裝置、清潔設備和可讀存儲介質</chinese-title>
        <english-title>OBSTACLE AVOIDANCE METHOD, APPARATUS, CLEANING EQUIPMENT, AND READABLE STORAGE MEDIUM FOR CLEANING EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種清潔設備避障方法、裝置、清潔設備和可讀存儲介質，涉及智慧家居領域。清潔設備包括結構光模組和雷射雷達，該方法包括：通過結構光模組獲取第一點雲數據，以及通過雷射雷達獲取第二點雲數據；基於第一點雲數據標記結構光模組對應的第一地圖，以及基於第二點雲數據標記雷射雷達對應的第二地圖；對第一地圖和第二地圖進行障礙物識別，得到障礙物識別結果，並根據障礙物識別結果控制清潔設備的移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides a method, apparatus, cleaning equipment, and a readable storage medium for obstacle avoidance in cleaning equipment, which pertains to the field of smart home. The cleaning equipment comprises a structured light module and a LiDAR (Light Detection and Ranging). The method includes: acquiring first point cloud data through the structured light module and acquiring second point cloud data through the LiDAR; marking a first map corresponding to the structured light module based on the first point cloud data and marking a second map corresponding to the LiDAR based on the second point cloud data; performing obstacle recognition on the first map and the second map to obtain obstacle recognition results, and controlling the movement of the cleaning equipment according to the obstacle recognition results.</p>
      </isu-abst>
      <representative-img>
        <p type="p">101~103:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="358px" img-content="tif" inline="yes" orientation="portrait" width="681px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621706</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144600</doc-number>
          <kind></kind>
          <date>113/10/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/713</main-classification>
        <further-classification edition="201001120260302B">C12N15/113</further-classification>
        <further-classification edition="201701120260302B">A61K47/54</further-classification>
        <further-classification edition="200601120260302B">A61P9/00</further-classification>
        <further-classification edition="200601120260302B">A61P3/06</further-classification>
        <further-classification edition="200601120260302B">A61P9/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州天龍藥業有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU TIANLONG PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宋更申</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SONG, GENGSHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃澤傲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, ZEAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SHUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田志康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TIAN, ZHIKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳玉成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YUCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, PENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余曉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, XIAOWEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, DAWEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>龐雪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANG, XUE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, FANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彥慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林宗武</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2023114633757</doc-number>
          <date>20231106</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>靶向調控PCSK9基因表達的siRNA及其應用</chinese-title>
        <english-title>SIRNA TARGETING AND REGULATING PCSK9 GENE EXPRESSION AND USE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及靶向調控PCSK9基因表達的siRNA及其應用。實驗結果顯示，一些交替修飾和特定模板修飾的寡核苷酸序列，能夠顯著抑制PCSK9表達，可用於開發治療PCSK9相關疾病的藥物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to siRNAs that target and regulate PCSK9 gene expression and use thereof. Experimental results show that some alternately modified and specific template-modified oligonucleotide sequences can significantly inhibit PCSK9 expression and can be used to develop drugs to treat PCSK9-related diseases.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10065.JPG" file="ed10065.JPG" height="491px" img-content="tif" inline="yes" orientation="portrait" width="601px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623410</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144624</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D62/10</main-classification>
        <further-classification edition="202501120260302B">H10D64/20</further-classification>
        <further-classification edition="202601120260302B">H10W10/10</further-classification>
        <further-classification edition="202601120260302B">H10W76/05</further-classification>
        <further-classification edition="200601120260302B">C23C16/52</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿格拉瓦爾　尼迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AGRAWAL, NIDHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡納戈　安東尼　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAGO, ANTHONY JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高俊洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KO, JUNG SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,108</doc-number>
          <date>20241120</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/170,056</doc-number>
          <date>20250403</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體的電晶體、其製造方法及製造系統</chinese-title>
        <english-title>TRANSISTOR OF MEMORY, METHOD OF FABRICATION THEREOF, AND FABRICATION SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供記憶體的電晶體、其製造方法及製造系統。在一個或多個實例中，方法包括形成電晶體的第一絕緣體、第二絕緣體和半導體通道；在第一絕緣體的表面、第二絕緣體的表面或半導體通道的表面中的至少一個上方形成介電層；在介電層上方形成第一金屬層；在第一金屬層上方形成第二金屬層；移除第一金屬層的第一部分和第二金屬層的部分；以及基於移除第一金屬層的第二部分在第二金屬層和介電層之間形成至少一個凹槽。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are a transistor of a memory cell, a method of fabrication thereof, and a fabrication system. In one or more examples, the method includes forming a first insulator, a second insulator, and a semiconductor channel of the transistor; forming a dielectric layer over at least one of a surface of the first insulator, a surface of the second insulator, or a surface of the semiconductor channel; forming a first metal layer over the dielectric layer; forming a second metal layer over the first metal layer; removing a first portion of the first metal layer and a portion of the second metal layer; and forming at least one recess between the second metal layer and the dielectric layer based on removing a second portion of the first metal layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">900:方法</p>
        <p type="p">905,910,915,920:操作</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="778px" img-content="tif" inline="yes" orientation="portrait" width="636px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623693</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144663</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/00</main-classification>
        <further-classification edition="202601120260302B">H10W70/40</further-classification>
        <further-classification edition="202501120260302B">H10D84/83</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商萬國半導體國際有限合夥公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>薛　彥迅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XUE, YANXUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　燮光</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUI, SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>博德　馬督兒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOBDE, MADHUR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　隆慶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LONG-CHING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牛　志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIU, ZHIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>溫　淳雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEN, CHUNYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黎冠宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, KUAN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂琳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LV, LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴國榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/958,514</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有垂直堆疊晶體管的半導體封裝及其製造方法</chinese-title>
        <english-title>SEMICONDUCTOR PACKAGE HAVING VERTICALLY STACKED TRANSISTORS AND METHOD OF MAKING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種半導體封裝，包括一個引線框架、一個垂直堆疊的場效電晶體(FET)組、一個源極夾、一個閘極夾和一個模塑封裝。垂直堆疊的FET組包括第一FET和第二FET。第一FET是翻轉的。一種方法包括以下步驟：提供引線框架；安裝垂直堆疊的FET組，安裝夾片，形成模塑封裝；以及進行切割工藝。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor package comprising a lead frame, a vertically stacked field-effect transistor (FET) set, a source clip, a gate clip, and a molding encapsulation. The vertically stacked FET set comprises a first FET, and a second FET. The first FET is flipped. A method comprising the steps of providing a lead frame; attaching a vertically stacked FET set, attaching clip(s), forming a molding encapsulation; and applying a singulation process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體封裝</p>
        <p type="p">120:模制封裝體</p>
        <p type="p">128:第二閘極焊盤</p>
        <p type="p">160:源極夾</p>
        <p type="p">170:閘極夾</p>
        <p type="p">190:模塑封裝</p>
        <p type="p">250:垂直堆疊FET組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="448px" img-content="tif" inline="yes" orientation="portrait" width="671px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622619</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144682</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">G02F1/137</main-classification>
        <further-classification edition="200601120251201B">G02F1/133</further-classification>
        <further-classification edition="200601120251201B">G09G3/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴廷祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAI, TING YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊武璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WU CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,554</doc-number>
          <date>20241117</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>液晶顯示裝置及其驅動方法</chinese-title>
        <english-title>LIQUID CRYSTAL DISPLAY DEVICE AND DRIVING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種液晶顯示裝置，其包含一顯示面板、一時序控制模組以及複數驅動模組。顯示面板包含複數顯示區塊。時序控制模組用以同時產生複數時序控制訊號。此些驅動模組連接於時序控制模組與顯示面板之間，並分別接收此些時序控制訊號。其中此些驅動模組中的至少一者根據此些時序控制訊號中的至少一者輸出複數掃描訊號組至此些顯示區塊。其中此些驅動模組根據此些時序控制訊號分別輸出複數資料訊號組至此些顯示區塊，使此些顯示區塊受此些掃描訊號組及此些資料訊號組驅動以顯示一影像。藉此，可達到成像時間短之效果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A liquid crystal display device is proposed, and includes a display panel, a timing control module, and a plurality of driving modules. The display panel includes a plurality of display blocks. The timing control module is configured to simultaneously generate a plurality of timing control signals. The driving modules are connected between the timing control module and the display panel, and receive the timing control signals, respectively. At least one of the driving modules outputs a plurality of scan signal groups to the display blocks according to at least one of the timing control signals. The driving modules respectively output a plurality of data signal groups to the display blocks according to the timing control signals, causing the display blocks to be driven by the scan signal groups and the data signal groups to display an image. Therefore, the short imaging time can be achieved.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:液晶顯示裝置</p>
        <p type="p">110:顯示面板</p>
        <p type="p">120:時序控制模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="731px" img-content="tif" inline="yes" orientation="portrait" width="853px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622566</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144684</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260218B">G02B6/40</main-classification>
        <further-classification edition="200601120260218B">G02B6/36</further-classification>
        <further-classification edition="200601120260218B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧研發公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING RESEARCH &amp; DEVELOPMENT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格里吉爾　提姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GRYGIEL, TIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪蒂斯　安德瑞亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATISS, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史提克　安</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STIEKEL, ANNE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>泰來克　巴爾托斯亞當</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYLAK, BARTOSZ ADAM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
              <english-address>PL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,280</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學連接系統及方法</chinese-title>
        <english-title>OPTICAL CONNECTION SYSTEMS AND METHODS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種可拆卸光學連接系統包括一光纖陣列單元（FAU）總成、具有一波導之一波導晶片及複數個接腳。該FAU總成可經由該複數個接腳可移除地耦接至該波導晶片，且該FAU總成與該波導對準以用於光學通信。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A detachable optical connection system includes a fiber array unit (FAU) assembly, a waveguide chip with a waveguide, and a plurality of pins. The FAU assembly is removably coupled couplable to the waveguide chip by via the plurality of pins and the FAU assembly is aligned with the waveguide for optical communication.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:可拆卸光學連接系統</p>
        <p type="p">200:FAU總成</p>
        <p type="p">210:FAU基座</p>
        <p type="p">211:基座主體</p>
        <p type="p">211a:上部表面</p>
        <p type="p">211a-1:第一部分</p>
        <p type="p">211a-2:第二部分</p>
        <p type="p">211b:耦接端</p>
        <p type="p">212:接腳接納凹槽</p>
        <p type="p">213:光纖凹槽</p>
        <p type="p">220:蓋</p>
        <p type="p">220a,302b:頂部表面</p>
        <p type="p">240:環氧樹脂</p>
        <p type="p">300:波導晶片</p>
        <p type="p">302:主體</p>
        <p type="p">302a:接合表面</p>
        <p type="p">302c:底部表面</p>
        <p type="p">304:波導</p>
        <p type="p">306:凹槽</p>
        <p type="p">400:接腳</p>
        <p type="p">402a:第一端</p>
        <p type="p">402b:第二端</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10031.JPG" file="ed10031.JPG" height="583px" img-content="tif" inline="yes" orientation="portrait" width="793px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621621</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144699</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260121B">A47L11/24</main-classification>
        <further-classification edition="200601120260121B">A47L11/40</further-classification>
        <further-classification edition="200601120260121B">G01S17/08</further-classification>
        <further-classification edition="200601120260121B">G01S7/497</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116556181</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>移動機器人狀態檢測方法、裝置、移動機器人及設備</chinese-title>
        <english-title>STATE DETECTION METHOD AND APPARATUS FOR MOBILE ROBOT, MOBILE ROBOT, AND DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種移動機器人狀態檢測方法、裝置、移動機器人及設備。移動機器人包括機身以及可升降設置於機身頂端的鐳射測距元件，移動機器人狀態檢測方法包括：在切換鐳射測距元件的升降狀態的過程中，控制鐳射測距元件採集點雲資料；確定所述點雲資料的特徵；根據點雲資料的特徵，判斷鐳射測距元件的升降狀態。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a state detection method and apparatus for a mobile robot, the mobile robot, and a device. The mobile robot includes a body and a laser distance component liftably disposed on top of the body. The state detection method for the mobile robot comprises: during the process of switching the lifting state of the laser ranging component, controlling the laser distance component to collect point cloud data; determining features of the point cloud data; and judging the lifting state of the laser distance component based on the features of the point cloud data.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S201、S202、S203:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="243px" img-content="tif" inline="yes" orientation="portrait" width="692px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621631</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144700</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">A47L11/40</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯崢韜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, ZHENGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王澤君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZEJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411654576X</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔機器人的控制方法及裝置、清潔機器人</chinese-title>
        <english-title>CONTROL METHOD AND APPARATUS OF CLEANING ROBOT, AND CLEANING ROBOT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種清潔機器人的控制方法及裝置、清潔機器人。在該方法中，響應於清潔機器人的機身上殼的第一測距組件與第一障礙物發生碰撞，且機身未與第一障礙物發生碰撞，控制所述清潔機器人解除第一測距組件與第一障礙物的碰撞，並將第一測距組件下降後控制清潔機器人繼續行進。本公開可以增強清潔機器人的覆蓋能力，而且可以減少對清潔機器人的錯誤控制，從而有益於提高清潔機器的整體性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a control method and a control apparatus of a cleaning robot, and a cleaning robot. In this method, in response to a collision between a first ranging component in an upper housing of the cleaning robot and a first obstacle while a robot body does not collide with the first obstacle, the cleaning robot is controlled to release the collision between the first ranging component and the first obstacle, lower the first ranging component, and continue movement of the robot. The present disclosure may enhance the coverage capability of the cleaning robot, reduce erroneous control of the cleaning robot, and thus improve the overall performance of cleaning machines.</p>
      </isu-abst>
      <representative-img>
        <p type="p">401、402、403、404:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="300px" img-content="tif" inline="yes" orientation="portrait" width="426px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622536</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144701</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">G01S17/08</main-classification>
        <further-classification edition="200601120260102B">G01S7/497</further-classification>
        <further-classification edition="200601120260102B">G01S7/481</further-classification>
        <further-classification edition="202401120260102B">G05D1/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯崢韜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, ZHENGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王澤君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZEJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116490216</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>異常檢測方法、裝置、移動機器人及儲存媒介</chinese-title>
        <english-title>ANOMALY DETECTION METHOD, DEVICE, MOBILE ROBOT, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種異常檢測方法、裝置、移動機器人及儲存媒介，其中，所述方法包括：藉由移動機器人控制第一測距器件進行測距，得到多個測距資料，藉由移動機器人根據測距資料是否為空，或者，根據測距資料中低於第一預設值的測距資料佔比是否超過預設閾值，確定第一測距器件的測距是否異常，測距資料為第一測距器件在移動機器人運動時獲取的資料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides an anomaly detection method, device, mobile robot, and storage medium. The method comprises: controlling, by the mobile robot, a first ranging device to perform ranging to obtain a plurality of ranging data; and determining, by the mobile robot, whether the ranging of the first ranging device is abnormal based on whether the ranging data is empty or based on whether the proportion of ranging data lower than a first preset value in the ranging data exceeds a preset threshold, wherein the ranging data is acquired by the first ranging device while the mobile robot is in motion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="302px" img-content="tif" inline="yes" orientation="portrait" width="747px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621622</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144713</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260211B">A47L11/24</main-classification>
        <further-classification edition="202401120260211B">G05D1/648</further-classification>
        <further-classification edition="200601120260211B">A47L11/40</further-classification>
        <further-classification edition="200601120260211B">G05B19/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, HAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>關鑫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GUAN, XIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116523101</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔機器人的控制方法及裝置、清潔機器人</chinese-title>
        <english-title>CONTROL METHOD AND APPARATUS FOR CLEANING ROBOT, AND CLEANING ROBOT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提供了一種清潔機器人的控制方法及裝置、清潔機器人。其中，在該方法中，在所述清潔機器人的行進路徑上存在第一區域的情況下，控制所述清潔機器人繞開所述第一區域行進或進入所述第一區域；其中，在所述第一區域中存在至少三個障礙物並且存在至少一個第一空隙，所述第一空隙是指相鄰障礙物之間的距離小於或等於所述清潔機器人的機身寬度的空隙。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a control method and apparatus for a cleaning robot, and the cleaning robot. In the method, when a first area exists on a traveling path of the cleaning robot, the cleaning robot is controlled to bypass the first area or enter the first area; wherein, at least three obstacles exist and at least one first gap exists in the first area, the first gap referring to a gap where the distance between adjacent obstacles is less than or equal to the body width of the cleaning robot.</p>
      </isu-abst>
      <representative-img>
        <p type="p">401:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="169px" img-content="tif" inline="yes" orientation="portrait" width="621px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622176</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144719</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260204B">C08L63/10</main-classification>
        <further-classification edition="200601120260204B">C08G77/38</further-classification>
        <further-classification edition="200601120260204B">C08G65/32</further-classification>
        <further-classification edition="200601120260204B">C08L83/12</further-classification>
        <further-classification edition="200601120260204B">C08F2/06</further-classification>
        <further-classification edition="200601120260204B">B01J23/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商陶氏東麗股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DOW TORAY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>早田達央</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SOUDA, TATSUO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤（大淵）萌萌子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO OFUCHI, MOMOKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山下聡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMASHITA, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷口裕子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIGUCHI, HIROKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>談立易</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, LIYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>堀誠司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORI, SEIJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-201704</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>共改質聚矽氧</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]本發明提供一種新型之共改質聚矽氧等。  &lt;br/&gt;[解決手段]一種共改質聚矽氧，其於分子內含有式(1)所表示之含烷氧基之結構以及聚醚結構，且25℃下之黏度為400至100,000 mPa•s之範圍。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623178</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144734</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">H02M7/66</main-classification>
        <further-classification edition="200701120260202B">H02M1/44</further-classification>
        <further-classification edition="200701120260202B">H02M1/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈里亞尼　妮蒂</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARYANI, NIDHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>ＮＡ　阿努普</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, ANUP ANURAG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張弛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
              <english-address>BR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/950,576</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多電平雙向AC-DC轉換器及其調變方法</chinese-title>
        <english-title>MULTI-LEVEL BIDIRECTIONAL AC-DC CONVERTERS AND MODULATION METHODS THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種多電平雙向AC-DC轉換器，包含第一電感、諧振支路以及至少兩組開關，諧振支路包含第二電感及第一電容，至少兩組開關形成支路，至少兩組開關耦接於第一電感及諧振支路，至少兩組開關耦接於至少一電路組件。一方面，多電平雙向AC-DC轉換器為N電平飛跨電容多電平轉換器，其中N大於或等於3。本案還提供一種適用於多電平雙向AC-DC轉換器的調變方法，包含利用集成三角-梯形傳導調變來調變電感電流。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-level, bi-directional AC-DC converter is provided with including a first inductor, a resonant branch having a second inductor and a first capacitor, and at least two pairs of switches arranged in a branch and coupled to the first inductor and the resonant branch, wherein the at least two pairs of switches are coupled to at least one circuit component. In one aspect, the multi-level converter is configured as an N-level, flying capacitor, multi-level converter, wherein N is greater than or equal to 3. A modulation method adapted for the multi-level, bi-directional AC-DC converter and including modulating the inductor current by using integrated triangular plus trapezoidal conduction modulation is also provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">41:電感</p>
        <p type="p">42:FCML PFC轉換器</p>
        <p type="p">AC:電源</p>
        <p type="p">i&lt;sub&gt;b&lt;/sub&gt;、i&lt;sub&gt;Lg&lt;/sub&gt;:電流</p>
        <p type="p">L&lt;sub&gt;g&lt;/sub&gt;:升壓電感</p>
        <p type="p">S&lt;sub&gt;1&lt;/sub&gt;、&lt;i&gt;S&lt;/i&gt;&lt;sub&gt;1&lt;/sub&gt;、S&lt;sub&gt;2&lt;/sub&gt;、&lt;i&gt;S&lt;/i&gt;&lt;sub&gt;2&lt;/sub&gt;:開關</p>
        <p type="p">45:電路組件</p>
        <p type="p">43:LC諧振支路</p>
        <p type="p">L&lt;sub&gt;b&lt;/sub&gt;:諧振電感</p>
        <p type="p">C&lt;sub&gt;b&lt;/sub&gt;:電容</p>
        <p type="p">S&lt;sub&gt;N1&lt;/sub&gt;、S&lt;sub&gt;N2&lt;/sub&gt;:開關二極體</p>
        <p type="p">C&lt;sub&gt;dc&lt;/sub&gt;:電容</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.png" file="d10009.TIF" giffile="ed10009.png" height="608px" img-content="tif" inline="yes" orientation="portrait" width="845px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623636</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144738</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W20/48</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立大學法人東京科學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INSTITUTE OF SCIENCE TOKYO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大場隆之</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OHBA, TAKAYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-200923</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置及半導體裝置之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">半導體裝置具備:第1基板,具有彼此相對的第1表面和第2表面;第1半導體晶片,具有第1功能區域,並配置在設置於所述第1表面或所述第2表面的第1凹部內;第2基板,當從所述第1基板的厚度方向觀察時設置有與所述第1功能區域重疊的第2功能區域,並具有彼此相對的第3表面和第4表面,所述第3表面和所述第2表面接合;及第1配線,從所述第1表面電連接至所述第2功能區域,不穿過所述第1半導體晶片,而是穿過所述第1基板的所述第1凹部之外的第1部分｡</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10,20:基板</p>
        <p type="p">11,21:凹部</p>
        <p type="p">12,18,22,28,28A,28B,28C:絕緣層</p>
        <p type="p">14,24A,24B:半導體晶片</p>
        <p type="p">15,25A,25B:功能區域</p>
        <p type="p">17,27A,27B,29:接合層</p>
        <p type="p">30,31,32,33,34,35:配線</p>
        <p type="p">38:端子</p>
        <p type="p">45:第1層</p>
        <p type="p">46:第2層</p>
        <p type="p">47:部分</p>
        <p type="p">51:第1表面</p>
        <p type="p">52:第2表面</p>
        <p type="p">53:第3表面</p>
        <p type="p">54:第4表面</p>
        <p type="p">100:半導體裝置</p>
        <p type="p">D1:寬度</p>
        <p type="p">D2,D3:距離</p>
        <p type="p">D4:深度</p>
        <p type="p">D5:厚度</p>
        <p type="p">S1:晶片尺寸</p>
        <p type="p">X,Y,Z:方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10026.JPG" file="ed10026.JPG" height="790px" img-content="tif" inline="yes" orientation="portrait" width="697px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622178</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144753</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">C08L67/02</main-classification>
        <further-classification edition="200601120251201B">C08K7/02</further-classification>
        <further-classification edition="200601120251201B">C08K9/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商矢崎總業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAZAKI CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金岡佳充</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANAOKA, YOSHIMITSU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柴山多江子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIBAYAMA, TAEKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秋山三帆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKIYAMA, MIHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪武雄</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳昭誠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-200930</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-134060</doc-number>
          <date>20250812</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>複合材料</chinese-title>
        <english-title>COMPOSITE MATERIAL</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之複合材料(1)係具備基質樹脂(2)、以及分散於基質樹脂內部之玻璃纖維(3)及矽灰石(4)。基質樹脂係PBT樹脂、PP樹脂或PA樹脂。複合材料係分別含有1重量%以上的玻璃纖維及矽灰石，將複合材料中之玻璃纖維的含量設為a重量%，矽灰石的含量設為b重量%，並將基質樹脂的含量設為100-a-b重量%時，滿足式1至7之關係。  &lt;br/&gt;式1：a≥-0.5000b+27.5000(1≤b≤10)  &lt;br/&gt;式2：a≥0.0000b+22.5000(10＜b≤15)  &lt;br/&gt;式3：a≥-0.3613b+27.9194(15＜b≤30.5)  &lt;br/&gt;式4：a≥-0.0571b+18.6429(30.5＜b≤34)  &lt;br/&gt;式5：a≥0.1429b+11.8429(34＜b≤37.5)  &lt;br/&gt;式6：a≤-0.7413b+45.0000(1≤b＜37.5)  &lt;br/&gt;式7：a＞-3.6543b+30.0000(b＞0)</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The composite material (1) of the present invention includes a matrix resin (2), and glass fibers (3) and wollastonite (4) dispersed within the matrix resin. The matrix resin is PBT resin, PP resin, or PA resin. The composite material contains 1 wt% or more of glass fibers and wollastonite, respectively. Letting the content of glass fibers in the composite material is denoted as a wt%, the content of wollastonite as b wt%, and the content of the matrix resin as 100-a-b wt%, the composite material satisfies the relationships defined by Formulas 1 to 7. &lt;br/&gt;Formula1：a≥-0.5000b+27.5000(1≤b≤10) &lt;br/&gt;Formula2：a≥0.0000b+22.5000(10＜b≤15) &lt;br/&gt;Formula3：a≥-0.3613b+27.9194(15＜b≤30.5) &lt;br/&gt;Formula4：a≥-0.0571b+18.6429(30.5＜b≤34) &lt;br/&gt;Formula5：a≥0.1429b+11.8429(34＜b≤37.5) &lt;br/&gt;Formula6：a≤-0.7413b+45.0000(1≤b＜37.5) &lt;br/&gt;Formula7：a＞-3.6543b+30.0000(b＞0)</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:複合材料</p>
        <p type="p">2:基質樹脂</p>
        <p type="p">3:玻璃纖維</p>
        <p type="p">4:矽灰石</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="706px" img-content="tif" inline="yes" orientation="portrait" width="596px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623572</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144754</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/10</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="202601120260302B">H10W40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋鑫鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, XIN FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>耿丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GENG, DAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊來寶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, LAI BAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閆志順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, ZHI SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曹景陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, JING YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116898757</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>承載舟及半導體製程設備</chinese-title>
        <english-title>CARRIER BOAT AND SEMICONDUCTOR PROCESSING EQUIPMENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種承載舟及半導體製程設備，涉及光伏、半導體領域。一種承載舟，包括：支撐組件和多個加熱板；所述多個加熱板層疊設置於所述支撐組件，且相鄰兩個所述加熱板之間具有容納空間；所述多個加熱板包括至少一個射頻電極板和至少一個接地電極板，所述射頻電極板與所述接地電極板交替設置。本發明至少能夠解決預熱時間長、預熱不均勻等問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a carrier boat and semiconductor processing equipment, relating to the fields of photovoltaics and semiconductors. The carrier boat comprises: a support component and a plurality of heating plates; the plurality of heating plates are stacked on the support component, and a receiving space is formed between each pair of adjacent heating plates; the plurality of heating plates include at least one radio frequency (RF) electrode plate and at least one grounding electrode plate, with the RF electrode plates and grounding electrode plates arranged alternately. The present invention can at least solve problems such as long preheating times and uneven preheating.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:承載舟</p>
        <p type="p">11:支撐組件</p>
        <p type="p">12:加熱板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="306px" img-content="tif" inline="yes" orientation="portrait" width="488px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623582</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144757</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/30</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
        <further-classification edition="200601120260302B">C23C16/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭慧娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HUI NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈士亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, SHI LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閆志順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, ZHI SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116897078</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體製程設備</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種半導體製程設備，包括腔室模組、傳輸裝置和控制器，腔室模組包括多個製程腔室，多個製程腔室包括第一製程腔室、第二製程腔室、第三製程腔室以及第四製程腔室，且腔室模組包括多個堆疊式腔室結構，其中一個堆疊式腔室結構包括第一製程腔室或第四製程腔室，另一個堆疊式腔室結構包括第二製程腔室或第三製程腔室，控制器控制半導體製程設備執行如下步驟：在第一製程腔室中晶片的正面進行第一本征非晶矽薄膜層沉積；在第二製程腔室中晶片的背面進行第二本征非晶矽薄膜層的沉積；在第三製程腔室中第二本征非晶矽薄膜層上進行N型晶矽或非晶矽薄膜層的沉積；在第四製程腔室中第一本征非晶矽薄膜層上進行P型晶矽或非晶矽薄膜層的沉積。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a semiconductor processing apparatus, comprising a chamber module, a transfer device, and a controller. The chamber module includes a plurality of process chambers, wherein the plurality of process chambers comprise a first process chamber, a second process chamber, a third process chamber, and a fourth process chamber. The chamber module further includes a plurality of stacked chamber structures, wherein one of the stacked chamber structures comprises the first process chamber or the fourth process chamber, and another stacked chamber structure comprises the second process chamber or the third process chamber. The controller is configured to control the semiconductor processing apparatus to perform the following steps: depositing a first intrinsic amorphous silicon thin film layer on the front side of a wafer in the first process chamber; depositing a second intrinsic amorphous silicon thin film layer on the back side of the wafer in the second process chamber; depositing an N-type crystalline silicon or amorphous silicon thin film layer on the second intrinsic amorphous silicon thin film layer in the third process chamber; and depositing a P-type crystalline silicon or amorphous silicon thin film layer on the first intrinsic amorphous silicon thin film layer in the fourth process chamber.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:腔室模組</p>
        <p type="p">101:第一製程腔室</p>
        <p type="p">102:第二製程腔室</p>
        <p type="p">103:第三製程腔室</p>
        <p type="p">104:第四製程腔室</p>
        <p type="p">105:堆疊式支架</p>
        <p type="p">201:第一晶片機械手</p>
        <p type="p">202:第二晶片機械手</p>
        <p type="p">203:第一載片板暫存裝置</p>
        <p type="p">204:第二載片板暫存裝置</p>
        <p type="p">205:第一載片板機械手</p>
        <p type="p">206:第二載片板機械手</p>
        <p type="p">250:翻面暫存裝置</p>
        <p type="p">260:花籃上下料裝置</p>
        <p type="p">300:運輸車</p>
        <p type="p">400:保護艙室</p>
        <p type="p">401:第一載片板傳輸口</p>
        <p type="p">402:第二載片板傳輸口</p>
        <p type="p">403:晶片傳輸口</p>
        <p type="p">410:第一子艙室</p>
        <p type="p">420:第二子艙室</p>
        <p type="p">430:第一密封門</p>
        <p type="p">440:第二密封門</p>
        <p type="p">450:第三子艙室</p>
        <p type="p">1051:腔室容納空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="536px" img-content="tif" inline="yes" orientation="portrait" width="630px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622659</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144758</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G05B19/418</main-classification>
        <further-classification edition="200601120260302B">B25J9/18</further-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張洪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, HONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭慧娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HUI NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閆志順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, ZHI SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈士亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, SHI LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭建宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JIAN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116898028</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>傳輸裝置的控制方法</chinese-title>
        <english-title>CONTROL METHOD FOR TRANSMISSION DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種傳輸裝置的控制方法，傳輸裝置包括晶片機械手、載片板暫存裝置和載片板；晶片機械手包括N個間隔分佈的第一機械手指；載片板暫存裝置用於承載成組的載片板，每組載片板包括M個在載片板暫存裝置承載方向上間隔分佈的載片板，每個載片板設有晶片槽；在每組載片板中，任意兩個載片板上的晶片槽一一相對，以使相鄰的N個載片板上相對的晶片槽構成槽組；M和N均大於或等於2，且M大於或等於N，M與N的比值為大於或等於1的正整數，控制方法包括：控制晶片機械手的N個第一機械手指抓取N片晶片；控制抓取晶片後的晶片機械手朝向載片板暫存裝置；控制晶片機械手將其抓取的N片晶片成組地放置在載片板暫存裝置對應的槽組中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a control method for a transmission device. The transmission device comprises a wafer manipulator, a carrier plate buffer device, and carrier plates. The wafer manipulator includes N first manipulator fingers spaced apart from each other. The carrier plate buffer device is used to carry groups of carrier plates, each group comprising M carrier plates spaced apart in the carrying direction of the carrier plate buffer device, with each carrier plate being provided with wafer slots. In each group of carrier plates, the wafer slots on any two carrier plates are correspondingly aligned, so that the corresponding wafer slots on N adjacent carrier plates form a slot group. Both M and N are greater than or equal to 2, and M is greater than or equal to N, with the ratio of M to N being a positive integer greater than or equal to 1. The control method comprises: controlling the N first manipulator fingers of the wafer manipulator to pick up N wafers; controlling the wafer manipulator, after picking up the wafers, to move towards the carrier plate buffer device; and controlling the wafer manipulator to place the N wafers it has picked up as a group into the corresponding slot group of the carrier plate buffer device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">201:第一晶片機械手</p>
        <p type="p">203:第一載片板暫存裝置</p>
        <p type="p">221:第二架體</p>
        <p type="p">222:第二支撐塊</p>
        <p type="p">223:第一底座</p>
        <p type="p">224:第一轉軸</p>
        <p type="p">242:六軸工業機器人</p>
        <p type="p">243:基座</p>
        <p type="p">260:花籃上下料裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.JPG" file="ed10018.JPG" height="434px" img-content="tif" inline="yes" orientation="portrait" width="557px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623468</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144759</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10F71/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="200601120260302B">B65G49/07</further-classification>
        <further-classification edition="200601120260302B">F16H25/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉登明</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, DENG MING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李補忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, BU ZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116898210</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>製程腔室、載片板機械手和載片板暫存裝置</chinese-title>
        <english-title>PROCESS CHAMBER, WAFER CARRIER PLATE MANIPULATOR, AND WAFER CARRIER PLATE TEMPORARY STORAGE DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開製程腔室、載片板機械手和載片板暫存裝置，製程腔室包括腔室本體、升降機構和設於腔室本體內的加熱器，加熱器包括間隔分佈的多層加熱板，加熱板用於加熱其承載的攜帶有晶片的載片板且設有避讓結構；升降機構包括設於腔室本體內的升降架，升降架包括間隔分佈的多層第一支撐塊，每層第一支撐塊與相應加熱板的避讓結構相對；在升降架上升過程中，每層第一支撐塊向上穿過相對的避讓結構並承載對應載片板，以使載片板與相應加熱板分離；在升降架下降過程中，每層第一支撐塊向下穿過相對避讓結構並使其承載的載片板落在相應加熱板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a process chamber, a wafer carrier plate manipulator, and a wafer carrier plate temporary storage device. The process chamber comprises a chamber body, a lifting mechanism, and a heater disposed within the chamber body. The heater includes multiple layers of heating plates arranged at intervals, with the heating plates used to heat the carrier plates carrying wafers. The heating plates are provided with avoidance structures. The lifting mechanism includes a lifting frame disposed within the chamber body, and the lifting frame comprises multiple layers of first support blocks arranged at intervals, with each layer of first support block corresponding to the avoidance structure of the respective heating plate. During the upward movement of the lifting frame, each layer of first support block passes upward through the corresponding avoidance structure and supports the corresponding carrier plate, thereby separating the carrier plate from the corresponding heating plate. During the downward movement of the lifting frame, each layer of first support block passes downward through the corresponding avoidance structure, allowing the carrier plate it supports to fall onto the corresponding heating plate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:腔室本體</p>
        <p type="p">111:穿孔</p>
        <p type="p">120:加熱器</p>
        <p type="p">131:驅動機構</p>
        <p type="p">132:升降架</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.JPG" file="ed10025.JPG" height="434px" img-content="tif" inline="yes" orientation="portrait" width="700px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623566</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144760</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
        <further-classification edition="200601120260302B">B25J9/16</further-classification>
        <further-classification edition="200601120260302B">B25J13/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張寧</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, NING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭慧娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, HUI NA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范秀哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, XIU ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116871824</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體製程設備</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種半導體製程設備，其包括腔室模組、傳輸裝置和控制器，腔室模組包括依次對晶片進行製程的第一製程腔室、第二製程腔室、第三製程腔室和第四製程腔室，第四製程腔室用於在晶片的正面的第一本征非晶矽薄膜層上沉積P型晶矽或非晶矽薄膜層，傳輸裝置包括第一載片板暫存裝置和第一晶片機械手；控制器控制半導體製程設備執行如下步驟：判斷第一載片板暫存裝置上是否存放有經第四製程腔室製程完成的晶片；若是，控制第一晶片機械手成組地抓取第一載片板暫存裝置上經第四製程腔室製程完成的晶片進行下料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a semiconductor processing apparatus, which comprises a chamber module, a transfer device, and a controller. The chamber module includes a first process chamber, a second process chamber, a third process chamber, and a fourth process chamber, which sequentially accomplish processing of a wafer. The fourth process chamber is used for depositing a P-type polycrystalline silicon or amorphous silicon thin film layer on a first intrinsic amorphous silicon thin film layer on the front side of the wafer. The transfer device includes a first wafer carrier buffer device and a first wafer robot. The controller controls the semiconductor processing apparatus to execute the following steps: determining whether the first wafer carrier buffer device stores wafers that have accomplished processing in the fourth process chamber; if so, controlling the first wafer robot to collectively pick up the wafers that have accomplished processing in the fourth process chamber from the first wafer carrier buffer device for unloading.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:腔室模組</p>
        <p type="p">101:第一製程腔室</p>
        <p type="p">102:第二製程腔室</p>
        <p type="p">103:第三製程腔室</p>
        <p type="p">104:第四製程腔室</p>
        <p type="p">105:堆疊式支架</p>
        <p type="p">201:第一晶片機械手</p>
        <p type="p">202:第二晶片機械手</p>
        <p type="p">203:第一載片板暫存裝置</p>
        <p type="p">204:第二載片板暫存裝置</p>
        <p type="p">205:第一載片板機械手</p>
        <p type="p">206:第二載片板機械手</p>
        <p type="p">250:翻面暫存裝置</p>
        <p type="p">260:花籃上下料裝置</p>
        <p type="p">300:運輸車</p>
        <p type="p">400:保護艙室</p>
        <p type="p">401:第一載片板傳輸口</p>
        <p type="p">403:晶片傳輸口</p>
        <p type="p">410:第一子艙室</p>
        <p type="p">420:第二子艙室</p>
        <p type="p">430:第一密封門</p>
        <p type="p">440:第二密封門</p>
        <p type="p">450:第三子艙室</p>
        <p type="p">1051:腔室容納空間</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="650px" img-content="tif" inline="yes" orientation="portrait" width="686px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623567</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144761</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
        <further-classification edition="200601120260302B">C23C16/505</further-classification>
        <further-classification edition="202601120260302B">H10P72/70</further-classification>
        <further-classification edition="202601120260302B">H10W40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京北方華創微電子裝備有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韋鑫鋒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, XIN FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭建宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHENG, JIAN YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閆志順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAN, ZHI SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>簡師節</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIAN, SHI JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116898687</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體製程設備</chinese-title>
        <english-title>SEMICONDUCTOR PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種半導體製程設備，涉及光伏、半導體領域。一種半導體製程設備，包括：承載舟和射頻隔離裝置；承載舟包括分別作為射頻電極板或接地電極板的多個加熱板，加熱板設有加熱件，加熱件的一端相對於加熱板引出，加熱件包括金屬套；射頻隔離裝置包括第一隔離組件，第一隔離組件包括隔離環，隔離環連接於金屬套，用於阻斷加熱板中射頻信號經由金屬套傳出。本發明能夠解決射頻洩漏等問題。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a semiconductor processing apparatus, relating to the fields of photovoltaics and semiconductors. The semiconductor processing apparatus comprises: a carrier boat and a radio frequency isolation device. The carrier boat includes a plurality of heating plates, each serving as either a radio frequency electrode plate or a grounding electrode plate. Each heating plate is provided with a heating element, one end of which is led out relative to the heating plate, and the heating element includes a metal sleeve. The radio frequency isolation device comprises a first isolation component, which includes an isolation ring. The isolation ring is connected to the metal sleeve and is used to block RF signals in the heating plate from being transmitted out via the metal sleeve. The present invention can solve problems such as radio frequency leakage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:承載舟</p>
        <p type="p">2:射頻饋入裝置</p>
        <p type="p">4:密封裝置</p>
        <p type="p">5:製程腔室</p>
        <p type="p">6:匹配器</p>
        <p type="p">21:射頻饋入件</p>
        <p type="p">23:射頻功率調節組件</p>
        <p type="p">24:饋入連接組件</p>
        <p type="p">35:濾波器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10037.JPG" file="ed10037.JPG" height="434px" img-content="tif" inline="yes" orientation="portrait" width="561px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622417</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144763</doc-number>
          <kind></kind>
          <date>114/11/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251201B">F22G3/00</main-classification>
        <further-classification edition="200601120251201B">F22G1/16</further-classification>
        <further-classification edition="200601120251201B">H05B6/10</further-classification>
        <further-classification edition="200601120251201B">H05B6/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商特電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKUDEN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>外村徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TONOMURA, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202741</doc-number>
          <date>20241120</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-023509</doc-number>
          <date>20250217</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>過熱水蒸氣生成裝置</chinese-title>
        <english-title>SUPERHEATED STEAM GENERATOR</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明是一種過熱水蒸氣生成裝置，在根據電力量控制生成的水蒸氣量的裝置中防止水蒸氣生成部的破損，具備：水蒸氣生成部2，感應加熱螺旋狀的第1導體管21而從水生成水蒸氣；過熱水蒸氣生成部3，感應加熱螺旋狀的第2導體管31而從水蒸氣生成過熱水蒸氣；控制部61，根據向水蒸氣生成部2供給的電力量控制由水蒸氣生成部2生成的水蒸氣量；以及安全裝置12，基於水蒸氣生成部2中的水的壓力、水蒸氣生成部2中的水蒸氣的壓力或溫度、或者過熱水蒸氣生成部3中的過熱水蒸氣的壓力或溫度，防止水蒸氣生成部2或過熱水蒸氣生成部3的破損。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention prevents damage to a steam generation unit in a superheated steam generator in which the amount of steam to be generated is controlled by the amount of electric power, and that includes: a steam generation unit 2 that generates steam from water by inductively heating a first conductor pipe 21 having a spiral shape; a superheated steam generation unit 3 that generates superheated steam from the steam by inductively heating a second conductor pipe 31 having a spiral shape; a control unit 61 that controls an amount of steam to be generated by the steam generation unit 2 based on an amount of electric power to be supplied to the steam generation unit 2; and a safety device 12 that prevents damage to the steam generation unit 2 or the superheated steam generation unit 3 based on a pressure of the water in the steam generation unit 2, a pressure or a temperature of the steam in the steam generation unit 2, or a pressure or a temperature of the superheated steam in the superheated steam generation unit 3.</p>
      </isu-abst>
      <representative-img>
        <p type="p">2:飽和水蒸氣生成部(水蒸氣生成部)</p>
        <p type="p">3:過熱水蒸氣生成部</p>
        <p type="p">8:溫度檢測器</p>
        <p type="p">12:安全裝置</p>
        <p type="p">12a:放出部</p>
        <p type="p">21:第1導體管</p>
        <p type="p">21a:第1捲繞管部</p>
        <p type="p">21b:第1導入管部</p>
        <p type="p">21c:第1匯出管部</p>
        <p type="p">22、32:磁通產生機構</p>
        <p type="p">22a、32a:鐵芯</p>
        <p type="p">22b、32b:感應線圈</p>
        <p type="p">31:第2導體管</p>
        <p type="p">31a:第2捲繞管部</p>
        <p type="p">31b:第2導入管部</p>
        <p type="p">31c:第2匯出管部</p>
        <p type="p">61:水蒸氣量控制部(控制部)</p>
        <p type="p">63:溫度控制部</p>
        <p type="p">100:過熱水蒸氣生成裝置</p>
        <p type="p">CP:連通管部</p>
        <p type="p">P1:第1導入口</p>
        <p type="p">P2:第1匯出口</p>
        <p type="p">P3:第2導入口</p>
        <p type="p">P4:第2匯出口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="679px" img-content="tif" inline="yes" orientation="portrait" width="936px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621869</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144837</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260122B">B25J9/18</main-classification>
        <further-classification edition="200601120260122B">B25J9/02</further-classification>
        <further-classification edition="200601120260122B">B25J9/22</further-classification>
        <further-classification edition="200601120260122B">B25J15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美倍亞三美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEBEA MITSUMI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中澤一瑛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAZAWA, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宇野寿一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UNO, JUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋秀一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SHUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207203</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>握持裝置及握持裝置的控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提高握持裝置的控制參數的選擇自由度，並抑制握持裝置的大型化、高成本化。握持裝置（100）包括握持部（50）、多個開關（200）、驅動控制電路（10），驅動控制電路（10）包含驅動電路（11）與基於運作條件生成驅動控制訊號的控制電路（12），運作條件包含第一設定值群組與第二設定值群組，控制電路（12）包含能夠設定第一設定值群組的第一運作模式、以及能夠設定第二設定值群組且基於運作條件對握持部（50）的驅動進行控制的第二運作模式，控制電路（12）藉由如下方式實現：在規定的開關（21、22）為第一規定狀態的情況下，以第一運作模式運作，在不為第一規定狀態的情況下，以第二運作模式運作，在第一運作模式中設定第一設定值群組，在第二運作模式中設定第二設定值群組，並基於第一設定值群組、第二設定值群組生成驅動控制訊號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:握持系統</p>
        <p type="p">10:驅動控制電路</p>
        <p type="p">11:驅動電路</p>
        <p type="p">12:控制電路</p>
        <p type="p">20:開關電路</p>
        <p type="p">21:第一開關/開關</p>
        <p type="p">22:第二開關/開關</p>
        <p type="p">23:第三開關/開關</p>
        <p type="p">24:第四開關/開關</p>
        <p type="p">30:連接器</p>
        <p type="p">31A:第一通訊端子</p>
        <p type="p">31B:第二通訊端子</p>
        <p type="p">32A:第一電源端子</p>
        <p type="p">32B:第二電源端子</p>
        <p type="p">40:上位裝置</p>
        <p type="p">41:控制器</p>
        <p type="p">42:電源裝置</p>
        <p type="p">50:握持部</p>
        <p type="p">51:馬達</p>
        <p type="p">52:驅動機構</p>
        <p type="p">53:可動機構</p>
        <p type="p">70:對象物</p>
        <p type="p">100:握持裝置</p>
        <p type="p">531A、531B:移動部</p>
        <p type="p">532A、532B:指部</p>
        <p type="p">GND:接地點</p>
        <p type="p">P:中心位置</p>
        <p type="p">SR1、SR2、SS1、SS2、SS3、SS4:訊號</p>
        <p type="p">X、Y、Z:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="738px" img-content="tif" inline="yes" orientation="portrait" width="939px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622973</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144841</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G11C13/04</main-classification>
        <further-classification edition="200601120260302B">G11C11/42</further-classification>
        <further-classification edition="200601120260302B">G11C7/16</further-classification>
        <further-classification edition="200601120260302B">G06F13/38</further-classification>
        <further-classification edition="200601120260302B">G06F13/14</further-classification>
        <further-classification edition="202601120260302B">H10W74/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海曦智科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI XIZHI TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈亦晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YI CHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟懷宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, HUAI YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FENG, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張騫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, QIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117289686</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>計算系統、晶片封裝、運算板及計算方法</chinese-title>
        <english-title>COMPUTING SYSTEMS, CHIP PACKAGING, COMPUTING BOARDS AND COMPUTING METHODS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及計算系統、晶片封裝、運算板及計算方法。其中所述計算系統包括第一匯流排；多個處理單元，每個所述處理單元電耦合至所述第一匯流排，其中，所述多個處理單元包括第一處理單元以及第二處理單元；多個光計算單元，每個所述光計算單元電耦合至所述第一匯流排，其中，所述多個光計算單元包括第一光計算單元以及第二光計算單元。所述計算方法包括利用所述計算系統進行計算。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This invention relates to a computing system, a chip packaging, a computing board, and a computing method. The computing system includes a first bus; a plurality of processing units in which each electrically couples to the first bus and the plurality of processing units include a first processing unit and a second processing unit; and a plurality of optical computing units in which each electrically couples to the first bus and the plurality of optical computing units include a first optical computing unit and a second optical computing unit. The computing method includes performing calculations using the computing system.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1000:計算系統</p>
        <p type="p">150:第二匯流排</p>
        <p type="p">130:第一匯流排</p>
        <p type="p">113a~113d:處理單元</p>
        <p type="p">121a~121f:光計算單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="587px" img-content="tif" inline="yes" orientation="portrait" width="765px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622009</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144906</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">C03B29/08</main-classification>
        <further-classification edition="200601120260102B">C03B33/07</further-classification>
        <further-classification edition="200601120260102B">B32B17/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商康寧公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商康寧精密素材股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CORNING PRECISION MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭基榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEOUNG, KI-YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宇鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, WOO JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廉宗燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEOM, JONGSUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,611</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於製造電漿邊緣處理玻璃層壓物之方法及所提供之電漿邊緣處理玻璃層壓物</chinese-title>
        <english-title>METHODS FOR MAKING PLASMA EDGED GLASS LAMINATES AND PLASMA EDGED GLASS LAMINATES PROVIDED</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了用於對玻璃層壓物進行加工之方法，其包括：經由一電漿羽加熱一玻璃層壓物中之一玻璃片之一邊緣部分，該電漿羽係相對於該玻璃片以30度至60度之一回流角度而施加；使該邊緣部分回流以界定一回流區，從而使玻璃流修復該邊緣部分中之至少一個缺陷；及提供具有修整邊緣之至少一個部分的一邊緣修整玻璃層壓物，其中一修整邊緣包含一拋光邊緣，且另外其中該邊緣修整玻璃層壓物包含一封裝間層。描述了各種方法及邊緣修整玻璃層壓物堆疊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods for processing glass-laminates are provided, including: heating an edge portion of a glass sheet in a glass laminate via a plasma plume applied at a reflow angle of 30 to 60 degrees relative to the glass sheet; reflowing the edge portion to define a reflow zone, causing glass flow to heal at least one defect in the edge portion; and providing an edge-finished glass laminate having at least one portion of finished edge, wherein a finished edge comprises a polished edge and further wherein, the edge-finished glass laminate comprises an encapsulated interlayer. Various methods and edge-finished glass laminate stacks are described.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="350px" img-content="tif" inline="yes" orientation="portrait" width="287px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621959</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144914</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260218B">B65D81/38</main-classification>
        <further-classification edition="200601120260218B">B65D81/03</further-classification>
        <further-classification edition="200601120260218B">B32B3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬來西亞商生力山村織品有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAN MIGUEL YAMAMURA WOVEN PRODUCTS SDN BHD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　德順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAN, TECK SOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭　巧珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TEH, KHAR SAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷　雪智</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOI, PATRICK SUOK TEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任　家偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAM, KAH WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅　秀蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOH, SIEW LIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>MY</english-country>
              <english-address>MY</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>澳大利亞</country>
          <doc-number>2024903855</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>反射絕熱內襯</chinese-title>
        <english-title>REFLECTIVE THERMAL INSULATION LINER</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種反射絕熱內襯，其包含一可撓性第一膜，該可撓性第一膜覆蓋於一可撓性第二膜上；其中該第一膜及該第二膜以界定一系列填充腔室之一密封圖案密封在一起，且各填充腔室包括用於用一流體填充該腔室之一埠；其中該填充腔室之一內部表面為一反射表面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A reflective thermal insulation liner, comprising a flexible first film overlying a flexible second film; wherein the first film and second film are sealed together in a sealing pattern defining a series of filling chambers, and each filling chamber includes a port for filling the chamber with a fluid; wherein an inner surface of the filling chamber is a reflective surface.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:內襯/捲起內襯</p>
        <p type="p">11:縱向側/長邊緣/長側邊緣</p>
        <p type="p">12:可充氣柱/柱</p>
        <p type="p">13:柱密封件</p>
        <p type="p">14:邊緣密封件</p>
        <p type="p">15:空氣閥</p>
        <p type="p">17:充氣通道</p>
        <p type="p">25:密封圖案</p>
        <p type="p">26:縱向末端密封線/末端密封線</p>
        <p type="p">27:平行縱向埠密封線/埠密封線</p>
        <p type="p">L:縱向長度/內襯長度/長度</p>
        <p type="p">W:寬度/寬度方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="604px" img-content="tif" inline="yes" orientation="portrait" width="767px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622750</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144929</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120260202B">G06F12/0866</main-classification>
        <further-classification edition="201601120260202B">G06F12/08</further-classification>
        <further-classification edition="200601120260202B">G06F13/14</further-classification>
        <further-classification edition="200601120260202B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商愛思開海力士有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SK HYNIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭棟薰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, DONG HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金永祚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, YOUNG JO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴智勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JI HUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭普釋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEONG, BO SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, JAE WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0169278</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>控制器、記憶體裝置和資料儲存裝置</chinese-title>
        <english-title>CONTROLLER, MEMORY DEVICE AND DATA STORAGE DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露關於一種控制器、記憶體裝置和資料儲存裝置，該資料儲存裝置包括揮發性記憶體和非揮發性記憶體，並且透過將包括壓縮用戶資料和標籤資料的快取線儲存在揮發性記憶體中，可以提供快取功能。因此，可以避免存取次數的增加以及利用揮發性記憶體以實現快取功能的儲存區域的增加，從而提高資料儲存裝置的快取操作性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This disclosure relates to a controller, a memory device, and a data storage device, the data storage device includes a volatile memory and a nonvolatile memory, and a caching function is provided by storing a cache line including compressed user data and tag data in the volatile memory. Therefore, increases in the number of accesses and addition of a storage region using the volatile memory for caching functions are prevented, resulting in a data storage device with improved caching operation performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資料儲存裝置</p>
        <p type="p">110:記憶體</p>
        <p type="p">111:第一記憶體</p>
        <p type="p">112:第二記憶體</p>
        <p type="p">120:控制器</p>
        <p type="p">200:主機裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="497px" img-content="tif" inline="yes" orientation="portrait" width="700px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621717</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144939</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260105B">A61K36/068</main-classification>
        <further-classification edition="200601120260105B">A61P39/00</further-classification>
        <further-classification edition="200601120260105B">A61P1/04</further-classification>
        <further-classification edition="201601120260105B">A23L33/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州中美華東製藥有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU ZHONGMEIHUADONG PHARMACEUTICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉杏忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉佳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>肖惠文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳月</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂祥蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余婷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116587103</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>冬蟲夏草在製備抗輻射損傷保健品或藥物中的用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了冬蟲夏草在製備預防和/或治療輻射損傷的保健品或藥物中的應用，特別是在製備預防和或/治療電離輻射引起的腸型放射損傷的保健品或藥物中的應用。冬蟲夏草能夠顯著改善腸型放射損傷造成的體重下降、結腸長度變短、血液和/或小腸ROS含量升高、血液和/或小腸炎症水準升高、小腸組織損傷等症狀，可以作為輻射損傷、特別是腸型放射損傷的防治保健品或藥物，改善腸型放射損傷的臨床治療仍缺乏切實有效保健品或藥物的現狀。同時為開發抗輻射損傷保健品或藥物提供了新的思路和策略，具有重要的科學意義和臨床應用價值。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="586px" img-content="tif" inline="yes" orientation="portrait" width="1017px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623279</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144943</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260218B">H04S3/00</main-classification>
        <further-classification edition="200601120260218B">H04S7/00</further-classification>
        <further-classification edition="200601120260218B">H04R5/02</further-classification>
        <further-classification edition="200601120260218B">B60R11/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商阿爾卑斯阿爾派股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALPS ALPINE CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戶田真登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TODA, MASATO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丹野慶太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANNO, KEITA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>仁平一聖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIHIRA, KAZUMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-203800</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>音頻系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">課題在於，提供在使用了在座位的左右具備的揚聲器的音頻系統中實現向前方的位置的良好的定位感的“音頻系統”。解決方案在於，A_L_SPK和A_R_SPK配置於汽車的駕駛座的頭枕的左右，B_L_SPK和B_R_SPK配置於汽車的副駕駛座的頭枕的左右。前置揚聲器F_SPK配置於汽車的車內後視鏡上的位置。向A_L_SPK和A_R_SPK分別輸出第一音頻信號的左右聲道的信號，向B_L_SPK和B_R_SPK分別輸出第二音頻信號的左右聲道的信號。提取與第一音頻信號的各聲道和第二音頻信號的各聲道的全部聲道相關的成分並輸出到前置揚聲器F_SPK。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">A_L_SPK,B_L_SPK:左揚聲器</p>
        <p type="p">A_R_SPK,B_R_SPK:右揚聲器</p>
        <p type="p">F_SPK:前置揚聲器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="1018px" img-content="tif" inline="yes" orientation="portrait" width="668px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622670</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144972</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120260206B">G05D1/43</main-classification>
        <further-classification edition="202401120260206B">G05D1/633</further-classification>
        <further-classification edition="200601120260206B">A47L11/40</further-classification>
        <further-classification edition="202401320260206B">G05D105/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>侯崢韜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HOU, ZHENGTAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王澤君</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZEJUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116545149</doc-number>
          <date>20241118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>移動機器人的控制方法、裝置、移動機器人及設備、介質</chinese-title>
        <english-title>CONTROL METHOD AND APPARATUS OF MOBILE ROBOT, MOBILE ROBOT, DEVICE, AND MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種移動機器人的控制方法。移動機器人包括機身以及可升降設置於機身頂端的測距組件。所述方法包括控制移動機器人在初始位置以使得測距組件下降的第一狀態啟動；控制移動機器人在該初始位置獲取該移動機器人與上方障礙物之間的距離；以及基於該距離，控制測距組件是否切換至第二狀態，在第二狀態下，控制測距組件上升。本公開可以減少移動機器人在低矮區域啟動時測距組件相關的硬體受到損壞的風險，並在移動機器人啟動時更加智能地控制測距組件的升降，提高硬體安全性以及工作性能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a control method and a control apparatus of a mobile robot, a mobile robot, a device and a medium. The mobile robot includes a robot body and a ranging component set at the top of the robot body in a liftable and lowerable manner. The method includes: controlling the mobile robot to start in a first state where the ranging component is lowered; controlling the mobile robot to obtain a distance between the mobile robot and an overhead obstacle at an initial position; and controlling, based on the distance, whether the ranging component switches to a second state where the ranging component is raised. The present disclosure may reduce the risk of damage to hardware related to the ranging component when the mobile robot starts in low-clearance areas, and enable more intelligent control of the raising and lowering of the ranging component during startup to better adapt to the environment, thereby improving the hardware safety and operation performance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S101、S102、S103、S201、S202:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="375px" img-content="tif" inline="yes" orientation="portrait" width="696px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622229</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144981</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">C12N1/20</main-classification>
        <further-classification edition="201501120260302B">A61K35/74</further-classification>
        <further-classification edition="200601120260302B">A61P3/04</further-classification>
        <further-classification edition="201601120260302B">A23L33/135</further-classification>
        <further-classification edition="200601320260302B">C12R1/01</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷文虎克生物技術股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEEUWENHOEK LABORATORIES CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林巧威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIAO-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅翊菱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, YI-LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄒欣蓓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOU, HSIN-BAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, WEN-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李奇珊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHI-SHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐丞志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHENG-CHIH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/721,573</doc-number>
          <date>20241118</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/738,839</doc-number>
          <date>20241226</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>提升類升糖素胜肽-1的艾克曼嗜黏蛋白菌、其萃取物及其用途</chinese-title>
        <english-title>AKKERMANSIA MUCINIPHILA FOR INCREASING GLUCAGON-LIKE PEPTIDE-1, EXTRACT AND USE THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種艾克曼嗜黏蛋白菌包括由艾克曼嗜黏蛋白菌LWHK0001、LWHK0002、LWHK0004、LWHK0005、LWHK0006或LWHK0008。另提供一種艾克曼嗜黏蛋白菌提升類升糖素胜肽-1的用途，包括LWHK0001、LWHK0002、LWHK0003、LWHK0004、LWHK0005、LWHK0006或LWHK0008。另提供一種艾克曼嗜黏蛋白菌萃取物，具有提升類升糖素胜肽-1的功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided is an &lt;i&gt;Akkermansia muciniphila&lt;/i&gt; strain including &lt;i&gt;Akkermansia muciniphila&lt;/i&gt; LWHK0001, LWHK0002, LWHK0004, LWHK0005, LWHK0006, or LWHK0008. Also provided is an use of &lt;i&gt;Akkermansia muciniphila&lt;/i&gt; for enhancing glucagon-like peptide-1 (GLP-1), including LWHK0001, LWHK0002, LWHK0003, LWHK0004, LWHK0005, LWHK0006, or LWHK0008. Also provided is an &lt;i&gt;Akkermansia muciniphila&lt;/i&gt; extract having the effect of increasing GLP-1.</p>
      </isu-abst>
      <representative-img>
        <p type="p">F1:圖面</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="638px" img-content="tif" inline="yes" orientation="portrait" width="648px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623138</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114144986</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H02B1/26</main-classification>
        <further-classification edition="202601120260302B">H02J13/18</further-classification>
        <further-classification edition="200601120260302B">H02B1/56</further-classification>
        <further-classification edition="200601120260302B">H02B15/00</further-classification>
        <further-classification edition="200601120260302B">G06F1/16</further-classification>
        <further-classification edition="202601320260302B">H02J105/42</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商瓦特洛威電子製造公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WATLOW ELECTRIC MANUFACTURING COMPANY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>布里特羅　史丹頓　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BREITLOW, STANTON H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮阿爾克斯　泰德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VON ARX, TED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>萊姆基　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMKE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沃特斯　賴瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WALTERS, LARRY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柯里　馬丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CURRIE, MARTIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>基斯林　帕克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIESLING, PARKER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/722,170</doc-number>
          <date>20241119</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>模組化緊湊電力控制系統</chinese-title>
        <english-title>MODULAR COMPACT POWER CONTROL SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種電力控制系統可包括具有複數個面板壁之一機殼、位於該機殼內之一中央互連系統、沿著該機殼布置之複數個輸入、以及複數個電力控制模組，其中各電力控制模組包括：被組配用以從該複數個輸入接收電力及資料通訊之一電力控制裝置、耦合至該電力控制裝置以感測一或多個操作條件之一感測裝置；以及一連接器，其被組配用以在受耦合至該中央互連系統時延伸穿過該複數個面板壁中之一個面板壁，並且被組配用以耦合至一加熱器控制器之一或多個連接，其中該連接器係可從該機殼之一外部接取；以及一控制器，其被組配用以基於該複數個電力控制模組之該一或多個受感測操作條件，來控制藉由該連接器輸出之電力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power control system may include a housing having a plurality of panel walls, a central interconnect system within the housing, a plurality of inputs arranged along the housing, and a plurality of power control modules, where each power control module includes: a power control device configured to receive power and data communication from the plurality of inputs, a sensing device coupled to the power control device to sense one or more operating conditions; and a connector configured to extend through one panel wall of the plurality of panel walls when coupled to the central interconnect system and configured to couple to one or more connections of a heater controller, wherein the connector is accessible from an exterior of the housing; and a controller configured to control power output by the connector based on the one or more sensed operating conditions of the plurality of power control modules.</p>
      </isu-abst>
      <representative-img>
        <p type="p">108:控制模組</p>
        <p type="p">112:加熱器控制器</p>
        <p type="p">114:中央互連系統</p>
        <p type="p">604:控制組件</p>
        <p type="p">606:SSR</p>
        <p type="p">608:保險絲</p>
        <p type="p">612:加熱器連接器；連接器</p>
        <p type="p">614:電流感測裝置</p>
        <p type="p">620:加熱器元件</p>
        <p type="p">702:電力輸入</p>
        <p type="p">802:聯鎖</p>
        <p type="p">900:輸出組態</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="738px" img-content="tif" inline="yes" orientation="portrait" width="994px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622618</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145000</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251127B">G02F1/1347</main-classification>
        <further-classification edition="200601120251127B">G02F1/1343</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京八億時空液晶科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊雪彪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙玉盼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王智成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳卯先</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雲鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116613216</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>液晶顯示面板狀態評估方法、裝置、電子設備及存儲介質</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種液晶顯示面板狀態評估方法、裝置、電子設備及存儲介質。所述液晶顯示面板包括配向膜、公共電極、像素電極以及液晶層；所述方法包括：向所述液晶顯示面板的所述公共電極或所述像素電極提供目標直流信號，同時獲取離子累積數據；根據所述離子累積數據以及所述目標直流信號確定所述液晶顯示面板中的離子類型。本發明提供的方法通過在液晶顯示面板上疊加直流信號，使顯示面板中的離子在電場的作用下累積，並通過離子累積數據判斷顯示面板中雜散離子的類型，有助於判斷殘像的成因，進而能夠針對性地消除液晶顯示面板中的殘像。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S1:步驟</p>
        <p type="p">S2:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="403px" img-content="tif" inline="yes" orientation="portrait" width="619px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622438</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114145003</doc-number>
          <kind></kind>
          <date>114/11/18</date>
        </document-id>
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      <classification-ipc>
        <main-classification edition="200601120260122B">F28D1/047</main-classification>
        <further-classification edition="200601120260122B">F28D1/06</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奥野喬也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKUNO, TAKAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邢逸凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XING, YIFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-204048</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>冷卻裝置及冷卻單元</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本發明之一態樣之冷卻裝置具備護罩、第1彎頭、第2彎頭、第1流管、及第2流管。護罩於第1面具有供冷媒流通之第1開口及第2開口。第1彎頭位於第1面，且連接於第1開口。第2彎頭位於第1面，且連接於第2開口。第1流管位於第1面，且連接於第1彎頭。第2流管位於第1面，且連接於第2彎頭。從與第1面正交之方向觀察時，第1流管係於鄰近第2彎頭之位置處向相對於第2彎頭之流體通道方向傾斜之方向呈直線狀延伸，或者，第2流管係於鄰近第1彎頭之位置處向遠離第1彎頭之方向彎曲。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:護罩</p>
        <p type="p">11:第1面</p>
        <p type="p">13:第1開口</p>
        <p type="p">14:第2開口</p>
        <p type="p">20:第1彎頭</p>
        <p type="p">21:第1角部</p>
        <p type="p">30:第2彎頭</p>
        <p type="p">31:第2角部</p>
        <p type="p">40:第1流管</p>
        <p type="p">41:第1直線部</p>
        <p type="p">42:第3彎曲部</p>
        <p type="p">43:第2直線部</p>
        <p type="p">44:第4彎曲部</p>
        <p type="p">50:第2流管</p>
        <p type="p">51:第3直線部</p>
        <p type="p">52:第1彎曲部</p>
        <p type="p">53:第2彎曲部</p>
        <p type="p">82:第2耦接器</p>
        <p type="p">100:冷卻裝置</p>
        <p type="p">A:流體通道方向</p>
        <p type="p">B:角度</p>
        <p type="p">L1:距離</p>
        <p type="p">L4:寬度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="843px" img-content="tif" inline="yes" orientation="portrait" width="796px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202623196</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114145015</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
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      <classification-ipc>
        <main-classification edition="200601120260202B">H03F3/24</main-classification>
        <further-classification edition="200601120260202B">H03F3/189</further-classification>
        <further-classification edition="200601120260202B">H04B1/16</further-classification>
        <further-classification edition="200601120260202B">H04B1/04</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商宜確半導體（蘇州）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ETRA SEMICONDUCTOR (SUZHOU) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉新宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, XINYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116788757</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基於同相功率合成的功率放大器系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基於同相功率合成的功率放大器系統,包括輸入端口、輸出端口，多個功率放大通路，均與輸入端口連接，包括至少一個主功率放大通路和至少一個輔助功率放大通路，用於對各自從輸入端口接收的相同相位的一路輸入信號進行放大，至少一個輔助功率放大通路處於工作狀態時，對主功率放大通路進行負載調製，使主功率放大通路的負載阻抗減小；同相合成器，連接在多個功率放大通路與輸出端口之間，用於將每路功率放大通路輸出的放大後的信號在相同相位上進行功率合成，得到合成後的輸出信號傳輸給所述輸出端口進行輸出。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:功率放大通路</p>
        <p type="p">110:主功率放大通路</p>
        <p type="p">120N,1201,1202,1203:輔助功率放大通路</p>
        <p type="p">130a:主功率放大單元</p>
        <p type="p">130b1,130b2,130b3,130bN:輔助功率放大單元</p>
        <p type="p">140a:第一阻抗轉換網路</p>
        <p type="p">140b1,140b2,140b3,140bN:第二阻抗轉換網路</p>
        <p type="p">200:同相合成器</p>
        <p type="p">300:同相功分器</p>
        <p type="p">RFInput:輸入端口</p>
        <p type="p">RFOutput:輸出端口</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.JPG" file="ed10023.JPG" height="507px" img-content="tif" inline="yes" orientation="portrait" width="674px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621974</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114145016</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260129B">B65H67/052</main-classification>
        <further-classification edition="200601120260129B">B65H67/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商ＴＭＴ機械股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TMT MACHINERY, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>七山大督</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANAYAMA, DAISUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李元戎</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-208502</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>紗線捲取機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種紗線捲取機，具備一對筒管支架(41、42)、第一筒管支架馬達、轉台板(40)以及控制裝置。一對筒管支架保持筒管。驅動裝置對筒管支架進行旋轉驅動而將紗線捲取於筒管來形成捲筒。轉台板(40)使筒管支架(41、42)在捲取位置、回收位置、第一切換位置以及第二切換位置之間移動。控制裝置以在第一筒管支架(41)至少到達回收位置的時刻成為第一筒管支架(41)向捲取紗線的方向旋轉的狀態的方式，在進行了紗線切換之後且第一筒管支架(41)到達回收位置為止的期間，進行使第一筒管支架(41)開始向捲取紗線的方向旋轉的控制。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">40:轉台板</p>
        <p type="p">40a,40b:凹部</p>
        <p type="p">41:第一筒管支架(筒管支架)</p>
        <p type="p">42:第二筒管支架(筒管支架)</p>
        <p type="p">61:轉台止擋件</p>
        <p type="p">61a:凸部</p>
        <p type="p">62:缸裝置</p>
        <p type="p">62b:桿</p>
        <p type="p">63:回收位置檢測感測器</p>
        <p type="p">64a:回收位置捲筒止擋件</p>
        <p type="p">64b:第一切換位置捲筒止擋件</p>
        <p type="p">93:紗線</p>
        <p type="p">94:捲筒</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10018.png" file="d10018.TIF" giffile="ed10018.png" height="948px" img-content="tif" inline="yes" orientation="portrait" width="713px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622477</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145041</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G01M11/02</main-classification>
        <further-classification edition="200601120260226B">G01N21/00</further-classification>
        <further-classification edition="200601120260226B">G01N21/84</further-classification>
        <further-classification edition="200601120260226B">G02B5/32</further-classification>
        <further-classification edition="200601120260226B">G02B27/18</further-classification>
        <further-classification edition="201801120260226B">H04N13/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商羅伯特　博世有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROBERT BOSCH GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>琳道爾　瑪麗亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINDAUER, MARIA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>菲斯　萊恩后德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIESS, REINHOLD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛文多夫　史戴芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOEWENDORF, STEFFEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賽格　烏利希</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEGER, ULRICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>德國</country>
          <doc-number>102024211223.2</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於投影測試圖案的投影單元、測試裝置以及用於測試光學樣品之清晰度特性的方法</chinese-title>
        <english-title>PROJECTION UNIT FOR PROJECTING A TEST PATTERN, TEST DEVICE AND METHOD FOR TESTING SHARPNESS PROPERTIES OF AN OPTICAL SPECIMEN</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明為關於一種用於投影測試圖案（140）的投影單元（110）。可藉由使用該測試圖案（140）來測試光學樣品（X）之清晰度特性。該投影單元（110）包含繞射光學元件，該繞射光學元件經形成以便回應於自一個或多個光源（120、130）同時耦合至該投影單元（110）中之不同激發光（125、135）而產生複數個虛擬測試物件（142、143）作為該測試圖案（140）。如由該樣品（X）所見，所述測試物件（142、143）當中之不同的測試物件布置於不同的焦平面中及不同的立體角中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention relates to a projection unit (110) for projecting a test pattern (140). Sharpness properties of an optical specimen (X) can be tested by using the test pattern (140). The projection unit (110) comprises a diffractive optical element which is formed in order to generate a plurality of virtual test objects (142, 143) as the test pattern (140) in response to different excitation light (125, 135) coupled simultaneously into the projection unit (110) from one more light sources (120, 130). Different test objects among the test objects (142, 143) are arranged in different focal planes and in different solid angles as seen by the specimen (X).</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:測試裝置</p>
        <p type="p">110:投影單元</p>
        <p type="p">120:光源</p>
        <p type="p">125:激發光</p>
        <p type="p">130:光源</p>
        <p type="p">135:激發光</p>
        <p type="p">140:測試圖案</p>
        <p type="p">142:測試物件/虛擬測試物件</p>
        <p type="p">143:測試物件/虛擬測試物件</p>
        <p type="p">X:樣品/光學樣品</p>
        <p type="p">Y:視野</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="502px" img-content="tif" inline="yes" orientation="portrait" width="684px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622094</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145042</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/22</main-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
        <further-classification edition="201101120260302B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG SDI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃昇淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, SEONGYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>任相均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IM, SANGKYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旻映</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MINYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐也隱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEO, YAEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹志賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, JIHYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金旻惠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, MINHYE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0166455</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體光刻膠組成物以及使用組成物形成圖案的方法</chinese-title>
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種半導體光刻膠組成物和使用其形成或提供圖案的方法，半導體光刻膠組成物包括由化學式1表示的有機金屬化合物；以及溶劑。化學式1的描述如說明書中所述。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a semiconductor photoresist composition and a method of forming or providing patterns using the same, the semiconductor photoresist composition including an organometallic compound represented by Chemical Formula 1; and a solvent. The descriptions of Chemical Formula 1 are as described in the specification.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基材</p>
        <p type="p">108:光刻膠圖案</p>
        <p type="p">112:有機薄膜圖案</p>
        <p type="p">114:薄膜圖案</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="475px" img-content="tif" inline="yes" orientation="portrait" width="703px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621876</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145046</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">B25J19/02</main-classification>
        <further-classification edition="200601120260202B">B25J13/08</further-classification>
        <further-classification edition="200601120260202B">B25J9/10</further-classification>
        <further-classification edition="202201120260202B">G06V20/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程冉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, RAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411670020X</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>物體識別方法、裝置、可移動設備和可讀存儲介質</chinese-title>
        <english-title>AN OBJECT RECOGNITION METHOD, APPARATUS, MOVABLE DEVICE, AND READABLE STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供了一種物體識別方法、裝置、可移動設備和可讀存儲介質，涉及智慧家居領域。物體識別方法應用於可移動設備，可移動設備包括用於夾取物體的機械臂，該物體識別方法包括：獲取待清潔環境中目標物體的物體資訊，並根據物體資訊進行物體識別，得到物體識別結果；根據物體識別結果，確定目標物體的物體類別，並判斷目標物體相對於可移動設備的可夾取情況。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides an object recognition method, apparatus, movable device, and readable storage medium, relating to the field of smart home. The object recognition method is applied to a movable device, which includes a robotic arm for gripping objects. This object recognition method comprises: acquiring object information of a target object in an environment to be cleaned, and performing object recognition based on the object information to obtain an object recognition result; based on the object recognition result, determining the object category of the target object and judging the grippability of the target object relative to the movable device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301、302:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="385px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622220</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145048</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260129B">C09K21/04</main-classification>
        <further-classification edition="200601120260129B">C04B35/532</further-classification>
        <further-classification edition="200601120260129B">C04B28/34</further-classification>
        <further-classification edition="200601120260129B">C08K3/22</further-classification>
        <further-classification edition="201801120260129B">C08K3/016</further-classification>
        <further-classification edition="200601320260129B">B29K21/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商電化股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DENKA COMPANY LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高津知道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKATSU, TOMOMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-205702</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>耐火材組合物、構件</chinese-title>
        <english-title></english-title>
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      <physical-examination>無</physical-examination>
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        <p type="p">本發明提供一種耐火材組合物，其加工性、作業性、熱膨脹性、熱膨脹後之形狀穩定性、及熱膨脹後之密接性優異。  &lt;br/&gt;根據本發明，提供一種耐火材組合物，其包含基質聚合物成分及磷酸系無機化合物，相對於上述基質聚合物成分100質量份，上述磷酸系無機化合物之含量超過120質量份且為2000質量份以下，熱膨脹性層狀無機化合物之含量未達10質量份，分子量為500以下之多元醇化合物之含量未達30質量份，上述基質聚合物成分包含液狀橡膠及固體彈性體，且上述液狀橡膠與上述固體彈性體之質量比為95：5～5：95。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:構件</p>
        <p type="p">3:電池單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="311px" img-content="tif" inline="yes" orientation="portrait" width="483px">
          </img>
        </representative>
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      <isuno>11</isuno>
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          <doc-number>202621834</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114145065</doc-number>
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        <main-classification edition="201401120260302B">B23K26/323</main-classification>
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        <further-classification edition="202601120260302B">H10W20/44</further-classification>
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                <last-name>日商龍雲股份有限公司</last-name>
                <first-name></first-name>
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                <last-name>TAZMO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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              <english-address>JP</english-address>
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          <applicant app-type="applicant" sequence="2">
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                <last-name>國立大學法人東北大學</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>TOHOKU UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
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              <english-address>JP</english-address>
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          </applicant>
        </applicants>
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              <chinese-name name-type="organization">
                <last-name>五十川良則</last-name>
                <first-name></first-name>
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                <last-name>IKAGAWA, YOSHINORI</last-name>
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                <first-name></first-name>
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                <last-name>井伊隼平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>II, SHUMPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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                <last-name>田中秀治</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>TANAKA, SHUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木裕輝夫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, YUKIO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴經臣</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>宿希成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
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          </agent>
        </agents>
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      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-202874</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>接合體</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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        <p type="p">本發明之接合體係具備有：屬於接合對象的第1基材與第2基材、以及介設於該等2個基材相對向面之間的第1接合材料層。第1接合材料層係在該等2個基材的接合位置設有開口，該開口的內側，係充滿與第1基材主成分及第2基材之主成分中至少任一者相同成分作為主成分的材料。又，在開口內側或其附近區域中，形成由與第1接合材料層主成分相同成分、及由該成分所構成化合物中至少任一者分散之區域。</p>
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        <p type="p">
        </p>
      </isu-abst>
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        <p type="p">101:第1基材</p>
        <p type="p">102:第2基材</p>
        <p type="p">101a、102a:對向面</p>
        <p type="p">201:第1接合材料層</p>
        <p type="p">201X:開口</p>
        <p type="p">202:第2接合材料層</p>
        <p type="p">202P:介設部分</p>
        <p type="p">202Q:侵入部分</p>
        <p type="p">R1:區域</p>
        <p type="p">S1、S2:界面</p>
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          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="647px" img-content="tif" inline="yes" orientation="portrait" width="520px">
          </img>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202622844</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145075</doc-number>
          <kind></kind>
          <date>114/11/19</date>
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        <main-classification edition="202301120260220B">G06Q30/015</main-classification>
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        <further-classification edition="202001120260220B">G06F40/30</further-classification>
        <further-classification edition="202301120260220B">G06Q30/0601</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN GROUP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>高橋晋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭芷昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, GRACE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上多喜子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, TAKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>由
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENISHI, MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206803</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
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        <chinese-title>資訊處理裝置、處理方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
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        <p type="p">[課題]提供一種可支援將針對詢問的回答之種類列入考慮的回答之作成的資訊處理裝置、處理方法及程式。  &lt;br/&gt;　　[解決手段]資訊處理裝置(100)的詢問受理部(101)，係將來自詢問者的詢問文，予以受理。回答類型選擇部(104)，係從已被預先規定之回答類型的候補中選擇出任一回答類型，該回答類型係表示，針對詢問文的回答之種類。取得部(105)，係將針對已被受理之詢問文的回答文，藉由令生成式AI基於已被受理之詢問文、與已被選擇之回答類型來進行生成，而加以取得。提示部(106)，係將已被取得之回答文，提示給針對詢問文進行回答的回答者。</p>
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      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資訊處理裝置</p>
        <p type="p">101:詢問受理部</p>
        <p type="p">102:回答內容受理部</p>
        <p type="p">103:禮貌等級選擇部</p>
        <p type="p">104:回答類型選擇部</p>
        <p type="p">105:取得部</p>
        <p type="p">106:提示部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="639px" img-content="tif" inline="yes" orientation="portrait" width="619px">
          </img>
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          <doc-number>202622856</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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          <doc-number>114145076</doc-number>
          <kind></kind>
          <date>114/11/19</date>
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        <further-classification edition="201301120260204B">G06F3/048</further-classification>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商樂天集團股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAKUTEN GROUP, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
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              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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              <chinese-name name-type="organization">
                <last-name>高橋晋</last-name>
                <first-name></first-name>
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              <english-name name-type="organization">
                <last-name>TAKAHASHI, SUSUMU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上多喜子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, TAKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
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              <chinese-name name-type="organization">
                <last-name>鄭芷昕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, GRACE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>由
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UENISHI, MAYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-206806</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>資訊處理裝置、處理方法及程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供一種，藉由從可作為針對詢問的回答之要旨而成立的要旨之候補中選擇出回答之要旨，而可支援回答之作成的資訊處理裝置等。  &lt;br/&gt;　　[解決手段]資訊處理裝置(100)的詢問受理部(101)，係將詢問文予以受理。要旨候補取得部(102)，係藉由將「必須生成包含有可作為針對詢問文的回答之要旨而成立的要旨候補，且為相互排斥之要旨候補在內的複數個要旨候補」之意旨的要旨候補提詞，給予至短句生成AI而令其進行生成，以取得複數個要旨候補。選擇部(103)，係從複數個要旨候補中選擇出1個以上，且以不會從相互排斥之要旨候補中選擇出複數個的方式，來進行選擇。回答文取得部(104)，係藉由將「必須生成以要旨候補為基礎的回答文」之意旨的回答文提詞，給予至文章生成AI而令其進行生成，以取得回答文。提示部(105)，係將已被取得之回答文，提示給回答者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:資訊處理裝置</p>
        <p type="p">101:詢問受理部</p>
        <p type="p">102:要旨候補取得部</p>
        <p type="p">103:選擇部</p>
        <p type="p">104:回答文取得部</p>
        <p type="p">105:提示部</p>
        <p type="p">106:校正部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.png" file="d10003.TIF" giffile="ed10003.png" height="858px" img-content="tif" inline="yes" orientation="portrait" width="381px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621582</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145086</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120260126B">A24F40/40</main-classification>
        <further-classification edition="202001120260126B">A24F40/46</further-classification>
        <further-classification edition="202001120260126B">A24F47/00</further-classification>
        <further-classification edition="200601120260126B">H02H7/00</further-classification>
        <further-classification edition="200601120260126B">H02H7/18</further-classification>
        <further-classification edition="202001120260126B">G01R31/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商ＪＴ國際公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JT INTERNATIONAL SA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普爾科維　達利博爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PURKOVIC, DALIBOR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HR</english-country>
              <english-address>HR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>24214766.8</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於氣溶膠產生裝置的電池單元的感測器組件以及包括其的電池單元</chinese-title>
        <english-title>A SENSOR ASSEMBLY FOR A BATTERY UNIT FOR AN AEROSOL-GENERATING DEVICE AND A BATTERY UNIT COMPRISING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於氣溶膠產生裝置的電池單元(100)的感測器組件(1)包括：電路基板(2)，該電路基板具有安裝表面(2a)；第一感測器(3)，該第一感測器安裝在電路基板(2)的安裝表面(2a)上；第二感測器(4)，該第二感測器在該第一感測器(3)下方安裝在該電路基板(2)的安裝表面(2a)上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A sensor assembly (1) for a battery unit (100) for an aerosol-generating device comprises a circuit substrate (2) presenting a mounting surface (2a), a first sensor (3) mounted on the mounting surface (2a) of the circuit substrate (2); a second sensor (4) mounted on the mounting surface (2a) of the circuit substrate (2) beneath the first sensor (3).</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:感測器組件</p>
        <p type="p">2:電路基板</p>
        <p type="p">3:第一感測器</p>
        <p type="p">4:第二感測器</p>
        <p type="p">5:加強板</p>
        <p type="p">5c:直邊緣部分</p>
        <p type="p">5d:邊緣部分</p>
        <p type="p">6:開口</p>
        <p type="p">7:附加電子構件</p>
        <p type="p">L:縱向方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="914px" img-content="tif" inline="yes" orientation="portrait" width="699px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622408</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145089</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260122B">F16L11/11</main-classification>
        <further-classification edition="200601120260122B">F16L11/127</further-classification>
        <further-classification edition="200601120260122B">F16L11/118</further-classification>
        <further-classification edition="200601120260122B">F16L11/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商沙巴斯工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蓮沼正裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HASUNUMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小林將道</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KOBAYASHI, MASAMICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何秋遠</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-203812</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>連接裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種連接裝置，以避免形成有可伸縮的內部流路的波紋管部發生絕緣擊穿的方式適當進行保護。連接裝置（100）具備：筒狀的殼體部（10），一端側供插頭裝置（200）插入，並且另一端側連接供給配管（P）；閥體部（20），通過與插入於殼體部（10）的插頭裝置（200）接觸，成為液體從插頭裝置（200）向連接裝置（100）流入的開啟狀態；波紋管部（30），形成有可伸縮的內部流路（31），在閥體部（20）為開啟狀態時，向供給配管（P）供給從插頭裝置（200）流入的液體；以及止動件（40），形成從內部流路（31）向供給配管（P）供給液體的供給流路（41），止動件（40）由導電性氟樹脂材料形成，並且與保持為接地電位的接地部（60）導通，該導電性氟樹脂材料含有氟樹脂材料和分散於氟樹脂材料的導電性材料。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼體部</p>
        <p type="p">11:貫通孔</p>
        <p type="p">20:閥體部</p>
        <p type="p">30:波紋管部</p>
        <p type="p">30a:上端部</p>
        <p type="p">31:內部流路</p>
        <p type="p">40:止動件(流路部)</p>
        <p type="p">41:供給流路</p>
        <p type="p">50:彈簧</p>
        <p type="p">60:接地部</p>
        <p type="p">61:主體部</p>
        <p type="p">62:銷部件</p>
        <p type="p">63:固定螺釘</p>
        <p type="p">64:安裝螺釘</p>
        <p type="p">70:配管連接部(流路部)</p>
        <p type="p">71:主體部</p>
        <p type="p">72:緊固螺母</p>
        <p type="p">90:緊固螺栓</p>
        <p type="p">100:連接裝置</p>
        <p type="p">200:插頭裝置</p>
        <p type="p">210:虹吸管</p>
        <p type="p">220:主體部</p>
        <p type="p">221:外螺紋</p>
        <p type="p">230:閥體部</p>
        <p type="p">300:空氣供給裝置</p>
        <p type="p">C:液體收納容器</p>
        <p type="p">C1:開口部</p>
        <p type="p">E:接地電纜</p>
        <p type="p">P:供給配管</p>
        <p type="p">X:軸線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="822px" img-content="tif" inline="yes" orientation="portrait" width="631px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621632</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145148</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260122B">A47L11/40</main-classification>
        <further-classification edition="200601120260122B">A47L11/24</further-classification>
        <further-classification edition="200601120260122B">A47L11/28</further-classification>
        <further-classification edition="202401120260122B">G05D1/648</further-classification>
        <further-classification edition="202401120260122B">G05D1/622</further-classification>
        <further-classification edition="202401120260122B">G05D1/43</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙嘉文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116686217</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔設備控制方法、控制裝置、清潔設備及相關設備</chinese-title>
        <english-title>CONTROL METHOD AND CONTROL APPARATUS FOR CLEANING DEVICE, CLEANING DEVICE, AND RELATED DEVICES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供一種清潔設備控制方法、控制裝置、清潔設備及相關設備，涉及智慧家居技術領域，方法包括：控制清潔設備執行目標任務；在清潔設備執行目標任務的過程中，獲取目標障礙物資訊，目標障礙物為阻礙清潔設備執行目標任務的障礙物；基於目標障礙物資訊，生成目標障礙物移動策略；根據目標障礙物移動策略，對目標障礙物進行移動操作，以繼續執行目標任務。由此可以保證目標任務的順利完成，清潔設備可以自行生成目標障礙物移動策略進行障礙物處理，無需透過報警的方式在用戶的説明下處理障礙物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S110:步驟</p>
        <p type="p">S120:步驟</p>
        <p type="p">S130:步驟</p>
        <p type="p">S140:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="632px" img-content="tif" inline="yes" orientation="portrait" width="636px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623292</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145155</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200901120260202B">H04W52/04</main-classification>
        <further-classification edition="200901120260202B">H04W52/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝孟儒</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIEH, MENG-JU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江建豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, CHIEN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宏霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOU, HUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/953,119</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>功率控制方法和系統</chinese-title>
        <english-title>POWER CONTROL METHOD AND SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種功率控制方法可以包括：當處理裝置在運行時，動態收集該處理裝置的複數個第一指標的資料，其中該複數個第一指標是從代表該處理裝置運行能力的功率表中選擇的；根據該功率表的資料與該收集的複數個第一指標的資料之間的差異生成第一調整值；以及根據該第一調整值更新該處理裝置的功率表。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A power control method can include dynamically collecting data of a plurality of first indices of a processing device when the processing device is operated at runtime, wherein the first plurality of indices are selected from a power table representing operation capacity of the processing device; generating a first adjustment value according to a difference between data of the power table and the collected data of the plurality of first indices; and updating the power table for the processing device according to the first adjustment value.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:功率控制系統</p>
        <p type="p">110:收集器</p>
        <p type="p">120:計算器</p>
        <p type="p">130:調整器</p>
        <p type="p">140:記憶體</p>
        <p type="p">145:功率表</p>
        <p type="p">199:處理裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="618px" img-content="tif" inline="yes" orientation="portrait" width="624px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622747</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145156</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120260202B">G06F12/08</main-classification>
        <further-classification edition="200601120260202B">G06F13/38</further-classification>
        <further-classification edition="200601120260202B">G06F13/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴熙權</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, HEEKWON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金鍾民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GIM, JONGMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭在珉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JUNG, JAEMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加格　穆克什</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GARG, MUKESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔　昌皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, CHANGHO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奇　亮奭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KI, YANG SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/722,849</doc-number>
          <date>20241120</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/195,008</doc-number>
          <date>20250430</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於在計算系統中管理記憶體的系統和方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR MANAGING MEMORY IN COMPUTER SYSTEM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了用於在計算系統中管理記憶體的系統和方法。所述方法包括透過結合耦合到計算快速連結（compute express link，CXL）交換器的兩個或更多實體節點來產生虛擬節點；以及基於兩個或更多實體節點的位址範圍之間的偏移來識別儲存在記憶體中的資料的實體位址。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for managing memory in a computing system are disclosed. The method includes generating a virtual node by combining two or more physical nodes coupled to a compute express link (CXL) switch; and identifying a physical address of data stored in the memory based on an offset between address ranges of the two or more physical nodes.</p>
      </isu-abst>
      <representative-img>
        <p type="p">901、902:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="682px" img-content="tif" inline="yes" orientation="portrait" width="473px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621633</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145167</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260123B">A47L13/258</main-classification>
        <further-classification edition="200601120260123B">A47L11/40</further-classification>
        <further-classification edition="200601120260123B">A47L11/28</further-classification>
        <further-classification edition="200601120260123B">A47L11/24</further-classification>
        <further-classification edition="200601120260123B">A47L5/28</further-classification>
        <further-classification edition="200601120260123B">B25J9/08</further-classification>
        <further-classification edition="200601120260123B">B25J18/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116981881</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024228811247</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>自動清潔設備和自動清潔系統</chinese-title>
        <english-title>AUTOMATIC CLEANING APPARATUS AND AUTOMATIC CLEANING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供了一種自動清潔設備和自動清潔系統，包括設備本體和機械臂，設備本體上設置有倉室，機械臂能夠收納至倉室內，設備本體上設置有多個行走輪，倉室設置在多個行走輪之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application provides an automatic cleaning apparatus and an automatic cleaning system, which include an apparatus body and a robotic arm. The apparatus body is equipped with a compartment, and the robotic arm can be retracted into the compartment. The apparatus body is provided with multiple traveling wheels, and the compartment is located between the multiple traveling wheels.</p>
      </isu-abst>
      <representative-img>
        <p type="p">112:下殼體</p>
        <p type="p">L1:縱向中分線</p>
        <p type="p">L2:橫向中分線</p>
        <p type="p">310:第一主動輪</p>
        <p type="p">320:第二主動輪</p>
        <p type="p">330:從動輪</p>
        <p type="p">400:滾刷組件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10020.JPG" file="ed10020.JPG" height="673px" img-content="tif" inline="yes" orientation="portrait" width="526px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622946</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145173</doc-number>
          <kind></kind>
          <date>114/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201601120260113B">G09G3/32</main-classification>
        <further-classification edition="200601120260113B">G09G5/10</further-classification>
        <further-classification edition="202201120260113B">H05B45/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＸ半導體科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LX SEMICON CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金知煥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JI HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>申允秀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN, YOON SOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金長洙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JANG SU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金尙碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, SANG SUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李相佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, SANG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔鎭鎬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHOI, JIN HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0166584</doc-number>
          <date>20241120</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2025-0056950</doc-number>
          <date>20250430</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>發光二極體顯示驅動電路和包括其的發光二極體顯示裝置</chinese-title>
        <english-title>LED DISPLAY DRIVING CIRCUIT AND LED DISPLAY DEVICE INCLUDING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種發光二極體（LED）顯示驅動電路，包括：通道驅動電路，被配置為向多個LED所連接的多條通道線中的每一條提供通道電流； 掃描驅動電路，包括被配置為選擇性地驅動每條掃描線的多個掃描開關以及在掃描開關關斷時導通並向掃描線提供預充電電壓的多個預充電開關；短路檢測單元，被配置為檢測多個LED是否短路以及短路程度；資料控制器，當檢測到短路LED時在短路LED所連接的目標掃描線的掃描開關關斷時關斷目標掃描線的預充電開關並將目標掃描線維持在浮接狀態；以及亮度補償單元，被配置為補償與短路LED所連接的目標通道線連接的正常LED的亮度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light-emitting diode (LED) display driving circuit includes a channel driving circuit configured to supply a channel current to each of a plurality of channel lines to which a plurality of LEDs are connected, a scan driving circuit including a plurality of scan switches configured to selectively drive each scan line, and a plurality of precharge switches which are turned on when the scan switches are turned off and supply a precharge voltage to the scan lines, a short-circuit detection unit configured to detect whether the plurality of LEDs are short-circuited and a short-circuit degree, a data controller which, when a short-circuited LED is detected, turns off a precharge switch of a target scan line, to which the short-circuited LED is connected, when the scan switch of the target scan line is turned off, and maintains the target scan line in a floating state, and a luminance compensation unit configured to compensate luminance of normal LEDs connected to the target channel line to which the short-circuited LED is connected according to a short-circuit degree of the short-circuited LED.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:LED顯示裝置</p>
        <p type="p">110:顯示面板</p>
        <p type="p">120:顯示驅動電路</p>
        <p type="p">CL1:第一通道線</p>
        <p type="p">CL2:第二通道線</p>
        <p type="p">CL3:第三通道線</p>
        <p type="p">CLm:第m通道線</p>
        <p type="p">SL1:第一掃描線</p>
        <p type="p">SL2:第二掃描線</p>
        <p type="p">SLn:第n掃描線</p>
        <p type="p">DATA:影像資料</p>
        <p type="p">CLK:時脈</p>
        <p type="p">P:像素</p>
        <p type="p">R:紅色子像素</p>
        <p type="p">G:綠色子像素</p>
        <p type="p">B:藍色子像素</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="819px" img-content="tif" inline="yes" orientation="portrait" width="705px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622913</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145229</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
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        <main-classification edition="202201120260210B">G06V20/69</main-classification>
        <further-classification edition="201901120260210B">G16B40/00</further-classification>
        <further-classification edition="202301120260210B">G06N3/098</further-classification>
        <further-classification edition="202401120260210B">G06T5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>擴核生醫科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHERENCE BIOTECH CO. LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白香荷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OVERMAAT, TOBY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　柑丹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FROELIGER, DANIEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林逸崙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, I-LUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/722,766</doc-number>
          <date>20241120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>生物樣本分析系統及生物樣本分析方法</chinese-title>
        <english-title>BIOLOGICAL SAMPLE ANALYSIS SYSTEM AND BIOLOGICAL SAMPLE ANALYSIS METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種生物樣本分析系統及生物樣本分析方法。生物樣本分析系統包含多個成像裝置、多個本地運算裝置、及雲端運算裝置。各成像裝置用來自生物樣本擷取系列影像。各本地運算裝置執行的動作包含以下：自各成像裝置接收系列影像；及使用本地機器學習模型處理系列影像，以通過識別生物樣本的狀態產生分析結果。雲端運算裝置執行以下動作：自多個本地運算裝置接收系列影像與分析結果；依據系列影像與分析結果對雲端機器學習模型進行訓練，以產生優化機器學習模型；及傳輸優化機器學習模型至各本地運算裝置對本地機器學習模型取代、或更新，以形成環式回饋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A biological sample analysis system and a biological sample analysis method. The biological sample analysis system includes a plurality of imaging devices, a plurality of local computing devices, and a cloud computing device. Each imaging device captures a series of images from a biological sample. Actions performed by each local computing device include: receiving the series of images from a corresponding one of the imaging devices; and processing the series of images using a local machine learning model to generate an analysis result. The cloud computing device performs actions including: training a cloud machine learning model based on the series of images and the analysis result from the local computing devices to generate an optimized machine learning model; and transmitting the optimized machine learning model to each local computing device to replace or update the local machine learning model.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100A:生物樣本分析系統</p>
        <p type="p">1:成像裝置</p>
        <p type="p">2:本地運算裝置</p>
        <p type="p">3:雲端運算裝置</p>
        <p type="p">LM:本地機器學習模型</p>
        <p type="p">CM:雲端機器學習模型</p>
        <p type="p">OM:優化機器學習模型</p>
        <p type="p">SI:系列影像</p>
        <p type="p">AR:分析結果</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.png" file="d10010.TIF" giffile="ed10010.png" height="716px" img-content="tif" inline="yes" orientation="portrait" width="929px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623096</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145240</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H01Q15/02</main-classification>
        <further-classification edition="200601120260302B">H03H7/38</further-classification>
        <further-classification edition="200601120260302B">H01Q13/18</further-classification>
        <further-classification edition="200601120260302B">H01Q21/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商凱米塔公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KYMETA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍納裡　卡拉泰　穆罕默德　馬赫迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONARI KALATEH, MOHAMMAD MAHDI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
              <english-address>IR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>默曼尼　哈撒　雅巴迪　撒也　默和穆德　阿鳴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MOMENI HASAN ABADI, SEYED MOHAMAD AMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IR</english-country>
              <english-address>IR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/722,948</doc-number>
          <date>20241120</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/389,753</doc-number>
          <date>20251114</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>增加超穎表面天線性能之調諧電路架構</chinese-title>
        <english-title>A TUNING CIRCUIT ARCHITECTURE TO INCREASE METASURFACE ANTENNA PERFORMANCE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種具有一調諧電路架構之天線及其使用方法。在一些實施例中，一天線包含具有複數個射頻(RF)輻射天線元件之一超穎表面。該複數個天線元件之各者包含一調諧電路，該調諧電路包含一電壓可變電容器、與該電壓可變電容器串聯耦合之一第一固定電容器、及與該電壓可變電容器並聯耦合之一第二固定電容器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An antenna having a tuning circuit architecture and methods for using the same are described. In some embodiments, an antenna includes a metasurface having a plurality of radio-frequency (RF) radiating antenna elements. Each of the plurality of antenna elements includes a tuning circuit including a voltage-variable capacitor, a first fixed capacitor coupled in series with the voltage-variable capacitor, and a second fixed capacitor coupled in parallel with the voltage-variable capacitor.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301:變容器</p>
        <p type="p">310:調諧電路</p>
        <p type="p">312:金屬-絕緣體-金屬(MIM)電容器</p>
        <p type="p">313:金屬-絕緣體-金屬(MIM)電容器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="396px" img-content="tif" inline="yes" orientation="portrait" width="498px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622516</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145245</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">G01R1/073</main-classification>
        <further-classification edition="200601120260202B">H01R13/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商普因特工程有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>POINT ENGINEERING CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴勝浩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, SEUNG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邊聖鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYUN, SUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪昌熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HONG, CHANG HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仲謙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0171502</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>導電性接觸銷、導電性接觸銷陣列以及檢查裝置</chinese-title>
        <english-title>ELECTRO-CONDUCTIVE CONTACT PIN, ELECTRO-CONDUCTIVE CONTACT PIN ARRAY, AND INSPECTION DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種通過對參數進行優化而在將一般粒子乃至於超小型粒子作為對象時的清潔效率得到改善的基板清潔用噴嘴。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="538px" img-content="tif" inline="yes" orientation="portrait" width="676px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621550</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145272</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260220B">A01B69/00</main-classification>
        <further-classification edition="202401120260220B">G05D1/686</further-classification>
        <further-classification edition="202401120260220B">G05D1/622</further-classification>
        <further-classification edition="201001120260220B">G01S5/02</further-classification>
        <further-classification edition="202001120260220B">G01S15/931</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商羅博帝克股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THE ROBOTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜東右</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GANG, DONG WOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梁漢圭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, HAN KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李玟赫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, MIN HYUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧楡喆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOH, YU CHEOL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃志揚</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175714</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基於UWB的自動駕駛農業作業機器人</chinese-title>
        <english-title>ROBOT FOR UWB-BASED FOLLOWING AUTONOMOUS DRIVING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種基於UWB的自動駕駛農業作業機器人。根據本發明一實施例的基於UWB的自動駕駛農業作業機器人包括：UWB遙控器，由使用者攜帶，生成UWB信號並透過使用者輸入用於運行的操作；以及作業機器人，根據從UWB遙控器接收的UWB信號判斷追蹤目標，並透過超聲波模組判斷周圍是否存在障礙物，在駕駛時避讓該障礙物的同時並追蹤該追蹤目標。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A UWB-based autonomous driving agricultural work robot is provided. The UWB-based autonomous driving agricultural work robot according to an embodiment of the present invention includes: a UWB remote controller carried by a user, generating a UWB signal and receiving an operation for driving through a user input; and a work robot determining a tracking target based on the UWB signal received from the UWB remote controller, determining whether there is an obstacle around through an ultrasonic module, and tracking the tracking target while avoiding the obstacle during driving.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:基於UWB的自動駕駛農業作業機器人</p>
        <p type="p">100:機器人本體</p>
        <p type="p">200:UWB遙控器</p>
        <p type="p">112、114:方向指示燈</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.png" file="d10008.TIF" giffile="ed10008.png" height="728px" img-content="tif" inline="yes" orientation="portrait" width="678px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622393</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145281</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260220B">F16C32/04</main-classification>
        <further-classification edition="200601120260220B">H02K7/09</further-classification>
        <further-classification edition="200601120260220B">H02K3/28</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商松下知識產權經營股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>三宅貴史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAKE, TAKAFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高原一晶</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHARA, KAZUAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森元瑛樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIMOTO, EIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鈴木健太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUZUKI, KENTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周宜新</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-208978</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>磁性軸承及無軸承馬達</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在轉子（3）的軸心方向A1上，將定子（2）的第一齒部（222）的位置設為第一齒部位置（220）；將第二齒部（232）的位置設為第二齒部位置（230）；將來自與第一齒部的假想繞組交鏈之轉子的第一磁化部（32）與第二磁化部（33）的至少一方的第一磁通量達到極大值或極小值的第一磁化部的位置設為第一磁化部位置；將來自與第二齒部的假想繞組交鏈之第一磁化部與第二磁化部的至少一方的第二磁通量達到極大值或極小值的第二磁化部的位置設為第二磁化部位置（330）。在控制轉子的軸心方向的位置的狀態下，當第一磁化部位置位於與第一齒部位置相同的位置時，第二磁化部位置不在與第二齒部位置相同的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:無軸承馬達</p>
        <p type="p">2:定子</p>
        <p type="p">3:轉子</p>
        <p type="p">21:框體</p>
        <p type="p">25:馬達繞組</p>
        <p type="p">26:徑向繞組(第一繞組)</p>
        <p type="p">27:推力繞組(第二繞組)</p>
        <p type="p">31:轉子核心</p>
        <p type="p">32:第一磁化部</p>
        <p type="p">33:第二磁化部</p>
        <p type="p">220:第一齒部位置</p>
        <p type="p">222:第一齒部</p>
        <p type="p">230:第二齒部位置</p>
        <p type="p">232:第二齒部</p>
        <p type="p">320:第一磁化部位置</p>
        <p type="p">330:第二磁化部位置</p>
        <p type="p">A11:軸心方向第一側</p>
        <p type="p">A12:軸心方向第二側</p>
        <p type="p">A1:軸心方向</p>
        <p type="p">F1:推力</p>
        <p type="p">M1:磁通量</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="463px" img-content="tif" inline="yes" orientation="portrait" width="669px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623421</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145288</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D64/62</main-classification>
        <further-classification edition="202501120260302B">H10D64/64</further-classification>
        <further-classification edition="202501120260302B">H10D62/832</further-classification>
        <further-classification edition="202501120260302B">H10D62/834</further-classification>
        <further-classification edition="202501120260302B">H10D62/40</further-classification>
        <further-classification edition="202501120260302B">H10D62/60</further-classification>
        <further-classification edition="202601120260302B">H10D80/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商帕天媞股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PATENTIX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>松田慎平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MATSUDA, SHINPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清水悠吏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMIZU, YURI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>髙橋勳</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAKAHASHI, ISAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金子健太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANEKO, KENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-204267</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置、電子機器及系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供對功率裝置等有用且具有優異的電性特性的半導體裝置、電子機器及系統。  &lt;br/&gt;　　[解決手段]使用一種半導體裝置，其包含積層結構體，該積層結構體係在由包含鍺或其混晶作為主成分之結晶性氧化物所構成之第一半導體層上，直接或隔著其他層，積層有具有與前述第一半導體層相同結晶結構之第二半導體層，更包含與前述第二半導體層進行肖特基接合之肖特基電極及與前述第一半導體層進行歐姆接合之歐姆電極，將其應用於例如功率裝置等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">19:成膜裝置</p>
        <p type="p">20:被成膜試料</p>
        <p type="p">21:試料台</p>
        <p type="p">22a:載體氣體源</p>
        <p type="p">22b:稀釋氣體源</p>
        <p type="p">23a:流量調節閥</p>
        <p type="p">23b:流量調節閥</p>
        <p type="p">24:原料隔板</p>
        <p type="p">24a:霧化用原料溶液</p>
        <p type="p">24b:超音波穿透基材</p>
        <p type="p">24c:台</p>
        <p type="p">26:超音波振動子</p>
        <p type="p">27:成膜室</p>
        <p type="p">28:加熱器</p>
        <p type="p">30:霧化裝置</p>
        <p type="p">31:引導隔板</p>
        <p type="p">35:超音波傳播液槽</p>
        <p type="p">36:超音波傳播液</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="490px" img-content="tif" inline="yes" orientation="portrait" width="687px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622666</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145291</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120251231B">G05D1/246</main-classification>
        <further-classification edition="202401120251231B">G05D1/648</further-classification>
        <further-classification edition="201901120251231B">G06F16/29</further-classification>
        <further-classification edition="202201120251231B">G06V10/762</further-classification>
        <further-classification edition="202201120251231B">G06V10/764</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張振東</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, ZHENDONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116776872</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>地圖處理方法、裝置、設備及存儲介質</chinese-title>
        <english-title>MAP PROCESSING METHOD, APPARATUS, DEVICE, AND STORAGE MEDIUM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種地圖處理方法、裝置、設備及存儲介質，涉及智慧家居技術領域，以至少解決展示的清潔設備導航地圖中包括較多與作業導航路線不相關的散點地圖資訊，降低地圖的清晰性、可讀性和美觀性，從而導致用戶使用體驗低的問題。該方法包括：在檢測到清潔設備所處運行環境包括目標物體的情況下，確定目標物體的目標位置資訊；目標物體表徵引起待展示地圖包括與運行環境無關的地圖區域；根據目標位置資訊，確定待展示地圖中與無關的地圖區域的位置；將待展示地圖中的無關的地圖區域刪除，得到用於展示的目標地圖。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a map processing method, apparatus, device, and storage medium, which pertain to the field of smart home technology. It aims to at least solve the problem where the navigation map of cleaning equipment on display includes a significant amount of scattered map information that is irrelevant to the operational navigation route, reducing the clarity, readability, and aesthetics of the map, and thus leading to a poor user experience. The method comprises the following steps: When it is detected that the operating environment of the cleaning equipment includes target objects, determine the target location information of the target objects; the target objects represent factors that cause the map to be displayed to include map areas unrelated to the operating environment; based on the target location information, determine the locations of the unrelated map areas in the map to be displayed; delete the unrelated map areas from the map to be displayed to obtain the target map for display.</p>
      </isu-abst>
      <representative-img>
        <p type="p">S31~S33:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="450px" img-content="tif" inline="yes" orientation="portrait" width="649px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622391</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145304</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260126B">F16C19/06</main-classification>
        <further-classification edition="200601120260126B">F16C33/41</further-classification>
        <further-classification edition="200601120260126B">F16C33/66</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商美倍亞三美股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MINEBEA MITSUMI INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>矢澤永一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAZAWA, EIICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/JP2024/041510</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>保持器及滾珠軸承</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">保持器（2）包括：基部（6），繞軸線x呈環狀；多個柱部（7），自基部（6）沿著軸線x延伸；以及多個袋狀體（8），分別形成於相互鄰接的一對柱部（7）之間。袋狀體（8）收容滾動體（5）。袋狀體（8）包括在軸線x方向上保持滾動體（5）的第一袋狀體（10）、以及在軸線x方向上不保持滾動體（5）的第二袋狀體（20）。多個柱部（7）中的形成第一袋狀體（10）的一對柱部（7）分別在前端部（30a）具有為相互相向且相互平行地延伸的平面的相向平面（31）。相互相向的兩個相向平面（31）的相向方向上的寬度（w1）較滾動體（5）的直徑D小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:滾珠軸承</p>
        <p type="p">2:保持器</p>
        <p type="p">3:內圈</p>
        <p type="p">4:外圈</p>
        <p type="p">5:滾動體</p>
        <p type="p">7:柱部</p>
        <p type="p">8:袋狀體</p>
        <p type="p">x:軸線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="889px" img-content="tif" inline="yes" orientation="portrait" width="697px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623254</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145330</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/159</main-classification>
        <further-classification edition="201401120260102B">H04N19/105</further-classification>
        <further-classification edition="201401120260102B">H04N19/577</further-classification>
        <further-classification edition="201401120260102B">H04N19/146</further-classification>
        <further-classification edition="201401120260102B">H04N19/176</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊政彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, PO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泓輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴貞延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHEN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江嫚書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, MAN-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳渏紋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,651</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/812,437</doc-number>
          <date>20250527</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/135326</doc-number>
          <date>20251117</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>視訊編解碼方法及裝置</chinese-title>
        <english-title>METHODS AND APPARATUS FOR VIDEO CODING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露了一種使用新型基於樣本的預測偏移（Sample-based Prediction Offset，簡稱 SPO）的視訊編解碼方法和裝置。根據一種方法，針對具有多重假設的編解碼系統，SPO基於當前塊的模板區域和位置相關權重（Position-Related Weighting，簡稱 PRW）導出，以細化預測。在一個實施例中，SPO可以應用於最終預測。在另一個實施例中，SPO可以應用於每個多重假設或其中的一部分。在又一種方法中，SPO可以選擇性地應用於最終預測、每個多重假設或其中的一部分。在又一種方法中，SPO和重疊塊運動補償（Overlapped Block Motion Compensation，簡稱 OBMC）均應用於編解碼塊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and apparatus of video coding using new Sample-based Prediction Offset (SPO) are disclosed. According to one method, SPO for coding systems with multiple hypothesis is derived based on a template area of the current block and PRW (Position-Related Weighting) to refine prediction. In one embodiment, SPO can be applied to the final prediction. In another embodiment, SPO can be applied to each of the multiple hypothesis or some of them. In yet another method, the SPO is applied to the final prediction, or each of the multiple hypothesis or some of them selectively. In yet another method, the SPO and OBMC (Overlapped Block Motion Compensation) are both applied to a coding block.</p>
      </isu-abst>
      <representative-img>
        <p type="p">710-760:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.png" file="d10005.TIF" giffile="ed10005.png" height="813px" img-content="tif" inline="yes" orientation="portrait" width="766px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623568</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145331</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P72/00</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＨＰＳＰ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HPSP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白承鎭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, SEUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李忠曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHUNG YEOP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0168297</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>高壓基板處理裝置用氣體箱組件及其運用方法</chinese-title>
        <english-title>GAS BOX ASSEMBLY FOR HIGH PRESSURE SUBSTRATE PROCESSING APPARATUS AND METHOD FOR OPERATING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種高壓基板處理裝置用氣體箱組件及其運用方法。該高壓基板處理裝置用氣體箱組件，可以包括：外殼、氣體導引模組、及吐出阻斷模組。該外殼可具有內部空間及設有用以使外氣流入該內部空間之流入口。該氣體導引模組可配置於該內部空間內，並可具有用以向高壓基板處理裝置之腔室供應製程氣體之供應管線、及用以自該腔室排出腔室氣體之排氣管線中之至少一種。該吐出阻斷模組可被形成為於該內部空間由該製程氣體及該腔室氣體中至少之一產生洩漏氣體時，以阻斷該洩漏氣體經由該流入口吐出至外部。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a gas box assembly for a high pressure substrate processing apparatus and a method for operating the same. The gas box assembly for the high pressure substrate processing apparatus may include: a housing, a gas guiding module, and an exhaust blocking module. The housing may have an internal space and an inlet for allowing external gas to flow into the internal space. The gas guiding module may be disposed within the internal space and may have at least one of a supply pipe for supplying process gas to a chamber of the high pressure substrate processing apparatus and an exhaust pipe for discharging chamber gas from the chamber. The exhaust blocking module may be configured to prevent leaked gas from being discharged to the outside through the inlet when leaked gas is generated in the internal space due to at least one of the process gas and the chamber gas.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:外殼</p>
        <p type="p">160:吐出阻斷模組</p>
        <p type="p">161:阻斷蓋</p>
        <p type="p">163:驅動單元</p>
        <p type="p">165:安裝板</p>
        <p type="p">166:安裝銷</p>
        <p type="p">H:水平方向</p>
        <p type="p">V:垂直方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="326px" img-content="tif" inline="yes" orientation="portrait" width="605px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623522</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145333</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P14/692</main-classification>
        <further-classification edition="200601120260302B">C23C16/448</further-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
        <further-classification edition="200601120260302B">B01J4/00</further-classification>
        <further-classification edition="200601120260302B">B01J7/00</further-classification>
        <further-classification edition="202601120260302B">H10P95/90</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＨＰＳＰ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HPSP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權敬祐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, KYOUNGWOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0168973</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>氣態氧化氫生成組件及其方法、以及基板處理裝置</chinese-title>
        <english-title>GASEOUS HYDROGEN OXIDE GENERATING ASSEMBLY AND METHOD, AND SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明有關於一種氣態氧化氫生成組件及方法，以及基板處理裝置。該氣態氧化氫生成組件可以包括汽化模組及流體供給模組。該汽化模組可以被形成為將液態氧化氫轉化為氣態氧化氫。該流體供給模組可以被形成為於第一供給模式下將該液態氧化氫供給至該汽化模組。該流體供給模組可以被形成為於第二供給模式中，將於第一供給模式進行後殘留於該流體供給模組之該液態氧化氫之殘留分追加供給至該汽化模組。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a gaseous hydrogen oxide generating assembly and method, and a substrate processing apparatus. The gaseous hydrogen oxide generating assembly may include a vaporization module and a fluid supply module. The vaporization module may be configured to convert liquid hydrogen oxide into gaseous hydrogen oxide. The fluid supply module may be configured to supply the liquid hydrogen oxide to the vaporization module in a first supply mode. The fluid supply module may be configured in a second supply mode to additionally supply the residual liquid hydrogen oxide remaining in the fluid supply module after the first supply mode to the vaporization module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板處理裝置</p>
        <p type="p">110:內部腔室</p>
        <p type="p">120:外部腔室</p>
        <p type="p">130:流體供給模組</p>
        <p type="p">131:流體供給裝置</p>
        <p type="p">133:反應氣體管線</p>
        <p type="p">135:保護氣體管線</p>
        <p type="p">140:排氣模組</p>
        <p type="p">141、145:排氣管</p>
        <p type="p">160:汽化模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="733px" img-content="tif" inline="yes" orientation="portrait" width="604px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623250</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145338</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260202B">H04N19/117</main-classification>
        <further-classification edition="201401120260202B">H04N19/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,646</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/134989</doc-number>
          <date>20251114</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>影片編解碼的裝置及其方法</chinese-title>
        <english-title>APPARATUS AND METHODS FOR VIDEO ENCODING AND DECODING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種基於樣本的預測偏移的方法和裝置被揭示。根據該方法，接收與當前圖片中一個或多個區塊相關聯的輸入資料，其中該輸入資料對應於所述一個或多個區塊的殘差資料、預測資料、重建資料或過濾重建資料。將神經網路迴路濾波器（Neural Network Loop Filter，簡稱 NNLF）應用於該輸入資料以生成過濾訊號，其中該 NNLF 使用神經網路（Neural Network；NN）輸入訊號，該 NN 輸入訊號包括側資訊，該側資訊包含通過變換方程導出的邊界強度（Boundary Strength，簡稱 BS）值的變換值，並且該 BS 值是從所述一個或多個區塊中確定的。該過濾訊號被提供以進行進一步的編碼或解碼過程。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for sample-based prediction offset are disclosed. According to the method, input data associated with one or more blocks in a current picture is received, wherein the input data corresponds to residual data, prediction data, reconstructed data, or filtered-reconstructed data for said one or more blocks. Neural Network Loop Filter (NNLF) is applied to the input data to generate a filtered signal, wherein the NNLF uses NN input signal comprising side information including a transformed value of boundary strength (BS) value derived through a transform equation, and wherein the BS value is determined from said one or more blocks. The filtered signal is provided for further encoding or decoding process.</p>
      </isu-abst>
      <representative-img>
        <p type="p">410:步驟</p>
        <p type="p">420:步驟</p>
        <p type="p">430:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="668px" img-content="tif" inline="yes" orientation="portrait" width="653px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622950</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145343</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260219B">G09G3/36</main-classification>
        <further-classification edition="200601120260219B">G09G5/393</further-classification>
        <further-classification edition="200601120260219B">H04N5/57</further-classification>
        <further-classification edition="200601120260219B">G02F1/133</further-classification>
        <further-classification edition="200601120260219B">G02F1/137</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>虹彩光電股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IRIS OPTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺南市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡明良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MING LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊武璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, WU CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖奇璋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, CHI CHANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,912</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示驅動系統及其方法</chinese-title>
        <english-title>DISPLAY DRIVING SYSTEM AND METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容提供一種顯示驅動系統及其方法，包含顯示模組、資料來源模組、驅動參數儲存模組及時序控制模組。顯示模組包含複數畫素單元組，畫素單元組被劃分為複數子畫素單元。資料來源模組包含對應畫素單元組的複數資料訊號。驅動參數儲存模組用以儲存掃描序列清單及補償資訊。掃描序列清單包含對應子畫素單元的次序資訊，補償資訊包含補償模式。時序控制模組依據次序資訊以補償模式選擇資料訊號進行影像補償而產生補償資料訊號，並依據次序資訊、補償資料訊號及未進行影像補償的其餘資料訊號顯示畫面。藉此，使畫面的顯示亮度均勻。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display driving system and a method thereof are proposed. The display driving system includes a display module, a data source module, a driving parameter storing module and a time sequence controlling module. The display module includes a plurality of pixel unit sets, the pixel unit sets are divided into a plurality of sub-pixel units. The data source module includes a plurality of data signals corresponding to the pixel unit sets. The driving parameter storing module is configured to store a scanning sequence list and a compensating information. The scanning sequence list includes a plurality of sequence information, which are corresponding to the sub-pixel units. The compensating information includes a plurality of compensating modes. The time sequence controlling module compensates to at least one of the data signals to generate a compensating data signal according to the sequence information, and display a display screen according to the sequence information, the compensating data signal and other data signal without being compensating. Thus, the display driving system of the present disclosure can display the display screen with even brightness.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:顯示驅動系統</p>
        <p type="p">110:顯示模組</p>
        <p type="p">120:資料來源模組</p>
        <p type="p">121:資料訊號</p>
        <p type="p">130:驅動參數儲存模組</p>
        <p type="p">140:時序控制模組</p>
        <p type="p">C1:補償資訊</p>
        <p type="p">L1:掃描序列清單</p>
        <p type="p">P01,P02,Pn:畫素單元組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.png" file="d10006.TIF" giffile="ed10006.png" height="749px" img-content="tif" inline="yes" orientation="portrait" width="992px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623397</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145368</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/64</main-classification>
        <further-classification edition="202501120260302B">H10D62/824</further-classification>
        <further-classification edition="202501120260302B">H10D62/85</further-classification>
        <further-classification edition="202501120260302B">H10D64/23</further-classification>
        <further-classification edition="202501120260302B">H10D64/27</further-classification>
        <further-classification edition="202501120260302B">H10H29/01</further-classification>
        <further-classification edition="202501120260302B">H10H20/832</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>權俊榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWON, JUNYOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>兪貞恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, JOUNGEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李殷奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, EUNKYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0172763</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置、製造其之方法及包括該半導體裝置的電子裝置</chinese-title>
        <english-title>SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR DEVICE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種半導體裝置，其包括：一通道層，其包括一凡得瓦材料；一源極電極結構及一汲極電極結構，其分別電氣連接至該通道層之相對端部；一閘極絕緣層，其在該通道層上；以及一閘極電極，其在該閘極絕緣層上；其中該源極電極結構及該汲極電極結構中之各者包括：一中間層，其包括一摻雜劑以及一半導體或一絕緣體中之一者；以及一金屬層，其在該中間層上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor device includes a channel layer including a van der Waals material, a source electrode structure and a drain electrode structure electrically connected to opposite ends of the channel layer, respectively, a gate insulating layer on the channel layer, and a gate electrode on the gate insulating layer, wherein each of the source electrode structure and the drain electrode structure includes an interlayer including a dopant and one of a semiconductor or an insulator, and a metal layer on the interlayer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10,30:中間層</p>
        <p type="p">20,40:金屬層</p>
        <p type="p">100:半導體裝置</p>
        <p type="p">110:基體</p>
        <p type="p">120:通道層</p>
        <p type="p">120s:頂部表面</p>
        <p type="p">160:閘極絕緣層</p>
        <p type="p">170:源極電極結構</p>
        <p type="p">180:汲極電極結構</p>
        <p type="p">190:閘極電極</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="478px" img-content="tif" inline="yes" orientation="portrait" width="693px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623220</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145372</doc-number>
          <kind></kind>
          <date>114/11/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201301120251203B">H04B10/25</main-classification>
        <further-classification edition="200601120251203B">G02B6/24</further-classification>
        <further-classification edition="200601120251203B">G02B6/12</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>合聖科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AUTHENX INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林聖富</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, SHENG-FU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張正陽</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JENQ-YANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍茂仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, MAO-JEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許志銘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,635</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/745,916</doc-number>
          <date>20250116</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>63/827,476</doc-number>
          <date>20250620</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多通道光纖傳輸界面及其製造方法</chinese-title>
        <english-title>MULTI-CHANNEL OPTICAL FIBER TRANSMISSION INTERFACE AND MANUFACTURING METHOD OF THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">多通道光纖傳輸界面包含多條光纖、光纖陣列單元、光子積體電路、第一透鏡陣列以及第二透鏡陣列。光纖陣列單元配置以連接光纖。光纖陣列單元包含收發端面。光子積體電路包含光柵耦合器陣列。光纖陣列單元的收發端面朝向光柵耦合器陣列。第一透鏡陣列位在光柵耦合器陣列與光纖陣列單元之間並配置以連接光纖陣列單元的收發端面。第二透鏡陣列位在光柵耦合器陣列與第一透鏡陣列之間。第二透鏡陣列與第一透鏡陣列相對並配置以調整光線的準直與對位。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-channel optical fiber transmission interface includes multiple optical fibers, an optical fiber array unit, a photonic integrated circuit, a first lens array, and a second lens array. The optical fiber array unit is configured to connect the optical fibers. The optical fiber array unit includes a transceiver end surface. The photonic integrated circuit includes a grating coupler array. The transceiver end surface of the optical fiber array unit faces the grating coupler array. The first lens array is located between the grating coupler and the optical fiber array unit and is configured to connect the transceiver end surface of the optical fiber array unit. The second lens array is located between the grating coupler array and the first lens array. The second lens array is opposite to the first lens array and is configured to adjust the collimation and alignment of the light.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:光纖</p>
        <p type="p">120:光纖陣列單元</p>
        <p type="p">122:收發端面</p>
        <p type="p">130:光子積體電路</p>
        <p type="p">132:光柵耦合器陣列</p>
        <p type="p">140:第一透鏡陣列</p>
        <p type="p">142:第一調光元件</p>
        <p type="p">144:基底</p>
        <p type="p">146:第一表面</p>
        <p type="p">148:第三表面</p>
        <p type="p">150:第二透鏡陣列</p>
        <p type="p">152:第二調光元件</p>
        <p type="p">154:基底</p>
        <p type="p">156:第二表面</p>
        <p type="p">158:第四表面</p>
        <p type="p">160:耦接結構</p>
        <p type="p">170:第一光學塗層</p>
        <p type="p">DIA:寬度</p>
        <p type="p">P1:第一間距</p>
        <p type="p">P2:第二間距</p>
        <p type="p">P3:光纖間距</p>
        <p type="p">P4:耦合器間距</p>
        <p type="p">CS:距離</p>
        <p type="p">C1:光纖核心</p>
        <p type="p">C2,C3:相位中心</p>
        <p type="p">C4:收發中心</p>
        <p type="p">L1:入射光束</p>
        <p type="p">L2:準直光束</p>
        <p type="p">L3:接收光束</p>
        <p type="p">D2:垂直方向</p>
        <p type="p">D1:水平方向</p>
        <p type="p">R1:透鏡區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.png" file="d10023.TIF" giffile="ed10023.png" height="730px" img-content="tif" inline="yes" orientation="portrait" width="1014px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622312</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145434</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260122B">D06F58/02</main-classification>
        <further-classification edition="200601120260122B">D06F58/26</further-classification>
        <further-classification edition="200601120260122B">D06F58/20</further-classification>
        <further-classification edition="200601120260122B">B01D53/00</further-classification>
        <further-classification edition="200601120260122B">B01D53/04</further-classification>
        <further-classification edition="200601120260122B">B01D53/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>段傳林</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DUAN, CHUANLIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, ZHE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周永飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHOU, YONGFEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林翔</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, XIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117452230</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229446984</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>烘乾裝置以及衣物處理設備</chinese-title>
        <english-title>DRYING DEVICE AND LAUNDRY PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請涉及一種烘乾裝置以及衣物處理設備。該烘乾裝置包括吸濕除濕模組、加熱組件、熱泵模組，熱泵模組包括依次連接的蒸發器和冷凝器，吸濕除濕模組具有除濕區以及脫附區，吸濕除濕模組的除濕區設置於蒸發器和冷凝器之間或者冷凝器的下游，加熱組件、吸濕除濕模組的脫附區、蒸發器依次連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a drying device and a laundry processing apparatus. The drying device includes a moisture-absorption and dehumidification module, a heating component and a heat pump module; the heat pump module includes an evaporator and a condenser which are connected in sequence; the moisture-absorption and dehumidification module has a dehumidification area and a desorption area; the dehumidification area of the moisture-absorption and dehumidification module is arranged between the evaporator and the condenser or downstream of the condenser; and the heating component, the desorption area of the moisture-absorption and dehumidification module and the evaporator are connected in sequence.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:筒體</p>
        <p type="p">4112:除濕區</p>
        <p type="p">4113:脫附區</p>
        <p type="p">442:加熱件</p>
        <p type="p">443:第一引風件</p>
        <p type="p">5:蒸發器</p>
        <p type="p">51:第一蒸發通道</p>
        <p type="p">52:第二蒸發通道</p>
        <p type="p">6:冷凝器</p>
        <p type="p">7:第二引風件</p>
        <p type="p">8:壓縮機</p>
        <p type="p">9:節流件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="821px" img-content="tif" inline="yes" orientation="portrait" width="725px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623685</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145435</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W72/50</main-classification>
        <further-classification edition="202601120260302B">H10P34/42</further-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＰＳＫ控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSK HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鐘範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONGBUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張東鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, DONG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹星進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0167929</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體封裝體及半導體封裝體的重佈線製程執行方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種半導體封裝體及包括其的重佈線製程執行方法。根據本發明的一實施例的重佈線製程執行方法，包括：利用紫外雷射對設置於絕緣層的上部的第一金屬層進行鑽孔的步驟；利用紫外雷射對設置於第一金屬層的下部的絕緣層中的一部分進行蝕刻的步驟；及利用電漿對所述絕緣層的殘餘部分進行蝕刻的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:重佈線製程執行方法</p>
        <p type="p">S110、S120、S130、S140:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="662px" img-content="tif" inline="yes" orientation="portrait" width="615px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621623</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145437</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260123B">A47L11/24</main-classification>
        <further-classification edition="200601120260123B">A47L11/40</further-classification>
        <further-classification edition="200601120260123B">A47L13/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024228545709</doc-number>
          <date>20241121</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024116789923</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔設備以及清潔系統</chinese-title>
        <english-title>CLEANING DEVICE AND CLEANING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種清潔設備以及清潔系統，涉及清潔機器人技術領域，用於提高清潔設備殼體內空間的利用率，以保證清潔設備體積的小型化。清潔設備包括殼體、清潔組件以及儲液箱，殼體內部形成有容納空間。清潔組件設置於容納空間內，清潔組件至少包括拖布驅動模組，拖布驅動模組用於連接和控制容納空間外部的拖布運動，以對待清潔面清潔。儲液箱設置於容納空間內，儲液箱的至少部分位於清潔組件的下方。本申請中的清潔設備用於清潔待清潔面。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application discloses a cleaning device and a cleaning system, which relate to the technical field of cleaning robots and are used to improve the space utilization inside the housing of the cleaning device, thereby ensuring the miniaturization of the cleaning device's volume. The cleaning device includes a housing, a cleaning assembly, and a liquid storage tank. The housing internally forms an accommodation space. The cleaning assembly is disposed within the accommodation space and includes at least a mop driving module, which is used to connect and control a mop located outside the accommodation space to clean the surface to be cleaned. The liquid storage tank is disposed within the accommodation space, with at least a portion of it located below the cleaning assembly. The cleaning device described in this application is used for cleaning the surface to be cleaned.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:儲液箱</p>
        <p type="p">A:出液通道</p>
        <p type="p">A1:溢液通道</p>
        <p type="p">A11:第一溢液通道</p>
        <p type="p">A12:第二溢液通道</p>
        <p type="p">A2:排液通道</p>
        <p type="p">B:進液通道</p>
        <p type="p">31:第一箱體部</p>
        <p type="p">311:遠端子箱體</p>
        <p type="p">312:承載子箱體</p>
        <p type="p">3121:馬達子箱體</p>
        <p type="p">3122:傳動子箱體</p>
        <p type="p">313:連接子箱體</p>
        <p type="p">32:第二箱體部</p>
        <p type="p">321:第一壁板</p>
        <p type="p">322:第二壁板</p>
        <p type="p">3221:第一承載件</p>
        <p type="p">c:避讓空間</p>
        <p type="p">3222:第二承載件</p>
        <p type="p">33:第一連接件</p>
        <p type="p">34:第二連接件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="515px" img-content="tif" inline="yes" orientation="portrait" width="642px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623501</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145440</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260211B">H10K85/50</main-classification>
        <further-classification edition="202301120260211B">H10K71/60</further-classification>
        <further-classification edition="202301120260211B">H10K30/82</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商大倉工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKURA INDUSTRIAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>谷澤克也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TANIZAWA, KATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>富田武蔵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMIDA, MUSASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207892</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積層體、光電轉換元件、積層體的製造方法及光電轉換元件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種可抑制電極及電子傳輸層的劣化且能夠輸出高的電流值或電壓值的積層體、光電轉換元件、積層體的製造方法及光電轉換元件的製造方法。一種積層體，用於積層包含具有鈣鈦礦晶體結構的鈣鈦礦化合物的光電轉換層50而形成光電轉換元件1，所述積層體具有：基板10、積層於基板10上的電極20、以及積層於電極20上的電子傳輸層30，電子傳輸層30含有半導體微粒與水分散系樹脂。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:光電轉換元件</p>
        <p type="p">2:積層體</p>
        <p type="p">10:基板</p>
        <p type="p">20:第一電極(電極)</p>
        <p type="p">30:電子傳輸層</p>
        <p type="p">40:多孔質層</p>
        <p type="p">50:光電轉換層</p>
        <p type="p">60:電洞傳輸層</p>
        <p type="p">70:第二電極</p>
        <p type="p">80:配線層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="389px" img-content="tif" inline="yes" orientation="portrait" width="554px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622321</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145448</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120251226B">D06F58/34</main-classification>
        <further-classification edition="200601120251226B">D06F58/24</further-classification>
        <further-classification edition="200601120251226B">D06F58/26</further-classification>
        <further-classification edition="200601120251226B">D06F58/20</further-classification>
        <further-classification edition="202001320251226B">D06F105/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117450610</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229438174</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>烘乾裝置、衣物處理設備及其控制方法</chinese-title>
        <english-title>DRYING DEVICE, LAUNDRY PROCESSING APPARATUS AND CONTROL METHOD THEREFOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請屬於電器設備技術領域，具體涉及烘乾裝置以及衣物處理設備。烘乾裝置包括具有除濕區和脫附區的吸濕除濕模組，包括壓縮機、節流部件、蒸發器和冷凝器的熱泵模組，加熱組件和冷卻器。沿氣流方向，蒸發器、吸濕除濕模組的除濕區以及冷凝器依次連接，吸濕除濕模組的脫附區、冷卻器和加熱組件依次循環連接；壓縮機具有輸出部和輸入部，壓縮機的輸出部、冷凝器和節流部件依次連接，節流部件可被控制地和冷卻器以及蒸發器中的至少一個連接，冷卻器和蒸發器均和壓縮機的輸入部連接，以使烘乾裝置執行熱泵除濕和吸濕除濕模組除濕的至少一者。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a field of electrical equipment, and particularly to a drying device and a laundry processing apparatus. The drying device includes a moisture-absorption and dehumidification module having a dehumidification area and a desorption area, a heat pump module having a compressor, a throttling member, an evaporator and a condenser, a heating component and a cooler. Along an airflow direction, the evaporator, the dehumidification area of the moisture-absorption and dehumidification module and the condenser are connected in sequence, and the desorption area of the moisture-absorption and dehumidification module, the cooler and the heating component are connected in a sequential loop. The compressor has an output portion and an input portion, and the output portion of the compressor, the condenser, and the throttling member are connected in sequence. The throttling member is controllably connected to at least one of the cooler or the evaporator, and both the cooler and the evaporator are connected to the input portion of the compressor, so that the drying device performs at least one of dehumidification by the heat pump module or dehumidification by the moisture-absorption and dehumidification module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:筒體</p>
        <p type="p">41:吸濕除濕模組</p>
        <p type="p">442:加熱件</p>
        <p type="p">443:第一引風件</p>
        <p type="p">5:蒸發器</p>
        <p type="p">6:冷凝器</p>
        <p type="p">7:冷卻器</p>
        <p type="p">8:壓縮機</p>
        <p type="p">9:節流部件</p>
        <p type="p">10:第二引風件</p>
        <p type="p">11:過濾件</p>
        <p type="p">12:第一閥體</p>
        <p type="p">13:第二閥體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="536px" img-content="tif" inline="yes" orientation="portrait" width="611px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622933</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145474</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G09G3/00</main-classification>
        <further-classification edition="200601120260226B">G09G3/20</further-classification>
        <further-classification edition="201601120260226B">G09G3/3208</further-classification>
        <further-classification edition="201301120260226B">G09G3/296</further-classification>
        <further-classification edition="201601120260226B">G09G3/3291</further-classification>
        <further-classification edition="200601120260226B">G09G3/36</further-classification>
        <further-classification edition="200601120260226B">H03K17/00</further-classification>
        <further-classification edition="200601120260226B">H03K19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＬＸ半導體科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LX SEMICON CO.,LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂成大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, SUNG DAE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳尙德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YU, SANG DUK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0167848</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示設備及其控制方法</chinese-title>
        <english-title>DISPLAY APPARATUS AND METHOD FOR CONTROLLING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種根據本發明的一個實施例的顯示裝置包括：閘極驅動電路，從時序控制器接收第一電位電壓或第二電位電壓並輸出特定電壓；第一升壓電路，基於在第一段中接收的第一賦能訊號來判斷是否執行控制特定電壓的操作；第二升壓電路，基於在第二段中接收的第二賦能訊號來判斷是否執行控制特定電壓的操作；以及顯示面板，由第一升壓電路或第二升壓電路的選擇性操作控制的特定電壓被施加到該顯示面板上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A display device according to one embodiment of the present invention includes: a gate driving circuit that receives a first level voltage or a second level voltage from a timing controller and outputs a specific voltage; a first booster circuit that determines whether to perform an operation of controlling the specific voltage based on a first enable signal received in a first section; a second booster circuit that determines whether to perform an operation of controlling the specific voltage based on a second enable signal received in a second section; and a display panel to which the specific voltage controlled by a selective operation of the first booster circuit or the second booster circuit is applied.</p>
      </isu-abst>
      <representative-img>
        <p type="p">300:時序控制器</p>
        <p type="p">310:閘極驅動電路</p>
        <p type="p">320:第一升壓電路</p>
        <p type="p">321:第一感測器</p>
        <p type="p">322:第一位準偏移器</p>
        <p type="p">323:電晶體</p>
        <p type="p">330:第二升壓電路</p>
        <p type="p">331:第二感測器</p>
        <p type="p">332:第二位準偏移器</p>
        <p type="p">340:顯示面板</p>
        <p type="p">T-CON:時序控制器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="651px" img-content="tif" inline="yes" orientation="portrait" width="880px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623534</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145501</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P50/20</main-classification>
        <further-classification edition="202601120260302B">H10P14/60</further-classification>
        <further-classification edition="200601120260302B">H05H1/46</further-classification>
        <further-classification edition="200601120260302B">G05D16/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小野寺忍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ONODERA, SHINOBU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207631</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>資訊處理方法、資訊處理裝置及電腦程式</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠選擇是否要將基板處理裝置所進行之製程之設定條件切換為使用模型更新所得之更新條件的資訊處理方法等。  &lt;br/&gt;本實施方式之資訊處理裝置獲取基板處理裝置所進行之製程之設定條件；使用針對製程之設定條件導出更新上述設定條件所得之更新條件之模型，獲取更新所獲取之設定條件所得之更新條件。又，資訊處理裝置藉由模擬而獲取第1模擬結果及第2模擬結果，上述第1模擬結果表示進行基於上述設定條件之製程之情形時基板處理裝置之動作狀態，上述第2模擬結果表示進行基於上述更新條件之製程之情形時基板處理裝置之動作狀態；輸出所獲取之第1模擬結果及第2模擬結果。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">2:控制部</p>
        <p type="p">2a1:處理部</p>
        <p type="p">2a2:記憶部</p>
        <p type="p">2a3:通信介面</p>
        <p type="p">2aa:記憶媒體</p>
        <p type="p">2M:最佳化模型</p>
        <p type="p">2P:程式</p>
        <p type="p">2R:製程配方資料</p>
        <p type="p">41:壓力調整閥</p>
        <p type="p">50:壓力閥控制裝置</p>
        <p type="p">51:通信部</p>
        <p type="p">52:開度算出部</p>
        <p type="p">53:記憶部</p>
        <p type="p">54:開度控制部</p>
        <p type="p">60:壓力感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="634px" img-content="tif" inline="yes" orientation="portrait" width="983px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622528</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145526</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G01R31/28</main-classification>
        <further-classification edition="202601120260302B">H10P74/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商泰克元股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TECHWING, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅閏成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN SUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>平謹榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0167789</doc-number>
          <date>20241121</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2025-0176865</doc-number>
          <date>20251120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於測試電子元件的處理機</chinese-title>
        <english-title>HANDLER FOR TESTING ELECTRONIC COMPONENTS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於能處理晶片及晶圓的處理機。&lt;br/&gt;  本發明的處理機能使用一個測試台支援針對單顆形式電子元件的測試或支援針對晶圓狀態電子元件的測試。&lt;br/&gt;  依據本發明，能節省用於測試電子元件的系統的建置成本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:測試區</p>
        <p type="p">200:重新配置區</p>
        <p type="p">300:第一供應回收區</p>
        <p type="p">400:第二供應回收區</p>
        <p type="p">500:測試台</p>
        <p type="p">600:搬運穿梭機</p>
        <p type="p">610:搬運台</p>
        <p type="p">710:第一拾取機械手</p>
        <p type="p">720:第二拾取機械手</p>
        <p type="p">730:晶圓裝卸器</p>
        <p type="p">740:移動機構</p>
        <p type="p">800:重新配置機構</p>
        <p type="p">900:控制器</p>
        <p type="p">A1:第一領域</p>
        <p type="p">A2:第二領域</p>
        <p type="p">CT:客戶托盤</p>
        <p type="p">TB:測試板</p>
        <p type="p">TH:用於測試電子元件的處理機</p>
        <p type="p">TS:重新配置空間</p>
        <p type="p">RS:重新配置空間</p>
        <p type="p">X:軸</p>
        <p type="p">Y:軸</p>
        <p type="p">Z:軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.png" file="d10011.TIF" giffile="ed10011.png" height="592px" img-content="tif" inline="yes" orientation="portrait" width="675px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623135</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145530</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260127B">H01S3/03</main-classification>
        <further-classification edition="202301120260127B">H01S3/08</further-classification>
        <further-classification edition="200601120260127B">H01S3/105</further-classification>
        <further-classification edition="201401120260127B">B23K26/064</further-classification>
        <further-classification edition="200601120260127B">G02B5/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三菱電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUBISHI ELECTRIC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本達也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TATSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田所譲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TADOKORO, YUZURU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>川島拓也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWASHIMA, TAKUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207717</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>雷射裝置、雷射加工裝置、以及電子元件的製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">雷射裝置100，具有：殼體1；諧振腔2，用於放大和輸出雷射光；透光窗6，通過從諧振腔2所輸出的雷射光；以及，電極11、12，在垂直於雷射光的光軸L的方向上保持間隔並且成對地配置。諧振腔2，至少一部分包含鑽石構件，並且具有：將放大的雷射光輸出至外部的部分反射鏡3、以及與部分反射鏡3相隔配置用以反射雷射光的全反射鏡4。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:殼體</p>
        <p type="p">2:諧振腔</p>
        <p type="p">3:部分反射鏡</p>
        <p type="p">4:全反射鏡</p>
        <p type="p">5:折返反射鏡</p>
        <p type="p">6:透光窗</p>
        <p type="p">11,12:電極</p>
        <p type="p">13:熱交換器</p>
        <p type="p">14:風扇</p>
        <p type="p">100:雷射裝置</p>
        <p type="p">L:光軸</p>
        <p type="p">F&lt;sub&gt;1&lt;/sub&gt;,F&lt;sub&gt;2&lt;/sub&gt;:氣體流方向</p>
        <p type="p">S:放電區域</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.JPG" file="ed10028.JPG" height="896px" img-content="tif" inline="yes" orientation="portrait" width="712px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621624</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145539</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260123B">A47L11/24</main-classification>
        <further-classification edition="200601120260123B">A47L11/40</further-classification>
        <further-classification edition="200601120260123B">H05K7/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐洪亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, HONGLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116789656</doc-number>
          <date>20241121</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024228520947</doc-number>
          <date>20241121</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔設備及清潔系統</chinese-title>
        <english-title>A CLEANING DEVICE AND A CLEANING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露公開了一種清潔設備及清潔系統，涉及清潔機器人技術領域。清潔設備可以提升清潔設備的散熱效率，有利於提升清潔設備的性能。該清潔設備包括：移動平臺、殼體、處理組件和氣流發生器。其中，移動平臺被配置為在待清潔區域自移動；殼體設置在移動平臺上，沿移動平臺的行進方向，殼體的前端內具有散熱風道；處理組件設置在散熱風道內；氣流發生器設置在散熱風道內，氣流發生器用於帶動散熱風道內的氣體流動。該清潔設備用於自動清理待清理區域。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure discloses a cleaning device and a cleaning system, concerning to the technical field of cleaning robots. The cleaning device can improve the heat dissipation efficiency of the cleaning device, which is beneficial for enhancing its performance. The cleaning device comprises: a mobile platform, a housing, a processing assembly, and an airflow generator. The mobile platform is configured to move autonomously in an area to be cleaned. The housing is arranged on the mobile platform, and a front end of the housing along the traveling direction of the mobile platform is provided with a heat dissipation air duct inside. The processing assembly is disposed within the heat dissipation air duct. The airflow generator is arranged within the heat dissipation air duct and is configured to drive the gas inside the heat dissipation air duct to flow. The cleaning device is used for automatically cleaning the area to be cleaned.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:第二容置腔</p>
        <p type="p">2:散熱風道</p>
        <p type="p">21:主風道</p>
        <p type="p">22:第一容置腔</p>
        <p type="p">221:驅動腔</p>
        <p type="p">222:擺動腔</p>
        <p type="p">23:第二氣流口</p>
        <p type="p">3:處理組件</p>
        <p type="p">31:第一電路板</p>
        <p type="p">32:第二電路板</p>
        <p type="p">4:氣流發生器</p>
        <p type="p">8:散熱件</p>
        <p type="p">9:屏蔽件</p>
        <p type="p">Z:厚度方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="377px" img-content="tif" inline="yes" orientation="portrait" width="629px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623395</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145572</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202501120260302B">H10D30/60</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山崎舜平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAZAKI, SHUNPEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>神保安弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JINBO, YASUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方堂涼太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HODO, RYOTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠藤俊弥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ENDO, TOSHIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畑勇気</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATA, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荒井隆弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARAI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林怡芳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>童啓哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207955</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種工作速度快的半導體裝置。該半導體裝置包括氧化物半導體、氧化物半導體上的彼此分離的第一導電體及第二導電體、與第一導電體的頂面的一部分接觸的第三導電體、與第二導電體的頂面的一部分接觸的第四導電體、配置在第三導電體及第四導電體上並包括與第三導電體和第四導電體間的區域重疊的開口部的第一絕緣體、配置在第一絕緣體的開口部內並與第一導電體的頂面的其他一部分及第二導電體的頂面的其他一部分接觸的第二絕緣體、配置在第一絕緣體的開口部內的第三絕緣體以及在第一絕緣體的開口部內配置在第三絕緣體上的第五導電體，第一導電體和第二導電體之間的距離小於第三導電體和第四導電體之間的距離，氧化物半導體包含銦，第一導電體及第二導電體都包含導電性氧化物。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">200:電晶體</p>
        <p type="p">205:導電體</p>
        <p type="p">212:絕緣體</p>
        <p type="p">214:絕緣體</p>
        <p type="p">216:絕緣體</p>
        <p type="p">221:絕緣體</p>
        <p type="p">222:絕緣體</p>
        <p type="p">224:絕緣體</p>
        <p type="p">230:氧化物半導體</p>
        <p type="p">240a:導電體</p>
        <p type="p">240b:導電體</p>
        <p type="p">241a:絕緣體</p>
        <p type="p">241b:絕緣體</p>
        <p type="p">242a:導電體</p>
        <p type="p">242a1:導電體</p>
        <p type="p">242a2:導電體</p>
        <p type="p">242b:導電體</p>
        <p type="p">242b1:導電體</p>
        <p type="p">242b2:導電體</p>
        <p type="p">250:絕緣體</p>
        <p type="p">255:絕緣體</p>
        <p type="p">260:導電體</p>
        <p type="p">271a:絕緣體</p>
        <p type="p">271b:絕緣體</p>
        <p type="p">275:絕緣體</p>
        <p type="p">280:絕緣體</p>
        <p type="p">282:絕緣體</p>
        <p type="p">283:絕緣體</p>
        <p type="p">285:絕緣體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="459px" img-content="tif" inline="yes" orientation="portrait" width="500px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623228</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145586</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260218B">H04L25/03</main-classification>
        <further-classification edition="200601120260218B">H04L25/49</further-classification>
        <further-classification edition="200601120260218B">H04L1/12</further-classification>
        <further-classification edition="200601120260218B">H03F1/32</further-classification>
        <further-classification edition="200601120260218B">H03F3/45</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRONICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴宗源</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JOUNG WON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金載燮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JAEHYUP</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姜大顯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANG, DAE HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林孟閱</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧姵君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳怡如</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,880</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>19/245,252</doc-number>
          <date>20250620</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>失真緩解的系統及其方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR DISTORTION MITIGATION THEREOF</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種失真緩解的系統及其方法。在一些實施例中，系統包括：發射器，發射器包括：脈衝振幅調變驅動器電路。脈衝振幅調變驅動器電路可包括主驅動器，主驅動器包括最高有效位元（most significant bit，MSB）放大器以及最低有效位元（least significant bit，LSB）放大器。LSB放大器可包括上臂和下臂，上臂的強度或下臂的強度是可調整的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for distortion mitigation thereof. In some embodiments, a system, includes: a transmitter, including: a pulse amplitude modulation driver circuit. The pulse amplitude modulation driver circuit may include a main driver including a most significant bit (MSB) amplifier, and a least significant bit (LSB) amplifier. The LSB amplifier may include an upper arm and a lower arm, a strength of the upper arm or a strength of the lower arm being adjustable.</p>
      </isu-abst>
      <representative-img>
        <p type="p">505、510:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="376px" img-content="tif" inline="yes" orientation="portrait" width="805px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622154</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145606</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260206B">C08G73/10</main-classification>
        <further-classification edition="200601120260206B">C08K5/18</further-classification>
        <further-classification edition="200601120260206B">C08F2/06</further-classification>
        <further-classification edition="200601120260206B">H05K3/16</further-classification>
        <further-classification edition="200601120260206B">C08J5/22</further-classification>
        <further-classification edition="200601120260206B">B32B27/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商聚醯亞胺尖端素材有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PI ADVANCED MATERIALS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金烔暎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, DONG YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>田珍碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JEON, JIN SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白承烈</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BACK, SUNG YUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂文眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YEO, MOON JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡洙京</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, SU KYUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>元東榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WON, DONG YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江日舜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175899</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>聚醯亞胺膜及柔性電路板</chinese-title>
        <english-title>Polyimide Film and Flexible Circuit Board</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種聚醯亞胺膜及柔性電路板，所述聚醯亞胺膜基於使用傅立葉變換紅外（FT-IR）光譜的分析結果，通過滿足以下運算式1從而具有改善的黏附性：[運算式1] A/B＞1，在上述運算式1中，A為基於FT-IR分析在約1470 cm&lt;sup&gt;-1&lt;/sup&gt;處的吸光度強度，以及B為基於FT-IR分析在約1455 cm&lt;sup&gt;-1&lt;/sup&gt;處的吸光度強度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無。</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621599</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145612</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260213B">A46B9/02</main-classification>
        <further-classification edition="200601120260213B">A47L9/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商深圳洛克創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHENZHEN ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>夏良紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIA, LIANGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116937446</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024228787252</doc-number>
          <date>20241122</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>清潔設備刷頭、清潔設備和清潔系統</chinese-title>
        <english-title>BRUSH HEAD OF CLEANING DEVICE, CLEANING DEVICE AND CLEANING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及一種清潔設備刷頭、清潔設備和清潔系統，其中清潔設備刷頭包括：主體部，包括吸風口；滾刷，設置於所述主體部，並能夠相對於所述主體部旋轉；梳齒，安裝於所述主體部，所述梳齒包括多個沿第一方向排布的齒部，且至少部分所述齒部的延伸方向與所述第一方向之間具有第一銳角；其中，所述第一方向為所述滾刷的軸線方向。該清潔設備刷頭具有較好的防纏繞能力。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a brush head of a cleaning device, a cleaning device, and a cleaning system. The brush head of the cleaning device includes: a main body portion including an air intake port; a roller brush arranged in the main body portion and capable of rotating relative to the main body portion; and comb teeth mounted to the main body portion. The comb teeth include a plurality of tooth portions arranged along a first direction, and a first acute angle is formed between an extension direction of at least a part of the tooth portions and the first direction. The first direction is an axial direction of the roller brush. The brush head of the cleaning device has good anti-tangle capability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:主體部</p>
        <p type="p">11:吸風口</p>
        <p type="p">14:吸風口的中心線</p>
        <p type="p">3:梳齒</p>
        <p type="p">31:齒部</p>
        <p type="p">32:第一齒組</p>
        <p type="p">33:第二齒組</p>
        <p type="p">34:第三齒組</p>
        <p type="p">35:第四齒組</p>
        <p type="p">36:第五齒組</p>
        <p type="p">37:第六齒組</p>
        <p type="p">X:第一方向</p>
        <p type="p">Y:第二方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="630px" img-content="tif" inline="yes" orientation="portrait" width="679px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623255</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145620</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/159</main-classification>
        <further-classification edition="201401120260102B">H04N19/182</further-classification>
        <further-classification edition="201401120260102B">H04N19/577</further-classification>
        <further-classification edition="201401120260102B">H04N19/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, PO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊政彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳泓輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HONG-HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江嫚書</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIANG, MAN-SHU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴貞延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHEN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="11">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳渏紋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/723,653</doc-number>
          <date>20241122</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/761,219</doc-number>
          <date>20250221</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/134854</doc-number>
          <date>20251114</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>視訊編解碼方法和裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR VIDEO CODING</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種視訊編解碼方法和裝置。根據該方法，首先決定當前區塊的模板區域。然後，對該模板樣本集決定位置相關權重（position-related weight，簡稱PRW）。對該模板樣本集以及當前區塊中的每個目標位置，決定一個或多個位置相關權重（PRW）集。對相應的PRW，導出相似性檢查權重（similarity-check weighting，簡稱SCW）。其中，當前區塊中每個目標位置的SCW基於當前區塊中的目標預測樣本以及參考模板中或當前區塊中的相應參考樣本導出。對於當前區塊中的目標預測樣本，藉由將導出的模板樣本加權求和，以及結合所述一個或多個PRW集和SCW，導出基於樣本的預測偏移（sample-based prediction offset，簡稱SPO）。利用SPO對目標預測樣本進行優化，生成優化後的預測樣本。最後，利用包含該優化後預測樣本的預測結果對當前區塊進行編碼或解碼。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for sample-based prediction offset are disclosed. According to the method, a template area of the current block is determined. Position-Related Weights (PRWs) are determined for the set of template samples. One or more sets of Position-Related Weights (PRWs) are determined for the set of template samples and each target position in the current block. Similarity-Check Weighting (SCW) is derived for for a corresponding PRW, wherein the SCW for said each target position in the current block is derived based on a target prediction sample of the current block and a corresponding reference sample in a reference template or the current block. An SPO (Sample-Based Prediction Offset) is derived for the target prediction sample of the current block from a sum of derived template samples weighted by said one or more sets of respective PRWs and the SCW. The target prediction sample is refined using the SPO to generate a refined prediction sample. The current block is encoded or decoded by using prediction comprising the refined prediction sample.</p>
      </isu-abst>
      <representative-img>
        <p type="p">210:步驟</p>
        <p type="p">220:步驟</p>
        <p type="p">230:步驟</p>
        <p type="p">240:步驟</p>
        <p type="p">250:步驟</p>
        <p type="p">260:步驟</p>
        <p type="p">270:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10060.JPG" file="ed10060.JPG" height="853px" img-content="tif" inline="yes" orientation="portrait" width="608px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623252</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145627</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260219B">H04N19/13</main-classification>
        <further-classification edition="201401120260219B">H04N19/119</further-classification>
        <further-classification edition="201401120260219B">H04N19/96</further-classification>
        <further-classification edition="201401120260219B">H04N19/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向時達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIANG, SHIH-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,171</doc-number>
          <date>20241126</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/129290</doc-number>
          <date>20251022</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>視頻編解碼的方法與裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR VIDEO CODING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自適應熵編碼區塊分割信息的方法和裝置被披露。根據該方法，對當前區塊的分割決策進行編碼或解碼，分割決策包括關於是否分割當前區塊的第一決策和關於是否使用四叉樹進行分割的第二決策。選擇一個目標語法方案，其中包括選擇在第二語法元素之前或之後發送或解析第一語法元素。第一語法元素對應於分割決策中的第一決策，第二語法元素對應於分割決策中的第二決策。當第一語法元素在第二語法元素之後發送或解析時，用於第一決策的熵編碼或解碼的選定上下文變量的推導獨立於四叉樹分割的可用性信息。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus of adaptive entropy coding of block partitioning information are disclosed. According to this method, decisions for partitioning the current block are encoded or decoded, and the splitting decisions comprise a first decision regarding whether to split the current block and a second decision regarding whether a quadtree being used for partitioning. A target syntax scheme is selected, which comprises a selection of a first syntax element being signalled or parsed either prior to or after a second syntax element. The first syntax element corresponds to the first decision in the splitting decisions and the second syntax element corresponds to the second decision in the splitting decisions. When the first syntax element is signalled or parsed after the second syntax element, derivation of a selected context variable for the entropy encoding or decoding of the first decision is independent of availability information about quadtree split.</p>
      </isu-abst>
      <representative-img>
        <p type="p">810-830:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="939px" img-content="tif" inline="yes" orientation="portrait" width="625px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623253</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145635</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/13</main-classification>
        <further-classification edition="201401120260102B">H04N19/96</further-classification>
        <further-classification edition="201401120260102B">H04N19/119</further-classification>
        <further-classification edition="201401120260102B">H04N19/70</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>向時達</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSIANG, SHIH-TA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,164</doc-number>
          <date>20241126</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/117425</doc-number>
          <date>20250828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>視頻編解碼的方法與裝置</chinese-title>
        <english-title>METHOD AND APPARATUS FOR VIDEO CODING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種自適應熵編解碼塊分割信息的方法和裝置被披露。根據該方法，為分割決策的熵編解碼確定多個語法方案或碼字集。選擇一個目標語法方案或碼字集。確定用於熵編解碼當前塊的目標分割決策的上下文變量，其中上下文變量的確定取決於為分割決策的熵編解碼選擇的目標語法方案或碼字集。在編碼器端，根據所述一個或多個上下文變量，對目標分割決策應用熵編碼以導出目標熵編碼的分割決策；或者在解碼器端，對應於目標分割決策的目標熵編碼的分割決策應用熵解碼，以根據目標語法方案或目標碼字導出對應於目標分割決策的目標解碼的分割決策。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus of adaptive entropy coding of block partitioning information are disclosed. According to this method, multiple syntax schemes or codeword sets are determined for entropy coding of splitting decisions. A target syntax scheme or codeword set is selected. Context variables are determined for entropy coding the target splitting decision of the current block, wherein context variables are determined depending on the target syntax scheme or codeword set selected for entropy coding the splitting decision. Entropy encoding is applied to the target splitting decision at the encoder side to derive a target entropy-coded splitting decision or entropy decoding is applied to the target entropy-coded splitting decision corresponding to the target splitting decision at the decoder side to derive a target decoded splitting decision corresponding to the target splitting decision, according to the target syntax scheme or the target codeword using said one or more context variables.</p>
      </isu-abst>
      <representative-img>
        <p type="p">810-860:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="966px" img-content="tif" inline="yes" orientation="portrait" width="717px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622056</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145636</doc-number>
          <kind></kind>
          <date>114/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07D401/12</main-classification>
        <further-classification edition="200601120260302B">C07D405/14</further-classification>
        <further-classification edition="200601120260302B">C07D401/14</further-classification>
        <further-classification edition="200601120260302B">A61K31/4439</further-classification>
        <further-classification edition="200601120260302B">A61P37/00</further-classification>
        <further-classification edition="200601120260302B">A61P29/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商武漢朗來科技發展有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WUHAN CREATERNA SCIENCE AND TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>婁軍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOU, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧曉琴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LU, XIAOQIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳靖康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JINGKANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>董小龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DONG, XIAOLONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116684438</doc-number>
          <date>20241121</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2025104971775</doc-number>
          <date>20250421</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2025110810910</doc-number>
          <date>20250804</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2025116255969</doc-number>
          <date>20251107</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>2025116695210</doc-number>
          <date>20251114</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>環丁烯二酮類化合物、其藥物組合物和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供了下式 (I) 所示的化合物、其消旋體、立體異構體或它們藥學上可接受的鹽，或如式 (I) 所示的化合物的溶劑合物。該化合物具有很好的CCR6抑制活性，且相對於CXCR2具有較好的選擇性，同時具有優良的藥代和藥效性質。&lt;br/&gt;&lt;img align="absmiddle" height="175px" width="267px" file="ed10512.JPG" alt="ed10512.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622095</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145682</doc-number>
          <kind></kind>
          <date>114/11/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/22</main-classification>
        <further-classification edition="200601120260302B">C08G79/12</further-classification>
        <further-classification edition="200601120260302B">C07C31/10</further-classification>
        <further-classification edition="200601120260302B">C07C31/20</further-classification>
        <further-classification edition="200601120260302B">C07C31/36</further-classification>
        <further-classification edition="200601120260302B">C07C31/38</further-classification>
        <further-classification edition="200601120260302B">C07C39/27</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG SDI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李采恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHAEEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓美蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, MIYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓俊熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JOONHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡閏珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, YUNJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金智敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林秀斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SOOBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174121</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體光阻組成物和使用其形成圖案的方法</chinese-title>
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE SAME</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種半導體光阻組成物和使用其形成圖案的方法。所述半導體光阻組成物包含：有機金屬化合物；經至少一個鹵素取代的醇化合物；未經鹵素取代的醇化合物；以及溶劑。本申請提供具有優異的線邊緣粗糙度和圖案線寬的光阻圖案。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A semiconductor photoresist composition and a method of forming patterns using the same are provided. The semiconductor photoresist composition includes an organometallic compound; an alcohol compound substituted with at least one halogen; a halogen-unsubstituted alcohol compound; and a solvent. The present application provides a photoresist pattern having excellent LER and pattern line width.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基板/半導體基板</p>
        <p type="p">108:光阻圖案</p>
        <p type="p">112:有機膜圖案</p>
        <p type="p">114:薄膜圖案</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.JPG" file="ed10032.JPG" height="362px" img-content="tif" inline="yes" orientation="portrait" width="527px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623126</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145688</doc-number>
          <kind></kind>
          <date>114/11/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201101120260226B">H01R24/20</main-classification>
        <further-classification edition="201101120260226B">H01R24/38</further-classification>
        <further-classification edition="200601120260226B">H01R13/40</further-classification>
        <further-classification edition="200601120260226B">H01R13/639</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商泰科電子（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TYCO ELECTRONICS (SHANGHAI) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉嬌勇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, JIAOYONG (MAC)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, JIE (ROGER)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, WILLIAM (WEI)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, RONG (SUMMER)</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳傳岳</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭雨嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117213371</doc-number>
          <date>20241127</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>端子組件和電連接器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文中描述一種端子組件（1）和一種電連接器（2），所述端子組件（1）被配置成與一導電件（6）配合成導電接觸，且所述端子組件（1）包括端子底座（11）和固定至所述端子底座（11）的接觸臂（12），所述接觸臂（12）包括：公共底板（121），固定至所述端子底座（11），和兩組接觸梁（122），彼此相對於所述公共底板（121）的縱向軸線（L）呈鏡像對稱佈置，每組接觸梁（122）構造成從所述公共底板（121）的相應側延伸且往回彎折。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:端子組件</p>
        <p type="p">2:電連接器</p>
        <p type="p">3:絕緣的殼體</p>
        <p type="p">4:基板</p>
        <p type="p">5:螺紋件</p>
        <p type="p">6:導電件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10022.JPG" file="ed10022.JPG" height="572px" img-content="tif" inline="yes" orientation="portrait" width="715px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622316</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145693</doc-number>
          <kind></kind>
          <date>114/11/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260213B">D06F58/20</main-classification>
        <further-classification edition="200601120260213B">D06F58/04</further-classification>
        <further-classification edition="200601120260213B">D06F58/26</further-classification>
        <further-classification edition="202001320260213B">D06F105/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫學遜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XUEXUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117450733</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229443581</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>連接件、烘乾模組及衣物處理設備</chinese-title>
        <english-title>CONNECTING MEMBER, DRYING MODULE, AND CLOTHING TREATMENT DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申请屬於家用電器領域，提供了一種連接件、烘乾模組及衣物處理設備。連接件包括連接主體，所述連接主體具有導風通道以及與所述導風通道相連通的迎風口和排風口。所述迎風口被配置為與熱交換器組件的出風口連通，所述排風口被配置為與吸濕除濕組件的進風口連通。本申请提供的連接件、烘乾模組有助於改善衣物處理設備的烘乾除濕效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure belongs to the field of household appliances and provides a connecting member, a drying module, and a clothing treatment device. The connecting member includes a connecting body, and the connecting body has an air guide channel, an air receiving port in communication with the air guide channel, and an air discharge port in communication with the air guide channel. The air receiving port is configured to be in communication with an air outlet of a heat exchanger assembly, and the air discharge port is configured to be in communication with an air inlet of a moisture absorption and dehumidification assembly. The connecting member and the drying module provided in the present disclosure help improve the drying and dehumidification efficiency of the clothing treatment device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:連接主體</p>
        <p type="p">2:定位凸起</p>
        <p type="p">31:第一密封條</p>
        <p type="p">32:第二密封條</p>
        <p type="p">4:安裝板</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="634px" img-content="tif" inline="yes" orientation="portrait" width="690px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621946</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145787</doc-number>
          <kind></kind>
          <date>114/11/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260122B">B64U20/40</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊毓漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樊毓漢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中華民國</country>
          <doc-number>113145543</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多構型多動力系統之模組式無人機</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提出一種多構型多動力系統之模組式無人機，其具有一機身、一機首及一機翼組。機身可選擇性地設置有一電動尾翼動力模組或一油引擎動力模組。機首以一連結機構模組可拆卸式地設置於機身上。機翼組以至少一連結機構模組可拆卸式地設置於機身的兩側。各連結機構模組具有一凸柱、一凹槽以及一固定件。凸柱及凹槽能相卡合，當凸柱及該凹槽相卡合時，固定件能貫穿並固定凸柱及凹槽。藉由將機身、機首、機翼組以及機尾組使用連結機構模組相連接，因此當使用者要依使用場景進行變化時，能將本創作自由拆裝，並選用適合的構件進行快速裝配。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">12:油引擎動力模組</p>
        <p type="p">20:機首</p>
        <p type="p">30:機翼組</p>
        <p type="p">31:機翼模組</p>
        <p type="p">33:長航程機翼模組</p>
        <p type="p">34:垂直起降模組</p>
        <p type="p">40:機尾組</p>
        <p type="p">42:V型尾翼模組</p>
        <p type="p">421:V型尾翼支架</p>
        <p type="p">422:V型尾翼</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.png" file="d10004.TIF" giffile="ed10004.png" height="684px" img-content="tif" inline="yes" orientation="portrait" width="659px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623011</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145851</doc-number>
          <kind></kind>
          <date>114/11/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260105B">H01F27/28</main-classification>
        <further-classification edition="200601120260105B">H01F27/30</further-classification>
        <further-classification edition="200601120260105B">H01F27/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>台達電子工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DELTA ELECTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>臺北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王達開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, DAKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金峰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIN, FENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張溢盛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, YI-SHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡孟錡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSAI, MENG-CHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫馬爾　美莎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUMAR, MISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>包　彼得</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BARBOSA, PETER MANTOVANELLI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
              <english-address>BR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李秋成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾國軒</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/725,041</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>整合磁性元件</chinese-title>
        <english-title>INTEGRATED MAGNETIC COMPONENT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案提供一種整合磁性元件，包括多個電路板、變壓器以及多個電感器。變壓器包括多個初級繞組、多個次級繞組以及兩個變壓器磁芯。初級繞組以及次級繞組設置於多個電路板，且繞設於該兩個變壓器磁芯。多個電感器設置於多個電路板，且連接於變壓器。變壓器的多個初級繞組以及多個次級繞組相應成對地設置於多個電路板其中之一。多個電感器鄰設於變壓器。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An integrated magnetic component is disclosed and includes a plurality of PCBs, a transformer and a plurality of inductors. The transformer includes a plurality of primary windings, a plurality of secondary windings, and two pieces of transformer cores. The primary windings and the secondary windings are disposed on the PCBs and wound around the two pieces of transformer cores. The inductors are disposed on the PCBs and connected to the transformer. The primary windings and the secondary windings of the transformer are disposed correspondingly in pairs on one of the PCBs, and the inductors are disposed adjacent to the transformer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1:整合磁性元件</p>
        <p type="p">21:初級繞組</p>
        <p type="p">22:次級繞組</p>
        <p type="p">23:變壓器磁芯</p>
        <p type="p">3:電感器</p>
        <p type="p">30:電感器磁芯</p>
        <p type="p">300:電感器磁芯蓋板</p>
        <p type="p">301:第一電感器磁芯基座</p>
        <p type="p">302:第二電感器磁芯基座</p>
        <p type="p">4:電路板</p>
        <p type="p">T:變壓器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="724px" img-content="tif" inline="yes" orientation="portrait" width="887px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622317</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145862</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260213B">D06F58/20</main-classification>
        <further-classification edition="202001120260213B">D06F58/32</further-classification>
        <further-classification edition="200601120260213B">D06F58/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱甫金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, FUJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117459988</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229457739</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>烘乾系統及衣物處理設備</chinese-title>
        <english-title>DRYING SYSTEM AND LAUNDRY TREATING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提出一種烘乾系統及衣物處理設備。烘乾系統包括第一熱交換器、第二熱交換器、吸濕除濕裝置、循環空氣驅動裝置、旁路風道和第一切換機構。第一熱交換器、第二熱交換器、吸濕除濕裝置以及循環空氣驅動裝置構造出第一循環風道。沿第一循環風道的風向，第一熱交換器處於第二熱交換器的上游。旁路風道與吸濕除濕裝置並聯佈置，第一切換機構用於控制循環空氣在旁路風道和吸濕除濕裝置中擇一通過。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a drying system and a laundry treating apparatus. The drying system includes a first heat exchanger, a second heat exchanger, a moisture absorption and dehumidification device, a circulating air drive device, a bypass air duct, and a first switching mechanism. The first heat exchanger, the second heat exchanger, the moisture absorption and dehumidification device, and the circulating air drive device form a first circulating air duct. Along the air flow direction of the first circulating air duct, the first heat exchanger is located upstream of the second heat exchanger. The bypass air duct is arranged in parallel with the moisture absorption and dehumidification device, and the first switching mechanism is configured to control the circulating air to pass through either the bypass air duct or the moisture absorption and dehumidification device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:烘乾系統</p>
        <p type="p">10:衣物容器</p>
        <p type="p">20:第一循環風道</p>
        <p type="p">21:循環空氣驅動裝置</p>
        <p type="p">22:旁路風道</p>
        <p type="p">23:第一切換機構</p>
        <p type="p">30:第一熱交換器</p>
        <p type="p">40:第二熱交換器</p>
        <p type="p">50:吸濕除濕裝置</p>
        <p type="p">51:脫附區</p>
        <p type="p">511:加熱器</p>
        <p type="p">52:吸濕區</p>
        <p type="p">60:脫附風道</p>
        <p type="p">61:脫附空氣驅動裝置</p>
        <p type="p">62:第二切換機構</p>
        <p type="p">80:第一製冷劑管路</p>
        <p type="p">81:節流器</p>
        <p type="p">90:第二製冷劑管路</p>
        <p type="p">91:壓縮機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="498px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622320</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145863</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120260213B">D06F58/30</main-classification>
        <further-classification edition="200601120260213B">D06F58/04</further-classification>
        <further-classification edition="202001320260213B">D06F105/22</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117377988</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229351096</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>烘乾系統、衣物處理設備及烘乾方法</chinese-title>
        <english-title>DRYING SYSTEM, LAUNDRY PROCESSING APPARATUS AND DRYING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">烘乾系統包括：第一烘乾子系統，包括通過冷媒流路連接的蒸發器、冷凝器、節流部件和壓縮機；第二烘乾子系統，包括吸濕除濕裝置和再生裝置，吸濕除濕裝置用於吸附烘乾用風中的水汽，再生裝置用於使吸附了水汽的吸濕除濕裝置再生；沿著烘乾用風的循環路徑，蒸發器、吸濕除濕裝置、冷凝器依次佈置，再生裝置包括加熱裝置，加熱裝置用於加熱再生用風，再生用風用於使吸濕除濕裝置中所吸附的水分脫附，加熱裝置通過冷媒流路而至少連接於壓縮機的熱輸出端。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A drying system includes a first drying subsystem including an evaporator, a condenser, a throttling component and a compressor connected through a refrigerant flow path; a second drying subsystem including a moisture absorption and dehumidification device and a regeneration device, wherein the moisture absorption and dehumidification device is configured to adsorb water vapor in drying wind, and the regeneration device is configured to regenerate the moisture absorption and dehumidification device adsorbed with water vapor; along a circulating path of drying air, the evaporator, the moisture absorption and dehumidification device and the condenser are sequentially arranged, and the regeneration device includes a heating device, wherein the heating device is configured to heat regeneration air, and the regeneration air is used for desorbing moisture absorbed in the moisture absorption and dehumidification device, and the heating device is at least connected to a heat output end of the compressor through the refrigerant flow path.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:蒸發器</p>
        <p type="p">11:冷凝器</p>
        <p type="p">12:節流部件</p>
        <p type="p">13:壓縮機</p>
        <p type="p">14:吸濕除濕裝置</p>
        <p type="p">15:加熱裝置</p>
        <p type="p">16:冷卻器</p>
        <p type="p">17:烘乾筒</p>
        <p type="p">18:濾網</p>
        <p type="p">19:第一風機</p>
        <p type="p">20:第二風機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10003.JPG" file="ed10003.JPG" height="498px" img-content="tif" inline="yes" orientation="portrait" width="711px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622322</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145869</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202001120251226B">D06F58/36</main-classification>
        <further-classification edition="200601120251226B">D06F58/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓先山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, XIANSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱甫金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHU, FUJIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117454861</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229451639</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>烘乾系統、衣物處理設備及烘乾方法</chinese-title>
        <english-title>DRYING SYSTEM, LAUNDRY PROCESSING APPARATUS AND DRYING METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">烘乾系統包括第一烘乾子系統和第二烘乾子系統，第一烘乾子系統包括設置於冷媒循環路徑的冷凝器和第一蒸發器；第二烘乾子系統包括吸濕除濕裝置和再生裝置；其中，第一蒸發器、吸濕除濕裝置和冷凝器設置於烘乾風循環路徑，且第二烘乾子系統被配置為在第一烘乾子系統的不同烘乾階段啟動或關停。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A drying system includes a first drying subsystem and a second drying subsystem; the first drying subsystem includes a condenser and a first evaporator arranged in a refrigerant circulation path; the second drying subsystem includes a moisture absorption and dehumidification device and a regeneration device, and the first evaporator, the moisture absorption and dehumidification device, and the condenser are arranged in the drying air circulation path, and the second drying subsystem is configured to start or shut down during different drying stages of the first drying subsystem.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:第一烘乾子系統</p>
        <p type="p">130:第一蒸發器</p>
        <p type="p">110:壓縮機</p>
        <p type="p">120:冷凝器</p>
        <p type="p">L20:烘乾風循環路徑</p>
        <p type="p">500:烘乾筒</p>
        <p type="p">300:截止閥</p>
        <p type="p">L30:脫附風循環路徑</p>
        <p type="p">200:第二烘乾子系統</p>
        <p type="p">210:吸濕除濕裝置</p>
        <p type="p">220:第二蒸發器</p>
        <p type="p">211:除濕轉盤</p>
        <p type="p">212:加熱器</p>
        <p type="p">400:節流器</p>
        <p type="p">L10:冷媒循環路徑</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.JPG" file="ed10004.JPG" height="672px" img-content="tif" inline="yes" orientation="portrait" width="716px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622313</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145875</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260213B">D06F58/04</main-classification>
        <further-classification edition="200601120260213B">D06F58/20</further-classification>
        <further-classification edition="200601120260213B">D06F58/24</further-classification>
        <further-classification edition="200601120260213B">D06F58/26</further-classification>
        <further-classification edition="202001320260213B">D06F105/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍亞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, YA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>章云</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, YUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117492581</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229437699</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>烘乾裝置以及衣物處理設備</chinese-title>
        <english-title>DRYING DEVICE AND LAUNDRY PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請屬於電器設備技術領域，具體涉及一種烘乾裝置以及衣物處理設備。該烘乾裝置包括吸濕除濕模組、熱泵模組、加熱組件以及冷卻器，其中，吸濕除濕模組具有除濕區以及脫附區，熱泵模組包括蒸發器和冷凝器，沿氣流方向，蒸發器、吸濕除濕模組的除濕區以及冷凝器依次連接，吸濕除濕模組的脫附區、冷卻器以及加熱組件依次循環連接。本申請能降低乾燥氣流的水分，並提高衣物處理設備的烘乾效率，減少烘乾時間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to a field of electrical equipment technology, particularly to a drying device and a laundry processing apparatus. The drying device includes a moisture-absorption and dehumidification module, a heat pump module, a heating component and a cooler, the moisture-absorption and dehumidification module includes a dehumidification area and a desorption area, and the heat pump module includes an evaporator and a condenser. Along an airflow direction, the evaporator, the dehumidification area of the moisture-absorption and dehumidification module and the condenser are connected in sequence, and the desorption area of the moisture-absorption and dehumidification module, the cooler and the heating component are connected in a sequential loop. The present disclosure reduces a moisture content of a dry airflow, enhances the drying efficiency of the laundry processing apparatus and shortens the drying time.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第二引風件</p>
        <p type="p">11:過濾件</p>
        <p type="p">3:筒體</p>
        <p type="p">41:吸濕除濕模組</p>
        <p type="p">442:加熱件</p>
        <p type="p">443:第一引風件</p>
        <p type="p">5:蒸發器</p>
        <p type="p">6:冷凝器</p>
        <p type="p">7:冷卻器</p>
        <p type="p">8:壓縮機</p>
        <p type="p">9:節流部件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="588px" img-content="tif" inline="yes" orientation="portrait" width="719px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202623149</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114145893</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
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      <classification-ipc>
        <main-classification edition="200601120260102B">H02K5/10</main-classification>
        <further-classification edition="200601120260102B">H02K21/24</further-classification>
        <further-classification edition="201001120260102B">B62M6/60</further-classification>
        <further-classification edition="201901120260102B">B60L50/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>山本敏禎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAMAMOTO, TOSHITSUGU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>井上順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INOUE, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>関井洋一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEKII, YOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-204618</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>馬達、輪轂馬達及電動車輛</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種輪轂馬達及電動車輛。馬達，包括：第1構件，具有第1接合部，且以沿軸向延伸之旋轉軸為中心旋轉；第2構件，具有與所述第1構件之所述第1接合部連接之第2接合部，且與所述第1構件一起以中心軸為中心旋轉；多個緊固構件，於軸向上緊固所述第1構件與所述第2構件；以及密封構件，配置於所述第1構件與所述第2構件之間。所述第1接合部之第1密封面及所述第2接合部之第2密封面中之至少一者，具有：相對於另一者向相反側凹陷之凹部。所述密封構件配置於由第1密封面、所述第2密封面、及所述第2側面所包圍之空間內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">20:輪轂蓋</p>
        <p type="p">21:蓋本體部</p>
        <p type="p">22:第1連接部</p>
        <p type="p">26:螺絲座</p>
        <p type="p">41:安裝筒部</p>
        <p type="p">42:扭矩感測器</p>
        <p type="p">61:密封構件</p>
        <p type="p">71:第1構件</p>
        <p type="p">72:第2構件</p>
        <p type="p">73:空間</p>
        <p type="p">74:密封構件</p>
        <p type="p">221:內凸緣部</p>
        <p type="p">222:內凸緣端面</p>
        <p type="p">223:內凸緣密封面</p>
        <p type="p">224:內凸緣接觸面</p>
        <p type="p">225:內緊固部</p>
        <p type="p">226:凹部</p>
        <p type="p">227:內突出部</p>
        <p type="p">228:內側面</p>
        <p type="p">229:空間</p>
        <p type="p">261:按壓面</p>
        <p type="p">421:感測器凸緣部</p>
        <p type="p">422:感測器凸緣端面</p>
        <p type="p">423:感測器凸緣密封面</p>
        <p type="p">424:感測器凸緣接觸面</p>
        <p type="p">425:感測器緊固部</p>
        <p type="p">426:感測器外周面</p>
        <p type="p">710:第1側面</p>
        <p type="p">711:第1接合部</p>
        <p type="p">712:第1端面</p>
        <p type="p">713:第1密封面</p>
        <p type="p">714:第1接觸面</p>
        <p type="p">715:第1緊固部</p>
        <p type="p">720:第2側面</p>
        <p type="p">721:第2接合部</p>
        <p type="p">722:第2端面</p>
        <p type="p">723:第2密封面</p>
        <p type="p">724:第2接觸面</p>
        <p type="p">725:第2緊固部</p>
        <p type="p">726:螺絲座</p>
        <p type="p">727:突出部</p>
        <p type="p">728:凹部</p>
        <p type="p">Bt:緊固構件</p>
        <p type="p">DI:徑向內側</p>
        <p type="p">DO:徑向外側</p>
        <p type="p">S1:軸向一側</p>
        <p type="p">S2:軸向另一側</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="868px" img-content="tif" inline="yes" orientation="portrait" width="735px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622534</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114145901</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">G01S13/58</main-classification>
        <further-classification edition="200601120260202B">G01S7/41</further-classification>
        <further-classification edition="200601120260202B">G01S13/88</further-classification>
        <further-classification edition="200601120260202B">G01P3/44</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商高爾縱股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLFZON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉裁允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OK, JAE YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174624</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>被擊打而移動的球的自旋資訊測量方法</chinese-title>
        <english-title>METHOD FOR MEASURING SPIN OF MOVING BALL BY HIT</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種被擊打而移動的球的自旋資訊測量方法，該方法能夠在如高爾夫等體育運動中利用的球被擊打而旋轉且移動時，接收雷達信號經反射而得的都卜勒信號，且獲取並分析接收的該信號的數位資料，從而能夠以現有技術中無法預測的新的方式計算移動的球的自旋軸，並且提高自旋軸計算的準確性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S100~S180:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="915px" img-content="tif" inline="yes" orientation="portrait" width="710px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621770</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145902</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260131B">A63F13/573</main-classification>
        <further-classification edition="201401120260131B">A63F13/53</further-classification>
        <further-classification edition="200601120260131B">A63F7/06</further-classification>
        <further-classification edition="201401120260131B">A63F13/27</further-classification>
        <further-classification edition="200601120260131B">A63B69/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商高爾縱股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLFZON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉裁允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OK, JAE YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174625</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>虛擬高爾夫類比裝置及該裝置中根據難度決定洞杯位置的方法</chinese-title>
        <english-title>VIRTUAL GOLF SIMULATION APPARATUS AND METHOD OF DETERMINING HOLE-CUP POSITION ACCORDING TO DIFFICULTY OF GOLF PLAY IN THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明旨在解決以往的虛擬高爾夫類比裝置中無論用戶設定的高爾夫打球的難度如何，前旗桿、後旗桿、左旗桿、右旗桿、中旗桿等果嶺上的旗桿位置均被統一批量且千篇一律地設定的問題，用於提供一種虛擬高爾夫類比裝置及該裝置中根據難度決定洞杯位置的方法，該裝置能夠實現：在應用虛擬高爾夫類比裝置的高爾夫系統中，以與用戶設定的高爾夫打球的難度相對應的方式，基於虛擬果嶺的地形資訊決定並生成洞杯的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:模擬器</p>
        <p type="p">110:地形資訊存儲部</p>
        <p type="p">120:影像實現部</p>
        <p type="p">130:操作部</p>
        <p type="p">140:控制部</p>
        <p type="p">200:感測裝置</p>
        <p type="p">300:影像輸出部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="453px" img-content="tif" inline="yes" orientation="portrait" width="654px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202621771</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114145903</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260131B">A63F13/573</main-classification>
        <further-classification edition="201401120260131B">A63F13/53</further-classification>
        <further-classification edition="200601120260131B">A63F7/06</further-classification>
        <further-classification edition="201401120260131B">A63F13/27</further-classification>
        <further-classification edition="200601120260131B">A63B69/36</further-classification>
      </classification-ipc>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商高爾縱股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLFZON CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>玉裁允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OK, JAE YOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李保祿</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
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      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174626</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>虛擬高爾夫類比裝置及通過其提供旗桿攻略引導的方法</chinese-title>
        <english-title>VIRTUAL GOLF SIMULATION APPARATUS AND METHOD FOR PROVIDING PIN-TARGETING GUIDE THROUGH THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本發明旨在提供一種虛擬高爾夫類比裝置及通過其提供旗桿攻略引導的方法，即，在以虛擬的高爾夫球場實現為影像，且使用者擊打的高爾夫球的軌跡在該虛擬的高爾夫球場中進行類比的方式進行高爾夫打球的系統中，在果嶺周邊的預定位置進行近距離切球時，當近距離切球難度極大，如當果嶺周邊存在沙坑或障礙區等危險區域等時，該虛擬高爾夫類比裝置能夠提供使得使用者能夠將球移動到果嶺上易於推桿的位置來攻旗桿的引導。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:模擬器</p>
        <p type="p">110:資訊存儲部</p>
        <p type="p">120:影像實現部</p>
        <p type="p">130:操作部</p>
        <p type="p">140:控制部</p>
        <p type="p">200:感測裝置</p>
        <p type="p">300:影像輸出部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="456px" img-content="tif" inline="yes" orientation="portrait" width="684px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202623221</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>114145915</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
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        <main-classification edition="201301120260105B">H04B10/275</main-classification>
        <further-classification edition="200601120260105B">G02B6/12</further-classification>
        <further-classification edition="200601120260105B">G02B6/26</further-classification>
        <further-classification edition="200601120260105B">G02B6/35</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商上海曦智科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI XIZHI TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈亦晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟怀宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, HUAIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吕文清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LV, WENQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　泷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡涛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117062174</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>計算系統及其操作方法</chinese-title>
        <english-title>COMPUTING SYSTEM AND OPERATING METHOD THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種包括多個計算裝置的計算系統。每個計算裝置包括計算模塊和光互連裝置，每個光互連裝置包括光信號接口和電信號接口。多個計算裝置包括第一、第二和第三計算裝置。第一計算裝置的第一部分光互連裝置的第一光信號接口分別與第二計算裝置的第一部分光互連裝置的光信號接口通過光傳輸裝置物理連接，第一計算裝置的第一部分光互連裝置的第二光信號接口分別與第三計算裝置的第一部分光互連裝置的光信號接口通過光傳輸裝置物理連接。第一計算裝置的第一部分光互連裝置能夠使第一計算裝置選擇性地與第二或第三計算裝置通信連接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A computing system including a plurality of computing devices is provided. Each of the computing devices includes computing modules and optical interconnect devices, and each of the optical interconnect devices includes an optical signal interface and an electrical signal interface. The plurality of computing devices include a first, a second, and a third computing devices. First optical signal interfaces of a first portion of the optical interconnect devices of the first computing device are physically connected to optical signal interfaces of a first portion of the optical interconnect devices of the second computing device via optical transmission devices, respectively, and second optical signal interfaces of the first portion of the optical interconnect devices of the first computing device are physically connected to optical signal interfaces of a first portion of the optical interconnect devices of the third computing device via optical transmission devices, respectively. The first portion of the optical interconnect devices of the first computing device enable the first computing device to selectively communicate with the second or the third computing device.</p>
      </isu-abst>
      <representative-img>
        <p type="p">3:計算系統</p>
        <p type="p">31,32,33:計算裝置</p>
        <p type="p">35:光傳輸裝置</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10019.JPG" file="ed10019.JPG" height="559px" img-content="tif" inline="yes" orientation="portrait" width="705px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622560</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145916</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260120B">G02B6/12</main-classification>
        <further-classification edition="200601120260120B">G02B6/35</further-classification>
        <further-classification edition="200601120260120B">G02B6/42</further-classification>
        <further-classification edition="201301120260120B">H04B10/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商上海曦智科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHANGHAI XIZHI TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈亦晨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, YICHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟怀宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, HUAIYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吕文清</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LV, WENQING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　泷</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, LONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡涛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117034812</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光互連模組、光互連裝置和計算系統</chinese-title>
        <english-title>OPTICAL INTERCONNECT MODULE, OPTICAL INTERCONNECT DEVICE AND COMPUTING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種光互連模組，包括光子積體電路晶片和收發電晶片。光子積體電路晶片包括第一光交換部分和第二光交換部分。第一光交換部分包括多個第一光交換輸入端口、多個第一光交換輸出端口、多個第二光交換輸出端口和多個第三光交換輸出端口，從每個第一光交換輸入端口輸入的光信號選擇性從第一光交換輸出端口中的對應一個、第二光交換輸出端口中的對應一個或第三光交換輸出端口中的對應一個輸出。第二光交換部分包括多個第二光交換輸入端口和多個第四光交換輸出端口，第二光交換輸入端口中的每個連接到第一光交換輸出端口中的對應一個。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical interconnect module is provided, including a photonic integrated circuit chip and a transceiver chip. The photonic integrated circuit chip includes a first optical switching portion and a second optical switching portion. The first optical switching portion includes a plurality of first optical switching input ports and a plurality of first, second, and third optical switching output ports, and an optical signal input from each of the first optical switching input ports are selectively output from a corresponding one of the first optical switching output ports, a corresponding one of the second optical switching output ports, or a corresponding one of the third optical switching output ports. The second optical switching portion includes a plurality of second optical switching input ports and a plurality of fourth optical switching output ports, with each of the second optical switching input ports connected to a corresponding one of the first optical switching output ports.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110:光子積體電路晶片</p>
        <p type="p">112:電光轉換部分</p>
        <p type="p">1121:光調變器</p>
        <p type="p">114:第一光交換部分</p>
        <p type="p">1141:第一光交換單元</p>
        <p type="p">1142:第二光交換單元</p>
        <p type="p">116:第二光交換部分</p>
        <p type="p">118:光電轉換部分</p>
        <p type="p">1181:光探測器</p>
        <p type="p">1191:第一光耦合器</p>
        <p type="p">1192:第二光耦合器</p>
        <p type="p">1193:第三光耦合器</p>
        <p type="p">1194:第四光耦合器</p>
        <p type="p">L1:光載波</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10014.JPG" file="ed10014.JPG" height="782px" img-content="tif" inline="yes" orientation="portrait" width="753px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621868</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145917</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">B25J9/08</main-classification>
        <further-classification edition="200601120260102B">B25J9/06</further-classification>
        <further-classification edition="200601120260102B">B25J15/08</further-classification>
        <further-classification edition="200601120260102B">B25J17/02</further-classification>
        <further-classification edition="200601120260102B">B25J9/18</further-classification>
        <further-classification edition="200601120260102B">B25J19/02</further-classification>
        <further-classification edition="200601120260102B">A47L11/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾令星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, LINGXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖智成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, ZHICHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范红城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, HONGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黄育忠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUANG, YUZHONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李长城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHANGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116981684</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024228818640</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>中國大陸</country>
          <doc-number>2024228856426</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="4">
          <country>中國大陸</country>
          <doc-number>2024228822326</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="5">
          <country>中國大陸</country>
          <doc-number>2024228818759</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="6">
          <country>中國大陸</country>
          <doc-number>2024116989489</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="7">
          <country>中國大陸</country>
          <doc-number>2024228853377</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="8">
          <country>中國大陸</country>
          <doc-number>202411698960X</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="9">
          <country>中國大陸</country>
          <doc-number>2024228823827</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="10">
          <country>中國大陸</country>
          <doc-number>2024116989120</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="11">
          <country>中國大陸</country>
          <doc-number>2024228853964</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>機械臂機構、清潔設備與清潔系統</chinese-title>
        <english-title>ROBOTIC ARM MECHANISM, CLEANING DEVICE, AND CLEANING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種機械臂機構、清潔設備與清潔系統，涉及清潔設備技術領域。機械臂機構包括多個機械臂，相鄰的兩個機械臂通過機械臂關節轉動連接；其中，至少一個機械臂包括機械臂本體、線束轉接板、第一線束和第二線束，線束轉接板設於機械臂本體上，第一線束與線束轉接板連接，第二線束與線束轉接板連接，第一線束與第二線束通過線束轉接板導通，便於機械臂分體組裝與檢修。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a robotic arm mechanism, a cleaning device, and a cleaning system, which relate to the technical field of cleaning devices. The robotic arm mechanism includes a plurality of robotic arms, where two adjacent robotic arms are rotatably connected via a robotic arm joint; at least one robotic arm includes a robotic arm body, a wire harness adapter plate, a first wire harness, and a second wire harness. The wire harness adapter plate is arranged on the robotic arm body; the first wire harness is connected to the wire harness adapter plate, and the second wire harness is connected to the wire harness adapter plate. The first wire harness and the second wire harness are connected and conducted through the wire harness adapter plate, which facilitates the split assembly and maintenance of the robotic arm.</p>
      </isu-abst>
      <representative-img>
        <p type="p">23:連接臂</p>
        <p type="p">230:連接臂本體</p>
        <p type="p">231:連接臂殼體</p>
        <p type="p">232:線束轉接板</p>
        <p type="p">271:第一線束</p>
        <p type="p">272:第二線束</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.JPG" file="ed10032.JPG" height="248px" img-content="tif" inline="yes" orientation="portrait" width="648px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622805</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145920</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260102B">G06N3/063</main-classification>
        <further-classification edition="201801120260102B">G06F9/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加拿大商應用智慧研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>APPLIED BRAIN RESEARCH INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施特克爾　安德烈亞斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOECKEL, ANDREAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亨斯伯格　艾瑞克戈登</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNSBERGER, ERIC GORDON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴國榕</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/726,305</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>神經網路處理器及處理單元</chinese-title>
        <english-title>NEURAL NETWORK PROCESSOR AND PROCESSING ELEMENT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於執行神經網路推理的處理器，包括中央處理單元（CPU）、權重及狀態存儲器、以及由複數個處理單元組成的結構。每個處理單元包括算術邏輯單元（ALU）和序列發生器，該算術邏輯單元（ALU）具有控制器和核心，該序列發生器被配置為：接收包含至少一條序列指令的序列程序，該至少一條序列指令包含一個或多個算術邏輯單元（ALU）操作碼的壓縮表示；解壓縮該序列指令以生成該一個或多個算術邏輯單元（ALU）操作碼；並將由此生成的該一個或多個算術邏輯單元（ALU）操作碼提供給該算術邏輯單元（ALU）控制器。該算術邏輯單元（ALU）控制器被配置為：針對從該序列發生器接收的每個操作碼，輸出控制訊號以配置該算術邏輯單元（ALU）的數據路徑，用於在執行推理時執行一個或多個操作。該中央處理單元（CPU）控制該複數個處理單元執行序列程序。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A processor for executing neural network inference includes a CPU, weight and state memory, and a fabric comprising a plurality of programming elements. Each programming element comprises an ALU, having a controller and a core, and a sequencer configured to receive a sequencer program comprising at least one sequencer instruction, the at least one sequencer instruction comprising a compressed representation of one or more arithmetic ALU op codes; decompress the sequence instruction to produce the one or more ALU op codes; and provide the one or more ALU op codes thus produced to the ALU controller. The ALU controller is configured to output a control signal to configure a data path of the ALU for executing one or more operations in performing inference, for each op code received from the sequencer. The CPU controls execution of sequencer programs by the plurality of programming elements.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:處理器</p>
        <p type="p">101:片上系統(SoC)</p>
        <p type="p">103:存儲器子系統</p>
        <p type="p">105:結構</p>
        <p type="p">112:輸入/輸出外設</p>
        <p type="p">114:CPU</p>
        <p type="p">116:直接存儲器訪問(DMA)控制器</p>
        <p type="p">130:狀態存儲器</p>
        <p type="p">132:靜態隨機存取存儲器(SRAM)</p>
        <p type="p">140:權重存儲器</p>
        <p type="p">152:中斷通知器</p>
        <p type="p">170:系統總線</p>
        <p type="p">180:結構內部總線</p>
        <p type="p">190:高速並行存儲器接口</p>
        <p type="p">200:處理單元(PE)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.JPG" file="ed10023.JPG" height="754px" img-content="tif" inline="yes" orientation="portrait" width="1023px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622131</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145921</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">C08F210/02</main-classification>
        <further-classification edition="200601120260202B">C08F232/08</further-classification>
        <further-classification edition="202501120260202B">C08L23/0807</further-classification>
        <further-classification edition="200601120260202B">G02B1/04</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商三井化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MITSUI CHEMICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>力石亜紀子</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIKARAISHI, AKIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小川亮平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGAWA, RYOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中島真実</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKASHIMA, MAKOTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-208120</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>環狀烯烴系共聚物組成物及成形體</chinese-title>
        <english-title>CYCLIC OLEFIN COPOLYMER COMPOSITION AND FORMED ARTICLE</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種環狀烯烴系共聚物組成物，包含玻璃轉移點（Tg）超過100.0℃的環狀烯烴系共聚物[A]、以及玻璃轉移點（Tg）為100.0℃以下的環狀烯烴系共聚物[B]，所述環狀烯烴系共聚物組成物中，在將所述環狀烯烴系共聚物[A]及所述環狀烯烴系共聚物[B]的合計量設為100質量份時，所述環狀烯烴系共聚物[A]的含量超過95.0質量份且為99.9質量份以下，所述環狀烯烴系共聚物[B]的含量為0.1質量份以上且小於5.0質量份。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622307</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145932</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260102B">D01F6/38</main-classification>
        <further-classification edition="200601120260102B">D01F9/22</further-classification>
        <further-classification edition="200601120260102B">D06M10/00</further-classification>
        <further-classification edition="200601120260102B">D06M10/06</further-classification>
        <further-classification edition="200601120260102B">D06M11/34</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商中國石油化工科技開發有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHINA PETROCHEMICAL TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張笛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>屠曉萍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TU, XIAOPING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李磊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, LEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>沈志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEN, ZHIGANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬帥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MA, SHUAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳展俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117036818</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>聚丙烯腈預氧化纖維及其製備方法和用途</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種聚丙烯腈預氧化纖維及其製備方法和應用。所述聚丙烯腈預氧化纖維，在應變0-2.5%的範圍內，其應力σ和應變ε的數值滿足非線性擬合公式σ=Aε&lt;sup&gt;2&lt;/sup&gt;+Bε+C，預氧化纖維單絲的斷裂伸長率E滿足公式-150≤(B*E*100)/A≤-70或公式-150≤(B*E*100+C)/A≤-70；其中，A、B、C為應力σ和應變ε的二次函數的係數。採用本發明的技術方案，預氧化纖維力學性能優異，易加工；以其為原料製得的碳/碳複合材料XY向和Z向壓縮強度可高達150 MPa以上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622434</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145933</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260202B">F25J3/04</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>法商液態空氣喬治斯克勞帝方法研究開發股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>L'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION DES PROCEDES GEORGES CLAUDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭修　馬克西姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RANCHOUX, MAXIME</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>FR</english-country>
              <english-address>FR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李曉旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, XIAOXU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117070310</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>低溫分離空氣之方法及適用的精餾塔系統</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露了低溫分離空氣之方法及適用的精餾塔系統。高壓塔和低壓塔並排佈置，第一冷凝蒸發器設置於低壓塔的底部、第二冷凝蒸發器設置於低壓塔的頂部。高壓塔底富氧流送入低壓塔進一步精餾。第一冷凝蒸發器產生的高壓液氮減壓後在氣液分離器中分離為氣相和液相，液相與第二冷凝蒸發器產生的低壓液氮匯合後，經液氮泵增壓後輸入高壓塔作為回流液。氣液分離器中的氣相產物與液氮泵出口處的閃蒸氣體匯合後返回低壓塔。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">01:高壓塔</p>
        <p type="p">02:低壓塔</p>
        <p type="p">03:第一冷凝蒸發器</p>
        <p type="p">04:第二冷凝蒸發器</p>
        <p type="p">05:第一減壓裝置</p>
        <p type="p">06:第二減壓裝置</p>
        <p type="p">07:液氮泵</p>
        <p type="p">09:氣液分離器</p>
        <p type="p">10:第三減壓裝置</p>
        <p type="p">20:進料空氣</p>
        <p type="p">21:高壓塔底富氧流</p>
        <p type="p">22:高壓富氮蒸汽</p>
        <p type="p">23:高壓液氮</p>
        <p type="p">24:第一冷凝蒸發器釜底液</p>
        <p type="p">25:低壓富氮蒸汽</p>
        <p type="p">26:第一部分低壓液氮</p>
        <p type="p">27:第二部分低壓液氮</p>
        <p type="p">28:富氧廢氣流</p>
        <p type="p">30:高壓氮氣產品</p>
        <p type="p">31:高壓塔液氮回流液</p>
        <p type="p">32:氣液分離器氣相</p>
        <p type="p">33:氣液分離器液相</p>
        <p type="p">34:閃蒸氣體</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="467px" img-content="tif" inline="yes" orientation="portrait" width="578px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621625</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145936</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251231B">A47L11/24</main-classification>
        <further-classification edition="200601120251231B">A47L11/28</further-classification>
        <further-classification edition="200601120251231B">A47L11/40</further-classification>
        <further-classification edition="200601120251231B">B25J9/00</further-classification>
        <further-classification edition="200601120251231B">B25J9/10</further-classification>
        <further-classification edition="200601120251231B">B25J15/08</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京石頭世紀科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BEIJING ROBOROCK TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>曾令星</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZENG, LINGXING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李長城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, CHANGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>廖智成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIAO, ZHICHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范紅城</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, HONGCHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202411698632X</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024228827601</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>掃地機器人及機器人系統</chinese-title>
        <english-title>ROBOTIC VACUUM CLEANER AND ROBOT SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提出一種掃地機器人及機器人系統，掃地機器人包括移動主體以及設置於移動主體的容納槽中的機械臂；機械臂包括基板及折疊臂機構；折疊臂機構包括依次轉動連接的至少兩個臂，其中一個臂轉動連接於基板，相連接的兩個臂之間的轉動軸線和臂與基板之間的轉動軸線分別沿第一方向延伸；機械臂能在收折狀態與展開狀態之間轉換；收折狀態下，機械臂的至少部分容納於容納槽中，至少兩個臂分別平行於基板佈置，且至少兩個臂在第二方向上排列，第二方向垂直於基板；至少兩個相連接的臂的厚度不相同，在相連接的至少兩個臂中，厚度大的一者在收折狀態下面向厚度小的一者的一側形成有凹陷區域，收折狀態下，厚度小的一者部分嵌合於凹陷區域中。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a robotic vacuum cleaner and a robot system. The robotic vacuum cleaner includes a mobile body and a mechanical arm disposed in an accommodating groove of the mobile body; the mechanical arm includes a base plate and a folding arm mechanism; the folding arm mechanism includes at least two arms rotatably connected in sequence, one of which is rotatably connected to the base plate, and the rotation axis between two connected arms and the rotation axis between the arm and the base plate respectively extend along a first direction; the mechanical arm can switch between a folded state and an unfolded state; in the folded state, at least part of the mechanical arm is accommodated in the accommodating groove, the at least two arms are respectively arranged parallel to the base plate and arranged in a second direction (perpendicular to the base plate); the thicknesses of the at least two connected arms are different. Among the at least two connected arms, the one with a larger thickness is formed with a recessed area on the side facing the one with a smaller thickness in the folded state, and in the folded state, the one with a smaller thickness is partially fitted into the recessed area.</p>
      </isu-abst>
      <representative-img>
        <p type="p">220:折疊臂機構</p>
        <p type="p">221:第一臂</p>
        <p type="p">222:第二臂</p>
        <p type="p">223:第三臂</p>
        <p type="p">230:夾爪機構</p>
        <p type="p">231:夾爪臂</p>
        <p type="p">232:夾爪</p>
        <p type="p">240:旋轉座</p>
        <p type="p">2201:凹陷區域</p>
        <p type="p">2202:嵌合空間</p>
        <p type="p">D1:第一方向</p>
        <p type="p">D2:第二方向</p>
        <p type="p">D3:第三方向</p>
        <p type="p">H1:第一高度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10004.bmp" file="ed10004.bmp" height="473px" img-content="tif" inline="yes" orientation="portrait" width="621px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623257</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145957</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260102B">H04N19/577</main-classification>
        <further-classification edition="201401120260102B">H04N19/176</further-classification>
        <further-classification edition="201401120260102B">H04N19/105</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯發科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEDIATEK INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳冠豪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, GUAN-HAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>古博文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KU, PO-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊政彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, CHENG-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱志堯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIU, CHIH-YAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賴貞延</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAI, CHEN-YEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊子德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, TZU-DER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慶曄</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHING-YEH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐志瑋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, CHIH-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳渏紋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, YI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,494</doc-number>
          <date>20241125</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2025/136496</doc-number>
          <date>20251120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於影片編解碼系統中預測細化的模板區域生成增強的方法和裝置</chinese-title>
        <english-title>METHOD AND APPARATUS OF TEMPLATE AREA GENERATION ENHANCEMENT FOR PREDICTION REFINEMENT IN VIDEO CODING SYSTEMS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種用於基於樣本的預測細化的影片編解碼的方法和裝置。根據該方法，確定當前塊的模板區域。使用基於子塊的運動補償生成當前塊的模板區域的參考模板。確定模板樣本集的位置相關權重（PRWs）。從所述一個或多個相應PRWs集加權的推導模板樣本的總和中推導當前塊的目標預測樣本的基於樣本的預測偏移（SPO），並且所述一個或多個PRWs集的每個權重依賴於目標模板樣本相對於模板區域的第一位置和目標預測樣本相對於當前塊的第二位置。使用SPO細化目標預測樣本以生成細化的預測樣本。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method and apparatus for sample-based prediction refinement in video coding are disclosed. According to the method, a template area of the current block is determined. A reference template for the template area of the current block is generated using subblock-based motion compensation. Position-Related Weights (PRWs) are determined for the set of template samples. An SPO (Sample-Based Prediction Offset) is derived for a target prediction sample of the current block from a sum of derived template samples weighted by said one or more sets of respective PRWs, and wherein each weight of each set of said one or more sets of PRWs is dependent on a first position of a target template sample with respect to the template area and a second position of the target prediction sample with respect to the current block. The target prediction sample is refined using the SPO to generate a refined prediction sample.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1310,1320,1330,1340,1350,1360,1370:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.bmp" file="ed10013.bmp" height="1031px" img-content="tif" inline="yes" orientation="portrait" width="670px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202622265</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114145960</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
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        <main-classification edition="200601120251205B">C23C14/34</main-classification>
        <further-classification edition="200601120251205B">C22C19/03</further-classification>
        <further-classification edition="200601120251205B">C22F1/10</further-classification>
        <further-classification edition="200601120251205B">B22F5/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商攀時（上海）高性能材料有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLANSEE SHANGHAI HIGH PERFORMANCE MATERIAL LTD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧地利商普蘭西股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PLANSEE SE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高則翠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, ZECUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>施密特　亨里克</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHMIDT, HENNRIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝勒　托馬斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SCHERER, THOMAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程東驥</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, DONGJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117015101</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鎳鉬濺射靶</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及一種通過粉末冶金生產的鎳鉬濺射靶（NiMo濺射靶），其包含10重量%至20重量%的鉬，餘量為Ni和不可避免的雜質，該濺射靶具有等於或小於10000 A/m的飽和磁化強度（Ms）。本發明還涉及一種通過粉末冶金法生產NiMo濺射靶的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="405px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621648</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114145967</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260130B">A61B17/80</main-classification>
        <further-classification edition="200601120260130B">A61B17/56</further-classification>
        <further-classification edition="200601120260130B">A61B17/58</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波蘭商ＣＨＭ有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
              <english-address>PL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>茲錐克　安錐</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KRZYŻEK, ANDRZEJ</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
              <english-address>PL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史丹維奇　羅斯蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZDANOWICZ, RUSLAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
              <english-address>PL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>牧拉維琪　畢格斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MURAWSKI, ZBIGNIEW</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
              <english-address>PL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>札查　史瓦密</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZACHA, SŁAWOMIR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>PL</english-country>
              <english-address>PL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何崇熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐吉良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>桃園市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>EP24461641.3</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>漏斗胸矯正板系統</chinese-title>
        <english-title>PECTUS BAR SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種漏斗胸矯正板系統，包括至少一個具有細長形狀的矯正板，其具有成排孔，以及一穩定板，該穩定板適於附著在患者胸部的側面。穩定板和矯正板適於通過所述孔的螺栓彼此連接。矯正板中的孔設有內螺紋。該系統進一步包括一個無頭雙螺紋定位螺釘，設有承窩，並具有與矯正板中的孔的螺紋互補的第一螺紋。定位螺釘還設有穿過穩定板中的孔的第二螺紋。該系統還包括一個螺帽，設有與定位螺釘的第二螺紋互補的內螺紋。螺帽具有比穩定板中的孔更寬的頭部。矯正板在孔周圍設有齒紋，而穩定板在孔周圍至少部分圓周上設有與矯正板的齒紋互補的齒紋。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:矯正板</p>
        <p type="p">15:孔</p>
        <p type="p">20:定位螺釘</p>
        <p type="p">30:穩定板</p>
        <p type="p">35:孔</p>
        <p type="p">40:螺帽</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="700px" img-content="tif" inline="yes" orientation="portrait" width="664px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622537</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146017</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
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        <main-classification edition="202001120260302B">G01S17/32</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商杭州眾硅電子科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏佳健</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI,JIAJIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024116930911</doc-number>
          <date>20241125</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>一種用於半導體濕法設備的晶圓定位檢測方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開了一種用於半導體濕法設備的晶圓定位檢測方法，包括以下步驟：檢測演算法數據校準，裝有已知位置晶圓的片盒放置於箱體；感測器按設定速度和方向掃描片盒，並記錄每次觸發訊號時間；對獲取的觸發訊號計算處理；在校準狀態下，根據第一處理訊號及已知晶圓的相對位置，計算得出片盒相鄰兩層間隔距離及第一層晶圓位置；進入工作狀態，裝有未知位置晶圓的片盒放置於箱體，感測器按照設定的速度和方向掃描片盒，記錄每次觸發訊號的時間；對獲取的觸發訊號計算進行處理；得到片盒內所有晶圓的相對位置資訊。本發明解決了晶圓傾斜放置在帶有流體介質的片盒內無法準確定位檢測的問題，為後續的晶圓抓取提供了準確的定位檢測。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:晶圓</p>
        <p type="p">2:片盒</p>
        <p type="p">3:箱體</p>
        <p type="p">4:感測器</p>
        <p type="p">5:流體介質</p>
        <p type="p">6:液面感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10006.JPG" file="ed10006.JPG" height="518px" img-content="tif" inline="yes" orientation="portrait" width="693px">
          </img>
        </representative>
      </representative-img>
    </description>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622366</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146067</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260122B">F04D29/05</main-classification>
        <further-classification edition="200601120260122B">F04D25/08</further-classification>
        <further-classification edition="200601120260122B">F04D25/06</further-classification>
        <further-classification edition="200601120260122B">F04D29/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商尼得科股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIDEC CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福永敏一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUNAGA, TOSHIKAZU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-208334</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>送風裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭露提供了一種送風裝置。送風裝置具有殼體、馬達及葉輪。殼體具有貫通孔部。馬達配置於貫通孔部。葉輪配置於貫通孔部內，藉由利用馬達而旋轉，使貫通孔部產生在軸向上流動之氣流。殼體具有本體部、基底部及靜葉片。本體部具有上述貫通孔部。基底部配置於貫通孔部內。靜葉片從貫通孔部之內壁向內側突出，於本體部之外表面形成有引線收容槽。上述靜葉片在周向上排列，與上述引線收容槽在周向上相鄰之靜葉片係隔著間隙而與基底部在徑向上相對，剩餘之上述靜葉片與上述基底部連結。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:殼體</p>
        <p type="p">11:本體部</p>
        <p type="p">12:基底部</p>
        <p type="p">13:靜葉片</p>
        <p type="p">14:凹部</p>
        <p type="p">15:引線收容槽</p>
        <p type="p">16:引線按壓部</p>
        <p type="p">17:軸支撐部</p>
        <p type="p">18:下表面</p>
        <p type="p">25:引線</p>
        <p type="p">100:送風裝置</p>
        <p type="p">110:側面</p>
        <p type="p">110a:側面</p>
        <p type="p">110b:側面</p>
        <p type="p">111:貫通孔部</p>
        <p type="p">112:角部</p>
        <p type="p">112a:角部</p>
        <p type="p">114:排氣口</p>
        <p type="p">121:底板部</p>
        <p type="p">122:側壁部</p>
        <p type="p">123:凹口部</p>
        <p type="p">151:開口</p>
        <p type="p">161:引線穿過部</p>
        <p type="p">170:支撐套筒</p>
        <p type="p">181:凹槽</p>
        <p type="p">C1:中心軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="867px" img-content="tif" inline="yes" orientation="portrait" width="747px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623650</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146068</doc-number>
          <kind></kind>
          <date>114/11/25</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W42/60</main-classification>
        <further-classification edition="202601120260302B">H10P72/30</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛帷半導體設備（上海）有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (LINGANG), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊超繁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, CHAOFAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賈社娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIA, SHENA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張大海</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, DAHAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117151430</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基片傳輸系統靜電消除裝置及方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請公開了一種基片傳輸系統靜電消除裝置及方法，涉及半導體製造設備領域，基片傳輸系統靜電消除裝置包括：設備本體；裝載端設置於設備本體的外部，設備本體上設置有連通口，連通口用於連通設備本體的外部和內部，基片盒與連通口相對設置，門設置於連通口處；機械手，設置於設備本體的內部；靜電消除單元，包括第一移動機構和至少一個靜電消除器，靜電消除單元被配置為：在機械手持有至少一片基片時，第一移動機構帶動靜電消除器移動至基片的上方，靜電消除器消除基片上的靜電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基片盒</p>
        <p type="p">W:基片</p>
        <p type="p">200:設備本體</p>
        <p type="p">210:裝載端</p>
        <p type="p">220:連通口</p>
        <p type="p">230:門</p>
        <p type="p">240:開關門機構</p>
        <p type="p">241:導軌</p>
        <p type="p">243:連接部件</p>
        <p type="p">242:氣缸</p>
        <p type="p">300:靜電消除單元</p>
        <p type="p">310:靜電消除器</p>
        <p type="p">320:第一移動機構</p>
        <p type="p">321:氣缸</p>
        <p type="p">322:導軌</p>
        <p type="p">400:靜電檢測單元</p>
        <p type="p">410:靜電檢測器</p>
        <p type="p">420:第二移動機構</p>
        <p type="p">500:機械手</p>
        <p type="p">510:取片叉</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.bmp" file="ed10001.bmp" height="625px" img-content="tif" inline="yes" orientation="portrait" width="671px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622096</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146101</doc-number>
          <kind></kind>
          <date>114/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07F7/22</main-classification>
        <further-classification edition="200601120260302B">C08G79/12</further-classification>
        <further-classification edition="200601120260302B">C07C205/12</further-classification>
        <further-classification edition="200601120260302B">C07C255/50</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
        <further-classification edition="202601120260302B">H10P76/00</further-classification>
        <further-classification edition="201101120260302B">B82Y40/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星ＳＤＩ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG SDI CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡閏珠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHAE, YUNJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓美蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, MIYEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓俊熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, JOONHEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金智敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JIMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張水民</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SUMIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林秀斌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, SOOBIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金經睦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, KYUNGMOG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李采恩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHAEEUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175744</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體光阻組成物、光阻圖案及形成圖案的方法</chinese-title>
        <english-title>SEMICONDUCTOR PHOTORESIST COMPOSITION, PHOTORESIST PATTERN, AND METHOD OF FORMING PATTERNS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">公開了一種半導體光阻組成物、光阻圖案和形成圖案的方法，半導體光阻組成物包括有機金屬化合物；包括鹵素和除鹵素以外的拉電子基（EWG）的芳香環化合物；以及溶劑。本發明可實現優異解析度。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed are a semiconductor photoresist composition, a photoresist pattern and a method of forming patterns, the semiconductor photoresist composition including an organometallic compound; an aromatic ring compound including a halogen and an electron withdrawing group (EWG) other than a halogen; and a solvent. The present invention can implement excellent resolution.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:基底</p>
        <p type="p">108:光阻圖案</p>
        <p type="p">112:有機膜圖案</p>
        <p type="p">114:薄膜圖案</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10034.JPG" file="ed10034.JPG" height="513px" img-content="tif" inline="yes" orientation="portrait" width="638px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622171</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146136</doc-number>
          <kind></kind>
          <date>114/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260120B">C08L33/10</main-classification>
        <further-classification edition="200601120260120B">C08K3/22</further-classification>
        <further-classification edition="202201120260120B">C01F7/02</further-classification>
        <further-classification edition="202201120260120B">B22F1/065</further-classification>
        <further-classification edition="201901120260120B">B32B7/027</further-classification>
        <further-classification edition="201801120260120B">C09J7/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商住友化學股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUMITOMO CHEMICAL COMPANY, LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>島崎泰治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIMAZAKI, YASUHARU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伊藤友宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ITO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>幡中伸行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HATANAKA, NOBUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-209073</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>膜</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的目的在於提供一種膜，其為薄膜的熱傳導性膜，且可容易地將發熱體與散熱體接著。本發明為一種膜，由包含(甲基)丙烯酸系樹脂及氧化鋁粒子的樹脂組成物形成，所述膜中，所述氧化鋁粒子在所述樹脂組成物的固體成分100體積%中包含50體積%以上，並且在粒度分佈中具有一個以上的波峰，在將氧化鋁粒子100質量%中具有包含粒徑最大的波峰的粒度分佈的氧化鋁粒子A的比例設為X質量%，將氧化鋁粒子A的D50設為Y（μm），將所述膜的厚度設為Z（μm）時，Y為2.0 μm以上，Z小於100 μm，且滿足下述式（1）。  &lt;br/&gt;&lt;br/&gt;Z/（Y×X/100）≧2.5  …（1）</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622937</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146162</doc-number>
          <kind></kind>
          <date>114/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260219B">G09G3/20</main-classification>
        <further-classification edition="201901120260219B">G06F1/3203</further-classification>
        <further-classification edition="201901120260219B">G06F1/3296</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>聯詠科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOVATEK MICROELECTRONICS CORP.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅吉逸</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LO, CHI-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳豐任</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戴俊彥</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/724,911</doc-number>
          <date>20241126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>節省耗電的方法及其顯示驅動電路</chinese-title>
        <english-title>METHOD OF SAVING POWER CONSUMPTION AND DISPLAY DRIVER CIRCUIT USING THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於一顯示驅動電路之方法，包含有下列步驟：透過一顯示介面接收顯示資料；偵測該顯示驅動電路是否進入一非運作狀態，在該非運作狀態中該顯示驅動電路停止刷新一顯示面板；以及響應偵測到該顯示驅動電路進入該非運作狀態，將該顯示驅動電路之一內部電路設定於一供電狀態，以節省內部電路的耗電。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method for a display driver circuit includes steps of: receiving display data through a display interface; detecting whether the display driver circuit enters a non-active state in which the display driver circuit stops refreshing a display panel; and in response to detecting that the display driver circuit enters the non-active state, configuring a power supply state for an internal circuit of the display driver circuit to save power consumption of the internal circuit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">20:電源控制流程</p>
        <p type="p">202~206:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="629px" img-content="tif" inline="yes" orientation="portrait" width="597px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622672</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146168</doc-number>
          <kind></kind>
          <date>114/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202401120260122B">G05D1/617</main-classification>
        <further-classification edition="202401120260122B">G05D1/622</further-classification>
        <further-classification edition="202401120260122B">G05D1/46</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中國大陸商深圳市海柔創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAI ROBOTICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>匡成鎮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KUANG, CHENGZHEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>紀畊宇</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117658267</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>機器人碰撞檢測的方法、裝置、設備和程式產品</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開提供一種機器人碰撞檢測的方法、裝置、設備和程式產品。本公開的方法，通過計算第一機器人和第二機器人在運動過程的輪廓空間，並根據第一機器人和第二機器人在運動過程的輪廓空間是否存在重疊，來預測第一機器人和第二機器人在運動過程中是否會發生碰撞，可以更加精准地檢測機器人在運動過程中是否發生碰撞，能夠適用于機器人可沿豎直方向上下移動的倉儲系統，提升了機器人碰撞檢測的精確度，從而提高了機器人調度效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S301:步驟</p>
        <p type="p">S302:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10060.JPG" file="ed10060.JPG" height="408px" img-content="tif" inline="yes" orientation="portrait" width="733px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622468</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146250</doc-number>
          <kind></kind>
          <date>114/11/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251226B">G01F1/48</main-classification>
        <further-classification edition="200601120251226B">G01F1/684</further-classification>
        <further-classification edition="200601120251226B">G05D7/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商伊原科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>IHARA SCIENCE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商堀場ＳＴＥＣ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HORIBA STEC, CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村美良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, MIYOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岸亨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KISHI, TORU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安田忠弘</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YASUDA, TADAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許世正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207399</doc-number>
          <date>20241128</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2025-142679</doc-number>
          <date>20250828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>流道結構、流體測量裝置和流體控制裝置</chinese-title>
        <english-title>CHANNEL STRUCTURE, FLUID MEASUREMENT APPARATUS, AND FLUID CONTROL APPARATUS</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供流道結構、流體測量裝置和流體控制裝置，在不對流體阻力構件施加不需要的力的情況下進行固定並確保密封性，具備：管構件（11a、11b），構成流道（R）；陶瓷製的流體阻力構件（2），設置於流道（R），並具有一條或多條阻力流道（2a）；以及固定機構（3），透過被管構件（11a、11b）夾持，將流體阻力構件（2）固定於流道（R），固定機構（3）具有：密封部（4），密封流體阻力構件（2）的外周面；以及按壓固定部（5），將流體阻力構件（2）的外周面按壓並固定，密封部（4）和按壓固定部（5）在流體阻力構件（2）的軸向上至少設置在相互不同的位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention fixes a fluidic resistor member while ensuring sealability, without applying unnecessary force thereto. The fluidic resistor member includes: pipe members 11a, 11b each forming a channel R; a fluidic resistor member 2 that is made of ceramic, that is provided in the channel R, and that has one or more resistor channels 2a; and a fixing mechanism 3 that fixes the fluidic resistor member 2 to the channel R by being nipped between the pipe members 11a, 11b. The fixing mechanism 3 includes a seal 4 that provides sealing on an outer peripheral surface of the fluidic resistor member 2 and a press-fixing portion 5 that fixes the fluidic resistor member 2 by pressing the outer peripheral surface of the fluidic resistor member 2. The seal 4 and the press-fixing portion 5 are provided at least at different positions in an axial direction of the fluidic resistor member 2.</p>
      </isu-abst>
      <representative-img>
        <p type="p">R:流道</p>
        <p type="p">10:流道結構</p>
        <p type="p">2:流體阻力構件</p>
        <p type="p">2a:阻力流道</p>
        <p type="p">3:固定機構</p>
        <p type="p">4:密封部</p>
        <p type="p">5:按壓固定部</p>
        <p type="p">6:墊圈</p>
        <p type="p">7a,7b:固定構件</p>
        <p type="p">12:連結機構</p>
        <p type="p">121:卡箍主體</p>
        <p type="p">121m:凹槽</p>
        <p type="p">122:緊固部</p>
        <p type="p">122a:螺栓構件</p>
        <p type="p">111:凸緣部</p>
        <p type="p">112:突起</p>
        <p type="p">11a,11b:管構件</p>
        <p type="p">113,1211:傾斜面</p>
        <p type="p">114:臺階部</p>
        <p type="p">121c:卡箍部件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="872px" img-content="tif" inline="yes" orientation="portrait" width="626px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622318</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146306</doc-number>
          <kind></kind>
          <date>114/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260213B">D06F58/20</main-classification>
        <further-classification edition="200601120260213B">D06F58/04</further-classification>
        <further-classification edition="200601120260213B">D06F58/26</further-classification>
        <further-classification edition="200601120260213B">D06F58/02</further-classification>
        <further-classification edition="202001320260213B">D06F105/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫學遜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XUEXUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117452550</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229450231</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>吸濕排濕系統、烘乾模組和衣物處理設備</chinese-title>
        <english-title>MOISTURE-ABSORPTION AND DEHUMIDIFICATION SYSTEM, DRYING MODULE AND LAUNDRY PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請提供吸濕排濕系統、烘乾模組和衣物處理設備。吸濕排濕系統包括吸濕排濕件、吸濕排濕殼體和第二驅動件。吸濕排濕件設於吸濕排濕殼體內。吸濕排濕殼體上設有第一開口和第二開口，第一開口和第二開口分別用於暴露吸濕排濕件的不同的部分。第二驅動件與吸濕排濕件連接，第二驅動件用於驅動吸濕排濕件轉動。第二驅動件沿徑向偏離於第一開口設置，第二驅動件對第一開口的遮擋面積可以減小。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application provides a moisture-absorption and dehumidification system, a drying module and a laundry processing apparatus. The moisture-absorption and dehumidification system includes a moisture-absorption and dehumidification member, a moisture-absorption and dehumidification housing and a second driving menmber. The moisture-absorption and dehumidification member is arranged in the moisture-absorption and dehumidification housing. The moisture-absorption and dehumidification housing includes a first opening and a second opening, and the first opening and the second opening are respectively located at different portions of the moisture-absorption and dehumidification member. The second driving member is connected to the moisture-absorption and dehumidification member for driving the moisture-absorption and dehumidification member to rotate. The second driving member is radially offset from the first opening, thereby minimizing an obscured area of the first opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">4:吸濕排濕系統</p>
        <p type="p">4110:第一開口</p>
        <p type="p">4114:第一外導風面</p>
        <p type="p">412:第二殼體</p>
        <p type="p">43:第二驅動件</p>
        <p type="p">442:再生風機</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10029.JPG" file="ed10029.JPG" height="451px" img-content="tif" inline="yes" orientation="portrait" width="703px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622314</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146309</doc-number>
          <kind></kind>
          <date>114/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260129B">D06F58/04</main-classification>
        <further-classification edition="200601120260129B">D06F58/10</further-classification>
        <further-classification edition="200601120260129B">D06F58/20</further-classification>
        <further-classification edition="200601120260129B">D06F58/24</further-classification>
        <further-classification edition="200601120260129B">D06F58/26</further-classification>
        <further-classification edition="200601120260129B">D06F25/00</further-classification>
        <further-classification edition="202001320260129B">D06F105/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉通</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, TONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓先山</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAN, XIANSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫學遜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XUEXUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡承兵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, CHENGBING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117453498</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229437307</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>烘乾模組和衣物處理設備</chinese-title>
        <english-title>A DRYING MODULE AND A LAUNDRY TREATMENT DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請適用於家用電器技術領域，提供了一種烘乾模組和衣物處理設備，烘乾模組包括底座組件和吸濕排濕系統，底座組件包括底座和上蓋，底座包括底板、設於底板上的第一側板，上蓋與第一側板的端面連接，以限定出主烘乾風道，吸濕排濕系統包括吸濕排濕殼體以及轉動設於吸濕排濕殼體內的吸濕排濕件，吸濕排濕殼體的至少一部分和吸濕排濕件設於主烘乾風道內，吸濕排濕件的轉動中心軸線與主烘乾風道內的風向平行。烘乾模組的過風效率高、風阻小，該衣物處理設備同時具備烘乾速度快、能耗低的優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">This application applies to the technical field of household appliances and provides a drying module and a laundry treatment device. The drying module comprises a base assembly and a moisture absorption and discharge system. The base assembly includes a base and an upper cover. The base includes a base plate and a first side plate provided on the base plate. The upper cover is connected to the end surface of the first side plate to define a main drying air duct. The moisture absorption and discharge system includes a moisture absorption and discharge housing and a moisture absorption and discharge member rotatably provided within the housing. At least a portion of the moisture absorption and discharge housing and the moisture absorption and discharge member are disposed within the main drying air duct. The central rotation axis of the moisture absorption and discharge member is parallel to the air flow direction within the main drying air duct. This configuration results in high air passage efficiency and low air resistance for the drying module. Consequently, the laundry treatment device equipped with this module offers the advantages of fast drying speed and low energy consumption.</p>
      </isu-abst>
      <representative-img>
        <p type="p">11:底座組件</p>
        <p type="p">110:主烘乾風道</p>
        <p type="p">113:走水通道</p>
        <p type="p">12:底座</p>
        <p type="p">121:第一側板</p>
        <p type="p">1210:第一排水口</p>
        <p type="p">123:集水盒</p>
        <p type="p">124:墊高塊</p>
        <p type="p">1240:第一安裝腔</p>
        <p type="p">1243:第三墊高塊</p>
        <p type="p">125:第三側板</p>
        <p type="p">1250:前置風道</p>
        <p type="p">1251:第四連通口</p>
        <p type="p">1252:第五連通口</p>
        <p type="p">13:上蓋</p>
        <p type="p">14:隔離板</p>
        <p type="p">141:漏水孔</p>
        <p type="p">142:擋水條</p>
        <p type="p">144:擋邊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10025.JPG" file="ed10025.JPG" height="494px" img-content="tif" inline="yes" orientation="portrait" width="719px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622315</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146315</doc-number>
          <kind></kind>
          <date>114/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260129B">D06F58/04</main-classification>
        <further-classification edition="200601120260129B">D06F58/10</further-classification>
        <further-classification edition="200601120260129B">D06F58/20</further-classification>
        <further-classification edition="200601120260129B">D06F58/24</further-classification>
        <further-classification edition="200601120260129B">D06F58/26</further-classification>
        <further-classification edition="200601120260129B">D06F25/00</further-classification>
        <further-classification edition="202001320260129B">D06F105/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫學遜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XUEXUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂昆餘</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117463451</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229460407</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>吸濕排濕系統、烘乾模組及衣物處理設備</chinese-title>
        <english-title>MOISTURE-ABSORPTION AND DEHUMIDIFICATION SYSTEM, DRYING MODULE AND LAUNDRY PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請的吸濕排濕系統包括吸濕排濕殼體、吸濕排濕件。吸濕排濕件包括吸濕部和脫附部。吸濕排濕殼體上設有通過吸濕部連通的第一開口和第二開口，吸濕排濕殼體內設有位於脫附部軸向兩側的進風風道部和出風風道部，進風風道部和出風風道部通過脫附部連通。吸濕排濕殼體的外表面設有至少一個外導風面，外導風面在朝向吸濕排濕件中心軸線的方向上逐漸向脫附部傾斜，用於引導主烘乾風道內空氣到達吸濕排濕件的吸濕部和/或引導從吸濕部流出的空氣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The moisture-absorption and dehumidification system of the present disclosure includes a moisture-absorption and dehumidification housing and a moisture-absorption and dehumidification member. The moisture-absorption and dehumidification member includes a moisture-absorption portion and a desorption portion. The moisture-absorption and dehumidification housing includes a first opening and a second opening communicated with each other by the moisture-absorption portion and an air inlet duct portion and an air outlet duct portion located on opposite sides of the desorption porion in an axial direction of the desorption porion, and the air inlet duct portion is communicated with the air outlet duct portion by the desorption portion. An outer surface of the moisture-absorption and dehumidification housing includes at least one external air guide face, and the external air guide face gradually inclines toward the desorption portion facing to a central axial direction of the moisture-absorption and dehumidification member so as to guide air from a main drying duct to the moisture-absorption portion of the moisture-absorption and dehumidification member and/or guide air flowing out from the moisture-absorption portion.</p>
      </isu-abst>
      <representative-img>
        <p type="p">41:吸濕排濕殼體</p>
        <p type="p">4101:脫附區</p>
        <p type="p">4102:吸濕區</p>
        <p type="p">411:第一殼體</p>
        <p type="p">4111:馬達安裝槽</p>
        <p type="p">4112:限位槽</p>
        <p type="p">4113:第一內導風面</p>
        <p type="p">4114:第一外導風面</p>
        <p type="p">4115:出風風道部</p>
        <p type="p">412:第二殼體</p>
        <p type="p">4120:第二開口</p>
        <p type="p">4121:安裝台</p>
        <p type="p">4123:第二內導風面</p>
        <p type="p">4124:第二外導風面</p>
        <p type="p">4125:進風風道部</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10036.JPG" file="ed10036.JPG" height="498px" img-content="tif" inline="yes" orientation="portrait" width="675px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622177</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
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        <document-id>
          <doc-number>114146323</doc-number>
          <kind></kind>
          <date>114/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260116B">C08L63/10</main-classification>
        <further-classification edition="200601120260116B">C08K5/5333</further-classification>
        <further-classification edition="200601120260116B">C08K5/33</further-classification>
        <further-classification edition="200601120260116B">G03F7/038</further-classification>
        <further-classification edition="200601120260116B">C08F2/50</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商太陽控股股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TAIYO HOLDINGS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏澄江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASHIWA, SUMIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>信田和哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NOBUTA, KAZUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加藤文崇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATO, FUMITAKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>岡本大地</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OKAMOTO, DAICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207734</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>硬化性樹脂組成物、乾膜、硬化物及印刷配線板</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明課題在於提供一種硬化性樹脂組成物，其即便填充球狀無機粒子，在厚膜下之解析性仍優異，且硬化物之耐冷熱循環性性或長期耐熱性優異。&lt;br/&gt;  作為其解決手段，本發明硬化性樹脂組成物之特徵在於：其係可鹼性顯影者，且含有(A)鹼可溶性樹脂、(B)熱硬化性成分、(C)光聚合引發劑、(D)有機粒子及(E)無機粒子；相對於前述硬化性樹脂組成物之總固體成分量，前述(E)無機粒子之含量為20體積%以上；前述(E)無機粒子包含(E-1)第一無機粒子；前述(E-1)第一無機粒子之平均一次粒徑為40nm以上且400nm以下；且，相對於前述(E)無機粒子之總固體成分量，前述(E-1)第一無機粒子之含量為20體積%以上且90體積%以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">(無)</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622211</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146332</doc-number>
          <kind></kind>
          <date>114/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260205B">C09K5/10</main-classification>
        <further-classification edition="200601120260205B">C08L83/10</further-classification>
        <further-classification edition="200601120260205B">C08L83/14</further-classification>
        <further-classification edition="200601120260205B">C08G77/12</further-classification>
        <further-classification edition="200601120260205B">C08G77/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商瓦克化學公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WACKER CHEMIE AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張思原</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZHANG, SIYUAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范勝華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, SHENGHUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2024/135608</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>矽酮組合物</chinese-title>
        <english-title>SILICONE COMPOSITION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於一種傳熱流體組合物，其中包含矽酮A及／或由矽酮A縮合而成的矽氧烷低聚物B；前提是該矽氧烷低聚物B包含至少一個與矽原子鍵合的OR基團。該組合物可用於冷卻流體領域，例如浸沒式冷卻流體，以及使用浸沒式冷卻流體的製程和系統。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to a heat transfer fluid composition. It contains the silicone A; and/or the siloxane oligomer B condensed by the silicone A; with the proviso that siloxane oligomer B contains at least one OR group bonded on the silicon atom. The composition can be used in the field of cooling fluids, such as immersion cooling fluids, processes and systems using immersion cooling fluid.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622905</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146352</doc-number>
          <kind></kind>
          <date>114/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202201120260220B">G06V10/764</main-classification>
        <further-classification edition="200601120260220B">B07C5/342</further-classification>
        <further-classification edition="202201120260220B">G06V20/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>長屋皓紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAGAYA, HIROKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石垣雄亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIGAKI, YUSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西名慶晃</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHINA, YOSHIAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207423</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>比例判定系統、比例判定方法、比例判定程式、記錄介質及放置場所分選方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種能夠提高混合存在有多種對象物體的對象物集合體中的每種對象物體的存在比例的判定精度的比例判定系統、比例判定方法、比例判定程式、記錄介質及放置場所分選方法。具體而言，一種比例判定系統（1），包括：拍攝裝置（2），對包含混合存在有多種對象物體的對象物集合體的圖像進行拍攝；以及運算裝置（3），算出圖像中所含的對象物集合體中的每種對象物體的存在比例，所述比例判定系統（1）中，運算裝置（3）具有使用比例判定模型（5A）來算出每種對象物體的存在比例的比例算出部（3B），所述比例判定模型（5A）是將包含對象物集合體的圖像作為輸入資料、將對象物集合體中的每種對象物體的存在比例作為教師資料並藉由機器學習而預先生成的學習完畢模型。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:比例判定系統</p>
        <p type="p">2:拍攝裝置</p>
        <p type="p">2A:攝像部</p>
        <p type="p">2B:位置資訊獲取部</p>
        <p type="p">2C:拍攝部位設定部</p>
        <p type="p">2D:相機控制部</p>
        <p type="p">3:運算裝置</p>
        <p type="p">3A:圖像獲取部</p>
        <p type="p">3B:比例算出部</p>
        <p type="p">3C:整體算出部</p>
        <p type="p">3D:計算部</p>
        <p type="p">4:學習裝置</p>
        <p type="p">4A:圖像獲取部</p>
        <p type="p">4B:圖像處理部</p>
        <p type="p">4C:機器學習部</p>
        <p type="p">5:儲存裝置</p>
        <p type="p">5A:比例判定模型</p>
        <p type="p">5B:集合體識別模型</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="733px" img-content="tif" inline="yes" orientation="portrait" width="1027px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623697</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146411</doc-number>
          <kind></kind>
          <date>114/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W74/10</main-classification>
        <further-classification edition="202601120260302B">H10W70/01</further-classification>
        <further-classification edition="202601120260302B">H10W70/685</further-classification>
        <further-classification edition="200601120260302B">H05K3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蒲應江</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PU, YINGJIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔣　航</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JIANG, HUNT HANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117218642</doc-number>
          <date>20241128</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>層疊基板及用於製造層疊基板的方法</chinese-title>
        <english-title>LAMINATED SUBSTRATE AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭示了一種具有可潤濕側面的層疊基板，在該層疊基板的焊墊上具有可填充焊料的凹陷。該凹陷貫穿層疊基板的第二圖案化導電結構、金屬壩體並延伸至第一圖案化導電結構，具有形貌可控，可靠性高等優點。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a laminated substrate with wettable flank, featuring recesses on its pads that can be filled with solder. These recesses penetrate the substrate's second patterned conductive structure and metal bar, extending to the substrate's first patterned conductive structure. This design offers advantages such as controllable morphology and high reliability.</p>
      </isu-abst>
      <representative-img>
        <p type="p">601:層疊基板</p>
        <p type="p">610:凹陷</p>
        <p type="p">611:焊墊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="534px" img-content="tif" inline="yes" orientation="portrait" width="600px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622254</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146508</doc-number>
          <kind></kind>
          <date>114/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260220B">C21C7/00</main-classification>
        <further-classification edition="200601120260220B">G05B13/04</further-classification>
        <further-classification edition="201901120260220B">G06N20/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商杰富意鋼鐵股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JFE STEEL CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加瀨寛人</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KASE, HIROTO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤新吾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, SHINGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉野智裕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGINO, TOMOHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>小笠原太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OGASAWARA, FUTOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>渡久地祐輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOGUCHI, YUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-207939</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>精煉控制裝置及精煉控制方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的精煉控制裝置中，使用計算對象的精煉處理條件及精煉處理的操作量的預定值來算出計算對象的精煉處理的狀態量的預測值，使用類似的過去的精煉處理的作業實績資料，來生成表示精煉處理的狀態量的變化量與精煉處理的操作量的關係的控制模型，使用類似的過去的精煉處理的作業實績資料，將過去的精煉處理中的狀態量的預測值與實績值的差作為誤差進行評價，並基於誤差的評價結果來修正計算對象的精煉處理的狀態量的目標值，藉由將狀態量的預測值與所修正的目標值的差作為狀態量的變化量輸入至控制模型，而算出用於使精煉處理的狀態量接近所修正的目標值的精煉處理的操作量。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:精煉控制裝置</p>
        <p type="p">2:精煉設備</p>
        <p type="p">10:控制終端</p>
        <p type="p">11:輸入裝置</p>
        <p type="p">12:過去實績資料庫(過去實績DB)</p>
        <p type="p">13:運算處理部</p>
        <p type="p">14:狀態量預測部</p>
        <p type="p">15:控制模型生成部</p>
        <p type="p">16:目標值修正部</p>
        <p type="p">17:操作量決定部</p>
        <p type="p">20:顯示裝置</p>
        <p type="p">100:轉爐</p>
        <p type="p">101:熔態金屬</p>
        <p type="p">102:噴管</p>
        <p type="p">103:熔渣</p>
        <p type="p">104:導管</p>
        <p type="p">105:通氣孔</p>
        <p type="p">106:流量計</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10016.JPG" file="ed10016.JPG" height="785px" img-content="tif" inline="yes" orientation="portrait" width="1022px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621798</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146513</doc-number>
          <kind></kind>
          <date>114/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">B05B13/02</main-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商盛美半導體設備（上海）股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH (SHANGHAI), INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>韓商盛美半導體設備韓國有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ACM RESEARCH KOREA CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商清芯科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CLEANCHIP TECHNOLOGIES LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐飛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, FEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>袁禕</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YUAN, YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, JUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>程成</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, CHENG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, HUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李康植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, KANG-SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>秦建譜</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117536753</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>噴嘴元件及基板處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種噴嘴元件及基板處理裝置，該噴嘴元件包括：接頭，接頭的內部設置有第一通孔，接頭的外側設置有第一卡槽，接頭用於連接處理液存儲機構；噴嘴主體，噴嘴主體的內部設置有第二通孔，噴嘴主體的外側設置有第二卡槽，噴嘴主體用於向基板噴射處理液；卡扣，卡扣被構造為與第一卡槽和第二卡槽相配合；其中，在裝配狀態下，接頭與噴嘴主體沿同一軸線相對接，卡扣與第一卡槽和第二卡槽相連接，並在接頭與噴嘴主體的相向側施加沿軸線的預緊力，使第一通孔與第二通孔密封連接&lt;b&gt;。&lt;/b&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">100:噴嘴元件</p>
        <p type="p">110:接頭</p>
        <p type="p">114:第一卡槽</p>
        <p type="p">1141:第一環形凹槽</p>
        <p type="p">120:噴嘴主體</p>
        <p type="p">124:第二卡槽</p>
        <p type="p">1241:第二環形凹槽</p>
        <p type="p">130:卡扣</p>
        <p type="p">131:卡扣主體</p>
        <p type="p">132:第一限位部</p>
        <p type="p">1321:第一U形槽</p>
        <p type="p">133:第二限位部</p>
        <p type="p">1331:第二U形槽</p>
        <p type="p">134:手柄</p>
        <p type="p">140:墊圈</p>
        <p type="p">150:輸液管</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10008.JPG" file="ed10008.JPG" height="887px" img-content="tif" inline="yes" orientation="portrait" width="672px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623548</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146538</doc-number>
          <kind></kind>
          <date>114/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P54/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＰＳＫ控股公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PSK HOLDINGS INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹星進</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, SUNG JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金泰徹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, TAE CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹會淨</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOON, HOI JUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朴鐘範</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PARK, JONGBUM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張東鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, DONG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張耀暉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0175182</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板的切割方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種基板的切割方法，根據本發明的一實施例的基板的切割（dicing）方法，其可以包括：基板的上表面形成第一溝槽（trench）的步驟；在與所述第一溝槽相鄰的所述基板的上表面上形成活性層（active layer）的步驟；在所述第一溝槽的上部形成第二溝槽的步驟；在所述活性層的上部形成導電佈線層的步驟；以及沿著包括所述第一溝槽和所述第二溝槽的溝槽線進行蝕刻，以生成多個半導體晶片（chip）的步驟。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S100:流程圖</p>
        <p type="p">S110、S120、S130、S140、S150:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="647px" img-content="tif" inline="yes" orientation="portrait" width="596px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623620</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146752</doc-number>
          <kind></kind>
          <date>114/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P95/90</main-classification>
        <further-classification edition="202101120260302B">G01K1/14</further-classification>
        <further-classification edition="202601120260302B">H10P72/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商ＨＰＳＰ股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HPSP CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卞基碩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYEON, KI SEOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邱珍元</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2024-0174966</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2025-0169053</doc-number>
          <date>20251111</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置</chinese-title>
        <english-title>SUBSTRATE PROCESSING APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明公開一種基板處理裝置。該基板處理裝置，可以包括腔室及溫度感測模組。該腔室，可以具備：殼體，形成為收容基板；以及門，形成為打開及關閉該殼體。該溫度感測模組，設置於該腔室，可以包括溫度傳感器、基座單元及保持單元。該溫度傳感器可以形成為以測量該腔室內之溫度。該基座單元，具備形成有變位孔之基座塊，該變位孔收容該溫度傳感器，使該溫度傳感器沿與該溫度傳感器之延伸方向交叉之交叉方向自第一地點變位至第二地點。該保持單元形成為用以保持該溫度傳感器，並在該溫度傳感器位於該第一地點與該第二地點之一之狀態下，可結合於該基座單元。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a substrate processing apparatus. The substrate processing apparatus may include a chamber and a temperature sensing module. The chamber may include: a housing is configured to house a substrate; and a door is configured to open and close the housing. The temperature sensing module is disposed at the chamber, may include a temperature sensor, a base unit, and a holding unit. The temperature sensor may be configured to measure the temperature within the chamber. The base unit includes a base block with a displacement hole that houses the temperature sensor, allowing the temperature sensor to be displaced from a first location to a second location along a cross direction intersecting the extension direction of the temperature sensor. The holding unit is configured to hold the temperature sensor and, when the temperature sensor is located at one of the first and second locations, can be coupled to the base unit.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:溫度感測模組</p>
        <p type="p">210:溫度傳感器</p>
        <p type="p">230:基座單元</p>
        <p type="p">231:基座塊</p>
        <p type="p">233:位移孔</p>
        <p type="p">250:保持單元</p>
        <p type="p">251:第一保持塊</p>
        <p type="p">255:第二保持塊</p>
        <p type="p">H:水平方向</p>
        <p type="p">V:垂直方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="811px" img-content="tif" inline="yes" orientation="portrait" width="654px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623170</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146783</doc-number>
          <kind></kind>
          <date>114/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260204B">H02M3/156</main-classification>
        <further-classification edition="200601120260204B">H02M1/08</further-classification>
        <further-classification edition="200601120260204B">G05F1/565</further-classification>
        <further-classification edition="200601120260204B">G06F1/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商茂力科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MONOLITHIC POWER SYSTEMS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉順</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, SHUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許劍波</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, JIANBO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王嘉楠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, JIANAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117355067</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>多相電壓調節器及其控制器和控制方法</chinese-title>
        <english-title>MULTI-PHASE VOLTAGE REGULATOR, AND ITS CONTROLLER AND CONTROL METHOD</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本申請揭露了一種多相電壓調節器及其控制器和控制方法。控制器包括接收電壓控制命令的通訊接腳、用於取樣多相電壓調節器中每相切換式電路電流的多個相電流取樣接腳、提供多個開關控制訊號以控制多相切換式電路多個開關控制接腳。控制器根據多相電壓調節器的輸出電流決定多相電壓調節器穩態工作時進入功率運行的切換式電路的相數。當電壓控制命令控制多相電壓調節器的輸出電壓變化時，控制器根據流過該多相切換式電路的其中一相切換式電路的電流決定是否增加進入功率運行的切換式電路的相數。可以快速回應改變輸出電壓的命令，同時具有較小的功率損耗，具有較高的效率。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A multi-phase voltage regulator, and its controller and control method are disclosed. The controller has a communication pin for receiving a voltage control command, a plurality of phase current sensing pins each for sensing a current of a corresponding one of a plurality of switching circuits of the multi-phase voltage regulator, and a plurality of switching control pins for providing a plurality of switching control signals to control the plurality of switching circuits. The controller determines, based on an output current of the multi-phase voltage regulator, the number of the switching circuits in power operation when the multi-phase voltage regulator operates in a steady state. When the voltage control command controls an output voltage of the multi-phase voltage regulator to change, the controller determines whether to increase the number of the switching circuits in the power operation based on a current flowing through a first switching circuit. The multi-phase voltage regulator of the present disclosure quickly responds to the command for changing the output voltage, and also has small power loss and high efficiency.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1200:控制器</p>
        <p type="p">1201:電流取樣單元</p>
        <p type="p">1202:穩態相數控制單元</p>
        <p type="p">1203:加相控制單元</p>
        <p type="p">1204:參考電壓產生單元</p>
        <p type="p">1205:開關控制訊號產生單元</p>
        <p type="p">1206:比較電路或誤差放大電路</p>
        <p type="p">CS1,CS2,CS3,CS4:相電流取樣訊號</p>
        <p type="p">DOWN_ADD:加相控制訊號</p>
        <p type="p">Imon:總電流取樣訊號</p>
        <p type="p">Level_down:加相閾值</p>
        <p type="p">Level_up:加相閾值</p>
        <p type="p">NUM:進入功率運行的相數</p>
        <p type="p">PWM1,PWM2,PWM3,PWM4:開關控制訊號</p>
        <p type="p">UP_ADD:加相控制訊號</p>
        <p type="p">Ve:迴路訊號</p>
        <p type="p">VOCMD:電壓控制命令</p>
        <p type="p">VOSEN:電壓取樣訊號</p>
        <p type="p">VREF:參考電壓</p>
        <p type="p">Vth1,Vth2,Vth3,Vth4:切相閾值</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="786px" img-content="tif" inline="yes" orientation="portrait" width="711px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622319</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114146790</doc-number>
          <kind></kind>
          <date>114/11/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260213B">D06F58/20</main-classification>
        <further-classification edition="202001120260213B">D06F58/30</further-classification>
        <further-classification edition="200601120260213B">D06F58/26</further-classification>
        <further-classification edition="200601120260213B">D06F58/02</further-classification>
        <further-classification edition="202001320260213B">D06F105/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商南京石頭創新科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NANJING ROBOROCK INNOVATION TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孫學遜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUN, XUEXUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李宗德</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2024117462726</doc-number>
          <date>20241129</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>中國大陸</country>
          <doc-number>2024229533380</doc-number>
          <date>20241129</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>烘乾模組和衣物處理設備</chinese-title>
        <english-title>DRYING MODULE AND CLOTHING TREATMENT APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本創作提供了一種烘乾模組和衣物處理設備。烘乾模組包括吸濕排濕系統和熱泵系統，吸濕排濕系統包括吸濕排濕件和吸濕排濕殼體，吸濕排濕殼體的其中一軸向端面上設有第一開口，吸濕排濕殼體的另一軸向端面上設有第二開口，且第一開口和第二開口沿吸濕排濕件的軸向經由吸濕排濕件連通，第一開口和第二開口沿軸向經由吸濕排濕件連通，熱泵系統的第一熱交換器沿風向設於第一開口的上游。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure provides a drying module and a clothing treatment apparatus. The drying module includes a moisture-absorption/desorption system and a heat-pump system. The moisture-absorption/desorption system includes a moisture-absorption/desorption element and a moisture-absorption/desorption housing. A first opening is formed in one axial end face of the moisture-absorption/desorption housing, and a second opening is formed in the opposite axial end face thereof, the first and second openings being in communication through the moisture-absorption/desorption element along the axial direction thereof. A first heat exchanger of the heat-pump system is located, in the airflow direction, upstream of the first opening.</p>
      </isu-abst>
      <representative-img>
        <p type="p">12:底座</p>
        <p type="p">31:壓縮機</p>
        <p type="p">32:第一熱交換器</p>
        <p type="p">33:第三熱交換器</p>
        <p type="p">34:第二熱交換器</p>
        <p type="p">35:製冷劑管件</p>
        <p type="p">36:節流裝置</p>
        <p type="p">110:主烘乾風道</p>
        <p type="p">112:容置腔</p>
        <p type="p">120:底板</p>
        <p type="p">123:集水盒</p>
        <p type="p">4:吸濕排濕系統</p>
        <p type="p">442:再生風機</p>
        <p type="p">1111:第一風道部</p>
        <p type="p">1250:前置風道</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10021.JPG" file="ed10021.JPG" height="645px" img-content="tif" inline="yes" orientation="portrait" width="745px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621816</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114150339</doc-number>
          <kind></kind>
          <date>113/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120251231B">B21D53/00</main-classification>
        <further-classification edition="200601120251231B">B26D9/00</further-classification>
        <further-classification edition="200601120251231B">E04H12/30</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>嘉義縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林信志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>臥式水塔加工程序及其水塔結構</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種臥式水塔加工程序及水塔結構，包括提供一板片結構，板片結構定義或具有兩邊緣接合區；一製孔作業，應用製孔裝置在本體上成型出人孔區域。以及，一裁切作業，裁切分離兩邊緣接合區，而構成一具有開放區的環狀本體的水塔結構，以利於每一個環狀本體可相互疊置、運輸，達到建立一個比較理想的作業機制和結構效果；改善習知(筒狀)水塔的裝載佔據大量空間，不利於運輸及減少業者或中/下游廠商必須建立相當大的製造及/或加工場地和配置多種大型機具設備之生產線等情形。</p>
      </isu-abst>
      <isu-abst lang="en">
      </isu-abst>
      <representative-img>
        <p type="p">10:板片結構</p>
        <p type="p">11:邊緣接合區</p>
        <p type="p">12:補強結構</p>
        <p type="p">13:端部</p>
        <p type="p">14:人孔區域</p>
        <p type="p">15:開放區</p>
        <p type="p">20:本體</p>
        <p type="p">X:軸向參考線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="943px" img-content="tif" inline="yes" orientation="portrait" width="709px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623703</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114151931</doc-number>
          <kind></kind>
          <date>108/07/03</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W80/00</main-classification>
        <further-classification edition="202601120260302B">H10W74/10</further-classification>
        <further-classification edition="202601120260302B">H10W74/43</further-classification>
        <further-classification edition="202601120260302B">H10W20/20</further-classification>
        <further-classification edition="202601120260302B">H10W76/60</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾德亞半導體接合科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高　桂蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GAO, GUILIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>烏佐　賽普里恩　艾米卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UZOH, CYPRIAN EMEKA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>提爾　傑瑞米　阿弗烈德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THEIL, JEREMY ALFRED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈巴　貝高森</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HABA, BELGACEM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡特卡　拉杰詡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KATKAR, RAJESH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/694,845</doc-number>
          <date>20180706</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>16/460,068</doc-number>
          <date>20190702</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>模製直接接合且互連的堆疊</chinese-title>
        <english-title>MOLDED DIRECT BONDED AND INTERCONNECTED STACK</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於晶粒及/或晶圓，該些晶粒及/或晶圓以包括堆疊之各種配置而經堆疊且接合，且可覆蓋有模製物以便於處置、封裝以及類似操作。在各個實例中，該模製物可或多或少覆蓋一堆疊，以促進與該堆疊之裝置之連接性、增強熱管理等等。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Dies and/or wafers are stacked and bonded in various arrangements including stacks, and may be covered with a molding to facilitate handling, packaging, and the like. In various examples, the molding may cover more or less of a stack, to facilitate connectivity with the devices of the stack, to enhance thermal management, and so forth.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:堆疊/微電子組件</p>
        <p type="p">102:晶粒</p>
        <p type="p">102':晶粒</p>
        <p type="p">104:基底基板</p>
        <p type="p">106:絕緣層/介電層</p>
        <p type="p">108:接合表面</p>
        <p type="p">110:傳導特徵</p>
        <p type="p">112:傳導跡線</p>
        <p type="p">114:傳導矽穿孔</p>
        <p type="p">116:電耦接墊/襯墊</p>
        <p type="p">e:誤差/未對準</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="820px" img-content="tif" inline="yes" orientation="portrait" width="605px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622575</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>114152268</doc-number>
          <kind></kind>
          <date>109/02/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G02B9/60</main-classification>
        <further-classification edition="200601120260226B">G02B13/00</further-classification>
        <further-classification edition="202301120260226B">H04N23/55</further-classification>
        <further-classification edition="202101120260226B">G02B7/02</further-classification>
        <further-classification edition="202101120260226B">G02B7/14</further-classification>
        <further-classification edition="202101120260226B">G03B17/12</further-classification>
        <further-classification edition="202101120260226B">G03B30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金學哲</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, HAG CHUL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃孝眞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HWANG, HYO JIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2019-0127269</doc-number>
          <date>20191014</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>透鏡攝像系統以及照相機模組</chinese-title>
        <english-title>LENS IMAGING SYSTEM AND CAMERA MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種照相機模組包括：第一透鏡，具有正的折射力；第二透鏡，具有折射力；第三透鏡，具有正的折射力，且在像側表面上具有凹的形狀；第四透鏡，具有負的折射力；以及第五透鏡，具有折射力。自第一透鏡的物側表面至攝像表面的距離TTL及自第五透鏡的像側表面至攝像表面的距離BFL滿足1.0 ＜ TTL/BFL ＜ 3.0。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A camera module includes a first lens having positive refractive power; a second lens having refractive power; a third lens having positive refractive power, and having a concave shape on an image side surface; a fourth lens having negative refractive power; and a fifth lens having refractive power. TTL, a distance from an object side surface of the first lens to an imaging surface and BFL, a distance from an image side surface of the fifth lens to the imaging surface satisfy 1.0 ＜ TTL/BFL ＜ 3.0.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:透鏡攝像系統</p>
        <p type="p">110:透鏡/第一透鏡</p>
        <p type="p">120:透鏡/第二透鏡</p>
        <p type="p">130:透鏡/第三透鏡</p>
        <p type="p">140:透鏡/第四透鏡</p>
        <p type="p">150:透鏡/第五透鏡</p>
        <p type="p">170:濾波器</p>
        <p type="p">180:影像感測器</p>
        <p type="p">ST:光闌</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="741px" img-content="tif" inline="yes" orientation="portrait" width="410px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623201</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100063</doc-number>
          <kind></kind>
          <date>113/11/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260223B">H03H7/38</main-classification>
        <further-classification edition="200601120260223B">H01P5/10</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>國立澎湖科技大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>澎湖縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊明霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>吳明典</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡淑敏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張政佑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱世仁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺中市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>適用於雙頻阻抗轉換電路</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種適用於雙頻阻抗轉換電路，尤指一種具有隨頻率變化的複數阻抗信號源及負載之雙頻阻抗轉換電路，雙頻阻抗轉換電路係由傳輸線和集總元件組成，使其可以工作在兩個任意、且不相關的頻率，其所需之元件數值可由設計之公式獲得，無須耗時之大量數值進行試誤計算，同時可有效縮短設計時程，且所獲得之阻抗轉換電路器具有尺寸精簡的優點，並可避免使用極細或極寬之傳輸線和並聯殘段，大幅提高其實用性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">ST&lt;sub&gt;1&lt;/sub&gt;:上段之傳輸線</p>
        <p type="p">ST&lt;sub&gt;2&lt;/sub&gt;:下段之傳輸線</p>
        <p type="p">TL&lt;sub&gt;S&lt;/sub&gt;:左段之傳輸線</p>
        <p type="p">TL&lt;sub&gt;L&lt;/sub&gt;:右段之傳輸線</p>
        <p type="p">Q&lt;sub&gt;B&lt;/sub&gt;:電感</p>
        <p type="p">Q&lt;sub&gt;L&lt;/sub&gt;:負載</p>
        <p type="p">Q&lt;sub&gt;S&lt;/sub&gt;:信號源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10053.JPG" file="ed10053.JPG" height="575px" img-content="tif" inline="yes" orientation="portrait" width="876px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623319</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115100161</doc-number>
          <kind></kind>
          <date>113/07/29</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H05K1/02</main-classification>
        <further-classification edition="200601120260302B">H05K1/03</further-classification>
        <further-classification edition="200601120260302B">H05K1/11</further-classification>
        <further-classification edition="202601120260302B">H05K1/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>財團法人工業技術研究院</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林依蓉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, YI-RONG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏小芬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEI, HSIAO-FEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王仲偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, CHUNG-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>姚力崴</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YAO, LI-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/535,564</doc-number>
          <date>20230830</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電子裝置</chinese-title>
        <english-title>ELECTRONIC DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">電子裝置包括基底、第一導線、第二導線以及第一介電圖案。基底具有曲面。第一導線設置於基底之上，其中第一導線具有第一厚度。第二導線設置於第一導線之上，其中第二導線具有第二厚度。第一介電圖案設置於第一導線與第二導線之間，其中第一介電圖案具有第三厚度，第三厚度與第一厚度的比值及第三厚度與第二厚度的比值分別在0.5至10之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electronic device includes a substrate, a first conductive line, a second conductive line and a first dielectric pattern. The substrate has a curved surface. The first conductive line is disposed over the substrate and has a first thickness. The second conductive line is disposed on the first conductive line and has a second thickness. The dielectric pattern is disposed between the first conductive line and the second conductive line and has a third thickness. A ratio of the third thickness to the first thickness and a ratio of the third thickness to the second thickness are respectively in a range of 0.5 to 10.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:電子裝置</p>
        <p type="p">100:表面結構</p>
        <p type="p">102:基底</p>
        <p type="p">104:第一導線</p>
        <p type="p">106:第一介電圖案</p>
        <p type="p">200:模塑體</p>
        <p type="p">202:平坦部</p>
        <p type="p">204:凸出部</p>
        <p type="p">A:點</p>
        <p type="p">N:垂直方向</p>
        <p type="p">R1:第一區域</p>
        <p type="p">R2:第二區域</p>
        <p type="p">Q-Q’:剖線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="382px" img-content="tif" inline="yes" orientation="portrait" width="705px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622383</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101115</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">F16B21/09</main-classification>
        <further-classification edition="200601120260302B">F16B5/06</further-classification>
        <further-classification edition="202601120260302B">H10W40/60</further-classification>
        <further-classification edition="200601120260302B">F16B19/02</further-classification>
        <further-classification edition="200601120260302B">F16B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍隆國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIVEGRAND INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>彈性扣體及其扣接方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種彈性扣體及其扣接方法，其包含扣接頭部，扣接頭部大於被扣物體之限制部，彈性扣體穿過或通過被扣物體而組接或設置於物體，用以使物體與被扣物體組合或彈性組合。藉此，可完成至少兩物體之快速結合與分離，而達到反復快速結合與分離之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:彈性扣體</p>
        <p type="p">11:扣接頭部</p>
        <p type="p">111:斜面</p>
        <p type="p">12:身部</p>
        <p type="p">13:彈性元件</p>
        <p type="p">14:對應部</p>
        <p type="p">15:擋抵部</p>
        <p type="p">10:被扣物體</p>
        <p type="p">101:限制部</p>
        <p type="p">20:物體</p>
        <p type="p">h:抬起距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="514px" img-content="tif" inline="yes" orientation="portrait" width="996px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622384</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101264</doc-number>
          <kind></kind>
          <date>113/11/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">F16B21/09</main-classification>
        <further-classification edition="200601120260302B">F16B5/06</further-classification>
        <further-classification edition="202601120260302B">H10W40/60</further-classification>
        <further-classification edition="200601120260302B">F16B19/02</further-classification>
        <further-classification edition="200601120260302B">F16B1/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>伍隆國際有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FIVEGRAND INTERNATIONAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新北市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王鼎瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, TING-JUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王立成</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>余宗學</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>彈性扣體及其扣接方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係提供一種彈性扣體及其扣接方法，其包含扣接頭部，扣接頭部大於被扣物體之限制部，彈性扣體穿過或通過被扣物體而組接或設置於物體，用以使物體與被扣物體組合或彈性組合。藉此，可完成至少兩物體之快速結合與分離，而達到反復快速結合與分離之功效。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:彈性扣體</p>
        <p type="p">11:扣接頭部</p>
        <p type="p">111:斜面</p>
        <p type="p">12:身部</p>
        <p type="p">13:彈性元件</p>
        <p type="p">14:對應部</p>
        <p type="p">15:擋抵部</p>
        <p type="p">10:被扣物體</p>
        <p type="p">101:限制部</p>
        <p type="p">20:物體</p>
        <p type="p">h:抬起距離</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="482px" img-content="tif" inline="yes" orientation="portrait" width="1009px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621635</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101307</doc-number>
          <kind></kind>
          <date>111/01/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61B1/018</main-classification>
        <further-classification edition="200601120260302B">A61B1/00</further-classification>
        <further-classification edition="201601120260302B">A61B34/30</further-classification>
        <further-classification edition="200601120260302B">A61B17/94</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>香港商港大科橋有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VERSITECH LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>郭　嘉威</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KWOK, KA-WAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　焯亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HE, ZHUO-LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　曉梅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, XIAO-MEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何　迪朗</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HO, JUSTIN DI-LANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>方　格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FANG, GE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>王　奎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WANG, KUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>HK</english-country>
              <english-address>HK</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>何美瑩</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63141613</doc-number>
          <date>20210126</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>內視鏡手術用之可操縱臂</chinese-title>
        <english-title>A STEERABLE ARM FOR USE IN ENDOSCOPIC SURGICAL PROCEDURES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">在此揭示能與內視鏡手術一同使用的可操縱臂。此可操縱臂是利用切割鎳鈦管，來提供所切割管之結構所需的伸縮性及彈性。典型情況是，經切割的管包含一螺旋管，其上的螺圈在一水平面上彼此接觸且彎曲管可在另一水平側上打開螺圈。管是由能記憶住其彎曲形狀的材料製成，如此也提供一種偏壓力，讓導致管伸縮的力量被移除後，管可回復其原有形狀。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A steerable arm for use in endoscopic surgical procedures. The steerable arm cut from a tube of Nitinol to provide flexibility and resilience by the structure into which the tube is cut. Typically, the cut tube comprises a spiralling coil, the loops of which are in contact on one lateral side of the tube and the tube is bent to open apart the loops on the other lateral side. The material which the tube is made of is capable of retaining memory of the bend. This provides a bias for restoring the tube to the bend whenever a force causing the tube to flex is removed.</p>
      </isu-abst>
      <representative-img>
        <p type="p">301:可操縱臂</p>
        <p type="p">401:蓋子</p>
        <p type="p">403:末端效應件</p>
        <p type="p">501:照相機</p>
        <p type="p">503:光源</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10032.JPG" file="ed10032.JPG" height="634px" img-content="tif" inline="yes" orientation="portrait" width="640px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623299</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101362</doc-number>
          <kind></kind>
          <date>110/01/13</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260228B">H04W76/19</main-classification>
        <further-classification edition="201701120260228B">H04B7/0408</further-classification>
        <further-classification edition="202301120260228B">H04W72/25</further-classification>
        <further-classification edition="200901120260228B">H04W92/18</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商高通公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>QUALCOMM INCORPORATED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳　仲皓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RYU, JUNG HO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>丁　甯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DING, LING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿卡拉卡蘭　索尼</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AKKARAKARAN, SONY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>維努戈帕爾　基蘭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VENUGOPAL, KIRAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白天楊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAI, TIANYANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李　君毅</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LI, JUNYI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>駱　濤</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LUO, TAO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彭國洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/969,544</doc-number>
          <date>20200203</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>17/248,162</doc-number>
          <date>20210112</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>側行鏈路波束失敗偵測</chinese-title>
        <english-title>SIDELINK BEAM FAILURE DETECTION</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本案內容的各個態樣通常涉及無線通訊。在一些態樣中，第一節點可在從第一節點到第二節點的經波束成形的鏈路上向第二節點發送第一信號，其中第一節點和第二節點與公共定時相關聯；決定是否在從第二節點到第一節點的經波束成形的鏈路上接收到至少部分地基於第一信號的第二信號；及至少部分地基於接收到第二信號來發送第三信號，或者至少部分地基於決定未接收到第二信號來執行側行鏈路波束失敗恢復程序。提供另一些態樣。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a first node may transmit, to a second node on a beamformed link from the first node to the second node, a first signal, wherein the first node and the second node are associated with common timing; determine whether a second signal, based at least in part on the first signal, is received on a beamformed link from the second node to the first node; and transmit a third signal based at least in part on receiving the second signal or perform a sidelink beam failure recovery procedure based at least in part on determining that the second signal is not received. Numerous other aspects are provided.</p>
      </isu-abst>
      <representative-img>
        <p type="p">120:UE</p>
        <p type="p">500:實例</p>
        <p type="p">505:發射(Tx)波束</p>
        <p type="p">510:接收(Rx)波束</p>
        <p type="p">515:Rx波束</p>
        <p type="p">520:Tx波束</p>
        <p type="p">525:側行鏈路</p>
        <p type="p">530:側行鏈路</p>
        <p type="p">535:步驟</p>
        <p type="p">540:步驟</p>
        <p type="p">545:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="717px" img-content="tif" inline="yes" orientation="portrait" width="954px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622576</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101376</doc-number>
          <kind></kind>
          <date>109/08/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G02B9/60</main-classification>
        <further-classification edition="200601120260226B">G02B13/00</further-classification>
        <further-classification edition="200601120260226B">G02B13/02</further-classification>
        <further-classification edition="200601120260226B">G02B13/18</further-classification>
        <further-classification edition="200601120260226B">G02B27/00</further-classification>
        <further-classification edition="200601120260226B">G02B5/20</further-classification>
        <further-classification edition="202101120260226B">G02B7/02</further-classification>
        <further-classification edition="202301120260226B">H04N23/55</further-classification>
        <further-classification edition="202301120260226B">H04N23/45</further-classification>
        <further-classification edition="202301120260226B">H04N23/57</further-classification>
        <further-classification edition="202101120260226B">G03B30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卞俊熙</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BYUN, JOON HEE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳浩植</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YOO, HO SIK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2019-0107775</doc-number>
          <date>20190830</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統，包括：具有正的折射力、凸的物側表面以及凸的像側表面的第一透鏡；具有負的折射力的第二透鏡；具有正的折射力的第三透鏡；具有折射力的第四透鏡；以及具有折射力的第五透鏡，其中，所述第一透鏡至所述第五透鏡從物側到像側依次排列，其中所述光學成像系統共有五個透鏡，以及其中滿足以下條件表達式：0.87 ＜ TTL/f ＜ 1.31；以及-0.7 毫米 ＜ f1+f2 ＜ 1.3 毫米，其中TTL為光軸上所述第一透鏡的所述物側表面到成像表面的距離，f為所述光學成像系統的總焦距，f1為所述第一透鏡的焦距，f2為第二透鏡的焦距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system, includes: a first lens having positive refractive power, a convex object-side surface and a convex image-side surface; a second lens having negative refractive power; &lt;br/&gt;a third lens having positive refractive power; a fourth lens having refractive power; and a fifth lens having refractive power, wherein the first to fifth lenses are arranged in order from an object side towards an image side, wherein the optical imaging system has a total of five lenses, and wherein the following conditional expressions are satisfied: 0.87 ＜ TTL/f ＜ 1.31; and -0.7 mm ＜ f1+f2 ＜ 1.3 mm, where TTL is a distance on the optical axis from the object-side surface of the first lens to an imaging surface, f is a total focal length of the optical imaging system, f1 is a focal length of the first lens, and f2 is a focal length of the second lens.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:光學成像系統</p>
        <p type="p">110:第一透鏡</p>
        <p type="p">120:第二透鏡</p>
        <p type="p">130:第三透鏡</p>
        <p type="p">140:第四透鏡</p>
        <p type="p">150:第五透鏡</p>
        <p type="p">160:濾光片</p>
        <p type="p">170:影像感測器</p>
        <p type="p">R1:第一反射構件</p>
        <p type="p">R2:第二反射構件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="582px" img-content="tif" inline="yes" orientation="portrait" width="620px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623645</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101397</doc-number>
          <kind></kind>
          <date>113/04/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10W40/40</main-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商惠普發展公司有限責任合夥企業</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　清華</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN HUA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>庫米比　麥可　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CUMBIE, MICHAEL W</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/US23/22589</doc-number>
          <date>20230517</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>冷卻裝置及用於系統單晶片的液體冷卻系統</chinese-title>
        <english-title>COOLING DEVICE AND LIQUID COOLING SYSTEM FOR A SYSTEM-ON-CHIP</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種用於系統單晶片的冷卻裝置包括複數個冷卻單元，該等複數個冷卻單元經由該等複數個冷卻單元之第一側耦接至系統單晶片且與該等其他冷卻單元間隔開。該冷卻裝置進一步包括耦接至該等複數個冷卻單元之第二側的橋接件，該橋接件及該等複數個冷卻單元配置來使該等複數個冷卻單元之個別冷卻單元能夠獨立移動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A cooling device for a system-on-chip includes a plurality of cooling units to be coupled to a system-on-chip via a first side of the plurality of cooling units and spaced apart from the other cooling units. The cooling device further includes a bridge coupled to a second side of the plurality of cooling units, the bridge and the plurality of cooling units arranged to enable independent movement of individual cooling units of the plurality of cooling units.</p>
      </isu-abst>
      <representative-img>
        <p type="p">102:SOC</p>
        <p type="p">108:處理組件</p>
        <p type="p">110:基體</p>
        <p type="p">200:SOC總成</p>
        <p type="p">202:冷卻裝置</p>
        <p type="p">204:冷卻單元</p>
        <p type="p">206:TIM，剛性TIM</p>
        <p type="p">208:橋接件</p>
        <p type="p">210:可撓性密封件</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="550px" img-content="tif" inline="yes" orientation="portrait" width="909px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622413</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101440</doc-number>
          <kind></kind>
          <date>113/09/27</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201801120260302B">F16L53/38</main-classification>
        <further-classification edition="200601120260302B">H05B3/46</further-classification>
        <further-classification edition="200601120260302B">H05B3/54</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商漢唐熱材公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BRISKHEAT CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福爾頓　泰勒　Ｈ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FULTON, TAYLOR H.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡斯堤勒　瑪貝爾　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CASTELLAR, MABEL C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅賽爾　納桑</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEISEL, NATHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳俊良</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/586,845</doc-number>
          <date>20230929</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>18/890,596</doc-number>
          <date>20240919</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於加熱管之電加熱元件系統</chinese-title>
        <english-title>ELECTRIC HEATING ELEMENT SYSTEM FOR HEATING PIPE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種用於加熱一管之電加熱元件系統，其具有經構形用於連接至一電源的一電阻加熱元件及包括一長度之一近似矩形之基板。該基板包含：一第一列狹槽，其等橫向於該長度；一第二列狹槽，其等橫向於該長度且與該第一列狹槽側向對準；一第三列狹槽，其等橫向於該長度且相對於第一列及第二列中之該等狹槽沿該長度交替定位；以及一第一列緊固件端及一第二列緊固件端，其等分別由該第一列狹槽及該第二列狹槽界定。該第一列緊固件端及該第二列緊固件端之各者經構形以將該基板固定至該管。該基板之長度可調整，以用於安裝在該管上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An electric heating element system for heating a pipe is disclosed, having an electrically resistive heating element configured for connection to an electric power source and an approximately rectangular-shaped substrate comprising a length. The substrate includes a first row of slots transverse to the length, a second row of slots transverse to the length and laterally aligned with the first row of slots, a third row of slots transverse to the length and alternatingly positioned along the length relative to the slots in the first and second rows, and a first row of fastener ends and a second row of fastener ends defined by the first row of slots and the second row of slots, respectively. Each of the first and second rows of fastener ends are configured to secure the substrate to the pipe. The substrate’s length is adjustable for installation on the pipe.</p>
      </isu-abst>
      <representative-img>
        <p type="p">5:終端</p>
        <p type="p">10:加熱元件</p>
        <p type="p">20:基板</p>
        <p type="p">50a:緊固件端</p>
        <p type="p">50b:緊固件端</p>
        <p type="p">52a:端突片</p>
        <p type="p">52b:端突片</p>
        <p type="p">62:導體端</p>
        <p type="p">64:導體端</p>
        <p type="p">100:電加熱元件系統</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10040.JPG" file="ed10040.JPG" height="759px" img-content="tif" inline="yes" orientation="portrait" width="1017px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622625</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115101483</doc-number>
          <kind></kind>
          <date>110/04/30</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201201120260225B">G03F1/26</main-classification>
        <further-classification edition="201201120260225B">G03F1/32</further-classification>
        <further-classification edition="201201120260225B">G03F1/70</further-classification>
        <further-classification edition="202001120260225B">G06F30/398</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商福昌公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PHOTRONICS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷瑪丹　默漢麥德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>RAMADAN, MOHAMED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREEN, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>咸永</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAM, YOUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>普拉葛　克里斯托弗　Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROGLER, CHRISTOPHER J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/018,471</doc-number>
          <date>20200430</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>製造光罩的系統及方法</chinese-title>
        <english-title>SYSTEM AND METHOD FOR MANUFACTURING A PHOTOMASK</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供用於自與展現晶圓上之缺陷之一光罩相關之經獲得圖案資訊構建一光罩之方法及系統。對該圖案資訊進行空間域分析，使得可產生校正性光罩結構，且將該等校正性光罩結構應用至一光罩佈局。使用該等校正性光罩結構來構建一光罩。驗證該光罩之有效性。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for building a photomask from obtained pattern information relating to a photomask that exhibits defects on wafer. Spatial domain analysis is conducted on the pattern information so that corrective photomask structures can be generated and applied to a photomask layout. A photomask is built using the corrective photomask structures. The photomask is verified for effectiveness.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="647px" img-content="tif" inline="yes" orientation="portrait" width="1082px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623608</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102223</doc-number>
          <kind></kind>
          <date>107/03/02</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="200601120260302B">G01R31/28</further-classification>
        <further-classification edition="200601120260302B">G05F1/577</further-classification>
        <further-classification edition="200601120260302B">G05F1/575</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商艾爾測試系統</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AEHR TEST SYSTEMS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>喬凡維克　喬凡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JOVANOVIC, JOVAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德博伊　肯尼士　Ｗ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEBOE, KENNETH W.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯塔普斯　史蒂文　Ｃ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEPS, STEVEN C.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>琳賽　史考特　Ｅ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LINDSEY, SCOTT E.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/466,462</doc-number>
          <date>20170303</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>62/526,089</doc-number>
          <date>20170628</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>測試器設備以及測試多個電子裝置的方法</chinese-title>
        <english-title>TESTER APPARATUS AND METHOD OF TESTING A PLURALITY OF ELECTRONIC DEVICES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明闡述一種測試器設備。具體而言，公開一種匣盒以及測試多個電子裝置的方法。各種組件有助於達成所述測試器設備的功能，包括插入與拆卸設備、熱柱、獨立萬向運動、光電偵測器的包含、多種熱控制方法的組合、插座蓋中的偵測電路系統、具有支座的貫穿柱、及電壓目標重新確定。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A tester apparatus is described. Specifically, a cartridge and a method of testing a plurality of electronic devices are disclosed. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:測試器設備</p>
        <p type="p">12:測試器</p>
        <p type="p">14:框架</p>
        <p type="p">16:電力匯流排</p>
        <p type="p">18A:第一插槽總成/插槽總成</p>
        <p type="p">18B:第二插槽總成/插槽總成</p>
        <p type="p">20:測試器纜線</p>
        <p type="p">22:電力纜線</p>
        <p type="p">24A:冷液體供應管路/管路</p>
        <p type="p">24B:冷液體返回管路/管路</p>
        <p type="p">24C:控制液體供應管路/管路</p>
        <p type="p">24D:控制液體返回管路/管路</p>
        <p type="p">24E:真空管路/管路</p>
        <p type="p">28A:第一匣盒/匣盒</p>
        <p type="p">28B:第二匣盒/匣盒</p>
        <p type="p">30A:第一晶圓/晶圓</p>
        <p type="p">30B:第二晶圓/晶圓</p>
        <p type="p">32:插槽總成本體</p>
        <p type="p">34、222:熱卡盤</p>
        <p type="p">36:溫度偵測器</p>
        <p type="p">38:加熱電阻器</p>
        <p type="p">40:第一插槽總成介面/插槽總成介面</p>
        <p type="p">44:控制介面</p>
        <p type="p">46:電力介面</p>
        <p type="p">48A:冷液體供應介面/介面</p>
        <p type="p">48B:冷液體返回介面/介面</p>
        <p type="p">48C:控制液體供應介面/介面</p>
        <p type="p">48D:控制液體返回介面</p>
        <p type="p">48E:真空介面/介面</p>
        <p type="p">50:熱控制器</p>
        <p type="p">52:溫度回饋線路</p>
        <p type="p">54:電力線路</p>
        <p type="p">60:母板</p>
        <p type="p">62:通道模組板</p>
        <p type="p">64:撓性連接器</p>
        <p type="p">66:連接板</p>
        <p type="p">72:薄卡盤</p>
        <p type="p">74:背襯板</p>
        <p type="p">76:匣盒觸點</p>
        <p type="p">77:密封件</p>
        <p type="p">78:匣盒介面</p>
        <p type="p">82:門</p>
        <p type="p">84:鉸鏈</p>
        <p type="p">86:門開孔</p>
        <p type="p">88:密封件</p>
        <p type="p">90:真空管路</p>
        <p type="p">100、102:前密封件</p>
        <p type="p">104:連續密封式前壁</p>
        <p type="p">106:內部壁</p>
        <p type="p">108、110:分隔密封件</p>
        <p type="p">112:連續密封式分隔壁</p>
        <p type="p">224:熱流體通路</p>
        <p type="p">226:控制液體供應管路</p>
        <p type="p">228:控制液體返回管路</p>
        <p type="p">240:冷卻系統</p>
        <p type="p">242:溫度控制系統</p>
        <p type="p">244:真空幫浦</p>
        <p type="p">246:冷板</p>
        <p type="p">248:流體通路</p>
        <p type="p">2-2:線段</p>
        <p type="p">3-3:線段</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10023.JPG" file="ed10023.JPG" height="683px" img-content="tif" inline="yes" orientation="portrait" width="897px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622350</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115102961</doc-number>
          <kind></kind>
          <date>113/11/12</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">E05B47/00</main-classification>
        <further-classification edition="200601120260226B">E05B65/00</further-classification>
        <further-classification edition="200601120260226B">E05B65/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東海理研股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKAI RIKEN CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>佐藤明広</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SATO, AKIHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>梅村正美</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>UMEMURA, MASAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瀬木信彦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEGI, NOBUHIKO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂上晃一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAGAMI, KOICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪茂</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2023-221742</doc-number>
          <date>20231227</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>上鎖裝置及收容裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明的上鎖裝置包括：槓桿鎖片25，在上鎖狀態下進行第一切換動作的限制（第一限制）；第一螺線管22，驅動第一限制機構，以實施或解除第一限制；鉤件26，可在將門12保持於閉狀態的閉位置與解除此保持的開位置之間進行動作；鎖桿27，在上鎖狀態下對鉤件26從閉位置朝開位置的動作進行限制（第二限制）；第二螺線管23，驅動鎖桿27，以實施或解除第二限制；以及切換桿24，可強制性地進行第一切換動作以及第二限制機構的驅動。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:置物櫃裝置(收容裝置的一例)</p>
        <p type="p">2:置物櫃結構體</p>
        <p type="p">10:收容部</p>
        <p type="p">11:框</p>
        <p type="p">12:門</p>
        <p type="p">20:上鎖裝置</p>
        <p type="p">30:操作部</p>
        <p type="p">32:顯示部</p>
        <p type="p">38:印表機</p>
        <p type="p">40:IC卡讀卡器</p>
        <p type="p">122:把手</p>
        <p type="p">A:部分</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.JPG" file="ed10001.JPG" height="830px" img-content="tif" inline="yes" orientation="portrait" width="720px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622218</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103288</doc-number>
          <kind></kind>
          <date>112/07/10</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C09K19/30</main-classification>
        <further-classification edition="200601120260302B">C09K19/34</further-classification>
        <further-classification edition="200601120260302B">C09K19/12</further-classification>
        <further-classification edition="200601120260302B">C09K19/04</further-classification>
        <further-classification edition="200601120260302B">C09K19/44</further-classification>
        <further-classification edition="200601120260302B">G02F1/13</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商馬克專利公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MERCK PATENT GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>勞特　史分　克里斯丁</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAUT, SVEN CHRISTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李熙規</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, HEE-KYU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊明輝</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, MINGHUI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>賀奇曼　哈拉德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIRSCHMANN, HARALD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>迪因　卡佳　克麗斯提娜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEING, KAJA CHRISTINA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許文亭</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2022/104920</doc-number>
          <date>20220711</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>液晶介質</chinese-title>
        <english-title>LIQUID-CRYSTAL MEDIUM</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於如技術方案1中所定義之液晶(LC)介質，其用於光學、電光學及電子目的，尤其在LC顯示器中之用途，及含有該等LC介質之LC顯示器。本發明尤其係關於具有改良回應時間之LC介質，其能夠使顯示器節能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to liquid-crystal (LC) media as defined in claim 1, to the use thereof for optical, electro-optical and electronic purposes, in particular in LC displays, and to LC displays containing said LC media. The invention in particular relates to LC media with improved response time that enable energy saving displays.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622554</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103325</doc-number>
          <kind></kind>
          <date>110/12/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B5/30</main-classification>
        <further-classification edition="200601120260302B">G02F1/1335</further-classification>
        <further-classification edition="201901120260302B">B32B7/02</further-classification>
        <further-classification edition="200601120260302B">B32B27/00</further-classification>
        <further-classification edition="200601120260302B">B32B38/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日東電工股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NITTO DENKO CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朝永政俊</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMONAGA, MASATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>後藤周作</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOTO, SHUSAKU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2021-001056</doc-number>
          <date>20210106</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>積層體及附有相位差層之偏光板之製造方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種翹曲得到抑制之附有相位差層之偏光板。  &lt;br/&gt;本發明之實施方式之積層體依次具有：第一保護膜、包含偏光元件與配置於上述偏光元件之至少單側之保護層之偏光板、相位差層以及第二保護膜，上述偏光板之厚度與上述相位差層之厚度之合計為70 μm以下，上述偏光元件之厚度方向之中心位於自上述積層體之厚度方向中心起上述積層體之一半厚度之10%以下之範圍內。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:偏光板</p>
        <p type="p">11:偏光元件</p>
        <p type="p">11a:偏光元件之中心</p>
        <p type="p">12:保護層</p>
        <p type="p">21:第一相位差層(H層)</p>
        <p type="p">22:第二相位差層(Q層)</p>
        <p type="p">31:第一保護膜</p>
        <p type="p">32:第二保護膜</p>
        <p type="p">50:表面保護膜</p>
        <p type="p">52:黏著劑層</p>
        <p type="p">54:接著劑層</p>
        <p type="p">56:接著劑層</p>
        <p type="p">58:黏著劑層</p>
        <p type="p">100:積層體</p>
        <p type="p">100a:積層體之中心</p>
        <p type="p">d:偏光元件之中心與積層體之中心之距離</p>
        <p type="p">T:積層體之厚度</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="729px" img-content="tif" inline="yes" orientation="portrait" width="600px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621686</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103565</doc-number>
          <kind></kind>
          <date>111/04/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/496</main-classification>
        <further-classification edition="200601120260302B">A61K31/4439</further-classification>
        <further-classification edition="200601120260302B">A61K31/4545</further-classification>
        <further-classification edition="200601120260302B">A61K31/541</further-classification>
        <further-classification edition="200601120260302B">A61K31/4985</further-classification>
        <further-classification edition="200601120260302B">A61K31/5386</further-classification>
        <further-classification edition="200601120260302B">A61K31/5377</further-classification>
        <further-classification edition="200601120260302B">A61K9/00</further-classification>
        <further-classification edition="200601120260302B">A61P35/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德商百靈佳殷格翰國際股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOEHRINGER INGELHEIM INTERNATIONAL GMBH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡洛他　賽巴斯汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAROTTA, SEBASTIAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>達曼　喬治</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DAHMANN, GEORG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格波特　西德克斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GODBOUT, CEDRICKX</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CA</english-country>
              <english-address>CA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>漢斯屈　珊卓　盧思</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HANDSCHUH, SANDRA RUTH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>納爾　赫伯特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAR, HERBERT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐斯特　索斯坦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OOST, THORSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>雷瑟爾　奧理奇</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>REISER, ULRICH</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>DE</english-country>
              <english-address>DE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>崔伍　瑪夏斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TREU, MATTHIAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>AT</english-country>
              <english-address>AT</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張雅雯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>歐洲專利局</country>
          <doc-number>21171155.1</doc-number>
          <date>20210429</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>可活化ＳＴＩＮＧ之雜環化合物</chinese-title>
        <english-title>HETEROCYCLIC COMPOUNDS CAPABLE OF ACTIVATING STING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係關於能夠活化干擾素基因刺激因子(Stimulator of Interferon Gene；STING)之式(I)雜環化合物。  &lt;br/&gt;&lt;img align="absmiddle" height="270px" width="216px" file="ed10197.JPG" alt="ed10197.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention relates to heterocyclic compounds of formula (I) capable of activating STING (Stimulator of Interferon Genes). &lt;br/&gt;&lt;img align="absmiddle" height="275px" width="208px" file="ed10198.JPG" alt="ed10198.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623077</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103740</doc-number>
          <kind></kind>
          <date>113/02/06</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260213B">H01M10/00</main-classification>
        <further-classification edition="201001120260213B">H01M10/052</further-classification>
        <further-classification edition="201001120260213B">H01M10/0525</further-classification>
        <further-classification edition="201001120260213B">H01M10/0567</further-classification>
        <further-classification edition="200601120260213B">H01M10/42</further-classification>
        <further-classification edition="200601120260213B">H01M4/62</further-classification>
        <further-classification edition="202101120260213B">H01M50/434</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>輝能科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PROLOGIUM TECHNOLOGY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>桃園市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊思枬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANG, SZU-NAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范翔智</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/485,032</doc-number>
          <date>20230215</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>可自我毒化的鋰二次電池</chinese-title>
        <english-title>LITHIUM SECONDARY BATTERIES CAPABLE OF SELF-POISONING</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提出一種可自我毒化的鋰二電池，其包含有一正極活性材料；一負極活性材料；一位於正極活性材料與負極活性材料間的電解質，以供鋰離子在正極活性材料與負極活性材料間移動；以及一設置在鋰二次電池內的毒化劑，其包含有一反應起始觸媒與一摻染劑，摻染劑具有磷氧鍵、硼氧鍵或硫氧鍵顯露在自由端，或者具有磷氧鍵、硼氧鍵或硫氧鍵非顯露在自由端，且被有機或無機基團屏蔽，在該鋰二次電池升溫至一第一預設溫度時，摻染劑將與反應起始觸媒反應並釋出至少一具有自由基或不飽和鍵的磷氧鍵、硼氧鍵或硫氧鍵，以汙染該鋰二次電池的正極活性材料，使鋰二次電池無害化。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The invention provides a lithium secondary battery capable of self-poisoning, which includes a positive active material, a negative active material, an electrolyte located between the positive active material and the negative active material to allow lithium ions move therebetween, and a poisonous agent, including an initiating-reaction catalyst and a dopant. The dopant has a phosphorus-oxygen bond, a boron-oxygen bond or a sulfur-oxygen bond exposed at the free end, or a phosphorus-oxygen bond, a boron-oxygen bond or a sulfur-oxygen bond that is not exposed at the free end and is shielded by an organic or inorganic group. When the temperature of the lithium secondary battery reaches a first temperature, the dopant will react with the initiating-reaction catalyst to release at least one phosphorus-oxygen bond, boron-oxygen bond or sulfur-oxygen bond with free radicals or unsaturated bonds. Therefore, the positive active material of the lithium secondary battery will be contaminated to make the lithium secondary battery harmless.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="760px" img-content="tif" inline="yes" orientation="portrait" width="584px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623256</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103757</doc-number>
          <kind></kind>
          <date>107/05/31</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201401120260302B">H04N19/51</main-classification>
        <further-classification edition="201401120260302B">H04N19/103</further-classification>
        <further-classification edition="201401120260302B">H04N19/537</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商松下電器（美國）知識產權公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>安倍清史</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ABE, KIYOFUMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>西孝啓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHI, TAKAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>遠間正真</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOMA, TADAMASA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>加納龍一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KANOH, RYUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/515,208</doc-number>
          <date>20170605</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>編碼裝置、解碼裝置、編碼方法、解碼方法及發送方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種編碼裝置，其包含記憶體及電路，電路使用記憶體，在第1動作模式中，以將動態圖像所包含的圖像分割後的預測區塊為單位，導出第1移動向量，且以預測區塊為單位，進行參考圖像中的亮度之空間上的梯度來產生預測圖像的第1移動補償處理，其中前述圖像是藉由使用了導出的第1移動向量之移動補償所產生；在第2動作模式中，以將預測區塊分割後的子區塊為單位，導出第2移動向量，且以子區塊為單位，進行不參考圖像中的亮度之空間上的梯度而產生預測圖像的第2移動補償處理，其中前述圖像是藉由使用了第2移動向量的移動補償所產生。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">S111~S115:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10054.png" file="d10054.TIF" giffile="ed10054.png" height="533px" img-content="tif" inline="yes" orientation="portrait" width="778px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621724</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103770</doc-number>
          <kind></kind>
          <date>113/05/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K38/36</main-classification>
        <further-classification edition="201001120260302B">C12N15/113</further-classification>
        <further-classification edition="200601120260302B">A61P19/02</further-classification>
        <further-classification edition="200601120260302B">A61P19/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>高雄醫學大學</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAOHSIUNG MEDICAL UNIVERSITY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>高雄市</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭琮霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHENG, TSUNG-LIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳崇桓</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHUNG-HWAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張瑞根</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, JE-KEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林文杰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>預防或治療骨關節炎的凝血調節素與ｍｉＲＮＡ</chinese-title>
        <english-title>THROMBOMODULIN PROTEIN AND MIRNA FOR PREVENTING OR TREATING OSTEOATHRITIS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露一種軟骨細胞-凝血調節素(thrombomodulin，TM)或可溶性TM用於預防或治療骨關節炎(Osteoathritis，OA)，其是透過軟骨細胞-凝血調節素(thrombomodulin，TM)或可溶性TM增強細胞生長和遷移，同時阻斷介白素1&lt;i&gt;β&lt;/i&gt;(IL-1&lt;i&gt;β&lt;/i&gt;)介導的信號傳導，並在骨關節炎的治療中能防止骨頭完整性和膝關節功能的喪失，而miR-up-TM的給予也增加TM蛋白的表現並防止軟骨損傷，可以用於預防軟骨相關疾病。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present invention discloses a use for preventing or treating Osteoathritis (OA) by chondrocytes-thrombomodulin (TM) or soluble TM, using chondrocytes-TM soluble TM to enhance cell proliferation and migration with chondrocytes-thrombomodulin (TM) or soluble TM, while blocking interleukin 1β (IL-1β) mediated signaling and preventing the loss of bone integrity and the function of knee joint in osteoarthritis (OA) treatment. The administration of miR-up-TM also increases the expression of TM protein and prevents cartilage damage, which can be used to prevent cartilage-related diseases.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="920px" img-content="tif" inline="yes" orientation="portrait" width="740px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622286</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103902</doc-number>
          <kind></kind>
          <date>110/12/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/455</main-classification>
        <further-classification edition="200601120260302B">C23C16/52</further-classification>
        <further-classification edition="200601120260302B">C23C16/32</further-classification>
        <further-classification edition="202601120260302B">H10P14/24</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范　杜魯能　梅特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>VAN DRUENEN, MAART</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德茲拉　查理斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEZELAH, CHARLES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>德明斯基　彼德洛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>DEMINSKYI, PETRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>UA</english-country>
              <english-address>UA</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>亞雷西歐　維爾尼　吉賽佩</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ALESSIO VERNI, GIUSEPPE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IT</english-country>
              <english-address>IT</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張仁頡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHANG, REN-JIE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳立甫</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, LIFU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/125,194</doc-number>
          <date>20201214</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>在基板上形成電極之方法、在基板上沉積含稀土金屬碳化物層之方法及系統</chinese-title>
        <english-title>METHOD FOR FORMING ELECTRODE ON SUBSTRATE, METHOD FOR DEPOSITING RARE EARTH METAL CARBIDE CONTAINING LAYER ON SUBSTRATE AND SYSTEM FOR THE SAME</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明係揭示用於在一基板之一表面上沉積含稀土金屬碳化物層的方法和系統，以及使用該等方法所形成的結構和裝置。一例示性方法包括使用一循環沉積製程，諸如一原子層沉積製程，以將一含稀土金屬碳化物層沉積至該基板之一表面上。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and systems for depositing rare earth metal carbide containing layers on a surface of a substrate and structures and devices formed using the methods are disclosed. An exemplary method includes using a cyclical deposition process such as an atomic layer deposition process for depositing a rare earth metal carbide containing layer onto a surface of the substrate.</p>
      </isu-abst>
      <representative-img>
        <p type="p">111:開始</p>
        <p type="p">112:前驅物脈衝</p>
        <p type="p">113:沖洗</p>
        <p type="p">114:反應物脈衝</p>
        <p type="p">115:沖洗</p>
        <p type="p">116:重複</p>
        <p type="p">117:結束</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="869px" img-content="tif" inline="yes" orientation="portrait" width="602px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623609</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103963</doc-number>
          <kind></kind>
          <date>110/03/26</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P74/00</main-classification>
        <further-classification edition="200601120260302B">G01R23/16</further-classification>
        <further-classification edition="200601120260302B">G05B23/02</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商蘭姆研究公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LAM RESEARCH CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卡普爾　蘇尼爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAPOOR, SUNIL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>弗倫奇　大衛</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FRENCH, DAVID</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蘭森　蓋瑞</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEMSON, GARY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>孟亮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MENG, LIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許峻榮</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>16/832,961</doc-number>
          <date>20200327</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>辨識異常情況的方法</chinese-title>
        <english-title>METHOD FOR IDENTIFYING ANOMALOUS CONDITIONS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">用以估計射頻(RF)訊號之參數的設備可包含配置成提供RF訊號之電壓之示值的電壓感測器、以及配置成提供由RF訊號傳導之電流之示值的電流感測器。該設備可額外包含耦合至電壓感測器及電流感測器之輸出埠的類比至數位轉換器，其中該類比至數位轉換器係配置成提供RF訊號之瞬間電壓及瞬間電流的數位表示法。該設備可額外包含一或更多處理器，其配置成將瞬間電壓及電流的數位表示法轉換成複變電壓及複變電流的頻率域表示法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An apparatus to estimate parameters of a radio frequency (RF) signal may include a voltage sensor configured to provide an indication of a voltage of the RF signal as well as a current sensor configured to provide an indication of current conducted by the RF signal. The apparatus may additionally include an analog-to-digital converter coupled to an output port of the voltage sensor and the current sensor, wherein the analog-to-digital converter is configured to provide digital representations of an instantaneous voltage and an instantaneous current of the RF signal. The apparatus may additionally include one or more processors configured to transform the digital representations of the instantaneous voltage and current into frequency domain representations of a complex voltage and complex current.</p>
      </isu-abst>
      <representative-img>
        <p type="p">802:RF頻率訊號</p>
        <p type="p">804:RF電壓訊號</p>
        <p type="p">806:RF電流訊號</p>
        <p type="p">808:第一分支</p>
        <p type="p">810:峰值大小</p>
        <p type="p">812:第二分支</p>
        <p type="p">814:峰值大小</p>
        <p type="p">818:相位差</p>
        <p type="p">822:功率因數</p>
        <p type="p">824:降頻轉換模組</p>
        <p type="p">826:實部濾波及降取樣模組</p>
        <p type="p">828:虛部濾波及降取樣模組</p>
        <p type="p">830:大小/相位判定模組</p>
        <p type="p">832:降頻轉換模組</p>
        <p type="p">834:實部濾波及降取樣模組</p>
        <p type="p">836:虛部濾波及降取樣模組</p>
        <p type="p">838:大小/相位判定模組</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10028.png" file="d10028.TIF" giffile="ed10028.png" height="659px" img-content="tif" inline="yes" orientation="portrait" width="986px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623315</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115103980</doc-number>
          <kind></kind>
          <date>111/01/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">H05H1/46</main-classification>
        <further-classification edition="200601120260302B">H03F3/217</further-classification>
        <further-classification edition="200601120260302B">H02M3/156</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>新加坡商ＡＥＳ　全球公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AES GLOBAL HOLDINGS PTE LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>SG</english-country>
              <english-address>SG</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>赫克曼　蘭迪</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HECKMAN, RANDY</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/139,488</doc-number>
          <date>20210120</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>電感耦合電漿ＲＦ功率遞送系統</chinese-title>
        <english-title>INDUCTIVELY COUPLED PLASMA RF POWER DELIVERY SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭示一種電感耦合電漿(ICP)RF功率遞送系統，其包含至少兩個ICP線圈。所述ICP線圈中的至少一個藉由一RF諧振功率放大器直接驅動，所述RF諧振功率放大器包含一諧振槽，其包括所述ICP線圈。一控制器被配置以藉由變化一對應DC電壓源以及同時變化進入所述ICP線圈的操作頻率來控制進入直接被驅動的所述ICP線圈的功率，其中藉由容許橫跨一對應開路開關網路的一諧振電壓波形上升並且接著在一RF週期的一剩餘部分將所述對應開關網路閉路之前下降到實質零伏特。某些變化包括至少一被動ICP線圈，其被安排且配置以電感耦合至所述第一ICP線圈，並且所述被動ICP線圈藉由一獨立可調整阻抗而被端接。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Inductively coupled plasma (ICP) RF power delivery systems are disclosed that include at least two ICP coils. At least one of the ICP coils is directly driven by an RF resonant power amplifier that includes a resonant tank comprising the ICP coil. A controller is configured to control the power into the direct driven ICP coil by varying a corresponding DC voltage source and simultaneously varying operating frequency into the ICP coil by allowing a resonant voltage waveform across a corresponding open switch network to rise and then fall to substantially zero volts before closing the corresponding switch network for a remainder of an RF cycle. Some variations comprise at least one passive ICP coil that is arranged and configured to be inductively coupled to the first ICP coil, and the passive ICP coil is terminated by an independently adjustable impedance.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:電感耦合電漿(ICP)RF功率遞送系統</p>
        <p type="p">101:ICP源</p>
        <p type="p">102:RF諧振功率放大器</p>
        <p type="p">104:ICP線圈</p>
        <p type="p">106:開關網路</p>
        <p type="p">107:互耦合</p>
        <p type="p">108:諧振槽</p>
        <p type="p">109:電漿體</p>
        <p type="p">110:電抗網路</p>
        <p type="p">112:串聯電容</p>
        <p type="p">114:並聯電容</p>
        <p type="p">116:DC電壓源</p>
        <p type="p">118:節點</p>
        <p type="p">120:節點</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="781px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621610</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104226</doc-number>
          <kind></kind>
          <date>113/01/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260227B">A47C7/54</main-classification>
        <further-classification edition="200601120260227B">B62B9/24</further-classification>
        <further-classification edition="200601120260227B">B62B9/12</further-classification>
        <further-classification edition="200601120260227B">B62B9/26</further-classification>
        <further-classification edition="201801120260227B">B60N2/75</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑞士商明門瑞士股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WONDERLAND SWITZERLAND AG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CH</english-country>
              <english-address>CH</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>胡志強</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HU, ZHIQIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐頌雅</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>2023101757770</doc-number>
          <date>20230224</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>座椅組件</chinese-title>
        <english-title>SEAT COMPONENTS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種座椅組件包括：座椅部；束縛帶，設置於座椅部上且具有束縛位置和打開位置；鎖定扣具組，連接於束縛帶，並具有鎖定狀態和釋鎖狀態；及定位機構，設置於束縛帶和座椅部之間；其中鎖定扣具組處於鎖定狀態時，鎖定扣具組能與束縛帶連接而將束縛帶保持於束縛位置；鎖定扣具組處於釋鎖狀態時，定位機構能將束縛帶保持於打開位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A seat component includes: a seat portion; a harness strap disposed on the seat portion and having a restraining position and an open position; a locking buckle assembly connected to the harness strap and having a locking state and a release state; and a positioning mechanism disposed between the harness strap and the seat portion, wherein the locking buckle assembly in the locking state can connect to the harness strap and keep the harness strap in the restraining position, and the positioning mechanism can keep the harness strap in the open position when the locking buckle assembly is in the release state.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:車架</p>
        <p type="p">110:座椅組件</p>
        <p type="p">111:座杆</p>
        <p type="p">120:推手組件</p>
        <p type="p">130:扶手支撐杆</p>
        <p type="p">200:扶手本體</p>
        <p type="p">300:扶手安裝單元</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10031.JPG" file="ed10031.JPG" height="902px" img-content="tif" inline="yes" orientation="portrait" width="630px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622650</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104539</doc-number>
          <kind></kind>
          <date>110/09/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G03G15/08</main-classification>
        <further-classification edition="200601120260224B">G03G21/14</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商佳能股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANON KABUSHIKI KAISHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>杉本聡太</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SUGIMOTO, SOHTA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>土方俊介</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIJIKATA, SHUNSUKE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樹
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAYASHI, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>深澤悠</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKASAWA, YU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石川聖也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHIKAWA, SEIYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>一
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NISHIDA, SHINICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>二郎
              </last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOBA, SHINJIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>河波健男</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KAWANAMI, TAKEO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="9">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福井悠一</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUI, YUICHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="10">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>江上恭行</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EGAMI, YASUYUKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2020-156776</doc-number>
          <date>20200917</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>匣盒</chinese-title>
        <english-title>CARTRIDGE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]  &lt;br/&gt;　　目的在於使歷來的技術進一步開展。  &lt;br/&gt;[解決手段]  &lt;br/&gt;　　一種匣盒，其具有：感光體(4)；顯影構件(6)，其使碳粉附著於感光體(4)；聯軸構件(74)，其可承受用於將顯影構件(6)進行旋轉驅動的驅動力；移動部(510)，其可在容許從聯軸構件(74)往顯影構件(6)的驅動力的傳遞的驅動力傳遞位置與遮斷從聯軸構件(74)往顯影構件(6)的驅動力的傳遞的驅動力遮斷位置之間進行移動；以及保持部，其在移動部(510)位於驅動力遮斷位置時將移動部(510)在驅動力遮斷位置進行保持；在顯影構件(6)位於可使碳粉附著於感光體(4)的位置的狀態下，移動部(510)可採取驅動力傳遞位置與驅動力遮斷位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:感光鼓</p>
        <p type="p">8:光鼓單元</p>
        <p type="p">9:顯影單元</p>
        <p type="p">510:限制構件</p>
        <p type="p">510b:限制桿部</p>
        <p type="p">510c,510d:腳部</p>
        <p type="p">510e,510f:面</p>
        <p type="p">526c:支撐部</p>
        <p type="p">533:顯影蓋構件</p>
        <p type="p">533c:嵌合孔</p>
        <p type="p">540:驅動控制構件</p>
        <p type="p">540a:控制部</p>
        <p type="p">540b:第一施力面</p>
        <p type="p">540c:第二施力面</p>
        <p type="p">B1,B2:箭頭</p>
        <p type="p">K:擺動軸</p>
        <p type="p">T3,T4,T6:間隙</p>
        <p type="p">W51,W52:箭頭</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10073.png" file="d10073.TIF" giffile="ed10073.png" height="995px" img-content="tif" inline="yes" orientation="portrait" width="747px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622571</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104625</doc-number>
          <kind></kind>
          <date>113/05/24</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G02B6/42</main-classification>
        <further-classification edition="200601120260224B">G02B6/26</further-classification>
        <further-classification edition="200601120260224B">G02B6/36</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商山姆科技公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMTEC, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>畢特門　Ｒ　布瑞德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BETTMAN, R. BRAD</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>阿迪安　喬瑟夫　Ｆ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AHADIAN, JOSEPH F.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>閻啓泰</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林景郁</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/468,858</doc-number>
          <date>20230525</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>63/608,518</doc-number>
          <date>20231211</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學塊件、光學塊件次組件、光學互連以及在纜線套管與光學互連模組之間進行光學互連的方法</chinese-title>
        <english-title>OPTICAL BLOCK, OPTICAL BLOCK SUBASSEMBLY, OPTICAL INTERCONNECTION AND METHOD OF MAKING OPTICAL INTERCONNECTION BETWEEN CABLE FERRULE AND OPTICAL INTERCONNECT MODULE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明描述一種使用一光學塊件在光纖與光電元件之間進行一光學連接之系統及方法。該光學塊件為包括至複數個光纖之一可拆卸光學界面的一光學互連模組之一部分。該光學界面可包括兩個配置：一第一配置及一第二配置。該第一配置包括一經曝露光學路徑，且該第二配置包括一經密封光學路徑。一共同光學互連模組及一共同光學塊件可用於兩種配置中。該光學塊件可包括對準特徵，這些對準特徵有助於使得該光學塊件能夠相對於六個自由度與一配合元件準確對齊。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A system and method for making an optical connection between optical fibers and optoelectronic elements using an optical block is described. The optical block is a portion of an optical interconnect module that includes a detachable optical interface to a plurality of optical fibers. The optical interface may include two configurations: a first configuration and a second configuration. The first configuration includes an exposed optical path, and the second configuration includes a sealed optical path. A common optical interconnect module and a common optical block can be used in both configurations. The optical block may include alignment features that help enable accurate registration of the optical block to a mating element with respect to six degrees-of-freedom.</p>
      </isu-abst>
      <representative-img>
        <p type="p">78:光學塊件</p>
        <p type="p">152:光學塊件之底部表面</p>
        <p type="p">154:光學塊件上之對準特徵</p>
        <p type="p">156:II型對準特徵</p>
        <p type="p">157:楔</p>
        <p type="p">158:側向延伸之楔</p>
        <p type="p">160:I型對準特徵</p>
        <p type="p">161:支座</p>
        <p type="p">162:縱向延伸之楔</p>
        <p type="p">278:帶楔光學塊件</p>
        <p type="p">X:方向/軸</p>
        <p type="p">Y:方向/軸</p>
        <p type="p">Z:方向/軸</p>
        <p type="p">γ&lt;sub&gt;x&lt;/sub&gt;:縱向旋轉</p>
        <p type="p">γ&lt;sub&gt;y&lt;/sub&gt;:側向旋轉</p>
        <p type="p">γ&lt;sub&gt;z&lt;/sub&gt;:橫向旋轉</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10015.JPG" file="ed10015.JPG" height="549px" img-content="tif" inline="yes" orientation="portrait" width="691px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621982</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104658</doc-number>
          <kind></kind>
          <date>110/12/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="201701120260224B">C01B32/168</main-classification>
        <further-classification edition="200601120260224B">B23K35/36</further-classification>
        <further-classification edition="200601120260224B">B05D1/00</further-classification>
        <further-classification edition="201101120260224B">B82Y30/00</further-classification>
        <further-classification edition="201101120260224B">B82Y40/00</further-classification>
        <further-classification edition="200601320260224B">B23K101/40</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商卡爾拜斯有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CARBICE CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔻拉　巴拉坦特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COLA, BARATUNDE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格林　科瑞格</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREEN, CRAIG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>奧托摩　Ａ　　Ｄ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OETOMO, A. DAVIN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/126,432</doc-number>
          <date>20201216</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>焊料－奈米碳結構複合材料及其製造與使用方法</chinese-title>
        <english-title>SOLDER-CARBON NANOSTRUCTURE COMPOSITES AND METHODS OF MAKING AND USING THEREOF</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">描述了焊料-奈米碳結構複合材料及其製造與使用方法。此類複合材料可以用於熱應用，並且可以用作例如熱界面材料(TIM)。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Solder-carbon nanostructure composites and methods of making and using thereof are described. Such composites can be useful for thermal application and can serve, for example, as thermal interface materials (TIMs).</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623136</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104685</doc-number>
          <kind></kind>
          <date>108/07/08</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H01S5/00</main-classification>
        <further-classification edition="200601120260224B">H01S5/02</further-classification>
        <further-classification edition="201601120260224B">F21K9/00</further-classification>
        <further-classification edition="202201120260224B">H05B44/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商光程研創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ARTILUX, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>那允中</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NA, YUN-CHUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳建龍</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, CHIEN-LUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林杰霆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIN, CHIEH-TING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳柏均</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, BO-JIUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳慧文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, HUI-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>許毓倚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HSU, YU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="7">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>莊世岱</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUANG, SHIH-TAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/695,062</doc-number>
          <date>20180708</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>62/700,688</doc-number>
          <date>20180719</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>美國</country>
          <doc-number>62/751,602</doc-number>
          <date>20181027</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>發光裝置</chinese-title>
        <english-title>LIGHT EMISSION APPARATUS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一發光裝置包括：一雷射二極體，用以發出一光線；一雷射驅動器，電性耦接至雷射二極體，所述雷射驅動器用以驅動雷射二極體以產生光線；及一光學模組，被配置以接收雷射二極體發出的光線，所述光學模組包含至少一光學元件，且用以調整光線並發出一發送光線；其中光學模組發出的發送光線有一照射角，且光學模組可調整光線以改變所述照射角。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A light emission apparatus includes a laser diode configured to emit a light; a laser driver electrically coupled to the laser diode, the laser driver being configured to drive the laser diode to generate the light; and an optical module arranged to receive the light emitted by the laser diode, the optical module comprising at least one optical element and being configured to adjust the light and emits a transmitting light; wherein the transmitting light emits from the optical module with an illumination angle and the optical module adjusts the light to vary the illumination angle.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:飛行時間影像系統</p>
        <p type="p">102:發光裝置</p>
        <p type="p">104:光源</p>
        <p type="p">105:雷射驅動器</p>
        <p type="p">106:雷射二極體</p>
        <p type="p">108:光學模組</p>
        <p type="p">120:光線接收裝置</p>
        <p type="p">122:光學模組</p>
        <p type="p">124:像素陣列</p>
        <p type="p">126:影像資料處理器</p>
        <p type="p">140:3D標的</p>
        <p type="p">IL:入射光</p>
        <p type="p">TL:發送光線</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10100.JPG" file="ed10100.JPG" height="731px" img-content="tif" inline="yes" orientation="portrait" width="1083px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622979</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104722</doc-number>
          <kind></kind>
          <date>113/07/16</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G11C16/22</main-classification>
        <further-classification edition="200601120260224B">G11C16/30</further-classification>
        <further-classification edition="200601120260224B">G06F1/28</further-classification>
        <further-classification edition="200601120260224B">G06F1/24</further-classification>
        <further-classification edition="200601120260224B">G11C16/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商長江存儲科技有限責任公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANGTZE MEMORY TECHNOLOGIES CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>翁青煌</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WENG, QING-HUANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>武恒文</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WU, HENG-WEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>楊長峯</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>世界智慧財產權組織</country>
          <doc-number>PCT/CN2023/108056</doc-number>
          <date>20230719</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體系統中的斷電保護和復位信號生成</chinese-title>
        <english-title>POWER LOSS PROTECTION AND RESET SIGNAL GENERATION IN MEMORY SYSTEMS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本公開涉及用於記憶體系統中的斷電保護的方法和設備。在一個示例中，記憶體系統包括記憶體裝置、控制器、斷電保護（PLP）電路和保護電路。控制器耦合到記憶體裝置。控制器的復位端子耦合到電容器。保護電路耦合到控制器和PLP電路。保護電路被配置為：接收來自PLP電路的PLP輸出電壓；接收系統供電電壓；以及響應於確定PLP輸出電壓低於系統供電電壓的一部分來向控制器的復位端子提供復位信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present disclosure relates to methods and apparatuses for power loss protection in a memory system. In one example, a memory system includes a memory device, a controller, a power loss protection (PLP) circuit, and a protection circuit. The controller is coupled to the memory device. A reset terminal of the controller is coupled to a capacitor. The protection circuit is coupled to the controller and the PLP circuit. The protection circuit is configured to: receive a PLP output voltage from the PLP circuit, receive a system supply voltage, and provide a reset signal to the reset terminal of the controller in response to determining that the PLP output voltage is lower than a fraction of the system supply voltage.</p>
      </isu-abst>
      <representative-img>
        <p type="p">104:控制器</p>
        <p type="p">110:斷電保護(PLP)電路</p>
        <p type="p">112:保護電路</p>
        <p type="p">126:系統供電電壓</p>
        <p type="p">128:PLP輸出電壓</p>
        <p type="p">130:復位信號(RST)</p>
        <p type="p">132:復位端子</p>
        <p type="p">302:電容器</p>
        <p type="p">304:比較器</p>
        <p type="p">306，308:輸入</p>
        <p type="p">310:輸出</p>
        <p type="p">312，314，316，320:電阻器</p>
        <p type="p">318:電壓輸入</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10010.JPG" file="ed10010.JPG" height="933px" img-content="tif" inline="yes" orientation="portrait" width="547px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623268</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104746</doc-number>
          <kind></kind>
          <date>113/05/22</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202301120260223B">H04N25/70</main-classification>
        <further-classification edition="202301120260223B">H04N25/76</further-classification>
        <further-classification edition="202301120260223B">H04N25/77</further-classification>
        <further-classification edition="202301120260223B">H04N25/60</further-classification>
        <further-classification edition="202301120260223B">H04N25/67</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商豪威科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>OMNIVISION TECHNOLOGIES, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>海老原弘知</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EBIHARA, HIROAKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柳澤暢大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>YANAGISAWA, NOBUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>櫻井賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKURAI, SATOSHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>舘知恭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TATE, TOMOYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>北沢直紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KITAZAWA, NAOKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>原田康平</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HARADA, KOHEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂光</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金若芸</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/363,469</doc-number>
          <date>20230801</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>分散式斜坡線性補償電路</chinese-title>
        <english-title>DISTRIBUTED RAMP LINEARITY COMPENSATION CIRCUIT</english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種成像系統包括經組態以回應於入射光而產生複數個影像電荷電壓信號之一像素陣列，及耦合至該像素陣列之讀出電路系統，該讀出電路系統包含複數個行單元胞元。每一行單元胞元包括複數個比較器中之至少一者，其中每一比較器經耦合以透過一斜坡信號線而接收來自斜坡產生器之斜坡信號。每一行單元胞元亦包括耦合至該斜坡信號線之一補償電流單元，每一補償電流單元包括一補償電流源及耦合至該補償電流源之一補償電流開關，其中該補償電流源及該補償電流開關耦合於該斜坡信號線上之一第一節點與一第二節點之間。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging system comprises a pixel array configured to generate a plurality of image charge voltage signals in response to incident light, and readout circuitry coupled to the pixel array, the readout circuitry including a plurality of column unit cells. Each column unit cell comprises at least one of a plurality of comparators, wherein each comparator is coupled to receive the ramp signal from the ramp generator through a ramp signal line. Each column unit cell also comprises a compensation current unit coupled to the ramp signal line, each compensation current unit comprising a compensation current source and a compensation current switch coupled to the compensation current source, wherein the compensation current source and the compensation current switch are coupled between a first node on the ramp signal line and a second node.</p>
      </isu-abst>
      <representative-img>
        <p type="p">202:像素陣列</p>
        <p type="p">206:讀出電路</p>
        <p type="p">212:位元線</p>
        <p type="p">214:全域斜坡產生器</p>
        <p type="p">216:比較器</p>
        <p type="p">220:斜坡信號線</p>
        <p type="p">222:行單元胞元</p>
        <p type="p">226:計數器</p>
        <p type="p">228a-228n:節點</p>
        <p type="p">230:補償電流單元</p>
        <p type="p">240:固有金屬佈線電阻/寄生電阻</p>
        <p type="p">242:代表的局域寄生電容</p>
        <p type="p">R&lt;sub&gt;P&lt;/sub&gt;:固有金屬佈線電阻/寄生電阻</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.JPG" file="ed10012.JPG" height="811px" img-content="tif" inline="yes" orientation="portrait" width="690px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202621680</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104777</doc-number>
          <kind></kind>
          <date>109/05/15</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">A61K31/192</main-classification>
        <further-classification edition="200601120260302B">A61K31/198</further-classification>
        <further-classification edition="200601120260302B">A61P1/00</further-classification>
        <further-classification edition="200601120260302B">A61K9/20</further-classification>
        <further-classification edition="200601120260302B">A61K9/48</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商癌症預防製藥股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CANCER PREVENTION PHARMACEUTICALS, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>格納　尤金</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GERNER, EUGENE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>科恩　艾爾弗雷德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COHEN, ALFRED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>柏伊蒂姆　麥克爾</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYTIM, MICHELLE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>朱淑尹</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/849,590</doc-number>
          <date>20190517</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>治療家族性腺瘤性瘜肉症之方法</chinese-title>
        <english-title>METHODS FOR TREATING FAMILIAL ADENOMATOUS POLYPOSIS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本文提供用於預防或延遲患有家族性腺瘤性瘜肉症(FAP)且具有至少部分完整下胃腸道之病患需要手術介入之方法。本文亦提供用於預防或延遲患有FAP之病患中贅生物及/或癌症形成之方法。該等方法包括向患有FAP且具有完整下胃腸道之病患投與有效量之包含依氟鳥胺酸(eflornithine)及舒林酸(sulindac)之醫藥療法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Provided are methods for preventing or delaying the need for surgical intervention in a patient having familial adenomatous polyposis (FAP) and an at least partially intact lower gastrointestinal tract. Also provided are methods for preventing or delaying the formation of neoplasia and/or cancer in a patient having FAP. The methods comprise administering an effective amount of a pharmaceutical therapy that comprises eflornithine and sulindac to a patient having FAP and an intact lower gastrointestinal tract.</p>
      </isu-abst>
      <representative-img>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10013.JPG" file="ed10013.JPG" height="627px" img-content="tif" inline="yes" orientation="portrait" width="926px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622511</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104844</doc-number>
          <kind></kind>
          <date>113/03/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G01R1/06</main-classification>
        <further-classification edition="200601120260224B">G01R1/02</further-classification>
        <further-classification edition="200601120260224B">G01R3/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商李諾工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEENO INDUSTRIAL INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>白承夏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BAEK, SEUNGHA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林民周</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, MINJU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金昌旭</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, CHANGWOOK</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李彩允</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LEE, CHAEYOON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2023-0054922</doc-number>
          <date>20230426</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2023-0173351</doc-number>
          <date>20231204</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>製造測試探頭的方法</chinese-title>
        <english-title>METHOD OF FABRICATING TEST PROBE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">揭露一種製造測試探頭的方法，所述測試探頭包括管狀的筒且包括柱塞，所述柱塞可滑動地且部分地插置於所述筒中。所述方法包括：在所述筒的一個端部部分處形成直徑減小部分；藉由在所述筒的軸線方向上進行圓柱形切割而機械加工出直徑減小部分的前端內表面；以及至少在直徑減小部分中沿著軸線方向形成多個狹縫。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Disclosed is a method of fabricating a test probe including a tubular barrel and a plunger slidably and partially inserted in the barrel. The method includes: forming a diameter-reducing portion at one end portion of the barrel; machining a fore-end inner surface of the diameter-reducing portion by cylindrical cutting in an axial-line direction of the barrel; and forming a plurality of slits at least in the diameter-reducing portion along the axial-line direction.</p>
      </isu-abst>
      <representative-img>
        <p type="p">110M:管構件</p>
        <p type="p">112:裙部部分</p>
        <p type="p">113:狹縫</p>
        <p type="p">114:凸緣</p>
        <p type="p">1122C:倒角部分</p>
        <p type="p">1122E:面對端部部分</p>
        <p type="p">1122M:直徑減小部分</p>
        <p type="p">X:軸線方向</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10012.png" file="d10012.TIF" giffile="ed10012.png" height="981px" img-content="tif" inline="yes" orientation="portrait" width="763px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622599</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104929</doc-number>
          <kind></kind>
          <date>110/08/11</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">G02B27/01</main-classification>
        <further-classification edition="200601120260302B">H04N5/64</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商半導體能源研究所股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEMICONDUCTOR ENERGY LABORATORY CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>中村太紀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NAKAMURA, DAIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>青山智哉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AOYAMA, TOMOYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>清野史康</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SEINO, FUMIYASU</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>石谷哲二</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ISHITANI, TETSUJI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2020-140132</doc-number>
          <date>20200821</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2020-167184</doc-number>
          <date>20201001</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>顯示裝置、電子裝置及頭戴顯示器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">提供一種顯示裝置的使用者能夠看到明亮的影像的顯示裝置。本發明是從下層依次層疊第一基板、發光元件、絕緣層、彩色層、平坦化層、平凸透鏡、樹脂層及第二基板而成的顯示裝置。平凸透鏡是向顯示裝置的上方向凸出的形狀。平凸透鏡的凸部與樹脂層接觸，樹脂層的折射率低於平凸透鏡的折射率。發光元件發射的光藉由平凸透鏡在正面方向聚光。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">10:顯示裝置</p>
        <p type="p">11:基板</p>
        <p type="p">12:基板</p>
        <p type="p">13:絕緣層</p>
        <p type="p">14:分隔壁</p>
        <p type="p">15B:像素</p>
        <p type="p">15G:像素</p>
        <p type="p">15R:像素</p>
        <p type="p">21:絕緣層</p>
        <p type="p">25B:彩色層</p>
        <p type="p">25G:彩色層</p>
        <p type="p">25R:彩色層</p>
        <p type="p">27:平坦化層</p>
        <p type="p">29:透鏡</p>
        <p type="p">29a:平坦部</p>
        <p type="p">29b:凸部</p>
        <p type="p">30:發光元件</p>
        <p type="p">31:發光層</p>
        <p type="p">33:樹脂層</p>
        <p type="p">42:導電層</p>
        <p type="p">52:電晶體</p>
        <p type="p">60:導電層</p>
        <p type="p">63:絕緣層</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10001.png" file="d10001.TIF" giffile="ed10001.png" height="540px" img-content="tif" inline="yes" orientation="portrait" width="698px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623545</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115104930</doc-number>
          <kind></kind>
          <date>111/04/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="202601120260302B">H10P52/00</main-classification>
        <further-classification edition="202601120260302B">H10P50/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>坂﨑哲也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAKAZAKI, TETSUYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>森川勝洋</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MORIKAWA, KATSUHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林志剛</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2021-077562</doc-number>
          <date>20210430</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2022-001222</doc-number>
          <date>20220106</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>基板處理裝置及基板處理方法</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">[課題]提供提升基板之面內均勻性的技術。  &lt;br/&gt;　　[解決手段]實施型態所涉及的基板處理裝置具備基板保持部、處理液供給部和蓋部。基板保持部係將基板保持水平而使基板旋轉。處理液供給部係朝向被保持於基板保持部的基板供給處理液。蓋部係被設置成與由基板保持部所保持的基板之一面相反側的基板之另一面面對面。基板保持部保持上述基板之下面。蓋部具備加熱基板的加熱器。在蓋部形成開口部和複數氣體供給口。開口部被形成在對應於基板之中央部的位置。複數氣體供給口係在較開口部更外周側，朝向基板之另一面供給氣體。氣體係藉由加熱器被加熱。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">4:控制裝置</p>
        <p type="p">16:處理單元</p>
        <p type="p">30:腔室</p>
        <p type="p">31:基板保持機構(基板保持部)</p>
        <p type="p">32:升降機構</p>
        <p type="p">33:處理液供給機構(處理液供給部)</p>
        <p type="p">34:加熱機構</p>
        <p type="p">35:氣體供給機構</p>
        <p type="p">36:回收杯</p>
        <p type="p">37:排氣裝置</p>
        <p type="p">38:FFU(Fan Filter Unit)</p>
        <p type="p">40:軸部</p>
        <p type="p">41:底板</p>
        <p type="p">41a:支持銷</p>
        <p type="p">41b:凹部</p>
        <p type="p">42:旋轉驅動部</p>
        <p type="p">43:插入孔</p>
        <p type="p">50:軸部</p>
        <p type="p">51:升降板</p>
        <p type="p">51a:收授銷</p>
        <p type="p">52:升降驅動部</p>
        <p type="p">60:處理液供給源</p>
        <p type="p">61:流量調整機構</p>
        <p type="p">62:處理液供給管</p>
        <p type="p">62a:供給口</p>
        <p type="p">70:蓋部</p>
        <p type="p">70a:開口部</p>
        <p type="p">71:臂部</p>
        <p type="p">72:移動機構</p>
        <p type="p">73:加熱器</p>
        <p type="p">80:氣體供給源</p>
        <p type="p">81:流量調整機構</p>
        <p type="p">82:吐出口(氣體供給口)</p>
        <p type="p">82a:第1吐出口(第1氣體供給口)</p>
        <p type="p">82b:第2吐出口(第2氣體供給口)</p>
        <p type="p">84:貯留部</p>
        <p type="p">84a:第1貯留部</p>
        <p type="p">84b:第2貯留部</p>
        <p type="p">86:氣體供給路</p>
        <p type="p">90:第1壁部</p>
        <p type="p">91:第2壁部</p>
        <p type="p">92:頂棚部</p>
        <p type="p">92a:開口部</p>
        <p type="p">93:底部</p>
        <p type="p">100:處理液排出管</p>
        <p type="p">101:排氣管</p>
        <p type="p">W:晶圓(基板)</p>
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          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="873px" img-content="tif" inline="yes" orientation="portrait" width="729px">
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        <document-id>
          <doc-number>202621716</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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          <doc-number>115105036</doc-number>
          <kind></kind>
          <date>113/02/15</date>
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        <main-classification edition="201501120260302B">A61K35/747</main-classification>
        <further-classification edition="200601120260302B">A61P37/04</further-classification>
        <further-classification edition="201601120260302B">A23L33/135</further-classification>
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          <applicant app-type="applicant" sequence="1">
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                <last-name>日商江崎格力高股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>EZAKI GLICO CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>鶴野圭悟</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TSURUNO, KEIGO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馬渡隆志</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MAWATARI, TAKASHI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉法正</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>尹重君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2023-020334</doc-number>
          <date>20230213</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>乳酸菌及免疫賦活劑</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題在於提供一種新穎乳酸菌及使用該乳酸菌之免疫賦活劑。&lt;br/&gt;  本發明之解決手段係提供一種免疫賦活劑，其係包含瑞士乳桿菌(&lt;i&gt;Lactobacillus helveticus&lt;/i&gt;)之免疫賦活劑，其中前述瑞士乳桿菌具有樹突細胞樣細胞活化、IgA產生誘導及IL-12產生誘導之3個機能。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202622232</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105080</doc-number>
          <kind></kind>
          <date>110/07/09</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C12N9/06</main-classification>
        <further-classification edition="200601120260302B">C12N15/53</further-classification>
        <further-classification edition="200601120260302B">C12N15/63</further-classification>
        <further-classification edition="200601120260302B">C12N5/10</further-classification>
        <further-classification edition="200601120260302B">C12P13/04</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商湖南利爾生物科技有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HUNAN LIER BIOTECH CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝新開</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, XINKAI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>徐偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XU, WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>范俊英</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FAN, JUNYING</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張哲倫</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>李協書</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>中國大陸</country>
          <doc-number>202010659106.8</doc-number>
          <date>20200709</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>經修飾的麩胺酸脫氫酶及其應用</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明涉及經修飾的麩胺酸脫氫酶(GluDH)。具體而言，本發明的經修飾的GluDH具有提高的催化PPO與胺基供體反應生成L-草銨膦的活性和/或改進的動力學性質。本發明還涉及編碼本發明的經修飾的GluDH的多核苷酸、表現本發明的經修飾的GluDH的載體和宿主細胞以及使用本發明的經修飾的GluDH和宿主細胞生產L-草銨膦的方法。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622304</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105092</doc-number>
          <kind></kind>
          <date>110/05/20</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C30B25/04</main-classification>
        <further-classification edition="200601120260302B">C30B25/18</further-classification>
        <further-classification edition="200601120260302B">C30B29/52</further-classification>
        <further-classification edition="202601120260302B">H10P70/00</further-classification>
      </classification-ipc>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>彼得森　巴柏沙　立馬　盧卡斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>PETERSEN BARBOSA LIMA, LUCAS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BR</english-country>
              <english-address>BR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>瑪格蒂斯　喬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MARGETIS, JOE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>托勒　約翰</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOLLE, JOHN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>哈莎卡　瑞米</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KHAZAKA, RAMI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>LB</english-country>
              <english-address>LB</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>謝　琦</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>XIE, QI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/030,174</doc-number>
          <date>20200526</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>磊晶生長摻雜硼及鎵的矽鍺層之方法</chinese-title>
        <english-title>METHOD FOR EPITAXIALLY GROWING BORON- AND GALLIUM-DOPED SILICON GERMANIUM LAYERS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">所揭示者係用於磊晶生長摻雜硼及鎵的矽鍺層之方法及裝置。該等層可舉例而言使用作為場效應電晶體中之p型源極及/或汲極區。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Methods and devices for epitaxially growing boron- and gallium-doped silicon germanium layers. The layers may be used, for example, as a p-type source and/or drain regions in field effect transistors.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:方法</p>
        <p type="p">102:基材提供步驟</p>
        <p type="p">104:沉積步驟</p>
        <p type="p">105:加蓋步驟</p>
        <p type="p">108:蝕刻步驟</p>
        <p type="p">110:沉積步驟104及105和蝕刻步驟108之循環迴圈/重複</p>
        <p type="p">112:方法終止</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.JPG" file="ed10007.JPG" height="816px" img-content="tif" inline="yes" orientation="portrait" width="651px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622012</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105095</doc-number>
          <kind></kind>
          <date>112/03/14</date>
        </document-id>
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      <classification-ipc>
        <main-classification edition="200601120260223B">C03C3/076</main-classification>
        <further-classification edition="200601120260223B">C03C3/089</further-classification>
        <further-classification edition="200601120260223B">C03B37/01</further-classification>
        <further-classification edition="200601120260223B">C03C13/02</further-classification>
        <further-classification edition="200601120260223B">H01B3/08</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商日本電氣硝子股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>NIPPON ELECTRIC GLASS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>木村美樹</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIMURA, MIKI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
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      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2022-040940</doc-number>
          <date>20220316</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>日本</country>
          <doc-number>2022-094481</doc-number>
          <date>20220610</date>
        </priority-claim>
        <priority-claim sequence="3">
          <country>日本</country>
          <doc-number>2023-036411</doc-number>
          <date>20230309</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>玻璃纖維</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種玻璃纖維，作為玻璃組成，以質量%計含有SiO&lt;sub&gt;2&lt;/sub&gt; 40%～80%、Al&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 0%～20%、B&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt; 10%～30%，並且含有選自MgO、CaO、SrO、BaO、Li&lt;sub&gt;2&lt;/sub&gt;O、Na&lt;sub&gt;2&lt;/sub&gt;O、K&lt;sub&gt;2&lt;/sub&gt;O、ZrO&lt;sub&gt;2&lt;/sub&gt;、Fe&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、SnO&lt;sub&gt;2&lt;/sub&gt;、F及Cl中的至少一種，MoO&lt;sub&gt;3&lt;/sub&gt;、Cr&lt;sub&gt;2&lt;/sub&gt;O&lt;sub&gt;3&lt;/sub&gt;、Pt及Rh的總量為0.01 ppm～500 ppm，且TiO&lt;sub&gt;2&lt;/sub&gt;（質量%）×MoO&lt;sub&gt;3&lt;/sub&gt;（ppm）的值為3100以下。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202623204</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105254</doc-number>
          <kind></kind>
          <date>113/10/23</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">H03K5/003</main-classification>
        <further-classification edition="202001120260224B">H03K19/1778</further-classification>
        <further-classification edition="200601120260224B">H03K19/0185</further-classification>
        <further-classification edition="200601120260224B">G05F3/26</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>大陸商北京集創北方科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHIPONE TECHNOLOGY (BEIJING) CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉雲鵬</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name></last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>CN</english-country>
              <english-address>CN</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>葉盛豐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
      </priority-claims>
      <invention-title>
        <chinese-title>動態電平移位電路、電子晶片和資訊處理裝置</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明主要揭示一種動態電平移位電路，其應用於一電子晶片之中，且包括：一信號輸入單元、一轉換單元以及一啟動模塊，其中，該信號輸入單元用以將一輸入信號處理為一第一輸入信號與一第二輸入信號，且該轉換單元被配置耦接於一工作電壓與一接地端之間。特別地，本發明以一使能信號控制該信號輸入單元和該啟動模塊。在該使能信號具一電壓準位的情況下，該信號輸入單元輸出所述第一輸入信號和所述第二輸入信號，且該啟動模塊啟動該轉換單元以將該第一輸入信號和該第二輸入信號電平移位處理為一輸出信號。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">1:動態電平移位電路</p>
        <p type="p">11:信號輸入單元</p>
        <p type="p">12:轉換單元</p>
        <p type="p">121:第一P型MOSFET元件</p>
        <p type="p">123:第二P型MOSFET元件</p>
        <p type="p">122:第一N型MOSFET元件</p>
        <p type="p">124:第二N型MOSFET元件</p>
        <p type="p">13:啟動模塊</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10007.png" file="d10007.TIF" giffile="ed10007.png" height="811px" img-content="tif" inline="yes" orientation="portrait" width="747px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622588</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105263</doc-number>
          <kind></kind>
          <date>113/08/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G02B15/14</main-classification>
        <further-classification edition="202301120260224B">H04N23/55</further-classification>
        <further-classification edition="200601120260224B">G02B13/02</further-classification>
        <further-classification edition="200601120260224B">G02B9/60</further-classification>
        <further-classification edition="202101120260224B">G03B17/12</further-classification>
        <further-classification edition="202301120260224B">H04N23/45</further-classification>
        <further-classification edition="202301120260224B">H04N23/54</further-classification>
        <further-classification edition="202301120260224B">H04N23/698</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>趙鏞主</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JO, YONG JOO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林台淵</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIM, TAE YEON</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2023-0112972</doc-number>
          <date>20230828</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>成像裝置</chinese-title>
        <english-title>IMAGING DEVICE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">成像裝置包括第一透鏡組和第二透鏡組，第一透鏡組包括多個第一透鏡模組和單個第一影像感測器，第二透鏡組包括多個第二透鏡模組和單個第二影像感測器，其中第一透鏡組和第二透鏡組布置為彼此相鄰，其中多個第一透鏡模組中每個第一透鏡模組的視場比多個第二透鏡模組中每個第二透鏡模組的視場更寬，並且其中滿足f35t/f35w ≥ 2，其中f35t是第二透鏡模組的35毫米等效焦距，f35w是第一透鏡模組的35毫米等效焦距。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An imaging device includes a first lens assembly including a plurality of first lens modules and a single first image sensor, and a second lens assembly including a plurality of second lens modules and a single second image sensor, wherein the first lens assembly and the second lens assembly are arranged to be adjacent to each other, wherein a field of view of each first lens module of the plurality of first lens modules is wider than a field of view of each second lens module of the plurality of second lens modules, and wherein f35t/f35w ≥ 2 is satisfied, where f35t is a 35mm equivalent focal length of the second lens module and f35w is a 35mm equivalent focal length of the first lens module.</p>
      </isu-abst>
      <representative-img>
        <p type="p">10:第一透鏡組</p>
        <p type="p">11:第一廣角透鏡陣列</p>
        <p type="p">12:第二廣角透鏡陣列</p>
        <p type="p">13:第三廣角透鏡陣列</p>
        <p type="p">14:第四廣角透鏡陣列</p>
        <p type="p">15:第五廣角透鏡陣列</p>
        <p type="p">16:第一影像感測器</p>
        <p type="p">20:第二透鏡組</p>
        <p type="p">21:第一攝遠透鏡陣列</p>
        <p type="p">22:第二攝遠透鏡陣列</p>
        <p type="p">23:第三攝遠透鏡陣列</p>
        <p type="p">24:第四攝遠透鏡陣列</p>
        <p type="p">25:第五攝遠透鏡陣列</p>
        <p type="p">26:第二影像感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10011.JPG" file="ed10011.JPG" height="721px" img-content="tif" inline="yes" orientation="portrait" width="656px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
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    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622548</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105270</doc-number>
          <kind></kind>
          <date>112/08/28</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G02B3/00</main-classification>
        <further-classification edition="202101120260224B">G02B7/02</further-classification>
        <further-classification edition="200601120260224B">G02B9/64</further-classification>
        <further-classification edition="200601120260224B">G02B11/34</further-classification>
        <further-classification edition="200601120260224B">G02B13/00</further-classification>
        <further-classification edition="200601120260224B">G02B13/18</further-classification>
        <further-classification edition="202101120260224B">G03B30/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>南韓商三星電機股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SAMSUNG ELECTRO-MECHANICS CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金炳賢</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, BYUNG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>金俊河</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIM, JOON HA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>張相鉉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>JANG, SANG HYUN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>KR</english-country>
              <english-address>KR</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鄭婷文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>詹富閔</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>南韓</country>
          <doc-number>10-2022-0171733</doc-number>
          <date>20221209</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>南韓</country>
          <doc-number>10-2023-0070460</doc-number>
          <date>20230531</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>光學成像系統</chinese-title>
        <english-title>OPTICAL IMAGING SYSTEM</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種光學成像系統包括：第一透鏡、第二透鏡、第三透鏡、第四透鏡、第五透鏡、第六透鏡、第七透鏡、第八透鏡、第九透鏡、第十透鏡及第十一透鏡，自物體側依次排列，其中第一透鏡具有正的折射力，且第二透鏡具有正的折射力，其中第十一透鏡在物體側表面及影像側表面中的至少一者上具有至少一個拐點，且其中滿足0.6 ＜ TTL/(2×IMG HT) ＜ 0.8及Nv26 ≥ 4，其中TTL是在光軸上自第一透鏡的物體側表面至成像表面的距離，IMG HT是成像表面的對角線長度的一半，且Nv26是具有小於26的阿貝數的透鏡的數目。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, an eighth lens, a ninth lens, a tenth lens, and an eleventh lens arranged in order from an object side, wherein the first lens has positive refractive power, and the second lens has positive refractive power, wherein the eleventh lens has at least one inflection point on at least one of an object-side surface and an image-side surface, and wherein 0.6 ＜ TTL/(2×IMG HT) ＜ 0.8, and Nv26 ≥ 4 are satisfied, where TTL is a distance from an object-side surface of the first lens to an imaging surface on an optical axis, IMG HT is half a diagonal length of the imaging surface, and Nv26 is the number of lenses with an Abbe number of less than 26.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:成像光學系統</p>
        <p type="p">101:第一透鏡</p>
        <p type="p">102:第二透鏡</p>
        <p type="p">103:第三透鏡</p>
        <p type="p">104:第四透鏡</p>
        <p type="p">105:第五透鏡</p>
        <p type="p">106:第六透鏡</p>
        <p type="p">107:第七透鏡</p>
        <p type="p">108:第八透鏡</p>
        <p type="p">109:第九透鏡</p>
        <p type="p">110:第十透鏡</p>
        <p type="p">111:第十一透鏡</p>
        <p type="p">112:濾光器</p>
        <p type="p">113:成像表面</p>
        <p type="p">IS:影像感測器</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10024.JPG" file="ed10024.JPG" height="744px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622040</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105305</doc-number>
          <kind></kind>
          <date>114/04/21</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C07C309/42</main-classification>
        <further-classification edition="200601120260302B">C07C309/43</further-classification>
        <further-classification edition="200601120260302B">C07C309/58</further-classification>
        <further-classification edition="200601120260302B">C07C309/71</further-classification>
        <further-classification edition="200601120260302B">C07C309/73</further-classification>
        <further-classification edition="200601120260302B">C07C381/12</further-classification>
        <further-classification edition="200601120260302B">C07D307/93</further-classification>
        <further-classification edition="200601120260302B">C07D327/08</further-classification>
        <further-classification edition="200601120260302B">C07D333/76</further-classification>
        <further-classification edition="200601120260302B">C09K3/00</further-classification>
        <further-classification edition="200601120260302B">G03F7/004</further-classification>
        <further-classification edition="200601120260302B">G03F7/039</further-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/32</further-classification>
        <further-classification edition="202601120260302B">H10P76/20</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商信越化學工業股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHIN-ETSU CHEMICAL CO., LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>福島将大</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>FUKUSHIMA, MASAHIRO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>樋田源太郎</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HIDA, GENTARO</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>周良吉</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>新竹市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-069899</doc-number>
          <date>20240423</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>鎓鹽、化學增幅阻劑組成物及圖案形成方法</chinese-title>
        <english-title>ONIUM SALT, CHEMICALLY AMPLIFIED RESIST COMPOSITION, AND PATTERN FORMING PROCESS</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明之課題為提供在使用高能射線之光微影中，係溶劑溶解性優異、高感度、高對比度，且EL、LWR、CDU、MEF、EL、DOF等微影性能優異的化學增幅阻劑組成物中使用之鎓鹽；包含該鎓鹽作為光酸產生劑之化學增幅阻劑組成物；以及使用該化學增幅阻劑組成物之圖案形成方法。  &lt;br/&gt;本發明之解決手段為由下式(1A)表示之陰離子及下式(1B)表示之陽離子構成的鎓鹽。  &lt;br/&gt;&lt;img align="absmiddle" height="342px" width="641px" file="ed10527.JPG" alt="ed10527.JPG" img-content="jpg" orientation="portrait" inline="yes"/&gt;&lt;br/&gt;</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">An onium salt consisting of an aromatic sulfonic acid anion substituted with a hydrocarbyl group containing at least one aromatic ring and a triaryl sulfonium cation containing iodine and fluorine is provided. A chemically amplified resist composition comprising the onium salt as a photoacid generator has satisfactory solvent solubility, high sensitivity, and high contrast, and forms a resist film with improved lithography properties including EL, LWR, CDU, MEF, EL and DOF.</p>
      </isu-abst>
      <representative-img>
        <p type="p">無</p>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622275</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105314</doc-number>
          <kind></kind>
          <date>110/06/17</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260302B">C23C16/34</main-classification>
        <further-classification edition="200601120260302B">C23C16/455</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>荷蘭商ＡＳＭ　ＩＰ私人控股有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ASM IP HOLDING B.V.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>NL</english-country>
              <english-address>NL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洛波　布尚</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ZOPE, BHUSHAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IN</english-country>
              <english-address>IN</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史帝芬斯　艾瑞克　克里斯多福</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STEVENS, ERIC CHRISTOPHER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>斯瓦米那森　香卡</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SWAMINATHAN, SHANKAR</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>希羅　艾瑞克　詹姆斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHERO, ERIC JAMES</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="5">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>米利根　羅勃特　布倫南</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MILLIGAN, ROBERT BRENNAN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>洪澄文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/043,271</doc-number>
          <date>20200624</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>在反應空間中的基材上形成含鉬薄膜之製程</chinese-title>
        <english-title>PROCESS FOR FORMING THIN FILM COMPRISING MOLYBDENUM ON SUBSTRATE IN REACTION SPACE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明揭露用於在基材上形成含鉬薄膜的氣相沉積製程。在一些實施例中，該等製程包含複數個沉積循環，其中該基材單獨接觸一含鹵化鉬的氣相鉬前驅物、一含CO的第一反應物、和一含H&lt;sub&gt;2&lt;/sub&gt;的第二反應物。在一些實施例中，該薄膜包含MoC、Mo&lt;sub&gt;2&lt;/sub&gt;C或MoOC。在一些實施例中，該基材另外接觸一氮反應物並沉積一含鉬、碳和氮薄膜，諸如MoCN或MoOCN。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Vapor deposition processes for forming thin films comprising molybdenum on a substrate are provide. In some embodiments the processes comprise a plurality of deposition cycles in which the substrate is separately contacted with a vapor phase molybdenum precursor comprising a molybdenum halide, a first reactant comprising CO, and a second reactant comprising H&lt;sub&gt;2&lt;/sub&gt;. In some embodiments the thin film comprises MoC, Mo&lt;sub&gt;2&lt;/sub&gt;C, or MoOC. In some embodiments the substrate is additionally contacted with a nitrogen reactant and a thin film comprising molybdenum, carbon and nitrogen is deposited, such as MoCN or MoOCN.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體器件結構</p>
        <p type="p">102:基材</p>
        <p type="p">103:閘極結構</p>
        <p type="p">104:閘極介電層</p>
        <p type="p">106:閘極金屬層</p>
        <p type="p">108:導電層</p>
        <p type="p">110:間隔物</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10005.JPG" file="ed10005.JPG" height="285px" img-content="tif" inline="yes" orientation="portrait" width="549px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622587</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105516</doc-number>
          <kind></kind>
          <date>113/11/07</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260224B">G02B13/02</main-classification>
        <further-classification edition="200601120260224B">G02B9/04</further-classification>
        <further-classification edition="200601120260224B">G02B17/08</further-classification>
        <further-classification edition="202101120260224B">G03B17/17</further-classification>
        <further-classification edition="202101120260224B">G03B5/00</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>以色列商核心光電有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>COREPHOTONICS LTD.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈德斯坦　科比</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDSTEIN, KOBI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>戈登堡　以法蓮</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GOLDENBERG, EPHRAIM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>魏茨　湯姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>WEITZ, TOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>IL</english-country>
              <english-address>IL</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>呂長霖</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>63/597,017</doc-number>
          <date>20231108</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>具有輕薄的高圖像品質光學影像穩定致動器的緊湊型折疊式望遠相機</chinese-title>
        <english-title>COMPACT FOLDED TELE CAMERAS WITH SLIM HIGH IMAGE QUALITY OPTICAL IMAGE STABILIZATION ACTUATOR</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">一種折疊式望遠相機，包括鏡頭，包括多個透鏡元件，分為第一透頭組（G1）和第二透鏡組（G2），並具有EFL在8毫米＜EFL＜40毫米的範圍內；影像感測器；光路折疊元件（OPFE）用於將第一光路（OP1）折疊到第二光路（OP2），其中第一透頭組位於光路折疊元件的物側，第二透鏡組位於光路折疊元件的像側，光路折疊元件具有沿第一光路量測的高度H&lt;sub&gt;O&lt;/sub&gt;；及光學影像穩定（OIS）致動器，可操作的以執行光學影像穩定，並包括單個馬達用於通過將第一透鏡組圍繞第一透鏡組旋轉軸共同地旋轉第一透鏡組旋轉行程（Rot&lt;sub&gt;G1&lt;/sub&gt;）並將光路折疊元件圍繞光路折疊元件旋轉軸旋轉光路折疊元件旋轉行程（Rot&lt;sub&gt;OPFE&lt;/sub&gt;）來沿著第一光學影像穩定方向執行光學影像穩定，其中Rot&lt;sub&gt;OPFE&lt;/sub&gt;＜Rot&lt;sub&gt;G1&lt;/sub&gt;，第一透鏡組旋轉軸和光路折疊元件旋轉軸彼此相平行，並垂直於第一光路和第二光路，以及第一透鏡組旋轉軸和光路折疊元件旋轉軸之間的距離d&lt;sub&gt;ROT&lt;/sub&gt;滿足d&lt;sub&gt;ROT&lt;/sub&gt; ＜ H&lt;sub&gt;O&lt;/sub&gt;/2。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">Folded Tele cameras comprising a lens including a plurality of lens elements divided into a first lens group (G1) and a second lens group (G2) and having an EFL in the range of 8mm＜EFL＜40mm, an image sensor, an optical path folding element (OPFE) for folding a first optical path (OP1) to a second optical path (OP2), wherein G1 is located at an object side of the OPFE, and wherein G2 is located at an image side of the OPFE, the OPFE having a height H&lt;sub&gt;O&lt;/sub&gt; measured along OP1, and an optical image stabilization (OIS) actuator operational to perform OIS and including a single motor for performing OIS along a first OIS direction by jointly rotating G1 around a G1 rotation axis by a G1 rotational stroke (Rot&lt;sub&gt;G1&lt;/sub&gt;) and by rotating the OPFE around an OPFE rotation axis by an OPFE rotational stroke (Rot&lt;sub&gt;OPFE&lt;/sub&gt;) ＜ Rot&lt;sub&gt;G1&lt;/sub&gt;, wherein the G1 rotation axis and the OPFE rotation axis are parallel to each other and perpendicular to both OP1 and OP2, and wherein a distance d&lt;sub&gt;ROT&lt;/sub&gt; between the G1 rotation axis and the OPFE rotation axis fulfills d&lt;sub&gt;ROT&lt;/sub&gt; ＜ H&lt;sub&gt;O&lt;/sub&gt;/2.</p>
      </isu-abst>
      <representative-img>
        <p type="p">200:相機</p>
        <p type="p">202:鏡頭</p>
        <p type="p">204:棱鏡</p>
        <p type="p">205:反射表面</p>
        <p type="p">206:影像感測器</p>
        <p type="p">209:G1軸</p>
        <p type="p">G1:第一透鏡組</p>
        <p type="p">G2:第二透鏡組</p>
        <p type="p">OP1:第一光路</p>
        <p type="p">OP2:第二光路</p>
        <p type="p">H&lt;sub&gt;P&lt;/sub&gt;:高度</p>
        <p type="p">d&lt;sub&gt;ROT&lt;/sub&gt;:距離</p>
        <p type="p">208:棱鏡軸</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10027.JPG" file="ed10027.JPG" height="401px" img-content="tif" inline="yes" orientation="portrait" width="647px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
  <tw-patent-application dtd-version="A103.1.0">
    <tw-bibliographic-data-application>
      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
      <publication-reference>
        <document-id>
          <doc-number>202622779</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
      </publication-reference>
      <application-reference appl-type="invention-public">
        <document-id>
          <doc-number>115105770</doc-number>
          <kind></kind>
          <date>108/11/19</date>
        </document-id>
      </application-reference>
      <classification-ipc>
        <main-classification edition="200601120260226B">G06F17/16</main-classification>
        <further-classification edition="200601120260226B">G06N3/06</further-classification>
      </classification-ipc>
      <parties>
        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商葛如克公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GROQ, INC.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
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          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>羅斯　強納森　亞歷山德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ROSS, JONATHAN ALEXANDER</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>霍金斯　湯姆</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>HAWKINS, TOM</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>索爾森　葛瑞格　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>THORSON, GREGORY MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>波伊德　麥特</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>BOYD, MATT</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>林嘉興</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>羅文妙</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/769,444</doc-number>
          <date>20181119</date>
        </priority-claim>
        <priority-claim sequence="2">
          <country>美國</country>
          <doc-number>16/686,866</doc-number>
          <date>20191118</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>用於矩陣的空間地域轉換之方法及系統</chinese-title>
        <english-title>METHOD AND SYSTEM FOR SPATIAL LOCALITY TRANSFORM OF MATRICES</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
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      <isu-abst lang="tw">
        <p type="p">本發明揭示一種方法，其包括：接收與一輸入張量廻旋以產生一輸出激勵的一核心之維之各者之一或多個大小；產生用於運算輸出值之一控制型樣用於廻旋該輸入張量，其中該控制型樣係一方形矩陣，其中各維係等於該核心之寬度與高度之乘積的一大小。藉由產生該控制型樣之各位置之一值來產生該控制型樣，該值係基於該控制型樣中之該位置之一定位及該核心之該等維之各者之該一或多個大小，該值指示自其存取來自用於與該核心廻旋之一展平輸入張量之值的一位置。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">A method comprises receiving one or more sizes for each of the dimensions of a kernel that is convolved with an input tensor to generate an output activation, generating a control pattern used to compute output values for the convolution of the input tensor, with the control pattern being a square matrix with each dimension being a size equal to the product of the width and the height of the kernel. The control pattern is generated by generating a value for each position of the control pattern that is based on a location of the position in the control pattern and the one or more sizes of each of the dimensions of the kernel, the value indicating a location from which to access values from a flattened input tensor for the convolution with the kernel.</p>
      </isu-abst>
      <representative-img>
        <p type="p">1100至1140:步驟</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10060.JPG" file="ed10060.JPG" height="850px" img-content="tif" inline="yes" orientation="portrait" width="789px">
          </img>
        </representative>
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      <volno>24</volno>
      <isuno>11</isuno>
      <kindcode>A</kindcode>
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        <document-id>
          <doc-number>202622784</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>115105896</doc-number>
          <kind></kind>
          <date>113/10/21</date>
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        <main-classification edition="201301120260228B">G06F21/71</main-classification>
        <further-classification edition="200601120260228B">G06F9/48</further-classification>
        <further-classification edition="200601120260228B">G06F9/52</further-classification>
        <further-classification edition="200601120260228B">G06F9/54</further-classification>
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        <applicants>
          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商鎧俠股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KIOXIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>宮本久也</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MIYAMOTO, HISAYA</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>卓俊傑</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鮑亞嵐</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉亞君</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>日本</country>
          <doc-number>2024-117943</doc-number>
          <date>20240723</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>記憶體系統及控制器</chinese-title>
        <english-title></english-title>
      </invention-title>
      <physical-examination>無</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本發明提供一種兼顧中斷潛伏時間的減低以及安全處理的非中止的記憶體系統及控制器。根據實施形態，記憶體系統包括記憶體以及控制器。記憶體儲存資料。控制器具有提供與記憶體相關的安全功能的安全區塊。安全區塊包括第一CPU以及第二CPU。第一CPU執行與請求安全功能的第一模組的通訊，受理安全區塊內發生的中斷，將與請求對應的安全處理作為一個任務，以不中止地執行安全處理的方式執行安全區塊內的任務管理。第二CPU在第一CPU的控制下執行安全處理。在第一模組與第一CPU之間設置用於通訊的信箱機構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">
        </p>
      </isu-abst>
      <representative-img>
        <p type="p">21:內核CPU</p>
        <p type="p">22:任務CPU</p>
        <p type="p">23:共享記憶體</p>
        <p type="p">24:智慧財產權核(intellectual property，IP)</p>
        <p type="p">31:信箱</p>
        <p type="p">101:應用程式[A]、應用程式[B]、應用程式[C]</p>
        <p type="p">111:處理器</p>
        <p type="p">117:安全功能區塊(security block，SECB)</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.png" file="d10002.TIF" giffile="ed10002.png" height="637px" img-content="tif" inline="yes" orientation="portrait" width="988px">
          </img>
        </representative>
      </representative-img>
    </description>
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      <volno>24</volno>
      <isuno>11</isuno>
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        <document-id>
          <doc-number>202623615</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>115106036</doc-number>
          <kind></kind>
          <date>110/03/02</date>
        </document-id>
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        <main-classification edition="202601120260302B">H10P76/00</main-classification>
        <further-classification edition="200601120260302B">G03F7/20</further-classification>
        <further-classification edition="200601120260302B">G03F7/40</further-classification>
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          <applicant app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>美商英培雅股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>INPRIA CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </applicant>
          <applicant app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>日商東京威力科創股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TOKYO ELECTRON LIMITED</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>JP</english-country>
              <english-address>JP</english-address>
            </addressbook>
          </applicant>
        </applicants>
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              <chinese-name name-type="organization">
                <last-name>泰勒基　亞倫Ｊ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>TELECKY, ALAN J.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蕭普　彼特　德</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>SHEPPER, PETER DE</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>BE</english-country>
              <english-address>BE</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>邁爾　史蒂芬Ｔ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>MEYERS, STEPHEN T.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>史托爾斯　傑森Ｋ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>STOWERS, JASON K.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
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            <addressbook>
              <chinese-name name-type="organization">
                <last-name>凱斯勒　道格拉斯Ａ</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>KESZLER, DOUGLAS A.</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="6">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>歐泰卡　頌尼亞　卡司特蘭諾斯</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>ORTEGA, SONIA CASTELLANOS</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>ES</english-country>
              <english-address>ES</english-address>
            </addressbook>
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                <last-name>格里爾　麥可</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>GREER, MICHAEL</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="8">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>盧森　克莉絲汀</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LOUTHAN, KIRSTEN</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
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          <agent rep-type="agent" sequence="1">
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              <chinese-name name-type="organization">
                <last-name>陳翠華</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
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        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>62/984,023</doc-number>
          <date>20200302</date>
        </priority-claim>
      </priority-claims>
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        <chinese-title>用於改善輻射可圖案化之有機錫基塗層之處理的方法</chinese-title>
        <english-title>METHOD FOR IMPROVING THE PROCESSING OF RADIATION PATTERNABLE ORGANO TIN-BASED COATING</english-title>
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        <p type="p">輻射可圖案化之有機金屬塗層之處理係顯示出可藉由在圖案之塗覆與顯影之間適當選擇後處理條件而加以改善。特別地，塗覆晶圓可經受製程延遲，以使得塗層能夠在不同的製程點老化，特別是在輻照之後。製程延遲可與加熱步驟組合並穿插進行。在各個製程步驟中，可調節塗覆晶圓上方之氣氛，以在圖案之顯影中獲得期望之改善。反應氣體對於改善塗層性能是有益的。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The processing of radiation patternable organometallic coatings is shown to be improved through the appropriate selection of post processing conditions between coating and development of the pattern. In particular, a coated wafer can be subjected to process delays to allow aging of the coating at various process points, in particular following irradiation. Process delays can be combined and interspersed with heating steps. The atmosphere above the coated wafer at various process steps can be adjusted to obtain desired improvements in the development of the pattern. Reactive gases can be beneficial with respect to improvement of coating properties.</p>
      </isu-abst>
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        <representative>
          <img align="absmiddle" alt="代表圖式ed10009.JPG" file="ed10009.JPG" height="474px" img-content="tif" inline="yes" orientation="portrait" width="735px">
          </img>
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      <volno>24</volno>
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        <document-id>
          <doc-number>202623678</doc-number>
          <kind></kind>
          <date>115/06/01</date>
        </document-id>
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        <document-id>
          <doc-number>115106307</doc-number>
          <kind></kind>
          <date>113/10/22</date>
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        <main-classification edition="202601120260302B">H10W72/20</main-classification>
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        <further-classification edition="202601120260302B">H10W72/50</further-classification>
        <further-classification edition="202601120260302B">H10W20/00</further-classification>
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              <chinese-name name-type="organization">
                <last-name>愛普科技股份有限公司</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>AP MEMORY TECHNOLOGY CORPORATION</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address>新竹縣</address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
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        </applicants>
        <inventors>
          <inventor app-type="applicant" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>鍾基偉</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHUNG, KEE-WEI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>蔡茹宜</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CAI, RU-YI</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳　文良</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>CHEN, WENLIANG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>US</english-country>
              <english-address>US</english-address>
            </addressbook>
          </inventor>
          <inventor app-type="applicant" sequence="4">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>劉景宏</last-name>
                <first-name></first-name>
              </chinese-name>
              <english-name name-type="organization">
                <last-name>LIU, CHIN-HUNG</last-name>
                <middle-name></middle-name>
                <first-name></first-name>
              </english-name>
              <address></address>
              <english-country>TW</english-country>
              <english-address>TW</english-address>
            </addressbook>
          </inventor>
        </inventors>
        <agents>
          <agent rep-type="agent" sequence="1">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>陳長文</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="2">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>馮博生</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
          <agent rep-type="agent" sequence="3">
            <addressbook>
              <chinese-name name-type="organization">
                <last-name>黃愷</last-name>
                <first-name></first-name>
              </chinese-name>
              <address>臺北市</address>
            </addressbook>
          </agent>
        </agents>
      </parties>
      <priority-claims>
        <priority-claim sequence="1">
          <country>美國</country>
          <doc-number>18/594,934</doc-number>
          <date>20240304</date>
        </priority-claim>
      </priority-claims>
      <invention-title>
        <chinese-title>半導體結構及半導體結構的製備方法</chinese-title>
        <english-title>SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE</english-title>
      </invention-title>
      <physical-examination>有</physical-examination>
    </tw-bibliographic-data-application>
    <description>
      <isu-abst lang="tw">
        <p type="p">本揭示內容揭露一種半導體結構與一種製造半導體結構的方法。半導體結構包含第一晶圓、第二晶圓、第一接合層及電源管理晶圓。第一晶圓包含第一晶片，且第一晶片具有第一3D電容器結構。第二晶圓包含第二晶片，且第二晶片具有第二3D電容器結構。第一接合層將第一晶圓與第二晶圓接合。電源管理晶圓包含電源管理晶粒，且電源管理晶圓與第二晶圓接合。電源管理晶粒透過沿著半導體結構的厚度延伸並跨過第一接合層的互連件而電性連接至第一3D電容器結構與第二3D電容器結構。</p>
      </isu-abst>
      <isu-abst lang="en">
        <p type="p">The present application discloses a semiconductor structure and a method for manufacturing the semiconductor structure. The semiconductor structure includes a first wafer, a second wafer, a first bonding layer, and a power management wafer. The first wafer includes a first chip, and the first chip has a first 3-dimensional (3D) capacitor structure therein. The second wafer includes a second chip, and the second chip has a second 3D capacitor structure therein. The first bonding layer bonds the first wafer with the second wafer. The power management wafer includes a power management die, and the power management die is bonded with the second wafer. The power management die is electrically connected to the first 3D capacitor structure and the second 3D capacitor structure through interconnects extending along a thickness of the semiconductor structure and across the first bonding layer.</p>
      </isu-abst>
      <representative-img>
        <p type="p">100:半導體結構</p>
        <p type="p">110,120:晶片</p>
        <p type="p">110a,120a:晶片的第一表面</p>
        <p type="p">110b,120b:晶片的第二表面</p>
        <p type="p">112,122:半導體層</p>
        <p type="p">112a:半導體層的第一表面</p>
        <p type="p">112b:半導體層的第二表面</p>
        <p type="p">114,124:介電層</p>
        <p type="p">114a,124a:互連結構</p>
        <p type="p">116,126:通孔</p>
        <p type="p">119:導電凸塊</p>
        <p type="p">130:電源管理晶粒</p>
        <p type="p">132:半導體層</p>
        <p type="p">134:介電層</p>
        <p type="p">141a,141b,151a,151b:接合介電層</p>
        <p type="p">142a,142b,152a,152b:接合墊</p>
        <p type="p">140a,140b,150a,150b:子接合層</p>
        <p type="p">140,150:接合層</p>
        <p type="p">C1,C2:3D電容器結構</p>
        <representative>
          <img align="absmiddle" alt="代表圖式ed10002.JPG" file="ed10002.JPG" height="729px" img-content="tif" inline="yes" orientation="portrait" width="897px">
          </img>
        </representative>
      </representative-img>
    </description>
  </tw-patent-application>
</tw-patent-applications>